Citizen CBM-202 Series User`s manual

USER’S MANUAL
Model : CBM-202PC Series
Control LSI for Citizen Thermal Printer Mechanism
Rev. 1.0, November 1st, 1996
Rev. 1.1, February 2nd, 1997
Japan CBM Corporation
Information Systems Div.
CBM-202PC User’s Manual
NOTICE
1. Description in this manual are subject to changes without prior notification.
2. Upon finding of any inappropriateness, error, or omission concerning contents of this manual,
please contact us at any time.
3. Notwithstanding the above Item 2, we will not be responsible for the influences of employment of this
manual.
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CONTENTS
1.OUTLINE ................................................................................................................................................................5
1.1 MODEL CLASSIFICATIONS.....................................................................................................................5
2. GENERAL SPECIFICATIONS .............................................................................................................................5
2.1 OUTER APPEARANCE..............................................................................................................................5
2.2 STRUCTURE ...............................................................................................................................................5
2.3 DATA TRANSFER SYSTEM .....................................................................................................................5
2.4 PRINT FUNCTION......................................................................................................................................6
2.5 OPERATING VOLTAGE AND CURRENT CONSUMPTION .................................................................6
2.6 OPERATING FREQUENCY.......................................................................................................................6
3. HARDWARE SPECIFICATIONS.........................................................................................................................7
3.1 ABSOLUTE MAXIMUM RATINGS..........................................................................................................7
3.2 ELECTRICAL CHARACTERISTICS .........................................................................................................7
3.3 TERMINAL PIN CONFIGURATION.........................................................................................................8
3.4 RESET CIRCUIT .......................................................................................................................................13
3.5 OSCILLATION CIRCUIT .........................................................................................................................14
3.6 HEAD-UP DETECTION CIRCUIT...........................................................................................................15
3.7 HEAD DETECTION CIRCUIT.................................................................................................................16
3.8 PAPER END DETECTION CIRCUIT.......................................................................................................17
3.9 MOTOR CONTROL CIRCUIT .................................................................................................................18
3.10 AUTO CUTTER CONTROL CIRCUIT ..................................................................................................19
3.11 PARALLEL INTERFACE CIRCUIT.......................................................................................................20
3.12 SERIAL INTERFACE CIRCUIT.............................................................................................................22
3.13 SWITCH CIRCUIT ..................................................................................................................................24
3.14 ERROR OUTPUT CIRCUIT....................................................................................................................25
3.15 FUNCTION SELECTION CIRCUIT.......................................................................................................26
3.16 EXTERNAL RAM INTERFACE ............................................................................................................29
4. OPERATING TIMING ........................................................................................................................................32
5. PACKAGE SPECIFICATIONS ...........................................................................................................................33
6. SPECIAL REMARKS FOR MOUNTING...........................................................................................................34
6.1 CAUTIONS ................................................................................................................................................34
6.2 REFLOW MOUNTING .............................................................................................................................34
6.3 RECOMMENDED CONDITIONS FOR VARIOUS MOUNTING METHODS .....................................34
6.4 CLEANING METHOD..............................................................................................................................36
6.5 STORAGE METHOD................................................................................................................................36
7. COMMAND LIST................................................................................................................................................37
8. CHARACTER CODE TABLE.............................................................................................................................39
8.1 INTERNATIONAL....................................................................................................................................39
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8.2 INTERNATIONAL CHARACTER CODE TABLE..................................................................................40
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CBM-202PC User’s Manual
1.OUTLINE
This LSI, through use of the Japan CBM Corp. gate array, serves to control CITIZEN line thermal
printer, being featured by the following:
(1)
(2)
(3)
(4)
(5)
High print quality due to a detector which detects temperature to adjust print density automatically.
Both parallel and serial interfaces are available.
Print density can be freely selected with the function selection terminal.
Bar-code printing is available.
Prints such as double width, double high and bit image printing are available by various commands.
1.1 MODEL CLASSIFICATIONS
LSI (Chip) Model name
Applied Printer Mechanism
CBM-202PC-01
LT-380
CBM-202PC-02
LT-381
CBM-202PC-03
LT-282/283
2. GENERAL SPECIFICATIONS
2.1 OUTER APPEARANCE
100-pin flat package
2.2 STRUCTURE
C-MOS LSI
2.3 DATA TRANSFER SYSTEM
Parallel transfer or serial transfer (Selectable by User)
(1) 8-bit parallel transfer
(Conforms to Centronics.)
(2) Asynchronous type serial transfer (Selectable by User)
1200, 2400, 4800, 9600, 19200 bps
Parity : odd, even, none
7 bits, 8 bits
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2.4 PRINT FUNCTION
(1) No. of Print Columns and Print Speed
Machine Type
Total No of
Dots
448
Character Size (mm)
Print Speed (m/s)
LT-282
No of
Digits
37
1.25×3.00 (Font A)
50
LT-283
34
416
0.88×2.13 (Font B)
50
LT-380
48
576
50
LT-381
48
576
50
2.5 OPERATING VOLTAGE AND CURRENT CONSUMPTION
Voltage
: DC 5V± 5%
Current consumption : Max. 80mA
2.6 OPERATING FREQUENCY
16MHz
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3. HARDWARE SPECIFICATIONS
3.1 ABSOLUTE MAXIMUM RATINGS
ITEM
SYMBOL
RATINGS
Supply voltage
VCC
-0.3 to+7V
Input voltage
Vi
-03 to Vcc+0.3V
Reference supply voltage
VREF
-0.3 to AVcc+0.3V
Analog supply voltage
AVCC
-0.3 to+7V
Analog input voltage
VAN
-0.3 to AVcc+0.3V
Operating temperature
Topr
-20 to+75℃
Storage temperature
Tstg
-55 to+125℃
3.2 ELECTRICAL CHARACTERISTICS
ITEM
SYMBOL
RES, STBY, NMI
Input
"HIGH"
level
MDO, MD1, MD2
EXTAL
VIH
MIN
MAX
UNIT
Vcc−0.7
Vcc+0.3
V
Vcc×0.7
Vcc+0.3
V
THEM
2.0
AVcc+0.3
V
Others
2.0
Vcc+0.3
V
CONDITION
Input
"LOW"
level
Total input
terminal
VIL
−0.3
0.5
V
Output
"HIGH"
level
Total output
terminal
VOH
3.5
−
V
IOH=−1 mA
−
0.4
V
IOL=2.6 mA
−
1.0
V
IOL=10 mA
0.4
V
IOL=1.6 mA
Output
"LOW"
level
RESO
LEDER, LEDPE
VOL
Others
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3.3 TERMINAL PIN CONFIGURATION
PIN NO.
SIGNAL NAME
I/O
FUNCTION
LOGIC
1
VCC
−
2
LFSW
I
LF switch input
LOW
3
LEDER
O
Error LED output
LOW
4
LEDPE
O
Paper end LED output
LOW
5
NC
−
NC
−
6
NC
−
NC
−
7
NC
−
NC
−
8
DRQ
9
NC
−
NC
10
RESO
O
Watchdog output
11
VSS
−
GND
12
DTR
O
Serial DTR (RS-232C)
HIGH
13
TXD
O
Serial TXD (RS-232C)
HIGH
14
DI
I
Print head output data
HIGH
15
RXD
I
Serial RXD (RS-232C)
HIGH
16
CP
I
Print head clock
HIGH
17
NC
−
18
CTSW
19
NC
−
NC
−
20
NC
−
NC
−
21
NU
−
RESERVED
−
22
VSS
−
GND
−
23
MOTORA
O
Motor A
−
24
MOTORB
O
Motor B
−
25
MOTORA
O
Motor A
−
I
I
−
VCC
DMA request
LOW
−
LOW
−
−
NC
Cutter switch input
LOW
I = Input, O = Output, I/O = Input/Output
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PIN NO.
SIGNAL NAME
I/O
FUNCTION
LOGIC
−
26
Motor B
O
Motor B
27
D0
I/O
D0
HIGH
28
D1
I/O
D1
HIGH
29
D2
I/O
D2
HIGH
30
D3
I/O
D3
HIGH
31
D4
I/O
D4
HIGH
32
D5
I/O
D5
HIGH
33
D6
I/O
D6
HIGH
34
D7
I/O
D7
HIGH
35
VCC
−
VCC
36
A0
O
A0
HIGH
37
A1
O
A1
HIGH
38
A2
O
A2
HIGH
39
A3
O
A3
HIGH
40
A4
O
A4
HIGH
41
A5
O
A5
HIGH
42
A6
O
A6
HIGH
43
A7
O
A7
HIGH
44
VSS
−
GND
45
A8
O
A8
HIGH
46
A9
O
A9
HIGH
47
A10
O
A10
HIGH
48
A11
O
A11
HIGH
49
A12
O
A12
HIGH
50
A13
O
A13
HIGH
−
−
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PIN NO.
SIGNAL NAME
I/O
FUNCTION
LOGIC
51
A14
O
A14
HIGH
52
A15
O
NC
−
53
A16
O
NC
−
54
A17
O
NC
−
55
A18
O
NC
−
56
A19
O
NC
−
57
VSS
−
GND
−
58
P60
O
NC
−
59
P61
O
NC
−
60
P62
O
NC
−
61
φ
O
Clock output
HIGH
62
STBY
I
(Pull up in VCC with 10KΩ.)
LOW
63
RES
I
Reset input
LOW
64
NMI
I
(Pull up in VCC with 10K Ω.)
LOW
65
VSS
−
GND
−
66
EXTAL
−
EXTAL (16 MHz)
−
67
XTAL
−
XTAL (16 MHz)
−
68
VCC
−
VCC
−
69
P63
O
NC
−
70
RD
O
RD
LOW
71
HRW
O
HRW
LOW
72
P66
O
NC
73
MD0
I
( Pull up in VCC with 10KΩ.)
HIGH
74
MD1
I
(Pull down in GND with 10KΩ.)
LOW
75
MD2
I
(Pull up in VCC with 10K Ω.)
HIGH
−
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PIN NO.
SIGNAL NAME
I/O
FUNCTION
LOGIC
76
AVCC
−
VCC
−
77
VREF
−
VCC
−
78
THERM
I
Head temperature detection terminal
−
79
NC
I
(Pull down in GND with 10K Ω.)
−
80
NC
I
(Pull down in GND with 10K Ω.)
−
81
NC
I
(Pull down in GND with 10K Ω.)
−
82
NC
I
(Pull down in GND with 10K Ω.)
−
83
NC
I
(Pull down in GND with 10K Ω.)
−
84
NC
I
(Pull down in GND with 10K Ω.)
−
85
NC
I
(Pull down in GND with 10K Ω.)
−
86
AVSS
GND
−
87
STB
I
Parallel data interrupt
LOW
88
HEADUP
I
Headup detection terminal
LOW
89
CS2
O
Gate array chip selection
LOW
90
CS1
O
RAM chip selection
LOW
91
CS0
O
(Kanji ROM chip selection.
Only for Japanese use.)
LOW
92
VSS
−
GND
−
93
NC
O
NC
−
94
STRB1
O
Head Strobe 1
LOW
95
STRB2
O
Head Strobe 2
LOW
96
STRB3
O
Head Strobe 3
LOW
97
INH
O
Motor control
LOW
98
LATCH
O
Head latch signal
LOW
99
PAPER
I
Paper end input
HIGH
DSR
I
Serial DSR (RS-232C)
HIGH
100
−
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Pin Arrangement and Functions of Gate Array(CBM-202LA)
PIN NO.
SIGNAL NAME
I/O
FUNCTION
LOGIC
44
D7
I
Parallel input data D7
HIGH
45
D6
I
Parallel input data D6
HIGH
46
D5
I
Parallel input data D5
HIGH
47
D4
I
Parallel input data D4
HIGH
48
D3
I
Parallel input data D3
HIGH
49
D2
I
Parallel input data D2
HIGH
50
D1
I
Parallel input data D1
HIGH
51
D0
I
Parallel input data D0
HIGH
52
STROBE
I
Parallel STROBE
LOW
55
BUSY
O
Parallel BUSY
HIGH
58
PAO7
O
NC
−
59
ACK
O
Parallel ACK
−
61
PE
O
Parallel paper end
HIGH
62
FAULT
O
Parallel FAULT
LOW
63
CUTTERX
O
Cutter X
−
64
CUTTERY
O
Cutter Y
−
65
PAO1
O
NC
−
67
PAO0
O
NC
−
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3.4 RESET CIRCUIT
With RES terminal set to "Low", reset state is created.
In order to assure resetting, it is necessary to hold "Low" for min. 20ms on supply of power and
for min. 625ns while in operation.
When external reset is not used, those parts inside the broken lines are not required.
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3.5 OSCILLATION CIRCUIT
A clock oscillator, being installed, generates a system clock and an internal clock. Two clock supplying
methods are available including one to connect a ceramic oscillator and the other to input an external clock.
When using a ceramic oscillator, you are recommended to use CSTCS16.00MX0C3 (with a condenser)
manufactured by Murata Mfg. Co.. For input of an external clock, two methods are available,
one of which is to open XTAL terminal and the other of which is to input an antiphase clock in
XTAL terminal.
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3.6 HEAD-UP DETECTION CIRCUIT
Up/down state of the head is detected so that no power is supplied in head-up state, with the head-up sensor
installed in the printer. With head UP, it becomes "OPEN". With head DOWN, it becomes "CLOSE".
In head UP state, CPU's HEADUP (Pin 88) gets "HIGH", where printing is immediately stopped with error
output if it is while in print operation. Printing is resumed when it becomes head DOWN.
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3.7 HEAD DETECTION CIRCUIT
VP is controlled so as to prevent the head from electrolytic etching.
When turning ON the VP, set 11VC (Pin 4) of the gate array (CBM-202LA)to "HIGH".
When turning it OFF, set the HVC to "LOW".
It is also provided with a temperature detection circuit which serves to prevent print quality from being
deteriorated or destroyed by temperature. This function, through use of a thermistor installed in the printer,
detects temperature based on which energy applied to the head is determined. Further, when head
temperature has exceeded 60℃, printing is stopped so that the head is protected from being destroyed.
For protection of CPU runaway, make connection so that the gate array is reset by output of the CPU
watchdog timer. The CPU itself has been set to which resetting can work. Further, to prevent the head
strobe from being turned ON at that time, place a pull-up resistance in STRB1 to STRB3 each by one.
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3.8 PAPER END DETECTION CIRCUIT
Existence of printing paper is detected by the paper sensor which is installed in the paper
not to supply power when paper runs our.
Without printing paper, CPU PAPER (Pin 99) gets "HIGH". When this takes place while in printing
operation, the operation stops at the end of the line, sending an error output. Printing is automatically
resumed when paper is supplied.
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3.9 MOTOR CONTROL CIRCUIT
Except while in paper feed, the motor is held unexcited by CPU INH (Pin 97) so that heating of the motor is
prevented. While INH is held in "HIGH", the motor is maintained unexcited.
On supply of power, 4 dot lines of line feed is performed to meet the motor phase.
Avoid continuous printing over 15 min.
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3.10
AUTO CUTTER CONTROL CIRCUIT
This CPU, by using the gate array (CBM-202LA), has auto cutter control function.
When an auto cutter is not used, set DS1-1 to OFF. When DS1-1 is ON, alarm state is created where
normal operation is interrupted.
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3.11 PARALLEL INTERFACE CIRCUIT
This circuit performs 8-bit parallel interface by mainly using the gate array ports. When the parallel
interface is not used, pull up STB (Pin 52) of the gate array (CBM-202LA) through use of 10KΩ
resistance. Also, either connect CPU's STB (Pin 87) to INTR (Pin 56) of the gate array or pull it up with
10K Ω resistance.
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Gate Array Signal Names and Functions
SIGNAL NAME
PIN NO.
I/O
FUNCTION
STROBE
52
Input
The signal to read data (negative logic)
D0
51
D1
50
D2
49
D3
48
D4
47
Input
Input data (positive logic)
D5
46
D6
45
D7
44
ACK
59
Output
Signal to indicate that data have been read.
(negative logic)
BUSY
55
Output
Signal to indicate that data receiving is possible.
(positive logic) Send data while it is in
"LOW".
PE
61
Output
Signal which is output when printing paper
runs out . (positive logic)
FAULT
62
Output
Signal to indicate a printer error (negative
logic)
GND
Timing Chart
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3.12 SERIAL INTERFACE CIRCUIT
Serial interface applies asynchronous serial system.
When not using serial interface, pull up, CPU's RXD (Pin 15) and DSR (Pin 100) with
10K Ω resistance.
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Signal Names and Functions
SIGNAL NAME
TXD
PIN NO.
13
I/O
FUNCTION
Output
Transmits status.
When data receiving is not available while in
XON/XOFF, XOFF (13H) is transmitted.
When receiving is made possible, XON (11H) is
transmitted.
RXD
15
Input
Receiving data signal.
On occurrence of a framing error or parity error, the
data are printed in "?".
With this signal held in "LOW" when data are
DSR
DTR
100
12
Input
Output
transmitted from CPU while DTR/DSR has been
selected, transmitting takes place. With this signal
held in "HIGH", transmitting is does not take place
until it gets "LOW".
Transmits data while this signal is held in "LOW".
If writing takes place while in "HIGH", overrun error
is created, where data are ignored.
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3.13 SWITCH CIRCUIT
This circuit is provided with switch input function for printer paper feeding.
Also, a function for self printing is equipped through use of this switch. (Either supply power as pushing
this switch or apply resetting in power supplied state as pushing this switch. Self printing starts
automatically and, on completion of printing, normal standby state is recovered.)
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3.14 ERROR OUTPUT CIRCUIT
Two kinds of error output are held for output of various errors. (Max. 10mA current can be taken for
display with mainly LED, etc.. When this level is exceeded, however, CPU may be destroyed. Pay
attention, therefore, to select an appropriate current control resistance, LED, etc..)
CPU's LEDPE (Pin 4) is exclusively for output of paper error. When printing paper has got scarce,
"LOW" is output automatically. When paper is supplied, it becomes "HIGH".
CPU's LEDER (Pin 3) output various other errors in the following patterns:
ERROR
DISPLAY PATTERN
RECOVERY
Head UP
Head DOWN
Memory check
Not available
Head overheat
Head temperature lowered
Macro execution standby
LF switch
Cutter motor lock
Paper jamming cancelled
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3.15 FUNCTION SELECTION CIRCUIT
The gate array input ports have terminals for function selection. To connect a DIP switch, etc., do it as it
is. When fixing with a jumper, etc., connect to GND only for those to be set to "LOW".
GATE ARRAY
FUNCTION
“LOW”
“HIGH”
PAI0
Auto cutter
Equipped
None
32
PAI1
CR Selection
LF
Ignored
31
PAI2
Print density
30
PAI3
DTR/XON-XOFF
29
PAI4
28
PAI5
27
PAI6
26
PAI7
PIN NO.
SIGNAL NAME
33
See Table③
XON-XOFF
DTR/DSR
See Table①
Interface
PAI 3 is valid only when serial interface is used.
GATE ARRAY
FUNCTION
“LOW”
“HIGH”
PIN NO.
SIGNAL NAME
43
PBI0
42
PBI1
39
PBI2
38
PBI3
Auto loading
Valid
37
PBI4
Input buffer
4K bytes
36
PBI5
Print density
35
PBI6
Bit length
8 bits
7 bits
34
PBI7
Type of printer mechanism
LT-282
LT-283
Selection of international
character
See Table②
Invalid
72 bytes
See Table③
PBI6 is valid only when serial interface is used.
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①Interface
INPUT SYSTEM
PARITY
Parallel
−
None
Serial
Odd
Even
BAUD RATE
PAI7
PAI6
PAI5
PAI4
−
HIGH
HIGH
HIGH
HIGH
1200
HIGH
HIGH
HIGH
LOW
2400
HIGH
HIGH
LOW
HIGH
4800
HIGH
HIGH
LOW
LOW
9600
HIGH
LOW
HIGH
HIGH
19200
HIGH
LOW
HIGH
LOW
1200
HIGH
LOW
LOW
HIGH
2400
HIGH
LOW
LOW
LOW
4800
LOW
HIGH
HIGH
HIGH
9600
LOW
HIGH
HIGH
LOW
19200
LOW
HIGH
LOW
HIGH
1200
LOW
HIGH
LOW
LOW
2400
LOW
LOW
HIGH
HIGH
4800
LOW
LOW
HIGH
LOW
9600
LOW
LOW
LOW
HIGH
19200
LOW
LOW
LOW
LOW
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②International Characters
International Characters
PBI2
PBI1
PBI0
Japan (JIS)
HIGH
HIGH
HIGH
Japan (Shift JIS)
HIGH
HIGH
LOW
Sweden
HIGH
LOW
HIGH
Denmark I
HIGH
LOW
LOW
U.K.
LOW
HIGH
HIGH
Germany
LOW
HIGH
LOW
France
LOW
LOW
HIGH
U.S.A.
LOW
LOW
LOW
PAI 2
PAI 1
Light
HIGH
HIGH
Standard
HIGH
LOW
Dark
LOW
HIGH
Darker
LOW
LOW
③Print Density
Print Density
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3.16 EXTERNAL RAM INTERFACE
An external SRAM of 32 K bytes is always necessary for printing.
connected, normal operation cannot be obtained.
When no external RAM is
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Bus Timing
VCC=5.0V±10%, AVCC=5.0V±10%, VF=4.5V∼AVCC,
VSS=AVSS=0V, φ2∼16MHz, TA=−20∼+75℃
ITEM
SYMBOL
MIN
MAX
500
Clock cycle time
tcyc
62.5
Clock pulse width "LOW" level time
tCL
20
−
Clock pulse width "HIGH" level time
tCH
20
−
Clock rise time
tCR
−
10
Clock breaking time
tCF
−
10
Address delay time
tAD
−
30
Address hold time
tAH
10
−
Address strobe delay time
tASD
−
30
Write strobe delay time
tWSD
−
30
Strobe delay time
tSD
−
30
Write data strobe pulse width 1
tWSW1
35
−
Write data strobe pulse width 2
tWSW2
65
−
Address setup time 1
tAS1
10
−
Address setup time 2
tAS2
40
−
Read data setup time
tRDS
20
−
Read data hold time
tRDH
0
−
Write data delay time
tWDD
−
60
Write data setup time 1
tWDS1
35
−
Write data setup time 2
tWDS2
5
−
Write data hold time
tWDH
20
−
Read data access time 1
tACC1
−
55
Read data access time 2
tACC2
−
115
Unit: ns
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CBM-202PC User’s Manual
4. OPERATING TIMING
Operating timing after resetting is canceled for this CPU is shown below:
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5. PACKAGE SPECIFICATIONS
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6. SPECIAL REMARKS FOR MOUNTING
6.1 CAUTIONS
As relative humidity gets low, static electricity tends to be charged. Although surface mount type
packages need to be stored in dry environments not to be affected by humidity, there is no worry for
charging as the packages in storage are not subject to friction. However, during handling and mounting to
substrates where friction and electric discharge are likely to take place, the relative humidity is
recommended to be 45 to 75% for prevention of electric charge.
6.2 REFLOW MOUNTING
The pattern on a PCB board has been formed to facilitate soldering with the package lead pins,
where a fixed amount of soldering paste is applied by screen process printing and the package is mounted.
The package is temporarily fixed by surface tension of soldering paste.
Then, with solder being reflowed, the package lead and the pattern on the base board are fitted by surface
tension of the reflowed solder.
Although the design value of the lead joint part pattern on a PCB board varies by soldering paste material,
reflow conditions, etc., the standard level is 1.1 to 1.3 times of the width of a lead pin subject to soldering.
6.3 RECOMMENDED CONDITIONS FOR VARIOUS MOUNTING METHODS
Mounting methods most commonly applied to surface mounting devices are the infrared rays reflow
method, the vapor phase reflow method, and the flow soldering method.
In all of these mounting methods, as the entire part of a package is heated, strong thermal stress is applied
to the package. For reliability assurance sake, therefore, not only temperature of the solder joint part but
also temperature of the package surface need to be controlled. As the recommended mounting conditions,
use package surface temperature for the reflow method and solder temperature as well as dipping time
for the flow soldering method.
The basic understanding of the recommended conditions is explained in Fig. 6.1:
Fig. 6.1
Thermal
gradient 2
Package
surface
temperature
Peak temperature
and time
Preparatory
heating
Thermal gradient 1
Time
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1) Thermal Gradient 1
On a sudden temperature increase, unevenness in temperature is produced among package parts of
a surface mounting device, where difference in thermal expansion coefficients of materials can
cause a warp in the package, resulting in damaged chips. Attention, therefore, should be paid to the
upper limit for the increase speed. The lower limit is based on operation efficiency of the reflow
device.
2) Preparatory Heating
The parts and base boards are prepared at a temperature below the solder melting temperature so that
solder jointing is stabilized and thermal shock is lessened. In general, the temperature is set to a level
close to the rated temperature of the surface mounting device.
3) Thermal Gradient 2
The upper limit of increase temperature, as in 1), is determined based on necessity to maintain the
peak temperature and time within the specific range.
4) Peak Temperature and Time
The greatest care must be taken to minimize damage of a package. As a peak temperature directly
influences to reduce package strength and steam pressure inside a package, temperature should be held
low. Also, as steam pressure rises as time passes, set time as short as possible. Conditions shown
here indicate, not in mean values but in the maximum values, the points at which both the above
allowable region and the solder available region are satisfied. On setting conditions, therefore, be
careful not to exceed the upper limit values.
The recommended conditions for the various mounting methods are shown in Figs. 6.2 and 6.3:
Fig. 6.2 Recommended Conditions for Infrared Rays Reflow and Air Reflow
235℃ max
10 sec. max.
max
1 to 4℃ / sec.
140 to 160℃
Package
Surface
Temperature
max. 60 sec.
1 to 5℃ / sec.
Time
Fig. 6.3 Recommended Conditions for Vapor Phase Reflow
215℃ max
30 sec. max.
max
140 to 160℃
Package
Surface
Temperature
max. 60 sec.
1 to 5℃ / sec.
Time
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6.4 CLEANING METHOD
As flux residue from soldering adversely affects reliability of parts and base PCB, it should be normally
removed by cleaning.
Ultrasonic cleaning, for example, is performed in the following conditions, for which cares should be taken
to an applied frequency, electricity (especially, peak power), time and device resonance to prevent the
device from breakage:
Frequency
Ultrasonic output
Time
Others
..... 28 to 29KHz (Device should not resonate.)
..... 15W/1 (1 time)
..... 30 seconds and less
..... Neither a device nor a PCB board directly touches an oscillation
source.
6.5 STORAGE METHOD
Epoxy resin used in plastic packages, when stored in a humid place, cannot escape
from moisture absorption. Absorbed moisture content, as it gets high, can suddenly
vaporize on soldering implementation, causing peeling of resin/lead frame joint or even
causing a crack on a package. It is, therefore, important to store it in dry environment
(under normal temperature and humidity within 5 to 35 ℃and 45 to 75%RH) in dampproof
package. After opening the package, please keep it in the specified environments to avoid
development of moisture absorption and perform reflow implementation in the shortest
possible time. When restoring it in the dampproof package, place new silica gel.
To remove water content having been absorbed during transport, storage, and handling,
drying (at 125 ℃) for 16 to 24 hours is recommended to be performed.
Store external terminals as they are not yet subject to machining.
This is to prevent soldering failure from taking place on implementation caused by
produced rust, etc..
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7. COMMAND LIST
1
2
3
4
5
6
7
FUNCTION
CONTROL
CODE
HT
Horizontal tab command
CR
Print command
LF
Printing and paper feed
ESC SP Setting the right space amount of the character
!
Collective specifying printing mode
%
Specifying/canceling download character set
&
Defining download characters
CODE
09H
0DH
0DH
1BH 20H n
1BH21H n
1BH25Hn
1BH26H5nm
[ap1p2...p5xa]m-n+1
8
9
10
11
*
2
3
Specifying the bit image mode
Specifying/canceling underline
Specifying 1/6-inch line feed rate
Setting line feed rate of minimum pitch
1BH2Amn1n2[d]k
1BH2DH n
1BH32H
1BH33Hn
12
13
14
15
16
17
18
@
D
E
G
J
R
c3
Initializing the Printer
Setting horizontal tab position
Specifying/canceling highlighting
Specifying/canceling double printing
Printing and feeding paper n/203 inch
Selecting the international characters
NOP
1BH40H
1BH44H[n]k00H
1BH45Hn
1BH47Hn
1BH4An
1BH52Hn
1BH63H33Hn
19
20
21
22
23
24
25
26
27
28
29
30
c4
c5
d
p
t
v
u
{
V
$
¥
GS k
NOP
Enabling/disabling the panel switches
Printing and feeding the paper by n lines
NOP
Selecting the character code table
Transmitting the printer status (Serial type)
NOP
Specifying/canceling the inverted characters
Specifying/canceling
the
90 ° -
Specifying the absolute positions
Specifying the relative positions
Printing the bar code
1BH63H34Hn
1BH63H35Hn
1BH64Hn
1BH70Hmn1n2
1BH74Hn
1BH75Hn
1BH76H
1BH7BHn
right-turned 1BH56Hn
1BH24Hn1n2
1BH5Cn1n2
1DH6BHn[“d”]k00H
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31
32
33
34
35
36
37
38
39
40
41
42
w
h
H
f
*
/
:
^
ESC =
a
i
m
Selecting the horizontal size (scale factor) of bar code 1DH77n
Selecting the height of the bar code
Selecting of print position of HRI code
Selecting the font of HRI code
Defining the download bit image
Printing the download bit image
Starting/ending macro definition
Executing the macro
Data input control
Aligning the characters
Activating auto cutter (Full cut)
Activating auto cutter (Partial cut)
1DH68Hn
1DH48Hn
1DH66Hn
1DH2An1n2[d]n1xn2x
1DH2FHm
1DH3AH
1DH5En1n2n3
1BH3DHn
1BH61Hn
1BH69H
1BH6DH
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8. CHARACTER CODE TABLE
8.1 INTERNATIONAL
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8.2 INTERNATIONAL CHARACTER CODE TABLE
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