Dell POWEREDGE R515 Specifications

PowerEdge R515
Technical Guide
The PowerEdge
R515 offers
enterprise-class
features and
superior price for
performance.
Dell
This document is for informational purposes only. Dell reserves the right to make changes without
further notice to any products herein. The content provided is as is and without express or implied
warranties of any kind.
Dell, PowerEdge, OpenManage, and ReadyRails are trademarks of Dell, Inc. Citrix® and XenServer™
are trademarks of Citrix Systems, Inc. and/or one or more of its subsidiaries, and may be registered
in the United States Patent and Trademark Office and in other countries. Intel and Xeon are
registered trademarks of Intel Corporation in the U.S. and other countries. Broadcom is a registered
trademark and NetXtreme is a trademark of Broadcom Corporation and/or its affiliates in the United
States, certain other countries and/or the EU. Matrox is a registered trademark of Matrox Electronic
Systems Ltd. Microsoft, Windows, Windows Server, SQL Server, and BitLocker, and Hyper-V are either
registered trademarks or trademarks of Microsoft Corporation in the United States and/or other
countries. Mellanox is a registered trademark of Mellanox Technologies, Inc. Nuvoton is a registered
trademark of Nuvoton Technology Corporation. Red Hat is a registered trademark of Red Hat, Inc. in
the United States and other countries. Linux is a registered trademark of Linus Torvalds. VMware is a
registered trademark and vSphere is a trademark of VMware, Inc. in the United States and/or other
jurisdictions. AMD, AMD Opteron, AMD PowerNow!, AMD-V, CoolCore, and combinations thereof are
trademarks of Advanced Micro Devices, Inc. Other trademarks and trade names may be used in this
document to refer to either the entities claiming the marks and names or their products. Dell
disclaims proprietary interest in the marks and names of others.
©Copyright 2010 Dell Inc. All rights reserved. Reproduction or translation of any part of this work
beyond that permitted by U.S. copyright laws without the written permission of Dell Inc. is unlawful
and strictly forbidden.
November 2010
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Table of Contents
1
2
3
4
5
Product Comparison ........................................................................................... 7
1.1
Overview .................................................................................................. 7
1.1.1
Designed to Go the Distance...................................................................... 7
1.1.2
Efficient from the Inside Out ..................................................................... 7
1.1.3
Easy to Manage ..................................................................................... 7
1.2
Comparison ............................................................................................... 8
System Overview ............................................................................................. 11
Mechanical .................................................................................................... 14
3.1
Chassis Description..................................................................................... 14
3.2
Dimensions and Weight ................................................................................ 14
3.3
Front Panel View and Features ...................................................................... 15
3.4
Back Panel View and Features ....................................................................... 15
3.5
Power Supply Indicators ............................................................................... 16
3.6
NIC Indicators ........................................................................................... 16
3.7
Side Views ............................................................................................... 16
3.8
Rails and Cable Management ......................................................................... 17
3.8.1
ReadyRails Sliding Rails ......................................................................... 17
3.8.2
ReadyRails Static Rails .......................................................................... 17
3.9
Rack View ............................................................................................... 17
3.9.1
Sliding Rails ....................................................................................... 17
3.9.2
Static Rails ........................................................................................ 18
3.10 Fans ...................................................................................................... 18
3.11 Control Panel/LCD ..................................................................................... 19
3.11.1
LCD Panel Configuration ........................................................................ 19
3.11.2
LED Panel Configuration......................................................................... 20
3.12 Security .................................................................................................. 20
3.12.1
Cover Latch ....................................................................................... 20
3.12.2
Bezel ............................................................................................... 20
3.12.3
Hard Drive ......................................................................................... 20
3.12.4
TPM ................................................................................................. 21
3.12.5
Power Off Security ............................................................................... 21
3.12.6
Intrusion Alert .................................................................................... 21
3.12.7
Secure Mode ...................................................................................... 21
3.13 USB Key .................................................................................................. 21
3.14 Battery ................................................................................................... 21
3.15 Field Replaceable Units (FRU)........................................................................ 21
3.16 User Accessible Jumpers, Sockets, and Connectors ............................................... 22
Power, Thermal, Acoustic .................................................................................. 23
4.1
Power Supplies ......................................................................................... 23
4.2
Power Supply Specifications .......................................................................... 23
4.3
Heat Dissipation ........................................................................................ 24
4.4
Environmental Specifications......................................................................... 24
4.5
ENERGY STAR Compliance ............................................................................ 25
4.6
Thermal.................................................................................................. 25
4.7
Acoustics ................................................................................................ 25
Processors ..................................................................................................... 27
5.1
Overview ................................................................................................ 27
5.2
Features ................................................................................................. 27
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5.3
Supported Processors ..................................................................................
5.4
Processor Configurations ..............................................................................
5.5
Processor Installation ..................................................................................
6
Memory ........................................................................................................
6.1
Overview ................................................................................................
6.2
DIMMs Supported .......................................................................................
6.3
DIMM Slots ...............................................................................................
6.4
Speed ....................................................................................................
6.5
Sparing ...................................................................................................
6.6
Mirroring .................................................................................................
6.7
RAID ......................................................................................................
6.8
Supported Configurations .............................................................................
7
Chipset ........................................................................................................
7.1
Overview ................................................................................................
7.2
AMD I/O Bridges ........................................................................................
7.3
HyperTransport 3 (HT3) ...............................................................................
7.4
Southbridge Link Interface ...........................................................................
7.5
AMD SP5100 Southbridge (SP5100) ...................................................................
8
BIOS ............................................................................................................
8.1
Overview ................................................................................................
8.2
Supported ACPI States .................................................................................
8.3
Power Management Modes ............................................................................
8.3.1
Dell Active Power Controller ...................................................................
8.3.2
Power Saving BIOS Setting (OS Control).......................................................
8.3.3
Maximum Performance ..........................................................................
9
Embedded NICs/LAN on Motherboard (LOM) .............................................................
10 I/O Slots .......................................................................................................
10.1 Overview ................................................................................................
10.1.1
Riser 1 PCI Expansion Slots......................................................................
10.1.2
Riser 2 (Optional) PCI Expansion Slots ........................................................
10.2 Boot Order ..............................................................................................
10.3 NIC and LOM Enumeration ............................................................................
10.4 PCI Card Dimensions ...................................................................................
11 Storage ........................................................................................................
11.1 Overview ................................................................................................
11.2 RAID Configurations ....................................................................................
11.3 Persistent Storage......................................................................................
11.4 Internal SD Module (Unmanaged Internal Persistent Storage) ...................................
11.5 LED Indicators ..........................................................................................
11.6 Optical Drives ...........................................................................................
11.7 Tape Drives .............................................................................................
11.8 External Storage Support .............................................................................
12 Video ...........................................................................................................
13 Rack Information .............................................................................................
13.1 Overview ................................................................................................
13.2 Rails ......................................................................................................
13.2.1
Sliding Rails .......................................................................................
13.2.2
Static Rails ........................................................................................
13.3 Cable Management Arm (CMA) .......................................................................
14 Operating Systems and Virtualization .....................................................................
15 Systems Management ........................................................................................
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15.1 Overview/Description .................................................................................
15.2 Server Management ....................................................................................
15.3 Embedded Server Management ......................................................................
15.4 Lifecycle Controller and Unified Server Configurator ............................................
15.5 iDRAC Express...........................................................................................
15.6 iDRAC6 Enterprise ......................................................................................
16 USB Peripherals ..............................................................................................
Appendix A.
Statement of Volatility .......................................................................
Appendix B.
Certifications ..................................................................................
B.1
Regulatory Certifications .............................................................................
B.2
Product Safety Certifications .........................................................................
B.3
Electromagnetic Compatibility .......................................................................
B.4
Ergonomics, Acoustics and Hygienics ...............................................................
Appendix C.
Additional Information and Options ........................................................
50
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Tables
Table
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20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
Feature Comparison to R510 and R710............................................................. 8
Product Features Summary ........................................................................ 11
Power Supply Status ................................................................................ 16
750W Power Supply Specifications ............................................................... 24
Environmental Specifications ...................................................................... 24
Acoustical Performance (8 HDD Chassis)......................................................... 25
Acoustical Performance (12 HDD Chassis) ....................................................... 26
Supported Processor Description and Features ................................................. 27
DIMMS Supported .................................................................................... 29
Supported Configurations (1 Processor).......................................................... 30
Supported Configurations (2 Processors) ........................................................ 31
BIOS Power Management Features................................................................ 34
BIOS Power Management Profiles ................................................................. 35
Riser 1 PCI Expansion Slots ........................................................................ 38
Riser 2 (Optional) PCIe Expansion Slots .......................................................... 38
Supported Hard Drives.............................................................................. 40
Raid Configurations (8 HDD Chassis) .............................................................. 40
RAID Configurations (12 HDD Chassis) ............................................................ 41
RAID Configurations (12 HDD Chassis, 12 + 2 HDDs) ............................................ 42
Graphics Video Modes .............................................................................. 44
Supported Racks ..................................................................................... 47
Rail Adjustability Ranges and Depth ............................................................. 47
Unified Server Configurator Features and Description......................................... 51
Features List for BMC, iDRAC, and vFlash ....................................................... 52
R515 Volatility Table ............................................................................... 55
Product Safety Certifications ...................................................................... 59
Electromagnetic Compatibility Certifications ................................................... 60
Ergonomics, Acoustics and Hygienics............................................................. 61
Industry Standards .................................................................................. 62
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Figures
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Figure
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5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
R515 Chassis Dimensions ...........................................................................
Front View (8 Hard Drive Chassis) ................................................................
Front View (12 Hard Drive Chassis) ...............................................................
Front View (With Optional Bezel) .................................................................
Back View ............................................................................................
Left Side View .......................................................................................
Right Side View ......................................................................................
R515 Mounted in B3 Sliding Rails..................................................................
Back View of R515 Mounted in B3 Sliding Rails with CMA .....................................
R515 Mounted in the B4 Static Rails in 2-Post Center Mount Configuration .............
LCD Panel Configuration ........................................................................
LCD Panel (Detailed View) ......................................................................
LED Panel Configuration.........................................................................
LED Panel (Detailed View) ......................................................................
R515 Redundant Power Supplies ...............................................................
R515 Sliding Rails with Optional CMA .........................................................
2U Threaded Rack Adapter Brackets Kit ......................................................
R515 Static Rails..................................................................................
14
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15
15
16
16
17
18
18
18
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19
20
20
23
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PowerEdge R515 Technical Guide
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1 Product Comparison
1.1 Overview
The Dell™ PowerEdge™ R515 is a 2-socket 2U rack server well-suited for database, email, virtualization,
workload consolidation, and other applications requiring an immense amount of local storage.
The PowerEdge R515 offers outstanding price for performance with the latest AMD Opteron™ (4 or 6 core)
series processors and enterprise-class features, including advanced systems management capabilities, an
interactive LCD screen (8 hard drive model) as well as hot-swap hard drives and redundant power supplies
for additional business data protection.
The R515 also offers the choice of an 8 or 12 hard drive configuration, delivering up to 25 TB of internal
storage space, making it ideally suited to meet the demands of the small- to mid-sized business or data
center with superior stability, efficiency, and long-term business value.
1.1.1
Designed to Go the Distance
You’ve told us you need a server manufacturer that inspires confidence through its reliability, availability,
and quality of products. That is why we have designed the PowerEdge R515 for optimal reliability and ease
of use, incorporating customer-inspired features that range from robust metal hard-drive carriers and
industrial-quality materials to embedded diagnostics and an optional interactive LCD screen.
Our reliability goals are simple: Deliver quality products that stand the test of time.





1.1.2
A Unified Server Configurator (USC) helps minimize downtime by offering embedded and persistent
diagnostics with no media requirements.
A one-touch quality-control process enables single-person responsibility for an entire server build.
Every Dell server model is tested and re-tested before it leaves the factory.
Our operating system, application and software integration testing, and validation help ensure that
everything works together right out of the box.
A focus on product longevity provides longer, fully supported product lifecycles for better investment
protection.
Efficient from the Inside Out
The PowerEdge R515 was designed to provide you with a multitude of time- and energy-saving options, not
only inside the server, but outside as well.
Inside the server, we have Energy Smart technologies to help you better manage power. This includes lowwattage processors, support for low-voltage DIMMs, and efficient fans that spin in accordance with server
workload demands. Internal shrouding and logical component layouts aid with airflow direction, helping to
cool the server. Energy-efficient power supplies use power effectively without compromising business
productivity.
Outside the server, we have put the external ports, power supplies, and LED lights or LCD screens in the
same location as other 11th generation PowerEdge servers for a familiar server-to-server usability and
commonality, as well as for easy installation and deployment. The hard drives across the 11G servers are
also interchangeable since they share the same drive carriers.
1.1.3
Easy to Manage
As an IT professional, you do not have a lot of time to spend managing and maintaining your systems. That is
why the Dell systems-management portfolio focuses on two core principles to make your life easier:
simplicity and cost-effectiveness.
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PowerEdge R515 Technical Guide
Dell
The optional Lifecycle Controller helps you perform system diagnostics, hardware configuration, and system
deployment in a pre-operating-system environment from an easy-to-use interface called the Unified Server
Configurator (USC). This helps eliminate the need to use and maintain multiple pieces of CD/DVD media and
helps get your server up and running fast.
An interactive LCD screen (8 hard drive model) on the front of the server allows for easy setup, monitoring,
and maintenance. Plain-language diagnosis and a programmable messaging system can help you address
issues quickly to simplify day-to-day monitoring.
The Dell Management Console, which is included with every Dell server, provides you with a consolidated
console view of your IT infrastructure.
Automated update notification from Support.Dell.com provides you with the latest updates for firmware,
drivers and BIOS so your systems are always running at their best.
1.2 Comparison
Table 1.
Feature
R510
®
®
Feature Comparison to R510 and R710
R515 (8 HDD)
R515 (12 HDD)
R710
Processor
Intel Xeon
processor 5500 or
5600 series
AMD Opteron™ 4100
series
AMD Opteron™ 4100
series
Intel® Xeon® processor
5500 or 5600 series
Form Factor
2U rack
2U rack
2U rack
2U rack
# Sockets
1 or 2
1 or 2
1 or 2
1 or 2
# Cores
2 or 4
4 or 6
4 or 6
2 or 4
®
Front Side
Bus
Intel QuickPath
Interconnect (QPI)
6.4GT/s
HyperTransport-3
(HT-3)
5.2GT/s
HyperTransport-3 (HT3)
5.2GT/s
Intel® QuickPath
Interconnect (QPI)
6.4GT/s
L2/L3 Cache
4MB or 8MB
512KB per core/6MB
512KB per core/6MB
4MB or 8MB
Chipset
Intel® 5500
AMD SR 5670
AMD SR 5670
Intel® 5520
DIMMs
4+4 DDR3
UDIMM or RDIMM
1333/1066/800MHz
8 x DDR3
UDIMM, RDIMM, or
LV RDIMM
1333/1066/800/
667MHz
8 x DDR3
UDIMM, RDIMM, or
LV RDIMM
1333/1066/800/
667MHz
18 x DDR3
UDIMM or RDIMM
1333/1066MHz
Min/Max RAM
1GB/128GB
1 GB/128GB1
1 GB/64GB
1GB/144GB
HD Bays
4 x 3.5‖ cabled or
8 x 3.5‖ hot-plug
(supports 2.5" drives
with HDD carrier)
8 x 3.5" hot-plug or
8 x 2.5" hot-plug
12 x 3.5" hot-plug + 2
x 2.5" internal cabled
or
12 x 2.5" hot-plug + 2
x 2.5" internal cabled
4 x 3.5‖ with optional
flex bay,
6 x 3.5‖ without flex
bay, or
8 x 2.5‖
HD Types
SATA (default), SAS
and SSD optional
with add-in
controller
SATA (default), SAS
and SSD optional
with add-in
controller
SATA (default), SAS
and SSD optional with
add-in controller
SAS and SATA, Nearline
SAS and SSD
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PowerEdge R515 Technical Guide
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Feature
R510
R515 (8 HDD)
R515 (12 HDD)
R710
Ext Drive
Bay(s)
1 for slim optical
drive in 4-HDD and
8-HDD chassis
No optical drive in
12-HDD chassis
1 for slim optical
drive
No optical drive
Optional flex bay
expansion to support
half-height tape
backup unit
Embedded HD
Controller
Chipset-based SATA
Chipset-based SATA
Chipset-based SATA
Chipset-based SATA
Optional
Storage
Controller
Non-RAID:
SAS 5/E
LSI 2032 (for tape
backup unit only)
RAID:
SAS 6/iR Modular
PERC 6/i
PERC 6/E
PERC H200
PERC H700
PERC H800
Non-RAID:
6 Gbps SAS HBA
RAID:
PERC S300
PERC H200
PERC H700
PERC H800
Non-RAID:
6 Gbps SAS HBA
RAID:
PERC H200
PERC H700
PERC H800
Non-RAID:
SAS 5/E
LSI 2032 (for tape
backup unit only)
6 Gps SAS HBA
RAID:
SAS 6/iR
PERC 6/i
PERC 6/E
PERC H200
PERC H700
PERC H800
Availability
Hot-plug hard drive,
redundant power
supply, quad-pack
LED diagnostic or
LCD (with hot-plug
hard drive chassis),
memory mirroring
Hot-plug hard drive,
redundant power
supply, LCD
diagnostic
Hot-plug hard drive,
redundant power
supply, quad-pack LED
diagnostic
Hot-plug hard drive,
redundant power
supply and cooling,
ECC memory, Single
Device Data Correction
(SDDC) supports
memory demand and
patrol scrubbing, highavailability failover
cluster
Server Mgt.
BMC, IPMI 2.0
compliant, full Dell
OpenManage™ suite
Optional: iDRAC6
Express, iDRAC6
Enterprise, vFlash
BMC, IPMI 2.0
compliant, full Dell
OpenManage™ suite
Optional: iDRAC6
Express, iDRAC6
Enterprise, vFlash
BMC, IPMI 2.0
compliant, full Dell
OpenManage™ suite
Optional: iDRAC6
Express, iDRAC6
Enterprise, vFlash
iDRAC6 Express, BMC,
IPMI 2.0 compliant, full
Dell OpenManage™
suite
Optional: iDRAC6
Enterprise, vFlash
I/O Slots
3 PCIe + 1 storage
slot or
1 PCIe + 1 storage
slot
3 PCIe + 1 storage
slot or
1 PCIe + 1 storage
slot
3 PCIe + 1 storage slot
or
1 PCIe + 1 storage slot
2 PCIe x8 + 2 PCIe x4 or
1 PCIe x16 + 2 PCIe x4
NIC/LOM
2 x GbE LOM
Optional: various
NICs available
2 x GbE LOM
Optional: various
NICs available
2 x GbE LOM
Optional: various NICs
available
Broadcom® BCM5709C
4 x iSCSI TOE
Optional: various NICs
available
USB
2 front, 2 back,
2 internal
2 front, 2 back,
2 internal
2 front, 2 back,
2 internal
2 front, 2 back,
1 internal
Hypervisor
(with internal
SD card)
No
No
No
Yes
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PowerEdge R515 Technical Guide
Dell
Feature
R510
R515 (8 HDD)
R515 (12 HDD)
R710
Power
Supplies
4-HDD chassis:
non-redundant,
480W (80+ SILVER)
8-HDD and 12-HDD
chassis: hot-plug
redundant 750W
(80+ GOLD)
Auto ranging
(100V~240V)
Hot-plug redundant
750W (80+ GOLD)
Auto ranging
(100V~240V)
Hot-plug
redundant 750W (80+
GOLD)
Auto ranging
(100V~240V)
Two hot-plug high
efficient 570W or
Two hot-plug 870W
(1+1)
Fans
Non-redundant,
non-hot-pluggable
Non-redundant, nonhot-pluggable
Redundant, non-hotpluggable
5 hot-plug fans
(default processor
config)
4 hot-plug fans (single
processor config)
Dimensions
(HxWxD)
86.4 x 436.6 x 610.2
(mm)
3.40 x 17.19 x 24.09
(in)
86.4 x 436.6 x 610.2
(mm)
3.40 x 17.19 x 24.09
(in)
86.7 x 445.2 x 664.6
(mm)
3.42 x 17.53 x 26.17
(in)
864 x 443.1 x 720.6
(mm)
3.40 x 17.4 x 29.75 (in)
Weight
Max (8-HDD
chassis): 22.5 Kg
(49.5 lbs)
Max (12-HDD
chassis): 29.0Kg
(63.8 lbs)
Max: 22.5 Kg
(49.5 lbs)
Max: 29.0 Kg
(63.8lbs)
Max: 26.1 Kg
(57.54 lbs)
1
128 GB maximum memory will be available with 16 GB DIMMs (available Q1 2011).
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PowerEdge R515 Technical Guide
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2 System Overview
Table 2.
Product Features Summary
Feature
Technical Specification
Form Factor
2U rack
Processors
AMD Opteron™ 4100 series processors
Processor Sockets
2
Front Side Bus or
HyperTransport
HyperTransport-3 links
Cache
L2: 512K/core
L3: 6MB
Chipset
AMD (SR5670 and SP5100)
Memory1
Up to 128GB2 (8 DIMM slots) 1GB/2GB/4GB/8GB/16GB2 1333MHz
I/O Slots
3 PCIe G2 slots (one x8, two x4)
1 storage slot (x4)
RAID Controller
Internal Controllers:
PERC H200 (6Gb/s)
PERC H700 (6Gb/s) (non-volatile batterybacked cache: 512MB, 1G)
PERC S300 (software based) (8-HDD
chassis only)
External Controllers:
PERC H800 (6Gb/s) (non-volatile batterybacked cache: 512MB, 1G)
External HBA (Non-RAID):
6GB/s SAS HBA
Drive Bays
8 HDD chassis:
2.5‖ or 3.5‖ SAS, SATA, or SSD
12 HDD chassis:
2.5‖ or 3.5‖ SAS, SATA, or SSD + 2 x 2.5‖
internal cabled
Maximum Internal
Storage
16TB (8-HDD chassis)
25.2TB (12-HDD chassis)
Hard Drives1
3.5‖ SATA (7.2K RPM): 160GB, 250GB,
500GB, 1TB, 2TB
3.5‖ Nearline SAS (7.2K RPM): 500GB,
1TB, 2TB
3.5‖ SAS (15K RPM): 146GB, 300GB,
450GB, 600GB
2.5‖ SAS (10K RPM): 146GB, 300GB,
600GB
2.5‖ SATA SSD: 50GB, 100GB
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PowerEdge R515 Technical Guide
Dell
Feature
Technical Specification
Communications
Optional add-in NICs:
Intel® 10GBase-T Copper Single Port NIC,
PCI-E x8
Intel® PRO 1000 PT Single Port Adapter,
Gigabit Ethernet NIC, PCIe x1
Intel® Gigabit ET Dual Port Server
Adapter, PCIe x4
Intel® Gigabit ET Quad Port Server
Adapter, PCIe x4
Intel® Ethernet X520 DA2 Dual-Port 10
Gigabit Server Adapter
Intel® X520-T2 Dual-Port 10 Gigabit
Ethernet Server Adapter
Broadcom® BCM5709C IPV6 Gigabit
Copper Dual Port NIC with TOE and iSCSI
Offload, PCIe x4
Broadcom® BCM5709C IPV6 Gigabit
Copper Dual Port NIC with TOE, PCIe x4
Broadcom® BCM5709C 10/100/1000BASET
Quad Port NIC
Broadcom® NetXtreme™ II 57711 DualPort SFP+/Direct Attach 10Gb Ethernet
PCIe with TOE and iSCSI Offload
Power Supply
Redundant 750W
Availability
Hot-plug hard drives, hot-plug redundant power, ECC memory, quad-pack LED
diagnostic or interactive LCD (8-HDD chassis only)
Video
Matrox® G200eW with 8MB memory
Remote Management
Optional: iDRAC6 Express, iDRAC6 Enterprise, and vFlash (upgrade optional)
Systems Management
Dell OpenManage™ featuring Dell Management Console
BMC, IPMI 2.0 compliant
Lifecycle Controller enabled via optional iDRAC6 Express or iDRAC6 Enterprise and
vFlash
Unified Server Configurator
Rack Support
ReadyRails™ sliding rails for 4-post racks with support for optional cable
management arm or
ReadyRails™ static rails for 4-post and 2-post racks
Optional add-in HBAs:
Brocade® 1020 10G Converged Network
Adapter (CNA)–dual port
Emulex® LPe11002 FC4 HBA, Dual Port
Emulex® LPe1150 FC4 HBA, Single Port
Emulex® LPe12000 8Gbps FC HBA, Single
Port
Emulex® LPe12002 8Gbps FC HBA, Dual
Port
Emulex® OCE10102FXD, 10G PCIe FCoE
CNA, Dual Port
Qlogic® QLE220 FC4 HBA, Single Port
Qlogic® QLE2460 FC4 HBA, Single Port
Qlogic® QLE2462 FC4 HBA, Dual Port
Qlogic® QLE2560 8Gbps FC HBA, Single
Port
Qlogic® QLE2562 8Gbps FC HBA, Dual Port
Qlogic® QLE8152 8Gbps FC HBA, Dual Port
Brocade® FC HBA BR815
Brocade® FC HBA BR825
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PowerEdge R515 Technical Guide
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Feature
Technical Specification
Operating Systems
Microsoft® Windows® Small Business Server 2008
Microsoft® Windows Server® 2008 SP2, x86/x64 (x64 includes Hyper-V™)
Microsoft® Windows Server® 2008 SP2 R2, x64 (includes Hyper-V™ v2)
Microsoft® Windows® HPC Server 2008
Novell® SUSE® Linux® Enterprise Server
Red Hat® Enterprise Linux®
Optional Embedded Hypervisors:
Citrix® XenServer®
VMware® vSphere™ 4.1 (including VMware ESX® 4.1 or VMware ESXi™ 4.1)
For more information on the specific versions and additions, visit
www.dell.com/OSsupport
Featured Database
Application
Microsoft® SQL Server® solutions (see Dell.com/SQL)
1
GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.
2
128 GB maximum memory will be available with 16 GB DIMMs (available Q1 2011).
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3 Mechanical
3.1 Chassis Description
PowerEdge R515 chassis is a 2U rack-mount design that supports the following configurations:


8 hard drive chassis:
o 8 hot-plug 3.5‖ SAS/SATA hard drives (2.5‖ SAS/SSD with hard drive carrier)
o 750W redundant power supplies
o 11G diagnostic LCD
12 hard drive chassis:
o 12 hot-plug 3.5‖ SAS/SATA and 2 internal cabled 2.5‖ SAS/SATA hard drives
o 750W redundant power supplies
o Rack-ear diagnostic LED
o Redundant system cooling
3.2 Dimensions and Weight
Figure 1 details the dimensions and weight for the PowerEdge R515.
Chassis
type
Xa
Xb
Za
Za
Zb*
w/ bezel w/o bezel
Zc
Max
Weight
8-HDD
482.4mm
436.6mm 86.4mm
35.0mm
21.0mm
610.2mm
642.0mm
22.5Kg
12-HDD
482.4mm
445.2mm 86.76mm 35.0mm
21.0mm
664.65mm 697.05mm 29.0Kg
Y
Figure 1.
R515 Chassis Dimensions
*Zb measures to the nominal rear wall external surface where the motherboard I/O connectors reside.
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3.3 Front Panel View and Features
The PowerEdge R515 is available in two chassis configurations: 8 hard drive chassis (see Figure 2) and 12
hard drive chassis (as shown in Figure 3). The 8 hard drive chassis has a configuration including the LCD
panel, buttons, and connectors on the front panel. The 12 hard drive chassis has a configuration including
the LED panel, connectors, and buttons located on the rack ears above the latches. You cannot upgrade a
chassis from one configuration to another. Figure 4 shows a front view with the optional bezel.
Figure 2.
Front View (8 Hard Drive Chassis)
Figure 3.
Front View (12 Hard Drive Chassis)
Figure 4.
Front View (With Optional Bezel)
See the Front-Panel Features and Indicators section in the About Your System chapter of the PowerEdge
R515 Hardware Owner’s Manual on Support.Dell.com for more information.
3.4 Back Panel View and Features
Figure 5 shows the back of the PowerEdge R515 server.
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Figure 5.
Back View
See the Back-Panel Features and Indicators section in the About Your System chapter of the PowerEdge R515
Hardware Owner’s Manual on Support.Dell.com for more information.
3.5 Power Supply Indicators
The PowerEdge R515 redundant power supplies have one status bi-color LED: green for AC power present
and amber for a fault as detailed in Table 3.
Table 3.
LED
Power Supply Status
Power Supply Status
AC Power is not present
AC Power is present
Fault of any kind is detected
DC Power is applied to the system
↔
Redundant power supply mismatch
(when hot-plugged/swapped)
See the Power Indicator Codes section in the About Your System chapter of the PowerEdge R515 Hardware
Owner’s Manual on Support.Dell.com for more information.
3.6 NIC Indicators
See the NIC Indicator Codes section in the About Your System chapter of the PowerEdge R515 Hardware
Owner’s Manual on Support.Dell.com for more information.
3.7 Side Views
Figure 6 and Figure 7 show left and right side views of the server.
Figure 6.
Left Side View
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Figure 7.
Right Side View
3.8 Rails and Cable Management
3.8.1
ReadyRails Sliding Rails
ReadyRailsTM Sliding Rails for 4-post racks support the following:




3.8.2
Toolless installation in 19‖ EIA-310-E compliant square or unthreaded round hole 4-post racks,
including all generations of Dell racks
Tooled installation in 19‖ EIA-310-E compliant threaded hole 4-post racks (requires the 2U Threaded
Rack Adapter Brackets Kit)
Full extension of the system out of the rack to allow serviceability of key internal components
Optional cable management arm (CMA)
ReadyRails Static Rails
ReadyRailsTM Static Rails for 4-post and 2-post racks support the following:


Toolless installation in 19‖ EIA-310-E compliant square or unthreaded round hole 4-post racks,
including all generations of Dell racks
Tooled installation in 19‖ EIA-310-E compliant threaded hole 4-post and 2-post racks
For more information, see the Rails section the Rack Information chapter.
3.9 Rack View
3.9.1
Sliding Rails
The PowerEdge R515 sliding rails are a stab-in design, meaning that the inner chassis rail members must first
be attached to the sides of the system prior to inserting them into the middle (intermediate) and outer
cabinet rail members installed in the rack.
The CMA can be mounted to either side of the rails without the use of tools or the need for conversion, but
it is recommended that it be mounted on the side opposite the power supplies to allow easier access to the
power supplies for service or replacement.
See Figure 8 and Figure 9 for views of the R515 mounted in the B3 sliding rails.
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Figure 8.
Figure 9.
3.9.2
R515 Mounted in B3 Sliding Rails
Back View of R515 Mounted in B3 Sliding Rails with CMA
Static Rails
The R515 static rails are also a stab-in design, but unlike the sliding rails, they do not include middle
(intermediate) rail members. After the inner chassis rail members have been attached to the sides of the
chassis, they are inserted directly into the outer cabinet rail members installed in the rack.
See Figure 10 for a view of the R515 mounted in B4 static rails.
Figure 10. R515 Mounted in the B4 Static Rails in 2-Post Center Mount Configuration
3.10 Fans
There are five fan modules in the PowerEdge R515. The types of fan modules differ, depending on one of
the following chassis configurations:


8 hard drive chassis: 5 single-fan modules
12 hard drive chassis: 5 double-fan (stacked) modules (10 fans total)
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3.11 Control Panel/LCD
The PowerEdge R515 includes one of the following control panel configurations:


LCD panel (8 hard drive chassis only)
LED panel (12 hard drive chassis only)
3.11.1 LCD Panel Configuration
Figure 11 and Figure 12 show the LCD panel configuration for the PowerEdge R515 with 8 HDDs.
Figure 11. LCD Panel Configuration
Figure 12. LCD Panel (Detailed View)
The LCD panel is located on the front of the system chassis to provide user access to buttons, display, and
I/O interfaces. Features of the system control panel include the following:







ACPI-compliant power button with an integrated green power LED (controlled by iDRAC6)
128x20 pixel LCD screen
Two navigation buttons
One select button
One system ID button
Non-maskable Interrupt (NMI) button (recessed)
Ambient temperature sensor
The LCD panel is a graphics display controlled by iDRAC6. Error codes can be sent to the display by either
iDRAC6 or BIOS.
The system's LCD panel provides system information and status messages to signify when the system is
operating correctly or when the system needs attention.
The R515 BIOS has the ability to enter a secure mode through Setup, which locks the Power and NMI
buttons. When in this mode, the power button can still be used to turn on the system, but it cannot be used
to turn off power to the system.
For more information on the LCD panel, see the LCD Panel Features (Optional) section in the About Your
System chapter in the PowerEdge R515 Hardware Owner’s Manual on Support.Dell.com.
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3.11.2 LED Panel Configuration
Figure 13 and Figure 14 show the LCD panel configuration for the PowerEdge R515 with 12 HDDs.
Figure 13. LED Panel Configuration
Figure 14. LED Panel (Detailed View)
For a complete description of LED indicators, their causes, and possible courses of action to take to resolve
an error, see the Diagnostic Lights (Optional) section in the About Your System chapter in the PowerEdge
R515 Hardware Owner’s Manual on Support.Dell.com.
3.12 Security
For additional information regarding the following security features, see the PowerEdge R515 Hardware
Owner’s Manual on Support.Dell.com.
3.12.1 Cover Latch
The PowerEdge R515 comes with a coin lock entry latch on the top cover of the unit and provides security
for the entire system. The lock provides for toolless access to the chassis.
3.12.2 Bezel
A metal bezel is an available option and is mounted to the chassis front to provide the Dell ID. A lock on the
bezel prevents un-authorized access to system peripherals and the control panel. System status (on the LCD
or LED panel) remains viewable with the bezel is installed.
3.12.3 Hard Drive
Hot-plug hard drives are only accessible by opening the bezel, thus locking the bezel secures the hard
drives. Cabled hard drives are only accessible by opening the top cover, thus locking the top cover secures
the hard drives.
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3.12.4 TPM
The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to store the Microsoft® BitLocker™ keys for hard drive encryption features
in Microsoft® Windows Server® 2008. TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for
binding. In China, the S-TPM (Socket TPM) is used.
3.12.5 Power Off Security
The control panel is designed such that the power switch cannot be accidentally activated. The lock on the
bezel secures the power button behind the bezel. In addition, there is a setting in the CMOS setup that
disables the power button function.
3.12.6 Intrusion Alert
A switch inside the chassis is used to detect chassis intrusion. When the system cover is opened, the switch
circuit closes to indicate intrusion. When enabled, the software can provide notification to the customer
that the cover has been opened.
3.12.7 Secure Mode
BIOS has the ability to enter a secure boot mode through Setup. This mode includes the option to lock out
the power and NMI switches on the Control Panel or to set up a system password.
3.13 USB Key
Dell does not offer USB keys for factory installation. The PowerEdge R515 supports two internal USB
connectors which can be used for USB keys.
3.14 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the RealTime Clock and CMOS RAM on the SP5100 chip.
3.15 Field Replaceable Units (FRU)
Parts available for field replacement include:















Backplane
CMOS battery
Expansion card
Front bezel
HDD
I/O panel
Memory
ODD
PDB
Power supply
Processor
Processor shroud
System board
System cover
System fan
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For detailed information on replacing parts for the PowerEdge R515, see the Installing System Components
chapter in the PowerEdge R515 Hardware Owner’s Manual on Support.Dell.com.
3.16 User Accessible Jumpers, Sockets, and Connectors
See the Jumpers and Connectors chapter in the PowerEdge R515 Hardware Owner’s Manual on
Support.Dell.com.
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4 Power, Thermal, Acoustic
4.1 Power Supplies
The PowerEdge R515 system is powered by hot-plug redundant 750W power supply units. Power is softswitched, allowing power cycling using a switch on the front of the system enclosure, or through software
control (through server management functions). The power system is compatible with industry standards,
such as ACPI and Server 2000.
Two options are available for 750W hot-plug redundant PSUs:


n+0, hot plug non-redundant
n+1, hot plug redundant
For a redundant power supply configuration (shown in Figure 15), the second power supply provides hotpluggable power redundancy. In redundant mode, the system distributes the power load across both power
supplies to maximize efficiency. When a power supply is removed with the system powered on, the full
power load is picked up by the remaining power supply.
Figure 15. R515 Redundant Power Supplies
4.2 Power Supply Specifications
Table 4 details power supply specfications.
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Table 4.
750W Power Supply Specifications
AC Power Supply (per power supply)
Wattage
750W (optional redundant)
Voltage
100–240 VAC, auto ranging, 50–60Hz
Maximum inrush current
Under typical line conditions and over the entire system
ambient operating range, the inrush current may reach 55A per
power supply for 10ms or less
The R515 Energy Smart 750W Power Supply is certified Gold (80 Plus) and Climate Savers 3. It is certified UL approved
and incorporates PFC logic.
4.3 Heat Dissipation
Redundant power supply (8 hard drive chassis): 2200 BTU/hr maximum
Redundant power supply (12 hard drive chassis): 2450 BTU/hr maximum
4.4 Environmental Specifications
Table 5 details the environmental specifications for operating and storage of the PowerEdge R515.
Table 5.
Environmental Specifications
Temperature
Operating
10° to 35°C (50° to 95°F) with a maximum temperature
gradation of 10°C per hour
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1°F/550 ft.
Storage
-40° to 65°C (-40° to 149°F) with a maximum temperature
gradation of 20°C per hour
Relative Humidity
Operating
20% to 80% (noncondensing) with a maximum humidity gradation
of 10% per hour
Storage
5% to 95% (noncondensing) with a maximum humidity gradation
of 10% per hour
Maximum Vibration
Operating
0.26 Grms at 5–350Hz for 15 minutes
Storage
1.87 Grms at 10–500Hz for 15 minutes
Maximum Shock
Operating
One shock pulse in the positive z axis (one pulse on each side of
the system) of 31G for 2.6ms in the operational orientation
Storage
Six consecutively-executed shock pulses in the positive and
negative x, y, and z axes (one pulse on each side of the system)
of 71G for up to 2ms
Square wave shock of 32G @ 270 in/second
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Altitude
Operating
-15.2 to 10,668m
(-50 to 35,000ft)
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1°F/550 ft.
Storage
-15.2 to 10,668m
(-50 to 35,000ft)
The airborne contaminant level is class G2 or lower as defined by ISA-S71.04-1985.
4.5 ENERGY STAR Compliance
ENERGY STAR® qualified configurations can be accessed from the ENERGY STAR Compliance results landing
page on Dell.com.
4.6 Thermal
The thermal design of the PowerEdge R515 includes the following:




Closed loop thermal control algorithm: This method uses feedback temperatures to dynamically
determine proper fan speeds.
Comprehensive thermal management: The PowerEdge R515 controls system cooling fan speed based
on several different responses from critical component sensors, such as processor temperature, DIMM
temperature, IOH temperature, inlet ambient temperature, and system configurations. The thermal
management adjusts proper cooling ability for the system according to what the system really needs.
Optimized Ventilation: The R515 chassis has a custom ventilation design for optimized air flow path.
Each component and peripheral is ensured sufficient air for cooling.
Redundant Cooling: The R515 (12-HDD system) has redundant cooling, which means that other fans
take over for cooling if a fan fails.
4.7 Acoustics
The acoustical design of the PowerEdge R515 reflects adherence to Dell’s high sound quality standards.
Sound quality is different from sound power level and sound pressure level in that it describes how humans
respond to annoyances in sound, like whistles, hums, etc. One of the sound quality metrics in the Dell
specification is prominence ratio of a tone as shown in Table 6 and 0.
Fan speeds and noise levels ramp up during the boot process to add a layer of protection for component
cooling if the system were not to boot properly. Hardware configurations affect system noise levels. Dell’s
thermal control provides for optimized cooling with varying hardware configurations, as shown in the
following tables.
Table 6.
Acoustical Performance (8 HDD Chassis)
Typical Configuration @ 23 ± 2 °C
CPU
HDD
RAID
DIMM
2 x AMD
4180
6 core
2.6GHz
6 x 3.5‖
1TB SATA
7,200 rpm
PERC
H700
4 x 2GB
Operating
Mode
LWA-UL
(Bels)
LpA
(dBA)
Prominent
Tones
Idle
5.3
39
None
Stressed
5.3
39
None
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Max. Configuration @ 23 ± 2 °C
CPU
HDD
RAID
2 x AMD
4180
6 core
2.8GHz
8 x 3.5‖
600GB SAS
15,000 rpm
PERC
H700
Table 7.
DIMM
Operating
Mode
LWA-UL
(Bels)
LpA
(dBA)
Prominent
Tones
Idle
5.4
43
Yes
Stressed
5.5
43
Yes
8 x 8GB
Acoustical Performance (12 HDD Chassis)
Typical Configuration @ 23 ± 2 °C
CPU
HDD
RAID
2 x AMD
4180
6 core
2.6GHz
8 x 3.5‖
2TB SATA
7,200 rpm
PERC
H700
DIMM
HDD
RAID
2 x AMD
4180
6 core
2.8GHz
12 x 3.5‖
600GB SAS
15,000 rpm
+ 2 x SSD
50GB SATA
PERC
H700
LWAUL
(Bels)
LpA
(dBA)
Prominent
Tones
Idle
6.1
45
Yes
Stressed
6.3
47
Yes
Operating
Mode
LWAUL
(Bels)
LpA
(dBA)
Prominent
Tones
Idle
6.1
45
Yes
Stressed
6.3
47
Yes
4 x 4GB
Max. Configuration @ 23 ± 2 °C
CPU
Operating
Mode
DIMM
8 x 8GB
Definitions
Typical configuration: The system is populated with projected average quantity, type, capacity, speed, etc.,
of components.
Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific activity.
Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6. The software SPECPower_ssj2008
is utilized to stress the processors. SPECPower is set to 50% loading.
LwA – UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and
measured in accordance to ISO 7779 (1999).
LpA: Average bystander A-Weighted sound pressure level. The system is placed in a rack with its bottom at
25 cm from the floor. The acoustic transducers are at the four bystander positions, ref ISO7779 (1999)
Section 8.6.2.
Prominent tone: Criteria of D.5 and D.8 of ECMA-74 9th ed. (2005) are followed to determine if discrete
tones are prominent. The system is placed in a rack with its bottom at 75 cm from the floor. The acoustic
transducer is at front bystander position, ref ISO7779 (1999) Section 8.6.2.
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5 Processors
5.1 Overview
The PowerEdge R515 utilizes the latest four and six core offerings from AMD’s Opteron 4000 series (C32).
5.2 Features


Performance for blades and cost-effective DP servers
o Up to six cores per processor
o Up to 6M L3 Cache for 6-core processor (512KB per core L2)
o Enhanced AMD power efficiency features:
 CoolCore™ Technology
 Enhanced AMD PowerNow!™
 APML
o Demand-based switching for active processor power management, as well as support for ACPI
P-States and C-States
 C1E support
 AMD CoolSpeed
o Dual-channel U/RDDR3 up to 1333 MHz, ECC
o Up to 3 DIMMs/channel, 6 per CPU (R515 supports to up 2 DIMMs/channel, 4 per processor)
o Low voltage DIMM support (6-core processor only)
o Designed for thermally-constrained environments
o 45 nm process technology
o PCIe Gen 2 with up to 42 lanes with 9 controllers (SR5670)
o Single series for UP and DP platforms (enterprise scalability and features for 1P)
New C32 socket infrastructure
o Lower power/thermal bands
o Dual 16-bit HT3 links, up to 6.4 GT/s per link
o Workload optimized platforms (SR5670 chipset for expandable SMB)
5.3 Supported Processors
Table 8.
Supported Processor Description and Features
Model
Speed
Power
Cores
L2/L3 Cache
HyperTransport
HyperTransport
Multiplier
Memory
Speed
Process
4122
2.2GHz
95W
4
4 x 512KB/6MB
3.2GHz
11x
1333
45nm
4130
2.6GHz
95W
4
4 x 512KB/6MB
3.2GHz
13x
1333
45nm
4162 EE
1.7GHz
35W
6
6 x 512KB/6MB
3.2GHz
8.5x
1333
45nm
4164 EE
1.7GHz
35W
6
6 x 512KB/6MB
3.2GHz
9x
1333
45nm
4170 HE
2.1GHz
65W
6
6 x 512KB/6MB
3.2GHz
10.5x
1333
45nm
4174 HE
2.3GHz
65W
6
6 x 512KB/6MB
3.2GHz
11.5x
1333
45nm
4176 HE
2.4GHz
65W
6
6 x 512KB/6MB
3.2GHz
12x
1333
45nm
4180
2.6GHz
95W
6
6 x 512KB/6MB
3.2GHz
13x
1333
45nm
4184
2.8GHz
95W
6
6 x 512KB/6MB
3.2GHz
14x
1333
45nm
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5.4 Processor Configurations
The PowerEdge R515 is a two-socket server that will operate with either a single processor or dual
processors. When the R515 is configured with a single processor, the memory controller is embedded in the
processor and supports 4 DIMMs (1 GB minimum and a 32 GB maximum). When two processors are installed
in the system, it supports a total of 8 DIMMs (2 GB minimum and a 128 GB maximum (with 16 GB DIMMS—
available Q1 2011).
5.5 Processor Installation
See the Processors section in the Installing System Components chapter in the PowerEdge R515 Hardware
Owner’s Manual on Support.Dell.com.
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6 Memory
6.1 Overview
The PowerEdge R515 utilizes DDR3 memory providing a high-performance, high-speed memory interface
capable of low latency response and high throughput.
Key features of the R515 memory system include the following:










Support for up to 32 GB of UDIMM memory (8 x 4 GB)
Support for up to 128 GB of DDR3 RDIMM memory (8 x 16 GB) (16 GB DIMMS available Q1 2011)
Support for 1333 MHz single- and dual-rank DIMMs
Support for 1066 MHz quad-rank DIMMS
Two channels per processor
Advanced ECC (Chipkill) mode (x4 RDIMM only)
Online spare
Parity
Low voltage (LV) DIMM support (6 core processor only)
Single bit error correction
6.2 DIMMs Supported
The PowerEdge R515 supports DDR3 RDIMMs and UDIMMs. The memory interface uses 1 GB, 2 GB, 4 GB, 8 GB,
and 16 GB (available Q1 2011) RDIMMs and 1 GB, 2 GB, and 4 GB UDIMMs. See Table 9.
Table 9.
DIMMS Supported
UDIMM
RDIMM
1GB, DDR3, 1333MHz, single rank
2GB, DDR3, 1333MHz, single rank
2GB, DDR3, 1333MHz, single rank
4GB, DDR3, 1333MHz, dual rank
4GB, DDR3, 1333MHz, dual rank
8GB, DDR3, 1333MHz, dual rank
1GB, DDR3, 1333MHz, single rank, LV
16GB1, DDR3, 1333MHz, quad rank
2GB, DDR3, 1333MHz, single rank, LV
2GB, DDR3, 1333MHz, single rank, LV
4GB, DDR3, 1333MHz, dual rank, LV
4GB, DDR3, 1333MHz, dual rank, LV
8GB1, DDR3, 1333MHz, dual rank, LV
16GB1, DDR3, 1066MHz, quad rank, LV
1
Available Q1 2011
6.3 DIMM Slots
The DDR3 memory interface consists of two memory channels per processor socket. Each channel supports
up to two RDIMMs for single/dual/quad rank or two UDIMMs. Population order is identified by the silkscreen
designator and the System Information Label (SIL) located on the chassis cover.
The following DIMM population rules apply:



Support for DDR3 1333 MHz UDIMMs or 1066/1333 MHz RDIMMs
2 channels, up to 2 DIMMs per channel
Support for 1333 MHz single and dual-rank DIMMs, 1066 MHz quad-rank DIMMs
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The following is not supported:


Mixing of RDIMMs and UDIMMs
Use of non-ECC UDIMMs
For more information on memory configuration, see the System Memory section in the Installing System
Components chapter in the PowerEdge R515 Hardware Owner’s Manual on Support.Dell.com.
6.4 Speed
Each processor has 2 DDR3 channels capable of supporting speeds up to 1333 MHz. Single- and dual-rank
DIMM types can support speeds up to 1333 MHz. Quad-rank DIMMs can support speeds up to 1066 MHz.
If memory modules with different speeds are installed, they will operate at the speed of the slowest
installed memory module(s).
6.5 Sparing
Memory sparing is supported. Sparing requires a fully populated memory configuration (8 DIMMs). See Table
10 (1 processor) and Table 11 (2 processors).
6.6 Mirroring
No mirroring support.
6.7 RAID
No RAID memory support.
6.8 Supported Configurations
Table 10.
Supported Configurations (1 Processor)
DIMM Slots
System
Capacity
Channel A
1 Socket
Channel B
UDIMM
RDIMM
A1
A3
A2
A4
DIMM speed
System speed
DIMM speed
System speed
1GB
1GB
—
—
—
1333
1333
N/A
N/A
2GB
1GB
—
1GB
—
1333
1333
N/A
N/A
2GB
2GB
—
—
—
1333
1333
1333
1333
4GB
1GB
1GB
1GB
1GB
1333
1333
N/A
N/A
4GB
2GB
—
2GB
—
1333
1333
1333
1333
8GB
2GB
2GB
2GB
2GB
1333
1333
1333
1333
4GB
4GB
—
—
—
1333
1333
1333
1333
8GB
4GB
—
4GB
—
1333
1333
1333
1333
16GB
4GB
4GB
4GB
4GB
1333
1066
1333
1066
16GB
8GB
—
8GB
—
N/A
N/A
1333
1333
32GB
8GB
8GB
8GB
8GB
N/A
N/A
1333
1066
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DIMM Slots
System
Capacity
Channel A
1 Socket
Channel B
UDIMM
RDIMM
A1
A3
A2
A4
DIMM speed
System speed
DIMM speed
System speed
32GB1
16GB
—
16GB
—
N/A
N/A
1066
1066
1
16GB
16GB
16GB
16GB
N/A
N/A
1066
1066
64GB
1
16 GB DIMMS available Q1 2011
Table 11.
Supported Configurations (2 Processors)
DIMM Slots
System
Capacity
DIMM Slots
2 Socket
Channel A
Channel B
Channel A
Channel B
A1
A3
A2
A4
B1
B3
B2
B4
DIMM
speed
System
speed
DIMM
speed
System
speed
2GB
1GB
—
—
—
1GB
—
—
—
1333
1333
N/A
N/A
4GB
1GB
—
1GB
—
1GB
—
1GB
—
1333
1333
N/A
N/A
4GB
2GB
—
—
—
2GB
—
—
—
1333
1333
1333
1333
8GB
1GB
1GB
1GB
1GB
1GB
1GB
1GB
1GB
1333
1333
N/A
N/A
8GB
2GB
—
2GB
—
2GB
—
2GB
—
1333
1333
1333
1333
16GB
2GB
2GB
2GB
2GB
2GB
2GB
2GB
2GB
1333
1333
1333
1333
8GB
4GB
—
—
—
4GB
—
—
—
1333
1333
1333
1333
16GB
4GB
—
4GB
—
4GB
—
4GB
—
1333
1333
1333
1333
32GB
4GB
4GB
4GB
4GB
4GB
4GB
4GB
4GB
1333
1066
1333
1066
32GB
8GB
—
8GB
—
8GB
—
8GB
—
N/A
N/A
1333
1333
64GB
8GB
8GB
8GB
8GB
8GB
8GB
8GB
8GB
N/A
N/A
1333
1066
16GB
—
16GB
—
16GB
—
16GB
—
N/A
N/A
1066
1066
16GB
16GB
16GB
16GB
16GB
16GB
16GB
16GB
N/A
N/A
1066
1066
64GB1
128GB
1
1
UDIMM
RDIMM
16 GB DIMMS available Q1 2011
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7 Chipset
7.1 Overview
The PowerEdge R515 planar uses a dual IOB configuration using the AMD SR5670 chipset with IO bridges and
the SP5100 Southbridge. The SR5670 is designed to support the AMD C32 processor family, HyperTransport-3
Interface (@ 2.6GHz), DDR3 memory technology, and PCI Express Generation 2. The chipset consists of the
SR5670 and the SP5100.
7.2 AMD I/O Bridges
The PowerEdge R515 I/O board uses the AMD SR5670 I/O Bridges (IOB) to provide links between the C32
processor(s) and I/O components. The main components of the I/O controllers are configured to use two x16
HyperTransport 3 links (to both processors), up to 42 lanes of PCI Express Gen 2, an x4 PCIe Gen 1
Southbridge Interface (SB Link) and an integrated IOAPIC.
7.3 HyperTransport 3 (HT3)
The HyperTransport 3 (HT3) consists of serial point-to-point interconnects for the processors and the I/O
bridges. The PowerEdge R515 has a total of four HT3 links per processor which allows interconnecting each
processor with each other and an option for I/O Bridge. Each I/O Bridge has a single x16 HT3 link. A full link
consists of 16 lanes (full-width) in each direction with a link speed of 6.4 GT/s. The HT3 clocking for
processor HT3 and IOB HT3 are 3.2 GHz and 2.6 GHz, respectively. Therefore, the IOB HT3 link is capable of
5.2 GT/s. For routing, the HT3 links are grouped by x8 Command Address (CAD), x1 Control (CTL), and x1
Clock (CLK) for each RX and TX directions.
7.4 Southbridge Link Interface
The Southbridge (SB) link connects the SR5670 IOB with the AMD Southbridge SP5100. The SB Link (A-Link
Express) is equivalent to an x4 PCIe Gen 1 link with a transfer rate of 1 GB/s in each direction.
7.5 AMD SP5100 Southbridge (SP5100)
SP5100 is a highly integrated Southbridge controller, supporting the following functions:



PCI bus 32-bit interface Rev 2.3 running at 33 MHz
o Serial ATA (SATA) ports with transfer rates up to 300 MB/s (R515 supports one SATA port for
optical devices)
o Five OHC (full-speed 1.1) and two EHCI (high-speed 2.0) USB host controllers, with up to 12
USB general purpose ports and 2 USB embedded ports (R515 uses 6 ports for internal and
external use from the general purpose ports)
Power management interface (ACPI 3.0b compliant)
Integrated Micro Controller (IMC) and thermal management
Note: The iDRAC interfaces the Hardware Thermal Control (HTC), not the SP5100.





I/O interrupt controller
SMBus 2.0 controller
Low Pin Count (LPC) interface to Super I/O, Trusted Platform Module (TPM), and SPI-VU
Serial Peripheral Interface (SPI) support for up to two devices
4 MB BIOS flash connected to the SP5100 using SPI interface
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8 BIOS
8.1 Overview
The PowerEdge R515 BIOS is based on the Dell BIOS core and supports the following features:



































AMD C32 processor support
Simultaneous Multi-Threading (SMT) support
PCI 2.3 compliant
Plug and Play 1.0a compliant
Multiprocessor (MP) 1.4 compliant
Bootable from hard drive, optical drive, iSCSI drive, USB key, and SD card
Power management support including DBS, power inventory, and multiple power profiles:
o Maximum performance
o OS control (DBS)
o Active Power Controller
o Custom
ACPI 2.0 support (S0, OS-S4, S5 states)
PXE and WOL support for on-board NICs
Memory-sparing support
SETUP access through <F2> key at end of POST
USB 2.0 (USB boot code is 1.1 compliant)
F1/F2 error logging in CMOS
Virtual KVM, CD, and floppy support
iDRAC supported
Unified Server Configurator (UEFI 2.1) and UEFI shell support
SMBIOS 2.5
PCI-to-PCI bridge 1.0 compliant
Dell Server Assistant 7.0 support
System Service support
Onboard PCI video BIOS support
SATA enabled for CDROM and HDD
PCI FW3.0 compliant
I2O v1.5 ready
Selectable boot support based on BIOS Boot Specification v1.01
El Torito CD-ROM Boot 1.0
Remote BIOS update support
Remote Configuration Interface (RCI) support
Console redirection via COM1
PXE support based on Preboot Execution Environment Specification v2.1
2-byte ID support
ePPID support in flash
Memory remapping support
AC recovery staggering power-up
DIMM mismatch checking
The PowerEdge R515 BIOS does not support the following:


BIOS language localization
BIOS recovery after bad flash
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8.2 Supported ACPI States
The following ACPI states are supported:


ACPI compliance: S0, S4, S5
NO S1, S2, S3 (STR)
State S4 is supported by the OS only.
8.3 Power Management Modes
8.3.1
Dell Active Power Controller
The Dell Active Power Controller (DAPC) is implemented in system BIOS and uses hardware level counters,
etc., to determine hardware utilization. The BIOS uses this information to determine when to change the
processor’s operating frequency. The DAPC is OS independent and means that the OS no longer has control.
This provides a consistent power management solution regardless of the installed OS. Some OS(s),
particularly hypervisors, do not support power management, thus DAPC provides a solution when there
otherwise would not be one.
8.3.2
Power Saving BIOS Setting (OS Control)
With the Power Saving BIOS setting, the OS monitors process/thread level utilization of the processor and
uses processor controls to change the processor’s operating frequency. For heavy workloads, the OS will run
the processor at higher frequencies for additional performance. Lighter workloads do not need high
performance, thus the OS will run the processor at lower frequencies.
8.3.3
Maximum Performance
The Maximum Performance mode disables power management. In this mode, the processor frequency is
statically set to the highest supported frequency.
The power management features are implemented via two categories: fixed or generic.
Fixed features use bits defined in the ACPI specification for specific capabilities. The fixed-feature bits give
the OS complete control over the power management of a device, since the location of the bits is given to
the OS in the FACP table. Thus, a driver can directly access bits to control a device’s power management.
Generic features have defined enable and status bits, but the functionality is not fully visible to the OS. Dell
provides ASL code to handle the details of generic features, allowing the OS to intelligently communicate
with system-specific hardware. Table 12 summarizes power management features, and Table 13 describes
the possible power profiles.
Table 12.
BIOS Power Management Features
Feature
Type
Enable/Status/
Ctrl bit
location
Description
ACPI Mode
Switch
Fixed
PCH
The OS uses the SCI_EN bit to switch from legacy mode to
ACPI mode.
Sleep States
Fixed
PCH
Supported states: S0 (Working), S4-OS (Hibernation in
Microsoft® Windows® 2000), and S5 (soft-off).
Not supported: S1 (standby or suspend) and S3.
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Feature
Type
Enable/Status/
Ctrl bit
location
Description
Power
Button
Fixed
PCH
In ACPI mode, OS has control of the power button. In nonACPI mode, SMI handler owns power button events.
Real-Time
Clock
Fixed
PCH
The OS is able to configure the system to wake on the RTC
alarm.
Power Mgmt.
Timer
Fixed
PCH
24-bit power management timer is used.
Power Mgmt.
Event (PME)
Generic
PCH
Each host bus’s PME# signal is routed to a separate generalpurpose event pin in the chipset. When a device signals PME#,
the system wakes (if necessary), the OS detects the event,
and a Dell-defined ASL routine handles the event. Wake-onLAN is one example of a PME.
USB Wake
Generic
N/A
This feature is not supported on this system since the S1 state
is not supported.
DBS
N/A
Processor MSRs
This feature does P state transition under Microsoft®
Windows®.
C State
Support
N/A
Processor and
PCH registers
This feature allows multiple C state supports for processor.
This feature will work under Windows and ACPI OS that
understand C states.
Power
Profile
Support
N/A
Processor/IMC
and PCH
chipset
registers
11G Servers are the most energy-smart servers that Dell
provides. In addition to P,C, and T states, BIOS exposes the
power profiles to the OS. Each power profile has specific
settings that fine tune processor, MCH, IOH, and Southbridge.
Table 13.
BIOS Power Management Profiles
Profile
Description
Maximum Performance
DBPM Disabled (BIOS sets P-State to MAX)
Memory frequency: Maximum Performance
Fan algorithm: Maximum Performance
OS Control
Enable OS DBPM Control (BIOS exposes
all possible P states to OS)
Memory frequency: Maximum Performance
Fan algorithm: Minimum Power
Active Power Controller
Enable Dell System DBPM (BIOS does not make
all P states available to OS)
Memory frequency: Maximum Performance
Fan algorithm: Minimum Power
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Profile
Description
Custom
CPU Power and Performance Management:
Maximum Performance, Minimum Power, OS
DBPM, System DBPM
Memory Power and Performance Management:
Maximum Performance, 1333MHz, 1067MHz,
800MHz, Minimum Power
Fan Algorithm: Maximum Performance, Minimum
Power
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9 Embedded NICs/LAN on Motherboard (LOM)
The Broadcom® 5716 LOM chip is located on the PowerEdge R515 motherboard. The 5716 chip is connected
to the IOH via a PCI Express x4 gen2 link. The chip provides two 1xGB Ethernet ports with two RJ-45
connectors on the back of the system. The firmware for the LOM chip resides in a flash part. The PowerEdge
R515 supports Wake-On-LAN (WOL) from either port.
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10 I/O Slots
10.1 Overview
The PowerEdge R515 includes a total of three PCIe slots and one dedicated internal storage card slot. Two
additional PCIe slots are available with the optional Riser 2. All slots are PCI Express Gen 2. See Table 14
and Table 14 for more information.
10.1.1 Riser 1 PCI Expansion Slots
Riser 1 includes three PCIe expansion slots and one dedicated slot for an internal storage card. See Table 14.
Table 14.
Riser 1 PCI Expansion Slots
PCI Slot #
Mechanical
Electrical
Height
Length
1
x8
x4
Full height
Half length
2
x8
x4
Full height
Full length
3
x8
x8
Full height
Half length
4
x8
x4
For dedicated storage controller
The PowerEdge R515 supports 80W maximum power for the sum total of the PCI cards on Riser 1. Hotplugging of PCIe cards is not supported.
10.1.2 Riser 2 (Optional) PCI Expansion Slots
The optional Riser 2 is dedicated for an external general-purpose graphics processing unit solution (GPGPU).
Riser 2 includes one PCIe expansion slot and one dedicated slot for an internal storage card. See Table 15.
Table 15.
Riser 2 (Optional) PCIe Expansion Slots
PCI Slot #
Mechanical
Electrical
Height
Length
1
x16
x16
Full height
Half length
2
x8
x4
For dedicated storage controller
The PowerEdge R515 supports 80W maximum power for the sum total of the PCI cards on Riser 2. Hotplugging of PCIe cards is not supported.
10.2 Boot Order
The boot order can be customized based on bootable devices detected by the BIOS.
10.3 NIC and LOM Enumeration
LOMs will enumerate first in order to have consistent Ethernet assignment (i.e., eth0). NIC enumeration
varies depending on configuration.
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10.4 PCI Card Dimensions
For information about PCIe slots and card dimensions, see the Back-Panel Features and Indicators section in
the About Your System chapter in the PowerEdge R515 Hardware Owner’s Manual on Support.Dell.com.
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11 Storage
11.1 Overview
There are two chassis types for the PowerEdge R515:


8 hard drive chassis: 8 x hot- plug 3.5‖ or 2.5‖ HDD (in HDD carrier); support for one slim optical disk
drive (ODD)
12 hard drive chassis: 12 x hot- plug 3.5‖ or 2.5‖ HDD (in HDD carrier) and 2 x internal cabled 2.5‖
HDD; no ODD support
Table 16.
Supported Hard Drives
Form Factor
Capacity
Speed
Type
3.5‖
160GB, 250GB, 500GB, 1TB, 2TB
7.2K
SATA
3.5‖
500GB, 1TB, 2TB
7.2K
NL SAS
3.5‖
146GB
15K
SAS 3Gb
3.5‖
300GB, 450GB, 600GB
15K
SAS 6Gb
2.5‖
146GB, 300GB, 600GB
10K
SAS
2.5‖
50GB
N/A
SSD
11.2 RAID Configurations
Table 17.
Raid Configurations (8 HDD Chassis)
No Mixed HDD
(must be all 2.5" or 3.5"
HDDs)
Factory Configuration
Type
SW RAID (Add-in
card)
No RAID (Add-in
card)
RAID (Add-in
card)
#
Name
Description
Min
HDD
Max
HDD
C1
ASSR5
RAID5 (PERC S300)
3
8
C2
ASSR10
RAID10 (PERC S300)
4
8
C3
ASS
No RAID (PERC H200)
1
8
C4
ASSR0
RAID0 (PERC H200, PERC H700)
2
8
C5
ASSR1
RAID1 (PERC PERC H200, PERC H700)
2
2
C6
ASSR10
RAID10 (PERC H200, PERC H700)
4
8
C7
ASSR5
RAID5 (PERC H700)
3
8
C8
ASSR6
RAID6 (PERC H700)
4
8
C9
ASSR1/R5
RAID1 + RAID5 (PERC H700)
2+
3
2+
6
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Mixed HDD (SAS + SATA) Factory Configuration
Type
Mix HDD (Add-in
card)
Mixed SAS + SATA
(must be all 3.5" HDDs)
(ex. Min 2 x SAS + 2 x SATA;
max 2 x SAS + 6 x SATA)
#
Name
Description
Min
HDD
Max
HDD
C10
ASS-X
No RAID (PERC H200)
2+
2
2+
6
C11
ASSR1/R5X
RAID1 + RAID5 (PERC H700)
3+
3
2+
6
Mixed HDD (SSD + SAS) Factory Configuration
Mixed SSD + SAS
(must be all 2.5" HDDs)
(ex. Min 2 x SSD + 2 x SAS;
max 2 x SSD + 6 x SAS)
Type
#
Name
Description
Min
HDD
Max
HDD
Mix HDD (Add-in
card)
C12
ASS-X
No RAID (PERC H200)
2+
2
2+
6
Table 18.
RAID Configurations (12 HDD Chassis)
No Mixed HDD
(must be all 2.5" or 3.5"
HDDs)
Factory Configuration
Type
#
Name
Description
Min
HDD
Max
HDD
No RAID
(Add-in
card)
C3
ASS
No RAID (PERC H200)
1
12
C4
ASSR0
RAID0 (PERC H200, PERC H700)
2
12
C6
ASSR10
RAID10 (PERC H200, PERC H700)
4
12
C7
ASSR5
RAID5 (PERC H700)
3
12
C8
ASSR6
RAID6 (PERC H700)
4
12
C9
ASSR1/R5
RAID1 + RAID5 (PERC H700)
2+3
2 + 10
RAID (Addin card)
Mixed HDD (SAS + SATA) Factory Configuration
Mixed SAS + SATA
(must be all 3.5" HDDs)
(ex. Min 2 x SAS + 2 x
SATA; max 2 x SAS + 6 x
SATA)
Type
#
Name
Description
Min
HDD
Max
HDD
Mix HDD
(Add-in
card)
C10
ASS-X
No RAID (PERC H200)
2+2
2 + 10
C11
ASSR1/R5X
RAID1 + RAID5 (PERC H700)
3+3
2 + 10
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Table 19.
RAID Configurations (12 HDD Chassis, 12 + 2 HDDs)
(12 + 2 HDD) Factory Configuration
No Mixed HDD
(Must be all
2.5" or 3.5"
HDDs)
Type
#
Name
Description
Min
HDD
Max
HDD
No RAID
(Add-in
card)
14
ASS/+iR1
No RAID (PERC H200)
1
12
2
15
ASSR0/+iR
1
RAID0 (PERC H200, PERC H700)
2
12
2
16
ASSR5/+iR
1
RAID5 (PERC H700)
3
12
2
17
ASSR6/+iR
1
RAID6 (PERC H700)
4
12
2
18
ASSR1/R5
/+iR1
RAID1 + RAID5 (PERC H700)
2+3
2 + 10
2
19
ASSR5/R1
0/+iR1
RAID5 + RAID10 (PERC H700)
4+4
4+8
2
RAID (Addin card)
Internal
HDD
(2.5” SAS)
(must be
exactly 2
HDDs)
11.3 Persistent Storage
The PowerEdge R515 offers two types of persistent storage: unmanaged and managed. The following options
are available for persistent storage:


Unmanaged internal SD module
Managed iDRAC6 Express or Enterprise (optional)
11.4 Internal SD Module (Unmanaged Internal Persistent Storage)
The internal SD module Unmanaged Internal Persistent Storage (UIPS) consists of two ports:


One port on the control panel board for the USB key
One port on the internal SD module for the SD card
The UIPS is a feature which enables the following solutions:



USB license keys used for software application enablement
User custom-boot OS and pre-boot OS (Loaded into memory and then run; used for ease of
deployment, as well as in diskless environments, such as HPCC)
User custom logs/scratch pad (User-defined information, removable and portable after system is
down)
11.5 LED Indicators
Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED for
disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED is driven
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by the disk drive during normal operation. The bicolor LED is controlled by the SEP device on the backplane.
Both LEDs are used to indicate certain conditions under direction of a storage controller.
For more information, see the Hard-Drive Indicator Patterns section in the About Your System chapter in the
PowerEdge R515 Hardware Owner’s Manual on Support.Dell.com.
11.6 Optical Drives
The PowerEdge R515 supports one SATA interface, DVD-ROM or DVD+/-RW, in the 8 hard drive chassis. The
R515 with the 12 hard drive chassis does not support an optical drive.
11.7 Tape Drives
For more information on supported tape drives and tape libraries, see http://www.dell.com/storage.
11.8 External Storage Support
External storage devices are supported. For more information, see http://www.dell.com/storage.
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12 Video
The PowerEdge R515 is equipped with a Matrox® G200eW with 8MB memory integrated in the Nuvoton®
WPCM450 (BMC controller). The resolutions supported are listed in Table 20.
Table 20.
Graphics Video Modes
Resolution
Refresh Rate (Hz)
Color Depth
(bit)
640 x 480
60, 72, 75, 85
8, 16, 32
800 x 600
60, 72, 75, 85
8, 16, 32
1024 x 768
60, 72, 75, 85
8, 16, 32
1152 x 864
75
8, 16, 32
1280 x 1024
1
60
32
1280 x 1024
2
60, 75, 85
8, 16
1
32 bit color only supported at 60Hz for this resolution.
85Hz for KVM and 1600x1200 at 60Hz for video out.
2
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13 Rack Information
13.1 Overview
The ReadyRails™ sliding and static rail systems for the R515 provide toolless support for 4-post racks with
square or unthreaded round mounting holes including all generations of Dell racks. Both support tooled
mounting in 4-post threaded racks (an optional adapter brackets kit is required for the sliding rails), with
the static rails also providing tooled mounting support for 2-post (Telco) racks for added versatility. The
optional cable management arm (CMA) can be mounted on either the left or right side of the sliding rails
without the use of tools for fast and easy deployment.
Note: The PowerEdge R515 is not compatible with any other Dell rails including previous generation rails,
but it does use the same sliding and static rails as the R510.
13.2 Rails
The rail offerings for the R515 consist of two types: sliding rails and static rails.
13.2.1 Sliding Rails
The sliding rails allow the system to be fully extended out of the rack for service and are available with or
without the optional cable management arm (CMA). See Figure 16.
Figure 16. R515 Sliding Rails with Optional CMA
Sliding rail kits can be used in a threaded hole rack only if threaded rack adapter brackets are installed. The
threaded rack adapter brackets are first mounted to the EIA flanges in the rack, and then the sliding rails
are mounted into the brackets. The design of the brackets has been optimized to limit the forward shift of
the system in the rack to only 17.3 mm.
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The adapter brackets kit includes 6 brackets to accommodate different rail lengths, plus four sets of custom
screws in common thread sizes. See Figure 17. A detailed Getting Started Guide is included in the kit along
with directions for installing the brackets and mounting the rails into the brackets.
Depending on the depth of the rack used, it may be necessary to remove the server’s bezel in order to close
the door of the rack. A minimum of 58 mm will be needed between the back surface of the door panel and
the front face of the EIA flange for the front door to close with the 11G server bezel installed.
Figure 17. 2U Threaded Rack Adapter Brackets Kit
13.2.2 Static Rails
The static rails support a wider variety of racks than the sliding rails but do not support serviceability in the
rack and are thus not compatible with the CMA. See Figure 18.
Figure 18. R515 Static Rails
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One key factor in selecting the proper rails is identifying the type of rack in which they will be installed.
Both the sliding rails and the static rails support mounting in 19‖-wide, EIA-310-E compliant 4-post racks,
but only the static rails, as the more generic or universal solution, support mounting in 2-post (Telco) racks.
Table 21 provides a summary of the rack types supported by the R515 rails.
Table 21.
Supported Racks
Rack Types Supported
Product
R515
Rail
ID
Mounting
Interface
Rail
Type
4-Post
2-Post
Square
Round
Thread
Flush
Center
B3
ReadyRails
Sliding
√
√
√*
X
X
B4
ReadyRails/Generic
Static
√
√
√
√
√
*Requires the 2U Threaded Rack Adapter Brackets Kit (Dell PN PKCR1)
Screws are not included in the static rail kit due to the fact that threaded racks are offered with a variety of
thread designations. Users must provide their own screws when mounting the static rails in threaded or 2post racks.
Other key factors governing proper rail selection include the spacing between the front and rear mounting
flanges of the rack, the type and location of any equipment mounted in the back of the rack such as power
distribution units (PDUs), and the overall depth of the rack. See Table 22. Due to their reduced complexity
and lack of need for CMA support, the static rails offer a greater adjustability range and an overall smaller
footprint than the sliding rails.
Table 22.
Rail Adjustability Ranges and Depth
Rail Adjustability Range (mm)
Product
R515
Rail
ID
Mounting
Interface
Rail
Type
Rail Depth (mm)
Square
Round
Threaded
Min
Max
Min
Max
Min
Max
without
CMA
with
CMA
B3
ReadyRails
Sliding
686
883
672
876
651
897
714
845
B4
ReadyRails/
Generic
Static
608
879
594
872
604
890
622
N/A
The adjustment range of the rails is a function of the type of rack in which they are being mounted. The min
and max values listed above represent the allowable distance between the front and rear mounting flanges
in the rack. Rail depth represents the minimum depth of the rail as measured from the rack front mounting
flanges when the rail rear bracket is positioned all the way forward.
13.3 Cable Management Arm (CMA)
The optional cable management arm (CMA) for the R515 organizes and secures the cords and cables exiting
the back of the server and unfolds to allow the server to extend out of the rack without having to detach
the cables. Some key features of the R515 CMA include:



Large U-shaped baskets support dense cable loads.
An open-vent pattern allows optimal airflow.
The CMA mounting is fully-reversible (can be mounted on either side) with no conversion required.
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


Hook-and-loop straps are utilized (rather than plastic tie wraps) to eliminate the risk of cable
damage during cycling.
A low-profile fixed tray is included to support and retain the CMA in its fully-closed position.
The CMA and the tray can be mounted without the use of tools using simple and intuitive snap-in
designs.
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14 Operating Systems and Virtualization
For detailed information, see the following:
•
•
Operating System Support Matrix for Dell PowerEdge Systems on www.Dell.com.
Dell PowerEdge R515 Systems Getting Started With Your System guide on Support.Dell.com.
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15 Systems Management
15.1 Overview/Description
Dell aims on delivering open, flexible, and integrated solutions that help you reduce the complexity of
managing disparate IT assets by building comprehensive IT management solutions. Combining Dell
PowerEdge Servers with a wide selection of Dell-developed management solutions gives you choice and
flexibility, so you can simplify and save in environments of any size. To help you meet your server
performance demands, Dell offers Dell OpenManage™ systems management solutions for:
•
•
•
Deployment of one or many servers from a single console
Monitoring of server and storage health and maintenance
Update of system, operating system, and application software
Dell offers IT management solutions for organizations of all sizes—priced, sized, and supported right.
15.2 Server Management
A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are included with
the product. ISO images are also available. A brief description of available content:
•
•
•
•
•
•
•
•
Dell Systems Build and Update Utility: Dell Systems Build and Update Utility assists in OS install and
pre-OS hardware configuration and updates.
OpenManage Server Administrator: The OpenManage Server Administrator (OMSA) tool provides a
comprehensive, one-to-one systems management solution, designed for system administrators to
manage systems locally and remotely on a network. OMSA allows system administrators to focus on
managing their entire network by providing comprehensive one-to-one systems management.
Management Console: Our legacy IT Assistant console is also included, as well as tools to allow access
to our remote management products. These tools are Remote Access Service, for iDRAC, and the BMC
Management Utility.
Active Directory Snap-in Utility: The Active Directory Snap-in Utility provides an extension snap-in to
the Microsoft Active Directory. This allows you to manage Dell specific Active Directory objects. The
Dell-specific schema class definitions and their installation are also included on the DVD.
Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the latest
Dell optimized drivers, utilities, and operating system-based diagnostics that you can use to update
your system.
eDocs: The section includes PDF files for PowerEdge systems, storage peripheral, and OpenManage
software.
Dell Management Console DVD: The Dell Management Console is a Web-based systems management
software that enables you to discover and inventory devices on your network. It also provides
advanced functions, such as health and performance monitoring of networked devices and patch
management capabilities for Dell systems.
Server Update Utility: In addition to the Systems Management Tools and Documentation and Dell
Management Console DVDs, customers have the option to obtain Server Update Utility DVD. This DVD
has an inventory tool for managing updates to firmware, BIOS and drivers for either Linux or Windows
varieties.
15.3 Embedded Server Management
The PowerEdge R515 implements circuitry for the next generation of Embedded Server Management. It is
Intelligent Platform Management Interface (IPMI) v2.0 compliant. The optional iDRAC (Integrated Dell
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Remote Access Controller) is responsible for acting as an interface between the host system and its
management software and the periphery devices. These periphery devices consist of the PSUs, the storage
backplane, integrated SAS HBA or PERC 6/I, and control panel with display.
The optional upgrade to iDRAC6 provides features for managing the server remotely or in data center lightsout environments. Advanced iDRAC features require the installation of the optional iDRAC6 Enterprise card.
15.4 Lifecycle Controller and Unified Server Configurator
Embedded management is comprised of several interdependent pieces:
•
•
•
•
Lifecycle Controller
Unified Server Configurator
iDRAC6
vFlash
Lifecycle controller powers the embedded management features. It is integrated and tamperproof storage
for system-management tools and enablement utilities (firmware, drivers, etc.). It is flash partitioned to
support multiple, future-use cases.
Dell Unified Server Configurator (USC) is a local 1:1 graphical user interface embedded on Lifecycle
Controller that aids in local server provisioning in a pre-OS environment. For servers with iDRAC Express, the
Lifecycle Controller offers OS install, platform updates, platform configuration, and diagnostics capabilities.
For servers without iDRAC Express, this utility has limited functionality and offers OS install and diagnostics
capabilities only.
To access the Unified Server Configurator, press the <F10> key within 10 seconds of the Dell logo’s
appearance during the system boot process. Table 23 details current functionality enabled by the USC.
Table 23.
Unified Server Configurator Features and Description
Feature
Description
Faster O/S Installation
Drivers and the installation utility are embedded on
system, so no need to scour Dell.com.
Faster System Updates
Integration with Dell support automatically directed
to latest versions of the Unified Server Configurator,
iDRAC, RAID, BIOS, NIC, and Power Supply.
Update Rollback
Ability to recover to previous ―known good state‖ for
all updatable components.
More Comprehensive Diagnostics
Diagnostic utilities are embedded on system.
Simplified Hardware Configuration
Detects RAID controller and allows user to configure
virtual disk and choose virtual disk as boot device,
eliminating the need to launch a separate utility. Also
provides configuration for iDRAC, BIOS, and NIC/LOM.
15.5 iDRAC Express
The optional iDRAC Express is the first tier of iDRAC6 upgrades. In addition to upgrading the system with a
Lifecycle Controller, the iDRAC6 Express offers the following key features:
•
•
Graphical web interface
Standard-based interfaces
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•
•
•
Server Sensor monitoring and fault alerting
Secure operation of remote access functions including authentication, authorization, and encryption
Power control and management with the ability to limit server power consumption and remotely
control server power states
• Advanced troubleshooting capabilities
For more information on iDRAC6 Express features see Table 24.
15.6 iDRAC6 Enterprise
The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6 Enterprise
connects directly to the R515 planar and is mounted parallel to the planar with stand-offs.
Key features for the iDRAC6 Enterprise include:
•
•
•
•
Scripting capability with Dell’s Racadm command-line
Remote video, keyboard, and mouse control with Virtual Console
Remote media access with Virtual Media
Dedicated network interface
Additionally, the iDRAC6 Enterprise can be upgraded by adding the vFlash Media card. This is a 1 GB Dell
branded SD card that enables a persistent 256 MB virtual flash partition. In the future, vFlash will be
expanded to include additional features.
A more detailed feature list for iDRAC6 Enterprise and vFlash is included in Table 24.
Table 24.
Feature
Features List for BMC, iDRAC, and vFlash
BMC
iDRAC6 Express
iDRAC6 Enterprise
vFlash Media
Interface and Standards Support



Web-based GUI



SNMP



WSMAN



SMASH-CLP





IPMI 2.0

Racadm command-line
Conductivity
Shared/Failover
Network Modes




IPv4




VLAN Tagging












IPv6
Dynamic DNS
Dedicated NIC

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Feature
BMC
iDRAC6 Express
iDRAC6 Enterprise
vFlash Media
Security and Authentication
Role-based Authority




Local Users




Active Directory



SSL Encryption



Remote Management and Remediation
Remote Firmware
Update




Server power control




Serial-over-LAN (with
proxy)




Serial-over-LAN (no
proxy)



Power capping



Last crash screen
capture



Boot capture



Serial-over-LAN



Virtual media


Virtual console


Virtual console sharing



Virtual flash
Monitoring
Sensor Monitoring and
Alerting




Real-time Power
Monitoring*




Real-time Power
Graphing*




Historical Power
Counters*













Logging Features
System Event Log
RAC Log
Trace Log
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16 USB Peripherals
The PowerEdge R515 supports the following USB devices:




USB key (bootable)
Keyboard (only one USB keyboard is supported)
Mouse (only one USB mouse is supported)
Optional USB DVD-ROM
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Appendix A.
Statement of Volatility
The Dell PowerEdge R515 contains both volatile and non-volatile (NV) components. Volatile components lose
their data immediately upon removal of power from the component. Non-volatile components continue to
retain their data even after the power has been removed from the component. Components chosen as userdefinable configuration options (those not soldered to the motherboard) are not included in the Statement
of Volatility. Configuration option information (pertinent to options such as microprocessors, system
memory, remote access controllers, and storage controllers) is available by component separately. The NV
components detailed in Table 25 are present in the PowerEdge R515 server.
Table 25.
R515 Volatility Table
Server BIOS Memory
Details
Size:
32Mbit
Type [e.g., Flash PROM, EEPROM]:
Flash EEPROM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g., boot code]
Boot Code and Configuration Information
How is data input to this memory?
Loading flash memory requires a vendor
provided firmware file and loader program
which is executed by booting up the system
from a floppy or OS based executable containing
the firmware file and the loader. System loaded
with arbitrary data in firmware memory would
not operate.
How is this memory write protected?
Software write protected
Server CMOS (Complementary Metal-Oxide
Semiconductor) Memory
Details
Size:
512 bytes
Type: [e.g., Flash PROM, EEPROM]:
Battery-backed NVRAM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g., boot code]
RTC and Configuration settings
How is data input to this memory?
F2 Setup Menu during POST
How is this memory write protected?
N/A
Remarks
Jumper on motherboard can be used to clear to
factory default settings
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LOM (LAN [Network Interface] on
Motherboard) Memory
Details
Size:
4Mb (1MB)
Type: [e.g., Flash PROM, EEPROM]:
Flash
Can user programs or operating system write
data to it during normal operation?
Yes, under software control.
Purpose? [e.g., boot code]
Contains LOM boot code and config data
How is data input to this memory?
Requires vendor provided firmware file and
loader program used during factory assembly or
possible field update. A system loaded with
arbitrary data in firmware memory would not
operate.
How is this memory write protected?
Software control
Server System FRU
Details
Size:
4KB
Type: [e.g., Flash PROM, EEPROM]:
SEEPROM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g., boot code]
Store System FRU
How is data input to this memory?
BMC controller write
How is this memory write protected?
Not write protected
Power Supply FRU
Details
Size:
256 bytes
Type: [e.g., Flash PROM, EEPROM]:
SEEPROM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g., boot code]
Store power supply information
How is data input to this memory?
Programmed by the power supply manufacturer
How is this memory write protected?
Not write protected
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TPM (Trusted Platform Module;
Details
For boards shipped outside of China; Boards
sold to destinations in China do not have TPM
at this time)
Size:
Unspecified size of user ROM, RAM, EEPROM;
128 bytes of OTP memory included
Type: [e.g., Flash PROM, EEPROM]:
ROM, RAM, EEPROM
Can user programs or operating system write
data to it during normal operation?
Yes, operating systems and applications that
conform to the TCG standard can write data to
the TPM during normal operation. Access to the
NV Storage is controlled by the TPM owner.
Purpose? [e.g., boot code]
Trusted Platform Module NV storage. May be
used to securely storage of encryption keys.
How is data input to this memory?
TCG TPM Specification defined command
interface or Using TPM Enabled operating
systems
How is this memory write protected?
As defined by the TCG TPM Specification,
protection of this NV memory area is
configurable by the TPM owner.
Backplane Firmware and FRU
Details
Size:
32KB
Type: [e.g., Flash PROM, EEPROM]:
Flash
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g., boot code]
Backplane Firmware and FRU data storage
How is data input to this memory?
Loading flash memory requires a vendor
provided firmware file and loader program
which is executed by booting up the system
from a floppy or OS based executable
containing the firmware file and the loader.
System loaded with arbitrary data in firmware
memory would not operate.
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Embedded Bootable Memory Device
Details
Size:
1GB
Type: [e.g., Flash PROM, EEPROM]:
MMC
Can user programs or operating system write
data to it during normal operation?
Yes
Purpose? [e.g., boot code]
Optional embedded boot device
How is data input to this memory?
Factory installed or via USB bus
How is this memory write protected?
Not write protected
Server BMC (Baseboard Management
Controller) Firmware Flash Memory
Details
Size:
16MB Flash
Type: [e.g., Flash PROM, EEPROM]:
SPI Flash
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g., boot code]
Stores the BMC Firmware
How is data input to this memory?
Loading flash memory requires a vendor
provided firmware file and loader program
which is executed by booting up the system
from a floppy or OS based executable
containing the firmware file and the loader.
System loaded with arbitrary data in firmware
memory would not operate.
How is this memory write protected?
Software write protected
To obtain optional component information, please refer to the Dell Statement of Volatility for the individual
components. Please direct any questions to your Dell Marketing contact.
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Appendix B.
Certifications
B.1 Regulatory Certifications
Regulatory models:


E12S (8 HDD chassis)
E13S (12 HDD chassis)
Regulatory types:


E12S002 (8 HDD chassis)
E13S002 (12 HDD chassis)
Regulatory compliance information can be located at the following sites:


Product Safety, EMC and Environmental Datasheets
Dell Regulatory Compliance Home Page
B.2 Product Safety Certifications
The product has been certified and bears the Mark, as applicable, of the Product Safety authorities as
indicated in Table 26.
Table 26.
Product Safety Certifications
Country/Region
Authority or Mark
Argentina
IRAM
Belarus
BELLIS
Canada
SCC
China
CNCA or CCC
Croatia
KONCAR
European Union
CE
Germany
TUV
IECEE
IECEE CB
Israel
SII
Kazakhstan
OTAN – CKT
Kenya
KEBS
Kuwait
KUCAS
Mexico
NYCE or NOM
Moldova
INSM
Nigeria
SONCAP
Norway
NEMKO
Russia
GOST
Saudi Arabia
KSA ICCP
South Africa
NRCS
Taiwan
BSMI
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Country/Region
Authority or Mark
Ukraine
UKRTEST or
UKRSERTCOMPUTER
United States
NRTL
Uzbekistan
STZ
B.3 Electromagnetic Compatibility
The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated in
Table 27.
Table 27.
Electromagnetic Compatibility Certifications
Country/Region
Authority or Mark
Australia/New Zealand
ACMA or C-Tick
Class
Class A
Belarus
BELLIS
Class A
Bosnia & Herzegovina,
Montenegro, Serbia
KVALITET
Class A
Canada
ICES
Class A
China
CNCA or CCC
Class A
Croatia
KONCAR
Class A
European Union
CE
Class A
Israel
SII
Class A
Japan
VCCI
Class A
Kazakhstan
OTAN – CKT
Class A
Moldova
INSM
Class A
Norway
NEMKO
Class A
Russia
GOST
Class A
South Africa
SABS
Class A
South Korea
KCC
Class A
Taiwan
BSMI
Class A
Ukraine
UKRTEST or UKRSERTCOMPUTER
Class A
United States
FCC
Class A
Uzbekistan
STZ
Class A
Vietnam
ICT
Class A
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B.4 Ergonomics, Acoustics and Hygienics
The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics, and
Hygienics authorities as indicated in Table 28.
Table 28.
Ergonomics, Acoustics and Hygienics
Country/Region
Authority or Mark
Belarus
BELLIS
Germany
GS
Russia
GOST
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Appendix C.
Additional Information and Options
The PowerEdge R515 system conforms to the industry standards detailed in Table 29.
Table 29.
Industry Standards
Standard
URL for information and specifications
ACPI
Advance Configuration and
Power Interface Specification,
v2.0c
http://www.acpi.info/
Energy Star
EPA Version 1.0 of the
Computer Server specification
http://www.energystar.gov/index.cfm?c=archives.enterprise
_servers
Ethernet
IEEE 802.3-2005
http://standards.ieee.org/getieee802/802.3.html
IPMI
Intelligent Platform
Management Interface, v2.0
http://www.intel.com/design/servers/ipmi/
DDR3 Memory
DDR3 SDRAM Specification,
Rev. 3A
http://www.jedec.org/download/search/JESD79-3A.pdf
LPC
Low Pin Count Interface
Specification, Rev. 1.1
http://developer.AMD.com/design/chipsets/industry/lpc.ht
m
PCI Express
PCI Express Base Specification
Rev. 2.0
http://www.pcisig.com/specifications/pciexpress/
PMBus
Power System Management
Protocol Specification, v1.1
http://pmbus.info/specs.html
SAS
Serial Attached SCSI, v1.1
http://www.t10.org/cgi-bin/ac.pl?t=f&f=sas1r10.pdf
SATA
Serial ATA Rev. 2.6;
SATA II, Extensions to SATA
1.0a, Rev. 1.2
http://sata-io.org/
SMBIOS
System Management BIOS
Reference Specification, v2.6
http://www.dmtf.org/standards/smbios/
TPM
Trusted Platform Module
Specification, v1.2
http://www.trustedcomputinggroup.org/resources/tpm_mai
n_specification
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Standard
URL for information and specifications
UEFI
Unified Extensible Firmware
Interface Specification, v2.1
http://www.uefi.org/specs/
USB
Universal Serial Bus
Specification, Rev. 2.0
http://www.usb.org/developers/docs/
Windows Logo
Windows Logo Program
System and Device
Requirements, v3.10
http://www.microsoft.com/whdc/winlogo/hwrequirements.
mspx
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