ROC364 - Welcome to Emerson Process Management Documentation

2:ROC364
Specification Sheet
December 2004
ROC364 Remote Operations Controller
The ROC364 Remote Operations Controller (ROC) is
a microprocessor-based controller that provides the
functions required for a variety of field automation
applications. The unit is used primarily where there is
a need to monitor, measure, and control equipment
remotely. The unit is ideal for applications requiring
flow computation, PID control, and logic/sequencing
control. It is available with a FlashPAC memory
module.
The ROC364 features modular, single-point I/O. The
modular I/O allows a high degree of application
flexibility: any combination of discrete inputs, discrete
outputs, analog inputs, analog outputs, and pulse
inputs can be accommodated, up to a maximum of 64
channels. This makes it possible to buy only the I/O
needed for the immediate requirements of the
application, while allowing field expansion or changes
in the I/O later on.
FLASHPAC
®
POWER
2A S.B., 32 VDC
F2
AUX OUT 1
5A, 32 VDC
F3
AUX OUT 2
5A, 32 VDC
SYSTEM
STATUS
DC PWR
IN
2
ROM
3
COM2
POWER
AUX OUT 1
AUX OUT 2
+
+
AUX PWR
OUT 1
1
REMOTE OPERATIONS
CONTROLLER
RAM
MEMORY EXPANSION
F1
ROC
+
+
-
GND
COM1
DISPLAY
OPERATOR
INTERFACE
AUX PWR
OUT 2
DOC0119A
®
MODULE RACK
A
B
2
C
A
B
3
C
A
B
5
4
C
A
B
C
A
B
7
6
C
A
B
C
A
B
8
C
A
B
C
A
B
11
10
9
C
A
B
C
A
B
C
12
A
B
14
13
C
A
B
C
A
GND
B
15
C
A
B
16
C
A
B
C
GND
DOC0030C
ROC364 Master Controller Unit and I/O Module Rack
Remote Automation Solutions
Website: www.EmersonProcess.com/Remote
D301030X012
1
2:ROC364
Specification Sheet
Master Controller Unit
The Master Controller Unit (MCU) is the key component of the ROC364 and consists of:
♦
♦
♦
♦
♦
♦
NEC V25+ microprocessor with on-board memory.
On-board memory.
FlashPAC module.
Connections for operator interface.
Sockets for two optional communications cards.
Status indicators and diagnostic inputs.
The NEC V25+ is a 16-bit CMOS microprocessor that
can address up to one MB of memory space. The
MCU comes standard with 128 KB of on-board,
battery-backed, static random access memory (SRAM)
for storing data and 32 KB of electrically-erasable
read-only memory (EEPROM) for storing configuration
parameters.
The FlashPAC module contains the operating system,
ROC communications protocol, and applications
firmware (see other specification sheets). The module
provides additional RAM for user programs and history
logs. The firmware in the module also provides 1992
AGA flow calculations. See the FlashPAC
specifications sheet (2:MFP) for more information.
Page 2
auxiliary devices, such as a radio. The source of
auxiliary power is the input power.
LED indicators display ROC status, input power, and
auxiliary power. The ROC status indicator shows
whether operation is normal. The power and auxiliary
output indicators light to show that power is applied.
Diagnostic inputs are provided for monitoring
conditions, such as board temperature, input power
voltage, and transmitter supply voltage.
The MCU has a metal case that helps protect the
electronics from physical damage. For protection from
outdoor environments, the unit must be housed in a
ROC enclosure (see respective specification sheets).
Options
A complete ROC364 consists of a Master Controller
Unit and a variety of options. The name and the
quantity of each option that can be accommodated is
shown in Table 1.
Table 1. ROC364 Options
Option
Quantity
The ROC364 maintains an Audit trail per API Chapter
21.1.
Module Rack, 16 socket
1, 2, 3, or 4
Backplate
0 or 1
The Local Operator Interface (LOI) port provides a
means for a direct link between the ROC364 and a
personal computer. With a personal computer running
ROCLINK™ Software (see Specification Sheet
4:RLFW), the user can configure the ROC364 and
monitor its operation.
I/O Power Converter Card
0 or 1
I/O Modules
0 to 64
Communication Cards
0, 1, or 2
The display port is dedicated to communications
between the MCU and the Local Display Panel
accessory (see Specification Sheet 2.2:LDP).
Through this panel, the user can access information
stored in the ROC364.
The Module Rack provides sockets for up to 16 I/O
modules. A minimum of one Module Rack is required
for any ROC364 connected to field I/O. Up to four
Module Racks can be used with one MCU. The first
Module Rack plugs directly into the MCU. Additional
racks plug into the previous rack.
The communications card expansion sockets allow
one or two communications cards to be added to the
ROC364. The cards make use of the COM1 and
COM2 ports and can be any of the ROC300-series
communications cards (described under “Options”).
The Backplate provides a mounting panel for a MCU
and Module Racks. Various backplates are available
for accommodating one, two, or four Module Racks.
The four-rack backplate is used for either three or four
racks.
Fuses for input and auxiliary power are readily
accessible from the front of the MCU. Screw
terminals, also located on the front, provide
connections for input power and auxiliary output
power. Auxiliary power outputs are switched by the
MCU under software control and can be used for
The I/O Power Converter Card converts the MCU
input power from 12 volts to 24 volts (nominal) for field
transmitters. The converter, which is required only for
12-volt input voltage, can accommodate up to 25
transmitter loops at 20 milliAmps each.
(Continued on Page 4)
2:ROC364
Specification Sheet
Page 3
Specifications
PROCESSOR MEMORY
NEC V25+ running at 8 MHz.
On-Board: 128 KB battery-backed SRAM for data.
32 KB EEPROM for configuration.
FlashPAC: Plug-in module with 512 KB Flash readonly memory (ROM) and 512 KB of battery-backed
static RAM (SRAM).
Memory Reset: Optional LDP permits a cold start
initialization when used during power-up.
I/O CAPACITY
Up to 16 I/O channels per Module Rack. Up to 4
Module Racks (64 I/O channels) per MCU.
OPERATOR INTERFACE PORT
EIA-232D (RS-232D) serial format for use with
portable operator interface. Baud is selectable from
300 to 19,200 bps. Asynchronous format, 7 or 8-bit
(software selectable). Parity can be odd, even, or
none (software selectable). 9-pin, female D-shell
connector provided.
TIME FUNCTIONS
Clock Type: 32 kHz crystal oscillator with regulated
supply, battery-backed. Year/Month/Day and
Hour/Minute/Second.
Clock Accuracy: 0.01%.
Watchdog Timer: Hardware monitor expires after
1.2 seconds and resets the processor. Processor
restart is automatic.
DIAGNOSTICS
These values are monitored: real-time clock/system
clock compare, AI module mid-scale voltage, DI
module default status, AO module D/A voltage, DO
module latch value, I/O transmitter voltage, power
input voltage, MCU board temperature.
POWER REQUIREMENTS
11 to 16 V dc (12.5 V to start up) or 22 to 30 V dc
(25 V to start up), jumper selectable. 1 Watt typical,
excluding I/O power.
AUXILIARY OUTPUT POWER
Input power is software switched to two sets of
auxiliary output power terminals. Each output fused
for 5 A maximum. Output voltage is 0 to 2 V dc less
than input voltage, depending on load.
I/O POWER CONVERTER (OPTIONAL)
Input: 11 to 16 V dc, 15 mA with no load or shorted
output.
Output: 22 to 24 V dc, up to 0.6 A for transmitter
power.
ENVIRONMENTAL
Operating Temperature: -40° to 70°C (-40° to
158°F).
Storage Temperature: -50° to 85°C (-58° to
185°F).
Operating Humidity: To 95%, non-condensing.
Transient Protection: Meets IEEE C37.90.1-1989.
EMI Immunity: Meets EN61000-4-5 Performance
Criterion B for Industrial Locations.
EMI Emissions: Meets FCC 47 CFR, Part 15,
Subpart J, Class A verified.
DIMENSIONS
MCU: 51 mm D by 203 mm H by 305 mm W (2 in. D
by 8 in. H by 12 in. W). Add 38 mm (1.5 in.) to depth
dimension for memory modules.
Module Rack: 13 mm D by 127 mm H by 305 mm D
(0.5 in. D by 5 in. H by 12 in. W).
MCU w/one Module Rack: 311 mm W by 356 mm H
(12.25 in. W by 14 in. H).
MCU w/two Module Racks: 311 mm W by 565 mm
H (12.25 in. W by 22.25 in. H).
MCU w/three or four Module Racks: 311 mm W by
743 mm H (12.25 in. W by 29.25 in. H).
WEIGHT
MCU: 2.3 kg (5 lbs) nominal.
Module Rack: 0.5 kg (1 lb) nominal.
Backplate: 1.4 to 3 kg (3 to 6.5 lbs).
ENCLOSURE
MCU metal chassis with 2-piece cover and Module
Rack case meet NEMA 1 rating.
BACKPLATE
16 gauge steel.
APPROVALS
Approved by CSA for hazardous locations Class I,
Division 2, Groups A, B, C, and D.
2:ROC364
Specification Sheet
(Continued from Page 2)
I/O modules can be added as needed to satisfy a
wide variety of field I/O requirements. The types of
modules (see respective specification sheets) that
can be used are:
♦ Analog input (loop, differential, or source).
♦ Analog output.
♦ Discrete input (source or isolated).
♦ Discrete output (source or isolated).
♦ Pulse input (normal, slow, or low-level).
♦ Relay output.
♦ RTD input.
♦ HART® interface.
♦ Serial I/O module (RS-232 or RS-485).
Communication cards provide the means for communicating with a host computer or other device.
One or two cards of the following types in any
combination can be accommodated (see
Page 4
Specification Sheets 2:COM1, 2:COM2, and
2.5:RMI):
♦ EIA-232 (RS-232) for point-to-point
asynchronous serial communications.
♦ EIA-422/EIA-485 (RS-422/RS-485) for
multiple-point asynchronous serial
communications.
♦ Dual Communications (RMI) for sensor to
ROC communications.
♦ Radio modem for communications to a radio.
♦ Leased line modem for communications over
customer-owned or leased lines.
♦ Dial-up modem for communications over a
telephone network.
Accessories
A number of accessory items are available for the
ROC364 that provide environmental housing, power,
communications, local monitoring, and I/O lightning
protection. These items are described in other
specification sheets. See your local sales
representative for more information.
Bristol, Inc., Bristol Babcock Ltd, Bristol Canada, BBI SA de CV and the Flow Computer Division, are wholly owned subsidiaries of Emerson
Electric Co. doing business as Remote Automation Solutions (“RAS”), a division of Emerson Process Management. FloBoss, ROCLINK,
Bristol, Bristol Babcock, ControlWave, TeleFlow and Helicoid are trademarks of RAS. AMS, PlantWeb and the PlantWeb logo are marks of
Emerson Electric Co. The Emerson logo is a trademark and service mark of the Emerson Electric Co. All other marks are property of their
respective owners.
The contents of this publication are presented for informational purposes only. While every effort has been made to ensure informational
accuracy, they are not to be construed as warranties or guarantees, express or implied, regarding the products or services described herein or
their use or applicability. RAS reserves the right to modify or improve the designs or specifications of such products at any time without notice.
All sales are governed by RAS’ terms and conditions which are available upon request. RAS does not assume responsibility for the selection,
use or maintenance of any product. Responsibility for proper selection, use and maintenance of any RAS product remains solely with the
purchaser and end-user.
Emerson Process Management
Remote Automation Solutions
Marshalltown, IA 50158 U.S.A.
Houston, TX 77041 U.S.A
Pickering, North Yorkshire UK Y018 7JA
© 1991-2004 Remote Automation Solutions, division of Emerson Process Management. All rights reserved.