Quad-Core Intel® Xeon® Processor
3300 Series
Datasheet
February 2009
Version -002
Document Number: 319005-002
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∆Intel
processor numbers are not a measure of performance. Processor numbers differentiate features within each processor
family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time
processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not
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progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled
for Intel 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary
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details on which processors support Intel 64, or consult with your system vendor for more information.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting
operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
±
Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor
(VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other benefits will vary
depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible
with all operating systems. Please check with your application vendor.
Not all specified units of this processor support Thermal Monitor 2, Enhanced HALT State and Enhanced Intel SpeedStep®
Technology. See the Processor Spec Finder at http://processorfinder.intel.com or contact your Intel representative for more
information.
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countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2009, Intel Corporation. All Rights Reserved.
2
Datasheet
Contents
1
Introduction .............................................................................................................. 9
1.1
Terminology ....................................................................................................... 9
1.1.1 Processor Terminology Definitions ............................................................ 10
1.2
References ....................................................................................................... 11
2
Electrical Specifications ........................................................................................... 13
2.1
Power and Ground Lands.................................................................................... 13
2.2
Decoupling Guidelines ........................................................................................ 13
2.2.1 Vcc Decoupling ...................................................................................... 13
2.2.2 Vtt Decoupling ....................................................................................... 13
2.2.3 FSB Decoupling...................................................................................... 13
2.3
Voltage Identification ......................................................................................... 14
2.4
Reserved, Unused, and TESTHI Signals ................................................................ 16
2.5
Flexible Motherboard Guidelines (FMB) ................................................................. 16
2.6
Power Segment Identifier (PSID)......................................................................... 17
2.7
Voltage and Current Specification ........................................................................ 17
2.7.1 Absolute Maximum and Minimum Ratings .................................................. 17
2.7.2 DC Voltage and Current Specification ........................................................ 18
2.7.3 VCC Overshoot ...................................................................................... 21
2.7.4 Die Voltage Validation ............................................................................. 22
2.8
Signaling Specifications...................................................................................... 22
2.8.1 FSB Signal Groups.................................................................................. 22
2.8.2 CMOS and Open Drain Signals ................................................................. 24
2.8.3 Processor DC Specifications ..................................................................... 24
2.8.3.1 Platform Environment Control Interface (PECI) DC Specifications..... 26
2.8.3.2 GTL+ Front Side Bus Specifications ............................................. 26
2.9
Clock Specifications ........................................................................................... 28
2.9.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 28
2.9.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 29
2.9.3 Phase Lock Loop (PLL) and Filter .............................................................. 29
2.9.4 BCLK[1:0] Specifications ......................................................................... 30
3
Package Mechanical Specifications .......................................................................... 33
3.1
Package Mechanical Specifications ....................................................................... 33
3.1.1 Package Mechanical Drawing.................................................................... 34
3.1.2 Processor Component Keep-Out Zones ...................................................... 38
3.1.3 Package Loading Specifications ................................................................ 38
3.1.4 Package Handling Guidelines.................................................................... 38
3.1.5 Package Insertion Specifications............................................................... 39
3.1.6 Processor Mass Specification .................................................................... 39
3.1.7 Processor Materials................................................................................. 39
3.1.8 Processor Markings................................................................................. 39
3.1.9 Processor Land Coordinates ..................................................................... 40
4
Land Listing and Signal Descriptions ....................................................................... 41
4.1
Processor Land Assignments ............................................................................... 41
4.2
Alphabetical Signals Reference ............................................................................ 64
5
Thermal Specifications and Design Considerations .................................................. 75
5.1
Processor Thermal Specifications ......................................................................... 75
5.1.1 Thermal Specifications ............................................................................ 75
5.1.2 Thermal Metrology ................................................................................. 80
Datasheet
3
5.2
5.3
Processor Thermal Features ................................................................................80
5.2.1 Thermal Monitor .....................................................................................80
5.2.2 Thermal Monitor 2 ..................................................................................81
5.2.3 On-Demand Mode ...................................................................................82
5.2.4 PROCHOT# Signal ..................................................................................83
5.2.5 THERMTRIP# Signal ................................................................................83
Platform Environment Control Interface (PECI) ......................................................83
5.3.1 Introduction ...........................................................................................83
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems ..................84
5.3.2 PECI Specifications .................................................................................84
5.3.2.1 PECI Device Address..................................................................84
5.3.2.2 PECI Command Support .............................................................84
5.3.2.3 PECI Fault Handling Requirements ...............................................84
5.3.2.4 PECI GetTemp0() Error Code Support ..........................................85
6
Features ..................................................................................................................87
6.1
Power-On Configuration Options ..........................................................................87
6.2
Clock Control and Low Power States .....................................................................87
6.2.1 Normal State .........................................................................................88
6.2.2 HALT and Extended HALT Powerdown States ..............................................88
6.2.2.1 HALT Powerdown State ..............................................................88
6.2.2.2 Extended HALT Powerdown State ................................................89
6.2.3 Stop Grant State ....................................................................................89
6.2.4 Extended HALT Snoop or HALT Snoop State,
Stop Grant Snoop State...........................................................................89
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................90
6.2.4.2 Extended HALT Snoop State .......................................................90
6.2.5 Enhanced Intel SpeedStep® Technology ....................................................90
6.2.6 Processor Power Status Indicator (PSI) Signal ............................................90
7
Boxed Processor Specifications................................................................................91
7.1
Introduction ......................................................................................................91
7.2
Mechanical Specifications ....................................................................................92
7.2.1 Boxed Processor Cooling Solution Dimensions.............................................92
7.2.2 Boxed Processor Fan Heatsink Weight .......................................................94
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....94
7.3
Electrical Requirements ......................................................................................94
7.3.1 Fan Heatsink Power Supply ......................................................................94
7.4
Thermal Specifications........................................................................................96
7.4.1 Boxed Processor Cooling Requirements......................................................96
7.4.2 Variable Speed Fan .................................................................................98
8
Debug Tools Specifications .................................................................................... 101
8.1
Logic Analyzer Interface (LAI) ........................................................................... 101
8.1.1 Mechanical Considerations ..................................................................... 101
8.1.2 Electrical Considerations ........................................................................ 101
Figures
2-1
2-2
2-3
2-4
3-1
3-2
3-3
3-4
3-5
4
VCC Static and Transient Tolerance .........................................................................20
VCC Overshoot Example Waveform .........................................................................21
Differential Clock Waveform...................................................................................31
Measurement Points for Differential Clock Waveforms ...............................................31
Processor Package Assembly Sketch .......................................................................33
Processor Package Drawing Sheet 1 of 3 .................................................................35
Processor Package Drawing Sheet 2 of 3 .................................................................36
Processor Package Drawing Sheet 3 of 3 .................................................................37
Processor Top-Side Markings Example.....................................................................39
Datasheet
3-6
4-1
4-2
5-1
5-2
5-3
5-4
5-5
6-1
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
7-9
Processor Land Coordinates and Quadrants, Top View............................................... 40
land-out Diagram (Top View – Left Side)................................................................. 42
land-out Diagram (Top View – Right Side)............................................................... 43
Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile(95W) ................................ 78
Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile (65W) ....................... 79
Case Temperature (TC) Measurement Location ........................................................ 80
Thermal Monitor 2 Frequency and Voltage Ordering.................................................. 82
Conceptual Fan Control Diagram on PECI-Based Platforms ........................................ 84
Processor Low Power State Machine ....................................................................... 88
Mechanical Representation of the Boxed Processor ................................................... 91
Side View Space Requirements for the Boxed Processor ............................................ 92
Top View Space Requirements for the Boxed Processor ............................................. 93
Overall View Space Requirements for the Boxed Processor ........................................ 93
Boxed Processor Fan Heatsink Power Cable Connector Description.............................. 95
Baseboard Power Header Placement Relative to Processor Socket............................... 96
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ............... 97
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ............... 98
Boxed Processor Fan Heatsink Set Points ................................................................ 99
Tables
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
2-13
2-14
2-15
2-16
2-17
3-1
3-2
3-3
4-1
4-2
4-3
5-1
5-2
5-3
5-4
6-1
7-1
7-2
References.......................................................................................................... 11
Voltage Identification Definition ............................................................................. 14
Absolute Maximum and Minimum Ratings................................................................ 17
Voltage and Current Specifications ......................................................................... 18
VCC Static and Transient Tolerance......................................................................... 19
VCC Overshoot Specifications ................................................................................. 21
FSB Signal Groups ............................................................................................... 23
Signal Characteristics ........................................................................................... 24
Signal Reference Voltages..................................................................................... 24
GTL+ Signal Group DC Specifications ..................................................................... 24
Open Drain and TAP Output Signal Group DC Specifications....................................... 25
CMOS Signal Group DC Specifications ..................................................................... 25
PECI DC Electrical Limits....................................................................................... 26
GTL+ Bus Voltage Definitions ................................................................................ 27
Core Frequency to FSB Multiplier Configuration ........................................................ 28
BSEL[2:0] Frequency Table for BCLK[1:0]............................................................... 29
Front Side Bus Differential BCLK Specifications ........................................................ 30
FSB Differential Clock Specifications (1333 MHz FSB) ............................................... 30
Processor Loading Specifications ............................................................................ 38
Package Handling Guidelines ................................................................................. 38
Processor Materials .............................................................................................. 39
Alphabetical Land Assignments .............................................................................. 44
Numerical Land Assignment .................................................................................. 54
Signal Description ................................................................................................ 64
Processor Thermal Specifications ........................................................................... 76
Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile (95W) ............................... 77
Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile (65W) ............................... 79
GetTemp0() Error Codes....................................................................................... 85
Power-On Configuration Option Signals................................................................... 87
Fan Heatsink Power and Signal Specifications .......................................................... 95
Fan Heatsink Power and Signal Specifications .......................................................... 99
Datasheet
5
Revision History
6
Revision
Date
Document
Number
Version
Number
Revision
319005
1.0
-001
• Initial release
January
2008
-002
• Added Quad-Core Intel® Xeon® Processor
X3380 & L3360
• Updated VID information
• Added PSI# Signal
February
2009
Description
Datasheet
Quad-Core Intel® Xeon® Processor 3300 Series Features
• Available at 3.16 GHz, 3.00 GHz, 2.83 GHz,
2.66 GHz, and 2.50 GHz (Quad-Core Intel®
Xeon® Processor 3300 Series)
• Very deep out-of-order execution
• Optimized for 32-bit applications running on
advanced 32-bit operating systems
• Enhanced Intel Speedstep® Technology
®
64 architecture
®
Virtualization Technology
• Supports Intel
• Supports Intel
• Intel® Advanced Smart Cache
• Two 6 MB Level 2 caches (Quad-Core Intel®
Xeon® Processor X3350, X3360)
• Two 3 MB Level 2 caches (Quad-Core Intel®
Xeon® Processor X3320)
• Intel® Advanced Digital Media Boost
• Enhanced floating point and multimedia unit
for enhanced video, audio, encryption, and
3D performance
• Power Management capabilities
• System Management mode
• Multiple low-power states
• 8-way cache associativity provides improved
cache hit rate on load/store operations
• 775-land Package
• Supports Execute Disable Bit capability
• FSB frequency at 1333 MHz
• Binary compatible with applications running
on previous members of the Intel
microprocessor line
• Advance Dynamic Execution
• Enhanced branch prediction
The Quad-Core Intel® Xeon® Processor 3300 Series deliver Intel's advanced, powerful processors for
desktop PCs. The processor is designed to deliver performance across applications and usages where
end-users can truly appreciate and experience the performance. These applications include Internet
audio and streaming video, image processing, video content creation, speech, 3D, CAD, games,
multimedia, and multitasking user environments.
Intel® 64 architecture enables the processor to execute operating systems and applications written to
take advantage of the Intel 64 architecture. The processor, supporting Enhanced Intel Speedstep®
technology, allows tradeoffs to be made between performance and power consumption.
The Quad-Core Intel® Xeon® Processor 3300 Series also includes the Execute Disable Bit capability.
This feature, combined with a supported operating system, allows memory to be marked as
executable or non-executable.
The Quad-Core Intel® Xeon® Processor 3300 Series support Intel® Virtualization Technology.
Virtualization Technology provides silicon-based functionality that works together with compatible
Virtual Machine Monitor (VMM) software to improve on software-only solutions.
§
Datasheet
7
8
Datasheet
Introduction
1
Introduction
The Quad-Core Intel® Xeon® Processor 3300 Series, like the Quad-Core Intel® Xeon®
Processor 3200 Series, is a based on the Intel® CoreTM microarchitecture. The Intel
Core microarchitecture combines the performance of previous generation Desktop
products with the power efficiencies of a low-power microarchitecture to enable
smaller, quieter systems.The Quad-Core Intel® Xeon® Processor 3300 Series are 64bit processors that maintain compatibility with IA-32 software.
The processor utilizes Flip-Chip Land Grid Array (FC-LGA6) package technology, and
plug into a 775-land surface mount, Land Grid Array (LGA) socket, referred to as the
LGA775 socket.
Note:
In this document the Quad-Core Intel® Xeon® Processor 3300 Series may be referred
to simply as "the processor."
Note:
The Quad-Core Intel® Xeon® Processor 3300 Series refers to X3380, X3360, X3350,
X3330, X3320, L3360.
The processor is a quad-core processor, based on 45 nm process technology. The
processor features the Intel® Advanced Smart Cache, a shared multi-core optimized
cache that significantly reduces latency to frequently used data. The processors feature
a 1333 MHz front side bus (FSB) and either two independent but shared 6 MB of L2
cache (2x6M) or two independent but shared 3 MB of L2 cache (2x3M).The processor
supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD
Extensions 3 (SSE3), Supplemental Streaming SIMD Extension 3 (SSSE3), and the
Streaming SIMD Extensions 4.1 (SSE4.1). The processor supports several Advanced
Technologies: Execute Disable (XD) Bit, Intel® 64 architecture (Intel® 64), Enhanced
Intel SpeedStep® Technology, and Intel® Virtualization Technology (Intel® VT).
The processor's front side bus (FSB) utilizes a split-transaction, deferred reply protocol.
The FSB uses Source-Synchronous Transfer of address and data to improve
performance by transferring data four times per bus clock (4X data transfer rate).
Along with the 4X data bus, the address bus can deliver addresses two times per bus
clock and is referred to as a "double-clocked" or 2X address bus. Working together, the
4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s.
The processor use some of the infrastructure already enabled by 2005 FMB platforms
including heatsink, heatsink retention mechanism, and socket. Manufacturability is a
high priority; hence, mechanical assembly may be completed from the top of the
baseboard and should not require any special tooling.
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in
the active state when driven to a low level. For example, when RESET# is low, a reset
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies
that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and
D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“Front Side Bus” refers to the interface between the processor and system core logic
(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors,
memory, and I/O.
Datasheet
9
Introduction
1.1.1
Processor Terminology Definitions
Commonly used terms are explained here for clarification:
• Quad-Core Intel® Xeon® Processor 3300 Series — Quad core processor in the
FC-LGA6 package with two 6 MB L2 cache or two 3 B L2 cache.
• Processor — For this document, the term processor is the generic form of the
Quad-Core Intel® Xeon® Processor 3300 Series.
• Intel® CoreTM microarchitecture — A new foundation for Intel® architecturebased desktop, mobile and mainstream server multi-core processors. For additional
information refer to: http://www.intel.com/technology/architecture/coremicro/
• Keep-out zone — The area on or near the processor that system design can not
utilize.
• Processor core — Processor die with integrated L2 cache.
• LGA775 socket — The processor mates with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
• Storage conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation — Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
• Execute Disable (XD) Bit — XD allows memory to be marked as executable or
non-executable, when combined with a supporting operating system. If code
attempts to run in non-executable memory the processor raises an error to the
operating system. This feature can prevent some classes of viruses or worms that
exploit buffer over run vulnerabilities and can thus help improve the overall security
of the system. See the Intel® Architecture Software Developer's Manual for more
detailed information.
• Intel® 64 Architecture — An enhancement to Intel's IA-32 architecture, allowing
the processor to execute operating systems and applications written to take
advantage of Intel 64 architecture. Further details on Intel 64 architecture and
programming model can be found in the Software Developer Guide at http://
developer.intel.com/technology/64bitextensions/.
• Enhanced Intel SpeedStep® Technology — Enhanced Intel SpeedStep
Technology allows trade-offs to be made between performance and power
consumptions, based on processor utilization. This may lower average power
consumption (in conjunction with OS support).
• Intel® Virtualization Technology (Intel® VT) — A set of hardware
enhancements to Intel server and client platforms that can improve virtualization
solutions. Intel VT will provide a foundation for widely-deployed virtualization
10
Datasheet
Introduction
solutions and enables more robust hardware assisted virtualization solutions. More
information can be found at: http://www.intel.com/technology/virtualization/
• Platform Environment Control Interface (PECI) — A proprietary one-wire bus
interface that provides a communication channel between the processor and
chipset components to external monitoring devices.
1.2
References
Material and concepts available in the following documents may be beneficial when
reading this document:
Table 1-1.
References
Document
Location
Quad-Core Intel® Xeon® Processor 3300 Series
Thermal and Mechanical Design Guidelines Addendum
http://www.intel.com/
products/processor/
xeon3000/
documentation.htm#therma
l_models
Quad-Core Intel® Xeon® Processor 3300 Series
Specification Update
http://download.intel.com/
design/intarch/specupdt/
319007.pdf
Voltage Regulator-Down (VRD) 11.0 Processor Power
Delivery Design Guidelines For Desktop LGA775 Socket
http://www.intel.com/
design/processor/applnots/
313214.htm
LGA775 Socket Mechanical Design Guide
http://intel.com/design/
Pentium4/guides/
302666.htm
IA-32 Intel Architecture Software Developer's Manual
Volume 1: Basic Architecture
Volume 2A: Instruction Set Reference, A-M
Volume 2B: Instruction Set Reference, N-Z
Volume 3A: System Programming Guide, Part 1
http://www.intel.com/
products/processor/
manuals/
Volume 3B: System Programming Guide, Part 2
§
Datasheet
11
Introduction
12
Datasheet
Electrical Specifications
2
Electrical Specifications
2.1
Power and Ground Lands
The processor has VCC (power), VTT, and VSS (ground) inputs for on-chip power
distribution. All power lands must be connected to VCC, while all VSS lands must be
connected to a system ground plane. The processor VCC lands must be supplied the
voltage determined by the Voltage IDentification (VID) lands.
The signals denoted as VTT provide termination for the front side bus and power to the
I/O buffers. A separate supply must be implemented for these lands, that meets the
VTT specifications outlined in Table 2-3.
2.2
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is
capable of generating large current swings. This may cause voltages on power planes
to sag below their minimum specified values if bulk decoupling is not adequate. Larger
bulk storage (CBULK), such as electrolytic or aluminum-polymer capacitors, supply
current during longer lasting changes in current demand by the component, such as
coming out of an idle condition. Similarly, they act as a storage well for current when
entering an idle condition from a running condition. The motherboard must be designed
to ensure that the voltage provided to the processor remains within the specifications
listed in Table 2-3. Failure to do so can result in timing violations or reduced lifetime of
the component. For further information and guidelines, refer to the appropriate
platform design guidelines.
2.2.1
VCC Decoupling
VCC regulator solutions need to provide sufficient decoupling capacitance to satisfy the
processor voltage specifications. This includes bulk capacitance with low effective series
resistance (ESR) to keep the voltage rail within specifications during large swings in
load current. In addition, ceramic decoupling capacitors are required to filter high
frequency content generated by the front side bus and processor activity. Consult the
Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For
Desktop LGA775 Socket and appropriate platform design guidelines for further
information.
2.2.2
VTT Decoupling
Decoupling must be provided on the motherboard. Decoupling solutions must be sized
to meet the expected load. To ensure compliance with the specifications, various
factors associated with the power delivery solution must be considered including
regulator type, power plane and trace sizing, and component placement. A
conservative decoupling solution would consist of a combination of low ESR bulk
capacitors and high frequency ceramic capacitors. For further information regarding
power delivery, decoupling and layout guidelines, refer to the appropriate platform
design guidelines.
2.2.3
FSB Decoupling
The processor integrates signal termination on the die. In addition, some of the high
frequency capacitance required for the FSB is included on the processor package.
However, additional high frequency capacitance must be added to the motherboard to
Datasheet
13
Electrical Specifications
properly decouple the return currents from the front side bus. Bulk decoupling must
also be provided by the motherboard for proper [A]GTL+ bus operation. Decoupling
guidelines are described in the appropriate platform design guidelines.
2.3
Voltage Identification
The Voltage Identification (VID) specification for the processor is defined by the Voltage
Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop
LGA775 Socket. The voltage set by the VID signals is the reference VR output voltage
to be delivered to the processor VCC lands (see Chapter 2.7.3 for VCC overshoot
specifications). Refer to Table 2-11 for the DC specifications for these signals. Voltages
for each processor frequency is provided in Table 2-3.
NOTE: To support the Deeper Sleep State the platform must use a VRD 11.1 compliant
solution. The Deeper Sleep State also requires additional platform support. Refer to the
platform design guide and the Voltage Regulator-Down (VRD) 11.1 Processor Power
Delivery Design Guidelines for further details.
Individual processor VID values may be calibrated during manufacturing such that two
devices at the same core speed may have different default VID settings. This is
reflected by the VID Range values provided in Table 2-3. Refer to the Processor
Specification Update for further details on specific valid core frequency and VID values
of the processor. Note that this differs from the VID employed by the processor during
a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep®
technology, or Extended HALT State).
The processor uses eight voltage identification signals, VID[7:0], to support automatic
selection of power supply voltages. Table 2-1 specifies the voltage level corresponding
to the state of VID[7:0]. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers
to a low voltage level. If the processor socket is empty (VID[7:0] = 11111110), or the
voltage regulation circuit cannot supply the voltage that is requested, it must disable
itself.
The processor provides the ability to operate while transitioning to an adjacent VID and
its associated processor core voltage (VCC). This will represent a DC shift in the load
line. It should be noted that a low-to-high or high-to-low voltage state change may
result in as many VID transitions as necessary to reach the target core voltage.
Transitions above the specified VID are not permitted. Table 2-3 includes VID step sizes
and DC shift ranges. Minimum and maximum voltages must be maintained as shown in
Table 2-4 and Figure 2-1as measured across the VCC_SENSE and VSS_SENSE lands.
The VRM or VRD utilized must be capable of regulating its output to the value defined
by the new VID. DC specifications for dynamic VID transitions are included in Table 2-3
and Table 2-4. Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power
Delivery Design Guidelines For Desktop LGA775 Socket for further details.
Table 2-1.
Voltage Identification Definition
VID VID VID VID VID VID VID VID
7
6
5
4
3
2
1
0
Voltage
VID VID VID VID VID VID VID VID
Voltage
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
OFF
0
1
0
1
1
1
0
0
0
0
0
0
0
0
1
0
1.6
0
1
0
1
1
1
1
0
1.025
0
0
0
0
0
1
0
0
1.5875
0
1
1
0
0
0
0
0
1.0125
0
0
0
0
0
1
1
0
1.575
0
1
1
0
0
0
1
0
1
0
0
0
0
1
0
0
0
1.5625
0
1
1
0
0
1
0
0
0.9875
0
0
0
0
1
0
1
0
1.55
0
1
1
0
0
1
1
0
0.975
0
0
0
0
1
1
0
0
1.5375
0
1
1
0
1
0
0
0
0.9625
14
1.0375
Datasheet
Electrical Specifications
VID VID VID VID VID VID VID VID
7
6
5
4
3
2
1
0
Voltage
VID VID VID VID VID VID VID VID
Voltage
7
6
5
4
3
2
1
0
0
0
0
0
1
1
1
0
1.525
0
1
1
0
1
0
1
0
0.95
0
0
0
1
0
0
0
0
1.5125
0
1
1
0
1
1
0
0
0.9375
0
0
0
1
0
0
1
0
1.5
0
1
1
0
1
1
1
0
0.925
0
0
0
1
0
1
0
0
1.4875
0
1
1
1
0
0
0
0
0.9125
0
0
0
1
0
1
1
0
1.475
0
1
1
1
0
0
1
0
0.9
0
0
0
1
1
0
0
0
1.4625
0
1
1
1
0
1
0
0
0.8875
0
0
0
1
1
0
1
0
1.45
0
1
1
1
0
1
1
0
0.875
0
0
0
1
1
1
0
0
1.4375
0
1
1
1
1
0
0
0
0.8625
0
0
0
1
1
1
1
0
1.425
0
1
1
1
1
0
1
0
0.85
0
0
1
0
0
0
0
0
1.4125
0
1
1
1
1
1
0
0
0.8375
0
0
1
0
0
0
1
0
1.4
0
1
1
1
1
1
1
0
0.825
0
0
1
0
0
1
0
0
1.3875
1
0
0
0
0
0
0
0
0.8125
0
0
1
0
0
1
1
0
1.375
1
0
0
0
0
0
1
0
0.8
0
0
1
0
1
0
0
0
1.3625
1
0
0
0
0
1
0
0
0.7875
0
0
1
0
1
0
1
0
1.35
1
0
0
0
0
1
1
0
0.775
0
0
1
0
1
1
0
0
1.3375
1
0
0
0
1
0
0
0
0.7625
0
0
1
0
1
1
1
0
1.325
1
0
0
0
1
0
1
0
0.75
0
0
1
1
0
0
0
0
1.3125
1
0
0
0
1
1
0
0
0.7375
0
0
1
1
0
0
1
0
1.3
1
0
0
0
1
1
1
0
0.725
0
0
1
1
0
1
0
0
1.2875
1
0
0
1
0
0
0
0
0.7125
0
0
1
1
0
1
1
0
1.275
1
0
0
1
0
0
1
0
0.7
0
0
1
1
1
0
0
0
1.2625
1
0
0
1
0
1
0
0
0.6875
0
0
1
1
1
0
1
0
1.25
1
0
0
1
0
1
1
0
0.675
0
0
1
1
1
1
0
0
1.2375
1
0
0
1
1
0
0
0
0.6625
0
0
1
1
1
1
1
0
1.225
1
0
0
1
1
0
1
0
0.65
0
1
0
0
0
0
0
0
1.2125
1
0
0
1
1
1
0
0
0.6375
0
1
0
0
0
0
1
0
1.2
1
0
0
1
1
1
1
0
0.625
0
1
0
0
0
1
0
0
1.1875
1
0
1
0
0
0
0
0
0.6125
0
1
0
0
0
1
1
0
1.175
1
0
1
0
0
0
1
0
0.6
0
1
0
0
1
0
0
0
1.1625
1
0
1
0
0
1
0
0
0.5875
0
1
0
0
1
0
1
0
1.15
1
0
1
0
0
1
1
0
0.575
0
1
0
0
1
1
0
0
1.1375
1
0
1
0
1
0
0
0
0.5625
0
1
0
0
1
1
1
0
1.125
1
0
1
0
1
0
1
0
0.55
0
1
0
1
0
0
0
0
1.1125
1
0
1
0
1
1
0
0
0.5375
0
1
0
1
0
0
1
0
1.1
1
0
1
0
1
1
1
0
0.525
0
1
0
1
0
1
0
0
1.0875
1
0
1
1
0
0
0
0
0.5125
0
1
0
1
0
1
1
0
1.075
1
0
1
1
0
0
1
0
0.5
0
1
0
1
1
0
0
0
1.0625
1
1
1
1
1
1
1
0
OFF
0
1
0
1
1
0
1
0
1.05
Datasheet
15
Electrical Specifications
2.4
Reserved, Unused, and TESTHI Signals
All RESERVED lands must remain unconnected. Connection of these lands to VCC, VSS,
VTT, or to any other signal (including each other) can result in component malfunction
or incompatibility with future processors. See Chapter 4 for a land listing of the
processor and the location of all RESERVED lands.
In a system level design, on-die termination has been included by the processor to
allow signals to be terminated within the processor silicon. Most unused GTL+ inputs
should be left as no connects as GTL+ termination is provided on the processor silicon.
However, see Table 2-6 for details on GTL+ signals that do not include on-die
termination.
Unused active high inputs, should be connected through a resistor to ground (VSS).
Unused outputs can be left unconnected, however this may interfere with some TAP
functions, complicate debug probing, and prevent boundary scan testing. A resistor
must be used when tying bidirectional signals to power or ground. When tying any
signal to power or ground, a resistor will also allow for system testability. Resistor
values should be within ± 20% of the impedance of the motherboard trace for front
side bus signals. For unused GTL+ input or I/O signals, use pull-up resistors of the
same value as the on-die termination resistors (RTT). For details see Table 2-13.
TAP and CMOS signals do not include on-die termination. Inputs and utilized outputs
must be terminated on the motherboard. Unused outputs may be terminated on the
motherboard or left unconnected. Note that leaving unused outputs unterminated may
interfere with some TAP functions, complicate debug probing, and prevent boundary
scan testing. Signal termination for these signal types is discussed in the appropriate
platform design guidelines.
All TESTHI[13,11:10:7:0] lands should be individually connected to VTT via a pull-up
resistor which matches the nominal trace impedance.
The TESTHI signals may use individual pull-up resistors or be grouped together as
detailed below. A matched resistor must be used for each group:
• TESTHI[1:0]
• TESTHI[7:2]
• TESTHI10 – cannot be grouped with other TESTHI signals
• TESTHI11 – cannot be grouped with other TESTHI signals
• TESTHI13 – cannot be grouped with other TESTHI signals
Terminating multiple TESTHI pins together with a single pull-up resistor is not
recommended for designs supporting boundary scan for proper Boundary Scan testing
of the TESTHI signals. For optimum noise margin, all pull-up resistor values used for
TESTHI[13, 11:10,7:0] lands should have a resistance value within ± 20% of the
impedance of the board transmission line traces. For example, if the nominal trace
impedance is 50 Ω, then a value between 40 Ω and 60 Ω should be used.
2.5
Flexible Motherboard Guidelines (FMB)
The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the
processor will have over certain time periods. The values are only estimates and actual
specifications for future processors may differ. Processors may or may not have
specifications equal to the FMB value in the foreseeable future. System designers
should meet the FMB values to ensure their systems will be compatible with future
processors. The FMB values are shown in Table 2-3 and Table 5-1.
16
Datasheet
Electrical Specifications
2.6
Power Segment Identifier (PSID)
Power Segment Identifier (PSID) is a mechanism to prevent booting under mismatched
power requirement situations. The PSID mechanism enables BIOS to detect if the
processor in use requires more power than the platform voltage regulator (VR) is
capable of supplying. For example, a 130W TDP processor installed in a board with a
65W or 95W TDP capable VR may draw too much power and cause a potential VR issue.
2.7
Voltage and Current Specification
2.7.1
Absolute Maximum and Minimum Ratings
Table 2-2 specifies absolute maximum and minimum ratings only and lie outside the
functional limits of the processor. Within functional operation limits, functionality and
long-term reliability can be expected.
At conditions outside functional operation condition limits, but within absolute
maximum and minimum ratings, neither functionality nor long-term reliability can be
expected. If a device is returned to conditions within functional operation limits after
having been subjected to conditions outside these limits, but within the absolute
maximum and minimum ratings, the device may be functional, but with its lifetime
degraded depending on exposure to conditions exceeding the functional operation
condition limits.
At conditions exceeding absolute maximum and minimum ratings, neither functionality
nor long-term reliability can be expected. Moreover, if a device is subjected to these
conditions for any length of time then, when returned to conditions within the
functional operating condition limits, it will either not function, or its reliability will be
severely degraded.
Although the processor contains protective circuitry to resist damage from static
electric discharge, precautions should always be taken to avoid high static voltages or
electric fields.
Table 2-2.
Absolute Maximum and Minimum Ratings
Symbol
Parameter
Min
Max
Unit
Notes1, 2
VCC
Core voltage with respect to
VSS
–0.3
1.45
V
-
VTT
FSB termination voltage with
respect to VSS
–0.3
1.45
V
-
TCASE
Processor case temperature
See Section 5
See
Section 5
°C
-
TSTORAGE
Processor storage
temperature
–40
85
°C
3, 4, 5
NOTES:
1.
For functional operation, all processor electrical, signal quality, mechanical and thermal
specifications must be satisfied.
2.
Overshoot and undershoot voltage guidelines for input, output and I/O signals are outlined
in Chapter 3. Excessive overshoot or undershoot on any signal will likely result in
permanent damage to the processor.
3.
Storage temperature is applicable to storage conditions only. In this scenario, the
processor must not receive a clock, and no lands can be connected to a voltage bias.
Datasheet
17
Electrical Specifications
Storage within these limits will not affect the long-term reliability of the device. For
functional operation, refer to the processor case temperature specifications.
This rating applies to the processor and does not include any tray or packaging.
Failure to adhere to this specification can affect the long term reliability of the processor.
4.
5.
2.7.2
DC Voltage and Current Specification
Table 2-3.
Voltage and Current Specifications
Symbol
VID Range
VCC Core
Parameter
VID
Processor
Number
VCC for 775_VR_CONFIG_05A
(95W)
775_VR_CONFIG_06A
(65W)
X3380
3.16 GHz (12MB Cache)
X3370
3.00 GHz (12MB Cache)
L3360
2.83 GHz (12MB Cache)
X3330
2.66 GHz (6MB Cache)
X3360
2.83 GHz (12MB Cache)
X3350
2.66 GHz (12MB Cache)
X3320
2.50 GHz (6MB Cache)
VCC_BOOT
Default VCC voltage for initial power up
VCCPLL
PLL VCC
ICC
VTT
VTT_OUT_LEFT
and
VTT_OUT_RIGHT
ICC
ITT
Processor
Number
ICC for 775_VR_CONFIG_05A
(95W)
775_VR_CONFIG_06A
(65W)
X3380
3.16 GHz (12MB Cache)
X3370
3.00 GHz (12MB Cache)
L3360
2.83 GHz (12MB Cache)
X3330
2.66 GHz (6MB Cache)
X3360
2.83 GHz (12MB Cache)
X3350
2.66 GHz (12MB Cache)
X3320
2.50 GHz (6MB Cache)
FSB termination voltage
(DC + AC specifications)
DC Current that may be drawn from
VTT_OUT_LEFT and VTT_OUT_RIGHT per land
ICC for VTT supply before VCC stable
ICC for VTT supply after VCC stable
ICC_VCCPLL
ICC for PLL land
ICC_GTLREF
ICC for GTLREF
Min
Typ
Max
Unit
0.8500
-
1.3625
V
Refer to Table 2-4 and
Figure 2-1
V
2, 11
1
3, 4, 5
-
1.10
-
- 5%
1.50
+ 5%
-
-
100
A
6, 7
1.045
1.10
1.155
V
8, 9
-
-
580
mA
-
-
-
-
8.0
7.0
V
A
130
mA
200
µA
NOTES:
1.
Each processor is programmed with a maximum valid voltage identification value (VID),
which is set at manufacturing and can not be altered. Individual maximum VID values are
calibrated during manufacturing such that two processors at the same frequency may have
18
Notes
Datasheet
10
Electrical Specifications
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
Table 2-4.
different settings within the VID range. Note that this differs from the VID employed by the
processor during a power management event (Thermal Monitor 2, Enhanced Intel
SpeedStep® Technology, or Extended HALT State).
Unless otherwise noted, all specifications in this table are based on estimates and
simulations or empirical data. These specifications will be updated with characterized data
from silicon measurements at a later date.
These voltages are targets only. A variable voltage source should exist on systems in the
event that a different voltage is required. See Section 2.3 and Table 2-1 for more
information.
The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE
lands at the socket with a 100MHz bandwidth oscilloscope, 1.5 pF maximum probe
capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the
probe should be less than 5 mm. Ensure external noise from the system is not coupled into
the oscilloscope probe.
Refer to Table 2-4 and Figure 2-1 for the minimum, typical, and maximum VCC allowed for
a given current. The processor should not be subjected to any VCC and ICC combination
wherein VCC exceeds VCC_MAX for a given current.
FMB is the Flexible Motherboard guideline. These guidelines are for estimation purposes
only. See Section 2.5 for further details on FMB guidelines.
ICC_MAX specification is based on VCC_MAX loadline. Refer to Figure 2-1 for details.
VTT must be provided via a separate voltage source and not be connected to VCC. This
specification is measured at the land.
Baseboard bandwidth is limited to 20 MHz.
This is the maximum total current drawn from the VTT plane by only the processor. This
specification does not include the current coming from on-board termination (RTT),
through the signal line. Refer to the appropriate platform design guide and the Voltage
Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop
LGA775 Socket to determine the total ITT drawn by the system. This parameter is based on
design characterization and is not tested.
Adherence to the voltage specifications for the processor are required to ensure reliable
processor operation.
VCC Static and Transient Tolerance
Voltage Deviation from VID Setting (V)1, 2, 3, 4
ICC (A)
Maximum Voltage
1.30 mΩ
Typical Voltage
1.38 mΩ
Minimum Voltage
1.45 mΩ
0
0.000
-0.019
-0.038
5
-0.007
-0.026
-0.045
10
-0.013
-0.033
-0.053
15
-0.020
-0.040
-0.060
20
-0.026
-0.047
-0.067
25
-0.033
-0.053
-0.074
30
-0.039
-0.060
-0.082
35
-0.046
-0.067
-0.089
40
-0.052
-0.074
-0.096
45
-0.059
-0.081
-0.103
50
-0.065
-0.088
-0.111
55
-0.072
-0.095
-0.118
60
-0.078
-0.102
-0.125
65
-0.085
-0.108
-0.132
70
-0.091
-0.115
-0.140
75
-0.098
-0.122
-0.147
80
-0.101
-0.126
-0.151
Datasheet
19
Electrical Specifications
Table 2-4.
VCC Static and Transient Tolerance (Continued)
Voltage Deviation from VID Setting (V)1, 2, 3, 4
ICC (A)
Maximum Voltage
1.30 mΩ
Typical Voltage
1.38 mΩ
Minimum Voltage
1.45 mΩ
85
-0.111
-0.136
-0.161
90
-0.117
-0.143
-0.169
95
-0.124
-0.150
-0.176
100
-0.130
-0.157
-0.183
NOTES:
1.
The loadline specification includes both static and transient limits except for overshoot
allowed as shown in Section 2.7.3.
2.
This table is intended to aid in reading discrete points on Figure 2-1.
3.
The loadlines specify voltage limits at the die measured at the VCC_SENSE and
VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken
from processor VCC and VSS lands. Refer to the Voltage Regulator-Down (VRD) 11.0
Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for socket loadline
guidelines and VR implementation details.
4.
Adherence to this loadline specification is required to ensure reliable processor operation.
Figure 2-1.
VCC Static and Transient Tolerance
Icc [A]
0
10
20
30
40
50
60
70
80
90
100
VID - 0.000
VID - 0.013
VID - 0.025
Vcc Maximum
VID - 0.038
VID - 0.050
VID - 0.063
Vcc [V]
VID - 0.075
VID - 0.088
Vcc Typical
VID - 0.100
VID - 0.113
VID - 0.125
Vcc Minimum
VID - 0.138
VID - 0.150
VID - 0.163
VID - 0.175
VID - 0.188
NOTES:
1.
The loadline specification includes both static and transient limits except for overshoot
allowed as shown in Section 2.7.3.
2.
This loadline specification shows the deviation from the VID set point.
20
Datasheet
Electrical Specifications
3.
2.7.3
The loadlines specify voltage limits at the die measured at the VCC_SENSE and
VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken
from processor VCC and VSS lands. Refer to the Voltage Regulator-Down (VRD) 11.0
Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for socket loadline
guidelines and VR implementation details.
VCC Overshoot
The processor can tolerate short transient overshoot events where VCC exceeds the VID
voltage when transitioning from a high to low current load condition. This overshoot
cannot exceed VID + VOS_MAX (VOS_MAX is the maximum allowable overshoot voltage).
The time duration of the overshoot event must not exceed TOS_MAX (TOS_MAX is the
maximum allowable time duration above VID). These specifications apply to the
processor die voltage as measured across the VCC_SENSE and VSS_SENSE lands.
Table 2-5.
VCC Overshoot Specifications
Symbol
Parameter
Min
Max
Unit
Figure
Notes
VOS_MAX
Magnitude of VCC overshoot above
VID
-
50
mV
2-2
1
TOS_MAX
Time duration of VCC overshoot above
VID
-
25
µs
2-2
1
NOTES:
1.
Adherence to these specifications is required to ensure reliable processor operation.
Figure 2-2.
VCC Overshoot Example Waveform
Example Overshoot Waveform
VOS
Voltage [V]
VID + 0.050
VID - 0.000
TOS
0
5
10
15
20
25
Time [us]
TOS: Overshoot time above VID
VOS: Overshoot above VID
NOTES:
1.
VOS is measured overshoot voltage.
2.
TOS is measured time duration above VID.
Datasheet
21
Electrical Specifications
2.7.4
Die Voltage Validation
Overshoot events on processor must meet the specifications in Table 2-5 when
measured across the VCC_SENSE and VSS_SENSE lands. Overshoot events that are <
10 ns in duration may be ignored. These measurements of processor die level
overshoot must be taken with a bandwidth limited oscilloscope set to a greater than or
equal to 100 MHz bandwidth limit.
2.8
Signaling Specifications
Most processor Front Side Bus signals use Gunning Transceiver Logic (GTL+) signaling
technology. This technology provides improved noise margins and reduced ringing
through low voltage swings and controlled edge rates. Platforms implement a
termination voltage level for GTL+ signals defined as VTT. Because platforms implement
separate power planes for each processor (and chipset), separate VCC and VTT supplies
are necessary. This configuration allows for improved noise tolerance as processor
frequency increases. Speed enhancements to data and address busses have caused
signal integrity considerations and platform design methods to become even more
critical than with previous processor families. Design guidelines for the processor front
side bus are detailed in the appropriate platform design guides (refer to Section 1.2).
The GTL+ inputs require a reference voltage (GTLREF) which is used by the receivers to
determine if a signal is a logical 0 or a logical 1. GTLREF must be generated on the
motherboard (see Table 2-13 for GTLREF specifications). Refer to the applicable
platform design guidelines for details. Termination resistors (RTT) for GTL+ signals are
provided on the processor silicon and are terminated to VTT. Intel chipsets will also
provide on-die termination, thus eliminating the need to terminate the bus on the
motherboard for most GTL+ signals.
2.8.1
FSB Signal Groups
The front side bus signals have been combined into groups by buffer type. GTL+ input
signals have differential input buffers, which use GTLREF[3:0] as a reference level. In
this document, the term “GTL+ Input” refers to the GTL+ input group as well as the
GTL+ I/O group when receiving. Similarly, “GTL+ Output” refers to the GTL+ output
group as well as the GTL+ I/O group when driving.
With the implementation of a source synchronous data bus comes the need to specify
two sets of timing parameters. One set is for common clock signals which are
dependent upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second
set is for the source synchronous signals which are relative to their respective strobe
lines (data and address) as well as the rising edge of BCLK0. Asychronous signals are
still present (A20M#, IGNNE#, etc.) and can become active at any time during the
clock cycle. Table 2-6 identifies which signals are common clock, source synchronous,
and asynchronous.
22
Datasheet
Electrical Specifications
Table 2-6.
FSB Signal Groups
Signal Group
Signals1
Type
GTL+ Common
Clock Input
Synchronous to
BCLK[1:0]
BPRI#, DEFER#, RESET#, RS[2:0]#, TRDY#
GTL+ Common
Clock I/O
Synchronous to
BCLK[1:0]
ADS#, BNR#, BPM[5:0]#, BPMb[3:0]#, BR0#3, DBSY#,
DRDY#, HIT#, HITM#, LOCK#
Signals
GTL+ Source
Synchronous I/O
GTL+ Strobes
Synchronous to
assoc. strobe
Synchronous to
BCLK[1:0]
Associated Strobe
REQ[4:0]#, A[16:3]#3
ADSTB0#
A[35:17]#3
ADSTB1#
D[15:0]#, DBI0#
DSTBP0#, DSTBN0#
D[31:16]#, DBI1#
DSTBP1#, DSTBN1#
D[47:32]#, DBI2#
DSTBP2#, DSTBN2#
D[63:48]#, DBI3#
DSTBP3#, DSTBN3#
ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]#
CMOS
A20M#, DPSLP#, DPRSTP#, IGNNE#, INIT#, LINT0/
INTR, LINT1/NMI, SMI#3, STPCLK#, PWRGOOD, SLP#,
TCK, TDI, TDI_M, TMS, TRST#, BSEL[2:0], VID[7:0],
PSI#
Open Drain
Output
FERR#/PBE#, IERR#, THERMTRIP#, TDO, TDO_M
Open Drain
Input/Output
PROCHOT#4
FSB Clock
Power/Other
Clock
BCLK[1:0], ITP_CLK[1:0]2
VCC, VTT, VCCA, VCCIOPLL, VCCPLL, VSS, VSSA,
GTLREF[3:0], COMP[8,3:0], RESERVED,
TESTHI[13,11:10,7:0], VCC_SENSE,
VCC_MB_REGULATION, VSS_SENSE,
VSS_MB_REGULATION, DBR#2, VTT_OUT_LEFT,
VTT_OUT_RIGHT, VTT_SEL, FCx, PECI, MSID[1:0]
NOTES:
1.
Refer to Section 4.2 for signal descriptions.
2.
In processor systems where no debug port is implemented on the system board, these
signals are used to support a debug port interposer. In systems with the debug port
implemented on the system board, these signals are no connects.
3.
The value of these signals during the active-to-inactive edge of RESET# defines the
processor configuration options. See Section 6.1 for details.
4.
PROCHOT# signal type is open drain output and CMOS input.
Datasheet
23
Electrical Specifications
.
Table 2-7.
Signal Characteristics
Signals with RTT
Signals with No RTT
A[35:3]#, ADS#, ADSTB[1:0]#, BNR#, BPRI#,
D[63:0]#, DBI[3:0]#, DBSY#, DEFER#,
DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, HIT#,
HITM#, LOCK#, PROCHOT#, REQ[4:0]#,
RS[2:0]#, TRDY#
A20M#, BCLK[1:0], BSEL[2:0],
COMP[8,3:0], FERR#/PBE#, IERR#, IGNNE#,
INIT#, ITP_CLK[1:0], LINT0/INTR, LINT1/
NMI, MSID[1:0], PWRGOOD, RESET#, SMI#,
STPCLK#, TDO, TDO_M,
TESTHI[13,11:10,7:0], THERMTRIP#,
VID[6:0], GTLREF[3:0], TCK, TDI, TDI_M,
TMS, TRST#, VTT_SEL
Open Drain Signals1
THERMTRIP#, FERR#/PBE#, IERR#, BPM[5:0]#,
BPMb[3:0]#, BR0#, TDO, TDO_M, FCx
NOTES:
1.
Signals that do not have RTT, nor are actively driven to their high-voltage level.
Table 2-8.
Signal Reference Voltages
GTLREF
VTT/2
BPM[5:0]#, BPMb[3:0]#, RESET#, BNR#, HIT#,
HITM#, BR0#, A[35:0]#, ADS#, ADSTB[1:0]#,
BPRI#, D[63:0]#, DBI[3:0]#, DBSY#, DEFER#,
DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, LOCK#,
REQ[4:0]#, RS[2:0]#, TRDY#
A20M#, LINT0/INTR, LINT1/NMI,
IGNNE#, INIT#, PROCHOT#,
PWRGOOD1, SMI#, STPCLK#, TCK1,
TDI1, TDI_M1, TMS1, TRST#1
NOTE:
1.
See Table 2-10 for more information.
2.8.2
CMOS and Open Drain Signals
Legacy input signals such as A20M#, IGNNE#, INIT#, SMI#, and STPCLK# use CMOS
input buffers. All of the CMOS and Open Drain signals are required to be asserted/
deasserted for at least eight BCLKs in order for the processor to recognize the proper
signal state. See Section 2.8.3 for the DC specifications. See Section 6.2 for additional
timing requirements for entering and leaving the low power states.
2.8.3
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads)
unless otherwise stated. All specifications apply to all frequencies and cache sizes
unless otherwise stated.
Table 2-9.
GTL+ Signal Group DC Specifications
Symbol
24
Parameter
Min
Max
Unit
Notes1
VIL
Input Low Voltage
-0.10
GTLREF - 0.10
V
2, 6
VIH
Input High Voltage
GTLREF + 0.10
VTT + 0.10
V
3, 4, 6
VOH
Output High Voltage
VTT - 0.10
VTT
V
4, 6
IOL
Output Low Current
N/A
VTT_MAX /
[(RTT_MIN) + (2 * RON_MIN)]
A
-
Datasheet
Electrical Specifications
Table 2-9.
GTL+ Signal Group DC Specifications
Symbol
Parameter
Min
Max
Unit
Notes1
ILI
Input Leakage
Current
N/A
± 100
µA
7
ILO
Output Leakage
Current
N/A
± 100
µA
8
RON
Buffer On Resistance
7.49
9.16
Ω
5
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
VIL is defined as the voltage range at a receiving agent that will be interpreted as a logical
low value.
3.
VIH is defined as the voltage range at a receiving agent that will be interpreted as a logical
high value.
4.
VIH and VOH may experience excursions above VTT. However, input signal drivers must
comply with the signal quality specifications in Chapter 3.
5.
Refer to processor I/O Buffer Models for I/V characteristics.
6.
The VTT referred to in these specifications is the instantaneous VTT.
7.
Leakage to VSS with land held at VTT.
8.
Leakage to VTT with land held at 300mV.
Table 2-10. Open Drain and TAP Output Signal Group DC Specifications
Symbol
Parameter
Min
Max
Unit
Notes1
VOL
Output Low Voltage
0
0.20
V
-
IOL
Output Low Current
16
50
mA
2
ILO
Output Leakage Current
N/A
± 200
µA
3
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
Measured at VTT * 0.2V.
3.
For Vin between 0 and VOH.
Table 2-11. CMOS Signal Group DC Specifications
Symbol
Parameter
Min
Max
Unit
Notes1
V
3, 6
VIL
Input Low Voltage
-0.10
VTT * 0.30
VIH
Input High Voltage
VTT * 0.70
VTT + 0.10
V
4, 5, 6
VOL
Output Low Voltage
-0.10
VTT * 0.10
V
6
VOH
Output High Voltage
0.90 * VTT
VTT + 0.10
V
2, 5, 6
IOL
Output Low Current
VTT * 0.10 /
67
VTT * 0.10 /
27
A
6, 7
IOH
Output Low Current
VTT * 0.10 /
67
VTT * 0.10 /
27
A
6, 7
ILI
Input Leakage Current
N/A
± 100
µA
8
ILO
Output Leakage Current
N/A
± 100
µA
9
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
All outputs are open drain.
Datasheet
25
Electrical Specifications
3.
VIL is defined as the voltage range at a receiving agent that will be interpreted as a logical
low value.
VIH is defined as the voltage range at a receiving agent that will be interpreted as a logical
high value.
VIH and VOH may experience excursions above VTT. However, input signal drivers must
comply with the signal quality specifications in Chapter 3.
The VTT referred to in these specifications refers to instantaneous VTT.
IOL is measured at 0.10 * VTT. IOH is measured at 0.90 * VTT.
Leakage to VSS with land held at VTT.
Leakage to VTT with land held at 300 mV.
4.
5.
6.
7.
8.
9.
2.8.3.1
Platform Environment Control Interface (PECI) DC Specifications
PECI is an Intel proprietary one-wire interface that provides a communication channel
between Intel processors, chipsets, and external thermal monitoring devices. The
Yorkfield processor contains Digital Thermal Sensors (DTS) distributed throughout die.
These sensors are implemented as analog-to-digital converters calibrated at the factory
for reasonable accuracy to provide a digital representation of relative processor
temperature. PECI provides an interface to relay the highest DTS temperature within a
die to external management devices for thermal/fan speed control. More detailed
information may be found in the Platform Environment Control Interface (PECI)
Specification.
Table 2-12. PECI DC Electrical Limits
Symbol
Vin
Vhysteresis
Definition and Conditions
Input Voltage Range
Hysteresis
Min
Max
Units
-0.15
VTT
V
0.1 * VTT
-
V
Notes1
2
Vn
Negative-edge threshold voltage
0.275 * VTT
0.500 * VTT
V
Vp
Positive-edge threshold voltage
0.550 * VTT
0.725 * VTT
V
-6.0
N/A
mA
(VOL = 0.25 * VTT)
0.5
1.0
mA
Ileak+
High impedance state leakage to VTT
N/A
50
µA
3
Ileak-
High impedance leakage to GND
N/A
10
µA
2
Cbus
Bus capacitance per node
-
10
pF
4
Vnoise
Signal noise immunity above 300 MHz
0.1 * VTT
-
Vp-p
Isource
Isink
High level output source
(VOH = 0.75 * VTT)
Low level output sink
NOTES:
1. VTT supplies the PECI interface. PECI behavior does not affect VTT min/max specifications. Please
refer to Table 2-3 for VTT specifications.
2. The leakage specification applies to powered devices on the PECI bus.
3. The input buffers use a Schmitt-triggered input design for improved noise immunity.
4. One node is counted for each client and one node for the system host. Extended trace lengths
might appear as additional nodes.
.
2.8.3.2
GTL+ Front Side Bus Specifications
In most cases, termination resistors are not required as these are integrated into the
processor silicon. See Table 2-7 for details on which GTL+ signals do not include on-die
termination. Refer to the appropriate platform design guidelines for specific
implementation details.
26
Datasheet
Electrical Specifications
Valid high and low levels are determined by the input buffers by comparing with a
reference voltage called GTLREF. Table 2-13 lists the GTLREF specifications. The GTL+
reference voltage (GTLREF) should be generated on the system board using high
precision voltage divider circuits. For more details on platform design, see the
applicable platform design guide.
Table 2-13. GTL+ Bus Voltage Definitions
Min
Typ
Max
Units
Notes1
GTLREF pull up resistor
57.6 * 0.99
57.6
57.6 * 1.01
Ω
2
GTLREF_PD
GTLREF pull down resistor
100 * 0.99
100
100 * 1.01
Ω
2
RTT
Termination Resistance
45
50
55
Ω
3
COMP[3:0]
COMP Resistance
49.40
49.90
50.40
Ω
4
COMP8
COMP Resistance
24.65
24.90
25.15
Ω
4
Symbol
GTLREF_PU
Parameter
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
GTLREF is to be generated from VTT by a voltage divider of 1% resistors. If an Variable
GTLREF circuit is used on the board the GTLREF lands connected to the Variable GTLREF
circuit may require different resistor values. Each GTLREF land must be connected, refer to
the platform design guide for implementation details.
3.
RTT is the on-die termination resistance measured at VTT/3 of the GTL+ output driver.
Refer to the appropriate platform design guide for the board impedance. Refer to processor
I/O buffer models for I/V characteristics.
4.
COMP resistance must be provided on the system board with 1% resistors. See the
applicable platform design guide for implementation details. COMP[3:0] and COMP8
resistors are to VSS.
Datasheet
27
Electrical Specifications
2.9
Clock Specifications
2.9.1
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the
processor. As in previous generation processors, the processor’s core frequency is a
multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its
default ratio during manufacturing. The processor supports Half Ratios between 7.5
and 13.5, refer to Table 2-14 for the processor supported ratios.
The processor uses a differential clocking implementation. For more information on the
processor clocking, contact your Intel field representative.
Table 2-14. Core Frequency to FSB Multiplier Configuration
Multiplication of
System Core
Frequency to FSB
Frequency
Core Frequency
(333 MHz BCLK/1333
MHz FSB)
Notes1, 2
1/6
2 GHz
-
1/7
2.33 GHz
-
1/7.5
2.50 GHz
-
1/8
2.66 GHz
-
1/8.5
2.83 GHz
-
1/9
3 GHz
-
1/9.5
3.16 GHz
-
1/10
3.33 GHz
-
1/10.5
3.50 GHz
-
1/11
3.66 GHz
-
1/11.5
3.83 GHz
-
1/12
4 GHz
-
1/12.5
4.16 GHz
-
1/13
4.33 GHz
-
1/13.5
4.50 GHz
-
1/14
4.66 GHz
-
1/15
5 GHz
-
NOTES:
1.
Individual processors operate only at or below the rated frequency.
2.
Listed frequencies are not necessarily committed production frequencies.
2.9.2
FSB Frequency Select Signals (BSEL[2:0])
The BSEL[2:0] signals are used to select the frequency of the processor input clock
(BCLK[1:0]). Table 2-15 defines the possible combinations of the signals and the
frequency associated with each combination. The required frequency is determined by
the processor, chipset, and clock synthesizer. All agents must operate at the same
frequency.
28
Datasheet
Electrical Specifications
The Yorkfield processor will operate at a 1333 MHz FSB frequency (selected by a 333
MHz BCLK[1:0] frequency). Individual processors will only operate at their specified
FSB frequency.
For more information about these signals, refer to Section 4.2 and the appropriate
platform design guidelines.
Table 2-15. BSEL[2:0] Frequency Table for BCLK[1:0]
2.9.3
BSEL2
BSEL1
BSEL0
FSB Frequency
L
L
L
RESERVED
L
L
H
RESERVED
L
H
H
RESERVED
L
H
L
RESERVED
H
H
L
RESERVED
H
H
H
RESERVED
H
L
H
RESERVED
H
L
L
333 MHz
Phase Lock Loop (PLL) and Filter
An on-die PLL filter solution will be implemented on the processor. The VCCPLL input is
used for the PLL. Refer to Table 2-3 for DC specifications. Refer to the appropriate
platform design guidelines for decoupling and routing guidelines.
Datasheet
29
Electrical Specifications
2.9.4
BCLK[1:0] Specifications
Table 2-16. Front Side Bus Differential BCLK Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Figure
Notes1
VL
Input Low Voltage
-0.30
N/A
N/A
V
2-3
3
VH
Input High Voltage
N/A
N/A
1.15
V
2-3
3
VCROSS(abs)
Absolute Crossing
Point
0.300
N/A
0.550
V
2-3
2
∆VCROSS
Range of Crossing
Points
N/A
N/A
0.140
V
2-3
-
VOS
Overshoot
N/A
N/A
1.4
V
2-3
4
VUS
Undershoot
-0.300
N/A
N/A
V
2-3
4
Differential Output
Swing
0.300
N/A
N/A
V
2-4
5
VSWING
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
Crossing voltage is defined as the instantaneous voltage value when the rising edge of
BCLK0 equals the falling edge of BCLK1.
3.
“Steady state” voltage, not including overshoot or undershoot.
4.
Overshoot is defined as the absolute value of the maximum voltage. Undershoot is defined
as the absolute value of the minimum voltage.
5.
Measurement taken from differential waveform.
Table 2-17. FSB Differential Clock Specifications (1333 MHz FSB)
Min
Nom
Max
Unit
Figure
Notes1
BCLK[1:0] Frequency
331.633
-
333.367
MHz
-
7
T1: BCLK[1:0] Period
2.99970
-
3.01538
ns
2-3
2
T# Parameter
-
-
150
ps
2-3
3, 4
T5: BCLK[1:0] Rise and Fall Slew
Rate
T2: BCLK[1:0] Period Stability
2.5
-
8
V/ns
2-4
5
Slew Rate Matching
N/A
N/A
20
%
-
6
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor core
frequencies based on a 333 MHz BCLK[1:0].
2.
The period specified here is the average period. A given period may vary from this
specification as governed by the period stability specification (T2). Min period specification
is based on -300 PPM deviation from a 3 ns period. Max period specification is based on
the summation of +300 PPM deviation from a 3 ns period and a +0.5% maximum variance
due to spread spectrum clocking.
3.
For the clock jitter specification, refer to the CK505 Clock Synthesizer Specification.
4.
In this context, period stability is defined as the worst case timing difference between
successive crossover voltages. In other words, the largest absolute difference between
adjacent clock periods must be less than the period stability.
5.
Slew rate is measured through the VSWING voltage range centered about differential zero.
Measurement taken from differential waveform.
6.
Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is
measured using a ±75mV window centered on the average cross point where Clock rising
meets Clock# falling. The median cross point is used to calculate the voltage thresholds
the oscilloscope is to use for the edge rate calculations.
30
Datasheet
Electrical Specifications
7.
Duty Cycle (High time/Period) must be between 40 and 60%
.
Figure 2-3.
Differential Clock Waveform
Tph
Overshoot
BCLK1
VH
Rising Edge
Ringback
V CROSS (ABS)
Threshold
Region
V CROSS (ABS)
Ringback
Margin
Falling Edge
Ringback
BCLK0
VL
Undershoot
Tpl
Tp
Tp = T1: BCLK[1:0] period
T2: BCLK[1:0] period stability (not shown)
Tph = T3: BCLK[1:0] pulse high time
Tpl = T4: BCLK[1:0] pulse low time
T5: BCLK[1:0] rise time through the threshold region
T6: BCLK[1:0] fall time through the threshold region
Figure 2-4.
Measurement Points for Differential Clock Waveforms
Slew_rise
Slew _fall
+150 mV
+150mV
0.0V
V_swing
-150 mV
0.0V
-150mV
Diff
T5 = BCLK[1:0] rise and fall time through the swing region
§
Datasheet
31
Electrical Specifications
32
Datasheet
Package Mechanical Specifications
3
Package Mechanical
Specifications
3.1
Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA8) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch
of the processor package components and how they are assembled together. Refer to
the LGA775 Socket Mechanical Design Guide for complete details on the LGA775
socket.
The package components shown in Figure 3-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 3-1.
Processor Package Assembly Sketch
IHS
Core (die)
TIM
Substrate
Capacitors
LGA775 Socket
System Board
NOTE:
1.
Socket and motherboard are included for reference and are not part of processor package.
Datasheet
33
Package Mechanical Specifications
3.1.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm [in].
7. Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal/Mechanical
Design Guidelines.
34
Datasheet
Package Mechanical Specifications
Figure 3-2.
Processor Package Drawing Sheet 1 of 3
Datasheet
35
Package Mechanical Specifications
Figure 3-3.
36
Processor Package Drawing Sheet 2 of 3
Datasheet
Package Mechanical Specifications
Figure 3-4.
Processor Package Drawing Sheet 3 of 3
Datasheet
37
Package Mechanical Specifications
3.1.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See Figure 3-2 and Figure 3-3 for keepout zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
3.1.3
Package Loading Specifications
Table 3-1 provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solutions.
.
Table 3-1.
Processor Loading Specifications
Parameter
Minimum
Maximum
Notes
Static
80 N [17 lbf]
311 N [70 lbf]
1, 2, 3
Dynamic
-
756 N [170 lbf]
1, 3, 4
NOTES:
1.
These specifications apply to uniform compressive loading in a direction normal to the
processor IHS.
2.
This is the maximum force that can be applied by a heatsink retention clip. The clip must
also provide the minimum specified load on the processor package.
3.
These specifications are based on limited testing for design characterization. Loading limits
are for the package only and do not include the limits of the processor socket.
4.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static
load requirement.
3.1.4
Package Handling Guidelines
Table 3-2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
311 N [70 lbf]
1, 4
Tensile
111 N [25 lbf]
2, 4
Torque
3.95 N-m [35 lbf-in]
3, 4
NOTES:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top
surface.
2.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the
IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal
to the IHS top surface.
38
Datasheet
Package Mechanical Specifications
4.
3.1.5
These guidelines are based on limited testing for design characterization.
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.1.6
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.1.7
Processor Materials
Table 3-3 lists some of the package components and associated materials.
Table 3-3.
3.1.8
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Lands
Gold Plated Copper
Processor Markings
Figure 3-5 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Figure 3-5.
Processor Top-Side Markings Example
INTEL M ©'06 3360
INTEL® XEON®
SLxxx [COO]
2.83GHZ/12M/1333/05A
[FPO] e4
ATPO
S/N
Datasheet
39
Package Mechanical Specifications
3.1.9
Processor Land Coordinates
Figure 3-6 shows the top view of the processor land coordinates. The coordinates are
referred to throughout the document to identify processor lands.
.
Figure 3-6.
Processor Land Coordinates and Quadrants, Top View
VCC / VSS
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
8
7
6
5
4
3
2
1
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Socket 775
Quadrants
Top View
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
VTT / Clocks
8
7
6
5
4
3
2
Address/
Common Clock/
Async
1
Data
§
40
Datasheet
Land Listing and Signal Descriptions
4
Land Listing and Signal
Descriptions
This chapter provides the processor land assignment and signal descriptions.
4.1
Processor Land Assignments
This section contains the land listings for the processor. The land-out footprint is shown
in Figure 4-1 and Figure 4-2. These figures represent the land-out arranged by land
number and they show the physical location of each signal on the package land array
(top view). Table 4-1 is a listing of all processor lands ordered alphabetically by land
(signal) name. Table 4-2 is also a listing of all processor lands; the ordering is by land
number.
Datasheet
41
Land Listing and Signal Descriptions
Figure 4-1.land-out Diagram (Top View – Left Side)
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
VCC
AM
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
VCC
AN
AL
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
VCC
AK
VSS
VSS
VSS
VSS
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
VCC
AJ
VSS
VSS
VSS
VSS
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
VCC
AH
VCC
VCC
VCC
VCC
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
VCC
AG
VCC
VCC
VCC
VCC
VCC
VCC
VSS
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
VCC
AF
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
VCC
AE
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VCC
VCC
VCC
VSS
VCC
VCC
VSS
VSS
VCC
AD
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
AC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
AB
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
AA
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
Y
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
W
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
V
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
U
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
T
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
R
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
P
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
N
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
M
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
L
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
K
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
FC34
FC31
VCC
BSEL1
FC15
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
FC33
FC32
BSEL2
BSEL0
BCLK1
D47#
D44#
D35#
D36#
D32#
D31#
F
RSVD
BCLK0 VTT_SEL TESTHI0 TESTHI2 TESTHI7
RSVD
VSS
D43#
D41#
VSS
D38#
D37#
VSS
D30#
E
FC26
VSS
VSS
VSS
VSS
FC10
RSVD
D45#
D42#
VSS
D40#
D39#
VSS
D34#
D33#
VTT
VTT
VTT
VTT
VTT
VSS
VCCPLL
D46#
VSS
D48#
DBI2#
VSS
D49#
RSVD
VSS
VSS
D58#
DBI3#
VSS
D54#
DSTBP3#
VSS
D51#
J
H
G
D
42
VTT
TESTHI4 TESTHI5 TESTHI3 TESTHI6 RESET#
DSTBN2# DSTBP2#
C
VTT
VTT
VTT
VTT
VTT
VTT
VSS
VCCIO
PLL
B
VTT
VTT
VTT
VTT
VTT
VTT
VSS
VSSA
D63#
D59#
VSS
D60#
D57#
VSS
D55#
D53#
A
VTT
VTT
VTT
VTT
VTT
VTT
FC23
VCCA
D62#
VSS
RSVD
D61#
VSS
D56#
DSTBN3#
VSS
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Datasheet
Land Listing and Signal Descriptions
Figure 4-2.land-out Diagram (Top View – Right Side)
14
13
12
11
10
9
8
7
6
5
VID_SEL
VSS_MB_
VCC_MB_
ECT
REGULATION REGULATION
4
3
2
1
VSS_
SENSE
VCC_
SENSE
VSS
VSS
AN
VID2
VID0
VCC
VSS
VCC
VCC
VSS
VCC
VCC
VCC
VSS
VCC
VCC
VSS
VCC
VCC
VID7
FC40
VID6
VSS
VCC
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VID3
VID1
VID5
VCC
VSS
VCC
VCC
VSS
VCC
VCC
VSS
FC8
VSS
VID4
ITP_CLK0
VCC
VSS
VCC
VCC
VSS
VCC
VCC
VSS
A35#
A34#
VSS
ITP_CLK1
VCC
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
A33#
A32#
VSS
VCC
VSS
VCC
VCC
VSS
VCC
VCC
VSS
A29#
A31#
A30#
VCC
VSS
VCC
VCC
VSS
VCC
VCC
VSS
VSS
A27#
A28#
VCC
VSS
VCC
VCC
VSS
VCC
SKTOCC#
VSS
RSVD
VSS
RSVD
VCC
VSS
A22#
ADSTB1#
VSS
VCC
VSS
VSS
A25#
RSVD
VCC
VSS
A17#
A24#
A26#
VSS
AM
FC25
AL
VSS
FC24
AK
BPM0#
BPM1#
AJ
RSVD
VSS
AH
BPM5#
BPM3#
TRST#
AG
VSS
BPM4#
TDO
AF
FC18
VSS
TCK
AE
FC36
BPM2#
TDI
AD
VSS
DBR#
TMS
AC
FC37
IERR#
VSS
AB
AA
VRDSEL PROCHOT#
VCC
VSS
VSS
A23#
A21#
VSS
FC39
VTT_OUT_
RIGHT
VCC
VSS
A19#
VSS
A20#
PSI#
VSS
FC0/BOOTSELECT
Y
VCC
VSS
A18#
A16#
VSS
TESTHI1
TDI_M
MSID0
W
VCC
VSS
VSS
A14#
A15#
VSS
RSVD
MSID1
V
VCC
VSS
A10#
A12#
A13#
FC30
FC29
TDO_M
U
VCC
VSS
VSS
A9#
A11#
VSS
FC4
COMP1
T
VCC
VSS
ADSTB0#
VSS
A8#
FERR#/
PBE#
VSS
COMP3
R
VCC
VSS
A4#
RSVD
VSS
INIT#
SMI#
TESTHI11
P
VCC
VSS
VSS
RSVD
RSVD
VSS
IGNNE#
PWRGOOD
N
VSS
M
LINT1
L
VCC
VSS
REQ2#
A5#
A7#
STPCLK#
THERMTRIP#
VCC
VSS
VSS
A3#
A6#
VSS
TESTHI13
VCC
VSS
REQ3#
VSS
REQ0#
A20M#
VSS
LINT0
K
J
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VSS
REQ4#
REQ1#
VSS
FC22
FC3
VTT_OUT_
LEFT
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
TESTHI10
FC35
VSS
GTLREF1
GTLREF0
D29#
D27#
DSTBN1#
DBI1# GTLREF3
D16#
BPRI#
DEFER#
RSVD
PECI
BPMb2#
BPMb3#
COMP2
BPMb0#
D28#
VSS
D24#
D23#
VSS
D18#
D17#
VSS
FC21
RS1#
VSS
BR0#
GTLREF2
VSS
D26#
DSTBP1#
VSS
D21#
D19#
VSS
RSVD
RSVD
FC20
HITM#
TRDY#
VSS
D25#
VSS
D15#
D22#
VSS
D12#
D20#
VSS
VSS
HIT#
VSS
ADS#
RSVD
D52#
VSS
D14#
D11#
VSS
BPMb1# DSTBN0#
VSS
D3#
D1#
VSS
LOCK#
BNR#
DRDY#
VSS
VSS
COMP8
D13#
VSS
D10#
DSTBP0#
VSS
D6#
D5#
VSS
D0#
RS0#
DBSY#
COMP0
VSS
D9#
D8#
VSS
DBI0#
D7#
VSS
D4#
D2#
RS2#
VSS
14
13
12
11
10
9
8
7
6
5
4
3
2
G
F
RSVD
D50#
H
E
D
C
B
A
1
Datasheet
43
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
44
Table 4-1.
Signal Buffer
Type
Direction
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
Direction
A10#
U6
Source Synch
Input/Output
BNR#
C2
Common Clock
Input/Output
A11#
T4
Source Synch
Input/Output
BPM0#
AJ2
Common Clock
Input/Output
A12#
U5
Source Synch
Input/Output
BPM1#
AJ1
Common Clock
Input/Output
A13#
U4
Source Synch
Input/Output
BPM2#
AD2
Common Clock
Input/Output
A14#
V5
Source Synch
Input/Output
BPM3#
AG2
Common Clock
Input/Output
A15#
V4
Source Synch
Input/Output
BPM4#
AF2
Common Clock
Input/Output
A16#
W5
Source Synch
Input/Output
BPM5#
AG3
Common Clock
Input/Output
A17#
AB6
Source Synch
Input/Output
BPMb0#
G1
Common Clock
Input/Output
A18#
W6
Source Synch
Input/Output
BPMb1#
C9
Common Clock
Input/Output
A19#
Y6
Source Synch
Input/Output
BPMb2#
G4
Common Clock
Input/Output
A20#
Y4
Source Synch
Input/Output
BPMb3#
G3
Common Clock
Input/Output
A20M#
K3
Asynch CMOS
Input
BPRI#
G8
Common Clock
Input
A21#
AA4
Source Synch
Input/Output
BR0#
F3
Common Clock
Input/Output
A22#
AD6
Source Synch
Input/Output
BSEL0
G29
Asynch CMOS
Output
A23#
AA5
Source Synch
Input/Output
BSEL1
H30
Asynch CMOS
Output
A24#
AB5
Source Synch
Input/Output
BSEL2
G30
Asynch CMOS
Output
A25#
AC5
Source Synch
Input/Output
COMP0
A13
Power/Other
Input
A26#
AB4
Source Synch
Input/Output
COMP1
T1
Power/Other
Input
A27#
AF5
Source Synch
Input/Output
COMP2
G2
Power/Other
Input
A28#
AF4
Source Synch
Input/Output
COMP3
R1
Power/Other
Input
A29#
AG6
Source Synch
Input/Output
COMP8
B13
Power/Other
Input
A3#
L5
Source Synch
Input/Output
D0#
B4
Source Synch
Input/Output
A30#
AG4
Source Synch
Input/Output
D1#
C5
Source Synch
Input/Output
A31#
AG5
Source Synch
Input/Output
D10#
B10
Source Synch
Input/Output
A32#
AH4
Source Synch
Input/Output
D11#
C11
Source Synch
Input/Output
A33#
AH5
Source Synch
Input/Output
D12#
D8
Source Synch
Input/Output
A34#
AJ5
Source Synch
Input/Output
D13#
B12
Source Synch
Input/Output
A35#
AJ6
Source Synch
Input/Output
D14#
C12
Source Synch
Input/Output
A4#
P6
Source Synch
Input/Output
D15#
D11
Source Synch
Input/Output
A5#
M5
Source Synch
Input/Output
D16#
G9
Source Synch
Input/Output
A6#
L4
Source Synch
Input/Output
D17#
F8
Source Synch
Input/Output
A7#
M4
Source Synch
Input/Output
D18#
F9
Source Synch
Input/Output
A8#
R4
Source Synch
Input/Output
D19#
E9
Source Synch
Input/Output
A9#
T5
Source Synch
Input/Output
D2#
A4
Source Synch
Input/Output
ADS#
D2
Common Clock
Input/Output
D20#
D7
Source Synch
Input/Output
ADSTB0#
R6
Source Synch
Input/Output
D21#
E10
Source Synch
Input/Output
ADSTB1#
AD5
Source Synch
Input/Output
D22#
D10
Source Synch
Input/Output
BCLK0
F28
Clock
Input
D23#
F11
Source Synch
Input/Output
BCLK1
G28
Clock
Input
D24#
F12
Source Synch
Input/Output
Datasheet
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
D25#
D13
Table 4-1.
Signal Buffer
Type
Direction
Source Synch
Input/Output
D60#
Alphabetical Land
Assignments
Signal Buffer
Type
Direction
B19
Source Synch
Input/Output
Land Name Land #
D26#
E13
Source Synch
Input/Output
D61#
A19
Source Synch
Input/Output
D27#
G13
Source Synch
Input/Output
D62#
A22
Source Synch
Input/Output
D28#
F14
Source Synch
Input/Output
D63#
B22
Source Synch
Input/Output
D29#
G14
Source Synch
Input/Output
D7#
A7
Source Synch
Input/Output
D3#
C6
Source Synch
Input/Output
D8#
A10
Source Synch
Input/Output
D30#
F15
Source Synch
Input/Output
D9#
A11
Source Synch
Input/Output
D31#
G15
Source Synch
Input/Output
DBI0#
A8
Source Synch
Input/Output
D32#
G16
Source Synch
Input/Output
DBI1#
G11
Source Synch
Input/Output
D33#
E15
Source Synch
Input/Output
DBI2#
D19
Source Synch
Input/Output
D34#
E16
Source Synch
Input/Output
DBI3#
C20
Source Synch
Input/Output
D35#
G18
Source Synch
Input/Output
DBR#
AC2
Power/Other
Output
D36#
G17
Source Synch
Input/Output
DBSY#
B2
Common Clock
Input/Output
D37#
F17
Source Synch
Input/Output
DEFER#
G7
Common Clock
Input
D38#
F18
Source Synch
Input/Output
DRDY#
C1
Common Clock
Input/Output
D39#
E18
Source Synch
Input/Output
DSTBN0#
C8
Source Synch
Input/Output
D4#
A5
Source Synch
Input/Output
DSTBN1#
G12
Source Synch
Input/Output
D40#
E19
Source Synch
Input/Output
DSTBN2#
G20
Source Synch
Input/Output
D41#
F20
Source Synch
Input/Output
DSTBN3#
A16
Source Synch
Input/Output
D42#
E21
Source Synch
Input/Output
DSTBP0#
B9
Source Synch
Input/Output
D43#
F21
Source Synch
Input/Output
DSTBP1#
E12
Source Synch
Input/Output
D44#
G21
Source Synch
Input/Output
DSTBP2#
G19
Source Synch
Input/Output
D45#
E22
Source Synch
Input/Output
DSTBP3#
C17
Source Synch
Input/Output
D46#
D22
Source Synch
Input/Output
Power/Other
G22
Source Synch
Input/Output
FC0/
BOOTSELECT
Y1
D47#
D48#
D20
Source Synch
Input/Output
FC10
E24
Power/Other
D49#
D17
Source Synch
Input/Output
FC15
H29
Power/Other
D5#
B6
Source Synch
Input/Output
FC17
Y3
Power/Other
D50#
A14
Source Synch
Input/Output
FC18
AE3
Power/Other
D51#
C15
Source Synch
Input/Output
FC20
E5
Power/Other
D52#
C14
Source Synch
Input/Output
FC21
F6
Power/Other
D53#
B15
Source Synch
Input/Output
FC22
J3
Power/Other
D54#
C18
Source Synch
Input/Output
D55#
B16
Source Synch
Input/Output
D56#
A17
Source Synch
Input/Output
D57#
B18
Source Synch
Input/Output
D58#
C21
Source Synch
Input/Output
D59#
B21
Source Synch
Input/Output
D6#
B7
Source Synch
Input/Output
FC23
A24
Power/Other
FC24
AK1
Power/Other
FC25
AL1
Power/Other
FC26
E29
Power/Other
FC29
U2
Power/Other
FC3
J2
Power/Other
FC30
U3
Power/Other
FC31
J16
Power/Other
Datasheet
45
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
46
Signal Buffer
Type
Table 4-1.
Direction
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
Direction
FC32
H15
Power/Other
RESERVED
AE6
FC33
H16
Power/Other
RESERVED
AH2
FC34
J17
Power/Other
RESERVED
D1
FC35
H4
Power/Other
RESERVED
D14
FC36
AD3
Power/Other
RESERVED
D16
FC37
AB3
Power/Other
RESERVED
E23
FC39
AA2
Power/Other
RESERVED
E6
FC4
T2
Power/Other
RESERVED
E7
FC40
AM6
Power/Other
RESERVED
F23
FC8
AK6
Power/Other
RESERVED
F29
FERR#/PBE#
R3
Asynch CMOS
Output
RESERVED
G6
GTLREF0
H1
Power/Other
Input
RESERVED
N4
GTLREF1
H2
Power/Other
Input
RESERVED
N5
GTLREF2
F2
Power/Other
Input
RESERVED
P5
GTLREF3
G10
Power/Other
Input
RESET#
G23
Common Clock
Input
HIT#
D4
Common Clock
Input/Output
RS0#
B3
Common Clock
Input
HITM#
E4
Common Clock
Input/Output
RS1#
F5
Common Clock
Input
IERR#
AB2
Asynch CMOS
Output
RS2#
A3
Common Clock
Input
IGNNE#
N2
Asynch CMOS
Input
SKTOCC#
AE8
Power/Other
Output
INIT#
P3
Asynch CMOS
Input
SMI#
P2
Asynch CMOS
Input
ITP_CLK0
AK3
TAP
Input
STPCLK#
M3
Asynch CMOS
Input
ITP_CLK1
AJ3
TAP
Input
TCK
AE1
TAP
Input
LINT0
K1
Asynch CMOS
Input
TDI
AD1
TAP
Input
LINT1
L1
Asynch CMOS
Input
TDI_M
W2
Power/Other
Input
LOCK#
C3
Common Clock
Input/Output
TDO
AF1
TAP
Output
MSID0
W1
Power/Other
Output
TDO_M
U1
TAP
Output
MSID1
V1
Power/Other
Output
TESTHI0
F26
Power/Other
Input
PECI
G5
Power/Other
Input/Output
TESTHI1
W3
Power/Other
Input
PROCHOT#
AL2
Asynch CMOS
Input/Output
TESTHI10
H5
Power/Other
Input
PWRGOOD
N1
Power/Other
Input
TESTHI11
P1
Power/Other
Input
REQ0#
K4
Source Synch
Input/Output
TESTHI13
L2
Power/Other
Input
REQ1#
J5
Source Synch
Input/Output
TESTHI2
F25
Power/Other
Input
REQ2#
M6
Source Synch
Input/Output
TESTHI3
G25
Power/Other
Input
REQ3#
K6
Source Synch
Input/Output
TESTHI4
G27
Power/Other
Input
REQ4#
J6
Source Synch
Input/Output
TESTHI5
G26
Power/Other
Input
RESERVED
V2
TESTHI6
G24
Power/Other
Input
RESERVED
A20
TESTHI7
F24
Power/Other
Input
RESERVED
AC4
THERMTRIP#
M2
Asynch CMOS
Output
RESERVED
AE4
TMS
AC1
TAP
Input
Datasheet
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
Table 4-1.
Alphabetical Land
Assignments
Signal Buffer
Type
Direction
Common Clock
Input
VCC
AF22
Power/Other
Input
Land Name Land #
Signal Buffer
Type
TRDY#
E3
TRST#
AG1
TAP
VCC
AF8
Power/Other
VCC
AA8
Power/Other
VCC
AF9
Power/Other
VCC
AB8
Power/Other
VCC
AG11
Power/Other
VCC
AC23
Power/Other
VCC
AG12
Power/Other
VCC
AC24
Power/Other
VCC
AG14
Power/Other
VCC
AC25
Power/Other
VCC
AG15
Power/Other
VCC
AC26
Power/Other
VCC
AG18
Power/Other
VCC
AC27
Power/Other
VCC
AG19
Power/Other
VCC
AC28
Power/Other
VCC
AG21
Power/Other
VCC
AC29
Power/Other
VCC
AG22
Power/Other
VCC
AC30
Power/Other
VCC
AG25
Power/Other
VCC
AC8
Power/Other
VCC
AG26
Power/Other
VCC
AD23
Power/Other
VCC
AG27
Power/Other
VCC
AD24
Power/Other
VCC
AG28
Power/Other
VCC
AD25
Power/Other
VCC
AG29
Power/Other
VCC
AD26
Power/Other
VCC
AG30
Power/Other
VCC
AD27
Power/Other
VCC
AG8
Power/Other
VCC
AD28
Power/Other
VCC
AG9
Power/Other
VCC
AD29
Power/Other
VCC
AH11
Power/Other
VCC
AD30
Power/Other
VCC
AH12
Power/Other
VCC
AD8
Power/Other
VCC
AH14
Power/Other
VCC
AE11
Power/Other
VCC
AH15
Power/Other
VCC
AE12
Power/Other
VCC
AH18
Power/Other
VCC
AE14
Power/Other
VCC
AH19
Power/Other
VCC
AE15
Power/Other
VCC
AH21
Power/Other
VCC
AE18
Power/Other
VCC
AH22
Power/Other
VCC
AE19
Power/Other
VCC
AH25
Power/Other
VCC
AE21
Power/Other
VCC
AH26
Power/Other
VCC
AE22
Power/Other
VCC
AH27
Power/Other
VCC
AE23
Power/Other
VCC
AH28
Power/Other
VCC
AE9
Power/Other
VCC
AH29
Power/Other
VCC
AF11
Power/Other
VCC
AH30
Power/Other
VCC
AF12
Power/Other
VCC
AH8
Power/Other
VCC
AF14
Power/Other
VCC
AH9
Power/Other
VCC
AF15
Power/Other
VCC
AJ11
Power/Other
VCC
AF18
Power/Other
VCC
AJ12
Power/Other
VCC
AF19
Power/Other
VCC
AJ14
Power/Other
VCC
AF21
Power/Other
VCC
AJ15
Power/Other
Direction
Datasheet
47
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
48
Signal Buffer
Type
Table 4-1.
Direction
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
VCC
AJ18
Power/Other
VCC
AM19
Power/Other
VCC
AJ19
Power/Other
VCC
AM21
Power/Other
VCC
AJ21
Power/Other
VCC
AM22
Power/Other
VCC
AJ22
Power/Other
VCC
AM25
Power/Other
VCC
AJ25
Power/Other
VCC
AM26
Power/Other
VCC
AJ26
Power/Other
VCC
AM29
Power/Other
VCC
AJ8
Power/Other
VCC
AM30
Power/Other
VCC
AJ9
Power/Other
VCC
AM8
Power/Other
VCC
AK11
Power/Other
VCC
AM9
Power/Other
VCC
AK12
Power/Other
VCC
AN11
Power/Other
VCC
AK14
Power/Other
VCC
AN12
Power/Other
VCC
AK15
Power/Other
VCC
AN14
Power/Other
VCC
AK18
Power/Other
VCC
AN15
Power/Other
VCC
AK19
Power/Other
VCC
AN18
Power/Other
VCC
AK21
Power/Other
VCC
AN19
Power/Other
VCC
AK22
Power/Other
VCC
AN21
Power/Other
VCC
AK25
Power/Other
VCC
AN22
Power/Other
VCC
AK26
Power/Other
VCC
AN25
Power/Other
VCC
AK8
Power/Other
VCC
AN26
Power/Other
VCC
AK9
Power/Other
VCC
AN29
Power/Other
VCC
AL11
Power/Other
VCC
AN30
Power/Other
VCC
AL12
Power/Other
VCC
AN8
Power/Other
VCC
AL14
Power/Other
VCC
AN9
Power/Other
VCC
AL15
Power/Other
VCC
J10
Power/Other
VCC
AL18
Power/Other
VCC
J11
Power/Other
VCC
AL19
Power/Other
VCC
J12
Power/Other
VCC
AL21
Power/Other
VCC
J13
Power/Other
VCC
AL22
Power/Other
VCC
J14
Power/Other
VCC
AL25
Power/Other
VCC
J15
Power/Other
VCC
AL26
Power/Other
VCC
J18
Power/Other
VCC
AL29
Power/Other
VCC
J19
Power/Other
VCC
AL30
Power/Other
VCC
J20
Power/Other
VCC
AL8
Power/Other
VCC
J21
Power/Other
VCC
AL9
Power/Other
VCC
J22
Power/Other
VCC
AM11
Power/Other
VCC
J23
Power/Other
VCC
AM12
Power/Other
VCC
J24
Power/Other
VCC
AM14
Power/Other
VCC
J25
Power/Other
VCC
AM15
Power/Other
VCC
J26
Power/Other
VCC
AM18
Power/Other
VCC
J27
Power/Other
Direction
Datasheet
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
Table 4-1.
Direction
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
Direction
VCC
J28
Power/Other
VCC
T27
Power/Other
VCC
J29
Power/Other
VCC
T28
Power/Other
VCC
J30
Power/Other
VCC
T29
Power/Other
VCC
J8
Power/Other
VCC
T30
Power/Other
VCC
J9
Power/Other
VCC
T8
Power/Other
VCC
K23
Power/Other
VCC
U23
Power/Other
VCC
K24
Power/Other
VCC
U24
Power/Other
VCC
K25
Power/Other
VCC
U25
Power/Other
VCC
K26
Power/Other
VCC
U26
Power/Other
VCC
K27
Power/Other
VCC
U27
Power/Other
VCC
K28
Power/Other
VCC
U28
Power/Other
VCC
K29
Power/Other
VCC
U29
Power/Other
VCC
K30
Power/Other
VCC
U30
Power/Other
VCC
K8
Power/Other
VCC
U8
Power/Other
VCC
L8
Power/Other
VCC
V8
Power/Other
VCC
M23
Power/Other
VCC
W23
Power/Other
VCC
M24
Power/Other
VCC
W24
Power/Other
VCC
M25
Power/Other
VCC
W25
Power/Other
VCC
M26
Power/Other
VCC
W26
Power/Other
VCC
M27
Power/Other
VCC
W27
Power/Other
VCC
M28
Power/Other
VCC
W28
Power/Other
VCC
M29
Power/Other
VCC
W29
Power/Other
VCC
M30
Power/Other
VCC
W30
Power/Other
VCC
M8
Power/Other
VCC
W8
Power/Other
VCC
N23
Power/Other
VCC
Y23
Power/Other
VCC
N24
Power/Other
VCC
Y24
Power/Other
VCC
N25
Power/Other
VCC
Y25
Power/Other
VCC
N26
Power/Other
VCC
Y26
Power/Other
VCC
N27
Power/Other
VCC
Y27
Power/Other
VCC
N28
Power/Other
VCC
Y28
Power/Other
VCC
N29
Power/Other
VCC
Y29
Power/Other
VCC
N30
Power/Other
VCC
Y30
Power/Other
VCC
N8
Power/Other
VCC
Y8
Power/Other
VCC_MB_
REGULATION
AN5
Power/Other
Output
VCC_SENSE
AN3
Power/Other
Output
VCCA
A23
Power/Other
VCCIOPLL
C23
Power/Other
VCCPLL
D23
Power/Other
VID_SELECT
AN7
Power/Other
VCC
P8
Power/Other
VCC
R8
Power/Other
VCC
T23
Power/Other
VCC
T24
Power/Other
VCC
T25
Power/Other
VCC
T26
Power/Other
Output
Datasheet
49
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
50
Signal Buffer
Type
Table 4-1.
Direction
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
VID0
AM2
Asynch CMOS
Output
VSS
AB26
Power/Other
VID1
AL5
Asynch CMOS
Output
VSS
AB27
Power/Other
VID2
AM3
Asynch CMOS
Output
VSS
AB28
Power/Other
VID3
AL6
Asynch CMOS
Output
VSS
AB29
Power/Other
VID4
AK4
Asynch CMOS
Output
VSS
AB30
Power/Other
VID5
AL4
Asynch CMOS
Output
VSS
AB7
Power/Other
VID6
AM5
Asynch CMOS
Output
VSS
AC3
Power/Other
VID7
AM7
Asynch CMOS
Output
VSS
AC6
Power/Other
VRDSEL
AL3
Power/Other
VSS
AC7
Power/Other
VSS
B1
Power/Other
VSS
AD4
Power/Other
VSS
B11
Power/Other
VSS
AD7
Power/Other
VSS
B14
Power/Other
VSS
AE10
Power/Other
VSS
B17
Power/Other
VSS
AE13
Power/Other
VSS
B20
Power/Other
VSS
AE16
Power/Other
VSS
B24
Power/Other
VSS
AE17
Power/Other
VSS
B5
Power/Other
VSS
AE2
Power/Other
VSS
B8
Power/Other
VSS
AE20
Power/Other
VSS
A12
Power/Other
VSS
AE24
Power/Other
VSS
A15
Power/Other
VSS
AE25
Power/Other
VSS
A18
Power/Other
VSS
AE26
Power/Other
VSS
A2
Power/Other
VSS
AE27
Power/Other
VSS
A21
Power/Other
VSS
AE28
Power/Other
VSS
A6
Power/Other
VSS
AE29
Power/Other
VSS
A9
Power/Other
VSS
AE30
Power/Other
VSS
AA23
Power/Other
VSS
AE5
Power/Other
VSS
AA24
Power/Other
VSS
AE7
Power/Other
VSS
AA25
Power/Other
VSS
AF10
Power/Other
VSS
AA26
Power/Other
VSS
AF13
Power/Other
VSS
AA27
Power/Other
VSS
AF16
Power/Other
VSS
AA28
Power/Other
VSS
AF17
Power/Other
VSS
AA29
Power/Other
VSS
AF20
Power/Other
VSS
AA3
Power/Other
VSS
AF23
Power/Other
VSS
AA30
Power/Other
VSS
AF24
Power/Other
VSS
AA6
Power/Other
VSS
AF25
Power/Other
VSS
AA7
Power/Other
VSS
AF26
Power/Other
VSS
AB1
Power/Other
VSS
AF27
Power/Other
VSS
AB23
Power/Other
VSS
AF28
Power/Other
VSS
AB24
Power/Other
VSS
AF29
Power/Other
VSS
AB25
Power/Other
VSS
AF3
Power/Other
Direction
Datasheet
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
Table 4-1.
Direction
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
VSS
AF30
Power/Other
VSS
AK2
Power/Other
VSS
AF6
Power/Other
VSS
AK20
Power/Other
VSS
AF7
Power/Other
VSS
AK23
Power/Other
VSS
AG10
Power/Other
VSS
AK24
Power/Other
VSS
AG13
Power/Other
VSS
AK27
Power/Other
VSS
AG16
Power/Other
VSS
AK28
Power/Other
VSS
AG17
Power/Other
VSS
AK29
Power/Other
VSS
AG20
Power/Other
VSS
AK30
Power/Other
VSS
AG23
Power/Other
VSS
AK5
Power/Other
VSS
AG24
Power/Other
VSS
AK7
Power/Other
VSS
AG7
Power/Other
VSS
AL10
Power/Other
VSS
AH1
Power/Other
VSS
AL13
Power/Other
VSS
AH10
Power/Other
VSS
AL16
Power/Other
VSS
AH13
Power/Other
VSS
AL17
Power/Other
VSS
AH16
Power/Other
VSS
AL20
Power/Other
VSS
AH17
Power/Other
VSS
AL23
Power/Other
VSS
AH20
Power/Other
VSS
AL24
Power/Other
VSS
AH23
Power/Other
VSS
AL27
Power/Other
VSS
AH24
Power/Other
VSS
AL28
Power/Other
VSS
AH3
Power/Other
VSS
AL7
Power/Other
VSS
AH6
Power/Other
VSS
AM1
Power/Other
VSS
AH7
Power/Other
VSS
AM10
Power/Other
VSS
AJ10
Power/Other
VSS
AM13
Power/Other
VSS
AJ13
Power/Other
VSS
AM16
Power/Other
VSS
AJ16
Power/Other
VSS
AM17
Power/Other
VSS
AJ17
Power/Other
VSS
AM20
Power/Other
VSS
AJ20
Power/Other
VSS
AM23
Power/Other
VSS
AJ23
Power/Other
VSS
AM24
Power/Other
VSS
AJ24
Power/Other
VSS
AM27
Power/Other
VSS
AJ27
Power/Other
VSS
AM28
Power/Other
VSS
AJ28
Power/Other
VSS
AM4
Power/Other
VSS
AJ29
Power/Other
VSS
AN1
Power/Other
VSS
AJ30
Power/Other
VSS
AN10
Power/Other
VSS
AJ4
Power/Other
VSS
AN13
Power/Other
VSS
AJ7
Power/Other
VSS
AN16
Power/Other
VSS
AK10
Power/Other
VSS
AN17
Power/Other
VSS
AK13
Power/Other
VSS
AN2
Power/Other
VSS
AK16
Power/Other
VSS
AN20
Power/Other
VSS
AK17
Power/Other
VSS
AN23
Power/Other
Direction
Datasheet
51
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
52
Signal Buffer
Type
Table 4-1.
Direction
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
VSS
AN24
Power/Other
VSS
H12
Power/Other
VSS
AN27
Power/Other
VSS
H13
Power/Other
VSS
AN28
Power/Other
VSS
H14
Power/Other
VSS
C10
Power/Other
VSS
H17
Power/Other
VSS
C13
Power/Other
VSS
H18
Power/Other
VSS
C16
Power/Other
VSS
H19
Power/Other
VSS
C19
Power/Other
VSS
H20
Power/Other
VSS
C22
Power/Other
VSS
H21
Power/Other
VSS
C24
Power/Other
VSS
H22
Power/Other
VSS
C4
Power/Other
VSS
H23
Power/Other
VSS
C7
Power/Other
VSS
H24
Power/Other
VSS
D12
Power/Other
VSS
H25
Power/Other
VSS
D15
Power/Other
VSS
H26
Power/Other
VSS
D18
Power/Other
VSS
H27
Power/Other
VSS
D21
Power/Other
VSS
H28
Power/Other
VSS
D24
Power/Other
VSS
H3
Power/Other
VSS
D3
Power/Other
VSS
H6
Power/Other
VSS
D5
Power/Other
VSS
H7
Power/Other
VSS
D6
Power/Other
VSS
H8
Power/Other
VSS
D9
Power/Other
VSS
H9
Power/Other
VSS
E11
Power/Other
VSS
J4
Power/Other
VSS
E14
Power/Other
VSS
J7
Power/Other
VSS
E17
Power/Other
VSS
K2
Power/Other
VSS
E2
Power/Other
VSS
K5
Power/Other
VSS
E20
Power/Other
VSS
K7
Power/Other
VSS
E25
Power/Other
VSS
L23
Power/Other
VSS
E26
Power/Other
VSS
L24
Power/Other
VSS
E27
Power/Other
VSS
L25
Power/Other
VSS
E28
Power/Other
VSS
L26
Power/Other
VSS
E8
Power/Other
VSS
L27
Power/Other
VSS
F10
Power/Other
VSS
L28
Power/Other
VSS
F13
Power/Other
VSS
L29
Power/Other
VSS
F16
Power/Other
VSS
L3
Power/Other
VSS
F19
Power/Other
VSS
L30
Power/Other
VSS
F22
Power/Other
VSS
L6
Power/Other
VSS
F4
Power/Other
VSS
L7
Power/Other
VSS
F7
Power/Other
VSS
M1
Power/Other
VSS
H10
Power/Other
VSS
M7
Power/Other
VSS
H11
Power/Other
VSS
N3
Power/Other
Direction
Datasheet
Land Listing and Signal Descriptions
Table 4-1.
Alphabetical Land
Assignments
Land Name Land #
VSS
N6
Signal Buffer
Type
Table 4-1.
Direction
Alphabetical Land
Assignments
Land Name Land #
Signal Buffer
Type
Power/Other
VSS
W7
Power/Other
Direction
VSS
N7
Power/Other
VSS
Y2
Power/Other
VSS
P23
Power/Other
VSS
Y5
Power/Other
VSS
P24
Power/Other
VSS
Y7
Power/Other
VSS
P25
Power/Other
AN6
Power/Other
Output
VSS
P26
Power/Other
VSS_MB_
REGULATION
VSS
P27
Power/Other
VSS_SENSE
AN4
Power/Other
Output
VSS
P28
Power/Other
VSSA
B23
Power/Other
VSS
P29
Power/Other
VTT
B25
Power/Other
VSS
P30
Power/Other
VTT
B26
Power/Other
VSS
P4
Power/Other
VTT
B27
Power/Other
VSS
P7
Power/Other
VTT
B28
Power/Other
VSS
R2
Power/Other
VTT
B29
Power/Other
VSS
R23
Power/Other
VTT
B30
Power/Other
VSS
R24
Power/Other
VTT
A25
Power/Other
VSS
R25
Power/Other
VTT
A26
Power/Other
VSS
R26
Power/Other
VTT
A27
Power/Other
VSS
R27
Power/Other
VTT
A28
Power/Other
VSS
R28
Power/Other
VTT
A29
Power/Other
VSS
R29
Power/Other
VTT
A30
Power/Other
VSS
R30
Power/Other
VTT
C25
Power/Other
VSS
R5
Power/Other
VTT
C26
Power/Other
VSS
R7
Power/Other
VTT
C27
Power/Other
VSS
T3
Power/Other
VTT
C28
Power/Other
VSS
T6
Power/Other
VTT
C29
Power/Other
VSS
T7
Power/Other
VTT
C30
Power/Other
VSS
U7
Power/Other
VTT
D25
Power/Other
VSS
V23
Power/Other
VTT
D26
Power/Other
VSS
V24
Power/Other
VTT
D27
Power/Other
VSS
V25
Power/Other
VTT
D28
Power/Other
VSS
V26
Power/Other
VTT
D29
Power/Other
VSS
V27
Power/Other
VTT
D30
Power/Other
VSS
V28
Power/Other
VTT_OUT_LE
FT
J1
Power/Other
Output
VSS
V29
Power/Other
VSS
V3
Power/Other
VTT_OUT_RI
GHT
AA1
Power/Other
Output
VSS
V30
Power/Other
VTT_SEL
F27
Power/Other
Output
VSS
V6
Power/Other
VSS
V7
Power/Other
VSS
W4
Power/Other
Datasheet
53
Land Listing and Signal Descriptions
Table 4-2.
54
Numerical Land
Assignment
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
Direction
Land
#
A10
D08#
Source Synch
Input/Output
AA30
VSS
Power/Other
A11
D09#
Source Synch
Input/Output
AA4
A21#
Source Synch
Input/Output
A12
VSS
Power/Other
AA5
A23#
Source Synch
Input/Output
A13
COMP0
Power/Other
Input
AA6
VSS
Power/Other
A14
D50#
Source Synch
Input/Output
AA7
VSS
Power/Other
A15
VSS
Power/Other
AA8
VCC
Power/Other
A16
DSTBN3#
Source Synch
Input/Output
AB1
VSS
Power/Other
A17
D56#
Source Synch
Input/Output
AB2
IERR#
Asynch CMOS
AB23
VSS
Power/Other
AB24
VSS
Power/Other
AB25
VSS
Power/Other
AB26
VSS
Power/Other
AB27
VSS
Power/Other
AB28
VSS
Power/Other
A18
VSS
Power/Other
A19
D61#
Source Synch
A2
VSS
Power/Other
A20
RESERVED
Input/Output
Land Name
Signal Buffer
Type
Direction
Output
A21
VSS
Power/Other
A22
D62#
Source Synch
A23
VCCA
Power/Other
AB29
VSS
Power/Other
A24
FC23
Power/Other
AB3
FC37
Power/Other
A25
VTT
Power/Other
AB30
VSS
Power/Other
A26
VTT
Power/Other
AB4
A26#
Source Synch
Input/Output
A27
VTT
Power/Other
AB5
A24#
Source Synch
Input/Output
A28
VTT
Power/Other
AB6
A17#
Source Synch
Input/Output
A29
VTT
Power/Other
A3
RS2#
Common Clock
Input/Output
Input
AB7
VSS
Power/Other
AB8
VCC
Power/Other
A30
VTT
Power/Other
AC1
TMS
TAP
Input
A4
D02#
Source Synch
Input/Output
AC2
DBR#
Power/Other
Output
A5
D04#
Source Synch
Input/Output
AC23
VCC
Power/Other
A6
VSS
Power/Other
AC24
VCC
Power/Other
A7
D07#
Source Synch
Input/Output
AC25
VCC
Power/Other
A8
DBI0#
Source Synch
Input/Output
AC26
VCC
Power/Other
A9
VSS
Power/Other
AC27
VCC
Power/Other
AA1
VTT_OUT_RI
GHT
Power/Other
AC28
VCC
Power/Other
AA2
FC39
Power/Other
AC29
VCC
Power/Other
AA23
VSS
Power/Other
AC3
VSS
Power/Other
AA24
VSS
Power/Other
AC30
VCC
Power/Other
AA25
VSS
Power/Other
AC4
RESERVED
AA26
VSS
Power/Other
AC5
A25#
Source Synch
AA27
VSS
Power/Other
AC6
VSS
Power/Other
AA28
VSS
Power/Other
AA29
VSS
Power/Other
AA3
VSS
Power/Other
Output
AC7
VSS
Power/Other
AC8
VCC
Power/Other
AD1
TDI
TAP
Input/Output
Input
Datasheet
Land Listing and Signal Descriptions
Table 4-2.
Numerical Land
Assignment
Signal Buffer
Type
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
AD2
BPM2#
AD23
VCC
Power/Other
AE5
VSS
AD24
VCC
Power/Other
AE6
RESERVED
AD25
VCC
Power/Other
AE7
VSS
Power/Other
AD26
VCC
Power/Other
AE8
SKTOCC#
Power/Other
AD27
VCC
Power/Other
AE9
VCC
Power/Other
AD28
VCC
Power/Other
AF1
TDO
TAP
Direction
Common Clock Input/Output
Land
#
Land Name
AE4
RESERVED
Signal Buffer
Type
Power/Other
AD29
VCC
Power/Other
AF10
VSS
Power/Other
AD3
FC36
Power/Other
AF11
VCC
Power/Other
AD30
VCC
Power/Other
AF12
VCC
Power/Other
AD4
VSS
Power/Other
AF13
VSS
Power/Other
AD5
ADSTB1#
Source Synch
Input/Output
AF14
VCC
Power/Other
AD6
A22#
Source Synch
Input/Output
AF15
VCC
Power/Other
AD7
VSS
Power/Other
AF16
VSS
Power/Other
AD8
VCC
Power/Other
AF17
VSS
Power/Other
AF18
VCC
Power/Other
AF19
VCC
Power/Other
Input
Direction
AE1
TCK
TAP
AE10
VSS
Power/Other
AE11
VCC
Power/Other
AF2
BPM4#
AE12
VCC
Power/Other
AF20
VSS
Power/Other
Output
Output
Common Clock Input/Output
AE13
VSS
Power/Other
AF21
VCC
Power/Other
AE14
VCC
Power/Other
AF22
VCC
Power/Other
AE15
VCC
Power/Other
AF23
VSS
Power/Other
AE16
VSS
Power/Other
AF24
VSS
Power/Other
AE17
VSS
Power/Other
AF25
VSS
Power/Other
AE18
VCC
Power/Other
AF26
VSS
Power/Other
AE19
VCC
Power/Other
AF27
VSS
Power/Other
AE2
VSS
Power/Other
AF28
VSS
Power/Other
AE20
VSS
Power/Other
AF29
VSS
Power/Other
AE21
VCC
Power/Other
AF3
VSS
Power/Other
AE22
VCC
Power/Other
AF30
VSS
Power/Other
AE23
VCC
Power/Other
AF4
A28#
Source Synch
Input/Output
AE24
VSS
Power/Other
AF5
A27#
Source Synch
Input/Output
AE25
VSS
Power/Other
AF6
VSS
Power/Other
AE26
VSS
Power/Other
AF7
VSS
Power/Other
AE27
VSS
Power/Other
AF8
VCC
Power/Other
AE28
VSS
Power/Other
AF9
VCC
Power/Other
AE29
VSS
Power/Other
AG1
TRST#
TAP
AE3
FC18
Power/Other
AG10
VSS
Power/Other
AE30
VSS
Power/Other
AG11
VCC
Power/Other
Input
Datasheet
55
Land Listing and Signal Descriptions
Table 4-2.
56
Numerical Land
Assignment
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
AG12
VCC
Power/Other
AH20
VSS
Power/Other
AG13
VSS
Power/Other
AH21
VCC
Power/Other
AG14
VCC
Power/Other
AH22
VCC
Power/Other
AG15
VCC
Power/Other
AH23
VSS
Power/Other
AG16
VSS
Power/Other
AH24
VSS
Power/Other
AG17
VSS
Power/Other
AH25
VCC
Power/Other
AG18
VCC
Power/Other
AH26
VCC
Power/Other
AG19
VCC
Power/Other
AH27
VCC
Power/Other
AH28
VCC
Power/Other
AH29
VCC
Power/Other
Direction
Land Name
Signal Buffer
Type
Direction
AG2
BPM3#
AG20
VSS
Power/Other
AG21
VCC
Power/Other
AH3
VSS
Power/Other
AG22
VCC
Power/Other
AH30
VCC
Power/Other
AG23
VSS
Power/Other
AH4
A32#
Source Synch
Input/Output
AG24
VSS
Power/Other
AH5
A33#
Source Synch
Input/Output
AG25
VCC
Power/Other
AH6
VSS
Power/Other
AG26
VCC
Power/Other
AH7
VSS
Power/Other
AG27
VCC
Power/Other
AH8
VCC
Power/Other
AG28
VCC
Power/Other
AH9
VCC
Power/Other
AG29
VCC
AG3
BPM5#
Common Clock Input/Output
Land
#
Power/Other
Common Clock Input/Output
AJ1
BPM1#
AJ10
VSS
Common Clock Input/Output
Power/Other
AG30
VCC
Power/Other
AJ11
VCC
Power/Other
AG4
A30#
Source Synch
Input/Output
AJ12
VCC
Power/Other
AG5
A31#
Source Synch
Input/Output
AJ13
VSS
Power/Other
AG6
A29#
Source Synch
Input/Output
AJ14
VCC
Power/Other
AG7
VSS
Power/Other
AJ15
VCC
Power/Other
AG8
VCC
Power/Other
AJ16
VSS
Power/Other
AG9
VCC
Power/Other
AJ17
VSS
Power/Other
AH1
VSS
Power/Other
AJ18
VCC
Power/Other
AH10
VSS
Power/Other
AJ19
VCC
AH11
VCC
Power/Other
AJ2
BPM0#
AH12
VCC
Power/Other
AJ20
VSS
Power/Other
AH13
VSS
Power/Other
AJ21
VCC
Power/Other
AH14
VCC
Power/Other
AJ22
VCC
Power/Other
AH15
VCC
Power/Other
AJ23
VSS
Power/Other
AH16
VSS
Power/Other
AJ24
VSS
Power/Other
AH17
VSS
Power/Other
AJ25
VCC
Power/Other
AH18
VCC
Power/Other
AJ26
VCC
Power/Other
AH19
VCC
Power/Other
AJ27
VSS
Power/Other
AH2
RESERVED
AJ28
VSS
Power/Other
Power/Other
Common Clock Input/Output
Datasheet
Land Listing and Signal Descriptions
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
AJ29
VSS
Power/Other
AJ3
ITP_CLK1
TAP
AJ30
VSS
Power/Other
Table 4-2.
Direction
Input
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
AL1
FC25
Power/Other
AL10
VSS
Power/Other
AL11
VCC
Power/Other
AJ4
VSS
Power/Other
AL12
VCC
Power/Other
AJ5
A34#
Source Synch
Input/Output
AL13
VSS
Power/Other
AJ6
A35#
Source Synch
Input/Output
AL14
VCC
Power/Other
AJ7
VSS
Power/Other
AL15
VCC
Power/Other
AJ8
VCC
Power/Other
AL16
VSS
Power/Other
AJ9
VCC
Power/Other
AL17
VSS
Power/Other
AK1
FC24
Power/Other
AL18
VCC
Power/Other
AK10
VSS
Power/Other
AL19
VCC
Power/Other
AK11
VCC
Power/Other
AL2
PROCHOT#
Asynch CMOS
AK12
VCC
Power/Other
AL20
VSS
Power/Other
AK13
VSS
Power/Other
AL21
VCC
Power/Other
AK14
VCC
Power/Other
AL22
VCC
Power/Other
AK15
VCC
Power/Other
AL23
VSS
Power/Other
AK16
VSS
Power/Other
AL24
VSS
Power/Other
AK17
VSS
Power/Other
AL25
VCC
Power/Other
AK18
VCC
Power/Other
AL26
VCC
Power/Other
AK19
VCC
Power/Other
AL27
VSS
Power/Other
AK2
VSS
Power/Other
AL28
VSS
Power/Other
Direction
Input/Output
AK20
VSS
Power/Other
AL29
VCC
Power/Other
AK21
VCC
Power/Other
AL3
VRDSEL
Power/Other
AK22
VCC
Power/Other
AL30
VCC
Power/Other
AK23
VSS
Power/Other
AL4
VID5
Asynch CMOS
Output
AK24
VSS
Power/Other
AL5
VID1
Asynch CMOS
Output
AK25
VCC
Power/Other
AL6
VID3
Asynch CMOS
Output
AK26
VCC
Power/Other
AL7
VSS
Power/Other
AK27
VSS
Power/Other
AL8
VCC
Power/Other
AK28
VSS
Power/Other
AL9
VCC
Power/Other
AK29
VSS
Power/Other
AM1
VSS
Power/Other
AK3
ITP_CLK0
TAP
AK30
VSS
Power/Other
AK4
VID4
Asynch CMOS
AK5
VSS
Power/Other
Input
Output
AM10
VSS
Power/Other
AM11
VCC
Power/Other
AM12
VCC
Power/Other
AM13
VSS
Power/Other
AK6
FC8
Power/Other
AM14
VCC
Power/Other
AK7
VSS
Power/Other
AM15
VCC
Power/Other
AK8
VCC
Power/Other
AM16
VSS
Power/Other
AK9
VCC
Power/Other
AM17
VSS
Power/Other
Datasheet
57
Land Listing and Signal Descriptions
Table 4-2.
58
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
AM18
VCC
AM19
VCC
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
Power/Other
AN26
VCC
Power/Other
Power/Other
AN27
VSS
Power/Other
AM2
VID0
Asynch CMOS
AM20
VSS
Power/Other
AM21
VCC
AM22
VCC
AM23
AM24
Direction
Output
Direction
AN28
VSS
Power/Other
AN29
VCC
Power/Other
Power/Other
AN3
VCC_SENSE
Power/Other
Power/Other
AN30
VCC
Power/Other
VSS
Power/Other
AN4
VSS_SENSE
Power/Other
Output
VSS
Power/Other
AN5
Power/Other
Output
AM25
VCC
Power/Other
VCC_MB_
REGULATION
AM26
VCC
Power/Other
AN6
VSS_MB_
REGULATION
Power/Other
Output
AM27
VSS
Power/Other
AN7
VID_SELECT
Power/Other
Output
AM28
VSS
Power/Other
AN8
VCC
Power/Other
AM29
VCC
Power/Other
AN9
VCC
Power/Other
AM3
VID2
Asynch CMOS
AM30
VCC
Power/Other
AM4
VSS
Power/Other
AM5
VID6
Asynch CMOS
AM6
FC40
Power/Other
AM7
VID7
Asynch CMOS
AM8
VCC
AM9
Output
B1
VSS
Power/Other
B10
D10#
Source Synch
Output
Input/Output
B11
VSS
Power/Other
B12
D13#
Source Synch
Input/Output
B13
COMP8
Power/Other
Input
B14
VSS
Power/Other
Power/Other
B15
D53#
Source Synch
Input/Output
VCC
Power/Other
B16
D55#
Source Synch
Input/Output
AN1
VSS
Power/Other
B17
VSS
Power/Other
AN10
VSS
Power/Other
B18
D57#
Source Synch
Input/Output
AN11
VCC
Power/Other
B19
D60#
Source Synch
Input/Output
AN12
VCC
Power/Other
B2
DBSY#
AN13
VSS
Power/Other
B20
VSS
Power/Other
AN14
VCC
Power/Other
B21
D59#
Source Synch
Input/Output
AN15
VCC
Power/Other
B22
D63#
Source Synch
Input/Output
AN16
VSS
Power/Other
B23
VSSA
Power/Other
AN17
VSS
Power/Other
B24
VSS
Power/Other
AN18
VCC
Power/Other
B25
VTT
Power/Other
AN19
VCC
Power/Other
B26
VTT
Power/Other
AN2
VSS
Power/Other
B27
VTT
Power/Other
AN20
VSS
Power/Other
B28
VTT
Power/Other
AN21
VCC
Power/Other
B29
VTT
Power/Other
AN22
VCC
Power/Other
B3
RS0#
Common Clock
AN23
VSS
Power/Other
B30
VTT
Power/Other
AN24
VSS
Power/Other
B4
D00#
Source Synch
AN25
VCC
Power/Other
B5
VSS
Power/Other
Output
Output
Common Clock Input/Output
Input
Input/Output
Datasheet
Land Listing and Signal Descriptions
Table 4-2.
Numerical Land
Assignment
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
Direction
Land
#
Land Name
B6
D05#
Source Synch
Input/Output
D14
RESERVED
B7
D06#
Source Synch
Input/Output
D15
VSS
B8
VSS
Power/Other
D16
RESERVED
B9
DSTBP0#
Input/Output
D17
D49#
Source Synch
C1
DRDY#
Common Clock Input/Output
D18
VSS
Power/Other
Source Synch
Signal Buffer
Type
Power/Other
C10
VSS
Power/Other
D19
DBI2#
C11
D11#
Source Synch
Input/Output
D2
ADS#
C12
D14#
Source Synch
Input/Output
D20
D48#
Source Synch
C13
VSS
Power/Other
D21
VSS
Power/Other
C14
D52#
Source Synch
Input/Output
D22
D46#
Source Synch
C15
D51#
Source Synch
Input/Output
D23
VCCPLL
Power/Other
Source Synch
Input/Output
Input/Output
Common Clock Input/Output
C16
VSS
Power/Other
D24
VSS
Power/Other
C17
DSTBP3#
Source Synch
Input/Output
D25
VTT
Power/Other
C18
D54#
Source Synch
Input/Output
D26
VTT
Power/Other
C19
VSS
Power/Other
D27
VTT
Power/Other
D28
VTT
Power/Other
D29
VTT
Power/Other
Input/Output
Input/Output
C2
BNR#
C20
DBI3#
Source Synch
Input/Output
C21
D58#
Source Synch
Input/Output
D3
VSS
Power/Other
C22
VSS
Power/Other
D30
VTT
Power/Other
C23
VCCIOPLL
Power/Other
D4
HIT#
C24
VSS
Power/Other
D5
VSS
C25
VTT
Power/Other
D6
VSS
Power/Other
C26
VTT
Power/Other
D7
D20#
Source Synch
Input/Output
C27
VTT
Power/Other
D8
D12#
Source Synch
Input/Output
C28
VTT
Power/Other
D9
VSS
Power/Other
Power/Other
E10
D21#
Source Synch
E11
VSS
Power/Other
C29
VTT
C3
LOCK#
Common Clock Input/Output
Direction
Common Clock Input/Output
Common Clock Input/Output
Power/Other
Input/Output
C30
VTT
Power/Other
E12
DSTBP1#
Source Synch
Input/Output
C4
VSS
Power/Other
E13
D26#
Source Synch
Input/Output
C5
D01#
Source Synch
Input/Output
E14
VSS
Power/Other
C6
D03#
Source Synch
Input/Output
E15
D33#
Source Synch
Input/Output
Input/Output
C7
VSS
Power/Other
C8
DSTBN0#
Source Synch
E16
D34#
Source Synch
Input/Output
E17
VSS
Power/Other
Common Clock Input/Output
E18
D39#
Source Synch
Input/Output
E19
D40#
Source Synch
Input/Output
C9
BPMb1#
D1
RESERVED
D10
D22#
Source Synch
Input/Output
E2
VSS
Power/Other
D11
D15#
Source Synch
Input/Output
E20
VSS
Power/Other
E21
D42#
Source Synch
Input/Output
E22
D45#
Source Synch
Input/Output
D12
VSS
Power/Other
D13
D25#
Source Synch
Input/Output
Datasheet
59
Land Listing and Signal Descriptions
Table 4-2.
60
Numerical Land
Assignment
Signal Buffer
Type
Table 4-2.
Signal Buffer
Type
Land
#
Land Name
E23
RESERVED
E24
FC10
Power/Other
E25
VSS
Power/Other
F9
D18#
E26
VSS
Power/Other
G1
BPMb0#
E27
VSS
Power/Other
G10
GTLREF3
Power/Other
Input
E28
VSS
Power/Other
G11
DBI1#
Source Synch
Input/Output
G12
DSTBN1#
Source Synch
Input/Output
G13
D27#
Source Synch
Input/Output
G14
D29#
Source Synch
Input/Output
G15
D31#
Source Synch
Input/Output
Direction
Land
#
Numerical Land
Assignment
Land Name
Direction
F7
VSS
Power/Other
F8
D17#
Source Synch
Input/Output
Source Synch
Input/Output
Common Clock Input/Output
E29
FC26
Power/Other
E3
TRDY#
Common Clock
E4
HITM#
Common Clock Input/Output
E5
FC20
E6
RESERVED
G16
D32#
Source Synch
Input/Output
E7
RESERVED
G17
D36#
Source Synch
Input/Output
Input
Power/Other
E8
VSS
Power/Other
E9
D19#
Source Synch
G18
D35#
Source Synch
Input/Output
Input/Output
G19
DSTBP2#
Source Synch
Input/Output
F10
VSS
Power/Other
G2
COMP2
Power/Other
Input
F11
D23#
Source Synch
Input/Output
G20
DSTBN2#
Source Synch
Input/Output
F12
D24#
Source Synch
Input/Output
G21
D44#
Source Synch
Input/Output
F13
VSS
Power/Other
G22
D47#
Source Synch
Input/Output
F14
D28#
Source Synch
Input/Output
G23
RESET#
Common Clock
Input
F15
D30#
Source Synch
Input/Output
G24
TESTHI6
Power/Other
Input
F16
VSS
Power/Other
G25
TESTHI3
Power/Other
Input
F17
D37#
Source Synch
Input/Output
G26
TESTHI5
Power/Other
Input
F18
D38#
Source Synch
Input/Output
G27
TESTHI4
Power/Other
Input
F19
VSS
Power/Other
G28
BCLK1
Clock
Input
Asynch CMOS
Output
F2
GTLREF2
Power/Other
Input
G29
BSEL0
F20
D41#
Source Synch
Input/Output
G3
BPMb3#
F21
D43#
Source Synch
Input/Output
G30
BSEL2
F22
VSS
Power/Other
G4
BPMb2#
F23
RESERVED
G5
PECI
F24
TESTHI7
Power/Other
Input
G6
RESERVED
F25
TESTHI2
Power/Other
Input
G7
F26
TESTHI0
Power/Other
Input
G8
F27
VTT_SEL
Power/Other
Output
F28
BCLK0
Clock
Input
F29
RESERVED
F3
BR0#
Common Clock Input/Output
F4
VSS
Power/Other
F5
RS1#
Common Clock
F6
FC21
Power/Other
Input
Common Clock Input/Output
Asynch CMOS
Output
Common Clock Input/Output
Power/Other
Input/Output
DEFER#
Common Clock
Input
BPRI#
Common Clock
Input
G9
D16#
Source Synch
Input/Output
H1
GTLREF0
Power/Other
Input
H10
VSS
Power/Other
H11
VSS
Power/Other
H12
VSS
Power/Other
H13
VSS
Power/Other
H14
VSS
Power/Other
Datasheet
Land Listing and Signal Descriptions
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
H15
FC32
H16
H17
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
Power/Other
J23
VCC
Power/Other
FC33
Power/Other
J24
VCC
Power/Other
VSS
Power/Other
J25
VCC
Power/Other
H18
VSS
Power/Other
J26
VCC
Power/Other
H19
VSS
Power/Other
J27
VCC
Power/Other
J28
VCC
Power/Other
J29
VCC
Power/Other
Direction
Input
Direction
H2
GTLREF1
Power/Other
H20
VSS
Power/Other
H21
VSS
Power/Other
J3
FC22
Power/Other
H22
VSS
Power/Other
J30
VCC
Power/Other
H23
VSS
Power/Other
J4
VSS
Power/Other
H24
VSS
Power/Other
J5
REQ1#
Source Synch
Input/Output
H25
VSS
Power/Other
J6
REQ4#
Source Synch
Input/Output
H26
VSS
Power/Other
J7
VSS
Power/Other
H27
VSS
Power/Other
J8
VCC
Power/Other
H28
VSS
Power/Other
J9
VCC
Power/Other
H29
FC15
Power/Other
K1
LINT0
Asynch CMOS
H3
VSS
Power/Other
K2
VSS
Power/Other
H30
BSEL1
Asynch CMOS
K23
VCC
Power/Other
H4
FC35
Power/Other
K24
VCC
Power/Other
H5
TESTHI10
Power/Other
K25
VCC
Power/Other
H6
VSS
Power/Other
K26
VCC
Power/Other
H7
VSS
Power/Other
K27
VCC
Power/Other
H8
VSS
Power/Other
K28
VCC
Power/Other
H9
VSS
Power/Other
K29
VCC
Power/Other
J1
VTT_OUT_LE
FT
Power/Other
K3
A20M#
Asynch CMOS
J10
VCC
Power/Other
J11
VCC
Power/Other
J12
VCC
Power/Other
J13
VCC
Power/Other
J14
VCC
Power/Other
J15
VCC
Power/Other
J16
FC31
Power/Other
J17
FC34
Power/Other
J18
VCC
Power/Other
J19
VCC
Power/Other
J2
FC3
Power/Other
J20
VCC
Power/Other
J21
VCC
Power/Other
J22
VCC
Power/Other
Output
Input
Output
K30
VCC
Power/Other
K4
REQ0#
Source Synch
Input
Input
Input/Output
K5
VSS
Power/Other
K6
REQ3#
Source Synch
K7
VSS
Power/Other
K8
VCC
Power/Other
L1
LINT1
Asynch CMOS
Input
L2
TESTHI13
Power/Other
Input
L23
VSS
Power/Other
L24
VSS
Power/Other
L25
VSS
Power/Other
L26
VSS
Power/Other
L27
VSS
Power/Other
L28
VSS
Power/Other
Input/Output
Datasheet
61
Land Listing and Signal Descriptions
Table 4-2.
Land
#
Land Name
Signal Buffer
Type
Table 4-2.
Direction
Land
#
Numerical Land
Assignment
Land Name
Signal Buffer
Type
Direction
L29
VSS
Power/Other
N8
VCC
Power/Other
L3
VSS
Power/Other
P1
TESTHI11
Power/Other
Input
Input
L30
VSS
Power/Other
P2
SMI#
Asynch CMOS
L4
A06#
Source Synch
Input/Output
P23
VSS
Power/Other
L5
A03#
Source Synch
Input/Output
P24
VSS
Power/Other
L6
VSS
Power/Other
P25
VSS
Power/Other
L7
VSS
Power/Other
P26
VSS
Power/Other
L8
VCC
Power/Other
P27
VSS
Power/Other
VSS
Power/Other
P28
VSS
Power/Other
P29
VSS
Power/Other
M1
M2
62
Numerical Land
Assignment
THERMTRIP# Asynch CMOS
Output
M23
VCC
Power/Other
P3
INIT#
Asynch CMOS
M24
VCC
Power/Other
P30
VSS
Power/Other
M25
VCC
Power/Other
P4
VSS
Power/Other
M26
VCC
Power/Other
P5
RESERVED
M27
VCC
Power/Other
P6
A04#
Source Synch
M28
VCC
Power/Other
P7
VSS
Power/Other
M29
VCC
Power/Other
M3
STPCLK#
Asynch CMOS
M30
VCC
Power/Other
M4
A07#
Source Synch
P8
VCC
Power/Other
Input
R1
COMP3
Power/Other
R2
VSS
Power/Other
Input/Output
R23
VSS
Power/Other
M5
A05#
Source Synch
Input/Output
R24
VSS
Power/Other
M6
REQ2#
Source Synch
Input/Output
R25
VSS
Power/Other
M7
VSS
Power/Other
R26
VSS
Power/Other
M8
VCC
Power/Other
R27
VSS
Power/Other
N1
PWRGOOD
Power/Other
Input
R28
VSS
Power/Other
N2
IGNNE#
Asynch CMOS
Input
R29
VSS
Power/Other
N23
VCC
Power/Other
R3
FERR#/PBE#
Asynch CMOS
N24
VCC
Power/Other
R30
VSS
Power/Other
N25
VCC
Power/Other
R4
A08#
Source Synch
N26
VCC
Power/Other
R5
VSS
Power/Other
N27
VCC
Power/Other
R6
ADSTB0#
Source Synch
N28
VCC
Power/Other
R7
VSS
Power/Other
N29
VCC
Power/Other
R8
VCC
Power/Other
N3
VSS
Power/Other
T1
COMP1
Power/Other
N30
VCC
Power/Other
N4
RESERVED
N5
RESERVED
N6
VSS
Power/Other
N7
VSS
Power/Other
T2
FC4
Power/Other
T23
VCC
Power/Other
T24
VCC
Power/Other
T25
VCC
Power/Other
T26
VCC
Power/Other
Input
Input/Output
Input
Output
Input/Output
Input/Output
Input
Datasheet
Land Listing and Signal Descriptions
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
T27
VCC
T28
T29
Table 4-2.
Numerical Land
Assignment
Land
#
Land Name
Signal Buffer
Type
Power/Other
V6
VSS
Power/Other
VCC
Power/Other
V7
VSS
Power/Other
VCC
Power/Other
V8
VCC
Power/Other
Direction
Direction
T3
VSS
Power/Other
W1
MSID0
Power/Other
Output
T30
VCC
Power/Other
W2
TDI_M
Power/Other
Input
T4
A11#
Source Synch
Input/Output
W23
VCC
Power/Other
T5
A09#
Source Synch
Input/Output
W24
VCC
Power/Other
T6
VSS
Power/Other
W25
VCC
Power/Other
T7
VSS
Power/Other
W26
VCC
Power/Other
W27
VCC
Power/Other
W28
VCC
Power/Other
T8
VCC
Power/Other
U1
TDO_M
TAP
Output
U2
FC29
Power/Other
W29
VCC
Power/Other
U23
VCC
Power/Other
W3
TESTHI1
Power/Other
U24
VCC
Power/Other
W30
VCC
Power/Other
U25
VCC
Power/Other
W4
VSS
Power/Other
U26
VCC
Power/Other
W5
A16#
Source Synch
Input/Output
U27
VCC
Power/Other
W6
A18#
Source Synch
Input/Output
U28
VCC
Power/Other
W7
VSS
Power/Other
U29
VCC
Power/Other
W8
VCC
Power/Other
Y1
FC0/
BOOTSELECT
Power/Other
Y2
VSS
Power/Other
Y23
VCC
Power/Other
Y24
VCC
Power/Other
Y25
VCC
Power/Other
Y26
VCC
Power/Other
Y27
VCC
Power/Other
Y28
VCC
Power/Other
U3
FC30
Power/Other
U30
VCC
Power/Other
U4
A13#
Source Synch
Input/Output
U5
A12#
Source Synch
Input/Output
U6
A10#
Source Synch
Input/Output
U7
VSS
Power/Other
U8
VCC
Power/Other
V1
MSID1
Power/Other
V2
RESERVED
V23
VSS
Power/Other
V24
VSS
Power/Other
V25
VSS
Power/Other
V26
VSS
Power/Other
V27
VSS
Power/Other
V28
VSS
Power/Other
V29
VSS
Power/Other
Output
V3
VSS
Power/Other
V30
VSS
Power/Other
V4
A15#
Source Synch
Input/Output
V5
A14#
Source Synch
Input/Output
Y29
VCC
Power/Other
Y3
PSI#
Power/Other
Y30
VCC
Power/Other
Y4
A20#
Source Synch
Y5
VSS
Power/Other
Y6
A19#
Source Synch
Y7
VSS
Power/Other
Y8
VCC
Power/Other
Input
Input/Output
Input/Output
Datasheet
63
Land Listing and Signal Descriptions
4.2
Alphabetical Signals Reference
Table 4-3.
Signal Description (Sheet 1 of 10)
Name
A[35:3]#
Type
Input/
Output
Description
A[35:3]# (Address) define a 236-byte physical memory address
space. In sub-phase 1 of the address phase, these signals transmit
the address of a transaction. In sub-phase 2, these signals transmit
transaction type information. These signals must connect the
appropriate pins/lands of all agents on the processor FSB. A[35:3]#
are source synchronous signals and are latched into the receiving
buffers by ADSTB[1:0]#.
On the active-to-inactive transition of RESET#, the processor
samples a subset of the A[35:3]# signals to determine power-on
configuration. See Section 6.1 for more details.
A20M#
Input
If A20M# (Address-20 Mask) is asserted, the processor masks
physical address bit 20 (A20#) before looking up a line in any internal
cache and before driving a read/write transaction on the bus.
Asserting A20M# emulates the 8086 processor's address wraparound at the 1-MB boundary. Assertion of A20M# is only supported
in real mode.
A20M# is an asynchronous signal. However, to ensure recognition of
this signal following an Input/Output write instruction, it must be
valid along with the TRDY# assertion of the corresponding Input/
Output Write bus transaction.
ADS#
Input/
Output
ADS# (Address Strobe) is asserted to indicate the validity of the
transaction address on the A[35:3]# and REQ[4:0]# signals. All bus
agents observe the ADS# activation to begin protocol checking,
address decode, internal snoop, or deferred reply ID match
operations associated with the new transaction.
Address strobes are used to latch A[35:3]# and REQ[4:0]# on their
rising and falling edges. Strobes are associated with signals as shown
below.
ADSTB[1:0]#
BCLK[1:0]
Input/
Output
Input
Signals
Associated
Strobe
REQ[4:0]#, A[16:3]#
ADSTB0#
A[35:17]#
ADSTB1#
The differential pair BCLK (Bus Clock) determines the FSB frequency.
All processor FSB agents must receive these signals to drive their
outputs and latch their inputs.
All external timing parameters are specified with respect to the rising
edge of BCLK0 crossing VCROSS.
BNR#
64
Input/
Output
BNR# (Block Next Request) is used to assert a bus stall by any bus
agent unable to accept new bus transactions. During a bus stall, the
current bus owner cannot issue any new transactions.
Datasheet
Land Listing and Signal Descriptions
Table 4-3.
Signal Description (Sheet 2 of 10)
Name
Type
Description
BPM[5:0]# and BPMb[3:0]# (Breakpoint Monitor) are breakpoint and
performance monitor signals. They are outputs from the processor
which indicate the status of breakpoints and programmable counters
used for monitoring processor performance. BPM[5:0]# and
BPMb[3:0]# should connect the appropriate pins/lands of all
processor FSB agents. BPM[3:0]# are associated with core 0.
BPMb[3:0]# are associated with core 1.
BPM[5:0]#
BPMb[3:0]#
Input/
Output
BPM4# provides PRDY# (Probe Ready) functionality for the TAP port.
PRDY# is a processor output used by debug tools to determine
processor debug readiness.
BPM5# provides PREQ# (Probe Request) functionality for the TAP
port. PREQ# is used by debug tools to request debug operation of the
processor.
Refer to the appropriate platform design guide for more detailed
information.
These signals do not have on-die termination. Refer to Section 2.7.2,
and appropriate platform design guide for termination requirements.
BPRI#
Input
BR0#
Input/
Output
BPRI# (Bus Priority Request) is used to arbitrate for ownership of the
processor FSB. It must connect the appropriate pins/lands of all
processor FSB agents. Observing BPRI# active (as asserted by the
priority agent) causes all other agents to stop issuing new requests,
unless such requests are part of an ongoing locked operation. The
priority agent keeps BPRI# asserted until all of its requests are
completed, then releases the bus by de-asserting BPRI#.
BR0# drives the BREQ0# signal in the system and is used by the
processor to request the bus. During power-on configuration this
signal is sampled to determine the agent ID = 0.
This signal does not have on-die termination and must be terminated.
BSEL[2:0]
Output
The BCLK[1:0] frequency select signals BSEL[2:0] are used to select
the processor input clock frequency. Table 2-15 defines the possible
combinations of the signals and the frequency associated with each
combination. The required frequency is determined by the processor,
chipset and clock synthesizer. All agents must operate at the same
frequency. For more information about these signals, including
termination recommendations refer to Section 2.9.2 and the
appropriate platform design guidelines.
COMP[3:0],
COMP8
Analog
COMP[3:0] and COMP8 must be terminated to VSS on the system
board using precision resistors. Refer to the appropriate platform
design guide for details on implementation.
Datasheet
65
Land Listing and Signal Descriptions
Table 4-3.
Signal Description (Sheet 3 of 10)
Name
Type
Description
D[63:0]# (Data) are the data signals. These signals provide a 64-bit
data path between the processor FSB agents, and must connect the
appropriate pins/lands on all such agents. The data driver asserts
DRDY# to indicate a valid data transfer.
D[63:0]# are quad-pumped signals and will, thus, be driven four
times in a common clock period. D[63:0]# are latched off the falling
edge of both DSTBP[3:0]# and DSTBN[3:0]#. Each group of 16 data
signals correspond to a pair of one DSTBP# and one DSTBN#. The
following table shows the grouping of data signals to data strobes and
DBI#.
Quad-Pumped Signal Groups
D[63:0]#
Input/
Output
Data Group
DSTBN#/
DSTBP#
DBI#
D[15:0]#
0
0
D[31:16]#
1
1
D[47:32]#
2
2
D[63:48]#
3
3
Furthermore, the DBI# signals determine the polarity of the data
signals. Each group of 16 data signals corresponds to one DBI#
signal. When the DBI# signal is active, the corresponding data group
is inverted and therefore sampled active high.
DBI[3:0]# (Data Bus Inversion) are source synchronous and indicate
the polarity of the D[63:0]# signals.The DBI[3:0]# signals are
activated when the data on the data bus is inverted. If more than half
the data bits, within a 16-bit group, would have been asserted
electrically low, the bus agent may invert the data bus signals for that
particular sub-phase for that 16-bit group.
DBI[3:0]#
66
Input/
Output
DBR#
Output
DBSY#
Input/
Output
DBI[3:0] Assignment To Data Bus
Bus Signal
Data Bus
Signals
DBI3#
D[63:48]#
DBI2#
D[47:32]#
DBI1#
D[31:16]#
DBI0#
D[15:0]#
DBR# (Debug Reset) is used only in processor systems where no
debug port is implemented on the system board. DBR# is used by a
debug port interposer so that an in-target probe can drive system
reset. If a debug port is implemented in the system, DBR# is a no
connect in the system. DBR# is not a processor signal.
DBSY# (Data Bus Busy) is asserted by the agent responsible for
driving data on the processor FSB to indicate that the data bus is in
use. The data bus is released after DBSY# is de-asserted. This signal
must connect the appropriate pins/lands on all processor FSB agents.
Datasheet
Land Listing and Signal Descriptions
Table 4-3.
Signal Description (Sheet 4 of 10)
Name
DEFER#
DPRSTP#
Type
Description
Input
DEFER# is asserted by an agent to indicate that a transaction cannot
be ensured in-order completion. Assertion of DEFER# is normally the
responsibility of the addressed memory or input/output agent. This
signal must connect the appropriate pins/lands of all processor FSB
agents.
Input
DPRSTP#, when asserted on the platform, causes the processor to
transition from the Deep Sleep State to the Deeper Sleep state. To
return to the Deep Sleep State, DPRSTP# must be deasserted. Use of
the DPRSTP# pin, and corresponding low power state, requires
chipset support and may not be available on all platforms. Refer to
the appropriate platform design guide for implementation details.
NOTE: Some processors may not have the Deeper Sleep State
enabled, refer to the Specification Update for specific sku and
stepping guidance.
DPSLP#
Input
DPSLP#, when asserted on the platform, causes the processor to
transition from the Sleep State to the Deep Sleep state. To return to
the Sleep State, DPSLP# must be deasserted. Use of the DPSLP# pin,
and corresponding low power state, requires chipset support and may
not be available on all platforms. Refer to the appropriate platform
design guide for implementation details.
NOTE: Some processors may not have the Deep Sleep State enabled,
refer to the Specification Update for specific sku and stepping
guidance.
DRDY#
Input/
Output
DRDY# (Data Ready) is asserted by the data driver on each data
transfer, indicating valid data on the data bus. In a multi-common
clock data transfer, DRDY# may be de-asserted to insert idle clocks.
This signal must connect the appropriate pins/lands of all processor
FSB agents.
DSTBN[3:0]# are the data strobes used to latch in D[63:0]#.
DSTBN[3:0]#
Input/
Output
Signals
Associated
Strobe
D[15:0]#, DBI0#
DSTBN0#
D[31:16]#, DBI1#
DSTBN1#
D[47:32]#, DBI2#
DSTBN2#
D[63:48]#, DBI3#
DSTBN3#
DSTBP[3:0]# are the data strobes used to latch in D[63:0]#.
DSTBP[3:0]#
FC0/
BOOTSELECT
Input/
Output
Other
Signals
Associated
Strobe
D[15:0]#, DBI0#
DSTBP0#
D[31:16]#, DBI1#
DSTBP1#
D[47:32]#, DBI2#
DSTBP2#
D[63:48]#, DBI3#
DSTBP3#
FC0/BOOTSELECT is not used by the Yorkfield processor. When this
land is tied to Vss previous processors based on the Intel NetBurst®
microarchitecture should be disabled and prevented from booting.
Refer to appropriate platform design guide for termination guidance.
Datasheet
67
Land Listing and Signal Descriptions
Table 4-3.
Signal Description (Sheet 5 of 10)
Name
FCx
FERR#/PBE#
GTLREF[3:0]
HIT#
HITM#
IERR#
Type
Other
Output
Input
Input/
Output
Input/
Output
Output
Description
FC signals are signals that are available for compatibility with other
processors. Refer to the appropriate platform design guide for more
information on how these are connected on the motherboard.
FERR#/PBE# (floating point error/pending break event) is a
multiplexed signal and its meaning is qualified by STPCLK#. When
STPCLK# is not asserted, FERR#/PBE# indicates a floating-point
error and will be asserted when the processor detects an unmasked
floating-point error. When STPCLK# is not asserted, FERR#/PBE# is
similar to the ERROR# signal on the Intel 387 coprocessor, and is
included for compatibility with systems using MS-DOS*-type floatingpoint error reporting. When STPCLK# is asserted, an assertion of
FERR#/PBE# indicates that the processor has a pending break event
waiting for service. The assertion of FERR#/PBE# indicates that the
processor should be returned to the Normal state. For additional
information on the pending break event functionality, including the
identification of support of the feature and enable/disable
information, refer to volume 3 of the Intel Architecture Software
Developer's Manual and the Intel Processor Identification and the
CPUID Instruction application note.
GTLREF[3:0] determine the signal reference level for GTL+ input
signals. GTLREF is used by the GTL+ receivers to determine if a
signal is a logical 0 or logical 1. Refer to the applicable platform
design guide for more information.
HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction snoop
operation results. Any FSB agent may assert both HIT# and HITM#
together to indicate that it requires a snoop stall, which can be
continued by reasserting HIT# and HITM# together.
IERR# (Internal Error) is asserted by a processor as the result of an
internal error. Assertion of IERR# is usually accompanied by a
SHUTDOWN transaction on the processor FSB. This transaction may
optionally be converted to an external error signal (e.g., NMI) by
system core logic. The processor will keep IERR# asserted until the
assertion of RESET#.
This signal does not have on-die termination. Refer to Section 2.7.2
for termination requirements.
IGNNE#
Input
IGNNE# (Ignore Numeric Error) is asserted to the processor to ignore
a numeric error and continue to execute noncontrol floating-point
instructions. If IGNNE# is de-asserted, the processor generates an
exception on a noncontrol floating-point instruction if a previous
floating-point instruction caused an error. IGNNE# has no effect when
the NE bit in control register 0 (CR0) is set.
IGNNE# is an asynchronous signal. However, to ensure recognition of
this signal following an Input/Output write instruction, it must be
valid along with the TRDY# assertion of the corresponding Input/
Output Write bus transaction.
68
Datasheet
Land Listing and Signal Descriptions
Table 4-3.
Signal Description (Sheet 6 of 10)
Name
INIT#
Type
Input
Description
INIT# (Initialization), when asserted, resets integer registers inside
the processor without affecting its internal caches or floating-point
registers. The processor then begins execution at the power-on Reset
vector configured during power-on configuration. The processor
continues to handle snoop requests during INIT# assertion. INIT# is
an asynchronous signal and must connect the appropriate pins/lands
of all processor FSB agents.
If INIT# is sampled active on the active to inactive transition of
RESET#, then the processor executes its Built-in Self-Test (BIST).
ITP_CLK[1:0]
LINT[1:0]
Input
Input
ITP_CLK[1:0] are copies of BCLK that are used only in processor
systems where no debug port is implemented on the system board.
ITP_CLK[1:0] are used as BCLK[1:0] references for a debug port
implemented on an interposer. If a debug port is implemented in the
system, ITP_CLK[1:0] are no connects in the system. These are not
processor signals.
LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins/
lands of all APIC Bus agents. When the APIC is disabled, the LINT0
signal becomes INTR, a maskable interrupt request signal, and LINT1
becomes NMI, a nonmaskable interrupt. INTR and NMI are backward
compatible with the signals of those names on the Pentium processor.
Both signals are asynchronous.
Both of these signals must be software configured via BIOS
programming of the APIC register space to be used either as NMI/
INTR or LINT[1:0]. Because the APIC is enabled by default after
Reset, operation of these signals as LINT[1:0] is the default
configuration.
LOCK#
Input/
Output
LOCK# indicates to the system that a transaction must occur
atomically. This signal must connect the appropriate pins/lands of all
processor FSB agents. For a locked sequence of transactions, LOCK#
is asserted from the beginning of the first transaction to the end of
the last transaction.
When the priority agent asserts BPRI# to arbitrate for ownership of
the processor FSB, it will wait until it observes LOCK# de-asserted.
This enables symmetric agents to retain ownership of the processor
FSB throughout the bus locked operation and ensure the atomicity of
lock.
MSID[1:0]
Output
On a Yorkfield processor these signals are not connected on the
package (they are floating). As an alternative to MSID, Intel has
implemented the Power Segment Identifier (PSID) to report the
maximum Thermal Design Power of the processor. Refer to the
Platform Design Guide for additional information regarding PSID.
PECI
Input/
Output
PECI is a proprietary one-wire bus interface. See Chapter 5.3 for
details.
Input/
Output
As an output, PROCHOT# (Processor Hot) will go active when the
processor temperature monitoring sensor detects that the processor
has reached its maximum safe operating temperature. This indicates
that the processor Thermal Control Circuit (TCC) has been activated,
if enabled. As an input, assertion of PROCHOT# by the system will
activate the TCC, if enabled. The TCC will remain active until the
system de-asserts PROCHOT#. See Section 5.2.4 for more details.
PROCHOT#
Datasheet
69
Land Listing and Signal Descriptions
Table 4-3.
Signal Description (Sheet 7 of 10)
Name
Type
Description
PWRGOOD
Input
PWRGOOD (Power Good) is a processor input. The processor requires
this signal to be a clean indication that the clocks and power supplies
are stable and within their specifications. ‘Clean’ implies that the
signal will remain low (capable of sinking leakage current), without
glitches, from the time that the power supplies are turned on until
they come within specification. The signal must then transition
monotonically to a high state. PWRGOOD can be driven inactive at
any time, but clocks and power must again be stable before a
subsequent rising edge of PWRGOOD.
The PWRGOOD signal must be supplied to the processor; it is used to
protect internal circuits against voltage sequencing issues. It should
be driven high throughout boundary scan operation.
REQ[4:0]#
Input/
Output
REQ[4:0]# (Request Command) must connect the appropriate pins/
lands of all processor FSB agents. They are asserted by the current
bus owner to define the currently active transaction type. These
signals are source synchronous to ADSTB0#.
RESET#
Input
Asserting the RESET# signal resets the processor to a known state
and invalidates its internal caches without writing back any of their
contents. For a power-on Reset, RESET# must stay active for at least
one millisecond after VCC and BCLK have reached their proper
specifications. On observing active RESET#, all FSB agents will deassert their outputs within two clocks. RESET# must not be kept
asserted for more than 10 ms while PWRGOOD is asserted.
A number of bus signals are sampled at the active-to-inactive
transition of RESET# for power-on configuration. These configuration
options are described in the Section 6.1.
This signal does not have on-die termination and must be terminated
on the system board.
All RESERVED lands must remain unconnected. Connection of these
lands to VCC, VSS, VTT, or to any other signal (including each other)
can result in component malfunction or incompatibility with future
processors.
RESERVED
RS[2:0]#
Input
RS[2:0]# (Response Status) are driven by the response agent (the
agent responsible for completion of the current transaction), and
must connect the appropriate pins/lands of all processor FSB agents.
SKTOCC#
Output
SKTOCC# (Socket Occupied) will be pulled to ground by the
processor. System board designers may use this signal to determine
if the processor is present.
SMI#
Input
SMI# (System Management Interrupt) is asserted asynchronously by
system logic. On accepting a System Management Interrupt, the
processor saves the current state and enter System Management
Mode (SMM). An SMI Acknowledge transaction is issued, and the
processor begins program execution from the SMM handler.
If SMI# is asserted during the de-assertion of RESET#, the processor
will tri-state its outputs.
70
Datasheet
Land Listing and Signal Descriptions
Table 4-3.
Signal Description (Sheet 8 of 10)
Name
Type
Description
STPCLK#
Input
STPCLK# (Stop Clock), when asserted, causes the processor to enter
a low power Stop-Grant state. The processor issues a Stop-Grant
Acknowledge transaction, and stops providing internal clock signals
to all processor core units except the FSB and APIC units. The
processor continues to snoop bus transactions and service interrupts
while in Stop-Grant state. When STPCLK# is de-asserted, the
processor restarts its internal clock to all units and resumes
execution. The assertion of STPCLK# has no effect on the bus clock;
STPCLK# is an asynchronous input.
TCK
Input
TCK (Test Clock) provides the clock input for the processor Test Bus
(also known as the Test Access Port).
Input
TDI and TDI_M (Test Data In) transfers serial test data into the
processor. TDI and TDI_M provide the serial input needed for JTAG
specification support. TDI connects to core 0. TDI_M connects to core
1. Refer to the appropriate platform design guide for more
information.
Output
TDO and TDO_M (Test Data Out) transfers serial test data out of the
processor. TDO and TDO_M provide the serial output needed for JTAG
specification support. TDO connects to core 1. TDO_M connects to
core 0. Refer to the appropriate platform design guide for more
information.
TDI, TDI_M
TDO, TDO_M
TESTHI[13,
11:10,7:0]
Input
TESTHI[13,11:10,7:0] must be connected to the processor’s
appropriate power source (refer to VTT_OUT_LEFT and
VTT_OUT_RIGHT signal description) through a resistor for proper
processor operation. See Section 2.4 for more details.
Output
In the event of a catastrophic cooling failure, the processor will
automatically shut down when the silicon has reached a temperature
approximately 20 °C above the maximum TC. Assertion of
THERMTRIP# (Thermal Trip) indicates the processor junction
temperature has reached a level beyond where permanent silicon
damage may occur. Upon assertion of THERMTRIP#, the processor
will shut off its internal clocks (thus, halting program execution) in an
attempt to reduce the processor junction temperature. To protect the
processor, its core voltage (VCC) must be removed following the
assertion of THERMTRIP#. Driving of the THERMTRIP# signal is
enabled within 10 µs of the assertion of PWRGOOD (provided VTT and
VCC are asserted) and is disabled on de-assertion of PWRGOOD (if VTT
or VCC are not valid, THERMTRIP# may also be disabled). Once
activated, THERMTRIP# remains latched until PWRGOOD, VTT or VCC
is de-asserted. While the de-assertion of the PWRGOOD, VTT or VCC
signal will de-assert THERMTRIP#, if the processor’s junction
temperature remains at or above the trip level, THERMTRIP# will
again be asserted within 10 µs of the assertion of PWRGOOD
(provided VTT and VCC are valid).
TMS
Input
TMS (Test Mode Select) is a JTAG specification support signal used by
debug tools.
TRDY#
Input
TRDY# (Target Ready) is asserted by the target to indicate that it is
ready to receive a write or implicit writeback data transfer. TRDY#
must connect the appropriate pins/lands of all FSB agents.
Input
TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST#
must be driven low during power on Reset. Refer to the Debug Port
Design Guide for UP / DP Systems for complete implementation
details.
THERMTRIP#
TRST#
Datasheet
71
Land Listing and Signal Descriptions
Table 4-3.
Signal Description (Sheet 9 of 10)
Name
Description
VCC
Input
VCC are the power pins for the processor. The voltage supplied to
these pins is determined by the VID[7:0] pins.
VCCA
Input
VCCA provides isolated power for internal PLLs on previous
generation processors. It may be left as a No-Connect on boards
supporting the Wolfdale processor.
VCCIOPLL
Input
VCCIOPLL provides isolated power for internal processor FSB PLLs on
previous generation processors. It may be left as a No-Connect on
boards supporting the Wolfdale processor.
VCCPLL
Input
VCCPLL provides isolated power for internal processor FSB PLLs.
Output
VCC_SENSE is an isolated low impedance connection to processor
core power (VCC). It can be used to sense or measure voltage near
the silicon with little noise.
Output
This land is provided as a voltage regulator feedback sense point for
VCC. It is connected internally in the processor package to the sense
point land U27 as described in the Voltage Regulator-Down (VRD)
11.0 Processor Power Delivery Design Guidelines For Desktop
LGA775 Socket.
Output
The VID (Voltage ID) signals are used to support automatic selection
of power supply voltages (VCC). Refer to the appropriate platform
design guide or the Voltage Regulator-Down (VRD) 11.0 Processor
Power Delivery Design Guidelines For Desktop LGA775 Socket for
more information. The voltage supply for these signals must be valid
before the VR can supply VCC to the processor. Conversely, the VR
output must be disabled until the voltage supply for the VID signals
becomes valid. The VID signals are needed to support the processor
voltage specification variations. See Table 2-1 for definitions of these
signals. The VR must supply the voltage that is requested by the
signals, or disable itself.
Output
This land is tied high on the processor package and is used by the VR
to choose the proper VID table. Refer to the appropriate platform
design guide or the Voltage Regulator-Down (VRD) 11.0 Processor
Power Delivery Design Guidelines For Desktop LGA775 Socket for
more information.
VRDSEL
Input
This input should be left as a no connect in order for the processor to
boot. The processor will not boot on legacy platforms where this land
is connected to VSS.
VSS
Input
VSS are the ground pins for the processor and should be connected
to the system ground plane.
VSSA
Input
VSSA provides isolated ground for internal PLLs on previous
generation processors. It may be left as a No-Connect on boards
supporting the Wolfdale processor.
VCC_SENSE
VCC_MB_
REGULATION
VID[7:0]
VID_SELECT
VSS_SENSE
VSS_MB_
REGULATION
VTT
72
Type
Output
VSS_SENSE is an isolated low impedance connection to processor
core VSS. It can be used to sense or measure ground near the silicon
with little noise.
Output
This land is provided as a voltage regulator feedback sense point for
VSS. It is connected internally in the processor package to the sense
point land V27 as described in the Voltage Regulator-Down (VRD)
11.0 Processor Power Delivery Design Guidelines For Desktop
LGA775 Socket.
Miscellaneous voltage supply.
Datasheet
Land Listing and Signal Descriptions
Table 4-3.
Signal Description (Sheet 10 of 10)
Name
Type
Description
Output
The VTT_OUT_LEFT and VTT_OUT_RIGHT signals are included to
provide a voltage supply for some signals that require termination to
VTT on the motherboard. Refer to the appropriate platform design
guide for details on implementation.
Output
The VTT_SEL signal is used to select the correct VTT voltage level for
the processor. This land is connected internally in the package to VSS.
VTT_OUT_LEFT
VTT_OUT_RIGHT
VTT_SEL
§
Datasheet
73
Land Listing and Signal Descriptions
74
Datasheet
Thermal Specifications and Design Considerations
5
Thermal Specifications and
Design Considerations
5.1
Processor Thermal Specifications
The processor requires a thermal solution to maintain temperatures within the
operating limits as set forth in Section 5.1.1. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete thermal solution includes both component and system level thermal
management features. Component level thermal solutions can include active or passive
heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system
level thermal solutions may consist of system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the
Yorkfield Processor Thermal and Mechanical Design Guidelines Addendum.
Note:
The boxed processor will ship with a component thermal solution. Refer to Chapter 7
for details on the boxed processor.
5.1.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum case temperature (TC)
specifications when operating at or below the Thermal Design Power (TDP) value listed
per frequency in Table 5-1. Thermal solutions not designed to provide this level of
thermal capability may affect the long-term reliability of the processor and system. For
more details on thermal solution design, refer to the Yorkfield Processor Thermal and
Mechanical Design Guidelines Addendum.
The processor uses a methodology for managing processor temperatures which is
intended to support acoustic noise reduction through fan speed control. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) bus as described in
Section 5.3. If the value reported via PECI is less than TCONTROL, then the case
temperature is permitted to exceed the Thermal Profile. If the value reported via PECI
is greater than or equal to TCONTROL, then the processor case temperature must remain
at or below the temperature as specified by the thermal profile. The temperature
reported over PECI is always a negative value and represents a delta below the onset of
thermal control circuit (TCC) activation, as indicated by PROCHOT# (see Section 5.2).
Systems that implement fan speed control must be designed to take these conditions in
to account. Systems that do not alter the fan speed only need to ensure the case
temperature meets the thermal profile specifications.
In order to determine a processor's case temperature specification based on the
thermal profile, it is necessary to accurately measure processor power dissipation. Intel
has developed a methodology for accurate power measurement that correlates to Intel
test temperature and voltage conditions. Refer to the Yorkfield Processor Thermal and
Mechanical Design Guidelines Addendum and the Live Die System Thermal Testing
Basics for the details of this methodology.
Datasheet
75
Thermal Specifications and Design Considerations
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 5-1 instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. To ensure maximum flexibility for future
requirements, systems should be designed to the Flexible Motherboard (FMB)
guidelines, even if a processor with a lower thermal dissipation is currently planned. In
all cases the Thermal Monitor or Thermal Monitor 2 feature must be enabled
for the processor to remain within specification.
Table 5-1.
Processor
Number
Processor Thermal Specifications
Thermal
Core
Design
Frequency
Power (W)
(GHz)
2, 3
Extended
HALT
Power
(W)1
X3380
3.16
95
12
X3370
3.00
95
16
X3330
2.66
95
16
X3360
2.83
95
12
X3350
2.66
95
12
X3320
2.50
95
12
L3360
2.83
65
12
FMB Guidance4
Minimum Maximum TC
TC (°C)
(°C)
775_VR_CONFIG_05A
(95W)
5
775_VR_CONFIG_05A
(95W)
775_VR_CONFIG_06A
(65 W) [L3360]
5
Notes
See Table 5-2
and
Figure 5-1
See Table 5-2
and
Figure 5-1
NOTES:
1.
Specification is at 37°C Tc and minimum voltage loadline. Specification is guaranteed by
design characterization and not 100% tested.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets.
The TDP is not the maximum power that the processor can dissipate.
3.
This table shows the maximum TDP for a given frequency range. Individual processors
may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the
individual processor. Refer to thermal profile figure and associated table for the allowed
combinations of power and TC.
4.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting future
thermal requirements.
76
Datasheet
Thermal Specifications and Design Considerations
Table 5-2.
Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile (95W)
Power (W)
Maximum Tc (°C)
Power (W)
Maximum Tc (°C)
0
44.8
50
58.8
2
45.4
52
59.4
4
45.9
54
59.9
6
46.5
56
60.5
8
47.0
58
61.0
10
47.6
60
61.6
12
48.2
62
62.2
14
48.7
64
62.7
16
49.3
66
63.3
18
49.8
68
63.8
20
50.4
70
64.4
22
51.0
72
65.0
24
51.5
74
65.5
26
52.1
76
66.1
28
52.6
78
66.6
30
53.2
80
67.2
32
53.8
82
67.8
34
54.3
84
68.3
36
54.9
86
68.9
38
55.4
88
69.4
40
56.0
90
70.0
42
56.6
92
70.6
44
57.1
94
71.1
46
57.7
95
71.4
48
58.2
Datasheet
77
Thermal Specifications and Design Considerations
Figure 5-1.
Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile(95W)
72.0
68.0
64.0
y = 0.28x + 44.8
Tcase (C)
60.0
56.0
52.0
48.0
44.0
0
10
20
30
40
50
60
70
80
90
Power (W)
78
Datasheet
Thermal Specifications and Design Considerations
Table 5-3.
Figure 5-2.
Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile (65W)
Power (W)
Maximum Tc
(°C)
Power (W)
Maximum Tc
(°C)
0
49.6
34
63.54
2
50.42
36
64.36
4
51.24
38
65.18
6
52.06
40
66
8
52.88
42
66.82
10
53.7
44
67.64
12
54.52
46
68.46
14
55.34
48
69.28
16
56.16
50
70.1
18
56.98
52
70.92
20
57.8
54
71.74
22
58.62
56
72.56
24
59.44
58
73.38
26
60.26
60
74.2
28
61.08
62
75.02
30
61.9
64
75.84
32
62.72
65
76.25
Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile (65W)
Tcase (C)
Thermal Profile
80
70
60
50
40
30
20
10
0
y = .41x + 49.6
0
10
20
30
40
50
60
70
Power (W)
Datasheet
79
Thermal Specifications and Design Considerations
5.1.2
Thermal Metrology
The maximum and minimum case temperatures (TC) for the processor is specified in
Table 5-1. This temperature specification is meant to help ensure proper operation of
the processor. Figure 5-3 illustrates where Intel recommends TC thermal
measurements should be made. For detailed guidelines on temperature measurement
methodology, refer to the Yorkfield Processor Thermal and Mechanical Design
Guidelines Addendum.
Figure 5-3.
Case Temperature (TC) Measurement Location
37.5 mm
Measure TC at this point
(geometric center of the package)
37.5 mm
5.2
Processor Thermal Features
5.2.1
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the
thermal control circuit (TCC) when the processor silicon reaches its maximum operating
temperature. The TCC reduces processor power consumption by modulating (starting
and stopping) the internal processor core clocks. The Thermal Monitor feature must
be enabled for the processor to be operating within specifications. The
temperature at which Thermal Monitor activates the thermal control circuit is not user
configurable and is not software visible. Bus traffic is snooped in the normal manner,
and interrupt requests are latched (and serviced during the time that the clocks are on)
while the TCC is active.
When the Thermal Monitor feature is enabled, and a high temperature situation exists
(i.e., TCC is active), the clocks will be modulated by alternately turning the clocks off
and on at a duty cycle specific to the processor (typically 30-50%). Clocks often will not
be off for more than 3.0 microseconds when the TCC is active. Cycle times are
processor speed dependent and will decrease as processor core frequencies increase. A
small amount of hysteresis has been included to prevent rapid active/inactive
transitions of the TCC when the processor temperature is near its maximum operating
temperature. Once the temperature has dropped below the maximum operating
temperature, and the hysteresis timer has expired, the TCC goes inactive and clock
modulation ceases.
With a properly designed and characterized thermal solution, it is anticipated that the
TCC would only be activated for very short periods of time when running the most
power intensive applications. The processor performance impact due to these brief
80
Datasheet
Thermal Specifications and Design Considerations
periods of TCC activation is expected to be so minor that it would be immeasurable. An
under-designed thermal solution that is not able to prevent excessive activation of the
TCC in the anticipated ambient environment may cause a noticeable performance loss,
and in some cases may result in a TC that exceeds the specified maximum temperature
and may affect the long-term reliability of the processor. In addition, a thermal solution
that is significantly under-designed may not be capable of cooling the processor even
when the TCC is active continuously. Refer to the Yorkfield Processor Thermal and
Mechanical Design Guidelines Addendum for information on designing a thermal
solution.
The duty cycle for the TCC, when activated by the Thermal Monitor, is factory
configured and cannot be modified. The Thermal Monitor does not require any
additional hardware, software drivers, or interrupt handling routines.
5.2.2
Thermal Monitor 2
The processor also supports an additional power reduction capability known as Thermal
Monitor 2. This mechanism provides an efficient means for limiting the processor
temperature by reducing the power consumption within the processor.
When Thermal Monitor 2 is enabled, and a high temperature situation is detected, the
Thermal Control Circuit (TCC) will be activated. The TCC causes the processor to adjust
its operating frequency (via the bus multiplier) and input voltage (via the VID signals).
This combination of reduced frequency and VID results in a reduction to the processor
power consumption.
A processor enabled for Thermal Monitor 2 includes two operating points, each
consisting of a specific operating frequency and voltage. The first operating point
represents the normal operating condition for the processor. Under this condition, the
core-frequency-to-FSB multiple utilized by the processor is that contained in the
CLK_GEYSIII_STAT MSR and the VID is that specified in Table 2-3. These parameters
represent normal system operation.
The second operating point consists of both a lower operating frequency and voltage.
When the TCC is activated, the processor automatically transitions to the new
frequency. This transition occurs very rapidly (on the order of 5 µs). During the
frequency transition, the processor is unable to service any bus requests, and
consequently, all bus traffic is blocked. Edge-triggered interrupts will be latched and
kept pending until the processor resumes operation at the new frequency.
Once the new operating frequency is engaged, the processor will transition to the new
core operating voltage by issuing a new VID code to the voltage regulator. The voltage
regulator must support dynamic VID steps in order to support Thermal Monitor 2.
During the voltage change, it will be necessary to transition through multiple VID codes
to reach the target operating voltage. Each step will likely be one VID table entry (see
Table 2-3). The processor continues to execute instructions during the voltage
transition. Operation at the lower voltage reduces the power consumption of the
processor.
A small amount of hysteresis has been included to prevent rapid active/inactive
transitions of the TCC when the processor temperature is near its maximum operating
temperature. Once the temperature has dropped below the maximum operating
temperature, and the hysteresis timer has expired, the operating frequency and
voltage transition back to the normal system operating point. Transition of the VID code
will occur first, in order to ensure proper operation once the processor reaches its
normal operating frequency. Refer to Figure 5-4 for an illustration of this ordering.
Datasheet
81
Thermal Specifications and Design Considerations
Figure 5-4.
Thermal Monitor 2 Frequency and Voltage Ordering
TTM2
Temperature
fMAX
fTM2
Frequency
VID
VIDTM2
VID
PROCHOT#
The PROCHOT# signal is asserted when a high temperature situation is detected,
regardless of whether Thermal Monitor or Thermal Monitor 2 is enabled.
It should be noted that the Thermal Monitor 2 TCC cannot be activated via the on
demand mode. The Thermal Monitor TCC, however, can be activated through the use of
the on demand mode.
5.2.3
On-Demand Mode
The processor provides an auxiliary mechanism that allows system software to force
the processor to reduce its power consumption. This mechanism is referred to as “OnDemand” mode and is distinct from the Thermal Monitor feature. On-Demand mode is
intended as a means to reduce system level power consumption. Systems using the
processor must not rely on software usage of this mechanism to limit the processor
temperature.
If bit 4 of the ACPI P_CNT Control Register (located in the processor
IA32_THERM_CONTROL MSR) is written to a '1', the processor will immediately reduce
its power consumption via modulation (starting and stopping) of the internal core clock,
independent of the processor temperature. When using On-Demand mode, the duty
cycle of the clock modulation is programmable via bits 3:1 of the same ACPI P_CNT
Control Register. In On-Demand mode, the duty cycle can be programmed from 12.5%
on/87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-Demand mode may be
used in conjunction with the Thermal Monitor. If the system tries to enable On-Demand
mode at the same time the TCC is engaged, the factory configured duty cycle of the
TCC will override the duty cycle selected by the On-Demand mode.
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Datasheet
Thermal Specifications and Design Considerations
5.2.4
PROCHOT# Signal
An external signal, PROCHOT# (processor hot), is asserted when the processor core
temperature has reached its maximum operating temperature. If the Thermal Monitor
is enabled (note that the Thermal Monitor must be enabled for the processor to be
operating within specification), the TCC will be active when PROCHOT# is asserted. The
processor can be configured to generate an interrupt upon the assertion or deassertion of PROCHOT#.
PROCHOT# is a bi-directional signal. As an output, PROCHOT# (Processor Hot) will go
active when the processor temperature monitoring sensor detects that one or both
cores has reached its maximum safe operating temperature. This indicates that the
processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input,
assertion of PROCHOT# by the system will activate the TCC, if enabled, for both cores.
The TCC will remain active until the system de-asserts PROCHOT#.
PROCHOT# allows for some protection of various components from over-temperature
situations. The PROCHOT# signal is bi-directional in that it can either signal when the
processor (either core) has reached its maximum operating temperature or be driven
from an external source to activate the TCC. The ability to activate the TCC via
PROCHOT# can provide a means for thermal protection of system components.
Bi-directional PROCHOT# can allow VR thermal designs to target maximum sustained
current instead of maximum current. Systems should still provide proper cooling for the
VR, and rely on bi-directional PROCHOT# only as a backup in case of system cooling
failure. The system thermal design should allow the power delivery circuitry to operate
within its temperature specification even while the processor is operating at its Thermal
Design Power. With a properly designed and characterized thermal solution, it is
anticipated that bi-directional PROCHOT# would only be asserted for very short periods
of time when running the most power intensive applications. An under-designed
thermal solution that is not able to prevent excessive assertion of PROCHOT# in the
anticipated ambient environment may cause a noticeable performance loss. Refer to
the appropriate platform design guide and the Voltage Regulator-Down (VRD) 11.0
Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for details on
implementing the bi-directional PROCHOT# feature.
5.2.5
THERMTRIP# Signal
Regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled, in the
event of a catastrophic cooling failure, the processor will automatically shut down when
the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in
Table 4-3). At this point, the FSB signal THERMTRIP# will go active and stay active as
described in Table 4-3. THERMTRIP# activation is independent of processor activity and
does not generate any bus cycles.
5.3
Platform Environment Control Interface (PECI)
5.3.1
Introduction
PECI offers an interface for thermal monitoring of Intel processor and chipset
components. It uses a single wire, thus alleviating routing congestion issues. PECI uses
CRC checking on the host side to ensure reliable transfers between the host and client
devices. Also, data transfer speeds across the PECI interface are negotiable within a
wide range (2Kbps to 2Mbps). The PECI interface on the Wolfdale processor is disabled
by default and must be enabled through BIOS. More information can be found in the
Platform Environment Control Interface (PECI) Specification.
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Thermal Specifications and Design Considerations
5.3.1.1
TCONTROL and TCC activation on PECI-Based Systems
Fan speed control solutions based on PECI utilize a TCONTROL value stored in the
processor IA32_TEMPERATURE_TARGET MSR. The TCONTROL MSR uses the same offset
temperature format as PECI though it contains no sign bit. Thermal management
devices should infer the TCONTROL value as negative. Thermal management algorithms
should utilize the relative temperature value delivered over PECI in conjunction with the
TCONTROL MSR value to control or optimize fan speeds. Figure 5-5 shows a conceptual
fan control diagram using PECI temperatures.
The relative temperature value reported over PECI represents the delta below the onset
of thermal control circuit (TCC) activation as indicated by PROCHOT# assertions. As the
temperature approaches TCC activation, the PECI value approaches zero. TCC activates
at a PECI count of zero.
Figure 5-5.
Conceptual Fan Control Diagram on PECI-Based Platforms
5.3.2
PECI Specifications
5.3.2.1
PECI Device Address
The PECI register resides at address 0x30.
5.3.2.2
PECI Command Support
PECI command support is covered in detail in the Platform Environment Control
Interface Specification. Please refer to this document for details on supported PECI
command function and codes.
5.3.2.3
PECI Fault Handling Requirements
PECI is largely a fault tolerant interface, including noise immunity and error checking
improvements over other comparable industry standard interfaces. The PECI client is
as reliable as the device that it is embedded in, and thus given operating conditions
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that fall under the specification, the PECI will always respond to requests and the
protocol itself can be relied upon to detect any transmission failures. There are,
however, certain scenarios where the PECI is know to be unresponsive.
Prior to a power on RESET# and during RESET# assertion, PECI is not guaranteed to
provide reliable thermal data. System designs should implement a default power-on
condition that ensures proper processor operation during the time frame when reliable
data is not available via PECI.
To protect platforms from potential operational or safety issues due to an abnormal
condition on PECI, the Host controller should take action to protect the system from
possible damage. It is recommended that the PECI host controller take appropriate
action to protect the client processor device if valid temperature readings have not
been obtained in response to three consecutive GetTemp()s or for a one second time
interval. The host controller may also implement an alert to software in the event of a
critical or continuous fault condition.
5.3.2.4
PECI GetTemp0() Error Code Support
The error codes supported for the processor GetTemp() command are listed in Table 54:
Table 5-4.
GetTemp0() Error Codes
Error Code
Description
0x8000
General sensor error
0x8002
Sensor is operational, but has detected a temperature below its operational
range (underflow)
§
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Thermal Specifications and Design Considerations
86
Datasheet
Features
6
Features
6.1
Power-On Configuration Options
Several configuration options can be configured by hardware. The processor samples
the hardware configuration at reset, on the active-to-inactive transition of RESET#. For
specifications on these options, refer to Table 6-1.
The sampled information configures the processor for subsequent operation. These
configuration options cannot be changed except by another reset. All resets reconfigure
the processor; for configuration purposes, the processor does not distinguish between
a "warm" reset and a "power-on" reset.
Table 6-1.
Power-On Configuration Option Signals
Configuration Option
Output tristate
Execute BIST
Signal1,2
SMI#
A3#
Disable dynamic bus parking
A25#
Symmetric agent arbitration ID
BR0#
RESERVED
A[24:4]#, A[35:26]#
NOTE:
1.
Asserting this signal during RESET# will select the corresponding option.
2.
Address signals not identified in this table as configuration options should not be asserted
during RESET#.
3.
Disabling of any of the cores within a Yorkfield processor must be handled by configuring
the EXT_CONFIG Model Specific Register (MSR). This MSR will allow for the disabling of a
single core per die within the Yorkfield package.
6.2
Clock Control and Low Power States
The processor allows the use of AutoHALT and Stop-Grant states to reduce power
consumption by stopping the clock to internal sections of the processor, depending on
each particular state. See Figure 6-1 for a visual representation of the processor low
power states.
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87
Features
Figure 6-1.
Processor Low Power State Machine
HALT or MWAIT Instruction and
HALT Bus Cycle Generated
Normal State
- Normal Execution
STPCLK#
Asserted
STPCLK#
De-asserted
INIT#, INTR, NMI, SMI#, RESET#,
FSB interrupts
STPCLK#
Asserted
Extended HALT or HALT
State
- BCLK running
- Snoops and interrupts
allowed
Snoop
Event
Occurs
Snoop
Event
Serviced
STPCLK#
De-asserted
Extended HALT Snoop or
HALT Snoop State
- BCLK running
- Service Snoops to caches
Stop Grant State
- BCLK running
- Snoops and interrupts
allowed
6.2.1
Snoop Event Occurs
Snoop Event Serviced
Stop Grant Snoop State
- BCLK running
- Service Snoops to caches
Normal State
This is the normal operating state for the processor.
6.2.2
HALT and Extended HALT Powerdown States
The processor supports the HALT or Extended HALT powerdown state. The Extended
HALT Powerdown state must be configured and enabled via the BIOS for the processor
to remain within specification.
The Extended HALT state is a lower power state as compared to the Stop Grant State.
If Extended HALT is not enabled, the default Powerdown state entered will be HALT.
Refer to the sections below for details about the HALT and Extended HALT states.
6.2.2.1
HALT Powerdown State
HALT is a low power state entered when all the processor cores have executed the HALT
or MWAIT instructions. When one of the processor cores executes the HALT instruction,
that processor core is halted, however, the other processor continues normal operation.
The halted core will transition to the Normal state upon the occurrence of SMI#, INIT#,
or LINT[1:0] (NMI, INTR). RESET# will cause the processor to immediately initialize
itself.
The return from a System Management Interrupt (SMI) handler can be to either
Normal Mode or the HALT Power Down state. See the Intel Architecture Software
Developer's Manual, Volume 3B: System Programming Guide, Part 2 for more
information.
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The system can generate a STPCLK# while the processor is in the HALT Power Down
state. When the system deasserts the STPCLK# interrupt, the processor will return
execution to the HALT state.
While in HALT Power Down state, the processor will process bus snoops.
6.2.2.2
Extended HALT Powerdown State
Extended HALT is a low power state entered when all processor cores have executed
the HALT or MWAIT instructions and Extended HALT has been enabled via the BIOS.
When one of the processor cores executes the HALT instruction, that logical processor
is halted; however, the other processor continues normal operation. The Extended
HALT Powerdown must be enabled via the BIOS for the processor to remain within its
specification.
The processor will automatically transition to a lower frequency and voltage operating
point before entering the Extended HALT state. Note that the processor FSB frequency
is not altered; only the internal core frequency is changed. When entering the low
power state, the processor will first switch to the lower bus ratio and then transition to
the lower VID.
While in Extended HALT state, the processor will process bus snoops.
The processor exits the Extended HALT state when a break event occurs. When the
processor exits the Extended HALT state, it will first transition the VID to the original
value and then change the bus ratio back to the original value.
6.2.3
Stop Grant State
When the STPCLK# signal is asserted, the Stop Grant state of the processor is entered
20 bus clocks after the response phase of the processor-issued Stop Grant
Acknowledge special bus cycle.
Since the GTL+ signals receive power from the FSB, these signals should not be driven
(allowing the level to return to VTT) for minimum power drawn by the termination
resistors in this state. In addition, all other input signals on the FSB should be driven to
the inactive state.
RESET# will cause the processor to immediately initialize itself, but the processor will
stay in Stop-Grant state. A transition back to the Normal state will occur with the deassertion of the STPCLK# signal.
A transition to the Grant Snoop state will occur when the processor detects a snoop on
the FSB (see Section 6.2.4).
While in the Stop-Grant State, SMI#, INIT# and LINT[1:0] will be latched by the
processor, and only serviced when the processor returns to the Normal State. Only one
occurrence of each event will be recognized upon return to the Normal state.
While in Stop-Grant state, the processor will process a FSB snoop.
6.2.4
Extended HALT Snoop or HALT Snoop State,
Stop Grant Snoop State
The Extended HALT Snoop State is used in conjunction with the Extended HALT state. If
Extended HALT state is not enabled in the BIOS, the default Snoop State entered will
be the HALT Snoop State. Refer to the sections below for details on HALT Snoop State,
Grant Snoop State and Extended HALT Snoop State.
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Features
6.2.4.1
HALT Snoop State, Stop Grant Snoop State
The processor will respond to snoop transactions on the FSB while in Stop-Grant state
or in HALT Power Down state. During a snoop transaction, the processor enters the
HALT Snoop State:Stop Grant Snoop state. The processor will stay in this state until the
snoop on the FSB has been serviced (whether by the processor or another agent on the
FSB). After the snoop is serviced, the processor will return to the Stop Grant state or
HALT Power Down state, as appropriate.
6.2.4.2
Extended HALT Snoop State
The Extended HALT Snoop State is the default Snoop State when the Extended HALT
state is enabled via the BIOS. The processor will remain in the lower bus ratio and VID
operating point of the Extended HALT state.
While in the Extended HALT Snoop State, snoops are handled the same way as in the
HALT Snoop State. After the snoop is serviced the processor will return to the Extended
HALT state.
6.2.5
Enhanced Intel SpeedStep® Technology
The processor supports Enhanced Intel SpeedStep Technology. This technology enables
the processor to switch between frequency and voltage points, which may result in
platform power savings. In order to support this technology, the system must support
dynamic VID transitions. Switching between voltage/frequency states is software
controlled.
Enhanced Intel SpeedStep Technology is a technology that creates processor
performance states (P states). P states are power consumption and capability states
within the Normal state as shown in Figure 6-1. Enhanced Intel SpeedStep Technology
enables real-time dynamic switching between frequency and voltage points. It alters
the performance of the processor by changing the bus to core frequency ratio and
voltage. This allows the processor to run at different core frequencies and voltages to
best serve the performance and power requirements of the processor and system. Note
that the front side bus is not altered; only the internal core frequency is changed. In
order to run at reduced power consumption, the voltage is altered in step with the bus
ratio.
The following are key features of Enhanced Intel SpeedStep Technology:
• Voltage/Frequency selection is software controlled by writing to processor MSR's
(Model Specific Registers), thus eliminating chipset dependency.
- If the target frequency is higher than the current frequency, Vcc is incremented in
steps (+12.5 mV) by placing a new value on the VID signals after which the
processor shifts to the new frequency. Note that the top frequency for the
processor can not be exceeded.
- If the target frequency is lower than the current frequency, the processor shifts to
the new frequency and Vcc is then decremented in steps (-12.5 mV) by changing
the target VID through the VID signals.
6.2.6
Processor Power Status Indicator (PSI) Signal
The processor incorporates the PSI# signal that is asserted when the processor is in a
reduced power consumption state. PSI# can be used to improve efficiency of the
voltage regulator, resulting in platform power savings. For details, refer to the
compatible chipset Platform Design Guide and Voltage Regulator-Down (VRD) 11.1
Processor Power Delivery Design Guidelines.
PSI# may be asserted only when the processor is in the Deeper Sleep state.
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Boxed Processor Specifications
7
Boxed Processor Specifications
7.1
Introduction
The processor will also be offered as an Intel boxed processor. Intel boxed processors
are intended for system integrators who build systems from baseboards and standard
components. The boxed processor will be supplied with a cooling solution. This chapter
documents baseboard and system requirements for the cooling solution that will be
supplied with the boxed processor. This chapter is particularly important for OEMs that
manufacture baseboards for system integrators.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets]. Figure 7-1 shows a mechanical representation of a boxed
processor.
Note:
Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their proprietary
cooling solution when designing to the required keep-out zone on their system
platforms and chassis. Refer to the Yorkfield Processor Thermal and Mechanical Design
Guidelines Addendum for further guidance. Contact your local Intel Sales
Representative for this document.
Figure 7-1.
Mechanical Representation of the Boxed Processor
NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
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Boxed Processor Specifications
7.2
Mechanical Specifications
7.2.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed processor. The
boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a
mechanical representation of the boxed processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in Figure 7-2 (Side View), and Figure 7-3 (Top
View). The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in Figure 7-7 and Figure 7-8. Note that some figures have centerlines shown
(marked with alphabetic designations) to clarify relative dimensioning.
Figure 7-2.
Side View Space Requirements for the Boxed Processor
95.0
[3.74]
81.3
[3.2]
10.0
[0.39]
25.0
[0.98]
Boxed_Proc_SideView
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Boxed Processor Specifications
Figure 7-3.
Top View Space Requirements for the Boxed Processor
95.0
[3.74]
95.0
[3.74]
Boxed_Proc_TopView
NOTES:
1.
Diagram does not show the attached hardware for the clip design and is provided only as a
mechanical representation.
Figure 7-4.
Overall View Space Requirements for the Boxed Processor
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Boxed Processor Specifications
7.2.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 450 grams. See Chapter 5
and the Yorkfield Processor Thermal and Mechanical Design Guidelines Addendum for
details on the processor weight and heatsink requirements.
7.2.3
Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly
The boxed processor thermal solution requires a heatsink attach clip assembly, to
secure the processor and fan heatsink in the baseboard socket. The boxed processor
will ship with the heatsink attach clip assembly.
7.3
Electrical Requirements
7.3.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12V power supply. A fan power cable
will be shipped with the boxed processor to draw power from a power header on the
baseboard. The power cable connector and pinout are shown in Figure 7-5. Baseboards
must provide a matched power header to support the boxed processor. Table 7-1
contains specifications for the input and output signals at the fan heatsink connector.
The fan heatsink outputs a SENSE signal, which is an open- collector output that pulses
at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to
match the system board-mounted fan speed monitor requirements, if applicable. Use of
the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector
should be tied to GND.
The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the
connector labeled as CONTROL.
The boxed processor's fanheat sink requires a constant +12 V supplied to pin 2 and
does not support variable voltage control or 3-pin PWM control.
The power header on the baseboard must be positioned to allow the fan heatsink power
cable to reach it. The power header identification and location should be documented in
the platform documentation, or on the system board itself. Figure 7-6 shows the
location of the fan power connector relative to the processor socket. The baseboard
power header should be positioned within 110 mm [4.33 inches] from the center of the
processor socket.
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Figure 7-5.
Boxed Processor Fan Heatsink Power Cable Connector Description
Pin
1
2
3
4
Signal
GND
+12 V
SENSE
CONTROL
Straight square pin, 4-pin terminal housing with
polarizing ribs and friction locking ramp.
0.100" pitch, 0.025" square pin width.
Match with straight pin, friction lock header on
mainboard.
1 2 3 4
Table 7-1.
Fan Heatsink Power and Signal Specifications
Description
Min
Typ
Max
11.4
12
12.6
- Maximum fan steady-state current draw
—
1.2
—
A
- Average fan steady-state current draw
—
0.5
—
A
- Maximum fan start-up current draw
—
2.2
—
A
- Fan start-up current draw maximum
duration
—
1.0
—
Second
SENSE: SENSE frequency
—
2
—
pulses per
fan
revolution
1
CONTROL
21
25
28
kHz
2, 3
+12V: 12 volt fan power supply
Unit
V
Notes
-
IC:
-
NOTES:
1. Baseboard should pull this pin up to 5V with a resistor.
2. Open drain type, pulse width modulated.
3. Fan will have pull-up resistor for this signal to maximum of 5.25 V.
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Boxed Processor Specifications
Figure 7-6.
Baseboard Power Header Placement Relative to Processor Socket
B
R110
[4.33]
C
Boxed_Proc_PwrHeaderPlacement
7.4
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by
the boxed processor.
7.4.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is found in Chapter 5 of this document. The boxed processor
fan heatsink is able to keep the processor temperature within the specifications (see
Table 5-1) in chassis that provide good thermal management. For the boxed processor
fan heatsink to operate properly, it is critical that the airflow provided to the fan
heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the
sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow
through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink
reduces the cooling efficiency and decreases fan life. Figure 7-7 and Figure 7-8
illustrate an acceptable airspace clearance for the fan heatsink. The air temperature
entering the fan should be kept below 38 ºC. Again, meeting the processor's
temperature specification is the responsibility of the system integrator.
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Figure 7-7.
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)
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Boxed Processor Specifications
Figure 7-8.
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view)
7.4.2
Variable Speed Fan
If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin
motherboard header it will operate as follows:
The boxed processor fan will operate at different speeds over a short range of internal
chassis temperatures. This allows the processor fan to operate at a lower speed and
noise level, while internal chassis temperatures are low. If internal chassis temperature
increases beyond a lower set point, the fan speed will rise linearly with the internal
temperature until the higher set point is reached. At that point, the fan speed is at its
maximum. As fan speed increases, so does fan noise levels. Systems should be
designed to provide adequate air around the boxed processor fan heatsink that remains
cooler then lower set point. These set points, represented in Figure 7-9 and Table 7-2,
can vary by a few degrees from fan heatsink to fan heatsink. The internal chassis
temperature should be kept below 38 ºC. Meeting the processor's temperature
specification (see Chapter 5) is the responsibility of the system integrator.
The motherboard must supply a constant +12V to the processor's power header to
ensure proper operation of the variable speed fan for the boxed processor. Refer to
Table 7-1 for the specific requirements.
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Figure 7-9.
Boxed Processor Fan Heatsink Set Points
Table 7-2.
Fan Heatsink Power and Signal Specifications
Boxed Processor
Fan Heatsink Set
Point (ºC)
Boxed Processor Fan Speed
X ≤ 30
When the internal chassis temperature is below or equal to this
set point, the fan operates at its lowest speed. Recommended
maximum internal chassis temperature for nominal operating
environment.
1
Y = 35
When the internal chassis temperature is at this point, the fan
operates between its lowest and highest speeds. Recommended
maximum internal chassis temperature for worst-case operating
environment.
-
Z ≥ 39
When the internal chassis temperature is above or equal to this
set point, the fan operates at its highest speed.
-
Notes
NOTES:
1. Set point variance is approximately ± 1 °C from fan heatsink to fan heatsink.
If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin
motherboard header and the motherboard is designed with a fan speed controller with
PWM output (CONTROL see Table 7-1) and remote thermal diode measurement
capability the boxed processor will operate as follows:
As processor power has increased the required thermal solutions have generated
increasingly more noise. Intel has added an option to the boxed processor that allows
system integrators to have a quieter system in the most common usage.
The 4th wire PWM solution provides better control over chassis acoustics. This is
achieved by more accurate measurement of processor die temperature through the
processor's Digital Thermal Sensors (DTS) and PECI. Fan RPM is modulated through the
use of an ASIC located on the motherboard that sends out a PWM control signal to the
4th pin of the connector labeled as CONTROL. The fan speed is based on actual
processor temperature instead of internal ambient chassis temperatures.
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Boxed Processor Specifications
If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard
CPU fan header it will default back to a thermistor controlled mode, allowing
compatibility with existing 3-pin baseboard designs. Under thermistor controlled mode,
the fan RPM is automatically varied based on the Tinlet temperature measured by a
thermistor located at the fan inlet.
For more details on specific motherboard requirements for 4-wire based fan speed
control see the Yorkfield Processor Thermal and Mechanical Design Guidelines
Addendum.
§
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Debug Tools Specifications
8
Debug Tools Specifications
Refer to the Debug Port Design Guide for UP / DP Systems and the appropriate
platform design guidelines for information regarding debug tools specifications.
8.1
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces
(LAIs) for use in debugging Yorkfield processor systems. Tektronix and Agilent should
be contacted to get specific information about their logic analyzer interfaces. The
following information is general in nature. Specific information must be obtained from
the logic analyzer vendor.
Due to the complexity of Yorkfield processor systems, the LAI is critical in providing the
ability to probe and capture FSB signals. There are two sets of considerations to keep in
mind when designing a Yorkfield processor system that can make use of an LAI:
mechanical and electrical.
8.1.1
Mechanical Considerations
The LAI is installed between the processor socket and the Yorkfield processor. The LAI
lands plug into the processor socket, while the Yorkfield processor lands plug into a
socket on the LAI. Cabling that is part of the LAI egresses the system to allow an
electrical connection between the Yorkfield processor and a logic analyzer. The
maximum volume occupied by the LAI, known as the keepout volume, as well as the
cable egress restrictions, should be obtained from the logic analyzer vendor. System
designers must make sure that the keepout volume remains unobstructed inside the
system. Note that it is possible that the keepout volume reserved for the LAI may differ
from the space normally occupied by the Yorkfield processors heatsink. If this is the
case, the logic analyzer vendor will provide a cooling solution as part of the LAI.
8.1.2
Electrical Considerations
The LAI will also affect the electrical performance of the FSB; therefore, it is critical to
obtain electrical load models from each of the logic analyzers to be able to run system
level simulations to prove that their tool will work in the system. Contact the logic
analyzer vendor for electrical specifications and load models for the LAI solution it
provides.
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