Kingston Technology ValueRAM KVR667D2S8F5/1GEF memory module

Memory Module Specifications
KVR667D2S8F5/1GEF
1GB 128M x 72-Bit PC2-5300
CL5 ECC 240-Pin FBDIMM
Description:
This document describes ValueRAM's 1GB (128M x 72-bit) PC2-5300 CL5 SDRAM (Synchronous DRAM) "fully
buffered" ECC "single rank" memory module. This module is based on nine 128M x 8-bit 667MHz DDR2 FBGA
components. The module also includes an AMB device (Advanced Memory Buffer). The electrical and mechanical
specifications are as follows:
Feature:
DRAM Supported:
Elpida F-Die
·
FBDIMM Module: 240-pin
·
JEDEC Standard: R/C A
·
Memory Organization: 1 rank of x8 devices
·
DDR2 DRAM Interface: SSTL_18
·
DDR2 Speed Grade: 667 Mbps
·
CAS Latency: 5-5-5
·
Module Bandwidth: 5.3 GB/s
·
DRAM: VDD = VDDQ = 1.8V
·
AMB: VCC = VCCFBD = 1.5V
·
EEPROM: VDDSPD = 3.3V (typical)
·
Heat Spreader: Full DIMM Heat Spreader (FDHS)
·
PCB Height: 30.35mm, double-side
·
RoHS Compliant
VALUERAM0900-001.A00
02/02/10
Page 1
T E C H N O L O G Y
DDR2 240-pin FBDIMM Pinout:
Pin
#
Front
Side
Pin
#
Back
Side
Pin
#
Front
Side
Pin
#
Back
Side
Pin
#
Front
Side
Pin
#
Back
Side
Pin
#
Front
Side
Pin
#
Back
Side
1
VDD
121
VDD
31
PN3
151
SN3
61
PN9
181
SN9
91
PS9
211
SS9
2
VDD
122
VDD
32
PN3
152
SN3
62
VSS
182
VSS
92
VSS
212
VSS
3
VDD
123
VDD
33
VSS
153
VSS
63
PN10
183
SN10
93
PS5
213
SS5
4
VSS
124
VSS
34
PN4
154
SN4
64
PN10
184
SN10
94
PS5
214
SS5
5
VDD
125
VDD
35
PN4
155
SN4
65
VSS
185
VSS
95
VSS
215
VSS
6
VDD
126
VDD
36
VSS
156
VSS
66
PN11
186
SN11
96
PS6
216
SS6
7
VDD
127
VDD
37
PN5
157
SN5
67
PN11
187
SN11
97
PS6
217
SS6
8
VSS
128
VSS
38
PN5
158
SN5
68
VSS
188
VSS
98
VSS
218
VSS
9
VCC
129
VCC
39
VSS
159
VSS
99
PS7
219
SS7
10
VCC
130
VCC
40
PN13
160
SN13
69
VSS
189
VSS
100
PS7
220
SS7
11
VSS
131
VSS
41
PN13
161
SN13
70
PS0
190
SS0
101
VSS
221
VSS
12
VCC
132
VCC
42
VSS
162
VSS
71
PS0
191
SS0
102
PS8
222
SS8
13
VCC
133
VCC
43
VSS
163
VSS
72
VSS
192
VSS
103
PS8
223
SS8
14
VSS
134
VSS
44
RFU*
164
RFU*
73
PS1
193
SS1
104
VSS
224
VSS
15
VTT
135
VTT
45
RFU*
165
RFU*
74
PS1
194
SS1
105
RFU**
225
RFU**
16
VID1
136
VID0
46
VSS
166
VSS
75
VSS
195
VSS
106
RFU**
226
RFU**
17
RESET
47
VSS
167
VSS
76
PS2
196
SS2
107
VSS
227
VSS
18
VSS
19
137 DNU/M_Test
KEY
138
VSS
48
PN12
168
SN12
77
PS2
197
SS2
108
VDD
228
SCK
RFU**
139
RFU**
49
PN12
169
SN12
78
VSS
198
VSS
109
VDD
229
SCK
20
RFU**
140
RFU**
50
VSS
170
VSS
79
PS3
199
SS3
110
VSS
230
VSS
21
VSS
141
VSS
51
PN6
171
SN6
80
PS3
200
SS3
111
VDD
231
VDD
22
PN0
142
SN0
52
PN6
172
SN6
81
VSS
201
VSS
112
VDD
232
VDD
23
PN0
143
SN0
53
VSS
173
VSS
82
PS4
202
SS4
113
VDD
233
VDD
24
VSS
144
VSS
54
PN7
174
SN7
83
PS4
203
SS4
114
VSS
234
VSS
25
PN1
145
SN1
55
PN7
175
SN7
84
VSS
204
VSS
115
VDD
235
VDD
26
PN1
146
SN1
56
VSS
176
VSS
85
VSS
205
VSS
116
VDD
236
VDD
27
VSS
147
VSS
57
PN8
177
SN8
86
RFU*
206
RFU*
117
VTT
237
VTT
28
PN2
148
SN2
58
PN8
178
SN8
87
RFU*
207
RFU*
118
SA2
238
VDDSPD
29
PN2
149
SN2
59
VSS
179
VSS
88
VSS
208
VSS
119
SDA
239
SA0
30
VSS
150
VSS
60
PN9
180
SN9
89
VSS
209
VSS
120
SCL
240
SA1
90
PS9
210
SS9
RFU = Reserved Future Use.
* These pin positions are reserved for forwarded clocks to be used in future module implementations
** These pin positions are reserved for future architecture flexibility
1) The following signals are CRC bits and thus appear out of the normal sequence: PN12/PN12, SN12/SN12, PN13/PN13, SN13/SN13,
PS9/PS9, SS9/SS9
VALUERAM0900-001.A00
Page 2
T E C H N O L O G Y
DIMM Connector Pin Description:
Pin Name
Pin Description
Count
SCK
System Clock Input, positive line1
1
SCK
System Clock Input, negative line1
1
PN[13:0]
Primary Northbound Data, positive lines
14
PN[13:0]
Primary Northbound Data, negative lines
14
PS[9:0]
Primary Southbound Data, positive lines
10
Primary Southbound Data, negative lines
10
SN[13:0]
Secondary Northbound Data, positive lines
14
SN[13:0]
Secondary Northbound Data, negative lines
14
SS[9:0]
Secondary Southbound Data, positive lines
10
SS[9:0]
Secondary Southbound Data, negative lines
10
SCL
Serial Presence Detect (SPD) Clock Input
1
SDA
SPD Data Input / Output
1
SA[2:0]
SPD Address Inputs, also used to select the DIMM number in the AMB
3
VID[1:0]
Voltage ID: These pins must be unconnected for DDR2-based Fully Buffered DIMMs
VID[0] is VDD value: OPEN = 1.8 V, GND = 1.5 V; VID[1] is V CC value: OPEN = 1.5 V, GND = 1.2 V
2
RESET
AMB reset signal
1
PS[9:0]
2
RFU
Reserved for Future Use
16
VCC
AMB Core Power and AMB Channel Interface Power (1.5 Volt)
8
VDD
DRAM Power and AMB DRAM I/O Power (1.8 Volt)
24
VTT
DRAM Address/Command/Clock Termination Power (V DD/2)
4
SPD Power
1
Ground
80
The DNU/M_Test pin provides an exter nal connection on R/Cs A-D for testing
the margin of Vref which is produced by a voltage divider on the module. It
is not intended to be used in normal system operation and must not be
connected (DNU) in a system. This test pin may have other features on future card designs
and if it does, will be included in this specification at that time.
1
1
Total
240
VDDSPD
VSS
DNU/M_Test
1. System Clock Signals SCK and SCK switch at one half the DRAM CK/CK frequency
2. Eight pins reserved for forwarded clocks, eight pins reserved for future architecture flexibility
Absolute Maximum Ratings
Symbol
MIN
MAX
Units
SS
-0.3
1.75
V
VCC
Voltage on V CC pin relative to V SS
-0.3
1.75
V
VDD
VTT
TSTG
Voltage V DD pin relative to Vss
-0.5
2.3
V
Voltage on V TT pin relative to V SS
Storage temperature
-0.5
-55
2.3
100
V
°C
TCASE
DDR2 SDRAM device operat ing temperature (Ambient)
AMB device operating temperature (Ambient)
0
95 (1)
°C
0
110
°C
VIN, VOUT
Parameter
Voltage on any pin relative to V
Note: (1) Above 85°C DRAM case temperature the Auto-Refresh command interval has to be reduced to tREFI = 3.9 µs.
VALUERAM0900-001.A00
Page 3
T E C H N O L O G Y
Functional Block Diagram:
S0
DQS4
DQS4
DQS13
DQS0
DQS0
DQS9
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DM/ NU/
RDQS RDQS CS DQS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D0
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D4
DQS5
DQS5
DQS14
DQS1
DQS1
DQS10
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DM/ NU/
RDQS RDQS CS DQS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM/ NU/
RDQS RDQS CS DQS DQS
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
D1
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D5
DQS6
DQS6
DQS15
DQS2
DQS2
DQS11
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DM/ NU/
RDQS RDQS CS DQS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DM/ NU/
RDQS RDQS CS DQS DQS
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
D2
DQS3
DQS3
DQS12
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D6
DQS7
DQS7
DQS16
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DM/ NU/
RDQS RDQS CS DQS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
A
M
B
RESET
SCK/SCK
D3
D7
S0 -> CS (all SDRAMs)
CKE0 -> CKE (all SDRAMs)
ODT -> ODT (all SDRAMs)
BA0-BA2 (all SDRAMs)
A0-A15 (all SDRAMs)
RAS (all SDRAMs)
CAS (all SDRAMs)
WE (all SDRAMs)
CK/CK (all SDRAMs)
Notes:
1. DQ-to-I/O wiring may be changed within a byte.
2. There are two physical copies of each address/command/con-
DM/ NU/
RDQS RDQS CS DQS DQS
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
All address/command/control/clock
VALUERAM0900-001.A00
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS8
DQS8
DQS17
825
trol/clock
DM/ NU/
RDQS RDQS CS DQS DQS
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
SN0-SN13
SN0-SN13
SS0-SS9
SS0-SS9
PN0-PN13
PN0-PN13
PS0-PS9
PS0-PS9
DQ0-DQ63
CB0-CB7
DQS0-DQS17
DQS0-DQS8
SCL
SDA
SA1-SA2
SA0
DM/ NU/
RDQS RDQS CS DQS DQS
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
22
VTT
Serial PD
SCL
WP A0
A1
A2
SA0 SA1 SA2
SDA
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
D8
VTT
Terminators
VCC
AMB
VDDSPD
SPD, AMB
VDD
D0-D8, AMB
VREF
D0-D8
VSS
D0-D8,SPD,AMB
Page 4
T E C H N O L O G Y
Architecture:
Advanced Memory Buffer Pin Description:
Pin Name
Pin Description
Count
FB-DIMM Channel Signals
99
SCK
System Clock Input, positive line
1
SCK
System Clock Input, negative line
1
PN[13:0]
Primary Northbound Data, positive lines
14
PN[13:0]
Primary Northbound Data, negative lines
14
PS[9:0]
Primary Southbound Data, positive lines
10
PS[9:0]
Primary Southbound Data, negative lines
10
SN[13:0]
Secondary Northbound Data, positive lines
14
SN[13:0]
Secondary Northbound Data, negative lines
14
SS[9:0]
Secondary Southbound Data, positive lines
10
SS[9:0]
Secondary Southbound Data, negative lines
10
To an external precision calibration resistor connected to Vcc
1
FBDRES
DDR2 Interface Signals
175
DQS[8:0]
Data Strobes, positive lines
9
DQS[8:0]
Data Strobes, negative lines
9
DQS[17:9]/DM[8:0]
Data Strobes (x4 DRAM only), positive lines. These signals are driven low to x8 DRAM on writes.
9
Data Strobes (x4 DRAM only), negative lines
9
Data
64
Checkbits
8
A[15:0]A, A[15:0]B
Addresses. A10 is part of the pre-charge command
32
BA[2:0]A, BA[2:0]B
Bank Addresses
6
RASA, RASB
Part of command, with CAS, WE, and CS[1:0].
2
CASA, CASB
Part of command, with RAS, WE, and CS[1:0].
2
Part of command, with RAS, CAS, and CS[1:0].
2
On-die Termination Enable
2
DQS[17:9]
DQ[63:0]
CB[7:0]
WEA, WEB
ODTA, ODTB
CKE[1:0]A, CKE[1:0]B Clock Enable (one per rank)
CS[1:0]A, CS[1:0]B
Chip Select (one per rank)
4
4
CLK[3:0]
CLK[1:0] used on 9 and 18 device DIMMs, CLK[3:0] used on 36 device DIMMs. CLK[3:2] should be out4
put disabled when not in use.
CLK[3:0]
Negative lines for CLK[3:0]
4
DDRC_C14
DDR Compensation: Common return pin for DDRC_B18 and DDRC_C18.
1
DDRC_B18
DDR Compensation: Resistor connected to common return pin DDRC_C14
1
DDRC_C18
DDR Compensation: Resistor connected to common return pin DDRC_C14
1
DDRC_B12
DDR Compensation: Resistor connected to VSS
1
DDRC_C12
DDR Compensation: Resistor connected to VDD
1
VALUERAM0900-001.A00
Page 5
T E C H N O L O G Y
Advanced Memory Buffer Pin Description:
SPD Bus Interface Signals
5
SCL
Serial Presence Detect (SPD) Clock Input
1
SDA
SPD Data Input / Output
1
SPD Address Inputs, also used to select the DIMM number in the AMB
3
SA[2:0]
Miscellaneous Signals
163
PLLTSTO
PLL Clock Observability Output
1
VCCAPLL
Analog VCC for the PLL. Tied with low pass filter to VCC.
1
VSSAPLL
Analog VSS for the PLL. Tied to ground on the AMB die. Do not tie to ground on the DIMM.
1
TEST_pin#
Leave floating on the DIMM
6
2
5
TESTLO_pin#
Tie to ground on the DIMM
BFUNC
Tie to ground to set functionality as “buffer on DIMM.”
1
RESET
AMB reset signal
1
No connect. Many NC are connected to VDD on the DIMM, to lower the impedance of the VDD power
islands.
129
Reserved for Future Use
18
NC
RFU
Power/Ground Signals
VCC
VCCFBD
VDD
VDDSPD
VSS
213
AMB Core Power (1.5 Volt)
24
AMB Channel I/O Power (1.5 Volt)
8
AMB DRAM I/O Power (1.8 Volt)
24
SPD Power (3.3 Volt)
1
Ground
156
Total
655
1. System Clock Signals SCK and SCK switch at one half the DRAM CK/CK frequency.
2. TESTLO_AB20 and TESTLO_AC20 should be configured for debug purposes on prototype DIMMs: each pin should have a zero
ohm resistor pulldown to ground, and an unpopulated resistor pullup to VCC. These resistors can be replaced on production
DIMMs with a direct connection to ground.
VALUERAM0900-001.A00
Page 6
T E C H N O L O G Y
FBGA DDR2
SDRAM
Advanced Memory Buffer
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
T E C H N O L O G Y
FBGA DDR2
SDRAM
AMB
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
T E C H N O L O G Y
Package Dimensions:
(Units = millimeters)
0.346 (8.8)
MAX with heat sink
Units: inches (millimeters)
45°x 0.0071(0.18)
0.042 (1.06)
0.047 (1.19)
0.042 (1.06)
0.054 (1.37)
0.046 (1.17)
VALUERAM0900-001.A00
Detail A
Page 7