CCD Delay Line Series
MN3881S
PAL-Compatible CCD Video Signal Delay Element
VBIASC
1
16
VINC
VOC
2
15
N.C.
N.C.
3
14
N.C.
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The MN3881S is a CCD signal delay element for video
signal processing applications.
It contains such components as a shift register clock
driver, charge I/O blocks, 1/2nd frequency doubler, two
switchable CCD analog shift registers, a clamp bias circuit, resampling output amplifiers, a mode selection circuit and booster circuits.
When the switch pin is grounded, the MN3881S
samples the input using the supplied clock signal with a
frequency 8.8672375 MHz of twice the PAL color signal
subcarrier frequency, and after adding in the attached filter delay, produces independent delays of 1 H (the horizontal scan period for the PAL system) for the Y output
and 2 H for the C output.
XI
–VBB
5
12
VSS
N.C.
6
11
SW
VOY
7
10
VBIASY
8
9
N.C.
VINY
( TOP VIEW )
SOP016-P-0225
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Applications
13
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Single 4.9 V power supply
Single chip combining luminance signal delay element
and delay element for color signal converted to low
frequency.
VCRs
4
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Features
VDD
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Pin Assignment
typ
Overview
1
MN3881S
CCD Delay Line Series
VBIASC
1
VDD
4
12
VSS
Block Diagram
Auto bias circuit
CCD 567 stages
Charge
detection block
Resampling output 2
amplifier
ø1 driver
ø2 driver
øR driver
øSH driver
øSH driver
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8
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VBIASY
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øS driver
VOC
e)
Charge input
block
typ
16
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VINC
Timing adjustment
XI
13
Waveform amplifier
adjustment block
1/2nd frequency
doubler
Timing adjustment
øS driver
ø1 driver
ø2 driver
øR driver
øSH driver
øSH driver
Auto clamp circuit
9
Charge input
block
(p –VBB
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ed
5
VINY
2
CCD 566.5 stages
Charge
detection block
Resampling output 7
amplifier
VOY
CCD Delay Line Series
MN3881S
Application Circuit Example
VBIASC
0.01µF
1
VDD
0.1µF
4
12 VSS
10µF
– +
Auto bias circuit
VINC 16
CCD 567 stages
Charge
detection block
Resampling output 2 VOC
amplifier
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0.01µF
Charge input
block
øS driver
ø1 driver
ø2 driver
øR driver
øSH driver
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VBIASY 8
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typ
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øSH driver
Timing adjustment
XI 13
Waveform amplifier
adjustment block
1000pF
1/2nd frequency
doubler
Timing adjustment
øS driver
ø1 driver
ø2 driver
øR driver
øSH driver
øSH driver
Auto clamp circuit
Charge
detection block
Resampling output
amplifier
7 VOY
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–VBB
CCD 566.5 stages
ed
Charge input
block
5
VINY 9
– +
0.47µF
0.01µF
0.01µF
Note: If the capacitor attached to pin 5 has a polarity, attach the negative pole to pin 5.
3
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ed
1
(0.6)
4
8
1.27
0.40±0.10
SEATING PLANE
0 to 10°
e)
0.15 -0.05
+0.10
6.50±0.20
4.30±0.20
16
typ
0.40min.
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1.50±0.20
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+0.50
1.60 -0.20
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MN3881S
CCD Delay Line Series
Package Dimensions (Unit:mm)
SOP016-P-0225
10.10±0.20
9
1.10±0.20
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semiconductors described in this book
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company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
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equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
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(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.