Intel® Desktop Board
D945GTP
Technical Product Specification
May 2005
Order Number: D14070-001US
The Intel® Desktop Board D945GTP may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D945GTP Specification Update.
Revision History
Revision
-001
Revision History
First release of the
Specification.
Date
Intel®
Desktop Board D945GTP Technical Product
May 2005
This product specification applies to only the standard Intel Desktop Board D945GTP with BIOS
identifier NT94510J.86A.
Changes to this specification will be published in the Intel Desktop Board D945GTP Specification
Update before being incorporated into a revision of this document.
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Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
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published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
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Copyright © 2005, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for the Intel® Desktop Board D945GTP. It
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board D945GTP
and its components to the vendors, system integrators, and other engineers and technicians who
need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter
1
2
3
4
Description
A description of the hardware used on the Desktop Board D945GTP
A map of the resources of the Desktop Board
The features supported by the BIOS Setup program
A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
#
INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel Desktop Board D945GTP Technical Product Specification
Other Common Notation
iv
#
Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX)
When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Board D945GTP, and X is the instance of the
particular part at that general location. For example, J5J1 is a connector, located at 5J. It is
the first connector in the 5J area.
GB
Gigabyte (1,073,741,824 bytes)
GB/sec
Gigabytes per second
Gbits/sec
Gigabits per second
KB
Kilobyte (1024 bytes)
Kbit
Kilobit (1024 bits)
kbits/sec
1000 bits per second
MB
Megabyte (1,048,576 bytes)
MB/sec
Megabytes per second
Mbit
Megabit (1,048,576 bits)
Mbit/sec
Megabits per second
xxh
An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V
Volts. Voltages are DC unless otherwise specified.
*
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
Contents
1 Product Description
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
Overview ...................................................................................................................... 10
1.1.1
Feature Summary.......................................................................................... 10
1.1.2
Manufacturing Options .................................................................................. 11
1.1.3
Board Layout ................................................................................................. 12
1.1.4
Block Diagram ............................................................................................... 14
Online Support ............................................................................................................. 15
Processor ..................................................................................................................... 15
System Memory ........................................................................................................... 16
1.4.1
Memory Configurations ................................................................................. 17
Intel® 945G Chipset ..................................................................................................... 21
1.5.1
Intel 945G Graphics Subsystem.................................................................... 21
1.5.2
USB ............................................................................................................... 23
1.5.3
IDE Support ................................................................................................... 24
1.5.4
Real-Time Clock, CMOS SRAM, and Battery................................................ 26
PCI Express* Connectors ............................................................................................ 26
IEEE-1394a Connectors (Optional).............................................................................. 26
Legacy I/O Controller ................................................................................................... 27
1.8.1
Serial Port...................................................................................................... 27
1.8.2
Parallel Port ................................................................................................... 27
1.8.3
Diskette Drive Controller................................................................................ 27
1.8.4
Keyboard and Mouse Interface ..................................................................... 27
Audio Subsystem ......................................................................................................... 28
1.9.1
Audio Subsystem Software ........................................................................... 28
1.9.2
Audio Connectors .......................................................................................... 28
1.9.3
8-Channel (7.1) Audio Subsystem................................................................. 28
1.9.4
6-Channel (5.1) Audio Subsystem................................................................. 30
LAN Subsystem ........................................................................................................... 31
1.10.1 LAN Subsystem Software.............................................................................. 31
1.10.2 10/100 Mbits/sec LAN Subsystem................................................................. 31
1.10.3 Gigabit LAN Subsystem ................................................................................ 32
1.10.4 Intel® Active Management Technology (Optional)......................................... 33
1.10.5 Alert Standard Format (ASF) Support (Optional) .......................................... 35
Hardware Management Subsystem............................................................................. 35
1.11.1 Hardware Monitoring and Fan Control ASIC ................................................. 36
1.11.2 Chassis Intrusion and Detection.................................................................... 36
1.11.3 Fan Monitoring............................................................................................... 36
1.11.4 Thermal Monitoring........................................................................................ 37
Power Management ..................................................................................................... 38
1.12.1 ACPI .............................................................................................................. 38
1.12.2 Hardware Support ......................................................................................... 40
Trusted Platform Module (Optional) ............................................................................. 44
v
Intel Desktop Board D945GTP Technical Product Specification
2 Technical Reference
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
2.15
Introduction .................................................................................................................. 45
Memory Resources ...................................................................................................... 45
2.2.1
Addressable Memory..................................................................................... 45
2.2.2
Memory Map.................................................................................................. 47
DMA Channels ............................................................................................................. 47
Fixed I/O Map............................................................................................................... 48
PCI Configuration Space Map...................................................................................... 49
Interrupts ...................................................................................................................... 50
PCI Conventional Interrupt Routing Map ..................................................................... 51
Connectors................................................................................................................... 53
2.8.1
Back Panel Connectors ................................................................................. 53
2.8.2
Component-side Connectors......................................................................... 56
Jumper Block ............................................................................................................... 65
Mechanical Considerations .......................................................................................... 66
2.10.1 Form Factor ................................................................................................... 66
2.10.2 I/O Shield....................................................................................................... 67
Electrical Considerations.............................................................................................. 69
2.11.1 DC Loading.................................................................................................... 69
2.11.2 Add-in Board Considerations......................................................................... 69
2.11.3 Fan Connector Current Capability ................................................................. 70
2.11.4 Power Supply Considerations ....................................................................... 70
Thermal Considerations ............................................................................................... 71
Reliability...................................................................................................................... 73
Environmental .............................................................................................................. 74
Regulatory Compliance................................................................................................ 75
2.15.1 Safety Regulations ........................................................................................ 75
2.15.2 EMC Regulations........................................................................................... 75
2.15.3 European Union Declaration of Conformity Statement.................................. 76
2.15.4 Recycling Considerations .............................................................................. 77
2.15.5 Product Certification Markings (Board Level) ................................................ 78
3 Overview of BIOS Features
3.1
3.2
3.3
3.4
3.5
3.6
3.7
vi
Introduction .................................................................................................................. 79
BIOS Flash Memory Organization ............................................................................... 80
Resource Configuration ............................................................................................... 80
3.3.1
PCI Autoconfiguration.................................................................................... 80
3.3.2
PCI IDE Support ............................................................................................ 80
System Management BIOS (SMBIOS) ........................................................................ 81
Legacy USB Support.................................................................................................... 81
BIOS Updates .............................................................................................................. 82
3.6.1
Language Support ......................................................................................... 82
3.6.2
Custom Splash Screen.................................................................................. 82
Boot Options ................................................................................................................ 83
3.7.1
CD-ROM Boot ............................................................................................... 83
3.7.2
Network Boot ................................................................................................. 83
3.7.3
Booting Without Attached Devices ................................................................ 83
3.7.4
Changing the Default Boot Device During POST .......................................... 83
Contents
3.8
3.9
Adjusting Boot Speed................................................................................................... 84
3.8.1
Peripheral Selection and Configuration ......................................................... 84
3.8.2
BIOS Boot Optimizations............................................................................... 84
BIOS Security Features ............................................................................................... 85
4 Error Messages and Beep Codes
4.1
4.2
4.3
4.4
Speaker ....................................................................................................................... 87
BIOS Beep Codes........................................................................................................ 87
BIOS Error Messages .................................................................................................. 87
Port 80h POST Codes ................................................................................................. 88
Figures
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
Board Components ...................................................................................................... 12
Block Diagram.............................................................................................................. 14
Memory Channel and DIMM Configuration .................................................................. 17
Dual Channel (Interleaved) Mode Configuration with Two DIMMs .............................. 18
Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................ 18
Dual Channel (Interleaved) Mode Configuration with Four DIMMs.............................. 19
Single Channel (Asymmetric) Mode Configuration with One DIMM............................. 20
Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................ 20
Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem .... 29
8-channel (7.1) Audio Subsystem Block Diagram........................................................ 29
Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem .... 30
6-Channel (5.1) Audio Subsystem Block Diagram....................................................... 30
LAN Connector LED Locations .................................................................................... 32
LAN Connector LED Locations .................................................................................... 33
Thermal Sensors and Fan Connectors ........................................................................ 37
Location of the Standby Power Indicator LED ............................................................. 44
Detailed System Memory Address Map ....................................................................... 46
Back Panel Connectors for 8-Channel (7.1) Audio Subsystem ................................... 54
Back Panel Connectors for 6-Channel (5.1) Audio Subsystem ................................... 55
Component-side Connectors ....................................................................................... 56
Connection Diagram for Front Panel Connector .......................................................... 62
Connection Diagram for Front Panel USB Connectors................................................ 64
Connection Diagram for IEEE 1394a Connectors........................................................ 64
Location of the Jumper Block....................................................................................... 65
Board Dimensions........................................................................................................ 66
I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem............ 67
I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem............ 68
Processor Heatsink for Omni-directional Airflow.......................................................... 71
Localized High Temperature Zones ............................................................................. 72
vii
Intel Desktop Board D945GTP Technical Product Specification
Tables
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
47.
viii
Feature Summary ........................................................................................................ 10
Manufacturing Options ................................................................................................. 11
Board Components Shown in Figure 1 ........................................................................ 13
Supported Memory Configurations .............................................................................. 16
LAN Connector LED States ......................................................................................... 32
LAN Connector LED States ......................................................................................... 33
Effects of Pressing the Power Switch .......................................................................... 38
Power States and Targeted System Power ................................................................. 39
Wake-up Devices and Events ...................................................................................... 40
System Memory Map ................................................................................................... 47
DMA Channels ............................................................................................................. 47
I/O Map ........................................................................................................................ 48
PCI Configuration Space Map...................................................................................... 49
Interrupts ...................................................................................................................... 50
PCI Interrupt Routing Map ........................................................................................... 51
Back Panel Connectors Shown in Figure 18................................................................ 54
Back Panel Connectors Shown in Figure 19................................................................ 55
Component-side Connectors Shown in Figure 20 ....................................................... 57
Front Panel Audio Connector....................................................................................... 58
Chassis Intrusion Connector ........................................................................................ 58
SCSI Hard Drive Activity LED Connector (Optional) .................................................... 58
Serial ATA Connectors................................................................................................. 58
Processor Fan Connector ............................................................................................ 59
Front and Rear Chassis Fan Connectors..................................................................... 59
Main Power Connector................................................................................................. 60
ATX12V Power Connector ........................................................................................... 60
Auxiliary Front Panel Power/Sleep LED Connector ..................................................... 61
Front Panel Connector ................................................................................................. 62
States for a One-Color Power LED .............................................................................. 63
States for a Two-Color Power LED .............................................................................. 63
BIOS Setup Configuration Jumper Settings................................................................. 65
DC Loading Characteristics ......................................................................................... 69
Fan Connector Current Capability................................................................................ 70
Thermal Considerations for Components .................................................................... 73
Environmental Specifications ....................................................................................... 74
Safety Regulations ....................................................................................................... 75
EMC Regulations ......................................................................................................... 75
Product Certification Markings ..................................................................................... 78
BIOS Setup Program Menu Bar................................................................................... 80
BIOS Setup Program Function Keys............................................................................ 80
Boot Device Menu Options .......................................................................................... 83
Supervisor and User Password Functions ................................................................... 85
Beep Codes ................................................................................................................. 87
BIOS Error Messages .................................................................................................. 87
Port 80h POST Code Ranges...................................................................................... 88
Port 80h POST Codes ................................................................................................. 89
Typical Port 80h POST Sequence ............................................................................... 92
1 Product Description
What This Chapter Contains
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
Overview ...................................................................................................................... 10
Online Support ............................................................................................................. 15
Processor ..................................................................................................................... 15
System Memory ........................................................................................................... 16
Intel® 945G Chipset ..................................................................................................... 21
PCI Express* Connectors ............................................................................................ 26
IEEE-1394a Connectors (Optional).............................................................................. 26
Legacy I/O Controller ................................................................................................... 27
Audio Subsystem ......................................................................................................... 28
LAN Subsystem ........................................................................................................... 31
Hardware Management Subsystem............................................................................. 35
Power Management ..................................................................................................... 38
Trusted Platform Module (Optional) ............................................................................. 44
9
Intel Desktop Board D945GTP Technical Product Specification
1.1 Overview
1.1.1
Feature Summary
Table 1 summarizes the major features of the board.
Table 1.
Feature Summary
Form Factor
microATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])
Processor
Support for an Intel® Pentium® 4 processor in an LGA775 socket with a 1066, 800,
or 533 MHz system bus
Memory
• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 667, DDR2 533, or DDR2 400 MHz DIMMs
• Support for up to 4 GB of system memory
Chipset
Intel® 945G Chipset, consisting of:
• Intel® 82945G Graphics Memory Controller Hub (GMCH)
• Intel® 82801G I/O Controller Hub (ICH7)
Video
Intel® GMA950 onboard graphics subsystem
Audio
Refer to Table 2 on page 11 for a description of audio subsystem options
Legacy I/O Control
Legacy I/O controller for diskette drive, serial, parallel, and PS/2* ports
USB
Support for USB 2.0 devices
Peripheral
Interfaces
• Eight USB ports
• One serial port
• One parallel port
• Four Serial ATA interfaces
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
• One diskette drive interface
• PS/2 keyboard and mouse ports
LAN Support
Refer to Table 2 on page 11 for a description of LAN subsystem options.
BIOS
• Intel® BIOS (resident in the SPI Flash device)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Expansion
Capabilities
• Two PCI Conventional* bus connectors
• One PCI Express* x1 bus add-in card connector
• One PCI Express x16 bus add-in card connector
Instantly Available
PC Technology
• Support for PCI Local Bus Specification Revision 2.3
• Support for PCI Express Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
Hardware Monitor
Subsystem
• Hardware monitoring and fan control ASIC
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan connectors
• Three fan sense inputs used to monitor fan activity
• Fan speed control
10
Product Description
1.1.2
Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is available in all
marketing channels. Please contact your Intel representative to determine which manufacturing
options are available to you.
Table 2.
Manufacturing Options
Audio Subsystem
Intel® High Definition Audio subsystem in one of the following configurations:
• 8-channel (7.1) audio subsystem with five analog audio outputs and two S/PDIF
digital audio outputs (coaxial and optical) using the Sigmatel* 9223 audio codec
• 6-channel (5.1) audio subsystem with three analog audio outputs using the
Sigmatel 9220 audio codec
IEEE-1394a
Interface
IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector,
two front-panel connectors)
LAN subsystem
The board provides one of the following:
• Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the
Intel® 82573E/82573V/82574V Gigabit Ethernet Controller
• 10/100 Mbits/sec LAN subsystem using the Intel® 82562GX/82562GZ Platform
LAN Connect (PLC) device
SATA RAID
Intel® 82801GR I/O Controller Hub (ICH7-R) for RAID support (levels 0,1, 0+1, and 5)
on the SATA interface
SCSI Hard Drive
Activity LED
Connector
Allows add-in hard drive controllers (SCSI or other) to use the same LED as the
onboard IDE controller.
Trusted Platform
Module (TPM),
revision 1.2
A component that enhances platform security
For information about
Refer to
Available configurations for the board
Section 1.2, page 15
11
Intel Desktop Board D945GTP Technical Product Specification
1.1.3
Board Layout
Figure 1 shows the location of the major components.
A
D
B
C
E
F
G
H
FF
EE
I
DD
CC
J
BB
AA
K
Z
L
Y
M
N
X
T
V
W
S
R
Q
P
O
U
OM17835
Figure 1. Board Components
Table 3 lists the components identified in Figure 1.
12
Product Description
Table 3.
Board Components Shown in Figure 1
Item/callout
from Figure 1
Description
A
Audio codec
B
Front panel audio connector
C
Ethernet device
D
PCI Conventional bus add-in card connectors [2]
E
PCI Express x16 bus add-in card connector
F
Back panel connectors
G
+12V power connector (ATX12V)
H
Rear chassis fan connector
I
LGA775 processor socket
J
Intel 82945G GMCH
K
Processor fan connector
L
DIMM Channel A sockets [2]
M
DIMM Channel B sockets [2]
N
SCSI LED connector (optional)
O
Legacy I/O controller
P
Power connector
Q
Diskette drive connector
R
Parallel ATE IDE connector
S
Battery
T
Front chassis fan connector
U
BIOS Setup configuration jumper block
V
Serial ATA connectors [4]
W
Auxiliary front panel power LED connector
X
Front panel connector
Y
Front panel USB connectors [2]
Z
Chassis intrusion connector
AA
Intel 82801G I/O Controller Hub (ICH7)
BB
SPI flash device
CC
IEEE-1394a controller (optional)
DD
Front panel IEEE-1394a connectors (optional) [2]
EE
Speaker
FF
PCI Express x1 bus add-in card connector
13
Intel Desktop Board D945GTP Technical Product Specification
1.1.4
Block Diagram
Figure 2 is a block diagram of the major functional areas.
Gigabit Ethernet
Controller (Optional)
PCI Express x1 Interface
PCI Express x1 Slot 1
LAN
Connector
Back Panel/Front Panel
USB Ports
USB
Serial Port
Parallel ATA
IDE Connector
Legacy
I/O
Controller
Parallel ATA
IDE Interface
Parallel Port
PS/2 Mouse
PS/2 Keyboard
PCI Express
x16 Interface
System Bus
(1066/800/533 MHz)
Intel 945G Chipset
Intel 82945G
Graphics and
Memory Controller
Hub (GMCH)
PCI Express
x16
Connector
Display Interface
LAN Connect
Interface
Channel A
DIMMs (2)
Intel 82801G
I/O Controller Hub
(ICH7)
Dual-Channel
Memory Bus
SMBus
Channel B
DIMMs (2)
IEEE-1394a Connectors
(optional)
IEEE-1394a
Controller
(optional)
PCI
Bus
High Definition Audio Link
VGA
Port
Diskette Drive
Connector
LPC
Bus
DMI Interconnect
LGA775
Processor Socket
Serial Peripheral
Interface (SPI)
Flash Device
TPM Component
(Optional)
LPC
Bus
10/100
LAN PLC
(Optional)
Serial ATA
IDE Interface
LAN
Connector
Serial ATA IDE
Connectors (4)
Line Out
PCI Bus
Mic In
Line In/Retasking Jack
PCI Slot 1
PCI Slot 2
Line Out/Retasking Jack
SMBus
Audio
Codec
Hardware Monitoring
and Fan Control ASIC
Mic In/Retasking Jack
Center and LFE/
Retasking Jack (optional)
Surround L-R/
Retasking Jack (optional)
S/PDIF (optional)
= connector or socket
OM17836
Figure 2. Block Diagram
14
Product Description
1.2 Online Support
To find information about…
Visit this World Wide Web site:
Intel Desktop Board D945GTP under
“Desktop Board Products” or “Desktop
Board Support”
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
Available configurations for the Desktop
Board D945GTP
http://developer.intel.com/design/motherbd/tp/tp_available.htm
Processor data sheets
http://www.intel.com/design/litcentr
ICH7 addressing
http://developer.intel.com/products/chipsets
Custom splash screens
http://intel.com/design/motherbd/gen_indx.htm
Audio software and utilities
http://www.intel.com/design/motherbd
LAN software and drivers
http://www.intel.com/design/motherbd
Supported video modes
http://www.intel.com/design/motherbd/tp/tp_documentation.htm
Intel® Active Management Technology
http://www.intel.com/technology/manage/iamt/index.htm
1.3 Processor
The board is designed to support Intel Pentium 4 processors in an LGA775 processor socket with a
1066, 800, or 533 MHz system bus. See the Intel web site listed below for the most up-to-date list
of supported processors.
For information about…
Refer to:
Supported processors
http://www.intel.com/design/motherbd/tp/tp_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
#
INTEGRATOR’S NOTE
Use only ATX12V-compliant power supplies.
For information about
Refer to
Power supply connectors
Section 2.8.2.1, page 60
15
Intel Desktop Board D945GTP Technical Product Specification
1.4 System Memory
The board has four DIMM sockets and support the following memory features:
•
•
1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
•
•
•
•
•
4 GB maximum total system memory. Refer to Section 2.2.1 on page 45 for information on the
total amount of addressable memory.
Minimum total system memory: 128 MB
Non-ECC DIMMs
Serial Presence Detect
DDR2 667, DDR2 533, or DDR2 400 MHz SDRAM DIMMs
NOTES
•
•
Remove the PCI Express x16 video card before installing or upgrading memory to avoid
interference with the memory retention mechanism.
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure.
This allows the BIOS to read the SPD data and program the chipset to accurately configure
memory settings for optimum performance. If non-SPD memory is installed, the BIOS will
attempt to correctly configure the memory settings, but performance and reliability may be
impacted or the DIMMs may not function under the determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4.
Supported Memory Configurations
DIMM
Capacity
Configuration
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
128 MB
SS
256 Mbit
16 M x 16/empty
4
256 MB
SS
256 Mbit
32 M x 8/empty
8
256 MB
SS
512 Mbit
32 M x 16/empty
4
512 MB
DS
256 Mbit
32 M x 8/32 M x 8
16
512 MB
SS
512 Mbit
64 M x 8/empty
8
512 MB
SS
1 Gbit
64 M x 16/empty
4
1024 MB
DS
512 Mbit
64 M x 8/64 M x 8
16
1024 MB
SS
1 Gbit
128 M x 8/empty
8
2048 MB
DS
1 Gbit
128 M x 8/128 M x 8
16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers
to single-sided memory modules (containing one row of SDRAM).
#
INTEGRATOR’S NOTE
It is possible to install four 2048 MB (2 GB) modules for a total of 8 GB of system memory,
however, only 4 GB of address space is available. Refer to Section 2.2.1, on page 45 for additional
information on available memory.
16
Product Description
1.4.1
Memory Configurations
The Intel 82945G GMCH supports two types of memory organization:
•
•
Dual channel (Interleaved) mode. This mode offers the highest throughput for real world
applications. Dual channel mode is enabled when the installed memory capacities of both
DIMM channels are equal. Technology and device width can vary from one channel to the
other but the installed memory capacity for each channel must be equal. If different speed
DIMMs are used between channels, the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth
operation for real world applications. This mode is used when only a single DIMM is installed
or the memory capacities are unequal. Technology and device width can vary from one
channel to the other. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black.
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17739
Figure 3. Memory Channel and DIMM Configuration
17
Intel Desktop Board D945GTP Technical Product Specification
1.4.1.1
Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0
(blue) sockets of both channels are populated with identical DIMMs.
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
1 GB
Channel B, DIMM 0
Channel B, DIMM 1
OM17123
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 5 shows a dual channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0
(blue) socket of Channel B.
256 MB
256 MB
Channel A, DIMM 0
Channel A, DIMM 1
512 MB
Channel B, DIMM 0
Channel B, DIMM 1
OM17122
Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
18
Product Description
Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in
Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
256 MB
512 MB
Channel B, DIMM 0
Channel B, DIMM 1
OM17124
Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
19
Intel Desktop Board D945GTP Technical Product Specification
1.4.1.2
Single Channel (Asymmetric) Mode Configurations
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory throughput.
Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0
(blue) socket of Channel A is populated. Channel B is not populated.
256 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17125
Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM
Figure 8 shows a single channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the
DIMM0 (blue) socket of Channel B.
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
512 MB
Channel B, DIMM 0
Channel B, DIMM 1
OM17126
Figure 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs
20
Product Description
1.5 Intel® 945G Chipset
The Intel 945G chipset consists of the following devices:
•
•
Intel 82945G Graphics Memory Controller Hub (GMCH) with Direct Media Interface (DMI)
interconnect
Intel 82801G I/O Controller Hub (ICH7) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI
interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D and
display capabilities. The ICH7 is a centralized controller for the board’s I/O paths.
For information about
Refer to
The Intel 945G chipset
http://developer.intel.com/
Resources used by the chipset
Chapter 2
1.5.1
Intel 945G Graphics Subsystem
The Intel 945G chipset contains two separate, mutually exclusive graphics options. Either the
GMA950 graphics controller (contained within the 82945G GMCH) is used, or a PCI Express x16
add-in card can be used. When a PCI Express x16 add-in card is installed, the GMA950 graphics
controller is disabled.
1.5.1.1
Intel® GMA950 Graphics Controller
The Intel GMA950 graphics controller features the following:
•
•
•
•
•
400 MHz core frequency
High performance 3-D setup and render engine
High quality texture engine
⎯ DX9* Compliant Hardware Pixel Shader 2.0
⎯ Alpha and luminance maps
⎯ Texture color-keying/chroma-keying
⎯ Cubic environment reflection mapping
⎯ Enhanced texture blending functions
3D Graphics Rendering enhancements
⎯ 1.3 Dual Texture GigaPixel/Sec Fill Rate
⎯ 16 and 32 bit color
⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz
⎯ Vertex cache
⎯ Anti-aliased lines
⎯ OpenGL* version 1.4 support with vertex buffer and EXT_Shadow extensions
2D Graphics enhancements
⎯ 8, 16,and 32 bit color
⎯ Optimized 256-bit BLT engine
⎯ Color space conversion
⎯ Anti-aliased lines
21
Intel Desktop Board D945GTP Technical Product Specification
•
Video
⎯ Hardware motion compensation for MPEG2
•
⎯ Software DVD at 30 fps full screen
Display
⎯ Integrated 24-bit 400 MHz RAMDAC
⎯ Up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ DDC2B compliant interface
⎯ With Advanced Digital Display 2 or 2+ (ADD2/ADD2+) cards, support for TV-out / TV-in
and DVI digital display connections
⎯ Supports flat panels up to 2048 x 1536 at 60Hz or digital CRT/HDTV at 1920 x 1080 at
85 Hz (with ADD2/ADD2+)
•
•
⎯ Two multiplexed DVO port interfaces with 200 MHz pixel clocks using an ADD2/ADD2+
card
Dynamic Video Memory Technology (DVMT) support up to 224 MB
Intel® Zoom Utility
For information about
Refer to
DVMT
Section 1.5.1.2, page 22
Obtaining graphics software and utilities
Section 1.2, page 15
1.5.1.2
Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through Direct AGP, and highly
efficient memory utilization. DVMT ensures the most efficient use of available system memory for
maximum 2-D/3-D graphics performance. Up to 224 MB of system memory can be allocated to
DVMT on systems that have 512 MB or more of total system memory installed. Up to 128 MB can
be allocated to DVMT on systems that have 256 MB but less than 512 MB of total installed system
memory. Up to 64 MB can be allocated to DVMT when less than 256 MB of system memory is
installed. DVMT returns system memory back to the operating system when the additional system
memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS
Setup program) for compatibility with legacy applications. An example of this would be when
using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate
additional system memory to the graphics buffer as needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
22
Product Description
1.5.1.3
Advanced Digital Display (ADD2/ADD2+) Card Support
The GMCH routes two multiplexed DVO ports that are each capable of driving up to a 200 MHz
pixel clock to the PCI Express x16 connector. The DVO ports can be paired for a dual channel
configuration to support up to a 400 MHz pixel clock. When an ADD2/ADD2+ card is detected,
the Intel GMA950 graphics controller is enabled and the PCI Express x16 connector is configured
for DVO mode. DVO mode enables the DVO ports to be accessed by the ADD2/ADD2+ card. An
ADD2/ADD2+ card can either be configured to support simultaneous display with the primary
VGA display or can be configured to support dual independent display as an extended desktop
configuration with different color depths and resolutions. ADD2/ADD2+ cards can be designed to
support the following configurations:
•
•
•
•
•
•
1.5.1.4
TV-Out (composite video)
Transition Minimized Differential Signaling (TMDS) for DVI 1.0
Low Voltage Differential Signaling (LVDS)
Single device operating in dual channel mode
VGA output
HDTV output
Configuration Modes
A list of supported modes for the Intel GMA950 graphics controller is available as a downloadable
document.
For information about
Refer to
Supported video modes for the board
Section 1.2, page 15
1.5.2
USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and
EHCI-compatible drivers.
The ICH7 provides the USB controller for all ports. The port arrangement is as follows:
•
•
Four ports are implemented with dual stacked back panel connectors adjacent to the audio
connectors
Four ports are routed to two separate front panel USB connectors
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the
requirements for full-speed devices.
For information about
Refer to
The location of the USB connectors on the back panel
Figure 19, page 55
The location of the front panel USB connectors
Figure 20, page 56
23
Intel Desktop Board D945GTP Technical Product Specification
1.5.3
IDE Support
The board provides five IDE interface connectors:
•
•
1.5.3.1
One parallel ATA IDE connector that supports two devices
Four serial ATA IDE connectors that support one device per connector
Parallel ATE IDE Interface
The ICH7’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
•
•
•
•
•
Programmed I/O (PIO): processor controls data transfer.
8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH7’s ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections,
noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
For information about
Refer to
The location of the Parallel ATA IDE connector
Figure 20, page 56
1.5.3.2
Serial ATA Interfaces
The ICH7’s Serial ATA controller offers four independent Serial ATA ports with a theoretical
maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a
maximum of four Serial ATA devices. A point-to-point interface is used for host to device
connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard
IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for configurations
using the Windows* XP and Windows 2000 operating systems.
24
Product Description
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power
supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about
Refer to
The location of the Serial ATA IDE connectors
Figure 20, page 56
1.5.3.3
Serial ATA RAID (Optional)
The optional ICH7-R supports the following RAID (Redundant Array of Independent Drives)
levels:
•
•
•
•
1.5.3.4
RAID 0 - data striping. Multiple physical drives can be teamed together to create one logical
drive. As data is written or retrieved from the logical drive, both drives operate in parallel, thus
increasing the throughput. The ICH7-R allows for more than two drives to be used in a
RAID 0 configuration.
RAID 1 - data mirroring. Multiple physical drives maintain duplicate sets of all data on
separate disk drives. Level 1 provides the highest data reliability because two complete copies
of all information are maintained. The ICH7-R allows for two or four drives to be used in a
RAID 1 configuration.
RAID 0+1 (or RAID 10) - data striping and mirroring. RAID 0+1 combines multiple mirrored
drives (RAID 1) with data striping (RAID 0) into a single array. This provides the highest
performance with data protection. Data is striped across all mirrored sets. RAID 0+1 utilizes
several drives to stripe data (increased performance) and then makes a copy of the striped
drives to provide redundancy. The mirrored disks eliminate the overhead and delay of parity.
RAID 5 - distributed parity. RAID Level 5 stripes data at a block level across several drives
and distributes parity among the drives; no single disk is devoted to parity. Because parity data
is distributed on each drive, read performance tends to be lower than other RAID types.
RAID 5 requires the use of three or four drives.
SCSI Hard Drive Activity LED Connector (Optional)
The SCSI hard drive activity LED connector is a 1 x 2-pin connector that allows an add-in
hard drive controller to use the same LED as the onboard IDE controller. For proper operation, this
connector should be wired to the LED output of the add-in hard drive controller. The LED
indicates when data is being read from, or written to, either the add-in hard drive controller or the
onboard IDE controller (Parallel ATA or Serial ATA).
For information about
Refer to
The location of the SCSI hard drive activity LED connector
Figure 20, page 56
The signal names of the SCSI hard drive activity LED connector
Table 21, page 58
25
Intel Desktop Board D945GTP Technical Product Specification
1.5.4
Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
1.6 PCI Express* Connectors
The board provides the following PCI Express connectors:
•
•
One PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec
One PCI Express x1 connector. The x1 interface supports simultaneous transfer speeds up to
500 MBytes/sec
The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the
underlying PCI Express architecture is compatible with PCI Conventional compliant operating
systems. Additional features of the PCI Express interface include the following:
•
•
•
•
•
•
Support for the PCI Express enhanced configuration mechanism
Automatic discovery, link training, and initialization
Support for Active State Power Management (ASPM)
SMBus 2.0 support
Wake# signal supporting wake events from ACPI S1, S3, S4, or S5
Software compatible with the PCI Power Management Event (PME) mechanism defined in the
PCI Power Management Specification Rev. 1.1
1.7 IEEE-1394a Connectors (Optional)
The optional IEEE-1394a interface addresses interconnection of both computer peripherals and
consumer electronics. The IEEE-1394a interface provides a throughput ranging from
100 Mbits/sec to 400 Mbits/sec. As a manufacturing option, the board includes three IEEE-1394a
connectors as follows:
•
•
26
One IEEE-1394a connector located on the back panel.
Two IEEE-1394a front-panel connectors located on the component side.
For information about
Refer to
The location of the back panel IEEE-1394a connector
Figure 18, page 54
The location of the front panel IEEE-1394a connectors
Figure 20, page 56
The signal names of the front panel IEEE-1394a connectors
Section 2.8.2.6, page 64
Product Description
1.8 Legacy I/O Controller
The legacy I/O controller provides the following features:
•
•
•
•
•
•
•
One serial port
One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
PS/2-style mouse and keyboard interfaces
Interface for one 1.44 MB or 2.88 MB diskette drive
Intelligent power management, including a programmable wake-up event interface
PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the legacy I/O controller.
1.8.1
Serial Port
The Serial port A connector is located on the back panel. The serial port supports data transfers at
speeds up to 115.2 kbits/sec with BIOS support.
For information about
Refer to
The location of the serial port A connector
Figure 19, page 55
1.8.2
Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup
program to set the parallel port mode.
For information about
Refer to
The location of the parallel port connector
Figure 19, page 55
1.8.3
Diskette Drive Controller
The legacy I/O controller supports one diskette drive. Use the BIOS Setup program to configure
the diskette drive interface.
For information about
Refer to
The location of the diskette drive connector
Figure 20, page 56
1.8.4
Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2
connector. Power to the computer should be turned off before a keyboard or mouse is connected or
disconnected.
For information about
Refer to
The location of the keyboard and mouse connectors
Figure 19, page 55
27
Intel Desktop Board D945GTP Technical Product Specification
1.9 Audio Subsystem
The board supports the Intel High Definition audio subsystem based on the Sigmatel 9223 or the
Sigmatel 9220 audio codec. The audio subsystem supports the following features:
•
•
•
•
1.9.1
Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize
the device that is connected to an audio port. The back panel audio jacks are capable of
retasking according to user’s definition, or can be automatically switched depending on the
recognized device type.
Stereo input and output for all back panel jacks
Line out and Mic in functions for front panel audio jacks
A signal-to-noise (S/N) ratio of 95 dB
Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about
Refer to
Obtaining audio software and drivers
Section 1.2, page 15
1.9.2
Audio Connectors
The board contains audio connectors on both the back panel and the component side of the board.
The front panel audio connector provides mic in and line out signals for the front panel. The
functions of the back panel audio connectors are dependent on which subsystem is present. The
8-channel (7.1) audio subsystem is described in Section 1.9.3; the 6-channel (5.1) audio subsystem
is described in Section 1.9.4.
For information about
Refer to
The location of the front panel audio connector
Figure 20, page 56
The signal names of the front panel audio connector
Table 19, page 58
The back panel audio connectors
Section 2.8.1, page 53
1.9.3
8-Channel (7.1) Audio Subsystem
The 8-channel (7.1) audio subsystem includes the following:
•
•
•
Intel 82801G I/O Controller Hub (ICH7)
Sigmatel 9223 audio codec
Microphone input that supports a single dynamic, condenser, or electret microphone
The back panel audio connectors are configurable through the audio device drivers. The available
configurable audio ports are shown in Figure 9.
28
Product Description
Front Panel
Audio Connectors
Mic In
Line Out
Surround Left and Right/Retasking Jack
[Black]
Side Surround
Left and Right/
Line In/Retasking Jack
[Blue]
Center channel and LFE (Subwoofer)/
Retasking Jack [Orange]
S/PDIF Digital Audio Out
Optical
Mic In/Retasking Jack
[Pink]
Line Out/Retasking Jack
[Lime Green]
OM17816
Figure 9. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem
Figure 10 is a block diagram of the 8-channel (7.1) audio subsystem.
Line Out
Front
Panel
Mic In
82801G
I/O Controller
Hub
(ICH7)
Line In/Side Surround L-R/Retasking Jack
Intel
High Definition
Audio Link
Sigmatel
9223
Audio Codec
Line Out/Retasking Jack
Mic In/Retasking Jack
Center and LFE/Retasking Jack
Back
Panel
Surround Left-Right/Retasking Jack
S/PDIF
OM17817
Figure 10. 8-channel (7.1) Audio Subsystem Block Diagram
For information about
The back panel audio connectors
Refer to
Section 2.8.1, page 53
29
Intel Desktop Board D945GTP Technical Product Specification
1.9.4
6-Channel (5.1) Audio Subsystem
The 6-channel (5.1) audio subsystem includes the following:
•
•
•
Intel 82801G I/O Controller Hub (ICH7)
Sigmatel 9220 audio codec
Microphone input that supports a single dynamic, condenser, or electret microphone
The back panel audio connectors are configurable through the audio device drivers. The available
configurable audio ports are shown in Figure 11.
Back Panel
Audio Connectors
Front Panel
Audio Connectors
Line Out
Mic In
Line In/
Retasking Jack
Line Out/
Retasking Jack
Mic In/
Retasking Jack
OM17560
Figure 11. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem
Figure 12 is a block diagram of the 6-channel (5.1) audio subsystem.
Line Out
82801G
I/O Controller
Hub
(ICH7)
Intel
High Definition
Audio Link
Sigmatel
9220
Audio Codec
Front
Panel
Mic In
Line In/Retasking Jack
Line Out/Retasking Jack
Back
Panel
Mic In/Retasking Jack
OM17818
Figure 12. 6-Channel (5.1) Audio Subsystem Block Diagram
For information about
The back panel audio connectors
30
Refer to
Section 2.8.1, page 53
Product Description
1.10 LAN Subsystem
The LAN subsystem consists of the following:
•
Physical layer interface device. As a manufacturing option, the board includes one of the
following LAN devices:
⎯ Intel 82562GX/82562GZ PLC for 10/100 Mbits/sec Ethernet LAN connectivity
•
⎯ Intel 82573E/82573V/82574V for Gigabit (10/100/1000 Mbits/sec) Ethernet LAN
connectivity
RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
•
•
•
CSMA/CD protocol engine
LAN connect interface that supports the 82562GX and 82562GZ
PCI Conventional bus power management
⎯ Supports ACPI technology
⎯ Supports LAN wake capabilities
1.10.1
LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about
Refer to
Obtaining LAN software and drivers
Section 1.2, page 15
1.10.2
10/100 Mbits/sec LAN Subsystem
The 10/100 Mbits/sec LAN subsystem consists of the following:
•
•
•
1.10.2.1
Intel 82801G ICH7
Intel 82562GX/82562GZ PLC
RJ-45 LAN connector with integrated status LEDs.
Intel® 82562GX/82562GZ Physical Layer Interface Device
The Intel 82562GX provides the following functions:
•
•
•
•
10/100 Ethernet LAN connectivity
Full device driver compatibility
Programmable transit threshold
Configuration EEPROM that contains the MAC address
The Intel 82562GZ additionally provides Alert Standard Format (ASF) 1.03 support.
31
Intel Desktop Board D945GTP Technical Product Specification
1.10.2.2
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 13).
Green LED
Yellow LED
OM15076
Figure 13. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the 10/100 Mbits/sec LAN
subsystem is operating.
Table 5.
LAN Connector LED States
LED Color
LED State
Condition
Green
Off
LAN link is not established.
On
LAN link is established.
Blinking
LAN activity is occurring.
Off
10 Mbits/sec data rate is selected.
On
100 Mbits/sec data rate is selected.
Yellow
1.10.3
Gigabit LAN Subsystem
The Gigabit (10/100/1000 Mbits/sec) LAN subsystem includes the Intel 82573/82574 controller
and an RJ-45 LAN connector with integrated status LEDs.
1.10.3.1
Intel® 82573E/82573V/82574V Gigabit Ethernet Controller
The Intel 82573E/82573V/82574V Gigabit Ethernet Controller supports the following features:
•
•
•
•
•
•
•
•
•
PCI Express link
10/100/1000 IEEE 802.3 compliant
Compliant to IEEE 802.3x flow control support
Jumbo frame support
TCP, IP, UDP checksum offload
Transmit TCP segmentation
Advanced packet filtering
Full device driver compatibility
PCI Express Power Management Support
The 82573E Gigabit Ethernet Controller also supports the following:
•
•
32
Intel® Active Management Technology
Alert Standard Format (ASF) 2.0.
Product Description
1.10.3.2
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 14). Table 6 describes the
LED states when the board is powered up and the Gigabit LAN subsystem is operating.
Green LED
Green/Yellow LED
OM16513
Figure 14. LAN Connector LED Locations
Table 6.
LED
Color
Left
LED State
Condition
Off
LAN link is not established.
On
LAN link is established.
Blinking
LAN activity is occurring.
N/A
Off
10 Mbits/sec data rate is selected.
Green
On
100 Mbits/sec data rate is selected.
Yellow
On
1000 Mbits/sec data rate is selected.
Green
Right
1.10.4
LAN Connector LED States
Intel® Active Management Technology (Optional)
NOTE
Intel Active Management Technology (AMT) is available only on boards that use the
Intel® 82573E Ethernet Controller.
Intel Active Management Technology (AMT) offers IT organizations tamper-resistant and
persistent management capabilities. Specifically, Intel® AMT is a hardware-based solution that
offers encrypted and persistent asset management and remote diagnostics and/or recovery
capabilities for networked platforms. With Intel AMT, IT organizations can easily get accurate
platform information, and can perform remote updating, diagnostics, debugging, and repair of a
system, regardless of the state of the operating system and the power state of the system. Intel
AMT enables IT organizations to discover, heal, and protect all of their computing assets,
regardless of system state in the manner described below.
•
Discovering hardware and software computing assets:
⎯ Intel AMT stores hardware and software asset information in non-volatile memory and
allows IT to read the asset information anytime, even if the PC is off
⎯ Users cannot remove or prevent IT organization access to the information because it does
not rely on software agents
33
Intel Desktop Board D945GTP Technical Product Specification
•
•
Healing systems remotely, regardless of the operating system or system state:
⎯ Intel AMT provides out-of-band diagnostics and recovery capabilities for IT organizations
to remotely diagnose and repair PCs after software, operating system, or hardware failures
⎯ Alerting and event logging help IT organizations detect and diagnose problems quickly to
reduce end-user downtime
Protecting the enterprise against malicious software attacks:
⎯ Intel AMT helps IT organizations keep software versions and virus protection consistent
and up-to-date across the enterprise
⎯ Version information is stored in non-volatile memory for access anytime by third party
software to check and, if necessary, wake a system to perform off-hours updates
The key features of Intel AMT include:
•
•
•
•
•
34
Secure Out of Band (OOB) system management that allows remote management of PCs
regardless of system power or operating system state.
⎯ SSL3.1/TLS encryption
⎯ HTTP authentication
⎯ TCP/IP
⎯ HTTP web GUI
⎯ XML/SOAP API
Remote troubleshooting and recovery that can significantly reduce desk-side visits and
potentially increasing efficiency of IT technical staff.
⎯ System event log
⎯ IDE-Redirection or PXE boot; Network drive or remote CD boot
⎯ Serial over LAN
⎯ OOB diagnostics
⎯ Remote control
⎯ Remote BIOS update
Proactive alerting that decreases downtime and minimizes time to repair.
⎯ Programmable policies
⎯ Operating system lock-up alert
⎯ Boot failure alert
⎯ Hardware failure alerts
Third party non-volatile storage that prevents users from removing critical inventory, remote
control, or virus protection agents.
⎯ Nonvolatile storage for agents
⎯ Tamper-resistant
Remote hardware and software asset tracking that eliminates time-consuming manual inventory
tracking, which also reduces asset accounting costs.
⎯ E-Asset Tag
⎯ HW/SW inventory
For information about
Refer to
Intel Active Management Technology
Section 1.2, page 15
Product Description
1.10.5
Alert Standard Format (ASF) Support (Optional)
NOTE
Alter Standard Format (ASF) support is available only on boards that use the Intel 82573E
Ethernet Controller or the Intel 82562GZ PLC device.
The board provides the following ASF support for PCI Express x1 bus add-in LAN cards and PCI
Conventional bus add-in LAN cards installed in PCI Conventional bus slot 2:
•
Monitoring of system firmware progress events, including:
⎯ BIOS present
⎯ Primary processor initialization
⎯ Memory initialization
⎯ Video initialization
⎯ PCI resource configuration
⎯ Hard-disk initialization
⎯ User authentication
•
⎯ Starting operating system boot process
Monitoring of system firmware error events, including:
⎯ Memory missing
⎯ Memory failure
⎯ No video device
⎯ Keyboard failure
⎯ Hard-disk failure
•
•
•
⎯ No boot media
Boot options to boot from different types of boot devices
Reset, shutdown, power cycle, and power up options
LAN Subsystem Software
1.11 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for
Management (WfM) specification. The board has several hardware management features,
including the following:
•
•
•
Chassis intrusion detection
Fan monitoring and control (through the hardware monitoring and fan control ASIC)
Thermal and voltage monitoring
35
Intel Desktop Board D945GTP Technical Product Specification
1.11.1
Hardware Monitoring and Fan Control ASIC
The features of the hardware monitoring and fan control ASIC include:
•
•
•
•
•
Internal ambient temperature sensor
Two remote thermal diode sensors for direct monitoring of processor temperature and ambient
temperature sensing
Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and +VCCP) to
detect levels above or below acceptable values
Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or
switch the fans on or off as needed
SMBus interface
For information about
Refer to
The location of the fan connectors and sensors for thermal monitoring
Figure 15, page 37
1.11.2
Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is removed. The
security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion
connector. When the chassis cover is removed, the mechanical switch is in the closed position.
1.11.3
Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities or third-party software. The
level of monitoring and control is dependent on the hardware monitoring ASIC used with the
board.
36
For information about
Refer to
The functions of the fan connectors
Section 1.12.2.2, page 41
Product Description
1.11.4
Thermal Monitoring
Figure 15 shows the location of the sensors and fan connectors.
1
A
3
B
4
1
1
D
C
3
F
E
OM17837
Item
Description
A
Remote ambient temperature sensor
B
Thermal diode, located on processor die
C
Ambient temperature sensor, internal to hardware monitoring and fan control ASIC
D
Processor fan
E
Rear chassis fan
F
Front chassis fan
Figure 15. Thermal Sensors and Fan Connectors
37
Intel Desktop Board D945GTP Technical Product Specification
1.12 Power Management
Power management is implemented at several levels, including:
•
•
1.12.1
Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
⎯ Power connector
⎯ Fan connectors
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Resume on Ring
⎯ Wake from USB
⎯ Wake from PS/2 devices
⎯ Power Management Event signal (PME#) wake-up support
ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with this board requires an operating system that
provides full ACPI support. ACPI features include:
•
•
•
•
•
•
Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 9 on page 40)
Support for a front panel power and sleep mode switch
Table 7 lists the system states based on how long the power switch is pressed, depending on how
ACPI is configured with an ACPI-aware operating system.
Table 7.
Effects of Pressing the Power Switch
If the system is in this state…
Off
(ACPI G2/G5 – Soft off)
On
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Sleep
(ACPI G1 – sleeping state)
38
…and the power switch is
pressed for
Less than four seconds
Less than four seconds
More than four seconds
Less than four seconds
More than four seconds
…the system enters this state
Power-on
(ACPI G0 – working state)
Soft-off/Standby
(ACPI G1 – sleeping state)
Fail safe power-off
(ACPI G2/G5 – Soft off)
Wake-up
(ACPI G0 – working state)
Power-off
(ACPI G2/G5 – Soft off)
Product Description
1.12.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 8 lists the power states supported by the board along with the associated system power
targets. See the ACPI specification for a complete description of the various system and power
states.
Table 8.
Power States and Targeted System Power
Global States
G0 – working
state
G1 – sleeping
state
Sleeping States
S0 – working
Processor
States
C0 – working
S1 – Processor
stopped
C1 – stop
grant
G1 – sleeping
state
S3 – Suspend to
RAM. Context
saved to RAM.
S4 – Suspend to
disk. Context
saved to disk.
S5 – Soft off.
Context not saved.
Cold boot is
required.
No power to the
system.
No power
G1 – sleeping
state
G2/S5
G3 –
mechanical off
AC power is
disconnected
from the
computer.
No power
No power
No power
Device States
D0 – working state.
Targeted System
Power (Note 1)
Full power > 30 W
D1, D2, D3 – device
specification
specific.
D3 – no power
except for wake-up
logic.
D3 – no power
except for wake-up
logic.
D3 – no power
except for wake-up
logic.
5 W < power < 52.5 W
D3 – no power for
wake-up logic,
except when
provided by battery
or external source.
No power to the system.
Service can be
performed safely.
Power < 5 W
(Note 2)
Power < 5 W
(Note 2)
Power < 5 W
(Note 2)
Notes:
1.
Total system power is dependent on the system configuration, including add-in boards and peripherals powered
by the system chassis’ power supply.
2.
Dependent on the standby power consumption of wake-up devices used in the system.
1.12.1.2
One-Watt Standby
In 2001, the U.S. government issued an executive order requiring a reduction in power for
appliances and personal computers. This board meets that requirement by operating at 1 W (or
less) in S5 (Standby) mode. One-Watt operation applies only to the S5 state when the computer is
turned off, but still connected to AC power. One-Watt operation does not apply to the S3 (Suspend
to RAM) or S4 (Suspend to disk) states.
Newer energy-efficient power supplies using less than 0.5 W (in Standby mode) may also be
needed to achieve this goal.
39
Intel Desktop Board D945GTP Technical Product Specification
1.12.1.3
Wake-up Devices and Events
Table 9 lists the devices or specific events that can wake the computer from specific states.
Table 9.
Wake-up Devices and Events
These devices/events can wake up the computer…
…from this state
LAN
S1, S3, S4, S5 (Note)
Modem (back panel Serial Port A)
S1, S3
PME# signal
S1, S3, S4, S5 (Note)
Power switch
S1, S3, S4, S5
PS/2 devices
S1, S3
RTC alarm
S1, S3, S4, S5
USB
S1, S3
WAKE# signal
S1, S3, S4, S5
Note:
For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On
will enable a wake-up event from LAN in the S5 state.
NOTE
The use of these wake-up events from an ACPI state requires an operating system that provides full
ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.
1.12.2
Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and
Instantly Available PC technology features are used. Failure to do so can damage the power
supply. The total amount of standby current required depends on the wake devices supported and
manufacturing options.
The board provides several power management hardware features, including:
•
•
•
•
•
•
•
•
•
Power connector
Fan connectors
LAN wake capabilities
Instantly Available PC technology
Resume on Ring
Wake from USB
Wake from PS/2 keyboard
PME# signal wake-up support
WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the +5 V
standby line.
Resume on Ring enables telephony devices to access the computer when it is in a power-managed
state. The method used depends on the type of telephony device (external or internal).
40
Product Description
NOTE
The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an
operating system that provides full ACPI support.
1.12.2.1
Power Connector
ATX12V-compliant power supplies can turn off the system power through system control. When
an ACPI-enabled system receives the correct command, the power supply removes all non-standby
voltages.
When resuming from an AC power failure, the computer returns to the power state it was in before
power was interrupted (on or off). The computer’s response can be set using the Last Power State
feature in the BIOS Setup program’s Boot menu.
For information about
Refer to
The location of the main power connector
Figure 20, page 56
The signal names of the main power connector
Table 25, page 60
1.12.2.2
Fan Connectors
The function/operation of the fan connectors is as follows:
•
•
•
•
•
The fans are on when the board is in the S0 or S1 state.
The fans are off when the board is off or in the S3, S4, or S5 state.
Each fan connector is wired to a fan tachometer input of the hardware monitoring and fan
control ASIC.
All fan connectors support closed-loop fan control that can adjust the fan speed or switch the
fan on or off as needed.
All fan connectors have a +12 V DC connection.
For information about
Refer to
The location of the fan connectors
Figure 20, page 56
The location of the fan connectors and sensors for thermal monitoring
Figure 15, page 37
The signal names of the processor fan connector
Table 23, page 59
The signal names of the chassis fan connectors
Table 24, page 59
41
Intel Desktop Board D945GTP Technical Product Specification
1.12.2.3
LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN
network adapter monitors network traffic at the Media Independent Interface. Upon detecting a
Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.
Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in
the following ways:
•
•
•
1.12.2.4
The PCI Express WAKE# signal
The PCI Conventional bus PME# signal for PCI 2.3 compliant LAN designs
The onboard LAN subsystem
Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Instantly Available PC technology can damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM)
sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off,
and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a
wake-up device or event, the system quickly returns to its last known wake state. Table 9 on
page 40 lists the devices and events that can wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in boards that
also support this specification can participate in power management and can be used to wake the
computer.
The use of Instantly Available PC technology requires operating system support and PCI 2.3
compliant add-in cards, PCI Express add-in cards, and drivers.
42
Product Description
1.12.2.5
Resume on Ring
The operation of Resume on Ring can be summarized as follows:
•
•
•
1.12.2.6
Resumes operation from ACPI S1 or S3 states
Detects incoming call similarly for external and internal modems
Requires modem interrupt be unmasked for correct operation
Wake from USB
USB bus activity wakes the computer from ACPI S1 or S3 states.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.12.2.7
Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1 or S3 state.
1.12.2.8
PME# Signal Wake-up Support
When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.12.2.9
WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state.
43
Intel Desktop Board D945GTP Technical Product Specification
1.12.2.10
+5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the computer
appears to be off. Figure 16 shows the location of the standby power indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power
cord before installing or removing any devices connected to the board. Failure to do so could
damage the board and any attached devices.
CR3J1
OM17838
Figure 16. Location of the Standby Power Indicator LED
1.13 Trusted Platform Module (Optional)
The optional Trusted Platform Module (TPM) is a component on the desktop board that is
specifically designed to enhance platform security above-and-beyond the capabilities of today’s
software by providing a protected space for key operations and other security critical tasks. Using
both hardware and software, the TPM protects encryption and signature keys at their most
vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The
TPM is specifically designed to shield unencrypted keys and platform authentication information
from software-based attacks.
44
For information about
Refer to
TPM
http://www.intel.com/design/motherbd/tp
2 Technical Reference
What This Chapter Contains
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
2.15
Introduction .................................................................................................................. 45
Memory Resources ...................................................................................................... 45
DMA Channels ............................................................................................................. 47
Fixed I/O Map............................................................................................................... 48
PCI Configuration Space Map...................................................................................... 49
Interrupts ...................................................................................................................... 50
PCI Conventional Interrupt Routing Map ..................................................................... 51
Connectors................................................................................................................... 53
Jumper Block ............................................................................................................... 65
Mechanical Considerations .......................................................................................... 66
Electrical Considerations.............................................................................................. 69
Thermal Considerations ............................................................................................... 71
Reliability...................................................................................................................... 73
Environmental .............................................................................................................. 74
Regulatory Compliance................................................................................................ 75
2.1 Introduction
Sections 2.2 - 2.6 contain several standalone tables. Table 10 describes the system memory map,
Table 11 lists the DMA channels, Table 12 shows the I/O map, Table 13 defines the PCI
Conventional bus configuration space map, and Table 14 describes the interrupts. The remaining
sections in this chapter are introduced by text found with their respective section headings.
2.2 Memory Resources
2.2.1
Addressable Memory
The board utilizes 4 GB of addressable system memory. Typically the address space that is
allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI
Flash), and chipset overhead resides above the top of DRAM (total system memory). On a system
that has 4 GB of system memory installed, it is not possible to use all of the installed memory due
to system address space being allocated for other system critical functions. These functions include
the following:
•
•
•
•
•
BIOS/ SPI Flash (2 MB)
Local APIC (19 MB)
Digital Media Interface (40 MB)
Front side bus interrupts (17 MB)
PCI Express configuration space (256 MB)
45
Intel Desktop Board D945GTP Technical Product Specification
•
•
MCH base address registers, internal graphics ranges, PCI Express ports (up to 512 MB)
Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express
add-in cards
The amount of installed memory that can be used will vary based on add-in cards and BIOS
settings. Figure 17 shows a schematic of the system memory map. All installed system memory
can be used when there is no overlap of system addresses.
4 GB
Top of System Address Space
FLASH
APIC
~20 MB
Reserved
PCI Memory Range contains PCI, chipsets,
Direct Media Interface
(DMI), and ICH ranges
(approximately 750 MB)
0FFFFFH
0F0000H
0EFFFFH
Top of usable
DRAM (memory
visible to the
operating
system)
0E0000H
0DFFFFH
0C0000H
0BFFFFH
DRAM
Range
1 MB
DOS
Compatibility
Memory
640 KB
0A0000H
1 MB
Upper BIOS
area (64 KB)
960 KB
Lower BIOS
area
(64 KB;
16 KB x 4)
896 KB
Add-in Card
BIOS and
Buffer area
(128 KB;
16 KB x 8)
768 KB
Standard PCI/
ISA Video
Memory (SMM
Memory)
128 KB
640 KB
09FFFFH
DOS area
(640 KB)
0 MB
00000H
0 KB
OM17140
Figure 17. Detailed System Memory Address Map
46
Technical Reference
2.2.2
Memory Map
Table 10 lists the system memory map.
Table 10.
System Memory Map
Address Range (decimal)
Address Range (hex)
Size
Description
1024 K - 4194304 K
100000 - FFFFFFFF
4095 MB
Extended memory
960 K - 1024 K
F0000 - FFFFF
64 KB
Runtime BIOS
896 K - 960 K
E0000 - EFFFF
64 KB
Reserved
800 K - 896 K
C8000 - DFFFF
96 KB
Potential available high DOS
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
640 K - 800 K
A0000 - C7FFF
160 KB
Video memory and BIOS
639 K - 640 K
9FC00 - 9FFFF
1 KB
Extended BIOS data (movable by
memory manager software)
512 K - 639 K
80000 - 9FBFF
127 KB
Extended conventional memory
0 K - 512 K
00000 - 7FFFF
512 KB
Conventional memory
2.3 DMA Channels
Table 11.
DMA Channels
DMA Channel Number
Data Width
System Resource
0
8 or 16 bits
Open
1
8 or 16 bits
Parallel port
2
8 or 16 bits
Diskette drive
3
8 or 16 bits
Parallel port (for ECP or EPP)
4
8 or 16 bits
DMA controller
5
16 bits
Open
6
16 bits
Open
7
16 bits
Open
47
Intel Desktop Board D945GTP Technical Product Specification
2.4 Fixed I/O Map
Table 12.
I/O Map
Address (hex)
Size
Description
0000 - 00FF
256 bytes
0170 - 0177
01F0 - 01F7
8 bytes
8 bytes
Used by the Desktop Board D945GTP. Refer to the ICH7
data sheet for dynamic addressing information.
Secondary Parallel ATA IDE channel command block
Primary Parallel ATA IDE channel command block
0228 - 022F (Note 1)
0278 - 027F (Note 1)
02E8 - 02EF (Note 1)
02F8 - 02FF (Note 1)
0374 - 0377
0377, bits 6:0
0378 - 037F
03E8 - 03EF
03F0 - 03F5
03F4 – 03F7
03F8 - 03FF
04D0 - 04D1
LPTn + 400
0CF8 - 0CFB (Note 2)
0CF9 (Note 3)
0CFC - 0CFF
FFA0 - FFA7
FFA8 - FFAF
8 bytes
8 bytes
8 bytes
8 bytes
4 bytes
7 bits
8 bytes
8 bytes
6 bytes
1 byte
8 bytes
2 bytes
8 bytes
4 bytes
1 byte
4 bytes
8 bytes
8 bytes
LPT3
LPT2
COM4
COM2
Secondary Parallel ATA IDE channel control block
Secondary IDE channel status port
LPT1
COM3
Diskette channel
Primary Parallel ATA IDE channel control block
COM1
Edge/level triggered PIC
ECP port, LPTn base address + 400h
PCI Conventional bus configuration address register
Reset control register
PCI Conventional bus configuration data register
Primary Parallel ATA IDE bus master registers
Secondary Parallel ATA IDE bus master registers
Notes:
1.
Default, but can be changed to another address range
2.
Dword access only
3.
Byte access only
NOTE
Some additional I/O addresses are not available due to ICH7 address aliasing. The ICH7 data
sheet provides more information on address aliasing.
48
For information about
Refer to
Obtaining the ICH7 data sheet
Section 1.2, page 15
Technical Reference
2.5 PCI Configuration Space Map
Table 13.
PCI Configuration Space Map
Bus
Number (hex)
Device
Number (hex)
Function
Number (hex)
Description
00
00
00
Memory controller of Intel 82945G component
00
01
00
PCI Express x16 graphics port (Note 1)
00
02
00
Integrated graphics controller
00
1B
00
Intel High Definition Audio Controller
00
1C
00
PCI Express port 1
00
1C
01
PCI Express port 2
00
1C
02
PCI Express port 3
00
1C
03
PCI Express port 4
00
1D
00
USB UHCI controller 1
00
1D
01
USB UHCI controller 2
00
1D
02
USB UHCI controller 3
00
1D
03
USB UHCI controller 4
00
1D
07
EHCI controller
00
1E
00
PCI bridge
00
1F
00
PCI controller
00
1F
01
Parallel ATA IDE controller
00
1F
02
Serial ATA controller
00
1F
03
SMBus controller
(Note 2)
00
00
Gigabit LAN controller (if present)
(Note 2)
00
00
PCI Conventional bus connector 1
(Note 2)
01
00
PCI Conventional bus connector 2
(Note 2)
05
00
IEEE-1394a controller (if present)
(Note 2)
08
00
Intel 82562 10/100 Mbits/sec LAN PLC (if present)
01
00
00
PCI Express video controller (if present)
Notes:
1.
Present only when a PCI Express x16 graphics card is installed.
2.
Bus number is dynamic and can change based on add-in cards used.
49
Intel Desktop Board D945GTP Technical Product Specification
2.6 Interrupts
The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the
Advanced Programmable Interrupt Controller (APIC) portion of the ICH7 component. The PIC is
supported in Windows 98 SE and Windows ME and uses the first 16 interrupts. The APIC is
supported in Windows 2000 and Windows XP and supports a total of 24 interrupts.
Table 14.
Interrupts
IRQ
System Resource
NMI
I/O channel check
0
Reserved, interval timer
1
Reserved, keyboard buffer full
2
Reserved, cascade interrupt from slave PIC
3
User available
4
COM1 (Note 1)
5
User available
6
Diskette drive
7
LPT1 (Note 1)
8
Real-time clock
9
User available
10
User available
11
User available
12
Onboard mouse port (if present, else user available)
13
Reserved, math coprocessor
14
Primary Parallel ATA/Serial ATA – Legacy Mode (if present, else user available)
15
Secondary Parallel ATA/Serial ATA – Legacy Mode (if present, else user available)
16 (Note 2)
User available (through PIRQA)
17 (Note 2)
User available (through PIRQB)
18
(Note 2)
User available (through PIRQC)
19
(Note 2)
User available (through PIRQD)
20 (Note 2)
User available (through PIRQE)
21
(Note 2)
User available (through PIRQF)
22
(Note 2)
User available (through PIRQG)
23 (Note 2)
User available (through PIRQH)
Notes:
50
1.
Default, but can be changed to another IRQ.
2.
Available in APIC mode only.
Technical Reference
2.7 PCI Conventional Interrupt Routing Map
This section describes interrupt sharing and how the interrupt signals are connected between the
PCI Conventional bus connectors and onboard PCI Conventional devices. The PCI Conventional
specification describes how interrupts can be shared between devices attached to the PCI
Conventional bus. In most cases, the small amount of latency added by interrupt sharing does not
affect the operation or throughput of the devices. In some special cases where maximum
performance is needed from a device, a PCI Conventional device should not share an interrupt with
other PCI Conventional devices. Use the following information to avoid sharing an interrupt with a
PCI Conventional add-in card.
PCI Conventional devices are categorized as follows to specify their interrupt grouping:
•
•
•
INTA: By default, all add-in cards that require only one interrupt are in this category. For
almost all cards that require more than one interrupt, the first interrupt on the card is also
classified as INTA.
INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is
classified as INTB. (This is not an absolute requirement.)
INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a fourth
interrupt is classified as INTD.
The ICH7 has eight Programmable Interrupt Request (PIRQ) input signals. All PCI Conventional
interrupt sources either onboard or from a PCI Conventional add-in card connect to one of these
PIRQ signals. Some PCI Conventional interrupt sources are electrically tied together on the board
and therefore share the same interrupt. Table 15 shows an example of how the PIRQ signals are
routed.
Table 15.
PCI Interrupt Routing Map
ICH7 PIRQ Signal Name
PCI Interrupt Source
IEEE-1394a controller
(optional)
PIRQA
PIRQB
PCI bus connector 1
PCI bus connector 2
ICH7 LAN
PIRQC
PIRQD
PIRQE
PIRQF
PIRQG
PIRQH
INTD
INTA
INTB
INTC
INTC
INTB
INTA
INTD
INTA
INTA
51
Intel Desktop Board D945GTP Technical Product Specification
NOTE
In PIC mode, the ICH7 can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 6,
7, 9, 10, 11, 12, 14, and 15). Typically, a device that does not share a PIRQ line will have a unique
interrupt. However, in certain interrupt-constrained situations, it is possible for two or more of the
PIRQ lines to be connected to the same IRQ signal. Refer to Table 14 for the allocation of PIRQ
lines to IRQ signals in APIC mode.
PCI interrupt assignments to the USB ports, Serial ATA ports, and PCI Express ports are dynamic.
52
Technical Reference
2.8 Connectors
CAUTION
Only the following connectors have overcurrent protection: back panel USB, front panel USB, and
PS/2.
The other internal connectors are not overcurrent protected and should connect only to devices
inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors
to power devices external to the computer’s chassis. A fault in the load presented by the external
devices could cause damage to the computer, the power cable, and the external devices themselves.
This section describes the board’s connectors. The connectors can be divided into these groups:
•
•
2.8.1
Back panel I/O connectors (see page 55)
Component-side I/O connectors (see page 53)
Back Panel Connectors
The back panel configuration is dependent upon which audio subsystem is present. The
configurations are as follows:
• 8-channel (7.1) audio subsystem (five analog audio output connectors and one digital audio
output connector), described on page 54
• 6-channel (5.1) audio subsystem (three analog audio output connectors), described on page 55
53
Intel Desktop Board D945GTP Technical Product Specification
2.8.1.1
Back Panel Connectors For 8-Channel (7.1) Audio Subsystem
Figure 18 shows the location of the back panel connectors for boards equipped with the 8-channel
(7.1) audio subsystem. The back panel connectors are color-coded. The figure legend (Table 16)
lists the colors used (when applicable).
A
D
C
B
F
E
G
H
J
K
L
I
M
N
O
OM17558
Figure 18. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem
Table 16 lists the back panel connectors identified in Figure 18.
NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers
only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
Table 16.
Back Panel Connectors Shown in Figure 18
Item/callout from
Figure 18
54
Description
A
PS/2 mouse port [Green]
B
PS/2 keyboard port [Purple]
C
Serial port A [Teal]
D
Parallel port [Burgundy]
E
VGA port
F
IEEE-1394a connector
G
USB ports (two)
H
LAN
I
USB ports (two)
J
Center channel and LFE (subwoofer) audio out/ Retasking Jack [Orange]
K
Surround left/right channel audio out/Retasking Jack [Black]
L
Audio line in/Retasking Jack [Blue]
M
Digital audio out optical
N
Mic in/Retasking Jack [Pink]
O
Front left/right channel audio out/Two channel audio line out/Retasking Jack
[Lime green]
Technical Reference
2.8.1.2
Back Panel Connectors For 6-Channel (5.1) Audio Subsystem
Figure 19 shows the location of the back panel connectors for boards equipped with the 6-channel
(5.1) audio subsystem. The back panel connectors are color-coded. The figure legend (Table 17)
lists the colors used (when applicable).
A
B
I
G
D
C
E
F
H
J
K
OM17559
Figure 19. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem
Table 17 lists the back panel connectors identified in Figure 19.
NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers
only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
Table 17.
Back Panel Connectors Shown in Figure 19
Item/callout from
Figure 19
Description
A
PS/2 mouse port [Green]
B
PS/2 keyboard port [Purple]
C
Serial port A [Teal]
D
Parallel port [Burgundy]
E
VGA port
F
USB ports (two)
G
LAN
H
USB ports (two)
I
Audio line in/Retasking Jack [Blue]
J
Mic in/Retasking Jack [Pink]
K
Front left/right channel audio out/Two channel audio line out/Retasking Jack
[Lime green]
55
Intel Desktop Board D945GTP Technical Product Specification
2.8.2
Component-side Connectors
Figure 20 shows the locations of the component-side connectors.
A
B CD
1
2
9
10
E
F
1
2
3
G
4
1
3
X
W
10
2
1
10
2
1
4
1
V
U
1
H
2
10
T
24
2
1
23
40 2
39 1
2
1
S R Q P O
1
34
33
L
N M
1
K
I
J
1
2
1
10
1
9
1
1
2
1
1
3
1
OM17839
Figure 20. Component-side Connectors
56
Technical Reference
Table 18 lists the component-side connectors identified in Figure 20.
Table 18.
Component-side Connectors Shown in Figure 20
Item/callout
from Figure 20
Description
A
PCI Express x1 bus add-in card connector
B
Front panel audio connector
C
PCI Conventional bus add-in card connector 2
D
PCI Conventional bus add-in card connector 1
E
PCI Express x16 bus add-in card connector
F
Rear chassis fan connector
G
+12V power connector (ATX12V)
H
Processor fan connector
I
SCSI LED connector (optional)
J
Power connector
K
Diskette drive connector
L
Parallel ATA IDE connector
M
Serial ATA connector 3
N
Front chassis fan connector
O
Serial ATA connector 2
P
Serial ATA connector 0
Q
Auxiliary front panel power LED connector
R
Front panel connector
S
Serial ATA connector 1
T
Front panel USB connector
U
Chassis intrusion connector
V
Front panel USB connector
W
Front panel IEEE-1394a connector (optional)
X
Front panel IEEE-1394a connector (optional)
57
Intel Desktop Board D945GTP Technical Product Specification
Table 19.
#
Front Panel Audio Connector
Pin
Signal Name
Pin
Signal Name
1
Port E [Port 1] Left Channel
2
Ground
3
Port E [Port 1] Right Channel
4
Presence# (dongle present)
5
Port F [Port 2] Right Channel
6
Port E [Port 1] Sense return
(jack detection)
7
Port E [Port 1] and Port F [Port 2]
Sense send (jack detection)
8
Key
9
Port F [Port 2] Left Channel
10
Port F [Port 2] Sense return
(jack detection)
INTEGRATOR’S NOTE
The front panel audio connector is colored yellow.
Table 20.
Pin
Signal Name
1
Intruder
2
Ground
Table 21.
SCSI Hard Drive Activity LED
Connector (Optional)
Pin
Signal Name
1
SCSI_ACT#
2
No connect
Table 22.
58
Chassis Intrusion Connector
Serial ATA Connectors
Pin
Signal Name
1
Ground
2
TXP
3
TXN
4
Ground
5
RXN
6
RXP
7
Ground
Technical Reference
Table 23.
Processor Fan Connector
Pin
Signal Name
1
Ground
2
+12 V
3
FAN_TACH
4
FAN_CONTROL
Table 24.
Front and Rear Chassis Fan Connectors
Pin
Signal Name
1
FAN_CONTROL
2
+12 V
3
FAN_TACH
59
Intel Desktop Board D945GTP Technical Product Specification
2.8.2.1
Power Supply Connectors
The board has power supply connectors:
•
•
#
Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors
previously used on Intel Desktop boards. The board supports the use of ATX12V power
supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a
2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector,
leaving pins 11, 12, 23, and 24 unconnected.
ATX12V power – a 2 x 2 connector. This connector provides power directly to the processor
voltage regulator and must always be used. Failure to do so will prevent the board from
booting.
INTEGRATOR’S NOTE
When using high wattage PCI Express x16 graphics cards, use a power supply with a 2 x 12 main
power cable. The 2 x 12 main power cable can provide up to 144 W of power from the +12 V rail.
Table 25.
Main Power Connector
Pin
Signal Name
Pin
Signal Name
1
+3.3 V
13
+3.3 V
2
+3.3 V
14
-12 V
3
Ground
15
Ground
4
+5 V
16
PS-ON# (power supply remote on/off)
5
Ground
17
Ground
6
+5 V
18
Ground
7
Ground
19
Ground
8
PWRGD (Power Good)
20
No connect
9
+5 V (Standby)
21
+5 V
10
+12 V
22
+5 V
11
+12 V
23
+5 V
12
2 x 12 connector detect
24
Ground
(Note)
(Note)
(Note)
(Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
Table 26.
60
ATX12V Power Connector
Pin
Signal Name
Pin
Signal Name
1
Ground
2
Ground
3
+12 V
4
+12 V
Technical Reference
2.8.2.2
Add-in Card Connectors
The board has the following add-in card connectors:
•
•
•
PCI Express x16: one connector supporting simultaneous transfer speeds up to 8 GBytes/sec.
PCI Express x1: one PCI Express x1 connector. The x1 interface supports simultaneous
transfer speeds up to 500 MBytes/sec.
PCI Conventional (rev 2.3 compliant) bus: two PCI Conventional bus add-in card connectors.
The SMBus is routed to PCI Conventional bus connector 2 only (ATX expansion slot 6). PCI
Conventional bus add-in cards with SMBus support can access sensor data and other
information residing on the board.
Note the following considerations for the PCI Conventional bus connectors:
•
•
All of the PCI Conventional bus connectors are bus master capable.
SMBus signals are routed to PCI Conventional bus connector 2. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the boards. The
specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
NOTE
The PCI Express x16 connector is configured to support only a PCI Express x1 link when the
Intel GMA950 graphics controller is enabled.
2.8.2.3
Auxiliary Front Panel Power/Sleep LED Connector
Pins 1 and 3 of this connector duplicate the signals on pins 2 and 4 of the front panel connector.
Table 27.
Auxiliary Front Panel Power/Sleep LED Connector
Pin
Signal Name
In/Out
Description
1
HDR_BLNK_GRN
Out
Front panel green LED
2
Not connected
3
HDR_BLNK_YEL
Out
Front panel yellow LED
61
Intel Desktop Board D945GTP Technical Product Specification
2.8.2.4
Front Panel Connector
This section describes the functions of the front panel connector. Table 28 lists the signal names of
the front panel connector. Figure 21 is a connection diagram for the front panel connector.
Table 28.
Pin
Front Panel Connector
Signal
In/Out
Description
Pin
Signal
In/Out
Hard Drive Activity LED
[Yellow]
Description
Power LED
[Green]
1
HD_PWR
Out
Hard disk LED pull-up
(750 Ω) to +5 V
2
HDR_BLNK_
GRN
Out
Front panel green
LED
3
HAD#
Out
Hard disk active LED
4
HDR_BLNK_
YEL
Out
Front panel yellow
LED
Reset Switch
[Purple]
5
Ground
7
FP_RESET#
In
On/Off Switch
[Red]
Ground
6
FPBUT_IN
Reset switch
8
Ground
Not Connected
Power
10
N/C
Dual-colored
Power LED
Single-colored
Power LED
+
−
−
+
Not connected
+5 V DC
8
7
6
5
4
3
2
1
Purple
Red
9
Green
Power
Switch
N/C
Yellow
+5 V
Power switch
Ground
Power
9
In
Reset
Switch
−
+
Hard Drive
Activity LED
OM17000
Figure 21. Connection Diagram for Front Panel Connector
2.8.2.4.1
Hard Drive Activity LED Connector [Yellow]
Pins 1 and 3 [Yellow] can be connected to an LED to provide a visual indicator that data is being
read from or written to a hard drive. Proper LED function requires one of the following:
•
•
62
A Serial ATA hard drive connected to an onboard Serial ATA connector
An IDE hard drive connected to an onboard IDE connector
Technical Reference
2.8.2.4.2
Reset Switch Connector [Purple]
Pins 5 and 7 [Purple] can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the POST.
2.8.2.4.3
Power/Sleep LED Connector [Green]
Pins 2 and 4 [Green] can be connected to a one- or two-color LED. Table 29 shows the possible
states for a one-color LED. Table 30 shows the possible states for a two-color LED.
Table 29.
States for a One-Color Power LED
LED State
Description
Off
Power off/sleeping
Steady Green
Running
Table 30.
States for a Two-Color Power LED
LED State
Description
Off
Power off
Steady Green
Running
Steady Yellow
Sleeping
NOTE
The colors listed in Table 29 and Table 30 are suggested colors only. Actual LED colors are
product- or customer-specific.
2.8.2.4.4
Power Switch Connector [Red]
Pins 6 and 8 [Red] can be connected to a front panel momentary-contact power switch. The switch
must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or
off. (The time requirement is due to internal debounce circuitry on the board.) At least two
seconds must pass before the power supply will recognize another on/off signal.
63
Intel Desktop Board D945GTP Technical Product Specification
2.8.2.5
Front Panel USB Connectors
Figure 22 is a connection diagram for the front panel USB connectors.
#
INTEGRATOR’S NOTES
•
•
•
•
The +5 V DC power on the USB connector is fused.
Pins 1, 3, 5, and 7 comprise one USB port.
Pins 2, 4, 6, and 8 comprise one USB port.
Use only a front panel USB connector that conforms to the USB 2.0 specification for highspeed USB devices.
One
USB
Port
Power
(+5 V DC)
1
2
Power
(+5 V DC)
D−
3
4
D−
D+
5
6
D+
Ground
7
8
Ground
10
No Connect
Key (no pin)
One
USB
Port
OM15963
Figure 22. Connection Diagram for Front Panel USB Connectors
2.8.2.6
Front Panel IEEE 1394a Connectors (Optional)
Figure 23 is a connection diagram for the optional IEEE 1394a connectors.
Key (no pin)
Ground
10
+12 V DC
8
7
+12 V DC
TPB−
6
5
TPB+
Ground
4
3
Ground
TPA−
2
1
TPA+
OM17834
Figure 23. Connection Diagram for IEEE 1394a Connectors
#
64
INTEGRATOR’S NOTES
•
•
•
The IEEE 1394a connectors are colored blue.
The +12 V DC power on the IEEE 1394a connectors is fused.
Each IEEE 1394a connector provides one IEEE 1394a port.
Technical Reference
2.9 Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the power cord
from the computer before changing a jumper setting. Otherwise, the board could be damaged.
Figure 24 shows the location of the jumper block. The jumper block determines the BIOS Setup
program’s mode. Table 31 describes the jumper settings for the three modes: normal, configure, and
recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS
compares the processor version and the microcode version in the BIOS and reports if the two match.
3
1
J7J3
OM17840
Figure 24. Location of the Jumper Block
Table 31.
BIOS Setup Configuration Jumper Settings
Function/Mode
Jumper Setting
Configuration
1-2
3
1
The BIOS uses current configuration information and
passwords for booting.
2-3
3
1
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
None
3
1
Normal
Configure
Recovery
The BIOS attempts to recover the BIOS configuration. A
recovery diskette is required.
65
Intel Desktop Board D945GTP Technical Product Specification
2.10 Mechanical Considerations
2.10.1
Form Factor
The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 25 illustrates
the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer
dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]. Location of
the I/O connectors and mounting holes are in compliance with the ATX specification.
1.800
[45.72]
6.500
[165.10]
6.100
[154.94]
5.200
[132.08]
0.00
2.850
[72.39]
3.100
[78.74]
3.150
[80.01]
0.00
2.600
[66.04]
6.450
6.200 [163.83]
[157.48]
OM17841
Figure 25. Board Dimensions
66
Technical Reference
2.10.2
I/O Shield
The back panel I/O shield for the board must meet specific dimension and material requirements.
Systems based on this board need the back panel I/O shield to pass certification testing. Figure 26
shows the I/O shield for boards with the 8-channel (7.1) audio subsystem. Figure 27 shows the I/O
shield for boards with the 6-channel (5.1) audio subsystem. Dimensions are given in millimeters
[inches]. The figures also indicate the position of each cutout. Additional design considerations for
I/O shields relative to chassis requirements are described in the ATX specification.
NOTE
The I/O shield drawings in this document are for reference only. I/O shields compliant with the
ATX chassis specification 2.03 are available from Intel.
162.3 REF
[6.390]
1.6 ± 0.12
[0.063 ± 0.005]
20 ± 0.254 TYP
[0.787 ± 0.10]
159.2 ± 0.12
[6.268 ± 0.005]
1.55 REF
[0.061]
22.45
[0.884]
7.01
[0.276]
Ø 1.00
[0.039]
8x R 0.5 MIN
A
A
0.00
[0.00]
11.81
[0.465]
11.81
[0.465]
12.04
[0.474]
146.88
[5.783]
113.63
[4.473]
93.74
[3.690]
56.31
[2.217]
26.91
[1.059]
20.28
[0.799]
0.00
[0.00]
8.81
[0.347]
14.17
[0.558]
Pictorial
View
OM17932
Figure 26. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem
67
Intel Desktop Board D945GTP Technical Product Specification
162.3 REF
[6.390]
1.6 ± 0.12
[0.063 ± 0.005]
20 ± 0.254 TYP
[0.787 ± 0.10]
159.2 ± 0.12
[6.268 ± 0.005]
1.55 REF
[0.061]
22.45
[0.884]
7.01
[0.276]
Ø 1.00
[0.039]
8x R 0.5 MIN
A
A
0.00
[0.00]
11.81
[0.465]
11.81
[0.465]
12.04
[0.474]
146.88
[5.783]
113.63
[4.473]
93.74
[3.690]
56.31
[2.217]
26.91
[1.059]
20.28
[0.799]
0.00
[0.00]
8.81
[0.347]
14.17
[0.558]
Pictorial
View
OM17933
Figure 27. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem
68
Technical Reference
2.11 Electrical Considerations
2.11.1
DC Loading
Table 32 lists the DC loading characteristics of the boards. This data is based on a DC analysis of
all active components within the board that impact its power delivery subsystems. The analysis
does not include PCI add-in cards. Minimum values assume a light load placed on the board that is
similar to an environment with no applications running and no USB current draw. Maximum
values assume a load placed on the board that is similar to a heavy gaming environment with a
500 mA current draw per USB port. These calculations are not based on specific processor values
or memory configurations but are based on the minimum and maximum current draw possible from
the board’s power delivery subsystems to the processor, memory, and USB ports.
Use the datasheets for add-in cards, such as PCI, to determine the overall system power
requirements. The selection of a power supply at the system level is dependent on the system’s
usage model and not necessarily tied to a particular processor speed.
Table 32.
DC Loading Characteristics
DC Current at:
Mode
DC Power
+3.3 V
+5 V
+12 V
-12 V
+5 VSB
Minimum loading
275 W
3.5 A
12 A
17 A
0A
0.34 A (S0)
1.00 A (S3)
Maximum loading
500 W
16 A
23 A
29 A
0.20 A
0.34 A (S0)
1.10 A (S3)
2.11.2
Add-in Board Considerations
The boards are designed to provide 2 A (average) of +5 V current for each add-in board. The total
+5 V current draw for both boards is as follows: a fully loaded D945GTP board (all three
expansion slots and the PCI Express x16 slot filled) must not exceed 8 A.
69
Intel Desktop Board D945GTP Technical Product Specification
2.11.3
Fan Connector Current Capability
CAUTION
The processor fan must be connected to the processor fan connector, not to a chassis fan
connector. Connecting the processor fan to a chassis fan connector may result in onboard
component damage that will halt fan operation.
Table 33 lists the current capability of the fan connectors.
Table 33.
Fan Connector Current Capability
Fan Connector
Maximum Available Current
Processor fan
3.0 A
Front chassis fan
1.5 A
Rear chassis fan
1.5 A
2.11.4
Power Supply Considerations
CAUTION
The +5 V standby line for the power supply must be capable of providing adequate +5 V standby
current. Failure to do so can damage the power supply. The total amount of standby current
required depends on the wake devices supported and manufacturing options.
System integrators should refer to the power usage values listed in Table 32 when selecting a power
supply for use with the board.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the following recommendations found in the indicated
sections of the ATX form factor specification.
• The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2)
• The current capability of the +5 VSB line (Section 4.2.1.2)
• All timing parameters (Section 4.2.1.3)
• All voltage tolerances (Section 4.2.2)
70
Technical Reference
2.12 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a
requirement. Use a processor heatsink that provides omni-directional airflow (similar to the type
shown in Figure 28) to maintain required airflow across the processor voltage regulator area.
OM16996
Figure 28. Processor Heatsink for Omni-directional Airflow
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have
been tested with Intel desktop boards please refer to the following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design remains solely with
the reader. Intel makes no warranties or representations that merely following the instructions
presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating temperature.
Failure to do so could cause components to exceed their maximum case temperature and
malfunction. For information about the maximum operating temperature, see the environmental
specifications in Section 2.14.
71
Intel Desktop Board D945GTP Technical Product Specification
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
(item A in Figure 29) can reach a temperature of up to 85 oC in an open chassis.
Figure 29 shows the locations of the localized high temperature zones.
A
B
D
C
OM17842
Item
A
B
C
D
Description
Processor voltage regulator area
Processor
Intel 82945G GMCH
Intel 82801G ICH7
Figure 29. Localized High Temperature Zones
72
Technical Reference
Table 34 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to cool
the board.
Table 34.
Thermal Considerations for Components
Component
Maximum Case Temperature
Intel Pentium 4 processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel 82945G GMCH
99 oC (under bias)
Intel 82801G ICH7
110 oC (under bias, without heatsink)
99 oC (under bias, with heatsink)
For information about
Intel Pentium 4 processor datasheets and specification updates
Refer to
Section 1.2, page 15
2.13 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D945GTP board is
108,165 hours.
73
Intel Desktop Board D945GTP Technical Product Specification
2.14 Environmental
Table 35 lists the environmental specifications for the board.
Table 35.
Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-40 °C to +70 °C
Operating
0 °C to +55 °C
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged
Half sine 2 millisecond
Product Weight (pounds)
Free Fall (inches)
Velocity Change (inches/sec)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
Packaged
5 Hz to 40 Hz: 0.015 g² Hz (flat)
20 Hz to 500 Hz: 0.02 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
74
Technical Reference
2.15 Regulatory Compliance
This section describes the Desktop Boards’ compliance with U.S. and international safety and
electromagnetic compatibility (EMC) regulations.
2.15.1
Safety Regulations
Table 36 lists the safety regulations that the Desktop Board D945GTP complies with when
correctly installed in a compatible host system.
Table 36.
Safety Regulations
Regulation
Title
UL 60950-1:2003/
Information Technology Equipment - Safety - Part 1: General
Requirements (USA and Canada)
CSA C22.2 No. 60950-1-03
EN 60950-1:2002
Information Technology Equipment - Safety - Part 1: General
Requirements (European Union)
IEC 60950-1:2001, First Edition
Information Technology Equipment - Safety - Part 1: General
Requirements (International)
2.15.2
EMC Regulations
Table 37 lists the EMC regulations the Desktop Board D945GTP complies with when correctly
installed in a compatible host system.
Table 37.
EMC Regulations
Regulation
Title
FCC (Class B)
Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B,
Radio Frequency Devices. (USA)
ICES-003 (Class B)
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022: 1998 (Class B)
Limits and methods of measurement of Radio Interference
Characteristics of Information Technology Equipment.
(European Union)
EN55024: 1998
Information Technology Equipment – Immunity Characteristics Limits
and methods of measurement. (European Union)
AS/NZS CISPR 22 (Class B)
Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22, 3rd Edition (Class B)
Limits and methods of measurement of Radio Disturbance
Characteristics of Information Technology Equipment. (International)
CISPR 24: 1997
Information Technology Equipment – Immunity Characteristics – Limits
and Methods of Measurements. (International)
VCCI (Class B)
Voluntary Control for Interference by Information Technology Equipment
(Japan)
75
Intel Desktop Board D945GTP Technical Product Specification
2.15.2.1
FCC Compliance Statement (USA)
Product Type: D945GTP Desktop Board
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment to a different electrical branch circuit from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel Corporation could
void the user’s authority to operate the equipment.
Tested to comply with FCC standards for home or office use.
2.15.2.2
Canadian Compliance Statement
This Class B digital apparatus complies with Canadian ICES-003.
Cet appereil numérique de la classe B est conforme à la norme NMB-003 du Canada.
2.15.3
European Union Declaration of Conformity Statement
We, Intel Corporation, declare under our sole responsibility that the product: Intel Desktop Board
D945GTP is in conformity with all applicable essential requirements necessary for CE marking,
following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and
Council Directive 73/23/EEC (Safety/Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for distribution within all
member states of the EU with no restrictions.
This product follows the provisions of the European Directives 89/336/EEC and 73/23/EEC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 89/336/EEC &
73/23/EEC.
76
Technical Reference
Dutch Dit product is in navolging van de bepalingen van Europees Directief 89/336/EEC &
73/23/EEC.
Suomi Tämä tuote noudattaa EU-direktiivin 89/336/EEC & 73/23/EEC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne 89/336/EEC &
73/23/EEC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 89/336/EEC &
73/23/EEC.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 89/336/ EEC &
73/23/EEC.
Italiano Questo prodotto è conforme alla Direttiva Europea 89/336/EEC & 73/23/EEC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC &
73/23/EEC.
Portuguese Este produto cumpre com as normas da Diretiva Européia 89/336/EEC &
73/23/EEC.
Español Este producto cumple con las normas del Directivo Europeo 89/336/EEC & 73/23/EEC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 89/336/EEC & 73/23/EEC.
2.15.4
Recycling Considerations
Intel encourages its customers to recycle its products and their components (e.g., batteries, circuit
boards, plastic enclosures, etc.) whenever possible. In the U.S., a list of recyclers in your area can
be found at:
http://www.eiae.org/
In the absence of a viable recycling option, products and their components must be disposed of in
accordance with all applicable local environmental regulations.
77
Intel Desktop Board D945GTP Technical Product Specification
2.15.5
Product Certification Markings (Board Level)
Table 38 lists the board’s product certification markings.
Table 38.
Product Certification Markings
Description
Marking
UL joint US/Canada Recognized Component mark. Includes adjacent
UL file number for Intel Desktop Boards: E210882 (component side).
FCC Declaration of Conformity logo mark for Class B equipment;
includes Intel name and D945GTP model designation (component side).
CE mark. Declares compliance to European Union (EU) EMC directive
(89/336/EEC) and Low Voltage directive (73/23/EEC) (component side).
The CE mark should also be on the shipping container.
Australian Communications Authority (ACA) C-Tick mark. Includes
adjacent Intel supplier code number, N-232. The C-tick mark should
also be on the shipping container.
Printed wiring board manufacturer’s recognition mark: consists of a
unique UL recognized manufacturer’s logo, along with a flammability
rating (solder side).
V-0 or 94V-0
Lead – Free Certification
Pb-free certification markings are per the JEDEC spec.
Pb-free symbol - PB_FREE_SILK
e1 symbol (specifies the composition of the solder paste) - E1_SILK
2ND Level Interconnect (used until a board is considered Pb-free per the
RoHS definition – This must follow the Pb-free symbol. It is abbreviated
per spec) - 2ND_LVL_INTCT_SILK
260 °C (specifies maximum safe processing temperature) - 260C_SILK
78
Pb
2ND LVL INTCT
260 oC
e1
3 Overview of BIOS Features
What This Chapter Contains
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Introduction .................................................................................................................. 79
BIOS Flash Memory Organization ............................................................................... 80
Resource Configuration ............................................................................................... 80
System Management BIOS (SMBIOS) ........................................................................ 81
Legacy USB Support.................................................................................................... 81
BIOS Updates .............................................................................................................. 82
Boot Options ................................................................................................................ 83
Adjusting Boot Speed................................................................................................... 84
BIOS Security Features ............................................................................................... 85
3.1 Introduction
The boards use an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI
Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup
program, POST, the PCI auto-configuration utility, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
initial production BIOSs are identified as NT94510J.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer is poweredup, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the
two match.
The BIOS Setup program can be used to view and change the BIOS settings for the computer. The
BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST)
memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main
Advanced
Security
Power
Boot
Exit
NOTE
The maintenance menu is displayed only when the Desktop Board is in configure mode. Section 2.9
on page 65 shows how to put the Desktop Board in configure mode.
79
Intel Desktop Board D945GTP Technical Product Specification
Table 39 lists the BIOS Setup program menu features.
Table 39.
BIOS Setup Program Menu Bar
Maintenance
Main
Advanced
Security
Power
Boot
Clears
passwords and
displays
processor
information
Displays
processor
and memory
configuration
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Selects boot
Configures
options
power
management
features and
power supply
controls
Exit
Saves or
discards
changes to
Setup
program
options
Table 40 lists the function keys available for menu screens.
Table 40.
BIOS Setup Program Function Keys
BIOS Setup Program Function Key
Description
<←> or <→>
Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓>
Selects an item (Moves the cursor up or down)
<Tab>
Selects a field (Not implemented)
<Enter>
Executes command or selects the submenu
<F9>
Load the default configuration values for the current menu
<F10>
Save the current values and exits the BIOS Setup program
<Esc>
Exits the menu
3.2 BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 4 Mbit (512 KB) flash
memory device.
3.3 Resource Configuration
3.3.1
PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards.
Autoconfiguration lets a user insert or remove PCI cards without having to configure the system.
When a user turns on the system after adding a PCI card, the BIOS automatically configures
interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are
considered to be available for use by the add-in card.
3.3.2
PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the
PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives
up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape
drives, and Ultra DMA drives. The interface also supports second-generation SATA drives. The
BIOS determines the capabilities of each drive and configures them to optimize capacity and
performance. To take advantage of the high capacities typically available today, hard drives are
80
Overview of BIOS Features
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending
on the capability of the drive. You can override the auto-configuration options by specifying
manual configuration in the BIOS Setup program.
To use ATA-66/100 features the following items are required:
•
•
•
An ATA-66/100 peripheral device
An ATA-66/100 compatible cable
ATA-66/100 operating system device drivers
NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For
example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive.
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in
a managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates for
system components. The MIF database defines the data and provides the method for accessing this
information. The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
•
•
•
•
BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems, such as Windows NT*, require an additional interface for
obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such
operating systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information.
3.5 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating system’s USB
drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and
to install an operating system that supports USB.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and
configure the BIOS Setup program and the maintenance menu.
4. POST completes.
81
Intel Desktop Board D945GTP Technical Product Specification
5. The operating system loads. While the operating system is loading, USB keyboards and mice
are recognized and may be used to configure the operating system.
6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are
recognized by the operating system, and Legacy USB support from the BIOS is no longer used.
To install an operating system that supports USB, follow the operating system’s installation
instructions.
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on the Intel
World Wide Web site:
•
•
Intel® Express BIOS Update utility, which enables automated updating while in the Windows
environment. Using this utility, the BIOS can be updated from a file on a hard disk, a 1.44 MB
diskette, or a CD-ROM, or from the file location on the Web.
Intel® Flash Memory Update Utility, which requires creation of a boot diskette and manual
rebooting of the system. Using this utility, the BIOS can be updated from a file on a 1.44 MB
diskette (from a legacy diskette drive or an LS-120 diskette drive) or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent accidentally
installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
For information about
Refer to
The Intel World Wide Web site
Section 1.2, page 15
3.6.1
Language Support
The BIOS Setup program and help messages are supported in US English. Additional languages
are available in the Integrator’s Toolkit utility. Check the Intel website for details.
3.6.2
Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented
with a custom splash screen. The Integrator’s Toolkit that is available from Intel can be used to
create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
82
For information about
Refer to
The Intel World Wide Web site
Section 1.2, page 15
Overview of BIOS Features
3.7 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives,
CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device,
the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled.
3.7.1
CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format
specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a
boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD
in the CD-ROM drive, the system will attempt to boot from the next defined drive.
3.7.2
Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard LAN
or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key
during POST, the User Access Level in the BIOS Setup program's Security menu must be
set to Full.
3.7.3
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the
operating system loader is invoked even if the following devices are not present:
•
•
•
3.7.4
Video adapter
Keyboard
Mouse
Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu
displays the list of available boot devices (as set in the BIOS setup program’s Boot Device Priority
Submenu). Table 41 lists the boot device menu options.
Table 41.
Boot Device Menu Options
Boot Device Menu Function Keys
Description
<↑> or <↓>
Selects a default boot device
<Enter>
Exits the menu, saves changes, and boots from the selected device
<Esc>
Exits the menu without saving changes
83
Intel Desktop Board D945GTP Technical Product Specification
3.8 Adjusting Boot Speed
These factors affect system boot speed:
•
•
3.8.1
Selecting and configuring peripherals properly
Optimized BIOS boot parameters
Peripheral Selection and Configuration
The following techniques help improve system boot speed:
•
•
•
•
3.8.2
Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds,
that minimize hard drive startup delays.
Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode
changes in POST. These features may add time to the boot process.
Try different monitors. Some monitors initialize and communicate with the BIOS more
quickly, which enables the system to boot more quickly.
BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
In the Boot Menu:
•
•
Set the hard disk drive as the first boot device. As a result, the POST does not first seek a
diskette drive, which saves about one second from the POST execution time.
Disable Quiet Boot, which eliminates display of the logo splash screen. This could save several
seconds of painting complex graphic images and changing video modes.
In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can
reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so quickly that the
Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives
with minimum initialization times can also contribute to a boot time that might be so fast that
necessary logo screens and POST messages cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If this condition
should occur, it is possible to introduce a programmable delay ranging from three to 30 seconds
(using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu
of the BIOS Setup program).
84
Overview of BIOS Features
3.9 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can
boot the computer. A supervisor password and a user password can be set for the BIOS Setup
program and for booting the computer, with the following restrictions:
•
•
•
•
•
•
•
The supervisor password gives unrestricted access to view and change all the Setup options in
the BIOS Setup program. This is the supervisor mode.
The user password gives restricted access to view and change Setup options in the BIOS Setup
program. This is the user mode.
If only the supervisor password is set, pressing the <Enter> key at the password prompt of the
BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the supervisor password
or the user password to access Setup. Users have access to Setup respective to which password
is entered.
Setting the user password restricts who can boot the computer. The password prompt will be
displayed before the computer is booted. If only the supervisor password is set, the computer
boots without asking for a password. If both passwords are set, the user can enter either
password to boot the computer.
For enhanced security, use different passwords for the supervisor and user passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in
length.
Table 42 shows the effects of setting the supervisor password and user password. This table is for
reference only and is not displayed on the screen.
Table 42.
Supervisor and User Password Functions
Supervisor
Password Set Mode
User Mode
Setup Options
Password to
Enter Setup
Password
During Boot
Neither
Can change all
options (Note)
Can change all None
options (Note)
None
None
Supervisor
only
Can change all
options
Can change a
limited number
of options
Supervisor
None
User only
N/A
Can change all Enter Password
options
Clear User Password
User
User
Supervisor
and user set
Can change all
options
Can change a
limited number
of options
Supervisor or
user
Supervisor or
user
Note:
Supervisor Password
Supervisor Password
Enter Password
If no password is set, any user can change all Setup options.
85
Intel Desktop Board D945GTP Technical Product Specification
86
4 Error Messages and Beep Codes
What This Chapter Contains
4.1
4.2
4.3
4.4
Speaker ....................................................................................................................... 87
BIOS Beep Codes........................................................................................................ 87
BIOS Error Messages .................................................................................................. 87
Port 80h POST Codes ................................................................................................. 88
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information during POST.
For information about
Refer to
The location of the onboard speaker
Figure 1, page 12
4.2 BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS displays an error message describing
the problem (see Table 43).
Table 43.
Beep Codes
Type
Pattern
Frequency
Memory error
Three long beeps
1280 Hz
Thermal warning
Four alternating beeps:
High tone: 2000 Hz
High tone, low tone, high tone, low tone
Low tone: 1600 Hz
4.3 BIOS Error Messages
Table 44 lists the error messages and provides a brief description of each.
Table 44.
BIOS Error Messages
Error Message
Explanation
CMOS Battery Low
The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad
The CMOS checksum is incorrect. CMOS memory may have
been corrupted. Run Setup to reset values.
Memory Size Decreased
Memory size has decreased since the last boot. If no memory was
removed then memory may be bad.
No Boot Device Available
System did not find a device to boot.
87
Intel Desktop Board D945GTP Technical Product Specification
4.4 Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If
the POST fails, execution stops and the last POST code generated is left at port 80h. This code is
useful for determining the point where an error occurred.
Displaying the POST-codes requires a PCI bus add-in card, often called a POST card. The POST
card can decode the port and display the contents on a medium such as a seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the BIOS:
•
•
•
Table 45 lists the Port 80h POST code ranges
Table 46 lists the Port 80h POST codes themselves
Table 47 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 45.
Port 80h POST Code Ranges
Range
Category/Subsystem
00 – 0F
Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F
Host Processors: 1F is an unrecoverable CPU error.
20 – 2F
Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F
Recovery: 3F indicated recovery failure.
40 – 4F
Reserved for future use.
50 – 5F
I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F
Reserved for future use (for new busses).
70 – 7F
Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F
Reserved for future use (new output console codes).
90 – 9F
Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF
Reserved for future use (new input console codes).
B0 – BF
Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF
Reserved for future use.
D0 – DF
Boot device selection.
E0 – FF
F0 – FF: FF processor exception.
E0 – EE: Miscellaneous codes. See Table 46.
EF boot/S3: resume failure.
88
Error Messages and Beep Codes
Table 46.
POST Code
Port 80h POST Codes
Description of POST Operation
Host Processor
10
Power-on initialization of the host processor (Boot Strap Processor)
11
Host processor Cache initialization (including APs)
12
Starting Application processor initialization
13
SMM initialization
Chipset
21
Initializing a chipset component
22
Reading SPD from memory DIMMs
23
Detecting presence of memory DIMMs
24
Programming timing parameters in the memory controller and the DIMMs
25
Configuring memory
26
Optimizing memory settings
27
Initializing memory, such as ECC init
28
Testing memory
Memory
PCI Bus
50
Enumerating PCI busses
51
Allocating resources to PCI bus
52
Hot Plug PCI controller initialization
53 – 57
Reserved for PCI Bus
USB
58
Resetting USB bus
59
Reserved for USB
ATA/ATAPI/SATA
5A
Resetting PATA/SATA bus and all devices
5B
Reserved for ATA
SMBus
5C
Resetting SMBUS
5D
Reserved for SMBUS
Local Console
70
Resetting the VGA controller
71
Disabling the VGA controller
72
Enabling the VGA controller
Remote Console
78
Resetting the console controller
79
Disabling the console controller
7A
Enabling the console controller
continued
89
Intel Desktop Board D945GTP Technical Product Specification
Table 46.
POST Code
Port 80h POST Codes (continued)
Description of POST Operation
Keyboard (PS2 or USB)
90
Resetting keyboard
91
Disabling keyboard
92
Detecting presence of keyboard
93
Enabling keyboard
94
Clearing keyboard input buffer
95
Instructing keyboard controller to run Self Test (PS2 only)
98
Resetting mouse
99
Disabling mouse
9A
Detecting presence of mouse
9B
Enabling mouse
Mouse (PS2 or USB)
Fixed Media
B0
Resetting fixed media
B1
Disabling fixed media
B2
Detecting presence of a fixed media (IDE hard drive detection etc.)
B3
Enabling/configuring a fixed media
Removable media
B8
Resetting removable media
B9
Disabling removable media
BA
Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC
Enabling/configuring a removable media
BDS
Dy
Trying boot selection y (y=0 to 15)
E0
Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT
E2
Permanent memory found.
E1, E3
Reserved for PEI/PEIMs
PEI Core
DXE Core
E4
Entered DXE phase
E5
Started dispatching drivers
E6
Started connecting drivers
continued
90
Error Messages and Beep Codes
Table 46.
POST Code
Port 80h POST Codes (continued)
Description of POST Operation
DXE Drivers
E7
Waiting for user input
E8
Checking password
E9
Entering BIOS setup
EA
TBD – Flash Update
EB
Calling Legacy Option ROMs
EE
TBD – Calling INT 19. One beep unless silent boot is enabled.
EF
TBD – Unrecoverable Boot failure/S3 resume failure
Runtime Phase/EFI OS Boot
F4
Entering Sleep state
F5
Exiting Sleep state
F8
EFI boot service ExitBootServices ( ) has been called
F9
EFI runtime service SetVirtualAddressMap ( ) has been called
FA
EFI runtime service ResetSystem ( ) has been called
30
Crisis Recovery has initiated per User request
31
Crisis Recovery has initiated by software (corrupt flash)
34
Loading recovery capsule
PEIMs/Recovery
35
Handing off control to the recovery capsule
3F
Unable to recover
91
Intel Desktop Board D945GTP Technical Product Specification
Table 47.
92
Typical Port 80h POST Sequence
POST Code
Description
21
Initializing a chipset component
22
Reading SPD from memory DIMMs
23
Detecting presence of memory DIMMs
25
Configuring memory
28
Testing memory
34
Loading recovery capsule
E4
Entered DXE phase
12
Starting Application processor initialization
13
SMM initialization
50
Enumerating PCI busses
51
Allocating resourced to PCI bus
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
Clearing keyboard input buffer
95
Keyboard Self Test
EB
Calling Video BIOS
58
Resetting USB bus
5A
Resetting PATA/SATA bus and all devices
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
Clearing keyboard input buffer
5A
Resetting PATA/SATA bus and all devices
28
Testing memory
90
Resetting keyboard
94
Clearing keyboard input buffer
E7
Waiting for user input
01
INT 19
00
Ready to boot.