Rapid Oven Setup (ROS) for use with Insight™ software for Reflow

Rapid Oven Setup (ROS)
for use with Insight™ software for Reflow Tracker®
Rapid Oven Setup (ROS) is an innovative
modeling tool that calculates optimum reflow
oven settings for a given product and profile
quickly, easily and accurately.
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Rapid Oven Setu
Every time a new product or solder paste is introduced, the reflow
oven settings have to be optimized – a time consuming process.
Rapid Oven Setup (ROS) from Datapaq® automates this process
by calculating the optimum oven settings for any combination of
oven, product and target profile. ROS accomplishes in seconds an
operation that can take even an experienced process engineer
hours to achieve.
RAPID OVEN SETUP:
• Ensures the optimum profile is found
• Reduces scrap levels
• Saves time and money
• Speeds up the changeover to new profiles (lead free)
• Enables users to check product and oven compatibility offline
• Works on all reflow ovens, old or new, infrared or convection
HOW DOES RAPID OVEN SETUP WORK?
There are two unique features that enable the ROS system to
achieve unrivalled accuracy:
A thermal profile
of the product
is calculated for
every element
The Heat Transfer Sensor measures the actual
performance of each oven.
This ensures that the system will work accurately in any oven.
ROS can read information directly from CAD files.
This enables it to automatically produce a detailed thermal model
of the product, removing any possible operator error.
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Rapid Oven Setu
st time’ profiles
ensures ‘right fir
RAPID OVEN SETUP (ROS)
OVEN PERFORMANCE MEASUREMENT
The Datapaq ROS uses a heat transfer sensor to accurately characterize the
performance of the oven. The heat transfer sensor has one thermocouple
to measure air temperature, one thermocouple attached to a low emissivity
sensor, and a third connected to a high emissivity sensor. The system
measures the heat transfer efficiency of the oven and any calibration
errors in the zone settings, leading to unrivalled accuracy in all oven types.
PRODUCT THERMAL MASS CALCULATION
The ROS system can read the CAD files used to design the product. It
uses this information to create a detailed thermal model. This innovative
approach enables ROS to calculate thermal profiles for every location on
the product. It then uses finite difference methods to calculate a thermal
profile for every location on the product. This can all be achieved without
having to connect thermocouples to a test PCB, saving time and money.
TARGET PROFILE DEFINITION
The ROS system has an easy-to-use, wizard-based interface for defining
target profiles. The dual display of graph and analysis allows the user
to either click and drag on the graph or enter the numerical data. This
approach enables the user to easily and quickly create target profiles that
comply not only with solder paste specifications, but also
with any other company or component requirements.
Rapid Oven Setup is designed for use with Insight™ software for Reflow Tracker®.
It is compatible with the full range of Datapaq® Q18 loggers.
The Worldwide Leader in Temperature Profiling
Europe and Asia
DATAPAQ Limited,
Deanland House, 160 Cowley Road,
Cambridge CB4 OGU, UK
Tel:
+44 (0)1223 423 141
Fax:
+44 (0)1223 423 306
E-mail: sales@datapaq.co.uk
Web:
www.datapaq.com
North and South America
DATAPAQ Inc,
187 Ballardvale Street,
Willmington, MA 01887, USA
Tel:
+1 978 988 9000
Fax:
+1 978 988 0666
E-mail: sales@datapaq.com
Web:
www.datapaq.com
Germany
DATAPAQ GmbH,
Valdorfer Straße 100
D-32602 Vlotho, Deutschland
Tel:
+49 5733 9107 0
Fax:
+49 5733 9107 27
E-mail: sales@datapaq.de
Web:
www.datapaq.de
www.datapaq.com
© 2011 Datapaq (Q18ROS Rev B) 6/2011
Datapaq, the Datapaq logo and Reflow Tracker
are registered trademarks of Datapaq.
Specifications subject to change without notice.
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