BIPOLAR ANALOG INTEGRATED CIRCUIT
PC3240TB
3.3 V, SILICON MMIC WIDE BAND AMPLIFIER
DESCRIPTION
The PC3240TB is a silicon monolithic integrated circuit designed as IF amplifier for DBS LNB.
This device exhibits low noise figure and high power gain characteristics.
This IC is manufactured using our UHS0 (Ultra High Speed Process) bipolar process.
FEATURES
• Low current
: ICC = 13 mA TYP.
• High linearity
: PO (1 dB) = +1 dBm TYP. @ f = 1.0 GHz
: PO (1 dB) = 4 dBm TYP. @ f = 2.2 GHz
• Power gain
: GP = 25 dB TYP. @ f = 1.0 GHz
: GP = 24.5 dB TYP. @ f = 2.2 GHz
• Gain flatness
: GP = 1.0 dB TYP. @ f = 1.0 to 2.2 GHz
• Noise figure
: NF = 4.3 dB TYP. @ f = 1.0 GHz
: NF = 4.5 dB TYP. @ f = 2.2 GHz
• Supply voltage
: VCC = 3.0 to 3.6 V
• Port impedance
: input/output 50 
APPLICATIONS
• IF amplifiers in DBS LNB, other L-band amplifiers, etc.
ORDERING INFORMATION
Part Number
PC3240TB-E3
Order Number
Package
PC3240TB-E3-A 6-pin super minimold
(Pb-Free)
Marking
C3W
Supplying Form
 Embossed tape 8 mm wide
 Pin 1, 2, 3 face the perforation side of the tape
 Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: PC3240TB-A
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
Document No. PU10751EJ01V0DS (1st edition)
Date Published February 2009 NS
PC3240TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
OUTPUT
2
GND
3
VCC
4
INPUT
5
GND
6
Note
NC
Note
NC: Non-Connection
(Connect with pin 5)
Remark A NC pin is non-connection in the mold package. (When NC pin is open state, it will get influences of
floating capacitance. Therefore, we recommend connect to NC pin and GND pin).
PRODUCT LINE-UP OF 5 V or 3.3 V-BIAS SILICON MMIC WIDE BAND AMPLIFIER
(T A = +25°C, VCC = 5.0 V or 3.3 V, ZS = ZL = 50 )
Part No.
PC2711TB
VCC
ICC
GP
NF
PO (sat)
PO (1 dB)
(V)
(mA)
(dB)
(dB)
(dBm)
(dBm)
5.0
12.0
13.0 (1.0 GHz)
5.0 (1.0 GHz)
＋1.0 (1.0 GHz)
–
6-pin
–
super
PC2712TB
12.0
PC3215TB
14.0
20.5 (1.5 GHz)
2.3 (1.5 GHz)
＋3.5 (1.5 GHz)
＋1.5 (1.5 GHz)
PC3224TB
9.0
21.5 (1.0 GHz)
4.3 (1.0 GHz)
＋4.0 (1.0 GHz)
–3.5 (1.0 GHz)
21.5 (2.2 GHz)
4.3 (2.2 GHz)
＋1.5 (2.2 GHz)
–5.5 (2.2 GHz)
22.0 (1.0 GHz)
4.7 (1.0 GHz)
–1.0 (1.0 GHz)
–6.5 (1.0 GHz)
22.0 (2.2 GHz)
4.6 (2.2 GHz)
–3.5 (2.2 GHz)
–8.0 (2.2 GHz)
25 (1.0 GHz)
4.3 (1.0 GHz)
–
＋1.0 (1.0 GHz)
24.5 (2.2 GHz)
4.5 (2.2 GHz)
–
–4.0 (2.2 GHz)
PC3227TB
PC3240TB
4.8
3.3
13.0
20.0 (1.0 GHz)
4.5 (1.0 GHz)
＋3.0 (1.0 GHz)
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
2
Data Sheet PU10751EJ01V0DS
Package
Marking
C1G
C1H
minimold
C3H
C3K
C3P
C3W
PC3240TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25°C
4.0
V
Total Circuit Current
ICC
TA = +25°C
25
mA
Power Dissipation
PD
TA = +85C
270
mW
Operating Ambient Temperature
TA
40 to +85
°C
Storage Temperature
Tstg
55 to +150
°C
Input Power
Pin
10
dBm
Note
TA = +25°C
Note Mounted on double-sided copper-clad 50  50  1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
3.0
3.3
3.6
V
Operating Ambient Temperature
TA
40
+25
+85
°C
Input Power
Pin


20
dBm
Data Sheet PU10751EJ01V0DS
3
PC3240TB
ELECTRICAL CHARACTERISTICS (T A = +25°C, VCC = 3.3 V, ZS = ZL = 50 , unless otherwise
specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
No input signal
9.5
13
17
mA
dB
Circuit Current
ICC
Power Gain 1
GP1
f = 0.25 GHz, Pin = 40 dBm
22
25
28
Power Gain 2
GP2
f = 1.0 GHz, Pin = 40 dBm
22
25
28
Power Gain 3
GP3
f = 1.8 GHz, Pin = 40 dBm
22.5
25.5
28.5
Power Gain 4
GP4
f = 2.2 GHz, Pin = 40 dBm
21.5
24.5
27.5
PO (1 dB) 1
f = 1.0 GHz
2
+1

PO (1 dB) 2
f = 2.2 GHz
7
4

Noise Figure 1
NF1
f = 1.0 GHz

4.3
5.1
Noise Figure 2
NF2
f = 2.2 GHz

4.5
5.3
Isolation 1
ISL1
f = 1.0 GHz, Pin = 40 dBm
37
42

Isolation 2
ISL2
f = 2.2 GHz, Pin = 40 dBm
37
44

Input Return Loss 1
RLin1
f = 1.0 GHz, Pin = 40 dBm
10
23

Input Return Loss 2
RLin2
f = 2.2 GHz, Pin = 40 dBm
10
13

Output Return Loss 1
RLout1
f = 1.0 GHz, Pin = 40 dBm
8
12

Output Return Loss 2
RLout2
f = 2.2 GHz, Pin = 40 dBm
7
12

Gain 1 dB Compression Output Power
dBm
1
Gain 1 dB Compression Output Power
2
dB
dB
dB
dB
STANDARD CHARACTERISTICS FOR REFERENCE
(T A = +25°C, VCC = 3.3 V, ZS = ZL = 50 , unless otherwise specified)
Parameter
Symbol
Test Conditions
Reference Value
Unit
dB
Power Gain 5
GP5
f = 2.6 GHz, Pin = 40 dBm
22.5
Power Gain 6
GP6
f = 3.0 GHz, Pin = 40 dBm
20
Gain Flatness
GP
f = 1.0 to 2.2 GHz, Pin = 40 dBm
1.0
dB
K factor 1
K1
f = 1.0 GHz, Pin = 40 dBm
3.2

K factor 2
K2
f = 2.2 GHz, Pin = 40 dBm
4.6

dBm
Output 3rd Order Intercept Point 1
OIP31
f1 = 1 000 MHz, f2 = 1 001 MHz
12.5
Output 3rd Order Intercept Point 2
OIP32
f1 = 2 200 MHz, f2 = 2 201 MHz
5.5
Input 3rd Order Intercept Point 1
IIP31
f1 = 1 000 MHz, f2 = 1 001 MHz
13
Input 3rd Order Intercept Point 2
IIP32
f1 = 2 200 MHz, f2 = 2 201 MHz
19
IM2
f1 = 1 000 MHz, f2 = 1 001 MHz,
38
dBc
44
dBc
2nd Order Intermodulation Distortion
dBm
Pin = 40 dBm/tone
2nd Harmonics
4
2f0
f0 = 1.0 GHz, Pin = 40 dBm
Data Sheet PU10751EJ01V0DS
PC3240TB
TEST CIRCUIT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
Type
Value
C1, C2
Chip Capacitor
100 pF
C3
Chip Capacitor
1 000 pF
C4
Feed-through Capacitor
1 000 pF
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for
the input and output pins.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitances are therefore selected as lower impedance against a 50  load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
Data Sheet PU10751EJ01V0DS
5
PC3240TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Notes
1. 30  30  0.4 mm double sided 35 m copper clad
COMPONENT LIST
Value
polyimide board.
Size
2. Back side: GND pattern
C1, C2
6
100 pF
1608
C3
1 000 pF
1005
C4
1 000 pF
Feed-through Capacitor
3. Au plated on pattern
4.
: Through holes
Data Sheet PU10751EJ01V0DS
PC3240TB
TYPICAL CHARACTERISTICS (T A = +25C, VCC = 3.3 V, ZS = ZL = 50 , unless otherwise specified)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10751EJ01V0DS
7
PC3240TB
Remark The graphs indicate nominal characteristics.
8
Data Sheet PU10751EJ01V0DS
PC3240TB
Remark The graphs indicate nominal characteristics.
Data Sheet PU10751EJ01V0DS
9
PC3240TB
Remark The graphs indicate nominal characteristics.
10
Data Sheet PU10751EJ01V0DS
PC3240TB
Remark The graphs indicate nominal characteristics.
Data Sheet PU10751EJ01V0DS
11
PC3240TB
Remark The graphs indicate nominal characteristics.
12
Data Sheet PU10751EJ01V0DS
PC3240TB
Remark The graphs indicate nominal characteristics.
Data Sheet PU10751EJ01V0DS
13
PC3240TB
S-PARAMETERS (T A = +25C, VCC = 3.3 V, Pin = 40 dBm)
S11FREQUENCY
S22FREQUENCY
Remarks 1. Measured on the test circuit of evaluation board.
2. The graphs indicate nominal characteristics.
14
Data Sheet PU10751EJ01V0DS
PC3240TB
S-PARAMETERS
Data Sheet PU10751EJ01V0DS
15
PC3240TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
16
Data Sheet PU10751EJ01V0DS
PC3240TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC line.
(4) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Partial Heating
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
WS260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10751EJ01V0DS
17
Mouser Electronics
Authorized Distributor
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NEC:
UPC3221GV