STMicroelectronics LBP01 Datasheet

LBP01

LED bypass protection

Datasheet

−

production data

Features

■

■

■

Bidirectional device: LBP01-0810B

Unidirectional device: LBP01-0803SC5

RoHS compliant

Benefits

■

■

■ Keep LED strings on in case of LED open mode failure

Reduced maintenance cost

Increase lifetime of the lighting system

Complies with the following standards:

■

■

IEC61000-4-2 level 4

– ±15 kV (air discharge)

– ±8 kV (contact discharge)

IEC 61000-4-5

– ±1kV / 24 A

Applications

This device shunts failed LEDs in applications where LED strings can not be turned-off for safety reason due to a LED failure. Main applications are:

■

■

Automotive headlights

Traffic lights

■

■

■

■

Aircraft runaway lights

Emergency lighting systems

Display panel backlighting

Street lighting

SMB

(DO-214AA)

LBP01-0810B

SOT23-5L

LBP01-0803SC5

Figure 1.

Functional diagrams

Control circuit

Control circuit

LBP01-0810B

1

3

4

5

2

LBP01-0803SC5

Description

The LBP01 series are bypass switches to be connected in parallel with 1 or 2 LEDs. In case of

LED failure, this allows the current to flow through the other LEDs.

It also provides an overvoltage protection against surges defined in IEC 61000-4-2 and

IEC 61000-4-5

Their robust dice also protect LEDs against surge.

These devices are compatible with LEDs up to

1 A.

LBP01 are packaged either in SMB or SOT23-5L

March 2012

This is information on a product in full production.

Doc ID 022950 Rev 1 1/8 www.st.com

8

Characteristics

1 Characteristics

LBP01

Table 1.

Symbol

V

PP

I

PP

I

F

T j

T stg

T

L

Absolute maximum ratings (T amb

= 25 °C)

Parameter

Peak pulse voltage IEC 61000-4-2 contact discharge

Repetitive peak pulse current (8/20µs)

SOT23-5L

On-state DC current

SMB

Operating junction temperature range

Storage temperature range

Maximum lead temperature for soldering during 10 s

Value

30

24

0.35

1

-55 to 150

-65 to 150

260

Table 2.

Symbol

I

RM

V

BO

Electrical characteristics (T amb

= 25 °C)

Test conditions

V

RM

= 3 V

I

H

V on

I on

= 0.35 A

(1)

I on

= 0.35 A

I on

= 1 A dV/dt

R th(j-a)

On recommended pad layout with copper area of 1 cm

2

1.

Measured between pin 1, 3, 4, or 5 and pin 2

SOT23-5L

SMB

SOT23-5L

SMB

SMB

SOT23-5L

SMB

Min.

Typ. Max.

Unit

8

100

15

200

200

2

1.3

1.5

nA

V mA

300

140

100

V

V

V

V/µs

°C/W

°C/W

Unit

A

°C

°C

°C kV

A

A

2/8 Doc ID 022950 Rev 1

LBP01 Ordering information scheme

Figure 2.

Thermal resistance, junction to ambient, versus copper area under each lead (SMB)

Figure 3.

Thermal resistance, junction to ambient, versus copper area under each lead (SOT23-5L)

200

Rth(j-a)(°C/W)

240

Rth(j-a)(°C/W)

180

160

140

120

100

80

0

SCu(mm2)

20 40 60 80 100 120 140 160 180 200

220

200

180

160

140

120

SCu(mm2)

100

0 20 40 60 80 100 120 140 160 180 200

2 Ordering information scheme

Figure 4.

Ordering information scheme

LBP 01 - vv ii p

LED bypass protection

Version

Breakdown voltage

Forward DC current

Delivery mode

SC5 = SOT23-5L

B = SMB

Doc ID 022950 Rev 1 3/8

Package information LBP01

●

●

Epoxy meets UL94, V0

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

® specifications, grade definitions and product status are available at: www.st.com

.

ECOPACK

®

is an ST trademark.

Table 3.

SMB dimensions

Ref.

Millimeters

C

E1

E

L

D

A1

A2 b

A1

A2 b c

D

E

E1

L

Min.

1.90

0.05

1.95

0.15

3.30

5.10

4.05

0.75

Figure 5.

Footprint, dimensions in mm

(inches)

Figure 6.

Marking

(1)

Max.

2.45

0.20

2.20

0.40

3.95

5.60

4.60

1.50

Dimensions

Inches

Min.

0.075

0.002

0.077

0.006

0.130

0.201

0.159

0.030

Max.

0.096

0.008

0.087

0.016

0.156

0.220

0.181

0.059

1.62

2.60

(0.064) (0.102)

1.62

(0.064)

2.18

(0.086) x x x z y w w

ECOPACK compliance

XXX: Marking

Z: Manufacturing location

Y: Year

WW: week

5.84

(0.23)

1.

Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.

4/8 Doc ID 022950 Rev 1

LBP01 Package information

Table 4.

SOT23-5L dimensions

Ref.

Millimeters

Dimensions

Inches

A

A2 c

D b q

H

E

L e e

A1

Min. Typ. Max.

Min.

Typ.

Max.

A 0.90

A1 0

A2 0.90

b 0.35

c 0.09

D 2.80

E 1.50

e

H 2.60

L 0.10

M 0°

0.95

1.45

0.035

0.10

0

1.30

0.035

0.50

0.014

0.20

0.004

3.05

0.11

1.75

0.059

3.00

0.102

0.60

0.004

10° 0°

0.037

0.057

0.004

0.051

0.020

0.008

0.118

0.069

0.118

0.024

10°

Figure 7.

Footprint, dimensions in mm

(inches)

Figure 8.

Marking

0.60

(0.024)

1.20

(0.047)

3.50

(0.138)

2.30

(0.091)

0.95

(0.037)

1.10

(0.043) xx xx

Doc ID 022950 Rev 1 5/8

Recommendations on PCB assembly

4 Recommendations on PCB assembly

LBP01

1.

To control the solder paste amount, the closed via is recommended instead of open vias.

2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.

Figure 9.

Printed circuit board layout

Note:

Figure 10.

ST ECOPACK

®

recommended soldering reflow profile for PCB mounting

150

100

50

250

Temperature (°C)

200

0 30

2 - 3 °C/s

240-245 °C

60 sec

(90 max)

-2 °C/s to

-3 °C/s

-6 °C/s max

0.9 °C/s

60 90 120 150 180 210

Time (s)

240 270 300

Minimize air convection currents in the reflow oven to avoid component movement.

6/8 Doc ID 022950 Rev 1

LBP01 Ordering information

Table 5.

Ordering information

Order code Marking Package Weight

LBP01-0803SC5

LBP01-0810B

XT08

L08

(1)

SOT23-5L

SMB

16 mg

0.11 g

1.

The marking can be rotated by 90° to differentiate assembly location.

Base qty

3000

2500

Delivery mode

Tape and reel

Tape and reel

Table 6.

Date

Document revision history

Revision

20-Mar-2012 1 Initial release.

Changes

Doc ID 022950 Rev 1 7/8

LBP01

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