CCD Delay Line Series MN3881S PAL-Compatible CCD Video Signal Delay Element VBIASC 1 16 VINC VOC 2 15 N.C. N.C. 3 14 N.C. M Di ain sc te on na tin nc ue e/ d The MN3881S is a CCD signal delay element for video signal processing applications. It contains such components as a shift register clock driver, charge I/O blocks, 1/2nd frequency doubler, two switchable CCD analog shift registers, a clamp bias circuit, resampling output amplifiers, a mode selection circuit and booster circuits. When the switch pin is grounded, the MN3881S samples the input using the supplied clock signal with a frequency 8.8672375 MHz of twice the PAL color signal subcarrier frequency, and after adding in the attached filter delay, produces independent delays of 1 H (the horizontal scan period for the PAL system) for the Y output and 2 H for the C output. XI –VBB 5 12 VSS N.C. 6 11 SW VOY 7 10 VBIASY 8 9 N.C. VINY ( TOP VIEW ) SOP016-P-0225 lan (p Applications 13 ed Single 4.9 V power supply Single chip combining luminance signal delay element and delay element for color signal converted to low frequency. VCRs 4 M ma ain int ten en an an ce ce /D typ isc e, ont ma inu int ed en in an clu ce de typ s f e, ollo pla wi ne ng d d fou isc r P on rod tin uc ue t l d t ife yp cy ed cle , d st isc ag on e. tin ue d Features VDD e) Pin Assignment typ Overview 1 MN3881S CCD Delay Line Series VBIASC 1 VDD 4 12 VSS Block Diagram Auto bias circuit CCD 567 stages Charge detection block Resampling output 2 amplifier ø1 driver ø2 driver øR driver øSH driver øSH driver M ma ain int ten en an an ce ce /D 11 typ isc SW e, ont ma inu int ed en in an clu ce de typ s f e, ollo pla wi ne ng d d fou isc r P on rod tin uc ue t l d t ife 8 yp cy VBIASY ed cle , d st isc ag on e. tin ue d øS driver VOC e) Charge input block typ 16 M Di ain sc te on na tin nc ue e/ d VINC Timing adjustment XI 13 Waveform amplifier adjustment block 1/2nd frequency doubler Timing adjustment øS driver ø1 driver ø2 driver øR driver øSH driver øSH driver Auto clamp circuit 9 Charge input block (p –VBB lan ed 5 VINY 2 CCD 566.5 stages Charge detection block Resampling output 7 amplifier VOY CCD Delay Line Series MN3881S Application Circuit Example VBIASC 0.01µF 1 VDD 0.1µF 4 12 VSS 10µF – + Auto bias circuit VINC 16 CCD 567 stages Charge detection block Resampling output 2 VOC amplifier M Di ain sc te on na tin nc ue e/ d 0.01µF Charge input block øS driver ø1 driver ø2 driver øR driver øSH driver M ma ain int ten en an an ce ce /D SW 11 typ isc e, ont ma inu int ed en in an clu ce de typ s f e, ollo pla wi ne ng d d fou isc r P on rod tin uc ue t l d t ife VBIASY 8 yp cy ed cle , d st isc ag on e. tin ue d typ e) øSH driver Timing adjustment XI 13 Waveform amplifier adjustment block 1000pF 1/2nd frequency doubler Timing adjustment øS driver ø1 driver ø2 driver øR driver øSH driver øSH driver Auto clamp circuit Charge detection block Resampling output amplifier 7 VOY (p lan –VBB CCD 566.5 stages ed Charge input block 5 VINY 9 – + 0.47µF 0.01µF 0.01µF Note: If the capacitor attached to pin 5 has a polarity, attach the negative pole to pin 5. 3 lan (p ed 1 (0.6) 4 8 1.27 0.40±0.10 SEATING PLANE 0 to 10° e) 0.15 -0.05 +0.10 6.50±0.20 4.30±0.20 16 typ 0.40min. M ma ain int ten en an an ce ce /D typ isc e, ont ma inu int ed en in 0.10±0.10 1.50±0.20 an clu ce de +0.50 1.60 -0.20 typ s f e, ollo pla wi ne ng d d fou isc r P on rod tin uc ue t l d t ife yp cy ed cle , d st isc ag on e. tin ue d M Di ain sc te on na tin nc ue e/ d MN3881S CCD Delay Line Series Package Dimensions (Unit:mm) SOP016-P-0225 10.10±0.20 9 1.10±0.20 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. M Di ain sc te on na tin nc ue e/ d (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. ed M ma ain int ten en an an ce ce /D typ isc e, ont ma inu int ed en in an clu ce de typ s f e, ollo pla wi ne ng d d fou isc r P on rod tin uc ue t l d t ife yp cy ed cle , d st isc ag on e. tin ue dt yp e) (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (p lan (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.