Product Guide - CoolIT Systems

Product Guide
Direct Contact Liquid Cooling
Industry leading data center solutions for
HPC, Cloud and Enterprise markets.
www.coolitsystems.com
Phone: +1 403.235.4895
The Future of Data Center Cooling
CooIIT Systems Innovates and Delivers
CoolIT Systems is the world leader in energy efficient liquid cooling solutions for HPC,
Cloud and Enterprise markets. As an experienced innovator with over 60 patents and more
than 2 million liquid cooling units deployed in desktop computers, servers and data centers
around the world, CoolIT's Direct Contact Liquid Cooling (DCLC™) technology is the top
choice for OEMs and system integrators.
Proven Technology
Selling 30-40,000 units/month
>2M units deployed worldwide
99.998% leak free and improving
60+ issued patents
Worldwide Service Network
Since 2001, CoolIT has been dedicated to innovating and manufacturing reliable liquid cooling technology. In order
to provide superior manufacturing and service capacity to its growing list of global customers, CoolIT has engaged
in a commercial partnership with STULZ, a world leading solution provider of energy efficient temperature and
humidity management technology. With 7 production plants, 17 subsidiaries and more than 140 partners around
the world, the strategic relationship with STULZ increases CoolIT's ability to better serve the data center industry
with forward-thinking designs, solutions and services.
Disclosed Customers
Solution Partners
Technology Partners
© CoolIT Systems, Inc. All rights reserved.
APEX
nualized)
Direct Contact Liquid Cooling (DCLC )
™
Maximizing Data Center Performance
Direct Contact Liquid Cooling (DCLC™) uses the exceptional thermal conductivity of liquid to provide dense, concentrated cooling to targeted
surface areas. By integrating DCLC, dependence on fans, expensive air conditioning and air handling systems is drastically reduced, enabling
extremely high rack densities, reduced power use and access to higher performance potential. Supported by options for data centers with or
without facility water hook up, any server in any rack can be liquid cooled by CoolIT, and can immediately benefit from measurable OPEX savings.
CAPEX
(annualized)
OPEX
OPEX
(annualized)
(annualized)
Performance
Facilitate peak performance
for higher powered or
overclocked processors
Efficiency
Benefit from a significant
reduction in total data center
energy consumed
Density
Enable 100% utilization of
rack and data center spaces
Scalability
Meet fluctuating demands
through the ability to modify
data center capacity
Quiet
Relieve employees from
the disruption of screaming
server fans
Savings
Generate immediate and
measurable OPEX benefits
and reduce overall TCO
Density
OPEX Rack Power Rack
Rack Power
ASHRAE W3-W5 (2°C-45°C) warm liquid cooling eliminates the
need for chilled water supply, delivering a rapid ROI. The initial
cost of integrating liquid cooling is quickly offset by several factors:
(annualized)
Total IT PowerTotal IT Power
1.5 MW
1.5 MW
1.5 MW
1.5 MW
• MW
High density
require
less data center equipment
1.8solutions
MW
Total Data Center
2.7 MW
1.8 MW
Total Power
Data Center2.7
Power
*Including Cooling IT *Including
UPS & AUX
Cooling IT UPS & AUX
# of Racks Required
100
# of Racks Required
IT Density
IT Density
(racks, switches, etc.), lowering overall CAPEX
100 55
55
15kW/rack 15kW/rack
27.7kW/rack 27.7kW/rack
•
Warm liquid cooling reduces OPEX by an average of 22%
* Using Koomey’s*data
center
costing
methods
Using
Koomey’s
data
center costing methods
22% REDUCTION
Operating Expenses
www.coolitsystems.com
80% INCREASE
Rack Capacity
Phone: +1 403.235.4895
A Modular Approach to Liquid Cooling
Three simple steps to configure a cooling system for your unique application
Rack DCLC utilizes a three module "building block" approach (Server Module, Manifold Module and Heat Exchange Module) that
provides a tremendous amount of product flexibility when integrating liquid cooling into any compute environment or configuration.
Step 1: Select Server Module
CoolIT Systems' Server Modules can cool any combination of CPU, GPU and Memory components, with customization
available for VR, ASIC, FPGA and other devices. Servers remain hot-swappable and simple to service.
CPU Cooling: CoolIT's R4, RP2 and RX1
(purpose-built for Intel Xeon and Intel Xeon
Phi) are passive CPU cooling solutions
managed
by
centralized
pumping
architectures. These coldplate assemblies
are specifically designed to accommodate
lower profile footprints,
such as 1U
blades and other custom chassis.
GPU Cooling: CoolIT's GPU cooling
product line supports passive coldplate
assemblies for NVIDIA and AMD.
Designed specifically to support NVIDIA
Tesla P100 GPU accelerator, the CoolIT
GP1 is a full coverage coldplate that
enables NVIDIA Pascal™ SXM2 solutions
in 1U applications.
Memory Cooling: CoolIT's full coverage
Memory Cooling solutions are designed
for standard height memory modules and
custom configurations. Routing coolant
directly above the DIMMs simplifies design
and maximizes serviceability. Combined
with processor coldplates, 80% of total
server heat can be captured by liquid.
A key component of the Server Module, CoolIT Systems’ patented
Split-Flow Coldplates are solid copper components which deliver
superior performance for today’s high thermal density processors.
The Split-Flow design uses microchannel architecture to minimize
pressure drop, maximize coolant flow, and direct the coolest liquid
to the hottest area of the processor first.
At only 2.4mm in height, Coldplates are easily integrated into
extremely compact, low-profile blade architectures, and allow
for optimal performance.
Custom Coldplate designs are available.
© CoolIT Systems, Inc. All rights reserved.
Step 2: Select Manifold Module
The Rack DCLC Manifold Module manages liquid distribution between the Heat Exchange Module and any number of Server
Modules. Manifold Modules can be customized to suit any server or rack environment. CoolIT Systems Manifold Modules are
incredibly reliable and robust, utilizing a stainless steel body combined with 100% non-drip quick disconnects.
Rack Manifold: Made with reliable
stainless steel and 100% non-drip quick
disconnects, CoolIT's Rack Manifolds can
be installed horizontally or vertically for
connection at the front or back of the rack.
Chassis Manifold: User-friendly Chassis
Manifold design deploys blind-mate quick
disconnects to integrate into blade-style
chassis and accommodates small
misalignments when connecting server.
Dry-break Quick Disconnects: Stäubli
is CoolIT's expert choice for quick
disconnect technology. Featuring double
shut-off valves, these 100% non-drip
quick disconnects are made of metal to
ensure long-lasting component reliability.
Step 3: Select Heat Exchange Module
While Server Modules and Manifold Modules are installed with each system and are local to the rack, the appropriate heat
rejection method may vary. CoolIT Systems' Rack DCLC product line offers a variety of Heat Exchange Modules depending
on load requirements and availability of facility water, including CHx (Liquid-to-Liquid), AHx (Liquid-to-Air) and custom options.
CHx Modules (Liquid-to-Liquid)
AHx Modules (Liquid-to-Air)
Customized solutions for
your unique environment
www.coolitsystems.com
Phone: +1 403.235.4895
Liquid-to-Liquid heat exchanger which manages a network of IT cabinets
The CHx650 Module manages the distribution of clean,
treated coolant to and from a network of IT cabinets. This
stand-alone CHx accepts ASHRAE W3-W5 warm facility
water and can support 650kW of processor load per network.
The CHx650 Module is customizable to fit various data
center environments. Standard equipment groups offer N+1
redundancy, and when deployed can provide tier 4 resiliency.
Key Features
• Manages 650kW of IT load
• ASHRAE W3-W5 (2°C-45°C) warm water cooling
• Redundant centralized pumps
• Integrated control and monitoring system
(Webserver, Modbus, IPMI, SNMP)
• 4” LCD screen with touch functionality
• Internal leak detection system
• Stand-alone solution
• Integrated fill-pump
Key Benefits
• Warm water cooling reduces the need for chillers
• Quick and easy installation and service
• Significantly reduces OPEX
• Reduces the need for CRACs
• Isolates facility water from racks
• Serviceable onsite - no down time for maintenance
• High temperature return water can be used for heat re-use
CHx650
Capacity
CHx650 Module
CoolingCooling
Capacity
Maximum
(kW) vs.
Maximum Cooling
Cooling Load
Load (kW)
vs. Facility
Facility Liquid
LiquidInput
InputTemperature
Temperature(°C)
(°C)
Capacity (kW)
1000
750
500
250
Cooling Capacity
(@ 30°C facility liquid)
650kW
Power Consumption
(Max)
4.2kW
Racks per Solution
5-20
ROI (months)
1-6
Facility Liquid Integration
Yes
0
10
20
30
40
50
Facility Input Temperature (°C)
© CoolIT Systems, Inc. All rights reserved.
Liquid-to-Liquid heat exchanger which manages a single IT cabinet
The CHx80 Module meets today's most demanding
HPC requirements. Capable of managing 80kW+
of heat load in a remarkably small 4U of space, this
system provides cooling for 120 servers or more.
The CHx80 is an extremely efficient heat exchanger that uses
ASHRAE W3-W5 warm water to manage processor and
component heat. As a result, users can expect a significant
reduction in data center OPEX.
Key Features
• Manages 80kW+ cooling capacity per rack
• ASHRAE W3-W5 (2°C-45°C) warm water cooling
• Redundant centralized pumps
• Dry-break quick disconnects
• 4.3” LCD screen with touch functionality
• Integrated control and monitoring system
(Webserver, Modbus, SNMP)
• Internal and external leak detection system
• 4U rack mount chassis
• Integrated fill-pump
Key Benefits
• Warm water cooling reduces the need for chillers
• Manages 120+ servers per rack
• Quick and easy installation and service
• Uses only 652W
• Can be located anywhere in a rack
• High temperature return water can be used for heat re-use
CHx80 Module Cooling Capacity
Total (W)
Cooling
Capacity
(W) vs
Facility
Flow Facility
Rate Liquid Temperatures (°C)
Total Cooling Capacity
vs. Facility
Flow Rate
(L/min)
@ Varying
(L/min) @ Varying Facility Liquid Temperatures ( C)
15%PG Coolant (Secondary and Primary), 40L/min Seconday Flow
Cooling Capacity
(@ 30°C facility water)
80kW
Power Consumption
(Max)
652W @ 115VAC
60000
Racks per Solution
1
40000
ROI (months)
1-6
20000
Facility Water Integration
Yes
Facility water temperature
120000
20°C
30°C
40°C
Max Power (W)
100000
80000
0
20
25
30
35
40
45
50
55
60
65
70
Facility Flow Rate (L/min)
www.coolitsystems.com
Phone: +1 403.235.4895
Liquid-to-Liquid heat exchanger which manages a single IT cabinet
The CHx40 Module manages the distribution of coolant and
heat exchange within a single IT cabinet. This 2U CHx accepts
ASHRAE W3-W5 warm facility water and manages 40kW+ of
processor load per rack.
Key Features
• Manages 40kW+ cooling capacity per rack
• ASHRAE W3-W5 (2°C-45°C) warm water cooling
• Redundant centralized pumps
• Integrated control and monitoring system
(Webserver, Modbus, IPMI, SNMP)
• 4.3” LCD screen with touch functionality
• Internal leak detection system
• Dry-break quick disconnects
• 2U rack mount chassis
Key Benefits
• Warm water cooling reduces the need for chillers
• Manages 50+ servers per rack
• Quick and easy installation and service
• Dramatically increases CPU/GPU density
• Reduces the need for CRACs
• High temperature return water can be used for heat re-use
CHx40 Module Cooling Capacity
CHx40 Cooling Capacity
Cooling Capacity (kW)
Maximum Cooling Load (kW) vs. Facility Flow Rate (L/min)
Cooling Capacity
(@ 30 °C facility water)
40kW
Power Consumption
(Max)
110-120W
30
Racks per Solution
1
20
ROI (months)
1-6
10
Facility Water Integration
Yes
60
Facility water temperature
20°C
30°C
40°C
50
40
0
10
20
30
40
Facility Flow Rate (L/min)
© CoolIT Systems, Inc. All rights reserved.
Liquid-to-Air heat exchanger which manages powerful clusters in limited space
The AHx20 Module packs an incredible amount of heat load
management into a small form factor. Available in top-of-rack
or in-rack configurations, this AHx solution provides superior
processor performance and enables very high densities.
The AHx20 Module is perfect for compute environments that
are short on space, big on compute, and do not have access
to facility water.
Key Features
• Manages 20kW+ cooling capacity per rack
• No facility water required
• Redundant centralized pumps
• Integrated control and monitoring system
(Webserver, Modbus, IPMI, SNMP)
• 4.3" LCD screen with touch functionality
• Internal leak detection system
• Dry-break quick disconnects
Key Benefits
• Dramatically increases CPU/GPU density
• Stand-alone rack-based liquid cooling
• Monitor system health remotely
• Easily upgradable to CHx Module
AHx20 Module Cooling Capacity
Capacity
Maximum Cooling
LoadCooling
(kW) vs.
Facility
AirFacility
Inlet Temperature
(°C)
Maximum
Load
(W) vs.
Air Inlet Temperature
(°C)
Capacity (kW)
30
22.5
15
7.5
Cooling Capacity
(@ 25°C facility air)
20kW
Power Consumption
(Max)
300W
Racks per Solution
1
ROI (months)
1-12
Facility Water Integration
No
0
10
20
30
40
50
Facility Air Inlet Temperature (°C)
www.coolitsystems.com
Phone: +1 403.235.4895
Case Studies
Customer: Poznan Supercomputing and Networking Center
Objective: Double compute capacity within existing infratructure and floor space
HPC Setup
• 1.8 petaFLOPS cluster
• 2 CoolIT Systems Rack DCLC™ CHx650
• CPU, RAM and VRM cooled by liquid
• 30kW per rack
• 40 - 45°C primary fluid supply temperature
• Huawei E9000 chassis
• Huawei CH121 server
• 1,232 Huawei blade servers across 19 racks
Results
• 85% of total IT load managed by liquid cooling
• 75% fan speed reduction
• Waste energy reused to heat surrounding buildings
• Ranked on TOP500 and Green500 lists
• Greenest supercomputer in Poland
“Reducing energy usage and lowering operating costs are permanently
on our checklist when planning for new High Performance Computing
clusters. Liquid cooling is the most efficient way to achieve our
objectives and we are seeing excellent results and reliability from the
combined Huawei and CoolIT Systems cluster.”
Radoslaw Januszewski, IT Specialist, PSNC
Customer: Center for Biological Sequence Analysis at Denmark Technical University
Objective: Maximize energy efficiency within containerized space
HPC Setup
• CoolIT Systems Rack DCLC™ CHx40
• Dual CPU liquid cooled server modules
• HP ProLiant DL560 Gen8 servers
• Modular data center
• 45°C primary fluid supply temperature
• 14kW total rack load (130W CPUs x 108)
• 563 gigaFLOPS per server (at peak performance)
Results
• 72% of total IT load managed by liquid cooling
• Waste energy reused to heat surrounding buildings
• Ranked on TOP500 List of Supercomputing Sites
“An important goal for CBS-DTU was provisioning these computational
resources as efficiently as possible. CoolIT delivered a liquid cooled
system that lowers the energy consumed for cooling and provides
opportunities to reuse the waste heat from the servers.”
Peter Løngreen, Head of HPC, CBS-DTU
© CoolIT Systems, Inc. All rights reserved.
High Density Chip-to-Atmosphere
Data Center Cooling Solutions
Chip-to-Atmosphere™
One Unified Solution and Service Vendor
STULZ and CoolIT Systems have partnered to deliver innovative cooling solutions and worldwide service support to the data center industry.
Chip-to-Atmosphere™ cooling solutions allow customers to capture dense heat loads at the source (inside the servers) and efficiently
CoolITit Systems
and STULZ
have partnered
offer a full range
centercooling
coolingproducts
solutionswhich
that actively
transport
heat
from Chip-tomove
to the outside
atmosphere.
STULZ is to
world-renowned
forofitsdata
precision
are combined
with
CoolIT's
industry
Atmosphere. STULZ is world-renowned for its precision Air Cooling products which can now be combined with CoolIT’s industry leading
leading Rack DCLC™ technology. The result is ultra-efficient total thermal solutions that support any OEM server at even the highest density
Direct Contact Liquid Cooling (DCLC™) systems. The result is ultra-efficient total thermal solutions that support any OEM server at even the
configurations
through one unified vendor.
highest density- all
configurations.
When integrated, CoolIT Systems' Rack DCLC solution can capture 60-80% of the servers' heat directly into liquid. To compliment this, STULZ
When integrated, CoolIT Systems’ DCLC system can capture 60-80% of the servers’ heat directly into liquid. To compliment this, STULZ Air
precision
cooling products
capture
the of
balance
of the
lowerheat
density
heat efficiently.
A considerable
benefit
forms
whenheat
the energy
total heat
energy
Cooling products
capture the
balance
the lower
density
efficiently.
A considerable
benefit forms
when
the total
from
both
from
both
systems
is
consolidated,
transported
outside
and
then
dissipated
or
recaptured
for
reuse,
to
heat
nearby
buildings,
for
example.
systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.
The modular Chip-to-Atmosphere™ approach combines CoolIT's DCLC solutions with STULZ-engineered precision cooling systems to
The modular Chip-to-Atmosphere approach combines CoolIT’s DCLC solutions with STULZ-engineered precision cooling systems to address
address
high server
densityconfigurations
data center configurations
today and tomorrow.
high density
for today and for
tomorrow.
1. Server Module
2. Manifold Module
3. Heat Exchange Module
4. Precision Air Conditioner
5. Heat Rejection System
STULZ
Micro
DC
Optimize Data
Center
Potential
Work with
the STULZ-CoolIT
technical teams
during
planning
stagesliquid
to strategize
unique solution
Chip-to-Atmosphere
High
density,
stand-alone
Micro
Data
Center
cooling
solutions that can be
optimized for the highest efficiency while minimizing capital cost. Once installed, feel confident that the complete solution is supported by
the STULZ worldwide service organization for years of trouble-free operation. Chip-to-Atmosphere data center cooling solutions will enable
STULZ
Micro
DC provides
a completely
enclosed,
high-density
customers
to benefit
from immediate
OPEX results
with minimal
footprint,computing
even in the most compute-heavy environments.
environment that is suitable for applications beyond the typical white space. The
Micro DC offers a significant reduction in size for highly dense heat load applications
Efficiency
Performance
employing a combination of cooling from an integral precision cooling unit and direct
Benefit from a significant
Facilitate peak performance
contact liquid cooling. With support
for racks
up to
reduction in total data center
for higher
powered
or64kW, the Micro DC is the ideal
solution to manage high performance
computing
requirements in any environment.
energy consumed
overclocked
processors
Configurations can be purpose built to include various options for heat rejection.
Density
Enable 100% utilization of
All cooling managed within rackrack
structure
withcenter
integrated
STULZ CyberRow and
and data
spaces
CoolIT Systems' Rack DCLC™ system:
Typical IT and Cooling Configuration
•
Single 48u rack
•
Scalability
1 STULZ CyberRow unit (N+1
available)
Meet fluctuating demands
1 CHx80 Heat Exchange Module
through (4u)
the ability to modify
100% of servers equippeddata
withcenter
CoolITcapacity
Rack DCLC:
•
•
Modular
Customized module
configurations to fit any unique
application or environment
Savings
Generate immediate and
measurable OPEX benefits
and reduce overall TCO
– 64 kW of servers equipped with DCLC
Those interested
– 70% =in44.8
kW liquid Chip-to-Atmosphere
cooled
incorporating
solutions into their projects should contact their local CoolIT Systems or STULZ sales
representative.
Alternatively,
visit
www.coolitsystems.com
or www.stulz-usa.com for more information.
– 30% = 19.2 kW air cooled
•
pPUE = 1.24
For more information contact your CoolIT Systems sales representative.
www.coolitsystems.com
Phone: +1 403.235.4895
@coolitsystems
sales@coolitsystems.com
www.coolitsystems.com
Phone: +1 403.235.4895
Download PDF
Similar pages