PROTECTION PRODUCTS TM

Description

The EClamp TM 2454P is a (L-C) low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics.

They have been optimized for protection of color

LCD and camera lines portable electronics.

The device consists of four identical circuits comprised of TVS diodes for ESD protection, and a 5-pole inductor - capacitor network for EMI/RFI filtering. A typical inductor value of 28nH and a capacitor value of 12pF are used to achieve 40dB minimum attenuation at

800MHz. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and

±8kV (contact discharge) per IEC 61000-4-2, level 4.

The EClamp2454P is in a 8-pin, RoHS/WEEE compliant,

SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm.

The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs.

EClamp2454P

ESD/EMI Protection

for Color LCD Interfaces

PRELIMINARY

Features

‹ Bidirectional EMI/RFI filter with integrated TVS for ESD protection

‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,

±15kV (air), ±8kV (contact)

‹ Filter performance: 40dB minimum attenuation at

800MHz to 2.7GHz

‹ TVS working voltage: 5V

‹ Inductor: 28nH (Typical)

‹ Capacitors: 12pF (Typical at VR = 2.5V)

‹ Protection and filtering for four lines

‹ Solid-state technology

Mechanical Characteristics

‹ SLP2116P8 8-pin package

‹ RoHS/WEEE Compliant

‹ Nominal Dimensions: 2.1 x 1.6 x 0.58 mm

‹ Lead Pitch: 0.5mm

‹ Lead finish: NiPd

‹ Marking: Marking Code

‹ Packaging: Tape and Reel per EIA 481

Applications

‹ Color LCD Protection

‹ Cell Phone CCD Camera Lines

‹ Clamshell Cell Phones

Circuit Diagram (Each Line) Package Configuration

IN

L1

C1 C2

L2

C3

GND

OUT

2.10

1 2

1.60

0.50 BSC

0.58

Device Schematic (4X)

Revision 03/29/2006

1

8 Pin SLP package (Bottom Side View)

Nominal Dimensions in mm www.semtech.com

PROTECTION PRODUCTS

Maximum Ratings

R a t i n g

E S D

E S D p p e r e r

I E

I E

C

C

6 1 0 0 0 4 2

6 1 0 0 0 4 2 (

( A i r )

C o n t a c t )

J u n c it o n T e m p e r a t u r e

O p e r a it n g T e m p e r a t u r e

S t o r a g e T e m p e r a t u r e

Electrical Characteristics (T=25 o C)

S y m b o l

V

E S D

T

J

T o p

T

S T G

V a l u e

+ / -

+ / -

2 0

1 5

1 2 5

4 0 t o + 8 5

5 5 t o + 1 5 0

EClamp2454P

PRELIMINARY

U n i t s k V o C o C o C

I

P a r r r r r a m e t t t t t e r r r r r

T V S R e v e r s e S t a n d O f f V o tl a g e

T V S R e v e r s e B r e a k d o w n V o tl a g e

T V S R e v e r s e L e a k a g e C u r r e n t

D

F

T

T n i

C o d o t t tl

C a p e r u a

R e a l l c t a c s i

C u a n

S e ti s t a n

-t O f c e ir e s a n c e

C a p a c f c e

F r e

I n d u q u ti a n c e e n c y c t a n c e

S y m b o l l

V

R W M

V

B R

I

R

R

D C f c

L

L

1

+ L

2

C

1

, C

2

, C

3

C

1

+

C

3

C

2

+

Z

S o u r c e

= Z

L o a d

= 5 0 O h m s

V

V

R

R

=

C

V o

R W M

E

I t n a

= c d i i i i i h

2 .

5 V ,

1

= t t t t t i i i i i f

L m

3 .

3 V i o

A n

= n e s

1 M H z

I

= n p u t

E a c h

2 .

5 V , t o G n d , f

L i n e

= 1 M H z

M i i i i i n i i i i i m u m

6

1

3

0

0

T y y p i i i i i c a l l l

8

5 6

1 2

3 6

3 3

1 5 5

2 8

M a x i i i i i m u m

5

1 0

0 .

1

1

4

5

5

U n i i t t t t s

V

V

µ A

O h m s

M H z n H n H p F p F

 2006 Semtech Corp.

2 www.semtech.com

EClamp2454P

PRELIMINARY PROTECTION PRODUCTS

Typical Characteristics

Typical Insertion Loss S21 (Each Line)

CH1 S21 LOG 6 dB / REF 0 dB

0 dB

-6 dB

-12 dB

-18 dB

-24 dB

1

1: -5.3134 dB

156 MHz

2: -41.559 dB

800 MHz

3: -41.327 dB

1.8 GHz

4: -40.105 dB

2.7 GHz

-30 dB

-36 dB

4

-42 dB

-48 dB

2

3

-54 dB

1

MHz

10

MHz

100

MHz

1

GHz

3

GHz

START . 030 MHz

ESD Clamping (+8kV Contact)

Analog Crosstalk (Each Line)

CH1 S21 LOG 20 dB / REF 0 dB

START . 030 MHz

ESD Clamping (-8kV Contact)

Note: Data is taken with a 10x attenuator

Capacitance vs. Reverse Voltage

(Normalized to 2.5 volts)

2

1.5

1

0.5

0

0 0.5

1

 2006 Semtech Corp.

1.5

2 2.5

3 3.5

Reverse Voltage - V

R

(V)

4 f = 1 MHz

4.5

5

3

Note: Data is taken with a 10x attenuator www.semtech.com

EClamp2454P

PROTECTION PRODUCTS

Device Connection

The EClamp2454P is comprised of four identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 8-pin SLP package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below.

PRELIMINARY

Figure 1 - Pin Identification and Configuration

(Top Side View)

In 1

In 2

In 3

In 4

1

4

Gnd

8

5

Out 1

Out 2

Out 3

Out 4

Ground Connection Recommendation

Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect is given by

Equation 1.

Equation 1: The Impedance of an Inductor at

Frequency XLF

P i n

1 4

5 8

C e n t e r T a b

I d e n t i f i c a t i o n

I n p u t L i n e s

O u t p u t L i n e s

G r o u n d

XLF ( L , f ) = 2 * π * f * L

Figure 2 - Inductance of Rectangular Wire Loops

Where:

L= Inductance (H) f = Frequency (Hz)

Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in

Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics.

Equation 2: Inductance of Rectangular Wire Loop

LRECT ( d , x , y ) = 10 .

16 * 10 − 9

Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in)

*

[ x * ln 2

[ ] d

+ y * ln

[ ] ] www.semtech.com

 2006 Semtech Corp.

4

EClamp2454P

PROTECTION PRODUCTS

Applications Information

Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20

mm) while the two external vias have a diameter of

0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 in highly insensitive to parameter d) . Figure 4 shows a typical insertion loss (S21) plot for the device using

Semtech’s filter evaluation board with 50 Ohm traces and the recommended via configuration.

Figure 3 - Recommended Layout Using Ground Vias

PRELIMINARY

Figure 4 - Filter Characteristics Using Recommended

Layout with Internal Vias

CH1 S21 LOG 6 dB / REF 0 dB

0 dB

-6 dB

-12 dB

-18 dB

-24 dB

1

1: -5.3134 dB

156 MHz

2: -41.559 dB

800 MHz

3: -41.327 dB

1.8 GHz

4: -40.105 dB

2.7 GHz

-30 dB

-36 dB

-42 dB

-48 dB

-54 dB

1

MHz

START . 030 MHz

10

MHz

100

MHz

2

3

4

1

GHz

3

GHz

 2006 Semtech Corp.

5 www.semtech.com

PROTECTION PRODUCTS

Applications Information - Spice Model

EClamp2454P Spice Model & Parameters

Line In 0.5nH

L

56nH

0.5nH

Line Out

EClamp2454P

PRELIMINARY

EClamp2454P Spice Model

 2006 Semtech Corp.

R S

I B V

C J O

T T

M

N

E G

T a b l e 1 E C l a m p 2 4 5 4 P S p i c e P a r a m e t e r s

P a r a m e t e r U n i t D 1 ( T V S ) D 2 ( T V S )

I S

B V

V J

A m

V o

V o tl tl p 4 .

0

0

7

.

9

.

4

7

E

4

-

4

1

4

5 4 .

0

0

7

.

9

.

7

E

4

4

-

4

1

4

5

F

O

A a s m e h r e

--

--

V m a c p d 3

2 .

0

1

1

5 4

0

.

1

.

E -

1

.

5

E

.

1 E

2

1

-

8

1

3

1 2

3

1

4

9

0 .

5 8 4

1 E 3

3 1 E 1 2

2 .

5 4 1 E 9

0 .

2 3

1 .

1

1 .

1 1

6 www.semtech.com

EClamp2454P

PRELIMINARY PROTECTION PRODUCTS

Outline Drawing - SLP2116P8

PIN 1

INDICATOR

(LASER MARK) aaa C

A2

A D B

E

A1

A

C

SEATING

PLANE

DIM

A

A1

A2

MIN b .007

D .079

D1

E

E1 e

L

N aaa bbb

.061

.059

.011

DIMENSIONS

INCHES

NOM

.023

.001

(.006)

.010

.083

.067

.063

MAX

.026

.002

.012

.087

.071

.067

.020 BSC

.013

6

.003

.004

.015

MILLIMETERS

MIN

0.50

0.00

0.20

2.00

1.55

1.50

NOM

0.58

.003

(0.15)

0.25

2.10

1.70

1.60

MAX

0.65

0.05

0.30

2.20

1.80

1.70

.010 .016 .020 0.25 0.40 0.50

0.50 BSC

0.28

0.33

6

0.08

0.10

0.38

1 2

D1

LxN

E/2

E1 e

N bxN bbb C A B

D/2

NOTES:

1.

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

2.

COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.

Land Pattern - SLP2116P8

P

X

Z G

Y

F

(C)

DIM

Y

Z

P

X

B

C

F

G

DIMENSIONS

INCHES

.071

.060

.018

.035

.020

.012

.025

.085

MILLIMETERS

1.80

1.52

0.45

0.89

0.50

0.30

0.63

2.15

B

NOTES:

1.

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

 2006 Semtech Corp.

7 www.semtech.com

PROTECTION PRODUCTS

Marking

PIN 1

INDICATOR

2454P

YW = Date Code (Y=Year, W=Week)

Tape and Reel Specification

YW

EClamp2454P

PRELIMINARY

Ordering Information

P a r t N u m b e r

Q t y p

R e e l e r

3 0 0 0

R e e l S i z e

E C l a m p 2 4 5 4 P .

T C T 7 I n c h

This is a lead-free RoHS/WEEE Compliant Device

EMIClamp and EClamp are marks of Semtech Corporation

Pin 1 Location

User Direction of feed

Device Orientation in Tape

A 0 B 0 K 0

1 .

9 6 + / 0 .

0 5 m m 2 .

3 1 + / 0 .

0 5 m m 0 .

7 4 + / 0 .

0 5 m m

T a

W i p e d t h

B , ( M a x )

8 m m

D D 1

4 .

2 m m

.( 1 6 5 )

1 .

5

-

-

+

0 .

( 0 .

5 9

.

0

0

+

.

1 m m m m

0 0

.

0

0 )

0 5

0 .

8 m m

±

.(

0 .

0 5

0 3 1 )

E

1 .

7 5 0 ± .

1 0 m m

.( 0 6 9 ± .

0 0 4 )

F

3 .

5 ± 0 .

0 5

.( 1 m m

3 8 ± .

0 0 2 )

( M

K

A X )

P

2 .

4 m m

.( 0 9 4 )

4 .

0 ± 0 .

1 m m

.( 1 5 7 ± .

0 0 -

4 )

P 0 P 2 T ( M A X ) W

4 .

0 ± 0 .

1 m m

.( 1 5 7 ± .

0 0 -

4 )

2 .

0 ± 0 .

0 5 m -

.( 0 m

7 9 ± .

0 0 2 )

0 .

4 m m

.( 0 1 6 )

+

8

0

.

0

.

3 m m m m

0 .

1 m m

.( 3 1 2 ± .

0 1 2 )

Contact Information

 2006 Semtech Corp.

Semtech Corporation

Protection Products Division

200 Flynn Rd., Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804

8 www.semtech.com