user’s guide
hp StorageWorks
disk system 2405
Edition E0902
.
Notice
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© Hewlett-Packard Company, 2002. All rights
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Revision History
First Edition
March 2002
Second Edition
June 2002
Third Edition
Sept 2002
contents
1
Product Description 13
General Description 13
Features 14
Status Indicators 15
Power/Standby Switch 15
High Availability 15
Upgradability 16
Environmental Services 16
Components 17
Disks and Disk Fillers 17
LCCs 18
Power Supply/Fan Module 21
Hardware/Software Requirements 23
Topologies 23
Single Host Basic Configuration 24
Single Host PV Links Configuration 25
Two Host High Availability Configuration 26
Four Host Hub Configuration 27
Definitions 28
2
Installation 31
Preparation 31
Electrical Requirements 31
Choosing PDUs 32
Installing PDU/PDRUs 34
Software Requirements 37
Step 1: Gather Tools 38
Step 2: Unpack the Product 38
5
Step 3: Install the device 41
Installing the Storage Device into a Rack System/E 41
Installing the storage device into an HP Computer Cabinet 49
Installing the Storage Device into a Rittal-Style Rack 56
Install the Disk System 63
Step 4: Configure LCCs 64
Step 5: Set LCC Switches 66
Step 6: Connect FC and Power Cables 72
Step 7: Install Disk Modules 75
Step 8: Turn on the Disk System 76
Step 9: Verify Devices on the Host 78
Sample IOSCAN 78
Where do you go from here? 79
3
Configuration 81
Viewing a Disk System in IOSCAN 81
Sample IOSCAN 81
Interpreting the Hardware Path 83
Loop IDs and Hardware Paths by Enclosure ID 84
Setting Up the Hardware Event Monitor 88
Aliasing Devices (HP-Qualified Only) 88
Using SAM 88
Using STM (HP-Qualified Only) 88
Updating Firmware (HP-Qualified Only) 90
4
Troubleshooting 93
Overview 93
Event Notification 93
Status LEDs 96
Online Status Information 98
Viewing Component Status in SAM 98
Viewing the STM Information Log 99
Interpreting Status Values 100
Checking the Fibre Channel Link 102
Isolating Causes 104
6
5
Removal and Replacement 109
Disk Module 111
Preparation 111
To Determine If a Volume Group or Physical Volume Group Is
Active 111
To Determine If the Physical Volume Is Attached 112
To Replace Attached Physical Volumes 112
To Replace Unattached Physical Volumes 114
Tools 115
Procedure 115
LCC 117
Tools 117
Procedure 117
Power Supply 120
Tools 120
Procedure 120
Disk System 122
Tools 122
Procedure 122
Top Cover (HP-Qualified Only) 124
Tools 124
Procedure 124
Midplane (HP-Qualified Only) 126
Tools 126
Procedure 126
6
Reference 129
Product Models and Options 129
Upgrade Products 130
PDU/PDRU Products 131
Replaceable Parts 132
Specifications 132
Dimensions 132
Weight 133
AC Power Input 133
DC Power Output 133
7
Heat Output 133
Environment 134
Acoustics 134
Safety Certifications 134
EMC Compliance 135
Regulatory Statements 136
A. FCC Statement (For U.S.A. Only) 136
B. IEC Statement (Worldwide) 136
C. Spécification ATI Classe A (France) 137
D. Product Noise Declaration (Germany) 137
E. VCCI Statement (Japan) 138
Harmonics Conformance (Japan) 138
F. BSMI EMC Statement (Taiwan) 138
G. Declaration of Conformity 139
Product Web Site 140
Related Documents 140
8
figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Figure 16
Figure 17
Figure 18
Figure 19
Figure 20
Figure 21
Figure 22
Figure 23
Figure 24
Figure 25
Figure 26
Figure 27
Figure 28
Disk System Front View 14
Disk System Back View 14
Disk Module 18
LCC 19
Power Supply/Fan Module 21
Single Initiator Basic Configuration 24
Single Host PV Links Configuration 25
Two Host High Availability Configuration 26
Four Host Hub Configuration 27
PDRU Placement in 1.6-Meter Rack 35
PDRU Placement in a 2.0-Meter Rack 36
Disk System Accessories 39
Disk System Contents 40
HP Rack System/E Rail Kit Contents 41
HP Rack System/E Installation Overview 42
Locating the site for the device installation in a System/E
rack 44
Installing clipnuts for an HP Rack System/E 44
Installing rails in an HP Rack System/E 45
Installing the enclosure clipnut in an HP Rack System/E 46
Installing the storage device in the Rack System/E 47
Installing enclosure rail clamps in an HP Rack
System/E 48
HP Computer Cabinet Rail Kit Contents 49
HP Computer Cabinet Installation Overview 50
Locating the site for the device installation in an HP
Computer Cabinet 51
Installing rail clip nuts in the HP Computer Cabinet 51
Installing rails in the HP Computer Cabinet 52
Installing enclosure retention clipnuts in an HP Computer
Cabinet 53
Installing the storage device in an HP Computer
Cabinet 54
9
Figure 29
Figure 30
Figure 31
Figure 32
Figure 33
Figure 34
Figure 35
Figure 36
Figure 37
Figure 38
Figure 39
Figure 40
Figure 41
Figure 42
Figure 43
Figure 44
Figure 45
Figure 46
Figure 47
Figure 48
Figure 49
Figure 50
Figure 51
Figure 52
Figure 53
Figure 54
Figure 55
Figure 56
Figure 57
Figure 58
Figure 59
Figure 60
Figure 61
Figure 62
Figure 63
10
Installing a filler panel in an HP Computer Cabinet 55
Rittal-Style Rail Kit Contents 56
Rail Alignment 57
Front Screw Installation 57
Rear Slide Extension 58
Center Nut Tightening 59
Installing a Disk System into the Rittal-Style Rack 60
Moving a Disk System Retention Bracket 61
Bolting the Disk System to the Front Column of the
Rack 62
LCC Internal Configuration Switch 64
LCC Installation 65
Fiber Optic Cabling and Address Switch Settings with 1
Disk System 66
Fiber Optic Cabling and Address Switch Settings with 2
Disk Systems 67
Fiber Optic Cabling and Address Switch Settings with 3
Disk Systems 68
Fiber Optic Cabling and Address Switch Settings with 4
Disk Systems 69
Fiber Optic Cabling and Address Switch Settings with 5
Disk Systems 70
Fiber Optic Cabling and Address Switch Settings with 6
Disk Systems 71
Wiring Scheme for 1.6-Meter Rack 73
Wiring Scheme for 2.0-Meter Rack 74
Disk Module Installation 75
Power/Standby Switch and System LEDs 77
Annotate Device Using STM 89
Firmware File Selection Window 90
Firmware Download Confirmation Window 91
Firmware Tool Window 92
Sample Hardware Event Notification 95
LED Status Indicators 96
Disk System Field Replaceable Units (FRUs) 109
Disk Module Removal 116
LCC Removal and Replacement 118
LCC Address Switches and LEDs 119
Power Supply Removal and Replacement 121
Disk System Removal and Replacement 123
Top Cover Assembly 125
Midplane Assembly 128
tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Table 9
Table 10
Table 11
Table 12
Table 13
Table 14
Table 15
Table 16
Table 17
Table 18
Inrush (Surge) Current and Duration 31
Maximum Operating Current 32
Recommended PDU/PDRUs for Multiple Disk Systems in
HP Legacy Racks 33
Recommended PDU/PDRUs for Multiple Disk Systems in
HP System/E Racks 33
Disk System Accessories 38
Disk System Contents 39
Rail Positions for Sequential Disk Systems 43
Loop IDs and Hardware Paths by Slot Number and
Enclosure ID 0 - 2 84
Loop IDs and Hardware Paths by Slot Number and
Enclosure ID 3 - 4 85
Loop IDs and Hardware Paths by Slot Number and
Enclosure ID 5- 6 86
LED Functions 96
Status Indications 100
Troubleshooting Table 104
Disk System Field Replaceable Units 110
Upgrade Products 130
PDU/PDRU Products 131
Replacement and Exchange Part Numbers 132
Product Weights 133
11
12
Product Description
1
General Description
Hewlett-Packard’s StorageWorks Disk System 2405 (referred to in this guide as
the disk system) is a high-availability Fibre Channel (FC) storage product. Dual
optical fiber ports on dual link controllers provide Fibre Channel connections to
the host. Fifteen slots accept high-speed, high-capacity FC disks connected to a
FC midplane. Data throughput is 200 Mbytes/sec. Thirteen disk systems fill a
2-meter System/E rack. Filled with 18-Gbyte disks, the 2-meter Rack System/E
yields 3.51 Terabytes of storage; with 36-Gbyte disks, 7.02 Terabytes of storage;
and with 73-Gbyte disk, 14.23 Terabytes.
Modular and redundant components are easy to upgrade and maintain. Disks,
power supplies, and link control cards (LCCs) are replaceable parts that plug into
individual slots in the front and back of the disk system. Redundant power
supply/fan modules and LCCs can be removed and replaced without interrupting
storage operations. Disks can be replaced with the system on, and only the
affected file systems taken off-line. Hewlett-Packard technical support is optional
for these procedures.
Special electronics and HP-UX software enable remote monitoring and
diagnostics. Sensors on the LCCs monitor the disk system environment,
including temperature, voltage, fan speed, and component status. HewlettPackard’s Command View SDM reports any changes in environmental status to
user-defined locations. Standard HP-UX diagnostic utilities also report
environmental data for enhanced troubleshooting.
Product Description
13
Status Indicators
On the front of the disk system, a pair of LEDs indicates the status of the disk
system, and an LED for each slot shows disk I/O activity:
■ The system power LED (B in Figure 1) indicates that power is on or off.
■ The system fault LED (C in Figure 1) indicates whether or not a fault has
occurred anywhere in the disk system.
■ At the bottom of each disk module, the left LED (D in Figure 1) indicates the
presence of I/O activity on the disk.
■ The right LED, at the bottom of each disk module (E in Figure 1), can be
flashed to help a customer engineer (CE) locate the disk for physical
inspection or removal.
LEDs (G and J in Figure 2) on the back of the disk system indicate the status of
replaceable components. See chapter 4, Troubleshooting, for specific LED
information.
Power/Standby Switch
Located in the upper right corner of the front of the disk system, the power switch
(A in Figure 1) interrupts power from the power supplies to the LCCs and other
internal components. Power to the power supplies is controlled by the power
cords and the AC source.
High Availability
High availability is a general term describing computer systems that are designed
to minimize unplanned downtime. The disk system supports high availability
requirements through the following features:
■ Hot-pluggable, high-capacity, high-speed disks
■ Redundant, hot-pluggable, user-replaceable power supplies and LCCs
■ Support for mirrored disks in the HP-UX environment
■ Online firmware upgrades
■ Hardware event monitoring and real-time error reporting
Product Description
15
Product Description
LEDs on the disk system enable you to detect and replace failed components and
thereby prevent or minimize users’ downtime. For additional information about
LEDs, see chapter 4, Troubleshooting.
Upgradability
You can increase disk system storage capacity by:
■ Replacing disk drives with higher-capacity disk drives
■ Adding disks in unused slots
■ Adding another disk system to a FC loop
None of these actions require shutting down the product, but some may require
the use of system utilities to manage file systems.
Disk and LCC firmware is downloadable using the supported tools.
Environmental Services
Environmental services circuitry monitors the following elements:
■ Fan rotation
■ Power supply output
■ Power supply and fan status
■ Disk drive status, including fault conditions
■ LCC status
■ Temperature
■ Self-test results
Each LCC reports the status of all elements in the disk system, even if the LCC
does not have direct access to the element.
Additionally, the EEPROM on each LCC stores 2 Kbytes of configuration
information and user-defined data, including the manufacturer serial number and
product number.
16
Product Description
Product Description
Components
User-replaceable components enable high availability and easy maintenance.
This section describes the following components:
■ Disks and disk fillers
■ LCCs
■ Power supply/fan modules
Disks and Disk Fillers
Disks, shown in Figure 3, are 3.5-inch Low Profile disks in open metal carriers.
Disks are Fibre Channel.
The open carrier design requires careful handling to avoid disk damage by
breakage and static electricity. Avoid personal contact with hot surfaces.
WARNING
Touching exposed circuits can cause electrical discharge and
disable the disk. Disks require careful handling and ESD
precautions.
The plastic parts of the disk are safe to touch:
■ Extraction handle (A in Figure 3)
■ Latch tab (B in Figure 3)
The initial disk options for this product are 73-Gbyte, 36-GByte and 18-GByte
drives. A label on the disk carrier shows the storage capacity and rotational speed
of the installed disk. Obtain information about the latest disk options from HP
sales representatives.
Disk fillers occupy unused slots to balance the air flow.
Caution
Fillers must be installed in unused slots in order to maintain even
cooling around the remaining slots.
Product Description
17
Figure 4. LCC
Product Description
Other features of the LCC are:
■ LEDs (D) indicating LCC status and bus configuration
■ Rotary switch (E)
■ Configuration switch with four settings:
1 Link Speed (1.0625 Gb/s or 2.125 Gb/s)
2 Reserved
3 Reserved
4 Power fail warning (enable/disable)
■ Locking screws (F)
■ Cam levers (G)
Product Description
19
LCC circuitry provides the following functions:
■ System fault detection
■ Disk address generation
Caution
20
Product Description
If an LCC fails, do not remove it from the disk system until you
are ready to replace it with a new one. The failed LCC should
remain installed to assure proper cooling for the disk system.
Power Supply/Fan Module
Figure 5.
Power Supply/Fan Module
Product Description
21
Product Description
Redundant, hot-pluggable 340-watt power supplies convert wide-ranging AC
voltage from an external main to stable DC output and deliver it to the midplane.
Each power supply has an internal fan, an AC receptacle (A in Figure 5), two
ejector handles (D) with thumbscrews (C), and 2 LEDs (B). Internal control
prevents the rear DC output connector from becoming energized when the power
supply is removed from the disk system.
Power supplies share the load reciprocally; that is, each supply automatically
increases its output to compensate for reduced output from the other, and vice
versa. If one power supply fails, the other delivers the entire load.
Internal circuitry triggers a fault when the internal fan or other part fails. At the
same time, the power fault LED (amber) illuminates, and, if enabled, the
hardware event monitor sends an event message. The power supply fan remains
on if other parts fail in order to maintain cooling air flow through the system. If
the fan fails, the power supply shuts down. The fan in the other working power
supply will increase to full speed to compensate for the failed fan. The failed
power supply/fan module must be removed and the replacement power supply/
fan module installed within two minutes. In the event of a failure, if a
replacement fan module/power supply is not available, leave the failed power
supply/fan module installed until you are ready to replace it. This should be done
to maintain proper cooling for the disk system.
Internal circuitry senses fan motion and triggers a fault when the speed of the
power supply’s internal fan falls below a critical level. At the same time, the LED
turns amber, and, if enabled, the hardware event monitor sends an event message.
22
Product Description
The disk system is supported on the following operating systems:
■ HP-UX 11.00 with HWE 0302 or greater
■ HP-UX 11.11 with HWE 0302 or greater
For supported servers, see the latest HP 9000 Configuration and Ordering Guide.
One of the following Fibre Channel HBAs must be installed in the host:
■ A5158A, 1 Gb PCI Fibre Channel HBA
■ A6684A, 1 Gb HSC Fibre Channel HBA
■ A6685A, 1 Gb HSC Fibre Channel HBA
■ A6795A, 2 Gb PCI FIbre Channel HBA
Topologies
The disk system supports high availability through redundant components and
redundant connections to redundant hosts. Each port on a LCC can be connected
to a different host bus adapter in the same or different hosts. Mirroring inside a
disk system is not a high availability solution to the extent that a midplane failure
would necessitate downtime.
Basic high availability topologies are described on the following pages. For
information about specific supported topologies, consult an HP sales
representative.
Product Description
23
Product Description
Hardware/Software Requirements
Single Host Basic Configuration
The maximum number of disk systems supported on a Fibre Channel Arbitrated
Loop (FC-AL) is seven. The maximum storage capacity with this configuration
is approximately 7.5 Terabytes (105 disk modules at the 73 Gbyte capacity
point). This configuration does not provide any redundancy to the data path,
however there is some hardware redundancy provided by the enclosures
themselves (power supplies). With the utilization of Mirror/UX software, one or
more mirrors can be created on the hardware path to provide a basic level of data
protection.
The performance of this configuration depends on the number of disk systems on
the loop. Using the maximum supported number of disk systems reduces the
performance of the loop. To get the maximum performance (200 MB/s or
maximum number of I/Os), the number of disk systems should be limited to four.
24
Product Description
Single Host PV Links Configuration
Product Description
25
Product Description
Data path redundancy can be achieved with the configuration shown in Figure .
Using an additional host bus adapter and the LVM software, pvlinks can be
created to provide a redundant path to data. A separate mirror path can be created
for data protection, also. This configuration protects against any single
component failure (cables, HBAs, disks). Like the single host basic
configuration, each loop is capable of 200 MB/s which translates to 400 MB/s for
this configuration.
Two Host High Availability Configuration
Figure 8 shows a basic high availability configuration. Each disk system can still
be configured using pvlinks and mirroring. High availability software protects
against a disk system failure. A failure in a cable or LCC will result in a loop
failure. Adding FC-AL loops or switches makes this configuration more robust.
26
Product Description
Four Host Hub Configuration
The performance of this configuration is limited to a maximum of 200MB/s (100
MB/s per loop). The performance issues discussed with the single initiator basic
configuration also apply with this configuration.
Product Description
27
Product Description
The disk system can run at 2 Gb/s speed. For legacy systems a four host
configuration could be used for an advanced high availability environment at 1
Gb/s speed. See Figure 9, below.
Definitions
The following terms have specific meanings in the context of this guide:
High availability (HA)
HA describes hardware and software systems that are designed to minimize
planned and unplanned downtime. High availability is measured at the system
level and stated as the percentage of time the system is in a state to do useful
work; for example, 99.95% availability translates to four hours of downtime per
year.
Hot-pluggable
Hot-pluggable signifies the ability of a component to be installed or replaced
without interrupting storage operations and within the restrictions of the
operating environment. All customer-replaceable disk system components can be
replaced under power. Adding or replacing disks or LCCs may require the use of
HP-UX commands to manage file systems.
JBOD
Pronounced jay-bod, a JBOD (Just a Bunch Of Disks) is an enclosed group of
disks that are addressed individually by the host.
PDU and PDRU
PDUs (power distribution units) distribute power from a single inlet to multiple
outlets. PRUs (power relay units) connect one or more PDU inlets to a single on/
off switch, such as a cabinet power switch. Units that both distribute and switch
power are referred to as PDRUs.
Short Wave
Lasers or LEDs that emit light with wavelengths around 780 nm or 850 nm. Short
wave lasers are used for Fibre Channel links up to approximately 700 m. They
are typically used with multimode fiber. The preferred fiber core size is 50
microns since this fiber has large bandwidth so the distance is limited by fiber
attenuation. A 62.5 micron core size is also supported for compatibility with
existing FDDI installations. Fiber of this type has smaller bandwidth and, in this
case, the distance is limited by fiber bandwidth.
28
Product Description
Multimode
Arbitrated Loop (FC-AL)
A Fibre Channel topology that provides a low-cost solution to attach multiple
communicating ports in a loop without hubs and switches.
Arbitrated Loop Physical Address (AL_PA)
A unique one-byte valid value assigned during Loop Initialization to each
NL_Port or FL_Port on a Loop.
Product Description
29
Product Description
A type of fiber optic cable that allows more than one mode (rays of light) to be
guided.
30
Product Description
2
Installation
Preparation
Before installing the disk system, make sure (1) electrical wiring, breakers, and
PDUs meet power needs, (2) the required support software is installed on the
host, and (3) if you are connecting the disk system to a V-class server, autotermination is enabled on the host bus adapter. This section covers all three of
these topics.
Electrical Requirements
All electrical wiring to the service point (plug) must be sized to carry the
appropriate inrush (20 amps per power supply) and steady state currents. See the
following table for examples.
Table 1. Inrush (Surge) Current and Duration
No. of Disk Systems on Circuit
(2 power supplies per disk
system)
Inrush Current and Duration
1
40 amps declining over 100 ms (5 cycles)
2
80 amps declining over 100 ms (5 cycles)
3
120 amps declining over 100 ms (5 cycles)
4
160 amps declining over 100 ms (5 cycles)
Installation
31
Table 2. Maximum Operating Current
Incoming Voltage
AC RMS
Maximum RMS Current Drawn
by One Disk System
100 – 120 volts
4.8 amps
200 – 240 volts
2.0 amps
Caution
Adding disk systems to 120V circuits rapidly increases amp
requirements. Always make sure that the total current drawn does
not exceed circuit capacity.
Circuit breakers must be adequately rated for inrush and operating currents.
Hewlett-Packard recommends magnetic-type circuit breakers, which are capable
of handling large inrush currents for short durations (10 to 12 cycles) and are
rated adequately for steady state currents.
Choosing PDUs
Peak power requirements and PDU capacity affect the number of disk systems
that can be installed in a rack. For example, to install more than four disk systems
in Hewlett-Packard legacy racks (HP C2785A, C2786A, and C2787A), you must
upgrade to 19-inch PDUs.
Besides rack density, the following factors can help you choose PDUs:
■ Redundant power source. To connect redundant power supplies to separate
PDUs, install redundant PDUs.
■ Number of cords to the AC source. Using 30-amp PDRUs instead of 16-amp
PDUs reduces the number of cords to the wall.
■ Future needs. Installing surplus PDU capacity allows you to add disk system
units later.
■ Inrush margins. For installations that require four or more 16-amp PDUs,
Hewlett-Packard recommends HP 30-amp PDRUs (E7681A, E7682A) for
their inherent inrush protection.
■ On/Off switch capability. Some PDU/PDRU options support the use of a
single-point on/off switch.
The following tables show how many and what kind of PDU/PDRUs are needed
to install one or more disk systems in an HP rack. Data assumes 220V AC
32
Installation
nominal power and redundant PDU/PDRUs. For nonredundant configurations,
divide the number of recommended PDU/PDRUs by 2.
Table 3. Recommended PDU/PDRUs for Multiple Disk Systems in HP Legacy
Racks
No. of Disk
Systems
1.1 meter
(21 U)
1.6 meter
(32 U)
2.0 meter
(41 U)
2 3-foot/16-amp PDUs
or
2 19-inch/16-amp PDUs
2 5-foot/16-amp PDUs1
or
2 19-inch/16-amp PDUs
6–8
NA2
4 19-inch/16-amp PDRUs
or
4 19-inch/30-amp PDRUs
9 – 10
NA2
NA2
4 19-inch/
30-amp PDRUs
1.Supports cabinet on/off switch.
2.Rack height does not allow additional disk systems.
Table 4. Recommended PDU/PDRUs for Multiple Disk Systems in HP System/
E Racks
No. of Disk
Systems
1.25 meter
(25 U)
1.6 meter
(33 U)
2.0 meter
(41 U)
1–4
2 19-inch/16-amp PDUs
or
2 19-inch/30-amp PDRUs1
5–8
NA2
2 19-inch/30-amp PDRUs1
4 19-inch/30-amp PDRUs
9 – 11
NA2
NA2
4 19-inch/
30-amp PDRUs
12-13
NA2
NA2
4 19-inch/
30-amp PDRUs
1.Supports cabinet on/off switch.
2.Rack height does not allow additional disk systems.
Installation
33
Installation
1–5
Installing PDU/PDRUs
The 19-inch PDUs and PDRUs can be installed vertically or horizontally in the
rack. Choose PDU/PDRU locations with the following guidelines in mind:
■ Place PDU/PDRUs within the reach of disk system cords.
■ Place PDU/PDRUs vertically whenever possible. See sample installations in
Figure 10 and Figure 11. Installing PDU/PDRUs horizontally interferes with
the ability to service disk systems that are behind the PDU/PDRU.
■ Place vertical PDU/PDRUs on each side of the disk system so that the cord
from either power supply does not cross over replaceable components in the
middle of the product.
■ To achieve maximum density in 2-meter racks, install 30-amp PDRUs on
hinged brackets directly behind disk systems. Hinges allow the PDRU (HP
E7681A and E7682A) to swing aside for servicing obscured components.
(See Figure 11.)
34
Installation
Software Requirements
Ensure that the minimum revisions of HP-UX extension software and online
diagnostics are installed. These release packages enable STM and EMS for the
disk system.
1 At the host console, enter swlist | grep XSW and look for the following
extension software according to the installed HP-UX revision:
— HP-UX 11.00 with HWE 0302 (March 2002 Patch bundles)
— HP-UX 11.11 with HWE 0302 (March 2002 Patch bundles)
2 Enter swlist | grep Online and look for the following online
diagnostics according to the installed HP-UX revision:
Installation
— OnlineDiags B.11.00.20.09, or greater, on HP-UX 11.00
— OnlineDiags B.11.11.06.09, or greater, on HP-UX 11.11
If swlist does not report the specified releases, install them from the latest
CD-ROM in any of the following products:
— For HP-UX 11.00:
o B3920EA HP-UX OE Media for Servers
o B6261AA HP-UX 11.00 Extension Upgrade Media Kit
— For HP-UX 11.11:
o B3920EA HP-UX OE Media for Servers
o B6191AA HP 9000 Support Plus Media
o B6821AA HP-UX TCOE Media
o B6845AA HP-UX 11.11 Minimal Technical OE Media
o B7993AA HP-UX Enterprise OE Server Media
o B7994AA HP-UX Mission Critical OE Comm. Media
The external IT Resource Center web site is:
http://us-support3.external.hp.com/
Installation
37
Step 1: Gather Tools
Once the electrical, software, and special V-class preparations are complete,
collect the tools you need to install the disk system hardware:
■ Torx T25 screwdriver
■ Torx T15 screwdriver
■ Small flat-blade screwdriver
Step 2: Unpack the Product
1 Lift off the overcarton and verify the contents of the accessories (top) box.
See Table 5 and Figure 12.
Table 5. Disk System Accessories
Figure
Label
38
Installation
Part (part number)
A
User guide (A6250-96010)
B
Quick installation guide (A6490-96003)
C
LCCs (A6255-60001)
D
Disk Modules and/or Filler Panels
E
Fibre Channel cable(s)
–
Rail Kits (not shown)
Installation
2 Lift off the accessories box and the top of the under box, and verify the
contents shown in Table 6 and Figure 13.
Table 6. Disk System Contents
Figure
Label
Part (part number)
A
Two power cords (8120-6514)
B
FC Cables (Ordered separately)
C
Disk system chassis with previously installed disk modules, link
control cards, and power supply/fan modules
Installation
39
3 If a part is missing, contact an HP sales representative.
40
Installation
Step 3: Install the device
Follow the procedures in this section to install your storage device in one of the
following rack systems:
■ HP Rack System/E
■ HP Computer Cabinet
■ Rittal-Style Rack
Installing the Storage Device into a Rack System/E
Installation
Your storage device can be installed into any of these HP Rack System/E
Products:
■ A4900A HP Rack System/E25 (1.25 M; 25U)
■ A4901A HP Rack System/E33 (1.60 M; 33U)
■ A4902A HP Rack System/E41 (2.00 M; 41U)
1 Check the rail kit contents (see Figure 14). If any parts are missing, call your
nearest HP sales office.
Installation
41
2 Study the installation overview (see Figure 15).
The following tools are required for the installation of the storage device:
■ Flat-blade screwdriver
■ T25 nut driver
WARNING
To ensure cabinet or rack stability, and avoid possible injury,
always install the storage devices in the rack or cabinet from the
bottom up.
3 Locate a place on the rack columns with the available space required for the
installation of the storage device. The storage device and the rail kit require 3
EIA units of space.
42
Installation
Use the following table as a guide for placement of the rails in a Rack System/E
where multiple disk systems will be installed. You can rack multiple disk systems
without gaps by installing rails every three EIA units. For example, starting at the
bottom of a 2-meter rack, set rails at the following unit/hole locations:
Table 7. Rail Positions for Sequential Disk Systems
Disk Systems
Hole from Rack Bottom
1
Two
4
Three
7
Four
10
Five
13
Six
16
Seven
19
Eight
22
Nine
25
Ten
28
Eleven
31
Installation
One
Installation
43
Note
Be sure to use the same tab—upper or lower—on opposing rails.
Also, hole patterns vary at opposite ends of the rails.
5 Insert the rail tabs into the appropriate column holes (see A in Figure 18).
Installation
6 Secure the rail ends with one M5 screw each.
7 Install clipnuts on the front columns of the cabinet (see Figure 19). These are
used for the retention bracket screws.
Installation
45
8 Place the storage device on the rails and slide into the cabinet until the
retention bracket comes into contact with the rack column (see Figure 20).
WARNING
An empty disk system weighs approximately 54 pounds (24.5 kg).
To avoid personal injury, it is recommended that two people install
the storage device in the rack.
9 Insert and tighten the storage device retention (M5) screws through the
retention bracket (see Figure 20).
46
Installation
Installation
Installation
47
10 Place a rail clamp on each rail and slide them to each bottom rear corner of
the storage device (see Figure 21).
11 Secure the clamps to the rails. Use one 10-32 screw for each rail clamp.
48
Installation
Installing the storage device into an HP Computer Cabinet
Your storage device can be installed into the following Computer Cabinets:
■ C2785A Computer Cabinet (1.10M; 21U)
■ C2786A Computer Cabinet (1.60M; 32U)
■ C2787A Computer Cabinet (1.96M; 41U)
Caution
To ensure proper installation, only use the instructions in this
manual for installing the storage device in the HP Computer
Cabinet. Do not use the instructions enclosed in the rail kit box.
Installation
49
Installation
1 Check the rail kit contents (see Figure 22). If any parts are missing, call your
nearest HP sales office. The tie-down clamp is not used and may be
discarded.
2 Study the installation overview (see Figure 23).
The following tools are required for the installation of the storage device:
■ Flat-blade screwdriver
■ T25 nut driver
WARNING
To ensure cabinet or rack stability and avoid possible injury,
always install the storage devices in the rack or cabinet from the
bottom up.
3 Locate a place on the rack columns with the available space required for the
installation of the storage device. The storage device and the rail kit require 4
EIA units of space, three units for the storage device and one unit for the rails
(see Figure 24).
50
Installation
5 Insert the rail tabs into the appropriate holes on the HP Computer Cabinet
columns (see A in Figure 26).
6 Secure the rail ends with one M5 screw each.
52
Installation
7 Install clipnuts on the front columns of the cabinet (see Figure 27). These are
used for the device retention screws.
Installation
8 Place the storage device on the rails and slide it into the cabinet until the
retention bracket comes in contact with the rack column (see Figure 28).
WARNING
An empty disk system weighs approximately 54 pounds (24.5 kg).
To avoid personal injury, it is recommended that two people install
the storage device in the rack.
Installation
53
9 Tighten the storage device retention (M5) screws through the retention
bracket (see Figure 28).
54
Installation
10 Install a filler panel in the space below the storage device.
Installation
Installation
55
Installing the Storage Device into a Rittal-Style Rack
Your storage device can be installed into the Rittal-Style Rack by doing the
following steps:
1 Inspect the contents of the rail kit. If any parts are missing, call your nearest
HP sales office (see Figure 30).
2 Align the front of rails to the inside of the front cabinet column.
Carefully observe the alignment of the groups of holes on the columns so the
holes in the rails align properly (see Figure 31).
56
Installation
4 Extend the adjustable slide to the back column of the cabinet.
5 Insert the mounting screws and finger tighten them through the rear column
of the cabinet (see Figure 33).
58
Installation
6 Tighten the center nuts to finger tightness (see Figure 34).
Installation
7 Tighten all screws to their final tightness using a driver.
Tighten the screws that hold the rail to the columns first, before tightening the
center slide nuts to their final tightness.
8 Repeat the procedure above for the other rail.
Installation
59
9 Insert the disk system (with disk modules and power supplies removed) onto
the rails (see Figure 35).
60
Installation
10 Move the disk system retention brackets to the frontmost set of mounting
holes.
This allows the disk system to install further back into the cabinet; and allows
the cabinet doors (if present) to close properly (see Figure 36).
Installation
Installation
61
11 Push the disk system back into the rack until the disk system retaining bracket
is flush against the front column of the rack.
12 Bolt the disk system to the front column. Use the fifth hole from the top of the
front of the rail (see Figure 37).
62
Installation
Install the Disk System
1 Remove the power supply/fan modules to prepare the disk system for lifting:
a
Loosen the screws in the extractor handles of each power supply/fan
module with the chassis still in the box.
b Pull the extractor handles out from the center of the power supply to
disengage it from the midplane. Pull each power supply/fan module out of
the chassis. Support the far end of the power supply/fan module with your
free hand as it clears the chassis.
c
Set the power supply/fan modules aside, on an antistatic pad, to be
reinstalled later.
An empty disk system weighs approximately 54 pounds (24.5 kg).
To avoid personal injury, it is recommended that two people install
the storage device in the rack.
2 Remove the disk modules from the disk system. Place them aside on the pink
antistatic foam pad supplied with your disk system.
3 Carry the disk system to the front of the rack and slide the back end onto the
rails (Figure 35) with the help of another person or using a lifting device.
Push the disk system into the rack as far as it will go.
Installation
63
Installation
WARNING
Step 4: Configure LCCs
The disk system comes with two LCCs installed.
If you are connecting this disk system to an HP StorageWorks Virtual Array 7400
or to a 1 Gb/s hub, the link speed switch must be set to 1 Gb/s.
1 Attach your ESD strap to ground.
2 Remove the LCC from the disk system chassis.
Caution
Do not touch the pins on the back of the LCC.
3 Set internal configuration dip switch to appropriate link speed.
Be sure to set the internal LCC data transmission speed switch to 1
Gb/s or 2 Gb/s as appropriate for your configuration. See Figure 2.29
for more detailed information.
64
Installation
4 Open the LCC cam latches (B in Figure 39) by pulling them away from the
center.
5 Align the LCC with the slot (D in Figure 39), and insert the LCC into the slot
at the back of the disk system. Stop pushing when the LCC meets the
midplane.
6 Press the cam latches inward and flat against the center. The cam action
draws the LCC completely into the slot and seats the connector pins on the
midplane.
7 Tighten the locking thumbscrews (C).
Installation
8
Repeat steps 2 through 7, installing the second LCC in the remaining empty
slot.
Installation
65
Step 6: Connect FC and Power Cables
1 Connect the front-end fiber-optic cables.
Front-end fiber-optic cable connections depend on the type of connectors
used by the controller and the type of HBA to which the controller is
connected. The Virtual Array Products use integrated LC (small form factor)
connectors. They support HBAs with either SC (large form factor) or LC
connectors. See Figure 40 through Figure 45.
2 Connect power cords to the power receptacle on the power supply/fan
module(s).
3 Attach the other end of each power cord to a preinstalled PDU/PDRU.
Choose outlets according to the following guidelines:
— Redundancy. To extend the redundancy of the product, attach each cord to
a different PDU. This is represented in Figure 46 and Figure 47.
— Reliability. To avoid cascading faults for a group of disk systems that are
plugged into the same PDU, distribute redundant power cords to as many
different combinations of PDUs as possible. See Figure 46 and Figure 47.
Cascading faults occur when a backup PDU is overloaded with power
surges after the primary PDU fails.
— Serviceability. Choose PDU locations that prevent power cords from
interfering with the removal and replacement of serviceable components.
Also leave a 6-inch service loop to allow for the rotation of PDRUs.
The letters in Figures 46 and 47 represent independent PDUs or PDU banks. The
absence of duplicate letters in individual disk systems indicates the products are
using redundant PDUs. The minimal number of duplicate letter pairs indicates
the disk systems are protected against cascading faults.
72
Installation
Step 7: Install Disk Modules
Caution
Touching exposed areas on the disk can cause electrical discharge
and disable the disk. Be sure you are grounded and be careful not
to touch exposed circuits.
Disk modules are fragile and ESD sensitive. Dropping one end of the disk just
two inches is enough to cause permanent damage. In addition, static electricity
can destroy the magnetic properties of recording surfaces. Grip disks only by
their handles (A in Figure 48) and carriers (C), and follow strict ESD procedures.
Installation
Installation
75
1 Determine which slots, 1 through 15, will contain disk modules and which
will contain fillers.
At least two slots must contain disk modules.
2 Put on the ESD strap and attach the other end of the strap appropriately.
Caution
Disk modules are fragile. Handle carefully. Be careful to grasp the
disk module by its handle and avoid touching exposed circuitry.
3 Remove a disk module from the disk pack and its ESD bag.
4 Open the disk module cam latch (C) by pulling the tab toward you.
5 Push the disk module as far as it will go into the selected slot.
6 Close the cam latch by pushing the latch toward the disk until it clicks. The
cam action draws the disk module completely into the slot and seats the
connecting pins on the midplane.
7 Repeat steps 4 through 6 to install additional disk modules.
8 Install disk fillers in the remaining slots.
Caution
Every slot must contain either a disk module or filler.
Step 8: Turn on the Disk System
Caution
When starting up the disk system, do not override automatic spinup of the drives. Doing so could cause an overcurrent fault,
requiring a power cycle to recover.
Press in the power/standby switch with the retracted tip of a pen or pencil to
power-on the disk system (see Figure 49). Allow 2 minutes for the disk drives
and controllers to complete their self-tests.
1 Press the power/standby switch (C in Figure 49) to turn on the disk system.
2 Watch the system LEDs for confirmation that the disk system is operational.
The system power LED (A) should be green, and the fault LED (B) should be
off.
If the LEDs indicate a problem, refer to chapter 4, Troubleshooting.
Note
76
Installation
An amber light that is on briefly when a component turns on is
normal. If this light remains on more than a couple seconds, a fault
has been detected.
Step 9: Verify Devices on the Host
On the host system run IOSCAN (ioscan -f) and verify that the disks and LCC(s)
are listed in IOSCAN output. If the displayed “S/W State” is not “claimed,”
begin troubleshooting (see chapter 4).
Sample IOSCAN
Each LCC (ctl) or disk appears as a separate target in IOSCAN output.
Class
I
H/W Path
Driver
S/W State
H/W Type
Description
==============================================================================================
fc
0
0/4/0/0
fcT1
CLAIMED
INTERFACE
HP Fibre Channel Mass Storage
lan
1
0/4/0/0.5
fcT1_cntl CLAIMED
INTERFACE
fcp
0
0/4/0/0.8
fcp
CLAIMED
INTERFACE
FCP Protocol Adapter
ba
4
0/5
lba
CLAIMED
BUS_NEXUS
Local PCI Bus Adapter (782)
lan
2
0/5/0/0
btlan5
CLAIMED
INTERFACE
PCI Ethernet (10110019)
ba
5
0/8
lba
CLAIMED
BUS_NEXUS
Local PCI Bus Adapter (782)
fc
4
0/8/0/0
td
CLAIMED
INTERFACE
HP Tachyon TL/TS Fibre Channel
fcp
4
0/8/0/0.8
fcp
CLAIMED
INTERFACE
FCP Protocol Adapter
0/8/0/0.8.0.255.0
fcpdev
CLAIMED
INTERFACE
FCP Device Interface
0/8/0/0.8.0.255.0.0
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.0.0
sdisk
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.1
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.1.0
sdisk
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.2
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.2.0
sdisk
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.3
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.3.0
sdisk
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.4
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.4.0
sdisk
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.5
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.5.0
sdisk
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.6
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.6.0
sdisk
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.7
tgt
CLAIMED
DEVICE
Adapter
HP Fibre Channel Mass Storage
Cntl
Mass Storage Adapter
ext_bus
target
disk
5
140
target
disk
6
141
target
disk
7
64
target
disk
8
65
target
disk
9
142
target
disk
10
143
target
disk
11
144
target
78
10
12
Installation
HP 18.2GST318451FC
HP 18.2GST318451FC
HP 18.2GST318451FC
HP 18.2GST318451FC
HP 36.4GST336704FC
HP 36.4GST336704FC
HP 36.4GST336704FC
disk
target
disk
145
13
146
0/8/0/0.8.0.255.0.7.0
sdisk
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.8
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.8.0
sdisk
CLAIMED
DEVICE
HP 36.4GST336704FC
HP 36.4GST336704FC
The “descriptions” in this example represent some of the valid disk modules.
Valid disk descriptions include:
■ ST336704FC36-Gbyte 10K rpm FC disk module
ST336605FC
■ ST373405FC73-Gbyte 10K rpm FC disk module
■ ST318451FC18-Gbyte 15K rpm FC disk module
ST318452FC
Installation
■ ST336752FC36-Gbyte 15K rpm FC disk module
Where do you go from here?
For operating system and application configuration information, refer to the
documentation for your particular server’s operating system.
Installation
79
80
Installation
3
Configuration
Viewing a Disk System in IOSCAN
An IOSCAN (example below) shows each LCC (0/8/0/0.8) and disk in the
system.
Sample IOSCAN
Type the command: ioscan -fn
Class
I
H/W Path
Driver
S/W State
H/W Type
Description
===========================================================================================
fcp
ext_bus
target
disk
4
10
5
140
0/8/0/0.8
fcp
CLAIMED
INTERFACE
FCP Protocol Adapter
0/8/0/0.8.0.255.0
fcpdev
CLAIMED
INTERFACE
FCP Device Interface
0/8/0/0.8.0.255.0.0
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.0.0
sdisk
CLAIMED
/dev/dsk/c10t0d0
target
disk
6
141
0/8/0/0.8.0.255.0.1
0/8/0/0.8.0.255.0.1.0
tgt
CLAIMED
sdisk
CLAIMED
/dev/dsk/c10t1d0
target
disk
7
64
disk
8
65
tgt
CLAIMED
DEVICE
sdisk
CLAIMED
DEVICE
tgt
CLAIMED
0/8/0/0.8.0.255.0.3.0
sdisk
CLAIMED
/dev/dsk/c10t3d0
target
disk
9
142
0/8/0/0.8.0.255.0.4
tgt
CLAIMED
0/8/0/0.8.0.255.0.4.0
sdisk
CLAIMED
/dev/dsk/c10t4d0
target
disk
10
143
DEVICE
HP 18.2GST318451FC
/dev/rdsk/c10t1d0
0/8/0/0.8.0.255.0.2.0
0/8/0/0.8.0.255.0.3
HP 18.2GST318451FC
DEVICE
0/8/0/0.8.0.255.0.2
/dev/dsk/c10t2d0
target
DEVICE
/dev/rdsk/c10t0d0
HP 18.2GST318451FC
/dev/rdsk/c10t2d0
DEVICE
DEVICE
HP 18.2GST318451FC
/dev/rdsk/c10t3d0
DEVICE
DEVICE
HP 36.4GST336704FC
/dev/rdsk/c10t4d0
0/8/0/0.8.0.255.0.5
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.5.0
sdisk
CLAIMED
DEVICE
HP 36.4GST336704FC
Configuration
81
/dev/dsk/c10t5d0
target
disk
11
144
0/8/0/0.8.0.255.0.6
tgt
CLAIMED
0/8/0/0.8.0.255.0.6.0
sdisk
CLAIMED
/dev/dsk/c10t6d0
target
disk
12
145
0/8/0/0.8.0.255.0.7
tgt
CLAIMED
0/8/0/0.8.0.255.0.7.0
sdisk
CLAIMED
/dev/dsk/c10t7d0
target
disk
13
146
0/8/0/0.8.0.255.0.8
0/8/0/0.8.0.255.0.8.0
tgt
CLAIMED
sdisk
CLAIMED
/dev/dsk/c10t8d0
target
disk
14
147
disk
15
148
disk
16
149
disk
17
150
disk
18
151
DEVICE
DEVICE
CLAIMED
0/8/0/0.8.0.255.0.10.0
sdisk
CLAIMED
0/8/0/0.8.0.255.0.11
tgt
CLAIMED
0/8/0/0.8.0.255.0.11.0
sdisk
CLAIMED
0/8/0/0.8.0.255.0.12
0/8/0/0.8.0.255.0.12.0
tgt
CLAIMED
sdisk
CLAIMED
disk
19
185
ctl
20
7
DEVICE
DEVICE
sdisk
CLAIMED
HP 36.4GST336704FC
/dev/rdsk/c10t13d0
DEVICE
DEVICE
HP 36.4GST336704FC
/dev/rdsk/c10t14d0
0/8/0/0.8.0.255.0.15
tgt
CLAIMED
DEVICE
0/8/0/0.8.0.255.0.15.0
sctl
CLAIMED
DEVICE
Configuration
HP 36.4GST336704FC
/dev/rdsk/c10t12d0
DEVICE
0/8/0/0.8.0.255.0.14.0
HP 36.4GST336704FC
DEVICE
CLAIMED
/dev/rscsi/c10t15d0
82
DEVICE
/dev/rdsk/c10t11d0
CLAIMED
CLAIMED
HP 36.4GST336704FC
DEVICE
sdisk
/dev/dsk/c10t14d0
target
DEVICE
/dev/rdsk/c10t10d0
tgt
tgt
HP 36.4GST336704FC
DEVICE
0/8/0/0.8.0.255.0.13.0
0/8/0/0.8.0.255.0.14
HP 36.4GST336704FC
/dev/rdsk/c10t9d0
0/8/0/0.8.0.255.0.13
/dev/dsk/c10t13d0
target
DEVICE
/dev/rdsk/c10t8d0
CLAIMED
tgt
HP 36.4GST336704FC
DEVICE
CLAIMED
/dev/dsk/c10t12d0
target
DEVICE
/dev/rdsk/c10t7d0
sdisk
0/8/0/0.8.0.255.0.10
HP 36.4GST336704FC
DEVICE
tgt
/dev/dsk/c10t11d0
target
DEVICE
/dev/rdsk/c10t6d0
0/8/0/0.8.0.255.0.9.0
/dev/dsk/c10t10d0
target
DEVICE
0/8/0/0.8.0.255.0.9
/dev/dsk/c10t9d0
target
/dev/rdsk/c10t5d0
HP
A6255A
The disks shown in the previous sample ioscan -fn are the ST318451FC (used in
the A6191A disk module) and the ST336704FC (used in the A6192A disk
module). The full descriptions of the supported disk modules are:
■ ST336605FC 36 Gbyte 10K rpm disk FC disk module (A6192A)
ST336704FC
■ ST373405FC 73 Gbyte 10K rpm disk FC disk module (A6194A)
■ ST318451FC 18 Gbyte 15K rpm disk FC disk module (A6191A)
ST318452FC
■ ST336752FC 36 Gbyte 15K rpm disk FC disk module (A6193A)
Interpreting the Hardware Path
Configuration
The elements of the Fibre Channel hardware path are interpreted as follows:
8/12.8.0.255.2.14.0
LUN (Logical Unit Number of disk)
Target (Lower 4 bits of the loop ID)
Bus (Upper 4 bits of the loop ID)
Port (255 = the target connected directly to the FC)
Area (0 = point-to-point or private loop)
Protocol Type (8 = mass storage)
Adapter
Bus Converter
The loop ID, broken out in upper and lower bits in the example above, is 46. To
derive the loop ID from the Bus and Target values of the hardware path:
1 Convert the Bus and Target fields (the upper and lower bits of the loop ID) to
binary:
8/12.8.0.255.2.14.0
1 1 1 0 (Lower 4 bits of the loop ID)
0 0 1 0 (Upper 4 bits of the loop ID)
Configuration
83
2 Combine the two binary fields into 8 bits and convert back to decimal:
Upper bit Lower bit
0 0 1 0 1 1 1 0
32 + 8+4+2
= 46
Loop IDs and Hardware Paths by Enclosure ID
The rotary switch on the LCC set the Fibre-Channel Address range for the
enclosure. Both LCCs should be set identically for proper redundancy. Multiple
enclosures need to have unique settings to avoid address conflicts. If devices are
physically present and are not reported as found, suspect address conflicts with
other devices. The following tables helps understand what addressing is being
used:
Table 8. Loop IDs and Hardware Paths by Slot Number and Enclosure ID 0 - 2
Encl.
ID
0
1
2
Disk
Slot #
(dec)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
1
0
0
0
EF
16
1
0
CD
32
2
0
B2
2
1
0
1
E8
17
1
1
CC
33
2
1
B1
3
2
0
0
E4
18
1
2
CB
34
2
2
AE
4
3
0
3
E2
19
1
3
CA
35
2
3
AD
5
4
0
4
E1
20
1
4
C9
36
2
4
AC
6
5
0
5
E0
21
1
5
C7
37
2
5
AB
7
6
0
6
DC
22
1
6
C6
38
2
6
AA
8
7
0
7
DA
23
1
7
C5
39
2
7
A9
9
8
0
8
D9
24
1
8
C3
40
2
8
A7
10
9
0
9
D6
25
1
9
BC
41
2
9
A6
84
Configuration
Table 8. Loop IDs and Hardware Paths by Slot Number and Enclosure ID 0 - 2
Encl.
ID
0
1
2
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
11
10
0
10
D5
26
1
10
BA
42
2
10
A5
12
11
0
11
D4
27
1
11
B9
43
2
11
A3
13
12
0
12
D3
28
1
12
B6
44
12
9F
14
13
0
13
d2
29
1
13
B5
45
2
13
9E
15
14
0
14
D1
30
1
14
B4
46
2
14
B4
SES
15
0
15
CE
31
1
15
B3
63
3
15
73
Configuration
Disk
Slot #
(dec)
Table 9. Loop IDs and Hardware Paths by Slot Number and Enclosure ID 3 - 4
Encl.
ID
3
4
Disk
Slot #
(dec)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
1
48
3
0
98
64
4
0
72
2
49
3
1
97
65
4
1
71
3
50
3
2
90
66
4
2
6E
4
51
3
3
8F
67
4
3
6D
5
52
3
4
88
68
4
4
6C
6
53
3
5
84
69
4
5
6B
7
54
3
6
82
70
4
6
6A
8
55
3
7
81
71
4
7
69
Configuration
85
Table 9. Loop IDs and Hardware Paths by Slot Number and Enclosure ID 3 - 4
Encl.
ID
3
4
Disk
Slot #
(dec)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
9
56
3
8
80
80
4
8
67
10
57
3
9
7C
73
4
9
66
11
58
3
10
7A
74
4
10
65
12
59
3
11
79
75
4
11
63
13
60
3
12
76
76
4
12
5C
14
61
3
13
75
77
4
13
5A
15
62
3
14
74
78
4
14
59
SES
79
4
15
56
79
4
15
56
Table 10. Loop IDs and Hardware Paths by Slot Number and Enclosure ID 5- 6
Encl.
ID
86
5
6
Disk
Slot #
(dec)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
1
80
5
0
55
96
6
0
3A
2
81
5
1
54
97
6
1
39
3
82
5
2
53
98
6
2
36
4
83
5
3
52
99
6
3
35
5
84
5
4
51
100
6
4
34
6
85
5
5
4E
101
6
5
33
Configuration
Table 10. Loop IDs and Hardware Paths by Slot Number and Enclosure ID 5- 6
Encl.
ID
5
6
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
Loop
ID
(dec)
Bus
(dec)
Tgt
(dec)
ALPA
(hex)
7
86
5
6
4D
102
6
6
32
8
87
5
7
4C
103
6
7
31
9
88
5
8
4B
104
6
8
2E
10
89
5
9
4A
105
6
9
2D
11
90
5
10
49
106
6
10
2C
12
91
5
11
47
107
6
11
2B
13
92
5
12
46
108
6
12
2A
14
93
5
13
45
109
6
13
29
15
94
5
14
43
110
6
14
27
SES
95
5
15
3C
111
6
15
26
Configuration
Disk
Slot #
(dec)
In the above tables, columns 0-6 correspond to possible switch settings. Rows 115 indicate the disk slot positions. SES refers the address reserved for the
enclosure controller. The intersection of a row and a column contains the loop ID
the device will take. The loop ID is translated to a Fibre Channel address (ALPA) by firmware according to the table in the FC-AL2 standard.
Enclosure IDs (0 through 6) are set with a dial on the LCC. This setting
determines the FC-AL IDs of the disks and LCCs in the disk system. See Table 8
and Table 10 for the FC-AL IDs and corresponding hardware paths for each slot
and LCC based on the Enclosure ID.
Caution
The Enclosure IDs on both LCCs in the same disk system must be
identical.
For redundancy, each LCC is connected to a different Fibre Channel loop (that is,
a different host bus adapter).
Configuration
87
Setting Up the Hardware Event Monitor
Separate monitors watch over the disks and the disk system. You need to install
and configure the Disk Monitor (disk_em) and the High Availability Storage
System Monitor (dm_ses_enclosure) for complete event notification.
To install and configure the required monitors, refer to the EMS Hardware
Monitors User’s Guide, which is included in Adobe Acrobat format on the IPR
Support Media. You can download a copy of Acrobat Reader without charge
from http://www.adobe.com/prodindex/acrobat/readstep.html.
Aliasing Devices (HP-Qualified Only)
Using host-based software, you can “label” each disk system with any
information that would be useful for the site. You might use this feature to assign
an inventory number or to indicate the location of the product. The maximum
length of the annotation is 256 characters.
Using SAM
To define a text string using SAM, select the desired LCC or disk from the Disk
Devices list; then select Annotate Device from the Actions menu. Type the
comment that you want in the Annotation field and select OK.
You can view the annotation through the Annotate Device option in the Actions
menu or by displaying the Annotation column in the Disk Devices list. To
include the Annotation column in the Disk Devices window, select Columns
from the View menu and choose Annotation.
Using STM (HP-Qualified Only)
Annotating devices is a password-protected function of STM (Support Tools
Manager). Use the System menu License option to install the HP-Only license
before you select the annotate function.
1 Run STM and install the HP-Only license.
2 Select the desired LCC.
3 Select Expert Tool > Run from the Tools menu. An Expert Tool window
opens.
88
Configuration
4 Select Write Label from the Info menu. The User Defined Annotation
window, similar to the screen shown below, displays the existing label in an
edit field.
Figure 50. Annotate Device Using STM
Configuration
5 Type the desired text in the New User Defined Annotation field. Click OK.
The new label will replace the existing label.
To view the annotation of a selected disk system, select Read Label from the
Expert Tool Info menu. The label is displayed in the Expert Tool window.
Configuration
89
Updating Firmware (HP-Qualified Only)
Obtain the latest disk system firmware release from the support web site before
traveling to the customer site. When you arrive at the site:
1 Save the firmware file on the customer’s system, preferably in the default
firmware directory: /var/tmp
2 If you want to run STM in graphic mode, make sure DISPLAY is exported.
3 Start STM by typing xstm& on the HP-UX command line. This command
starts the graphic version of STM and keeps the X window open when you
quit STM.
4 Select License from the System menu and install the password-protected
HP-Only license.
5 Select Firmware Update > Run from the Tools menu. A tool window opens,
displaying the current firmware version and instructions for updating. A
second window lists the available firmware files in the var/tmp directory.
That second window is similar to the one shown below.
Figure 51. Firmware File Selection Window
If there are no firmware files in the default directory, a pop-up window instructs
you to select an optional path and STM displays a list of directories. Enter the
directory path you used to save the firmware file (in step 1) and click OK.
90
Configuration
6 Select the firmware file from the list of files displayed in the default or
specified directory. Click OK.
7 Select Start Update... from the Update menu. STM prompts you to confirm or
cancel the firmware update. A window is similar to the one shown below.
Figure 52. Firmware Download Confirmation Window
Configuration
Configuration
91
The results of your action appear in the Tool window. The screen that appears is
similar to the illustration shown below.
Figure 53. Firmware Tool Window
92
Configuration
4
Troubleshooting
Overview
The following steps will help you identify and resolve disk system failures:
8 Gather information from all sources:
— Event notifications (page 93)
— Disk system LED status (page 96)
— Online information tools (page 98)
9 Isolate the cause of the problem (page 104).
10 Correct the problem (chapter 5, Removal and Replacement).
11 Verify operational status with IOSCAN or other host utilities.
Event Notification
The EMS hardware event monitor polls environmental services on the LCC and
reports any changes in the status of monitored components. Depending on how
the monitor is set up, you can receive messages at the console, in e-mail, in a log
file, or through third-party applications. These messages are likely to be the first
indication of a problem with a disk system.
Events are reported for changes in temperature, voltage, and the status of
replaceable components.
Troubleshooting
93
Messages identify five levels of severity:
Critical
An event that causes data loss, host system downtime,
or other loss of service. Host system operation will be
affected if the disk system continues to be used without
correction. Immediate action is required.
Serious
An event that may cause data loss, host system
downtime, or other loss of service if left uncorrected.
Host system and hardware operation may be adversely
affected. The problem needs repair as soon as possible.
Major Warning
An event that could escalate to a serious condition if
not corrected. Host system operation should not be
affected and normal use of the disk system can
continue. Repair is needed but at a convenient time.
Minor Warning
An event that will not likely escalate to a severe
condition if left uncorrected. Host system operation
will not be interrupted and normal use of the disk
system can continue. The problem can be repaired
when convenient.
Information
An event that is expected as part of the normal
operation of the hardware. No action is required.
Event messages (see Figure 54) contain the following:
■ Message Data – Date and time the message was sent, the source and
destination of the message, and the severity level
■ Event Data – Date and time of the event, the host, event ID, name of the
monitor, event number, event class, severity level, hardware path, associated
OS error log entry ID
■ Error Description – Narrative information indicating the component that
experienced the event and the nature of the event
■ Probable Cause/Recommended Action – The cause of the event and
suggested steps toward a solution. This information should be the first step in
troubleshooting.
■ Annotation – The user-defined annotation associated with the specific disk
system
94
Troubleshooting
Figure 54. Sample Hardware Event Notification
Notification Time:
Wed Feb 3 11:27:15 1999
yourserver sent Event Monitor notification information:
/storage/events/enclosures/ses_enclosure/8_0_1_0.15.0 is >=1.
Its current value is MAJORWARNING(3)
Event data from monitor:
Event Time: Wed Feb 3 11:27:15 1999
Hostname: yourserver.rose.hp.com
Event ID: 0x0036b8a313000000002
Event # : 402
Severity : MAJOR WARNING
IP Address : 15.43.213.13
Monitor
: dm_ses_enclosure
Event Class: I/O
Enclosure at hardware path 8/0/1/0.15.0: Hardware failure
Associated OS error log entry id(s): None
Description of Error:
The enclosure services controllers have different versions of
firmware.
Probable Cause / Recommended Action:
The enclosure services controller cards have different versions of
firmware. Update the controllers to the same version of firmware.
User Defined Annotation: Enclosure 37 LCC A.
Troubleshooting
Troubleshooting
95
Status LEDs
LEDs indicate the status of the disk system itself and each of its components (see
Table 11). Green and amber system LEDs are visible on the front of the disk
system. They show that power is on (green) and a fault has occurred (amber).
Disk activity (green) LEDs are on the front of the disk drives at the bottom. Other
LEDs are on individual components in the back of the disk system.
LED states are described in Table 11:
Table 11. LED Functions
LED
System Power
96
Troubleshooting
State
Indication
Green
Power is on.
OFF
Power is off.
Table 11. LED Functions
LED
State
System Fault
LCC Fault
Link Active
2G
Power Supply
3
Disk Activity
Indication
Amber
Self-test1 / Problem.2
OFF
Normal operation.
Flashing
LCC A & B DIP switch settings do not match.
Amber
Self-test1 / Fault.
OFF
Normal operation.
Flashing
Peer LCC DIP switch settings do not match.
Green
Port is in use.
OFF
Port is disabled (bypassed).
ON
Disk system is configured for 2.125 Gb/s operation.
OFF
Disk system is configured for 1.0625 Gb/s operation.
Amber
Start-up1 / Fault.
Green
Operating.
OFF
Power is off.
ON
Installed and spinning up. If the LED is still on 3 minutes
after power is engaged, the disk may be faulty.
Flashing
There is input/output activity to the disk.
OFF
Not installed or not operating.
Note
An amber light that is on briefly when a component first comes on
is normal. If this light remains on more than a couple of seconds, a
fault has been detected.
Troubleshooting
97
Troubleshooting
1.Start-up and self-tests occur briefly when the unit is powered on.
2.A component has failed; temperature or voltage is out of normal range. See Isolating Causes
on page 104.
3.When a disk is installed with power on, its activity LED stays on until the disk has spun up.
When the disk is ready, the LED turns off. Thereafter, it flashes when there is I/O to the disk.
Online Status Information
Software applications that run on HP-UX hosts display status and descriptive
information about the disk system and its components. SAM is the system
administrator’s interface to specific HP-UX functions. STM is the service
engineer’s tool for information, diagnostics, firmware updates, and more.
Viewing Component Status in SAM
SAM displays the status of disk system components on the host console. Follow
the instructions below to use SAM:
1 Select Disks and File Systems from the main window.
2 Select Disk Devices. SAM displays the hardware paths of all disks, disk
systems, and arrays on the host.
3 Select the path that represents the LCC of the desired disk system. You can
recognize the LCC by the description “HP Disk System 2405 Controller.”
4 Select View More Info from the Actions menu. A window displays header
information and a graphical representation of the front of the disk system.
The header provides the following information:
— LCC Hardware path - the path chosen from the Disk Devices list
— Peer LCC Hardware path - the path to the other LCC in the same unit
— Controller’s ID Switch Setting - Enclosure ID, set by the dial on the LCC
bulkhead
— Enclosure’s logical ID - the enclosure’s World Wide Name, a unique
identifier in the Fibre Channel network
5 For a view of the back of the selected disk system, click the “Back” tab.
6 To view component information, click the button representing the
component. SAM displays the following information about specific
components:
98
Troubleshooting
Button
Displays
Disk
Disk Slot, hardware path, status
LCC
Hardware path, status, firmware revision
Power Supply
Name, status
Status values are OK, critical error, noncritical, not installed, unknown, and
status not available. See Interpreting Status Values on page 100 for the meanings
of these terms.
Viewing the STM Information Log
STM generates Information and Activity logs for a selected disk system. Execute
STM in an X window and run the Information tool as follows.
1 At the system prompt, type xstm&.
2 Select the desired disk system (HP A6250A).
3 Select Information from the Tools menu.
4 To generate a current log, select Run.
5 To view log output, select Information from the Tools menu.
6 Select Information Log.
7 Select Done when you have finished viewing the information.
The contents of the STM Information Log are as follows:
The date and time the Information Tool was last
run for the selected disk system.
Hardware path
The physical path from the host to the reporting
LCC; for example, 8/12.8.0.255.2.14.0.
Product ID
A6250A, the HP product number of the disk
system.
FC Loop ID
The FC-AL ID of the reporting LCC, a decimal
value between 0 and 125.
LCC A Status
The reported status of LCC A in the selected disk
system. Possible values are OK, critical,
noncritical, not installed, or not available.
LCC B Status
The reported status of LCC B in the selected disk
system. Possible values are OK, critical,
noncritical, not installed, or not available.
Reporting LCC
LCC A or LCC B, whichever LCC corresponds to
the selected hardware path.
Troubleshooting
99
Troubleshooting
Log creation time
Enclosure ID
The unique manufacturer number that
distinguishes the reporting LCC from all other
LCCs.
WW Name (node)
The World Wide Name assigned to this disk
system. In normal operation, this value is the same
as the World Wide Name (port) for LCC A.
WW Name (port)
The World Wide Name of the reporting LCC.
Firmware Rev.
The current firmware version on the reporting
LCC.
Power Supply Status
The status of the left (Supply A) and right (Supply
B) power supplies in the selected disk system.
Possible values are OK, critical, not installed, or
not available.
Voltage Sensors
Voltage and Status
The voltage detected and status of three voltage
sensors—3.3V, 5.0V, and 12V—on each LCC.
Possible status values are OK, critical, noncritical,
not installed, unknown, and not available.
Temp Sensors
Temperature and Status
The temperature detected and status of four
sensors. Possible status values are OK, critical,
noncritical, not installed, unknown, or not
available.
Interpreting Status Values
SAM and STM report status in common terms, which are defined as follows:
Table 12. Status Indications
Reported
Status
OK
100 Troubleshooting
Applicable
Component
All replaceable
components and
sensors
Indication
Component is installed and no error
conditions are known.
Table 12. Status Indications
Reported
Status
Critical
Applicable
Component
Indication
Replaceable
components
Hardware has failed.
Sensors
Voltage/temperature exceeds critical limit.
Noncritical LCC
LCC A and LCC B have different firmware
versions.
Sensors
Voltage/temperature exceeds warning
limit.
Not
Installed
All replaceable
components and
sensors
Component is not installed.
Unknown
Sensors
Sensor has failed or status is not available.
Not
Available
All replaceable
components and
sensors
Component is installed without known
errors, but has not turned on or set into
operation.
Troubleshooting
Troubleshooting 101
Checking the Fibre Channel Link
At power up, the disk system and the host Fibre Channel I/O adapters default to
Fibre Channel Arbitrated Loop (FC-AL) Use the HP-UX FCMSUTIL on the host
to verify that the loop is operating correctly. Then check the Fibre Channel cables
and connectors.
To create the device files, first run the IOSCAN command against the Fibre
Channel driver to find the minor numbers. For example:
1 ioscan -fnd fcT1_cnt1
Output similar to the following will appear
Class I
H/W Path
Driver
S/W State
H/W Type
Description
=========================================================================
lan
0
8/8.5fcT1_cntl CLAIMED
INTERFACE HP Fibre Channel Mass Stora
/dev/fcms0
lan
1
8/12.5 fcT1_cntl CLAIMED
INTERFACE HP Fibre Channel Mass Stora
/dev/fcms1
2 Next, run the LSDEV command to find the major number of the Fibre
Channel driver:
lsdev | grep fcT1_cntl
Output similar to the following will display. The major number is the first
item in the output line.
78
-1
fcT1_cntl
lan
3 Next, run the MKNOD command to create the device files using the major
and minor numbers from the LSDEV and IOSCAN output. The minor
numbers are under the “I” column.
mknod
/dev/fcms1
c
78
0x000000
mknod
/dev/fcms1
c
78
0x010000
FCMSUTIL uses the device file of the Fibre Channel I/O adapters. If the
device files do not exist, they must be created.
102 Troubleshooting
4 After the device files have been created, issue the FCMSUTIL command on
the device files. For example:
/opt/fcms/bin/fcmsutil
/dev/fcms0
The output should appear similar to the following:
Local N_Port_ID is = 0x000001
N_Port Node World Wide Name = 0x10000060B03E22CB
N_Port World Wide Name = 0x10000060B03E22CB
Topology = IN_LOOP
Speed = 1062500000 (bps)
HPA of card = 0xFBF48000
EIM of card = 0xFFFA000A
Driver state = Ready
Number of EDB’s in use = 0
Number of OIB’s in use = 0
Number of Active Outbound Exchanges = 1
Number of Active Login Sessions = 5
A driver state of Ready indicates that the driver is in the correct operating
state. IN_LOOP topology indicates that the host has detected an FC-AL.
5 Check Fibre Channel cables for loose connections.
6 Check the Enclosure ID switches for conflicting loop IDs. Make sure both
LCCs have the same ID setting.
Troubleshooting
Troubleshooting 103
Isolating Causes
Table 13 lists the probable causes and solutions for problems you may detect on
the disk system. When more than one problem applies to your situation,
investigate the first description that applies. The table lists the most basic
problems first and excludes them from subsequent problem descriptions.
Table 13. Troubleshooting Table
Problem
Description
Installed
product does
not power on
HW Event
Category
none
LED
State
STM
Status
System
none
power LED
off
Probable Cause/Solution
■ Neither power cord is plugged in.
■ The power switch is not pressed.
■ AC breaker is tripped.
■ AC power source has failed.
■ The PDU/PDRU is defective.
■ Power switch is defective.
■ A faulty component is causing power
supplies to turn off. Remove all
components and reinsert one at a time
until the faulty component is isolated.
Power
Power
supply LED supply Not
off
Available
■ The power supply is not plugged in.
Critical
Part fault
LED on
Critical
A component has failed. See problem
descriptions below.
none
LCC Fault
flashing
Disk Not
Available
LCC DIP switch settings do not match
peer LCC switch settings. Reset switches.
LCC Fault LED Critical
is on
LCC Fault
on
Critical
LCC hardware is faulty. Replace the LCC.
Fan LED is
amber
Amber
Critical
Fan has slowed or stopped. Replace the
fan.
System fault
LED is on
Audio alarm
when LCC
installed
none
Critical
104 Troubleshooting
■ The PDU/PDRU or primary power
source has failed.
Table 13. Troubleshooting Table
Problem
Description
Power supply
LED is amber
HW Event
Category
Critical
LED
State
Amber
STM
Status
Critical
Probable Cause/Solution
■ An incompatible or defective
component caused a temporary fault.
■ Power supply hardware is faulty.
Unplug the power cord and wait for the
LED to turn off. Reinsert the power cord.
If fault persists, replace the power supply.
IOSCAN lists
LCC and disks
as NO_HW
Critical
All normal
none
■ Cable is unplugged or loose at either
end.
■ Cable is damaged. Replace with
another cable to test.
■ Prior unit in the daisy chain is
powered off.
■ HBA is faulty. Check status and
correct any problem.
IOSCAN lists
disk as
NO_HW
none
All off
none
Disk system is powered off.
On or off
(See STM
Disk Tool)
■ Use the fcmsutil replace_dsk
operation when replacing the disk
drive.
■ Use insf -e to create the appropriate
device files for the newly installed
disk drive.
■ Reboot host. If after reboot, ioscan
■ Replace the drive.
Troubleshooting 105
Troubleshooting
does not report the newly installed
disk drive, then the disk drive is faulty.
Table 13. Troubleshooting Table
Problem
Description
Temperature is
over limit
HW Event
Category
Critical
LED
State
none
STM
Status
Critical
Temp is
>54.5º C
(130.1º F)
Major Warning
none
Probable Cause/Solution
■ A fan is faulty. Check status and
correct.
■ Airflow is obstructed; vents are
blocked.
Non-critical ■ One or more slots are empty.
■ Power supply is faulty. Check status
Temp is
and correct.
>36º C
(96.8º F)
■ Room temperature is too high. If
ambient temperature cannot be
Temperature sensors are on the LCC and are independent of
reduced in a reasonable time, turn off
power supplies. Investigate temperature warnings
product to prevent shortened life.
immediately, before power supplies sense critical temperature
■ Temperature sensor is faulty.
and turn off.
Compare temperature reported by peer
LCC.
Temperature is
under limit
Critical
none
Critical
Temps
<9.5º C
(49.1º F)
Major Warning
none
Non-critical
Temps
<15.5º C
(59.9º F)
Voltage is over
limit
Critical
none
Critical
Major Warning
none
Non-critical
Voltage is
under limit
Critical
none
Critical
Major Warning
none
Non-critical
106 Troubleshooting
■ Room temperature is too low.
■ Temperature sensor is faulty.
Compare temperature reported by peer
LCC.
Power supply is faulty. Check status and
correct.
Either power supply is faulty. Check
status and correct.
Table 13. Troubleshooting Table
Problem
Description
HW Event
Category
Major Warning
Peer LCC
status,
temperature and
voltage are Not
Available
LED
State
STM
Status
Probable Cause/Solution
none
Both LCCs: Firmware on LCC A and LCC B are
Non-critical different versions.
none
Not
Available
Internal bus is faulty. Contact HP
technical support to replace midplane.
Troubleshooting
Troubleshooting 107
108 Troubleshooting
Removal and Replacement
Caution
Do not remove hot-pluggable components until you have the
replacement parts and are ready to install them. An empty slot will
cause uneven cooling and eventual overheating.
Caution
Do not move the disk system with disks installed and power on.
Even a one-inch drop of the disk system can damage spinning
disks.
Removal and Replacement 109
Table 14. Disk System Field Replaceable Units
Fig.
38
Item
Part No.
FRU Description
Qty
Per
Encl.
Exch/
Repl.
Part
FRU
Type
1
A6191-69001 Disk Drive, 18GB, 15k rpm, 2-15
512 bytes/sector
E
CRU
1
A6192-69001 Disk Drive, 36GB, 10k rpm, 2-15
512 bytes/sector
E
CRU
1
A6193-69001 Disk Drive, 36GB, 15k rpm, 2-15
512 bytes/sector
E
CRU
1
A6194-69001 Disk Drive, 73GB, 10k rpm, 2-15
512 bytes/sector
2
A6198-69002 Disk Drive Filler Panel
0-13
R
CRU
3
A6250-67003 Enclosure Bezel
1
R
HP
4
A6250-97005 Midplane Assembly
(includes: midplane PCA,
T-15 driver, ESD kit,
8 x T-15 x 6/32 x 7/16”
long screws,
3 x T-10 x 6mm long
screws, 1 x power/ standby
switch shaft, 1 x lightpipe)
1
R
HP
5
A6250-69001 Power Supply/Fan Module
2
E
CRU
6
A6255-69001 Link Controller Card
2
E
CRU
CRU
CRU = Customer Replaceable Unit
HP = Hewlett-Packard Replaceable Only Unit
110 Removal and Replacement
Add or replace disks to increase storage capacity or eliminate faults. (See
chapter 4 for troubleshooting procedures.) Disks must be Fibre Channel (FC) and
3.5 inches wide but can vary in capacity. For current information about supported
disks, consult an HP sales representative.
You do not need to turn off the disk system to replace a disk or filler.
Preparation
Removing or replacing a disk has consequences for the file systems and logical
volumes located on the disk. Before removing or replacing a disk, complete the
appropriate system administration for your environment and configuration.
Instructions for determining physical volume status and reducing and recreating
mirrored extents follow. For additional information, refer to your HP-UX guide,
How HP-UX Works: Concepts for the System Administrator.
The LVM commands in the following instructions assume the following:
■ All of the extents of the disk in use belong to mirrored logical volumes
created with the strict (-s) option.
■ The replacement disk is of the same or greater capacity as the disk being
replaced.
The correct set of instructions depends on whether the mirrored volume is active
and attached, or unattached. First, follow the instructions to determine the
volume status; then follow the instructions to replace the volume depending on
whether the volume is attached or unattached.
To Determine If a Volume Group or Physical Volume Group Is
Active
At the host console, enter:
# vgdisplay <VG name>
For example:
#vgdisplay /dev/vg00
If the volume group is not active, the host will display:
# vgdisplay: volume group not activated.
# vgdisplay: cannot display volume group
/dev/vg00
Removal and Replacement 111
Removal and Replacement
Disk Module
The following messages will appear if the disk is defective:
VGDISPLAY: WARNING: COULDN’T QUERY PHYSICAL VOLUME
“/dev/dsk/c2t4d0”
THE SPECIFIED PATH DOES NOT CORRESPOND TO PHYSICAL
VOLUME ATTACHED TO THE VOLUME GROUP
VGDISPLAY: WARNING: COULDN’T QUERY ALL OF THE
PHYSICAL VOLUMES
If either of the above messages appears, follow the replacement instructions for
unattached physical volumes (page 114).
Otherwise, follow the instructions to determine if the physical volume is
attached.
To Determine If the Physical Volume Is Attached
Enter the vgchange command to activate the volume group.
The physical volume is unattached if a message similar to the following appears:
VGCHANGE: WARNING: COULDN’T ATTACH TO THE VOLUME
GROUP PHYSICAL VOLUME “/dev/dsk/c2t4d0”
THE PATH OF THE PHYSICAL VOLUME REFERS TO A DEVICE
THAT DOES NOT EXIST, OR IS NOT CONFIGURED INTO THE
KERNEL.
Continue with the appropriate replacement instructions as follows:
■ If the physical volume is unattached, follow the instructions for replacing
unattached physical volumes (page 114).
■ If the physical volume is attached, follow the instructions for replacing
attached physical volumes (page 112).
To Replace Attached Physical Volumes
Use the following commands to reduce any logical volumes that have mirror
copies on the faulty disk and to recreate the mirror extents once the disk has been
replaced. Commands to recover from a host failure are included with most steps.
Note
112 Removal and Replacement
The way that mirrors span several disks may not be duplicated
exactly. For cases where the original mirror layout must be
preserved, consider deactivating the volume group with the
vgchange command and using the procedure for replacing
unattached physical volumes.
1 Enter the following command to reduce the mirror:
For example, to reduce a two-way mirror:
# lvreduce -m 0 -A n /dev/vg00/lvol4
/dev/dsk/c2t4d0
or, for a three-way mirror:
# lvreduce -m 1 -A n /dev/vg00/lvol5
/dev/dsk/c2t4d0
If this step fails, execute an lvdisplay command to determine if the lvreduce
command succeeded. If the command did not succeed, execute the command
again. Perform any other lvreduce commands that were not executed before
the system failed. Then proceed.
Note
An important effect of the lvreduce command is that the LVM
configuration backup file used by the vgcfgrestore command is
updated. If this replacement procedure is being performed now on
another host system and there is no need to execute any lvreduce
commands, then the configuration file is not updated. The LVM
configuration is correct on the physical volumes, however, so the
configuration file can be updated with the vgcfbackup command.
2 Replace the disk module (see “Procedure” on page 115).
3 Execute ioscan to verify that the new disk drive is accessible and a proper
replacement.
4 Enter the following command to restore the LVM configuration/headers to
the replaced disks from the backup of the LVM configuration:
# vgcfgrestore -n <volume group name> <physical volume path>
For example:
# vgcfgrestore -n /dev/vg00
/dev/rdsk/c2t4d0
If this step fails, repeat it to ensure all configuration data is written to the new
disk.
Note
If this replacement procedure is being performed now on another
host system and there is no need to execute any lvreduce
commands, then the configuration file can be updated with the
vgcfbackup command.
5 Enter the following command to attach the replaced disk to the active volume
group:
Removal and Replacement 113
Removal and Replacement
# lvreduce -m <mirror_copies> -A n <LV name> <physical volume path>
# vgchange -a y <volume group name>
For example:
# vgchange -a y
/dev/vg00
6 Enter the lvextend command to transfer the mirrors onto the replaced disk.
It will take time to copy all of the original data to the mirrored extents. The
logical volumes are accessible to users’ applications for two-way mirroring
during this command.
# lvextend -m <mirror_copies> <LV name> physical volume path
For example, for two-way mirroring:
# lvextend -m 1
/dev/vg00/lvol4
/dev/dsk/c2t4d0
For three-way mirroring:
# lvextend -m 2 /dev/vg00/lvol5
/dev/dsk/c2t4d0
If there is a failure during step 6, execute an lvdisplay command to determine
if the lvextend command was successful. If the command did not successfully
execute, reissue the command. Perform any other lvextend commands that
were not executed before the system failed.
At this point, the system should be fully functioning.
To Replace Unattached Physical Volumes
Follow these instructions if the volume group is not active or if the physical
volume is unattached.
1 Replace the disk (see page 115).
2 Execute ioscan to verify that the replaced disk is accessible and a proper
replacement.
3 Enter the vgcfgrestore command to restore the LVM configuration/
headers to the replaced disk from the backup of the LVM configuration.
# vgcfgrestore -n <volume group name> character device file
For example:
# vgcfgrestore -n
/dev/vg00
/dev/rdsk/c2t4d0
If the host fails, repeat the step to ensure that all configuration data is written
to the new disk.
4 Enter the vgchange command to attach the new disk to the active volume
group:
114 Removal and Replacement
# vgchange -a y <volume group name>
# vgchange -a y /dev/vg00
Tools
■ ESD wrist strap (no hand tools are required to perform this procedure).
Whenever possible, follow ESD procedures.
Procedure
Caution
Whenever possible, follow standard ESD procedures and avoid
touching exposed circuitry.
Do not remove a disk or filler from an operating product until you
have the replacement part and are ready to install it. An empty slot
will cause uneven cooling and overheating.
1 Release the disk module from the slot by squeezing the latch tab (see
Figure 57) and pulling the disk module toward you.
Caution
Spinning disks generate heat and gyroscopic force.
Wait for a spinning disk to slow down and cool off before
removing it from the product.
WARNING
High current available. Avoid touching the midplane or adjacent
drive electronics when removing and inserting disk modules.
2 Pull the disk out of the slot using the extraction handle. Support the disk
module with your other hand around the enclosed side. See Figure 57.
Note
Removing disk modules and fillers from right to left improves
access to successive disk modules.
Removal and Replacement 115
Removal and Replacement
For example:
Caution
Replace the disk module or filler immediately (see next step).
Caution
Touching the disk circuit board can cause high energy discharge
and permanently damage the disk.
Disk modules are fragile. Handle carefully.
3 Remove the replacement disk module from its ESD bag, being careful to
grasp the disk module by its extraction handle (see Figure 57). (Fillers are not
in ESD bags.)
4 Press the cam latch toward the end of the extraction handle to loosen the
extraction handle.
When you are installing a disk module filler, align the disk filler guides with
the chassis rails and insert the filler. Push the filler in until it stops. When it is
fully inserted, it will be flush with the rest of the disk modules/disk module
fillers.
5 Slide the disk module, capacity label up, into the empty slot.
6 Press the extraction handle to seat the disk module firmly on the midplane.
An audible click indicates the disk module is fully seated.
If you are installing a disk module (as opposed to a filler), monitor the LEDs.
It should be on while the disk spins up and then turn off. The LED will blink
116 Removal and Replacement
7 Run IOSCAN on the host and verify that the replacement disk module is
“claimed.”
8 Restore file systems and data as needed (see Preparation on page 111).
LCC
Replace an LCC when troubleshooting shows that the card is faulty (see
“Isolating Causes” in chapter 4).
There is no need to turn off the disk system to remove and replace an LCC.
However, the host must be notified that all disks on the affected loop will be
unavailable for I/O. Refer to Preparation on page 111.
Caution
Touching the LCC pins can cause high energy discharge and
permanently damage the LCC.
Tools
■ ESD wrist strap (no hand tools are required to perform this procedure).
Whenever possible, follow ESD procedures.
Procedure
Caution
Do not remove a LCC from an operating product until you have
the replacement LCC and are ready to install it. An empty slot will
cause uneven cooling and eventual overheating.
1 Remove the cables and/or terminators from the failed LCC.
2 Loosen the locking thumbscrew (A in Figure 58) until it clears the LCC
bulkhead. The screw stays in the ejector handle.
Removal and Replacement 117
Removal and Replacement
with I/O activity to the disk. If you observe different results, refer to chapter
4, Troubleshooting, for probable causes and solutions.
3 Open the cam levers (B) by pulling them away from the center of the card.
This disconnects the LCC pins from the midplane.
4 Pull the LCC out of the slot (C).
Replace the LCC immediately if the product is in use (see next step).
5 Attach the clip end of your ESD wrist strap to the ground stud at the top of the
rack.
Caution
Touching the LCC pins can cause high energy discharge and
permanently damage the LCC.
6 Remove the replacement LCC from its ESD bag.
118 Removal and Replacement
7 Set address switches on the new LCC to match settings on the peer LCC.
The address switches must have the same settings on both LCCs.
8 Open the cam levers (see Figure 58) by pulling them away from the center of
the card.
9 Insert the LCC in the empty slot.
10 Push the cam levers flat against the center of the card to seat the LCC pins
firmly on the midplane.
11 Watch the LCC Fault LED (see Figure 59). It should come on briefly and then
turn off. If the LED stays on and a buzzer sounds, the switch settings do not
match the settings on the peer LCC. For other solutions to a LCC fault, see
“Isolating Causes” in chapter 4.
12 Tighten the locking screws (A in Figure 58).
13 Reattach the FC cables.
Caution
The LCC must be replaced or a filler panel installed in the open
slot to ensure proper cooling for the disk system.
Removal and Replacement 119
Removal and Replacement
Caution
Power Supply
Replace a power supply as soon as possible when troubleshooting indicates a
power supply failure (see “Isolating Causes” in Chapter 4). If a power supply
fails, the remaining power supply provides proper voltage to the disk system.
However, if the remaining power supply fails before the first power supply is
replaced, the disk system will turn off.
The power supply fan may continue to operate even when a power supply fails.
You do not need to turn off the disk system to replace a power supply.
Follow ESD procedures whenever possible.
Tools
ESD wrist strap (no hand tools are required to perform this procedure).
Whenever possible, follow ESD procedures.
Procedure
Caution
Do not remove a power supply from an operating product
until you have the replacement and are ready to install it.
An empty slot will cause uneven cooling and eventual
overheating.
The power supply may be hot to touch.
1 Disconnect the power cord from the power supply.
2 Loosen the thumbscrews on the power supply handles (A and B in Figure 60).
3 Rotate the handles out to disengage the power supply from the midplane.
4 Pull the power supply out of the chassis. Support the far end of the supply
with your free hand as it clears the chassis.
Replace the power supply immediately if the product is in use (see next step).
120 Removal and Replacement
Removal and Replacement
5 Slide the replacement power supply into the empty slot (D in Figure 60). The
power supply begins to engage the midplane with 3/8 inch (8mm) still
exposed.
6 Rotate the handles back toward the center of the power supply module to
draw the power supply the last 3/8 inch into the chassis and firmly seat the
power supply on the midplane. The power supply should be flush with the
edge of the chassis.
7 Tighten the thumbscrews on the power supply handles (A and B). It is
recommended that you use a screwdriver to ensure proper seating.
8 Plug the power cord into the power supply and electrical source.
9 Monitor the power supply LED. It should turn green. If the LED is dark or
stays amber, see Chapter 4, Troubleshooting.
Removal and Replacement 121
Disk System
Use this procedure if you need to move or remove and replace the disk system in
the rack. For example, you must remove the disk system from the rack in order to
replace the midplane or power switch assembly. Twenty four inches of vertical
space is required in the rack if the midplane or power switch assembly are to be
replaced without removing the disk system from the rack.
The disk system will be turned off in this procedure.
Caution
Do not move the disk system with disks installed and power on.
Even a one-inch drop of the disk system can damage spinning
disks.
Tools
■ ESD wrist strap (no hand tools are required to perform this procedure).
Whenever possible, follow ESD procedures.
Procedure
1 Determine the file systems that will be inaccessible for I/O operations while
the disk system is turned off, and perform necessary system administration.
(See the HP-UX guide, How HP-UX Works: Concepts for the System
Administrator.)
2 Push and release the power button to turn off the disk system.
3 Remove the disk modules from the chassis and set them aside on an antistatic surface. Label the disk modules so they can be reinstalled in the same
disk slots.
4 Remove the power supply/fan modules and set them aside on an anti-static
surface.
5 Remove screws from the mounting ears (see Figure 61).
6 Disconnect power and Fibre Channel cables from the back of the disk system.
WARNING
122 Removal and Replacement
Product is heavy (~54 lbs. without disks). If you choose to remove
the disk system from the rack, use two people or a lift device.
Removal and Replacement
7 Push the disconnected disk system forward or lift it completely out of the
rack, as needed.
8 When you are ready to replace the disk system, push the chassis back into the
rack.
9 Insert and tighten the front mounting screws.
10 Reinstall the power supply/fan module(s).
11 Reinstall the disk modules in the slots from which they were removed.
12 Reconnect Fibre Channel cables and power cords.
13 Push the power/standby button in to turn on the disk system.
14 Perform necessary system administration to return file systems to service.
Removal and Replacement 123
Top Cover (HP-Qualified Only)
The following procedure is for HP-qualified personnel only.
The top cover, which is not an orderable part, will need to be removed and
replaced to service the light pipes, the power switch extension arm, or the
midplane.
You will need to turn the power off to perform this procedure.
Tools
■ Small flat-blade screwdriver
■ Torx T25 screwdriver
■ Torx T10 screwdriver
Procedure
Caution
Disk slots must be empty before removing the top cover.
1 Perform all appropriate system administration tasks before doing the
following tasks.
2 Remove disk modules and fillers and place them on an appropriate anti-static
surface. See page 111.
3 Disconnect all power and fibre channel cables. See Figure 2 on page 14.
4 Remove the power supply/fan modules. See page 120.
5 Remove the disk system retention screws. See page 123.
6 Remove the disk system from the rack and place it on an appropriate antistatic surface.
7 Remove the three flathead screws from the back and side edges of the cover
plate (A in Figure 62).
8 Rotate the cover upward; then lift it away from the disk system.
124 Removal and Replacement
Removal and Replacement
9 Slide the cover toward the middle of the chassis.
10 Insert the three flathead screws through the holes as shown in Figure 62 and
tighten.
11 Reconnect the disk system. See page 120.
12 Reinstall disks. See page 111.
Removal and Replacement 125
Midplane (HP-Qualified Only)
The midplane board is replaceable by HP-qualified personnel only.
Replace the midplane based on troubleshooting results (see “Isolating Causes” in
chapter 4). Disks, LCCs, and power supply/fan modules connect to the midplane.
The power must be OFF and the top cover removed in order to remove and
replace the midplane board.
Caution
Turning off a disk system isolates the enclosed disks from the host.
Perform recommended system administration to prevent loss of
pending I/Os to the disks.
Tools
■ Small flat-blade screwdriver
■ Torx T25 screwdriver
■ Torx T15 screwdriver
■ Torx T10 screwdriver
■ ESD strap
Procedure
1 Remove the top cover. See page 124.
2 Put on your ESD strap and attach the free end to the disk system.
Caution
Static discharge can destroy functional components on the
midplane.
3 To remove the midplane:
a
Loosen the cam handle locking screws and pull power supplies free of the
midplane (see page 120).
b Loosen the cam handle locking screws and pull the LCCs free of the
midplane.
c
Remove the disk modules from the chassis.
d Remove the light pipes (see Figure 63 on page 128).
e
126 Removal and Replacement
Remove the power switch extender arm.
f
g Pull the midplane forward to clear alignment pins and lift it up and out of
the disk system.
4 To replace the midplane:
a
Stand the new midplane inside the chassis and push it over the alignment
pins. Connectors automatically align with floating fan connectors inside
the chassis.
b Insert and tighten eight screws into the midplane and chassis.
c
Replace the light pipes.
d Replace the power switch extender arm.
5 Replace the top cover. See page 124.
6 Reseat and secure the LCCs (see page 117).
7 Reseat and secure the power supplies (see page 120).
8 Reinstall the disk modules.
Removal and Replacement 127
Removal and Replacement
Remove the eight Torx T15 screws along the top and bottom edges of the
midplane (see Figure 63).
6
Reference
Product Models and Options
Three models of the disk system are available:
■ A6250A field-racked disk system
■ A6250AZ factory-racked disk system
■ A6250AE empty field-racked disk system
Reference 129
Upgrade Products
Order the following parts to expand or reconfigure your original purchase:
Table 15. Upgrade Products
Order No.
130 Reference
Description
A6192A
36-Gbyte 10K rpm FC disk module
A6194A
73-Gbyte 10K rpm FC disk module
A6191A
18-Gbyte 15K rpm FC disk module
A6193A
36-Gbyte 15K rpm FC disk module
C7524A
2-meter LC duplex M/M FC cable
C7525A
16-meter LC duplex M/M FC cable
C7526A
50-meter LC duplex M/M FC cable
C7527A
200-meter LC duplex M/M FC cable
C7529A
2-meter LC/SC duplex 50/125 M/M Fiber Optic Cable
C7530A
16-meter LC/SC duplex 50/125 M/M Fiber Optic Cable
C7534A
Fiber Optic Coupler SC F/F
C7540A
Fiber Optic Adapter Kit - Optical
A6244A
Rail kit for HP C2785A, C2786A, C2787A, A1896A, and
A1897A
A6209A
Rail kit for HP Rack Systems/E
A6496A
Rittal Rack Rail Kit
A6498A
2-Post Rail Kit
PDU/PDRU Products
Table 16. PDU/PDRU Products
Order No.
Description
19-inch, 100-240 V, 16 Amp, 1 C20 inlet, 10 C13 outlets
E7671A
19-inch, 100-240 V, 16 Amp, 1 C20 inlet, 2 C19 & 6 C13 outlets
E7674A
19-inch, 100-240 V, 16 Amp, 1 C20 inlet, 1 C19 & 7 C13 outlets
E7679A
19-inch, 100-127 V, 16 Amp, 2 C20 inlets, 2 C19 outlets, switch
accessory
E7680A
19-inch, 200-240 V, 16 Amp, 2 C20 inlets, 2 C19 outlets, switch
accessory
E7681A
19-inch, 200-240 V, 30 Amp, L6-30P, 2 C19 & 8 C13 outlets,
switch accessory
E7682A
19-inch, 200-240 V, 30 Amp, IEC-309, 2 C19 & 8 C13 outlets,
switch accessory
E4452A
36-inch, 200-240 V, 16 Amp, L6-20P plug, 6 IEC-320 outlets
E4453A
36-inch, 200-240 V, 16 Amp, L6-20P plug, 6 IEC outlets
E5933A
36-inch, 110-240 V, 16 Amp, UPS, IEC-320, 6 IEC-320 outlets
E4456A/B 60-inch, 220 V, 16 Amp, power cord w/IEC-320 plug, 6 IEC
outlets
E4457A/B 60-inch, 200-240 V, 16 Amp, L6-20P plug, 10 IEC-320 outlets
E5930A
60-inch, 110-220 V, 16 Amp, UPS, IEC-320, 10 C-13 outlets
E5931A
60-inch, 220 V, 16 Amp, UPS, LP-30P, 10 C-13 outlets
E5932A
60-inch, 220 V, 16 Amp, UPS, no plug, 10 C-13 outlets
E7677A
Switch panel accessory for PRU
E7678A
Switch control jumper cord for PRU
Reference 131
Reference
E7676A
Replaceable Parts
Table 17. Replacement and Exchange Part Numbers
Replacement Part
Order No.
Exchange Part
Order No.
8120-6514
A6250-67001
Power cord
A6250-69001
A6250-67005
A6255-67001
Part Description
Power supply/fan module
Midplane PCA
A6255-69001
A6198-60009
Link Control Card (LCC)
Disk filler
A6192-67001
A6192-69001
36-GB 10K rpm FC disk module
A6194-67001
A6194-69001
73-GB 10K rpm FC disk module
A6191-67001
A6191-69001
18-GB 15K rpm FC disk module
A6193-67001
A6193-69001
36-GB 15K rpm FC disk module
Specifications
Dimensions
The maximum dimensions of the disk system are:
■ Height: 12.9 cm (5.10 in.)
■ Width: 44.7 cm (17.60 in.)
■ Depth: 50.5 cm (19.90 in.)
132 Reference
Weight
A fully loaded disk system weighs approximately 78 pounds. Component
weights are shown in Table 18.
Table 18. Product Weights
Quantity
Subtotal
(lbs)
Disk Module (half height
disk drives)
1.6
15
24
Power Supply/Fan Module
9.5
2
19
LCC
3
2
6
Midplane
6
1
6
Chassis
23
1
23
Approx. Total
78 lbs
AC Power Input
The disk system operates at 100-127 and 200-240 V AC, 50-60 Hz, single phase,
power factor corrected. Maximum current is 6.5 amps over the low voltage range
and 3.2 amps over the high voltage range. Average power consumption with
medium load (15 disks running idle) is 340 watts.
DC Power Output
■ Disk: +5 V and +12 V from power supply
■ LCC: +5 V and +3.3 V from power supply
Heat Output
■ 1600 BTU/hr.
Reference 133
Reference
Weight of
Each (lbs)
Component
Environment
The following environmental specifications were type-tested under controlled
conditions. Hewlett-Packard maintains an active program of auditing production
products to make sure these specifications remain true when products are retested
under the same conditions. However, the limits of these specifications do not
represent the optimum for long, trouble-free operation and specifically are not
recommended for maximum satisfaction. The recommended conditions are
stated when appropriate.
■ Operating temperature: 5º C to 40º C (50º F to 104º F)
Recommended: 20º C to 25.5º C (68º F to 78º F)
■ Maximum gradient: 20º C per hour (36º F per hour)
■ Relative humidity: 20% to 80% noncondensing, max. wetbulb at 26º C
Recommended: 30% to 50% noncondensing
■ Altitude: 3000 m (10,000 ft.)
Note
For continuous, trouble-free operation, the disk system should
NOT be operated at its maximum environmental limits for
extended periods of time. Operating within the recommended
operating range, a less stressful operating environment, ensures
maximum reliability.
The environmental limits in a nonoperating state (shipping and storage) are
wider:
■ Temperature: -40º C to 70º C (-40º F to 158º F)
■ Maximum gradient: 24º C per hour (43.2º F per hour)
■ Relative humidity: 15% to 90% noncondensing
■ Altitude: 4600 m (15,000 ft.)
Acoustics
■ Sound power: 7.3 Bels
■ Sound pressure at operator’s position: 56.3 dB(A)
Safety Certifications
UL listed, UL 1950:1995 – 3rd Edition
CSA certified, C22.2 No. 950:1989
134 Reference
TUV certified with GS mark, EN 60950:1992 + A1:1993, A2:1993, A3:1995,
A4:1997
CE mark (see Declaration of Conformity on page 139)
EMC Compliance
Australia: AS/NZS 3548, Class A
Canada: ICES-003, Class A
China: CB9254-88
European Union: EN55022 Class A, EN50082-1
Japan: VCCI Class A
Reference
Taiwan: CNS 13438, Class A
US: 47 CFR Parts 2 & 15, Class A
Reference 135
Regulatory Statements
A. FCC Statement (For U.S.A. Only)
The Federal Communications Commission (in 47 CFR 15.105) has specified that
the following notice be brought to the attention of the users of this product.
This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment
is operated in a commercial environment. This equipment generates, uses, and
can radiate radio frequency energy and, if not installed and used in accordance
with the instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the
interference at his own expense. The end user of this product should be aware
that any changes or modifications made to this equipment without the approval
of Hewlett-Packard could result in the product not meeting the Class A limits, in
which case the FCC could void the user's authority to operate the equipment.
B. IEC Statement (Worldwide)
This is a Class A product. In a domestic environment this product may cause
radio interference, in which case the user may be required to take adequate
measures.
136 Reference
C. Spécification ATI Classe A (France)
DECLARATION D’INSTALLATION ET DE MISE EN EXPLOITATION d’un
matériel de traitement de l’information (ATI), classé A en fonction des niveaux
de perturbations radioélectriques émis, définis dans la norme européenne EN
55022 concernant la Compatibilité Electromagnétique.
Cher Client,
Conformément à la Réglementation Française en vigueur l’installation ou le
transfert d’installation, et l’exploitation de cet appareil de classe A, doivent
faire l’objet d’une déclaration (en deux exemplaires) simultanément auprès
des services suivants:
Préfecture du département du lieu d’exploitation
Le formulaire à utiliser est disponible auprès des préfectures.
La déclaration doit être faite dans les 30 jours suivant la mise en exploitation.
Le non respect de cette obligation peut être sanctionné par les peines prévues
au code des Postes et Télécommunications et celles indiquées dans la loi du
31 mai 1993 susvisée.
Arrêté du 27 Mars 1993, publié au J.O. du 28 Mars - ATI
D. Product Noise Declaration (Germany)
Schalldruckpegel Lp = 56.3 dB(A)
Am Arbeitsplatz (operator position)
Normaler Betrieb (normal operation)
Nach ISO 7779:1988 / EN 27779:1991 (Typprufung)
Reference 137
Reference
Comité de Coordination des Télécommunications 20, avenue de Ségur 75700 PARIS
E. VCCI Statement (Japan)
Harmonics Conformance (Japan)
F. BSMI EMC Statement (Taiwan)
138 Reference
G. Declaration of Conformity
Reference
Reference 139
Product Web Site
This guide is available in Adobe® Acrobat® format on the HP Customer Care
web site for enterprise storage (http://www.hp.com/support/storage). Choose HP
Disks and Disk Arrays and then HP disk systems. The HP StorageWorks Disk
System 2405 is one of the disk system selections.
Related Documents
The following manuals explain how to use the system software interfaces to the
HP StorageWorks Disk System 2405.
■ EMS Hardware Monitors User’s Guide, available at
http://docs.hp.com/hpux/hw/
■ Online Diagnostics (for HP 9000): Support Tools Manager Overview
■ HP-UX System Administration Tasks Manual
140 Reference
index
A
AC power 133
acoustics, product 134
Acrobat Reader
World Wide Web site 88
annotating devices
using SAM 88
using STM 88
arbitrated loop (FC-AL)
definition 29
audio alarm 104
C
Cautions
circuit board 76
ESD 75
LCC pins 64
LCC switch settings 119
moving the disk system with
power on 109, 122
multiple disk systems 32, 75
operating with empty slot 115,
117, 120
permanent disk damage 116
permanent LCC damage 117,
118
removing
disk 115
top cover 124
static discharge 126
turning off the disk system 126
configuration
annotating devices 88
setting up Hardware Event
Monitor 88
topologies 23
updating firmware 90
cover
installing 124
removing 124
D
DC power 133
Declaration of Conformity 139
definitions 28
dimensions, product 132
disk
installing 115
products 130
removing 111, 115
disk filler 116
installing 115
removing 115
disk fillers
description of 17
disk module
installing 75
disk system
description 13
disconnecting 122
reconnecting 122
status indicators 15
disks
description of 17
141
E
EMC compliance 135
Enclosure ID
settings 87, 103
environment, product 134
environmental services
event notification 93
environmental services, features of 16
event messages, contents of 94
event monitor 93
user guide 140
event notification 88, 93– 95
exchange part numbers 132
J
F
JBOD
definition 28
fan
troubleshooting 104, 106
FC cable
installing 72
FC-AL ID 87
firmware
mismatch 104
obtaining latest release 90
troubleshooting 107
updating 90
H
Hardware Event Monitor 88
hardware requirements 23
high availability
definition 28
features 15
hot-pluggable
definition 28
I
inrush current 31
installing
cover 124
disk 115
disk filler 115
142
LCC 64, 117
midplane 126
PDU/PDRUs 34
power supply/fan module 120
tools required 38
verifying operation 76
IOSCAN
example 78, 81
hardware path 83
troubleshooting NO_HW 105
viewing a disk system 81
L
LCC
description of 18
Enclosure ID 87
environmental services 93
environmental services, features
of 16
Fault LED 119
installing 117
order number 38
removing 117
shown in IOSCAN 81
switch settings 66
troubleshooting 104
LCC filler
description of 18
LEDs 15
components 15
disk module 15
fault 15
functions 96
LCC Fault 119
power supply/fan module 121
status 96
system 15
logical volume 111
loop ID 83
M
midplane
installing 126
removing 126
model numbers 129
Multimode
definition 29
O
operating systems
required 23
order number
LCC 38
PDU/PDRU 131
upgrade products 130
User Guide 38
P
part numbers 132
PDRU
definition 28
PDU
definition 28
PDU/PDRU
definition 28
installing 34
order numbers 131
troubleshooting 104
physical volume group 111
power cable
installing 72
power supply
troubleshooting 105, 106
power supply/fan module
description of 21
installing 120
LED 121
removing 120
power switch
and PDUs 28
troubleshooting 104
power up the disk system 76
power/standby switch
location and function 15
product
AC power 133
acoustics 134
DC power 133
dimensions 132
disconnecting 122
EMC compliance 135
environment 134
exchange part numbers 132
model numbers 129
options 129
reconnecting 122
replacement part numbers 132
safety certifications 134
web site 140
weight 133
Q
Quick Installation Guide 38
Part Number 38
R
removing
cover 124
disk 115
disk filler 115
LCC 117
midplane 126
power supply/fan module 120
replaceable parts, description of 17
replaceable parts, descriptions of ??–
22
replacement part numbers 132
restoring operation 122
143
S
V
safety certifications 134
SAM
annotating devices 88
Short Wave
definition 28
site preparation 31
electrical 31
PDU 32
software requirements 23
verifying 37
status
LEDs 96
steady state current 31
STM
annotating devices 88
Information Log contents 99
user guide 140
switches
LCC 66
verify connection to the host 78
voltage, troubleshooting 106
T
temperature
troubleshooting 106
topologies 23
troubleshooting
event notification 93
Information Log 98
isolating faults 104
overview 93
status LEDs 96
table 104
turning on the disk system 76
U
upgrade products
order numbers 130
User and Installation Guide 38
User Guide
order number 38
web site 140
144
W
web site
documents 140
product 140
weight, product 133