Galaxy Raid
Model GALHDX-7370S-8U4D
8 bay SCSI U320 to SATA-II RAID Subsystem
Galaxy Raid
Model GALHDX-7370S-8U4D
12 bay SCSI U320 to SATA-II RAID Subsystem
Installation and Hardware
Reference Manual
Version 060107
Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Contact Information
Americas
Rorke Data Inc
7626 Golden Triangle Drive
Eden Prairie, MN 55344
USA
Tel: +1-800 328 8147
Fax: +1-952 829 0988
sales@rorke.com
techsupport@rorke.com
http://www.rorke.com
ii
Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Copyright 2005
This Edition First Published 2005
All rights reserved. This publication may not be reproduced, transmitted, transcribed,
stored in a retrieval system, or translated into any language or computer language, in
any form or by any means, electronic, mechanical, magnetic, optical, chemical,
manual or otherwise, without the prior written consent of Rorke Data , Inc.
Disclaimer
Rorke Data makes no representations or warranties with respect to the contents
hereof and specifically disclaims any implied warranties of merchantability or fitness
for any particular purpose. Furthermore, Rorke Data reserves the right to revise this
publication and to make changes from time to time in the content hereof without obligation to notify any person of such revisions or changes. Product specifications are
also subject to change without prior notice.
Trademarks
Galaxy and the Galaxy logo are registered trademarks of Rorke Data , Inc.
PowerPC® is a trademark of International Business Machines Corporation and
Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or registered trademarks
of their respective owners.
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Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Warnings and Certifications
Restricted Access Location:
This equipment is intended to be installed in a RESTRICTED ACCESS
LOCATION only.
Electric Shock Warning!
To Prevent Electric Shock:
Access to this equipment is granted only to trained operators and service
personnel who have been instructed of and fully understand the possible
hazardous conditions and the consequences of accessing non-fieldserviceable units. For example, accessing the backplane may cause electric
shock.
FCC
(applies in the U.S. and Canada)
FCC Class A Radio Frequency Interference Statement
This device complies with Part 15 of the FCC rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device may accept any interference received, including interference that may
cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his
own expense.
Any changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
WARNING:
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Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
A shielded power cord is required in order to meet FCC emission limits and also to
prevent interference to nearby radio and television reception.
Use only shielded cables to connect I/O devices to this equipment. You are cautioned
that changes or modifications not expressly approved by the party responsible for
compliance could void your authority to operate the equipment.
This device is in conformity with the EMC.
CB
CCC
(Certified Worldwide)
This device meets the requirements of the CB
standard for electrical equipment with regard to
establishing a satisfactory level of safety for persons
using the device and for the area surrounding the
apparatus. This standard covers only safety aspects
of the above apparatus; it does not cover other
matters, such as style or performance.
for Power Supplies’ compatibility to China
Compulsory Certification.
ITE BSMI Class A, CNS 13438 (for Taiwan)
This device is in conformity with UL standards for safety.
RoHS 2002/96/EC compliant
WEEE Disposal of Old Electrical and Electronic Equipment
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Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Table of Contents
CONTACT INFORMATION ..................................................................................................................... II
WARNINGS AND CERTIFICATIONS ............................................... ERROR! BOOKMARK NOT DEFINED.
SAFETY PRECAUTIONS ....................................................................................................................... IX
Precautions and Instructions.............................................................................................................. ix
ESD Precautions................................................................................................................................ ix
ABOUT THIS MANUAL......................................................................................................................... X
WHO SHOULD READ THIS MANUAL? .................................................................................................. X
Related Documentation ...................................................................................................................... x
Conventions........................................................................................................................................ x
CHAPTER 1 INTRODUCTION ........................................................................... 1-1
1.1
PRODUCT OVERVIEW ........................................................................................................... 1-1
1.1.1 Introduction ......................................................................................................................... 1-1
1.1.2 Model Variations ................................................................................................................. 1-2
1.1.3 Enclosure Chassis ................................................................................................................ 1-2
1.1.3.1
1.1.3.2
1.1.3.3
1.1.3.4
1.1.3.5
1.1.3.6
1.2
1.2.1
1.2.2
1.2.3
Chassis Overview................................................................................................................... 1-2
Physical Dimensions .............................................................................................................. 1-4
Front Panel Overview............................................................................................................. 1-4
Hard Drive Numbering........................................................................................................... 1-5
Rear Panel Overview.............................................................................................................. 1-5
Backplane Board .................................................................................................................... 1-7
SUBSYSTEM COMPONENTS ................................................................................................... 1-7
LCD Panel ........................................................................................................................... 1-7
Drive Trays.......................................................................................................................... 1-8
The RAID Controller Module ............................................................................................. 1-8
Controller Module Interfaces................................................................................................................... 1-9
Host Ports............................................................................................................................... 1-9
Ethernet Port .......................................................................................................................... 1-9
COM Port............................................................................................................................. 1-10
DIMM Module ...................................................................................................................................... 1-10
1.2.4 Battery Backup Unit .......................................................................................................... 1-10
1.2.5 Power Supply Units ........................................................................................................... 1-11
1.2.6 Cooling Fan Modules ........................................................................................................ 1-12
Advanced Fault-Preventative Operation ................................................................................................ 1-12
1.3
1.3.1
1.3.2
1.3.3
1.3.4
1.4
1.4.1
1.4.2
1.4.3
SUBSYSTEM MONITORING .................................................................................................. 1-13
I2C Bus .............................................................................................................................. 1-13
LED Indicators .................................................................................................................. 1-13
Firmware and RAIDWatch GUI........................................................................................ 1-13
Audible Alarms.................................................................................................................. 1-14
HOT-SWAPPABLE COMPONENTS ........................................................................................ 1-14
Hot-Swap Capabilities ....................................................................................................... 1-14
Components....................................................................................................................... 1-14
Normalized Airflow........................................................................................................... 1-15
CHAPTER 2 HARDWARE INSTALLATION ................................................... 2-1
2.1
2.2
2.3
2.3.1
2.3.2
2.3.3
2.4
2.4.1
2.5
2.6
INTRODUCTION ..................................................................................................................... 2-1
INSTALLATION PREREQUISITES ............................................................................................ 2-1
SAFETY PRECAUTIONS ......................................................................................................... 2-2
Precautions and Instructions ................................................................................................ 2-2
Static-Free Installation......................................................................................................... 2-3
BBU Warnings and Precautions .......................................................................................... 2-3
GENERAL INSTALLATION PROCEDURE ................................................................................. 2-4
Installation Procedure Flowchart ......................................................................................... 2-5
UNPACKING THE SUBSYSTEM ............................................................................................... 2-6
INSTALLATION OVERVIEW ................................................................................................... 2-7
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Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
2.6.1
2.6.2
2.7
2.7.1
2.7.2
2.8
2.8.1
2.8.2
2.9
2.9.1
2.9.2
2.10
Pre-installed Components.................................................................................................... 2-7
Uninstalled Components...................................................................................................... 2-7
RACKMOUNTING .................................................................................................................. 2-7
Considerations for Installation Site and Chassis.................................................................. 2-7
Mounting Holes Positions.................................................................................................... 2-8
BBU INSTALLATION ............................................................................................................. 2-9
BBU Module Installation Overview .................................................................................... 2-9
Installation Procedure .......................................................................................................... 2-9
HARD DRIVE INSTALLATION .............................................................................................. 2-11
Hard Drive Installation Pre-requisites ............................................................................... 2-11
Drive Installation ............................................................................................................... 2-11
DRIVE TRAY INSTALLATION ............................................................................................... 2-12
CHAPTER 3 SYSTEM MONITORING .............................................................. 3-1
3.1
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.2.5
3.2.6
3.2.7
3.2.8
3.3
3.3.1
3.3.2
3.4
SUBSYSTEM MONITORING OVERVIEW.................................................................................. 3-1
STATUS-INDICATING LEDS .................................................................................................. 3-3
Brief Overview of the LEDs................................................................................................ 3-3
Controller Module LEDs ..................................................................................................... 3-3
Ethernet Port LEDs.............................................................................................................. 3-4
LCD Keypad Panel.............................................................................................................. 3-5
Drive Tray LEDs ................................................................................................................. 3-6
BBU Module LED............................................................................................................... 3-7
PSU LED ............................................................................................................................. 3-7
Cooling Fan Module LED ................................................................................................... 3-7
AUDIBLE ALARM .................................................................................................................. 3-8
Default Threshold Values .................................................................................................... 3-9
Failed Devices ..................................................................................................................... 3-9
I2C MONITORING ............................................................................................................... 3-10
CHAPTER 4 SYSTEM CONNECTION AND OPERATION ........................... 4-1
4.1
4.1.1
4.1.2
4.1.3
SCSI CONNECTION OVERVIEW ............................................................................................ 4-1
SCSI Cables......................................................................................................................... 4-1
SCSI Port on the Controller Rear Panel............................................................................... 4-1
SCSI Termination ................................................................................................................ 4-2
Using the LCD Keypad Panel.................................................................................................................. 4-4
Configuration over Hyper Terminal ........................................................................................................ 4-4
Via RAIDWatch GUI .............................................................................................................................. 4-5
4.2
4.2.1
4.2.2
4.3
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.4
HOST CONNECTION TOPOLOGY ............................................................................................ 4-6
Single Host .......................................................................................................................... 4-6
Dual Hosts ........................................................................................................................... 4-7
POWER ON ........................................................................................................................... 4-7
Power On Checklist ............................................................................................................. 4-7
Power On Sequence............................................................................................................. 4-8
Power On Procedure............................................................................................................ 4-8
Power On Status Check ....................................................................................................... 4-9
LCD Screen ....................................................................................................................... 4-10
POWER OFF PROCEDURE .................................................................................................... 4-11
CHAPTER 5 SYSTEM MAINTENANCE
5.1
5.1.1
5.1.2
5.2
5.2.1
5.2.2
5.2.3
5.2.4
5.3
5.3.1
5.3.2
OVERVIEW ........................................................................................................................... 5-1
About Subsystem Maintenance ........................................................................................... 5-1
General Notes on Component Replacement ........................................................................ 5-1
REPLACING CONTROLLER MODULE COMPONENTS .............................................................. 5-2
Overview ............................................................................................................................. 5-2
Notes on Controller Module Maintenance........................................................................... 5-3
Removing the Controller Module ........................................................................................ 5-3
Replacing the Controller Module ........................................................................................ 5-4
REPLACING OR UPGRADING MEMORY MODULES ................................................................. 5-5
Memory Module Installation Overview .............................................................................. 5-5
Selecting a Memory Module ............................................................................................... 5-5
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Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
5.3.3
5.4
5.5
5.5.1
5.5.2
5.6
5.6.1
5.6.2
5.7
5.7.1
5.7.2
DIMM Module Installation.................................................................................................. 5-6
REPLACING A FAULTY BBU................................................................................................. 5-8
REPLACING A FAILED PSU MODULE .................................................................................... 5-9
Notes on PSU Module Maintenance.................................................................................... 5-9
Replacing the PSU Module ................................................................................................. 5-9
REPLACING A FAILED COOLING FAN MODULE ................................................................... 5-12
Notes on Cooling Fan Module Maintenance ..................................................................... 5-12
Replacing a Cooling Fan Module ...................................................................................... 5-12
DRIVE TRAY MAINTENANCE .............................................................................................. 5-13
Notes on Hard Drive Maintenance .................................................................................... 5-13
Replacing a Failed Hard Drive .......................................................................................... 5-15
APPENDIX A SUBSYSTEM SPECIFICATIONS
A.1
TECHNICAL SPECIFICATIONS ............................................................................................... A-1
Vibration......................................................................................................................................... A-2
A.2
CONTROLLER SPECIFICATIONS ............................................................................................ A-3
A.2.1 Configuration........................................................................................................................ A-3
A.2.2 Architecture .......................................................................................................................... A-3
A.3
DRIVE TRAY SPECIFICATIONS ............................................................................................. A-4
A.4
POWER SUPPLY SPECIFICATIONS ......................................................................................... A-4
A.5
COOLING MODULE SPECIFICATIONS .................................................................................... A-4
A.6
RAID MANAGEMENT .......................................................................................................... A-5
A.7
FAULT TOLERANCE MANAGEMENT ..................................................................................... A-5
APPENDIX B SPARE PARTS AND ACCESSORIES
B.1
B.1.1
B.1.2
B.1.3
B.2
B.2.1
B.2.2
SPARE PARTS....................................................................................................................... B-1
Spare Parts Overview ......................................................................................................... B-1
Spare Parts List................................................................................................................... B-1
Controller Modules............................................................................................................. B-2
ACCESSORIES AND OPTIONAL ITEMS ................................................................................... B-3
Accessories Overview ........................................................................................................ B-3
Accessory Parts List ........................................................................................................... B-3
APPENDIX C PINOUTS
C.1.
C.2.
C.3.
C.4.
C.5.
SCSI PORT: VHDCI CONNECTOR PINOUTS ........................................................................ C-1
COM1 CABLE: DB9 AND AUDIO JACK PINOUTS ................................................................. C-2
GAL-9011 NULL MODEM ................................................................................................... C-3
ETHERNET PORT PINOUTS ................................................................................................... C-3
MAIN POWER ...................................................................................................................... C-3
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Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Safety Precautions
Precautions and Instructions
•
Prior to powering on the subsystem, ensure that the correct power range is being
used.
•
The Galaxy subsystems come with eight (8) or twelve (12) drive bays. Leaving
any of these drive bays empty will seriously affect the efficiency of the airflow
within the enclosure, and will consequently lead to the system overheating,
which can cause irreparable damage.
•
If a module fails, leave it in place until you have a replacement unit and you are
ready to replace it.
•
Airflow Consideration: The subsystem requires an airflow clearance, especially
at the front and the rear side.
•
Handle subsystem modules using the retention screws, extraction levers, and the
metal frames/faceplates. Avoid touching PCB boards and connector pins.
•
To comply with safety, emission, or thermal requirements, none of the covers or
replaceable modules should be removed. Make sure that during operation, all
enclosure modules and covers are securely in place.
•
Be sure that the rack cabinet that the subsystem chassis is to be installed provides
sufficient ventilation channels and airflow circulation around the subsystem.
•
Provide a soft, clean surface to place your subsystem on before working on it.
Servicing on a rough surface may damage the exterior of the chassis.
•
If it is necessary to transport the subsystem, repackage all disk drives separately.
If using the original package material, other replaceable modules can stay within
the enclosure.
ESD Precautions
Observe all conventional anti-ESD methods while handling system modules. The use
of a grounded wrist strap and an anti-static work pad are recommended. Avoid dust
or debris in your work area.
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Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
About This Manual
This manual:
•
Introduces the Galaxy GALHDX-7370S-8+12U4D RAID Subsystems.
•
Describes all the active components in the subsystem.
•
Provides recommendations and details about the hardware installation process.
•
Briefly describes how to monitor the subsystem.
•
Describes how to maintain the subsystem.
This manual does not:
•
Describe components that are not user-serviceable.
•
Describe the configuration options of firmware, using terminal emulation
program, or the RAIDWatch GUI that came with your subsystem.
•
Give a detailed description of the RAID processing units, or the RAID
controllers embedded within the subsystem.
Who Should Read This Manual?
This manual assumes that its readers are experienced with computer hardware
installation and are familiar with storage enclosures.
Related Documentation
•
Generic Operation Manual
•
RAIDWatch User’s Manual
These two documents can be found in the product utility CD included with your
subsystem package.
Conventions
Naming
From this point on and throughout the rest of this manual, the Galaxy series is
referred to as simply the “subsystem” or the “system.”
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Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Important Messages
Important messages appear where mishandling of components is possible or when
work orders can be misunderstood. These messages also provide vital information
associated with other aspects of system operation. The word “important” is written
as “IMPORTANT,” both capitalized and bold and is followed by text in italics. The
italicized text is the important message.
Warnings
Warnings appear where overlooked details may cause damage to the equipment or
result in personal injury. Warnings should be taken seriously. Warnings are easy to
recognize. The word “warning” is written as “WARNING,” both capitalized and
bold and is followed by text in italics. The italicized text is the warning message.
Cautions
Cautionary messages should also be heeded to help you reduce the chance of losing
data or damaging the system. Cautions are easy to recognize. The word “caution” is
written as “CAUTION,” both capitalized and bold and is followed by text in italics.
The italicized text is the cautionary message.
Notes
Notes inform the reader of essential but non-critical information. These messages
should be read carefully as any directions or instructions contained therein can help
you avoid making mistakes. Notes are easy to recognize. The word “note” is written
as “NOTE,” both capitalized and bold and is followed by text in italics. The
italicized text is the note message.
Steps
Steps describe the sequential tasks in a specific work procedure. Following the steps
in their proper order helps guarantee effectiveness and lowers the chance of making
mistakes.
Lists
Bulleted Lists: Bulleted lists are statements of non-sequential facts. They can be read
in any order. Each statement is preceded by a round black dot “•.”
Numbered Lists: Numbered lists describe sequential steps you should follow in
order.
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Galaxy GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Software and Firmware Updates
Please contact tech support for the latest software or firmware updates. Note that the
firmware version installed on your system should provide the complete functionality
listed in the specification sheet/user’s manual. We provide special revisions for
various application purposes. Therefore, DO NOT upgrade your firmware unless you
fully understand what a firmware revision will do.
Problems that occur during the updating process may cause unrecoverable errors and
system down time. Always let technical personnel handle the upgrade or consult
technical personnel before proceeding with any firmware upgrade.
xii
Chapter 1
Introduction
1.1 Product Overview
1.1.1 Introduction
This hardware manual briefly introduces the Galaxy RAID serial ATA (SATA)
RAID subsystem series. The SATA-based RAID subsystems come with two
320MB/second SCSI (SCSI-320) host channels and provide RAID protection to the
data stored in the eight (8) or twelve (12) hot-swappable, SATA-II hard drives. The
2U-profile subsystems are equipped with redundant and hot-swappable cooling fan
and power supply modules to reduce the chance of downtime by component failure.
The modular nature of the subsystem and the easy accessibility to all major
components ensure the ease of subsystem maintenance. The differences between the
two
models
will
be
described
in
the
following
sections
The 12-bay and 8-bay subsystems are shown below:
Figure 1-1: Galaxy RAID 12-bay SATA RAID Subsystem
Figure 1-2: Galaxy RAID 8-bay SATA RAID Subsystem
1-1
Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
1.1.2 Model Variations
There are two available models in the 2U version of the new SATAII Galaxy RAID
subsystem series. Below is a comparison chart listing major components of the two
models. For specific Model and component chart, refer to Appendix B.
12 Bay
8 Bay
Number of Drive Bays
12
8
RAID Controller
1
1
SCSI-320 x 2
SCSI-320 x 2
PSUs
2
2
Cooling Modules
3
2
LCD Panel
1
1
Optional
Optional
Host Channels
Battery Support
Table 1- 1: Available SATA RAID Subsystem Models
NOTE:
On receiving and unpacking your subsystem, please check the package contents
against the included unpacking checklist. If any modules appear to be missing,
please contact your subsystem vendor immediately.
1.1.3 Enclosure Chassis
1.1.3.1 Chassis Overview
The Galaxy RAID subsystem comes in a 2U metal chassis. A backplane board
divides the enclosure internally into front and rear sections. The front section
accommodates twelve (12) or eight (8) drive trays (with their associated hard drives)
and the rear section accommodates two (2) PSU modules, two (2) or three (3) singlefan cooling modules, and a single RAID controller module. The two (2) forearm
handles on the front of the subsystem enable you to easily insert/extract the chassis
into/from a rack or cabinet. Pre-drilled mounting holes on the sides of the chassis
allow you to attach separately purchased slide rails.
1-2
Product Overview
Chapter 1: Introduction
Figure 1-3: Locations of Key Components in a 12-bay Model
Figure 1-4: Locations of Key Components in an 8-bay Model
CAUTION!
When working with the subsystem, it is important to use tools with extreme care.
Do not place tools or other items on top of the enclosure to help avoid damaging
the outward appearance of chassis.
Product Overview
1 -3
Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
1.1.3.2 Physical Dimensions
The subsystems come in a standard 2U, 19” chassis with the following dimensions:
•
Measured with forearm handles: 482mm x 88mm x 505mm (width x height x
depth)
•
Measured without forearm handles: 446mm x 88mm x 490mm (width x height x
depth)
NOTE:
Components accessed through the front panel are referred to as “Front Panel
Components” and Components accessed through the rear panel are referred to as
“Rear Panel Components.”
1.1.3.3 Front Panel Overview
The front section of the subsystem features a 4 x 2 or 4 x 3 layout for eight (8) or
twelve (12) 3.5-inch disk drives and a foldable LCD keypad panel. The front panels
of the RAID subsystems described in this manual are shown in Figure 1-5 and
Figure 1-6. A description of each front panel component is given below:
Figure 1-5: Front View – 12-bay Model
Figure 1-6: Front View – 8-bay Model
The front panels shown in Figure 1-5 and Figure 1-6 are designed to accommodate
the following components:
• Forearm handles with an LCD keypad panel: The LCD Panel mounted on the
left handle shows system information and provides local access to the firmwareembedded configuration and monitoring utility.
1-4
Product Overview
Chapter 1: Introduction
• Drive bays with drive tray canisters: The drive bays are used to house the
subsystem hard drives. The GALHDX-7370S-12U4D contains 12 drive bays while
the GALHDX-7370S-8U4D contains 8 drive bays with a blank plate covering the
lower part of the front panel.
1.1.3.4 Hard Drive Numbering
The subsystems are housed in an enclosure that is 4 bays wide and 3 or 2 bays high.
When viewed from the front, drive bays (slots) are numbered 1 to 12 (See Figure 17) or 1 to 8 (See Figure 1-8), from the left to the right, and then from the top to the
bottom.
Figure 1-7:
12 Drive Bays Numbering Sequence
Figure 1-8:
8 Drive Bays Numbering Sequence
1.1.3.5 Rear Panel Overview
The rear section of the subsystems are accessed through the rear panel and is reserved
for a single RAID controller module, one (1) battery backup unit (BBU), two (2)
power supply units (PSUs), and three (12 Bay) or two (8 Bay) cooling fan modules.
The subsystem rear views are shown in Figure 1-9 and Figure 1-10. A description
of each rear panel component is given in the proceeding discussions:
Product Overview
1 -5
Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Figure 1-9: Rear View – 12 Bay Subsystem
Figure 1-10: Rear View – 8 Bay Subsystem
The rear panels shown above are designed to accommodate the following
components:
•
RAID controller module: The controller module contains a controller main
board and a pre-installed DDR DIMM module.
•
Power Supply Unit (PSU): The PSU is used to provide power to the
subsystem.
•
BBU module: A BBU comes as an optional module which provides the
protective implementation to cached data; and, unless deselected when
purchasing the subsystems, is installed into the module slot located at the
upper left corner of the controller module.
•
Cooling fan module: The redundant cooling fan module is used to ventilate
the subsystem and to reduce the temperature within the subsystem. The 12-bay
model has an additional cooling module installed in the bottom module bay.
NOTE:
Each of the power supplies on the sides of the enclosure houses one cooling fan
module in a retrievable canister. When a power supply is removed, the cooling
module is also removed. Therefore, replace the power supply unit as fast as possible
whenever it becomes necessary. Cooling fan modules can be independently removed
from the chassis without affecting PSU operation.
1-6
Product Overview
Chapter 1: Introduction
1.1.3.6 Backplane Board
An integrated backplane board separates the front and rear sections of the
subsystems. The PCB board provides traces for logic level signal traces and low
voltage power paths. It contains no user-serviceable components.
1.2 Subsystem Components
All the active components on the subsystems can be accessed through either the front
or rear panel. The modular design of the active components facilitates their easy
installation and removal. Hot-swap mechanisms are incorporated to eliminate power
surges and signal glitches that might occur while removing or installing these
modules.
1.2.1 LCD Panel
Figure 1-11: Opening the Front Handle
The LCD panel shown in Figure 1-11 consists of a 16 characters x 2 rows LCD
screen with push buttons, a mute button, and LED status indicators. The LCD front
panel provides full access to all array configurations and monitoring. After powering
up the subsystem, the initial screen will show the subsystem model name. A different
name can be manually assigned to the subsystem or different drive arrays. This will
enable easier identification in a topology consisting of numerous arrays.
Figure 1-12: Front Panel Retention Latch
To access drive bays in the left- or right-hand side column, first flip the retention
latches (see Figure 1-12) on the enclosure front handles, and then swing the handles
to the left- and right-hand sides. To close the handles (see Figure 1-13), swing the
handles toward the system; gently press the handles until a click is heard. The latches
will keep the handles in place.
Subsystem Components
1 -7
Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Figure 1-13: Closing the Front Handles
1.2.2 Drive Trays
The subsystems come with 12 or 8 drive trays (see Figure 1-14) designed to
accommodate separately purchased standard 1-inch pitch, 3.5-inch disk drives. The
drive bays are accessed from the enclosure front. Two LED’s on the front of the tray
are used to indicate the drive status. A key-lock on each drive tray secures the hard
drive in place, while an easily accessible release button ensures fast and efficient
drive hot-swapping.
Figure 1-14: Drive Tray Front View
WARNING!
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by dropping it
or resting heavy objects on it). The drive tray has been customized to fit into the drive
bays in the subsystem. If the drive bay superstructure is deformed or altered, the drive
trays may not fit into the drive bay.
1.2.3 The RAID Controller Module
The RAID controller module contains a main circuit board, a preinstalled 256MB
capacity or above DDR RAM DIMM module, and the necessary support interfaces.
The controller module contains no user-serviceable components. Except when
replacing a faulty unit or installing/upgrading the cache memory inside, the controller
module should never be removed or opened.
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Subsystem Components
Chapter 1: Introduction
WARNING!
Although the RAID controller can be removed, the only time you should touch the
controller itself is to replace the memory module or to install the memory module.
The RAID controller is built of sensitive components and unnecessary tampering can
damage the controller.
Controller Module Interfaces
The subsystems provide external interfaces to host computers and management
station(s) through the RAID controller’s rear-side faceplate as shown in Figure 1-15.
Note that the rear-facing faceplates of the 12 BAY and 8 BAY models look identical.
Figure 1-15: Controller Module Faceplate
• Host Ports
SCSI-320 Host Ports: Two SCSI-320 host channels connect the subsystem to the
host computers equipped with SCSI-320 compatible adapters through the dual-stack
VHDCI connectors. The dual-stack connectors facilitate cascade connections for
configurations such as host clustering or cascading with another RAID subsystem.
NOTE:
This subsystems come with preset configurations for channel mode and channel ID
settings, and should be sufficient for most applications.
• Ethernet Port
All controller modules on the subsystems come with a single 10/100BasedT RJ-45
Ethernet port. The Ethernet port is used for local or remote management through the
network using the RAIDWatch GUI manager or Telnet protocol.
Subsystem Components
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
• COM Port
All controller modules come with one RS-232C (audio jack) serial port. The serial
port is used for local access to the system-embedded configuration utility over the
included serial port cable.
DIMM Module
The controller module comes with a preinstalled 256MB capacity or above DDR
RAM DIMM module and can support a larger capacity up to 2GB. The DIMM
module is mounted in an easily accessible location on the controller board. However,
when the DIMM module is being changed, the controller module must be removed
from the subsystem chassis.
1.2.4 Battery Backup Unit
An optional, separately purchased Li-ION battery backup unit (BBU) module can
sustain cache memory for days after a power failure. If you purchased a BBU, it will
be installed on the upper left corner of the controller module in the rear of subsystem
chassis. Please refer to Chapter 2 for installation details.
Figure 1-16: BBU Module
In accordance with international transportation regulations, the BBU module is only
charged to between 35% and 45% of its total capacity when shipped. Therefore,
when powering on the subsystem for the first time (see Section 4.4) the BBU will
begin to charge its batteries to their full capacity. It normally requires approximately
twelve (12) hours for the battery to be fully charged. If the battery is not fully
charged after twelve (12) hours (its LED is still flashing), there is a problem with the
BBU module and you should contact your subsystem vendor immediately. While the
battery is being charged, the LED on the BBU rear panel and the fifth LED on the
controller module will flash. (See Chapter 3.2.6 for details on the LED indicators.)
You can check the status of the battery’s charge via RAIDWatch manager or the
firmware utility screen.
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Subsystem Components
Chapter 1: Introduction
1.2.5 Power Supply Units
The SATA-based Galaxy RAID subsystems are equipped with two (2) redundant,
hot-swappable, 2U, 350W power supply unit (PSUs) modules. The PSU is
permanently mounted into a 2U high (dual-level) bracket especially designed to
house both the PSU and a cooling module mounted underneath. PSUs can be found
on either side of the controller module.
Each PSU comes with a single power socket for power cord plug-in and a single
power switch for you to turn the PSU on and off. Each PSU also comes with two
embedded cooling fans to provide sufficient airflow to keep the PSU cool. A single
LED is used to indicate the PSU status. A handle at the back of the PSU has been
especially designed to enable you to remove the PSU from the subsystem while the
system is still online. This should only be done if the PSU has failed and needs to be
replaced.
NOTE:
Hot-swapping the PSU also removes the cooling module at the lower slot.
A retention screw at the upper right corner of the PSU module is used to secure the
PSU to the enclosure. If the PSU needs to be removed, the retention screw must be
removed first. When installing a new PSU module, make sure that the retention screw
has been firmly secured.
Figure 1-17: PSU Module
For the PSU specifications, please refer to Appendix B.
Subsystem Components
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1.2.6 Cooling Fan Modules
The SATA-based Galaxy RAID subsystems are equipped with two (the 8-bay model)
or three (the 12-bay model), 1U single-fan, redundant, hot-swappable cooling
modules shown in Figure 1-18. One 9.7cm fan is housed in each cooling module.
These modules have been designed to generate a cooling flow from the front to the
rear of the subsystem to extract the heat generated by the SATA hard drives. Two of
the cooling fan modules are installed directly beneath the PSUs. For the 12-bay
subsystem, a third module is located directly beneath the controller module.
Figure 1-18: Top View of a Cooling Fan Module
Advanced Fault-Preventative Operation
The cooling fan modules support dual-speed operation modes that help to protect the
subsystem in the event of component failure or extreme working condition.
Intelligent Dual Speed Operation
The cooling fans operate with two rotation speeds. Under normal operating
conditions, the cooling fans run at the low speed, which is sufficient for maintaining
efficient airflow across components. Under the following conditions, cooling fans
raise their rotation speed to increase the airflow:
1.
Component Failure: if another cooling fan module, a PSU, or a temperature
sensor fails, the remaining cooling fan(s) automatically raises its rotation
speed.
2.
Elevated Temperature: if the temperature breaches the upper threshold set for
any of the interior temperature sensors, the cooling fans automatically raises
its rotation speed.
3.
During the subsystem initialization stage, the cooling fans operate at the high
speed and return to lower speed once the initialization process is completed
and no erroneous condition is detected.
NOTE:
There are two values set for the upper temperature thresholds. One is set for event
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Subsystem Components
Chapter 1: Introduction
notification and the other triggering higher fan rotation speed. The preset value
for event notification can be changed using the firmware-embedded configuration
utility, while the fan speed trigger is not a user’s option. Please refer to the
Generic Operation Manual for the options with event notification values.
1.3 Subsystem Monitoring
The SATA-based RAID subsystems come with a number of different monitoring
methods that provide you with continual updates on the status of the system and
individual components. The following monitoring features are included in the
subsystem.
1.3.1 I2C Bus
The following subsystem elements are interfaced to the RAID controller over a nonuser-serviceable I2C bus:
•
Cooling fan modules
•
PSUs
•
Temperature sensors
1.3.2 LED Indicators
The following active components come with LEDs to indicate the status of the
individual components:
•
RAID controller
•
LCD panel
•
Cooling fan module
•
PSU module
•
BBU module
•
Drive trays
1.3.3 Firmware and RAIDWatch GUI
Firmware: The firmware is pre-installed software that is used to configure the
subsystem. The firmware can be accessed either through the LCD keypad panel or a
terminal emulation program running on a management computer that is connected to
the subsystem’s serial port.
RAIDWatch: RAIDWatch is a premier web-based graphical user interface (GUI) that
can be installed on a remote computer and is used to access the array through LAN or
Subsystem Monitoring
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
the Internet. The manager communicates with the array via the connection of the
existing host interface or Ethernet link to the RJ-45 LAN port.
1.3.4 Audible Alarms
The subsystems come with audible alarms that are triggered when certain active
components fail or when certain (controller or subsystem) thresholds are exceeded. If
you hear hastily repeated beep tones from the subsystems it is imperative that you
immediately determine and rectify the problem.
Event notification messages indicate the completion of or the condition when
proceeding with array configuration tasks and are always accompanied by two or
three successive and prolonged beeps.
WARNING!
Failing to respond when a critical alarm is heard can lead to permanent damage of
the subsystem. When an audible alarm is heard, rectify the problem as soon as
possible.
1.4 Hot-Swappable Components
1.4.1 Hot-Swap Capabilities
The Galaxy RAID 12 and 8 Bay subsystems come with a number of hot-swappable
components. A hot-swap component is one that can be exchanged while the
subsystem is still online without affecting the operational integrity of the subsystem.
These components should only be removed from the subsystem when they are being
replaced. At no other time should these components be removed from the subsystem.
1.4.2 Components
The following components are all hot-swappable:
•
Power supply units (PSUs)
•
Cooling fan modules
•
Hard drives
•
BBU module
1.4.3 Normalized Airflow
Proper subsystem cooling is referred to as “normalized” airflow. Normalized airflow
ensures the sufficient cooling of the subsystem and is only attained when all
components are properly installed. Therefore, a failed component should only be hot-
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Hot-Swappable Components
Chapter 1: Introduction
swapped when a replacement is available. If a failed component is removed but not
replaced, permanent damage to the subsystem can result.
Hot-Swappable Components
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1-16
Hot-Swappable Components
Chapter 2
Hardware Installation
2.1 Introduction
This chapter gives detailed instructions on how to install the subsystem. When
installing the subsystem, it is necessary to mount the chassis into a rack or cabinet
and to install hard drives and drive trays. Installation into a rack or cabinet should
occur before the hard drives or drive trays are installed into the subsystem. Please
confirm that you received all of the components listed on the Unpacking List that
came with the subsystem before proceeding with the installation process.
CAUTION!
Please note that the installation instructions described in this chapter should be
carefully followed to prevent any difficulties and damages to your system.
2.2 Installation Prerequisites
1.
Static free installation environment: The subsystems must be installed in a
static-free environment to minimize the possibility of electrostatic discharge
(ESD) damage. (See Section 2.3).
2.
Component check: Before installing the subsystems, you should first check to
see that you have received all the required components. (See Section 2.4) If any
items appear damaged, contact your vendor for a replacement.
3.
Hard drives: The GALAXY RAID hard drive and mounting sleds are shipped
integrated and are placed in the RAID during installation. (See Section 2.9 for
installation instructions)
4.
Cabling:
(1). The subsystems come with an external VHDCI-to-VHDCI SCSI round cable
to connect the subsystem to a host computer. All other SCSI cables that are
used to connect to a second host computer or external devices must be
purchased separately. Please see Chapter 4 for sample topologies and
configuration options.
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
(2). One (1) audio-jack-to-DB9 cable is provided to facilitate the connection of
the COM1 port for local terminal emulation access to the array.
(3). Two (2) power cords are provided for the power connections to the power
sources.
(4). The RJ-45 Ethernet cable for network management connection is a usersupplied item.
5.
Memory module: If you wish to change the pre-installed memory module, a
separately purchased module must be installed. Please contact your vendor for a
different memory module or consult the list of compatible modules.
6.
BBU module: If you wish to use a BBU module, the module can be purchased
separately.
7.
Rack installation: The enclosure chassis is installed into a rack cabinet using the
provided mounting rails. (See Section 2.7).
2.3 Safety Precautions
2.3.1 Precautions and Instructions
2-2
1.
Be sure the correct power range (100-120 or 220-240VAC) is supplied by your
rack cabinet, UPS device, or power outlet.
2.
Thermal notice: All drive trays (even if they do not contain a hard drive) must be
installed into the enclosure. Leaving a drive bay or module slot open will
severely affect the airflow efficiency within the enclosure, and will consequently
lead to system overheating. Keep a faulty module in place until you have a
replacement unit and you are ready to replace it.
3.
An enclosure without disk drives can weigh over 25 kilograms. Two (2) people
are required to install or relocate the subsystem. To avoid damage to disk drives,
drives should be removed from the enclosure before moving the subsystem.
4.
Handle the system modules by the retention screws, extraction levers, or the
modules metal frames/faceplates only. Avoid touching the PCB boards,
connector pins, and soldered surfaces.
5.
Airflow considerations: The subsystem requires an airflow clearance especially
on the front and rear. For proper ventilation, a minimum of 2.5cm is required
between the front of the enclosure and rack cover; a minimum of 5cm is required
between the enclosure and end of the rack.
6.
None of the covers or replaceable modules should be removed in order to
maintain compliance with safety, emission, or thermal requirements.
Safety Precautions
Chapter 2: Installation
7.
Always secure every enclosure module by its retaining screws or make sure it is
held in place by its latches.
8.
Always make sure the subsystem has a safe electrical earth connection via power
cords or chassis ground by the rack cabinet.
9.
Be sure that the rack cabinet in which the subsystem chassis is to be installed
provides sufficient ventilation channels and airflow circulation around the
subsystem.
10. Provide a soft, clean surface to place your enclosure on before working on it.
Servicing the enclosure on a rough surface may damage the finish of the chassis.
11. If it is necessary to transport the subsystem, repackage all disk drives separately.
If using the original package material, all other modules can stay within the
enclosure.
2.3.2 Static-Free Installation
The subsystem contains static-sensitive electronic components that can be damaged
by improper handling and electrostatic discharge (ESD). To prevent ESD damage to
any of the components, follow these precautions before touching or handling them:
•
Discharge the static electricity from your body by wearing an anti-static
wristband or by touching a grounded metal surface.
•
Avoid carpets, plastic, vinyl, and styrofoam in your work area.
•
Handle all components by holding their edges or metal frame. Avoid touching
PCB boards and connector pins.
2.3.3 BBU Warnings and Precautions
The BBU module is an optional item that can sustain cache memory in the event
of a power failure or in the unlikely event if both PSUs have failed. Having the
protection to cached data by a BBU is highly recommended. The BBU provides
additional data security and helps minimize the chance of data loss during power
outage.
Safety Precautions
•
Replace the BBU once it shows symptoms failing to hold the charge.
Although the life expectancy of a BBU is determined by the times it has
been charged or discharged, a BBU can approximately last for one year. If
the battery recharge time is obviously longer than the suggested 12 hours, or
if the fault LED is lit, replace the battery.
•
Install or replace the BBU module only with a BBU module supplied by
your subsystem vendor. Use of battery cells provided by another source will
void our warranty.
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
•
Always dispose of discharged or used batteries in an ecologically
responsible manner. Dispose used BBUs at authorized battery disposal sites
only.
•
Do not use nor leave the BBU near a heat source or direct sunlight. Heat can
melt the insulation and damage other safety features of battery cells,
possibly leading it to acid leak and result in flames or explosion.
•
Do not immerse the BBU in water nor allow it to get wet. Its protective
features can be damaged. Abnormal chemical reactions may occur, possibly
causing functional defects, acid leak, and other hazardous results.
•
Do not disassemble or modify the BBU. If disassembled, the BBU could
leak acid, overheat, emit smoke, burst and/or ignite.
•
Do not pierce the BBU with a sharp object, strike it with a hammer, step on
it, or throw it. These actions could damage or deform it, internal shortcircuiting can occur, possibly causing functional defects, acid leaks, and
other hazardous results.
•
If the BBU leaks, gives off a bad odor, generates heat, becomes discolored
or deformed, or in any way appears abnormal during use, recharging or
storage, immediately remove it from the subsystem and stop using it. If this
is discovered when you first use the BBU, request a replacement.
2.4 General Installation Procedure
Following all the instructions provided below can save installation time. Detailed,
illustrated instructions for each component are given in the following sections.
CAUTION!
To ensure that your system is correctly installed, please follow the steps outlined
below. If you follow these steps, installation will be fast and efficient. If you do
not follow these steps, you may have incorrectly installed the hardware.
2-4
Step 1.
Unpack: Unpack the subsystem and confirm that all the
components on the Unpacking Checklist have been included.
Step 2.
Install an optional BBU: a battery backup unit is highly
recommended for its protection to data integrity. It should be
installed prior to operating the subsystem. (See Section 2.8)
General Installation Procedure
Chapter 2: Installation
2.4.1
Step 3.
Rack/Cabinet installation: If the subsystem is going to be installed
in a rack or cabinet, it should be installed prior to installing the hard
drives. Installing the subsystem into a rack or cabinet requires at
least two (2) people.
Step 4.
Install hard drives: Hard drives have been preinstalled and tested in
drive trays. Use this procedure for replacement of faulty drives (See
Section 2.9)
Step 5.
Install drive trays: After the hard drives have been installed into the
drive trays, the drive trays must be installed into the enclosure itself.
(See Section 2.10)
Step 6.
Cable connection: Use the power cords that came with the
subsystem to connect the subsystem to the main power source. Use
self-purchased SCSI cables (see Chapter 4 for more details) to
connect host ports to servers.
Step 7.
Power up: Once the components have been properly installed and
all cables are properly connected, you can power up the subsystem
and configure the RAID array. (See Section 4.4)
Installation Procedure Flowchart
Figure 2-1 shows a flowchart of the installation procedure. As you complete each
step, check off the “Done” box on the right. Please use this flowchart in conjunction
with the instructions that follow.
General Installation Procedure
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Figure 2-1: Installation Procedure Flowchart
2.5 Unpacking the Subsystem
Use the unpacking checklist in your package to check packing contents. Carefully
check the items contained in each box before proceeding with installation.
Each packed box is separated into the upper and lower levels.
Lower level: The boxes on the upper level contain:
•
Eight (8) or twelve (12) drive canisters
Upper level: The lower box should contain the enclosure chassis with all the preinstalled components. The pre-installed components should include:
•
RAID controller module
•
PSU modules
•
LCD panel
•
Cooling fan modules
•
A backplane
Accessory items are placed in a box on the upper level. They include two power
cords, a null modem, screws, an audio jack cable, a VHDCI-to-VHDCI external
SCSI round cable, a product utility CD containing the Installation and Hardware
Reference Manual (this document), Generic Operation (Firmware) Manual.
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Unpacking the Subsystem
Chapter 2: Installation
2.6 Installation Overview
2.6.1 Pre-installed Components
The following components have been pre-installed in the GALAXY RAID
subsystem and therefore do not need to be installed.
•
2 - PSU modules
•
Cooling fan modules: 3 for 12 drive bays, or 2 for 8 drive bays
•
1 - RAID controller module
•
1 - Memory DIMM module (mounted on the controller)
•
1 - LCD keypad panel
•
2 - foldable forearm handles
•
1 - backplane
2.6.2 Uninstalled Components
You must install the following components:
•
Drive sleds (integrated with the hard drives)
•
SCSI cables
•
A separately purchased BBU (a BBU is shipped in a different package)
2.7 Rackmounting
The subsystem is easily installed into a standard 19-inch rack cabinet using the
mounting holes on the sides of chassis.
WARNING!
Always use a slide, shelf or other chassis mounting hardware to
secure the Galaxy Raid in a rack cabinet.
NOTE: The front screws are not sufficient to properly hold the
chassis.
FAILURE TO PROPERLLY MOUNT THE GALAXY WITH
SLIDE, SHELF OR OTHER MOUNTING DESCRIBED
BELOW MAY CAUSE DATA CORRUPTION OR LOSS OF
DATA.
Installation Overview
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
2.7.1
Considerations for Installation Site and Chassis
•
Make sure you have an appropriate site location and cables prepared with
adequate lengths to connect to main power and other devices.
•
At least two people will be required to install the chassis. Disk drives should
only be installed after the chassis is properly mounted. The chassis can weigh
about 24Kgs without disk drives.
•
The following tools are necessary for mounting the chassis:
ƒ
ƒ
#4 Phillips-head screwdriver
Wrenches may be necessary, depending on the rack type
•
Use the included M5 or M6 screws for securing the chassis through its front
mounting ears.
•
More details about the use of optional slide rails are given in the Installation
Guide that came with the slide rail package.
2.7.2 Mounting Holes Positions
•
Integrators may design their own brackets or slide rails using the twenty-two
(22) mounting holes on the sides of chassis.
•
There are six (6) mounting holes with six (6) M4 nuts near the end of the chassis
on each side. Shown below are the locations of these mounting holes. (See the
arrow marks in Figure 2-1). See the next diagram for another group of mounting
holes on a horizontal line.
Figure 2-1: Enclosure Side Mounting Holes (1)
•
Figure 2-2 shows holes that are designed for slide rail options. There are five (5)
mounting holes for #6-32 screws on the sides of the enclosure for use with slide.
Figure 2-2: Enclosure Side Mounting Holes (2)
•
2-8
Use M5 or M6 pan-head screws to secure the chassis to the front cabinet posts.
The
front
ear
holes
are
shown
in
Figure
2-3.
Rackmounting
Chapter 2: Installation
WARNING: DO NOT USE ONLY THE FRONT EAR HOLES TO MOUNT
THE GALAXY. DATA LOSS OR CORUPTION MAY OCCUR.
Figure 2-3: Front Ear Holes
2.8 BBU Installation
2.8.1 BBU Module Installation Overview
The BBU module is an optional item that can sustain cached data in the event of a
power outage or in the unlikely event that both PSUs have failed. Purchasing and
installing a BBU is highly recommended. The optional BBU provides additional data
security and helps minimize the chance of data loss during power shutdowns.
The BBU module is inserted into the subsystem in the module slot at the upper left
corner of the controller module. The BBU module is secured to the subsystem with
two (2) retention screws. When shipped, the BBU module slot in the subsystem rear
panel is covered with a metal dummy plate that must first be removed.
2.8.2 Installation Procedure
To install a BBU into the subsystem, please follow these steps:
Step 1.
Using a screwdriver, loosen the two (2) retention screws located on
both sides of the dummy plate. (See Figure 2-2)
Figure 2-2: Loosening the Metal Sheet Retention Screws
Step 2.
BBU Installation
Once the retention screws are loosened, wedge a screwdriver
between the back of the dummy plate and the interior wall of the
subsystem enclosure. Gently lever the dummy plate out of the
enclosure. (See Figure 2-3)
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Figure 2-3: Removing the BBU Slot Dummy Plate
Step 3.
Install the BBU module. Align the BBU module with the BBU
module slot and gently insert the BBU module until the back of the
BBU module reaches the end of the slot.
Step 4.
Secure the BBU module to the chassis. Fasten the two (2) retention
screws on the BBU module rear panel to secure the BBU module to
the chassis. (See Figure 2-4)
Figure 2-4: Installing the BBU Module
IMPORTANT!
If a BBU is added when the subsystem has already been put to use, reset the subsystem
for the configuration change to take effect. Although a BBU can be added online, the
BBU module will only be functional after a subsystem reset.
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BBU Installation
Chapter 2: Installation
2.9 Hard Drive Installation
NOTE:
Your Galaxy RAID drives and drive trays have been pre-integrated for
you and only need to be inserted into the RAID enclosure. The following
procedures are used by integration to accomplish this process..
WARNING!
1.
Handle hard drives with extreme care. Hard drives are very delicate.
Dropping a drive onto a hard surface (even from a short distance) and hitting
or touching the circuits on the drives with your tools may all cause damage
to drives.
2.
Observe all ESD prevention methods when handling hard drives.
3.
Only use screws supplied with the drive canisters. Longer screws may
damage the drive.
2.9.1 Hard Drive Installation Pre-requisites
CAUTION!
The hard drives and drive trays should only be installed into the subsystem once
the subsystem has been mounted into a rack cabinet. If the hard drives are
installed first, the subsystem will be too heavy to place into position and the
possible impact during installation may damage your drives.
Hard drives for the subsystem must be purchased separately. When purchasing the
hard drives, the following factors should be considered:
•
Capacity (MB/GB): Use drives with the same capacity. RAID arrays use a
“least-common-denominator” approach. The maximum capacity of each drive
used in the array is the maximum capacity of the smallest drive. Use drives of
the same capacity.
•
Profile: The drive trays and bays of the system are designed for 3.5-inch wide
x 1-inch high hard drives. It is highly recommended that you do not try to use
drives of any other size.
•
Drive type: The subsystem described in this manual can use either SATA-II or
SATA-I hard drives.
Hard Drive Installation
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
2.9.2 Drive Installation
Step 1.
Place the SATA hard drive into the drive tray (as shown in Figure
2-4) making sure that the hard drive is oriented in such a way that
the drive’s SATA connector is facing the back of the drive tray.
Figure 2-4: Installing a SATA Hard Drive
Step 2.
Adjust the drive’s location until the mounting holes in the drive
canister are aligned with those on the hard drive. Secure the drive
with four supplied 6/32 flathead screws. (See Figure 2-4)
WARNING!
Only use screws supplied with the drive canisters. Longer screws may damage the
drive.
2.10 Drive Tray Installation
Once the hard drives have been installed in the drive trays, the drive trays can be
installed into the subsystem.
WARNING!
All drive trays must be installed into the enclosure even if they do not contain a
hard drive. If the trays are not installed into the enclosure, the ventilation required
for cooling will be disturbed and the subsystem will overheat.
Step 1. Make sure that the hard drive is secured to the drive tray. Make sure
the key-lock is in the unlocked position. The key-lock is unlocked if
the groove on its face is in a horizontal orientation. If the groove is in
a vertical position, as shown in Figure 2-5, then the key-lock is
locked and the front flap on the drive tray cannot be opened.
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Drive Tray Installation
Chapter 2: Installation
Figure 2-5: Front View of an Individual Drive Tray
Step 2.
Open the front flap on the drive tray. (See Figure 2-6). To open the
flap, push the release button (shown in Figure 2-7) on the front bezel.
The front flap will open in an upward direction.
Figure 2-6: Opening Drive Tray Front Flap
Step 3.
Align the drive tray with the slot in which you wish to insert it. Make
sure that it is resting on the rails inside the module slot. Once the
drive tray is lined up with the slot, gently slide it in. This should be
done smoothly and gently.
Figure 2-7: Installing a Drive Tray
Step 4. Close the front flap on the drive tray. Make sure the front flap is
closed properly. Closing the front flap ensures that the drive tray is
firmly connected to the corresponding connector on the backplane
board. If the front flap is not closed properly, the connection
between the HDD and the subsystem will not be secure. DO NOT
slam the drive tray into place! The connector pins might be
damaged. If the front flap is not closed properly, the connection
between the hard drive and the subsystem will not be secure.
Drive Tray Installation
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Step 5.
Lock the flap into place by turning the key-lock until the groove on
its face is pointing down (vertical orientation). (See Figure 2-8)
Figure 2-8: Drive Tray Key-lock Rotation
Step 6.
Once all drive trays are installed, the RAID subsystem will poll the
drive channels and recognize the drives and scan them in
automatically.
When powered up, you should check the LEDs on drive bezels to
ensure all drives are receiving power and are functional. All drive
LEDs should be solid green after the initialization stage.
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Chapter 2: Installation
2-15
Chapter 3
System Monitoring
This chapter provides information on how to monitor the 8 bay and 12 bay SCSI <>
SATA RAID subsystems.
3.1 Subsystem Monitoring Overview
Both the Galaxy RAID 8 BAY and 12 BAY subsystems are equipped with a variety
of self-monitoring features that help to keep subsystem managers informed of the
subsystem operational status. These monitoring features provide vital feedback to
help you maintain the operational integrity of the subsystem. Prompt response to
warnings and subsystem component failure notifications will ensure safe operation of
the subsystem and help ensure the longevity of the subsystems.
Self-monitoring features include:
•
Firmware (FW): The RAID controllers in the subsystems come with preinstalled FW. The FW can be accessed using either the LCD keypad panel
or a PC running terminal software through the RS-232C (audio jack) serial
port. Device status information can be obtained from the FW. The FW
capabilities have been fully described in the “Generic Operation Manual”
that came with your subsystems. Please refer to this manual for further
information.
•
RAIDWatch: RAIDWatch is a fully integrated Java based Graphical User
Interface (GUI) that came with the subsystem and can be used to monitor
and maintain the subsystem using web browsers. Connection to a
RAIDWatch station is made using the existing Ethernet ports.
The RAIDWatch Panel View can be customized to show a direct, graphical
representation of the subsystem in the content panel of the RAIDWatch
screen. Panel View allows you to quickly determine the operational status
of critical components. Detailed information for the RAIDWatch manager
is given in the RAIDWatch User’s Manual included in the Product Utility
CD that came with your subsystem.
•
Configuration Client: The powerful Configuration Client sub-module can
be used to keep you informed of system events via a variety of
communication methods like email, LAN broadcast, fax, pager, MSN
messenger, ICQ, and SMS. The sub-module runs as an independent
program from RAIDWatch main program. The Configuration Client helps
prevent blind time and keeps you constantly informed as to the status of the
storage management subsystem. Instructions on how to activate the
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Configuration Client functionality are given in the RAIDWatch User’s
Manual.
•
LEDs: Device-status-indicating LEDs are placed on all of the subsystems’
active components. These LEDs inform you of the integrity of a given
component or a given link. You should become familiar with the different
LEDs on the subsystem and be aware of their functions. (See Section 3.2)
•
Audible Alarm: An audible alarm is present on the subsystem controller
board and will be triggered if any of a number of threatening events
occurred. These events usually jeopardize the functional and operational
integrity of the controller board and must be heeded at all times. Events
such as a breaching of the temperature threshold will trigger the alarm and
if an onsite subsystem manager is present, the manager should, using either
the LCD panel or the PC hyper-terminal, determine the cause of the alarm
and take the appropriate corrective measures. (See Section 3.3)
•
Inter-Integrated Circuit (I2C): The I2C bus monitors the operational
integrity of the cooling modules, sensors for RAID controller
board/backplane temperature and voltage readings.
Subsystem monitoring is a necessary part of subsystem management. If failure
events or other disruptive events are detected and reported, the subsystem managers
must take the appropriate action to rectify the problem. Failure to act in a properly
specified manner to a system event (like overheating) can cause severe and
permanent damage to the subsystem.
3-2
Subsystem Monitoring Overview
Chapter 3: Monitoring
3.2 Status-indicating LEDs
3.2.1 Brief Overview of the LEDs
The following devices come with LEDs that inform subsystem managers about the
operational status of the component on which they are mounted. The Galaxy RAID
subsystems feature status-indicating LEDs distributed over the active components in
the following ways:
Component
LED(s) per Unit
Total LEDs
Definition
Drive Trays
2
24 – 12 BAY
See Section 3.2.5
16 – 8 BAY
Controller Module
5
5
See Section 3.2.2
Ethernet Ports
2
2
See Section 3.2.3
BBU Module (if BBU
is installed)
1
1
See Section 3.2.6
PSU Module
1
2
See Section 3.2.7
LCD Keypad Panel
3
3
See Section 3.2.4
Cooling Module
1
3 – 12 BAY
2 – 8 BAY
See Section 3.2.8
Table 3-1: LED Distribution
LED definitions are given in the following sections.
3.2.2 Controller Module LEDs
The rear-facing faceplate of the RAID controller module is shown in Figure 3-1 for
model GALHDX-7370S-12U4D. The rear-facing faceplates on the two models look
identical. The LEDs are numbered from 1 to 5. There are two more LEDs on the
Ethernet port. The definitions are shown in Table 3-2 below.
Figure 3-1: GALHDX-7370S-12U4D Controller Faceplate
LED
Status-indicating LEDs
Name
Color
Status
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
1
Green
Controller
Ready
ON: Indicates controller is active and
operating normally.
FLASHING: Indicates controller
initialization is taking place.
OFF: Controller is not ready for operation.
2
Green
Hst_Bsy
OFF: No activities on the host ports.
(Host Ports
Busy)
3
Green
Drv_Bsy
C_Dirty
Amber
ON: Indicates that data is currently being
cached in memory or is being held up by
the BBU during a system power loss.
Amber
ON: Indicates the BBU has failed and
cannot sustain cached data.
(Cache Dirty)
5
FLASHING: Activities on the drive side.
OFF: No activities on the drive side.
(Drive Busy)
4
FLASHING: Activities on the host ports.
BBU_Fail
OFF: Indicates the BBU can sustain cached
data in memory.
FLASHING: The BBU is charging.
(NOTE: The BBU is considered as an
optional module. If a BBU has not been
installed, then this LED is always off).
Table 3-2: Controller Module LED Definitions
3.2.3 Ethernet Port LEDs
Both 8 and 12 bay SCSI Raid subsystems come with a RS-232C audio jack serial
port that can be used to assign a permanent IP to the subsystems. After a permanent
IP address has been assigned, an Ethernet cable can be used to connect the RJ-45
Ethernet port to a network hub or router. This enables you to manage your subsystem
locally or remotely over TCP/IP. See Figure 3- 2 for the locations of the two LED
indicators on Ethernet port. Refer to Table 3-3 for the LED definitions.
Link Status
Activity
Figure 3- 2: Ethernet Port Indicators
3-4
Status-indicating LEDs
Chapter 3: Monitoring
Name
Color
Status
Link Status
Green
ON: Indicates a valid connection to network
LAN Activity
Green
BLINKING: Indicates active transmissions
Table 3-3: Ethernet Port LED Definitions
3.2.4 LCD Keypad Panel
The LCD panel located on the front aluminum foldable handle comes with three
status LEDs. The LEDs are marked from top to bottom “PWR,” “BUSY” and
“ATTEN” and are clearly seen in Figure 3-3 below. The definitions of these LEDs
are shown in Table 3- 4. The mute button can be used to stop the alarm until the next
controller event occurs.
Figure 3-3: LCD Keypad Panel
Name
Color
Status
ON indicates that power is being supplied to the
subsystem.
POWER
Blue
OFF indicates that no power is being supplied to the
subsystem.
Flashing indicates that there is activity on the
host/drive channels.
White
BUSY
ATTENTION
Red
OFF indicates that there is no activity on the
host/drive channels.
ON indicates that one or more
failure/critical events have occurred.
component
OFF indicates that the subsystem and all its
components are operating normally.
Table 3- 4: LCD Panel LED Definitions
NOTE:
The LCD panel ATTEN LED will, during the power up process, be turned on. If the
subsystem boots up correctly, then the ATTEN LED will be turned off after the boot up
procedure is complete.
Status-indicating LEDs
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
3.2.5 Drive Tray LEDs
Two LED indicators are located on the right side of each drive tray. (See Figure 3- 4)
Refer to Table 3- 5 for LED definitions. When notified by a drive failure message,
you should check the drive tray indicators to find the correct location of the failed
drive. Replacing the wrong drive can cause fatal failure of a logical array.
Figure 3- 4: Drive Tray LEDs
LED Name
Color
Status
Drive Busy
Blue
ON indicates read/write activity on the drive.
OFF indicates there is no read/write activity on the drive.
Power
Status
Red/
Green
GREEN indicates that power is being supplied to the
drive.
OFF indicates no power is being supplied to the drive or
the drive tray is not properly installed. .
RED indicates drive failure or faults have occurred.
Table 3- 5: Drive Tray LED Definitions
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Status-indicating LEDs
Chapter 3: Monitoring
3.2.6 BBU Module LED
The BBU module has an LED on its faceplate. (See Figure 3-5) The function is the
same as the fifth LED on the controller module. The LED is off when the BBU is
functioning normally and is able to sustain the cache memory. The LED flashes to
indicate the BBU is currently charging its battery cells. If the LED is illuminating
amber, the unit may have failed. Please contact your system vendor to verify the
problem.
Figure 3-5: BBU Module LED
3.2.7 PSU LED
Figure 3- 6: PSU LED
Each PSU comes with a single LED located just above the power switch and just
below the retention screw (see Figure 3- 6). The LED is used to indicate the
operational status of the PSU module. Please refer to the PSU LED definitions shown
in Table 3- 6.
Color
Status
Flashing
Green
The power supply has not been turned on. The PSU module LED
will blink when the subsystem is connected to a power source but
has not been turned on.
Static Green
The PSU is operating normally and experiencing no problems
Static Red
The PSU has failed and is unable to continue providing power to
the subsystem.
OFF
The power cord is unplugged or the power cord is plugged but no
power is being supplied from the power source.
Table 3- 6: PSU Module LED Definitions
3.2.8 Cooling Fan Module LED
The cooling fan module comes with a single status-indicating red LED shown in
Figure 3-7. LED definitions are given in Table 3-7.
Status-indicating LEDs
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Figure 3-7: Cooling Fan Module LED
RED
Status
OFF
The cooling fan module is operating normally.
ON
The cooling fan module has failed and must be replaced.
Table 3-7: Cooling Fan Module LED Definitions
The subsystem has a novel approach to stabilizing the temperature within the
subsystem: When the sensors within the enclosure detect critical working conditions,
such as high ambient temperature or the failure of any cooling or PSU module, the
system will turn the cooling fans to high speed to extract more heat. Once the
ambient temperature cools down to normal or the faulty module has been replaced,
the cooling fans return to normal speed.
3.3 Audible Alarm
Different subsystem environmental and operational parameters (i.e., temperature,
etc.) have been assigned a range of values between which they can fluctuate. If either
the upper or lower thresholds are exceeded, an audible alarm will automatically be
triggered. The alarm will also be triggered when an active component of the
subsystem fails. If the subsystem manager is onsite and hears the alarm, the manager
will have to read the error message on the LCD screen or the PC terminal in order to
determine what has triggered the alarm. After determining what has occurred, the
subsystem manager must take appropriate actions to rectify the problem.
WARNING!
When an alarm is triggered, it is necessary for you to determine the problem. If the
audible alarm is ignored and the problem is not rectified, unexpected damages may
occur.
3-8
Audible Alarm
Chapter 3: Monitoring
3.3.1 Default Threshold Values
NOTE:
The threshold values listed below are used to trigger a warning event and sound
the alarm. A different value set is reserved for triggering the cooling fans to
operate at a high rotation speed. The fan speed value set is not user-configurable.
Table 3-8 shows the default threshold values for the subsystem. If any of these values
are surpassed the alarm will sound:
Upper Threshold
Lower Threshold
+3.3V
+3.6V
+2.9V
+5V
+5.5V
+4.5V
+12V
+13.2V
+10.8V
CPU Temperature
90ºC
5ºC
Board Temperature
80ºC
5ºC
Enclosure
Ambient
Temperature
40ºC
0ºC
Table 3-8: Default Threshold Values
The controller self-monitoring thresholds in Table 3-8 are the default threshold
values. To change these pre-set values, please refer to the Generic Operation
Manual that came with your system. The values set for the subsystem’s ambient
temperature are pre-configured before shipping and cannot be changed.
3.3.2 Failed Devices
The audible alarm will be triggered if any of the following devices fail:
•
Cooling fan modules
•
PSU modules
•
BBU modules
•
Hard drives
•
Components on the RAID controller
NOTE:
If the temperature exceeds a preset threshold, the BBU charger circuits will stop
charging. You will then receive a message that says “Thermal Shutdown/Enter
Sleep Mode.” When the temperature falls back within normal range, the battery
will resume charging.
Audible Alarm
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3.4 I2C Monitoring
Module presence detection and the general working status of cooling fan and other
modules are monitored through an I2C serial bus. If any of these modules fails, the
failure will be detected and you will be notified via the various methods described
above.
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I2C Monitoring
Chapter 4: Connection and Operation
Chapter 4
System Connection and Operation
This chapter introduces sample topologies, configuration options and server
connections for the Galaxy RAID subsystems and discusses both the power on and
power off procedures.
4.1 SCSI Connection Overview
The Galaxy RAID GALHDX-7370S-8U4D and GALHDX-7370S-12U4D
subsystems support 2 SCSI host channels and 2 dual-stack connectors featuring
support for SCSI-320 protocol (also known as Ultra-320), the latest iteration of the
SCSI drive interface standard. The SCSI-320 enables maximum data transfer rates up
to 320MB/second per channel from host computers to the subsystems or expansion
systems. This is twice the bandwidth as the Ultra160 standard, allowing you optimal
performance and flexibility with configuring storage applications.
4.1.1 SCSI Cables
One SCSI cable (GAL-9270UJBODCab) is provided with each subsystem for host
connection. If you wish to connect the second host channel, a second cable must be
separately purchased. Purchase only high quality SCSI-320 cables from a reputable
manufacturer. To ensure optimum performance, it is necessary to use proper, high
quality SCSI-320 compatible cables. Failure to do so will result in downgraded
performance.
4.1.2 SCSI Port on the Controller Rear Panel
The SATA-based subsystems are equipped with two dual-stack VHDCI connectors
on the back of the enclosure. (See Figure 4- 1) Each 68-pin VHDCI connector is
specified as “Channel # In” or “Channel # Out” port.
SCSI Connection Overview
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Figure 4- 1: SCSI Connectors on the Controller Rear Panel
4.1.3 SCSI Termination
SCSI termination requires that the last device on the SCSI bus is terminated. If the
last device is not terminated, or if devices other than the last are terminated, erratic
SCSI bus performance may occur.
The RAID controller comes with built-in auto-sense terminators. You do not have to
install an external terminator when the subsystem acts as the last device in the daisychain configuration. However, you will need to “disable” the firmware setting for the
on-board terminator using the LCD keypad panel, RS-232C terminal session, or
RAIDWatch management software if the “IN” and “OUT” ports are separately
connected to servers and/or a cascaded enclosure. (The firmware default for channel
termination is set to “enabled.”)
See the diagrams below for correct configurations and the configurations that may
cause problems:
4-2
SCSI Connection Overview
Chapter 4: Connection and Operation
Figure 4- 2: Single Host Connection: Correct
Connection
A server is connected to one of the host ports.
There is no need for further termination
configuration because the firmware default is
terminator ON, and the auto-sense terminator is
also automatically enabled.
Figure 4- 3: Dual-Host Connection: Incorrect
Connection
The “IN” and “OUT” ports are separately
connected to a server and a cascaded enclosure.
The auto-sense terminator is disabled, while the
firmware setting remains effective. Problems will
occur on the SCSI bus.
Figure 4- 4: Dual Host Connection: Correct
Connection
The “IN” and “OUT” ports are separately
connected to a server and a cascaded enclosure.
The auto-sense terminator is automatically
disabled, and the firmware setting should be
manually disabled.
The firmware default for SCSI bus termination setting is “ON.” The bus termination
setting can be manually enabled or disabled on each SCSI channel. See the diagrams
below for different accesses to the termination control. More details about the
configuration process can be found in the Generic Operation Manual or the
RAIDWatch User’s Manual that came with the Product Utility CD.
SCSI Connection Overview
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Using the LCD Keypad Panel
Figure 4- 5: LCD Keypad
Navigation Flow
Configuration over Hyper Terminal
Figure 4- 6: The Terminator Option on Terminal Screen
Select from Main Menu, “View and Edit Channels,” press [ENTER] on a channel
you wish to change its termination mode, and select “SCSI Terminator” by pressing
[ENTER]. Depending on the current setting, select Yes or press ESC to complete the
configuration process.
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SCSI Connection Overview
Chapter 4: Connection and Operation
Via RAIDWatch GUI
Figure 4-7: The Terminator Option in RAIDWatch Screen
Select from RAIDWatch’s navigation tree, “Configuration,” “Channel,” and click on
a channel (host) you wish to change its termination mode, and click on one of the
check circles besides “Termination.” Click the “Apply” button to complete the
configuration process.
Typically, the server or host adapter (SCSI card inside the server) is the first device
and is already terminated. When installing the subsystems on a SCSI bus with other
devices, be sure to observe the above rules with all devices on the SCSI bus. Consult
the documentation for your server and/or host adapters for additional information on
correct termination procedures.
SCSI Connection Overview
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4.2 Host Connection Topology
4.2.1 Single Host
Figure 4-8: Single SCSI Controller Connected to a Single Host Computer
In the example shown in Figure 4-8, the SCSI ports are connected to two adapters on
a host computer to provide path redundancy. If one of the host channels becomes
disconnected, or if the cable connecting one of the host ports to the host computer is
damaged, data flow will be routed through the second path from the subsystem to the
host computer.
NOTE:
To create dual redundant data paths on the host side, you will need to install a
third-party fail-over software on the host computer.
4-6
Host Connection Topology
Chapter 4: Connection and Operation
4.2.2 Dual Hosts
Figure 4- 9: Cascaded Subsystems Connected to Two Host Computers
In the example shown in Figure 4- 9, the SCSI ports are connected to different host
computers. This provides both path and host computer redundancy. If one of the host
channels becomes disconnected, or if the cable connecting one of the host ports to the
host computer is damaged, the second path can transmit data from the subsystem to
one of the host computers. Similarly, in the clustered hosts configuration, the same
array can be accessed through different data paths and downtime will be minimized.
To obtain more disk capacity, the “Out” ports are used to cascade another subsystem.
4.3 Power On
After installing all the components in the subsystem, connecting the host channels to
the host, and connecting the expansion cables to the expansion enclosures, the
subsystem is ready to be powered on.
4.3.1 Power On Checklist
BEFORE powering on the subsystem, please check the following:
Power On
‰
Memory module: Memory module has been correctly installed on the
controller board.
‰
BBU modules: (Option) If used, ensure that the BBU modules have been
installed correctly.
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
‰
Hard drives: Hard drives have been correctly installed on the drive trays.
‰
Drive trays: ALL the drive trays, whether or not they have a hard drive,
have been installed into the subsystem.
‰
Cable connections: The host ports on the subsystem have been correctly
connected to host computer(s).
‰
Power cables: The power cords have been connected to the PSU modules on
the subsystem and plugged into main power.
‰
Ambient temperature: All the subsystem components have been acclimated
to the surrounding temperature.
4.3.2 Power On Sequence
When powering on the ES subsystem, please follow the steps below:
1.
Power on any expansion enclosures if applied
If you connect any expansion enclosures to the subsystem, power on those
expansion enclosures before powering on the subsystem.
2.
Power on the subsystem
The subsystem should be powered on before the host computers. The power on
procedure for the subsystem is described in Section 4.3.3.
3.
Host computers
Host computers should be the last devices that are turned on. Please refer to the
documentation that came with your host computers to see its own power on
procedure.
4.3.3 Power On Procedure
4-8
1.
Plug in all power cords to the power connectors located at the rear of the
subsystem. Use the power cables that came with the subsystem to connect the
subsystem to the power outlet, separate power sources, or UPS devices.
2.
Turn on the power supply switches for both power supply units.
3.
The subsystem is now turned on and the self-test will start automatically.
4.
The “Power” LED on the front LCD panel will turn blue. (See Figure 4- 10)
Power On
Chapter 4: Connection and Operation
Figure 4- 10: Subsystem Power Switches
CAUTION!
Although the PSUs are redundant and a single PSU can provide sufficient power
to the system, it is advisable to turn both the power switches on. If only one PSU is
operating and fails, the whole system will crash.
4.3.4 Power On Status Check
Once the ES subsystem has been powered on, the status of the entire subsystem
should be checked to ensure that everything is running smoothly and that there are no
complications or malfunctions.
1.
Controller module LEDs: The controller module LEDs should all flash green.
2.
Drive tray LEDs: The LEDs of all the drive trays (that contain hard drives)
should be constantly lit green to indicate that the drives have successfully spun
up and are ready for I/Os.
3.
LCD panel LEDs: The blue LED on the LCD panel should come on indicating
that power is being supplied to the system.
4.
Firmware and RAIDWatch: The overall status of the system may be checked
using the terminal interface or the RAIDWatch GUI.
5.
Audible alarm: If any errors occur during the initialization process, the onboard
alarm will sound in a hastily repeated manner.
Drive tray LEDs should normally start flashing during the initialization stage,
indicating the RAID controller unit is attempting to access the hard drives.
NOTE:
The subsystem has been designed to run continuously. If a hot-replaceable
component fails, the fault can be corrected online.
Power On
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
4.3.5 LCD Screen
When powering on the subsystem, the following messages should appear on the front
panel LCD screen. Wait for the front panel LCD to show “READY” or “No Host
LUN” before the host boots up. Refer to Figure 4- 11 on how to read the screens.
Model Name
GALAXYHD
Ready
Status/Data Transfer Indicator
Figure 4- 11: The LCD Initial Screen
The LCD screen startup sequence is shown and described in the sequence below:
Initializing….
Please Wait...
This screen appears when the PSUs are turned on.
Power on Self
Test, Please Wait...
Proceeding with controller self-test.
Power on Self
Test Completed
Self-test completed.
GALAXYHD
128MB RAM, Wait…
Verifying installed cache memory.
GALAXYHD
No Host LUN
4-10
System is ready. You can now start to configure
the subsystem.
Power On
Chapter 4: Connection and Operation
4.4 Power Off Procedure
If you wish to power down the subsystem, please follow these steps:
NOTE:
If you wish to power down the subsystem, please ensure that no time-consuming
processes, like “Regenerate Logical Drive Parity” or a “Media Scan,” are taking
place.
1.
Stop I/O access to the system
Stop all I/O accesses from the host computers to the subsystem. Please refer to
the related documentation of your host applications and operating system.
2.
Disconnect the host
The host must be disconnected from the subsystem. To do this, disconnect the
cables from both the host and the subsystem.
3.
Flush the cache
Use the “Shutdown Controller” function to flush all cached data. This prepares
the RAID subsystem to be powered down.
4.
Turn off the power
Turn off the power switches at the power supply modules. Once the RAID
subsystem has been powered down, other devices that are connected to the
subsystem can be powered down.
Power Off Procedure
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
4-12
Power Off Procedure
Chapter 5
System Maintenance
5.1 Overview
5.1.1 About Subsystem Maintenance
Constant monitoring and maintenance of your SATA-based subsystems will
minimize the chance of system downtime and preserve the working integrity of the
system for a longer period of time. If any of the subsystem plug-in modules fails,
they must be replaced as soon as possible.
WARNING!
Do not remove a failed component from the subsystem until you have a
replacement on hand. If you remove a failed component without replacing it, the
internal airflow will be disrupted and the system will overheat causing damage to
the subsystem.
All of the following components can be replaced in case of failure:
1.
Controller module – Section 5.2
2.
Memory module – Section 5.3
3.
BBU module – Section 5.4
4.
PSU modules – Section 5.5
5.
Cooling fan modules – Section 5.6
6.
Hard drives – Section 5.7.2
5.1.2 General Notes on Component Replacement
•
With the exception of the RAID controller module, all the components on the
subsystems, including the PSU modules, cooling fan modules, BBU, and drive
trays are hot-swappable and can be changed while the subsystem is still in
operation.
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
•
Qualified engineers who are familiar with the subsystem should be the only ones
who make component replacements. If you are not familiar with the subsystems
and not familiar with RAID subsystem maintenance in general, it is strongly
advised that you refer subsystem maintenance to a suitably qualified
maintenance engineer.
•
Normalized airflow is directly dependent upon the presence of all subsystem
components. Even if a subsystem component fails, it should not be removed
from the subsystem until a replacement is readily at hand and can be quickly
installed. Removing a subsystem component without a replacement can lead to
permanent subsystem damage.
•
When replacing any hot-swappable component, caution should be taken to
ensure that the components are handled in an appropriate manner. Rough or
improper handling of components can lead to irreparable damage.
•
When removing a controller module from the subsystem, ensure that the power
has been turned off and that all precautionary measures, without exception, are
adhered to. The controller board contains very sensitive components and can be
easily damaged.
WARNING!
When inserting a removable module, take heed that DO NOT USE
EXCESSIVE FORCE! Forcing or slamming a module can damage the pins
on the module connectors either on the module itself or on the backplane. Gently
push the module until it reaches the end of module slot. Feel the contact
resistance and use slightly more force to ensure the module connectors are
correctly mated. If the module comes with extraction levers or retention screws,
use them to secure the module.
5.2 Replacing Controller Module Components
5.2.1 Overview
The controller module should never be removed unless the following replaceable
components need to be accessed:
•
Cache memory DIMM module: If a larger capacity DIMM module is required.
•
Controller module itself:
If the controller module in a single-controller
model fails, it is necessary to power down the
subsystem and replace the controller.
If a DIMM module or RAID controller fails, contact your vendor immediately for a
replacement. To replace any of these components, the controller module must first be
removed from the subsystem.
5-2
Replacing Controller Module Components
Chapter 5: System Maintenance
5.2.2 Notes on Controller Module Maintenance
•
The controller module contains a DIMM module. It is not recommended to reuse the DIMM module extracted from a failed controller unless you have a
similar RAID subsystem that can be used to test the module. You can contact
your vendor for sending the failed controller in for repair.
•
When replacing the controller module, it must be remembered that the controller
board is one of the most sensitive components in the subsystem. All previously
stipulated safety precautions (see Chapter 2) must be strictly adhered to. Failure
to adhere to these precautions can result in permanent damage to the controller
board, resulting in lengthy delays.
•
Prior to replacing the controller module, it is imperative for your own safety to
be sure no power is being supplied to the system.
5.2.3 Removing the Controller Module
To remove the controller module:
Step 1. Stop host I/Os or host applications to avoid losing data or causing
data inconsistency.
Step 2. Turn the subsystem power off: If possible power off the subsystem in
the way described in Chapter 4. If it is not possible to do this turn off
both PSU modules and disconnect the power cords.
Step 3. Disconnect all cables: There may be a number of different cables
attached to the controller module. These cables could include SCSI
cables for host connections, an RS-232C (audio jack) cable for serial
port connection, and an Ethernet cable for network connection. Prior
to removing the controller module, all these cables should be
removed.
Step 4. Loosen the retention hand screws: Hard screws are located on both
sides of the RAID controller’s faceplate. Press these screws and use a
Phillips screwdriver to loosen them so that the controller can be
removed from chassis. (See Figure 5- 1)
Replacing Controller Module Components
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Figure 5- 1: Loosen Controller Module Retention Screws
Step 5. Pull the controller module out: Once the retention screws have been
removed; gently pull the controller module out of the subsystem
chassis.
5.2.4 Replacing the Controller Module
Step 1. Remove the failed controller module. (See Section 5.2.3 above)
Step 2. Install a DIMM module on the new controller module. (See Section
5.5)
Step 3. Insert the replacement controller. Align the controller module with
the module bay at the rear of the subsystem. Gently slide the
controller module in.
Step 5. Fasten the hand screws. Once the controller module has been
completely inserted into the subsystem chassis, secure the controller
module to the chassis by tightening the hand screws at the sides of the
controller rear panel.
Step 6. Connect the controller module cables: Reconnect all of the cables
that were previously disconnected from the controller module. These
may include SCSI cables for host and expansion connections, an RS232C (audio jack) cable for serial port connection, and an Ethernet
cable for network connection.
Step 7. Power on: Once the new controller module has been properly
installed and the cables have been correctly connected, turn the
subsystem power on.
5-4
Replacing Controller Module Components
Chapter 5: System Maintenance
5.3 Replacing or Upgrading Memory Modules
5.3.1 Memory Module Installation Overview
Š
The subsystems come with a pre-installed 256MB (or above) DDR RAM
DIMM module on the controller. The controller supports one memory module
for the capacity up to 1GB. If a DDR RAM DIMM modules with a different
size is preferred or the original memory module has failed in some way, the preinstalled module must be removed and replaced by a new one. Replacement and
installation instructions are described fully below.
Š
The DIMM module is located on the controller board. The controller board is a
sensitive component and must be treated with care to avoid being damaged.
WARNING!
The controller board in the module contains sensitive components. Please ensure
that all anti-static precautions stipulated above are strictly adhered to. Only
qualified engineers can replace a DIMM module.
5.3.2 Selecting a Memory Module
If the memory module mounted on the controller is going to be replaced, the
following factors should be considered when purchasing replacement modules.
Š
Pre-installed DIMM module: The subsystem comes with a 256MB DDR RAM
module pre-installed on the controller board. If you wish to change the size of
the DIMM, then a new, separately purchased DIMM can be installed.
Š
DDR RAM DIMM modules supported. The subsystems support DDR RAM
DIMM modules with the capacities ranging from 256MB to 1GB.
Š
Installation consideration: When installing the DIMM module, it is necessary
to handle the controller module. The controller board is more susceptible to
damage than the other components and must therefore be handled with extreme
care. All anti-static precautions specified in Section 2.3 must be strictly adhered
to.
Š
Secure installation: When replacing the DIMM module, make sure that the new
DIMM module is firmly in place prior to installing the controller module. If the
DIMM module is not firmly in place, the subsystem will not run and the
controller will need to be removed and the DIMM module correctly installed.
Š
Purchasing consideration: When purchasing a DDR RAM DIMM to install on
the controller board, contact your vendor for an updated list of certified
modules.
Replacing or Upgrading Memory Modules
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
5.3.3 DIMM Module Installation
WARNING!
The pre-installed modules must be removed prior to installing new memory
modules. Do this with care. Sensitive components can be damaged during the
process.
If a DIMM module fails or a DIMM module with a higher memory capacity is
required, the DIMM module must be replaced.
Step 1. Remove the controller module. See Section 5.2.3.
Step 2. Remove the previously installed DIMM module from the DIMM
socket. To do this, push the white module clips on the sides of the
DIMM module down together. By doing this, the previously
installed modules will be ejected from the DIMM socket. (See
Figure 5-2)
Figure 5-2: Push Back the Module Clips on the Sides of the DIMM
Socket
Step 3. Gently retrieve the DIMM module out of the DIMM socket. (See
Figure 5-2)
Step 4. Insert the DIMM module into the DIMM socket. Align the DIMM
module with the DIMM socket. Once aligned, gently push the
DIMM module into the socket. The white clips on the sides of the
socket will close automatically and secure the DIMM module into
the socket.
5-6
Replacing or Upgrading Memory Modules
Chapter 5: System Maintenance
Figure 5-3: Insert the DIMM Module
Step 5.
Reinstall the controller module. After the DIMM module has been
properly installed, the controller module must be reinstalled. To do
this, align the controller module with the controller module bay. Then
gently push the controller module in the controller bay. Carefully
push the controller until you feel the contact when the board edge
connectors are mated to the backplane. Do not use force. If unusual
contact resistance is felt, try it again. Next secure the controller
module into the subsystem by fastening the hand screws on the sides.
NOTE:
When replacing a DIMM, the whole subsystem needs to be powered down.
Therefore, when replacing a DIMM, you should carefully select the time when the
replacement will be made in order to minimize the overall disruption to service.
Replacing or Upgrading Memory Modules
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
5.4 Replacing a Faulty BBU
IMPORTANT!
The BBU is hot-swappable, can be replaced while the subsystem is running.
However, a new module will only be recognized after a subsystem reset.
Carefully select the time when the reset will be made in order to minimize the
overall disruption to service.
To replace a faulty BBU, please follow these steps:
Step 1. Remove the faulty BBU module from the chassis. The BBU
module is secured to the chassis with two (2) spring screws. These
screws must be loosened. To loosen, turn the screws
counterclockwise. (See Figure 5-4)
Figure 5-4: Remove the BBU Retention Screws
Step 2. Install the new BBU module. After the faulty BBU module has
been removed, the new BBU module can be installed. To do this,
align the BBU module with the empty slot, and then gently push the
BBU module into the slot. (See Figure 5-5)
Figure 5-5: Install the BBU Module
Step 3. Secure the BBU module to the enclosure. Tighten the two (2)
spring screws as shown above on the back of the BBU module.
5-8
Replacing a Faulty BBU
Chapter 5: System Maintenance
Step 4. Once the new BBU module is correctly installed into the subsystem,
the LED should start flashing, indicates the BBU is being charged.
When the BBU is fully charged, the LED will go off.
5.5 Replacing a Failed PSU Module
5.5.1 Notes on PSU Module Maintenance
•
Two redundant PSU modules: The subsystem comes with two 350W, fully
redundant, hot-swappable PSU modules. These modules are accessed from the
rear of the subsystem.
•
Immediate replacement: When a PSU fails, it should ideally be replaced
immediately. Do not remove the PSU module unless a replacement is readily
available. Removing a PSU without a replacement will cause severe disruptions
to the internal airflow and the subsystem will overheat, possibly causing
irreparable damage to some of the subsystem components.
•
PSU bracket: Each PSU module is permanently mounted in a two-level steel
bracket, creating a single unit. The PSU is located in the upper level and a
removable cooling fan module is mounted in the lower level.
WARNING!
Although the subsystems can operate using single PSU module, it is not advisable
to run the Galaxy Raid subsystems with a single PSU module for an extended
period of time.
5.5.2 Replacing the PSU Module
To replace a PSU, please follow these steps:
Step 1.
1.
Turn off the PSU and remove the power cord: Turn of the power
switches located on the right side of each power supply module. See
the diagram below.
Step 2. Once the power switches have been turned off, remove the power
cables that connect the subsystem to the main power. The power connector is
found on the left side of each power supply module.
Replacing a Failed PSU Module
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Step 3.
Remove the retention screw: After the power cable has been
removed from the power connector, remove the retention screw at
the upper right side of the PSU rear-end panel. (See Figure 5- 7)
The screw is located below the extraction lever, beside the LED
indicator, and can be hidden from sight.
Figure 5-6: PSU Parts Identification
Figure 5- 7: Removing the PSU Retention Screw
Step 4.
Pull the extraction handle downward: Push the extraction lever at
the back of the PSU module downwards. This will dislodge the PSU
module from the subsystem. Once dislodged, gently pull the PSU
module out of the subsystem. (See Figure 5- 8).
WARNING!
•
•
•
5-10
When a PSU is pulled out of the chassis, the fan module beneath the PSU is
removed from the chassis at the same time.
Do not remove the PSU module unless a replacement is readily available.
Removing a PSU without a replacement will cause severe disruptions to the
internal airflow and the subsystem will overheat, possibly causing irreparable
damage to some of the subsystem components.
It is recommended that the replacement procedure is completed in less than
five (5) minutes to prevent the subsystem from overheating.
Replacing a Failed PSU Module
Chapter 5: System Maintenance
Figure 5- 8: Dislodging the PSU
Step 5.
Remove the cooling module: To do this, push the clips on either
side of the module rear panel together. Then gently pull the cooling
module out of the lower level of the PSU bracket. (See Figure 511)
Figure 5-9: Remove the Cooling Module
Step 6.
Reinstall the cooling module into the new PSU module: To do
this, align the cooling module with the lower level of the PSU
bracket and gently slide the cooling module in.
Step 7.
Insert the new PSU module into the subsystem: Once the
previously removed cooling module has been installed, insert the
new PSU module into the subsystem. Make sure the extraction lever
is in its downright position so that the saddle notches on the lower
edges of the handle can lock on to the edge metal brackets along the
chassis inner walls. Push the PSU into the slot and pull the handle
upwards to secure the module.
Step 8.
Reinsert the retention screw: If the PSU module is properly
installed, the back end of the module should be aligned with the
Replacing a Failed PSU Module
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
enclosure’s rear panel. To firmly secure the PSUs into place,
reinsert the retention screw.
Step 9.
Reconnect the power cord and turn the power on: Plug the power
cord into the socket on the PSU module and turn the PSU module
power switch on.
5.6 Replacing a Failed Cooling Fan Module
5.6.1 Notes on Cooling Fan Module Maintenance
•
Redundant cooling fan modules: The subsystems are equipped with two or
three redundant, hot-swappable, single-blower cooling fan modules located in
the lower PSU module slot. These cooling fan modules control the internal
operational temperature of the subsystem and therefore their working integrity
should be maintained at all times.
•
Detecting a failed cooling fan module: If a cooling fan module fails, you can be
notified of the failure by the LED located at the back of the module, an audible
alarm, the terminal event prompts, the RAIDWatch Panel View, or through the
various methods by the Configuration Client utility.
•
Replacing a cooling fan module: Once you are notified that a cooling fan
module has failed, it should be replaced as soon as possible. A failed cooling fan
module should only be removed from the subsystem when you have an
immediately available replacement module that can be installed as soon as the
failed cooling fan module has been removed.
WARNING!
•
The latches at the back of the cooling fan module secure the cooling fan
module into the enclosure. If these latches are broken, the warranty on the
cooling fan module will be void.
•
Although the cooling fan modules are fully redundant, it is not advisable to
run the Galaxy Raid subsystems with any of the cooling fan modules missing.
Whenever a cooling fan module fails, the system is at risk of sustaining
irreparable damage.
Keep a failed module in its enclosure bay until a replacement unit is in hand.
•
5.6.2 Replacing a Cooling Fan Module
The cooling fan modules are secured to the chassis with two black latches located on
the rear of the module. To replace the cooling fan module, please follow these steps:
5-12
Replacing a Failed Cooling Fan Module
Chapter 5: System Maintenance
Step 1.
To remove the cooling fan module: Squeeze both side latches
towards the center of the cooling fan module and gently withdraw
the cooling fan module from the subsystem by gently pulling on the
silver handle at the bottom. (See Figure 5- 10).
Release the module
using the latches
Figure 5- 10: Removing the Cooling Fan Module
WARNING!
Forcing or slamming a module into place can damage the connector pins on the
module itself or that on the subsystem backplane.
Step 2.
Install the new cooling fan module: Line the new module up with
the slot into which it will be inserted and then gently push it into the
chassis. The latches will hold the module in place.
5.7 Drive Tray Maintenance
5.7.1 Notes on Hard Drive Maintenance
Š
Hot-swappable drive trays: The drive trays are all hot-swappable. If a hard drive fails, it
can be replaced while the subsystem is still running.
Š
Forearm handles: If the hard drive is behind either the left or right forearm handle, make
sure that the locking mechanism on the side of the handle is first released prior to
opening the handle itself. (See Figure 5- 11) The locking mechanism must also be
released in order to close the handle. Therefore, after the new drive has been installed, it
will be necessary to release the locking mechanism on the handle prior to closing it. For
more information, please refer to Section 1.5 in Chapter 1.
Drive Tray Maintenance
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Figure 5- 11: Forearm Handle Locking Mechanism
5-14
Š
Front flap mechanism: Do not leave a drive tray’s front flap open. The front flap and its
key-lock secure a drive tray to chassis slot. A disk drive operating with the half-open
front bezel may result in signal glitches and Data Compare Errors might ensue.
Š
Remove drives slowly: Although the drive trays are designed to be hot-swappable, when
removing a drive tray from the subsystem, withdraw it from the chassis slowly.
Removing the drive tray too quickly may cause a drive I/O timeout.
Š
Replacement on hand: If a hard drive has failed, make sure you have a replacement hard
drive readily available before removing the failed drive from the subsystem. Do not leave
the drive tray slot open for an extended period of time. If the drive tray slot is left
unoccupied for an extended period of time, the airflow will be disrupted and subsystem
components will overheat and may be permanently damaged.
Drive Tray Maintenance
Chapter 5: System Maintenance
5.7.2 Replacing a Failed Hard Drive
To replace a hard drive, please follow these steps:
WARNING!
Hard drives are fragile. Please always handle hard drives with extreme care. Do
not drop the hard drives; always be slow, gentle and careful when handling a hard
drive. Only handle the hard drives by the edges, avoid touching any components
or connector pins.
Step 1.
Identify the drive tray that contains the hard drive that needs to be
replaced.
WARNING!
Replacing the wrong drive in an array can fatally fail a RAID configuration. You
should identify a failed drive from the RAIDWatch GUI screen, by checking the
drive slot ID in the terminal screen, by checking the LEDs on the drive tray panel,
and/or use the identify/flash drive function in firmware. Please refer to Section 1.5
in your Generic Operation Manual for details on this function.
Step 2.
Open the front flap: Once the drive tray has been identified, push
the release button at the drive bezel. (See Figure 5-12) The front
bezel will automatically be lifted and the drive tray should be easily
dislodged from the chassis.
Figure 5-12: Front View of an Individual Drive Tray
Step 3.
Drive Tray Maintenance
Remove the drive tray. To remove the drive tray from the
enclosure, the key-lock must be unlocked. (See Figure 5-13) To do
this, turn the key-lock on the front of the drive tray until the groove
on its face is in a horizontal orientation.
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Figure 5-13: Drive Tray Key-Lock Rotation
Step 4.
Remove the drive tray along with the hard drive in it. Once the
drive tray is dislodged from the chassis, gently and carefully
withdraw the drive tray from the chassis.
Step 5.
Remove the hard drive from the drive tray: Loosen the four
retention screws (two on each side) to remove the hard drive from
the drive tray.
Step 6.
Install the new hard drive: Please refer to the complete hard drive
installation procedures in Section 2.9.
Figure 5- 14: Drive Tray Retention Screws
Step 7.
5-16
If the failed drive is a member of a RAID 1, 3, or 5 array, once it is
replaced the subsystem should immediately start to rebuild the
array. The drive activity LEDs should start to flash.
Drive Tray Maintenance
Appendix A
Subsystem Specifications
A.1 Technical Specifications
Environmental Specifications
Humidity
Temperature
Altitude
5 to 95% (non condensing – operating and non-operating)
Operating: 0º to 40ºC
Non-operating: -40º to 60ºC
Sea level to 12,000ft – operating
Sea level to 20,000ft – non-operating
Power Requirements
Input Voltage
115VAC @ 6A
240VAC @ 3A with PFC
(auto-switching)
Frequency
47-63Hz
Power
Consumption
350W
Dimensions
w/o front handles
w/ front handles
Height
88mm
88mm
Width
446mm
482mm
Length
490mm
505mm
Package dimensions: 344H x 600W x 670D mm
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
System Weight
Net weight: 23.5kg
Gross weight: 25.0kg (without disk drives)
EMI/EMC
•
•
FCC Class-B
CE
Safety Requirements
•
UL
•
CB
Shock
Half-sine
Operating: 5G peak, 11ms duration
Non-operating: 15G, 11ms, half-sine
Vibration
Operating
0.5oct/min
Non-operating
0.5oct/min
Warning Alarms
•
•
•
•
A-2
LCD screen messages
Audible alarms
System LEDs
Event notification via the RAIDWatch Manager (LAN broadcast, email, fax,
MSN, ICQ, SMS, and SNMP traps) and RS-232C terminal display
Technical Specifications
Appendix A: Subsystem Features
A.2 Controller Specifications
A.2.1 Configuration
Specification
RAID Levels
0, 1(0 + 1), 3, 5, 10, 30, 50, JBOD, and non-RAID disk
spanning
Host OS
Compatibility
Host OS independent; supports all major platforms
Host Interface
Host Channels
Drive Interface
Drive Channels
Caching Mode
Cache Memory
Number of LUN’s
Multiple Target
IDs/Host Channel
Firmware on Flash
Memory
2 SCSI-320 channels via 2 dual-stacked VHDCI
connectors
2 pre-configured SCSI-320 host channels
Supports 8 or 12 channel connections to 3Gbps SATA-II
disk drives, SATA-I backward compatible
All drive channels are pre-configured, routed through a
back-end PCB and cannot be changed
Write-through or Write-back
Pre-installed 256MB (or above) DDR RAM DIMM
with/without ECC, in one DIMM socket
Up to 32 per host ID
Yes
Yes
A.2.2 Architecture
Specification
CPU
Gigabit Ethernet
DIMM Slot
ASIC
Flash ROM
NVRAM
Hardware XOR
Real-time Clock
Controller Specifications
IBM PowerPC 750CXr
One 10/100BasedT for local or remote management
access
One 184-pin DDR DIMM module
64-bit chipset (ASIC266)
32Mbit (4MB)
32KB with RTC
Yes
For event messages with time record tracking and
scheduled maintenance tasks, e.g., Media Scan.
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
A.3
Drive Tray Specifications
Specification
Height
Width
Depth
Key Lock
28mm
110mm
218.92mm
Yes
A.4 Power Supply Specifications
Specification
Nominal Power
DC Output
Input Frequency
AC Input
Power Factor
Correction
Hold-up Time
Over-temperature
Protection
Cooling Fans
350W
12.0V: 25A
5.0V: 25A
3.3V: 20A
47 to 63Hz
115VAC @ 6A or 240VAC @ 3A with PFC
Yes
At least 16ms at 115/230VAC full load after a loss of AC
input
Auto shutdown when cooling is lost or elevated
temperature is detected; over-voltage protection is also
available.
Two fans for each unit (inside PSU)
A.5 Cooling Module Specifications
Specification
Speed
Max. Air Flow
(each module)
Input Power
Rated Voltage
Temperature
A-4
High or low rotation speed controlled by firmware
High speed: 31.8 CFM
Low speed: 20.1 CFM
9/3.12W max.
DC 12V
Operating: -10 to +60ºC
Storage: -20 to +70ºC
Drive Tray Specifications
Appendix A: Subsystem Features
A.6 RAID Management
Specification
•
•
Configuration
•
Performance
Monitoring
Remote Control and
Monitoring
LCD keypad panel
Text-based firmware-embedded utility over RS232C connection through the included audio jackto-DB-9 serial cable
The RAIDWatch Manager program using
Ethernet connection
Yes
Yes
Event Notification
Yes (via RAIDWatch’s sub-modules, Configuration
Client or NPC)
Management
Connection
In-band over Ethernet, or RS-232C
Configuration on
Disk
Failure Indicator
Configuration data stored on disk drives for logical drive
assemblies to exist after controller replacement; basic
settings, e.g., channel mode settings, are stored on
NVRAM
Via audible alarm, LCD keypad panel, RAIDWatch
Manager session, event notifications, or event prompts on
terminal emulation
A.7 Fault Tolerance Management
Specification
SATA drive SMART
support
Battery Back-up Option
ISEMS (Simple Enclosure
Management Service) via
I2C Interface
Automatic Drive Failure
Detection
Regenerate Logical Drive
Parity
Bad Block Reassignment
Automatic Rebuild upon
Failed Drive Replacement
Automatic Rebuild on Spare
Drives
Manual Clone of Suspected
Failed Drive
RAID Management
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
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Galaxy Raid GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
Concurrent rebuild on
Multiple Drives in a RAID
(0 + 1) Logical Drive
Salvage the 2nd Temporarily
Failed Drive in a RAID 1, 3
or 5 Logical Drive
Salvage the 1st Temporarily
Failed Drive in a RAID 0
Logical Drive
A-6
Yes
Yes
Yes
Fault Tolerance Management
Appendix B
Spare Parts and Accessories
B.1 Spare Parts
B.1.1 Spare Parts Overview
Except the RAID controller module, all the active components in the subsystems can
be replaced while the system is running. If any of these components fails then it can,
if configured in a fully redundant mode, be hot-swapped. Spare parts for the
subsystems can be ordered separately. This section lists the model names for the
different spare parts.
B.1.2 Spare Parts List
Except the controller module, the spare parts shown below are common to both the 8bay and the 12-bay models.
Model Name
Description
GALHDX-9273CDTray
Drive tray, type-III bezel and type-II LED lightpipe.
GALHDX-9272CPSU
Power supply module, 350W capacity.
GALHDX9272CFanMod
Dual-speed
subsystems
GALHDX-9273CBTC
Battery cell pack, Li-ION battery cells
GALHDX-9272CHandR
Right-side forearm handle for 2U subsystems
GALHDX9272CHandLLCD
Left-side forearm handle for 2U subsystems, an LCD
keypad panel mounted on it
version
of
cooling
fan
module:2U
Table B-1: Spare Parts List
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
B.1.3 Controller Modules
Model Name
Description
GHDX8-7370S-U320
SCSI-to-SATA RAID controller module, 2 x
SCSI-320 host channels, 8 x SATA II drive
channels.
GHDX12-7370S-U320
SCSI-to-SATA RAID controller module, 2 x
SCSI-320 host channels, 12 x SATA II drive
channels.
Table B-2: Controller Module List
B-2
Spare Parts and Accessories
Appendix B: Spare Parts and Accessories
B.2 Accessories and Optional Items
B.2.1 Accessories Overview
A number of accessory items are available for the Galaxy RAID subsystem. Some of
these accessory items come with the subsystem; but if damaged or if more accessory
items are needed, they can be ordered separately. Available accessory items are listed
below:
B.2.2 Accessory Parts List
Model Name
Description
GALHDX9270UHstCab
SCSI external round cable, DB68-to-VHDCI
GALHDX9270UJBODCab
External SCSI round cable, VHDCI-to-VHDCI
* One included in the shipping package
GALHDX9270ASCab
RS-232C serial cable, audio-jack to DB9
* One included in the shipping package
GALHDX9011
Null modem, DB9 female to DB9 male, wires
swapped
* One included in the shipping package
GALHDX9272CEslide28
Slide rails for 21"~28.5" deep racks
GALHDX9272CEslide36
Slide rails for 23"~36" deep racks
Table B-3: Accessories List
Spare Parts and Accessories
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Galaxy RAID GALHDX-7370S-8+12U4D Installation and Hardware Reference Manual
B-4
Spare Parts and Accessories
Appendix C
Pinouts
C.1. SCSI Port: VHDCI Connector Pinouts
The SCSI port connector pinouts comply with specifications in T10 Working Draft, Project
1365D, SCSI Parallel Interface-4.
* NC = No Connection, * GND = Ground,
* TPWR = Terminator Power
Pin
Name
Pin
Name
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
SD12+
SD13+
SD14+
SD15+
SDP1+
SD0+
SD1+
SD2+
SD3+
SD4+
SD5+
SD6+
SD7+
SDP0+
GND
DIFSENS
TPWR
TPWR
NC
GND
SATN+
GND
SBSY+
SACK+
SRST+
SMSG+
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
SD12SD13SD14SD15SDP1SD0SD1SD2SD3SD4SD5SD6SD7SDP0GND
GND
TPWR
TPWR
NC
GND
SATNGND
SBSYSACKSRSTSMSG-
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Galaxy RAID GALHDX-7370S-8+12U4D0607 Installation and Hardware Reference Manual
27
28
29
30
31
32
33
34
SSEL+
SC_D+
SREQ+
SI_O+
SD8+
SD9+
SD10+
SD11+
61
62
63
64
65
66
67
68
SSELSC_DSREQSI_OSD8SD9SD10SD11-
C.2. COM1 Cable: DB9 and Audio Jack Pinouts
Figure C-1: Serial Port Cable CN1 and CN2 Connectors
COM 1 Cable: Connects a PC running a terminal emulation program
CN1 Pin Number
1
2
3
CN2 Pin Number
1
2
3
4
5
6
7
8
9
Pin Name
Ground
TXD
RXD
Pin Name
NC
RXD
TXD
DTR
GND
DSR
RTS
CTS
NC
♦ Pin 4 and Pin 6 are shorted
♦ Pin 7 and Pin 8 are shorted
Table C-1: COM 1 Cable, RS-232C (Audio Jack)
Pin Out Definitions
C-2
COM1 Cable: DB9 and Audio Jack Pinouts
Appendix C
Pinouts
NOTE:
A null modem is used for wire-swap and is necessary for connecting in between
COM1CN2 and a PC serial port.
C.3. GAL-9011 Null Modem
Swap Pin 2 and Pin 3
Swap Pin 4 and Pin 6
Swap Pin 7 and Pin 8
Table C-2: Null Modem Pinouts
C.4. Ethernet Port Pinouts
Figure C-2: LAN Port Pinouts
Pin
Pin Name
Pin
Pin Name
1
LAN_TXP
5
N2
2
LAN_TXN
6
LAN_RXN
3
LAN_RXP
7
N1
4
N2
8
N1
Table C-3: Ethernet Port Pinouts
C.5. Main Power
IEC-type receptacle.
C-3
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left blank.
C-4
Main Power
Appendix C
Pinouts
Main Power
Main Power
C-5