Inventek
Systems
ISM43362-M3G-L44
Embedded Serial-to-Wi-Fi Module
eS-WiFi
802.11 b/g/n
Preliminary Data Sheet
TM
_____________________________________________________________________________________________
Inventek Systems - www.Inventeksys.com
2 Republic Road • Billerica, MA 01862 • Phone 978-667-1962
Product Specification
1
ISM43362-M3X Product Specification
Table of Contents
1
2
GENERAL DESCRIPTION ................................................................................................... 4
PART NUMBER DETAIL DESCRIPTION .......................................................................... 5
2.1
Ordering Information ...................................................................................................... 5
3
GENERAL FEATURES ......................................................................................................... 5
3.1
Limitations ...................................................................................................................... 6
3.2
Regulatory Compliance .................................................................................................. 6
3.3
FCC and IC User’s Manual Statements: ......................................................................... 7
4
COMPLEMENTARY DOCUMENTATION ...................................................................... 10
4.1
Inventek Systems .......................................................................................................... 10
5
SPECIFICATIONS ............................................................................................................... 10
5.1
Module Architecture ..................................................................................................... 10
5.2
External Antenna Connections ..................................................................................... 11
5.3
Mechanical Specifications ............................................................................................ 11
5.4
Environmental Specifications ....................................................................................... 12
6
HARDWARE ELECTRICAL SPECIFICATIONS ............................................................. 12
6.1.1 Absolute Maximum Ratings ..................................................................................... 12
6.1.2 Recommended Operating Ratings ............................................................................ 12
7
Power Consumption .............................................................................................................. 13
7.1.1 Estimated Power Consumption ................................................................................. 13
7.1.2 Stop Mode ................................................................................................................. 13
8
Pin out ................................................................................................................................... 14
8.1.1 Detailed Pin Description ........................................................................................... 15
8.1.2 Configuration Pins: ................................................................................................... 16
*Requires a 10K ohm pull down .............................................................................................. 16
9
Firmware Upgrades during Development ............................................................................. 16
10 Serial Host Interfaces Available ........................................................................................... 16
10.1 UART ............................................................................................................................ 16
10.1.1 Data Mode ............................................................................................................. 17
10.1.2 2.1.2 Flow Control ................................................................................................ 17
10.1.3 2.1.3 Supported Baud Rates .................................................................................. 17
10.1.4 Default Serial Configuration ................................................................................. 17
10.2 SPI (Serial Peripheral Interface Bus) ............................................................................ 17
10.2.1 SPI Communication Overview: ............................................................................ 18
10.2.2 SPI Command Phase: ............................................................................................ 18
10.2.3 SPI Data Phase: ..................................................................................................... 19
10.2.4 SPI Asynchronous Messages: ............................................................................... 19
10.2.5 SPI AC Characteristics: ........................................................................................ 20
10.3 USB ............................................................................................................................... 20
10.4 GPIO ............................................................................................................................. 20
10.5 ADC’s ........................................................................................................................... 20
11 Wi-Fi RF Specification ......................................................................................................... 21
11.1.1 RF Specification.................................................................................................... 21
12 Antenna Patterns ................................................................................................................... 22
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
2
ISM43362-M3X Product Specification
12.1 External Antenna .......................................................................................................... 22
12.2 PCB Etch Antenna Gain on the Evaluation Board ....................................................... 23
12.3 Farfield Directivity........................................................................................................ 24
13 On Board Processor .............................................................................................................. 25
14 ISM43362-M3G-L44 FOOTPRINT ..................................................................................... 26
14.1 Module’s package dimensions (mm) ............................................................................ 26
15 Typical Application Circuit .................................................................................................. 27
15.1 Reference Schematic (EVB) ......................................................................................... 28
15.2 USB to UART ............................................................................................................... 29
15.3 Connecting Microcontroller to eS-WiFi UART ........................................................... 30
15.4 EXTERNAL FLASH FOR OVER THE AIR UPGRADE........................................... 31
15.5 JTAG and Reset Connections ....................................................................................... 31
15.6 eS-WiFi Programming Options .................................................................................... 32
15.7 eS-WiFi USB Direct Connection Option ...................................................................... 32
16 Product Compliance Considerations ..................................................................................... 33
17 Reflow Profile ....................................................................................................................... 33
18 Packaging Information .......................................................................................................... 34
18.1 MSL Level / Storage Condition .................................................................................... 34
18.2 Device baking requirements prior to assembly............................................................. 35
Module’s Assembly Instructions .............................................................................................. 35
19 REVISION CONTROL ........................................................................................................ 36
20 CONTACT INFORMATION ............................................................................................... 36
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
3
ISM43362-M3X Product Specification
1 GENERAL DESCRIPTION
The Inventek ISM43362-M3G-L44 is an embedded (eS-WiFiTM) wireless Internet
Connectivity device. The Wi-Fi module hardware consists of an STM M3 Cortex host
processor, integrated antenna (or optional external antenna) and Broadcom Wi-Fi
device. The module provides UART, USB and SPI interfaces enabling connection to an
embedded design. The Wi-Fi module requires no operating system and has a
completely integrated TCP/IP Stack that only requires AT commands to establish
connectivity for your wireless product, minimizing development time, testing routines
and certification. The low cost, small foot print (14.5 mm x 30 mm) and ease of designin make it ideal for a range of embedded applications. The module hardware can be
used with Inventek’s AT Command set or with Broadcom’s WICEDTM SDK.
Summary of Key Features:








802.11 b/g/n compliant based on Broadcom MAC/Baseband/Radio device.
Fully contained TCP/IP stack minimizing host CPU requirements.
Configurable using AT commands.
Host interface: UART, SPI, or USB.
Network features: ICMP (Ping), ARP, DHCP,TCP, UDP.
Low power operation (3.3V supply) with built-in low power modes.
Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-PSK.
Proven Interoperability … Connects with other vendor’s b/g/n Access Points in the
Wireless LAN.
 Supported by Broadcom WICEDTM SDK
Typical Applications:







PDA, Pocket PC, computing devices.
Building automation and smart energy control.
Industrial sensing and remote equipment monitoring.
Warehousing, logistics and freight management.
PC and gaming peripherals.
Printers, scanners, alarm and video systems.
Medical applications including patient monitoring and remote diagnostics.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
4
ISM43362-M3X Product Specification
2 PART NUMBER DETAIL DESCRIPTION
2.1 Ordering Information
Device
Description
Firmware
Ordering Number
ISM43362-M3G-L44
802.11 Module, STM32F205
(1 Meg), UART, Internal
Etched Antenna
UART
SPI
USB
ISM43362-M3G-L44-E-C-xx
ISM43362-M3G-L44-E-SPI-Cxx
ISM43362-M3G-L44-E-USB-Cxx
ISM43362-M3G-L44
802.11 Module, STM32F205
(1 Meg), External U.FL
Connector
Evaluation Board, USB cable,
with ISM43362-M3G-L44-E,
Quick Start Guide
UART
SPI
USB
UART
ISM43362-M3G-L44-U-C-xx
ISM43362-M3G-L44-U-SPI-Cxx
ISM43362-M3G-L44-U-USB-Cxx
ISM43362-M3G-EVB-E
ISM43362-M3GEVB-E
*c-xx designates firmware revision – modules shipped with firmware
3 GENERAL FEATURES








Based on the Broadcom BCM43362 MAC/Baseband/Radio device.
Supports Broadcom WICED SDK
CPU ARM Cortex™-M3 32-bit RISC core from ST Microelectronics.
Host UART, SPI, or USB HID interface.
IEEE 802.11n D7.0 -OFDM-72.2 Mbps -single stream w/20 MHz, Short GI
IEEE 802.11g (OFDM 54 Mbps)
IEEE 802.11b (DSSS 11Mbps)
IEEE 802.11i (Security)
o
o








WPA (Wi-Fi Protected Access) –PSK/TKIP
WPA2 (Wi-Fi Protected Access 2)- AES/CCMP/802.1x Authentication
Inputs +3.3 V tolerant
5 GPIO, 5 ADC (Note: SPI interface utilizes ADC pins.)
The devices operate from a 3.0 to 3.6 V power supply.
-40 to +85 °C temperature range
Power-saving mode allows the design of low-power applications.
Lead Free Design which is compliant with ROHS requirements.
EMI/EMC Metal Shield for best RF performance in noisy environments and to
accommodate for lower RF emissions/signature for easier FCC compliance.
FCC/CE Compliance Certification.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
5
ISM43362-M3X Product Specification
3.1 Limitations
Inventek Systems products are not authorized for use in safety-critical applications
(such as life support) where a failure of the Inventek Systems product would
reasonably be expected to cause severe personal injury or death.
3.2 Regulatory Compliance
CE
Regulator
FCC
CE
RoHS
Status
07P-362
10147A-362
Compliant
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
6
ISM43362-M3X Product Specification
3.3 FCC and IC User’s Manual Statements:
OEM INSTRUCTIONS:
This module is limited to OEM installation only.
OEM integrators must ensure that the end-user has no manual instructions to remove or
install the module.. OEM’s must comply with FCC marking regulation part 15 declaration
of conformity (Section 2.925(e)).
This module is to be installed only in mobile or fixed applications (Please refer to FCC
CFR 47 Part 2.1091(b) for a definition of mobile and fixed devices).
Separate approval is required for all other operating configurations, including portable
configurations with respect to FCC CFR 47 Part 2.1093, and different antenna
configurations.
The antennas used with this module must be installed to provide a separation distance
of at least 20cm from all persons, and must not be co-located or transmit simultaneously
with any other antenna or transmitter, except in accordance with FCC multi transmitter
product procedures.
The ISM43362 Module has been designed to operate with the following antennas and
gains. Use with other antenna types or with these antenna types at higher gains is
strictly prohibited.
Manufacturer
Inventek
Inventek
Type of
Antenna
U.FL port
Antenna
Trace Antenna
Model
Gain dB
W24P-U
2.15
NA
0
Type of
Connector
Unique
Connector
Permanent
integral
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
7
ISM43362-M3X Product Specification
Warning: changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate this equipment.
A clearly visible label is required on the outside of the user’s (OEM) enclosure stat the
following text:
Contains FCC ID: O7P-362
Contains IC: 10147A-362
This transmitter module has been certified for FCC Part 15 operation; when installed in
a host device, the host manufacturer is responsible for making sure that the host device
with the transmitter installed continues to be compliant with Part 15B unintentional
radiator requirements
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
8
ISM43362-M3X Product Specification
Industry Canada User’s Manual Statements:
IC RSS-210/RSS-Gen NoticesOperation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of this device.
L’opѐration est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas
provoquer d’interfѐrences et (2) cet apparial doit accepter toute interfѐrence, y compris
les interfѐrences qui peuvent causer un mauvis fonctionment de l’appareil.
Under Industry Canada regulations, this radio transmitter may only operate using an
antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry
Canada. To reduce potential radio interference to other users, the antenna type and its
gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not
more than that necessary for successful communication.
Sous la rѐglementation d’Industrie Canada, ce transmetteur radio ne peut fonctionner
en utilisant une antenne d’un type et un maximum (ou moins) gain approuvѐes pour
l’ѐmetteur par Industrie Canada. Pour rѐduire le risqué d’interference aux autres
utilisateures, le type d’antenne et son gain doivent être choisis de maniѐre que la
puissance isotrpe rayonnѐe ѐquivalente (PIRE) ne dѐpasse pas ce qui est nѐcessaire
pour une communication rѐussie.
The radio transmitter has been approved by Industry Canada to operate with the
antenna types listed above with the maximum permissible gain and required antenna
impedance for each antenna type indicated. Antenna types not included in this list
having a gain greater than the maximum gain indicated for that type, are strictly
prohibited for use with this device.
Cet ѐmetteur de radio a ѐtѐ approuvѐ par Industrie Canada pour fonctionner avec les
types d’antennes ѐnumѐrѐes ci-dessus avec le gain maximal admissible et impѐdance
d’antenna requise pour chaque type d’antenne indiquѐ. Types d’antennes ne figurant
pas dans cette liste, ayant un gain supѐrieur au gain maximum indiquѐ pour ce type,
sont strictement interdites pour l’utilisation avec cet appareil.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
9
ISM43362-M3X Product Specification
4 COMPLEMENTARY DOCUMENTATION
4.1 Inventek Systems
 Evaluation Board
o ISM43362-M3G-EVB Evaluation Board Specification
o EVB User’s Guide
o Quick Start Guide
o eS-WiFi Demo software (includes EVB Drivers and Firmware)
 AT Command Set
o AT Command Set User’s Manual
o AT Command Set Quick Reference Guide
 Firmware
 OrCAD Schematic Symbol
 PADS Land Pattern
 FCC Test Report
5 SPECIFICATIONS
5.1 Module Architecture
Figure 1 Inventek’s ISM43362-M3 General Block Diagram
Note:
1. ADC1-ADC4 can also be used as SPI port
2. Antenna Options: Integrated microstrip antenna or U.FL connector for an external antenna.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
10
ISM43362-M3X Product Specification
5.2 External Antenna Connections
ISM43362-M3G-L44-U module is designed for use with an external antenna via a
connection using the U.FL connector.
Item
Description
Connector
U.FL series
Manufacturer I-PEX Co., Ltd.
Part No.
20279-001E-01
Height
1.25 mm
Width
2 mm
DC
3.0 – 5.0 V
Table 1 On-Board Antenna Connector
5.3 Mechanical Specifications
The Physical dimensions of this eS-WiFi Module are as follow:
* Keep out
Area
Figure 2: ANTENNA IS IN ETCH
* External Antenna does not require “keep out” area
”Keep out” area should ideally have the antenna hanging off the side of the PCB for best
performance. If you do not hang the antenna off the PCB, ensure no ground planes or traces are
placed under the antenna (keep out area). Surrounding metal will affect the antenna
performance. *The ISM43362-M3G-L44- U and -E have the same footprint.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
11
ISM43362-M3X Product Specification
Items
Description
ISM43362-M3G-L44-E /U
Length
Width
Height
Package
30 mm (-/+0.5 mm)
14.5 mm (-/+0.5 mm)
2.5 ± 0.2 mm
44 pin LGA
5.4 Environmental Specifications
Item
Operating temperature range
Storage temperature range
Humidity
Description
-40 deg. C to +85 deg. C
-40 deg. C to +85 deg. C
95% max non-condensing
Note 1: The ISM43362-M3G supports a functional operating range of -40°C to +85°C.
However the optimal RF performance specified in this data sheet is only guaranteed for
temperatures from -10°C to +65°C
6 HARDWARE ELECTRICAL SPECIFICATIONS
6.1.1 Absolute Maximum Ratings
Symbol
Description
Min
Max
Unit
VDD
Input supply Voltage
-0.4
3.7
V
VBAT
Battery Backup
-0.4
3.6
V
6.1.2 Recommended Operating Ratings
Symbol
Min.
Typ.
Max.
Unit.
VDD
3.0
3.3
3.6
V
VBAT
3.0
3.3
3.6
V
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
12
ISM43362-M3X Product Specification
7 Power Consumption
7.1.1 Estimated Power Consumption
Mode/Description
802.x
Max.
Unit
Running Full Power
/n
3.3V
(1)
Running in Power Save Mode
/n
3.3V
110
Wi-Fi Radio Off
b/g/n
(2)
Stop Mode
Note:
(1)
During transmit the maximum current can reach 340 mA burst of not more than 5ms.
(2)
Available in Firmware release 1.3 or later only.
mA
mA
mA
mA
(1)
Voltage
Typ.
(RMS)
110
55
30
10
The eS-WiFi modules support multiple power saving modes. Please see the power savings
application note for more detailed information
7.1.2 Stop Mode
Stop Mode is initiated by software and exited by the Wakeup pin. (Wakeup pin is 3.3 volt
tolerant). The wakeup pin is an external interrupt pin that on the rising edge will cause the
module to exit stop mode. It is an edge trigged input. It is critical to have no glitch on this line.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
13
ISM43362-M3X Product Specification
8 Pin out
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
14
ISM43362-M3X Product Specification
8.1.1 Detailed Pin Description
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Type
Pin Definition
G GND
I VDD
G GND
I/O RES
I/O RES
I/O RES
I/O RES
I/O RES
I ADC 4 / SPI_MOSI
I ADC 3 / SPI_MISO
I ADC 2 / SPI_SCK
I ADC 1 / SPI_SSN
I ADC 0/ DATARDY
I VDD
I VBAT
I Wakeup
G GND
I DP
I/O DM
G GND
I/O RX
I/O TX
I/O GPIO 0
I/O GPIO 1
I/O GPIO 2
I/O GPIO 3
I/O GPIO 4
I CFGO
I CFG1
O RES
I RES
I RES
I BOOT 0
I RSTN
G GND
G GND
Descriptions
Ground
3.3V
Ground
Reserved
Reserved
Reserved
Reserved
Reserved
ADC Input Pins or SPI Host Interface
(Refer to SPI Section 10.2)
3.3V
3.3V
(Refer to Section 7.1.2)
Ground
USB Data Plus (Refer to Table 8.1.2)
USB Data Minus (Refer to Table 8.1.2 )
Ground
UART Receive (Refer to section 10.1 )
UART Transmit (Refer to section 10.1 )
General Purpose Interface Pins
Configuration Pin 0 (Refer to Table 8.1.2 )
Configuration Pin 1 (Refer to Table 8.1.2 )
Reserved
Reserved
Reserved
Reserved
Reset (See STM32F205 NRST specification )
Ground
Ground
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
15
ISM43362-M3X Product Specification
Pin No. Type
Pin Definition
37
G GND
38
G GND
39
G GND
40
G GND
41
G GND
42
G GND
43
G GND
44
G GND
Descriptions
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
8.1.2 Configuration Pins:
CFGO
1
1
0*
0*
CFG1
Internally Pulled High
1
UART ( NC)
0*
SPI
1
USB VCP
0*
USB HID
*Requires a 10K ohm pull down
Note: These pins are not used in the currently available production firmware. Modules are
preprogrammed with separate and specific firmware that supports either UART, SPI or USB
HID. In future versions of the firmware these pins will be used to select the host interface type.
9 Firmware Upgrades during Development
We recommend using a JTAG 10 pin header or directly connecting to the JTAG pins on the
module for updating. Use the ST-Link to flash the ST micro.
Below are links to the ST-Link and JTAG header at Digikey:
STLink:
http://www.digikey.com/product-detail/en/ST-LINK%2FV2/497-10484-ND/2214535
The 10 to 20 pin JTAG adapter is Digi-Key PN 726-1193-ND:
http://www.digikey.com/product-detail/en/MDL-ADA2/726-1193-ND/1986451
10 Serial Host Interfaces Available
UART, SPI and USB-HID host interfaces are supported and unique firmware is required for each
interface.
10.1 UART
A universal asynchronous receiver / transmitter (UART) with 3.3v logic levels is available.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
16
ISM43362-M3X Product Specification
10.1.1
Data Mode
When the eS-WiFi module is interfaced serially, the serial interface needs to be configured
for 8 bit data, no parity, and one stop bit -- (8-n-1).
10.1.2
2.1.2 Flow Control
The eS-WiFi module doesn’t require or support Flow Control, so Flow Control should be
‘None’
10.1.3
2.1.3 Supported Baud Rates
The eS-WiFi module supports the following serial baud rates:
1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 1152000,
1382400, 1612800, 1834200, 2073600
10.1.4
Default Serial Configuration
The eS-WiFi module is shipped with the default serial configuration of 115200 baud, 8 data bits, no
party, and 1 stop bits.
10.2 SPI (Serial Peripheral Interface Bus)
The eS-WiFi module supports SPI (Contact Inventek for specific firmware.)
SCLK
MOSI
MISO
SSN
CMD/DATA
READY
Command
Phase
Data
Phase
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
17
ISM43362-M3X Product Specification
SPI Slave Interface:
Clock rate:
20MHz max.
Width:
16-bit
Note:
All commands to the eS-WiFi module must be post-padded with 0x0A (Line Feed) to an even
number of bytes.
All data from eS-WiFi module will be post-padded with 0x15(NAK) to an even number of bytes.
10.2.1
SPI Communication Overview:
With the exception of initial cursor, all communication with the module happens synchronously.
In other words, the SPI Master must always poll for every asynchronous event.
A typical command flow is provided flow. This is an example using the Direct Connect Soft AP
with a TCP communication server.
SPI Master
SPI Slave
Description
“\r\n> “
Prompt
“AS=0,ABC\r\x15”
"\r\n\r\nOK\r\n> "
Set Access Point SSID
“AD\r\x15”
"\r\n\r\nOK\r\n> "
Start AP - Direct Mode
"P1=0\r\x15"
"\r\n\r\nOK\r\n> "
Set TCP Protocol
"P4=2000\r"
"\r\n\r\nOK\r\n> "
Set TCP Port
"P5=1\r\x15"
"\r\n\r\nOK\r\n> "
Start TCP COMM Server
"MR\r\x15"
"\r\n[SOMA]...[EOMA]\r\nOK\r\n> Read Messages
"
Note: [SOMA] - Start of Message Asynchronous, [EOMA] - End Of Message Asynchronous
The SPI communication is always 16-bit and can be sustained up to 20MHz. The eS-WiFi
module after power up or reset will raise CMD/DATA READY pin to signal that the first Data
Phase has started. In this mode, the SPI Host must fetch the cursor. As provided by the example
above, this is the only time host needs fetch data from slave without issuing a command.
The Host will initiate a SPI cycle (lower SSN) and clock out 0x0A (Line Feed) until the
CMD/DATA READY pin lowers signaling the end of the Data Phase. The data received will be
0x0d (CR) 0x0A (LF) 0x3E (>) 0x20 (SP).
The next rising edge of the CMD/DATA READY pin signals the Command Phase.
10.2.2
SPI Command Phase:
The Command Phase indicates the eS-WiFi module is ready to accept a AT Command. The
command must include all delimiters and data for the command.
Ex.
S3=0010\r0123456789
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
18
ISM43362-M3X Product Specification
The command must also be sent as one continuous SPI cycle, that is SSN must stay low for the
complete command, delimiters, and data.
The Host will initiate a SPI cycle (lower SSN) and clock out the command, delimiters and
associated data and raise the NSS signal to indicated that the all data has be sent. As result of the
NNS raising the eS-WiFi module will lower the CMD/DATA READY pin to signal the end
Command Phase.
The data that will be clocked back to the Host will be 0x15 (NAK).
10.2.3
SPI Data Phase:
The Data Phase indicates the eS-WiFi module has data ready for the Host to read. The eS-WiFi
module will raise CMD/DATA READY and the Host will initiate a SPI cycle (lower SSN) and
clock out 0x0A (Line Feed) until the CMD/DATA READY pin lowers signaling the end of the
Data Phase.
10.2.4
SPI Asynchronous Messages:
There are certain situations in which the eS-WiFi will issue asynchronous messages:
 Soft AP (AO/AD Commands), when a device connects to the Soft AP a DHCP assigned
message will issued.
Ex. [DHCP ] Assigned 00:00:00:00:00:00 has 192.168.10.100
 TCP/UDP Communication Servers (P5=1), when a client connects to the server a
connected message will be issued.
Ex. [TCP SVR] Waiting on connection...
[TCP SVR] Accepted 192.168.10.100:2000
[UDP SVR] Accepted 192.168.10.100:2000
With the SPI host interface being synchronous the Host must poll for these messages. This can
be done by using the MR (Message Read) command or when a Communication connection the
issuing of a R0 command will read all asynchronous message and the result of the R0 command.
The asynchronous messages are delineated by the Start Of Message Asynchronous ([SOMA])
and End Of Message Asynchronous ([EOMA]) markers.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
19
ISM43362-M3X Product Specification
10.2.5
SPI AC Characteristics:
Symbol
Tf(sck)
Tc(sck)
Tsu(sck)
Tc(byte)
Tsu(ssn)
Th(ssn)
Min.
Typ.
Max.
20 MHz
50 ns
15 us
8 * Tc(sck)
4 us
3 us
10.3 USB
The eS-WiFi module supports a USB HID interface. (Contact Inventek for specific firmware.)
10.4 GPIO
Each of the GPIO pins can be configured by the AT command set as Button, LED, Digital input
or Digital output. The outputs are 3.3V CMOS and reference the AT Command Set User manual
to configure.
10.5 ADC’s
One 12-bit analog-to-digital converter is available. Reference the AT Command Set User’s
manual for configuration.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
20
ISM43362-M3X Product Specification
11 Wi-Fi RF Specification
11.1.1
RF Specification
Conditions: VDD=3.3V; VDDIO=3.3V; TEMP: 25°C
Feature
WLAN Standard
Frequency Range
Number of Channels
Modulation
Output Power
Receive Sensitivity
(11n,20MHz)
@10% PER
Receive Sensitivity
(11g) @10% PER
Receive Sensitivity
(11b) @10% PER
Data Rates
Data Rate
(20MHz ,Long GI,800ns)
Description
IEEE 802.11b/g/n, Wi-Fi compliant
2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band)
Ch1 ~ Ch14
802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK
802.11b : CCK, DQPSK, DBPSK
802.11b /11Mbps : 20 dBm ± 1.5 dB
802.11g /54Mbps: 20 dBm ± 1.5 dB
802.11n /72Mbps: 20 dBm ± 1.5 dB
- MCS=0
PER @ -86 dBm, typical
- MCS=1
PER @ -85 dBm, typical
- MCS=2
PER @ -85 dBm, typical
- MCS=3
PER @ -84 dBm, typical
- MCS=4
PER @ -80 dBm, typical
- MCS=5
PER @ -78 dBm, typical
- MCS=6
PER @ -72 dBm, typical
- MCS=7
PER @ -69 dBm, typical
- 6Mbps
PER @ -89 dBm, typical
- 9Mbps
PER @ -88 dBm, typical
- 12Mbps
PER @ -88 dBm, typical
- 18Mbps
PER @ -87 dBm, typical
- 24Mbps
PER @ -83 dBm, typical
- 36Mbps
PER @ -80 dBm, typical
- 48Mbps
PER @ -75 dBm, typical
- 54Mbps
PER @ -72 dBm, typical
- 1Mbps
PER @ -93 dBm, typical
- 2Mbps
PER @ -91 dBm, typical
- 5.5Mbps
PER @ -89 dBm, typical
- 11Mbps
PER @ -87 dBm, typical
802.11b : 1, 2, 5.5, 11Mbps
802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
21
ISM43362-M3X Product Specification
Data Rate
802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps
(20MHz ,short GI,400ns)
Maximum Input Level
802.11b : -10 dBm
802.11g : -10 dBm
12 Antenna Patterns
12.1 External Antenna
The Inventek U.FL PCB antenna has passed FCC and CE testing. The part number is W24P-U. It
is a 2.4 GHz PCB antenna with an U.FL connector.
The eS-Wifi family of Wi-Fi products comes with two different antenna offerings:
ISM43362-M3G-L44-E
ISM43362-M3G-L44-U
PCB Etched Antenna
U.FL connector for external antenna
The Inventek W24P-U PCB antenna is FCC and CE certified and can be found on the Inventek
Website.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
22
ISM43362-M3X Product Specification
12.2 PCB Etch Antenna Gain on the Evaluation Board
The eS-WiFi PCB etched antenna performance is shown below. This etched antenna is FCC and
CE certified and the radiation patterns shown below are based on simulation using evaluation
boards that have a ground plane with dimensions of 71mm x 48mm.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
23
ISM43362-M3X Product Specification
12.3 Farfield Directivity
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
24
ISM43362-M3X Product Specification
13 On Board Processor
The eS-WiFi module is available with ST Microcontroller, F205 family of processors.
ISM43362-M3G-L44 -E STM32F205 (1 Meg), Flash
ISM43362-M3G-L44-U
Microcontroller
STM32F205 (1Meg), Flash
Microcontroller)
See the STM32F205 specification from ST Microelectronics for UART, SPI (Slave Mode) and
USB Device.
http://www.st.com/internet/mcu/product/164485.jsp#DATASHEET
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
25
ISM43362-M3X Product Specification
14 ISM43362-M3G-L44 FOOTPRINT
14.1 Module’s package dimensions (mm)
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
26
ISM43362-M3X Product Specification
15 Typical Application Circuit
This is the minimum number of wires required to be connected to a host microcontroller for
operation in UART mode. It is recommended that the JTAG lines are also brought out for future
firmware upgrades.
ISM43362-M3G
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
27
ISM43362-M3X Product Specification
15.1 Reference Schematic (EVB)
ISM43362-M3G
Typical application circuits please refer to schematic below. For a *.pdf version please visit the
Wi-Fi evaluation board website, www.Inventeksys.com.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
28
ISM43362-M3X Product Specification
15.2 USB to UART
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
29
ISM43362-M3X Product Specification
15.3 Connecting Microcontroller to eS-WiFi UART
ISM43362-M3G
ISM43362-M3G
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
30
ISM43362-M3X Product Specification
15.4 EXTERNAL FLASH FOR OVER THE AIR UPGRADE
(In development, contact Inventek)
15.5 JTAG and Reset Connections
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
31
ISM43362-M3X Product Specification
15.6 eS-WiFi Programming Options
15.7 eS-WiFi USB Direct Connection Option
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
32
ISM43362-M3X Product Specification
16 Product Compliance Considerations
RoHS: Restriction of Hazardous Substances (RoHS) directive has come into force since
1st July 2006 all electronic products sold in the EU must be free of hazardous materials,
such as lead. Inventek is fully committed to being one of the first to introduce lead-free
products while maintaining backwards compatibility and focusing on a continuously high
level of product and manufacturing quality.
EMI/EMC: The Inventek module design embeds EMI/EMC suppression features and
accommodations to allow for higher operational reliability in noisier (RF) environments
and easier integration compliance in host (OEM) applications.
FCC/CE: The module will be in compliance test for FCC/CE
17 Reflow Profile



Reference the IPC/JEDEC standard.
Peak Temperature:
<250°C
Number of Times:
≤2 times
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
33
ISM43362-M3X Product Specification
18 Packaging Information
18.1 MSL Level / Storage Condition
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
34
ISM43362-M3X Product Specification
18.2 Device baking requirements prior to assembly
Boards must be baked prior to rework or assembly to avoid damaging moisture sensitive
components during localized reflow. The default bake cycles is 24 hours at 125C.
Maintaining proper control of moisture uptake in components is critical.
Before opening the shipping bag and attempting solder reflow, you should maintain a
minimal out-of-bag time and ensure the highest possible package reliability for the final
product.
Module’s Assembly Instructions
Board Placement: The ISM43362-M3G-L44 has an optional on board Wi-Fi antenna.
The board is designed to be a stuffing option. If you elect to use the on-board antenna,
then board placement is critical in your system. Several key items to consider when
placing the module are:
 Ensure that the antenna portion of the design is placed so that the antenna has
no ground plane under, above or near the antenna. Ideally, the antenna requires
clear sky for optimal performance. If you have shields or other material around
the antenna, please test for interference and loss of signal strength.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
35
ISM43362-M3X Product Specification
19 REVISION CONTROL
Document : ISM43362-M3G-L44
External Release
Wi-Fi module
DOC-DS-20023
Date
8/15/2012
2/11/2013
Author
FMT
FMT
Revision
1.0
1.1
5/5/2013
7/24/13
FMT
FMT
2.0
2.1
Comment
Preliminary
Updated Ref.
Schematic
Updated SPI
Added FCC, updated
Temperature
,SPI,UART
20 CONTACT INFORMATION
Inventek Systems
2 Republic Road
Billerica Ma, 01862
Tel: 978-667-1962
Sales@inventeksys.com
www.inventeksys.com
Inventek Systems reserves the right to make changes without further notice to any products or data herein to improve reliability,
function, or design. The information contained within is believed to be accurate and reliable. However Inventek Systems does not
assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit
described herein, neither does it convey any license under its patent rights nor the rights of others.
_____________________________________________________________________________________________
Inventek Systems
DOC-DS-20023-2.1
36
Download PDF
Similar pages