Site Preparation Guide
hp rp7405/rp7410 Servers
Second Edition
Manufacturing Part Number: A6752-96009
21102
USA
© Copyright 2002
Legal Notices
The information in this document is subject to change without notice.
Hewlett-Packard makes no warranty of any kind with regard to this manual, including, but not limited to, the
implied warranties of merchantability and fitness for a particular purpose. Hewlett-Packard shall not be held
liable for errors contained herein or direct, indirect, special, incidental or consequential damages in
connection with the furnishing, performance, or use of this material.
Restricted Rights Legend. Use, duplication or disclosure by the U.S. Government is subject to restrictions
as set forth in subparagraph (c) (1) (ii) of the Rights in Technical Data and Computer Software clause at
DFARS 252.227-7013 for DOD agencies, and subparagraphs (c) (1) and (c) (2) of the Commercial Computer
Software Restricted Rights clause at FAR 52.227-19 for other agencies.
HEWLETT-PACKARD COMPANY 3000 Hanover Street Palo Alto, California 94304 U.S.A.
Copyright Notices. ©copyright 1983-2002 Hewlett-Packard Company, all rights reserved.
Reproduction, adaptation, or translation of this document without prior written permission is prohibited,
except as allowed under the copyright laws.
ii
Contents
1. System Specifications
Dimensions and Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Circuit Breaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System AC Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature and Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical Power Dissipation and Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acoustic Noise Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Air Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
3
3
3
3
6
6
6
7
7
7
2. Facility Guidelines
Electrical Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Load Requirements (Circuit Breaker Sizing) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Quality. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sources of Electrical Disturbances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power System Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Distribution Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wire Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Raceway Systems (electrical conduits) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Building Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Routing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Grounding Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution Safety Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cabinet Performance Grounding (High frequency Ground). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Equipment Grounding Implementation Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wiring Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Communications Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Environmental Elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Computer Room Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Basic Air Conditioning Equipment Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Air Conditioning System Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Air Conditioning System Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Basic Air Distribution Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Air Conditioning System Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Humidity Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Air Conditioning Ducts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Dust and Pollution Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrostatic Discharge (ESD) Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Computer Room Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fire Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lighting Requirements for Equipment Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
11
12
12
12
13
13
13
13
13
14
14
14
16
17
17
17
18
18
18
19
19
19
20
20
21
21
22
22
24
24
24
iii
Contents
Facility Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Floor Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Windows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Space Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Delivery Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operational Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Zinc Particle Contamination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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25
25
27
28
28
28
30
Pre-installation Survey Content . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical Installation Schedule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Site Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Delivery Survey . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
32
33
34
37
3. Pre-installation Survey
A. System Requirements Summary
Power Consumption and Air Conditioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Power Consumption and Air Conditioning Requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Weight. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
B. Templates
Equipment Footprint Templates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Computer Room Layout Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
iv
Tables
Table 1. Revisions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .viii
Table 1-1. hp rp7405/rp7410 Server Dimensions and Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table 1-2. hp rp7405/rp7410 Component Weights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table 1-3. Power Cords. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Table 1-4. AC Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 1-5. AC Frequency Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 1-6. Typical hp rp7405/rp7410 Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2-1. Computer Room Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 2-2. Effect of Humidity on ESD Charge Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 2-3. Floor Loading Term Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 2-4. Typical Raised Floor Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 3-1. Customer and Hewlett-Packard Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 3-2. Site Inspection Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table A-1. Example Power Consumption (Theoretical Maximum) and Air Conditioning Requirement
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table A-2. Power Consumption (Theoretical Maximum) and Air Conditioning Requirement
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table A-3. Example Power Consumption (Typical) and Air Conditioning Requirement Summary 44
Table A-4. Power Consumption (Typical) and Air Conditioning Requirement Summary . . . . . . . . 44
Table A-5. Example Weight Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table A-6. Weight Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
v
Tables
vi
Figures
Figure 1. Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
Figure 2. Japanese RFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xii
Figure 3. Korean RFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiii
Figure 4. Taiwan Area EMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiv
Figure 5. C-Tick Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvi
Figure 1-1. Airflow Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 2-1. Raised Floor Ground System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 2-2. Cabinet Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 2-3. Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 3-1. Delivery Survey (Part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 3-2. Delivery Survey (Part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure B-1. hp rp7405/rp7410 Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure B-2. hp rp7405/rp7410 Cabinet Template. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure B-3. Planning Grid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
vii
Figures
viii
Preface
Revision History
Table 1
Revision
Revisions
Part Number
Release Date
Description
Second
A6752-96003
November 2002
Made general updates and corrections throughout book
First
A6752-96003
August 2002
Initial Release
viii
Notational Conventions
WARNING
Warnings highlight procedures or information necessary to avoid injury to
personnel. The warning should tell the reader exactly what will result from what
actions and how to avoid them.
CAUTION
A caution highlights procedures or information necessary to avoid damage to equipment,
damage to software, loss of data, or invalid test results.
NOTE
A note highlights supplemental information.
ix
Safety and Regulatory
Regulatory Model: RSVLA-0102
For your protection, this product has been tested to various national and international regulations and
standards. The scope of this regulatory testing includes electrical/mechanical safety, radio frequency
interference, acoustics, and know hazardous materials.Where applicable, approvals obtained from third-party
test agencies are shown on the product label.
Safety in Material Handling
WARNING
Do not lift the cabinet manually. To avoid physical injury you must use a mechanical
lifting device.
WARNING
Use care when working with hazardous voltages. This equipment may be configured
with dual input line sources. Hazardous voltages and energy maybe present even
after the removal of a single input source. Trained service personnel must follow the
service guidelines.
WARNING
Do not stand in front of the equipment as it is rolled off the pallet onto the ramps.
When removing the equipment from the shipping pallet, follow the guidelines
specified in the Installation Procedures section of the appropriate equipment
guides.
NOTE
Electrical practices and suggestions in this guide are based on North American practices. For
countries outside North America, local electrical codes will take precedence over North
American electrical codes.
An example would be the recommendation that the PE (protective earthing) conductor be green
with yellow stripes. This requirement is a North American directive and does not override the
local code requirements for a country outside North America.
Throughout this manual, the [LAHJ] acronym will be used to indicate Local Authority Has Jurisdiction.
x
Figure 1
Declaration of Conformity
xi
USA Radio Frequency Interference
FCC Notice
The Federal Communications Commission (in 47 CFR Part 15 subpart B) has specified that the following
notice be brought to the attention of the users of this product.
NOTE
This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a residential area is
likely to cause harmful interference in which case the user will be required to correct the
interference at his own expense.
The user is cautioned that changes or modifications not expressly approved by Hewlett-Packard could result
in the equipment being noncompliant with FCC Class A requirements and void the user’s authority to
operated the equipment.
Japanese Radio Frequency Interference
VCCI
This equipment is in the Class A category information technology equipment based on the rules of Voluntary
Control Council For Interference by Information Technology Equipment (VCCI). When used in a residential
area, radio interference may be caused. In this case, user may be required to take appropriate corrective
actions.
Figure 2
xii
Japanese RFI
Korean RFI Statement
Certification Number: E - AAAAA - BB - CCCC
•
E: EMC registration
•
AAAAA: equipment codes (RRL notice, 2000.10.26)
•
BB: certification year
•
CCCC: registration number
Figure 3
Korean RFI
Translation
Class A Equipment:
Please note that this equipment has been approved for business purpose with regards to electromagnetic
interference, if purchased un error for use in residential area, you may wish to exchange the equipment where
you purchase it.
Class B Equipment:
Please note that this equipment has been approved for non-business with regards to electromagnetic
interference. So, this equipment can be allowed to use all area as well as residential area.
European Union RFI Statement
This is a Class A product. In a domestic environment this product may cause radio interference in which case
the user may be required to take adequate measures.
Canada RFI Statement
This Class A digital apparatus complies with Canadian ICES-003.
Notice relative aux interférences radioélectriques (Canada)
Cet appareil numéric de la classe A est conforme à la norme NMB-003 du Canada.
xiii
BSMI (Taiwan Area)
This product is fully compliant to CNS 13438 (CISPR 22: 1993) Class A. The EMC label is in the form shown
in Figure 4.
Figure 4
Taiwan Area EMC
Acoustics (Germany)
Acoustic Noise (A-weighted Sound Pressure Level LpA) measured at the bystander position, normal
operation, to ISO 7779: LpA = 59 dB.
Geräuschemission (Deutschland)
Lärmangabe (Schalldruckpegel LpA) gemessen am fiktiven Arbeitsplatz bei normalem Betrieb nach
DIN 45635, Teil 19: LpA = 59 dB.
IT Power System
This product has not been evaluated for connection to an IT power system (an AC distribution system having
no direct connection to earth according to IEC 60950).
TT, TN-C, and TN-C-S Power Systems
These products should not be connected to power systems that switch open the return lead when the return
lead also functions as the protective earth (PE). A separate PE ground wire must be connected to the
equipment at the designated PE terminal tie point.
xiv
Installation Conditions
See installation instructions before connecting this equipment to the input supply.
Voir la notice d’installation avant de raccorder au réseau.
WARNING
NORDIC Class 1 Equipment
Denmark: Før tilslutning af de øvrige ledere, se medfølgende
installationsvejledning.
WARNING
NORDIC Class 1 Equipment
Sweden: Apparaten skall anslutas till jordat uttag, när den ansluts till ett nätverk.
Network Connected Equipment
The installation must provide a ground connection for the network equipment.
CAUTION
Sweden: Apparaten skall anslutas till jordat uttang när deb abskuts till ett nätverk.
CAUTION
Norway: Apparaten skall anslutas till jordat uttang nar deb abskuts till ett natverk.
xv
Lithium Battery Caution
WARNING
Observe the correct polarity when changing the lithium battery. There is a danger of
explosion if battery is installed incorrectly.
Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions and local
disposal requirements.
IMPORTANT Switzerland: Annex 4.10 of SR 814.013 applies to batteries.
Australian C-Tick Label
Figure 5
xvi
C-Tick Label
Laser Safety
NOTE
If a Fibre Channel I/O card is present, the following laser safety statement applies.
This product contains a laser internal to the Optical Link Module (OLM) for connection to the Fibre
communications port.
In the USA, the OLM is certified as a Class 1 laser product conforming to the requirements contained in the
Department of Health and Human Services (DHHS) regulation 21 CFR, Subchapter J. The certification is
indicated by a label on the plastic OLM housing.
Outside the USA, the OLM is certified as a Class 1 laser product conforming to the requirements contained in
IEC 60825-1:1993 and EN 60825-1:1994, including Amendment 11:1996.
NOTE
If a DVD is present, the following laser safety statement applies.
This product contains a laser internal to the Digital Versatile Disc (DVD) housing.
In the USA, the DVD is certified as a Class 1 laser product conforming to the requirements contained in the
Department of Health and Human Services (DHHS) regulation 21 CFR, Subchapter J. The certification is
indicated by a label on the DVD housing.
Outside the USA, the DVD is certified as a Class 1 laser product conforming to the requirements contained in
IEC 60825-1:1993+A1 and EN 60825-1:1994+A11.
xvii
xviii
1
System Specifications
Chapter 1
1
System Specifications
Dimensions and Weights
Dimensions and Weights
This section provides dimensions and weights of the system components.
Table 1-1
hp rp7405/rp7410 Server Dimensions and Weights
Standalone
Packaged
Height - Inches (centimeters)
17.3 (43.9)
35.75 (90.8)
Width - Inches (centimeters)
17.5 (44.4)
28.0 (71.1)
Depth - Inches (centimeters)
30.0 (76.2)
28.38 (72.0)
Weight - Pounds (kilograms)
220 (100)
N./A
Shipping box, pallet, ramp, and container adds approximately 50 lbs to the total system weight. The size and
number of miscellaneous pallets will be determined by the equipment ordered by the customer.
Table 1-2
Quantity
hp rp7405/rp7410 Component Weights
Description
Weight (lb/kg.)
1 or 2
Cell board
19.81 (9.0)
1
System backplane
12 (estimate) 5.44 (estimate)
1
PCI backplane
20.4 (9.25)
2
Bulk power supply
18 (8.2)
1
Mass storage backplane
1 (0.45)
2
PCI DC-to-DC converters
5 (2.27)
2
Chapter 1
System Specifications
Electrical Specifications
Electrical Specifications
This section provides electrical specifications for hp rp7405/rp7410 servers.
Grounding
The site building shall provide a safety ground/protective earth for each AC service entrance to all cabinets.
Install a PE (protective earthing) conductor that is identical in size, insulation material, and thickness to the
branch-circuit supply conductors. The PE conductor must be green with yellow stripes. The earthing
conductor described is to be connected from the unit to the building installation earth or, if supplied by a
separately derived system, at the supply transformer or motor-generator set grounding point.
Circuit Breaker
The Marked Electrical for the hp rp7405/rp7410 server is 12 amps. The recommended circuit breaker size is
20 amps for North America. For countries outside North America, consult your local electrical authority
having jurisdiction for the recommended circuit breaker size.
System AC Power Specifications
Power Cords
The supplied power cord length is 15 feet (457.4 cm). Table 1-3 lists the various power cables available for use
with a hp rp7405/rp7410 system. Each power cord is 15 feet (4.5 meters) in length with a IEC 60320-1 C19
female connector attached to one end.
Table 1-3
Power Cords
Part Number
Description
Where Used
8120-6895
Stripped end, 240 volt
International-Europe
8120-6897
Male IEC309, 240 volt
International
8121-0070
Male GB-1002, 240 volts
China
8120-6899
Male CEEE 7/7, 240 volt
Continental Europe
8121-0558
Male ISI-32, 240 volts
Israel
8120-6903
Male NEMA L6-20, 240 volt
North America/Japan
System Power Specifications
Table 1-4 and Table 1-5 list the AC power requirements for the server. These tables provide information to
help determine the amount of AC power needed for your computer room.
Table 1-4
AC Power Specifications
Requirements
Nominal input voltage
Chapter 1
Value
Comments
200, 208, 220, 240 VAC
3
System Specifications
Electrical Specifications
Table 1-4
AC Power Specifications (Continued)
Requirements
Value
Minimum Operating Voltage
180 VAC
Maximum Operating Voltage
269 VAC
Frequency range (minimum maximum)
50 - 60 (Hz)
Number of phases
1
Rated line current
12 A rms
Maximum inrush current
30 A peak for 15 ms
Dropout carry-through time at
minimum line voltage
20 ms
Circuit breaker rating
20 A
Branch Circuit Breaker (Size,
Type)
20A, slow trip delay
type
Power factor correction
>0.97 @269VAC
>0.93 @262VAC
Ground leakage current (mA)
<3.0 (ma)
kVA rating
2.7 KVA
Table 1-5
Comments
Per line cord
Per line cord
At all loads of 50% - 100% of
supply rating
At all loads 0f 30% - 50% of
supply rating
Per line cord
System Power Requirements
Power Required (50 - 60 Hz)
VA
Comments
Maximum configuration hp rp7405/rp7410 server PA8700
3000
Theoretical
Typical configuration hp rp7405/rp7410 server PA8700
1700
Typical
Future upgrades may increase the Maximum Theoretical System Power to 3400 VA.
Maximum power is the sum of the worst case power consumption of every subsystem in the box, and should
be used to size worst case power consumption for facility installation. Typical power consumption numbers
are what HP engineers have measured running power intensive applications. These are generally lower than
maximum power numbers due to the fact that getting all of the subsystems in the box to simultaneously draw
maximum power for long durations being uncommon.
4
Chapter 1
System Specifications
Environmental Specifications
Environmental Specifications
This section provides the environmental, power dissipation, noise emission, and air flow specifications for the
hp rp7405/rp7410 server.
Temperature and Humidity
The cabinet is actively cooled using forced convection in a Class C1-modified environment.
Operating Environment
The system is designed to run continuously and meet reliability goals in an ambient temperature of 5° C - 35°
C at sea level. The maximum allowable temperature is derated 1° C per 1000 feet of elevation above 5000 feet
above sea level up to 30° C at 10,000 feet. For optimum reliability and performance, the recommended
operating range is 20° C to 25° C
Environmental Temperature Sensor
To ensure that the system is operating within the published limits, the ambient operating temperature is
measured using a sensor placed near the chassis inlet, between the cell boards. Data from the sensor is used
to control the fan speed and also to initiate system overtemp shutdown. (For more details see the platform
management section.)
Non-Operating Environment
The system is designed to withstand ambient temperatures between -40° C to 70° C under non-operating
conditions.
Cooling
Cell Section Cooling
The cabinet incorporates front to back airflow across the cell boards and system backplane. Two (2) 150mm
fans, mounted externally on the front chassis wall behind the cosmetic front bezel, push air into the Cell
section; and two (2) 150mm fans housed in cosmetic plastic fan carriers and mounted externally to the rear
chassis wall, pull air through the Cell section.
Each cell area fan cooling is controlled by a smart fan control board, embedded in the fan module plastic
housing. The smart fan control board receives fan control input from the system fan controller on the system
backplane and returns fan status information to the system fan controller. The smart fan control board also
controls the power and the pulse width modulated control signal to the fan and monitors the speed indicator
back from the fan. The fan status LED is driven by the smart fan control board.
Bulk Power Supply Cooling
Cooling for the bulk power supplies is provided by two (2) 60mm fans contained within each BPS. Air flows
into the front of the BPS and is exhausted out of the top of the power supply though upward facing vents near
the rear of the supply. The air is then ducted out of the rear of the chassis with minimal leakage into the cell
airflow plenum.
Chapter 1
5
System Specifications
Environmental Specifications
PCI/Mass Storage Section Cooling
Six (6) 92mm fans located between the Mass Storage Devices and the PCI Card Cage provide airflow through
these devices. The PCI fans are powered off of housekeeping power and + run at full speed at all times. The
air is pulled through the mass storage devices and pushed through the PCI Card Cage. Perforation is
provided between the PCI bulkheads to allow adequate exhaust ventilation and to help reduce the localized
airflow dead spots that typically occur at the faceplate tail of each PCI card.
Standby Cooling
Several components within the chassis consume significant amounts of power while the system is in standby
mode. The system fans will be run at 1541 rpm, or 38% of full speed, during standby to remove the resulting
heat from the cabinet. The fans within the power supply will operate at full speed during standby.
Typical Power Dissipation and Cooling
Table 1-6
Typical hp rp7405/rp7410 Configurations
Cell
Boards
Memory
Per Cell
Board
PCI Cards
(assumes
10 watts
each)
DVDs
Hard
Disk
Drives
Core
I/O
Bulk
Power
Supplies
Typical
Power
Typical
Cooling
Qty
GBytes
Qty
Qty
Qty
Qty
Qty
Watts
BTU/Hr
2
16
16
2
4
2
2
2000
6826
2
8
8
0
2
2
2
1810
6179
2
4
8
0
2
2
2
1757
5998
1
4
8
0
1
1
2
1148
3919
Acoustic Noise Specification
The acoustic noise specification for the hp rp7410 server is 57.3 db (sound pressure level at bystander
position) It is appropriate for dedicated computer room environments, not office environments. The LwA is 7.5
Bels. Care should be taken to understand the acoustic noise specifications relative to operator positions
within the computer room or when adding servers to computer rooms with existing noise sources.
Air Flow
The hp rp7405/rp7410 servers require that the cabinet air intake temperature be between 68° F and 77° F
(20° C and 25° C) at 960 CFM.
6
Chapter 1
System Specifications
Environmental Specifications
Figure 1-1 illustrates the location of the inlet and outlet airducts on a single cabinet.
Figure 1-1
Chapter 1
Airflow Diagram
7
System Specifications
Environmental Specifications
8
Chapter 1
2 Facility Guidelines
Chapter 2
9
Facility Guidelines
Electrical Considerations
Electrical Considerations
Proper design and installation of a power distribution system for an hp rp7405/rp7410 server requires
specialized skills. Those responsible for this task must have a thorough knowledge and understanding of
appropriate electrical codes and the limitations of the power systems for computer and data processing
equipment.
In general, a well-designed power distribution system exceeds the requirements of most electrical codes. A
good design, when coupled with proper installation practices, produces the most trouble-free operation.
The electrical factors discussed in this section are:
A detailed discussion of power distribution system design and installation is beyond the scope of this
document. However, electrical factors relating to power distribution system design and installation must be
considered during the site preparation process.
•
Computer room safety
•
Electrical load requirements (circuit breaker sizing)
•
Power quality
•
Distribution hardware
•
System installation guidelines
10
Chapter 2
Facility Guidelines
Electrical Load Requirements (Circuit Breaker Sizing)
Electrical Load Requirements (Circuit Breaker Sizing)
It is always a good idea to derate power distribution systems for one or more of the following reasons:
•
To avoid nuisance tripping from load shifts or power transients, circuit protection devices should never be
run above 80% of their root-mean-square (RMS) current ratings.
•
Safety agencies derate most power connectors to 80% of their RMS current ratings.
Chapter 2
11
Facility Guidelines
Power Quality
Power Quality
This equipment is designed to operate over a wide range of voltages and frequencies. It has been tested and
shown to comply with EMC Specification EN50082. However, damage can occur if these ranges are exceeded.
Severe electrical disturbances can exceed the design specifications of the equipment.
Sources of Electrical Disturbances
Electrical disturbances, sometimes called glitches, affect the quality of electrical power. Common sources of
these disturbances are:
•
Fluctuations occurring within the facility’s distribution system
•
Utility service low-voltage conditions (such as sags or brownouts)
•
Wide and rapid variations in input voltage levels
•
Wide and rapid variations in input power frequency
•
Electrical storms
•
Large inductive sources (such as motors and welders)
•
Faults in the distribution system wiring (such as loose connections)
•
Microwave, radar, radio, or cell phone transmissions
Power System Protection
Computer systems can be protected from the sources of many of these electrical disturbances by using:
•
A dedicated power distribution system
•
Power conditioning equipment
•
Over- and under-voltage detection and protection circuits
•
Screening to cancel out the effects of undesirable transmissions
•
Lightning arresters on power cables to protect equipment against electrical storms
Every precaution has been taken during power distribution system design to provide immunity to power
outages of less than one cycle. However, testing cannot conclusively rule out loss of service. Therefore,
adherence to the following guidelines provides the best possible performance of power distribution systems
for server equipment:
•
Dedicated power source—Isolates server power distribution system from other circuits in the facility.
•
Missing-phase and low-voltage detectors—Shuts equipment down automatically when a severe power
disruption occurs. For peripheral equipment, these devices are recommended but optional.
•
Online uninterruptible power supply (UPS)—Keeps input voltage to devices constant and should be
considered if outages of one-half cycle or more are common. Refer to qualified contractors or consultants
for each situation.
12
Chapter 2
Facility Guidelines
Distribution Hardware
Distribution Hardware
This section describes wire selection and the types of raceways (electrical conduits) used in the distribution
system.
Wire Selection
Use copper conductors instead of aluminum, as aluminum’s coefficient of expansion differs significantly from
that of other metals used in power hardware. Because of this difference, aluminum conductors can cause
connector hardware to work loose, overheat, and fail.
Raceway Systems (electrical conduits)
Raceways (electrical conduits) form part of the protective ground path for personnel and equipment.
Raceways protect the wiring from accidental damage and also provide a heatsink for the wires.
Any of the following types may be used:
•
Electrical metallic tubing (EMT) thin-wall tubing
•
Rigid (metal) conduit
•
Liquidtight with RFI strain relief (most commonly used with raised floors)
Building Distribution
All building feeders and branch circuitry should be in rigid metallic conduit with proper connectors (to
provide ground continuity) Conduit that is exposed and subject to damage should be constructed of rigid
galvanized steel.
Power Routing
Power drops and interface cables from the equipment are routed down from the power panel, through a
grommet protected opening (beneath the floor level), and under the floor panels.
Chapter 2
13
Facility Guidelines
Grounding Systems
Grounding Systems
hp rp7405/rp7410 servers require two methods of grounding:
•
Power distribution safety grounding
•
High frequency intercabinet grounding
Power Distribution Safety Grounding
The power distribution safety grounding system consists of connecting various points in the power
distribution system to earth ground using green (green/yellow) wire ground conductors. Having these ground
connections tied to metal chassis parts that may be touched by computer room personnel protects them
against shock hazard from current leakage and fault conditions.
Power distribution systems consist of several parts. Hewlett-Packard recommends that these parts be solidly
interconnected to provide an equipotential ground to all points.
Main Building Electrical Ground
The main electrical service entrance equipment should have an earth ground connection, as required by
applicable codes. Connections such as a grounding rod, building steel, or a conductive type cold water service
pipe provide an earth ground.
Electrical Conduit Ground
All electrical conduits should be made of rigid metallic conduit that is securely connected together or bonded
to panels and electrical boxes, so as to provide a continuous grounding system.
Power Panel Ground
Each power panel should be grounded to the electrical service entrance with green (green/yellow) wire ground
conductors. The green (green/yellow) wire ground conductors should be sized per applicable codes (based on
circuit over current device ratings).
NOTE
The green wire ground conductor mentioned above may be a black wire marked with green
tape.
Computer Safety Ground
Ground all computer equipment with the green (green/yellow) wire included in the branch circuitry. The
green (green/yellow) wire ground conductors should be connected to the appropriate power panel and should
be sized per applicable codes (based on circuit over current device ratings).
Cabinet Performance Grounding (High frequency Ground)
Signal interconnects between system cabinets require high frequency ground return paths. Connect all
cabinets to site ground.
14
Chapter 2
Facility Guidelines
Grounding Systems
NOTE
In some cases power distribution system green (green/yellow) wire ground conductors are too
long and inductive to provide adequate high frequency ground return paths. Therefore, the
server is shipped with a ground strap for connecting the system cabinet to the site grounding
grid (customer-supplied). When connecting this ground, ensure that the raised floor is properly
grounded.
Power panels located in close proximity to the computer equipment should also be connected to the site
grounding grid. Methods of providing a sufficiently high frequency ground grid are described in the next
sections.
Raised Floor Grounding
If a raised floor system is used, install a complete signal grounding grid for maintaining equal potential over
a broad band of frequencies. The grounding grid should be connected to the equipment cabinet and electrical
service entrance ground at multiple connection points using a minimum #6 AWG (16mm2) wire ground
conductor.
Hewlett-Packard recommends the following approaches:
•
Excellent—Add a grounding grid to the subfloor. The grounding grid should be made of aluminum strips
mounted to the subfloor. The strips should be 0.032 in. (0.08 cm) thick and a minimum of 3.0 in. (8.0 cm)
wide.
Connect each pedestal to four strips using 1/4 in. (6.0 mm) bolts tightened to the manufacturer’s torque
recommendation.
Chapter 2
15
Facility Guidelines
Grounding Systems
•
Good—Use the raised floor structure as a ground grid. In this case, the floor must be designed as a ground
grid with bolted down stringers and corrosion resistive plating (to provide low resistance and attachment
points for connection to service entrance ground and server equipment). The use of conductive floor tiles
with this style of grid further enhances ground performance.
Figure 2-1
Raised Floor Ground System
Equipment Grounding Implementation Details
If it has been determined to be necessary, connect all Hewlett-Packard equipment cabinets to the site ground
grid as follows:
Step 1. Attach one end of each ground strap to the applicable cabinet ground lug.
Step 2. Attach the other end to the nearest pedestal base (raised floor) or cable trough ground point
(nonraised floor).
Step 3. Check that the braid contact on each end of the ground strap consists of a terminal and connection
hardware (a 1/4-in. (6.0-mm) bolt, nuts, and washers).
Step 4. Check that the braid contact connection points are free of paint or other insulating material and
treated with a contact enhancement compound (similar to Burndy Penetrox).
16
Chapter 2
Facility Guidelines
System Installation Guidelines
System Installation Guidelines
This section contains information about installation practices. Some common pitfalls are highlighted. Both
power cable and data communications cable installations are discussed.
NOTE
In domestic installations, the proper receptacles should be installed prior to the arrival of
Hewlett-Packard equipment. Refer to the appropriate installation guide for installation
procedures.
Wiring Connections
Expansion and contraction rates vary among different metals. Therefore, the integrity of an electrical
connection depends on the restraining force applied. Connections that are too tight compress or deform the
hardware and causes it to weaken. This usually leads to high impedance causing circuit breakers to trip.
CAUTION
Connections that are too loose have a high resistance that cause serious problems, such as
erratic equipment operation. A high resistance connection overheats and sometimes causes fire
or high temperatures that can destroy hard-to-replace components such as distribution panels
or system bus bars.
Wiring connections must be properly torqued. Many equipment manufacturers specify the proper connection
torque values for their hardware.
Ground connections must only be made on a conductive, nonpainted surface. When equipment vibration is
present, lockwashers must be used on all connections to prevent connection hardware from working loose.
Data Communications Cables
Power transformers and heavy foot traffic create high energy fields. Route data communications cables away
from these areas. Use shielded data communications cables that meet approved industry standards to reduce
the effects of external fields.
Chapter 2
17
Facility Guidelines
Environmental Elements
Environmental Elements
The following environmental elements can affect an hp rp7405/rp7410 server installation:
•
Computer room preparation
•
Cooling requirements
•
Humidity level
•
Air conditioning ducts
•
Dust and pollution control
•
Electrostatic discharge (ESD) prevention
•
Acoustics (noise reduction)
Computer Room Preparation
The following guidelines are recommended when preparing a computer room for an hp rp7405/rp7410 server
system:
•
Locate the computer room away from the exterior walls of the building to avoid the heat gain from
windows and exterior wall surfaces.
•
When exterior windows are unavoidable, use windows that are double or triple glazed and shaded to
prevent direct sunlight from entering the computer room.
•
Maintain the computer room at a positive pressure relative to surrounding spaces.
•
Use a vapor barrier installed around the entire computer room envelope to restrain moisture migration.
•
Caulk and vapor seal all pipes and cables that penetrate the envelope.
•
Use at least a 12-inch raised floor system for the most favorable room air distribution system (underfloor
distribution).
•
Ensure a minimum ceiling height of 12 inches between the top of the server and the ceiling and that all
ceiling clips are in place.
Basic Air Conditioning Equipment Requirements
The cooling capacity of the installed air conditioning equipment for the computer room should be sufficient to
offset the computer equipment dissipation loads, as well as any space envelope heat gain. This equipment
should include:
•
Air filtration
•
Cooling or dehumidification
•
Humidification
•
Reheating
•
Air distribution
•
System controls adequate to maintain the computer room within the operating range.
Lighting and personnel must also be included. For example, a person dissipates about 450 BTUs per hour
while performing a typical computer room task.
18
Chapter 2
Facility Guidelines
Environmental Elements
At altitudes above 5,000 feet (3048 m), the lower air density reduces the cooling capability of air conditioning
systems. If your facility is located above this altitude, the recommended temperature ranges may need to be
modified. For each 1000 feet (305 m) increase in altitude above 5,000 feet (up to a maximum of 10,000 feet),
subtract 1.0° C from the upper limit of the temperature range.
Air Conditioning System Guidelines
The following guidelines are recommended when designing an air conditioning system and selecting the
necessary equipment:
•
The air conditioning system that serves the computer room should be capable of operating 24 hours a day,
365 days a year. It should also be independent of other systems in the building.
•
Consider the long-term value of computer system availability, redundant air conditioning equipment or
capacity.
•
The system should be capable of handling any future computer system expansion.
•
Air conditioning equipment air filters should have a minimum rating of 45% (based on “AShRA Standard
52-76, Dust Spot Efficiency Test”).
•
Introduce only enough outside air into the system to meet building code requirements (for human
occupancy) and to maintain a positive air pressure in the computer room.
Air Conditioning System Types
The following three air conditioning system types are listed in order of preference:
•
Complete self-contained package unit(s) with remote condenser(s)—These systems are available with up
or down discharge and are usually located in the computer room.
•
Chilled water package unit with remote chilled water plant—These systems are available with up or
down discharge and are usually located in the computer room.
•
Central station air handling units with remote refrigeration equipment—These systems are usually
located outside the computer room
•
Scalable overhead distribution system—This system distributes water overhead to air heat exchangers,
which cool the air locally over the servers. This system called DataCoolTM is primarily used in high
density environments of 100 to 500 watts per square foot.
Basic Air Distribution Systems
A basic air distribution system includes supply air and return air.
An air distribution system should be zoned to deliver an adequate amount of supply air to the cooling air
intake vents of the computer system equipment cabinets. Supply air temperature should be maintained
within the following parameters:
•
Ceiling supply system—From 55° F (12.8° C) to 60° F (15.6° C)
•
Floor supply system—At least 60° F (15.6° C)
If a ceiling plenum return air system or a ducted ceiling return air system is used, the return air grille(s) in
the ceiling should be located directly above the computer equipment cabinets.
The following three types of air distribution system are listed in order of recommendation:
Chapter 2
19
Facility Guidelines
Environmental Elements
•
Underfloor air distribution system—Downflow air conditioning equipment located on the raised floor of
the computer room uses the cavity beneath the raised floor as plenum for the supply air.
Perforated floor panels (available from the raised floor manufacturer) should be located around the
perimeter of the system cabinets. Supply air emitted though the perforated floor panels is then available
near the cooling air intake vents of the computer system cabinets.
•
Ceiling plenum air distribution system—Supply air is ducted into the ceiling plenum from upflow air
conditioning equipment located in the computer room or from an air handling unit (remote).
The ceiling construction should resist air leakage. Place perforated ceiling panels (with down discharge
air flow characteristics) around the perimeter of the system cabinets. The supply air emitted downward
from the perforated ceiling panels is then available near the cooling air intake vents of the computer
system cabinets.
Return air should be ducted back to the air conditioning equipment though the return air duct above the
ceiling.
•
Above ceiling ducted air distribution system—Supply air is ducted into a ceiling diffuser system from
upflow air conditioning equipment located in the computer room or from an air handling unit (remote).
Adjust the supply air diffuser system grilles to direct the cooling air downward around the perimeter of
the computer system cabinets. The supply air is then available near the cooling air intake vents of the
computer system cabinets.
Table 2-1
Parameter
Computer Room Environment
Operating Limits
Recommended
Operating
Range
Maximum Rate of
Change (per hour)
Non-Operating
Ranges
Temperaturea 41° - 95° F
(5° - 35° C)
68° - 77° F
(20° - 25° C)
20° C/hr (no tape media) -40° C - +70° C
10° C/hr (with tape media)
Humidity
40% - 55% RH
non-condensing
30% RH/hour
non-condensing
15% - 80%
with no condensation
(40% - 55% recommended)
90% RH
non-condensing
@ 65° C (149° F)
a. The temperature ranges stated are at 0 to 5,000 feet. The maximum operating temperature must be
de-rated by 1° C/1,000 feet from 5,000 to 10,000 feet.
Air Conditioning System Installation
All air conditioning equipment, materials, and installation must comply with any applicable construction
codes. Installation of the various components of the air conditioning system must also conform to the air
conditioning equipment manufacturer’s recommendations.
Humidity Level
Maintain proper humidity levels. High humidity causes galvanic actions to occur between some dissimilar
metals. This eventually causes a high resistance between connections, leading to equipment failures. High
humidity can also have an adverse affect on some magnetic tapes and paper media.
20
Chapter 2
Facility Guidelines
Environmental Elements
CAUTION
Low humidity contributes to undesirably high levels of electrostatic charges. This increases the
electrostatic discharge (ESD) voltage potential. ESD can cause component damage during
servicing operations. Paper feed problems on high-speed printers are usually encountered in
low-humidity environments.
Low humidity levels are often the result of the facility heating system and occur during the cold season. Most
heating systems cause air to have a low humidity level, unless the system has a built-in humidifier.
Air Conditioning Ducts
Use separate computer room air conditioning duct work. If it is not separate from the rest of the building, it
might be difficult to control cooling and air pressure levels. Duct work seals are important for maintaining a
balanced air conditioning system and high static air pressure. Adequate cooling capacity means little if the
direction and rate of air flow cannot be controlled because of poor duct sealing. Also, the ducts should not be
exposed to warm air, or humidity levels may increase.
Dust and Pollution Control
Computer equipment can be adversely affected by dust and microscopic particles in the site environment.
Specifically, disk drives, tape drives, and some other mechanical devices can have bearing failures resulting
from airborne abrasive particles. Dust may also blanket electronic components like printed circuit boards
causing premature failure due to excess heat and/or humidity build up on the boards. Other failures to power
supplies and other electronic components can be caused by metallically conductive particles. These metallic
particles are conductive and can short circuit electronic components. Use every effort to ensure that the
environment is as dust and particulant free as possible.
Smaller particles can pass though some filters and, over a period of time, resulting in possible cause problems
in mechanical parts. Small dust particles can be prevented from entering the computer room by maintaining
its air conditioning system at a high static air pressure level.
Other sources of dust, metallic, conductive, abrasive, and/or microscopic particles can be present. Some
sources of these particulants are:
•
Subfloor shedding
•
Raised floor shedding
•
Ceiling tile shedding
These pollutants are not always visible to the naked eye. A good check to determine their possible presence is
to check the underside of the tiles. The tile should be shiny, galvanized, and free from rust.
The computer room should be kept clean. The following guidelines are recommended:
•
Smoking—Establish a no-smoking policy. Cigarette smoke particles are eight times larger than the
clearance between disk drive read/write heads and the disk surface.
•
Printer—Locate printers and paper products in a separate room to eliminate paper particulate problems.
•
Eating or drinking—Establish a no-eating or drinking policy. Spilled liquids can cause short circuits in
equipment such as keyboards.
•
Tile floors—Use a dust-absorbent cloth mop rather than a dry mop to clean tile floors.
Chapter 2
21
Facility Guidelines
Environmental Elements
Special precautions are necessary if the computer room is near a source of air pollution. Some air pollutants,
especially hydrogen sulfide (H2S), are not only unpleasant but corrosive as well. Hydrogen sulfide damages
wiring and delicate sound equipment. The use of activated charcoal filters reduces this form of air pollution.
Electrostatic Discharge (ESD) Prevention
Static charges (voltage levels) occur when objects are separated or rubbed together. The voltage level of a
static charge is determined by the following factors:
•
Types of materials
•
Relative humidity
•
Rate of change or separation
Table 2-2 lists charge levels based on personnel activities and humidity levels.
Table 2-2
Effect of Humidity on ESD Charge Levels
Personnel Activitya
Humidityband Charge Levels (voltages)c
26%
32%
40%
50%
6,150 V
5,750 V
4,625 V
3,700 V
Person walking across a carpeted
floor
18,450 V
17,250 V
13,875 V
11,100 V
Person getting up from a plastic
chair
24,600 V
23,000 V
18,500 V
14,800 V
Person walking across a
linoleum floor
a. Source: B.A. Unger, Electrostatic Discharge Failures of Semiconductor Devices
(Bell Laboratories, 1981)
b. For the same relative humidity level, a high rate of airflow produces higher
static charges than a low airflow rate.
c. Some data in this table has been extrapolated.
Static Protection Measures
Follow these precautions to minimize possible ESD-induced failures in the computer room:
•
Install conductive flooring (conductive adhesive must be used when laying tiles).
•
Use conductive wax if waxed floors are necessary.
•
Ensure that all equipment and flooring are properly grounded and are at the same ground potential.
•
Use conductive tables and chairs.
•
Use a grounded wrist strap (or other grounding method) when handling circuit boards.
•
Store spare electronic modules in antistatic containers.
•
Maintain recommended humidity level and airflow rates in the computer room.
22
Chapter 2
Facility Guidelines
Environmental Elements
Acoustics
Computer equipment and air conditioning blowers cause computer rooms to be noisy. Ambient noise level in a
computer room can be reduced as follows:
•
Dropped ceiling—Cover with a commercial grade of fire-resistant, acoustic rated, fiberglass ceiling tile.
•
Sound deadening—Cover the walls with curtains or other sound deadening material.
•
Removable partitions—Use foam rubber models for most effectiveness.
Chapter 2
23
Facility Guidelines
Computer Room Safety
Computer Room Safety
Inside the computer room, fire protection and adequate lighting (for equipment servicing) are important
safety considerations. Federal and local safety codes govern computer installations.
Fire Protection
The national Fire Protection Association’s Standard for the Protection of Electronic Computer Data
Processing Equipment, NFPA 75, contains information on safety monitoring equipment for computer rooms.
Most computer room installations are equipped with the following fire protection devices:
•
Smoke detectors
•
Fire and temperature alarms
•
Fire extinguishing system
Additional safety devices are:
•
Circuit breakers
•
An emergency power cutoff switch
•
Devices specific to the geographic location i.e., earthquake protection
Lighting Requirements for Equipment Servicing
Adequate lighting and utility outlets in a computer room reduce the possibility of accidents during equipment
servicing. Safer servicing is also more efficient and, therefore, less costly.
For example, it is difficult to see cable connection points on the hardware if there is not enough light.
Adequate lighting reduces the chances of connector damage when cables are installed or removed.
The minimum recommended illumination level is 70 foot-candles (756 lumens per square meter) when the
light level is measured at 30 inches (76.2 cm) above the floor.
24
Chapter 2
Facility Guidelines
Facility Characteristics
Facility Characteristics
This section contains information about facility characteristics that must be considered for the installation or
operation of an hp rp7405/rp7410 server. Facility characteristics are:
•
Floor loading
•
Windows
•
Altitude effects
Floor Loading
The computer room floor must be able to support the total weight of the installed computer system as well as
the weight of the individual cabinets as they are moved into position.
Floor loading is usually not an issue in nonraised floor installations. The information presented in this section
is directed toward raised floor installations.
Any floor system under consideration for an hp rp7405/rp7410 server installation should be
verified by an appropriate floor system consultant.
NOTE
Raised Floor Loading
Raised floor loading is a function of the manufacturer’s load specification and the positioning of the
equipment relative to the raised floor grid. While Hewlett-Packard cannot assume responsibility for
determining the suitability of a particular raised floor system, it does provide information and illustrations
for the customer or local agencies to determine installation requirements.
The following guidelines are recommended:
•
Because many raised floor systems do not have grid stringers between floor stands, the lateral support for
the floor stands depends on adjacent panels being in place. To avoid compromising this type of floor
system while gaining under floor access, remove only one floor panel at a time.
•
Larger floor grids (bigger panels) are generally rated for lighter loads.
CAUTION
Do not install any raised floor system until you have carefully examined it to verify that it is
adequate to support the appropriate installation.
Floor Loading Terms
Table 2-3 defines floor loading terms.
Table 2-3
Term
Floor Loading Term Definitions
Definition
Dead load
The weight of the raised panel floor system, including the
understructure. Expressed in lb/ft2 (kg/m2).
Live load
The load that the floor system can safely support. Expressed
in lb/ft2 (kg/m2).
Chapter 2
25
Facility Guidelines
Facility Characteristics
Table 2-3
Floor Loading Term Definitions (Continued)
Term
Definition
Concentrated load
The load that a floor panel can support on a 1-in2 (6.45 cm2)
area at the panel’s weakest point (typically the center of the
panel), without the surface of the panel deflecting more than
a predetermined amount.
Ultimate load
The maximum load (per floor panel) that the floor system can
support without failure. Failure expressed by floor panel(s)
breaking or bending.
Ultimate load is usually stated as load per floor panel.
Rolling load
The load a floor panel can support (without failure) when a
wheel of specified diameter and width is rolled across the
panel.
Average floor load
Computed by dividing total equipment weight by the area of
its footprint. This value is expressed in lb/ft2 (kg/m2).
Average Floor Loading
The average floor load value, defined in Table 2-4, is not appropriate for addressing raised floor ratings at the
floor grid spacing level. However, it is useful for determining floor loading at the building level, such as the
area of solid floor or span of raised floor tiles covered by the hp rp7405/rp7410 server footprint.
Typical Raised Floor Site
This section contains an example of a computer room raised floor system that is satisfactory for the
installation of an hp rp7405/rp7410 server.
Based on specific information provided by Hewlett-Packard, Tate Access Floors has approved its Series 800
all-steel access floor with bolt-together stringers and 24 in. (61.0 cm) by 24 in. (61.0 cm) floor panels.
In the event that the flooring is being replaced or a new floor is being installed, Tate Access Floors
recommends its Series 1250 all-steel access floor with bolt-together stringers and 24 in. (61.0 cm) by 24 in.
(61.0 cm) floor panels be used to support the server installation.
NOTE
If the specific floor being evaluated or considered is other than a Tate Series 800 floor, the
specific floor manufacturer must be contacted to evaluate the floor being used.
Table 2-4 lists specifications for the Tate Access Floors Series 800 raised floor system.
Table 2-4
Typical Raised Floor Specifications
Itema
Rating
Dead load
7 lb/ft 2 (34.2 kg/m2)
Live load
313 lb/ft 2 (1528.3 kg/m2)
Concentrated loadb
1250 lb (567 kg)
26
Chapter 2
Facility Guidelines
Facility Characteristics
Table 2-4
Typical Raised Floor Specifications (Continued)
Itema
Rating
Ultimate load
4000 lb (1814 kg) per
panel
Rolling load
400 lb (181 kg)
Average floor load
500 lb (227 kg)
a. From Table 2-3 on page 25
b. With 0.08 in (0.2 cm) of span maximum deflection
Windows
Avoid housing computers in a room with windows. Sunlight entering a computer room may cause problems.
Magnetic tape storage media is damaged if exposed to direct sunlight. Also, the heat generated by sunlight
places an additional load on the cooling system.
Chapter 2
27
Facility Guidelines
Space Requirements
Space Requirements
This section contains information about space requirements for an hp rp7405/rp7410 server. This data should
be used as the basic guideline for space plan developments. Other factors, such as airflow, lighting, and
equipment space requirements must also be considered.
Delivery Space Requirements
There should be enough clearance to move equipment safely from the receiving area to the computer room.
Permanent obstructions, such as pillars or narrow doorways, can cause equipment damage.
Delivery plans should include the possible removal of walls or doors.
Figure 2-2
Cabinet Dimensions
Operational Space Requirements
Other factors must be considered along with the basic equipment dimensions. Reduced airflow around
equipment causes overheating, which can lead to equipment failure. Therefore, the location and orientation of
air conditioning ducts, as well as airflow direction, are important. Obstructions to equipment intake or
exhaust airflow must be eliminated.
The locations of lighting fixtures and utility outlets affect servicing operations. Plan equipment layout to take
advantage of lighting and utility outlets. Do not forget to include clearance for opening and closing equipment
doors.
Clearance around the cabinets must be provided for proper cooling airflow through the equipment.
28
Chapter 2
Facility Guidelines
Space Requirements
The service area space requirements, shown in Figure 2-3, are minimum dimensions. If other equipment is
located so that it exhausts heated air near the cooling air intakes of the computer system cabinets, larger
space requirements are needed to keep ambient air intake to the computer system cabinets within the
specified temperature and humidity ranges.
Figure 2-3
Footprint
Space planning should also include the possible addition of equipment or other changes in space
requirements. Equipment layout plans should also include provisions for the following:
•
Channels or fixtures used for routing data cables and power cables
•
Access to air conditioning ducts, filters, lighting, and electrical power hardware
•
Power conditioning equipment
•
Cabinets for cleaning materials
•
Maintenance area and spare parts
Chapter 2
29
Facility Guidelines
Zinc Particle Contamination
Zinc Particle Contamination
Metallic particulates can be especially harmful around electronic equipment. This type of contamination may
enter the data center environment from a variety of sources, including but not limited to raised floor tiles,
worn air conditioning parts, heating ducts, rotor brushes in vacuum cleaners or printer component wear.
Because metallic particulates conduct electricity, they have an increased potential for creating short circuits
in electronic equipment. This problem is exaggerated by the increasingly dense circuitry of electronic
equipment.
Over time, very fine whiskers of pure metal can form on electroplated zinc, cadmium, or tin surfaces. If these
whiskers are disturbed, they may break off and become airborne, possibly causing failures or operational
interruptions. For over 50 years, the electronics industry has been aware of the relatively rare but possible
threat posed by metallic particulate contamination. During recent years, a growing concern has developed in
computer rooms where these conductive contaminants are formed on the bottom of some raised floor tiles.
Although this problem is relatively rare, it may be an issue within your computer room. Since metallic
contamination can cause permanent or intermittent failures on your electronic equipment, Hewlett-Packard
strongly recommends that your site be evaluated for metallic particulate contamination before installation of
electronic equipment.
30
Chapter 2
3 Pre-installation Survey
This chapter provides a site survey information packet consisting of an information form and checklists to be
used to evaluate a computer facility. The checklists should be completed and the information sheets and
information forms filled out by the customer and a Hewlett-Packard representative.
Chapter 3
31
Pre-installation Survey
Pre-installation Survey Content
Pre-installation Survey Content
The site Pre-installation survey information is designed to identify problems that might occur before, during,
or after the installation of the system. It contains the following items:
•
Pre-installation checklists—Verify that the customer site is ready for the equipment installation.
•
Pre-installation survey information sheets—List customer name, address, and corresponding
Hewlett-Packard sales personnel.
•
Pre-installation survey information forms—List delivery information and special instructions.
32
Chapter 3
Pre-installation Survey
Typical Installation Schedule
Typical Installation Schedule
The following schedule lists the sequence of events for a typical system installation:
•
60 days before installation
— Floor plan design completed and mailed to Hewlett-Packard (if required to be an HP task)
•
30 days before installation
— Primary power and air conditioning installation completed
— Telephone and data cables installed
— Fire protection equipment installed
— Major facility changes completed
— Special delivery requirements defined
— Site inspection survey completed
— Delivery survey completed
— A signed copy of the site inspection and delivery survey mailed to Hewlett-Packard
— Site inspection and predelivery coordination meeting arranged with a Hewlett-Packard
representative to review the inspection checklist and arrange an installation schedule.
•
7 days before installation
— Final check made with an Hewlett-Packard site preparation specialist to resolve any last minute
problems
NOTE
Chapter 3
Not all installations follow a schedule like the one noted above. Sometimes, HP Servers are
purchased through another vendor which can preclude a rigid schedule. Other conditions could
also prevent following this schedule. For those situations, consider a milestone schedule.
•
Site Preparation - schedule with the customer as soon as possible after the order is placed.
•
Site Verification - schedule with the customer a minimum of one to two days before the HP
Server is scheduled to be installed.
33
Pre-installation Survey
Site Inspection
Site Inspection
Table 3-1 contains the basic Customer and Hewlett-Packard information.
Table 3-2 contains the Site Inspection Checklist.
Table 3-1
Customer and Hewlett-Packard Information
Customer Information
Name:
Phone No:
Street Address:
City
or
Town:
State or Province:
Country
Zip or postal code:
Primary customer contact:
Phone No.:
Secondary customer contact:
Phone No.:
Traffic coordinator:
Phone No.:
Hewlett-Packard information
Sales representative
Order No:
Representative making survey
Date:
Scheduled delivery date
Table 3-2
Site Inspection Checklist
Please check either Yes or No. If No, include comment# or date
Comment
or Date
Computer room
No.
Area or condition
1.
Is there a completed floor plan?
2.
Is there adequate space for maintenance needs?
Front 36 in (91.4 cm) minimum, Rear 36 in
(91.4 cm) minimum are recommended
clearances.
3.
Is access to the site or computer room
restricted?
4.
Is the computer room structurally complete?
Expected date of completion?
5.
Is a raised floor installed and in good condition?
34
Yes
No
Chapter 3
Pre-installation Survey
Site Inspection
Table 3-2
Site Inspection Checklist (Continued)
Please check either Yes or No. If No, include comment# or date
6.
Is the raised floor adequate for equipment
loading?
7.
Are there channels or cutouts for cable routing?
8.
Is there a remote console telephone line
available with an RJ11 jack?
9.
Is a telephone line available?
10.
Are customer supplied peripheral cables and
LAN cables available and of the proper type?
11.
Are floor tiles in good condition and properly
braced?
12.
Is floor tile underside shiny or painted? If
painted, judge the need for particulate test.
Comment
or Date
Power and lighting
No.
Area or condition
13.
Are lighting levels adequate for maintenance?
14.
Are there AC outlets available for servicing
needs? (i.e. vacuuming)
15.
Does the input voltage correspond to equipment
specifications?
15A
Is dual source power used? If so, identify type(s)
and evaluate grounding.
16
Does the input frequency correspond to
equipment specifications?
17.
Are lightning arrestors installed inside the
building?
18.
Is power conditioning equipment installed?
19.
Is there a dedicated branch circuit for
equipment?
20.
Is the dedicated branch circuit less than 250
feet (72.5 meters)?
21.
Are the input circuit breakers adequate for
equipment loads?
Yes
No
Yes
No
Safety
No.
Chapter 3
Area or condition
35
Pre-installation Survey
Site Inspection
Table 3-2
Site Inspection Checklist (Continued)
Please check either Yes or No. If No, include comment# or date
22.
Is there an emergency power shut-off switch?
23.
Is there a telephone available for emergency
purposes?
24.
Is there a fire protection system in the
computer room?
25.
Is antistatic flooring installed?
26.
Are there any equipment servicing hazards
(loose ground wires, poor lighting, etc.)?
Comment
or Date
Cooling
No.
Area or condition
27.
Can cooling be maintained between 20° C and
25° C (up to 5000 ft.)? Derate 1° C/1000 ft.
above 5000 ft. and up to 10,000 ft.
28.
Can temperature changes be held to 10 °C per
hour with tape media? Can temperature
changes be held to 20 °C per hour without tape
media?
29.
Can humidity level be maintained at 40% to
60% at 35° C non-condensing?
30.
Are air conditioning filters installed and clean?
Yes
No
Yes
No
Storage
No.
Area or condition
31.
Are cabinets available for tape and disc media?
32.
Is shelving available for documentation?
Training
No.
Area or Condition
33
Are personnel enrolled in the System
Administrator’s Course?
34
Is on-site training required?
36
Chapter 3
Pre-installation Survey
Delivery Survey
Delivery Survey
The delivery survey form shown in Figure 3-1 on page 38 and Figure 3-2 on page 39 lists delivery or
installation requirements. If any of the items on the list apply, enter the appropriate information in the areas
provided on the form.
Special instructions or recommendations should be entered on the special instructions or recommendations
form. The following list gives examples of special instructions or issues:
•
Packaging restrictions at the facility, such as size and weight limitations
•
Special delivery procedures
•
Special equipment required for installation, such as tracking or hoists
•
What time the facility is available for installation (after the equipment is unloaded)
Chapter 3
37
Pre-installation Survey
Delivery Survey
•
Special security requirements applicable to the facility, such as security clearance
Figure 3-1
Delivery Survey (Part 1)
DELIVERY CHECKLIST
DOCK DELIVERY
Yes
Is dock large enough for a semitrailer?
No
Circle the location of the dock and give street name if different than address.
North
East
West
South
STREET DELIVERY
Circle the location of access door and list street name if different than address.
North
East
West
South
List height
and width
of access door.
List special permits (if required) for street delivery.
Permit type:
Agency obtained from:
60SP018A
12/7/99
38
Chapter 3
Pre-installation Survey
Delivery Survey
Figure 3-2
Delivery Survey (Part 2)
ELEVATOR
Fill in the following information if an elevator is required to move equipment.
Capacity (lb or kg)
Depth
Height
Width
Height
Depth
Width
STAIRS
Please list number of flights and stairway dimensions.
Number of flights
Number of flights
Width
Width
Width
Width
Width
Width
60SP019A
11/24/99
Chapter 3
39
Pre-installation Survey
Delivery Survey
40
Chapter 3
A System Requirements Summary
This appendix summarizes the requirements that must be considered in preparing the site for the hp
rp7405/rp7410 server.
Appendix A
41
System Requirements Summary
Power Consumption and Air Conditioning
Power Consumption and Air Conditioning
To determine the power consumed and the air conditioning required, follow the examples in Table A-1 and
Table A-3, then complete the entries in Table A-2 and Table A-4.
NOTE
42
When determining power requirements you must consider any peripheral equipment that will
be installed during initial installation or as a later update. Refer to the applicable
documentation for such devices to determine the power and air-conditioning that is required to
support these devices.
Appendix A
System Requirements Summary
Power Consumption and Air Conditioning
Table A-1
Example Power Consumption (Theoretical Maximum) and Air
Conditioning Requirement Summary
Component
Quantity
Multiply
Quantity
By:
Air
Conditioning
Required (tons)
(kilowatts/3.517
=tons)
Power
Dissipated
(kilowatts)
Chassis
1
426
426.00 (.426)
0.121
Cell Board (PA8700)
2
746
1492.00 (1.492)
0.424
PCI Card (Maximum 25W)
16
25
400.00 (.400)
0.114
Power Supply (BPS)
2
125
250.00 (.250)
0.071
DVD
1
20
20.00 (.020)
0.006
Disk Drive
4
25
100.00 (.100)
0.028
Core I/O
2
70
140.00 (.140)
0.040
PCI Power Supply
2
47
94.00 (.094)
0.027
Total
2922.00 (2.922)
.831
Table A-2
Power Consumption (Theoretical Maximum) and Air Conditioning
Requirement Summary
Component
Chassis
Quantity
1
Multiply
Quantity
By:
Power
Dissipated
(kilowatts)
Air
Conditioning
Required (tons)
(kilowatts/3.517
=tons)
426
426.00 (.426)
0.121
Cell Board (PA8700)
746
PCI Card (Maximum 25W)
25
Power Supply (BPS)
125
DVD
20
Disk Drive
25
Core I/O
70
PCI Power Supply
47
Total
Appendix A
43
System Requirements Summary
Power Consumption and Air Conditioning Requirement
Power Consumption and Air Conditioning Requirement
Table A-3
Example Power Consumption (Typical) and Air Conditioning
Requirement Summary
Component
Quantity
Multiply
Quantity
By:
Power
Dissipated
(kilowatts)
Air
Conditioning
Required (tons)
(kilowatts/3.517
=tons)
Chassis
1
330
330.00 (0.33)
0.094
Cell Board (PA8700)
2
500
1000.0 (1.00)
0.284
PCI Card (25W max)
16
10
160.00 (0.16)
0.045
Power Supply (BPS)
2
49
98.00 (.098)
0.027
DVD
1
20
20.00 (0.02)
0.006
Disk Drive
2
25
50.00 (0.05)
0.014
Core I/O
2
29
58.00 (0.058)
0.016
PCI Power Supply
2
47
94.00 (0.094)
0.027
Total
1810.00
(1.810)
0.513
Table A-4
Power Consumption (Typical) and Air Conditioning Requirement
Summary
Component
Chassis
Quantity
1
Multiply
Quantity
By:
Power
Dissipated
(kilowatts)
Air
Conditioning
Required (tons)
(kilowatts/3.517
=tons)
330
330.00 (0.33)
0.094
Cell Board (PA8700)
500
PCI Card (25W max)
10
Power Supply (BPS)
49
DVD
0
Disk Drive
25
Core I/O
29
PCI Power Supply
47
Total
44
Appendix A
System Requirements Summary
Power Consumption and Air Conditioning Requirement
Maximum power is the sum of the worst case power consumption of every subsystem in the box, and should
be used to size worst case power consumption. Typical power consumption numbers are what HP engineers
have measured running power intensive applications. These are generally lower than maximum power
numbers due to the fact that getting all of the subsystems in the box to simultaneously draw maximum power
for long durations being uncommon.
Appendix A
45
System Requirements Summary
Weight
Weight
To determine overall weight, follow the examples in Table A-5, then complete the entries in Table A-6.
Table A-5
Example Weight Summary
Component
Quantity
Multiply By
Weight (kg)
Cell Boards
2
19.81 lbs (9.00)
39.62 lbs (18.00)
PCI Card (varies - used A3739B here)
4
0.34 lbs (0.153)
1.36 lbs(0.61)
Power Supply (BPS)
2
18.0 (8.2)
36 lbs (16.40)
DVD
1
2.2 lbs (1.0)
2.2 lbs (1.0)
Disk Drive
4
1.6 lbs (0.73)
6.40 lbs (2.90)
Chassis with skins and front bezel cover
1
131 lbs (59.42)
131 lbs (59.42)
Total weight
216.58 lbs (97.68)
Table A-6
Weight Summary
Component
Quantity
Multiply By
Cell Boards
19.81 lbs (9.00)
PCI Card
varies lbs
Power Supply (BPS)
18 (8.2)
DVD
2.2 lbs (1.0)
Disk Drive
1.6 lbs (0.73)
Chassis with skins and front bezel cover
131 lbs (59.42)
Weight (kg)
Total weight
46
Appendix A
B Templates
This appendix contains blank floor plan grids and equipment templates. Combine the necessary number of
floor plan grid sheets to create a scaled version of the computer room floor plan.
Appendix B
47
Templates
Figure B-1 illustrates the overall dimensions required for an hp rp7405/rp7410 system.
Figure B-1
48
hp rp7405/rp7410 Space Requirements
Appendix B
Templates
Equipment Footprint Templates
Equipment Footprint Templates
Equipment footprint templates are drawn to the same scale as the floor plan grid (1/4 inch = 1 foot). These
templates are provided to show basic equipment dimensions and space requirements for servicing.
The service areas shown on the template drawings are lightly shaded.
The equipment templates should be used with the floor plan grid to define the location of the equipment that
will be installed in your computer room.
NOTE
Appendix B
Photocopying typically changes the scale of drawings copied. If any templates are copied, then
all templates and floor plan grids must also be copied.
49
Templates
Computer Room Layout Plan
Computer Room Layout Plan
Use the following procedure to create a computer room layout plan:
Step 1. Remove several copies of the floor plan grid.
Step 2. Cut and join them together (as necessary) to create a scale model floor plan of your computer room.
Step 3. Remove a copy of each applicable equipment footprint template.
Step 4. Cut out each template selected in Step 3; then place it on the floor plan grid created in Step 2.
50
Appendix B
Templates
Computer Room Layout Plan
Step 5. Position pieces until the desired layout is obtained; then fasten the pieces to the grid. Mark
locations of computer room doors, air conditioning floor vents, utility outlets, and so on.
Figure B-2
Appendix B
hp rp7405/rp7410 Cabinet Template
51
Templates
Computer Room Layout Plan
Figure B-3
Planning Grid
Scale: 1/4 inch = 1 foot
60SP016A
12/20/99
52
Appendix B
Index
A
AC frequency specifications, 4
AC power specifications, 3
acoustics, 22
air conditioning, 19
system recommendations, 19
air conditioning ducts, 21
air distribution system
room space return air, 19
air ducts, 8
illustrated, 8
average floor loading, 26
B
backplane
mass storage, 2
system, 2, 6
basic air conditioning equipment requirements, 18
basic air distribution systems, 19
C
cell board, 2, 6
circuit breaker, 3, 11
computer room layout plan, 50
computer room safety
fire protection, 24
cooling, 6
D
data communications cables, 17
dimensions and weights, 2
DIMM
removing and replacing, 20, 21
disk, 21
ducts, air conditioning, 21
E
electrical and environmental guidelines
air distribution system, 19
computer equipment grounds, 14
computer room safety
fire protection, 24
dust and pollution contro, 21
electrical conduit ground, 14
grounding systems, 14
lighting requirements, 24
main building electrical ground , 14
power distribution safety grounding, 14
power panel grounds, 14
power quality, 12
sources of electrical disturbances, 12
system installation guidelines, 17
electrical specifications, 3
environmental elements, 18
acoustics, 22
air conditioning equipment requirements, 18
air conditioning recommendations, 19
air distribution systems, 19
computer room considerations, 18
dust and pollution control, 21
electrostatic discharge
prevention, 22
humidity level, 20
static protection measures, 22
environmental specifications, 6
equipment footprint templates, 49
ESD, 22
F
facility characteristics, 25
facility guidelines
characteristics, 25
computer room layout, 50
equipment footprint templates, 49
floor loading terms, 25
operational space requirements, 28
typical raised floor site, 26
windows, 27
fire protection, 24
floor loading, 25
raised floor, 25
G
grounding, 3, 14
grounding systems, 14
electrical conduit ground, 14
H
humidity, 6
humidity level, 20
K
Keystone system
computer room layout, 50
environmental elements, 18
power system protection, 12
typical installation schedule, 33
L
lighting requirements, 24
M
main building electrical ground, 14
mass storage backplane, 2
N
noise emission specifications, 7
O
operating environment, 6
P
power considerations, 12
power cords, 3
power distribution hardware , 13
power distribution safety grounding, 14
53
Index
power distribution system
distribution hardware, 13
power quality, 12
power system protection, 12
power wiring, 13, 17
preinstallation survey, 31
R
raised floor
ground system, illustrated, 16
S
site
inspection, 34
sources of electrical disturbances, 12
space requirements, 28
computer room layout, 50
delivery space requirements, 28
equipment footprint templates, 49
system backplane, 2, 6
system installation guidelines, 17
data communications cables, 17
wiring connections, 17
system specifications, 1
T
temperature, 6
typical installation schedule, 33
W
wiring
connections, 17
54