Intel® Carrier Grade Server TIGW1U Technical Product

Kontron Carrier Grade Server
TIGW1U
Technical Product Specification
June 2010
Rev 1.4
Copyright © 2010, Kontron AG. All Rights Reserved.
Legal Lines and Disclaimers
All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is
believed to be accurate; however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other
trademaarks or registed trademarks are the property of their respective owners and are recognized. Specifications are subject to
change without notice.
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
2
June 2010
—Carrier Grade Server TIGW1U
Contents
June 2010
1.0
Introduction9
1.1
Document Structure and Outline ........................................................9
2.0
System Overview ..................................................................................11
2.1
Introduction..................................................................................11
2.1.1 Carrier Grade Server TIGW1U Features ..................................12
2.2
External Chassis Features ...............................................................16
2.2.1 Front Panel ........................................................................16
2.2.2 Front Panel Features ...........................................................17
2.2.3 Hard Drives .......................................................................18
2.2.3.1 SAS Hard Drive Tray Assembly.................................19
2.2.4 Optical Drive ......................................................................19
2.2.4.1 Optical Drive Tray Assembly ...................................20
2.2.5 System Rear View ...............................................................21
2.3
Internal Chassis Features ................................................................21
2.3.1 Intel® Server Board S5000PHB .............................................21
2.3.2 PCI/PCI Express Adapter Subsystem ......................................21
2.3.3 Power Subsystem ...............................................................22
2.3.4 Cooling Subsystem .............................................................24
2.3.4.1 Front Panel Board Cooling Area ...............................25
2.3.4.2 PCI Cooling Area ...................................................25
2.3.4.3 CPU-Memory-HDD Cooling Area25
2.3.4.4 Fan Speed Control .................................................25
2.3.4.5 Cooling Summary .................................................26
2.4
Server Management .......................................................................27
2.5
Specifications ...............................................................................28
2.5.1 Environmental Specifications ............................................... 28
2.5.2 Physical Specifications .........................................................29
3.0
Cables and Connectors .........................................................................30
3.1
System Interconnect Block Diagram .................................................31
3.2
Cable and System Interconnect Descriptions .....................................32
3.2.1 Flex Circuit ........................................................................32
3.2.2 IDE Signal Cable .................................................................36
3.2.3 Optical Drive Power Cable ....................................................37
3.2.4 Front Panel Board Power Harness ..........................................37
3.2.5 SMART Embedded USB Solid-State Drive Signal and Power Cable
(Optional)..........................................................................38
3.2.6 RAID Smart Battery Cable ...................................................38
3.2.7 Fan Power Cables ...............................................................39
3.3
User-Accessible Interface Connections ..............................................40
3.3.1 Keyboard and Mouse Ports ...................................................40
3.3.2 Serial Port B .......................................................................40
3.3.3 Video Port .........................................................................42
3.3.4 Universal Serial Bus (USB) Interface .....................................43
3.3.5 Ethernet Connectors ...........................................................43
3.3.6 GCM Remote Management Module Connector .........................44
3.3.7 Telco Alarms Connector .......................................................44
3.3.8 Internal SAS Hard Disk Drive Connector ................................45
3.3.9 External SAS 4X Hard Disk Drive Connector ...........................46
3.3.10 AC Power Input for AC-Input Power Supply ............................47
3.3.11 DC Power Input for DC-Input Power Supply ............................47
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4.0
SAS Front Panel (SFP) Board ...............................................................48
4.1
Features ......................................................................................48
4.2
Overview .....................................................................................49
4.3
Component Location ......................................................................51
4.4
Power Distribution .........................................................................52
4.4.1 Battery Backup Power Control ..............................................52
4.4.2 12 V to 1.8 V VRM ..............................................................52
4.4.3 12 V to 1.5 V VRM ..............................................................53
4.4.4 3.3 V to 1.35 DC to DC Linear Converter ................................53
4.4.5 1.8V to 1.2V DC to DC Linear Converter .................................53
4.5
I/O Processor Subsystem ................................................................53
4.5.1 PCI-X to PCI Express Bridge .................................................53
4.5.2 RAID Controller ..................................................................53
4.5.3 I/O Processor .....................................................................54
4.5.4 Flash Memory ....................................................................55
4.5.5 NVRAM .............................................................................55
4.5.6 PCI-X Buses .......................................................................55
4.5.7 PCI Express Bus .................................................................55
4.5.8 DDR2 Bus ..........................................................................55
4.5.9 RAID Smart Battery ............................................................55
4.5.10 GPIOs ...............................................................................55
4.5.11 RAID Activation Key ............................................................56
4.5.12 I2C ...................................................................................56
4.5.13 Indicator Buzzer .................................................................56
4.6
SAS Controller (LSI1068) ................................................................56
4.6.1 PCI-X Interface ..................................................................57
4.6.2 SAS Interface ....................................................................57
4.6.3 Flash Memory.....................................................................57
4.6.4 I2C....................................................................................57
4.6.5 LSI1068 Heart Beat LED
Indicator............................................................................57
4.7
VSC410 Enclosure Management
Controller.....................................................................................57
4.7.1 Drive Presence ...................................................................58
4.7.2 Drive Fault ........................................................................58
4.7.3 IPMB Buses........................................................................58
4.7.4 SPI Bus..............................................................................58
4.8
Clock Generation/Distribution..........................................................59
4.8.1 75 MHz Sourced Clock .........................................................59
4.8.2 133 MHz Sourced Clock........................................................59
4.8.3 200 MHz Sourced Clock........................................................59
4.8.4 100 MHz Sourced Clock........................................................59
4.8.5 PLD Sourced Clock...............................................................59
4.8.6 VSC410 Clock.....................................................................60
4.9
Programmable Logic Device (PLD).....................................................60
4.9.1 Power On/Reset..................................................................60
4.9.2 Buzzer Control....................................................................60
4.9.3 Intel® RAID Smart Battery
Control..............................................................................60
4.9.4 Telco Alarm LED Control.......................................................60
4.9.5 System Drive Status LED
Control..............................................................................60
4.10 Hardware RAID..............................................................................60
4.10.1 DDR-2 Support ..................................................................61
4.10.2 Intel 80333 I/O Processor NVRAM..........................................61
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4.11
4.12
4.13
June 2010
4.10.3 ROMB Battery Backup .........................................................61
Software RAID ..............................................................................61
4.11.1 80333 Processor in Software RAID.........................................61
4.11.2 LSI1068 Controller in Software RAID .....................................62
Power Good and Reset Control .........................................................62
4.12.1 Power Good Circuit .............................................................62
4.12.2 Power Good Inputs .............................................................62
4.12.3 Reset Control .....................................................................62
Front Panel Switches and Status Indicators ........................................63
4.13.1 Front Panel Switches ...........................................................64
4.13.2 Front Panel LEDs ................................................................64
4.13.3 System Status LEDs ............................................................64
4.13.4 System Fault LEDs (Telco Alarms)..........................................65
4.13.5 Fan Fault LEDs ...................................................................66
4.13.6 Hard Drive LEDs .................................................................66
4.13.7 Temperature Sensor ...........................................................66
5.0
SMART Embedded USB Solid-State Drive ..............................................67
5.1
Functional Description ....................................................................67
5.2
SFP Board Connector ......................................................................68
5.3
Architecture ..................................................................................68
5.4
Installation ...................................................................................69
6.0
PCI/PCI-X* Riser Card .........................................................................70
6.1
Introduction .................................................................................70
6.2
Functional Description ....................................................................71
6.3
PCI-X Riser Card Connector Interface ................................................71
6.4
Electrical Specification ....................................................................73
7.0
PCI Express* Riser Card .......................................................................74
7.1
Introduction .................................................................................74
7.2
Functional Description ....................................................................75
7.3
PCI Express Riser Card Connector Interface .......................................75
7.4
Electrical Specification ....................................................................76
8.0
AC Power Subsystem ...........................................................................77
8.1
Features ......................................................................................77
8.2
Power Distribution Board ................................................................78
8.2.1 PDB Mechanical Specification ................................................78
8.2.2 PDB System Interface .........................................................79
8.2.2.1 PDB Interface to Server Board .................................79
8.2.2.2 PDB Interface to PSUs ............................................80
8.2.2.3 PDB to Front-Panel Board Interface ..........................81
8.2.3 Output Current Requirements ...............................................82
8.2.4 Hot-Swapping Power Modules ...............................................83
8.2.5 Intelligent Power Subsystem Functions ..................................83
8.2.6 FRU Data ...........................................................................83
8.3
AC-input Power Supply Module ........................................................83
8.3.1 AC-input PSU Mechanical Specification ...................................83
8.3.2 PSU to PDB Interconnect .....................................................83
8.3.3 AC Input Voltage Requirements ............................................83
8.3.4 Air Flow .............................................................................84
8.3.5 Thermal Protection .............................................................84
9.0
DC Power Subsystem ...........................................................................85
9.1
Features ......................................................................................85
9.2
DC-Input Power Distribution Board ..................................................85
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Carrier Grade Server TIGW1U—
9.3
DC-Input Power Supply Module .......................................................86
9.3.1 PSU Enclosure ....................................................................86
9.3.2 DC Power Supply Unit Input Connector ...................................86
9.3.3 DC PSU to PDB Interconnect ................................................87
9.3.4 DC Input Voltage.................................................................88
9.3.5 Output Current Ratings .......................................................89
9.3.6 DC PSU LED Indicators ........................................................89
9.3.7 Air Flow .............................................................................90
9.3.8 Thermal Protection .............................................................90
10.0 Regulatory Specifications ....................................................................91
10.1 Safety Compliance .........................................................................91
10.2 Electromagnetic Compatibility..........................................................91
10.3 CE Mark........................................................................................91
10.4 NEBS Compliance ..........................................................................92
10.5 ETSI Standards Compliance (DC Input Only) .....................................92
A
Glossary...............................................................................................93
B
Additional References...........................................................................97
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Technical Product Specification, Rev 1.4
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June 2010
—Carrier Grade Server TIGW1U
Revision History
Date
Version
June 2010
006
Corrected DC power supply connector pin-out table in section 3.3.11
December 2009
005
Kontron version: Changed all Z-U130 Value Solid State Drive (VSSD) references to SMART
Embedded USB Solid-State Drive (eUSB SSD)
April 2008
004
Updated DC Power Supply information in section 9.3.2:
Changed part number
Changed pinout information
003
Updated block diagram in “System Overview” to include NIC port numbers.
Added information to “System Overview” and “Ethernet Front Panel (EFP) Board” about second
MAC address on Ethernet port 1 for IPMI access to Baseboard Management Controller.
Updated rear panel illustrations in “System Overview” and illustration in “AC Power Subsystem” to
show correct power supply unit numbering.
Updated acoustic specification and added cooling requirements to environmental specifications in
“System Overview”.
Updated interconnection diagram in “Cables and Connectors” and to reflect captive front-panel
board power harness.
Added section for GCM interface connector to “Cables and Connectors”.
Added note in “SysCon Board” regarding non-support of SDHC cards.
Updated illustrations in “SysCon Board” to match production version of board.
Updated illustrations in “AC Power Sybsystem” to reflect captive front-panel board power harness.
Corrected input voltages in input connector pin-out in “DC Power Subsystem”.
March 2007
002
Updated multiple figures to show new fan mounting.
Updated all descriptions of RAID support.
Updated and corrected interconnection block diagram.
Updated description of front-panel Flex cable to include baseboard signal names as well as SFP
board signal names.
Updated and corrected all descriptions and specifications of front-panel LEDs.
January 2007
001
Initial release specific to TIGW1U server. (Previously was combined document for TIGW1U server
and IP Network Server NSW1U.)
June 2007
June 2010
Description
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
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June 2010
Introduction—Carrier Grade Server TIGW1U
1.0
Introduction
This document provides an overview of the Kontron Carrier Grade Server TIGW1U,
including information about the chassis hardware, cables, connectors, system boards,
power subsystem, and regulatory requirements.
1.1
Document Structure and Outline
This document is organized into the following chapters:
Chapter 1.0, “Introduction” — Provides an overview of this document.
Chapter 2.0, “System Overview” — Provides an overview of the Kontron Carrier Grade
Server TIGW1U chassis hardware.
Chapter 3.0, “Cables and Connectors” — Describes the cables and connectors used to
interconnect the system board set and the server system components.
Chapter 4.0, “SAS Front Panel (SFP) Board” — Describes the specifications of the front
panel I/O boards including SAS RAID features.
Chapter 5.0, “SMART Embedded USB Solid-State Drive” — Describes the specifications
of the optional SMART Embedded USB Solid-State Drive.
Chapter 6.0, “PCI/PCI-X* Riser Card” — Describes the specifications of the standard
PCI-X riser card.
Chapter 7.0, “PCI Express* Riser Card” — Describes the specifications of the optional
PCI Express riser card.
Chapter 8.0, “AC Power Subsystem” — Describes the specifications of the AC-input
power subsystem.
Chapter 9.0, “DC Power Subsystem” — Describes the specifications of the DC-input
power subsystem.
Chapter 10.0, “Regulatory Specifications” — Describes system compliance to
regulatory specifications.
June 2010
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—Introduction
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
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June 2010
System Overview—Carrier Grade Server TIGW1U
2.0
System Overview
This chapter describes the features of the Kontron Carrier Grade Server TIGW1U.
This chapter is organized into the following sections.
• Introduction
• External Chassis Features
• Internal Chassis Features
• Server Management
• Specifications
2.1
Introduction
The Kontron Carrier Grade Server TIGW1U is a compact, high-density, rack-mount
server system with support for two low-voltage Dual-Core Intel® Xeon® processors and
24 GBytes of DDR2-667 FBD ECC DIMM memory). The server supports high availability
features such as hot-swappable disk drives and hot-swappable and redundant power
supply modules. The scalable architecture of the TIGW1U server supports a variety of
operating systems.
Figure 1 shows the assembled TIGW1U server. Figure 2 shows the system with the top
cover and the front bezel removed.
Figure 1.
Carrier Grade Server TIGW1U (Top Cover On)
AF000800
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Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—System Overview
Figure 2.
Carrier Grade Server TIGW1U (Top Cover Off)
C
D
E
F
B
A
M
G
L
K
J
H
I
AF000801
Item
2.1.1
Description
Item
Description
A
Front panel board
H
System fans
B
Power distribution board (PDB)
I
Three SAS hard disk drive bays (see note)
C
Power supply units, AC or DC input (one PSU
standard, second PSU optional)
J
DVD drive
D
PCI-X* or PCI Express* card bracket
K
SAS controller
E
Riser card assembly (PCI-X or PCI Express)
L
Front panel LEDs and switches
F
S5000PHB server board
M
Serial port (RJ45) and USB 2.0 connectors
G
System memory
Carrier Grade Server TIGW1U Features
Table 1 provides a list and brief description of the server features.
Table 1.
Carrier Grade Server TIGW1U Feature List
Feature
Description
Compact, high-density
system
Rack-mount server with a height of 1U (1.75 inches) and a depth of 20.0
inches
Configuration flexibility
Two-way capability in low profile and cost/value-effective packaging
Stand-alone system
Two Dual-Core Intel® Xeon® processors 5100 series or two Quad-Core Intel®
Xeon® processors 5400 series
Serviceability
Rear access to hot-swappable power supplies
Front access to hot-swappable hard disk drives
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System Overview—Carrier Grade Server TIGW1U
Table 1.
Carrier Grade Server TIGW1U Feature List (Continued)
Feature
Description
Availability
Supports two hot-swappable 450 W power supplies in a redundant (1+1)
configuration (with optional second PSU)
Integrated support for software RAID levels 0 & 1 using three internal hotswappable 2.5-inch SAS disk drives, and RAID levels 0, 1, and 10 when using
additional external SAS drive(s) through rear-panel connector.
Supports ROMB (RAID On Mother Board) hardware RAID operation for
RAID 0, 1, and 5 capability with addition of optional Intel® RAID Activation
Key and ECC Mini-DIMM.
Memory rank sparing
Manageability
Remote management and diagnostics support
Emergency management port (serial and LAN)
IPMI 2.0 compliant
Support for optional SMART Embedded USB Solid-State Drive
Upgradeability and
investment protection
Supports Dual-Core Intel® Xeon® processors 5100 series or Quad-Core Intel®
Xeon® processors 5400 series
Multi-generational chassis
Supports Intel® 64 architecture
System-level scalability
Supports up to 24 Gbytes of DDR2-533 or DDR2-667, registered SDRAM FBD
DIMM memory
Supports two Dual-Core Intel® Xeon® processors 5100 series or two QuadCore Intel® Xeon® processors 5400 series
Full-height, full-length, 64-bit x 100/66 MHz PCI-X or x8 PCI Express slot
Three internal hot-swappable 2.5-inch SAS hard disk drives with RAID support
Supports up to four external SAS hard disk drives
Low-profile PATA optical (DVD or CD) drive
Front panel
Power switch
Reset switch
NMI switch
ID switch
Main power LED
HDD activity LED
NIC activity LED
ID LED
Power fault Telco alarm/relay LED
Critical fault Telco alarm/relay LED
Major fault Telco alarm/relay LED
Minor fault Telco alarm/relay LED
I/O
Front Access
• Serial B port (RJ45)
• USB 2.0 port
Rear Access
• Four GbE NIC ports
• SAS 4x drive port with RAID support
• Telco alarms port
• Serial B port (RJ45)
• Two USB 2.0 ports
• GCM 100 Mbps management port
(requires Intel® RMM2 accessory)
• Dual PS/2 ports for keyboard and
mouse
• Video port
The S5000PHB server board is mounted horizontally toward the rear of the chassis
behind the system fan array. The server board uses two LGA 771 processor sockets,
and has six DIMM slots for up to 24 Gbytes of error checking and correcting (ECC) FBD
memory. The server board contains one PCI Super Slot to accommodate a full-height,
full-length PCI, PCI-X, or x8 PCI Express (PCIe) add-in board by means of a riser card,
plus input/output (I/O) ports and various controllers.
The hot-swappable power supply modules are installed at the left-rear of the chassis,
as shown in Figure 2. AC-input and DC-input modules are available, and two 450 W
power supply modules can be installed for a 1+1 redundant configuration. A filler
module for the empty power supply location is supplied for systems without power
supply redundancy.
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Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—System Overview
Up to three 2.5-inch SAS hard drives can be mounted in the hot-swap drive bays, which
are located in the bottom front of the chassis.
Figure 2 shows the location of the hot-swappable drives, which are accessible when the
front bezel is removed. Integrated support for software RAID levels 0 and 1 (and level
10 with connection of external SAS drives through a rear-panel connector) is provided.
ROMB (RAID On Mother Board) hardware RAID with RAID 0, 1, and 5 capability is
supported with installation of an optional Intel® RAID Activation Key and a mini-DIMM
memory module.
A slim-line DVD drive is mounted above the hard drives, as shown in Figure 2, using a
drive tray assembly inserted into the front of the system.
The front panel I/O board (referred to as the SAS front panel board or SFP board) is
located in front of the power supplies and extends behind the hot-swappable SAS hard
drives. The hard drives dock into the SFP board. The SFP board also provides the user
interface for the system’s front panel and for the SIO (system management) serial
port.
The front bezel can be customized to meet OEM industrial design requirements. The
bezel design allows adequate airflow to cool the system components. The front bezel is
removed to access the HDD drive trays.
The system contains one 40 × 40 × 28 mm single-rotor fan to cool the PCI area of the
server board and an array of four 40 × 40 × 56 mm dual-rotor fans to cool the CPU,
memory, and the other server board components. The PCI fan is located to the left of
the hard drive area and in front of the power distribution board (PDB) and the CPU/
memory fans are directly behind the hard drives and directly in front of the server
board, as shown in Figure 2. The PCI fan connector is located on the SFP board to the
left of the PCI fan. The connectors for the CPU/memory fans are on the SFP board in
front of the fans.
Figure 3 shows a functional block diagram of the Carrier Grade Server TIGW1U.
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Technical Product Specification, Rev 1.4
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System Overview—Carrier Grade Server TIGW1U
Figure 3.
June 2010
Carrier Grade Server TIGW1U Functional Block Diagram
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Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—System Overview
2.2
External Chassis Features
2.2.1
Front Panel
Figure 4 shows the front view of the system with the bezel installed and Figure 5 shows
the front of the system with the bezel removed. Removing the bezel provides access to
the three hot-pluggable hard drive tray assemblies and to the optical drive.
The hard drive and optical drive areas are described in the following sections.
Figure 4.
Front View (Bezel Installed)
A
B
C
Alarms
CRT
MJR
ID
NIC
MNR
PWR
Status
ON
D
AF000806
Item
Figure 5.
Description
Item
Description
A
Front-panel Serial B port (RJ45)
C
Optical drive (or filler panel)
B
Front-panel control switches and status LEDs
D
USB 2.0 port 2
Front View (Bezel Removed)
A
B
C
Alarms
CRT
MJR
ID
NIC
MNR
PWR
Status
ON
H
G
E
F
D
AF000807
Item
Description
Item
Description
A
Front-panel serial B port (RJ45)
E
Drive bay 1 and handle
B
Front-panel control switches and status LEDs
F
Drive bay 2 and handle
C
Optical drive (or filler panel)
G
HDD activity (green) and fault (amber) LEDs
(per drive)
D
Drive bay 0 and handle
H
USB 2.0 port 2
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System Overview—Carrier Grade Server TIGW1U
2.2.2
Front Panel Features
The front panel features are shown in Figure 6 and described in Table 2. All front panel
control switches and status LEDs are contained on the SFP board. See Section 4.13 for
a detailed description of the control switches and status LEDs on the front panel.
Figure 6.
Front Panel Details
A
B
D
C
E
F
MNR
PWR
Alarms
CRT
MJR
Status
L
ID
NIC
ON
J
I
H
K
G
AF000808
Table 2.
Front Panel Features
Item
Feature
Description
Front Panel Switches
A
Power switch
Toggles the system power
B
Reset switch
Resets the system
K
ID switch
Toggles the system ID LED
L
NMI switch
Asserts NMI to the server board
Front Panel Alarms LEDs
Critical (yellow or red†)
When continuously lit, this indicates the presence of a Critical System
Fault. A critical system fault is an error or event with a fatal system
impact. In this case, the system cannot continue to operate. An example
is the loss of a large section of memory, or other corruption that renders
the system not operational.
The critical alarm relay is engaged when the LED is lit.
D
Major (yellow or red†)
When continuously lit, this indicates the presence of a Major System
Fault. A major system fault is an error or event that has discernible
impact to system operation. In this case, the system can continue to
operate but in a “degraded” fashion (reduced performance or loss of nonfatal feature reduction). An example is the loss of one of two mirrored
disks.
The major alarm relay is engaged when the LED is lit.
E
Minor (yellow)
When continuously lit, this indicates the presence of a Minor System Fault.
A minor system fault is an error or event that has little impact to actual
system operation. An example is a correctable ECC error.
The minor alarm relay is engaged when the LED is lit.
F
Power (yellow)
When continuously lit, this indicates the presence of a Power System
Fault.
The power alarm relay is engaged when the LED is lit.
C
†
June 2010
Critical and major alarm indicators are bi-color LEDs that can be configured to be yellow or red by an
SDR TAM setting. Yellow is the default.
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Carrier Grade Server TIGW1U—System Overview
Table 2.
Front Panel Features (Continued)
Item
Feature
Description
Front Panel Status LEDs
2.2.3
G
Disk Activity/Fault LED
(green/amber)
Indicates hard drive activity when green, or a hard drive fault when
amber. This is an OR’ed display for all three internal drives.
H
Main power LED (green)
When continuously lit, this indicates the presence of DC power in the
server. The LED goes out when the power switch is turned off (standby
mode) or the power source is disrupted.
I
NIC activity LED (green)
Indicates NIC activity.
J
System ID LED (white)
This LED can be toggled remotely or by front-panel ID switch for
identification purposes.
Hard Drives
The chassis provides three hot-swappable hard drive tray assemblies at the front, as
shown in Figure 7. The tray assemblies accommodate SAS 2.5-inch hard disk drives.
Figure 7.
Hard Drive Positions
D
A
B
C
AF000809
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System Overview—Carrier Grade Server TIGW1U
2.2.3.1
SAS Hard Drive Tray Assembly
Each hard drive must be mounted to a drive tray as shown in Figure 8, The drive is
attached to the tray by four screws inserted into the sides of the drive.
Figure 8.
SAS Hard Drive Tray
B
A
AF000810
2.2.4
Optical Drive
The chassis provides an ptical drive location at the front of the chassis above the three
hard drive bays, as shown in Figure 7. The optical drive is mounted in a non-hotswappable tray that is secured to the chassis by one captive fastener. The optical drive
tray assembly accommodates a 0.5-inch (12.7 mm) slim-line optical drive.
The optical drive tray assembly is installed from the front of the system through the
front wall of the chassis. See Figure 9.
Note:
The optical drive tray assembly can be removed only when the system is powered off,
the bezel is removed, and the IDE signal and optical drive power cables have been
disconnected from the back of the drive tray assembly.
Figure 9.
Optical Drive Tray Mounting
B
A
AF000811
June 2010
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Carrier Grade Server TIGW1U—System Overview
2.2.4.1
Optical Drive Tray Assembly
As shown in Figure 10, the optical drive is installed in a drive tray assembly before
installing it into the system. An interface board that provides power and signal cable
connections is installed on the rear of the optical drive.
Two cables are required to interconnect the optical drive to the server board and to the
EFP board.
• A 40-wire IDE cable connects the 2 × 20 IDE connector on the optical drive
interface board to the 2 × 20 IDE connector on the server board.
• A two-wire discrete power cable connects the 1 × 2 connector on the optical drive
interface board to the EFP board.
Figure 10.
Optical Drive Tray Assembly
A
B
AF000812
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June 2010
System Overview—Carrier Grade Server TIGW1U
2.2.5
System Rear View
Figure 11.
System Rear View
A
R
Q
P
B
C
D
O
N
M
E
L
F
G H
I
J
K
AF000813
Item
Description
Item
Description
A
PS/2 mouse connector
J
B
COM2 (Serial B) port connector (RJ45)
K
External 4x SAS connector
GbE NIC port 3 connector (RJ45)
L
Management port. Requires optional Intel®
Remote Management Module 2 or filler panel
D
GbE NIC port 2 connector (RJ45)
M
GbE NIC port 1 connector (RJ45) ††
E
PCI card I/O bracket or filler panel (shown)
N
GbE NIC port 4 connector (RJ45)
C
Power supply 2 DC input connector †
F
Ground studs (used with DC-input systems)
O
USB connectors, ports 0 (bottom) and 1 (top)
G
Power supply 1 †
P
Telco alarms connector (DB15)
H
Power supply 1 DC input connector †
Q
Video connector
I
Power supply 2 (optional) or filler panel†
R
PS/2 keyboard connector
†
††
Items G through J in Figure 11 illustrate the DC-input configuration. AC-input power supply modules
are also available.
Port 1 has a second MAC address and IP address that provide access to the baseboard management
controller to enable remote IPMI management over LAN.
2.3
Internal Chassis Features
2.3.1
Intel® Server Board S5000PHB
See the Intel® Server Board S5000PHB Technical Product Specification for detailed
information about this server board.
2.3.2
PCI/PCI Express Adapter Subsystem
The S5000PHB server board implements a PCI super slot that contains the signals
necessary for a PCI-X* or PCI Express* (PCIe*) expansion slot. One of two low-profile
riser cards is inserted into the super slot to access the required signals and provide the
appropriate connector for a PCI/PCI-X or PCI Express adapter card. The server
accommodates full-length, full-height adapter cards and the card’s I/O bracket is
accessible through an opening in the rear panel of the system.
The system is delivered with the PCI/PCI-X riser card installed in the system board riser
slot. To use a PCIe adapter card, the PCI-X riser card must be replaced with a PCIe riser
card, which may be ordered as an accessory.
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Carrier Grade Server TIGW1U—System Overview
To add an adapter card to the system, a user removes the riser card assembly from the
system and removes the I/O filler panel from the rear of the server. After attaching the
appropriate riser card to the PCI or PCIe adapter card, the assembly is plugged into the
super slot connector near the center of the server board. See the Intel® Server Board
S5000PHB Technical Product Specification for electrical characteristics for this PCI/PCIe
adapter subsystem.
Note:
See the Kontron Carrier Grade Server TIGW1U Tested Hardware and Operating System
List (THOL) for a list of supported adapter cards.
The PCI-X riser card implements a 64-bit PCI slot with bus speeds of 33 MHz or 66 MHz
for PCI adapter cards or 66 MHz, 100 MHz, or 133 MHz for PCI-X cards.
The PCI Express riser card implements a x8 link interface, and can be used with
adapter cards that implement x1, x4, or x8 interfaces.
2.3.3
Power Subsystem
The power subsystem consists of up to two hot-swappable power supply units (PSU)
and a power distribution board (PDB). The system can be configured and operated with
either an AC or DC input PSU located at the left rear of the chassis that docks into a
common PDB. The system can contain up to two PSUs and can be configured as
follows:
• Two PSUs installed, (1+1) power redundancy for maximally loaded system
• One PSU installed, non-redundant for maximally loaded system
When the system is configured with two power supply modules, the hot-swap feature
allows the user to replace a failed PSU without interrupting system operation. To ensure
that all components remain within specification under all system environmental
conditions, it is recommended that PSU hot-swap operations not exceed two minutes in
duration.
Power from the power subsystem is carried directly to the server board through a
docking connector between the PDB and the server board. Front panel board power is
provided from the PDB through a cable. Peripheral devices are powered from the front
panel board via discrete cables between the device and the front panel board. One PSU
is capable of handling the worst-case power requirements for a fully configured Carrier
Grade Server TIGW1U. This includes two low-voltage Dual-Core Intel® Xeon®
processors, 24 Gbytes of memory, three 2.5-inch SAS hard drives, and one full-height,
full-length PCI or PCI Express add-in board at 25 W.
Note:
The total power requirements exceeds the 240 VA energy hazard limits, which defines
an operator-accessible area. Only qualified technical individuals should access the
processor, memory, and I/O areas on the Intel® Server Board S5000PHB while the
system is energized.
See Chapter 8.0, “AC Power Subsystem”, or Chapter 9.0, “DC Power Subsystem”, in
this document for detailed power specifications.
Kontron Carrier Grade Server TIGW1U
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System Overview—Carrier Grade Server TIGW1U
Figure 12.
AC-input Power Supply Module (Input End)
AF000826
Figure 13.
DC-input Power Supply Module (Input End)
AF000828
Figure 14.
AC-input or DC-input Power Supply Module (Output End)
AF000827
June 2010
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Carrier Grade Server TIGW1U—System Overview
2.3.4
Cooling Subsystem
There are three cooling areas in the Carrier Grade Server TIGW1U:
• Front panel board area
• PCI area
• CPU / memory / HDD area
Figure 15.
System Cooling Areas
Front Panel
Board Area
Airflow
PCI Area
Airflow
CPU-MemoryHDD Area
Airflow
TS000216
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System Overview—Carrier Grade Server TIGW1U
2.3.4.1
Front Panel Board Cooling Area
The left one-fourth of the front panel board and the portion of the PDB in this area are
cooled by the 40 × 40 × 56 mm dual-rotor fans in the PSU modules. See Figure 15.
One PSU is sufficient to cool this portion of the front panel board area and two PSUs
provide cooling redundancy for this area.
The PSU fans draw air in through the front bezel and through vents in the left front side
of the chassis. Air is moved over this portion of the front panel board and PDB through
the PSU and then exhausted out the rear of each PSU. The left wall of the PCI fan air
duct and the PSU guide wall provide an air flow barrier between the front panel board
cooling area and the PCI cooling area.
2.3.4.2
PCI Cooling Area
The 40 × 40 × 28 mm single-rotor PCI fan cools the portions of the server board, PDB,
and front-panel board that are in this area as shown in Figure 15, and any PCI or PCI
Express adapter card installed in the riser card.
The PCI fan draws air in through the front bezel and exhausts out the rear of the
system. A plastic air duct directs the air flow in this area, house the PCI fan, and
provides air flow barriers between
• The front panel board and the PCI cooling areas.
• The PCI and the CPU-memory-HDD cooling areas.
A second plastic part behind the PCI air duct continues the air flow barrier between the
PCI cooling area and the CPU / memory / HDD cooling area. The riser card provides the
third portion of the air flow barrier between the PCI cooling area and the CPU / memory
/ HDD cooling area.
2.3.4.3
CPU-Memory-HDD Cooling Area
The system uses four 40 × 40 × 56 mm dual-rotor fans that slide into individual
pockets in a sheet metal bracket between the SFP board and the server board,
immediately in front of the processors and their heatsinks.
Air is drawn in through the front bezel and exhausted out the rear of the chassis. The
CPU / memory / HDD cooling area air flow path is isolated from the rest of the system
by the PCI air ducts and riser card. Air entering the CPU / memory air duct is preheated
by the hard drives.
2.3.4.4
Fan Speed Control
The S5000PHB server board contains three pulse-width-modulation (PWM) circuits that
provide duty cycle controlled PWM signals to the system fans in three separate
domains. The PSU fans are not controlled by the system. PWM 1 controls the CPU2 and
memory area fan, PWM2 controls the CPU1 fans, and PWM3 controls the PCI cooling
area fan as shown in Figure 16.
The fan speeds are set per Table 3 based on ambient temperature feedback from the
front panel board, and baseboard (PCI area) sensors. If the processors reach their
throttling temperature the fans will ramp to higher speeds. If a system fan fails, the
remaining system fans will be set for maximum speed.
June 2010
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Carrier Grade Server TIGW1U—System Overview
Figure 16.
Fan PWM Domains
PSU Fans
CPU-MEMHDD Fans
PWM 3
PWM 1
PWM 2
PCI Fan
AF000833-B
Table 3.
Fan Speed Settings
Temperature
2.3.4.5
PCI Area Fan
PWM Duty Cycle
CPU1 Area Fan
PWM Duty Cycle
CPU2 & Mem Area Fan
PWM Duty Cycle
0° C to 23° C
55%
55%
55%
24° C
56%
56%
56%
25° C
57%
57%
57%
26° C
58%
58%
58%
27° C
59%
59%
59%
28° C
60%
60%
60%
29° C
62%
62%
62%
30° C
66%
66%
66%
31° C
71%
71%
71%
32° C
77%
77%
77%
33° C
84%
84%
84%
34° C
92%
92%
92%
35° C
100%
100%
100%
Cooling Summary
The cooling subsystem is sized to provide cooling for:
• Two processors
• 24 Gbytes of 667 MHz DRx8 FBD memory
• Three 15,000 RPM SAS 2.5-inch hard drives at a maximum of 18 W per drive
• One PCI, PCI-X, or PCI Express card at a maximum of 25 W
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System Overview—Carrier Grade Server TIGW1U
The cooling subsystem meets acoustic and thermal requirements at the lower fan
speed settings. At higher fan speed settings, thermal requirements are met for the
maximum ambient temperatures, but acoustic requirements are not met. The
environmental specifications are summarized in Section 2.5.1, “Environmental
Specifications”.
2.4
Server Management
See the Intel® Server Board S5000PHB Technical Product Specification and the Core
(ESB2) EPS for a detailed description of the server management design and features.
The server management sub-system consists of a micro-controller, communication
buses, sensors, system BIOS, and server management firmware. The baseboard
management controller (BMC) component of the ESB2-EO provides on-board platform
instrumentation.
Table 4 summarizes the supported features:
Table 4.
Server Management Features
Element
IPMI Messaging, Commands, and Abstractions
Yes
Baseboard Management Controller (BMC)
Yes
Sensors
Yes
Sensor Data Records (SDRs) and SDR Repository
Yes
FRU Information
Yes
Autonomous Event Logging
Yes
System Event Log (SEL)
3276 Entries
BMC Watchdog Timer, covering BIOS and run-time software
Yes
IPMI Channels, and Sessions
Yes
EMP (Emergency Management Port) - IPMI Messaging over Serial/Modem. This
feature is also referred to as DPC (Direct Platform Control) over serial/modem.
Yes
Serial/Modem Paging
Yes
Serial/Modem Alerting over PPP using the Platform Event Trap (PET) format
Yes
DPC (Direct Platform Control) - IPMI Messaging over LAN (available via both
on-board network controllers)
Available over dedicated management port (ESB2 NIC 1)
Yes
LAN Alerting using PET
Yes
Platform Event Filtering (PEF)
Yes
ICMB (Intelligent Chassis Management Bus) - IPMI Messaging between chassis
Yes
PCI SMBus support
Yes
Fault Resilient Booting
Yes
BIOS logging of POST progress and POST errors
Yes
Integration with BIOS console redirection via IPMI v2.0 Serial Port Sharing
Yes
Access via web browser
No †
SNMP access
Yes
Telnet access
No
DNS support
Yes
†
June 2010
Supported
Requires optional Intel® Remote Management Module 2 (Intel® RMM2)
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Carrier Grade Server TIGW1U—System Overview
Table 4.
Server Management Features (Continued)
Element
Supported
DHCP support (dedicated NIC only)
Yes
Memory Sparing/Mirroring sensor support
* does not support mirroring
Yes/No*
Alerting via Email
Yes
Keyboard, Video, Mouse (KVM) redirection via LAN
No †
High speed access to dedicated NIC
Yes
†
Requires optional Intel® Remote Management Module 2 (Intel® RMM2)
2.5
Specifications
2.5.1
Environmental Specifications
The system is tested to the environmental specifications indicated in Table 5. All testing
is performed per procedures defined in Bellcore GR-63-CORE NEBS Physical Protection,
Bellcore GR-1089-CORE EMC and Electrical Safety — Generic Criteria for Network
Telecommunications Equipment, and the Intel Environmental Standards Handbook.
Table 5.
Environmental Specifications Summary
Environment
Specification
Temperature, operating
+5° C to +40° C (41° F to 104° F)
Temperature, non-operating
-40° C to +70° C (-40° F to +158° F)
Altitude
0 to 900m (2,950 ft.) @ 40° C, temperature derated by 1° C for each
additional 300m (985 ft.)
Humidity, non-operating
95%, non-condensing at temperatures of 23° C (73° F) to 40° C (104° F)
Vibration, operating
Swept sine survey at an acceleration amplitude of 0.1 G from 5 to 100 Hz and
back to 5 Hz at a rate of 0.1 octave/minute, 90 minutes per axis on all three
axes as per Bellcore GR-63-CORE standards
Vibration, non-operating
Swept sine survey at an acceleration amplitude of 0.5 G from 5 to 50 Hz at a
rate of 0.1 octaves/minute, and an acceleration amplitude of 3.0 G from 50 to
500 Hz at a rate of 0.25 octaves/minute, on all three axes as per Bellcore GR63-CORE standard.
2.2 Grms, 10 minutes per axis on all three axes as per the Intel Environmental
Standards Handbook
Shock, operating
Half-sine 2 G, 11 ms pulse, 100 pulses in each direction, on each of the three
axes as per the Intel Environmental Standards Handbook
Shock, non-operating
Trapezoidal, 25 G, 170 inches/sec delta V, three drops in each direction, on
each of the three axes as per Intel Environmental Standards Handbook
Acoustic
Sound power:  7 bels at ambient temperatures <24° C measured at
bystander positions in operating mode
System Cooling Requirement
1200 BTU/hr with single power supply unit
1250 BTU/hr with dual power supply units
RoHS
Complies with RoHS Directive 2002/95/EC
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System Overview—Carrier Grade Server TIGW1U
2.5.2
Physical Specifications
Table 6 provides the physical dimensions of the Carrier Grade Server TIGW1U system.
Table 6.
June 2010
Physical Dimensions
Height
1.70 inches (43.2 mm)
Width
16.93 inches (430.0 mm)
Depth
20.0 inches (508 mm)
Front clearance
2.0 inches (76 mm)
Side clearance
1.0 inches (25 mm)
Rear clearance
3.6 inches (92 mm)
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Carrier Grade Server TIGW1U—System Overview
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Cables and Connectors—Carrier Grade Server TIGW1U
3.0
Cables and Connectors
This chapter describes interconnections between the components of the Kontron
Carrier Grade Server TIGW1U and provides overview diagrams and tables to describe
the signals and pin-outs for the system connectors. See the Intel® Server Board
S5000PHB Technical Product Specification for connector signal descriptions and pinouts not listed in this section.
The information in this chapter is organized into the following sections:
• System Interconnect Block Diagram
• Cable and System Interconnect Descriptions
• User-Accessible Interface Connections
June 2010
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Carrier Grade Server TIGW1U—Cables and Connectors
3.1
System Interconnect Block Diagram
Figure 17.
Interconnect Block Diagram
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Cables and Connectors—Carrier Grade Server TIGW1U
3.2
Cable and System Interconnect Descriptions
3.2.1
Flex Circuit
The flex circuit is an impedance-controlled flexible circuit with 140 signal connections
which interconnects the SFP to the server board.
This cable routes all of the signals between the server board and the SFP board
including:
• All of the front panel I/O signals
• The 4X SAS signals routed from the SAS controller on the SFP board through the
cable to the server board external connector on the back of the system.
Figure 18.
Flex Circuit Cable Connection
TS000217
Table 7 lists the pin-out for the front panel flex connector to the server board.
Table 7.
June 2010
SFP Board Flex Cable Pin-Out (Sheet 1 of 5)
Pin #
SFP Board Signal Name
Server Board Signal Name
1
FP_FLEX_PRES1
FLEX_PRES2
2
SYSCON_USB_P
USB_P3P
3
IPMB_I2C_SCL
SMB_CLK
4
SYSCON_USB_N
USB_P3N
5
IPMB_I2C_SDA
SMB_DATA
6
GND
GND
7
FP_USB_FLT_N
OC_N[3]
8
CLK_100M_DOBSON_P
CLK_100M_PCIE_P
9
GND
GND
10
CLK_100M_DOBSON_N
CLK_100M_PCIE_N
11
EXP_SB_7N
PCIE2_TX3_N
12
NC_FLEX_CONN_SPARE_12
NC
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Carrier Grade Server TIGW1U—Cables and Connectors
Table 7.
SFP Board Flex Cable Pin-Out (Sheet 2 of 5)
Pin #
SFP Board Signal Name
Server Board Signal Name
13
EXP_SB_7P
PCIE2_TX3_P
14
GND
GND
15
CRITICAL_ALARM
DU_HD_LED
16
EXP_NB_7N
PCIE2_RX3_N
17
GND
GND
18
EXP_NB_7P
PCIE2_RX3_P
19
EXP_SB_6N
PCIE2_TX2_N
20
POWER_ALARM
DU_LED4
21
EXP_SB_6P
PCIE2_TX2_P
22
GND
GND
23
MAJOR_ALARM
DU_LED2
24
EXP_NB_6N
PCIE2_RX2_N
25
GND
GND
26
EXP_NB_6P
PCIE2_RX2_P
27
EXP_SB_5N
PCIE2_TX1_N
28
TELCO_LED_SELECT
TELCO_LED_SELECT
29
EXP_SB_5P
PCIE2_TX1_P
30
GND
GND
31
MINOR_ALARM
DU_LED3
32
EXP_NB_5N
PCIE2_RX1_N
33
GND
GND
34
EXP_NB_5P
PCIE2_RX1_P
35
EXP_SB_4N
PCIE2_TX0_N
36
FP_PWR_ENABLE
PWR_ENABLE
37
EXP_SB_4P
PCIE2_TX0_P
38
GND
GND
39
FP_PWR_GOOD
FP_PWR_GOOD
40
EXP_NB_4N
PCIE2_RX0_N
41
GND
GND
42
EXP_NB_4P
PCIE2_RX0_P
43
EXP_SB_3N
PCIE1_TX3_N
44
NIC_ACT_LED_N
NIC_ACT_LED_N
45
EXP_SB_3P
PCIE1_TX3_P
46
GND
GND
47
PWR_LED_ON_N
PWR_LED_N
48
EXP_NB_3N
PCIE1_RX3_N
49
GND
GND
50
EXP_NB_3P
PCIE1_RX3_P
51
EXP_SB_2N
PCIE1_TX2_N
52
FP_NMI_BTN_N
NMI_BTN_N
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Cables and Connectors—Carrier Grade Server TIGW1U
Table 7.
SFP Board Flex Cable Pin-Out (Sheet 3 of 5)
Pin #
June 2010
SFP Board Signal Name
Server Board Signal Name
53
EXP_SB_2P
PCIE1_TX2_P
54
GND
GND
55
FP_PWR_BTN_N
PWR_BTN_N
56
EXP_NB_2N
PCIE1_RX2_N
57
GND
GND
58
EXP_NB_2P
PCIE1_RX2_P
59
EXP_SB_1N
PCIE1_TX1_N
60
FP_RST_BTN_N
RST_BTN_N
61
EXP_SB_1P
PCIE1_TX1_P
62
GND
GND
63
FP_ID_BTN_N
ID_BTN_N
64
EXP_NB_1N
PCIE1_RX1_N
65
GND
GND
66
EXP_NB_1P
PCIE1_RX1_P
67
EXP_SB_0N
PCIE1_TX0_N
68
ID_LED_N
ID_LED_BUF_N
69
EXP_SB_0P
PCIE1_TX0_P
70
GND
GND
71
FP_TEMP_PWM
TEMP_SENSOR
72
EXP_NB_0N
PCIE1_RX0_N
73
GND
GND
74
EXP_NB_0P
PCIE1_RX0_P
75
FP_USB_N
USB_P2N
76
GND
GND
77
FP_USB_P
USB_P2P
78
GND
GND
79
GND
GND
80
SYSCON_USB_FLT_N
USB_OC_N[2]
81
FAN1_TACH
FAN1_TACH
82
FAN2_TACH
FAN2_TACH
83
FAN3_TACH
FAN3_TACH
84
FAN4_TACH
FAN4_TACH
85
FAN5_TACH
FAN5_TACH
86
FAN6_TACH
FAN6_TACH
87
FAN7_TACH
FAN7_TACH
88
FAN8_TACH
FAN8_TACH
89
FAN9_TACH
FAN9_TACH
90
FAN_CPU1_PWM
FAN_CPU1_PWM
91
FAN_PCI_PWM
FAN_PWM
92
FAN_CPU2_PWM
FAN_CPU2_PWM
Kontron Carrier Grade Server TIGW1U
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Carrier Grade Server TIGW1U—Cables and Connectors
Table 7.
SFP Board Flex Cable Pin-Out (Sheet 4 of 5)
Pin #
SFP Board Signal Name
Server Board Signal Name
93
GND
GND
94
GND
GND
95
EMP_DTR_N
DTR2_N
96
EMP_INUSE_L
EMP_INUSE_L
97
EMP_RTS_N
RTS2_N
98
EMP_SOUT
SOUT2
99
EMP_SIN
SIN2
100
EMP_CTS_L
CTS2_N
101
EMP_DSR_N
DSR2_N
102
EMP_DCD_L
DCD2_N
103
GND
GND
104
GND
GND
105
SAS_TX_P<7>
SAS_RX7_P
106
FP_SYS_RESET_N
SYS_RESET_N
107
SAS_TX_N<7>
SAS_RX7_N
108
GND
GND
109
RAID_MODE
RAID_MODE_R
110
SAS_RX_N<7>
SAS_TX7_N
111
GND
GND
112
SAS_RX_P<7>
SAS_TX7_P
113
SAS_TX_P<6>
SAS_RX6_P
114
IBUTTON_PRESENT
IBUTTON_PRES_N
115
SAS_TX_N<6>
SAS_RX6_N
116
GND
GND
117
SERIAL_CLK_LED
SMB_SERIAL_CLK1
118
SAS_RX_N<6>
SAS_TX6_N
119
GND
GND †
120
SAS_RX_P<6>
SAS_TX6_P
121
SAS_RX_P<4>
SAS_TX4_P
122
SERIAL_DATA_IN_LED
FAULT_LED_SHIFT_OUT
123
SAS_RX_N<4>
SAS_TX4_N
124
GND
GND
125
RSET_LED
RSM_RST_N
126
SAS_TX_N<4>
SAS_RX4_N
127
GND
GND
128
SAS_TX_P<4>
SAS_RX4_P
129
SAS_TX_P<5>
SAS_RX5_P
130
SPKR_2400HZ
SAS_RAID_SPKR
131
SAS_TX_N<5>
SAS_RX5_N
132
GND
GND
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Cables and Connectors—Carrier Grade Server TIGW1U
Table 7.
SFP Board Flex Cable Pin-Out (Sheet 5 of 5)
Pin #
3.2.2
SFP Board Signal Name
Server Board Signal Name
133
SAS_DISABLE_N
SAS_DISABLE_N
134
SAS_RX_N<5>
SAS_TX5_N
135
GND
GND
136
SAS_RX_P<5>
SAS_TX5_P
137
P3V3_STBY
P3V3_STBY
138
GND
GND
139
P3V3_STBY
P3V3_STBY
140
FP_FLEX_PRES1
GND
MP1
GND
MP2
GND
IDE Signal Cable
The IDE signal cable is a standard 40-conductor (28 AWG) ribbon cable with 2×20
position, 0.050-inch centers connectors. This cable connects between the optical drive
interface adapter and connector J2J1 on the server board. Figure 19 illustrates the
physical details of the cable assembly. All dimensions are in inches.
Figure 19.
IDE Signal Cable Physical Details
8.30
39
40
40
2
2
2.00
1.00
Pull Strap
1
J2J1
Cable separated into individual
conductors here.
J1
39
3.00
1
2.50
Heat Shrink Tubing
Pull Strap
DRIVE
IDE Cable
D41603-003
Label
Cable Tie [2]
0.40
0.40
AF000858
June 2010
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Carrier Grade Server TIGW1U—Cables and Connectors
3.2.3
Optical Drive Power Cable
Figure 20 illustrates the physical details of the optical drive power cable assembly, with
all dimensions in inches. In the Carrier Grade Server TIGW1U, this cable connects
between the 2-pin power connector on the optical drive interface adapter and a 2-pin
power connector on the front panel board.
Figure 20.
Optical Drive Power Cable Physical Details
P1
3.25
1 2
1 2
CD Power
P2
AF000859
Table 8.
Optical Drive Power 1×2 Connector Pin-Out
Pin #
3.2.4
Signal
1
P5V
2
GND
Front Panel Board Power Harness
The power distribution board uses a 12-conductor, 20 AWG discrete wire harness with
one 1 × 12 connector to supply power to the front panel board. Table 9 shows the
1 × 12 connector pin-out.
Table 9.
Front Panel Board Power Harness Connector Pin-Out
Pin #
Signal
1
P3V3
2
P5V_STBY
3
GND
4
GND
5
P12V
6
P12V
7
P12V
8
GND
9
GND
10
P5V
11
P5V
12
GND
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Cables and Connectors—Carrier Grade Server TIGW1U
3.2.5
SMART Embedded USB Solid-State Drive Signal and Power Cable
(Optional)
The optional SMART Embedded USB Solid-State Drive (eUSB SSD) connects to the SFP
board with a single signal and power cable. The parts kit that is supplied with the eUSB
solid-state drive includes two interface cables that are identical except for their length.
TheTIGW1U server uses the longer of the two cables (part no. D47975-001). The
physical details of this cable are shown in Figure 21 (all dimensions in inches), and the
pin-out of the connectors is given in Table 10.
Figure 21.
eUSB Solid-State Drive Signal and Power Cable Physical Details
7.00
0.70
0.70
Heat Shrink Tubing
2
1
6
5
SysCon Cable
D47975-001
2
1
6
5
Label
Front View
P1
P2
Heat Shrink Tubing
Front View
TS000341
Table 10.
eUSB Solid-State Drive 2 x 3 Connector Pin-Out
Pin #
3.2.6
Signal
1
GND
2
Keyed (no connect)
3
SYSCON_USB_P
4
SYSCON_PWR
5
SYSCON_USB_N
6
GND
RAID Smart Battery Cable
The Intel® RAID Smart Battery cable connects the optional Intel® RAID Smart Battery
to the SFP board when operating theTIGW1U server in SAS hardware RAID mode (for
example, for RAID 5 operation).
Figure 22.
RAID Smart Battery Cable Physical Details
6.00
2
1
1
Front Panel
Battery Cable
Battery
Label
20
20
19
End View
P1
P2
End View
AF000862
June 2010
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Carrier Grade Server TIGW1U—Cables and Connectors
Table 11.
RAID Smart Battery Cable Connector Pin-Out
Pin #
3.2.7
Signal Name
Pin #
Signal Name
1
P12V
2
GND
3
NC_P5V_IBBU
4
GND
5
VBAT_RAID
6
GND
7
P3V3_STBY_PWRGD_IBBU
8
GND
9
VBAT_RAID
10
GND
11
IBBU_RST_N
12
GND
13
IBBU_SMB_SCK
14
GND
15
IBBU_SMB_SDA
16
IBBU_PFAIL_N
17
IBBU_DDR_SEL
18
IBBU_BBE
19
IBBU_BBSTROBE
20
TM_STATUS
Fan Power Cables
The PCI fan uses a wire harness assembly with a 4-pin connector that mates to a
connector on the SFP board. The connector pin-out is shown in Table 12.
Table 12.
PCI Fan 2 x 2 Connector Pin-Out
Pin #
Signal
1
P12V
2
Fan Tachometer Signal
3
GND
4
Fan Speed Control
The four dual-rotor CPU fans all use the same type of wiring harness, which terminates
in an 8-pin connector that mates to a connector on the SFP board. Table 13 provides
the pin-out of these connectors.
Table 13.
CPU Dual-Rotor Fan 2x4 Connector Pin-Out
Pin #
Signal Name
Pin #
Signal Name
1
P12V
5
P12V
2
FRONT_FAN_TACH
6
REAR_FAN_TACH
3
GND
7
GND
4
FAN_CPU_PWM (Fan Speed Control)
8
FAN_CPU_PWM (Fan Speed Control)
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Cables and Connectors—Carrier Grade Server TIGW1U
3.3
User-Accessible Interface Connections
3.3.1
Keyboard and Mouse Ports
Two stacked PS/2 ports support both a keyboard and a mouse. Each port can support
either a mouse or keyboard. Table 14 details the pin-out of the PS/2 connector.
Figure 23.
Keyboard and Mouse Connectors
6
5
4
3
2 1
AF000837
Table 14.
Keyboard and Mouse Port Pin-Out
Pin #
3.3.2
Signal
1
KEYDAT (keyboard data)
2
MSEDAT (mouse data)
3
GND (ground)
4
Fused Vcc (+5V)
5
KEYCLK (keyboard clock)
6
MSECLK (mouse clock)
Serial Port B
Two serial port connectors (Serial B) are provided, one on the front panel and one at
the rear I/O panel, both using 8-pin RJ45 connectors. An RJ45 connector allows
connection to serial port concentrators. For applications that require a DB-9 serial port
connection, an adapter cable must be used.
Both the front and rear serial port connectors connect to COM2. Users can connect to
either the front or the rear serial port connector, but should never connect to both
connectors at the same time.
The connector pin-out differs slightly between the front-panel and rear-panel
connectors, specifically in relation to Pin 6 and Pin 7. On the front-panel serial port
connector, Pin 6 is used as a serial port selection input. Grounding the EMP_INUSE_L
signal that appears on Pin 6 disables the rear-panel serial port connection so that only
the front-panel connection is active. This allows users to plug into and use the frontpanel connector without regard for whether anything is connected to the rear-panel
connector. The front-panel serial port connector always carries the DSR signal on Pin 7.
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Carrier Grade Server TIGW1U—Cables and Connectors
On the rear-panel serial port connector, a server board jumper configures Pin 7 to carry
either the DSR (Data Set Ready) signal or the DCD (Data Carrier Detect) signal as
required by a particular serial port concentrator. The default jumper setting selects the
DSR signal, which conforms to the Cisco* serial port standard. See the Intel® Server
Board S5000PHB Technical Product Specification for details about this jumper or if you
need to change the DSR/DCD configuration.
Figure 24.
Serial B Port Connector
AF000873
Table 15.
Front-Panel Serial Port B (RJ45) Connector Pin-Out
Pin #
Table 16.
EFP Board Signal Name
Description
1
SPB_EMP_RTS_L
RTS (Request To Send)
2
SPB_EMP_DTR_L
DTR (Data Terminal Ready)
3
SPB_EMP_SOUT
TXD (Transmit Data, serial data out)
4
GND
Ground
5
EMP_INUSE_L
When grounded, disables rear-panel serial port
6
SPB_EMP_SIN
RXD (Receive Data, serial data in)
7
SPB_EMP_DSR_L
DSR (Data Set Ready)
8
SPB_EMP_CTS_L
CTS (Clear To Send)
Rear-Panel Serial B Port (RJ45) Connector Pin-Out
Pin #
Signal
1
RTS (Request To Send)
2
DTR (Data Terminal Ready)
3
TXD (Transmit Data)
4
GND
5
RIA (Ring Indicator)
6
RXD (Receive Data)
7
Configurable (using jumper J2A2 on system board) to carry either:
• DSR (Data Set Ready) [default, Cisco port concentrator compatible]
• DCD (Data Carrier Detect)
8
CTS (clear to send)
For server applications that require a DB9 serial connector, an 8-pin RJ45-to-DB9
adapter must be used. The following table provides the pin-out required for the adapter
to provide RS-232 support.
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Cables and Connectors—Carrier Grade Server TIGW1U
Table 17.
RJ-45-to-DB9 Adapter Pin Assignments
RJ45 Pin No.
†
3.3.3
Signal
Description
DB9 Pin No.
1
RTS
Request to Send
7
2
DTR
Data Terminal Ready
4
3
TD
Transmitted Data
3
4
SGND
Signal Ground
5
5
RI
Ring Indicator
9
6
RD
Received Data
2
7
DSR
Data Signal Ready
8
CTS
Clear To Send
6†
8
When using the rear-panel Serial B port connector, the wiring of the RJ45-to-DB9 adapter should
match the configuration of the RJ45 pin-out. If the port has been configured for the DCD rather than
DSR on Pin 7, the adapter cable should connect Pin 1 of the DB9 rather than Pin 6.
Video Port
The video port interface is a standard VGA compatible, 15-pin connector. On-board
video is supplied by an ATI* Rage XL video controller with 8 MB of on-board video
SGRAM.
Figure 25.
Video Connector
5
10
15
1
11
6
AF000839
Table 18.
Video Connector Pin-Out
Pin #
June 2010
Signal
1
Red (analog color signal R)
2
Green (analog color signal G)
3
Blue (analog color signal B)
4
No connection
5
GND
6
GND
7
GND
8
GND
9
Fused Vcc (+5V)
10
GND
11
No connection
12
DDCDAT
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Carrier Grade Server TIGW1U—Cables and Connectors
Table 18.
3.3.4
Video Connector Pin-Out
13
HSYNC (horizontal sync)
14
VSYNC (vertical sync)
15
DDCCLK
Universal Serial Bus (USB) Interface
The server board provides four USB ports. USB ports 0 and 1 are brought to the rear.
USB ports 2 and 3 are routed to the front panel board where USB port 2 is brought to
the front of the system and USB port 3 is used internally for interfacing to the optional
SMART Embedded USB Solid-State Drive. The built-in external USB ports permit direct
connection of three USB peripherals without an external hub. If more devices are
required, an external hub can be connected to any of the built-in ports.
Figure 26.
External USB Connector
AF000840
Table 19.
USB Connector Pin-Out
Pin #
3.3.5
Signal
1
Fused Vcc (+5V w/over-current monitor of ports 0, 1, 2, and 3)
2
DATAL0 (differential data line paired with DATAH0)
3
DATAH0 (differential data line paired with DATAL0)
4
GND
Ethernet Connectors
The system provides four RJ45 Ethernet NIC connectors. These NIC connectors are
located at the back edge of the S5000PHB server board and are accessible on the rear
I/O panel. The Ethernet connectors appear as stacked pairs as illustrated in Figure 27.
The pin-out of each connector is identical and is defined in Table 20.
Figure 27.
Stacked Ethernet Connector Pair
Pin 8
Pin 1
Pin 1
Pin 8
AF000838-D
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Cables and Connectors—Carrier Grade Server TIGW1U
Table 20.
Ethernet Connector Pin-Out
Pin #
Signal Name
Description
1
BI_DA+
Bi-directional pair A, +
2
BI_DA–
Bi-directional pair A, –
3
BI_DB+
Bi-directional pair B, +
4
BI_DC+
Bi-directional pair C, +
5
BI_DC–
Bi-directional pair C, –
6
BI_DB–
Bi-directional pair B, –
7
BI_DD+
Bi-directional pair D, +
8
BI_DD–
Bi-directional pair D, –
For each Ethernet connector there are two status indicator LEDs integrated into the
connector assembly, a green LED to the left of the connector and a bi-color LED to the
right of the connector.
The green LED indicates the connection status for each port. If the port is connected to
a network but there is no current activity, the green LED is continuously illuminated.
When there is activity on the connected network the green LED blinks.
The bi-color LED indicates the connection speed. If the green LED indicates a network
connection but the bi-color LED is not lit, then the connection speed is 10 Mbps. If the
bi-color LED shows a solid green indication, then the connection speed is 100 Mbps. If
the bi-color LED is solid amber, then the connection speed is 1 Gbps.
3.3.6
GCM Remote Management Module Connector
The TIGW1U server supports the installation of an optional Intel® Remote Management
Module 2, which provides a 1000 Mbps Ethernet interface through a GCM connector
module. The connector outline, pin-out, and LED indications for the GCM connector are
the same as for the server’s standard Ethernet connectors, as described above.
3.3.7
Telco Alarms Connector
The system provides one Telco DB15 alarms connector on the rear panel. Figure 28
shows the Telco alarms connector as viewed from the back of the server and Table 21
shows the pin-out for the connector.
Figure 28.
Telco Alarms Connector
1
8
9
15
AF000841
June 2010
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Carrier Grade Server TIGW1U—Cables and Connectors
Table 21.
3.3.8
Telco Alarms Connector Pin-Out
Pin
Description
Pin
Description
1
MinorReset +
9
MinorAlarm – NC
2
MinorReset -
10
MinorAlarm - COM
3
MajorReset +
11
MajorAlarm - NO
4
MajorReset -
12
MajorAlarm - NC
5
CriticalAlarm - NO
13
MajorAlarm - COM
6
CriticalAlarm - NC
14
PwrAlarm - NO
7
CriticalAlarm - COM
15
PwrAlarm - COM
8
MinorAlarm - NO
Internal SAS Hard Disk Drive Connector
The SFP board provides three connectors for the internal hot-swappable 2.5-inch SAS
hard disk drives.
Table 22.
2.5-inch SAS Hard Drive Connector Pin-Out
Pin #
Signal Name
Pin #
Signal Name
P1
NC_SASX_P1
S1
GND
P2
NC_SASX_P2
S2
SAS_TX_P<X>
P3
NC_SASX_P3
S3
SAS_TX_N<X>
P4
GND
S4
GND
P5
GND
S5
SAS_RX_N<X>
P6
DRVX_PRSNT_N
S6
SAS_RX_P<X>
P7
DRVX_5V_PCHRG
S7
GND
P8
P5V
S8
GND
P9
P5V
S9
NC_SASX_S9
P10
GND
S10
NC_SASX_S10
P11
ACTLED_DRVX
S11
GND
P12
GND
S12
NC_SASX_S12
P13
DRVX_12V_PCHRG
S13
NC_SASX_S13
P14
P12V
S14
GND
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Cables and Connectors—Carrier Grade Server TIGW1U
3.3.9
External SAS 4X Hard Disk Drive Connector
The system provides an external SAS 4X hard drive connector for RAID support. The
SAS 4X external connector is illustrated in Figure 29, and the pin-out is shown in
Table 23.
Figure 29.
External SAS 4X Hard Disk Drive Connector
AF000842
Table 23.
June 2010
External SAS 4X Hard Disk Drive Connector Pin-Out
Pin
Signal
Pin
Signal
S1
SAS_RX4_P
S2
SAS_RX4_N
S3
SAS_RX5_P
S4
SAS_RX5_N
S5
SAS_RX6_P
S6
SAS_RX6_N
S7
SAS_RX7_P
S8
SAS_RX7_N
S9
SAS_TX7_N
S10
SAS_TX7_P
S11
SAS_TX6_N
S12
SAS_TX6_P
S13
SAS_TX5_N
S14
SAS_TX5_P
S15
SAS_TX4_N
S16
SAS_TX4_P
G1
GND
G2
GND
G3
GND
G4
GND
G5
GND
G6
GND
G7
GND
G8
GND
G9
GND
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Carrier Grade Server TIGW1U—Cables and Connectors
3.3.10
AC Power Input for AC-Input Power Supply
An IEC320-C13 receptacle is at the rear of each AC-input power module. An
appropriately sized power cord and AC main is recommended. See Chapter 8.0, “AC
Power Subsystem”, for system voltage, frequency, and current draw specifications.
Figure 30.
AC Power Input Connector
Line
GND
Neutral
AF000843
3.3.11
DC Power Input for DC-Input Power Supply
A Molex* MTC 4-pin DC connector (Molex p/n 55757-0420 or an equivalent) is used in
the DC power supply modules to provide the DC-input power connection. The required
mating connector is a Molex 54927-0420 or equivalent. Use an appropriately-sized
power wire and DC main. See Chapter 9.0, “DC Power Subsystem” for system DC
voltage and current draw specifications.
Figure 31.
DC Power Input Connector
Pin 1
The pin-out of the DC input connector is in Table 24.
Table 24.
DC Power Supply Module Input Pin Assignments
Pin#
Description
1
RTN
2
RTN
3
-48V
4
-48V
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SAS Front Panel (SFP) Board—Carrier Grade Server TIGW1U
4.0
SAS Front Panel (SFP) Board
This chapter describes the basic functions and interface requirements of the SAS front
panel (SFP) board on the Kontron Carrier Grade Server TIGW1U.
This chapter is organized in the following sections:
• Features
• Overview
• Component Location
• Power Distribution
• I/O Processor Subsystem
• SAS Controller (LSI1068)
• VSC410 Enclosure Management Controller
• Clock Generation/Distribution
• Programmable Logic Device (PLD)
• Hardware RAID
• Software RAID
• Power Good and Reset Control
• Front Panel Switches and Status Indicators
4.1
Features
• Four switches to control power-on, reset, NMI, and the system ID
• One RS-232 front panel port
• One USB 2.0 front panel port
• One USB 2.0 interface to the optional eUSB solid-state drive
• Five fan connectors to provide power, control, and monitoring of four dual-rotor
CPU fans and one single-rotor PCI fan
• One power connector for the optical drive port
• One system ID LED that can be controlled remotely or by the system ID switch
• Two system activity LEDs that indicate power-on and NIC activity
• One hard drive dual LED that indicates activity/fault status for all internal SAS
drives
• Four individual Telco alarm LEDs indicating critical, major, minor, and power alarms
• DDR2 mini-DIMM connector providing data caching for hardware RAID
• Three SAS connectors to support three independent internal 2.5-inch SAS hard
drives
• Support for external SAS 4X disk drive connector on the S5000PHB server board
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Carrier Grade Server TIGW1U—SAS Front Panel (SFP) Board
• Integrated support for software RAID 0/1/10
• Hardware RAID support for RAID 5 capability with installation of optional RAID
activation key
• Support for up to 1 Gbyte of optional DDR2 registered ECC memory (mini-DIMM
module) for hardware RAID caching
• Support for RAID smart battery to preserve the contents of RAID memory miniDIMM if power falls below specifications
4.2
Overview
The SAS front panel (SFP) board provides SAS support for the Carrier Grade Server
TIGW1U. The standard SFP configuration provides software supported RAID 0 and
RAID 1 operation using the internal SAS drives, and RAID 10 if one or more additional
SAS drives are connected externally via the SAS 4X connector on the server’s rear
panel. When fitted with additional hardware components that are available as a RAID
activation kit, the SFP board provides RAID 5 capability in addition to hardware RAID 0,
1, and 10.
The SFP board provides seven main categories of functions for the system:
• Cascaded power conversion
— +12 V to +1.8 V (SFP and DDR2)
— +1.8 V to 1.2 V (SFP)
— +1.8 V to +1.35 V (SFP)
— +1.8 V to +1.5 V (SFP)
— +3.3 V to +1.8 V (SFP and DDR2)
— Power Good monitoring and sequencing
• Three SAS ports to internal 2.5-inch disk drives, four ports to external SAS drives
through rear-panel connector
— 1.5 or 3.0 Gbps link rate
• Software RAID 0/1/10
— LSI Logic* LSI1068 provides software RAID 0/1/10 support [level 10 requires
one or more external SAS drives]
• Hardware RAID 0/1/10 and 5
— Hardware support via the Intel® 80333 I/O controller
— DDR-II SDRAM DIMM socket, supporting up to 1-Gbyte memory modules for
data caching
— Intel® RAID Smart Battery connector to provide power for the RAID DIMM if
power fails
— Socket for the Intel® RAID Activation Key to enable hardware RAID operation
• Enclosure Management
— VSC410 enclosure management controller
— VSC410 interfaces with BMC through IPMB bus
— Hot swap control and drive fault light indication
• Telco alarm and status indication
— Telco alarms for Critical, Major, Minor, and PWR faults
— NIC activity, system ID, power on, oR’ed drive LEDs
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SAS Front Panel (SFP) Board—Carrier Grade Server TIGW1U
— Individual drive activity and fault LEDs
— Drive for audible buzzer on baseboard to indicate hard drive failure
• User interactive switches
— Front-panel power on, reset, NMI, and ID switches
Figure 32 presents the functional block diagram of the SAS front panel board.
Figure 32.
June 2010
SAS Front Panel Board Functional Block Diagram
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Carrier Grade Server TIGW1U—SAS Front Panel (SFP) Board
4.3
Component Location
Figure 33 shows the placement of the major components and connectors on the SFP
board. Figure 40 on page 24 provides a detail view of the user interface switches and
LEDs.
Figure 33.
SAS Front Panel Board Component Locations
B
A
C
E
D
F
G
H
P
R
O
Q
N
I
M
L
K
J
TS000227
Item
Description
®
A
Intel
B
LSI Logic* LSI 1068 SAS controller
80333 I/O controller w/ heatsink
Item
Description
J
Drive #0 SAS connector
K
Drive #0 LEDs and light pipes
C
Front-panel board power connector
L
Optical drive power cable connector
D
Drive #2 LEDs and light pipes
M
Drive #1 SAS connector
E
SMART Embedded USB Solid-State Drive
interface connector
N
Drive #1 LEDs and light pipes
Drive #2 SAS connector
®
F
Intel RAID Activation Key socket; key
optional, required for hardware RAID only
O
G
Front-panel board Flex cable connector
P
PCI fan connector
H
CPU fan connectors (4x)
Q
DDR2 Mini-DIMM socket; memory optional,
required only for hardware RAID
I
RAID smart battery connector; battery
optional, needed only for hardware RAID
R
Serial Port B and USB port 2 connectors
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SAS Front Panel (SFP) Board—Carrier Grade Server TIGW1U
4.4
Power Distribution
This section details the SFP power distribution. This consists of power provided by the
power distribution board (PDB) and the on-board D2D and linear regulators:
• +12 V board input is cascaded to +1.8 V, +1.5 V, +1.35 V, +1.2 V.
• +3.3 V board input is converted to +1.35 V.
• +5 V Standby and +5 V power is provided directly from the PDB board interface.
Figure 34 diagrams the power conversion and distribution functions.
Figure 34.
SFP Board Power Conversion Diagram
3.3V to 1.35V
0.45 Amps
SC4215
+1.35V
+5V Standby
TL431
Reference
PE_VCC
+12V to 1.8V
4.25 Amps
VRM
FLEX
Connector
3V3 Standby
+5V @ 200mA
+3.3V
+12V to 1.5V
4.7 Amps
VRM
+1.8V
+5V @ 6A
+3.3V
+3.3V
+3.3V
+1.8V
Fans
(6.75 Amps)
+1.5V
+2.5V
TL431
Reference
+12V
+12V
+12V
+12V
+3.3V @ 2.8 Amps
+5V
Main Power Connector
+12V @ 8.35 Amps
+12V
+1.8V
+1.5V
+1.2V
+3.3V Standby
1.8V to 1.2V
1.85 Amps
SC4215
Intel 80333
Flash/
NVRAM
+3.3V
+1.2V
+3.3V
PE_VCC
+3.3V
+1.8V
+1.5V I/O
+1.5V
+1.35V
IBBU
LSI1068
+3.3V to +1.8V
1.5 Amps
LDO Linear
SC1565
D2D
VBAT_RAID
DIMM
BQ2060
Gas
Gage
Battery
4.8V
880mAH
NiMH
PLD
TS000114
4.4.1
Battery Backup Power Control
The VBAT_RAID power rail can be supplied from several sources. The battery backup
power controller determines the appropriate source and activates that source:
• During normal operation VBAT_RAID is supplied by the 1.8 V power rail.
• If main system power is turned off and standby power is available, then the 3.3 V
to 1.8 V linear regulator supplies power to VBAT_RAID.
• If all system power fails and the DDR DIMM has critical data stored, then
VBAT_RAID is supplied by the RAID smart battery.
4.4.2
12 V to 1.8 V VRM
The 12 V to 1.8V VRM converts the +12 V supply to +1.8 V. The generated +1.8 V is
used by the 80333, LSI1068, DDR2, and PLD.
• Output rated at +1.8 V ±2% at a maximum of 6 A continuous. The +1.8 V output
will be between +1.76 V and +1.84 V.
• Over-current protection.
• Voltage regulation starts when input voltage exceeds ~7.9 V.
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• DOSA standard footprint.
• D2D can be inhibited with the ENABLE_P1V8_N signal (controlled by PLD).
4.4.3
12 V to 1.5 V VRM
The 12 V to 1.5 V VRM converts the +12 V supply to +1.5 V. The generated +1.5 V is
used by the 80333.
• Output rated at +1.5 V ±2% at a maximum of 6 A continuous.
• Voltage regulation starts when input voltage exceeds ~7.9 V .
• Over-current protection.
• DOSA standard footprint.
• D2D can be inhibited with the ENABLE_P1V5_N signal (controlled by PLD).
4.4.4
3.3 V to 1.35 DC to DC Linear Converter
The 3.3 V to 1.35 V D2D converts the +3.3 V supply to +1.35 V. The generated
+1.35 V is used by the 80333.
• Output rated at +1.35 V ±2% at a maximum of 3 A continuous.
• Over-current and over-temperature protection.
• D2D can be inhibited with the P1V35_ENABLE_N signal (controlled by PLD).
4.4.5
1.8V to 1.2V DC to DC Linear Converter
The 1.8 V to 1.2 V D2D converts the +1.8 V supply to +1.2 V. The generated +1.35 V
is used by the LSI1068.
• Output rated at +1.2 V ±2% at a maximum of 3 A continuous.
• Over-current and over-temperature protection.
• D2D can be inhibited with the P1V2_ENABLE_N signal (controlled by PLD).
4.5
I/O Processor Subsystem
This section provides a detailed description of the I/O subsystem of the SFP board,
which is based on the 80333 I/O controller device. The I/O processor subsystem has
two major functions: To act a PCI Express to PCI-X bridge, and to provide hardware
RAID functionality to support RAID 5.
4.5.1
PCI-X to PCI Express Bridge
The 80333 I/O controller acts as PCI-X to PCI Express Bridge. This allows the SFP board
to attach to the server board’s PCI Express interface and use existing PCI-X SAS
controllers.
4.5.2
RAID Controller
The 80333 I/O controller adds hardware RAID capabilities to the SFP board when an
optional RAID activation key is installed.
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Figure 35.
SFP Board I/O Subsystem Block Diagram
DDR2 Registered ECC
400 MHz DIMM
I2C
PCI-X Bus A
Not Used
Intel 80333
RAID Controller
ROM Bus A/D
NVRAM STK14C88
Flash 28F320
PCI-X bus B
PCI Express x8
Latches
Front Panel Flex Cable Connector to Baseboard
ROM Bus A
RAID
Activation
Key
Buzzer
Resets
PLD (with ISP)
IBBU Connector
D2D
Power Good
Circuits
TS000115
When in hardware RAID mode, the following parts of the I/O processor subsystem
interact:
• DDR2
• 80333 device
• Flash memory
• RAID activation key
• PCI buses
The following topics describe each part and its role.
4.5.3
I/O Processor
The SFP architecture is based around the Intel® 80333 I/O processor. The 80333
processor 500 MHz core controls two 133 MHz, 64-bit PCI-X buses, a x8 PCI Express
bus, a ROM bus, and a DDR2 400 MHz SDRAM bus. The 80333 also provides two
UARTs, I2C bus, and GPIOs.
In PCI-X to PCI Express bridge mode the 80333 processor is seen by the system as a
bridge. This allows the LSI1068 to provide SAS support and software RAID support for
the system.
In hardware RAID mode, the 80333 processor provides transparent hardware support
for RAID 0/1/10. The 80333 provides virtual disk arrays for the system to use. These
disk arrays can be in any of the supported RAID modes. The 80333 DDR2 connector
provides flexible cache support. The cache support can speed up transaction timing,
depending on the cache configuration. When in RAID mode the 80333 processor boots
from the flash memory and loads configuration information from the NVRAM.
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4.5.4
Flash Memory
A 32 megabit flash memory device contains the executable code for the 80333
processor that is used when the processor is in hardware RAID (RAID 5) mode.
4.5.5
NVRAM
The NVRAM is 256 kilobits of accessible static RAM. The NVRAM is used to store 80333’
configuration information and disk drive RAID configuration information.
4.5.6
PCI-X Buses
The PCI-X bus interface is 64 bits wide and runs at 133 MHz. Only one of the 80333
PCI-X buses (Bus A) is used. The LSI1068 is the only device on the 80333 PCI-X bus.
4.5.7
PCI Express Bus
The PCI Express bus interfaces the 80333 processor to the system via the SFP flex
connector. The PCI Express bus is an x8 configuration, although the 80333 processor
also supports x1 and x4 modes.
4.5.8
DDR2 Bus
The 80333 DDR2 bus runs at 400 MHz and supports 256 Mbyte, 512 Mbyte, and
1 Gbyte registered ECC mini-DIMMs. The DDR2 memory is used to provide data
caching when the 80333 processor is operating in hardware RAID (ROMB) mode.
4.5.9
RAID Smart Battery
The Intel® RAID Smart Battery allows the contents of the RAID DIMM to be preserved
if power drops below specifications. VBAT_RAID is the 1.8 V used by the DIMM and is
supplied by the either the P1V8, P3V3_STBY to 1.8 V linear, or the RAID battery
(battery backup module).
Under normal operation, full power (P1V8) is applied to VBAT_RAID and is generated
from 12 V to 1.8 V by a separate PWM controlled switching regulator. If this rail drops
out, VBAT_RAID is powered from the system power supply standby rail (P3V3_STBY)
through a SC1565 LDO regulator. If P3V3_STBY_PWRGD is de-asserted, the battery
takes over as the VBAT_RAID source if cache data is present in the DIMM.
When the 80333 I/O processor senses power has dropped below 2.96 V (Power Good
de-asserts) and its POWER_DELAY signal is asserted, it initiates a power fail sequence
that safely puts the ROMB DIMM into self-refresh state. The POWER_DELAY circuit
generates enough of a delay to allow the 80333 I/O processor to complete its power fail
sequence. After the power fail sequence is completed, additional logic (powered by
VBAT_RAID) holds the DIMM’s clock enable signals low to keep the DIMM in self-refresh
mode. Once power is restored, data from the DIMM can be written to the disk array.
4.5.10
GPIOs
The 80333 processor has eight GPIOs that handle various input and output functions.
The GPIOs are used to control the RAID smart battery, system indicators, and debug
support.
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4.5.11
RAID Activation Key
The Intel® RAID Activation Key is a pre-programmed serial device. This device is
required to enable hardware RAID (for RAID 5 operation, for example).
4.5.12
I2C
The 80333 I2C bus allows the device to communicate with the system BMC and to the
RAID smart battery. The I2C bus going to the system BMC is isolated when power is not
provided to the 80333 processor.
4.5.13
Indicator Buzzer
When the the optional RAID components are installed, the 80333 processor generates
a series of beep codes to indicate failure modes. The 80333 indicates buzzer state via a
GPIO. The SFP board PLD takes the GPIO input and creates a square wave to activate a
buzzer on the server board.
4.6
SAS Controller (LSI1068)
The LSI Logic* LSI 1068 is a PCI-X SAS controller. The LSI1068 provides seven, 3 Gbps
SAS links.
During normal SAS mode or software RAID operation, the LSI1068 boots from its
dedicated flash device. The LSI1068 has an assigned SAS ID on the SFP board.
Figure 36.
SAS Controller I/O Subsystem Block Diagram
SAS Drive
Connectors
ROM Bus
Flash M29W160
Heart Beat
LED
LSI1068
SAS
Controller
PCI-X Bus A
To 80333
SAS 4x
SAS_ISTW
VSC410
I2C
(IPMB)
Front Panel Flex Cable Connector to Baseboard
TS000116
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4.6.1
PCI-X Interface
The LSI1068 communicates to the 80333 over a 133 MHz, 64-bit PCI-X bus. The 80333
Bus A is used for this interface and Bus B is left unused.
4.6.2
SAS Interface
The SFP LSI1068 internal SAS interface consists of seven, 3 Gbps links. Three of the
SAS ports are routed directly to internal 2.5-inch SAS drive connectors. Four ports are
routed to the system baseboard’s repeater for re-formation to the baseboard external
SAS connector. (The eighth SAS interface on the LSI1068 is unused on the SFP.) All
supported hardware and software RAID modes are available on the SAS interface.
4.6.3
Flash Memory
A 16 Mbit flash memory contains the LSI1068 executable code. The LSI1068 boots
from the flash when the Carrier Grade Server TIGW1U SFP card is operating in normal
SAS mode.
4.6.4
I2C
The LSI1068 I2C bus allows the system’s BMC to communicate with the LSI1068. This
ISTW I2C bus is provided via the SFP VSC410 enclosure management controller.
4.6.5
LSI1068 Heart Beat LED Indicator
The HB_LED_N signal from the LSI1068 drives a LED on the SFP board that indicates
SAS controller health. A blinking green LED indicates the LSI1068 IOP (I/O processor)
is up and running. This LED is specifically for debug purposes and is only viewable by
removing the system top cover.
4.7
VSC410 Enclosure Management Controller
The VSC410 supports baseboard management controller applications using the
intelligent platform management bus (IPMB). The VSC410 provides four IPMB two-wire
serial interfaces and three GPIO ports used to detect drive presence and to generate
drive fault LED signals. A dedicated SPI flash bus is also provided for connection to
serial flash ROM (code store) for system applications. The SFP enclosure management
block diagram is shown in Figure 37.
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SAS Front Panel (SFP) Board—Carrier Grade Server TIGW1U
Enclosure Management Block Diagram
0 Ohm
LSI1068
SAS_ISTW
DDRII_SMB
SMB_SAS_3V3
1
SMB_3
Mux
2
empty
SMB_2
SPI_FLASH
PRESENT
SPI
Flash
SPI_BUS
SMB_LOCAL
DRV_PRSNT_N
3x
SMB_0
DRV_FLT_N
3x
SMB_EEPROM
empty
To 80333, IBBU,
and DDR2 DIMM
SMB_IPMB
SMB_1
FAULT
Temp
Sensor
VSC_RST_N
VSC410
IPMB_I2C
Internal
Disk
Drives
Disk Drive
Fault LEDS
& PLD
EEPROM
FRU
Front Panel Flex Cable Connector to Baseboard
Figure 37.
TS000117
4.7.1
Drive Presence
The VSC410 provides GPIO inputs that are connected directly to the internal hard
drives presence pins. These pins are communicate drive presence to the BMC.
4.7.2
Drive Fault
Internal hard drive faults are communicated from the BMC to the VSC410 over the
IPMB. GPIO outputs from the VSC410 are connected directly to drive fault LED circuits
to alert the user about which drive is at fault.
4.7.3
IPMB Buses
The VSC410 provides four, two-wire IPMB serial interfaces, SMB0-SMB3. SMB0 serves
as the FRU interface. SMB1 monitors a temperature sensor that records temperature
data around the VSC410. SMB2 is connected directly to the baseboard ESB. SMB3
connects to the LSI1068 ISTW I2C to output debug information to the enclosure
management processor.
4.7.4
SPI Bus
The VSC410 provides an SPI-compatible interface to attach a serial flash memory
device. This flash device stores the server management application code necessary for
the VSC410 functionality.
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4.8
Clock Generation/Distribution
The SFP uses several on-board clock sources and a system-generated 100 MHz clock
(PCI Express).
Figure 38.
SFP Clock Diagram
+1.8V
FAST_PLD_CLK
MCLK0_200Mhz
PLD
SLOW_PLD_CLK
DDR2 Registered ECC
400 MHz DIMM
MCLK0_200Mhz
Crystal
4 MHz
VSC410
+3.3V
CLK_PCIX_LSI
RCLK_LSI
Intel® 80333
PCIX_A_CLKOUT
LSI1068
Single to
diff
Match length to actual
LSI1068 clk length
PCIX_A_CLKIN
SAS_CLK_75MHZ
CLK_100M_DOBSON
OSC
75 MHz
SAS_REFCLK_B
Differential Bus
Single Ended Bus
PCI Express x8
Front Panel Flex
Connector
TS000118
4.8.1
75 MHz Sourced Clock
The LSI1068 uses a differential 75 MHz clock sourced from the 75 MHz oscillator.
4.8.2
133 MHz Sourced Clock
The 80333 processor generates a 133 MHz clock for the PCI-X bus. Skew is controlled
to the LSI1068 via a feedback circuit.
4.8.3
200 MHz Sourced Clock
The 80333 processor generates a 200 MHz clock for the DDRII interface.
4.8.4
100 MHz Sourced Clock
The S5000PHB server board provides a 100 MHz clock for the 80333 processor.
4.8.5
PLD Sourced Clock
Two separate external RC circuits and Schmitt* triggers generate a slow CLK and fast
CLK for the PLD. The fast CLK is used for critical IBBU strobe timing and the slow CLK
provides buzzer frequency and to hold the 80333 in reset for at least 1.5 ms after
brock_reset_n.
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SAS Front Panel (SFP) Board—Carrier Grade Server TIGW1U
4.8.6
VSC410 Clock
An external 4.0 MHz crystal provides the clock required for the VSC410 internal PLL.
4.9
Programmable Logic Device (PLD)
The Lattice* programmable logic device on the SFP is used for board power/reset
control, board interlock control, buzzer control, Intel® RAID Smart Battery control, and
various miscellaneous signals. The PLD can only be updated via a header (unpopulated)
on the SFP. Further understanding can be obtained by reviewing the VHDL code and
comments.
4.9.1
Power On/Reset
A state machine ensures the voltage sequencing and reset logic comes up as expected.
4.9.2
Buzzer Control
The PLD uses the PLD clock and the AUDIOTRIG signal to generate a 2.4 kHz signal to
drive the server board buzzer. AUDIOTRIG is generated from GPIO3 on the 80333.
4.9.3
Intel® RAID Smart Battery Control
The PLD uses the PLD clock to generate the smart battery control signals BBE and
IBBU_BBSTROBE. These signals are used to notify the Smart Battery that critical data
(dirty) is in the DIMM and that the Smart Battery will have to supply VBAT_RAID if
power fails.
4.9.4
Telco Alarm LED Control
The PLD is responsible for selecting the correct color (Red or Yellow) for the Critical and
Major dual alarm LEDs according to the TELCO_SELECT_LED signal provided by the
S5000PHB server board.
4.9.5
System Drive Status LED Control
The PLD also monitors hard drive presence, hard drive activity, and drive fault signals
driven from the VSC410. It uses all of these pins to control the OR’ed internal drive
status LED that indicates drive activity and drive faults.
4.10
Hardware RAID
The SFP provides hardware supported RAID 0/1/10/5. The SFP board supports a RAID
On MotherBoard (ROMB) solution via the Intel 80333 I/O processor in conjunction with
the LSI1068 SCSI controller.
To activate the hardware RAID feature, an optional Intel® RAID Activation Key is
available. This pre-programmed serial device contains a configuration code to unlock
specific features to support the LSI Logic* MegaRAID solution.
In addition to the activation key, hardware RAID mode requires a DDR-2 mini-DIMM to
provide memory for the IOP and to serve as a disk cache to store write data to the
drives. If power to the Intel 80333 I/O processor drops below specifications, the RAID
smart battery maintains the contents of the ROMB DIMM by keeping the DIMM in selfrefresh mode until power is restored. After power is restored, the data can be safely
written to the drives, maintaining the integrity of the disk array.
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4.10.1
DDR-2 Support
The Carrier Grade Server TIGW1U SFP has a single 244-pin DDR-2 mini-DIMM slot that
can be used to add local memory for the I/O processor. This increases performance by
allowing the caching of writes to the disk array. See the current supported memory list
for compatible DIMMS.
• DDR2 400 MHz SDRAM only.
• Registered DIMMs only (board not routed nor simulated for unbuffered DIMMs).
• 72-bit ECC DIMMs only (64-bit data bus width plus 8-bit ECC).
4.10.2
Intel 80333 I/O Processor NVRAM
A 32 kilobyte NVRAM component is connected to the peripheral bus interface (PBI) of
the 80333 I/O processor. This NVRAM contains board and disk drive setup configuration
data and other system information.
The SFP uses a 32 Kbyte (32K x 8-bit) Simtek* STK14D88 NVRAM component, which is
powered by the system’s main 3.3 V rail.
4.10.3
ROMB Battery Backup
The battery backup allows the contents of the ROMB DIMM to be preserved if power
drops below specifications. VBAT_RAID is the 1.8 V used by the DIMM and is supplied
by the either, P1V8, P3V3_STBY, or the RAID smart battery. Under normal operation,
full power (P1V8) is applied to VBAT_RAID and is generated from 12 V to 1.8 V by a
separate PWM controlled switching regulator. If this rail drops out, VBAT_RAID is
powered from the system power supply standby rail (P3V3_STBY) through a SC1565
LDO regulator. If P3V3_STBY_PWRGD is deasserted, the Smart Battery takes over as
the VBAT_RAID source.
When the Intel 80333 I/O processor senses power has dropped below 2.96 V (Power
Good deasserts) and its POWER_DELAY signal is asserted, it initiates a power fail
sequence that safely puts the ROMB DIMM into self-refresh state. The POWER_DELAY
circuit generates enough of a delay to allow the 80333 I/O processor to complete its
power fail sequence. After the power fail sequence is completed, additional logic
(powered by VBAT_RAID) holds the DIMM’s clock enable signals low to keep the DIMM
in self-refresh mode. One power is restored, data from the DIMM can be written to the
disk array.
4.11
Software RAID
When the Intel® RAID Activation Key is not installed, the Carrier Grade Server TIGW1U
provides software-supported RAID 0 and RAID 1 capabilities for the internal drives.
When one or more external SAS drives are connected to the rear-panel 4x SAS
connector, the system also provides software-supported RAID 10 operation.
Software RAID is enabled by the “Software RAID Enabled” setting in BIOS. This sets
the RAID_MODE signal that is necessary to distinguish between straight SAS mode and
software RAID mode. The Intel® RAID Activation Key and mini-DIMM should be uninstalled to run software RAID.
4.11.1
80333 Processor in Software RAID
The 80333 processor serves as a PCIe to PCI-X bridge supporting transfer rates of up to
3 GB/s. It is connected to the server board’s x8 PCI Express link and includes fully
functional RAID support. However, the IOP80333 serves only as a bridge in software
RAID mode.
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4.11.2
LSI1068 Controller in Software RAID
The LSI1068 controller resides on the Channel A PCI-X bus of the 80333 processor,
supporting transfer rates of up to 3 GB/s. It includes an Address Translation Unit (ATU)
supporting transactions between PCI address space and IOP80333 address space.
Address translation for the ATU is controlled through programmable registers accessible
from both the PCI interface and the Intel XScale® core. The LSI1068 controller includes
its own Flash ROM to support SAS-only software RAID. Software RAID levels supported
include 0, 1, and 10.
4.12
Power Good and Reset Control
Power Good are positive logic signals reflecting the status of various power rails.
4.12.1
Power Good Circuit
Power Good outputs allow the SFP board to know when to come out of reset. The
worst-case ranges take into account component tolerances and the range represents
the smallest expected range.
Table 25.
4.12.2
Power Good Specifications
Voltage
Signal Name
Voltage Range for Good Voltage
+3.3 V
P3V3_STBY_PWRGD
±10% (2.97 V to 3.63 V)
+1.8 V
P1V8_PWRGOOD
+12% / -11% (1.62 V to 1.98 V)
+1.5 V
P1V5_PWRGOOD
±10%
+1.35 V
P1V35_PWRGOOD
+9% / -10% (1.21 V to 1.48 V)
+1.2 V
P1V2_PWRGOOD
+13% / -12%
(1.35 V to 1.64 V)
(1.06 V to 1.35 V)
Power Good Inputs
The FP_SYS_RESET_N signal indicates the P3V3 power rail supplied by the server board
is good. This signal serves as the same function as the system PERST_N.
4.12.3
Reset Control
The board resets are controlled by the PLD and are generated off of the Voltage PowerGood signals and the FP_SYS_RESET_N.
The BROCK_RST_N signal must be held off for 1 ms after the 80333 Power Good signal
goes active.
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Figure 39.
SFP Reset Block Diagram
DDR2 Registered ECC 400 MHz DIMM
DDR_M_RST_N
NVRAM
STK14C88
FLASH
28F320
PCIX_A_RST_N
Intel 80333
LSI1068
BROCK_RST_N
NVRAM
STK14C88
FLASH
M29W160
SAS_TST_RESET_N
VSC410
BROCK_FLASH_RST_N
LSI_FLASH_RESET_N
PLD
P3V3
VSC_RST_N
ADM809
SAS_DISABLE_N
FP_SYS_RESET_N
Flex Connector to Baseboard
TS000119
4.13
Front Panel Switches and Status Indicators
Figure 40 shows the locations of the SFP board’s front panel switches and LED
indicators.
Figure 40.
SAS Front Panel Board LED Indicators and Switches
Power
Reset
NMI
ID
Critical Alarm (Yellow)
Major Alarm (Yellow)
ID Indicator (White)
Minor Alarm (Yellow)
NIC Activity (Green/Amber)
Power Alarm (Yellow)
Main Power (Green)
HD Activity/Fault (Green/Amber)
TS000228
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SAS Front Panel (SFP) Board—Carrier Grade Server TIGW1U
4.13.1
Front Panel Switches
The front panel has a power switch, a reset switch, an NMI switch, and a system ID
switch. The function of these switches is described in the following table.
Table 26.
4.13.2
Front Panel Switches Description
Switch
Function
Power Switch
Toggles system power on/off. Also functions as a Sleep Button if enabled by an
ACPI-compliant operating system
Reset Switch
Resets the system when it is in the power-on state
NMI Switch
Instructs the processor to copy system memory to hard disk
System ID Switch
Instructs the processor to toggle the state of the system ID LED
Front Panel LEDs
Table 27 lists the front panel LED specifications
Table 27.
SFP LED Specifications
LED Function
Peak Wavelength
(nm)
Luminous Intensity
Typ @20mA (mcd)
Luminous Intensity
Min @20mA (mcd)
Critical Alarm†
Yellow (Red)
590 (627)
15 (20)
4 (7)
Major Alarm†
Yellow (Red)
590 (627)
15 (20)
4 (7)
Minor Alarm
Yellow
580
6
3
Power Alarm
Yellow
580
6
3
System ID
White
n/a
75
36
NIC Activity
Green
560
12
6
Power On
Green
HDD Activity/Status
Green/Amber
†
4.13.3
LED Color
567
12
6
560/605
7.5/9
3/5
Critical and Major alarm indicators are bi-color LEDs that can be configured to be yellow or red by
means of an SDR TAM setting. Yellow is the default color.
System Status LEDs
There are four front panel system status LEDs. The functions of these system status
LEDs are described in Table 28.
Table 28.
June 2010
SFP System Status LEDs
Status LED
Function
Power On
The green Power On LED indicates that system power is on when it is illuminated
continuously. When blinking green, it indicates that the system is in ACPI sleep mode.
NIC Activity
The green NIC activity LED indicates network link presence and activity on either NIC 0 or
NIC 1.
System ID
The white ID LED identifies a system. The LED can be toggled remotely or with the
System ID Switch.
HDD Activity/Fault
The green/amber hard drive activity/fault LED displays activity (green indication) or fault
status (amber indication) for any of the three internal SAS drives. This is an OR’ed LED
function; the SFP board also provides individual activity and status LEDs for each internal
drive, which can be seen when the bezel is removed.
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
25
Carrier Grade Server TIGW1U—SAS Front Panel (SFP) Board
4.13.4
System Fault LEDs (Telco Alarms)
There are four front panel system fault LEDs. The functions of these system fault LEDs
are described in Table 29.
Table 29.
Telco Alarm LED Description
Fault LED
Function
Critical†
The yellow (or red) LED alarm is illuminated via BMC private I2C bus and may only be turned
off via BMC private I2C control. When continuously lit, it indicates the presence of a Critical
System Fault, which is an error or event that has a fatal impact to the system. In this case, the
system cannot continue to operate. An example is the loss of a large section of memory, or
other corruption that renders the system not operational.
The critical alarm relay is also engaged when the LED is illuminated.
Major†
The yellow (or red) major alarm is illuminated via BMC private I2C bus and may be turned off
via BMC private I2C control or alarm connector reset. When continuously lit, it indicates the
presence of a Major System Fault, which is an error or event that that has discernible impact
to system operation. In this case, the system can continue to operate, but in a “degraded”
fashion (reduced performance or a non-fatal feature reduction). An example is the loss of one
of two mirrored disks.
The major alarm relay is also engaged when the LED is illuminated.
Minor
The yellow minor alarm LED is illuminated via BMC private I2C bus and may be turned off via
BMC private I2C control or alarm connector reset. When continuously lit, it indicates the
presence of a Minor System Fault, which is an error or event that that has little impact to
actual system operation. An example would be a correctable ECC error.
The minor alarm relay is also engaged when the LED is illuminated.
Power
The yellow power alarm LED is illuminated via BMC private I2C bus or SYS_FLT_LED_L signal
and may only be turned off via BMC private I2C control. When continuously lit, it indicates the
presence of a Power System Fault.
The power alarm relay is also engaged when the LED is illuminated.
†
Critical and Major alarm indicators are bi-color LEDs that can be configured to be yellow or red by an
SDR TAM setting. Yellow is the default.
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
26
June 2010
SAS Front Panel (SFP) Board—Carrier Grade Server TIGW1U
4.13.5
Fan Fault LEDs
The SFP board contains an 8-bit, serial-in, parallel-out shift register to control the onboard fan fault LEDs. Each of the five fan LEDs is mapped to the following bits of the
shift register.
Table 30.
Fan Fault LED Bit Mapping
Fan ID
4.13.6
Shift Register Bit Location
FAN1 (in front of CPU1 & DIMMS)
Bit 0
FAN2 (in front of CPU1)
Bit 1
FAN3 (in front of CPU0)
Bit 2
FAN4 (in front of CPU0)
Bit 3
FAN9 (in front of PCI CONN)
Bit 4
Hard Drive LEDs
The SFP provides individual light-piped activity and fault LEDs for each internal disk
drive. Activity and fault conditions can be observed on the OR’ed front-panel disk drive
LED indicator described in Section 4.13.3, “System Status LEDs”. If a fault is seen, the
user can remove the front bezel to observe the individual hard drive LEDs and identify
the faulty drive.
4.13.7
Temperature Sensor
The SFP board provides an LM95010 single-wire interface temperature sensor that can
be read by the server board. The temperature sensor address pins are strapped to
ground, which corresponds to the assignment of device number 001. The temperature
sensor has an accuracy of ±2º C and provides a temperature reading range of -20º C
to +125º C. This temperature sensor is placed to measure ambient air coming into the
chassis.
June 2010
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
27
Carrier Grade Server TIGW1U—SAS Front Panel (SFP) Board
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
28
June 2010
SMART Embedded USB Solid-State Drive—Carrier Grade Server TIGW1U
5.0
SMART Embedded USB Solid-State Drive
This chapter describes the basic functions and interface requirements of the
SMART Embedded USB Solid-State Drive. The information contained in this chapter is
organized into the following sections:
• Functional Description
• SFP Board Connector
• Architecture
• Installation
5.1
Functional Description
Key features of the eUSB solid-state drive are:
• Capacity of 1, 2, or 4 Gbyte
• Sequential read performance of 28 Mbyte per second
• Sequential write performance of 20 Mbyte per second
• Supports the USB 2.0 / 1.1 specification
The eUSB solid-state drive attaches to an interposer board and is used with the
Ethernet front panel (EFP) board to provide local memory storage for various options
including, but not limited to, operating system, system information, diagnostic
partitions, and configuration data.
Figure 41 shows the eUSB solid-state drive board as it attaches to the interposer board
and Figure 42 gives the dimensions of the Solid State Drive.
Figure 41.
June 2010
eUSB Solid-State Drive Connection to Interposer Board
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
9
Carrier Grade Server TIGW1U—SMART Embedded USB Solid-State Drive
Figure 42.
eUSB Solid-State Drive Dimensions
Because this is a removable media device, it can be moved with the data intact from
one system to another. This is useful for cloning system configurations and system
options, and for other operations. The connection for the eUSB SSD is made by a USB
channel provided by the SFP board.
5.2
SFP Board Connector
Table 31 lists the pinout of the 2 x 3 connector that interfaces to the SFP board.
Table 31.
5.3
2 x 3 Connector Pinout
Pin
Blind Mate Signal
Pin
Blind Mate Signal
1
GND
2
N/C (Pin Pulled)
3
USB_Data_Plus (D+)
4
VBUS (+5V)
5
USB_Data_Minus (D-)
6
GND
Architecture
The eUSB solid-state drive combines Intel® NAND Flash memory and a USB controller
to deliver a solution for embedded and thin client markets. The system is based on a
single level cell (SLC) flash technology. Each capacity option (1, 2, or 4 Gbyte) contain
two NAND flash devices. The high-speed USB 2.0 controller includes 4 symbol error
correction capability and wear-leveling algorithms for enhanced NAND management.
The controller is backward-compatible to the USB 1.1 specification and complies with
USB Mass Storage Class Specification v1.0.
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
10
June 2010
SMART Embedded USB Solid-State Drive—Carrier Grade Server TIGW1U
5.4
Installation
The SMART Embedded USB Solid-State Drive is installed onto an interposer board. The
interposer board attaches to the top of the drive bay. The cable connects between the
Solid State Drive interposer board and the SFP board. See the following figure.
Figure 43.
eUSB Solid-State Drive Installation
Drive
Cable
er
s
rpo
Inteoard
B
Standoffs
f
p o ys
To e Ba
iv
Dr
TS000489
June 2010
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
11
Carrier Grade Server TIGW1U—SMART Embedded USB Solid-State Drive
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
12
June 2010
PCI/PCI-X* Riser Card—Carrier Grade Server TIGW1U
6.0
PCI/PCI-X* Riser Card
This chapter describes the design and external interface PCI/PCI-X* riser card, which is
standard on the Kontron Carrier Grade Server TIGW1U. The riser card implements one
3.3 V, 64-bit PCI/PCI-X slot, with access to the I/O bracket through the server’s rear
panel.
The information in this chapter is organized into the following sections:
• Introduction
• Functional Description
• PCI-X Riser Card Connector Interface
• Electrical Specification
6.1
Introduction
The PCI/PCI-X riser card supports one 3.3 V, 64-bit slot. The bus speed varies from
33 MHz to 133 MHz depending on the PCI or PCI-X adapter card installed in the riser
card. For a detailed description of this card, see the Intel® Server Board S5000PHB
Technical Product Specification.
Figure 44 illustrates the riser board assembly (upside down from its installed
orientation).
Figure 44.
PCI-X Riser Card Assembly
l
TS000109
June 2010
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—PCI/PCI-X* Riser Card
6.2
Functional Description
The PCI/PCI-X riser card has one 64-bit slot that supports bus speeds of 33 MHz and
66 MHz for PCI add-in cards and 66 MHz, 100 MHz, and 133 MHz for PCI-X cards.
IDSELs are AD24 for slot 1.
6.3
PCI-X Riser Card Connector Interface
Table 32 lists the signals available on the PCI/PCI-X card slot.
Table 32.
PCI/PCI-X Riser Card Slot Pin-Out (Sheet 1 of 3)
Pin #
Signal
Pin #
Signal
B1
-12V
A1
TRST#
B2
TCK
A2
+12V
B3
GND
A3
TMS
B4
Reserved
A4
TDI
B5
+5V
A5
+5V
B6
+5V
A6
P64IRQ0
B7
P64IRQ1
A7
P64IRQ2
B8
P64IRQ3
A8
+5V
Reserved
B9
Reserved
A9
B10
Reserved
A10
+3.3V
B11
Reserved
A11
Reserved
KEY
B14
Reserved
A14
+3.3VAUX
B15
GND
A15
RST#
B16
CLK
A16
+3.3V
B17
GND
A17
GNT#
B18
REQ#
A18
GND
B19
+3.3V
A19
PME#
B20
AD31
A20
AD30
B21
AD29
A21
+3.3V
B22
GND
A22
AD28
B23
AD27
A23
AD26
B24
AD25
A24
GND
B25
+3.3V
A25
AD24
B26
C/BE3#
A26
IDSEL
B27
AD23
A27
+3.3V
B28
GND
A28
AD22
B29
AD21
A29
AD20
B30
AD19
A30
GND
B31
+3.3V
A31
AD18
B32
AD17
A32
AD16
B33
C/BE2#
A33
+3.3V
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
10
June 2010
PCI/PCI-X* Riser Card—Carrier Grade Server TIGW1U
Table 32.
PCI/PCI-X Riser Card Slot Pin-Out (Sheet 2 of 3)
Pin #
Signal
Pin #
Signal
B34
GND
A34
FRAME#
B35
IRDY#
A35
GND
B36
+3.3V
A36
TRDY#
B37
DEVSEL#
A37
GND
B38
GND
A38
STOP#
B39
LOCK#
A39
+3.3V
B40
PERR#
A40
SMCLK
B41
+3.3V
A41
SMDATA
B42
SERR#
A42
GND
B43
+3.3V
A43
PAR
B44
C/BE1#
A44
AD15
B45
AD14
A45
+3.3V
B46
GND
A46
AD13
B47
AD12
A47
AD11
B48
AD10
A48
GND
B49
M66EN
A49
AD9
B50
GND
A50
GND
B51
GND
A51
GND
B52
AD8
A52
C/BE0#
B53
AD7
A53
+3.3V
B54
+3.3V
A54
AD6
B55
AD5
A55
AD4
B56
AD3
A56
GND
B57
GND
A57
AD2
B58
AD1
A58
AD0
B59
+3.3V
A59
+3.3V
B60
ACK64#
A60
REQ64#
B61
+5V
A61
+5V
B62
+5V
A62
+5V
KEY
June 2010
B63
Reserved
A63
GND
B64
GND
A64
C/BE7#
B65
C/BE6#
A65
C/BE5#
B66
C/BE4#
A66
+3.3V
B67
GND
A67
PAR64
B68
AD63
A68
AD62
B69
AD61
A69
GND
B70
+3.3V
A70
AD60
B71
AD59
A71
AD58
B72
AD57
A72
GND
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
11
Carrier Grade Server TIGW1U—PCI/PCI-X* Riser Card
Table 32.
PCI/PCI-X Riser Card Slot Pin-Out (Sheet 3 of 3)
Pin #
6.4
Signal
Pin #
Signal
B73
GND
A73
AD56
B74
AD55
A74
AD54
B75
AD53
A75
+3.3V
B76
GND
A76
AD52
B77
AD51
A77
AD50
B78
AD49
A78
GND
B79
+3.3V
A79
AD48
B80
AD47
A80
AD46
B81
AD45
A81
GND
B82
GND
A82
AD44
B83
AD43
A83
AD42
B84
AD41
A84
+3.3V
B85
GND
A85
AD40
B86
AD39
A86
AD38
B87
AD37
A87
GND
B88
+3.3V
A88
AD36
B89
AD35
A89
AD34
B90
AD33
A90
GND
B91
GND
A91
AD32
B92
Reserved
A92
Reserved
B93
Reserved
A93
GND
B94
GND
A94
Reserved
Electrical Specification
The maximum power per slot is 25 W. This conforms to PCI Specification 2.2.
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
12
June 2010
PCI Express* Riser Card—Carrier Grade Server TIGW1U
7.0
PCI Express* Riser Card
This chapter describes the design and external interface of the PCI Express* (PCIe*)
riser card, an optional accessory for the Kontron Carrier Grade Server TIGW1U. The
PCIe riser board implements one x8 PCI Express slot compatible with full-height, fulllength x1, x4, and x8 PCI Express boards. The I/O bracket of the PCIe board is
accessible through the server’s rear panel.
The information contained in this chapter is organized into the following sections:
• Introduction
• Functional Description
• PCI Express Riser Card Connector Interface
• Electrical Specification
7.1
Introduction
The PCIe riser card supports one x8 PCIe slot. This is described in the Intel® Server
Board S5000PHB Technical Product Specification.
Figure 45 shows the FH/FL PCIe riser card layout (upside down from its installed
orientation).
Figure 45.
PCI Express Riser Card Assembly
TS000110
June 2010
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
9
Carrier Grade Server TIGW1U—PCI Express* Riser Card
7.2
Functional Description
The FH/FL PCIe riser card has one x8 PCIe slot, which can accept x1, x4, or x8 PCI
Express boards.
IDSELs are device ID 17 for slot 1.
7.3
PCI Express Riser Card Connector Interface
Table 33 provides the pin-out for the adapter card connector on the PCIe riser card.
Table 33.
PCI Express Riser Slot Pin-Out (Sheet 1 of 2)
Pin #
Signal
Pin #
Signal
B1
+12V
A1
Reserved
B2
+12V
A2
+12V
B3
Reserved
A3
+12V
B4
GND
A4
GND
B5
SMCLK
A5
Reserved
B6
SMDATA
A6
Reserved
B7
GND
A7
Reserved
B8
+3.3V
A8
Reserved
B9
Reserved
A9
+3.3V
B10
+3.3VAUX
A10
+3.3V
B11
WAKE_N
A11
PWRGD
KEY
B12
Reserved
A12
GND
B13
GND
A13
REFCLK+
B14
HSOP0+
A14
REFCLK-
B15
HSOP0-
A15
GND
B16
GND
A16
HSIP0+
B17
Reserved
A17
HSIP0-
B18
GND
A18
GND
B19
HSOP1+
A19
Reserved
B20
HSOP1-
A20
GND
B21
GND
A21
HSIP1+
B22
GND
A22
HSIP1-
B23
HSOP2+
A23
GND
B24
HSOP2-
A24
GND
B25
GND
A25
HSIP2+
B26
GND
A26
HSIP2-
B27
HSOP3+
A27
GND
B28
HSOP3-
A28
GND
B29
GND
A29
HSIP3+
B30
Reserved
A30
HSIP3-
B31
Reserved
A31
GND
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
10
June 2010
PCI Express* Riser Card—Carrier Grade Server TIGW1U
Table 33.
PCI Express Riser Slot Pin-Out (Sheet 2 of 2)
Pin #
7.4
Signal
Pin #
Signal
B32
GND
A32
Reserved
B33
HSOP4+
A33
Reserved
B34
HSOP4-
A34
GND
B35
GND
A35
HSIP4+
B36
GND
A36
HSIP4-
B37
HSOP5+
A37
GND
B38
HSOP5-
A38
GND
B39
GND
A39
HSIP5+
B40
GND
A40
HSIP5-
B41
HSOP6+
A41
GND
B42
HSOP6-
A42
GND
B43
GND
A43
HSIP6+
B44
GND
A44
HSIP6-
B45
HSOP7+
A45
GND
B46
HSOP7-
A46
GND
B47
GND
A47
HSIP7+
B48
Reserved
A48
HSIP7-
B49
GND
A49
GND
Electrical Specification
The maximum power per slot is 25 W. This conforms to PCI Express Specification 2.0.
June 2010
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
11
Carrier Grade Server TIGW1U—PCI Express* Riser Card
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
12
June 2010
AC Power Subsystem—Carrier Grade Server TIGW1U
8.0
AC Power Subsystem
This chapter defines the features and functionality of the AC-input switching power
subsystem of the Kontron Carrier Grade Server TIGW1U. The AC power subsystem has
up to two AC-input power supply modules that can operate in redundant mode, and a
power distribution board (PDB).
The AC power supply module is not NEBS hardened, so NEBS certification of the
TIGW1U carrier grade server system will not be performed with the server system
configured with an AC power subsystem. However, the Carrier Grade Server TIGW1U
configured with an AC power supply subsystem is NEBS Level 1 compliant.
The information contained in this chapter is organized into the following sections:
• Features
• Power Distribution Board
• AC-input Power Supply Module
8.1
Features
• 450 W output capability over full AC input voltage range
• Power good indication LEDs
• Predictive failure warning
• External cooling fans with multi-speed capability
• Remote sense of 3.3 V, 5 V, and 12 V DC outputs (on the PDB)
• Brown-out protection and recovery
• Built-in overloading protection capability
• Onboard field replaceable unit (FRU) information
• I2C interface for server management functions
• Mechanical module latching feature
• Integral handle for insertion/extraction
June 2010
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
9
Carrier Grade Server TIGW1U—AC Power Subsystem
8.2
Power Distribution Board
8.2.1
PDB Mechanical Specification
The AC-input PDB can support up to two 450 W PSUs in a 1+1 configuration or a 1+0
configuration. A mechanical drawing for the power distribution board is shown in
Figure 46.
Figure 46.
Power Distribution Board Mechanical Drawing
Power
Supply
Unit 2
Power
Supply
Unit 1
Baseboard
6.9
6.427
6.517
5.955
6.044
5.483
5.572
5.1
4.685
4.996
4.39
Power
Distribution
Board
4.07
3.725
Ø 0.156
1.65
1.511
1.325
Ø 0.156
0.691 2X
Ø 0.125
0.083
0.000
0.125
7.005
5.97
6.075
4.2
3.785
0.4
0.125
0.000
Ø 0.156
AF000869
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
10
June 2010
AC Power Subsystem—Carrier Grade Server TIGW1U
8.2.2
PDB System Interface
The power distribution board has three interconnections with other system
components:
• The PDB has edge fingers that connects to the server board via a five-section blindmate connector.
• The PDB has two, three-section blind-mate connectors that accept edge finger
contacts on the hot-swappable power-supply units.
• The PDB has a discrete conductor wiring harness that connects to the front panel
board via a single-row 12-pin connector.
All output wiring uses listed or recognized component appliance wiring material
(AVLV2), VW-1 flame rating, rated 105° C min, 300 Vdc min.
8.2.2.1
PDB Interface to Server Board
Figure 47 and Figure 48 show the connection between the PDB and the S5000PHB
server board.
Figure 47.
PDB Server Board Edge Finger Layout
1
See pin-out table for
signal identification
7
Plug 1
Plug 2
Plug 3
Plug 4
Bottom Side
Plug 1
Plug 2
Plug 3
Plug 4
Top Side
6
12
Server Board Power
Edge Connector
PSU Docking Connectors
Front Panel Board
Power Cable
Connector
Front of Chassis
AF000868
June 2010
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
11
Carrier Grade Server TIGW1U—AC Power Subsystem
Figure 48.
Server Board Power Docking Connector
AF000867
Table 34.
8.2.2.2
PDB Server Board Edge Finger Pin-Out
Pin #
Pin Assignment
Pin #
Pin Assignment
1
PWR OK
7
ReturnS
2
PSON#
8
+3.3RS
3
-12V (0.1 A)
9
+5VSB (1.33 A)
4
I2C Clock
10
+5VSB (1.33 A)
5
I2C Data
11
+5V RS*
6
SMBAlert#
12
+5VSB (1.33 A)
P1 Bottom
COMM (19.61 A)
P1 Top
+12V3 (15.42 A)
P2 Bottom
COMM* (19.61 A)
P2 Top
+5VDC* (6.35 A)
P3 Bottom
COMM (19.61 A)
P3 Top
+3.3VDC* (18.146 A)
P4 Bottom
+12V2 (7.41 A)
P4 Top
+12V1 (7.41 A)
PDB Interface to PSUs
Figure 49, Figure 50, and Table 35 document the connection between each PSU module
and the PDB.
Figure 49.
PSU Docking Connector
AF000865
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
12
June 2010
AC Power Subsystem—Carrier Grade Server TIGW1U
Plug 1
(+12V)
Plug 2
(Ground)
Plug 1
(Ground)
Top
Pin 13
Plug 2
(+12V)
Pin 1
Bottom
Pin 24
PSU Output Finger Layout
Pin 12
Figure 50.
AF000870
Table 35.
8.2.2.3
PSU Docking Connector Pin-Out
Pin #
Pin Assignment
Pin #
Pin Assignment
1
n/c
13
12V RS+
2
n/c
14
12V RS-
3
A0
15
12LS
4
n/c
16
SMB Alert
5
n/c
17
SDA
6
n/c
18
SCL
7
n/c
19
PS Kill
8
n/c
20
PS_ON
9
n/c
21
PWOK
10
n/c
22
A1
11
5VSB
23
5VSB
12
5VSB
24
5VSB
P1 Top
COMM
P1 Bottom
+12V
P2 Top
COMM
P2 Bottom
+12V
PDB to Front-Panel Board Interface
The power distribution board uses a 12-conductor, 20 AWG discrete wire harness to
connect to the front panel board. Table 36 shows the 1 × 12 connector pin-out.
June 2010
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Carrier Grade Server TIGW1U—AC Power Subsystem
Table 36.
Front Panel Board Power Harness Connector Pin-Out
Pin #
8.2.3
Signal
1
P3V3
2
P5V_STBY
3
GND
4
GND
5
P12V
6
P12V
7
P12V
8
GND
9
GND
10
P5V
11
P5V
12
GND
Output Current Requirements
This describes the +12 V output power requirements from the power distribution board
with one or two 450 W PSUs plugged into the input of the power distribution board.
Table 37.
+12 V Outputs Load Ratings
MAX Load
+12V1
+12V2
+12V3
+12V4
16 A
16 A
16 A
16 A
MIN Static / Dynamic Load
0A
0A
0A
0A
Peak load (12 seconds)
18 A
18 A
18 A
18 A
Max Output Power
12 V x 16 A
=192 W
12 V x 16 A
=192 W
12 V x 16 A
=192 W
12 V x 16 A
=192 W
Notes:
1.
The combined total power limit for all outputs is 450 W max.
2.
+12V1/+12V2/+12V3/+12V4 combined output limit = 46.2 A / 63 A pk max.
The following table defines power and current ratings of the two DC/DC converters
located on the PDB, each powered from +12 V rail. The converters must meet both
static and dynamic voltage regulation requirements for the minimum and maximum
loading conditions.
Table 38.
DC/DC Converters Load Ratings
+12 VDC Input DC/DC Converters
+3.3 V Converter
+5 V Converter
MAX Load
15 A
12 A
MIN Static / Dynamic Load
0.0 A
0.0 A
Max Output Power
3.3 V x15 A =45 W
5 V x12 A =60 W
Note:
3.3 V / 5 V combined power limit: 95 W max.
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June 2010
AC Power Subsystem—Carrier Grade Server TIGW1U
8.2.4
Hot-Swapping Power Modules
Hot swapping a power supply module is the process of extracting and inserting a PSU
from a system that is powered on. The power subsystem is capable of supporting hot
swapping of power supply modules in a 1 + 1 configuration.
8.2.5
Intelligent Power Subsystem Functions
The PSU and power distribution board (PDB) combination provides a monitoring
interface over a server management bus. The device is compatible with both SMBus 2.0
“high power” and I2C Vdd based power and drive. This bus may operate inside the PSU
and PDB at 5 V (powered from stand-by voltage) but, looking from the system server
management into the PSU and PDB combination, it is compatible with the 3.3 V bus. A
bi-directional I2C voltage translator IC, such as GTL2002 or similar, is employed on the
PDB. The SMBus pull-ups are located on the server board.
The power distribution board’s I2C bus will have a dual function: to provide PSU and
PDB monitoring features and to convey the stored FRU data in the PSU and PDB
EEPROM.
8.2.6
FRU Data
The PDB contains a 2 Kbyte EEPROM device that contains FRU data for the power
subsystem according to the IPMI spec. Each separate output is given a different
number for identification purposes.
8.3
AC-input Power Supply Module
The AC-input power system supports one 450 W SSI TPS (Thin Power Supply) module
for a non redundant configuration, or two in a 1 + 1 redundant configuration.
8.3.1
AC-input PSU Mechanical Specification
The power supply module contains one 40 mm fan. The module provides a handle to
assist in insertion and extraction and can be inserted and extracted without the
assistance of tools.
8.3.2
PSU to PDB Interconnect
The PSU’s PCB extends beyond the PSU enclosure with edge finger contacts and blind
mates to a Molex* LPH 45984-005 connector, or equivalent, located on the PDB (power
distribution board). This connects the PSU’s output voltages and signals to the PDB.
This connection is documented in Figure 49, Figure 50, and Table 35, above.
The PSU is provided with a reliable protective earth ground. All secondary circuits are
connected to protective earth ground. Resistance of the ground returns to chassis can
not exceed 1.0 m. This path can be used to carry DC current.
8.3.3
AC Input Voltage Requirements
The power supply must operate within all specified limits over the following input
voltage range, shown in Table 39. Harmonic distortion of up to 10% THD must not
cause the power supply to go out of specified limits. Application of an input voltage
below 85 VAC shall not cause damage to the power supply, including a fuse blow.
June 2010
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Carrier Grade Server TIGW1U—AC Power Subsystem
Table 39.
AC Input Voltage Requirements
Parameter
MIN
Rated
Max
Max Input
AC Current
Max Rated
Input AC Current
Voltage (110)
90 Vrms
100-127 Vrms
140 Vrms
7.0 Arms
(See Notes 1
and 3)
6.3 Arms
(See Note 4)
Voltage (220)
180 Vrms
200-240 Vrms
264 Vrms
3.5 Arms
(See Notes 2
and 3)
3.2 Arms
(See Note 4)
Frequency
47 Hz
1.
2.
3.
4.
8.3.4
63 Hz
Maximum input current at low input voltage range shall be measured at 90 VAC, at max load.
Maximum input current at high input voltage range shall be measured at 180 VAC, at max load.
This is not to be used for determining agency input current markings.
Maximum rated input current is measured at 100 VAC and 200 VAC.
Air Flow
Each power supply module incorporates fans for self-cooling, which also contribute to
overall system cooling. The cooling air enters the power module from the PDB side
(pre-heated air from the system). The fan’s variable speed is based on output load and
ambient temperature. Under standby mode, the fans run at minimum RPM and provide
3.5 CFM of airflow per PSU module.
8.3.5
Thermal Protection
The PSU incorporates thermal protection that causes a shut-down if airflow through the
PSU is insufficient. Thermal protection activates shutdown before the temperature of
any PSU component passes the maximum rated temperature. This shutdown takes
place before over-temperature-induced damage to the PSU.
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June 2010
DC Power Subsystem—Carrier Grade Server TIGW1U
9.0
DC Power Subsystem
This chapter defines the features and functionality of the DC-input switching power
subsystem of the Kontron Carrier Grade Server TIGW1U. The DC power subsystem has
up to two DC power supply modules capable of operating in redundant mode and a
power distribution board (PDB).
The power subsystem with DC power supply module is NEBS hardened. NEBS
certification of the TIGW1U carrier grade server system is performed with the TIGW1U
system configured with a DC power subsystem.
The information contained in this chapter is organized into the following sections:
• Features
• DC-Input Power Distribution Board
• DC-Input Power Supply Module
9.1
Features
• 450 W power module output capability over full DC input voltage range
• 450 W subsystem output capability over full DC input voltage range
• Power good indication LEDs
• Predictive failure warning
• Internal cooling fans with multi-speed capability
• Remote sense of 3.3 V, 5 V, and 12 V DC outputs (on the PDB)
• DC_OK circuitry for brown out protection and recovery
• Built-in load sharing capability
• Built-in overloading protection capability
• Onboard field replaceable unit (FRU) information
• I2C interface for server management functions
• Integral handle for insertion/extraction
• Mechanical module latching feature
9.2
DC-Input Power Distribution Board
The DC-input power subsystem uses the same PDB as the AC-input subsystem. See
Section 8.2, “Power Distribution Board”.
June 2010
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Carrier Grade Server TIGW1U—DC Power Subsystem
9.3
DC-Input Power Supply Module
9.3.1
PSU Enclosure
A mechanical drawing of the enclosure for the 450 W DC-input power supply module is
shown in Figure 51.
Figure 51.
DC PSU Mechanical Drawing
Airflow direction
Fan
54.5 ±
0.5 mm
Top View
321 mm ± 0.5
Bi-Color LED
(PWR/Fail)
Sloped to allow smooth
insertion into the system
40.25 ±
0.5 mm
39 ±
0.5 mm
Side View
4.0
DC
325.99 ± 0.40
[12.834 ± 0.015]
312.28 ± 0.40
[12.294 ± 0.015]
3.81 ± 0.30
[0.150 ± 0.011]
Bottom View
AF000872
9.3.2
DC Power Supply Unit Input Connector
The DC input power is delivered to the PSU through a 4-pin connector (Molex* MTC
55757-0420 or equivalent) as shown in Figure 51.
Figure 52.
DC Power Supply Module Input Connector
Pin 1
The mating connector for customer cable termination is a Molex 54927-0420 or
equivalent, as shown in Figure 53.
Kontron Carrier Grade Server TIGW1U
Technical Product Specification, Rev 1.4
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June 2010
DC Power Subsystem—Carrier Grade Server TIGW1U
Figure 53.
DC Power Supply Module Power Input Mating Connector
The pin-out of the DC input connector is given in Table 40.
Table 40.
9.3.3
DC Power Supply Module Input Pin Assignments
Pin#
Description
1
RTN
2
RTN
3
–48V
4
–48V
DC PSU to PDB Interconnect
The PSU’s PCB extends beyond the PSU enclosure with edge finger contacts and blind
mates to a Molex LPH 45984-005 connector, or equivalent, located on the PDB (power
distribution board). This connects the PSU’s output voltages and signals to the PDB.
The PSU is provided with a reliable protective earth ground. All secondary circuits are
connected to protective earth ground. Resistance of the ground returns to chassis can
not exceed 1.0 m. This path can be used to carry DC current.
Figure 54, Figure 55, and Table 41 document the connection between each PSU module
and the PDB.
Figure 54.
PSU Docking Connector
AF000865
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Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—DC Power Subsystem
Plug 1
(+12V)
Plug 2
(Ground)
Plug 1
(Ground)
Top
Pin 13
Plug 2
(+12V)
Pin 1
Bottom
Pin 24
PSU Output Finger Layout
Pin 12
Figure 55.
AF000870
Table 41.
9.3.4
PSU Docking Connector Pin Out
Pin #
Pin Assignment
Pin #
Pin Assignment
1
n/c
13
12V RS+
2
n/c
14
12V RS-
3
A0
15
12LS
4
n/c
16
SMB Alert
5
n/c
17
SDA
6
n/c
18
SCL
7
n/c
19
PS Kill
8
n/c
20
PS_ON
9
n/c
21
PWOK
10
n/c
22
A1
11
5VSB
23
5VSB
12
5VSB
24
5VSB
P1 Top
COMM
P1 Bottom
+12V
P2 Top
COMM
P2 Bottom
+12V
DC Input Voltage
The power supply must operate within all specified limits over the following input
voltage range, shown in Table 42.
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June 2010
DC Power Subsystem—Carrier Grade Server TIGW1U
Table 42.
DC Input Rating
Parameter
MIN
Rated
MAX
DC Voltage
-38 VDC
-48 VDC/-60 VDC
-75 VDC
Note:
There are two rated input voltages. One is for 48 VDC battery plants, the other is for 60
VDC battery plants.
9.3.5
Output Current Ratings
The PSU provides two outputs, +12 V and +5 V standby voltage. The combined
maximum output power of all outputs is 450 W (680 W peak). Each output has a
maximum and minimum current rating as shown in Table 43.
Table 43.
DC PSU Load Ratings
+12V
+5V standby
MAX Load
37.0 A
3.0 A
MIN DYNAMIC Load
0.0 A
0.1 A
MIN STATIC Load
0.0 A
0.1 A
PEAK Load (12 seconds minimum)
42.0 A
3.5 A
Max Output Power (continuous), see note 1
12 V x 37 A = 444 W max
5 V x 3 A = 15 W max
Peak Output Power (12 sec. min.), see note 2
12 V x 42 A = 504 W pk
5 V x 3.5 A = 17.5 W pk
Notes:
1.
At maximum load the output voltages are allowed to sag to -4%. For the 12 V output, this results in
11.52 V, so the actual max power will then be 11.52 V x 37 A = 426.2 W. For the 5 V standby output,
the max load voltage can sag to 4.80 V so the actual max power is 4.80 V x 3 A = 14.4 W. The total
max continuous power is therefore 426.2 + 14.4 = 440.6 W.
2.
At peak load the output voltages are allowed to sag to -4%. For the 12 V output, this results in
11.52 V, so the actual max power will then be 11.52 V x 42 A = 483.8 W. For the 5 V standby output,
the max load voltage can sag to 4.80 V so the actual max power is 4.80 V x 3.5 A = 16.8 W. The total
max continuous power is therefore 483.8 + 16.8 = 500.6 W.
9.3.6
DC PSU LED Indicators
The PSU provides a single, external, bi-color LED to indicate the status of the power
supply.
The LED blinks green when DC is applied to the PSU and standby voltages are
available. The LED displays solid green when all the power outputs are available.
The LED displays solid amber when the PSU has failed or shut down due to over-current
or over-temperature.
See the following table for LED conditions.
Table 44.
June 2010
DC PSU LED Indicators
Power Supply Condition
Bi-color LED Indication
No DC power to all power supplies
OFF
No DC power to this PSU only (for 1+1 configuration)
or
Power supply critical event causing a shutdown:
failure, fuse blown (1+1 only), OCP(12V), OVP(12V), fan failed
Amber
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Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—DC Power Subsystem
Table 44.
9.3.7
DC PSU LED Indicators
Power Supply Condition
Bi-color LED Indication
Power supply warning events where the power supply continues to operate:
high temp, high power/high current, slow fan.
1 Hz Blinking Amber
DC present / Only 5 Vsb on (PS Off)
1 Hz Blinking Green
Output ON and OK
Green
Air Flow
The power supply module incorporates fans for self-cooling, which also contribute to
overall system cooling. The cooling air enters the power module from the PDB side
(pre-heated air from the system). The fan’s variable speed is based on output load and
ambient temperature. Under standby mode, the fans run at minimum RPM and provide
3.5 CFM of airflow per PSU module.
9.3.8
Thermal Protection
The PSU incorporates thermal protection that causes a shut down if airflow through the
PSU is insufficient. Thermal protection activates shutdown before the temperature of
any PSU component passes the maximum rated temperature. This shutdown takes
place before over-temperature induced damage to the PSU.
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June 2010
Regulatory Specifications—Carrier Grade Server TIGW1U
10.0
Regulatory Specifications
The Kontron Carrier Grade Server TIGW1U meets the specifications and regulations for
safety and EMC defined in this chapter.
10.1
10.2
10.3
Safety Compliance
USA/Canada
UL 60950-1, 1st Edition/CSA 22.2
Europe
Low Voltage Directive, 73/23/EEC
TUV/GS to EN60950-1, 1st Edition
International
CB Certificate and Report to IEC60950-1, 1St Edition and all international
deviations
Electromagnetic Compatibility
USA
FCC 47 CFR Parts 2 and 15, Verified Class A Limit
Canada
IC ICES-003 Class A Limit
Europe
EMC Directive, 89/336/EEC
EN55022, Class A Limit, Radiated & Conducted Emissions
EN55024 Immunity Characteristics for ITE
EN61000-4-2 ESD Immunity (level 2 contact discharge, level 3 air discharge)
EN61000-4-3 Radiated Immunity (level 2)
EN61000-4-4 Electrical Fast Transient (level 2)
EN61000-4-5 Surge
EN61000-4-6 Conducted RF
EN61000-4-8 Power Frequency Magnetic Fields
EN61000-4-11 Voltage Fluctuations and Short Interrupts
EN61000-3-2 Harmonic Currents
EN61000-3-3 Voltage Flicker
Australia/New Zealand
EN55022, Class A Limit
Japan
VCCI Class A ITE (CISPR 22, Class A Limit)
Taiwan
BSMI Approval, CNS 13438, Class A and CNS13436 Safety
Korea
RRL Approval, Class A
China
CCC Approval, Class A (EMC and Safety)
Russia
Gost Approval (EMC and safety)
International
CISPR 22, Class A Limit, CISPR 24 Immunity
CE Mark
The CE marking on this product indicates that the Carrier Grade Server TIGW1U system
is in compliance with the European Union’s EMC Directive 89/336/EEC, and Low Voltage
Directive 73/23/EEC.
June 2010
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Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—Regulatory Specifications
10.4
NEBS Compliance
The Carrier Grade Server TIGW1U with DC input is compliant with the NEBS Level 3
criteria from the following NEBS specifications:
• NEBS GR-63-CORE, Issue 3 — Physical Protection
• NEBS GR-1089-CORE, Issue 4 — Electromagnetic Compatibility and Electrical
Safety
10.5
ETSI Standards Compliance (DC Input Only)
The Carrier Grade Server TIGW1U with DC input is compliant with the following ETSI
specifications:
• ETSI EN 300 386 — EMC requirements for Telecom Equip.
• ETS 300-019-2-1 — Storage Tests, Class T1.2
• ETS 300-019-2-2 — Transportation Tests, Class T2.3
• ETS 300-019-2-3 — Operational Tests, Class T3.2
• ETS 753 — Acoustic Noise
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June 2010
Glossary—Carrier Grade Server TIGW1U
Appendix A Glossary
This appendix contains important acronyms and terms used in the preceding chapters.
Term
June 2010
Definition
A, Amp
Ampere
A/µs
Amps per microsecond
AC
Alternating current
ACPI
Advanced Configuration and Power Interface
ANSI
American National Standards Institute
APIC
Advanced Programmable Interrupt Controller
ASIC
Application specific integrated circuit
AWG
American wire gauge
BIOS
Basic input/output system
BMC
Bus management controller
Bridge
Circuitry that connects one computer bus to another
Byte
8-bit quantity
C
Centigrade
CE
Community European
CFM
Cubic feet per minute
CISPR
International Special Committee on Radio Interference
CSA
Canadian Standards Organization
CTS
Clear to send
DAT
Digital audio tape
dB
Decibel
dBA
Acoustic decibel
DC
Direct current
DIMM
Dual inline memory module
DMI
Desktop management interface
DOS
Disk operating system
DRAM
Dynamic random access memory
DSR
Data set ready
DTR
Data terminal ready
DWORD
Double word – 32-bit quantity
ECC
Error checking and correcting
EEPROM
Electrically erasable programmable read-only memory
EFP
Ethernet Front Panel
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Carrier Grade Server TIGW1U—Glossary
Term
Definition
EMC
Electromagnetic compatibility
EMI
Electromagnetic interference
EMP
Emergency management port
EN
European Standard (Norme Européenne or Europäische Norm)
EPS
External product specification
ESCD
Extended system configuration data
ESD
Electrostatic discharge
ESR
Equivalent series resistance
eUSB
Embedded USB
F
Fahrenheit
FCC
Federal Communications Commission
FFC
Flexible flat connector
Flash ROM
EEPROM
FPC
Front panel controller
FRB
Fault resilient booting
FRU
Field replaceable unit
G
Acceleration in gravity units, 1 G = 9.8 m/s2
Gbyte or GB
Gigabyte – 1024 Mbytes
GND
Ground
GPIO
General purpose input/output
Grms
Root mean square of acceleration in gravity units
GUI
Graphical user interface
HDD
Hard disk drive
HPIB
Hot-plug indicator board
HSC
Hot-swap controller
Hz
Hertz – 1 cycle/second
I/O
Input/output
I2C*
Inter-integrated circuit bus
ICMB
Intelligent Chassis Management Bus
IDE
Integrated drive electronics
IEC
International Electrotechnical Commission
IEEE
Institute of Electrical and Electronics Engineers
IFLASH
Utility to update Flash EEPROM
IMB
Intelligent management bus
IPMB
Intelligent Platform Management Bus
IPMI
Intelligent Platform Management Initiative
IRQ
Interrupt request line
ITE
Information technology equipment
ITP
In-target probe
JAE
Japan Aviation Electronics
KB
Kilobyte – 1024 bytes
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June 2010
Glossary—Carrier Grade Server TIGW1U
June 2010
Term
Definition
kV
Kilovolt – 1,000 volts
L2
Second-level cache
LAN
Local area network
LED
Light-emitting diode
LVDS
Low voltage differential SCSI
mA
Milliampere
Mbyte or MB
Megabyte – 1024 Kbytes
MEC
Memory expansion card
mm
Millimeter
MPS
Multiprocessor specification
MTTR
Mean time to repair
m
Milliohm
NEMKO
Norges Elektriske Materiellkontroll (Norwegian Board of Testing and Approval of
Electrical Equipment)
NIC
Network interface card
NMI
Nonmaskable interrupt
NWPA
NetWare* Peripheral Architecture
ODI
Open data-link interface
OEM
Original equipment manufacturer
OPROM
Option ROM (expansion BIOS for a peripheral)
OS
Operating system
OTP
Over-temperature protection
OVP
Over-voltage protection
PC-100
Collection of specifications for 100 MHz memory modules
PCB
Printed circuit board
PCI
Peripheral component interconnect
PCI-E
PCI Express peripheral component interconnect
PHP
PCI hot-plug
PID
Programmable interrupt device
PIRQ
PCI interrupt request line
PMM
POST memory manager
PnP
Plug and play
POST
Power-on Self Test
PSU
Power supply unit
PVC
Polyvinyl chloride
PWM
Pulse width modulation
RAS
Reliability, availability, and serviceability
RIA
Ring indicator
RPM
Revolutions per minute
RTS
Request to send
SAF-TE
SCSI Accessed Fault-Tolerant Enclosures
SCA
Single connector attachment
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Technical Product Specification, Rev 1.4
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Carrier Grade Server TIGW1U—Glossary
Term
Definition
SCL
Serial clock
SCSI
Small Computer Systems Interface
SDR
Sensor data records
SDRAM
Synchronous dynamic RAM
SEC
Single edge connector
SEL
System event log
SELV
Safety extra low voltage
SEMKO
Sverge Elektriske Materiellkontroll (Swedish Board of Testing and Approval of
Electrical Equipment)
SFP
SAS Front Panel
SGRAM
Synchronous graphics RAM
SM
Server management
SMBIOS
System management BIOS
SMBus
Subset of I2C bus/protocol (developed by Intel)
SMI
System management interrupt
SMM
Server management mode
SMP
Symmetric multiprocessing
SMRAM
System management RAM
SMS
Server management software
SPD
Serial presence detect
SSD
Solid-state drive
SSI
Server system infrastructure
TUV
Technischer Uberwachungs-Verein (A safety testing laboratory with headquarters in
Germany)
UL
Underwriters Laboratories, Inc.
USB
Universal Serial Bus
UV
Under-voltage
V
Volt
VA
Volt-amps (volts multiplied by amps)
Vac
Volts alternating current
VCCI
Voluntary Control Council for Interference
Vdc
Volts direct current
VDE
Verband Deutscher Electrotechniker (German Institute of Electrical Engineers)
VGA
Video graphics array
VRM
Voltage regulator module
VSB
Voltage standby
W
Watt
WfM
Wired for Management

Ohm
F
Microfarad
S
Microsecond
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June 2010
Additional References—Carrier Grade Server TIGW1U
Appendix B Additional References
This appendix contains information on additional reference documents that contain
useful information on the indicated subjects:
Ethernet
• Intel® 82563EB and Intel® 82571EB Gigabit Ethernet Controller datasheets
http://developer.intel.com/design/network/datashts/82563_datasheet.htm
http://developer.intel.com/design/network/datashts/82571eb_82572ei.htm
MPS
• MultiProcessor Specification, Version 1.4, Intel Corporation
http://www-techdoc.intel.com/design/intarch/manuals/242016.htm
PCI
• PCI Bus Power Management Interface Specification, Revision 1.1, PCI Special
Interest Group
http://www.pcisig.com/specifications/conventional/
pci_bus_power_management_interface
• PCI Local Bus Specification Revision 3.0, PCI Special Interest Group
http://www.pcisig.com/specifications/conventional/pci_30
Plug and Play
• Plug and Play ISA Specification, Version 1.0a, Microsoft Corp.
http://www.microsoft.com/hwdev/respec/PNPSPECS.HTM
• Clarification to Plug and Play ISA Specification, Version 1.0a, Microsoft Corp.
http://www.microsoft.com/hwdev/respec/PNPSPECS.HTM
Power Supply
• AC ERP1U 450 W Power Supply Module Specification, Intel Corporation.
• DC ERP1U 450 W Power Supply Module Specification, Intel Corporation.
• AC / DC ERP1U 450 W Power Supply Power Distribution Board Specification, Intel
Corporation.
Server Management
• Emergency Management Port v1.0 Interface External Product Specification,
Revision 0.83, Intel Corporation.
• Intelligent Platform Management Interface (IPMI) Specification, Version 2.0, Intel
Corporation.
http://developer.intel.com/design/servers/ipmi/spec.htm
June 2010
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Carrier Grade Server TIGW1U—Additional References
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