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Doc. Title
.
HTC Corporation.
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 1 of 91
AX02
Sapphire Service Manual
Sapphire
Service Manual
HTCUSA-200015
U
HTC Proprietary
Confidential Treatment Requested
Rev. AX02
HTC Corporation.
Engineering Mobility
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Doc. Title Sapphire Service Manual
REVISION CONTROL TABLE
REV
AX02
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Issued Date 2008/12/29
Revised Date 2009/01/14
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DATE CONTENTS DEPT REVISED STAGE
PSE Marc
2009/01/14 Add product picture at page 1 PSE Marc
DVT
HTCUSA-200015
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Doc. Title Sapphire Service Manual
1.
INTRODUCTION ....................................................................................................................................................................4
1.1
P RODUCT F EATURES .......................................................................................................................................................5
1.2
P RODUCT OVERVIEW
HTCUSA-200015
.......................................................................................................................................................7
2.
DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ................................................................................13
2.1
D ISASSEMBLING PROCEDURE ........................................................................................................................................13
2.2
A SSEMBLING PROCEDURE .............................................................................................................................................23
3.
ROM RE-FLASH PROCEDURE ........................................................................................................................................32
3.1
ROM UPGRADE THRU RUU (R E FLASH U PGRADE U TILITY ) ........................................................................................32
3.2
R OM I MAGE UPGRADE THRU SD CARD ..........................................................................................................................36
4.
DIAGNOSTIC PROGRAM ..................................................................................................................................................38
4.1
L IST OF D IAGNOSTIC / W IN CE T EST I TEMS ..................................................................................................................38
5.
POWER MEASUREMENT TEST ......................................................................................................................................51
5.1
M AIN BOARD LEAKAGE CURRENT T EST P ROCEDURE ...................................................................................................51
5.2
B ATTERY RUNDOWN TEST PROCEDURE .........................................................................................................................56
6.
COSMETIC INSPECTION CRITERIA...............................................................................................................................58
6.1
C LASSES DEFINITION OF INSPECTIVE AREA ...................................................................................................................58
6.2
D ISPLAY INSPECTION .....................................................................................................................................................59
6.3
M AIN UNIT INSPECTION ..................................................................................................................................................61
7.
GENERIC TROUBLESHOOTING .....................................................................................................................................62
8.
GENERIC LABELING PLAN..............................................................................................................................................67
9.
GENERIC SPARE PART LIST AND PHOTOS................................................................................................................83
9.1
SPL FOR R EPAIR ...........................................................................................................................................................83
9.2
B OARD L EVEL 2.5
R EPAIRS ...........................................................................................................................................85
9.3
FRU M/B ADDITIONAL PARTS LOCATION ........................................................................................................................89
10.
RF ANTENNA SPECIFICATION ...................................................................................................................................90
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Sapphire Service Manual
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This manual provides the technical information to support the service activities of this product.
HTCUSA-200015
This document contains highly confidential information, so any or all of this document should not be revealed to any third party.
z Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After reading this chapter, you will know what feature the product has and basic hardware operation. Also you will know how to perform soft-rest and hard-rest in this chapter. z Chapter 2: Device Disassembling and Assembling Procedure- After reading this chapter, you will learn how to disassemble and assemble the product. Also, you will know what tools to use and the torque. Please follow the instruction to disassemble the unit to prevent from damaging the unit. z Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of enter the boot loader mode. z Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn z How to use the diagnostic program to perform unit function test z How to test some functions in Windows Mobile mode (ex. WLAN, Bluetooth, and
USB etc…) z Chapter 5: Power measurement test- After reading this chapter, you will learn how to use MB leakage test procedure and battery run-down test (Battery Capacity Measurement). z Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the appearance quality inspection criteria, ex. Display, bezel, and housing etc… z Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do generic trouble-shooting. z Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex.
Regulation label, and battery label etc… z Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference list and photos for repairing, including unit and Board level. z Chapter 10: RF Antenna Specification- Reference Spec for RF test.
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1.1
Product Features
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HTCUSA-200015
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Doc. Title
Product overview
Sapphire Service Manual
z Front side z Accessories
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HTCUSA-200015
#
1
2
ITEM
AC ADAPTER
USB SYNC CABLE
FUNCTION
RECHARGES THE BATTERY.
CONNECTS TO A PC AND SYNCHRONISES
DATA.
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Doc. Title Sapphire Service Manual
z Install the SIM card
1. Make sure your device is turned off.
2. Press the back cover latch down and gently slide the back cover towards yourself. Once the back cover pops out, remove it by lifting it up from the bottom end. HTCUSA-200015
3. If you have installed the battery, remove it by lifting it up from the bottom end.
4. Insert the SIM card into the slot with its gold contacts facing down and its cut-off corner facing toward outside of the slot.
5. Install the battery by inserting it with its exposed copper part aligned with the protruding copper conductor on the upper right side of the battery compartment. Insert the upper part of the battery first, then gently push the battery into place.
6. Replace the back cover by gently sliding back in until it snaps in place.
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z Install the SD card
If you need more storage for your device, you can install an SD card into the slot on the upper part of the device. To install the SD card, gently insert the card into the slot (with its gold contacts facing down) until it snaps in place.
To remove the SD card, make sure that no application is accessing the card. Press the card to pop it out slightly and gently pull the card out of the slot.
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HTCUSA-200015
z Charge the battery
New batteries are shipped partially charged. Before you start using your device, you have to install and charge the battery. Some batteries perform best after several full charge/discharge cycles. You can charge the battery in two ways:
• Connect your device directly to an electrical outlet using the AC adapter.
• Plug the sync cable to the USB port on your PC and to the sync connector on your device.
When your device is turned off, charging is indicated by a solid amber light on the LED indicator.
When your device is turned on, charging is indicated by a solid amber light on the LED indicator as well as a charging icon ( ) on the Today screen.
After the battery has been fully charged, the LED indicator becomes green and a full battery icon
( ) appears on the Today screen.
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z To perform a soft reset
• Use the stylus to press the RESET button found on the back of the device. Your device restarts and displays the Today screen.
HTCUSA-200015
z To perform a hard reset
Warning! Your device will be set back to factory default settings. Please ensure any additional installed programs and/or user data have been backed up before a hard reset is performed.
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Doc. Title Sapphire Service Manual
2 Device Disassembling and Assembling Procedure
2.1 Disassembling procedure
HTCUSA-200015
1.
P
HILLIPS SCREW
-
DRIVER
00
X
50
2.
F LAT PLASTIC STICK
(P/N:RTT-00006)
3.
C LEANING CLOTH
4.
P LASTIC TWEEZERS
5.
ESD WRIST STRAP .
1. Remove the battery cover
2. Remove the battery
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HTCUSA-200015
3. Unfasten the screws at the location indicated.
4. Remove the antenna by inserting the plastic stick in to the gap
5. Use the flat plastic stick to slide through the gap between keyboard upper cover and keyboard bottom cover.
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HTCUSA-200015
6. Disassemble speaker from keyboard bottom cover.
7. Unfasten the screws at the location indicated
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HTCUSA-200015 connector from the Main board.
9. Disconnect the Vibrator cable
10. Disconnect the FPC connector from the Upper board.
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HTCUSA-200015 location indicated
12. Turn over the upper board.
13. Disassemble the cable.
FPC from Rigid-Flex board.
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HTCUSA-200015
15. Remove the volume FPC from the chassis
16. Disassemble the camera module from the upper board.
17. Disconnect the AP key FPC connector
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HTCUSA-200015
18.
19.
Disconnect the Rigid-Flex board connector form the
Main board as shown.(1)
Use the white stick to separate it
20. Unfasten the screws at location indicated (blue)
21. Disconnect the Main FPC from Main board and remove it
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HTCUSA-200015
22. Remove the Main Board from Chassis
23. Unplug the cable from the
Main Board.
24.
25.
Remove the Mylar
Release the hook from the
Main Board to separate the switch
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HTCUSA-200015
26. Remove the Microphone
Rubber
27. Remove Receiver from
Chassis.
28. Remove the AP key FPC from Chassis as shown.
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HTCUSA-200015
29. Start from the top two corners and Press LCM along the two sides of it to separate the LCM.
30. Disassembly Completed
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2.2 Assembling procedure
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HTCUSA-200015
1. Remove the protect film on the LCM and
Combine it will Bezel.
2. Attach the receiver to
Chassis.
3.
4.
Insert the switch hook into the Main Board
Stick Mylar on the hook as shown.
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HTCUSA-200015
5. Remove the release paper and stick AP key
FPC on the Chassis as shown
6. Connect the cable with the Main board
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Main Board
8. Fasten the screws at the location indicated
Screw:72H01266-01M*2
T ORQUE : 1.0+-0.1
KGF C
㎡
9. Connect Main FPC with
MB
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HTCUSA-200015
10. Stick the copper foil as location indicated
11. Stick the Rigid-Flex
Board on the Main Board
12. Combine the Rigid-Flex board with Main board and stick Rigid-Flex at the location indicated
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HTCUSA-200015 module on the Upper board
14. Connect the cable
15. Insert the volume FPC into the connector on the upper board.
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HTCUSA-200015
16. Attach the Volume FPC to the Chassis
17. Combine Main FPC upper board as show
18. Fasten the screws at the location indicated
Screw: 72H01266-01M
Torque : 1.0+-0.1kgf-c ㎡
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HTCUSA-200015
19. Insert vibrator as shown
20. Combine LCM FPC with
Main-Board as shown.
21. Fasten two screws as shown
Screw: 72H01266-00M
Torque : 0.8+-0.1kgf-c ㎡
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22. Attach the speaker to the
Housing.
23. Combine Housing with
Bezel
24. Combine the antenna with Housing as shown
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HTCUSA-200015
25. Fasten the screw as location indicated
Torque : 1.0+-0.1kgf-c ㎡
26. Insert battery into housing.
27. Assemble the Battery
Cover
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Connect device to PC
I. Setting and allow USB connections in Microsoft ActiveSync.
II. Connect your device and desktop/ or laptop via USB cable.
III. Check the pop-up message from
Microsoft ActiveSync when device is synchronized with PC.
Download ROM Image from SDO
I. Download OS image from SDO. http://htcscm10.htc.com.tw/SDO
II. Un-zip the file and execute RUU program.
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RUU - 1
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HTCUSA-200015
III. Read the pop-up message form
ROM update utility and select the “I understand…” checkbox.
IV. Click “Next” to proceed.
RUU - 2
V. Read the pop-up message form
ROM update utility to follow and perform the instructions and select the “I completed…” checkbox.
VI. Click “Next” to proceed.
RUU - 3
VII. Current image version confirmation.
VIII. Click “Update” to proceed.
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RUU - 4
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HTCUSA-200015
IX. Double verify the ROM revision which you want to update before re-flash procedure.
X. Click “Next” to proceed.
RUU - 5
XI. Read the information from pop-up message and the OS update procedure will takes 10 minutes long.
XII. Click “Next” to proceed.
RUU - 6
XIII. You can see the update progress from your PC and in your device.
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RUU - 7
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XIV. The OS upgrade is finished, click
“Finish” to close the utility.
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3.2 Rom Image upgrade thru SD card
Download ROM Image from SDO
HTCUSA-200015
I. Download ROM image from SDO. http://htcscm10.htc.com.tw
/SDO
II. Un-zip the image file.
Format SD card and copy image file to SD card
III. Select file system and format the SD card to
FAT32 mode.
IV. Copy image file sappIMG.nbh to the micro SD card and rename to
SAPPIMG.NBH.
V. Turn the device power off and insert Diagnostic
SD card.
VI. Hold Volume down and press the power button to entry Boot loader mode.
VII. Press button to start upgrade procedure.
SD Upgrade - 1
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SD Upgrade - 2
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VIII. Reading source code from SD card.
[Note]: This process will
IX. takes 10 mins, please don’t power off the device.
After finish, press
Action button to reboot.
HTCUSA-200015
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4.1 List of Diagnostic / WinCE Test Items
HTCUSA-200015
Mode No Item
Function Test
Description Remark
1 Auto
2 SDRAM Test
3 Display Test
Auto Regular Tests (SD card, Vibrator, Display, B.L, etc…)
RAM memory test.
Color bar/R/G/B/Black/White/Gray pattern.
5 LED Test
6 Back Light Test
7 Touch Test
Send, Home, Return, End(Power), Menu, Volume up,
Volume down, Up, Down, Left, Right, Action.
Red, Green, Blue, UI, Key Led
Back light test Level (0/1/2/3/4)
Touch panel test
8 Vibrator Test
9 SD Card Test
10 ROM Checksum
Vibrator on test.
SD door test, SD card Read/Write test.
ROM checksum
SIM card test 11 SIM Test
G-sensor
12
Headset, Receiver audio test 13 Audio Test
Run-in Test
1 1 Hour
2 2 Hours
1 Hour Run-in Test
2 Hours Run-in Test
Option
Option
Option
Option
3 4 Hours
4 8 Hours
Format Storage
Device Info
4 Hours Run-in Test
8 Hours Run-in Test
Check WLAN calibration status
Check SKU ID
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Calibration Test (Perform WLAN calibration)
Compass Test
Battery Test (1H)
Battery info.
1 USB Test
2 Camera Test
3 Bluetooth Test
USB link test
Camera test
Bluetooth test
4 GPS Test
5 WLAN Test
6 Speaker Test
GPS test
WLAN test
Speaker test
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Doc. Title Sapphire Service Manual
Test Procedure
How to select test item: Using navigation button -"Up" or "Down" to select the test items
How to execute the test program: Press “Action” button to start each of test items.
Diagnostic HTCUSA-200015
Main Menu/Function Test Menu
I. Turn the device power off and insert
Diagnostic SD card.
II. Press and hold Volume down button, then press Power button to enter Diagnostic mode.
III. Using the Vol_up or Vol_down button to select the test item. (Also you can press the hot key 0 ~ I to perform the test item)
IV. Select item “Function Test” to find the Function test menu.
Auto Test
I. Press the Action key to start the Auto test.
II. It will perform the regular tests, please follow the system instruction to do the test.
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SD card Test
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I. Insert the SD card and follow the system instruction to do the test.
II. If press Action key to next or return to Function test menu.
Vibrator Test
I. Press Action key to select Vibrator
Test on Function test menu.
II. Press Action key to next or return to
Function test menu.
Display Test (Color bar / Red pattern)
I. Press Action key to select Display
Test on Function test menu.
II. After the test pattern is show up, please check the pattern if any un-uniform color or chromatist.
III. Press Action key to continue the next test pattern.
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Display Test (Green / Blue pattern)
HTCUSA-200015
IV. Press Action key to continue the next test pattern.
Display Test ( Black / White pattern)
V. Press Action key to continue the next test pattern.
Display Test (Gray pattern)
VI. Press Action key to continue the next test pattern.
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LED Test
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HTCUSA-200015 instruction on screen to perform the
LED inspection test ( Green , Red , Blue ,
UI LED and Key LED) .
II. Press Action key to next or return to
Function test menu.
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Sliding Test
I. Press Action key to select Sliding Test on Function test menu.
II. Follow the instruction on screen to perform open and close the key pad.
III. The screen will go to the next test or return to Function test menu.
I.
Button Test
Press Action key to select Button
Test on Function test menu.
II. Follow the instruction on screen to perform the Button/Key test
(Volume up, Volume down, Menu, Send,
End, Home, Back, Up~ Right, Action,
Focus, Capture and Keyboard test) .
III. The screen will go to the next test or return to Function test menu.
Back Light Test
I. Press Action key to select Backlight
Test on Function test menu.
II. Press Action key to switch the LCD backlight level from Level 0, Level 1,
Level 2, Level3, Level 4.
III. The screen will go to the next test or return to Function test menu.
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Headset Audio Test
I. Press “B” key or select Headset Audio
Test on Function test menu.
II. Insert the headset and speaking.
III. You can hear the sound output from the headset.
IV. Press the action to exit the test.
Receiver Audio Test
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HTCUSA-200015
I. Press “C” key or select Receiver
Audio Test on Function test menu.
II. You can hear the sound output from the receiver.
III. Press the action to exit the test.
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Doc. Title
Android Test
- 3G SIM card
- Google account
HTC Corporation.
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Sapphire Service Manual
Sign in
I. Insert the 3G SIM card.
II. Signing in the Google account and enter to the system.
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HTCUSA-200015
III. Follow the test item of the service manual to perform the function test.
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USB Test
I. Select to use your memory card as USB mass storage when your phone is connected to your computer (selected by default or press Menu>Settings>SD card & phone storage>Use for USB storage)
II. Insert USB cable and connect device to computer then you can view and manage the
SD card storage from your computer.
Camera Test
I. Tap the application tab and press Camera icon to turn on the Camera.
II. Make sure the device will present and enter the preview display.
III. Check camera pre-view and image quality.
(1). Press Capture key.
(2). Press Capture key again.
(3). Tap 'Delete' icon on the preview screen.
Bluetooth Test (BT headset)
I. Press Menu button.
II. Tap the icon “Settings”.
III. Select Wireless controls, and then select the
Bluetooth check box to turn on Bluetooth services.
IV. To pair with a device in the list, select it.
V. Once the other Bluetooth device shows
“connected” status, you can start using it to make and receive phone calls.
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Sapphire Service Manual
GPS Test
I. Press Menu button and tap the icon
“Settings”.
II. Select “Security & location”.
III. Select My Location settings to “GPS satellites”.
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HTCUSA-200015
IV. Tap the application tab and press the Maps icon to enter to the Google Map.
V. Press Menu button and select “My Location”.
Note: The device should test at you can view of sky area or within connection extension antenna area.
VI. The screen should appear your location on the map.
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WLAN Test
I. Press Menu button and tap the icon
“Settings”.
II. Select “Wireless controls” > select the
“Mobile networks” > select “USE only 2G networks” check box.
III. Select “Wireless controls” > select the
“Wi-Fi” check box to turn on Wi-Fi services and open the “Wi-Fi settings” screen.
IV. View and scan for available network.
V. Connect to a network - Select it from the network list. (Provide your username or password if required.) And you can see the icon appear on the status bar when Wi-Fi service connected.
VI. Make sure the device can access to the internet via Wi-Fi network.
Speaker Test
I. Press Menu button and tap the icon
“Settings”.
II. Select “Sound & display” > select the “Phone ringtone”.
III. Select and play a ringtone then check the sound quality from the speaker.
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RF Test
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I. Press to dial for performs the RF test.
II. Also you can test by mobile tester.
Erase all test data
I. Before shipping you should erase all test data on the phone.
II. Press Menu button and tap the icon
“Settings”.
III. Select “SD card & phone storage” > Press the “Factory data reset” and press the “Reset phone” button.
IV. Also you can perform the hard reset when the device is power off.
V. Press and hold Home + Back Button then press Power Button .
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Power measurement test
Sapphire Service Manual
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4.2 Main board leakage current Test Procedure
This is a quick method to measure if any abnormal leakage current on main board which caused high power
HTCUSA-200015 consumption compare to GOOD main board.
Requirement：
- Power Supply
- Micro-current Meter
- Current series JIG
- CABLE
- Battery JIG
Equipment list
1.Control box
2. Four colors cables
Cable A: Red
Cable B: Yellow
Cable C: Green
Cable D: Black
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3. Test Jig HTCUSA-200015
Jig - E (3 pins-Long for Dream)
Equipment set up
Connect control box and jig through
4 colors cable
Set up each button by row A~D according to product specification
Following is an example for Sapphire
It means, press button A=0,B=8,C=X,D=0
(X=Don’t care, the Dream battery only 3 pins)
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HTCUSA-200015
Install the jig to device
Start testing
Turn on control box power button
Press power button to turn on the Device
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Idle current test
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HTCUSA-200015
1. Set the device to airplane mode.
2. Set the brightness to minimum(Press
MENU>Settings>Sound & display>Brightness)
Measure the idle mode current.
The idle current value must under 70
mA.
If out of the criteria, it means the devices is fail and please replace M/B or daughter board for repair.
Sleep current test
Power off the device and measure the sleep mode current.
The sleep current value must under 3
mA
.
If out of the criteria, it means the devices is fail and please replace M/B or daughter board for repair.
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Doc. Title Sapphire Service Manual
Conclusion:
If current consumption is passed at both of flight and power off mode, it means M/B is
GOOD.
M/B for repair.
Measurement parameter
Measurement mode Measured Current
Under mA
Flight Mode
(Idle mode)
Over 105 mA
POWER OFF
( Sleeping mode)
Under 3 mA
Over 3 mA
REMARK
MB is good
Fail, MB need to be further repaired
MB is good
Fail, MB need to be further repaired
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4.3 Battery rundown test procedure
Battery Test
I. Turn the device power off and insert Diagnostic SD card.
II. Press and hold Capture button, then press Power button to enter
Diagnostic mode.
III. Select item “Battery Info” to check the battery capacity.
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IV. If the battery has been fully charged, please perform the
“Battery Test”.
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V. After one hour, check the test result.
VI. If the capacity is under 70%, please replace a new battery.
HTCUSA-200015
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Doc. Title Sapphire Service Manual
5 Cosmetic Inspection Criteria
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5.1 Classes definition of inspective area
HTCUSA-200015
¾ Class A area => The front side of main unit involve all buttons and LED lens except LCD.
¾ Class C area => 4 sides and back views of main unit.
¾ Class D area => The socket of battery, inner side of battery cover.
Photo of inspection areas
CLASS A
CLASS C
CLASS D
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Doc. Title Sapphire Service Manual
HTCUSA-200015
WITH THESE GENERIC CRITERIONS; PLEASE FOLLOW THE PRODUCT INSPECTION CRITERIA
RESPECTIVELY.
Description
¾ D: Diameter / L: Length / W: Width / N: Number of defects/ S: Distance from dot to dot
¾ Inspecting distance: 30 ± 5cm / Mechanical inspection angle：90 degrees /
¾ LCM inspection angle：90±15 degrees / Inspection time:5 secs per surface.
¾ Ambient illumination is to be 500-1100 lux
¾ The inspection condition of Newton ring: a. Inspection distance: 30cm / Inspection time: 5 sec b. Ambient illumination is to be 500-1000 Lux (Incandescent lamp) c. Inspection should be performed under the condition that LCD screen could reflect the mirror image of lamp. d. The criteria of Newton ring’s tinges and measure of area must follow up the worst-case sample.
5.2 Display inspection
Inspection Defects Accept Level Level
Bright
Dots
Electrical Characteristic
Dark Dots
Defects
Single
2 adjacent
3 or more adjacent
Single
2 adjacent
Dark or Bright lines
Red+ Green+ Blue ≦ 3, S > 5mm.
0
Total Number ≦ 2, S > 5mm.
0
0
All Allowable Dots DefectsTotal Number ≦ 3, S > 5mm.
Minor
Minor
0 Minor
Minor
Minor
Minor
Minor
Foreign Scratch,
Objects or Lint on power off status
Shift and tilt of screen viewed area
The black edge around display area must be detected by front view.
Minor
Scratch
Lint (linear foreign objects)
0.03 < W ≦ 0.1 (mm)
L ≦ 5 (mm), N ≦ 2 (mm)
0.03 < W ≦ 0.1 (mm)
0.3 < L ≦ 3.0 (mm)
N ≦ 5
Minor
Minor
Spots
Fish eye on film
0.1 < D ≦ 0.3 (mm), N ≦ 4 Minor
0.1 < D ≦ 0.4 (mm), N
Breakage on film surface Not acceptable
Total acceptable defect quantity ≦ 10
≦ 4 Minor
Minor
Minor
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Sapphire Service Manual
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Doc. Title Sapphire Service Manual
5.3 Main unit inspection
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GAP & STEP INSPECTIONS
Description
1.
3.
Gap between ME parts.
2. Stylus
≦ 1.5 (mm)
Stylus assembly protruding, loose, missing, falling and deformed is not allowed.
Others, refer to production release spec
Others, refer to production release spec
OTHERS
Scratch
Class A
Class C
Exposure of substrate do not accept
Scratch : L≦4mm ,W≦0.2mm ,N≦2, S≧10mm
Label area don’t care
Exposure of substrate do not accept
Scratch : L≦10mm ,W≦0.4mm ,N≦5, S≧5mm
Contamination dot/Granule dot/Cave granule
MI
MI
Class A
Class C
Burr.
Class A
Class A
Class C
Class A
Class C
D≦0.5mm ,N≦2,S ≧15 mm (Ignored if D D≦ 0.15mm)
D<0.9mm ,N≦4,S ≧10 mm
Burr
MI
MI
Don’t accept hand scrape
Imprint mark
MI
0.25≦diameter≦0.65mm ,N≦3 MI
Bright mark
L≦2.5mm,W≦0.25mm,N≦3 MI
L≦3.0mm,W≦0.3mm,N≦5 MI
Lint
L≦3mm , W≦0.2mm ,N≦2, S ≧5 mm MI
L≦10mm , W≦0.3 mm ,N≦3 MI
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6 Generic Troubleshooting
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1．Main Unit Does Not Respond to Power Button
HTCUSA-200015
(1) Connect the AC adapter, maybe the battery pack is exhaust and wait few minutes for battery recharging.
(2) Check if battery installed well.
(3) Check the Power Button whether it’s damaged.
(4) Replace another battery pack.
(5) Try to start boot-loader mode [refer to section 4.2]. Re-flash ROM if boot loader mode is enabled.
(6) Check all connectors including LCD FPC to Main Board.
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.
2．Touch Panel Does Not Respond to Screen Tap
(1) Check the connection of LCM FPC cable whether is properly connected.
(2) Try to cold boot the unit then perform screen tap again.
(3) Try with another LCM.
(4) Try with another Main Board.
(5) Replace LCM if necessary
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.
3．Buttons Do Not Respond
(1) Try to cold boot the unit then tries again.
(2) Dismantle the unit; check the status of switches on the Main Board and the plastic parts of the Button not responding.
(3) Try with another Main Board or Front Bezel.
(4) Replace Main Board or Front Bezel if necessary.
(5) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.
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4．Unusual Vertical / Horizontal lines or partial display
(1) Check the connection of LCM FPC whether is properly connected.
(2) Try to cold boot the unit then tries again.
(3) Try to re-flash the ROM code.
(4) Try with another LCM.
HTCUSA-200015
(5) Try with another Main Board.
(6) Replace LCM if necessary
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
5．Back Light Does Not Turn ON/OFF
(1) Check the connection of LCM FPC whether is properly connected.
(2) Try to re-flash the ROM code.
(3) Try with another LCM.
(4) Try with another Main Board.
(5) Replace LCM if necessary
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
6．CF/SD Card cannot be used
(1) Check whether CF/SD Card is fully inserted to the slot until you hear a click.
(2) Try to re-flash the ROM code.
(3) Try with another CF/SD Card.
(4) Try with another Main Board.
(5) Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
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7．PC Connection not possible
(1) If test result is NFF, it is possible caused by user connect cradle to computer before ActiveSync is installed.
HTCUSA-200015
(2) Check whether “Connection Settings” in the MS ActiveSync is properly set.
(3) Check whether it connects with other cables or cradle, customer’s cable might be damaged.
(4) Check the external appearance of the connector on the unit whether it is physically damaged.
(5) Try to re-flash the ROM code.
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
8．Battery Pack does not start
(1) Make sure the battery cover is closed properly.
(2) Connect to the AC Adapter and see if it takes charge. Also check AC Adapter condition.
(3) Check whether AC Adapter is functioning properly.
(4) Check whether the condition of Battery Charging status is correct.
(5) Check the appearance of Battery Pack if any abnormal..
(6) Try with another Battery Pack or Replace Battery Pack if necessary
(7) Try with another Main Board or Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
9．Battery discharges quickly even after fully charged
(1) Make sure the Battery Pack takes fully charge with AC Adapter.
(2) Check whether the condition of Battery Charging status is correct.
(3) Dismantle the unit and check the appearance of Battery Pack.
(4) Try with another Battery Pack or Replace Battery Pack if necessary
(5) Try with another Main Board or Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
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10．Battery Pack does not recharge
(1) Make sure the Battery Pack takes fully charge with AC Adapter.
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(3) Dismantle the unit and check the appearance of Battery Pack.
(4) Try with another Battery Pack or Replace Battery Pack if necessary
(5) Try with another Main Board or Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
11．No Sound from Speaker or Distorted sound
(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling.
(2) Make sure it’s not MUTED.
(3) Try to re-flash the ROM code.
(4) Clean up the speaker connection side on MB if there is any contamination.
(5) Dismantle and Check whether the Speaker is properly installed (Orientation)
(6) Replace Speaker if necessary.
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
12．No Recorded Sound or Distorted sound
(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling.
(2) Make sure it’s not MUTED.
(3) Try to re-flash the ROM code.
(4) Dismantle and Check whether the Microphone is properly installed.
(5) Replace Microphone if necessary.
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.
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13．Wireless connection (WLAN/BT) not functioning
(1) Make sure the wireless environment is OK before connecting to WLAN.
(2) Make sure the wireless connection setting has properly set.
HTCUSA-200015
(3) Make a life connection with Internet or another device.
(4) Try to re-flash the ROM code.
(5) Try with another main board if necessary
(6) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.
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HTC Corporation.
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Doc. Title Sapphire Service Manual
7 Generic Labeling Plan
Main unit
7.1Agency label_SAPP100_Black
The brand name is shown on Bezel.
HTC P/N: 77H00693-00M
Size: 41.2 X 39.00mm
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HTC P/N Description
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Doc. Title Sapphire Service Manual
7.2 Agency label_SAPP100_Gray
The brand name is shown on Bezel.
HTC P/N: 77H00693-02M
Size: 41.2 X 39.00mm
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HTC P/N Description
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Doc. Title Sapphire Service Manual
7.3 Agency label_SAPP200_Black
The brand name is shown on Bezel.
HTC P/N: 77H00693-01M
Size: 41.2 X 39.00mm
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HTC P/N Description
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Doc. Title Sapphire Service Manual
7.4 Agency label_SAPP200_Gray
The brand name is shown on Bezel.
HTC P/N: 77H00693-03M
Size: 41. 2 X 39.00mm
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HTC P/N Description
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Doc. Title Sapphire Service Manual
7.5 Agency label_SAPP300_Black
The brand name is shown on Bezel.
HTC P/N: 77H00693-04M
Size: 41.2 X 39.00mm
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HTCUSA-200015
HTC P/N Description
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Doc. Title Sapphire Service Manual
7.6 Agency label_SAPP300_Gray
The brand name is shown on Bezel.
HTC P/N: 77H00693-05M
Size: 41.2 X 39.00mm
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 72 of 91
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HTCUSA-200015
HTC P/N Description
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.
HTC Corporation.
Doc. Title Sapphire Service Manual
7.7 Unit label location explanation
Water sensitive label
HTC P/N: 77H00668-00M
Qty: 1
Tamper evident label
HTC P/N: 77H00460-01M(Black) for Sapphire with black housing
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 73 of 91
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HTCUSA-200015
77H00460-01M(White) for Sapphire with white/gray housing
Qty: 1
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Doc. Title
7.8 Screen protector
Sapphire Service Manual
HTC P/N: 76H10040-00M
Size: 51.2 x 84.6mm
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 74 of 91
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.
Doc. Title
7.9 Battery label
Sapphire Service Manual
SAPP160_1340mAh_TWS
HTC P/N: 35H00119-00M (Black)
35H00119-04M (Gray)
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Issued Date 2008/12/29
Revised Date 2009/01/14
Page 75 of 91
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Doc. Title
HTC Corporation.
.
Sapphire Service Manual
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 76 of 91
AX02
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HTC Corporation.
.
Doc. Title Sapphire Service Manual
7.10 SAPP160_1340mAh_Welldone
HTC P/N: 35H00119-01M (Black)
35H00119-05M (Gray)
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 77 of 91
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Doc. Title
HTC Corporation.
.
Sapphire Service Manual
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 78 of 91
AX02
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Doc. No. DOC-00051810 REV.
HTC Corporation.
.
Doc. Title Sapphire Service Manual
7.11. MFG packing label single box label (not confirmed)
HTC P/N: 77Hxxxxx-xxM
Size: xx.0 x xx.0mm
HTC P/N Description
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 79 of 91
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.
Doc. Title Sapphire Service Manual
12 in 1 carton label (not confirmed)
HTC P/N: 77HXXXXX-00M
Size: 4 X 6 inches
HTC P/N Description
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
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HTC Corporation.
.
Doc. Title
pallet label
Sapphire Service Manual
HTC P/N: 77H30026-00M
Size: 4 X 6 inches
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 81 of 91
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HTC P/N Description
HTC CONFIDENTIAL
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HTC Corporation.
.
Doc. Title
Incomplete pallet label
Sapphire Service Manual
HTC P/N: 77H30026-00M
Size: 4 X 6 inches
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 82 of 91
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Doc. Title Sapphire Service Manual
8 Generic Spare Part List and Photos
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 83 of 91
AX02
Parts P/N and Photos for
RC/ASP to identify.
8.1 SPL for Repair
HTCUSA-200015
Qty Substitute Item P/N Description
1 35H00082-00M BATTERY_LI-POLYMER,1050mAh,3.7V,A94CA010F,SIMPLO,60/-20degC,54.1*39.7*5
.25mm
1
1
1
2 36H00486-00M Speaker,MERRY,DSH962-002
3 36H00523-00M Vibrator,JT0406-30CSR1,JNTECH,Cylindrical,3V,100mA,12000+/-3000 rpm,60/-20degC,11.2*5.1*5.8mm
4 36H00524-00M Receiver,DTR882-002,MERRY
5 51H00386-00M PCBA-MAIN BOARD,w/WIFI,Mega SIM,EU,VOX
6 51H10053-00M Rigid-Flex Board ASSY,VOX
7 54H00211-00M Camera Module,DCM-200MES,LITE-ON SEMICONDUCTOR,SOC2020 sensor,9*9*5.65mm,Vox
8 60H00087-00M TFT-LCD Module,TX06D10VM0AAA,HITACHI,59.3*42.6*2.25mm
9 71H01810-00M Cover,Battery,CHEW CHIENG,VOX
10 72H01548-00M Screw,POINT SCREW,KH-M16-L14-NI,Libra
11 72H01875-00M Shielding,Camera,JUN-YEN,Vox
12 72H01876-00M Screw,M1.6,KH,D2.5*3,NI+NYLOK
13 72H01889-00M EMI Gasket,LCD,CATERON,Vox
14 72H01892-00M Screw,PHK14*3.8,BLACK
15 72H01893-00M Screw,FPHM1.4-0.3*3.3(2.45,0.3),AISI-1018,BLACK
16 72H01894-00M Screw,HAMA NAKA SHOUKIN,PH M1.6,T6,3.2D*4L,Nickel(Silver)
1
1
2
4
4
1
1
8
1
1
1
1
1 54H00210-00M
NOTE:
THE PHOTO OF SPL IS GENERIC AND ONLY FOR REFERENCE, THE COLOR AND APPEARANCE MAY BE
DIFFERENT FROM THE SHIPPED PARTS, IF YOU WANT TO APPLY THOSE PARTS, PLEASE CONTACT
YOUR SERVICE ACCOUNT MANAGER FOR MORE INFORMATION.
AS FOR PICTURE, PLEASE REFER TO THE TABLE AS BELOW.
FOR REFURBISHMENT PARTS, THE TABLE IS FOR YOUR REFERENCE. YOU CAN DO THE
REFURBISHMENT ONLY WHEN YOUR SERVICE MODEL IS ALLOWED TO DO THE REFURBISHMENT.
HTC CONFIDENTIAL
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Doc. Title
Part No.
XXXXXXXXX-XXX
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
XXXXXXXXX-XXX
Description
Yes/No
Yes/No
Q'ty
Repair Code
Refurbishment
Return to HTC
Yes/No
Yes/No
Part No.
XXXXXXXXX-XXX
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Yes/No
Yes/No
Part No.
Description
XXXXXXXXX-XXX
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Yes/No
Yes/No
XXXXXXXXX-XXX
Description
HTC Corporation.
.
Sapphire Service Manual
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 84 of 91
AX02
Picture for SPL 80H Kernel and Accessories
(Part no on picture is for Generic version only, please check SPL for detail per customer)
Part No.
Description
XXXXXXXXX-XXX
HTCUSA-200015
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
XXXXXXXXX-XXX
Description
Yes/No
Yes/No
Q'ty
Repair Code
Refurbishment
Return to HTC
Yes/No
Yes/No
Part No.
XXXXXXXXX-XXX
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Yes/No
Yes/No
Part No.
Description
XXXXXXXXX-XXX
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Yes/No
Yes/No
XXXXXXXXX-XXX
Description
HTC CONFIDENTIAL
SM-TP008-1125
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.
HTC Corporation.
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 85 of 91
AX02
Doc. Title Sapphire Service Manual
8.2 Board Level 2.5 Repairs
Basic Repair Instructions for Component Replacement:
Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.
HTCUSA-200015
Warning：DO NOT overheat the tape and components to avoid the tape melted and the components damaged
Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the components.
Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components being removed
Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder and flux residues.
Notice:
A. Checking the polarity of CON8, and the position can't be shifted.
B. Checking the polarity of SW8、SW7, and it can't be reversed.
C. All the parts of the PCB should be checked if it is missing or not.
D. The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.
E. When you solder and repair that the soldering iron ,temperature must be setup 415 .
temperature range is 415 ℃ ±5 ℃ ),and the solder wire's diameter is 0.4/0.5/0.6mm
(SAC 305 (1.1%)
F. Please be noticed to follow below steps for main board repair which is equipped with Golden
Capacitor :
1. When replacing level 2.5 components located around the golden capacitor:
I. The temperature of the hot air blower must be under 400°c
II. When apply the hot air to the part / component, the heating time must be under 20 seconds (including the time of removing and soldering)
III. The temperature of the soldering iron must be under 350°c
IV. When apply the solder tip to the part / component, the heating time must be under 5 seconds
V. The solder tip must not contact with the golden capacitor
2. For BGA replacement: The golden capacitor must be removed before perform pre-heating, heating, soldering and de-soldering process, and then it must be replaced with a new one
(please refer to 1.c. and 1.d. steps)
3. For main board which failed to pass the function test, the golden capacitor must be replaced with a new one and must follow below soldering criteria: The temperature of the soldering iron must be under 350°c When apply the solder tip to the part / component, the heating time must be under 5 seconds The solder tip must not have a contact with the body of golden capacitor
HTC CONFIDENTIAL
SM-TP008-1125
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HTC Corporation.
.
Doc. Title Sapphire Service Manual
Item
¾
51HXXXXXXXX
PCBA-MAIN BOARD(Side A)
P/N Description
1 75H00248-00M
COAXIAL CONNECTOR,RF,WITH
SWITCH,SMD,MM8430-2600RA1,MURATA
2 75H00276-00P Connector RF,5.8*5.4*3.9,Female,MS-147(06),4pin,HRS
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 86 of 91
AX02
Qty Location Substitute
1 WCON_SW1
HTCUSA-200015
1 WECON1
3 75H00465-01M Connector I/O,Reverse,11P,0.4mm Pitch,MJE21-11K7P21,ACON 1 CON15
4 75H00615-00M
Connector
Others,90mohm,24P,0.9Pitch,0.5A,60V,CAM-F94M09,MITSUMI
1 CON2
5 75H00633-00M Connector,Battery,4Pin,2.5mmPitch,250042MB004G315ZR,SUYIN 1 PCON1
6 75H00636-00P
Connector B to B,80P,0.4Pitch,24 5801 080 002
829+,KYOCERA,Female,without position boss
1 CON6
SW1 SW2
7 36H00230-00M SWITCH,SOH-213HST,MITSUMI,70/-20degC 5
SW7
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HTC Corporation.
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Doc. Title Sapphire Service Manual
SIDE A PHOTO AND COMPONENT LOCATION
RFSW1
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 87 of 91
AX02
HTCUSA-200015
SW2
BCON1
SW13
CON5
PCON1
PCG1
CON9
CON1
SW5
AMIC1
CON3 SW3
PF1
HTC CONFIDENTIAL
SM-TP008-1125
2/10/2009 9:51:19 PM
HTC Corporation.
.
Doc. Title Sapphire Service Manual
51HXXXXXXXXX
PCBA-MAIN BOARD(Side B)
Item P/N Description
1 75H00248-00M
COAXIAL CONNECTOR,RF,WITH
SWITCH,SMD,MM8430-2600RA1,MURATA
2 75H00276-00P Connector RF,5.8*5.4*3.9,Female,MS-147(06),4pin,HRS
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 88 of 91
AX02
Qty Location Substitute
HTCUSA-200015
1 WCON_SW1
1 WECON1
3 75H00465-01M Connector I/O,Reverse,11P,0.4mm Pitch,MJE21-11K7P21,ACON 1 CON15
SIDE B PHOTO AND
SW1
SW7
CON8
SW8
CON SW1
COMPONENT LOCATION
HTC CONFIDENTIAL
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HTC Corporation.
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 89 of 91
AX02
Doc. Title Sapphire Service Manual
8.3 FRU M/B additional parts location
This chapter is about locations and P/N of additional parts (Mylar, Gasket, tape, etc…) for MB.
HTCUSA-200015
HTC CONFIDENTIAL
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HTC Corporation.
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 90 of 91
AX02
Doc. Title Sapphire Service Manual
9
RF Antenna Specification
Item Test Name
Sapphire WCDMA Antenna Test Specification
HTCUSA-200015
TX Level
Uplink / Downlink 1st Downlink note
UA RF CN cell power
1
Camp@ W-CDMA
Band ( 2100 )
2 BS Originate Cell
3 9613 / 10563 -60
-60
3 Fast Bit Error Rate
4 Fast Bit Error Rate
5 Fast Bit Error Rate
3 9613 / 10563
Receiver Test
3 9613 / 10563
3 9750 / 10700
3 9887 / 10837
-104
-104 <= 0.1 %
-104
8 TX Power
6 TX Power
7 TX Power
8 TX Power
Transmitter Test
3 9613 / 10563
3 9750 / 10700
3 9887 / 10837
-60
-60 >= 18 dbm
-60
Item Test Name
Sapphire WCDMA Antenna Test Specification
Uplink / Downlink
TX Level
1st Downlink
UA RF CN cell power note
1
Camp@ W-CDMA
Band ( 900 )
2 BS Originate Cell
3 2712 / 2937
3 2712 / 2937
Receiver Test
-60
-60
3 Fast Bit Error Rate
4 Fast Bit Error Rate
5 Fast Bit Error Rate
6 TX Power
7 TX Power
3 2712 / 2937
3 2788 / 3013
3 2863 / 3088
Transmitter Test
3 2712 / 2937
3 2788 / 3013
3 2863 / 3088
-104
-104 <= 0.1 %
-104
-60
-60
-60
>= 18 dbm
Sapphire GSM Antenna Test Specification
HTC CONFIDENTIAL
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HTC Corporation.
Doc. No. DOC-00051810 REV.
Issued Date 2008/12/29
Revised Date 2009/01/14
Page 91 of 91
AX02
Doc. Title
Item Test Name
1 Wait_Signal
2 Power_Class
3 Fast Bit Error Rate
4 Fast Bit Error Rate
5 Fast Bit Error Rate
6 TX Power
7 TX Power
8 TX Power
9 Fast Bit Error Rate
10 Fast Bit Error Rate
11 Fast Bit Error Rate
12 TX Power
13 TX Power
14 TX Power
9 Fast Bit Error Rate
10 Fast Bit Error Rate
11 Fast Bit Error Rate
12 TX Power
13 TX Power
14 TX Power
24 TX Power
25 TX Power
26 TX Power
Sapphire Service Manual
21 Fast Bit Error Rate
22 Fast Bit Error Rate
23 Fast Bit Error Rate
TX Level TCH
0
0
600
600
PCS 1900 Receiver Test
0 512
0
0
661
810
PCS 1900 Transmitter Test
0 512
0
0
661
810
GSM 850 Receiver Test
5
5
128
189
5
GSM 850 Transmitter Test
251
5
5
128
189
5
EGSM 900 Receiver Test
251
5 975
5
5
38
124
EGSM 900 Transmitter Test
5 975
5
5
38
124
DCS 1800 Receiver Test
0 512
0
0
699
885
DCS 1800 Transmitter Test
0 512
0
0
699
885
1st Downlink cell power note
-65
-65
HTCUSA-200015
-104
-104 <= 2 %
-104
-65
-65 >= 25 dbm
-65
-104
-104 <= 2 %
-104
-65
-65 >= 26 dbm
-65
-104
-104 <= 2 %
-104
-65
-65 >= 28 dbm
-65
-104
-104 <= 2 %
-104
-65
-65 >= 27 dbm
-65
HTC CONFIDENTIAL
SM-TP008-1125
2/10/2009 9:51:19 PM
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