CDMA CELLULAR
TELEPHONE
SCH-811
SERVICE
CDMA CELLULAR TELEPHONE
Manual
CONTENTS
1. General Introduction
2. Specification
3. Installation
4. NAM Programming
5. Product Support Tools
6. Troubleshooting
7. Exploded view and its Part List
8. Electrical Parts List
9. PCB diagrams
10. Block & circuit diagrams
SAMSUNG PROPRIETARY-CONTENTS MAY CHANGE WITHOUT NOTICE
ELECTRONICS
Samsung Electronics Co.,Ltd.
GH68-00398A
1999. 3. REV. 1.0
1. General Description
The SCH-811 cellular phone functions as both analog cellular phone working in AMPS (Advanced Mobile
Phone Service) mode and digital cellular phone working in CDMA (Code Division Multiple Access) mode.
CDMA type digital mode applies DSSS (Direct Sequential Spread spectrum) mode which first came to be used
in the military.
The DSSS reduces channel cross talk and allow to use one frequency channel by multiple users in the same
specific area, resulting in increase of channel capacity to about ten times compared to that of analog mode
currently used.
Soft/Softer Handoff, Hard Handoff, and Dynamic RF Power Control technologies are combined into this phone
to reduce the call drop while usage.
CDMA digital cellular network consists of MSO (Mobile Switching Office), BSC (Base Station Controller),
BTS(Base Station Transmission System), and MS (Mobile Station). MS meets the specifications of the below:
E IS-95A : Mobile Station-Base Station Compatibility Standard for Dual-Mode Wideband Spread Spectrum
Cellular System
E IS-96A : Speech Service Option 1 Standard for Dual-Mode Wideband Spread Spectrum Cellular Systems
E IS-98A : Standards for Dual-Mode Wideband Spread Spectrum Cellular Mobile Station
E IS-126 : Mobile Station Loopback Service Options Standard
SCH-811 is composed of main handset, rapid charger, three batteries (1600 mAh, 1000 mAh, 550mAh), handsfree kit, car adaptor, and travel charger. Hands-Free Kit is designed to be operated in full-duplex mode taking
turn-around delay between the phone and the system into account.
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1-1
2. Specification
2-1 General
Frequency Range
Transmitter
Receiver
Digital Mode
: 824 ~ 849 MHz
: 869 ~ 894 MHz
Analog Mode
824 ~ 849 MHz
869 ~ 894 MHz
Channel Spacing
: 1.23 MHz
30kHz
Number of Channels
: 20 FA
832CHs
Duplex Spacing
: 45 MHz
45MHz
Frequency Stability
: ±2.5 ppm (-20ûC ~ +60ûC, -4ûF ~ +140ûF)
Operating Temperature
: -30ûC~+60ûC (-4ûF ~ +140ûF)
Operating Voltage
HHP : 3.6V DC (±10%)
Hands-free : 13.7V DC (±10%)
Size and Weight : 88.0 x 56.5 x 26.7/27.6/31.3 mm
including slim battery : 117.3 g
including standard battery : 145.2 g
including extended battery : 160.5 g
Operating Time
Digital Mode Standby Time
Talk Time
2-1
: up to 36 hours (with slim battery)
: up to 65 hours (with standard battery)
: up to 100 hours (with extended battery)
: up to 75 min (with slim battery)
: up to 150min (with standard battery)
: up to 240min (with extended battery)
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2-2 Digital Mode
Waveform Quality
Time Reference
Rx Sensitivity and Dynamic Range
Tx Output Power
Tx Frequency Deviation
Occupied Band Width
Tx Conducted Spurious Emission
Minimum Tx Power Control
Open Loop Power Control
Standby Output Power
Colsed Loop Tx Power Control Range
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0.944 or more
±1uS or less
-104dBm, FER=0.5% or less
-25dBm, FER=0.5% or less
320mW (25dBm)
±300Hz or less
1.32MHz
900KHz : -42dBc / 30KHz below
1.98MHz: -54dBc / 30KHz below
below -50dBm
-25dBm: -57.0dBm ~ -38.5dBm
-65dBm: -17.5dBm ~ + 1.5dBm
-104dBm: +18.0dBm ~ +30.0dBm
below -61dBm
Test1: ±24dB or less
Test2: 0mS ~ 2.5mS
Test3: ±24dB or more
Test4: ±24dB or more
Test5: ±24dB or more
2-2
2-3 ANALOG MODE
TRANSMITTER
RF output power
Carrier ON/OFF conditions
ÒONÓ Condition
ÒOFFÓ Condition
Compressor
Compression Rate
Attack Time
Recovery Time
Reference Input
Preamphasis
Maximum Freqency Deviation
F3 of G3
Supervisory Audio Tone
Signaling Tone
Wideband Data
Post Deviation Limiter Filter
3.0 ~ 5.9KHz
5.9 ~ 6.1KHz
6.1 ~ 15KHz
Over 15KHz
0.6W (+2/-4dB)
within ±3dB of specification output (in 2mS)
below-60dBm (in 2mS)
2:1
3mS
13.5mS
Input level for producing a nominal ±2.9KHz
peak freqency deviation of transmitted carrier
6dB/OCT within 0.3 ~ 3KHz
±12KHz
±2KHz (±10%)
±8KHz (±10%)
±8KHz (±10%)
above 40 LOG (F/3000) dB
above 35 dB
above 40 LOG (F/3000) dB
above 28 dB
Spectrum Noise Suppression
For all modulation
f0+20KHz ~ f0+45KHz
For modulation by voice and SAT
f0 +45KHz
For modulation by WBD(without SAT)
and ST (with SAT)
f0+45KHz ~ f0+60KHz
f0+60KHz ~ f0+90KHz
f0+90KHz ~ 2f0
Harmonic and conducted Spurious Emissions
2-3
above 26 dB
above 63 +10 LOG (PY) dB
above 45 dB
above 65 dB
above 63 +10 LOG (PY) dB
(where f0=carrier frequency
PY=mean output power in watts)
below 43 + 10 LOG (PY) dB
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RECEIVER
De-Emphasis
Expander
Expander Rate
Attack Time
Recovery Time
Reference Input
Sensitivity
-6dB / OCT within 0.3 ~3KHz
1:2
within 3mS
within 13.5mS
output level to a 1000Hz tone from a carrier
within ±2.9KHz peak frequency deviation
12dB SINAD / -116dBm
Intermodulation Spurious Response Attenuation
avove 65dB
RSSI Range
above 60dB
Protection Against Spurious Response
Interference
above 60dB
In Band Conducted Spurious Emission
Transmit Band
Receive Band
Other Band
below -60dBm
below -80dBm
below -47dBm
Radiated Spurious Emission
Frequency Range
25 ~ 70 MHz
70 ~ 130MHz
130 ~ 174 MHz
174 ~ 260 MHz
260 ~ 470 MHz
470 ~ 1GHz
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Maximum Allowable EIRP
-45dBm
-41dBm
-41 ~ -32dBm
-32dBm
-32 ~ -26dBm
-21dBm
2-4
2-4 CDMA Debug Display Information (menu 8)
IN IDLE MODE
1
2
3
Sxxxx
4
SIx
T-xx
x
Dxxx
Pxxx
-xx
6
CHxxx
8
7
5
IN CONVERSATION MODE
9
10
TEx
T-xx
Pxxx
REx
11
xx
Dxxx
x
-xx
3
CHxxxx
1 : Sxxxxx : SID (System ldentification) toggle
Nxxxxx : NID (Network Identification) toggle
2 : SIx : Slot cycle index (lowest between the system and the phone will be used)
3 : Handset Status : 0 - Acquisition
1 - Synchronization
2 - Paging (Idle)
3 - Traffic Initialization
4 - Traffic Mode
5 - Exit
4 : T-xx : Tx adjust, Value ranges from +63 ~ -63dB
5 : Dxxx : sector power in dBm
6 : -xx : Ec/Io
7 : Pxxx : PN offset
8 : CHxxxx : channel number
9 : TEx : Tx vocoder rate (8 is full rate, 1 is 1/8th rate)
E : EVRC
V : 13k or 8k
10 : REx : Rx vocoder rate (8 is full rate, 1 is 1/8th rate)
11 : xx : Walsh code used in traffic channel
2-5
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2-5 FM Debug Display Information (menu 8)
1
4
SIDxxxxx
2
PWRx
SATx
3
x
RSSIxxx
5
CHxxxx
6
1 : SIDxxxxx : FM Home System ID
2 : PWRx : Power Level 0~7
3 : SATx : Supervisory Audio Tone code (0~3)
4 : x (Using Frequency Band) : A Band or B Band
5 : RSSIxxx : RSSI value
6 : CHxxx : Using Channel
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2-6
3. Installation
3-1 Installing a Battery Pack
1. To attach the battery pack after charging, align it with the phone about 1cm (1/2 inch away from its place so
that the two arrows on the phone are seen, the battery charge contacts pointing downward.
2. Slide the battery pack upwards until it clicks firmly into position. The phone is now ready to be turned on.
3. To remove the battery pack, release it by pressing the button on the rear of the phone.
4. Slide the battery pack downward about 1cm (1/2inch and lift it away from the phone.
Press this button to
release the battery pack
3-1
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3-2 For Desk Top Use
1. Choose a proper location to install the charger for Desk Top use.
2. Plug the power cord of the charger into an appropriate wall socket. When the power is connected correctly,
the lamps turn on briefly.
3. To charge the battery pack, insert the battery pack into the rear slot of the charger. The lamp marked BAT on
the front panel of the charger ights up red.
4. If you do not wish to use the phone while charging the battery, insert the phone with the battery pack
attached into the front slot of the charger. The lamp marked PHONE on the front panel of the charger lights
up red.
SLIM
BATTERY PACK
STANDARD
BATTERY PACK
EXTENDED
BATTERY PACK
Figure 3-1 Charging the Phone and Battery
item
Model Name
Desk Top Rapid Charger
Service Part#
DTC81
Slim Battery Pack
BTI81AB
Standard Battery Pack
BTS81AB
Extended Battery Pack
BTE81AB
GH43-00060A
SPECIFICATIONS USING ÒDTC 81Ó
Product
Charging time (hours)
Stand by time (hours) Talking time(min)
Front
Rear
Digital
Digital
2
2
36
75
Standard Battery Pack (Li-ion: 1000mAh)
2.5
4
65
150
Extended Battery Pack (Li-ion: 1600mAh)
3
5
100
240
Slim Battery Pack (Li-ion: 550mAh
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3-2
3-3 For Mobile Mount
3-3-1 Cradle
1. Choose a location where it is easy to reach and does not interfere with the driverÕs safe operation of the car.
2. Separate the two halves of the clamshell by removing the two large slotted screws. See the figure 3-2.
3. Drill holes and mount the lower half of the clamshell by using the screws.
4. Place the cradle onto the remaining half of the clamshell and assemble them by using the screws.
5. Reassemble the two halves of the clamshell together. Adjust the mounting angle and tighten the two slotted
screws.
CRADLE
CLAM SHEEL
MOUNT UPPER
CELLULAR
PHONE
FIXED SCREW
HANDS
FREE BOX
CLAM SHEEL
MOUNT LOWER
CAR
32
32
Figure 3-2 Cradle Installation
3-3-2 Hands-Free Box
1. Drill holes in a proper location for the hands-free box, attach the mounting bracket by using the screws. See
the figure 3-3.
2. Install the hands-free box into the bracket.
3-3
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3-3-3 Hands-Free Microphone
1. It is recommended to install the microphone where it is 30-45 cm (12-18inch away from the driver. Choose
the location where is least susceptible to interference caused by external noise sources, ie, adjacent windows,
radio speakers, etc. Normal place is the sun visor.
2. Once the microphone has been correctly positioned, connect the microphone wire to the MIC jack on the
hands-free box.
MOUNTING BRACKET
Figure 3-3 Hands-Free Box 1 Installation
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3-4
3-3-4 Cables
1. Connect the cradle and the hands-free box with the data cable. See the figure 3-4.
2. Connect the antenna cable to the RF jack of the cradle.
3. Connect the power cable as follows:
Connect the red wire to the battery (+) terminal, black wire to the vehicle chassis. Then connect the battery (-)
terminal to the vehicle chassis. Connect the yellow wire to the switched side of the ignition switch, and then
connect the white to the stereo mute wire from your vehicle stereo.
4. Connect the other end of the power cable to the PWR jack of the hands-free box.
Notes:
It is recommended to connect the power cable directly to the battery to avoid power noise.
Make sure the connection, in the vehicle, between the battery (-) terminal and vehicle chassis is made correctly.
Make sure the fuse having a proper capacity is used on the power cable.
Make sure the cables do not pass over any sharp metal edge that may damage it.
Micro Phone
Yellow(Ignition)
White(Stereo Mute)
Red(Vehicle Battery)
Black(GND)
3-5
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4. NAM Programming
NAM features can be programmed as follows:
Notes:
-If you enter the NAM program mode, each item shows the currently stored data. Go to the next item by
pressing OK.
-You can modify the data by entering a new data.
-If you enter a wrong digit, press CLR to delete the last digit. Press and hold CLR to delete all digits.
-To scroll items backwards or forwards, press the VOLUME button on the left side of the phone.
4-1 General Setup
LCD Display
Key in
Function
47*869#08#9
1
-selects NAM programming
-choose ÔGENERALÕ
ESN
E9031F77
Volume ▼
-Electronic Serial Number of the phone is displayed
CAI version
3
Volumet
-Common Air Interface version is displayed
Volume ▼
-Vocoder Rate
Volume ▼
-Station Class Mark displays the power class,
transmission, slotted class, dual mode.
NAM program
1:General
2:Setup NAM1
3:Setup NAM2
VOC13K/8K
SO_VOICE_08K
SCM
01101010
Lock Code
0000
Slot Mode
Yes
Slot Index
2
OK -store it.
Pref NAM(1~4)...
Digital pref
4-digit code
OK
Lock code, current ststus is displayed
-to change, enter new code.
-store it
F or E
OK
Slot mode. ÔYesÕ indicates the slot mode.
-changes the status.
-store it.
0-7
Slot mode index. The higher, the longer sleeping time
-to change, enter new one.
F or E
OK
Preferred system selection for NAM(1~4).
Up to four NAMs are allowed for the phone. This lists
one of the four NAMs and allows you to program both
the FM and CDMA settings.
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4-1
4-2 Setting Up NAM1
LCD Display
Key in
NAM Program
1:General
2:Setup NAM1
3:Setup NAM2
2
-Choose ÔSetup NAM1.Õ
Setup NAM1
1:Phone #
2:FM
3:CDMA
1
-Choose ÔPhone #Õ
Phone number
OK
-directory number
-to change, enter new one.
-store it.
Phone number
OK
-Phone number currently used.
-to change, enter new one.
-store it.
2
-Choose ÔPhone #Õ
ID number
OK
System ID for home, current ststus is displayed.
-to change, enter new one.
-store it.
Channel number
OK
Current 1st paging channel.
-to change, enter new one.
-store it.
ID number
OK
Acquisition system ID 1, current status is displayed.
-to change, enter new one.
-store it.
ID number
OK
Acquisition system ID2, current status is displayed.
-to change, enter new one.
-store it.
Phone #
1234567890
Mobile ID #
1234567890
Setup NAM1
1:Phone #
2:FM
3:CDMA
FM HOME SID
4369
FM 1st Chn
333
FM Acq SID1
4
FM Acq SID2
0
FM LockSID 1
0
Auto Reg
4-2
ID number
OK
Function
Lock system ID 1, current status is displayed.
-to change, enter new one.
-store it.
FM Registration, current status is displayed.
-changes the status.
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LCD Display
Yes
Key in
F or E
OK
ÔYESÕ to enable, ÔNOÕ to disable.
-store it.
F or E
OK
Preferred system selection, current status is displayed.
-changes the system.
ÔYESÕ to enable, ÔNOÕ to disable.
-store it.
F or E
OK
Current Access Overload Class.
-changes the system.
-store it.
3
-choose ÔCDMAÕ
number
OK
IMSI Moble Country Code, current code is displayed.
-to change, enter new one.
-store it.
number
OK
IMSI Mobile Network Code, current code is displayed.
-to change, enter new one.
-store it.
F or E
OK
Preferred system selection, current system is displayed.
-changes the system.
-store it.
class number
OK
CDMA Access Overload Class, current status is displayed.
-to change, enter new one.
-store it.
channel number
OK
Preferred channel currently used under system A
-to change, enter new one.
-store it.
channel number
OK
Preferred channel currently used under system B
-to change, enter new one.
-store it.
channel number
OK
Second channel currently used under system A
-to change, enter new one.
-store it.
FM preq...
A only
FM ACCOLC
0
Setup NAM1
1:Phone #
2:FM
3:CDMA
IMSI_MCC
000
IMSI_MNC
00
CDMA pref..
A only
CDMA ACCOLC
0
Pchn Sys A
779
Pchn Sys B
779
Schn Sys A
738
Function
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4-3
LCD Display
Schn Sys B
738
CD Acq SID 1
0
CD lockSID 1
0
CDMA Home SID
Yes
CDMA fSID
Yes
CDMA fNID
Yes
Key in
channel number
OK
Second channel currently used under system B
-to change, enter new one.
-store it.
ID number
OK
1st Acquisition system ID, current status is displayed.
-to change, enter new one.
-store it.
ID number
OK
1st lock system ID,current status is displayed.
-to change, enter new one.
-store it.
F or E
OK
CDMA Home system ID, current status is displayed
-changes the status.
-store it.
F or E
OK
CDMA foreign SID, current status is displayed.
-changes the system.
-store it.
F or E
OK
CDMA foreign NID, current status is displayed.
-changes the system.
-store it.
number
OK
first SID written in the list, current status is displayed.
-to change, enter new one.
-store it.
number
OK
first NID written in the list, current status is displayed.
-to change, enter new one.
-store it.
number
OK
2nd SID written in the list, current status is displayed.
-to change, enter new one.
-store it.
number
OK
2nd NID written in the list, current status is displayed.
-to change, enter new one.
-store it.
number
OK
3rd SID written in the list, current status is displayed.
-to change, enter new one.
-store it.
number
OK
3rd SID written in the list, current status is displayed.
-to change, enter new one.
-store it.
SID #1
2222
NID #1
1
SID #2
2222
NID #2
2
SID #3
2222
NID #3
3
4-4
Function
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LCD Display
SID #4
2222
NID #4
15
Key in
number
OK
number
OK
Setup NAM1
1:Phone #
2:FM
3:CDMA
Function
4th SID written in the list, current status is displayed.
-to change, enter new one.
-store it.
4th NID written in the list, current status is displayed.
-to change, enter new one.
-store it.
LCD returns to the NAM1 setup mode.
4-3 Setting Up NAM2,3,4
The NAM2,3,4 setup program is the same as Ô4-2 Setting Up NAM1Õ.
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4-5
5. Product Support Tools
5-1 General
IMPORTANT INFORMATION
Purpose
The Product Support Tool (PST) offers you the ability to interface with the SAMSUNG CDMA telephone using
a PC. With this tool you can program the phones network system requirements and functionality, swap phone
data, and download software upgrades. This document supports UniPST version 1.xx.
NOTE: This software must be executed in the Windows95/98 mode.
EQUIPMENT REQUIRED
Make sure you have the following equipment setup:
1. Minimum PC configuration: 586 CPU, 16MB RAM, Windows95/98, 5MB of disk space free for software
upgrade.
2. PST Software with appropriate cable (DM Cable for SAMSUNG CDMA phone).
3. Serial Port (16550 Serial Interface Card).
4. POWER SUPPLY (3.8V) OR BATTERY
INSTALLATION
Software
1.Insert the PST floppy disk into drive (A:\).
2.Create an appropriate directory on the C:\ drive for PST software, Execute Setup.exe file,
The installation program creates folder and task bar on the windows95/98 start bar.
SAMSUNG CDMA Phone
The serial port should be configured to COM1 or COM2.
Use the following procedure to connect the phone, cable, and PC .
Plug the female end of the DM Cable into the 16550 card.
Pull the black rubber connector away from the socket at the base of the phone.
Plug the special connector on the cable into the socket at the base of the phone.
5-1
SAMSUNG Proprietary-Contents may change without notice
5-2. PST (Product Support Tool)
5-2-1 Getting Started
MAIN MENU SCREEN
1. At the Windows95/98, Double Click ÒUniPst.exeÓ.
2. The Main Menu Screen will be displayed.
The Main Menu Screen shows the basic tasks that are available.
CAUTION: DO NOT attempt to program phone with a low battery.
PST SETUP
UniPst supports SAMSUNG CDMA portable telephone. You can select serial port COM1 or COM2.
5-2-2 Operation Procedure
Service Programming
The Service Programming screens enable you to set and change the service activation parameters of the
phones. These items can be changed individually or as a group via the ÒEdit ItemsÓ Property Sheet of the PST.
There are several pages on the Service Programming Property Sheet (See below Figure).
Read Data from File
Click ÒopenÓ icon to select the name of a file whose extension is ÒmmcÓ. The values will be read from the
named file, and will initialize the parameter values seen on the Service programming screen
Read Data from Phone
Click Read from the Phone icon to upload the current programmable parameters of the phone. The values are
read from the phone, so the phone must have the power ON and be properly connected to the PST.
NOTE: To actually view the data you need to go to the Edit Items screens.
Edit Items
Click this icon to edit Number Assignment Module (NAM) items or UI items.
There are two types of screens:
1. Parameters associated with a particular Number Assignment Module (NAM)
2. UI items settings
Phone Book
Click this icon to edit Phone Book.
While you edit cell, you can use <Enter> and < UP , DOWN,LEFT,LIGHT Arrow> and <SPACE> key. If you
want to edit phone number or name , you must move rectangle box to cell where you want to edit , Write it
down . if <UP and DOWN Arrow> key is pressed, the cursor moves to next cell or previous cell.
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5-2
Save Data to File
Click this icon to save the current parameters to a file. Once you enter a filename, Click <OK> button to write
all current parameters to that file. This way the same information can be downloaded into multiple phones.
Write to Phone
Click this icon to write the selected parameter values to the phone. Writing the selected values to the phone
may take up to a minute.
If there are dependencies in a field you can make all the changes in the proper fields and download the
information all together.
If you intend to use this ÒWrite to PhoneÓ feature, it is recommended that you do a ÒRead Data from PhoneÓ
first, and then make the changes, so that nothing gets inadvertently overwritten.
NOTE: DO NOT TOUCH THE PHONE WHILE WRITING IS IN PROGRESS.
Software Download and Upgrade Screen
To begin a software upgrade or download, perform the following steps:
1. From the main menu screen choose DOWNLOAD MODE?
Click open icon to choose a BIN file of the new software to be loaded. Choose the appropriate BIN file, then
Click <Open> (see below figure).
2. Click Download? to begin downloading the file. You will notice various messages and a progress bar that
informs the user what percentage of the downloading has already occurred.
3.Click Mode Select box, then Select SERVICE MODE?to return to the Service Mode Screen.
NOTE: DO NOT POWER OFF WHILE THE PHONE IS BEING DOWNLOADED!
5-3
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5-3 TEST PROCEDURE
5-3-1 Configuration of Test
Spectrum Analyzer
RF In
HP8924C
RF
In/Out
Audio Audio
Out
In
Directional
Coupler
To A-Out
Test Jig
To A-In
DC Power Supply
(+3.93V)
❈ CAUTION : Because there is the loss (0.33V at FM Max Power) of the test jig and Data cable, youÕd better
input 3.93V to the DC Power Supply to use 3.6V (Battery normal voltage) at Cellular phone
Items needed to purchase from SAMSUNG
ITEMS
RF test Cable
Test cable
DM Cable
Test JIG
(RF Interface Pack AssÕy)
PARTS #
GH39-0002A
GH39-30516A
GH39-30525A
GH80-10502A
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REMARK
Including
1. Power Cable(Black,Red)
2. 9-pin RS232 data Cable
5-4
5-3-2 List of Equipment
- DC Power Supply
- Test Jig
- Test Cable
- CDMA Mobile Station Test Set
- Spectrum Analyzer(include CDMA Test Mode)
HP8924C, HP83236A, CMD-80, etc
HP8596E
TEST JIG
AUDIO SELECT
LEFT: AUDIO IN
RIGHT: AUDIONOFF
DC POWER INPUT PORT
CHANGE VOLTAGE LEVEL
BY MODEL (3.8VDC)
RED: +
BLACK: GND
UP: AUTO POWER ON
DOWN: NOT USE
AUTO
DB25 CONNECTOR
CPMMECT TO
DB25 CONNECTOR
OF TEST CABLE
A-IN
- DC3.8v +
TO_PC
T
E
S
T
D89 CONNECTOR
CONNECT TO IBM
PC SERIAL PORT
HHP I/F TEST JIG
P
A
C
K
TO_HP
TO
A-OUT
TO
A-IN
BJ11 CONNECTOR
CONNECT TO HP
SERIAL PORT
PROBE
NOT USED
CONNECT TO
AUDIO OUT PORT OF
TEST EQUIPMENT
(USE BNC CABLE)
CONNECT TO
AUDIO IN PORT OF
TEST EQUIPMENT
(USE BNC CABLE)
TEST CABLE
5-5
SAMSUNG Proprietary-Contents may change without notice
TEST CABLE CONNECTIONS
1
MHC 172
2
RF CABLE (1.4 dB Loss)
3
BNC CONNECTOR (RF)
4
PLUG CONNECT TO SCH-811
5
DATA CABLE
6
Dsub 25PIN CONNECTOR (DATA)
Dsub 25 PIN CONNECTOR PIN DESCRIPTION (TEST CABLE 1, BACK SIDE)
DATA DESCRIPTION
Dsub CONN.
PIN NO.
DATA DESCRIPTION
Dsub CONN.
PIN NO.
V_F
12,21
DP_RX_DATA
8
DGND
2,4,6,13,19
HP_PWR
9
BATT
15,16,22
RI
10
C_F
3,20
CD
11
TX_AUDIO
5
RTS
14
DP_TX_DATA
7
CTS
17
RX_AUDIO
1
DTR
18
15
14
1
17
16
2
3
19
18
4
5
21
20
6
7
SAMSUNG Proprietary-Contents may change without notice
23
22
8
9
25
24
10
11
12
13
5-6
5-4. CONVERSION TABLE OF FREQUENCY vs CHANNEL
TYPE
CHANNEL
CONVERSION EQUATION
REMARK
TX
1 ² N² 799
F=0.03 ✕ N + 825.00
FREQUENCY
990 ²N²1023
F=0.03 ✕ (N-1023) + 825.00
N ; CH NUMBER
RX
1 ²N² 799
F=0.03 ✕ N + 870.00
F ; FREQUENCY
FREQUENCY
990 ²N²1023
F=0.03 ✕ (N-1023) + 870.00
Change to Test Mode
A. To change the phoneÕs state from Normal Mode to Test Mode, You should enter the following keys.
Ò*759#813580Ò
B. The command Ò0 1Ó is Suspend.
C. To finish the Test Mode, You should enter the command Ò0 2Ó.
* Note: Make sure to change to ÒDigital onlyÓ or ÒAnalog onlyÓ mode in NAM1,
EST MODE. (Refer to 4. NAM Programming)
Channel Selection and Tx Power Output Level Control
1. Digital Mode (CDMA)
A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ).
B. Ò0 1Ó : Suspend.
C. Ò0 9 0 3 6 3 #Ó : Set to Ô0363Õ channel.
D. Ò0 7Ó : Carrier On.
E. Ò3 4Ó : Spread spectrum to 1.23MHz band width.
F. Ò7 1 2 7 5 #Ó : Output RF power level setting.
Ò275Ó means AGC level and AGC level range is from 0 to 511.
2. Analog Mode ( FM )
A. Enter to Test Mode ( * 7 5 9 # 8 1 3 5 8 0 ).
B. Ò0 1Ó : Suspend.
C. Ò4 6Ó : Vocoder initial to Analog mode.
D. Ò0 9 0 3 8 3 #Ó : Set to Ô0383Õ channel.
E. Ò0 7Ó : Carrier On.
F. Ò7 2 2 7 5 #Ó : Output RF power level setting.
Ò275Ó means AGC level and AGC level range is from 0 to 511.
G. Ò1 0 2Ó : RF Power level control, 2(0~7) means power level .
5-7
SAMSUNG Proprietary-Contents may change without notice
5-5 TEST COMMAND TABLE
Command No.
Signal. Name
Description
01(1F,0,0)
T_SUSPEND_I
Terminate the normal mode, enter to the test mode.
02(3F,0,0)
T_RESTART_I
Terminate the test mode, enter to the normal mode.
03(FD,0,0)
T_SAVE_VAL_I
Save value in EEPROM. (Only for Auto test).
04(1D,0,1)
T_GET_MODE_I
Get mode CDMA or FM (Only for Auto test).
05(1C,1,0)
T_SET_MODE_I
Set mode CDMA or FM. (Only for Auto test).
06(1E,0,0)
T_WRITE_NV_I
Write an EEPROM item (one of the NV items)
07(81,0,0)
T_CARRIERON_I
Turn the carrier on.
08(82,0,0)
T_CARRIEROFF_I
Turn the carrier off
09(83,4,0)
T_LOADSYN_I
Set the synthesizer to the channel specified by ch_data.
10(84,1,0)
T_PWRLEVEL_I
Set the RF power level.
11(85,0,0)
T_RXMUTE_I
Mute the receive-audio signal.
12(86,0,0)
T_RXUNMUTE_I
Unmute the receive-audio signal.
13(87,0,0)
T_TXMUTE_I
Mute the transmit-audio signal.
14(88,0,0)
T_TXUNMUTE_I
Unmute the transmit-audio signal.
15(89,1,0)
T_VOC_ESEC_I
Echo canceller ON/OFF
16(8F,0,0)
T_ST_ON_I
Transmit a continuous Signaling Tone(ST).
17(90,0,0)
T_ST_OFF_I
Stop transmit a continuous Signaling Tone.
19(93,0,0)
T_INDEX_DECR_I
Index dn Key.
20(9E,3,0)
T_LNA_GAIN_WR_I
Write LNA gain.
22(91,96,96)
T_SNDNAM_I1)
Display and send NAM information.
23(95,3,4)
T_SNDVERSION_I
Display and return s/w version .
24(9F,7,8)
T_SNDESN_I
Display and return ESN .
25(92,0,0)
T_BACKLIGHT_ON_I
Turn on the backlight
26(93,0,0)
T_BACKLIGHT_OFF_I
Turn off the backlight
27(96,0,0)
T_LAMP_ON_I
Turn on the LAMP
28(97,0,0)
T_LAMP_OFF_I
Turn off the LAMP
29(9A,5,0)
T_REBUILD_I
Rebuild EEPROM
30(9D,16,0)
T_PLINE_I
Display and return production line information.
32(A0,1,0)
T_SAT_ON_I*
Enable the transmission of SAT.
33(A1,0,0)
T_SAT_OFF_I*
Disable the transmission of SAT.
34(A2,0,0)
T_CDATA_I
Transmit continuous 5-word Reverse CTL CH message.
35(A3,3,0)
T_VOLUME_UP_I
Increase value of the last command (Only for autotest)
36(A4,3,0)
T_VOLUME_DOWN_I
Decrease value of the last command (Only for autotest)
38(A6,3,0)
T_VOC_ENC_OFFSET_I
Vocoder ENC offset.
39(A7,3,0)
T_VOC_DEC_OFFSET_I
Vocoder DEC offset.
(OP,AB,RB)
2)
2)
1)
1)
2)
SAMSUNG Proprietary-Contents may change without notice
5-8
Command No.
Signal. Name
Description
40(A8,4,0)
T_VOC_CDMA_UNITY _GAIN_I
Vocoder CDMA unity gain.
41(A9,0,0)
T_VOC_FM_HFRX_UPGAIN_I
Vocoder FM hfrx upgain.
42(AA,1,0)
T_DTMFON_I
Activate dtmf generator with keycode.
43(AB,0,0)
T_DTMFOFF_I
Deactivate DTMF generator.
44(B0,0,0)
T_COMPANDORON_I
Enable the compressor and expandor.
45(B1,0,0)
T_COMPANDOROF_I
Diable the compressor and expandor.
46(B2,0,0)
T_FM_VCLINE_I*
Enter Analog voice channel state.
47(B3,0,0)
T_FM_AUD_GAIN_I
FM audio gain.
48(B4,0,0)
T_VIBRATOR_ON_I
Active A Vibrator.
49(B5,0,0)
T_VIBRATOR_OFF_I
Inactive A Vibrator.
50(B6,0,4)
T_BATT_TYPE_I
Batt type.
51(B7,1,1)
T_BBA_I
BBA supplier.
52(B9,2,2)
T_HW_VERSION_I
HW version.
53(BA,3,0)
T_CARRIER_I
Target Carrier option (Banner).
54(BB,1,0)
T_VOC13K_I
Target Service option (8K/13K).
55(AC,1,0)
T_EXT_AUDIO_I
External Audio Path ON/OFF.
56(AD,0,0)
T_LOOP_BACK_I
Loopback ON.
57(BC,0,0)
T_MIC_ON_I
Mic path on.
58(BD,0,0)
T_MIC_OFF_I
Mic path off.
59(BE,0,0)
T_ALLPATH_I
60(BF,3,0)
T_FM_TX_GAIN_I
(OP,AB,RB)
2)
Set Rx Path, TX Path Unmute to Earpiece.
FM Tx Audio Gain Control.
2)3)
61(C0,3,0)
2)3)
T_FM_RX_GAIN_I
FM Rx Audio Gain Control.
62(C1,3,0)
T_DTMF_VOL_TX_I
FM Tx DTMF Gain control.
63(C2,3,0)
T_TX_LIMITER_I
64(C3,3,0)
T_FM_SAT_LEVEL_I
65(C4,3,0)
T_FM_FREQ_SGAIN_I
FM Tx Master Gain Control.
66(C5,3,0)
T_FM_ST_GAIN_I
FM TX ST Gain Control.
67(C6,3,6)
T_READ_BATT_I
Reads low batt. Value in Standby or Talk mode.
68(C8,0,3)
T_VBATT1_I
Set the low battery position in the standby.
69(C9,0,3)
T_VBATT2_I
70(CA,3,0)
T_WRITE_BATT_I
71(D1,3,0)
T_CDMA_TXADJ_I
Change pdm TX AGC in CDMA.
72(D2,3,0)
T_FM_TXADJ_I
Change pdm TX AGC in FM.
73(D3,1,0)
T_SET_PA_R0_I
74(D4,4,0)
T_OFF_PA_R0_I
75(D5,0,3)
T_READ_RSSI_I
Read a RSSI.
77(D7,0,3)
T_READ_TEMP_I
Read Temp.
78(D8,0,3)
T_RXRAS_AUTO_I
Adjust RXRAS from 8924C.
79(D9,1,0)
T_BUZZER_ON_I2)
Buzzer On at DTMF 0 key
80(DA,0,0)
T_BUZZER_OFF_I
Buzzer off
5-9
2)3)
FM Tx Limiter Gain Control.
2)3)
FM Tx SAT level Control.
2)3)
2)3)
2)3)
1)
3)
Set the low battery position in the talking.
3)
3)3)
2)
2)
2)
Write low battery Level Value to NVM.
Set TX power Amp ctrl R0.
Off TX power Amp ctrl R0.
3)
SAMSUNG Proprietary-Contents may change without notice
Command No.
Signal. Name
Description
81(E3,0,0)
T_VOC_PCMLPON_I
Play a PCM LOOP BACK.
82(E4,0,0)
T_VOC_PCMLPOFF_I
Play off a PCM LOOP BACK.
85(E7,0,0)
T_SPEAKER_ON_I
Turn on the speaker path.
86(E8,0,0)
T_SPEAKER_OFF_I
Turn off the speaker path.
87(E9,0,0)
T_FM_LOOP_TEST_I
Play a PCM FM loopback.
88(EA,0,0)
T_TRK_ADJ_I3)
FM TRK_LO_ADJ control.
89(EB,0,0)
T_CD_TRK_ADJ_I3)
CDMA TRK_LO_ADJ control.
92(F2,3,0)
T_TXRAS_ADJ_I
TXRAS adj = TX RAS offset array.
93(F3,3,0)
T_RXRAS_ADJ_I
RXRAS adj = RX RAS offset array.
94(F4,4,0)
T_HW_CHANFLAT_T
H/W Channel Flatness.
95(F5,4,0)
T_SW_CHANFLAT_T
S/W Channel Flatness.
96(F6,3,0)
T_CH_FLATNESS_I
Set 22dBm Channel Deviation 10 POINT.
97(F7,3,0)
T_FM_TX_PWR_I
Set FM PWR LEVEL 2~7
(OP,AB,RB)
1) ==> The AB (Input Argument Byte Number) values of these commands are used only in the manual test. In
automatic test mode, the AB is regarded as 0.
2) ==> You can assign the value for these commands. If the AB value is assigned without argument,
the test is achieved with the value stored in EEPROM.
3) ==> After you get a desired test value by performing these commands, if you want to save the value in
EEPROM, use T-SAVE-VAL-I command to store the test value into the corresponding position.
* OP : Operation Command Number
AB : Input Argument Byte Number
RB : Return Byte Number
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5-10
6. Troubleshooting
6-1 Logic Section
6-1-1 No Power
Press End button
U105 pin 1=VBAT?
No
Check the signal from the battery
terminal to U 105 pin 1.
No
Check U105 and its neighboring
circuits.
No
Check U106 and its neighboring
circuits.
No
Check U107 and its neighboring
circuits.
Yes
U106 pin 1 input
=3.7V?
Yes
U106 pin 5 output
=3.7V?
Yes
U107 pin 5 output
=3.7V?
Yes
END
6-1
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6-1-2 Abnormal Initial Operation (Normal +3.3V source)
Press END button
TCXO CLK
applied to U401 pin 26?
No
Check TCXO output,
R400 and C400.
Replace if required.
No
Check U401 and its meighboring
circuit. Replace if required.
No
Check U109, MSM and its
neighboring circuits.
No
Check ‘H’ level input from J104
pin 17 to U401 pin 79.
replace if required.
No
Check Q125 and its neighboring
circuit. Replace if required.
No
Check the LCD pins and its
neighboring circuit.
Replace if required.
Yes
TCXO CLK signal output
from U401 pin 29?
Yes
RAM-CS signal output
from U109 pin 44?
Yes
CHIPX8 CLK signal output
from U401 pin 52?
Yes
Alert LED ON?
Yes
Normal initial
display on LCD?
Yes
END
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6-2
6-1-3 Abnormal Backlight Operation
Press and button on the phone
‘H’ level output from
U101 L7 to J105 pin 19?
No
Check U101 L7.
Replace if required
No
Check FPC.
Replace if required
No
Check U139, L201, Q139
and its neighboring circuits.
Replace if required
No
Check EL.
Replace if required
Yes
‘H’ level input to
U139 pin 4,5?
Yes
Normal U139 operation?
Yes
Normal EL?
Yes
EL ON
6-3
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6-1-4 Abnormal Key Data input
Check initial status
Scanning signals
output from U101, C5, B4, D5, A5
C6, A5, D6
No
Check U101
No
Replace the key pad assembly
Yes
Check U101 A2, A3, C4, B5, E5
Yes
Check J103
Yes
Normal key data input?
Yes
END
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6-4
6-1-5 Abnormal Key tone
Press and key
Waveform output
from U102 pin 14, 15, 16
No
Check U102 pin 14, 15, 16.
Replace if required.
No
Check U102, pin 2, 3 and its
neighboring circuits.
Replace if required.
No
Check U102, R250 and C108, FPC.
Replace if required.
No
Check SPK.
Replace if required.
Yes
Waveform output
from U102 pin 2, 3?
Yes
Waveform applied to
SPK(+), (-)?
Yes
normal key tone?
Yes
END
6-5
SAMSUNG Proprietary-Contents may change without notice
6-1-6 Abnormal Alert Tone
Abnormal alert tone
CLK waveform output
from U101, N7, P7?
No
Check U101 N7, P7.
Replace if required.
No
Check U102 pin 17, and its
neighboring circuits.
Replace if required
No
Check Q120, Q121, R128.
Replace if required.
No
Connect the buzzer correctly.
Yes
CLK waveform output
from U102 pin 17?
Yes
CLK waveform applied
to Buzz?
Yes
Is the buzzer
connection correct?
Yes
Check the buzzer
and replace if required
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6-6
6-2 Receiver Section
6-2-1 FM mode
Start FM mode
No
Check FM 12dB
SINAD OK?
No
Check LNA
in/output OK?
Check Duplexer
& LNA power
Gain: +16dB
Yes
Yes
Check RF amp
in/output OK?
Gain: +17dB
Yes
Yes
Check mixer
in/output OK?
No
Gain(FM): -8dB
Check 1st
local & mixer power
OK?
No
Check PLL (U306)
& VCO output
969.96MHz
local: -4~0dBm
VCO_OUTPUT: -10dBm
Yes
No
Check IF filter
soldering
Check IF filter
in/output OK?
Loss: -5dB
Yes
Yes
No
Check AGC amp
in/output OK?
Gain: +, -45dB
Check 2nd
local & AGC control
voltage OK?
No
Check PLL
& BBA #80
170.76MHz
Yes
RF Rx FM OK
BBA INPUT: -54dBm
6-7
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6-2-2 CDMA Mode
Start CDMA mode
Normal CDMA
SVC & ROAM?
No
Check CDMA RX path
Setup CDMA
call OK?
No
Check Transmitter
No
Yes
Measure
CDMA FER
Yes
Normal CDMA RF?
SAMSUNG Proprietary-Contents may change without notice
6-8
6-3 Transmitter Section
Check Tx
No
O.K
Check Tx PLL
Check U403
Tx IF level
O.K
CDMA: -20dBm
Check U403
Local Input level
CDMA: -5~3dBm
SPAN 5MHz
Tx VCO:260.76MHz
IF:130.38MHz
Yes
O.K
Check Tx
Power level
No
Check U403
Out level
O.K
CDMA: -16~15dBm
6-9
Check U404
RF Out level
O.K
CDMA: 0~1dBm
Check U407
Pout level
CDMA: 24~26dBm
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6-4 Desk-Top Rapid Charger
Plug_in
Check LED state
(RED>GRN>YEL)
Check
BAT-Contact.
Check Voltage of
C3, C2.
(about 330V)
Check
F1, BD1, U1
Check Battery.
Check component the secondary
D30, D20, U22, U23, U24, U25, U26.
Blank of Front.
Check
BAT-Contact.
Check
Battery.
Check C30
Blank of Rear
Check
BAT-Contact.
Check
Battery.
Check C40.
Check
Voltage of
C41.(5V)
Check U25.
LED blink?
(Yellow)
Check Voltage of
C22.
(about 4.5V)
Check
U26.
Check Voltage of
C22.
(about 4.5V)
LED blink?
(RED>GRN>YEL)
Check
LD1, LD2
Check component the secondary
D30, D20, U22, U23, U24, U25, U26.
SAMSUNG Proprietary-Contents may change without notice
6-10
6-5 Hands-Free Kit 1
Start
Ignition Check
Phone Power
ON/OFF Check
Charger Circuit
Auto Power ON
Handset Hook
ON/OFF Check
Handset Mode
Battery Check
Hands Free Mode
Charging current
and voltage check
according to
battery type
In conversation mode, volume
adijustment, mute on/off,
calibration check
Full Charging check
Auto power off
according to lgnition status
Charging LED Check
Handsfree off with the phone
powered off or removed
6-11
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7. Exploded View and its Parts List
7-1 Cellular phone Exploded View
1
2
20
3
21
5
22
4
6
23
24
7
25
26
8
12
9
10
27
29
13
28
11
30
14
15
31
32
16
33
17
49
18
19
34
35
39
36
37
40
38
41
43
42
44
45
46
47
48
SAMSUNG Proprietary-Contents may change without notice
7-1
7-2 Cellular phone Parts List
No
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
7-2
Description
PMO-DECORATION
MPR-TAPE DECORATION
LABEL(M) LOGO BADGE PCL
PMO-FOLDER UPPER
SCREW-MACHINE
MCT-SHIELD GASKET
LCD ASSÕY
MPR-SPONGE LCD
MPR-TAPE EAR PIECE
MPR-TAPE VIBRATIOR
NPR-BRACKET FOLDER R
PPR-PC SHEET LCD
MEC-HINGE ASSY
ICT-MAGNET
NPR-BRACKET FOLDER L
PMO-FOLDER LOWER
MPR-TAPE WINDOW LCD
PCT-WINDOW LCD
PPR-WINDOW BOHO
PMO-HINGE DUMMY
RMO-REFLECTOR LED
PMO-FRONT COVER
RMO-KEY PAD
LOGIC BOARD
RMO-HOLDER MIC
RMO-CONNECTOR COVER
NPR-SHIELD STRIP(C)
NPR-SHIELD STRIP(A)
NPR-SHIELD MSM CAN
PMO-SHIELD COVER
NNPR-SHIELD DUPLEX CA
RMO-HOLDER BUZZER
PMO-MOBILE CAP
NPR-SHIELD TAPE RF
NPR-GROUND PLATE
PMO-KNOB VOLUME
RMO-EAR JACK COVER
PMO-REAR COVER
NPR-BRACKET ANT
ANTENNA
SPRING-LOCKER
PMO-LOCKER BATT
SCREW-MACHINE
SCREW-MACHINE
LABEL(R) MAIN
SLIM BATTERY
STANDARD BATTERY
EXTENDED BATTERY
RF BOARD
SEC code
GH72-00264C
GH74-10772A
GH68-00365C
GH72-00285A
601-000876
GH74-00011A
GH96-00798A
GH74-10774A
GH74-00005A
GH74-10776A
GH71-10726A
GH72-10545A
GH75-11337A
GH70-00009A
GH71-10722A
GH72-41804A
GH74-10775A
GH72-00283A
GH72-10001A
GH72-00067A
GH72-41801A
GH72-41800A
GH73-00080A
GH41-00019A
GH73-40708A
GH73-40704A
GH71-00006A
GH71-00004A
GH71-00008A
GH72-41799A
GH71-00009A
GH73-40735A
GH73-40705A
GH74-00027A
GH71-00010A
GH72-41787A
GH73-40734A
GH72-41806A
GH71-10742A
GH42-00002A
GH61-70054A
GH72-00068A
6001-001140
6001-000876
GH68-00368A
GH41-00020A
QÕTY
Remark
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
1
1
1
1
1
1
3
1
1
1
1
1
1
1
1
4
1
1
1
1
1
1
SAMSUNG Proprietary-Contents may change without notice
7-3 Desk-Top Rapid charger Exploded View
1
2
4
6
3
5
7
8
9
10
11
SAMSUNG Proprietary-Contents may change without notice
7-3
7-4 Desk-Top Rapid charger Parts List
No
Description
SEC. CODE
QÕTY
1
Case. upper
1
2
Hook-plate
2
3
SCREW
4
4
Battery housing
1
5
SCREW
1
6
Power cord
1
7
PCB
1
8
Case. Lower
1
9
SCREW
4
10
BUM PON
4
11
Label
1
TYPE
A
B
C
D
SEC. CODE
Remark
A
ISRAEL
B
Brazil
C
China
D
Hong Kong
7-4
Remark
SAMSUNG Proprietary-Contents may change without notice
7-5 Hands-free Kit 1 Exploded View
1
2
3
4
5
6
7
SAMSUNG Proprietary-Contents may change without notice
7-5
7-6 Hands-free Kit 1 Parts List
No
Description
SEC. CODE
QÕTY
1
Case. upper
1
2
SCREW 3✕5Y
1
3
PCB
1
4
Case. Lower
1
5
SCREW 3✕12Y
4
6
Sponge
2
7
Label
1
7-6
Remark
SAMSUNG Proprietary-Contents may change without notice
7-7 Speaker Exploded View
6
7
4
3
9
8
5
2
1
SAMSUNG Proprietary-Contents may change without notice
7-7
7-8 Speaker Parts List
No
Description
SEC. CODE
QÕTY
1
Case. Front
1
2
Speaker
1
3
Case. Rear
1
4
Bolt
2
5
HEX. NUT
2
6
Hamdle
1
7
Speaker wire
1
8
Screw
4
9
Label
1
7-8
Remark
SAMSUNG Proprietary-Contents may change without notice
7-9 Cradle Exploded View
1
2
4
3
6
5
7
9
8
7
10
11
12
16
13
14
15
17
SAMSUNG Proprietary-Contents may change without notice
7-9
7-10 Cradle Parts List
No
Description
SEC. CODE
QÕTY
1
Cover Top
1
2
Holder Socket
1
3
Spring rock
2
4
Locker
1
5
Locker
1
6
Eject-A
1
7
Efect Spring
2
8
Frame
1
9
Eject-B
1
10
Screw
6
11
PCB
1
12
SCREW
4
13
Cover Bottom
1
14
Screw
2
15
Label
1
16
I/F coil cord
1
17
Data coil cord
1
7-10
Remark
SAMSUNG Proprietary-Contents may change without notice
7-11 Main packing Exploded View
1
2
8
4
6
5
3
7
SAMSUNG Proprietary-Contents may change without notice
7-11
7-12 Main packing Parts List
No
PART NAME
CODE NO
QÕTY
1
CUSHION DUMMY MANUAL
1
2
MAIN SET
1
3
DTC81
1
4
EXT BATT
1
5
HOLSTER
1
6
STD BATT
1
7
MAIN CUSHION
1
8
MAIN GIFT BOX
1
7-12
Remark
SAMSUNG Proprietary-Contents may change without notice
7-13 Hands-Free Kit 1 packing Exploded View
1
3
2
4
7
6
5
8
9
10
SAMSUNG Proprietary-Contents may change without notice
7-13
7-14 Hands-Free Kit 1 packing Parts List
No
Description
SEC. CODE
QÕTY
1
User manual
1
2
User manual
1
3
External speaker
1
4
Cradle
1
5
install Bracket for cradle
1
6
External Mic
1
7
Hands-free Box
1
8
install Bracket for hands-free Box
1
9
Power cable
1
10
Unit Box
1
7-14
Remark
SAMSUNG Proprietary-Contents may change without notice
8. Electrical Parts List
8-1 Main Part List
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
1
-
SCREW-MACHINE
“CH,+,M1.7,L2,ZPC(BLK),SWRCH18”
6001-000876
1
-
SCREW-MACHINE
“BH,STAR,M2,L4,CBLACK,SM20C,-”
6001-001140
1
REAR-COVER
ANTENNA-SCH800
“-,824~894MHZ,0DBD,50OHM”
GH42-00002A
1
-
BATTERY-STD ENG(B)
“3.6V,1000MAH,-,1CMA,4.1V”
GH43-00057A
1
-
LABEL(R)-MAIN SCH811
“SCH-811,POLYESTER T0.05,37X28,-,SIL”
GH68-00368A
1
-
LABEL(P)-7PI
“SCH-200F,ART,PI7,100G,BLK”
GH68-10680A
1
-
LABEL(P)-MS BAR CODE
“SCH-1900,ART,100X155,T0.1,WHT”
GH68-11057A
1
-
LABEL(R)-BARCODE BOX
“SCH-1011,POLYESTER,61X71,T0.1,”
GH68-30937A
1
-
LABEL(R)-BAR CODE
“SP-D300,PR,34X6.5,T0.1,WHT”
GH68-30963A
1
-
PCT-WINDOW LCD SCH811P
“SCH-811,-,BLK,-,-”
GH72-00283A
1
WINDOW-LCD
PPR-TAPE WINDOW BOHO
“SCH-100,VINYL TAPE,TRP,-,-”
GH72-10001A
1
-
PMO-KEY VOLUME
“SPH7000,PC+ELASTOMER,BLK,-,-”
GH72-41787A
1
SCREW BOSS
RPR-GROUND GASKET
“SPH-7000,SI RUBBER,®™7*T0.4,GRY,-”
GH73-00005A
1
-
RMO-CONNECTOR COVER
“SPH7000,URETAN,18.2X4.0XT5.8,B”
GH73-40704A
1
-
RMO-MOBILE CAP
“SPH7000,URETHAN,5.2X4.2XT5.0,B”
GH73-40705A
1
-
RMO-EAR JACK COVER
“SCH-800,URETHAN,5.0X11XT5.0,BL”
GH73-40734A
1
SPEAKER
MPR-SPONGE SPEAK
“SCH-800,FOAM,®™8.5XT0.4,BLK,-”
GH74-00012A
1
FPC-CABLE
MPR-SPONGE MIC
“SH-800,SPONGE,7X7.5X3,BLK,-”
GH74-10526A
1
-
MEC-SHIELD COVER
“SCH-800B,SEC,TRP”
GH75-00022A
2
SHIELD-COVER
NPR-SHIELD STRIP(A)
“SCH-800B,C5210-1/2H,T0.1,-”
GH71-00004A
2
SHIELD-COVER
NPR-SHIELD STRIP(C)
“SCH-800B,C5210-1/2H,T0.1,-”
GH71-00006A
2
SHIELD-COVER
NPR-SHIELD MSM CAN
“SCH-800B,C5210-1/2H,T0.1,-”
GH71-00008A
2
SHIELD-COVER
NPR-SHIELD DUPLEX CAN
“SCH-800B,C5210-1/2H,T0.1,-”
GH71-00009A
2
SHIELD-COVER
PMO-SHIELD COVER
“SCH-800,PC,TRP,-,-”
GH72-41799A
2
SHIELD-COVER
MPR-SPONGE MSM
“SPH-7000,PVC FOAM,10X10XT0.5,WHT,-”
GH74-00002A
2
SHIELD-COVER
MPR-SPONGE SAW FILTER
“SCH-800B,PE SPONGE,15X5.8XT0.5,WHT,-”
GH74-00014A
2
SHIELD-COVER
MPR-SPONGE TCXO
“SCH-800B,PE SPONGE,9.0X7.0XT0.5,WHT,-”
GH74-00015A
1
-
MEC-HOLSTER 811B
“SCH-811,PCL,BLK”
GH75-00144A
2
-
SPRING-CLAMP
“SCH-811,PW1(KSD 3556),-,-,-,-”
GH61-00005A
2
-
IPR-E RING
“SCH-811,STS304 W2,0.3,-”
GH70-00023A
2
-
ICT-PIN CLAMP
“SCH-811,STS304 W2,PI1.9X20,-”
GH70-00024A
2
-
PMO-HOLSTER CRADLE 811B
“SCH-811,PC,BLK,-,-”
GH72-00282A
2
-
PMO-HOLSTER CLAMP 811B
“SCH-811,PC,BLK,-,-”
GH72-00284A
1
-
MEC-HANGER
“SCH-811,PCL,BLK”
GH75-00157A
1
-
PBA MAIN-SCH810 LOGIC
“SCH-810,SAMSUNG,BRAZ,LOGIC,-,-,-”
GH92-00758A
2
D107
DIODE-SWITCHING
“MCL4148,100V,200mA,LL-34,TP”
0401-001052
2
D109
DIODE-RECTIFIER
“UPS5819,40V,1.0A,SMT,TP”
0402-001207
2
D101
DIODE-TVS
“SM05,6V/1mA,300,SOT-23”
0406-001005
2
D103
DIODE-TVS
“SM05,6V/1mA,300,SOT-23”
0406-001005
2
D130
DIODE-TVS
“SM05,6V/1mA,300,SOT-23”
0406-001005
SAMSUNG Proprietary-Contents may change without notice
8-1
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
D111
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D112
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D128
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D129
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D135
DIODE-TVS
“SMS05C,6V,300W,SOT-23-6”
0406-001051
2
D104
DIODE-ARRAY
“DA204U,20V,100mA,C2-3,SC-70,TP”
0407-000102
2
D102
DIODE-ARRAY
“KDS226,80V,300mA,C2-3,SOT-23,T”
0407-000122
2
Q124
TR-SMALL SIGNAL
“2SA1576,PNP,200MW,SOT-323,TP,180-390”
0501-000162
2
Q107
TR-SMALL SIGNAL
“2SC4081,NPN,200mW,UMT,TP,180-3”
0501-000218
2
Q119
TR-SMALL SIGNAL
“MMBT2222A,NPN,225mW,SOT-23,TP,”
0501-000457
2
Q121
TR-SMALL SIGNAL
“MMBT2222A,NPN,225mW,SOT-23,TP,”
0501-000457
2
Q123
TR-SMALL SIGNAL
“MMBT2222A,NPN,225mW,SOT-23,TP,”
0501-000457
2
Q106
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q125
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q126
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
Q101
TR-DIGITAL
“RN2104,PNP,100MW,47K/47K,SSM,TP”
0504-000172
2
Q120
TR-DIGITAL
“RN2104,PNP,100MW,47K/47K,SSM,TP”
0504-000172
2
Q103
FET-SILICON
“SI3443DV,P,-20V,+-3.5mA,65mohm”
0505-001165
2
Q104
FET-SILICON
“SI6803DQ,N/P,20/-20V,+-2.5/+-2”
0505-001185
2
D120
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D121
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D122
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D123
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D124
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D125
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D126
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D127
LED
“CHIP,Y-GRN,0.8x1.1mm,570nm”
0601-001094
2
D110
LED
“CHIP,RED/GRN,3x2.5mm,660/570nm”
0601-001130
2
U114
IC-CMOS LOGIC
“7W04,INVERTER,SSOP,8P,110MIL,T”
0801-000301
2
U116
IC-CMOS LOGIC
“7S32,OR GATE,SOT-25,5P,63MIL,S”
0801-000796
2
U111
IC-CMOS LOGIC
“7S04,INVERTER,SOT-25,5P,63MIL,”
0801-002192
2
U112
IC-TTL
“4W53,MUX/DEMUX,SOP,8P,110MIL,S”
0803-003010
2
U115
IC-DSP
“16272,16BIT,TQFP,64P,400MIL,27”
0904-001280
2
U104
IC-EEPROM
“24C256,32Kx8BIT,SOP,8P,200MIL,”
1103-001131
2
U110
IC-FLASH MEMORY
“29LV800,1Mx8BIT,SON,46P,-,100n”
1107-001062
2
U109
IC-ETC. MEMORY
“1306,524Kx16BIT,SOP,48P,400MIL”
1109-001081
2
U103
IC-VOLTAGE COMP.
“75W56,SSOP,8P,110MIL,DUAL,7V,C”
1202-001022
2
U108
IC-RESET
“809,SOP,3P,-,PLASTIC,-0.3/6V,4”
1203-000392
2
U107
IC-VOLTAGE REGULATOR
“5205,SOT-23,5P,59MIL,PLASTIC,3”
1203-001256
2
U105
IC-PWM CONTROLLER
“9161,SOP,16P,-,PLASTIC,1.455/1”
1203-001434
8-2
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
U106
IC-VOLTAGE REGULATOR
“5219,SOT-23,5P,63MIL,PLASTIC,3”
1203-001518
2
U102
IC-ENCODER/DECODER
“ST5092TQFPTR,QFP,44P,-,PLASTIC”
1204-001375
2
U101
IC-DATA COMM./GEN.
“MSM2300,PBGA,196P,590MIL,PLAST”
1205-001517
2
R113
R-CHIP
“2Kohm,5%,1/16W,DA,TP,1005”
2007-000137
2
R105
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R106
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R129
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R130
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R131
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R137
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R188
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
“R103,R108,R224”
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R104
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R116
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R117
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R125
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R128
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R181
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R183
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R230
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R102
R-CHIP
“2.2Kohm,5%,1/16W,DA,TP,1005”
2007-000141
2
R114
R-CHIP
“2.7Kohm,5%,1/16W,DA,TP,1005”
2007-000142
2
R100
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R149
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R217
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R221
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R222
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R223
R-CHIP
“4.7Kohm,5%,1/16W,DA,TP,1005”
2007-000143
2
R144
R-CHIP
“6.8Kohm,5%,1/16W,DA,TP,1005”
2007-000146
2
R120
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R136
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R182
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R184
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R185
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R187
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R124
R-CHIP
“15Kohm,5%,1/16W,DA,TP,1005”
2007-000151
2
R139
R-CHIP
“15Kohm,5%,1/16W,DA,TP,1005”
2007-000151
2
R101
R-CHIP
“20Kohm,5%,1/16W,DA,TP,1005”
2007-000152
2
R107
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R132
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
SAMSUNG Proprietary-Contents may change without notice
8-3
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
R150
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R189
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R211
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R215
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R216
R-CHIP
“22Kohm,5%,1/16W,DA,TP,1005”
2007-000153
2
R155
R-CHIP
“24Kohm,5%,1/16W,DA,TP,1005”
2007-000154
2
“R145,C162”
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R210
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R138
R-CHIP
“56Kohm,5%,1/16W,DA,TP,1005”
2007-000159
2
R111
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R134
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R135
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R146
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R147
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R148
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R151
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R172
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R173
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R174
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R175
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R176
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R177
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R178
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R190
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R109
R-CHIP
“120Kohm,5%,1/16W,DA,TP,1005”
2007-000163
2
R152
R-CHIP
“150Kohm,5%,1/16W,DA,TP,1005”
2007-000164
2
R153
R-CHIP
“150Kohm,5%,1/16W,DA,TP,1005”
2007-000164
2
R154
R-CHIP
“200Kohm,5%,1/16W,DA,TP,1005”
2007-000165
2
R186
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R115
R-CHIP
“1.5Kohm,5%,1/16W,DA,TP,1005”
2007-000242
2
R127
R-CHIP
“33Kohm,5%,1/16W,DA,TP,1005”
2007-000775
2
R214
R-CHIP
“39Kohm,5%,1/16W,DA,TP,1005”
2007-000831
2
R133
R-CHIP
“470ohm,5%,1/16W,DA,TP,1005”
2007-000932
2
R250
R-CHIP
“4.7ohm,5%,1/16W,DA,TP,1005”
2007-001284
2
“R212,R225”
R-CHIP
“33ohm,5%,1/16W,DA,TP,1005”
2007-001292
2
R168
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R169
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R170
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R171
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R218
R-CHIP
“150ohm,5%,1/16W,DA,TP,1005”
2007-001306
8-4
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
R220
R-CHIP
“150ohm,5%,1/16W,DA,TP,1005”
2007-001306
2
R122
R-CHIP
“1.2Kohm,5%,1/16W,DA,TP,1005”
2007-001319
2
R213
R-CHIP
“13KOHM,5%,1/16W,DA,TP,1005”
2007-007015
2
R110
R-CHIP
“43KOHM,5%,1/16W,DA,TP,1005”
2007-007101
2
R141
R-CHIP
“100Kohm,1%,1/16W,DA,TP,1005”
2007-007107
2
R123
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R142
R-CHIP
“68Kohm,1%,1/16W,DA,TP,1005”
2007-007589
2
C167
“C-CERAMIC,CHIP”
“1.5nF,10%,50V,X7R,TP,1005,-”
2203-000138
2
C103
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C105
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C106
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C121
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C122
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C130
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C152
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C154
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C156
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C100
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C116
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C118
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C119
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C127
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C158
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C159
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C164
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C170
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C182
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C183
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C184
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C185
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C133
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C151
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C153
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C160
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C102
“C-CERAMIC,CHIP”
“220pF,10%,50V,X7R,TP,1005,-”
2203-000585
2
C104
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C120
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C123
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C135
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C187
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
SAMSUNG Proprietary-Contents may change without notice
8-5
Level
2
Design LOC
DESCRIPTIONS
SEC.CODE
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C191,C192,C193,C194” “C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C195,C196,C198”
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
C199
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C201,C202”
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C205,C206”
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
“C207,C208,C209,C210” “C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
C101
“C-CERAMIC,CHIP”
“8.2nF,10%,16V,X7R,TP,1005,-”
2203-001210
2
C109
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C111
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C112
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C115
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C126
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C128
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C129
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C132
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C134
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C137
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C155
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
“C161,C163,C211”
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C169
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C171
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C181
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
“C197,C200”
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C220
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C221
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C222
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C139
“C-CERAMIC,CHIP”
“1uF,+80-20%,10V,Y5V,TP,1608,-”
2203-005065
2
C117
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C180
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C108
“C-TA,CHIP”
“33uF,20%,6.3V,GP,TP,3528,-”
2404-001032
2
C125
“C-TA,CHIP”
“33uF,20%,6.3V,GP,TP,3528,-”
2404-001032
2
C131
“C-TA,CHIP”
“100uF,20,6,LZ,TP,7343,-”
2404-001057
2
C110
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C136
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C138
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
L105
INDUCTOR-SMD
“1uH,10%,0.8x1.6x0.8mm”
2703-000300
2
L101
INDUCTOR-SMD
“10uH,20%,4.45x6.6x2.92mm”
2703-001563
2
X101
RESONATOR-CERAMIC
“27MHz,0.5%,TP,3.2x2.1x1.5”
2802-001090
2
X102
RESONATOR-CERAMIC
“27MHz,0.5%,TP,3.2x2.1x1.5”
2802-001090
8-6
“C186,C188,C190”
ITEMS
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
S1
SWITCH-REED
“100VDC,0.5A,1mS,1mS”
3409-001039
2
J105
CONNECTOR-FPC/FC/PIC
“22P,0.5mm,SMD-A,SN”
3708-001295
2
J110
CONNECTOR-SOCKET
“18P,1R,0.5mm,SMD-A,AUF”
3710-001429
2
J104
CONNECTOR-HEADER
“NOWALL,60P,2R,0.5mm,SMD-S,AUF”
3711-004027
2
J102
JACK-AC POWER
“2P,2.6PI,AU,BLK,NO”
3722-001172
2
-
PCB-SCH811 LOG
“SCH-811,-,8,0.8T,118X138MM”
GH41-00019A
2
VOL_KEY
UNIT-VOLKEY
“SCH-800,KBSCH800B,KEYPAD,FPC,-,-,-”
GH59-00004A
2
MIC ASS’Y
ELA ETC-MIC
“SPH-7000,SAMSUNG,KORA,MICROPHO”
GH96-01156A
1
-
PBA MAIN-SCH810 RF
“SCH-810,SAMSUNG,BRAZ,RF,-,-,-”
GH92-00759A
2
D400
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D401
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D402
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D403
DIODE-VARACTOR
“1SV279,15V,3nA,USC,TP”
0405-001035
2
D310
DIODE-ARRAY
“DAN202U,80V,100mA,CA2-3,SC-70,”
0407-000115
2
D300
DIODE-PIN
“BAR63-02W,50V,100mA,SCD-80,TP”
0409-001016
2
D301
DIODE-PIN
“BAR63-02W,50V,100mA,SCD-80,TP”
0409-001016
2
Q402
TR-SMALL SIGNAL
“2SA1576,PNP,200MW,SOT-323,TP,180-390”
0501-000162
2
Q300
TR-SMALL SIGNAL
“2SC4081,NPN,200mW,UMT,TP,180-3”
0501-000218
2
U309
TR-SMALL SIGNAL
“AT-32011,NPN,200mW,SOT-143,TP,”
0501-002060
2
Q302
TR-SMALL SIGNAL
“BFP420,NPN,160MW,SOT-343,TP,50-150”
0501-002096
2
D302
TR-SMALL SIGNAL
“BCR400W,NPN,-,SOT-343,TP,-”
0501-002205
2
Q301
TR-SMALL SIGNAL
“BFP196W,NPN,700MW,SOT-343,TP,100”
0501-002240
2
Q401
TR-DIGITAL
“RN1102,NPN,100MW,10K/10K,SSM,TP”
0504-000167
2
Q303
TR-DIGITAL
“RN1104,NPN,100MW,47K/47K,SSM,TP”
0504-000168
2
U408
FET-SILICON
“SI3443DV,P,-20V,+-3.5mA,65mohm”
0505-001165
2
U301
IC-ANALOG SWITCH
“SW395TR,SPDP,SOT-26,6P,-,DUAL,”
1001-001048
2
U409
IC-ANALOG MULTIPLEX
“MAX4524EUB-T,TTL/CMOS,SOP,10P,”
1001-001080
2
U404
IC-PREAMP
“01037,SOP,6P,59MIL,SINGLE,-,PL”
1201-001175
2
U310
IC-CASCODE AMP
“0916,SOT-143,4P,-,-,2.7V,-,6Vd”
1201-001248
2
U407
IC-POWER AMP
“23124,LCC,8P,-,SINGLE,-,PLASTI”
1201-001259
2
U402
IC-AGC AMP
“3222,SOP,-,-,SINGLE,-,PLASTIC,”
1201-001261
2
U314
IC-OP AMP
“821,SOT23-5,5P,63MIL,SINGLE,-,”
1201-001348
2
U405
IC-OP AMP
“821,SOT23-5,5P,63MIL,SINGLE,-,”
1201-001348
2
U406
IC-OP AMP
“821,SOT23-5,5P,63MIL,SINGLE,-,”
1201-001348
2
U303
IC-RF AMP
“2617,SSOP,16P,150MIL,DUAL,3V/V”
1201-001366
2
U304
IC-VOLTAGE REGULATOR
“5205,SOT-23,5P,59MIL,PLASTIC,3”
1203-001256
2
U311
IC-VOLTAGE REGULATOR
“5205,SOT-23,5P,59MIL,PLASTIC,3”
1203-001256
2
U312
IC-VOLTAGE REGULATOR
“5205,SOT-23,5P,59MIL,PLASTIC,3”
1203-001256
2
U300
IC-MIXER
“CMY210,SOP,6P,-,PLASTIC,3 TO 6”
1205-001249
2
U401
IC-DATA COMM./GEN.
“Q5312I-3S2,QSOP,80P,138mm,PLAS”
1205-001451
SAMSUNG Proprietary-Contents may change without notice
8-7
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
U403
IC-MIXER
“RF2628,MSOP,8P,190MIL,PLASTIC,”
2
U306
IC-PLL
“LMX2332LSLB,CSP,20P,-,PLASTIC,”
1209-001197
2
U313
THERMISTOR-NTC
“10Kohm,5%,3650K,-,TP”
1404-001040
2
U410
THERMISTOR-NTC
“10Kohm,5%,3650K,-,TP”
1404-001040
2
R325
R-CHIP
“2Kohm,5%,1/16W,DA,TP,1005”
2007-000137
2
R321
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R394
R-CHIP
“100ohm,5%,1/16W,DA,TP,1005”
2007-000138
2
R305
R-CHIP
“220ohm,5%,1/16W,DA,TP,1005”
2007-000139
2
R307
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R309
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R330
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R426
R-CHIP
“1Kohm,5%,1/16W,DA,TP,1005”
2007-000140
2
R443
R-CHIP
“2.2Kohm,5%,1/16W,DA,TP,1005”
2007-000141
2
R315
R-CHIP
“5.1Kohm,5%,1/16W,DA,TP,1005”
2007-000144
2
R440
R-CHIP
“5.1Kohm,5%,1/16W,DA,TP,1005”
2007-000144
2
R324
R-CHIP
“6.2Kohm,5%,1/16W,DA,TP,1005”
2007-000145
2
R451
R-CHIP
“6.2Kohm,5%,1/16W,DA,TP,1005”
2007-000145
2
R411
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R412
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R417
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R438
R-CHIP
“10Kohm,5%,1/16W,DA,TP,1005”
2007-000148
2
R306
R-CHIP
“12Kohm,5%,1/16W,DA,TP,1005”
2007-000149
2
R441
R-CHIP
“12Kohm,5%,1/16W,DA,TP,1005”
2007-000149
2
R452
R-CHIP
“12Kohm,5%,1/16W,DA,TP,1005”
2007-000149
2
R444
R-CHIP
“20Kohm,5%,1/16W,DA,TP,1005”
2007-000152
2
R310
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R322
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R401
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R402
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R435
R-CHIP
“47Kohm,5%,1/16W,DA,TP,1005”
2007-000157
2
R333
R-CHIP
“56Kohm,5%,1/16W,DA,TP,1005”
2007-000159
2
R395
R-CHIP
“68Kohm,5%,1/16W,DA,TP,1005”
2007-000160
2
R308
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R332
R-CHIP
“100Kohm,5%,1/16W,DA,TP,1005”
2007-000162
2
R331
R-CHIP
“1Mohm,5%,1/16W,DA,TP,1005”
2007-000170
2
R425
R-CHIP
“1Mohm,5%,1/16W,DA,TP,1005”
2007-000170
2
C444
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
C445
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
L353
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R314
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
8-8
1205-001535
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
R316
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R320
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R327
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R329
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R396
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R398
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R406
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R407
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R408
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R416
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R418
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R419
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R437
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R445
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R446
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R450
R-CHIP
“0ohm,5%,1/16W,DA,TP,1005”
2007-000171
2
R300
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R303
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R311
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R313
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R319
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R400
R-CHIP
“10ohm,5%,1/16W,DA,TP,1005”
2007-000172
2
R439
R-CHIP
“1.5Kohm,5%,1/16W,DA,TP,1005”
2007-000242
2
R421
R-CHIP
“270Kohm,5%,1/16W,DA,TP,1005”
2007-000636
2
R442
R-CHIP
“39Kohm,5%,1/16W,DA,TP,1005”
2007-000831
2
R424
R-CHIP
“430Kohm,5%,1/16W,DA,TP,1005”
2007-000899
2
R422
R-CHIP
“560Kohm,5%,1/16W,DA,TP,1005”
2007-001025
2
R302
R-CHIP
“24ohm,5%,1/16W,DA,TP,1005”
2007-001290
2
R427
R-CHIP
“51ohm,5%,1/16W,DA,TP,1005”
2007-001298
2
R399
R-CHIP
“150ohm,5%,1/16W,DA,TP,1005”
2007-001306
2
R301
R-CHIP
“200ohm,5%,1/16W,DA,TP,1005”
2007-001308
2
R328
R-CHIP
“910ohm,5%,1/16W,DA,TP,1005”
2007-001317
2
R410
R-CHIP
“1.8Kohm,5%,1/16W,DA,TP,1005”
2007-001320
2
R423
R-CHIP
“1.8Kohm,5%,1/16W,DA,TP,1005”
2007-001320
2
R334
R-CHIP
“36Kohm,5%,1/16W,DA,TP,1005”
2007-001335
2
R317
R-CHIP
“16OHM,5%,1/16W,DA,TP,1005”
2007-003006
2
R318
R-CHIP
“16OHM,5%,1/16W,DA,TP,1005”
2007-003006
2
R420
R-CHIP
“20OHM,5%,1/16W,DA,TP,1005”
2007-003010
2
R428
R-CHIP
“20OHM,5%,1/16W,DA,TP,1005”
2007-003010
2
R335
R-CHIP
“43KOHM,5%,1/16W,DA,TP,1005”
2007-007101
SAMSUNG Proprietary-Contents may change without notice
8-9
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
R405
R-CHIP
“300ohm,1%,1/16W,DA,TP,1005”
2007-007133
2
R409
R-CHIP
“39Kohm,1%,1/16W,DA,TP,1005”
2007-007134
2
R403
R-CHIP
“1.2Kohm,1%,1/16W,DA,TP,1005”
2007-007137
2
R404
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R449
R-CHIP
“10Kohm,1%,1/16W,DA,TP,1005”
2007-007142
2
R448
R-CHIP
“11.3Kohm,1%,1/16W,DA,TP,1005”
2007-007491
2
C303
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C310
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C311
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C315
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C316
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C326
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C337
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C341
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C342
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C344
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C349
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C350
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C362
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C363
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C365
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C367
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C369
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C370
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C373
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C393
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C400
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C410
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C416
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C426
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C428
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C432
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C434
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C448
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C454
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
L304
“C-CERAMIC,CHIP”
“100pF,5%,50V,NPO,TP,1005,-”
2203-000233
2
C343
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C356
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C359
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C366
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
8-10
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
C371
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C372
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C378
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C381
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C382
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C387
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C404
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C415
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C421
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C427
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C435
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C438
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C439
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C440
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C442
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C443
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C450
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C452
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C456
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C458
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C464
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C468
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C470
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C471
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C472
“C-CERAMIC,CHIP”
“10nF,10%,16V,X7R,TP,1005,-”
2203-000254
2
C322
“C-CERAMIC,CHIP”
“10pF,0.5pF,50V,NPO,TP,1005,-”
2203-000278
2
C383
“C-CERAMIC,CHIP”
“10pF,0.5pF,50V,NPO,TP,1005,-”
2203-000278
2
C403
“C-CERAMIC,CHIP”
“10pF,0.5pF,50V,NPO,TP,1005,-”
2203-000278
2
C418
“C-CERAMIC,CHIP”
“18pF,5%,50V,NPO,TP,1005,-”
2203-000425
2
C301
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C320
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C323
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C327
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C361
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C407
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C409
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C419
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C422
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C423
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C424
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
SAMSUNG Proprietary-Contents may change without notice
8-11
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
C425
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C430
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C431
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C437
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C449
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C455
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C457
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C459
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C463
“C-CERAMIC,CHIP”
“1nF,10%,50V,X7R,TP,1005,-”
2203-000438
2
C345
“C-CERAMIC,CHIP”
“1pF,0.25pF,50V,NPO,TP,1005,-”
2203-000466
2
C346
“C-CERAMIC,CHIP”
“1pF,0.25pF,50V,NPO,TP,1005,-”
2203-000466
2
C329
“C-CERAMIC,CHIP”
“220pF,10%,50V,X7R,TP,1005,-”
2203-000585
2
C305
“C-CERAMIC,CHIP”
“22pF,5%,50V,NPO,TP,1005,-”
2203-000628
2
C351
“C-CERAMIC,CHIP”
“3.9nF,10%,50V,X7R,TP,1005,-”
2203-000725
2
C319
“C-CERAMIC,CHIP”
“33pF,5%,50V,NPO,TP,1005,-”
2203-000812
2
C391
“C-CERAMIC,CHIP”
“33pF,5%,50V,NPO,TP,1005,-”
2203-000812
2
C401
“C-CERAMIC,CHIP”
“39pF,5%,50V,NPO,TP,1005,-”
2203-000854
2
C402
“C-CERAMIC,CHIP”
“39pF,5%,50V,NPO,TP,1005,-”
2203-000854
2
C321
“C-CERAMIC,CHIP”
“3pF,0.25pF,50V,NPO,TP,1005,-”
2203-000870
2
C324
“C-CERAMIC,CHIP”
“3pF,0.25pF,50V,NPO,TP,1005,-”
2203-000870
2
C338
“C-CERAMIC,CHIP”
“3pF,0.25pF,50V,NPO,TP,1005,-”
2203-000870
2
C508
“C-CERAMIC,CHIP”
“3pF,0.25pF,50V,NPO,TP,1005,-”
2203-000870
2
C318
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C328
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C332
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C340
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C357
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C360
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C376
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C379
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C384
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C390
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C395
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C398
“C-CERAMIC,CHIP”
“4.7nF,10%,25V,X7R,TP,1005,-”
2203-000885
2
C325
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C333
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C334
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C368
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C388
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C405
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
8-12
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
C461
“C-CERAMIC,CHIP”
“470pF,10%,50V,X7R,TP,1005,-”
2203-000940
2
C446
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
C462
“C-CERAMIC,CHIP”
“47pF,5%,50V,NPO,TP,1005,-”
2203-000995
2
C312
“C-CERAMIC,CHIP”
“4pF,0.25pF,50V,NPO,TP,1005,-”
2203-001017
2
C353
“C-CERAMIC,CHIP”
“56pF,5%,50V,NPO,TP,1005,-”
2203-001072
2
C411
“C-CERAMIC,CHIP”
“68pF,5%,50V,NPO,TP,1005,-”
2203-001153
2
C412
“C-CERAMIC,CHIP”
“68pF,5%,50V,NPO,TP,1005,-”
2203-001153
2
C304
“C-CERAMIC,CHIP”
“7pF,0.5pF,50V,NPO,TP,1005,-”
2203-001201
2
C441
“C-CERAMIC,CHIP”
“8.2nF,10%,16V,X7R,TP,1005,-”
2203-001210
2
“C302,L306”
“C-CERAMIC,CHIP”
“8pF,0.5pF,50V,NPO,TP,1005,-”
2203-001259
2
C386
“C-CERAMIC,CHIP”
“33nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001416
2
C300
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C314
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C331
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C336
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C355
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C429
“C-CERAMIC,CHIP”
“47nF,10%,16V,Y5V,TP,1005,1.0mm”
2203-001432
2
C307
“C-CERAMIC,CHIP”
“5pF,0.25pF,50V,X7R,TP,1005,1.0”
2203-001437
2
C309
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C313
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C339
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C354
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C364
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C380
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C417
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C420
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C436
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C451
“C-CERAMIC,CHIP”
“100nF,+80-20%,16V,Y5V,TP,1005,”
2203-005061
2
C413
“C-CERAMIC,CHIP”
“6pF,0.1pF,50V,NPO,TP,1005,-”
2203-005382
2
C408
“C-TA,CHIP”
“1uF,20%,10V,GP,TP,2012,2,0”
2404-001017
2
C467
“C-TA,CHIP”
“33uF,20%,6.3V,GP,TP,3528,-”
2404-001032
2
C317
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C347
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C348
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C358
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C374
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C375
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C396
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C399
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C414
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
SAMSUNG Proprietary-Contents may change without notice
8-13
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
C460
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C465
“C-TA,CHIP”
“10uF,20%,6.3V,GP,TP,2012,-”
2404-001064
2
C453
“C-TA,CHIP”
“4.7uF,20%,6.3V,GP,TP,2012,-”
2404-001086
2
C385
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C389
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C447
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C498
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C499
“C-TA,CHIP”
“3.3uF,20%,6.3V,GP,TP,2012,-”
2404-001087
2
C352
“C-TA,CHIP”
“220nF,20%,20V,GP,TP,2012,-”
2404-001092
2
L315
INDUCTOR-SMD
“470nH,10%,0.8x1.6x0.8mm”
2703-000213
2
L316
INDUCTOR-SMD
“470nH,10%,0.8x1.6x0.8mm”
2703-000213
2
L312
INDUCTOR-SMD
“390nH,10%,0.8x1.6x0.8mm”
2703-000297
2
L403
INDUCTOR-SMD
“1uH,10%,0.8x1.6x0.8mm”
2703-000300
2
L310
INDUCTOR-SMD
“100nH,5%,1.6x0.8x0.8mm”
2703-001172
2
L400
INDUCTOR-SMD
“33nH,5%,1.6x0.8x0.8mm”
2703-001174
2
L307
INDUCTOR-SMD
“18nH,5%,1.6x0.8x0.8mm”
2703-001189
2
L313
INDUCTOR-SMD
“120nH,10%,1.6x0.8x0.8mm”
2703-001220
2
L305
INDUCTOR-SMD
“39nH,5%,1.6x0.8x0.8mm”
2703-001285
2
L319
INDUCTOR-SMD
“8.2nH,10%,1x0.5x0.5mm”
2703-001408
2
L320
INDUCTOR-SMD
“8.2nH,10%,1x0.5x0.5mm”
2703-001408
2
L323
INDUCTOR-SMD
“8.2nH,10%,1x0.5x0.5mm”
2703-001408
2
L351
INDUCTOR-SMD
“12nH,10%,1x0.5x0.5mm”
2703-001409
2
L410
INDUCTOR-SMD
“12nH,10%,1x0.5x0.5mm”
2703-001409
2
L402
INDUCTOR-SMD
“68nH,5%,1.8x1.12x1.02mm”
2703-001514
2
L404
INDUCTOR-SMD
“120nH,5%,1.7x1.14x1.02mm”
2703-001546
2
L405
INDUCTOR-SMD
“120nH,5%,1.7x1.14x1.02mm”
2703-001546
2
L301
INDUCTOR-SMD
“47nH,5%,1.0x0.5x0.5mm”
2703-001595
2
L303
INDUCTOR-SMD
“47nH,5%,1.0x0.5x0.5mm”
2703-001595
2
L322
INDUCTOR-SMD
“5.6nH,10%,1.0x0.5x0.5mm”
2703-001708
2
L406
INDUCTOR-SMD
“33nH,5%,1.0x0.5x0.5mm”
2703-001723
2
L407
INDUCTOR-SMD
“22nH,5%,1x0.5x0.5mm”
2703-001727
2
L308
INDUCTOR-SMD
“15nH,5%,1x0.5x0.5mm”
2703-001730
2
L350
INDUCTOR-SMD
“15nH,5%,1x0.5x0.5mm”
2703-001730
2
L302
INDUCTOR-SMD
“6.8nH,5%,1x0.5x0.5mm”
2703-001734
2
L330
INDUCTOR-SMD
“6.8nH,5%,1x0.5x0.5mm”
2703-001734
2
L311
INDUCTOR-SMD
“100nH,2%,2.29x1.73x1.52mm”
2703-001743
2
U307
OSCILLATOR-VCO
“954MHz,-,-,TP,3.3V,6.4mA”
2806-001146
2
U305
OSCILLATOR-VCTCXO
“19.68MHZ,2.5PPM,10KOHM//10PF,TP,3V,2MA”
2809-001225
2
F302
FILTER-SAW
“85.38MHz,0.630MHz,0.3MHz/0.3dB”
2904-001128
2
F304
FILTER-SAW
“967MHz,25MHz,967MHz/0.5dB,TP,9”
2904-001133
8-14
SAMSUNG Proprietary-Contents may change without notice
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
2
F400
FILTER-SAW
“836.5MHz,25MHz,+-25MHz/0.9dB,T”
2
F301
FILTER-SAW
“881.5MHz,25MHz,+-25MHz/0.9dB,T”
2904-001136
2
F401
FILTER-SAW
“836.50MHz,-,849MHz/1dB,TP,849M”
2904-001138
2
F300
FILTER-DUPLEXER
“881.5MHz,836.5MHz,4/2.7dB,TP,8”
2909-001077
2
BUZZ
BUZZER-MAGNETIC
“88dB,3.6V,90mA,2.731KHz,TP”
3002-001062
2
L300
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L309
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L317
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L321
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L325
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L326
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L328
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
L409
CORE-FERRITE
“AB,1.6x0.8x0.8mm,-,-”
3301-001105
2
J301
CONNECTOR-COAXIAL
“SMC,JACK,100mohm,50ohm,0.5dB”
3705-001163
2
J300
CONNECTOR-SOCKET
“60P,2R,0.5mm,SMD-S,AUF”
3710-001390
2
U308
RF POWER SPLITTER
“2WAY,955-979MHz,12dB,-,TP”
4709-001080
2
-
PCB-SCH811 RF
“SCH-811,-,6,0.8T,118X90MM”
GH41-00020A
2
PBA MAIN RF
RMO-HOLDER BUZZER
“SCH-800,CR RUBBER,11x9xT3.5,BL”
GH73-40735A
1
-
MEA FRONT-SCH811B
“SCH-800,PCL,ISRL,-,-,-,-”
GH97-00918A
2
FOLDER ASSY
SCREW-MACHINE
“CH,+,M1.7,L2,ZPC(BLK),SWRCH18”
6001-000876
2
FRONT-COVER
PMO-HINGE DUMMY
“SCH-800,PC,BLK,-,-”
GH72-00067A
2
-
PMO-DECORATION B(CHNA)
“SGH-800,ABS,B/PEL,-,-”
GH72-00264C
2
WINDOW-LCD
PPR-TAPE WINDOW BOHO
“SCH-100,VINYL TAPE,TRP,-,-”
GH72-10001A
LABEL(M)-LOGO BADGE PCL
SCH-811 BLK
GH68-00365A
“SCH-811,-,-,BLK,-”
GH73-00080A
2
2904-001135
2
-
RMO-KEY PAD HEBREW
2
FRONT-COVER
RMO-HOLDER MIC
“SPH7000,SI RUBBER,PI8.0,T5.0,B”
GH73-40708A
2
SPEAKER
MPR-SPONGE SPEAK
“SCH-800,FOAM,®™8.5XT0.4,BLK,-”
GH74-00012A
2
FOLDER-UPPER
MPR-DECO BOHO VINYL
“SCH-800,VINYL,27X32.5X0.2,TRP,-”
GH74-00084A
2
-
MEC-FOLDER UPPER 811B
“SCH-811,PCL,BLK”
GH75-00139A
3
-
PMO-FOLDER UPPER 811B
“SCH-811,PC,BLK,-,-”
GH72-00285A
3
-
MCT-SHIELD GASKET
“SCH-800B,GASKET(SHIELD),30X34XT0.7,GRY,-”
GH74-00011A
3
-
MPR-TAPE UPPER
“SCH-800B,TESA 983,8X8XT0.15,TRP,-”
GH74-00031A
3
-
MPR-TAPE DECORATION
“SCH-800,TESA4965,16.9x23xT0.2,”
GH74-10772A
2
-
MEC-FOLDER LOWER 811B
“SCH-811,PCL,BLK”
GH75-00143A
3
-
NPR-BRACKET FOLDER
“SPH7000,C5210S-1/2H,T0.5,NI”
GH71-10722A
3
-
NPR-BRACKET FOLDER R
“SPH7000,C5210S-1/2H,T0.5,NI”
GH71-10726A
3
-
PMO-EARPIECE 811B
“SCH-811,PC,BLK,-,-”
GH72-00281A
3
-
PPR-PC SHEET LCD
“SCH-800,PC SHEET T0.6,BLK,-,-”
GH72-10545A
3
-
PMO-FOLDER LOWER
“SCH-800,PC,BLK,-,LEXAN SP-1210”
GH72-41804A
3
-
MPR-TAPE EAR PIECE
“SCH-800,FOAM TAPE,5X4XT0.4,BLK,-”
GH74-00005A
SAMSUNG Proprietary-Contents may change without notice
8-15
Level
Design LOC
ITEMS
DESCRIPTIONS
SEC.CODE
3
-
MPR-SPONGE EAR PIECE
“SCH-800B,PE SPONGE,8X11XT0.5,WHT,-”
GH74-00029A
3
-
MPR-SPONGE LCD
“SCH-800,SPONGE,41.5x38xT1.0,BL”
GH74-10774A
3
-
MPR-TAPE WINDOW LCD
“SCH-800,TESA4965,41.5X38XT0.2,”
GH74-10775A
3
-
MPR-TAPE VIBRATOR
“SCH-800,TESA4965,PI13xT0.2,TRP”
GH74-10776A
3
-
MEC-HINGE
“SCH-800,SEC,BLK”
GH75-11337A
4
HINGE
SPRING-HINGE
“SPH7000,PW2,PI5.0,D0.7,L11.2,-”
GH61-70056A
4
HINGE
HINGE-CAM
“SPH7000,ACETAL,BLK”
GH61-80004A
4
HINGE
HINGE-SHAFT
“SPH7000,ACETAL,BLK”
GH61-80005A
4
HINGE
HINGE-HOUSING
“SCH-800,PC(LEXAN SP-1210R),BLK”
GH61-80007A
4
HINGE-ASSY
ICT-MAGNET
“SCH-800B,ALLOY(AL+NI+CO),(3X15)T1.0,NTR”
GH70-00009A
2
-
MEC-FRONT COVER
“SCH-800,SEC,BLK”
GH75-11334A
3
FRONT-COVER
PMO-FRONT COVER
“SCH-800,PC,BLK,-,LEXAN SP-1210”
GH72-41800A
3
FRONT-COVER
PMO-REFLECTOR LED
“SCH-800,ACRYL,M/WHT,-,-”
GH72-41801A
2
-
ELA HOU-LCD ASS’Y
“SCH-811,SAMSUNG,-,LCD+MOTOR+SPKER,-,-,-”
GH96-00798A
1
-
MEA REAR-SCH800
“SCH-800,SEC,KOR,BLK,-,-,-”
GH97-01432A
2
REAR-COVER
LABEL(R)-QUALCOMM
“SCH-100F,VINYL,12X6,0.12,TRP”
GH68-30846A
2
REAR-COVER
MPR-SHIELD TAPE
“SCH-800B,CLOTH(SHIELD),30X8XT0.1,GRY,-”
GH74-00027A
2
-
MEC-REAR COVER
“SCH-800,SEC,BLK”
GH75-11338A
3
REAR-COVER
SPRING-LOCKER
“SPH7000,PW2,PI.8,D0.2,4.4,-”
GH61-70054A
3
REAR COVER
NPR-GROUND PLATE
“SCH-800B,C5210-3/4H,T0.1,-”
GH71-00010A
3
REAR-COVER
NPR-BRACKET ANT
“SCH-800,C2801S-1/4H,T0.5,AU(0.”
GH71-10742A
3
REAR-COVER
PMO-LOCKER BATT
“SCH-800,PC,BLK,-,-”
GH72-00068A
3
REAR-COVER
PMO-REAR COVER
“SCH-800,PC,BLK,-,LEXAN SP-1210”
GH72-41806A
1
-
PAA MAIN-PACKING 811 PCL
“SCH-811,PCL,ISRL,-,-,-,-”
GH99-02153A
2
-
BAG-PE
“PE,T0.06,150X300,-”
GA69-30508A
2
-
PAC-SILICAGEL
“SiO2,50x40,5,SKP-816H”
GA69-90502A
2
-
BAG-LDPE
“PELD,T0.06,100X260,SP-RM928”
GG69-30517A
2
-
LABEL(P)-SHIPPING 811 PCL
“SCH-811,CRAFT-PAPER 100G,250X180,-,BRN”
GH68-00386A
2
-
BOX(P)-MAIN GIFT BOX 811 IS
“-,SCH-811,-,171X220X94,-”
GH69-00169A
2
-
CUSHION-MAIN 811
“SCH-811,-,165X223X90”
GH69-00170A
2
-
CUSHION—DUMMY MANUAL
“SCH-811,SW5,124X208”
GH69-00185A
2
-
BOX(P)-MASTER MAIN
“SPRINT,SCH-2000,DW-3,498X355X2”
GH69-11133A
2
-
CUSHION-PAD MAIN
“SCH-2000,DW-3,483X340XT7”
GH69-20666A
2
-
CUSHION-PAD SIDE
“SCH-2000,DW-3,340X230XT7”
GH69-20667A
2
-
BAG-STD BATT.
“PE,T0.06,70X170,SCH-1011”
GH69-30503A
2
-
BAG-MANUAL
“PP,T0.06,125*280,SCH-1011”
GH69-30518A
8-16
SAMSUNG Proprietary-Contents may change without notice
8-2 Desk-top charger part List
No
Design LOC
DESCRIPTIONS
SEC CODE
1
C7, C8
Y-CAP
2, 2nF, 20%, 250V
2201-001004
2
C1
X-CAP
100nF, 20%, 250V
2301-001092
3
C2, C3
CAP-FELECTRONIC
10uF, 400V, 85°C 10x16
2401-00
4
C21, C332
CAP-FELECTRONIC
680uF, 16V, 105°C 10x13
2401-003090
5
C23, C33
CAP-FELECTRONIC
220uF, 16V, 85°C 6x11
2401-000804
6
C36
CAP-FELECTRONIC
47uF, 16V, 85°C 5x7
2401-00
7
C6, C41
CAP-FELECTRONIC
10uF, 50V, 105°C 5x11
2401-00
9
F1
FUSE
250VAC, 2A 5x15 BLACK-TUBING
10
LD1, LD2
LED
RED/GRN-DUAL 3 (ROUND)
11
BD1
DIODE-BRIDGE
600V, 1A
0402-000003
12
D2, D3
DIODE-FR
1000V, 1A
0402-000012
13
D21, D31, D32
DIODE-SCHOTKY
40V, 1A
0402-000358
14
D30
DIODE-FR
200V, 1.5A/2A
0402-000205
15
D20
DIODE-SCHOTKY
60V, 5A
0402-000467
16
TH1
THERMISTER
5Ω, 10Ø
1404-000128
17
D1
TRANSIENT VOLTAGE
160V, 600W
18
U1
SUPPESSOR
TO-220, 700V, 1A
0505-00
19
U26
IC-pemto
35V, 1.5A, DIP-8P
1203-000391
20
U21
IC-SWITCHING
5V, 100mA, TO-92
1203-000542
21
PC1
IC-VOLTAGE REGULATER 120-180%, 200mW
0604-001098
REMARKS
8
3601-001125
0601-00
0402-000124
1404-001083
0403-001028
DIP-4P, ST
0604-000191
22
R21
PHOTO-OOUPLER
51Ω, 2W, 5%
2003-000327
23
R15, R16
R-METAL OXIDE
1/2W, 4.7MΩ, 5%
2009-001039
24
R51
R-SURGE
10KΩ, 25°C
1404-000215
1404-001014
25
VR1, VR2
R-NTC
1KΩ, 1/10W, 30% TOP, TP
2103-000210
26
TNR1
R-SEMIFIX
470V, 2500A, 300V, 3000A
1405-000001
1405-000193
27
J01-15
VARISTOR
0.6*52mm, SDACW
28
R26, R27, R45, R16
WIRE-NO SHEATH
1Ω, 1/4W, 1%, TP
29
R35, R52
R-METAL FILM
47KΩ, 1/8W, 5%, TP
30
R33, R47
R-CARBON FILM
4.7KΩ, 1/8W, 1%, TP
31
CHT009
R-METAL FILM
CHT09, 0.8mA, EE1916
ML26-00274A
32
LF1
S/W TRANS
UU1014-V, 22mH(MIN)
ML29-00023K
33
L22
LINE-FILTER
120uH, 10X5, 0, 40
34
L21
COIL-CHOKE(TROIDAL)
7uH 5X7,5
ML27-00252A
35
C25
COIL-CHOKE (DRUM)
2012, 104K, X7R, 50V
2203-000206
SAMSUNG Proprietary-Contents may change without notice
3811-000545
ML27-00
8-17
No
Design LOC
DESCRIPTIONS
35
SEC CODE
REMARKS
2203-000204
36
C4, C23, C24
CAP-CHIP
2012, 474Z, Y5V, 50V
2203-000922
37
C44
CAP-CHIP
2012, 474K, X7R, 50V
2203-000985
2203-000979
38
C34
CAP-CHIP
2012, 101J, NPO, 50V
2203-002278
39
C5, C7
CAP-CHIP
2012, 103K, X7R, 50V
2203-001458
40
C28, C30, C33, C42,
CAP-CHIP
2012, 104Z, Y52, 50V
2203-000192
2203-001604
C43, C45
41
C26
CAP-CHIP
2012, 224K, X7R, 25V
42
U25
u-com
u-com, 8bit, SOP-32P
0903-001148
43
U22
IC-OP AMP
28V, 150pA, DUAL
1201-000166
SOP-8P
1201-000167
36V, 1mA, DUAL
1202-000188
SOP-8P
1202-000104
2203-000575
44
U23, U24
IC-COMPERATER
1202-000187
45
Q23
46
Q21, Q22, Q24
47
FET-DUAL
12V, 5A, 0.05
P-CHANNEL
SO-8P
TR-PNP
SOT-23, 60V, 600mA
0501-000462
D33
DIODE-ULTRA HIGH SPEED
SOT-23, 80V, 100mW
0407-000114
49
R24, R44
R-CHIP
2012, 620Ω, 1%
2007-000
50
R25
R-CHIP
2012, 680Ω, 1%
2007-000
51
R28, R31, R32, R48, R63
R-CHIP
2012, 10KΩ, 1%
2007-000297
52
R36, R53
R-CHIP
2012, 470KΩ, 1%
2007-000922
53
R34, R51
R-CHIP
2012, 150KΩ, 1%
2007-000
54
R40, R49
R-CHIP
2012, 12KΩ, 1%
2007-000352
55
R61
R-CHIP
2012, 27KΩ, 1%
2007-00
56
R23, R43, R60
R-CHIP
2012, 91Ω, 1%
57
R64, R65, R66, R7
R-CHIP
2012, 470Ω, 1%
2007-00
58
R41
R-CHIP
2012, 4.7KΩ, 1%
2007-000868
59
R37, R54
R-CHIP
2012, 2.4KΩ, 1%
2007-00508
61
R38, R55, R69, R70
R-CHIP
2012, 47KΩ, 5%
2007-000
62
R1, R2
R-CHIP
2012, 10Ω, 5%
2007-000
63
R29, R47
R-CHIP
2012, 2.2KΩ, 5%
64
R30, R42, R68
R-CHIP
2012, 1KΩ, 5%
2007-000
65
R4
R-CHIP
2012, 750Ω, 5%
2007-000
66
R22
R-CHIP
2012, 180Ω, 5%
2007-000
67
R3
R-CHIP
2012, 5.6Ω, 5%
2007-000
0505-001180
48
2007-001677
60
8-18
2007-000493
SAMSUNG Proprietary-Contents may change without notice
No
DESCRIPTIONS
Design LOC
SEC CODE
REMARKS
68
69
B1, B2
CHIP-BEAD
3x4, CHIP-BEAD
3301-000329
70
CN21
BAIT-CONNENTOR-
4P, 3.0mm
ML74-001411
FRONT, REAR
30x9x10
CONNECTOR-C/B
3.9mm, 3(2)P
CASE ASS’Y-COVER
COVER (1)
71
CON1
72
3711-000203
ML72-00
GATE LABEL (1)
BATT HOUSING (1)
BATT LOCKER (1)
TH+M3x8, BLK (1)
73
CASE ASS’Y-BOTTOM
BOTTOM (1), BOMPON (4)
ML72-00
74
LABEL, DTC81
30x50x0.15
ML68-0
SCREW-TAP
PH+, 2.6x12, BLK
76
PCB-MAIN DTC81
FR-1, loz, 125x64x1.2
77
PWR-CORD
75
(BOTTBM)
ML60-00001A
ML41-00
ML39-00
78
(U1)
HEAT-SINK(U1)
15x13x5x1.0
ML62-00133A
79
(U1)
SCREW-TAP)U1)
PH+, M3x6
6001-000563
ADHESIVE-SEALANT
DC739, 40RTV
0201-001029
80
0201-000303
81
VINIL SACK
170x350x0.05, WHITE
82
SOLDER-WIRE
KR-19, S60A, D1.0
83
ALCOHL
(CH3)2CHOM
0204-000429
84
FLUX-SOLDER
920-CFX
MF02-00020A
0202-000178
0202-000193
0202-000226
85
SOLDER-WIRE
D3, 0, Sn60%
SAMSUNG Proprietary-Contents may change without notice
ML74-00113A
8-19
8-3 Hands-Free Kit Part List
No
Design LOC
DESCRIPTIONS
1
UPPER C/D
FOR CRADLE
2
LOWER C/D
FOR CRADLE
3
FRAME
FOR CRADLE
4
HOLDER SOCKET
FOR CRADLE
5
LOCKER
FOR CRADLE
6
EJECTOR
FOR CRADLE
7
SPRING LOCK
FOR CRADLE
8
SPRING EJECT
FOR CRADLE
9
HOLDER C/D
FOR CRADLE
10
COVER GATE
FOR CRADLE
11
SCREW
#2 BT 2.6x6B
12
SCREW
BM 3x6B
13
SCREW
#2 BT 2x8Y
14
CASE CONN UPPER
FOR CONNECTOR JACK
15
CASE CONN LOWER
FOR CONNECTOR JACK
16
BUTTON PUSH
FOR CONNECTOR JACK
17
CURL CORD ASS'Y
FOR CONNECTOR JACK
18
CONNECTOR
FOR CONNECTOR JACK
19
SPRING PLATE
FOR CONNECTOR JACK
20
CABLE DATA ASS'Y
HIROCE 15P
21
SCREW
#2 FT2x6B
22
CASE UPPER
CONTROL BOX CASE
23
CASE LOWER
CONTROL BOX CASE
24
BRACKET INSTALL
CONTROL BOX CASE
25
RIVET
CONTROL BOX CASE
26
HEAT SINK
CONTROL BOX CASE
27
SCREW
#2 PS 3x6 Y
28
SCREW
#2 PS 3x12 B
29
CASE UPPER
MICROPHONE
30
CASE LOWER
MICROPHONE
31
SPRING FIXING
MICROPHONE
32
SCREW
#1 FT 2x8 B
33
CABLE MIC
1P+1SCHIELD WIRE+PLUG
34
CUSHION MIC.
MICROPHONE
35
MIC CONDENSOR
CMP-68(NP)
36
CABLE POWER
4P, RED-BLK-YLW-WHITE
37
LABEL
FOR CRADLE
38
LABEL
FOR CONTROL BOX
39
LABEL
FOR SPEAKER
40
LABEL BAR CODE
FOR SERIAL NO.
8-20
SEC. CODE
REMARKS
SAMSUNG Proprietary-Contents may change without notice
No
Design LOC
DESCRIPTIONS
41
LABEL BAR CODE
FOR PRODUCT
42
MANUAL
4-COLOR PRINT
43
POLYBAG
15x27, PE
44
POLYBAG
6x9, PE
45
CABLE TIE
80mm
46
POWER LOG
ø6
47
SCREW
#1 BT4x16B
48
SCREW
PM 4x6B
49
BOX ACCESSORY
FOR ACCESSORY ASS'Y
50
UNIT BOX
FOR PACKING
51
PACKING PAD
FOR PACKING
52
OUTER BOX
FOR PACKING
53
CASE FRONT
FOR EXTERNAL SPEAKER
54
CASE REAR
FOR EXTERNAL SPEAKER
55
HANDLE SPEAKER
FOR EXTERNAL SPEAKER
56
BOLT
FOR FIXING HANDLE
57
HEX. NUT
WITH WASHER
58
SPEAKER
LEEWON 9050F
59
SPEAKER WIRE
2P
60
SCREW
#1 PT 3x12B
61
LABEL
62
LABEL 3 SORTS
SAMSUNG Proprietary-Contents may change without notice
SEC. CODE
REMARKS
8-21
No
Design LOC
DESCRIPTION
1
ZD201, ZD202
ZENER DIODE
5.1V 0.5W - DIP
2
ZD1
TVS DIODE
P6KE33 - DIP
3
D5, D7, D101, D102
DIODE
1N4148 - DIP
4
D1, D2, D3
DIODE
1N5818 - DIP
5
D100
DIODE
SDS7000 - CHIP
6
R278
RESISTOR
CH2012 1ohm-J 5%
7
R9
RESISTOR
CH2012 91oohm-F 1%
8
R8
RESISTOR
CH2012 8.2K-F 1%
9
R3, R13, R131
RESISTOR
CH2012 100ohm-J 5%
10
R51, R52, R139, R272
RESISTOR
CH2012 220ohm-J 5%
11
R279
RESISTOR
CH2012 270ohm-J 5%
12
R137, R138
RESISTOR
CH2012 330ohm-J 5%
13
R31, R32, R225, R251, R257,
RESISTOR
CH2012 1K-J 5%
SEC. CODE
REMARKS
R270
14
R132
RESISTOR
CH2012 1.8K-J 5%
15
R213, R217, R228, R229,
RESISTOR
CH2012 2.2K-J 5%
R230, R231
16
R271
RESISTOR
CH2012 2.4K-J 5%
17
R1, R7, R112
RESISTOR
CH2012 2.7K-J 5%
18
R18
RESISTOR
CH2012 3K-J 5%
19
R12
RESISTOR
CH2012 3.9K-J 5%
20
R38, R110, R113, R117,
RESISTOR
CH2012 4.7K-J 5%
R119, R268
R275
21
R57, R233, R248
RESISTER
CH2012 5.1K-J 5%
22
R5, R10, R17, R20, R23,R27
RESISTER
CH 2012 10K-J 5%
R30, R33, R41, R44 R45,
R46, R55, R56, R100. R104,
R108, R109, R111, R115,
R116, R120, R122, R123,
R124, R135, R201, R202,
R203, R204, R205, R207,
R208, R210, R211, R212,
R215, R252, R253, R254,
R255, R258, R260, R266,
R270, R274, R276, R114
23
R269
RESISTER
CH 2012 560 ohm-J 5%
24
R102
RESISTER
CH 3216 10K-J 5%
25
R43
RESISTER
CH 3216 12K-J 5%
26
R54, R267
RESISTER
CH 3216 10K-J 5%
8-22
SAMSUNG Proprietary-Contents may change without notice
No
27
Design LOC
DESCRIPTIONS
R19, R128, R266
RESISTER
CH 2012 12K-J 5%
28
R24
RESISTER
CH 2012 15K-J 5%
29
R106, R107, R121, R127, R277
RESISTER
CH 2012 18K-J 5%
30
R16, R126
RESISTER
CH 2012 22K-J 5%
31
R40, R222, R223, R224
RESISTER
CH 2012 27K-J 5%
32
R4, R21, R37, R101, R105
RESISTER
CH 2012 33K-J 5%
SEC.CODE
REMARKS
R136, R140, R259, R273
33
R133, R134
RESISTER
CH 2012 47K-J 5%
34
R227
RESISTER
CH 2012 56K-J 5%
35
R216, R226
RESISTER
CH 2012 68K-J 5%
36
R36, R42, R53, R103, R125,
RESISTER
CH 2012 82K-J 5%
R129
R141, R214, R261
37
R26
RESISTER
CH 2012 100K-J 5%
38
R39
RESISTOR
CH 2012 220K-J 5%
39
R29
RESISTOR
CH 2012 1M-J 5%
40
R14
RESISTOR
CH 2012 5.6K-J 5%
41
R50
RESISTOR
0.1 ohm/1W-F-DIP
42
L6
RESISTOR
22 ohm/1W-J-DIP
43
VR1
VAR. RESISTOR
0.2 ohm/1W-J-DIP
44
C255, C256
ELEC. CAPACITOR
MVR32 5K
45
C257
ELEC. CAPACITOR
0.47UF/50V (5*11)85˚C
46
C15, C204, C205, C206, C259
ELEC. CAPACITOR
2.2UF/16V (5*11)85˚C
47
C104
ELEC. CAPACITOR
10UF/16V (5*11)85˚C
48
C106
ELEC. CAPACITOR
10UF/25V (5*11)85˚C
49
C258
ELEC. CAPACITOR
22UF/35V (5*11)85˚C
50
C207
ELEC. CAPACITOR
47UF/16V (5*11)85˚C
51
C1
ELEC. CAPACITOR
100UF/35V (6.3*11)85˚C
52
C7, C18, C23, C29, C40,
ELEC. CAPACITOR
470UF/16V (8*11.5)85˚C
C43, C45, C260
53
C4
ELEC. CAPACITOR
470UF/35V (10*18)85˚C
54
C221
TAN. CAPACITOR
4.7UF/16V (5*11)85˚C
55
C32, C101, C105, C107
CERAMIC CAPACITOR
CH 2012 B330P-J (330)
C108, C109, C110, C111,
C112, C111133,, C114, C115,
C1116, C117, C118, C119,
C201, C202, C215. C216,
C217
56
C17
CERAMIC CAPACITOR
CH 2012 B470P-K (471)
57
C5, C25, C209, C218, C222,
CERAMIC CAPACITOR
CH2012 B102-K (102)
SAMSUNG Proprietary-Contents may change without notice
8-23
DESIGN LOC
No
DESCRIPTION
SEC. CODE
REMARKS
C223, C261
58
C250
CERAMIC CAPACITOR
CH 2012 B152-K (152)
59
C100
CERAMIC CAPACITOR
CH 2012 B103-K (103)
60
C219, C220
CERAMIC CAPACITOR
CH 2012 B472-K (472)
61
C2, C3, C6, C13, C14, C16, C22,
CERAMIC CAPACITOR
CH 2012 B104-Z (104)
C24, C26, C30, C31, C41, C42,
C44,C46, C103, C120, C121,
C2224, C226, C228, C237, C238,
C239, C241, C242, C243, C244,
C245, C246, C247, C248, C249,
C251, C252, C253, C254, R209
62
C208, C213
CERAMIC CAPACITOR
CH 2012 B105-Z (105)
63
C263
CERAMIC CAPACITOR
CH 3216 B104-Z (104)
64
C262
CERAMIC CAPACITOR
CH 2012 B224-Z (224)
65
L2
INDUCTOR (COIL)
220UH (18ø )
66
L4
INDUCTOR (COIL)
220UH (13ø )
67
L1
INDUCTOR (COIL)
10UH
68
L3
INDUCTOR (COIL)
20UH
69
J100
CONNECTOR-DATA
20P (RP13A-12RC-20PB)
70
J201
MIC JACK
TC38-001-01
71
J203 FOR SPEAKER
CONNECTOR-SPEAKER
LAD-1140-02 (2 PIN)
72
J1
CONNECTOR-POWERR
LAD-1140-04 (4 PIN)
73
Q20, Q21
TRANSISTOR
B772-DIP
74
Q1, Q2, Q6, Q11, Q12, Q13, Q14,
TRANSISTOR
KST2222A - CHIP
Q15, Q16, Q100, Q101, Q102,
Q103, Q104, Q105, Q107, Q108,
Q109, Q110, Q208
75
Q3, Q8, Q106, Q202
TRANSISTOR
KST2907A - CHIP
76
Q4, Q5
FET
IRF9540 OR 2SJ176 - DIP
77
BT201
X-TAL
I2.288Mhz - DIP
78
BT100
RESONATOR
3.58Mhz - DIP
79
U201, U207
IC
LM358 - CHIP
80
U202
IC
AD1845 - CHIP
81
U204
IC
ADSP-2176 - CHIP
82
U205
IC
74111C14D - CHIP
83
U206
IC
93C66 - CHIP
84
U208
IC
HEF4051B - CHIP
85
U100
IC
PIC6C73 - CHIP
86
U1
IC
NJM2360 OR KA34063 - CHIP
8-24
SAMSUNG Proprietary-Contents may change without notice
No
DESIGN LOC
DESCRIPTIONS
87
U4
IC
LM2576 - DIP
88
U2
IC
LM7805 - CHIP
89
U3
IC
LP2951CM
90
U5
IC
LM3403 - CHIP
91
U101
IC
LM2904 - CHIP
92
S201
SWITCH
TACT SWITCH
93
U209
IC
TDA1905 - DIP
94
P.C.B
No
REMARKS
SEC. CODE
REMARKS
SEC. CODE
REMARKS
MAIN PCB SCH 811
DESIGN LOC
DESCRIPTIONS
1
MIC ASS'Y
CMP-68
2
SPEAKER ASS'Y
4 ohm 5W
3
POWER CABLE
4 PIN POWER CABLE ASS'Y
No
SEC. CODE
DESIGN LOC
DESCRIPTIONS
1
RESISTOR
CH 2012 330 ohm-J 5%
2
RESISTOR
CH 2012 2.2K-J 5%
3
RESISTOR
CH 2012 1K-J 5%
4
CONNECTOR WAFER
13 PIN 2mm PITCH ANGLE
5
CONNECTOR WAFER
15 PIN 2mm PITCH ANGLE
6
PHOTO INT.
SG215 - DIP
7
THERMOSTOR
C103JF4C (10K 1%)
8
LED (LED TACK)
KARG138 (5 , 3 COLOR)
9
COILD CORD CABLE
13 PIN 2mm PITCH ANGLE
10
DATA CABLE
15 PIN 2mm PITCH ANGLE
11
P.C.B
SUB PCB SCH-811
SAMSUNG Proprietary-Contents may change without notice
8-25
8-4 Travel charger
No
DESIGN LOC
DESCRIPTIONS
1
U2
IC OPTP
2
U1
IC PWM P/S
TOP222P
3
U4
IC V.REF TO -92
KA431AZ
SEC. CODE
REMARKS
LTV817V
TLP621GRH
TL431ACLP
KIA431
4
D1, 2, 3, 4
DIODE REC
1N4007
5
D21
DIODE SCHOTKY
SR560
SR560
6
D7, 20
DIODE SW
RLS4148
7
D5
T.V.S DIODE
P6KE160A
P6KE1600A
8
D6
DIODE UF
9
D24
DIODE ZENER
RLZJ4.3
10
LED
LED CONNECTOR
352111-0310
11
LED
12
MOV1
UF40007
UF4007
ALL-153GW
VARISTOR
D62Z0V300RA65
M.O.V
TNR12G471K
RG06P102
13
VR1
SEMI-FIXEED RES
14
L1, 2
INDUCCTOR
15
PTF1
SGH500 TRANS
16
L20
CHOKE ASS'Y
17
R4, 5
SURGE RESISTOR
PPSR0.5W
18
C1, 2
CAP EL
SHL400V10UF
19
C22
CAP EL
KMF16V330UF
20
C21
CAP EL
AG10V1000UF
21
C4, 20, 24
CAP EL
1SK1C476M05007
22
C8
CE. CAP
440DL472
23
C3
CE. CAP
ECSL3A220K06BS5
24
C6
MY. CAP
S/M2A152J
25
TH
THERMISTOR
FTG-310H37
26
F1
MICRO FUSE
MST
27
SK2
CONN. HEADER
5267-04A
28
Q7
S.S. TR
KTA1273
29
R2
CHIP RESI
MCR18EZHJ6R2
30
R14, 15, 16
CHIP RESI
MCR18EZHF1R0
31
JP1, 2, 3
CHIP RESI
MCR18EZHJ0R0
SCH500
SDE472M
CR180R0JM
8-26
SAMSUNG Proprietary-Contents may change without notice
DESIGN LOC
DESCRIPTIONS
32
R66, 67
CHIP RESI
33
JP4, 5
CHIP RESI
MCR10EZHJORO
34
R57
CHIP RESI
MCR10EZHF1501
SEC. CODE
REMARKS
MCR18EZHJ511
CR18511JM
CR10150FM
35
R58
CHIP RESI
MCR10EZHF2201
CR102201FM
36
R17
CHIP RESI
MCR10EZHJ470
CR10470JM
37
R1
CHIP RESI
MCR18EZHJ103
CR18103JM
38
R59
CHIP RESI
MCR10EZHJ102
39
C23
CHIP CAPACITOR
CM21COG331J50AT
40
C5
CHIP CAPACITOR
CM316Y5V224Z50AT
41
C25, 26, 27, 28, 29, 30
CHIP CAPACITOR
CM21Y5V104Z50AT
42
U3
IC HYBRID
AH1504F
43
MICOM IC
PIC16C711
44
P.C.B
TC30
45
AC PLUG ASS'Y
46
PLUG TERMINAL
47
CONTACT TERMINAL
48
CONTACT TERMINAL
49
CASE BOTTOM
50
CASE TOP
51
SCREW
52
SCREW
53
OUTPUT CABLE ASS'Y
54
LABEL
55
CARTON BOX
56
MAIN BOARD
57
CARD BOARD(A)
58
CARD BOARD(B)
59
PAD
60
VINYL SACK
AXR324100201
SAMSUNG Proprietary-Contents may change without notice
8-27
8-5 CLA Parts List
No
Design LOC
DESCRIPTIONS
SEC CODE
REMARKS
MAIN SMD ASS'Y
1
C6, C9
CERAMIC CAPACITOR
CL21B04JBNCS/0.1U
2
C3
CERAMIC CAPACITOR
CL21B103JBNCS/0.01U
3
C5, C10
CERAMIC CAPACITOR
CL21B224JBNCS/0.22U
4
D7
CHIP DIODE
KDS181
5
D5, D6
CHIP DIODE
KDS184
6
R21
CHIP RESISTOR
RC1608J102CS/1K OHM
7
R111, R12, R22, R34
CHIP RESISTOR
RC1608J104CS/100K OHM
8
R31
CHIP RESISTOR
RC1608J134CS/130K OHM
9
R33
CHIP RESISTOR
RC1608J182CS/1.8K OHM
10
R15
CHIP RESISTOR
RC1608J222CS/2.2K OHM
11
R29
CHIP RESISTOR
RC1608J272CS/2.7K OHM
12
R35
CHIP RESISTOR
RC1608J304CS/300K OHM
13
R13
CHIP RESISTOR
RC1608J333CS/33K OHM
14
R14
CHIP RESISTOR
RC1608J335CS/3.3M OHM
15
R5
CHIP RESISTOR
RC1608J392CS/3.9K OHM
16
R16, R17
CHIP RESISTOR
RC1608J431CS/430 OHM
17
R27
CHIP RESISTOR
RC1608J432CS/4.3K OHM
18
R6, R24
CHIP RESISTOR
RC1608J562CS/5.6K OHM
19
R7, R18, R19, R20,
CHIP RESISTOR
RC1608J912CS/9.1K OHM
R26, R28, R30, R32
20
Q3, Q5, Q7, Q9, Q10, Q11
CHIP TRANSISTOR
KSR1104/NPN
21
Q4, Q8
CHIP TRANSISTOR
KSR2104
22
Q1, Q6
CHIP TRANSISTOR
KTA1504
INSERT ASS'Y
23
J1
7 PIN CONNECTOR
GILS-7P-S2T2-EF
24
L1
CHOKE COIL
RF-300/300UH
25
D2, D4
SCHOTTKY DIODE
1N5819
26
D1
TRANSIENT DIODE
P6KE36A
27
U4
DIODE
KA431
28
C7
ELECT CAPACITOR
CESSL1C100MAAT/10U16V 105˚C
29
C2, C4
ELECT CAPACITOR
CESSL1C331MAAT/330U16V 105˚C
30
C1
ELECT CAPACITOR
CESSX1V101MAAT/100U35V 105˚C
31
F1
FUSE
250V/2A
32
U1
ADJUST REGULATOR I.C.
LM2576T-ADJ
33
U2
O.P AMP
KA358D
34
U3
O.P AMP(14P)
KA324D
35
LED 1, 2
DUALL COLOR LED LAMP
SAM3270
36
R4
CARBON FILM RESISTOR
0.5 OHM 11/2W
37
R2
CARBON FILM RESISTOR
11K OHM 1/4W
8-28
SAMSUNG Proprietary-Contents may change without notice
No
Design LOC
DESCRIPTIONS
38
R1
CARBON FILM RESISTOR
470 OHM 1/4W
39
R3
CARBON FILM RESISTOR
680 OHM 1/4W
40
VR1
V. RESISTOR
1K OHM/VOLUME/GF06P
41
CURL CORD ASS'Y
7 PIN/MQ179
42
CLA PCB
FR-4 (T=1.6)
43
OUTER GND
1.68PIE/25MM
44
WIREJUMPER
PC/BLACK
45
UPPER COVER
PC/BLACK
46
LOWER COVER
PC/BLACK
47
FUSE COVER
CLA OUTER SPRING
48
OUTER SPRING
CLA POWER CONTACT
49
POWER CONTACT
CLA
50
SPRING
FUSE HOLDER/CLA
51
FUSE HOLDER
FUSE PLATE/CLA
52
FUSE PLATE
TAPPING SCREW
+PH (2.6x14-2S) BLACK
53
UPPER+LOWER
NAME LABEL
CLA010A
SEC. CODE
REMARKS
ELECTRIC ASS’Y
PACKING ASS’Y
54
HANISHELLL
55
OUT BOX
CARTON BOX
56
CURRUGATED PAD
CLA CORRUGATED PAD
57
CLA SPONGE
SAMSUNG Proprietary-Contents may change without notice
8-29
9. PCB Diagrams
9-1
Cellular Phone
9-1-1 Main PCB - LOGIC B'D
9-1
Cellular Phone
9-1-2 Main PCB - LOGIC B'D
9-1
Cellular Phone
9-1-3 Main PCB - RF B'D
9-1-4 LCD FPC
9-2 Desk-Top rapid Charger PCB
Top View
Bottom View
9-3 Hands-Free kit 1 PCB
Top View
Bottom View
9-4 Cradle 1 PCB
Top View
9-5 TC PCB
Top View
Bottom View
9-6 CLC PCB
Top View
Bottom View
Main Block Diagram
SCH - 811 BLOCK DIAGRAM
3.6V
BATTERY
DC/DC
550mAh
1000mAh
1600mAh
Regulator
3.3V
Regulator
3.3AV
Regulator
3.3BBA
Regulator
3.3VT
Regulator
3.3VRC
3.7V
CONV.
COMBINATION MEMORY
8M FLASH + 2M SRAM
FLASH MEMORY
8M FLASH
EEPROM
256K BITS
1st RF
2nd RF
SAW
FILTER
Driver
Amp
SAW
FILTER
130.38 MHz
IF AGC
AMP
I
PA
D/A CONV.
USER
INTERFACE
80186 16BIT
CPU
Q
&
824~894 MHz
Filter
PLL
&
VCO
DUPLEXER
10-1
LCD
&
KEY
Interleaver
MOD.
&
Encoder
Vocoder
A/D CONV.
1ST LO
SYNTH
&
(966.87+/12.5 MHz)
MIC
PCM
CODEC
&
Filter
SPK
VCO
RF SAW
FILTER
RF AMP
IF BPF
DEMOD
IF AGC
AMP
A/D CONV.
I
LNA
Q
869~894 MHz
85.38 MHz
Deinterleaver
&
Decoder
EXT
Vocoder
I/F
&
EVRC
Filter
FM DATA
PROCESSOR
FM AUDIO
PROCESSOR
10-2
Desk-Top rapid Charger Block Diagram
C-C
Input
Line
Rectifier
Rectifier
Filter
& Flate
& Flate
Filter
C-V
FET-S/W
Control
Front-out
4.2V/0.8A
Snubber
u-com
Rectifier
& Flate
Reference
Switch
|
LED
Over-voltage protection
Display
LED-controller
Controller
charging control
O.C.P
O.V.P
|
Thermal protection
Feedback
Buck Converter
Filter
C-C
C-V
Control
FET-S/W
Rear-out
4.2V/0.4A
10-3
Hands-Free kit 1 Block Diagram
STABILITY
CIRCUIT
POWER
(10V~28V)
POWER
CONTROL
REGULATOR 5V
(RESET CIRCUIT)
DC/DC
REGULATOR
CURRENT
DETECTOR
VOLTAGE/
CURRENT
FEEDBACK
IGNITION
MICOM
CRADLE
DATA
COMMUNICATION
EEPROM
DSP
Tx AMP
CALIBRATION
CODEC
Rx AMP
MICROPHONE
VOLUME
CONTROL
AUDIO AMP
SPEAKER
10-4
Travel Charger Block Diagram
1
2
3
4
5
6
7
8
9
10
11
12
14
13
15
16
A
A
R105
CD
FM_CLK
FM_STB
FM_RX_QD
FM_RX_ID
100
MSM
100
+3.3V : E6, F5, J5, K6, E9, F10, J10, K9
R182
R181
DGND : E7, E8, F6, F7, F8, F9, G5, G6,
C106
100pF
100pF
10K
C151
1000pF
C152
100pF
R183
Q_OFFSET
+3.3V
C104
2.2K
C103
220pF
1K
+3.3V
470pF
1000pF
+3.3V
C183
C184
C185
0.01uF
0.01uF
0.01uF
0.01uF
P10
A12
U102
6
5
17
26
+3.3V
R117
1K
VCC
VCCP
VLR+
VLR-
VCCA
BZ
GND
GNDP
GNDA
LO
B11
19
16
15
14
18
42
C115
+ C117
C116
21
8
36
0.01uF
0.1uF
1U/10V(R)
TP1
M10
1K
R120
+3.3V
2
1
F
MMBT2222A
A0
A1
A2
GND
VCC
NC
SCL
SDA
R124
8
7
6
5
R121
15K
24LC256
B5
C7
A7
A8
C8
B9
C9
D9
MUX_CTL
SCL
SDA
D110
3
C208
R218
2
1
4
3
150
C207
SVC_LED
2
R216
22K
C119
1
0.01uF
SML-020MLT
C162
R126
ALT_LED
OPEN
M4
R129
DP_TX_DATA
DP_RX_DATA
1
100
P5
R130
V_DC
M3
470
M5
C123
C122
C121
TP2
N5
1U/10V
A6
JACK_S
A3
L101
Q103
6
5
4
BATT
D1 D2
D3 D4
S G
1
2
3
+ C125
33U/6.3V(B)
1
2
3
4
5
6
7
8
C127
0.01uF
100K
R136
10K
Q104
1UF
VDD
VS
LL_
DR
DMAX_SS
DS
COMP
PGND
UVLOSET
FB
NI
COSC
VREF
ROSC
GND
ENABLE
1
2
3
4
(1608)
16
15
14
13
12
11
10
9
D1
S1
S1-1
G1
D2
S2
S2-2
G2
100K
8
7
6
5
C129
R150
C132
100U/6.3V(B)
0.1uF
0.1uF
3
1
DTC144EE
4
5
+3.3AV
VCC INB
INA
OUTGND
4
1
2
3
4
ADC_IN0
1
DGND1
DGND2
DGND3
DGND4
R145
47K
6.8K
D104
DA204UT
R146
100K
100K
V_F
R122
R123
1.2K
10K(1%)
LRS1306
C211
0.1uF
D124
3
R230
2
DSP_RESET_
D126
25
26
19
23
31
30
28
X102
SSR27.00B-C15
CKO
TDO
M12
P8
L7
52
9
63
21
27
D
+3.3V
TC4W53F
PCM_DOUT
R213
13K
C181
H2
R225
33
R212
33
IMD_CTL
ADC_SEL1
ADC_SEL0
ADC_IN0
TRK_LO_ADJ
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
0
MODE_SEL
_IDLE
_SLEEP
CHIPX8
C166
R222
OPEN
BUZZ_
OPEN
VBAT
VBAT
R190
C_RX_QD(3)
C_RX_QD(2)
C_RX_QD(1)
C_RX_QD(0)
C_RX_ID(3)
C_RX_ID(2)
C_RX_ID(1)
C_RX_ID(0)
TX_CLK
_TX_CLK
CHIPX8
PA_ON
100K
C164
U111
4
C_RX_ID(3)
C_RX_ID(2)
C_RX_ID(1)
C_RX_ID(0)
MUX_CTL
V_DC
ADC_EN
ADC_DATA
ADC_CLK
TX_IQ_D(7)
TX_IQ_D(6)
TX_IQ_D(5)
TX_IQ_D(4)
TX_IQ_D(3)
TX_IQ_D(2)
TX_IQ_D(1)
TX_IQ_D(0)
8
7
6
5
LED_ON
R221
OPEN
L2
H1
H4
E
U112
COMMON VDD
CH0
INH
CH1
VEE
A
VSS
Q123
C2
B1
C1
F4
F3
F2
F1
C
J104
+3.3V
G4
G3
G2
G1
14
51
10
1
_PCS6
J2
J1
H3
J4
K1
K2
J3
L1
IBF2_PIBF
IBF1
DO1
11
TCK
TMS
RSTB
TRST
CKI2
CKI
TDI
1
2
3
4
CO_DIN
MMBT2222A
1K
L11
2
TCXO_4
TC7S04F
C_RX_QD(3)
C_RX_QD(2)
C_RX_QD(1)
C_RX_QD(0)
0.01uF
PLL_CLK
PLL_DATA
PLL_EN
SYN_EN
RX_AGC_ADJ
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
F
+3.3V
TX_AGC_ADJ
LOCK
ADC_EN
ADC_DATA
ADC_CLK
Q_OFFSET
I_OFFSET
G
FM_RX_ID
FM_RX_QD
FM_CLK
FM_STB
TCXO_4
TX_IQ_D(7)
TX_IQ_D(6)
TX_IQ_D(5)
TX_IQ_D(4)
TX_IQ_D(3)
TX_IQ_D(2)
TX_IQ_D(1)
TX_IQ_D(0)
_TX_CLK
SPK-
TX_CLK
H
HEADER30X2
SPK+
+3.3V
A10
D1
M2
LCD_CS
D130
SM05
_SLEEP
_IDLE
4.7K
MODE0
MODE1
MODE2
B2
C3
D4
I_OFFSET D3
Q_OFFSET D2
2
1
4
5
6
D129
D111
CD
RI
D135
RTS
KEY_0
V_F
KEY_1
C_F
1
2
3
SMS05C
UP
F4
DOWN
F1
F2
F3
SMS05C
SEND
CLR
J110
100K
100K
END/P
1
2
3
4
5
6
RX_AUDIO
DGND
C_F
DGND
TX_AUDIO
DGND
DP_RX_DATA
DP_TX_DATA
HP_PWR
RI
CD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
V_F
DGND
RTS
BATT
BATT
CTS
DTR
DGND
C_F
V_F
BATT
3
2
4
5
KEY_2
J103
R173
D125
+3.3V
R211
22K
M14
L12
N14
R175
D123
CO_DOUT
9
NC1
36
NC2
IACK
OBE2_POBE
OBE1
18
TRAP
12
INT1
13
INT0
7
DI1
EL_EN
100K
D122
_LWR
_RD
N12
3
C133
D121
NC
U115
DSP1627SS
58
OCK2_PCSN
57
DO2_PSTAT
56
SYNC2_PBSEL
55
ILD2_PIDS
53
OLD2_PODS
_PCS6
C156
100pF
V_DC
R174
D120
OLD1
OCK1
ICK1
ILD1
SYNC1
SADD1
DOEN1
C170
C171
0.01uF
0.1uF
J105
0.1uF
1000pF
5
C158
0.01uF
MBM29LV800T
R189
22K
N13
R172
BATT
2
3
4
5
62
61
60
3
C155
0.1uF
22
VSS1
25
VSS2
+3.3V
VOL_KEY
10U/6.3V(R)
7
R210
47K
AD(15)
AD(14)
AD(13)
AD(12)
AD(11)
AD(10)
AD(9)
AD(8)
AD(7)
AD(6)
AD(5)
AD(4)
AD(3)
AD(2)
AD(1)
AD(0)
37
36
35
34
C_RX_QD(0:3)
1
2
3
SCAN_0
KEY_3
SCAN_1
R149
23
18
16
14
35
33
31
29
19
17
15
13
34
32
30
28
VEC3_IOBIT4
VEC2_IOBIT5
VEC1_IOBIT6
VEC0_IOBIT7
7
8
9
*
0
H
D127
NNYG101TS
R177
C167
100K
1500P
J
LCD_CONN_22
C161
0.1U
C222
0.1U
C200
C202
C198
C197
C163
100K
I
47P 0.1U 47P 47P 0.1U 47P 47P 47P 47P 47P 47P 47P 47P 47P 470P 47P
C201
Engineer:
CDMA2
Drawn by:
JB-KIM
R&D CHK:
IFCON
100K
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
LCD_CS
_RESET
A(1)
DGND
AD(7)
D112
AD(6)
AD(5)
1 SMS05C
AD(4)
AD(3)
AD(2)
AD(1)
AD(0)
6
DGND
+3.3V
+3.3V
SPK+
SPKMOTOR
EL_EN
0.1U
C194
C192
C190
C196
C187
C188
C186
C191
C195
C193
C199
K
COMPANY NAME
Address
City
Size:
A3
TITLE:
R178
R168
51
V_F_CON
R169
51
R170
51
R171
51
B
R188
2
0.01uF
10K
0
_RD
_LWR
_RAM_CS
12
37
RY_BY*
21
_BYTE
11
_RESET
+3.3V
R186
_RESET
VCC
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
24
_OE
26
_CE
10
_WE
R187
TX_IQ_D(0:7)
SCAN_0
SCAN_1
SCAN_2
SCAN_3
SCAN_4
SCAN_5
SCAN_6
V_DC
Q101
DTA144EE
C118
GND
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
1
TC7W04FU
R176
1
3
31
_SWE
44
_SCE
9
_SOE
_FRP
_RESET
0.1U
R148
100K
AD(15)
AD(14)
AD(13)
AD(12)
AD(11)
AD(10)
AD(9)
AD(8)
AD(7)
AD(6)
AD(5)
AD(4)
AD(3)
AD(2)
AD(1)
AD(0)
100
4.7K
2SC4081BR
27
A(19)
A(18)
A(17)
A(16)
A(15)
A(14)
A(13)
A(12)
A(11)
A(10)
A(9)
A(8)
A(7)
A(6)
A(5)
A(4)
A(3)
A(2)
A(1)
R185
10K
38
39
20
3
2
1
4
5
6
7
8
40
41
42
43
46
45
44
27
+3.3AV
29
C_RX_ID(0:3)
R147
+3.3V
K
11
_KEYSENSE4
+ C138
MIC5205-3.3BM5
C221
R144
Q107
LCD_CS
_SLEEP
_IDLE
GPIO7
5
VIN VOUT
GND
CONT BYP
C137
TC7S32FU
3
C_RX_QDATA3
C_RX_QDATA2
C_RX_QDATA1
C_RX_QDATA0
_RFR
+3.3AV
150K
2
_CTS
10U/6.3V(R)
R153
HP_PWR
C_RX_IDATA3
C_RX_IDATA2
C_RX_IDATA1
C_RX_IDATA0
470pF
R142
68K(1%)
1
2
3
_GP_WR
GPIO_INT1
C135
0.1U
U107
U116
GPIO17
+ C136
MIC5219-3.3BM5
C220
R141
100K(1%)
0.1uF
TX_IQDATA7
TX_IQDATA6
TX_IQDATA5
TX_IQDATA4
TX_IQDATA3
TX_IQDATA2
TX_IQDATA1
TX_IQDATA0
TAMN1
5
VIN VOUT
GND
CONT BYP
28
_RD
_FOE
_ROM_CS 26 _FCE
_LWR 10 _FWE
M11
R223
1
150K
15K
C128
CHIPX8
TCXO_4
TX_CLK
_TX_CLK
2
+3.3V
U106
1
2
3
R152
A(19)
A(18)
A(17)
A(16)
A(15)
A(14)
A(13)
A(12)
A(11)
A(10)
A(9)
A(8)
A(7)
A(6)
A(5)
A(4)
A(3)
A(2)
A(1)
A(0)
U114
U110
MSM2300BGA
RESET_
VCC
GND
MAX809S
C130
100pF
R139
R135
100K
GPIO_28
GPIO22
ADC_ENABLE
ADC_DATA
ADC_CLK
U108
RN1104
R138
J
_DT_R
GPIO21
ON_SW_SENSE
2
22K
SI9161
56K
_PCS6
GPIO20
Q106 3
UPS5819
+ C131
_ROM_CS
_RAM_CS
_EEPROM_CS
GPIO13
R151
V_DC
D109
SI6803
_LWR
TMS
TCK
TDO
TDI
_TRST
GPIO14
GPIO15
GPIO16
M6
GPIO19
P9
GPIO_INT0
+3.3V
C139
U105
R134
PS_HOLD
DC_DC_CON
10uH
MCL4148
0.1uF
SI3443
I
D107
R137
100
C126
_HWR
M9
_RESIN
P11
RESOUT
33K
SMS05C
VBAT
WDOC_STB
P4
DP_TX_DATA
L5
DP_RX_DATA
470pF
100pF
100pF
470pF
C120
R127
+3.3V
4
C210
47P
C180
_RD
5
2
FR2S2025-052500
22K
3
2
6
S1
R215
3
22K
M8
R133
1
Q124
2SA1576
R132
+3.3V
100
D128
39K
1
R131
DTR
CTS
R214
D11
C12
B13
B14
D12
C13
E10
C14
E12
D13
E11
D14
F12
E13
E14
F11
G12
F14
F13
G14
_WP_ROM
RTS
WDOG_EN
100
IMD_CTL
U114
TC7W04FU
+3.3V
2
XTAL_OUT
L9
GPIO_INT2
P2
PDM1
P3
PDM2
REED_SW
2
47P
47K
BATT
4.7K
DTC144EE
C209
P6
R217
Q125
3
47P
+3.3V
SVC_LED
47P
150
R220
G
A9
N6
DTC144EE
XTAL_IN
B6
GPIO8
D7
GPIO9
B7
GPIO10
B8
GPIO11
D8
GPIO12
Q126
+3.3V
MOTOR
OPEN
SSR27.00B-C15
1K
PLL_DATA
PLL_CLK
PLL_EN
V_F_CON
ADC_SEL0
ADC_SEL1
SYN_EN
PLL_DATA
PLL_CLK
PLL_EN
V_F_CON
ADC_SEL0
ADC_SEL1
SYN_EN
MODE_SEL
H
N11
R125
DTA144EE
1K
L10
X101
U104
3
R128
2
P12
10K
+3.3V
3 Q121
M13
P13
K10
N7
GPIO24
N10
GPIO_INT4
N4
RINGER
L6
GPIO18
SEND_END
RX_AUDIO
BUZZ_
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
B12
PCM_SCS
B10
AUX_PCM_CLK
C10
AUX_PCM_SYNC
D10
AUX_PCN_DIN
A11
AUX_PCM_DOUT
+3.3AV
41
E
1
2
3
4
PCM_CLK
M7
GPIO23
P7
GPIO25
N8
GPIO26
L8
GPIO27
MODE_SEL
DSP_RESET_
ST5092TQ
Q120
PCM_SYNC
+3.3V
R116
1
PCM_DOUT
1
C169
0.1uF
SPK+
SPK-
VFR+
VFR-
C11
Q119
MMBT2222A
47
45
42
40
37
35
33
30
46
43
41
39
36
34
32
29
I_O15
I_O14
I_O13
I_O12
I_O11
I_O10
I_O9
I_O8
I_O7
I_O6
I_O5
I_O4
I_O3
I_O2
I_O1
I_O
6
3
2
20
10
24
25
1
2
0.1uF
R155 R113
5.6K 1M
CO
CI
CS
CCLK
38
MIC3+
37
MIC3-
C112
1SS226
R250
4.7
DX
DR
FX
MCLK
31
MIC2+
30
MIC2-
C168
0.1uF
D102
A13
34
MIC1+
33
MIC1-
3
12
FVPP
14
_FWP
5
OPEN
0.1uF
13
SVCC
38
FVCC
3
C204
OPEN
C111
FA18
FA17
SA17_FA16
SA16_FA15
SA15_FA14
SA14_FA13
SA13_FA12
SA12_FA11
SA11_FA10
SA10_FA9
SA9_FA8
SA8_FA7
SA7_FA6
SA6_FA5
SA5_FA4
SA4_FA3
SA3_FA2
SA2_FA1
SA1_FA0
SA0
4
+
C203
47P
1UH(X)
10U/6.3V(R)
C109
0.1uF
C205
47P
L105
1.5K
+ C110
6
2.7K
+3.3AV
TX_AUDIO
C206
R115
+3.3AV
100K
5
R114
R111
C108
PCM_DIN
4
2
4
5
3
1
GPIO_INT3
1
TC75W56FU
33U/6.3V(B)
D
_WP_ROM
CO_DOUT
PCM_SYNC
PCM_CLK
PCM_DOUT
CO_DIN
SEND_END
JACK_S
2
8
1
7
4
VCC
AOUT
BOUT
GND
15
16
48
1
2
3
4
5
6
7
8
17
18
19
20
21
22
23
25
24
A(19)
A(18)
A(17)
A(16)
A(15)
A(14)
A(13)
A(12)
A(11)
A(10)
A(9)
A(8)
A(7)
A(6)
A(5)
A(4)
A(3)
A(2)
A(1)
A(0)
AD(15)
AD(14)
AD(13)
AD(12)
AD(11)
AD(10)
AD(9)
AD(8)
AD(7)
AD(6)
AD(5)
AD(4)
AD(3)
AD(2)
AD(1)
AD(0)
3
AA+
B+
B-
SMS05C
2
3
5
6
G11
G13
H14
H13
H12
H11
J14
J13
J12
J11
K14
K13
K12
K11
L14
L13
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
U103
R109
120K
R110
43K
J102
R112
OPEN
0.1uF
R224
1K
U109
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
VDDA
IOBIT3_PB7
IOBIT2_PB6
IOBIT1_PB5
IOBIT0_PB4
SADD2_PB3
DOEN2_PB2
DI2_PB1
CK2_PB0
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSSA
C134
D101
SM05
SYNTH_LOCK
PA_ON
PA_R0
RA_R1
LNA_RANGE
TRK_LO_ADJ
TX_AGC_ADJ
RX_AGC_ADJ
39
40
41
42
44
45
46
47
C5
B4
D5
A4
C6
A5
D6
200K
R108
1K
BATT
K4
L4
L3
N1
N2
N3
K3
M1
+3.3AV
LNA_GAIN
ALE
NMI
MIC
+3.3V
FM_RX_CLK E2
FM_RX_STB E1
FM_RX_QDATA E3
FM_RX_IDATA E4
U101
AD(7)
AD(6)
AD(5)
AD(4)
AD(3)
AD(2)
AD(1)
AD(0)
PCM_CLK
PCM_SYNC
A(0:19)
1
8
17
22
33
43
49
59
32
C182
WSYMCLK_GPIO29 N9
MASKDATA_GPIO30 K5
22K
4.7K
R154
AD(0:15)
100pF
R107
A2_KEYSENSE0
C4_KEYSENSE1
B3_KEYSENSE2
E5_KEYSENSE3
J111
+3.3V
100pF
20K
8200pF
C100
0.01uF
+3.3V
C154
10K
STOP
R103
R102
C102
R101
C101
R100
C153
1K
15
1K
TRK_LO_ADJ
TX_AGC_ADJ
RX_AGC_ADJ
C
C159
0.01uF
R184
PA_ON
B
C160
1000P
I_OFFSET
1K
G7, G8, G9, G10, H5, H6, H7, H8,
H9, H10, J6, J7, J8, J9, K7, K8
R104
VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
C105
LOCK
+3.3V
6
16
20
24
38
48
50
54
64
R106
RI
KEY_0
LED_ON
DOC CTRL CHK:
100K
KEY_1
SCH-811 LOGIC
KEY_2
MFG ENGR CHK:
16 1 12 A
L
L
Changed by:
Date Changed:
CDMA2
1
2
3
4
5
6
7
8
9
10
11
1999.02.12
12
Time Changed:
9:02:31 am
13
REV:
QA CHK:
14
Drawing Number:
15
Page: 1
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A
A
+3.3VRC
C340
100P
R332
3
R334
1
2
4
36K
+
5
R335
43K
C355
0.047U
U314
LMV821
R333
56K
C389
BLM11A102S 3.3U/6.3V(R)
1
C300
0.047U
C398
4700P
3
C301
1000P
Q300
2SC4081BR
IMD_CTL
100P
F300
DFA0836G0881A
4
10
TXOUTPUT
C304
7P
D
R323
OPEN
R330
1K
L305
39N(X)
R325
2K
L304
100P
C307
5P
4
Q301
BFP196W
C311
100P
L306
8P
C321
R305
1
C316
100P
C312
L350
3
15N(W)
Q302
BFP420
2
2
OUT
~OUT
C388
470P
L312
390N(X)
9
4
C327
10
5
1000P
C397
OPEN
6 7 8
_FMIF
NC
IFCON
GND1
GND2
GND3
GND4_IFCON
L315
OPEN
470N(X)
10
RXIF
C333
470P
R326
OPEN
9
_RXIF
D
C334
470P
C335
OPEN
OPEN(X)
F303
SAFC85.380ME35X
100K
+3.3VRC
C
C330
RF2617
L314
R308
47N(W)
5
8
3
6
11
12
RX_AGC_ADJ
1K
13
14
15
_CDIF VCC1
VCC2
4
FMIF VCC3
4700P
MODE_SEL
R309
16
2
C328
1 2 3
C323
1000P
7
CDIF IN_SEl
GC
L313
120N(X)
SW395
1
6
G1G2G3G4G5G6
B
L316
470N(X)
+3.3VRC
C339
0.1UF
R301
R300
C337
100P
C342
100P
U310
2
L322
5.6N(W)
U309
R321
100
C345
1
V_DC
CTL
BYP
GND
2
10uF/6.3V(R)
2
F
10uF/6.3V(R)
4
C356
0.01UF
R310
47K
G
_SLEEP
C357
4700P
C346
1P
U306
LMX2332L
+3.3VRC
C393
100P
VCC
19 20
C349
100P
OUT
GND1
GND2
GND3
GND4
GND5
3
C347
10U/6.3(R)
VT
4
R318
16
1
R316
0
C351
2 5 6 7 8
3900P
C350
100P
R317
16
4
R314
0
C353
56P
R315
5.1K
J300
PLL_CLK
PLL_DATA
PLL_EN
SYN_EN
RX_AGC_ADJ
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
C352
0.22U/6.3(R)
U311
C354
C382
0.1U
0.01UF
+3.3BBA
+3.3V
3
TX_AGC_ADJ
LOCK
ADC_EN
ADCDATA
ADCCLK
Q_OFFSET
I_OFFSET
VOUT
CTL
VIN
BYP
GND
2
1
R327
0
C386
0.033U
C384
4
4700P
R328
910
5
3
6
8
13
16
DO_RF _RX_IN
GND1
_IFIN
IFIN
GND2
GND3
DOIF
GND4
GND5
C362
100P
TCO-555
3
OUT
VC
GND
GND1
GND2
1
2
5
6
TRK_LO_ADJ
H
C381
0.01U
VCC
4
L328
R399
BLM11A102S 150
+3.3BV
C365
C366
100P
0.01U
C348
10U/6.3V(R)
I
C383
10P
PLL_CLK
PLL_EN
PLL_DATA
C387
C367
C369
C370
0.01UF
100P
100P
100P
TCXO
+3.3VRC
U313
NTH5G36B103J01TE
C385
3.3U/6.3V(R)
C378
0.01UF
R322
47K
1
+3.3VT
U312
C374
MIC5205-3.3BM5
1
V_DC
RXIFMDATA
RXQFMDATA
FM_CLK
RXFMSTB
TCXO_4
TXD(7)
TXD(6)
TXD(5)
TXD(4)
TXD(3)
TXD(2)
TXD(1)
TXD(0)
U305
C363
100P
R313
10
7
RX_IN TCXO_IN
RX_IF_IN
R329
0
VDC_R
RX_IF_DO
2
14
15
17
1 18
11 12 10 9
MIC5205-3.3BM5
5
VIN
VOUT
5 10U/6.3V(R)
2
C372
0.01U
C373
100P
J
TEMPO
C371
0.01U
R324
6.2K
C375
10uF/6.3V(R)
C379
4700P
4
BYP
BUZZ_
4
2
BUZZ
GND
2
CTL
3
_IDLE
K
Engineer:
CDMA2
Drawn by:
JB-KIM
3
C376
4700P
1
RXQD(3)
RXQD(2)
RXQD(1)
RXQD(0)
RXID(3)
RXID(2)
RXID(1)
RXID(0)
TXCLK
TXCLK_
CHIPX8
PA_ON
VIN
C317
R320
0
U307
VC-3R3A30-0967
L321
BLM11A102S
H
BUZZ_
V_DC
V_DC
VBAT
VBAT
VOUT
4
6
R319
10
MRFIC0916
MODE_SEL
_IDLE
_SLEEP
L325
BLM11A102S 5
C396
10U/6.3V(R)
1P
4
1
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
C359
0.01UF
L309
BLM11A102S
MIC5205-3.3BM5
C399
100P
U308
STH-01R
IMD_CTL
ADC_SEL1
ADC_SEL0
ADC_IN0
TRK_LO_ADJ
L317
BLM11A102S
C360
4700P
10
C341
AT-32011
3
C361
1000P
3
4 2
L320
8.2N(W)
TX_1ST_LO
VDC_R
U304
C358
10U/6.3V(R)
3
100P
G
1
R311
L318
OPEN(W)
C344
C380
0.1U
R395
68K
1
E
+3.3VRC
C395
4700P
3
4
5
6
C343
0.01UF
C336
0.047U
2
R394
100
L319
8.2N(W)
F304
FAR-F5CE-967M00-K286 C338
3P
1
2
C313
0.1U
DTC144EE 3
MODE_SEL
R396
0
+3.3VRC
Q303
R393
OPEN
200
10
ANT
K
~IN
C332
4700P
U303
C324 C325
3P 470P
5
1
v2 out2
L303
C305
22P
F
J
6
3
2 4
OUT
2
gnd
in
IN
2 3 4 7 8 9
+3.3VRC
L307
18N(X)
I
5
1000P
3
v1 out1
1
C508
3P
L353
0N(W)
G4
6
G3
5
G2
4
G1
3
IN
1
E
1
U300
CMY210
4
C320
6 L323
8.2N(W)
5
12N
4P
10
L311
100N(CY)
U301
3P
4
L351
J301
MHC-173
C322
10P
15N(W)
1K
220
33P
C368
470P
L308
C315
100P
R307
F302
FB_G953
3 1
C306
OPEN
D301
BAR63-02W
F301
FAR-F5CE-881M50-D233
1
2
6.8N(W)
2
L302
6.8N(W)
C319
L330
C303
100P
1
C308
OPEN
C391
33P
C302
8P
D300
BAR63-02W
C326
100P
C310
0
C
C331
0.047U
L310
R306
12K 100N(X)
R398
L326
BLM11A102S
C314
0.047U
R303
10
C318
4700P
C309
0.1U
R302
27
2
4
D302
BCR400W
C390
4700P
L301
47N(W)
C329
220P
L300
VP
VP1
B
-
VCC
VCC1
MODE_SEL
100K
+3.3VRC
DATA
EN
CLK
FOLD
RX_AGC_ADJ
R331
1M
C364
0.1U
D310
DAN202U
VDC_R
COMPANY NAME
Address
City
R&D CHK:
16 1 12 A
SCH-811 RX
MFG ENGR CHK:
HEADER30X2
Size:
A3
TITLE:
DOC CTRL CHK:
L
L
Changed by:
Date Changed:
CDMA2
1
2
3
4
5
6
7
8
9
10
11
1999.02.12
12
Time Changed:
9:02:31 am
13
QA CHK:
REV:
14
Drawing Number:
15
Page: 1
16
1
2
3
6
5
4
7
8
9
10
12
11
13
14
15
16
A
A
U409
4
U401
Q5312I-3S2
64
+3.3BV
RXIFMDATA
TCXO
63
RXQFMDATA
61
+3.3V
TXVCO_T1
RXFMSTB
62
FMCLK
38
5
+3.3BV6
+3.3BV1
10
+3.3BV2
14 51
+3.3BV7
+3.3BV3
48
21 68
TXCLK +3.3BV4
+3.3BV8
49
23 71
TXCLK_+3.3BV5
+3.3BV9TXVCO_T2
75
ADCENA
74
ADCDATA
73
ADCCLK
FM_MOD
52
CHIPX8
29
TCXO_4
C
TXCLK
TXCLK_
ADC_EN
ADCDATA
ADCCLK
CHIPX8
TCXO_4
R447
OPEN
TXD(0:7)
47
46
45
44
43
42
41
40
TXD(7)
TXD(6)
TXD(5)
TXD(4)
TXD(3)
TXD(2)
TXD(1)
TXD(0)
D
E
PD_OUT
TXIQ7
TXIQ6
TXIQ5
TXIQ4
TXIQ3
TXIQ2
TXIQ1
TXIQ0
RXID(0:3)
RXID(3)
RXID(2)
RXID(1)
RXID(0)
RXQD(3)
RXQD(2)
RXQD(1)
RXQD(0)
RXQD(0:3)
56
55
54
53
60
59
58
57
F
LOCK
_SLEEP
MODE_SEL
_IDLE
I_OFFSET
Q_OFFSET
G
C443
0.01U
RXI3
RXI2
RXI1
RXI0
RXQ3
RXQ2
RXQ1
RXQ0
PD_ISET
RXVCO_OUT
C444
0
C445
0
C403
6P(1%)
R404
10K(1%)
0
R409
39K(1%)
R405
300(1%)
R445
0
C470
0.01U
R448
11.3K(1%)
C471
0.01U
C
R408
0
C406
OPEN
R410
1.8K
R400
C400
10
100P
TCXO
C407
1000P
D
C408
1U/10V(R)
C410
80
TEMPO
C405
2200P
R407
19
VBAT
10K(1%)
2
NO3
GND
47K
RX_IF_IN
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
2
RXVCO_T1
1 28
GND12
4 30
GND13
37
9
GND14
13 39
GND15
20 50
GND16
3
22 67
GND17RXVCO_T2
25 72
GND18
27
C411
R411
68P
10K
L402
68N(COI,X)
D402
1SV279
C413
6P(1%)
RX_IF_DO
E
D403
1SV279
+3.3VT
R412
10K
C412
68P
R450
0
Q402
C460
10UF
R416
0
2SA1576
L403
1UH(X)
R417
10K
PSV
C417
0.1U
C419
1000P
U402
C442
0.01U
NO2
NO1
VCC
C420
0.1U
C447
3.3U/6.3V(R)
C448
100P
C421
0.01U
7
F
C499
C446
47P
C431
1000P
C429
0.047uF
3.3U/6.3V(R)
C432 L407
100P 22N(TX)
R427
51
L406
33N(TX)
PA_ON
LOCK
SLEEP_
FM_
IDLE_
I_OFFSET
Q_OFFSET
TXIF
C422
12
1
1000P
TXIF_
R423
1.8K
2
C423
11
OUTX
IF_IN
IN_INX
OUT
5
C468
0.01U
R418
0
6
R419
0
U404
C416
1000P
3
GND
GCTL
U403
L404
120N(X)
8
C424
CXA3222N
2
IF-
VCC
1000P
33
NC1
34
NC2
65
NC3
66
NC4
L405
120N(X)
RFOUT
C425
1000P
R446
0
C427
C426
0.01U
100P
1
4
R425
1M
7
2
5
C450
1000P
0.01U
C418
18P
R444
1
F401
12N(TX)
FAR-F5CE-836M50-K205
C461
470P
R440
5.1K
C462
47P
R437
0
+
3
-
2
4
8
C498
3.3U/6.3V(R)
C451
0.1U
5
C452
0.01uF
C453
4.7uF
C409
1000P
U408
6
5
4
4
U405
LMV821
R441
12K
-
2
VBAT
U406
LMV821
D1D2
D3D4
S G
1
5
7
1
2
3
L409
38
68
C439
0.01U
C465
10U/6.3V(R)
23
C436
0.1U
VREF
PIN
I
VDD1
VDD2
GND4
GND1
9
GND2
GND3
POUT
6
TXOUTPUT
C495
OPEN
J
C435
0.01U
C433
OPEN
2
SI3443DV
R435
47K
+3.3BV
C434
100P
U407
RI23124U
3
C497
OPEN
4
3
H
TX_1ST_LO
5
+
C441
8200P
G
R428
20
L410
+3.3VT
1
20K
3
C438
0.01U
R443
2.2K R442
39K
C440
0.01U
TX_AGC
TX_AGC_ADJ
1
GN01037B
C430
1000P
R421
270K
LO_BYPASS
6
GND0
3
GND1 LO
560K
1
C428
100P
IF+
R422
TX_AGC
FAR-F5CE-836M50-D232
8
R424
430K
51
C449
R420
20
F400
RF2628
+3.3V
I
6
RF_IN
VDD1
4
VAGC
2
GND1
5
GND2VDD2
100P
R426
1K
C454
100P
J
C496
OPEN
Q401
DTC114EE
PA_ON
TX_AGC
+3.3BBA
BLM11A102S
C467
K
B
ADC_IN0
R449
1
MAX4524
R402
C402
39P
R403
10K
5
0
D401
1SV279
16
15
3
47K
D400
1SV279 R406
39P
L400
33N
ADC_SEL1
8
R401
100P
31
GND0
32
GND1
35
GND2
36
GND3
H
C401
ADC_SEL0
6
NO0
4
24
77
79
78
70
69
COM
ADDB
17
+3.3BBA
7
ADDA
26
18
10
INHIBIT V+
2
RXIF
_RXIF
RXIFMDATA
RXQFMDATA
RXFMSTB
FM_CLK
9
76
ADCIN
8
RSSI
1
B
7
RXIF
6
RXIF_
33UF/6.3V
C455
C456
C459
C404
C463
C464
1000P
0.01U
1000P
0.01U
1000P
0.01U
+3.3VRC
C414
14
C457
C458
1000P
0.01U
C437
1000P
U410
NTH5G36B103J01TE
10U/6.3V(R)
1
2
C415
0.01UF
R451
6.2K
R439
1.5K
R452
12K
K
Engineer:
CDMA2
Drawn by:
JB-KIM
R&D CHK:
R438
10K
C472
0.01U
COMPANY NAME
Address
City
Size:
A3
TITLE:
DOC CTRL CHK:
SCH-811 TX
MFG ENGR CHK:
16 1 12 A
L
L
Changed by:
Date Changed:
CDMA2
1
2
3
4
5
6
7
8
9
10
11
1999.02.12
12
Time Changed:
9:02:31 am
13
QA CHK:
REV:
14
Drawing Number:
15
Page: 2
16
10-5
Main Circuit Diagram (1/3)
Main Circuit Diagram (2/3)
Main Circuit Diagram (3/3)
LCD FPC Circuit Diagram
10-7 Hands-Free kit 1 Circuit Diagram (data)
Hands-Free kit 1 Circuit Diagram (audio)
Car Adaptor 1 Circuit Diagram
10-8
Cradle 1 Circuit Diagram
10-9
Travel Charger Circuit Diagram
10-10 CLC (Cigarette Lighter Charger) Circuit Diagram