Detailed Technical USER MANUAL FOR:
3.5”-SBC
MSB900/L
Nordstrasse 11/F
CH- 4542 Luterbach
Tel.:
++41 (0)32 681 58 00
Fax:
++41 (0)32 681 58 01
Email:
support@digitallogic.com
Homepage: http://www.digitallogic.com
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
For internal use only:
File:
Path:
MSB900_Detailed_V1.0
R:\HANDBUCH\MSB\MSB900\MSB900_Detailed_V1.0.doc
COPYRIGHT  2008 BY DIGITAL-LOGIC AG
This publication is protected by copyright and all rights are reserved. No part of this document may be reproduced, transmitted, transcribed or stored in a retrieval system, in any form or by any means, electronic, mechanical, optical, manual, or otherwise, without the prior written permission of DIGITAL-LOGIC AG.
The software described herein, together with this document, are furnished under a license agreement and
may be used or copied only in accordance with the terms of that agreement.
About this Manual and How to Use It
This manual is written for the original equipment manufacturer (OEM) who plans to build computer systems
based on the single board MICROSPACE-PC. It is for integrators and programmers of systems based on the
MICROSPACE-Computer family. This manual provides instructions for installing and configuring the board,
and describes the system and setup requirements. This document contains information on hardware requirements, interconnections, and details of how to program the system. Please check the Product CD for
further information and manuals.
REVISION HISTORY:
Document
Version
V1.0
Date/Initials:
02.2008 DAR
Modification:
Remarks, News, Attention:
Initial document
Attention!
1. All information in this manual, and the product, are subject to change without prior notice.
2. Read this manual prior to installation of the product.
3. Read the security information carefully prior to installation of the product.
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
Table of Contents
1.
Preface.......................................................................................................................5
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
1.7.
1.8.
1.9.
1.10.
1.11.
Trademarks ................................................................................................................... 5
Disclaimer ..................................................................................................................... 5
Environmental Protection Statement .......................................................................... 5
Who should use this Product....................................................................................... 5
Recycling Information .................................................................................................. 6
Technical Support......................................................................................................... 6
Limited Two Year Warranty.......................................................................................... 6
Explanation of Symbols ............................................................................................... 7
Applicable Documents and Standards........................................................................ 8
For Your Safety ............................................................................................................. 9
RoHS Commitment ....................................................................................................... 9
1.11.1.
1.11.2.
1.11.3.
1.12.
1.13.
2.
RoHS Compatible Product Design ......................................................................................... 10
RoHS Compliant Production Process .................................................................................... 10
WEEE Application .................................................................................................................. 10
Swiss Quality .............................................................................................................. 11
The Swiss Association for Quality and Management Systems ............................... 11
Overview..................................................................................................................12
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
2.7.
Standard Features of the MSB900/L .......................................................................... 12
Unique Features.......................................................................................................... 12
MSB900 Block Diagram .............................................................................................. 13
MSB900/MSB900L specifications .............................................................................. 14
Examples of Ordering Codes ..................................................................................... 16
Related Application Notes.......................................................................................... 16
Dimensions & Diagrams............................................................................................. 17
2.7.1.
2.7.2.
2.8.
2.9.
2.10.
2.11.
MSB900/L .................................................................................................................................. 17
MSB800CON Part Nr 802205.................................................................................................... 21
MSB900/L Incompatibilities to a standard PC/AT ..................................................... 22
Related Application Notes.......................................................................................... 22
High Frequency Radiation (to meet EN55022) .......................................................... 22
Battery-Lifetime .......................................................................................................... 23
2.11.1.
3.
External battery assembling (for the MSB900L): ................................................................... 23
Bus Signals .............................................................................................................23
3.1.
Addressing PCI Devices............................................................................................. 23
3.1.1.
MSB900 and MSB900L ............................................................................................................. 23
4.
BIOS History............................................................................................................24
5.
Detailed System Description .................................................................................25
5.1.
5.2.
5.3.
5.3.1.
5.3.2.
5.3.3.
5.4.
5.4.1.
5.4.2.
5.4.3.
5.4.4.
5.5.
5.5.1.
5.6.
5.6.1.
5.6.2.
Power Requirements .................................................................................................. 25
Boot Time .................................................................................................................... 25
CPU, Boards and RAMs.............................................................................................. 26
CPUs of this MICROSPACE Product ........................................................................................ 26
Numeric Coprocessor ................................................................................................................ 26
DDRAM Memory........................................................................................................................ 26
Interfaces..................................................................................................................... 26
Keyboard AT compatible and PS/2 Mouse................................................................................ 26
Line Printer Port LPT1 ............................................................................................................... 26
Serial Ports COM1-COM2 ......................................................................................................... 27
Floppy Disk Interface ................................................................................................................. 27
Controllers................................................................................................................... 27
Interrupt Controllers ................................................................................................................... 27
Timers and Counters .................................................................................................. 28
Programmable Timers ............................................................................................................... 28
RTC (Real Time Clock).............................................................................................................. 28
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DIGITAL-LOGIC AG
5.6.3.
5.6.4.
5.6.5.
5.7.
5.8.
Watchdog ................................................................................................................................... 28
ROM-BIOS Sockets ................................................................................................................... 28
BIOS CMOS Setup .................................................................................................................... 29
CMOS RAM Map.......................................................................................................... 29
EEPROM saved CMOS Setup..................................................................................... 34
5.8.1.
5.9.
EEPROM Memory for Setup...................................................................................................... 35
Memory & I/O Map....................................................................................................... 35
5.9.1.
5.9.2.
6.
MSB900/L Detailed Technical Manual V1.0
System Memory Map ................................................................................................................. 35
System I/O map ......................................................................................................................... 36
VGA ..........................................................................................................................40
6.1.
6.2.
VGA/LCD Controller of the Geode LX900.................................................................. 40
Graphic Modes............................................................................................................ 40
7.
Video Input ..............................................................................................................41
8.
Description of the connectors ...............................................................................41
9.
Jumper Locations on the Board ............................................................................53
9.1.
9.2.
10.
The Jumpers on MSB900/L ........................................................................................ 53
Reload Default BIOS Settings .................................................................................... 53
Cable Interfaces ......................................................................................................55
10.1.
10.2.
10.3.
11.
Thermal Specifications...........................................................................................58
11.1.
12.
The Hard Disk Cable 44pin......................................................................................... 55
The COM1/LPT Serial Interface Cable ....................................................................... 56
The COM2 Serial Interface Cable ............................................................................... 57
Thermal Analysis for Case Integration...................................................................... 58
Assembly Views......................................................................................................59
12.1.
12.2.
MSB900/L .................................................................................................................... 59
Mechanical Dimensions ............................................................................................. 61
13.
PXE-Boot and PXE-Setup in the BIOS ..................................................................62
14.
PXE-License Order .................................................................................................64
15.
Index ........................................................................................................................65
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
1. PREFACE
The information contained in this manual has been carefully checked and is believed to be accurate; it is
subject to change without notice. Product advances mean that some specifications may have changed.
DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may
appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or
application of any circuit or product described herein.
1.1.
Trademarks
DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks
owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include
names, company logos, and registered trademarks which are, therefore, proprietary to their respective owners.
1.2.
Disclaimer
DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and
specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITALLOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damage.
1.3.
Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements wherever possible.
Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capable of being recycled. Final disposal of this product after its service life must be accomplished in accordance
with applicable country, state, or local laws or regulations.
1.4.
Who should use this Product
Electrical engineers with know-how in PC-technology.
Because of the complexity and the variability of PC-technology, we cannot guarantee that the product
will work in any particular situation or set-up. Our technical support will try to help you find a solution.
Pay attention to electrostatic discharges; use a CMOS protected workplace.
Power supply must be OFF when working on the board or connecting any cables or devices.
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DIGITAL-LOGIC AG
1.5.
MSB900/L Detailed Technical Manual V1.0
Recycling Information
All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances
Directive). The product is soldered with a lead free process.
1.6.
Technical Support
1.
Contact your local DIGITAL-LOGIC Technical Support, in your country.
2.
Use the Internet Support Request form at http://support.digitallogic.ch/ embedded products New Support Request
Support requests are only accepted with detailed information about the product (i.e., BIOS-, Boardversion)!
1.7.
Limited Two Year Warranty
DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be
free from defects in materials and workmanship for two years following the date of shipment from DIGITALLOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not transferable.
During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any defective product or part at no additional charge, provided that the product is returned, shipping prepaid, to
DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.
Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland are required to register a RMA (Return Material Authorization) number in the Support Center at
http://support.digitallogic.ch/
All other customers must contact their local distributors for returning defective materials.
This limited warranty does not extend to any product which has been damaged as a result of accident, misuse, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or insufficient
ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or other contingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as a result of
service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient knowledge
of these technologies or has not consulted the product manuals or the technical support of DIGITAL-LOGIC
AG and therefore the product has been damaged.
Empty batteries (external and onboard), as well as all other battery failures, are not covered by this manufacturer’s limited warranty.
Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to,
any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG expressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be liable
to the purchaser or any user for any damage, including any incidental or consequential damage, expenses,
lost profits, lost savings, or other damages arising out of the use or inability to use the product.
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DIGITAL-LOGIC AG
1.8.
MSB900/L Detailed Technical Manual V1.0
Explanation of Symbols
CE Conformity
This symbol indicates that the product described in this manual is in compliance with all applied CE standards.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the
law may endanger your life/health and/or result in damage to your equipment.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 32V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the
law may endanger your life/health and/or result in damage to your equipment
Warning, ESD Sensitive Device!
This symbol and title inform that electronic boards and their components are sensitive to
Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must
always be taken while handling and examining this product.
Attention!
This symbol and title emphasize points which, if not fully understood and taken into consideration by the reader, may endanger your health and/or result in damage to your equipment.
Note...
This symbol and title emphasize aspects the user should read through carefully for his, or
her, own advantage.
Warning, Heat Sensitive Device!
This symbol indicates a heat sensitive component.
Safety Instructions
This symbol shows safety instructions for the operator to follow.
This symbol warns of general hazards from mechanical, electrical,
and/or chemical failure. This may endanger your life/health and/or
result in damage to your equipment.
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DIGITAL-LOGIC AG
1.9.
MSB900/L Detailed Technical Manual V1.0
Applicable Documents and Standards
The following publications are used in conjunction with this manual. When any of the referenced specifications are superseded by an approved revision, that revision shall apply. All documents may be obtained from
their respective organizations.
Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright
© 1996-2003 Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Technologies Ltd., Toshiba Corporation. All rights reserved. http://www.acpi.info/
ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, January 1, 2001. http://www.ansi.org/
ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.
http://www.ansi.org/
ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached
SCSI (SAS), October 30, 2003. http://www.ansi.org/
Audio Codec ’97 Revision 2.3 Revision 1.0, April 2002 Copyright © 2002 Intel Corporation. All rights
reserved. http://www.intel.com/labs/media/audio/
Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August
14, 1998 Copyright © 1998 Video Electronics Standards Association. All rights reserved.
http://www.vesa.org/summary/sumddcci.htm
ExpressCard Standard Release 1.0, December 2003 Copyright © 2003 PCMCIA. All rights reserved.
http://www.expresscard.org/
IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information exchange between systems–Local and metropolitan area networks–Specific requirements – Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer
Specifications. http://www.ieee.org
IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision
Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access
Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.
http://www.ieee.org
Intel Low Pin Count (LPC) Interface Specification Revision 1.1, August 2002 Copyright © 2002 Intel
Corporation. All rights reserved. http://developer.intel.com/design/chipsets/industry/lpc.htm
PCI Express Base Specification Revision 1.1, March 28, 2005, Copyright © 2002-2005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005, Copyright © 20022005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright © 1992, 1993, 1995, 1998, 2002
PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI-104 Specification, Version V1.0, November 2003. All rights reserved. http://www.pc104.org
PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004,
PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wakefield, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/
Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 20002003, APT Technologies, Inc, Dell Computer Corporation, Intel Corporation, Maxtor Corporation, Seagate Technology LLC. All rights reserved. http://www.sata-io.org/
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
Smart Battery Data Specification Revision 1.1, December 11, 1998. www.sbs-forum.org
System Management Bus (SMBus) Specification Version 2.0, August 3, 2000 Copyright © 1994, 1995,
1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear
Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, PowerSmart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.
http://www.smbus.org/
Universal Serial Bus Specification Revision 2.0, April 27, 2000 Copyright © 2000 Compaq Computer
Corporation, Hewlett-Packard Company, Intel Corporation, Lucent Technologies Inc., Microsoft Corporation, NEC Corporation, Koninklijke Philips Electronics N.V. All rights reserved. http://www.usb.org/
1.10. For Your Safety
Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features necessary to ensure its compliance with electrical safety requirements. It was also designed for a long,
fault-free life. However, this life expectancy can be drastically reduced by improper treatment during
unpacking and installation. Therefore, in the interest of your own safety and for the correct operation
of your new DIGITAL-LOGIC product, please comply with the following guidelines.
Attention!
All work on this device must only be carried out by sufficiently skilled personnel.
Caution, Electric Shock!
Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is
switched off. This applies also to the installation of piggybacks or peripherals. Serious electrical shock hazards can exist during all installation, repair and maintenance operations with this
product. Therefore, always unplug the power cable and any other cables which provide
external voltage before performing work.
Warning, ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. In order to ensure
product integrity at all times, be careful during all handling and examinations of this product.
1.11. RoHS Commitment
DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the
Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic
Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was
adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a
directive, which restricts the use of six hazardous materials in the manufacturing of various types of electronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment Directive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods and
is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.
Each European Union member state is adopting its own enforcement and implementation policies using the
directive as a guide. Therefore, there could be as many different versions of the law as there are states in the
EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have their
own regulations for green products, which are similar, but not identical, to the RoHS directive.
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:
Lead
Mercury
Cadmium
Chromium VI
PBB and PBDE
The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for Cadmium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not apply
to the weight of the finished product, or even to a component but to any single substance that could (theoretically) be separated mechanically.
1.11.1. RoHS Compatible Product Design
All DIGITAL-LOGIC standard products comply with RoHS legislation.
Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and mechanical components during the design-in phase of all DIGITAL-LOGIC standard products.
1.11.2. RoHS Compliant Production Process
DIGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These
capabilities are verified by:
1. A confirmation from the supplier indicating that their production processes and resulting devices are
RoHS compliant.
2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned substances in a produced device will be measured. These measurements are carried out by an accredited laboratory.
1.11.3. WEEE Application
The WEEE directive is closely related to the RoHS directive and applies to the following devices:
Large and small household appliances
IT equipment
Telecommunications equipment (although infrastructure equipment is exempt in some countries)
Consumer equipment
Lighting equipment – including light bulbs
Electronic and electrical tools
Toys, leisure and sports equipment
Automatic dispensers
It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that
brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to
product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end
users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to properly recycle all electronic products that have reached the end of their life cycle.
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
1.12. Swiss Quality
100% Made in Switzerland
DIGITAL-LOGIC is a member of "Swiss-Label"
This product was not manufactured by employees earning
piecework wages
This product was manufactured in humane work conditions
All employees who worked on this product are paid
customary Swiss market wages and are insured
ISO 9000:2001 (quality management system)
1.13. The Swiss Association for Quality and Management Systems
The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment
services for all types of industries and services. SQS certificates are accepted worldwide thanks to accreditation by the Swiss Accreditation Service (SAS), active membership in the International Certification Network,
IQNet, and co-operation contracts/agreements with accredited partners.
www.sqs.ch
The SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field
of development, manufacturing and sales of embedded computer boards, embedded computer modules and
computer systems. The certification is valid for three years at which time an audit is performed for recertification.
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
2. OVERVIEW
2.1.
Standard Features of the MSB900/L
The MICROSPACE 3.5”-SBC is a miniaturized modular device incorporating the major elements of a PC/AT
compatible computer. It includes standard PC/AT compatible elements, such as:
2.2.
Powerful GEODE LX-900 600MHz
Legacy BIOS ROM
DDR-SODIMM 200pin socket (for DDR-RAM 256-1024MB)
128k second level cache
Timers
DMA
Real-time clock with CMOS-RAM and battery buffer (only on MSB900, not on MSB900L)
LPT1 parallel port
COM1-, COM2- RS2332 serial port
Speaker interface
PS/2-keyboard and mouse interface (shared on one mini DIN connector)
PATA-IDE hard disk interface
VGA video interface
PCI/104 (one slot), limited I/O connector space
4 Channels USB 2.0
Onboard CF socket Type II
Unique Features
The MICROSPACE 3.5”-SBC includes all standard PC/AT functions plus unique DIGITAL-LOGIC AG enhancements, such as:
Two channel LAN Ethernet, INTEL 82551QM (LAN A) and INTEL 82551ER (LAN B)
Boot from LAN (PXE and RPL)
Single 8 - 32Volt supply
Video input (only on MSB900, not available on MSB900L)
Watchdog
EEPROM for setup and configuration
UL approved parts
Optional: interface for operator display (LVDS, COM2, CRT, USB, SMBus)
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DIGITAL-LOGIC AG
2.3.
MSB900/L Detailed Technical Manual V1.0
MSB900 Block Diagram
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DIGITAL-LOGIC AG
2.4.
MSB900/L Detailed Technical Manual V1.0
MSB900/MSB900L specifications
CPU
CPU
CPU Core Supply
Mode
Compatibility
Word Size
Secondary Cache
Physical Addressing
Virtual Addressing
Clock Rates
Socket Standard
Specification
GEODE LX900
1.25V very low powered
Real / Protected
x86
32Bits
128kB
32 lines
16GB
600MHz
Soldered BGA
Chipset
Northbridge
Southbridge
LAN
Audio
Codec
Firewire IEEE1394
Video
Specification
AMD LX900
AMD CS5536
2x 10/100Mbit Intel 82551QM (LAN A), Intel 82551ER (LAN B)
Stereo In and Stereo Line-Out
AD1985 up to 96kHz sampling rate, 16Bit (Analog Devices)
Not on board
16MByte Video-DDRAM
Power Management:
Specification
The LX900 supports ACPI and APM Version 1.2
The following ACPI Sleep States are supported:
- S1 (Standby)
- S3 (Suspend to RAM) not available
- S4 (Hibernation)
DMA:
8237A comp.
Specification
4 channel 8bit
3 channel 16bit
Interrupts:
8259 comp.
Specification
8 + 7 levels
PC compatible
Timers:
8254 comp.
Specification
3 programmable counters/timers
Memory:
SODIMM
Specification
SODIMM200pin DDR PC2700 333MHz 256-1024MByte
Video
Controller
BUS
Enhanced BIOS
Memory
CRT-Monitor
Video Input
Specification
GEODE LX900
32Bit high speed 33MHz PCI bus
VGA / LCD BIOS
2-16MByte shared RAM
VGA, SVGA up to 1920x1440
MSB900: yes, 1 channel
MSB900L: no
WIN2000, XP
Drivers
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
Mass Storage
FD
HD
Specification
Floppy disk interface not supported
E-IDE interface, AT-type, for max. 2 hard disks, 44pin connector,
for 1.3, 1.8 and 2.5" hard disk with 44 pins IDE
Standard AT Interfaces:
SuperIO Chip
Parallel
Keyboard
Mouse
Speaker
RTC
Backup current
RTC-backup MSB900
RTC-backup MSB900L
Specification
Name
FIFO
IRQs
Addr.
Standard Option
COM1
yes
IRQ4
3F8
RS232C
COM2
yes
IRQ3
2F8
RS232C
COM1/2 available on headers onboard.
For DSub-connectors, option MSB800-CON is needed.
W83627HF from WINBOND
LPT1 printer interface mode: SPP (output), EPP (bidir.)
AT or PS/2-keyboard
PS/2
No speaker
Integrated into the chipset, RTC with CMOS-RAM 256Byte
<5 µA
Onboard 3.6Volt Lithium 400mAh available
External connection, no onboard battery available
BUS
PCI/104
Clock
Specification
PCI 32Bit Bus, 1 slot
33MHz defined by the GEODE
USB
USB
Transfer rate
Channels
Specification
2.0
480MBps, 12.5MBps / 1.5MBps
4
Peripheral Extension
ISA
PCI MSB900
PCI MSB900L
Specification
Not supported
With PCI/104 BUS (1 slot), limited I/O space
Not available
Power Supply
Working
Power Rise Time
Power consumption
Specification
8-32Volt ± 5% (peak 36Volt)
Unspecified
MSB900/L with HD, MS/KB (PS/2), CRT Monitor
Windows XP Desktop: type 8.5-10W
MSB900/L:
Windows Standby: 2.5W (without MS/KB wakeup function)
Windows Standby: 4.5W (with PS/2 wakeup function)
Serial
Standby power consumption
Physical Characteristics
Dimensions
Weight
PCB Thickness
PCB Layer
Specification
Length: 146 mm
Depth: 102 mm
Height: 20 mm
160g
1.6mm / 0.0625 inches nominal
Multilayer
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DIGITAL-LOGIC AG
Operating Environment
Relative humidity
Vibration
Shock
Temperature
MSB900/L Detailed Technical Manual V1.0
Specification
5-90%, non-condensing
5-2000Hz, 0.1G
1G
MSB900*:
Operating: Standard version: -25°C to +70°C
Extended version: -40°C to +85°C
Storage:
-55°C to +85°C
* = with passive cooler
MSB900L**:
Operating: Standard version: 0°C to +60°C
Storage:
-55°C to +85°C
** = without passive cooler
EMI/EMC (IEC1131-2 refer MIL
461/462)
ESD Electro Static Discharge
REF Radiated Electromagnetic Field
EFT Electric Fast Transient (Burst)
SIR Surge Immunity Requirements
High-frequency Radiation
Compatibility
MSB900/L
Specification
IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
Metallic protection needed
Separate ground layer included
15kV single peak
IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9. (not tested)
IEC 801-4, EN50082-1, VDE 0843 Part 4
250V - 4kV, 50 ohms, Ts=5ns
Grade 2: 1kV Supply, 500 I/O, 5kHz
IEC 801-5, IEEE587, VDE 0843 Part 5
Supply:
2kV, 6 pulse/minute
I/O:
500V, 2 pulse/minute
FD, CRT: none
EN55022
Specification
Mechanically compatible to 3.5inch industrial embedded computer boards
All information is subject to change without notice.
2.5.
802220
802221
802205
Examples of Ordering Codes
MSB900 with LX900 CPU, 0MB-RAM, Battery, PCI/104 and Video input
MSB900L with LX900 CPU, 0MB RAM, …
MSB800CON COM1, LPT1 Expansion board.
These are only examples; for current ordering codes, please see the current price list.
2.6.
Related Application Notes
Application Notes are available at http://www.digitallogic.com support, or on any DIGITAL-LOGIC
Application CD.
#
Description
16
DIGITAL-LOGIC AG
2.7.
2.7.1.
MSB900/L Detailed Technical Manual V1.0
Dimensions & Diagrams
MSB900/L
Board / Version
MSB900/L
Unit:
mm (millimeter)
Tolerance:
+ / - 0.1mm
17
Date / Author
25.10.2006 / BRR
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
18
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
19
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
20
DIGITAL-LOGIC AG
2.7.2.
MSB900/L Detailed Technical Manual V1.0
MSB800CON Part Nr 802205
Board / Version
MSB800CON
Unit:
mm (millimeter)
Tolerance:
+ / - 0.1mm
21
Date / Author
25.10.2006 / BRR
DIGITAL-LOGIC AG
2.8.
MSB900/L Detailed Technical Manual V1.0
MSB900/L Incompatibilities to a standard PC/AT
None.
2.9.
Related Application Notes
Application Notes are available at http://www.digitallogic.com support, or on any DIGITAL-LOGIC
Application CD.
#
Description
2.10. High Frequency Radiation (to meet EN55022)
All connectors are filtered onboard to comply with the EMI standards.
The following filters are used:
Interface
3dbFrequency
Inductivity
L and R
Ferrite
33ohms
Ferrite
Capacitor
to GND
2x 10pF
33pF
1nF
Filter-Type
-
-
-
None
USB
Inductors
none
DLP31D
Diode SRV05-4
GND/5V
IDE
33ohms series
-
-
None
Sound I/O
Ferrite
1nF
None
PS2-KB
PS2-MS
PS2-VCC
PS2-GND
Ferrite
Ferrite
Ferrite
Ferrite
47pF
47pF
1nF
1nF
None
None
None
None
47pF
47pF
47pF
MAX211E
MAX211E
none
VGA-RGB
VGA-HS/VS
VGA-VCC
Video Input
-
COM1
COM2
LPT1
LAN
Integrated
PULSE
All 33MHz-Clocks
33Ohms series
10pF
22
Protection
0V/3V Diode
0V/3V Diode
None
J00-0065NL
Isolated 500V
None
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
2.11. Battery-Lifetime
Battery specs:
Lowest temp.
-40°C
Nominal temp.
+20°C
Highest temp.
+85°C
400mAh
3.6V
350mAh
Ca. 3.6V
VCC (+5)
switched ON
µA
<1
VCC (+5V)
switched off
µA
<3
>3.5 years
>3.5 year
Manufacturer:
pba
Type:
ER10280
Capacity versus Temp:
10uA
420mAh
Voltage versus Temp.
10uA
3.6V
Nominal values:
3.6V / 400mAh @ 0.5mA / -55°C...~+85°C
Information taken from the datasheet of ER10280
PRODUCT:
Temperature
°C
Battery voltage
V
Battery current:
+25°C
3.6
Battery-Lifetime:
+25°C
2.11.1. External battery assembling (for the MSB900L):
On the MSB900L board, an external battery can be connected to J3. Attach the battery ground to pin 2.
If the customer wants to connect an external battery, then some precautions have to be taken:
The battery is prohibited from charging. Do not use a rechargeable battery!
The RTC device defines a voltage level of 3.0-3.6V, so use an external battery within this range (inclusive of
the diode which is pre-assembled onboard).
3. BUS SIGNALS
3.1.
3.1.1.
Addressing PCI Devices
MSB900 and MSB900L
DEVICE
SLOT 1
IDSEL
AD20
PIRQ
A/B/C/D
#REG #GNT
Remarks
3
3
For additional cards (peripheral boards)
Onboard used:
LAN A
LAN B
Mini-PCI
AD28
AD29
AD27
C
A
A/B
1
4
5
1
4
5
Onboard device
Onboard device
Optional device
CPU
AD11
A
2
2
Onboard device
23
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
4. BIOS HISTORY
This BIOS history is for the MSB900/L.
This BIOS history is not for the following products:
MSEP900, MSM900, SM900
Version:
1.23
Date:
02.2007
Status:
Initial Release
Modifications:
-
Note…
This product has a unique BIOS version. For a description of the other features of the BIOS, please
refer to the driver/software/BIOS manual “GEODE_LX800-LX900” on the Product CD.
24
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
5. DETAILED SYSTEM DESCRIPTION
This system configuration is based on the ISA architecture. Check the I/O and memory map in this chapter.
5.1.
Power Requirements
The power is connected through the wide-range power connector. The supply uses only the +8V to +32V
and the ground connection.
Attention:
Make sure the power plug is wired correctly before supplying power to the board! A built-in diode
protects the board against reverse polarity.
Tolerance of supply:
Must be within 8-32Volt norm.
Test environment for power consumption measurement:
Peripheries:
Hard disk Hitachi Model HTA422020F9ATJ0 20GB
Monitor Eizo Flexscan F340I-W
PS/2-KB Logitech Model iTouch Keyboard
PS/2-MS Logitech Model M-CAA43
Software:
MS-DOS V6.22
WinXP
Current consumption @ 12Volt supply at -40°C/+25°C/+85°C
Mode
MSB900-600MHz
DOS: C:\
Memory
1GB
+25°C
[mA]
700
WinXP: Desktop
1GB
700
5.2.
DLAG-Nr.
-30 °C
[mA]
+85 °C
[mA]
Boot Time
System Boot-Times
Definitions/Boot-Medium
MSB900-600MHz
From hard disk Hitachi Model J4K20-20:
Boot from hard disk to “Starting MS-DOS”.-Prompt
Boot from hard disk to XP desktop
Booting without a storage device (only BIOS)
25
Quick Boot
time [s]
Normal Boot
time [s]
-
15
45
10
DIGITAL-LOGIC AG
5.3.
MSB900/L Detailed Technical Manual V1.0
CPU, Boards and RAMs
5.3.1.
CPUs of this MICROSPACE Product
Processor:
GEODE LX900
5.3.2.
Type:
National
Clock:
600 MHz
Numeric Coprocessor
It is integrated in the LX900 CPU.
5.3.3.
DDRAM Memory
Speed:
Size:
Bits:
Capacity:
Bank:
5.4.
5.4.1.
333
DDR-SODIMM
DDRDIMM 200pin
64bit
256-1024MBytes
DDR-SODIMM
1
Interfaces
Keyboard AT compatible and PS/2 Mouse
The PS/2 Keyboard and Mouse are combined on the PS2-connector. It is needed to use a Y-Cable to connect both, the mouse and the keyboard.
5.4.2.
Line Printer Port LPT1
A standard bi-directional LPT port is integrated into the MICROSPACE PC.
Further information about these signals is available in numerous publications, including the IBM technical
reference manuals for the PC and AT computers and from other reference documents.
26
DIGITAL-LOGIC AG
5.4.3.
MSB900/L Detailed Technical Manual V1.0
Serial Ports COM1-COM2
The serial channels are fully compatible with 16C550 UARTS. COM1 is the primary serial port, and is supported by the board's ROM-BIOS as the PC-DOS 'COM1' device. The secondary serial port is COM2; it is
supported as the 'COM2' device.
Standard: COM 1/2: National PC87317VUL:
2 x 16C550 compatible serial interfaces
Serial Port Connectors COM1, COM2
Pin
1
2
3
4
5
6
7
8
9
Signal Name
CD
DSR
RXD
RTS
TXD
CTS
DTR
RI
GND
Function
Data Carrier Detect
Data Set Ready
Receive Data
Request To Send
Transmit Data
Clear to Send
Data Terminal Ready
Ring Indicator
Signal Ground
in/out
in
in
in
out
out
in
out
in
DB25 Pin
8
6
3
4
2
5
20
22
7
DB9 Pin
1
6
2
7
3
8
4
9
5
The serial port signals are compatible with the RS232C specifications.
5.4.4.
Floppy Disk Interface
This is not available with this product; use a USB Floppy.
5.5.
Controllers
5.5.1.
Interrupt Controllers
An 8259A compatible interrupt controller, within the chipset, provides seven prioritized interrupt levels. Of
these, several are normally associated with the board's onboard device interfaces and controllers, and several are available on the AT expansion bus.
Interrupt:
IRQ0
IRQ1
IRQ2
IRQ3
IRQ4
IRQ5
IRQ6
IRQ7
IRQ8
IRQ9
IRQ10
IRQ11
IRQ12
IRQ13
IRQ14
IRQ15
Sources:
ROM-BIOS clock tick function, from timer 0
Keyboard controller output buffer full
Used for cascade 2. 8259
COM2 serial port
COM1 serial port
LPT2 parallel printer (if present)
Floppy controller
LPT1 parallel printer
Battery backed clock
Free for user
Free for user
Free for user
PS/2 mouse
Math. coprocessor
Hard disk IDE
Free for user
27
Onboard used:
yes
yes
yes
yes
yes
no *
yes
yes
yes
no *
no *
no *
yes
yes
yes
no *
* It may depend on the LAN configuration.
DIGITAL-LOGIC AG
5.6.
5.6.1.
MSB900/L Detailed Technical Manual V1.0
Timers and Counters
Programmable Timers
An 8253 compatible timer/counter device is also included in the board's ASIC device. This device is utilized
in precisely the same manner as in a standard AT implementation. Each channel of the 8253 is driven by a
1.190 MHz clock, derived from a 14.318 MHz oscillator, which can be internally divided in order to provide a
variety of frequencies.
Timer 2 can also be used as a general purpose timer if the speaker function is not required.
Timer Assignment
Timer
0
1
2
Function
ROM-BIOS clock tick (18.2Hz)
DRAM refresh request timing (15 µs)
Speaker tone generation time base
5.6.2.
RTC (Real Time Clock)
An AT compatible date/time clock is located within the chipset. The device also contains a CMOS static
RAM, compatible with that in standard ATs. System configuration data is normally stored in the clock chip's
CMOS RAM in a manner consistent with the convention used in other AT compatible computers. To attach
an external battery on a MSB900L board refer to section 2.11.1.
5.6.3.
Watchdog
The watchdog timer detects a system crash and performs a hardware reset. After power up, the watchdog is
always disabled as the BIOS does not send strobes to the watchdog. In case the user wants to take advantage of the watchdog, the application must produce a strobe at least every 800 ms. If no strobe occurs within
the 800 ms, the watchdog resets the system.
For more information, please refer to the driver/software/BIOS manual “GEODE_LX800-LX900” on the Product CD. The watchdog feature is integrated in the INT15 function.
There are some programming examples available:
Product CD-Rom or customer download area: \tools\SM855\int15dl\…
5.6.4.
ROM-BIOS Sockets
An EPROM socket with 8bit wide data access normally contains the board’s AT compatible ROM-BIOS. The
socket takes a 29F020 EPROM (or equivalent) device. The board's wait-state control logic automatically inserts four memory wait states in all CPU accesses to this socket. The ROM-BIOS sockets occupy the memory area from C0000H through FFFFFh; however, the board's ASIC logic reserves the entire area from
C0000h through FFFFFh for onboard devices, so that this area is already usable for ROM-DOS and BIOS
expansion modules. Consult the appropriate address map for the MICROSPACE PC-Product ROM-BIOS
sockets.
28
DIGITAL-LOGIC AG
5.6.4.1.
Standard BIOS ROM
Device:
FWH
Map:
E0000 - FFFFFh
C0000 - C7FFFh
CC000 - CFFFFh
5.6.5.
MSB900/L Detailed Technical Manual V1.0
Core BIOS 128k
VGA BIOS 32k
FREE
BIOS CMOS Setup
If wrong setups are memorized in the CMOS-RAM, the default values will be loaded after resetting the
RTC/CMOS-RAM by de-soldering the battery.
If the battery is down, it is always possible to start the system with the default values from the BIOS.
5.7.
CMOS RAM Map
Systems based on the industry-standard specification include a battery backed Real Time Clock chip. This
clock contains at least 64Bytes of non-volatile RAM. The system BIOS uses this area to store information
including system configuration and initialization parameters, system diagnostics, and the time and date. This
information remains intact even when the system is powered down.
The BIOS supports 128Bytes of CMOS RAM. This information is accessible through I/O ports 70h and 71h.
CMOS RAM can be divided into several segments:
Locations 00h - 0Fh contain the real time clock (RTC) and status information
Locations 10h - 2Fh contain system configuration data
Locations 30h - 3Fh contain system BIOS-specific configuration data as well as chipset-specific information
Locations 40h - 7Fh contain chipset-specific information as well as power management configuration
parameters
The following table provides a summary of how these areas may be further divided.
Beginning
Ending
Checksum
Description
00h
10h
2Eh
30h
34h
40h
5Ch
5Eh
6Fh
7Eh
0Fh
2Dh
2Fh
33h
3Fh
5Bh
5Dh
6Eh
7Dh
7Fh
No
Yes
No
No
No
Yes
No
No
Yes
No
RTC and Checksum
System Configuration
Checksum Value of 10h - 2Dh
Standard CMOS
Standard CMOS - SystemSoft Reserved
Extended CMOS - Chipset Specific
Checksum Value of 40h - 5Bh
Extended CMOS - Chipset Specific
Extended CMOS - Power Management
Checksum Value of 6Fh - 7Dh
29
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
CMOS Map
Location
00h
Description
Time of day (seconds) specified in BCD
01h
Alarm (seconds) specified in BCD
02h
Time of day (minutes) specified in BCD
03h
Alarm (minutes) specified in BCD
04h
Time of day (hours) specified in BCD
05h
Alarm (hours) specified in BCD
06h
Day of week specified in BCD
07h
Day of month specified in BCD
08h
Month specified in BCD
09h
Year specified in BCD
0Ah
Status Register A
Bit 7
= Update in progress
Bits 6-4 = Time based frequency divider
Bits 3-0 = Rate selection bits that define the periodic
interrupt rate and output frequency.
0Bh
Status Register B
Bit 7
= Run/Halt
0 Run
1 Halt
Bit 6
= Periodic Timer
0 Disable
1 Enable
Bit 5
= Alarm Interrupt
0 Disable
1 Enable
Bit 4
= Update Ended Interrupt
0 Disable
1 Enable
Bit 3
= Square Wave Interrupt
0 Disable
1 Enable
Bit 2
= Calendar Format
0 BCD
1 Binary
Bit 1
= Time Format
0 12-Hour
1 24-Hour
Bit 0
= Daylight Savings Time
0 Disable
1 Enable
0Ch
Status Register C
Bit 7
= Interrupt Flag
Bit 6
= Periodic Interrupt Flag
Bit 5
= Alarm Interrupt Flag
Bit 4
= Update Interrupt Flag
Bits 3-0 = Reserved
0Dh
Status Register D
Bit 7
= Real Time Clock
0 Lost Power
1 Power
Continued...
30
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
CMOS Map continued...
Location
Description
0Eh
CMOS Location for Bad CMOS and Checksum Flags
Bit 7
= Flag for CMOS Lost Power
0
1
Bit 6
=
=
Power OK
Lost Power
= Flag for CMOS checksum bad
0
1
=
=
Checksum is valid
Checksum is bad
0Fh
Shutdown Code
10h
Diskette Drives
Bits 7-4 = Diskette Drive A
0000
0001
0010
0011
0100
0101
=
=
=
=
=
=
Not installed
Drive A = 360 kB
Drive A = 1.2MB
Drive A = 720 kB
Drive A = 1.44MB
Drive A = 2.88MB
Bits 3-0 = Diskette Drive B
0000
0001
0010
0011
0100
0101
=
=
=
=
=
=
Not installed
Drive B = 360 kB
Drive B = 1.2MB
Drive B = 720 kB
Drive B = 1.44MB
Drive B = 2.88MB
11h
Reserved
12h
Fixed (Hard) Drives
Bits 7-4 = Hard Drive 0, AT Type
0000
0001-1110
1111
=
=
=
Not installed
Types 1-14
Extended drive types 16-44.
See location 19h.
Bits 3-0 = Hard Drive 1, AT Type
0000
0001-1110
1111
=
=
=
Not installed
Types 1-14
Extended drive types 16-44.
See location 2Ah.
13h
Reserved
14h
Equipment
Bits 7-6 = Number of Diskette Drives
00
=
01
=
10, 11 =
One diskette drive
Two diskette drives
Reserved
Bits 5-4 = Primary Display Type
00
01
10
11
=
=
=
=
Adapter with option ROM
CGA in 40 column mode
CGA in 80 column mode
Monochrome
Bits 3-2 = Reserved
Bit 1
= Math Coprocessor Presence
0
1
Bit 0
=
=
Not installed
Installed
= Bootable Diskette Drive
0
1
=
=
Not installed
Installed
Continued...
31
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
CMOS Map continued...
Location
Description
15h
Base Memory Size (in kB) - Low Byte
16h
Base Memory Size (in kB) - High Byte
17h
Extended Memory Size (in kB) - Low Byte
18h
Extended Memory Size (in kB) - High Byte
19h
Extended Drive Type - Hard Drive 0
1Ah
Extended Drive Type - Hard Drive 1
1Bh
Custom and Fixed (Hard) Drive Flags
Bits 7-6 = Reserved
Bit 5
= Internal Floppy Disk Controller
0
1
Bit 4
=
=
Disabled
Enabled
=
=
Disabled
Enabled
= Hard Drive 1 Custom Flag
0
1
Bit 0
Disabled
Enabled
= Hard Drive 0 IDE Flag
0
1
Bit 1
=
=
= Hard Drive 0 Custom Flag
0
1
Bit 2
Disabled
Enabled
= Internal IDE Controller
0
1
Bit 3
=
=
=
=
Disabled
Enabled
= Hard Drive 1 IDE Flag
0
1
=
=
Disabled
Enabled
1Ch
Reserved
1Dh
EMS Memory Size Low Byte
1Eh
EMS Memory Size High Byte
1Fh - 24h
Custom Drive Table 0
These 6 Bytes (48 bits) contain the following data:
Cylinders
Landing Zone
Write Precompensation
Heads
Sectors/Track
10bits
10bits
10bits
08bits
08bits
range 0-1023
range 0-1023
range 0-1023
range 0-15
range 0-254
1Fh
Byte 0
Bits 7-0 = Lower 8 bits of Cylinders
20h
Byte 1
Bits 7-2 = Lower 6 bits of Landing Zone
Bits 1-0 = Upper 2 bits of Cylinders
21h
Byte 2
Bits 7-4 = Lower 4 bits of Write Precompensation
Bits 3-0 = Upper 4 bits of Landing Zone
Continued...
32
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
CMOS Map continued...
Location
Description
22h
Byte 3
Bits 7-6 = Reserved
Bits 5-0 = Upper 6 bits of Write Precompensation
23h
Byte 4
Bits 7-0 = Number of Heads
24h
Byte 5
Bits 7-0 = Sectors Per Track
25h - 2Ah
Custom Drive Table 1
These 6 Bytes (48 bits) contain the following data:
Cylinders
Landing Zone
Write Precompensation
Heads
Sectors/Track
10bits
10bits
10bits
08bits
08bits
range 0-1023
range 0-1023
range 0-1023
range 0-15
range 0-254
25h
Byte 0
Bits 7-0 = Lower 8 bits of Cylinders
26h
Byte 1
Bits 7-2 = Lower 6 bits of Landing Zone
Bits 1-0 = Upper 2 bits of Cylinders
27h
Byte 2
Bits 7-4 = Lower 4 bits of Write Precompensation
Bits 3-0 = Upper 4 bits of Landing Zone
28h
Byte 3
Bits 7-6 = Reserved
Bits 5-0 = Upper 6 bits of Write Precompensation
29h
Byte 4
Bits 7-0 = Number of Heads
2Ah
Byte 5
Bits 7-0 = Sectors Per Track
2Bh
Boot Password
Bit 7
= Enable/Disable Password
0
1
=
=
Disable Password
Enable Password
Bits 6-0 = Calculated Password
2Ch
SCU Password
Bit 7
= Enable/Disable Password
0
1
=
=
Disable Password
Enable Password
Bits 6-0 = Calculated Password
2Dh
Reserved
2Eh
High Byte of Checksum - Locations 10h to 2Dh
2Fh
Low Byte of Checksum - Locations 10h to 2Dh
30h
Extended RAM (kB) detected by POST - Low Byte
31h
Extended RAM (kB) detected by POST - High Byte
32h
BCD Value for Century
Continued...
33
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
CMOS Map continued...
Location
Description
33h
Base Memory Installed
Bit 7
= Flag for Memory Size
0
1
=
=
640kB
512kB
Bits 6-0 = Reserved
34h
Minor CPU Revision
Differentiates CPUs within a CPU type (i.e., 486SX vs 486 DX,
vs 486 DX/2). This is crucial for correctly determining CPU input
clock frequency. During a power-on reset, Reg DL holds minor
CPU revision.
35h
Major CPU Revision
Differentiates between different CPUs (i.e., 386, 486, Pentium).
This is crucial for correctly determining CPU input clock frequency. During a power-on reset, Reg DH holds major CPU
revision.
5.8.
36h
Hotkey Usage
Bits 7-6 = Reserved
Bit 5
= Semaphore for Completed POST
Bit 4
= Semaphore for 0 Volt POST (not currently used)
Bit 3
= Semaphore for already in SCU menu
Bit 2
= Semaphore for already in PM menu
Bit 1
= Semaphore for SCU menu call pending
Bit 0
= Semaphore for PM menu call pending
40h-7Fh
Definitions for these locations vary depending on the chipset.
EEPROM saved CMOS Setup
The EEPROM has different functions, as listed below:
• Backup of the CMOS-Setup values.
• Storing system information (i.e., version, production date, customization of the board, CPU type).
• Storing user/application values.
The EEPROM will be updated automatically after exiting the BIOS setup menu. The system will operate also
without any CMOS battery. While booting, the CMOS is automatically updated with the EEPROM values.
Press the Esc-key while powering on the system before the video shows the BIOS message and the CMOS
will not be updated.
This would be helpful, if wrong parameters are stored in the EEPROM and the setup of the BIOS does not
start.
If the system hangs or a problem appears, the following steps must be performed:
1. Reset the CMOS-Setup (disconnect the battery for at least 10 minutes).
2. Press Esc until the system starts up.
3. Enter the BIOS Setup:
a) load DEFAULT values
b) enter the settings for the environment
c) exit the setup
4. Restart the system.
The user may access the EEPROM through the INT15 special functions. Refer to that chapter in the GEODE
LX800-LX900 manual on the Product CD.
The system information is read-only and uses the SFI functions. Refer to the GEODE LX800-LX900 manual.
34
DIGITAL-LOGIC AG
5.8.1.
MSB900/L Detailed Technical Manual V1.0
EEPROM Memory for Setup
The EEPROM is used for setup and configuration data, stored as an alternative to the CMOS-RTC. Optionally, the EEPROM setup driver may update the CMOS RTC, if the battery is running down and the checksum
error would appear and stop the system. The capacity of the EEPROM is 2 kByte.
Organization of the 2048Byte EEPROMs:
Address MAP:
0000h
0001h
0003h
0010h-007Fh
0080h-00FFh
0100h-010Fh
0110h-0113h
0114h-0117h
0118h-011Bh
011Ch-011Fh
0120h-0122h
0123h-0125h
0126h-0128h
0129h-012Bh
0130h
0131h
0132h/0133h
0134h/0135h
0136h
0137h
0200h-03FFh
0200h-027Fh
0400h-07FFh
5.9.
5.9.1.
Function:
CMOS-Setup valid (01=valid)
Reserved
Flag for DLAG-Message (FF=no message)
Copy of CMOS-Setup data
Reserved for AUX-CMOS-Setup
Serial-Number
Production date (year/day/month)
1. Service date (year/day/month)
2. Service date (year/day/month)
3. Service date (year/day/month)
Boot errors (Auto incremented if any boot error occurs)
Setup Entries (Auto incremented on every Setup entry)
Low Battery (Auto incremented every time the battery is low, EEPROM -> CMOS)
Startup (Auto incremented on every power-on start)
Reserved
Reserved
BIOS Version (V1.4 => [0132h]:= 4, [0133h]:=1)
BOARD Version (V1.5 => [0124h]:=5, [0125h]:=1)
BOARD TYPE (‘M’=PC/104, ‘E’=Euro, ‘W’=MSWS, ‘S’=Slot, ‘C’=Custom, ‘X’= smartCore or smartModule)
CPU TYPE:
(01h=ELAN300/310, 02h=ELAN400, 05h=P5, 08h=P3, 09h=ELAN520, 10h=P-M).
Reserved
Reserved
Free for Customer use
Memory & I/O Map
System Memory Map
The X86 CPU, used as a central processing unit on the MICROSPACE, has a memory address space which
is defined by 32 address bits. Therefore, it can address 1 GByte of memory. The memory address MAP is as
follows:
CPU GEODE
Address:
000000 - 09FFFFh
0A0000 - 0BFFFFh
0C0000 - 0C7FFFh
0C8000 - 0CFFFFh
0D0000 - 0DFFFFh
0E0000 - 0EBFFFh
0EC000 - 0EFFFFh
0F0000 - 0FFFFFh
100000 - 1FFFFFFh
Size:
640 kBytes
128 kBytes
32 kBytes
32 kBytes
64 kBytes
32 kBytes
16 kBytes
64 kBytes
31 MBytes
Function / Comments:
Onboard DRAM for DOS applications
CGA, EGA, LCD Video RAM 128kB
VGA BIOS
Free for user
Free for user
Bios
BIOS extensions
Core BIOS
DRAM for extended onboard memory
35
DIGITAL-LOGIC AG
5.9.2.
MSB900/L Detailed Technical Manual V1.0
System I/O map
The following table details the legacy I/O range for 000h through 4FFh. Each I/O location has a read/write
(R/W) capability.
Note the following abbreviations:
---
Unknown or can not be determined.
Yes
Read and write the register at the indicated location. No shadow required.
WO
Write only. Value written can not be read back. Reads do not contain any useful information.
RO
Read only. Writes have no effect.
Shw
The value written to the register can not be read back via the same I/O location. Read back is
accomplished via a “Shadow” register located in MSR space.
Shw@
Reads of the location return a constant or meaningless value.
Shw$
Reads of the location return a status or some other meaningful information
Rec
Writes to the location are “recorded” and written to the LPC. Reads to the location return the recorded value. The LPC is not read.
I/O Map
I/O Addr.
Function
Size
R/W Comment
000h
Slave DMA Address - Channel 0
8bit
Yes 16bit values in two transfers.
001h
Slave DMA Counter - Channel 0
8bit
Yes 16bit values in two transfers.
002h
Slave DMA Address - Channel 1
8bit
Yes 16bit values in two transfers.
003h
Slave DMA Counter - Channel 1
8bit
Yes 16bit values in two transfers.
004h
Slave DMA Address - Channel 2
8bit
Yes 16bit values in two transfers.
005h
Slave DMA Counter - Channel 2
8bit
Yes 16bit values in two transfers.
006h
Slave DMA Address - Channel 3
8bit
Yes 16bit values in two transfers.
007h
Slave DMA Counter - Channel 3
8bit
Yes 16bit values in two transfers.
008h
Slave DMA Command/Status - Channels [3:0]
8bit
009h
Slave DMA Request - Channels [3:0]
8bit
00Ah
Slave DMA Mask - Channels [3:0]
8bit Shw@ Reads return value B2h.
00Bh
Slave DMA Mode - Channels [3:0]
8bit Shw@ Reads return value B2h.
00Ch
Slave DMA Clear Pointer - Channels [3:0]
8bit
WO Reads return value B2h.
00Dh
Slave DMA Reset - Channels [3:0]
8bit
WO Reads return value B2h.
Shw$
WO Reads return value B2h.
00Eh
Slave DMA Reset Mask - Channels [3:0]
8bit Shw@ Reads return value B2h.
00Fh
Slave DMA General Mask - Channels [3:0]
8bit Shw@ Reads return value B2h.
010h-01Fh No Specific Usage
---
---
020h
PIC Master - Command/Status
8bit
Shw$
021h
PIC Master - Command/Status
8bit
Shw$
---
---
022h-03Fh No Specific Usage
040h
PIT – System Timer
8bit
Shw$
041h
PIT – Refresh Timer
8bit
Shw$
042h
PIT – Speaker Timer
8bit
Shw$
043h
PIT – Control
8bit
Shw$
---
---
044h-05Fh No Specific Usage
Continued…
36
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
I/O Map Continued…
I/O Addr.
Function
Size
R/W Comment
If KEL Memory Offset 100h[0] = 1(EmulationEnabled bit).
060h
Keyboard/Mouse - Data Port
8bit
Yes
061h
Port B Control
8bit
Yes
---
---
062h-063h No Specific Usage
064h
Keyboard/Mouse - Command/ Status
8bit
065h-06Fh No Specific Usage
---
If MSR 5140001Fh[0] = 1 (SNOOP bit) and
KEL Memory Offset 100h[0] = 0 (EmulationEnabled bit).
If KEL Memory Offset 100h[0] = 1
(Emulation-Enabled bit).
.
Yes
If MSR 5140001Fh[0] = 1 (SNOOP
bit) and KEL Memory Offset 100h[0]
= 0 (Emulation-Enabled bit)
---
070h-071h RTC RAM Address/Data Port
8bit
Yes Options per MSR 51400014h[0]. (Note 1)
072h-073h High RTC RAM Address/Data Port
8bit
Yes Options per MSR 51400014h[1].
074-077h
No Specific Usage
---
---
078h-07Fh No Specific Usage
---
---
080h
Post Code Display
081h
DMA Channel 2 Low Page
8bit
Rec Write LPC and DMA. Read only DMA.
082h
DMA Channel 3 Low Page
8bit
Rec
083h
DMA Channel 1 Low Page
084h-086h No Specific Usage
8bit
087h
DMA Channel 0 Low Page
8bit
088h
No Specific Usage
8bit
Rec Write LPC and DMA. Read only DMA.
Upper addr bits [23:16]. Write LPC and DMA.
Rec
Read only DMA.
Rec Write LPC and DMA. Read only DMA.
089h
DMA Channel 6 Low Page
08Ah
DMA Channel 7 Low Page
8bit
Rec
08B
DMA Channel 5 Low Page
8bit
Rec Write LPC and DMA. Read only
8bit
Rec Upper addr bits [23:16]. See comment at 080h.
08Ch-08Dh No Specific Usage
08Eh
DMA
08Fh
DMA C4 Low Page
090h-091h No Specific Usage
---
---
Port A
8bit
Yes
093h-09Fh No Specific Usage
---
---
092h
0A0h
PIC Slave - Command/Status
8bit
Shw$
0A1h
PIC Slave - Command/Status
8bit
Shw$
Upper addr bits [23:16]. Write LPC and
DMA. Read only DMA.
Upper addr bits [23:16]. Write LPC and DMA.
Read only DMA.
If kel_porta_en is enabled, then access Port A;
else access LPC.
0A2h-0BFh No Specific Usage
8bit
0C0h
Master DMA Address - Channel 4
8bit
0C1h
No Specific Usage
8bit
0C2h
Master DMA Counter - Channel 4
8bit
0C3h
No Specific Usage
8bit
0C4h
Master DMA Address - Channel 5
8bit
Yes 16bit values in two transfers.
0C6h
Master DMA Counter - Channel 5
8bit
Yes 16bit values in two transfers.
0C7h
No Specific Usage
8bit
0C8h
Master DMA Address - Channel 6
8bit
Yes 16bit values in two transfers.
0CAh
Master DMA Counter - Channel 6
8bit
Yes 16bit values in two transfers.
0CBh
No Specific Usage
8bit
Continued…
37
--Yes 16bit values in two transfers.
--Yes 16bit values in two transfers.
---
---
---
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
I/O Map Continued…
I/O Addr.
Function
Size
R/W Comment
0CCh
Master DMA Address - Channel 7
8bit
Yes 16bit values in two transfers.
0CDh
No Specific Usage
8bit
0CEh
Master DMA Counter - Channel 7
8bit
0CFh
No Specific Usage
8bit
---
0D0h
Master DMA Command/Status – Channels [7:4]
8bit
Shw$
0D1h
No Specific Usage
8bit
---
0D2h
Master DMA Request - Channels [7:4]
8bit
WO
0D3h
No Specific Usage
8bit
---
0D4h
Master DMA Mask - Channels [7:4]
8bit
Yes
0D5h
No Specific Usage
8bit
---
0D6h
Master DMA Mode - Channels [7:4]
8bit Shw@
0D7h
No Specific Usage
8bit
---
0D8h
Master DMA Clear Pointer - Channels [7:4]
8bit
WO
0D9h
No Specific Usage
8bit
---
0DAh
Master DMA Reset - Channels [7:4]
8bit
WO
0DBh
No Specific Usage
8bit
---
0DCh
Master DMA Reset Mask - Channels [7:4]
8bit
WO
0DDh
No Specific Usage
8bit
---
0DEh
Master DMA General Mask - Channels [7:4]
8bit Shw@
0DFh
No Specific Usage
8bit
---
---
---
0E0h-2E7h No Specific Usage
--Yes 16bit values in two transfers.
2E8h-2EFh UART/IR - COM4
8bit
---
2F0h-2F7h No Specific Usage
---
---
2F8h-2FFh UART/IR - COM2
8bit
300h- 36Fh No Specific Usage
370h
Floppy Status R A
371h
372h
---
---
MSR bit enables/disables into I/O
2EFh space. (UART1 MSR
51400014h[18:16], UART2 MSR
51400014h[22:20]). Defaults to
LPC.
MSR bit enables/disables into I/O
2FFh space. (UART1 MSR
51400014h[18:16], UART2 MSR
51400014h[22:20]). Defaults to
LPC.
---
8bit
RO Second Floppy.
Floppy Status R B
8bit
RO Second Floppy.
Floppy Digital Out
8bit Shw@ Second Floppy.
373h
No Specific Usage
8bit
---
374h
Floppy Cntrl Status
8bit
RO Second Floppy.
375h
Floppy Data
8bit
Yes Second Floppy.
376h
No Specific Usage
8bit
377h
Floppy Conf Reg
8bit
378h-3E7h No Specific Usage
---
--Shw$ Second Floppy.
---
MSR bit enables/disables into I/O
3EFh space. (UART1 MSR
51400014h[18:16], UART2 MSR
51400014h[22:20]). Defaults to
LPC.
3E8h-3EFh UART/IR - COM3
8bit
---
3F0h
8bit
RO First Floppy.
Floppy Status R A
Continued…
38
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
I/O Map Continued…
I/O Addr.
Function
Size
R/W Comment
3F1h
Floppy Status R B
8bit
RO First Floppy.
3F2h
Floppy Digital Out
8bit Shw@ First Floppy.
3F3h
No Specific Usage
8bit
3F4h
Floppy Cntrl Status
8bit
RO First Floppy.
3F5h
Floppy Data
8bit
Yes First Floppy.
3F6h
No Specific Usage
8bit
3F7h
Floppy Conf Reg
8bit
3F8h-3FFh UART/IR - COM1
8bit
480h
No Specific Usage
8bit
481h
DMA Channel 2 High Page
8bit
482h
DMA Channel 3 High Page
483h
DMA Channel 1 High Page
484h-486h No Specific Usage
8bit
487h
DMA Channel 0 High Page
8bit
489h
DMA Channel 6 High Page
8bit
48Ah
DMA Channel 7 High Page
48Bh
DMA Channel 5 High Page
48Ch-48Eh No Specific Usage
8bit
48Fh
8bit
DMA Channel 4 High Page
490h-4CFh No Specific Usage
---
---
--Shw$ First Floppy.
---
MSR bit enables/disables into I/O
3FFh space. (UART1 MSR
51400014h[18:16], UART2 MSR
51400014h[22:20]). Defaults to
LPC.
WO Write LPC and DMA. Read only DMA.
Upper addr bits [31:24]. Write LPC and DMA.
Rec
Read only DMA.
WO Write LPC and DMA. Read only DMA.
Upper addr bits [31:24]. Write LPC and DMA.
Rec
Read only DMA.
Upper addr bits [31:24]. Write LPC and DMA.
Rec
Read only DMA.
WO Write LPC and DMA. Read only DMA.
Upper addr bits [31:24]. Write LPC and DMA.
Rec
Read only DMA.
---
4D0h
PIC Level/Edge
8bit
Yes IRQ0-IRQ 7.
4D1h
PIC Level/Edge
8bit
Yes IRQ8-IRQ15.
4D2h-4FFh No Specific Usage
---
---
Note 1: The Diverse Device Snoops writes to this port and maintains the MSB as NMI enabled. When low,
NMI is enabled. When high, NMI is disabled. This bit defaults high. Reads of this port return bits
[6:0] from the on-chip or off-chip target, while Bit 7 is returned from the “maintained” value.
39
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
6. VGA
6.1.
VGA/LCD Controller of the Geode LX900
• Highly integrated flat panel and CRT GUI Accelerator & Multimedia Engine, Palette/DAC, Clock Synthesizer, and integrated frame buffer
• HiQColor
TM
Technology implemented with TMED (Temporal Modulated Energy Distribution)
• Hardware Windows Acceleration
• Hardware Multimedia Support
• High-Performance flat panel display resolution and color depth at 3.3V
• 18/24bit direct interface to color TFT panels (X1)
• Advanced Power Management minimizes power usage in:
Normal operation
Standby (Sleep) modes
Panel-Off Power-Saving Mode
• VESA standards supported
®
• Fully compatible with IBM VGA
• Driver support for Windows XP, Windows 2000, Windows 98, Windows NT4.0
Attention!
When connecting or disconnecting the monitor, be very careful. Also hold the socket on the board
at the same time to add stability.
6.2.
Graphic Modes
Bios settings: 254MB video memory (shared)
Resolution
800x600
1024x768
1152x864
1280x1024
1600x1200
1920x1440
Col. Dept.
16bit / 32bit
16bit / 32bit
16bit / 32bit
16bit / 32bit
16bit / 32bit
16bit / 32bit
Frequency
60Hz – 100Hz
60Hz – 100Hz
60Hz – 100Hz
60Hz – 100Hz
60Hz – 100Hz
60Hz – 85Hz
40
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
7. VIDEO INPUT
The MSB900 contains a low-cost video input port. It consist of LX900’s video input port (VIP) and the external frame grabber chip SAA7111A. This port is capable of digitizing a CVBS video signal with 15 frames per
second at a resolution of 352x288bits. Note that this frame rate is only achievable when the raw data stream
is compressed before being stored on the hard drive. Driver support is currently available for the Windows
XP platform.
8. DESCRIPTION OF THE CONNECTORS
Flat cable
•
•
•
44pin IDE is: IDT Terminal for Dual Row (2.00mm grid) and 1.00mm flat cable
All others are: IDT Terminal for Dual Row 0.1" (2.54mm grid) and 1.27mm flat cable
NC: not connected
Connector
X1
X14
X15
X20
X22
X31
X33
X34
X39
X50
X51
X52
X60
X61
X71
X101
X110
X120
X230
X301
Structure
Power
Video Input
Operator panel connector / Flat panel
Sound MIC stereo input
Sound speaker stereo output
Keyboard PS/2 and Mouse Utility connector
LAN Port A
LAN Port B
COM2 serial interface connector
USB 0/1 connector
USB 2/3 connector
Socket for USB UDOC
IDE PATA connector
COM1 and LPT connector
CompactFlash Socket
PCI/104 expansion connector
POD-Port interface connector
MiniPCI socket
JTAG-Port
DSUB VGA connector
41
Pin
2pin jack plug
SMA
44pin RM 2.0
3.5mm jack plug
3.5mm jack plug
PS/2
RJ45
RJ45
10pin RM 2.54mm
Dual-USB
Dual-USB
10pin RM2.54mm
44pin RM 2.0
32pin RM 2.54mm
50pin
120pin
14pin
124pin
4 pin
15pin DSUB
Remarks
Not assembled
Not assembled
High-density
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
Top view of the MSB900/L
42
DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
Bottom view of the MSB900/L
43
DIGITAL-LOGIC AG
X1
Power Supply
Pin
1 (Shield)
2
3
X14
Pin
1
MSB900/L Detailed Technical Manual V1.0
Signal
Power supply 8-30V
NC
Power supply GND
Video IN
Signal
CVBS
Pin Signal
2 GND
44
DIGITAL-LOGIC AG
X15
MSB900/L Detailed Technical Manual V1.0
Operator Panel / Flat Panel (bottom side)
X15 is intended to be used internally to attach an operator panel. Some signals may not be present or are
shared with other connectors. This connector is not assembled and is only for OEM-specific applications. A
2mm x 44pin header is needed.
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Signal
GND
VCC (+5V output)
LVDS YAM0
LVDS YAP0
GND
VCC (+5V output)
LVDS YAM1
LVDS YAP1
GND
VCC (+5V output)
LVDS YAM2
LVDS YAP2
GND
Enable VDD
LVDS CLKAP
LVDS CLKAM
CRT red
CRT green
CRT blue
CRT hsync
CRT vsync
CRT SCL
CRT SDA
GND
COM2 DCD
COM2 DSR
COM2 RXD
COM2 RTS
COM2 TXD
COM2 CTS
COM2 DTR
COM2 RI
SYS_RST#
VCC3 (+3.3V output)
USB DUSB D+
VCC3 (+3.3V output)
SMB SCL
SMB SDA
AVR PA0
AVR PA3
DCMAIN (filtered power input)
GND
VCC (+5V output)
Note...
VCC:
max. 0.5 Amp
VCC3:
max. 0.5 Amp
DCMAIN: DC supply input must be within
the 8-30V range.
Attention!
If the VGA or COM2 signals on X15 are
used, the X10 (VGA connector) or the
X39 (COM2 connector) must not be connected.
Attention!
USB-signals on X15 are multiplexed with
the USB-Port1. They must be enabled by
soldering the two resistors.
45
DIGITAL-LOGIC AG
X15
MSB900/L Detailed Technical Manual V1.0
Reverse Pin Configuration MSB900 LVDS X15 (on component side)
Attention!
When X15 is soldered on the component side, a different pin numbering schema must be applied.
Odd and even pin numbers are swapped. Ignoring this warning may result in the destruction
of any attached devices such as displays!
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Signal
VCC (+5V Output)
GND
LVDS_YAP0
LVDS_YAM0
VCC (+5V Output)
GND
LVDS_YAP1
LVDS_YAM1
VCC (+5V Output)
GND
LVDS_YAP2
LVDS_YAM2
Enable VDD
GND
LVDS_CLKAM
LVDS_CLKAP
CRT green
CRT red
CRT hsync
CRT blue
CRT SCL
CRT vsync
GND
CRT SDA
COM2 DSR
COM2 DCD
COM2 RTS
COM2 RXD
COM2 CTS
COM2 TXD
COM2 RI
COM2 DTR
VCC3 (+3.3V Output)
SYS_RST#
USB D+
USB DSMB SCL
VCC3 (+3.3V Output)
AVR PA0
SMB SDA
DCMAIN (filtered power input)
AVR PA3
VCC (+5V Output)
GND
46
DIGITAL-LOGIC AG
X31
MSB900/L Detailed Technical Manual V1.0
Keyboard PS/2 and Mouse Utility Connector
Connector and Adapter
Shield
DATA
GND
VCC (+5V)
CLK
Mini- DIN PS/2 (6 PC)
Shield
1
3
4
5
Remarks
KEYBOARD
VCC (+5V)
DATA
GND
CLK
Mini- DIN PS/2 (6 PC)
4
2
3
6
Remarks
MOUSE
PS/2 Front side (female)
X33
Pin
1
2
3
4
5
6
7
8
X34
Pin
1
2
3
4
5
6
7
8
10/100 BASE-T Interface Connector 0
Signal (CAT 5)
TX+
TXRX+
RX-
10/100 BASE-T Interface Connector 1
Signal
TX+
TXRX+
RX-
47
DIGITAL-LOGIC AG
X39
MSB900/L Detailed Technical Manual V1.0
Serial Port COM2
Header onboard
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Pin 10
D-SUB connector
Pin 1
Pin 6
Pin 2
Pin 7
Pin 3
Pin 8
Pin 4
Pin 9
Pin 5
Signal
DCD
DSR
RxD
RTS
TxD
CTS
DTR
RI
GND
open
Attention!
If the X39 connector is used, DO NOT connect the COM2 signals on the X15 connector!
X50
Pin
1
2
3
4
5
6
7
8
X51
Pin
1
2
3
4
5
6
7
8
Pin 1
Pin 2
Pin 3
Pin 4
USB 1 Connector (Dual-USB)
Signal
VCC
USB-P1USB-P1+
GND
VCC
USB-P2USB-P2+
GND
Remarks
On MPC20/21, not assembled.
USB 2 Connector (Dual USB)
Signal
VCC
USB-P2USB-P2+
GND
VCC
USB-P4USB-P4+
GND
Remarks
VCC
USB-PUSB-P+
GND
48
DIGITAL-LOGIC AG
X52
Pin
1
2
3
4
5
MSB900/L Detailed Technical Manual V1.0
USB UDOC (not assembled)
Signal
VCC
NC
USB-P2NC
USB-P2+
Pin
6
7
8
9
10
Signal
NC
GND
NC
NC
NC
Attention!
X52 for USB-DOC-Flash drives are only for OEM use. The connector is not assembled. The UDOC
may be assembled if the CompactFlash is not assembled.
X60
Pin
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
IDE Interface
Signal
Reset (active low)
D7
D6
D5
D4
D3
D2
D1
D0
GND
DREQ
IOW (active low)
IOR (active low)
IORDY
DACK
IRQ14
ADR1
ADR0
CS0 (active low)
LED (active low)
VCC Logic
GND
Pin
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
Signal
GND
D8
D9
D10
D11
D12
D13
D14
D15
(keypin) NC
GND
GND
GND
ALE / Master-Slave
GND
NC
NC
ADR2
CS1 (active low)
GND
VCC Motor
NC
49
DIGITAL-LOGIC AG
X61
MSB900/L Detailed Technical Manual V1.0
Serial Port COM1, Parallel Port LPT1
Header onboard
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Pin 10
Pin 11
Pin 12
Pin 13
Pin 14
Pin 15
Pin 16
Pin 17
Pin 18
Pin 19
Pin 20
Pin 21
Pin 22
Pin 23
Pin 24
Pin 25
Pin 26
Pin 27
Pin 28
Pin 29
Pin 30
Pin 29
Pin 30
D-SUB connector
Pin 1
Pin 6
Pin 2
Pin 7
Pin 3
Pin 8
Pin 4
Pin 9
Pin 5
Pin 12
Pin 11
Pin 10
Pin 9
Pin 8
Pin 7
Pin 6
Pin 5
Pin 17
Pin 4
Pin 16
Pin 3
Pin 15
Pin 2
Pin 14
Pin 1
Pin 23-25
Signal
DCD
DSR
RxD
RTS
TxD
CTS
DTR
RI
GND
GND
select
paper end
busy
acknowledge
data 7
data 6
data 5
data 4
data 3
shift in
data 2
init printer
data 1
error
data 0
auto feed
strobe
GND
power supply GND
power supply 8-30V
power supply GND
power supply 8-30V
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
X101 PCI-104 BUS Interface
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
A
GND/5.0V KEY2
VI/O
AD05
C/BE0*
GND
AD11
AD14
+3.3V
SERR*
GND
STOP*
+3.3V
FRAME*
GND
AD18
AD21
+3.3V
IDSEL0
AD24
GND
AD29
+5V
REQ0*
GND
GNT1*
+5V
CLK2
GND
+12V
-12V
B
Reserved
AD02
GND
AD07
AD09
VI/O
AD13
C/BE1*
GND
PERR*
+3.3V
TRDY*
GND
AD16
+3.3V
AD20
AD23
GND
C/BE3*
AD26
+5V
AD30
GND
REQ2*
VI/O
CLK0
+5V
INTD*
INTA*
Reserved
C
+5
AD01
AD04
GND
AD08
AD10
GND
AD15
SB0*
+3.3V
LOCK*
GND
IRDY*
+3.3V
AD17
GND
AD22
IDSEL1
VI/O
AD25
AD28
GND
REQ1*
+5V
GNT2*
GND
CLK3
+5V
INTB*
Reserved
D
AD00
+5V
AD03
AD06
GND
M66EN
AD12
+3.3V
PAR
SDONE
GND
DEVSEL*
+3.3V
C/BE2*
GND
AD19
+3.3V
IDSEL2
IDSEL3
GND
AD27
AD31
VI/O
GNT0*
GND
CLK1
GND
RST*
INTC*
GND/3.3V KEY2
Notes:
1. The shaded area denotes power or ground signals.
2. The KEY pins are to guarantee proper module installation. Pin-A1 will be removed and the female side
plugged for 5.0V I/O signals and Pin-D30 will be modified in the same manner for 3.3V I/O. It is highly
recommended that both KEY pins (A1 and D30) be electrically connected to GND for shielding.
DLAG boards have them as NC (not connected).
X110 LPC-Port
Only for factory and POD-Diagnostic use.
Pin Signal
Pin Signal
1 VCC 3.3V
2 LAD0
3 LFrame#
4 LAD1
5 PCI_RST#
6 LAD2
7 FWH_TBL#
8 LAD3
9 VCC 5V
10 PCI_RST#
11 LPC_Clock
12 nc
13 Ground
14 FWH_Control
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DIGITAL-LOGIC AG
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X230 JTAG-Port
Pin
1
3
Signal
TCK
TDI
Pin Signal
2 TMS
4 TDO
X301 VGA Monitor (CRT-Signals)
15pins High-Density DSub
Pin
Signal
1
Red
2
Green
3
Blue
13
H-Synch
14
V-Synch
5 + 11
Bridged
5, 6, 7, 8 Grounded
The VGA-CRT signals from J2 must be wired to a standard VGA High Density DSub-connector (female):
The LCD signals must be wired panel-specific.
Solder-side view of the female 15pin HiDSub
1
2
3
4
5
Red Green Blue
6
7
8
GND
9
10
GND
11
12
13
14
15
HSyn VSyn
Attention!
If the X10 connector is used, DO NOT connect the VGA signals on the X15 connector!
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9. JUMPER LOCATIONS ON THE BOARD
The following figure shows the location of all jumper blocks on the MSB900/L board. The numbers shown in
this figure are silk screened on the board so that the pins can easily be located. This chapter refers to the
individual pins for these jumpers. The default jumper settings are indicated with asterisks.
Be careful: some jumpers are soldering bridges; you will need a miniature soldering station with a vacuum
pump.
9.1.
The Jumpers on MSB900/L
Settings written in bold are defaults.
Jumper
J1
J2
J3
J4
Structure
CompactFlash master
Autostart function
Disconnect Battery
Disconnect CMOS EEPROM
1-2 / open
Slave
Enabled
Disabled
Disabled
2-3 / closed
Master
N/A
N/A
N/A
Remarks
1)
1) With the autostart function enabled, the system will start booting up within 2 seconds after the power
supply is turned on.
9.2.
Reload Default BIOS Settings
To reload default BIOS settings when the system refuses to boot after defective BIOS settings have been
made please proceed as follows.
•
•
•
•
•
•
Turn off the system.
Remove J3 on MSB900 or disconnect the optional external battery on the MSB900L.
Remove J4.
Turn on the system and enter the BIOS setup menu.
Close J4 and J5 or attach the optional external battery.
Choose save and exit in the BIOS setup menu.
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
10.CABLE INTERFACES
10.1. The Hard Disk Cable 44pin
IDT Terminal for Dual Row (2.00mm grid) and 1.00mm flat cable; 44pins = 40pins signal and 4pins power.
1 2
39
1 2
40
39
43 44
40
43 44
Max. length for the IDE cable is 30cm.
Attention!
Check the pin 1 marker of the cable and the connector before you power-on. Refer to the technical manual of the installed drives because a wrong cable will immediately destroy the drive
and/or the MICROSPACE MSB900/L board. In this case the warranty is void! Without the technical manual you may not connect this type of drive.
The 44pin IDE connector on the drives is normally composed of the 44 pins, 2 open pins and 4
test pins, 50 pins in total. Leave the 4 test pins unconnected.
c
d
a b
1 3
Testpin
43
44pin IDE Interface with integrated power lines
open pin
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DIGITAL-LOGIC AG
MSB900/L Detailed Technical Manual V1.0
10.2. The COM1/LPT Serial Interface Cable
Terminal for dual row 2mm grid and 1mm flat cable.
Connector X61
Pin
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Pin 10
Signal
= DCD
= DSR
= RXD
= RTS
= TXD
= CTS
= DTR
= RI
= GND
COM1 9pin D-Sub male
1
6
2
7
3
8
4
9
5
Pin
Pin 11
Pin 12
Pin 13
Pin 14
Pin 15
Pin 16
Pin 17
Pin 18
Pin 19
Pin 20
Pin 21
Pin 22
Pin 23
Pin 24
Pin 25
Pin 26
Pin 27
Pin 28
Signal
= SELECT
= Paper end
= Busy
= Acknowledge
= Data 7
= Data 6
= Data 5
= Data 4
= Data 3
= Shift in
= Data 2
= Init
= Data 1
= Error
= Data 0
= Autofeed
= Strobe
= GND
LPT1 25pin D-Sub female
13
12
11
10
9
8
7
6
5
17
4
16
3
15
2
14
1
18-25
Attention!
• Do not short circuit these signal lines.
• Never connect any pins on the same plug or to any other plug on the MICROSPACE
MSB900/L. The +/-10 Volts will immediately destroy the MICROSPACE core logic. In this
case the warranty is void!
• Do not overload the output; the maximum output of the current converters is 10mA.
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10.3. The COM2 Serial Interface Cable
DT terminal for dual row 0.1" (2.54mm grid) and 1.27mm flat cable.
Connector X39
Pin
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Pin 10
Signal
= DCD
= DSR
= RXD
= RTS
= TXD
= CTS
= DTR
= RI
= GND
COM2 9pin D-Sub male
1
6
2
7
3
8
4
9
5
Attention!
• Do not short circuit these signal lines.
• Never connect any pins on the same plug or to any other plug on the MICROSPACE
MSB900/L. The +/-10 Volts will immediately destroy the MICROSPACE core logic. In this
case the warranty is void!
• Do not overload the output; the maximum output of the current converters is 10mA.
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DIGITAL-LOGIC AG
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11. THERMAL SPECIFICATIONS
11.1. Thermal Analysis for Case Integration
The MSB900/L has a unique thermal design. Heat sources are located on the bottom side of the PCB.
Usually this means the board will be mounted upside down with the CPU thermally in contact with a heat
sink. Alternatively, the CPU will be in contact with the system enclosure which then works as a heat sink.
The LX900 CPU is rated with a Total Dissipated Power (TDP) of 3.8W maximum and 1.6W typical @ 600
MHz.
The following picture is a thermal analysis of the bottom side. It was taken after one hour of operating (BIOS
screen) at room temperature. There was no heat sink mounted on the CPU.
fCPU
[MHz]
600
Uin [V]
TCPUmax [°C]
TCS5536max[°C]
12
Pay particular attention when mounting the PC-product in a fully enclosed case/box. The thermal energy will
be stored in the interior of this environment.
If the case has a fan:
•
•
The hot air must be exchanged with cool air from outside using a filtered fan.
The hot air must be cooled with a heat exchanger.
If the case has no fan or opening to exchange hot air:
• The heat sink of the CPU must be mounted directly to a heat sink integrated in the case. The heat will
be conducted directly through the alloy of the heat sink to the outside.
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12.ASSEMBLY VIEWS
12.1. MSB900/L
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MSB900/L Detailed Technical Manual V1.0
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MSB900/L Detailed Technical Manual V1.0
12.2. Mechanical Dimensions
MSB900 Version
Unit: mm (millimeter)
Tolerance: +/- 0.1mm
Date: 28.03.2006
Author: BRR
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13.PXE-BOOT AND PXE-SETUP IN THE BIOS
PXE Protocol
PXE is defined on a foundation of industry-standard Internet protocols and services that are widely deployed
in the industry, namely TCP/IP, DHCP, and TFTP. These standardize the form of the interactions between
clients and servers. To ensure that the meaning of the client-server interaction is standardized as well, certain vendor option fields in DHCP protocol are used, which are allowed by the DHCP standard. The operations of standard DHCP and/or BOOTP servers (that serve up IP addresses and/or NBPs) will not be disrupted by the use of the extended protocol. Clients and servers that are aware of these extensions will recognize and use this information, and those that do not recognize the extensions will ignore them.
In brief, the PXE protocol operates as follows. The client initiates the protocol by broadcasting a
DHCPDISCOVER containing an extension that identifies the request as coming from a client that implements
the PXE protocol. Assuming that a DHCP server or a Proxy DHCP server implementing this extended protocol is available, after several intermediate steps, the server sends the client a list of appropriate Boot Servers. The client then discovers a Boot Server of the type selected and receives the name of an executable file
on the chosen Boot Server. The client uses TFTP to download the executable from the Boot Server. Finally,
the client initiates execution of the downloaded image. At this point, the client’s state must meet certain requirements that provide a predictable execution environment for the image. Important aspects of this environment include the availability of certain areas of the client’s main memory, and the availability of basic network I/O services.
Deployment of servers
On the server end of the client-server interaction there must be available services that are responsible for
providing redirection of the client to an appropriate Boot Server. These redirection services may be deployed
in two ways:
1. Combined standard DHCP and redirection services.
The DHCP servers that are supplying IP addresses to clients are modified to become, or are replaced
by servers that serve up IP addresses for all clients and redirect PXE-enabled clients to Boot Servers
as requested.
2. Separate standard DHCP and redirection services.
PXE redirection servers (Proxy DHCP servers) are added to the existing network environment. They
respond only to PXE-enabled clients, and provide only redirection to Boot Servers. Each PXE Boot
Server must have one or more executables appropriate to the clients that it serves.
Preboot Execution Environment (PXE) Specification 11
Version 2.1 September 20, 1999
Copyright © 1998, 1999 Intel Corporation. All rights reserved.
This diagram illustrates the relationship between the NBP (the remote boot program) and the PXE APIs.
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BIOS-Setup Screen with the LAN-BOOT (PXE) DISABLE / ENABLE menu:
After ENABLING the LAN-Boot, the Password must be entered.
The Password must be requested with the PXE-licence order form on the following page.
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14.PXE-LICENSE ORDER
The PXE-Function must be licensed before it can be enabled. To order, fill out and sign this form; return to
the fax number below. This form may be printed out separately from the digital copy of this manual on the
Product CD.
Note... One license per form
Each computer system requires an individual, one-time royalty payment for the PXE-license. After
receipt of payment, you will be emailed the password necessary to enable the PXE-Function (see
Section 13).
Customer Information:
Company Name:
Your Name:
Street Address:
ZIP / City:
Email:
Information for the PXE-License:
Currency
(circle one)
Product
MPC20
USD
Euro
MPC21/A
Price per license
CHF
23 USD
17 Euro
28 CHF
For each additional license, please fill out another form.
Date:
Signature:
dd / mm / yyyy
Fax this form to your DIGITAL-LOGIC Sales Manager:
(please write in his/her name)
Fax: +0041 32 681 58 01
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MSB900/L Detailed Technical Manual V1.0
15.INDEX
I
1
10/100 BASE-T Interface
47
I/O Map
IDE interface
IDE Interface
Incompatibilities
Interfaces
Interrupt Controllers
ISO 9001:2000
A
Addressing PCI Devices
Application Notes
23
16, 22
B
Battery-Lifetime
BIOS CMOS
BIOS History
BIOS, Reload Default Settings
Block Diagram
Boot Time
Bus Signals
J
23
29
24
53
13
25
23
JTAG-Port
Jumper Locations
Keyboard PS/2
LCD TFT Interface
LPC-Port
LPT1
Manual, How to Use It
Mechanical Dimensions
memory address MAP
Memory Map
Mouse Utility Connector
MSM800-LVDSCON
17
5
26
E
35
16
5
23
Ordering Codes
16
P
Parallel Port
PCI-104 BUS Interface
power
Power Requirements
Power Supply
Printer
PS/2
PXE-Boot
PXE-License Order
PXE-Setup
12
12
15
27
G
Graphic Modes
2
61
35
35
47
21
O
F
Features, Standard
Features, Unique
Floppy disk
Floppy Disk Interface
45
51
26
M
D
EEPROM Memory for Setup
EMI / EMC
Environmental Protection Statement
External battery assembling
26, 47
L
29
34
41
27
28
26
Dimensions & Diagrams
Disclaimer
DRAM
52
53
K
C
CMOS
CMOS Setup
Connectors
Controllers
Counters
CPU
36
15
49
22
15, 26
27
11
50
51
25
25
44
26
47
62
64
62
40
R
H
Hard Disk Cable
Radiation
RAM Map
Recycling Information
55
65
22
29
6
DIGITAL-LOGIC AG
RoHS Commitment
ROM-BIOS
RTC
MSB900/L Detailed Technical Manual V1.0
9
28
28
T
Technical Support
Thermal Specifications
Timers
Trademarks
S
Safety Precautions
9
Schematics
59
Serial Interface Cable
56, 57
Serial Port COM1
50
Serial Port COM2
48
Serial Ports
27
Specifications
14
SQS
11
Standards
8
Swiss Association for Quality and Management
Systems
11
Swiss Quality
11
Symbols
7
System Description
25
6
58
28
5
U
UDOC
USB
44, 49
48
V
VGA
VGA Monitor
Video Input
40
52
41
W
Warranty
Watchdog
66
6
28