Intel(R) Desktop Board DX58OG Extreme Series

product brief
Intel® Desktop Board DX58OG
Extreme Series
ATX Form Factor
Intel® Desktop Board
DX58OG Extreme Series
Built for performance
keeps the system performing in the most
Maximum ePower also enables a thermally
Introducing the Intel® Desktop Board
efficient optimum state. The massive data
balanced voltage regulator for pushing
DX58OG, designed to unleash the power of
throughput and support for the Intel Core
the limits with confidence as the system
the new Intel® Core™ i7 processors.
i7 processor runs more applications simul-
stays cool.
taneously, with less wait time.
When performance matters
With the Intel Desktop Board DX58OG,
Intel has done it again. Built with stability
and reliability in mind, performance users
will have the peace of mind needed to
perform critical compute-intensive tasks.
The Intel Desktop Board DX58OG provides
breakaway performance in production and
Power and affordability
With incredible support for up to 12 threads
of raw processing power, unprecedented
bandwidth, triple-channel DDR3 memory,
and full support for ATI* CrossFireX* and
NVIDIA* SLI* technologies, the Intel Desktop
Board DX58OG offers the power and
editing, as well as digital media rendering
affordability for a desktop workhorse.
and real-time audio/video preview capabili-
The optimized eight-layer stack up provides
ties. Superior Phase Shedding Technology
flawless signal speed and industry-leading
power delivery to critical components to
deliver more advanced performance tuning1.
Intel® Desktop Board DX58OG Extreme Series
The boxed Intel® Desktop Board DX58OG solution includes:
•ATX 2.2 compliant I/O shield
•UV-reactive SATA cables
•Board and back panel I/O layout stickers
•Quick reference guide
•Intel® Express Installer driver and software DVD
•Windows Vista* Premium WHQL certified
•NVIDIA* SLI* bridge connector
•Post code information card
Software included:
2
CAPABILITY
SOFTWARE INCLUDED:
Utilities
•Intel® Core Utilities Bundle2
•Intel® Extreme Tuning Utility3 (XTU) (Internet download)
Antivirus
•ESET* Smart Security
Intel® Desktop Board DX58OG Extreme Series
Features and Benefits
1 Support for the Intel® Core™ i7
processor Extreme Edition in the
LGA1366 package: Supports both
four-core and six-core processors. Features Intel® Turbo Boost Technology4
and Intel® Hyper-Threading Technology5
for exceptional performance and scalability, and 12 MB shared Intel® Smart
Cache, enabling dynamic and efficient
allocation of cache.
7 Two SATA 6.0 Gb/s ports and six
2 Intel® X58 Express Chipset with
9 Eight-channel Intel® High Definition
support overclocked DDR3 1600+ /
1333 / 1066 MHz memory, delivering
up to 48 GB/s7 memory bandwidth.
1
6
4 Two SuperSpeed USB 3.0 ports,
two IEEE 1394a ports (one external
port and one port via internal
header), and 12 USB 2.0 ports (six
back ports and six ports via three
internal headers): Provides for the
most flexible back panel connectivity
options.
5 Two PCI Express* 2.0 x16
connectors: Improved graphics
bandwidth and support for certified
dual-card ATI* CrossFireX* and
NVIDIA* SLI*.
6 PCI Express and PCI connectors:
Flexibility to support PCI Express and
legacy PCI devices.
6
4
10
12
5
8 Intel® Matrix Storage Technology:
Performance and reliability with
support for RAID 0, 1, 5, and 10, and
new Intel® Rapid Recover Technology.
Audio8 (5.1): Enables high-quality
integrated audio that rivals the performance of high-end discrete solutions.
3 Six DIMM connectors: Designed to
9
15
16
1
10 Intel® Gigabit Ethernet LAN: Features
onboard 10/100/1000 Mb/s Ethernet
LAN connectivity.
11 Consumer infrared receiver and
transmitter: Supports receiving,
learning, and emitting capabilities,
controls up to two additional CE
devices with your PC, and eliminates
the need for a USB CIR dongle.
14
9.6” (24.38cm)
ICH10R: Features Intel® QuickPath
Interconnect (Intel® QPI) to the
processor for 25.6 GB/s maximum
peak bandwidth.
18
SATA 3.0 Gb/s ports: Support for
up to eight ports with external SATA
capability and the ability to disable
individual ports via the Intel® Matrix
Storage driver stack.
13
11
2
7
3
8
12 Back-to-BIOS switch: Allows easy
17
11.6” (29.46cm)
access to the BIOS for easy overclocking
and recovery.
13 Post code decoder: Allows for display
15 Solid-state capacitors and exclusive
of post codes for debug along with
the included post code quick reference
card displaying critical areas to help
troubleshoot performance-increase
roadblocks.
Maximum ePower processor voltage
regulation design: Maximizes stability
and power for advanced performance
tuning.
14 Exclusive voltage regulator thermal
solutions: Provides reliable and
silent cooling for extreme performance
tuning.
17 ATX Form Factor: ATX board supports
more fully featured tower designs.
18 Lead-free: Meets all worldwide
regulatory requirements for lead-free
manufacturing.
16 Tweaker switches: Speed bump,
power, and reset switches for overclocking on the go, quick reset, and
power on.
3
Intel® Desktop Board DX58OG Extreme Series
Technical Specifications
Hardware Management Features
•Processor fan speed control
•System chassis fan speed control
•Voltage and temperature sensing
•Fan sensor inputs used to monitor fan activity
•Power management support for ACPI 3.0b
Processor
Processor Support
•Intel® Core™ i7 processors in the LGA1366 package
•Intel® Turbo Boost Technology4
•Intel® Hyper-Threading Technology5
•Integrated Memory Controller with support for up
to 48 GB7 of system memory DDR3 +16006 /
1333 / 1066 MHz SDRAM •Intel® Fast Memory Access •Supports Intel® 64 architecture9
Intel® PRO 10/100/1000 Network Connection
•LAN on the back panel
•New low-power design can meet ENERGY STAR*
5.0 specifications
Chipset
Intel® X58 Express Chipset
•Intel® 82X58 IOH with ICH10R
•Intel® Matrix Storage Manager (RAID 0, 1, 5, 10) •Two SATA (6.0 Gb/s) ports and 6 SATA (3.0 Gb/s) ports
Expansion Capabilities
•Two PCI Express* 2.0 x16 connectors (configured as x16 / x16 in dual-graphics mode) •Three PCI Express 2.0 x1 connectors
•One PCI connector
USB PORTS
Integrated Intel® ICH10R controller
•Six Hi-Speed USB 2.0 ports via back panel
•Six additional Hi-Speed USB 2.0 ports via three internal headers
•Two SuperSpeed USB 3.0 ports via NEC controller
Audio
•8-channel Intel® High Definition Audio8 codec
•6-channel via the back panel •2-channel via the front panel
•One internal header for S/PDIF output for HDMI*
support
System BIOS
•32 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play, IDE
drive auto-configure
•Advanced configuration and power interface
V3.0b, DMI 2.5
System Memory
Memory Capacity
•Six 240-pin DIMM connectors supporting triple-
channel memory. Two double-sided DIMMs per channel.
•Maximum system memory up to 48 GB7 using 8 GB
double-sided DIMMs
Intel® Rapid BIOS Boot
•Intel® Rapid BIOS Boot
•Intel® Express BIOS update support: BIOS update
via new F7 function key
Warning: Altering clock frequency and/or voltage may (i) reduce
system stability and useful life of the system and processor; (ii)
cause the processor and other system components to fail; (iii)
cause reductions in system performance; (iv) cause additional
heat or other damage; and (v) affect system data integrity. Intel
has not tested, and does not warranty, the operation of the
processor beyond its specifications.
2
The Intel® Core Utilities Bundle includes Intel® Integrator Assistant, Intel® Integrator Toolkit, Intel® Express Installer, and Intel®
Express BIOS Update.
3
Intel® Extreme Tuning Utility is only compatible with Intel® Desktop Boards based on the Intel® X38 Express Chipset and newer.
Auto-tuning capabilities may not be available for all Extreme
Series motherboards.
4
Intel® Turbo Boost Technology requires a PC with a processor with
Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and
overall system configuration. Check with your PC manufacturer on
whether your system delivers Intel Turbo Boost Technology. See
www.intel.com/technology/turboboost for more information.
5
Intel® Hyper-Threading Technology requires a computer system
with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating system. Performance
will vary depending on the specific hardware and software you
use. For more information including details on which processors
support HT Technology, see www.intel.com/info/hyperthreading.
1
Memory Types
Maximum peak memory bandwidth requires three DDR3 modules
to be populated in each of the blue memory slots. DDR3 1600
memory support on this motherboard requires advanced knowledge of BIOS and memory tuning; individual results may vary.
For specific supported memory for this motherboard, please visit
www.intel.com/products/motherboard/ for more details.
7
System resources and hardware (such as PCI and PCI Express*)
require physical memory address locations that can reduce available addressable system memory. This could result in a reduction
of as much as 1 GB or more of physical addressable memory being
available to the operating system and applications, depending on
the system configuration and operating system.
8
Intel® High Definition Audio requires a system with an appropriate
Intel® chipset and a motherboard with an appropriate codec and
the necessary drivers installed. System sound quality will vary
depending on actual implementation, controller, codec, drivers,
and speakers. For more information about Intel® HD Audio, refer
to www.intel.com/design/chipsets/hdaudio.htm
9
64-bit computing on Intel® architecture requires a computer
system with a processor, chipset, BIOS, operating system, device
drivers, and applications enabled for Intel® 64 architecture.
Processors will not operate (including 32-bit operation) without
an Intel 64 architecture-enabled BIOS. Performance will vary
depending on your hardware and software configurations. See
http://developer.intel.com/technology/intel64/index.htm for
more information.
6
For ordering information, visit www.intel.com
For the most current product information, visit www.intel.com/go/idb
or http://ark.intel.com
For specific CPU compatibility, visit http://processormatch.intel.com
•DDR3 +1600 / 1333 / 1066 SDRAM memory support
•Non-ECC Memory
Memory Modes
•Triple-, dual-, or single-channel operation support
Memory Voltage
•1.35 V low voltage
•1.5 V standard JEDEC voltage
•Support for Intel® XMP extended voltage profiles
Jumpers and Front-Panel Connectors
Jumpers
•Single configuration jumper design
•Jumper access for BIOS maintenance mode
Front-Panel Connectors
•Reset, HD LED, Power LEDs, power on/off
•Three front-panel Hi-Speed USB 2.0 headers
•Front-panel audio header
•One IEEE 1394a header
Mechanical
Board Style
•ATX
Board Size
•9.6” x 11.6” (24.38 cm x 29.46 cm)
Baseboard Power Requirements
•ATX 12 V
Environment
Operating Temperature
•0° C to +55° C
Storage Temperature
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving,
or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based
on current expectations, and are subject to change without
notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, and Intel Core are trademarks of Intel
Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2010 Intel Corporation. All rights reserved.
1110/JB/MS/PDF 324622-001US
•-20° C to +70° C
Regulations and Safety Standards
United States and Canada
UL 1950, Third edition—CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
Europe
Nemko certified to EN 60950 International
Nemko certified to IEC 60950
(CB report with CB certificate)
EMC regulations (tested in representative chassis)
United States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis (cover off) testing
Canada
ICES-003, Class B
Europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
Taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via
EN55022 +6 db in system configurations with an
open chassis and EU Directive 89/336/EEC and use
via EN55022 and EN50082-1 in a representative
chassis.
Lead-Free: The symbol is used to identify electrical
and electronic assemblies and components
in which the lead (Pb) concentration level in
any of the raw materials and the end product is not greater than 0.1% by weight (1000 ppm).
This symbol is also used to indicate conformance
to lead-free requirements and definitions adopted
under the European Union’s Restriction on Hazardous
Substances (RoHS) directive, 2002/95/EC.
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