Samsung DVD-611/ 511 Service manual

DVD PLAYER
DVD-611/611B/615
DVD-511
SERVICE MANUAL
SERVICE
DVD-611/611B/615/511
ELECTRONICS
Manual
DVD PLAYER
CONTENTS
1. Precautions
2. Reference Information
3. Product Specification
4. Disassembly and Reassembly
OPEN/CLOSE
5. Circuit Descriptions
DIGITAL VIDEO
DIGITAL VIDEO
STANDBY/ON
PLAY/PAUSE
STOP
SKIP
OPEN/
CLOSE
6. Troubleshooting
DVD-611/611B/615
7. Exploded Views and Parts List
8. Electrical Parts List
9. Block Diagrams
10. PCB Diagrams
11. Wiring Diagram
OPEN/CLOSE
STANDBY/ON
PLAY/PAUSE
STOP
SKIP
OPEN/
CLOSE
12. Schematic Diagrams
DVD-511
© Samsung Electronics Co., Ltd. APR. 2000
Printed in Korea
AH68-00462A
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,
always make a safety check of the entire instrument,
including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(1)Protective shields are provided to protect both
the technician and the customer. Correctly replace
all missing protective shields, including any
remove for servicing convenience.
(2)When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place
all protective devices, including, but not limited to,
nonmetallic control knobs, insulating fish papers,
adjustment and compartment covers/shields, and
isolation resistor/capacitor networks. Do not operate this instrument or permit it to be operated without all protective devices correctly installed and
functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert
their fingers and contact a hazardous voltage. Such
openings include, but are not limited to, excessively wide cabinet ventilation slots, and an improperly fitted and/or incorrectly secured cabinet back
cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use a isolation transformer during this test.) Use a leakage
current tester or a metering system that complies
with American National Standards institute (ANSI)
C101.1 Leakage Current for Appliances and
Underwriters Laboratories (UL) 1270 (40.7). With
the instrument’s AC switch first in the ON position
and then in the OFF position, measure from a
known earth ground (metal water pipe, conduit,
etc.) to all exposed metal parts of the instrument
(antennas, handle brackets, metal cabinets, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the outlet and repeat the test. See Fig. 1-1.
Any measurements not within the limits specified
herein indicate a potential shock hazard that must
be eliminated before returning the instrument to
the customer.
(READING SHOULD
NOT BE ABOVE
0.5mA)
LEAKAGE
CURRENT
TESTER
DEVICE
UNDER
TEST
TEST ALL
EXPOSED METER
SURFACES
2-WIRE CORD
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)
EARTH
GROUND
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire
between the two prongs of the plug. (2) Turn on the
power switch of the instrument. (3) Measure the
resistance with an ohmmeter between the
jumpered AC plug and all exposed metallic cabinet
parts on the instrument, such as screwheads,
antenna, control shafts, handle brackets, etc. When
an exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2
megohm. When there is no return path to the chassis, the reading must be infinite. If the reading is
not within the limits specified, there is the possibility of a shock hazard, and the instrument must be
re-pared and rechecked before it is returned to the
customer. See Fig. 1-2.
Antenna
Terminal
Exposed
Melal Part
ohm
ohmmeter
Fig. 1-2 Insulation Resistance Test
Samsung Electronics
1-1
Precautions
2) Read and comply with all caution and safety related notes non or inside the cabinet, or on the chassis.
3) Design Alteration Warning-Do not alter of add to
the mechanical or electrical design of this instrument. Design alterations and additions, including
but not limited to, circuit modifications and the
addition of items such as auxiliary audio output
connections, might alter the safety characteristics of
this instrument and create a hazard to the user. Any
design alterations or additions will make you, the
service, responsible for personal injury or property
damage resulting therefrom.
4) Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot parts (be
sure that leads and components do not touch thermally hot parts), (3) the AC supply, (4) high voltage,
and (5) antenna wiring. Always inspect in all areas
for pinched, out-of-place, or frayed wiring, Do not
change spacing between a component and the
printed-circuit board. Check the AC power cord for
damage.
1-2
5) Components, parts, and/or wiring that appear to
have overheated or that are otherwise damaged
should be replaced with components, parts and/ or
wiring that meet original specifications.
Additionally, determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechanical parts have special safety-related characteristics
which are often not evident from visual inspection,
nor can the protection they give necessarily be
obtained by replacing them with components rated
for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by shading,
an (
)or a (
)on schematics and parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might created shock, fire and/or
other hazards. Product safety is under review continuously and new instructions are issued whenever appropriate.
Samsung Electronics
Precautions
1-2 Servicing Precautions
CAUTION : Before servicing Instruments covered
by this service manual and its supplements, read and
follow the Safety Precautions section of this manual.
Note : If unforseen circument create conflict between
the following servicing precautions and any of the
safety precautions, always follow the safety precautions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic capacitor in the instrument.
b. Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this
service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly installed.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before connecting the test instrument positive lead. Always
remove the test instrument ground lead last.
(4) An insulation tube or tape is sometimes used and
some components are raised above the printed
wiring board for safety. The internal wiring is
sometimes clamped to prevent contact with heating components. Install such elements as they
were.
(5) After servicing, always check that the removed
screws, components, and wiring have been installed correctly and that the portion around the
serviced part has not been damaged and so on.
Further, check the insulation between the blades of
the attachment plug and accessible conductive
parts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment
plug. The insulation resistance between each blade of
the attachment plug and accessible conductive
parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal panels, input terminals, earphone jacks, etc.
Note : Refer to the Safety Precautions section ground
lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength.
When replacing components, use components
which have the same ratings. Components i-entified by shading, by( ) or by ( ) in the circuit diagram are important for safety or for the characteristics of the unit. Always replace them with the exact
replacement components.
Samsung Electronics
1-3
Precautions
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD
devices are integrated circuits and some field-effect
transistors and semiconductor chip components. The
following techniques should be used to help reduce
the incidence of component damage caused by static
electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by
touching a known earth ground. Alternatively,
obtain and wear a commercially available discharging wrist strap device, which should be
removed for potential shock reasons prior to applying power to the unit under test.
(7) Immediately before removing the protective materials from the leads of a replacement ESD device,
touch the protective material to the chassis or circuit assembly into which the device will be
installed.
CAUTION : Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
(8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your
clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ESD device).
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as
“anti-static” can generate electrical charges sufficient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage
ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive materials).
1-4
Samsung Electronics
Precautions
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer electrostatic breakdown because of potential static electricity from clothing and your body.
WRIST-STRAP
FOR GROUNDING
1M
The following method is recommended.
(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static
sources to touch the unit.
THE UNIT
1M
CONDUCTIVE SHEET
Fig.1-3
(6) Short the short terminal on the PCB, which is inside the Pick-Up ASS’Y, before replacing the PickUp. (The short terminal is shorted when the PickUp Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short terminal on the PCB.
Be sure to put on a wrist strap grounded to the
sheet.
Be sure to lay a conductive sheet made of copper etc.
Which is grounded to the table.
Samsung Electronics
1-5
Precautions
1-5 Pick-up disassembly and reassembly
1-5-1 Disassembly
1-5-2 Assembly
1) Remove the power cable.
2) Switch SW3 on deck PCB to “OFF” before
removing the FPC.
( Inserted into Main PCB DCN1. See Fig. 1-4)
3) Disassemble the deck.
4) Disassemble the deck PCB.
1) Replace the Pick-up.
2) Assemble the deck PCB.
3) Reassemble the deck.
4) Insert FPC into Main PCB DCN1 and switch SW3 on
deck PCB to “ON”. (See Fig 1-4)
Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.
FPC
TO MAIN PCB
(DCN1)
Fig. 1-4
1-6
Samsung Electronics
2. Reference Information
2-1 IC Descriptions
2-1-1 AIC1 (AK4393 ; Digital-to-Analog Converter)
Left Channel
De-emphasis
Soft Mute
Serial
Input Control
Left/Right Clock
Bit Clock
Double
Speed Select
Multi-bit ˘•
Modulator
Right Output +
Right Output -
Switched
Capacitor Filter
Serial
Input
Interface
Serial Data
Power Down
Soft Mute
8X
Interpolator
De-emphasis
Soft Mute
8X
Interpolator
Multi-bit ˘•
Modulator
Left Output +
Left Output -
Switched
Capacitor Filter
Right Channel
Control
Register
De-emphasis
Control
Clock Divider
Master Clock
No.
Pin Name
I/O
DVSS
DVDD
MCLK
PD
BICK
SDATA
LRCK
SMUTE
DFS
DEM0
DEM1
DIF0
DIF1
DIF2
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
Clock Control
Pin Function and Description
1
DVSS
-
Digital Ground. Digital ground is 0V.
2
DVDD
-
Digital Supply.
3
MCLK
I
Master Clock Input.
4
PD
I
Power-down and Reset. When low the AK4393 is in Power-down Mode and held in reset.
The AK4393 should always be reset after power-up.
3.3V or 5.0V nominal.
5
BICK
I
Audio Serial Data Clock Input.
6
SDATA
I
Serial Data Input.
7
LRCK
I
Left/Right Clock Input.
8
SMUTE
(or CS)
I
Soft Mute Input or Chip Select Input. If the P/S pin (pin 25) is high, SMUTE controls the
soft mute function as follows:
- When SMUTE goes high, the soft mute cycle is initiated.
- When SMUTE goes low, the output mute is slowly released.
If the P/S pin is low, SMUTE is the Chip Select Input for the Serial Control Mode. Chip
select is active when SMUTE is low.
9
DFS
I
Double Sampling Speed Input. When low, this pin defines the Normal Speed Mode, and
128 x Fs oversampling is implemented. When high, the DFS pin defines the Double Speed
Mode, implemented with 64 x Fs oversampling. This pin features an internal pull-down.
10
DEM0
(or CCLK)
I
De-emphasis Enable #0 or Control Data Clock Input. If the P/S pin (pin 25) is high,
DEM0 is used to select the De-emphasis Mode according to Table 3. If the P/S pin os low
DEM0 is the clock input for the Serial Control Mode.
11
DEM1
(or CDTI)
I
De-emphasis Enable #1 or Control Data Input. If the P/S pin (pin 25) is high, DEM1 is
used to select the De-emphasis Mode according to Table 3. If the P/S pin is low, DEM1 is
the control data input for the Serial Control Mode.
A clock input of 64fs or more is recommended.
Defines the sampling rate, Fs.
12
DIF0
I
Digital Input Format Select #0.
13
DIF1
I
Digital Input Format Select #1.
14
DIF2
I
Digital Input Format Select #2.
15
BVSS
-
Substrate Ground Pin.
16
VREFL
I
Low Level Voltage Reference Input.
Normally connected to analog ground.
17
VREFH
I
High Level Voltage Reference Input.
Normally connected to analog supply.
18
AVDD
-
Analog Supply.
Analog supply is 5V nominal.
19
AVSS
-
Analog Ground.
Analog ground is 0V.
20
AOUTR-
O
Right Channel Negative Output.
21
AOUTR+
O
Right Channel Positive Output.
22
AOUTL-
O
Left Channel Negative Output.
23
AOUTL+
O
Left Channel Positive Output.
24
VCOM
O
Common Voltage Output.
25
P/S
I
Parallel/Serial Control Mode Select Input.
If Low, the Serial Control Mode is
implemented. If High, the Parallel Control Mode is selected. This pin has an internal
pull-up.
Master Clock Select #0.
26
CKS0
I
27
CKS1
I
Master Clock Select #1.
28
CKS2
I
Master Clock Select #2.
Samsung Electronics
CKS2
CKS1
CKS0
P/S
VCOM
AOUTL+
AOUTLAOUTR+
AOUTRAVSS
AVDD
VREFH
VREFL
BVSS
Substrate ground is 0V.
Common voltage output is 2.6V nominal.
2-1
2-2
M ON_OUT
M DP_OUT
M DS_OUT
FSW _OUT
PLLLOCK_
OUT
SERLOCK_
OUT
To
S er vo (6)
XTI_ IN
XTO_ OUT
CK33MI_IN
CK33MO_ OUT
X -t al (4)
EFMI_IN
PL CK_IN
FG_ IN
Fr om
Servo (3)
CD CLV/CAV
VCO Tim ing
Generator
7.3 5KHz= 4 .3 218M/588
17 .58KHz= 26 .1 6M/1 488
SUBCODE I/F
23BIT SR
T o MICOM (15)
M
TES T0_IN, TES T1_IN, TES T2_IN
M
SQ-V CD
DVDP,
MICOM I/F
T es t Pin (3 )
CD- G
V-C D ,CD -D A
Deinterleave
&
RAM Control
(6,4,3)
trans ID ECC
EDC
Descrambler
MDAT[7:0]_BI , MRZA_IN, ZCS_IN, M W R_IN,
MRD_IN, ZIRQZD_OUT, ZW AI T_OUT, ZRST_IN
Pow er (34)=VDD(11)+GND(23)
EFM
DEMOD
(32,28,5)
(28,24,5)
CIRC
7 5Hz
67 6.08Hz
(208,192,17)
(182,172,11)
ECC
Frame Sync
DET/PROT/INS
(7.35KHz)
W FCK 17 .58/7.3 5KHz
M
VCO Tim ing
Generator
26 .1 6MHz
GFS_OUT, FRSY Z_ OUT, TX_OUT, EFM O_ OUT,
W FCK_ OUT, RFCK_ OUT, CK1 6M_OUT, DEMPHA_ OUT
CLVLOCK_ OUT
Mon i tor (9)
M
DVD CLV/CAV
RFCK 1 7.58/7 .3 5KHz
X -tal & Tim ing
Generator
16-8
DEMOD
(6,4,3)
Frame Sync
DE T/PROT/INS ECSY efm wr ID ECC
(17.57KHz)
32BIT S R
PW MO[ 7:0]_OUT, BCARZ_IN
T o RF (9)
SDATA[ 0]_OUT/
CDATA
SDATA[ 1]_OUT/L RCK
SDATA[ 2]_OUT/B CLK
SDATA[ 3]_OUT/C2PO
SDATA[ 4]_OUT/S Q DT
SDATA[ 5]_OUT/W FSY
SDATA[ 6]_OUT/S 0 S1
SDATA[ 7]_BI /SQ CK
DATREQ _ IN
CSTROB E _ OUT
DTER_OUT
DATACK_OUT
TOS _ OUT
T o AV (13)
DD[1 5:0]_BI
DADR[8:0]_ OUT
ZRAS _OUT
ZUCAS _OUT
ZLCAS _ OUT
ZOE [ 1 :0 ]_OUT
ZW E[ 1:0]_OUT
(32)
T o DRAM
256K*16
Reference Information
2-1-2 DIC1 (KS1453 ; Data Processor)
Samsung Electronics
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
No.
Pin Name
DVSS
ZCS_IN
MRZA_IN
DVSS
MDAT7_BI
MDAT6_BI
MDAT5_BI
MDAT4_BI
MDAT3_BI
MDAT2_BI
MDAT1_BI
MDAT0_BI
DVDD
XTI_IN
XTO_OUT
DVSS
DD15_BI
DD0_BI
DD14_BI
DD1_BI
DVSS
DD13_BI
DD2_BI
DD12_BI
DD3_BI
DVDD
DD11_BI
DD4_BI
DD10_BI
DD5_BI
DVSS
DD9_BI
DD6_BI
DD8_BI
DD7_BI
DVSS
ZLCAS_OUT
ZUCAS_OUT
ZWE1_OUT
ZWE0_OUT
ZOE1_OUT
DVDD
ZOE0_OUT
ZRAS_OUT
DADR8_OUT
DADR7_OUT
DVSS
DADR0_OUT
DADR6_OUT
DADR1_OUT
DADR5_OUT
DADR2_OUT
DADR4_OUT
DADR3_OUT
DVSS
DVSS
TOS_OUT
DATACK_OUT
DVDD
SDATA0_OUT
SDATA1_OUT
SDATA2_OUT
SDATA3_OUT
SDATA4_OUT
Description
Samsung Electronics
DRAM Address Bus
Digital GND (0 V)
DRAM Address Bus
DRAM Address Bus
DRAM Address Bus
DRAM Address Bus
DRAM Address Bus
DRAM Address Bus
DRAM Address Bus
Digital GND (0 V)
Digital GND (0 V)
Top of Sector
Data Acknowledge Signal Output
DIGITAL Power (+5 V)
DVD Data/CD Data Bit Stream (CDATA)
DVD Data/CD Data L/R Clock (LRCK)
DVD Data/CD Data Bit Clock (BLCK)
DVD Data/CD Data Error Flag (C2PO)
DVD Data/Subcode Serial Data (SQDT)
Digital GND (0 V)
Chip Select (Active Low)
Micom Register Select (L
REGISTER H fi DATA)
Digital GND (0 V)
MICOM Data Bus
MICOM Data Bus
MICOM Data Bus
MICOM Data Bus
MICOM Data Bus
MICOM Data Bus
MICOM Data Bus
MICOM Data Bus
Digital Power (+5V)
System Clock Input for 26.16 MHz
System Clock Output for 26.16 MHz
Digital GND (0 V)
DRAM Data Bus
DRAM Data Bus
DRAM Data Bus
DRAM Data Bus
Digital GND (0 V)
DRAM Data Bus
DRAM Address Bus
DRAM Data Bus
DRAM Data Bus
DRAM Data Bus
Digital Power (+5 V)
Digital Data Bus
Digital Data Bus
Digital Data Bus
Digital Data Bus
Digital GND (0 V)
DRAM Data Bus
DRAM Data Bus
DRAM Data Bus
DRAM Data Bus
Digital GND (0 V)
DRAM Low Column Address Strobe
DRAM Upper Column Address Strobe
DRAM Write Enable 1 (8M ONLY)
DRAM Write Enable 0 (4M, 8M, 16M)
DRAM Output Enable 1 (16M MODE DADR9)
Digital Power (+5 V)
DRAM Output Enable 0
DRAM Row Address Strobe
MICOM
MICOM
MICOM
MICOM
MICOM
MICOM
MICOM
MICOM
XTAL
XTAL
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
AV Decoder
AV Decoder
AV
AV
AV
AV
AV
B
B
B
B
B
B
B
B
I
O
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
Decoder
Decoder
Decoder
Decoder
Decoder
MICOM
MICOM
Notes
I
I
I/O
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
No.
Pin Name
SDATA5_OUT
SDATA6_OUT
SDATA7_BI
DVSS
CSTROBE_OUT
DATREQ_IN
DTER_OUT
DVSS
PWMO7_OUT
PWMO6_OUT
PWMO5_OUT
PWMO4_OUT
DVDD
PWMO3_OUT
PWMO2_OUT
PWMO1_OUT
PWMO0_OUT
DVSS
DVSS
DVSS
DVDD
DVDD
DVSS
DVSS
DVSS
DVSS
FRSYZ_OUT
TX_OUT
GFS_OUT
DVSS
CK33MI_IN
CK33MO_OUT
DVDD
TEST0_IN
TEST1_IN
TEST2_IN
EFMO_OUT
WFCK_OUT
RFCK_OUT
PLCK_IN
DVSS
PLLLOCK_OUT
CLVLOCK_OUT
SERLOCK_OUT
MDP_OUT
MDS_OUT
DVSS
DVSS
MON_OUT
FG_IN
FSW_OUT
EFMI_IN
DVDD
DVDD
DVDD
CK16M_OUT
DEMPHA_OUT
BCARZ_IN
DVSS
ZRST_IN
ZWAIT_OUT
ZIRQZD_OUT
MRD_IN
MWR_IN
Description
DVD Data/Subcode Frame Sync (WFSY)
DVD Data/Subcode Block Sync (S0S1)
DVD Data/Subcode Serial Clock (SQCK)
Digital GND (0 V)
Data Strobe (Clock) Output
Data Request from A/V Decoder or ROM Decoder
DVD Data Error Output
Digital GND (0 V)
PWM Output Signal
PWM Output Signal
PWM Output Signal
PWM Output Signal
Digital Power (+5 V)
PWM Output Signal
PWM Output Signal
PWM Output Signal
PWM Output Signal
Digital GND (0 V)
Digital GND (0 V)
Digital GND (0 V)
DIGITAL Power (+5 V)
DIGITAL Power (+5 V)
Digital GND (0 V)
Digital GND (0 V)
Digital GND (0 V)
Digital GND (0 V)
Frame Sync Out
Digital Out
Good Frame Sync Detection State Output (OK at H)
Digital GND (0 V)
System Clock Input for 33.8688 MHz
System Clock Output for 33.8688 MHz
Digital Power (+5 V)
Test Mode Selection Terminal
Test Mode Selection Terminal
Test Mode Selection Terminal
EFM Out
Write Frame Pulse
Reference Frame Pulse
Phase Locked Clock
Digital GND (0 V)
Lock Signal for PLL
Lock Signal for CLV
Lock Signal for SERVO
Spindle Motor Phase Control Signal (3-STATE)
Spindle Motor Speed Control Signal (3-STATE)
Digital GND (0 V)
Digital GND (0 V)
Spindle Motor Output Filter Switching Output
Reference Signal for CAV
Spindle Motor Output Filter Switching Output (3-STATE)
EFM/EFM+ Signal Input
Notes
Digital Power (+5 V)
Digital Power (+5 V)
Digital Power (+5 V)
CK33Ms 2 Division Clock / 16.9344 MHz
HIGH , when on Deemphasis
BCA Input Signal
Digital GND (0 V)
Hardware Reset (Active Low)
Micom Read / Write Access Wait (Wait at L)
Interrupt Request to Micom
Micom Read Strobe (Active Low)
Micom Write Strobe (Active Low)
Notes
I
O
O
I
I
MICOM
MICOM
MICOM
MICOM
MICOM
Monitor
Monitor
RF
Servo
Monitor
Servo
Servo
Servo
O
O
O
O
O
O
O
I
Monitor
Monitor
Monitor
Servo
I
I
I
O
O
O
I
Servo
Servo
Servo
Servo
X-tal
X-tal
I
O
O
I
O
I
Monitor
Monitor
Monitor
O
O
O
RF
RF
RF
RF
RF
RF
RF
RF
O
O
O
O
O
O
O
O
AV Decoder
AV Decoder
AV Decoder
AV Decoder
AV Decoder
AV Decoder
O
I
O
O
O
B
I/O
Reference Information
2-3
Reference Information
2-1-3 DIC2 (KM416C254D ; CMOS 4M DRAM)
WE
CASL
CASH
CAS
DATA-IN BUFFER
CONTROL
LOGIC
IO0
16
NO.2 CLOCK
GENERATOR
IO15
DATA-OUT
BUFFER
9
D0
D1
D2
D3
D4
D5
D6
D7
D8
9
16
8
8
SENSE AMPLIFIERS
VO GATING
512x16
9
9
ROW
DECODER
REFRESH
COUNTER
ROW.
ADDRESS
BUFFERS(9)
OE
COLUMN
DECODER
512
REFRESH
CONTROLLER
9
RAS
COLUMN
ADDRESS
BUFFER
512
512x512x16
MEMORY
ARRAY
NO.1CLOCK
GENERATOR
Vcc
Vss
2-4
Samsung Electronics
Reference Information
PIN NO.
SYM.
TYPE
16~19, 22~26
A0~A8
Input
Address Input
14
RAS
Input
Row Address Strobe
28
CASH
Input
Column Address Strobe/Upper Byte Control
29
CASL
Input
Column Address Strobe/Lower Byte Control
13
WE
Input
Write Enable
27
OE
Input
Output Enable
2~5, 7~10, 31~34, 36~39
I/O0~I/O15
Input/Output
1, 6, 20
Vcc
Supply
Power, 5V
21, 35, 40
Vss
Ground
Ground
11, 12, 15, 30
NC
-
Samsung Electronics
DESCRITION
Data Input/Output
No Connect
2-5
Reference Information
2-1-4 MIC1 (TMP95C265 ; Main Micom)
AND~AN2
(PA0~PA2)
AN3/ADTRG
(PA3)
AN4~AN7
(PA4~PA7)
VREFH
VREFL
AVCC
AV55
10BIT 8CH
A/D
CONVERTER
DAOUT0,1
8BIT 2CH
A/D
CONVERTER
900/H
XWA
XBC
XDE
XHL
XIX
XIY
XIZ
XSP
CPU
W A
B C
D E
H L
IX
IY
IZ
SP
32bit
SR
F
VCC [3]
VSS[3]
OSC
CLK
AM8/16
EA
RESET
PORT0
(P00~P07)
D0~D7
*
PORT1
(P10~P17)
D8~D15
PORT2
(P20~P27)
A15~A23 *
PORT3
(P30~P37)
A8~A15
*
PORT4
(P40~P47)
A0~A7
*
PC
TxD0(P80)
RxD0(P81)
SCLK0/CT50(P82)
TxD1(P83)
RxD1(P84)
SCLK1/CT51(P85)
TxD2(P86)
RxD2(P87)
SCLK2/CT52(P57)
T10/INT(P70)
TO1(P71)
SERIAL I/O
(CH. 0)
SERIAL I/O
(CH. 1)
WATCHDOG
TIMER
SERIAL I/O
(CH. 2)
2KB ROM
8BIT TIMER
(TIMER 0)
8BIT TIMER
(TIMER 1)
PORT5
8BIT TIMER
(TIMER 2)
TO3/INT2(P72)
8BIT TIMER
(TIMER 3)
T14/INT3(P73)
8BIT TIMER
(TIMER 4)
TO5(P74)
CS/WAIT
CONTROLLER
(4-BLOCK)
64KB ROM
2-6
INTERRUPT
CONTROLLER
RD(P50)*
WR(P51)*
HWR(P52)
BUSRQ(P53)
BUSAK(P54)
WAIT(P55)
C50(P60)
C51(P61)
C52(P62)
C53(P63)
NIMI
INTO(P56)
8BIT TIMER
(TIMER 5)
16BIT TIMER
(TIMER 8)
8BIT TIMER
(TIMER 6)
TO7/INT4(P75)
X1
X2
8BIT TIMER
(TIMER 7)
Not included in
TMP95C265
16BIT TIMER
(TIMER 9)
T18/INT5(P90)
T19/INT6(P91)
TO8(P92)
TO9(P93)
TIA/INT7(P94)
TIB/INT8(P95)
TOA/TOB(P96)
Samsung Electronics
NO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
PORT NAME
VREFL
AVss
AVcc
DAOUT0
DAOUT1
/NMI
P53
P54/BUSAK
/WAIT
P56
SCLK2
P80/TXD0
P81/RXD0
P82/SCLKO
P83/TXD1
P84/RXD1
P85/SCLK1
TXD2
RXD2
CSO
CS1
CS2
CS3
CLK
Vcc
Vss
X1
X2
/EA
/REST
INT1
P71
P72
P73
P74
P75
INT5
P91
P92
P93
INT7
INT8
P96
Vcc
D0
D1
D2
D3
D4
D5
ASSIGNED NAME
DGND
DGND
5D
MTP1
MPT2
CSB
MTP3
/MWAIT
DVD/CD
SCLK
MD
STB
MC
MTP5
MTP6
MTP4
RXD
TXD
/CSO
/CS1
/DVD1CS
/DSPCS
CLK
5D
GDND
X1
X2
/EA
/MRST
SRQ
RRQ
SCL
SDA
OPEN
CLOSE
FGINT
ACT MUTE
M/D MUTE
ZRST
/DVDINT
/DSPINT
ZIVA_RST
5D
HAD0
HAD1
HAD2
HAD3
HAD4
HAD5
Samsung Electronics
Data 0
Data 1
Data 2
Data 3
Data 4
Data 5
GND
High Frequency OSC in
High frequency OSC out
Internal ROM Less Mode
Master reset from FRONT
Interrupt from Front Micom
Request to Front Micom
EEPROM CLOCK
EEPROM DATA I/O
Tray Out Motor Control Output
Tray In Motor Control Output
Interrupt from Spindle Motor FG
Driver IC MUTE(Actuator)
Driver IC MUTE(Spindle)
DSP H/W reset
Interrupt from AV-DEC
Interrupt from DSP
AV Decoder Reset(Active H:4.0, L:4.1)
Serial Data Output
Serial Data Input
EPROM(M27C801) Select
SRAM(KM681000) Select
AVDecoder(ZiVA4) Select
Data Processor(KS1453) Select
CLOCK OUTPUT (System Clock 2)
/Wait(ZiVA, DSP)
DVD/CD RF AGC Gain Select
Serial Data Clock
RF Contrl Data
RF Data Latch
RF Control Clock
PULL-UP
D. Servo IC Chip Select
DESCRIPTION
A/D Ref Input(L)
A/D Ref Input
A/D VCC Input
I/0
I/0
I/0
I/0
I/0
I/0
TYPE
I
0
0
I
0
0
I
0
I
0
I/0
0
0
0
0
0
I
0
0
0
0
0
I
0
I
I
I
0
0
0
0
0
I
0
0
0
I
I
0
GND
FRONT, IC
FRONT
FRONT
KS24C020(6)
KS24C020(5)
DRIVER(0PIN-, 16)
DRIVER(0PIN-, 17)
DRIVER(FG, 2)
DRIVER(MUTE4, 37)
DRIVER(MUTE3, 38)
KS1453(124)
INV(ZiVA-4(51))
INV(KS1453(126))
ZiVA-4(52)
20MHz
/MWait
RF(KS1461)
FRONT
KS1461(69)
KS1461(71)
KS1461(70)
NC
NC
NC
FRONT
FRONT
EPROM(M27C801)
SRAM(KM681000)
AVDecoder(ZiVA4)
Data Processor(KS1453)
fc/2
VCC
GND
KS1452(10)
REMARK
DGND
DGND
5D
NC
NC
NO
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
PORT NAME
D6
D7
P10
P11
P12
P13
P14
P15
P16
P17
AM8/16
Vss
Vcc
A23
P26/A22
P25/A21
P24/A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
/RD
/WR
P52
Vss
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
VREFH
ASSIGNED NAME
HAD6
HAD7
CLSW
OPSW
MTP8
MTP9
MTP10
MTP11
MTP12
MTP13
AM8
DGND
5D
HA23
MRP14
MRP15
MRP16
HA19
HA18
HA17
HA16
HA15
HA14
HA13
HA12
HA11
HA10
HA9
HA8
HA7
HA6
HA5
HA4
HA3
HA2
HA1
HA0
/RD
/WR
RSTB
DGND
RFRP
TILTO
MTP17
SENSE
FR
SLOCK
FOKB
RFO
5D
Tracking Lock monitir from SERVO
Monitor signal
Reserved I
SENSE monitor from SERVO
Spindle direcrion from SP Driver
LOCK monitor from DSP
Focus lock monitor from RF
RF sum signal (Analog Lnput)
A/D Ref Input (H)
SERVO /RD Strobe Mask Signal
Reserved Address Port
Reserved Address Port
Reserved Address Port
Address 19
Address 18
Address 17
Address 16
Address 15
Address 14
Address 13
Address 12
Address 11
Address 10
Address 9
Address 8
Address 7
Address 6
Address 5
Address 4
Address 3
Address 2
Address 1(SERVO DAB)
Address 0(DSP DAB)
/Read Strobe
/Write Strobe
RF&Servo IC Reset
DESCRIPTION
Data6
Data7
Close Switch
Open Swithc
Reserved I/0
Reserved I/0
Reserved I/0
Reserved I/0
Reserved I/0
Reserved I/0
Address Mode(H:8 BIT MODE)
TYPE
I/0
I/0
I
I
0
0
0
0
0
0
I
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
I
I
I
I
I
I
I
I
I
DECK
DECK
NC
NC
NC
NC
NC
NC
VCC
GND
VCC
74HCOO(5)
NC
NC
NC
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM, Zlva Adrs
EPROM, SRAM, Zlva Adrs
EPROM, SRAM, Zlva Adrs
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
EPROM, SRAM ADDRESS
/Read
/Write
KS1461 (73), KS1452 (9)
DGND
KS1452 (7)
KS1452 (69)
NC
KS1452 (22)
BA6849FP (20)
KS1453 (108)
KS1461 (48)
RFO
5D
REMARK
Reference Information
2-7
Reference Information
2-1-5 MIC2 (M27C801 ; 8Mbit (1Mbx8) UVEPROM and OTP EPROM)
LOGIC DIAGRAM
Vcc
8
20
A0-A19
A0-Q7
E
GVpp
Vss
TOP VIEW
2-8
FUNCTION
A19
1
32 Vcc
NAME
A16
2
31 A18
A0-A19
Address Inputs
A15
3
30 A17
A12
29 A14
Q0-Q7
Data Outputs
4
A7
5
28 A13
A6
6
27 A8
A5
7
26 A9
A4
8
25 A11
A3
9
24 GVPP
A2 10
23 A10
A1 11
22 E
A0 12
21 Q7
Q0 13
20 Q6
Q1 14
19 Q4
Q2 15
18 Q4
Vss 16
17 Q3
E
OVpp
Chip Enable
Output Enable/Program Supply
Vcc
Supply Voltage
Vss
Ground
Samsung Electronics
Reference Information
2-1-6 MIC3 (W24256A ; 32K x 8 High Speed CMOS Static RAM)
BLOCK DIAGRAM
V DD
V SS
A0
.
.
DECODER
CORE
ARRAY
A14
CS
OE
CONTROL
DATA I/O
WE
I/O1
.
.
I/O8
TOP VIEW
A14
1
28
VDD
SYMBOL
A12
2
27
WE
A0 - A14
A7
3
26
A13
A6
4
25
A8
A5
5
24
A9
A4
6
23
A11
A3
7
22
OE
A2
8
21
A1
9
A0
I/O1
I/O2
I/O3
VSS
I/O1 - I/O8
DESCRIPTION
Address Inputs
Data Inputs/Outputs
CS
Chip Select Input
WE
Write Enable Input
A10
OE
Output Enable Input
20
CS
V DD
Power Supply
10
19
I/O8
V SS
Ground
11
18
I/O7
12
17
I/O6
13
16
I/O5
14
15
I/O4
Samsung Electronics
28-pin
DIP
2-9
Reference Information
2-1-7 FIC1 (LC86P6232 ; Front Micom)
IR
PLA
ROM
Interrupt Control
Stand-by Control
CF
RC
BUS
PC
Clock
Generator
X’tal
ACC
Base Timer
Bus Interface
B Reg
SIO 0
Port 1
C Reg
SIO 1
Port 7
Timer 0
BUS
Port 8
ALU
Timer 1
Port 2
ADC
Port 3
INT0-3
Noise Filter
Real Time
Service
Port 4
PSW
Port 5
PWM 1
RAR
RAM
XRAM
(128 bytes)
Stack Pointer
VFD Controller
PORT 0
High Voltage
Output
2-10
Watch Dog Timer
Samsung Electronics
PORT NAME
P52
PWM1
P20
P21
P22
P23
P24
P25
P26
P27
TEST1
*RES
XT1
XT2
VSS
CF1
CF2
VDD
ANO/P8 0
AN1/P8 1
AN2/P8 2
AN3/P8 3
AN4/P8 4
AN5/P8 5
AN6/P8 6
AN7/P8 7
P70/IN TO
P71/IN T1
P72/IN T2
P73/IN T3
S0/T0
S1/T1
S2/T2
S3/T3
S4/T4
S5/T5
S6/T6
S7/T7
S8/T8
S9/T9
S10/T10
S11/T11
S12/T12
S13/T13
S14/T14
S15/T15
VOD
VP
S16
S17
NO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Samsung Electronics
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
I
I
I
I
I
I
I
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
I
I
0
-
TYPE
0
0
0
0
0
0
0
SEG1
SEG2
SEG3
SEG4
+5V
-28V
SEG5
SEG6
ECHO_VR
MIC_DET
TP19
KEY0
KEY1
KEY2
NC
NC
RRQ
TP25
TP26
REMOCON
GRID11
GRID10
GRID9
GRID8
GRID7
GRID6
GRID5
GRID4
GRID3
GRID2
GRID1
VMUTE0
VMUTE1
TP4
*RES
GND
TP5
GND
VDD
ASSIGNED NAME
MRST
TP1
CS1
CCLK
CDTI
CS2
DARST
DARST 1
MAIN MICOM
NC
NC
REMOCON EYE
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
Request to Front Micom
FLT
FLT
FLT
FLT
FLT
FLT
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
REMOCON data in
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
FLT GRID CONTROL
KEY SCAN
KEY SCAN
KEY SCAN
KARAOKE
KARAOKE
NC
TACT SW
TACT SW
TACT SW
VIDEO(RESERVED)
VIDEO(RESERVED)
NC
REMARK
RESET
NC
AK4393
AK4393/AK4356
AK4393/AK4356
AK4356
AK4393
AK4356
ECHO volume A/D input
MIC detect
High Frequency OSC in
High Frequency OSC out
Reset
Low Frequency OSC in
Low Frequency OSC out
BA7660 MUTE(VIC2)
BA7660 MUTE(VIC1)
Chip Select 1
Control Data Clock
Control Data
Chip Select 2
PD(Power Down)
PD(Power Down)
DESCRIPTION
Front end reset
PORT NAME
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
P00
P01
P02
P03
P04
P05
P06
P07
P10/S0 0
P11/S1 0
P12/SC K0
P13/S0 1
P14/SI 1
P15/SC K1
P16/BU Z
P17/PW MO
P30
P31
P32
P33
P34
P35
P36
P37
VSS
VDD
P40
P41
P42
P43
P44
P45
P46
P47
P50
P51
NO
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
0
TYPE
0
0
0
0
0
0
0
0
0
0
0
I
I
I
I
I
-0
I
0
I
I
I
I
I
I
I
I
0
0
0
0
0
0
0
0
ON/OFF
TXD
RXD
SCLK
TP12
TP13
TP14
TP15
TP16
S1
S2
S3
S4
J1
J2
AT
AD
+5V
GND
RGBCTL
SCON_B
TP28
WIDE
SRQ
SAVE
AMUTE1
AMUTE0
LED
ASSIGNED NAME
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
MODE4
MODE3
MODE2
MODE1
MODE0
TP10
TP11
POWER ON/OFF CONTROL
SCART CONTROL
request to main micom
POWER SAVE MODE
REAR MUTE
FRONT MUTE
STANDBY LED
SCART CONTROL
SCART CONTROL
SHUTTLE DATA
SHUTTLE DATA
SHUTTLE DATA
SHUTTLE DATA
JOG DATA
JOG DATA
VIDEO OUT SEL.
VIDEO OUT SEL.
SERIAL DATA OUT
SERIAL DATA IN
SERIAL CLOCK
DESCRIPTION
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
FLT SEGMENT CONTROL
HARDWARE MODE SELECT
HARDWARE MODE SELECT
HARDWARE MODE SELECT
HARDWARE MODE SELECT
HARDWARE MODE SELECT
POWER
SCART JACK
SCART JACK
NC
SCART JACK
NC
POWER
AUDIO
AUDIO
LED
REMARK
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
FLT
MARKET CODE
MARKET CODE
MARKET CODE
MARKET CODE
MARKET CODE
NC
NC
NC
SERIAL DATA OUT
SERIAL DATA IN
SERIAL CLOCK
NC
NC
NC
NC
NC
JOG/SHUTTLE
JOG/SHUTTLE
JOG/SHUTTLE
JOG/SHUTTLE
JOG/SHUTTLE
JOG/SHUTTLE
VIDEO SELECT(OPEN)
VIDEO SELECT
Reference Information
2-11
Reference Information
2-1-8 RIC1 (KS1461 ; RF Signal Processor)
BCATH
RFEQO
86 85 84 83 82 81 80 79 78 77 76
1
2
3
4
ADVD
BDVD
CDVD
DDVD
5
6
7
8
AGC-HOLD(00 H)
RFCT
CB2
CP2
RFRP
RFRPN
MROFST
CB1
CP1
MIRRI
EQIN
87
EQVCC
RFAGCO
88
AGCI
AGCC
89
t o RF EQ
TUNI NG BLOCK
ACD
BCD
CCD
DCD
EQGND
AGCLEVEL
95 94 93 92 91 90
AGCB
AGCP
RDPF
EQG
EQF
PLLF
VZOCTL
100 99 98 97 96
AGC_ D ET
BCA
BLOCK
MUX
RF
MUX
74 BCAI
+
A
B
C
D
+
RF
Equalizer
RF SUM
& AGC
+
BCA
RFRP
+
GAIN_ EQ(02 H)
CDRSEL(00 H )
TE1RES
DELAY _SE L(00H)
PLLCTL
TBA L(01H)
DELAY_AB(07 H )
DELAY_C D(07 H)
PLL CTL
RREFBF 9
RREFEQ 10
RREF 11
DVCTL_SE L(02H)
VREF
GENERATOR
DPDEQ1
g a_ R FSUM(08 H )
D
+
GCA
EQ
+
D
TEOFST(04H)
MUX3
D
TE1_LIMIT
+
+
PD_LIMI T(08H)
GA_PLL DN (09 H)
GA_PLL DP(09 H )
VREFEQ 12
PDL IMITRES
COM
EQ
GCA
D
HOLD_CTL(08H)
DPDMUTE
DPD_MUTE(02H)
SEOFHOLD
FLT_CTL(00H)
CAL_ENDB(02H)
PD,LPF
DELAY
COM
DPDEQ2
Ab normal waveform FAUL TOUT
Detectio n circu it
EQ VC
AMP
GAIN_ TE3(02 H )
E 13
GCA
F 14
GCA
AUTO
OFSTCTL
RFCT
&
MIRR
CD1 S12
DELAY _SE L(00H)
PLLCTL
CD1
S12
DVD1
DVD2
LDONB
FLT_CTL
CDRSE L
TES E L
AGCHOLD
TB AL
GAI N_TE 3
ENV_SE L
DVCTL_SE L
DPD_MUTE
GAI N_EQ
GAI N_FE
GAI N_AB CD
TE_OFST
FE_OFST
AB CD_OFST
DELAY _CD
DELAY _AB
PDLIM I T
ga_RFSUM
HOLD_CTL
ga_PLLDP
ga_PLLDN
ADVD1
BDVD1
CDVD1
DDVD1
15
16
17
18
ACD1
BCD1
CCD1
DCD1
19
20
21
22
68 RREFDLY
DPD
VC AMP
66 DPDGND
t o DPD
BLOCK
+
+
+
+
-
D1
B1
C1
SUB A1
RF
MUX GAIN_ FE(03 H)
FE_OFST(05 H )
+
ALPC
65 TE1RES
64 PLLCTL
63 DPDMUTE
62 FAULTOUT
61 DPDEQ 2
60 DPDEQ 1
59 TE3OFST
58 BCA
ENV_SEL(02 H)
57 MIRR
MUX
ABCD_ OFST(06 H )
56 DPDVCC
OFSTHOLD
LDONB(00 H)
FOFST 25
EQIN
AB CD
SUM
OFSTHOLD
FE
CDRSEL(00 H )
ANALOG
VC AMP
67 VREFDPD
TE3B
-
CDR SEL(00 H)
GAIN_ ABCD(00 H )
VREFA 24
72 OSC
69 DATA
+
AVCC 23
73 RESET
71 STB
70 CLOCK
S/ I F
BLOCK
OFSTHOLD
TEOFST(04 H )
TBAL(01 H)
-
55 DFCT2
MUX
TESEL(00 H )
ENVELOPE
-
FOK
DEFECT
+
FOFST
54 DFCT1
53 DFCTTH1
52 DFCTTH2
51 DVCC
47 48
49 50
VREFLP_BGI
AGND
FE
ABCDN
PDLIMITRES
ABCD
ABCDI
FOKB
DFCT_CP1
CC2
CC1
DFCT_CP2
46
FOKTH
40 41 42 43 44 45
DGND
39
ENV
ENVB
37 38
ENVP
33 34 35 36
TE
TEN
32
FEN
27 28 29 30 31
PDCD
LDOCD
PDVD
LDODVD
26
OFSTHOLD
2-12
75 BCAO
Samsung Electronics
Reference Information
Pin
No.
Pin Name
I/O
Description
Related Block
Related
Part
1
ACD
I
Optical main beam A, AC Coupling input terminals for CD of RF
block
PRE AMP
P/U
2
BCD
I
Optical main beam B, AC Coupling input terminals for CD of RF
block
PRE AMP
P/U
3
CCD
I
Optical main beam C, AC Coupling input terminals for CD of RF
block
PRE AMP
P/U
4
DCD
I
Optical main beam D, AC Coupling input terminals for CD of RF
block
PRE AMP
P/U
5
ADVD
I
Optical main beam A, AC Coupling input terminals for DVD of RF
block
PRE AMP
P/U
6
BDVD
I
Optical main beam B, AC Coupling input terminals for DVD of RF
block
PRE AMP
P/U
Optical main beam C, AC Coupling input terminals for DVD of RF
block
PRE AMP
7
8
CDVD
DDVD
I
I
Optical main beam D, AC Coupling input terminals for DVD of RF
block
PRE AMP
P/U
P/U
Pin
No.
Related Block
Related
Part
59
TE3OFST
-
Cap connection terminal (open) for 3B TE Offset
3B TE AMP
-
60
DPDEQ1
O
DPD EQ (A+C) output terminal
DPD
-
61
DPDEQ2
O
DPD EQ (B+D) output terminal
DPD
-
62
FAULTOUT
O
DPD abnormal wave form output terminal (monitor)
DPD
-
63
DPDMUTE
I
DPD TE MUTE control terminal (H: Mute)
DPD
MICOM
64
PLLCTL
I
DPD TE PLL variable input terminal
DPD
SERVO
65
TE1RES
I
DPD TE PLL variable bias resistance
DPD
-
66
DPDGND
P
Power GND input terminal for DPD TE
DPD
-
67
VREFDPD
O
CAP connection terminal for DPD TE center voltage
DPD VC AMP
-
68
RREFDLY
-
Bias resistance connection terminal for Delay Block
Delay Block
-
69
DATA
I
Data input terminal
Serial Interface
MICOM
70
CLOCK
I
Clock input terminal
Serial Interface
MICOM
71
STB
I
Data Enable input terminal
Serial Interface
MICOM
Input terminal for RC value of OSC, for Auto Offset Block
Auto OFSTCTL
-
Pin Name
I/O
Description
9
RREFBF
-
RF AMP I/O buffer bias resistance connection terminal
RF AMP
-
72
OSC
10
RREFEQ
-
RF EQ BIAS resistance connection terminal
RF EQ
-
73
RESET
I
Reset input terminal (L: Reset) for Auto Offset Block
Auto OFSTCTL
MICOM
11
RREF
-
Analog Block bias resistance connection terminal
ANALOG
-
74
BCAI
I
BCA Filter1
BCA
-
12
VREFEQ
-
CAP connection terminal for RF EQ Center voltage
EQ VC AMP
-
75
BCAO
O
BCA Filter2
BCA
-
13
E
I
CD Optical sub beam E input terminal for Servos
TE 3B
P/U
76
RFCT
O
MIRROR
DSSP
77
CB2
-
78
CP2
-
79
RFRP
80
81
14
F
I
CD Optical sub beam F input terminal for Servos
TE 3B
P/U
15
ADVD1
I
Optical main beam A input terminal for DVD of Servo block
SERVO AMP
P/U
16
BDVD1
I
Optical main beam B input terminal for DVD of Servo block
SERVO AMP
P/U
17
CDVD1
I
Optical main beam C input terminal for DVD of Servo block
SERVO AMP
P/U
18
DDVD1
I
Optical main beam D input terminal for DVD of Servo block
SERVO AMP
P/U
19
ACD1
I
Optical main beam A input terminal for CD of Servo block
SERVO AMP
P/U
20
BCD1
I
Optical main beam B input terminal for CD of Servo block
SERVO AMP
P/U
21
CCD1
I
Optical main beam C input terminal for CD of Servo block
SERVO AMP
P/U
22
DCD1
I
Optical main beam D input terminal for CD of Servo block
SERVO AMP
P/U
23
AVCC
P
24
VREFA
I/O
Power voltage input terminal for Analog Part
ANALOG
-
CAP connection terminal for Analog Part center voltage
Uses an external block
ANA VC AMP
SERVO
Related
RF Ripple Center voltage output terminal for Mirror
O
CAP connection terminal of RC value of Bottom Hold, for RFCT
MIRROR
generation
CAP connection terminal of RC value of Peak Hold, for RFCT gen- MIRROR
eration
RF Ripple Amp output terminal for Mirror
MIRROR
DSSP
RFRPN
I
Input terminal for selecting RFRP Amp gain
MIRROR
-
MROFST
I
RF Ripple Offset control terminal for Mirror
MRROR
-
82
CB1
-
MRROR
-
83
CP1
-
MRROR
-
84
MIRRI
I
RC connection terminal of RC value of Bottom Hold, for RFRP
generation
RC connection terminal of RC value of Peak Hold, for RFRP generation
Input terminal for MIRR signal generation
MRROR
-
85
EQVCC
P
Power voltage input signal for RF EQ
RF EQ
-
86
RFEQ0
0
RF EQ output terminal
RF EQ
PLL
BCATH
I
BCA Comparating Level control terminal
BCA
DSP
-
25
FOFST
-
CAP connection terminal (open) for Focus Auto Offsets
FE AMP
-
87
26
OFSTHOLD
I
On/Off terminal for Auto Offset Block.
(L: Auto Offset Adjustments, H: Serial Offset Adjustments)
OFSTCTL
MICOM
88
EQIN
I
RFAGCO input terminal for RF EQ
RFEQ,RFENV
DSSP
89
RFAGCO
O
RF AGC AMP output terminal
RF AGC
-
27
VREFLP_BGI
I
Band gap voltage input block for ALPC
ALPC
-
90
AGCC
-
CAP connection terminal for time constant of AGC
RF AGC
28
LDODVD
O
Optical Laser Diodes operation voltage output terminal for DVD
ALPC
P/U
91
AGCI
I
AGC voltage input terminal while in AGC hold
RF AGC
-
29
PDDVD
I
Optical Laser Monitor Diode voltage input terminal for DVD
ALPC
P/U
92
EQGND
P
Power GND input terminal for RF EQ
RF EQ
-
ALPC
P/U
93
AGCLEVEL
I
ALPC
P/U
94
AGCB
-
AGC Level control voltage input terminal (3.5 V) while in AGC hold RF AGC
off
RC connection terminal for RC value of Bottom Hold, for RF AGC RF AGC
95
AGCP
-
RC connection terminal for RC value of Peak Hold, for RF AGC
96
RDPF
-
Bias resistance connection terminal for selecting RF EQ frequency RF EQ
-
97
EQG
I
RF EQ Boost Gain control voltage input terminal
RF EQ
DSSP
98
EQF
I
RF EQ Peak Frequency control voltage input terminal
RF EQ
DSSP
99
PLLF
I
DSSP
100
VZOCTL
I
Wide-band PLL compatible RF EQ Peak Frequency Control termi- RF EQ
nal
RF EQ zero control terminal
RF EQ
30
LDOCD
O
Optical Laser Diode operating voltage output terminal for CD
31
PDCD
I
Optical Laser Monitor Diode voltage input terminal for CD
32
AGND
P
Power GND terminal for Analog Part
ANALOG
-
33
FE
O
FE AMP output terminal
FE AMP
DSSP
34
FEN
I
Input terminal for selecting FE AMP Gain
FE AMP
-
35
TEN
I
Input terminal for selecting TE AMP Gain
TE AMP
-
36
TE
O
TE AMP output terminal
TE AMP
DSSP
37
PDLIMTRES
-
Bias resistance terminal for PDLIMIT
DPD
-
38
ABCDN
I
ABCD AMP for selecting Gain (- ) input terminal
ABCD AMP
-
39
ABCD
O
ABCD AMP output terminal
ABCD AMP
-
40
ABCDI
I
ABCD AC Coupling input terminal for servo monitor
SERVO MONIT
-
41
ENVP
-
RF ENV
-
RF ENV
-
RF ENV
DSSP
42
ENVB
-
43
ENV
O
CAP connection terminal for selecting the RC value of Peak Hold
for detecting RF Envelopes
CAP connection terminal for selecting the RC value of Bottom
Hold for detecting RF Envelopes
RF Envelope Detect Output terminal
44
DGND
P
Power GND input terminal for digital circuits
DIGITAL
-
45
FOKTH
I
Focus OK comparating level input terminal
FOKB
-
46
FOKB
O
Focus OK comparator output terminal (L: Focus OK)
FOKB
DSSP
DFCT
-
DFCT
-
DFCT
-
DFCT
-
47
DFCT_CP1
-
48
DFCT_CP2
-
49
CC1
O
50
CC2
I
Connection terminal for RC value of Peak Hold, for selecting the
maximum time for Servo signal
Connection terminal for RC value of Peak Hold, for selecting the
minimum defect time for PLL
Peak Hold Output terminal for selecting the minimum Defect time
for Defect
Peak Hold AC Coupling Input terminal for Defect
51
DVCC
P
Power voltage input terminal for digital circuit
DIGITAL
-
52
DFCTTH2
-
-
53
DFCTTH1
-
54
DFCT1
O
Resistance connection terminal for selecting the Defect Comparat- DEFECT
ing Level for PLL
Resistance connection terminal for selecting the Defect Comparat- DEFECT
ing Level for Servo
Defect output terminal for Servo
DEFECT
55
DFCT2
O
Defect output terminal for PLL
DEFECT
PLL
-
DPDVCC
P
Power voltage input terminal for DPD TE
DPD
MIRR
O
Mirror output terminal
MIRR
DSSP
O
BCA output terminal
BCA
DSP
Samsung Electronics
-
DSSP
DSSP
57
BCA
-
-
56
58
RF AGC
-
2-13
XOUT
XO
XI
RSTB
TEST
TILTO
TILTI
2-14
EFM OA
EFM
ASY C D
ASY D VD
R FI
EF M ASYMM ETR Y
R OM
D IGIT AL SER VO
F OR
D SP C OR E
R ANGE PLL
W ID E C APTU RE
BLOC K
IN TER FACE
SYSC ON
PS1
EFM I
D VC T L
TBA L
BLOC K
FBA L
D /A
C ON VER TER
SPD
SL D
TRD
TR ACK C OU NTER
BLOC K
C ON VER TER
PHI1
FOD
C OU T
FE
TE
SM E
TZC O
GEN ER ATOR
FOKB
A/D
DFCT
EN V
LOCK
I/O IN TER FACE BLOC K
SMON
TIM IN G
SSTOP/PS0
VR EF
PL LHD
IN T 0_224
FD C TL
M AG I C 0
EQC TL
VC TR L
R VC O
PL CK
EFM R TD
R PD
R FD
PL LLOC K
M D OU T[3 :0 ]
PSB
SEN SE
M D ATA[ 7 :0 ]
MRDB
MW RB
C SB
D AB
L D ON B
TL KB
FL KB
Reference Information
2-1-9 SIC1 (KS1452 ; Servo Processor)
DIRC
MIRR
TZCA
Samsung Electronics
Samsung Electronics
MDATA2
MDATA3
MDATA4
MDATA5
MDATA6
MDATA7
SENSE
DVDD
XI
XO
XOUT
DVSS
SQCK
SQSI
SCOR
SMON
LOCK
DIRC
FOKB
FDCTL
LDONB
DFCT
MIRR
PLLHD
INT0_224
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
DAB
11
MDATA1
CSB
10
16
RSTB
9
15
PSB
8
MDATA0
TLKB
7
14
FLKB
6
MWRB
COUT
5
MRDB
TEST
4
13
PS1
3
12
SSTOP/PS0PS1
2
Name
MDOUT3
1
No
O
I
I
I
O
I
I
I
I
I
I
I
O
P
O
O
I
P
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
I
O
O
O
I
I
I
O
I/O
Description
RFD
47
SVDD
EQCTL
EFMI
EFMO
LPFDVD
LPFCD
RFI
SVSS
AVSS
SME
VREF
TE
FE
ENV
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
Servo interrupt monitor pin
PLL hold signal from micom
Mirror signal input pin
Defect detection signal input pin
Laser diode ON signal output pin
PLL frequency detect control input pin
80
79
78
77
76
75
74
73
Focus OK signal input pin
72
Lock signal input pin
71
70
69
68
MDOUT2
MDOUT1
MDOUT0
TZCA
TRD
FOD
SPD
SLD
FBAL
TBAL
DVCTL
TILTO
AVDD
TILTI
TZCO
51
67
MAGIC0
EFMOA
50
RPD
RVCO
46
VCTL
PVSS
45
49
EFMRTD
44
48
PLCK
PLLLOCK
43
Name
42
PVDD
41
No
Direct jump control (for 1 track jump)
Motor ON signal input pin
Timing detection input pin for subcode data read
Subcode data input pin
Clock output pin for subcode data read
Servo logic & ROM VSS power supply pin
Clock out (33.9688MHz) to DSP
System clock signal output pin
System clock signal input pin
Servo logic & ROM VDD power supply pin
Internal status monitor pin
MICOM data pin7
MICOM data pin6
MICOM data pin5
MICOM data pin4
MICOM data pin3
MICOM data pin2
MICOM data pin1
MICOM data pin0
MICOM read clock signal input pin
MICOM write clock signal input pin
MICOM data/addrs select pin
MICOM chip select pin
System reset signal input pin
0: 1 Bit, 1: 8 Bit
Tracking servo lock signal output pin
Focus servo lock signal output pin
Counter clock
Test pin (L: normal H: test)
Sled motor position sensor input pin1
Limit switch/sled position sensor input pin0
Mode data3 out controlled by micom
O
O
O
I
O
O
O
O
O
O
O
O
P
I
I
I
I
I
I
P
P
I
I
I
O
I
O
P
O
I
I
I
I
I
I
P
O
O
O
P
I/O
Description
Mode data2 out controlled by micom
Mode data1 out controlled by micom
Mode data0 out controlled by micom
TE signal for tracking zero cross input pin
Tracking actuator drive signal output pin
Focus actuator drive signal output pin
Spindle motor drive signal output pin
Sled motor drive signal output pin
Focus balance signal output pin
Tracking balance signal output pin
Depth variation control signal output pin
TILT out (reserved)
Analog block VDD power supply pin
TILT in (reserved)
RF envelope input pin
Focus error signal input pin
Tracking error signal input pin
Reference voltage input pin
Spindle error input pin
Analog block VSS power supply pin
Servo CPU VSS power supply pin
Rf input signal
Asymmetric input signal for CD
Asymmetric input signal for DVD
EFM signal
EFM signal for test
EQ control signal
Servo CPU VDD power supply pin
Tracking zero cross output pin
EFM offset adjustment pin
Input for controlling hysteresis of the FD output (for testing)
control voltage for VCO
Gain adjust resister for phase detector
Gain adjust resister for frequency detector
Resistor pin for VCO gain
PLL logic block VSS power supply pin
Latched EFM output signal
Frequency lock detect output (H: lock, L: unlock)
PLCK
PLL logic block VDD power supply pin
Reference Information
2-15
Reference Information
7
Short vrake
4
3
2
1
Power
Save
Absolute
Values
+-
Direction
Detector
+
44 H1+
43 H1-
2P
-
45 H2-
-
FIN (GND)
OPIN - 18
46 H2+
Hall amp matrix
Upper
Distributor
OPIN + 17
47 H3-
Detector
Direction select
Lower
Distributor
A1 16
48 H3+
Hall bias
+ -
A2 15
FIN (GND)
5
FG
Comparator
A3 14
6
TSD
PWRGND 13
VH
SIGGND
8
FG
VM
9
ECR
CS1
10
EC
SS
11
VCC2
DIR
12
FIN (GND)
PC1
SB
2-1-10 SIC4 (KA3017 ; Motor & Actuator Driver)
+
OPOUT 19
42 BTLSGND
VCC1 20
41 BIAS
-
+
-
+
-
-
+
-
+
10k
-
10k
AVM12 21
+
+
10k
-
10k
+
40 AVM4
-
+
DI4 22
39 MUTE12
MUTE
MUTE
MUTE
37 MUTE4
DO1 -
DO1 +
DO2 -
DO2 +
BTLPGND1
31
FIN (GND)
32
33
34
35
36
DO4 +
30
DO4 -
29
AVM3
28
DO3 +
27
DO3 -
26
BTLPGND2
25
DI1
DI2 24
2-16
38 MUTE3
2P
2P
2P
2P
2P
2P
2P
2P
DI3 23
Samsung Electronics
Reference Information
Samsung Electronics
No.
Symbol
I/O
1
VH
I
Description
2
FG
O
FG SIGNAL OUTPUT
3
ECR
I
TORQUE CONTROL REFERENCE
4
EC
I
TORQUE CONTROL SIGNAL
5
VCC2
—
SUPPLY VOLTAGE
6
PC1
—
PHASE COMPENSATION CAPACITOR
7
SIGGND
—
SIGNAL GROUND
8
VM
—
MOTOR SUPPLY VOLTAGE
9
CS1
I
CURRENT SENSOR
HALL BIAS
10
S/S
I
START/STOP
11
DIR
O
3-PHASE ROTATIONAL DIRECTION OUTPUT
12
SB
I
SHORT BRAKE
13
PWRGND
—
POWER GROUND
14
A3
O
3-PHASE OUTPUT 3
15
A2
O
3-PHASE OUTPUT 2
16
A1
O
3-PHASE OUTPUT 1
17
OPIN+
I
OP AMP INPUT (+)
18
OPIN-
I
OP AMP INPUT (-)
19
OPOUT
O
OP AMP OUTPUT
20
VCC1
—
SUPPLY VOLTAGE
21
AVM12
—
BTL CH-1, 2 MOTOR SUPPLY VOLTAGE
22
DI4
I
BTL DRIVE INPUT 4
23
DI3
I
BTL DRIVE INPUT 3
24
DI2
I
BTL DRIVE INPUT 2
25
DI1
I
BTL DRIVE INPUT 1
26
DO1-
O
BTL DRIVE 1 OUTPUT (-)
27
DO1+
O
BTL DRIVE 1 OUTPUT (+)
28
DO2-
O
BTL DRIVE 2 OUTPUT (-)
29
DO2+
O
BTL DRIVE 2 OUTPUT (+)
30
BTLPGND1
—
BTL POWER GROUND 1
31
BTLPGND2
—
BTL POWER GROUND 2
32
DO3-
O
BTL DRIVE 3 OUTPUT (-)
33
DO3+
O
BTL DRIVE 3 OUTPUT (+)
34
AVM3
—
BTL CH3 MOTOR SUPPLY VOLTAGE
35
DO4-
O
BTL DRIVE 4 OUTPUT (-)
36
DO4+
O
BTL DRIVE 4 OUTPUT (+)
37
MUTE4
I
BTL DRIVE MUTE CH 4
38
MUTE3
I
BTL DRIVE MUTE CH 3
39
MUTE12
I
BTL DRIVE MUTE CH 1, 2
40
AVM4
—
BTL CH 4 MOTOR SUPPLY VOLTAGE
41
BIAS
—
BTL BIAS VOLTAGE
42
BTLSGND
—
BTL DRIVE SIGNAL GROUND
43
H1-
I
HALL1(-) INPUT
44
H1+
I
HALL1(+) INPUT
45
H2-
I
HALL2(-) INPUT
46
H2+
I
HALL2(+) INPUT
47
H3-
I
HALL3(-) INPUT
48
H3+
I
HALL3(+) INPUT
2-17
2-18
Host
Interface
DVD/CD
Interface
Host
Interface
Control Logic
Bus Key
Authentication
(optional)
SecureView
CSS
Descrambling
Memory
Controller
SDRAM
Interface
Program
Stream
Decoder
MPEG Audio
Decoder
Dolby Digital Audio
Decoder
CD-DA and LPCM
Decoder
MPEG Video
Decoder
Subpicture
Decoder
OSD
Decoder
Digital Audio Input
Audio
DSP
Video
Mixer
Digital
Audio
Interface
Digital
Video
Encoder
Audio
Interface
Video
Out
Reference Information
2-1-11 ZIC1 (ZIVA 4.1 ; A/V Decoder)
Samsung Electronics
Samsung Electronics
NC
NC
VDD_2.5
VSS
NC
NC
NC
NC
VSS
VDD_3.3
VDATA0
VDATA1
VDATA2
VDATA3
VDATA4
VDATA5
VDATA6
VDATA7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
PIO0
VSS
VDD_3.3
PIO1
PIO2
PIO3
45
46
47
48
RESERVED
42
44
RESERVED
41
43
RESERVED
37
40
VSS
36
RESERVED
VDD_2.5
35
RESERVED
RESERVED
34
39
RESERVED
33
38
VDD_3.3
RESERVED
32
VSS
NC
9
31
NC
8
VSYNC
INT
7
HSYNC
VDD_3.3
6
30
VSS
5
29
WAIT
RESET
4
R/W
VDD_3.3
3
RD
1
2
Pin Name
Pin No.
I
3.3V
I/O
3.3V
3.3V
3.3V
3.3V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
GROUND
2.5V
3.3V
3.3V
3.3V
3.3V
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
I/O
3.3V
GROUND
O
O
O
3.3V
3.3V
3.3V
O
O
3.3V
O
3.3V
O
O
O
O
O
O
O
O
O
3.3V
3.3V
3.3V
3.3V
GROUND
No Connect
No Connect
No Connect
No Connect
GROUND
2.5V
No Connect
No Connect
No Connect
O
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
No Connect
55
3.3V
54
53
52
51
50
49
Pin No.
3.3V
O, OD, PU
I
3.3V
GROUND
O, OD, PU
3.3V
3.3V
I
I/O Type
3.3V
I/O Voltage
SD-CS1/MADDR11
SD-CS0
SD-RAS
VSS
VDD_3.3
SD-CAS
MWE
MADDR4
VSS
VDD_2.5
MADDR5
MADDR6
MADDR7
VSS
VDD_3.3
MADDR8
MADDR9
CLKSEL
SD-CLK
LDQM
MDATA8
VSS
VDD_3.3
MDATA9
MDATA10
MDATA11
MDATA12
MDATA13
VSS
VDD_2.5
MDATA14
VSS
VDD_3.3
MDATA15
MDATA7
MDATA6
MDATA5
MDATA4
MDATA3
MDATA2
VSS
VDD_3.3
MDATA1
MDATA0
PIO7
PIO6
PIO5
PIO4
Pin Name
3.3V
3.3V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
GROUND
2.5V
3.3V
3.3V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
GROUND
2.5V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
I/O Voltage
O
O
O
O
O
O
O
O
O
O
O
I
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O Type
RESERVED
DAI-LRCK
DAI-BCK
112
113
114
NC
VSS_DAC
143
VDD_VIDEO
141
142
CVBS/G/Y
VDD_DAC
138
140
VSS_DAC
VSS_VIDEO
137
139
NC
135
136
VDD_DAC
VDD_VIDEO
134
VSS_VIDEO
CVBS + sync
132
133
NC
VSS_DAC
131
VSS
130
VDD_2.5
129
DA-BCK
126
128
DA-XCK
125
DA-IEC
VSS
124
127
VDD_3.3
123
120
DA-LRCK
DA-DATA1
119
122
DA-DATA2
118
DA-DATA0
DA-DATA3
117
121
VSS
DAI-DATA
116
VDD_3.3
RESERVED
115
RESERVED
111
NC
110
109
RESERVED
NC
107
108
NC
106
RESERVED
MADDR1
102
105
VSS
101
MADDR3
VDD_3.3
100
MADDR2
MADDR0
99
104
MADDR10
98
103
SD-BS
Pin Name
97
Pin No.
ANALOG GND
No Connect
3.3V ANALOG
3.3V ANALOG
3.3V ANALOG
ANALOG GND
ANALOG GND
No Connect
3.3V ANALOG
3.3V ANALOG
3.3V ANALOG
ANALOG GND
ANALOG GND
No Connect
GROUND
2.5V
3.3V
3.3V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V ANALOG
3.3V
No connect
3.3V
No connect
No connect
ANALOG GND
3.3V
3.3V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
I/O Voltage
O
O
O
O
O
O
O
O
I/O
O
O
O
O
O
I/O
I/O
I/O
I
I
O
I
O
O
O
O
O
O
O
O
I/O Type
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
Pin No.
RESERVED
VDD_2.5
VSS
RESERVED
RESERVED
RESERVED
HADDR2
HADDR1
HADDR0
NC
NC
NC
VSS
VDD_3.3
RESERVED
VDD_3.3
ERROR
VSTROBE
VREQUEST
VDACK
DVD-DATA7/CDG-SCLK
DVD-DATA6/CDG-S0S1
DVD-DATA5/CDG-VFSY
VDD_3.3
VSS
DVD-DATA4/CDG-SDATA
DVD-DATA3/CD-C2P0
DVD-DATA2/CD-BCK
DVD-DATA1/CD-LRCK
DVD-DATA0/CD-DATA
A_VDD
VCLK
SYSCLK
A_VSS
VDD_RREF
RREF
VSS_RREF
VDD_VIDEO
VDD_DAC
C/R/V
VSS_VIDEO
VSS_DAC
NC
VDD_VIDEO
VDD_DAC
Y/B/U
VSS_VIDEO
Pin Name
I/O Voltage
3.3V
2.5V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
No connect
No connect
No connect
GROUND
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V ANALOG
3.3V
3.3V
GROUND
3.3V ANALOG
3.3V ANALOG
ANALOG GND
3.3V ANALOG
3.3V ANALOG
3.3V ANALOG
ANALOG GND
ANALOG GND
No Connect
3.3V ANALOG
3.3V ANALOG
3.3V ANALOG
ANALOG GND
I
I
I
I
I
I
I
O
O
O
I
I
O
I
I
I
I
I
I
I
I
I
I
I
O
O
O
O
I/O Type
Reference Information
2-19
2-20
Pin Name
VSS
VDD_3.3
RESERVED
RESERVED
RESERVED
RESERVED
HDATA7
VSS
Pin No.
191
192
193
194
195
196
197
198
GROUND
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
GROUND
I/O Voltage
I/O
I
I
I
I
I/O Type
VSS
HDATA1
HDATA0
CS
205
206
207
208
VDD_3.3
HDATA2
HDATA3
HDATA4
HDATA5
HDATA6
Pin Name
204
203
202
201
200
199
Pin No.
I/O
I
3.3V
I/O
I/O
I/O
I/O
I/O
I/O
I/O Type
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
I/O Voltage
Reference Information
Samsung Electronics
Reference Information
2-1-12 ZIC2/ZIC3 (KM416S1120D ; CMOS 16M SDRAM)
I/O Control
Data Input Register
Bank Select
Output Buffer
512K x 16
Sense AMP
Row Decoder
ADD
Row Buffer
Refresh Counter
LDQM
DQi
Column Decoder
Col. Buffer
LCBR
LRAS
Address Register
CLK
512K x 16
LWE
Latency & Burst Length
LCKE
Programming Register
LRAS
LCBR
LWE
LCAS
LWCBR
LDQM
Timing Register
CLK
CKE
RAS
CS
Pin
CAS
Name
WE
VDD
DQ0
DQ1
VSSQ
DQ2
DQ3
VDDQ
DQ4
DQ5
VSSQ
DQ6
DQ7
VDDQ
LDQM
WE
CAS
RAS
CS
BA
A10/AP
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
VSS
DQ15
DQ14
VSSQ
DQ13
DQ12
VDDQ
DQ11
DQ10
VSSQ
DQ9
DQ8
VDDQ
N.C/RFU
UDQM
CLK
CKE
N.C
A9
A8
A7
A6
A5
A4
VSS
L(U)DQM
Input Function
CLK
System Clock
Active on the positive going edge to sample all inputs.
CS
Chip Select
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and L(U)DQM
CKE
Clock Enable
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
A0 ~ A10/AP
Address
Row / column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA10, column address : CA0 ~ CA7
BA
Bank Select Address
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
RAS
Row Address Strobe
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
CAS
Column Address Strobe
Latches column addresses on the positive going edge of the CLK with CAS low.
Enables column access.
WE
Write Enable
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
L(U)DQM
Data Input/Output Mask
Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when L(U)DQM active.
DQ0 ~ 15
Data Input/Output
Data inputs/outputs are multiplexed on the same pins.
VDD/VSS
Power Supply/Ground
Power and ground for the input buffers and the core logic.
VDDQ/VSSQ
Data Output Power/Ground
Isolated power supply and ground for the output buffers to provide improved noise
immunity.
N.C/RFU
No Connection/
Reserved for Future Use
This pin is recommended to be left No Connection on the device.
Samsung Electronics
2-21
Reference Information
MEMO
2-22
Samsung Electronics
3. Product Specifications
GENERAL
Power Requirements
AC 110 - 240V, 50/60Hz
Power Consumption
17W
Weight
3.1kg
Dimensions
Operating Temperature Range
+5°C ~ +35°C
Operating Humidity Range
10% to 75%
DVD
(Digital Versatile Disc)
CD : 12Cm
DISC
W 430mm X D 280mm X 89mm
(Compact Disc)
CD : 8Cm
(Compact Disc)
VCD : 12Cm
Composite Video
Reading Speed : 3.49 m/sec
Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Reading Speed : 1.2 to 1.4 m/sec
Maximum Play Time : 74min.
Reading Speed : 1.2to 1.4 m/sec.
Maximum Play Time : 20min.
Reading Speed : 1.2 to 1.4 m/sec.
Maximum Play Time : 74min. (Video + Audio)
2 channel : 1.0Vp-p (75ohm load)
R(Red) : 0.714 Vp-p (75ohm load)
G(Green) : 0.714 Vp-p (75ohm load)
Video Output
Scart Jack
B(Blue) : 0.714 Vp-p (75ohm load)
Composite Video : 0.714 Vp-p (75ohm load)
Color Signal : 0.286 Vp-p (75ohm load)
S-Video
Audio Output
Luminance Signal : 1Vp-p (75ohm load)
Color Signal : 0.286Vp-p (75ohm load)
Scart Jack
2 Channel : L(1.L), R(2/R)
2 Channel
L (1/L), R (2/R)
* Frequency Response
48KHz Sampling : 4Hz to 22 KHz
96KHz Sampling : 4Hz to 44KHz
* S/N Ratio
115dB
* Dynamic Range
105dB
* Total Harmonic Distortion
0.003%
* : Nominal specification
Samsung Electronics
3-1
Product Specification
MEMO
3-2
Samsung Electronics
4. Disassembly and Reassembly
4-1 Cabinet and PCB
Note : Reassembly in reverse order.
4-1-1 Top Cabinet Removal
1) Remove 3 Screws Πon the back Top Cabinet.
2) Remove 2 Screws ´, ˇ on the left and right side.
3) Lift up the Top Cabinet in direction of arrow.
Π3 SCREWS
´ 1 SCREW
ˇ 1 SCREW
Fig. 4-1 Top Cabinet Removal
Samsung Electronics
4-1
Disassembly and Reaasembly
4-1-2 Door-Tray Removal
1) Supply power and open Tray Œ.
2) Disassemble the Door-Tray ´ in direction of arrow “A”.
3) Close Tray Πand power off.
Note : If Tray Œ doesn’t open, insert a Screw driver ¨ into the Emergency hole ˇ (as shown in detailed drawing) and then push it in the direction of arrow “B”. Open Tray manually.
ΠTRAY
´ DOOR-TRAY
"A"
"B"
ˇ EMERGENCY HOLE
¨ SCREW DRIVER
<Side View>
Fig. 4-2 Door-Tray Removal
4-2
Samsung Electronics
Disassembly and Reaasembly
4-1-3 Ass’y Front-Panel, Key PCB Removal
1) Remove Ass’y Front-Panel Œ.
2) Remove 5 Screws ´ and Key PCB ˇ.
´ 5 SCREWS
ˇ KEY PCB
ΠASS'Y FRONT-PANEL
Fig. 4-3 Ass’y Front-Panel, Key PCB Removal
Samsung Electronics
4-3
Disassembly and Reaasembly
4-1-4 Ass’y Deck Removal
1) Remove 4 Screws Œ from the Ass’y Deck and lift it up.
CAUTIONS ;
(1) When disassembling, switch the SW3 to “OFF” on the Deck PCB and remove the FPC connected to DCN1 on Main PCB.
(2) When assembling, insert the FPC into the DCN1 on Main PCB and switch SW3 to “ON” on the Deck PCB.
Π3 SCREWS
DECK-ASS'Y
FPC
W3
S
ON
OFF
MAIN PCB
DCN1
Fig. 4-4 Ass’y Deck Removal
4-4
Samsung Electronics
Disassembly and Reaasembly
4-1-5 Main PCB, Jack PCB Removal
1) Remove 1 Screw Œ.
2) Remove 2 Screws ´ and lift up the Jack PCB ˇ.
3) Remove 3 Screws ¨ and lift up the Main PCB ˆ.
´ 2 SCREWS
ˇ JACK PCB
¨ 3 SCREWS
ˆ MAIN PCB
Π1 SCREW
Fig. 4-5 Main PCB, Jack PCB Removal
Samsung Electronics
4-5
Disassembly and Reaasembly
4-2 PCB Location
JACK PCB
MAIN PCB
KEY PCB
Fig. 4-6 PCB Location
4-6
Samsung Electronics
Disassembly and Reaasembly
4-3 Connector Diagram
DECK-ASS'Y
CT3
ˆ
CT4
JACK PCB
∏
CT2
ˇ
”
MAIN PCB
¨
´
Ø
CT1
Œ
KEY PCB
NO.
CONNECTOR NO.
DIRECTION
CONNECTOR NO.
NO.
Œ
CON21
KEY PCB
CT1
JACK PCB
CN2
´
ˇ
PCNS1
JACK PCB
CT2
MAIN PCB
PCN1
¨
ˆ
FPC
DECK-ASS'Y
CT3
MAIN PCB
DCN1
Ø
∏
CN1
JACK PCB
CT4
MAIN PCB
CN8
”
Fig. 4-7 Connector Diagram
Samsung Electronics
4-7
Disassembly and Reaasembly
4-4 Deck
4-4-1 PCB Deck Ass’y and Ass’y P/U Deck Removal
1) Remove the soldering of SLED+, SLED- Œ and TM+, TM- ´.
2) Disconnect CN3 ˇ, CN2 ¨.
3) Remove 1 Screw ˆ and lift up the PCB Deck Ø.
4) Remove 1 Screw ∏.
5) Push the Hook ” in the direction of arrow “A” and lift up the Ass’y P/U Deck ’ in direction of arrow “B”.
ˆ 1 SCREW
Œ SLED+/SLED´ TM+/TM¨ CN2
Ø DECK PCB
ˇ CN3
’ ASS'Y P/U DECK
∏ 1 SCREW
"B"
<Assembly Point>
"A"
” HOOK
Fig. 4-8 PCB Deck Ass’y and Ass’y P/U Deck Removal
4-8
Samsung Electronics
Disassembly and Reaasembly
4-4-2 Tray Disc Removal
1) Insert a Screw Driver Œ into Emergency Hole ´ and push the Sider Housing ˇ in the direction arrow “A”.
2) When the Tray Disc ¨ comes out little, pull it in the direction arrow “B” by hand.
3) Pull the Tray Disc ¨ to disassemble , while simultaneously pushing 2 Stoppers ˆ (left, right) in the direction
arrow “C”, “D”.
ˆ STOPPER
"C"
"A"
"D"
¨ TRAY DISC
"B"
ˇ SLIDER HOUSING
ˆ STOPPER
ΠSCREW DRIVER
´ EMERGENCY HOLE
Fig. 4-9 Tray Disc Removal
Samsung Electronics
4-9
Disassembly and Reaasembly
4-4-3 Slider Housing Removal
1) Push the Slider Housing Œ in the direction arrow “A”.
2) Lift up the Slider Housing Œ.
ΠSLIDER HOUSING
"A"
Assembly
PUSH
Fig. 4-10 Slider Housing Removal
4-10
Samsung Electronics
Disassembly and Reaasembly
4-4-4 Housing Ass’y Removal
1) Remove Belt Œ and 1 Screw ´.
2) Remove 1 Screw ˇ and lift up the Pulley Gear ¨.
3) Push the Hook ˆ in the direction arrow “A” and lift up Gear Tray Ø, Gear Housing ∏.
4) Push the 4 Hooks ” bottom side in the direction arrow “B” and lift up the Motor Load Ass’y ’.
5) Remove Clamper Ass’y ˝.
ˆ HOOK
"A"
˝ CLAMPER ASS'Y
ΠBELT
ˇ 1 SCREW
¨ PULLEY GEAR
´ 1 SCREW
Ø GEAR TRAY
∏ GEAR HOUSING
"B"
"B"
"B"
"B"
” 4 HOOKS
<Bottom Side>
’ MOTOR LOAD ASS'Y
Fig. 4-11 Housing Ass’y Removal
Samsung Electronics
4-11
Disassembly and Reaasembly
4-4-5 Sub Chassis Removal
1) Remove the 4 Screws Œ.
2) Lift up the Ass’y Brkt Deck ´.
Π4 SCREWS
´ ASSY-BRAK DECK
Fig. 4-12 Sub Chassis Removal
4-12
Samsung Electronics
Disassembly and Reaasembly
4-4-6 Ass’y Brkt Deck Removal
1) Remove Washer Œ.
2) Remove Gear Feed B ´ , Gear Feed A ˇ.
3) Remove 2 Screws ¨.
4) Remove Shaft Pick-Up ˆ and Pick-Up Assy Ø.
5) Remove 1 Screw ∏.
6) Remove 2 Screws ”.
7) Remove 3 Spring Spindle ’ and Motor Spindle Ass’y ˝.
˝ MOTOR SPINDLE
Ø PICK-UP ASS'Y
ˆ SHAFT PICK-UP
¨ 2 SCREW
’ SPRING SPINDLE
ΠWASHER
´ GEAR FEED B
∏ 1 SCREW
” 2 SCREWS
ˇ GEAR FEED A
Fig. 4-13 Ass’y Brkt Deck Removal
Samsung Electronics
4-13
Disassembly and Reaasembly
MEMO
4-14
Samsung Electronics
5. Circuit Descriptions
5-1 S.M.P.S.
5-1-1 Comparsion between Linear Power Supply and S.M.P.S.
5-1-1 (a) Linear
Vout
Vreg
REGULATOR
+
Vp
(Np) –
Common power
(Ex.120/220V 50/60Hz)
+
Vs
– (Ns)
+
Fig. 5-1 Linear Power Supply
◆ Waveform/Description
Vs
0
t
Input : Common power to transformer (Vp).
Fig. 5-2
Vs
0
t
The output Vs of transformer is determined by the ratio
of 1st Np and 2nd Ns.
Vs = (Ns/Np) x Vp
Fig. 5-3
Vout
0
t
Vout is output (DC) by diode and condensor.
Fig. 5-4
Samsung Electronics
5-1
Circuit Descriptions
◆ Advantages and disadvantages of linear power supply
Change by common power
1) Advantages : Little noise because the output waveform
of transformer is sine wave.
2) Disadvantages :
ΠAdditional margin is required because Vs is changed (depending on power source). (The regulator
loss is caused by margin design).
´ Greater core size and condensor capacity are needed, because the transformer works on a single
power frequency.
v
Vout
Vreg
0
t
Regulator loss
Fig. 5-5
5-1-1 (b) S.M.P.S. (Pulse width modulation method)
Vout
Transformer
(Np)
(Ns)
+
+
(Vp)
(Vs)
–
–
REGULATOR
+
+
Vin
Switch
ON/OFF Control
+
Vs switch
–
I switch
Fig. 5-6
◆ Terms
1) 1st : Common power input to 1st winding.
2) 2nd : Circuit followings output winding of transformer.
3) f (Frequency) : Switching frequency (T : Switching cycle)
4) Duty : (Ton/T) x 100
5-2
Samsung Electronics
Circuit Descriptions
5-1-2 Circuit description (FLY-Back PWM (Plise Width Modulation) Control)
5-1-2 (a) AC Power Rectification/Smoothing Terminal
1) PDS01,PDS02,PDS03,PDS04 : Convert AC power to DC(Wave rectification)
2) PEF10 : Smooth the voltage converted to DC(Refer to VIN of Fig. 5-7)
3) PLF01, PLS01, PCF01, PCF02, PCD01, PCD03, PCS03 : Noise removal at power input/output
4) PVA1 : SMPS protection at power surge input (PVA1 pattern open is to remove noise)
5) PR10 : Rush current limit resistance at the moment of power cord insertion.
ΠRush current = (AC input voltage x 1.414 - Diode drop voltage) / Pattern resistance + PLF01, PLS01
resistance + PCD01 resistance + PRF10) (AC230V based : approx. 26A)
´ Without PRF10, the bridge diode might be damaged as the rush current increases.
5-1-2 (b) SNUBBER Circuit : PRS11, PRS12, PRD12, PCD12, PDS11, PCF11
1) Prevent residual high voltage at the terminals of
switch during switch off/Suppress noise.
High inverted power occurs at switch off, because of
the 1st winding of transformer :
(V= LI xdi/dt. LI : Leakage Induction)
A very high residual voltage exists on both terminals
of PICF1 because dt is a very short.
Vswitch
Inverted power
by leakage
inductance
dt
2) SNUBBER circuit protects PICF1 from damage
through leakage voltage suppression by RC,
(Charges the leakage voltage to PDS11 and PCF11,
and discharges to PRS11 and PRS12).
0
t
Toff
3) PCD12, PRD12 : For noise removal
Fig. 5-7
5-1-2 (c) PICF1 Vcc circuit
1) PCD11, PCF12, PCF13, PCF14 : PICF1 driving resistance
(PICF1 works through driving resistance at power cord in)
2) PICF1 Vcc : PDF13, PRF16, PEF12
ΠUse the output of transformer as Vcc, because the current starts to flow into transformer while
PICF1 is active.
´ Rectify to PDF13 and smooth to PEF12.
ˇ Use the output of transformer as PICF1 Vcc : The loads are different before and after PICF1 driving.
(Vcc of PICF1 decreases below OFF voltage, using only the resistance due to load increase after PICF1 driving.)
Samsung Electronics
5-3
Circuit Descriptions
5-1-2 (d) Feedback Control Circuit
Trans PDS33
PLS31
PES37
PES33
PICF1
5.8V
OCP
GND
#
DRAIN !
@
$
PRD32
%
F/B
VCC
C
A
E
K
PICS1
PRD31
PCS32
PRS32
PRS33
K
1st GND
P
PICS2
2.5V
A
PRS34
2nd GND
Fig. 5-8
1) F/B terminal of PICF1 determines output duty cycle.
2) C-E(Collector-Emitter) of PICS1 and F/B potential of PICF1 are same.
Operation descriptions
1) Internal OP-Amp ‘+’ base potential of PICS2 is 2.5V and external “-” input potential is connected with PRS33
and PRS34 to maintain Vout of 5.8V. (Vout = ((PRS38 x PRS34) / PRS34) x 2.5V)
2) If load of 5.8 V terminal increases(or AC input voltage decreases) and Vout decreases below 5.8V, then :
PICS2 “P” potential down below 2.5V --> PICS2 A-K of base current down --> PICS2 of A-K current down -->
PICS1 Diode current down --> PICS1 C-E current down --> PICS1 C-E voltage up --> PICF1 F/B voltage up -->
Out Duty up --> Transformer 1st current up --> Transformer 1st power up --> Vout up --> Maintain Vout 5.8V
3) If load of 5.8 V terminal decreases(or AC input voltage rises) and Vout rises above 5.8V, then :
Reverse sequence of the above description --> Duty down --> Vout down --> Maintain 5.8V (i.e., the feedback
to maintains 5.8V).
ΠPRD31, PRD32 : Reduce 5.8V overshoot
´ PRS32, PCS32 : Prevent PICS2 oscillation(for phase correction)
5-4
Samsung Electronics
Circuit Descriptions
5-1-3 Internal Block Diagram
5-1-3 (a) Internal Block Diagram of S.M.P.S. Circuit
FLT Driving
Circuit
Smoothing
Circuit
Noise
Removal
(SNUBBER)
Converter
Rectified Circuit
3.3V Rectified
VoltageCircuit
5V Rectified
Smoothing Circuit
5V Rectified
VoltageCircuit (x2)
O
U
T
P
U
T
Motor 8V
1 Port
PWM Control
Circuit
(STR-G6551)
Line Filter
3.3V Rectified
Smoothing Circuit
Voltage
Detection
Circuit
Power IN
(85~265V)
8V Rectified
Smoothing Circuit
8V Rectified
VoltageCircuit
-8V Rectified
Smoothing Circuit
-8V Rectified
VoltageCircuit
Fig. 5-9
5-1-3 (b) PICF1 (STR-G6551) Internal Block Diagram
VIN
4
1
D
2
S
5
O.C.P/
3
GND
DRIVE
START
O.V.P
LATCH
REG.
+
_
T.S.D
Vin
Comp
O.S.C
Fig. 5-10
Samsung Electronics
5-5
Circuit Descriptions
5-2 RF
5-2-1 RIC1 (KS1461)
KS1461 is combined with KS1452 and KS1453 as bipolar IC developed for DVD SERVO system.
Main features include DVD waveform equalizing, CD waveform equalizing, focus error signal generation, 3-beam
tracking error signal generation, DPD 1-beam tracking error, defect, envelope, MIRR output, etc. after receiving the
pick-up output converted into I/V.
5-2-1 (a) Basic Potentiometer
KS1461 uses a single power method and each circuit is based on V of 2.5V.
V (Pin 12, 20, 24, 67) terminal is needed for IC, which uses the peripheral V.
5-2-1(b) RF signal
Fig. 5-11 shows the flow of signal generated by the pick-up.
A, B, C, D signals detected from pick-up are converted in to RF signal(A+B+C+D) via RF summing AMP.
104
MIRRI
RFAGCO 474
EQIN
?
.
m
A
B
C
PICK-UP
D
PD LD F
104
%
104
^
104
&
104
*
MIRR
RE SUM
& AGC
RF EG
G MIRR
,
TESEL
E
DPD
TE
Mhx
y TE
3
4 TE
5
6
7
i
ABCD
SUM
8
ABCDI
103
ENV
FOK
DEFECT
FE
w
E
RFEQO
I
P
[
F
d
T
ABCD
ENV
FOKB
DFCT2
DFCT1
FE
ALPC
Fig. 5-11
Fig. 5-12 shows the waveform-equalizing block diagram for the RF signal.
It outputs to EQout (Pin 86) terminal by initially changing switching AMP gain of DVD and CD, and then adjusting the level in RF SUM & AGC. It controls RF SUM & AGC gain by means of Pin 89-95 and interfaces with PWM
signal, (output from PWM terminal of KS1453, via low-pass filter to adjust boost gain and peak frequency.
5-6
Samsung Electronics
Circuit Descriptions
EQIN
,
VZOCTL
‚
RFEQO
RFDVCC
·
VREFEQ
PLLGF
EQG
PWM1
°
RF EQ
EQF
.
‡
REAGCO ?
PWM2
474
Fig. 5-12
The control parameters of DVD EQ and CD EQ are as follows.
1) DVD CD EQ control parameter
ΠEQG (Pin 97) : Changes the gain of peak frequency with EQ frequency characteristic. Convert PWM signal,
output from KS1453, into DC via low-pass filter.
´ EQF (Pin 98) : Changes the peak frequency with EQ frequency characteristic. Convert PWM signal, output
from KS1453, into DVD via low-pass filter.
Samsung Electronics
5-7
Circuit Descriptions
5-3 System Control
5-3-1 Outline
The main micom peripheral circuit is composed of 16bit Micom (MIC1 ; TMP95C265), 8M EPROM (MIC2 ;
M27C801) for Microcode and data save, 256 byte EE-PROM (MIC4 ; KS24C020) for permanent storage of data needed at power off.
The Micom (MIC1 ; TMP95C265) mounted in main board analizes the key commands of front panel or instructions
of remote control through communication with Micom (FIC1 ; LC86P6232) of front and controls the devices on
board to execute the corresponding commands after initializing the devices connected with micom on board at
power on.
5-3-2 Block Diagram
RIC1
RF AMP
KS1461
SIC1
DIGITAL SERVO
KS1452
DIC1
DATA PROCESSOR
KS1453
FIC1
FRONT MICOM
LC86P6232
ZIC1
A/V DECODER
ZIVA4.1
AIC1
D/A CONVERTER
AK4393
MIC1
MAIN MICOM
TMP95C265
DATA BUS
MICOM
BLOCK
MIC5
EEPROM
KS24C020
MIC8
EPROM
AT27C080
ADDRESS
Fig. 5-13
5-8
Samsung Electronics
Circuit Descriptions
5-3-3 Waveform Description
When micom accesses each device sharing bus, it falls the chip select signal of corresponding chip to (/CS1:MIC322, /CS2:MIC2-22, /DSPCS:DIC1-2, /DVD1CS:ZIC1-208, CSB:SIC1-10) 0 (Low) before trial.
So to speak, the bus is used by time-division as shown in Fig 5-14, 5-15, 5-16.
Two and more devices can't be accessed simultaneously.
/CS2
/DSPCS
/DVD1CS
/CSB
/WR
/RD
Fig. 5-14
• CH1 : CS2 (MIC2-22, EPROM CHIP SELECT)
• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)
• CH3 : DVD1CS (ZIC1-208, A/V DECODER CHIP SELECT)
• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)
• CH5 : WR (MIC1-89, MICOM OUTPUT WRITE SIGNAL)
• CH6 : RD (MIC1-88, MICOM OUTPUT READ SIGNAL)
/CS2
/DSPCS
/DVD1CS
/CSB
/WR
/RD
Fig. 5-15 DSP Access
• CH1 : CS2 (MIC2-22, EPROM CHIP SELECT)
• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)
• CH3 : DVD1CS (ZIC1-208, A/V DECODER CHIP SELECT)
• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)
• CH5 : WR (MIC1-89, MICOM OUTPUT WRITE SIGNAL)
• CH6 : RD (MIC1-88, MICOM OUTPUT READ SIGNAL)
Samsung Electronics
5-9
Circuit Descriptions
/CS2
/DSPCS
/DVD1CS
/CSB
/WR
/RD
Fig. 5-16 Servo Access
• CH1 : CS2 (MIC2-22, EPROM CHIP SELECT)
• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)
• CH3 : DVD1CS (ZIC1-208, A/V DECODER CHIP SELECT)
• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)
• CH5 : WR (MIC1-89, MICOM OUTPUT WRITE SIGNAL)
• CH6 : RD (MIC1-88, MICOM OUTPUT READ SIGNAL)
5-10
Samsung Electronics
Circuit Descriptions
5-4 Servo
5-4-1 Outline
SERVO system of DVD is divided into Focusing SERVO, Tracking SERVO, SLED Linked SERVO and CLV
SERVO (DISC Motor Control SERVO).
1) Focusing SERVO
Focuses the optical spot output from object lens onto the disc surface. Maintains a uniform distance between
object lens of Pick-up and disc (for surface vibration of disc).
2) Tracking SERVO
Make the object lens follow the disc track in use of tracking error signal (created from Pick-up).
3) SLED Linked SERVO
When the tracking actuator inclines outwardly as the object lens follows the track during play, the SLED motor
moves slightly (and counteracts the incline).
4) CLV SERVO (DISC Motor Control SERVO)
Controls the disc motor to maintain a constant linear velocity (necessary for RF signal).
5-4-2 Block Diagram
DISC
Fig. 5-17
Samsung Electronics
5-11
Circuit Descriptions
5-4-3 Operation
1) FOCUSING SERVO
(1) FOCUS INPUT
The focus loop is changed from open loop to closed loop, and the triangular waveform moves the object lens up
and down (at pin 75 of SIC1 during Focus SERVO ON.) At that time, S curve is input to pin 65 of SIC1.
ABAD (pin 39 of RIC1) signal, summing signal of PD A, B, C, D, is generated, and zero cross(2.5V) point occurs
when S curve is focused and ABAD signal exceeds a preset,constant value. The focus loop is changed to
closed loop, and the object lens follows the disc movement, maintaining a constant distance from the disc.
(these operations are same in CD and DVD).
Vref
Pin75 of SIC1 (FOD)
Pin65 of SIC1 (FEI)
Vref
Pin39 of RIC1 (ABCD)
1.5V
Fig. 5-18
(2) PLAY
When focus loop closes the loop during focus servo on, both pin 65 and pin 75 of SIC1 are controlled by VREF
voltage (approx. 2.5V), and pin 26, 27 of SIC4 are approximately 4.5V.
2) TRACKING SERVO
(1) NORMAL PLAY MODE
ΠFor DVD
Composite : The signal output from PD A, B, C, D of Pick-up, the tracking error signal (pin36 of RIC1) uses the
phase difference of A+C and B+D in RIC1, and inputs to terminal 64 of SIC1. Then, it is output to SIC1 pin 76 via
digital equalizer, and applied to the tracking actuator through SIC4.
Pins 76 of SIC1 is controlled by VREF(approx. 2.5V) during normal play.
Meanwhile, DVD repeats the track jump from 1 to 4 in inner direction at normal play (because data- read speed
from disc is faster than data output speed on screen).
´ For CD, VCD
Receive the signal output through E, F of Pick-up, from RIC1. The tracking error signal is similar to DVD.
5-12
Samsung Electronics
Circuit Descriptions
(2) SEARCH Mode :
Search mode : Fine seek,(Moving the tracking actuator slightly little below 255 track) and coarse search, moving
much in use of sled motor. The coarse search will be described in sled linked servo and now, the fine seek is
explained shortly.
If the object lens is located near target, cut off the tracking loop and give the control signal as many as desired
count to move the tracking actuator via SIC1 pin 76 terminal(TRD).
3) SLED LINKED SERVO
• Normal play mode
Move SLED motor slightly by means of PWM signal in SIC1 pin 73, as the tracking actuator moves along with
track during play. Control to move the entire Pick-up as the tracking actuator moves.
• Coarse serach mode
In case of long-distance search (such as chapter serach), SIC1 uses MIRR and TZC signal of SIC1-38, 52.
Then, read ID and compute the existing track count after input of next
track. If the existing track count is within fine seek range, tracking begins using fine seek.
4) CLV SERVO(DISC MOTOR CONTROL SERVO)
Input RF signal (from Pick-up) to SIC1 pin 59. Detect SYNC signal from RF in SIC1, and output PWM signal to
SIC1 pin 55 for constant linear velocity.
Samsung Electronics
5-13
Circuit Descriptions
5-5 DVD Data Processor
5-5-1 Outline
DIC1(KS1453) performs Sync detection, EFM demodulation and error correction and Spindle motor control (CLV
control) after inputting sliced EFM signal of RF signal at disc playback and EFM read clock (PLCK) signal generated from PLL. Outputs data which converted to the last audio and video from A/V decoder (ZIC1). KS1453 uses
external memory(4M DRAM) as buffer as well as for error correction and carries out Variable Bit Rate transfer function. VBR function uses the external buffer as buffer to absorb the difference of transfer rate occurring because the
transfer rate of disc playback is faster than data transfer rate demanded by A/V decoder(Video/Audio Signal
Process Chip).
In case of general disc refresh, the memory is almost filled up periodically. It is because Write rate to memory after
disc playback and signal process is faster than Read of A/V decoder. When the memory is filled, this status is reported by interrupt to main micom, which controls the servo to kick back the pick-up to the previous track after memorizing the last data read from disc until now. It takes some times to jump to the previous track and return to the
original(jump location) again. The memory will have an empty space because A/V decoder reads out data of memory.
When the memory has an empty space, where data can be processed and written and the pick-up correctly gets to
the original location(before kick back location) again, it reads data again avoids the interrupt of data read previously. The basic operation repeats to perform as described above.
5-5-2 Block Diagram
DIC2 (KM416C254)
[
D
A
D
R
8.
.
0
[
[
D
D
1
5.
.
0
[
MDP 109
MDS 110
[
R C
A A
S S
Z
R
A
S
Z
C
A
S
W
E
CLOCK 27MHz
CLOCK 33.8688MHz
CLOCK 27MHz
O
E
Z Z
W O
E E
O O
SDATA[7..0]
CSTROBE
DATREQ
DIC1
DATACK
(KS1453)
DTER
MDAT[7:0]
MRZA(3)
ZCS(2)
MWR(128)
MRD(127)
ZIRQZD(126)
1WAIT
14
95
159
[
EFM 116
EFMI
PLCK 104
PLCK
A
8.
.
0
[
[
D
1
5.
.
0
173
172
171
174
69
70
58
71
zIC1
DVD-D[7..0]
VSTROBE
(ZiVA4.1)
REQUEST
HDATA[7..0]
DACK
HADDR[2..0]
*ERR
/CS
/RD
/WR
/INT
ZWAIT
MAD[7..0] INT7(ZIRQZD)
HA[10..8] INT8(/DVDINT)
*RD(88)
*WR(89)
HA0
MIC1 TMP95C265F
Fig. 5-19
5-14
Samsung Electronics
Circuit Descriptions
5-5-3 Waveform Description
It measures the timing that data processed in DIC1 at DVD playback.
STROBE
REQ
DACK
SDATA all
2
2
0
1
0
Fig. 5-20
• CH1 : STROBE (DIC1-69, CLOCK)
• CH2 : REQ (DIC1-70, DATA REQUEST)
• CH3 : DACK (DIC1-58, DATA ACKNOWLEDGE)
• CH4 : SDATA (DIC1-60~67, DATA)
Samsung Electronics
5-15
Circuit Descriptions
5-6 Video
5-6-1 Outline
ZIC1(A/V decoder with video encoder) diverges from the 27MHz crystal, then generates VHSYNC and HSYNC.
ZIC1(A/V decoder with video encoder) does RGB encoding,copy guard processing and D/A conversion of 8bit
video data internally inputted from video decoder block by MIC1 (Micom).
Video signal converted into analog signal is outputted via amplifier of analog part.
(Main Board)
ZIC1
A/V Decoder
ZiVA-4 with
Video Encoder
(Output Board)
Video
data
CVBS
CVBS
Y/B/U
Y
C/R/V
Low Pass Filter
(6MHz)
CVBS
VIC1
Amplifier
BA7660
Y
C
C
CVBS/G/Y
CVBS
R/C
B
G
MIC1
Main Micom
TMP95C265F
SCART JACK
Fig. 6-21 Video Output Block Diagram
5-6-2 NTSC/PAL Digital Encoder (ZIVA-4.1 ; Buit in video encode)
ZIC1 inputted from pin 159 with 27MHz generates HSYNC and VSYNC which are based on video signal.
ZIC1 is synchronous signals with decoded video signal and control the output timing of 8bit video signal of ITUR601 format.
The inputted 8bit data which decoded from video decoder block is demuxed with each 8bit of R, G, B.
The separate signal is encoded to NTSC/PAL by control of MIC1.
The above signals, which are CVBS(Composite Video Burst Synchronized)/G(GREEN)/Y[PIN139],
Y(S_VIDEO)/B(BRUE)/Pb[PIN145] and C(S_VIDEO)/R(RED)/Pr[PIN151], are selectively outputted CVBS
+S_VIDEO, R, G, B by the rear switch.
In Course of encoding,8bit data can extend to 10bit or more. To convert the extended data to quantization noise as
possible,ZIC1 adopts 10bit D/A converter. ZIC1 perform video en-coding as well as copy protection.
5-6-3 Amplifier (VIC1, VIC2 : BA7660)
VIC1 and VIC2 are 6dB amplifier. Based on CVBS signal, the final output level must be 2Vpp without 75ohm terminal resitance. Because the level of video encoder output is only 1.1Vpp, the level is adjusted with the special
amplifier. When mute of pin 1 is high active, if the pin is floating and connecte to power, the output isgnal is
never outputted. CVBS, Y, C, R, G, B outputted from video encoder are inputted to VIC1 (Pin 7,Pin2,Pin4), and
VIC2 (Pin 7,Pin 4,Pin 2) respectively and outputted from VIC1(Pin15,Pin13,Pin10) and VIC2 (Pin 15,Pin 13,Pin 10).
Pin 9, Pin 12, Pin 14 of VIC1, VIC2 are feedback pin to SAG compensation (DC characteristic compensation of
siganl).
The signal to which gain is adjusted by amplifier is outputted from jack via 75ohm Resistance (VR10~VR13,
VR22~24).
5-16
Samsung Electronics
Circuit Descriptions
5-6-4 Scart Jack Output
The SCJ1 of scart jacks is used for connecting a TV.
When the DVD player is turned on, the RGB, CVBS, or S-VIDEO is outputted to SCJ1.
Switching of power on/off is controlled by SCIC3.
The control signal (Pin 9,10,11) of SCIC3 is outputted from Pin 100 and pin 92 of FIC1 and the oin 9, 10 of SCIC3 is
inverted again by SCQ8.
According to the characteristics that SCART Jack is supplied same pins for the output of CVBS signal and Y signal
and for the R signal and C signal, SCIC3 lets the user select two signals in setup menu.
The signal selected by switch is amplified by SIC4 and SIC6 and outputted through the SCART jack.
The scart jack has the function select signal (Pin 8 of SCJ1) that the TV can select automatically RF and the external
video signal.
SCQ3, SCQ7, SCQ18 and SCD4 are the circuit to point, FIC1 (Pin100, pin 94) controls. When the TV aspect ratio is
16:9 or 4:3, it is outputted 4.5 ~ 7V or 9.5 ~ 12V each. But, when the DVD video source is 16:9 and 16:9 wide is selected in setup menu, 4.5 ~ 7V is outputted. Otherwise, 9.5 ~ 12V is outputted.
RGB control signal (Pin 16 of SCJ1) is outputted that the TV can select between RGB and CVBS.
SCQ15, SCQ16 are for RGB control and controlled by FIC1 (Pin 91).
DVD_Y
DVD_CVBS
SCIC3
(14053)
Switch
SCIC4
(NJM2267)
Amplifier
DVD_R/C
DVD_G
DVD_B
CVBS/Y_TV_OUT
R/C_TV_OUT
G_TV_OUT
SCJ1
TV
B_TV_OUT
R/C_TV_OUT
SCIC6 G_TV_OUT
(BA7660)
Amplifier B_TV_OUT
Fig. 5-22 1 Scart Output Block Diagrsm
Samsung Electronics
5-17
Circuit Descriptions
5-7 Audio
5-7-1 Outline
The four data (Data 0~3) outputted from A/V decoder (ZIC1 ; ZiVA4.1) are supplied to DATA 0 for 2-channel
mixed audio output and to DATA 1~3 for Analog audio output (5.1-channel).
The audio data (0~3) transmitted from A/V decoder (ZIC1 ; ZiVA4.1) are converted into analog signal via audio
D/A converter and outputted via post filter and amplifier.
CD and VCD are outputted with only 2 channels audio data and transmit them to Data 0 and Data 1.
Front L/R channel is outputted in mixed audio output (L/R output) and analog audio output and surround L/R,
center and subwoofer aren’t outputted.
If DVD of 2 channels source disc is used, it is outputted by the same way with CD and VCD.
If 5.1-channel source disc, front L/R channel is outputted in Data 1, Surround L/R in Data 2 and Center/Subwoofer in Data 3. At that time, 5.1 channel can be downmixed in 2 channel in Data 0.
Mixed Audio Output (2-Channel)
ZIC1
(ZiVA4.1)
A/V Decoder
DATA0
LRCK
BCK
AIC1
AK4324
D/A CONVERTER
POST
FILTER
POST
FILTER
AMP
L
AMP
R
Fig. 5-23 Audio Output Block Diagram
5-18
Samsung Electronics
Circuit Descriptions
5-7-2 DVD Audio Output
Source Data Types :
MPEG-1,-2, Dolby Digital,
CD-DA, LPCM
ZIC2, 3 (LOCAL DRAM)
ZIC1 (ZiVA4.1 ; A/V DECODER)
HOST or DVD/CD
INTERFACE
IEC-958/1937
OUTPUT PROCESS
AUDIO INPUT
BUFFER
Compressed Data
(MPEG, Dolby Digital),
CD-DA, LPCM
AUDIO DECODER
(MPEG, DOLBY DIGITAL,
CD-DA, LPCM
AUDIO OUTPUT
BUFFER
IEC-958/1937
INTERFACE
RECEIVER
or
DECODER
(IEC-958/1937)
2-Channel LPCM, Decoder
Dolby Digital, Decoded MPEG
Uncompressed 16- or 24-bit
LPCM camples at
fs=44.1,48,96KHz
2-, 4, or 6CHANNEL OUTPUT
PROCESS
DIGITAL AUDIO
INTERFACE
AUDIO
DAC
Fig. 5-24 Audio Decoder and Output Interface Datapath
1) Compressed Data
The audio data inputted to ZIC1 (ZiVA4.1) A/V decoder is divided into compressed data and uncompressed data.
It is compressed data that is compressed with multi-channel audio data such as Dolby digital, MPEG, DTS, etc.
The compressed data inputted to ZIC1 (ZiVA4.1) is converted into the uncompressed data of 2, 4, and 6 channels
through ZiVA4.1 built-in audio decoder and is outputted to Data 0, 1, 2, and 3 through digital audio interface.
The compressed data is transmitted to external AC-3 amplifier or MPEG/DTS amplifier as IEC-958/1937 transmission data format compressed by ZiVA4.1 built-in IEC-958 output process.
2) Uncompressed Data
The uncompressed data is that data isn’t compressed, so it is called CD-DA, LPCM data.
The 2 channels data is converted through audio decoder 2-channel data and Data 0 and Data 1 are outputted in
digital audio interface.Via IEC-958 output process, they is transmitted to digital amplifier or AC-3/MPEG/DTS
amplifier built in the external digital input source with IEC-958/1937 transmission format.
Samsung Electronics
5-19
Circuit Descriptions
MEMO
5-20
Samsung Electronics
Samsung Electronics
A
No focus incoming and
no disc occurs.
Yes
LD is outputted
from object lens at
play key input?
No Disc recognition
No
B
Check open state from
DRIC4 to pick-up.
Yes
DRIC4-1, 2 output
are normal?
Yes
FE in SIC1-65
is within specified range?
A
No focus incoming
No
No
Check DRIC4
Check RIC1 and A, B, C, D input.
6. Troubleshooting
6-1
6-2
Check the Sled Motor and connection
Yes
LED+, SLEDSIC4-32, 33 output are
normal?
Yes
SLD, SIC1-73
output is normal?
No pick-up home positing
No
No
Check SIC4
Check MIC1
Yes
RIC1-28 is 5V?
LD out pick-up replace.
Yes
Current exceeds 0.1A?
Yes
Divide RQ1 emitter terminal
voltage and 5V real voltage
difference into 10ohm.
B
NO LD ON
No
No
Open check in related circuit.
Check MIC1
Troubleshooting
Samsung Electronics
Samsung Electronics
See "Fine Seek Check"
Yes
TE occurs in
search range?
Yes
Actual velocity occurs
at ISC4-32, 33 terminal?
Yes
Actual velocity occurs
at SIC1-73 terminal?
Yes
MIRR, SIC1-38
output is nrmal?
No Search Operation
No
No
No
No
Focus On?
Check SIC4 peripheral circuit.
Check SIC1 peripheral circuit.
Check RIC1 peripheral circuit.
Yes
RFAGCO, RIC1-89
output level is normal?
No
A
Check pick-up.
No
Check SIC1 peripheral circuit.
Yes
Pick-up transfer smooth.
Yes
TE is within
2V and 3V?
Yes
Track incomming is
delayed?
Yes
TZCO signal
(SIC1-52) is occurs?
No
FINE SEEK MIRR
signal (RIC1-57) is missing?
FINE SEEK Check
Check SIC1 Peripheral curcuit.
Check RIC1 Peripheral curcuit.
No
Check RIC1-36 terminal.
No
Check SIC4 peripheral circuit.
Check DCN1 and pick-up.
Yes
SIC4-28, 29
terminal outputs are
normal?
Yes
SIC1-76 output
is normal?
Time out due to many jump counts.
Check MECHA.
No
No
No
No
Yes
Troubleshooting
6-3
6-4
No
No
No
No
Yes
RIC1-86 output
are normal?
Yes
RIC1-88 output
is normal?
Check DRIC1 soldering and power.
Check DIC1, MIC1.
No
Check RIC1 peripheral
circuit and A, B, C, D.
No
Check RIC1 soldering and power.
Check path to RIC1 and SIC1.
After resoldering SIC1.
Check or replace disc motor.
Yes
SIC4-9 signal
MON is "H" ?
Yes
SIC4-2 output (FG)
is normal?
Yes
SPD output is normal?
(SIC1-74)
Yes
Input of RF signal
is normal? (SIC1-59)
Abnormal rotation of
disc motor
Check signal line state from
SIC4-35, 36 to tray motor.
Yes
Check SIC4-35, 36
output at open/close
Yes
MIC1-84, 85 is
Open ; "L", "L" ?
Close ; "H", "H"?
No Tray open/close
No
No
Check SIC4.
Micom (MIC1) error.
Troubleshooting
Samsung Electronics
Samsung Electronics
Check AVJ2 peripheral
soldering shot.
Yes
Base terminal level
of AQ1, AQ3
are "L"?
Yes
AOP1-1, 7 output
is normal?
Yes
Analog output of
AIC1-20, 21, 22, 23 is
normal?
Yes
Normal DATA 0 is
input in AIC1-6?
CD/VCD/DVD L/R output error
(Mixed Audio output)
No
No
No
No
Check FIC1-47 mute.
Check AOP1 peripheral circuit.
Check ZIC1-125
(CD/VCD ; 16.9344MHz,
DVD ; 18.432MHz)
Check ZIC1-121 output.
Check AVJ4, 5 peripheral
soldering shot.
Yes
Output in
AIC3-6, 8, 10 is
normal?
Yes
Output in ZIC1-127 is normal?
Digital output error
No
No
Check AIC3.
Check ZIC1 peripheral circuit.
Troubleshooting
6-5
6-6
Replace PICF1.
No
Pulse is missing
in PICF1-5?
Yes
Voltage exists in
PICF1-4?
Yes
PICF1 Drain (pin 1)
voltage is missing?
Yes
PDS01 voltage
is missing?
No
PFD01 error?
No Power
(Standby LED OFF)
Yes
No
No
No
Yes
Replace PICF1.
Check feed back.
Check PRF11 ~ PRF14.
Check 2d voltage.
Check PRF10.
Replace fuse.
C
Yes
Play works?
Yes
/CS2, /RD, /WR signal occur?
Yes
All clocks (20MHz,
33.8688MHz, 27MHz) of main PCB
oscillate normally?
Yes
All power is measured
correctly and front cable is
properly connected?
Key operation or
remote control error
No
No
No
Yes
Check ZIC1 peripheral unit.
Yes
Check short pin out of micom
common-bus (8-bit).
Check short or operating of micom.
Check soldering of micom and
communication devices.
Yes
Check all clock oscillating parts.
Yes
Check A/V decoder signal process block.
Troubleshooting
Samsung Electronics
Samsung Electronics
Check eith article
"No Front (SET) Operation"
No
MIC1-10, 19
waveform state (0, 1)
changes whenever pressing
front key?
No
MIC7-4, 5 pin is fixed to 0V?
No
MIC1-9 is fixed to 0V?
C
Yes
Yes
Yes
Check MIC1 peripheral soldering.
Check DVD signal process block.
Check A/V decoder signal process block.
If the problem persists ;
Check after replacing Jack PCB,
with another one.
Check other parts for abnormal
front operation persists.
Yes
Key of STOP, PLAY, OPEN
work normally?
No
FIC1 soldering is OK?
Yes
Reset working in
FIC1-12?
Yes
12MHz oscillation (FY1)?
Yes
REF +/-, 5V-all, -28V
power is supplied.
No front (SET) operation
No
No
No
No
No
Check S/W interface.
Check communication status with
main micom
(Check FIC1 pins 27, 73, 74, 75, 95)
Check FIC1 soldering.
Check reset peripheral circuit of FIC2.
Check X-TAL peripheral circuit.
Check power status.
Troubleshooting
6-7
6-8
ZIC1 peripheral soldering
and short check.
Yes
Signals are output
from SIC1-42, 44?
Yes
27MHz clock is
input in DIC1-14?
Yes
No
No
Replace SIC1.
Check 27MHz oscillating part.
D
Yes
Pin 87 in FIC1
is high state?
Yes
VR121 of VSW1
is high state?
Yes
VSW1 video select
switch is up position?
Check DIC1, MIC1 peripheral short.
'NO DISK' appears
after pick-up moves up and
down twice at power on?
No
S-Video output error
DVD play error
No
No
No
Check the connection between
pin 87 in FIC1 and VR121.
Check the soldering of VSW1.
Move the select switch to up position.
Troubleshooting
Samsung Electronics
D
Samsung Electronics
Check the RCA cable.
Yes
Video signal of
about 1V appears at
output jack?
Yes
Peak to peak
voltage level of pin 10
in VIC1 is 2V?
Yes
Pin 1 in VIC1
is in low stste?
Yes
Power is
normal at pin 16
in VIC1?
Yes
Analog signals are
inputted normally
pin 7 in VIC1?
Yes
Analog output
is normal at pin 133
in ZIC1?
Yes
27MHz clock
input is normal at
pin 159 in ZIC1?
Yes
Pin of VDD_2.5 &
VDD-3.3 in Zic1 has
normal level?
CVBS output error
No
No
No
No
No
No
No
No
Check the connection between
VIC1 and output jack.
Check the soldering of VIC1.
Check the connection between
pin 10 in FIC1 and pin 1 in VIC1.
Check the connection betwen
VIC1 and emitter of PQS58.
Check the connection netween
pin 133 in ZIC1 and VIC1.
Check the soldering of ZIC1.
Check the connection between
pin 6 in ZIC4 and pin 129 in ZIC1.
Check the connection between
pin 1 in PCNS1 and pin 3 in ZIC5.
Check the SCART cable.
Yes
RGB signal is
outputed at pin 7, 11, 15
in SCJ1?
Yes
RGB signal is
inputed at pin 2, 4, 7
in SCIC6?
Yes
R signal is
outputed normally at pin 15
in SCIC3?
Yes
RGB signal is
outputed at pin 139, 145,
151 in ZIC1?
Yes
Output voltage at
pin in SCJ1 is in
1V ~ 3V?
Change the SCART output in
setup menu to RGB.
RGB output error at SCJ1
No
No
No
No
No
Check the connection with
pin 10, 13, 15 in SCIC6.
Check the connection with
pin 2, 4, 7 in VIC1.
ΠCheck the connection between
pin 151 in ZIC1 and pin 2 in SCIC3.
´ Check the pin 9, 10, 11 in SCIC3
--> "L" state.
See "Video output error in RCA jacks"
Check the pin 91 in FIC1 --> "H" state.
Check SCQ 15, 16 circuit.
Troubleshooting
6-9
Troubleshooting
MEMO
6-10
Samsung Electronics
7. Exploded View and Parts List
Page
7-1 Cabinet Assembly (DVD-611/611B/615) - - - - - - - - - - - - - - - - - - - - - - - - - - -
7-2
7-2 Cabinet Assembly (DVD-511) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 7-4
7-3 Deck Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 7-6
Samsung Electronics
7-1
7-2
2
1
602 (ASS'Y-PCB-JACK)
701
151
S.N.A. : Service Not Available
151
12
11
CN1A
151
12
151
101
13
152
610
S.N.A. (CABINET-BOTTOM)
S.N.A. (CHASSIS-REAR)
152
601 (ASSY-PCB-MAIN)
150
S.N.A (DECK-DVD MECHA)
l
UT01
150
150
Exploded Views and Parts List
7-1 Cabinet Assembly (DVD-611)
Samsung Electronics
Exploded Views and Parts List
Loc. No
1
2
11
12
13
101
150
151
152
601
602
610
701
CN1A
UT01
Parts No.
AH97-00359B
AH97-00359E
AH97-00359F
AH97-00364B
AH61-00301B
AH64-80001E
AH61-00303A
AH64-00489B
AH64-00489A
6003-000275
6003-000276
6003-000282
AH92-00337K
AH92-00338B
AC39-10019A
AC39-12022K
AH92-00583A
3809-001180
AH59-00056C
Samsung Electronics
Description ; Specification
ASSY FRONT CABINET;DVD-611/XEF,ASSY,XEF
ASSY FRONT CABINET;DVD-611B/XET
ASSY FRONT CABINET;DVD-615/XET
ASSY-DOOR;ASS’Y,DVD-611,XEF
HOLDER-DECK;-,HIPS 94BH,-,GRY,-,DVD-811
FOOT-FRONT;-,ABS94,HB,T2,SIL,H/STAMP,DVD
HOLDER-CORD POWER;-,ABS 94HB,-,BLK,-,DVD
CABINET TOP;-,PCM T0.65,-,-,-,SIL,SV227,
CABINET TOP
SCREW-TAPTITE;BH,+,B,M3,L10,BLK,SWCH1018
SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(YEL),SWC
SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(BLK),SWCH
ASSY PCB-MAIN;DVD-511/XEF,MAIN PCB
ASSY PCB-JACK;DVD-611/XEF,JACK PCB
POWER CORD;KKP-419C,H03VVH2-F,VDE/KEMA-K
POWER-CORD;Y352160,H03VVH2-F,-,BS6500,1.
ASSY PCB-KEY;DVD-611/XAA,KEY PCB
CABLE-FLAT;30V,-30to+80C,80mm,35P,1.25mm
REMOCON-ASS’Y;DVD-611/XEF,SEF,-,-,-,-,-,
Remark
DVD-611
DVD-611B
DVD-615
DVD-611/615
DVD-611B
COMMON
U.K. ONLY
7-3
7-4
2
1
602 (ASS'Y-PCB-JACK)
701
151
S.N.A. : Service Not Available
151
12
11
CN1A
151
12
151
101
13
152
610
S.N.A. (CABINET-BOTTOM)
S.N.A. (CHASSIS-REAR)
152
601 (ASSY-PCB-MAIN)
150
S.N.A (DECK-DVD MECHA)
l
UT01
150
150
Exploded Views and Parts List
7-2 Cabinet Assembly (DVD-511)
Samsung Electronics
Exploded Views and Parts List
Loc. No
1
2
11
12
13
101
150
151
152
601
602
610
701
CN1A
UT01
Parts No.
AH97-00360B
AH97-00365B
AH61-00301B
AH64-80001E
AH61-00303A
AH64-00489B
6003-000275
6003-000276
6003-000282
AH92-00337K
AH92-00338F
AC39-10019A
AC39-12022K
AH92-00582A
3809-001180
AH59-00056C
Samsung Electronics
Description ; Specification
ASSY FRONT CABINET;ASSY,DVD-511/XEF,XEF
ASSY-DOOR;ASS’Y,DVD-511,XEF
HOLDER-DECK;-,HIPS 94BH,-,GRY,-,DVD-811
FOOT-FRONT;-,ABS94,HB,T2,SIL,H/STAMP,DVD
HOLDER-CORD POWER;-,ABS 94HB,-,BLK,-,DVD
CABINET TOP;-,PCM T0.65,-,-,-,SIL,SV227,
SCREW-TAPTITE;BH,+,B,M3,L10,BLK,SWCH1018A
SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(YEL),SWC
SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(BLK),SWCH
ASSY PCB-MAIN;DVD-511/XEF,MAIN PCB
ASSY PCB-JACK;DVD-511/XEF,JACK PCB
POWER CORD;KKP-419C,H03VVH2-F,VDE/KEMA-K
POWER-CORD;Y352160,H03VVH2-F,-,BS6500,1.
ASSY PCB-KEY;DVD-511/XAA,KEY PCB
CABLE-FLAT;30V,-30to+80C,80mm,35P,1.25mm
REMOCON-ASS’Y;DVD-611/XEF,SEF,-,-,-,-,-,
Remark
COMMON
U.K. ONLY
7-5
Exploded Views and Parts List
7-3 Deck Assembly
H107
H103
H102
H100
900
H108
905
H105
H104
H109
H101
H110
H106
2 LD
1 LD
H220
H220
H200
H203
900
901
900
906
H201
H206
H205
H207
H204
H208
H210
904
903
H209
900
H240
H241
900
7-6
Samsung Electronics
Exploded Views and Parts List
Loc. No
900
901
903
904
905
906
H100
H101
H102
H103
H104
H105
H106
H107
H108
H109
H110
H200
H201
H203
H204
H205
H206
H207
H208
H209
H210
H220
H240
H241
Parts No.
6003-001157
6001-001332
6001-001333
6001-001196
BG60-10020A
AH60-00010A
AH61-00391A
AH61-00272A
AH66-00111A
AH66-00080A
AH66-00074A
AH66-00072A
AH31-00015A
AH66-00112A
AH66-00073A
AH66-00079A
AH66-00081A
AH97-00369A
AH97-00369B
AH97-00410A
AH61-50327A
AH66-00075A
AH66-00076A
AC60-30306A
AH31-00017A
AH61-00403A
AH61-00273A
AH31-00016A
AH30-00008A
AJ97-00014A
AH92-00608A
AH92-00609A
3809-001181
Samsung Electronics
Description ; Specification
SCREW-TAPTITE;PWH,+,B,M2,L6,ZPC(YEL),SWR
SCREW-MACHINE;FH,+,M2,L8,ZPC(YEL),SWRCH1
SCREW-MACHINE;SOCKET,HEX,M2.6,L8,ZPC(YEL
SCREW-MACHINE;BH,+-,M2,L4,ZPC(YEL),SWRCH
SCREW-SP MOTOR;-,BHW TOOTH,-,-M1.7,L3SCREW-MACHINE-MOTOR;-,+SWCH18AK,M1.7,L2
HOUSING-ASSY;DP-5,ABS+POM,-,-,-,-,-,-,-,
CHASSIS-HOUSING;-,ABS(SR-0320),-,-,-,-,B
CLAMPER-ASSY;DP-5,POM+MAGNET,-,-,-,DP-5
LEVER-S/W;WHITE,-,-,-,-,-,-,GEAR-HOUSING;-,POM M90-44,-,-,-,-,-,-,-,
PULLEY-GEAR;-,POM M90-44,-,-,MOTOR-LOAD ASSY;-,DP-5,-,BELT-PULLEY;-,CR,T1.5,ID30,-,-,DP-5
GEAR-TRAY;-,POM M90-44,-,-,-,-,-,-,-,SLIDER-HOUSING;DP-5,-,-,-,PBT #2002K,TRAY-DISC;-,ABS(GF) VG4820,-,BLK,-,DP-5
ASSY-P/U DECK;DP-5,-,ASSY-P/U DECK;2LD,DP-5,ASSY-BRKT-SUB;SECC+RUBBER+MOTOR,DP-5,SHAFT-P/U;DP,SUS420J2,OD3,L84.7,S/FINISH
GEAR-FEED A;-,POM M90-44,-,-,-,-,-,-,-,GEAR-FEED B;-,POM M90-44,-,-,-,-,-,-,-,WASHER-SLIT;-,-,ID2.1,OD5.0,T0.5,-,POLYS
MOTOR-SPINDLE ASSY;-,DP-5,-,SPRING-SPINDLE;-,SWPB,-,CS,PI4.9,PI0.7,CHASSIS-SUB;-,ABS(SR-0320),-,-,-,-,BLK,MOTOR-FEED ASSY;-,DP-5,-,PICK UP-ASSY;VALINO(1LD)
ASSY-PICK-UP;SOH-D2A,-,ASSY PCB-DECK;VALINO DECK 1LD
ASSY PCB-DECK;VALINO DECK 2LD
CABLE-FLAT;30V,-30to+80C,80mm,40P,1.25mm
Remark
1 LD (DVD-511)
2 LD (DVD-611/611B/615)
1 LD (DVD-511)
2 LD (DVD-611/611B/615)
1 LD (DVD-511)
2 LD (DVD-611/611B/615)
7-7
Exploded Views and Parts List
MEMO
7-8
Samsung Electronics
8. Electrical Parts List
Loc.No
Part No
601
CN8
DC1
DC10
DC12
DC13
DC14
DC15
DC16
DC2
DC23
DC24
DC3
DC4
DC5
DC7
DCN1
DIC1
DIC2
DIC3
DR1
DR16
DR17
DR18
DR19
DR2
DR20
DR21
DR22
DR3
DR4
DR5
DR7
DR8
DR9
MC1
MC10
MC12
MC13
MC14
MC15
MC16
MC17
MC2
MC3
MC4
MC5
MC6
MC7
MC8
MC9
MIC1
MIC2
MIC3
MIC4
MIC5
MIC6
MIC7
MIC8A
MR1
MR10
MR11
AH92-00337K
3708-001364
2203-005148
2203-000257
2203-000257
2203-000257
2203-000257
2203-001640
2203-000257
2203-005148
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
3708-001085
AH13-10030P
1105-001233
0801-002097
2007-000799
2007-000799
2007-000799
2007-000070
2007-000074
2007-000799
2007-000074
2007-000074
2007-000109
2007-000799
2007-000799
2007-000799
2007-000799
2011-000816
2011-000816
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000626
2203-000426
2203-000426
2203-000257
2203-000626
2203-000257
2203-000257
0903-001185
1102-001090
1106-000401
1103-001204
0801-002097
0801-000411
0801-002517
3704-000472
2007-000090
2007-000074
2007-000074
Samsung Electronics
Description ; Specification
ASSY PCB-MAIN;DVD-511/XEF,MAIN PCB
CONNECTOR-FPC/FC/PIC;35P,1.25MM,STRAIGHT
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;0.39nF,10%,50V,X7R,TP,160
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
CONNECTOR-FPC/FC/PIC;40P,1.25mm,STRAIGHT
IC-ASIC;-,KS1453,TQFP,128P,DATA PRO. I
IC-DRAM;416C256,256KX16BIT,SOJ,40P,400MI
IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-NETWORK;100ohm,5%,63mW,L,CHIP,8P,TP
R-NETWORK;100ohm,5%,63mW,L,CHIP,8P,TP
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;0.018nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;0.018nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
IC-MICROCONTROLLER;95C265,16Bit,LQFP,100
IC-EPROM;27C081,1MX8BIT,DIP,32P,600MIL,1
IC-SRAM;681000,128Kx8BIT,SOP,32P,525MI
IC-EEPROM;24C021,256x8Bit,SOP,8P,150MIL,
IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110
IC-CMOS LOGIC;74HC32,OR GATE,SOP,14P,150
IC-CMOS LOGIC;7SET00,NAND GATE,SOP,5P,63
SOCKET-IC;32P,DIP,SN,2.54mm
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
Remark
Loc.No
COMMON
MR12
MR14
MR15
MR2
MR3
MR4
MR5
MR6
MR7
MR8
MR9
MY1
PC1
PC2
PC3
PC4
PCN1
PE1
PE2
PE3
PE4
RC1
RC10
RC11
RC12
RC13
RC14
RC16
RC17
RC2
RC20
RC21
RC22
RC23
RC24
RC25
RC26
RC27
RC28
RC29
RC3
RC30
RC32
RC33
RC34
RC35
RC36
RC39
RC40
RC41
RC42
RC43
RC44
RC45
RC46
RC47
RC48
RC5
RC50
RC51
RC52
RC53
Part No
2007-000074
2007-000074
2007-000074
2007-000074
2007-000074
2007-000074
2007-000109
2007-000090
2007-000090
2007-000078
2007-000074
2801-000199
2203-000257
2203-000257
2203-000257
2203-000257
3711-003358
2401-002165
2401-002165
2401-002165
2401-002165
2203-005148
2203-000257
2203-005148
2203-000560
2203-000560
2203-005148
2203-005148
2203-005148
2203-005148
2203-005148
2203-000384
2203-005148
2203-005148
2203-001697
2203-005148
2203-005148
2203-005148
2203-001052
2203-005148
2203-005148
2203-005148
2203-005148
2203-005148
2203-005148
2203-000236
2203-000140
2203-000531
2203-000257
2203-005148
2203-005148
2203-005148
2203-000257
2203-001652
2203-001652
2203-005148
2203-001652
2203-005148
2203-005148
2203-005148
2203-005148
2203-005148
Description ; Specification
Remark
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
CRYSTAL-UNIT;20MHz,50ppm,28-AAA,16pF,50o
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
CONNECTOR-HEADER;BOX,8P,1R,2.5mm,STRAIGH
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,
C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;0.082nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608
C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;2.7nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
8-1
Electrical Parts List
Loc.No
RC54
RC55
RC56
RC6
RC7
RC8
RC9
RD1
RD2
RD3
RD6
RE11
RE12
RE13
RE14
RE17
RE2
RE8
RE9
RIC1
RIC3
RL2
RL3
RL4
RL5
RQ1
RQ2
RQ3
RR1
RR10
RR11
RR12
RR13
RR14
RR15
RR16
RR17
RR18
RR19
RR2
RR20
RR21
RR22
RR23
RR24
RR25
RR28
RR29
RR3
RR30
RR31
RR32
RR33
RR34
RR35
RR36
RR37
RR38
RR39
RR4
RR40
RR41
RR43
RR44
RR45
RR46
8-2
Part No
2203-005148
2203-000888
2203-000626
2203-001052
2203-001640
2203-000384
2203-000257
0401-000008
0403-001079
0401-000008
0407-000114
2401-000913
2401-002144
2401-000414
2401-000913
2401-002144
2401-000414
2401-000414
2401-002144
AH13-10030Y
1202-000121
2703-000398
3301-000353
3301-000353
2703-000398
0501-000279
0504-000128
0501-000279
2007-000091
2007-001179
2007-000512
2007-000093
2007-001179
2007-000091
2007-000092
2007-000704
2007-000092
2007-000102
2007-000102
2007-000091
2007-000084
2007-000704
2007-000102
2007-000102
2007-000078
2007-000092
2007-000078
2007-000078
2007-000091
2007-000091
2007-001179
2007-000102
2007-000082
2007-000090
2007-000092
2007-000102
2007-000102
2007-000102
2007-000102
2007-000090
2007-000655
2007-000708
2007-000090
2007-000090
2007-000090
2007-000084
Description ; Specification
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;4.7nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160
C-CERAMIC,CHIP;0.39nF,10%,50V,X7R,TP,160
C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
DIODE-SWITCHING;DAN217,80V,100mA,SOT-23,
DIODE-ZENER;UDZ3.9B,7%,200MW,SOD-323,TP
DIODE-SWITCHING;DAN217,80V,100mA,SOT-23,
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTC-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
IC ASIC;-,KS1461,VQFP,100pin,RF IC
IC-VOLTAGE COMP.;2903,SOP,8P,150MIL,DUAL
INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm
TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW,SOTTR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW,SOTR-CHIP;12Kohm,5%,1/16W,DA,TP,1608
R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;2.4Kohm,5%,1/16W,DA,TP,1608
R-CHIP;20Kohm,5%,1/16W,DA,TP,1608
R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;27Kohm,5%,1/16W,DA,TP,1608
R-CHIP;3.9Kohm,1%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
Remark
Loc.No
RR47
RR48
RR49
RR50
RR51
RR52
RR53
RR57
RR58
RR59
RR6
RR62
RR65
RR68
RR69
RR7
RR70
RR72
RR8
RR80
RR81
RR82
RR83
RR85
RR86
RR87
RR9
SC1
SC10
SC11
SC14
SC15
SC16
SC17
SC18
SC19
SC2
SC20
SC26
SC29
SC3
SC30
SC31
SC32
SC33
SC36
SC38
SC40
SC41
SC44
SC49
SC50
SC51
SC52
SC53
SC55
SC57
SC58
SC59
SC6
SC60
SC61
SC62
SC64
SC65
SC66
Part No
2007-000102
2007-000102
2007-000084
2007-000084
2007-000134
2007-000077
2007-000312
2007-000090
2007-000092
2007-000082
2007-000092
2007-000084
2007-000082
2007-000130
2007-000091
2007-000072
2007-000134
2007-000103
2007-000077
2007-000074
2007-000074
2007-000074
2007-000074
2007-000108
2007-000092
2007-000084
2007-000312
2203-000257
2203-001222
2203-005148
2203-000491
2203-001052
2203-005148
2203-000560
2203-005148
2203-000140
2203-001573
2203-001640
2203-002398
2203-000372
2203-001573
2203-000372
2203-000491
2203-000491
2203-005148
2203-005148
2203-005148
2203-005148
2203-000560
2203-002398
2203-005148
2203-005148
2203-005148
2203-005148
2203-000257
2203-005148
2203-005148
2203-005148
2203-005148
2203-005148
2203-005148
2203-005148
2203-005148
2203-000626
2203-000626
2203-000257
Description ; Specification
Remark
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;33Kohm,5%,1/16W,DA,TP,1608
R-CHIP;470ohm,5%,1/16W,DA,TP,1608
R-CHIP;10OHM,5%,1/8W,DA,TP,3216
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608
R-CHIP;39Kohm,5%,1/16W,DA,TP,1608
R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
R-CHIP;47ohm,5%,1/16W,DA,TP,1608
R-CHIP;33Kohm,5%,1/16W,DA,TP,1608
R-CHIP;120Kohm,5%,1/16W,DA,TP,1608
R-CHIP;470ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;510Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10OHM,5%,1/8W,DA,TP,3216
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;820pF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;0.012nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;0.39nF,10%,50V,X7R,TP,160
C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;15nF,10%,50V,X7R,TP,1608,
C-CERAMIC,CHIP;0.012nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;15nF,10%,50V,X7R,TP,1608,
C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,
C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
Samsung Electronics
Electrical Parts List
Loc.No
SC68
SC7
SC9
SD2
SD3
SE1
SE2
SE3
SE5
SE53
SE54
SE55
SE56
SE63
SIC1
SIC3
SIC4
SIC8
SL2
SL4
SQ1
SQ2
SR1
SR10
SR11
SR12
SR14
SR15
SR16
SR17
SR18
SR19
SR2
SR20
SR21
SR22
SR23
SR24
SR25
SR26
SR3
SR32
SR33
SR34
SR35
SR36
SR37
SR38
SR39
SR4
SR40
SR41
SR42
SR43
SR44
SR45
SR47
SR5
SR52
SR53
SR6
SR60
SR67
SR68
SR7
SR70
Part No
2203-005148
2203-005148
2203-000560
0407-000114
0407-000114
2401-002165
2401-002144
2401-002165
2401-000913
2401-002144
2401-002075
2401-002075
2401-002075
2401-000414
AH13-10030N
0801-002097
1003-001298
AH14-10004T
3301-000353
3301-000353
0504-000128
0504-000156
2007-000090
2007-000084
2007-000107
2007-001235
2007-000450
2007-000102
2007-000131
2007-000081
2007-000093
2007-000092
2007-000109
2007-000092
2007-000070
2007-000070
2007-000130
2007-000070
2007-000074
2007-000091
2007-000090
2007-000080
2007-000080
2007-000124
2007-000124
2007-000124
2007-000124
2007-000092
2007-000090
2007-000090
2007-000101
2007-000084
2007-000090
2007-000106
2007-000098
2007-000655
2007-000070
2007-001179
2007-000704
2007-000123
2007-000098
2007-000097
2007-000034
2007-000034
2007-000799
2007-000090
Samsung Electronics
Description ; Specification
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTC-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;4.7uF,20%,50V,GP,TP,5x11,5
C-AL;4.7uF,20%,50V,GP,TP,5x11,5
C-AL;4.7uF,20%,50V,GP,TP,5x11,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
IC-ASIC;-,KS1452,QFP,80P,DSSP IC
IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110
IC-MOTOR DRIVER;KA3017,HQFP,48P,550MIL,1
IC-ANALOG M/PLEXER;MC14053BD,SOP,TAPE 16
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;470Kohm,5%,1/16W,DA,TP,1608
R-CHIP;910Kohm,5%,1/16W,DA,TP,1608
R-CHIP;180ohm,5%,1/16W,DA,TP,1608
R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R-CHIP;91Kohm,5%,1/16W,DA,TP,1608
R-CHIP;2.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;20Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;39Kohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;82Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;220Kohm,5%,1/16W,DA,TP,1608
R-CHIP;56Kohm,5%,1/16W,DA,TP,1608
R-CHIP;27Kohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608
R-CHIP;56Kohm,5%,1/16W,DA,TP,1608
R-CHIP;47Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1OHM,5%,1/8W,DA,TP,3216
R-CHIP;1OHM,5%,1/8W,DA,TP,3216
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
Remark
Loc.No
SR71
SR73
SR74
SR75
SR76
SR77
SR80
SR81
SR82
SR83
SR84
SR85
SR9
SY1
VR1
ZC1
ZC10
ZC11
ZC12
ZC13
ZC14
ZC15
ZC16
ZC17
ZC18
ZC19
ZC2
ZC29
ZC3
ZC37
ZC38
ZC39
ZC4
ZC40
ZC41
ZC42
ZC43
ZC44
ZC45
ZC46
ZC47
ZC48
ZC49
ZC5
ZC50
ZC51
ZC58
ZC59
ZC6
ZC60
ZC61
ZC62
ZC63
ZC65
ZC66
ZC67
ZC68
ZC69
ZC7
ZC70
ZC71
ZC72
ZC73
ZC74
ZC75
ZC76
Part No
2007-000090
2007-000090
2007-000090
2007-000092
2007-000616
2007-001179
2007-000074
2007-000074
2007-000074
2007-000074
2007-000070
2007-000074
2007-000084
2801-000261
2104-001068
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-005148
2203-000257
2203-005148
2203-000257
2203-000257
2203-000626
2203-000257
2203-000257
2203-000257
2203-001652
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000626
2203-000257
2203-000257
2203-000440
2203-005148
2203-000626
2203-000681
2007-000070
2203-000681
2203-000626
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
2203-000257
Description ; Specification
Remark
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
R-CHIP;24Kohm,5%,1/16W,DA,TP,1608
R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
CRYSTAL-UNIT;33.8688MHZ,50PPM,28-AAA,12P
VR-SMD;10Kohm,25%,1/20W,TOP
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,160
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
8-3
Electrical Parts List
Loc.No
ZC77
ZC78
ZC8
ZC9
ZE30
ZE34
ZE35
ZE36
ZE37
ZIC1
ZIC2
ZIC3
ZIC4
ZIC5
ZL10
ZL11
ZL12
ZL2
ZL6
ZL7
ZL9
ZR1
ZR16
ZR17
ZR18
ZR23
ZR27
ZR28
ZR29
ZR30
ZR31
ZR32
ZR33
ZR34
ZR35
ZR37
ZR38
ZR68
ZR69
ZR70
ZR71
ZR72
ZR73
ZR75
ZR76
ZR77
ZR78
ZR79
ZR82
ZR84
ZR86
ZR88
ZR89
ZR90
ZR91
ZR92
ZR93
ZY1
8-4
Part No
2203-000426
2203-000626
2203-000257
2203-000257
2401-000414
2401-000414
2401-002144
2401-000414
2401-000414
1204-001673
1105-001268
1105-001268
AH14-10004R
0402-000309
2703-000398
3301-000353
2703-000398
3301-000353
3301-000353
3301-000353
3301-000353
2007-001164
2007-000074
2007-000074
2007-000074
2007-000078
2007-000084
2007-000084
2007-000078
2011-000475
2011-000475
2011-000475
2011-000475
2007-000113
2007-000070
2007-000113
2007-000074
2007-000078
2007-000070
2007-000070
2007-000070
2011-000816
2007-000078
2007-001164
2007-001164
2007-001164
2007-001164
2007-007332
2007-000799
2007-000078
2007-000078
2007-000078
2007-000109
2007-000070
2007-000074
2007-000074
2007-000074
2801-003554
Description ; Specification
C-CERAMIC,CHIP;0.018nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
IC-DECODER;ZIVA4.1,QFP,208P,1100MIL,PLAS
IC-DRAM;3617161,16BIT,TSOP,50P,-,7NS,3
IC-DRAM;3617161,16BIT,TSOP,50P,-,7NS,3
IC;M74HCU04,SOP,TAPE 14P
DIODE-RECTIFIER;1SR154-400,400V,1A,PSM
INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,R-CHIP;75ohm,1%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-NETWORK;33ohm,5%,63mW,L,CHIP,8P,TP
R-NETWORK;33ohm,5%,63mW,L,CHIP,8P,TP
R-NETWORK;33ohm,5%,63mW,L,CHIP,8P,TP
R-NETWORK;33ohm,5%,63mW,L,CHIP,8P,TP
R-CHIP;33ohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;33ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-NETWORK;100ohm,5%,63mW,L,CHIP,8P,TP
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;75ohm,1%,1/16W,DA,TP,1608
R-CHIP;75ohm,1%,1/16W,DA,TP,1608
R-CHIP;75ohm,1%,1/16W,DA,TP,1608
R-CHIP;75ohm,1%,1/16W,DA,TP,1608
R-CHIP;1.18KOHM,1%,1/10W,DA,TP,2012
R-CHIP;360ohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
R-CHIP;0ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
R-CHIP;100ohm,5%,1/16W,DA,TP,1608
CRYSTAL-UNIT;27MHz,10ppm,28-AAM,12pF,40o
Remark
Loc.No
602
AC10
AC11
AC13
AC14
AC15
AC201
AC202
AC203
AC4
AC5
AC6
AC7
AC8
AC9
AD51
AD54
AD55
AD60
AE1
AE17
AE2
AE21
AE22
AE3
AE51
AE52
AE6
AE9
AIC1
AIC3
AL1
AL2
AL201
AOP1
AQ1
AQ3
AQ51
AQ52
AQ55
AQ56
AQ57
AR10
AR11
AR14
AR15
AR16
AR17
AR18
AR19
AR2
AR201
AR202
AR203
AR21
AR22
AR24
AR26
AR28
AR29
AR3
AR30
AR31
AR32
AR33
AR35
Part No
AH92-00338B
2203-000192
2301-000423
2301-000423
2301-000402
2301-000402
2203-000192
2203-000260
2203-000260
2202-002037
2202-002037
2202-002037
2301-000402
2301-000402
2203-000192
0407-000114
0401-000101
0401-000101
0407-000116
2401-002042
2401-000598
2401-002042
2401-002144
2401-002144
2401-002042
2401-001969
2401-000302
2401-000414
2401-000414
1002-001213
AH14-10004R
3301-000353
3301-000353
2901-001125
1201-000163
0501-000341
0501-000341
0504-000128
0504-000156
0504-000118
0504-000118
0504-001003
2007-000267
2001-000258
2007-000468
2007-000468
2007-000468
2007-000468
2007-000221
2007-000221
2001-000258
2007-000766
2007-001247
2001-000515
2001-000290
2001-000515
2001-000515
2001-000429
2007-000468
2007-000468
2007-000468
2007-000468
2007-000468
2007-000221
2007-000221
2001-000290
Description ; Specification
Remark
ASSY PCB-JACK;DVD-611/XEF,JACK PCB DVD-611/611B/615
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-FILM,PEF;3.3NF,5%,100V,TP,7X10X4.5MM,5
C-FILM,PEF;3.3NF,5%,100V,TP,7X10X4.5MM,5
C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-ARRAY;DAP202K,80V,100mA,CK2-3,SOTC-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;1uF,20%,50V,GP,TP,4x7,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;470uF,20%,25V,GP,TP,10x12.5,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
IC-D/A CONVERTER;AK4393VF,24BIT,SOP,28P,
IC;M74HCU04,SOP,TAPE 14P
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,FILTER-EMI ON BOARD;50V,0.5A,-,220pF,7x2
IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m
TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR2003,PNP,300MW,22K/22K,TOR-CHIP;1.8KOHM,5%,1/10W,DA,TP,2012
R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;330OHM,5%,1/10W,DA,TP,2012
R-CHIP;91OHM,5%,1/10W,DA,TP,2012
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
Samsung Electronics
Electrical Parts List
Loc.No
Part No
AR36
AR38
AR4
AR40
AR5
AR51
AR54
AR55
AR56
AR6
AR7
AR8
AR9
AVJ2
AVJ4
AVJ5
AZD51
CN1
CN1A
CN3
FC10
FC14
FC15
FC16
FC2
FC3
FC4
FC6
FC7
FD10
FD6
FD7
FD8
FD9
FE1
FE12
FE5
FE8
FIC1
FIC2
FIC4
FL2
FR1
FR10
FR101
FR102
FR103
FR104
FR105
FR106
FR11
FR12
FR13
FR16
FR17
FR18
FR19
FR20
FR21
FR24
FR25
FR26
FR2S
FR31
FR32
FR33
2001-000515
2001-000515
2007-000468
2001-000429
2001-000429
2001-000429
2001-000281
2001-000241
2001-000281
2001-000429
2001-000429
2001-000429
2007-000267
3722-001467
3722-001053
3707-001005
0403-000551
3708-001364
3809-001180
AH39-00179A
2202-000797
2202-000797
2202-000797
2203-000444
2202-000162
2202-000162
2202-000797
2202-000797
2202-002037
0401-000101
0401-000101
0401-000101
0401-000101
0403-000551
2401-000922
2401-001475
2401-002144
2401-001507
AH09-00034A
1203-001252
AH59-00010A
2701-000114
2001-000273
2001-000281
2001-000273
2001-000273
2001-000273
2001-000273
2001-000273
2001-000273
2001-000281
2001-000281
2001-000281
2001-000027
2001-000027
2007-000493
2001-000449
2001-000449
2001-000435
2001-000281
2007-000029
2001-000281
2007-000029
2001-000273
2001-000273
2001-000273
Samsung Electronics
Description ; Specification
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1.5KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;1.8KOHM,5%,1/10W,DA,TP,2012
JACK-RCA;3P,3.2mm,NI,BLK,JACK-RCA;1P,3.2mm,NI,BLK,CONNECTOR-OPTICAL;PLUG,SM,-,4.4/2.0MM
DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500m
CONNECTOR-FPC/FC/PIC;35P,1.25MM,STRAIGHT
CABLE-FLAT;30V,-30to+80C,80mm,35P,1.25mm
CONNECT WIRE;-,-,-,-,#26,-,-,-,-,-,-,-,1
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,C-CERAMIC,MLC-AXIAL;.015NF,5%,50V,SL,TP,
C-CERAMIC,MLC-AXIAL;.015NF,5%,50V,SL,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500m
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;47uF,20%,10V,GP,TP,6.3x5,5mm
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,6.3x5,5
IC MICOM;LC866232A,SANYO,100PIN,QFP,QFP
IC-VOL. DETECTOR;7545,TO-92,3P,-,PLASTIC
MODULE-REMOCON;-,-,37.9KHZ,940NM,-,-,INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CHIP;2.2KOHM,5%,1/10W,DA,TP,2012
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;1MOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
Remark
Loc.No
FR34
FR35
FR36
FR37
FR43
FR44
FR45
FR46
FR4S
FR5
FR51
FR52
FR7
FY1
HC3
HC4
HE3
HE4
HOP2
HR10
HR15
HR16
HR9
JP266
JP281
JP347
JP383
JP385
JP58
JP80
JP81
JP91
PBD11
PBF11
PBS01
PCD01
PCD02
PCD03
PCD12
PCF01
PCF02
PCF11
PCF13
PCNS1
PCNS2
PCS03
PCS31
PCS32
PDD35
PDF01
PDF12
PDF13
PDL51
PDL52
PDL55
PDS01
PDS02
PDS03
PDS04
PDS11
PDS31
PDS32
PDS33
PDS34
PDS36
PDS51
Part No
2001-000273
2001-000273
2001-000273
2001-000273
2001-000793
2001-000429
2001-000429
2001-000273
2007-000029
2001-000325
2007-000029
2007-000029
2007-000282
2802-000108
2202-002037
2202-002037
2401-002075
2401-002075
1201-000163
2007-000282
2001-000515
2001-000515
2007-000282
2007-000033
2007-000033
2008-000141
2001-000780
2007-000033
2701-000114
2007-000033
2007-000033
2008-000141
3301-000297
3301-000297
3301-000297
2201-000916
2201-000812
2201-000812
2201-000129
2305-001021
2305-001021
2305-001029
2201-000376
AH39-00177A
3711-000178
2201-000916
2301-000381
2203-000192
0402-001195
0402-001196
0402-001195
0402-001195
0401-000101
0401-000101
0401-000101
0402-001196
0402-001196
0402-001196
0402-001196
0402-000276
0402-001195
0402-001194
0404-001097
0404-001097
0402-001195
0401-000101
Description ; Specification
Remark
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;47OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CARBON;120OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
RESONATOR-CERAMIC;12MHZ,0.5%,BK,10.0X5.0
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-AL;4.7uF,20%,50V,GP,TP,5x11,5
C-AL;4.7uF,20%,50V,GP,TP,5x11,5
IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
R-FUSIBLE;2.2ohm,5%,1/4W,AA,TP,2.6x6.7mm
R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
R-FUSIBLE;2.2ohm,5%,1/4W,AA,TP,2.6x6.7mm
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10x
C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,12.
C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,12.
C-CERAMIC,DISC;0.1nF,10%,1kV,Y5P,TP,7x4,
C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.
C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.
C-FILM,MPEF;10nF,10%,630V,TP,12x9x12.5,5
C-CERAMIC,DISC;0.22nF,5%,50V,SL,TP,6.3x3
CONNECT WIRE;-,-,-,-,#24,-,-,-,-,-,-,-,1
CONNECTOR-HEADER;1WALL,2P,1R,3.96mm,STRA
C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10x
C-FILM,PEF;10nF,5%,50V,TP,6.5x5.5x3mm,5m
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;UF4007,1KV,1A,DO-41,TP
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-RECTIFIER;UG2D,200V,2A,DO-204AC,TP
DIODE-SCHOTTKY;SG45,45V,7500mA,TO-220A,B
DIODE-SCHOTTKY;SG45,45V,7500mA,TO-220A,B
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
8-5
Electrical Parts List
Loc.No
Part No
PDS52
PEF10
PEF12
PES31
PES32
PES33
PES34
PES35
PES36
PES37
PES51
PES52
PES53
PES54
PES56
PES57
PES58
PFD01
PICF1
PICS1
PICS2
PICS3
PICS4
PICS5
PLF01
PLS01
PLS31
POWER
PQL51
PQL52
PQL53
PQL54
PQL55
PQL56
PQL57
PQL58
PQS55
PQS56
PQS57
PQS58
PRD31
PRD32
PRF10
PRF11
PRF12
PRF13
PRF14
PRF15
PRF16
PRF17
PRF19
PRF20
PRL51
PRL52
PRL53
PRL54
PRL55
PRL56
PRL57
PRL58
PRS11
PRS12
PRS31
PRS32
PRS33
PRS34
0402-000132
2401-001682
2401-002608
2401-000302
2401-000302
2401-000118
2401-000118
2401-003046
2401-001353
2401-002042
2401-002144
2401-000598
2401-000302
2401-002144
2401-000302
2401-000302
2401-001353
3601-001123
1203-001802
0604-000186
AC14-12006D
1203-000122
1203-001697
1203-001083
AC29-30050A
AC29-30050C
AC27-12001N
0601-001447
0504-000152
0501-000442
0504-000152
0501-000442
0501-000442
0504-000152
0504-000126
0501-000303
0504-000152
0504-000128
0501-000616
0501-000616
2007-000468
2007-000931
2006-000262
2001-000076
2001-000076
2001-000076
2001-000076
2001-000096
2001-000938
2001-000591
2001-000429
2003-000105
2001-000449
2001-000290
2001-000449
2001-000290
2001-000290
2001-000449
2001-000273
2001-000449
2003-000273
2003-000273
2001-000440
2007-000468
2004-000869
2004-000459
8-6
Description ; Specification
DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TP
C-AL;82uF,20%,400V,GP,BK,22x25,10
C-AL;33uF,20%,35V,GP,TP,5x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;1000uF,20%,10V,GP,TP,10x12.5,5
C-AL;1000uF,20%,10V,GP,TP,10x12.5,5
C-AL;47uF,20%,50V,WT,TP,6.3x11,2.5
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;1uF,20%,50V,GP,TP,4x7,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
FUSE-CARTRIDGE;250V,1.6A,TIME-LAG,CERAMI
IC-PWM CONTROLLER;STR-G6551,TO-220F,5P,PHOTO-COUPLER;TR,-,200mW,DIP-4,ST
IC;KA431Z,TO-92,TAPING
IC-NEGA.FIXED REG.;7908,TO-220,3P,-,PLAS
IC-VOLTAGE REGULATOR;78R08,TO-220,4P,-,P
IC-VOLTAGE REGULATOR;3RF23,TO-202,4P,12.
FILTER-LINE NOISE;-,400UH,-,250V,FILTER-LINE NOISE;-,25MH,0.35A,AC250V,BS
COIL-CHOKE;10UH-15%,RA,K-30,Q80,150KHZ,LED;ROUND,RED,3.1mm,650nm
TR-DIGITAL;KSR2101,PNP,200MW,4.7K/4.7K,S
TR-SMALL SIGNAL;KTC3203-Y,NPN,400MW,T0-9
TR-DIGITAL;KSR2101,PNP,200MW,4.7K/4.7K,S
TR-SMALL SIGNAL;KTC3203-Y,NPN,400MW,T0-9
TR-SMALL SIGNAL;KTC3203-Y,NPN,400MW,T0-9
TR-DIGITAL;KSR2101,PNP,200MW,4.7K/4.7K,S
TR-DIGITAL;KSR1101,NPN,200MW,4.7K/4.7K,S
TR-SMALL SIGNAL;KSA733,PNP,250mW,TO-92,T
TR-DIGITAL;KSR2101,PNP,200MW,4.7K/4.7K,S
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-SMALL SIGNAL;KSC2328A-Y,NPN,1W,TO-92L
TR-SMALL SIGNAL;KSC2328A-Y,NPN,1W,TO-92L
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;470OHM,5%,1/10W,DA,TP,2012
R-CEMENT;2.7ohm,10%,2W,CB,TP,7.5x11x20.
R-CARBON;47KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;47KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;47KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;47KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON(S);1MOHM,5%,1/2W,AA,TP,2.4X6.4M
R-CARBON;68OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-METAL OXIDE;0.33ohm,5%,2W,AD,TP,6x16mm
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-METAL OXIDE;33Kohm,5%,2W,AA,TP,6x16mm
R-METAL OXIDE;33Kohm,5%,2W,AA,TP,6x16mm
R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-METAL;3Kohm,1%,1/8W,AA,TP,1.8x3.2mm
R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x3.2m
Remark
Loc.No
PRS54
PRS55
PRS56
PTD1
PVA1
PZS51
SCC11
SCC12
SCC14
SCC3
SCC4
SCC7
SCC8
SCD1
SCD3
SCD4
SCE10
SCE11
SCE12
SCE13
SCE14
SCE15
SCE16
SCE17
SCE4
SCE5
SCE6
SCIC3
SCIC4
SCIC6
SCJ1
SCL1
SCL11
SCL2
SCQ15
SCQ16
SCQ18
SCQ3
SCQ7
SCQ8
SCR1
SCR15
SCR19
SCR20
SCR23
SCR24
SCR25
SCR35
SCR36
SCR37
SCR4
SCR46
SCR5
SCR60
SCR61
SCR63
SCR65
SCR76
SVJ1
SW1
VC1
VC10
VC106
VC11
VC12
VC13
Part No
2001-000449
2001-000062
2001-000429
AC26-00001M
1405-000186
0403-000717
2203-000192
2203-000192
2203-000192
2203-000239
2203-000239
2203-000239
2203-000239
0407-000114
0407-000114
0403-000297
2401-001479
2401-000913
2401-001479
2401-000913
2401-001479
2401-000913
2401-002042
2401-001353
2401-002075
2401-000913
2401-000369
AH14-10004T
1201-001063
1201-001419
3722-001359
2701-000181
3301-000353
2701-000181
0504-000156
0504-000128
0504-000128
0504-000128
0501-000314
0504-000128
2001-000734
2001-000969
2007-000030
2007-000030
2007-001201
2007-001201
2007-001166
2007-001166
2007-001166
2007-001166
2007-000981
2007-000290
2007-000686
2007-000029
2007-000029
2007-000029
2007-000029
2007-000468
3722-001375
3404-000160
2202-000205
2202-000791
2203-000260
2202-000851
2202-000231
2202-000791
Description ; Specification
Remark
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;470OHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
TRANS-SWITCHING;-,-,-,100V-240V,DEMCO,EE
VARISTOR;470V,4500A,17x12mm,TP
DIODE-ZENER;MTZJ5.1B,5.1V,4.94-5.2V,500m
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-ZENER;MTZ6.2B,6.2V,5.96-6.27V,500m
C-AL;470uF,20%,10V,GP,TP,-,C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;470uF,20%,10V,GP,TP,-,C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;470uF,20%,10V,GP,TP,-,C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;4.7uF,20%,50V,GP,TP,5x11,5
C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;100uF,20%,6.3V,GP,-,6.3x11,5
IC-ANALOG M/PLEXER;MC14053BD,SOP,TAPE 16
IC-OP AMP;2267,SOP,8P,300MIL,DUAL,6.7dB,
IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,
JACK-SCART;21P,-,SN,BLK,#20-28
INDUCTOR-AXIAL;33uH,5%,2.4x3.4mm
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,INDUCTOR-AXIAL;33uH,5%,2.4x3.4mm
TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-SMALL SIGNAL;KSA812,PNP,150mW,SOT-23,
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;560OHM,5%,1/10W,DA,TP,2012
R-CHIP;560OHM,5%,1/10W,DA,TP,2012
R-CHIP;820OHM,5%,1/10W,DA,TP,2012
R-CHIP;820OHM,5%,1/10W,DA,TP,2012
R-CHIP;75OHM,5%,1/10W,DA,TP,2012
R-CHIP;75OHM,5%,1/10W,DA,TP,2012
R-CHIP;75OHM,5%,1/10W,DA,TP,2012
R-CHIP;75OHM,5%,1/10W,DA,TP,2012
R-CHIP;5.6KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100OHM,5%,1/10W,DA,TP,2012
R-CHIP;3.3KOHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
JACK-DIN;4P,-,NI,BLK,SWITCH-TACT;12V,50mA,160gf+-50gf,6.55x7.
C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
Samsung Electronics
Electrical Parts List
Loc.No
VC14
VC16
VC17
VC18
VC19
VC21
VC22
VC3
VC4
VC5
VC6
VC8
VC9
VE5
VE6
VE7
VE8
VE9
VFD1
VIC1
VL1
VL112
VL2
VL3
VL4
VL5
VL6
VL7
VL8
VR10
VR10S
VR11
VR12
VR121
VR122
VR123
VR7
VR8
VR9
VSW1
Part No
2202-000205
2202-002037
2203-000192
2202-000231
2202-000791
2202-000205
2202-000851
2202-000851
2202-000231
2202-000791
2202-000205
2202-000851
2202-000231
2401-001353
2401-000913
2401-001353
2401-000913
2401-002042
AH07-00024A
1201-001419
2701-000238
3301-000353
2701-000238
2701-000238
2701-000238
2701-000238
2701-000238
2701-000238
2701-000238
2001-000969
2001-001006
2001-000969
2001-000969
2001-000515
2007-000572
2001-000290
2001-001006
2001-001006
2001-001006
AH34-00010A
Samsung Electronics
Description ; Specification
C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
VF DISPLAY;HNV-11SS19,21SEG,74X9.0mm,DVD
IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;220OHM,5%,1/10W,DA,TP,2012
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
SWITCH SLIDE;-,50V DC,-,-,100MOHM,-,-,-,
Remark
Loc.No
602
AC10
AC11
AC13
AC14
AC15
AC201
AC202
AC203
AC4
AC5
AC6
AC7
AC8
AC9
AD51
AD54
AD55
AD60
AE1
AE17
AE2
AE21
AE22
AE3
AE51
AE52
AE6
AE9
AIC1
AIC3
AL1
AL2
AL201
AOP1
AQ1
AQ3
AQ51
AQ52
AQ55
AQ56
AQ57
AR10
AR11
AR14
AR15
AR16
AR17
AR18
AR19
AR2
AR201
AR202
AR203
AR21
AR22
AR24
AR26
AR28
AR29
AR30
AR31
AR32
AR33
AR35
AR36
Part No
AH92-00338F
2203-000192
2301-000423
2301-000423
2301-000402
2301-000402
2203-000192
2203-000260
2203-000260
2202-002037
2202-002037
2202-002037
2301-000402
2301-000402
2203-000192
0407-000114
0401-000101
0401-000101
0407-000116
2401-002042
2401-000598
2401-002042
2401-002144
2401-002144
2401-002042
2401-001969
2401-000302
2401-000414
2401-000414
1002-001213
AH14-10004R
3301-000353
3301-000353
2901-001125
1201-000163
0501-000341
0501-000341
0504-000128
0504-000156
0504-000118
0504-000118
0504-001003
2007-000267
2001-000258
2007-000468
2007-000468
2007-000468
2007-000468
2007-000221
2007-000221
2001-000258
2007-000766
2007-001247
2001-000515
2001-000290
2001-000515
2001-000515
2001-000429
2007-000468
2007-000468
2007-000468
2007-000468
2007-000221
2007-000221
2001-000290
2001-000515
Description ; Specification
ASSY PCB-JACK;DVD-511/XEF,JACK PCB
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-FILM,PEF;3.3NF,5%,100V,TP,7X10X4.5MM,5
C-FILM,PEF;3.3NF,5%,100V,TP,7X10X4.5MM,5
C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-ARRAY;DAP202K,80V,100mA,CK2-3,SOTC-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;1uF,20%,50V,GP,TP,4x7,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;470uF,20%,25V,GP,TP,10x12.5,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
IC-D/A CONVERTER;AK4393VF,24BIT,SOP,28P,
IC;M74HCU04,SOP,TAPE 14P
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,FILTER-EMI ON BOARD;50V,0.5A,-,220pF,7x2
IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m
TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOTTR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TOTR-DIGITAL;KSR2003,PNP,300MW,22K/22K,TOR-CHIP;1.8KOHM,5%,1/10W,DA,TP,2012
R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;330OHM,5%,1/10W,DA,TP,2012
R-CHIP;91OHM,5%,1/10W,DA,TP,2012
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
Remark
DVD-511
8-7
Electrical Parts List
Loc.No
Part No
AR38
AR40
AR5
AR51
AR54
AR55
AR56
AR6
AR7
AR8
AR9
AVJ2
AVJ4
AVJ5
AZD51
CN1
CN1A
CN3
FC10
FC14
FC15
FC16
FC2
FC3
FC4A
FC6
FC7
FD10
FD6
FD7
FD8
FD9
FE1
FE12
FE5
FE8
FIC1
FIC2
FIC4
FL2
FR1
FR10
FR101
FR102
FR103
FR104
FR105
FR106
FR11
FR12
FR13
FR16
FR17
FR18
FR19
FR20
FR21
FR24
FR25
FR26
FR2S
FR31
FR32
FR33
FR34
FR35
2001-000515
2001-000429
2001-000429
2001-000429
2001-000281
2001-000241
2001-000281
2001-000429
2001-000429
2001-000429
2007-000267
3722-001467
3722-001053
3707-001005
0403-000551
3708-001364
3809-001180
AH39-00179A
2202-000797
2202-000797
2202-000797
2203-000444
2202-000162
2202-000162
2203-000260
2202-000797
2202-002037
0401-000101
0401-000101
0401-000101
0401-000101
0403-000551
2401-000922
2401-001475
2401-002144
2401-001507
AH09-00034A
1203-001252
AH59-00010A
2701-000114
2001-000273
2001-000281
2001-000273
2001-000273
2001-000273
2001-000273
2001-000273
2001-000273
2001-000281
2001-000281
2001-000281
2001-000027
2001-000027
2007-000493
2001-000449
2001-000449
2001-000435
2001-000281
2007-000029
2001-000281
2007-000029
2001-000273
2001-000273
2001-000273
2001-000273
2001-000273
8-8
Description ; Specification
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1.5KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;1.8KOHM,5%,1/10W,DA,TP,2012
JACK-RCA;3P,3.2mm,NI,BLK,JACK-RCA;1P,3.2mm,NI,BLK,CONNECTOR-OPTICAL;PLUG,SM,-,4.4/2.0MM
DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500m
CONNECTOR-FPC/FC/PIC;35P,1.25MM,STRAIGHT
CABLE-FLAT;30V,-30to+80C,80mm,35P,1.25mm
CONNECT WIRE;-,-,-,-,#26,-,-,-,-,-,-,-,1
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,C-CERAMIC,MLC-AXIAL;.015NF,5%,50V,SL,TP,
C-CERAMIC,MLC-AXIAL;.015NF,5%,50V,SL,TP,
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500m
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;47uF,20%,10V,GP,TP,6.3x5,5mm
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;47uF,20%,16V,GP,TP,6.3x5,5
IC MICOM;LC866232A,SANYO,100PIN,QFP,QFP
IC-VOL. DETECTOR;7545,TO-92,3P,-,PLASTIC
MODULE-REMOCON;-,-,37.9KHZ,940NM,-,-,INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CHIP;2.2KOHM,5%,1/10W,DA,TP,2012
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;1MOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
Remark
Loc.No
Part No
FR36
FR37
FR43
FR44
FR45
FR46
FR4S
FR5
FR51
FR52
FR7
FY1
HC3
HC4
HE3
HE4
HOP2
HR10
HR15
HR16
HR9
JP266
JP281
JP347
JP383
JP385
JP58
JP80
JP81
JP91
PBD11
PBF11
PBS01
PCD01
PCD02
PCD03
PCD12
PCF01
PCF02
PCF11
PCF13
PCNS1
PCNS2
PCR01A
PCS03
PCS31
PCS32
PDD35
PDF01
PDF12
PDF13
PDL51
PDL52
PDL55
PDS01
PDS02
PDS03
PDS04
PDS11
PDS31
PDS32
PDS33
PDS34
PDS36
PDS51
PDS52
2001-000273
2001-000273
2001-000793
2001-000429
2001-000429
2001-000273
2007-000029
2001-000325
2007-000029
2007-000029
2007-000282
2802-000108
2202-002037
2202-002037
2401-002075
2401-002075
1201-000163
2007-000282
2001-000515
2001-000515
2007-000282
2007-000033
2007-000033
2008-000141
2001-000780
2007-000033
2701-000114
2007-000033
2007-000033
2008-000141
3301-000297
3301-000297
3301-000297
2201-000916
2201-000812
2201-000812
2201-000129
2305-001021
2305-001021
2305-001029
2201-000376
AH39-00177A
3711-000178
2002-000121
2201-000916
2301-000381
2203-000192
0402-001195
0402-001196
0402-001195
0402-001195
0401-000101
0401-000101
0401-000101
0402-001196
0402-001196
0402-001196
0402-001196
0402-000276
0402-001195
0402-001194
0404-001097
0404-001097
0402-001195
0401-000101
0402-000132
Description ; Specification
Remark
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;47OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CARBON;120OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
RESONATOR-CERAMIC;12MHZ,0.5%,BK,10.0X5.0
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-AL;4.7uF,20%,50V,GP,TP,5x11,5
C-AL;4.7uF,20%,50V,GP,TP,5x11,5
IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
R-FUSIBLE;2.2ohm,5%,1/4W,AA,TP,2.6x6.7mm
R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
R-CHIP;0OHM,5%,1/8W,DA,TP,3216
R-FUSIBLE;2.2ohm,5%,1/4W,AA,TP,2.6x6.7mm
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10x
C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,12.
C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,12.
C-CERAMIC,DISC;0.1nF,10%,1kV,Y5P,TP,7x4,
C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.
C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.
C-FILM,MPEF;10nF,10%,630V,TP,12x9x12.5,5
C-CERAMIC,DISC;0.22nF,5%,50V,SL,TP,6.3x3
CONNECT WIRE;-,-,-,-,#24,-,-,-,-,-,-,-,1
CONNECTOR-HEADER;1WALL,2P,1R,3.96mm,STRA
R-COMPOSITION;1Mohm,10%,1/2W,AA,TP,3.5x9
C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10x
C-FILM,PEF;10nF,5%,50V,TP,6.5x5.5x3mm,5m
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
DIODE-RECTIFIER;UF4007,1KV,1A,DO-41,TP
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-RECTIFIER;UG2D,200V,2A,DO-204AC,TP
DIODE-SCHOTTKY;SG45,45V,7500mA,TO-220A,B
DIODE-SCHOTTKY;SG45,45V,7500mA,TO-220A,B
DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TP
Samsung Electronics
Electrical Parts List
Loc.No
Part No
PEF10
PEF12
PES31
PES32
PES33
PES34
PES35
PES36
PES37
PES51
PES52
PES53
PES54
PES56
PES57
PES58
PFD01
PICF1
PICS1
PICS2
PICS3
PICS4
PICS5
PLF01
PLS01
PLS31
POWER
PQL51
PQL52
PQL53
PQL54
PQL55
PQL56
PQL57
PQL58
PQS55
PQS56
PQS57
PQS58
PRD12
PRD31
PRD32
PRF10
PRF11
PRF12
PRF13
PRF14
PRF15
PRF16
PRF17
PRF19
PRF20
PRL51
PRL52
PRL53
PRL54
PRL55
PRL56
PRL57
PRL58
PRS11
PRS12
PRS31
PRS32
PRS33
PRS34
2401-001682
2401-002608
2401-000302
2401-000302
2401-000118
2401-000118
2401-003046
2401-001353
2401-002042
2401-002144
2401-000598
2401-000302
2401-002144
2401-000302
2401-000302
2401-001353
3601-001123
1203-001802
0604-000186
AC14-12006D
1203-000122
1203-001697
1203-001083
AC29-30050A
AC29-30050C
AC27-12001N
0601-001447
0504-000152
0501-000442
0504-000152
0501-000442
0501-000442
0504-000152
0504-000126
0501-000303
0504-000152
0504-000128
0501-000616
0501-000616
2003-000148
2007-000468
2007-000931
2006-000262
2001-000076
2001-000076
2001-000076
2001-000076
2001-000096
2001-000938
2001-000591
2001-000429
2003-000105
2001-000449
2001-000290
2001-000449
2001-000290
2001-000290
2001-000449
2001-000273
2001-000449
2003-000994
2003-000994
2001-000440
2007-000468
2004-000869
2004-000459
Samsung Electronics
Description ; Specification
C-AL;82uF,20%,400V,GP,BK,22x25,10
C-AL;33uF,20%,35V,GP,TP,5x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;1000uF,20%,10V,GP,TP,10x12.5,5
C-AL;1000uF,20%,10V,GP,TP,10x12.5,5
C-AL;47uF,20%,50V,WT,TP,6.3x11,2.5
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;1uF,20%,50V,GP,TP,4x7,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
FUSE-CARTRIDGE;250V,1.6A,TIME-LAG,CERAMI
IC-PWM CONTROLLER;STR-G6551,TO-220F,5P,PHOTO-COUPLER;TR,-,200mW,DIP-4,ST
IC;KA431Z,TO-92,TAPING
IC-NEGA.FIXED REG.;7908,TO-220,3P,-,PLAS
IC-VOLTAGE REGULATOR;78R08,TO-220,4P,-,P
IC-VOLTAGE REGULATOR;3RF23,TO-202,4P,12.
FILTER-LINE NOISE;-,400UH,-,250V,FILTER-LINE NOISE;-,25MH,0.35A,AC250V,BS
COIL-CHOKE;10UH-15%,RA,K-30,Q80,150KHZ,LED;ROUND,RED,3.1mm,650nm
TR-DIGITAL;KSR2101,PNP,200MW,4.7K/4.7K,S
TR-SMALL SIGNAL;KTC3203-Y,NPN,400MW,T0-9
TR-DIGITAL;KSR2101,PNP,200MW,4.7K/4.7K,S
TR-SMALL SIGNAL;KTC3203-Y,NPN,400MW,T0-9
TR-SMALL SIGNAL;KTC3203-Y,NPN,400MW,T0-9
TR-DIGITAL;KSR2101,PNP,200MW,4.7K/4.7K,S
TR-DIGITAL;KSR1101,NPN,200MW,4.7K/4.7K,S
TR-SMALL SIGNAL;KSA733,PNP,250mW,TO-92,T
TR-DIGITAL;KSR2101,PNP,200MW,4.7K/4.7K,S
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-SMALL SIGNAL;KSC2328A-Y,NPN,1W,TO-92L
TR-SMALL SIGNAL;KSC2328A-Y,NPN,1W,TO-92L
R-METAL OXIDE;100OHM,5%,2W,AE,TP,6X16MM
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-CHIP;470OHM,5%,1/10W,DA,TP,2012
R-CEMENT;2.7ohm,10%,2W,CB,TP,7.5x11x20.
R-CARBON;47KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;47KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;47KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;47KOHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON(S);1MOHM,5%,1/2W,AA,TP,2.4X6.4M
R-CARBON;68OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-METAL OXIDE;0.33ohm,5%,2W,AD,TP,6x16mm
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9x
R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9x
R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
R-METAL;3Kohm,1%,1/8W,AA,TP,1.8x3.2mm
R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x3.2m
Remark
Loc.No
Part No
PRS54
PRS55
PRS56
PTD1
PVA1
PZS51
SCC100
SCC11
SCC12
SCC14
SCC3
SCC4
SCC7
SCC8
SCD1
SCD3
SCD4
SCE10
SCE11
SCE12
SCE13
SCE14
SCE15
SCE16
SCE17
SCE4
SCE5
SCE6
SCIC3
SCIC4
SCIC6
SCJ1
SCL1
SCL11
SCL2
SCQ15
SCQ16
SCQ18
SCQ3
SCQ7
SCQ8
SCR1
SCR15
SCR19
SCR20
SCR23
SCR24
SCR25
SCR35
SCR36
SCR37
SCR4
SCR46
SCR5
SCR60
SCR61
SCR63
SCR65
SCR76
SVJ1
SW1
VC1
VC10
VC106
VC11
VC12
2001-000449
2001-000062
2001-000429
AC26-00001M
1405-000186
0403-000717
2203-000444
2203-000192
2203-000192
2203-000192
2203-000239
2203-000239
2203-000239
2203-000239
0407-000114
0407-000114
0403-000297
2401-001479
2401-000913
2401-001479
2401-000913
2401-001479
2401-000913
2401-002042
2401-001353
2401-002075
2401-000913
2401-000369
AH14-10004T
1201-001063
1201-001419
3722-001359
2701-000181
3301-000353
2701-000181
0504-000156
0504-000128
0504-000128
0504-000128
0501-000314
0504-000128
2001-000734
2001-000969
2007-000030
2007-000030
2007-001201
2007-001201
2007-001166
2007-001166
2007-001166
2007-001166
2007-000981
2007-000290
2007-000686
2007-000029
2007-000029
2007-000029
2007-000029
2007-000468
3722-001375
3404-000160
2202-000205
2202-000791
2203-000260
2202-000851
2202-000231
Description ; Specification
Remark
R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;470OHM,5%,1/4W,AA,TP,2.4X6.4MM
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
TRANS-SWITCHING;-,-,-,100V-240V,DEMCO,EE
VARISTOR;470V,4500A,17x12mm,TP
DIODE-ZENER;MTZJ5.1B,5.1V,4.94-5.2V,500m
C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012
C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,2012
DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOTDIODE-ZENER;MTZ6.2B,6.2V,5.96-6.27V,500m
C-AL;470uF,20%,10V,GP,TP,-,C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;470uF,20%,10V,GP,TP,-,C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;470uF,20%,10V,GP,TP,-,C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;4.7uF,20%,50V,GP,TP,5x11,5
C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;100uF,20%,6.3V,GP,-,6.3x11,5
IC-ANALOG M/PLEXER;MC14053BD,SOP,TAPE 16
IC-OP AMP;2267,SOP,8P,300MIL,DUAL,6.7dB,
IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,
JACK-SCART;21P,-,SN,BLK,#20-28
INDUCTOR-AXIAL;33uH,5%,2.4x3.4mm
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,INDUCTOR-AXIAL;33uH,5%,2.4x3.4mm
TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
TR-SMALL SIGNAL;KSA812,PNP,150mW,SOT-23,
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2M
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;560OHM,5%,1/10W,DA,TP,2012
R-CHIP;560OHM,5%,1/10W,DA,TP,2012
R-CHIP;820OHM,5%,1/10W,DA,TP,2012
R-CHIP;820OHM,5%,1/10W,DA,TP,2012
R-CHIP;75OHM,5%,1/10W,DA,TP,2012
R-CHIP;75OHM,5%,1/10W,DA,TP,2012
R-CHIP;75OHM,5%,1/10W,DA,TP,2012
R-CHIP;75OHM,5%,1/10W,DA,TP,2012
R-CHIP;5.6KOHM,5%,1/10W,DA,TP,2012
R-CHIP;100OHM,5%,1/10W,DA,TP,2012
R-CHIP;3.3KOHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;0OHM,5%,1/10W,DA,TP,2012
R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
JACK-DIN;4P,-,NI,BLK,SWITCH-TACT;12V,50mA,160gf+-50gf,6.55x7.
C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
8-9
Electrical Parts List
Loc.No
VC13
VC14
VC16
VC17
VC18
VC19
VC21
VC22
VC3
VC4
VC5
VC6
VC8
VC9
VE5
VE6
VE7
VE8
VE9
VFD1
VIC1
VL1
VL112
VL2
VL3
VL4
VL5
VL6
VL7
VL8
VR10
VR10S
VR11
VR12
VR121
VR122
VR123
VR7
VR8
VR9
VSW1
8-10
Part No
2202-000791
2202-000205
2202-002037
2203-000192
2202-000231
2202-000791
2202-000205
2202-000851
2202-000851
2202-000231
2202-000791
2202-000205
2202-000851
2202-000231
2401-001353
2401-000913
2401-001353
2401-000913
2401-002042
AH07-00024A
1201-001419
2701-000238
3301-000353
2701-000238
2701-000238
2701-000238
2701-000238
2701-000238
2701-000238
2701-000238
2001-000969
2001-001006
2001-000969
2001-000969
2001-000515
2007-000572
2001-000290
2001-001006
2001-001006
2001-001006
AH34-00010A
Description ; Specification
C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;470uF,20%,10V,GP,TP,8x11.5,5
C-AL;22uF,20%,16V,GP,TP,5x11,5
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
VF DISPLAY;HNV-11SS19,21SEG,74X9.0mm,DVD
IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;220OHM,5%,1/10W,DA,TP,2012
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
SWITCH SLIDE;-,50V DC,-,-,100MOHM,-,-,-,
Remark
Loc.No
Part No
Description ; Specification
Remark
701
CON21
FSW1
FSW2
FSW4
FSW5
FSW6
AH92-00583A
AH39-00180A
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
ASSY PCB-KEY;DVD-611/XAA,KEY PCB DVD-611/611B/615
CONNECT WIRE;-,-,-,-,#26,-,-,-,-,-,-,-,1
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
701
CON21
FSW1
FSW2
FSW4
FSW5
FSW6
AH92-00582A
AH39-00180A
3404-000165
3404-000165
3404-000165
3404-000165
3404-000165
ASSY PCB-KEY;DVD-511/XAA,KEY PCB
CONNECT WIRE;-,-,-,-,#26,-,-,-,-,-,-,-,1
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
H240
CN1
CN2
CN3
DC1
DC2
DC3
DC4
DC5
DD1
DD2
DR1
DR2
DR3
DR4
DR5
DR6
DR7
SW1
SW2
SW2
SW3
AH92-00609A
3708-001084
3708-001493
3708-001492
2202-000797
2202-000797
2202-000797
2202-000797
2202-000797
0401-000101
0401-000101
2001-000290
2001-000290
2001-000515
2001-000405
2001-000405
2001-000290
2001-000515
3409-001045
3409-001045
3409-000176
3408-000227
ASSY PCB-DECK;VALINO DECK 2L
DVD-611/611B/615
CONNECTOR-FPC/FC/PIC;40P,1.25mm,ANGLE,SN
CONNECTOR-FPC/FC/PIC;24P,1mm,SMD-A,SN
CONNECTOR-FPC/FC/PIC;11P,1mm,ANGLE,SN
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;180OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;180OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
SWITCH-DETECTOR;30V,0.1A,1,36gf,SWITCH-DETECTOR;30V,0.1A,1,36gf,SWITCH-DETECTOR;30Vdc,100mA,SPST,-,SWITCH-SLIDE;30V,300mA,DPDT,-
H240
CN1
CN2
CN3
DC1
DC2
DC4
DC5
DD2
DR1
DR4
DR5
DR6
DR7
SW1
SW2
SW3
AH92-00608A
3708-001084
3708-001494
3708-001492
2202-000797
2202-000797
2202-000797
2202-000797
0401-000101
2001-000290
2001-000405
2001-000405
2001-000290
2001-000924
3409-001045
3409-000176
3408-000227
ASSY PCB-DECK;DVD-611/XAA,VALINO DECK 1L
CONNECTOR-FPC/FC/PIC;40P,1.25mm,ANGLE,SN
CONNECTOR-FPC/FC/PIC;20P,1mm,SMD-A,SN
CONNECTOR-FPC/FC/PIC;11P,1mm,ANGLE,SN
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;180OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;180OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;680OHM,5%,1/8W,AA,TP,1.8X3.2MM
SWITCH-DETECTOR;30V,0.1A,1,36gf,SWITCH-DETECTOR;30Vdc,100mA,SPST,-,SWITCH-SLIDE;30V,300mA,DPDT,-
DVD-511
DVD-511
Samsung Electronics
9. Block Diagram
DECK ASS'Y (DP-5)
Remote Control
MIC4 2K EEPROM
MIC2 8M EPROM
FLT Display
FIC1
(LC86P6232)
Front Controller
MIC1
(TMP95C265F)
Main Controller
MIC3 1M SDRAM
Spindle/Sied/Tray Motor
ZIC2/3 SDRAM X 2
Pick-up & I/V Amp
RIC1
(KS1461)
RF Amp & DPD
DIC2 4M DRAM
SIC4
(KA3017)
Actuator & Motor Driver
Optical
ZIC1 (ZiVA-4.1)
A/V Decoder
CSS
INPUT
FIFO
&
DEMUX
Coaxial
AUDIO
DSP
Down-L/R
AIC1 (AK4393)
2-CH Audio DAC
Post
Filter
Lt
Rt
DIC1
(KS1453)
DVD & CD Processor
A/V
Decoder
AC3 &
MPEG 5.1
Y/B/Pb
Video
Encoder
(4DAC)
C/R/Pr
Comp/G/Y
Post Filter
Post Filter
CVBS
VIC1 (BA7660)
6dB AMP
Post Filter
Post Filter
SIC1 (BA7660)
6dB AMP
Samsung Electronics
Yout
Cout
SCART JACK
Compo
SIC1
(KS1452)
Digital Servo
9-1
Block Diagram
MEMO
9-2
Samsung Electronics
10. PCB Diagrams
10-1 Main - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-2
10-2 Jack - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-3
10-3 Key - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-4
10-4 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-4
Samsung Electronics
10-1
PCB Diagrams
10-2
SOLDER SIDE
COMPONENT SIDE
10-1 Main
Samsung Electronics
PCB Diagrams
10-2 Jack
Samsung Electronics
10-3
PCB Diagrams
10-3 Key
DVD-511
DVD-611
DVD-611B
DVD-615
10-4 Deck
1 LD ;
DVD-511
10-4
2 LD ;
DVD-611
DVD-611B
DVD-615
Samsung Electronics
11. Wiring Diagram
Samsung Electronics
11-1
Wiring Diagram
MEMO
11-2
Samsung Electronics
12. Schematic Diagrams
Block Identification of PCB
12-1 Power - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-2
12-2 Main-Micom - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-3
12-3 Servo - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-4
12-4 Video - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-5
12-5 Audio- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-6
12-6 RF - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-7
12-7 ZiVA (A/V Decoder) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-8
12-8 DSP - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-9
12-9 Front-Micom/VFD Display - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-10
12-10 Key - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-11
12-11 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-12
12-12 Remote Control - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
12-13
Main PCB (Component Side)
Jack PCB (Conductor Side)
Samsung Electronics
12-1
Schematic Diagrams
12-1 Power
12-2
Samsung Electronics
Schematic Diagrams
12-2 Main-Micom
Samsung Electronics
12-3
Schematic Diagrams
12-3 Servo
12-4
Samsung Electronics
Schematic Diagrams
12-4 Video
Samsung Electronics
12-5
Schematic Diagrams
12-5 Audio
12-6
Samsung Electronics
Schematic Diagrams
12-6 RF
Samsung Electronics
12-7
Schematic Diagrams
12-7 ZiVA (A/V Decoder)
12-8
Samsung Electronics
Schematic Diagrams
12-8 DSP
Samsung Electronics
12-9
Schematic Diagrams
12-9 Front-Micom/VFD Display
12-10
Samsung Electronics
Schematic Diagrams
12-10 Key
Samsung Electronics
12-11
Schematic Diagrams
12-11 Deck
1 LD ; DVD-511
12-12
2 LD ; DVD-611/611B/615
Samsung Electronics
Schematic Diagrams
12-12 Remote Control
Samsung Electronics
12-13
Schematic Diagrams
MEMO
12-14
Samsung Electronics