HP Proliant DL580 User guide

HP ProLiant DL580 G7 Server
User Guide
Part Number 595656-001
June 2010 (First Edition)
© Copyright 2010 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft, Windows, and Windows Server are U.S. registered trademarks of Microsoft Corporation.
Intel and Xeon are trademarks of Intel Corporation in the U.S. and other countries.
Intended audience
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the
servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
Contents
Component identification ............................................................................................................... 7
Front panel components ................................................................................................................................ 7
Front panel LEDs and buttons ......................................................................................................................... 8
Systems Insight Display ................................................................................................................................. 9
Rear panel components .............................................................................................................................. 10
Rear panel LEDs and buttons ....................................................................................................................... 11
Power supply LED ....................................................................................................................................... 12
System board components .......................................................................................................................... 13
System maintenance switch ............................................................................................................... 14
SPI board components ................................................................................................................................ 15
I/O expansion board components ............................................................................................................... 16
Processors and memory cartridges ............................................................................................................... 17
DIMM slot locations .................................................................................................................................... 18
Device numbers ......................................................................................................................................... 18
Hard drive LEDs ............................................................................................................................... 19
Hard drive LED combinations ............................................................................................................ 19
Battery pack LEDs ....................................................................................................................................... 20
FBWC module LEDs .................................................................................................................................... 22
Fan locations ............................................................................................................................................. 23
Power supply backplane components ........................................................................................................... 23
Operations................................................................................................................................. 25
Power up the server .................................................................................................................................... 25
Power down the server ............................................................................................................................... 25
Extend the server from the rack .................................................................................................................... 25
Remove the access panel ............................................................................................................................ 26
Remove the processor memory drawer ......................................................................................................... 27
Access the Systems Insight Display ............................................................................................................... 28
Remove the SPI board ................................................................................................................................. 28
Setup......................................................................................................................................... 30
Optional installation services ....................................................................................................................... 30
Rack planning resources ............................................................................................................................. 30
Optimum environment................................................................................................................................. 31
Space and airflow requirements ........................................................................................................ 31
Temperature requirements ................................................................................................................. 31
Power requirements .......................................................................................................................... 32
Electrical grounding requirements ...................................................................................................... 32
Rack warnings ........................................................................................................................................... 33
Identifying the contents of the server shipping carton...................................................................................... 33
Installing hardware options ......................................................................................................................... 33
Installing the server into the rack .................................................................................................................. 33
Powering up and configuring the server........................................................................................................ 34
Installing the operating system ..................................................................................................................... 34
Registering the server.................................................................................................................................. 34
Hardware options installation....................................................................................................... 35
Introduction ............................................................................................................................................... 35
Processor options ....................................................................................................................................... 35
Installing a processor ........................................................................................................................ 35
Memory options ......................................................................................................................................... 41
Memory overview ............................................................................................................................ 41
DIMM support.................................................................................................................................. 41
Single-, dual-, and quad-rank DIMMs ................................................................................................. 41
DIMM identification .......................................................................................................................... 42
DIMM installation guidelines ............................................................................................................. 42
Memory cartridge population guidelines............................................................................................. 44
Memory subsystem architecture ......................................................................................................... 45
Hemisphere mode ............................................................................................................................ 45
Memory performance optimization .................................................................................................... 46
Memory RAS ................................................................................................................................... 47
Advanced ECC memory population guidelines .................................................................................... 48
Online Spare memory population guidelines ....................................................................................... 48
Mirrored Memory population guidelines ............................................................................................. 49
Installing memory ............................................................................................................................. 49
Hot-plug hard drive option .......................................................................................................................... 51
Redundant hot-plug power supply option ...................................................................................................... 53
Internal solid state drive expansion bay option .............................................................................................. 54
Expansion board options ............................................................................................................................ 55
Installing a non-hot-plug expansion board ........................................................................................... 55
Securing an expansion board for shipping ......................................................................................... 56
Installing the PCI Express I/O expansion board ................................................................................... 58
Installing the PCI-X/PCI Express I/O expansion board ......................................................................... 60
HP NC524SFP Dual Port 10GbE Module option ........................................................................................... 62
Battery-backed write cache module .............................................................................................................. 64
FBWC module and capacitor pack option .................................................................................................... 66
HP Trusted Platform Module option .............................................................................................................. 68
Retaining the recovery key/password................................................................................................. 69
Installing the Trusted Platform Module board ....................................................................................... 69
Enabling the Trusted Platform Module ................................................................................................. 70
Cabling ..................................................................................................................................... 72
DVD-ROM drive cabling ............................................................................................................................. 72
Server software and configuration utilities ...................................................................................... 73
Configuration tools ..................................................................................................................................... 73
SmartStart software .......................................................................................................................... 73
SmartStart Scripting Toolkit................................................................................................................ 73
HP ROM-Based Setup Utility ........................................................................................................................ 73
Using RBSU ..................................................................................................................................... 74
Auto-configuration process ................................................................................................................ 74
Boot options .................................................................................................................................... 75
BIOS Serial Console ......................................................................................................................... 75
Configuring lockstep memory ............................................................................................................ 75
Configuring online spare memory ...................................................................................................... 76
Configuring mirrored memory ........................................................................................................... 76
Array Configuration Utility .......................................................................................................................... 76
HP ProLiant Essentials Rapid Deployment Pack .............................................................................................. 77
Option ROM Configuration for Arrays.......................................................................................................... 77
Re-entering the server serial number and product ID ....................................................................................... 77
Management tools...................................................................................................................................... 78
Automatic Server Recovery ................................................................................................................ 78
ROMPaq utility................................................................................................................................. 78
System Online ROM flash component utility ........................................................................................ 79
Integrated Lights-Out 3 technology ..................................................................................................... 79
Erase Utility ..................................................................................................................................... 79
StorageWorks library and tape tools .................................................................................................. 80
HP Systems Insight Manager ............................................................................................................. 80
Management Agents ........................................................................................................................ 80
Redundant ROM support ................................................................................................................... 80
USB support .................................................................................................................................... 81
Diagnostic tools ......................................................................................................................................... 81
HP Insight Diagnostics ...................................................................................................................... 81
HP Insight Diagnostics survey functionality .......................................................................................... 81
Integrated Management Log .............................................................................................................. 82
Array Diagnostic Utility ..................................................................................................................... 82
Remote support and analysis tools ............................................................................................................... 82
HP Insight Remote Support software ................................................................................................... 82
Keeping the system current .......................................................................................................................... 83
Drivers ............................................................................................................................................ 83
Version control ................................................................................................................................. 83
ProLiant Support Packs ...................................................................................................................... 83
Operating system version support ...................................................................................................... 84
System Online ROM flash component utility ........................................................................................ 84
Change control and proactive notification .......................................................................................... 84
Care Pack ....................................................................................................................................... 84
Troubleshooting .......................................................................................................................... 85
Troubleshooting resources ........................................................................................................................... 85
Pre-diagnostic steps .................................................................................................................................... 85
Important safety information .............................................................................................................. 85
Symptom information ........................................................................................................................ 87
Prepare the server for diagnosis......................................................................................................... 88
Loose connections ...................................................................................................................................... 88
Service notifications.................................................................................................................................... 89
Troubleshooting flowcharts .......................................................................................................................... 89
Start diagnosis flowchart ................................................................................................................... 89
General diagnosis flowchart.............................................................................................................. 90
Server power-on problems flowchart .................................................................................................. 92
POST problems flowchart .................................................................................................................. 95
OS boot problems flowchart .............................................................................................................. 96
Server fault indications flowchart ....................................................................................................... 98
POST error messages and beep codes ....................................................................................................... 100
Battery replacement .................................................................................................................. 101
Regulatory compliance notices ................................................................................................... 102
Regulatory compliance identification numbers ............................................................................................. 102
Federal Communications Commission notice ............................................................................................... 102
FCC rating label ............................................................................................................................ 102
Class A equipment ......................................................................................................................... 102
Class B equipment.......................................................................................................................... 102
Declaration of conformity for products marked with the FCC logo, United States only...................................... 103
Modifications ........................................................................................................................................... 103
Cables .................................................................................................................................................... 103
Canadian notice (Avis Canadien) .............................................................................................................. 104
European Union regulatory notice .............................................................................................................. 104
Disposal of waste equipment by users in private households in the European Union ........................................ 105
Japanese notice ....................................................................................................................................... 105
BSMI notice ............................................................................................................................................. 105
Korean notice .......................................................................................................................................... 106
Chinese notice ......................................................................................................................................... 106
Laser compliance ..................................................................................................................................... 106
Battery replacement notice ........................................................................................................................ 106
Taiwan battery recycling notice ................................................................................................................. 107
Power cord statement for Japan ................................................................................................................. 107
Acoustics statement for Germany (Geräuschemission) .................................................................................. 107
Wireless devices ...................................................................................................................................... 108
Brazilian notices ............................................................................................................................ 108
Canadian notices ........................................................................................................................... 108
Japanese notices ............................................................................................................................ 108
Taiwan notices ............................................................................................................................... 109
Electrostatic discharge ............................................................................................................... 110
Preventing electrostatic discharge .............................................................................................................. 110
Grounding methods to prevent electrostatic discharge .................................................................................. 110
Specifications ........................................................................................................................... 111
Environmental specifications ...................................................................................................................... 111
Server specifications ................................................................................................................................. 111
HP ProLiant 1200 W power supply specifications........................................................................................ 112
Technical support ...................................................................................................................... 113
Before you contact HP .............................................................................................................................. 113
HP contact information .............................................................................................................................. 113
Customer Self Repair ................................................................................................................................ 113
Acronyms and abbreviations ...................................................................................................... 121
Index ....................................................................................................................................... 124
Component identification
Front panel components
Item
Description
1
Serial and PID tag
2
Optical drive
3
Systems Insight Display
4
USB connectors (2)
5
Video connector
6
Processor memory drawer
Component identification
7
Front panel LEDs and buttons
Item
Description
Status
1
UID button and LED
Blue—Activated
Blue (flashing)—Server being managed remotely
Off—Deactivated
2
Health LED
Green—Normal (system on)
Amber (flashing)—Internal system health degraded
Red (flashing)—Internal system health critical
Off—Normal (system off)
3
NIC 1 LED
Green—Linked to network
Green (flashing)—Linked with activity on the network
Off—No network connection
4
NIC 2 LED
Green—Linked to network
Green (flashing)—Linked with activity on the network
Off—No network connection
5
NIC 3 LED
Green—Linked to network
Green (flashing)—Linked with activity on the network
Off—No network connection
6
NIC 4 LED
Green—Linked to network
Green (flashing)—Linked with activity on the network
Off—No network connection
7
Power on/Standby button and
LED
Amber—System has AC power and is in standby mode.
Green—System has AC power and is powered on.
Off—System has no AC power.
Component identification
8
Systems Insight Display
The Systems Insight Display LEDs represent the server and component layout.
LED
Description
AMP status
Off—No protection
Green—Protection enabled
Amber—Memory failure occurred
Amber (flashing)—Memory configuration error
Health
Green—Normal (system on)
Amber (flashing)—Internal system health degraded
Red (flashing)—Internal system health critical
Off—Normal (system off)
Power cap
Green—System on or requesting poweron
Flashing amber—Poweron denied
Off—Standby
All other LEDs
Off—Normal
Amber—Failed or missing component
Component identification
9
Rear panel components
Item
Description
Item
Description
1
Power supply bay 4 (optional)
15
Expansion slot 2 (optional)
2
Power supply bay 3 (optional)
16
Expansion slot 3 (optional)
3
Power supply bay 2
17
Expansion slot 4 (optional)
4
Power supply bay 1
18
Expansion slot 5 (optional)
5
Keyboard connector
19
Expansion slot 6 (optional)
6
Video connector
20
PCIe2 x8 expansion slot 7
7
NIC 2 connector
21
PCIe2 x8 expansion slot 8
8
10Gb NIC adapter blank
22
PCIe2 x16 expansion slot 9
9
NIC 4 connector
23
PCIe2 x8 expansion slot 10
10
NIC 3 connector
24
PCIe2 x16 expansion slot 11
11
NIC 1 connector
25
USB connectors (2)
12
Serial connector
26
iLO 3 connector
13
Mouse connector
27
T-10/T-15 Torx screwdriver
14
Expansion slot 1 (optional)
—
—
For optional configuration of slots 1–6, see "I/O expansion board components (on page 16)."
Component identification
10
Rear panel LEDs and buttons
Item
Description
LED color
Status
1
iLO 3 NIC Activity LED
Green
On or flashing—Network activity
Off—No network activity
2
iLO 3 NIC Link LED
Green
On—Linked to network
Off—Not linked to network
3
NIC 2 Activity LED
Green
On or flashing—Network activity
Off—No network activity
4
NIC 2 Link LED
Green
On—Linked to network
Off—Not linked to network
5
NIC 4 Activity LED
Green
On or flashing—Network activity
Off—No network activity
6
NIC 4 Link LED
Green
On—Linked to network
Off—Not linked to network
7
NIC 3 Link LED
Green
On—Linked to network
Off—Not linked to network
8
NIC 3 Activity LED
Green
On or flashing—Network activity
Off—No network activity
9
NIC 1 Link LED
Green
On—Linked to network
Off—Not linked to network
10
NIC 1 Activity LED
Green
On or flashing—Network activity
Off—No network activity
Component identification
11
Power supply LED
Power LED
Status
Off
No AC power to power supply units. Check the AC power cord.
Off
AC is present. Standby output is on, output is disabled. Further
indicated by the front panel LED.
Off
Power supply failure (includes overvoltage and overtemperature) further
indicated by the Systems Insight Display LEDs.
Green
AC is present. Standby output is on, power supply DC output is on and
OK.
Component identification
12
System board components
Item
Description
1
Optional I/O expansion board connectors:
•
•
PCI-X/PCI Express I/O expansion board
PCI Express I/O expansion board
2
Slot 7 PCIe2 x4 (4, 2, 1)
3
Slot 8 PCIe2 x4 (4, 2, 1)
4
Slot 9 PCIe2 x8 (8, 4, 2, 1)
5
Slot 10 PCIe2 x4 (4, 2, 1)
6
Slot 11 PCIe2 x8 (8, 4, 2, 1)
7
SPI board connector
8
Internal USB connectors (2)
9
System maintenance switch
10
Optical drive connector
11
Video/USB connector
12
Solid state drive connector
13
Power button/UID connector
Component identification
13
System maintenance switch
The system maintenance switch (SW1) is an eight-position switch that is used for system configuration. The
default position for all eight positions is Off.
Position
Description
Function
S1
iLO 3 Security
Off = iLO 3 security is enabled.
On = iLO 3 security is disabled.
S2
Configuration
lock
Off = System configuration can
be changed.
On = System configuration is
locked.
S3
Reserved
Reserved
S4
Reserved
Reserved
S5
Password
protection
override
Off = No function
S6
On = Clears power-on password
and administrator password
Invalidate
configuration
Off = Normal
S7
Reserved
Reserved
S8
Reserved
Reserved
On = Clears NVRAM
Component identification
14
SPI board components
Item
Description
1
Mini SAS connectors (2)
2
SAS cache connector
3
TPM connector
4
Fan data connector
5
RMII connector
6
SD card slot
7
Battery
8
10Gb NIC connector
9
NIC cache connector
10
NIC 3 connector
11
NIC 1 connector
12
Video connector
13
Keyboard connector
14
USB connectors (2)
15
iLO 3 connector
16
Mouse connector
17
Serial connector
18
NIC 2 connector
19
NIC 4 connector
Component identification
15
I/O expansion board components
•
PCI-X/PCI Express I/O expansion board
Item
Description
1
Slot 6 PCIe2 x16 (16, 8, 4, 2, 1)
2
Slot 4 PCIe2 x4 (4, 2, 1)
3
Slot 3 PCIe2 x16 (16, 8, 4, 2, 1)
4
Slot 2 PCI-X
5
Slot 1 PCI-X
•
PCI Express I/O expansion board
Item
Description
1
Slot 6 PCIe2 x8 (8, 4, 2, 1)
2
Slot 5 PCIe2 x8 (8, 4, 2, 1)
3
Slot 4 PCIe2 x4 (4, 2, 1)
4
Slot 3 PCIe2 x8 (8, 4, 2, 1)
5
Slot 2 PCIe2 x8 (8, 4, 2, 1)
6
Slot 1 PCIe1 x4 (4, 2, 1)
Component identification
16
Processors and memory cartridges
The processor memory drawer contains 4 processor sockets and 8 memory cartridges.
For DIMM numbering, see "DIMM slot locations (on page 18)."
For installation guidelines, see "Memory options (on page 41)."
Component identification
17
DIMM slot locations
Each memory cartridge contains 8 DIMM slots. The lockstep banks are identified by the letters A through
D.
For installation guidelines, see "Memory options (on page 41)."
Device numbers
Component identification
18
Hard drive LEDs
Item
Description
1
Fault/UID LED (amber/blue)
2
Online LED (green)
Hard drive LED combinations
Online/activity
LED (green)
Fault/UID LED
(amber/blue)
Interpretation
On, off, or
flashing
Alternating amber
and blue
The drive has failed, or a predictive failure alert has been
received for this drive; it also has been selected by a
management application.
On, off, or
flashing
Steadily blue
The drive is operating normally, and it has been selected by a
management application.
On
Amber, flashing
regularly (1 Hz)
A predictive failure alert has been received for this drive.
Replace the drive as soon as possible.
On
Off
The drive is online, but it is not active currently.
Flashing
regularly (1 Hz)
Amber, flashing
regularly (1 Hz)
Do not remove the drive. Removing a drive may terminate the
current operation and cause data loss.
The drive is part of an array that is undergoing capacity
expansion or stripe migration, but a predictive failure alert has
been received for this drive. To minimize the risk of data loss,
do not replace the drive until the expansion or migration is
complete.
Flashing
regularly (1 Hz)
Off
Do not remove the drive. Removing a drive may terminate the
current operation and cause data loss.
The drive is rebuilding, or it is part of an array that is
undergoing capacity expansion or stripe migration.
Flashing
irregularly
Amber, flashing
regularly (1 Hz)
The drive is active, but a predictive failure alert has been
received for this drive. Replace the drive as soon as possible.
Component identification
19
Online/activity
LED (green)
Fault/UID LED
(amber/blue)
Interpretation
Flashing
irregularly
Off
The drive is active, and it is operating normally.
Off
Steadily amber
A critical fault condition has been identified for this drive, and
the controller has placed it offline. Replace the drive as soon
as possible.
Off
Amber, flashing
regularly (1 Hz)
A predictive failure alert has been received for this drive.
Replace the drive as soon as possible.
Off
Off
The drive is offline, a spare, or not configured as part of an
array.
Battery pack LEDs
Item ID
Color
Description
1
Green
System Power LED. This LED glows steadily when the
system is powered up and 12 V system power is
available. This power supply is used to maintain the
battery charge and provide supplementary power to the
cache microcontroller.
2
Green
Auxiliary Power LED. This LED glows steadily when 3.3V
auxiliary voltage is detected. The auxiliary voltage is
used to preserve BBWC data and is available any time
that the system power cords are connected to a power
supply.
3
Amber
Battery Health LED. To interpret the illumination patterns
of this LED, see the following table.
4
Green
BBWC Status LED. To interpret the illumination patterns
of this LED, see the following table.
Component identification
20
LED3 pattern
LED4 pattern
Interpretation
—
One blink every
two seconds
The system is powered down, and the cache contains data that has
not yet been written to the drives. Restore system power as soon as
possible to prevent data loss.
Data preservation time is extended any time that 3.3 V auxiliary
power is available, as indicated by LED 2. In the absence of
auxiliary power, battery power alone preserves the data. A fullycharged battery can normally preserve data for at least two days.
The battery lifetime also depends on the cache module size. For
further information, refer to the controller QuickSpecs on the HP
website (http://www.hp.com).
—
Double blink,
then pause
The cache microcontroller is waiting for the host controller to
communicate.
—
One blink per
second
The battery pack is below the minimum charge level and is being
charged. Features that require a battery (such as write cache,
capacity expansion, stripe size migration, and RAID migration) are
temporarily unavailable until charging is complete. The recharge
process takes between 15 minutes and two hours, depending on
the initial capacity of the battery.
—
Steady glow
The battery pack is fully charged, and posted write data is stored
in the cache.
—
Off
The battery pack is fully charged, and there is no posted write data
in the cache.
One blink per
second
One blink per
second
An alternating green and amber blink pattern indicates that the
cache microcontroller is executing from within its boot loader and
receiving new flash code from the host controller.
Steady glow
—
There is a short circuit across the battery terminals or within the
battery pack. BBWC features are disabled until the battery pack is
replaced. The life expectancy of a battery pack is typically more
than three years.
One blink per
second
—
There is an open circuit across the battery terminals or within the
battery pack. BBWC features are disabled until the battery pack is
replaced. The life expectancy of a battery pack is typically more
than three years.
Component identification
21
FBWC module LEDs
The FBWC module has two single-color LEDs (green and amber). The LEDs are duplicated on the reverse
side of the cache module to facilitate status viewing.
Green LED
Amber LED
Interpretation
Off
On
A backup is in progress.
Flashing (1 Hz)
On
A restore is in progress.
Flashing (1 Hz)
Off
The capacitor pack is charging.
On
Off
The capacitor pack has completed charging.
Flashing (2 Hz)
Flashing (2 Hz)
One of the following conditions exists:
Alternating with
amber LED
Alternating with
green LED
•
•
On
On
The flash code image failed to load.
Off
Off
The flash code is corrupt.
The charging process has timed out.
The capacitor pack is not connected.
Component identification
22
Fan locations
Power supply backplane components
Component identification
23
Item
Description
1
Graphics card power connector
2
Graphics card power connector
3
Graphics card power connector
4
SAS backplane power connector
5
Fan power connector
Component identification
24
Operations
Power up the server
To power up the server, press the Power On/Standby button.
Power down the server
WARNING: To reduce the risk of personal injury, electric shock, or damage to the
equipment, remove the power cord to remove power from the server. The front panel Power
On/Standby button does not completely shut off system power. Portions of the power supply
and some internal circuitry remain active until AC power is removed.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.
1.
Back up the server data.
2.
Shut down the operating system as directed by the operating system documentation.
NOTE: If the operating system automatically places the server in Standby mode, omit the next
step.
3.
Press the Power On/Standby button to place the server in Standby mode. When the server activates
Standby power mode, the system power LED changes to amber.
IMPORTANT: Pressing the UID button illuminates the blue UID LEDs on the front and rear
panels. In a rack environment, this feature facilitates locating a server when moving between
the front and rear of the rack.
4.
Disconnect the power cords.
The system is now without power.
Extend the server from the rack
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack
is adequately stabilized before extending a component from the rack.
WARNING: To reduce the risk of personal injury, be careful when pressing the server railrelease latches and sliding the server into the rack. The sliding rails could pinch your fingers.
To extend the server from the rack:
1.
Pull down the quick-release levers on each side of the server to release the server from the rack.
Operations
25
2.
Extend the server on the rack rails until the server rail-release latches engage.
3.
After performing the installation or maintenance procedure, slide the server into the rack by pressing
the server rail-release latches.
Remove the access panel
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or
removed. Operating the server in this manner results in improper airflow and improper
cooling that can lead to thermal damage.
To remove the component:
1.
Power down the server (on page 25).
Operations
26
2.
Extend the server from the rack (on page 25).
3.
Open the locking latch, slide the access panel to the rear of the chassis, and remove the access
panel.
If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch.
Remove the processor memory drawer
1.
Power down the server (on page 25).
2.
Release the latches on the release lever.
3.
Lower the handle, and then extend the processor memory drawer from the server until the release
latches catch.
WARNING: The processor memory drawer weighs more than 11.3 kg (25.0 lb). Use extra
caution when removing and replacing the processor memory drawer.
Operations
27
4.
Firmly holding the processor memory drawer, press the release buttons and then remove the drawer
from the server.
Access the Systems Insight Display
To access the Systems Insight Display:
1.
Press and release the panel.
2.
After the display fully ejects, rotate the display downward to view the LEDs.
Remove the SPI board
To remove the component:
1.
Power down the server (on page 25).
2.
Extend the server from the rack (on page 25).
Operations
28
3.
Remove the access panel (on page 26).
4.
Disconnect all cables from the SPI board.
IMPORTANT: If replacing the SPI board or clearing NVRAM, you must re-enter the server
serial number through RBSU ("Re-entering the server serial number and product ID" on page
77).
5.
Raise the levers, and lift the SPI board from the server.
6.
Remove all components from the failed SPI board.
To replace the component, reverse the removal procedure.
Operations
29
Setup
Optional installation services
Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and
running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you
integrate both hardware and software support into a single package. A number of service level options
are available to meet your needs.
HP Care Pack Services offer upgraded service levels to expand your standard product warranty with easyto-buy, easy-to-use support packages that help you make the most of your server investments. Some of the
Care Pack services are:
•
•
•
•
Hardware support
o
6-Hour Call-to-Repair
o
4-Hour 24x7 Same Day
o
4-Hour Same Business Day
Software support
o
Microsoft®
o
Linux
o
HP ProLiant Essentials (HP SIM and RDP)
o
VMWare
Integrated hardware and software support
o
Critical Service
o
Proactive 24
o
Support Plus
o
Support Plus 24
Startup and implementation services for both hardware and software
For more information on HP Care Pack Services, see the HP website
(http://www.hp.com/services/carepack).
Rack planning resources
The rack resource kit ships with all HP branded or Compaq branded 9000, 10000, and H9 series racks.
For more information on the content of each resource, refer to the rack resource kit documentation.
If you intend to deploy and configure multiple servers in a single rack, refer to the white paper on highdensity deployment at the HP website (http://www.hp.com/products/servers/platforms).
Setup 30
Optimum environment
When installing the server, select a location that meets the environmental standards described in this
section.
Space and airflow requirements
To allow for servicing and adequate airflow, observe the following space and airflow requirements when
deciding where to install a rack:
•
Leave a minimum clearance of 63.5 cm (25 in) in front of the rack.
•
Leave a minimum clearance of 76.2 cm (30 in) behind the rack.
•
Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another
rack or row of racks.
HP servers draw in cool air through the front door and expel warm air through the rear door. Therefore,
the front and rear rack doors must be adequately ventilated to allow ambient room air to enter the
cabinet, and the rear door must be adequately ventilated to allow the warm air to escape from the
cabinet.
CAUTION: To prevent improper cooling and damage to the equipment, do not block the
ventilation openings.
When vertical space in the rack is not filled by a server or rack component, the gaps between the
components cause changes in airflow through the rack and across the servers. Cover all gaps with
blanking panels to maintain proper airflow.
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This
arrangement ensures proper airflow. Using a rack without blanking panels results in improper
cooling that can lead to thermal damage.
The 9000 and 10000 Series Racks provide proper server cooling from flow-through perforations in the
front and rear doors that provide 64 percent open area for ventilation.
CAUTION: When using a Compaq branded 7000 Series rack, you must install the high
airflow rack door insert [P/N 327281-B21 (42U) or P/N 157847-B21 (22U)] to provide
proper front-to-back airflow and cooling.
CAUTION: If a third-party rack is used, observe the following additional requirements to
ensure adequate airflow and to prevent damage to the equipment:
• Front and rear doors—If the 42U rack includes closing front and rear doors, you must
allow 5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit
adequate airflow (equivalent to the required 64 percent open area for ventilation).
• Side—The clearance between the installed rack component and the side panels of the rack
must be a minimum of 7 cm (2.75 in).
Temperature requirements
To ensure continued safe and reliable equipment operation, install or position the system in a wellventilated, climate-controlled environment.
Setup 31
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C
(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
• Do not permit optional equipment to impede airflow around the server or to increase the
internal rack temperature beyond the maximum allowable limits.
• Do not exceed the manufacturer’s TMRA.
Power requirements
Installation of this equipment must comply with local and regional electrical regulations governing the
installation of information technology equipment by licensed electricians. This equipment is designed to
operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992
(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on
options, refer to the product rating label or the user documentation supplied with that option.
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not
overload the AC supply branch circuit that provides power to the rack. Consult the electrical
authority having jurisdiction over wiring and installation requirements of your facility.
CAUTION: Protect the server from power fluctuations and temporary interruptions with a
regulating uninterruptible power supply (UPS). This device protects the hardware from
damage caused by power surges and voltage spikes and keeps the system in operation
during a power failure.
When installing more than one server, you may need to use additional power distribution devices to
safely provide power to all devices. Observe the following guidelines:
•
Balance the server power load between available AC supply branch circuits.
•
Do not allow the overall system AC current load to exceed 80 percent of the branch circuit AC
current rating.
•
Do not use common power outlet strips for this equipment.
•
Provide a separate electrical circuit for the server.
Electrical grounding requirements
The server must be grounded properly for proper operation and safety. In the United States, you must
install the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250,
as well as any local and regional building codes. In Canada, you must install the equipment in
accordance with Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other
countries, you must install the equipment in accordance with any regional or national electrical wiring
codes, such as the International Electrotechnical Commission (IEC) Code 364, parts 1 through 7.
Furthermore, you must be sure that all power distribution devices used in the installation, such as branch
wiring and receptacles, are listed or certified grounding-type devices.
Because of the high ground-leakage currents associated with multiple servers connected to the same
power source, HP recommends the use of a PDU that is either permanently wired to the building’s branch
circuit or includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs
or those complying with IEC 60309 are considered suitable for this purpose. Using common power outlet
strips for the server is not recommended.
Setup 32
Rack warnings
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
• The leveling jacks are extended to the floor.
• The full weight of the rack rests on the leveling jacks.
• The stabilizing feet are attached to the rack if it is a single-rack installation.
• The racks are coupled together in multiple-rack installations.
• Only one component is extended at a time. A rack may become unstable if more than one
component is extended for any reason.
WARNING: To reduce the risk of personal injury or equipment damage when unloading a
rack:
• At least two people are needed to safely unload the rack from the pallet. An empty 42U
rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and
may become unstable when being moved on its casters.
• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always
handle the rack from both sides.
Identifying the contents of the server shipping carton
Unpack the server shipping carton and locate the materials and documentation necessary for installing the
server. All the rack mounting hardware necessary for installing the server into the rack is included with the
rack or the server.
The contents of the server shipping carton include:
•
Server
•
Power cord
•
Hardware documentation, Documentation CD, and software products
•
Rack-mounting hardware
In addition to the supplied items, you may need:
•
Operating system or application software
•
Hardware options
Installing hardware options
Install any hardware options before initializing the server. For options installation information, refer to the
option documentation. For server-specific information, refer to "Hardware options installation (on page
35)."
Installing the server into the rack
Refer to the installation instructions that ship with the rack kit to install the server into the rack.
Setup 33
Powering up and configuring the server
To power up the server, press the Power On/Standby button.
While the server boots, RBSU and the ORCA utility are automatically configured to prepare the server for
operating system installation.
To configure these utilities manually:
•
Press the F8 key when prompted during the array controller initialization to configure the array
controller using ORCA.
•
Press the F9 key when prompted during the boot process to change the server settings using RBSU.
The system is set up by default for the English language.
For more information on the automatic configuration, refer to the HP ROM-Based Setup Utility User Guide
located on the Documentation CD.
Installing the operating system
To operate properly, the server must have a supported operating system. For the latest information on
supported operating systems, refer to the HP website (http://www.hp.com/go/supportos).
Two methods are available to install an operating system on the server:
•
SmartStart assisted installation—Insert the SmartStart CD into the CD-ROM drive and reboot the
server.
•
Manual installation—Insert the operating system CD into the CD-ROM drive and reboot the server.
This process may require you to obtain additional drivers from the HP website
(http://www.hp.com/support).
Follow the on-screen instructions to begin the installation process.
For information on using these installation paths, refer to the SmartStart installation poster in the HP
ProLiant Essentials Foundation Pack, included with the server.
Registering the server
To register the server, refer to the HP Registration website (http://register.hp.com).
Setup 34
Hardware options installation
Introduction
If more than one option is being installed, read the installation instructions for all the hardware options
and identify similar steps to streamline the installation process.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server before
beginning any installation procedure. Improper grounding can cause electrostatic discharge.
Review "Electrostatic Discharge (on page 110)" before installing hardware options into the server.
Processor options
The server supports up to four processors. Observe the following processor installation guidelines:
•
Processor socket 1 must be populated at all times so that the server functions properly.
•
Processors must be installed in the following order: processor 1, processor 2, processor 3, and
processor 4.
•
When either optional I/O expansion board in installed in a two-processor configuration, the second
processor must be installed in socket 3.
Installing a processor
The processors and memory are stored in a module at the front of the server. Access to the processor
memory module is provided through the front panel, eliminating the need to extend the server from the
rack to install new or replace existing processors or upgrade the memory.
WARNING: Use caution when installing the processor memory module or removing the
processor memory module. The processor memory module is very heavy when fully
populated.
CAUTION: To help avoid damage to the processor and system board, do not install the
processor without using the processor installation tool.
CAUTION: To prevent possible server malfunction and damage to the equipment,
multiprocessor configurations must contain processors with the same part number.
IMPORTANT: If installing a processor with a faster speed, update the system ROM before
installing the processor.
Hardware options installation
35
IMPORTANT: When either optional I/O expansion board is installed in a two-processor
configuration, the second processor must be installed in socket 3 or 4. To install a processor,
see the server user guide.
To install the component:
1.
Update the system ROM.
Locate and download the latest ROM version from the HP website (http://www.hp.com/support).
Follow the instructions on the website to update the system ROM.
2.
Power down the server (on page 25).
3.
Remove the processor memory drawer (on page 27).
CAUTION: To prevent damage to the processor memory drawer cover, be sure the handle of
the processor memory drawer is fully open before removing the cover.
4.
Remove the processor memory drawer cover.
Hardware options installation
36
5.
Open the heatsink retaining bracket.
6.
Open the processor retaining latch and the processor socket retaining bracket.
7.
Remove the processor socket protective cover.
IMPORTANT: Be sure the processor remains inside the processor installation tool.
Hardware options installation
37
8.
If the processor has separated from the installation tool, carefully re-insert the processor in the tool.
9.
Align the processor installation tool with the socket and install the processor.
Hardware options installation
38
10.
Press down firmly until the processor installation tool clicks and separates from the processor, and
then remove the processor installation tool.
11.
Close the processor socket retaining bracket and the processor retaining latch.
Hardware options installation
39
12.
Remove the heatsink protective cover.
13.
Install the heatsink.
14.
Close and lock the heatsink retaining bracket.
15.
Install the processor memory drawer cover.
16.
Install the processor memory drawer.
17.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
Hardware options installation
40
Memory options
This server contains eight memory cartridge connectors in the processor memory drawer. Each memory
cartridge can contain eight DIMMs, for a total of 64 DIMMs.
The server supports the following DIMM speeds:
•
Single- and dual-rank PC3-10600 (DDR-1333) DIMMs operating at 1066 MHz
•
Quad-rank PC3-8500 (DDR-1066) DIMMs operating at 1066 MHz
Depending on the processor model, the memory clock speed may be reduced to 1066 or 800 MHz.
Memory overview
The HP ProLiant DL580 G7 Server uses the next generation Intel® Xeon™ 7500-series processor. This
processor’s architecture departs radically from previous Intel Xeon front-side-bus-based architectures. In
front-side bus architectures, the memory controller was incorporated in the north bridge, which produced
a common sharepoint for memory accesses for all processors. Similar to the dual-socket Intel Xeon 5500
processor, the Intel Xeon 7500 processor employs a NUMA architecture incorporating QPI links for pointto-point connectivity between processors and provides dedicated local memory for each processor.
However, instead of directly connecting DIMMs to the processor, for the sake of higher memory
expansion, the Intel Xeon 7500 processor includes a memory buffer for each SMI in its memory
subsystem. With this Intel Xeon 7500 architecture, two memory controllers and four scalable memory
interfaces are embedded in each processor. SMI links run at a higher bit rate. There are four SMIs per
processor, and each SMI link supports two DDR buses through a memory buffer. A four-socket system
provides 6.4 times the memory bandwidth as compared to the previous generation 4S Xeon processors.
DIMM support
The server supports the following DIMMs:
•
Single- and dual-rank PC3-10600 (DDR3-1333) DIMMs operating at 1066 MT/s
While single-rank DIMMs are supported, HP recommends dual-rank and quad-rank DIMMs since
they provide significant memory throughput and better memory protection (Online Spare memory
mode) over single-rank DIMMs.
•
Quad-rank PC3-8500 (DDR3-1066) DIMMs operating at 1066 MT/s
Single-, dual-, and quad-rank DIMMs
To understand and configure memory protection modes properly, an understanding of single-, dual-, and
quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.
A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the
memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only
one rank accessible at a time. A quad-rank DIMM is effectively two dual-rank DIMMs on the same
module. Only one rank is accessible at a time. The server memory control subsystem selects the proper
rank within the DIMM when writing to or reading from the DIMM.
Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For
example, if current DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4GB and a quad-rank DIMM would be 8-GB.
Hardware options installation
41
Although only one data rank is accessed at any given time for each DIMM, optimized command and
address pipelining via various interleaving schemes enables the Intel® Xeon™ 7500-series processor
architecture to benefit from dual-rank and quad-rank DIMMs. A dual-rank DIMM performs significantly
better than its single-rank counterpart. A quad-rank DIMM provides further performance improvement even
at the same DIMM capacity.
DIMM identification
To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and
table.
Item
Description
Definition
1
Size
—
2
Rank
1R = Single-rank
2R = Dual-rank
4R = Quad-rank
3
Data width
x4 = 4-bit
x8 = 8-bit
4
Memory speed
10600 = 1333-MHz
8500 = 1066-MHz
5
DIMM type
R = RDIMM (registered)
For the latest supported memory information, see the QuickSpecs on the HP website
(http://www.hp.com).
DIMM installation guidelines
This server supports two memory cartridges per processor. Each memory cartridge can support up to eight
DIMMs. Eight memory cartridges provide a total of 64 DIMMs per system. When installing DIMMs in the
memory cartridge ("Memory options" on page 41), observe the following minimum guidelines:
•
The minimum configuration is two DIMMs per cartridge. Running in Lockstep mode, such DIMM pairs
offer larger memory protection to provide increased memory fault resiliency.
Hardware options installation
42
•
DIMMs must be installed in pairs with identical characteristics. When possible, for configuration
simplicity, HP recommends using DIMMs with identical part numbers throughout the system.
•
DIMM pairs must be populated in sequence by letter designation. Install DIMM pair (1A, 8A) first,
followed by DIMM pair (3B, 6B), DIMM pair (2C, 7C) and DIMM pair (4D, 5D).
The illustration below represents each processor/cartridge population. This example shows two
cartridges installed behind processor 1 with the associated bus connections and DIMM locations.
•
To achieve maximum performance, balance DIMM pairs by letter groupings across all memory
cartridges so that the (1A, 8A) pair is installed in all memory cartridges first, followed by the B-pair,
C-pair, and D-pair.
•
When installing mixed rank DIMMs in any cartridge, DIMMs with the highest number of ranks must
be installed in the white DIMM connector locations. This guarantees proper electrical signaling on
the DDR3 channel since DIMMs with higher rank counts present larger electrical loading on the
DDR3 channel and must be populated at the end point of the channel. For more information, see the
illustration below.
CAUTION: Failure to follow these guidelines may result in the inability to recognize memory,
memory errors, or reduced memory performance.
Examples:
o
If the configuration is four quad-rank 8-GB DIMMs and four dual-rank 8-GB DIMMs, the quadrank DIMMs must be installed in the white DIMM connectors 1A/8A and 3B/6B. The dual-rank
DIMMs must be installed in the black DIMM connectors 2C/7C and 4D/5D. See the figure
below, which illustrates how the processor, memory cartridge, and DIMMs are connected
electronically.
Hardware options installation
43
o
•
If the configuration is two quad-rank 8-GB DIMMs and six dual-rank 8-GB DIMMs in a single
cartridge configuration, the quad-rank DIMMs can be located in either of the corresponding
white DIMM pairs (1A/8A or 3B/6B) as long as they are installed at the end point of the DDR3
channel.
AMP modes Advanced ECC, Online Spare, and Mirrored Memory have further requirements
beyond the ones listed here. For additional memory configuration requirements, see the
corresponding AMP sections:
o
Advanced ECC memory population guidelines (on page 48)
o
Online Spare memory population guidelines (on page 48)
o
Mirrored Memory population guidelines (on page 49)
Memory cartridge population guidelines
This server contains eight memory cartridge slots in the processor memory drawer.
Observe the following guidelines:
•
Populate memory cartridge slots for a processor only if the corresponding processor is installed:
o
Processor 1 connects to the memory cartridge in slots 1 and 2.
o
Processor 2 connects to the memory cartridge in slots 3 and 4.
o
Processor 3 connects to the memory cartridge in slots 5 and 6.
o
Processor 4 connects to the memory cartridge in slots 7 and 8.
•
Memory is only accessible to the system if the associated processor is installed. Do not install
memory cartridges in cartridge slots without the corresponding processor installed.
•
The minimum memory cartridge population is one per processor. For best performance, two memory
cartridges per processor are recommended.
•
Due to higher memory access latencies, HP does not recommend installing a processor without its
corresponding memory cartridges.
•
To maximize performance in multi-processor configurations, distribute the total memory capacity
evenly across all processors.
Hardware options installation
44
Memory subsystem architecture
The Intel® Xeon™ 7500 processor memory architecture is designed to take advantage of multiple stages
of memory interleaving to reduce latency and increase bandwidth.
Each Intel Xeon 7500 processor contains two memory controllers as shown in the illustration below. Each
memory controller has two SMI buses operating in Lockstep mode. Each SMI bus connects to a memory
buffer. The buffer converts SMI to DDR3 and expands the memory capacity of the system. Each buffer has
two DDR3 channels and can support up to four DIMMs for a total of eight DIMMs per cartridge.
•
Memory speed is not affected by number of DIMMs or ranks. All DIMMs run at the highest possible
speed for a given processor.
•
DDR3 memory speed is a function of the QPI bus speed supported by the processor:
•
o
Processors with a QPI speed of 6.4 GT/s run memory at 1066 MT/s.
o
Processors with a QPI speed of 5.6 GT/s run memory at 978 MT/s.
o
Processors with a QPI speed of 4.8 GT/s run memory at 800 MT/s.
Successive cache lines are interleaved between the DIMMs and the Lockstep SMI channels of the two
memory controllers in the processor such that adjacent cache lines reside on different memory
controllers, SMIs, DIMMs, and DIMM ranks for better performance. To take advantage of this
feature, DIMMs should be populated evenly between all SMI channels. If an SMI channel pair has
more DIMMs than others, the extra memory on that SMI channel pair does not benefit from the
interleaving mechanism across memory controllers.
Hemisphere mode
The Intel® Xeon™ 7500-series processor architecture incorporates Hemisphere mode, a high-performance
interleaving technology. Hemisphere mode combines the tracking resources of both memory controllers
within each processor for a more aggressive cache line pipelining.
Hemisphere mode is enabled when processors in the system have identical DIMM population behind both
of their memory controllers. That is to say, all populated memory cartridges are populated the same way.
However, there may be different DIMM pairs within each memory cartridge.
•
Hemisphere mode is controlled via an RBSU option, enabling the user to select either automatic
(default) or disable.
Hardware options installation
45
•
In automatic mode, the BIOS enables Hemisphere mode if the system memory configuration is
compatible with Hemisphere mode.
•
Hemisphere mode should produce the best overall performance for a variety of applications.
However, Hemisphere mode can be disabled if it produces lower performance for a particular
application.
•
To enable each processor to enter Hemisphere mode, both memory cartridges must be installed and
populated with equal memory capacities based on the DIMM installation guidelines (on page 42).
•
Greater performance is obtained when all cartridges are populated with either four or eight dual- or
quad-rank DIMMs.
•
Mirrored Memory mode is not supported when Hemisphere mode is enabled.
The following illustration shows examples of Hemisphere mode and non-Hemisphere mode populations.
The two non-Hemisphere examples show the following:
•
Each memory controller must have a cartridge installed.
•
The DIMM configurations of each cartridge connected to controller 1 and 2 of a processor must be
identical.
Example 4 is a Hemisphere mode configuration as the two cartridges connected to each processor are
configured identically, even though cartridges 1 and 2 are not identical to cartridges 3 and 4.
Memory performance optimization
The HP ProLiant DL580 G7 Server supports 64 DIMMs across four multi-core processors. While there are
many DIMM population configurations that can support any total memory size, optimal performance is
achieved when populated DIMMs can take advantage of the Intel® Xeon™ 7500-series processor
architecture.
Hardware options installation
46
To achieve the best performance for a given memory processor configuration, observe the following
guidelines:
•
The largest contributor to maximum memory bandwidth performance is to use both memory
controllers inside the processor. To achieve maximum memory bandwidth performance, populate
both memory cartridges for each installed processor.
•
The second largest contributor to performance is to populate each DDR3 channel in each memory
cartridge. To achieve this, the minimum DIMM count per cartridge is four DIMMs installed in DIMM
pair locations A and B.
•
The next largest contributor to performance is the number of ranks per DIMM. Dual-rank DIMMs
perform significantly better than single-rank DIMMs. Quad-rank DIMMs offer a further performance
boost.
•
The best performance is obtained when all installed processors are enabled for Hemisphere mode.
Hemisphere mode is optimum when four or eight DIMMs are installed per cartridge. Hemisphere
mode can be achieved with two or six DIMMs per cartridge (2 cartridges per processor), but this
configuration is not optimal for Hemisphere mode.
•
Maximum throughput is achieved when all memory cartridges are fully populated with the maximum
number of eight quad-rank DIMMs per cartridge.
Plan the memory configurations using identical DIMMs to achieve the memory size target, taking into
account that 32- and 64-DIMM count configurations result in the highest performance. Using a fourprocessor configuration as an example, do the following:
•
If the initial memory target is 64 GB, populate a four-processor system with eight cartridges of four 2GB DIMMs each for a total of 32 DIMMs. The maximum expansion target is 128 GB with 64 x 2-GB
DIMMs.
•
For 4-GB DIMMs, the initial memory target is 128-GB using 32 DIMMs. The maximum expansion
target is 256 GB with 64 DIMMs.
•
For 8-GB DIMMs, the initial memory target is 256-GB using 32 DIMMs. The maximum expansion
target is 512 GB with 64 DIMMs.
•
The maximum system memory capability is achieved with an initial memory target of 512 GB with
32 x 16-GB DIMMs and 1 TB with 64 x 16-GB DIMMs.
Memory RAS
The server supports the following AMP modes:
•
Advanced ECC memory mode provides the greatest memory capacity for a given DIMM size and
provides x4 and x8 SDDC. This mode is the default option for this server. For more information, see
"Advanced ECC memory population guidelines (on page 48)."
•
Online Spare memory mode provides protection against persistent DRAM failure. Rank-sparing is
more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory protection.
For more information, see "Online Spare memory population guidelines (on page 48)."
•
Mirrored Memory mode provides the maximum protection against failed DIMMs. Uncorrectable
errors in the DIMMs of one memory cartridge are corrected by the DIMMs in the mirrored cartridge.
The two memory controllers of each processor form a mirrored pair using two memory cartridges.
For more information, see "Mirrored Memory population guidelines (on page 49)."
Hardware options installation
47
AMP modes are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM
configuration, the server boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup
Utility (on page 73)."
For the latest memory configuration information, see the QuickSpecs on the HP website
(http://www.hp.com/go/ProLiant).
Advanced ECC memory population guidelines
Advanced ECC memory is the default memory protection mode for the server. Up to 1-TB of active
memory using 16-GB DIMMs is supported in this AMP mode.
Advanced ECC can correct single-bit and multi-bit memory errors on a single x8 or two adjacent x4
DRAM devices.
The server provides notification when correctable error events have exceeded a pre-defined threshold
rate. When uncorrectable errors are detected using Advanced ECC, the server notifies the user and shuts
down the operating system.
Online Spare memory population guidelines
Online spare memory provides protection against persistent DRAM failure. It monitors DIMMs for
excessive correctable errors and copies the content of an unhealthy rank to an available spare rank in
advance of multi-bit or persistent single-bit failures that may result in uncorrectable faults. Rank-sparing is
more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory protection.
When Online Spare memory is enabled, the first ranks of DIMM pair, 1A/8A, are set aside as the
sparing ranks. Therefore, the available memory is reduced by the size of the first ranks of DIMM pair
1A/8A.
If a DIMM rank on either of the SMI buses exceeds its correctable ECC threshold, then the contents of the
failing DIMM ranks are copied to the spare DIMM ranks. Once the copy is complete, all memory
accesses to the previous failing DIMM ranks go to the spare DIMM ranks.
No performance penalty occurs for rank-sparing, other than the time it takes to copy the data from the
failing rank to the spare rank upon an error condition.
The following population rules apply to each memory cartridge. Begin with the DIMM installation
guidelines (on page 42) with these additional constraints:
•
All installed processors must contain a valid sparing configuration.
•
If installing mixed rank DIMMs in a cartridge, follow the mixed rank installation rules of the DIMM
installation guidelines (on page 42).
•
Rank sparing requires that the spare ranks of the DIMM pair 1A/8A be at least as large as any
other DIMM rank on the DDR3 channels of the cartridge. To determine the size of a single rank in a
DIMM, divide the total DIMM size by the number of ranks.
For example, the rank size of a dual-rank 2-GB DIMM is 1 GB and the rank size of a dual-rank 4-GB
DIMM is 2 GB. Therefore, it is possible to support rank sparing with mixed DIMM pair sizes in the
cartridge if the 1A/8A pair is populated with the 4-GB DIMMs and the other pairs are populated
with either the identical 4-GB or 2-GB DIMMs (pairs C and D are not required to be populated). In
this case, the 2-GB rank size of the 4-GB DIMMs in the 1A/8A pair is equal to or greater than the
rank size of the other installed DIMMs.
Hardware options installation
48
However, the server cannot support DIMM sparing in this example if the 2-GB DIMMs are populated
in the 1A/8A pair locations and the 4-GB DIMMs are populated in any of the remaining DIMM pair
locations. This is because it violates the rule requiring that the spare rank size of DIMM pair 1A/8A
(1 GB) be equal to or larger than the single rank size of the other DIMM pair locations, since the
rank size of a 4-GB DIMM in pairs B, C, or D would be larger (2 GB) than the spare rank size of the
2-GB DIMM pair in 1A/8A (1 GB).
Mirrored Memory population guidelines
Errors that are not corrected by ECC or SDDC cannot be corrected by Online Spare memory. By
providing added redundancy in the memory sub-system, Mirrored Memory provides the greatest
protection against memory failure beyond ECC, SDDC, and Online Spare memory.
In Mirrored Memory mode, each Lockstep DIMM pair of a memory controller (of a memory cartridge
connected to a processor) has a mirrored DIMM pair on the other memory cartridge of the same
processor.
Upon detecting an uncorrectable memory error from a DIMM pair of a memory cartridge, the processor
avoids a system crash by reading the mirrored DIMM pairs from the other memory cartridge. In this case,
the system management routine disables the failed DIMM. Further memory reads and writes will only
occur on the mirrored DIMM pairs.
The exceptions to Mirrored Memory mode are the following:
•
In Mirrored Memory mode, half of the memory is allocated to memory protection.
•
The available memory bandwidth is reduced by up to 50% in this mode.
•
Mirrored Memory mode, Online Spare mode, Hemisphere mode, and interleaving cannot be
enabled simultaneously.
To configure memory for Mirrored Memory mode, observe these additional constraints:
•
For the server to support Mirrored Memory, all processors must have a valid mirroring configuration.
•
The minimum allowable configuration is two memory cartridges per processor.
•
Both memory cartridges for each processor must be populated with the same DIMM configurations.
•
Although this configuration requirement is the same for Hemisphere mode and Mirrored Memory
mode, only one of the two modes can be enabled at a given time.
Installing memory
1.
Power down the server (on page 25).
2.
Remove the processor memory drawer (on page 27).
CAUTION: To prevent damage to the processor memory drawer cover, be sure the handle of
the processor memory drawer is fully open before removing the cover.
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49
3.
Remove the processor memory drawer cover.
4.
Remove the memory cartridge.
5.
Open the memory cartridge cover.
6.
Open the DIMM slot latches.
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50
7.
Install the DIMM. See "Memory options (on page 41)."
8.
Close the memory cartridge cover.
9.
Install the memory cartridge.
10.
Install the processor memory drawer cover.
11.
Install the processor memory drawer.
12.
Power up the server.
Hot-plug hard drive option
When adding hard drives to the server, observe the following general guidelines:
•
The system automatically sets all device numbers.
•
If only one hard drive is used, install it in the bay with the lowest device number.
•
Hard drives must be SFF types.
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Drives should be the same capacity to provide the greatest storage space efficiency when drives are
grouped together into the same drive array.
For hard drive numbers, see "Device numbers (on page 18)."
To install the component:
1.
Remove the hard drive blank.
2.
Prepare the SAS hard drive.
3.
Install the hard drive.
4.
Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations.
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52
Redundant hot-plug power supply option
The server supports up to four hot-plug power supplies. Install all power supplies to provide full
redundancy.
HP recommends installing redundant hot-plug power supplies in pairs.
To confirm the redundancy of your configuration, see the HP power advisor at the HP website
(http://www.hp.com/go/hpoweradvisor).
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at
all times.
• Unplug the power cord from the power supply to disconnect power to the equipment.
• Do not route the power cord where it can be walked on or pinched by items placed
against it. Pay particular attention to the plug, electrical outlet, and the point where the
cord extends from the server.
1.
Remove the power supply blank.
2.
Slide the power supply into the power supply bay until the device locks into place.
Hardware options installation
53
3.
Connect the power cord to the power supply.
4.
Connect the power cord to the power source.
5.
Be sure that the power supply LED is green ("Power supply LED" on page 12).
6.
Be sure that the front panel external health LED is green ("Front panel LEDs and buttons" on page 8).
Internal solid state drive expansion bay option
1.
Power down the server (on page 25).
2.
Extend the server from the rack (on page 25).
3.
Remove the access panel (on page 26).
4.
Install the solid state drive.
The SPI board is not shown for clarity.
5.
Connect the cable.
The SPI board is not shown for clarity.
Hardware options installation
54
The cable and the cable arrangement may appear differently from shown.
6.
Install the access panel.
7.
Slide the server back into the rack.
8.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
Expansion board options
The server supports up to 11 expansion slots. The server ships with 5 PCI Express expansion slots.
To support the optional expansion slots, install one of the following options into the server:
•
PCI Express I/O Expansion Board—Adds six optional slots
•
PCI-X/PCI Express I/O Expansion Board—Adds five optional slots
Installing a non-hot-plug expansion board
CAUTION: To prevent improper cooling and thermal damage, do not operate the server
unless all expansion slots have either an expansion slot cover or an expansion board
installed.
1.
Power down the server (on page 25).
2.
Extend or remove the server from the rack ("Extend the server from the rack" on page 25).
3.
Remove the access panel (on page 26).
Hardware options installation
55
4.
Open the expansion board retainer, and then remove the expansion slot cover.
5.
Install the expansion board.
6.
Install the shipping screw, if necessary. For more information, see "Securing an expansion board for
shipping (on page 56)."
7.
Close the expansion slot retainer.
8.
Connect any required internal or external cables to the expansion board.
9.
Install the access panel.
10.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
11.
Resume normal server operations.
Securing an expansion board for shipping
Hardware options installation
56
CAUTION: To prevent improper cooling and thermal damage, do not operate the server
unless all expansion slots have either an expansion slot cover or an expansion board
installed.
1.
Power down the server (on page 25).
2.
Extend the server from the rack (on page 25).
3.
Remove the access panel (on page 26).
4.
Remove the shipping screw.
5.
Open the expansion board retainer.
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57
6.
Install the shipping screw.
7.
Close the expansion slot retainer.
8.
Install the access panel.
9.
Slide the server back into the rack.
10.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
11.
Resume normal server operations.
Installing the PCI Express I/O expansion board
CAUTION: To prevent improper cooling and thermal damage, do not operate the server
unless all expansion slots have either an expansion slot cover or an expansion board
installed.
IMPORTANT: When either optional I/O expansion board in installed in a two-processor
configuration, the second processor must be installed in socket 3.
1.
Power down the server (on page 25).
2.
Extend the server from the rack (on page 25).
3.
Remove the access panel (on page 26).
Hardware options installation
58
4.
Release the latches on the release lever.
5.
Lower the handle, and then extend the processor memory drawer from the server until the release
latches catch.
Hardware options installation
59
6.
Install the PCI Express I/O expansion board.
7.
Install any expansion boards ("Installing a non-hot-plug expansion board" on page 55).
8.
Slide the processor memory drawer back into the server.
9.
Install the access panel.
10.
Slide the server back into the rack.
11.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
Installing the PCI-X/PCI Express I/O expansion board
CAUTION: To prevent improper cooling and thermal damage, do not operate the server
unless all expansion slots have either an expansion slot cover or an expansion board
installed.
IMPORTANT: When either optional I/O expansion board in installed in a two-processor
configuration, the second processor must be installed in socket 3.
1.
Power down the server (on page 25).
2.
Extend the server from the rack (on page 25).
3.
Remove the access panel (on page 26).
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60
4.
Release the latches on the release lever.
5.
Lower the handle, and then extend the processor memory drawer from the server until the release
latches catch.
Hardware options installation
61
6.
Install the PCI-X/PCI Express I/O expansion board.
7.
Install any expansion boards ("Installing a non-hot-plug expansion board" on page 55).
8.
Slide the processor memory drawer back into the server.
9.
Install the access panel.
10.
Slide the server back into the rack.
11.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
HP NC524SFP Dual Port 10GbE Module option
When installed on the SPI board, the HP NC524SFP Dual Port 10GbE Module provides two 10G NIC
connectors for server I/O. When the HP NC524SFP module is installed, 1G NIC connectors 1 and 2 on
the rear panel are unavailable.
IMPORTANT: When both an HP NC524SFP module and an optional HP NC522SFP Dual
Port 10GbE Server Adapter are installed in the server, only two expansion slots have Wake
On LAN capability.
To install the component:
1.
Power down the server (on page 25).
2.
Disconnect the network cables.
3.
Extend the server from the rack (on page 25).
4.
Remove the access panel (on page 26).
5.
Remove the SPI board (on page 28).
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62
6.
Install the mini-DIMM on the SPI board.
7.
Install the SPI board.
8.
Using a T-15 Torx screwdriver, remove the 10G NIC adapter blank.
Save the retaining screw.
9.
Install the HP NC524SFP module on the SPI board.
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63
10.
Secure the 10G NIC connectors to the chassis with the retaining screw.
11.
Install the RJ-45 plugs on the bottom two RJ-45 connectors on the rear panel.
12.
Install the access panel.
13.
Slide the server back into the rack.
14.
Connect the network cables.
15.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
Battery-backed write cache module
The HP BBWC protects against hard boot, power, controller, and system board failures. The server
supports the following battery-backed options:
•
256-MB cache module (standard)
•
512-MB cache module (optional)
Hardware options installation
64
The BBWC consists of two parts: a battery pack and a storage cache module.
Along with the cache module, the battery pack provides transportable data protection, increases overall
controller performance, and maintains any cached data for up to 72 hours after the server loses power.
The NiMH batteries in the battery pack are continuously recharged through a trickle-charging process
whenever the system power is on.
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or
remove the battery pack while an array capacity expansion, RAID level migration, or stripe
size migration is in progress.
CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED
before unplugging the cable from the cache module. If the amber LED blinks after 15
seconds, do not remove the cable from the cache module. The cache module is backing up
data, and data is lost if the cable is detached.
IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST
error message is displayed when the server is powered up, indicating that the battery pack is
temporarily disabled. No action is necessary on your part. The internal circuitry automatically
recharges the batteries and enables the battery pack. This process might take up to four
hours. During this time, the cache module functions properly, but without the performance
advantage of the battery pack.
To install the component:
1.
Close all applications, and power down the server (on page 25). This procedure flushes all data
from the cache.
2.
Extend the server from the rack (on page 25).
3.
Remove the access panel (on page 26).
4.
Remove the SPI board (on page 28).
5.
Install the cache module.
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65
6.
Attach the cable to the cache module.
7.
Install the battery.
8.
Connect the cable to the battery.
The SPI board is not shown for clarity.
9.
Install the access panel.
10.
Slide the server back into the rack.
11.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
FBWC module and capacitor pack option
CAUTION: Do not use this controller with cache modules designed for other controller
models, because the controller can malfunction and you can lose data. Also, do not transfer
this cache module to a different controller module, because you can lose data.
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66
To install the component:
1.
Back up all data.
2.
Close all applications.
3.
Power down the server (on page 25).
CAUTION: In systems that use external data storage, be sure that the server is the first unit to
be powered down and the last to be powered back up. Taking this precaution ensures that
the system does not erroneously mark the drives as failed when the server is powered up.
4.
Extend the server from the rack (on page 25).
5.
Remove the access panel (on page 26).
6.
Remove the SPI board (on page 28).
7.
Install the FBWC module.
8.
Connect the cable.
9.
Install the capacitor pack.
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67
The SPI board is not shown for clarity.
10.
Install the SPI board.
11.
Install the access panel.
12.
Slide the server back into the rack.
13.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
HP Trusted Platform Module option
Use these instructions to install and enable a TPM on a supported server. This procedure includes three
sections:
1.
Installing the Trusted Platform Module board (on page 69).
2.
Retaining the recovery key/password (on page 69).
3.
Enabling the Trusted Platform Module (on page 70).
Enabling the TPM requires accessing the ROM-Based Setup Utility (RBSU) ("HP ROM-Based Setup
Utility" on page 73). For more information about RBSU, see the HP website
(http://www.hp.com/support/smartstart/documentation).
TPM installation requires the use of drive encryption technology, such as the Microsoft® Windows®
BitLocker™ Drive Encryption feature. For more information on BitLocker™, see the Microsoft website
(http://www.microsoft.com).
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines
can cause hardware damage or halt data access.
When installing or replacing a TPM, observe the following guidelines:
•
Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system
board.
•
When installing or replacing hardware, HP service providers cannot enable the TPM or the
encryption technology. For security reasons, only the customer can enable these features.
Hardware options installation
68
•
When returning a system board for service replacement, do not remove the TPM from the system
board. When requested, HP Service provides a TPM with the spare system board.
•
Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security
rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider
the system compromised and take appropriate measures to ensure the integrity of the system data.
•
When using BitLocker™, always retain the recovery key/password. The recovery key/password is
required to enter Recovery Mode after BitLocker™ detects a possible compromise of system integrity.
•
HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see
the encryption technology feature documentation provided by the operating system.
Retaining the recovery key/password
The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after
BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery
key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of
system integrity.
To help ensure maximum security, observe the following guidelines when retaining the recovery
key/password:
•
Always store the recovery key/password in multiple locations.
•
Always store copies of the recovery key/password away from the server.
•
Do not save the recovery key/password on the encrypted hard drive.
Installing the Trusted Platform Module board
WARNING: To reduce the risk of personal injury, electric shock, or damage to the
equipment, remove the power cord to remove power from the server. The front panel Power
On/Standby button does not completely shut off system power. Portions of the power supply
and some internal circuitry remain active until AC power is removed.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
1.
Power down the server (on page 25).
2.
Remove the access panel (on page 26).
3.
Extend the server from the rack (on page 25).
4.
Remove the SPI board (on page 28).
5.
Locate the TPM connector ("SPI board components" on page 15).
CAUTION: Any attempt to remove an installed TPM from the system board breaks or
disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed
TPM, administrators should consider the system compromised and take appropriate measures
to ensure the integrity of the system data.
Hardware options installation
69
6.
Install the TPM board. Press down on the connector to seat the board ("System board components"
on page 13).
7.
Install the TPM security rivet by pressing the rivet firmly into the system board.
8.
Install the SPI board.
9.
Install the access panel.
10.
Slide the server back into the rack.
11.
Power up the server (on page 25, "Powering up and configuring the server" on page 34).
Enabling the Trusted Platform Module
1.
When prompted during the start-up sequence, access RBSU by pressing the F9 key.
2.
From the Main Menu, select Server Security.
3.
From the Server Security Menu, select Trusted Platform Module.
4.
From the Trusted Platform Module Menu, select TPM Functionality.
5.
Select Enable, and then press the Enter key to modify the TPM Functionality setting.
6.
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.
Hardware options installation
70
7.
Reboot the server.
8.
Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.
CAUTION: When a TPM is installed and enabled on the server, data access is locked if you
fail to follow the proper procedures for updating the system or option firmware, replacing the
system board, replacing a hard drive, or modifying OS application TPM settings.
For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module
Best Practices White Paper on the HP website (http://www.hp.com/support).
For more information on adjusting TPM usage in BitLocker™, see the Microsoft website
(http://technet.microsoft.com/en-us/windowsvista/aa905065.aspx).
Hardware options installation
71
Cabling
DVD-ROM drive cabling
Cabling
72
Server software and configuration utilities
Configuration tools
SmartStart software
SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent
way to deploy server configuration. SmartStart has been tested on many ProLiant server products,
resulting in proven, reliable configurations.
SmartStart assists the deployment process by performing a wide range of configuration activities,
including:
•
Preparing the system for installing "off-the-shelf" versions of leading operating system software
•
Installing optimized server drivers, management agents, and utilities automatically with every
assisted installation
•
Testing server hardware using the Insight Diagnostics Utility ("HP Insight Diagnostics" on page 81)
•
Installing software drivers directly from the CD. With systems that have Internet connection, the
SmartStart Autorun Menu provides access to a complete list of ProLiant system software.
•
Enabling access to the Array Configuration Utility (on page 76) and Erase Utility (on page 79)
SmartStart is included in the HP Insight Foundation suite for ProLiant. For more information about
SmartStart software, see the HP Insight Foundation suite for ProLiant or the HP website
(http://www.hp.com/go/foundation).
SmartStart Scripting Toolkit
The SmartStart Scripting Toolkit is a server deployment product that delivers an unattended automated
installation for high-volume server deployments. The SmartStart Scripting Toolkit is designed to support
ProLiant BL, ML, DL, and 100 series servers. The toolkit includes a modular set of utilities and important
documentation that describes how to apply these new tools to build an automated server deployment
process.
Using SmartStart technology, the Scripting Toolkit provides a flexible way to create standard server
configuration scripts. These scripts are used to automate many of the manual steps in the server
configuration process. This automated server configuration process cuts time from each deployment,
making it possible to scale server deployments to high volumes in a rapid manner.
For more information, and to download the SmartStart Scripting Toolkit, see the HP website
(http://www.hp.com/servers/sstoolkit).
HP ROM-Based Setup Utility
RBSU is a configuration utility embedded in ProLiant servers that performs a wide range of configuration
activities that can include the following:
Server software and configuration utilities
73
•
Configuring system devices and installed options
•
Enabling and disabling system features
•
Displaying system information
•
Selecting the primary boot controller
•
Configuring memory options
•
Language selection
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD
or the HP website (http://www.hp.com/support/smartstart/documentation).
Using RBSU
To use RBSU, use the following keys:
•
To access RBSU, press the F9 key during power-up when prompted.
•
To navigate the menu system, use the arrow keys.
•
To make selections, press the Enter key.
•
To access Help for a highlighted configuration option, press the F1 key.
IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does
not prompt you for confirmation of settings before you exit the utility. To change a selected
setting, you must select a different setting and press the Enter key.
Default configuration settings are applied to the server at one of the following times:
•
Upon the first system power-up
•
After defaults have been restored
Default configuration settings are sufficient for proper typical server operation, but configuration settings
can be modified using RBSU. The system will prompt you for access to RBSU with each power-up.
Auto-configuration process
The auto-configuration process automatically runs when you boot the server for the first time. During the
power-up sequence, the system ROM automatically configures the entire system without needing any
intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a
default setting based on the number of drives connected to the server.
NOTE: The server may not support all the following examples.
NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not
automatically configure the array. You must run ORCA to configure the array settings.
Drives installed
Drives used
RAID level
1
1
RAID 0
2
2
RAID 1
3, 4, 5, or 6
3, 4, 5, or 6
RAID 5
Server software and configuration utilities
74
Drives installed
Drives used
RAID level
More than 6
0
None
To change any ORCA default settings and override the auto-configuration process, press the F8 key when
prompted.
By default, the auto-configuration process configures the system for the English language. To change any
default settings in the auto-configuration process (such as the settings for language, operating system, and
primary boot controller), execute RBSU by pressing the F9 key when prompted. After the settings are
selected, exit RBSU and allow the server to reboot automatically.
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD
or the HP website (http://www.hp.com/support/smartstart/documentation).
Boot options
Near the end of the boot process, the boot options screen is displayed. This screen is visible for several
seconds before the system attempts to boot from a supported boot device. During this time, you can do
the following:
•
Access RBSU by pressing the F9 key.
•
Access the System Maintenance Menu (which enables you to launch ROM-based Diagnostics or
Inspect) by pressing the F10 key.
•
Force a PXE Network boot by pressing the F12 key.
BIOS Serial Console
BIOS Serial Console allows you to configure the serial port to view POST error messages and run RBSU
remotely through a serial connection to the server COM port. The server that you are remotely configuring
does not require a keyboard and mouse.
For more information about BIOS Serial Console, see the BIOS Serial Console User Guide on the
Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation).
Configuring lockstep memory
To configure Lockstep memory:
1.
Install the required DIMMs.
2.
Access RBSU by pressing the F9 key during power-up when the prompt is displayed.
3.
Select System Options.
4.
Select Advanced Memory Protection.
5.
Select Lockstep with Advanced ECC Support.
6.
Press the Enter key.
7.
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.
For more information on Lockstep memory, see the white paper on the HP website
(http://h18000.www1.hp.com/products/servers/technology/memoryprotection.html).
Server software and configuration utilities
75
Configuring online spare memory
To configure online spare memory:
1.
Install the required DIMMs.
2.
When the prompt appears, access RBSU by pressing the F9 key during power-up.
3.
Select System Options.
4.
Select Advanced Memory Protection.
5.
Select Online Spare with Advanced ECC Support.
6.
Press the Enter key.
7.
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.
For more information on online spare memory, see the HP website
(http://h18000.www1.hp.com/products/servers/technology/memoryprotection.html).
Configuring mirrored memory
To configure mirrored memory:
1.
Install the required DIMMs.
2.
Access RBSU by pressing the F9 key during power-up when the prompt is displayed.
3.
Select System Options.
4.
Select Advanced Memory Protection.
5.
Select Mirrored Memory with Advanced ECC Support.
6.
Press the Enter key.
7.
Press the Esc key to exit the current menu or press the F10 key to exit RBSU.
For more information on mirrored memory, see the white paper on the HP website
(http://h18000.www1.hp.com/products/servers/technology/memoryprotection.html).
Array Configuration Utility
ACU is a browser-based utility with the following features:
•
Runs as a local application or remote service
•
Supports online array capacity expansion, logical drive extension, assignment of online spares, and
RAID or stripe size migration
•
Suggests the optimum configuration for an unconfigured system
•
Provides different operating modes, enabling faster configuration or greater control over the
configuration options
•
Remains available any time that the server is on
•
Displays on-screen tips for individual steps of a configuration procedure
•
Beginning with ACU version 8.28.13.0, provides diagnostic functionality on the Diagnostics tab
(formerly known as Array Diagnostics Utility).
For optimum performance, the minimum display settings are 1024 × 768 resolution and 16-bit color.
Servers running Microsoft® operating systems require one of the following supported browsers:
Server software and configuration utilities
76
•
Internet Explorer 6.0 or later
•
Mozilla Firefox 2.0 or later
For Linux servers, see the README.TXT file for additional browser and support information.
For more information, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the
Documentation CD or the HP website (http://www.hp.com).
HP ProLiant Essentials Rapid Deployment Pack
The RDP software is the preferred method for rapid, high-volume server deployments. The RDP software
integrates two powerful products: Altiris Deployment Solution and the HP ProLiant Integration Module.
The intuitive graphical user interface of the Altiris Deployment Solution console provides simplified pointand-click and drag-and-drop operations that enable you to deploy target servers, including server blades,
remotely. It enables you to perform imaging or scripting functions and maintain software images.
For more information about the RDP, refer to the HP ProLiant Essentials Rapid Deployment Pack CD or
refer to the HP website (http://www.hp.com/servers/rdp).
Option ROM Configuration for Arrays
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign
RAID levels, and establish online spare configurations.
The utility also provides support for the following functions:
•
Reconfiguring one or more logical drives
•
Viewing the current logical drive configuration
•
Deleting a logical drive configuration
•
Setting the controller to be the boot controller
If you do not use the utility, ORCA will default to the standard configuration.
For more information regarding array controller configuration, refer to the controller user guide.
For more information regarding the default configurations that ORCA uses, refer to the HP ROM-Based
Setup Utility User Guide on the Documentation CD.
Re-entering the server serial number and product ID
After you replace the system board, you must re-enter the server serial number and the product ID.
1.
During the server startup sequence, press the F9 key to access RBSU.
2.
Select the Advanced Options menu.
3.
Select Service Options.
4.
Select Serial Number. The following warnings appear:
WARNING! WARNING! WARNING! The serial number is loaded into the system
during the manufacturing process and should NOT be modified. This option
should only be used by qualified service personnel. This value should
always match the serial number sticker located on the chassis.
Server software and configuration utilities
77
Warning: The serial number should ONLY be modified by qualified
personnel. This value should always match the serial number located on
the chassis.
5.
Press the Enter key to clear the warning.
6.
Enter the serial number and press the Enter key.
7.
Select Product ID. The following warning appears:
Warning: The Product ID should ONLY be modified by qualified personnel.
This value should always match the Product ID on the chassis.
8.
Enter the product ID and press the Enter key.
9.
Press the Esc key to close the menu.
10.
Press the Esc key to exit RBSU.
11.
Press the F10 key to confirm exiting RBSU. The server automatically reboots.
Management tools
Automatic Server Recovery
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such
as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System
Management driver, also known as the Health Driver, is loaded. When the operating system is
functioning properly, the system periodically resets the timer. However, when the operating system fails,
the timer expires and restarts the server.
ASR increases server availability by restarting the server within a specified time after a system hang or
shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated
pager number that ASR has restarted the system. You can disable ASR from the HP SIM console or
through RBSU.
ROMPaq utility
The ROMPaq utility enables you to upgrade the system firmware (BIOS). To upgrade the firmware, insert
a ROMPaq USB Key into an available USB port and boot the system. In addition to ROMPaq, Online
Flash Components for Windows and Linux operating systems are available for updating the system
firmware.
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available
firmware revisions.
For more information, see the Download drivers and software page for the server. To access the serverspecific page, enter the following web address into the browser:
http://www.hp.com/support/<servername>
For example:
http://www.hp.com/support/dl360g6
Server software and configuration utilities
78
System Online ROM flash component utility
The Online ROM Flash Component Utility enables system administrators to efficiently upgrade system or
controller ROM images across a wide range of servers and array controllers. This tool has the following
features:
•
Works offline and online
•
Supports Microsoft® Windows NT®, Windows® 2000, Windows Server® 2003, Novell Netware,
and Linux operating systems
IMPORTANT: This utility supports operating systems that may not be supported by the server.
For operating systems supported by the server, see the HP website
(http://www.hp.com/support).
•
Integrates with other software maintenance, deployment, and operating system tools
•
Automatically checks for hardware, firmware, and operating system dependencies, and installs only
the correct ROM upgrades required by each target server
To download the tool and for more information, see the HP website (http://www.hp.com/support).
Integrated Lights-Out 3 technology
The iLO 3 subsystem is a standard component of selected ProLiant servers that provides server health and
remote server manageability. The iLO 3 subsystem includes an intelligent microprocessor, secure memory,
and a dedicated network interface. This design makes iLO 3 independent of the host server and its
operating system. The iLO 3 subsystem provides remote access to any authorized network client, sends
alerts, and provides other server management functions.
Using iLO 3, you can:
•
Remotely power up, power down, or reboot the host server.
•
Send alerts from iLO 3 regardless of the state of the host server.
•
Access advanced troubleshooting features through the iLO 3 interface.
•
Diagnose iLO 3 using HP SIM through a web browser and SNMP alerting.
For more information about iLO 3 features (which may require an iLO Advanced Pack or iLO Advanced
for BladeSystem license), see the iLO 3 documentation on the Documentation CD or on the HP website
(http://www.hp.com/servers/lights-out).
Erase Utility
CAUTION: Perform a backup before running the System Erase Utility. The utility sets the
system to its original factory state, deletes the current hardware configuration information,
including array setup and disk partitioning, and erases all connected hard drives completely.
Refer to the instructions for using this utility.
Run the Erase Utility if you must erase the system for the following reasons:
•
You want to install a new operating system on a server with an existing operating system.
•
You encounter an error when completing the steps of a factory-installed operating system installation.
Server software and configuration utilities
79
To access the Erase Utility, use the System Erase button on the home screen of the SmartStart CD
("SmartStart software" on page 73).
StorageWorks library and tape tools
HP StorageWorks L&TT provides functionality for firmware downloads, verification of device operation,
maintenance procedures, failure analysis, corrective service actions, and some utility functions. It also
provides seamless integration with HP hardware support by generating and emailing support tickets that
deliver a snapshot of the storage system.
For more information, and to download the utility, refer to the StorageWorks L&TT website
(http://h18006.www1.hp.com/products/storageworks/ltt).
HP Systems Insight Manager
HP SIM is a web-based application that allows system administrators to accomplish normal administrative
tasks from any remote location, using a web browser. HP SIM provides device management capabilities
that consolidate and integrate management data from HP and third-party devices.
IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for
processors, SAS and SATA hard drives, and memory modules.
For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or
the HP SIM website (http://www.hp.com/go/hpsim).
Management Agents
Management Agents provide the information to enable fault, performance, and configuration
management. The agents allow easy manageability of the server through HP SIM software, and thirdparty SNMP management platforms. Management Agents are installed with every SmartStart assisted
installation or can be installed through the HP PSP. The Systems Management homepage provides status
and direct access to in-depth subsystem information by accessing data reported through the Management
Agents. For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation
Pack or the HP website (http://www.hp.com/servers/manage).
Redundant ROM support
The server enables you to upgrade or configure the ROM safely with redundant ROM support. The server
has a 8-MB ROM that acts as two, separate 4-MB ROMs. In the standard implementation, one side of the
ROM contains the current ROM program version, while the other side of the ROM contains a backup
version.
NOTE: The server ships with the same version programmed on each side of the ROM.
Safety and security benefits
When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a
backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted
Server software and configuration utilities
80
for any reason. This feature protects the existing ROM version, even if you experience a power failure
while flashing the ROM.
USB support
HP provides both standard USB support and legacy USB support. Standard support is provided by the OS
through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices
through legacy USB support, which is enabled by default in the system ROM.
Legacy USB support provides USB functionality in environments where USB support is not available
normally. Specifically, HP provides legacy USB functionality for the following:
•
POST
•
RBSU
•
Diagnostics
•
DOS
•
Operating environments which do not provide native USB support
Diagnostic tools
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online
versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify
server installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the
OS is not running. To run this utility, launch the SmartStart CD.
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and
other related data needed for effective server management. Available in Microsoft® Windows® and
Linux versions, the utility helps to ensure proper system operation.
For more information or to download the utility, refer to the HP website
(http://www.hp.com/servers/diags).
HP Insight Diagnostics survey functionality
HP Insight Diagnostics (on page 81) provides survey functionality that gathers critical hardware and
software information on ProLiant servers.
This functionality supports operating systems that may not be supported by the server. For operating
systems supported by the server, see the HP website (http://www.hp.com/go/supportos).
If a significant change occurs between data-gathering intervals, the survey function marks the previous
information and overwrites the survey data files to reflect the latest changes in the configuration.
Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can
be installed through the HP PSP ("ProLiant Support Packs" on page 83).
Server software and configuration utilities
81
NOTE: The current version of SmartStart provides the memory spare part numbers for the
server. To download the latest version, see the HP website (http://www.hp.com/support).
Integrated Management Log
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each
event with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
•
From within HP SIM ("HP Systems Insight Manager" on page 80)
•
From within Survey Utility
•
From within operating system-specific IML viewers
o
For NetWare: IML Viewer
o
For Windows®: IML Viewer
o
For Linux: IML Viewer Application
•
From within the iLO 3 user interface
•
From within HP Insight Diagnostics (on page 81)
For more information, see the Management CD in the HP Insight Foundation suite for ProLiant.
Array Diagnostic Utility
The HP Array Diagnostics Utility is a web-based application that creates a report of all HP storage
controllers and disk drives. This report provides vital information to assist in identifying faults or conditions
that may require attention. ADU can be accessed from the SmartStart CD ("SmartStart software" on page
73) or downloaded from the HP website (http://www.hp.com).
Remote support and analysis tools
HP Insight Remote Support software
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service or
HP contractual support agreement. HP Insight Remote Support supplements your monitoring, 24 x 7 to
ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure
submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based
on your product’s service level. Notifications may be sent to your authorized HP Channel Partner for onsite service, if configured and available in your country. The software is available in two variants:
•
HP Insight Remote Support Standard: This software supports server and storage devices and is
optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive
notification, but do not need proactive service delivery and integration with a management platform.
•
HP Insight Remote Support Advanced: This software provides comprehensive remote monitoring and
proactive service support for nearly all HP servers, storage, network, and SAN environments, plus
selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems
Server software and configuration utilities
82
Insight Manager. A dedicated server is recommended to host both HP Systems Insight Manager and
HP Insight Remote Support Advanced.
Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).
To download the software for free, go to Software Depot (http://www.software.hp.com).
Select Insight Remote Support from the menu on the right.
Keeping the system current
Drivers
The server includes new hardware that may not have driver support on all operating system installation
media.
If you are installing a SmartStart-supported operating system, use the SmartStart software (on page 73)
and its Assisted Path feature to install the operating system and latest driver support.
NOTE: If you are installing drivers from the SmartStart CD or the Software Maintenance CD,
refer to the SmartStart website (http://www.hp.com/servers/smartstart) to be sure that you
are using the latest version of SmartStart. For more information, refer to the documentation
provided with the SmartStart CD.
If you do not use the SmartStart CD to install an operating system, drivers for some of the new hardware
are required. These drivers, as well as other option drivers, ROM images, and value-add software can be
downloaded from the HP website (http://www.hp.com/support).
IMPORTANT: Always perform a backup before installing or updating device drivers.
Version control
The VCRM and VCA are Web-enabled Insight Management Agents tools that HP SIM uses to facilitate
and schedule software update tasks to the entire enterprise.
•
VCRM manages the repository for Windows and Linux PSPs as well as online firmware.
Administrators can browse a graphical view of the PSPs or configure VCRM to automatically update
the repository with Internet downloads of the latest software from HP.
•
VCA compares installed software versions and available updates. Administrators can configure VCA
to point to a repository managed by VCRM.
For more information about version control tools, see the HP Systems Insight Manager Help Guide and the
Version Control User Guide on the HP Systems Insight Manager website (http://www.hp.com/go/hpsim).
ProLiant Support Packs
PSPs represent operating system-specific bundles of ProLiant optimized drivers, utilities, and management
agents. Refer to the PSP website
(http://h18000.www1.hp.com/products/servers/management/psp.html).
Server software and configuration utilities
83
Operating system version support
Refer to the operating system support matrix (http://www.hp.com/go/supportos).
System Online ROM flash component utility
The Online ROM Flash Component Utility enables system administrators to efficiently upgrade system or
controller ROM images across a wide range of servers and array controllers. This tool has the following
features:
•
Works offline and online
•
Supports Windows Server® 2003, Windows Server® 2008, Novell Netware, and Linux operating
systems
IMPORTANT: This utility supports operating systems that may not be supported by the server.
For operating systems supported by the server, see the HP website
(http://www.hp.com/support).
•
Integrates with other software maintenance, deployment, and operating system tools
•
Automatically checks for hardware, firmware, and operating system dependencies, and installs only
the correct ROM upgrades required by each target server
To download the tool and for more information, see the HP website (http://www.hp.com/support).
Change control and proactive notification
HP offers Change Control and Proactive Notification to notify customers 30 to 60 days in advance of
upcoming hardware and software changes on HP commercial products.
For more information, refer to the HP website (http://www.hp.com/go/pcn).
Care Pack
HP Care Pack Services offer upgraded service levels to extend and expand bundled services with easy-tobuy, easy-to-use support packages that help you make the most of your server investments. For more
information, see the HP website (http://www.hp.com/services/carepack).
Server software and configuration utilities
84
Troubleshooting
Troubleshooting resources
The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and
comprehensive courses of action for fault isolation and identification, error message interpretation, issue
resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a
language:
•
English (http://www.hp.com/support/ProLiant_TSG_en)
•
French (http://www.hp.com/support/ProLiant_TSG_fr)
•
Italian (http://www.hp.com/support/ProLiant_TSG_it)
•
Spanish (http://www.hp.com/support/ProLiant_TSG_sp)
•
German (http://www.hp.com/support/ProLiant_TSG_gr)
•
Dutch (http://www.hp.com/support/ProLiant_TSG_nl)
•
Japanese (http://www.hp.com/support/ProLiant_TSG_jp)
Pre-diagnostic steps
WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary
information in the server documentation before removing, replacing, reseating, or modifying
system components.
IMPORTANT: This guide provides information for multiple servers. Some information may not
apply to the server you are troubleshooting. Refer to the server documentation for information
on procedures, hardware options, software tools, and operating systems supported by the
server.
1.
Review the important safety information (on page 85).
2.
Gather symptom information (on page 87).
3.
Prepare the server for diagnosis (on page 88).
4.
Use the Start diagnosis flowchart (on page 89) to begin the diagnostic process.
Important safety information
Familiarize yourself with the safety information in the following sections before troubleshooting the server.
Important safety information
Before servicing this product, read the Important Safety Information document provided with the server.
Troubleshooting
85
Symbols on equipment
The following symbols may be placed on equipment to indicate the presence of potentially hazardous
conditions.
This symbol indicates the presence of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
WARNING: To reduce the risk of injury from electric shock hazards, do not open this
enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.
This symbol indicates the presence of electric shock hazards. The area contains no
user or field serviceable parts. Do not open for any reason.
WARNING: To reduce the risk of injury from electric shock hazards, do not open this
enclosure.
This symbol on an RJ-45 receptacle indicates a network interface connection.
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment,
do not plug telephone or telecommunications connectors into this receptacle.
This symbol indicates the presence of a hot surface or hot component. If this surface
is contacted, the potential for injury exists.
WARNING: To reduce the risk of injury from a hot component, allow the surface to
cool before touching.
This symbol indicates that the component exceeds the recommended weight for one
individual to handle safely.
50 kg
110 lb
WARNING: To reduce the risk of personal injury or damage to the equipment,
observe local occupational health and safety requirements and guidelines for
manual material handling.
These symbols, on power supplies or systems, indicate that the equipment is
supplied by multiple sources of power.
WARNING: To reduce the risk of injury from electric shock, remove all power
cords to completely disconnect power from the system.
Warnings and cautions
WARNING: Only authorized technicians trained by HP should attempt to repair this
equipment. All troubleshooting and repair procedures are detailed to allow only
subassembly/module-level repair. Because of the complexity of the individual boards and
subassemblies, no one should attempt to make repairs at the component level or to make
modifications to any printed wiring board. Improper repairs can create a safety hazard.
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
• The leveling feet are extended to the floor.
• The full weight of the rack rests on the leveling feet.
• The stabilizing feet are attached to the rack if it is a single-rack installation.
• The racks are coupled together in multiple-rack installations.
• Only one component is extended at a time. A rack may become unstable if more than one
component is extended for any reason.
Troubleshooting
86
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at
all times.
• Unplug the power cord from the power supply to disconnect power to the equipment.
• Do not route the power cord where it can be walked on or pinched by items placed
against it. Pay particular attention to the plug, electrical outlet, and the point where the
cord extends from the server.
WARNING: To reduce the risk of personal injury or damage to the equipment:
50 kg
110 lb
• Observe local occupation health and safety requirements and guidelines for
manual handling.
• Obtain adequate assistance to lift and stabilize the chassis during installation or
removal.
• The server is unstable when not fastened to the rails.
• When mounting the server in a rack, remove the power supplies and any other
removable module to reduce the overall weight of the product.
CAUTION: To properly ventilate the system, you must provide at least 7.6 cm (3.0 in) of
clearance at the front and back of the server.
CAUTION: The server is designed to be electrically grounded (earthed). To ensure proper
operation, plug the AC power cord into a properly grounded AC outlet only.
Symptom information
Before troubleshooting a server problem, collect the following information:
•
What events preceded the failure? After which steps does the problem occur?
•
What has been changed since the time the server was working?
•
Did you recently add or remove hardware or software? If so, did you remember to change the
appropriate settings in the server setup utility, if necessary?
•
How long has the server exhibited problem symptoms?
•
If the problem occurs randomly, what is the duration or frequency?
To answer these questions, the following information may be useful:
•
Run HP Insight Diagnostics (on page 81) and use the survey page to view the current configuration
or to compare it to previous configurations.
•
Refer to your hardware and software records for information.
•
Refer to server LEDs and their statuses.
Troubleshooting
87
Prepare the server for diagnosis
1.
Be sure the server is in the proper operating environment with adequate power, air conditioning,
and humidity control. For required environmental conditions, see the server documentation.
2.
Record any error messages displayed by the system.
3.
Remove all diskettes, CD-ROMs, DVD-ROMs, and USB drive keys.
4.
Power down the server and peripheral devices if you will be diagnosing the server offline. If
possible, always perform an orderly shutdown:
a. Exit any applications.
b. Exit the operating system.
c.
Power down the server (on page 25).
5.
Disconnect any peripheral devices not required for testing (any devices not necessary to power up
the server). Do not disconnect the printer if you want to use it to print error messages.
6.
Collect all tools and utilities, such as a Torx screwdriver, loopback adapters, ESD wrist strap, and
software utilities, necessary to troubleshoot the problem.
o
You must have the appropriate Health Drivers and Management Agents installed on the server.
To verify the server configuration, connect to the System Management homepage and select
Version Control Agent. The VCA gives you a list of names and versions of all installed HP drivers,
Management Agents, and utilities, and whether they are up-to-date.
o
HP recommends you have access to the server documentation for server-specific information.
o
HP recommends you have access to the SmartStart CD for value-added software and drivers
required during the troubleshooting process. Download the current version of SmartStart from the
HP website (http://www.hp.com/servers/smartstart).
Loose connections
Action:
•
Be sure all power cords are securely connected.
•
Be sure all cables are properly aligned and securely connected for all external and internal
components.
•
Remove and check all data and power cables for damage. Be sure no cables have bent pins or
damaged connectors.
•
If a fixed cable tray is available for the server, be sure the cords and cables connected to the server
are routed correctly through the tray.
•
Be sure each device is properly seated. Avoid bending or flexing circuit boards when reseating
components.
•
If a device has latches, be sure they are completely closed and locked.
•
Check any interlock or interconnect LEDs that may indicate a component is not connected properly.
•
If problems continue to occur, remove and reinstall each device, checking the connectors and sockets
for bent pins or other damage.
Troubleshooting
88
Service notifications
To view the latest service notifications, refer to the HP website (http://www.hp.com/go/bizsupport).
Select the appropriate server model, and then click the Troubleshoot a Problem link on the product page.
Troubleshooting flowcharts
To effectively troubleshoot a problem, HP recommends that you start with the first flowchart in this section,
"Start diagnosis flowchart (on page 89)," and follow the appropriate diagnostic path. If the other
flowcharts do not provide a troubleshooting solution, follow the diagnostic steps in "General diagnosis
flowchart (on page 90)." The General diagnosis flowchart is a generic troubleshooting process to be used
when the problem is not server-specific or is not easily categorized into the other flowcharts.
The available flowcharts include:
•
Start diagnosis flowchart (on page 89)
•
General diagnosis flowchart (on page 90)
•
Server power-on problems flowchart (on page 92)
•
POST problems flowchart (on page 95)
•
OS boot problems flowchart (on page 96)
•
Server fault indications flowchart (on page 98)
Start diagnosis flowchart
Use the following flowchart to start the diagnostic process.
Item
Refer to
1
"General diagnosis flowchart (on page 90)"
2
"Power-on problems flowchart ("Server power-on problems flowchart"
on page 92)"
3
"POST problems flowchart (on page 95)"
4
"OS boot problems flowchart (on page 96)"
5
"Server fault indications flowchart (on page 98)"
Troubleshooting
89
General diagnosis flowchart
The General diagnosis flowchart provides a generic approach to troubleshooting. If you are unsure of the
problem, or if the other flowcharts do not fix the problem, use the following flowchart.
Item
Refer to
1
"Symptom information (on page 87)"
2
"Loose connections (on page 88)"
3
"Service notifications (on page 89)"
4
The most recent version of a particular server or option firmware is
available on the HP Support website (http://www.hp.com/support).
Troubleshooting
90
Item
Refer to
5
"General memory problems are occurring" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the HP
website (http://www.hp.com/support)
6
Server maintenance and service guide, located on the Documentation
CD or the HP website
(http://www.hp.com/products/servers/platforms)
7
•
Server maintenance and service guide, located on the
Documentation CD or the HP website
(http://www.hp.com/products/servers/platforms)
•
"Hardware problems" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or on the HP website
(http://www.hp.com/support)
•
"Server information you need" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the
HP website (http://www.hp.com/support)
•
"Operating system information you need" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the
HP website (http://www.hp.com/support)
8
9
"HP contact information (on page 113)"
Troubleshooting
91
Server power-on problems flowchart
Symptoms:
•
The server does not power on.
•
The system power LED is off or amber.
Troubleshooting
92
•
The external health LED is red or amber.
•
The internal health LED is red or amber.
NOTE: For the location of server LEDs and information on their statuses, refer to the server
documentation.
Possible causes:
•
Improperly seated or faulty power supply
•
Loose or faulty power cord
•
Power source problem
•
Power on circuit problem
•
Improperly seated component or interlock problem
•
Faulty internal component
Item
Refer to
1
"Component identification (on page 7)"
2
"HP Insight Diagnostics (on page 81)" or in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the HP
website (http://www.hp.com/support)
3
"Loose connections (on page 88)"
4
Server maintenance and service guide, located on the Documentation
CD, or the HP website
(http://www.hp.com/products/servers/platforms)
5
"Integrated Management Log (on page 82)" or in the HP ProLiant
Servers Troubleshooting Guide located on the Documentation CD or on
the HP website (http://www.hp.com/support)
6
"Power source problems" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or on the HP website
(http://www.hp.com/support)
7
•
"Power supply problems" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or on the HP website
(http://www.hp.com/support)
•
Server maintenance and service guide, located on the
Documentation CD, or the HP website
(http://www.hp.com/products/servers/platforms)
8
"System open circuits and short circuits" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the HP
website (http://www.hp.com/support)
Troubleshooting
93
Troubleshooting
94
POST problems flowchart
Symptoms:
•
Server does not complete POST
NOTE: The server has completed POST when the system attempts to access the boot device.
•
Server completes POST with errors
Possible problems:
•
Improperly seated or faulty internal component
•
Faulty KVM device
•
Faulty video device
Item
Refer to
1
"POST error messages and beep codes (on page 100)"
2
"Video problems" in the HP ProLiant Servers Troubleshooting Guide
located on the Documentation CD or on the HP website
(http://www.hp.com/support)
3
KVM or iLO 3 documentation
4
"Loose connections (on page 88)"
5
"Symptom information (on page 87)"
6
Server maintenance and service guide, located on the Documentation
CD or the HP website
(http://www.hp.com/products/servers/platforms)
7
"Port 85 and iLO messages" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or on the HP website
(http://www.hp.com/support)
8
"General memory problems are occurring" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the HP
website (http://www.hp.com/support)
9
•
"Hardware problems" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or on the HP website
(http://www.hp.com/support)
•
Server maintenance and service guide, located on the
Documentation CD or the HP website
(http://www.hp.com/products/servers/platforms)
•
"Server information you need" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the
HP website (http://www.hp.com/support)
•
"Operating system information you need" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the
HP website (http://www.hp.com/support)
10
Troubleshooting
95
Item
Refer to
OS boot problems flowchart
Symptoms:
•
Server does not boot a previously installed operating system
Troubleshooting
96
•
Server does not boot SmartStart
Possible causes:
•
Corrupted operating system
•
Hard drive subsystem problem
•
Incorrect boot order setting in RBSU
Item
Refer to
1
HP ROM-Based Setup Utility User Guide
(http://www.hp.com/servers/smartstart)
2
"POST problems flowchart (on page 95)"
3
•
"Hard drive problems" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or on the HP website
(http://www.hp.com/support)
•
Controller documentation
4
"HP Insight Diagnostics (on page 81)" or in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the HP
website (http://www.hp.com/support)
5
•
"CD-ROM and DVD drive problems" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the
HP website (http://www.hp.com/support)
•
•
Controller documentation
"Loose connections (on page 88)"
6
"General memory problems are occurring" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the HP
website (http://www.hp.com/support)
7
•
"Operating system problems" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the
HP website (http://www.hp.com/support)
•
"HP contact information (on page 113)"
•
"Hardware problems" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or on the HP website
(http://www.hp.com/support)
•
Server maintenance and service guide, located on the
Documentation CD or the HP website
(http://www.hp.com/products/servers/platforms)
8
9
"General diagnosis flowchart (on page 90)"
Troubleshooting
97
Server fault indications flowchart
Symptoms:
•
Server boots, but a fault event is reported by Insight Management Agents (on page 80)
•
Server boots, but the internal health LED, external health LED, or component health LED is red or
amber
Troubleshooting
98
NOTE: For the location of server LEDs and information on their statuses, refer to the server
documentation.
Possible causes:
•
Improperly seated or faulty internal or external component
•
Unsupported component installed
•
Redundancy failure
•
System overtemperature condition
Item
Refer to
1
"Management agents (on page 80)" or in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the HP
website (http://www.hp.com/support)
2
•
"Integrated Management Log (on page 82)" or in the HP ProLiant
Servers Troubleshooting Guide located on the Documentation CD or
on the HP website (http://www.hp.com/support)
•
"Event list error messages" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the
HP website (http://www.hp.com/support)
3
"Component identification (on page 7)"
4
System Management Homepage (https://localhost:2381)
5
"Power-on problems flowchart ("Server power-on problems flowchart"
on page 92)"
6
•
"Smart Array SCSI Diagnosis feature" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the
HP website (http://www.hp.com/support)
•
Server maintenance and service guide, located on the
Documentation CD or the HP website
(http://www.hp.com/products/servers/platforms)
•
"HP contact information (on page 113)"
7
"HP Insight Diagnostics (on page 81)" or in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the HP
website (http://www.hp.com/support)
8
•
"Hardware problems" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or on the HP website
(http://www.hp.com/support)
•
Server maintenance and service guide, located on the
Documentation CD or the HP website
(http://www.hp.com/products/servers/platforms)
Troubleshooting
99
POST error messages and beep codes
For a complete listing of error messages, refer to the "POST error messages" in the HP ProLiant Servers
Troubleshooting Guide located on the Documentation CD or on the HP website
(http://www.hp.com/support).
WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary
information in the server documentation before removing, replacing, reseating, or modifying
system components.
Troubleshooting
100
Battery replacement
If the server no longer automatically displays the correct date and time, you may need to replace the
battery that provides power to the real-time clock.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not
properly handled. To reduce the risk of personal injury:
• Do not attempt to recharge the battery.
• Do not expose the battery to temperatures higher than 60°C (140°F).
• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
• Replace only with the spare designated for this product.
To remove the component:
1.
Power down the server (on page 25).
2.
Extend the server from the rack (on page 25).
3.
Remove the access panel (on page 26).
4.
Locate the battery ("SPI board components" on page 15).
5.
Remove the battery.
To replace the component, reverse the removal procedure.
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
Battery replacement
101
Regulatory compliance notices
Regulatory compliance identification numbers
For the purpose of regulatory compliance certifications and identification, this product has been assigned
a unique regulatory model number. The regulatory model number can be found on the product nameplate
label, along with all required approval markings and information. When requesting compliance
information for this product, always refer to this regulatory model number. The regulatory model number is
not the marketing name or model number of the product.
Federal Communications Commission notice
Part 15 of the Federal Communications Commission (FCC) Rules and Regulations has established Radio
Frequency (RF) emission limits to provide an interference-free radio frequency spectrum. Many electronic
devices, including computers, generate RF energy incidental to their intended function and are, therefore,
covered by these rules. These rules place computers and related peripheral devices into two classes, A
and B, depending upon their intended installation. Class A devices are those that may reasonably be
expected to be installed in a business or commercial environment. Class B devices are those that may
reasonably be expected to be installed in a residential environment (for example, personal computers).
The FCC requires devices in both classes to bear a label indicating the interference potential of the device
as well as additional operating instructions for the user.
FCC rating label
The FCC rating label on the device shows the classification (A or B) of the equipment. Class B devices
have an FCC logo or ID on the label. Class A devices do not have an FCC logo or ID on the label. After
you determine the class of the device, refer to the corresponding statement.
Class A equipment
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference, in which case the user will be required to correct
the interference at personal expense.
Class B equipment
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
Regulatory compliance notices 102
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
•
Reorient or relocate the receiving antenna.
•
Increase the separation between the equipment and receiver.
•
Connect the equipment into an outlet on a circuit that is different from that to which the receiver is
connected.
•
Consult the dealer or an experienced radio or television technician for help.
Declaration of conformity for products marked with
the FCC logo, United States only
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
For questions regarding this product, contact us by mail or telephone:
•
Hewlett-Packard Company
P. O. Box 692000, Mail Stop 530113
Houston, Texas 77269-2000
•
1-800-HP-INVENT (1-800-474-6836). (For continuous quality improvement, calls may be recorded
or monitored.)
For questions regarding this FCC declaration, contact us by mail or telephone:
•
Hewlett-Packard Company
P. O. Box 692000, Mail Stop 510101
Houston, Texas 77269-2000
•
1­281-514-3333
To identify this product, refer to the part, series, or model number found on the product.
Modifications
The FCC requires the user to be notified that any changes or modifications made to this device that are
not expressly approved by Hewlett-Packard Company may void the user’s authority to operate the
equipment.
Cables
Connections to this device must be made with shielded cables with metallic RFI/EMI connector hoods in
order to maintain compliance with FCC Rules and Regulations.
Regulatory compliance notices 103
Canadian notice (Avis Canadien)
Class A equipment
This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment
Regulations.
Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel
brouilleur du Canada.
Class B equipment
This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment
Regulations.
Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel
brouilleur du Canada.
European Union regulatory notice
Products bearing the CE marking comply with the following EU Directives:
•
Low Voltage Directive 2006/95/EC
•
EMC Directive 2004/108/EC
•
Ecodesign Directive 2009/125/EC, where applicable
CE compliance of this product is valid if powered with the correct CE-marked AC adapter provided by
HP.
Compliance with these directives implies conformity to applicable harmonized European standards
(European Norms) that are listed in the EU Declaration of Conformity issued by HP for this product or
product family and available (in English only) either within the product documentation or at the following
HP website (http://www.hp.eu/certificates) (type the product number in the search field).
The compliance is indicated by one of the following conformity markings placed on the product:
For non-telecommunications products and for EU harmonized telecommunications products, such as
Bluetooth® within power class below 10mW.
For EU non-harmonized telecommunications products (If applicable, a 4-digit notified body number is
inserted between CE and !).
Please refer to the regulatory label provided on the product.
The point of contact for regulatory matters is Hewlett-Packard GmbH, Dept./MS: HQ-TRE, Herrenberger
Strasse 140, 71034 Boeblingen, GERMANY.
Regulatory compliance notices 104
Disposal of waste equipment by users in private
households in the European Union
This symbol on the product or on its packaging indicates that this product must not be
disposed of with your other household waste. Instead, it is your responsibility to dispose of
your waste equipment by handing it over to a designated collection point for the recycling of
waste electrical and electronic equipment. The separate collection and recycling of your
waste equipment at the time of disposal will help to conserve natural resources and ensure
that it is recycled in a manner that protects human health and the environment. For more
information about where you can drop off your waste equipment for recycling, please contact
your local city office, your household waste disposal service or the shop where you
purchased the product.
Japanese notice
BSMI notice
Regulatory compliance notices 105
Korean notice
Class A equipment
Class B equipment
Chinese notice
Class A equipment
Laser compliance
This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic
transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in
accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser
radiation.
Each laser product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser
Notice No. 50, dated May 27, 2001; and with IEC 60825-1:1993/A2:2001.
WARNING: Use of controls or adjustments or performance of procedures other than those
specified herein or in the laser product's installation guide may result in hazardous radiation
exposure. To reduce the risk of exposure to hazardous radiation:
• Do not try to open the module enclosure. There are no user-serviceable components inside.
• Do not operate controls, make adjustments, or perform procedures to the laser device
other than those specified herein.
• Allow only HP Authorized Service technicians to repair the unit.
The Center for Devices and Radiological Health (CDRH) of the U.S. Food and Drug Administration
implemented regulations for laser products on August 2, 1976. These regulations apply to laser products
manufactured from August 1, 1976. Compliance is mandatory for products marketed in the United States.
Battery replacement notice
Regulatory compliance notices 106
WARNING: Power products contain sealed lead-acid battery modules. A risk of fire and
burns exists if the battery is not properly handled. To reduce the risk of personal injury:
• Do not attempt to recharge the battery.
• Do not expose the battery to temperatures higher than 60°C (140°F).
• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
The battery might explode.
Batteries, battery packs, and accumulators should not be disposed of together with the general
household waste. To forward them to recycling or proper disposal, use the public collection system
or return them to HP, an authorized HP Partner, or their agents.
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
Taiwan battery recycling notice
The Taiwan EPA requires dry battery manufacturing or importing firms in accordance with Article 15 of
the Waste Disposal Act to indicate the recovery marks on the batteries used in sales, giveaway or
promotion. Contact a qualified Taiwanese recycler for proper battery disposal.
Power cord statement for Japan
Acoustics statement for Germany
(Geräuschemission)
Schalldruckpegel LpA < 70 dB(A)
Zuschauerpositionen (bystander positions), Normaler Betrieb (normal operation)
Nach ISO 7779:1999 (Typprüfung)
Regulatory compliance notices 107
Wireless devices
You can install one or more integrated wireless devices. In some environments, the use of wireless devices
might be restricted. Such restrictions might apply on airplanes, in hospitals, near explosives, or in other
hazardous locations. Before you turn on this product, be sure that you understand local policies and have
proper authorization.
Do not co-locate or operate this device in conjunction with any other antenna or transmitter.
To avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the
antennae should be greater than 20 cm (8 in).
WARNING: Exposure to Radio Frequency Radiation—The radiated output power of this
device is below the FCC radio frequency exposure limits. Nevertheless, human contact during
normal operation should be minimized.
Brazilian notices
Este equipamento opera em caráter secundário, isto é, não tem direito a proteção contra interferência
prejudicial, mesmo de estações do mesmo tipo, e não pode causar interferência a sistemas operando em
caráter primário.
Canadian notices
Wireless operation is subject to two conditions. The first is that the wireless device may not cause
interference. The second is that the wireless device must accept any interference, including interference
that may cause undesired operation of the device.
Japanese notices
Regulatory compliance notices 108
Taiwan notices
Regulatory compliance notices 109
Electrostatic discharge
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the
system or handling parts. A discharge of static electricity from a finger or other conductor may damage
system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the
device.
To prevent electrostatic damage:
•
Avoid hand contact by transporting and storing products in static-safe containers.
•
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
•
Place parts on a grounded surface before removing them from their containers.
•
Avoid touching pins, leads, or circuitry.
•
Always be properly grounded when touching a static-sensitive component or assembly.
Grounding methods to prevent electrostatic
discharge
Several methods are used for grounding. Use one or more of the following methods when handling or
installing electrostatic-sensitive parts:
•
Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist
straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords.
To provide proper ground, wear the strap snug against the skin.
•
Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet
when standing on conductive floors or dissipating floor mats.
•
Use conductive field service tools.
•
Use a portable field service kit with a folding static-dissipating work mat.
If you do not have any of the suggested equipment for proper grounding, have an authorized reseller
install the part.
For more information on static electricity or assistance with product installation, contact an authorized
reseller.
Electrostatic discharge
110
Specifications
Environmental specifications
Specification
Value
Temperature range*
Operating
10°C to 35°C (50°F to 95°F)
Shipping
-40°C to 70°C (-40°F to
158°F)
Maximum wet bulb temperature
28°C (82.4°F)
Relative humidity
(noncondensing)**
Operating
10% to 90%
Non-operating
5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to
3048 m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for
storage corresponds to a pressure minimum of 70 kPa.
Server specifications
Specification
Value
Dimension
—
Height
17.6 cm (6.94 in)
Depth
67.3 cm (26.5 in)
Width
46.3 cm (19.0 in)
Weight (maximum)
47.6 kg (105 lb)
Weight (no drives installed)
36.3 kg (80 lb)
Input requirement
—
Rated input voltage
100–127 VAC
200–240 VAC
Rated input frequency
50–60 Hz
Rated input current
@ 100 VAC–12A
@ 200 VAC–8A
Rated input power
@100 VAC–1161 W
@200 VAC–1598 W
BTUs per hour
@100 VAC–3960 BTU
@200 VAC–5450 BTU
Power supply output
—
Specifications
111
Specification
Value
Power supply output
910 W (low line)
1300 W (high line)
HP ProLiant 1200 W power supply specifications
Specification
Value
Input requirements
Rated input voltage
100 to 120 VAC, 200 to
240 VAC
Rated input frequency
50 Hz to 60 Hz
Rated input current
10 A at 100 VAC
4.9 A at 200 VAC
Rated input power
930 W at 100V AC input
1348 W at 200V AC input
BTUs per hour
3530 at 120V AC input
4600 at 200V to 240V AC
input
Power supply output
Rated steady-state power
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC
input
Maximum peak power
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC
input
Specifications
112
Technical support
Before you contact HP
Be sure to have the following information available before you call HP:
•
Technical support registration number (if applicable)
•
Product serial number
•
Product model name and number
•
Product identification number
•
Applicable error messages
•
Add-on boards or hardware
•
Third-party hardware or software
•
Operating system type and revision level
HP contact information
For the name of the nearest HP authorized reseller:
•
See the Contact HP worldwide (in English) webpage
(http://welcome.hp.com/country/us/en/wwcontact.html).
For HP technical support:
•
•
In the United States, for contact options see the Contact HP United States webpage
(http://welcome.hp.com/country/us/en/contact_us.html). To contact HP by phone:
o
Call 1-800-HP-INVENT (1-800-474-6836). This service is available 24 hours a day, 7 days a
week. For continuous quality improvement, calls may be recorded or monitored.
o
If you have purchased a Care Pack (service upgrade), call 1-800-633-3600. For more
information about Care Packs, refer to the HP website (http://www.hp.com/hps).
In other locations, see the Contact HP worldwide (in English) webpage
(http://welcome.hp.com/country/us/en/wwcontact.html).
Customer Self Repair
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow
for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP
service providers or service partners) identifies that the repair can be accomplished by the use of a CSR
part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:
•
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these
parts, you will be charged for the travel and labor costs of this service.
Technical support
113
•
Optional—Parts for which customer self repair is optional. These parts are also designed for
customer self repair. If, however, you require that HP replace them for you, there may or may not be
additional charges, depending on the type of warranty service designated for your product.
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the
Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business day
delivery. Same day or four-hour delivery may be offered at an additional charge where geography
permits. If assistance is required, you can call the HP Technical Support Center and a technician will help
you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a
defective part must be returned to HP. In cases where it is required to return the defective part to HP, you
must ship the defective part back to HP within a defined period of time, normally five (5) business days.
The defective part must be returned with the associated documentation in the provided shipping material.
Failure to return the defective part may result in HP billing you for the replacement. With a customer self
repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.
For more information about HP's Customer Self Repair program, contact your local service provider. For
the North American program, refer to the HP website (http://www.hp.com/go/selfrepair).
Réparation par le client (CSR)
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client)
afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant
la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut
être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces
CSR:
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à
votre produit.
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit
effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue
illustré.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre
situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le
jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance
téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de
rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous
devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation
doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se
réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte
l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à
utiliser.
Technical support
114
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP
(http://www.hp.com/go/selfrepair).
Riparazione da parte del cliente
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di
assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente
al cliente per la sostituzione. Vi sono due categorie di parti CSR:
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover
sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare
la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti
sono identificate da un "No" nel Catalogo illustrato dei componenti.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un
supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di
un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP
specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente
difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni
lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di
spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio
da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e
resa e sceglie il corriere/vettore da utilizzare.
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).
Customer Self Repair
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und
höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP
Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden
kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien
unterteilt:
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen
Service berechnet.
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für
Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen
möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen
zusätzliche Kosten anfallen.
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HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag
geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen
einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden
muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines
vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss
mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang
enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung
stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf
und bestimmt den Kurier-/Frachtdienst.
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter
(http://www.hp.com/go/selfrepair).
Reparaciones del propio cliente
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer
Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de
realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los
proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el
uso de un componente CSR, HP le enviará dicho componente directamente para que realice su
sustitución. Los componentes CSR se clasifican en dos categorías:
•
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita
a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de
desplazamiento y de mano de obra de dicho servicio.
•
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo,
si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del
tipo de servicio de garantía correspondiente al producto.
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para
que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios
autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra
"No" en el catálogo ilustrado de componentes.
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a
su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega
en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de
materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos
deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP,
deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los
componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje
de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En
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el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío
y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase
en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica,
visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Customer Self Repair
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner)
bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP
dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee
categorieën CSR-onderdelen:
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen,
kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor
het product.
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.
Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde
onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).
Reparo feito pelo cliente
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o
reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao
cliente. Existem duas categorias de peças CSR:
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança
de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após
o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode
ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte
técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a
peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for
necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente
cinco (5) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no
material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de
reparo feito pelo cliente, a HP paga todas as despesas de transporte e de devolução da peça e
determina a transportadora/serviço postal a ser utilizado.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com
o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP
(http://www.hp.com/go/selfrepair).
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Acronyms and abbreviations
ABEND
abnormal end
ACU
Array Configuration Utility
ADU
Array Diagnostics Utility
AMP
Advanced Memory Protection
ASR
Automatic Server Recovery
BBWC
battery-backed write cache
CSA
Canadian Standards Association
ESD
electrostatic discharge
IEC
International Electrotechnical Commission
iLO 3
Integrated Lights-Out 3
IML
Integrated Management Log
KVM
keyboard, video, and mouse
Acronyms and abbreviations
121
NIC
network interface controller
NVRAM
non-volatile memory
ORCA
Option ROM Configuration for Arrays
PCIe
peripheral component interconnect express
PCI-X
peripheral component interconnect extended
PDU
power distribution unit
PID
port ID
POST
Power-On Self Test
PSP
ProLiant Support Pack
QPI
QuickPath Interconnect
RBSU
ROM-Based Setup Utility
RDP
Rapid Deployment Pack
SAS
serial attached SCSI
SD
Secure Digital
Acronyms and abbreviations
122
SDDC
Single Device Data Correction
SFF
small form-factor
SIM
Systems Insight Manager
SMI
Scalable memory interfaces
SPI
system peripheral interface
TMRA
recommended ambient operating temperature
TPM
trusted platform module
UID
unit identification
UPS
uninterruptible power system
USB
universal serial bus
VCA
Version Control Agent
Acronyms and abbreviations
123
Index
A
AC power supply 112
access panel 26
ACU (Array Configuration Utility) 76
additional information 85
ADU (Array Diagnostic Utility) 82
airflow requirements 31
Altiris Deployment Solution 77
Altiris eXpress Deployment Server 77
Array Configuration Utility (ACU) 76
Array Diagnostic Utility (ADU) 82
ASR (Automatic Server Recovery) 78
authorized reseller 113
auto-configuration process 74
Automatic Server Recovery (ASR) 78
B
Basic Input/Output System (BIOS) 75, 78, 90
battery 15, 101
battery pack LEDs 20
battery replacement notice 106
battery-backed write cache (BBWC) 15, 20, 64
battery-backed write cache battery pack 64
BBWC (battery-backed write cache) 20, 64
beep codes 100
BIOS (Basic Input/Output System) 75, 78, 90
BIOS Serial Console 75
BIOS upgrade 78
board, SPI (System Peripheral Interface) 13, 15, 28
boot options 75
BSMI notice 105
buttons, front panel 7
C
cables 72, 88, 103
cabling, DVD-ROM drive 72
Canadian notice 104
capacitor pack 22, 66
Care Pack 30, 84
Change Control 84
Chinese notice 106
class A equipment 102
class B equipment 102
components, front panel 7, 9
components, identification 7
components, SPI board 15
components, system board 13, 14
configuration of system 34, 73
configuration tools 73
configuration utilities 73
connection problems 88
connector, USB 7
connector, video 7
contacting HP 113
creating a disk image 77
CSR (customer self repair) 113
customer self repair (CSR) 113
D
Declaration of Conformity 103
deployment software 77
diagnosing problems 85
diagnostic tools 77, 78, 81
diagnostics utility 81
DIMM installation guidelines 42
DIMM support 41
DIMMs 41, 42, 76
DIMMs, quad-rank 41
diskette image creation 77
disposal, battery 105, 106
drivers 83
DVD drive 72
E
electrical grounding requirements 32
electrostatic discharge 35, 110
environmental requirements 31, 111
environmental specifications 111
Erase Utility 79
error messages 100
European Union notice 104
expansion boards 55
expansion boards, non-hot-plug 55
expansion boards, shipping 56
expansion slots 13
Index 124
extending server from rack 25
external health LED 8
F
fans 23
FBWC module 22, 66
FCC rating label 102
features 7
Federal Communications Commission (FCC)
notice 102, 103
flowcharts 89, 90, 92, 95, 96, 98
front panel buttons 8
front panel components 7, 9
front panel LEDs 8
G
general diagnosis flowchart 90
grounding methods 110
grounding requirements 32
H
hard drive bays 7, 18
hard drive LEDs 19
hard drives, installing 51
hardware options 35
hardware options installation 33, 35
health driver 78
help resources 113
hemisphere mode 45
HP Insight Diagnostics 81
HP Insight Remote Support software 82
HP NC524SFP Dual Port 10GbE Module 62
HP ProLiant Essentials Foundation Pack 34, 80
HP ProLiant Essentials Rapid Deployment Pack 77
HP Systems Insight Manager overview 80
HP technical support 113
I
I/O expansion board components 16
identification number 102
iLO 2 (Integrated Lights-Out 2) 79
IML (Integrated Management Log) 82
Important Safety Information document 85
Insight Diagnostics 81, 83
installation services 30
installation, server options 33, 35
installing operating system 34
installing server 33
Integrated Lights-Out 2 (iLO 2) 79
Integrated Management Log (IML) 82
internal health LED 8
J
Japanese notice 105
K
Korean notices 106
L
laser compliance 106
laser devices 106
LED, external health 8
LED, internal health 8
LED, power button 8
LEDs, battery pack 20
LEDs, hard drive 19
LEDs, NIC 8
LEDs, power supply 12
LEDs, troubleshooting 85
LEDs, unit identification (UID) 8
loose connections 88
M
Management Agents 80
management tools 78
memory 18, 41, 49, 75, 76
memory cartridge population guidelines 44
memory expansion boards 18
memory options 35, 41
memory overview 41
memory performance optimization 46
memory RAS 47
memory subsystem architecture 45
memory, configuring 75, 76
memory, mirrored 76
memory, online spare 76
mirrored memory 76
modifications, FCC notice 103
N
NVRAM, clearing 14
O
Online ROM Flash Component Utility 79
operating systems 34, 84
Index 125
operations 25
optimum environment 31
Option ROM Configuration for Arrays (ORCA) 77
options installation 33, 35
ORCA (Option ROM Configuration for Arrays) 77
OS boot problems flowchart 96
P
PCI Express I/O expansion board, installing 58
PCI-X/PCI Express I/O expansion board,
installing 60
phone numbers 113
population guidelines 48, 49
population guidelines, Advanced ECC 48
population guidelines, mirrored memory 49
population guidelines, online spare 48
POST error messages 100
POST problems flowchart 95
power button 8
power cord 86, 107
power distribution unit (PDU) 32
Power On/Standby button 8, 25, 34
power requirements 32
power supply 53
power supply backplane components 23
power supply LEDs 12
powering down 25
powering up 25, 74
power-on problems flowchart 92
pre-diagnostic steps 85
preparation procedures 25, 88
problem diagnosis 85
processor memory module 17
processors 35
ProLiant Support Pack (PSP) 83
PSP (ProLiant Support Pack) 83
PSPs, overview 83
R
rack installation 30, 33
rack mounting hardware 33
rack resources 30
rack stability 86
rack warnings 33, 86
rack, extending server from 25
RBSU (ROM-Based Setup Utility) 73
RBSU configuration 74
rear panel buttons 11
rear panel components 10
rear panel LEDs 11
recommended ambient operating temperature
(TMRA) 31
recovery key 69
redundant ROM 80
registering the server 34
regulatory compliance identification numbers 102
regulatory compliance notices 102, 105
remote support and analysis tools 82
removing the processor memory drawer 27
required information 113
requirements, airflow 31
requirements, electrical grounding 32
requirements, environmental 31, 111
requirements, power 32
requirements, site 31
requirements, space 31
requirements, temperature 31
ROM redundancy 80
ROM, updating 79
ROM-Based Setup Utility (RBSU) 70, 73
ROMPaq utility 78, 80
S
safety considerations 33, 85
safety information 80
SAS device numbers 18
SAS hard drive 51
SAS hard drive LEDs 19
scripted installation 73
serial number 77
series number 102
server fault indications flowchart 98
server features and options 35
server options, installing 33, 35
server specifications 111
server, installation 33
service notifications 89
shipping carton contents 33
site requirements 31
SmartStart autorun menu 73
SmartStart Scripting Toolkit 73
SmartStart software 34
SmartStart, overview 73
space requirements 31
specifications, environmental 111
specifications, server 111
SPI (System Peripheral Interface) board 13, 15, 28
SSD drive, installing 54
start diagnosis flowchart 89
Index 126
static electricity 110
status lights, battery pack 20
StorageWorks Library and Tape Tools (L&TT) 80
support 82, 113
support packs 73
supported operating systems 84
switch, system maintenance 13
symbols on equipment 86
symptom information 87
system battery 15
system board components 13, 14
system board switches 14
system configuration settings 34, 73
system maintenance switch 13, 14
System Online ROM flash component utility 79, 84
system power LED 8, 20
system, keeping current 83
Systems Insight Display 7, 9
Systems Insight Display, ejecting 28
Systems Insight Manager 80
Version Control Repository Manager (VCRM) 83
video connector 7
W
website, HP 113
wireless devices 108, 109
T
Taiwan battery recycling notice 107
tape drive blank 7
TPM (Trusted Platform Module) 68, 69
technical support 113
telephone numbers 113
temperature requirements 31
three slot option card connectors 13
TMRA (recommended ambient operating
temperature) 31
troubleshooting flowcharts 89
troubleshooting resources 85
Trusted Platform Module (TPM) 68, 69
U
UID LED 8
uninterruptible power supply (UPS) 32
universal serial bus (USB) 7
updating the system ROM 80
UPS (uninterruptible power supply) 32
USB connectors 7
USB support 81
utilities, deployment 73, 77
V
ventilation 31
Version Control 83
Version Control Agent (VCA) 83
Index 127