High Power Infrared Emitter (940 nm) Version 1.4 SFH 4244

2016-08-11
High Power Infrared Emitter (940 nm)
Version 1.4
SFH 4244
Features:
•
High Power Infrared LED
•
Short switching time
•
The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
Applications
•
Infrared Illumination for cameras
•
IR data transmission
•
Sensor technology
Notes
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety
precautions given in IEC 60825-1 and IEC 62471.
Ordering Information
Type:
Radiant Intensity
Ordering Code
Ie [mW/sr]
IF = 70 mA, tp = 20 ms
SFH 4244
11 (≥ 4)
Q65110A7516
SFH 4244-QR
6.3 ... 20
Q65110A8753
Note:
Measured at a solid angle of Ω = 0.01 sr
2016-08-11
1
Version 1.4
SFH 4244
Maximum Ratings (TA = 25 °C)
Parameter
Symbol
Values
Operation and storage temperature range
Top; Tstg
-40 ... 100
°C
Reverse voltage
VR
5
V
Forward current
IF
70
mA
Surge current
(tp = 100 µs, D = 0)
IFSM
0.7
A
Power consumption
Ptot
140
mW
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD
2
Thermal resistance junction - ambient 1) page 12
RthJA
500
K/W
Thermal resistance junction - soldering point
RthJS
280
K/W
2) page 12
Unit
kV
Characteristics (TA = 25 °C)
Parameter
Symbol
Values
Unit
Peak wavelength
(IF = 70 mA, tp = 20 ms)
(typ)
λpeak
950
nm
Centroid wavelength
(IF = 70 mA, tp = 20 ms)
(typ)
λcentroid
940
nm
Spectral bandwidth at 50% of Imax
(IF = 70 mA, tp = 20 ms)
(typ)
∆λ
42
nm
Half angle
(typ)
ϕ
± 60
Dimensions of active chip area
(typ)
LxW
Rise and fall time of Ie ( 10% and 90% of Ie max)
(IF = 70 mA, RL = 50 Ω)
(typ)
tr, tf
Forward voltage
(IF = 70 mA, tp = 20 ms)
Forward voltage
(IF = 500 mA, tp = 100 µs)
2016-08-11
mm x
mm
12
ns
(typ (max)) VF
1.6 (≤ 2)
V
(typ (max)) VF
2.4 (≤ 3)
V
Reverse current
(VR = 5 V)
Total radiant flux
(IF=70 mA, tp=20 ms)
0.2 x 0.2
°
(typ)
2
IR
not designed for
reverse operation
µA
Φe
35
mW
Version 1.4
SFH 4244
Parameter
Symbol
Values
Unit
Temperature coefficient of Ie or Φe
(IF = 70 mA, tp = 20 ms)
(typ)
TCI
-0.5
%/K
Temperature coefficient of VF
(IF = 70 mA, tp = 20 ms)
(typ)
TCV
-1.3
mV / K
Temperature coefficient of wavelength
(IF = 70 mA, tp = 20 ms)
(typ)
TCλ
0.3
nm / K
Grouping (TA = 25 °C)
Group
Min Radiant Intensity
Max Radiant Intensity
Typ Radiant Intensity
IF = 70 mA, tp = 20 ms
IF = 70 mA, tp = 20 ms
IF = 500 mA, tp = 25 µs
Ie, min [mW / sr]
Ie, max [mW / sr]
Ie, typ [mW / sr]
SFH 4244-P
4
8
30
SFH 4244-Q
6.3
12.5
50
SFH 4244-R
10
20
75
Note:
measured at a solid angle of Ω = 0.01 sr
Only one group in one packing unit (variation lower 2:1).
Relative Spectral Emission 3) page 12
Irel = f(λ), TA = 25°C
Radiant Intensity 3) page 12
Ie / Ie(70 mA) = f(IF), single pulse, tp = 25 µs,
TA= 25°C
OHF04134
100
OHF03827
101
I rel %
Ie
80
I e (70 mA)
60
100
5
40
10-1
20
0
800
5
850
900
950
nm 1025
10-2 0
10
λ
5 10 1
5 10 2
mA 10 3
IF
2016-08-11
3
Version 1.4
SFH 4244
Forward Current 3) page 12
IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
Max. Permissible Forward Current
IF, max = f(TA), RthJA = 500 K / W
IF
OHF03732
80
mA
IF
70
OHF03828
100
A
10-1
60
5
50
10-2
40
5
30
10-3
20
5
10
0
0
20
40
60
80
10-4
100 ˚C 120
0
0.5
1
1.5
2.5 V 3
2
TA
VF
Permissible Pulse Handling Capability
IF = f(tp), T A = 85 °C, duty cycle D = parameter
Permissible Pulse Handling Capability
IF = f(tp), TA = 25 °C, duty cycle D = parameter
IF
0.7
A
0.6
0.5
0.4
0.3
0.2
OHF03733
t
tP
IF
IF
D = TP
T
0.6
D=
0.5
0.005
0.01
0.02
0.05
0.1
0.2
0.3
0.5
1
0.4
0.3
0.2
0.1
0.1
OHF03824
t
tP
IF
D = TP
T
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.3
0.5
1
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
tp
2016-08-11
0.7
A
4
Version 1.4
SFH 4244
Radiation Characteristics 3) page 12
Irel = f(ϕ), TA= 25°C
40˚
30˚
20˚
10˚
0˚
ϕ
50˚
OHL01660
1.0
0.8
0.6
60˚
0.4
70˚
0.2
80˚
0
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
Package Outline
1.1 (0.043)
Dimensions in mm (inch).
Anode
(1.4 (0.055))
(R1)
4.2 (0.165)
3.8 (0.150)
C
A
GPLY6880
Package
SIDELED
2016-08-11
3.8 (0.150)
3.4 (0.134)
(2.9 (0.114))
Cathode marking
2.54 (0.100)
spacing
(2.85 (0.112))
0.9 (0.035)
(0.3 (0.012))
Cathode
0.7 (0.028)
4.2 (0.165)
3.8 (0.150)
2.4 (0.094)
2.8 (0.110)
(2.4 (0.094))
5
100˚
120˚
Version 1.4
SFH 4244
Approximate Weight:
76 mg
Recommended Solder Pad
Dimensions in mm.
2016-08-11
6
Version 1.4
SFH 4244
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
50
0
100
150
200
250
s 300
t
Profil-Charakteristik
Profile Feature
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
)
Ramp-up Rate to Preheat*
25 °C to 150 °C
Time tS
TSmin to TSmax
tS
60
Ramp-up Rate to Peak*)
TSmax to TP
Recommendation
Maximum
2
3
100
120
2
3
Einheit
Unit
K/s
s
K/s
Liquidus Temperature
TL
217
Time above Liquidus temperature
tL
80
100
s
Peak Temperature
TP
245
250
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
s
3
4
K/s
10
Ramp-down Rate*
TP to 100 °C
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
2016-08-11
°C
7
s
Version 1.4
SFH 4244
Taping
4 (0.157)
4.25 (0.167)
8 (0.315)
12 (0.472)
1.75 (0.069)
Cathode/Collector Marking
5.5 (0.217)
2 (0.079)
3.95 (0.156)
1.5 (0.059)
OHAY2273
Dimensions in mm (inch).
Tape and Reel
12 mm tape with 2000 pcs. on ∅ 330 mm reel
W1
D0
P0
A
N
F
W
E
13.0 ±0.25
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324
2016-08-11
8
Version 1.4
SFH 4244
Tape dimensions [mm]
Tape dim ensions in m m
W
P0
12 + 0.3 / - 0.1 4 ± 0.1
P1
P2
D0
E
F
4 ± 0.1
or
8 ± 0.1
2 ± 0.05
1.5 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
Reel dimensions [mm]
Reel dim ensions in m m
A
W
Nmin
W1
W2max
330
12
60
12.4 + 2
18.4
Barcode-Product-Label (BPL)
OSRAM Opto
EX
A
RoHS Compliant
(6P) BATCH NO: 1234567890
(1T) LOT NO: 1234567890
BIN1: XX-XX-X-XXX-X
LX XXXX
Semiconductors
MP
(9D) D/C: 1234
ML Temp ST
X XXX °C X
Pack: RXX
LE
DEMY
XXX
X_X123_1234.1234 X
(X) PROD NO: 123456789(Q)QTY:
9999
(G) GROUP:
XX-XX-X-X
OHA04563
Dry Packing Process and Materials
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
AM
OSR
Desiccant
OHA00539
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
2016-08-11
9
Version 1.4
SFH 4244
Transportation Packing and Materials
Barcode label
8
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Packing
Sealing label
Dimensions of transportation box in mm
Width
Length
Height
349 ± 5
349 ± 5
33 ± 5
2016-08-11
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Barcode label
10
OHA02044
Version 1.4
SFH 4244
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2016-08-11
11
Version 1.4
SFH 4244
Glossary
1)
Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm2 each
2)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)
3)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2016-08-11
12
Version 1.4
SFH 4244
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
2016-08-11
13
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Osram Opto Semiconductor:
SFH 4244-Z SFH 4244-QR
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