Pentium® II Processor at 350 MHz,
400 MHz, and 450 MHz
Datasheet
Product Features
•
•
•
•
•
•
Available at 350 MHz, 400 MHz, and
450 MHz frequencies
System bus frequency at 100 MHz
Binary compatible with applications
running on previous members of the Intel
microprocessor line
Dynamic execution micro architecture
Dual Independent Bus architecture:
Separate dedicated external System Bus
and dedicated internal high-speed cache
bus
Power Management capabilities
— System Management mode
— Multiple low-power states
•
•
•
•
•
•
Optimized for 32-bit applications running
on advanced 32-bit operating systems
Single Edge Contact Cartridge (S.E.C.C.)
and S.E.C.C.2 packaging technology; the
S.E.C. cartridges deliver high performance
with improved handling protection and
socketability
Integrated high performance 16 KB
instruction and 16 KB data, nonblocking,
level one cache
Available with integrated 512 KB unified,
nonblocking, level two cache
Enables systems which are scaleable up to
two processors
Error-correcting code for System Bus data
The Intel Pentium® II processor is designed for high-performance desktops and for workstations
and servers. It is binary compatible with previous Intel Architecture processors. The Pentium II
processor provides the best performance available for applications running on advanced
operating systems such as Windows* 95, Windows NT and UNIX*. This is achieved by
integrating the best attributes of Intel processors—the dynamic execution, Dual Independent Bus
architecture plus Intel MMX™ technology—bringing a new level of performance for systems
buyers. The Pentium II processor is scaleable to two processors in a multiprocessor system and
extends the power of today’s Pentium II processor with performance headroom for business
media, communication and internet capabilities. Systems based on Pentium II processors also
include the latest features to simplify system management and lower the cost of ownership for
large and small business environments. The Pentium II processor offers great performance for
today’s and tomorrow’s applications.
Order Number: 243657-003
August 1998
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved“ or “undefined.“ Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or imcompatibilities arising from future changes to them.
The Pentium® II processor may contain design defects or errors known as errata which may cause the product to deviate from published
specifcations. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright © Intel Corporation 1998.
*Third-party brands and names are the property of their respective owners.
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Contents
1.0
Introduction......................................................................................................................... 7
1.1
1.2
2.0
Electrical Specifications.................................................................................................... 10
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
3.0
3.2
3.3
Thermal Specifications ........................................................................................ 43
4.1.1 Thermal Diode ........................................................................................ 44
S.E.C.C. and S.E.C.C.2 Mechanical Specifications ........................................................ 44
5.1
Datasheet
System Bus Clock (BCLK) Signal Quality Specifications and Measurement
Guidelines ........................................................................................................... 37
AGTL+ Signal Quality Specifications and Measurement Guidelines .................. 38
Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 40
3.3.1 Overshoot/Undershoot Guidelines ......................................................... 41
3.3.2 Ringback Specification ........................................................................... 41
3.3.3 Settling Limit Guideline........................................................................... 42
Thermal Specifications and Design Considerations......................................................... 42
4.1
5.0
Processor System Bus and VREF ...................................................................... 10
Clock Control and Low Power States ..................................................................11
2.2.1 Normal State—State 1 ........................................................................... 12
2.2.2 AutoHALT Powerdown State—State 2................................................... 12
2.2.3 Stop-Grant State—State 3 ..................................................................... 12
2.2.4 HALT/Grant Snoop State—State 4 ........................................................ 13
2.2.5 Sleep State—State 5 ..............................................................................13
2.2.6 Deep Sleep State—State 6 .................................................................... 13
2.2.7 Clock Control..........................................................................................14
Power and Ground Pins ...................................................................................... 14
Decoupling Guidelines ........................................................................................ 14
2.4.1 Processor VCCCORE Decoupling............................................................ 15
2.4.2 Processor System Bus AGTL+ Decoupling............................................ 15
Processor System Bus Clock and Processor Clocking ....................................... 15
2.5.1 Mixing Processors of Different Frequencies........................................... 15
Voltage Identification ........................................................................................... 15
Processor System Bus Unused Pins................................................................... 17
Processor System Bus Signal Groups ................................................................ 17
2.8.1 Asynchronous vs. Synchronous for System Bus Signals ....................... 19
2.8.2 System Bus Frequency Select Signal (100/66#) .................................... 19
Test Access Port (TAP) Connection.................................................................... 20
Maximum Ratings................................................................................................ 20
Processor DC Specifications............................................................................... 21
AGTL+ System Bus Specifications ..................................................................... 24
System Bus AC Specifications ............................................................................ 25
System Bus Signal Simulations........................................................................................ 36
3.1
4.0
Terminology........................................................................................................... 8
1.1.1 S.E.C. Cartridge Terminology .................................................................. 8
References ............................................................................................................ 9
S.E.C.C. Mechnical Specifications ...................................................................... 45
3
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
5.2
5.3
5.4
6.0
Boxed Processor Specifications....................................................................................... 64
6.1
6.2
6.3
6.4
7.0
S.E.C.C.2 Mechanical Specification.................................................................... 52
Processor Package Materials Information .......................................................... 57
Pentium® II Processor Signal Listing .................................................................. 58
Introduction ......................................................................................................... 64
Mechanical Specifications ................................................................................... 66
6.2.1 Boxed Processor Fan Heatsink Dimensions .......................................... 66
6.2.2 Boxed Processor Fan Heatsink Weight.................................................. 69
6.2.3 Boxed Processor Retention Mechanism and Fan Heatsink Supports.... 69
Boxed Processor Requirements ......................................................................... 72
6.3.1 Fan Heatsink Power Supply ................................................................... 72
Thermal Specifications ........................................................................................ 73
6.4.1 Boxed Processor Cooling Requirements ............................................... 73
Pentium® II Processor Signal Description ........................................................................ 74
7.1
7.2
Alphabetical Signals Reference .......................................................................... 74
Signal Summaries ............................................................................................... 81
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Second Level (L2) Cache Implementations ......................................................... 8
AGTL+ Bus Topology.......................................................................................... 11
Stop Clock State Machine ................................................................................... 11
100/66# Pin Example .......................................................................................... 20
BCLK to Core Logic Offset .................................................................................. 33
BCLK, PICCLK, and TCK Generic Clock Waveform........................................... 34
System Bus Valid Delay Timings ........................................................................ 34
System Bus Setup and Hold Timings.................................................................. 34
System Bus Reset and Configuration Timings.................................................... 35
Power-On Reset and Configuration Timings....................................................... 35
Test Timings (TAP Connection) .......................................................................... 36
Test Reset Timings ............................................................................................. 36
BCLK, TCK, PICCLK Generic Clock Waveform at the Processor Core Pins...... 37
BCLK, TCK, PICCLK Generic Clock Waveform at the Processor Edge
Fingers ................................................................................................................ 38
Low to High AGTL+ Receiver Ringback Tolerance............................................. 40
Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback ..................... 40
Pentium® II Processor S.E.C.C. - Side View....................................................... 42
Pentium® II Processor (S.E.C.C. Package)—Top and Side View....................... 45
Pentium® II Processor (S.E.C.C. Package)—Extended Thermal Plate Side
Dimensions ......................................................................................................... 46
Pentium® II Processor (S.E.C.C. Package)—Bottom View Dimensions ............. 46
Pentium® II Processor (S.E.C.C. Package)—Latch Arm, Extended Thermal
Plate Lug, and Cover Lug Dimensions................................................................ 47
Pentium® II Processor (S.E.C.C. Package)—Latch Arm, Extended Thermal
Plate, and Cover Detail Dimensions (Reference Dimensions Only) ................... 48
Pentium® II Processor (S.E.C.C. Package)—Extended Thermal Plate
Attachment Detail Dimensions ............................................................................ 49
Figures
15
16
17
18
19
20
21
22
23
4
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
Pentium® II Processor (S.E.C.C. Package)—Extended Thermal Plate
Attachment Detail Dimensions, Continued.......................................................... 50
Pentium® II Processor Substrate (S.E.C.C. Package)—Edge Finger
Contact Dimensions ............................................................................................50
Pentium® II Processor Substrate (S.E.C.C. Package)—Edge Finger
Contact Dimensions, Detail A..............................................................................51
Pentium® II Processor Markings (S.E.C.C. Package) ......................................... 51
Pentium® II Processor (S.E.C.C.2 Package) Top and Side Views—
OLGA Processor Core ........................................................................................ 52
Pentium® II Processor (S.E.C.C.2 Package) Top and Side Views—
PLGA Processor Core......................................................................................... 53
Pentium® II Processor Assembly (S.E.C.C.2 Package)—Primary View ............. 53
Pentium® II Processor Assembly (S.E.C.C.2 Package)—Cover View with
Dimensions.......................................................................................................... 54
Pentium® II Processor Assembly (S.E.C.C.2 Package)—Heat Sink Attach
Boss Section ....................................................................................................... 54
Pentium® II Processor Assembly (S.E.C.C.2 Package), Side View—
OLGA Substrate Shown ...................................................................................... 55
Detail View of Cover in the Vicinity of the Substrate Attach Features ................. 55
Pentium® II Processor Substrate (S.E.C.C.2 Package), Edge Finger Contact
Dimensions.......................................................................................................... 56
Pentium® II Processor Markings (S.E.C.C.2 Package) ....................................... 56
Boxed Pentium® II Processor in the S.E.C.C. Packaging Installed in Retention
Mechanism (Fan Power Cable Not Shown) ....................................................... 65
Boxed Pentium® II Processor in the S.E.C.C.2 Packaging (Fan Power Cable
Not Shown)......................................................................................................... 65
Side View Space Requirements for the Boxed Processor with S.E.C.C.
Packaging............................................................................................................ 66
Front View Space Requirements for the Boxed Processor with S.E.C.C.
Packaging............................................................................................................ 67
Side View Space Requirements for the Boxed Processor with S.E.C.C.2
Packaging............................................................................................................ 67
Front View Space Requirements for the Boxed Processor with S.E.C.C.2
Packaging............................................................................................................ 68
Top View Air Space Requirements for the Boxed Processor.............................. 68
Heatsink Support Hole Locations and Size ......................................................... 70
Side View Space Requirements for Boxed Processor Fan Heatsink Supports... 71
Top View Space Requirements for Boxed Processor Fan Heatsink Supports ... 71
Boxed Processor Fan Heatsink Power Cable Connector Description................. 72
Recommended Motherboard Power Header Placement Relative to Fan Power
Connector and Pentium® II Processor ................................................................ 73
Tables
1
2
3
4
5
6
Datasheet
Voltage Identification Definition ........................................................................... 16
Recommended Pull-up Resistor Values (Approximate) for CMOS Signals ........ 18
System Bus Signal Groups ................................................................................. 19
Absolute Maximum Ratings................................................................................. 21
Voltage and Current Specifications .................................................................... 22
AGTL+ Signal Groups DC Specifications ...........................................................24
5
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
6
Non-AGTL+ Signal Group DC Specifications...................................................... 24
AGTL+ Bus Specifications ................................................................................. 25
System Bus AC Specifications (Clock) at the Processor Edge Fingers ............. 26
System Bus AC Specifications (Clock) at Processor Core Pins ........................ 27
Valid System Bus, Core Frequency, and Cache Bus Frequencies .................... 27
System Bus AC Specifications (AGTL+ Signal Group)at the Processor
Edge Fingers ...................................................................................................... 28
System Bus AC Specifications (AGTL+ Signal Group) at the Processor
Core Pins ........................................................................................................... 28
System Bus AC Specifications (CMOS Signal Group) at the Processor
Edge Fingers
29
System Bus AC Specifications (CMOS Signal Group)at the Processor Core
Pins
29
System Bus AC Specifications (Reset Conditions) ............................................ 30
System Bus AC Specifications (APIC Clock and APIC I/O) at the Processor
Edge Fingers ....................................................................................................... 30
System Bus AC Specifications (APIC Clock and APIC I/O)at the Processor
Core Pins ........................................................................................................... 31
System Bus AC Specifications (TAP Connection)at the Processor Edge
Fingers ............................................................................................................... 31
System Bus AC Specifications (TAP Connection)at the Processor Core Pins .. 32
BCLK Signal Quality Specifications for Simulation at the Processor Core ........ 37
BCLK Signal Quality Guidelines for Edge Finger Measurement ........................ 38
AGTL+ Signal Groups Ringback Tolerance Specifications at the Processor
Core ................................................................................................................... 39
AGTL+ Signal Groups Ringback Tolerance Guidelines for Edge Finger
Measurement ..................................................................................................... 39
Signal Ringback Specifications for Non-AGTL+ Signal Simulation at the
Processor Core .................................................................................................. 41
Signal Ringback Guidelines for Non-AGTL+ Signal Edge Finger Measurement 41
Thermal Specifications for S.E.C.C. Packaged Processors ............................... 43
Thermal Specifications for S.E.C.C.2 Packaged Processors.............................. 43
Thermal Diode Parameters ................................................................................. 44
Thermal Diode Interface...................................................................................... 44
Description Table for Processor Markings (S.E.C.C. Packaged Processor)....... 52
Description Table for Processor Markings (S.E.C.C.2 Packaged Processor)..... 57
S.E.C.C. Materials .............................................................................................. 57
S.E.C.C.2 Materials ............................................................................................ 57
Signal Listing in Order by Pin Number ................................................................ 58
Signal Listing in Order by Signal Name .............................................................. 61
Boxed Processor Fan Heatsink Spatial Dimensions ........................................... 69
Boxed Processor Fan Heatsink Support Dimensions ......................................... 70
Fan Heatsink Power and Signal Specifications................................................... 72
Motherboard Fan Power Connector Location ..................................................... 73
Signal Description ............................................................................................... 74
Output Signals..................................................................................................... 81
Input Signals ....................................................................................................... 82
Input/Output Signals (Single Driver).................................................................... 83
Input/Output Signals (Multiple Driver) ................................................................. 83
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
1.0
Introduction
The Pentium II 350 MHz/400 MHz/450 MHz processor is the next in the Pentium II processor line
of Intel processors. The Pentium II processor, like the Pentium Pro processor, implements a
Dynamic Execution microarchitecture—a unique combination of multiple branch prediction, data
flow analysis, and speculative execution. This enables these processors to deliver higher
performance than the Pentium processor, while maintaining binary compatibility with all previous
Intel Architecture processors. The Pentium II processor also executes MMX technology
instructions for enhanced media and communication performance. The Pentium II processor
utilizes multiple low-power states such as AutoHALT, Stop-Grant, Sleep, and Deep Sleep to
conserve power during idle times.
The Pentium II processor utilizes the same multiprocessing system bus technology as the Pentium
Pro processor. This allows for a higher level of performance for both uni-processor and two-way
multiprocessor (2-way MP) systems. Memory is cacheable for up to 4 GB of addressable memory
space, allowing significant headroom for business desktop systems. Please refer to the Intel
Specification Update document’s S-spec number table to determine the cacheability for a given
processor.
The Pentium II processor system bus operates in the same manner as the Pentium Pro processor
system bus. The Pentium II processor system bus uses a variant of GTL+ signal technology called
AGTL+ signal technology. The Pentium II processor deviates from the Pentium Pro processor by
using commercially available die for the second level (L2) cache. The L2 cache (the TagRAM and
burst pipelined synchronous static RAM (BSRAM) memories) are now multiple die. Transfer rates
between a Pentium II processor’s core and L2 cache are one-half the processor core clock
frequency and scale with the processor core frequency. Both the TagRAM and BSRAM receive
clocked data directly from the Pentium II processor core. As with the Pentium Pro, the Pentium II
processor has a dedicated L2 cache bus, thus maintaining the dual independent bus architecture to
deliver high bus bandwidth and high performance (see Figure 1).
Pentium II processors use either a Single Edge Contact Cartridge (S.E.C.C.) or a Single Edge
Contact Cartridge 2 (S.E.C.C.2) packaging technology. These packaging technologies allow the L2
cache to remain tightly coupled to the processor, while enabling use of high volume commercial
SRAM components. The L2 cache is performance optimized and tested at the package level. The
S.E.C.C. and S.E.C.C.2 packages utilize surface mounted technology and a substrate with an edge
finger connection. Pentium II processors at 350, 400 and 450 MHz, while available at higher core
frequencies than the previously released Pentium II processors at 233, 266, 300 and 333 MHz, also
provide additional features while utilizing either a compatible S.E.C.C. package or the follow-on
S.E.C.C.2 package.
The S.E.C.C. package has the following features: an extended thermal plate, a cover, and a
substrate with an edge finger connection. The extended thermal plate allows heatsink attachment or
customized thermal solutions. The S.E.C.C.2 package has a cover and a substrate with an edge
finger conenction. This allows the thermal solutions to be placed directly onto the processor core
package. The edge finger connection maintains socketability for system configuration. The edge
finger connector is called the ‘SC 242 connector’ in this and other documentation.
Datasheet
7
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 1.
Second Level (L2) Cache Implementations
Processor
Core
Processor Core
L2
Tag
L2
®®
Pentium
Pentium Pro
ProProcessor
Processor
Dual
Cavity
Dual Die
Cavity
Package
Pentium II Processor
Pentium® II Processor
Substrate
and Components
Substrate
and Components
v001
1.1
Terminology
In this document, a ‘#’ symbol after a signal name refers to an active low signal. This means that a
signal is in the active state (based on the name of the signal) when driven to a low level. For
example, when FLUSH# is low, a flush has been requested. When NMI is high, a nonmaskable
interrupt has occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies that the signal
is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D#[3:0] = ‘LHLH’ also refers
to a hex ‘A’ (H= High logic level, L= Low logic level).
The term “system bus” refers to the interface between the processor, system core logic (a.k.a. the
AGPset components), and other bus agents. The system bus is a multiprocessing interface to
processors, memory, and I/O. The term “cache bus” refers to the interface between the processor
and the L2 cache components (TagRAM and BSRAMs). The cache bus does NOT connect to the
system bus, and is not visible to other agents on the system bus.
1.1.1
S.E.C. Cartridge Terminology
The following terms are used often in this document and are explained here for clarification:
• Pentium® II processor—The entire product including internal components, substrate,
extended thermal plate, and cover.
• S.E.C.C.—The processor packaging technology is called a “Single Edge Contact Cartridge.”
Initial releases of the Pentium II processor are based upon this packaging technology.
• S.E.C.C.2—The follow-on to S.E.C.C. processor packaging technology. The biggest
difference from its predecessor is that it has no extended thermal plate, thus reducing thermal
resistance.
• Processor substrate—The structure on which components are mounted inside the S.E.C.C. or
S.E.C.C.2 package technology (with or without components attached).
• Processor core—The processor’s execution engine.
8
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
• Extended Thermal Plate—This S.E.C.C. 100 MHz processor feature is the surface used to
attach a heatsink or other thermal solution to the processor. The extended thermal plate has an
extended skirt as compared to the 66 MHz Pentium II processors for increased thermal
capabilities.
• Cover—The plastic casing that covers the backsire of the substrate and holds processor
branding and marking information.
• Latch arms—An S.E.C.C. processor feature which can be used as a means for securing the
processor in the retention mechanism(s).
• PLGA - Plastic Land Grid Array. This package technology incorporates a heat slug within the
package that contacts the extended thermal plate.
• OLGA - Organic Land Grid Array. This package technology permits attaching the heatsink
directly to the die.
Additional terms referred to in this and other related documentation:
• SC 242—The 242-contact slot connector (previously referred to as Slot 1 connector) that the
S.E.C.C. and S.E.C.C.2 plug into, just as the Pentium® Pro processor uses Socket 8.
• Retention mechanism—An enabled mechanical piece which holds the S.E.C. cartridge in the
SC 242 connector.
• Heatsink support—The support pieces that are mounted on the motherboard to provide added
support for heatsinks.
The L2 cache (TagRAM, BSRAM) die keep industry names.
1.2
References
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
• AP-485, Intel Processor Identification and the CPUID Instruction (Order Number 241618)
• AP-827, 100 MHz GTL+ Layout Guidelines for the Pentium® II Processor and Intel® 440BX
AGPset (Order Number 243735)
• AP-586, Pentium® II Processor Thermal Design Guidelines (Order Number 243331)
• AP-587, Pentium® II Processor Power Distribution Guidelines (Order Number 243332)
• AP-588, Mechanical and Assembly Technology for S.E.C. Cartridge Processors (Order
Number 243333)
•
•
•
•
•
•
AP-589, Pentium® II Processor Electro-Magnetic Interference (Order Number 243334)
Pentium® II Processor at 233, 266, 300, 333 MHz (Order Number 243335)
Pentium® II Processor Specification Update (Order Number 243337)
Slot 1 Connector Specification (Order Number 243397)
Slot 1 Bus Terminator Card Design Guidelines (Order Number 243409)
Intel Architecture Software Developer's Manual (Order Number 243193)
— Volume I: Basic Architecture (Order Number 243190)
— Volume II: Instruction Set Reference (Order Number 243191)
Datasheet
9
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
— Volume III: System Programming Guide (Order Number 243192)
• P6 Family of Processors Hardware Developer’s Manual (Order Number 244001)
• Pentium® II Processor I/O Buffer Models, Quad Format (developer.intel.com)
2.0
Electrical Specifications
2.1
Processor System Bus and VREF
Most Pentium II processor signals use a variation of the low voltage Gunning Transceiver Logic
(GTL) signaling technology.
The Pentium II processor system bus specification is similar to the GTL specification, but has been
enhanced to provide larger noise margins and reduced ringing. The improvements are
accomplished by increasing the termination voltage level and controlling the edge rates. This
specification is different from the standard GTL specification, and is referred to as GTL+. For
more information on GTL+ specifications, see AP-827, 100 MHz GTL+ Layout Guidelines for the
Pentium ® II Processor and Intel® 440BX AGPset (Order Number 243735).
The Pentium II processor varies from the Pentium Pro processor in its output buffer
implementation. The buffers that drive most of the system bus signals on the Pentium II processor
are actively driven to VCCCORE for one clock cycle after the low to high transition to improve its
rise times and reduce noise. These signals should still be considered open-drain and require
termination to a supply that provides the high signal level. Because this specification is different
from the standard GTL+ specification, it is referred to as Assisted Gunning Transitistor Logic
(AGTL+) in this document. AGTL+ logic and GTL+ logic are compatible with each other and may
both be used on the same system bus.
AGTL+ signals are open-drain and require termination to a supply that provides the high signal
level. AGTL+ inputs use differential receivers which require a reference signal (VREF). VREF is used
by the receivers to determine if a signal is a logical 0 or a logical 1, and is generated on the S.E.C
cartridges for the processor core. Local VREF copies should be generated on the motherboard for all
other devices on the AGTL+ system bus. Termination (usually a resistor at each end of the signal
trace) is used to pull the bus up to the high voltage level and to control reflections on the
transmission line. The processor contains termination resistors that provide termination for one end
of the Pentium II processor system bus. These specifications assume another resistor at the end of
each signal trace to ensure adequate signal quality for the AGTL+ signals; see Table 8 for the bus
termination voltage specifications for AGTL+ and the Pentium® II Processor Developer’s Manual
(Order Number 243502) for the GTL+ bus specification. Solutions exist for single-ended
termination as well, though solution space is affected. Figure 2 is a schematic representation of
AGTL+ bus topology with Pentium II processors.
The AGTL+ bus depends on incident wave switching. Therefore timing calculations for AGTL+
signals are based on flight time as opposed to capacitive deratings. Analog signal simulation of the
Pentium II processor system bus including trace lengths is highly recommended when designing a
system with a heavily loaded AGTL+ bus, especially for systems using a single set of termination
resistors (i.e., those on the processor substrate) with the Intel® 440BX AGPset. Such designs will
not match the solution space allowed for by installation of termination resistors on the
motherboard. See Intel’s World Wide Web page (http://developer.intel.com) to download the buffer
models: Pentium® II Processor I/O Buffer Models, Quad Format (Electronic Form).
10
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 2.
AGTL+ Bus Topology
Pentium® II
Processor
2.2
ASIC
ASIC
Pentium II
Processor
Clock Control and Low Power States
Pentium II processors allow the use of AutoHALT, Stop-Grant, Sleep, and Deep Sleep states to
reduce power consumption by stopping the clock to internal sections of the processor, depending
on each particular state. See Figure 3 for a visual representation of the Pentium II processor low
power states.
Figure 3.
Stop Clock State Machine
HALT Instruction and
HALT Bus Cycle Generated
2. Auto HALT Power Down State
BCLK running.
Snoops and interrupts allowed.
INIT#, BINIT#, INTR,
SMI#, RESET#
1. Normal State
Normal execution.
STPCLK# Asserted
Snoop
Event
Occurs
Snoop
Event
Serviced
4. HALT/Grant Snoop State
BCLK running.
Service snoops to caches.
STPCLK# De-asserted
Snoop Event Occurs
Snoop Event Serviced
STPCLK#
Asserted
STPCLK#
De-asserted
3. Stop Grant State
BCLK running.
Snoops and interrupts allowed.
SLP#
Asserted
SLP#
De-asserted
5. Sleep State
BCLK running.
No snoops or interrupts allowed.
BCLK
Input
Stopped
BCLK
Input
Restarted
6. Deep Sleep State
BCLK stopped.
No snoops or interrupts allowed.
PCB757a
Datasheet
11
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
For the processor to fully realize the low current consumption of the Stop-Grant, Sleep, and Deep
Sleep states, a Model Specific Register (MSR) bit must be set. For the MSR at 02AH (Hex), bit 26
must be set to a ‘1’ (this is the power on default setting) for the processor to stop all internal clocks
during these modes. For more information, see the Pentium® II Processor Developer's Manual
(Order Number 243502).
Due to the inability of processors to recognize bus transactions during the Sleep and Deep Sleep
states, two-way MP systems are not allowed to have one processor in Sleep/Deep Sleep state and
the other processor in Normal or Stop-Grant state simultaneously.
2.2.1
Normal State—State 1
This is the normal operating state for the processor.
2.2.2
AutoHALT Powerdown State—State 2
AutoHALT is a low power state entered when the processor executes the HALT instruction. The
processor will transition to the Normal state upon the occurrence of SMI#, BINIT#, INIT#, or
LINT[1:0] (NMI, INTR). RESET# will cause the processor to immediately initialize itself.
The return from a System Management Interrupt (SMI) handler can be to either Normal Mode or
the AutoHALT Power Down state. See the Intel Architecture Software Developer's Manual,
Volume III: System Programmer's Guide (Order Number 243192) for more information.
FLUSH# will be serviced during the AutoHALT state, and the procesor will return to the
AutoHALT state.
The system can generate a STPCLK# while the processor is in the AutoHALT Power Down state.
When the system deasserts the STPCLK# interrupt, the processor will return execution to the
HALT state.
2.2.3
Stop-Grant State—State 3
The Stop-Grant state on the processor is entered when the STPCLK# signal is asserted.
Since the AGTL+ signal pins receive power from the system bus, these pins should not be driven
(allowing the level to return to VTT) for minimum power drawn by the termination resistors in this
state. In addition, all other input pins on the system bus should be driven to the inactive state.
BINIT# will be recognized while the processor is in Stop-Grant state. If STPCLK# is still asserted
at the completion of the BINIT# bus initialization, the processor will remain in Stop-Grant mode. If
the STPCLK# is not asserted at the completion of the BINIT# bus initialization, the processor will
return to Normal state.
FLUSH# will not be serviced during Stop-Grant state.
RESET# will cause the processor to immediately initialize itself, but the processor will stay in
Stop-Grant state. A transition back to the Normal state will occur with the deassertion of the
STPCLK# signal.
A transition to the HALT/Grant Snoop state will occur when the processor detects a snoop on the
system bus (see Section 2.2.4). A transition to the Sleep state (see Section 2.2.5) will occur with the
assertion of the SLP# signal.
12
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
While in the Stop-Grant State, SMI#, INIT#, and LINT[1:0] will be latched by the processor, and
only serviced when the processor returns to the Normal state. Only one occurrence of each event
will be recognized upon return to the Normal state.
2.2.4
HALT/Grant Snoop State—State 4
The processor will respond to snoop transactions on the Pentium II processor system bus while in
Stop-Grant state or in AutoHALT Power Down state. During a snoop transaction, the processor
enters the HALT/Grant Snoop state. The processor will stay in this state until the snoop on the
Pentium II processor system bus has been serviced (whether by the processor or another agent on
the Pentium II processor system bus). After the snoop is serviced, the processor will return to the
Stop-Grant state or AutoHALT Power Down state, as appropriate.
2.2.5
Sleep State—State 5
The Sleep state is a very low power state in which the processor maintains its context, maintains
the phase-locked loop (PLL), and has stopped all internal clocks. The Sleep state can only be
entered from Stop-Grant state. Once in the Stop-Grant state, the SLP# pin can be asserted, causing
the processor to enter the Sleep state. The SLP# pin is not recognized in the Normal or AutoHALT
states.
Snoop events that occur while in Sleep State or during a transition into or out of Sleep state will
cause unpredictable behavior.
In the Sleep state, the processor is incapable of responding to snoop transactions or latching
interrupt signals. No transitions or assertions of signals (with the exception of SLP# or RESET#)
are allowed on the system bus while the processor is in Sleep state. Any transition on an input
signal before the processor has returned to Stop-Grant state will result in unpredictable behavior.
If RESET# is driven active while the processor is in the Sleep state, and held active as specified in
the RESET# pin specification, then the processor will reset itself, ignoring the transition through
Stop-Grant State. If RESET# is driven active while the processor is in the Sleep State, the SLP#
and STPCLK# signals should be deasserted immediately after RESET# is asserted to ensure the
processor correctly executes the Reset sequence.
While in the Sleep state, the processor is capable of entering its lowest power state, the Deep Sleep
state, by stopping the BCLK input (see Section 2.2.6). Once in the Sleep or Deep Sleep states, the
SLP# pin can be deasserted if another asynchronous system bus event occurs. The SLP# pin has a
minimum assertion of one BCLK period.
2.2.6
Deep Sleep State—State 6
The Deep Sleep state is the lowest power state the processor can enter while maintaining context.
The Deep Sleep state is entered by stopping the BCLK input (after the Sleep state was entered from
the assertion of the SLP# pin). The processor is in Deep Sleep state immediately after BLCK is
stopped. It is recommended that the BLCK input be held low during the Deep Sleep State.
Stopping of the BCLK input lowers the overall current consumption to leakage levels.
To re-enter the Sleep state, the BLCK input must be restarted. A period of 1 ms (to allow for PLL
stabilization) must occur before the processor can be considered to be in the Sleep state. Once in
the Sleep state, the SLP# pin can be deasserted to re-enter the Stop-Grant state.
Datasheet
13
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
While in Deep Sleep state, the processor is incapable of responding to snoop transactions or
latching interrupt signals. No transitions or assertions of signals are allowed on the system bus
while the processor is in Deep Sleep state. Any transition on an input signal before the processor
has returned to Stop-Grant state will result in unpredictable behavior.
2.2.7
Clock Control
The processor provides the clock signal to the L2 cache. During AutoHALT Power Down and
Stop-Grant states, the processor will process a system bus snoop. The processor will not stop the
clock to the L2 cache during AutoHALT Power Down or Stop-Grant states. Entrance into the Halt/
Grant Snoop state will allow the L2 cache to be snooped, similar to the Normal state.
When the processor is in Sleep and Deep Sleep states, it will not respond to interrupts or snoop
transactions. During the Sleep state, the clock to the L2 cache is not stopped. During the Deep
Sleep state, the clock to the L2 cache is stopped. The clock to the L2 cache will be restarted only
after the internal clocking mechanism for the processor is stable (i.e., the processor has re-entered
Sleep state).
PICCLK should not be removed during the AutoHALT Power Down or Stop-Grant states.
PICCLK can be removed during the Sleep or Deep Sleep states. When transitioning from the Deep
Sleep state to the Sleep state, PICCLK must be restarted with BCLK.
2.3
Power and Ground Pins
The operating voltage of the processor die and of the L2 cache die differ from each other. There are
two groups of power inputs on the Pentium II processor package to support this voltage difference
between the components in the package. There are also five pins defined on the package for voltage
identification (VID). These pins specify the voltage required by the processor core. These have
been added to cleanly support voltage specification variations on current and future Pentium II
processors.
For clean on-chip power distribution, Pentium II processors have 27 V CC (power) and 30 V SS
(ground) inputs. The 27 VCC pins are further divided to provide the different voltage levels to the
components. VCCCORE inputs for the processor core and some L2 cache components account for 19
of the VCC pins, while 4 VTT inputs (1.5 V) are used to provide an AGTL+ termination voltage to
the processor and 3 VCCL2 inputs (3.3 V) are for use by the L2 cache TagRAM and BSRAMs. One
VCC5 pin is provided for use by the Slot 1 Test Kit. VCC5, VCCL2, and VCCCORE must remain electrically
separated from each other. On the circuit board, all VCCCORE pins must be connected to a voltage
island and all VCCL2 pins must be connected to a separate voltage island (an island is a portion of a
power plane that has been divided, or an entire plane). Similarly, all VSS pins must be connected to
a system ground plane.
2.4
Decoupling Guidelines
Due to the large number of transistors and high internal clock speeds, the processor is capable of
generating large average current swings between low and full power states. This causes voltages on
power planes to sag below their nominal values if bulk decoupling is not adequate. Care must be
taken in the board design to ensure that the voltage provided to the processor remains within the
specifications listed in Table 5. Failure to do so can result in timing violations or a reduced lifetime
of the component.
14
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
2.4.1
Processor VCCCORE Decoupling
Regulator solutions need to provide bulk capacitance with a low Effective Series Resistance (ESR)
and keep an interconnect resistance from the regulator (or VRM pins) to the SC 242 connector of
less than 0.3 mΩ. This can be accomplished by keeping a maximum distance of 1.0 inches between
the regulator output and SC 242 connector. The recommended VCCCORE interconnect is a 2.0 inch
wide (the width of the VRM 8.2 connector) by 1.0 inch long (maximum distance between the
SC 242 connector and the VRM 8.2 connector) plane segment with a 1-ounce plating. Bulk
decoupling for the large current swings when the part is powering on, or entering/exiting low
power states, is provided on the voltage regulation module (VRM). The VCCCORE input should be
capable of delivering a recommended minimum dICCCORE/dt (defined in Table 5) while maintaining
the required tolerances (also defined in Table 5).
2.4.2
Processor System Bus AGTL+ Decoupling
The Pentium II processor contains high frequency decoupling capacitance on the processor
substrate; bulk decoupling must be provided for by the system motherboard for proper AGTL+ bus
operation. See AP-827, 100 MHz GTL+ Layout Guidelines for the Pentium® II Processor and
Intel® 440BX AGPset (Order Number 243735), AP-587, Pentium ® II Processor Power
Distribution Guidelines (Order Number 243332), and the Pentium ® II Processor Developer's
Manual (Order Number 243502) for more information.
2.5
Processor System Bus Clock and Processor Clocking
The BCLK input directly controls the operating speed of the Pentium II processor system bus
interface. All Pentium II processor system bus timing parameters are specified with respect to the
rising edge of the BCLK input. See the Pentium ® II Processor Developer's Manual (Order Number
243502) for further details.
2.5.1
Mixing Processors of Different Frequencies
Mixing processors of different internal clock frequencies is not supported and has not been
validated by Intel. One should also note that when attempting to mix processors rated at different
frequencies in a two-way MP system, a common bus clock frequency and a set of multipliers must
be found that is acceptable to both processors in the system. A processor may run at a core
frequency as low as its minimum rating.
2.6
Voltage Identification
There are five voltage identification pins on the SC 242 connector. These pins can be used to
support automatic selection of power supply voltages. These pins are not signals, but are either an
open circuit or a short circuit to VSS on the processor. The combination of opens and shorts defines
the voltage required by the processor core. The VID pins are needed to cleanly support voltage
specification variations on current and future Pentium II processors. These pins (VID[0] through
VID[4]) are defined in Table 1. A ‘1’ in this table refers to an open pin and a ‘0’ refers to a short to
ground. The definition provided in Table 1 is a superset of the definition previously defined for the
Pentium Pro processor. The power supply must supply the voltage that is requested or disable
itself.
Datasheet
15
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
To ensure the system is ready for current and future Pentium II processors, the range of values in
bold in Table 1 must be supported. A smaller range will risk the ability of the system to migrate to
a higher performance Pentium II processor and/or maintain compatibility with current Pentium II
processors.
Table 1.
Voltage Identification Definition 1, 2, 3
Processor Pins
VID4
VID3
0
0
0
VID2
VID1
VID0
1
0
1
1.80 4
0
1
0
0
1.85 4
0
0
0
1
1
1.90 4
0
0
0
1
0
1.95 4
0
0
0
0
1
2.00 4
0
0
0
0
0
2.05 4
1
1
1
1
1
No Core
1
1
1
1
0
2.1 4
1
1
1
0
1
2.2 4
1
1
1
0
0
2.3 4
1
1
0
1
1
2.4 4
1
1
0
1
0
2.5 4
1
1
0
0
1
2.6 4
1
1
0
0
0
2.7 4
1
0
1
1
1
2.8 4
1
0
1
1
0
2.9
1
0
1
0
1
3.0
1
0
1
0
0
3.1
1
0
0
1
1
3.2
1
0
0
1
0
3.3
1
0
0
0
1
3.4
1
0
0
0
0
3.5
01111 - 00110
VCCCORE
Reserved
NOTES:
1. 0 = Processor pin connected to VSS.
2. 1 = Open on processor; may be pulled up to TTL VIH on motherboard.
3. VRM output should be disabled for VCCCORE values less than 1.80 V.
4. To ensure the system is ready for the Pentium® II processors, the values in BOLD in Table 1 must be supported.
Note that the ‘11111’ (all opens) ID can be used to detect the absence of a processor core in a given
slot as long as the power supply used does not affect these lines. Detection logic and pull-ups
should not affect VID inputs at the power source (see Section 7.0).
The VID pins should be pulled up to a TTL-compatible level with external resistors to the power
source of the regulator only if required by the regulator or external logic monitoring the VID[4:0]
signals. The power source chosen must be guaranteed to be stable whenever the supply to the
voltage regulator is stable. This will prevent the possibility of the processor supply going above the
specified V CCCORE in the event of a failure in the supply for the VID lines. In the case of a DC-to-DC
converter, this can be accomplished by using the input voltage to the converter for the VID line
16
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
pull-ups. A resistor of greater than or equal to 10 kΩ may be used to connect the VID signals to the
converter input. Note that no changes have been made to the physical connector between the VRM
8.1 and VRM 8.2 specifications, though pin definitions have changed.
2.7
Processor System Bus Unused Pins
All RESERVED pins must remain unconnected. Connection of these pins to VCCCORE, VCCL2, VSS, or
to any other signal (including each other) can result in component malfunction or incompatibility
with future Pentium II processors. See Section 5.4 for a pin listing of the processor and the location
of each RESERVED pin.
All TESTHI pins must be connected to 2.5 V via a pull-up resistor of between 1 and 100 kΩ value.
PICCLK must be driven with a valid clock input and the PICD[1:0] lines must be pulled-up to
2.5 V even when the APIC will not be used. A separate pull-up resistor must be provided for each
PICD line (see Table 2 for recommended values).
For reliable operation, always connect unused inputs or bidirectional signals to an appropriate
signal level. Unused AGTL+ inputs should be left as no connects; AGTL+ termination is provided
on the processor. Unused active low CMOS inputs should be connected to 2.5 V. Unused active
high inputs should be connected to ground (VSS). Unused outputs can be left unconnected. A
resistor must be used when tying bidirectional signals to power or ground. When tying any signal
to power or ground, a resistor will also allow for system testability. For unused pins, it is suggested
that ~10 kΩ resistors be used for pull-ups (except for PICD[1:0] discussed above), and ~1 kΩ
resistors be used as pull-downs.
2.8
Processor System Bus Signal Groups
In order to simplify the following discussion, the Pentium II processor system bus signals have
been combined into groups by buffer type. All Pentium II processor system bus outputs are
open drain and require a high-level source provided externally by the termination or pull-up
resistor.
AGTL+ input signals have differential input buffers, which use VREF as a reference signal. AGTL+
output signals require termination to 1.5 V. In this document, the term “AGTL+ Input” refers to the
AGTL+ input group as well as the AGTL+ I/O group when receiving. Similarly, “AGTL+ Output”
refers to the AGTL+ output group as well as the AGTL+ I/O group when driving.
EMI pins should be connected to motherboard ground and/or to chassis ground through zero ohm
(0Ω) resistors. The 0Ω resistors should be placed in close proximity to the SC 242 connector. The
path to chassis ground should be short in length and have a low impedance.
The CMOS, Clock, APIC, and TAP inputs can each be driven from ground to 2.5 V. The CMOS,
APIC, and TAP outputs are open drain and should be pulled high to 2.5 V. This ensures not only
correct operation for current Pentium II processors, but compatibility for future Pentium II
products as well. See Table 2 for recommended pull-up resistor values on each CMOS signal.
~150Ω resistors are expected on the PICD[1:0] lines; other values in Table 2 are specified for
proper logic analyzer and test mode operation only.
Datasheet
17
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 2.
Recommended Pull-up Resistor Values (Approximate) for CMOS Signals 1, 2, 3
Recommended Resistor
Value (Approximate)
150Ω
CMOS Signal
TDI, TDO, TMS, PICD[0], PICD[1]
150Ω – 220Ω
FERR#, IERR#, THERMTRIP#
150Ω – 330Ω
A20M#, IGNNE#, INIT#, LINT[1]/NMI, LINT[0]/INTR, PWRGOOD, SLP#, PREQ#
410Ω
STPCLK#, SMI#
500Ω
FLUSH#
1KΩ–100KΩ
TESTHI4
NOTES:
1. These resistor values are recommended for system implementations using open-drain CMOS buffers.
2. ~150Ω resistors are expected for these signals. This value may vary by system and should be correlated with the output
drive characteristics of the devices generating the input signals. Other approximate values are recommended for proper
operation with the Pentium® II processor Logic Analyzer Interface.
3. TRST# must be pulled to ground via a 680Ω resistor or driven low at power on with the assertion of RESET# (see
Table 19).
4. 1K−10KΩ pullup to 2.0 V (VCCCORE ) or, if 2.5 V ramps after core, pull up TESTHI to 2.5V (VCC2.5) with a 100 kΩ
resistor.
The groups and the signals contained within each group are shown in Table 3. Refer to Section 7.0
for descriptions of these signals.
18
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 3.
System Bus Signal Groups
Group Name
Signals
AGTL+ Input
BPRI#, BR1#, DEFER#, RESET#, RS[2:0]#, RSP#, TRDY#
AGTL+ Output
PRDY#
AGTL+ I/O
A[35:3]#, ADS#, AERR#, AP[1:0]#, BERR#, BINIT#, BNR#, BP[3:2]#, BPM[1:0]#, BR0#1,
D[63:0]#, DBSY#, DEP[7:0]#, DRDY#, HIT#, HITM#, LOCK#, REQ[4:0]#, RP#
CMOS Input5
A20M#, FLUSH#, IGNNE#, INIT#, LINT0/INTR, LINT1/NMI, PREQ#, PWRGOOD2 , SMI#,
SLP#3 , STPCLK#
CMOS Output5
FERR#, IERR#, THERMTRIP#4
System Bus Clock
BCLK
APIC Clock
PICCLK
APIC I/O
5
TAP Input
PICD[1:0]
5
TCK, TDI, TMS, TRST#
TAP Output5
TDO
Power/Other6
VCCCORE, V CCL2, VCC5, VID[4:0], V TT, VSS, SLOTOCC#, THERMDP, THERMDN,
100/66#, EMI
NOTES:
1. The BR0# pin is the only BREQ# signal that is bidirectional. The internal BREQ# signals are mapped onto BR# pins
after the agent ID is determined. See Section 7.0 for more information.
2. See Section 7.0 for information on the PWRGOOD signal.
3. See Section 7.0 for information on the SLP# signal.
4. See Section 7.0 for information on the THERMTRIP# signal.
5. These signals are specified for 2.5 V operation. See Table 2 for recommended pull-up resistor values.
6. VCCCORE is the power supply for the processor core and L2 cache I/O logic.
VCCL2 is the power supply for the L2 cache component core logic.
VID[4:0] is described in Section 2.6.
VTT is used to terminate the system bus and generate VREF on the processor substrate.
VSS is system ground.
TESTHI should be connected to 2.5 V with a 1–100 kΩ resistor.
VCC5 is not connected to the Pentium® II processors. This supply is used for the Slot 1 Test Kit.
SLOTOCC# is described in Section 7.0.
100/66# is described in Section 2.8.2 and Section 7.0.
EMI pins are described in Section 7.0.
THERMDP, THERMDN are described in Section 7.0.
2.8.1
Asynchronous vs. Synchronous for System Bus Signals
All AGTL+ signals are synchronous to BCLK. All of the CMOS, Clock, APIC, and TAP signals
can be applied asynchronously to BCLK.
All APIC signals are synchronous to PICCLK. All TAP signals are synchronous to TCK.
2.8.2
System Bus Frequency Select Signal (100/66#)
This bidirectional signal is used to select the system bus frequency. A logic low will select a
66 MHz system bus frequency and a logic high (3.3 V) will select a 100 MHz system bus
frequency. The frequency is determined by the processor(s), AGPset and frequency synthesizer. All
system bus agents must operate at the same frequency; in a two-way MP Pentium II processor
configuration, this signal must connect the pins of both Pentium II processors. This signal will be
grounded by processors that are only capable of operating at a host frequency of 66 MHz. On
Datasheet
19
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
motherboards which support operation at either 66 or 100 MHz, this signal must be pulled up to
3.3 V with a 1/4 W, 200Ω resistor (as shown in Figure 4) and provided as a frequency selection
signal to the clock driver/synthesizer. If the system motherboard is not capable of operating at
100 MHz (e.g., Intel 440FX PCIset and 440LX AGPset-based systems), it should ground this
signal and generate a 66 MHz system bus frequency. This signal can also be incorporated into
RESET# logic on the motherboard if only 100 MHz operation is supported (thus forcing the
RESET# signal to remain active as long as the 100/66# signal is low).
Figure 4.
100/66# Pin Example
3.3 Volts
CK100
200 Ω
100/66#
S
S
L
C
O
2T
4
21
Pentium® II Processor
Processor
Core
1 KΩ
3.3 KΩ
GND
2.9
Test Access Port (TAP) Connection
Due to the voltage levels supported by other components in the Test Access Port (TAP) logic, it is
recommended that the Pentium II processor be first in the TAP chain and followed by any other
components within the system. A translation buffer should be used to connect to the rest of the
chain unless one of the other components is capable of accepting a 2.5 V input. Similar
considerations must be made for TCK, TMS, and TRST#. Two copies of each signal may be
required with each driving a different voltage level.
The Debug Port will have to be placed at the start and end of the TAP chain with the TDI of the
first component coming from the Debug Port and the TDO from the last component going to the
Debug Port. In a two-way MP system, be cautious when including an empty SC 242 connector in
the scan chain. All connectors in the scan chain must have a processor installed to complete the
chain or the system must support a method to bypass the empty connectors; SC 242 terminator
substrates should not connect TDI to TDO in order to avoid placing the TDO pull-up resistors in
parallel. (See Slot 1 Bus Terminator Card Design Guidelines (Order Number 243409) for more
details.)
2.10
Maximum Ratings
Table 4 contains Pentium II processor stress ratings only. Functional operation at the absolute
maximum and minimum is not implied nor guaranteed. The processor should not receive a clock
while subjected to these conditions. Functional operating conditions are given in the AC and DC
tables in Section 2.11 and Section 2.13. Extended exposure to the maximum ratings may affect
device reliability. Furthermore, although the processor contains protective circuitry to resist
damage from static electric discharge, one should always take precautions to avoid high static
voltages or electric fields.
20
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 4.
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
TSTORAGE
Processor storage temperature
–40
85
°C
VCC(All)
Any processor supply voltage
with respect to V SS
–0.5
Operating voltage + 1.0
V
VinAGTL
AGTL+ buffer DC input
voltage with respect to VSS
–0.3
VCCCORE + 0.7
V
VinCMOS
CMOS buffer DC input
voltage with respect to VSS
–0.3
3.3
V
IVID
Max VID pin current
5
mA
ISLOTOCC
Max SLOTOCC# pin current
5
mA
Mech Max
Latch Arms
Mechanical integrity of latch
arms
50
Cycles
Mech Max Edge
Fingers
Mechanical integrity of
processor edge fingers
50
Insertions/
Extractions
Notes
1, 2
3
4
5, 6
NOTES:
1. Operating voltage is the voltage to which the component is designed to operate. See Table 5.
2. This rating applies to the VCC CORE, V CCL2 , VCC5, and any input (except as noted below) to the processor.
3. Parameter applies to CMOS, APIC, and TAP bus signal groups only.
4. The mechanical integrity of the latch arms is specified to last a maximum of 50 cycles.
5. The electrical and mechanical integrity of the processor edge fingers are specified to last for 50 insertion/extraction
cycles.
6. While insertion/extraction cycling above 50 insertions will cause an increase in the contact resistance (above 0.1Ω) and
a degradation in the material integrity of the edge finger gold plating, it is possible to have processor functionality above
the specified limit. The actual number of insertions before processor failure will vary based upon system configuration
and environmental conditions.
2.11
Processor DC Specifications
The processor DC specifications in this section are defined at the Pentium II processor edge
fingers. See Section 7.0 for the processor edge finger signal definitions and Section 5.0 for the
signal listing.
Most of the signals on the Pentium II processor system bus are in the AGTL+ signal group. These
signals are specified to be terminated to 1.5 V. The DC specifications for these signals are listed in
Table 6.
To allow connection with other devices, the Clock, CMOS, APIC, and TAP signals are designed to
interface at non-AGTL+ levels. The DC specifications for these pins are listed in Table 7.
Table 5 through Table 8 list the DC specifications for Pentium II processors operating at 100 MHz
processor system bus frequencies. Specifications are valid only while meeting specifications for
case temperature, clock frequency, and input voltages. Care should be taken to read all notes
associated with each parameter.
Datasheet
21
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 5.
Voltage and Current Specifications 1
Symbol
22
Parameter
Core Freq
Min
Typ
Max
Unit
Notes
V CCCORE
VCC for processor core
1.9
2.00
2.1
V
2, 4, 5, 6
V CCL2
VCC for second level
cache
3.135
3.30
3.465
V
3.3 V ±5% 7
V TT
AGTL+ bus termination
voltage
1.365
1.50
1.635
V
1.5 ±9% 8
Baseboard
Tolerance,
Static
Processor core voltage
static tolerance level at
SC 242 pins
–0.070
0.070
V
4, 9
Baseboard
Tolerance,
Transient
Processor core voltage
transient tolerance level
at SC 242 pins
–0.110
0.110
V
4, 9
V CCCORE
Tolerance,
Static
Processor core voltage
static tolerance level at
edge fingers
–0.085
0.085
V
4, 10
V CCCORE
Tolerance,
Transient
Processor core voltage
transient tolerance level
at edge fingers
–0.140
0.140
V
4, 10
I CCCORE
ICC for processor core
350 MHz
400 MHz
450 MHz
10.8
12.0
13.6
A
A
A
2, 4, 12, 13
2, 4, 12, 13
2, 4, 12, 13
I CCL2
ICC for second level
cache
350 MHz
400 MHz
450 MHz
0.7
0.9
1.0
A
A
A
4, 7, 12
4, 7, 12
4, 7, 12
I VTT
Termination voltage
supply current
2.7
A
14
I SGnt
ICC Stop-Grant for
processor core
0.8
0.9
1.0
A
A
A
4, 11, 12, 15
4, 11, 12, 15
4, 11, 12, 15
I SGntL2
ICC Stop-Grant for
second level cache
0.1
A
4, 7, 12
I SLP
ICC Sleep for processor
core
0.8
0.9
1.0
A
A
A
4, 11, 12
4, 11, 12
4, 11, 12
I SLPL2
ICC Sleep for second
level cache
0.1
A
4, 7, 12
I DSLP
ICC Deep Sleep for
processor core
0.35
A
I DSLPL2
ICC Deep Sleep for
second level cache
0.1
A
dICCCORE/dt
Power supply current
slew rate
20
A/µs
3, 16, 17, 18
dICCL2/dt
L2 cache power supply
current slew rate
1
A/µs
16, 17, 18
dICCvTT/dt
Termination current slew
rate
8
A/µs
See
Table 8 17, 18
V CC5
5 V supply voltage
5.25
V
5 V ±5% 19
I CC5
ICC for 5 V supply
voltage
A
19
350 MHz
400 MHz
450 MHz
350 MHz
400 MHz
450 MHz
4.75
5.00
1.0
12
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies and cache sizes.
2. VccCORE and IccCORE supply the processor core and the TagRAM and BSRAM I/O buffers.
3. This specification applies only to the Pentium® II processor. Unless otherwise noted, this specification applies to all
Pentium II processor frequencies and cache sizes.
4. This specification applies only to the Pentium II processor when operating with a 100 MHz Pentium II processor system
bus. Unless otherwise noted, this specification applies to all Pentium II processor cache sizes.
5. These voltages are targets only. A variable voltage source should exist on systems in the event that a different voltage is
required. See Section 2.5 and Table 1 for more information.
6. Use the Typical Voltage specification with the Tolerance specifications to provide correct voltage regulation to the
processor.
7. VCCL2 and ICCL2 supply the second level cache. Unless otherwise noted, this specification applies to all Pentium II
processor cache sizes. Systems should be designed for these specifications, even if a smaller cache size is used.
8. VTT must be held to 1.5 V ±9%. It is recommended that VTT be held to 1.5 V ±3% while the Pentium II processor
system bus is idle. This is measured at the processor edge fingers.
9. These are the tolerance requirements, across a 20 MHz bandwidth, at the SC 242 connector pin on the bottom side of the
baseboard. The requirements at the SC 242 connector pins account for voltage drops (and impedance discontinuities)
across the connector, processor edge fingers, and to the processor core. VccCORE must return to within the static voltage
specification within 100 µs after a transient event.
10. These are the tolerance requirements, across a 20 MHz bandwidth, at the processor edge fingers. The requirements at
the processor edge fingers account for voltage drops (and impedance discontinuities) at the processor edge fingers and
to the processor core. VccCORE must return to within the static voltage specification within 2 µs after a transient event.
11. These are estimated values not actual measurements.
12. Max I CC measurements are measured at VCC max voltage, 95 °C ±2 °C, under maximum signal loading conditions. The
Max Icc currents specified do not occur simultaneously under the stress measurement condition.
13. Voltage regulators may be designed with a minimum equivalent internal resistance to ensure that the output voltage, at
maximum current output, is no greater than the nominal (i.e., typical) voltage level of VccCORE (VccCORE_TYP). In this
case, the maximum current level for the regulator, IccCORE_REG , can be reduced from the specified maximum current
IccCORE _MAX and is calculated by the equation:
Icc CORE_REG = Icc CORE_MAX × VccCORE_TYP / (Vcc CORE_TYP + Vcc CORE Tolerance, Transient)
14. The current specified is the current required for a single Pentium II processor. A similar amount of current is drawn
through the termination resistors on the opposite end of the AGTL+ bus, unless single-ended termination is used (see
Section 2.1).
15. The current specified is also for AutoHALT state.
16. Maximum values are specified by design/characterization at nominal VccCORE and nominal V CCL2.
17. Based on simulation and averaged over the duration of any change in current. Use to compute the maximum inductance
tolerable and reaction time of the voltage regulator. This parameter is not tested.
18. dICC/dt specifications are measured and specified at the SC 242 connector pins.
19. VCC5 and ICC5 are not used by the Pentium II processors. This supply is used for the SC 242 Test Kit.
Datasheet
23
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 6.
AGTL+ Signal Groups DC Specifications 1
Symbol
Parameter
Min
Max
Unit
Notes
V IL
Input Low Voltage
–0.3
0.82
V
V IH
Input High Voltage
1.22
VTT
V
2, 3, 7, 8
Ron
Buffer On Resistance
16.67
Ω
6
IL
Leakage Current
±100
µA
4
I LO
Output Leakage Current
±15
µA
5
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. VIH and VOH for the Pentium II processor may experience excursions of up to 200 mV above VTT for a single system bus
clock. However, input signal drivers must comply with the signal quality specifications in Section 3.0.
3. Minimum and maximum VTT are given in Table 8.
4. (0 ≤ V IN ≤ 2.0 V +5%).
5. (0 ≤ V OUT ≤ 2.0 V +5%).
6. Refer to the I/O Buffer Models for IV characteristics.
7. Parameter correlated to measure into a 25Ω resistor terminated to 1.5 V.
8. Refer to the IO Buffer Models for IV characteristics.
Table 7.
Non-AGTL+ Signal Group DC Specifications 1
Symbol
Parameter
Min
Max
Unit
Notes
V IL
Input Low Voltage
–0.3
0.5
V
V IH
Input High Voltage
2.0
2.625
V
2.5 V +5% maximum
V OL
Output Low Voltage
0.4
V
2
V OH
Output High Voltage
N/A
2.625
V
All outputs are opendrain to 2.5 V +5%
I OL
Output Low Current
14
I LI
Input Leakage Current
±100
µA
3
I LO
Output Leakage Current
±15
µA
4
mA
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. Parameter measured at 14 mA (for use with TTL inputs).
3. (0 ≤ V IN ≤ 2.5 V +5%).
4. (0 ≤ V OUT ≤ 2.5 V +5%).
2.12
AGTL+ System Bus Specifications
It is recommended that the AGTL+ bus be routed in a daisy-chain fashion with termination
resistors to VTT at each end of the signal trace. These termination resistors are placed electrically
between the ends of the signal traces and the VTT voltage supply and generally are chosen to
approximate the substrate impedance. The valid high and low levels are determined by the input
buffers using a reference voltage called VREF.
Table 8 lists the nominal specification for the AGTL+ termination voltage (VTT). The AGTL+
reference voltage (VREF) is generated on the processor substrate for the processor core, but should
be set to 2/3 VTT for other AGTL+ logic using a voltage divider on the motherboard. It is important
that the motherboard impedance be specified and held to a 65Ω±15% tolerance, and that the
24
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
intrinsic trace capacitance for the AGTL+ signal group traces is known and well-controlled. For
more details on GTL+, see the Pentium® II Processor Developer's Manual (Order Number
243502) and AP-827, 100 MHz GTL+ Layout Guidelines for the Pentium ® II Processor and Intel®
440BX AGPset (Order Number 243735).
Table 8.
AGTL+ Bus Specifications 1, 2
Symbol
Parameter
VTT
Bus Termination Voltage
RTT
Termination Resistor
VREF
Bus Reference Voltage
Min
Typ
Max
Units
1.365
1.50
1.635
V
Notes
1.5 V ±9% 3
56
Ω
±5%
2/3 VTT
V
4
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. Pentium II processors contain AGTL+ termination resistors at the end of each signal trace on the processor substrate.
Pentium II processors generate VREF on the processor substrate by using a voltage divider on VTT supplied through the
SC 242 connector.
3. VTT must be held to 1.5 V ±9%; dICCVTT/dt is specified in Table 5. It is recommended that V TT be held to
1.5 V ±3% while the Pentium II processor system bus is idle. This is measured at the processor edge fingers.
4. VREF is generated on the processor substrate to be 2/3 VTT nominally.
2.13
System Bus AC Specifications
The Pentium II processor system bus timings specified in this section are defined at the Pentium II
processor edge fingers and the processor core pads. Unless otherwise specified, timings are tested
at the processor core during manufacturing. Timings at the processor edge fingers are specified by
design characterization. See Section 7.0 for the Pentium II processor edge connector signal
definitions. See the Pentium® II Processor at 233, 266, 300, and 333 MHz (Order Number 243335)
for more detail.
Table 9 through Table 20 list the AC specifications associated with the Pentium II processor system
bus. These specifications are broken into the following categories: Table 9 through Table 11
contain the system bus clock core frequency and cache bus frequencies, Table 12 and Table 13
contain the AGTL+ specifications, Table 14 and Table 15 are the CMOS signal group
specifications, Table 16 contains timings for the Reset conditions, Table 17 and Table 18 cover
APIC bus timing, and Table 19 and Table 20 cover TAP timing. For each pair of tables, the first
table contains timing specifications for measurement or simulation at the processor edge fingers.
The second table contains specifications for simulation at the processor core pads.
All Pentium II processor system bus AC specifications for the AGTL+ signal group are relative to
the rising edge of the BCLK input. All AGTL+ timings are referenced to VREF for both ‘0’ and ‘1’
logic levels unless otherwise specified.
The timings specified in this section should be used in conjunction with the I/O buffer models
provided by Intel. These I/O buffer models, which include package information, are available for
the Pentium II processor in Quad format as the Pentium® II Processor I/O Buffer Models, Quad
Format (Electronic Form) on Intel’s website: “http://www.intel.com.” GTL+ layout guidelines are
also available in AP-827, 100 MHz GTL+ Layout Guidelines for the Pentium ® II Processor and
Intel® 440BX AGPset (Order Number 243735).
Care should be taken to read all notes associated with a particular timing parameter.
Datasheet
25
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 9.
System Bus AC Specifications (Clock) at the Processor Edge Fingers 1, 2, 3
T# Parameter
Min
Nom
System Bus Frequency
T1’: BCLK Period
Max
Unit
100.00
MHz
10.0
T1B’: SC 242 to Core Logic BCLK Offset
0.78
Notes
Figure
All processor core
frequencies 4
ns
6
4, 5
ns
6
Absolute Value 7, 8
T2’: BCLK Period Stability
See Table 10
T3’: BCLK High Time
2.1
ns
6
@>2.0 V 6
T4’: BCLK Low Time
1.97
ns
6
@<0.5 V 6
T5’: BCLK Rise Time
0.88
2.37
ns
6
(0.5 V–2.0 V) 6, 9
T6’: BCLK Fall Time
1.13
2.94
ns
6
(2.0 V–0.5 V) 6, 9
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. All AC timings for the AGTL+ signals are referenced to the BCLK rising edge at 0.50 V at the processor edge fingers.
This reference is to account for trace length and capacitance on the processor substrate, allowing the processor core to
receive the signal with a reference at 1.25 V. All AGTL+ signal timings (address bus, data bus, etc.) are referenced at
1.00 V at the processor edge fingers.
3. All AC timings for the CMOS signals are referenced to the BCLK rising edge at 0.7 V at the processor edge fingers.
This reference is to account for trace length and capacitance on the processor substrate, allowing the processor core to
receive the signal with a reference at 1.25 V. All CMOS signal timings (compatibility signals, etc.) are referenced at
1.25 V at the processor edge fingers.
4. The internal core clock frequency is derived from the Pentium II processor system bus clock. The system bus clock to
core clock ratio is determined during initialization as described in Section 2.5. Table 11 shows the supported ratios for
each processor.
5. The BCLK period allows a +0.5 ns -0.0ns tolerance for clock driver variation.
6. This specification applies to Pentium II processors when operating with a Pentium II processor system bus frequency of
100 MHz.
7. The BCLK offset time is the absolute difference needed between the BCLK signal arriving at the Pentium II processor
edge finger at 0.5 V vs. arriving at the core logic at 1.25 V. The positive offset is needed to account for the delay
between the SC 242 connector and processor core. The positive offset ensures both the processor core and the core logic
receive the BCLK edge concurrently.
8. See Section 3.1 for Pentium II processor system bus clock signal quality specifications.
9. Not 100% tested. Specified by design characterization as a clock driver requirement.
26
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 10. System Bus AC Specifications (Clock) at Processor Core Pins 1, 2, 3
T# Parameter
Min
Nom
System Bus Frequency
T1: BCLK Period
Max
Unit
100.00
MHz
10.0
T2: BCLK Period Stability
±250
Figure
Notes
All processor core
frequencies 4
ns
6
4, 5, 6, 10
ps
6
6, 7, 8, 10
T3: BCLK High Time
2.6
ns
6
@>2.0 V 6
T4: BCLK Low Time
2.47
ns
6
@<0.5 V 6
T5: BCLK Rise Time
0.38
1.25
ns
6
(0.5 V–2.0 V) 6, 9
T6: BCLK Fall Time
0.38
1.5
ns
6
(2.0 V–0.5 V) 6, 9
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. All AC timings for the AGTL+ signals are referenced to the BCLK rising edge at 1.25 V at the processor core pin. All
AGTL+ signal timings (address bus, data bus, etc.) are referenced at 1.00 V at the processor core pins.
3. All AC timings for the CMOS signals are referenced to the BCLK rising edge at 1.25 V at the processor core pin. All
CMOS signal timings (compatibility signals, etc.) are referenced at 1.25 V at the processor core pins.
4. The internal core clock frequency is derived from the Pentium II processor system bus clock. The system bus clock to
core clock ratio is determined during initialization as described in Section 2.5. Table 11 shows the supported ratios for
each processor.
5. The BCLK period allows a +0.5 ns tolerance for clock driver variation.
6. This specification applies to the Pentium II processor when operating with a Pentium II processor system bus frequency
of 100 MHz.
7. Due to the difficulty of accurately measuring clock jitter in a system, it is recommended that a clock driver be used that
is designed to meet the period stability specification into a test load of 10 to 20 pF. This should be measured on the
rising edges of adjacent BCLKs crossing 1.25 V at the processor core pin. The jitter present must be accounted for
as a component of BCLK timing skew between devices.
8. The clock driver’s closed loop jitter bandwidth must be set low to allow any PLL-based device to track the jitter created
by the clock driver. The –20 dB attenuation point, as measured into a 10 to 20 pF load, should be less than 500 kHz. This
specification may be ensured by design characterization and/or measured with a spectrum analyzer.
9. Not 100% tested. Specified by design characterization as a clock driver requirement.
10. The average period over a 1uS period of time must be greater than the minimum specified period.
Table 11. Valid System Bus, Core Frequency, and Cache Bus Frequencies 1, 2
Core Frequency (MHz)
BCLK Frequency (MHz)
Frequency Multiplier
L2 Cache (MHz)
350.00
100.00
7/2
175.00
400.00
100.00
4/1
200.00
450.00
100.00
9/2
225.00
NOTES:
1. Contact your local Intel representative for the latest information on processor frequencies and/or frequency multipliers.
2. While other bus ratios are defined, operation at frequencies other than those listed are not supported.
Datasheet
27
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 12. System Bus AC Specifications (AGTL+ Signal Group)at the Processor Edge Fingers 1, 2, 3
Notes
T# Parameter
Min
Max
Unit
Figure
T7’: AGTL+ Output Valid Delay
0.71
4.66
ns
7
4
T8’: AGTL+ Input Setup Time
1.97
ns
8
5, 6, 7
T9’: AGTL+ Input Hold Time
1.61
ns
8
8
T10’: RESET# Pulse Width
1.00
ms
10
9
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. Not 100% tested. Specified by design characterization.
3. All AC timings for AGTL+ signals are referenced to the BCLK rising edge at 0. 7 V at the processor edge fingers. All
AGTL+ signal timings (compatibility signals, etc.) are referenced at 1.00 V at the processor edge fingers.
4. Valid delay timings for these signals are specified into 50Ω to 1.5 V and with VREF at 1.0 V.
5. A minimum of 3 clocks must be guaranteed between two active-to-inactive transitions of TRDY#.
6. RESET# can be asserted (active) asynchronously, but must be deasserted synchronously.
7. Specification is for a minimum 0.40 V swing.
8. Specification is for a maximum 1.0 V swing.
9. After VCCCORE , VCCL2 , and BCLK become stable.
Table 13. System Bus AC Specifications (AGTL+ Signal Group) at the Processor Core Pins 1, 2, 3
Notes
T# Parameter
Min
Max
Unit
Figure
T7: AGTL+ Output Valid Delay
-0.20
3.45
ns
7
4
T8: AGTL+ Input Setup Time
2.10
ns
8
5, 6, 7
T9: AGTL+ Input Hold Time
0.85
ns
8
8
T10: RESET# Pulse Width
1.00
ms
10
6, 9
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. These specifications are tested during manufacturing.
3. All AC timings for the AGTL+ signals are referenced to the BCLK rising edge at 1.25 V at the processor core pin. All
AGTL+ signal timings (compatibility signals, etc.) are referenced at 1.00 V at the processor core pins.
4. Valid delay timings for these signals are specified into 25Ω to 1.5 V and with VREF at 1.0 V.
5. A minimum of 3 clocks must be guaranteed between two active-to-inactive transitions of TRDY#.
6. RESET# can be asserted (active) asynchronously, but must be deasserted synchronously.
7. Specification is for a minimum 0.40 V swing.
8. Specification is for a maximum 1.0 V swing.
9. This should be measured after VCCCORE, V CCL2, and BCLK become stable.
28
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 14. System Bus AC Specifications (CMOS Signal Group) at the Processor Edge Fingers 1, 2, 3, 4
Notes
T# Parameter
Min
Max
Unit
Figure
T11’: CMOS Output Valid Delay
1.00
10.5
ns
7
5
T12’: CMOS Input Setup Time
4.50
ns
8
6, 7, 8
T13’: CMOS Input Hold Time
1.50
ns
8
6, 7
T14’: CMOS Input Pulse Width, except
PWRGOOD
2
BCLKs
7
Active and Inactive
states
T15’: PWRGOOD Inactive Pulse Width
10
BCLKs
7, 10
8
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. Not 100% tested. Specified by design characterization.
3. All AC timings for the CMOS signals are referenced to the BCLK rising edge at 0.5 V at the processor edge fingers. All
CMOS signal timings (address bus, data bus, etc.) are referenced at 1.25 V.
4. These signals may be driven asynchronously.
5. Valid delay timings for these signals are specified to 2.5 V +5%. See Table 2 for pull-up resistor values.
6. To ensure recognition on a specific clock, the setup and hold times with respect to BCLK must be met.
7. INTR and NMI are only valid when the local APIC is disabled. LINT[1:0] are only valid when the local APIC is
enabled.
8. When driven inactive or after VCC CORE, V CCL2, and BCLK become stable.
Table 15. System Bus AC Specifications (CMOS Signal Group)at the Processor Core Pins 1, 2, 3, 4
Unit
Notes
T# Parameter
Min
Max
Figure
T11: CMOS Output Valid Delay
0.00
8.00
ns
7
5
T12: CMOS Input Setup Time
4.00
ns
8
6, 7, 8
T13: CMOS Input Hold Time
1.30
ns
8
6, 7
T14: CMOS Input Pulse Width, except
PWRGOOD
2
BCLKs
7
Active and Inactive
states
T15: PWRGOOD Inactive Pulse Width
10
BCLKs
7, 10
9
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. These specifications are tested during manufacturing.
3. All AC timings for the CMOS signals are referenced to the BCLK rising edge at 1.25 V at the processor core pins. All
CMOS signal timings (address bus, data bus, etc.) are referenced at 1.25 V.
4. These signals may be driven asynchronously.
5. Valid delay timings for these signals are specified to 2.5 V +5%. See Table 2 for pull-up resistor values.
6. This specification applies to Pentium II processors operating with a 100-MHz Pentium II processor system bus only.
7. To ensure recognition on a specific clock, the setup and hold times with respect to BCLK must be met.
8. INTR and NMI are only valid when the local APIC is disabled. LINT[1:0] are only valid when the local APIC is
enabled.
9. When driven inactive or after VCC CORE, V CCL2, and BCLK become stable.
Datasheet
29
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 16. System Bus AC Specifications (Reset Conditions) 1
T# Parameter
Min
T16: Reset Configuration Signals
(A[14:5]#, BR0#, FLUSH#,
INIT#) Setup Time
4
T17: Reset Configuration Signals
(A[14:5]#, BR0#, FLUSH#,
INIT#) Hold Time
2
T18: Reset Configuration Signals
(A20M#, IGNNE#, LINT[1:0])
Setup Time
1
T19: Reset Configuration Signals
(A20M#, IGNNE#, LINT[1:0])
Delay Time
T20: Reset Configuration Signals
(A20M#, IGNNE#, LINT[1:0])
Hold Time
2
Max
Unit
Notes
Figure
BCLKs
9
Before deassertion of
RESET#
BCLKs
9
After clock that
deasserts RESET#
ms
9
Before deassertion of
RESET#
5
BCLKs
9
After assertion of
RESET# 2
20
BCLKs
9, 10
After clock that
deasserts RESET#
20
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. For a Reset, the clock ratio defined by these signals must be a safe value (their final or a lower multiplier) within this
delay unless PWRGOOD is being driven inactive.
Ta b le 1 7. S ystem B u s A C S p e cific ation s (A P IC C lo ck a n d A P IC I/O ) at th e P roce ssor E d g e F in g ers 1, 2, 3
T# Parameter
Min
Max
Unit
T21’: PICCLK Frequency
2.0
33.3
MHz
T22’: PICCLK Period
30.0
500.0
ns
Figure
Notes
6
T23’: PICCLK High Time
12.0
ns
6
T24’: PICCLK Low Time
12.0
ns
6
T25’: PICCLK Rise Time
1.0
5.0
ns
6
T26’: PICCLK Fall Time
1.0
5.0
ns
6
T27’: PICD[1:0] Setup Time
8.5
ns
8
4
T28’: PICD[1:0] Hold Time
3.0
ns
8
4
T29’: PICD[1:0] Valid Delay
3.0
ns
7
4, 5, 6
12.0
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. Not 100% tested. Specified by design characterization.
3. All AC timings for the APIC I/O signals are referenced to the PICCLK rising edge at 0.7 V at the processor edge
fingers. All APIC I/O signal timings are referenced at 1.25 V at the processor edge fingers.
4. Referenced to PICCLK rising edge.
5. For open drain signals, valid delay is synonymous with float delay.
6. Valid delay timings for these signals are specified to 2.5 V +5%. See Table 2 for recommended pull-up resistor values.
30
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 18. System Bus AC Specifications (APIC Clock and APIC I/O)at the Processor Core Pins 1, 2, 3
Notes
T# Parameter
Min
Max
Unit
T21: PICCLK Frequency
2.0
33.3
MHz
T22: PICCLK Period
30.0
500.0
ns
T23: PICCLK High Time
12.0
ns
6
T24: PICCLK Low Time
12.0
ns
6
T25: PICCLK Rise Time
1.0
5.0
ns
6
T26: PICCLK Fall Time
1.0
5.0
ns
6
T27: PICD[1:0] Setup Time
8.0
ns
8
T28: PICD[1:0] Hold Time
2.5
ns
8
4
T29: PICD[1:0] Valid Delay
1.5
ns
7
4, 5, 6
10.0
Figure
6
4
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. These specifications are tested during manufacturing.
3. All AC timings for the APIC I/O signals are referenced to the PICCLK rising edge at 1.25 V at the processor core pins.
All APIC I/O signal timings are referenced at 1.25 V at the processor core pins.
4. Referenced to PICCLK rising edge.
5. For open drain signals, valid delay is synonymous with float delay.
6. Valid delay timings for these signals are specified to 2.5 V +5%. See Table 2 for recommended pull-up resistor values.
Table 19. System Bus AC Specifications (TAP Connection)at the Processor Edge Fingers 1, 2, 3
T# Parameter
Min
T30’: TCK Frequency
Unit
16.667
MHz
Notes
Figure
T31’: TCK Period
60.0
ns
6
T32’: TCK High Time
25.0
ns
6
@1.7 V
T33’: TCK Low Time
25.0
ns
6
@0.7 V
T34’: TCK Rise Time
5.0
ns
6
(0.7 V–1.7 V) 4
T35’: TCK Fall Time
5.0
ns
6
(1.7 V–0.7 V) 4
T36’: TRST# Pulse Width
40.0
ns
12
Asynchronous
T37’: TDI, TMS Setup Time
5.5
ns
11
5
T38’: TDI, TMS Hold Time
14.5
T39’: TDO Valid Delay
2.0
T40’: TDO Float Delay
T41’: All Non-Test Outputs Valid Delay
2.0
T42’: All Non-Test Inputs Setup Time
Datasheet
Max
ns
11
5
13.5
ns
11
6, 7
28.5
ns
11
6, 7
27.5
ns
11
6, 8, 9
27.5
ns
11
6, 8, 9
T43’: All Non-Test Inputs Setup Time
5.5
ns
11
5, 8, 9
T44’: All Non-Test Inputs Hold Time
14.5
ns
11
5, 8, 9
31
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. All AC timings for the TAP signals are referenced to the TCK rising edge at 0.7 V at the processor edge fingers. All
TAP signal timings (TMS, TDI, etc.) are referenced at 1.25 V at the processor edge fingers.
3. Not 100% tested. Specified by design characterization.
4. 1 ns can be added to the maximum TCK rise and fall times for every 1 MHz below 16.667 MHz.
5. Referenced to TCK rising edge.
6. Referenced to TCK falling edge.
7. Valid delay timing for this signal is specified to 2.5 V +5%. See Table 2 for pull-up resistor values.
8. Non-Test Outputs and Inputs are the normal output or input signals (besides TCK, TRST#, TDI, TDO, and TMS). These
timings correspond to the response of these signals due to TAP operations.
9. During Debug Port operation, use the normal specified timings rather than the TAP signal timings.
Table 20. System Bus AC Specifications (TAP Connection)at the Processor Core Pins 1, 2, 3
T# Parameter
Min
T30: TCK Frequency
Max
Unit
16.667
MHz
Notes
Figure
T31: TCK Period
60.0
ns
6
T32: TCK High Time
25.0
ns
6
@1.7 V 10
T33: TCK Low Time
25.0
ns
6
@0.7 V 10
T34: TCK Rise Time
5.0
ns
6
(0.7 V–1.7 V) 4, 10
T35: TCK Fall Time
5.0
ns
6
(1.7 V–0.7 V) 4, 10
T36: TRST# Pulse Width
40.0
ns
12
Asynchronous 10
T37: TDI, TMS Setup Time
5.0
ns
11
5
T38: TDI, TMS Hold Time
14.0
T39: TDO Valid Delay
1.0
T40: TDO Float Delay
T41: All Non-Test Outputs Valid Delay
2.0
T42: All Non-Test Inputs Setup Time
ns
11
5
10.0
ns
11
6, 7
25.0
ns
11
6, 7, 10
25.0
ns
11
6, 8, 9
25.0
ns
11
6, 8, 9, 10
T43: All Non-Test Inputs Setup Time
5.0
ns
11
5, 8, 9
T44: All Non-Test Inputs Hold Time
13.0
ns
11
5, 8, 9
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. All AC timings for the TAP signals are referenced to the TCK rising edge at 1.25 V at the processor core pins. All TAP
signal timings (TMS, TDI, etc.) are referenced at 1.25 V at the processor core pins.
3. These specifications are tested during manufacturing, unless otherwise noted.
4. 1 ns can be added to the maximum TCK rise and fall times for every 1 MHz below 16.667 MHz.
5. Referenced to TCK rising edge.
6. Referenced to TCK falling edge.
7. Valid delay timing for this signal is specified to 2.5 V +5%. See Table 2 for pull-up resistor values.
8. Non-Test Outputs and Inputs are the normal output or input signals (besides TCK, TRST#, TDI, TDO, and TMS). These
timings correspond to the response of these signals due to TAP operations.
9. During Debug Port operation, use the normal specified timings rather than the TAP signal timings.
10. Not 100% tested. Specified by design characterization.
32
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 5.
BCLK to Core Logic Offset
BCLK at
Edge Fingers
0.5V
T7
BCLK at
Core Logic
1.25V
000807
Note:
For Figure 6 through Figure 12, the following apply:
1. Figure 6 through Figure 12 are to be used in conjunction with Table 9 through Table 20.
2. All AC timings for the AGTL+ signals at the processor edge fingers are referenced to the
BCLK rising edge at 0.50 V. This reference is to account for trace length and capacitance on
the processor substrate, allowing the processor core to receive the signal with a reference at
1.25 V. All AGTL+ signal timings (address bus, data bus, etc.) are referenced at 1.00 V at the
processor edge fingers.
3. All AC timings for the AGTL+ signals at the processor core pins are referenced to the BCLK
rising edge at 1.25 V. All GTL+ signal timings (address bus, data bus, etc.) are referenced at
1.00 V at the processor core pins.
4. All AC timings for the CMOS signals at the processor edge fingers are referenced to the
BCLK rising edge at 0.50 V. This reference is to account for trace length and capacitance on
the processor substrate, allowing the processor core to receive the signal with a reference at
1.25 V. All CMOS signal timings (compatibility signals, etc.) are referenced at 1.25 V at the
processor edge fingers.
5. All AC timings for the APIC I/O signals at the processor edge fingers are referenced to the
PICCLK rising edge at 0.7 V. All APIC I/O signal timings are referenced at 1.25 V at the
processor edge fingers.
6. All AC timings for the TAP signals at the processor edge fingers are referenced to the TCK
rising edge at 0.70 V. All TAP signal timings (TMS, TDI, etc.) are referenced at 1.25 V at the
processor edge fingers.
Datasheet
33
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 6.
BCLK, PICCLK, and TCK Generic Clock Waveform
th
tr
1.7V (2.0V*)
1.25V
CLK
0.7V (0.5V*)
tf
tl
tp
Tr
Tf
Th
Tl
Tp
=
=
=
=
=
T5,
T6,
T3,
T4,
T1,
pT25, T34 (Rise Time)
T26, T35 (Fall Time)
T23, T32 (High Time)
T24, T33 (Low Time)
T22, T31 (BLCK, TCK, PCICLK Period)
Note: BCLK is referenced to 0.5 V and 2.0 V. PICCLK and TCK are referenced to
0.7 V and 1.7 V
000761a
Figure 7.
System Bus Valid Delay Timings
CLK
Tx
Tx
V
Signal
Valid
Valid
Tpw
Tx
= T7, T11, T29 (Valid Delay)
Tpw = T14, T15 (Pulse Wdith)
V
= 1.0V for GTL+ signal group; 1.25V for CMOS, APIC and JTAG signal groups
000762b
Figure 8.
System Bus Setup and Hold Timings
CLK
Ts
Signal
Th
V Valid
Ts = T8, T12, T27 (Setup Time)
Th = T9, T13, T28 (Hold Time)
V = 1.0V for GTL+ signal group; 1.25V for CMOS, APIC and JTAG signal groups
000763b
34
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 9.
System Bus Reset and Configuration Timings
BCLK
Tu
Tt
RESET#
Tv
Ty
Configuration
(A20M#, IGNNE#,
LINT[1:0])
Tx
Tz
Safe
Valid
Tw
Configuration
(A[14:5]#, BR0#,
FLUSH#, INT#)
Valid
T9 and T9' (GTL+ Input Hold Time)
T8 and T8' (GTL+ Input Setup Time)
T10 and T10' (RESET# Pulse Width)
T16 (Reset Configuration Signals (A[14:5]#, BR0#, FLUSH#, INIT#) Setup Time)
T17 (Reset Configuration Signals (A[14:5]#, BR0#, FLUSH#, INIT#) Hold Time)
T20 (Reset Configuration Signals (A20M#, IGNNE#, LINT[1:0]) Hold Time)
T y = T19 (Reset Configuration Signals (A20M#, IGNNE#, LINT[1:0]) Delay Time)
Tz = T18 (Reset Configuration Signals (A20M#, IGNNE#, LINT[1:0]) Setup Time)
Tt
Tu
Tv
Tw
Tx
=
=
=
=
=
PCD-764
Figure 10. Power-On Reset and Configuration Timings
BCLK
V C C,P ,
V C C,
VR E F
PWRGOOD
V IL,max
Ta
V IH,min
Tb
RESET#
Tc
C o n f ig u r a t i o n
(A20M#, IGNNE#,
INTR, NMI)
Valid Ratio
Ta = T15 and T15' (PWRGOOD Inactive Pulse Width)
Tb = T10 and T10' (RESET# Pulse Width)
Tc = T20 (Reset Configuration Signals (A20M#, IGNNE#, LINT[1:0]) Hold Time)
D0007-02
Datasheet
35
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 11. Test Timings (TAP Connection)
1.25V
TCK
Tv
Tw
Tr
Ts
1.25V
TDI, TMS
Input
Signals
Tx
Tu
Ty
Tz
TDO
Output
Signals
Tr = T43 (All Non-Test Inputs Setup Time)
Ts = T44 (All Non-Test Inputs Hold Time)
Tu = T40 (TDO Float Delay)
Tv = T37 (TDI, TMS Setup Time)
Tw = T38 (TDI, TMS Hold Time)
Tx = T39 (TDO Valid Delay)
Ty = T41 (All Non-Test Outputs Valid Delay)
Tz = T42 (All Non-Test Outputs Float Delay)
PCB766a
Figure 12. Test Reset Timings
TRST#
1.25V
Tq
Tq = T37 (TRST# Pulse Width)
PCB-773
3.0
System Bus Signal Simulations
Signals driven on the Pentium II processor system bus should meet signal quality specifications to
ensure that the components read data properly and to ensure that incoming signals do not affect the
long term reliability of the component. Specifications are provided for simulation at the processor
core; guidelines are provided for correlation to the processor edge fingers. These edge finger
guidelines are intended for use during testing and measurement of system signal integrity.
Violations of these guidelines are permitted, but if they occur, simulation of signal quality at the
processor core should be performed to ensure that no violations of signal quality specifications
occur. Meeting the specifications at the processor core in Table 21, Table 23, and Table 25 ensures
that signal quality effects will not adversely affect processor operation, but does not necessarily
guarantee that the guidelines in Table 22, Table 24, and Table 26 will be met.
36
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
3.1
System Bus Clock (BCLK) Signal Quality Specifications and
Measurement Guidelines
Table 21 describes the signal quality specifications at the processor core for the Pentium II
processor system bus clock (BCLK) signal. Table 22 describes guidelines for signal quality
measurement at the processor edge fingers. Figure 13 describes the signal quality waveform for the
system bus clock at the processor core pins. Figure 14 describes the signal quality waveform for the
system bus clock at the processor edge fingers.
Table 21. BCLK Signal Quality Specifications for Simulation at the Processor Core 1
T# Parameter
Min
Nom
V1: BCLK VIL
V2: BCLK VIH
2.0
V3: VIN Absolute Voltage Range
–0.7
V4: Rising Edge Ringback
1.7
V5: Falling Edge Ringback
Notes
Max
Unit
Figure
0.5
V
13
V
13
2
3.3
V
13
2
V
13
3
0.7
V
13
3
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. This is the Pentium II processor system bus clock overshoot and undershoot specification for 100-MHz system bus
operation.
3. The rising and falling edge ringback voltage specified is the minimum (rising) or maximum (falling) absolute voltage
the BCLK signal can dip back to after passing the VIH (rising) or VIL (falling) voltage limits. This specification is an
absolute value.
Figure 13. BCLK, TCK, PICCLK Generic Clock Waveform at the Processor Core Pins
T3
V3
V2
V4
Voltage
V2
V1
V5
V1
V3
T6
T4
T5
Time
Datasheet
37
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 22.
BCLK Signal Quality Guidelines for Edge Finger Measurement 1
T# Parameter
Min
Nom
V1’: BCLK VIL
V2’: BCLK VIH
2.0
V3’: VIN Absolute Voltage Range
–0.5
V4’: Rising Edge Ringback
2.0
Unit
Figure
0.5
V
14
V
14
3.3
V5’: Falling Edge Ringback
V6’: Tline Ledge Voltage
Max
1.0
V7’: Tline Ledge Oscillation
Notes
V
14
2
V
14
3
0.5
V
14
3
1.7
V
14
At Ledge Midpoint 4
0.2
V
14
Peak-to-Peak 5
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. This is the Pentium II processor system bus clock overshoot and undershoot measurement guideline.
3. The rising and falling edge ringback voltage guideline is the minimum (rising) or maximum (falling) absolute voltage
the BCLK signal may dip back to after passing the VIH (rising) or V IL (falling) voltage limits. This guideline is an
absolute value.
4. The BCLK at the processor edge fingers may have a dip or ledge midway on the rising or falling edge. The midpoint
voltage level of this ledge should be within the range of the guideline.
5. The ledge (V7’) is allowed to have peak-to-peak oscillation as given in the guideline.
Figure 14. BCLK, TCK, PICCLK Generic Clock Waveform at the Processor Edge Fingers
T3
V3
’
’
V4
V2
Vo ltag e
’
V7
V6
V1
’
’
’
V5
’
V3
T6
T4
’
T5
Tim e
3.2
000808
AGTL+ Signal Quality Specifications and Measurement
Guidelines
Many scenarios have been simulated to generate a set of GTL+ layout guidelines which are
available in AP-827, 100 MHz GTL+ Layout Guidelines for the Pentium® II Processor and Intel®
440BX AGPset (Order Number 243735). Refer to the Pentium® II Processor Developer's Manual
(Order Number 243502) for the GTL+ buffer specification.
38
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 23 provides the AGTL+ signal quality specifications for Pentium II processors for use in
simulating signal quality at the processor core. Table 24 provides AGTL+ signal quality guidelines
for measuring and testing signal quality at the processor edge fingers. Figure 15 describes the
signal quality waveform for AGTL+ signals at the processor core and edge fingers. For more
information on the AGTL+ interface, see the Pentium ® II Processor Developer's Manual (Order
Number 243502).
Table 23. AGTL+ Signal Groups Ringback Tolerance Specifications at the Processor Core 1, 2, 3
T# Parameter
Notes
Min
Unit
Figure
α: Overshoot
100
mV
15
4
τ: Minimum Time at High
0.50
ns
15
4
ρ: Amplitude of Ringback
–20
mV
15
4, 5, 6
φ: Final Settling Voltage
20
mV
15
4
N/A
ns
15
δ: Duration of Squarewave Ringback
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
2. Specifications are for the edge rate of 0.3 - 0.8 V/ns. See Figure 15 for the generic waveform.
3. All values specified by design characterization.
4. This specification applies to Pentium II processors operating with a 100-MHz Pentium II processor system bus only.
5. Ringback below VREF + 20 mV is not supported.
6. Intel recommends performing simulations using an amplitude of -120 mV to allow margin for other sources of system
noise.
Table 24. AGTL+ Signal Groups Ringback Tolerance Guidelines for Edge Finger Measurement 1, 2, 3
Notes
T# Parameter
Min
Unit
Figure
α’: Overshoot
100
mV
15
τ’: Minimum Time at High
0.5
ns
15
ρ’: Amplitude of Ringback
–210
mV
15
4,5
φ’: Final Settling Voltage
210
mV
15
4
δ’: Duration of Squarewave Ringback
N/A
ns
15
4
NOTES:
1. Unless otherwise noted, all guidelines in this table apply to all Pentium® II processor frequencies and cache sizes.
2. Guidelines are for the edge rate of 0.3 - 0.8 V/ns. See Figure 15 for the generic waveform.
3. All values specified by design characterization.
4. This guideline applies to Pentium II processors operating with a 100-MHz Pentium II processor system bus only.
5. Ringback below VREF + 210 mV is not supported.
Datasheet
39
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 15. Low to High AGTL+ Receiver Ringback Tolerance
τ
α
VREF +0.2
φ
VREF
ρ
VREF –0.2
δ
0.7V Clk Ref
Vstart
Clock
Time
Note: High to Low case is analogous.
000914a
3.3
Non-AGTL+ Signal Quality Specifications and Measurement
Guidelines
There are three signal quality parameters defined for non-AGTL+ signals: overshoot/undershoot,
ringback, and settling limit. All three signal quality parameters are shown in Figure 16 for the nonAGTL+ signal group.
Figure 16. Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback
Settling Limit
Overshoot
VHI = VCC
2.5
Rising-Edge
Ringback
Falling-Edge
Ringback
Settling Limit
VLO
VSS
Time
Undershoot
000767b
40
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
3.3.1
Overshoot/Undershoot Guidelines
Overshoot (or undershoot) is the absolute value of the maximum voltage above the nominal high
voltage or below VSS. The overshoot/undershoot guideline limits transitions beyond VCC or VSS due
to the fast signal edge rates. (See Figure 16 for non-AGTL+ signals.) The processor can be
damaged by repeated overshoot events on 2.5 V tolerant buffers if the charge is large enough (i.e.,
if the overshoot is great enough). However, excessive ringback is the dominant detrimental system
timing effect resulting from overshoot/undershoot (i.e., violating the overshoot/undershoot
guideline will make satisfying the ringback specification difficult). The overshoot/undershoot
guideline is 0.7 V and assumes the absence of diodes on the input. These guidelines should be
verified in simulations without the on-chip ESD protection diodes present because the diodes
will begin clamping the 2.5 V tolerant signals beginning at approximately 0.7 V above the 2.5 V
supply and 0.7 V below VSS. If signals are not reaching the clamping voltage, this will not be an
issue. A system should not rely on the diodes for overshoot/undershoot protection as this will
negatively affect the life of the components and make meeting the ringback specification very
difficult.
3.3.2
Ringback Specification
Ringback refers to the amount of reflection seen after a signal has switched. The ringback
specification is the voltage that the signal rings back to after achieving its maximum absolute
value. (See Figure 16 for an illustration of ringback.) Excessive ringback can cause false signal
detection or extend the propagation delay. The ringback specification applies to the input pin of
each receiving agent. Violations of the signal ringback specification are not allowed under any
circumstances for non-AGTL+ signals.
Ringback can be simulated with or without the input protection diodes that can be added to the
input buffer model. However, signals that reach the clamping voltage should be evaluated further.
See Table 25 for the signal ringback specifications for non-AGTL+ signals for simulations at the
processor core, and Table 26 for guidelines on measuring ringback at the edge fingers.
Table 25. Signal Ringback Specifications for Non-AGTL+ Signal Simulation at the Processor Core 1
Transition
Maximum Ringback
(with Input Diodes Present)
Unit
Figure
Non-AGTL+ Signals
0→1
1.7
V
16
Non-AGTL+ Signals
1→0
0.7
V
16
Input Signal Group
NOTE:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
Table 26. Signal Ringback Guidelines for Non-AGTL+ Signal Edge Finger Measurement 1
Transition
Maximum Ringback
(with Input Diodes Present)
Unit
Figure
Non-AGTL+ Signals
0→1
2.0
V
16
Non-AGTL+ Signals
1→0
0.7
V
16
Input Signal Group
NOTE:
1. Unless otherwise noted, all specifications in this table apply to all Pentium® II processor frequencies and cache sizes.
Datasheet
41
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
3.3.3
Settling Limit Guideline
Settling limit defines the maximum amount of ringing at the receiving pin that a signal must reach
before its next transition. The amount allowed is 10% of the total signal swing (VHI –VLO) above and
below its final value. A signal should be within the settling limits of its final value, when either in
its high state or low state, before it transitions again.
Signals that are not within their settling limit before transitioning are at risk of unwanted
oscillations which could jeopardize signal integrity. Simulations to verify settling limit may be
done either with or without the input protection diodes present. Violation of the settling limit
guideline is acceptable if simulations of 5 to 10 successive transitions do not show the amplitude of
the ringing increasing in the subsequent transitions.
4.0
Thermal Specifications and Design Considerations
Initial Pentium II processors take advatange of S.E.C.C. package technology. This technology uses
an extended thermal plate for heatsink attachment. The extended thermal plate interface is intended
to provide accessiblity for multiple types of thermal solutions. Follow-on releases of the Pentium II
processor use S.E.C.C.2 packaging technology. This pakaging technology doesn’t incorporate an
extended thermal plate. Processors which use S.E.C.C.2 packaging technology have either a PLGA
or an OLGA processor core that is surface mounted onto the substrate. All three of these package
variations require unique thermal measuring processes. This chapter provides needed data for
designing a thermal solution. However, for the correct thermal measuring processes please refer to
AP-586, Pentium® II Processor Thermal Design Guidelines (Order Number 243331).
Figure 17 provides a side view of an S.E.C.C. package. This figure provides the thermal plate
location.
Figure 17. Pentium® II Processor S.E.C.C. - Side View
Cover
Left Latch
Right Latch
EnhancedThermal
Thermal Plate
Plate
Extended
42
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
4.1
Thermal Specifications
Table 27 and Table 28 provide the thermal design power dissipation and maximum and minimum
temperatures for Pentium II processors with S.E.C.C. and S.E.C.C.2 package technologies,
respectively. While the processor core dissipates the majority of the thermal power, thermal power
dissipated by the L2 cache also impacts the overall processor power specification. Systems should
design for the highest possible thermal power, even if a processor with a lower thermal dissipation
is planned.
Table 27. Thermal Specifications for S.E.C.C. Packaged Processors 1
Processor Core
Frequency
(MHz)
L2 Cache
Size
(Kbytes)
Processor
Power 2
(W)
Extended
Thermal Plate
Power 3
(W)
Min
TPLATE
(°C)
Max
TPLATE
(°C)
Min
TCOVER
(°C)
Max
TCOVER
(°C)
450 4
512
27.1
26.4
5
70
5
75
400 4
512
24.3
23.6
5
75
5
75
4
512
21.5
20.8
5
75
5
75
350
NOTES:
1. These values are specified at nominal VCCCORE for the processor core and nominal VCCL2 for the L2 cache.
2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus termination.
The maximum power for each of these components does not occur simultaneously.
3. Extended Thermal Plate power is the processor power that is dissipated through the extended thermal plate.
4. These processors use the extended thermal plate for the Pentium® II processor (see Figure 17).
Table 28. Thermal Specifications for S.E.C.C.2 Packaged Processors1
Processor
Core
Frequency
(MHz)
L2 Cache
Size
(Kbytes)
Processor
Power 2
(W)
Min
PLGA
T CASE
(°C)
Max
PLGA
TCASE
(°C)
Min
OLGA
TJUNC
(°C)
Max
OLGA
TJUNC
(°C)
L2 Cache
Min TCASE
(°C)
L2 Cache
Max TCASE
(°C)
Min
TCOVER
(°C)
Max
TCOVER
(°C)
450
512
27.1
N/A
N/A
5
90
5
105
5
75
400
512
24.3
N/A
N/A
5
90
5
105
5
75
350
512
21.5
5
80
N/A
N/A
5
105
5
75
NOTES:
1. These values are specified at nominal VCCCORE for the processor core and nominal VCCL2 for the L2 cache.
2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus termination.
The maximum power for each of these components does not occur simultaneously.
For S.E.C.C. packaged processors, the extended thermal plate is the attach location for all thermal
solutions. The maximum and minimum extended thermal plate temperatures are specified in Table
27. For S.E.C.C.2 packaged processors, thermal solutions attach to the processor by connecting
through the substrate to the cover. The maximum and minimum temperatures of the pertinent
locations are specified in Table 28. A thermal solution should be designed to ensure the
temperature of the specified locations never exceeds these temperatures.
The total processor power is a result of heat dissipation that is a combination of heat from both the
processor core and L2 cache. The overall system chassis thermal design must comprehend the
entire processor power. In S.E.C.C. packaged processors, the extended thermal plate power is a
component of this power, and is composed of a combination of the processor core and the L2 cache
dissipating heat through the extended thermal plate. The heatsink need only be designed to
dissipate the extended thermal plate power. See Table 27 for current Pentium II processor thermal
design specifications.
Datasheet
43
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
For S.E.C.C.2 packaged processors, no extended thermal plate exists and thermal solutions need to
contact the core package directly and attach through the substrate to the cover. The total processor
power that must be dissipated for S.E.C.C.2 processors can be thought of just as it is for S.E.C.C.
packaged processors: a combination of both the processor core and L2 cache. In regards to the
core, thermal specifications depend on the packaging technology used. Pentium II processors in
S.E.C.C.2 utilizing PLGA core packaging technology have a case temperature specified. Pentium
II processors in S.E.C.C.2 utilizing OLGA core packaging technology have a junction temperature
specified. Specifics on how to measure these two paramaters are outlined in AP-586, Pentium® II
Processor Thermal Design Guidelines (Order Number 243331). In addition, there are surface
mounted SRAM components for the L2 Cache on the substrate that have a separate TCASE
specification in Table 28.
4.1.1
Thermal Diode
The Pentium II processor incorporates an on-die diode that must be used to monitor the die
temperature (junction temperature). A thermal sensor located on the motherboard, or a stand-alone
measurement kit, may monitor the die temperature of the Pentium II processor for thermal
management or instrumentation purposes.Table 29 and Table 30 provide the diode parameter and
interface specifications.
1
Table 29. Thermal Diode Parameters 1
Symbol
Min
I forward bias
5
n_ideality
1.0000
Typ
1.0065
Max
Unit
500
uA
1.0173
Notes
2
3,4
NOTES:
1. Not 100% tested. Specified by design characterization.
2. Intel does not support or recommend operation of the thermal diode under reverse bias.
3. At room temperature with a forward bias of 630 mV.
4. n_ideality is the diode ideality factor parameter, as represented by the diode equation:
I-Io(e (Vd*q)/(nkT) - 1).
Table 30. Thermal Diode Interface
Pin Name
5.0
SC 242 Connector Signal #
Pin Description
THERMDP
B14
diode anode
THERMDN
B15
diode cathode
S.E.C.C. and S.E.C.C.2 Mechanical Specifications
Pentium II processors use either S.E.C.C. or S.E.C.C.2 package technology. Both package types
contain the processor core, L2 cache, and other passive components. The cartridges connect to the
motherboard through an edge connector. Mechanical specifications for the processor are given in
this section. See Section 1.1.1 for a complete terminology listing.
44
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
5.1
S.E.C.C. Mechnical Specifications
S.E.C.C. package drawings and dimension details are provided in Figure 18 through Figure 27.
Figure 18 shows all views of the Pentium II processor in an S.E.C.C. package; Figure 19 through
Figure 22 show the S.E.C.C. package dimensions; Figure 23 and Figure 24 show the extended
thermal plate dimensions; and Figure 25 and Figure 26 provide details of the processor substrate
edge finger contacts. Figure 27 and Table 31 contain processor marking information.
The processor edge connector defined in this document is referred to as the “SC 242 connector.”
See the Slot 1 Connector Specification (Order Number 243397) for further details on the SC 242
connector.
Note:
For Figure 18 through Figure 35, the following apply:
1. Unless otherwise specified, the following drawings are dimensioned in inches.
2. All dimensions provided with tolerances are guaranteed to be met for all normal production
product.
3. Figures and drawings labeled as “Reference Dimensions” are provided for informational
purposes only. Reference Dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference Dimensions are
NOT checked as part of the processor manufacturing. Dimensions in parentheses without
tolerances are Reference Dimensions.
4. Drawings are not to scale.
Figure 18. Pentium® II Processor (S.E.C.C. Package)—Top and Side View
Top View
Left Latch
Left
Right Latch
Cover
Cover Side view
Right
Right
Side
Thermal
Plate
Right
Thermal Plate
Side View
Left
v006a.vsd
Datasheet
45
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 19. Pentium® II Processor (S.E.C.C. Package)—Extended Thermal Plate Side Dimensions
3.805±.020
2.473±.016
2.070±.020
2X .125±.005
1.235±.020
2X .342±.005
These dimensions are from the bottom
of the substrate edge fingers
2X .365±.005
1.745±.005
1.877±.020
v005a
Figure 20. Pentium® II Processor (S.E.C.C. Package)—Bottom View Dimensions
5.255±.006
Cover
Thermal Plate
2.181±.015
3.243±.015
5.341±.010
5.505±.010
v007
46
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 21. Pentium® II Processor (S.E.C.C. Package)—Latch Arm, Extended Thermal Plate Lug, and
Cover Lug Dimensions
2X 0.238
2X 0.103 ± 0.005
2X 0.174 ±0.005
2X 0.647
±0.020
2X 0.488
±0.020
2X 0.058
±0.005
2X 0.136
±0.005
Left
2X 0.253
001056a
Datasheet
47
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 22. Pentium® II Processor (S.E.C.C. Package)—Latch Arm, Extended Thermal Plate, and Cover
Detail Dimensions (Reference Dimensions Only)
0.075
0.236
0.122
0.113
0.084
Detail A
Detail B
(Bottom Side View)
0.120 Min.
0.316
0.116
0.082
0.216
0.291
0.276
45°
Detail C
Detail D
Detail E
001057a
Note: All dimensions without tolerance information
are considered reference dimensions only
48
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
2.110 ±0.008
+0.001
–0.002
6X 0.124
Datasheet
0.375 ±0.008
0.000
0.250 ±0.008
0.500 ±0.008
0.978 ±0.008
0.000
Detail A
4X 0.365
±0.005
8X R 0.0625 ±0.002
See Detail A
001051
Figure 23. Pentium® II Processor (S.E.C.C. Package)—Extended Thermal Plate Attachment Detail
Dimensions
49
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 24. Pentium® II Processor (S.E.C.C. Package)—Extended Thermal Plate Attachment Detail
Dimensions, Continued
0.0032 / 1.000 x 1.000
1.250
2.500
v008
Figure 25. Pentium® II Processor Substrate (S.E.C.C. Package)—Edge Finger Contact Dimensions
Thermal Plate
Cover
Pin A1
Pin A121
Y
Substrate
See Detail A in
Next Figure
1.85
2.835
W
2.992 ±.008
.045
.062
70°
+.007
-.005
Z
2.01 ±.008
5.000
X
NOTE:
All dimensions without tolerance information are
considered reference dimensions only.
50
007.vsd
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 26. Pentium® II Processor Substrate (S.E.C.C. Package)—Edge Finger Contact Dimensions,
Detail A
.098
.098
Pin A74
Pin A73
.010
.008
.360
.045
.236
.138 ±.005
.039
Y
.074 ±.002
W
121 X 0.043 ±.002
.008
ZW
.002
Z
121 X 0.16 ±.002
.008
.002
.037
ZW
Z
NOTE:
1. All dimensions without tolerance information are considered reference dimensions only.
2. Z reference datum shown in Figure 35
010.vsd
Figure 27. Pentium® II Processor Markings (S.E.C.C. Package)
2-D Matrix Mark
pentium
P
R
O
C
E
S
S
O
II
®
R
NoteCODE
SZNNN/XYZ See
ORDER
XXXXXXXX-NNNN
pentium
R
O
C
E
S
S
II
®
O
Dynamic Mark Area
R
pentium
P
R
O
C
E
S
S
®
O
II
R
Hologram
Location
NOTE:
Please refer to the Pentium® II
Processor Specification Update
for this information.
i
m C '94 '96
P
Datasheet
51
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 31. Description Table for Processor Markings (S.E.C.C. Packaged Processor)
Code Letter
5.2
Description
A
Logo
B
Product Name
C
Trademark
D
Logo
E
Product Name
F
Dynamic Mark Area – with 2-D matrix
S.E.C.C.2 Mechanical Specification
S.E.C.C.2 packaged drawings and dimension details are provided in Figure 28 through Figure 35.
Figure 28 shows all views of the Pentium II processor in an S.E.C.C.2 package using an OLGA
packaged processor core; Figure 29 shows all views of a Pentium II processor in an S.E.C.C.2
package using a PLGA packaged processor core; Figure 30 through Figure 34 show the S.E.C.C.2
package dimensions; Figure 35 provides dimensions of the processor substrate edge finger
contacts; and Figure 36 and Table 32 contain processor marking information.
Figure 28. Pentium® II Processor (S.E.C.C.2 Package) Top and Side Views—OLGA Processor Core
52
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 29. Pentium® II Processor (S.E.C.C.2 Package) Top and Side Views—PLGA Processor Core
Figure 30. Pentium® II Processor Assembly (S.E.C.C.2 Package)—Primary View
PLG A
O LG A
Datasheet
53
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 31. Pentium® II Processor Assembly (S.E.C.C.2 Package)—Cover View with Dimensions
PLGA
OLGA
Figure 32. Pentium® II Processor Assembly (S.E.C.C.2 Package)—Heat Sink Attach Boss Section
54
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 33. Pentium® II Processor Assembly (S.E.C.C.2 Package), Side View—OLGA Substrate Shown
PLG A
OLG A
S ee F ig u re 4 0
Figure 34. Detail View of Cover in the Vicinity of the Substrate Attach Features
Datasheet
55
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 35. Pentium® II Processor Substrate (S.E.C.C.2 Package), Edge Finger Contact Dimensions
OLGA
Package
Figure 36. Pentium® II Processor Markings (S.E.C.C.2 Package)
2-D Matrix Mark
iCOMP® 2.0 index=YYY
SZNNN/XYZ ORDER CODE
Se e N ote
XXXXXXXX-NNNN
C
Dynamic Mark Area
A
B
pentium
P
56
R
O
C
E
S
S
O
®
R
II
Hologram
Location
NOTE:
Please refer to the Pentium® II
Processor Specification Update
for this information.
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 32. Description Table for Processor Markings (S.E.C.C.2 Packaged Processor)
Code Letter
5.3
Description
A
Logo
B
Product Name
C
Trademark
D
Logo
E
Product Name
F
Dynamic Mark Area – with 2-D matrix
Processor Package Materials Information
Both the the S.E.C.C. and S.E.C.C.2 processor cartridges are comprised of multiple pieces to make
the complete assembly. This section provides information relevant to the use and acceptance of the
package. Table 33 and Section 34 contain piece-part information of the S.E.C.C. and S.E.C.C.2
processor packages, respectively.
Table 33. S.E.C.C. Materials 1
S.E.C.C. Piece
Piece Material
Maximum Piece Weight (Grams)
Extended Thermal Plate
Aluminum 6063-T6
84.0
Latch Arms
GE Lexan 940-V0, 30% glass filled
Less than 2.0 per latch arm
Cover
GE Lexan 940-V0
24.0
®
Total Pentium II Processor
150
NOTE:
1. Unless otherwise noted, these specifications apply to all S.E.C.C. packaged Pentium® II processor frequencies and
cache sizes.
Table 34. S.E.C.C.2 Materials 1
S.E.C.C.2 Piece
Piece Material
Maximum Piece Weight (Grams)
Cover
GE Lexan 940-V0
18.0
®
Total Pentium II Processor
57.0
NOTE:
®
1. Unless otherwise noted, these specifications apply to all S.E.C.C.2 packaged Pentium II processor frequencies and
cache sizes.
Datasheet
57
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
5.4
Pentium® II Processor Signal Listing
Table 35 and Table 36 provide the processor edge finger and Pentium II processor connector signal
definitions for Pentium II processors. The signal locations on the SC 242 edge connector are to be
used for signal routing, simulation, and component placement on the motherboard.
Table 35 is the Pentium II processor substrate edge finger listing in order by pin number.
Table 35. Signal Listing in Order by Pin Number (Sheet 1 of 4)
Pin No.
58
Pin Name
Signal Buffer Type
Pin No.
Pin Name
Signal Buffer Type
A1
VCC_VTT
AGTL+ VTT Supply
B1
EMI
EMI Management
A2
GND
V SS
B2
FLUSH#
CMOS Input
A3
VCC_VTT
AGTL+ VTT Supply
B3
SMI#
CMOS Input
A4
IERR#
CMOS Output
B4
INIT#
CMOS Input
A5
A20M#
CMOS Input
B5
VCC_VTT
AGTL+ VTT Supply
A6
GND
V SS
B6
STPCLK#
CMOS Input
A7
FERR#
CMOS Output
B7
TCK
JTAG Input
A8
IGNNE#
CMOS Input
B8
SLP#
CMOS Input
A9
TDI
JTAG Input
B9
VCC_VTT
AGTL+ VTT Supply
A10
GND
V SS
B10
TMS
JTAG Input
A11
TDO
JTAG Output
B11
TRST#
JTAG Input
A12
PWRGOOD
CMOS Input
B12
Reserved
Reserved for Future Use
A13
TESTHI
CMOS Test Input
B13
VCC_CORE
Processor core V CC
A14
GND
V SS
B14
THERMDP
Diode Anode
A15
THERMTRIP#
CMOS Output
B15
THERMDN
Diode Cathode
A16
Reserved
Reserved for Future Use
B16
LINT[1]/NMI
CMOS Input
A17
LINT[0]/INTR
CMOS Input
B17
VCC_CORE
Processor core V CC
A18
GND
V SS
B18
PICCLK
APIC Clock Input
A19
PICD[0]
CMOS I/O
B19
BP#[2]
AGTL+ I/O
A20
PREQ#
CMOS Input
B20
Reserved
Reserved for Future Use
A21
BP#[3]
AGTL+ I/O
B21
100/66#
BCLK Frequency Select
A22
GND
V SS
B22
PICD[1]
CMOS I/O
A23
BPM#[0]
AGTL+ I/O
B23
PRDY#
AGTL+ Output
A24
BINIT#
AGTL+ I/O
B24
BPM#[1]
AGTL+ I/O
A25
DEP#[0]
AGTL+ I/O
B25
VCC_CORE
Processor core V CC
A26
GND
V SS
B26
DEP#[2]
AGTL+ I/O
A27
DEP#[1]
AGTL+ I/O
B27
DEP#[4]
AGTL+ I/O
A28
DEP#[3]
AGTL+ I/O
B28
DEP#[7]
AGTL+ I/O
A29
DEP#[5]
AGTL+ I/O
B29
VCC_CORE
Processor core VCC
A30
GND
V SS
B30
D#[62]
AGTL+ I/O
A31
DEP#[6]
AGTL+ I/O
B31
D#[58]
AGTL+ I/O
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 35. Signal Listing in Order by Pin Number (Sheet 2 of 4)
Pin No.
Datasheet
Pin Name
Signal Buffer Type
Pin No.
Pin Name
Signal Buffer Type
A32
D#[61]
AGTL+ I/O
B32
D#[63]
AGTL+ I/O
A33
D#[55]
AGTL+ I/O
B33
VCC_CORE
Processor core VCC
A34
GND
VSS
B34
D#[56]
AGTL+ I/O
A35
D#[60]
AGTL+ I/O
B35
D#[50]
AGTL+ I/O
A36
D#[53]
AGTL+ I/O
B36
D#[54]
AGTL+ I/O
A37
D#[57]
AGTL+ I/O
B37
VCC_CORE
Processor core VCC
A38
GND
VSS
B38
D#[59]
AGTL+ I/O
A39
D#[46]
AGTL+ I/O
B39
D#[48]
AGTL+ I/O
A40
D#[49]
AGTL+ I/O
B40
D#[52]
AGTL+ I/O
A41
D#[51]
AGTL+ I/O
B41
EMI
EMI Management
A42
GND
VSS
B42
D#[41]
AGTL+ I/O
A43
D#[42]
AGTL+ I/O
B43
D#[47]
AGTL+ I/O
A44
D#[45]
AGTL+ I/O
B44
D#[44]
AGTL+ I/O
A45
D#[39]
AGTL+ I/O
B45
VCC_CORE
Processor core VCC
A46
GND
VSS
B46
D#[36]
AGTL+ I/O
A47
Reserved
Reserved for Future Use
B47
D#[40]
AGTL+ I/O
A48
D#[43]
AGTL+ I/O
B48
D#[34]
AGTL+ I/O
A49
D#[37]
AGTL+ I/O
B49
VCC_CORE
Processor core VCC
A50
GND
VSS
B50
D#[38]
AGTL+ I/O
A51
D#[33]
AGTL+ I/O
B51
D#[32]
AGTL+ I/O
A52
D#[35]
AGTL+ I/O
B52
D#[28]
AGTL+ I/O
A53
D#[31]
AGTL+ I/O
B53
VCC_CORE
Processor core VCC
A54
GND
VSS
B54
D#[29]
AGTL+ I/O
A55
D#[30]
AGTL+ I/O
B55
D#[26]
AGTL+ I/O
A56
D#[27]
AGTL+ I/O
B56
D#[25]
AGTL+ I/O
A57
D#[24]
AGTL+ I/O
B57
VCC_CORE
Processor core VCC
A58
GND
VSS
B58
D#[22]
AGTL+ I/O
A59
D#[23]
AGTL+ I/O
B59
D#[19]
AGTL+ I/O
A60
D#[21]
AGTL+ I/O
B60
D#[18]
AGTL+ I/O
A61
D#[16]
AGTL+ I/O
B61
EMI
EMI Management
A62
GND
VSS
B62
D#[20]
AGTL+ I/O
A63
D#[13]
AGTL+ I/O
B63
D#[17]
AGTL+ I/O
A64
D#[11]
AGTL+ I/O
B64
D#[15]
AGTL+ I/O
A65
D#[10]
AGTL+ I/O
B65
VCC_CORE
Processor core VCC
A66
GND
VSS
B66
D#[12]
AGTL+ I/O
A67
D#[14]
AGTL+ I/O
B67
D#[7]
AGTL+ I/O
A68
D#[9]
AGTL+ I/O
B68
D#[6]
AGTL+ I/O
A69
D#[8]
AGTL+ I/O
B69
VCC_CORE
Processor core VCC
59
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 35. Signal Listing in Order by Pin Number (Sheet 3 of 4)
Pin No.
60
Pin Name
Signal Buffer Type
Pin No.
Pin Name
Signal Buffer Type
A70
GND
V SS
B70
D#[4]
AGTL+ I/O
A71
D#[5]
AGTL+ I/O
B71
D#[2]
AGTL+ I/O
A72
D#[3]
AGTL+ I/O
B72
D#[0]
AGTL+ I/O
A73
D#[1]
AGTL+ I/O
B73
VCC_CORE
Processor core V CC
A74
GND
V SS
B74
RESET#
AGTL+ Input
A75
BCLK
Processor Clock Input
B75
BR1#
AGTL+ Input
A76
BR0#
AGTL+ I/O
B76
Reserved
Reserved for Future Use.
A77
BERR#
AGTL+ I/O
B77
VCC_CORE
Processor core V CC
A78
GND
V SS
B78
A#[35]
AGTL+ I/O
A79
A#[33]
AGTL+ I/O
B79
A#[32]
AGTL+ I/O
A80
A#[34]
AGTL+ I/O
B80
A#[29]
AGTL+ I/O
A81
A#[30]
AGTL+ I/O
B81
EMI
EMI Management
A82
GND
V SS
B82
A#[26]
AGTL+ I/O
A83
A#[31]
AGTL+ I/O
B83
A#[24]
AGTL+ I/O
A84
A#[27]
AGTL+ I/O
B84
A#[28]
AGTL+ I/O
A85
A#[22]
AGTL+ I/O
B85
VCC_CORE
Processor core V CC
A86
GND
V SS
B86
A#[20]
AGTL+ I/O
A87
A#[23]
AGTL+ I/O
B87
A#[21]
AGTL+ I/O
A88
Reserved
Reserved for Future Use
B88
A#[25]
AGTL+ I/O
A89
A#[19]
AGTL+ I/O
B89
VCC_CORE
Processor core V CC
A90
GND
V SS
B90
A#[15]
AGTL+ I/O
A91
A#[18]
AGTL+ I/O
B91
A#[17]
AGTL+ I/O
A92
A#[16]
AGTL+ I/O
B92
A#[11]
AGTL+ I/O
A93
A#[13]
AGTL+ I/O
B93
VCC_CORE
Processor core V CC
A94
GND
V SS
B94
A#[12]
AGTL+ I/O
A95
A#[14]
AGTL+ I/O
B95
A#[8]
AGTL+ I/O
A96
A#[10]
AGTL+ I/O
B96
A#[7]
AGTL+ I/O
A97
A#[5]
AGTL+ I/O
B97
VCC_CORE
Processor core V CC
A98
GND
V SS
B98
A#[3]
AGTL+ I/O
A99
A#[9]
AGTL+ I/O
B99
A#[6]
AGTL+ I/O
A100
A#[4]
AGTL+ I/O
B100
EMI
EMI Management
A101
BNR#
AGTL+ I/O
B101
SLOTOCC#
SC 242 Occupied
A102
GND
V SS
B102
REQ#[0]
AGTL+ I/O
A103
BPRI#
AGTL+ Input
B103
REQ#[1]
AGTL+ I/O
A104
TRDY#
AGTL+ Input
B104
REQ#[4]
AGTL+ I/O
A105
DEFER#
AGTL+ Input
B105
VCC_CORE
Processor core V CC
A106
GND
V SS
B106
LOCK#
AGTL+ I/O
A107
REQ#[2]
AGTL+ I/O
B107
DRDY#
AGTL+ I/O
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 35. Signal Listing in Order by Pin Number (Sheet 4 of 4)
Pin No.
Pin Name
Signal Buffer Type
Pin No.
Pin Name
Signal Buffer Type
A108
REQ#[3]
AGTL+ I/O
B108
RS#[0]
AGTL+ Input
A109
HITM#
AGTL+ I/O
B109
VCC5
Other V CC
A110
GND
VSS
B110
HIT#
AGTL+ I/O
A111
DBSY#
AGTL+ I/O
B111
RS#[2]
AGTL+ Input
A112
RS#[1]
AGTL+ Input
B112
Reserved
Reserved for Future Use
A113
Reserved
Reserved for Future Use
B113
VCC_L2
Other VCC
A114
GND
VSS
B114
RP#
AGTL+ I/O
A115
ADS#
AGTL+ I/O
B115
RSP#
AGTL+ Input
A116
Reserved
Reserved for Future Use
B116
AP#[1]
AGTL+ I/O
A117
AP#[0]
AGTL+ I/O
B117
VCC_L2
Other V CC
A118
GND
VSS
B118
AERR#
AGTL+ I/O
A119
VID[2]
Voltage Identification
B119
VID[3]
Voltage Identification
A120
VID[1]
Voltage Identification
B120
VID[0]
Voltage Identification
A121
VID[4]
Voltage Identification
B121
VCC_L2
Other V CC
Table 36 is the Pentium II processor substrate edge connector listing in order by signal name.
Table 36. Signal Listing in Order by Signal Name (Sheet 1 of 4)
Pin No.
B21
Datasheet
Pin Name
100/66#
Signal Buffer Type
Pin No.
Pin Name
Signal Buffer Type
BCLK Frequency Select
A29
DEP#[5]
AGTL+ I/O
B98
A#[3]
AGTL+ I/O
A31
DEP#[6]
AGTL+ I/O
A100
A#[4]
AGTL+ I/O
B28
DEP#[7]
AGTL+ I/O
A97
A#[5]
AGTL+ I/O
B107
DRDY#
AGTL+ I/O
B99
A#[6]
AGTL+ I/O
B1
EMI
EMI Management
B96
A#[7]
AGTL+ I/O
B41
EMI
EMI Management
B95
A#[8]
AGTL+ I/O
B61
EMI
EMI Management
A99
A#[9]
AGTL+ I/O
B81
EMI
EMI Management
A96
A#[10]
AGTL+ I/O
B100
EMI
EMI Management
B92
A#[11]
AGTL+ I/O
A7
FERR#
CMOS Output
B94
A#[12]
AGTL+ I/O
B2
FLUSH#
CMOS Input
A93
A#[13]
AGTL+ I/O
B76
Reserved
Reserved for Future Use
A95
A#[14]
AGTL+ I/O
A2
GND
VSS
B90
A#[15]
AGTL+ I/O
A6
GND
VSS
A92
A#[16]
AGTL+ I/O
A10
GND
VSS
B91
A#[17]
AGTL+ I/O
A14
GND
VSS
A91
A#[18]
AGTL+ I/O
A18
GND
VSS
A89
A#[19]
AGTL+ I/O
A22
GND
VSS
B86
A#[20]
AGTL+ I/O
A26
GND
VSS
61
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 36. Signal Listing in Order by Signal Name (Sheet 2 of 4)
Pin No.
62
Pin Name
Signal Buffer Type
Pin No.
Pin Name
Signal Buffer Type
B87
A#[21]
AGTL+ I/O
A30
GND
VSS
A85
A#[22]
AGTL+ I/O
A34
GND
VSS
A87
A#[23]
AGTL+ I/O
A38
GND
VSS
B83
A#[24]
AGTL+ I/O
A42
GND
VSS
B88
A#[25]
AGTL+ I/O
A46
GND
VSS
B82
A#[26]
AGTL+ I/O
A50
GND
VSS
A84
A#[27]
AGTL+ I/O
A54
GND
VSS
B84
A#[28]
AGTL+ I/O
A58
GND
VSS
B80
A#[29]
AGTL+ I/O
A62
GND
VSS
A81
A#[30]
AGTL+ I/O
A66
GND
VSS
A83
A#[31]
AGTL+ I/O
A70
GND
VSS
B79
A#[32]
AGTL+ I/O
A74
GND
VSS
A79
A#[33]
AGTL+ I/O
A78
GND
VSS
A80
A#[34]
AGTL+ I/O
A82
GND
VSS
B78
A#[35]
AGTL+ I/O
A86
GND
VSS
A5
A20M#
CMOS Input
A90
GND
VSS
A115
ADS#
AGTL+ I/O
A94
GND
VSS
B118
AERR#
AGTL+ I/O
A98
GND
VSS
A117
AP#[0]
AGTL+ I/O
A102
GND
VSS
B116
AP#[1]
AGTL+ I/O
A106
GND
VSS
A75
BCLK
Processor Clock Input
A110
GND
VSS
A77
BERR#
AGTL+ I/O
A114
GND
VSS
A24
BINIT#
AGTL+ I/O
A118
GND
VSS
A101
BNR#
AGTL+ I/O
B110
HIT#
AGTL+ I/O
B19
BP#[2]
AGTL+ I/O
A109
HITM#
AGTL+ I/O
A21
BP#[3]
AGTL+ I/O
A4
IERR#
CMOS Output
A23
BPM#[0]
AGTL+ I/O
A8
IGNNE#
CMOS Input
B24
BPM#[1]
AGTL+ I/O
B4
INIT#
CMOS Input
A103
BPRI#
AGTL+ Input
A17
LINT[0]/INTR
CMOS Input
A76
BR0#
AGTL+ I/O
B16
LINT[1]/NMI
CMOS Input
B75
BR1#
AGTL+ Input
B106
LOCK#
AGTL+ I/O
B72
D#[0]
AGTL+ I/O
B18
PICCLK
APIC Clock Input
A73
D#[1]
AGTL+ I/O
A19
PICD[0]
CMOS I/O
B71
D#[2]
AGTL+ I/O
B22
PICD[1]
CMOS I/O
A72
D#[3]
AGTL+ I/O
B23
PRDY#
AGTL+ Output
B70
D#[4]
AGTL+ I/O
A20
PREQ#
CMOS Input
A71
D#[5]
AGTL+ I/O
A12
PWRGOOD
CMOS Input
B68
D#[6]
AGTL+ I/O
B102
REQ#[0]
AGTL+ I/O
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 36. Signal Listing in Order by Signal Name (Sheet 3 of 4)
Pin No.
Datasheet
Pin Name
Signal Buffer Type
Pin No.
Pin Name
Signal Buffer Type
B67
D#[7]
AGTL+ I/O
B103
REQ#[1]
AGTL+ I/O
A69
D#[8]
AGTL+ I/O
A107
REQ#[2]
AGTL+ I/O
A68
D#[9]
AGTL+ I/O
A108
REQ#[3]
AGTL+ I/O
A65
D#[10]
AGTL+ I/O
B104
REQ#[4]
AGTL+ I/O
A64
D#[11]
AGTL+ I/O
A16
Reserved
Reserved for Future Use
B66
D#[12]
AGTL+ I/O
A47
Reserved
Reserved for Future Use
A63
D#[13]
AGTL+ I/O
A88
Reserved
Reserved for Future Use
A67
D#[14]
AGTL+ I/O
A113
Reserved
Reserved for Future Use
B64
D#[15]
AGTL+ I/O
A116
Reserved
Reserved for Future Use
A61
D#[16]
AGTL+ I/O
B12
Reserved
Reserved for Future Use
B63
D#[17]
AGTL+ I/O
B14
THERMDP
Diode Anode
B60
D#[18]
AGTL+ I/O
B15
THERMDN
Diode Cathode
B59
D#[19]
AGTL+ I/O
B20
Reserved
Reserved for Future Use
B62
D#[20]
AGTL+ I/O
B112
Reserved
Reserved for Future Use
A60
D#[21]
AGTL+ I/O
B74
RESET#
AGTL+ Input
B58
D#[22]
AGTL+ I/O
B114
RP#
AGTL+ I/O
A59
D#[23]
AGTL+ I/O
B108
RS#[0]
AGTL+ Input
A57
D#[24]
AGTL+ I/O
A112
RS#[1]
AGTL+ Input
B56
D#[25]
AGTL+ I/O
B111
RS#[2]
AGTL+ Input
B55
D#[26]
AGTL+ I/O
B115
RSP#
AGTL+ Input
A56
D#[27]
AGTL+ I/O
B101
SLOTOCC#
SC 242 Occupied
B52
D#[28]
AGTL+ I/O
B8
SLP#
CMOS Input
B54
D#[29]
AGTL+ I/O
B3
SMI#
CMOS Input
A55
D#[30]
AGTL+ I/O
B6
STPCLK#
CMOS Input
A53
D#[31]
AGTL+ I/O
B7
TCK
JTAG Input
B51
D#[32]
AGTL+ I/O
A9
TDI
JTAG Input
A51
D#[33]
AGTL+ I/O
A11
TDO
JTAG Output
B48
D#[34]
AGTL+ I/O
A13
TESTHI
CMOS Test Input
A52
D#[35]
AGTL+ I/O
A15
THERMTRIP#
CMOS Output
B46
D#[36]
AGTL+ I/O
B10
TMS
JTAG Input
A49
D#[37]
AGTL+ I/O
A104
TRDY#
AGTL+ Input
B50
D#[38]
AGTL+ I/O
B11
TRST#
JTAG Input
A45
D#[39]
AGTL+ I/O
B13
VCC_CORE
Processor core VCC
B47
D#[40]
AGTL+ I/O
B17
VCC_CORE
Processor core VCC
B42
D#[41]
AGTL+ I/O
B25
VCC_CORE
Processor core VCC
A43
D#[42]
AGTL+ I/O
B29
VCC_CORE
Processor core VCC
A48
D#[43]
AGTL+ I/O
B33
VCC_CORE
Processor core VCC
B44
D#[44]
AGTL+ I/O
B37
VCC_CORE
Processor core VCC
63
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 36. Signal Listing in Order by Signal Name (Sheet 4 of 4)
Pin No.
Pin Name
Signal Buffer Type
Pin No.
Pin Name
Signal Buffer Type
A44
D#[45]
AGTL+ I/O
B45
VCC_CORE
Processor core VCC
A39
D#[46]
AGTL+ I/O
B49
VCC_CORE
Processor core VCC
B43
D#[47]
AGTL+ I/O
B53
VCC_CORE
Processor core VCC
B39
D#[48]
AGTL+ I/O
B57
VCC_CORE
Processor core VCC
A40
D#[49]
AGTL+ I/O
B65
VCC_CORE
Processor core VCC
B35
D#[50]
AGTL+ I/O
B69
VCC_CORE
Processor core VCC
A41
D#[51]
AGTL+ I/O
B73
VCC_CORE
Processor core VCC
B40
D#[52]
AGTL+ I/O
B77
VCC_CORE
Processor core VCC
A36
D#[53]
AGTL+ I/O
B85
VCC_CORE
Processor core VCC
B36
D#[54]
AGTL+ I/O
B89
VCC_CORE
Processor core VCC
A33
D#[55]
AGTL+ I/O
B93
VCC_CORE
Processor core VCC
B34
D#[56]
AGTL+ I/O
B97
VCC_CORE
Processor core VCC
A37
D#[57]
AGTL+ I/O
B105
VCC_CORE
Processor core VCC
B31
D#[58]
AGTL+ I/O
B113
VCC_L2
Other VCC
B38
D#[59]
AGTL+ I/O
B117
VCC_L2
Other VCC
A35
D#[60]
AGTL+ I/O
B121
VCC_L2
Other VCC
A32
D#[61]
AGTL+ I/O
A1
VCC_VTT
AGTL+ VTT Supply
B30
D#[62]
AGTL+ I/O
A3
VCC_VTT
AGTL+ VTT Supply
B32
D#[63]
AGTL+ I/O
B5
VCC_VTT
AGTL+ VTT Supply
A111
DBSY#
AGTL+ I/O
B9
VCC_VTT
AGTL+ VTT Supply
A105
DEFER#
AGTL+ Input
B109
VCC5
Other VCC
A25
DEP#[0]
AGTL+ I/O
B120
VID[0]
Voltage Identification
A27
DEP#[1]
AGTL+ I/O
A120
VID[1]
Voltage Identification
B26
DEP#[2]
AGTL+ I/O
A119
VID[2]
Voltage Identification
A28
DEP#[3]
AGTL+ I/O
B119
VID[3]
Voltage Identification
B27
DEP#[4]
AGTL+ I/O
A121
VID[4]
Voltage Identification
6.0
Boxed Processor Specifications
6.1
Introduction
The Pentium II processor is also offered as an Intel boxed processor. Intel boxed processors are
intended for system integrators who build systems from motherboards and components. Boxed
Pentium II processors are supplied with an attached fan heatsink. This section documents
motherboard and system requirements for the fan heatsink that will be supplied with the boxed
Pentium II processor. This section is particularly important for OEM's that manufacture
motherboards for system integrators. Unless otherwise noted, all figures in this section are
dimensioned in inches. Figure 37 shows a mechanical representation of a boxed Pentium II
64
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
processor in the Single Edge Contact Cartridge (S.E.C.C.) package in its retention mechanism with
heatsink supports installed. Figure 38 shows a mechanical representation of a boxed Pentium II
processor in the S.E.C.C.2 package.
Note:
The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. The large
arrows in Figure 37 denote the direction of airflow.
Figure 37. Boxed Pentium® II Processor in the S.E.C.C. Packaging Installed in Retention Mechanism
(Fan Power Cable Not Shown)
Heatsink Support Mechanism
Processor
Fan
Shroud Covering Heatsink Fins
Retention
Mechanism
Fan Power
Connector
Motherboard
Heatsink Support Mechanism
Figure 38. Boxed Pentium® II Processor in the S.E.C.C.2 Packaging (Fan Power Cable Not Shown)
Datasheet
65
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
6.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed Pentium II processor fan
heatsinks. Motherboard manufacturers and system designers should take into account the spacial
requirement for both the boxed Pentium II processor in the S.E.C.C. package and the boxed
Pentium II processor in the S.E.C.C.2 package.
6.2.1
Boxed Processor Fan Heatsink Dimensions
The boxed processor is shipped with an attached fan heatsink. Clearance is required around the fan
heatsink to ensure unimpeded air flow for proper cooling. The space requirements and dimensions
for the boxed processor in the S.E.C.C. package are shown in Figure 39 (Side View), Figure 40
(Front View), and Figure 43 (Top View). Spacial requirements and dimensions for the boxed
processor in the S.E.C.C.2 package are shown in Figure 41 (Side View), Figure 42 (Front View),
and Figure 43 (Top View). All dimensions are in inches.
Figure 39. Side View Space Requirements for the Boxed Processor with S.E.C.C. Packaging
66
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 40. Front View Space Requirements for the Boxed Processor with S.E.C.C. Packaging
Figure 41. Side View Space Requirements for the Boxed Processor with S.E.C.C.2 Packaging
Datasheet
67
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 42. Front View Space Requirements for the Boxed Processor with S.E.C.C.2 Packaging
Figure 43. Top View Air Space Requirements for the Boxed Processor
68
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 37. Boxed Processor Fan Heatsink Spatial Dimensions
Fig. Ref.
Label
Refers to
Figure
A
Figure 39
S.E.C.C. Fan Heatsink Depth (off processor extended
thermal plate)
B
Figure 39
S.E.C.C. Fan Heatsink Height Above Motherboard
C
Figure 40
D
Dimensions (Inches)
Min
Typ
Max
-
1.1
1.3
Note 1
0.5
-
S.E.C.C. Fan Heatsink Height
-
2.1
2.2
Figure 40
S.E.C.C. Fan Heatsink Width (plastic shroud only)
-
4.8
4.9
E
Figure 40
S.E.C.C. Power Cable Connector Location From Edge
of Fan Heatsink Shroud
1.3
-
1.45
F
Figure 41
S.E.C.C.2 Fan Heatsink Depth (off processor substrate)
G
Figure 41
S.E.C.C.2 Fan Heatsink Height Above Motherboard
-
1.3
1.4
0.4
0.6
-
H
Figure 42
S.E.C.C.2 Fan Heatsink Height
-
2.0
2.2
I
Figure 42
S.E.C.C.2 Fan Heatsink Width (plastic shroud only)
-
4.7
4.8
J
Figure 42
S.E.C.C.2 Power Cable Connector Location From Edge
of Fan Heatsink Shroud
1.4
-
1.45
K
Figure 43
Airflow keep out zones from end of fan heatsink
0.40
-
-
L
Figure 43
Airflow keepout zones from face of fan heatsink
0.20
-
-
NOTE:
1. See Figure 45, label N.
6.2.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 225 grams. See Section 4.0 and Section
5.0 for details on the heatsink preformance requirements and processor weight.
6.2.3
Boxed Processor Retention Mechanism and Fan Heatsink Supports
The boxed processor requires processor retention mechanism(s) to secure the processor in the 242contact slot connector. S.E.C.C. processors must use either the retention mechanism described in
AP-588, Mechanical and Assembly Technology for S.E.C. Cartridge Processors (Order Number
243333), or retention mechanisms that have been designed to support S.E.C.C., S.E.C.C.2, and
Single Edge Processor Package (S.E.P.P.) form factors (also known as universal retention
mechanisms). S.E.C.C.2 processors must use either retention mechanisms described in AP-826,
Mechanical Assembly and Customer Manufacturing Technology for S.E.P. Packages (Order
Number 243748). The boxed processor will not ship with a retention mechanism. Motherboards
designed for use by system integrators must include retention mechanisms that support the
S.E.C.C. and S.E.C.C.2 form factors and the appropriate installation instructions.
Some boxed Pentium II processors using the S.E.C.C. packaging technology were shipped with fan
heatsink supports. These supports differ from supports for passive heatsinks. The boxed processor
fan heatsink support requires heatsink support holes in the motherboard. Location and size of these
holes are given in Figure 44.
Datasheet
69
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 44. Heatsink Support Hole Locations and Size
Any motherboard components placed in the area beneath the fan heatsink supports must recognize
the clearance given in Table 38. Component height restrictions for passive heatsink support
designs, as described in AP-588, Mechanical and Assembly Technology for S.E.C. Cartridge
Processors (Order Number 243333), still apply.
Motherboards designed for use by system integrators should not have objects installed in the
heatsink support holes. Otherwise, removal instructions for objects preinstalled in the heatsink
support holes should be included in the motherboard documentation.
Table 38. Boxed Processor Fan Heatsink Support Dimensions1
Fig. Ref.
Label
Refers to
Figure
Dimensions (Inches)
Min
Typ
M
Figure 45
Fan Heatsink support height
2.261
N
Figure 45
Fan Heatsink support clearance above motherboard
0.430
O
Figure 45
Fan Heatsink support standoff diameter
0.275
P
Figure 45
Fan Heatsink support front edge to heatsink support hole
center
0.240
Q
Figure 45
Fan Heatsink support standoff protrusion beneath motherboard
0.06
R
Figure 45
Motherboard thickness
S
Figure 46
Spacing between FHS Supports
4.084
T
Figure 46
Fan Heatsink support width
0.600
U
Figure 46
Fan Heatsink support inner edge to heatsink support hole
0.400
0.05
0.06
Max
0.300
0.075
NOTE:
1. All dimensions are in inches. Unless otherwise specified, all dimensions with three significant digits have a tolerance of
±0.005 inches. All dimensions with two significant digits have a tolerance of ±0.01 inches.
70
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 45. Side View Space Requirements for Boxed Processor Fan Heatsink Supports
Figure 46. Top View Space Requirements for Boxed Processor Fan Heatsink Supports
Datasheet
71
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
6.3
Boxed Processor Requirements
6.3.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be
shipped with the boxed processor to draw power from a power header on the motherboard. The
power cable connector and pinout are shown in Figure 47. Motherboards must provide a matched
power header to support the boxed processor. Table 39 contains specifications for the input and
output signals at the fan heatsink connector. The cable length will be 7.0 ±0.25 inches. The fan
heatsink outputs a SENSE signal, which is an open-collector output, that pulses at a rate of two
pulses per fan revolution. A motherboard pull-up resistor provides VOH to match the motherboardmounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the
SENSE signal is not used, pin 3 of the connector should be tied to GND.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the motherboard
documentation, or on the motherboard itself. Figure 48 shows the location of the fan power
connector relative to the 242-contact slot connector. The motherboard power header should be
positioned within 4.75 inches (lateral) of the fan power connector.
Figure 47. Boxed Processor Fan Heatsink Power Cable Connector Description
Pin
Signal
1
GND
Straight square pin, 3-pin terminal housing with
polarizing ribs and friction locking ramp.
2
+12V
0.100" pin pitch, 0.025" square pin width.
3
SENSE
Waldom/Molex P/N 22-01-3037 or equivalent.
Match with straight pin, friction lock header on motherboard
Waldom/Molex P/N 22-23-2031, AMP P/N 640456-3,
or equivalent.
1
2
3
000888
Table 39. Fan Heatsink Power and Signal Specifications
Description
+12 V: 12 volt fan power supply
Min
Typ
Max
9V
12 V
13.8 V
I C: Fan current draw
SENSE: SENSE frequency (motherboard should pull this pin
up to appropriate VCC with resistor)
72
100 mA
2 pulses per fan revolution
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Figure 48. Recommended Motherboard Power Header Placement Relative to Fan Power Connector and
Pentium® II Processor
Table 40. Motherboard Fan Power Connector Location
Fig. Ref. Labels
6.4
Dimensions (Inches)
Min
Typ
V
Aproximate perpendicular distance of the fan power
connector from the center of the 242-contact slot connector
1.44
W
Aproximate parallel distance of the fan power connector
from the edge of the 242-contact slot connector
1.45
X
Lateral distance of the motherboard fan power header
location from the fan power connector
Max
4.75
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed
processor.
6.4.1
Boxed Processor Cooling Requirements
The boxed processor will be cooled with a fan heatsink. The boxed processor fan heatsink will
keep the processor temperature, within the specifications (see Section 4.0), provided airflow
through the fan heatsink is unimpeded and the air temperature entering the fan is below 45 °C (see
Figure 43 for measurement location).
Airspace is required around the fan to ensure that the airflow through the fan heatsink is not
blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan
life. Figure 43 illustrates an acceptable airspace clearance for the fan heatsink.
Datasheet
73
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
7.0
Pentium® II Processor Signal Description
This section provides an alphabetical listing of all Pentium II processor signals. The tables at the
end of this section summarize the signals by direction: output, input, and I/O.
7.1
Alphabetical Signals Reference
Table 41. Signal Description (Sheet 1 of 8)
Name
Type
Description
This bidirectional signal is used to select the system bus frequency. A logic low will select a
66 MHz system bus frequency and a logic high (3.3 V) will select a 100 MHz system bus
frequency. The frequency is determined by the processor(s), PCIset, and frequency
synthesizer. All system bus agents must operate at the same frequency; in a two-way MP
Pentium® II procesor configuration, this signal must connect the pins of both Pentium II
processors. This signal will be grounded by processors that are only capable of operating at
a host frequency of 66 MHz. On motherboards which support operation at either 66- or
100 MHz, this signal must be pulled up to 3.3 V with a 200Ω resistor (as shown in the figure
below) and provided as a frequency selection signal to the clock driver/synthesizer. If the
system motherboard is not capable of operating at 100 MHz (e.g., Intel® 440FX and 440LX
PCIset-based systems), it should ground this signal and generate a 66 MHz system bus
frequency. This signal can also be incorporated into RESET# logic on the motherboard if
only 100 MHz operation is supported (thus forcing the RESET# signal to remain active as
long as the 100/66# signal is low).
100/66#
100/66# Pin Example
I/O
3.3 Volts
CK100
200 Ω
100/66#
S
LS
C
O
T24
2
1
Pentium® II Processor
Processor
Core
1 KΩ
3.3 KΩ
GND
A[35:3]#
I/O
The A[35:3]# (Address) signals define a 236 -byte physical memory address space. When
ADS# is active, these pins transmit the address of a transaction; when ADS# is inactive,
these pins transmit transaction type information. These signals must connect the appropriate
pins of all agents on the Pentium II processor system bus. The A[35:24]# signals are parityprotected by the AP1# parity signal, and the A[23:3]# signals are parity-protected by the
AP0# parity signal.
On the active-to-inactive transition of RESET#, the processors sample the A[35:3]# pins to
determine their power-on configuration. See the Pentium® II Processor Developer’s
Manual (Order Number 243502) for details.
74
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 41. Signal Description (Sheet 2 of 8)
Name
Type
Description
If the A20M# (Address-20 Mask) input signal is asserted, the Pentium II processor masks
physical address bit 20 (A20#) before looking up a line in any internal cache and before
driving a read/write transaction on the bus. Asserting A20M# emulates the 8086 processor's
address wrap-around at the 1-Mbyte boundary. Assertion of A20M# is only supported in
real mode.
A20M#
I
A20M# is an asynchronous signal. However, to ensure recognition of this signal following
an I/O write instruction, it must be valid along with the TRDY# assertion of the
corresponding I/O Write bus transaction.
During active RESET#, each processor begins sampling the A20M#, IGNNE#, and
LINT[1:0] values to determine the ratio of core-clock frequency to bus-clock frequency.
See Table 9. On the active-to-inactive transition of RESET#, each processor latches these
signals and freezes the frequency ratio internally. System logic must then release these
signals for normal operation.
ADS#
AERR#
I/O
I/O
The ADS# (Address Strobe) signal is asserted to indicate the validity of the transaction
address on the A[35:3]# pins. All bus agents observe the ADS# activation to begin parity
checking, protocol checking, address decode, internal snoop, or deferred reply ID match
operations associated with the new transaction. This signal must connect the appropriate
pins on all Pentium II processor system bus agents.
The AERR# (Address Parity Error) signal is observed and driven by all Pentium II
processor system bus agents, and if used, must connect the appropriate pins on all Pentium
II processor system bus agents. AERR# observation is optionally enabled during power-on
configuration; if enabled, a valid assertion of AERR# aborts the current transaction.
If AERR# observation is disabled during power-on configuration, a central agent may
handle an assertion of AERR# as appropriate to the error handling architecture of the
system.
AP[1:0]#
BCLK
I/O
I
The AP[1:0]# (Address Parity) signals are driven by the request initiator along with ADS#,
A[35:3]#, REQ[4:0]#, and RP#. AP1# covers A[35:24]#, and AP0# covers A[23:3]#. A
correct parity signal is high if an even number of covered signals are low and low if an odd
number of covered signals are low. This allows parity to be high when all the covered
signals are high. AP[1:0]# should connect the appropriate pins of all Pentium II processor
system bus agents.
The BCLK (Bus Clock) signal determines the bus frequency. All Pentium II processor
system bus agents must receive this signal to drive their outputs and latch their inputs on the
BCLK rising edge.
All external timing parameters are specified with respect to the BCLK signal.
The BERR# (Bus Error) signal is asserted to indicate an unrecoverable error without a bus
protocol violation. It may be driven by all Pentium II processor system bus agents, and must
connect the appropriate pins of all such agents, if used. However, Pentium II processors do
not observe assertions of the BERR# signal.
BERR#
I/O
BERR# assertion conditions are configurable at a system level. Assertion options are
defined by the following options:
• Enabled or disabled.
• Asserted optionally for internal errors along with IERR#.
• Asserted optionally by the request initiator of a bus transaction after it observes an
error.
• Asserted by any bus agent when it observes an error in a bus transaction.
Datasheet
75
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 41. Signal Description (Sheet 3 of 8)
Name
Type
Description
The BINIT# (Bus Initialization) signal may be observed and driven by all Pentium II
processor system bus agents, and if used must connect the appropriate pins of all such
agents. If the BINIT# driver is enabled during power on configuration, BINIT# is asserted
to signal any bus condition that prevents reliable future information.
BINIT#
I/O
If BINIT# observation is enabled during power-on configuration, and BINIT# is sampled
asserted, all bus state machines are reset and any data which was in transit is lost. All agents
reset their rotating ID for bus arbitration to the state after Reset, and internal count
information is lost. The L1 and L2 caches are not affected.
If BINIT# observation is disabled during power-on configuration, a central agent may
handle an assertion of BINIT# as appropriate to the error handling architecture of the
system.
The BNR# (Block Next Request) signal is used to assert a bus stall by any bus agent who is
unable to accept new bus transactions. During a bus stall, the current bus owner cannot issue
any new transactions.
Since multiple agents might need to request a bus stall at the same time, BNR# is a wire-OR
signal which must connect the appropriate pins of all Pentium II processor system bus
agents. In order to avoid wire-OR glitches associated with simultaneous edge transitions
driven by multiple drivers, BNR# is activated on specific clock edges and sampled on
specific clock edges.
BNR#
I/O
BP[3:2]#
I/O
The BP[3:2]# (Breakpoint) signals are outputs from the processor that indicate the status of
breakpoints.
BPM[1:0]#
I/O
The BPM[1:0]# (Breakpoint Monitor) signals are breakpoint and performance monitor
signals. They are outputs from the processor which indicate the status of breakpoints and
programmable counters used for monitoring processor performance.
BPRI#
I
The BPRI# (Bus Priority Request) signal is used to arbitrate for ownership of the Pentium II
processor system bus. It must connect the appropriate pins of all Pentium II processor
system bus agents. Observing BPRI# active (as asserted by the priority agent) causes all
other agents to stop issuing new requests, unless such requests are part of an ongoing locked
operation. The priority agent keeps BPRI# asserted until all of its requests are completed,
then releases the bus by deasserting BPRI#.
The BR0# and BR1# (Bus Request) pins drive the BREQ[1:0]# signals in the system. The
BREQ[1:0]# signals are interconnected in a rotating manner to individual processor pins.
The table below gives the rotating interconnect between the processor and bus signals.
BR0# (I/O) and BR1# Signals Rotating Interconnect
BR0#
I/O
BR1#
I
Bus Signal
Agent 0 Pins
Agent 1 Pins
BREQ0#
BR0#
BR1#
BREQ1#
BR1#
BR0#
During power-up configuration, the central agent must assert the BR0# bus signal. All
symmetric agents sample their BR[1:0]# pins on active-to-inactive transition of RESET#. Th
pin on which the agent samples an active level determines its agent ID. All agents then
configure their pins to match the appropriate bus signal protocol, as shown below.
BR[1:0]# Signal Agent IDs
D[63:0]#
76
I/O
Pin Sampled Active in RESET#
Agent ID
BR0#
0
BR1#
1
The D[63:0]# (Data) signals are the data signals. These signals provide a 64-bit data path
between the Pentium II processor system bus agents, and must connect the appropriate pins
on all such agents. The data driver asserts DRDY# to indicate a valid data transfer.
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 41. Signal Description (Sheet 4 of 8)
Name
DBSY#
DEFER#
DEP[7:0]#
DRDY#
EMI
FERR#
Type
Description
I/O
The DBSY# (Data Bus Busy) signal is asserted by the agent responsible for driving data on
the Pentium II processor system bus to indicate that the data bus is in use. The data bus is
released after DBSY# is deasserted. This signal must connect the appropriate pins on all
Pentium II processor system bus agents.
I
The DEFER# signal is asserted by an agent to indicate that a transaction cannot be
guaranteed in-order completion. Assertion of DEFER# is normally the responsibility of the
addressed memory or I/O agent. This signal must connect the appropriate pins of all
Pentium II processor system bus agents.
I/O
The DEP[7:0]# (Data Bus ECC Protection) signals provide optional ECC protection for the
data bus. They are driven by the agent responsible for driving D[63:0]#, and must connect
the appropriate pins of all Pentium II processor system bus agents which use them. The
DEP[7:0]# signals are enabled or disabled for ECC protection during power on
configuration.
I/O
The DRDY# (Data Ready) signal is asserted by the data driver on each data transfer,
indicating valid data on the data bus. In a multi-cycle data transfer, DRDY# may be
deasserted to insert idle clocks. This signal must connect the appropriate pins of all Pentium
II processor system bus agents.
I
EMI pins should be connected to motherboard ground and/or to chassis ground through zero
ohm (0Ω) resistors. The zero ohm resistors should be placed in close proximity to the
Pentium II processor connector. The path to chassis ground should be short in length and
have a low impedance. These pins are used for EMI management purposes.
O
The FERR# (Floating-point Error) signal is asserted when the processor detects an
unmasked floating-point error. FERR# is similar to the ERROR# signal on the Intel 387
coprocessor, and is included for compatibility with systems using MS-DOS*-type floatingpoint error reporting.
When the FLUSH# input signal is asserted, processors write back all data in the Modified
state from their internal caches and invalidate all internal cache lines. At the completion of
this operation, the processor issues a Flush Acknowledge transaction. The processor does
not cache any new data while the FLUSH# signal remains asserted.
FLUSH#
I
FLUSH# is an asynchronous signal. However, to ensure recognition of this signal following
an I/O write instruction, it must be valid along with the TRDY# assertion of the
corresponding I/O Write bus transaction.
On the active-to-inactive transition of RESET#, each processor samples FLUSH# to
determine its power-on configuration. See P6 Family of Processors Hardware Developer’s
Manual (Order Number 244001) for details.
HIT#
I/O
HITM#
I/O
IERR#
Datasheet
O
The HIT# (Snoop Hit) and HITM# (Hit Modified) signals convey transaction snoop
operation results, and must connect the appropriate pins of all Pentium II processor system
bus agents. Any such agent may assert both HIT# and HITM# together to indicate that it
requires a snoop stall, which can be continued by reasserting HIT# and HITM# together.
The IERR# (Internal Error) signal is asserted by a processor as the result of an internal error.
Assertion of IERR# is usually accompanied by a SHUTDOWN transaction on the Pentium
II processor system bus. This transaction may optionally be converted to an external error
signal (e.g., NMI) by system core logic. The processor will keep IERR# asserted until the
assertion of RESET#, BINIT#, or INIT#.
77
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 41. Signal Description (Sheet 5 of 8)
Name
Type
Description
The IGNNE# (Ignore Numeric Error) signal is asserted to force the processor to ignore a
numeric error and continue to execute noncontrol floating-point instructions. If IGNNE# is
deasserted, the processor generates an exception on a noncontrol floating-point instruction
if a previous floating-point instruction caused an error. IGNNE# has no effect when the NE
bit in control register 0 is set.
IGNNE#
I
IGNNE# is an asynchronous signal. However, to ensure recognition of this signal following
an I/O write instruction, it must be valid along with the TRDY# assertion of the
corresponding I/O Write bus transaction.
During active RESET#, the Pentium II processor begins sampling the A20M#, IGNNE#,
and LINT[1:0] values to determine the ratio of core-clock frequency to bus-clock
frequency. See Table 9. On the active-to-inactive transition of RESET#, the Pentium II
processor latches these signals and freezes the frequency ratio internally. System logic must
then release these signals for normal operation.
INIT#
I
The INIT# (Initialization) signal, when asserted, resets integer registers inside all processors
without affecting their internal (L1 or L2) caches or floating-point registers. Each processor
then begins execution at the power-on Reset vector configured during power-on
configuration. The processor continues to handle snoop requests during INIT# assertion.
INIT# is an asynchronous signal and must connect the appropriate pins of all Pentium II
processor system bus agents.
If INIT# is sampled active on the active to inactive transition of RESET#, then the processor
executes its Built-in Self-Test (BIST).
The LINT[1:0] (Local APIC Interrupt) signals must connect the appropriate pins of all
APIC Bus agents, including all processors and the core logic or I/O APIC component. When
the APIC is disabled, the LINT0 signal becomes INTR, a maskable interrupt request signal,
and LINT1 becomes NMI, a nonmaskable interrupt. INTR and NMI are backward
compatible with the signals of those names on the Pentium processor. Both signals are
asynchronous.
LINT[1:0]
I
Both of these signals must be software configured via BIOS programming of the APIC
register space to be used either as NMI/INTR or LINT[1:0]. Because the APIC is enabled
by default after Reset, operation of these pins as LINT[1:0] is the default configuration.
During active RESET#, the Pentium II processor begins sampling the A20M#, IGNNE#,
and LINT[1:0] values to determine the ratio of core-clock frequency to bus-clock
frequency. See Table 9. On the active-to-inactive transition of RESET#, the Pentium II
processor latches these signals and freezes the frequency ratio internally. System logic must
then release these signals for normal operation.
LOCK#
I/O
PICCLK
I
PICD[1:0]
78
I/O
The LOCK# signal indicates to the system that a transaction must occur atomically. This
signal must connect the appropriate pins of all Pentium II processor system bus agents. For
a locked sequence of transactions, LOCK# is asserted from the beginning of the first
transaction end of the last transaction.
When the priority agent asserts BPRI# to arbitrate for ownership of the Pentium II processor
system bus, it will wait until it observes LOCK# deasserted. This enables symmetric agents
to retain ownership of the Pentium II processor system bus throughout the bus locked
operation and ensure the atomicity of lock.
The PICCLK (APIC Clock) signal is an input clock to the processor and core logic or I/O
APIC which is required for operation of all processors, core logic, and I/O APIC
components on the APIC bus.
The PICD[1:0] (APIC Data) signals are used for bidirectional serial message passing on the
APIC bus, and must connect the appropriate pins of all processors and core logic or I/O
APIC components on the APIC bus.
PRDY#
O
The PRDY (Probe Ready) signal is a processor output used by debug tools to determine
processor debug readiness.
PREQ#
I
The PREQ# (Probe Request) signal is used by debug tools to request debug operation of the
processors.
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 41. Signal Description (Sheet 6 of 8)
Name
Type
Description
The PWRGOOD (Power Good) signal is a 2.5 V tolerant processor input. The processor
requires this signal to be a clean indication that the clocks and power supplies (VCCCORE,
etc.) are stable and within their specifications. Clean implies that the signal will remain low
(capable of sinking leakage current), without glitches, from the time that the power supplies
are turned on until they come within specification. The signal must then transition
monotonically to a high (2.5 V) state. The figure below illustrates the relationship of
PWRGOOD to other system signals. PWRGOOD can be driven inactive at any time, but
clocks and power must again be stable before a subsequent rising edge of PWRGOOD. It
must also meet the minimum pulse width specification in Table 14 and Table 15, and be
followed by a 1 ms RESET# pulse.
PWRGOOD
I
The PWRGOOD signal must be supplied to the processor; it is used to protect internal
circuits against voltage sequencing issues. It should be driven high throughout boundary
scan operation.
PWRGOOD Relationship at Power-On
BCLK
VCC,
VCCP,
VREF
PWRGOOD
VIH,min
1 msec
RESET#
D0026-00
REQ[4:0]#
I/O
The REQ[4:0]# (Request Command) signals must connect the appropriate pins of all
Pentium II processor system bus agents. They are asserted by the current bus owner over
two clock cycles to define the currently active transaction type.
Asserting the RESET# signal resets all processors to known states and invalidates their L1
and L2 caches without writing back any of their contents. RESET# must remain active for
one microsecond for a “warm” Reset; for a power-on Reset, RESET# must stay active for at
least one millisecond after V CCCORE and CLK have reached their proper specifications. On
observing active RESET#, all Pentium II processor system bus agents will deassert their
outputs within two clocks.
RESET#
I
A number of bus signals are sampled at the active-to-inactive transition of RESET# for
power-on configuration. These configuration options are described in the P6 Family of
Processors Hardware Developer’s Manual (Order Number 244001) for details.
The processor may have its outputs tristated via power-on configuration. Otherwise, if
INIT# is sampled active during the active-to-inactive transition of RESET#, the processor
will execute its Built-in Self-Test (BIST). Whether or not BIST is executed, the processor
will begin program execution at the power on Reset vector (default 0_FFFF_FFF0h).
RESET# must connect the appropriate pins of all Pentium II processor system bus agents.
RP#
RS[2:0]#
Datasheet
I/O
I
The RP# (Request Parity) signal is driven by the request initiator, and provides parity
protection on ADS# and REQ[4:0]#. It must connect the appropriate pins of all Pentium II
processor system bus agents.
A correct parity signal is high if an even number of covered signals are low and low if an
odd number of covered signals are low. This definition allows parity to be high when all
covered signals are high.
The RS[2:0]# (Response Status) signals are driven by the response agent (the agent
responsible for completion of the current transaction), and must connect the appropriate
pins of all Pentium II processor system bus agents.
79
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 41. Signal Description (Sheet 7 of 8)
Name
RSP#
Type
Description
I
The RSP# (Response Parity) signal is driven by the response agent (the agent responsible
for completion of the current transaction) during assertion of RS[2:0]#, the signals for
which RSP# provides parity protection. It must connect the appropriate pins of all Pentium
II processor system bus agents.
A correct parity signal is high if an even number of covered signals are low and low if an
odd number of covered signals are low. While RS[2:0]# = 000, RSP# is also high, since this
indicates it is not being driven by any agent guaranteeing correct parity.
The SLOTOCC# signal is defined to allow a system design to detect the presence of a
terminator card or processor in a SC 242 connector. Combined with the VID combination of
VID[4:0]= 11111 (see Section 2.6), a system can determine if a SC 242 connector is
occupied, and whether a processor core is present. See the table below for states and values
for determining the type of cartridge in the SC 242 connector.
SC 242 Occupation Truth Table
Signal
SLOTOCC#
80
Value
Status
O
SLOTOCC#
VID[4:0]
0
Anything other than
‘11111’
Processor with core in SC 242 connector.
SLOTOCC#
VID[4:0]
0
11111
Terminator cartridge in SC 242 connector
(i.e., no core present).
SLOTOCC#
VID[4:0]
1
Any value
SC 242 connector not occupied.
SLP#
I
The SLP# (Sleep) signal, when asserted in Stop-Grant state, causes processors to enter the
Sleep state. During Sleep state, the processor stops providing internal clock signals to all
units, leaving only the Phase-Locked Loop (PLL) still operating. Processors in this state will
not recognize snoops or interrupts. The processor will recognize only assertions of the
SLP#, STPCLK#, and RESET# signals while in Sleep state. If SLP# is deasserted, the
processor exits Sleep state and returns to Stop-Grant state, restarting its internal clock
signals to the bus and APIC processor core units.
SMI#
I
The SMI# (System Management Interrupt) signal is asserted asynchronously by system
logic. On accepting a System Management Interrupt, processors save the current state and
enter System Management Mode (SMM). An SMI Acknowledge transaction is issued, and
the processor begins program execution from the SMM handler.
STPCLK#
I
The STPCLK# (Stop Clock) signal, when asserted, causes processors to enter a low power
Stop-Grant state. The processor issues a Stop-Grant Acknowledge transaction, and stops
providing internal clock signals to all processor core units except the bus and APIC units.
The processor continues to snoop bus transactions and service interrupts while in StopGrant state. When STPCLK# is deasserted, the processor restarts its internal clock to all
units and resumes execution. The assertion of STPCLK# has no effect on the bus clock;
STPCLK# is an asynchronous input.
TCK
I
The TCK (Test Clock) signal provides the clock input for the Pentium II processor Test Bus
(also known as the Test Access Port).
TDI
I
The TDI (Test Data In) signal transfers serial test data into the Pentium II processor. TDI
provides the serial input needed for JTAG specification support.
TDO
O
The TDO (Test Data Out) signal transfers serial test data out of the Pentium II processor.
TDO provides the serial output needed for JTAG specification support.
TESTHI
I
The TESTHI signal must be connected to a 2.5 V power source through a 1-100 kΩ resistor
for proper processor operation.
THERMDN
O
Thermal Diode Cathode. Used to calculate core temperature. See Section 4.1.
THERMDP
I
Thermal Diode Anode. Used to calculate core temperature. See Section 4.1.
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 41. Signal Description (Sheet 8 of 8)
Name
Type
Description
THERMTRIP#
O
The processor protects itself from catastrophic overheating by use of an internal thermal
sensor. This sensor is set well above the normal operating temperature to ensure that there
are no false trips. The processor will stop all execution when the junction temperature
exceeds approximately 135 °C. This is signaled to the system by the THERMTRIP#
(Thermal Trip) pin. Once activated, the signal remains latched, and the processor stopped,
until RESET# goes active. There is no hysteresis built into the thermal sensor itself; as long
as the die temperature drops below the trip level, a RESET# pulse will reset the processor
and execution will continue. If the temperature has not dropped below the trip level, the
processor will continue to drive THERMTRIP# and remain stopped.
TMS
I
The TMS (Test Mode Select) signal is a JTAG specification support signal used by debug
tools.
TRDY#
I
The TRDY# (Target Ready) signal is asserted by the target to indicate that it is ready to
receive a write or implicit writeback data transfer. TRDY# must connect the appropriate
pins of all Pentium II processor system bus agents.
TRST#
I
The TRST# (Test Reset) signal resets the Test Access Port (TAP) logic. TRST# must be
driven low during power on Reset. This can be done with a 680 ohm pull-down resistor.
O
The VID[4:0] (Voltage ID) pins can be used to support automatic selection of power supply
voltages. These pins are not signals, but are either an open circuit or a short circuit to VSS
on the processor. The combination of opens and shorts defines the voltage required by the
processor. The VID pins are needed to cleanly support voltage specification variations on
Pentium II processors. See Table 1 for definitions of these pins. The power supply must
supply the voltage that is requested by these pins, or disable itself.
VID[4:0]
7.2
Signal Summaries
Table 42 through Table 45 list attributes of the Pentium II processor output, input, and I/O signals.
Table 42. Output Signals
Datasheet
Name
Active Level
Clock
Signal Group
FERR#
Low
Asynch
CMOS Output
IERR#
Low
Asynch
CMOS Output
PRDY#
Low
BCLK
AGTL+ Output
SLOTOCC#
Low
Asynch
Power/Other
TDO
High
TCK
JTAG Output
THERMTRIP#
Low
Asynch
CMOS Output
VID[4:0]
High
Asynch
Power/Other
81
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 43. Input Signals
Name
Active Level
Clock
Signal Group
Qualified
A20M#
Low
Asynch
CMOS Input
Always1
BPRI#
Low
BCLK
AGTL+ Input
Always
BR1#
Low
BCLK
AGTL+ Input
Always
BCLK
High
—
Clock
Always
DEFER#
Low
BCLK
AGTL+ Input
Always
FLUSH#
Low
Asynch
CMOS Input
Always1
IGNNE#
Low
Asynch
CMOS Input
Always1
INIT#
Low
Asynch
CMOS Input
Always1
INTR
High
Asynch
CMOS Input
APIC disabled mode
LINT[1:0]
High
Asynch
CMOS Input
APIC enabled mode
NMI
High
Asynch
CMOS Input
APIC disabled mode
PICCLK
High
—
APIC Clock
Always
PREQ#
Low
Asynch
CMOS Input
Always
PWRGOOD
High
Asynch
CMOS Input
Always
RESET#
Low
BCLK
AGTL+ Input
Always
RS[2:0]#
Low
BCLK
AGTL+ Input
Always
RSP#
Low
BCLK
AGTL+ Input
Always
SLP#
Low
Asynch
CMOS Input
During Stop-Grant state
SMI#
Low
Asynch
CMOS Input
STPCLK#
Low
Asynch
CMOS Input
TCK
High
—
JTAG Input
TDI
High
TCK
JTAG Input
TESTHI
High
Asynch
Power/Other
TMS
High
TCK
JTAG Input
TRST#
Low
Asynch
JTAG Input
TRDY#
Low
BCLK
AGTL+ Input
Always
NOTE:
1. Synchronous assertion with active TDRY# ensures synchronization.
82
Datasheet
Pentium® II Processor at 350 MHz, 400 MHz, and 450 MHz
Table 44. Input/Output Signals (Single Driver)
Name
Active Level
Clock
Signal Group
Qualified
100/66#
Low
Asynch
Power/Other
Always
A[35:3]#
Low
BCLK
AGTL+ I/O
ADS#, ADS#+1
ADS#
Low
BCLK
AGTL+ I/O
Always
AP[1:0]#
Low
BCLK
AGTL+ I/O
ADS#, ADS#+1
BR0#
Low
BCLK
AGTL+ I/O
Always
BP[3:2]#
Low
BCLK
AGTL+ I/O
Always
BPM[1:0]#
Low
BCLK
AGTL+ I/O
Always
D[63:0]#
Low
BCLK
AGTL+ I/O
DRDY#
DBSY#
Low
BCLK
AGTL+ I/O
Always
DEP[7:0]#
Low
BCLK
AGTL+ I/O
DRDY#
DRDY#
Low
BCLK
AGTL+ I/O
Always
LOCK#
Low
BCLK
AGTL+ I/O
Always
REQ[4:0]#
Low
BCLK
AGTL+ I/O
ADS#, ADS#+1
RP#
Low
BCLK
AGTL+ I/O
ADS#, ADS#+1
Table 45. Input/Output Signals (Multiple Driver)
Datasheet
Name
Active Level
Clock
Signal Group
Qualified
AERR#
Low
BCLK
AGTL+ I/O
ADS#+3
BERR#
Low
BCLK
AGTL+ I/O
Always
BNR#
Low
BCLK
AGTL+ I/O
Always
BINIT#
Low
BCLK
AGTL+ I/O
Always
HIT#
Low
BCLK
AGTL+ I/O
Always
HITM#
Low
BCLK
AGTL+ I/O
Always
PICD[1:0]
High
PICCLK
APIC I/O
Always
83