2nd Generation Intel® Core™
Processor Family Desktop, Intel®
Pentium® Processor Family Desktop,
and Intel® Celeron® Processor
Family Desktop
Datasheet, Volume 1
Supporting Intel® Core™ i7, i5, and i3 Desktop Processor Series
Supporting Intel® Pentium® Processor G800 and G600 Series
Supporting Intel® Celeron® Processor G500 and G400 Series
This is Volume 1 of 2
September 2012
Document Number: 324641-007
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2
Datasheet, Volume 1
Contents
1
Introduction ..............................................................................................................9
1.1
Processor Feature Details ................................................................................... 11
1.1.1 Supported Technologies .......................................................................... 11
1.2
Interfaces ........................................................................................................ 11
1.2.1 System Memory Support ......................................................................... 11
1.2.2 PCI Express* ......................................................................................... 12
1.2.3 Direct Media Interface (DMI).................................................................... 13
1.2.4 Platform Environment Control Interface (PECI) ........................................... 14
1.2.5 Processor Graphics ................................................................................. 14
1.2.6 Intel® Flexible Display Interface (Intel® FDI) ............................................. 14
1.3
Power Management Support ............................................................................... 15
1.3.1 Processor Core....................................................................................... 15
1.3.2 System ................................................................................................. 15
1.3.3 Memory Controller.................................................................................. 15
1.3.4 PCI Express* ......................................................................................... 15
1.3.5 Direct Media Interface (DMI).................................................................... 15
1.3.6 Processor Graphics Controller................................................................... 15
1.4
Thermal Management Support ............................................................................ 15
1.5
Package ........................................................................................................... 16
1.6
Terminology ..................................................................................................... 16
1.7
Related Documents............................................................................................ 18
2
Interfaces................................................................................................................ 19
2.1
System Memory Interface................................................................................... 19
2.1.1 System Memory Technology Supported ..................................................... 19
2.1.2 System Memory Timing Support ............................................................... 21
2.1.3 System Memory Organization Modes ......................................................... 21
2.1.3.1 Single-Channel Mode................................................................. 21
2.1.3.2 Dual-Channel Mode – Intel® Flex Memory Technology Mode ........... 21
2.1.4 Rules for Populating Memory Slots ............................................................ 22
2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA).......... 23
2.1.5.1 Just-in-Time Command Scheduling.............................................. 23
2.1.5.2 Command Overlap .................................................................... 23
2.1.5.3 Out-of-Order Scheduling ............................................................ 23
2.1.6 Memory Type Range Registers (MTRRs) Enhancement ................................. 23
2.1.7 Data Scrambling .................................................................................... 23
2.2
PCI Express* Interface....................................................................................... 24
2.2.1 PCI Express* Architecture ....................................................................... 24
2.2.1.1 Transaction Layer ..................................................................... 25
2.2.1.2 Data Link Layer ........................................................................ 25
2.2.1.3 Physical Layer .......................................................................... 25
2.2.2 PCI Express* Configuration Mechanism ..................................................... 26
2.2.3 PCI Express* Port................................................................................... 26
2.2.4 PCI Express* Lanes Connection ................................................................ 27
2.3
Direct Media Interface (DMI)............................................................................... 27
2.3.1 DMI Error Flow....................................................................................... 27
2.3.2 Processor / PCH Compatibility Assumptions................................................ 27
2.3.3 DMI Link Down ...................................................................................... 28
2.4
Processor Graphics Controller (GT) ...................................................................... 28
2.4.1 3D and Video Engines for Graphics Processing ............................................ 29
2.4.1.1 3D Engine Execution Units ......................................................... 29
Datasheet, Volume 1
3
2.4.1.2 3D Pipeline ..............................................................................
2.4.1.3 Video Engine ...........................................................................
2.4.1.4 2D Engine ...............................................................................
2.4.2 Processor Graphics Display......................................................................
2.4.2.1 Display Planes..........................................................................
2.4.2.2 Display Pipes ...........................................................................
2.4.2.3 Display Ports ...........................................................................
2.4.3 Intel® Flexible Display Interface (Intel® FDI).............................................
2.4.4 Multi-Graphics Controller Multi-Monitor Support .........................................
Platform Environment Control Interface (PECI) .....................................................
Interface Clocking .............................................................................................
2.6.1 Internal Clocking Requirements ...............................................................
29
30
30
31
31
32
32
32
32
33
33
33
Technologies...........................................................................................................
3.1
Intel® Virtualization Technology (Intel® VT) .........................................................
3.1.1 Intel® Virtualization Technology (Intel® VT) for
IA-32, Intel® 64 and Intel® Architecture
(Intel® VT-x) Objectives .........................................................................
3.1.2 Intel® Virtualization Technology (Intel® VT) for
IA-32, Intel® 64 and Intel® Architecture
(Intel® VT-x) Features ...........................................................................
3.1.3 Intel® Virtualization Technology (Intel® VT) for Directed
I/O (Intel® VT-d) Objectives ...................................................................
3.1.4 Intel® Virtualization Technology (Intel® VT) for Directed
I/O (Intel® VT-d) Features ......................................................................
3.1.5 Intel® Virtualization Technology (Intel® VT) for Directed
I/O (Intel® VT-d) Features Not Supported .................................................
®
3.2
Intel Trusted Execution Technology (Intel® TXT).................................................
3.3
Intel® Hyper-Threading Technology (Intel® HT Technology) ...................................
3.4
Intel® Turbo Boost Technology ...........................................................................
3.4.1 Intel® Turbo Boost Technology Frequency.................................................
3.4.2 Intel® Turbo Boost Technology Graphics Frequency....................................
3.5
Intel® Advanced Vector Extensions (Intel® AVX)...................................................
3.6
Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) ..................
3.6.1 PCLMULQDQ Instruction .........................................................................
3.7
Intel® 64 Architecture x2APIC ............................................................................
35
35
37
38
38
39
39
39
40
40
40
40
Power Management ................................................................................................
4.1
Advanced Configuration and Power Interface (ACPI) States Supported .....................
4.1.1 System States .......................................................................................
4.1.2 Processor Core / Package Idle States........................................................
4.1.3 Integrated Memory Controller States ........................................................
4.1.4 PCI Express* Link States ........................................................................
4.1.5 Direct Media Interface (DMI) States .........................................................
4.1.6 Processor Graphics Controller States ........................................................
4.1.7 Interface State Combinations ..................................................................
4.2
Processor Core Power Management .....................................................................
4.2.1 Enhanced Intel® SpeedStep® Technology .................................................
4.2.2 Low-Power Idle States ............................................................................
4.2.3 Requesting Low-Power Idle States ...........................................................
4.2.4 Core C-states ........................................................................................
4.2.4.1 Core C0 State ..........................................................................
4.2.4.2 Core C1/C1E State ...................................................................
4.2.4.3 Core C3 State ..........................................................................
4.2.4.4 Core C6 State ..........................................................................
4.2.4.5 C-State Auto-Demotion .............................................................
4.2.5 Package C-States...................................................................................
43
44
44
44
44
44
45
45
45
46
46
46
48
48
48
49
49
49
49
50
2.5
2.6
3
4
4
35
36
36
37
Datasheet, Volume 1
4.3
4.4
4.5
4.6
4.7
4.2.5.1 Package C0 .............................................................................. 51
4.2.5.2 Package C1/C1E ....................................................................... 51
4.2.5.3 Package C3 State...................................................................... 52
4.2.5.4 Package C6 State...................................................................... 52
Integrated Memory Controller (IMC) Power Management ........................................ 52
4.3.1 Disabling Unused System Memory Outputs ................................................ 52
4.3.2 DRAM Power Management and Initialization ............................................... 53
4.3.2.1 Initialization Role of CKE ............................................................ 54
4.3.2.2 Conditional Self-Refresh............................................................. 54
4.3.2.3 Dynamic Power-down Operation ................................................. 55
4.3.2.4 DRAM I/O Power Management .................................................... 55
PCI Express* Power Management ........................................................................ 55
Direct Media Interface (DMI) Power Management .................................................. 55
Graphics Power Management .............................................................................. 56
4.6.1 Intel® Rapid Memory Power Management (Intel® RMPM)
(also known as CxSR) ............................................................................. 56
4.6.2 Intel® Graphics Performance Modulation Technology (Intel® GPMT) .............. 56
4.6.3 Graphics Render C-State ......................................................................... 56
4.6.4 Intel® Smart 2D Display Technology (Intel® S2DDT) .................................. 56
4.6.5 Intel® Graphics Dynamic Frequency.......................................................... 57
Thermal Power Management ............................................................................... 57
5
Thermal Management .............................................................................................. 59
6
Signal Description ................................................................................................... 61
6.1
System Memory Interface Signals........................................................................ 62
6.2
Memory Reference and Compensation Signals ....................................................... 63
6.3
Reset and Miscellaneous Signals .......................................................................... 64
6.4
PCI Express*-Based Interface Signals .................................................................. 65
6.5
Intel® Flexible Display Interface (Intel® FDI) Signals ............................................. 65
6.6
Direct Media Interface (DMI) Signals .................................................................... 66
6.7
Phase Lock Loop (PLL) Signals ............................................................................ 66
6.8
Test Access Points (TAP) Signals ......................................................................... 66
6.9
Error and Thermal Protection Signals ................................................................... 67
6.10 Power Sequencing Signals .................................................................................. 67
6.11 Processor Power Signals ..................................................................................... 68
6.12 Sense Signals ................................................................................................... 68
6.13 Ground and Non-Critical to Function (NCTF) Signals ............................................... 68
6.14 Processor Internal Pull-Up / Pull-Down Resistors .................................................... 69
7
Electrical Specifications ........................................................................................... 71
7.1
Power and Ground Lands .................................................................................... 71
7.2
Decoupling Guidelines ........................................................................................ 71
7.2.1 Voltage Rail Decoupling........................................................................... 71
7.3
Processor Clocking (BCLK[0], BCLK#[0]) .............................................................. 72
7.3.1 Phase Lock Loop (PLL) Power Supply......................................................... 72
7.4
VCC Voltage Identification (VID) .......................................................................... 72
7.5
System Agent (SA) VCC VID ............................................................................... 76
7.6
Reserved or Unused Signals................................................................................ 76
7.7
Signal Groups ................................................................................................... 77
7.8
Test Access Port (TAP) Connection....................................................................... 78
7.9
Storage Conditions Specifications ........................................................................ 79
7.10 DC Specifications .............................................................................................. 80
7.10.1 Voltage and Current Specifications............................................................ 80
7.11 Platform Environmental Control Interface (PECI) DC Specifications........................... 86
7.11.1 PECI Bus Architecture ............................................................................. 86
7.11.2 DC Characteristics .................................................................................. 87
Datasheet, Volume 1
5
7.11.3 Input Device Hysteresis .......................................................................... 87
8
Processor Pin and Signal Information ..................................................................... 89
8.1
Processor Pin Assignments ................................................................................. 89
9
DDR Data Swizzling................................................................................................109
Figures
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
4-1
4-2
4-3
4-4
7-1
7-2
8-1
8-2
8-3
8-4
Desktop Platform System Block Diagram Example ......................................................
Intel® Flex Memory Technology Operation .................................................................
PCI Express* Layering Diagram................................................................................
Packet Flow through the Layers................................................................................
PCI Express* Related Register Structures in the Processor ...........................................
PCI Express* Typical Operation 16 lanes Mapping .......................................................
Processor Graphics Controller Unit Block Diagram .......................................................
Processor Display Block Diagram ..............................................................................
Power States .........................................................................................................
Idle Power Management Breakdown of the Processor Cores..........................................
Thread and Core C-State Entry and Exit ....................................................................
Package C-State Entry and Exit ................................................................................
Example for PECI Host-clients Connection..................................................................
Input Device Hysteresis ..........................................................................................
Socket Pinmap (Top View, Upper-Left Quadrant) ........................................................
Socket Pinmap (Top View, Upper-Right Quadrant) ......................................................
Socket Pinmap (Top View, Lower-Left Quadrant) ........................................................
Socket Pinmap (Top View, Lower-Right Quadrant) ......................................................
10
22
24
25
26
27
28
31
43
47
47
51
86
87
90
91
92
93
Tables
1-1
1-2
1-3
2-1
2-2
2-3
2-4
4-1
4-2
4-3
4-4
4-5
4-6
4-7
4-8
4-9
4-10
6-1
6-2
6-3
6-4
6-5
6-6
6-7
6-8
6-9
6-10
6
PCI Express* Supported Configurations in Desktop Products ........................................
Terminology ..........................................................................................................
Related Documents ................................................................................................
Supported UDIMM Module Configurations ..................................................................
Supported SO-DIMM Module Configurations (AIO Only) ...............................................
DDR3 System Memory Timing Support ......................................................................
Reference Clock .....................................................................................................
System States .......................................................................................................
Processor Core / Package State Support ....................................................................
Integrated Memory Controller States ........................................................................
PCI Express* Link States .........................................................................................
Direct Media Interface (DMI) States ..........................................................................
Processor Graphics Controller States .........................................................................
G, S, and C State Combinations ...............................................................................
Coordination of Thread Power States at the Core Level ................................................
P_LVLx to MWAIT Conversion...................................................................................
Coordination of Core Power States at the Package Level ..............................................
Signal Description Buffer Types ................................................................................
Memory Channel A Signals ......................................................................................
Memory Channel B Signals ......................................................................................
Memory Reference and Compensation .......................................................................
Reset and Miscellaneous Signals...............................................................................
PCI Express* Graphics Interface Signals ....................................................................
Intel® Flexible Display Interface (Intel® FDI) .............................................................
Direct Media Interface (DMI) Signals – Processor to PCH Serial Interface .......................
Phase Lock Loop (PLL) Signals .................................................................................
Test Access Points (TAP) Signals ..............................................................................
12
16
18
20
20
21
33
44
44
44
44
45
45
45
47
48
50
61
62
63
63
64
65
65
66
66
66
Datasheet, Volume 1
6-11
6-12
6-13
6-14
6-15
6-16
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
7-9
7-10
7-11
8-1
9-1
9-2
Error and Thermal Protection Signals ......................................................................... 67
Power Sequencing Signals........................................................................................ 67
Processor Power Signals .......................................................................................... 68
Sense Signals......................................................................................................... 68
Ground and Non-Critical to Function (NCTF) Signals .................................................... 68
Processor Internal Pull-Up / Pull-Down Resistors ......................................................... 69
VR 12.0 Voltage Identification Definition .................................................................... 73
VCCSA_VID configuration ........................................................................................ 76
Signal Groups 1 ...................................................................................................... 77
Storage Condition Ratings ........................................................................................ 79
Processor Core Active and Idle Mode DC Voltage and Current Specifications.................... 80
Processor System Agent I/O Buffer Supply DC Voltage and Current Specifications ........... 82
Processor Graphics VID based (VAXG) Supply DC Voltage and Current Specifications ........ 83
DDR3 Signal Group DC Specifications ........................................................................ 84
Control Sideband and TAP Signal Group DC Specifications ............................................ 85
PCI Express* DC Specifications ................................................................................. 85
PECI DC Electrical Limits .......................................................................................... 87
Processor Pin List by Pin Name ................................................................................. 94
DDR Data Swizzling Table – Channel A .................................................................... 110
DDR Data Swizzling Table – Channel B .................................................................... 111
Datasheet, Volume 1
7
Revision History
Revision
Number
001
Revision
Date
Description
January
2011
Initial release
002
• Added Intel® Core™ i5-2405S, i5-2310, and i3-2105 processors
• Added Intel® Pentium® processor family desktop – Intel®
Pentium® G850, G840, G620, and G620T processors
May 2011
003
• Added Intel® Core™ i5-2320, i3-2125, i3-2130, and i3-2120T
processors
• Added Intel® Celeron® processor family desktop – Intel® Celeron
G540, G530, G530T, and G440 processors
• Added Intel® Pentium® G860, G630, and G630T processors
September
2011
004
• Added Intel® Core™ i7-2700K processor
005
• Added Intel® Celeron® G460 processor
006
• Added Intel® Core™ i5-2550K, i5-2450P, i5-2380P processors
007
• Added Intel® Pentium® G645, G645T processors
• Added Intel® Celeron® G555, G550T, G465 processors
October
2011
December
2011
January
2012
September
2012
§§
8
Datasheet, Volume 1
Introduction
1
Introduction
The 2nd Generation Intel® Core™ processor family desktop, Intel® Pentium® processor
family desktop, and Intel® Celeron® processor family desktop are the next generation
of 64-bit, multi-core desktop processor built on 32- nanometer process technology.
Based on a new micro-architecture, the processor is designed for a two-chip platform
consisting of a processor and Platform Controller Hub (PCH). The platform enables
higher performance, lower cost, easier validation, and improved x-y footprint. The
processor includes Integrated Display Engine, Processor Graphics, PCI Express* ports,
and Integrated Memory Controller. The processor is designed for desktop platforms. It
supports up to 12 Processor Graphics execution units (EUs). The processor is offered in
an 1155-land LGA package. Figure 1-1 shows an example desktop platform block
diagram.
This document provides DC electrical specifications, signal integrity, differential
signaling specifications, pinout and signal definitions, interface functional descriptions,
thermal specifications, and additional feature information pertinent to the
implementation and operation of the processor on its respective platform.
Note:
Throughout this document, 2nd Generation Intel® Core™ processor family desktop,
Intel® Pentium® processor family desktop, and Intel® Celeron® processor family
desktop may be referred to as simply the processor.
Note:
Throughout this document, the Intel® Core™ i7 desktop processor series refers to the
Intel® Core™ i7-2700K, i7-2600K, i7-2600S, and i7-2600 processors.
Note:
Throughout this document, the Intel® Core™ i5 desktop processor series refers to the
Intel® Core™ i5-2550K, i5-2500K, i5-2500S, i5-2500T, i5-2500, i5-2450P, i5-2400,
i5-2405S, i5-2400S, i5-2390T, i5-2380P, i5-2320, i5-2310, and i5-2300 processors.
Note:
Throughout this document, the Intel® Core™ i3 desktop processor series refers to the
Intel® Core™ i3-2130, i3-2125, i3-2120, i3-2120T, i3-2105, i3-2100, and i3-2100T
processors.
Note:
Throughout this document, the Intel® Pentium® processor family desktop refers to the
Intel® Pentium® G870, G860, G860T, G850, G840, G645, G645T, G640, G540T, G630,
G630T, G620, and G620T processors.
Throughout this document, the Intel® Celeron® processor family desktop refers to the
Intel® Celeron® G555, G550, G550T, G540, G540T, G530, G530T, G465, G460, and
G440 processors.
Note:
Throughout this document, the Intel® 6 Series Chipset Platform Controller Hub may
also be referred to as “PCH”.
Note:
Some processor features are not available on all platforms. Refer to the processor
specification update for details.
Datasheet, Volume 1
9
Introduction
Figure 1-1.
10
Desktop Platform System Block Diagram Example
Datasheet, Volume 1
Introduction
1.1
Processor Feature Details
• Four or two execution cores
• A 32-KB instruction and 32-KB data first-level cache (L1) for each core
• A 256-KB shared instruction/data second-level cache (L2) for each core
• Up to 8-MB shared instruction/data third-level cache (L3), shared among all cores
1.1.1
Supported Technologies
• Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d)
• Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel®
Architecture (Intel® VT-x)
• Intel® Active Management Technology 7.0 (Intel® AMT 7.0)
• Intel® Trusted Execution Technology (Intel® TXT)
• Intel® Streaming SIMD Extensions 4.1 (Intel® SSE4.1)
• Intel® Streaming SIMD Extensions 4.2 (Intel® SSE4.2)
• Intel® Hyper-Threading Technology (Intel® HT Technology)
• Intel® 64 Architecture
• Execute Disable Bit
• Intel® Turbo Boost Technology
• Intel® Advanced Vector Extensions (Intel® AVX)
• Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)
• PCLMULQDQ Instruction
1.2
Interfaces
1.2.1
System Memory Support
• Two channels of unbuffered DDR3 memory with a maximum of two UDIMMs or SODIMMs (for AIO) per channel
• Single-channel and dual-channel memory organization modes
• Data burst length of eight for all memory organization modes
• Memory DDR3 data transfer rates of 1066 MT/s and 1333 MT/s
• 64-bit wide channels
• DDR3 I/O Voltage of 1.5 V
• The type of memory supported by the processor is dependent on the PCH SKU in
the target platform
— Desktop PCH platforms support non-ECC un-buffered DIMMs only
— All In One platforms (AIO) support SO-DIMMs
• Maximum memory bandwidth of 10.6 GB/s in single-channel mode or 21 GB/s in
dual-channel mode assuming DDR3 1333 MT/s
• 1Gb, 2Gb, and 4Gb DDR3 DRAM technologies are supported
— Using 4Gb device technologies, the largest memory capacity possible is 32 GB,
assuming Dual Channel Mode with four x8 dual ranked unbuffered DIMM
memory configuration.
Datasheet, Volume 1
11
Introduction
• Up to 64 simultaneous open pages, 32 per channel (assuming 8 ranks of 8 bank
devices)
• Command launch modes of 1n/2n
• On-Die Termination (ODT)
• Asynchronous ODT
• Intel® Fast Memory Access (Intel® FMA)
— Just-in-Time Command Scheduling
— Command Overlap
— Out-of-Order Scheduling
1.2.2
PCI Express*
• PCI Express* port(s) are fully-compliant with the PCI Express Base Specification,
Revision 2.0.
• Processor with desktop PCH supported configurations
Table 1-1.
PCI Express* Supported Configurations in Desktop Products
Configuration
Organization
Desktop
1
2x8
Graphics, I/O
2
1x16
Graphics, I/O
• The port may negotiate down to narrower widths
— Support for x16/x8/x4/x1 widths for a single PCI Express mode
• 2.5 GT/s and 5.0 GT/s PCI Express* frequencies are supported
• Gen1 Raw bit-rate on the data pins of 2.5 GT/s, resulting in a real bandwidth per
pair of 250 MB/s given the 8b/10b encoding used to transmit data across this
interface. This also does not account for packet overhead and link maintenance.
• Maximum theoretical bandwidth on the interface of 4 GB/s in each direction
simultaneously, for an aggregate of 8 GB/s when x16 Gen 1
• Gen 2 Raw bit-rate on the data pins of 5.0 GT/s, resulting in a real bandwidth per
pair of 500 MB/s given the 8b/10b encoding used to transmit data across this
interface. This also does not account for packet overhead and link maintenance.
• Maximum theoretical bandwidth on the interface of 8 GB/s in each direction
simultaneously, for an aggregate of 16 GB/s when x16 Gen 2
• Hierarchical PCI-compliant configuration mechanism for downstream devices
• Traditional PCI style traffic (asynchronous snooped, PCI ordering)
• PCI Express* extended configuration space. The first 256 bytes of configuration
space aliases directly to the PCI Compatibility configuration space. The remaining
portion of the fixed 4-KB block of memory-mapped space above that (starting at
100h) is known as extended configuration space.
• PCI Express* Enhanced Access Mechanism; accessing the device configuration
space in a flat memory mapped fashion
• Automatic discovery, negotiation, and training of link out of reset
• Traditional AGP style traffic (asynchronous non-snooped, PCI-X Relaxed ordering)
• Peer segment destination posted write traffic (no peer-to-peer read traffic) in
Virtual Channel 0
— DMI -> PCI Express* Port 0
12
Datasheet, Volume 1
Introduction
• 64-bit downstream address format, but the processor never generates an address
above 64 GB (Bits 63:36 will always be zeros)
• 64-bit upstream address format, but the processor responds to upstream read
transactions to addresses above 64 GB (addresses where any of Bits 63:36 are
nonzero) with an Unsupported Request response. Upstream write transactions to
addresses above 64 GB will be dropped.
• Re-issues Configuration cycles that have been previously completed with the
Configuration Retry status
• PCI Express* reference clock is 100-MHz differential clock
• Power Management Event (PME) functions
• Dynamic width capability
• Message Signaled Interrupt (MSI and MSI-X) messages
• Polarity inversion
Note:
The processor does not support PCI Express* Hot-Plug.
1.2.3
Direct Media Interface (DMI)
• DMI 2.0 support
• Four lanes in each direction
• 5 GT/s point-to-point DMI interface to PCH is supported
• Raw bit-rate on the data pins of 5.0 GB/s, resulting in a real bandwidth per pair of
500 MB/s given the 8b/10b encoding used to transmit data across this interface.
Does not account for packet overhead and link maintenance.
• Maximum theoretical bandwidth on interface of 2 GB/s in each direction
simultaneously, for an aggregate of 4 GB/s when DMI x4
• Shares 100-MHz PCI Express* reference clock
• 64-bit downstream address format, but the processor never generates an address
above 64 GB (Bits 63:36 will always be zeros)
• 64-bit upstream address format, but the processor responds to upstream read
transactions to addresses above 64 GB (addresses where any of Bits 63:36 are
nonzero) with an Unsupported Request response. Upstream write transactions to
addresses above 64 GB will be dropped.
• Supports the following traffic types to or from the PCH
— DMI -> DRAM
— DMI -> processor core (Virtual Legacy Wires (VLWs), Resetwarn, or MSIs only)
— Processor core -> DMI
• APIC and MSI interrupt messaging support
— Message Signaled Interrupt (MSI and MSI-X) messages
• Downstream SMI, SCI and SERR error indication
• Legacy support for ISA regime protocol (PHOLD/PHOLDA) required for parallel port
DMA, floppy drive, and LPC bus masters
• DC coupling – no capacitors between the processor and the PCH
• Polarity inversion
• PCH end-to-end lane reversal across the link
• Supports Half Swing “low-power/low-voltage”
Datasheet, Volume 1
13
Introduction
1.2.4
Platform Environment Control Interface (PECI)
The PECI is a one-wire interface that provides a communication channel between a
PECI client (the processor) and a PECI master. The processors support the PECI 3.0
Specification.
1.2.5
Processor Graphics
• The Processor Graphics contains a refresh of the sixth generation graphics core
enabling substantial gains in performance and lower power consumption.
• Next Generation Intel Clear Video Technology HD support is a collection of video
playback and enhancement features that improve the end user’s viewing
experience.
— Encode/transcode HD content
— Playback of high definition content including Blu-ray Disc*
— Superior image quality with sharper, more colorful images
— Playback of Blu-ray disc S3D content using HDMI (V.1.4 with 3D)
• DirectX* Video Acceleration (DXVA) support for accelerating video processing
— Full AVC/VC1/MPEG2 HW Decode
• Advanced Scheduler 2.0, 1.0, XPDM support
• Windows* 7, XP, Windows Vista*, OSX, Linux OS Support
• DX10.1, DX10, DX9 support
• OGL 3.0 support
• Switchable graphics support on desktop AIO platforms with MxM solutions only
1.2.6
Intel® Flexible Display Interface (Intel® FDI)
• For SKUs with graphics, Intel FDI carries display traffic from the Processor Graphics
in the processor to the legacy display connectors in the PCH
• Based on DisplayPort standard
• Two independent links – one for each display pipe
• Four unidirectional downstream differential transmitter pairs
— Scalable down to 3X, 2X, or 1X based on actual display bandwidth
requirements
— Fixed frequency 2.7 GT/s data rate
• Two sideband signals for Display synchronization
— FDI_FSYNC and FDI_LSYNC (Frame and Line Synchronization)
• One Interrupt signal used for various interrupts from the PCH
— FDI_INT signal shared by both Intel FDI Links
• PCH supports end-to-end lane reversal across both links
• Common 100-MHz reference clock
14
Datasheet, Volume 1
Introduction
1.3
Power Management Support
1.3.1
Processor Core
• Full support of Advanced Configuration and Power Interface (ACPI) C-states as
implemented by the following processor C-states
— C0, C1, C1E, C3, C6
• Enhanced Intel SpeedStep® Technology
1.3.2
System
• S0, S3, S4, S5
1.3.3
Memory Controller
• Conditional self-refresh (Intel® Rapid Memory Power Management (Intel® RMPM))
• Dynamic power-down
1.3.4
PCI Express*
• L0s and L1 ASPM power management capability
1.3.5
Direct Media Interface (DMI)
• L0s and L1 ASPM power management capability
1.3.6
Processor Graphics Controller
• Intel® Rapid Memory Power Management (Intel® RMPM) – CxSR
• Intel® Graphics Performance Modulation Technology (Intel® GPMT)
• Intel Smart 2D Display Technology (Intel S2DDT)
• Graphics Render C-State (RC6)
1.4
Thermal Management Support
• Digital Thermal Sensor
• Intel Adaptive Thermal Monitor
• THERMTRIP# and PROCHOT# support
• On-Demand Mode
• Memory Thermal Throttling
• External Thermal Sensor (TS-on-DIMM and TS-on-Board)
• Render Thermal Throttling
• Fan speed control with DTS
Datasheet, Volume 1
15
Introduction
1.5
Package
• The processor socket type is noted as LGA 1155. The package is a 37.5 x 37.5 mm
Flip Chip Land Grid Array (FCLGA 1155).
Note:
See the 2nd Generation Intel® Core™ Processor, Intel® Pentium® Processor, and
Intel® Celeron® Processor, and LGA1155 Socket Thermal Mechanical Specifications and
Design Guidelines for complete details on package.
1.6
Terminology
Table 1-2.
Terminology (Sheet 1 of 2)
Term
16
Description
ACPI
Advanced Configuration and Power Interface
AIO
All In One
BLT
Block Level Transfer
CRT
Cathode Ray Tube
DDR3
Third-generation Double Data Rate SDRAM memory technology
DMA
Direct Memory Access
DMI
Direct Media Interface
DP
DisplayPort*
DTS
Digital Thermal Sensor
Enhanced Intel
SpeedStep® Technology
Technology that provides power management capabilities to laptops.
EU
Execution Unit
Execute Disable Bit
The Execute Disable bit allows memory to be marked as executable or nonexecutable, when combined with a supporting operating system. If code
attempts to run in non-executable memory the processor raises an error to the
operating system. This feature can prevent some classes of viruses or worms
that exploit buffer overrun vulnerabilities and can thus help improve the overall
security of the system. See the Intel® 64 and IA-32 Architectures Software
Developer's Manuals for more detailed information.
IMC
Integrated Memory Controller
Intel® 64 Technology
64-bit memory extensions to the IA-32 architecture
Intel® FDI
Intel® Flexible Display Interface
Intel® TXT
Intel® Trusted Execution Technology
Intel® Virtualization
Technology
Processor virtualization which when used in conjunction with Virtual Machine
Monitor software enables multiple, robust independent software environments
inside a single platform.
Intel® VT-d
Intel® Virtualization Technology (Intel® VT) for Directed I/O. Intel VT-d is a
hardware assist, under system software (Virtual Machine Manager or OS)
control, for enabling I/O device virtualization. Intel VT-d also brings robust
security by providing protection from errant DMAs by using DMA remapping, a
key feature of Intel VT-d.
IOV
I/O Virtualization
ITPM
Integrated Trusted Platform Module
LCD
Liquid Crystal Display
LVDS
Low Voltage Differential Signaling. A high speed, low power data transmission
standard used for display connections to LCD panels.
NCTF
Non-Critical to Function. NCTF locations are typically redundant ground or noncritical reserved, so the loss of the solder joint continuity at end of life conditions
will not affect the overall product functionality.
Datasheet, Volume 1
Introduction
Table 1-2.
Terminology (Sheet 2 of 2)
Term
Description
PCH
Platform Controller Hub. The new, 2009 chipset with centralized platform
capabilities including the main I/O interfaces along with display connectivity,
audio features, power management, manageability, security and storage
features.
PECI
Platform Environment Control Interface
PEG
PCI Express* Graphics. External Graphics using PCI Express* Architecture. A
high-speed serial interface whose configuration is software compatible with the
existing PCI specifications.
Processor
The 64-bit, single-core or multi-core component (package).
Processor Core
The term “processor core” refers to Si die itself which can contain multiple
execution cores. Each execution core has an instruction cache, data cache, and
256-KB L2 cache. All execution cores share the L3 cache.
Processor Graphics
Intel® Processor Graphics
Rank
A unit of DRAM corresponding four to eight devices in parallel. These devices are
usually, but not always, mounted on a single side of a SO-DIMM.
SCI
System Control Interrupt. Used in ACPI protocol.
Storage Conditions
A non-operational state. The processor may be installed in a platform, in a tray,
or loose. Processors may be sealed in packaging or exposed to free air. Under
these conditions, processor landings should not be connected to any supply
voltages, have any I/Os biased or receive any clocks. Upon exposure to “free air”
(that is, unsealed packaging or a device removed from packaging material) the
processor must be handled in accordance with moisture sensitivity labeling
(MSL) as indicated on the packaging material.
TAC
Thermal Averaging Constant.
TAP
Test Access Point
TDP
Thermal Design Power.
VAXG
Graphics core power supply.
VCC
Processor core power supply.
VCCIO
High Frequency I/O logic power supply
VCCPLL
PLL power supply
VCCSA
System Agent (memory controller, DMI, PCIe controllers, and display engine)
power supply
VDDQ
DDR3 power supply.
VLD
Variable Length Decoding.
VSS
Processor ground.
x1
Refers to a Link or Port with one Physical Lane.
x16
Refers to a Link or Port with sixteen Physical Lanes.
x4
Refers to a Link or Port with four Physical Lanes.
x8
Refers to a Link or Port with eight Physical Lanes.
Datasheet, Volume 1
17
Introduction
1.7
Related Documents
Refer to Table 1-3 for additional information.
Table 1-3.
Related Documents
Document
Document Number/ Location
2nd Generation Intel® Core™ Processor Family Desktop, Intel®Pentium®
Processor Family Desktop, and Intel® Celeron® Processor Family Desktop
Datasheet, Volume 2
http://download.intel.com/design
/processor/datashts/324642.pdf
2nd Generation Intel® Core™ Processor Family Desktop, Intel®Pentium®
Processor Family Desktop, and Intel® Celeron® Processor Family Desktop
Specification Update
http://download.intel.com/design
/processor/specupdt/324643.pdf
2nd Generation Intel® Core™ Processor Family Desktop, Intel®Pentium®
Processor Family Desktop, and Intel® Celeron® Processor Family Desktop,
and LGA1155 Socket Thermal Mechanical Specifications and Design
Guidelines
http://download.intel.com/design
/processor/designex/324644.pdf
Intel® 6 Series Chipset and Intel® C200 Series Chipset Datasheet
www.intel.com/Assets/PDF/datas
heet/324645.pdf
Intel® 6 Series Chipset and Intel® C200 Series Chipset Thermal
Mechanical Specifications and Design Guidelines
www.intel.com/Assets/PDF/desig
nguide/324647.pdf
Advanced Configuration and Power Interface Specification 3.0
http://www.acpi.info/
PCI Local Bus Specification 3.0
http://www.pcisig.com/specifications
Intel® TXT Measured Launched Environment Developer’s Guide
http://www.intel.com/technology
/security
Intel® 64 Architecture x2APIC Specification
http://www.intel.com/products/pr
ocessor/manuals/
PCI Express* Base Specification 2.0
http://www.pcisig.com
DDR3 SDRAM Specification
http://www.jedec.org
DisplayPort* Specification
http://www.vesa.org
Intel® 64 and IA-32 Architectures Software Developer's Manuals
http://www.intel.com/products/pr
ocessor/manuals/index.htm
Volume 1: Basic Architecture
253665
Volume 2A: Instruction Set Reference, A-M
253666
Volume 2B: Instruction Set Reference, N-Z
253667
Volume 3A: System Programming Guide
253668
Volume 3B: System Programming Guide
253669
§§
18
Datasheet, Volume 1
Interfaces
2
Interfaces
This chapter describes the interfaces supported by the processor.
2.1
System Memory Interface
2.1.1
System Memory Technology Supported
The Integrated Memory Controller (IMC) supports DDR3 protocols with two
independent, 64-bit wide channels each accessing one or two DIMMs. The type of
memory supported by the processor is dependant on the PCH SKU in the target
platform. Refer to Chapter 1 for supported memory configuration details.
It supports a maximum of two DDR3 DIMMs per-channel; thus, allowing up to four
device ranks per-channel.
• DDR3 Data Transfer Rates
— 1066 MT/s (PC3-8500), 1333 MT/s (PC3-10600)
• DDR3 SO-DIMM Modules
— Raw Card A – Dual Ranked x16 unbuffered non-ECC
— Raw Card B – Single Ranked x8 unbuffered non-ECC
— Raw Card C – Single Ranked x16 unbuffered non-ECC
— Raw Card F – Dual Ranked x8 (planar) unbuffered non-ECC
• Desktop PCH platform DDR3 DIMM Modules
— Raw Card A – Single Ranked x8 unbuffered non-ECC
— Raw Card B – Dual Ranked x8 unbuffered non-ECC
— Raw Card C – Single Ranked x16 unbuffered non-ECC
• Advanced Server/Workstation PCH platforms DDR3 DIMM Modules:
—
—
—
—
—
Raw
Raw
Raw
Raw
Raw
Card
Card
Card
Card
Card
A – Single Ranked x8 unbuffered non-ECC
B – Dual Ranked x8 unbuffered non-ECC
C – Single Ranked x16 unbuffered non-ECC
D – Single Ranked x8 unbuffered ECC
E – Dual Ranked x8 unbuffered ECC
• Essential/Standard Server PCH platforms DDR3 DIMM Modules:
— Raw Card D – Single Ranked x8 unbuffered ECC
— Raw Card E – Dual Ranked x8 unbuffered ECC
DDR3 DRAM Device Technology: 1-Gb, 2-Gb, and 4 Gb DDR3 DRAM Device
technologies and addressing are supported.
Datasheet, Volume 1
19
Interfaces
Table 2-1.
Raw
Card
Version
Supported UDIMM Module Configurations
DIMM
Capacity
DRAM Device
Technology
DRAM
Organization
# of
DRAM
Devices
# of
Physical
Device
Ranks
# of
Row/Col
Address
Bits
# of
Banks
Inside
DRAM
Page Size
Unbuffered/Non-ECC Supported DIMM Module Configurations
A
B
C
1 GB
1 Gb
128 M X 8
8
2
14/10
8
8K
2 GB
2 Gb
128 M X 16
8
2
14/10
8
16 K
2 GB
1 Gb
128 M X 8
16
2
14/10
8
8K
4 GB
2 Gb
256 M X 8
16
2
15/10
8
8K
8 GB
4 Gb
512 M X 8
16
2
16/10
8
8K
512 MB
1 Gb
64 M X 16
4
1
13/10
8
16 K
1 GB
2 Gb
128 M X 16
4
1
14/10
8
16 K
Note:
Table 2-2.
Raw
Card
Version
A
B
C
F
DIMM module support is based on availability and is subject to change.
Supported SO-DIMM Module Configurations (AIO Only)1,2
DRAM
Organization
# of
DRAM
Devices
# of
Physical
Device
Ranks
# of
Row/Col
Address Bits
# of Banks
Inside
DRAM
Page Size
1 Gb
64 M x 16
8
2
13/10
8
8K
2 Gb
128 M x 16
8
2
14/10
8
8K
1 GB
1 Gb
128 M x 8
8
1
14/10
8
8K
2 GB
2 Gb
256 M x 8
8
1
15/10
8
8K
DIMM
Capacity
DRAM Device
Technology
1 GB
2 GB
512 MB
1 Gb
64 M x 16
4
1
13/10
8
8K
1 GB
2 Gb
128 M x 16
4
1
14/10
8
8K
2 GB
1 Gb
128 M x 8
16
2
14/10
8
8K
4 GB
2 Gb
256 M x 8
16
2
15/10
8
8K
8 GB
4 Gb
512 M x 8
16
2
16/ 10
8
8K
Notes:
1.
System memory configurations are based on availability and are subject to change.
2.
Interface does not support ULV/LV memory modules or ULV/LV DIMMs.
20
Datasheet, Volume 1
Interfaces
2.1.2
System Memory Timing Support
The IMC supports the following DDR3 Speed Bin, CAS Write Latency (CWL), and
command signal mode timings on the main memory interface:
• tCL = CAS Latency
• tRCD = Activate Command to READ or WRITE Command delay
• tRP = PRECHARGE Command Period
• CWL = CAS Write Latency
• Command Signal modes = 1n indicates a new command may be issued every clock
and 2n indicates a new command may be issued every 2 clocks. Command launch
mode programming depends on the transfer rate and memory configuration.
Table 2-3.
DDR3 System Memory Timing Support
Segment
Transfer
Rate
(MT/s)
tCL
(tCK)
tRCD
(tCK)
tRP
(tCK)
CWL
(tCK)
7
7
7
6
1066
All Desktop
segments
8
1333
9
8
9
8
9
6
7
DPC
CMD
Mode
1
1n/2n
2
2n
1
1n/2n
2
2n
1
1n/2n
2
2n
Notes1
Notes:
1.
System memory timing support is based on availability and is subject to change.
2.1.3
System Memory Organization Modes
The IMC supports two memory organization modes—single-channel and dual-channel.
Depending upon how the DIMM Modules are populated in each memory channel, a
number of different configurations can exist.
2.1.3.1
Single-Channel Mode
In this mode, all memory cycles are directed to a single-channel. Single-channel mode
is used when either Channel A or Channel B DIMM connectors are populated in any
order, but not both.
2.1.3.2
Dual-Channel Mode – Intel® Flex Memory Technology Mode
The IMC supports Intel Flex Memory Technology Mode. Memory is divided into a
symmetric and an asymmetric zone. The symmetric zone starts at the lowest address
in each channel and is contiguous until the asymmetric zone begins or until the top
address of the channel with the smaller capacity is reached. In this mode, the system
runs with one zone of dual-channel mode and one zone of single-channel mode,
simultaneously, across the whole memory array.
Note:
Channels A and B can be mapped for physical channels 0 and 1 respectively or vice
versa; however, channel A size must be greater or equal to channel B size.
Datasheet, Volume 1
21
Interfaces
Figure 2-1.
Intel® Flex Memory Technology Operation
2.1.3.2.1
Dual-Channel Symmetric Mode
Dual-Channel Symmetric mode, also known as interleaved mode, provides maximum
performance on real world applications. Addresses are ping-ponged between the
channels after each cache line (64-byte boundary). If there are two requests, and the
second request is to an address on the opposite channel from the first, that request can
be sent before data from the first request has returned. If two consecutive cache lines
are requested, both may be retrieved simultaneously since they are ensured to be on
opposite channels. Use Dual-Channel Symmetric mode when both Channel A and
Channel B DIMM connectors are populated in any order, with the total amount of
memory in each channel being the same.
When both channels are populated with the same memory capacity and the boundary
between the dual channel zone and the single channel zone is the top of memory, IMC
operates completely in Dual-Channel Symmetric mode.
Note:
The DRAM device technology and width may vary from one channel to the other.
2.1.4
Rules for Populating Memory Slots
In all modes, the frequency of system memory is the lowest frequency of all memory
modules placed in the system, as determined through the SPD registers on the
memory modules. The system memory controller supports one or two DIMM
connectors per channel. The usage of DIMM modules with different latencies is allowed,
but in that case, the worst latency (per channel) will be used. For dual-channel modes,
both channels must have a DIMM connector populated and for single-channel mode,
only a single-channel may have one or both DIMM connectors populated.
Note:
22
In a 2 DIMM Per Channel (2DPC) daisy chain layout memory configuration, the furthest
DIMM from the processor of any given channel must always be populated first.
Datasheet, Volume 1
Interfaces
2.1.5
Technology Enhancements of Intel® Fast Memory Access
(Intel® FMA)
The following sections describe the Just-in-Time Scheduling, Command Overlap, and
Out-of-Order Scheduling Intel FMA technology enhancements.
2.1.5.1
Just-in-Time Command Scheduling
The memory controller has an advanced command scheduler where all pending
requests are examined simultaneously to determine the most efficient request to be
issued next. The most efficient request is picked from all pending requests and issued
to system memory Just-in-Time to make optimal use of Command Overlapping. Thus,
instead of having all memory access requests go individually through an arbitration
mechanism forcing requests to be executed one at a time, they can be started without
interfering with the current request allowing for concurrent issuing of requests. This
allows for optimized bandwidth and reduced latency while maintaining appropriate
command spacing to meet system memory protocol.
2.1.5.2
Command Overlap
Command Overlap allows the insertion of the DRAM commands between the Activate,
Precharge, and Read/Write commands normally used, as long as the inserted
commands do not affect the currently executing command. Multiple commands can be
issued in an overlapping manner, increasing the efficiency of system memory protocol.
2.1.5.3
Out-of-Order Scheduling
While leveraging the Just-in-Time Scheduling and Command Overlap enhancements,
the IMC continuously monitors pending requests to system memory for the best use of
bandwidth and reduction of latency. If there are multiple requests to the same open
page, these requests would be launched in a back to back manner to make optimum
use of the open memory page. This ability to reorder requests on the fly allows the IMC
to further reduce latency and increase bandwidth efficiency.
2.1.6
Memory Type Range Registers (MTRRs) Enhancement
The processor has 2 additional MTRRs (total 10 MTRRs). These additional MTRRs are
specially important in supporting larger system memory beyond 4 GB.
2.1.7
Data Scrambling
The memory controller incorporates a DDR3 Data Scrambling feature to minimize the
impact of excessive di/dt on the platform DDR3 VRs due to successive 1s and 0s on the
data bus. Past experience has demonstrated that traffic on the data bus is not random
and can have energy concentrated at specific spectral harmonics creating high di/dt
that is generally limited by data patterns that excite resonance between the package
inductance and on-die capacitances. As a result, the memory controller uses a data
scrambling feature to create pseudo-random patterns on the DDR3 data bus to reduce
the impact of any excessive di/dt.
Datasheet, Volume 1
23
Interfaces
2.2
PCI Express* Interface
This section describes the PCI Express interface capabilities of the processor. See the
PCI Express Base Specification for details of PCI Express.
The number of PCI Express controllers is dependent on the platform. Refer to Chapter 1
for details.
2.2.1
PCI Express* Architecture
Compatibility with the PCI addressing model is maintained to ensure that all existing
applications and drivers operate unchanged.
The PCI Express configuration uses standard mechanisms as defined in the PCI
Plug-and-Play specification. The initial recovered clock speed of 1.25 GHz results in
2.5 Gb/s/direction that provides a 250 MB/s communications channel in each direction
(500 MB/s total). That is close to twice the data rate of classic PCI. The fact that
8b/10b encoding is used accounts for the 250 MB/s where quick calculations would
imply 300 MB/s. The external graphics ports support Gen2 speed as well. At 5.0 GT/s,
Gen 2 operation results in twice as much bandwidth per lane as compared to Gen 1
operation. When operating with two PCIe controllers, each controller can be operating
at either 2.5 GT/s or 5.0 GT/s.
The PCI Express architecture is specified in three layers—Transaction Layer, Data Link
Layer, and Physical Layer. The partitioning in the component is not necessarily along
these same boundaries. Refer to Figure 2-2 for the PCI Express Layering Diagram.
Figure 2-2.
PCI Express* Layering Diagram
PCI Express uses packets to communicate information between components. Packets
are formed in the Transaction and Data Link Layers to carry the information from the
transmitting component to the receiving component. As the transmitted packets flow
through the other layers, they are extended with additional information necessary to
24
Datasheet, Volume 1
Interfaces
handle packets at those layers. At the receiving side, the reverse process occurs and
packets get transformed from their Physical Layer representation to the Data Link
Layer representation and finally (for Transaction Layer Packets) to the form that can be
processed by the Transaction Layer of the receiving device.
Figure 2-3.
Packet Flow through the Layers
2.2.1.1
Transaction Layer
The upper layer of the PCI Express architecture is the Transaction Layer. The
Transaction Layer's primary responsibility is the assembly and disassembly of
Transaction Layer Packets (TLPs). TLPs are used to communicate transactions, such as
read and write, as well as certain types of events. The Transaction Layer also manages
flow control of TLPs.
2.2.1.2
Data Link Layer
The middle layer in the PCI Express stack, the Data Link Layer, serves as an
intermediate stage between the Transaction Layer and the Physical Layer.
Responsibilities of Data Link Layer include link management, error detection, and error
correction.
The transmission side of the Data Link Layer accepts TLPs assembled by the
Transaction Layer, calculates and applies data protection code and TLP sequence
number, and submits them to Physical Layer for transmission across the Link. The
receiving Data Link Layer is responsible for checking the integrity of received TLPs and
for submitting them to the Transaction Layer for further processing. On detection of TLP
error(s), this layer is responsible for requesting retransmission of TLPs until information
is correctly received, or the Link is determined to have failed. The Data Link Layer also
generates and consumes packets that are used for Link management functions.
2.2.1.3
Physical Layer
The Physical Layer includes all circuitry for interface operation, including driver and
input buffers, parallel-to-serial and serial-to-parallel conversion, PLL(s), and impedance
matching circuitry. It also includes logical functions related to interface initialization and
maintenance. The Physical Layer exchanges data with the Data Link Layer in an
implementation-specific format, and is responsible for converting this to an appropriate
serialized format and transmitting it across the PCI Express Link at a frequency and
width compatible with the remote device.
Datasheet, Volume 1
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Interfaces
2.2.2
PCI Express* Configuration Mechanism
The PCI Express (external graphics) link is mapped through a PCI-to-PCI bridge
structure.
Figure 2-4.
PCI Express* Related Register Structures in the Processor
PCI Express extends the configuration space to 4096 bytes per-device/function, as
compared to 256 bytes allowed by the Conventional PCI Specification. PCI Express
configuration space is divided into a PCI-compatible region (that consists of the first
256 bytes of a logical device's configuration space) and an extended PCI Express region
(that consists of the remaining configuration space). The PCI-compatible region can be
accessed using either the mechanisms defined in the PCI specification or using the
enhanced PCI Express configuration access mechanism described in the PCI Express
Enhanced Configuration Mechanism section.
The PCI Express Host Bridge is required to translate the memory-mapped PCI Express
configuration space accesses from the host processor to PCI Express configuration
cycles. To maintain compatibility with PCI configuration addressing mechanisms, it is
recommended that system software access the enhanced configuration space using
32-bit operations (32-bit aligned) only. See the PCI Express Base Specification for
details of both the PCI-compatible and PCI Express Enhanced configuration
mechanisms and transaction rules.
2.2.3
PCI Express* Port
The PCI Express interface on the processor is a single, 16-lane (x16) port that can also
be configured at narrower widths. The PCI Express port is compliant with the PCI
Express Base Specification, Revision 2.0.
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Datasheet, Volume 1
Interfaces
2.2.4
PCI Express* Lanes Connection
Figure 2-5 demonstrates the PCIe lanes mapping.
Figure 2-5.
PCI Express* Typical Operation 16 lanes Mapping
2.3
Direct Media Interface (DMI)
Direct Media Interface (DMI) connects the processor and the PCH. Next generation
DMI2 is supported.
Note:
Only DMI x4 configuration is supported.
2.3.1
DMI Error Flow
DMI can only generate SERR in response to errors, never SCI, SMI, MSI, PCI INT, or
GPE. Any DMI related SERR activity is associated with Device 0.
2.3.2
Processor / PCH Compatibility Assumptions
The processor is compatible with the Intel® 6 Series Chipset PCH. The processor is
not compatible with any previous PCH products.
Datasheet, Volume 1
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Interfaces
2.3.3
DMI Link Down
The DMI link going down is a fatal, unrecoverable error. If the DMI data link goes to
data link down, after the link was up, then the DMI link hangs the system by not
allowing the link to retrain to prevent data corruption. This link behavior is controlled
by the PCH.
Downstream transactions that had been successfully transmitted across the link prior
to the link going down may be processed as normal. No completions from downstream,
non-posted transactions are returned upstream over the DMI link after a link down
event.
2.4
Processor Graphics Controller (GT)
New Graphics Engine Architecture includes 3D compute elements, Multi-format
hardware-assisted decode/encode Pipeline, and Mid-Level Cache (MLC) for superior
high definition playback, video quality, and improved 3D performance and Media.
Display Engine in the Uncore handles delivering the pixels to the screen. GSA (Graphics
in System Agent) is the primary Channel interface for display memory accesses and
“PCI-like” traffic in and out.
Figure 2-6.
28
Processor Graphics Controller Unit Block Diagram
Datasheet, Volume 1
Interfaces
2.4.1
3D and Video Engines for Graphics Processing
The 3D graphics pipeline architecture simultaneously operates on different primitives or
on different portions of the same primitive. All the cores are fully programmable,
increasing the versatility of the 3D Engine. The Gen 6.0 3D engine provides the
following performance and power-management enhancements:
• Up to 12 Execution units (EUs)
• Hierarchal-Z
• Video quality enhancements
2.4.1.1
3D Engine Execution Units
• Supports up to 12 EUs. The EUs perform 128-bit wide execution per clock.
• Support SIMD8 instructions for vertex processing and SIMD16 instructions for pixel
processing.
2.4.1.2
3D Pipeline
2.4.1.2.1
Vertex Fetch (VF) Stage
The VF stage executes 3DPRIMITIVE commands. Some enhancements have been
included to better support legacy D3D APIs as well as SGI OpenGL*.
2.4.1.2.2
Vertex Shader (VS) Stage
The VS stage performs shading of vertices output by the VF function. The VS unit
produces an output vertex reference for every input vertex reference received from the
VF unit, in the order received.
2.4.1.2.3
Geometry Shader (GS) Stage
The GS stage receives inputs from the VS stage. Compiled application-provided GS
programs, specifying an algorithm to convert the vertices of an input object into some
output primitives. For example, a GS shader may convert lines of a line strip into
polygons representing a corresponding segment of a blade of grass centered on the
line. Or it could use adjacency information to detect silhouette edges of triangles and
output polygons extruding out from the edges.
2.4.1.2.4
Clip Stage
The Clip stage performs general processing on incoming 3D objects. However, it also
includes specialized logic to perform a Clip Test function on incoming objects. The Clip
Test optimizes generalized 3D Clipping. The Clip unit examines the position of incoming
vertices, and accepts/rejects 3D objects based on its Clip algorithm.
2.4.1.2.5
Strips and Fans (SF) Stage
The SF stage performs setup operations required to rasterize 3D objects. The outputs
from the SF stage to the Windower stage contain implementation-specific information
required for the rasterization of objects and also supports clipping of primitives to some
extent.
Datasheet, Volume 1
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Interfaces
2.4.1.2.6
Windower/IZ (WIZ) Stage
The WIZ unit performs an early depth test, which removes failing pixels and eliminates
unnecessary processing overhead.
The Windower uses the parameters provided by the SF unit in the object-specific
rasterization algorithms. The WIZ unit rasterizes objects into the corresponding set of
pixels. The Windower is also capable of performing dithering, whereby the illusion of a
higher resolution when using low-bpp channels in color buffers is possible. Color
dithering diffuses the sharp color bands seen on smooth-shaded objects.
2.4.1.3
Video Engine
The Video Engine handles the non-3D (media/video) applications. It includes support
for VLD and MPEG2 decode in hardware.
2.4.1.4
2D Engine
The 2D Engine contains BLT (Block Level Transfer) functionality and an extensive set of
2D instructions. To take advantage of the 3D during engine’s functionality, some BLT
functions make use of the 3D renderer.
2.4.1.4.1
Processor Graphics VGA Registers
The 2D registers consists of original VGA registers and others to support graphics
modes that have color depths, resolutions, and hardware acceleration features that go
beyond the original VGA standard.
2.4.1.4.2
Logical 128-Bit Fixed BLT and 256 Fill Engine
This BLT engine accelerates the GUI of Microsoft Windows* operating systems. The
128-bit BLT engine provides hardware acceleration of block transfers of pixel data for
many common Windows operations. The BLT engine can be used for the following:
• Move rectangular blocks of data between memory locations
• Data alignment
• To perform logical operations (raster ops)
The rectangular block of data does not change, as it is transferred between memory
locations. The allowable memory transfers are between: cacheable system memory
and frame buffer memory, frame buffer memory and frame buffer memory, and within
system memory. Data to be transferred can consist of regions of memory, patterns, or
solid color fills. A pattern is always 8 x 8 pixels wide and may be 8, 16, or 32 bits per
pixel.
The BLT engine expands monochrome data into a color depth of 8, 16, or 32 bits. BLTs
can be either opaque or transparent. Opaque transfers move the data specified to the
destination. Transparent transfers compare destination color to source color and write
according to the mode of transparency selected.
Data is horizontally and vertically aligned at the destination. If the destination for the
BLT overlaps with the source memory location, the BLT engine specifies which area in
memory to begin the BLT transfer. Hardware is included for all 256 raster operations
(source, pattern, and destination) defined by Microsoft, including transparent BLT.
The BLT engine has instructions to invoke BLT and stretch BLT operations, permitting
software to set up instruction buffers and use batch processing. The BLT engine can
perform hardware clipping during BLTs.
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Datasheet, Volume 1
Interfaces
2.4.2
Processor Graphics Display
The Processor Graphics controller display pipe can be broken down into three
components:
• Display Planes
• Display Pipes
• DisplayPort and Intel FDI
Figure 2-7.
Processor Display Block Diagram
2.4.2.1
Display Planes
A display plane is a single displayed surface in memory and contains one image
(desktop, cursor, overlay). It is the portion of the display hardware logic that defines
the format and location of a rectangular region of memory that can be displayed on
display output device and delivers that data to a display pipe. This is clocked by the
Core Display Clock.
2.4.2.1.1
Planes A and B
Planes A and B are the main display planes and are associated with Pipes A and B
respectively. The two display pipes are independent, allowing for support of two
independent display streams. They are both double-buffered, which minimizes latency
and improves visual quality.
2.4.2.1.2
Sprite A and B
Sprite A and Sprite B are planes optimized for video decode, and are associated with
Planes A and B respectively. Sprite A and B are also double-buffered.
2.4.2.1.3
Cursors A and B
Cursors A and B are small, fixed-sized planes dedicated for mouse cursor acceleration,
and are associated with Planes A and B respectively. These planes support resolutions
up to 256 x 256 each.
Datasheet, Volume 1
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Interfaces
2.4.2.1.4
Video Graphics Array (VGA)
VGA is used for boot, safe mode, legacy games, etc. It can be changed by an
application without OS/driver notification, due to legacy requirements.
2.4.2.2
Display Pipes
The display pipe blends and synchronizes pixel data received from one or more display
planes and adds the timing of the display output device upon which the image is
displayed. This is clocked by the Display Reference clock inputs.
The display pipes A and B operate independently of each other at the rate of 1 pixel per
clock. They can attach to any of the display ports. Each pipe sends display data to the
PCH over the Intel Flexible Display Interface (Intel FDI).
2.4.2.3
Display Ports
The display ports consist of output logic and pins that transmit the display data to the
associated encoding logic and send the data to the display device (that is, LVDS,
HDMI*, DVI, SDVO, and so on). All display interfaces connecting external displays are
now repartitioned and driven from the PCH.
2.4.3
Intel® Flexible Display Interface (Intel® FDI)
The Intel Flexible Display Interface (Intel® FDI) is a proprietary link for carrying display
traffic from the Processor Graphics controller to the PCH display I/Os. Intel® FDI
supports two independent channels—one for pipe A and one for pipe B.
• Each channel has four transmit (Tx) differential pairs used for transporting pixel
and framing data from the display engine.
• Each channel has one single-ended LineSync and one FrameSync input (1-V CMOS
signaling).
• One display interrupt line input (1-V CMOS signaling).
• Intel® FDI may dynamically scalable down to 2X or 1X based on actual display
bandwidth requirements.
• Common 100-MHz reference clock.
• Each channel transports at a rate of 2.7 Gbps.
• PCH supports end-to-end lane reversal across both channels (no reversal support
required in the processor).
2.4.4
Multi-Graphics Controller Multi-Monitor Support
The processor supports simultaneous use of the Processor Graphics Controller (GT) and
a x16 PCI Express Graphics (PEG) device.
The processor supports a maximum of 2 displays connected to the PEG card in parallel
with up to 2 displays connected to the PCH.
Note:
32
When supporting Multi Graphics controllers Multi-Monitors, “drag and drop” between
monitors and the 2x8 PEG is not supported.
Datasheet, Volume 1
Interfaces
2.5
Platform Environment Control Interface (PECI)
The PECI is a one-wire interface that provides a communication channel between a
PECI client (processor) and a PECI master. The processor implements a PECI interface
to:
• Allow communication of processor thermal and other information to the PECI
master.
• Read averaged Digital Thermal Sensor (DTS) values for fan speed control.
2.6
Interface Clocking
2.6.1
Internal Clocking Requirements
Table 2-4.
Reference Clock
Reference Input Clock
BCLK[0]/BCLK#[0]
Input Frequency
Associated PLL
100 MHz
Processor/Memory/Graphics/PCIe/DMI/FDI
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Datasheet, Volume 1
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34
Datasheet, Volume 1
Technologies
3
Technologies
This chapter provides a high-level description of Intel technologies implemented in the
processor.
The implementation of the features may vary between the processor SKUs.
Details on the different technologies of Intel processors and other relevant external
notes are located at the Intel technology web site: http://www.intel.com/technology/
3.1
Intel® Virtualization Technology (Intel® VT)
Intel Virtualization Technology (Intel® VT) makes a single system appear as multiple
independent systems to software. This allows multiple, independent operating systems
to run simultaneously on a single system. Intel VT comprises technology components
to support virtualization of platforms based on Intel architecture microprocessors and
chipsets. Intel Virtualization Technology (Intel VT-x) added hardware support in the
processor to improve the virtualization performance and robustness. Intel Virtualization
Technology for Directed I/O (Intel VT-d) adds chipset hardware implementation to
support and improve I/O virtualization performance and robustness.
Intel VT-x specifications and functional descriptions are included in the Intel® 64 and
IA-32 Architectures Software Developer’s Manual, Volume 3B and is available at:
http://www.intel.com/products/processor/manuals/index.htm
The Intel VT-d specification and other VT documents can be referenced at:
http://www.intel.com/technology/virtualization/index.htm
3.1.1
Intel® Virtualization Technology (Intel® VT) for
IA-32, Intel® 64 and Intel® Architecture
(Intel® VT-x) Objectives
Intel VT-x provides hardware acceleration for virtualization of IA platforms. Virtual
Machine Monitor (VMM) can use Intel VT-x features to provide improved a reliable
virtualized platform. By using Intel VT-x, a VMM is:
• Robust: VMMs no longer need to use paravirtualization or binary translation. This
means that they will be able to run off-the-shelf OSs and applications without any
special steps.
• Enhanced: Intel VT enables VMMs to run 64-bit guest operating systems on IA x86
processors.
• More reliable: Due to the hardware support, VMMs can now be smaller, less
complex, and more efficient. This improves reliability and availability and reduces
the potential for software conflicts.
• More secure: The use of hardware transitions in the VMM strengthens the isolation
of VMs and further prevents corruption of one VM from affecting others on the
same system.
Datasheet, Volume 1
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Technologies
3.1.2
Intel® Virtualization Technology (Intel® VT) for
IA-32, Intel® 64 and Intel® Architecture
(Intel® VT-x) Features
The processor core supports the following Intel VT-x features:
• Extended Page Tables (EPT)
— EPT is hardware assisted page table virtualization
— It eliminates VM exits from guest OS to the VMM for shadow page-table
maintenance
• Virtual Processor IDs (VPID)
— Ability to assign a VM ID to tag processor core hardware structures (such as
TLBs)
— This avoids flushes on VM transitions to give a lower-cost VM transition time
and an overall reduction in virtualization overhead.
• Guest Preemption Timer
— Mechanism for a VMM to preempt the execution of a guest OS after an amount
of time specified by the VMM. The VMM sets a timer value before entering a
guest
— The feature aids VMM developers in flexibility and Quality of Service (QoS)
assurances
• Descriptor-Table Exiting
— Descriptor-table exiting allows a VMM to protect a guest OS from internal
(malicious software based) attack by preventing relocation of key system data
structures like IDT (interrupt descriptor table), GDT (global descriptor table),
LDT (local descriptor table), and TSS (task segment selector).
— A VMM using this feature can intercept (by a VM exit) attempts to relocate
these data structures and prevent them from being tampered by malicious
software.
3.1.3
Intel® Virtualization Technology (Intel® VT) for Directed
I/O (Intel® VT-d) Objectives
The key Intel VT-d objectives are domain-based isolation and hardware-based
virtualization. A domain can be abstractly defined as an isolated environment in a
platform to which a subset of host physical memory is allocated. Virtualization allows
for the creation of one or more partitions on a single system. This could be multiple
partitions in the same operating system, or there can be multiple operating system
instances running on the same system – offering benefits such as system
consolidation, legacy migration, activity partitioning, or security.
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3.1.4
Intel® Virtualization Technology (Intel® VT) for Directed
I/O (Intel® VT-d) Features
The processor supports the following Intel VT-d features:
• Memory controller and Processor Graphics comply with Intel® VT-d 1.2
specification.
• Two VT-d DMA remap engines.
— iGraphics DMA remap engine
— DMI/PEG
• Support for root entry, context entry, and default context
• 39-bit guest physical address and host physical address widths
• Support for 4K page sizes only
• Support for register-based fault recording only (for single entry only) and support
for MSI interrupts for faults
• Support for both leaf and non-leaf caching
• Support for boot protection of default page table
• Support for non-caching of invalid page table entries
• Support for hardware based flushing of translated but pending writes and pending
reads, on IOTLB invalidation
• Support for page-selective IOTLB invalidation
• MSI cycles (MemWr to address FEEx_xxxxh) not translated
— Translation faults result in cycle forwarding to VBIOS region (byte enables
masked for writes). Returned data may be bogus for internal agents, PEG/DMI
interfaces return unsupported request status
• Interrupt Remapping is supported
• Queued invalidation is supported.
• VT-d translation bypass address range is supported (Pass Through)
Note:
Intel VT-d Technology may not be available on all SKUs.
3.1.5
Intel® Virtualization Technology (Intel® VT) for Directed
I/O (Intel® VT-d) Features Not Supported
The following features are not supported by the processor with Intel VT-d:
• No support for PCISIG endpoint caching (ATS)
• No support for Intel VT-d read prefetching/snarfing (that is, translations within a
cacheline are not stored in an internal buffer for reuse for subsequent translations).
• No support for advance fault reporting
• No support for super pages
• No support for Intel VT-d translation bypass address range (such usage models
need to be resolved with VMM help in setting up the page tables correctly)
Datasheet, Volume 1
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Technologies
3.2
Intel® Trusted Execution Technology (Intel® TXT)
Intel Trusted Execution Technology (Intel TXT) defines platform-level enhancements
that provide the building blocks for creating trusted platforms.
The Intel TXT platform helps to provide the authenticity of the controlling environment
such that those wishing to rely on the platform can make an appropriate trust decision.
The Intel TXT platform determines the identity of the controlling environment by
accurately measuring and verifying the controlling software.
Another aspect of the trust decision is the ability of the platform to resist attempts to
change the controlling environment. The Intel TXT platform will resist attempts by
software processes to change the controlling environment or bypass the bounds set by
the controlling environment.
Intel TXT is a set of extensions designed to provide a measured and controlled launch
of system software that will then establish a protected environment for itself and any
additional software that it may execute.
These extensions enhance two areas:
• The launching of the Measured Launched Environment (MLE)
• The protection of the MLE from potential corruption
The enhanced platform provides these launch and control interfaces using Safer Mode
Extensions (SMX).
The SMX interface includes the following functions:
• Measured/Verified launch of the MLE
• Mechanisms to ensure the above measurement is protected and stored in a secure
location
• Protection mechanisms that allow the MLE to control attempts to modify itself
For more information, refer to the Intel® TXT Measured Launched Environment
Developer’s Guide in http://www.intel.com/technology/security.
3.3
Intel® Hyper-Threading Technology (Intel® HT
Technology)
The processor supports Intel® Hyper-Threading Technology (Intel® HT Technology),
that allows an execution core to function as two logical processors. While some
execution resources (such as caches, execution units, and buses) are shared, each
logical processor has its own architectural state with its own set of general-purpose
registers and control registers. This feature must be enabled using the BIOS and
requires operating system support.
Intel recommends enabling Intel HT Technology with Microsoft Windows 7*, Microsoft
Windows Vista*, Microsoft Windows* XP Professional/Windows* XP Home, and
disabling Intel HT Technology using the BIOS for all previous versions of Windows
operating systems. For more information on Intel HT Technology, see
http://www.intel.com/technology/platform-technology/hyper-threading/.
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3.4
Intel® Turbo Boost Technology
Intel® Turbo Boost Technology is a feature that allows the processor core to
opportunistically and automatically run faster than its rated operating frequency/render
clock if it is operating below power, temperature, and current limits. The Intel Turbo
Boost Technology feature is designed to increase performance of both multi-threaded
and single-threaded workloads. Maximum frequency is dependant on the SKU and
number of active cores. No special hardware support is necessary for Intel Turbo Boost
Technology. BIOS and the OS can enable or disable Intel Turbo Boost Technology.
Compared with previous generation products, Intel Turbo Boost Technology will
increase the ratio of application power to TDP. Thus, thermal solutions and platform
cooling that are designed to less than thermal design guidance might experience
thermal and performance issues since more applications will tend to run at the
maximum power limit for significant periods of time.
Note:
Intel Turbo Boost Technology may not be available on all SKUs.
3.4.1
Intel® Turbo Boost Technology Frequency
The processor’s rated frequency assumes that all execution cores are running an
application at the thermal design power (TDP). However, under typical operation, not
all cores are active. Therefore, most applications are consuming less than the TDP at
the rated frequency. To take advantage of the available thermal headroom, the active
cores can increase their operating frequency.
To determine the highest performance frequency amongst active cores, the processor
takes the following into consideration:
• The number of cores operating in the C0 state.
• The estimated current consumption.
• The estimated power consumption.
• The temperature.
Any of these factors can affect the maximum frequency for a given workload. If the
power, current, or thermal limit is reached, the processor will automatically reduce the
frequency to stay with its TDP limit.
Note:
Intel Turbo Boost Technology processor frequencies are only active if the operating
system is requesting the P0 state. For more information on P-states and C-states, refer
to Chapter 4, “Power Management”.
3.4.2
Intel® Turbo Boost Technology Graphics Frequency
Graphics render frequency is selected by the processor dynamically based on graphics
workload demand. The processor can optimize both processor and Processor Graphics
performance by managing power for the overall package. For the Processor Graphics,
this allows an increase in the render core frequency and increased graphics
performance for graphics intensive workloads. In addition, during processor intensive
workloads when the graphics power is low, the processor core can increase its
frequency higher within the package power limit. Enabling Intel Turbo Boost Technology
will maximize the performance of the processor core and the graphics render frequency
within the specified package power levels.
Datasheet, Volume 1
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Technologies
3.5
Intel® Advanced Vector Extensions (Intel® AVX)
Intel Advanced Vector Extensions (Intel AVX) is the latest expansion of the Intel
instruction set. It extends the Intel Streaming SIMD Extensions (Intel SSE) from 128bit vectors into 256-bit vectors. Intel AVX addresses the continued need for vector
floating-point performance in mainstream scientific and engineering numerical
applications, visual processing, recognition, data-mining/synthesis, gaming, physics,
cryptography and other areas of applications. The enhancement in Intel AVX allows for
improved performance due to wider vectors, new extensible syntax, and rich
functionality including the ability to better manage, rearrange, and sort data. For more
information on Intel AVX, see http://www.intel.com/software/avx
3.6
Intel® Advanced Encryption Standard New
Instructions (Intel® AES-NI)
The processor supports Advanced Encryption Standard New Instructions (Intel AES-NI)
that are a set of Single Instruction Multiple Data (SIMD) instructions that enable fast
and secure data encryption and decryption based on the Advanced Encryption Standard
(AES). Intel AES-NI are valuable for a wide range of cryptographic applications; such
as, applications that perform bulk encryption/decryption, authentication, random
number generation, and authenticated encryption. AES is broadly accepted as the
standard for both government and industry applications, and is widely deployed in
various protocols.
Intel AES-NI consists of six Intel SSE instructions. Four instructions, AESENC,
AESENCLAST, AESDEC, and AESDELAST facilitate high performance AES encryption and
decryption. The other two, AESIMC and AESKEYGENASSIST, support the AES key
expansion procedure. Together, these instructions provide a full hardware for
supporting AES, offering security, high performance, and a great deal of flexibility.
3.6.1
PCLMULQDQ Instruction
The processor supports the carry-less multiplication instruction, PCLMULQDQ.
PCLMULQDQ is a Single Instruction Multiple Data (SIMD) instruction that computes the
128-bit carry-less multiplication of two, 64-bit operands without generating and
propagating carries. Carry-less multiplication is an essential processing component of
several cryptographic systems and standards. Hence, accelerating carry-less
multiplication can significantly contribute to achieving high speed secure computing
and communication.
3.7
Intel® 64 Architecture x2APIC
The x2APIC architecture extends the xAPIC architecture that provides a key mechanism
for interrupt delivery. This extension is intended primarily to increase processor
addressability.
Specifically, x2APIC:
• Retains all key elements of compatibility to the xAPIC architecture
— delivery modes
— interrupt and processor priorities
— interrupt sources
— interrupt destination types
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Datasheet, Volume 1
Technologies
• Provides extensions to scale processor addressability for both the logical and
physical destination modes
• Adds new features to enhance performance of interrupt delivery
• Reduces complexity of logical destination mode interrupt delivery on link based
architectures
The key enhancements provided by the x2APIC architecture over xAPIC are the
following:
• Support for two modes of operation to provide backward compatibility and
extensibility for future platform innovations
— In xAPIC compatibility mode, APIC registers are accessed through a memory
mapped interface to a 4 KB page, identical to the xAPIC architecture.
— In x2APIC mode, APIC registers are accessed through Model Specific Register
(MSR) interfaces. In this mode, the x2APIC architecture provides significantly
increased processor addressability and some enhancements on interrupt
delivery.
• Increased range of processor addressability in x2APIC mode
— Physical xAPIC ID field increases from 8 bits to 32 bits, allowing for interrupt
processor addressability up to 4G-1 processors in physical destination mode. A
processor implementation of x2APIC architecture can support fewer than 32bits in a software transparent fashion.
— Logical xAPIC ID field increases from 8 bits to 32 bits. The 32-bit logical x2APIC
ID is partitioned into two sub-fields—a 16-bit cluster ID and a 16-bit logical ID
within the cluster. Consequently, ((2^20) -16) processors can be addressed in
logical destination mode. Processor implementations can support fewer than
16 bits in the cluster ID sub-field and logical ID sub-field in a software agnostic
fashion.
• More efficient MSR interface to access APIC registers
— To enhance inter-processor and self directed interrupt delivery as well as the
ability to virtualize the local APIC, the APIC register set can be accessed only
through MSR based interfaces in the x2APIC mode. The Memory Mapped IO
(MMIO) interface used by xAPIC is not supported in the x2APIC mode.
• The semantics for accessing APIC registers have been revised to simplify the
programming of frequently-used APIC registers by system software. Specifically,
the software semantics for using the Interrupt Command Register (ICR) and End Of
Interrupt (EOI) registers have been modified to allow for more efficient delivery
and dispatching of interrupts.
The x2APIC extensions are made available to system software by enabling the local
x2APIC unit in the “x2APIC” mode. To benefit from x2APIC capabilities, a new
Operating System and a new BIOS are both needed, with special support for the
x2APIC mode.
The x2APIC architecture provides backward compatibility to the xAPIC architecture and
forward extendibility for future Intel platform innovations.
Note:
Intel x2APIC technology may not be available on all processor SKUs.
For more information, refer to the Intel® 64 Architecture x2APIC Specification at
http://www.intel.com/products/processor/manuals/
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Datasheet, Volume 1
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Technologies
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Datasheet, Volume 1
Power Management
4
Power Management
This chapter provides information on the following power management topics:
•
•
•
•
•
•
Figure 4-1.
Advanced Configuration and Power Interface (ACPI) States
Processor Core
Integrated Memory Controller (IMC)
PCI Express*
Direct Media Interface (DMI)
Processor Graphics Controller
Power States
Datasheet, Volume 1
43
Power Management
4.1
Advanced Configuration and Power Interface
(ACPI) States Supported
The ACPI states supported by the processor are described in this section.
4.1.1
System States
Table 4-1.
System States
State
G0/S0
G1/S3-Cold
Description
Full On
Suspend-to-RAM (STR). Context saved to memory (S3-Hot is not supported by the processor).
G1/S4
Suspend-to-Disk (STD). All power lost (except wakeup on PCH).
G2/S5
Soft off. All power lost (except wakeup on PCH). Total reboot.
G3
Mechanical off. All power removed from system.
4.1.2
Processor Core / Package Idle States
Table 4-2.
Processor Core / Package State Support
State
C0
C1
C1E
Description
Active mode, processor executing code
AutoHALT state
AutoHALT state with lowest frequency and voltage operating point
C3
Execution cores in C3 flush their L1 instruction cache, L1 data cache, and L2 cache to the L3
shared cache. Clocks are shut off to each core.
C6
Execution cores in this state save their architectural state before removing core voltage.
4.1.3
Integrated Memory Controller States
Table 4-3.
Integrated Memory Controller States
State
Power up
Pre-charge
Power-down
Active PowerDown
Self-Refresh
Description
CKE asserted. Active mode
CKE de-asserted (not self-refresh) with all banks closed
CKE de-asserted (not self-refresh) with minimum one bank active
CKE de-asserted using device self-refresh
4.1.4
PCI Express* Link States
Table 4-4.
PCI Express* Link States
State
44
Description
L0
Full on – Active transfer state
L0s
First Active Power Management low power state – Low exit latency
L1
Lowest Active Power Management – Longer exit latency
L3
Lowest power state (power-off) – Longest exit latency
Datasheet, Volume 1
Power Management
4.1.5
Direct Media Interface (DMI) States
Table 4-5.
Direct Media Interface (DMI) States
State
Description
L0
Full on – Active transfer state
L0s
First Active Power Management low power state – Low exit latency
L1
Lowest Active Power Management – Longer exit latency
L3
Lowest power state (power-off) – Longest exit latency
4.1.6
Processor Graphics Controller States
Table 4-6.
Processor Graphics Controller States
State
D0
D3 Cold
Description
Full on, display active
Power-off
4.1.7
Interface State Combinations
Table 4-7.
G, S, and C State Combinations
Global
(G) State
Datasheet, Volume 1
Sleep
(S) State
Processor
Package
(C) State
Processor State
System Clocks
Description
G0
S0
C0
Full On
On
Full On
G0
S0
C1/C1E
Auto-Halt
On
Auto-Halt
G0
S0
C3
Deep Sleep
On
Deep Sleep
G0
S0
C6
Deep Power-down
On
Deep Power-down
G1
S3
Power off
Off, except RTC
Suspend to RAM
G1
S4
Power off
Off, except RTC
Suspend to Disk
G2
S5
Power off
Off, except RTC
Soft Off
G3
NA
Power off
Power off
Hard off
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Power Management
4.2
Processor Core Power Management
While executing code, Enhanced Intel SpeedStep Technology optimizes the processor’s
frequency and core voltage based on workload. Each frequency and voltage operating
point is defined by ACPI as a P-state. When the processor is not executing code, it is
idle. A low-power idle state is defined by ACPI as a C-state. In general, lower power
C-states have longer entry and exit latencies.
4.2.1
Enhanced Intel® SpeedStep® Technology
The following are the key features of Enhanced Intel SpeedStep Technology:
• Multiple frequency and voltage points for optimal performance and power
efficiency. These operating points are known as P-states.
• Frequency selection is software controlled by writing to processor MSRs. The
voltage is optimized based on the selected frequency and the number of active
processor cores.
— If the target frequency is higher than the current frequency, VCC is ramped up
in steps to an optimized voltage. This voltage is signaled by the SVID bus to the
voltage regulator. Once the voltage is established, the PLL locks on to the
target frequency.
— If the target frequency is lower than the current frequency, the PLL locks to the
target frequency, then transitions to a lower voltage by signaling the target
voltage on SVID bus.
— All active processor cores share the same frequency and voltage. In a multicore processor, the highest frequency P-state requested amongst all active
cores is selected.
— Software-requested transitions are accepted at any time. If a previous
transition is in progress, the new transition is deferred until the previous
transition is completed.
• The processor controls voltage ramp rates internally to ensure glitch-free
transitions.
• Because there is low transition latency between P-states, a significant number of
transitions per-second are possible.
4.2.2
Low-Power Idle States
When the processor is idle, low-power idle states (C-states) are used to save power.
More power savings actions are taken for numerically higher C-states. However, higher
C-states have longer exit and entry latencies. Resolution of C-states occur at the
thread, processor core, and processor package level. Thread-level C-states are
available if Intel HT Technology is enabled.
Caution:
46
Long term reliability cannot be assured unless all the Low Power Idle States are
enabled.
Datasheet, Volume 1
Power Management
Figure 4-2.
Idle Power Management Breakdown of the Processor Cores
Entry and exit of the C-States at the thread and core level are shown in Figure 4-3.
Figure 4-3.
Thread and Core C-State Entry and Exit
While individual threads can request low power C-states, power saving actions only
take place once the core C-state is resolved. Core C-states are automatically resolved
by the processor. For thread and core C-states, a transition to and from C0 is required
before entering any other C-state.
Table 4-8.
Coordination of Thread Power States at the Core Level
Processor Core
C-State
Thread 0
Thread 1
C0
C1
C3
C6
C0
C0
C0
C0
C0
C1
C0
C11
C11
C11
C3
C0
C11
C3
C3
C6
C0
C11
C3
C6
Note:
1.
If enabled, the core C-state will be C1E if all enabled cores have also resolved a core C1 state or higher.
Datasheet, Volume 1
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Power Management
4.2.3
Requesting Low-Power Idle States
The primary software interfaces for requesting low power idle states are through the
MWAIT instruction with sub-state hints and the HLT instruction (for C1 and C1E).
However, software may make C-state requests using the legacy method of I/O reads
from the ACPI-defined processor clock control registers, referred to as P_LVLx. This
method of requesting C-states provides legacy support for operating systems that
initiate C-state transitions using I/O reads.
For legacy operating systems, P_LVLx I/O reads are converted within the processor to
the equivalent MWAIT C-state request. Therefore, P_LVLx reads do not directly result in
I/O reads to the system. The feature, known as I/O MWAIT redirection, must be
enabled in the BIOS.
Note:
The P_LVLx I/O Monitor address needs to be set up before using the P_LVLx I/O read
interface. Each P-LVLx is mapped to the supported MWAIT(Cx) instruction as shown in
Table 4-9.
Table 4-9.
P_LVLx to MWAIT Conversion
P_LVLx
MWAIT(Cx)
P_LVL2
MWAIT(C3)
P_LVL3
MWAIT(C6)
Notes
C6. No sub-states allowed.
The BIOS can write to the C-state range field of the PMG_IO_CAPTURE MSR to restrict
the range of I/O addresses that are trapped and emulate MWAIT like functionality. Any
P_LVLx reads outside of this range does not cause an I/O redirection to MWAIT(Cx) like
request. They fall through like a normal I/O instruction.
Note:
When P_LVLx I/O instructions are used, MWAIT substates cannot be defined. The
MWAIT substate is always zero if I/O MWAIT redirection is used. By default, P_LVLx I/O
redirections enable the MWAIT 'break on EFLAGS.IF’ feature that triggers a wakeup on
an interrupt, even if interrupts are masked by EFLAGS.IF.
4.2.4
Core C-states
The following are general rules for all core C-states, unless specified otherwise:
• A core C-State is determined by the lowest numerical thread state (such as Thread
0 requests C1E while Thread 1 requests C3, resulting in a core C1E state). See
Table 4-7.
• A core transitions to C0 state when:
— An interrupt occurs
— There is an access to the monitored address if the state was entered using an
MWAIT instruction
• For core C1/C1E, core C3, and core C6, an interrupt directed toward a single thread
wakes only that thread. However, since both threads are no longer at the same
core C-state, the core resolves to C0.
• A system reset re-initializes all processor cores.
4.2.4.1
Core C0 State
The normal operating state of a core where code is being executed.
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4.2.4.2
Core C1/C1E State
C1/C1E is a low power state entered when all threads within a core execute a HLT or
MWAIT(C1/C1E) instruction.
A System Management Interrupt (SMI) handler returns execution to either Normal
state or the C1/C1E state. See the Intel® 64 and IA-32 Architecture Software
Developer’s Manual, Volume 3A/3B: System Programmer’s Guide for more information.
While a core is in C1/C1E state, it processes bus snoops and snoops from other
threads. For more information on C1E, see Section 4.2.5.2.
4.2.4.3
Core C3 State
Individual threads of a core can enter the C3 state by initiating a P_LVL2 I/O read to
the P_BLK or an MWAIT(C3) instruction. A core in C3 state flushes the contents of its
L1 instruction cache, L1 data cache, and L2 cache to the shared L3 cache, while
maintaining its architectural state. All core clocks are stopped at this point. Because the
core’s caches are flushed, the processor does not wake any core that is in the C3 state
when either a snoop is detected or when another core accesses cacheable memory.
4.2.4.4
Core C6 State
Individual threads of a core can enter the C6 state by initiating a P_LVL3 I/O read or an
MWAIT(C6) instruction. Before entering core C6, the core will save its architectural
state to a dedicated SRAM. Once complete, a core will have its voltage reduced to zero
volts. During exit, the core is powered on and its architectural state is restored.
4.2.4.5
C-State Auto-Demotion
In general, deeper C-states such as C6 have long latencies and have higher energy
entry/exit costs. The resulting performance and energy penalties become significant
when the entry/exit frequency of a deeper C-state is high. Therefore, incorrect or
inefficient usage of deeper C-states have a negative impact on power. To increase
residency and improve power in deeper C-states, the processor supports C-state autodemotion.
There are two C-State auto-demotion options:
• C6 to C3
• C6/C3 To C1
The decision to demote a core from C6 to C3 or C3/C6 to C1 is based on each core’s
immediate residency history. Upon each core C6 request, the core C-state is demoted
to C3 or C1 until a sufficient amount of residency has been established. At that point, a
core is allowed to go into C3/C6. Each option can be run concurrently or individually.
This feature is disabled by default. BIOS must enable it in the
PMG_CST_CONFIG_CONTROL register. The auto-demotion policy is also configured by
this register.
Datasheet, Volume 1
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Power Management
4.2.5
Package C-States
The processor supports C0, C1/C1E, C3, and C6 power states. The following is a
summary of the general rules for package C-state entry. These apply to all package Cstates unless specified otherwise:
• A package C-state request is determined by the lowest numerical core C-state
amongst all cores.
• A package C-state is automatically resolved by the processor depending on the
core idle power states and the status of the platform components.
— Each core can be at a lower idle power state than the package if the platform
does not grant the processor permission to enter a requested package C-state.
— The platform may allow additional power savings to be realized in the
processor.
— For package C-states, the processor is not required to enter C0 before entering
any other C-state.
The processor exits a package C-state when a break event is detected. Depending on
the type of break event, the processor does the following:
• If a core break event is received, the target core is activated and the break event
message is forwarded to the target core.
— If the break event is not masked, the target core enters the core C0 state and
the processor enters package C0.
• If the break event was due to a memory access or snoop request.
— But the platform did not request to keep the processor in a higher package Cstate, the package returns to its previous C-state.
— And the platform requests a higher power C-state, the memory access or snoop
request is serviced and the package remains in the higher power C-state.
Table 4-10. Coordination of Core Power States at the Package Level
Core 1
Package C-State
C0
Core 0
C1
C3
C6
C0
C0
C0
C0
C0
C1
C0
C11
C11
C11
C3
C0
C11
C3
C3
C0
C11
C3
C6
C6
Note:
1.
If enabled, the package C-state will be C1E if all cores have resolved a core C1 state or higher.
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Figure 4-4.
Package C-State Entry and Exit
4.2.5.1
Package C0
This is the normal operating state for the processor. The processor remains in the
normal state when at least one of its cores is in the C0 or C1 state or when the platform
has not granted permission to the processor to go into a low power state. Individual
cores may be in lower power idle states while the package is in C0.
4.2.5.2
Package C1/C1E
No additional power reduction actions are taken in the package C1 state. However, if
the C1E sub-state is enabled, the processor automatically transitions to the lowest
supported core clock frequency, followed by a reduction in voltage.
The package enters the C1 low power state when:
• At least one core is in the C1 state.
• The other cores are in a C1 or lower power state.
The package enters the C1E state when:
• All cores have directly requested C1E using MWAIT(C1) with a C1E sub-state hint.
• All cores are in a power state lower that C1/C1E but the package low power state is
limited to C1/C1E using the PMG_CST_CONFIG_CONTROL MSR.
• All cores have requested C1 using HLT or MWAIT(C1) and C1E auto-promotion is
enabled in IA32_MISC_ENABLES.
No notification to the system occurs upon entry to C1/C1E.
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Power Management
4.2.5.3
Package C3 State
A processor enters the package C3 low power state when:
• At least one core is in the C3 state.
• The other cores are in a C3 or lower power state, and the processor has been
granted permission by the platform.
• The platform has not granted a request to a package C6 state but has allowed a
package C6 state.
In package C3-state, the L3 shared cache is valid.
4.2.5.4
Package C6 State
A processor enters the package C6 low power state when:
• At least one core is in the C6 state.
• The other cores are in a C6 or lower power state, and the processor has been
granted permission by the platform.
In package C6 state, all cores have saved their architectural state and have had their
core voltages reduced to zero volts. The L3 shared cache is still powered and snoopable
in this state. The processor remains in package C6 state as long as any part of the L3
cache is active.
4.3
Integrated Memory Controller (IMC) Power
Management
The main memory is power managed during normal operation and in low-power ACPI
Cx states.
4.3.1
Disabling Unused System Memory Outputs
Any system memory (SM) interface signal that goes to a memory module connector in
which it is not connected to any actual memory devices (such as DIMM connector is
unpopulated, or is single-sided) is tri-stated. The benefits of disabling unused SM
signals are:
• Reduced power consumption.
• Reduced possible overshoot/undershoot signal quality issues seen by the processor
I/O buffer receivers caused by reflections from potentially un-terminated
transmission lines.
When a given rank is not populated, the corresponding chip select and CKE signals are
not driven.
At reset, all rows must be assumed to be populated, until it can be proven that they are
not populated. This is due to the fact that when CKE is tristated with an DIMM present,
the DIMM is not ensured to maintain data integrity.
SCKE tri-state should be enabled by BIOS where appropriate, since at reset all rows
must be assumed to be populated.
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4.3.2
DRAM Power Management and Initialization
The processor implements extensive support for power management on the SDRAM
interface. There are four SDRAM operations associated with the Clock Enable (CKE)
signals that the SDRAM controller supports. The processor drives four CKE pins to
perform these operations.
The CKE is one of the power-save means. When CKE is off the internal DDR clock is
disabled and the DDR power is reduced. The power-saving differs according the
selected mode and the DDR type used. For more information, please refer to the IDD
table in the DDR specification.
The DDR specification defines 3 levels of power-down that differ in power-saving and in
wakeup time:
1. Active power-down (APD): This mode is entered if there are open pages when
de-asserting CKE. In this mode the open pages are retained. Power-saving in this
mode is the lowest. Power consumption of DDR is defined by IDD3P. Exiting this
mode is fined by tXP – small number of cycles.
2. Precharged power-down (PPD): This mode is entered if all banks in DDR are
precharged when de-asserting CKE. Power-saving in this mode is intermediate –
better than APD, but less than DLL-off. Power consumption is defined by IDD2P1.
Exiting this mode is defined by tXP. Difference from APD mode is that when wakingup all page-buffers are empty
3. DLL-off: In this mode the data-in DLLs on DDR are off. Power-saving in this mode
is the best among all power-modes. Power consumption is defined by IDD2P1.
Exiting this mode is defined by tXP, but also tXPDLL (10 – 20 according to DDR
type) cycles until first data transfer is allowed.
The processor supports 5 different types of power-down. The different modes are the
power-down modes supported by DDR3 and combinations of these. The type of CKE
power-down is defined by the configuration. The are options are:
1. No power-down
2. APD: The rank enters power-down as soon as idle-timer expires, no matter what is
the bank status
3. PPD: When idle timer expires the MC sends PRE-all to rank and then enters powerdown
4. DLL-off: same as option (2) but DDR is configured to DLL-off
5. APD, change to PPD (APD-PPD): Begins as option (1), and when all page-close
timers of the rank are expired, it wakes the rank, issues PRE-all, and returns to PPD
APD, change to DLL-off (APD_DLLoff) – Begins as option (1), and when all pageclose timers of the rank are expired, it wakes the rank, issues PRE-all and returns
to DLL-off power-down
The CKE is determined per rank when it is inactive. Each rank has an idle-counter. The
idle-counter starts counting as soon as the rank has no accesses, and if it expires, the
rank may enter power-down while no new transactions to the rank arrive to queues.
The idle-counter begins counting at the last incoming transaction arrival.
It is important to understand that since the power-down decision is per rank, the MC
can find many opportunities to power-down ranks even while running memory
intensive applications, and savings are significant (may be a few watts, according to
the DDR specification). This is significant when each channel is populated with more
ranks.
Datasheet, Volume 1
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Power Management
Selection of power modes should be according to power-performance or thermal tradeoffs of a given system:
• When trying to achieve maximum performance and power or thermal consideration
is not an issue: use no power-down.
• In a system that tries to minimize power-consumption, try to use the deepest
power-down mode possible – DLL-off or APD_DLLoff.
• In high-performance systems with dense packaging (that is, complex thermal
design) the power-down mode should be considered in order to reduce the heating
and avoid DDR throttling caused by the heating.
Control of the power-mode through CRB-BIOS: The BIOS selects by default no-powerdown. There are knobs to change the power-down selected mode.
Another control is the idle timer expiration count. This is set through PM_PDWN_config
bits 7:0 (MCHBAR +4CB0). As this timer is set to a shorter time, the MC will have more
opportunities to put DDR in power-down. The minimum recommended value for this
register is 15. There is no BIOS hook to set this register. Customers who choose to
change the value of this register can do it by changing the BIOS. For experiments, this
register can be modified in real time if BIOS did not lock the MC registers.
Note:
In APD, APD-PPD, and APD-DLLoff there is no point in setting the idle-counter in the
same range of page-close idle timer.
Another option associated with CKE power-down is the S_DLL-off. When this option is
enabled, the SBR I/O slave DLLs go off when all channel ranks are in power-down. (Do
not confuse it with the DLL-off mode, in which the DDR DLLs are off). This mode
requires to define the I/O slave DLL wakeup time.
4.3.2.1
Initialization Role of CKE
During power-up, CKE is the only input to the SDRAM that has its level recognized
(other than the DDR3 reset pin) once power is applied. It must be driven LOW by the
DDR controller to make sure the SDRAM components float DQ and DQS during powerup. CKE signals remain LOW (while any reset is active) until the BIOS writes to a
configuration register. Using this method, CKE is ensured to remain inactive for much
longer than the specified 200 micro-seconds after power and clocks to SDRAM devices
are stable.
4.3.2.2
Conditional Self-Refresh
Intel Rapid Memory Power Management (Intel RMPM) conditionally places memory into
self-refresh in the package C3 and C6 low-power states. Intel RMPM functionality
depends on the graphics/display state (relevant only when processor graphics is being
used), as well as memory traffic patterns generated by other connected I/O devices.
The target behavior is to enter self-refresh as long as there are no memory requests to
service.
When entering the S3 – Suspend-to-RAM (STR) state or S0 conditional self-refresh, the
processor core flushes pending cycles and then enters all SDRAM ranks into selfrefresh. The CKE signals remain LOW so the SDRAM devices perform self-refresh.
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4.3.2.3
Dynamic Power-down Operation
Dynamic power-down of memory is employed during normal operation. Based on idle
conditions, a given memory rank may be powered down. The IMC implements
aggressive CKE control to dynamically put the DRAM devices in a power-down state.
The processor core controller can be configured to put the devices in active powerdown (CKE de-assertion with open pages) or precharge power-down (CKE de-assertion
with all pages closed). Precharge power-down provides greater power savings but has
a bigger performance impact, since all pages will first be closed before putting the
devices in power-down mode.
If dynamic power-down is enabled, all ranks are powered up before doing a refresh
cycle and all ranks are powered down at the end of refresh.
4.3.2.4
DRAM I/O Power Management
Unused signals should be disabled to save power and reduce electromagnetic
interference. This includes all signals associated with an unused memory channel.
Clocks can be controlled on a per SO-DIMM basis. Exceptions are made for per SODIMM control signals such as CS#, CKE, and ODT for unpopulated SO-DIMM slots.
The I/O buffer for an unused signal should be tri-stated (output driver disabled), the
input receiver (differential sense-amp) should be disabled, and any DLL circuitry
related ONLY to unused signals should be disabled. The input path must be gated to
prevent spurious results due to noise on the unused signals (typically handled
automatically when input receiver is disabled).
4.4
PCI Express* Power Management
• Active power management support using L0s, and L1 states.
• All inputs and outputs disabled in L2/L3 Ready state.
Note:
PEG interface does not support Hot Plug.
Note:
Power impact may be observed when PEG link disable power management state is
used.
4.5
Direct Media Interface (DMI) Power Management
• Active power management support using L0s/L1 state.
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Power Management
4.6
Graphics Power Management
4.6.1
Intel® Rapid Memory Power Management (Intel® RMPM)
(also known as CxSR)
The Intel Rapid Memory Power Management puts rows of memory into self refresh
mode during C3/C6 to allow the system to remain in the lower power states longer.
Desktop processors routinely save power during runtime conditions by entering the C3,
C6 state. Intel RMPM is an indirect method of power saving that can have a significant
effect on the system as a whole.
4.6.2
Intel® Graphics Performance Modulation Technology
(Intel® GPMT)
Intel Graphics Power Modulation Technology (Intel GPMT) is a method for saving power
in the graphics adapter while continuing to display and process data in the adapter. This
method will switch the render frequency and/or render voltage dynamically between
higher and lower power states supported on the platform based on render engine
workload.
In products where Intel® Graphics Dynamic Frequency (also known as Turbo Boost
Technology) is supported and enabled, the functionality of Intel GPMT will be
maintained by Intel® Graphics Dynamic Frequency (also known as Turbo Boost
Technology).
4.6.3
Graphics Render C-State
Render C-State (RC6) is a technique designed to optimize the average power to the
graphics render engine during times of idleness of the render engine. Render C-state is
entered when the graphics render engine, blitter engine and the video engine have no
workload being currently worked on and no outstanding graphics memory transactions.
When the idleness condition is met, the Integrated Graphics will program the VR into a
low voltage state (~0.4 V) through the SVID bus.
4.6.4
Intel® Smart 2D Display Technology (Intel® S2DDT)
Intel S2DDT reduces display refresh memory traffic by reducing memory reads
required for display refresh. Power consumption is reduced by less accesses to the IMC.
S2DDT is only enabled in single pipe mode.
Intel S2DDT is most effective with:
• Display images well suited to compression, such as text windows, slide shows, and
so on. Poor examples are 3D games.
• Static screens such as screens with significant portions of the background showing
2D applications, processor benchmarks, and so on, or conditions when the
processor is idle. Poor examples are full-screen 3D games and benchmarks that flip
the display image at or near display refresh rates.
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4.6.5
Intel® Graphics Dynamic Frequency
Intel® Graphics Dynamic Frequency Technology is the ability of the processor and
graphics cores to opportunistically increase frequency and/or voltage above the
ensured processor and graphics frequency for the given part. Intel® Graphics Dynamic
Frequency Technology is a performance feature that makes use of unused package
power and thermals to increase application performance. The increase in frequency is
determined by how much power and thermal budget is available in the package, and
the application demand for additional processor or graphics performance. The
processor core control is maintained by an embedded controller. The graphics driver
dynamically adjusts between P-States to maintain optimal performance, power, and
thermals. The graphics driver will always place the graphics engine in its lowest
possible P-State; thereby, acting in the same capacity as Intel GPMT.
4.7
Thermal Power Management
See Section 4.6 for all graphics thermal power management-related features.
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Thermal Management
5
Thermal Management
For thermal specifications and design guidelines, refer to the 2nd Generation Intel®
Core™ Processor Family Desktop, Intel® Pentium® Processor Family Desktop, and
Intel® Celeron® Processor Family Desktop, and LGA1155 Socket Thermal and
Mechanical Specifications and Design Guidelines.
§§
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Thermal Management
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Datasheet, Volume 1
Signal Description
6
Signal Description
This chapter describes the processor signals. They are arranged in functional groups
according to their associated interface or category. The following notations are used to
describe the signal type.
Notations
Signal Type
I
Input Pin
O
Output Pin
I/O
Bi-directional Input/Output Pin
The signal description also includes the type of buffer used for the particular signal (see
Table 6-1).
Table 6-1.
Signal Description Buffer Types
Signal
PCI Express*
DMI
CMOS
DDR3
A
Ref
Asynchronous1
Description
PCI Express interface signals. These signals are compatible with PCI Express* 2.0
Signalling Environment AC Specifications and are AC coupled. The buffers are not
3.3-V tolerant. Refer to the PCIe specification.
Direct Media Interface signals. These signals are based on PCI Express* 2.0 Signaling
Environment AC Specifications (5 GT/s), but are DC coupled. The buffers are not
3.3-V tolerant.
CMOS buffers. 1.1-V tolerant
DDR3 buffers: 1.5-V tolerant
Analog reference or output. May be used as a threshold voltage or for buffer
compensation
Voltage reference signal
Signal has no timing relationship with any reference clock.
Notes:
1.
Qualifier for a buffer type.
Datasheet, Volume 1
61
Signal Description
6.1
System Memory Interface Signals
Table 6-2.
Memory Channel A Signals
Signal Name
Bank Select: These signals define which banks are selected within
each SDRAM rank.
O
DDR3
SA_WE#
Write Enable Control Signal: This signal is used with SA_RAS# and
SA_CAS# (along with SA_CS#) to define the SDRAM Commands.
O
DDR3
SA_RAS#
RAS Control Signal: This signal is used with SA_CAS# and SA_WE#
(along with SA_CS#) to define the SRAM Commands.
O
DDR3
SA_CAS#
CAS Control Signal: This signal is used with SA_RAS# and SA_WE#
(along with SA_CS#) to define the SRAM Commands.
O
DDR3
SA_DQS[8:0]
SA_DQS#[8:0]
Data Strobes: SA_DQS[8:0] and its complement signal group make
up a differential strobe pair. The data is captured at the crossing point
of SA_DQS[8:0] and its SA_DQS#[8:0] during read and write
transactions.
I/O
DDR3
SA_BS[2:0]
Data Bus: Channel A data signal interface to the SDRAM data bus.
I/O
DDR3
SA_MA[15:0]
Memory Address: These signals are used to provide the multiplexed
row and column address to the SDRAM.
O
DDR3
SA_CK[3:0]
SDRAM Differential Clock: Channel A SDRAM Differential clock signal
pair. The crossing of the positive edge of SA_CK and the negative edge
of its complement SA_CK# are used to sample the command and
control signals on the SDRAM.
O
DDR3
SA_CK#[3:0]
SDRAM Inverted Differential Clock: Channel A SDRAM Differential
clock signal-pair complement.
O
DDR3
SA_CKE[3:0]
Clock Enable: (1 per rank). Used to:
• Initialize the SDRAMs during power-up
• Power-down SDRAM ranks
• Place all SDRAM ranks into and out of self-refresh during STR
O
DDR3
SA_CS#[3:0]
Chip Select: (1 per rank). Used to select particular SDRAM
components during the active state. There is one Chip Select for each
SDRAM rank.
O
DDR3
SA_DQ[63:0]
SA_ODT[3:0]
62
Direction/
Buffer Type
Description
On Die Termination: Active Termination Control.
O
DDR3
Datasheet, Volume 1
Signal Description
Table 6-3.
Memory Channel B Signals
Signal Name
Description
Direction/
Buffer Type
Bank Select: These signals define which banks are selected within
each SDRAM rank.
O
DDR3
SB_WE#
Write Enable Control Signal: This signal is used with SB_RAS# and
SB_CAS# (along with SB_CS#) to define the SDRAM Commands.
O
DDR3
SB_RAS#
RAS Control Signal: This signal is used with SB_CAS# and SB_WE#
(along with SB_CS#) to define the SRAM Commands.
O
DDR3
SB_CAS#
CAS Control Signal: This signal is used with SB_RAS# and SB_WE#
(along with SB_CS#) to define the SRAM Commands.
O
DDR3
SB_DQS[8:0]
SB_DQS#[8:0]
Data Strobes: SB_DQS[8:0] and its complement signal group make
up a differential strobe pair. The data is captured at the crossing point
of SB_DQS[8:0] and its SB_DQS#[8:0] during read and write
transactions.
I/O
DDR3
SB_BS[2:0]
Data Bus: Channel B data signal interface to the SDRAM data bus.
I/O
DDR3
SB_MA[15:0]
Memory Address: These signals are used to provide the multiplexed
row and column address to the SDRAM.
O
DDR3
SB_CK[3:0]
SDRAM Differential Clock: Channel B SDRAM Differential clock signal
pair. The crossing of the positive edge of SB_CK and the negative edge
of its complement SB_CK# are used to sample the command and
control signals on the SDRAM.
O
DDR3
SB_CK#[3:0]
SDRAM Inverted Differential Clock: Channel B SDRAM Differential
clock signal-pair complement.
O
DDR3
SB_CKE[3:0]
Clock Enable: (1 per rank). Used to:
• Initialize the SDRAMs during power-up.
• Power-down SDRAM ranks.
• Place all SDRAM ranks into and out of self-refresh during STR.
O
DDR3
SB_CS#[3:0]
Chip Select: (1 per rank). Used to select particular SDRAM
components during the active state. There is one Chip Select for each
SDRAM rank.
O
DDR3
SB_DQ[63:0]
SB_ODT[3:0]
On Die Termination: Active Termination Control.
O
DDR3
6.2
Memory Reference and Compensation Signals
Table 6-4.
Memory Reference and Compensation
Signal Name
SM_VREF
Datasheet, Volume 1
Description
DDR3 Reference Voltage: This provides reference voltage to the
DDR3 interface and is defined as VDDQ/2.
Direction/
Buffer Type
I
A
63
Signal Description
6.3
Reset and Miscellaneous Signals
Table 6-5.
Reset and Miscellaneous Signals
Signal Name
Direction/
Buffer Type
Description
Configuration Signals: The CFG signals have a default value of '1' if not
terminated on the board.
• CFG[1:0]: Reserved configuration lane. A test point may be placed on
the board for this lane.
• CFG[2]: PCI Express* Static x16 Lane Numbering Reversal
— 1 = Normal operation
— 0 = Lane numbers reversed
CFG[17:0]
• CFG[3]: Reserved
• CFG[4]: Reserved configuration lane. A test point may be placed on
the board for this lane.
• CFG[6:5]: PCI Express BifurcationNote1
—
—
—
—
•
FC_x
PM_SYNC
RESET#
RSVD
RSVD_NCTF
SM_DRAMRST#
00
01
10
11
=
=
=
=
I
CMOS
1 x8, 2 x4 PCI Express
Reserved
2 x8 PCI Express
1 x16 PCI Express
CFG[17:7]: Reserved configuration lanes. A test point may be placed
on the board for these lands.
FC signals are signals that are available for compatibility with other
processors. A test point may be placed on the board for these lands.
Power Management Sync: A sideband signal to communicate power
management status from the platform to the processor.
I
CMOS
Platform Reset pin driven by the PCH
I
CMOS
No Connect
Non-Critical
to Function
RESERVED: All signals that are RSVD and RSVD_NCTF must be left
unconnected on the board.
DDR3 DRAM Reset: Reset signal from processor to DRAM devices. One
common to all channels.
O
CMOS
Notes:
1.
PCIe bifurcation support varies with the processor and PCH SKUs used.
64
Datasheet, Volume 1
Signal Description
6.4
PCI Express*-Based Interface Signals
Table 6-6.
PCI Express* Graphics Interface Signals
Signal Name
PEG_ICOMPI
PEG_ICOMPO
PEG_RCOMPO
Direction/
Buffer Type
Description
PCI Express Input Current Compensation
I
A
PCI Express Current Compensation
I
A
PCI Express Resistance Compensation
I
A
PEG_RX[15:0]
PEG_RX#[15:0]
PE_RX[3:0]1
PE_RX#[3:0]1
PCI Express Receive Differential Pair
PEG_TX[15:0]
PEG_TX#[15:0]
PE_TX[3:0]1
PE_TX#[3:0]1
PCI Express Transmit Differential Pair
I
PCI Express
O
PCI Express
Notes:
1.
PE_TX[3:0] and PE_RX[3:0] are only used for platforms that support 20 PCIe lanes.
6.5
Intel® Flexible Display Interface (Intel® FDI)
Signals
Table 6-7.
Intel® Flexible Display Interface (Intel® FDI)
Signal Name
FDI0_FSYNC[0]
FDI0_LSYNC[0]
FDI_TX[7:0]
FDI_TX#[7:0]
FDI1_FSYNC[1]
FDI1_LSYNC[1]
FDI_INT
Datasheet, Volume 1
Description
Direction/
Buffer Type
Intel® Flexible Display Interface Frame Sync – Pipe A
I
CMOS
Intel® Flexible Display Interface Line Sync – Pipe A
I
CMOS
Intel® Flexible Display Interface Transmit Differential Pairs
O
FDI
Intel® Flexible Display Interface Frame Sync – Pipe B
I
CMOS
Intel® Flexible Display Interface Line Sync – Pipe B
I
CMOS
Intel® Flexible Display Interface Hot Plug Interrupt
I
Asynchronous
CMOS
65
Signal Description
6.6
Direct Media Interface (DMI) Signals
Table 6-8.
Direct Media Interface (DMI) Signals – Processor to PCH Serial Interface
Signal Name
DMI_RX[3:0]
DMI_RX#[3:0]
DMI Input from PCH: Direct Media Interface receive differential pair.
I
DMI
DMI_TX[3:0]
DMI_TX#[3:0]
DMI Output to PCH: Direct Media Interface transmit differential pair.
O
DMI
6.7
Phase Lock Loop (PLL) Signals
Table 6-9.
Phase Lock Loop (PLL) Signals
Signal Name
BCLK
BCLK#
6.8
Direction/
Buffer Type
Description
Direction/
Buffer Type
Description
Differential bus clock input to the processor
I
Diff Clk
Test Access Points (TAP) Signals
Table 6-10. Test Access Points (TAP) Signals
Signal Name
Description
Direction/
Buffer Type
BPM#[7:0]
Breakpoint and Performance Monitor Signals: These signals are
outputs from the processor that indicate the status of breakpoints
and programmable counters used for monitoring processor
performance.
I/O
CMOS
BCLK_ITP
BCLK_ITP#
These pins are connected in parallel to the top side debug probe to
enable debug capacities.
I
DBR#
DBR# is used only in systems where no debug port is implemented
on the system board. DBR# is used by a debug port interposer so
that an in-target probe can drive system reset.
O
PRDY#
PRDY# is a processor output used by debug tools to determine
processor debug readiness.
O
Asynchronous
CMOS
PREQ#
PREQ# is used by debug tools to request debug operation of the
processor.
I
Asynchronous
CMOS
TCK
TCK (Test Clock): This signal provides the clock input for the
processor Test Bus (also known as the Test Access Port). TCK must be
driven low or allowed to float during power on Reset.
I
CMOS
TDI
TDI (Test Data In): This signal transfers serial test data into the
processor. TDI provides the serial input needed for JTAG specification
support.
I
CMOS
TDO
TDO (Test Data Out): This signal transfers serial test data out of the
processor. TDO provides the serial output needed for JTAG
specification support.
O
Open Drain
TMS
TMS (Test Mode Select): A JTAG specification support signal used by
debug tools.
I
CMOS
TRST# (Test Reset): This signal resets the Test Access Port (TAP)
logic. TRST# must be driven low during power on Reset.
I
CMOS
TRST#
66
Datasheet, Volume 1
Signal Description
6.9
Error and Thermal Protection Signals
Table 6-11. Error and Thermal Protection Signals
6.10
Signal Name
Description
Direction/
Buffer Type
CATERR#
Catastrophic Error: This signal indicates that the system has
experienced a catastrophic error and cannot continue to operate. The
processor will set this for non-recoverable machine check errors or
other unrecoverable internal errors.
On the processor, CATERR# is used for signaling the following types of
errors:
• Legacy MCERRs – CATERR# is asserted for 16 BCLKs.
• Legacy IERRs – CATERR# remains asserted until warm or cold
reset.
O
CMOS
PECI
PECI (Platform Environment Control Interface): A serial sideband
interface to the processor, it is used primarily for thermal, power, and
error management.
I/O
Asynchronous
PROCHOT#
Processor Hot: PROCHOT# goes active when the processor
temperature monitoring sensor(s) detects that the processor has
reached its maximum safe operating temperature. This indicates that
the processor Thermal Control Circuit (TCC) has been activated, if
enabled. This signal can also be driven to the processor to activate the
TCC.
CMOS Input/
Open-Drain
Output
THERMTRIP#
Thermal Trip: The processor protects itself from catastrophic
overheating by use of an internal thermal sensor. This sensor is set
well above the normal operating temperature to ensure that there are
no false trips. The processor will stop all execution when the junction
temperature exceeds approximately 130 °C. This is signaled to the
system by the THERMTRIP# pin.
O
Asynchronous
CMOS
Power Sequencing Signals
Table 6-12. Power Sequencing Signals
Signal Name
SM_DRAMPWROK
UNCOREPWRGOOD
SKTOCC#
Datasheet, Volume 1
Description
SM_DRAMPWROK Processor Input: Connects to PCH
DRAMPWROK.
The processor requires this input signal to be a clean indication that
the VCCSA, VCCIO, VAXG, and VDDQ, power supplies are stable and
within specifications. This requirement applies, regardless of the Sstate of the processor. 'Clean' implies that the signal will remain low
(capable of sinking leakage current), without glitches, from the time
that the power supplies are turned on until they come within
specification. The signal must then transition monotonically to a high
state. This is connected to the PCH PROCPWRGD signal.
Direction/
Buffer Type
I
Asynchronous
CMOS
I
Asynchronous
CMOS
SKTOCC# (Socket Occupied): Pulled down directly (0 Ohms) on
the processor package to ground. There is no connection to the
processor silicon for this signal. System board designers may use this
signal to determine if the processor is present.
67
Signal Description
6.11
Processor Power Signals
Table 6-13. Processor Power Signals
Signal Name
VCC
Processor core power rail
Ref
VCCIO
Processor power for I/O
Ref
VDDQ
Processor I/O supply voltage for DDR3
Ref
VCCAXG
Graphics core power supply.
Ref
VCCPLL
VCCPLL provides isolated power for internal processor PLLs
Ref
System Agent power supply
Ref
VCCSA
6.12
Direction/
Buffer Type
Description
VIDSOUT
VIDSCLK
VIDALERT#
VIDALERT#, VIDSCLK, and VIDSCLK comprise a three signal serial
synchronous interface used to transfer power management information
between the processor and the voltage regulator controllers. This serial
VID interface replaces the parallel VID interface on previous
processors.
VCCSA_VID
Voltage selection for VCCSA
I/O
O
I
CMOS
O
Sense Signals
Table 6-14. Sense Signals
6.13
Signal Name
Description
Direction/
Buffer Type
VCC_SENSE
VSS_SENSE
VCC_SENSE and VSS_SENSE provide an isolated, low impedance
connection to the processor core voltage and ground. They can be
used to sense or measure voltage near the silicon.
O
Analog
VAXG_SENSE
VSSAXG_SENSE
VAXG_SENSE and VSSAXG_SENSE provide an isolated, low
impedance connection to the VAXG voltage and ground. They can
be used to sense or measure voltage near the silicon.
O
Analog
VCCIO_SENSE
VSS_SENSE_VCCIO
VCCIO_SENSE and VSS_SENSE_VCCIO provide an isolated, low
impedance connection to the processor VCCIO voltage and ground.
They can be used to sense or measure voltage near the silicon.
O
Analog
VDDQ_SENSE
VSSD_SENSE
VDDQ_SENSE and VSSD_SENSE provides an isolated, low
impedance connection to the VDDQ voltage and ground. They can
be used to sense or measure voltage near the silicon.
O
Analog
VCCSA_SENSE
VCCSA_SENSE provide an isolated, low impedance connection to
the processor system agent voltage. It can be used to sense or
measure voltage near the silicon.
O
Analog
Ground and Non-Critical to Function (NCTF)
Signals
Table 6-15. Ground and Non-Critical to Function (NCTF) Signals
Signal Name
VSS
VSS_NCTF
68
Description
Processor ground node
Direction/
Buffer Type
GND
Non-Critical to Function: These pins are for package mechanical
reliability.
Datasheet, Volume 1
Signal Description
6.14
Processor Internal Pull-Up / Pull-Down Resistors
Table 6-16. Processor Internal Pull-Up / Pull-Down Resistors
Signal Name
Pull-Up / Pull-Down
Rail
Value
BPM[7:0]
Pull Up
VCCIO
65–165 
PRDY#
Pull Up
VCCIO
65–165 
PREQ#
Pull Up
VCCIO
65–165 
TCK
Pull Down
VSS
5–15 k
TDI
Pull Up
VCCIO
5–15 k
TMS
Pull Up
VCCIO
5–15 k
TRST#
Pull Up
VCCIO
5–15 k
CFG[17:0]
Pull Up
VCCIO
5–15 k
§§
Datasheet, Volume 1
69
Signal Description
70
Datasheet, Volume 1
Electrical Specifications
7
Electrical Specifications
7.1
Power and Ground Lands
The processor has VCC, VDDQ, VCCPLL, VCCSA, VCCAXG, VCCIO and VSS (ground)
inputs for on-chip power distribution. All power lands must be connected to their
respective processor power planes, while all VSS lands must be connected to the
system ground plane. Use of multiple power and ground planes is recommended to
reduce I*R drop. The VCC and VCCAXG lands must be supplied with the voltage
determined by the processor Serial Voltage IDentification (SVID) interface. A new
serial VID interface is implemented on the processor. Table 7-1 specifies the voltage
level for the various VIDs.
7.2
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is
capable of generating large current swings between low- and full-power states. This
may cause voltages on power planes to sag below their minimum values, if bulk
decoupling is not adequate. Larger bulk storage (CBULK), such as electrolytic capacitors,
supply current during longer lasting changes in current demand (for example, coming
out of an idle condition). Similarly, capacitors act as a storage well for current when
entering an idle condition from a running condition. To keep voltages within
specification, output decoupling must be properly designed.
Caution:
Design the board to ensure that the voltage provided to the processor remains within
the specifications listed in Table 7-5. Failure to do so can result in timing violations or
reduced lifetime of the processor.
7.2.1
Voltage Rail Decoupling
The voltage regulator solution needs to provide:
• bulk capacitance with low effective series resistance (ESR).
• a low interconnect resistance from the regulator to the socket.
• bulk decoupling to compensate for large current swings generated during poweron,
or low-power idle state entry/exit.
The power delivery solution must ensure that the voltage and current specifications are
met, as defined in Table 7-5.
Datasheet, Volume 1
71
Electrical Specifications
7.3
Processor Clocking (BCLK[0], BCLK#[0])
The processor uses a differential clock to generate the processor core operating
frequency, memory controller frequency, system agent frequencies, and other internal
clocks. The processor core frequency is determined by multiplying the processor core
ratio by the BCLK frequency. Clock multiplying within the processor is provided by an
internal phase locked loop (PLL) that requires a constant frequency input, with
exceptions for Spread Spectrum Clocking (SSC).
The processor’s maximum non-turbo core frequency is configured during power-on
reset by using its manufacturing default value. This value is the highest non-turbo core
multiplier at which the processor can operate. If lower maximum speeds are desired,
the appropriate ratio can be configured using the FLEX_RATIO MSR.
7.3.1
Phase Lock Loop (PLL) Power Supply
An on-die PLL filter solution is implemented on the processor. Refer to Table 7-6 for DC
specifications.
7.4
VCC Voltage Identification (VID)
The processor uses three signals for the serial voltage identification interface to support
automatic selection of voltages. Table 7-1 specifies the voltage level corresponding to
the eight bit VID value transmitted over serial VID. A ‘1’ in this table refers to a high
voltage level and a ‘0’ refers to a low voltage level. If the voltage regulation circuit
cannot supply the voltage that is requested, the voltage regulator must disable itself.
VID signals are CMOS push/pull drivers. Refer to Table 7-9 for the DC specifications for
these signals. The VID codes will change due to temperature and/or current load
changes in order to minimize the power of the part. A voltage range is provided in
Table 7-5. The specifications are set so that one voltage regulator can operate with all
supported frequencies.
Individual processor VID values may be set during manufacturing so that two devices
at the same core frequency may have different default VID settings. This is shown in
the VID range values in Table 7-5. The processor provides the ability to operate while
transitioning to an adjacent VID and its associated voltage. This will represent a DC
shift in the loadline.
See the VR12/IMVP7 SVID Protocol for further details.
72
Datasheet, Volume 1
Electrical Specifications
Table 7-1.
VR 12.0 Voltage Identification Definition (Sheet 1 of 3)
VID VID VID VID
7
6
5
4
VID VID VID
3
2
1
VID
0
HEX
VCC_MAX
VID VID VID VID VID VID VID VID
7
6
5
4
3
2
1
0
HEX
VCC_MAX
0
0
0
0
0
0
0
0
0
0
0.00000
1
0
0
0
0
0
0
0
8
0
0.88500
0
0
0
0
0
0
0
1
0
1
0.25000
1
0
0
0
0
0
0
1
8
1
0.89000
0
0
0
0
0
0
1
0
0
2
0.25500
1
0
0
0
0
0
1
0
8
2
0.89500
0
0
0
0
0
0
1
1
0
3
0.26000
1
0
0
0
0
0
1
1
8
3
0.90000
0
0
0
0
0
1
0
0
0
4
0.26500
1
0
0
0
0
1
0
0
8
4
0.90500
0
0
0
0
0
1
0
1
0
5
0.27000
1
0
0
0
0
1
0
1
8
5
0.91000
0
0
0
0
0
1
1
0
0
6
0.27500
1
0
0
0
0
1
1
0
8
6
0.91500
0
0
0
0
0
1
1
1
0
7
0.28000
1
0
0
0
0
1
1
1
8
7
0.92000
0
0
0
0
1
0
0
0
0
8
0.28500
1
0
0
0
1
0
0
0
8
8
0.92500
0
0
0
0
1
0
0
1
0
9
0.29000
1
0
0
0
1
0
0
1
8
9
0.93000
0
0
0
0
1
0
1
0
0
A
0.29500
1
0
0
0
1
0
1
0
8
A
0.93500
0
0
0
0
1
0
1
1
0
B
0.30000
1
0
0
0
1
0
1
1
8
B
0.94000
0
0
0
0
1
1
0
0
0
C
0.30500
1
0
0
0
1
1
0
0
8
C
0.94500
0
0
0
0
1
1
0
1
0
D
0.31000
1
0
0
0
1
1
0
1
8
D
0.95000
0
0
0
0
1
1
1
0
0
E
0.31500
1
0
0
0
1
1
1
0
8
E
0.95500
0
0
0
0
1
1
1
1
0
F
0.32000
1
0
0
0
1
1
1
1
8
F
0.96000
0
0
0
1
0
0
0
0
1
0
0.32500
1
0
0
1
0
0
0
0
9
0
0.96500
0
0
0
1
0
0
0
1
1
1
0.33000
1
0
0
1
0
0
0
1
9
1
0.97000
0
0
0
1
0
0
1
0
1
2
0.33500
1
0
0
1
0
0
1
0
9
2
0.97500
0
0
0
1
0
0
1
1
1
3
0.34000
1
0
0
1
0
0
1
1
9
3
0.98000
0
0
0
1
0
1
0
0
1
4
0.34500
1
0
0
1
0
1
0
0
9
4
0.98500
0
0
0
1
0
1
0
1
1
5
0.35000
1
0
0
1
0
1
0
1
9
5
0.99000
0
0
0
1
0
1
1
0
1
6
0.35500
1
0
0
1
0
1
1
0
9
6
0.99500
0
0
0
1
0
1
1
1
1
7
0.36000
1
0
0
1
0
1
1
1
9
7
1.00000
0
0
0
1
1
0
0
0
1
8
0.36500
1
0
0
1
1
0
0
0
9
8
1.00500
0
0
0
1
1
0
0
1
1
9
0.37000
1
0
0
1
1
0
0
1
9
9
1.01000
0
0
0
1
1
0
1
0
1
A
0.37500
1
0
0
1
1
0
1
0
9
A
1.01500
0
0
0
1
1
0
1
1
1
B
0.38000
1
0
0
1
1
0
1
1
9
B
1.02000
0
0
0
1
1
1
0
0
1
C
0.38500
1
0
0
1
1
1
0
0
9
C
1.02500
0
0
0
1
1
1
0
1
1
D
0.39000
1
0
0
1
1
1
0
1
9
D
1.03000
0
0
0
1
1
1
1
0
1
E
0.39500
1
0
0
1
1
1
1
0
9
E
1.03500
0
0
0
1
1
1
1
1
1
F
0.40000
1
0
0
1
1
1
1
1
9
F
1.04000
0
0
1
0
0
0
0
0
2
0
0.40500
1
0
1
0
0
0
0
0
A
0
1.04500
0
0
1
0
0
0
0
1
2
1
0.41000
1
0
1
0
0
0
0
1
A
1
1.05000
0
0
1
0
0
0
1
0
2
2
0.41500
1
0
1
0
0
0
1
0
A
2
1.05500
0
0
1
0
0
0
1
1
2
3
0.42000
1
0
1
0
0
0
1
1
A
3
1.06000
0
0
1
0
0
1
0
0
2
4
0.42500
1
0
1
0
0
1
0
0
A
4
1.06500
0
0
1
0
0
1
0
1
2
5
0.43000
1
0
1
0
0
1
0
1
A
5
1.07000
0
0
1
0
0
1
1
0
2
6
0.43500
1
0
1
0
0
1
1
0
A
6
1.07500
0
0
1
0
0
1
1
1
2
7
0.44000
1
0
1
0
0
1
1
1
A
7
1.08000
0
0
1
0
1
0
0
0
2
8
0.44500
1
0
1
0
1
0
0
0
A
8
1.08500
0
0
1
0
1
0
0
1
2
9
0.45000
1
0
1
0
1
0
0
1
A
9
1.09000
0
0
1
0
1
0
1
0
2
A
0.45500
1
0
1
0
1
0
1
0
A
A
1.09500
Datasheet, Volume 1
73
Electrical Specifications
Table 7-1.
VR 12.0 Voltage Identification Definition (Sheet 2 of 3)
VID VID VID VID
7
6
5
4
VID VID VID
3
2
1
VID
0
VID VID VID VID VID VID VID VID
7
6
5
4
3
2
1
0
HEX
VCC_MAX
B
0.46000
1
0
1
0
1
0
1
HEX
VCC_MAX
1
A
B
1.10000
0
0
1
0
1
0
1
1
2
0
0
1
0
1
1
0
0
2
C
0.46500
1
0
1
0
1
1
0
0
A
C
1.10500
0
0
1
0
1
1
0
1
2
D
0.47000
1
0
1
0
1
1
0
1
A
D
1.11000
0
0
1
0
1
1
1
0
2
E
0.47500
1
0
1
0
1
1
1
0
A
E
1.11500
0
0
1
0
1
1
1
1
2
F
0.48000
1
0
1
0
1
1
1
1
A
F
1.12000
0
0
1
1
0
0
0
0
3
0
0.48500
1
0
1
1
0
0
0
0
B
0
1.12500
0
0
1
1
0
0
0
1
3
1
0.49000
1
0
1
1
0
0
0
1
B
1
1.13000
0
0
1
1
0
0
1
0
3
2
0.49500
1
0
1
1
0
0
1
0
B
2
1.13500
0
0
1
1
0
0
1
1
3
3
0.50000
1
0
1
1
0
0
1
1
B
3
1.14000
0
0
1
1
0
1
0
0
3
4
0.50500
1
0
1
1
0
1
0
0
B
4
1.14500
0
0
1
1
0
1
0
1
3
5
0.51000
1
0
1
1
0
1
0
1
B
5
1.15000
0
0
1
1
0
1
1
0
3
6
0.51500
1
0
1
1
0
1
1
0
B
6
1.15500
0
0
1
1
0
1
1
1
3
7
0.52000
1
0
1
1
0
1
1
1
B
7
1.16000
0
0
1
1
1
0
0
0
3
8
0.52500
1
0
1
1
1
0
0
0
B
8
1.16500
0
0
1
1
1
0
0
1
3
9
0.53000
1
0
1
1
1
0
0
1
B
9
1.17000
0
0
1
1
1
0
1
0
3
A
0.53500
1
0
1
1
1
0
1
0
B
A
1.17500
0
0
1
1
1
0
1
1
3
B
0.54000
1
0
1
1
1
0
1
1
B
B
1.18000
0
0
1
1
1
1
0
0
3
C
0.54500
1
0
1
1
1
1
0
0
B
C
1.18500
0
0
1
1
1
1
0
1
3
D
0.55000
1
0
1
1
1
1
0
1
B
D
1.19000
0
0
1
1
1
1
1
0
3
E
0.55500
1
0
1
1
1
1
1
0
B
E
1.19500
0
0
1
1
1
1
1
1
3
F
0.56000
1
0
1
1
1
1
1
1
B
F
1.20000
0
1
0
0
0
0
0
0
4
0
0.56500
1
1
0
0
0
0
0
0
C
0
1.20500
0
1
0
0
0
0
0
1
4
1
0.57000
1
1
0
0
0
0
0
1
C
1
1.21000
0
1
0
0
0
0
1
0
4
2
0.57500
1
1
0
0
0
0
1
0
C
2
1.21500
0
1
0
0
0
0
1
1
4
3
0.58000
1
1
0
0
0
0
1
1
C
3
1.22000
0
1
0
0
0
1
0
0
4
4
0.58500
1
1
0
0
0
1
0
0
C
4
1.22500
0
1
0
0
0
1
0
1
4
5
0.59000
1
1
0
0
0
1
0
1
C
5
1.23000
0
1
0
0
0
1
1
0
4
6
0.59500
1
1
0
0
0
1
1
0
C
6
1.23500
0
1
0
0
0
1
1
1
4
7
0.60000
1
1
0
0
0
1
1
1
C
7
1.24000
0
1
0
0
1
0
0
0
4
8
0.60500
1
1
0
0
1
0
0
0
C
8
1.24500
0
1
0
0
1
0
0
1
4
9
0.61000
1
1
0
0
1
0
0
1
C
9
1.25000
0
1
0
0
1
0
1
0
4
A
0.61500
1
1
0
0
1
0
1
0
C
A
1.25500
0
1
0
0
1
0
1
1
4
B
0.62000
1
1
0
0
1
0
1
1
C
B
1.26000
0
1
0
0
1
1
0
0
4
C
0.62500
1
1
0
0
1
1
0
0
C
C
1.26500
0
1
0
0
1
1
0
1
4
D
0.63000
1
1
0
0
1
1
0
1
C
D
1.27000
0
1
0
0
1
1
1
0
4
E
0.63500
1
1
0
0
1
1
1
0
C
E
1.27500
0
1
0
0
1
1
1
1
4
F
0.64000
1
1
0
0
1
1
1
1
C
F
1.28000
0
1
0
1
0
0
0
0
5
0
0.64500
1
1
0
1
0
0
0
0
D
0
1.28500
0
1
0
1
0
0
0
1
5
1
0.65000
1
1
0
1
0
0
0
1
D
1
1.29000
0
1
0
1
0
0
1
0
5
2
0.65500
1
1
0
1
0
0
1
0
D
2
1.29500
0
1
0
1
0
0
1
1
5
3
0.66000
1
1
0
1
0
0
1
1
D
3
1.30000
0
1
0
1
0
1
0
0
5
4
0.66500
1
1
0
1
0
1
0
0
D
4
1.30500
0
1
0
1
0
1
0
1
5
5
0.67000
1
1
0
1
0
1
0
1
D
5
1.31000
74
Datasheet, Volume 1
Electrical Specifications
Table 7-1.
VR 12.0 Voltage Identification Definition (Sheet 3 of 3)
VID VID VID VID
7
6
5
4
VID VID VID
3
2
1
VID
0
HEX
VCC_MAX
VID VID VID VID VID VID VID VID
7
6
5
4
3
2
1
0
HEX
VCC_MAX
0
1
0
1
0
1
1
0
5
6
0.67500
1
1
0
1
0
1
1
0
D
6
1.31500
0
1
0
1
0
1
1
1
5
7
0.68000
1
1
0
1
0
1
1
1
D
7
1.32000
0
1
0
1
1
0
0
0
5
8
0.68500
1
1
0
1
1
0
0
0
D
8
1.32500
0
1
0
1
1
0
0
1
5
9
0.69000
1
1
0
1
1
0
0
1
D
9
1.33000
0
1
0
1
1
0
1
0
5
A
0.69500
1
1
0
1
1
0
1
0
D
A
1.33500
0
1
0
1
1
0
1
1
5
B
0.70000
1
1
0
1
1
0
1
1
D
B
1.34000
0
1
0
1
1
1
0
0
5
C
0.70500
1
1
0
1
1
1
0
0
D
C
1.34500
0
1
0
1
1
1
0
1
5
D
0.71000
1
1
0
1
1
1
0
1
D
D
1.35000
0
1
0
1
1
1
1
0
5
E
0.71500
1
1
0
1
1
1
1
0
D
E
1.35500
0
1
0
1
1
1
1
1
5
F
0.72000
1
1
0
1
1
1
1
1
D
F
1.36000
0
1
1
0
0
0
0
0
6
0
0.72500
1
1
1
0
0
0
0
0
E
0
1.36500
0
1
1
0
0
0
0
1
6
1
0.73000
1
1
1
0
0
0
0
1
E
1
1.37000
0
1
1
0
0
0
1
0
6
2
0.73500
1
1
1
0
0
0
1
0
E
2
1.37500
0
1
1
0
0
0
1
1
6
3
0.74000
1
1
1
0
0
0
1
1
E
3
1.38000
0
1
1
0
0
1
0
0
6
4
0.74500
1
1
1
0
0
1
0
0
E
4
1.38500
0
1
1
0
0
1
0
1
6
5
0.75000
1
1
1
0
0
1
0
1
E
5
1.39000
0
1
1
0
0
1
1
0
6
6
0.75500
1
1
1
0
0
1
1
0
E
6
1.39500
0
1
1
0
0
1
1
1
6
7
0.76000
1
1
1
0
0
1
1
1
E
7
1.40000
0
1
1
0
1
0
0
0
6
8
0.76500
1
1
1
0
1
0
0
0
E
8
1.40500
0
1
1
0
1
0
0
1
6
9
0.77000
1
1
1
0
1
0
0
1
E
9
1.41000
0
1
1
0
1
0
1
0
6
A
0.77500
1
1
1
0
1
0
1
0
E
A
1.41500
0
1
1
0
1
0
1
1
6
B
0.78000
1
1
1
0
1
0
1
1
E
B
1.42000
0
1
1
0
1
1
0
0
6
C
0.78500
1
1
1
0
1
1
0
0
E
C
1.42500
0
1
1
0
1
1
0
1
6
D
0.79000
1
1
1
0
1
1
0
1
E
D
1.43000
0
1
1
0
1
1
1
0
6
E
0.79500
1
1
1
0
1
1
1
0
E
E
1.43500
0
1
1
0
1
1
1
1
6
F
0.80000
1
1
1
0
1
1
1
1
E
F
1.44000
0
1
1
1
0
0
0
0
7
0
0.80500
1
1
1
1
0
0
0
0
F
0
1.44500
0
1
1
1
0
0
0
1
7
1
0.81000
1
1
1
1
0
0
0
1
F
1
1.45000
0
1
1
1
0
0
1
0
7
2
0.81500
1
1
1
1
0
0
1
0
F
2
1.45500
0
1
1
1
0
0
1
1
7
3
0.82000
1
1
1
1
0
0
1
1
F
3
1.46000
0
1
1
1
0
1
0
0
7
4
0.82500
1
1
1
1
0
1
0
0
F
4
1.46500
0
1
1
1
0
1
0
1
7
5
0.83000
1
1
1
1
0
1
0
1
F
5
1.47000
0
1
1
1
0
1
1
0
7
6
0.83500
1
1
1
1
0
1
1
0
F
6
1.47500
0
1
1
1
0
1
1
1
7
7
0.84000
1
1
1
1
0
1
1
1
F
7
1.48000
0
1
1
1
1
0
0
0
7
8
0.84500
1
1
1
1
1
0
0
0
F
8
1.48500
0
1
1
1
1
0
0
1
7
9
0.85000
1
1
1
1
1
0
0
1
F
9
1.49000
0
1
1
1
1
0
1
0
7
A
0.85500
1
1
1
1
1
0
1
0
F
A
1.49500
0
1
1
1
1
0
1
1
7
B
0.86000
1
1
1
1
1
0
1
1
F
B
1.50000
0
1
1
1
1
1
0
0
7
C
0.86500
1
1
1
1
1
1
0
0
F
C
1.50500
0
1
1
1
1
1
0
1
7
D
0.87000
1
1
1
1
1
1
0
1
F
D
1.51000
0
1
1
1
1
1
1
0
7
E
0.87500
1
1
1
1
1
1
1
0
F
E
1.51500
0
1
1
1
1
1
1
1
7
F
0.88000
1
1
1
1
1
1
1
1
F
F
1.52000
Datasheet, Volume 1
75
Electrical Specifications
7.5
System Agent (SA) VCC VID
The VCCSA is configured by the processor output pin VCCSA_VID.
VCCSA_VID output default logic state is low for the processors; logic high is reserved
for future compatibility.
Table 7-2 specifies the different VCCSA_VID configurations.
Table 7-2.
VCCSA_VID configuration
Processor Family
VCCSA_VID
Selected VCCSA
2nd Generation
Core™ processor family desktop,
Intel® Pentium® processor family desktop,
Intel® Celeron® processor family desktop
0
0.925 V
Future Intel processors
1
Note 1
Intel®
Notes:
1.
Some of VCCSA configurations are reserved for future Intel processor families.
7.6
Reserved or Unused Signals
The following are the general types of reserved (RSVD) signals and connection
guidelines:
• RSVD – These signals should not be connected.
• RSVD_NCTF – These signals are non-critical to function and may be left unconnected
Arbitrary connection of these signals to VCC, VCCIO, VDDQ, VCCPLL, VCCSA, VCCAXG, VSS, or
to any other signal (including each other) may result in component malfunction or
incompatibility with future processors. See Chapter 8 for a land listing of the processor
and the location of all reserved signals.
For reliable operation, always connect unused inputs or bi-directional signals to an
appropriate signal level. Unused active high inputs should be connected through a
resistor to ground (VSS). Unused outputs maybe left unconnected; however, this may
interfere with some Test Access Port (TAP) functions, complicate debug probing, and
prevent boundary scan testing. A resistor must be used when tying bi-directional
signals to power or ground. When tying any signal to power or ground, a resistor will
also allow for system testability. For details see Table 7-9.
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7.7
Signal Groups
Signals are grouped by buffer type and similar characteristics as listed in Table 7-3. The
buffer type indicates which signaling technology and specifications apply to the signals.
All the differential signals, and selected DDR3 and Control Sideband signals have OnDie Termination (ODT) resistors. There are some signals that do not have ODT and
need to be terminated on the board.
Table 7-3.
Signal Groups (Sheet 1 of 2)1
Signal Group
Type
Signals
System Reference Clock
Differential
CMOS Input
BCLK[0], BCLK#[0]
DDR3 Reference Clocks2
Differential
DDR3 Output
SA_CK[3:0], SA_CK#[3:0]
SB_CK[3:0], SB_CK#[3:0]
DDR3 Command Signals2
Single Ended
DDR3 Output
SA_RAS#, SB_RAS#, SA_CAS#, SB_CAS#
SA_WE#, SB_WE#
SA_MA[15:0], SB_MA[15:0]
SA_BS[2:0], SB_BS[2:0]
SM_DRAMRST#
SA_CS#[3:0], SB_CS#[3:0]
SA_ODT[3:0], SB_ODT[3:0]
SA_CKE[3:0], SB_CKE[3:0]
DDR3 Data Signals2
Single ended
Differential
DDR3 Bi-directional
SA_DQ[63:0], SB_DQ[63:0]
DDR3 Bi-directional
SA_DQS[8:0], SA_DQS#[8:0]
SB_DQS[8:0], SB_DQS#[8:0]
TAP (ITP/XDP)
Single Ended
CMOS Input
TCK, TDI, TMS, TRST#
Single Ended
CMOS Output
TDO
Single Ended
Asynchronous CMOS Output
TAPPWRGOOD
Control Sideband
Single Ended
CMOS Input
CFG[17:0]
Single Ended
Asynchronous CMOS/Open
Drain Bi-directional
PROCHOT#
Single Ended
Asynchronous CMOS Output
THERMTRIP#, CATERR#
Asynchronous CMOS Input
SM_DRAMPWROK, UNCOREPWRGOOD3, PM_SYNC,
RESET#
Single Ended
Single Ended
Asynchronous Bi-directional
PECI
Single Ended
CMOS Input
Open Drain Output
Bi-directional CMOS Input
/Open Drain Output
VIDALERT#
VIDSCLK
VIDSOUT
Power
VCC, VCC_NCTF, VCCIO, VCCPLL, VDDQ, VCCAXG
Ground
VSS
No Connect and test point
RSVD, RSVD_NCTF, RSVD_TP, FC_x
Power/Ground/Other
Datasheet, Volume 1
77
Electrical Specifications
Table 7-3.
Signal Groups (Sheet 2 of 2)1
Signal Group
Type
Signals
Sense Points
VCC_SENSE, VSS_SENSE, VCCIO_SENSE,
VSS_SENSE_VCCIO, VAXG_SENSE, VSSAXG_SENSE
Other
SKTOCC#, DBR#
Differential
PCI Express Input
PEG_RX[15:0], PEG_RX#[15:0], PE_RX[3:0],
PE_RX#[3:0]
Differential
PCI Express Output
PEG_TX[15:0], PEG_TX#[15:0], PE_TX[3:0],
PE_TX#[3:0]
Single Ended
Analog Input
PEG_ICOMP0, PEG_COMPI, PEG_RCOMP0
Differential
DMI Input
DMI_RX[3:0], DMI_RX#[3:0]
Differential
DMI Output
DMI_TX[3:0], DMI_TX#[3:0]
Single Ended
FDI Input
FDI_FSYNC[1:0], FDI_LSYNC[1:0], FDI_INT
Differential
FDI Output
FDI_TX[7:0], FDI_TX#[7:0]
Single Ended
Analog Input
FDI_COMPIO, FDI_ICOMPO
PCI Express*
DMI
Intel® FDI
Notes:
1.
Refer to Chapter 6 and Chapter 8 for signal description details.
2.
SA and SB refer to DDR3 Channel A and DDR3 Channel B.
3.
The maximum rise/fall time for UNCOREPWRGOOD is 20 ns.
All Control Sideband Asynchronous signals are required to be asserted/de-asserted for
at least 10 BCLKs with a maximum Trise/Tfall of 6 ns for the processor to recognize
the proper signal state. See Section 7.10 for the DC specifications.
7.8
Test Access Port (TAP) Connection
Due to the voltage levels supported by other components in the Test Access Port (TAP)
logic, Intel recommends the processor be first in the TAP chain, followed by any other
components within the system. A translation buffer should be used to connect to the
rest of the chain unless one of the other components is capable of accepting an input of
the appropriate voltage. Two copies of each signal may be required with each driving a
different voltage level.
The processor supports Boundary Scan (JTAG) IEEE 1149.1-2001 and IEEE 1149.62003 standards. Some small portion of the I/O pins may support only one of these
standards.
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Datasheet, Volume 1
Electrical Specifications
7.9
Storage Conditions Specifications
Environmental storage condition limits define the temperature and relative humidity
that the device is exposed to while being stored in a moisture barrier bag. The specified
storage conditions are for component level prior to board attach.
Table 7-4 specifies absolute maximum and minimum storage temperature limits that
represent the maximum or minimum device condition beyond which damage, latent or
otherwise, may occur. The table also specifies sustained storage temperature, relative
humidity, and time-duration limits. These limits specify the maximum or minimum
device storage conditions for a sustained period of time. Failure to adhere to the
following specifications can affect long term reliability of the processor.
Table 7-4.
Storage Condition Ratings
Symbol
Parameter
Tabsolute storage
The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when exceeded for any length of
time.
Tsustained storage
The ambient storage temperature (in
shipping media) for a sustained period of time
Tshort term storage
The ambient storage temperature (in
shipping media) for a short period of time.
RHsustained storage
The maximum device storage relative
humidity for a sustained period of time.
Timesustained storage
A prolonged or extended period of time;
typically associated with customer shelf life.
Timeshort term storage
A short-period of time.
Min
Max
Notes
-25 °C
125 °C
1, 2, 3, 4
-5 °C
40 °C
5, 6
-20 °C
85 °C
60% at 24 °C
0 Months
30 Months
0 hours
72 hours
6, 7
7
Notes:
1.
Refers to a component device that is not assembled in a board or socket and is not electrically connected to
a voltage reference or I/O signal.
2.
Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount
reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.
3.
Tabsolute storage applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags, or desiccant.
4.
Component product device storage temperature qualification methods may follow JESD22-A119 (low temp)
and JESD22-A103 (high temp) standards when applicable for volatile memory.
5.
Intel branded products are specified and certified to meet the following temperature and humidity limits
that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C and Humidity: 50%
to 90%, non-condensing with a maximum wet bulb of 28 °C.) Post board attach storage temperature limits
are not specified for non-Intel branded boards.
6.
The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
7.
Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by Tsustained storage and customer shelf life in applicable Intel boxes and bags.
Datasheet, Volume 1
79
Electrical Specifications
7.10
DC Specifications
The processor DC specifications in this section are defined at the processor
pads, unless noted otherwise. See Chapter 8 for the processor land listings and
Chapter 6 for signal definitions. Voltage and current specifications are detailed in
Table 7-5, Table 7-6, and Table 7-7.
The DC specifications for the DDR3 signals are listed in Table 7-8 Control Sideband and
Test Access Port (TAP) are listed in Table 7-9.
Table 7-5 through Table 7-7 list the DC specifications for the processor and are valid
only while meeting the thermal specifications (as specified in the Thermal / Mechanical
Specifications and Guidelines), clock frequency, and input voltages. Care should be
taken to read all notes associated with each parameter.
7.10.1
Voltage and Current Specifications
Table 7-5.
Processor Core Active and Idle Mode DC Voltage and Current Specifications
(Sheet 1 of 2)
Symbol
VID
80
Parameter
VID Range
Min
Typ
Max
Unit
Note1
0.2500
—
1.5200
V
2
m
3, 5, 6
mV
3, 5, 6,
7
mV
3, 5, 6,
7
2.9
m
3, 5, 6,
8
LLVCC
VCC Loadline Slope
2011D, 2011C, 2011B (processors
with 95 W, 65 W, and 45 W TDPs)
VCCTOB
VCC Tolerance Band
2011D, 2011C, 2011B (processors
with 95 W, 65 W, and 45 W TDPs)
PS0
PS1
PS2
±16
±13
±11.5
VCCRipple
Ripple:
2011D, 2011C, 2011B (processors
with 95 W, 65 W, and 45 W TDPs)
PS0
PS1
PS2
±7
±10
-10/+25
LLVCC
VCC Loadline Slope
2011A (processors with 35 W TDP)
VCCTOB
VCC Tolerance Band
2011A (processors with 35 W TDP)
PS0
PS1
PS2
19
19
11.5
mV
3, 5, 6,
7, 8
VCCRipple
Ripple:
2011A (processors with 35 W TDP)
PS0
PS1
PS2
±10
±10
-10/+25
mV
3, 5, 6,
7, 8
VCC,BOOT
Default VCC voltage for initial
power up
—
0
—
V
ICC
2011D (processors with 95 W
TDPs) ICC
—
—
112
A
4
ICC
2011C (processors with 65 W TDP)
ICC
—
—
75
A
4
1.7
Datasheet, Volume 1
Electrical Specifications
Table 7-5.
Processor Core Active and Idle Mode DC Voltage and Current Specifications
(Sheet 2 of 2)
Symbol
Parameter
Min
Typ
Max
Unit
Note1
ICC
2011B (processors with 45 W TDP)
ICC
—
—
60
A
4
ICC
2011A (processors with 35 W TDP)
ICC
—
—
35
A
4
ICC_TDC
2011D (processors with 95 W
TDPs) Sustained ICC
—
—
85
A
4
ICC_TDC
2011C (processors with 65 W TDP)
Sustained ICC
—
—
55
A
4
ICC_TDC
2011B (processors with 45 W TDP)
Sustained ICC
—
—
40
A
4
ICC_TDC
2011A (processors with 35 W TDP)
Sustained ICC
—
—
25
A
4
Notes:
1.
Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical
data. These specifications will be updated with characterized data from silicon measurements at a later
date.
2.
Each processor is programmed with a maximum valid voltage identification value (VID) that is set at
manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power management event (Adaptive
Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low Power States).
3.
The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the
socket with a 20-MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1-M minimum
impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external
noise from the system is not coupled into the oscilloscope probe.
4.
ICC_MAX specification is based on the VCC loadline at worst case (highest) tolerance and ripple.
5.
The VCC specifications represent static and transient limits.
6.
The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage
regulation feedback for voltage regulator circuits must also be taken from processor VCC_SENSE and
VSS_SENSE lands.
7.
PSx refers to the voltage regulator power state as set by the SVID protocol.
8.
2011A (processors with 35 W TDP) loadline slope, TOB, and ripple specifications allow for a cost reduced
voltage regulator for boards supporting only the 2011A (processors with 35 W TDP). 2011A (processors
with 35 W TDP) processors may also use the loadline slope, TOB, and ripple specifications for the 2011D
(processors with 95 W TDP), 2011C (processors with 65 W TDP), and 2011B (processors with 45 W TDP).
Datasheet, Volume 1
81
Electrical Specifications
Table 7-6.
Processor System Agent I/O Buffer Supply DC Voltage and Current
Specifications
Symbol
Parameter
Min
Typ
Max
Unit
VCCSA
Voltage for the system agent
0.879
0.925
0.971
V
VDDQ
Processor I/O supply voltage for
DDR3
1.425
1.5
1.575
V
1.71
1.8
1.89
V
-2/-3%
1.05
+2/+3%
V
Current for the system agent
—
—
8.8
A
ISA_TDC
Sustained current for the system
agent
—
—
8.2
A
IDDQ
Processor I/O supply current for
DDR3
—
—
4.75
A
IDDQ_TDC
Processor I/O supply sustained
current for DDR3
—
—
4.75
A
Processor I/O supply standby
current for DDR3
—
—
1
A
PLL supply current
—
—
1.5
A
VCCPLL
PLL supply voltage (DC + AC
specification)
VCCIO
Processor I/O supply voltage for
other than DDR3
ISA
IDDQ_STANDBY
ICC_VCCPLL
ICC_VCCPLL_TDC
PLL sustained supply current
—
—
0.93
A
ICC_VCCIO
Processor I/O supply current
—
—
8.5
A
Processor I/O supply sustained
current
—
—
8.5
A
ICC_VCCIO_TDC
Note
1
2
3
Notes:
1.
Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical
data. These specifications will be updated with characterized data from silicon measurements at a later
date.
2.
VCCSA must be provided using a separate voltage source and not be connected to VCC. This specification is
measured at VCCSA_SENSE.
3.
±5% total. Minimum of ±2% DC and 3% AC at the sense point. di/dt = 50 A/us with 150 ns step.
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Electrical Specifications
Table 7-7.
Processor Graphics VID based (VAXG) Supply DC Voltage and Current
Specifications
Symbol
VAXG GFX_VID
Range
LLAXG
VAXGTOB
VAXGRipple
Parameter
GFX_VID Range for VCCAXG
Min
Typ
Max
Unit
Note2
0.2500
—
1.5200
V
1
4.1
m
3, 4
19
11.5
mV
3, 4, 5
mV
3, 4, 5
VCCAXG Loadline Slope
VCC Tolerance Band
PS0, PS1
PS2
Ripple:
PS0
PS1
PS2
±10
±10
-10/+15
IAXG
Current for Processor Graphics
core
—
—
35
A
IAXG_TDC
Sustained current for Processor
Graphics core
—
—
25
A
Notes:
1.
VCCAXG is VID based rail.
2.
Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical
data. These specifications will be updated with characterized data from silicon measurements at a later
date.
3.
The VAXG_MIN and VAXG_MAX loadlines represent static and transient limits.
4.
The loadlines specify voltage limits at the die measured at the VAXG_SENSE and VSSAXG_SENSE lands.
Voltage regulation feedback for voltage regulator circuits must also be taken from processor VAXG_SENSE
and VSSAXG_SENSE lands.
5.
PSx refers to the voltage regulator power state as set by the SVID protocol.
6.
Each processor is programmed with a maximum valid voltage identification value (VID) that is set at
manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power management event (Adaptive
Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low Power States).
Datasheet, Volume 1
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Electrical Specifications
Table 7-8.
Symbol
DDR3 Signal Group DC Specifications
Parameter
Min
Typ
Max
Units
Notes1,9
—
SM_VREF – 0.1
V
2,4
V
3
VIL
Input Low Voltage
—
VIH
Input High Voltage
SM_VREF + 0.1
—
—
VOL
Output Low Voltage
—
(VDDQ / 2)* (RON
/(RON+RTERM))
—
Output High Voltage
—
VDDQ – ((VDDQ / 2)*
(RON/(RON+RTERM))
—
V
4,6
VOH
6
RON_UP(DQ)
DDR3 data buffer pull-up resistance
24.31
28.6
32.9

5
RON_DN(DQ)
DDR3 data buffer pull-down
resistance
22.88
28.6
34.32

5
RODT(DQ)
DDR3 on-die termination equivalent
resistance for data signals
83
41.5
100
50
117
65

7
VODT(DC)
DDR3 on-die termination DC
working point (driver set to receive
mode)
0.43*VDDQ
0.5*VDDQ
0.56*VCC
V
7
RON_UP(CK)
DDR3 clock buffer pull-up
resistance
20.8
26
28.6
Ω
5
RON_DN(CK)
DDR3 clock buffer pull-down
resistance
20.8
26
31.2
Ω
5
RON_UP(CMD)
DDR3 command buffer pull-up
resistance
16
20
23
Ω
5
RON_DN(CMD)
DDR3 command buffer pull-down
resistance
16
20
24
Ω
5
RON_UP(CTL)
DDR3 control buffer pull-up
resistance
16
20
23
Ω
5
RON_DN(CTL)
DDR3 control buffer pull-down
resistance
16
20
24
Ω
5
Input Low Voltage for
SM_DRAMPWROK
—
—
VDDQ *.55 – 0.1
V
9
Input High Voltage for
SM_DRAMPWROK
VDDQ *.55 +0.1
—
—
V
9
ILI
Input Leakage Current (DQ, CK)
0V
0.2*VDDQ
0.8*VDDQ
VDDQ
—
—
ILI
Input Leakage Current (CMD, CTL)
0V
0.2*VDDQ
0.8*VDDQ
VDDQ
—
—
VIL_SM_DRAMP
WROK
VIH_SM_DRAMP
WROK
± 0.75
± 0.55
± 0.9
± 1.4
± 0.85
± 0.65
± 1.1
± 1.65
mA
mA
Notes:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low
value.
3.
VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high
value.
4.
VIH and VOH may experience excursions above VDDQ. However, input signal drivers must comply with the
signal quality specifications.
5.
This is the pull up/down driver resistance.
6.
RTERM is the termination on the DIMM and in not controlled by the processor.
7.
The minimum and maximum values for these signals are programmable by BIOS to one of the two sets.
8.
DDR3 values are pre-silicon estimations and subject to change.
9.
SM_DRAMPWROK must have a maximum of 15 ns rise or fall time over VDDQ * 0.55 ±200 mV and edge
must be monotonic.
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Datasheet, Volume 1
Electrical Specifications
Table 7-9.
Control Sideband and TAP Signal Group DC Specifications
Symbol
Parameter
Min
Max
Units
Notes1
VCCIO * 0.3
V
2
VIL
Input Low Voltage
—
VIH
Input High Voltage
VCCIO * 0.7
—
V
2, 4
VOL
Output Low Voltage
—
VCCIO * 0.1
V
2
VOH
Output High Voltage
VCCIO * 0.9
—
V
2, 4
RON
Buffer on Resistance
23
73

Input Leakage Current
—
±200
A
ILI
3
Notes:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
The VCCIO referred to in these specifications refers to instantaneous VCCIO.
3.
For VIN between “0” V and VCCIO. Measured when the driver is tristated.
4.
VIH and VOH may experience excursions above VCCIO. However, input signal drivers must comply with the
signal quality specifications.
Table 7-10. PCI Express* DC Specifications
Min
Typ
Max
Units
Notes1,11
Low differential peak to peak Tx voltage
swing
0.4
0.5
0.6
V
3
VTX-DIFF-p-p
Differential peak to peak Tx voltage swing
0.8
1
1.2
V
3
VTX_CM-AC-p
Tx AC Peak Common Mode Output
Voltage (Gen1 only)
—
—
20
mV
1, 2, 6
VTX_CM-AC-p-p
Tx AC Peak Common Mode Output
Voltage (Gen2 only)
—
—
100
mV
1, 2
Symbol
VTX-DIFF-p-p Low
Parameter
DC Differential Tx Impedance (Gen1 only)
80
90
120

1, 10
DC Common Mode Rx Impedance
40
45
60

1, 8, 9
ZRX-DIFF-DC
DC Differential Rx Impedance (Gen1 only)
80
90
120

1
VRX-DIFFp-p
Differential Rx input Peak to Peak Voltage
(Gen1 only)
0.175
—
1.2
V
1
VRX-DIFFp-p
Differential Rx input Peak to Peak Voltage
(Gen2 only)
0.12
—
1.2
V
1
VRX_CM-AC-p
Rx AC peak Common Mode Input Voltage
150
—
—
mV
1, 7
ZTX-DIFF-DC
ZRX-DC
PEG_ICOMPO
Comp Resistance
24.75
25
25.25

4, 5
PEG_COMPI
Comp Resistance
24.75
25
25.25

4, 5
PEG_RCOMPO
Comp Resistance
24.75
25
25.25

4, 5
Notes:
1.
Refer to the PCI Express Base Specification for more details.
2.
VTX-AC-CM-PP and VTX-AC-CM-P are defined in the PCI Express Base Specification. Measurement is made over
at least 10^6 UI.
3.
As measured with compliance test load. Defined as 2*|VTXD+ – VTXD- |.
4.
COMP resistance must be provided on the system board with 1% resistors.
5.
PEG_ICOMPO, PEG_COMPI, PEG_RCOMPO are the same resistor.
6.
RMS value.
7.
Measured at Rx pins into a pair of 50-terminations into ground. Common mode peak voltage is defined by
the expression: max{|(Vd+ - Vd-) - V-CMDC|}.
8.
DC impedance limits are needed to ensure Receiver detect.
9.
The Rx DC Common Mode Impedance must be present when the Receiver terminations are first enabled to
ensure that the Receiver Detect occurs properly. Compensation of this impedance can start immediately
and the 15 Rx Common Mode Impedance (constrained by RLRX-CM to 50  ±20%) must be within the
specified range by the time Detect is entered.
10. Low impedance defined during signaling. Parameter is captured for 5.0 GHz by RLTX-DIFF.
11. These are pre-silicon estimates and are subject to change.
Datasheet, Volume 1
85
Electrical Specifications
7.11
Platform Environmental Control Interface (PECI)
DC Specifications
PECI is an Intel proprietary interface that provides a communication channel between
Intel processors and chipset components to external thermal monitoring devices. The
processor contains a Digital Thermal Sensor (DTS) that reports a relative die
temperature as an offset from Thermal Control Circuit (TCC) activation temperature.
Temperature sensors located throughout the die are implemented as analog-to-digital
converters calibrated at the factory. PECI provides an interface for external devices to
read the DTS temperature for thermal management and fan speed control. More
detailed information is provided in the Platform Environment Control Interface (PECI)
Specification.
7.11.1
PECI Bus Architecture
The PECI architecture based on wired OR bus that the clients (as processor PECI) can
pull up high (with strong drive).
The idle state on the bus is near zero.
Figure 7-1 demonstrates PECI design and connectivity, while the host/originator can be
3rd party PECI host, and one of the PECI clients is the processor PECI device.
Figure 7-1.
86
Example for PECI Host-clients Connection
Datasheet, Volume 1
Electrical Specifications
7.11.2
DC Characteristics
The PECI interface operates at a nominal voltage set by VCCIO. The set of DC electrical
specifications shown in Table 7-11 is used with devices normally operating from a VCCIO
interface supply. VCCIO nominal levels will vary between processor families. All PECI
devices will operate at the VCCIO level determined by the processor installed in the
system. For specific nominal VCCIO levels, refer to Table 7-6.
Table 7-11. PECI DC Electrical Limits
Symbol
Definition and Conditions
Rup
Internal pull up resistance
Vin
Input Voltage Range
Vhysteresis
Hysteresis
Min
Max
Units
Notes1
15
45
Ohm
3
V
-0.15
VCCIO
0.1 * VCCIO
N/A
V
Vn
Negative-Edge Threshold Voltage
0.275 * VCCIO
0.500 * VCCIO
V
Vp
Positive-Edge Threshold Voltage
0.550 * VCCIO
0.725 * VCCIO
V
Cbus
Bus Capacitance per Node
N/A
10
pF
Cpad
Pad Capacitance
0.7
1.8
pF
Ileak000
leakage current at 0V
—
0.6
mA
2
Ileak025
leakage current at 0.25*VCCIO
—
0.4
mA
2
Ileak050
leakage current at 0.50*VCCIO
—
0.2
mA
2
Ileak075
leakage current at 0.75*VCCIO
—
0.13
mA
2
Ileak100
leakage current at VCCIO
—
0.10
mA
2
Notes:
1.
VCCIO supplies the PECI interface. PECI behavior does not affect VCCIO min/max specifications.
2.
The leakage specification applies to powered devices on the PECI bus.
3.
The PECI buffer internal pull up resistance measured at 0.75*VCCIO
7.11.3
Input Device Hysteresis
The input buffers in both client and host models must use a Schmitt-triggered input
design for improved noise immunity. Use Figure 7-2 as a guide for input buffer design.
Figure 7-2.
Input Device Hysteresis
§§
Datasheet, Volume 1
87
Electrical Specifications
88
Datasheet, Volume 1
Processor Pin and Signal Information
8
Processor Pin and Signal
Information
8.1
Processor Pin Assignments
The processor pinmap quadrants are shown in Figure 8-1 through Figure 8-4. Table 8-1
provides a listing of all processor pins ordered alphabetically by pin name.
b
Datasheet, Volume 1
89
Processor Pin and Signal Information
Figure 8-1.
90
Socket Pinmap (Top View, Upper-Left Quadrant)
Datasheet, Volume 1
Processor Pin and Signal Information
Figure 8-2.
Socket Pinmap (Top View, Upper-Right Quadrant)
Datasheet, Volume 1
91
Processor Pin and Signal Information
Figure 8-3.
92
Socket Pinmap (Top View, Lower-Left Quadrant)
Datasheet, Volume 1
Processor Pin and Signal Information
Figure 8-4.
Socket Pinmap (Top View, Lower-Right Quadrant)
Datasheet, Volume 1
93
Processor Pin and Signal Information
Table 8-1.
Pin Name
94
Processor Pin List by Pin
Name
Table 8-1.
Pin Name
Processor Pin List by Pin
Name
Pin #
Buffer Type
Dir.
Pin #
Buffer Type
Dir.
BCLK_ITP
C40
Diff Clk
I
DMI_TX#[0]
V6
DMI
O
BCLK_ITP#
D40
Diff Clk
I
DMI_TX#[1]
W8
DMI
O
BCLK[0]
W2
Diff Clk
I
DMI_TX#[2]
Y7
DMI
O
BCLK#[0]
W1
Diff Clk
I
DMI_TX#[3]
AA8
DMI
O
BPM#[0]
H40
GTL
I/O
FC_AH1
AH1
N/A
O
BPM#[1]
H38
GTL
I/O
FC_AH4
AH4
N/A
O
BPM#[2]
G38
GTL
I/O
FDI_COMPIO
AE2
Analog
I
BPM#[3]
G40
GTL
I/O
FDI_FSYNC[0]
AC5
CMOS
I
BPM#[4]
G39
GTL
I/O
FDI_FSYNC[1]
AE5
CMOS
I
BPM#[5]
F38
GTL
I/O
FDI_ICOMPO
AE1
Analog
I
BPM#[6]
E40
GTL
I/O
FDI_INT
AG3
CMOS
I
BPM#[7]
F40
GTL
I/O
FDI_LSYNC[0]
AC4
CMOS
I
CATERR#
E37
GTL
O
FDI_LSYNC[1]
AE4
CMOS
I
CFG[0]
H36
CMOS
I
FDI_TX[0]
AC8
FDI
O
CFG[1]
J36
CMOS
I
FDI_TX[1]
AC2
FDI
O
CFG[10]
M38
CMOS
I
FDI_TX[2]
AD2
FDI
O
CFG[11]
N36
CMOS
I
FDI_TX[3]
AD4
FDI
O
CFG[12]
N38
CMOS
I
FDI_TX[4]
AD7
FDI
O
CFG[13]
N39
CMOS
I
FDI_TX[5]
AE7
FDI
O
CFG[14]
N37
CMOS
I
FDI_TX[6]
AF3
FDI
O
CFG[15]
N40
CMOS
I
FDI_TX[7]
AG2
FDI
O
CFG[16]
G37
CMOS
I
FDI_TX#[0]
AC7
FDI
O
CFG[17]
G36
CMOS
I
FDI_TX#[1]
AC3
FDI
O
CFG[2]
J37
CMOS
I
FDI_TX#[2]
AD1
FDI
O
CFG[3]
K36
CMOS
I
FDI_TX#[3]
AD3
FDI
O
CFG[4]
L36
CMOS
I
FDI_TX#[4]
AD6
FDI
O
CFG[5]
N35
CMOS
I
FDI_TX#[5]
AE8
FDI
O
CFG[6]
L37
CMOS
I
FDI_TX#[6]
AF2
FDI
O
CFG[7]
M36
CMOS
I
FDI_TX#[7]
AG1
FDI
O
CFG[8]
J38
CMOS
I
NCTF
A38
CFG[9]
L35
CMOS
I
NCTF
AU40
DBR#
E39
Async CMOS
O
NCTF
AW38
DMI_RX[0]
W5
DMI
I
NCTF
C2
DMI_RX[1]
V3
DMI
I
NCTF
D1
DMI_RX[2]
Y3
DMI
I
PE_RX[0]
P3
PCI Express
I
DMI_RX[3]
AA4
DMI
I
PE_RX[1]
R2
PCI Express
I
DMI_RX#[0]
W4
DMI
I
PE_RX[2]
T4
PCI Express
I
DMI_RX#[1]
V4
DMI
I
PE_RX[3]
U2
PCI Express
I
DMI_RX#[2]
Y4
DMI
I
PE_RX#[0]
P4
PCI Express
I
DMI_RX#[3]
AA5
DMI
I
PE_RX#[1]
R1
PCI Express
I
DMI_TX[0]
V7
DMI
O
PE_RX#[2]
T3
PCI Express
I
DMI_TX[1]
W7
DMI
O
PE_RX#[3]
U1
PCI Express
I
DMI_TX[2]
Y6
DMI
O
PE_TX[0]
P8
PCI Express
O
DMI_TX[3]
AA7
DMI
O
PE_TX[1]
T7
PCI Express
O
Datasheet, Volume 1
Processor Pin and Signal Information
Table 8-1.
Pin Name
Processor Pin List by Pin
Name
Table 8-1.
Pin #
Buffer Type
Dir.
Pin #
Buffer Type
Dir.
PE_TX[2]
R6
PCI Express
O
PEG_TX[2]
G14
PCI Express
O
PE_TX[3]
U5
PCI Express
O
PEG_TX[3]
F12
PCI Express
O
PE_TX#[0]
P7
PCI Express
O
PEG_TX[4]
J14
PCI Express
O
PE_TX#[1]
T8
PCI Express
O
PEG_TX[5]
D8
PCI Express
O
PE_TX#[2]
R5
PCI Express
O
PEG_TX[6]
D3
PCI Express
O
PE_TX#[3]
U6
PCI Express
O
PEG_TX[7]
E6
PCI Express
O
PECI
J35
Async
I/O
PEG_TX[8]
F8
PCI Express
O
PEG_COMPI
B4
Analog
I
PEG_TX[9]
G10
PCI Express
O
PEG_ICOMPO
B5
Analog
I
PEG_TX[10]
G5
PCI Express
O
O
PEG_RCOMPO
Pin Name
Processor Pin List by Pin
Name
C4
Analog
I
PEG_TX[11]
K7
PCI Express
PEG_RX[0]
B11
PCI Express
I
PEG_TX[12]
J5
PCI Express
O
PEG_RX[1]
D12
PCI Express
I
PEG_TX[13]
M8
PCI Express
O
H3
PCI Express
I
PEG_TX[14]
L6
PCI Express
O
O
PEG_RX[10]
PEG_RX[11]
J1
PCI Express
I
PEG_TX[15]
N5
PCI Express
PEG_RX[12]
K3
PCI Express
I
PEG_TX#[0]
C14
PCI Express
O
PEG_RX[13]
L1
PCI Express
I
PEG_TX#[1]
E13
PCI Express
O
PEG_RX[14]
M3
PCI Express
I
PEG_TX#[2]
G13
PCI Express
O
PEG_RX[15]
N1
PCI Express
I
PEG_TX#[3]
F11
PCI Express
O
PEG_RX[2]
C10
PCI Express
I
PEG_TX#[4]
J13
PCI Express
O
PEG_RX[3]
E10
PCI Express
I
PEG_TX#[5]
D7
PCI Express
O
PEG_RX[4]
B8
PCI Express
I
PEG_TX#[6]
C3
PCI Express
O
PEG_RX[5]
C6
PCI Express
I
PEG_TX#[7]
E5
PCI Express
O
PEG_RX[6]
A5
PCI Express
I
PEG_TX#[8]
F7
PCI Express
O
PEG_RX[7]
E2
PCI Express
I
PEG_TX#[9]
G9
PCI Express
O
PEG_RX[8]
F4
PCI Express
I
PEG_TX#[10]
G6
PCI Express
O
PEG_RX[9]
G2
PCI Express
I
PEG_TX#[11]
K8
PCI Express
O
PEG_RX#[0]
B12
PCI Express
I
PEG_TX#[12]
J6
PCI Express
O
PEG_RX#[1]
D11
PCI Express
I
PEG_TX#[13]
M7
PCI Express
O
H4
PCI Express
I
PEG_TX#[14]
L5
PCI Express
O
O
PEG_RX#[10]
PEG_RX#[11]
J2
PCI Express
I
PEG_TX#[15]
N6
PCI Express
PEG_RX#[12]
K4
PCI Express
I
PM_SYNC
E38
CMOS
I
PEG_RX#[13]
L2
PCI Express
I
PRDY#
K38
Async GTL
O
PEG_RX#[14]
M4
PCI Express
I
PREQ#
K40
Async GTL
I
PEG_RX#[15]
N2
PCI Express
I
PROC_SEL
K32
N/A
O
PEG_RX#[2]
C9
PCI Express
I
PROCHOT#
H34
Async GTL
I/O
PEG_RX#[3]
E9
PCI Express
I
RESET#
F36
CMOS
I
PEG_RX#[4]
B7
PCI Express
I
RSVD
AB6
PEG_RX#[5]
C5
PCI Express
I
RSVD
AB7
PEG_RX#[6]
A6
PCI Express
I
RSVD
AD37
PEG_RX#[7]
E1
PCI Express
I
RSVD
AE6
PEG_RX#[8]
F3
PCI Express
I
RSVD
AF4
PEG_RX#[9]
G1
PCI Express
I
RSVD
AG4
PEG_TX[0]
C13
PCI Express
O
RSVD
AJ11
PEG_TX[1]
E14
PCI Express
O
RSVD
AJ29
Datasheet, Volume 1
95
Processor Pin and Signal Information
Table 8-1.
Pin Name
Pin #
Buffer Type
Dir.
Table 8-1.
Pin Name
Processor Pin List by Pin
Name
Pin #
Buffer Type
Dir.
AJ30
SA_BS[2]
AV20
DDR3
O
RSVD
AJ31
SA_CAS#
AV30
DDR3
O
RSVD
AN20
SA_CK[0]
AY25
DDR3
O
RSVD
AP20
SA_CK[1]
AU24
DDR3
O
RSVD
AT11
SA_CK[2]
AW27
DDR3
O
RSVD
AT14
SA_CK[3]
AV26
DDR3
O
RSVD
AU10
SA_CK#[0]
AW25
DDR3
O
RSVD
AV34
SA_CK#[1]
AU25
DDR3
O
RSVD
AW34
SA_CK#[2]
AY27
DDR3
O
RSVD
AY10
SA_CK#[3]
AW26
DDR3
O
RSVD
C38
SA_CKE[0]
AV19
DDR3
O
RSVD
C39
SA_CKE[1]
AT19
DDR3
O
RSVD
D38
SA_CKE[2]
AU18
DDR3
O
RSVD
H7
SA_CKE[3]
AV18
DDR3
O
RSVD
H8
SA_CS#[0]
AU29
DDR3
O
RSVD
J33
SA_CS#[1]
AV32
DDR3
O
RSVD
J34
SA_CS#[2]
AW30
DDR3
O
RSVD
J9
SA_CS#[3]
AU33
DDR3
O
RSVD
K34
SA_DQ[0]
AJ3
DDR3
I/O
RSVD
K9
SA_DQ[1]
AJ4
DDR3
I/O
RSVD
L31
SA_DQ[2]
AL3
DDR3
I/O
RSVD
L33
SA_DQ[3]
AL4
DDR3
I/O
RSVD
L34
SA_DQ[4]
AJ2
DDR3
I/O
RSVD
L9
SA_DQ[5]
AJ1
DDR3
I/O
RSVD
M34
SA_DQ[6]
AL2
DDR3
I/O
RSVD
N33
SA_DQ[7]
AL1
DDR3
I/O
RSVD
N34
SA_DQ[8]
AN1
DDR3
I/O
RSVD
P35
SA_DQ[9]
AN4
DDR3
I/O
RSVD
P37
SA_DQ[10]
AR3
DDR3
I/O
RSVD
P39
SA_DQ[11]
AR4
DDR3
I/O
RSVD
R34
SA_DQ[12]
AN2
DDR3
I/O
RSVD
R36
SA_DQ[13]
AN3
DDR3
I/O
RSVD
R38
SA_DQ[14]
AR2
DDR3
I/O
I/O
RSVD
96
Processor Pin List by Pin
Name
RSVD
R40
SA_DQ[15]
AR1
DDR3
RSVD
J31
SA_DQ[16]
AV2
DDR3
I/O
RSVD
AD34
SA_DQ[17]
AW3
DDR3
I/O
RSVD
AD35
SA_DQ[18]
AV5
DDR3
I/O
RSVD
K31
SA_DQ[19]
AW5
DDR3
I/O
RSVD_NCTF
AV1
SA_DQ[20]
AU2
DDR3
I/O
RSVD_NCTF
AW2
SA_DQ[21]
AU3
DDR3
I/O
RSVD_NCTF
AY3
SA_DQ[22]
AU5
DDR3
I/O
RSVD_NCTF
B39
SA_DQ[23]
AY5
DDR3
I/O
SA_BS[0]
AY29
DDR3
O
SA_DQ[24]
AY7
DDR3
I/O
SA_BS[1]
AW28
DDR3
O
SA_DQ[25]
AU7
DDR3
I/O
Datasheet, Volume 1
Processor Pin and Signal Information
Table 8-1.
Pin Name
Processor Pin List by Pin
Name
Table 8-1.
Pin #
Buffer Type
Dir.
SA_DQ[26]
AV9
DDR3
I/O
SA_DQS[6]
Pin Name
SA_DQ[27]
AU9
DDR3
I/O
SA_DQ[28]
AV7
DDR3
I/O
SA_DQ[29]
AW7
DDR3
SA_DQ[30]
AW9
SA_DQ[31]
SA_DQ[32]
SA_DQ[33]
SA_DQ[34]
Processor Pin List by Pin
Name
Pin #
Buffer Type
Dir.
AK38
DDR3
I/O
SA_DQS[7]
AF38
DDR3
I/O
SA_DQS[8]
AV13
DDR3
I/O
I/O
SA_DQS#[0]
AK2
DDR3
I/O
DDR3
I/O
SA_DQS#[1]
AP2
DDR3
I/O
AY9
DDR3
I/O
SA_DQS#[2]
AV4
DDR3
I/O
AU35
DDR3
I/O
SA_DQS#[3]
AW8
DDR3
I/O
AW37
DDR3
I/O
SA_DQS#[4]
AV36
DDR3
I/O
AU39
DDR3
I/O
SA_DQS#[5]
AP39
DDR3
I/O
SA_DQ[35]
AU36
DDR3
I/O
SA_DQS#[6]
AK39
DDR3
I/O
SA_DQ[36]
AW35
DDR3
I/O
SA_DQS#[7]
AF39
DDR3
I/O
SA_DQ[37]
AY36
DDR3
I/O
SA_DQS#[8]
AV12
DDR3
I/O
SA_DQ[38]
AU38
DDR3
I/O
RSVD
AU12
DDR3
I/O
SA_DQ[39]
AU37
DDR3
I/O
RSVD
AU14
DDR3
I/O
SA_DQ[40]
AR40
DDR3
I/O
RSVD
AW13
DDR3
I/O
SA_DQ[41]
AR37
DDR3
I/O
RSVD
AY13
DDR3
I/O
SA_DQ[42]
AN38
DDR3
I/O
RSVD
AU13
DDR3
I/O
SA_DQ[43]
AN37
DDR3
I/O
RSVD
AU11
DDR3
I/O
SA_DQ[44]
AR39
DDR3
I/O
RSVD
AY12
DDR3
I/O
SA_DQ[45]
AR38
DDR3
I/O
RSVD
AW12
DDR3
I/O
SA_DQ[46]
AN39
DDR3
I/O
SA_MA[0]
AV27
DDR3
O
SA_DQ[47]
AN40
DDR3
I/O
SA_MA[1]
AY24
DDR3
O
SA_DQ[48]
AL40
DDR3
I/O
SA_MA[2]
AW24
DDR3
O
SA_DQ[49]
AL37
DDR3
I/O
SA_MA[3]
AW23
DDR3
O
SA_DQ[50]
AJ38
DDR3
I/O
SA_MA[4]
AV23
DDR3
O
SA_DQ[51]
AJ37
DDR3
I/O
SA_MA[5]
AT24
DDR3
O
SA_DQ[52]
AL39
DDR3
I/O
SA_MA[6]
AT23
DDR3
O
SA_DQ[53]
AL38
DDR3
I/O
SA_MA[7]
AU22
DDR3
O
SA_DQ[54]
AJ39
DDR3
I/O
SA_MA[8]
AV22
DDR3
O
SA_DQ[55]
AJ40
DDR3
I/O
SA_MA[9]
AT22
DDR3
O
SA_DQ[56]
AG40
DDR3
I/O
SA_MA[10]
AV28
DDR3
O
SA_DQ[57]
AG37
DDR3
I/O
SA_MA[11]
AU21
DDR3
O
SA_DQ[58]
AE38
DDR3
I/O
SA_MA[12]
AT21
DDR3
O
O
SA_DQ[59]
AE37
DDR3
I/O
SA_MA[13]
AW32
DDR3
SA_DQ[60]
AG39
DDR3
I/O
SA_MA[14]
AU20
DDR3
O
SA_DQ[61]
AG38
DDR3
I/O
SA_MA[15]
AT20
DDR3
O
SA_DQ[62]
AE39
DDR3
I/O
SA_ODT[0]
AV31
DDR3
O
SA_DQ[63]
AE40
DDR3
I/O
SA_ODT[1]
AU32
DDR3
O
SA_DQS[0]
AK3
DDR3
I/O
SA_ODT[2]
AU30
DDR3
O
SA_DQS[1]
AP3
DDR3
I/O
SA_ODT[3]
AW33
DDR3
O
SA_DQS[2]
AW4
DDR3
I/O
SA_RAS#
AU28
DDR3
O
SA_DQS[3]
AV8
DDR3
I/O
SA_WE#
AW29
DDR3
O
SA_DQS[4]
AV37
DDR3
I/O
SB_BS[0]
AP23
DDR3
O
SA_DQS[5]
AP38
DDR3
I/O
SB_BS[1]
AM24
DDR3
O
Datasheet, Volume 1
97
Processor Pin and Signal Information
Table 8-1.
Pin Name
Table 8-1.
Pin Name
Processor Pin List by Pin
Name
Pin #
Buffer Type
Dir.
Pin #
Buffer Type
Dir.
SB_BS[2]
AW17
DDR3
O
SB_DQ[26]
AR13
DDR3
I/O
SB_CAS#
AK25
DDR3
O
SB_DQ[27]
AP13
DDR3
I/O
SB_CK[0]
AL21
DDR3
O
SB_DQ[28]
AL12
DDR3
I/O
SB_CK[1]
AL20
DDR3
O
SB_DQ[29]
AL13
DDR3
I/O
SB_CK[2]
AL23
DDR3
O
SB_DQ[30]
AR12
DDR3
I/O
SB_CK[3]
AP21
DDR3
O
SB_DQ[31]
AP12
DDR3
I/O
SB_CK#[0]
AL22
DDR3
O
SB_DQ[32]
AR28
DDR3
I/O
SB_CK#[1]
AK20
DDR3
O
SB_DQ[33]
AR29
DDR3
I/O
SB_CK#[2]
AM22
DDR3
O
SB_DQ[34]
AL28
DDR3
I/O
SB_CK#[3]
AN21
DDR3
O
SB_DQ[35]
AL29
DDR3
I/O
SB_CKE[0]
AU16
DDR3
O
SB_DQ[36]
AP28
DDR3
I/O
SB_CKE[1]
AY15
DDR3
O
SB_DQ[37]
AP29
DDR3
I/O
SB_CKE[2]
AW15
DDR3
O
SB_DQ[38]
AM28
DDR3
I/O
SB_CKE[3]
AV15
DDR3
O
SB_DQ[39]
AM29
DDR3
I/O
SB_CS#[0]
AN25
DDR3
O
SB_DQ[40]
AP32
DDR3
I/O
SB_CS#[1]
AN26
DDR3
O
SB_DQ[41]
AP31
DDR3
I/O
SB_CS#[2]
AL25
DDR3
O
SB_DQ[42]
AP35
DDR3
I/O
SB_CS#[3]
AT26
DDR3
O
SB_DQ[43]
AP34
DDR3
I/O
SB_DQ[0]
AG7
DDR3
I/O
SB_DQ[44]
AR32
DDR3
I/O
SB_DQ[1]
AG8
DDR3
I/O
SB_DQ[45]
AR31
DDR3
I/O
SB_DQ[2]
AJ9
DDR3
I/O
SB_DQ[46]
AR35
DDR3
I/O
SB_DQ[3]
AJ8
DDR3
I/O
SB_DQ[47]
AR34
DDR3
I/O
SB_DQ[4]
AG5
DDR3
I/O
SB_DQ[48]
AM32
DDR3
I/O
SB_DQ[5]
AG6
DDR3
I/O
SB_DQ[49]
AM31
DDR3
I/O
SB_DQ[6]
AJ6
DDR3
I/O
SB_DQ[50]
AL35
DDR3
I/O
SB_DQ[7]
AJ7
DDR3
I/O
SB_DQ[51]
AL32
DDR3
I/O
SB_DQ[8]
AL7
DDR3
I/O
SB_DQ[52]
AM34
DDR3
I/O
SB_DQ[9]
98
Processor Pin List by Pin
Name
AM7
DDR3
I/O
SB_DQ[53]
AL31
DDR3
I/O
SB_DQ[10]
AM10
DDR3
I/O
SB_DQ[54]
AM35
DDR3
I/O
SB_DQ[11]
AL10
DDR3
I/O
SB_DQ[55]
AL34
DDR3
I/O
SB_DQ[12]
AL6
DDR3
I/O
SB_DQ[56]
AH35
DDR3
I/O
SB_DQ[13]
AM6
DDR3
I/O
SB_DQ[57]
AH34
DDR3
I/O
SB_DQ[14]
AL9
DDR3
I/O
SB_DQ[58]
AE34
DDR3
I/O
SB_DQ[15]
AM9
DDR3
I/O
SB_DQ[59]
AE35
DDR3
I/O
SB_DQ[16]
AP7
DDR3
I/O
SB_DQ[60]
AJ35
DDR3
I/O
SB_DQ[17]
AR7
DDR3
I/O
SB_DQ[61]
AJ34
DDR3
I/O
SB_DQ[18]
AP10
DDR3
I/O
SB_DQ[62]
AF33
DDR3
I/O
SB_DQ[19]
AR10
DDR3
I/O
SB_DQ[63]
AF35
DDR3
I/O
SB_DQ[20]
AP6
DDR3
I/O
SB_DQS[0]
AH7
DDR3
I/O
SB_DQ[21]
AR6
DDR3
I/O
SB_DQS[1]
AM8
DDR3
I/O
SB_DQ[22]
AP9
DDR3
I/O
SB_DQS[2]
AR8
DDR3
I/O
SB_DQ[23]
AR9
DDR3
I/O
SB_DQS[3]
AN13
DDR3
I/O
SB_DQ[24]
AM12
DDR3
I/O
SB_DQS[4]
AN29
DDR3
I/O
SB_DQ[25]
AM13
DDR3
I/O
SB_DQS[5]
AP33
DDR3
I/O
Datasheet, Volume 1
Processor Pin and Signal Information
Table 8-1.
Processor Pin List by Pin
Name
Pin Name
Table 8-1.
Processor Pin List by Pin
Name
Pin #
Buffer Type
Dir.
Pin #
Buffer Type
Dir.
SB_DQS[6]
AL33
DDR3
I/O
SM_DRAMRST#
AW18
DDR3
O
SB_DQS[7]
AG35
DDR3
I/O
SM_VREF
AJ22
Analog
I
SB_DQS[8]
AN16
DDR3
I/O
TCK
M40
TAP
I
SB_DQS#[0]
AH6
DDR3
I/O
TDI
L40
TAP
I
SB_DQS#[1]
AL8
DDR3
I/O
TDO
L39
TAP
O
SB_DQS#[2]
AP8
DDR3
I/O
THERMTRIP#
G35
Async CMOS
O
SB_DQS#[3]
AN12
DDR3
I/O
TMS
L38
TAP
I
SB_DQS#[4]
AN28
DDR3
I/O
TRST#
J39
TAP
I
SB_DQS#[5]
AR33
DDR3
I/O
UNCOREPWRGOOD
J40
Async CMOS
I
SB_DQS#[6]
AM33
DDR3
I/O
VCC
A12
PWR
SB_DQS#[7]
AG34
DDR3
I/O
VCC
A13
PWR
SB_DQS#[8]
AN15
DDR3
I/O
VCC
A14
PWR
RSVD
AL16
DDR3
I/O
VCC
A15
PWR
RSVD
AM16
DDR3
I/O
VCC
A16
PWR
RSVD
AP16
DDR3
I/O
VCC
A18
PWR
RSVD
AR16
DDR3
I/O
VCC
A24
PWR
RSVD
AL15
DDR3
I/O
VCC
A25
PWR
RSVD
AM15
DDR3
I/O
VCC
A27
PWR
RSVD
AR15
DDR3
I/O
VCC
A28
PWR
RSVD
AP15
DDR3
I/O
VCC
B15
PWR
SB_MA[0]
AK24
DDR3
O
VCC
B16
PWR
SB_MA[1]
AM20
DDR3
O
VCC
B18
PWR
SB_MA[2]
AM19
DDR3
O
VCC
B24
PWR
SB_MA[3]
AK18
DDR3
O
VCC
B25
PWR
SB_MA[4]
AP19
DDR3
O
VCC
B27
PWR
SB_MA[5]
AP18
DDR3
O
VCC
B28
PWR
SB_MA[6]
AM18
DDR3
O
VCC
B30
PWR
SB_MA[7]
AL18
DDR3
O
VCC
B31
PWR
SB_MA[8]
AN18
DDR3
O
VCC
B33
PWR
SB_MA[9]
AY17
DDR3
O
VCC
B34
PWR
SB_MA[10]
AN23
DDR3
O
VCC
C15
PWR
SB_MA[11]
AU17
DDR3
O
VCC
C16
PWR
SB_MA[12]
AT18
DDR3
O
VCC
C18
PWR
SB_MA[13]
AR26
DDR3
O
VCC
C19
PWR
SB_MA[14]
AY16
DDR3
O
VCC
C21
PWR
SB_MA[15]
AV16
DDR3
O
VCC
C22
PWR
SB_ODT[0]
AL26
DDR3
O
VCC
C24
PWR
SB_ODT[1]
AP26
DDR3
O
VCC
C25
PWR
SB_ODT[2]
AM26
DDR3
O
VCC
C27
PWR
SB_ODT[3]
AK26
DDR3
O
VCC
C28
PWR
SB_RAS#
AP24
DDR3
O
VCC
C30
PWR
SB_WE#
AR25
DDR3
O
VCC
C31
PWR
SKTOCC#
AJ33
Analog
O
VCC
C33
PWR
SM_DRAMPWROK
AJ19
Async CMOS
I
VCC
C34
PWR
Datasheet, Volume 1
Pin Name
99
Processor Pin and Signal Information
Table 8-1.
Pin Name
100
Processor Pin List by Pin
Name
Table 8-1.
Dir.
Pin Name
Processor Pin List by Pin
Name
Pin #
Buffer Type
Pin #
Buffer Type
VCC
C36
PWR
VCC
F30
PWR
VCC
D13
PWR
VCC
F31
PWR
VCC
D14
PWR
VCC
F32
PWR
VCC
D15
PWR
VCC
F33
PWR
VCC
D16
PWR
VCC
F34
PWR
VCC
D18
PWR
VCC
G15
PWR
VCC
D19
PWR
VCC
G16
PWR
VCC
D21
PWR
VCC
G18
PWR
VCC
D22
PWR
VCC
G19
PWR
VCC
D24
PWR
VCC
G21
PWR
VCC
D25
PWR
VCC
G22
PWR
VCC
D27
PWR
VCC
G24
PWR
VCC
D28
PWR
VCC
G25
PWR
VCC
D30
PWR
VCC
G27
PWR
VCC
D31
PWR
VCC
G28
PWR
VCC
D33
PWR
VCC
G30
PWR
VCC
D34
PWR
VCC
G31
PWR
VCC
D35
PWR
VCC
G32
PWR
VCC
D36
PWR
VCC
G33
PWR
VCC
E15
PWR
VCC
H13
PWR
VCC
E16
PWR
VCC
H14
PWR
VCC
E18
PWR
VCC
H15
PWR
VCC
E19
PWR
VCC
H16
PWR
VCC
E21
PWR
VCC
H18
PWR
VCC
E22
PWR
VCC
H19
PWR
VCC
E24
PWR
VCC
H21
PWR
VCC
E25
PWR
VCC
H22
PWR
VCC
E27
PWR
VCC
H24
PWR
VCC
E28
PWR
VCC
H25
PWR
VCC
E30
PWR
VCC
H27
PWR
VCC
E31
PWR
VCC
H28
PWR
VCC
E33
PWR
VCC
H30
PWR
VCC
E34
PWR
VCC
H31
PWR
VCC
E35
PWR
VCC
H32
PWR
VCC
F15
PWR
VCC
J12
PWR
VCC
F16
PWR
VCC
J15
PWR
VCC
F18
PWR
VCC
J16
PWR
VCC
F19
PWR
VCC
J18
PWR
VCC
F21
PWR
VCC
J19
PWR
VCC
F22
PWR
VCC
J21
PWR
VCC
F24
PWR
VCC
J22
PWR
VCC
F25
PWR
VCC
J24
PWR
VCC
F27
PWR
VCC
J25
PWR
VCC
F28
PWR
VCC
J27
PWR
Dir.
Datasheet, Volume 1
Processor Pin and Signal Information
Table 8-1.
Pin Name
VCC
Processor Pin List by Pin
Name
Dir.
Table 8-1.
Pin Name
Processor Pin List by Pin
Name
Pin #
Buffer Type
Pin #
Buffer Type
J28
PWR
VCCAXG
AB38
PWR
PWR
VCC
J30
PWR
VCCAXG
AB39
VCC
K15
PWR
VCCAXG
AB40
PWR
VCC
K16
PWR
VCCAXG
AC33
PWR
VCC
K18
PWR
VCCAXG
AC34
PWR
VCC
K19
PWR
VCCAXG
AC35
PWR
VCC
K21
PWR
VCCAXG
AC36
PWR
VCC
K22
PWR
VCCAXG
AC37
PWR
VCC
K24
PWR
VCCAXG
AC38
PWR
VCC
K25
PWR
VCCAXG
AC39
PWR
VCC
K27
PWR
VCCAXG
AC40
PWR
VCC
K28
PWR
VCCAXG
T33
PWR
VCC
K30
PWR
VCCAXG
T34
PWR
VCC
L13
PWR
VCCAXG
T35
PWR
VCC
L14
PWR
VCCAXG
T36
PWR
VCC
L15
PWR
VCCAXG
T37
PWR
VCC
L16
PWR
VCCAXG
T38
PWR
VCC
L18
PWR
VCCAXG
T39
PWR
VCC
L19
PWR
VCCAXG
T40
PWR
VCC
L21
PWR
VCCAXG
U33
PWR
VCC
L22
PWR
VCCAXG
U34
PWR
VCC
L24
PWR
VCCAXG
U35
PWR
VCC
L25
PWR
VCCAXG
U36
PWR
VCC
L27
PWR
VCCAXG
U37
PWR
VCC
L28
PWR
VCCAXG
U38
PWR
VCC
L30
PWR
VCCAXG
U39
PWR
VCC
M14
PWR
VCCAXG
U40
PWR
VCC
M15
PWR
VCCAXG
W33
PWR
VCC
M16
PWR
VCCAXG
W34
PWR
VCC
M18
PWR
VCCAXG
W35
PWR
VCC
M19
PWR
VCCAXG
W36
PWR
VCC
M21
PWR
VCCAXG
W37
PWR
VCC
M22
PWR
VCCAXG
W38
PWR
VCC
M24
PWR
VCCAXG
Y33
PWR
VCC
M25
PWR
VCCAXG
Y34
PWR
VCC
M27
PWR
VCCAXG
Y35
PWR
VCC
M28
PWR
VCCAXG
Y36
PWR
VCC
M30
PWR
VCCAXG
Y37
PWR
VCC_SENSE
A36
Analog
VCCAXG
Y38
PWR
VCCAXG
AB33
PWR
VCCAXG_SENSE
L32
Analog
VCCAXG
AB34
PWR
VCCIO
A11
PWR
VCCAXG
AB35
PWR
VCCIO
A7
PWR
VCCAXG
AB36
PWR
VCCIO
AA3
PWR
VCCAXG
AB37
PWR
VCCIO
AB8
PWR
Datasheet, Volume 1
O
Dir.
O
101
Processor Pin and Signal Information
Table 8-1.
Pin Name
Table 8-1.
Dir.
Pin Name
Processor Pin List by Pin
Name
Pin #
Buffer Type
Pin #
Buffer Type
VCCIO
AF8
PWR
VCCPLL
AK12
PWR
VCCIO
AG33
PWR
VCCSA
H10
PWR
VCCIO
AJ16
PWR
VCCSA
H11
PWR
VCCIO
AJ17
PWR
VCCSA
H12
PWR
VCCIO
AJ26
PWR
VCCSA
J10
PWR
VCCIO
AJ28
PWR
VCCSA
K10
PWR
VCCIO
AJ32
PWR
VCCSA
K11
PWR
VCCIO
AK15
PWR
VCCSA
L11
PWR
VCCIO
AK17
PWR
VCCSA
L12
PWR
VCCIO
AK19
PWR
VCCSA
M10
PWR
VCCIO
AK21
PWR
VCCSA
M11
PWR
VCCIO
AK23
PWR
VCCSA
M12
PWR
VCCIO
AK27
PWR
VCCSA_SENSE
T2
Analog
O
VCCIO
AK29
PWR
VCCSA_VID
P34
CMOS
O
VCCIO
AK30
PWR
VDDQ
AJ13
PWR
VCCIO
B9
PWR
VDDQ
AJ14
PWR
VCCIO
D10
PWR
VDDQ
AJ20
PWR
VCCIO
D6
PWR
VDDQ
AJ23
PWR
VCCIO
E3
PWR
VDDQ
AJ24
PWR
VCCIO
E4
PWR
VDDQ
AR20
PWR
VCCIO
G3
PWR
VDDQ
AR21
PWR
VCCIO
G4
PWR
VDDQ
AR22
PWR
VCCIO
J3
PWR
VDDQ
AR23
PWR
VCCIO
J4
PWR
VDDQ
AR24
PWR
VCCIO
J7
PWR
VDDQ
AU19
PWR
Dir.
VCCIO
J8
PWR
VDDQ
AU23
PWR
VCCIO
L3
PWR
VDDQ
AU27
PWR
VCCIO
L4
PWR
VDDQ
AU31
PWR
VCCIO
L7
PWR
VDDQ
AV21
PWR
VCCIO
M13
PWR
VDDQ
AV24
PWR
VCCIO
N3
PWR
VDDQ
AV25
PWR
VCCIO
N4
PWR
VDDQ
AV29
PWR
VCCIO
N7
PWR
VDDQ
AV33
PWR
VCCIO
R3
PWR
VDDQ
AW31
PWR
VCCIO
R4
PWR
VDDQ
AY23
PWR
VCCIO
R7
PWR
VDDQ
AY26
PWR
VCCIO
U3
PWR
VDDQ
AY28
PWR
VCCIO
U4
PWR
VIDALERT#
A37
CMOS
I
VCCIO
U7
PWR
VIDSCLK
C37
CMOS
O
I/O
VCCIO
V8
PWR
VIDSOUT
B37
CMOS
VCCIO
W3
PWR
VSS
A17
GND
VCCIO_SEL
P33
N/A
O
VSS
A23
GND
VCCIO_SENSE
AB4
Analog
O
VSS
A26
GND
AK11
PWR
VSS
A29
GND
VCCPLL
102
Processor Pin List by Pin
Name
Datasheet, Volume 1
Processor Pin and Signal Information
Table 8-1.
Pin Name
Processor Pin List by Pin
Name
Table 8-1.
Pin #
Buffer Type
Pin #
Buffer Type
VSS
A35
GND
VSS
AJ25
GND
VSS
AA33
GND
VSS
AJ27
GND
VSS
AA34
GND
VSS
AJ36
GND
VSS
AA35
GND
VSS
AJ5
GND
VSS
AA36
GND
VSS
AK1
GND
VSS
AA37
GND
VSS
AK10
GND
VSS
AA38
GND
VSS
AK13
GND
VSS
AA6
GND
VSS
AK14
GND
VSS
AB5
GND
VSS
AK16
GND
VSS
AC1
GND
VSS
AK22
GND
VSS
AC6
GND
VSS
AK28
GND
VSS
AD33
GND
VSS
AK31
GND
VSS
AD36
GND
VSS
AK32
GND
VSS
AD38
GND
VSS
AK33
GND
VSS
AD39
GND
VSS
AK34
GND
VSS
AD40
GND
VSS
AK35
GND
VSS
AD5
GND
VSS
AK36
GND
VSS
AD8
GND
VSS
AK37
GND
VSS
AE3
GND
VSS
AK4
GND
VSS
AE33
GND
VSS
AK40
GND
VSS
AE36
GND
VSS
AK5
GND
VSS
AF1
GND
VSS
AK6
GND
VSS
AF34
GND
VSS
AK7
GND
VSS
AF36
GND
VSS
AK8
GND
VSS
AF37
GND
VSS
AK9
GND
VSS
AF40
GND
VSS
AL11
GND
VSS
AF5
GND
VSS
AL14
GND
VSS
AF6
GND
VSS
AL17
GND
VSS
AF7
GND
VSS
AL19
GND
VSS
AG36
GND
VSS
AL24
GND
VSS
AH2
GND
VSS
AL27
GND
VSS
AH3
GND
VSS
AL30
GND
VSS
AH33
GND
VSS
AL36
GND
VSS
AH36
GND
VSS
AL5
GND
VSS
AH37
GND
VSS
AM1
GND
VSS
AH38
GND
VSS
AM11
GND
VSS
AH39
GND
VSS
AM14
GND
VSS
AH40
GND
VSS
AM17
GND
VSS
AH5
GND
VSS
AM2
GND
VSS
AH8
GND
VSS
AM21
GND
VSS
AJ12
GND
VSS
AM23
GND
VSS
AJ15
GND
VSS
AM25
GND
VSS
AJ18
GND
VSS
AM27
GND
VSS
AJ21
GND
VSS
AM3
GND
Datasheet, Volume 1
Dir.
Pin Name
Processor Pin List by Pin
Name
Dir.
103
Processor Pin and Signal Information
Table 8-1.
Pin Name
104
Processor Pin List by Pin
Name
Table 8-1.
Dir.
Pin Name
Processor Pin List by Pin
Name
Pin #
Buffer Type
Pin #
Buffer Type
VSS
AM30
GND
VSS
AR18
GND
VSS
AM36
GND
VSS
AR19
GND
VSS
AM37
GND
VSS
AR27
GND
VSS
AM38
GND
VSS
AR30
GND
VSS
AM39
GND
VSS
AR36
GND
VSS
AM4
GND
VSS
AR5
GND
VSS
AM40
GND
VSS
AT1
GND
VSS
AM5
GND
VSS
AT10
GND
VSS
AN10
GND
VSS
AT12
GND
VSS
AN11
GND
VSS
AT13
GND
VSS
AN14
GND
VSS
AT15
GND
VSS
AN17
GND
VSS
AT16
GND
VSS
AN19
GND
VSS
AT17
GND
VSS
AN22
GND
VSS
AT2
GND
VSS
AN24
GND
VSS
AT25
GND
VSS
AN27
GND
VSS
AT27
GND
VSS
AN30
GND
VSS
AT28
GND
VSS
AN31
GND
VSS
AT29
GND
VSS
AN32
GND
VSS
AT3
GND
VSS
AN33
GND
VSS
AT30
GND
VSS
AN34
GND
VSS
AT31
GND
VSS
AN35
GND
VSS
AT32
GND
VSS
AN36
GND
VSS
AT33
GND
VSS
AN5
GND
VSS
AT34
GND
VSS
AN6
GND
VSS
AT35
GND
VSS
AN7
GND
VSS
AT36
GND
VSS
AN8
GND
VSS
AT37
GND
VSS
AN9
GND
VSS
AT38
GND
VSS
AP1
GND
VSS
AT39
GND
VSS
AP11
GND
VSS
AT4
GND
VSS
AP14
GND
VSS
AT40
GND
VSS
AP17
GND
VSS
AT5
GND
VSS
AP22
GND
VSS
AT6
GND
VSS
AP25
GND
VSS
AT7
GND
VSS
AP27
GND
VSS
AT8
GND
VSS
AP30
GND
VSS
AT9
GND
VSS
AP36
GND
VSS
AU1
GND
VSS
AP37
GND
VSS
AU15
GND
VSS
AP4
GND
VSS
AU26
GND
VSS
AP40
GND
VSS
AU34
GND
VSS
AP5
GND
VSS
AU4
GND
VSS
AR11
GND
VSS
AU6
GND
VSS
AR14
GND
VSS
AU8
GND
VSS
AR17
GND
VSS
AV10
GND
Dir.
Datasheet, Volume 1
Processor Pin and Signal Information
Table 8-1.
Pin Name
Processor Pin List by Pin
Name
Table 8-1.
Pin #
Buffer Type
Pin #
Buffer Type
VSS
AV11
GND
VSS
D20
GND
VSS
AV14
GND
VSS
D23
GND
VSS
AV17
GND
VSS
D26
GND
VSS
AV3
GND
VSS
D29
GND
VSS
AV35
GND
VSS
D32
GND
VSS
AV38
GND
VSS
D37
GND
VSS
AV6
GND
VSS
D39
GND
VSS
AW10
GND
VSS
D4
GND
VSS
AW11
GND
VSS
D5
GND
VSS
AW14
GND
VSS
D9
GND
VSS
AW16
GND
VSS
E11
GND
VSS
AW36
GND
VSS
E12
GND
VSS
AW6
GND
VSS
E17
GND
VSS
AY11
GND
VSS
E20
GND
VSS
AY14
GND
VSS
E23
GND
VSS
AY18
GND
VSS
E26
GND
VSS
AY35
GND
VSS
E29
GND
VSS
AY4
GND
VSS
E32
GND
VSS
AY6
GND
VSS
E36
GND
VSS
AY8
GND
VSS
E7
GND
VSS
B10
GND
VSS
E8
GND
VSS
B13
GND
VSS
F1
GND
VSS
B14
GND
VSS
F10
GND
VSS
B17
GND
VSS
F13
GND
VSS
B23
GND
VSS
F14
GND
VSS
B26
GND
VSS
F17
GND
VSS
B29
GND
VSS
F2
GND
VSS
B32
GND
VSS
F20
GND
VSS
B35
GND
VSS
F23
GND
VSS
B38
GND
VSS
F26
GND
VSS
B6
GND
VSS
F29
GND
VSS
C11
GND
VSS
F35
GND
VSS
C12
GND
VSS
F37
GND
VSS
C17
GND
VSS
F39
GND
VSS
C20
GND
VSS
F5
GND
VSS
C23
GND
VSS
F6
GND
VSS
C26
GND
VSS
F9
GND
VSS
C29
GND
VSS
G11
GND
VSS
C32
GND
VSS
G12
GND
VSS
C35
GND
VSS
G17
GND
VSS
C7
GND
VSS
G20
GND
VSS
C8
GND
VSS
G23
GND
VSS
D17
GND
VSS
G26
GND
VSS
D2
GND
VSS
G29
GND
Datasheet, Volume 1
Dir.
Pin Name
Processor Pin List by Pin
Name
Dir.
105
Processor Pin and Signal Information
Table 8-1.
Pin Name
106
Processor Pin List by Pin
Name
Table 8-1.
Dir.
Pin Name
Processor Pin List by Pin
Name
Pin #
Buffer Type
Pin #
Buffer Type
VSS
G34
GND
VSS
L26
GND
VSS
G7
GND
VSS
L29
GND
VSS
G8
GND
VSS
L8
GND
VSS
H1
GND
VSS
M1
GND
VSS
H17
GND
VSS
M17
GND
VSS
H2
GND
VSS
M2
GND
VSS
H20
GND
VSS
M20
GND
VSS
H23
GND
VSS
M23
GND
VSS
H26
GND
VSS
M26
GND
VSS
H29
GND
VSS
M29
GND
VSS
H33
GND
VSS
M33
GND
VSS
H35
GND
VSS
M35
GND
VSS
H37
GND
VSS
M37
GND
VSS
H39
GND
VSS
M39
GND
VSS
H5
GND
VSS
M5
GND
VSS
H6
GND
VSS
M6
GND
VSS
H9
GND
VSS
M9
GND
VSS
J11
GND
VSS
N8
GND
VSS
J17
GND
VSS
P1
GND
VSS
J20
GND
VSS
P2
GND
VSS
J23
GND
VSS
P36
GND
VSS
J26
GND
VSS
P38
GND
VSS
J29
GND
VSS
P40
GND
VSS
J32
GND
VSS
P5
GND
VSS
K1
GND
VSS
P6
GND
VSS
K12
GND
VSS
R33
GND
VSS
K13
GND
VSS
R35
GND
VSS
K14
GND
VSS
R37
GND
VSS
K17
GND
VSS
R39
GND
VSS
K2
GND
VSS
R8
GND
VSS
K20
GND
VSS
T1
GND
VSS
K23
GND
VSS
T5
GND
VSS
K26
GND
VSS
T6
GND
VSS
K29
GND
VSS
U8
GND
VSS
K33
GND
VSS
V1
GND
VSS
K35
GND
VSS
V2
GND
VSS
K37
GND
VSS
V33
GND
VSS
K39
GND
VSS
V34
GND
VSS
K5
GND
VSS
V35
GND
VSS
K6
GND
VSS
V36
GND
VSS
L10
GND
VSS
V37
GND
VSS
L17
GND
VSS
V38
GND
VSS
L20
GND
VSS
V39
GND
VSS
L23
GND
VSS
V40
GND
Dir.
Datasheet, Volume 1
Processor Pin and Signal Information
Table 8-1.
Pin Name
Processor Pin List by Pin
Name
Pin #
Buffer Type
VSS
V5
GND
VSS
W6
GND
VSS
Y5
GND
VSS
Y8
GND
VSS_NCTF
A4
GND
VSS_NCTF
AV39
GND
VSS_NCTF
AY37
GND
VSS_NCTF
Dir.
B3
GND
VSS_SENSE
B36
Analog
O
VSSAXG_SENSE
M32
Analog
O
VSSIO_SENSE
AB3
Analog
O
§§
Datasheet, Volume 1
107
Processor Pin and Signal Information
108
Datasheet, Volume 1
DDR Data Swizzling
9
DDR Data Swizzling
To achieve better memory performance and better memory timing, Intel design
performed the DDR Data pin swizzling that will allow a better use of the product across
different platforms. Swizzling has no effect on functional operation and is invisible to
the OS/SW.
However, during debug, swizzling needs to be taken into consideration. This chapter
presents swizzling data. When placing a DIMM logic analyzer, the design engineer must
pay attention to the swizzling table to perform an efficient memory debug.
Datasheet, Volume 1
109
DDR Data Swizzling
Table 9-1.
Pin Name
110
DDR Data Swizzling
Table – Channel A
Pin #
MC Pin Name
SA_DQ[0]
AJ3
DQ01
SA_DQ[1]
AJ4
DQ02
SA_DQ[2]
AL3
SA_DQ[3]
AL4
SA_DQ[4]
SA_DQ[5]
Table 9-1.
Pin Name
DDR Data Swizzling
Table – Channel A
Pin #
MC Pin Name
SA_DQ[41]
AR37
DQ42
SA_DQ[42]
AN38
DQ44
DQ07
SA_DQ[43]
AN37
DQ45
DQ06
SA_DQ[44]
AR39
DQ41
AJ2
DQ03
SA_DQ[45]
AR38
DQ40
AJ1
DQ00
SA_DQ[46]
AN39
DQ46
SA_DQ[6]
AL2
DQ05
SA_DQ[47]
AN40
DQ47
SA_DQ[7]
AL1
DQ04
SA_DQ[48]
AL40
DQ51
SA_DQ[8]
AN1
DQ08
SA_DQ[49]
AL37
DQ48
SA_DQ[9]
AN4
DQ11
SA_DQ[50]
AJ38
DQ52
SA_DQ[10]
AR3
DQ14
SA_DQ[51]
AJ37
DQ53
SA_DQ[11]
AR4
DQ15
SA_DQ[52]
AL39
DQ49
SA_DQ[12]
AN2
DQ09
SA_DQ[53]
AL38
DQ50
SA_DQ[13]
AN3
DQ10
SA_DQ[54]
AJ39
DQ54
SA_DQ[14]
AR2
DQ13
SA_DQ[55]
AJ40
DQ55
SA_DQ[15]
AR1
DQ12
SA_DQ[56]
AG40
DQ58
SA_DQ[16]
AV2
DQ18
SA_DQ[57]
AG37
DQ56
SA_DQ[17]
AW3
DQ19
SA_DQ[58]
AE38
DQ60
SA_DQ[18]
AV5
DQ22
SA_DQ[59]
AE37
DQ61
SA_DQ[19]
AW5
DQ20
SA_DQ[60]
AG39
DQ57
SA_DQ[20]
AU2
DQ16
SA_DQ[61]
AG38
DQ59
SA_DQ[21]
AU3
DQ17
SA_DQ[62]
AE39
DQ63
SA_DQ[22]
AU5
DQ21
SA_DQ[63]
AE40
DQ62
SA_DQ[23]
AY5
DQ23
SA_DQ[24]
AY7
DQ27
SA_DQ[25]
AU7
DQ25
SA_DQ[26]
AV9
DQ28
SA_DQ[27]
AU9
DQ29
SA_DQ[28]
AV7
DQ24
SA_DQ[29]
AW7
DQ26
SA_DQ[30]
AW9
DQ30
SA_DQ[31]
AY9
DQ31
SA_DQ[32]
AU35
DQ35
SA_DQ[33]
AW37
DQ34
SA_DQ[34]
AU39
DQ38
SA_DQ[35]
AU36
DQ39
SA_DQ[36]
AW35
DQ33
SA_DQ[37]
AY36
DQ32
SA_DQ[38]
AU38
DQ36
SA_DQ[39]
AU37
DQ37
SA_DQ[40]
AR40
DQ43
Datasheet, Volume 1
DDR Data Swizzling
Table 9-2.
Pin Name
DDR Data Swizzling
Table – Channel B
Table 9-2.
Pin Name
DDR Data Swizzling
Table – Channel B
Pin #
MC Pin Name
Pin #
MC Pin Name
SB_DQ[0]
AG7
DQ03
SB_DQ[1]
AG8
DQ02
SB_DQ[41]
AP31
DQ43
SB_DQ[42]
AP35
DQ45
SB_DQ[2]
AJ9
DQ05
SB_DQ[43]
AP34
DQ46
SB_DQ[3]
AJ8
DQ04
SB_DQ[44]
AR32
DQ40
SB_DQ[4]
AG5
DQ00
SB_DQ[45]
AR31
DQ42
SB_DQ[5]
AG6
DQ01
SB_DQ[46]
AR35
DQ47
SB_DQ[6]
AJ6
DQ06
SB_DQ[47]
AR34
DQ41
SB_DQ[7]
AJ7
DQ07
SB_DQ[48]
AM32
DQ51
SB_DQ[8]
AL7
DQ11
SB_DQ[49]
AM31
DQ48
SB_DQ[9]
AM7
DQ10
SB_DQ[50]
AL35
DQ53
SB_DQ[10]
AM10
DQ14
SB_DQ[51]
AL32
DQ50
SB_DQ[11]
AL10
DQ13
SB_DQ[52]
AM34
DQ52
SB_DQ[12]
AL6
DQ08
SB_DQ[53]
AL31
DQ49
SB_DQ[13]
AM6
DQ09
SB_DQ[54]
AM35
DQ54
SB_DQ[14]
AL9
DQ12
SB_DQ[55]
AL34
DQ55
SB_DQ[15]
AM9
DQ15
SB_DQ[56]
AH35
DQ59
SB_DQ[16]
AP7
DQ19
SB_DQ[57]
AH34
DQ58
SB_DQ[17]
AR7
DQ18
SB_DQ[58]
AE34
DQ61
SB_DQ[18]
AP10
DQ21
SB_DQ[59]
AE35
DQ62
SB_DQ[19]
AR10
DQ22
SB_DQ[60]
AJ35
DQ57
SB_DQ[20]
AP6
DQ17
SB_DQ[61]
AJ34
DQ56
SB_DQ[21]
AR6
DQ16
SB_DQ[62]
AF33
DQ63
SB_DQ[63]
AF35
DQ60
SB_DQ[22]
AP9
DQ20
SB_DQ[23]
AR9
DQ23
SB_DQ[24]
AM12
DQ25
SB_DQ[25]
AM13
DQ30
SB_DQ[26]
AR13
DQ29
SB_DQ[27]
AP13
DQ28
SB_DQ[28]
AL12
DQ24
SB_DQ[29]
AL13
DQ31
SB_DQ[30]
AR12
DQ27
SB_DQ[31]
AP12
DQ26
SB_DQ[32]
AR28
DQ32
SB_DQ[33]
AR29
DQ34
SB_DQ[34]
AL28
DQ39
SB_DQ[35]
AL29
DQ37
SB_DQ[36]
AP28
DQ33
SB_DQ[37]
AP29
DQ35
SB_DQ[38]
AM28
DQ36
SB_DQ[39]
AM29
DQ38
SB_DQ[40]
AP32
DQ44
Datasheet, Volume 1
§§
111
DDR Data Swizzling
112
Datasheet, Volume 1