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MBX Series Embedded Controller
Version B
Installation and Use
MBXA/IH3
September 2000 Edition
© Copyright 1997–2000 Motorola, Inc.
All rights reserved.
Printed in the United States of America.
Motorola, the Motorola logo, and PowerQUICC are registered trademarks of Motorola, Inc.
PowerPC is a registered trademark of International Business Machines Corporation and is used by Motorola with permission.
QSpan is a trademark of Tundra Semiconductor Corporation.
PC/104 and PC104-Plus are trademarks of the PC/104 Consortium.
I
2
C is a registered trademark of Philips Electronics.
All other products and/or services mentioned in this document may be trademarks or registered trademarks of their respective holders.
Safety Summary
The following general safety precautions must be observed during all phases of operation, service, and repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual could result in personal injury or damage to the equipment.
The safety precautions listed below represent warnings of certain dangers of which Motorola is aware. You, as the user of the product, should follow these warnings and all other safety precautions necessary for the safe operation of the equipment in your operating environment.
Ground the Instrument.
To minimize shock hazard, the equipment chassis and enclosure must be connected to an electrical ground. If the equipment is supplied with a three-conductor AC power cable, the power cable must be plugged into an approved three-contact electrical outlet, with the grounding wire (green/yellow) reliably connected to an electrical ground
(safety ground) at the power outlet. The power jack and mating plug of the power cable meet International
Electrotechnical Commission (IEC) safety standards and local electrical regulatory codes.
Do Not Operate in an Explosive Atmosphere.
Do not operate the equipment in any explosive atmosphere such as in the presence of flammable gases or fumes.
Operation of any electrical equipment in such an environment could result in an explosion and cause injury or damage.
Keep Away From Live Circuits Inside the Equipment.
Operating personnel must not remove equipment covers. Only Factory Authorized Service Personnel or other qualified service personnel may remove equipment covers for internal subassembly or component replacement or any internal adjustment. Service personnel should not replace components with power cable connected. Under certain conditions, dangerous voltages may exist even with the power cable removed. To avoid injuries, such personnel should always disconnect power and discharge circuits before touching components.
Use Caution When Exposing or Handling a CRT.
Breakage of a Cathode-Ray Tube (CRT) causes a high-velocity scattering of glass fragments (implosion). To prevent CRT implosion, do not handle the CRT and avoid rough handling or jarring of the equipment. Handling of a CRT should be done only by qualified service personnel using approved safety mask and gloves.
Do Not Substitute Parts or Modify Equipment.
Do not install substitute parts or perform any unauthorized modification of the equipment. Contact your local
Motorola representative for service and repair to ensure that all safety features are maintained.
Observe Warnings in Manual.
Warnings, such as the example below, precede potentially dangerous procedures throughout this manual.
Instructions contained in the warnings must be followed. You should also employ all other safety precautions which you deem necessary for the operation of the equipment in your operating environment.
Warning
Warning
To prevent serious injury or death from dangerous voltages, use extreme caution when handling, testing, and adjusting this equipment and its components.
Flammability
All Motorola PWBs (printed wiring boards) are manufactured with a flammability rating of 94V-0 by UL-recognized manufacturers.
EMI Caution
Caution
!
Caution
This equipment generates, uses and can radiate electromagnetic energy. It may cause or be susceptible to electromagnetic interference (EMI) if not installed and used with adequate EMI protection.
Lithium Battery Caution
This product contains a lithium battery to power the clock and calendar circuitry.
Caution
!
Caution
Danger of explosion if battery is replaced incorrectly. Replace battery only with the same or equivalent type recommended by the equipment manufacturer. Dispose of used batteries according to the manufacturer’s instructions.
Caution
!
Attention
Il y a danger d’explosion s’il y a remplacement incorrect de la batterie.
Remplacer uniquement avec une batterie du même type ou d’un type
équivalent recommandé par le constructeur. Mettre au rebut les batteries usagées conformément aux instructions du fabricant.
Caution
!
Vorsicht
Explosionsgefahr bei unsachgemäßem Austausch der Batterie. Ersatz nur durch denselben oder einen vom Hersteller empfohlenen Typ. Entsorgung gebrauchter Batterien nach Angaben des Herstellers.
CE Notice (European Community)
Motorola Computer Group products with the CE marking comply with the EMC Directive
(89/336/EEC). Compliance with this directive implies conformity to the following
European Norms:
EN55022 “Limits and Methods of Measurement of Radio Interference Characteristics of Information Technology Equipment”; this product tested to Equipment Class B
EN50082-1:1997 “Electromagnetic Compatibility—Generic Immunity Standard,
Part 1. Residential, Commercial and Light Industry”
System products also fulfill EN60950 (product safety) which is essentially the requirement for the Low Voltage Directive (73/23/EEC).
Board products are tested in a representative system to show compliance with the above mentioned requirements. A proper installation in a CE-marked system will maintain the required EMC/safety performance.
In accordance with European Community directives, a “Declaration of Conformity” has been made and is on file within the European Union. The “Declaration of Conformity” is available on request. Please contact your sales representative.
Notice
While reasonable efforts have been made to assure the accuracy of this document,
Motorola, Inc. assumes no liability resulting from any omissions in this document, or from the use of the information obtained therein. Motorola reserves the right to revise this document and to make changes from time to time in the content hereof without obligation of Motorola to notify any person of such revision or changes.
Electronic versions of this material may be read online, downloaded for personal use, or referenced in another document as a URL to the Motorola Computer Group website. The text itself may not be published commercially in print or electronic form, edited, translated, or otherwise altered without the permission of Motorola, Inc.
It is possible that this publication may contain reference to or information about Motorola products (machines and programs), programming, or services that are not available in your country. Such references or information must not be construed to mean that Motorola intends to announce such Motorola products, programming, or services in your country.
Limited and Restricted Rights Legend
If the documentation contained herein is supplied, directly or indirectly, to the U.S.
Government, the following notice shall apply unless otherwise agreed to in writing by
Motorola, Inc.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (b)(3) of the Rights in Technical Data clause at DFARS 252.227-7013 (Nov.
1995) and of the Rights in Noncommercial Computer Software and Documentation clause at DFARS 252.227-7014 (Jun. 1995).
Motorola, Inc.
Computer Group
2900 South Diablo Way
Tempe, Arizona 85282
Contents
CHAPTER 1 Installation Procedures
CHAPTER 2 Startup and Operation
Firmware Implementation and Memory Requirements ........................................... 3-2
vii
CHAPTER 4 VPD and ENV Commands
CHAPTER 5 Functional Description
2.88MB Floppy Disk Drive Controller .................................................... 5-15
Keyboard and Mouse Interface ................................................................ 5-15
MPC8xx Serial Communications Interface ..................................................... 5-17
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CHAPTER 6 Jumpers, Connectors, and LEDs
J11 DREQ# Signal Source for DMA-type PCMCIA Cards ........................... 6-10
8xx/COMM Expansion Connectors ............................................................... 6-17
LCD & SPI Connector J27 (MBX821) ........................................................... 6-22
PC/104-Plus (PCI) Expansion Connector P2 .................................................. 6-23
PC/104 (ISA) Expansion Connector J21/J22 .................................................. 6-25
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APPENDIX B Related Documentation
x
List of Figures
Figure 5-1. MBX821 Entry-Level Features Block Diagram ................................... 5-2
Figure 5-2. MBX860 Entry-Level Features Block Diagram ................................... 5-3
Figure 5-3. MBX821/860 Standard Features Block Diagram ................................ 5-4
Figure 6-1. MBX821/860 Connectors, Headers, LEDs .......................................... 6-2
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List of Tables
Table 5-1. Features of the MBX Series Embedded Controller ............................... 5-5
Table 6-3. Analog Power Connector Pin Assignments ......................................... 6-12
Table 6-8. Ethernet 10BaseT Connector Pin Assignments ................................... 6-16
Table 6-9. Ethernet AUI Header Pin Assignments ................................................ 6-17
Table 6-10. 860/COMM Expansion Connector Pin Assignments ........................ 6-17
Table 6-11. 821/COMM Expansion Connector Pin Assignments ........................ 6-19
Table 6-12. Utility Connector #1 (J16) Pin Assignments ..................................... 6-21
Table 6-13. LCD & SPI Connector Pin Assignments ........................................... 6-22
Table 6-14. PC/104-Plus Expansion Connector Pin Assignments ........................ 6-23
Table 6-15. PC/104 Expansion Connector Pin Assignments ................................ 6-25
Table 6-17. Floppy Disk Drive Connector Pin Assignments ................................ 6-28
Table 6-18. Utility Connector #2 (J19) Pin Assignments ..................................... 6-29
Table A-3. Maximum Power Consumption for Each PC/104-Plus Module ...........A-3
Table B-1. Motorola Computer Group Documents .................................................B-1
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About This Manual
The MBX Series Embedded Controller Version B Installation and Use manual provides general information, hardware preparation and installation instructions, operating instructions, a functional description, and various types of interfacing information for the MBX family of embedded controller boards.
The information in this manual applies to MBX version B models in both entry-level and standard configurations. The following table lists the specific MBX models documented in this manual:
Model Number
Entry-Level
MBX860-001B
Description
50 MHz MPC860 processor, 4MB DRAM, 2MB Flash, 10BaseT Ethernet,
32KB NVRAM, COMM interface connector
Standard
MBX821 models include 40 MHz MPC821 processor; PC/104-Plus; 10BaseT Ethernet; EIDE and Floppy interfaces; 32KB NVRAM; keyboard, mouse, IR, COM1 and COM2 ports; LCD panel connector
MBX821-001B
MBX821-002B
MBX821-003B
MBX821-004B
4MB DRAM, 4MB Flash
4MB DRAM, 4MB Flash
4MB Parity DRAM, 4MB Flash
16MB DRAM, 4MB Flash
MBX821-005B
MBX821-006B
16MB Parity DRAM, 4MB Flash
16MB DRAM, 8MB Flash
MBX860 models include 40 MHz MPC860 processor; PC/104-Plus; 10BaseT Ethernet; EIDE and Floppy interfaces; 32KB NVRAM; keyboard, mouse, IR, COM1 and COM2 ports; COMM interface connector
MBX860-002B 4MB DRAM, 4MB Flash xv
Model Number
MBX860-003B
MBX860-004B
MBX860-005B
MBX860-006B
4MB Parity DRAM, 4MB Flash
16MB DRAM, 4MB Flash
Description
16MB Parity DRAM, 4MB Flash
16MB DRAM, 8MB Flash
For installation and use information about other versions of the MBX821 or MBX860, refer to the documentation that covers your model:
For MBX Model Numbers . . .
MBX821-00x, MBX860-00x
MBX821-00xA, MBX860-00xA
MBX860-00xC
Refer to . . .
MBX Series Embedded Controller Installation and Use
(MBXA/IH1)
MBX Series Embedded Controller Installation and Use
(MBXA/IH1) and MBX Series version A customer letter
(MBXA/LT1)
MBX Series Embedded Controller Version C Installation
and Use (MBXCA/IH)
This manual is intended for anyone who wants to supply OEM systems, add capability to an existing compatible system, or work in a lab environment for experimental purposes. A basic knowledge of computers and digital logic is assumed. After using this manual, you may wish to become familiar with the publications listed in
.
xvi
Summary of Changes
This manual has been revised and replaces previous revisions.
Date
5/00
11/98
4/98
Changes
Updated safety information and legal notices; revised the title to reflect covered MBX version
An important note regarding 5V and 3.3V supplies was added to
Power Requirements on page A-2
MBXA/IH2 created to support MBX revision B models
Replaces
MBXA/IH2.1
MBXA/IH2
Overview of Contents
This manual is divided into the following chapters and appendices:
Chapter 1, Installation Procedures
, provides instructions for installing the MBX board in a system, adding or removing expansion modules, connecting or replacing batteries, and adding memory.
Chapter 2, Startup and Operation , describes power-up procedures and
processes and briefly discusses methods for restarting the system.
Chapter 3, EPPCBug Firmware , provides an overview of the MBX
firmware layer and software debugger including a summary of debugger commands.
Chapter 4, VPD and ENV Commands
, describes the VPD and ENV commands for viewing product data and configuring start-up parameters.
Chapter 5, Functional Description , details the features and functions
of the MBX and its components.
Chapter 6, Jumpers, Connectors, and LEDs , describes the on-board
LEDs, jumpers and jumper settings, and connector pin assignments.
xvii
, lists mechanical and environmental specifications and power and cooling requirements.
Appendix B, Related Documentation
, lists other Motorola Computer
Group publications, manufacturers’ documents, and industry specifications that provide additional sources of information related to the product.
Comments and Suggestions
Motorola welcomes and appreciates your comments on its documentation.
We want to know what you think about our manuals and how we can make them better. Mail comments to:
Motorola Computer Group
Reader Comments DW164
2900 S. Diablo Way
Tempe, Arizona 85282
You can also submit comments to the following e-mail address: [email protected]
In all your correspondence, please list your name, position, and company.
Be sure to include the title and part number of the manual and tell how you used it. Then tell us your feelings about its strengths and weaknesses and any recommendations for improvements.
Conventions Used in This Manual
The following typographical conventions are used in this document: bold is used for user input that you type just as it appears; it is also used for commands, options and arguments to commands, and names of programs, directories and files.
xviii
italic is used for names of variables to which you assign values. Italic is also used for comments in screen displays and examples, and to introduce new terms.
courier is used for system output (for example, screen displays, reports), examples, and system prompts.
<Enter>, <Return> or <CR>
Ctrl represents the carriage return or Enter key.
represents the Control key. Execute control characters by pressing the
Ctrl key and the letter simultaneously, for example, Ctrl-d.
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1
Installation Procedures
1
This chapter describes the equipment you need and the tasks you will perform to complete an MBX system.
Equipment Required
To complete an MBX system, you need the following equipment:
✓ Enclosure or chassis with power supply
✓ Display console
✓ Operating system (and/or application software)
✓ Disk drives (and/or other I/O) and connecting cables
Overview of the Installation Procedure
The following table lists the things you will need to do to use this board and tells where to find the information to perform each step.
Table 1-1. Installation Overview
What you need to do...
Unpack the hardware.
Verify that jumper settings are appropriate for your application.
Ensure that expansion modules are properly installed.
Install the MBX board in a chassis and connect a display console.
Refer to...
Unpacking the Board on page 1-2
MBX Jumper Headers on page 6-3
Installing Expansion Modules on page 1-7
Installing the Board on page 1-3
1-1
1
Installation Procedures
Table 1-1. Installation Overview (continued)
What you need to do...
Refer to...
Connect any other equipment you will be using.
MBX Connectors and Pin Assignments on page
(For more information on optional devices and equipment, refer to the documentation provided with the equipment.)
Power up the system.
Note that the firmware initializes the board.
Initialize the system clock, if necessary.
Examine and/or change environmental parameters.
Program the board as needed for your applications.
Chapter 2, Startup and Operation
Initialization Process on page 2-2
(You may also wish to obtain the EPPCBug
Firmware Package User’s Manual, listed in
Appendix B, Related Documentation .)
Chapter 4, VPD and ENV Commands
MBX Series Embedded Controller Version B
Programmer’s Reference Guide, listed in
Appendix B, Related Documentation
Unpacking the Board
ESD Precautions
ESD
Use ESD
Wrist Strap
Motorola strongly recommends that you use an antistatic wrist strap and a conductive foam pad when installing or upgrading a system. Electronic components, such as disk drives, computer boards, and memory modules, can be extremely sensitive to electrostatic discharge (ESD). After removing the component from its protective wrapper or from the system, place the component flat on a grounded, static-free surface (and, in the case of a board, component side up). Do not slide the component over any surface.
1-2 Computer Group Literature Center Web Site
Unpacking Guidelines
If an ESD station is not available, you can avoid damage resulting from
ESD by wearing an antistatic wrist strap (available at electronics stores) that is attached to an active electrical ground. Note that a system chassis may not be grounded if it is unplugged.
Unpacking Guidelines
If the shipping carton is damaged upon receipt, request that the carrier’s agent be present during the unpacking and inspection of the equipment.
Caution
Caution
When unpacking the equipment, avoid touching areas of integrated circuitry; static discharge can damage circuits.
Refer to the packing list and verify that all items are present. Save the packing material for storing and reshipping equipment.
Preparing the Board for Installation
The MBX series embedded controller provides software control over many options. By setting bits in control registers after installing the board in a system, you can modify its configuration. (Control registers are described in the MBX Series Embedded Controller Version B Programmer’s
Reference Guide listed in Appendix B, Related Documentation
.)
Some options, however, are not software-programmable. Such options are controlled through manipulation of jumper headers on the MBX board.
Use the information in
MBX Jumper Headers on page 6-3
to configure the board as appropriate for your application.
Installing the Board
Depending on your application, it may be convenient to attach those devices and expansion modules you intend to use with the MBX before you install the board. For example, if you intend to add expansion modules, you should review
Installing Expansion Modules on page 1-7
before you http://www.motorola.com/computer/literature 1-3
1
1
Installation Procedures begin. Similarly, if you intend to connect an external battery to power the keep-alive circuits on the MBX, you should do so at the time you install the MBX board (see
Connecting an External Battery on page 1-10 for
instructions).
To install the MBX board in your enclosure, refer to
for the location of connectors and jumper headers and follow the steps below.
You need a Phillips screwdriver for this procedure. Depending on how the user-supplied board-to-chassis standoffs are installed, you may also need a hex nut driver, typically 3/16 inch.
You will also need cables and connectors as appropriate for your application.
Warning
Warning
To prevent serious injury or death from dangerous voltages, use extreme caution when handling, testing, and adjusting this equipment and its components.
Caution
!
Caution
Inserting or removing modules with power applied may result in damage to module components.
Caution
Caution
Avoid touching areas of integrated circuitry; static discharge can damage circuits.
ESD
Use ESD
Attach an ESD strap to your wrist. Attach the other end of the ESD strap to an electrical ground. (Note that the system chassis may not be grounded
Wrist Strap
1-4 Computer Group Literature Center Web Site
Installing the Board if it is unplugged.) The ESD strap must be secured to your wrist and to ground throughout the procedure.
1. Perform an operating system shutdown. Turn the AC or DC power off and remove the AC cord or DC power lines from the system. Remove chassis or system cover(s) as necessary for access to the card cage.
2. Ensure that all jumper settings on the MBX board are configured as
appropriate for your application. (See MBX Jumper Headers on page
.)
3. Attach any expansion modules you intend to use. (See Installing
Expansion Modules on page 1-7 .)
Note Depending on your application, expansion modules can also be attached with the MBX board already installed in your system.
4. If the MBX board-to-chassis standoffs are not already installed in the enclosure, insert the standoffs through the holes drilled for that purpose in the chassis. Secure the standoffs with the nut driver or screwdriver as appropriate.
5. Place the MBX board on the standoffs.
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Installation Procedures
6. Insert four short Phillips screws through the holes at the corners of the
MBX board, into the standoffs you installed in the chassis, as shown in the following illustration. Tighten the screws.
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2155 9802
7. Connect the power and peripheral cables to the MBX board as appropriate for your system configuration. (See
Pin Assignments on page 6-12 for pinout information and
Interface Configuration on page 6-9 for IDE related jumper settings.)
Note If you intend to use external battery backup instead of the onboard battery backup, to avoid later loss of information in the keep-alive circuits on the MBX board, we recommend that you connect that external battery at the time you install the
MBX board. (See
Connecting an External Battery on page
8. Connect the terminal that you plan to use as the EPPCBug system console, if any, to the EIA-232-D serial port (J18 on the MBX board).
Computer Group Literature Center Web Site
Installing Expansion Modules
Configure the terminal for 9600 baud, eight bits per character, one stop bit per character, and no parity.
Notes 1. 9600 baud is the default baud rate of MBX ports at power up. After power up you can, if you wish, reconfigure the serial ports by programming the MBX console interface, or by using the EPPCBug Port Format
( PF) command.
2. In order for high-baud-rate serial communication between EPPCBug and the terminal to work, the terminal must do some form of handshaking. If your terminal does not do hardware handshaking via the CTS line, then it must do XON/XOFF handshaking. If you get unintelligible messages and missing characters, check the terminal to be sure that XON/XOFF handshaking is enabled.
9. Replace the chassis or system cover(s), reconnect the system to the AC or DC power source.
10. Proceed to
Chapter 2, Startup and Operation .
Installing Expansion Modules
PC/104 (ISA), PC/104-Plus (PCI), 8xx/COMM, and PCMCIA expansion modules plug into the top of the MBX board. In most cases, it will be more convenient to add expansion modules to the MBX board before it is installed in a system chassis. However, you can attach modules even if the
MBX is already installed, so long as the board is accessible.
To install an expansion module, refer to
for the location of the appropriate connectors and jumper headers and follow the steps below.
No tools are necessary for this procedure, except those needed to remove chassis or system cover(s).
Notes 1. If you add an 8xx/COMM expansion module (user-supplied), it must be installed first; PC/104 and PC/104-Plus modules
1 http://www.motorola.com/computer/literature 1-7
1
Installation Procedures stack on top of it. You can stack up to four expansion modules on the MBX.
2. Before mounting expansion modules, ensure that all userconfigurable jumpers on the board are set as necessary for your application. Some jumper headers may not be accessible with expansion modules installed. See
Jumper Headers on page 6-3 for jumper information.
Warning
Warning
To prevent serious injury or death from dangerous voltages, use extreme caution when handling, testing, and adjusting this equipment and its components.
Caution
!
Caution
Inserting or removing modules with power applied may result in damage to module components.
Caution
Caution
Avoid touching areas of integrated circuitry; static discharge can damage circuits.
ESD
Use ESD
Wrist Strap
Attach an ESD strap to your wrist. Attach the other end of the ESD strap to an electrical ground. (Note that the system chassis may not be grounded if it is unplugged.) The ESD strap must be secured to your wrist and to ground throughout the procedure.
1. If the MBX is already installed, perform an operating system shutdown. Turn the AC or DC power off and remove the AC cord or
DC power lines from the system.
2. Remove chassis or system cover(s) as necessary for access to the card cage.
1-8 Computer Group Literature Center Web Site
Installing Expansion Modules
3. Referring to
, locate the connector(s) provided for expansion modules on the MBX board:
❏ PC/104 (ISA) modules plug into J21 and J22 in tandem (8-bit modules use J22 only).
❏ PC/104-Plus (PCI) modules plug into P2.
❏ 8xx/COMM modules plug into P1.
❏ PCMCIA modules plug into XJ26. (See J11 DREQ# Signal
Source for DMA-type PCMCIA Cards on page 6-10 for related
jumper settings.)
Note PCMCIA modules can be installed with power applied to the system. Other modules cannot.
4. Seat the expansion module firmly and evenly in the appropriate connector(s) as shown in the following illustration. The plug on the
1 http://www.motorola.com/computer/literature 1-9
1
Installation Procedures underside of the expansion module should connect smoothly with the corresponding socket on the MBX board.
2154 9802
5. Replace the chassis or system cover(s) and reconnect the system to the
AC or DC power source as necessary, or proceed to Installing the
.
Connecting an External Battery
The keep-alive power circuitry of the MBX processor has a maximum current draw of 15
µ
A. At that draw, the on-board battery shipped with the
MBX can provide at least four years of continuous service. Utility connector #1 (J16 on the MBX board) provides pins for external battery
1-10 Computer Group Literature Center Web Site
Connecting an External Battery backup in applications requiring a more durable backup battery. The battery should be 3.0V to 3.6V.
In most cases, it will be more convenient to connect the external battery you intend to use at the time you install the MBX board. However, if you have already installed the MBX, you can still connect an external battery so long as utility connector J16 and jumper header J1 are accessible. If the
MBX is currently installed and running, keep in mind that data loss may occur if power is not applied to the system when you remove the jumper from J1.
To connect an external backup battery, refer to
the location of connectors and jumper headers and follow the steps below.
To complete this procedure, you will need cables and connectors as appropriate for your application.
Warning
Warning
To prevent serious injury or death from dangerous voltages, use extreme caution when handling, testing, and adjusting this equipment and its components.
Caution
Caution
Avoid touching areas of integrated circuitry; static discharge can damage circuits.
ESD
Use ESD
Wrist Strap
Attach an ESD strap to your wrist. Attach the other end of the ESD strap to an electrical ground. (Note that the system chassis may not be grounded if it is unplugged.) The ESD strap must be secured to your wrist and to ground throughout the procedure.
1. While an external battery can be connected with power applied to the system, we recommend that you perform a system shutdown and
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1
Installation Procedures disconnect the AC or DC power source before connecting an external battery except where necessary to prevent data loss.
2. Connect the external battery to utility connector J16 using an appropriate user-supplied connector. (See
Utility Connector J16 on page 6-21
for pinout information.)
3. Place a jumper across J1 pins 2 and 3 to enable external battery backup.
Note Removing the jumper from J1 pins 1 and 2 disconnects the on-board battery. For more information, see
Adding DRAM
The MBX board accommodates 8MB, 16MB, 32MB, 64MB, or 128MB of expansion DRAM in a 168-pin DIMM socket, XU3. Expansion DRAM must have the same characteristics as the on-board DRAM, namely:
❏ Single bank
❏ 60ns or faster
❏ 3.3V
❏ Unbuffered
❏ EDO (extended data out)
❏ Up to 4K refresh
To add DRAM, refer to
Figure on page 6-2 for the location of connectors
and jumper headers and follow the steps below.
No special tools are required for this procedure.
Warning
Warning
To prevent serious injury or death from dangerous voltages, use extreme caution when handling, testing, and adjusting this equipment and its components.
1-12 Computer Group Literature Center Web Site
Adding DRAM
Caution
Caution
Avoid touching areas of integrated circuitry; static discharge can damage circuits.
ESD
Use ESD
Wrist Strap
Attach an ESD strap to your wrist. Attach the other end of the ESD strap to an electrical ground. (Note that the system chassis may not be grounded if it is unplugged.) The ESD strap must be secured to your wrist and to ground throughout the procedure.
1. While the MBX can accept changes in DRAM configuration with power applied to the system, we recommend that you perform a system shutdown and disconnect the AC or DC power source before adding
DRAM. Inserting or removing modules with power applied may result in damage to module components.
2. Insert the desired DRAM DIMM into XU3 and secure the DIMM with the clips at each end of the socket.
3. Configure jumper headers J8, J9, and J10 to match the size of the
DRAM module as shown in the following illustration. These jumpers
1 http://www.motorola.com/computer/literature 1-13
1
Installation Procedures specify the address width appropriate for the amount of expansion memory installed.
J8 J9 J10
8MB
(factory configuration)
1 2 3 1 2 3 1 2 3
16MB
1 2 3
32MB
1 2 3
64MB/
128MB
1 2 3
1 2 3
1 2 3
1 2 3
1 2 3
1 2 3
1 2 3
2152 9805 (i)
Replacing Lithium Batteries
Follow these safety rules for proper battery operation and to reduce equipment and personal injury hazards when handling lithium batteries.
Use the battery for its intended application only.
Note Do not recharge, open, puncture or crush, incinerate, expose to high temperatures or dispose of in your general trash collection.
To replace the lithium battery, observe the following guidelines and follow the steps below.
Note When replacing the battery, power must be applied to the board to prevent data loss.
Warning
Warning
To prevent serious injury or death from dangerous voltages, use extreme caution when handling, testing, and adjusting this equipment and its components.
1-14 Computer Group Literature Center Web Site
Replacing Lithium Batteries
Warning
!
Warning
Lithium batteries incorporate flammable materials such as lithium and organic solvents. If lithium batteries are short-circuited or exposed to high temperature or pressure, they may burst open and ignite, possibly resulting in injury and/or fire. When dealing with lithium batteries, carefully follow the precautions listed below in order to prevent accidents.
❏ Do not short-circuit.
❏ Do not disassemble, deform, or apply excessive pressure.
❏ Do not heat or incinerate.
❏ Do not apply solder directly.
❏ Do not use different models, or new and old batteries together.
❏ Do not charge.
❏ Always check proper polarity.
Caution
!
Caution
Danger of explosion if battery is replaced incorrectly.
Replace battery only with the same or equivalent type recommended by the equipment manufacturer. Dispose of used batteries according to local regulations and manufacturer’s instructions.
Caution
Caution
Avoid touching areas of integrated circuitry; static discharge can damage circuits.
ESD
Use ESD
Wrist Strap
Attach an ESD strap to your wrist. Attach the other end of the ESD strap to an electrical ground. (Note that the system chassis may not be grounded if it is unplugged.) The ESD strap must be secured to your wrist and to ground throughout the procedure.
1. To remove the battery from the module, carefully pull the battery from the socket.
2. Before installing a new battery, ensure that the battery pins are clean.
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1
Installation Procedures
3. Note the battery polarity and press the new battery into the socket.
Note When the battery is in the socket, no soldering is required.
4. Recycle or dispose of the old battery according to local regulations and manufacturer’s instructions.
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2
Startup and Operation
2
Pre-Startup Check
Before you power up the MBX system, be sure that the following conditions exist:
✓ Jumpers and/or configuration switches on the MBX and associated equipment are set as required for your application.
✓ The EPPCBug boot ROM is known to be present in socket XU1 on the top side of the MBX board (if booting from the socketed device); or the EPPCBug firmware is known to be installed in the
Flash devices on the secondary side of the board (if booting from
32-bit Flash).
✓ The MBX board is installed and cabled up as appropriate for your chassis or system, as outlined in
✓ Any devices you wish to use, such as a host computer system and/or a parallel printer, are cabled to the appropriate headers.
✓ The terminal that you plan to use as the EPPCBug system console is connected to the EIA-232-D console port (J18 on the MBX board) and properly configured (eight bits per character, one stop bit per character, no parity, 9600 baud).
After you complete the checks listed above, you are ready to power up the system.
Applying Power
Applying power (as well as resetting the system) triggers an initialization of the MPU, the hardware, and the firmware. The firmware initializes the devices on the MBX board in preparation for booting the operating system.
The firmware is shipped from the factory with an appropriate set of
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2
Startup and Operation defaults. In most cases there is no need to modify the firmware configuration before you boot the operating system.
For further information on the firmware, refer to
Firmware , or to the EPPCBug Firmware Package User’s Manual listed in
Appendix B, Related Documentation
.
Note Any devices or interface circuits you implement that require analog power (
−
12V,
−
5V, or +12V) must wait to initialize until the digital power on the MBX is ready. (See
.)
Initialization Process
When you power up (or reset) the system, EPPCBug executes some selfchecks and proceeds to the hardware initialization. The following hardware components are initialized at power up/reset:
❏ MPC821/860 PowerPC Core
❏ MPC821/860 System Interface Unit (SIU)
❏ MPC821/860 Memory Controller and Memory
❏ Primary PCI Bus Bridge Device (QSpan; standard configuration only)
❏ ISA Bus Bridge Device (Winbond W83C553F; standard configuration only)
❏ Peripheral I/O Device (SMC 37C672; standard configuration only)
❏ PCI Address Space Configuration and PCI Device Configuration
(standard configuration only)
❏ PCMCIA Module Configuration
The system startup flows in a predetermined sequence, following the hierarchy inherent in the hardware. The following illustration charts the flow of the basic initialization sequence that takes place during PowerPC system startup.
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Restarting the System
STARTUP
SYSTEM
INITIALIZATION
CONSOLE
DETECTION
STARTUP SCRIPT
EXECUTION
(IF ENABLED)
OPERATING
SYSTEM
2156 9802
Restarting the System
You can initialize the system to a known state in two different ways: reset or break. Each method has characteristics that make it more appropriate than the other in certain situations.
Reset
Powering up the MBX Series board initiates a system reset. Resets can also be asserted through the Reset switch, available remotely via utility connector #1 (J16 on the MBX board). Both “cold” and “warm” reset modes are available. By default, EPPCBug is in “cold” mode (refer to the
Reset command description in the EPPCBug Firmware Package User’s
Manual).
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Startup and Operation
During cold resets, these system initialization processes occur, as if the
MBX had just been powered up:
❏ All static variables are restored to their default states.
❏ Breakpoint table and offset registers are cleared.
❏ Target registers are invalidated.
❏ Input and output character queues are cleared.
❏ On-board devices are reset, and the console/terminal serial port is reconfigured to its default state.
During warm resets, the EPPCBug variables and tables are preserved, as are the target state registers and breakpoints.
Note Early revisions of the EPPCBug firmware do not support the
“warm” reset feature.
You need to reset the system if the processor ever halts or if the EPPCBug environment is ever lost (vector table destroyed, stack corrupted, etc.).
Break
Occasionally, you may wish to terminate a debugger command before its completion (for example, during the display of a large block of memory).
A break allows you to terminate the command.
To invoke a break, press and release the BREAK key on the terminal keyboard. Breaks do not generate an interrupt. A break is only recognized when characters are sent or received by the console port. A break removes any breakpoints in the user code and keeps the breakpoint table intact. A break also takes a snapshot of the machine state if the function was entered using an EPPCBug system call (see the EPPCBug Firmware Package
User’s Manual listed in
Appendix B, Related Documentation ). This
machine state is then accessible to you for diagnostic purposes.
For details on the firmware or the programming aspects of the MBX series embedded controller, refer to the EPPCBug Firmware Package User’s
Manual or to the MBX Series Embedded Controller Version B
Programmer’s Reference Guide respectively.
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3
EPPCBug Firmware
3
Firmware Overview
The PowerPC debugger, EPPCBug, is a versatile tool for evaluating and debugging systems built around Motorola PowerPC microcomputers. Its primary uses are to test and initialize the board hardware, determine the hardware configuration, and boot the operating system. Facilities are also available for loading and executing user programs under complete operator control for system evaluation.
The PowerPC debugger provides a high degree of functionality and user friendliness, stressing portability and ease of maintenance. It is written entirely in the C programming language, except where necessary to use assembler functions in the form of separately compiled assembly language program modules containing only assembler code. No mixed-language modules are used.
EPPCBug includes commands for display and modification of memory, breakpoint and tracing capabilities, a powerful assembler and disassembler useful for patching programs, and self tests which verify the integrity of the main CPU board. Various EPPCBug routines that handle I/O, data conversion, and string functions are available to user programs through the system call handler.
EPPCBug consists of three parts:
❏ A command-driven user-interactive software debugger. It is hereafter referred to as “the debugger” or “EPPCBug.”
❏ A set of command-driven diagnostics, which is hereafter referred to as “the diagnostics.”
❏ A user interface which accepts commands from the system console terminal.
EPPCBug is similar to previous Motorola firmware debugging packages
(e.g., MVME147Bug, MVME167Bug, MVME187Bug, PPCBug), with differences due to microprocessor architectures. These are primarily
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3
EPPCBug Firmware reflected in the instruction mnemonics, register displays, addressing modes of the assembler/ disassembler, and the passing of arguments to the system calls.
Firmware Implementation and Memory
Requirements
EPPCBug requires a total of 512KB of read/write memory (i.e., DRAM).
The debugger allocates this space from the top of memory. For example, a system containing 64MB ($04000000) of read/write memory will place the EPPCBug memory page at locations $03F80000 to $03FFFFFF.
Physically, the complete EPPCBug firmware is contained in both the 512K socketed “Boot ROM” device in XU1 and in the four soldered 32-pin
PLCC Flash devices that together provide 2MB, 4MB, or 8MB of storage
(depending on the model). The device used at start up is determined by jumper setting (see
J4 Boot ROM Device Selection on page 6-6 ); the
default uses the 32-bit soldered Flash. The EPPCBug firmware takes up
512KB (128K words) of space; the remainder of Flash memory is available for user applications.
The executable code in Flash memory is checksummed at every power-on or reset firmware entry, and the result (which includes a precalculated checksum contained in the Flash devices) is verified against the expected zero checksum. You are cautioned against modifying the contents of Flash memory unless you take precautions to re-checksum.
Using the Debugger
EPPCBug is command-driven; it performs its various operations in response to commands that you enter at the keyboard. When using
EPPCBug, you operate from within either the debugger directory or the diagnostics directory. The debugger prompt ( EPPC-Bug or EPPC-
Diag ) tells you the current directory (and, in effect, the current mode).
When the EPPC-Bug prompt appears on the screen, the debugger is ready to accept debugger commands. When the EPPC-Diag prompt appears on
3-2 Computer Group Literature Center Web Site
Debugger Commands the screen, the debugger is ready to accept diagnostics commands. To switch from one mode to the other, you use the Switch Directories command, SD.
Generally, when you enter a command, EPPCBug executes the command and the prompt reappears. However, if you enter a command that causes execution of user target code (GO, for example), then control may or may not return to EPPCBug, depending on the outcome of the user program.
What you key in is stored in an internal buffer. Execution begins only after you press the Return or Enter key. This allows you to correct entry errors, if necessary, with the DEL key or CTRL-h. (Additional control characters are described in the EPPCBug Firmware Package User’s Manual.)
A debugger command is made up of the following parts:
❏ The command name, either uppercase or lowercase (for example,
MD or md).
❏ Any required arguments, as specified by the command.
❏ At least one space before the first argument. Precede all other arguments with either a space or comma.
❏ One or more options. Precede an option or a string of options with a semicolon (;). If no option is entered, the command’s default option conditions are used.
Debugger Commands
The individual debugger commands are listed in the following table. The commands are described in detail in the EPPCBug Firmware Package
User’s Manual listed in Appendix B, Related Documentation .
Note You can list all the available debugger commands from the command line by entering the Help (HE) command alone. You
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3
EPPCBug Firmware can view the syntax for a particular command by entering HE and the command mnemonic, as listed below.
GD
GN
GO
GT
HBD
HBX
HE
CS
CSAR
CSAW
DS
DTT
DU
ECHO
ENV
Command
AS
BC
BF
BI
BM
BR/NOBR
BS
BV
Table 3-1. Debugger Commands
Description
One Line Assembler
Block of Memory Compare
Block of Memory Fill
Block of Memory Initialize
Block of Memory Move
Breakpoint Insert/Delete
Block of Memory Search
Block of Memory Verify
Checksum a Block of Data
PCI Configuration Space READ Access
PCI Configuration Space WRITE Access
One Line Disassembler
Display Temperature
Dump S-Records
Echo String
Set Environment
Go Direct (Ignore Breakpoints)
Go to Next Instruction
Go Execute User Program
Go to Temporary Breakpoint
History Buffer Display
History Buffer Entry/Execution
Help
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Debugger Commands
Table 3-1. Debugger Commands (continued)
MS
MW
NIOC
NIOP
NIOT
NPING
OF
PA/NOPA
PF/NOPF
PFLASH
PL
Command
I2C
IDIR
IOC
IOI
IOP
IOT
LO
MA/NOMA
MAE
MAL/NOMAL
MD, MDS
MM
MMAP
MMD
Description
I2C Device Read/Write
Display Filenames
I/O Control for Disk
I/O Inquiry
I/O Physical (Direct Disk Access)
I/O Teach for Configuring Disk Controller
Load S-records from Host
Macro Define/Display/Delete
Macro Edit
Enable/Disable Macro Listing
Memory Display
Memory Modify
MPC8xx Memory Map Display
Memory Map Diagnostic
Memory Set
Memory Write
Network I/O Control
Network I/O Physical
Network I/O Teach (Configuration)
Network Ping
Offset Registers Display/Modify
Printer Attach/Detach
Port Format/Detach
Program Flash Memory
Program Load
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3
EPPCBug Firmware
VE
VER
VPD
WL
Table 3-1. Debugger Commands (continued)
PLH
RD
Command
RESET
RL
RM
RS
SD
SET
SYM/NOSYM
SYMS
T
TA
TIME
TM
TT
UPM
Description
Program Load and Halt
Register Display
Cold/Warm Reset
Read Loop
Register Modify
Register Set
Switch Directories
Set Time and Date
Symbol Table Attach/Detach
Symbol Table Display/Search
Trace
Terminal Attach
Display Time and Date
Transparent Mode
Trace to Temporary Breakpoint
MPC8xx User-Programmable Memory (UPM)
Display/Read/Write
Verify S-Records Against Memory
Revision/Version Display
Vital Product Data (VPD) Display
Write Loop
Caution
!
Caution
Although a command (PFLASH) to allow the erasing and reprogramming of Flash memory is available to you, keep in mind that reprogramming any portion of Flash memory will erase everything currently contained in
Flash, including the EPPCBug debugger.
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4
VPD and ENV Commands
4
Two common tasks for which you need the factory-installed debug monitor, EPPCBug, are:
❏ Using the EPPCBug command VPD to view board-specific information that is stored in the VPD (Vital Product Data)
EPROM on the MBX board.
❏ Using the EPPCBug command ENV to edit configurable
EPPCBug parameters in the MBX board’s NVRAM.
The VPD and ENV commands are both described in the EPPCBug
Firmware Package User’s Manual (listed in
Documentation ). Refer to that manual for general information about their
use and capabilities.
The following topics present a brief introduction to VPD and ENV, along with the EPPCBug parameters that can be configured with the ENV command.
VPD—Display Vital Product Data
The VPD command displays the board configuration data, which is resident within a serial EEPROM located on the MBX board. The serial
EEPROM contains various elements that correspond to specific operational parameters of the board. The following example shows the board structure for the MBX embedded controller:
Product Identifier : MBX
Manufacturing Assembly Number : 01-w3269F21B
Serial Number : 2677405
Product Configuration Options : 000000000000000
Internal Clock Speed (Hertz) : 02625A00 (&40000000)
External Clock Speed (Hertz) : 02625A00 (&40000000)
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4
VPD and ENV Commands
Reference Clock Speed (Hertz) : 00008000 (&32768)
Ethernet Address : 08003E229470
The VPD EEPROM is factory-configured before shipment. There is no need to modify board parameters unless the contents are corrupted.
Refer to the MBX Series Embedded Controller Version B Programmer’s
Reference Guide (listed in Appendix B, Related Documentation ) for the
actual location of vital product data in EEPROM and other information about the VPD EEPROM.
Refer to the EPPCBug Firmware Package User’s Manual (listed in
Appendix B, Related Documentation
) for a description of VPD and examples.
ENV—Set Environment
Use the ENV command to view and/or configure interactively all
EPPCBug operational parameters that are kept in NVRAM.
Refer to the EPPCBug Firmware Package User’s Manual for a description of the use of ENV. Additional information on registers in MBX series boards that affect these parameters can be found in the MBX Series
Embedded Controller Version B Programmer’s Reference Guide.
Listed and described below are the parameters that you can configure using
ENV. The default values shown were those in effect when this publication went to print.
Probe System for Supported I/O Controllers [Y/N] =
Y?
Y—Accesses the appropriate system buses (PCI bus, local MPU bus) on startup to determine the presence of supported controllers.
(Default)
N—Does not access the system buses on startup to determine the presence of supported controllers.
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ENV—Set Environment
Local SCSI Bus Reset on Debugger Startup [Y/N] = N?
Y—Resets the local SCSI bus on debugger startup.
N—Does not reset the local SCSI bus on debugger startup. (Default)
PCI Interrupts Route Control Registers
(PIRQ0/1/2/3) = 0A0B0E0F?
Specifies the values to use for the PCI interrupts route control registers in the PCI/ISA bus bridge and defines the mapping of PCI interrupts to the ISA interrupt controller within the ISA bridge. The default maps
PCI INTA, INTB, INTC, and INTD to ISA IRQs 10, 11, 14, and 15 respectively.
Firmware Command Buffer Offset = 000002C8?
Specifies the offset within NVRAM where firmware looks for the startup command buffer.
At startup, if EPPCBug commands are found in the startup buffer, they are executed as though a user were entering the commands at the keyboard.
If the startup buffer begins with a null character, the firmware does not attempt to execute commands from the buffer. Instead, control of the system passes to the command line prompt.
Firmware Command Buffer Size = 00000200?
Specifies the size of the startup command buffer.
Firmware Command Buffer Delay = 5000?
Defines the number of milliseconds to wait before firmware begins executing the commands in the startup command buffer. During this delay, you may press any key to prevent the execution of the startup command buffer. The default value produces a startup delay of five seconds.
Program Intermediate Load Address = 00200000?
Defines the address in memory where the PL command initially loads the program image. Once the image is loaded at the intermediate load http://www.motorola.com/computer/literature 4-3
4
4
VPD and ENV Commands address, its contents are evaluated and repositioned in memory as appropriate for the load image type (ELF, ROMBOOT, or binary).
Binary Program Load Address = 00080000?
Defines the address to which binary images are moved for execution.
Binary images are distinct from ELF or ROMBOOT images. This parameter does not affect the load address for ELF or ROMBOOT images.
Binary Program Execution Offset = 00000100?
Defines the offset from the Binary Program Load Address that you use to establish the initial instruction pointer value for binary images. This parameter does not affect the initial instruction pointer for ELF or
ROMBOOT images.
Primary Network Controller LUN = 20?Primary
Network Device LUN = 00?
These two parameters jointly define the network device that is to be considered the primary network controller in the system. The networking parameters for the primary network controller are saved within the primary network controller NVRAM area.
Firmware Command Buffer:[’NULL’ terminates entry]?
The firmware command buffer contains EPPCBug commands that are executed upon system startup. The commands you place in the buffer should be typed just as you would enter commands from the command line. Typing NULL (all uppercase) on a new line terminates the command line entries.
In the command line buffer, you can enter all EPPCBug commands except DU, ECHO, LO, PA, TA, and VE. The PL command should not be used within the firmware command buffer to execute an
EPPCBug commands file.
There is no support for interactive editing of the startup command buffer. If changes to an existing set of startup commands are necessary, you must enter a new set of commands with changes.
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5
Functional Description
5
This chapter provides an overview of the MBX series embedded controller including a detailed description of the board’s major components.
Detailed descriptions of other MBX blocks, including programmable registers in the ASICs and peripheral chips, can be found in the MBX
Programmer’s Reference Guide (listed in
MBX Block Diagrams
The following figures diagram the overall board architecture.
5-1
Functional Description
5
PPORT Host/Peripherial
MPC821
PIP (SMC2, SPI, TDM)
Population
Option
CS0
CS7
INFC CNTL
Chip
Select
Router
FLASH (x32)
CS1
DRAM (x32/36)
SCC1
PCMCIA
LCD
Boot
ROM (x8)
CS2
CS3
DIMM Socket (x64/72)
DRAM BANK 1 (x32/36)
DRAM BANK 2 (x32/36)
CS4
BBSRAM (x8)
CONTROL & STATUS REGISTER #1 (X8)
CONTROL & STATUS REGISTER #2 (X8)
Parallel Port
Debug Port
IEEE1149.1
Test Access Port
Ethernet Interface
10BaseT & AUI
Single Slot
PCMCIA
Interface
LCD
Interface
UTILITY CONN #1
LEDs
RESET
STOP/ABORT
EXT. BATTERY
PWR FAIL SENSE
-5.0V
-12.0V
Battery/
KAPWR
Circuits
MPC821
Local Bus &
Interface
COMM
Interface
SCC2,
SMC1, SMC2, SPI, I C
TDM Signals/Clocks
5-2
2
I C
I C
Devices:
EPROM,
DIMM,
DTT
SMC1
Selector
EIA-232
Transceiver
COM1
To/From Standard Version
Figure 5-1. MBX821 Entry-Level Features Block Diagram
Computer Group Literature Center Web Site
MBX Block Diagrams
PPORT Host/Peripherial
MPC860
PIP (SMC2, SPI, TDM)
CS0
CS7
SCC2, SCC3, SCC4, SMC1,
2
I C, CLOCKs, TDM SCC1
INFC CNTL
PCMCIA
Chip
Select
Router
FLASH (x32)
Boot
ROM (x8)
CS1
DRAM (x32/36)
Population
Option
Parallel Port
Debug Port
IEEE1149.1
Test Access Port
Ethernet Interface
10BaseT & AUI
Single Slot
PCMCIA
Interface
CS2
CS3
CS4
BBSRAM (x8)
CONTROL & STATUS REGISTER #1 (X8)
CONTROL & STATUS REGISTER #2 (X8)
UTILITY CONN #1
LEDs
RESET
STOP/ABORT
EXT. BATTERY
PWR FAIL SENSE
-5.0V
-12.0V
KAPWR
Circuits
5
MPC860
Local Bus &
Interface
COMM
Interface
SMC1, SMC2, SPI, I C
TDM Signals/Clocks
2
I C
I C
Devices:
EPROM,
DIMM,
DTT
SMC1
Selector
EIA-232
Transceiver
COM1
To/From Standard Version
2143 9802
Figure 5-2. MBX860 Entry-Level Features Block Diagram
http://www.motorola.com/computer/literature 5-3
5
Functional Description
To/From Entry Level Version
8259INT#
QSINT#
CS5
QSPAN / PCI
PC/104Plus INFC
PCI Local Bus
CS6
QSPAN / REG
83C553
WINBOND
PCI-to-ISA
BRIDGE
PCI-to-EIDE
INTERFACE
PCI
ARBITER
IRQ
CNTLR
Power - 1x3
IDE HDR - 2x22
ISA Bus
PC/104 INFC
37C672
Peripheral I/O Controller
FDC HDR - 2x17
COM1
PPORT
SERIAL
PORT #1
SERIAL
PORT #2
KEYBOARD
INFC
MOUSE
INFC
PARALLEL
PORT
UTILITY CONN #2
KEYBOARD
MOUSE
COM2
IR
Clocks
Generator
Figure 5-3. MBX821/860 Standard Features Block Diagram
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MBX Features Summary
MBX Features Summary
The following table summarizes the key features of MBX series boards.
Features pertaining to both entry-level and standard configurations are listed in the upper section. Additional features offered only in the standard configuration are listed in the lower section.
Table 5-1. Features of the MBX Series Embedded Controller
Feature
Microprocessor
DRAM
Flash memory
NVRAM
Real-time clock
Switches
On-board status LEDs
Serial I/O
Parallel I/O
Ethernet I/O
PCMCIA interface
LCD interface
(MPC821 only)
Description
MPC860 PowerQUICC or MPC821 processor with integrated memory management unit (MMU) and communications functions
Up to 16MB on-board DRAM (with optional parity); 168-pin DIMM socket addressing up to 128MB expansion DRAM
One bank 32-bit Flash (2MB, 4MB, or 8MB) soldered to board
32KB NVRAM with battery backup and low battery indication
RTC, watchdog timer, four 16-bit timers in the MPC8xx processor
Reset and Abort, available remotely via utility connector
Eight: +3.3Vdc, +5Vdc, +12Vdc, Board Failure, Battery Status, Flash
Programming Status, CPU, PCI
EIA-232-D serial console or terminal port (DCE/DTE)
IEEE 1284 parallel port with host/peripheral mode selection
Support for AUI and 10BaseT Ethernet interface
One PCMCIA slot (type I, II, or III devices)
Support for both active and passive LCD panels via 24-pin header on
MPC821-powered MBX boards
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Functional Description
Table 5-1. Features of the MBX Series Embedded Controller
Feature
Communications I/O
Description
MPC8xx communications interface with Time Slot Allocator (TSA) and Time Division Multiplexing (TDM) channel to support multiplexed as well as non-multiplexed serial I/O. Serial
Communication Controllers (SCCs) 2–4, Serial Management
Controllers (SMCs) 1–2, Serial Peripheral Interface (SPI), and
Interprocessor-Integrated Controller (I
2
C) signals are available.
MPC8xx bus interface, with signals routed to same board connector as the MPC8xx communications interface. I/O point for other MPC8xxtype masters, and for TDM interfaces needing bus access.
PC/104-Plus interface
Additional Features—Standard Configuration
Support for PC/104 (ISA) and PC/104-Plus (PCI) expansion modules
EIDE port
Serial I/O
Floppy disk controller
Support for direct ribbon cable connection to 2.5-inch hard disk drive via header on MBX board; PCI bus master capability
Two additional EIA-232-D serial ports
Keyboard/mouse interface
Support for direct ribbon cable connection to 2.88MB floppy disk drive via header on MBX board
Support for keyboard and mouse input via header on MBX board
MBX Features Description
The following topics provide detailed information about the MBX series embedded controller and its principal components.
General Description
MBX series boards are based on the EBX (5.75"
×
8") industry-standard form factor specification. MBX boards provide single-board computer functionality with emphasis on open communications and networking capabilities. They offer open interfaces such as PCI, ISA, and PCMCIA in addition to Ethernet and serial/parallel I/O. The features they incorporate
5-6 Computer Group Literature Center Web Site
Processor make them well suited for embedded real-time applications in such areas as communications, industrial automation, and electronic imaging.
The MBX series has two branches: one is based on Motorola’s MPC821 embedded processor, the other uses an MPC860 processor. MBX860 models offer four serial communications controllers (SCCs); MBX821 models have two SCCs and an integrated LCD controller. In other respects, the logic design is the same for all models.
MBX series boards are offered in “standard” and “entry-level” configurations (
lists the features of each). Both standard and entry-level configurations offer integral system functions as well as peripheral functions on a single base board. Standard configurations furnish the additional capability of PCI/ISA expansion via plug-in expansion modules. These modules offer numerous possibilities for I/O expansion through FDDI (Fiber Distributed Data Interface), ATM
(Asynchronous Transfer Mode), graphics, Ethernet, or SCSI ports. The
MBX base board allows PC/104-Plus cards with a 32-bit, 33 MHz PCI interface to be used on the same stack as PC/104 cards.
Processor
The processor chip used on MBX series boards is either an MPC860
PowerQUICC
®
( PowerPC
®
Quad Integrated Communications
Controller) microprocessor or an MPC821 Portable Systems microprocessor. The processor is surface-mounted to the MBX board. The
MPC8xx is a single-chip microprocessor/peripheral combination that lends itself to a variety of controller applications. It incorporates many of the communications/networking capabilities and peripheral I/O functions offered by the overall MBX product.
MPC860
The MPC860 processor is suited for applications involving communications and networking systems. The CPU on the MPC860 is a
32-bit PowerPC implementation incorporating memory management units
(MMUs) and instruction/data caches. It has a real-time clock and a communications processor module that includes serial communication controllers (SCCs), serial management controllers (SMCs), and an
5 http://www.motorola.com/computer/literature 5-7
5
Functional Description
Interprocessor-Integrated Controller (I
2
C) channel for data exchanges between the MPC860 and other ICs with I
2
C capability. The MPC860’s memory controller supports all available types of memory. Its PCMCIA controller supports up to two PCMCIA devices (one socket is provided on the MBX).
MPC821
The MPC821 processor is especially well-suited for applications where lower power is essential, such as portable and/or high-performance communications systems. The CPU on the MPC821 is a 32-bit PowerPC implementation incorporating memory management units (MMUs) and instruction/data caches. It has a real-time clock and a communications processor module that includes serial communication controllers, serial management controllers, a serial peripheral interface (SPI) channel, and an
Interprocessor-Integrated Controller (I
2
C) channel for data exchanges between the MPC821 and other ICs with I
2
C capability. The MPC821’s memory controller supports all available types of memory. Its PCMCIA controller supports up to two PCMCIA devices (one socket is provided on the MBX). The MPC821 also incorporates an LCD controller for display capability.
Real-Time Clock/Timer Functions
The processor chip used on MBX series embedded controllers incorporates a clock module to provide the various system clock and timer functions as well as low power control circuitry for the system. Among the outputs of the clock module is a real-time clock (RTC). The real-time clock provides a time-of-day indication to the operating system and to application software.
The clock is unaffected by Reset signals and operates in all low-power modes. It can be programmed to generate a maskable interrupt via an alarm register. The RTC furnishes seconds, minutes, hours, day, month, and year in BCD 24-hour format. Corrections for 28-, 29- (leap year), and 30-day months are made automatically.
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DRAM
The processor incorporates a number of other timer functions that, on other boards, often require external circuits:
❏ Bus access monitor—generates a bus error signal if accesses to the processor bus are not handled within a programmed time limit
❏ Software watchdog timer—supplies time-out protection in case of hardware or software module faults (produces a reset if software does not service a fault within a programmed amount of time)
❏ Periodic interrupt timer—generates interrupts at prescribed intervals for use with real-time operating systems or application software
❏ Time base counter—employs the 64-bit counter defined in
PowerPC architecture as a time base reference for operating systems or application software
❏ Decrementer counter—uses the 32-bit counter defined in
PowerPC architecture to generate a decrementer interrupt
For programming information and details on MPC8xx timer functions, refer to the MPC821/MPC860 processor user’s manuals.
5
DRAM
The MBX series embedded controller has provision for either 4MB or
16MB of on-board DRAM, soldered in place. In addition, it accommodates 8MB to 128MB of expansion DRAM in a 168-pin DIMM
(dual in-line memory module) socket, XU3.
The on-board DRAM is composed of two 16-bit devices (either 1M x 16 or 4M x 16). Parity protection is optional.
If expansion DRAM is installed in the DIMM socket, it must have the same characteristics as the on-board DRAM, namely:
❏ Single bank
❏ 60ns or faster
❏ 3.3V
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5
Functional Description
❏ EDO (extended data out)
❏ Up to 4K refresh
Expansion DRAM cannot exceed 128MB and should also support CAS before RAS refresh.
Flash Memory
Flash memory on the MBX series embedded controller consists of 2MB,
4MB, or 8MB of memory in one bank of four devices soldered directly to the board. The EPPCBug firmware resident in Flash memory is originally loaded at the factory, but the Flash contents can be reprogrammed if necessary.
The on-board monitor/debugger, EPPCBug, resides in Flash memory. The
EPPCBug firmware provides functionality for:
❏ Booting and resetting the system
❏ Initializing a request
❏ Displaying and modifying configuration variables
❏ Running self-tests and diagnostics
❏ Updating firmware ROM
For purposes of reprogramming Flash, the MBX includes a 32-pin socket
(XU1) in which firmware programmers can install a removable boot ROM device. A jumper header (J4) enables you to select either the on-board
Flash memory or the socketed Flash chip in XU1 as the boot ROM.
Depending on the configuration of J4, resets execute either from the onboard Flash memory bank (32-bit Flash) or from the socketed ROM (8-bit
Flash).
Flash contents may be modified by executing the proper program command sequence. Refer to the third-party data sheet and/or to the
EPPCBug Firmware Package User’s Manual for further information on modifying Flash contents.
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NVRAM
NVRAM
The MBX series embedded controller accommodates 32KB of Non-
Volatile RAM (NVRAM) in a 34-pin socket, XU2. A battery within the device supplies VCC to the NVRAM when main power is removed. The
NVRAM provides for a low-battery indication which can be read by the processor (via status register #2—see the MBX Programmer’s Reference
Guide).
The lifetime of the battery is very dependent on the ambient temperature of the board and the power-on duty cycle. At 70
°
C, the worst-case elapsed time for battery protection is seven years. Battery warning time is 24 hours minimum. At lower ambient temperatures the backup time is greatly extended.
The first 4K of the NVRAM contains the vital product data (VPD) and should not be used. The remaining NVRAM is available for general use.
On-board Backup Battery
The on-board backup power source for the keep-alive power circuits is a
Sanyo CR14250SE lithium battery, socketed for easy removal and replacement. A low-battery indication (via status register #2) allows you to replace it before it discharges completely. When replacing the battery, power must be applied to the board to prevent data loss.
The lifetime of the battery is very dependent on the ambient temperature of the board and the power-on duty cycle. At 70
°
C, the worst-case elapsed time for battery protection is four years. Battery warning time is 24 hours minimum. At lower ambient temperatures the backup time is greatly extended.
When a board is stored, the on-board battery should be disconnected to prolong battery life. This is especially important at high ambient temperatures.
The MBX board provides a “freshness seal” to protect the on-board battery when it is not in use. The battery can be disconnected and the battery freshness seal reset by removing the jumper from J1 pins 1 and 2 after
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5
Functional Description disconnecting power to the board. You can then replace the jumper and store the board.
The freshness seal protecting the on-board battery is automatically broken when you apply power to the board with a jumper on J1 pins 1 and 2.
If your application does not use the integrated real-time clock, battery backup is not needed and the on-board battery can be removed.
Switches and Status Indicators
The MBX board provides for user-installed Abort and Reset switches and incorporates a number of status signals. The switches and status signals are available remotely via utility connector #1 (J16 on the MBX board).
Abort Switch
The MBX board supports the implementation of a remote abort switch connected via pin 12 of utility connector #1 (J16 on the MBX board). The circuit is filtered to remove switch bounce and prevent false aborts.
When activated, the Abort signal generates an interrupt signal to the processor at IRQ7. The interrupt can be programmed as falling-edge active or low-level active (the default is falling-edge active).
Reset Switch
The MBX board supports the implementation of a remote reset switch connected via pin 5 of utility connector #1 (J16 on the MBX board). The signal is debounced and filtered, and provides approximately 350ms minimum active pulse once the reset switch has been pressed (pulled to ground) and released.
The Reset signal resets all on-board devices, including the PC/104,
PC/104-Plus, and 8xx/COMM ports and the keep-alive power circuits.
For additional information about the reset function, see Restarting the
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Power Monitor Circuit
Status Indicators
The MBX board includes eight on-board LEDs (DS1–DS8) to indicate power levels; board, battery, and programming status; and CPU and PCI
activity. (See MBX LED Status Indicators on page 6-29 for a complete
description.) Six additional signals (five for Ethernet activity and one for a hard disk drive) are available for external display via utility connector #1.
(See
Utility Connector J16 on page 6-21 .)
Power Monitor Circuit
The MBX is equipped with a power monitor circuit that monitors both the
+3.3V and the +5V currents. At power up, the power monitor asserts
HRESET# low until voltages reach their proper levels, then holds
HRESET# low an additional 350ms. HRESET# is kept low as long as either voltage is inadequate.
During normal operation, if either voltage drops below acceptable limits
(5% for +5V and 10% for +3.3V), the power monitor asserts HRESET# low until the proper voltage returns.
The Reset signal on utility connector #1 (J16) is routed to this circuit.
Peripheral I/O Controller
The MBX series embedded controller uses a 37C672 multi-function I/O controller chip from Standard Microsystems to implement the on-board peripheral functions of the standard version, namely, an asynchronous serial port (COM1) for the console/terminal interface, IEEE 1284 bidirectional parallel port, floppy disk drive support, keyboard and mouse interface.
Asynchronous Serial Port
The I/O controller provides for two asynchronous ports (COM1 and
COM2). Interface header J18 and serial transceivers are supplied on board for the COM1 port. COM2 signals, though not directly implemented on the
MBX, are routed to utility connector #2 for user implementation. No transceivers are included for COM2.
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Functional Description
Hardware initializes the two serial ports as COM1 and COM2 with ISA
I/O base addresses of $3F8 and $2F8 respectively. This default configuration also assigns COM1 and COM2 to interrupt request lines
INT4 and INT3 respectively in the PCI/ISA bridge controller. You can change the default configuration by reprogramming the I/O controller. For programming information, refer to the PCI and ISA bus discussions in the
MBX Series Embedded Controller Version B Programmer’s Reference
Guide and to the vendor documentation for the I/O controller.
The MBX can derive its console/terminal interface from either of two sources: the COM1 port in the I/O controller, or the SMC1 port in the processor chip. By default, standard configurations use the I/O controller’s
COM1. Because entry-level configurations of the MBX board are not equipped with the I/O controller, they use SMC1 on the processor by default. You can also select one port or the other by setting control bits in control register #1 (refer to the MBX Series Embedded Controller Version
B Programmer’s Reference Guide for details).
Parallel Port
The bidirectional parallel port found in MBX series embedded controllers may take one of two forms depending on the board configuration determined at the time of manufacture: a partial IEEE 1284 parallel port with both host and peripheral capability, residing in the processor; or a full
IEEE 1284 parallel port with only host capability, implemented with the
I/O controller available in standard configurations of the board. In either case, all parallel I/O interface signals are routed to parallel port header J13.
To select between host or peripheral mode, you set control registers in the processor (refer to the MBX Series Embedded Controller Version B
Programmer’s Reference Guide for details). In peripheral mode, the
MPC8xx itself acts as a Centronics printer interface as it receives data from some other master in the system.
The signals not implemented in the partial IEEE 1284 implementation are
AUTOFD#, INIT#, and SEL_IN#. The full IEEE 1284 implementation supplies those signals at the expense of the peripheral-mode capability. For programming information, refer to the parallel port discussions in the MBX
Series Embedded Controller Version B Programmer’s Reference Guide and to the vendor documentation for the I/O controller.
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Ethernet Interface
2.88MB Floppy Disk Drive Controller
The I/O controller incorporates a PS/2-compatible low- and high-density disk drive controller for use with an optional 2.88MB external disk drive.
The drive interfaces with the I/O controller via MBX board connector J17,
which relays control signals. Refer to Floppy Disk Connector J17 on page
Note Supplying power for the disk drive is up to the system integrator.
Hard disk drives are under the control of the EIDE interface incorporated into the Winbond PCI/ISA bridge. For a description of the EIDE interface,
refer to PCI/ISA Bridge Controller on page 5-19
.
Keyboard and Mouse Interface
The Standard Microsystems 37C672 I/O controller chip used to implement the on-board peripheral functions in standard configurations provides
ROM-based keyboard and mouse interface control. The keyboard and mouse interface signals are filtered en route to utility connector #2.
Ethernet Interface
The MPC8xx processor chip incorporates an Ethernet interface that communicates with external devices by way of the SCC1 port. The SCC1 port is coupled to an Ethernet transceiver that supports both AUI (optional) and 10BaseT connections to the MBX board. The transceiver autodetects
AUI and 10BaseT connections, but you can also select AUI or 10BaseT by setting control bits in control register #1.
Every MBX series embedded controller is assigned an Ethernet station address. The address is $08003Exxxxxx, where xxxxxx is the unique sixnibble number assigned to the board (i.e., every board has a different value for xxxxxx).
Each MBX series embedded controller displays its Ethernet station address on a label attached to the base board. In addition, the six bytes including the Ethernet station address are stored in a serial EEPROM device separate from the Ethernet transceiver. That is, the value
08003Exxxxxx is stored in EEPROM. The EPPCBug firmware used on
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5
Functional Description
MBX series boards has the capability to display the Ethernet station address via the VPD command (described in the EPPCBug Firmware
Package User’s Manual listed in Appendix B, Related Documentation ).
Note The Ethernet station address of boards manufactured after March
2000 is $0001AFxxxxxx.
For the pin assignments of the AUI or 10BaseT header on the MBX, refer to
Ethernet AUI Header J20 on page 6-16 and Ethernet 10BaseT
Connector J15 on page 6-16 . For programming information, refer to the
MBX Series Embedded Controller Version B Programmer’s Reference
Guide.
PCMCIA Interface
A key feature of the MBX series embedded controller is the PCMCIA bus incorporated into the MPC8xx processor chip. PCMCIA modules offer a variety of possibilities for memory expansion and mass storage in addition to networking applications, wireless communications, and industrial I/O.
The MBX series embedded controller supports one PCMCIA type I, II, or
III module. A 68-pin socket on the base board (XJ26) interfaces with
PCMCIA Revision 2.1-compatible modules to add any desirable function.
For programming information, refer to the MPC8xx bus description in the
MBX Series Embedded Controller Version B Programmer’s Reference
Guide and to the user documentation for the PCMCIA modules you intend to use.
LCD Interface (MBX821 Only)
MBX boards equipped with an MPC821 processor chip incorporate an
LCD interface controller. The LCD controller has a built-in 256-entry color RAM. The controller supports both active and passive panels over a parallel data bus up to nine bits wide. Output control signals are programmable for polarity and are configurable for a variety of LCD panel types.
Supplying power circuitry for the LCD panel selected is up to the system integrator. The LCD controller port routes the data to a 24-pin 2-row
5-16 Computer Group Literature Center Web Site
MPC8xx Serial Communications Interface
header (J27) on the surface of the MBX board (as illustrated in Figure on page 6-2 ).
Refer to
LCD & SPI Connector J27 (MBX821) on page 6-22
for the pin assignments of LCD connector J27. Refer to the PowerPC MPC821
Portable Systems Microprocessor User’s Manual for detailed programming information.
MPC8 xx Serial Communications Interface
The MPC8xx processor chip used on MBX series embedded controllers has a versatile communications interface with Time Slot Allocator (TSA) and Time Division Multiplexing (TDM) channels to support multiplexed as well as non-multiplexed serial I/O. The Time Slot Allocator can route any of the Serial Communication Controller channels (SCC2–SCC4) or
Serial Management Controller channels (SMC1–SMC2) to the TDM channel to support communication links that require time division multiplexing.
To implement a specific communication protocol at the physical layer, it is necessary to connect the appropriate transceivers to the MBX board. The
8xx/COMM connector (P1), a 144-pin socket, is furnished for that purpose. All necessary TDM signals, including clocks, are routed to the
8xx/COMM connector so that a user-supplied add-on card with transceiver circuitry for the desired communication functions can be attached there.
Signals from SCCs 2–4, SMCs 1–2, the Serial Peripheral Interface (SPI), and the Interprocessor-Integrated Controller (I
2
C) are all available at the
8xx/COMM connector.
Note Using the MPC8xx processor’s parallel port in an application makes the SMC2 and SPI interface signals unavailable at the
8xx/COMM connector. However, the remaining serial channels with TDM capability (SCC2–SCC4 and SMC1) are still present at that connector.
The TDM capability of the serial interface does not prevent you from operating the serial channels in standard non-multiplexed fashion. A mix of TDM (multiplexed) and non-multiplexed channels, or the implementation of additional EIA-232 channels, would be equally feasible.
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5
5
Functional Description
The pin assignments of the 8xx/COMM connector (821/COMM or
860/COMM, depending on your board configuration) are listed in
8xx/COMM Expansion Connectors on page 6-17 . Note that some signal
line functions vary according to the mode of operation selected. For further information on the serial communications interface, refer to the MBX
Series Embedded Controller Version B Programmer’s Reference Guide or to the MPC821/MPC860 processor user’s manuals as applicable.
MPC8 xx Bus Interface
To support TDM interfaces requiring a parallel data bus or local processor bus interface, all MPC8xx bus interface signals (data, address, control) are routed to the 8xx/COMM board connector (P1), the same 144-pin socket used by the MPC8xx serial communications interface. In addition to servicing TDM interfaces that require bus access, the 8xx/COMM connector provides an I/O contact point for other MPC8xx-type devices.
Those devices may, in turn, send interrupts and assume the function of bus master.
For further information on the MPC8xx bus interface, refer to the MBX
Series Embedded Controller Version B Programmer’s Reference Guide or to the MPC821/MPC860 processor user’s manuals as applicable.
PCI/ISA Interface
A significant feature of the MBX series embedded controller is the
(Peripheral Component Interconnect) and ISA (Industry Standard
Architecture) buses, offer a variety of functionality as display interfaces, as network interfaces, and in industrial I/O applications.
MBX series boards comply with PCI interface specification 2.1 (although restricted to 32-bit mode) and support the P996.1 Standard for Compact
Embedded PC Modules. The standard dimensions for PC/104-Plus modules are 3.6 inches by 3.8 inches, but larger sizes are not precluded.
A 120-pin socket on the MBX board (P2) interfaces with PCI Revision 2.1compatible modules to add any desirable function. A two-part 104-pin ISA
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PCI/ISA Bridge Controller socket (J21/J22) accommodates ISA modules. PC/104-Plus (PCI/ISA) modules can be intermingled with PC/104 (ISA) modules and stacked up to four high; three can be masters.
Refer to
PC/104 (ISA) Expansion Connector J21/J22 on page 6-25
for the pin assignments of the PC/104 and PC/104-Plus connectors. For programming information, refer to the PCI and ISA bus descriptions in the
MBX Series Embedded Controller Version B Programmer’s Reference
Guide and to the user documentation for the modules you intend to use.
PCI/ISA Bridge Controller
The MBX series embedded controller uses a Winbond W83C553F bridge controller to supply the interface between the PCI local bus and the ISA system I/O bus (diagrammed in
Figure on page 5-4 ). In addition, the
PCI/ISA bridge controller provides support circuitry for standardconfiguration boards and incorporates an EIDE interface for hard disk drives. The PCI/ISA bridge controller provides the following functions:
❏ PCI bus arbitration for:
– The PHB (Processor Host Bridge) MPU/local bus interface
– The PC/104-Plus interface
– The integrated PCI/EIDE interface
❏ ISA bus arbitration for DMA devices
❏ ISA interrupt mapping for four PCI interrupts
❏ Interrupt controller functionality to support 14 ISA interrupts
❏ Edge/level control for ISA interrupts
❏ Seven independently programmable DMA channels
❏ One 16-bit timer
❏ Three interval counters/timers
The EIDE (Enhanced Integrated Drive Electronics) interface with bus master capability supports a direct ribbon cable connection to 2.5-inch hard disk drives via a header (J14) on the MBX board. J14 is a standard 44-
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5
Functional Description pin dual-row connector and supplies +5Vdc power in addition to data and control signals; no separate cable is needed to power the drive.
A jumper (J7) is provided to configure the IDE channel for native (EIDE) or legacy operation. Refer to
J7 IDE Interface Configuration on page 6-9
for more information.
Polyswitches (Self-resetting Fuses)
The MBX series embedded controller draws +3.3Vdc, +5Vdc, and
+12Vdc power through power connector header J12. The +5Vdc power is fused on board at its entry to the keyboard and mouse supply circuitry. The
+12Vdc power is fused on board at its entry to the LAN circuits on the
MBX. The following table lists the fuses with the voltages they protect.
Table 5-2. Fuse Assignments
Fuse
R59
R68
Voltage
+12Vdc
+5Vdc
The fuses are located on the secondary side of the board.
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6
Jumpers, Connectors, and
LEDs
6
In this chapter, you will find information about MBX jumpers and jumper settings, connectors and connector pin assignments, and the on-board LED status indicators.
MBX821/860 Connectors, Headers, LEDs
The following figure illustrates the location of the jumper headers, connectors, and LED indicators on the MBX board.
6-1
Jumpers, Connectors, and LEDs
1
J15
J12
7
16 15
2
1
J28
1
3
J20
2
1
2 1
J13
J16
1
J1
3
26
25
20
19
2
1
2
1
XBT1
J17
J14
34
33
44
43
1 2 1 2
J18
J19
9 10
15 16
6
6-2
P1
XU3
P2
J22 J21
1
J3
3
1
J6 J7 J5
1 1
3 3 3
XU1
2
1
2
1
2
1
J23
J24
J27
(MBX821)
10
19
16
15
24
23
DS6
DS7
DS8
DS3
DS1
DS2
DS4
DS5
XJ26
1
J8 J9 J10
1 1
3 3 3
XU2
J4
1 3
1
J11
3
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Figure 6-1. MBX821/860 Connectors, Headers, LEDs
Computer Group Literature Center Web Site
MBX Jumper Headers
MBX Jumper Headers
Jumper Settings in Brief
For convenient reference, manually configurable headers on the board are listed below. Default settings are enclosed in brackets.
Header
J1
J3
J4
J5
J6
J7
Function
Backup power configuration
Test/Debug port selection
IDE interface configuration
Table 6-1. Jumper Settings
Boot ROM write protection
Boot ROM Device selection
Arbitration mode
Jumper Settings
[1-2] On-board battery backup.
2-3 External battery backup.
1-2 Boot ROM write protection on (writes disabled).
[2-3] Boot ROM write protection off (writes enabled).
1-2 Port size = 8 bits; boot from ROM.
[2-3] Port size = 32 bits; boot from Flash.
1-2 IEEE 1149 functionality enabled at IEEE 1149 header.
[2-3] Debug functionality enabled at Debug header.
1-2 External arbitration selected (for one or two external masters).
[2-3] Internal arbitration selected (for one external master only).
1-2 “Native” (EIDE) addressing mode selected for IDE interface.
[2-3] “Legacy” addressing mode selected for IDE interface.
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Jumpers, Connectors, and LEDs
Header
J8
J9
J10
J11
Table 6-1. Jumper Settings (continued)
Function
DRAM DIMM configuration
DREQ# signal source for DMAtype PCMCIA cards
Jumper Settings
[1-2] 1M x 64/72 DRAM DIMM (8MB) installed.
2-3 2M/4M/8M/16M x 64/72 DRAM DIMM
(16/32/64/128MB) installed.
[1-2] 1M x 64/72 DRAM DIMM (8MB) installed.
2-3 2M x 64/72 DRAM DIMM (16MB) installed.
none 4M/8M/16M x 64/72 DRAM DIMM
(32/64/128MB) installed.
[none
]
1M/2M x 64/72 DRAM DIMM (8/16MB) installed.
1-2 4M x 64/72 DRAM DIMM (32MB) installed.
2-3 8M/16M x 64/72 DRAM DIMM (64/128MB) installed.
[1-2] PCMCIA module DREQ# signal on INPACK# pin.
2-3 PCMCIA module DREQ# signal on BVD2_SPKR pin.
Note MBX series embedded controllers are factory tested and shipped with the default configurations listed above. The MBX family’s required and factory-installed debug monitor, EPPCBug, operates with those factory settings.
J1 Backup Power Configuration
MBX series embedded controllers can use 3.0V–3.6V battery power
(either on board, or external via utility connector #1) as a backup power source for the “keep-alive” power circuits (such as the real-time clock) in the processor.
Placing a jumper on J1 pins 1 and 2 (the default configuration) designates the on-board battery as the source for keep-alive power. Placing a jumper
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J3 Boot ROM Write Protection on J1 pins 2 and 3 designates an external battery source via utility
connector #1. (See Connecting an External Battery on page 1-10 .)
J1 J1
1 2 3
Internal Battery Backup
(factory configuration)
1 2 3
External Battery Backup
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J3 Boot ROM Write Protection
Flash memory on the MBX series embedded controller consists of one bank of four 32-pin PLCC Flash devices soldered directly to the board.
Flash memory provides 2MB (in entry-level versions) or 4MB (in standard versions) of storage. EPPCBug firmware takes up 512KB (128K words) of space; the remainder of Flash memory is available for user applications.
The firmware resident in Flash memory is originally loaded at the factory, but the Flash contents can be reprogrammed if necessary.
For purposes of reprogramming Flash, the MBX includes a 32-pin socket
(XU1) in which firmware programmers can install a removable boot ROM device. To prevent inadvertent overwriting of the Flash memory used in the boot ROM, header J3 provides write protection for the device installed in
XU1.
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Jumpers, Connectors, and LEDs
Placing a jumper on J3 pins 1 and 2 disables writes to the device in socket
XU1. Placing a jumper on J3 pins 2 and 3 (the default configuration) enables writes to the device in socket XU1.
J3 J3
6
1 2 3
Boot ROM Write-Protected
1 2 3
Boot ROM Write-Enabled
(factory configuration)
2147 9802
Note To complete the MBX boot device configuration, you must set J4
(boot ROM device selection) on the board as well.
J4 Boot ROM Device Selection
The firmware resident in Flash memory on the MBX series embedded controller is originally loaded at the factory, but the Flash contents can be reprogrammed if necessary. For purposes of reprogramming Flash, the
MBX includes a 32-pin socket (XU1) in which firmware programmers can install a removable boot ROM device. (For information about reprogramming the Flash, see the MBX Series Embedded Controller
Version B Programmer’s Reference Guide.)
As described under
J3 Boot ROM Write Protection on page 6-5
, header J3 provides write protection for the device installed in XU1 to prevent inadvertent overwriting of the Flash memory used in the boot ROM. J4 enables you to select either the soldered Flash memory (x32) or the socketed Flash chip in XU1 (x8) as the boot ROM. As a secondary function, J4 defines the bus width of the device selected—8 bits for the socketed Flash, 32 bits for the soldered Flash.
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J5 Test/Debug Port Selection
Placing a jumper on J4 pins 1 and 2 designates the 8-bit device in socket
XU1 as the boot source. Placing a jumper on J4 pins 2 and 3 (the default configuration) designates the 32-bit soldered Flash as the boot source.
J4 J4
1 2 3
Boot Port = 8-bit XU1 Device
1 2 3
Boot Port = 32-bit Soldered Flash
(factory configuration)
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J5 Test/Debug Port Selection
Certain MPC821 and MPC860 signal lines have a dual function on the
MBX series embedded controller: they may serve either as IEEE 1149 test port signals or as Debug port signals, as illustrated in this table.
MPC8xx Pin
H16
H17
G17
IEEE 1149 Signal
TCK
TDI
TDO
Debug Signal
DSCK
DSDI
DSDO
Placing a jumper on J5 pins 1 and 2 designates the MPC8xx pins listed above as IEEE 1149 test port signals and enables IEEE 1149 functionality at the test port header (J23 on the MBX board). Placing a jumper on J5 pins
2 and 3 (the default configuration) designates the MPC8xx pins listed
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Jumpers, Connectors, and LEDs above as Debug port signals and enables Debug functionality at the Debug port header (J24 on the MBX board).
J5 J5
6
1 2 3
IEEE 1149 Test Port Enabled
1 2 3
Debug Port Enabled
(factory configuration)
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The pin assignments of the IEEE 1149 and Debug port headers are listed
in Test Port Header J23 on page 6-13 and Debug Port Header J24 on page
For additional details on the configuration and use of the multiplexed IEEE
1149 test port and Debug port signals, refer to the MBX Series Embedded
Controller Version B Programmer’s Reference Guide (listed in Appendix
).
J6 Arbitration Mode
The MBX series embedded controller supports an internal and an external system arbitration mode.
The internal setting allows one extra master besides the processor. On standard boards, the additional master would be the QSpan PCI host bridge. On entry-level boards, the additional master would be an add-on
MPC8xx-type daughter card on the MPC8xx bus.
The external setting allows two masters in addition to the processor. The additional masters would be both the QSpan PCI host bridge and a card on the MPC8xx bus.
Note Given these guidelines, external arbitration is restricted to standard configuration boards with an add-on MPC8xx-type daughter card capable of bus master operation.
6-8 Computer Group Literature Center Web Site
J7 IDE Interface Configuration
Placing a jumper on J6 pins 1 and 2 configures the MBX for external arbitration. Placing a jumper on J6 pins 2 and 3 (the default) configures the
MBX for internal arbitration.
J6 J6
1 2 3
External Arbitration
1 2 3
Internal Arbitration
(factory configuration)
2150 9802
J7 IDE Interface Configuration
IDE I/O controllers can be categorized as either “legacy” or “native” devices. “Legacy” devices use a hard-wired addressing scheme with fixed interrupt requests. The more recent “native” (also known as Bus Master
IDE) devices use controller registers that are relocatable in I/O space, with interrupt requests mapped to the appropriate registers.
Use J7 to configure the IDE interface on MBX series boards as necessary for the devices you have installed.
Placing a jumper on J7 pins 1 and 2 configures the IDE interface for native addressing mode. Placing a jumper on J7 pins 2 and 3 (the default) configures the IDE interface for legacy addressing mode.
J7 J7
6
1 2 3
Native IDE Mode
1 2 3
Legacy IDE Mode
(factory configuration)
2151 9802
For additional details on programming IDE devices, refer to the MBX
Series Embedded Controller Version B Programmer’s Reference Guide
(listed in
Appendix B, Related Documentation
).
http://www.motorola.com/computer/literature 6-9
6
Jumpers, Connectors, and LEDs
J8–J10 DRAM DIMM Size
The MBX series embedded controller provides either 4MB or 16MB of onboard DRAM, soldered in place. In addition, it accommodates 8MB,
16MB, 32MB, 64MB, or 128MB of expansion DRAM in a 168-pin DIMM socket, XU3.
Because the MBX supports I
2
C serial presence detect, the firmware automatically detects the amount of memory installed in this socket. The address width, however, is specified by jumper settings.
J8, J9, and J10 are configured as a set to match the size of the DRAM module you have installed on the MBX. Set the jumpers as shown in the following illustration to configure the MBX for the amount of expansion
DRAM in socket XU3.
J8 J9 J10
8MB
(factory configuration)
1 2 3 1 2 3 1 2 3
16MB
1 2 3 1 2 3 1 2 3
32MB
1 2 3
64MB/
128MB
1 2 3
1 2 3
1 2 3
1 2 3
1 2 3
2152 9805 (i)
J11 DREQ# Signal Source for DMA-type PCMCIA Cards
A single-slot PCMCIA interface (socket XJ26) and controller are available on the MBX series embedded controller. The interface is configurable for
DMA or non-DMA PCMCIA cards; that is, the routing of the INPACK# signal (needed for only some cards with DMA capability) can be defined.
6-10 Computer Group Literature Center Web Site
J11 DREQ# Signal Source for DMA-type PCMCIA Cards
If you are installing a PCMCIA card with DMA capability, the routing of the PCMCIA INPACK# signal needs to be defined using jumper header
J11. Refer to the PCMCIA vendor documentation for specifics on the card you intend to install; if the DREQ# signal is routed via INPACK# or
BVD2_SPKR, set J11 as indicated in the following table.
If the DMA DREQ# Signal is on . . .
INPACK#
BVD2_SPKR
Jumper Pins
1-2
2-3
For non-DMA cards, place a jumper on J11 pins 2 and 3 to permit use of the BVD2_SPKR signal.
The factory configuration uses pins 1 and 2 on J11.
J11 J11
6
1 2 3
DREQ# Signal on INPACK# Pin
(factory configuration)
1 2 3
DREQ# Signal on BVD2_SPKR Pin
2153 9802 http://www.motorola.com/computer/literature 6-11
6
Jumpers, Connectors, and LEDs
MBX Connectors and Pin Assignments
Power Connector J12
A seven-pin friction lock connector, right angle or straight up, serves as power connector. The pin assignments for the power connector are listed in the following table.
Table 6-2. Power Connector Pin Assignments
6
7
4
5
Pin #
1
2
3
Voltage
+5V
GND
GND
+12V
+3.3V
GND
+5V
Analog Power Connector J28
Standard configurations of the MBX include a three-pin, straight-up friction lock connector for analog power. The pin assignments for this connector are listed in the following table.
Table 6-3. Analog Power Connector Pin Assignments
Pin #
1
2
3
Voltage
−
12V
GND
−
5V
6-12 Computer Group Literature Center Web Site
Test Port Header J23
Test Port Header J23
A 16-pin header (J23 on MBX series boards) provides access to an IEEE
1149 test port. The pin assignments are listed in the following table.
Note To enable this port, you must configure jumper header J5 (see
Test/Debug Port Selection on page 6-7
).
Table 6-4. Test Port Header Pin Assignments
Signal
11
13
7
9
15
Pin #
1
3
5
Signal
TDO
TDI
TCK
TMS
SRESET#
HRESET#
TRST#
+3.3V
Key
GND
8
10
12
14
16
Pin #
2
4
6
Debug Port Header J24
A 10-pin header (J24 on MBX series boards) provides access to Debug port signals. The pin assignments are listed in the following table.
6 http://www.motorola.com/computer/literature 6-13
6
Jumpers, Connectors, and LEDs
Note
To enable this port, you must configure jumper header J5 (see J5
Test/Debug Port Selection on page 6-7 ).
Table 6-5. Debug Port Header Pin Assignments
Pin #
1
3
5
7
9
Signal
VFLS0
GND
GND
HRESET#
+3.3V
Signal
SRESET#
DSCK
VFLS1
DSDI
DSDO
Pin #
2
4
6
8
10
Parallel I/O Header J13
A 26-pin header (J13 on MBX series boards) provides access to the parallel I/O interface. The pinouts are arranged to permit a direct ribbon cable connection to a standard IEEE P1284-A DB25 female connector.
The pin assignments are listed in the following table.
Table 6-6. Parallel I/O Header Pin Assignments
11
13
7
9
Pin #
1
3
5
15
17
D2
D3
D4
D5
Signal
STBO#
D0
D1
D6
D7
Signal
AUTOFD#
FAULT#
INIT#
SEL_IN#
GND
GND
GND
GND
GND
8
10
12
14
Pin #
2
4
6
16
18
6-14 Computer Group Literature Center Web Site
Serial Port Header J18
Table 6-6. Parallel I/O Header Pin Assignments
Pin #
19
21
23
25
Signal
STBI#
BUSY
PERROR
SEL_OUT
Signal
GND
GND
GND
Key
Pin #
20
22
24
26
Notes 1. AUTOFD#, INIT#, and SEL_IN# are not supported when the MPC8xx port is used. They are supported when the
Peripheral I/O controller port is used.
2. BUSY, PERROR, and SEL_OUT are pulled down with
4.7K
Ω
resistors. All other control signals are pulled up with
4.7K
Ω
resistors.
Serial Port Header J18
A 10-pin header (J18 on MBX series boards) provides access to the EIA-
232 serial I/O interface. The pinouts are arranged to permit a direct ribbon cable connection to a DB9 male connector. The pin assignments are listed in the following table.
DB9 Pin
(DTE)
1
2
3
4
5
Table 6-7. Serial I/O Header Pin Assignments
Signal Signal Header
Pin
1
3
5
7
9
DCD
RXD
TXD
DTR
GND
DSR
RTS
CTS
RI
Header
Pin
2
4
6
8
10
DB9 Pin
(DTE)
6
7
8
9
Note For SMC1, only TXD and RXD are supported.
6 http://www.motorola.com/computer/literature 6-15
6
Jumpers, Connectors, and LEDs
Ethernet 10BaseT Connector J15
MBX series embedded controllers provide both 10BaseT and (optionally)
AUI local area network connections. The 10BaseT LAN interface is implemented with a shielded vertical-mount RJ-45 socket located on the board. The pin assignments are listed in the following table.
Table 6-8. Ethernet 10BaseT Connector Pin Assignments
6
7
4
5
8
Pin #
1
2
3
Signal
TD+
TD
−
RD+
No connection
No connection
RD
−
Reserved
Reserved
Ethernet AUI Header J20
The optional AUI connection is implemented with a 16-pin header (J20) located on the MBX series board. The pinouts are arranged to permit a direct ribbon cable connection to a DB15 female connector. The pin assignments are listed in the following table.
6-16 Computer Group Literature Center Web Site
8xx/COMM Expansion Connectors
Note If the AUI option is not present on the MBX board, header J20 and other AUI-related parts are not populated.
Table 6-9. Ethernet AUI Header Pin Assignments
Signal Signal
5
6
3
4
DB15
Pin
1
2
7
8
Header
Pin
1
3
9
11
5
7
13
15
GND
CD+
TD+
GND
RD+
GND
GND
CD
−
TD
−
GND
RD
−
+12V
GND
Header
Pin
2
4
10
12
6
8
14
16
DB15
Pin
9
10
11
12
13
14
15
8 xx /COMM Expansion Connectors
MBX series embedded controllers support EBX form factor expansion modules such as PC/104, PC/104-Plus, and 8xx/COMM modules. On
MBX860 boards, the 860/COMM expansion connector (P1), a 144-pin high-density socket, provides the electrical connection for expansion modules. On MBX821 boards, the 821/COMM expansion connector (P1) performs a similar function. The pin assignments are listed in the following two tables.
Table 6-10. 860/COMM Expansion Connector Pin Assignments
Pin #
1
2
3
4
Row A
RETRY#
GND
TA#
GND
TS#
GND
Row B
BB#
AS#
Row C
COMMINT#
CS#
Reserved
Reserved
Row D
CLKOUT
GND
SPKROUT
HRESET#
6 http://www.motorola.com/computer/literature 6-17
6
Jumpers, Connectors, and LEDs
Table 6-10. 860/COMM Expansion Connector Pin Assignments
Row C Row D Pin #
5
6
Row A
TEA#
GND
9
10
7
8
11
16
17
18
19
12
13
14
15
20
21
22
23
24
25
SCC3TXD
SCC3RXD
SCC3RTS
SCC3CTS
SCC3DCD
+5V
SCC4TXD
SCC4RXD
SCC4RTS
SCC4CTS
SCC4DCD
+12V
SMC1RXD
SMC1TXD
SMC1SYN
+5V
SMC2RXD/
L1CLKOa
SMC2TXD/
L1CLKOb
SMC2SYN
+3.3V
L1RXDa
L1TXDa
L1RXDb
L1TXDb
L1ST4
L1ST3
L1RSYNCb
L1TSYNCb
L1RSYNCa
L1TSYNCa
+3.3V
GND
Row B
L1TCLKb
(T4_C8)
B4_T4_C7
L1RCLKb
(T3_C6)
B3_T3_C5
L1TCLKa
(B2_T2_C3)
L1RCLKa
(B1_T1_C1)
SCC2TXD
SCC2RXD
D0
D2
D4
D6
D8
D10
D12
D22
D24
D26
D28
D14
D16
D18
D20
D30
A0
A2
A4
A6
A8
D1
D3
D5
D7
D9
D11
D13
D23
D25
D27
D29
D15
D17
D19
D21
D31
A1
A3
A5
A7
A9
6-18 Computer Group Literature Center Web Site
8xx/COMM Expansion Connectors
Table 6-10. 860/COMM Expansion Connector Pin Assignments
Pin #
26
27
28
29
30
31
32
33
34
35
36
Row A
GND
SPICLK
SPIMOSI
SPIMISO
SPISEL
I2CSCL
I2CSDA
BRCOMM#
BGCOMM#
RD/WR#
Reserved
Row B
SCC2RTS
SCC2CTS
SCC2DCD
SIZ0
SIZ1
GND
BI#
BDIP#
BURST#
Reserved
Reserved
A18
A20
A22
A24
A10
A12
A14
A16
A26
A28
A30
Row C
A19
A21
A23
A25
A11
A13
A15
A17
A27
A29
A31
Row D
Table 6-11. 821/COMM Expansion Connector Pin Assignments
4
5
6
Pin
1
2
3
7
8
9
Row A
RETRY#
GND
TA#
GND
TEA#
GND
LD3
LD4
LD0
TS#
GND
Row B
BB#
AS#
GND
L1TCLKb
(T4_C8)
B4_T4_C7
L1RCLKb
(T3_C6)
B3_T3_C5
Row C
COMMINT#
CS#
Unused
Unused
D0
D2
D4
D6
D8
Row D
CLKOUT
GND
SPKROUT
HRESET#
D1
D3
D5
D7
D9
6 http://www.motorola.com/computer/literature 6-19
6
Jumpers, Connectors, and LEDs
Table 6-11. 821/COMM Expansion Connector Pin Assignments
Pin
10
11
16
17
18
19
12
13
14
15
20
21
22
23
24
29
30
31
32
25
26
27
28
Row A
L1TSYNCb
L1RSYNCb
+5V
LD1
LD2
LCD_AC/OE
L1TSYNCa
L1RSYNCa
+12V
SMC1RXD
SMC1TXD
SMC1SYN
+5V
SMC2RXD/
L1CLKOa
SMC2TXD/
L1CLKOb
SMC2SYN
GND
SPICLK
SPIMOSI
SPIMISO
SPISEL
I2CSCL
I2CSDA
Row B
L1TCLKa
(B2_T2_C3)
L1RCLKa
(B1_T1_C1)
+3.3V
L1RXDa
L1TXDa
L1RXDb
L1TXDb
L1ST4
L1ST3
LD5
LD6
LD7
LD8
+3.3V
SCC2TXD
SCC2RXD
SCC2RTS
SCC2CTS
SCC2DCD
SIZ0
SIZ1
GND
BI#
D10
Row C
D12
D22
D24
D26
D28
D14
D16
D18
D20
D30
A0
A2
A4
A6
A16
A18
A20
A22
A8
A10
A12
A14
D11
Row D
D13
A17
A19
A21
A23
A9
A11
A13
A15
D23
D25
D27
D29
D15
D17
D19
D21
D31
A1
A3
A5
A7
6-20 Computer Group Literature Center Web Site
Utility Connector J16
Table 6-11. 821/COMM Expansion Connector Pin Assignments
Pin
33
34
35
36
Row A
BRCOMM#
BGCOMM#
RD/WR#
CLK
Row B
BDIP#
BURST#
FRAME_L
LOAD_L
A24
A26
A28
A30
Row C
A25
A27
A29
A31
Row D
Utility Connector J16
A 20-pin dual-row header known as “Utility Connector #1” supplies the interface between the MBX series embedded controller and external devices such as status LEDs, Reset and Abort switches, and power sources.
The pin assignments for this utility connector are listed in the following table.
Table 6-12. Utility Connector #1 (J16) Pin Assignments
11
13
7
9
Pin #
1
3
5
15
17
19
Signal
+3.3V
+5V
ResetSwitch#
ETHTX LED#
ETHRX LED#
ETHCOL LED#
ETHTPI LED#
ETHTPP LED#
Battery Low#
MBX Bus Activity#
Signal
−
12V
−
5V
Battery Plus
Battery Minus
Power Fail Sense#
Stop Interrupt#
GND
IDE LED#
Flash Programming#
PCI Bus Activity#
8
10
12
14
Pin #
2
4
6
16
18
20
6 http://www.motorola.com/computer/literature 6-21
6
Jumpers, Connectors, and LEDs
Notes 1. Power Fail Sense# is intended for input and sends a NMI to the processor when voltage falls below 0.8V. The signal is filtered for noise.
2. +3.3V, +5V,
−
12V,
−
5V, and GND should only be used for low-power applications.
LCD & SPI Connector J27 (MBX821)
On MBX821 models, a 24-pin dual-row header supplies the interface between the MBX821’s LCD controller and the panel. The pin assignments for the LCD connector are listed in the following table.
Table 6-13. LCD & SPI Connector Pin Assignments
11
13
7
9
Pin #
1
3
5
15
17
19
21
23
Signal
GND
GND
GND
+12V
+5V
+3.3V
LD1
LD3
LD5
LD7
SPIMISO
SPICLK
Signal
Reserved
SHIFT/CLK
LOAD/HSYNC
FRAME/VSYNC
LCD_AC/OE
LD0
LD2
LD4
LD6
LD8
SPIMOSI
SPISEL
8
10
12
14
Pin #
2
4
6
16
18
20
22
24
6-22 Computer Group Literature Center Web Site
PC/104-Plus (PCI) Expansion Connector P2
PC/104Plus (PCI) Expansion Connector P2
A 120-pin high-speed stackable socket provides an interface for PC/104-
Plus expansion devices. The pin assignments for the PC/104-Plus connector are listed in the following table.
+3.3V
SERR#
GND
STOP#
+3.3V
FRAME#
GND
AD18
Row A
5V Key
VI/O
AD05
C/BE0#
GND
AD11
AD14
AD21
+3.3V
IDSEL0
AD24
GND
AD29
12
13
14
15
10
11
8
9
6
7
4
5
Pin #
1
2
3
16
17
18
19
20
21
Table 6-14. PC/104Plus Expansion Connector Pin Assignments
C/BE1#
GND
PERR#
+3.3V
TRDY#
GND
AD16
+3.3V
Row B
Reserved
AD02
GND
AD07
AD09
VI/O
AD13
AD20
AD23
GND
C/BE3#
AD26
+5V
AD17
GND
AD22
IDSEL1
VI/O
AD25
AD28
GND
AD15
SB0#
+3.3V
LOCK#
GND
IRDY#
+3.3V
Row C
+5V
AD01
AD04
GND
AD08
AD10
Row D
AD00
+5V
AD03
AD06
GND
M66EN
AD12
+3.3V
PAR
SDONE
GND
DEVSEL#
+3.3V
C/BE2#
GND
AD19
+3.3V
IDSEL2
IDSEL3
GND
AD27
6 http://www.motorola.com/computer/literature 6-23
6
Jumpers, Connectors, and LEDs
Table 6-14. PC/104Plus Expansion Connector Pin Assignments
Pin #
22
23
24
25
26
27
28
29
30
Row A
+5V
REQ0#
GND
GNT1#
+5V
CLK2
GND
+12V
−
12V
Row B
AD30
GND
REQ2#
VI/O
CLK0
+5V
INTD#
INTA#
Reserved
Row C
GND
REQ1#
+5V
GNT2#
GND
CLK3
+5V
INTB#
Reserved
Row D
AD31
VI/O
GNT0#
GND
CLK1F
GND
RST#
INTC#
3.3V Key
Notes 1. The key pins on the PC/104-Plus expansion connector are provided to ensure proper module installation. In +5V I/O configurations, pin A1 is removed and the female side plugged. In +3.3V I/O configurations, pin D30 is similarly modified.
2. M66EN signal ground corresponds to a 33 MHz PCI bus ground. VI/O lines are connected to +5V.
6-24 Computer Group Literature Center Web Site
PC/104 (ISA) Expansion Connector J21/J22
PC/104 (ISA) Expansion Connector J21/J22
Two connectors, a 2
×
20-pin (J21) and a 2
×
32-pin (J22) socket, make up the PC/104 ISA bus expansion connector. The pin assignments for the
PC/104 connector are listed in the following table.
SA15
SA14
SA13
SA12
SA11
SA10
SD5
SD4
SD3
SD2
Row A
IOCHK#
SD7
SD6
SD1
SD0
IOCHRDY
AEN
SA19
SA18
SA17
SA16
12
13
14
15
10
11
8
9
6
7
4
5
Pin #
1
2
3
16
17
18
19
20
21
Table 6-15. PC/104 Expansion Connector Pin Assignments
GND
Row B
RSTISA
+5V
INT9
−
5V
DRQ2
−
12V
ENDXFR#
+12V
Key
SMEMW#
SMEMR#
IOW#
IOR#
DACK3#
DRQ3
DACK1#
DRQ1
REFRESH#
ISACLK
INT7
SD12
SD13
SD14
SD15
Key
LA18
LA17
MEMR#
MEMW#
SD8
SD9
SD10
SD11
GND
Row C
SBHE#
LA23
LA22
LA21
LA20
LA19
INT14
DACK0#
DRQ0
DACK5#
DRQ5
DACK6#
DRQ6
DACK7#
GND
Row D
MEMCS16#
IOCS16#
INT10
INT11
INT12
INT15
DRQ7
+5V
MASTER#
GND
GND
6 http://www.motorola.com/computer/literature 6-25
6
Jumpers, Connectors, and LEDs
Table 6-15. PC/104 Expansion Connector Pin Assignments (continued)
Row C Row D Pin #
22
23
24
25
26
27
28
29
30
31
32
SA5
SA4
SA3
SA2
SA9
SA8
SA7
SA6
SA1
SA0
GND
Row A
INT6
INT5
Row B
INT4
INT3
DACK2#
TC
BALE
+5V
OSC
GND
GND
Note Rows C and D are not required on 8-bit modules.
EIDE Connector J14
A 44-pin dual-row header supplies a connection point for an EIDE
(Enhanced IDE) hard disk subsystem. The EIDE header permits a direct ribbon cable connection between the MBX series embedded controller and user-installed 2.5-inch hard disk drives. The pin assignments for the EIDE connector are listed in the following table.
Table 6-16. EIDE Connector Pin Assignments
Pin #
1
3
5
7
Signal
RST#
D7
D6
D5
Signal
GND
D8
D9
D10
Pin #
2
4
6
8
6-26 Computer Group Literature Center Web Site
EIDE Connector J14
Table 6-16. EIDE Connector Pin Assignments (continued)
Signal
D4
D3
D2
D1
D0
GND
REQA
IOW#
IOR#
CHRDY
DACKA#
IRQA
A1
A0
CS0#
ACT#
VCC
GND
29
31
33
35
21
23
25
27
37
39
41
43
Pin #
9
11
13
15
17
19
30
32
34
36
22
24
26
28
38
40
42
44
Pin #
10
12
14
16
18
20
D11
D12
Signal
D13
D14
D15
Key
GND
GND
GND
ALE
GND
IOCS16#
DIAG#
A2
CS1#
GND
VCC
Reserved
Note ALE, IOCS16#, and DIAG# are not connected on the MBX board.
6 http://www.motorola.com/computer/literature 6-27
6
Jumpers, Connectors, and LEDs
Floppy Disk Connector J17
A 34-pin dual-row header supplies the interface between the MBX series embedded controller and external floppy disk drives. The pin assignments for the floppy disk drive connector are listed in the following table.
Table 6-17. Floppy Disk Drive Connector Pin
Assignments
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Signal
GND
GND
GND
GND
GND
GND
GND
23
25
27
29
15
17
19
21
31
33
11
13
7
9
Pin #
1
3
5
Signal
DRVDEN0#
Reserved
DRVDEN1#
INDEX#
MTR0#
DRV1#
DRV0#
MTR1#
DIR#
STEP#
WDATA#
WGATE#
TRK0#
WRPRO#
RDATA#
HDSEL#
DSKCHG#
24
26
28
30
16
18
20
22
32
34
8
10
12
14
Pin #
2
4
6
6-28 Computer Group Literature Center Web Site
Utility Connector J19
Utility Connector J19
A 16-pin dual-row header known as “Utility Connector #2” supplies the interface between the MBX series embedded controller and external devices such as the keyboard and mouse. This utility connector is only available on standard configurations. The pin assignments for this connector are listed in the following table.
Table 6-18. Utility Connector #2 (J19) Pin Assignments
11
13
7
9
15
Pin #
1
3
5
Signal
KDATA
+5V fused
MDATA
IR_TXD
IR_RXD
COM2_RXD
COM2_TXD
Reserved
Signal
KCLK
MCLK
GND
GND
+5V
COM2_RTS#
COM2_CTS#
Reserved
8
10
12
14
16
Pin #
2
4
6
MBX LED Status Indicators
In addition to the six status signals (five for Ethernet activity and one for a hard disk drive) available via utility connector #1, there are eight status
6 http://www.motorola.com/computer/literature 6-29
6
Jumpers, Connectors, and LEDs
LEDs (DS1–DS8) on board the MBX. The following table describes the function of the on-board LEDs.
Table 6-19. On-board LED Status Indicators
LED
DS3 (green)
DS1 (green)
DS2 (green)
DS4
(orange)
DS5
(yellow)
DS6
(yellow)
DS7 (green)
DS8 (green)
Status at Reset
On
On
On
Off
Off
Off
Off
Off
Function
+3.3Vdc OK; lights when +3.3Vdc power is available on the MBX board.
+5Vdc OK; lights when +5Vdc power is available on the MBX board.
+12Vdc OK; lights when +12Vdc power is available on the MBX board.
Board failure; lights when a fault is present on the
MBX board. (See note.)
Battery status; lights when the on-board or external battery is low. (See note.)
Flash programming status; lights when the Flash is being reprogrammed. (See note.)
CPU activity; lights when the MPC8xx processor bus is active. Should extinguish when board is reset.
PCI activity; lights when the PCI bus is active. Valid only on standard configurations of the MBX board; should remain off on entry-level configurations.
Note This table shows the recommended configuration. Statuses of
DS4, DS5, and DS6 may vary because their functions are defined by software and controlled via control register #2. The current release of EPPCBug does not support these status indicators. If you are using EPPCBug, DS4, DS5, and DS6 will always be on
(lit).
6-30 Computer Group Literature Center Web Site
A
Specifications
A
This appendix lists general specifications and power characteristics for
MBX series embedded controllers. It also describes cooling requirements and FCC compliance.
A complete functional description of the MBX series embedded controller appears in
Chapter 5, Functional Description
. Specifications for the optional expansion modules can be found in the documentation for those modules.
General Specifications
The following table lists general specifications for MBX boards.
Table A-1. MBX Series Specifications
Characteristic
Operating Temperature
Storage Temperature
Relative Humidity
Physical Dimensions (base board only)
Width
Length
Height
Specification
0
°
C to 70
°
C (32
°
F to 158
°
F) entry air with forced-air cooling
(see also
Cooling Requirements on page A-3 )
−
40
°
C to +85
°
C (
−
40
°
F to 185
°
F)
10% to 90% (non-condensing)
EBX form factor base board
146 mm (5.75 in.)
203 mm (8.0 in.)
19 mm (0.75 in.) without DIMM or PC/104-Plus modules
A-1
A
Specifications
Power Requirements
Power requirements for the MBX embedded controller depend on the configuration of the module. You can determine the power requirements specific to your application by adding the appropriate values from the following tables.
The first table specifies the minimum power consumption of the standard configuration assuming 16MB of on-board DRAM. The values do not include power required for expansion modules, expansion DRAM, disk drives, AUI devices, or PCMCIA devices.
The second table specifies the maximum additional power consumption expected for each PC/104-Plus module installed, as defined in the PC/104-
Plus specification version 1.0.
Table A-2. Basic Power Consumption
Supply Voltage
+3.3V (
±
10%)
+5V (
±
5%)
Amps Typical
1.0 A
2.6 A
Watts Typical
3.3 W
13.0 W
Notes 1. It is expected that 5V and 3.3V be supplied to the board at the same time. To prevent damage to the processor, the 5V should never exceed the 3.3V by more than 2.5V during power up or normal operation. For more information, refer to the “Electrical Characteristics” section of the MPC8xx processor manuals.
2. +12V power is not used on the MBX board but is supplied for use by other devices (such as PCI, PCMCIA, and external
AUI transceivers). For the power requirements of these
A-2 Computer Group Literature Center Web Site
Cooling Requirements optional devices, refer to the documentation provided with the device.
Table A-3. Maximum Power Consumption for Each
PC/104Plus Module
Supply Voltage
+3.3V (
±
10%)
+5V (
±
5%)
+12V (
±
5%)
−
5V (
±
5%)
−
12V (
±
5%)
Max. Current
3 A
2 A
1 A
0.2 A
0.3 A
Max. Power
10.8 W
10.5 W
12.6 W
1.05 W
3.78 W
Cooling Requirements
The Motorola MBX series family of embedded controllers is specified, designed, and tested to operate reliably with an incoming air temperature range from 0
°
C to 70
°
C (32
°
F to 158
°
F) with forced air cooling of the entire assembly (base board and expansion modules) at a velocity typically achievable by using a 100 CFM axial fan.
Temperature qualification is performed in a Motorola development chassis. Twenty-five–watt load boards are inserted in two card slots, one on each side, adjacent to the board under test, to simulate a high power density system configuration. An assembly of three axial fans, rated at
100 CFM per fan, is placed directly under the card cage. The incoming air temperature is measured between the fan assembly and the card cage, where the incoming airstream first encounters the module under test. Test software is executed as the module is subjected to ambient temperature variations. Case temperatures of critical, high power density integrated circuits are monitored to ensure component vendors’ specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the ambient air temperature and the type, number, and location of boards and other heat sources, adequate cooling can usually be achieved with 10 CFM
A http://www.motorola.com/computer/literature A-3
A
Specifications and 490 LFM flowing over the module. Less airflow is required to cool the module in environments having lower maximum ambient temperature.
Under more favorable thermal conditions, it may be possible to operate the module reliably at higher than 70
°
C with increased airflow. It is important to note that there are several factors, in addition to the rated CFM of the air mover, which determine the actual volume and speed of air flowing over a module.
A-4 Computer Group Literature Center Web Site
B
Related Documentation
B
Motorola Computer Group Documents
The Motorola publications listed below are referenced in this manual. You can obtain paper or electronic copies of Motorola Computer Group publications by:
❏ Contacting your local Motorola sales office
❏ Visiting Motorola Computer Group’s World Wide Web literature site, http://www.motorola.com/computer/literature
Table B-1. Motorola Computer Group Documents
Document Title
MBX Series Embedded Controller Version B Programmer’s
Reference Guide
EPPCBug Firmware Package User’s Manual
EPPCBug Diagnostics Firmware User’s Manual
Publication Number
MBXA/PG
EPPCBUGA/UM
EPPCDIAA/UM
To obtain the most up-to-date product information in PDF or HTML format, visit http://www.motorola.com/computer/literature .
B-1
B
Related Documentation
Manufacturers’ Documents
For additional information, refer to the following table for manufacturers’ data sheets or user’s manuals. As an additional help, a source for the listed document is provided. Please note that, while these sources have been verified, the information is subject to change without notice.
Table B-2. Manufacturers’ Documents
Document Title and Source Publication Number
PowerPC MPC821 Portable Systems Microprocessor User’s Manual MPC821UM
MPC860UM PowerPC PowerQUICC MPC860 User’s Manual
Literature Distribution Center for Motorola Semiconductor Products
Sector Telephone: 1-800-441-2447 FAX: (602) 994-6430 or (303)
675-2150 E-mail: [email protected]
W83C553 Enhanced System I/O Controller with PCI Arbiter (PIB) SL82C565
Winbond Electronics Corporation Winbond Systems Laboratory 2730
Orchard Parkway San Jose, CA 95134 Telephone: (408) 943-6666
FAX: (408) 943-6668
Super I/O Controller
Standard Microsystems Corporation 300 Kennedy Drive Hauppage,
NY 11788 Telephone: 1-800-443-SEMI or (516) 435-6000 FAX:
(516) 233-4260
QSpan User’s Manual
Tundra Semiconductor Corporation 603 March Road Kanata, ON
K2K 2M5, Canada Telephone: 1-800-267-7231 or (613) 592-1320 or,
Tundra Semiconductor Corporation 695 High Glen Drive San Jose,
CA 95133 Telephone: (408) 258-3600 FAX: (408) 258-3659
37C672
CA91C860-33QC
B-2 Computer Group Literature Center Web Site
Related Specifications
Related Specifications
For additional information, refer to the following table for related specifications. As an additional help, a source for the listed document is provided. Please note that, while these sources have been verified, the information is subject to change without notice.
Table B-3. Related Specifications
Document Title and Source
EBX Specification, Version 1.1
For information visit the EBX Form Factor Overview available at the
Motorola Computer Group Web site.
Publication Number
The following IEEE specification are available from Institute of Electrical and Electronics
Engineers, Inc. Publication and Sales Department 345 East 47th Street New York, NY 10017-
21633 Telephone: 1-800-678-4333
IEEE Common Mezzanine Card Specification (CMC)
IEEE PCI Mezzanine Card Specification (PMC)
IEEE P996.1 Standard for Compact Embedded PC Modules
Bidirectional Parallel Port Interface Specification
P1386 Draft 2.0
P1386.1 Draft 2.0
IEEE P996.1
IEEE Standard 1284
IEEE Standard for Local Area Networks: Carrier Sense Multiple
Access with Collision Detection (CSMA/CD) Access Method and
Physical Layer Specifications
Peripheral Component Interconnect (PCI) Local Bus Specification,
Revision 2.1
PCI Special Interest Group 2575 NE Kathryn St. #17 Hillsboro, OR
97124 Telephone: 1-800-433-5177 or (503) 693-6232 FAX: (503)
693-8344
IEEE 802.3
PCI Local Bus
Specification
PC Card Standard
PCMCIA 2635 N. First Street San Jose, CA 95134 Telephone:
(408) 433-2273 FAX: (408) 433-9558 E-mail: [email protected]
http://www.pc-card.com/
PCMCIA/JEIDA
B http://www.motorola.com/computer/literature B-3
B
Related Documentation
Table B-3. Related Specifications (continued)
Document Title and Source
PowerPC Microprocessor Common Hardware Reference Platform:
A System Architecture (CHRP), Version 1.0
Literature Distribution Center for Motorola Semiconductor Products
Sector Telephone: 1-800-441-2447 FAX: (602) 994-6430 or (303)
675-2150 E-mail: [email protected]
PowerPC Microprocessor Common Hardware Reference Platform:
A System Architecture (CHRP), Version 1.0 is also available from:
IBM 1580 Route 52, Bldg. 504 Hopewell Junction, NY 12533-6531
Telephone: 1-800-PowerPC (1-800-769-3772)
PowerPC Microprocessor Common Hardware Reference Platform:
A System Architecture (CHRP), Version 1.0 is also available from:
Morgan Kaufmann Publishers, Inc. 340 Pine Street, Sixth Floor San
Francisco, CA 94104-3205, USA Telephone: (415) 392-2665 FAX:
(415) 982-2665
PC/104 and PC/104-Plus Specifications
PC/104 Consortium P.O. Box 4303 Mountain View, CA 94040
Telephone: (415) 903-8304 FAX: (415) 967-0995
PowerPC Reference Platform (PRP) Specification, Third Edition,
Version 1.0, Volumes I and II
International Business Machines Corporation Power Personal
Systems Architecture 11400 Burnet Rd. Austin, TX 78758-3493
Document/Specification Ordering Telephone: 1-800-PowerPC (1-
800-769-3772) or (708) 296-9332
Information Technology—Local and Metropolitan Networks—
Part 3: Carrier Sense Multiple Access with Collision Detection
(CSMA/CD) Access Method and Physical Layer Specifications
Global Engineering Documents 15 Inverness Way East Englewood,
CO 80112-5704 Telephone: 1-800-854-7179 or (303) 792-2181
(This document can also be obtained through the national standards body of member countries.)
Publication Number
TB338/D
MPRP-CHRP-01
ISBN 1-55860-394-8
PC/104, PC/104-Plus
MPR-PPC-RPU-02
ISO/IEC 8802-3
B-4 Computer Group Literature Center Web Site
Related Specifications
Table B-3. Related Specifications (continued)
Document Title and Source
Interface Between Data Terminal Equipment and Data Circuit-
Terminating Equipment Employing Serial Binary Data Interchange
(EIA-232-D)
Electronic Industries Association Engineering Department 2001 Eye
Street, N.W. Washington, D.C. 20006
Publication Number
ANSI/EIA-232-D
Standard
B http://www.motorola.com/computer/literature B-5
Numerics
10BaseT
connector (J15), pinouts
8xx/COMM connector (P1), pinouts
interface
module installation
A
abort switch
air temperature
analog power connector (J28), pinouts
requirements
applying power
AUI
optional connector, pinouts
B
battery freshness seal
handling
life
NVRAM
on-board
low indication
replacing on-board
status LED
battery backup
configuring
,
external
on board
,
baud rate
block diagrams
board architecture
components
Index
configuration data
failure LED
features
installation
layout
parameters, displaying
preparation
boot ROM device configuring
,
contents
write protecting
break
bus interface
bus master IDE
C
checksum, Flash
cold reset
commands
BREAK
buffer
Display Vital Product Data (VPD)
entering
execution
execution at startup
GO
Help (HE)
Program Load (PL)
Set Environment (ENV)
Switch Directories (SD)
syntax
terminating
comments, sending
configuration data
configurations entry-level
standard
IN-1
I
N
D
E
X configuring arbitration mode
battery backup
baud rate
boot memory
boot ROM/Flash write protection
console
debug/test port
DRAM
DREQ# signal source
environment parameters
IDE addressing mode
PCMCIA
serial communications
terminal
,
,
connecting an external battery
connectors location
See also J12 to J28 for specific connec-
tors.
console configuration
,
console port (J18)
control registers
conventions used in the manual
cooling requirements
CPU activity LED
D
debug port header (J24), pinouts
selection
signals
debugger
debugger commands
breaking
debugger prompt
diagnostics
diagnostics prompt
diagrams, board architecture
dimensions, MBX board
DIMM socket (XU3)
disk interfaces
EIDE connector pinouts
floppy disk connector pinouts
DMA capability
documentation, related
DRAM configuration
installation
specifications
DREQ# signal source
E
EBX form factor
EBX specification
EIA-232
EIDE interface
connector (J14), pinouts
entering commands
entry-level configuration
entry-level features
ENV command
parameters
EPPCBug firmware
command execution
command syntax
debugger
debugger commands
memory requirements
overview
EPPC-Bug prompt
EPPC-Diag prompt
equipment required
ESD precautions
Ethernet
10BaseT connector (J15), pinouts
AUI header (J20), pinouts
interface
station address
expansion modules installation
stacking
IN-2 Computer Group Literature Center Web Site
external battery, connecting
F
features by model
general description
summary
firmware
,
command buffer
delay
offset
size
command execution
command syntax
commands
memory requirements
overview
Flash memory
programming
status LED
write protecting
floppy disk drive connector (J17), pinouts
controller
power
forced air cooling
freshness seal, breaking and resetting
functional description
fuses, self-resetting
H
handshaking, serial
hard disk drive interface
EIDE connector (J14), pinouts
power
hardware features
,
handshaking
initialization
,
Help command
humidity
I
I/O controller
I
2
C (interprocessor-integrated controller)
IDE addressing modes
IEEE 1149 test port header (J23), pinouts
selection
signals
IEEE 1284 parallel port
header (J13), pinouts
initialization
,
installation overview
installation procedures
installing
8xx/COMM module
DRAM
expansion modules
MBX board
PC/104 modules
PC/104-Plus modules
PCMCIA module
replacement battery
ISA arbitration
ISA connectors (J21/J22)
pinouts
J
J1 to J11
.
J12 power connector, pinouts
J13 parallel I/O header, pinouts
J14 EIDE connector
pinouts
J15 10BaseT connector, pinouts
J16 utility connector #1, pinouts
J17 floppy disk connector, pinouts
J18 serial port header, pinouts
J19 utility connector #2, pinouts
J20 AUI header, pinouts
J21/J22 ISA connectors
pinouts
http://www.mcg.mot.com/literature IN-3
I
N
D
E
X
I
N
D
E
X
J23 test port header, pinouts
J24 debug port header, pinouts
J27 LCD & SPI connector, pinouts
J28 analog power connector, pinouts
jumper settings
jumpers
J1 backup power configuration
,
configuring
J3 boot ROM write protection, configuring
J4 boot ROM device selection configuring
J5 test/debug port selection, configuring
J6 arbitration mode, configuring
J7 IDE interface configuration
J8, J9, J10 DRAM configuration
configuring
J11 DREQ# signal source, configuring
J4 boot ROM device selection
location
K
keep-alive power (KAPWR) configuring backup
consumption
on-board source
keyboard interface
L
LAN circuits, fuse protection
LCD & SPI connector (J27), pinouts
LCD interface
LEDs
location
on-board, defined
legacy (IDE addressing)
lithium battery precautions
loading programs
low-battery indication
IN-4
M
manual conventions
manufacturers’ documents
MBX models
memory adding
boot ROM configuring
,
contents
DRAM
EEPROM
firmware requirements
Flash
NVRAM
write protecting boot ROM/Flash
mouse interface
MPC821 processor, description
MPC860 processor, description
MPC8xx bus interface
N
native (IDE addressing)
NVRAM
O
on-board battery
,
life
replacing
on-board LEDs
P
P1 8xx/COMM connector, pinouts
P2 PCI connector, pinouts
P996.1 Standard
parallel connector (J13), pinouts
parallel interface
parallel port
PC/104 connector (J21/J22), pinouts
installation
stacking
Computer Group Literature Center Web Site
PC/104-Plus connector (P2), pinouts
dimensions
installation
interface
power consumption
stacking
PCI activity LED
arbitration
connector (P2)
pinouts
Revision 2.1
PCI/ISA bridge controller
PCI/ISA interface
PCMCIA installation
interface
performing diagnostics
,
polyswitches
power analog connector (J28), pinouts
requirements
applying
connector (J12), pinouts
floppy disk drive
fused voltages
hard disk drive
keyboard/mouse
LCD panel
requirements
status LEDs
power monitor circuit
PowerQUICC
preparing the board
processors, description
programming console
Flash memory
http://www.mcg.mot.com/literature programs execution offset
loading
prompts
Q
QSpan
,
R
R59 and R68 (fuses)
real-time clock
registers, PCI interrupts route control
related documentation
related specifcations
required equipment
reset switch
resetting the system
RJ-45 socket, pinouts
route control registers
running programs
S
SCC (serial communication controller) channels
SCC1 and Ethernet
selecting a boot device
serial asynchronous
communications interface
handshaking
ports
header (J18), pinouts
setting environment parameters
setting jumpers
setup overview
SMC (serial management controller) channels
specifications
MBX board
related
SPI & LCD connector (J27), pinouts 6-22
IN-5
I
N
D
E
X
I
N
D
E
X
IN-6
SPI (serial peripheral interface)
stacking modules
standard configuration
standard features
Standard Microsystems (SMC) 37C672
startup commands
status indicators
suggestions, submitting
switches
system initialization
reset
startup
system calls, breaking
T
TDM (time division multiplexing)
,
temperature
terminal configuration
terminating a command
test port header (J23), pinouts
selection
signals
timer functions
TSA (time slot allocator)
typeface, meaning of
U
unpacking guidelines
using debugger
utility connector #1 (J16), pinouts
utility connector #2 (J19), pinouts
V
vital product data (VPD)
,
VPD commmand
W
warm reset
Winbond W83C553F
X
XJ26 PCMCIA connector
XON/XOFF
XU1 boot ROM socket
XU2 NVRAM socket
XU3 DIMM socket
,
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