COM Express Modules
Board Placement
NEW
VIA
COMe-9X90
COM Express Module, Type
6, Basic Form Factor with
VIA Nano™ X2 E, HDMI, VGA,
LVDS, DisplayPort, LAN, USB
3.0 & USB 2.0
VIA VX11PH
VIA Nano™ X2 E
Features
Specifications
„„ VIA dual core Nano™ X2 E
processors
Model Name
Core
„„ Supports up to 16GB two
DDR3 SODIMM sockets
„„ Integrated VIA Chrome™ 640
DX11 3D/2D graphics with
MPEG2, WMV9/VC1, H.264
decoding acceleration
„„ Supports 18/24-bit dualchannel LVDS panel, two
DisplayPort or two HDMI
ports
Video
„„ Supports two USB 3.0 and 6
USB 2.0 ports
Ethernet
IO
Mechanical &
Environment
COMe-9X90
1.2GHz VIA Nano™ X2 E
VIA VX11PH Media System Processor
2 x DDR3 1333 SODIMM sockets, support up to 16GB memory size
AMI uEFI BIOS, 32Mbit SPI flash memory
32/64bit Windows 7 & 8
Windows Embedded Standard 7
Embedded Linux
Hardware Monitoring CPU temperature reading, CPU fan speed reading
System voltage monitoring
Watch Dog Timer
Software programmable
Chipset
Integrated VIA Chrome™ 640 DX11 3D/2D graphics with MPEG2,
WMV9/VC1, H.264 decoding acceleration
Graphics Memory
Optimized Unified Memory Architecture (UMA) support frame buffer
size from 64MB to 1GB (BIOS)
Digital Display
Up to 2 x HDMI or 2 x DisplayPort
Interface
LVDS
Dual channel 18-bit/24-bit LVDS (VIA VT1636 or Chrontel CH7305)
CRT
Analog VGA port supports up to 2048 x 1536 resolution
LAN
RealTek RTL8111G 10/100/1000M PCI-e Gigabit Ethernet controller
Audio
1 x HD audio digital interface
PCIe
4 x PCIe Gen2 x 1
USB
2 x USB 3.0 ports
6 x USB 2.0 ports
SATA
2 x SATA II ports
LAN
1 x LAN port
Serial
2 x Serial ports with TX and RX signals
Expansion Buses
1 x System Management Bus (SMBus) interface
1 x I2C bus
1 x SDIO interface as default (shared with GPIO 4 INs 4 OUTs via
VX11PH)
1 x Low Pin Count (LPC) bus
1 x SPI
Supports ExpressCard, speaker out, reset function, thermal protection,
suspend/wake signals, power button, fan control signals
System Monitoring & Wake-on-LAN
Management
System power management, AC power failure recovery
ETX Compliance
COM Express™ type 6, basic module
Form Factor
95 mm x 125 mm (3.73” x 4.92”)
Operating
0°C ~ 60°C
Temperature
Storage Temperature -40°C ~ 70°C
Operating Humidity
0% ~ 95% (relative humidity; non-condensing)
Compliance
CE/FCC/BSMI/RoHS
Processor
Chipset
System Memory
BIOS
Operating Systems
Base Board (COMEDB4)
* The carrier board is only for evaluation purpose.
Specifications
Model name
Audio
Super I/O
BIOS
COM Express Module Type
Onboard Connectors
Onboard Slots
Onboard Pin Headers
Onboard Front I/O Connector
Onboard Rear I/O Connectors
Switch
Form Factor & Dimension
Operating Temperature
Operating Humidity
Storage Temperature
Storage Humidity
Operating System
COMEDB4
VIA VT2021 High Definition Audio Codec
Fintek F71869 LPC Super I/O
AMI BIOS
32M-bit SPI BIOS for uEFI
Support basic/compact form factor type 6
1 x Dual-channel 18/24-bit LVDS connector
1 x Inverter connector
1 x CD In w/housing connector
1 x SPDIF w/housing connector
1 x ATX power connector and 1 AUX power connector (for ATX mode), or only 1 AUX power connector (for AT mode)
2 x SATA connectors
2 x FAN with housing connectors for CPU FAN & System FAN
3 x PCIe x1 slots
1 x Mini PCIe socket
1 x COM2 pin header, add +5V/+12V power select option on RI pin
1 x LPT pin header
1 x SPI pin header
1 x LPC pin header
1 x DIO1 pin header, shared with SDIO connector
1 x DIO2 pin header (from Fintek F71869)
1 x SMBUS pin header
1 x I2C pin header
2 x USB 2.0 pin headers for USB 2.0 ports 0 ~ 3
1 x Clear CMOS/password pin header
1 x Inverter Voltage Select pin header
1 x Panel Power Select pin header
1 x Front LAN LED pin header
1 x Front Audio pin header
1 x BIOS Select pin headers for select module/carrier board SPI BIOS
1 x Front panel pin header for HDD LED, Power LED, Switch and Speaker
1 x SD card connector as default, shared with DIO1 pin header
1 x VGA D-Sub connector with COM D-Sub connector, COM port add +5V/+12V power select option on RI pin
2 x DisplayPort connectors
1 x Stack type 2 ports USB 3.0 connector with Gb Ethernet RJ45 connector
1 x Stack type 2 ports USB 2.0 connector
1 x Stack type 6 ports audio I/O connector (support multi-channel audio outputs)
1 x Power button switch
1 x Reset switch
Micro-ATX form factor
Dimension: 10" x 9.6" (6 layers)
0°C ~ 60°C
95% relative humidity
-40°C ~ 70°C
95% relative humidity
32/64bit Windows 7 & 8, Windows Embedded Standard 7, Embedded Linux
Ordering Information
Model Name
COMe-9X90
CPU Frequency
1.2GHz Nano™ X2 E
COMEDB4
99G42-01380A
N/A
N/A
Description
COM Express Module with 1.2GHz Nano™ X2 E CPU, VGA, LVDS, 2 x HDMI or 2 x
DisplayPort, 6 x USB 2.0, 2 x USB 3.0, 1 x GigaLAN
COMe-9X90 Evaluation Carrier Board
COMe-9X90 Heatsink with Fan
Block Diagram
PWM
ISL6262ACRZ
VID0 ~ VID6
0.300V ~ 1.500V
VIA Nano X2 E
1.2GHz
Clock Generator
9LVRS720BKLF
533MHz/800MHz/1066MHz
ROW C-D
ROW A-B
LVDS
VT1636 /
CH7305
VGA Port
DVP Port
MCLKO
DRAM BUS
4 x PCIE X1 Lane
10/100/1000 LAN
RTL8111G(S)
DDR3
SO-DIMM x 2
PCIE X1 Lane
HD Audio
USB 3.0 X 2 Ports
2 X SATA Ports
VX11PH
USB 2.0 X 6 Ports
DDI 1 ( Display Port / HDMI from DP0)
LPC BUS
SMBUS
DDI 2 ( Display Port / HDMI from DP1)
I2C BUS
SPI BUS
EEPROM
4K bits
SPI BIOS
GPIO
GPIO/SDIO
Resistor Select
(Default SDIO)
SDIO
* All product specifications are subject to change without notice. Update: Aug. 16, 2013.
www.viaembedded.com
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