Philips TDA8944J User's Manual

TDA8944J

2 x 7 W stereo Bridge Tied Load (BTL) audio amplifier

Rev. 02 — 14 February 2000 Product specification

1.

General description

The TDA8944J is a dual-channel audio power amplifier with an output power of

2

×

7 W at an 8

Ω

load and a 12 V supply. The circuit contains two Bridge Tied Load

(BTL) amplifiers with an all-NPN output stage and standby/mute logic. The TDA8944J comes in a 17-pin DIL-bent-SIL (DBS) power package. The TDA8944J is printed-circuit board (PCB) compatible with all other types in the TDA894x family.

One PCB footprint accommodates both the mono and the stereo products.

2.

Features

c c

■ Few external components

■ Fixed gain

■ Standby and mute mode

■ No on/off switching plops

■ Low standby current

■ High supply voltage ripple rejection

■ Outputs short-circuit protected to ground, supply and across the load

■ Thermally protected

■ Printed-circuit board compatible.

3.

Applications

■ Mains fed applications (e.g. TV sound)

■ PC audio

■ Portable audio.

4.

Quick reference data

Table 1: Quick reference data

I

I

Symbol Parameter

V q

CC stb

Conditions supply voltage quiescent supply current V

CC

= 12 V; R

L

=

∞ standby supply current -

-

Min Typ Max Unit

6 12 18 V

-

24 36

10 mA

µ

A

Philips Semiconductors

TDA8944J

2 x 7 W stereo BTL audio amplifier

Table 1: Quick reference data …continued

Symbol Parameter

P o output power

Conditions

THD = 10%; R

L

V

CC

= 12 V

= 8

Ω

;

THD

G v total harmonic distortion P o

= 1 W voltage gain

SVRR supply voltage ripple rejection

Min Typ Max Unit

6 7 W

-

31

50

0.03

32

65 -

0.1

33

% dB dB

5.

Ordering information

Table 2: Ordering information

Type number Package

TDA8944J

Name Description

DBS17P plastic DIL-bent-SIL power package;

17 leads (lead length 12 mm)

6.

Block diagram

Version

SOT243-1 idth

VCC1

3

VCC2

16

1

OUT1

−

IN1

−

IN1

+

8

6

4

OUT1

+

TDA8944J

IN2

−

IN2

+

MODE

SVR

Fig 1.

Block diagram.

14

9

12

17

VCC

10 STANDBY/

MUTE LOGIC

11

20 k

Ω

20 k

Ω

SHORT CIRCUIT

AND

TEMPERATURE

PROTECTION

2 15

MBK933

GND1 GND2

OUT2

−

OUT2

+

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Product specification

© Philips Electronics N.V. 2000. All rights reserved.

2 of 21 Rev. 02 — 14 February 2000


TDA8944J


7.

Pinning information

7.1 Pinning

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Product specification handbook, halfpage

OUT1

−

1

GND1 2

VCC1

OUT1

+

3

4 n.c.

5

IN1

+

6 n.c.

7

IN1

−

8

IN2

−

9

MODE 10

TDA8944J

SVR 11

IN2

+

12 n.c.

13

OUT2

−

14

GND2 15

VCC2 16

OUT2

+

17

MBK936

Fig 2.

Pin configuration.

7.2 Pin description

Table 3: Pin description

Symbol

OUT1

GND1

V

CC1

OUT1

+ n.c.

IN1

+ n.c.

IN1

−

IN2

−

MODE

SVR

IN2

+

−

Pin

1

2

3

4

5

6

7

8

9

10

11

12

Description negative loudspeaker terminal 1 ground channel 1 supply voltage channel 1 positive loudspeaker terminal 1 not connected positive input 1 not connected negative input 1 negative input 2 mode selection input (standby, mute, operating) half supply voltage decoupling (ripple rejection) positive input 2

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TDA8944J


Table 3: Pin description …continued

Symbol n.c.

OUT2

−

GND2

V

CC2

OUT2+

Pin

13

14

15

16

17

Description not connected negative loudspeaker terminal 2 ground channel 2 supply voltage channel 2 positive loudspeaker terminal 2

8.

Functional description

The TDA8944J is a stereo BTL audio power amplifier capable of delivering 2

×

7 W output power to an 8

Ω

load at THD = 10%, using a 12 V power supply and an external heatsink. The voltage gain is fixed at 32 dB.

With the three-level MODE input the device can be switched from ‘standby’ to ‘mute’ and to ‘operating’ mode.

The TDA8944J outputs are protected by an internal thermal shutdown protection mechanism and a short-circuit protection.

8.1 Input configuration

The TDA8944J inputs can be driven symmetrical (floating) as well as asymmetrical.

In the asymmetrical mode one input pin is connected via a capacitor to the signal ground which should be as close as possible to the SVR (electrolytic) capacitor ground. Note that the DC level of the input pins is half of the supply voltage V

CC

, so coupling capacitors for both pins are necessary.

The input cut-off frequency is: f

(

– off

)

=

2 –

(

R

1 i

×

C i

)

For R i

= 45 k

Ω

and C i

= 220 nF:

(1) f

(

– off

)

=

1

------------------------------------------------------------------16 Hz

2 –

(

45

×

10

3 ×

220

×

10

– 9 )

= (2)

As shown in

Equation 1 and

2

, large capacitor values for the inputs are not

necessary ; so the switch-on delay during charging of the input capacitors, can be minimized. This results in a good low frequency response and good switch-on behaviour.

Remark: To prevent HF oscillations do not leave the inputs open, connect a capacitor of at least 1.5 nF across the input pins close to the device.

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TDA8944J


8.2 Power amplifier

The power amplifier is a Bridge Tied Load (BTL) amplifier with an all-NPN output stage, capable of delivering a peak output current of 2 A.

The BTL principle offers the following advantages:

• Lower peak value of the supply current

• The ripple frequency on the supply voltage is twice the signal frequency

• No expensive DC-blocking capacitor

• Good low frequency performance.

8.2.1

Output power measurement

The output power as a function of the supply voltage is measured on the output pins at THD = 10%; see

Figure 8 . The maximum output power is limited by the maximum

supply voltage of 12 V and the maximum available output current: 2 A repetitive peak current.

8.2.2

Headroom

Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom – compared to the average power output – for transferring the loudest parts without distortion. At V

CC

= 12 V, R

L

= 8

Ω

and P o

= 4 W at THD = 0.1% (see

Figure 6 ), the

Average Listening Level (ALL) – music power – without any distortion yields:

P o(ALL)

= 4 W/15.85 = 252 mW.

The power dissipation can be derived from

Figure 11 on page 10 for 0 dB

respectively 12 dB headroom.

Table 4: Power rating as function of headroom

Headroom

0 dB

12 dB

Power output (THD = 0.1%)

P o

= 4 W

P o(ALL)

= 252 mW

Power dissipation (P)

8 W

4 W

For the average listening level a power dissipation of 4 W can be used for a heatsink calculation.

8.3 Mode selection

The TDA8944J has three functional modes, which can be selected by applying the proper DC voltage to pin MODE. See

Figure 4 and

5

for the respective DC levels,

which depend on the supply voltage level. The MODE pin can be driven by a 3-state logic output stage: e.g. a microcontroller with additional components for DC-level shifting.

Standby — In this mode the current consumption is very low and the outputs are floating. The device is in standby mode when (V

CC

−

0.5 V) < V

MODE

< V

CC

, or when the MODE pin is left floating (high impedance). The power consumption of the

TDA8944J will be reduced to <0.18 mW.

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Mute — In this mode the amplifier is DC-biased but not operational (no audio output); t he DC level of the input and output pins remain on half the supply voltage. This allows the input coupling and Supply Voltage Ripple Rejection (SVRR) capacitors to be charged to avoid pop-noise. The device is in mute mode when

3 V < V

MODE

< (V

CC

−

1.5 V).

Operating — In this mode the amplifier is operating normally. The operating mode is activated at V

MODE

< 0.5 V.

8.3.1

Switch-on and switch-off

To avoid audible plops during supply voltage switch-on or switch-off, the device is set to standby mode before the supply voltage is applied (switch-on) or removed

(switch-off).

The switch-on and switch-off time can be influenced by an RC-circuit on the MODE pin. Rapid on/off switching of the device or the MODE pin may cause ‘click- and pop-noise’. This can be prevented by proper timing of the RC-circuit on the MODE pin.

8.4 Supply Voltage Ripple Rejection (SVRR)

The SVRR is measured with an electrolytic capacitor of 10

µ

F on pin SVR at a bandwidth of 10 Hz to 80 kHz.

Figure 13 on page 11 illustrates the SVRR as function

of the frequency. A larger capacitor value on the SVR pin improves the ripple rejection behaviour at the lower frequencies.

8.5 Built-in protection circuits

The TDA8944J contains two types of protection circuits, i.e. short-circuit and thermal shutdown.

8.5.1

Short-circuit protection

Short-circuit to ground or supply line — This is detected by a so-called ‘missing current’ detection circuit which measures the current in the positive supply line and the current in the ground line. A difference between both currents larger than 0.4 A, switches the power stage to standby mode (high impedance).

Short-circuit across the load — This is detected by an absolute-current measurement. An absolute-current larger than 2 A, switches the power stage to standby mode (high impedance).

8.5.2

Thermal shutdown protection

The junction temperature is measured by a temperature sensor; at a junction temperature of approximately 150

°

C this detection circuit switches the power stage to standby mode (high impedance).

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9.

Limiting values

Table 5: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions

V

CC supply voltage no signal operating

V

I

I

ORM

T stg

T amb

P tot

V

CC(sc) input voltage repetitive peak output current storage temperature operating ambient temperature total power dissipation supply voltage to guarantee short-circuit protection non-operating

10. Thermal characteristics

-

-

Min

−

0.3

−

0.3

−

0.3

-

−

55

−

40

Max

+25

+18

V

CC

+ 0.3

2

+150

+85

18

15

Table 6: Thermal characteristics

Symbol

R th(j-a)

R th(j-mb)

Parameter thermal resistance from junction to ambient

Conditions in free air thermal resistance from junction to mounting base both channels driven

11. Static characteristics

Value Unit

40 K/W

6.9

K/W

Table 7: Static characteristics

V

CC

= 12 V; T amb

= 25

°

C; R

L

= 8

Ω

; V

MODE

= 0 V; V i

= 0 V; measured in test circuit

Figure 14 ; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

I

V

CC

I q

I stb

V

O

∆

V

OUT

[3]

V

MODE

MODE supply voltage quiescent supply current standby supply current

DC output voltage differential output voltage offset mode selection input voltage mode selection input current operating

R

L

=

∞

V

MODE

= V

CC operating mode mute mode standby mode

0 < V

MODE

< V

CC

[1]

-

[2]

-

-

-

-

6

0

3

V

CC

−

0.5

-

-

-

-

-

-

12

24

6 -

18

36

10

200

V mA

µ

V

A mV

0.5

V

V

CC

−

1.5

V

V

CC

20

V

µ

A

[1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential output voltage offset

(∆

V

OUT

) divided by the load resistance (R

L

).

[2] The DC output voltage with respect to ground is approximately 0.5V

CC

.

[3]

∆

V

OUT

=



V

OUT+

−

V

OUT −



V

A

°

C

°

C

W

V

Unit

V

V

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TDA8944J


MGL954

50 handbook, halfpage

Iq

(mA)

40

MGL955


Iq

(mA)

40

30

30

20

20

VCC = 12 V

10

10

0

0 4 8 12 16

VCC (V)

20

Fig 3.

Quiescent current as function of supply voltage.

0

0 4 8 12 16 20

VMODE (V)

Fig 4.

Quiescent current as function of mode voltage.

12. Dynamic characteristics

Table 8: Dynamic characteristics

V

CC

= 12 V; T amb

= 25

°

C; R

L

= 8

Ω

; f = 1 kHz; V

MODE

22 Hz to 22 kHz; unless otherwise specified.

= 0 V; measured in test circuit

Figure 14 ; audio pass band

Symbol

P o

Parameter output power

Conditions

THD = 10%

Min

6

Typ

7 -

Max

THD total harmonic distortion

THD = 0.5%

P o

= 1 W -

4 5

0.03

-

0.1

G v

Z i(dif)

V n(o)

SVRR

V

α o(mute) cs voltage gain differential input impedance noise output voltage supply voltage ripple rejection output voltage channel separation f f ripple ripple

= 1 kHz

= 100 Hz to 20 kHz mute mode

R s

= 0

Ω

[1]

-

[2]

31

70

50

[2]

-

[3]

-

50

-

32

90

90

65

60

75 -

-

-

33

110

120

50 µ V dB

[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance

R s

= 0

Ω

at the input.

[2] Supply voltage ripple rejection is measured at the output, with a source impedance R s

= 0

Ω

at the input. The ripple voltage is a sine wave with a frequency f ripple

and an amplitude of 707 mV (RMS), which is applied to the positive supply rail.

[3] Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.

dB k

Ω

µ

V dB dB

Unit

W

W

%

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TDA8944J


10 handbook, full pagewidth

Vo

(V)

1

10

−

1

10

−

2

10

−

3

10

−

4

10

−

5

0 4 8

Fig 5.

Output voltage as function of mode voltage.

MGL952

10


THD

(%)

10

VCC = 12 V

1

VCC = 12 V

12


THD

(%)

1

MGL957

16

VMODE (V)

20

MGL953

Po = 0.1 W

1 W

10

−

1

10

−

1

10

−

2

10

−

2

10

−

1

1 10

Po (W)

10

2

Fig 6.

Total harmonic distortion as function of output power.

10

−

2

10 10

2

10

3

10

4 f (Hz)

10

5

No bandpass filter applied.

Fig 7.

Total harmonic distortion as function of frequency.

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TDA8944J


MGL959


Po

(W)

16

12

8

RL = 8

Ω

16

Ω

4

0

0 4 8 12 16

VCC (V)

20

THD = 10%.

Fig 8.

Output power as function of supply voltage.

MGL962


η

(%)

80

60

RL = 16

Ω

8

Ω

40

20

0

0 2 4 6 8

Po (W)

10

V

CC

= 12 V.

Fig 10. Efficiency as function of output power.

RL = 8

Ω

16

Ω

MGL960


Ptot

(W)

16

12

8

4

0

0 4 8 12 16

VCC (V)

20

Fig 9.

Total power dissipation as function of supply voltage.

MGL961


P

(W)

8

RL = 8

Ω

6

4

2

0

0 2

16

Ω

4 6 8

Po (W)

10

Fig 11. Power dissipation as function of output power.

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TDA8944J


MGL958

α cs


(dB)

−

20

−

40

−

60

−

80

−

100

10 10

2

No bandpass filter applied.

Fig 12. Channel separation as function of frequency.

10

3

0 handbook, full pagewidth

SVRR

(dB)

−

20

10

4 f (Hz)

10

5

MGL956

−

40

B

−

60

A

−

80

10 10

2

10

3

V

CC

= 12 V; R s

= 0

Ω

; V ripple

= 707 mV (peak-to-peak); no bandpass filter applied.

Curves A: inputs short-circuited

Curves B: inputs short-circuited and connected to ground (asymmetrical application)

Fig 13. Supply voltage ripple rejection as function of frequency.

10

4

CH2

CH1 f (Hz)

10

5

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13. Internal circuitry

Table 9: Internal circuitry

Pin

6 and 8

12 and 9

Symbol

IN1+ and IN1

−

IN2+ and IN2

−

1 and 4

14 and 17

OUT1 − and OUT1+

OUT2

− and OUT2+

Equivalent circuit

VCC

VCC

1.5 k

Ω

1.5 k

Ω

8, 9

1 : 1

45 k

Ω

45 k

Ω

1/2 VCC

(SVR)

1 : 1

VCC

6, 12

MGL946

10 MODE

40

Ω

1/2 VCC

100

Ω

1, 4, 14, 17

MGL947

VCC

VCC

VCC

10 k

Ω

10 k

Ω

1 k

Ω

1 k

Ω

10

11 SVR

OFF

HIGH

MUTE

HIGH

MGL949

Standby

VCC

11

20 k

Ω

20 k

Ω

MGL948

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14. Application information

TDA8944J


C1

MICROCONTROLLER

C2

MODE

Standby

Mute

On

C1 C2

0

0

1

0

1

0

Rs 220 nF

Symmetrical input

Ci

220 nF

220 nF Rs

Asymmetrical input

Ci

220 nF signal

GND

1.5

nF

IN1

IN1

IN2

−

+

−

8

6

9

VCC

R

1.5

nF

IN2

+

12

MODE 10

R signal

GND

SVR 11

10

µ

F

100 nF

Ri

45 k

Ω

1/2 VCC

Ri

45 k

Ω

3

−

+

16

1/2 VCC

+

−

−

+

1 OUT1

−

4 OUT1

+

TDA8944J

Ri

45 k

Ri

Ω

1/2 VCC

45 k

Ω

−

+

STANDBY/

MUTE LOGIC

20 k

Ω

1/2 VCC

1/2 VCC

+

−

VCC

−

+

SHORT CIRCUIT

AND

TEMPERATURE

PROTECTION

20 k

Ω

14 OUT2

−

17 OUT2

+

2 15

GND

MGL950

+

VCC

1000

µ

F

RL

8

Ω

RL

8

Ω

Fig 14. Application diagram.

14.1 Printed-circuit board (PCB)

14.1.1

Layout and grounding

For a high system performance level certain grounding techniques are essential.

The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large

(output) signal currents from interfering with the small AC input signals.

The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power.

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Philips Semiconductors idth

54 mm

TDA8944J


56 mm

100 nF

17

1

OUT2

−

220 nF

OUT1

−

ON

MUTE

OUT2

+ +

10

µ

F

−

220 nF

1.5 nF

IN2

−

IN2

+

IN1 −

IN1

+

VCC

1000

µ

F

GND

OUT1

+

MGL951

Fig 15. Printed-circuit board layout (single-sided); components view.

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14.1.2

Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor locations should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations.

For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR – typical 100 nF – has to be placed as close as possible to the device.

For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor – e.g. 1000

µ

F or greater – must be placed close to the device.

The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail voltage. For good THD and noise performance a low ESR capacitor is recommended.

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TDA8944J


14.2 Thermal behaviour and heatsink calculation

The measured maximum thermal resistance of the IC package, R th(j-mb)

is 6.9 K/W.

A calculation for the heatsink can be made, with the following parameters:

T amb(max)

= 50

°

C

V

CC

= 12 V and R

L

= 8

Ω

T j(max)

= 150

°

C.

R th(tot)

is the total thermal resistance between the junction and the ambient including the heatsink. In the heatsink calculations the value of R th(mb-h)

is ignored.

At V

CC

= 12 V and R

L

= 8

Ω

the measured worstcase sine-wave dissipation is 8 W; see

Figure 11

. For T j(max)

= 150

°

C the temperature raise - caused by the power dissipation - is: 150 – 50 = 100

°

C.

P

×

R th(tot)

= 100

°

C

R th(tot)

= 100/8 = 12.5 K/W

R th(h-a)

= R th(tot)

– R th(j-mb)

= 12.5 – 6.9 = 5.6 K/W.

The calculation above is for an application at worstcase (stereo) sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation (see

Section 8.2.2

). This allows for the use of a smaller heatsink:

P

×

R th(tot)

= 100

°

C

R th(tot)

= 100/4 = 25 K/W

R th(h-a)

= R th(tot)

– R th(j-mb)

= 25 – 6.9 = 18.1 K/W.

To increase the lifetime of the IC, T j(max) should be reduced to 125

°

C. This requires a heatsink of approximately 12 K/W for music signals.

15. Test information

15.1 Quality information

The General Quality Specification for Integrated Circuits, SNW-FQ-611D is applicable.

15.2 Test conditions

T amb

= 25

°

C; V

CC

= 12 V; f = 1 kHz; R

L

= 8

Ω

; audio pass band 22 Hz to 22 kHz; unless otherwise specified.

Remark: In the graphs as function of frequency no bandpass filter was applied; see

Figure 7 ,

12 and 13 .

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16. Package outline

DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)

TDA8944J


SOT243-1 non-concave x

D

D h

Eh d view B: mounting base side

A

2

B j E

A

Rev. 02 — 14 February 2000

L

3

L

Q c v M

1

Z e e

1 b p w M

17 m e

2

0 5 scale

10 mm

DIMENSIONS (mm are the original dimensions)

UNIT A A

2 b p c D

(1) d D h mm

17.0

15.5

4.6

4.4

0.75

0.60

0.48

0.38

24.0

23.6

20.0

19.6

10

E

(1) e e

1 e

2

12.2

11.8

2.54

1.27

5.08

E h

6 j

3.4

3.1

L

12.4

11.0

L

3

2.4

1.6

m

4.3

Q

2.1

1.8

v

0.8

w

0.4

x Z

(1)

0.03

2.00

1.45

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT243-1

IEC

REFERENCES

JEDEC EIAJ

EUROPEAN

PROJECTION

ISSUE DATE

97-12-16

99-12-17

Fig 16. DBS17P package outline.

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17. Soldering

17.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit

Packages (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

17.2 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260

°

C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg(max)

).

If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

17.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300

°

C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400

°

C, contact may be up to 5 seconds.

17.4 Package related soldering information

Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering methods

Package Soldering method

DBS, DIP, HDIP, SDIP, SIL

Dipping suitable

Wave suitable [1]

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

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TDA8944J


18. Revision history

Table 11: Revision history

Rev Date CPCN Description

02 000214 -

01 990414 -

Product specification; second version; supersedes initial version TDA8944J-01 of

14 April 1999 (9397 750 04881). Modifications:

•

Table 1 on page 1

: SVRR; Typ value 65 dB

→

added

•

Figure 1 on page 2

: Block diagram; pin numbers changed OUT2

− →

14 and OUT2+

→

17

•

Figure 2 on page 3

: Pin configuration; pin numbers changed OUT2

− →

14 and OUT2+

→

17

•

Section 8 “Functional description” :

–

Section 8.1 “Input configuration” on page 4

→

added.

–

Section 8.2 “Power amplifier” on page 5 : ........, capable of delivering a peak output

current of 1.5 A

→

changed to 2 A.

–

Section 8.2.1 “Output power measurement” on page 5

→

added

–

Section 8.2.2 “Headroom” on page 5

→

added

•

Section 8.3 “Mode selection” :

– Standby mode: V

MODE

> (V

CC

−

0.5 V)

→ changed to (V

CC

−

0.5 V) < V

MODE power consumption of the TDA8944J will be reduced to <0.18 mW

→

added.

< V

CC

; The

– Mute mode: the DC level of the input and output pins remain on half the supply voltage

→ added;

– 2.5 V < V

MODE

< (V

CC

−

1.5 V)

→

changed to 3 V < V

MODE

< (V

CC

−

1.5 V)

–

Section 8.3.1 “Switch-on and switch-off” on page 6

•

Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 6

→

added

•

Section 8.5 “Built-in protection circuits” on page 6

→

added

•

Table 5 on page 7

:

– P tot

value added 18 V

– V

CC(sc)

value added 15 V

•

Table 6 on page 7

:

– R th(j-a)

value added 40 K/W

– R th(j-c) driven’ value 10

→ changed to 6.9 K/W; condition ‘in free air’

→ changed to ‘both channels

•

Table 7 on page 7

: V

MODE

- mute mode - value Min 2.5

→

changed to 3 V

•

Table 8 on page 8

:

– SVRR; Typ values 65 and 60 dB

→

added

–

α cs

; Typ value 75 dB

→

added

•

Figure 3

to

13

: figures added

•

Section 13 “Internal circuitry” on page 12 :

→

added

•

Figure 14 : figure adjusted

•

Section 14.1 “Printed-circuit board (PCB)” on page 13 :

→

added

•

Figure 15

: figure added

•

Section 14.2 “Thermal behaviour and heatsink calculation” on page 15 :

→

added

•

Section 15.2 “Test conditions” on page 15

:

→

added

Preliminary specification; initial version.

9397 750 06861



18 of 21 Rev. 02 — 14 February 2000


TDA8944J


19. Data sheet status

Datasheet status

Objective specification

Preliminary specification Qualification

Product specification

Product status

Definition [1]

Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.

Production

This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips

Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

[1] Please consult the most recently issued data sheet before initiating or completing a design.

20. Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

21. Disclaimers

Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance.

Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

9397 750 06861


© Philips Electronics N.V. 2000 All rights reserved.

19 of 21


TDA8944J


Philips Semiconductors - a worldwide company

Argentina: see South America

Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Tel. +43 160 101, Fax. +43 160 101 1210

Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773

Belgium: see The Netherlands

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Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102

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Middle East: see Italy

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications,

Building BE, P.O. Box 218, 5600 MD EINDHOVEN,

The Netherlands, Fax. +31 40 272 4825

Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399

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Slovakia: see Austria

Slovenia: see Italy

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Vietnam: see Singapore

Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553

Internet: http://www.semiconductors.philips.com

(SCA69)

9397 750 06861



20 of 21


Contents

17.2

17.3

17.4

18

19

20

21

1

2

3

10

11

12

13

4

5

6

7

7.1

7.2

8

8.1

8.2

8.2.1

8.2.2

8.3

8.3.1

8.4

8.5

8.5.1

8.5.2

9

14

14.1

14.1.1

14.1.2

14.2

15

15.1

15.2

16

17

17.1

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 4

Input configuration . . . . . . . . . . . . . . . . . . . . . . 4

Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5

Output power measurement . . . . . . . . . . . . . . . 5

Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5

Switch-on and switch-off. . . . . . . . . . . . . . . . . . 6

Supply Voltage Ripple Rejection (SVRR) . . . . . 6

Built-in protection circuits . . . . . . . . . . . . . . . . . 6

Short-circuit protection . . . . . . . . . . . . . . . . . . . 6

Thermal shutdown protection . . . . . . . . . . . . . . 6

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7

Thermal characteristics. . . . . . . . . . . . . . . . . . . 7

Static characteristics. . . . . . . . . . . . . . . . . . . . . 7

Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12

Application information. . . . . . . . . . . . . . . . . . 13

Printed-circuit board (PCB). . . . . . . . . . . . . . . 13

Layout and grounding . . . . . . . . . . . . . . . . . . . 13

Power supply decoupling . . . . . . . . . . . . . . . . 14

Thermal behaviour and heatsink calculation . 15

Test information. . . . . . . . . . . . . . . . . . . . . . . . 15

Quality information . . . . . . . . . . . . . . . . . . . . . 15

Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Introduction to soldering through-hole mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Soldering by dipping or by solder wave . . . . . 17

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17

Package related soldering information . . . . . . 17

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

© Philips Electronics N.V. 2000.

Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Date of release: 14 February 2000 Document order number: 9397 750 06861

TDA8944J


Philips TDA8944J User's Manual

2 x 7 W stereo Bridge Tied Load (BTL) audio amplifier

Rev. 02 — 14 February 2000 Product specification

1.

General description

2.

Features

3.

Applications

4.

Quick reference data

5.

Ordering information

6.

Block diagram

7.

Pinning information

8.

Functional description

9.

Limiting values

10. Thermal characteristics

11. Static characteristics

12. Dynamic characteristics

13. Internal circuitry

14. Application information

15. Test information

16. Package outline

17. Soldering

18. Revision history

19. Data sheet status

20. Definitions

21. Disclaimers

Philips Semiconductors - a worldwide company

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