TFBS6712 Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s) for

TFBS6712
Vishay Semiconductors
Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s)
for IrDA® Applications with Low voltage Logic (1.8 V)
Description
The TFBS6712 is the smallest FIR transceiver
available. It is a low profile and low-power IrDA
transceiver. Compliant to IrDA’s Physical Layer specification, the TFBS6712 supports data transmission
rates from 9.6 kbit/s to 4 Mbit/s with a typical link
distance of 50 cm. It also enables mobile phones and
PDAs to function as universal remote controls for
televisions, DVDs and other home appliances. The
TFBS6712 emitter covers a range of 6.5 m with
common remote control receivers. Integrated within
the transceiver module is a PIN photodiode, an
infrared emitter, and a low-power control IC. The
TFBS6712 can be completely shutdown, achieving
very low power consumption. This type is adapted to
20208
work with a low logic I/O voltage of 1.8 V. For
operation with VCC as logic voltage base TFBS6711 is
available with otherwise same performance.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Lowest profile: 1.9 mm
Smallest footprint: 6.0 mm x 3.05 mm
Surface mount package
e4
IrDA transmit distance: 50 cm typical
Best remote control distance: ≥ 6.5 m on-axis
Fast data rates: from 9.6 kbit/s to 4 Mbit/s
Low shutdown current: 0.01 µA
Operating voltage: 2.4 V to 3.6 V
Reduced pin count: 6 pins
I/O voltage equal to the supply voltage
Pin compatibility: TFBS4711 and TFBS5711
Integrated EMI protection - no external shield
required
•
•
•
•
IEC 60825-1 class 1, eye safe
Qualified for lead-free and Sn/Pb processing
Compliant to IrDA physical layer specification
Split power supply, transmitter and receiver can be
operated from two power supplies with relaxed
requirements saving costs, US patent
No. 6,157,476
• Lead (Pb)-free device
• Qualified for lead (Pb)-free and Sn/Pb processing
(MSL4)
• Device in accordance with RoHS 2002/95/EC and
WEEE 2002/96/EC
Applications
• High-speed data transfer using infrared wireless
communication
• Mobile phones
• Camera phones
•
•
•
•
PDAs
MP3 players
Digital cameras
IrDA adapters or dongles
Parts table
Part number
Description and remarks
Qty/reel or tube
TFBS6712-TR1
Oriented in carrier tape for side view surface mounting
1000 pcs
TFBS6712-TR3
Oriented in carrier tape for side view surface mounting
2500 pcs
TFBS6712-TT1
Oriented in carrier tape for top view surface mounting
1000 pcs
TFBS6712-TT3
Oriented in carrier tape for top view surface mounting
2500 pcs
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Rev. 1.3, 30-Jul-08
TFBS6712
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-state
driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
Controlled
driver
and
Control
TXD
GND
19298
Figure 1. Functional Block Diagramm
Pin Description
Pin Number
Function
Description
1
VCC2, IRED
Anode
IRED anode to be externally connected to VCC2. For higher voltages as
3.6 V an external resistor might be necessary for reducing the internal power
dissipation. See derating curves. This pin is allowed to be supplied from an
uncontrolled power supply separated from the controlled VCC1 - supply
I/O
Active
2
TXD
Transmitter data input, adapted to 1.8 V logic
I
High
RXD
Received data output, push-pull CMOS driver output capable of driving a
standard CMOS load. No external pull-up or pull-down resistor is required.
Adapted to low i/O voltage 1.8 V logic. Floating with a weak pull-up of 500 kΩ
(typ.) in shutdown mode. The RXD output echos the TXD input during
transmission.
O
Low
4
SD
Shutdown, also used for dynamic mode switching
I
High
5
VCC1
Supply voltage
6
GND
Ground
3
TFBS6712
Weight: 50 mg
PIN 1
19428
Figure 2. Pinning
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TFBS6712
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin, GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Test conditions
Symbol
Min.
Supply voltage range,
transceiver
Parameter
0 V < VCC2 < 6 V
VCC1
Supply voltage range,
transmitter
0 V < VCC1 < 6 V
VCC2
Typ.
Max.
Unit
- 0.5
6
V
- 0.5
6.5
V
10
mA
For all pins, except IRED anode
pin
Input currents
Output sinking current
25
mA
Power dissipation
PD
500
mW
Junction temperature
TJ
125
°C
°C
Ambient temperature range
(operating)
Tamb
- 25
+ 85
Storage temperature range
Tstg
- 25
+ 85
°C
260
°C
125
mA
600
mA
Soldering temperature
IIRED (DC)
Average output current
Repetitive pulse output current
< 90 µs, ton < 20 %
Voltage at all inputs and outputs
Virtual source size
IIRED (RP)
VIREDA
- 0.5
6.5
V
Vin > VCC1 is allowed
Vin
- 0.5
5.5
V
Method: (1-1/e) encircled
energy
d
1.5
IRED anode voltage
Maximum intensity for Class 1 operation of
IEC60825-1 or EN60825-1, edition Jan. 2001
IrDA®
specified maximum limit
mm
internal
limitation
to class 1
500
mW/sr
Due to the internal limitation measures the device is a “class 1” device. It will not exceed the IrDA®
intensity limit of 500 mW/sr
Definitions:
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhY 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
IrDA®, the Infrared Data Association, implemented MIR and FIR with IrPHY 1.1, followed by IrPhY 1.2, adding the SIR low power standard.
IrPhY 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any case
obsoletes the former version.
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TFBS6712
Vishay Semiconductors
Electrical Characteristics
Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test conditions
Symbol
Min.
VCC
2.4
Typ.
Max.
Unit
3.6
V
Transceiver
Supply voltage range
Dynamic supply current
Receive mode only.
In transmit mode, add additional 85 mA (typ) for IRED current. Add RXD output current depending
on RXD load.
SD = Low, SIR mode
ICC
1.7
3
mA
SD = Low, MIR/FIR mode
ICC
1.9
3.3
mA
Shutdown supply current
SD = High
T = 25 °C, not ambient light
sensitive, detector is disabled in
shutdown mode
ISD
1
µA
Shutdown supply current
SD = High
T = 85 °C, not ambient light
sensitive
ISD
5
µA
+ 85
°C
0.4
V
TA
Operating temperature range
Output voltage “Low”
IOL = 1 mA
CLOAD = 15 pF
VOL
Output voltage “High”
IOH = - 250 µA
CLOAD = 15 pF
VOH
- 25
1.6
1.8
2
V
RRXD
400
500
600
kΩ
Input voltage “Low” (TXD, SD)
VIL
- 0.5
Input voltage “High” (TXD, SD)
VIH
1.5
IICH
-1
Internal RXD pull-up
Input leakage current (TXD, SD) 1)
Input capacitance
(TXD, SD)
Vin > 1.6 V
0.5
V
1.8
2.1
V
0.05
+1
µA
5
pF
CI
Note
The typical threshold level is 0.5 x VCC (at VCC = 3 V). It is recommended to use the specified min./max. values to avoid increased
operating/shutdown currents.
1)
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Optoelectronic Characteristics
Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test conditions
Symbol
Minimum irradiance Ee in
angular range 2)
9.6 kbit/s to 115.2 kbit/s
λ = 850 nm to 900 nm, Vcc = 2.4 V
Ee
Minimum irradiance Ee in
angular range
MIR mode
1.152 Mbit/s
λ = 850 nm to 900 nm, Vcc = 2.4 V
Ee
Minimum irradiance Ee in
angular range
FIR mode
4 Mbit/s
λ = 850 nm to 900 nm, Vcc = 2.4 V
Ee
Maximum irradiance Ee in
angular range 3)
λ = 850 nm to 900 nm
Ee
Min.
Typ.
Max.
Unit
50
80
mW/m2
(5)
(8)
(µW/cm2)
Receiver
No detection receiver Input
irradiance (fluorescent light
noise suppression)
Ee
100
mW/m2
(10)
(µW/cm2)
120
200
mW/m2
(12)
(20)
(µW/cm2)
5
kW/m2
(500)
(mW/cm2)
4
mW/m2
(0.4)
(µW/cm2)
Rise time of output signal
10 % to 90 %, CL = 15 pF
tr (RXD)
10
50
ns
Fall time of output signal
90 % to 10 %, CL = 15 pF
tf (RXD)
10
50
ns
RXD pulse width of output
signal, 50 %, SIR mode
Input pulse length
1.4 µs < PWopt < 25 µs
tPW
1.4
1.8
2.6
µs
RXD pulse width of output
signal, 50 %, MIR mode
Input pulse length
PWopt = 217 ns, 1.152 Mbit/s
tPW
110
250
270
ns
RXD pulse width of output
signal, 50 %, FIR mode
Input pulse length
PWopt = 125 ns, 4 Mbit/s
tPW
110
140
ns
RXD pulse width of output
signal, 50 %, FIR mode
Input pulse length
PWopt = 250 ns, 4 Mbit/s
tPW
225
275
ns
20
40
350
ns
ns
ns
500
µs
100
µs
RXD output jitter, leading edge
Receiver start up time
Latency 1)
Input irradiance = 150 mW/m2,
4 Mbit/s
1.152 Mbit/s
≤ 115.2 kbit/s
After completion of shutdown
programming sequence
power on delay
tL
Note:
All timing data measured with 4 Mbit/s are measured using the IrDA® FIR transmission header. The data given here are valid 5 µs after
starting the preamble.
1)
IrDA latency definition: Receiver Latency Allowance (milliseconds or microseconds) is the maximum time after a node ceases
transmitting before the node’s receiver recovers its specified sensitivity. During this period and also during the receiver start up time (after
power on or shut down) the RXD output may be in an undefined state.
2)
IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER
specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum
Link Length
3)
Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating at
the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link
errors. If placed at the active output interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER)
specification.
For more definitions see the document “Symbols and Terminology” on the Vishay Website (http://www.vishay.com/doc?82512).
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TFBS6712
Vishay Semiconductors
Optoelectronic Characteristics, continued
Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test conditions
Symbol
Min.
Typ.
Max.
Unit
IRED operating current, switched
current control
See derating curve. For 3.3-V
operation no external resistor is
needed.
ID
330
440
600
mA
Output leakage IRED current
VCC = VIRED = 3.3 V, TXD = Low
IIRED
-1
1
µA
Output radiant intensity,
see figure 3, recommended
application circuit
VCC = VIRED = 3.3 V, α = 0°
TXD = High, SD = Low, R1 = 1 Ω
Ie
45
115
300
mW/sr
Output radiant intensity,
see figure 3, recommended
application circuit
VCC = VIRED = 3.3 V, α = 0°, 15°
TXD = High, SD = Low, R1 = 1 Ω
Ie
25
75
300
mW/sr
VCC = 3.6 V, α = 0°, 15°
TXD = Low or SD = High
(Receiver is inactive as long as
SD = High)
Ie
0.04
mW/sr
Transmitter
Output radiant intensity
Output radiant intensity, angle of
half intensity
α
Peak - emission wavelength
Optical rise time,
Optical fall time
°
± 24
λp
880
900
nm
tropt,
tfopt
10
40
ns
Optical output pulse duration
Input pulse width 217 ns, 1.152
Mbit/s
topt
200
217
230
ns
Optical output pulse duration
Input pulse width 125 ns, 4 Mbit/s
topt
116
125
134
ns
Optical output pulse duration
Input pulse width 250 ns, 4 Mbit/s
topt
241
250
259
ns
Optical output pulse duration
Input pulse width t < 80 µs
Input pulse width t ≥ 80 µs
topt
topt
20
85
µs
µs
25
%
t
Optical overshoot
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TFBS6712
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the
TFBS6712 needs no additional external components.
However, depending on the entire system design and
board layout, additional components may be required
(see figure 3).
VCC2
VCC1
GND
R1
R2
C1
IRED Anode
VCC
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
19430
Figure 3. Recommended Application Circuit
The capacitor C1 is buffering the supply voltage and
eliminates the inductance of the power supply line.
This one should be a Tantalum or other fast capacitor
to guarantee the fast rise time of the IRED current.
Vishay transceivers integrate a sensitive receiver and
a built-in power driver. The combination of both needs
a careful circuit board layout. The use of thin, long,
resistive and inductive wiring should be avoided. The
inputs (TXD, SD) and the output RXD should be
directly (DC) coupled to the I/O circuit.
The capacitor C2 combined with the resistor R2 is the
low pass filter for smoothing the supply voltage.
R2, C1 and C2 are optional and dependent on the
quality of the supply voltages VCCx and injected
noise. An unstable power supply with dropping
voltage during transmission may reduce the
sensitivity (and transmission range) of the
transceiver.
The placement of these parts is critical. It is strongly
recommended to position C2 as close as possible to
the transceiver power supply pins.
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A Tantalum capacitor should be used for C1 while a
ceramic capacitor is used for C2.
In addition, when connecting the described circuit to
the power supply, low impedance wiring should be
used.
When extended wiring is used the inductance of the
power supply can cause dynamically a voltage drop
at VCC2. Often some power supplies are not able to
follow the fast current rise time. In that case another
4.7 µF (type, see tavle under C1) at VCC2 will be
helpful.
Keep in mind that basic RF-design rules for circuit
design should be taken into account. Especially
longer signal lines should not be used without
termination. See e.g. "The Art of Electronics" Paul
Horo-witz, Winfield Hill, 1989, Cambridge University
Press, ISBN: 0521370957.
Table 1. Recommended Application Circuit
Components
Component
Recommended value
C1
4.7 µF, 16 V
Vishay part#:
293D 475X9 016B
C2
0.1 µF, Ceramic
Vishay part#:
VJ1 206 Y 104 J XXMT
R1
3.3 V supply voltage: no resistor necessary, the
internal controller is able to control the current
R2
4.7 Ω, 0.125 W
I/O and Software
In the description, already different I/Os are
mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the I/
O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
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TFBS6712
Vishay Semiconductors
Mode Switching
The TFBS6712 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below. The low
frequency mode covers speeds up to 115.2 kbit/s.
Signals with higher data rates should be detected in
the high frequency mode. Lower frequency data can
also be received in the high frequency mode but with
reduced sensitivity. To switch the transceivers from
low frequency mode to the high frequency mode and
vice versa, the programming sequences described
below are required.
Setting to the High Bandwidth Mode
(0.576 Mbit/s to 4 Mbit/s)
Setting to the Lower Bandwidth Mode
(2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic "High".
2. Set TXD input to logic "Low". Wait ts ≥ 200 ns.
3. Set SD to logic "Low" (this negative edge latches
state of TXD, which determines speed setting).
4. TXD must be held for th ≥ 200 ns.
TXD is now enabled as normal TXDinput for the lower
bandwidth mode.
50 %
SD
1. Set SD input to logic "High".
2. Set TXD input to logic "High". Wait ts ≥ 200 ns.
3. Set SD to logic "Low" (this negative edge latches
state of TXD, which determines speed setting).
4. After waiting th ≥ 200 ns TXD can be set to logic
“Low”. The hold time of TXD is limited by the
maximum allowed pulse length.
TXD is now enabled as normal TXD input for the high
bandwidth mode.
ts
th
High: FIR
TXD
50 %
50 %
Low: SIR
14873
Figure 4. Mode Switching Timing Diagram
Truth table
Inputs
SD
High
Outputs
Optical input Irradiance [mW/m2]
RXD
Transmitter
x
x
weakly pulled
(500 kΩ)
high
0
TXD
Low
high
x
low active (echo)
Ie
Low
high > 80 µs
x
high
0
Low
low
<4
high
0
Low
low
> Min. irradiance Ee
in angular range
< Max. irradiance Ee
in angular range
low (active)
0
Low
low
> Max. irradiance Ee
in angular range
x
0
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TFBS6712
Vishay Semiconductors
Recommended Solder Profiles
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator.
Nevertheless, we added a chapter to the above
mentioned application note, describing manual
soldering and desoldering.
Solder Profile for Sn/Pb soldering
260
10 s max. at 230 °C
240 °C max.
240
220
2...4 °C/s
200
180
160
140
120 s...180 s
120
90 s max.
100
80
2...4 °C/s
60
40
20
0
0
50
100
150
200
250
300
350
Time/s
19431
Figure 5. Recommended Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS6712 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-SoakSpike (RSS) and Ramp-To-Spike (RTS). The RampSoak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-ToSpike profile is used increasingly. Shown below in
figure 6 is VISHAY's recommended profiles for use
with the TFBS6712 transceivers. For more details
please refer to Application note: SMD Assembly
Instruction.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are
equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/doc?82601).
280
T ≥ 255 °C for 20 s max
260
T peak = 260 °C max.
240
T ≥ 217 °C for 50 s max
220
200
180
Temperature/°C
Temperature/°C
160 °C max.
160
20 s
140
120
90 s...120 s
100
50 s max.
2 °C...4 °C/s
80
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Figure 6. Solder Profile, RSS Recommendation
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
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TFBS6712
Vishay Semiconductors
TFBS4711, TFBS5711, TFBS6711, and TFBS6712 Package
(Mechanical Dimensions)
19612
Figure 7. Package Drawing, Tolerances: Height + 0.1, - 0.2 mm, otherwise ± 0.2 mm if not indicated
19728
19301
Soldering Footprint: Side View
Soldering Footprint: Top View
Figure 8. Soldering Footprints
Design Rules for Optical Windows
For optical windows see the application note on the web http://www.vishay.com/doc?82506.
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TFBS6712
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Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Tape width
A max.
N
W1 min.
W2 max.
W3 min.
mm
mm
mm
mm
mm
mm
W3 max.
mm
16
330
50
16.4
22.4
15.9
19.4
Figure 9. Reel Dimensions (mm)
19303
Drawing-No.: 9.700-5294.01-4
Issue: prel. copy; 24.11.04
Figure 10. Tape Dimensions (mm) TFBS6712-TT3
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Rev. 1.3, 30-Jul-08
TFBS6712
Vishay Semiconductors
19304
Drawing-No.: 9.700-5295.01-4
Issue: prel. copy; 24.11.04
Figure 11. Tape Dmensions (mm) TFBS6712-TR3
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TFBS6712
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively.
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA.
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 84674 For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Rev. 1.3, 30-Jul-08
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282
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
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