DuPont Riston YM300i

Technical Data
DuPont™ Riston® Technology
YieldMaster® YM300i
Data Sheet & Processing Information
Designed as part of the
YieldMaster® Wet Lamination
System for Superior Yields
Riston YieldMaster YM300i, 30 micron lines and spaces
DS03-96 (02/03) Rev.2
Technical Data
P RODUCT F EATURES / A PPLICATIONS
• Negative working, aqueous processable dry film
photoresist
• Specially developed for use in the YieldMaster® 2000
high performance, high productivity process for
optimum yields.
• Designed for alkaline and acid print & etch applications.
• Fine Line capability with wider exposure latitude, and
reduced sensitivity to off-contact.
• Wide processing latitude.
• Excellent conformation.
P ROCESSING DATA
This Data Sheet documents specific process
information for Riston® YieldMaster YM300i. Data
quoted in this guide have been generated using
production equipment as well as laboratory test
methods, and are offered as a guideline. Actual
production parameters will depend upon the equipment, chemistries, and process controls in use, and
should be selected for best performance. For
more background on general Riston® processing
see the General Processing Guide (DS98-41).
S TORAGE & S AFE L IGHTING
PART 1: C OPPER S URFACES
S URFACE P REPARATION
AND
Riston® YM300i has very strong adhesion on all
surfaces. Riston® YM300i is compatible with the
following surfaces and surface preparations:
• Copper type
Standard copper foil
RTF
Doubletreat
• I/L copper preparation
Pumice
Chemical Clean
One step cleaners
• Panel plated copper
Unscrubbed
Scrubbed
For prelamination cleaning suggestions, see General
Processing Guide and its references.
See recommendations in the General
Processing Guide (DS98-41).
Double-Treated Copper Surfaces
S AFE HANDLING
Normally, no prelamination cleaning is required;
vapor degreasing or chemical cleaning to remove
organics is optional. Tacky roller cleaning is
recommended to remove particles.
Consult the Material Safety Data Sheet (MSDS)
for Riston® dry film photoresist vapors. The vapor
MSDS for this film was prepared using the highest
lamination roll temperature recommended for use.
If you choose to exceed this temperature, be aware
that the amount of vapor may increase and that the
identity of the materials vaporized may vary from
those in the MSDS. For more Safe Handling
information, see publication Technical Bulletin TB9944 "Handling Procedure for DuPont Photopolymer Films".
WASTE DISPOSAL
For questions concerning disposal of photoresist
waste refer to the latest DuPont literature and
Federal, State, and Local Regulations.
DS03-96 (02/03) Rev.2
One Step Cleaners
The following one step cleaners have been used
successfully per manufacturers' processing recommendations:
• Chembond 300
• Duratech SP1000
• Dexter 2116, 2021
• Chromeclean AC-1
(Others may give equally acceptable results)
PART 2: L AMINATION
Riston® YM300i has been formulated to give
excellent conformation in hot roll lamination, with
the YieldMaster® 2000 system.
Lamination Conditions for DuPont HRL-24/
Yieldmaster ® Film Laminator
•
•
•
•
Pre-Heat:
Lam. Roll Temp.:
Roll Speed:
Air Assist Pressure:
Optional
105-120°C (223-245°F)
0.6-1.5 m/min (2-5 ft/min)
0-2.8 bar (0-40 psig)
Note: for >1.4 bar use heavy-duty rolls)
Lamination Conditions for Automatic Sheet
Laminators
•
•
•
•
•
•
•
•
Pre-heat:
Seal Bar Temp.:
Lam. Roll Temp.:
Seal Bar Pressure:
Lam. Roll Pressure:
Seal Time:
Lamination Speed:
Total Water Flow Rate
(YieldMaster® 2000
models):
Optional
50-80°C
100-120°C
3.5-4.5 bar (50-65 psig)
3.0-5.0 bar (43-72 psig)
1-4 seconds
1.5-3 m/min (5-10 ft/min)
necessary.
• Resist wrinkling can be caused by high temperatures.
Decrease roll temperature or eliminate preheat.
• Reduced lamination roll pressure and/or temperature
may be required in tenting applications to avoid tent
breakage and resist flow into through-holes.
• Panels may be exposed immediately after lamination;
however, allow enough time for panels to cool to room
temperature before exposure.
• Note comments under Safe Handling with respect to
exceeding highest recommended lamination roll
temperature.
PART 3: E XPOSURE
Riston® YM300i can be exposed on all standard
equipment used in the printed circuit board industry.
Choose lamps that compliment the peak resist
response of 350 to 380 nm.
YM300i has excellent resolution and wider exposure latitude than many other resists. It is also
more resistant to off-contact exposure defects,
which are common in glass/glass exposure frames.
Resolution below 50 microns (2 mil) lines and
spaces is possible with Riston® YM300i in optimized production environments.
Recommended Exposure Range
YM300i
5-6 cc/min
NOTE: Expected Board Exit Temperature:
RST 25
10-20
SST 21
7-10
mJ/cm2
15-50
Innerlayers: 60-70°C (140-160°F)
(For information on how to use Board Exit Temperature for process control, see General Processing
Guide)
Suggestions:
Note: use distilled water; hard water is acceptable
but may cause scale build up and clog nozzles.
Note:
• RST = DuPont Riston® 25-Step Density Tablet (read
as highest resist step)
General Suggestions
• Start with Roll temperatures of 115°C and adjust as
DS03-96 (02/03) Rev.2
• Start with RST 12-14 < 100 micron L/S.
• Start with RST 15-16 for > 125 microns L/S
• SST 41 = Stouffer 41-Step Sensitivity Guide (read as
highest resist step)
• SST = Stouffer 21-Step Sensitivity Guide (read as
highest resist step)
• Exposure energy (mJ/cm2) from International Light
Radiometer model IL1400A with Super Slim UV Probe
(SSL001A) on an Olec AP30-8000 exposure unit.
• Rinse Spray Nozzles :
PART 4: D EVELOPMENT
NOTE:
Riston®YM300i can be developed in sodium or
potassium carbonate with good productivity. It has
wide development latitude.
Development Recommendations
• Spray Pressure: 1.4-2.2 bar (25-30 psig)
High impact direct-fan or cone nozzles
preferred
• Chemistry:
High Impact, direct fan nozzles preferred
• Drying:
Blow dry thoroughly; Hot air preferred
Dwell Time ranges were established in Chemcut
CS2000 type developer equipment, using potassium
carbonate and 2-10 mil-ft2 /gal (0.07-0.17 m2 /liter)
loading, with all other variables set within the
preferred ranges mentioned above.
Defoamers
Riston® YM300i could require the use of a defoamer. If required, add 0.5 ml/liter (2 ml/gallon) of
one of these antifoams:
FoamFREE™ 940
Dexter DF1205
Na2 CO3 0.7-1.0 wt%; 0.85 wt% preferred
Na2 CO3·H2 O 0.8-1.1 wt%; 1.0 wt% preferred
Pluronic 31R1
Others may work equally well.
K2 CO3 0.8-1.1 wt%; 1.0 wt% preferred
• Temperature:
PART 5: E TCHING
27-35°C (80-95°F); 30°C (85F) preferred
• Breakpoint:
50-65% (60% preferred)
• Dwell Times:
YM300i 22-30 secs
• Riston® YM300i is compatible and strongly resistant
to most alkaline ammonical etch processes.
• YM300i is compatible with most acid etchants, e.g.
cupric chloride (free HCl normality <3.0 N), H2O2/
H2SO4, and ferric chloride.
• Resist Loading:
Feed & Bleed -
4-8 mil-ft2/gal: 0.07-0.14
m2/liter
Batch -
To 12 mil-ft2/gal; to 0.20
m2/liter
• Rinse Water:
Hard water (150-250 ppm
CaCO3 equivalent), or soft water are accept
able
DS03-96 (02/03) Rev.2
PART 6: S TRIPPING
Riston® YM300i is formulated to dissolve slowly in
stripping solution after breaking up into pieces. This
can greatly increase the life of the stripping solution
and reduce costs, if the resist can be removed
before dissolving. Filtration is strongly recommended.
Stripping Recommendations
• Chemistry:
NaOH: 1.5-3 wt%;
faster stripping at 3 wt%
KOH: 1.5-3 wt%;
faster stripping at 3 wt%
Proprietary Strippers: Concentration per vendor
recommendation
Spray Pressures:
1.4-2.4 bar (20-35 psig)
Spray Nozzles:High impact direct fan
Breakpoint:
50% or lower
• Stripper Dwell Times (seconds) at 55°C (130°F). Dwell
time is the total time spent in the stripper, given a 50%
breakpoint:
Chemistry
Defoamers:
Follow recommendations in Development
Section.
Proprietary Strippers :
The following proprietary strippers have been
used successfully for Riston®YM300i.
•
•
•
•
•
RBP ADF-30
Dexter 2210
Dexter RS1607, RS1609
Alphametals PC4046,4089
Durastrip ARS-40
YM300i
Others may perform equally well.
3.0 wt% NaOH
50-70 sec
1.5 wt% KOH
60-90 sec
Proprietary Strippers
30-60 sec
DuPont Electronic Technologies
14 TW Alexander Drive
Research Traingle Park, NC 27709
(919) 248-5000 Tel
(919) 248-5132 Fax
www.dupont.com/et
____________________________
This information corresponds to DuPont’s current knowledge on the subject. It is offered solely to provide possible suggestions
for your own experiments and is not intended to substitute for any testing you may need to conduct to determine the suitability
of DuPont’s products for your particular purposes. This information may be subject to revision as new knowledge and experience
becomes available. Since DuPont cannot anticipate all variations in actual end-use conditions, it makes no warranties and assumes
no liability in connection with any use of this information. Nothing in this publication is to be considered as a license to operate
under or a recommendation to infringe any patent right.
Caution : Do not use in medical applications involving permanent implantation in the human body. For other medical
applications, see “DuPont Medical Caution Statement”, H-51459.
____________________________
DS03-96 (02/03) Rev.2
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