product brief Intel® Desktop Board DX58OG Extreme Series ATX Form Factor Intel® Desktop Board DX58OG Extreme Series Built for performance keeps the system performing in the most Maximum ePower also enables a thermally Introducing the Intel® Desktop Board efficient optimum state. The massive data balanced voltage regulator for pushing DX58OG, designed to unleash the power of throughput and support for the Intel Core the limits with confidence as the system the new Intel® Core™ i7 processors. i7 processor runs more applications simul- stays cool. taneously, with less wait time. When performance matters With the Intel Desktop Board DX58OG, Intel has done it again. Built with stability and reliability in mind, performance users will have the peace of mind needed to perform critical compute-intensive tasks. The Intel Desktop Board DX58OG provides breakaway performance in production and Power and affordability With incredible support for up to 12 threads of raw processing power, unprecedented bandwidth, triple-channel DDR3 memory, and full support for ATI* CrossFireX* and NVIDIA* SLI* technologies, the Intel Desktop Board DX58OG offers the power and editing, as well as digital media rendering affordability for a desktop workhorse. and real-time audio/video preview capabili- The optimized eight-layer stack up provides ties. Superior Phase Shedding Technology flawless signal speed and industry-leading power delivery to critical components to deliver more advanced performance tuning1. Intel® Desktop Board DX58OG Extreme Series The boxed Intel® Desktop Board DX58OG solution includes: •ATX 2.2 compliant I/O shield •UV-reactive SATA cables •Board and back panel I/O layout stickers •Quick reference guide •Intel® Express Installer driver and software DVD •Windows Vista* Premium WHQL certified •NVIDIA* SLI* bridge connector •Post code information card Software included: 2 CAPABILITY SOFTWARE INCLUDED: Utilities •Intel® Core Utilities Bundle2 •Intel® Extreme Tuning Utility3 (XTU) (Internet download) Antivirus •ESET* Smart Security Intel® Desktop Board DX58OG Extreme Series Features and Benefits 1 Support for the Intel® Core™ i7 processor Extreme Edition in the LGA1366 package: Supports both four-core and six-core processors. Features Intel® Turbo Boost Technology4 and Intel® Hyper-Threading Technology5 for exceptional performance and scalability, and 12 MB shared Intel® Smart Cache, enabling dynamic and efficient allocation of cache. 7 Two SATA 6.0 Gb/s ports and six 2 Intel® X58 Express Chipset with 9 Eight-channel Intel® High Definition support overclocked DDR3 1600+ / 1333 / 1066 MHz memory, delivering up to 48 GB/s7 memory bandwidth. 1 6 4 Two SuperSpeed USB 3.0 ports, two IEEE 1394a ports (one external port and one port via internal header), and 12 USB 2.0 ports (six back ports and six ports via three internal headers): Provides for the most flexible back panel connectivity options. 5 Two PCI Express* 2.0 x16 connectors: Improved graphics bandwidth and support for certified dual-card ATI* CrossFireX* and NVIDIA* SLI*. 6 PCI Express and PCI connectors: Flexibility to support PCI Express and legacy PCI devices. 6 4 10 12 5 8 Intel® Matrix Storage Technology: Performance and reliability with support for RAID 0, 1, 5, and 10, and new Intel® Rapid Recover Technology. Audio8 (5.1): Enables high-quality integrated audio that rivals the performance of high-end discrete solutions. 3 Six DIMM connectors: Designed to 9 15 16 1 10 Intel® Gigabit Ethernet LAN: Features onboard 10/100/1000 Mb/s Ethernet LAN connectivity. 11 Consumer infrared receiver and transmitter: Supports receiving, learning, and emitting capabilities, controls up to two additional CE devices with your PC, and eliminates the need for a USB CIR dongle. 14 9.6” (24.38cm) ICH10R: Features Intel® QuickPath Interconnect (Intel® QPI) to the processor for 25.6 GB/s maximum peak bandwidth. 18 SATA 3.0 Gb/s ports: Support for up to eight ports with external SATA capability and the ability to disable individual ports via the Intel® Matrix Storage driver stack. 13 11 2 7 3 8 12 Back-to-BIOS switch: Allows easy 17 11.6” (29.46cm) access to the BIOS for easy overclocking and recovery. 13 Post code decoder: Allows for display 15 Solid-state capacitors and exclusive of post codes for debug along with the included post code quick reference card displaying critical areas to help troubleshoot performance-increase roadblocks. Maximum ePower processor voltage regulation design: Maximizes stability and power for advanced performance tuning. 14 Exclusive voltage regulator thermal solutions: Provides reliable and silent cooling for extreme performance tuning. 17 ATX Form Factor: ATX board supports more fully featured tower designs. 18 Lead-free: Meets all worldwide regulatory requirements for lead-free manufacturing. 16 Tweaker switches: Speed bump, power, and reset switches for overclocking on the go, quick reset, and power on. 3 Intel® Desktop Board DX58OG Extreme Series Technical Specifications Hardware Management Features •Processor fan speed control •System chassis fan speed control •Voltage and temperature sensing •Fan sensor inputs used to monitor fan activity •Power management support for ACPI 3.0b Processor Processor Support •Intel® Core™ i7 processors in the LGA1366 package •Intel® Turbo Boost Technology4 •Intel® Hyper-Threading Technology5 •Integrated Memory Controller with support for up to 48 GB7 of system memory DDR3 +16006 / 1333 / 1066 MHz SDRAM •Intel® Fast Memory Access •Supports Intel® 64 architecture9 Intel® PRO 10/100/1000 Network Connection •LAN on the back panel •New low-power design can meet ENERGY STAR* 5.0 specifications Chipset Intel® X58 Express Chipset •Intel® 82X58 IOH with ICH10R •Intel® Matrix Storage Manager (RAID 0, 1, 5, 10) •Two SATA (6.0 Gb/s) ports and 6 SATA (3.0 Gb/s) ports Expansion Capabilities •Two PCI Express* 2.0 x16 connectors (configured as x16 / x16 in dual-graphics mode) •Three PCI Express 2.0 x1 connectors •One PCI connector USB PORTS Integrated Intel® ICH10R controller •Six Hi-Speed USB 2.0 ports via back panel •Six additional Hi-Speed USB 2.0 ports via three internal headers •Two SuperSpeed USB 3.0 ports via NEC controller Audio •8-channel Intel® High Definition Audio8 codec •6-channel via the back panel •2-channel via the front panel •One internal header for S/PDIF output for HDMI* support System BIOS •32 Mb Flash EEPROM with Intel® Platform Innovation Framework for EFI Plug and Play, IDE drive auto-configure •Advanced configuration and power interface V3.0b, DMI 2.5 System Memory Memory Capacity •Six 240-pin DIMM connectors supporting triple- channel memory. Two double-sided DIMMs per channel. •Maximum system memory up to 48 GB7 using 8 GB double-sided DIMMs Intel® Rapid BIOS Boot •Intel® Rapid BIOS Boot •Intel® Express BIOS update support: BIOS update via new F7 function key Warning: Altering clock frequency and/or voltage may (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. 2 The Intel® Core Utilities Bundle includes Intel® Integrator Assistant, Intel® Integrator Toolkit, Intel® Express Installer, and Intel® Express BIOS Update. 3 Intel® Extreme Tuning Utility is only compatible with Intel® Desktop Boards based on the Intel® X38 Express Chipset and newer. Auto-tuning capabilities may not be available for all Extreme Series motherboards. 4 Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.com/technology/turboboost for more information. 5 Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see www.intel.com/info/hyperthreading. 1 Memory Types Maximum peak memory bandwidth requires three DDR3 modules to be populated in each of the blue memory slots. DDR3 1600 memory support on this motherboard requires advanced knowledge of BIOS and memory tuning; individual results may vary. For specific supported memory for this motherboard, please visit www.intel.com/products/motherboard/ for more details. 7 System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system. 8 Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm 9 64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://developer.intel.com/technology/intel64/index.htm for more information. 6 For ordering information, visit www.intel.com For the most current product information, visit www.intel.com/go/idb or http://ark.intel.com For specific CPU compatibility, visit http://processormatch.intel.com •DDR3 +1600 / 1333 / 1066 SDRAM memory support •Non-ECC Memory Memory Modes •Triple-, dual-, or single-channel operation support Memory Voltage •1.35 V low voltage •1.5 V standard JEDEC voltage •Support for Intel® XMP extended voltage profiles Jumpers and Front-Panel Connectors Jumpers •Single configuration jumper design •Jumper access for BIOS maintenance mode Front-Panel Connectors •Reset, HD LED, Power LEDs, power on/off •Three front-panel Hi-Speed USB 2.0 headers •Front-panel audio header •One IEEE 1394a header Mechanical Board Style •ATX Board Size •9.6” x 11.6” (24.38 cm x 29.46 cm) Baseboard Power Requirements •ATX 12 V Environment Operating Temperature •0° C to +55° C Storage Temperature INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary. Actual Intel® Desktop Board may differ from the image shown. Intel, the Intel logo, and Intel Core are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2010 Intel Corporation. All rights reserved. 1110/JB/MS/PDF 324622-001US •-20° C to +70° C Regulations and Safety Standards United States and Canada UL 1950, Third edition—CAN/CSA C22.2 No. 950-95 with recognized U.S. and Canadian component marks Europe Nemko certified to EN 60950 International Nemko certified to IEC 60950 (CB report with CB certificate) EMC regulations (tested in representative chassis) United States FCC Part 15, Class B FCC Part 15, Class B open-chassis (cover off) testing Canada ICES-003, Class B Europe EMC directive 89/336/EEC; EN 55022:1998 Class B; EN 55024:1998 Australia/New Zealand AS/NZS 3548, Class B Taiwan CNS 13438, Class B International CISPR 22:1997, Class B Power requirements vary. Complies with US CRF via EN55022 +6 db in system configurations with an open chassis and EU Directive 89/336/EEC and use via EN55022 and EN50082-1 in a representative chassis. Lead-Free: The symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in any of the raw materials and the end product is not greater than 0.1% by weight (1000 ppm). This symbol is also used to indicate conformance to lead-free requirements and definitions adopted under the European Union’s Restriction on Hazardous Substances (RoHS) directive, 2002/95/EC.