Renesas EDK3687 Technical information

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Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
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April 1st, 2010
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Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
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EDK3687
USER MANUAL
FOR H8/3687
ON-CHIP FLASH MICROCONTROLLER
Preface
Cautions
1.
This document may be, wholly or partially, subject to change without notice.
2.
All rights reserved. No one is permitted to reproduce or duplicate, in any form, a part or this entire
document without Renesas Technology Europe Limited's written permission.
Trademarks
General
All brand or product names used in this manual are trademarks or registered trademarks of their respective
companies or organisations.
Specific
Microsoft, MS and MS-DOS are registered trademarks and Windows and Windows NT are
trademarks of Microsoft Corporation.
Document Information
Product Code:
D004173_11
Version:
2.0
Date:
09/05/2003
Copyright © Renesas Technology Europe Ltd. 2003. All rights reserved.
Website:
http://www.renesas.com/
2
1.
TABLE OF CONTENTS
1.
TABLE OF CONTENTS ............................................................................................................................................. 3
2.
START-UP INSTRUCTIONS ....................................................................................................................................... 4
2.1. INSTALLING THE EVALUATION DEVELOPMENT KIT (EDK)........................................................................... 4
2.2. SERIAL CONNECTION ....................................................................................................................................... 4
2.3. POWER SUPPLY ................................................................................................................................................ 4
3.
EDK BOARD LAYOUT ............................................................................................................................................ 5
3.1. EDK BLOCK DIAGRAM....................................................................................................................................... 5
4.
EDK OPERATION ................................................................................................................................................... 6
4.1. USER INTERFACE.............................................................................................................................................. 6
4.2. SERIAL INTERFACE........................................................................................................................................... 6
4.3. SPI EEPROM....................................................................................................................................................... 7
4.4. I2C EEPROM....................................................................................................................................................... 8
4.5. LIN INTERFACE .................................................................................................................................................. 8
4.6. LEDS.................................................................................................................................................................... 8
5.
BOARD OPTIONS .................................................................................................................................................... 9
5.1. JUMPER LINKS................................................................................................................................................... 9
5.2. EDK OPTIONS – CJ4 ........................................................................................................................................ 10
5.3. OPTION LINK SELECTION............................................................................................................................... 11
5.4. FLASH PROGRAMMING HEADER .................................................................................................................. 12
5.5. EXTERNAL DEBUG HEADER .......................................................................................................................... 12
5.6. BOOT CONTROL .............................................................................................................................................. 12
6.
MICROCONTROLLER HEADER CONNECTIONS ......................................................................................................... 13
6.1. HEADER J1 ....................................................................................................................................................... 13
6.2. HEADER J2 ....................................................................................................................................................... 13
7.
CODE DEVELOPMENT ........................................................................................................................................... 14
7.1. HMON ................................................................................................................................................................ 14
7.2. ADDITIONAL INFORMATION ........................................................................................................................... 16
3
2.
START-UP INSTRUCTIONS
2.1. INSTALLING THE EVALUATION DEVELOPMENT KIT (EDK)
Please refer to the quick start guide provided for initial installation of the EDK.
A copy of the quick start guide and other information relating to this EDK at:
http://www.eu.renesas.com/tools
Installing the EDK requires power and serial connection to a host computer.
2.2. SERIAL CONNECTION
The serial communications cable for connecting the EDK to a host computer requires 1:1 connectivity.
Figure 2-1 shows how to connect the EDK to a PC or notebook computer equipped with a nine pin D connector.
HOST
PC
EDK
3
2
5
3
2
5
FIGURE 2-1: SERIAL CONNECTION TO PC/NOTEBOOK WITH DB-9 CONNECTOR (SUPPLIED)
2.3. POWER SUPPLY
The EDK hardware requires a power supply of +5V. Since total power consumption can vary widely due to external
connections, port states, and memory configuration, use a power supply capable of providing at least 500mA at +5V DC ±
5%.
The design is specified for evaluation of the microcontroller and so does not include circuitry for supply filtering/noise
reduction, under voltage protection, over current protection or reversed polarity protection. Caution should be used when
selecting and using a power supply.
The power connector on the EDK is a 2.5mm Barrel connector. The center pin is the positive connection.
FIGURE 2-2: POWER SUPPLY CONNECTION
Caution: Existing customers using E6000 products note that the polarity of this board is opposite to that for the
E6000. Use of the E6000 power supply with this board will damage both board and power supply.
4
3.
EDK BOARD LAYOUT
The diagram shows a general layout of the EDK board.
J1
UVcc
GND
Testpoints
RESn
FW
NMIn
ULED1
ULED2
PSCK
PTXD
PRXD
RX232
TX232
NMI
Switch
Power LED
User1 LED
User2 LED
LIN
LIN
5V
OSC
Microprocessor
XTAL
RESET
Switch
SPI
DEBUG
Power
CTS
RTS
9-Way
D-Type
I2C
I2C
FLASH
Programming
J2
CJ4
FIGURE 3-1: EDK BOARD LAYOUT
3.1. EDK BLOCK DIAGRAM
The diagram shows the connectivity of the components on the EDK board.
External
PSU
Reset
NMI
Switches
EDK specific
Switch De-Bounce
RS232
Programming
& Comms
LIN
SPI
Microprocessor
I2C
LEDs
User1
Power
&
User2
Header
Connectors
On-Chip
Debug
Connector
FIGURE 3-2: EDK BLOCK DIAGRAM
5
4.
EDK OPERATION
4.1. USER INTERFACE
The EDK provides two buttons for influencing the operation of the board. The purpose of each button is clearly marked next
to it. Refer to the board layout for positions (Section 3)
1.
Reset Switch
This button provides the microcontroller with a reset pulse utilizing the built in power on reset control of the device.
2.
NMI Switch
This button provides a de-bounced signal to the microcontroller for each operation of the button. There is no maximum
activation time for this button.
4.2. SERIAL INTERFACE
The serial port on the microcontroller directly supports three wire serial interfaces. Options are provided on the board for the
user to write handshaking routines using standard port pins.
4.2.1. CONNECTOR PIN DEFINITIONS
The EDK RS232 interface conforms to Data Communication Equipment (DCE) format allowing the use of 1-1 cables when
connected to Data Terminal Equipment (DTE) such as an IBM PC. The cable used to connect to the EDK will affect the
available board options. A fully wired cable can allow handshaking between the microcontroller and the host PC, subject to
setting the board options and the availability of suitable host software. Handshaking is not supported as standard on the
microcontroller so for normal use a minimal three-wire cable can be used. The minimum connections are unshaded in the
following table.
EDK DB9
Connector Pin
1
2
3
4
5
6
7
8
9
Signal
Host DB9
Connector Pin
No Connection
EDK Tx Host Rx
EDK Rx Host Tx
No Connection
Ground
No Connection
EDK CTS Host RTS
EDK RTS Host CTS
No Connection
1
2
3
4
5
6
7
8
9
TABLE 4-1: RS232 INTERFACE CONNECTIONS
5
4
9
3
8
2
7
1
6
FIGURE 4-1: EDK SERIAL PORT PIN NUMBERING
6
4.2.2. CRYSTAL CHOICE
The operating crystal frequency has been chosen to support the fastest operation with the fastest serial operating speeds.
The value of the crystal is 18.432MHz.
The following table shows the baud rates and Baud Rate Register (BRR) setting required for each communication rate using
the above default operating speed. It also confirms the resultant baud rate and the bit error rate that can be expected.
Baud Rate Register Settings for Serial Communication Rates
SMR
0
Setting:
Comm.
BRR
Actual
ERR
Baud
setting
Rate
(%)
110
Invalid Invalid Invalid
300
Invalid Invalid Invalid
1200 Invalid Invalid Invalid
2400 239
2400
0.00
4800
119
4800
0.00
1
BRR
setting
Actual
Rate
2
ERR
(%)
Invalid
BRR
setting
Invalid
3
Actual
Rate
Invalid
ERR
(%)
Invalid
BRR
setting
81
Actual
Rate
110
ERR
(%)
Invalid
Invalid
-0.22
Invalid
Invalid
Invalid
119
300
0.00
29
300
0.00
119
1200
0.00
29
1200
0.00
7
1125
-6.25
59
2400
0.00
14
2400
0.00
3
2250
-6.25
29
4800
0.00
7
4500
-6.25
1
4500
-6.25
9600
59
9600
0.00
14
9600
0.00
3
9000
-6.25
Invalid
Invalid
Invalid
19200
29
19200
0.00
7
18000
-6.25
1
18000
-6.25
Invalid
Invalid
Invalid
38400
14
38400
0.00
3
36000
-6.25
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
57600
9
57600
0.00
2
48000
-16.67
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
115200 4
230400* 2
115200
0.00
0
144000
25.00
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
192000
-16.67
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
460800* 0
576000
25.00
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
Invalid
TABLE 4-2 CRYSTAL FREQUENCIES FOR RS232 COMMUNICATION
* Note: The device used to convert the RS232 serial information to logic signals for the microcontroller is limited to
120kBaud. The rates above this level can only be utilised if the user provides direct logic level communications.
The user may replace the HC49/U surface mounted AT cut crystal with another of similar type within the operating frequency
of the microcontroller device. Please refer to the hardware manual for the microcontroller for the valid operating range.
Alternatively the user may fit an oscillator module – or provide an external clock source. When providing an oscillator module
or external source it is highly recommended that the load capacitors for the AT crystal are removed from the PCB. These are
physically placed within the PCB outline of the oscillator module for easy location and to ensure they are removed when
using this option.
When changing the crystal frequency the pre-loaded debugging monitor will not function. In this situation the user is
responsible for providing code to evaluate the device away from the default operating speed.
4.2.3. REMOVABLE COMPONENT INFORMATION.
This information is provided to allow the replacement of components removed from the board as described in section 4.2.2.
Component
Load Resistor (X2)
Load Resistor (X3)
Load capacitors (X2)
Load capacitors (X3)
Cct. Ref
R8
R7
C2,C3
C4,C5
Value
1MΩ
1MΩ
12pF
15pF
Rating
0805 1%
0805 1%
0603 10% 25V
0603 10% 25V
Manufacturer
Welwyn WCR Series
Welwyn WCR Series
AVX 0603 3 A 150 KAT
AVX 0603 3 A 150 KAT
TABLE 4-3: REMOVABLE COMPONENT INFORMATION
Care must be taken not to damage the tracking around these components. Only use soldering equipment designed for
surface mount assembly and rework.
4.3. SPI EEPROM
The board has been tested with an Atmel AT25040N-10SA-2.7 SPI EEPROM device (Not supplied).
The device should be connected to P30, P31, P32 and P67 using 0R links on R15, R16, R17 and R21. Alternative
connections are available, refer to section 5.3 for more information.
Do not fit the CAN transceiver if the SPI device is fitted while using the settings above.
7
4.4. I2C EEPROM
The board has been tested with an Atmel AT24C04AN-10SI-2.7 I2C EEPROM device (Not supplied).
The device is configured to connect to dedicated I2C pins on Ports P56 and P57.
4.5. LIN INTERFACE
The board has been tested with an Philips TJA1020TD device (Not supplied).
The device should be connected to P71 and P72 using 0R links on R29 and R31. Alternative connections are available; refer
to section 5.3 for more information.
The links R41, R45 and R47 need to be carefully considered before fitting. Damage to the device, board or connected
equipment may occur if these links are fitted inappropriately. Please review the specifications for the LIN transceiver and LIN
Interface before fitting any of these links.
4.6. LEDS
The EDK has three red LEDs. The function of each LED is clearly marked on the silk screen of the PCB. Please refer to the
board layout diagram for position information (Section 3).
When the board is connected to a power source the Power (PWR) led will illuminate.
There are two LEDs dedicated for user control these are marked USR1 and USR2. Each LED will illuminate when the port
pin is in a logical low state.
The user LEDs are connected to the following ports:
LED
Identifier
USR1
USR2
Port
Pin
P64
P65
Microcontroller
Pin
37
38
Pin Functions on
Port Pin
FTIOA1
FTIOB1
TABLE 4-4: LED PORT CONNECTIONS
8
5.
BOARD OPTIONS
The EDK has a number of configuration settings set by four jumpers CJ4 (A, B, C, D) and zero-ohm links. Common EDK
functions can be set using the jumpers as described in sections 5.2. The additional zero-ohm links provide additional
features that may be required to interface with other systems.
All the Jumper link settings are three pin options. There are four sets of options on each header.
The headers are numbered from 1 to 12 with pin 1 marked on the PCB by an arrow pointing to the pin. The diagram below
shows the numbering of these jumper links and indicates jumpers fitted 1-2 for each three-pin jumper.
5.1. JUMPER LINKS
J1
UVcc
GND
Power LED
User1 LED
User2 LED
LIN
LIN
Testpoints
RESn
FW
NMIn
ULED1
ULED2
PSCK
PTXD
PRXD
RX232
TX232
NMI
Switch
OSC
Microprocessor
SPI
XTAL
RESET
Switch
DEBUG
5V
CTS
RTS
9-Way
D-Type
I2C
I2C
FLASH
Programming
Power
J2
CJ4
1 2
3
1 2 3
Jumper
A
1,2,3
4
5
6
1 2 3
Jumper
B
1,2,3
7
8
9 10 11
1 2 3
Jumper
C
1,2,3
12
1 2 3
Jumper
D
1,2,3
FIGURE 5-1: JUMPER CONFIGURATION
The following tables define each jumper and its settings.
9
5.2.
EDK OPTIONS – CJ4
The EDK options provide access to commonly used features of the EDK range.
These jumpers must be fitted at all times to ensure correct operation of the EDK.
Jumper
CJ 4-A
Default 1-2
CJ 4-B
Default 1-2
CJ 4-C
Default 2-3
CJ 4-D
Default 1-2
Function
Serial Receive
Source
Serial Transmit
Destination
Serial Receive
Source
BOOT Mode
Selection
Setting 1-2
Routes the programming serial
port to the 9Way D Connector
Routes the programming serial
port to the 9Way D Connector
Enable the Flash Programming
header data receive
Setting 2-3
Routes the programming serial port
to the LIN Interface
Routes the programming serial port
to the LIN Interface
Enable the RS232 interface data
receive.
User Mode
BOOT Mode
TABLE 5-1: BOARD OPTION: JUMPER SETTINGS (DEFAULT SETTINGS IN BOLD)
*See section 5.4
The following table lists the connections to each jumper pin.
Pin
1
2
3
4
5
6
7
8
9
10
11
12
Net Name
RX232
RX_OPT
LIN_RX
TX232
PTXD
LIN_TX
RX_HDR
PRXD
RX_OPT
NC
NMIn
GROUND
Description
RS232 received data
Link to below – Data from RS232 or LIN
LIN received data
RS232 transmitter
Data transmission
LIN transmitter
Flash Programming Header received data
Data reception
Link to above – Data from RS232 or LIN
No Connection
NMI used for BOOT mode selection
System Ground
10
5.3. OPTION LINK SELECTION
The following sections show the option links that apply to each peripheral device. The tables all use the same key of symbols
which is given below:
X – Groups of options one set of which must be fitted for correct operation of the EDK.
O – Groups of options which if fitted must be connected in the groups as shown by the table row.
S – Optional selection that will enable or disable specific device functions as listed.
! – Options which when incorrectly fitted may damage the board or attached devices.
5.3.1. RST – RESET FUNCTION
The HD643687GFP device includes a built in reset control circuit.
Internal
RST
C
C
C
C
C
C
R
R
R
R
R
R
2
3
4
8
9
10
X
External
X
Default
X
X
X
X
TABLE 5-2: OPTION LINKS
The alternate settings can be fitted without damage to the device.
5.3.2. LIN – LIN INTERFACE
The LIN interface is not fitted by default. The transceiver can be connected to two groups of pins. The SCI2 (56,57,58) pins
are shared with the CAN transceiver, do not use this selection when the CAN transceiver is fitted.
SCI2
SCI2 R R R R R R R R R R R
48,49,50 56,57,58 12 27 26 29 30 31 32 41 45 46 47
SCI
SCI
O
O
O
O
O
Default
O
NSLP
LIN FTOA0
IRQ3n
!
!
NWAKE
S
S
S
MASTER
X
SLAVE
X
!
POWER
TABLE 5-3: OPTION LINKS
11
5.3.3. SPI – SERIAL PERIPHERAL INTERFACE
The SPI interface is not directly compatible with the SCI interface on the device. Selection of the connections to the SPI
interface should therefore be chosen to allow the operation of other peripherals as required.
SCI2
SCI2
R R R R R R R R R R R R R
SSU 48,49,50 56,57,58 15 16 17 18 19 20 21 22 23 24 25 35 37
SCI
SPI
X
SCI
O O O O
X
SCI
O O O
X
O O O
HOLDn
SPI
S
WPn
S
X
CSn
TABLE 5-4: OPTION LINKS
5.3.4. CAN – CONTROLLER AREA NETWORK
The CAN device, when fitted, is permanently connected to microcontroller pins 56 & 57. Other options share these pins so be
sure that the alternate settings are made for the other peripheral options to avoid contentions on the board.
5.4. FLASH PROGRAMMING HEADER
The Flash Programming header is used with the Flash Debugging Module (FDM). The FDM is a USB based programming
tool for control and programming of Renesas microcontrollers, available separately from Renesas. This header provides
direct access for the FDM to control the EDK microcontroller.
To utilise this header the user must make the following changes to the board configuration.
1.
Select the FDM header using CJ4-C as marked on the silk screen. Please refer to section 5.2.
5.5. EXTERNAL DEBUG HEADER
The External debug header may be used with the Renesas E10T Debugger, Renesas LEM Debugger or a third party
debugger.
The E10T and LEM are on-chip debug emulators available separately from Renesas.
This header provides direct access for the debugger to control the EDK microcontroller.
5.6. BOOT CONTROL
The EDK provides a jumper selection to place the microcontroller device into boot mode. This jumper link grounds the NMI
pin on the device.
Always remove the power from the EDK before moving this jumper to prevent unintended effects in the processor that may
prevent the programming function from completing successfully.
12
6.
MICROCONTROLLER HEADER CONNECTIONS
The following table lists the connections to each or the headers on the board.
6.1. HEADER J1
J1
Pin
No
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
Function
TEST
VCL(No Connection)
X2
PB7/AN7
PB5/AN5
PB0/AN0
PB2/AN2
P30
P32
P17/IRQ3n/TRGV
P15/IRQ1n/TMIB1
P72/TXD_2
P70/SCK3_2
P22/TXD
P20/SCK3
P86
EDK Symbol
GND
NC3
CON_X2
PB7
PB5
PB0
PB2
P30
P32
P17
P15
P72
P70
PTXD
PSCK
P86
Device
pin
Pin
No
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
8
6
4
2
64
62
60
58
56
54
52
50
48
46
44
42
Function
RESn
X1
AVCC
PB6/AN6
PB4/AN4
PB1/AN1
PB3/AN3
P31
P33
P16/IRQ2n
P14/IRQ0n
P71/RXD_2
P23
P21/RXD
P87
P85
EDK Symbol
Device
pin
RESn
CON_X1
CON_AVCC
PB6
PB4
PB1
PB3
P31
P33
P16
CTS
P71
P23
PRXD
P87
P85
7
5
3
1
63
61
59
57
55
53
51
49
47
45
43
41
EDK Symbol
Device
pin
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
6.2. HEADER J2
J2
Pin
No
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
Function
VSS
OSC1
P50/WKP0n
P34
P36
P52/WKP2n
P54/WKP4n
P10/TMOW
P12
P57/SCL
P75/TMCIV
P24
P62/FTIOC0
NMIn
P64/FTIOA1
P66/FTIOC1
EDK Symbol
GND
CON_OSC1
P50
P34
P36
P52
P54
P10
P12
P57
P75
P24
P62
NMIn
ULED1
RTS
Device
pin
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
Pin
No
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
Function
OSC2
VCC
P51/WKP1n
P35
P37
P53/WKP3n
P55/WKP5n/ADTRGn
P11/PWM
P56/SDA
P74/TMRIV
P76/TMOV
P63/FTIOD0
P61/FTIOB0
P60/FTIOA0
P65/FTIOB1
P67/FTIOD1
CON_OSC2
EVCC 1
P51
P35
P37
P53
P55
P11
P56
P74
P76
P63
P61
P60
ULED2
P67
13
7.
CODE DEVELOPMENT
7.1. HMON
7.1.1. MODE SUPPORT
The HMON library is built to support Normal Mode only.
7.1.2. BREAKPOINT SUPPORT
The monitor utilises the Address Break Controller for code located in ROM, allowing a single breakpoint to be set in the code.
Code located in RAM may have multiple breakpoints limited only by the size of the On-Chip RAM.
Due to a limitation of the internal address break controller, a breakpoint set in ROM will execute the instruction at the
breakpoint and stop on the subsequent op-code.
7.1.2.1.CODE LOCATED IN FLASH / ROM
Double clicking in the breakpoint column in the code sets the breakpoint. Adding a further breakpoint in the code removes
the previous one. A warning message will be displayed in the message window when this occurs.
7.1.2.2.CODE LOCATED IN RAM
Double clicking in the breakpoint column in the code sets the breakpoint. Breakpoints will remain unless they are double
clicked to remove them.
7.1.3. HMON CODE SIZE
HMON is built along with the debug code. Certain elements of the HMON code must remain at a fixed location in memory.
The following table details the HMON components and their size and location in memory. For more information, refer to the
map file when building code.
Section
Description
Start Location
Size
(H’bytes)
RESET_VECTOR
HMON Reset Vector (Vector 0)
Required for Startup of HMON
Trap Vectors (Vector 8, 9, 10, 11)
Required by HMON to create Trap Breakpoints in RAM
HMON Break Controller (Vector 12)
Required by HMON to create Breakpoints in ROM
HMON Serial Port Vectors (Vector 23)
Used by HMON when EDK is configured to connect to the
default serial port.
HMON Code
HMON Constant Data
HMON Uninitialised data
FDT User Mode Kernel.
This is at a fixed location and must not be moved. Should the
kernel need to be moved it must be re-compiled.
FDT User Mode Kernel.
This is at a fixed location and must not be moved. Should the
kernel need to be moved it must be re-compiled.
Pointer used by HMON to point to the start of user code.
H’ 0000
2
H’ 0010
8
H’ 0018
2
H’ 002E
2
H’ 1000
H’ 2C3E
H’ FC80
H’ 0400
2C3D
2D10
1FD
F7
H’ 0500
6CC
H’ 0C00
4*
TRAP_VECTORS
HW_BREAK_VECTORS
SCI_VECTOR
PHMON
CHMON
BHMON
FDTInit
FDTUserModeMicroKernel
CUser_Vectors
* CUserVectors is a long word location with the upper 16 bits set to zero.
14
7.1.4.
MEMORY MAP
H'0000
Vectors
RESET Vector
TRAP Vectors
H'0400
H'04F7
H'0500
H'0BC1
H'0C00
H'0C03
H'1000
H'2D10
FDTInit
FDTUserModeMicr
oKernel
H'0000
H'0001
H'0010
H'0017
HW Break Vector
H'0018
H'0019
SCI Vector
H'002E
H'002F
CUser_Vectors
PHMON
CHMON
On-Chip FLASH
ROM
H'DFFF
H'E800
On-Chip RAM
H'EFFF
H'F700
H'F77F
H'F780
Internal I/O
REGISTERS
On-Chip RAM
H'FC7F
H'FC80
H'FE7C
H'FE7D
H'FE80
H'FF7F
H'FF80
H'EE00
BHMON
Stack
Internal I/O
REGISTERS
15
7.1.5.
BAUD RATE SETTING
HMON has initially set to connect at 115200Baud. Should the user wish to change this, the value for the BRR in
HMONserialconfiguser.c will need to be changed and the project re-built. Please refer to the HMON User Manual for further
information.
7.1.6.
INTERRUPT MASK SECTIONS
The EDK3687 has fixed interrupt priorities. The serial (SCI3 )port interrupt is used by HMON. The Real Time clock, external
interrupt and Timer V interrupts have a higher priority than the serial port. If these interrupts are used HMON may not
function correctly.
7.2. ADDITIONAL INFORMATION
For details on how to use HEW, with HMON, `refer to the HEW manual available on the CD or from the web site.
For information about the H8/3687 series microcontrollers refer to the H8/3687 Series Hardware Manual
For information about the H8/300 assembly language, refer to the H8300 Series Programming Manual
Further information available for this product can be found on the Renesas web site at:
http://www.eu.renesas.com/tools
General information on Renesas microcontrollers can be found at the following URLs.
Global:
http://www.renesas.com/
16