USB Type-C Connectors and Cable Assemblies

Universal Serial Bus
Type-C Connectors
and Cable Assemblies
Compliance Document
Revision 1.2
August 22, 2017
Compliance Document
Revision 1.2
Revision History
Rev
Date
Filename
Comments
Rev 1.0
January 19, 2016
Rev 1.0
Initial release
Rev 1.1
May 28, 2016
Rev 1.1
Add Locking Connector
Rev 1.2
August 22, 2017
Rev 1.2
Updated to reflect base spec Rev 1.3 and ECNs
Please send comments via electronic mail techadmin@usb.org
Copyright © 2017 USB Implementers Forum, Inc. All rights reserved.
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SPECIFICATION. CERTAIN OF THESE COMPANIES MAY HAVE ENTERED INTO AN AGREEMENT
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All product names are trademarks, registered trademarks, or service marks of their respective owners.
August 22, 2017
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Contributors
Company
Name
Advanced-Connectek, Inc.
(ACON)
Glen Chandler
Vicky Chuang
Allion Labs, Inc.
John Lin
Brian Shih
Amphenol Corporation
Apple
Basler AG
Bizlink Technology, Inc.
Chrontel, Inc.
Corning Cable Systems LLC
Dell
Electronics Testing Center,
Taiwan
Foxconn
Google
Hirose Electric Co., Ltd.
Hosiden Corporation
Intel Corporation
I-PEX USA LLC
iST - Integrated Service
Technology Inc.
Japan Aviation Electronics
Industry Ltd. (JAE)
JPC/Main Super Inc.
Lotes Co., Ltd.
Luxshare-ICT
MEC IMEX INC HPT
Microsoft Corporation
Molex Inc.
National Instruments
August 22, 2017
Jeff Chien
Lee (Dick Lee) Ching
Jesse Jaramillo
Mahmoud Amini
Aven Kao
Danny Liao
William Northey
Alan Tsai
Stephen Yang
Zheng Gao
Jennifer Tsai
Frank Hao
Tiffany Hsiao
Weichung Ooi
Chet Dayal
Ian McKay
Jason Chung
Bill Cornelius
Thies Möller
Yiwei Wang
David Meyers
Sophia Liu
Min Kim
Colin Whitby-Strevens
Ernesto Ramirez
Jason Chou
Terry Little
Jie Zheng
Joshua Boilard
Ingrid Lin
Ken Wu
Gourgen Oganessyan
Sid Tono
Hao-Han Hsu
Yun Ling
Hiroaki Ikeda
Toshiyuki Moritake
Toshio Shimoyama
Sam Tseng
Ray Yang
Fred Fons
Bob Hall
Jeffrey Hayashida
William MacKillop
Takahisa Otsuji
Joseph Chen
Kuan-Yu Chen
Hengju Cheng
Tetsuya Tagawa
AJ Yang
Yuan Zhang
Adam Rodriguez
Christine Krause
Xiang Li
Guobin Liu
Li Yuan
Gregory Young
Jeffrey Lee
Masaki Kimura
Mark Ho
Regina Liu-Hwang
Josue Castillo
Daniel Chen
Lisen Chen
Daniel Chen
Mark Saubert
Max Lo
Jason Yang
CY Hsu
Scott Shuey
JinYi Tu
Alan Kinningham
Stone Lin
Marty Evans
Ivan McCracken
Jim Berry
Eric Gross
Kenneth Lee
Masahide Watanabe
Pat Young
Alan MacDougall
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Compliance Document
Revision 1.2
Newnex Technology Corp.
Simon Lee
Sam Liu
Fuwen Xu
Nokia Corporation
Daniel Gratiot
Samuli Makinen
Timo Toivola
Tom Skaar
Dan Smith
Palpilot International Corp.
Point Grey Research Inc.
Seagate
Shenzhen Deren Electronic
Co., Ltd.
SMK Manufacturing Inc.
Synopsys, Inc.
Total Phase
Tyco Electronics Corp.
(TE Connectivity Ltd.)
Western Digital
Technologies, Inc.
August 22, 2017
Alan Li
Pekka Leinonen
Ed Green
Tim Vlaar
Alvin Cox
Lucy Zhang
Harrison Xie
Pekka Talmola
Panu Ylihaavisto
Naoyuki Ono
Morten Christiansen
Tom Holden
Jeff Mason
Cristian Roman Del
Nido
Nathan Tracy
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Revision 1.2
Compliance Document
Table of Contents
1
Introduction ................................................................................................................ 1
1.1
Purpose ....................................................................................................................... 1
1.2
Scope ........................................................................................................................... 1
1.3
Related Documents ..................................................................................................... 1
1.4
Terms and Abbreviations ............................................................................................. 2
2
Overview ..................................................................................................................... 5
3
USB Type-C Compliance Requirements ................................................................. 6
4
Acceptance Criteria, Test Methods and Test Procedures ................................... 15
4.1
Integrators List (IL)..................................................................................................... 15
4.2
USB Logo Usage ....................................................................................................... 15
4.3
Compliance Test Report ............................................................................................ 15
4.4
Connector and Cable Assembly Physical Certification ............................................. 15
4.5
General Information ................................................................................................... 16
4.5.1
Test Fixtures .............................................................................................................. 16
4.5.2
Mated Pairs ................................................................................................................ 16
4.5.3
Before Testing ........................................................................................................... 16
4.5.4
EIA Test Procedures.................................................................................................. 16
4.5.5
Test Sequences ......................................................................................................... 16
4.6
Sample Selection ....................................................................................................... 16
4.7
USB Type-C Compliance Testing Interval ................................................................. 17
4.8
Primary Qualification Approval Testing ..................................................................... 17
4.9
Sustaining Qualification Approval Testing ................................................................. 18
4.10
Compliance Test Sequences ..................................................................................... 18
4.10.1 Inspection (EIA 364-18) ............................................................................................. 18
4.10.2 Test Groups A............................................................................................................ 19
4.10.3 Test Groups B............................................................................................................ 26
5
Certification Acceptance and Submission ........................................................... 35
5.1
Compliance Test Report ............................................................................................ 35
5.2
Listing, Authorization and Notification ....................................................................... 35
5.2.1
Listing ........................................................................................................................ 35
5.2.2
Authorization to use Certified USB Logo(s) and USB Trident Logo(s) ...................... 35
5.2.3
Notification ................................................................................................................. 35
A
Testing by Similarity – General Guidelines .......................................................... 36
B
Critical Dimensions ................................................................................................. 37
C
Current Rating Test ................................................................................................. 46
D
4-Axis Continuity Test ............................................................................................. 49
E
Wrenching Strength Test ........................................................................................ 51
F
Type-C Cable Assemblies Signal Integrity Test Fixtures .................................... 55
F.1 Type-C High Speed Test Card (F.1)................................................................................ 55
F.2 Type-C Low Speed Test Card ........................................................................................ 57
F.3 Legacy USB Test Cards ................................................................................................. 58
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F.4
F.5
G
G.1
G.2
G.3
G.4
G.5
H
H.1
H.2
H.3
I
Revision 1.2
Calibration Card .............................................................................................................. 59
Fixture Design Guidelines ............................................................................................. 60
Type-C Cable Assemblies Signal Integrity Compliance Test Procedures......... 62
Reference Equipment .................................................................................................... 62
Reference Equipment Setup ......................................................................................... 62
SuperSpeed Signal Measurements .............................................................................. 62
USB 2.0 D+/D- Signal Measurements ........................................................................... 63
Low Speed Signal Measurements ................................................................................ 64
Type-C Cable Assemblies Shielding Effectiveness Fixtures .............................. 66
General Board Design Guideline .................................................................................. 67
SMA (Launch Point) Design Guideline ......................................................................... 68
Miscellaneous Design Guideline .................................................................................. 68
Type-C Cable Assemblies Shielding Effectiveness Measurements................... 68
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Table of Tables
Table 3-1
USB Type-C Connector DC Electrical Compliance Requirements............................. 6
Table 3-2
USB Type-C Connector Mechanical and Environmental Compliance Standards .... 7
Table 3-3
USB Type-C Cable Assembly Mechanical and Voltage Drop Compliance
Requirements ................................................................................................................................. 9
Table 3-4
USB Type-C to Type-C Cable Assembly Signal Integrity Compliance Requirements
10
Table 3-5
USB Type-C to Legacy USB Cable Assembly Signal Integrity Compliance
Requirements ............................................................................................................................... 12
Table 3-6
USB Type-C to Legacy USB Adapter Assembly Signal Integrity Compliance
Requirements ............................................................................................................................... 13
Table 3-7
USB Type-C Cable Assembly Shielding Effectiveness Compliance Requirements14
Table 3-8 Special requirements for legacy USB plugs and receptacles used in Type-C to legacy
USB cable assemblies and Type-C to legacy USB adapter assemblies ................................14
Table 4-1
Standard Test Conditions ............................................................................................. 16
Table 4-2
Primary Qualification Approval Testing ...................................................................... 17
Table 4-3
Tests Required for Receptacle, Plug and Assembly Certification ...........................18
Table 4-4 Test Group A-1 (required for all connectors) ................................................................. 20
Table 4-5 Test Group A-2 (required for all connectors) ................................................................. 21
Table 4-6 Test Group A-3 (required for all connectors) ................................................................. 22
Table 4-7 Test Group A-4................................................................................................................... 23
Table 4-8
Test Group A-7 (EIA test groups A-5 and A-6 do not apply to this connector) ......24
Table 4-9
Test Group B-1: Type-C Connector and Cable Assembly Mechanical Tests .........27
Table 4-10 Test Group B-2: USB 2.0 and Low Speed Signal Tests of Type-C Cable and Adapter
Assemblies ................................................................................................................................... 28
Table 4-11 Test Group B-3: USB SuperSpeed Signal Tests of Type-C Cable and Adapter
Assemblies ................................................................................................................................... 31
Table 4-12
Test Group B-4: USB Type-C Cable Assembly Shielding Effectiveness ................32
Table 4-13
Test Group B-5: Critical Dimensions .......................................................................... 33
Table 4-14
Test Group B-6: Connector Pair Current Rating ........................................................34
Table 4-15
Test Group B-7: Plug Connector Wrenching Test .....................................................34
Table C-1 Current Rating Test PCB .................................................................................................. 47
Table D-1 Force and Moment Requirements ................................................................................... 50
Table of Figures
Figure 4-1 Typical Contact Resistance Measurement .................................................................... 26
Figure 4-2 EMC Shielding Spring Tip Requirements ...................................................................... 33
Figure B-1 USB Full-Featured Type-C Plug ..................................................................................... 37
Figure B-2 USB 2.0 Type-C Plug and USB Type-C Power-Only Plug ...........................................39
Figure B-3 Single Screw USB Type-C Locking Plug And Mating Capability Requirement ........41
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Figure B-4 Dual Screw USB Type-C Locking Plug And Mating Capability Requirement ...........42
Figure B-5 USB Type-C Receptacle ................................................................................................. 43
Figure B-6 USB Type-C Receptacle Alternate Section A-A ...........................................................45
Figure C-1 Temperature Measurement Points ................................................................................ 47
Figure C-2 Example Current Rating Test Fixture Trace Configuration- VBUS Trace Length is
limited to 30 mm Max................................................................................................................... 48
Figure D-1 Example of 4-AxIs Continuity Test Fixture ................................................................... 50
Figure E-1 Wrenching Strength Test Fixture................................................................................... 53
Figure E-2 Reference Wrenching Strength Plug Component Part Test Fixture ..........................54
Figure E-3 Reference Wrenching Strength Continuity Test Fixture .............................................54
Figure E-4 Example of Wrenching Strength Test Mechanical failure point .................................55
Figure F-1 Signal connections for high speed signal integrity test fixture .................................56
Figure F-2 Test fixture with PCB tongue as mating interface .......................................................56
Figure F-3 Example of a pad design to lift the plug RFI finger off PCB .......................................57
Figure F-4 Metal shell to enclose the PCB tongue ......................................................................... 57
Figure F-5 Signal connections for low speed signal integrity test fixture ...................................57
Figure F-6 USB 3.1 standard-A receptacle card ............................................................................. 58
Figure F-7 USB 3.1 standard-A plug card ........................................................................................ 58
Figure F-8 USB 3.1 standard B receptacle card .............................................................................. 59
Figure F-9 Calibration card ............................................................................................................... 60
Figure G-1 Type-C connector crosstalk pairs ................................................................................. 63
Figure G-2 Lumped RLC circuit model for VBUS line .................................................................... 65
Figure G-3 Lumped RLC circuit model for VBUS line coupled with a low speed line (e.g., CC)65
Figure H-1 Cable Shielding Effectiveness Measurement Setup....................................................67
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1 Introduction
1.1
Purpose
This document describes mechanical, environmental, and electrical performance criteria and compliance
requirements for USB Type-C connectors and passive cable assemblies, which include:
1.2
•
Type-C receptacles
•
Type-C plugs
•
Type-C to Type-C cables assemblies
•
Type-C to legacy USB cable assemblies
•
Type-C to legacy USB adapter assemblies
Scope
The information provided in this document governs the compliance testing of all USB Type-C connectors
and cables assemblies. It defines how USB Type-C connectors and passive cables assemblies are to be
tested and how the compliance program works.
1.3
Related Documents
ANSI/EIA 364-C
Electrical Connector/Socket Test Procedures Including Environmental
Classifications, approved 1994. Available in hard copy – reference search site
http://www.nssn.org/information.html
ASTM-D-4566
Standard Test Methods for Electrical Performance Properties of Insulations and
Jackets for Telecommunications Wire and Cable. This specification is available
through the World Wide Web site http://www.astm.org/
EIA-364-1000.01
Environmental Test Methodology for Assessing the Performance of Electrical
Connectors and Sockets Used in Business Office Applications
UL STD-94
Test procedures used to classify polymeric materials 94HB, 94V-1, 94V-2, 94-5VA,
94-5VB, 94VTM-0, 94VTM-1, 94VTM-2, 94HBF, 94HF-1, and 94HF-2. This
specification is available through the World Wide Web site http://www.comm2000.com/
UL Subject-444
Type CMP (plenum cable), Type CMR (riser cable), Type CM (commercial cable),
and Type CMX (cable for restricted use. This specification is available through the
World Wide Web site http://www.comm-2000.com/
Universal Serial Bus 2.0
Universal Serial Bus Specification, revision 2.0 (also referred to as the USB
Specification). This specification is available on the World Wide Web site
http://www.usb.org.
Universal Serial Bus 3.1
Universal Serial Bus Specification, revision 3.1. This specification is available on
the World Wide Web site http://www.usb.org.
USB Type-C
Universal Serial Bus Type-C Cable and Connector Specification, Revision 1.1 (also
referred to as the USB Type-C Specification). This specification is available on the
World Wide Web site http://www.usb.org.
August 22, 2017
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1.4
Revision 1.2
Terms and Abbreviations
Term
Description
A2LA
The American Association for Laboratory Accreditation
(A2LA) is a non-profit, professional membership society.
A2LA coordinates and manages a broad-spectrum,
nationwide laboratory accreditation system and offers
training and continuing education in laboratory practices and
management.
A2LA offers accreditation to private, independent (for hirer),
in-house and government testing laboratories in the following
fields: acoustics and vibration; biological; chemical;
construction materials; electrical; environmental; geotechnical;
mechanical; calibration; and, nondestructive and thermal.
ANSI
American National Standards Institute
Approved Integrators List (AIL)
A listing available to USB-IF member companies at
http://www.usb.org listing cable and connector products that
have successfully completed a Voluntary Compliance Testing
program conducted in accordance with the most current
version of the USB Specification’s Electrical, Mechanical and
Environmental Performance Standards and this document.
ASTM
American Society for Testing and Materials.
ASUPS
The acronym for Application Specific USB Product
Specification. An ASUPS describes the unique characteristics
of a special purpose nonstandard USB connector or cable
assembly specification.
C of C
Certificate of Compliance.
Characteristic
A physical, chemical, visual or any other measurable property
of a product or material.
CNLA
Chinese National Laboratory Accreditation
Contact Point
One electrical contact of a multi-contact connector.
CTR
Conformance Test Report
Defect
Any nonconformance of the unit of product with specified
requirements.
Defective Unit
A unit of product that contains one or more defects.
DWG
USB-IF Device Working Group
EIA
Electronic Industries Association.
August 22, 2017
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Revision 1.2
Compliance Document
Term
Description
EMI/RFI
Electro-magnetic Interference/Radio Frequency Interference.
Full-speed
The USB ‘Full-speed’ data signaling rate is 12 Mb/s.
High-speed
The USB ‘High-speed’ data signaling rate is 480 Mb/s.
Low-speed
The USB ‘Low-speed’ data signaling rate is 1.5 Mb/s.
NIST
National Institute of Standards and Technology.
Power Pair
The non-twisted pair of electrical conductors in a USB cable
used to carry power from the ‘host controller’ and/or a ‘selfpowered hub’ to the device. It consists of Vbus and Ground.
SBU
Sideband Use.
Signal Pair (s)
Two electrical conductors that carry differential signals.
SuperSpeed
The USB ‘Super speed’ data rate is 5 Gb/s (USB 3.1 Gen 1).
TID
Test Identification Number.
Type-C Plug
A plug conforming to the mechanical and electrical
requirements in this specification.
Type-C Port
The USB port associated to a USB Type-C receptacle. This
includes the USB signaling, CC logic, multiplexers and other
associated logic.
Type-C Receptacle
A receptacle conforming to the mechanical and electrical
requirements of this specification.
UL
Underwriters Laboratories
Universal Serial Bus
Universal Serial Bus is a serial interconnect bus that supports
transfer rates up to 10 Gbps for a maximum of 127 USB
devices.
USB
Universal Serial Bus (see Universal Serial Bus.)
USB 3.1 Gen 1
The USB data signaling rate is 5 Gb/s.
USB 3.1 Gen 2
The USB data signaling rate is 10 Gb/s.
USB Devices
USB devices may be: ‘Hubs’ that provide attachment points
for USB; or, ‘Functions’ that provide capabilities to the system,
such as an ISDN connection, a digital joystick, a printer,
speakers, et cetera.
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Revision 1.2
Term
Description
USB Host
The USB interface to the host computer system is referred to
as the Host Controller. The Host Controller may be
implemented in a combination of hardware, firmware or
software. A ‘root hub’ is integrated within the host system to
provide one or more attachment points. Additional
information concerning the ‘USB host’ may be found in
Section 4.9 and Chapter 10 of the USB Specification USB 2.0.
USB-IF
USB Implementers Forum is a nonprofit industry organization
made up of original equipment manufacturers (OEMs),
component manufacturers and firmware/software developers
who are actively involved in the advancement of USB
technology. (Please see http://www.usb.org)
USB Topology
The USB connects USB devices with the USB host. The USB
physical interconnection is a tiered star topology. A ‘hub’ is at
the center of each star. Each wire segment is a point-to-point
connection between the ‘host’ and a ‘hub’ or ‘function,’ or a
‘hub’ connected to another ‘hub’ or ‘function.’
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Revision 1.2
Compliance Document
2 Overview
This section is an overview of the contents of this document and provides a brief summary of each of the
subsequent sections. It does not establish any requirements or guidelines.
Section 3 describes USB Type-C Compliance Requirements.
Section 4 describes the acceptance testing criteria and test procedures for USB Type-C connectors and
cable assemblies.
Section 5 describes the Certification, Acceptance and Submission processes.
Appendices provide necessary supporting information for this document.
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Compliance Document
Revision 1.2
3 USB Type-C Compliance Requirements
USB Type-C connectors and passive cable assemblies shall meet or exceed the requirements specified by
the most current version of Chapter 3 of the Universal Serial Bus Type-C Cable and Connector
Specification and applicable Supplements.
Table 3-1 to Table 3-7 summarizes the USB Type-C connector (receptacle and plug) and passive cable
assembly compliance requirements:
•
Table 3-1: USB Type-C connector (receptacle and plug) DC electrical compliance requirements.
•
Table 3-2: USB Type-C connector (receptacle and plug) mechanical and environment compliance
requirements.
•
Table 3-3: Type-C cable assembly mechanical and voltage drop compliance requirements.
•
Table 3-4: Type-C to Type-C cable assembly signal integrity compliance requirements.
•
Table 3-5: Type-C to legacy USB cable assembly signal integrity compliance requirements.
•
Table 3-6: Type-C to legacy USB adapter assembly signal integrity compliance requirements.
•
Table 3-7: Type-C to Type-C cable assemblies, Type-C to legacy USB cable assemblies and Type-C
to Standard-A Receptacle adapter shielding effectiveness compliance requirements.
•
Table 3-8: Special requirements for legacy USB plugs and receptacles used in Type-C to legacy
USB cable assemblies and Type-C to legacy USB adapter assemblies.
Table 3-1
USB Type-C Connector DC Electrical Compliance Requirements
Test Description
Low Level Contact
Resistance (LLCR)
Test Procedure
EIA 364-23
The low level contact resistance (LLCR)
measurement is made across the plug and
receptacle mated contacts and does not include
any internal paddle cards or substrates of the
plug or receptacle. The test boards shall be
provided with the connectors to be tested.
•
Dielectric
Withstanding Voltage
Insulation Resistance
The following requirements apply to the power and signal
contacts:
•
40 mΩ (max) initial for VBUS, GND and all other
contacts.
•
50 mΩ maximum after initial measurement.
Measure at 20 mV (max) open circuit at 100
mA.
EIA 364-20
Applicable to both receptacle and plug.
•
Performance Requirement
The dielectric shall withstand 100 VAC (RMS) for one
minute at sea level after the environmental stress defined in
Table 4-8, Test Group A-7.
Measurement per Method B.
EIA 364-21
Applicable to both receptacle and plug.
A minimum of 100 MΩ insulation resistance is required
between adjacent contacts of unmated and mated
connectors.
See Table 4-8 Test Group A-7.
Contact Current Rating
August 22, 2017
See Appendix C
When current is applied to the contacts, the temperature rise
shall not exceed limit at the location defined in Appendix C.
6
Revision 1.2
Table 3-2
Compliance Document
USB Type-C Connector Mechanical and Environmental Compliance Standards
Test Description
Test Procedure
Performance Requirement
Critical Dimension
Inspection
See Appendix B.
Meet all critical dimension requirements defined in
Appendix B.
Insertion Force
EIA 364-13
Within the range from 5 N to 20 N.
The insertion force test shall be done at a
maximum speed of 12.5 mm (0.492") per minute.
This requirement does not apply to the plugs that are used
for direct docking without a cable.
Extraction Force
EIA 364-13
The extraction force test shall be done at a
maximum speed of 12.5 mm (0.492") per minute.
Within the range of 8 N to 20 N, measured after a
preconditioning of five insertion/extraction cycles (i.e., the
sixth extraction). After an additional twenty-five
insertion/extraction cycles, the extraction force shall be
measured again (i.e., the thirty-second extraction) and the
extraction force shall be within:
a) 33 % of the initial reading, and
b) within the range of 8 N to 20 N.
The extraction force shall be within the range of 6 N to 20 N
after 10,000 insertion/extraction cycles.
This requirement does not apply to the plugs that are used
for direct docking without a cable.
Durability or
Insertion/Extraction
Cycles
EIA 364-09
Wrenching Strength
(Plug-only)
Perpendicular forces are applied to the plug in
four directions (i.e., left, right, up, and down).
10,000 cycles minimum.
Low level contact resistance and dielectric withstanding
voltage shall be checked to be within spec after the 10,000
durability cycles according to Table 4-8, Test Group A-7.
a)
A single plug shall be used for this test. Some
mechanical deformation may occur. The plug
shall be mated with the continuity test fixture
after the test forces have been applied to verify
no damage has occurred that causes discontinuity
or shorting. The Dielectric Withstanding Voltage
test shall be conducted after the continuity test to
verify plug compliance.
b)
A new plug is required for each of the four test
directions. The plug shall disengage from the
test fixture or demonstrate mechanical failure
(i.e., the force applied during the test procedure
peaks and drops off) when a moment of 2.0 Nm is
applied to the plug in the up and down directions
and a moment 3.5 Nm is applied to the plug in
the left and right directions.
A metal fixture with opening and tongue
representative of a receptacle shall be used.
See Appendix E.
See Appendix E.
August 22, 2017
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Compliance Document
Test Description
4-Axes Continuity
Revision 1.2
Test Procedure
See Appendix D for detailed test fixtures and
procedures.
Performance Requirement
No discontinuities greater than 1 microsecond duration in
any of the four orientations tested.
Plug and Receptacle: Subject the mating
interface to the moments defined in Appendix D
for at least 10 seconds.
Temperature Life
EIA 364-17, Method A.
105º C without applied voltage for 120 hours.
Low level contact resistance meets spec before and after the
Temperature Life test.
105º C without applied voltage for 72 hours
when used as preconditioning.
Vibration
EIA 364-28
Test Condition VII, Test Letter D
No evidence of physical damages and no discontinuity
longer than 1 microsecond.
Low level contact resistance meets spec before and after the
Vibration test.
Cyclic Temperature
and Humidity
Thermal Shock
Mixed Flowing Gas
EIA 364-31
Low level contact resistance meets spec before and after the
Cyclic Temperature and Humidity test.
EIA 364-32, Test Condition I
No evidence of any physical damage.
10 Cycles –55OC and +85OC.
Low level contact resistance meets spec before and after the
Thermal Shock test.
EIA 364-65,Class II A
Low level contact resistance meets spec before and after the
Mixed Flowing Gas test.
Samples should be placed in an environmentally
controlled ‘test chamber’ that is monitored by a
gas analyzing system for controlled
concentrations of the specified gas mixture. Test
coupons shall also be used and the weight gain
reported.
Test duration is 7 days.
Notes:
1.
Unless otherwise specified, all tests shall be done with mated connectors.
2.
Legacy USB (mated) connectors mechanical and environmental compliance requirements are governed by the legacy USB
connectors and cable assemblies compliance documents.
August 22, 2017
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Revision 1.2
Table 3-3
Test Description
Cable Flexing
Cable Pull-Out
Compliance Document
USB Type-C Cable Assembly Mechanical and Voltage Drop Compliance
Requirements
Test Procedure
EIA 364-41, Condition I with Dimension X =
3.7 times the cable diameter and 100 cycles
in each of two planes 120 degree arc.
No physical damage and discontinuity over
1 microsecond during flexing shall occur to the cable
assembly
EIA 364-38 Test Condition A
No visible physical damage and no electrical
discontinuity over 1 microsecond to the cable
assembly.
The cable assembly shall be subjected to a
40 N axial load for a minimum of 1 minute
while clamping one end of the cable plug.
Cable Assembly
Voltage Drop
Performance Requirement
The maximum rated VBUS current of the cable
assembly shall be used.
250 mV max for GND and 500 mV max for VBUS.
The measurement includes representative
receptacles at both ends of the cable assembly,
mounted on test fixtures.
The voltage drop measurement is made at the
receptacle contact solder tails and does not
include fixture losses. The plug shell shall be
DC connected to the applied GND through the
receptacle shell and/or receptacle ground bar.
Notes:
1.
All tests are for the Type-C cable assemblies. The mating connectors needed for the testing are considered part of the fixture,
either a representative spec-compliant receptacle or machined metal part.
2.
Legacy USB cable assembly mechanical compliance requirements are governed by the legacy USB cable assembly compliance
documents.
August 22, 2017
9
Compliance Document
Table 3-4
Revision 1.2
USB Type-C to Type-C Cable Assembly Signal Integrity Compliance
Requirements
Test Description
Insertion Loss Fit at Nyquist
Frequencies (ILfitatNq)
Test Procedure
See Appendix G.3.
Performance Requirement
For USB 3.1 Gen 2 SuperSpeed pairs:
≥ −4 dB at 2.5 GHz
≥ −6 dB at 5 GHz
≥ −11 dB at 10 GHz
For USB 3.1 Gen1 SuperSpeed pairs:
≥−7 dB at 2.5 GHz
≥ −12 dB at 5 GHz
Integrated Multi-reflection
(IMR)
See Appendix G.3.
≤ 0.126 ∙ ILfitatNq^2+3.024 ∙ ILfitatNq – 23.392, in dB. For
all SuperSpeed pairs.
Integrated Crosstalk between
SuperSpeed Pairs (INEXT and
IFEXT
See Appendix G.3.
Integrated near-end crosstalk:
INEXT ≤ -40 dB.
Integrated far-end crosstalk:
IFEXT ≤ -40 dB
For all SuperSpeed pairs.
Integrated Crosstalk between
SuperSpeed Pairs and D+/D(IDDXT_1NEXT+FEXT and,
IDDXT_2NEXT)
See Appendix G.3.
Integrated near-end crosstalk to D+/D-:
IDDXT_1NEXT+FEXT ≤ −34.5 dB
Integrated near-end and far-end crosstalk to D+/D-:
IDDXT_2NEXT ≤ −33 dB
For all SuperSpeed pairs.
Integrated Return Loss (IRL)
See Appendix G3.
≤ 0.046∙ ILfitatNq^2 + 1.812 ∙ ILfitatNq – 10.784, in dB. For
all SuperSpeed pairs.
Differential-to -CommonMode Conversion
(SCD12/SCD21)
See Appendix G.3.
≤ -20 dB from 100 MHz to 10 GHz. For all SuperSpeed
pairs.
Differential coupling between
CC and USB D+/D-
See Appendix G.5.
For cable assemblies the limit is defined with the vertices of
(0.3 MHz, -60.5 dB), (1 MHz, −50 dB), (10 MHz, −30 dB), (16
MHz, −26 dB) and (100 MHz, −26 dB) on scale of log10(f) .
Coupling between VBUS and
differential USB D+/D-
See Appendix G.5.
≤ -40 dB for 0.3 MHz < f ≤ 30 MHz, and
Single-ended coupling
between SBU_A and CC,
SBU_B and CC
See Appendix G.5.
The limit is defined with the vertices of (0.3 MHz, -65 dB), (1
MHz, −55 dB), (18 MHz, −30 dB), and (100 MHz, −30 dB) on
scale of log10(f).
Single-ended coupling
between CC and D-
See Appendix G.5.
For USB 2.0 Type-C cables, the singled-ended coupling
between the CC and D− shall be below the limit shown in
Figure 3-49. The limit is defined with the vertices of (0.3
MHz, −48.5 dB), (1 MHz, −38 dB), (10 MHz, −18 dB) and
(100 MHz, −18 dB) on scale of log10(f).
≤ 19.12∙log10(f/30)-40 (in dB) for 30 MHz< f ≤ 100 MHz..
For USB Full-Featured Type-C cables, the singled-ended
coupling between the CC and D− shall be below the limit
shown in Figure 3-50. The limit is defined with the vertices
of (0.3 MHz, −58 dB), (10 MHz, −27.5 dB), (11.8 MHz, −26
dB) and (100 MHz, −26 dB) on scale of log10(f).
August 22, 2017
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Revision 1.2
Test Description
Compliance Document
Test Procedure
Performance Requirement
Single- ended coupling
between SBU_A and SBU_B
See Appendix G.5.
The limit is defined with the vertices of (0.3 MHz, −56.5 dB),
(1 MHz, −46 dB), (10 MHz, −26 dB), (11.2 MHz, −25 dB), and
(100 MHz, −25 dB) on scale of log10(f).
Coupling between
SBU_A/SBU_B and
differential USB D+/D−
See Appendix G.5.
The limit is defined with the vertices of (0.3 MHz, -80 dB),
(30 MHz, −40 dB), and (100 MHz, −40 dB) on scale of
log10(f).
VBUS loop inductance
See Appendix G.5.
≤ 900 nH
Measure the 2-port S-parameters for the
VBUS line and then convert to loop
inductance.
VBUS Capacitance
See Appendix G.5.
Measure the 2-port S-parameters for the
VBUS line and then convert to
capacitances.
Mutual Inductance (M)
between VBUS and Other Low
Speed Signals (CC, SBU_A,
SBU_B, D+ and D-)
D+/D- Pair Differential
Impedance
D+/D- Pair Propagation Delay
See Appendix G.5.
Extract from measured S-parameters.
EIA 364-108 and Appendix G.4.
8 nF to 500 nF each side, not including the by-pass capacitor
on the test fixture. (Does not apply to USB 2.0-only cable
assembly)
See B-2-13 (Table 4-10) for values. The mutual inductance
is defined as:
1
14 + 41 + 23 + 32
 =
 �
�
2
(12 + 21 )(34 + 43
75 ohms min and 105 ohms max
Measured with a 400 ps rise time (20%80%).
EIA 364-103 and Appendix G.4.
20 ns max
Measured with a 400 ps rise time (20%80%) at 50% voltage crossing.
D+/D- Pair intra-pair Skew
EIA 364 – 103 and Appendix G.4.
100 ps max
Measured with a 400 ps rise time (20%80%) at 50% voltage crossing.
D+/D- Pair Attenuation
EIA 364 – 101 and Appendix G.4.
≥ −1.02 dB @ 50 MHz
≥ −1.43 dB @ 100 MHz
≥ −2.40 dB @ 200 MHz
≥ −4.35 dB @ 400 MHz
D+ and D- DC Resistance
Ohmmeter measurement from connector
to connector of the D+ line and the Dline.
3.5 ohms max.
Notes:
1.
USB 2.0-only Type-C to Type-C cable assembly includes only the D+/D- pair, VBUS and CC lines. Only the signal
integrity requirement applicable to those signals shall be tested for such cable assemblies.
August 22, 2017
11
Compliance Document
Table 3-5
Test Description
Revision 1.2
USB Type-C to Legacy USB Cable Assembly Signal Integrity Compliance
Requirements
Test Procedure
D+/D- Pair
Differential
Impedance
EIA 364-108 and Appendix G.4.
D+/D- Pair
Propagation Delay
EIA 364-103 and Appendix G.4.
Performance Requirement
75 ohms min and 105 ohms max.
Measured with a 400 ps rise time (20%80%).
Use a 400 ps rise time (20%-80%) at 50% voltage
crossing.
10 ns max for USB Type-C to Micro-B cable assembly;
20 ns max for all other USB Type-C to legacy USB
cable assemblies.
D+/D- Pair Intrapair Skew
EIA 364 – 103 and Appendix G.4.
100 ps max.
D+/D− Pair
Attenuation
EIA 364 – 101 and Appendix G.4.
Measured with a 400 ps rise time (20%-80%) at
50% voltage crossing.
≥ −1.02 dB @ 50 MHz
≥ −1.43 dB @ 100 MHz
≥ −2.40 dB @ 200 MHz
≥ −4.35 dB @ 400 MHz
D+ and D- DC
Resistance
Ohmmeter measurement from connector to
connector of the D+ line and the D- line.
3.5 ohms max.
VBUS Capacitance
See Appendix G.5.
PD not supported: 8 nF to 12 nF located in the Type-C plug.
(Does not apply to USB
2.0-only cable
assembly)
Measure the 2-port S-parameters for the VBUS
line and then convert to capacitances.
PD supported: 80 pF to 120 pF located in the Type-C
plug
Rd resistor
verification
Measure the resistance between pin A5 and
Ground (pin A1, A12, B1, or B12).
Type-C pin A5 resistance to GND for cable assemblies
with a USB B plug.
Rp resistor
verification
VBUS (pin A4, A9, B4, or B9).
Measure the resistance between pin A5 and
Type-C pin A5 to V BUS resistance for cable assemblies
with a Standard-A plug.
See Appendix G.5.
≥ −4 dB @ 2.5 GHz, except for the USB Type-C plug to USB
Differential Insertion
Loss Fit at Nyquist
Frequencies
(ILfitatNq)
3.1 Standard-A plug cable assembly which is specified as:
≥ −3.5 dB @ 2.5 GHz
≥ −6 dB @ 5.0 GHz
For SuperSpeed pairs only.
Integrated
Differential Multireflection (IMR)
See Appendix G.5.
Integrated
Differential
Crosstalk on
SuperSpeed (ISSXT)
See Appendix G.5.
≤ −37 dB
Integrated
Differential
Crosstalk on D+/D(IDDXT)
See Appendix G.5.
≤ −28.5 dB
Integrated Return
Loss (IRL)
See Appendix G.5.
≤ 0.046∙ ILfitatNq^2 + 1.812 ∙ ILfitatNq – 9.784 (in dB).
Differential-to Common-Mode
Conversion (SCD12
and SCD21)
See Appendix G.5.
August 22, 2017
≤ 0.126 ∙ ILfitatNq^2+3.024 ∙ ILfitatNq – 21.392 (in dB).
For SuperSpeed pairs only.
For SuperSpeed pairs only.
≤ -20 dB from 100 MHz to 10 GHz.
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Compliance Document
Test Description
Test Procedure
Performance Requirement
Notes:
1.
The SuperSpeed pairs is only applicable to Type-C to legacy USB 3.1 l (Gen 2) cable assembly.
Table 3-6
USB Type-C to Legacy USB Adapter Assembly Signal Integrity Compliance
Requirements
Test Description
D+/D- Pair
Differential
Impedance
D+/D- Pair Intrapair Skew
Test Procedure
EIA 364-108
Performance Requirement
75 ohms min and 105 ohms max.
Measured with a 400 ps rise time (20%80%).
EIA 364 – 103
20 ps max.
Measured with a 400 ps rise time (20%-80%) at
50% voltage crossing.
D+/D− Pair
Attenuation
EIA 364 – 101
≥ −0.7 dB @ 400 MHz
D+ and D- DC
Resistance
Ohmmeter measurement from connector to
connector of the D+ line and the D- line.
2.5 ohms max.
VBUS Capacitance
See Appendix G.5.
8 nF to 12 nF located in the Type-C plug.
Measure the 2-port S-parameters for the VBUS
line and then convert to capacitances.
(Does not apply to USB 2.0-only adapter assemblies)
Rd resistor
verification
Measure the resistance between pin A5 and
Ground (pin A1, A12, B1, or B12).
Type-C pin A5 to GND resistance for adapters with a
Standard-A receptacle.
Rp resistor
verification
VBUS (pin A4, A9, B4, or B9).
Measure the resistance between pin A5 and
Type-C pin A5 to VBUS resistance for adapters with a MicroB receptacle:
Differential Insertion
Loss Fit at Nyquist
Frequency (ILfitatNq)
See Appendix G.3.
≥ −2.4 dB at 2.5 GHz and ≥ −3.5 dB at 5.0 GHz
Integrated Differential
Multi-reflection (IMR)
See Appendix G.3.
≤ −34 dB for Tb=200 ps and ≤ -27 dB for Tb=100 ps
See Appendix G.3.
≤ −37 dB
Integrated Differential
Crosstalk on D+/D(IDDXT)
See Appendix G.3.
≤ −30 dB
Integrated Return Loss
(IRL)
See Appendix G.3.
≤ −14.5 dB for Tb=200 ps and ≤ -12.0 dB for Tb=100 ps
Integrated Differential
Crosstalk on
SuperSpeed (ISSXT)
Differential-to Common-Mode
Conversion (SCD12
and SCD21)
See Appendix G.3.
≤ -15 dB from 100 MHz to 7.5 GHz.
Notes:
1.
SuperSpeed pair requirements are only applicable to the USB Type-C to USB Standard-A Receptacle adapter assembly.
2.
Tb is the unit interval – Tb=200 ps is for USB 3.1 Gen 1 and Tb=100 ps is for USB 3.1 Gen 2.
August 22, 2017
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Compliance Document
Table 3-7
Revision 1.2
USB Type-C Cable Assembly Shielding Effectiveness Compliance Requirements
Test Description
USB Type-C to Type-C
(USB 3.1) Cable
Assembly
Test Procedure
See Appendix I
Performance Requirement
Differential model:
≤ -55 dB for f ≤1.6 GHz
≤ -50 dB for 1.6 GHz ≤ f ≤ 4.0 GHz and 5 GHz ≤ f ≤ 6 GHz
Cable Shielding
Effectiveness
Common model:
≤ -40 dB for f ≤ 1.6 GHz
≤ -35 dB for 1.6 GHz ≤ f ≤ 4 GHz and 5 GHz ≤ f ≤ 6 GHz
USB Type-C to USB
Legacy (USB 3.1) Cable
Assembly
See Appendix I.
Differential model:
≤ -49 dB for f ≤1.6 GHz
≤ -44 dB for 1.6 GHz ≤ f ≤4GHz and 5 GHz ≤ f ≤ 6 GHz
Cable Shielding
Effectiveness
Common model:
≤ -34 dB for f ≤1.6 GHz
≤ -29 dB for 1.6 GHz ≤ f ≤ 4 GHz and 5 GHz ≤ f ≤ 6 GHz
Type-C to Standard-A
See Appendix I
Receptacle Adapter
Differential model:
≤ -44 dB for f ≤1.6 GHz
≤ -39 dB for 1.6 GHz ≤ f ≤4 GHz and for
Cable Shielding
Effectiveness
5 GHz ≤ f ≤ 6 GHz
Common model:
≤ -24dB for f ≤1.6 GHz
≤ -24 dB for 1.6 GHz ≤ f ≤ 4 GHz and for 5 GHz ≤ f ≤ 6 GHz
Table 3-8 Special requirements for legacy USB plugs and receptacles used in Type-C to legacy USB
cable assemblies and Type-C to legacy USB adapter assemblies
Test Description
Low Level Contact
Resistance (LLCR)
Contact Current Rating
August 22, 2017
Test Procedure
EIA 364-23B
The low level contact resistance (LLCR)
measurement is made across the plug
and receptacle as defined in the
respective compliance specification for
the legacy connector.
EIA 364-70, Method 2
Performance Requirements
The following requirements apply to the power and
signal contacts of the USB Micro-B mated pair:
20 mΩ (max) initial for VBUS and GND contacts.
30 mΩ maximum after initial measurement.
For USB Standard-A, USB Standard-B, and USB
Micro-B connector mated pairs used in Type-C to
legacy cables and adapter assemblies, when a current
of 3 A is applied to the VBUS pin and its
corresponding GND pin (i.e., pins 1 and 4 in a USB
Standard-A or USB Standard-B connector or pins 1
and 5 in a USB Micro-B connector), the temperature
rise shall not exceed 30⁰C at any point on the
connectors under test when measured at an ambient
temperature of 25⁰C. The manufacturer shall provide
both the receptacle and plug for this test.
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4 Acceptance Criteria, Test Methods and Test Procedures
For a USB Type-C connector or cable assembly product to be listed on the USB-IF Integrators List, the
manufacturer shall show satisfactory completion of all qualification tests specified in the most current
version of the USB Type-C Specification and the USB Type-C Connectors and Cable Assemblies
Compliance Document.
Connector compliance testing includes dimensional inspection, mechanical, environmental and DC
electrical tests but it does not cover signal integrity and shielding effectiveness. A receptacle is
considered part of the host/device from signal integrity and shielding effectiveness perspective.
Type-C cable assemblies and adapters are required to be constructed with certified USB Type-C
connectors to be granted certification at the assembly level. USB 2.0 only cable assemblies may be
constructed with either USB 2.0 Type-C plug connectors or full featured Type-C plug connectors. Type-C
cable assemblies shall be electronically marked as specified in the most current version of the USB Type-C
Specification. The cable assembly electronic marking test methodology may be found at:
http://www.usb.org/developers/tools.
IMPORTANT NOTICE: USB Type-C connectors and cable assemblies shall successfully pass all
inspection procedures and compliance testing at the intervals defined in this document before listing on
the USB-IF Integrators List will be granted.
4.1
Integrators List (IL)
USB-IF maintains a current listing of ‘IL manufacturers and/or fabricators’ who have been authorized to
use the trademarked logo in conjunction with or on their connector and/or cable assembly products. The
USB-IF’s listing of approved manufacturers is periodically updated and is available to all USB-IF member
companies.
4.2
USB Logo Usage
Only products that meet or exceed the compliance test requirements identified in this document at the
time of testing are eligible to display the certified logo provided the product vendor has signed the USB
IF logo trademark license agreement.
4.3
Compliance Test Report
The testing laboratory performing the compliance testing will issue a certified test report concisely
detailing the tests performed. The certified test report shall contain complete test results (inclusive of the
raw data). Upon completion of compliance testing, the certified laboratory shall be responsible for
notifying the USB IF with the products test results. Upon acceptance of the test results confirming
compliance to this document the product will be added to the integrators list.
4.4
Connector and Cable Assembly Physical Certification
In case of conflict between the requirements of this document and the USB Type-C Specification, the most
current revision of the USB Type-C Specification & applicable USB Type-C Supplements shall take
precedence.
Unless otherwise specified, all tests shall be performed at the standard test conditions defined in Table 41.
August 22, 2017
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Compliance Document
Revision 1.2
Table 4-1
Standard Test Conditions
Temperature
15O C to 35O C
Air Pressure
86 to 106 kPa
Relative Humidity
25% to 85%
4.5
General Information
This document shows minimum compliance tests to be performed, and the order in which they shall be
performed and the performance requirements for each test.
4.5.1 Test Fixtures
Most test items for receptacle certification are done in the mated condition with a plug. The plugs used
for receptacle certification shall be provided by the connector vendor or by a USB certified lab. Similarly,
the receptacles necessary to conduct plug certification shall come either from the connector vendor or
from a USB certified lab. For cable assembly certification, all signal integrity and shielding effectiveness
test fixtures shall come from the USB certified lab and be approved by USB-IF.
4.5.2 Mated Pairs
An example of a mated pair is one USB Type-C Receptacle and one USB Type-C Plug and they are tested
as such unless otherwise specified. Typically the USB Type-C Receptacle is ‘fixed’ and the USB Type-C
Plug is ‘free.’ Each ‘receptacle’ and ‘plug’ shall be clearly and individually identified.
Note: ‘Mated connectors’ shall remain together for the duration of the testing sequence. For example,
when ‘un-mating’ is required by a test, the same ‘receptacle and plug pair’ as before shall be mated for
the subsequent tests.
4.5.3 Before Testing
Before testing commences, the specimens shall have been stored for at least 24 hours in the non-inserted
state under standard test conditions, unless otherwise specified.
4.5.4 EIA Test Procedures
Where an EIA test is specified the latest approved revision of that test shall be used.
4.5.5 Test Sequences
All the tests in Table 3-1 and Table 3-2 shall follow the sequences defined in 4.10.
4.6
Sample Selection
The samples to be tested for USB Type-C Certification shall be from a production run of the product.
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Compliance Document
All acceptance tests shall be performed on the minimum number of samples specified in Table 4-2 unless
otherwise specified.
IMPORTANT NOTE: Compliance testing shall be performed at the manufacturer’s expense by a certified
laboratory except for specific Test Groups that are to be performed by the manufacturer as noted in Table
4-3. The certified laboratory shall have direct traceability to a recognized standards organization (e.g.,
A2LA).
4.7
USB Type-C Compliance Testing Interval
Once a connector or cable assembly has been certified it remains certified for the life of the product.
However, any change to the materials, including platings, configuration or dimensions will void
certification of that product. Any modification of the manufacturing process that results to a change in
the product will void the certification. The USB-IF offers a Qualification by Similarity (QbS) program for
re-certification requirements.
4.8
Primary Qualification Approval Testing
The following number of specimens shall be subjected to the tests under the conditions as specified in
Section 3 of this document.
Table 4-2
Test
Group
Primary Qualification Approval Testing
Number of Specimens
Performance Level 1
Connectors
Cable or Adapter
Assembles
Number of Permitted Defects
Inspection
40
25
0
Test Groups A
As required by 4.10.2
n/a
0
Test Group B-1
8
8
0
Test Group B-2
n/a
3
0
Test Group B-3
n/a
3
0
Test Group B-4
n/a
3
0
Test Group B-5
3
3
0
Test Group B-6
3
n/a
0
Test Group B-7
3 (15 total)
3 (15 total)
0
Primary Qualification Approval Testing Notes:
1.
2.
3.
4.
Critical Dimension Inspection of some connectors may require destructive disassembly of the
part for complete dimensional inspection. Critical dimensions for cable or adapter assemblies is
limited to overmold dimensions only.
The vendor is responsible for providing additional plugs (as specified by the test lab) with a cable
of 200mm (or greater length) properly terminated for the test lab’s setup fixtures.
The vendor is responsible for providing additional receptacles (as specified by the test lab)
properly mounted on a printed circuit board for the test lab’s setup fixtures.
Legacy connectors used in cable assemblies and adapter assemblies shall comply with Table 3-8,
as applicable.
August 22, 2017
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Compliance Document
Revision 1.2
Table 4-3 is a summary of tests required for component certification.
Table 4-3
Tests Required for Receptacle, Plug and Assembly Certification
Component
to be
Certified
Test Group
A
Test Group
B-1
Test Group
B-2
Test Group
B-3
Test Group
B-4
Test Group
B-5
Test Group
B-6
Test Group
B-7
Receptacle
√
B-1-3 only
n/a
n/a
n/a
√
√
n/a
Plug
√
B-1-3 only
n/a
n/a
n/a
√
√
√
Cable or
adapter
Assembly
n/a
√
√
√
√
√
n/a
√
Notes:
4.9
1.
The connector manufacturer shall provide USB-IF test results for Test Groups A-1, A-2, A-4, A-5, and A-6. The certified lab
shall perform Test Groups A-3, A-7, and applicable B Test Groups.
2.
Critical dimensions for cable or adapter assemblies is limited to overmold dimensions only.
Sustaining Qualification Approval Testing
USB IF does not require vendors to re-qualify certified products. Please see section 4.7
4.10 Compliance Test Sequences
The following tests shall be performed in the sequence shown.
4.10.1 Inspection (EIA 364-18)
Visual and Dimensional Inspection and Test Group B-5 Critical Dimension Inspection
Because of the inspection criteria similarities between test groups and the fact that data may be collected
during inspections that may halt the subsequent tests, it is recommended the inspection be conducted
concurrently. Representative specimens should be subjected to the following tests to verify that a USB
Type-C connector and/or cable assembly demonstrates sufficient product integrity to be processed
through the remaining product acceptance test procedures/groups.
4.10.1.1 Visual Inspection
The laboratory conducting the compliance testing is required to 100% visually inspect each lot of sample
parts for obvious mechanical defects. Prohibited cable assemblies or connectors are not eligible for
certification. Vendors should be informed of non-compliant configurations.
4.10.1.1.1 Connector Number of Contacts
The number of contacts required for certification of the USB Type-C connector:
Full featured USB Type-C receptacle:
24 contacts: A1 – A12 and B1 – B12.
Type-C USB 2.0 receptacle:
16 contacts: A1, A4, A5, A6, A7, A8, A9, A12, B1, B4, B5, B6, B7, B8, B9, and B12.
August 22, 2017
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Compliance Document
Full featured Type-C plug:
22 contacts: A1 – A12 and B1 – B12, with contacts B6 and B7 depopulated (preferred); or
24 contacts: A1 – A12 and B1 – B12 (not recommended).
USB 2.0-only Type-C plug:
12 contacts A1, A4, A5, A6, A7, A9, A12, B1, B4, B5, B9, and B12 (preferred);
14 contacts A1, A4, A5, A6, A7, A8, A9, A12, B1, B4, B5, B8, B9, and B12 (also includes A8 and B8; SBU_A
and SBU_B) (preferred);
14 contacts A1, A4, A5, A6, A7, A9, A12, B1, B4, B5, B6, B7, B9, and B12 (not recommended); or
16 contacts A1, A4, A5, A6, A7, A8, A9, A12, B1, B4, B5, B6, B7, B8, B9, and B12 (also includes A8 and B8;
SBU_A and SBU_B) (not recommended).
Power-only USB Type-C plug:
9 contacts (A1, A4, A5, A9, A12, B1, B4, B9, and B12).
The laboratory conducting the compliance testing is required to visually verify, where possible, the
number of contacts implemented in the connector.
4.10.1.1.2 Cable Construction
The USB Type-C spec does not have normative requirements for raw or bulk cables. Bulk cable is not
eligible for USB certification.
The cable construction for detachable USB Type-C cable assemblies shall be visually verified. The
certification laboratory shall not conduct cable assembly compliance testing if the cable construction is
not as follows:
•
Cable construction should contain a braided outer shield.
•
Cables shall contain at least a power pair and CC.
•
The USB 2.0 D+/D- pair may be unshielded or shielded.
•
The SuperSpeed conductors shall be shielded (micro-coaxial, shielded twisted pair, or shielded
twin-ax pair).
4.10.1.2 Dimensional Inspection
The laboratory conducting the compliance testing shall measure and record critical dimensions per
Appendix C.
4.10.2 Test Groups A
Test Groups A consists of all the test groups defined in this section. They are based on EIA-364-1000.01,
with some modifications. For the test sequences in each of Test Groups A, unless otherwise stated, at
least 100 separable contact interfaces from at least 5 connectors (i.e., plug/receptacle) should be evaluated
for USB 3.1 Type-C plugs or at least 10 connectors should be evaluated for USB 2.0 Type-C plugs. Test
group A-4 requires twice this sample size due to the mixed flowing gas test methodology.
Except for Test Groups A-3 and A-7, which shall be performed by a USB-IF certified lab, all other tests in
Test Groups A (A-1, A-2, A-4, A-5, and A-6) may be done by the connector manufacturer or at a testing
lab and the test results shall be provided to USB-IF.
August 22, 2017
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Compliance Document
Revision 1.2
Table 4-4 Test Group A-1 (required for all connectors)
Test
Order
1
2
Test
Low level contact
resistance
Durability
(preconditioning)
Test procedure
EIA-364-23
Condition of test
specimens
Mated
Test criteria
40 milliohms max for
all contacts.
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
Baseline measurement.
EIA-364-09
No evidence of
physical damage
Perform 50 unplug/plug cycles.
3
Temperature life
EIA-364-17, method A
Mated
None
Mated
50 milliohms max.
105º C without applied voltage for 120
hours.
4
Low level contact
resistance
EIA-364-23
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
5
Reseating
Manually unplug/plug the connector
or socket. Perform 3 such cycles.
6
Low level contact
resistance
EIA-364-23
No evidence of
physical damage
Mated
50 milliohms max.
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
August 22, 2017
20
Revision 1.2
Compliance Document
Table 4-5 Test Group A-2 (required for all connectors)
Test
Order
1
2
Test
Low level contact
resistance
Durability
(preconditioning)
Test procedure
EIA-364-23
Condition of test
specimens
Mated
Test criteria
40 milliohms max for
all contacts.
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
Baseline measurement.
EIA-364-09
No evidence of
physical damage.
Perform 50 unplug/plug cycles.
3
Thermal shock
EIA-364-32, test condition I
Mated
None.
Mated
50 milliohms max.
Mated
None.
Mated
50 milliohms max.
10 cycles with the exception of
exposure times. Place a thermocouple
in the center of the largest mass
component of the connector that is in
the center of the test chamber to insure
that the contacts reach the temperature
extremes before ramping to the other
temperature.
4
Low level contact
resistance
EIA-364-23
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
5
Cyclic temperature
and humidity
EIA-364-31
Cycle the connector between 25 °C ±3
°C at 80 % ±3% RH and 65 °C ±3 °C at
50 % ±3% RH. Ramp times should be
0.5 hour and dwell times should be 1.0
hour. Dwell times start when the
temperature and humidity have
stabilized within the specified levels.
Perform 24 such cycles.
6
Low level contact
resistance
EIA-364-23
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
7
Reseating
August 22, 2017
Manually unplug/plug the connector
or socket. Perform 3 such cycles.
No evidence of
physical damage.
21
Compliance Document
Test
Order
8
Revision 1.2
Test
Test procedure
Low level contact
resistance
EIA-364-23
Condition of test
specimens
Mated
Test criteria
50 milliohms max.
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
Table 4-6 Test Group A-3 (required for all connectors)
Test
Order
1
2
Test
Low level contact
resistance
Durability
(preconditioning)
Test procedure
EIA-364-23
Condition of test
specimens
Mated
Test criteria
40 milliohms max for
all contacts.
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
Baseline measurement.
EIA-364-09
No evidence of
physical damage.
Perform 50 unplug/plug cycles.
3
Temperature life
(preconditioning)
EIA-364-17, method A
Mated
None.
Mated
50 milliohms max.
Mated
No evidence of
physical damage. No
discontinuities of 1 μS
or longer duration
when mated connector
during test.
Mated
50 milliohms max
105º C without applied voltage for 72
hours when used as preconditioning.
4
Low level contact
resistance
EIA-364-23
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
5
Vibration
EIA-364-28, test condition VII, test
condition letter D
15 minutes in each of 3 mutually
perpendicular directions. Both mating
halves should be rigidly fixed so as not
to contribute to the relative motion of
one contact against another. The
method of fixturing should be detailed
in the test report.
6
Low level contact
resistance
EIA-364-23
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
August 22, 2017
22
Revision 1.2
Compliance Document
Table 4-7 Test Group A-4
Test
Order
1
Test
Low level contact
resistance
Test procedure
EIA-364-23
Condition of test
specimens
Mated
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
2
Durability
(preconditioning)
Test criteria
40 milliohms max for
all contacts.
Baseline measurement.
EIA-364-09
No evidence of
physical damage.
Perform 50 unplug/plug cycles.
3
Temperature life
(preconditioning)
EIA-364-17, method A
Mated
None.
Mated
50 milliohms max.
Mated
Low level contact
resistance meets spec
before and after the
mixed flowing gas test.
Mated
50 milliohms max.
Mated
None.
105º C without applied voltage for 72
hours when used as preconditioning.
4
Low level contact
resistance
EIA-364-23
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
5
Mixed flowing gas
EIA 364-65,Class II A
Samples should be placed in an
environmentally controlled ‘test
chamber’ that is monitored by a gas
analyzing system for controlled
concentrations of the specified gas
mixture. Test coupons shall also be
used and the weight gain reported.
Test duration is 7 days.
6
Low level contact
resistance
EIA-364-23
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
7
Thermal disturbance
August 22, 2017
Cycle the connector or socket between
15 °C ±3 °C and 85 °C ± 3 °C, as
measured on the part. Ramps should
be a minimum of 2 °C per minute, and
dwell times should insure that the
contacts reach the temperature
extremes (a minimum of 5 minutes).
Humidity is not controlled. Perform 10
such cycles.
23
Compliance Document
Test
Order
8
Test
Low level contact
resistance
Revision 1.2
Test procedure
EIA-364-23
Condition of test
specimens
Mated
Test criteria
50 milliohms max.
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
9
Reseating
Manually unplug/plug the connector
or socket. Perform 3 such cycles.
10
Low level contact
resistance
EIA-364-23
No evidence of
physical damage.
Mated
50 milliohms max.
The measurement is made across the
plug and receptacle mated contacts
and does not include any internal
paddle cards or substrates of the plug
or receptacle. See Figure 4-1.
NOTES
1.
2.
Plugs: 1) expose 1/2 of the specimens unmated for 2/3 of the test duration; 2) mate each specimen to the same
receptacle that it was mated to during temperature life (preconditioning); and, 3) expose for the remainder of the test
duration.
Receptacles: 1) expose 1/2 of the specimens unmated for 2/3 of the test duration; 2) mate each specimen to the same
plug that it was mated to during temperature life (preconditioning); and, 3) expose for the remainder of the test
duration.
Table 4-8
Test
Order
Test Group A-7 (EIA test groups A-5 and A-6 do not apply to this connector)
Test
Test Procedure
Condition of Test
Specimens
Test Criteria
1
Dielectric withstanding
voltage
EIA-364-20, 100 VAC (RMS)
Mated
No disruptive discharge.
2
Low level contact
resistance
EIA-364-23
Mated
40 milliohms max for all
contacts.
The measurement is made across
the plug and receptacle mated
contacts and does not include any
internal paddle cards or substrates
of the plug or receptacle. See Figure
4-1.
Durability
(preconditioning)
EIA-364-09
Baseline measurement.
No evidence of physical
damage.
Perform 4 unplug/plug cycles,
followed by an unplug.
3
Insertion force
EIA 364-13
Perform the measurement at a
maximum speed of 12.5 mm
(0.492”) per minute.
August 22, 2017
Within the range of 5 N to
20 N.
24
Revision 1.2
Test
Order
4
Compliance Document
Test
Extraction force
Test Procedure
Condition of Test
Specimens
EIA 364-13
Within the range of 8 N to
20 N.
Perform the measurement at a
maximum speed of 12.5mm (0.492")
per minute.
5
Durability
Initial reading
EIA 364-9
No evidence of physical
damage
Perform 25 plug/unplug cycles.
Cycle rate of –500 ± 50 cycles per
hour followed by a plug.
6
Extraction force
EIA 364-13
Within:
Perform the measurement at a
maximum speed of 12.5mm (0.492")
per minute
7
Durability
EIA 364-9
Extraction force
a)
33% of the initial
reading, and
b)
8 N to 20 N.
No evidence of physical
damage
Perform 2,468 plug/unplug cycles.
Rotate the receptacle or plug 180⁰
and perform 2,500 plug/unplug
cycles. Rotate the receptacle or plug
180⁰ and perform 2,500
plug/unplug cycles. Rotate the
receptacle or plug 180⁰ and perform
2,500 plug/unplug cycles. Cycle
rate of 500 ± 50 cycles per hour
(total of 10,000 plug/unplug cycles,
flipping every 2,500 cycles).
8
Test Criteria
EIA 364-13
Within 6 N to 20 N.
Perform the measurement at a
maximum rate of 12.5mm (0.492")
per minute.
9
Low level contact
resistance
EIA-364-23
Mated
50 milliohms max.
EIA-364-20, 100 VAC (RMS)
Mated
No disruptive discharge
EIA 364-21.
Both unmated and
mated
The measurement is made across
the plug and receptacle mated
contacts and does not include any
internal paddle cards or substrates
of the plug or receptacle. See Figure
4-1.
10
Dielectric withstanding
voltage
11
Insulation Resistance
Applicable to both receptacle and
plug.
A minimum of 100 MΩ
insulation resistance is
required between adjacent
contacts of unmated and
mated connectors
NOTES
1.
2.
Separate sets of test specimens may be used to assess dielectric withstanding voltage and the change in low level
contact resistance.
Dielectric withstanding voltage testing should involve different contacts than low level contact resistance testing.
3.
The durability test requires that the plug be fully dis-engaged or separated from the receptacle during the cycling.
August 22, 2017
25
Compliance Document
Revision 1.2
Figure 4-1 Typical Contact Resistance Measurement
4.10.3 Test Groups B
Test Groups B cover tests not included in 4.10.2. There are a total of seven test groups in Test Groups B,
as defined in the tables of this section.
Cable assemblies shall be identified by the manufacturer regarding their configuration as specified by the
most current version of Chapter 3 of the Universal Serial Bus Type-C Cable and Connector Specification
and applicable Supplements. Verification of compliance with electronic marking, as required (see
Chapter 3 of the Type-C Cable and Connector Specification), shall also be performed. This information is
used to determine the maximum rated currents and signal capability as applicable to various test
procedures (e.g., voltage drop and insertion loss fit at Nyquist).
August 22, 2017
26
Revision 1.2
Compliance Document
Table 4-9
Test Group B-1: Type-C Connector and Cable Assembly Mechanical Tests
Test
Test
Phase
Title
EIA
364
Test
B-1-1
Cable Pull Out
38b
Requirements
Severity or Condition of Test
Apply steady state axial load to the
cable for one minute.
40 N minimum. The cable assembly shall have no
electrical discontinuity and cable shall have no
mechanical separation from connector.
For cable assembly only.
B-1-2
Cable Flex
41
X=3.7 x cable diameter
100 cycles 2 planes
120 degree arc.
No loss of continuity during cycling.
For cable assembly only.
B-1-3
4-Axis
Continuity
n/a
See Appendix D for detailed test
fixture and procedures.
No discontinuities greater than 1 microsecond
duration in any of the four orientations tested.
B-1-4
Voltage drop
n/a
Use the highest rated current for
the cable assembly.
250 mV for GND and 500 mV for VBUS.
Notes:
1.
All tests in this group shall be performed for cable assembly certification.
2.
All tests in this group except for B-1-4 shall be performed for certification of plugs or receptacles attached to cables. The
connector manufacturer is responsible for providing sample connectors with attached cables for testing.
3.
Only the test B-1-3 is required for certification receptacles and plugs not attached to cables. The connector manufacturer is
responsible for providing receptacles mounted on 4-axis continuity test fixtures. See Appendix D.
4.
Tests do not have to be performed according to the sequence listed in the table. Concurrent testing using virgin parts for
each test is allowed.
5.
The voltage drop measurement is made at the receptacle contact solder tails and does not include fixture losses. The plug
shell shall be DC connected to the applied GND through the receptacle shell and/or receptacle ground bar.
August 22, 2017
27
Compliance Document
Table 4-10
Revision 1.2
Test Group B-2: USB 2.0 and Low Speed Signal Tests of Type-C Cable and
Adapter Assemblies
Test
Test
Phase
B-2-1
B-2-2
B-2-3
Title
D+/D-Pair
Attenuation
EIA
364
Test
101
D+/D- Pair
Differential
Impedance
Appendix G.4.
Type-C to Type-C
Type-C to Legacy
Type-C to Legacy
Adapter
≥−1.02 dB @ 50 MHz
≥−1.02 dB @ 50 MHz
≥ −0.7 dB @ 400 MHz
≥−1.43 dB @100 MHz
≥−1.43 dB @100 MHz
≥−2.40 dB @200 MHz
−2.40 dB @200 MHz
≥−4.35 dB @400 MHz
≥−4.35 dB @400 MHz
75 ohms to 105 ohms
75 ohms to 105 ohms
75 ohms to 105 ohms
400 ps (20%-80%)
rise time
103
D+/D- IntraPair Skew
103
B-2-5
Coupling
between CC and
differential USB
D+/D-
90
B-2-6
Coupling
between VBUS
and differential
USB D+/D-
B-2-7
Single- ended
Coupling
between SBU_A
and CC, SBU_B
and CC.
August 22, 2017
Severity or
Condition of Test
Appendix G.4.
D+/D- Pair
Propagation
Delay
B-2-4
Requirements
Appendix G.4.
20 ns max
10 ns max for Type-C
to Micro-B cable
assembly; 20 ns max
for all other Type-C to
legacy USB cable
assemblies.
n/a
100 ps max.
100 ps max.
20 ps max.
Appendix G.5.
For cables the limit is
defined with the
vertices of (0.3 MHz, 60.5 dB), (1 MHz, −50
dB), (10 MHz, −30
dB), (16 MHz, −26 dB)
and (100 MHz, −26
dB) in scale of
log10(f).
n/a
n/a
90
Appendix G.5.
≤ -40 dB for 0.3
MHz<f≤30 MHz, and
≤ 19.12∙log10(f/30)-40
(in dB) for 30 MHz< f
≤ 100 MHz.
n/a
n/a
90
Appendix G.5.
The limit is defined
with the vertices of
(0.3 MHz, -65 dB), (1
MHz, −55 dB), (18
MHz, −30 dB), and
(100 MHz, −30 dB) in
scale of log10(f).
n/a
n/a
400 ps (20%-80%)
rise time at 50%
voltage crossing
Appendix G.4.
400 ps (20%-80%)
rise time at 50%
voltage crossing
28
Revision 1.2
Compliance Document
Test
Test
Phase
B-2-8
Title
Single- ended
Coupling
between CC and
D-
EIA
364
Test
90
Requirements
Severity or
Condition of Test
Appendix G.5.
Type-C to Type-C
Type-C to Legacy
Type-C to Legacy
Adapter
For USB 2.0 Type-C
cables, the singledended coupling
between the CC and
D− shall be below the
limits defined with
the vertices of (0.3
MHz, −48.5 dB), (1
MHz, −38 dB), (10
MHz, −18 dB) and
(100 MHz, −18 dB) in
scale of log10(f).
For USB FullFeatured Type-C
cables, the singledended coupling
between the CC and
D− shall be below the
limits defined with
the vertices of (0.3
MHz, −58 dB), (10
MHz, −27.5 dB), (11.8
MHz, −26 dB) and
(100 MHz, −26 dB) in
scale of log10(f).
B-2-9
Single- ended
Coupling
between SBU_A
and SBU_B.
90
Appendix G.5.
The limit is defined
with the vertices of
(0.3 MHz, −56.5 dB),
(1 MHz, −46 dB), (10
MHz, −26 dB), (11.2
MHz, −25 dB), and
(100 MHz, −25 dB) in
scale of log10(f).
n/a
n/a
B-2-10
Coupling
between SBU_A
/SBU_B and
differential USB
D+/D−
90
Appendix G.5.
The limit is defined
with the vertices of
(0.3 MHz, -80 dB), (30
MHz, −40 dB), and
(100 MHz, −40 dB) in
scale of log10(f).
n/a
n/a
B-2-11
VBUS loop
inductance
n/a
Appendix G.5.
≤ 900 nH.
n/a
n/a
B-2-12
VBUS
Capacitance
n/a
Appendix G.5.
8 nF to 500 nF in each
Type-C plug.
Do not support PD: 8
nF to 12 nF located in
the Type-C plug.
8 nF to 12 nF located in
the Type-C plug.
(Does not apply
to USB 2.0-only
cable assemblies
or USB 2.0
adapter
assemblies.)
August 22, 2017
Support PD: 80 pF to
120 pF located in the
Type-C plug
29
Compliance Document
Revision 1.2
Test
Test
Phase
B-2-13
Title
EIA
364
Test
Requirements
Severity or
Condition of Test
Mutual
Inductance
between VBUS
and Other Low
Speed Signals
(CC, SBU_A,
SBU_B, D+, and
D-)
n/a
B-2-14
Rd resistor
verification
n/a
Measure the
resistance between
pin A5 and Ground
(pin A1, A12, B1, or
B12).
B-2-15
Rp resistor
verification
n/a
B-2-16
D+ and DDC Resistance
n/a
August 22, 2017
Appendix G.5.
Type-C to Type-C
Maximum:
Type-C to Legacy
Type-C to Legacy
Adapter
n/a
n/a
n/a
Type-C pin A5
resistance to GND for
cable assemblies with
a USB B plug.
Type-C pin A5 to GND
resistance for adapters
with a Standard-A
receptacle.
Measure the
resistance between
pin A5 and VBUS
(pin A4, A9, B4, or
B9).
n/a
Type-C pin A5 to
VBUS resistance for
cable assemblies with
a Standard-A plug.
Type-C pin A5 to VBUS
resistance for adapters
with a Micro-B
receptacle:
Ohmmeter
measurement from
connector to
connector of the D+
line and the D- line.
3.5 ohms max.
3.5 ohms max.
2.5 ohms max.
VBUS to CC = 443
VBUS to D+ = 333
VBUS to D- = 333
VBUS to SBU_A = 334
VBUS to SBU_B = 334
30
Revision 1.2
Compliance Document
Table 4-11
Test Group B-3: USB SuperSpeed Signal Tests of Type-C Cable and Adapter
Assemblies
Test
Test
Phase
B-3-1
Title
Insertion Loss
Fit at Nyquist
Frequencies
(ILfitatNq)
Requirements
EIA
364
Test
Severity or
Condition of
Test
n/a
Appendix G.3
Type-C to Type-C
For all USB 3.1 Gen 2
SuperSpeed pairs:
≥ −4 dB at 2.5 GHz
≥ −6 dB at 5 GHz
≥ −11 dB at 10 GHz
For USB 3.1 Gen 1
SuperSpeed pairs:
Type-C to Legacy
≥ −4 dB @ 2.5 GHz,
except for the USB
Type-C plug to USB
Type-C to Legacy
Adapter
≥ −2.4 dB at 2.5 GHz and
≥ −3.5 dB at 5.0 GHz
3.1 Standard-A plug
cable assembly which
is:
≥ −3.5 dB @ 2.5 GHz
≥ −6 dB at 5 GHz
≥−7.0 dB at 2.5 GHz
≥ −12 dB at 5 GHz.
B-3-2
Integrated
Multi-reflection
(IMR)
n/a
Appendix G.3
≤ 0.126 ∙ ILfitatNq^2+
3.024 ∙ ILfitatNq –
23.392, in dB.
≤ 0.126 ∙ ILfitatNq^2+
3.024 ∙ ILfitatNq –
21.392, in dB
≤ −34 dB for Tb=200 ps
and ≤ −27 dB for Tb=100
ps
B-3-3
Integrated
Crosstalk on
SuperSpeed
Pairs (INEXT
and ISSXT)
n/a
Appendix G.3
Integrated near-end
crosstalk:
ISSXT ≤ −38 dB
ISSXT ≤ −37 dB
Integrated
Crosstalk
between
SuperSpeed
Pairs and D+/D(IDDXT_1NEXT
+FEXT and,
IDDXT_2NEXT)
n/a
n/a
n/a
B-3-4
INEXT ≤ −40 dB to
12.5GHz, for Tx1 to
Rx1, Tx2 to Rx2, TX1 to
RX2, TX2 to RX1, TX1
to TX2, and RX1 to RX2
Appendix G.3
Integrated near-end
crosstalk to D+/D-:
IDDXT_2NEXT ≤
−33 dB
Integrated near-end and
far-end crosstalk to
D+/D-:
IDDXT_1NEXT+FEXT ≤
−34.5 dB
For all SuperSpeed pairs.
B-3-5
Integrated
Differential
Crosstalk on
D+/D- (IDDXT)
n/a
Appendix G.3
n/a
≤ −28.5 dB
≤ -30 dB
B-3-6
Integrated
Return Loss
(IRL)
n/a
Appendix G.3
Differential-to Common-Mode
Conversion
(SCD12/SCD21)
n/a
Appendix G.3
≤ 0.046∙ ILfitatNq^2
+ 1.812 ∙ ILfitatNq –
9.784in dB
≤ −14.5 dB for Tb=200 ps
and ≤ -12.0 dB for
Tb=100 ps
B-3-7
≤ 0.046∙ ILfitatNq^2 +
1.812 ∙ ILfitatNq –
10.784in dB
August 22, 2017
≤ -20dB from 100 MHz to
10 GHz
≤ -20dB from 100
MHz to 10 GHz
≤ -15dB from 100 MHz to
7.5GHz
31
Compliance Document
Table 4-12
Revision 1.2
Test Group B-4: USB Type-C Cable Assembly Shielding Effectiveness
Test
Test
Phase
B-4-1
Title
Cable Shielding
Effectiveness
EIA
364
Test
n/a
Requirements
Severity or
Condition of Test
Type-C to Type-C
Type-C to Standard-A
Receptacle Adapter
Appendix I
Differential model:
Differential model:
Differential model:
≤-55 dB for f ≤1.6 GHz
≤ -49 dB for f ≤1.6 GHz
≤ -44 dB for f ≤1.6 GHz
≤ -50dB for 1.6 GHz ≤
f ≤ 4.0 GHz and for
≤ -44 dB for 1.6 GHz ≤ f
≤4 GHz and for
≤ -39 dB for 1.6 GHz ≤ f
≤4 GHz and for
5 GHz ≤ f ≤ 6 GHz
5 GHz ≤ f ≤ 6 GHz
5 GHz ≤ f ≤ 6 GHz
Common model:
Common model:
Common model:
≤-40 dB for f≤1.6 GHz
≤ -34 dB for f ≤1.6 GHz
≤ -24dB for f ≤1.6 GHz
≤ -35 dB for 1.6 GHz ≤
f ≤ 4 GHz and for
≤ -29 dB for 1.6 GHz
≤ f ≤ 4 GHz and for
5 GHz ≤ f ≤ 6 GHz
≤ -24 dB for 1.6 GHz ≤ f
≤ 4 GHz and for 5 GHz
≤ f ≤ 6 GHz
5 GHz ≤ f ≤ 6 GHz
August 22, 2017
Type-C to Legacy
32
Revision 1.2
Compliance Document
Table 4-13
Test Group B-5: Critical Dimensions
Test
Test
Phase
Title
EIA
364
Test
B-5-1
Critical
Dimensions
18
B-5-2
EMC Shielding
Spring
Inspection
n/a
Severity or
Condition of Test
Common
Requirements
See Appendix B
All dimensions for component
level qualification and
overmold only for cable and
adapter assemblies.
Visual inspection for
compliance with
Figure 4-2
No EMC shielding spring
finger tip of the USB FullFeatured Type-C plug or USB
2.0 Type-C plug shall be
exposed in the plug housing
opening of the unmated TypeC plug.
Figure 4-2 EMC Shielding Spring Tip Requirements
August 22, 2017
33
Compliance Document
Revision 1.2
Table 4-14
Test Group B-6: Connector Pair Current Rating
Test
Test
Phase
B-6-1
EIA
364
Test
Title
Contact Current
Rating
Table 4-15
n/a
Severity or
Condition of Test
See Appendix C
Common
Requirements
When current is applied to the
contacts, the temperature rise
shall not exceed 30°C at the
outside surface of the shell.
This requirement applies to
the USB Type-C connector
mated pair only.
Test Group B-7: Plug Connector Wrenching Test
Test
Test
Phase
B-7-1
EIA
364
Test
Title
Wrenching
Strength
n/a
Severity or
Condition of Test
Perpendicular
forces are applied
to the plug in four
directions (i.e.,
left, right, up, and
down).
Common
Requirements
The plug shall be mated with
the continuity test fixture after
the test forces have been
applied to verify no damage
has occurred that causes
discontinuity or shorting.
A metal fixture
with opening and
tongue
representative of a
receptacle shall be
used.
See Appendix E.
B-7-2
Continuity
n/a
See Appendix E.
No discontinuities or shorts
allowed.
B-7-3
Dielectric
withstanding
voltage
20
Mated, 100 VAC
(RMS)
No disruptive discharge
B-7-4
Wrenching
Strength
n/a
Perpendicular
forces are applied
to the plug in four
directions (i.e.,
left, right, up, and
down).
The plug shall disengage from
the test fixture or mechanically
fail (as defined in Appendix E)
when a moment of 2.0 Nm is
applied in the up and down
directions and a moment 3.5
Nm is applied in the left and
right directions.
A metal fixture
with opening and
tongue
representative of a
receptacle shall be
used.
See Appendix E.
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5 Certification Acceptance and Submission
Manufacturers of USB Type-C connectors and/or cable/adapter assemblies desiring to have a product or
products listed on the USB Implementers’ Forum (USB-IF) Integrators List (IL) are required to submit
‘certified proof’ that their USB Type-C product meets or exceeds the performance requirements specified
in the most current version of the USB Type-C Specification and this document. Certified proof of
compliance shall be in the form of a Compliance Test Report (CTR) completed by an A2LA /CNLA or
equivalent certified testing laboratory per IEC/ISO 17025.
5.1
Compliance Test Report
Upon successful completion of the compliance testing, the certified laboratory performing the specified
tests will issue formal compliance test report. This confidential report will only be available to the
manufacturer, test laboratory submitting the report and USB-IF Administration.
5.2
Listing, Authorization and Notification
5.2.1 Listing
Upon successful completion of the compliance testing, the certified laboratory performing the specified
tests will provide the USB IF Administration the test results. Upon approval by the USB IF
Administration of the test results, the product (s) will be added to the integrators list. The manufacturer
has the option whether to display their certified products via the integrators list to the USB IF
membership.
5.2.2 Authorization to use Certified USB Logo(s) and USB Trident Logo(s)
Products that are listed on the USB IF Integrators List may use the Certified USB Logo(s) and USB Trident
Logo(s) provided that the manufacturer has executed the USB IF Trademark License Agreement and it is
on file with USB-IF. Possession of a TID does not indicate that a product is certified. Only products that
are listed on the integrators list are certified.
If a manufacturer wishes to use the trademarked Certified USB Logo(s) or USB Trident Logo(s) on more
than one USB Type-C product, each product displaying the Certified USB Logo(s) or USB Trident Logo(s)
shall have successfully completed the Compliance Testing Program, shall have a TID assigned by USB-IF,
and have each product listed on the integrators list.
Only upon receiving official USB-IF Notification and executing the USB-IF Trademark License Agreement
is the product authorized to bear the Certified USB Logo(s) or USB Trident Logo(s) on the listed product.
5.2.3 Notification
The manufacturer of record will be notified by E-mail that their product has been listed.
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Appendices
This document is developed as a ‘living document.’ In order to provide system engineers and
designers the most current USB Type-C cable and connector information, USB-IF Device Working
Group members may from time to time choose to add additional useful information to this
document, e.g., listings of international laboratories capable of performing approval testing, et
cetera.
A Testing by Similarity – General Guidelines
Not all USB Type-C connector and cable assembly products have to go through the full compliance
tests. Certain tests may be exempted if a similar USB Type-C product is already certified. Below are
some general guidelines for Testing by Similarity:
1) If a new USB Type-C connector product has an identical mating interface (both design and
material) to another USB Type-C connector that has already been certified, then all the tests
associated to the mating interface may be exempted. For example, if a company A has a
certified through-hole USB Type-C connector and it then adds a SMT part into the product
line with the only difference being the soldering feature, then no new certification is required,
provided that the connector vendor has verified the performance of the soldering features
and signal integrity.
2) If a new Type-C cable assembly has the same mating interface and wire termination (both
design and material) as another USB Type-C cable assembly that has been already fully
tested and certified, then it is not necessary to do the full compliance testing:
August 22, 2017
a.
All the tests from the Group A are waived since the new cable assembly has the
identical mating interface and material from the certified cable assembly.
b.
Tests in test groups B-1, B-4, B-5 and B-6 are waived.
c.
Only the Test Groups B-2 and B-3 are required for the new cable assembly, if the new
cable assembly is longer than the certified cable assembly.
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B Critical Dimensions
The critical dimensions and tolerances for the Type-C connectors are defined in this section with the
circles marked near them.
USB full-featured Type-C plug
Figure B-1 USB Full-Featured Type-C Plug
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DESCRIPTION
Revision 1.2
DIMENSION
+ TOL
-
TOL
12.35 max
n/a
n/a
1.72 min
n/a
n/a
0.530
0.025
0.025
0.08 with datum A/B/C
n/a
n/a
1.
Plug overmold/insulator width
2.
EMC finger location
3.
EMC middle finger width
4.
EMC finger position tolerance
5.
Plug opening in y-direction
6.830
0.025
0.025
6.
Plug width
8.25
0.03
0.03
7.
Plug width (centerline) position tolerance
0.04 with datum A/B/C
n/a
n/a
8.
Contact point of EMC finger
0.81
0.15
0.10
9.
EMC finger contact height
0.18 min
n/a
n/a
0.27 min
n/a
n/a
11. Signal contact width
0.140 min and 0.245 max
n/a
n/a
12. Signal contact width position tolerance
0.08 with datum A/B/C
n/a
n/a
0.84
0.25
0.05
6.5 max
n/a
n/a
15. Plug length
6.65
0.10
0.10
16. Plug thickness
2.40
0.03
0.03
17. Plug thickness opening
1.300
0.025
0.025
0.05 with datum A/B/C
n/a
n/a
0.800
0.025
0.025
1.78 min and 2.10 max
n/a
n/a
10. Signal contact height
(top and bottom contacts shall not touch)
13. Outer EMC finger width
14. Plug overmold/insulator height
18. Plug thickness opening position tolerance
19. Plug tongue opening
20. Metal opening
Notes:
1.
All dimensions are in millimeters.
2.
For cable and adapter assemblies, only verify overmold/insulator dimensions 1, 14, and 15.
3.
Dimensions 1, 14, and 15 only apply if the overmold/insulator is present.
4.
All dimensions except 1 and 14 apply to the USB Type-C locking plug. See Figure B-3 and Figure B-4 for additional USB
Type-C locking plug requirements.
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USB 2.0 Type-C Plug and USB Type-C Power-Only Plug
Figure B-2 USB 2.0 Type-C Plug and USB Type-C Power-Only Plug
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DESCRIPTION
Revision 1.2
DIMENSION
+ TOL
12.35 max
n/a
n/a
1.72 min
n/a
n/a
3. EMC finger width1
0.250
0.025
0.025
4. Plug opening in width direction
6.830
0.025
0.025
5. Plug width
8.25
0.03
0.03
0.04 with datum A/B/C
n/a
n/a
0.81
0.15
0.10
8. EMC finger contact height1
0.18 min
n/a
n/a
9. Signal contact height
(Top and bottom contacts shall not touch)
0.27 min
n/a
n/a
10. Signal contact width
0.140 min and 0.245 max
n/a
n/a
11. Signal contact width position tolerance
0.08 with datum A/B/C
n/a
n/a
6.5 max
n/a
n/a
13. Plug length
6.65
0.10
0.10
14. Plug thickness
2.40
0.03
0.03
15. Plug opening in thickness direction
1.300
0.025
0.025
0.05 with datum A/B/C
n/a
n/a
0.800
0.025
0.025
1.78 min and 2.10 max
n/a
n/a
1. Plug overmold/insulator width
2. EMC finger location1
6. Plug width (centerline) position tolerance
7. Contact point of EMC finger1
12. Plug overmold/insulator height
16. Plug opening position tolerance
17. Plug tongue opening
18. Metal opening
-
TOL
Notes:
1.
All values are in millimeters.
2.
Full-featured plug EMC fingers may be used in the USB 2.0 Type-C plug or USB Type-C power-only plug. If the
full-feature EMC fingers are present, substitute critical dimensions 2, 3, 4, 8, and 9 from the full-featured plug for
critical dimensions 2, 3, 7, and 8.
3.
For cable and adapter assemblies, only verify overmold/insulator dimensions 1, 12, and 13.
4.
Dimensions 1, 12, and 13 only apply if the overmold/insulator is present.
5.
All dimensions except 1 and 12 apply to the USB Type-C locking plug. See Figure B-3 and Figure B-4 for
additional USB Type-C locking plug requirements.
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Single Screw USB Type-C Locking Plug Additional Dimensional Requirements
Figure B-3 Single Screw USB Type-C Locking Plug And Mating Capability Requirement
DESCRIPTION
DIMENSION
+ TOL
- TOL
3.5
0.25
0.25
2. Plug overmold/insulator height
13.5 max
n/a
n/a
3. Plug overmold/insulator width
12.35 max
n/a
n/a
1. Screw protrusion
Notes:
1.
2.
3.
4.
All values are in millimeters.
Dimensions apply to both full-featured and USB 2.0 Type-C locking plugs.
Dimension 1 is the maximum screw protrusion. The screw threads shall also retract to flush or below the
overmold/insulator surface.
The connector shall mount to receptacle and the screw shall properly engage with the threaded hole when the receptacle
and hole comply with the dimensions shown in the figure and the screw is oriented on the same side of the receptacle
as the threaded hole.
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Dual Screw USB Type-C Locking Plug Additional Dimensional Requirements
Figure B-4 Dual Screw USB Type-C Locking Plug And Mating Capability Requirement
DESCRIPTION
DIMENSION
+ TOL
- TOL
3.5
0.25
0.25
2. Plug overmold/insulator height
6.5 max
n/a
n/a
3. Plug overmold/insulator width
20.00 max
n/a
n/a
1. Screw protrusion
Notes:
1.
2.
3.
4.
All values are in millimeters.
Dimensions apply to both full-featured and USB 2.0 Type-C locking plugs.
Dimension 1 is the maximum screw protrusion. The screw threads shall also retract to flush or below the
overmold/insulator surface.
The connector shall mount to receptacle and the screw shall properly engage with the threaded hole when the receptacle
and hole comply with the dimensions shown in the figure and the screw is oriented on the same side of the receptacle
as the threaded hole.
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USB Type-C receptacle
Figure B-5 USB Type-C Receptacle
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Receptacle critical dimensions for receptacles using SECTION A-A if Figure B-5:
DESCRIPTION
DIMENSION
+ TOL
-
8.34
0.06
0.02
0.04 with datum A/B/C
n/a
n/a
TOL
1.
Receptacle inside opening
2.
Receptacle insider opening position tolerance
3.
Receptacle signal pin length
3.50
0.15
0.15
4.
Pin length delta
0.50
0.20
0.20
5.
Tongue width
6.690
0.045
0.055
6.
Contact width
0.25
0.04
0.04
7.
Contact width position tolerance
0.08 with datum A/B/C
n/a
n/a
8.
Tongue thickness
0.70
0.05
0.05
9.
Receptacle inside thickness
2.56
0.04
0.04
Notes:
1.
All dimensions are in millimeters.
The Type-C specification allows receptacle configurations with a conductive shell, a non-conductive
shell, or no shell. The following requirements apply to the receptacle contact dimensions shown in
SECTION A-A and ALTERNATE SECTION A-A shown in Figure B-5 and Figure B-6.
• If the receptacle shell is conductive, then the receptacle contact dimensions of SECTION A-A shown
in Figure B-5 shall be used. The contact dimensions of ALTERNATE SECTION A-A in Figure B-6 are
not allowed.
• If the receptacle shell is non-conductive, then the receptacle contact dimensions of ALTERNATE
SECTION A-A shown in Figure B-6 shall be used. The contact dimensions of SECTION A-A in Figure
B-5 are not allowed.
• If there is no receptacle shell, then the receptacle contact dimensions of either SECTION A-A in
Figure B-5 or ALTERNATE SECTION A-A shown in Figure B-6 may be used.
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ALTERNATE SECTION A-A
Figure B-6 USB Type-C Receptacle Alternate Section A-A
Receptacle critical dimensions for receptacles using Alternate SECTION A-A in Figure B-6:
DESCRIPTION
DIMENSION
+ TOL
-
TOL
1.
Receptacle inside
opening
8.34
0.06
0.02
2.
Receptacle insider
opening position
tolerance
0.04 with datum A/B/C
n/a
n/a
3.
Receptacle signal pin
length
3.45
0.10
0.10
4.
Pin length delta
0.20
0.10
0.10
5.
Tongue width
6.690
0.045
0.055
6.
Contact width
0.25
0.04
0.04
7.
Contact width position
tolerance
0.08 with datum A/B/C
n/a
n/a
8.
Tongue thickness
0.70
0.05
0.05
9.
Receptacle inside
thickness
2.56
0.04
0.04
0.35
0.10
0.10
10. Pin length delta
Notes:
2.
All dimensions are in millimeters.
3.
These dimension are defined in Figure B-3 except for substitution of ALTERNATE SECTION A-A in Figure B-6 for
SECTION A-A in Figure B-5.
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C Current Rating Test
The current rating testing for the Type-C connector (plug and receptacle) shall be conducted per the
following set up and procedures:
•
A current of 5 A shall be applied collectively to VBUS pins (i.e., pins A4, A9, B4, and B9) and 1.25
A shall be applied to the VCONN pin (i.e., B5) as applicable, terminated through the corresponding
GND pins (i.e., pins A1, A12, B1, and B12). A minimum current of 0.25 A shall also be applied
individually to all the other contacts, as applicable. When current is applied to the contacts, the
temperature of the connector pair shall be allowed to stabilize. The temperature rise of the
outside shell surface of the mated pair above the VBUS and GND contacts shall not exceed 30⁰C
above the ambient temperature. Figure C- provides an illustration of the measurement locations.
•
The measurement shall be done in still air.
•
The connectors shall be oriented such that the accessible outer shell surface is on top and
horizontal to the ground.
•
The plug and receptacle may require modification to access solder tails or cable attachment
points.
•
Either thermocouple or thermo-imaging (preferred) method may be used for temperature
measurement.
•
For certification, the connector manufacturer shall provide the receptacle and plug samples under
test mounted on a current rating test PCB with no copper planes. A cable plug may use short
wires to attach the cable attachment points together rather than using a current rating test PCB.
o
The current rating test PCBs should be of 2-layer construction. If 2-layer construction is
not possible due to the solder tail configuration, VBUS and ground traces shall be located
on the outer layers with the inner layers reserved for signal traces, as required; VCONN
traces may be routed either on internal or external layers. Table C-1 defines the
requirements for the test PCB thickness and traces. The trace length applies to each PCB
(receptacle PCB and plug PCB) and is from the contact terminal to the current source tie
point. Figure C-2 provides an informative partial trace illustration of the current rating
test PCB.
o
If short wires are used instead of a current rating test PCB, the wire length shall not
exceed 70 mm, measured from the plug contact solder point to the other end of the wire.
There shall be no paddle card or overmold included in the test set-up. Each plug solder
tail shall be attached with a wire with the wire gauge of AWG 36 for signals, AWG 32 for
power (VBUS and VCONN), and AWG 30 for ground.
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Measurement Point:
Receptacle shell top
when a receptacle
with a conductive
shell is used
Measurement Point:
Plug shell top when
receptacles with a
non-conductive shell
or no shell is used
Figure C-1 Temperature Measurement Points
Table C-1 Current Rating Test PCB
Item
Trace width (mm)
Trace length (mm)
on each PCB
Thickness
Signal trace
0.25 max.
13 max.
35 µm (1 oz. copper)
Ground trace
1.57 max.
38 max.
35 µm (1 oz. copper)
VBUS and VCONN
1.25 max.
30 max.
35 µm (1 oz. copper)
N/A
N/A
0.80 – 1.20 mm
PCB
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Figure C-2 Example Current Rating Test Fixture Trace Configuration- VBUS Trace Length is
limited to 30 mm Max
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D 4-Axis Continuity Test
The USB Type-C connector family shall be tested for continuity under stress using a test fixture shown in
Figure E or equivalent.
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Figure D-1 Example of 4-AxIs Continuity Test Fixture
Plugs shall be supplied with a representative overmold or mounted on a 2-layer printed circuit board
(PCB) between 0.8 mm and 1.0 mm thickness as applicable. A USB Type-C receptacle shall be mounted
on a 2-layer PCB between 0.8 mm and 1.0 mm thickness. The PCB shall be clamped on three sides of the
receptacle no further than 5 mm away from the receptacle outline. The receptacle PCB shall initially be
placed in a horizontal plane, and a perpendicular moment shall be applied to the plug with a 5 mm ball
tipped probe for a period of at least 10 seconds at a distance of 15 mm from the mating edge of the
receptacle shell in a downward direction, perpendicular to the axis of insertion. See Table D-1 for the
force and moment to be applied.
Table D-1 Force and Moment Requirements
Receptacle configuration with
respect to mounting surface
Force at 15 mm from receptacle
shell mating edge (N)
Moment with respect to
receptacle shell mating edge
(Nm)
Right angle
20
0.30
Vertical
8
0.12
The continuity across each contact shall be measured throughout the application of the tensile force. Each
non-ground contact shall also be tested to confirm that it does not short to the shell during the stresses.
The PCB shall then be rotated 90 degrees such that the cable is still inserted horizontally and the tensile
force in Table D-1 shall be applied again in the downward direction and continuity measured as before.
This test is repeated for 180 degree and 270 degree rotations. Passing parts shall not exhibit any
discontinuities or shorting to the shell greater than 1 μs duration in any of the four orientations.
One method for measuring the continuity through the contacts is to short all the wires at the end of the
cable pigtail and apply a voltage through a pull-up to each of VBUS, USB D+, USB D−, SBU, CC, and USB
SuperSpeed pins, with the GND pins connected to ground. Alternate methods are allowed to verify
continuity through all pins.
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E Wrenching Strength Test
Type-C plugs on cable assemblies and fixtured plug component parts without overmold shall be
tested using the mechanical wrenching test fixture, as illustrated in Figure E-1. The fixture
substitutes machined metal parts for the receptacle. For plug component part testing, the supplier
shall provide a plug test fixture that conforms to the specified plug overmold dimensions for the
Type-C plug. See Figure E-2. The fixture may be metal or other suitable material. Perpendicular
moments are applied to the plug with a 5 mm ball tipped probe for a period of at least 10 seconds
when inserted in the test fixture to achieve the defined moments in four directions of up or down
(i.e., perpendicular to the long axis of the plug opening) and left or right (i.e., in the plane of the plug
opening). Compliant connectors shall meet the following force thresholds:
a) A moment of 0-0.75 Nm (e.g., 50 N at 15 mm from the edge of the receptacle) is applied to a
plug inserted in the test fixture in each of the four directions. A single plug shall be used for
this test. Some mechanical deformation may occur. The plug shall be mated with the
continuity test fixture after the test forces have been applied to verify no damage has
occurred that causes discontinuity or shorting. The continuity test fixture shall provide a
planar surface on the mating side located 6.20 ± 0.20 mm from the receptacle Datum A,
perpendicular to the direction of insertion. No moment forces are applied to the plug during
this continuity test. Figure E-3 illustrates an example continuity test fixture to perform the
continuity test. The Dielectric Withstanding Voltage test shall be conducted after the
continuity test to verify plug compliance.
b) The plug shall disengage from the test fixture or demonstrate mechanical failure (i.e., the
force applied during the test procedure peaks and drops off) when a moment of 2.0 Nm is
applied to the plug in the up and down directions and a moment 3.5 Nm is applied to the
plug in the left and right directions. A new plug is required for each of the four test
directions. An example of the mechanical failure point is shown in Figure E-4.
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c)
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Figure E-1 Wrenching Strength Test Fixture
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Figure E-2 Reference Wrenching Strength Plug Component Part Test Fixture
Figure E-3 Reference Wrenching Strength Continuity Test Fixture
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Figure E-4 Example of Wrenching Strength Test Mechanical failure point
F Type-C Cable Assemblies Signal Integrity Test Fixtures
USB Type-C cable assembly signal integrity testing shall use USB-IF approved test fixtures. The
following test cards are needed to conduct the signal integrity testing for Type-C cable assemblies:
•
High speed Type-C test card
•
Low speed Type-C test card
•
Legacy USB connector test cards
•
Calibration card
For consistency, the test cards shall be designed and fabricated on the same PCB panel.
The USB-IF approved cable assembly signal integrity test fixture sets may be purchased from a
designated test fixture vendor(s). USB-IF also provides a reference fixture design. Use the following link
to download the Type-C cable assembly signal integrity test fixture Gerber files:
http://www.usb.org/developers/tools/
F.1 Type-C High Speed Test Card (F.1)
The Type-C high speed test fixture is used to test the SuperSpeed pair performance as well as the
crosstalk between the SuperSpeed pairs and the USB 2.0 D+/D- pair. Figure F-1 shows the signal
connections for the fixture. Only the SuperSpeed pairs and D+/D- pair are routed out to SMAs. Note
that Pins B6 and B7 are shorted to pins A6 and A7, respectively, in the fixture.
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Figure F-1 Signal connections for high speed signal integrity test fixture
The most important feature of the high speed test card is that there is no actual Type-C receptacle
mounted in the test card; a PCB tongue is fabricated on the test card as part of the mating interface, as
illustrated in
Figure F-2.
Figure F-2 Test fixture with PCB tongue as mating interface
There shall be a pad on each side of the test card to lift the internal EMC/RFI finger of the TypeC plug off the PCB. The pad is designed with air gap above the PCB, thus ensuring no contact
with the PCB traces to avoid any impedance impact that may be introduced by the internal RFI
finger. An example design is illustrated in Figure F-3.
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Figure F-3 Example of a pad design to lift the plug RFI finger off PCB
There shall be a metal shell mounted on the test card and connected to test card GND plane,
enclosing the PCB tongue, as shown in Figure F-4. The metal shell emulates the receptacle shell
GND and provides mechanical support for the plug.
Figure F-4 Metal shell to enclose the PCB tongue
Note that pins B6 and B7 are shorted with pins A6 and A7, respectively, on the test card. The
shorting traces should create a 6.5 mm stub length representing the typical stub length from the
receptacle pins.
F.2 Type-C Low Speed Test Card
The Type-C low speed test fixture is to test the performance of USB 2.0 D+/D- and other low
speed signals such as VBUS, CC and SBU_A/SBU_B. Figure F-5 shows the signal connections for
the fixture.
Figure F-5 Signal connections for low speed signal integrity test fixture
All the discussions for the Type-C high speed test card apply to the low speed test card. The
additional discussion is for the VBUS pins. They shall be shorted together and connected to the
fixture GND plane through a 10 nF 0402 bypass capacitor.
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F.3 Legacy USB Test Cards
The legacy USB test cards are used to evaluate signal performance of the Type-C to legacy USB connector
cable assemblies and adapter assemblies. A complete list of the legacy USB test cards includes:
•
USB 3.1 standard-A receptacle card to test the Type-C to USB 3.1 Standard-A cable assembly
•
USB 2.0 standard-A receptacle card to test the Type-C to USB 2.0 Standard-A cable assembly
•
USB 3.1 standard-B receptacle card to test the Type-C to USB 3.1 Standard-B cable assembly
•
USB 2.0 standard-B receptacle card to test the Type-C to USB 2.0 Standard-B cable assembly
•
USB 3.1 Micro-B receptacle card to test the Type-C to USB 3.1 Micro-B cable assembly
•
USB 2.0 Micro-B receptacle card to test the Type-C to USB 2.0 Micro-B cable assembly
•
USB 2.0 Mini-B receptacle card to test the Type-C to USB 2.0 Mini-B cable assembly
•
USB 3.1 Standard-A plug card to test the Type-C to USB 3.1 Standard-A receptacle adapter
assembly
•
USB 2.0 Micro-B plug card to test the Type-C to USB 2.0 Micro-B receptacle adapter assembly
Figure F-6 to Figure F-8 show a few examples of such cards.
Figure F-6 USB 3.1 standard-A receptacle card
Figure F-7 USB 3.1 standard-A plug card
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Figure F-8 USB 3.1 standard B receptacle card
Actual receptacles or plugs are mounted to those test cards. Those receptacle or plugs are considered the
“golden” receptacles or plugs. The golden receptacle or plug should be a USB-IF certified part with
reasonable signal integrity performance, not compromising the measurement quality of the Type-C to
legacy USB cable assemblies or adapter assemblies. The USB-IF test labs may choose the golden
receptacle or plug, subject to USB-IF approval.
F.4 Calibration Card
The calibration card has the structures required for TRL calibration, including THRU, OPEN,
SHORT, LOAD, and LINES. The LINES of different lengths cover the frequency range from 0.1
GHz to 20 GHz. There are also 1X THRUs on the calibration card to achieve the required rise
time at the connector reference plans. Figure F-9 shows a picture of the calibration card.
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Figure F-9 Calibration card
Other calibration methods are allowed. For example, the Agilent automatic fixture removal or
AFR; the 2X THRU structure may be used for AFR.
F.5 Fixture Design Guidelines
To prevent the impact of the test fixture on cable assembly measurement quality, the following
guidelines should be followed:
•
The test fixture PCB nominal thickness is 0.7 mm. This is dictated by the use of the PCB
as the tongue to mate with the Type-C plug. The PCB thickness tolerance is
recommended to be ± 0.05 mm. Exceeding this tolerance may result in the plug not be
mating with the fixture.
•
The PCB dielectric material is recommended to be Rogers. This minimizes the fixture
impedance variation and trace losses. Other PCB materials such as FR4 may be used as
long as the fixture electrical performance is achieved.
•
All of the traces on the test fixture shall be single-ended with a characteristic impedance
of 50 Ohms +/- 5% (47.5 to 52.5 Ω).
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•
Each trace length between the measurement reference plane and SMA should be less than
40 mm and equal length within a tolerance of +/- 0.025mm.
•
Traces between the reference plane and SMAs should be uncoupled from each other.
They should be routed in such a way that traces diverge from each other exiting from the
reference plane.
•
Ground vias should be placed near the GND pins to ensure short ground return path.
•
Co-planar wave guide (CPWG) structure should be used for trace isolation. Add plenty
of stitching vias to connect the CPWG and the GND planes.
•
All non-ground pins that are adjacent but not connected to measurement ports shall be
terminated with 50 Ω loads.
•
For through-hole connectors, traces should be routed on the opposite side of the PCB
from the side the lead is inserted into. For SMT connectors, traces should be routed on
the on the same side as the solder pads.
•
The SMA connector impedance should be 50 Ω and the impedance variation should be
controlled within +/-5% as seen from a TDR of 40 ps (20%-80%).
•
The frequency range of the SMA should be ≥ 20 GHz and its durability cycle life ≥ 500
cycles.
•
The test fixture should include the structures necessary to do a TRL cal, and in addition,
a 1X THRU for rise time calibration.
•
All fixture cards and calibration structures should be designed and fabricated from the
same PCB panel.
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G Type-C Cable Assemblies Signal Integrity Compliance Test
Procedures
This section describes all the Type-C cable assembly signal integrity compliance testing equipment and
procedures.
G.1 Reference Equipment
Most Type-C cable assembly signal integrity items are specified in frequency domain. VNAs or its
equivalent equipment may be used for measurement. If a VNA is used, its frequency range should be to
at least 15 GHz for the SuperSpeed pairs (e.g., the Agilent 50GHz PNA). Micro-coax precision 3.5mm
(e.g., UFB197C-1-0393) 1 meter cables should be used to connect VNA and test fixtures.
A few D+/D- signal integrity compliance items are specified in the time-domain. TDR/TDT or its
equivalent equipment should be used for time domain measurement.
G.2 Reference Equipment Setup
The reference equipment setup is described below, if a VNA is chosen.
•
The VNA should be powered on and allowed to warm up – recommendation is for 24 hours prior
to measurement.
•
For VNA bandwidth setup, it is recommended to limit the frequency sweep range to slightly
higher than the limit required in the specification (e.g. a 15 GHz sweep range for the USB Type-C
SuperSpeed pairs as required by the spec). A sufficient number of points should also be included
in the frequency sweep (for instant, a 10 MHz step for SuperSpeed pairs).
•
The IF Bandwidth should be low enough to help reduce noise effects (e.g. < 300 Hz).
For time-domain measurements (for D+/D- pair), TDR/TDT may be used.
G.3 SuperSpeed Signal Measurements
All SuperSpeed measurements are done in frequency-domain with S-parameters. A VNA is typically
used for such measurements, but other equivalent methods are allowed as long as the accuracy of the
measured S-parameters is demonstrated. The following procedures apply for SuperSpeed signal
measurements when using a VNA:
1.
The Type-C High Speed Test Cards discussed in Appendix F.1 and Appendix F.3 (for legacy USB
connectors) should be used for the measurements.
2.
The fixture effects should be removed from the measurements, using the calibration structures
defined in Appendix F.4. Allowed calibration methods include TRL, AFR, and other equivalent
methods with demonstrated accuracy and consistency.
3.
All measured S-parameters from a VNA are single-ended and they are converted to mixed mode
through post process.
4.
The measured frequency range shall be from 10 MHz to 15 GHz with a frequency step of 10
MHz.
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5.
Insertion losses and return losses of every SuperSpeed pair shall be measured.
6.
All crosstalk terms are required to be measured. For example, if the DP2 (Differential Pair 2) in
Figure G-1 is chosen as the victim, the crosstalk from DP1, DP3, DP4, and DP5 shall be measured.
7.
The measured S-parameters are processed by a Type-C compliance tool to do insertion loss fit
and to calculate ILfitatNq, IMR, IRL, INEXT, IFEXT and other integrated parameters, using the
equations defined in Section 3.7 of the USB Type-C spec. The Type-C compliance tool may be
down-loaded from the following link:
http://compliance.usb.org/files/
Figure G-1 Type-C connector crosstalk pairs
G.4 USB 2.0 D+/D- Signal Measurements
The USB 2.0 D+/D- signal integrity requirements are defined in both frequency-domain and time
domain. The test methodology is essentially the same as what has been practiced for USB 2.0 cable
assembly compliance testing. Brief discussions about USB 2.0 D+/D- signal measurements:
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1.
The Test Cards in Appendix F.1 or Appendix F.3 should be used for the measurements.
2.
The D+/D- pair attenuation is the only S-parameter to be measured, typically with a VNA. The
fixture loss shall be removed from the measurement and the simple AFR method is
recommended. The measured frequency range should be from 50 MHz to 400 MHz with a
frequency step of 10 MHz.
3.
The D+/D- pair impedance is typically measured with a TDR. The 1X THRU in the calibration
card should be used to calibrate the rise time to be 400 ps (20%-80%) entering the reference plane.
4.
The D+/D- pair propagation delay and intra-pair skew are measured typically with a TDT. The
1X THRU in the calibration card should be used to calibrate the rise time to be 400 ps (20%-80%)
entering the reference plane. The propagation delay and intra-pair skew are measured at the 50%
voltage crossing of the received step response.
G.5 Low Speed Signal Measurements
Low speed signal compliance tests are all done in frequency domain, measuring coupling or crosstalk
among the low speed signals, except for the VBUS line loop inductance. Descriptions regarding the
crosstalk measurements:
1.
A VNA is typically used to measure the coupling or crosstalk. The frequency range is from 300
KHz to 100 MHz.
2.
The low speed test card defined in Appendix F.2 should be used to test the low speed signals.
3.
All the measured S-parameters are single-ended with a 50 ohm reference impedance.
4.
Both near-end and far-end crosstalk shall be measured.
5.
If differential coupling is specified, the single-ended S-parameters should be post-processed to
get the differential coupling. For example, if the single-ended near-end crosstalk between the CC
line and the D+ line is 2+ and the single-ended near-end crosstalk between the CC line and
the D- line is 2− , the differential near-end crosstalk between the CC line and the D+/D- pair
is simply:
2+/− = (2+ − 2− )/(2). All other differential crosstalk can be similarly
calculated from the single-ended measurements.
The VBUS loop inductance and capacitance may be obtained from the S-parameter measurement also. A
2-port S-parameter measurement is done to the VBUs line; the S-parameters are represented as Sij (i, j=1
and 2). At low frequency (e.g., ∼1 MHz range) the VBUS line may be modeled as a simple RLC circuit, as
illustrated in Figure G-2.
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Figure G-2 Lumped RLC circuit model for VBUS line
This 2-port RLC circuit S-parameters may be analytically derived, and the VBUS loop inductance and
capacitance may then be obtained as:
1
 = 2  �0
(1+11 )(1+22 )−12 21
212
�,
1
(1−11 )(1+22 )−12 (2−12 )
1
(1+11 )(1−22 )−12 (2−12 )
1 = 2  � 
0 [(1+11 )(1+22 )−12 21 ]
2 = 2  � 
0 [(1+11 )(1+22 )−12 21 ]
�,
�,
where Z0 (=50 Ω) is the reference impedance of the S-parameter. The so extracted loop inductance is
approximately independent of frequency from KHz to a few MHz range; a frequency range from 300
KHz to 2 MHz is recommended.
To extract the inductance coupling factor, a coupled line model is assumed, as illustrated in Figure G-3.
Figure G-3 Lumped RLC circuit model for VBUS line coupled with a low speed line (e.g., CC)
The 4-port S-parameters of the coupled lines are measured first and then converted to the Y-parameters:
 = 0−1 ( + )−1 ( − )
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The mutual and loop inductances can be derived as
 =
1
14 + 41 + 23 + 32
 �
�
(12 + 21 )(34 + 43
2
1 =
2 =
1
2
 �−
�
2
(12 + 21
1
2
 �−
�
2
(34 + 43
And the inductance coupling factor k is defined as
 =

�1 2
The Type-C cable assembly compliance tool converts S-parameters to the VBUS loop inductance and
capacitances as well as the inductance coupling factor between VBUS and other low speed signals.
H Type-C Cable Assemblies Shielding Effectiveness Fixtures
The cable assembly shielding effectiveness test setup and fixture are illustrated in Figure H-1:
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Figure H-1 Cable Shielding Effectiveness Measurement Setup
The fixture includes three sections: driver section, tunnel section and receiver section.
•
Driver section: There is a PCB in this section, a top mounted Type C receptacle is
mounted on the end of PCB, TX/RX and USB2.0 signals are routed on the PCB on the top
layer to the SMA connectors on the other end. A metal shield is used to cover the traces
and receptacle. An absorber is used in this section to avoid reflection of cable radiation.
•
Tunnel section: Type C to type C cable under test is placed in this section. Supports
made of Styrofoam are used to keep the cable straight. Outside of the supports in this
section is a metal cover, which is used for prefect shielding to avoid any radiation
leakage.
•
Receiver section: A top mounted Type C receptacle is mounted on the edge of the PCB,
TX/RX and USB2.0 signals are terminated and the trace are covered by a metal shield.
The aperture between the outside shield and the metal cover is used to collect the cable
radiation. The radiation is transferred to a built-in SMA at the other end of this section.
H.1 General Board Design Guideline
•
Top mounted type C receptacle is used for both boards. All traces are routed on the top
layer and no signal via is used.
•
All of the traces on the driver board should be differential traces and shall be held to a
characteristic impedance of 85 Ohms with a tolerance of +/- 7.5%.
•
All of the traces on the terminated board should be differential traces and shall be held to
a characteristic impedance of 100 Ohms with a tolerance of +/- 7.5%. TX/RX and USB2.0
signals are connected to 50ohm resistors. VBUS signals are connected to 470pf by-pass
capacitor.
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H.2 SMA (Launch Point) Design Guideline
•
Recommend using 50 Ω edge-launch SMA connector.
•
Working frequency range of the SMA should be ≥ 20 GHz
•
Mating cycle life of the SMA should be ≥ 500 cycles
•
SMA spacing: Pitch of side-by-side SMA shall be greater than or equal to 15 mm.
H.3 Miscellaneous Design Guideline
•
All metal covers used are soldered on the PCB. The metal cover fully shields the PCB
trace and receptacle shell to avoid any radiation
•
CC and SBU pins of the type C receptacle are grounded to save routing space.
•
Ground stitch vias are placed along the edges of both boards
•
The plastic pegs of the type C receptacle are removed, so there is no non-plated through
hole on the PCB
I
Type-C Cable Assemblies Shielding Effectiveness
Measurements
Measurement of the shielding effectiveness:
1.
The length of the cable assembly sample used for shielding effectiveness testing shall be 1
m +/- 15 mm, regardless of the actual cable length to be certified. For example, if a cable
assembly vendor wishes to certify a 0.5 m Type-C cable, the vendor shall prepare a 1 m
+/- 15 mm cable assembly for shielding effectiveness testing.
2.
The cable shielding effectiveness test fixture has SMA connectors connected to the USB
SuperSpeed TX pairs, RX pairs, and the cable shield.
3.
Follow the VNA calibration procedures and calibrate to the end of the coaxial cable using
the SOLT standards.
4.
Install the cable under test into the fixture. Connect 1 port to the cable shield and 2 ports
to a TX pair. Terminate the RX pairs with 50 ohm loads.
5.
Perform measurement. Calculate the coupling factor from TX differential mode to cable
shield. Calculate the coupling factor from TX common mode to cable shield.
6.
Connect 1 port to the cable shield and 2 ports to the RX pair. Terminate the TX pair with
50 ohm loads. Repeat the steps until all the SuperSpeed pairs (i.e., TX and RX) have been
used as the stimulus.
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