z13s IMPP

IBM
z13s
Installation Manual for Physical Planning
2965 All Models
GC28-6953-00
Level 00f
IBM
z13s
Installation Manual for Physical Planning
2965 All Models
GC28-6953-00
Level 00f
Note:
Before you use this information and the product it supports, be sure to read the information in
“Safety” on page v, Appendix G, “Notices,” on page 133, and Environmental Notices and User Guide,
Z125-5823.
This edition, GC28-6953-00, applies to the IBM z13s (z13s) and IBM LinuxONE Rockhopper (Rockhopper).
There may be a newer version of this document in PDF format available on Resource Link. Go to
http://www.ibm.com/servers/resourcelink and click on Library on the navigation bar. A newer version is indicated by a
lowercase, alphabetic letter following the form number suffix (for example: 00a, 00b, 01a, 01b).
© Copyright IBM Corporation 2016, 2017.
US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contract
with IBM Corp.
Level 00f
Contents
Safety
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Safety notices . . . . . . .
World trade safety information
Laser safety information . . .
Laser compliance . . . . .
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About this publication . . . . . . . . vii
What is included in this publication . . .
Revisions . . . . . . . . . . . .
Related publications . . . . . . . .
Related HMC and SE console information .
Licensed Machine Code . . . . . . .
Accessibility . . . . . . . . . . .
Accessibility features . . . . . . .
Keyboard navigation . . . . . . .
IBM and accessibility . . . . . . .
How to send your comments . . . . .
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Summary of changes . . . . . . . . . xi
Chapter 1. Introduction . . . . . . . . 1
System planning . . . . . . .
Planning for a new computer room .
Planning checklist . . . . . .
Customized planning aid . . . .
ASHRAE declaration . . . . .
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Chapter 2. Environmental specifications 9
System acclimation . . .
Conductive contamination
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Chapter 3. Models and physical
specifications . . . . . . . . . . . . 17
Physical dimensions . . . . . . . . .
Shipping specifications . . . . . . .
z13s or Rockhopper models . . . . . .
PCIe I/O drawers . . . . . . . . .
I/O drawers . . . . . . . . . . .
System upgrades . . . . . . . . .
Differences between IBM servers . . . . .
Plan view . . . . . . . . . . . . .
Weight distribution . . . . . . . . . .
System weight examples . . . . . . .
Weight distribution and multiple systems .
Machine and service clearance areas . . . .
Cooling recommendations for the room . . .
Considerations for multiple system installations
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Chapter 4. Guide for raised floor
preparation . . . . . . . . . . . . . 47
Casters . . . . . . . . . . . . . . . . 48
Procedure for cutting and placement of floor panels 49
Raised floor with 610 mm (24 in) or 600 mm
(23.5 in) floor panels . . . . . . . . . . 50
© Copyright IBM Corp. 2016, 2017
Chapter 5. Power requirements . . . . 53
General electrical power requirements . . .
Important power selection considerations . .
Power installation considerations . . . . .
Bulk power regulator (BPR) specifications . .
Power specifications . . . . . . . . .
Power estimation tool . . . . . . . . .
Power capping . . . . . . . . . . .
Customer circuit breakers. . . . . . . .
Internal battery feature (FC 3215) . . . . .
Unit emergency power off (UEPO) . . .
Computer room emergency power off (EPO)
Power plugs and receptacles, and line cord wire
specifications . . . . . . . . . . . .
DC power cords . . . . . . . . . .
Grounding specifications . . . . . . . .
Top exit power cords . . . . . . . . .
Line cord wire specifications. . . . . . .
Wire colors for cut-end cords . . . . .
Line physical protection . . . . . . .
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Chapter 6. Hardware Management
Console and Support Element
communications . . . . . . . . . . 71
Support Element. . . . . . . . . .
Hardware Management Console . . . .
Ethernet LAN switch support . . . . .
Ethernet network connection requirements .
Hardware Management Console and Support
Element wiring options . . . . . . .
Trusted Key Entry (TKE) . . . . . . .
LAN connections . . . . . . . .
Planning for an ensemble. . . . . . .
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Chapter 7. Remote Support Facility
(RSF) installation planning . . . . . . 79
Choosing a communications method for remote
support. . . . . . . . . . . . . . .
Using the internet for remote support . . .
Server address lists and host names . . . .
. 79
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Chapter 8. Cabling and connectivity . . 83
Top exit I/O cabling . . . . . . . .
IBM Site and Facilities Services . . . . .
Customer fiber optic cabling responsibilities
FICON channel feature . . . . . . .
Configuration information . . . . .
FICON references . . . . . . . .
OSA-Express LAN features . . . . . .
Configuration information . . . . .
OSA-Express reference. . . . . . .
I/O interconnect links . . . . . . . .
Coupling features . . . . . . . . .
HCA3-O feature (FC 0171) . . . . .
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|
HCA3-O LR feature (FC 0170) . . . . . .
Integrated Coupling Adapter (ICA SR) feature .
Coupling Express LR feature (FC 0433) . . .
Flash Express (FC 0402 and FC 0403) . . . . .
Native PCIe adapters . . . . . . . . . .
10GbE RoCE Express (FC 0411) . . . . . .
zEnterprise Data Compression (zEDC) Express
(FC 0420) . . . . . . . . . . . . .
Regional Crypto Enablement (RCE) Vendor 1 . .
Time synchronization . . . . . . . . . .
Server time protocol . . . . . . . . .
Pulse per second . . . . . . . . . .
Ordering PPS cables . . . . . . . . .
Fiber Quick Connect for FICON cabling . . .
Preparing configuration definition . . . . .
z/VM . . . . . . . . . . . . . .
z/VSE . . . . . . . . . . . . . .
z/OS HCD . . . . . . . . . . . .
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Chapter 9. Parallel sysplex planning
105
Appendix A. IBM standard symbols
109
Appendix B. Hardware Management
Console physical specifications . . . 111
Appendix C. Acoustics . . . . . . . 123
Acoustical noise emission levels .
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Relevant international standards: .
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Appendix D. Dual power installation
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125
Appendix E. Balancing power panel
loads . . . . . . . . . . . . . . . 127
Appendix F. Frame tie-down . . . . . 129
Raised floor frame tie-down . .
Installing the eyebolts . . .
Nonraised floor frame tie-down .
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Appendix G. Notices . . . . . . . . 133
Trademarks . .
Class A Notices.
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Level 00f
Safety
Safety notices
Safety notices may be printed throughout this guide. DANGER notices warn you of conditions or
procedures that can result in death or severe personal injury. CAUTION notices warn you of conditions
or procedures that can cause personal injury that is neither lethal nor extremely hazardous. Attention
notices warn you of conditions or procedures that can cause damage to machines, equipment, or
programs.
World trade safety information
Several countries require the safety information contained in product publications to be presented in their
translation. If this requirement applies to your country, a safety information booklet is included in the
publications package shipped with the product. The booklet contains the translated safety information
with references to the US English source. Before using a US English publication to install, operate, or
service this IBM® product, you must first become familiar with the related safety information in the
Systems Safety Notices, G229-9054. You should also refer to the booklet any time you do not clearly
understand any safety information in the US English publications.
Laser safety information
All IBM z Systems® (z Systems®) and IBM LinuxONE™ (LinuxONE) models can use I/O cards such as
FICON®, Open Systems Adapter (OSA), InterSystem Channel-3 (ISC-3), or other I/O features which are
fiber optic based and utilize lasers (short wavelength or long wavelength lasers).
Laser compliance
All lasers are certified in the US to conform to the requirements of DHHS 21 CFR Subchapter J for Class
1 or Class 1M laser products. Outside the US, they are certified to be in compliance with IEC 60825 as a
Class 1 or Class 1M laser product. Consult the label on each part for laser certification numbers and
approval information.
CAUTION: Data processing environments can contain equipment transmitting on system links with
laser modules that operate at greater than Class 1 power levels. For this reason, never look into the
end of an optical fiber cable or open receptacle. (C027)
CAUTION: This product contains a Class 1M laser. Do not view directly with optical instruments.
(C028)
© Copyright IBM Corp. 2016, 2017
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About this publication
This publication contains information necessary for planning the physical installation of the IBM z13sTM
(z13sTM) and IBM LinuxONE RockhopperTM (Rockhopper).
Figures included in this document illustrate concepts and are not necessarily accurate in content,
appearance, or specific behavior.
What is included in this publication
This publication contains the following chapters and appendices:
v Chapter 1 provides an introduction to planning for your system and a planning checklist.
v Chapter 2 contains important computer room environmental information.
v Chapter 3 gives plan views, service clearances, weight distribution, and cooling information for the
system.
v Chapter 4 contains information on preparation of the raised floor.
v Chapter 5 provides power and internal battery feature information.
v Chapter 6 includes information on Hardware Management Console and Support Element
communications.
v Chapter 7 contains Remote Support Facility installation planning.
v Chapter 8 discusses cable connectivity information.
v Chapter 9 provides information about operating in a Parallel Sysplex® environment.
v The appendices provide IBM standard symbols, HMC specifications, acoustics, power installation and
power loads and a sample cabling schematic and upgrade paths, and frame tie-down information.
Revisions
A technical change from the previous edition of this document is indicated by a vertical bar ( | ) to the
left of the change.
Related publications
IBM publications that you will find helpful and that you should use along with this publication are in the
following list. You can access these books from Resource Link® at http://www.ibm.com/servers/resourcelink,
and click Library from the navigation bar on the left. Then select the server product.
v Systems Safety Notices, G229-9054
v Environmental Notices and User Guide, Z125-5823
v IBM z13s Installation Manual, GC28-6952
v Planning for Fiber Optic Links (FICON/FCP, Coupling Links, Open System Adapters, and zHyperLink Express),
GA23-1408
v FICON Channel-to-Channel Reference, SB10-7174
v Open System Adapter-Express Integrated Console Controller Dual Port User’s Guide , SA23-2266
v Open Systems Adapter-Express Customer's Guide and Reference, SA22-7935
In addition to these references, there is general computer room planning information on Resource Link at
http://www.ibm.com/servers/resourcelink.
© Copyright IBM Corp. 2016, 2017
vii
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Related HMC and SE console information
Hardware Management Console (HMC) and Support Element (SE) information can be found on the
console help system, or on the IBM Knowledge Center at http://www.ibm.com/support/
knowledgecenter/. Select Products, and then select your server.
Licensed Machine Code
Licensed Machine Code is provided in accordance with the terms and conditions of the applicable IBM
Customer Agreement or other applicable written agreement between the Customer and IBM.
Licensed Machine Code (LMC) is a fundamental component of the IBM z13s or Rockhopper and is
copyrighted and licensed by IBM. Each z13s or Rockhopper is delivered with Licensed Machine Code
that is customized to the specific machine ordered. The Licensed Machine Code enables the z13s or
Rockhopper to operate in accordance with its Official Published Specifications.
Model upgrades, feature additions, and system engineering changes may require updated Licensed
Machine Code for the system. Updated Licensed Machine Code replaces the existing Licensed Machine
Code.
Relocation of a z13s or Rockhopper requires that the Licensed Machine Code be reinstalled in the server
at the new location. See the “Discontinuing the System” section in the IBM z13s Installation Manual for the
procedure about relocating a z13s or Rockhopper.
Accessibility
IBM strives to provide products with usable access for everyone, regardless of age or ability.
Accessible publications for this product are offered in EPUB format and can be downloaded from
Resource Link at http://www.ibm.com/servers/resourcelink.
If you experience any difficulty with the accessibility of any IBM z Systems® (z Systems®) and IBM
LinuxONE (LinuxONE) information, go to Resource Link at http://www.ibm.com/servers/resourcelink
and click Feedback from the navigation bar on the left. In the Comments input area, state your question
or comment, the publication title and number, choose General comment as the category and click
Submit. You can also send an email to reslink@us.ibm.com providing the same information.
When you send information to IBM, you grant IBM a nonexclusive right to use or distribute the
information in any way it believes appropriate without incurring any obligation to you.
Accessibility features
The following list includes the major accessibility features in IBM z Systems® and IBM LinuxONE
documentation:
v Keyboard-only operation
v Interfaces that are commonly used by screen readers
v Customizable display attributes such as color, contrast, and font size
v Communication of information independent of color
v Interfaces commonly used by screen magnifiers
v Interfaces that are free of flashing lights that could induce seizures due to photo-sensitivity.
Keyboard navigation
This product uses standard Microsoft Windows navigation keys.
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IBM and accessibility
See http://www.ibm.com/able for more information about the commitment that IBM has to accessibility.
How to send your comments
Your feedback is important in helping to provide the most accurate and high-quality information. Send
your comments by using Resource Link at http://www.ibm.com/servers/resourcelink. Click Feedback
on the navigation bar on the left. You can also send an email to reslink@us.ibm.com. Be sure to include
the name of the book, the form number of the book, the version of the book, if applicable, and the
specific location of the text you are commenting on (for example, a page number, table number, or a
heading).
About this publication
ix
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x
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Summary of changes
Summary of changes for the IBM z13s Installation Manual for Physical Planning, GC28-6953.
Table 1. Summary of changes
Release level
Date
00f
7/2017
Changes in level
This revision contains editorial changes and the following technical changes:
v Added Coupling Express LR (FC 0433) to the following sections:
– “Coupling features” on page 91
– Chapter 9, “Parallel sysplex planning,” on page 105
00e
1/2017
This revision contains editorial changes and the following technical changes:
v Changed three phase power information under “Important power selection
considerations” on page 53
v Added table Table 24 on page 56 to “Bulk power regulator (BPR) specifications”
on page 55
00d
10/2016
This revision contains editorial changes and the following technical changes:
v Added 2461 HMC (FC 0095) and 2461 Support Element information
00c
06/2016
This revision contains editorial changes and the following technical changes:
v Updated “Pulse per second” on page 99.
v UpdatedAppendix B, “Hardware Management Console physical specifications,”
on page 111.
00b
05/2016
This revision contains editorial changes and the following technical changes:
v Updated the tables in “Power plugs and receptacles, and line cord wire
specifications” on page 64 and “Line cord wire specifications” on page 69.
00a
04/2016
This revision contains editorial changes and the following technical changes:
v Updated Table 49 on page 123 in “Acoustical noise emission levels” on page 123.
© Copyright IBM Corp. 2016, 2017
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Chapter 1. Introduction
This chapter is intended to help you prepare your physical site for the installation of an z13s or
Rockhopper. Marketing and Installation Planning Representatives are also available to help you with
installation planning. Proper planning for your new system will facilitate a smooth installation and fast
system start up.
The use of the terms, “server”, “processor”, “system” and “all models” in this publication refer to the
z13s or Rockhopper.
System planning
As part of your system planning activity, you will make decisions about where to locate your equipment,
who will operate the system, and so on. A good plan ensures that the equipment and materials are ready
to use when the z13s or Rockhopper arrives.
The type of software (operating system and application programs) that you intend to use must support
the features and devices on the system. You should already be familiar with your software requirements,
but may want to contact your IBM marketing representative for information on planning for the software.
Planning for a new computer room
A detailed step-by-step procedure for physically planning a computer room installation is located on the
General Information for Planning a Physical Site page on Resource Link at http://www.ibm.com/servers/
resourcelink. On the left navigation pane, click Planning, Physical Planning, and General information for
planning a physical site (located under zSeries & S/390®).
© Copyright IBM Corp. 2016, 2017
1
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Planning checklist
The following checklist identifies installation tasks and responsibilities sequentially, and is designed for
new installations. If you have to renovate your site, you may need a longer planning cycle.
Site Preparation Checklist
Task/Consideration
Task Assigned
( )
CHECKPOINT 1
Designate a person in your organization with the responsibility
for all phases of site preparation for this system installation
Review all site planning information with the designated person
Determine who will actually perform each site preparation task
and who will control the marking of this checklist
Identify communication needs, including Remote Support Facility,
cables, switches, telephones, connection panels, etc
In the Chapter titled, “I/O cabling and connectivity” (in this document),
read the information about planning now for future cabling needs.
In the same chapter, also read “IBM Site and Facilities Services”
Identify channel needs including:
cables, directors, switches, patch panels, etc
Identify other machine/device needs including:
changes to any existing equipment
Determine the schedule with your IBM marketing representative
and fill in the target dates on this checklist
CHECKPOINT 2
Lay out the floor plan. Include stationary obstacles, walls, all computer
equipment, locations for power, lighting, heating and cooling, water and
fire detection and extinguishing equipment
If the level of acoustical noise is a concern, consider arranging the floor layout to
avoid areas of excessive noise exposure to employees, and possibly utilize noise
control screens or other treatments to reduce noise levels. Some IBM servers
have available acoustic doors to reduce noise. Check with your marketing
representative to see if your server has such options.
If this is a new computer room, see the course, General information
for planning the physical site under “Planning / Physical Planning / zSeries”
on Resource Link (http://www.ibm.com/servers/resourcelink)
To assist in site planning, a 3-D graphic file to be used with CAD software
is available on Resource Link (http://www.ibm.com/servers/resourcelink
).
“
Click “Planning / Physical Planning.” Then under the specific machine,
click “STP 3-D graphic files.”
Order communication equipment cables, modems, switches,
telephones, connection panels, etc
Order channel equipment cables, directors, switches, patch panels, etc.
In the Chapter titled, “I/O cabling and Connectivity” (in this document),
read the information about “IBM Site and Facilities Services”
and “Customer fiber optic cabling responsibilities” to
determine your cabling requirements and responsibilities. Your IBM
marketing representative can assist you with this task. Other parts
of this chapter include fiber optic channel and adapter descriptions
and information about the Fiber Quick Connect feature for FICON
channels.
If you are planning for a system that will use FICON channels,
InfiniBand, coupling links, or Open System Adapters (OSA),
contact your IBM marketing representative to obtain the document,
Planning for Fiber Optic Links (FICON/FCP, Coupling Links,
Open System Adapters, and zHyperLink Express), GA23-1408
Order other machines/devices, including changes to any existing
equipment
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Target Date
Completed
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Site Preparation Checklist
Task/Consideration
Task Assigned
( )
Target Date
Completed
CHECKPOINT 3
The computer room is prepared for computer equipment service clearance
and floor loading, physical placement based on logical priority, cabling
restrictions, and shock and vibration considerations, and electromagnetic
compatibility/interference
Emergency and backup operations planning includes provisions for
fire detection, prevention, extinguishing, and control equipment, and
storm protection and damage recovery procedures
There is workspace around equipment, including passageways for
movement of people and machines, and includes consideration for
lighting and possible areas of high acoustic noise
Office equipment and space, including furniture, vending, meeting, and
entrance/exit areas have adequate lighting, heating/cooling, and
acoustics
Material and data storage provisions have been satisfied
Schedule and make changes to existing programs as required
Schedule and make changes to existing machines/devices as required
Arrange for installation of cables between work stations, controllers,
modems, switches, etc
Arrange for installation of new power receptacles and wiring
Define a training program for employees
CHECKPOINT 4
Computer room power should be completed.
electrically clean, dedicated circuits for all computer equipment
sufficient power provided to avoid outages caused by power transients
protection from lightning damage
Backup power batteries or generators, if required
Branch circuits, grounding, conduits, phase rotation, emergency controls,
to local electrical code and equipment guidelines
An adequate number of computer equipment and convenience outlets have
been provided in the locations where they are to be used
Computer room personnel are adequately trained in power procedures,
including emergency situations
Review the progress of the communications, channel, and adapter
cabling. Identify and resolve problems and schedule conflicts
Review the system configuration to make sure there are no physical
problems and that the configuration meets your needs.
Chapter 1. Introduction
3
Level 00f
Site Preparation Checklist
Task/Consideration
Task Assigned
( )
CHECKPOINT 5
Air conditioning installation is complete
capacity and controls provided for automatic temperature and humidity levels
filtration system is adequate and maintenance plan established
regular monitoring and testing
Training for computer room personnel
If you have elected to do your own I/O cabling, as cables begin to
arrive, start installing and labeling them. Label power receptacles
as they are installed
Complete the Systems Assurance Product Review with your IBM
marketing representative or Business Partner and the system installers
Carefully measure the delivery path from the shipper drop-off point
to the raised floor install location. Accurate measurements now may
prevent installation delays later
CHECKPOINT 6
Complete communication equipment installation,
cables, modems, switches, telephones, connection panels, etc
Complete the Remote Support Facility installation
LAN and communication cables, switches, patch panels, etc
Prepare IOCP input statements or HCD definitions
Use the CHPID Mapping Tool on Resource Link to help assign
PCHIDs to CHPIDs
If you have elected to do your own I/O cabling, complete the checkout
of system cables as much as possible. Verify that the cables are
properly routed, protective end caps are in place, that the processor
ends of the cables are safely out of the way for system installation,
and that cable safety procedures are followed
Complete the checkout of the power cables. Test for continuity and
polarity, proper grounding, correct phase wiring, and general power
safety considerations
Complete the required changes to the existing programs and data
processing units
Install communication facilities, such as telephone lines
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Target Date
Completed
Level 00f
Site Preparation Checklist
Task/Consideration
Task Assigned
( )
Target Date
Completed
CHECKPOINT 7
Are there any new applications that must be installed/ tested before the
new system arrives?
Do you need to conduct training with computer room personnel:
- Safety?
- Security?
- Operations?
- Other?
Are there any outstanding hardware changes that need to be made
to existing:
- Computer equipment?
- Communications equipment?
- Site facilities?
Is the system configuration ready for installation:
- IOCP input?
- CHPIDs?
Do you have a comprehensive channel cabling plan in place:
- Are all cables either ordered or on hand?
- Do you have a reliable installer ready to go?
- Are plans in place for cable connection at remote devices?
- Is there a system test plan?
- Are you prepared to provide cable labels or labeling information?
- Are protective end cap devices in place on all cable connectors?
- Are cables routed and coiled out of the way for installation?
Is the path for moving the new equipment:
- Wide enough?
- High enough?
- Free of obstructions?
- Ramps ready, if necessary?
Are floor panels ready?
Is all furniture and miscellaneous equipment in place or out of the
way for installation?
Is your setup team trained and ready for the arrival of the new equipment?
Complete the site preparation
ARRIVAL OF NEW EQUIPMENT
Move unit(s) to installation location.
Place the units according to machine clearance dimensions provided in
“Machine and service clearance areas” (in this document).
Unpack unit(s) according to instructions.
Call your service provider to install the unit(s).
Chapter 1. Introduction
5
Level 00f
Customized planning aid
A customized planning aid will be available for your system one day after receipt of your order in
manufacturing. You may obtain access to this aid by registering on Resource Link at
http://www.ibm.com/servers/resourcelink. This planning aid will include unique physical planning
requirements based on your system’s specific configuration.
It is important to note here that the planning aid is not intended to replace this manual. You should be
familiar with the contents of this document before you attempt to use the planning aid.
6
z13s IMPP
Level 00f
ASHRAE declaration
ASHRAE Declarations (Metric) for 2965
ASHRAE Class A3
Overall System
Dimensions
Max
Airflow
Airflow
Airflow
Typical
Minimum Nominal Maximum Weight
Heat
(2)
(1)
(1)
(1)
Release
(3)
Description
Typical
Configuration
Model N10, FC 1043
or
Model L10, FC 1056
(with 1 PCIe I/O drawer
and 1 I/O drawer) (7)
kW
m3/hr
m3/hr
m3/hr
kg
5.3
1470
1555
2532
1209
Maximum
Elevation
W X D X H (cm)
78.5
X 159.5 X 201.5
Maximum Maximum
Dry Bulb
Dew Point
Temperature
(4, 5, 6)
(4, 5)
m
C
3048
40
0
(6)
C
0
24
ASHRAE Declarations (English) for 2965
ASHRAE Class A3
Overall System
Dimensions
(3)
Maximum
Elevation
(4, 5, 6)
(4, 5)
kBTU/hr
W X D X H (in)
ft
F
Description
Typical
Configuration
Model N10, FC 1043
or
Model L10, FC 1056
(with 1 PCIe I/O drawer
and 1 I/O drawer) (7)
Maximum Maximum
Dry Bulb
Dew Point
Temperature
Max
Airflow
Airflow
Typical
Airflow
Minimum Nominal Maximum Weight
Heat
(2)
(1)
(1)
(1)
Release
18.1
cfm
865
cfm
cfm
lbs
915
1490
2665
30.9
X
62.8
X
79.3
10,000
0
104
(6)
F
0
75.2
z Systems
Airflow Diagram Cooling Scheme
Front to Rear
Fro
nt o
e
f th
ver
Ser
Notes:
1. Airflow is designed to increase as the local ambient room temperature increases. Minimum airflow
assumes an ambient temperature below 23o C (73o F). Nominal airflow assumes an ambient
temperature of 25o C (77o F). Maximum airflow is based on an ambient temperature of 40o C (104o F)
for all models.
2. Weights provided assumes the following:
v Optional integrated battery features are installed
v Optional tie-down kits (FC 8021 or FC 8022) is NOT installed
v Optional balanced power plan-ahead (FC 3003) is NOT installed.
3. Dimensions do not include top exit I/O (FC 7920)
4. For ambient temperatures exceeding 25o C (77o F), the acoustical noise levels of the system may
increase significantly as the speeds of the air moving devices increase. See Appendix C, “Acoustics,”
on page 123 for the declared acoustical noise emission levels for the system under nominal
temperature conditions of 23o C plus or minus 2o C (73.4o F plus or minus 3.6o F).
5. Maximum ambient reduces 1o C (1.8o F) for every 300 m (984 ft) over 900 m (2953 ft).
Chapter 1. Introduction
7
Level 00f
6. See the elevation label (
) or tropical climate label (
) in the Systems Safety Notices document to
determine if there are any elevation limitations or tropical climate limitations for your country.
7. I/O drawers can only be carried forward with z13s models. I/O drawers are not available with
Rockhopper models.
8
z13s IMPP
Level 00f
Chapter 2. Environmental specifications
The z13s or Rockhopper family of IBM servers is among the most powerful group of mainframe
processors ever built. Technology improvements have placed these servers in the top levels of Reliability,
Availability, and Serviceability. But it takes more than premium computer equipment to achieve these
goals. The data center environment must be able to support the demands that z13s or Rockhopper
capability requires. On the following pages, environmental specifications are presented in tabular and
graphic forms to emphasize how important it is that you provide the conditions necessary to utilize all of
the power the z13s or Rockhopper family offers.
The z13s or Rockhopper operates in an ASHRAE Class 3 environment.
Environmental specifications are presented in two categories: Required and Recommended. Obviously,
meeting the required specifications is prerequisite to using the z13s or Rockhopper. IBM strongly suggests
you strive for more than the minimum requirements. The powerful computing z13s or Rockhopper
provides generates a great deal of heat. That heat must be removed from the equipment to keep it
operating at peak efficiency. That’s where operating your data center with the goal of reaching
recommended specifications instead of just the required numbers will pay off for you.
Unless otherwise noted on individual specification pages, the following environmental specifications,
based on an altitude from sea level to 900 meters (2953 feet), apply:
© Copyright IBM Corp. 2016, 2017
9
Level 00f
Table 2. Environmental specifications
Environment, Operating: 1, 5
High ambient temperature
Long-term recommended
27°C (80.6°F) 4
Maximum ambient allowed
40°C (104°F) 4
Low ambient temperature
Long-term recommended
18° (64.4°F)
Minimum ambient allowed
5°C (41°F)
Low end humidity
Long-term recommended
5.5°C (41°F) dew point
Minimum relative humidity allowed
8% relative humidity and -12°C (10.4°F)
dew point
High end humidity
Long-term recommended
60% relative humidity and 15°C (59°F)
dew point
Maximum relative humidity allowed
85% relative humidity and 24°C (72.5°F)
dew point
Gaseous contamination
Class G1 as per ANSI/ISA S71.04–1985
Particulate contamination
1. Room air must be filtered continuously using appropriate filters.
2
2. The deliquescent relative humidity of the particulate contamination shall be
more than 80% 3
Environment, Nonoperating:
Temperature
5°C (41°F) to 45°C (113°F)
Relative humidity
8% - 85%
Maximum dew point
Less than 27°C (80.6°F)
Gaseous contamination
Class G1 as per ANSI/ISA S71.04–1985
5
2
Environment, shipping:
Temperature
-40°C (-40°F) to 60°C (140°F)
Relative humidity
5% - 100% (no condensation)
Wet bulb
Less than 29°C (84.2°F)
Shipping package
IBM-approved vapor barrier bag with desiccant
Environment, storage:
Temperature
1°C (33.8°F) to 60°C (140°F)
Relative humidity
5% -80% (no condensation)
Wet bulb
Less than 29°C (84.2°F)
Shipping package
IBM-approved vapor barrier bag with desiccant
Notes:
1. Maximum ambient temperature reduces 1oC (1.8 oF) for every 300 m (984 ft) over 900 m (2953 ft).
2. ANSI/ISA-S71.04. 1985. “Environmental conditions for process measurement and control systems: Airborne
contaminants.” Instrument Society of America, Research Triangle Park, NC, 1985.
3. The deliquescent relative humidity of particulate contamination is the relative humidity at which dust absorbs
enough water to become wet and promote ionic conduction.
4. For ambient temperatures exceeding 25oC (77oF), the acoustical noise levels of the system may increase
significantly as the speeds of the air moving devices increase. See Appendix C, “Acoustics,” on page 123 for the
declared acoustical noise emission levels for the system under nominal temperature conditions of 23oC plus or
minus 2oC (73.4oF plus or minus 3.6oF).
5. The machine should be in an environment that satisfies the operating environment specifications for at least one
day before it is powered on.
10
z13s IMPP
Level 00f
The following illustrations reiterate the environmental specifications in graphic form.
Psychrometric chart
?
?
?
?
?
SI (metric) units
Barometric pressure 101.325 kPa (sea level)
Curved lines represent % of relative humidity (RH)
Vertical lines represent dry bulb temperature in degrees Celsius ©
Points of saturation line (100% RH) represent dew point temperature in degrees Celsius (C)
relative humidity
28.4
25.0
80%
60%
40%
26.6
22.5
24.7
20.0
24.0
class A3
allowable guidelines
22.6
17.5
15.0
20.1
20%
17.3
12.5
15.0
13.8
10.0
recommended
guidelines
9.5
7.5
5.5
3.7
moisture content, g/kg dry air
dew point temperature ( C)
5.0
2.5
-12.0
0
0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
dry bulb temperature ( C)
Chapter 2. Environmental specifications
11
Level 00f
Meets the ASHRAE recommended guidelines
Meets the ASHRAE allowable guidelines
Exceeds the ASHRAE environmental limits
Data center temperature in degrees Celsius (C)
Data center % Relative Humidity
8% minimum, 85% maximum
5
6
7
8
5 0 C minimum, 400 C maximum
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
It is very important the environmental specifications be met immediately in front of the frame of the
z13s or Rockhopper server. Ideally, it would be best if the temperature and humidity controls are good
enough to surround the service area of the z13s or Rockhopper. If you are able to exceed the required
conditions, focus your efforts to provide the best quality air at the bottom front of the server.
12
z13s IMPP
Level 00f
System acclimation
Server and storage equipment 1 should be gradually acclimated to the surrounding environment before
being powered on.
When server and storage equipment is shipped in a climate where the outside temperature is below the
dew point of the destination indoor location, condensation and frost will naturally form on the cooler
inside and outside surfaces of the equipment when brought indoors. All IBM products are tested and
verified to withstand these phenomena produced under these circumstances. As long as sufficient time is
provided to allow the hardware to gradually acclimate to the indoor environment before attaching it to
electrical power, there should be no issues with long term reliability of the product.
If the machine has been shipped in climate controlled transportation, the temperature within the internal
drawers (such as the CPC and I/O drawers) is verified to be above the dew point of the destination
staging area or computer room, and the system has been verified to be completely dry, then the system
can be attached to power and operated immediately.
If the system has been exposed to cold conditions (such as in an aircraft), shipped in non-climate
controlled transportation, or if the shipping condition is unknown, it is then beneficial to allow the
shipped equipment to gradually reach thermal and moisture equilibrium with the indoor environment
before attaching to power by following the steps below:
v If the install / staging area environment allows it, leave the product in the full package, or at least the
shipping bag, to minimize condensation directly on or within the equipment.
v Acclimate the product away from perforated tiles or other direct sources of forced air convection to
minimize excessive condensation on or within the equipment.
v Allow the product to acclimate for the periods recommended in the table below 2. If there are visible
signs of moisture outside or inside the system after the recommended acclimation time, then continue
to acclimate the system without the shipping bag for an additional 12 hours before repeating
condensation verification.
Notes:
1. Racks and frames.
2. Unless otherwise stated by product specific install instructions.
Table 3. System acclimation
Acclimation time (hours)
Thermal condition
of machine that
arrived at the
customer site
First with
shipping bag
ON
Then with
shipping bag
OFF
Total
extremely cold
less than -20oC/-4oF
recommended
24
6
30
A1/A1
30
12
42
very cold
less than 0oC/32oF
recommended
18
6
24
A1/A2
30
12
42
less than computer room
dew point
recommended
12
6
18
A1/A2
24
12
36
greater than computer room
dew point
recommended
6
6
12
A1/A2
6
12
18
unknown/default
unknown
24
12
36
Thermal condition of
machine that arrived at the
customer site
Chapter 2. Environmental specifications
13
Level 00f
Conductive contamination
Semiconductors and sensitive electronics used in current Information Technology equipment have
allowed for the manufacture of very high density electronic circuitry. While new technology allows for
significant increases or capacity in a smaller physical space, it is susceptible to contamination, especially
contamination particles that will conduct electricity. Since the early 1990s, it has been determined that
data center environments may contain sources of conductive contamination. Contaminants include;
carbon fibers, metallic debris such as aluminum, copper and steel filings from construction, and zinc
whiskers from zinc-electroplated materials used in raised floor structures.
Although very small, and at times not easily seen without the visual aide of magnifying lenses, this type
of contamination can have disastrous impact on equipment availability and reliability. Errors, component
damage and equipment outages caused by conductive contamination can be difficult to diagnose. Failures
may be at first attributed to other more common factors such as lightning events or electrical power
quality or even just presumed to be defective parts.
The most common conductive contamination in raised-floor data centers is what is known as zinc
whiskers. It is the most common because it is frequently found on the underside of certain types of access
floor tiles. Typically, the wood core style floor tile has a flat steel bottom. The steel may be coated with
zinc either by a hot dip galvanize process or by zinc electroplate. The zinc electroplate steel exhibits a
phenomena which appears as whisker-like growths on the surface. These small particles of approximately
1-2 mm (.04-.08 in.) in length, can break away from the surface and get pulled into the cooling air stream.
Eventually they my be ingested by the equipment air, settle on a circuit board and create a problem. If
you suspect that you may have this type of problem, contact your IBM Service representative.
Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or temperature might pose a risk to the
z13s or Rockhopper that is described in this document. Risks that are posed by the presence of excessive
particulate levels or concentrations of harmful gases include damage that might cause the z13s or
Rockhopper to malfunction or cease functioning altogether. This specification sets forth limits for
particulates and gases that are intended to avoid such damage. The limits must not be viewed or used as
definitive limits because numerous other factors, such as temperature or moisture content of the air, can
influence the impact of particulates or environmental corrosives and gaseous contaminant transfer. In the
absence of specific limits that are set forth in this document, you must implement practices that maintain
particulate or gas levels that are consistent with the protection of human health and safety. If IBM
determines that the levels of particulates or gases in your environment have caused damage to the z13s
or Rockhopper IBM may condition provision of repair or replacement of z13s or Rockhopper or parts on
implementation of appropriate remedial measures to mitigate such environmental contamination.
Implementation of such remedial measures is a customer responsibility.
Table 4. Contaminant descriptions
Contaminant
Description
Gaseous contamination
Severity level G1 as per ANSI/ISA 71.04-19851 which states that the reactivity rate
of copper coupons shall be less than 300 Angstroms per month (Å/month, ≈ 0.0039
µg/cm2-hour weight gain).2 In addition, the reactivity rate of silver coupons shall
be less than 300 Å/month (≈ 0.0035 µg/cm2-hour weight gain).3 The reactive
monitoring of gaseous corrosivity should be conducted approximately 2 inches (5
cm) in front of the rack on the air inlet side at one-quarter and three-quarter frame
height off the floor or where the air velocity is much higher.
14
z13s IMPP
Level 00f
Table 4. Contaminant descriptions (continued)
Contaminant
Description
Particulate contamination
Data centers must meet the cleanliness level of ISO 14644-1 class 8. For data
centers without airside economizer, the ISO 14644-1 class 8 cleanliness may be met
simply by the choice of the following filtration:
v The room air may be continuously filtered with MERV 8 filters. Air entering a
data center may be filtered with MERV 11 or preferably MERV 13 filters.
v For data centers with airside economizers, the choice of filters to achieve ISO
class 8 cleanliness depends on the specific conditions present at that data center.
The deliquescent relative humidity of the particulate contamination should be
more than 60% RH.4
Data centers must be free of zinc whiskers.5
Notes:
1. ANSI/ISA-71.04.1985. “Environmental conditions for process measurement and control systems:
Airborne contaminants.” Instrument Society of America, Research Triangle Park, NC, 1985.
2. The derivation of the equivalence between the rate of copper corrosion product thickness growth in
Å/month and the rate of weight gain assumes that Cu2S and Cu2O grow in equal proportions.
3. The derivation of the equivalence between the rate of silver corrosion product thickness growth in
Å/month and the rate of weight gain assumes that Ag2S is the only corrosion product.
4. The deliquescent relative humidity of particulate contamination is the relative humidity at which the
dust absorbs enough water to become wet and promote corrosion and/or ion migration.
5. Surface debris is randomly collected from 10 areas of the data center on a 1.5-cm diameter disk of
sticky electrically conductive tape on a metal stub. If examination of the sticky tape in a scanning
electron microscope reveals no zinc whiskers, the data center is considered free of zinc whiskers.
6. If there is any question about potential corrosive gases or level of particulates, contact your IBM
representative for assistance in monitoring the environment.
Beyond the specific information provided in this document, IBM recommends that the customer's facility
meet the general guidelines published in the American Society of Heating, Refrigeration, and Air Conditioning
Engineers (ASHRAE) Handbook.
Chapter 2. Environmental specifications
15
Level 00f
16
z13s IMPP
Level 00f
Chapter 3. Models and physical specifications
z13s
LinuxONE
z Systems
This chapter provides the following detailed information for the z13s or Rockhopper.
v Model and frame descriptions
v Shipping specifications
v Plan view and specifications
v Weight distribution data and service clearances information
Rockhopper
Facts about the z13s or Rockhopper:
v The z13s or Rockhopper is always a one-frame system
v In areas that might be prone to seismic events, IBM offers FC 8021 and FC 8022, which provide
tie-down hardware. FC 8021 provides tie-down hardware to cover raised floor heights from 152.4 mm
(6 inches) to 914.4 mm (36 inches). FC 8022 provides tie-down hardware for nonraised floors. See
Appendix F, “Frame tie-down,” on page 129 for more information.
v There are separate shipping containers for the covers for the frame
v For z13s or Rockhopper, both bottom exit I/O cabling feature and top exit I/O cabling feature are
supported. The top exit I/O cabling feature (FC 7920) consists of two cable towers installed on the left
side of the frame.
v For z13s or Rockhopper, both bottom exit power cords and top exit power cords are supported.
v z13s or Rockhopper may be installed on a raised floor or a nonraised floor.
© Copyright IBM Corp. 2016, 2017
17
Level 00f
– Raised floor installation
Installation on a raised floor is recommended but not mandatory. Refer to your national electric
code if you have questions about routing data processing cables in exposed areas.
If z13s or Rockhopper is installed on a raised floor, the following I/O cabling and power cabling
combinations are supported:
- Bottom I/O and bottom power
- Top I/O and top power
- Top I/O and bottom power
- Bottom I/O and top power
– Nonraised floor installation
In a nonraised floor environment, where cables are exposed, refer to local and national electric and
safety codes for more information.
If z13s or Rockhopper is installed on a nonraised floor, only top I/O cabling and top power cabling
are supported.
v If you are planning an installation on a raised floor in Canada, the installation must be in accordance
with Section 12-020 of the CEC. In any country, refer to your national electric code if you have
questions about routing data processing cables in exposed areas.
18
z13s IMPP
Level 00f
Physical dimensions
Table 5. A frame dimensions
Frame-cover combination
Width mm (in)
Depth mm (in)
Height mm (in)
Frame A w/o covers
750 (29.5)
1273 (50.1)
2015 (79.3)
Frame A w/covers
785 (30.9)
1595 (62.8)
2015 (79.3)
Frame A w/covers and top exit I/O
towers
937 (36.9)
1595 (62.8)
2030 (79.9)
1
Note:
1. If the optional cable management brackets are used, the overall system height will increase to 2155 mm (84.8 in).
See “Top exit I/O cabling” on page 83 for details.
Chapter 3. Models and physical specifications
19
Level 00f
Shipping specifications
z13s or Rockhopper servers are shipped two ways:
v Packaged systems are protected with an antistatic poly bag and heavy cardboard and roll on their own
casters. This packaging is used only in the 48 contiguous United States.
v Crated systems are protected with wooden shipping boxes and are mounted on pallets requiring
commercial lift transportation. This packaging is used for all servers shipped anywhere except the 48
contiguous United States.
Height reduction (FC 9975)
If you have doorways with openings less than 2032 mm (80.0 in) high, you should order FC 9975. This
feature reduces the frame height to 1809 mm (71.2 in). The top portion of the frames are shipped in a
separate carton, as are the frame side covers.
Internal battery (FC 3215)
If you ordered FC 3215, the internal batteries are shipped uninstalled.
Packaging specifications
Table 6. A frame packaging specifications
Packaged frame
Packaged frame A
Crated frame
Crated frame A
Width mm (in)
Depth mm (in)
Height mm (in)
Max Weight kg (lb)
825.5 (32.5)
1,448.0 (57.0)
2045.0 (80.5)
1134 (2499)
Width mm (in)
Depth mm (in)
Height mm (in)
Max Weight kg (lb)
939.8 (37.0)
1,613.0 (63.5)
2299.0 (90.5)
1442 (3134)
Width mm (in)
Depth mm (in)
Height mm (in)
Weight kg (lb)
1,067.0 (42.0)
2,172.0 (85.5)
1,168.0 (46.0)
32.7 (72.0)
Width mm (in)
Depth mm (in)
Height mm (in)
Weight kg (lb)
762.0 (30.0)
2,184.0 (86.0)
431.8 (17.0)
86.2 (190.0)
Table 7. Cover set packaging specifications
Cover set
Frame A
Table 8. Top exit I/O towers packaging specifications
Top exit I/O towers
Frame A
Important:
z13s or Rockhopper is comprised of some of the most sophisticated and complex electronic equipment ever
integrated into one computer. As such, this hardware needs to be protected from negative environmental impacts
to ensure the utmost reliability. One of the key factors affecting this reliability is moving the system from the
loading dock into the controlled environment of your computer room on the day it is delivered.
To ensure that optimum environmental conditions are maintained, work with your marketing representative to
schedule the delivery at a time when you can transport the system components from the point of delivery to the
computer room destination without unnecessary delay. Prompt handling upon arrival will prevent any possibility
of a problem caused by exposure to temperature extremes, severe weather, or high humidity.
20
z13s IMPP
Level 00f
z13s or Rockhopper models
There are two models of the z13s: N10 and N20. There are two models of the Rockhopper: L10 and L20.
These models contain user-definable Processor Units (PUs), System Assist Processors (SAPs), and spare
PUs (used to provide uninterrupted computing if there should be a problem with a working PU).
The following table lists the feature codes for each model. You will use the feature codes to place your
z13s or Rockhopper order.
Table 9. Processor descriptions.
Feature code
Description
1043/1056
Model N10/Model L10, 1 processor drawer
1044/1057
Model N20/Model L20, 1 processor drawer
1045
Model N20/Model L20, 2 processor drawers
The server models are shown in the following illustration with InfiniBand copper and InfiniBand optical
ports installed. The actual number of ports for any model is dependent on total system configuration as
ordered. Model specifications are described in Table 10 on page 23.
Notes:
1. InfiniBand copper cables are used only to connect the I/O drawers to the processor.
I/O drawers can only be carried forward with z13s models. I/O drawers are not available in
Rockhopper models.
2. PCIe copper cables are used to connect PCIe I/O drawers to the processor.
PCIe I/O drawers are available with z13s and Rockhopper models.
Chapter 3. Models and physical specifications
21
Level 00f
LG07
LG02 LG03 LG04 LG05 LG06
J01
J01
J01
J01
J01
J01
J01
J01
LG09
LG08
LG10
J01
J01
J01
J02
J02
J01
J02
J03
J03
J02
J03
J04
J04
J04
J01
J01
J01
J02
J02
J01
J02
J03
J03
J02
J03
J04
J04
J01
LG11
J01
J01
J01
LG12 LG13 LG14 LG15
J01
J01
J01
J01
J01
J01
A21A
processor drawer 0
(installed 1st)
J01
A25A
processor drawer 1
(installed 2nd)
J01
J04
Optical fanouts
Copper fanouts
RX
J1
JR2
J2
JT2
TX
RX
J3
JR1
J4
JT1
PCIe
22
z13s IMPP
HCA2-C
ICA SR
HCA3-O LR
TX
HCA3-O
Level 00f
Table 10. Model feature codes and options.
Feature code
Description
FC 1043
(Model N10)
v
v
v
v
v
v
v
v
v
1 CPC drawer
0-6 CPs 1
0-10 IFLs
0-10 uIFLs
0-8 zIIPs 2
0-10 ICFs 2
1 IFP
2 - base SAPs, 0-2 optional SAPs
0 - spares
v 0 - 8 InfiniBand HCA3-O LR 1x
InfiniBand links 2
v
v
v
v
v
v
v
v
v
v
1 CPC drawer
0-6 CPs 1
0-20 IFLs
0-20 unassigned IFLs
0-12 zIIPs 2
0-20 ICFs 2
1 IFP
3 - base SAPs
0-3 optional SAPs
2 - spares
v 0 - 16 InfiniBand HCA3-O LR 1x
InfiniBand links 2
v
v
v
v
v
v
v
v
v
v
2 CPC drawers
0-6 CPs 1
0-20 IFLs
0-20 unassigned IFLs
0-12 zIIPs 2
0-20 ICFs 2
1 IFP
3 - base SAPs
0-3 optional SAPs
2 - spares
v 0 - 32 InfiniBand HCA3-O LR 1x
InfiniBand links 2
FC 1056
(Model L10)
FC 1044
(Model N20)
FC 1057
(Model L20)
FC 1045
(Model N20/L20)
FC 3215
CPC I/O links
v 0 - 4 InfiniBand HCA3-O 12x InfiniBand
links 2
v 0 - 8 ICA SR links
v 0 - 8 InfiniBand HCA3-O 12x InfiniBand
links 2
v 0 - 16 ICA SR links
v 0 - 16 InfiniBand HCA3-O 12x InfiniBand
links 2
v 0 - 16 ICA SR links
v Internal Battery Feature
Notes:
1. For Rockhopper models, 0 or 1 CP only for GDPS®.
2. For z13s models only.
3. Terminology:
v CP - Central Processor
v SAP - System Assist Processor
v IFL - Integrated Facilities for Linux
v ICF - Integrated Coupling Facility
v zIIP - System z® Integrated Information Processor
v IFP - Integrated Firmware Processor
Chapter 3. Models and physical specifications
23
Level 00f
Additionally, as shown below:
v Internal batteries (for emergency backup power) are placed in the EIA location 39.
v The system processor is located in the Central Processor Complex (CPC) drawer(s).
v The system power supply is contained in the top of the frame, below the battery positions.
v Input/Output features are installed in I/O drawers and PCIe I/O drawer. These I/O drawers and PCIe
I/O drawers are placed below the processor drawer.
I/O drawers can only be carried forward with z13s models. I/O drawers are not available in
Rockhopper models.
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
09
08
07
06
05
04
03
02
01
J1
J1
Pb
BATTERY ENBLD
(CB Must be on)
z13s IMPP
(CB Must be on)
J01 and J02
J01 and J02
DCA Logic Blwr
PWR PWR Good
DCA Logic Blwr
PWR PWR Good
LG02
J03
J03
J01 and J02
J01 and J02
DCA Logic Blwr
PWR PWR Good
DCA Logic Blwr
PWR PWR Good
LG02
J03
J03
A frame - front view
24
Pb
BATTERY ENBLD
A frame - rear view
Level 00f
PCIe I/O drawers
z13s and Rockhopper support PCIe I/O drawers.
v PCIe I/O drawer - 7 EIA units tall - provides 32 adapters, with two ports per adapter.
LG10
J01 J02
PCIe I/O drawer front view
LG29
J01 J02
PCIe I/O drawer rear view
Chapter 3. Models and physical specifications
25
Level 00f
I/O drawers
The z13s supports I/O drawers.
v I/O drawer - 5 EIA units tall - provides 8 adapters, with up to four ports per adapter.
J01
LG01
LG01
J02
I/O drawer front view
LG06
LG05
D109
D209
I/O drawer rear view
You can have a maximum of 16 legacy I/O cards in a z13s.
26
z13s IMPP
Level 00f
System upgrades
The following upgrades are supported:
v Any 2818 (zEnterprise® 114) model or 2828 (zEnterprise BC12) model to any z13s model
v Rockhopper model to Rockhopper or z13s model upgrades:
– L10 --> L20
– L10 --> N10, N20
– L20 --> N20
v The following upgrades are not supported:
– Any z13s model to any Rockhopper model
An upgrade includes all frames, drawers, support cards, and new I/O features.
Chapter 3. Models and physical specifications
27
Level 00f
Differences between IBM servers
Comparison information is provided here for those who may be placing a z13s or Rockhopper on a
raised floor with another IBM single-frame servers.
Table 11. Differences between single-frame System z servers
System Family
Width (with covers)
Depth (with covers)
Height (with covers
Weight (Maximum)2
zSeries 800 (2066)
720 mm (28.3 in)
1148 mm (45.1 in)
1810 mm (71.3 in)
545 kg (1201 lbs)
zSeries 890 (2086)
785 mm (30.9 in)
1577 mm (62.1 in)
1941 mm (76.4 in)
785 kg (1730 lbs)
®
785 mm (30.9 in)
1577 mm (62.1 in)
1941 mm (76.4 in)
785 kg (1730 lbs)
™
z10 BC (2098)
785 mm (30.9 in)
1806 mm (71.1 in)
2027 mm (79.8 in)
953 kg (2100 lbs)
z114 (2818)
785 mm (30.9 in)
1574 mm (62.0 in)
2027 mm (79.8 in)
953 kg (2168 lbs)
1
z9 BC (2096)
z114 (2818 with I/O
towers)
937 mm (36.9 in)
1574 mm (62.0 in)
2144 mm (84.4 in)
1027 kg (2263 lbs)
zBC12 (2828)
785 mm (30.9 in)
1595 (62.8)
2015 mm (79.3 in)
1036 kg (2282 lbs)
1
zBC12 (2828 with
I/O towers)
937 mm (36.9 in)
1595 (62.8)
2154 mm (84.8 in)
1079 kg (2377 lbs)
z13s or Rockhopper
(2965)
785 mm (30.9 in)
1595 (62.8)
2015 mm (79.3 in)
1209 kg (2665 lbs)
z13s or Rockhopper
(2965 with I/O
towers)
937 mm (36.9 in)
1595 (62.8)
2154 mm (84.8 in)1
1245 kg (2743 lbs)
Notes:
1. This height includes the cable management bracket.
2. This weight does not include the weight (54.43 kg (120 lb)) for the tie-down feature (FC 8021 or FC 8022).
All of these servers always consist of one frame.
If you are replacing an existing IBM server, refer carefully to the IBM z13s Installation Manual for Physical
Planning (available on the Resource Link at http://www.ibm.com/servers/resourcelink) to determine actual
differences between your installed IBM server and the z13s. Plan views, physical dimensions, service
clearances, aisle spacing, and power and cooling requirements may be substantially different.
28
z13s IMPP
Level 00f
Plan view
The plan view on the left shows the additional width required for top exit I/O cabling towers (FC 7920).
152 mm
(6.0 in)
160 mm
(6.29 in)
254 mm
(10.0 in)
+
+
765 mm
(30.1 in)
254 mm
(10.0 in)
+
+
1273 mm
(50.1 in)
A
+
+
1595 mm
(62.76 in)
A
+
+
Note: Door gaskets
are approximately
6.35 mm (.25 in) each
162 mm
(6.37 in)
937 mm
(36.9 in)
Frame
Entry/Exit
Front
Rear
Note: Door gaskets
are approximately
6.35 mm (.25 in) each
785 mm
(30.9 in)
Cutout dimension
for raised floor
(mm)
(in)
94 x 655
94 x 655
3.7 x 25.8
3.7 x 25.8
Chapter 3. Models and physical specifications
29
Level 00f
For installations planning to use top exit power cords, the frame openings for these cords are on the top
of the left front and right rear corners of the frame.
z Systems
top exit for
power cords
top exit I/O
cable towers
Front
30
z13s IMPP
Level 00f
Weight distribution
The following table shows weights and dimensions used to calculate floor loading for the z13s or
Rockhopper. All floor loading calculations are intended for a raised floor environment.
Table 12. Floor loading information - Model N10 (FC 1043) or Model L10 (FC 1056) - 1 processor drawer
Maximum
A frame
Model N10 (FC 1043)
Model L10 (FC 1056)
Weight
920 kg (2028 lbs)
Width
785 mm (30.9 in)
Depth
1273 mm (50.1 in)
Table 13. Floor loading information - Model N20 (FC 1044) or Model L20 (FC 1057) - 1 processor drawer
Maximum
A frame
Model N20 (FC 1044)
Model L20 (FC 1057)
Weight
1035 kg (2281 lbs)
Width
785 mm (30.9 in)
Depth
1273 mm (50.1 in)
Table 14. Floor loading information - Model N20 or Model L20 (FC 1045) - 2 processor drawers
Maximum
A frame
Model N20
Model L20
(FC 1045)
Weight
1114 kg (2455 lbs)
Width
785 mm (30.9 in)
Depth
1273 mm (50.1 in)
Notes:
1. Weight includes covers. The weight does not include the weight (54.43 kg (120 lbs)) for the tie-down
feature (FC 8021 or FC 8022). Width and depth are indicated without covers.
2. Internal battery (FC 3215) adds approximately 85.3 kg (188 lbs).
3. The optional top exit I/O cabling towers add approximately 36.29 kg (78 lbs) to the server weight,
152.4 mm (6 in) to the width, and 140 mm (5.5 in) to the height.
4. Balanced power (FC 3003) adds approximately 51 kg (112 lbs).
5. The front cover adds 162 mm (6.37 in) and the rear cover adds 160 mm (6.29 in) to the depth.
Chapter 3. Models and physical specifications
31
Level 00f
The following figure and table show sample floor loading values for the z13s or Rockhopper server with
and without the Internal Battery Feature (3215).
Rear
c
a, b, c
Weight Distribution
a
a
b
Front
For the floor loading specifications in the following two tables, the numbers given are for a z13s Model
N20 or Rockhopper Model L20 (two processor drawers, FC 1045) and two PCIe I/O drawers.
The weight of this server is 1114 kg (2455 lbs). The weight does not include the weight for the tie-down
feature (FC 8021 or FC 8022) (54.43 kg (120 lbs)), the weight of the top exit I/O towers (36.29 kg (78 lbs)),
or the weight of the balanced power (FC 3003) (51 kg (112 lbs)).
Table 15. Floor loading for servers without internal battery (FC 3215)
Example #
“a” (sides) mm (in)
“b” (front) mm (in)
“c” (rear) mm (in)
Floor load kg/m2
(lbs/ft2)
1
25.4 (1.0)
254 (10.0)
254 (10.0)
823.0 (168.57)
2
25.4 (1.0)
508 (20.0)
508 (20.0)
668.1 (136.84)
3
25.4 (1.0)
762 (30.0)
762 (30.0)
569.5 (116.64)
4
254 (10.0)
254 (10.0)
254 (10.0)
576.2 (118.02)
5
254 (10.0)
508 (20.0)
508 (20.0)
476.1 (97.51)
6
254 (10.0)
762 (30.0)
762 (30.0)
412.3 (84.45)
7
508 (20.0)
254 (10.0)
254 (10.0)
448.9 (91.95)
8
508 (20.0)
508 (20.0)
508 (20.0)
377.0 (77.22)
9
508 (20.0)
762 (30.0)
762 (30.0)
331.3 (67.85)
10
762 (30.0)
254 (10.0)
254 (10.0)
377.7 (77.35)
11
762 (30.0)
508 (20.0)
508 (20.0)
321.6 (65.87)
12
762 (30.0)
762 (30.0)
762 (30.0)
285.9 (58.55)
32
z13s IMPP
Level 00f
The weight of this server is 1200 kg (2646 lbs). The weight does not include the weight for the tie-down
feature (FC 8021 or FC 8022) (54.43 kg (120 lbs)), the weight of the top exit I/O towers (36.29 kg (78 lbs)),
or the weight of the balanced power (FC 3003) (51 kg (112 lbs)).
Table 16. Floor loading for servers with internal battery (FC 3215)
Example #
“a”' (sides) mm (in)
“b” (front) mm (in)
“c” (rear) mm (in)
Floor load kg/m2
(lbs/ft2)
1
25 (1.0)
254 (10.0)
254 (10.0)
880.8 (180.40)
2
25 (1.0)
508 (20.0)
508 (20.0)
713.1 (145.05)
3
25 (1.0)
762 (30.0)
762 (30.0)
606.3 (124.17)
4
254 (10.0)
254 (10.0)
254 (10.0)
613.6 (125.67)
5
254 (10.0)
508 (20.0)
508 (20.0)
505.1 (103.46)
6
254 (10.0)
762 (30.0)
762 (30.0)
436.1 (89.32)
7
508 (20.0)
254 (10.0)
254 (10.0)
475.7 (97.44)
8
508 (20.0)
508 (20.0)
508 (20.0)
397.9 (81.50)
9
508 (20.0)
762 (30.0)
762 (30.0)
348.3 (71.35)
10
762 (30.0)
254 (10.0)
254 (10.0)
398.6 (81.64)
11
762 (30.0)
508 (20.0)
508 (20.0)
337.9 (69.20)
12
762 (30.0)
762 (30.0)
762 (30.0)
299.2 (61.28)
All measurements are taken from the outside edge of the machine frame, without covers, unless
specifically described otherwise.
Minimum weight distribution is shown in the shaded area of Figure 1 on page 36.
v “a” = side dimension
v “b” = front dimension
v “c” = rear dimension
Chapter 3. Models and physical specifications
33
Level 00f
System weight examples
Following is a table that provides weight estimates for minimum, typical, and maximum configurations
on all models of the z13s or Rockhopper . The Power Estimator tool has been modified to include weight
data and now has the capability to provide a more accurate weight for your particular configuration. See
“Power estimation tool” on page 59.
Table 17. Weights for minimum, typical, and maximum server configurations
Model
Minimum
weight
lbs (kg)
Typical
weight
lbs (kg)
Maximum
weight
lbs (kg)
Top exit I/O
weight
lbs (kg)
Battery
weight
lbs (kg)
Balanced
power
lbs (kg)
Earthquake
feature
lbs (kg)
N10
or
L10
1535 (696.3)
1955 (886.8)
2060 (934.4)
78 (35.4)
188 (85.3)
55 (25.0)
120 (54.4)
N20
or
L20
1544 (700.3)
2088 (947.1)
2452 (1112)
78 (35.4)
188 (85.3)
0
120 (54.4)
N20 (2)
or
L20 (2)
1784 (809.2)
2115 (959.3)
2484 (1127)
78 (35.4)
188 (85.3)
0
120 (54.4)
Note:
1. All weights include all covers.
2. Minimum weights include no listed features and no I/O.
3. Maximum weight includes:
v For N10, one fully populated PCIe I/O drawer and one fully populated I/O drawer.
v For N20, two fully populated PCIe I/O drawers and one fully populated I/O drawer.
v For N20 (2), two fully populated PCIe I/O drawers.
I/O drawers can only be carried forward with z13s models. I/O drawers are not available in Rockhopper
models.
4. Typical weights contain I/O considered typical in a balanced system for the respective model.
5. The additional weight for features are valid for the maximum system power of each configuration.
6. Actual weight will vary and can only be determined by an exact specification of content.
34
z13s IMPP
Level 00f
Weight distribution and multiple systems
Under typical conditions, service clearances of adjacent products may be overlapped but weight
distribution areas should not be overlapped. If weight distribution clearances are overlapped, the
customer should obtain the services of a qualified consultant or structural engineer to determine floor
loading. Regardless of floor loading, minimum service and aisle clearances must be observed:
v Rear dimension “d” is 991 mm (39 in).
v Front dimension “e” is 1168 mm (46 in).
v Both “d” and “e” are measured from the frame edge (without covers) to the nearest obstacle.
v Cover opening dimensions are also shown.
Note that aisle clearances are not the same between rows of front-facing and rear-facing covers.
Front-facing rows require 1168 mm (46 in) of clearance while rear-facing rows need a minimum of 991
mm (39 in).
For physical planning purposes, you must verify system placement considering:
v Weight distribution
v Power availability
v Power access
v Machine and service clearance area
v Air conditioning delivery
v Chilled water delivery
v Thermal interaction
v Cable locations
v Floor tile cutouts.
Chapter 3. Models and physical specifications
35
Level 00f
Rear of Servers
Front of Servers
162 mm (6.37 in)
Aisle Width
(1168 mm 46 in)
e
c
Front of Servers
Rear of Servers
b
d
Aisle Width
(991 mm 39 in)
160 mm (6.29 in)
Rear of Servers
Front of Servers
Aisle Width
(1143 mm 45 in)
Wall
= Load Shedding Area
Figure 1. Aisle and service clearances
36
z13s IMPP
= Service Clearance Area
Level 00f
Machine and service clearance areas
Machine area is the actual floor space covered by the system. Service clearance area includes the machine
area, plus additional space required to open the doors and keyboard/display gate for service access to
the system.
Table 18. Machine area and service clearance area
Number
of
frames
Machine area M2 (ft2)
Service clearance area M2 (ft2)
1 (A)
1.26 (13.47) without I/O towers
front service clearance = 1.94 (20.86)
machine area without doors and without I/O towers = 0.99 (10.75)
rear service clearance = 0.94 (10.08)
1 (A)
1.50 (16.09) with I/O towers
front service clearance = 1.94 (20.86)
machine area without doors and with I/O towers = 1.19 (12.84)
rear service clearance = 0.94 (10.08)
Notes:
1. Machine area includes installed covers.
2. Service clearance area must be free of all obstacles. Units must be placed in a way that all service areas are
accessible. The weight distribution clearance area extending beyond the service clearance area, such as the area
at the outside corners of the units, may contain support walls and columns.
3. The I/O top exit towers, FC 7920, are optional. Service clearance is not shown for these towers.
g
160 mm (6.29 in)
d = front depth = 1168 mm (46 in)
e
e = rear depth = 991 mm (39 in)
g = rear side to side = 945 mm (37.19 in) = (160 mm (6.29 in) + 785 mm (30.9 in))
h = front side to side = 1252 mm (49.27 in) = (162 mm (6.37 in) + 785 mm (30.9 in) + 712 mm (28 in))
785 mm
(30.9 in)
1273 mm
(50.1 in)
service clearance area
712 mm (28.0 in)
d
162 mm (6.37 in)
h
front
The front and rear doors access all of the serviceable area in the z13s or Rockhopper. The system requires
specific service clearances to ensure the fastest possible repair in the unlikely event that a part may need
to be replaced. Failure to provide enough clearance to open the front and rear covers will result in
extended service time.
Chapter 3. Models and physical specifications
37
Level 00f
The following describes some service clearance conditions that must be followed. (See Figure 2.)
v The left side cover of the A frame cannot be placed adjacent to a wall because of the front and back
doors. The right side cover of the A frame cannot be placed adjacent to a wall because of the Support
Element gate (Example A), but can be positioned next to obstacles such as poles or columns (Example
B).
v The front cover on frame A opens 162 mm (6.37 in) wider than the width of the frame plus side cover
(Example C). The keyboard/display gate on frame A opens 712 mm (28 in) wider than the width of the
frame plus side cover (Example D).
Wall or
other obstacle
Column
OK
Pole
Example B
Example A
OK
Wall
162 mm (6.37 in)
frame A to wall
OK
Example C
Example D
OK
Figure 2. Detailed service clearances
38
z13s IMPP
712 mm (28 in)
frame A to wall
Level 00f
Cooling recommendations for the room
The following illustration does not represent any particular server machine type, and is intended only to
show hot and cold airflow and the arrangement of server aisles on the raised floor.
A typical z13s or Rockhopper uses chilled air, provided from under the raised floor, to cool the system.
As shown below, rows of servers must face front-to front. Chilled air is usually provided through
perforated floor panels placed in rows between the fronts of servers (the cold aisles shown in the figure).
Perforated tiles generally are not be placed in the hot aisles. (If your particular computer room causes the
temperature in the hot aisles to exceed limits of comfort for activities like system service, you may add as
many perforated tiles as necessary to create a satisfactory comfort level.) Heated exhaust air exits the
computer room above the computing equipment.
Refer to Chapter 2, “Environmental specifications,” on page 9 for specific data regarding temperature,
humidity, and gaseous and particulate contamination.
Chapter 3. Models and physical specifications
39
Level 00f
Wall
40
z13s IMPP
Level 00f
The following charts and tables show how much cooling airflow is recommended for the z13s or
Rockhopper.
Air flow requirements for data centers below 1,500 feet elevation
2000 (56.6)
air flow - CFM (CM/M)
1800 (51.0)
1600 (45.3)
1400 (39.6)
1200 (34.0)
D
1000 (28.3)
800 (22.7)
C
B
A
600 (17.0)
20
(68.0)
22
(71.6)
24
(75.2)
26
(78.8)
28
(82.4)
30
(86.0)
32
(89.6)
34
(93.2)
36
(96.8)
38
(100.4)
40
(104.0)
42
(107.6)
inlet air temperature -- °C (°F)
Figure 3. Air flow requirements for data center below 1,500 feet elevation
Chapter 3. Models and physical specifications
41
Level 00f
Air flow requirements for data centers between 1,500 and 3,100 feet elevation
2200 (62.3)
2000 (56.6)
air flow - CFM (CM/M)
1800 (51.0)
1600 (45.3)
1400 (39.6)
1200 (34.0)
1000 (28.3)
800 (22.7)
D
D
C
C
B
B
A
A
600 (17.0)
20
(68.0)
22
(71.6)
24
(75.2)
26
(78.8)
28
(82.4)
30
(86.0)
32
(89.6)
34
(93.2)
inlet air temperature -- °C (°F)
Figure 4. Air flow requirements for data center between 1,500 and 3,100 feet elevation
42
z13s IMPP
36
(96.8)
38
(100.4)
40
(104.0)
42
(107.6)
Level 00f
Air flow requirements for data centers between 3,100 and 6,000 feet elevation
2200 (62.3)
2000 (56.6)
air flow - CFM (CM/M)
1800 (51.0)
1600 (45.3)
1400 (39.6)
D
1200 (34.0)
C
1000 (28.3)
B
A
800 (22.7)
600 (17.0)
20
(68.0)
22
(71.6)
24
(75.2)
26
(78.8)
28
(82.4)
30
(86.0)
32
(89.6)
34
(93.2)
36
(96.8)
38
(100.4)
40
(104.0)
42
(107.6)
inlet air temperature -- °C (°F)
Figure 5. Air flow requirements for data center between 3,100 and 6,000 feet elevation
Chapter 3. Models and physical specifications
43
Level 00f
Air flow requirements for data centers between 6,000 and 10,000 feet elevation
2400 (68.0)
2200 (62.3)
air flow - CFM (CM/M)
2000 (56.6)
1800 (51.0)
1600 (45.3)
1400 (39.6)
1200 (34.0)
1000 (28.3)
D
C
B
A
800 (22.7)
600 (17.0)
20
(68.0)
22
(71.6)
24
(75.2)
26
(78.8)
28
(82.4)
30
(86.0)
32
(89.6)
34
(93.2)
36
(96.8)
inlet air temperature -- °C (°F)
Figure 6. Air flow requirements for data center between 6,000 and 10,000 1,500 feet elevation
44
z13s IMPP
38
(100.4)
40
(104.0)
42
(107.6)
Level 00f
Table 19. Cooling airflow graph codes- Model N10 (FC 1043) and Model L10 (FC 1056).
N10 or L10 configurations
Airflow curve from chart
0 I/O drawers
A
1 FC 4000 I/O drawer
A
1 FC 4000 I/O drawer and 1 FC 4009 PCIe I/O drawer
B
1 FC 4009 PCIe I/O drawer
A
Notes:
1. FC 4000 = I/O drawer. FC 4009 = PCIe I/O drawer.
2. I/O drawers are only available with z13s models.
Table 20. Cooling airflow graph codes- Model N20 (FC 1044) and Model L20 (FC 1057).
N20 or L20 configurations
Airflow curve from chart
0 I/O drawers
A
1 FC 4000 I/O drawer
A
1 FC 4000 I/O drawer and 1 FC 4009 PCIe I/O drawer
B
1 FC 4000 I/O drawer and 2 FC 4009 PCIe I/O drawers
C
1 FC 4009 PCIe I/O drawer
A
2 FC 4009 PCIe I/O drawers
B
Notes:
1. FC 4000 = I/O drawer. FC 4009 = PCIe I/O drawer.
2. I/O drawers are only available with z13s models.
Table 21. Cooling airflow graph codes- Model N20 (FC 1045) and Model L20 (FC 1045).
N20 or L20 configurations
Airflow curve from chart
0 I/O drawers
B
1 FC 4000 I/O drawer
C
1 FC 4000 I/O drawer and 1 FC 4009 PCIe I/O drawer
D
1 FC 4009 PCIe I/O drawer
C
2 FC 4009 PCIe I/O drawers
D
Notes:
1. FC 4000 = I/O drawer. FC 4009 = PCIe I/O drawer.
2. I/O drawers are only available with z13s models.
Chapter 3. Models and physical specifications
45
Level 00f
Considerations for multiple system installations
When integrating a z13s or Rockhopper into an existing multiple-system environment, or when adding
additional systems to an installed z13s or Rockhopper, consider the following factors:
v Thermal interactions
Although computer room floor space is valuable, for optimal cooling, it is recommended that z13s or
Rockhopper machines have a 1220 mm (48 in) aisle between rows of systems to reduce surrounding air
temperature. See “Cooling recommendations for the room” on page 39.
v Floor placement
The z13s or Rockhopper must be precisely placed for the cable openings to match the floor cutouts.
There is +/- 5 mm (0.2") tolerance for positioning the frame in relation to the floor tiles. This tolerance
assumes edging around the tile cutouts that does not exceed 15 mm (0.6 in) width.
v Floor loading
When trying to optimize floor space utilization, floor loading weight distribution rules may be
inadvertently violated by overlapping weight distribution areas of adjacent machines. Obtain the
services of a qualified structural engineer if you are uncertain of the floor load assessment for your
computer room.
46
z13s IMPP
Level 00f
Chapter 4. Guide for raised floor preparation
This chapter provides recommendations and requirements for making the necessary openings in the
raised floor for installation.
The drawings on the following pages are intended only to show relative positions and accurate
dimensions of floor cutouts. They are not machine templates and are not drawn to scale.
Raised floor cutouts should be protected by electrically non-conductive molding, appropriately sized,
with edges treated to prevent cable damage and to prevent casters from rolling into the floor cutouts.
© Copyright IBM Corp. 2016, 2017
47
Level 00f
Casters
The following illustration shows the physical dimensions around the casters. When planning for both the
movement and positioning of the system, be aware that each caster swivels in a circle slightly larger than
130 mm (5.1 in) in diameter. Exercise caution when working around floor cutouts.
Front
15.5 mm (0.6 in)
49.6 mm (1.96 in)
222.3 mm (8.75 in)
157.5 mm (6.2 in)
Swivel diameter
130.2 mm (5.17 in)
Caster - frame
dimensions
127.0 mm (5.00 in)
100.2 mm (4.00 in)
47.6 mm (1.87 in)
28.7 mm (1.13)
Leveling foot - frame
dimensions
48
z13s IMPP
Level 00f
Procedure for cutting and placement of floor panels
Important:
z13s or Rockhopper, fully configured, can weigh in excess of 1308 kg (2885 lbs) You must be certain that the
raised floor on which you are going to install the server is capable of supporting this weight. Contact your
floor tile manufacturer and a structural engineer to verify that your raised floor is safe to support the z13s or
Rockhopper.
Depending on the floor panel type, additional panel supports (pedestals) may be necessary to maintain the
structural integrity of an uncut panel, or to restore the integrity of a cut floor panel. Consult the panel
manufacturer and the structural engineer to ensure that the panel can sustain the concentrated loads.
Ensure adequate floor space is available to place the frames over the floor panels exactly as shown on the
drawing
Note: Frame template P/N 41T8506 can be ordered by your IBM service representative to assist in the system
layout on your raised floor.
DANGER: Heavy equipment — personal injury or equipment damage might result if mishandled.
(D006)
1. Identify the panels needed, and list the total quantity of each panel required for the installation.
2. Cut the required quantity of panels.
3. Additional panel supports (pedestals) are recommended to restore the structural integrity of the cut
floor tile panels.
4. When cutting the panels, you must adjust the size of the cut for the thickness of the edge molding
you are using. The dimensions shown are finished dimensions.
5. For ease of installation, number each panel as it is cut as shown on the panel specification pages.
6. Use the raised floor diagram to install the panels in the proper positions.
7. You will need two uncut floor tiles to temporarily replace A2 and A3 during the physical placement
of the frames. After frame placement, the uncut tiles can be removed and the cut tiles for A2 and A3
replaced in the floor.
Chapter 4. Guide for raised floor preparation
49
Level 00f
Raised floor with 610 mm (24 in) or 600 mm (23.5 in) floor panels
Cable exit cutouts
1
2
3
4
Rear
A
B
C
D
Front
(Panels
A2, C2)
(Panels
A3, C3)
Frame
Entry/Exit
Front
Rear
94 mm
(3.7 in)
327 mm
(12.87 in)
50
z13s IMPP
327 mm
(12.87 in)
Dimension
(mm)
(in)
94 x 655 3.7 x 25.8
94 x 655 3.7 x 25.8
Level 00f
Important:
Extra pedestals may be placed as shown in the following figure.
These extra pedestals are recommendations. You must decide which, if any, of these recommendations to use.
Extra Pedestal Placement
1
2
3
4
Rear
A
Ap2
Ap3
B
A
C
Cp2
Cp3
D
Front
All pedestals should be adjusted to just contact the underside of each floor panel before the frames are
rolled into place. Depending on your floor panel type, additional supports (pedestals) may be necessary
to restore the structural integrity of cut panels.
Chapter 4. Guide for raised floor preparation
51
Level 00f
52
z13s IMPP
Level 00f
Chapter 5. Power requirements
General electrical power requirements
z13s and Rockhopper requires the following:
v System frame
– 50/60 Hz AC or high-voltage DC
– Voltage ranges:
- AC: 200V to 480V AC, three-phase wiring or single-phase wiring with some restrictions
- DC: 380V to 520V DC
The system requires two power feeds, of the types previously described, each with the same nominal
voltage. One is connected to the front of the A frame, and one is connected to the rear of the A frame.
You cannot use a mix of DC power and AC power. The input power for the z13s or Rockhopper
must be exclusively AC or exclusively DC.
Refer to the Appendix D, “Dual power installation,” on page 125 for the correct wiring method for
your particular power distribution equipment.
v Hardware Management Console
|
For HMC FC 0091, HMC FC 0092, and HMC FC 0095, a single-phase feed from a customer-supplied
service outlet. The outlet must provide 100V to 130V or 200V to 240V 50/60Hz single-phase AC power.
For HMC FC 0094 and HMC 0096, the customer must supply a PDU that provides C13 outlets for the
three C13/C14 power jumper cables.
Important power selection considerations
|
|
|
|
As you select features for z13s or Rockhopper, be aware of the following when choosing server power:
v If you choose single phase power, reference Table 25 on page 57 for the Model N10 and Model L10 or
Table 26 on page 58 or Table 27 on page 58 for the Model N20 and Model L20 to see which I/O drawer
or PCIe I/O drawer configurations are compatible.
I/O drawers are only available with z13s models.
v If you choose single phase power, you will have unbalanced power.
v If you choose three phase power, you may have either balanced or unbalanced power, depending on
server configuration.
– Standard: The system can contain 1, 2 or 3 BPRs per side. See Table 24 on page 56.
– Balanced power plan ahead, FC 3003 adds BPRs, if required, resulting in in 3 BPRs per side. If the
configuration requires 3 BPRs per side, the power is already balanced and this feature is not offered.
Table 24 on page 56 contains the balance definitions for each case.
Power installation considerations
z13s or Rockhopper operates from two fully-redundant power supplies. These redundant power supplies
each have their own line cord, allowing the system to survive the loss of customer power to either line
cord. If power is interrupted to one of the power supplies, the other power supply will pick up the entire
load and the system will continue to operate without interruption. Therefore the line cord for each power
supply must be wired to support the entire power load of the system.
Note: The power cord sets provided are for use only with this product.
© Copyright IBM Corp. 2016, 2017
53
Level 00f
For the most reliable availability, the line cords in the front (A) and the rear (B) of the A frame should be
powered from different PDUs. The A line cord exits the front of the A frame and should be connected to
one PDU. The B line cord exits the rear of the A frame and should be connected to a different PDU than
the A line cord.
See Appendix D, “Dual power installation,” on page 125 for examples of typical redundant wiring
facilities.
The power supplies at the front end of the system use active resistive load synthesis. Harmonic distortion
of the current waveform is small enough that it need not be considered in planning the installation. The
power factor is typically 0.95 or higher.
The utility current distribution across the phase conductors (phase current balance) depends on the
system configuration. Each front end power supply is provided with phase switching redundancy. The
loss of an input phase is detected and the total input current is switched to the remaining phase pair
without any power interruption. Depending on the configuration input power draw, the system can run
from several minutes to indefinitely in this condition. Since most single phase losses are transients which
recover in seconds, this redundancy provides protection against virtually all single phase outages.
Supply type
Nominal voltage range (V)
Voltage tolerance (V)
Frequency range (Hz)
Two redundant 3-phase
line cords
200-480
180-509
47-63
Two redundant single
-phase line cords
200-415
180-440
47-63
Two redundant DC line
cords
380-520
330-550
N/A
Source type
Frequency
Input voltage range (V)
Rated input current (A)
Single or Three-phase power
50/60 Hz
200 - 240V
24A
Single or Three-phase power
50/60 Hz
380 - 415V
16A
Three-phase power
50/60 Hz
480V
14A
N/A
380 - 520V
24A
DC
54
z13s IMPP
Level 00f
Bulk power regulator (BPR) specifications
The following tables provide the number of BPRs required based on the number of processor drawers
and the number of I/O units in the server configuration.
Table 22. Number of BPRs installed per side (with the balanced power feature NOT installed)
Model
Number of I/O units
0
1
N10 or L10
(1 processor drawer)
1
2
N20 or L20
(1 processor drawer)
1
2
N20 or L20
(2 processor drawer)
2
2
1
1
3
3
1
2
3
2
N/A
3
3
3
3
3
3
N/A
Notes:
1. I/O unit = an I/O drawer or a PCIe I/O drawer. I/O drawers are only available with z13s models.
2. Indicates single phase input power is available. There is no balanced power option for single phase input power.
3. Indicates that it is already balanced. A balanced power feature is not available. See Table 23 for the number of
added BPRs per side for balanced power.
Table 23. Number of BPRs added to Table 21 when the balanced power feature is installed
Model
Number of I/O units
1
0
1
2
3
N10 or L10
(1 processor drawer)
2
2
1
N/A
N20 or L20
(1 processor drawer)
2
2
0
0
N20 or L20
(2 processor drawer)
1
0
0
N/A
Notes:
1. I/O unit = an I/O drawer or a PCIe I/O drawer. I/O drawers are only available with z13s models.
2. Minimum BPDs per side = 0.
Maximum BPDs per side = 1
Rule: Add BPD at second CPC drawer or second PCIe I/O drawer or first I/O drawer
Chapter 5. Power requirements
55
Level 00f
|
Table 24. Phase current balance definitions in 3-phase systems
|
number of BPRs per side
current balance
|
1 BPR/side
unbalanced A 1
|
2 BPRs/side
unbalanced B
|
3 BPRs/side
balanced
|
|
|
|
|
|
|
|
Notes:
2
3
1. Unbalanced A - Two phases carry equal current. The third phase carries zero. In this case, the third phase is
redundant and will take over if one of the other phases is lost. This protection is not available with single phase
power.
2. Unbalanced B - Two phases carry equal current. The third phase carries 1.73 times the current than the other
two.
3. Balanced - Three phases carry equal current.
56
z13s IMPP
Level 00f
Power specifications
The following tables provide system power consumption/heat load based on the number of processor
drawers and number of I/O drawers or PCIe I/O drawers with maximum configurations.
PCIe I/O drawer
I/O drawer
Note: I/O drawers are only available with z13s models.
Table 25. Utility power consumption for N10 (FC 1043) and L10 (FC 1056) - one processor drawer
kW
0 I/O drawers and 0 PCIe I/O drawers
2.8
1
1 I/O drawer and 0 PCIe I/O drawers
3.6
1
0 I/O drawers and 1 PCIe I/O drawer
4.4
1
1 I/O drawer and 1 PCIe I/O drawer
5.3
0 I/O drawers and 2 PCIe I/O drawers
N/A
1 I/O drawer and 2 PCIe I/O drawers
N/A
Notes:
1. Indicates that single phase input power is available. There is no balanced power option for single phase input
power.
2. Environmental conditions: warm room (40oC) and altitude of less than 1500 feet with system blowers speed
increased for the appropriate environmental zone.
3. Three phase input power is available on all configurations.
4. A balanced three phase option is offered which BPRs per side depending upon the configuration. This is
available on all configurations not already balanced.
5. DC input power is available on all configurations. There is no balanced power option for DC input. A mix of AC
and DC power on any system is not permitted.
6. Power is shown as maximum values for worst case I/O configurations. Your actual power usage will be
something less than shown here.
Chapter 5. Power requirements
57
Level 00f
Table 26. Utility power consumption for N20 (FC 1044) and L20 (FC 1057) - one processor drawer
number of I/O drawers and PCIe I/O drawers
kW
0 I/O drawers and 0 PCIe I/O drawers
4.0
1
1 I/O drawer and 0 PCIe I/O drawers
4.9
1
0 I/O drawers and 1 PCIe I/O drawer
5.6
1
1 I/O drawer and 1 PCIe I/O drawer
6.7
0 I/O drawers and 2 PCIe I/O drawers
7.4
1 I/O drawer and 2 PCIe I/O drawers
8.2
Notes:
1. Indicates that single phase input power is available. There is no balanced power option for single phase input
power.
2. Environmental conditions: warm room (40oC) and altitude of less than 1500 feet with system blowers speed
increased for the appropriate environmental zone.
3. Three phase input power is available on all configurations.
4. A balanced three phase option is offered which BPRs per side depending upon the configuration. This is
available on all configurations not already balanced.
5. DC input power is available on all configurations. There is no balanced power option for DC input. A mix of AC
and DC power on any system is not permitted.
6. Power is shown as maximum values for worst case I/O configurations. Your actual power usage will be
something less than shown here.
Table 27. Utility power consumption for N20 (FC 1044) and L20 (FC 1057) - two processor drawers
number of I/O drawers and PCIe I/O drawers
kW
0 I/O drawers and 0 PCIe I/O drawers
6.4
1 I/O drawer and 0 PCIe I/O drawers
7.4
0 I/O drawers and 1 PCIe I/O drawer
8.0
1 I/O drawer and 1 PCIe I/O drawer
8.9
0 I/O drawers and 2 PCIe I/O drawers
9.6
1 I/O drawer and 2 PCIe I/O drawers
N/A
Notes:
1. Environmental conditions: warm room (40oC) and altitude of less than 1500 feet with system blowers speed
increased for the appropriate environmental zone.
2. Three phase input power is available on all configurations.
3. A balanced three phase option is offered which BPRs per side depending upon the configuration. This is
available on all configurations not already balanced.
4. DC input power is available on all configurations. There is no balanced power option for DC input. A mix of AC
and DC power on any system is not permitted.
5. Power is shown as maximum values for worst case I/O configurations. Your actual power usage will be
something less than shown here.
58
z13s IMPP
Level 00f
Power estimation tool
The power estimator tool for z13s or Rockhopper allows you to enter your precise server configuration to
produce an estimate of power consumption. You can also use the tool to calculate the weight of your
server.
Log on to Resource Link at http://www.ibm.com/servers/resourcelink. Navigate to Tools, then to Power and
weight estimation. Specify the quantity for the features that are installed in your machine. This tool
estimates the power consumption for the specified configuration. The tool does not verify that the
specified configuration can be physically built.
Note: The exact power consumption for your machine will vary. The object of the tool is to produce an
estimation of the power requirements to aid you in planning for your machine installation.
Actual power consumption after installation can be confirmed using the HMC Monitors Dashboard task.
Power capping
z13s or Rockhopper supports power capping, which gives the customer the ability to limit the maximum
power consumption and reduce cooling requirements. To use power capping, Automate Firmware Suite
(FC 0020) must be ordered. This feature is used to enable the Automate suite of functionality associated
with the IBM z Unified Resource Manager. The Automate suite includes representation of resources in a
workload context, goal-oriented monitoring and management of resources, and energy management. The
Automate suite is included in the base zCPC at no charge for CPs and zIIPs.
Chapter 5. Power requirements
59
Level 00f
Customer circuit breakers
The following table shows the maximum circuit breaker ratings based on input voltage.
Table 28. Circuit breaker ratings based on input voltage
Input Voltage Range (V)
System Rated Current (A)
Circuit Breaker
200 - 240 VAC
24A
30 amps
380 - 415 VAC
16A
16 amps
480 VAC
14A
20 amps
380 - 520 VDC
24A
30A DC/32A DC W/T
It is recommended, for simplicity and ease of upgrades, that the circuit breaker ratings in this table be
used on all power cords for all installations. The actual power drawn (heat load) by any configuration
will not be affected.
Note: Small currents can appear on the server earth ground connection under normal server operation.
1. Occasionally an input phase voltage is lost. The server will continue to operate normally, but leakage
current (tens of mAs) will appear on the ground until the missing phase voltage is restored.
2. Background currents due to small voltage gradients in the facility's ground grid can appear on the
server earth connection because this connection is redundant.
For most reliable operation, circuit breakers that react to currents detected on ground (e.g. Earth Leakage
Circuit Breakers or Residual Current Circuit Breakers) are not recommended for use with z Systems
servers. By internal design and grounding, z Systems servers are fully certified for safe operation without
them (meets IEC, EN, UL, CSA 60950-1 standards).
However, if leakage detection circuit breakers are required by local electrical practice, they can be used
down to 100 mA. To safeguard against spurious tripping:
1. The Data Center ground grid should be constructed in accordance with best practices to avoid
significant voltage gradients.
2. The facility power infrastructure should be as reliable as possible.
3. The utility connections from the breaker panel to the two or four power cord inputs should be
reasonably equal in length or at least no one connection should be much shorter than the others.
If spurious tripping is experienced, corrections must be made in one or more of the above areas.
60
z13s IMPP
Level 00f
Internal battery feature (FC 3215)
The Internal Battery Feature (IBF), FC 3215, is optional on the z13s or Rockhopper. In the event of input
power interruption to the system, the internal battery feature will provide sustained system operation for
the times listed in the following table.
Note: I/O drawers are only available with z13s models.
Table 29. Battery hold-up times for Model N10 (FC 1043) and Model L10 (FC 1056) - one processor drawer.
number of I/O drawers and PCIe I/O drawers
hold-up time (minutes)
0 I/O drawers and 0 PCIe I/O drawers
22.8
1 I/O drawer and 0 PCIe I/O drawers
15.5
0 I/O drawers and 1 PCIe I/O drawer
11.7
1 I/O drawer and 1 PCIe I/O drawer
9.0
0 I/O drawers and 2 PCIe I/O drawers
NA
1 I/O drawer and 2 PCIe I/O drawers
NA
Notes:
1. The numbers shown assume both BPAs feeding power with the batteries charged at full capacity.
2. Hold-up times are influenced by temperature, battery age, and fault conditions within the system.
Table 30. Battery hold-up times for Model N20 (FC 1044) and Model L20 (FC 1057) - one processor drawer.
number of I/O drawers and PCIe I/O drawers
hold-up time (minutes)
0 I/O drawers and 0 PCIe I/O drawers
13.3
1 I/O drawer and 0 PCIe I/O drawers
9.9
0 I/O drawers and 1 PCIe I/O drawer
8.3
1 I/O drawer and 1 PCIe I/O drawer
6.9
0 I/O drawers and 2 PCIe I/O drawers
6.2
1 I/O drawer and 2 PCIe I/O drawers
4.8
Notes:
1. The numbers shown assume both BPAs feeding power with the batteries charged at full capacity.
2. Hold-up times are influenced by temperature, battery age, and fault conditions within the system.
Table 31. Battery hold-up times for Model N20 (FC 1045) and Model L20 (FC 1045) - two processor drawers.
number of I/O drawers and PCIe I/O drawers
hold-up time (minutes)
0 I/O drawers and 0 PCIe I/O drawers
7.2
1 I/O drawer and 0 PCIe I/O drawers
6.2
0 I/O drawers and 1 PCIe I/O drawer
4.9
1 I/O drawer and 1 PCIe I/O drawer
4.2
0 I/O drawers and 2 PCIe I/O drawers
3.7
1 I/O drawer and 2 PCIe I/O drawers
NA
Notes:
1. The numbers shown assume both BPAs feeding power with the batteries charged at full capacity.
2. Hold-up times are influenced by temperature, battery age, and fault conditions within the system.
Chapter 5. Power requirements
61
Level 00f
Unit emergency power off (UEPO)
There is a unit emergency power off (UEPO) switch on the front of the A frame of each system. When
tripped, the UEPO switch will immediately disconnect utility and battery power from the machine
functional unit. Utility power is confined to the machine power compartment. All volatile data will be
lost.
Front View
Unit EPO Panel
Rear View
Unit EPO Panel
Unit EPO Panel
Mounting Screw
A Side
BPI
Cable
J01
B Side
BPI
Cable
Unit EPO
Switch
J02
Customer
Supplied
Cable
J03
Unit EPO Panel
Mounting Screw
BYPASS
ACTIVE
Room Disconnecting Means/
Emergency Power Off Actuator
ACTIVE
BYPASS
Room Disconnecting Means/
Emergency Power Off Actuator
This figure illustrates the back of the machine UEPO panel showing where the room electrical power
disconnecting means, or room Emergency Power Off, EPO, cable plugs into the machine. Notice the
switch actuator. Once moved to make the cable connection possible, the room disconnecting means /
EPO cable must be installed for the machine to power on.
Note: Optionally, an EPO cover plate (P/N 00LV198) can be installed on the back of the front door. This
cover plate is used to determine whether the EPO switch was tampered with. If someone attempts to
tamper with the EPO switch, the cover plate will be deformed. The customer will decide if they want this
cover plate installed.
62
z13s IMPP
Level 00f
Computer room emergency power off (EPO)
When the internal battery backup feature is installed and the room disconnecting means / EPO is
tripped, the batteries will engage and the computer will continue to run. It is possible to attach the
computer room disconnecting means / EPO system to the machine UEPO switch. When this is done,
tripping the room disconnecting means / EPO will disconnect all power from the line cords and the
internal battery backup unit. In this event all volatile data will be lost.
To incorporate the IBF into the room disconnecting means / Emergency Power Off (EPO) systems, a cable
must be made to connect to the back of the system UEPO panel. The following diagram illustrates how
this connection is made.
4
3
2
1
AMP Part Number -- 770019-1
Contact Number
2 Pole Normally-closed Pushbutton
Room UEPO Switch Schematic
In this figure, an AMP connector (P/N 770019-1) is needed to connect to the system UEPO panel. For
room disconnecting means / EPO cables using wire sizes #20 AWG to #24 AWG, use AMP pins part
number 770010-4. The permissible resistance of the customer connection is 5 Ohms Maximum (~200' of
#24 AWG).
Chapter 5. Power requirements
63
Level 00f
Power plugs and receptacles, and line cord wire specifications
Plugs are shipped with the machine line cords in USA and Canada. Power cords that exit the bottom of
the frame are 4250 mm (14 ft.). Top exit power cords are 1829 mm (6 ft). Power plugs listed in Table 32
are approved for use with specified models and meet the relevant test laboratory or country/test-house
standards. The power plug must be connected to a correctly wired and grounded receptacle. The
customer is responsible for receptacle wiring.
For countries that require other types of plugs or receptacles, the system is shipped without plugs on the
line cords, and you are responsible for supplying and installing both plugs and receptacles.
Important:
In a typical three-phase power cord, there are five wires inside the cut cord cable. There are the three
phase wires, one ground wire and there is a fifth, small diameter wire, connected to the cable , that acts
as a drain. This drain wire must be connected to the cable ground, NOT neutral.
Table 32. Supported power cords
System location
|
|
Supported
power cord
feature
codes 7
Watertight plug
Watertight receptacle
Watertight connector
USA, Canada, Japan
(200-240 VAC)
1 phase
connector body - Blue
8971
8990
30A IEC-309
(provided as part of the
cord)
30A HBL330R6W
(not provided)
30A HBL330C6W
(not provided)
USA, Canada, Japan
(200-240 VAC)
3 phase
connector body - Blue
8975
8987
30A IEC-309
(provided as part of the
cord)
30A HBL430R9W
(not provided)
30A HBL430C9W
(not provided)
USA, high voltage
(480 VAC)
8969
8983
30A IEC-309
provided as part of the
cord)
30A HBL430R7W
(not provided)
30A HBL430C7W
(not provided)
USA, Canada
(415 VAC)
connector body - Red
8957
8976
30A IEC-309 8
(provided as part of the
cord)
30A HBL430R6V02
(not provided)
30A HBL430C6V02
(not provided)
USA, Canada, Japan
(380-520 VDC)
connector body - Black
8966
8973
30A IEC-309
(provided as part of the
cord)
30A HBL330R8WDC
(not provided)
30A HBL330C8V0DC
(not provided)
No plug provided.
Cut end cord.
Plug is provided by the
customer and is
electrician-installed.
(not specified)
(not specified)
No plug provided.
Cut end cord.
Plug is provided by the
customer and is
electrician-installed.
(not specified)
(not specified)
No plug provided.
Cut end cord.
Plug is provided by the
customer and is
electrician-installed.
(not specified)
(not specified)
World Trade
(200-240 VAC)
World Trade
(380-415 VAC)
World Trade
(300-600 VDC)
64
z13s IMPP
8970
8972
8988
8991
8998
6
8970
8972
8988
8991
8998
6
8964
8974
6
6
6
6
6
6
6
6
Level 00f
Notes:
1. IBM continues to strongly recommend the use of a metal backbox (example shown below) with our
line cords using IEC-309 plugs. Although in-line connectors and nonmetallic backboxes are available
and compatible, they are not recommended. These recommendations are based on the metal backbox
providing:
v An added level of protection against a mis-wired phase and ground reversal
v In some cases, a metal backbox may be better for EMI mitigation
2.
3.
4.
5.
6.
7.
8.
You may choose not to use a metal backbox. In this case, please check your local code for specific
requirements.
The customer must obtain the appropriate plugs and receptacles, based on existing electrical codes,
where those plugs and receptacles are not provided with the system. These customer-provided plugs
and receptacles should be installed by qualified electricians.
The power cord set(s) provided are for use only with this product.
Where plugs are provided, Hubbell is the plug supplier.
If you choose to use a Hubbell receptacle, do NOT use the Hubbell C-Series Light Industrial 3.
This FC can be used in both ranges: 200-240V and 380-415V.
See “Line cord wire specifications” on page 69 for descriptions of the power cord feature codes.
This plug is dual listed at 30A and 32A.
DC power cords
The DC power cord is illustrated below.
Vdc2
Vdc1
Earth
Earth
GND
plus
minus
customer DC source
C
GND
B
A
DC line cord
system side
The DC feed is on the B line. The C and A lines are the DC return. The crimp between the C line and A
line is internal on cords with a customer plug. For cut end cords, the C and A lines must both be tied to
the negative side of the source because all four wires exit the cord body separately. Reference the
following table for DC voltage information.
Table 33. Input voltage range.
Parameter
Absolute maximum
Absolute minimum
Vdc1 + Vdc2
550V
330V
Vdc1
550V
0V
Chapter 5. Power requirements
65
Level 00f
Table 33. Input voltage range (continued).
Parameter
Absolute maximum
Absolute minimum
Vdc2
420V
0V
A DC line cord locking ring must be attached on both ends of all DC line cords to ensure the DC line
cords are de-energized before unplugging,
Note: The DC line cord locking ring will have the following label attached.
DANGER: Arc Flash/Arc Blast hazard when disconnected with power on. Turn off power before
disconnecting. (L015)
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Grounding specifications
Every three-phase circuit must contain three-phase conductors and an insulated equipment-grounding
conductor. Every single-phase 120 volt branch circuit (used for the Hardware Management Console and
service outlets) must contain one phase conductor, a neutral conductor, and an insulated
equipment-grounding conductor.
For 200 VAC through 240 VAC installations worldwide, the equipment-grounding conductor must match
local electrical codes and must be green with or without one or more yellow stripes on the insulation.
IBM recommends that the ground wire be the same size as the phase conductor wires.
Conduit must not be used as the only grounding means. However, any conduit or cable shield must be
connected at both ends in such a way that it is included in the grounding path in parallel with the
grounding conductor it contains. Most electrical codes require that branch circuit wiring be located in
metallic conduit, or be made from shielded cable, if located under a raised floor. Even when not required
by local regulations, some form of shield around the branch circuit wiring is strongly recommended as a
means of reducing coupling of high-frequency electrical noise into signal and control cables.
For information about additional recommendations and requirements for equipment grounding, go to
Resource Link at http://www.ibm.com/servers/resourcelink. See General Information for Planning a Physical
Site.
Chapter 5. Power requirements
67
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Top exit power cords
z13s or Rockhopper has the option of top exit power cabling. There are several power cord options
specifically made for top exit, and you must choose one of these if you wish to have the power cords exit
through the top of the server. The top exit power cords are manufactured with additional hardware that
mounts the cord to the frame of the machine and provides an EMC seal at the same time.
If you are planning for top exit power cords, your receptacle must drop to within 305 mm (1 ft) of the
top of the frame and be no further than 305 mm (1 ft) from the front door or side cover of the frame.
305 mm (1 ft)
305 mm (1 ft)
Front view
Top view
305 mm (1 ft)
For power cord top exit, choose from the following power cord feature codes: 8957, 8969, 8970, 8971,
8972, 8973, 8974, and 8975.
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Line cord wire specifications
Line code usage location
|
|
Feature
code
AWG #
Type
# of wires
Number of shields
Connector
supplied
Bulk outside
diameter
mm (in)
USA
(415 VAC) 3 Phase
top exit cord
6 ft.
FC 8957
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
Yes
18.54
World Trade
(380-520 VDC)
bottom exit cut cord
14 ft.
FC 8964
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
No
18.54
USA
(380-520 VDC)
bottom exit cord
14 ft.
FC 8966
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
Yes
18.54
USA
(480 VAC) 3 Phase
top exit cord
6 ft.
FC 8969
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
Yes
18.54
World Trade 1, 2
(HiLo VAC) 3 Phase
top exit cut cord
14 ft.
FC 8970
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
No
18.54
USA, Canada, Japan
(200-240 VAC) 1 Phase
top exit cord
6 ft.
FC 8971
#10 AWG
Type ST
3 wire
1 (overall gross
shield)
Yes
18.54
World Trade 1, 2
(HiLo VAC) 1 Phase
top exit cut cord
14 ft.
FC 8972
#10 AWG
Type ST
3 wire
1 (overall gross
shield)
No
18.54
USA
(380-520 VDC)
top exit cord
6 ft.
FC 8973
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
Yes
18.54
World Trade 2
(380-520 VDC)
top exit cut cord
14 ft.
FC 8974
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
No
18.54
USA, Canada, Japan
(200-240 VAC) 3 Phase
plugged top exit cord
6 ft.
FC 8975
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
Yes
18.54
USA
(415 VAC) 3 Phase
bottom exit cord
14 ft.
FC 8976
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
Yes
18.54
USA
(480 VAC) 3 Phase
bottom exit cord
14 ft.
FC 8983
#10 AWG
Type DP-1
4 wire
1 (overall gross
shield)
Yes
14.48
Chapter 5. Power requirements
69
Level 00f
Line code usage location
|
|
AWG #
Type
# of wires
Feature
code
Number of shields
Connector
supplied
Bulk outside
diameter
mm (in)
USA, Canada, Japan
(200-240 VAC) 3 Phase
bottom exit cord
14 ft.
FC 8987
#10 AWG
Type ST
4 wire
1 (overall gross
shield)
Yes
18.54
World Trade 1
(HiLo VAC) 3 Phase
bottom exit cut cord
14 ft.
FC 8988
#10 AWG
Type DP-1
4 wire
1 (overall gross
shield)
No
14.48
USA, Canada, Japan
(200-240 VAC) 1 Phase
bottom exit cord
14 ft.
FC 8990
#10 AWG
Type ST
3 wire
1 (overall gross
shield)
Yes
18.54
World Trade 1
(HiLo VAC) 1 Phase
cut bottom exit cord
14 ft.
FC 8991
#10 AWG
Type DP-1
3 wire
1 (overall gross
shield)
No
14.48
World Trade 1
LSZH (HiLo VAC) 3 Phase
bottom exit cut cord
14 ft.
FC 8998
#10 AWG
Type DP-1-LS
4 wire
1 (overall gross
shield)
No
15.00
Notes:
1. HiLo VAC can be used in both ranges: 200-240 VAC or 380-415 VAC.
2. This excludes Canada and Japan.
3. LSZH = low smoke, zero halogen
Wire colors for cut-end cords
Wire Number
Color
Description
Line 1
Brown
Phase 1 (labeled "PH-1" on the wire insulation
Line 2
Black
Phase 2 (labeled "PH-2" on the wire insulation
Line 3
Gray
Phase 3 (labeled "PH-3" on the wire insulation
Ground
Green/Yellow
Ground (labeled "GND" on the wire insulation
Drain
clear or uninsulated
Cable shield - must be connected to GROUND
Line physical protection
In US installations the line cord must meet National Electric Code (NEC) requirements. When line cords
are run on the surface of the floor, they must be protected against physical damage (See NEC 645-5). For
other countries, local codes apply.
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Chapter 6. Hardware Management Console and Support
Element communications
Support Element
z13s and Rockhopper are supplied with dual 1U x86 7914 Support Elements or dual 1U 2461 Support
Elements (FC 0146); both with dual keyboards and displays. One is always active while the other is
strictly an alternate.
Note: Throughout the rest of this document, “Support Elements” refers to the dual 7914 Support
Elements or the dual 2461 Support Elements, whichever is being used.
Power for the Support Elements is supplied by the z13s or Rockhopper power supply, and there are no
additional power requirements.
The Support Elements on the z13s or Rockhopper connects to the LAN via the customer network switch.
Then the Support Elements connect to the system control hubs. The Hardware Management Console also
connects to the LAN via the customer network switch.
Hardware Management Console
| A Hardware Management Console (FC 0091, FC 0092, FC 0094, FC 0095, or FC 0096) is required to
| operate z13s or Rockhopper. FC 0092, FC 0094, FC 0095, and 0096 are optional features on new orders.
You can carry forward FC 0091. A single console can support multiple z Systems servers and can be
located remotely to the physical sites.
If you plan to use the ensemble capabilities of z13s or Rockhopper, you will need to order FC 0025,
Unified Resource Manager and provide two HMCs – one to serve as the primary HMC for the ensemble,
and one to serve as the alternate HMC.
Note: In addition to performing ensemble-related tasks for any CPC in the ensemble, the primary HMC
can perform all non-ensemble tasks on a CPC, whether it is a member of an ensemble or not a member of
an ensemble.
The machine type and model number of the primary HMC and alternate HMC must be identical. Both
| must be either FC 0091, FC 0092, FC 0094, FC 0095, or FC 0096. Compare the machine type from the
serial number label to ensure that both machines have the same machine type.
The Hardware Management Console consists of:
| v The Hardware Management Console (FC 0091, FC 0092, and FC 0095) consists of:
– A processor or system unit, including two Ethernet LAN adapters, capable of operating at 10, 100,
or 1000 Mbps and will use removable UFDs to install Licensed Machine Code (LMC)
– A flat panel display
– A keyboard and
– A mouse
– A customer-supplied table to hold the flat panel display, keyboard, and mouse.
See Appendix B, “Hardware Management Console physical specifications,” on page 111 for physical
specification of HMC (FC 0091), HMC (FC 0092), HMC (FC 0095), and the flat panel display (FC 6096).
v The Hardware Management Console (FC 0094 and FC 0096) consists of:
© Copyright IBM Corp. 2016, 2017
71
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– 1U HMC system unit, including two Ethernet LAN adapters, capable of operating at 10, 100, or 1000
Mbps and will use removable UFDs to install Licensed Machine Code (LMC)
– 1U console unit that holds the flat panel display and the keyboard
– Three C13/C14 10 amp power jumper cables (2.8 m (9 ft))
– The customer must provide the following:
- A rack to hold the 1U Hardware Management Console and the 1U console unit
- Three power receptacles, which provides C13 outlets for the C13/C14 power jumper cables -- two
for the 1U HMC system unit and one for the display/keyboard unit.
The 1U HMC system unit and the 1U keyboard/display unit must be mounted in two adjacent 1U
locations in the ergonomic zone in the rack. The following are recommendations for placement of the
1723-8BX keyboard/display unit into the customer supplied rack:
– If you are standing when using the 1723-8BX keyboard/display unit, place the unit in EIU locations
21, 22, or 23.
– If you are sitting when using the 1723-8BX keyboard/display unit, place the unit in EIU locations
12, 13, or 14.
– For special accommodations, you need to make adjustments in the placement of the 1723-8BX
keyboard/display unit in the rack that meet your needs.
See Appendix B, “Hardware Management Console physical specifications,” on page 111 for physical
specifications of HMC (FC 0094), HMC (FC 0096), the flat panel display (FC 6096), and the 1723-8BX
keyboard/display unit.
| The Hardware Management Console (FC 0091, FC 0092, and FC 0095) requires two 110/120V outlets for
USA and Canada. The Hardware Management Console (FC 0094 and FC 0096) uses three PDU plug
positions (two for the 1U HMC unit, and one for the 1723-8BX display/keyboard unit) for USA and
Canada. (Other power requirements are country dependent.)
An Ethernet switch will not be offered as a configurable feature on z13s or Rockhopper. If an Ethernet
switch is needed to manage the Ethernet connection between the Support Elements and HMCs, you must
supply your own. It is recommended that the Ethernet switch support a speed of 1 Gb. However, if you
are upgrading to a z13s or Rockhopper and Ethernet switch, FC 0070, is found on the base machine, it
will be carried forward.
The Ethernet switch requires a single 110/120V outlet for USA and Canada. (Other power requirements
are country dependent.)
Physical specifications for the Hardware Management Console components are located in Appendix B,
“Hardware Management Console physical specifications,” on page 111.
Ethernet LAN switch support
The following is general information relevant to many Ethernet switches. Refer to the manufacturer’s
User’s Guide that came with your switch or hub for installation instructions.
There must be an Ethernet switch or hub available to connect the Hardware Management Consoles to
your LAN. The Ethernet switch or hub is a standalone unit located outside the frame and which operates
on building AC power. An Ethernet switch will not be offered as a configurable feature on z13s or
Rockhopper. You must supply your own Ethernet switch unless you are upgrading to a z13s or
Rockhopper. If you are upgrading to a z13s or Rockhopper and Ethernet switch, FC 0070, is found on the
base machine, it will be carried forward. It is recommended that the Ethernet switch support a speed of 1
Gb.
Typical Ethernet switch/hub characteristics:
v 16 auto-negotiation ports
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v
v
v
v
v
10/100/1000 Mbps data rate
Full or half duplex operation
Auto-MDIX on all ports
Port Status LEDs
100 to 240 VAC, 50 or 60 Hz power
Ethernet switches supporting auto-MDIX on all ports use a straight-through cable between any two ports.
To provide redundancy for the HMCs, two switches or hubs should be used.
Switch Example
SMC
R
EZ Switch 10/100/1000
SMCGS16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Link/Act
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
1000/100M
Link/Act
1000/100M
Power
Ethernet network connection requirements
MUST READ:
This product may not be certified in your country for connection by any means whatsoever to interfaces of
public telecommunications networks. Further certification may be required by law prior to making any such
connection. Contact an IBM representative or reseller for any questions.
The preceding statement does NOT exclude using the network for private communications, such as connection to
the Remote Support Facility.
On the z13s or Rockhopper, the install team must connect the Ethernet adapters for any HMC(s) into an
Ethernet switch. This switch can then be connected to J03 and J04 on the Support Elements. (See Figure 7
on page 74.)
Chapter 6. Hardware Management Console and Support Element communications
73
Level 00f
Hardware Management Consoles
Switch
Switch
Customer
LAN Network
1X
2X
3X
4X
5X
6X
7X
8X
1X
2X
9X
10X 11X 12X 13X 14X 15X 16X
9X
10X 11X 12X 13X 14X 15X 16X
3X
4X
5X
6X
7X
8X
Customer
LAN Network
Support Element 1 (rear frame (A42) - Ethernet port 1
Support Element 1 (rear frame (A42) - Ethernet port 2
Support Element 1 (rear frame (A42) - Ethernet port 3
Support Element 1 (rear frame (A42) - Ethernet port 4
Support Element 2 (rear frame (A41) - Ethernet port 1
Support Element 2 (rear frame (A41) - Ethernet port 2
Support Element 2 (rear frame (A41) - Ethernet port 3
Support Element 2 (rear frame (A41) - Ethernet port 4
SCH 1
SCH 2
Figure 7. Two-switch configuration
Notes:
1. Connect customer LANs, via Ethernet switches, to Ethernet ports J03 and J04 on the Support Element
servers. Customer LAN 1 should be plugged into Ethernet port J03 on the Support Elements.
Customer LAN 2 should be plugged into Ethernet J04 on the Support Elements.
2. Never connect an HMC directly to Ethernet ports J03 and J04 on the Support Elements.
Hardware Management Console and Support Element wiring options
A local Hardware Management Console must be connected to its Support Elements using Local Area
Network (LAN) wiring. The Hardware Management Console and the Support Elements both come with
Dual Ethernet LAN adapters.
The communication protocol (TCP/IP) used in Support Element to Hardware Management Console
communication is defined for both adapters in the Support Elements.
Notes on wiring with multiple adapters:
1. The Hardware Management Console supports dual Ethernet paths to Support Elements. This allows
automatic redundant network paths so that the failure of a single network has no affect on Hardware
Management Console to Support Element communication.
2. When configuring multiple adapters the address must be defined in different subnets.
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Trusted Key Entry (TKE)
z13s or Rockhopper may have a Crypto Express5S (FC 0890) feature for applications where extensive data
security is required. For these systems, there is a separate console available for authorized access to the
Crypto Express5S (FC 0890) feature. This console is named the Trusted Key Entry (TKE) workstation.
|
|
|
|
|
The TKE workstations (FC 0082, FC 0847, and FC 0098) include a system unit, flat panel display, mouse,
keyboard, and line cord. The built-in Ethernet adapter supports a link data rate of 10, 100, or 1000 Mbps.
The TKE workstation (FC 0097) includes a system unit and a 1U console unit that holds the flat panel
display and the keyboard. A UFD drive is available for installation of Licensed Machine Code (LMC) for
all TKE workstations (FC 0082, FC 0847, FC 0097, and FC 0098).
Note: TKE workstation FC 0842 can only be carried forward. However, it must be upgraded to TKE
workstation FC 0847 using FC 0894, which ships the 4767 TKE Crypto Adapter. Therefore, the upgrade
from FC 0842 to FC 0847 requires the purchase of a 4767 TKE Crypto Adapter (FC 0894).
The TKE workstation attaches to the customer LAN, providing a security-rich, flexible method of
providing master key and operational key entry to locally and remotely managed Cryptographic
Coprocessor features.
TKE with optional Smart Card Reader, FC 0885 or FC 0891, allows access to and use of confidential data
on the Smart Card, protected by a user defined personal identification number (PIN) code providing
secure storage, access, transport and entry of master and operational key parts into the TKE workstation.
The following characteristics pertain to the Smart Card Reader:
Note: FC 0885 can only be carried forward.
v The Smart Card Reader is an optional security device that attaches to the TKE.
v TKE logon profiles can be placed on smart cards, which provide enhanced control over the sign on
processes.
v FC 0885 and FC 0891 contain two Smart Card Readers, two serial port “Y” adapters, two serial cables,
and 20 blank smart cards. The cables provide both power source for the Smart Card Reader and the
communication path between the Smart Card Reader and the TKE workstation.
v A TKE workstation and the TKE 7.2 or later level code are corequisites for ordering the Smart Card
Reader.
v TKE 8.0 is required to manage a Crypto Epress5S and the additional domains provided on the Crypto
Express5S on a z13s or Rockhopper.
Any existing TKE workstation (FC 0841 or less) cannot be upgraded to TKE 8.0. In this case, it must be
replaced with a TKE workstation (FC 0847).
TKE workstation (FC 0842) can be upgraded to TKE 8.0. However, this upgrade requires the purchase
of a 4767 TKE Crypto Adapter (FC 0894).
v FC 0884 and FC 0892 provide the ability to order additional blank Smart Cards. The Smart Card
Reader is a corequisite for ordering additional Smart Cards.
v The Smart Card Reader feature (FC 0885) and Additional Smart Card feature (FC 0884) can be carried
forward.
If you currently have the Smart Card Reader feature (FC 0885) and Additional Smart Card feature (FC
0884), they can only be carried forward to TKE 8.0 as follows:
– The smart card readers can be used on TKE 8.0 without any restrictions.
– If you have initialized any smart cards as CA, TKE, EP11, or MCA smart cards, you can use them on
your TKE 8.0 system without any restrictions.
– If you have initialized any smart cards as IA or KPH smart cards, you can use them on your TKE
8.0 for migration tasks done with Crypto Express4S or below modules.
Chapter 6. Hardware Management Console and Support Element communications
75
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– If you have initialized any smart cards as IA or KPH smart cards, you cannot use them for
migration tasks done with Crypto Express5S modules.
Note: If data will eventually be applied to a Crypto Express5S, the collect and apply migration tasks
must be performed from a TKE 8.0 using IA and KPH smart cards that were initialized on TKE 8.0.
– A smart card from FC 0885 or 0884 can be initialized as any one of the 6 types (CA, TKE, EP11,
MCA, IA or KPH) of smart cards on TKE 8.0.
To use the TKE function on z13s or Rockhopper, the Crypto Express5S feature, TKE 8.1 code (FC 0878),
and CP Assist for Cryptographic Function (FC 3863) must be installed.
| TKE workstations (FC 0082, 0847, and 0098) require two 110/120 volt outlets in the U.S. and Canada. TKE
| workstations (FC 0097) require three PDU outlets (two for the 1U TKE unit, and one for the
| display/keyboard). Power requirements vary in other countries.
LAN connections
LAN cabling is a customer responsibility. To connect the TKE workstation with Ethernet to a LAN, a
Category 5 Unshielded Twisted Pair (UTP) cable terminated with an RJ-45 connector is required.
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Planning for an ensemble
If you are planing to use this z13s in an ensemble, you must order FC 0025, which supplies the ensemble
| management code, and you must supply two HMCs (FC 0091, FC 0092, FC 0094, FC 0095, or FC 0096),
which manage the ensemble. One of these HMCs is configured as the primary for the ensemble, one as
the alternate.
Note: It is important to note that these two HMCs, if ordered, must be installed on the same Ethernet
subnet, to insure redundancy.
If FC 0025, Unified Resource Manager, is to be used on a single 2965, and if LPAR to LPAR
communications is required in a Unified Resource Manager defined VLAN, you must supply an LC
Duplex directly-connected cables (not wrap cables, as was previously recommended). Those LC Duplex
directly-connected cables plug into the two OSA-Express4S 10 GbE features or two OSA-Express5S 10
GbE features (CHPID type OSX).
Notes:
v When a z13s and FC 0025 (Unified Resource Manager) are ordered, eConfig does not force you to
order two OSA-Express4S 10 GbE features or two OSA-Express5S 10 GbE features; however, those OSA
features (OSA-Express4S 10 GbE Long Reach (FC 0406), OSA-Express4S 10 GbE Short Reach (FC 0407),
OSA-Express5S 10 GbE Long Reach (FC 0415), OSA-Express5S 10 GbE Short Reach (FC 0416)) are
required if you plan to use them for LPAR to LPAR communication.
v The IODF must be shared among participating z/OS® LPARs.
Ensemble network configurations for a z13s are as follows:
v z13s can be in an ensemble with one or more z13/z13s/zEC12/zBC12/z196/z114 machines, zBX
Model 004 machines, zBX Model 003 machines (attached to zEC12 or zBC12), and/or zBX Model 002
machines (attached to z196 or z114).
v Customer-managed management network (with or without zBX)
– A pair of HMCs (FC 0091, 0092, 0094, or 0096) with Unified Resource Manager (FC 0025) to control
and manage the ensemble. One HMC is configured as the primary, the other as the alternate if the
primary HMC fails.
– Only one pair of HMCs running Unified Resource Manager per ensemble.
v Intranode management (INMN) network (OSM CHPID)
– Two ports from two different OSA-Express5S 1000BASE-T Ethernet adapters (FC 0417) (for
redundancy) to provide management capability for a single node through the Unified Resource
Manager.
v Intraensemble data (IEDN) network (OSX CHPID with a zBX in the ensemble or single node without a
zBX for LPAR to LPAR communications)
A z13s ensemble that has multiple nodes and no zBX cannot utilize the IEDN.
– zBX in the ensemble, each node can have a connected pair of OSA-Express4S 10 GbE adapters or
OSA-Express5S 10 GbE adapters (for redundancy).
– Single node (with no zBX) will have a pair of 10 Gb loop back cables (customer-supplied) to allow
the applications to share data on the IEDN between operating system images.
v Customer network connections (OSD CHPID)
– For existing network connectivity from z Systems applications to networks other than the IEDN.
Chapter 6. Hardware Management Console and Support Element communications
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Chapter 7. Remote Support Facility (RSF) installation planning
The Remote Support Facility (RSF) provides communication to a centralized IBM support network for
problem reporting and service (IBM Service Support System), as well as providing a means for remote
operation of the Hardware Management Console. Communication with the IBM Remote Support Facility
is provided using an Internet connection.
IBM Remote Support Facility (RSF) is migrating to a new infrastructure. All transmissions are now
supported using the enhanced IBM Service Support System. Access to the traditional IBM Service Support
System is still required as backup to the new enhanced Service Support System.
Transmission to the enhanced IBM Support System requires a Domain Name Server (DNS) to be
available. It must be configured on the call-home server HMC Console or proxy server connecting to the
internet.
Choosing a communications method for remote support
You must choose method for connecting your server to IBM’s Service Support System through the
Remote Support Facility (RSF):
v A direct connection from the Hardware Management Console to the Internet. This method is fast,
reliable and uses the external customer firewall to control the connection.
v An indirect connection from the Hardware Management Console to the Internet using a proxy server.
This method has the advantages of the direct connection plus it allows your enterprise the added
control of the proxy. Potential additional advantages include the possibilities of logging and audit
facilities using the proxy server.
The following information is designed to provide your networking team with the information they need
to enable the Hardware Management Console to connect securely to the Internet.
Security characteristics of Remote Support Facility communications include:
v Remote Support Facility (RSF) requests are always initiated from the HMC to IBM. No inbound
connections are ever initiated from IBM’s Service Support System.
v All data is transferred using encrypted sockets.
v When the HMC initiates a connection to Remote Support Facility (RSF), it validates the trusted host by
its digital signature issued for the IBM Service Support System.
v Data sent to IBM consists solely of hardware problem information and configuration data. No
application or customer data is transmitted.
© Copyright IBM Corp. 2016, 2017
79
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Using the internet for remote support
The HMC can be enabled to connect directly to the Internet or to connect indirectly, through a proxy
server that you provide. The decision to use either a direct or indirect Internet connection for Remote
Support depends on the security and networking requirements of your enterprise.
Hardware Management Console Direct Internet Connection
If your Hardware Management Console can be connected to the Internet, and the external
firewall can be set to allow established TCP packets to flow outbound to the IP addresses
described in “Server address lists and host names,” you can use a direct connection between the
HMC and the Internet. The use of Source Network Address Translation (SNAT) and
masquerading rules to mask the HMC’s source IP address are both acceptable.
Hardware Management Console Indirect Connection with Proxy Server
For the Hardware Management Console to communicate successfully, your proxy server must
allow connections to port 443.
When using an indirect connection, you can choose whether the proxy is to be directed to connect
to the IBM Service Support System using an IP address or using a host name. You can control the
set of targets for that proxy using either a host name or IP address, depending upon the security
policies of your installation. See “Server address lists and host names” for the list of host names
and IP addresses.
If your installation requires host name addressing, your proxy must be configured with a Domain
Name Server.
Server address lists and host names
The internet-facing HMC or SSL Proxy requires outbound TCP/IP connections to be allowed to port 443
using the IP addresses that correspond the internet protocol used.
IPv4 addresses (LMC 2.12.1 and later)
Internet connectivity using IPv4 requires outbound connectivity to the following IP addresses:
v 129.42.26.224
v 129.42.42.224
v 129.42.50.244
v 129.42.54.189 (enhanced)
v 129.42.56.189 (enhanced)
v 129.42.60.189 (enhanced)
IPv6 addresses (LMC 2.12.1 and later)
Internet Protocol version 6 (IPv6) vastly extends the range of available IP addresses. Although IPv6 is not
required for remote support facility connection, IBM now offers the capability to migrate to IPv6.
The customer requires that the alternate HMC and the primary HMC are not to be connected to the same
switch, then the alternate HMC and the primary HMC must be defined on the same subnet and IPV6
multicast must flow both ways between the two HMCs.
Internet connectivity using IPv6 requires outbound connectivity to the following IP addresses:
v 2620:0:6c0:1::1000
v 2620:0:6c2:1::1000
v 2620:0:6c4:1::1000
v 2620:0:6c0:200:129.42.54.189 (enhanced)
v 2620:0:6c0:200:129.42.56.189 (enhanced)
v 2620:0:6c2:200:129.42.60.189 (enhanced)
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Host names
If a proxy is used to connect to the Internet and your installation requires host names to be used for
connections, your proxy must accept connections to the following host names:
| v www-945.ibm.com
v esupport.ibm.com
Chapter 7. Remote Support Facility (RSF) installation planning
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Chapter 8. Cabling and connectivity
Before you place your cable order, consider your future growth needs. You may wish to order cables
longer than you need right now to avoid expansion problems in the future.
As processor packaging evolves, internal locations for various cable connections may shift, necessitating
longer cables, even though the floor locations of connected devices have not changed.
Following are:
v A description of the top exit cabling option.
v A description of the IBM Site and Facilities Services.
v A list of customer fiber optic cabling responsibilities if the services are not elected.
v A description of the z13s or Rockhopper channel feature connections.
v A description of the Fiber Quick Connect fiber harness feature for FICON cables.
Top exit I/O cabling
The z13s or Rockhopper has an optional feature for top exit I/O cabling (FC 7920). These frame towers
for I/O top exit will add the following approximate measurements:
Table 34. Top exit I/O approximate measurements
Weight
Width
Height
35.38 kg (78 lbs) - two towers
17.69 kg (39 lbs) - one tower
152.4 mm (6 in)
2154 (84.8 in)
Note:
1. The height includes installed cable management brackets. The top of the top exit I/O cable towers are level with
the top of the A frame. Installing the cable management brackets adds 142.3 mm (5.6 in) inches to the overall
height of the system. The overall height of the system, with the cable management brackets installed, is 2154.0
mm (84.8 in) from the floor.
All I/O cables can be routed through the top exit towers, including those designated for the Fiber Quick
Connect feature. For 2965 servers installed on a nonraised floor, this can be the ideal solution for I/O
cabling.
The top exit towers are installed on the left side of the server (viewed from the front) and are mounted to
the side of the frame at the corners. A short left side cover fits between the towers.
© Copyright IBM Corp. 2016, 2017
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Level 00f
cable management
brackets
front
front
top exit I/O
cable towers
IBM Site and Facilities Services
IBM Site and Facilities Services has a comprehensive set of scalable solutions to address IBM cabling
requirements, from product-level to enterprise-level for small, medium, and large enterprises. These
services fall into two major categories:
v IBM Facilities Cabling Services - fiber transport system
v IBM IT Facilities Assessment, Design, and Construction Services - optimized airflow assessment for
cabling.
Planning and installation services for individual fiber optic cable connections are available. An assessment
and planning for IBM Fiber Transport System (FTS) trunking components can also be performed.
These services are designed to be right-sized for your products or the end-to-end enterprise, and to take
into consideration the requirements for all of the protocols and media types supported on z13s,
Rockhopper, z13™, Emperor, zBC12, zEC12, z114, z196, System z10®, System z9®, and zSeries (for
example, FICON, Coupling Links, OSA-Express) whether the focus is the data center, the Storage Area
Network (SAN), the Local Area Network (LAN), or the end-to-end enterprise.
IBM Site and Facilities Services are designed to deliver convenient, packaged services to help reduce the
complexity of planning, ordering, and installing fiber optic cables. The appropriate fiber cabling is
selected based upon the product requirements and the installed fiber plant.
The services are packaged as follows:
v Under IBM Facilities Cabling Services there is the option to provide IBM Fiber Transport System (FTS)
trunking commodities (fiber optic trunk cables, fiber harnesses, panel-mount boxes) for connecting to
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other z13s, Rockhopper, z13, Emperor, zBC12, zEC12, z114, z196, z10 BC, z10 EC, z9 BC, z9 EC, z890,
and z990 servers. IBM can reduce the cable clutter and cable bulk under the floor. An analysis of the
channel configuration and any existing fiber optic cabling is performed to determine the required FTS
trunking commodities. IBM can also help organize the entire enterprise. This option includes enterprise
planning, new cables, fiber optic trunking commodities, installation, and documentation.
v Under IBM IT Facilities Assessment, Design, and Construction Services there is the Optimized Airflow
Assessment for Cabling option to provide you with a comprehensive review of your existing data
center cabling infrastructure. This service provides an expert analysis of the overall cabling design
required to help improve data center airflow for optimized cooling, and to facilitate operational
efficiency through simplified change management.
Refer to the Services section of Resource Link at http://www.ibm.com/servers/resourcelink for further details.
Customer fiber optic cabling responsibilities
If you choose to plan and install your own I/O cabling, these are the specific tasks you must complete.
1. All cable planning and support
2. All purchasing of correct qualified cables
3. All installation of any required fiber optic or OSA-Express copper cables
4. All routing of cables to correct front/back floor cutouts for proper installation to the machine
5. If using the top exit I/O feature, you must install toroids on each copper Ethernet cable
6. All labeling of cables with PCHID numbers for proper installation to the machine.
Failure to accomplish these cabling tasks properly could lead to additional service charges during the
machine installation in order to correct any problems incurred.
All jumper cables, cable components, and connector options are available through IBM Global Services.
Contact your IBM installation planning representative, IBM product specialist, or IBM Connectivity
Services specialist for details.
Note: Customer cabling preparation does not include plugging cables into the z13s or Rockhopper.
CAUTION: Servicing of this product or unit is to be performed by trained service personnel only.
(C032)
FICON channel feature
The FICON Express16S features deliver up to 16 Gbps link data rate to servers, switches, control units
and storage devices. The FICON Express8S feature and the FICON Express8 feature deliver up to 8 Gbps
link data rate to servers, switches, control units and storage devices. FICON channels offer fast, efficient
data transfer while allowing reuse of currently installed single mode and multimode fiber optic cables.
Configuration information
Table 35 lists the FICON features. These features support two modes of operation:
v FC - native FICON
v FCP - Fibre Channel Protocol - attachment to SCSI disks in Linux on System z and z/VM®
environments.
Table 35. FICON feature codes
Feature code
FC 0418 (PCIe)
(2 ports)
Description
FICON Express16 LX
(Long Wavelength)
Fiber type
single mode 9 micron
(unrepeated distance - 10 KM / 6.2 MI)
Chapter 8. Cabling and connectivity
85
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Table 35. FICON feature codes (continued)
Feature code
Description
Fiber type
FC 0419 (PCIe)
(2 ports)
FICON Express16 SX
(Short Wavelength)
multimode 50 and 62.5 micron
(variable - maximum 860 m / 2822 ft)
FC 0409 (PCIe)
(2 ports)
FICON Express8S LX
(Long Wavelength)
single mode 9 micron
(unrepeated distance - 10 KM / 6.2 MI)
FC 0410 (PCIe)
(2 ports)
FICON Express8S SX
(Short Wavelength)
multimode 50 and 62.5 micron
(variable - maximum 860 m / 2822 ft)
FC 3325
(4 ports)
FICON Express8 LX
(Long Wavelength)
single mode 9 micron
(unrepeated distance - 10 KM / 6.2 MI)
FC 3326
(4 ports)
FICON Express8 SX
(Short Wavelength)
multimode 50 and 62.5 micron
(variable - maximum 860 m / 2822 ft)
Notes:
v All FICON Express feature codes use LC Duplex connectors.
v Each feature code represents a FICON base adapter with pluggable optic modules.
v Short wavelength and long wavelength optic modules cannot be mixed on the same FICON base
adapter.
v Short wavelength and long wavelength features (FICON adapters) can coexist in the same I/O drawer
or PCIe I/O drawer.
See “FICON references” on page 87 for information about link distances and light loss budget.
The following illustrations show the FICON features, the ports on the feature, and the type of connector
used.
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FCs 0409/0410
FICON Express8S
FCs 0418/0419
FICON Express16S
channel port
LC duplex connector
channel port
channel port
LC duplex connector
channel port
LC duplex connector
LC duplex connector
FCs 3325/3326
FICON Express8
FRU
channel port
LC duplex connector
D1
B1
C1
channel port
LC duplex connector
D2
B2
C2
D3
channel port
B3
C3
LC duplex connector
D4
channel port
B4
C4
LC duplex connector
Figure 8. FICON Express features
FICON references
For additional information on planning for FICON channels see:
v Planning for Fiber Optic Links (FICON/FCP, Coupling Links, Open System Adapters, and zHyperLink Express)
v FICON Channel-to-Channel Reference
Chapter 8. Cabling and connectivity
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OSA-Express LAN features
Open Systems Adapter-Express (OSA-Express) features enable connectivity to industry-standard local area
networks (LANs).
Configuration information
Table 36 lists the supported OSA-Express features.
Table 36. OSA-Express feature codes
Feature code
Feature description
Cable description
Connector type
FC 0413 (PCIe)
(2 ports)
OSA-Express5S GbE LX
9 micron single mode
LC Duplex
FC 0414 (PCIe)
(2 ports)
OSA-Express5S GbE SX
50 and 62.5 micron multimode
LC Duplex
FC 0415 (PCIe)
(1 port)
OSA-Express5S 10 GbE LR
9 micron single mode
LC Duplex
FC 0416 (PCIe)
(1 port)
OSA-Express5S 10 GbE SR
50 and 62.5 micron multimode
LC Duplex
FC 0417 (PCIe)
(2 ports)
OSA-Express5S 1000BASE-T
Category 5 UTP copper wire
RJ-45
FC 0404 (PCIe)
(2 ports)
OSA-Express4S GbE LX
9 micron single mode
LC Duplex
FC 0405 (PCIe)
(2 ports)
OSA-Express4S GbE SX
50 and 62.5 micron multimode
LC Duplex
FC 0406 (PCIe)
(1 port)
OSA-Express4S 10 GbE LR
9 micron single mode
LC Duplex
FC 0407 (PCIe)
(1 port)
OSA-Express4S 10 GbE SR
50 and 62.5 micron multimode
LC Duplex
Notes:
1. This feature can only be carried forward. This feature is only available with z13s models.
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FCs 0413/0414
OSA Express5S
Gigabit Ethernet LX/SX
LAN port 0
LC Duplex Connector
FCs 0415/0416
OSA Express5S
10 Gigabit Ethernet LR/SR
LAN port 0
LC Duplex Connector
LAN port 1
LC Duplex Connector
FC 0417
OSA Express5S
1000Base-T Ethernet
RJ-45 Connector
FRU
D1
LAN port 0
A1
B1
D2
LAN port 1
A2
B2
RJ-45 Connector
Figure 9. OSA-Express5S features
Chapter 8. Cabling and connectivity
89
Level 00f
FCs 0404/0405
OSA Express4S
Gigabit Ethernet LX/SX
LC Duplex Connector
LAN port 0
P0
J00
LAN port 1
A
0
B
0
A
1
B
1
J01
P1
P0
P1
F
R
U
LC Duplex Connector
FCs 0406/0407
OSA Express4S
10 Gigabit Ethernet LR/SR
LAN port 0
A0
J00
P0
F
R
U
LC Duplex Connector
Figure 10. OSA-Express4S features
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OSA-Express reference
For additional information on planning for OSA features, see:
v Open System Adapter-Express Integrated Console Controller Dual Port User’s Guide
v Open Systems Adapter-Express Customer's Guide and Reference
v Planning for Fiber Optic Links (FICON/FCP, Coupling Links, Open System Adapters, and zHyperLink Express)
I/O interconnect links
An HCA2-C fanout card (FC 0162) supports one copper cable 12x InfiniBand DDR 6 GBps interconnect.
This connects to the one IFB-MP card in an I/O drawer. A single IFB-MP card controls an I/O domain
that contains four channel cards. InfiniBand coupling communications is only available with z13s models.
A PCIe fanout card (FC 0173) supports one copper cable PCIe 8 GBps interconnect. This connects to the
one PCI-IN card in a PCIe I/O drawer. A single PCI-IN card controls an I/O domain that contains eight
channel cards.
Coupling features
The 2965 supports the following coupling features.
Feature code
|
|
Description
Maximum # of
features
Maximum
connections
Order
increments per
feature
Fiber type
Connector
type
FC 0171
1
HCA3-O
8
16 links
2 links
SX laser 50
micron
MPO
FC 0170
1
HCA3-O LR
8
32 links
4 links
9 micron single
mode
LC Duplex
FC 0172
ICA SR
8
16 links
2 links
SX laser 50
micron
MTP
FC 0433
Coupling
Express LR
16
32 links
2 links
9 micron single
mode
LC Duplex
Note:
1. FC 0170 and FC 0172 can be carried forward or can be purchased on a new build.
Chapter 8. Cabling and connectivity
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HCA3-O feature (FC 0171)
Note: InfiniBand coupling communications using HCA3-O (FC 0171) is not available with LinuxONE
models.
The HCA3-O feature (FC 0171) supports 12x InfiniBand for coupling communication between systems,
and it resides in the GX++ (Infiniband) fanout slot in the CPC drawer. If you are planning to install 12x
InfiniBand links, you will have to place connected servers no further than 150 meters (492 feet) from each
other.
12x InfiniBand provides up to a 6.0 GBps1 fiber optic connection between z13, z13s, zEC12, and zBC12
servers. A 12x InfiniBand fiber optic cable (50 micron multimode OM3) connects directly to a port on the
HCA3-O fanout card.
The following cables are all duplex 24-fiber cable assemblies, SX laser 50 micron, using MPO connectors
on both ends.
Table 37. InfiniBand cable part numbers for FC 0171
Part number
Length
meters (feet)
41V2466
10.0 (32.8)
15R8844
13.0 (42.7)
15R8845
15.0 (49.2)
41V2467
20.0 (65.6)
41V2468
40.0 (131.2)
41V2469
80.0 (262.4)
41V2470
120.0 (393.7)
41V2471
150.0 (492.1)
42V2083
Custom (Custom)
Notes:
1. The link data rates, (for example, 6.0 GBps, 8.0 GBps, and 5 Gbps), do not represent the performance
of the links. The actual performance is dependent upon many factors including latency through the
adapters, cable lengths, and the type of workload.
2. You must supply InfiniBand cables as you do with other fiber optic systems (FICON, OSA).
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HCA3-O LR feature (FC 0170)
Note: InfiniBand coupling communications using HCA3-O LR (FC 0170) is not available with LinuxONE
models.
The HCA3-O LR feature (FC 0170) supports 1x Long Reach (LR) InfiniBand for coupling communication
between systems, and it resides in the GX++ (Infiniband) fanout slot in the CPC drawer. 1x IFB coupling
links support a maximum unrepeated distance of 10 kilometers (6.2 miles) and the maximum repeated
distance is 100 kilometers (62 miles) when attached to a qualified DWDM.
1x Long Reach (LR) InfiniBand provides up to a 5.0 Gbps1 fiber optic connection.
A 1x LR InfiniBand fiber optic cable (9 micron single mode) connects directly to a port on the HCA3-O
LR fanout card.
Notes:
1. The link data rates, (for example, 6.0 GBps, 8.0 GBps, and 5 Gbps), do not represent the performance
of the links. The actual performance is dependent upon many factors including latency through the
adapters, cable lengths, and the type of workload.
2. You must supply InfiniBand cables as you do with other fiber optic systems (FICON, OSA).
Chapter 8. Cabling and connectivity
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Integrated Coupling Adapter (ICA SR) feature
IBM Integrated Coupling Adapter (ICA SR) feature (FC 0172) supports PCIe Gen3 for coupling
communication between systems, and it resides in the PCIe fanout slot in the CPC drawer. If you are
planning to install PCIe Gen3 links, you will have to place connected servers no further than 150 meters
(492 feet) from each other.
PCIe Gen3 provides up to a 8.0 GBps* fiber optic connection between z13s and z13 servers. A PCIe Gen3
fiber optic cable (150 m - 50 micron multimode OM4; 100 m - 50 micron multimode OM3) connects
directly to a port on the ICA SR fanout card. It is recommended that you order ICA SR cabling through
Anixter or IBM Global Technology Services® to get IBM qualified cables. For more information, see
Planning for Fiber Optic Links (FICON, Coupling Links, Open System Adapters, and zHyperLink Express) .
Note: * The link data rates, (for example, 6.0 GBps, 8.0 GBps, and 5 Gbps), do not represent the
performance of the links. The actual performance is dependent upon many factors including latency
through the adapters, cable lengths, and the type of workload.
| You can order ICA SR (FC 0172) in increments of one feature (2 ports), up to a maximum of 8 features (16
| ports).
The following cables are all simplex 24-fiber cable assemblies, SX laser 50 micron, using MTP connectors
on both ends.
Table 38. ICA SR cable part numbers for FC 0172.
94
Part number
Length
meters (feet)
Cable type
00JA687
8.0 m (26.3 ft)
OM4
00LU282
10.0 m (32.9 ft)
OM4
00LU283
13.0 m (42.7 ft)
OM4
00JA688
15.0 m (49.3 ft)
OM4
00JA689
20.0 m (65.7 ft)
OM4
00LU284
40.0 m (131.3 ft)
OM4
00LU285
80.0 m (262.5 ft)
OM4
00LU286
120.0 m (393.8 ft)
OM4
00LU287
150.0 m (492.2 ft)
OM4
00LU288
custom length < 150.0 m (492.2 ft)
OM4
00JJ548
8.0 m (26.3 ft)
OM3
00LU290
10.0 m (32.9 ft)
OM3
00LU291
13.0 m (42.7 ft)
OM3
00JJ549
15.0 m (49.3 ft)
OM3
00JJ550
20.0 m (65.7 ft)
OM3
00LU292
40.0 m (131.3 ft)
OM3
00LU293
80.0 m (262.5 ft)
OM3
00LU294
100.0 m (328.1 ft)
OM3
00LU295
custom length < 100.0 m (328.1 ft)
OM3
z13s IMPP
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|
Coupling Express LR feature (FC 0433)
| Coupling Express LR feature (FC 0433) supports 10 GbE RoCE for long-distance point-to-point coupling
| communications between z13 and z13s systems. The Coupling Express LR adapter connects to a card slot
| in the PCIe I/O drawer.
|
|
|
|
|
|
|
|
Coupling Express LR is a two-port, Ethernet-based coupling card with a data rate of 10.0 GBps* and a
maximum unrepeated distance of 10 km and a maximum repeated distance of 100 km with a qualified
Dense Wavelength Division Multiplexing (DWDM) device. Coupling Express LR utilizes a 9 micron single
mode cable that connects to the Coupling Express LR card using LC Duplex connectors on both ends.
Coupling Express LR can only connect to another Coupling Express LR. It is recommended that you
order Coupling Express LR cabling through IBM Global Technology Services to get IBM qualified cables.
For more information, see Planning for Fiber Optic Links (FICON/FCP, Coupling Links, Open System Adapters,
and zHyperLink Express).
| Note: * The link data rates, (for example, 6.0 GBps, 8.0 GBps, 5 Gbps, and 10 Gbps), do not represent the
| performance of the links. The actual performance is dependent upon many factors including latency
| through the adapters, cable lengths, and the type of workload.
| You can order Coupling Express LR in increments of one feature (2 ports), up to a maximum of 16
| features (32 ports). Coupling Express LR supports up to four CHPIDs per port.
|
FC 0433
port 1
LC Duplex Connector
port 2
LC Duplex Connector
|
Coupling Express LR
|
Flash Express (FC 0402 and FC 0403)
Flash Express (FC 0402 and FC 0403) provides a special programming interface to move data between the
Flash Express and host DRAM. It enables z/OS to access blocks of flash storage as storage locations in a
logical partition. The Flash Express card is designed to help improve availability and performance.
Each Flash Express feature provides two cards. You can order up to four features, which will provide
eight cards.
Each pair of Flash Express features requires interconnect cabling and specific plugging rules to manage
the pairing.
Flash Express (FC 0402 and FC 0403) can only be installed in a PCIe I/O drawers
Chapter 8. Cabling and connectivity
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Figure 11. Flash Express feature
Native PCIe adapters
The 10GbE RoCE Express and zEDC Express features utilize industry standard PCIe adapters (called
native PCIe adapters). The adaptation layer and the associated ASIC (both of which are part of the
FICON, OSA, OSC, Crypto, and Flash features) are no longer needed with 10GbE RoCE Express or zEDC
Express. With the elimination of the adaptation layer, the 10GbE RoCE Express and zEDC Express
features are designed to offer significant performance. They physically plug into a mother card that
provides Vital Product Data (VPD) and hot-plug capability. The features then plug into the PCIe I/O
drawer.
Table 39 lists the current supported native PCIe adapters.
Table 39. Native PCIe adapter feature codes
Feature code
Description
FC 0411
10GbE RoCE Express
FC 0420
zEDC Express
These native cards do not have CHPID assignments. They have Virtual Functions (VFs) that are defined
in IOCP/HCD. PCHIDs are still applicable with native cards.
10GbE RoCE Express (FC 0411)
RoCE stands for RDMA (Remote Direct Memory Access) over Converged Ethernet. Using 10GbE RoCE
Express (FC 0411), RDMA technology is available on Ethernet. RDMA technology provides the capability
to allow hosts to logically share memory. 10GbE RoCE Express, in conjunction with an OSA card, enables
shared memory communications between two CPCs using a shared switch, which is customer supplied.
10GbE RoCE Express does not use a CHPID number and does not require a CHPID type.
You can use 10GbE RoCE Express to help reduce network latency with memory-to-memory transfers
utilizing Shared Memory Communications- Remote Direct Memory Access (SMC-R) in z/OS V2.1. It is
transparent to applications and can be used for LPAR-to-LPAR communication on a single z/OS system
or server-to-server communication in a multiple CPC environment.
10GbE RoCE Express uses existing Ethernet fabric (switches with Global Pause enabled), and requires a
standard 10 GbE switch (CEE enabled switch is not required).
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You can order 10GbE RoCE Express in increments of two ports, up to a maximum of 32 ports (16
features). There are two ports per feature.
FC 0411
10 Gigabit Ethernet RoCE Express
LAN port 0
LC Duplex Connector
LAN port 1
LC Duplex Connector
Figure 12. 10GbE RoCE Express feature
zEnterprise Data Compression (zEDC) Express (FC 0420)
The zEDC Express feature and the IBM zEnterprise Data Compression (zEDC) acceleration capability in
z/OS are designed to help improve cross-platform data exchange, reduce CPU consumption, and save
disk space. zEDC Express is designed to allow higher write rates for SMF data when hardware
compression is enabled. zEDC Express can be shared by up to 15 LPARs.
You can order zEDC Express in increments of one feature, up to a maximum of 8 features. Pairing is not
required, but highly suggested for reliability and availability purposes.
FC 0420
zEDC Express
F
R
U
59AB
Figure 13. zEDC Express feature
Chapter 8. Cabling and connectivity
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Regional Crypto Enablement (RCE) Vendor 1
If Regional Crypto Enablement (RCE) Vendor 1 (FC 0901) was ordered, airflow plates will be installed in
the slots in the PCIe I/O drawer designated for the RCE Vendor 1 cards. Before the IBM representative
installs any RCE Vendor 1 cards, the following conditions must be satisfied:
v The customer must provide the RCE Vendor 1 cards from a reliable vendor. IBM does not supply these
RCE Vendor 1 cards.
v The customer must have a Linux LPAR partition established prior to the installation of the RCE Vendor
1 cards.
v The system must be in Service Code 33 prior to adding the RCE Vendor 1 cards.
v The plug location of each RCE Vendor 1 card must be identified. They will be located in the CHPID
report that the customer uses. You can obtain this information directly from the customer or obtain the
report from http://www.ibm.com/servers/resourcelink (Tools --> CHPID Mapping Tool).
Note: Installation of RCE Vendor 1 (FC 0901) is not covered under the machine installation. It requires a
local service contract for the IBM representative to recover time and material expenses.
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Time synchronization
Synchronized time is possible with a z13s or Rockhopper in a Sysplex environment using Server Time
Protocol (STP). STP supports Coordinated Timing Networks (CTNs) where the z13s or Rockhopper
machines in the network are configured to be in STP timing mode.
Server time protocol
Server Time Protocol (FC 1021) requires no special cables to create timing links with other servers.
Depending on the distance between servers in a timing network, you may use InfiniBand (HCA3-O (FC
0171) or HCA3-O LR (FC 0170) fiber optic cables or PCIe Gen3 (ICA SR feature (FC 0172) ) fiber optic
cables to create the Sysplex. z13s or Rockhopper can participate in a timing network with z13, Emperor,
z13s, Rockhopper, zEC12, zBC12, z196, and z114. STP on z13s or Rockhopper only supports STP-only
timing networks.
Note: HCA3-O and HCA3-O LR are only available with z13s models.
Pulse per second
An STP CTN has the capability of configuring as its time source a Network Time Protocol (NTP) time
server that has a pulse per second (PPS) output signal. This type of external time device is available
worldwide from several vendors that provide network timing solutions. Typically, the NTP output of the
time server is connected to the Support Element LAN because the NTP client runs on the Support
Element. The PPS output of the NTP time server is connected to the PPS input coaxial connector
provided on the oscillator card on the z13s. Note that pulse per second is only available for z13, Emperor,
z13s, Rockhopper, zEC12, zBC12, z196, or z114 . The following illustration shows the location of the
oscillator card on the z13s or Rockhopper.
oscillator card
PPS port 0
J01 and J02
J01 and J02
DCA Logic Blwr
PWR PWR Good
DCA Logic Blwr
PWR PWR Good
J03
J03
J01 and J02
oscillator card
PPS port 1
J01 and J02
DCA Logic Blwr
PWR PWR Good
DCA Logic Blwr
PWR PWR Good
J03
J03
| The pulse per second (PPS) port on the oscillator cards requires a signal with the characteristics listed in
| Table 40. Your network timing solution vendor can assist with the necessary cabling and signal
| distribution hardware required to meet these characteristics for your specific machine installation.
| With a low signal loss PPS distribution, timing solutions can be achieved that exceed 150 feet (45 meters)
| between the last distribution point and the oscillator card PPS port.
| For the input signal received at the oscillator card PPS port, the rise time/fall time of the PPS signal must
| be shorter as 50 microseconds.
|
Table 40. PPS signal characteristics
|
Unit of measure
Minimum
Typical
Maximum
|
Voltage Level LOW
volt
0
0,15
|
Voltage Level HIGH
volt
3,2
5,2
|
Rise time
microsecond
50
|
Fall time
microsecond
50
|
Pulse width
millisecond
50
125
450
Chapter 8. Cabling and connectivity
99
Level 00f
|
Ordering PPS cables
If you are planning to place this server in an STP-only Coordinated Timing Network using NTP with
pulse per second as the external time source, you must supply the coaxial cables that connect the z13s or
Rockhopper to the NTP server providing the PPS signal.
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Fiber Quick Connect for FICON cabling
Fiber Quick Connect harness cabling, harness brackets and mounting hardware are ordered with the z13s
or Rockhopper as feature codes. The feature codes are:
Table 41. Fiber Quck Connect feature codes
Feature codes
Description
7932
FQC bracket and mounting hardware
7933
LC Duplex 2012 mm (6.6 ft.) harness (FICON)
The Fiber Quick Connect feature enables trunk cables to connect to FICON channels using
under-the-cover attachment harnesses. These harnesses are installed when your system is built, and your
z13s or Rockhopper arrives ready to connect the trunk cables at your site.
Figure 14 shows the Fiber Quick Connect feature hardware.
MTP connector
LC Duplex (FICON) harness
harness bracket
Figure 14. Fiber Quick Connect feature hardware
The harness brackets use an MTP connector, and the FICON connectors are routed to the feature cards
the frame.
The following provides the FQC brackets plugging locations and sequence along the tailgate. Also, see
Figure 15 on page 102.
Chapter 8. Cabling and connectivity
101
Level 00f
v A-frame front - A00B (1), A00C (2)
v A-frame rear - A00Y (1), A00X (2)
A frame - front side
fiber cables into system
A
B
C
D
E
F
G
H
J
K
L
M
frame
horizontal
units
bracket
A00B
A00C
1
2
3
4
5
6
7
8
9
A
B
C
E
F
G
J
K
L
fiber cables under floor
bracket (top view)
(12 sockets per bracket)
A frame - rear side
N
P
Q
R
S
T
U
V
W
X
Y
Z
A00X
A00Y
1
2
3
4
5
6
7
8
9
N
P
Q
S
T
U
W
X
Y
single high fiber trunk
bracket positions
along tailgate
(top view)
frame
horizontal
units
single high fiber trunk
bracket positions
along tailgate
(top view)
Figure 15. Fiber Quick Connect - underfloor I/O
Fiber Quick Connect mounting brackets can also be installed at EIA positions 02, 10, and 19 in the I/O
top exit towers. (The harness bracket is installed on the Fiber Quick Connect mounting bracket.)
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EIA 19
EIA 10
EIA 02
Figure 16. Fiber Quick Connect mounting brackets
If you are planning to use the Fiber Quick Connect feature for FICON channels, contact IBM
Networking Services for assistance. Networking Services will help you plan for the trunking cabling
solution that meets your individual system requirements. Your IBM installation planning representative,
IBM product specialist, or IBM service representative will provide you with the information necessary to
contact Networking Services.
Preparing configuration definition
The customer is responsible for preparing a definition of the I/O configuration for the new processor.
You should use the PCHID report from the order process configurator as a guide for planning and
defining the new configuration. Depending on the current operating environment there may be several
methods for accomplishing this.
z/VM
If you use HCM and HCD, develop the configuration using HCM and HCD. Otherwise, develop the
IOCP statements necessary to define your configuration and use the level of the ICP IOCP program that
supports the new processor to verify the input statements. You do not need to initially assign PCHID
values to the channel paths in your configuration. You can use the CHPID Mapping Tool, available from
Resource Link at http://www.ibm.com/servers/resourcelink, to aid you in assigning PCHIDs to CHPIDs. HCM
Chapter 8. Cabling and connectivity
103
Level 00f
and HCD users must build an IOCP input data set from a validated work IODF and use this as input to
the CHPID Mapping Tool. The CHPID Mapping Tool updates the IOCP input and assigns PCHIDs to the
CHPIDs.
Note: An IOCP input file that was created by HCM and HCD without PCHIDs must be migrated back
into HCM and HCD after PCHID numbers have been added to the file by the CHPID Mapping Tool. An
IOCDS can then be written from a production IODF or IOCP statements can be built for the install
diskette.
If you are installing a new processor, transfer the IOCP statements for your configuration to a diskette. If
necessary, the IOCP input file can be compressed using a zip-compatible program. When the new system
arrives, give the diskette containing the IOCP input statements to the install team.
If you are installing a new processor, instead of using a diskette you can remotely write the IOCDS from
an HCD that is running on an installed CPC in the same HMC cluster. Inform the install team that plans
are in place to use the “Build and manage S/390 microprocessor IOCDSs” option in HCD to write the
IOCDS.
z/VSE®
Develop the IOCP statements necessary to define your configuration and use the level of the ICP IOCP
program that supports the new processor to verify the input statements. You do not need to initially
assign PCHID values to the channel paths in your configuration. You can use the CHPID Mapping Tool,
available from Resource Link at http://www.ibm.com/servers/resourcelink, to aid you in assigning PCHIDs to
CHPIDs. The CHPID Mapping Tool updates the IOCP input and assigns PCHIDs to the CHPIDs.
If you are installing a new processor, transfer the IOCP statements for your configuration to a diskette. If
necessary, the IOCP input file can be compressed using a zip-compatible program. When the new system
arrives, give the diskette containing the IOCP input statements to the install team.
z/OS HCD
Develop the configuration using HCD. You do not need to initially assign PCHID values to the channel
paths in your configuration. You can use the CHPID Mapping Tool, available from Resource Link at
http://www.ibm.com/servers/resourcelink, to aid you in assigning PCHIDs to CHPIDs. Build an IOCP input
data set from a validated work IODF and use this as input to the CHPID Mapping Tool. The CHPID
Mapping Tool updates the IOCP input and assigns PCHIDs to the CHPIDs. Migrate the modified IOCP
input file back into HCD after PCHID numbers have been added to the file by the CHPID Mapping Tool.
An IOCDS can then be written in preparation for an upgrade using a production IODF.
Note: An IOCP input file that was created by HCD without PCHIDs must be migrated back into HCD
after PCHID numbers have been added to the file by the CHPID Mapping Tool. An IOCDS can then be
written from a production IODF or IOCP statements can be built for the install diskette.
If you are installing a new processor, build an IOCP input data set for your configuration from a
production IODF and transfer the IOCP statements to a diskette. In the unlikely event that the IOCP
input file exceeds the capacity of the diskette, the IOCP input file can be compressed using a
zip-compatible program. When the new system arrives, give the diskette containing the IOCP input
statements to the install team.
If you are installing a new processor, instead of using a diskette you can remotely write the IOCDS from
an HCD that is running on an installed CPC in the same HMC cluster. Inform the install team that plans
are in place to use the “Build and manage S/390 microprocessor IOCDSs” option in HCD to write the
IOCDS.
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Chapter 9. Parallel sysplex planning
This chapter is intended to provide guidance to those customers who operate in a Parallel Sysplex
environment. A Parallel Sysplex typically involves multiple processors and coupling facilities, shared I/O
devices, and a host of interconnection possibilities. Detailed planning for a Parallel Sysplex is essential to
meet technical objectives, such as performance and high availability, within the constraints of a specific
raised floor configuration. Consider using the Fiber Optic Cabling Service to plan your sysplex
environment. A list of tasks the Service can perform is provided under “IBM Site and Facilities Services”
on page 84. Different technologies for servers, links and coupling facilities affect your ability to configure
a productive sysplex.
The basic premise for a successful Parallel Sysplex installation is to centralize the physical location of the
coupling facilities, and then position the sysplex servers around that center. Servers can be placed
side-to-side. In addition to bringing the servers closer to the coupling facility, placing your server
side-to-side provides for better management of hot and cold air flow.
Note:
1. z13s can only participate in an STP-only timing network. z13s cannot participate in a Mixed timing
network where ANY system is connected to a Sysplex Timer.
2. z13s can only communicate directly with z13, z13s, zEC12, zBC12, z196, and z114.
External
Coupling
Facility
Following are some guidelines to help you better plan for multiple system interconnection. These are
example configurations that would minimize the distance to the coupling facility.
1. Position the coupling facilities (or servers with internal coupling facilities) in the center of an open
area of raised floor large enough to accommodate all of the servers and other coupling facilities to
which you want to connect.
v Use physical planning information for each type of server/coupling facility you intend to add to
the Parallel Sysplex to help determine how much floor space you will need.
© Copyright IBM Corp. 2016, 2017
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v Remember to consider weight distribution, service clearances, power, and cooling for each piece of
equipment you want to include.
2. Arrange the sysplex in two rows, with the fronts of servers and coupling facilities facing each other
(see the illustration under “Weight distribution and multiple systems” on page 35). Allow a 1.22 meter
(48 inch) aisle width between the rows. Although this may be a larger aisle than you have used
before, your Parallel Sysplex will benefit from the improvement in cooling that a wider aisle provides.
(See the illustration under “Cooling recommendations for the room” on page 39.)
Central
External
Coupling
Coupling
Facility
Note: The system air flow illustration shows a minimum aisle width of 941 mm (37 in). Although this
width is adequate for a congested computer room floor, it is the minimum you should use. An aisle
1.22 m (48 in) wide will better serve the cooling and cabling needs of a Parallel Sysplex configuration.
ICF
= 610 mm (24 in) floor tiles
= Cool aisle, 1.22 meters
= Perforated floor tile
= Exhaust (heated air from
| 3. Sysplex connections can be made using InfiniBand, Coupling Express LR, or ICA SR cabling.
4. As the Parallel Sysplex grows, add new servers evenly on either side of the central coupling facilities.
106
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Central
External
Coupling
Coupling
Facility
Facility
Level 00f
ICF
= 610 mm (24 in) floor tiles
= Cool aisle, 1.22 meters
= Perforated floor tile
= Exhaust (heated air from
| 5. As the Parallel Sysplex evolves, it is possible to add rows using InfiniBand, Coupling Express LR, or
ICA SR links, which provide connectivity over greater distances than previous links. With the
equipment in these new rows centered on the original central coupling facilities, the Parallel Sysplex
now assumes the shape of a diamond.
Chapter 9. Parallel sysplex planning
107
Central
External
Coupling
Coupling
Facility
Facility
Level 00f
ICF
= 610 mm (24 in) floor tiles
= Cool aisle, 1.22 meters
= Perforated floor tile
= Exhaust (heated air from
By following these guidelines, you will be able to configure a Parallel Sysplex, using the minimum
amount of floor space, that meets your performance and availability objectives. The use of technology
combinations - z13, z13s, zEC12, zBC12, z196, and z114 servers and coupling facilities - may complicate
your physical planning, but the basic strategies outlined here will result in a successful Parallel Sysplex
environment.
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Appendix A. IBM standard symbols
In Plan Views:
Cable Entry and Exit Area in the
base of the machine. Locating
dimensions are measured from
the edge of the frame, not the
cover. This does not indicate the
floor cutout.
(Without
feature)
Service Area Boundary
(Service clearances are measured
from the machine with covers closed)
Casters
Locating dimensions are measured
from the edge of the frame, not the cover.
Cable Exit Area, recommended
Power Cord exit, 50/60 Hz
Leveling pads or glides
(90 mm [3 1/2 in] typical diameter)
Locating dimensions are measured
from the edge of the frame, not the cover.
Power Cord exit, 400 Hz
Legs
Power cords are supplied in 4.2 m (14 ft) lengths
unless otherwise noted on the specification page.
The length is measured from the symbol
or .
Non-raised floor cable exit
Meter location
Swinging Gate
Unit Emergency Switch
Standard equipment outline
(shows the machine with covers closed)
Hinged Covers
Optional equipment outline
Single
Customer Engineer
Indicator Panel
In Cabling Schematics:
801
Indicates a cable group
coming from a machine
Bifold
Offset Bifold
800
503
Indicates a cable group
going to a machine
504
© Copyright IBM Corp. 2016, 2017
109
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Appendix B. Hardware Management Console physical
specifications
This section contains information for the Hardware Management Console components applicable at the
time of publication (determined by the edition notice at the front of this document). Specifications for
your Hardware Management Console may differ from those presented below.
Notes for FC 0096 and FC 0094:
v When planning to use the rack mounted HMC (FC 0094) or HMC (FC 0096), you must provide the
rack where the HMC and console unit (holding the keyboard and display) are installed. It is
recommended that you install the rack-mounted HMC below the keyboard/display in the
customer-provided rack.
v For USA and Canada, the HMC (FC 0094) and HMC (FC 0096) uses two PDU plug positions for the
two AC power supplies in the server. (Other power requirements are country dependent.)
v Do not block any air vents; usually 15 cm (6 in) of space provides proper airflow.
v Do not leave open spaces above or below an installed server in your rack cabinet. To help prevent
damage to server components, always install a blank filler panel to cover the open space and to help
ensure proper air circulation.
v Install the server only in a rack cabinet with perforated doors.
v Plan the device installation starting from the bottom of the rack cabinet.
v Install the heaviest device in the bottom of the rack cabinet.
v Do not extend more than one device out of the rack cabinet at the same time.
v Connect the server to a properly grounded outlet.
v Do not overload the power outlet when you install multiple devices in the rack cabinet.
v For FC 0094, install the server in a rack that meets the following requirements:
– Minimum depth of 70 mm (2.76 in) between the front mounting flange and inside of the front door.
– Minimum depth of 157 mm (6.18 in) between the rear mounting flange and inside of the rear door.
– Minimum depth of 718 mm (28.27 in) and maximum depth of 762 mm (30 in) between the front and
rear mounting flanges to support the use of the cable management arm.
The maximum distance between the front and the rear EIA rails of the rack is 810 mm (31.9 in).
v For FC 0096, install the server in a rack that has a minimum depth of 28.25 in (720 mm) and maximum
depth of 30 in (762 mm).
© Copyright IBM Corp. 2016, 2017
111
Level 00f
Table 42. Hardware Management Console (FC 0096) specifications
FC 0096 - Hardware Management Console system unit specifications
Dimensions
Height
4.45 cm (1.75 in)
Width
48.26 cm (19 in)
Depth
71.12 cm (28.0 in)
Weight maximum configuration
15.97 kg (35.2 lb)
Input Power1
Low range input voltage
90 Vrms - 137 Vrms
High range input voltage
180 Vrms - 265 Vrms
Input frequency range
47 - 63 Hz
Input kilovolt-amperes (kVA) (approximate)
Minimum configuration
0.134 kVA
Maximum configuration
0.988 kVA
Environmentals
Server On
Temperature
5° to 50° C (41° to 122° F)
Humidity, non-condensing:
Dew point
-12° C (10.4° F)
Relative humidity
8% - 93%
Storage (non-operating)
Temperature
-40° to 60° C (-40° to 140° F)
Relative humidity
5% - 100%
1. Power consumption and heat output vary with the number and type of optional features installed and the
power-management optional features in use.
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Table 43. Hardware Management Console (FC 0094) specifications
FC 0094 - Hardware Management Console system unit specifications
Dimensions
Height
43 mm (1.7 in.)
Width
429 mm (16.9 in.)
Depth
734 mm (28.9 in.)
Weight maximum configuration
16.4 kg (36.16 lbs.)
Input Power1
Low range input voltage
100 VAC - 127 VAC
High range input voltage
200 VAC - 240 VAC
Input frequency range
50 - 60 Hz
Input kilovolt-amperes (kVA) (approximate)
Minimum configuration
0.14 kVA
Maximum configuration
0.90 kVA
Output Power1
Heat output in British thermal units (Btu) (approximate)
Minimum configuration
461 Btu/hr (135 watts)
Maximum configuration
2900 Btu/hr (850 watts)
Environmentals
Server On
Temperature with altitude: 0 to 950 m (3117 ft)
5° to 40° C (41° to 104° F)
Temperature with altitude: greater than 950 m (3117 ft) derated 1°C (33.8° F) per 175 m (575 ft)
Temperature at maximum altitude 3050 m (10,007 ft)
5° to 28° C (41° to 82.4° F)
Humidity, non-condensing:
Dew point
-12° C (10.4° F)
Relative humidity
8% - 85%
Maximum dew point
24° C (75.2° F)
Server Off
Temperature
5° to 45° C (41° to 113° F)
Relative humidity
8% - 85%
Maximum dew point
27° C (80.6° F)
Storage (non-operating)
Temperature
1° to 60° C (33.8° to 140° F)
Altitude
3050 m (10,007 ft)
Relative humidity
5% - 80%
Maximum dew point
29° C (84.2° F)
Shipping (non-operating)
Temperature
-40° to 60° C (-40° to 140° F)
Altitude
10,700 m (35,105 ft)
Relative humidity
5% - 100%
Maximum dew point
29° C (84.2° F)
Appendix B. Hardware Management Console physical specifications
113
Level 00f
Table 43. Hardware Management Console (FC 0094) specifications (continued)
FC 0094 - Hardware Management Console system unit specifications
1. Power consumption and heat output vary with the number and type of optional features installed and the
power-management optional features in use.
114
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Notes for FC 0095:
| v When installing the chassis, ensure that a minimum free air space is available around the system. The
|
installation should have a minimum of 4 in -6 in (101 mm -152 mm) behind the chassis and 7 in - 8
|
in(178 mm - 203 mm) in front of the chassis. Any front cabinet doors or access aisles must
|
accommodate a 2461 HMC (FC 0095) front chassis clearance of at least 7.0 in (178 mm) in order to
|
provide proper clearance for the fan FRU. Ideally, a chassis clearance of 0.5 in -1.5 in (13 mm -38 mm)
|
above the system is desirable.
| v The 2461 HMC (FC 0095) system is designed with ruggedness in mind, however, precautions should be
|
observed to ensure safe and reliable performance. Place the chassis on a flat, stable surface capable of
|
supporting both the system weight and any anticipated peripherals. Installation area should be secure
|
and free from danger of liquid or airborne contaminants that could damage internal components as
|
well as supporting all airflow requirements.
| v To protect internal components from electrostatic damage, be sure to observe the following
|
precautionswhen handling or storing the system:
|
– The 2461 HMC (FC 0095) has a net chassis weight of approximately 41.0 lbs. (18.59 kg). Use proper
|
lifting techniques when moving and installing the system.
|
– When removing or installing boards and sub-components, keep these components in their
|
static-shielded bag and/or packaging until you are ready to for component installation.
|
– Handle the sub-components by their edges.
|
– Do not touch any sub-component I/O connector pins. Do not apply pressure or attach labels to the
|
board-level sub-components.
|
– Use a personal grounding system, such as a wrist or heel strap(s) or ground yourself frequently by
|
touching the metal chassis of the system before handling any sub-components.
|
– Ensure the systems external power source has a solid connection to an earth ground.
|
– Use antistatic padding on all work surfaces when installing or removing sub-components.
|
– Avoid static-inducing carpeted areas.
Appendix B. Hardware Management Console physical specifications
115
Level 00f
|
Table 44. Hardware Management Console (FC 0095) specifications
|
FC 0095 Hardware Management Console system unit specifications
|
CPU:
Environment:
Electrical input:
||
|
||
||
||
|
||
||
||
||
|||
||
||
|
|
|
|
|
|
|
|
|
|
|
|
|
v 3.2 GHz Intel Xeon E3-1225 v3
Operating:
Memory:
v Temperature: 5oC - 40oC
(41oF - 104oF)
v Sine-wave input (47-63 Hz)
required
v Minimum: 32 GB
v Altitude: 3050 m (~10,000 ft)
v Maximum: 32 GB
v Slots: 4
v Relative humidity: 8% - 85% @
-12oC (10.4oF) dew point,
non-condensing
v Supports: 32 GB
Storage (non-operating):
Optical drive:
v Temperature: -20oC - 70oC
(-4oF - 158oF)
|
|
|
|
|
|
Integrated function:
v Type: DDR3, ECC
v Slim-line DVD drive
Hard drive:
v 1 TB SATA hard drive
Video:
v AST2400
v 350LFM continuous airflow
Size:
v Height: 439.2 mm (17.29 in)
Power supply:
v Weight: approximately 18.59 kg
(41.0 lb)
116
z13s IMPP
– Maximum: 265 Vrms
v Input kilovolt-amperes (kVA),
approximately:
– Maximum: 0.988 kVA
v Width: 215.9 mm (8.5 in)
v Eight USB ports
– Minimum: 180 Vrms
Air flow:
v Depth: 492.25 mm (19.38 in)
v One Intel l210 management
Ethernet port
– Maximum: 137 Vrms
v Input voltage high range:
– Minimum: 0.134 kVA
v Two side-removable hot-swap fans
v Six Intel l350 Ethernet ports
– Minimum: 90 Vrms
v Relative humidity: 5% - 100%
Fans:
v One 900-watt AC
v Input voltage low range:
Level 00f
Notes for FC 0091 and FC 0092: When planning the work area for the Hardware Management Console,
remember to allow a suitable space for a full-size keyboard, flat panel display, and mouse.
Table 45. Hardware Management Console (FC 0092) specifications
FC 0092 - Hardware Management Console system unit specifications
Dimensions
Height
425 mm (16.74 in.)
Width
176 mm (6.93 in.)
Depth
635 mm (25.00 in.)
Weight minimum configuration as shipped
20.0 kg (44.10 lbs.)
Weight maximum configuration
29.7 kg (65.48 lbs.)
Input Power1
Low range input voltage
100 VAC - 127 VAC
High range input voltage
200 VAC - 240 VAC
Input frequency range
50 - 60 Hz
Input kilovolt-amperes (kVA) (approximate)
Minimum configuration as shipped
0.12 kVA
Maximum configuration
0.90 kVA
Output Power1
Heat output in British thermal units (Btu) (approximate)
Minimum configuration
392 Btu/hr (115 watts)
Maximum configuration
2900 Btu/hr (850 watts)
Environmentals
Server On
Temperature with altitude: 0 to 950 m (3117 ft)
5° to 40° C (41° to 104° F)
Temperature with altitude: greater than 950 m (3117 ft) derated 1°C (33.8° F) per 175 m (575 ft)
Temperature at maximum altitude 3050 m (10,007 ft)
5° to 28° C (41° to 82.4° F)
Humidity, non-condensing:
Dew point
-12° C (10.4° F)
Relative humidity
8% - 85%
Maximum dew point
24° C (75.2° F)
Server Off
Temperature
5° to 45° C (41° to 113° F)
Relative humidity
8% - 85%
Maximum dew point
27° C (80.6° F)
Storage (non-operating)
Temperature
1° to 60° C (33.8° to 140° F)
Altitude
3050 m (10,007 ft)
Relative humidity
5% - 80%
Maximum dew point
29° C (84.2° F)
Shipping (non-operating)
Temperature
-40° to 60° C (-40° to 140° F)
Appendix B. Hardware Management Console physical specifications
117
Level 00f
Table 45. Hardware Management Console (FC 0092) specifications (continued)
FC 0092 - Hardware Management Console system unit specifications
Altitude
10,700 m (35,105 ft)
Relative humidity
5% - 100%
Maximum dew point
29° C (84.2° F)
1. Power consumption and heat output vary with the number and type of optional features installed and the
power-management optional features in use.
118
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Table 46. Hardware Management Console (FC 0091) specifications
FC 0091 - Hardware Management Console system unit specifications
Dimensions
Height
438 mm (17.3 in.)
Width
216 mm (8.5 in.)
Depth
540 mm (21.3 in.)
Weight minimum configuration as shipped
16.3 kg (36 lbs.)
Weight maximum configuration
25.2 kg (56 lbs.)
Input Power1
Voltage switch setting 115 VAC
Low range input voltage
100 VAC - 127 VAC
Input frequency range
47 - 53 Hz
Voltage switch setting 230 VAC
High range input voltage
200 VAC - 240 VAC
Input frequency range
57 - 63 Hz
Input kilovolt-amperes (kVA) (approximate)
Minimum configuration as shipped
0.20 kVA
Maximum configuration
0.55 kVA
Output Power1
Heat output in British thermal units (Btu) (approximate)
Minimum configuration
188 Btu/hr (55 watts)
Maximum configuration
1784 Btu/hr (523 watts)
Environmentals
Server On - 0 to 914 m (2998 ft)
10° to 35° C (50° to 95° F)
Server On - 914 m (2998 ft) to 2133.6 m (7000 ft)
10° to 32° C (50° to 89.6° F)
Server Off - to 2133 m (7000 ft)
10° to 43° C (50° to 109.4° F)
Shipping
-40° to 60° C (-40° to 140° F)
Humidity Range (operating and storage)
8% - 80%
1. Power consumption and heat output vary with the number and type of optional features installed and the
power-management optional features in use.
Appendix B. Hardware Management Console physical specifications
119
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Notes for 1U console unit (keyboard/display tray):
v The following are recommendations for placement of the 1723-8BX keyboard/display unit into the
customer supplied rack:
– If you are standing when using the 1723-8BX keyboard/display unit, place the unit in EIU locations
21, 22, or 23.
– If you are sitting when using the 1723-8BX keyboard/display unit, place the unit in EIU locations
12, 13, or 14.
– For special accommodations, you need to make adjustments in the placement of the 1723-8BX
keyboard/display unit in the rack that meet your needs.
v For USA and Canada, the 1723-8BX keyboard/display unit uses one PDU plug position for the AC
power supply in the keyboard/display. (Other power requirements are country dependent.)
v Elevated operating ambient - If installed in a closed or multi-unit rack assembly, the operating ambient
temperature of the rack environment might be greater than room ambient. Therefore, consideration
should be given to installing the equipment in an environment compatible with the maximum ambient
temperature (Tma) specified by the manufacturer.
v Reduced air flow - Installation of the equipment in a rack should be such that the amount of air flow
required for safe operation of the equipment is not compromised.
v Mechanical loading - Mounting of the equipment in the rack should be such that a hazardous
condition is not achieved due to uneven mechanical loading.
v Circuit overloading - Consideration should be given to the connection of the equipment to the supply
circuit and the effect that overloading of the circuits might have on overcurrent protection and supply
wiring. Appropriate consideration of equipment nameplate ratings should be used when addressing
this concern.
v Reliable earthing - Reliable earthing of rack-mounted equipment should be maintained. Particular
attention should be given to supply connections other than direct connections to the branch circuit (for
example, use of power strips).
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Table 47. 1U standard console, type 1723-8BX specifications
1U standard console, type 1723-8BX specifications
Dimensions
Height
44 mm (1.75 in) (display in stored position)
Width
434 mm (17 in) (main chassis only, slide-rails not included, faceplate not
included)
Depth
434 mm (17 in) (chassis behind EIA mounting flange, bezel in front of EIA
flange not included, cable-management arm not included)
Weight
10.4 kg (23 lb)
LCD panel
Size
18.5-inch diagonal
Display area (horizontal x vertical)
409.8 x 230.4 mm
Type
TFT active matrix
Pixel pitch (horizontal x vertical)
300 x 300 per triad
Input Power
Input voltage
100 VAC - 240 VAC
Input frequency range
47 - 63 Hz
Power Consumption
Normal operation
17 watts
Active off
< 1 watt (at 100 VAC and 240 VAC)
Environmentals - Temperature
Operating
0° to 50° C (32° to 122° F)
Storage
-20° to 60° C (-4° to 140° F)
Environmentals - Humidity
Operating
10% to 80%
Storage
5% to 95%
Appendix B. Hardware Management Console physical specifications
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Table 48. Flat panel display specifications
Flat panel display specifications
L2251x - Flat panel display
558.7 mm (22.0 inch)
(FC 6096)
LT2323p - Flat panel display
584.2 mm (23.0 inch)
T2324p - Flat panel display
584.2 mm (23.0 inch)
Dimensions
Height
406.0 mm (15.98 in)
403.9 mm (15.90 in)
Width
514.4 mm (20.25 in)
547.8 mm (21.57 in)
545.8 mm (21.49 in)
Depth
239.8 mm (9.44 in)
186.0 mm (7.32 in)
264.1 mm (10.39 in)
6.2 kg (20.5 lbs)
5.74 kg (12.65 lbs)
5.40 kg (11.90 lbs)
Weight with
stand
472.5 mm (18.60 in)
1
Input Power
Input voltage
Input frequency
range
Rated current
100 VAC - 240 VAC (+/- 10%)
100 VAC - 240 VAC (+/- 10%)
100 VAC - 240 VAC (+/- 10%)
50/60 Hz + or - 3 Hz
50/60 Hz + or - 3 Hz
50/60 Hz + or - 3 Hz
1.5 amps
1.5 amps
1.5 amps
Power Consumption
Normal
operation
< 45 watts
< 20 watts
< 21 watts (typical)
< 49 (maximum)
Standby/
Suspend
< 2 watts (analog or digital)
< 0.5 watts (analog or digital)
< 0.5 watts (analog or digital)
< 1 watt
(at 100 VAC and 240 VAC)
< 0.5 watt
(at 100 VAC and 240 VAC)
< 0.3 watt
(at 100 VAC and 240 VAC)
Active off
Environmentals - Temperature
Operating
10° to 45° C (50° to 113° F)
0° to 40° C (32° to 104° F)
0° to 45° C (32° to 113° F)
Storage
-20° to 60° C (-4° to 140° F)
-20° to 60° C (-4° to 140° F)
-20° to 60° C (-4° to 140° F)
Shipping
-20° to 60° C (-4° to 140° F)
-20° to 60° C (-4° to 140° F)
-20° to 60° C (-4° to 140° F)
Environmentals - Humidity
Operating
10% to 80%
10% to 80%
10% to 80%
Storage
5% to 90%
5% to 95%
5% to 95%
Shipping
5% to 90%
5% to 95%
5% to 95%
Notes:
1. This measurement is the distance from the tabletop to the top of the panel using the supplied stand.
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Appendix C. Acoustics
This appendix provides information on acoustics for the z13s or Rockhopper at nominal environmental
ambient temperatures of 23oC plus or minus 2oC (73.4oF plus or minus 3.6oF).
Acoustical noise emission levels
Table 49. Acoustical noise emissions (z13s) 1, 2, 3
Product Configuration
Declared A-Weighted Sound
Power Level LWAd (B)
Declared A-Weighted Sound
Pressure Level LpAm (dB)
Operating (B)
Idling (B)
Operating (dB)
Idling (dB)
|
|
|
|
|
Typical Configuration: M/T 2965 Model N20
or Model L20, one processor drawer, and one
PCIe I/O drawer. All air moving devices at
nominal speeds; front and rear acoustical doors
installed and closed.
7.64
7.64
58
58
|
|
|
|
|
Maximum Configuration: M/T 2965 Model
N20 or Model L20, two processor drawers, and
two PCIe I/O drawers. All air moving devices
at nominal speeds; front and rear acoustical
doors installed and closed.
7.85
7.85
60
60
Notes:
1. LWAd is the (upper limit) A-weighted sound power level. LpAm is the mean A-weighted sound pressure level at
the 1-meter bystander position.
2. All measurements are made in conformance with ISO 7779, and reported in conformance with ISO 9296.
3. B and dB are the abbreviations for bels and decibels, respectively. 1B = 10dB.
4. Meets IT Product Noise Limits for “Generally Attended Data Center” per Statskontoret Technical Standard 26:6.
|
|
5. Meets IT Product Noise Limits for “Generally Unattended Data Center” per Statskontoret Technical Standard
26:6.
Relevant international standards:
v Measurements: ISO 7779
v Declaration: ISO 9296
© Copyright IBM Corp. 2016, 2017
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Appendix D. Dual power installation
z13s and Rockhopper is designed with a fully redundant power system. Each computer has two line
cords attached to two power input ports which, in turn, power a pair of fully redundant power
distribution system within the computer. To take full advantage of the redundancy/reliability that is built
into the computer system, the system must be powered from two distribution panels.
The following shows three examples of redundancy. In these examples, two power cords are identified:
v P01 - Front BPE and J01 - Front BPE are the labels identifying the ends of one of the power cords. P01
- Front BPE is the label identifying the end of the power cord that connects to the top BPE jack in the
front of the frame and J01 - Front BPE is the label identifying the end of the same power cord that
connects to the customer power distribution unit.
v P01 - Back BPE and J01 - Back BPE are the labels identifying the ends of one of the power cords. P01 Back BPE is the label identifying the end of the power cord that connects to the top BPE jack in the
back of the frame and J01 - Back BPE is the label identifying the end of the same power cord that
connects to the customer power distribution unit.
Example 1 (redundant distribution panel and switch gear)
In this example, the computer receives power from two separate power distribution panels. Each
distribution panel receives power from a separate piece of building switch gear.
This type of power distribution will not result in system outage in the event of a power failure at either
switch great or either distribution panels.
J01 - Rear BPE
Distribution
Panel
P01 - Rear BPE
z Systems
Switch Gear
Switch Gear
Distribution
Panel
J01 - Front BPE
© Copyright IBM Corp. 2016, 2017
P01 - Front BPE
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Example 2 (redundant distribution panel)
In this example, the computer receives power from two separate power distribution panels. The two
distribution panels receive power from the same piece of building switch gear. Most facilities should be
able to achieve this level of redundancy. In this case, loss of switch gear (building power) will result in
system outage, but loss of one distribution panel will not.
J01 - Rear BPE
Distribution
Panel
P01 - Rear BPE
z Systems
Switch Gear
Distribution
Panel
J01 - Front BPE
P01 - Front BPE
Example 3 (single distribution panel)
In this example, the computer receives power from two separate circuit breakers in a single power panel.
This does not make use of the redundancy provided by the processor. It is, however, acceptable if a
second power distribution panel is not available.
This type of power distribution will result in system outage in the event of a power failure at either the
switch gear or the distribution panel. This power distribution is least recommended.
J01 - Rear BPE
P01 - Rear BPE
Distribution
Panel
z Systems
Switch Gear
J01 - Front BPE
P01 - Front BPE
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Appendix E. Balancing power panel loads
z13s or Rockhopper models that use three phase power, depending on the system configuration, the
phase currents can be fully balanced or unbalanced. For each possible drawer configuration (processor
and I/O combinations), any given system presents a balanced or unbalanced load. If several unbalanced
system configurations are fed from the same power panel, the load on that panel will be unbalanced. Two
phase currents will be equal and both will be, nominally, 57.8% of the current on the third phase.
Figure 17 is an example of feeding several loads of this type from two power panels in a way that
balances the load among the three phases.
Power Panel 1
OFF
A to Pin 3
OFF
30
C to Pin 1
OFF
30
A to Pin 2
OFF
30
B to Pin 3
30
A to Pin 1
OFF
30
B to Pin 2
OFF
30
B
C
A
B
C
C to Pin 3
OFF
OFF
C to Pin 2
30
OFF
30
C to Pin 3
C
A
A
To Connector
Machine4
OFF
OFF
30
B to Pin 2
B
B to Pin 1
30
30
A to Pin 1
A
OFF
OFF
30
B to Pin 3
C
C
To Connector
Machine 3
C to Pin 3
30
OFF
30
A to Pin 2
B
OFF
OFF
30
C to Pin 1
A
B to Pin 2
30
OFF
30
A to Pin 3
B
To Connector
Machine 2
OFF
OFF
30
C to Pin 2
A to Pin 1
30
OFF
30
B to Pin 1
To Connector
Machine 1
OFF
C to Pin 3
Power Panel 2
Phase
A
30
OFF
C
B to Pin 2
30
B
OFF
A
30
C
A to Pin 1
OFF
B
30
Phase
A
B
C
To Connector
Machine 1
To Connector
Machine 2
To Connector
Machine 3
To Connector
Machine4
Figure 17. Power® load balancing - three-pole breakers
The method in Figure 17 requires that the connection from the three poles of each breaker to the three
phase pins of a connector be varied. Some electricians may prefer to maintain a consistent wiring
sequence from the breakers to the connectors.
Figure 18 shows a way to balance the load without changing the wiring on the output of any breakers.
The three-pole breakers are alternated with single-pole breakers. This way the three-pole breakers don't
all begin on Phase A.
Power Panel 1
OFF
C to Pin 1
OFF
30
A to Pin 2
OFF
30
B to Pin 3
To Connector
Machine 1
To Connector
Machine 2
To Connector
Machine 3
30
OFF
A to Pin 1
OFF
30
B to Pin 2
OFF
30
C to Pin 3
OFF
30
C
30
B
30
OFF
30
A
To Connector
Machine 4
A to Pin 3
OFF
OFF
30
C to Pin 3
OFF
30
B to Pin 2
OFF
30
OFF
C
A to Pin 1
C to Pin 2
30
B
OFF
A
B to Pin 1
30
OFF
30
C
To Connector
Machine 3
OFF
B
30
A
30
C
C to Pin 3
OFF
B
To Connector
Machine 2
OFF
A
B to Pin 2
30
C
A to Pin 1
OFF
OFF
30
B to Pin 3
B
30
OFF
30
A to Pin 2
To Connector
Machine 1
OFF
30
C to Pin 1
Power Panel 2
Phase
A
30
A to Pin 3
OFF
C
OFF
B
C to Pin 2
30
A
OFF
C
B to Pin 1
30
B
OFF
A
30
C
30
B
C to Pin 3
OFF
A
OFF
C
30
B
B to Pin 2
OFF
A
30
C
A to Pin 1
OFF
B
30
Phase
A
To Connector
Machine 4
Figure 18. Power load balancing - alternating three-pole and single-pole breakers
Figure 19 on page 128 shows another way of distributing the unbalanced load evenly. In this case, the
three-pole breakers are alternated with two-pole breakers.
© Copyright IBM Corp. 2016, 2017
127
Level 00f
Power Panel 1
OFF
B to Pin 3
OFF
30
OFF
30
OFF
30
B to Pin 1
OFF
30
C to Pin 2
OFF
30
A to Pin 3
30
C
OFF
30
30
OFF
OFF
B
OFF
30
B to Pin 2
OFF
30
C
A to Pin 1
C to Pin 3
OFF
OFF
30
B
30
OFF
30
OFF
30
A
To Connector
Machine 4
A to Pin 2
30
A
OFF
C
C to Pin 1
30
To Connector
Machine 3
OFF
30
C to Pin 3
A
B
30
OFF
C
B to Pin 2
C
30
OFF
30
B
A to Pin 1
B
OFF
OFF
30
A
A
30
OFF
30
C
To Connector
Machine 2
C to Pin 3
OFF
30
B
B
C
OFF
OFF
A to Pin 3
A
B to Pin 2
30
30
C to Pin 2
C
A to Pin 1
OFF
OFF
B to Pin 1
B
30
OFF
30
B to Pin 3
To Connector
Machine 1
OFF
OFF
A to Pin 2
Power Panel 2
Phase
A
30
C to Pin 1
30
A
OFF
C
30
B
30
A
OFF
C
30
B
C to Pin 3
OFF
A
OFF
C
30
B
B to Pin 2
OFF
A
30
C
A to Pin 1
OFF
B
30
Phase
A
To Connector
Machine 1
To Connector
Machine 2
To Connector
Machine 3
To Connector
Machine 4
Figure 19. Power load balancing - alternating three-pole and double-pole breakers
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Appendix F. Frame tie-down
The purpose of this installation instruction is to describe how to install a frame tie down kit that will
provide frame ruggedizing and the floor tie down hardware for securing an IBM frame. The kit is
designed to help secure the frame and its contents from damage when exposed to vibrations and shocks
such as those in a seismic event.
FC 8021 is used on a raised floor. FC 8022 is used on a nonraised floor.
Raised floor frame tie-down
Frame tie-down for the z13s or Rockhopper on a raised floor is a system of adjustable turnbuckles
intended to fasten each corner of the server frames to eyebolts installed in the concrete floor beneath your
computer room raised floor. FC 8021 supplies parts to cover raised floor heights from 152.4 mm (6 inches)
to 914.4 mm (36 inches).
You are responsible for obtaining the services of a qualified consultant or structural engineer to determine
what must be done at your particular location to install four eyebolts. These eyebolts should be capable
of withstanding the appropriate seismic forces for a frame weighing up to 1308 kg (2885 lbs) with the
center of gravity 1270 mm (50 inches) from the ground and at the center of the frame.
Installing the eyebolts
You are responsible for obtaining and installing the eyebolts that will anchor the frames of z13s or
Rockhopper. Following are the specifications for the eyebolts:
v 12.7 mm (0.5 in) diameter, 13 threads per inch (length to be determined by the qualified contractor who
will perform the eyebolt installation)
v Inside diameter of the eye not smaller than 30 mm (1 3/16 in)
v Installed so that the center of the eye is not less than 25.4 mm (1 in) nor more than 63.5 mm (2.5 in)
from the surface of the concrete floor.
© Copyright IBM Corp. 2016, 2017
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Length of the eyebolts
to be determined by the
installation contractor
30 mm (1 3/16 in) diameter
Center of the eye
Not < 25.4 mm (1 in)
Not > 63.5 mm (2.5 in)
above the concrete surface
12.7 mm (0.5 in) diameter
Concrete floor
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Regardless of which kit you need, the following illustration shows where to cut the floor panels for the
turnbuckles to pass through to the eyebolts set in the concrete floor beneath.
Frame tie-down hole cutouts
610 mm (24 in) floor tiles
1
2
109 mm
(4.29 in)
65 mm
(2.54 in)
Frame tie-down hole cutouts
600 mm (23.5 in) floor tiles
Rear
1
2
119 mm
(4.69 in)
65 mm
(2.54 in)
A
A
52 mm
(2.05 in)
B
1019 mm
(40.12 in)
44 mm
(1.73 in)
1019 mm
(40.12 in)
A
B
A
C
C
137 mm
(5.39 in)
147 mm
(5.79 in)
D
654 mm
(25.75 in)
654 mm
(25.75 in)
D
Front
Additional floor panel pedestals may be necessary to restore structural integrity to the raised floor after
making the circular cuts for the turnbuckles. Consult your flooring manufacturer for recommendations.
The remainder of the parts involved in FC 8021 include:
v Side-to-side support bars at EIA unit 38, front and rear
v New side-to-side support bars, to stiffen the frame
v A triangular support bar, hung on two hinges and secured with a vertical stop
v A latch for the triangular support bar
v A pair of stabilizer bars that rest on the raised floor between the corners of each frame
v Four turnbuckle assemblies with fastening hardware that extend through the raised floor and are
secured to the eyebolts
v Heavier cover door latches.
These additional tie-down parts are installed along with the server. The installation instructions are
included as an appendix in the IBM z13s Installation Manual, which is shipped with the server.
Appendix F. Frame tie-down
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Nonraised floor frame tie-down
The purpose of this installation instruction is to install a frame tie down kit that will provide hardware
for securing an IBM frame to a concrete nonraised floor. This kit (FC 8022) is designed to help secure the
frame and its contents from damage when exposed to vibrations and shocks such as those in a seismic
event.
You are responsible for obtaining the services of a qualified consultant or structural engineer to determine
what must be done at your particular location to install five anchors per lock down plate and for
securing the front and rear lock down plate to the concrete floor according to the following illustration.
Contact your marketing representative well ahead of server delivery to obtain the lock down plate so that
the site will be ready when the server arrives.
Use the following illustration to plan carefully where the anchors that secure the stabilizers must be
installed.
5 bolts required for secure lockdown
1
3
2
5
4
1171.6 mm
(46.1 in)
Casters
1019 mm
(40.1 in)
Lockdown plate
threaded mounting holes
76.3 mm
(3.0 in)
65.5 mm
654.8 mm (2.6 in)
(25.8 in)
750 mm
(29.5 in)
47.6 mm
(1.9 in)
178.5 mm
(7.0 in)
375 mm
(14.7 in)
The lock down plate to concrete fasteners should be a heavy duty expansion anchor. The contractor you
engage to install the stabilizers will determine the length of the anchors.
When the server arrives, remove the fasteners from either the front or rear stabilizer. Remove the
stabilizer to position the server frame. Then reinstall the stabilizer and the fasteners before the service
provider begins the installation.
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Appendix G. Notices
This information was developed for products and services offered in the US.
IBM may not offer the products, services, or features discussed in this document in other countries.
Consult your local IBM representative for information on the products and services currently available in
your area. Any reference to an IBM product, program, or service is not intended to state or imply that
only that IBM product, program, or service may be used. Any functionally equivalent product, program,
or service that does not infringe any IBM intellectual property right may be used instead. However, it is
the user's responsibility to evaluate and verify the operation of any non-IBM product, program, or
service.
IBM may have patents or pending patent applications covering subject matter described in this
document. The furnishing of this document does not grant you any license to these patents. You can send
license inquiries, in writing, to:
IBM Director of Licensing
IBM Corporation
North Castle Drive, MD-NC119
Armonk, NY 10504-1785
US
INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION “AS IS”
WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT
LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR
FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimer of express or
implied warranties in certain transactions, therefore, this statement may not apply to you.
This information could include technical inaccuracies or typographical errors. Changes are periodically
made to the information herein; these changes will be incorporated in new editions of the publication.
IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this
publication at any time without notice.
Any references in this information to non-IBM websites are provided for convenience only and do not in
any manner serve as an endorsement of those websites. The materials at those websites are not part of
the materials for this IBM product and use of those websites is at your own risk.
IBM may use or distribute any of the information you provide in any way it believes appropriate without
incurring any obligation to you.
Information concerning non-IBM products was obtained from the suppliers of those products, their
published announcements or other publicly available sources. IBM has not tested those products and
cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM
products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of
those products.
Statements regarding IBM's future direction or intent are subject to change or withdrawal without notice,
and represent goals and objectives only.
This information is for planning purposes only. The information herein is subject to change before the
products described become available.
© Copyright IBM Corp. 2016, 2017
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This information contains examples of data and reports used in daily business operations. To illustrate
them as completely as possible, the examples include the names of individuals, companies, brands, and
products. All of these names are fictitious and any similarity to actual people or business enterprise is
entirely coincidental.
Trademarks
IBM, the IBM logo, and ibm.com® are trademarks of International Business Machines Corp., registered in
many jurisdictions worldwide. Other product and service names might be trademarks of IBM or other
companies. A current list of IBM trademarks is available on the web at “Copyright and trademark
information” at www.ibm.com/legal/copytrade.shtml.
Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both.
Microsoft and Windows are trademarks of Microsoft Corporation in the United States, other countries, or
both.
Other company, product, or service names may be trademarks or service marks of others.
Class A Notices
The following Class A statements apply to this IBM product. The statement for other IBM products
intended for use with this product will appear in their accompanying manuals.
Federal Communications Commission (FCC) Statement
Note: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instruction manual, may cause harmful interference to radio communications. Operation of this
equipment in a residential area is likely to cause harmful interference, in which case the user will be
required to correct the interference at his own expense.
Properly shielded and grounded cables and connectors must be used in order to meet FCC emission
limits. IBM is not responsible for any radio or television interference caused by using other than
recommended cables and connectors or by unauthorized changes or modifications to this equipment.
Unauthorized changes or modifications could void the user's authority to operate the equipment.
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Industry Canada Compliance Statement
This Class A digital apparatus complies with Canadian ICES-003.
Avis de conformité à la réglementation d'Industrie Canada
Cet appareil numérique de la classe A est conforme à la norme NMB-003 du Canada.
European Community Compliance Statement
This product is in conformity with the protection requirements of EU Council Directive 2014/30/EU on
the approximation of the laws of the Member States relating to electromagnetic compatibility. IBM cannot
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z13s IMPP
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accept responsibility for any failure to satisfy the protection requirements resulting from a
non-recommended modification of the product, including the fitting of non-IBM option cards.
This product has been tested and found to comply with the limits for Class A Information Technology
Equipment according to European Standard EN 55032. The limits for Class A equipment were derived for
commercial and industrial environments to provide reasonable protection against interference with
licensed communication equipment.
European Community contact:
IBM Deutschland GmbH
Technical Regulations, Department M372
IBM-Allee 1, 71139 Ehningen, Germany
Tele: +49 (0) 800 225 5423 or +49 (0) 180 331 3233
email: halloibm@de.ibm.com
Warning: This is a Class A product. In a domestic environment, this product may cause radio
interference, in which case the user may be required to take adequate measures.
VCCI Statement - Japan
The following is a summary of the Japanese VCCI statement above:
This is a Class A product based on the standard of the VCCI Council. If this equipment is used in a
domestic environment, radio interference may occur, in which case the user may be required to take
corrective actions.
Japan JIS C 61000-3-2 Compliance
("#)%&'()*+,-./ 012%3456789
/ :;に=づく@ABC%CD: Knowledge CenterのGHIの/
/ / / / / / / / / / / / /
JKページOP
For products less than or equal to 20 A per phase, the following statement applies:
!"#$%&' JIS C 61000-3-2 ()*
For products greater than 20 A, single-phase, the following statements apply:
Appendix G. Notices
135
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,:;3TUV JIS C 61000-3-2 WXY
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?ガイドライン」>FGH(,:;JKGH)です。
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For products greater than 20 A per phase, three-phase, the following statements apply:
%&'()*+ JIS C 61000-3-2 ,-.
/01は、「%56は78%5で:(する=>?の%&'ABC
Dガイドライン」CKLM(%&'OPLM)です。
"#ST :5 (3!、PFC"#$)
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Electromagnetic Interference (EMI) Statement - People's Republic of China
Declaration: This is a Class A product. In a domestic environment, this product may cause radio
interference, in which case the user may need to perform practical action.
Electromagnetic Interference (EMI) Statement - Taiwan
The following is a summary of the Taiwan EMI statement above:
Warning: This is a Class A product. In a domestic environment, this product may cause radio
interference, in which case the user will be required to take adequate measures.
136
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IBM Taiwan Contact Information:
Electromagnetic Interference (EMI) Statement - Korea
! ""# $%&( A')() *+,-./01 2 ""!34
56+ 7# 8&+# ! 91 :;<=" >?@, ABC;
DEFG 8&<# H1 I-() .4J.
Germany Compliance Statement
Deutschsprachiger EU Hinweis: Hinweis für Geräte der Klasse A EU-Richtlinie zur
Elektromagnetischen Verträglichkeit
Dieses Produkt entspricht den Schutzanforderungen der EU-Richtlinie 2014/30/EU zur Angleichung der
Rechtsvorschriften über die elektromagnetische Verträglichkeit in den EU-Mitgliedsstaaten und hält die
Grenzwerte der EN 55032 Klasse A ein.
Um dieses sicherzustellen, sind die Geräte wie in den Handbüchern beschrieben zu installieren und zu
betreiben. Des Weiteren dürfen auch nur von der IBM empfohlene Kabel angeschlossen werden. IBM
übernimmt keine Verantwortung für die Einhaltung der Schutzanforderungen, wenn das Produkt ohne
Zustimmung von IBM verändert bzw. wenn Erweiterungskomponenten von Fremdherstellern ohne
Empfehlung von IBM gesteckt/eingebaut werden.
EN 55032 Klasse A Geräte müssen mit folgendem Warnhinweis versehen werden:
"Warnung: Dieses ist eine Einrichtung der Klasse A. Diese Einrichtung kann im Wohnbereich
Funk-Störungen verursachen; in diesem Fall kann vom Betreiber verlangt werden, angemessene
Maßnahmen zu ergreifen und dafür aufzukommen."
Deutschland: Einhaltung des Gesetzes über die elektromagnetische Verträglichkeit von Geräten
Dieses Produkt entspricht dem “Gesetz über die elektromagnetische Verträglichkeit von Geräten
(EMVG)“. Dies ist die Umsetzung der EU-Richtlinie 2014/30/EU in der Bundesrepublik Deutschland.
Zulassungsbescheinigung laut dem Deutschen Gesetz über die elektromagnetische Verträglichkeit von
Geräten (EMVG) (bzw. der EMC EG Richtlinie 2014/30/EU) für Geräte der Klasse A
Dieses Gerät ist berechtigt, in Übereinstimmung mit dem Deutschen EMVG das EG-Konformitätszeichen
- CE - zu führen.
Verantwortlich für die Einhaltung der EMV Vorschriften ist der Hersteller:
International Business Machines Corp.
New Orchard Road
Armonk, New York 10504
Tel: 914-499-1900
Der verantwortliche Ansprechpartner des Herstellers in der EU ist:
IBM Deutschland GmbH
Technical Regulations, Abteilung M372
Appendix G. Notices
137
Level 00f
IBM-Allee 1, 71139 Ehningen, Germany
Tel: +49 (0) 800 225 5423 or +49 (0) 180 331 3233
email: halloibm@de.ibm.com
Generelle Informationen:
Das Gerät erfüllt die Schutzanforderungen nach EN 55024 und EN 55032 Klasse A.
Electromagnetic Interference (EMI) Statement - Russia
138
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Appendix G. Notices
139
IBM®
Printed in USA
GC28-6953-00