SECOMExp-iCORE
User Manual
COM-Express™ Module with Intel® Core™ i3 / i5 / i7 / Celeron®
Processors and Intel® HM55 Express Chipset with Dual Channel
Memory
SECOMExp-iCORE
SECOMExp-iCORE
pag. 2
User Manual - Rev. First Edition: 0.1 - Last Edition: 1.0 - Author: S.B. - Reviewed by G.M.
REVISION HISTORY
Revision
Date
Note
Rif.
0.1
16/06/2011
Preliminary release
SB
0.2
15/02/2012
Added BIOS Section
SB
1.0
01/08/2012
Official Release, updated BIOS section
SB
All rights reserved. All information contained in this manual is confidential material and
property of SECO S.r.l.
Unauthorised use, duplication, modification or disclosure of the information to a third-party by any
means without prior consent of SECO S.r.l. is prohibited.
Every effort has been made to ensure the accuracy of this manual, however, SECO s.r.l. accepts
no responsibility for any inaccuracies, errors or omissions herein. SECO s.r.l. reserves the right to
change specifications without prior notice in order to supply the best product possible.
Many of the information found in BIOS SETUP Chapter has been extracted from the following
copyrighted Insyde Software Corp. documents:
• InsydeH2O™ Setup Utility – User Reference Guide
The above mentioned documents are copyright© 2008 Insyde Software Corp. All rights reserved.
For more information on this and other SECO products, please visit our web-site at:
http://www.seco.com.
For assistance and problem solving please contact SECO using the online Contact form available
at http://www.seco.com/en/contatti.html, specifying the product model and describing your problem
/ request.
SECO Srl - Via Calamandrei 91
52100 Arezzo – ITALY
Ph: +39 0575 26979 Fax: +39 0575 350210
http://www.seco.com
Copyright © 2012 SECO s.r.l.
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INDEX
CHAPTER 1.
1.1
1.2
1.3
1.4
1.5
1.6
W ARRANTY ............................................................................................................................................ 5
INFORMATION AND ASSISTANCE .............................................................................................................. 6
RMA NUMBER REQUEST ......................................................................................................................... 6
SAFETY ................................................................................................................................................. 7
ELECTROSTATIC DISCHARGES ................................................................................................................ 7
ROHS COMPLIANCE ............................................................................................................................... 7
CHAPTER 2.
2.1
2.2
2.3
2.4
2.5
2.6
INTRODUCTION ................................................................................................... 4
OVERVIEW ........................................................................................................... 8
INTRODUCTION....................................................................................................................................... 9
TECHNICAL SPECIFICATIONS ................................................................................................................. 10
ELECTRICAL SPECIFICATIONS ................................................................................................................ 11
MECHANICAL SPECIFICATIONS .............................................................................................................. 11
HEATSINK ............................................................................................................................................ 12
BLOCK DIAGRAM .................................................................................................................................. 13
CHAPTER 3.
CONNECTORS ................................................................................................... 14
3.1 CONNECTORS OVERVIEW ..................................................................................................................... 15
3.2 SO-DIMM DDR3 SOCKETS ................................................................................................................. 16
3.3 TACHOMETRIC FAN CONNECTOR .......................................................................................................... 16
3.4 COM EXPRESS™ MODULE CONNECTORS ............................................................................................. 16
3.4.1 COM Express Connector 1: Row A ............................................................................................. 17
3.4.2 COM Express Connector 1: Row B ............................................................................................. 19
3.4.3 COM Express Connector 2: Row C ............................................................................................. 21
3.4.4 COM Express Connector 2: Row D ............................................................................................. 23
CHAPTER 4.
INTRODUCTION ................................................................................................. 25
4.1 INSYDEH2O SETUP UTILITY ........................................................................................................... 26
4.2 MAIN SETUP MENU .......................................................................................................................... 26
4.2.1 Language ..................................................................................................................................... 26
4.2.2 System Time/System Date .......................................................................................................... 26
4.3 ADVANCED MENU ........................................................................................................................... 27
4.3.1 Boot Configuration Submenu....................................................................................................... 27
4.3.2 Peripheral Configuration Submenu.............................................................................................. 27
4.3.3 IDE Configuration Submenu ........................................................................................................ 28
4.3.4 Thermal Configuration Submenu ................................................................................................. 28
4.3.5 Video Configuration Submenu ..................................................................................................... 29
4.3.6 USB Configuration Submenu ....................................................................................................... 31
4.3.7 Chipset Configuration Submenu .................................................................................................. 32
4.3.8 ACPI Table/features Submenu .................................................................................................... 33
4.3.9 PCI Express Configuration Submenu .......................................................................................... 33
4.4 SECURITY MENU ............................................................................................................................. 35
4.5 POWER MENU .................................................................................................................................. 36
4.5.1 Advanced CPU Control Submenu ............................................................................................... 37
4.5.2 Platform Power Management Submenu ...................................................................................... 37
4.5.3 Break Event Submenu ................................................................................................................. 37
4.6 BOOT MENU ..................................................................................................................................... 38
4.7 EXIT MENU........................................................................................................................................ 39
Copyright © 2012 SECO s.r.l.
SECOMExp-iCORE
SECOMExp-iCORE
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Chapter 1. INTRODUCTION
 Warranty
 Information and assistance
 RMA number request
 Safety
 Electrostatic Discharges
 RoHS compliance
Copyright © 2012 SECO s.r.l.
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1.1 Warranty
This product is subject to Italian law D. Lgs 24/2002, acting European Directive 1999/44/CE on
arguments of sale and warranties to consumer.
The warranty for this product lasts 1 year
Under the warranty period the Supplier guarantees the buyer an assistance service for repairing,
replacing or credit of the item, at its own discretion.
Shipping costs regarding non-conforming items or items that need replacement, are to be paid by
the customer.
Items cannot be returned unless formerly authorised by the supplier.
The authorisation is released after compiling the specific form available from the web-site
http://www.seco.com/ (RMA Online). Authorisation number for returning the item must be put both
on the packaging and on the documents brought with the items, that have to be not damaged, not
tampered, with all accessories in their original packaging.
Error analysis form identifying the fault type has to be compiled by the customer and has to be sent
in the packaging of the returned item.
If some of the above mentioned requirements for returning the item is not satisfied, item will be
shipped back and customer will have to pay for shipping costs.
The supplier, after a technical analysis, will verify if all the requirements for warranty service are
met. If warranty cannot be applied, he calculates the minimum cost of this initial analysis on the
item and the repairing costs. Costs for replaced components will be calculated aside.
Warning!
All changes or modifications to the equipment not clearly approved by
SECO S.r.l. could impair equipment’s functionality and lead to the
expire of the warranty
Copyright © 2012 SECO s.r.l.
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1.2 Information and assistance
What do I have to do if the product is faulty?
SECO S.r.l. offers the following services:
SECO website: visit http://www.seco.com to receive the last information on the product. In
most of the cases you can find useful information to resolve your problem.
SECO reseller: the reseller or agent can help you in determining the exact cause of the
problem and search the best solution for it.
SECO Help-Desk: contact SECO Technical Assistance.
A technician is at your disposal to understand the exact origin of the problem and suggest
the right solution.
E-mail: technical.service@seco.com
Fax (+39) 0575 340434
Repairing centre: it is possible to send the faulty product to SECO Repairing Centre. In this
case, follow this procedure:
Returned items have to be provided with RMA Number. Items sent without RMA
number will be not accepted.
Returned items have to be packed in the appropriate manner. SECO is not responsible
for damages caused by accidental drop, improper usage, or customer neglects.
Note: We ask to prepare the following information before asking for technical assistance:
- Name and serial number of the product;
- Description of Customer’s peripheral connections;
- Description of Customer’s software (operative system, version, application software, etc.);
- A complete description of the problem;
- The exact words of every kind of error message received
1.3 RMA number request
To request a RMA number, please, visit SECO’s web-site. In the home-page select “RMA Online”
and follow the described procedure.
You will receive an RMA Number within 1 working day (only for on-line RMA request).
Copyright © 2012 SECO s.r.l.
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1.4 Safety
SECOMExp-iCORE module only uses extremely-low voltages.
While handling the board, it is necessary to be careful in order to avoid any kind of risk or damages
to electronic components. Always switch the power off, and unplug the power supply unit, before
handling the board and/or connecting cables or other boards.
Don’t use metallic components, like paper clips, screws and similar, near the board, when this is
supplied, to avoid short circuits due to unwanted contacts with other components of the board.
Never connect the board to an external power supply unit or battery, if the board has become wet.
Make sure that all cables are correctly connected and are not damaged.
1.5 Electrostatic Discharges
SECOMExp-iCORE, like any other electronic product, is an electrostatic sensitive device and some
device on-board could be damaged by high voltages caused by static electricity.
So whenever handling a SECOMExp-iCORE board, take care to ground yourself through an antistatic wrist strap. Placement of the board on an anti-static surface is also highly recommended.
1.6 RoHS compliance
SECOMExp-iCORE board is designed using RoHS compliant components and is manufactured on
a lead-free production line. It is therefore fully RoHS compliant.
Copyright © 2012 SECO s.r.l.
SECOMExp-iCORE
SECOMExp-iCORE
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Chapter 2. OVERVIEW
 Introduction
 Technical Specifications
 Electrical specifications
 Mechanical specifications
 Heatsink
 Block diagram
Copyright © 2012 SECO s.r.l.
SECOMExp-iCORE
SECOMExp-iCORE
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User Manual - Rev. First Edition: 0.1 - Last Edition: 1.0 - Author: S.B. - Reviewed by G.M.
2.1 Introduction
SECOMExp-iCORE is a CPU module, in COM Express™ format, based on Intel® iCore (i3, i5, i7)
or Celeron® families of CPUs, interfaced to Intel® QM57 or HM55 Express Chipsets, that complete
the standard functionalities.
A complete list of CPUs available is detailed in the next chapter.
All of these CPU offer a 64-bit Instruction set, and provide direct access to the memory, that is
available on two SODIMM DDR3 memory modules, with frequencies of 1033 MHz (max 800 MHz
with U3405), with a total capacity up to 8GB.
Please notice that total amount of 8GB of memory will be available only using 64-bit O.S.; 32 bit
O.S.s need to allocate a portion of the physical memory for legacy MMIO (Memory Mapped I/O),
Chipset MMIO and PCI Enumeration Area. In order to provide full support for the previously
mentioned areas, usable memory for application will be limited to 3GB on the total amount of
physical memory is installed.
All CPUs integrate an Intel® Graphics Media Accelerator, which offer an advanced 2D and 3D
graphic engine, and can also be connected to external graphical controllers using the PCI Express
x16 Graphic interface.
The QM57 or HM55 Express Chipset, furthermore, offers external LVDS Interface.
QM57 or HM55 Express Chipsets complete the functionalities of the board offering Audio HD
Interface, 6x PCI Express ports (4x ports using HM55), 4x Serial ATA channels, 1x IDE UDMA5
interface, GigaBit Ethernet, 8 USB 2.0 ports, Real Time Clock and Watch Dog Timer.
Please refer to following chapter for a complete list of all peripherals integrated and characteristics.
The product is COM Express™ standard compliant, an open industry standard defined specifically
for COMs (computer on modules). Its definition provides the ability to make a smooth transition
from legacy parallel interfaces to the newest technologies based on serial buses available today.
Specifically, SECOMExp-iCORE is a Basic COM Express™ module, Type 2 (95mm x 125mm).
For video interface pins, the board is compliant to COM Express™ Extension rel. 0.13.
COM Express™ module integrates all the core components and has to be mounted onto an
application-specific carrier board; carrier board designers can utilise as little or as many of the I/O
interfaces as deemed necessary. The carrier board can therefore provide all the interface
connectors required to attach the system to the application specific peripherals. This versatility
allows the designer to create a dense and optimised package, which results in a more reliable
product while simplifying system integration. Most importantly, COM Express™ modules are
scalable, which means once an application has been created there is the ability to diversify the
product range through the use of different performance class or form factor size modules. Simply
unplug one module and replace it with another, no redesign is necessary.
The robust thermal and mechanical concept, combined with extended power-management
capabilities, is perfectly suited for all applications.
Copyright © 2012 SECO s.r.l.
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2.2 Technical Specifications
CPU:
Intel® Core™ i3-330E @ 2.13GHz, 3MB Cache, 35W TDP
Intel® Core™ i5-520M @ 2.4GHz, 3MB Cache, 35W TDP
Intel® Core™ i7-660UE @ 1.06GHz, 4MB Cache, 18W TDP
Intel® Core™ i7-620LE @ 2GHz, 4MB Cache, 25W TDP
Intel® Core™ i7-610E @ 2.53GHz, 4MB Cache, 35W TDP
Intel® Celeron® P4505 @ 1.86GHz, 2MB Cache, 35W TDP
Intel® Celeron® U3405 @ 1.07GHz, 2MB Cache, 18W TDP
Chipset:
Intel® HM55 Express Chipset
DRAM:
Up to 8GB of 1066MHz DDR3 using two SO-DIMM sockets
Graphics:
Integrated Intel® HD graphics controller with dual independent display
support.
Single / Dual Channel 18/24 bit LVDS interface available
PCI Express Graphics x16 interface
CRT interface supports resolutions up to 2048x1536
Mass Storage:
1x EIDE Channel (UDMA-100/66/33)
4x S-ATA channels
PCI Express:
4 x PCI-E x1 lanes
USB:
8x USB 2.0 ports
Ethernet:
1x Gigabit Ethernet controller, Intel® WG82577LM
AUDIO:
HD audio interface
PCI BUS rev. 2.3
LPC Bus
SMBus
Watch Dog Timer
Fan Speed Monitoring
Power Management Signals, ACPI 2.0 compliant
Power supply voltage: +12VDC +/-5% and +5VSB (optional)
Dimensions:
(*)
125 x 95 mm (4.921” x 3.740”).
Operating temperature is the temperature reached on any spot of the heat-spreader plate.
Copyright © 2012 SECO s.r.l.
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2.3 Electrical specifications
SECOMExp-iCORE board needs to be supplied only with an external +12VDC power supply. For
working in ATX mode, also +5VSB voltage needs to be supplied. For Real Time Clock working and
CMOS memory data retention, it is also needed a backup battery voltage. All these voltages are
supplied directly through COM Express Connectors CN9 and CN10.
For board’s working, all remaining voltages needed are generated internally from +12VDC power
rail.
2.4 Mechanical specifications
SECOMExp-iCORE is a COM Express board Basic type, 95.0 mm x 125.0 mm (3.74” x 4.92”). The
height is approximately between 18 and 21mm (including optional heat-spreader) depending on
the carrier board connectors (5mm-high or 8mm-high connectors are used).
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2.5 Heatsink
Due to TDP of CPU used, it is necessary to use a finned heatsink with FAN for thermal disspation.
Here following, it will be shown how to fix the standard heatsink with fan on SECOMExp-iCORE
board.
Always contact SECO to know the best cooling solution for your SECOMExp-iCORE module
Copyright © 2012 SECO s.r.l.
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2.6 Block diagram
2 x DDR3
SO-DIMM
System
Memory
FSB 800 /
1033 MHz
®
CPU Intel
Core™ or
®
Celeron
18/24 bit Single/Dual
Channel LVDS
PEG x16
CRT
DMI
8 x USB PORTS 2.0
4 x S-ATA
PCI bus
PCI Express x1
PCI Express x1
JMicron
JMB368
PCIE-to-IDE
Bridge
®
Gigabit ETHERNET
interface
Intel
WG82577LM
Gigabit
Ethernet
Controller
SPI bus
COM-EXPRESS CONNECTOR
ROW A-B
®
Intel
HM55 Express
Chipset
4 x PCI Express x1
1 x P-ATA
LPC BUS
POWER MGMT AND CONTROL SIGNALS
BIOS Serial
Flash
SMBUS
4 x GPI + 4 x GPO
NXP PCA9957
I/O port
Texas Instruments
MSP430F2232
Microcontroller
WDT
Spectralinear
SL28748CLC
PLL
Copyright © 2012 SECO s.r.l.
SECOMExp-iCORE
FAN Control
COM-EXPRESS CONNECTOR
ROW C-D
HD Audio Interface
SECOMExp-iCORE
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Chapter 3. CONNECTORS
 Connectors overview
 SO-DIMM DDR3 Sockets
 COM Express™ module connectors
Copyright © 2012 SECO s.r.l.
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3.1 Connectors overview
According to COM Express™ specifications, all interfaces to the board are available through two
220 pin connectors, for a total of 440 pin. Simplifying the terminology in this documentation, the
primary connector is called A-B and the secondary C-D because both consist of two rows.
Top side
SO-DIMM
DDR3
Socket
Tachometric
Fan
Connector
Bottom side
SO-DIMM
DDR3
Socket
COM Express
connector 2 –
rows C + D
COM Express
connector 1 –
rows A + B
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3.2 SO-DIMM DDR3 Sockets
Processors used on SECOMExp-iCORE module provide support to 1033MHz DDR3 memories,
which can be housed on two SO-DIMM DDR3 sockets.
Top socket is type LOTES AAA-DDR-109-K01 or equivalent, a right angle, h=5.2mm, standard
type socket, used for high speed system memory applications.
Bottom socket is type Tyco 2-2013287-2 or equivalent, and is a socket with performances similar
to the other.
3.3 Tachometric FAN connector
SECOMExp-iCORE COM Express board is able to manage directly +12VDC fans, with speed
control management.
For the connection of the fan, a connector type MOLEX 53261-0371 or equivalent is available, with
the following pinout:
FAN Connector – CN11
Pin
Signal
1
GND
2
+12VDC
3
FAN_TACHOIN
3.4 COM Express™ module connectors
For the connection of COM Express™ CPU modules, on board there is one double connector, type
TYCO 3-1827231-6 (440 pin, ultra thin, 0.5mm pitch, h=4mm), as requested by COM Express™
specifications.
The pinout of these connectors will be briefly described in the following paragraphs. Please refer to
COM Express™ standard for a better description of each signal.
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3.4.1 COM Express Connector 1: Row A
PIN
Signal
Description
PIN
Signal
Description
1
GND
Power Ground
56
N.C.
Not Connected
2
GBE0_MDI3-
GbEth Differential pair 3 -
57
GND
Power Ground
3
GBE0_MDI3+
GbEth Differential pair 3 +
58
PCIE_TX4+
PCI-E lane 4 transmit +
4
GBE0_LINK100#
GbEth 100Mb/s link ind.
59
PCIE_TX4-
PCI-E lane 4 transmit -
5
GBE0_LINK1000#
GbEth 1000Mb/s link ind.
60
GND
Power Ground
6
GBE0_MDI2-
GbEth differential pair 2 -
61
PCIE_TX3+
PCI-E lane 3 transmit +
7
GBE0_MDI2+
GbEth Differential pair 2+
62
PCIE_TX3-
PCI-E lane 3 transmit -
8
GBE0_LINK#
GbEth link indicator
63
GPI1
General Purpose Input 1
9
GBE0_MDI1-
GbEth Differential pair 1 -
64
PCIE_TX2+
PCI-E lane 2 transmit +
10
GBE0_MDI1+
GbEth Differential pair 1 +
65
PCIE_TX2-
PCI-E lane 2 transmit -
11
GND
Power Ground
66
GND
Power Ground
12
GBE0_MDI0-
GbEth Differential pair 0 -
67
GPI2
General Purpose Input 2
13
GBE0_MDI0+
GbEth Differential pair 0 +
68
PCIE_TX1+
PCI-E lane 1 transmit +
14
GBE0_CTREF
GbEth Reference Voltage
69
PCIE_TX1-
PCI-E lane 1 transmit -
15
SUS_S3#
Suspend to RAM (S3) signal
70
GND
Power Ground
16
SATA0_TX+
SATA0 Transmit Data +
71
LVDS_A0+
LVDS Channel A Data 0 +
17
SATA0_TX-
SATA0 Transmit Data -
72
LVDS_A0-
LVDS Channel A Data 0 -
18
SUS_S4#
Suspend to Disk (S4) Signal
73
LVDS_A1+
LVDS Channel A Data 1 +
19
SATA0_RX+
SATA0 Receive Data +
74
LVDS_A1-
LVDS Channel A Data 1 -
20
SATA0_RX-
SATA0 Receive Data -
75
LVDS_A2+
LVDS Channel A Data 2 +
21
GND
Power Ground
76
LVDS_A2-
LVDS Channel A Data 2 -
22
SATA4_TX+
SATA4 Transmit Data +
77
LVDS_VDD_EN
LVDS Panel Power Enable
23
SATA4_TX-
SATA4 Transmit Data -
78
LVDS_A3+
LVDS Channel A Data 3 +
24
SUS_S5#
Soft Off (S5) Signal
79
LVDS_A3-
LVDS Channel A Data 3 -
25
SATA4_RX+
SATA4 Receive Data +
80
GND
Power Ground
26
SATA4_RX-
SATA4 Receive Data -
81
LVDS_A_CK+
LVDS Channel A Clock +
27
BATLOW#
Battery Low signal
82
LVDS_A_CK-
LVDS Channel A Clock -
28
SATA_LED#
SATA LED
83
LVDS_I2C_CK
LVDS I2C Clock
29
AC_SYNC
HD Audio Sync signal
84
LVDS_I2C_DAT
LVDS I2C Data
30
AC_RST#
HD Audio Reset
85
GPI3
General Purpose Input 3
31
GND
Power Ground
86
KBD_RST#
Keyboard Controller Reset
32
AC_BITCLK
HD Audio Bit Clock
87
KBD_A20GATE
Keyboard A20_GATE signal
33
AC_SDOUT
HD Audio Serial TDM Output
88
PCIE0_CK_REF+
PCI-E Clock reference +
34
BIOS_DISABLE#
Module BIOS disable line
89
PCIE0_CK_REF-
PCI-E Clock reference -
35
N.C.
90
GND
Power Ground
36
USB8-
USB Data Port 8-
91
RSVD
Not Connected
37
USB8+
USB Data Port 8+
92
RSVD
Not Connected
38
USB_8_9_OC#
USB Over Current Ports 8/9
93
GPO0
General Purpose Output 0
Not Connected
Copyright © 2012 SECO s.r.l.
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39
USB4-
USB Data Port 4-
94
RSVD
Not Connected
40
USB4+
USB Data Port 4+
95
RSVD
Not Connected
41
GND
Power Ground
96
GND
Power Ground
42
USB2-
USB Data Port 2-
97
+12VDC
+12VDC power supply
43
USB2+
USB Data Port 2+
98
+12VDC
+12VDC power supply
44
USB_2_3_OC#
USB Over Current Ports 2/3
99
+12VDC
+12VDC power supply
45
USB0-
USB Data Port 0-
100
GND
Power Ground
46
USB0+
USB Data Port 0+
101
+12VDC
+12VDC power supply
47
VCC_RTC
Real Time Clock power line
102
+12VDC
+12VDC power supply
48
N.C.
Not Connected
103
+12VDC
+12VDC power supply
49
N.C.
Not Connected
104
+12VDC
+12VDC power supply
50
LPC_SERIRQ
LPC serial interrupt request
105
+12VDC
+12VDC power supply
51
GND
Power Ground
106
+12VDC
+12VDC power supply
52
N.C.
Not Connected
107
+12VDC
+12VDC power supply
53
N.C.
Not Connected
108
+12VDC
+12VDC power supply
54
GPI0
109
+12VDC
+12VDC power supply
55
N.C.
110
GND
Power Ground
General Purpose Input 0
Not Connected
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3.4.2 COM Express Connector 1: Row B
PIN
Signal
Description
PIN
Signal
Description
1
GND
Power Ground
56
N.C.
2
GBE0_ACT#
GbEth Activity indicator
57
GPO2
General Purpose Output 2
3
LPC_FRAME#
LPC Frame Indicator
58
PCIE_RX4+
PCI-E lane 4 receive +
4
LPC_AD0
LPC Address / Data Bus 0
59
PCIE_RX4-
PCI-E lane 4 receive -
5
LPC_AD1
LPC Address / Data Bus 1
60
GND
Power Ground
6
LPC_AD2
LPC Address / Data Bus 2
61
PCIE_RX3+
PCI-E lane 3 receive +
7
LPC_AD3
LPC Address / Data Bus 3
62
PCIE_RX3-
PCI-E lane 3 receive -
8
LPC_DRQ0#
LPC Serial DMA Request 0
63
GPO3
General Purpose Output 3
9
LPC_DRQ1#
LPC Serial DMA Request 2
64
PCIE_RX2+
PCI-E lane 2 receive +
10
LPC_CLK
LPC Clock Output 33MHz
65
PCIE_RX2-
PCI-E lane 2 receive -
11
GND
Power Ground
66
WAKE0#
PCI-E wake up signal
12
PWRBTN#
Power Button
67
WAKE1#
General wake-up signal
13
SMB_CK
SM Bus Clock
68
PCIE_RX1+
PCI-E lane 1 receive +
14
SMB_DATA
SM Bus Data
69
PCIE_RX1-
PCI-E lane 1 receive -
15
SMB_ALERT#
SM Bus Alert signal
70
GND
Power Ground
16
SATA1_TX+
SATA1 Transmit Data +
71
LVDS_B0+
LVDS Channel B Data 0 +
17
SATA1_TX-
SATA1 Transmit Data -
72
LVDS_B0-
LVDS Channel B Data 0 -
18
SUS_STAT#
Suspend operations signal
73
LVDS_B1+
LVDS Channel B Data 1 +
19
SATA1_RX+
SATA1 Receive Data +
74
LVDS_B1-
LVDS Channel B Data 1 -
20
SATA1_RX-
SATA1 Receive Data -
75
LVDS_B2+
LVDS Channel B Data 2 +
21
GND
Power Ground
76
LVDS_B2-
LVDS Channel B Data 2 -
22
SATA5_TX+
SATA5 Transmit Data +
77
LVDS_B3+
LVDS Channel B Data 3 +
23
SATA5_TX-
SATA5 Transmit Data -
78
LVDS_B3-
LVDS Channel B Data 3 -
24
PWR_OK
Power OK signal
79
LVDS_BKLT_EN
LVDS Panel Backlight ON
25
SATA5_RX+
SATA5 Receive Data +
80
GND
Power Ground
26
SATA5_RX-
SATA5 Receive Data -
81
LVDS_B_CK+
LVDS Channel B Clock +
27
WDT
Watch Dog Timer
82
LVDS_B_CK-
LVDS Channel B Clock -
28
AC_SDIN2
HD Audio Serial TDM Input 2
83
LVDS_BKLT_CTRL
LVDS Backlight Brightness
29
AC_SDIN1
HD Audio Serial TDM Input 1
84
+5VSB
+5V Standby power line
30
AC_SDIN0
HD Audio Serial TDM Input 0
85
+5VSB
+5V Standby power line
31
GND
Power Ground
86
+5VSB
+5V Standby power line
32
SPKR
Speaker
87
+5VSB
+5V Standby power line
33
N.C.
Not Connected
88
RSVD
Not Connected
34
N.C.
Not Connected
89
VGA_RED
Analog Video RGB-RED
35
N.C.
Not Connected
90
GND
Power Ground
36
USB9-
USB Data Port 9-
91
VGA_GRN
Analog Video RGB-Green
37
USB9+
USB Data Port 9+
92
VGA_BLU
Analog Video RGB-Blue
38
USB_4_5_OC#
USB Over Current Ports 4/5
93
VGA_HSYNC
Analog Video H-Sync
Copyright © 2012 SECO s.r.l.
SECOMExp-iCORE
Not Connected
SECOMExp-iCORE
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39
USB5-
USB Data Port 5-
94
VGA_VSYNC
Analog Video V-Sync
40
USB5+
USB Data Port 5+
95
VGA_I2C_CK
Display data channel clock
41
GND
Power Ground
96
VGA_I2C_DAT
Display data channel data
42
USB3-
USB Data Port 3-
97
N.C.
Not Connected
43
USB3+
USB Data Port 3+
98
N.C.
Not Connected
44
USB_0_1_OC#
USB Over Current Ports 0/1
99
N.C.
Not Connected
45
USB1-
USB Data Port 1-
100
GND
Power Ground
46
USB1+
USB Data Port 1+
101
+12VDC
+12VDC power supply
47
N.C.
Not Connected
102
+12VDC
+12VDC power supply
48
N.C.
Not Connected
103
+12VDC
+12VDC power supply
49
SYS_RESET#
Reset Button Input
104
+12VDC
+12VDC power supply
50
CB_RESET#
Board Reset Output
105
+12VDC
+12VDC power supply
51
GND
Power Ground
106
+12VDC
+12VDC power supply
52
N.C.
Not Connected
107
+12VDC
+12VDC power supply
53
N.C.
Not Connected
108
+12VDC
+12VDC power supply
54
GPO1
109
+12VDC
+12VDC power supply
55
N.C.
110
GND
Power Ground
General Purpose Output 1
Not Connected
Copyright © 2012 SECO s.r.l.
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User Manual - Rev. First Edition: 0.1 - Last Edition: 1.0 - Author: S.B. - Reviewed by G.M.
3.4.3 COM Express Connector 2: Row C
PIN
Signal
Description
PIN
Signal
Description
1
GND
Power Ground
56
PEG_RX1-
PCI-E x16 Lane 1 RX-
2
IDE_D7
IDE Data Bus
57
TYPE1#
Type1 signal: Not Connected
3
IDE_D6
IDE Data Bus
58
PEG_RX2+
PCI-E x16 Lane 2 RX+
4
IDE_D3
IDE Data Bus
59
PEG_RX2-
PCI-E x16 Lane 2 RX-
5
IDE_D15
IDE Data Bus
60
GND
Power Ground
6
IDE_D8
IDE Data Bus
61
PEG_RX3+
PCI-E x16 Lane 3 RX+
7
IDE_D9
IDE Data Bus
62
PEG_RX3-
PCI-E x16 Lane 3 RX-
8
IDE_D2
IDE Data Bus
63
RSVD
Not Connected
9
IDE_D13
IDE Data Bus
64
RSVD
Not Connected
10
IDE_D1
IDE Data Bus
65
PEG_RX4+
PCI-E x16 Lane 4 RX+
11
GND
Power Ground
66
PEG_RX4-
PCI-E x16 Lane 4 RX-
12
IDE_D14
IDE Data Bus
67
FAN_PWM
FAN PWM Signal
13
IDE_IORDY
IDE Device I/O Ready
68
PEG_RX5+
PCI-E x16 Lane 5 RX+
14
IDE_IOR#
IDE I/O Read Line
69
PEG_RX5-
PCI-E x16 Lane 5 RX-
15
PCI_PME#
PCI Pwr Management Event
70
GND
Power Ground
16
PCI_GNT2#
PCI bus master grant 2
71
PEG_RX6+
PCI-E x16 Lane 6 RX+
17
PCI_REQ2#
PCI bus master request 2
72
PEG_RX6-
PCI-E x16 Lane 6 RX-
18
PCI_GNT1#
PCI bus master grant 1
73
N.C.
Not Connected
19
PCI_REQ1#
PCI bus master request 1
74
PEG_RX7+
PCI-E x16 Lane 7 RX+
20
PCI_GNT0#
PCI bus master grant 0
75
PEG_RX7-
PCI-E x16 Lane 7 RX-
21
GND
Power Ground
76
GND
Power Ground
22
PCI_REQ0#
PCI bus master request 0
77
FAN_TACH
FAN Speed signal
23
PCI_RESET#
PCI Bus Reset Output
78
PEG_RX8+
PCI-E x16 Lane 8 RX+
24
PCI_AD0
PCI Address/Data Bus bit 0
79
PEG_RX8-
PCI-E x16 Lane 8 RX-
25
PCI_AD2
PCI Address/Data Bus bit 2
80
GND
Power Ground
26
PCI_AD4
PCI Address/Data Bus bit 4
81
PEG_RX9+
PCI-E x16 Lane 9 RX+
27
PCI_AD6
PCI Address/Data Bus bit 6
82
PEG_RX9-
PCI-E x16 Lane 9 RX-
28
PCI_AD8
PCI Address/Data Bus bit 8
83
RSVD
Not Connected
29
PCI_AD10
PCI Address/Data Bus bit 10
84
GND
Power Ground
30
PCI_AD12
PCI Address/Data Bus bit 12
85
PEG_RX10+
PCI-E x16 Lane 10 RX+
31
GND
Power Ground
86
PEG_RX10-
PCI-E x16 Lane 10 RX-
32
PCI_AD14
PCI Address/Data Bus bit 14
87
GND
Power Ground
33
PCI_C/BE1#
PCI Bus byte enable line 1
88
PEG_RX11+
PCI-E x16 Lane 11 RX+
34
PCI_PERR#
PCI Bus Parity Error
89
PEG_RX11-
PCI-E x16 Lane 11 RX-
35
PCI_LOCK#
PCI Bus Lock control line
90
GND
Power Ground
36
PCI_DEVSEL#
PCI Bus Device Select
91
PEG_RX12+
PCI-E x16 Lane 12 RX+
37
PCI_IRDY#
PCI Bus Initiator Ready line
92
PEG_RX12-
PCI-E x16 Lane 12 RX-
38
PCI_C/BE2#
PCI Bus byte enable line 2
93
GND
Power Ground
Copyright © 2012 SECO s.r.l.
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39
PCI_AD17
PCI Address/Data Bus bit 17
94
PEG_RX13+
PCI-E x16 Lane 13 RX+
40
PCI_AD19
PCI Address/Data Bus bit 19
95
PEG_RX13-
PCI-E x16 Lane 13 RX-
41
GND
Power Ground
96
GND
Power Ground
42
PCI_AD21
PCI Address/Data Bus bit 21
97
RSVD
Not Connected
43
PCI_AD23
PCI Address/Data Bus bit 23
98
PEG_RX14+
PCI-E x16 Lane 14 RX+
44
PCI_C/BE3#
PCI Bus byte enable line 3
99
PEG_RX14-
PCI-E x16 Lane 14 RX-
45
PCI_AD25
PCI Address/Data Bus bit 25
100
GND
Power Ground
46
PCI_AD27
PCI Address/Data Bus bit 27
101
PEG_RX15+
PCI-E x16 Lane 15 RX+
47
PCI_AD29
PCI Address/Data Bus bit 29
102
PEG_RX15-
PCI-E x16 Lane 15 RX-
48
PCI_AD31
PCI Address/Data Bus bit 31
103
GND
Power Ground
49
PCI_IRQA#
PCI Interrupt Request line A
104
VCC_12V
+12VDC power supply
50
PCI_IRQB#
PCI Interrupt Request line B
105
VCC_12V
+12VDC power supply
51
GND
Power Ground
106
VCC_12V
+12VDC power supply
52
PEG_RX0+
PCI-E x16 Lane 0 RX+
107
VCC_12V
+12VDC power supply
53
PEG_RX0-
PCI-E x16 Lane 0 RX-
108
VCC_12V
+12VDC power supply
54
TYPE0#
Type0 signal: Not Connected
109
VCC_12V
+12VDC power supply
55
PEG_RX1+
PCI-E x16 Lane 1 RX+
110
GND
Power Ground
Copyright © 2012 SECO s.r.l.
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User Manual - Rev. First Edition: 0.1 - Last Edition: 1.0 - Author: S.B. - Reviewed by G.M.
3.4.4 COM Express Connector 2: Row D
PIN
Signal
Description
PIN
Signal
Description
1
GND
Power Ground
56
PEG_TX1-
PCI-E x16 Lane 1 TX-
2
IDE_D5
IDE Data Bus
57
TYPE2#
Type2 signal: Not Connected
3
IDE_D10
IDE Data Bus
58
PEG_TX2+
PCI-E x16 Lane 2 TX+
4
IDE_D11
IDE Data Bus
59
PEG_TX2-
PCI-E x16 Lane 2 TX-
5
IDE_D12
IDE Data Bus
60
GND
Power Ground
6
IDE_D4
IDE Data Bus
61
PEG_TX3+
PCI-E x16 Lane 3 TX+
7
IDE_D0
IDE Data Bus
62
PEG_TX3-
PCI-E x16 Lane 3 TX-
8
IDE_REQ
IDE Device DMA request
63
RSVD
Not Connected
9
IDE_IOW#
IDE I/O Write Line
64
RSVD
Not Connected
10
IDE_ACK#
IDE device DMA Acknowledg
65
PEG_TX4+
PCI-E x16 Lane 4 TX+
11
GND
Power Ground
66
PEG_TX4-
PCI-E x16 Lane 4 TX-
12
IDE_IRQ
IDE Dev. Interrupt Request
67
GND
Power Ground
13
IDE_A0
IDE Address Line 0
68
PEG_TX5+
PCI-E x16 Lane 5 TX+
14
IDE_A1
IDE Address Line 1
69
PEG_TX5-
PCI-E x16 Lane 5 TX-
15
IDE_A2
IDE Address Line 2
70
GND
Power Ground
16
IDE_CS1#
IDE Chip Select Range 1xx
71
PEG_TX6+
PCI-E x16 Lane 6 TX+
17
IDE_CS3#
IDE Chip Select Range 3xx
72
PEG_TX6-
PCI-E x16 Lane 6 TX-
18
IDE_RESET#
IDE Device Reset
73
N.C.
Not Connected
19
PCI_GNT3#
PCI bus master grant 3
74
PEG_TX7+
PCI-E x16 Lane 7 TX+
20
PCI_REQ3#
PCI bus master request 3
75
PEG_TX7-
PCI-E x16 Lane 7 TX-
21
GND
Power Ground
76
GND
Power Ground
22
PCI_AD1
PCI Address/Data Bus bit 1
77
IDE_CBLID#
IDE Cable type identifier
23
PCI_AD3
PCI Address/Data Bus bit 3
78
PEG_TX8+
PCI-E x16 Lane 8 TX+
24
PCI_AD5
PCI Address/Data Bus bit 5
79
PEG_TX8-
PCI-E x16 Lane 8 TX-
25
PCI_AD7
PCI Address/Data Bus bit 7
80
GND
Power Ground
26
PCI_C/BE0#
PCI Bus byte enable line 0
81
PEG_TX9+
PCI-E x16 Lane 9 TX+
27
PCI_AD9
PCI Address/Data Bus bit 9
82
PEG_TX9-
PCI-E x16 Lane 9 TX-
28
PCI_AD11
PCI Address/Data Bus bit 11
83
RSVD
Not Connected
29
PCI_AD13
PCI Address/Data Bus bit 13
84
GND
Power Ground
30
PCI_AD15
PCI Address/Data Bus bit 15
85
PEG_TX10+
PCI-E x16 Lane 10 TX+
31
GND
Power Ground
86
PEG_TX10-
PCI-E x16 Lane 10 TX-
32
PCI_PAR
PCI Bus Parity
87
GND
Power Ground
33
PCI_SERR#
PCI Bus System Error
88
PEG_TX11+
PCI-E x16 Lane 11 TX+
34
PCI_STOP#
PCI Bus Stop control line
89
PEG_TX11-
PCI-E x16 Lane 11 TX-
35
PCI_TRDY#
PCI Bus Target Ready line
90
GND
Power Ground
36
PCI_FRAME#
PCI Bus Frame Control line
91
PEG_TX12+
PCI-E x16 Lane 12 TX+
37
PCI_AD16
PCI Address/Data Bus bit 16
92
PEG_TX12-
PCI-E x16 Lane 12 TX-
38
PCI_AD18
PCI Address/Data Bus bit 18
93
GND
Power Ground
Copyright © 2012 SECO s.r.l.
SECOMExp-iCORE
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User Manual - Rev. First Edition: 0.1 - Last Edition: 1.0 - Author: S.B. - Reviewed by G.M.
39
PCI_AD20
PCI Address/Data Bus bit 20
94
PEG_TX13+
PCI-E x16 Lane 13 TX+
40
PCI_AD22
PCI Address/Data Bus bit 22
95
PEG_TX13-
PCI-E x16 Lane 13 TX-
41
GND
Power Ground
96
GND
Power Ground
42
PCI_AD24
PCI Address/Data Bus bit 24
97
PEG_ENABLE#
PEG interface Enable
43
PCI_AD26
PCI Address/Data Bus bit 26
98
PEG_TX14+
PCI-E x16 Lane 14 TX+
44
PCI_AD28
PCI Address/Data Bus bit 28
99
PEG_TX14-
PCI-E x16 Lane 14 TX-
45
PCI_AD30
PCI Address/Data Bus bit 30
100
GND
Power Ground
46
PCI_IRQC#
PCI Interrupt Request line C
101
PEG_TX15+
PCI-E x16 Lane 15 TX+
47
PCI_IRQD#
PCI Interrupt Request line D
102
PEG_TX15-
PCI-E x16 Lane 15 TX-
48
N.C.
Not connected
103
GND
Power Ground
49
N.C.
Not connected
104
VCC_12V
+12VDC power supply
50
PCI_CLK
PCI Clock 33MHz
105
VCC_12V
+12VDC power supply
51
GND
Power Ground
106
VCC_12V
+12VDC power supply
52
PEG_TX0+
PCI-E x16 Lane 0 TX+
107
VCC_12V
+12VDC power supply
53
PEG_TX0-
PCI-E x16 Lane 0 TX-
108
VCC_12V
+12VDC power supply
54
PEG_LANE_RV#
PEG Interface Lane Reversal
109
VCC_12V
+12VDC power supply
55
PEG_TX1+
PCI-E x16 Lane 1 TX+
110
GND
Power Ground
Copyright © 2012 SECO s.r.l.
SECOMExp-iCORE
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pag. 25
User Manual - Rev. First Edition: 0.1 - Last Edition: 1.0 - Author: S.B. - Reviewed by G.M.
Chapter 4. INTRODUCTION
 INSYDEH2O SETUP UTILITY
 MAIN SETUP MENU
 ADVANCED MENU
 SECURITY MENU
 POWER MENU
 BOOT MENU
 EXIT MENU
Copyright © 2012 SECO s.r.l.
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User Manual - Rev. First Edition: 0.1 - Last Edition: 1.0 - Author: S.B. - Reviewed by G.M.
4.1 INSYDEH2O SETUP UTILITY
Basic Setup of the board can be done using Insyde Software Corp. “InsydeH2O Setup Utility”, that
is stored inside an onboard Serial Flash.
It is possible to access to InsydeH2O Setup Utility by pressing the <F2> key after System power
up, during POST phase.
On each menu page, on left frame are shown all the options that can be configured.
Grayed-out options are only for information and cannot configured.
Only options written in blue can be configured. Selected options are highlighted in white.
Right frame shows the key legend.
KEY LEGEND:
←/→
Navigate between various setup screens (Main, Advanced, Security, Power, Boot…)
↑/↓
Select a setup item or a submenu
<F5> / <F6> <F5> and <F6> keys allows to change the field value of highlighted menu item
<F1>
The <F1> key allows you to display the General Help screen.
<F9>
<F9> key allows to load Setup Defaults for the board. After pressing <F9> BIOS
Setup utility will request for a confirmation, before saving and exiting. By pressing <ESC> key, this
function will be aborted
<F10>
<F10> key allows save any changes made and exit Setup. After pressing <F10>
key, BIOS Setup utility will request for a confirmation, before saving and exiting. By pressing
<ESC> key, this function will be aborted
<ESC>
<Esc> key allows you to discard any changes made and exit the Setup. After
pressing <ESC> key, BIOS Setup utility will request for a confirmation, before discarding the
changes. By pressing <Cancel> key, this function will be aborted
<ENTER>
<Enter> key allows to display or change the setup option listed for a particular setup
item. The <Enter> key can also allow you to display the setup sub- screens.
4.2 MAIN SETUP MENU
When entering the Setup Utility, the first screen shown is the Main setup screen. It is always
possible to return to the Main setup screen by selecting the Main tab.
In this screen, are shown details regarding BIOS version, Processor type, Bus Speed and memory
configuration.
Only three options can be configured:
4.2.1 Language
Use this option to select the language that the Setup utility must use. Possible options are English,
French, Japanese, Chinese
4.2.2 System Time/System Date
Use this option to change the system time and date. Highlight System Time or System Date using
the <Arrow> keys. Enter new values directly through the keyboard, or using + / - keys to increase /
reduce displayed values. Press the <Enter> key to move between fields. The date must be entered
in MM/DD/YY format. The time is entered in HH:MM:SS format.
Note: The time is in 24-hour format. For example, 5:30 A.M. appears as 05:30:00, and 5:30 P.M.
as 17:30:00.
The system date is in the format mm/dd/yyyy.
Copyright © 2012 SECO s.r.l.
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User Manual - Rev. First Edition: 0.1 - Last Edition: 1.0 - Author: S.B. - Reviewed by G.M.
4.3 ADVANCED MENU
MENU ITEM
Options
Description
Boot Configuration
See submenu
Configures settings for Boot Phase
Peripheral Configuration
See submenu
Configures the peripherals
IDE configuration
See submenu
Configures the various Hard Disk Drives installed in the
system
Thermal Configuration
See submenu
Configures the Thermal parameters
Video Configuration
See submenu
Configures the options for video section
USB Configuration
See submenu
Configures USB Section
Chipset Configuration
See submenu
Configure Chipset’s parameters
ACPI Table / Features Control
See submenu
Configures the parameters for ACPI management
PCI Express Configuration
See submenu
Configures various options for PCI Express section
4.3.1 Boot Configuration Submenu
MENU ITEM
Numlock
Options
Description
On
Off
Allows to choose whether NumLock Key at system boot
must be turned On or Off
4.3.2 Peripheral Configuration Submenu
MENU ITEM
Options
Description
Azalia
Disabled
Auto
Enabled
Auto: Auto-detects the HD Audio Codec
Disabled: Disable the internal HD Audio Controller
Enabled: Disable the internal HD Audio Controller
Azalia Internal HDMI Codec
Disabled
Enabled
This menu item is available only when Azalia
Configuration is set to Auto or Enabled
Enable or Disable internal HDMI codec of HD Audio
Controller.
Azalia PME Enable
Disabled
Enabled
This menu item is available only when
Configuration is set to Auto or Enabled
Enable/Disable PME for Azalia.
Copyright © 2012 SECO s.r.l.
SECOMExp-iCORE
Azalia
SECOMExp-iCORE
pag. 28
User Manual - Rev. First Edition: 0.1 - Last Edition: 1.0 - Author: S.B. - Reviewed by G.M.
4.3.3 IDE Configuration Submenu
MENU ITEM
Options
IDE Controller
Disabled
Enabled
Disabled: Disables SATA controllers.
Enabled: Enable internal SATA controller.
HDC Configure As
IDE
AHCI
RAID
Set Harddisk Controller Configure type
AHCI/RAID SALP
Disabled
Enabled
This menu item is available only when “HDC Configure
As” is set to AHCI or RAID
Enable/Disable AHCI/RAID Support Aggressive Link
Power Management (SALP) in AHCI Host Capability
register Bit 26.
SATA Port 0 / 1 / 2 / 3 /4 / 5 HotPlug
Disabled
Enabled
This menu item is available only when Azalia
Configuration is set to AHCI.
Enable/Disable HotPlug capability for SATA port #0, #1,
#2, #3, #4, #5
Disabled
Enabled
This menu item is available only when Azalia
Configuration is set to AHCI.
Singularly configurable for SATA port #0, #1, #2, #3, #4
or #5, on an edge detect from 0 to 1, the PCH starts a
COMRESET initialization sequence to the device.
SATA Port 0 / 1 / 2 / 3 / 4 / 5 –
Spin Up
Description
Serial ATA Port 0 / 1 / 2 / 3 / 4 /
5
Shows information related to eventual
connected to SATA ports 0, 1, 4 or 5.
devices
4.3.4 Thermal Configuration Submenu
MENU ITEM
Options
Description
Platform Thermal Configuration
See Submenu
Platform Thermal Configuration Options
CPU Thermal Configuration
See Submenu
CPU Thermal Configuration Parameters
4.3.4.1 Platform Thermal Configuration Submenu
MENU ITEM
Options
Description
Shut Down Temperature
70°C / 75°C / 80°C / 85°C
/ 90°C / 100°C / 110°C /
120°C
ACPI Critical Trip Point – the point in which the OS will
shut down the system
Throttle On Temperature
40°C / 45°C / 50°C / 55°C
/ 60°C / 65°C / 70°C /
75°C / 80°C / 85°C / 90°C
Set the CPU temperature point of Throttle On
TC1
1 ÷ 16
Thermal constant TC1 for the ACPI Passive Cooling
(CPU Throttle On) Formula
TC2
1 ÷ 16
Thermal constant TC2 for the ACPI Passive Cooling
(CPU Throttle On) Formula
TSP
2÷32
It represents in tenth of a second how often the OS will
read the temperature when Passive Cooling is enabled.
Copyright © 2012 SECO s.r.l.
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4.3.4.2 CPU Thermal Configuration Submenu
MENU ITEM
Options
Description
Thermal Mode
Disabled
TM1
TM2
TM1 and TM2
Setting this bit enables the thermal control circuit portion
of the Thermal Monitor feature of the CPU Intel thermal
Monitor; TM1 = 50% duty cycle; TM2 = Enhanced Intel
Speed Step
Bi-Directional PROCHOT#
Enabled
Disabled
When a processor thermal sensor trips (either core), the
PROCHOT# will be driven. If bi-directional is enabled,
external agents can drive PROCHOT# to throttle.
4.3.5 Video Configuration Submenu
MENU ITEM
Options
Description
First Video Boot Device
PEG
PCIE
PCI
IGD
Select the first video boot device
IGD – DVMT Pre-Allocated
32 MB / 64MB / 96 MB /
128 MB / 160 MB / 224
MB / 256 MB / 352 MB
Select DVMT5.0 Pre-Allocated (Fixed) Graphics
Memory size used by the internal Graphics Device.
IGD – DVMT Total Gfx Mem
128MB
256MB
Select the size of DVMT 5.0 that the internal Graphics
Device will use.
IGD – Boot Type
VBIOS Default
CRT
LFP
CRT + LFP
TV
LFP – SDVO
EFP
TV - SDVO
CRT + LFP –SDVO
CRT + EFP
Select the Video Device that will be activated during
POST
IGD – LCD Panel Type
640x480 / 800x480 /
800x600 / 1024x600/
1024x768 / 1280x768 /
1280x800 / 1280x1024 /
1366x768 / 1440x900 /
1680x1050 / 1920x1080 /
1920x1200 / 2048x1536 /
custom1 / custom2
Select the Panel used by the Internal Graphics Device
by selecting the appropriate setup item.
IGD – LVDS Color Depth
18 bit
24 bit
Color depth supported by the connected LVDS panel
IGD – Backlight Control
PWM inverted
PWM Normal
GMBus inverted
GMBus Normal
Backlight Control Setting
IGD - TV
VBIOS Default
NTSC
PAL
SECAM
Select the TV standard used by the Internal graphics
Device
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IGD - Render Standby
Enabled
Disabled
Check to enable render standby support.
IGD - Render thermal Throttling
Enabled
Disabled
This feature is applicable Graphics SKUs only
Active LFP
None
No LVDS
Int-LVDS
SDVO LVDS
eDP
Select the Active LFP Configuration
PEG - ASPM
Enabled
Disabled
Control ASPM Support for the PEG device
PEG Force X1
Enabled
Disabled
Force PEG link to retrain to X1
Automatic ASPM
Auto
Manual
This menu item is available only when PEG – ASPM is
set to Enabled.
Automatically enable ASPM based on reported
capabilities and known issues
ASPM L0s
Disabled
Root Port Only
Endpoint Port Only
Root & Endpoint Ports
This menu item is available only when Automatic ASPM
is set to Manual.
Enable PCIe ASPM L0s
ASPM L1s
Enabled
Disabled
This menu item is available only when Automatic ASPM
is set to Manual.
Enable PCIe ASPM L1
ASPM L0s Aggressiveness
Normal
Aggressive
Ultra-aggressive
This menu item is available only when Automatic ASPM
is set to Manual and ASPM L0s includes Root Port.
Set the level of L0s entry aggressiveness. This applies
to root port L0s entry only.
Onboard PEG Option ROM
DVI
LVDS
Select the option ROM loaded by the Onboard PEG
device
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4.3.6 USB Configuration Submenu
MENU ITEM
Options
Description
USB Legacy
Enabled
Disabled
USB devices boot and access in DOS
EHCI 1
Enabled
Disabled
Enable / Disable EHCI 1
UHCI 1
Enabled
Disabled
This menu item is available only when “USB RMH
Mode” is disabled.
Enable/Disable UHCI 1
UHCI 2
Enabled
Disabled
This menu item is available only when “USB RMH
Mode” is disabled.
Enable/Disable UHCI 2
UHCI 3
Enabled
Disabled
This menu item is available only when “USB RMH
Mode” is disabled.
Enable/Disable UHCI 3
UHCI 4
Enabled
Disabled
This menu item is available only when “USB RMH
Mode” is disabled.
Enable/Disable UHCI 4
EHCI 2
Enabled
Disabled
Enable / Disable EHCI 2
UHCI 5
Enabled
Disabled
This menu item is available only when “USB RMH
Mode” is disabled.
Enable/Disable UHCI 5
UHCI 6
Enabled
Disabled
This menu item is available only when “USB RMH
Mode” is disabled.
Enable/Disable UHCI 6
UHCI 7
Enabled
Disabled
This menu item is available only when “USB RMH
Mode” is disabled.
Enable/Disable UHCI 7
Per-Port Control
Enabled
Disabled
Enable/Disable the Per-Port Disable Control Override
USB Port0
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 0
USB Port1
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 1
USB Port2
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 2
USB Port3
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 3
USB Port4
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 4
USB Port5
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 5
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USB Port6
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 6
USB Port7
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 7
USB Port8
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 8
USB Port9
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 9
USB Port10
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 10
USB Port11
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 11
USB Port12
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 12
USB Port13
Enabled
Disabled
This menu item is available only when “Per-Port
Control” is enabled.
Enable/Disable Port 13
USB RMH mode
Enabled
Disabled
PCH USB Rate matching Hubs mode
4.3.7 Chipset Configuration Submenu
MENU ITEM
Options
Description
CRID
Enabled
Disabled
Enable / Disable: Compatible Revision ID (CRID) /
Stepping Revision ID (SRID)
Port 80h Cycles
PCI Bus
LPC Bus
Control where the port 80h cycles are sent.
PCI Latency timer
32 / 64 / 96 / 128 / 160 /
192 / 224 / 248
Value to be programmed into PCI Latency Timer
Register.
VT-d
Enabled
Disabled
Check to enable VT-d function on MCH
Arrandale MRC / QPI
See submenu
Arrandale MRC/QPI options
After G3 On
Last State
S0
S5
Specify what state to go to when power is re-applied
after a power failure (G3 state)
4.3.7.1 Arrandale MRC/QPI Submenu
MENU ITEM
Options
Description
QPI Frequency
Auto
3.200GT
4.800 GT
5.866 GT
6.400 GT
QPI Frequency Selection
Memory Frequency
800 / 1066 / 1333
Memory Frequency Selections in MHz
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4.3.8 ACPI Table/features Submenu
MENU ITEM
Options
FACP – RTC S4 wakeup
APIC – IO APIC Mode
Description
Disabled
Enabled
Value only for ACPI.
Enable/Disable for S4 wakeup from RTC
Disabled
Enabled
This item is valid only for WIN2k and WINXP. Also, a
fresh install of the OS must occur when APIC Mode is
desired. Test the IO ACPI by setting item to Enable.
The APIC Table will then be pointed to by the RSDT,
the Local APIC will be initialized, and the proper enable
bits will be set in ICH4M
4.3.9 PCI Express Configuration Submenu
MENU ITEM
Options
Description
PCI Express Clock Gating
Enabled
Disabled
PCI Express Clock Gating Enable / Disable for each
root port
DMI Link ASPM Control
Disabled
L0s
L0sL1
The control of Active State Power management on both
NB side and SB side of the DMI Link
PCI Express Root Port 1 / 2 / 3 /
4/5/6/7/8
See submenus
PCIE Compliance Mode
Enabled
Disabled
Enabling PCIe Compliance Testing Mode
4.3.9.1 PCI Express Root Port x Submenu
MENU ITEM
Options
Description
PCI Express Root Port x
Enabled
Disabled
Control the PCI Express Root Port x.
Following menu items will be available only when this
menu item is enabled.
Automatic ASPM
Disabled
L0s
L1
L0sL1
Auto
Automatically enable ASPM
capabilities and known issues.
URR
Enabled
Disabled
PCI Express Unsupported Request Reporting Enable /
Disable.
FER
Enabled
Disabled
PCI Express Device Fatal Error Reporting Enable /
Disable.
NFER
Enabled
Disabled
PCI Express Device Non-Fatal Error Reporting Enable /
Disable
CER
Enabled
Disabled
PCI Express Device Correctable Error Reporting Enable
/ Disable.
CT0
Default
16-55 ms
65-210 ms
260-900 ms
1-3.5 ms
Disabled
PCI Express Completion Timer T0 Enable/Disable.
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SEFE
Enabled
Disabled
Root PCI Express System Error on Fatal Error
Enable/Disable.
SENFE
Enabled
Disabled
Root PCI Express System Error on Non-Fatal Error
Enable/Disable.
SECE
Enabled
Disabled
Root PCI Express System Error on Correctable Error
Enable/Disable.
PME Interrupt
Enabled
Disabled
Root PCI Express PME Interrupt Enable/Disable.
PME SCI
Enabled
Disabled
PCI Express PME SCI Enable/Disable
Hot Plug
Enabled
Disabled
PCI Express Hot Plug Enable/Disable
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4.4 SECURITY MENU
MENU ITEM
Options
Description
Shows information related to eventual TPM devices
installed
TPM Status
TPM Operation
No Operation
Disable and Deactivate
Enable and Activate
User Access Level
Set User Password
option
will
Install or Change the password and the length of
password must be greater than one character.
Set Supervisor Password
Power on Password
Only available if there are TPM devices.
Enable/Disable TPM Function. This
automatically return to No-Operation
Disabled
Enabled
Enable: System will ask input password on post time.
Disable: system will ask input password when go to
Setup utility
View only
Limited
Full
Limited: Only limited fields can be changed.
No Access: prevent User access to BIOS setup.
View Only: Access to BIOS Setup allowed but the fields
cannot be changed.
Full: Any Field can be changed except the Supervisor
Password
Install or Change the password and the length of
password must be greater than one character.
Clear User Password
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4.5 POWER MENU
MENU ITEM
Options
Description
Advanced CPU Control
See submenu
These items control various CPU parameters
Platform Power Management
See submenu
Platform Power Management Options
Break Event
See submenu
Break Event Options
SLP_S4# Min. Ass. Width
Disabled / 1 seconds /
2 seconds / 3 seconds /
4 seconds
This field indicates the minimum assertion width of the
SLP_S4# signal to ensure that the DRAMs have been
safely power-cycled.
ACPI S3
Enabled
Disabled
Enable/Disable ACPI S3 Sleep State
Wake on PME
Enabled
Disabled
Determines the action taken when the system power is
off and a PCI Power Management Enable wake up
event occurs.
Wake on Modem Ring
Enabled
Disabled
Determines the action taken when the system power is
off and a modem connected to the serial port is ringing.
Auto Wake on S5
Disabled
By Every Day
By Day of Month
Auto wake on S5, By Day of month or Fixed time of
every day.
[hh:mm:ss]
This menu item is available only when “Auto Wake on
S5” is not set to Disabled.
Set time of the day when the board must wake
automatically
1 ÷ 31
This menu item is available only when “Auto Wake on
S5” is set to “By Day of Month”
This is the help for the day field. Valid range is from 1 to
31. Error checking will be done against month/day/year
combinations that are not supported. Use + / - to
Increase / reduce
Wake on S5 time
Day of month
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4.5.1 Advanced CPU Control Submenu
MENU ITEM
Options
P-States(IST)
Enabled
Disabled
Enable processor performance states (P-states)
Boot Performance Mode
Max Battery
Max Performance
Select the performance state that BIOS will set before
OS handoff.
CMP Support
Auto
Disabled
Enable/Disable Core Multi-Processing
Use XD Capability
Enabled
Disabled
Enable or Disable processor XD capability
VT Support
Enabled
Disabled
Vanderpool Technology Enable/Disable
C-States
Enabled
Disabled
Enable processor idle power saving states (C-States)
Enhanced C-States
Enabled
Disabled
Menu item available only when “C-States” are enabled.
Enable P-State transition to occurr in combination with
C-States
Enable C6
Enabled
Disabled
Menu item available only when “C-States” are enabled.
Enable C6 State
Enabled
Disabled
This menu item is available only when “C-States” are
enabled.
When enabled, only the core that is the destination of
an interrupt while in C3/C6 will be notified to transition
to C0. When disabled, all cores that are in C3 / C6 will
be notified to transition to C0, regardless of interrupt
destination.
Interrupt Filtering
Description
4.5.2 Platform Power Management Submenu
MENU ITEM
Options
PCI Clock run
Enabled
Disabled
Description
If Enabled, the CLKRUN# Logic will stop the PCU
Clocks
4.5.3 Break Event Submenu
MENU ITEM
Options
Description
Storage Break Event
Enabled
Disabled
If Enabled, Parallel IDE or Serial ATA master activity
will cause BM_STS to be set and will cause a break
from C3/C4.
PCIE Break Event
Enabled
Disabled
If Enabled, PCI Express master activity will cause
BM_STS to be set and will cause a break from C3/C4.
PCI Break Event
Enabled
Disabled
If Enabled, PCI master activity will cause BM_STS to be
set and will cause a break from C3/C4.
EHCI Break Event
Enabled
Disabled
If Enabled, EHCI master activity will cause BM_STS to
be set and will cause a break from C3/C4.
UHCI Break Event
Enabled
Disabled
If Enabled, UHCI master activity will cause BM_STS to
be set and will cause a break from C3/C4.
HDA Break Event
Enabled
Disabled
If Enabled, Intel High Definition Audio master activity
will cause BM_STS to be set and will cause a break
from C3/C4.
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4.6 BOOT MENU
MENU ITEM
Options
Description
UEFI Boot
Enabled
Disabled
Enable/Disable UEFI Boot Function
Quick Boot
Enabled
Disabled
Skip certain tests while booting. This will decrease the
time needed to boot the system.
Quiet Boot
Enabled
Disabled
Disables or enables booting in Text Mode.
PXE Boot to LAN
Enabled
Disabled
Disables or enables PXE boot to LAN.
ACPI Selection
Acpi1.0B
Acpi3.0
Acpi4.0
Select booting to Acpi3.0/Acpi1.0B
USB Boot
Enabled
Disabled
Disables or enables booting from USB boot devices.
EFI Device First
Enabled
Disabled
Determine EFI device first or legacy device first. If
enabled, it is EFI device first. If disabled, it is Legacy
device first.
EFI
See Submenu
This submenu is available only when “UEFI Boot” is
enabled.
EFI Boot Order Settings
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4.7 EXIT MENU
MENU ITEM
Options
Description
Exit Saving Changes
Exit system setup after saving the changes.
F10 key can be used for this operation.
Save Change Without Exit
Save all changes made, but doesn’t exit from setup
utility.
Exit Discarding Changes
Exit system setup without saving any changes.
ESC key can be used for this operation.
Load Optimal Defaults
Load Optimal Default values for all the setup items.
F9 key can be used for this operation.
Load Custom Defaults
Load Custom Default values for all the setup items.
Save Custom Defaults
Save Custom Default values for all the setup items.
Discard Changes
Discard changes done so far to any of the setup items.
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