Dell PowerEdge M610x System information

PowerEdge M610x
Technical Guide
PCIe expansion
capabilities in the
PowerEdge M610x
bring a new
dimension of
flexibility and
performance to the
Dell M-Series.
Dell
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Citrix and XenServer are registered trademarks of Citrix Systems, Inc. and/or one or more of its
subsidiaries, and may be registered in the United States Patent and Trademark Office and in other
countries. Intel, Xeon, and Speedstep are registered trademarks and MMX and Core are trademarks of
Intel Corporation in the U.S. and other countries. Broadcom is a registered trademark and NetXtreme
is a trademark of Broadcom Corporation and/or its affiliates in the United States, certain other
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Trade Association. Matrox is a registered trademark of Matrox Electronic Systems Ltd. Microsoft,
Windows, Windows Server, BitLocker, and Hyper-V are either registered trademarks or trademarks of
Microsoft Corporation in the United States and/or other countries. Mellanox and ConnectX are
registered trademarks of Mellanox Technologies, Inc. Novell and SUSE are registered trademarks of
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Linux is a registered trademark of Linus Torvalds. NVIDIA is a registered trademark and Tesla is a
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©Copyright 2012 Dell Inc. All rights reserved. Reproduction or translation of any part of this work
beyond that permitted by U.S. copyright laws without the written permission of Dell Inc. is unlawful
and strictly forbidden.
December 2012 | Version 6.0
Dell PowerEdge M610x Technical Guide
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Table of Contents
1
Product Comparison ........................................................................................... 6
1.1
Overview .................................................................................................. 6
1.1.1
Unparalleled PowerEdge Flexibility ............................................................. 6
1.1.2
Uncompromised Performance .................................................................... 6
1.1.3
Simplified Systems Management ................................................................. 6
1.2
Product Comparison ..................................................................................... 7
2
Key Technologies............................................................................................... 9
2.1
Overview .................................................................................................. 9
3
System Information .......................................................................................... 10
4
Mechanical .................................................................................................... 13
4.1
Chassis Description..................................................................................... 13
4.2
Dimensions and Weight ................................................................................ 13
4.3
Internal Module View .................................................................................. 14
4.4
Security .................................................................................................. 14
4.5
Cover Latch ............................................................................................. 14
4.6
Trusted Platform Module.............................................................................. 14
4.7
Power Off Security ..................................................................................... 14
4.8
USB Key .................................................................................................. 14
4.9
Battery ................................................................................................... 14
4.10 Field Replaceable Units ............................................................................... 15
4.11 User Accessible Jumpers, Sockets, and Connectors ............................................... 15
5
Power, Thermal, Acoustic .................................................................................. 16
5.1
Power Supplies ......................................................................................... 16
5.2
Power Efficiency ....................................................................................... 16
5.3
Thermal Operating and Storage Specifications .................................................... 16
5.4
Acoustics ................................................................................................ 17
6
Processors ..................................................................................................... 19
6.1
Overview ................................................................................................ 19
6.2
Features ................................................................................................. 19
6.3
Supported Processors .................................................................................. 20
6.4
Processor Installation .................................................................................. 21
7
Memory ........................................................................................................ 22
7.1
Overview ................................................................................................ 22
7.2
DIMMs Supported ....................................................................................... 22
7.3
Memory Features ....................................................................................... 23
7.4
Speed .................................................................................................... 23
8
Chipset ........................................................................................................ 25
8.1
Overview ................................................................................................ 25
8.2
I/O Hub .................................................................................................. 25
8.2.1
QuickPath Interconnect ......................................................................... 25
8.2.2
PCI Express ........................................................................................ 25
8.2.3
Direct Media Interface........................................................................... 25
8.2.4
I/O Controller Hub 9 ............................................................................. 25
8.2.5
PCI Express Mezzanine Connectors ............................................................ 26
9
BIOS ............................................................................................................ 27
9.1
Overview ................................................................................................ 27
9.2
Supported ACPI States ................................................................................. 27
10 Embedded NICs/LAN on Motherboard ..................................................................... 28
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11
I/O Mezzanine Card Options ................................................................................
11.1.1
Overview ..........................................................................................
11.1.2
Options ............................................................................................
11.1.3
PCIe Card Support ................................................................................
11.1.4
GPGPU Cards ......................................................................................
11.1.5
Fusion-io Cards ...................................................................................
12 Storage ........................................................................................................
12.1 Overview ................................................................................................
12.2 Hard Disk Drive Carriers ...............................................................................
12.3 Empty Drive Bays .......................................................................................
12.4 Diskless Configuration Support .......................................................................
12.5 Hard Drive LED Indicators .............................................................................
12.6 Optical Drives ...........................................................................................
12.7 RAID Cards ..............................................................................................
12.7.1
SATA Repeater ....................................................................................
12.7.2
PERC6/i ............................................................................................
12.7.3
H200 ................................................................................................
12.7.4
H700 and H800 ....................................................................................
12.8 LED Indicators ..........................................................................................
12.9 Optical Drives ...........................................................................................
13 Video ...........................................................................................................
14 Rack Information .............................................................................................
15 Operating Systems ...........................................................................................
16 Virtualization .................................................................................................
16.1 Resources................................................................................................
16.2 Advanced Infrastructure Manager by Scalent ......................................................
17 Systems Management ........................................................................................
17.1 Overview ................................................................................................
17.2 Server Management ....................................................................................
17.3 Embedded Server Management ......................................................................
17.4 Lifecycle Controller and Unified Server Configurator ............................................
17.5 Integrated Dell Remote Access Controller..........................................................
17.6 iDRAC6 Enterprise ......................................................................................
17.7 iDRAC6 Enterprise with Virtual Flash (vFlash) Media .............................................
17.8 Chassis Management Controller (CMC) ..............................................................
18 Peripherals ....................................................................................................
18.1 USB Peripherals.........................................................................................
18.2 External Storage........................................................................................
Appendix A. Statement of Volatility ..........................................................................
Appendix B. Certifications .....................................................................................
B 1. Regulatory Certifications .............................................................................
B 2. Product Safety Certifications .........................................................................
B 3. Electromagnetic Compatibility .......................................................................
B 4. Ergonomics, Acoustics and Hygienics ...............................................................
Appendix C. Industry Standards ...............................................................................
29
29
29
29
29
30
31
31
31
31
31
31
31
32
32
32
32
32
32
32
33
34
35
36
36
36
37
37
37
38
38
39
39
39
41
42
42
42
43
49
49
49
50
50
51
Tables
Table 1.
Table 2.
Table 3.
Product Comparisons ................................................................................. 7
Product Features .................................................................................... 10
Operating and Storage Specifications ............................................................ 17
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Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Acoustical Performance of M1000e Chassis with Four M610x Blades Installed .............
Comparison of Processor Technology ............................................................
Supported Processors ...............................................................................
Maximum Supported Memory Frequencies ......................................................
Supported Video Modes ............................................................................
Server Management Documentation and Information..........................................
Unified Server Configurator Features and Description.........................................
Features List for Base Management Functionality, iDRAC, and vFlash Media ..............
PowerEdge M610x Statement of Volatility.......................................................
Product Safety Certifications ......................................................................
Electromagnetic Compatibility Certifications ...................................................
Ergonomics, Acoustics and Hygienics.............................................................
Industry Standards ..................................................................................
18
20
20
24
33
37
38
39
43
49
50
50
51
Figures
Figure 1.
Figure 2.
Figure 3.
PowerEdge M1000e ................................................................................. 13
Internal View ........................................................................................ 14
2.5‖ HDD Carrier .................................................................................... 31
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1 Product Comparison
1.1 Overview
With PCI Express® (PCIe) expansion options and a feature rich Chassis Management Controller, the
Dell™ PowerEdge™ M610x allows you to efficiently run applications, consolidate your data center,
and simplify data management.
The PowerEdge M610x enables you to incorporate a vast array of PCIe-based products into the blade
chassis framework with enough power and cooling to efficiently deploy even the most feature-rich,
expansion-card-based solutions. With the addition of the PCIe expansion module, the PowerEdge
M610x blade server is an ideal solution for organizations that need maximum flexibility and
performance with high reliability. Maximized PCIe Generation 2 (Gen2) expansion is finally realized
within a blade.
1.1.1
Unparalleled PowerEdge Flexibility
The PowerEdge M610x PCIe expansion module includes two full-length x16 PCIe Gen2 slots with
supplemental power connectors that enable maximum wattage for one 300W dual-slot card or two
250W single-slot cards. These PCIe slots are capable of supporting everything from H-series external
RAID controllers to general-purpose computing-on-graphics processing units (GPGPU).
Now, a single M610x, equipped with a NVIDIA® Tesla™ or AMD ATI FirePro™ GPU card, can perform
over 400 Gigaflops of double-precision computations for demanding, floating-point-intensive
workloads. Communication between the host system and the GPU processors is maximized by
providing x16 PCIe Gen2 bandwidth, while the efficient Dell M1000e chassis powers and cools the
solution to its maximum 247 W TDP (Thermal Design Power).
1.1.2
Uncompromised Performance
The PowerEdge M610x is an energy-efficient, optimized full-height two-socket server for
virtualization and database applications. Additional manageability features make it easy to use,
manage and deploy. As an ideal PCIe Host server, the M610x features the reliability of two 2.5‖ SAS
or SSD hot-swappable hard drives and the I/O throughput of a dual-port embedded gigabit NIC and
two additional network daughtercards. Intel® Xeon® processors 5600 series, plus up to 192 GB of
DDR3 memory, offer high performance with low-power consumption for a variety of
dense-environment workloads. The Platinum level (+94%) powered and modularly cooled PCIe
expansion module delivers up to 8 GB per second of application throughput.
1.1.3
Simplified Systems Management
Spend more time on your business and less on maintaining your IT with embedded system
management features on the PowerEdge M610x and the Chassis Management Controller (CMC).
Simplified server and chassis management is achieved through automated discovery that automates
configuration of new hardware through a one-to-many relationship and enables pre-provisioning of
LAN/SAN resources.
In addition, one-to-many updating through the CMC and Virtual File Share simplifies the update
process for BIOS, firmware and drivers without additional software. Proactive management provides
immediate access to system status, issues and alerts through a single, easy-to-use interface that
includes one-click key functions to help quickly resolve issues.
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1.2 Product Comparison
Table 1 compares the PowerEdge M610x blade server to the PowerEdge M610x, M710HD, and M710
servers.
Table 1.
M610x
Product Comparisons
M610
Description
Special purpose
full-height 2S
General purpose
half-height 2S
Processor
Intel® Xeon® Processor 5500 or 5600 Series
Front Side
Bus
Two Intel QuickPath Interconnect (QPI)
Sockets
Two
Cores per
Socket
Up to six
L2/L3 Cache
8 MB (5500 Series) or 12 MB (5600 Series)
Chipset
Intel 5520
DIMMs
12 x DDR3 DIMMs (800/1066/1333MT/s)
Min/Max RAM
1 GB – 192 GB (16 GB DIMMS)
Form Factor
Full-Height Blade,
Dual
Socket/Expansion
module
HDD Bays
(2.5” only)
SAS: Two hot-pluggable 2.5‖
SATA: One 2.5‖
HDD Types
SAS/SSD
HDD
Controller
PERC Η200
PERC Η700
PERC Η800
SAS6/Ε
Optional HD
Controller
SAS6/iR
PERC6/i with RAID
battery
Half-Height Blade,
Dual Socket
General purpose
half-height 2S
M710
General purpose
full-height 2S
18 x DDR3 DIMMs (800/1066/1333MT/s)
Half-Height Blade,
Dual socket
Full-Height Blade,
Dual Socket
SAS: Two
hot-pluggable 2.5‖
SSD SATA: Two 2.5‖
SAS: Four
hot-pluggable 2.5‖
SSD SATA: Two 2.5‖
PERC H200
PERC Η700
PERC 6/i
SAS6/iR
CERC 6/i
Embedded PERC
H200
PERC H200
PERC H700
CERC 6/i
SAS6/iR
PERC6/i with RAID
battery
Embedded H200
SAS6/iR
PERC6i with RAID
battery
Availability
Server
M710HD
Hot-plug hard drives
ECC memory
Single Device Data Correction (SDDC)
Supports memory demand and patrol
scrubbing
High-availability failover cluster support
Integrated Dell Remote Access Controller iDRAC6 Express/Enterprise (both standard) with
Dell PowerEdge M610x Technical Guide
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Dell
M610x
M610
M710HD
M710
Management
IPMI 2.0 +vMedia/vKVM, and CMC (on the PowerEdge M1000e chassis)
Mezz Slots
Two x8 PCIe Gen2;
Fabric B limited to
a small form factor
(SFF) mezzanine
card
Two x8 PCIe Gen2;
Fabric B limited to a
small form factor
(SFF) mezzanine
card
Two x8 PCIe
mezzanine cards
One x4 and three x8
PCIe mezzanine
cards
I/O slots
Two x16 PCIe Gen2
H800/6 GB SAS
NVIDIA® M2050204, M2070, and
M2070Q
AMD FirePro™
V7800P
NA
NA
NA
RAID
0,1
0,1
0,1
0,1,5
NIC/LOM
Two-port
Broadcom® 5709S
1 Gb with TOE plus
optional iSCSI
accelerator
Two-port Broadcom
5709S
1 Gb with TOE plus
optional iSCSI
accelerator
Four 1 GbE dual
Broadcom BCM5709S
Four TOE with
optional iSCSI
offload
USB
Two external USB 2.0 ports at front bezel
One internal USB port
SD Card
Two:
One for Persistent
Storage
One for
Management
TPM
Yes, except in China where TCM is the standard
Video
Matrox® G200eW integrated into iDRAC chip
Power
Supplies
See the PowerEdge M1000e Technical Guide.
Fans
See the PowerEdge M1000e Technical Guide.
Chassis
See the PowerEdge M1000e Technical Guide.
Two:
One for Persistent
Storage
One for Management
Dell PowerEdge M610x Technical Guide
Three external USB
2.0 ports at front
bezel
One internal USB
port
Two internal SD slots
One for Persistent
Storage
One for Management
(can also be
configured as
redundant SD cards
for embedded
hypervisor)
One internal SD slot
One for Persistent
Storage
OR
One for Management
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2 Key Technologies
2.1 Overview
The Dell™ PowerEdge™ M610x offers you expandability. The M610x is a half-height blade (based on
the M610 server technology) and PCIe card expansion module within a PowerEdge M1000e full-height
blade enclosure that provides the capability to use standard PCIe cards. Similar to the PowerEdge
M610, the PowerEdge M610x features:








Dual quad- and six-core Intel® Xeon® processor 5500 and 5600 series
Intel IOH (24D I/O Hub)
Intel QuickPath Architecture
DDR3 memory
DIMM thermal sensors
PCI Express® Generation 2
Internal SD Module
iDRAC6 Express
The M610x incorporates the system board of the M610 plus a PCI module—two x16 PCIe slots. The
module’s 2nd Generation expansion slots can accommodate any standard full-length or full-height
PCIe card. Supplemental power connectors allow, for the first time in the PowerEdge family, up to
two 250W-PCIe cards or one 350W-PCIe card (inclusive of General-Purpose computation on Graphics
Processing Units or GPGPU).
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3 System Information
Table 2 summarizes the product features for the Dell™ PowerEdge™ M610x. For the latest information
on supported features, visit Dell.com.
Table 2.
Product Features
Feature
Technical Specifications
Processors
Intel® Xeon® processor 5500 and 5600 series
quad- and six-core 60 W, 80 W, 95 W, and 130 W TDP options
Chipset
Intel 5520
Memory1
1 GB, 2 GB, 4 GB, 8 GB, 16 GB 1066 MT/s and 1333 MT/s DDR3
12 DIMM slots with support for up to 192 GB using RDIMMs
Drive Bays
Two 2.5‖ SAS/Solid State hot-plug drives
Storage1
Internal hot-plug hard drive options:
2.5‖ SAS (10 K rpm): 146 GB, 300 GB, 600 GB, or 900 GB
2.5‖ SAS (15 K rpm): 146 GB
2.5‖ SATA (7.2 K rpm): 160 GB, 250 GB, or 500 GB
Solid State Drives (SSD): 50 GB or 100 GB
Solid State Storage Cards:
Fusion-io® 160 GB ioDrive PCIe solid state storage card
Fusion-io 640 GB ioDrive Duo PCIe solid state storage card
Fusion-io 320GB ioDrive Mono PCIe solid state storage card
Fusion-io 640GB ioDrive Mono PCIe solid state storage card
Fusion-io 1.28TB ioDrive Duo PCIe solid state storage card
Maximum Internal Disk Storage:
Up to 1.8 TB using two 2.5‖ 900 GB hot-plug SAS hard drives
RAID Controller
Options
PERC H200 Modular RAID Controller (6 Gb/s)
PERC H700 Modular RAID Controller (6 Gb/s) with 512 MB battery-backed cache
I/O Mezzanine Card
Options
Fully populated mezzanine card slots and switch modules will yield three redundant
I/O fabrics per blade.
1 Gb and 10 Gb Ethernet:
Dual-Port Broadcom® Gb Ethernet with TOE (BCM-5709S)
Quad-Port Intel Gb Ethernet
Quad-Port Broadcom Gb Ethernet (BCM-5709S)
Dual-Port Intel 10Gb Ethernet
Dual-Port Broadcom 10Gb Ethernet (BCM-57711)
10Gb Enhanced Ethernet and Converged Network Adapters (CEE/DCB/FCoE):
Dual-Port Intel 10Gb Enhanced Ethernet (FcoE Ready for Future Enablement)
Dual-Port Emulex® Converged Network Adapter (OCM10102-F-M; supports CEE/DCB
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Feature
Technical Specifications
10GbE + FcoE)
Dual-Port Qlogic® Converged Network Adapter (QME8142; supports CEE/DCB 10GbE
+ FcoE)
Fibre Channel:
Dual-Port QLogic FC8 Fibre Channel Host Bus Adapter (HBA) (QME2572)
Dual-Port Emulex FC8 Fibre Channel Host Bus Adapter (HBA) (LPe1205-M)
Emulex 8 or 4 Gb/s Fibre Channel Pass-Through Module
InfiniBand™:
Dual-Port Mellanox® ConnectX®-2 Dual Data Rate (DDR) and Quad Data Rate (QDR)
InfiniBand
Communications
Two embedded Broadcom NetXtreme II™ 5709 Gigabit Ethernet NICs with failover and
load balancing.
TOE (TCP/IP Offload Engine) supported on Microsoft ® Windows Server® 2003 SP1 or
higher with Scalable Networking Pack. iSCSI Offload supported on Windows Server ®
2003 SP1 or higher, Red Hat® Enterprise Linux® 5, and SUSE® Linux® Enterprise Server
10. Scalable Networking Pack for Windows Server ® 2003 is not required.
Boot from SAN (iSCSI and FC) supported
Optional add-in NICs: See I/O Mezzanine Card Options
Optional add-in HBAs: See I/O Mezzanine Card Options
Two 2nd-generation full-length x16 slots with supplemental power for either two
cards at 250 W draws or one card at a 300 W draw.
PCIe Expansion Bay
Supported GPU Options:
NVIDIA® Tesla™ M2050–204 448 core,
double-width PCIe card with 3GB of
memory
NVIDIA Tesla M2070/M2070Q 448 core,
double-width PCIe card with 6GB of
memory
AMD FirePro™ V7800P 1,440 core, singlewidth PCIe card with 2GB of memory
SAS/PERC Options:
Dell H800 PERC dual-port 6 Gb/s SAS RAID
controller with up to 512MB cache
Dell SAS6E HBA dual-port 6 Gb/s SAS HBA
Operating Systems
Solid State Storage Options:
Fusion-io® 160GB ioDrive PCIe solid state
storage card
Fusion-io® 320GB ioDrive PCIe solid state
storage card
Fusion-io® 640GB ioDrive PCIe solid state
storage card
Fusion-io® 640GB ioDrive Duo PCIe solid
state storage card
Fusion-io® 1.28TB ioDrive Duo PCIe solid
state storage card
Microsoft Windows Server® 2012
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V® )
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2)
Microsoft Windows HPC Server 2008
Novell® SUSE® Linux Enterprise Server
Red Hat® Enterprise Linux®
Oracle® Solaris™
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Feature
Technical Specifications
For more information on the specific versions and additions, visit
Dell.com/OSsupport.
Virtualization OS
Support
Citrix® XenServer®
Microsoft Hyper-V through Microsoft Windows Server 2008
VMware® vSphere® including ESX™ and ESXi™
Red Hat Enterprise Virtualization®
Management Options
Dell OpenManage™ software tools
Dell Management Console
Integration with 3rd party management solutions via the Dell Certified Partner
Program
Altiris™ Deployment Solution for Dell Blade Servers
Designed to help reduce deployment time from hours to minutes
Integrated Dell Remote Access Controller (iDRAC)
Out-of-Band alerting, status, inventory, and troubleshooting via Secure Web GUI /
CLI (telnet/SSH)
Console Redirection
vMedia (virtual media)—Map optical or hard drives to the blade from remote
workstations over a network
vKVM (virtual KVM) out-of-band remote console redirection—supports Java or ActiveX
plug-ins
IPMI 2.0 support
Power Supply
Supplied by Dell PowerEdge M1000e Blade Chassis
Video
Integrated Matrox® G200 w/ 8 MB memory
Systems Management
BMC, IPMI2.0 compliant
Dell OpenManage featuring Dell Management Console
Unified Server Configurator
Lifecycle Controller
iDRAC6 Enterprise with optional vFlash
1
GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.
Dell PowerEdge M610x Technical Guide
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4 Mechanical
4.1 Chassis Description
The Dell™ PowerEdge™ M610x is a full-height blade server that requires an M1000e chassis to
operate.
Figure 1.
PowerEdge M1000e
The M610x server occupies two slots in the M1000e rack chassis for a maximum of eight blades in one
M1000e chassis. It can be mixed with other existing Dell blades and is designed to mix with possible
future half- and full-height double-wide blades. Some highlights are:
 Two full-size standard PCIe x16
 Front-cable access provided for add-in cards
 Support for RAID
 Support for persistent storage (internal USB connector and two external SD card slots)
Refer to the PowerEdge M1000e Technical Guide for information on fans, power and power supply,
racks, security, and other chassis information.
4.2 Dimensions and Weight
The PowerEdge M610x dimensions and weight are as follows:




Height: 38.5cm (15.2in)
Width: 5cm (2in)
Depth: 48.6cm (19.2in)
Weight (Maximum Configuration): 11.1kg (24.5lb)
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4.3 Internal Module View
A view of the internal module is shown in Figure 2. See the Opening and Closing the Blade in the Dell
PowerEdge Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals for more
information.
Figure 2.
Internal View
4.4 Security
The M610x offers a configurable client IP address range for clients connecting to iDRAC6. For
additional information regarding the PowerEdge M610x security features, see the Dell PowerEdge
Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals.
4.5 Cover Latch
The blade module includes a latch for the cover. See the Opening and Closing the Blade in the Dell
PowerEdge Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals for more
information.
4.6 Trusted Platform Module
The Trusted Platform Module (TPM) is used to generate/store keys, protect/authenticate passwords,
and create/store digital certificates. TPM can also be used to enable the BitLocker™ hard drive
encryption feature in Windows Server 2008. TPM is enabled through a BIOS option and uses HMACSHA1-160 for binding. TCM is available in China.
4.7 Power Off Security
Through the BIOS, the front blade server USB ports and power button can be disabled so as to not
allow any control of the system from the front of the blade. The enclosure video can also be
restricted.
The BIOS System Setup program’s system security screen allows administrators to set the system
password, control TPM activation and reporting, clear the TPM’s memory, and disable the power
button and USB ports.
4.8 USB Key
The M610x provides an internal USB connector for a USB flash memory key. The USB memory key can
be used as a boot device, security key, or mass storage device.
4.9 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH9 chip
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4.10 Field Replaceable Units
The planar contains a serial EEPROM to contain Field Replaceable Units (FRU) information including
Dell part number, part revision level, and serial number.
4.11 User Accessible Jumpers, Sockets, and Connectors
For information, see the System Board Information chapter in the Dell PowerEdge Modular Systems
Hardware Owner’s Manual on Support.Dell.com/Manuals.
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Dell
5 Power, Thermal, Acoustic
5.1 Power Supplies
See the PowerEdge M1000e Technical Guide for information on power supplies and power supply
specifications.
5.2 Power Efficiency
One of the main features of blade servers is enhanced power efficiency. The Dell™ PowerEdge™
M610x achieves higher power efficiency by implementing the following features:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
User-configurable power options through the M1000e Chassis Management Controller (CMC)
(see the M1000e documentation online at Support.Dell.com for further details)
Improved power budgeting
Voltage Regulator (VR) efficiency improvements
CPU VR dynamic phase shedding
Switching regulators instead of linear regulators
Closed loop thermal throttling
Use of DDR3 memory (lower voltage compared to DDR2)
Memory VR static phase shedding
BIOS Power/Performance options page
Active Power Controller (BIOS-based CPU P-state manager)
Ability to throttle memory
Ability to disable a CPU core
Ability to turn off embedded NICs or PCIe lanes when not being used
Energy Smart components at the M1000e chassis level to selectively enable more computing
performance with less power consumption.
5.3 Thermal Operating and Storage Specifications
The M610x thermal solution includes:






Optimized airflow impedance for individual blade and chassis level airflow balancing
Custom air baffling directs airflow through the components to maintain proper cooling
Custom designed heat sinks maintain CPU, DIMM, and board-level chip temperatures within
thermal design targets
Separate airflow cooling path for the two full-length x16 PCIe Gen2 slots.
Support for dual slot NVIDIA® GPU cards up to 250 W.
Highly Optimized Fan Control Algorithm
o Base fan speeds are a function of hardware configuration and ambient temperature to
minimize airflow for a given environment.
o Component algorithms: CPU PID, DIMMs, HW Configuration, IOH, GPU, and External
Ambient.
o The highest fan speed request from the above algorithms is used to set the
appropriate fan speed for the blade.
o Ambient and HW Configuration sets the minimum; other algorithms increase fan speed
to maintain proper cooling.
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Dell
Thermal specifications for the PowerEdge M610x are detailed in Table 3 along with other important
operating and storage information.
Table 3.
Operating and Storage Specifications
Temperature
Operating
10o to 35o C (50o to 95o F) with a maximum temperature gradation of
10o C per hour
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1oF/500ft
Storage
-40o to 65oC (-40o to 149oF) with a maximum temperature gradation
of 20oC per hour
Relative Humidity
Operating
20% to 80% (noncondensing) with a maximum humidity gradation of
10% per hour
Storage
5% to 95% (noncondensing) with a maximum humidity gradation of
10% per hour
Maximum Vibration
Operating
0.26 Grms at 5-350 Hz in operational orientations
Storage
1.54 Grms at 10-250 Hz in all orientations
Maximum Shock
Operating
Half sine shock in all operational orientations of 31 G +/- 5% with a
pulse duration of 2.6 ms +/- 10%
Storage
Half sine shock on all six sides of 71 G +/- 5% with a pulse duration
of 2 ms +/- 10%
Altitude
Operating
-15.2m to 3048 m (-50 to 10,000 ft)
Note: For altitudes above 2950 ft, the maximum temperature is
derated 1o F/550 ft
Storage
-16 to 10,600 m (-50 to 35,000 ft)
Airborne contaminant level
Class G1 or lower as defined by ISA-S71.04-1985 (G1 maximum corrosive contaminant levels
measured at ≤ 50% relative humidity)
5.4 Acoustics
The acoustical design of the PowerEdge M610x reflects adherence to Dell’s high sound quality
standards. Sound quality is different from sound power level and sound pressure level in that it
describes how humans respond to annoyances in sound, like whistles or hums. Definitions for
acoustical performance data are as follows:
•
•
Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other
specific activity.
LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296
(1988) and measured in accordance to ISO 7779 (1999).
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Dell
Table 4 shows the acoustical performance for a typical configuration of the M1000e chassis with four
PowerEdge M610x blade servers installed. Acoustical performance varies with hardware
configurations.
Table 4.
Acoustical Performance of M1000e Chassis with Four M610x Blades Installed
Typical Configuration (per blade) @ 23±2°C Ambient in M1000e
Chassis
Processors
Hard Drives
DIMMs
Mezzanine Cards
Two Intel®
Xeon® E5620
(80W)
Two SAS 2.5‖
146 GB (15
K)
12 4GB
DDR3
Two dual-port
GbE FC
Dell PowerEdge M610x Technical Guide
Operating
Mode
LwA-UL
(bels)
Idle
8.2
18
Dell
6 Processors
6.1 Overview
The Intel® Xeon® processor 5500 and 5600 series are designed specifically for servers and workstation
applications. These processors feature quad-core processing to maximize performance and
performance/watt for data center infrastructures and highly dense deployments. They feature Intel
Core™ micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and
operating systems and use a 1366-contact Flip-Chip Land Grid Array (FC-LGA) package that plugs into
a surface-mount socket. The Dell™ PowerEdge™ M610x provides support for up to two processors.
6.2 Features
Key features of the Intel Xeon processor 5500 series include:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Up to four cores per processor
Two point-to-point QuickPath Interconnect links at 6.4 GT/s
45 nm process technology
No termination required for non-populated CPUs (must populate CPU socket 1 first)
Integrated QuickPath DDR3 memory controller
64-byte cache line size
RISC/CISC hybrid architecture
Compatible with existing x86 code base
MMX™ support
Execute Disable Bit
Intel Wide Dynamic Execution
Executes up to four instructions per clock cycle
Simultaneous Multi-Threading (SMT) capability
Support for CPU Turbo Mode (on certain SKUs)
Increases CPU frequency if operating below thermal, power and current limits
Streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4
Intel 64 Technology
Intel VT-x and VT-d Technology for virtualization support
Enhanced Intel SpeedStep® Technology
Demand-based switching for active CPU power management as well as support for ACPI
P-States, C-States and T-States
The Intel Xeon processor 5600 series encompasses all the features of the 5500 series along with:
• New top BIN processors at 130W TDP
• Support for DDR3L, 1.35v DIMMs for even lower system power
• Support for memory sparing
• AES-NI (hardware encryption assist) for more efficient encryption for uses such as online
transactions SSL
• Intel TXT (Trusted Execution Technology) provides hardware assisted protection against
emerging software attacks
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Dell
Comparison of Processor Technology
Table 5.
Intel Xeon Processor
5400 Series
5500 Series
5600 Series
Cores
Four
Four
Six
Last Level Cache
Two 6 MB shared
8 MB shared
12 MB shared
FSB (MT/s) / Link Frequency
(GT/s)
1333 MT/s
Up to 6.4 GT/s
Up to 6.4 GT/s
Max TDP
120 W
130 W for WS
95 W for Server
130 W for WS and
Server
Max Frequency
>3 GHz
>3 GHz
>3 GHz
Memory Controller
Separate in
chipset
Integrated 3-channel
DDR3
Integrated 3channel DDR3
Process Technology
45 nm
45 nm
32 nm
Intel® Trusted Execution
Technology
No
No
Yes
Intel® Advanced Encryption
Security- New Instructions
No
No
Yes
Intel® Virtualization
Technology
Yes
Yes
Yes
Intel® 64
Yes
Yes
Yes
Intel Hyper-Threading
Technology
No
Yes
Yes
Socket
LGA771
LGA1366
LGA1366
®
6.3 Supported Processors
Supported Processors
Table 6.
Model
Speed
X5690
TDP
Max
Memory
Speed
QPI Link
Speed
Turbo
Mode
Enabled
Hyperthreading
Power
Cache
Cores
3.46 GHz
130 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5680
3.33 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5675
3.06 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5670
2.93 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5660
2.8 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
X5650
2.66 GHz
95 W
12 M
6
1333 MT/s
6.4 GT/s
Yes
Yes
L5640
2.26 GHz
60 W
12 M
6
1066 MT/s
5.86 GT/s
Yes
Yes
E5649
2.53 GHz
80 W
12 M
6
1333 MT/s
5.86 GT/s
Yes
Yes
Dell PowerEdge M610x Technical Guide
20
Dell
Model
Speed
E5645
TDP
Max
Memory
Speed
QPI Link
Speed
Turbo
Mode
Enabled
Hyperthreading
Power
Cache
Cores
2.4 GHz
80 W
12 M
6
1333 MT/s
5.86 GT/s
Yes
Yes
X5687
3.6 GHz
130 W
12 M
4
1333 MT/s
6.4 GT/s
Yes
Yes
X5677
3.46 GHz
130 W
12 M
4
1333 MT/s
6.4 GT/s
Yes
Yes
X5672
3.2 GHz
95 W
12 M
4
1333 MT/s
6.4 GT/s
Yes
Yes
X5667
3.06 GHz
95 W
12 M
4
1333 MT/s
6.4 GT/s
Yes
Yes
X5647
2.93 GHz
130 W
12 M
4
1333 MT/s
5.86 GT/s
Yes
Yes
E5640
2.66 GHz
80 W
12 M
4
1066 MT/s
5.86 GT/s
Yes
Yes
E5630
2.53 GHz
80 W
12 M
4
1066 MT/s
5.86 GT/s
Yes
Yes
E5620
2.4 GHz
80 W
12 M
4
1066 MT/s
5.86 GT/s
Yes
Yes
L5630
2.13 Ghz
40 W
12 M
4
1066 MT/s
5.86 GT/s
Yes
Yes
L5609
1.86 GHz
40 W
12 M
4
1066 MT/s
4.8 GT/s
No
No
X5560
2.8 GHz
95 W
8M
4
1333 MT/s
6.4 GT/s
Yes
Yes
E5530
2.4 GHz
80 W
8M
4
1066 MT/s
5.86 GT/s
Yes
Yes
L5520
2.26 GHz
60 W
8M
4
1066 MT/s
5.86 GT/s
Yes
Yes
E5507
2.13 GHz
80 W
4M
4
800 MT/s
4.8 GT/s
No
No
E5506
2.13 GHz
60 W
4M
4
800 MT/s
4.8 GT/s
No
No
E5503
2.0 GHz
80 W
4M
2
800 MT/s
4.8 GT/s
No
No
6.4 Processor Installation
See the Processors section in the Installing Blade Components chapter in the Dell PowerEdge Modular
Systems Hardware Owner’s Manual on Support.Dell.com/Manuals.
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7 Memory
7.1 Overview
The Dell™ PowerEdge™ M610x uses DDR3 memory providing a high-performance, high-speed memory
interface capable of low latency response and high throughput. The M610x supports Registered ECC
DDR3 DIMMs (RDIMM) as well as the low-voltage RDIMMs and Unbuffered ECC DDR3 DIMMs (UDIMM).
The DDR3 memory interface consists of three channels, with up to two RDIMMs or UDIMMs per
channel for single/dual rank and up to two RDIMMs per channel for quad rank. The interface uses 2
GB, 4 GB, or 8 GB RDIMMs. 1 GB or 2 GB UDIMMs are also supported. The memory mode is dependent
on how the memory is populated in the system:



Three channels per CPU populated identically
o Typically, the system will be set to run in Memory Optimized (Independent Channel) mode in
this configuration. This mode offers the most DIMM population flexibility and system memory
capacity, but offers the least number of RAS (reliability, availability, and serviceability)
features.
o All three channels must be populated identically.
o Memory sparing is not supported on the M610x with 5500 series processors.
The first two channels per CPU populated identically with the third channel unused
o Typically, two channels operate in Advanced ECC (Lockstep) mode with each other by having
the cache line split across both channels. This mode provides improved RAS features (SDDC
support for x8-based memory).
o For Memory Mirroring, two channels operate as mirrors of each other—write functions go to
both channels and read functions alternate between the two channels.
One channel per CPU populated (This is a simple Memory Optimized mode. No mirroring or
sparing is supported.)
The M610x memory interface supports memory demand and patrol scrubbing, single-bit correction,
and multi-bit error detection. Correction of a x4 or x8 device failure is also possible with SDDC in the
Advanced ECC mode. Additionally, correction of a x4 device failure is possible in the Memory
Optimized mode.
7.2 DIMMs Supported
The following memory requirements apply to the M610x:

If DIMMs of different speeds are mixed, all channels operate at the fastest common
frequency.

RDIMMs and UDIMMs cannot be mixed.

If memory mirroring is enabled, identical DIMMs must be installed in the same slots across
both channels. The third channel of each processor is unavailable for memory mirroring.

The first DIMM slot in each channel is color-coded with white ejection tabs for ease of
installation.

The M610x memory system supports up to 12 DIMMs. DIMMs must be installed in each channel
starting with the DIMM farthest from the processor. Population order will be identified by the
silkscreen designator and the System Information Label (SIL) located on the chassis cover.
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22
Dell
7.3 Memory Features
Key features of the Dell™ PowerEdge™ M610x memory system include:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Registered (RDIMM) and Unbuffered (UDIMM) ECC DDR3 technology
Each channel carries 64 data and eight ECC bits
Support for up to 192 GB of RDIMM memory (with twelve 16 GB RDIMMs)
Support for up to 24 GB of UDIMM memory (with twelve 2 GB UDIMMs)
Support for 1066/1333 MT/s single and dual rank DIMMs
Support for 1066 MT/s quad rank DIMMs
ODT support (On Die Termination)
Clock gating (CKE) to conserve power when DIMMs are not accessed (DIMMs enter a low-power
self-refresh mode)
I2C access to SPD EEPROM for access to RDIMM thermal sensors
Single Bit Error Correction
SDDC (Single Device Data Correction – x4 or x8 devices)
Support for Closed Loop Thermal Management on RDIMMs and UDIMMs
Multi Bit Error Detection
Support for Memory Optimized Mode
Support for Advanced ECC mode
Support for Memory Mirroring
Memory sparing is not supported on 5500 series processors. It is supported on systems using 5600
series processors. While 800 MT/s DIMMs are not supported, the installation of two quad-rank
1066 MT/s DIMMs will operate at 800 MT/s.
7.4 Speed
The memory frequency is determined by a variety of inputs:



Speed of the DIMMs
Speed supported by the CPU
Configuration of the DIMMs
For quad-rank DIMMs mixed with single- or dual-rank DIMMs, the quad-rank (QR) DIMM needs to be in
the slot with the white ejection tabs (the first DIMM slot in each channel). There is no requirement
for the order of single-rank (SR) and dual-rank (DR) DIMMs.
Table 7 shows the memory populations and the maximum frequency achievable for that
configuration.
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Dell
Table 7.
DIMM Type
UDIMM
RDIMM
Maximum Supported Memory Frequencies
DIMM 0
DIMM 1
# of DIMMs
800
1066
1333
SR
—
1



DR
—
1



SR
SR
2



SR
DR
2



DR
DR
2



SR
—
1



DR
—
1



QR
—
1



SR
SR
2



SR
DR
2



DR
DR
2



QR
SR
2



QR
DR
2



QR
QR
2



Dell PowerEdge M610x Technical Guide
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Dell
8 Chipset
8.1 Overview
The Dell™ PowerEdge™ M610x system board incorporates the Intel 5500 chipset for I/O and processor
interfacing which was designed to support Intel Xeon Processor 5500 and 5600 Series, QuickPath
Interconnect, DDR3 memory technology, and PCI Express Generation 2. The chipset consists of the
I/O Hub (IOH) and Intel I/O Controller Hub 9 (ICH9).
8.2 I/O Hub
The M610x system board uses the Intel 5520 chipset 24D I/O hub (IOH) to provide a link between the
processor(s) and I/O components. The main components of the IOH consist of two full-width
QuickPath Interconnect links (one to each processor), 24 lanes of PCI Express Gen2, a x4 Direct Media
Interface (DMI), and an integrated IOxAPIC.
8.2.1
QuickPath Interconnect
The QuickPath Interconnect (QPI) architecture consists of serial point-to-point interconnects for the
processors and the IOH. The M610x has a total of three QPI links: one link connecting the processors
and two links connecting both processors with the IOH. Each link consists of 20 lanes (full-width) in
each direction with a link speed of 6.4 GT/s. An additional lane is reserved for a forwarded clock.
Data is sent over the QPI links as packets.
The QuickPath architecture implemented in the IOH and CPUs features four layers. The Physical layer
consists of the actual connection between components. It supports Polarity Inversion and Lane
Reversal for optimizing component placement and routing. The Link layer is responsible for flow
control and the reliable transmission of data. The Routing layer is responsible for the routing of QPI
data packets. Finally, the Protocol layer is responsible for high-level protocol communications,
including the implementation of a MESIF (Modify, Exclusive, Shared, Invalid, Forward) cache
coherence protocol.
8.2.2
PCI Express
PCI Express (PCIe) is a serial point-to-point interconnect for I/O devices. PCIe Generation 2 doubles
the signaling bit rate of Generation 1 from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are
backward-compatible with Gen1 transfer rates.
The IOH 24D has 24 PCI Express lanes. The lanes are partitioned as two x2 ports and combined as a x4
PCI Express Gen2 port for the LOM1. The next port is a x4 PCI Express Gen2 port for LOM2 and the
remaining x4 ports are combined as two x8 PCI Express Gen2 ports for the mezzanine cards. These
last two x8 Gen2 ports are the entities that provide communication for the M610x functionality.
8.2.3
Direct Media Interface
The Direct Media Interface (DMI) connects the IOH with the Intel I/O Controller Hub 9 (ICH9). The
DMI is equivalent to a x4 PCIe Gen1 link with a transfer rate of 1 GB/s in each direction.
8.2.4
I/O Controller Hub 9
The I/O Controller Hub 9 (ICH9) is a highly integrated I/O controller, supporting the following
functions:
 Six x1 PCI Express Gen1 ports, with the capability of combining ports 1-4 as a x4 link (The x4 link
is routed to the storage controller card connector.)
Dell PowerEdge M610x Technical Guide
25
Dell









PCI Bus 32-bit Interface Rev 2.3 running at 33 MT/s
Serial ATA (SATA) ports with transfer rates up to 300 MB/s
Six UHCI and two EHCI (high-speed 2.0) USB host controllers, with up to 12 USB ports (The M610x
provides four of these ports for internal and external use.)
Power management interface (ACPI 3.0b compliant)
Platform Environmental Control Interface (PECI)
I/O interrupt controller
SMBus 2.0 controller
Low Pin Count (LPC) interface to Trusted Platform Module (TPM), and SPI-VU
Serial Peripheral Interface (SPI) support for up to two devices (The M610x BIOS is connected to
the ICH9 using SPI.)
8.2.5
PCI Express Mezzanine Connectors
The Planar Mezzanine connectors provide connection to the Mezzanine I/F Card.
Dell PowerEdge M610x Technical Guide
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Dell
9 BIOS
9.1 Overview
The M610x BIOS is based on the Dell BIOS core, and supports the following features:

















Intel Xeon processor 5500 and 5600 series 2S support
Simultaneous Multi-Threading (SMT) support
CPU Turbo Mode support
PCI 2.3 compliant
Plug and play 1.0a compliant
MP (Multiprocessor) 1.4 compliant
Boot from hard drive, optical drive, iSCSI drive, USB key, and SD card
ACPI support
Direct Media Interface (DMI) support
PXE, ISCSI, and WOL support for on-board NIC
Memory mirroring
SETUP access through F2 key at end of POST
USB 2.0 (USB boot code is 1.1 compliant)
F1/F2 error logging in CMOS
Virtual KVM, CD, and floppy support
Unified Server Configurator (UEFI 2.1) support
Power management support including DBS, Power Inventory and multiple Power Profiles
9.2 Supported ACPI States
The M610x supports the standard Advanced Configuration and Power Interface (ACPI) states.
To learn more see http://www.acpi.info/.
Dell PowerEdge M610x Technical Guide
27
Dell
10 Embedded NICs/LAN on Motherboard
Two embedded Broadcom® 5709S dual-port LAN controllers are on the Dell™ PowerEdge™ M610x
planar as independent Gigabit Ethernet interface devices. The following information details the
features of the LAN devices:
•
•
•
•
•
•
•
•
•
•
•
•
•
x4 PCI Express Gen2 capable interface
The M610 operates this controller at Gen1 speed
Integrated MAC and PHY
3072x18 Byte context memory
64 KB receive buffer
TOE (TCP Offload Engine)
NC-SI (Network Controller-Sideband Interface) connection for manageability
Wake-On-LAN (WOL)
PXE 2.0 remote boot
iSCSI boot
IPv4 and IPv6 support
Bare metal deployment support
ISCSI offload accelerator: used for offloading ISCSI traffic as an ISCSI accelerator/HBA –
Optionally enabled through a hardware key
The embedded NICs are not sharable with iDRAC since the blade iDRAC has a dedicated 100Mbps link
(Fabric D).
Dell PowerEdge M610x Technical Guide
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Dell
11 I/O Mezzanine Card Options
11.1.1
Overview
The M610x contains two PCIe Gen2 mezzanine slots. Installation of mezzanine cards requires an
M1000e I/O Module (IOM) of the same fabric technology to be installed in the corresponding fabric
slot of the mezzanine to support data flow through that fabric/slot.
For more information, refer to the PowerEdge M1000e Technical Guide.
11.1.2
Options
Available options include:











Broadcom Dual-Port 5709
Broadcom Quad-Port 5709
Intel® ET Quad-Port 82576
Broadcom Dual-Port 57711
Intel Ethernet X520 10GbE x/k
QLogic® CNA QME8142
Emulex® CNA OCM10102FM
QLogic QME2572 (FC8)
Emulex LPe1205 (FC8)
Mellanox® ConnectX®-2 DDR IB (SFF)
Mellanox ConnectX-2 QDR IB (SFF)
11.1.3
PCIe Card Support
The following cards are supported:
 Dell cards
– H800 controller
– 6GB SAS controller
 Fusion-io® cards (drop in the box)
– Fusion-io 160GB ioDrive PCIe solid state storage card
– Fusion-io 320GB ioDrive PCIe solid state storage card
– Fusion-io 640GB ioDrive PCIe solid state storage card
– Fusion-io 640GB ioDrive Duo PCIe solid state storage card
– Fusion-io 1.28TB ioDrive Duo PCIe solid state storage card
 NVIDIA® cards (cards installed, drivers available on NVIDIA site)
– Tesla™ M2050–204 448 core, double-width card with 3GB of memory
– Tesla M2070/M2070Q 448 core, double-width card with 6GB of memory

AMD FirePro™ V7800P 1,440 core, single-width card with 2GB of memory
11.1.4
GPGPU Cards
General-Purpose computation on Graphics Processing Units (GPGPU) are high-performance manycore processors that can be used to accelerate a wide range of applications. General-purpose
acceleration provides performance boosts for many applications in energy exploration, science, and
financial services and is commonly found in a high-performance computing (HPC) environment.
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Dell
11.1.5
Fusion-io Cards
Fusion-io’s family of products is based on a new solid state technology that increases bandwidth and
application performance, reduces latency, and simplifies IT infrastructure. Fusion-io products:
 Integrate with servers at the system bus and kernel level, creating a new Flash memory tier
 Accelerate applications, improves response times, and boosts efficiency
 Reduce storage latencies and eliminates I/O bottlenecks
 Deliver the performance of thousands of disk drives in a single server
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Dell
12 Storage
12.1 Overview
All enterprise-class 2.5‖ storage drives sold by Dell are qualified, including those that offer Self
Encrypting Drive functionality as well as the 6 Gb SAS drives. All storage drives used with the PERC
H700 must be purchased from Dell.
12.2 Hard Disk Drive Carriers
The Dell™ PowerEdge™ M610x supports the 11G 2.5‖ hard drive carrier.
Figure 3.
2.5” HDD Carrier
12.3 Empty Drive Bays
For the slots that are not occupied by drives, a carrier blank is provided to maintain proper cooling,
maintain a uniform appearance to the unit, and provide EMI shielding.
12.4 Diskless Configuration Support
The system supports diskless configuration with no storage controller (H200/PERC 7i) installed in the
system. A 2.5‖ hard drive backplane is installed in this configuration.
12.5 Hard Drive LED Indicators
Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (Green/Amber) LED for status information. The activity
LED is driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP
device on the backplane. Both LEDs are used to indicate certain conditions under direction of a
storage controller.
12.6 Optical Drives
Optical drives are optional in all M610x systems and connect to the blade through the front USB
interface. The following internal slim-line drives are available on the M610x: DVD-ROM and DVD+RW.
PATA (IDE) optical drives are not supported.
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12.7 RAID Cards
The M610x will support a variety of RAID cards.
12.7.1
SATA Repeater
The PE M610x internal SATA Repeater HBA is an expansion card that plugs into the dedicated storage
controller slot. It is connected to the ICH9 SATA port via that slot for support of one SATA 2.5‖ hard
drive. The SATA drives are NOT hot pluggable.
12.7.2
PERC6/i
For customers who want a hardware RAID solution, the PERC6i is an option, as a customer kit. The
PERC6i uses the LSI 1078 ROC (RAID on Chip) processor with a PCI Express host interface and DDR2
memory. A battery is available with this card. For details of this card, see the PERC6 Hardware
Product Specification.
12.7.3
H200
The M610x supports the latest SAS solution called H200.
12.7.4
H700 and H800
The M610x supports the latest PERC solutions: the H700 and H800. Details of the PERC H700M can be
found in the PERC H700 and H800 Technical Guidebook. Both offer a battery-backed cache.
12.8 LED Indicators
Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED
is driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP device
on the backplane. Both LEDs are used to indicate certain conditions under direction of a storage
controller.
12.9 Optical Drives
Optical drives are optional in all M610x systems and connect to the blade through the front USB
interface. The following internal slim-line drives are available on M610x: DVD-ROM and DVD+RW.
PATA (IDE) optical drives are not supported.
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13 Video
The Dell™ PowerEdge™ M610x Integrated Dell Remote Access Controller 6 (iDRAC6) incorporates an
integrated video subsystem, connected to the 32-bit PCI interface of the ICH9. This logic is based on
the Matrox® G200 with 8 MB of cache. The device only supports 2D graphics.
The M610 system supports the 2D graphics video modes listed in Table 8.
Supported Video Modes
Table 8.
Resolution
Refresh Rate (Hz)
Color Depth (bit)
640 x 480
60, 72, 75, 85
8, 16, 32
800 x 600
56, 60, 72, 75, 85
8, 16, 32
1024 x 768
60, 72, 75, 85
8, 16, 32
1152 x 864
75
8, 16, 32
1280 x 1024
60, 75, 85
8, 16
1280 x 1024
60
32
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14 Rack Information
For information on rack and cable accessories for the Dell™ PowerEdge™ M610x, see the PowerEdge
M1000e Technical Guide and the M1000e Rack and Cable Advisor Tool.
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15 Operating Systems
The Dell™ PowerEdge™ M610x is designed to meet the MSFT WinLogo 3.0 design specifications. For
the most up-to-date information, see the Operating System Support Matrix for Dell PowerEdge
Systems on Dell.com.
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16 Virtualization
16.1 Resources
The Dell™ Support site has extensive information designed to help you configure virtualization
software with PowerEdge servers. For more information, visit the following sites:



Dell Virtualization Solution Advisor: Advisement for configuring a complete virtualization
solution.
Supported virtualization platforms: Detailed listing of virtualization platforms supported by
Dell OpenManage™.
Support.dell.com: Other blade-related virtualization documents.
For information about which versions of VMware software have been certified on this server, see the
compatibility list maintained by VMware.
It is possible to order the server with an SD card that does not contain ESXi.
16.2 Advanced Infrastructure Manager by Scalent
Dell Advanced Infrastructure Manager (AIM) allows IT organizations to manage networking, storage,
and servers (as well as server workloads) that can be dynamically reconfigured and deployed to meet
the changing needs of today’s data center environment. Specifically, AIM provides IT professionals
the ability to:
•
Combine new and existing networking, storage devices, and servers into a holistic computing
solution that enables dynamic allocation of resources to meet application workload
requirements.
• Manage physical and virtual resources with a single solution that includes the ability to move
workloads seamlessly across hardware platforms for increased availability and scalability.
• Provide virtualization-like functionality to non-virtual (physical) servers, including automated
failover, dynamic load balancing, and business continuity.
• Integrate existing infrastructure (networking, storage devices, and servers) into an AIM
solution to provide investment protection and extend the useful life of existing data center
assets.
• Significantly decrease the amount of time and people required to deploy hardware and get
applications up and running by providing a repeatable, scalable framework for hardware
implementation using AIM.
More information can be found at Dell.com/AIM.
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17 Systems Management
17.1 Overview
Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of
managing disparate IT assets. Combining Dell™ PowerEdge™ servers with a wide selection of Dell
developed systems management solutions gives you choice and flexibility, so you can simplify and
save in IT environments of any size. To help you meet your server management demands, Dell offers
Dell OpenManage™ systems management solutions for:
•
•
•
Deployment of one or many servers from a single console
Monitoring of server and storage health and maintenance
Update of system, operating system, and application software
Dell offers IT management solutions for organizations of all sizes—priced and sized appropriately, and
supported comprehensively.
17.2 Server Management
A Dell Systems Management and Documentation DVD, Dell Management Console DVD, and ISO images
are included with the product. See Table 9 for a description of the available content.
Table 9.
Server Management Documentation and Information
Title
Description
Dell Systems Build and Update
Utility (SBUU)
Assists in OS install and pre-OS hardware configuration and
updates.
Server Update Utility (SUU)
Provides an inventory tool for managing updates to firmware,
BIOS, and drivers for either Linux or Windows varieties.
OpenManage Server
Administrator (OMSA)
Provides a comprehensive, one-to-one (one console to one
server) systems management solution, designed for system
administrators to manage systems locally and remotely over a
network. OMSA allows system administrators to focus on
managing their entire network by providing comprehensive
one-to-one systems management.
Management Console
Dell IT Assistant (ITA) is also included, as well as tools to allow
access to our remote management products. These tools are
Remote Access Service for iDRAC and the Baseboard
Management Controller (BMC) Utility.
Active Directory Snap-in Utility
Provides an extension snap-in to the Microsoft Active
Directory. This allows you to manage Dell specific Active
Directory objects. The Dell-specific schema class definitions
and their installation are also included on the DVD.
Dell Systems Service Diagnostics
Tools
Deliver the latest Dell optimized drivers, utilities, and
operating system-based diagnostics that you can use to update
your system.
eDocs
Includes PDF files for PowerEdge systems, storage peripherals,
and Dell OpenManage™ software.
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Title
Description
Dell Management Console (DMC)
Provides a systems management console that enables systems
administrators to discover and inventory devices on your
network. It provides functions such as health and performance
monitoring of networked devices and patch management
capabilities for Dell systems. DMC differs from the IT Assistant
management console (described above) in that with DMC,
value-add plug-ins that enable advanced functionality can be
purchased and added to the base DMC product.
17.3 Embedded Server Management
The PowerEdge M610x implements circuitry for the next generation of Embedded Server
Management. It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The optional
iDRAC (Integrated Dell Remote Access Controller) is responsible for acting as an interface between
the host system and its management software and the periphery devices.
The optional upgrade to iDRAC6 provides features for managing the server remotely or in data center
lights-out environments.
Advanced iDRAC features require the installation of the optional iDRAC6 Enterprise card.
17.4 Lifecycle Controller and Unified Server Configurator
Embedded management is comprised of interdependent pieces:
•
•
•
Dell Lifecycle Controller
Unified Server Configurator
iDRAC6
Dell Lifecycle Controller powers the embedded management features. It includes integrated and
tamper-proof storage for system-management tools and enablement utilities (firmware, drivers,
etc.). Lifecycle Controller enables pre-OS server deployment, OS installation, platform updates,
platform configuration, and diagnostics capabilities.
Dell Unified Server Configurator (USC) is a graphical user interface (GUI) that aids in local server
provisioning in a pre-OS environment. To access the Unified Server Configurator, press the <F10> key
within 10 seconds of the Dell logo appearance during the system boot process. Table 10 details
current functionality enabled by the USC.
Table 10.
Unified Server Configurator Features and Description
Feature
Description
Faster O/S Installation
Drivers and the installation utility are embedded on system, so no
need to scour Dell.com.
Faster System Updates
Integration with Dell support automatically directed to latest
versions of the Unified Server Configurator, iDRAC, RAID, BIOS, NIC,
and power supply.
Update Rollback
Ability to recover to previous ―known good state‖ for all updatable
components.
More Comprehensive Diagnostics
Diagnostic utilities are embedded on system.
Simplified Hardware Configuration
Detects RAID controller and allows user to configure virtual disk and
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Feature
Description
choose virtual disk as boot device, eliminating the need to launch a
separate utility. Also provides configuration for iDRAC, BIOS, and
NIC/LOM.
17.5 Integrated Dell Remote Access Controller
The integrated Dell Remote Access Controller (iDRAC6) provides IT Administrators comprehensive yet
straightforward management of remote servers, by delivering ―as if you are there‖ presence and
control. iDRAC6 helps users to save time and money by eliminating travel to the remote server(s),
whether that server is located in a different room, a different building, a different city, or in a
different country.
iDRAC6 Enterprise is a standard feature on the M610x, and Virtual Flash (vFlash) media is a
purchasable option.
17.6 iDRAC6 Enterprise
The iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6 Enterprise
connects directly to the M610x planar and is mounted parallel to the planar with stand-offs.
Key features for the iDRAC6 Enterprise include:
•
•
•
•
Scripting capability with Dell’s Racadm command-line
Remote video, keyboard, and mouse control with Virtual Console
Remote media access with Virtual Media
Dedicated network interface
17.7 iDRAC6 Enterprise with Virtual Flash (vFlash) Media
The iDRAC6 Enterprise can be upgraded by adding the vFlash media card. This is an 8 GB Dellbranded SD card that enables a persistent 256 MB virtual flash partition. The vFlash media delivers
the following key features:



Support for 8 GB SD storage media
Can be used as a repository for a pre-OS image, eliminating the need to maintain a network
infrastructure for OS deployment
Can also be used for permanent diagnostics image for use after system failures, or permanent
failsafe image for periodic configuration changes
A more detailed feature list for base management functionality, iDRAC6 Enterprise, and vFlash media
is shown in Table 11.
Table 11.
Features List for Base Management Functionality, iDRAC, and vFlash Media
Feature
Base Management
Functionality
iDRAC6 Enterprise
vFlash Media
Interface and Standards Support
IPMI 2.0
Web-based GUI
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Feature
Base Management
Functionality
iDRAC6 Enterprise
vFlash Media
SNMP


WSMAN


SMASH-CLP


Racadm command-line


Conductivity
Shared/Failover Network Modes



IPv4



VLAN Tagging



IPv6


Dynamic DNS


Dedicated NIC


Security and Authentication
Role-based Authority



Local Users



Active Directory


SSL Encryption


Remote Management and Remediation
Remote Firmware Update



Server power control



Serial-over-LAN (with proxy)



Serial-over-LAN (no proxy)


Power capping


Last crash screen capture


Boot capture


Serial-over-LAN


Virtual media


Virtual console


Virtual console sharing



Virtual flash
Monitoring


Real-time Power Monitoring


Real-time Power Graphing


Historical Power Counters


Sensor Monitoring and Alerting
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Feature
Base Management
Functionality
iDRAC6 Enterprise
vFlash Media
Logging Features


RAC Log


Trace Log


System Event Log

17.8 Chassis Management Controller (CMC)
See the PowerEdge M1000e Technical Guide.
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18 Peripherals
18.1 USB Peripherals
The Dell™ PowerEdge™ M610x supports the following USB devices:
• DVD (bootable; requires two USB ports)
• USB Key (bootable)
• Keyboard (only one USB keyboard is supported)
• Mouse (only one USB mouse is supported)
18.2 External Storage
By use of the appropriate IOMs in the M1000e chassis and mezzanine card(s) in the M610x blade, the
following external storage options are available:


Disk Storage Options:
o Dell EqualLogic™ PS5000 Series
o PowerVault™ NX1950 Unified Storage Solution
o PowerVault MD3000i
Dell/EMC fibre channel and/or iSCSI external storage, including:
o CX300
o CX3-10c
o CX3-20
o CX3-40
o CX3-80
o CX4-120
o CX4-240
o CX4-480
o CX4-960
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Appendix A.
Statement of Volatility
The Dell™ PowerEdge™ M610x blade and its configurable modules contain both volatile and nonvolatile (NV) components. Volatile components lose their data immediately upon removal of power
from the component. Non-volatile components continue to retain their data even after the power has
been removed from the component. Dell PowerEdge blades may contain hard disk drives that retain
customer data after the system is powered off. Data should be removed from these hard disk drives
using locally approved methods before they are removed from a secured environment.
Table 12.
PowerEdge M610x Statement of Volatility
Server BIOS Memory
Details
Size
4 MB
Type
SPI Flash
Purpose
There is boot code and application code. The
code is vital to the system booting to the OS.
Contains the BIOS code.
Can user programs or operating system write
data to it during normal operation?
No
How is data input to this memory?
Flashed in the factory or using Dell flash utility
How is this memory write protected?
Software write protected
System FRU
Details
Size
256 Kb
Type
Serial I2C EEPROM, nonvolatile
Purpose
This chip stores some system configuration
information (system type, board PPID information,
etc.)
Can user programs or operating system write
data to it during normal operation?
Yes; a user can enter a username and password
which will be stored in the chip
How is data input to this memory?
I2C bus from the iDRAC6
How is this memory write protected?
Only the iDRAC6 can write to the chip
Server CMOS (Complementary Metal-Oxide
Semiconductor) Memory
Details
Size
256 bytes
Type
CMOS
Purpose
BIOS configurations
Can user programs or operating system write
data to it during normal operation?
Using BIOS setup
How is data input to this memory?
BIOS defaults, BIOS setup
How is this memory write protected?
NA
Remarks
RTC is inside ICH9; jumper on motherboard can be
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used to reset to factory default settings
Server LOM Memory
Details
Size
4 Mb (1 MB)
Type
Flash
Purpose
Contains LOM boot code and config data
Can user programs or operating system write
data to it during normal operation?
Yes, under software control
How is data input to this memory?
Requires vendor provided firmware file and loader
program used during factory assembly or possible
field update; a system loaded with arbitrary data
in firmware memory would not operate
How is this memory write protected?
Software control
Broadcom Integrated LOM Hardware License
Key (optional)
Details
Size
256 bytes (dual port)
Type
Serial Flash
Purpose
TOE + iSCSI Offload Licensing
Can user programs or operating system write
data to it during normal operation?
No
Does it retain data when powered off?
Yes
How is data input to this memory?
Serial write-through external interface during
factory process
How is this memory write protected?
None
Server Video Memory
Details
Size
64 M x16
Type
DDR2 SDRAM
Purpose
Graphics Buffer
Can user programs or operating system write
data to it during normal operation?
Yes
How is data input to this memory?
Normal Operation
How is this memory write protected?
No
CPLD
Details
Size
2280 logic elements; 7.5 Kbits RAM;
27.6 Kbits EBR SRAM
Type
Programmable Logic Device
Purpose
Provide blade power sequencing and other blade
control logic
Can user programs or operating system write
data to it during normal operation?
Yes; customer can use DOS program to update
CPLD image
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How is data input to this memory?
By way of specialized programming utilities used
in the factory and possibly for field updates
How is this memory write protected?
Software control
HDD Backplane Firmware (SEP) Memory
Details
Size
32 KB
Type
Flash
Purpose
Interface between the RAID controller and the
hard drives as well as a controller for the HDD
status LED
Can user programs or operating system write
data to it during normal operation?
No; a special (not available to customers) DOS
utility is needed to flash the application code,
and the boot block is cable flashed only
How is data input to this memory?
Cable flash to flash entire chip or a special utility
(not available to customers) to flash in DOS
How is this memory write protected?
Software write protected; no hardware protection
pin
iDRAC6 Enterprise SPI Flash
Details
Size
2MB
Type
SPI Flash
Purpose
There is boot code that is used by the iDRAC6
Enterprise management controller. Also contains
the Life Cycle Log which contains server
management data unique to the run-time events
of the server itself.
Can user programs or operating system write
data to it during normal operation?
No
How is data input to this memory?
Flashed in the factory or using Dell flash utility.
Also written to by the iDRAC6 Enterprise
controller to make Life Cycle Log (LCL) entries.
How is this memory write protected?
Software write protected
TPM (for boards shipped outside of China;
boards sold to destinations in China do not
have TPM at this time)
Details
Size
Unspecified size of user ROM, RAM, EEPROM;
128 bytes of OTP memory included
Type
ROM, RAM, EEPROM
Purpose
Trusted Platform Module NV storage; may be used
to securely store user data
Can user programs or operating system write
data to it during normal operation?
Yes, OSes and applications that conform to the
TCG standard can write data to the TPM during
normal operation; access to the NV Storage is
controlled by the TPM owner
How is data input to this memory?
TCG TPM Specification defined command
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interface
How is this memory write protected?
As defined by the TCG TPM Specification,
protection of this NV memory area is configurable
by the TPM owner
iDRAC6 Enterprise Card FRU
Details
Size
2 KB (256 bytes)
Type
Serial I2C EEPROM, nonvolatile
Purpose
This chip stores some system configuration
information (system type, board PPID information,
etc.)
Can user programs or operating system write
data to it during normal operation?
No; a special (not available to customers) DOS
utility is needed to flash the application code
How is data input to this memory?
I2C bus from the iDRAC
How is this memory write protected?
Only the iDRAC can write to the chip
iDRAC6 Enterprise Card eMMC
Details
Size
1 GB
Type
NAND Flash
Purpose
Stores the iDRAC6 kernel and other data for
system management
Can user programs or operating system write
data to it during normal operation?
Yes, under software control
How is data input to this memory?
I2C bus from the iDRAC
How is this memory write protected?
Only the iDRAC can write to the chip
EDID FRU
Details
Size
2 Kb (256 bytes)
Type
Serial I2C EEPROM, nonvolatile
Purpose
Stores active video disply information
Can user programs or operating system write
data to it during normal operation?
No
How is data input to this memory?
I2C bus from iDRAC6
How is this memory write protected?
Only the iDRAC can write to the chip to support
its integrated video
Mezzanine Interface Card FRU
Details
Size
2 Kb (256 bytes)
Type
Serial I2C EEPROM, nonvolatile
Purpose
Stores system configuration information (system
type, board PPID information, etc.)
Can user programs or operating system write
data to it during normal operation?
No; a special (not available to customers) DOS
utility is needed to flash the application code
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How is data input to this memory?
I2C bus from iDRAC6
How is this memory write protected?
Only the iDRAC6 can write to the chip
PCIe Riser Card FRU
Details
Size
2 Kb (265 bytes)
Type
Serial I2C EEPROM, nonvolatile
Purpose
Stores system configuration information (system
type, board PPID information, etc.)
Can user programs or operating system write
data to it during normal operation?
No; a special (not available to customers) DOS
utility is needed to flash the application code
How is data input to this memory?
I2C bus from iDRAC6
How is this memory write protected?
Only the iDRAC6 can write to the chip
PCIe Riser Card SPI EEPROM
Details
Size
128 KB
Type
Serial I2C EEPROM, nonvolatile
Purpose
Stores system configuration information used by
the PCIe switch
Can user programs or operating system write
data to it during normal operation?
Yes; a special DOS utility (potentially available to
customers) is needed to flash the application code
How is data input to this memory?
Dedicated interface to the PCIe switch
How is this memory write protected?
Only the PCIe can write to the chip
Midplane Interface Card FRU
Details
Size
2 Kb (256 bytes)
Type
Serial I2C EEPROM, nonvolatile
Purpose
Stores system configuration information (system
type, board PPID information, etc.)
Can user programs or operating system write
data to it during normal operation?
No; a special (not available to customers) DOS
utility is needed to flash the application code
How is data input to this memory?
I2C bus from iDRAC6
How is this memory write protected?
Only the iDRAC can write to the chip
Extended CPLD
Details
Size
1200 logic elements; 6.25 Kb RAM; 9 Kb EBR SRAM
Type
Programmable Logic Device
Purpose
Provide blade power sequencing and other blade
control logic
Can user programs or operating system write
data to it during normal operation?
Yes; customer can use DOS program to update
CPLD image
How is data input to this memory?
By way of specializing programming utilities used
in the factory and possibly for field updates
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How is this memory write protected?
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Appendix B.
Certifications
B 1. Regulatory Certifications
Regulatory compliance certificates can be located at the following sites:

http://www.dell.com/content/topics/global.aspx/about_dell/values/regulatory_compliance
/dec_conform?c=us&l=en&s=corp
B 2. Product Safety Certifications
The product has been certified and bears the Mark, as applicable, of the Product Safety authorities
as indicated in Table 13.
Table 13.
Product Safety Certifications
Country/Region
Authority or Mark
Argentina
IRAM
Belarus
BELLIS
Canada
SCC
China
CNCA or CCC
Croatia
KONCAR
European Union
CE
Germany
TUV
IECEE
IECEE CB
Israel
SII
Kazakhstan
OTAN – CKT
Kenya
KEBS
Kuwait
KUCAS
Mexico
NYCE or NOM
Moldova
INSM
Nigeria
SONCAP
Norway
NEMKO
Russia
GOST
Saudi Arabia
KSA ICCP
South Africa
NRCS
Taiwan
BSMI
Ukraine
UKRTEST or
UKRSERTCOMPUTER
United States
NRTL
Uzbekistan
STZ
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B 3.
Electromagnetic Compatibility
The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated
in Table 14.
Electromagnetic Compatibility Certifications
Table 14.
Country/Region
Authority or Mark
Class
Australia/New
Zealand
ACMA or C-Tick
Belarus
BELLIS
Bosnia &
Herzegovina,
Montenegro, Serbia
KVALITET
Canada
ICES
Class A
China
CNCA or CCC
Class A
Croatia
KONCAR
Class A
European Union
CE
Class A
Israel
SII
Class A
Japan
VCCI
Class A
Kazakhstan
OTAN – CKT
Class A
Moldova
INSM
Class A
Norway
NEMKO
Class A
Russia
GOST
Class A
South Africa
SABS
Class A
South Korea
KCC
Class A
Taiwan
BSMI
Class A
Ukraine
UKRTEST or UKRSERTCOMPUTER
Class A
United States
FCC
Class A
Uzbekistan
STZ
Class A
Vietnam
ICT
Class A
Class A
Class A
Class A
B 4. Ergonomics, Acoustics and Hygienics
The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics and
Hygienics authorities as indicated in Table 15.
Table 15.
Ergonomics, Acoustics and Hygienics
Country/Region
Authority or Mark
Belarus
BELLIS
Germany
GS
Russia
GOST
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Appendix C.
Industry Standards
The Dell™ PowerEdge™ M610x conforms to the industry standards shown in Table 16.
Table 16.
Industry Standards
Standard
URL for Information and Specifications
ACPI
Advance Configuration and
Power Interface Specification,
v2.0c
http://www.acpi.info/
Energy Star
EPA Version 1.0 of the
Computer Server specification
http://www.energystar.gov/index.cfm?c=archives.enterprise
_servers
Ethernet
IEEE 802.3-2005
http://standards.ieee.org/getieee802/802.3.html
IPMI
Intelligent Platform
Management Interface, v2.0
http://www.intel.com/design/servers/ipmi/
DDR3 Memory
DDR3 SDRAM Specification,
Rev. 3A
http://www.jedec.org/download/search/JESD79-3A.pdf
LPC
Low Pin Count Interface
Specification, Rev. 1.1
http://developer.intel.com/design/chipsets/industry/lpc.ht
m
PCI Express
PCI Express Base Specification
Rev. 2.0
http://www.pcisig.com/specifications/pciexpress/
PMBus
Power System Management
Protocol Specification, v1.1
http://pmbus.info/specs.html
SAS
Serial Attached SCSI, v1.1
http://www.t10.org/cgi-bin/ac.pl?t=f&f=sas1r10.pdf
SATA
Serial ATA Rev. 2.6;
SATA II, Extensions to SATA
1.0a, Rev. 1.2
http://sata-io.org/
SMBIOS
System Management BIOS
Reference Specification, v2.6
http://www.dmtf.org/standards/smbios/
TPM
Trusted Platform Module
Specification, v1.2
http://www.trustedcomputinggroup.org/resources/tpm_mai
n_specification
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Dell
Standard
URL for Information and Specifications
UEFI
Unified Extensible Firmware
Interface Specification, v2.1
http://www.uefi.org/specs/
USB
Universal Serial Bus
Specification, Rev. 2.0
http://www.usb.org/developers/docs/
Microsoft® Windows® Logo
Windows Logo Program System
and Device Requirements,
v3.10
http://www.microsoft.com/whdc/winlogo/hwrequirements.
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