MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
General Description
The MAX17620 is a high-frequency, high-efficiency
synchronous step-down DC-DC converter with integrated
MOSFETs that operates over a 2.7V to 5.5V input voltage
range. The device supports up to 600mA load current and
1.5V to 100% VIN output voltage. High-frequency operation
enables the use of small, low-cost inductors and capacitors.
The device features selectable PWM/skip mode of
operation at light loads and operates at a 4MHz fixedfrequency in PWM mode. Skip mode improves system
efficiency at light loads, while PWM mode maintains a
constant switching frequency over the entire load.
In skip mode, the device draws only 40µA of quiescent
current from the supply input. In shutdown mode, the current
consumption is reduced to 0.1µA.
The device also features a soft-start feature to reduce
the inrush current during startup, and also incorporates an
enable (EN) pin to turn on/off the device. An open-drain
PGOOD pin provides power-good signal to the system
upon achieving successful regulation of the output voltage.
The MAX17620 is available in an 8-pin, 2mm x 2mm
TDFN package and operates over the -40°C to +125°C
temperature range.
Applications
●●
●●
●●
●●
Point-of-Load Power Supply
Standard 5V Rail Supplies
Battery-Powered Instruments
Distributed Power Systems
Benefits and Features
●● Minimizes External Components, Reducing Total
Cost
• Synchronous Operation for High Efficiency and
Reduced Cost
• Internal Compensation for Stable Operation at Any
Output Voltage
• All-Ceramic Capacitor Solution
• 4MHz Operation
• Only 5 External Components Required
• Total Solution Size is 12mm2 (Sum of the
Components Area)
●● Reduces Number of DC-DC Regulators to Stock
• Wide 2.7V to 5.5V Input Voltage Range
• Adjustable 1.5V to 100% VIN Output Voltage Range
• Delivers Up to 600mA Load Current
• 100% Duty-Cycle Operation
• +1%/-0.75% Reference Voltage Accuracy
• Available in a 2mm x 2mm TDFN Package
●● Reduces Power Dissipation
• Peak Efficiency 91%
• Skip Mode for High Light-Load Efficiency
• Shutdown Current = 0.1µA
●● Operates Reliably
• Peak Current-Limit Protection
• Soft-Start Reduces Inrush Current During Startup
• Built-In Output-Voltage Monitoring
(Open-Drain PGOOD Pin)
• -40°C to +125°C Operation
Ordering Information appears at end of data sheet.
Typical Application Circuit—1.8V, 600mA Step-Down Regulator
2.7V TO 5.5V
CIN
2.2µF
L
1µH
IN
MAX17620
GND
EN
MODE
VOUT
COUT
10µF
R1
24kΩ
FB
PGOOD
CIN: 2.2µF/10V/0603/X7R,GRM188R71A225KE15D, MURATA
L1: 1μH, 60mΩ, MAKK2016H1ROM, TAIYO-YUDEN
COUT : 10μF/6.3V/0805/X7R, GRM21BR70J106KE76K, MURATA
19-7543; Rev 2; 10/15
VOUT
1.8V/600mA
LX
R2
19.1kΩ
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Absolute Maximum Ratings
IN to GND...................................................................-0.3V to 6V
LX to GND..................................................................-0.3V to 6V
MODE ........................................................... -0.3V to VIN + 0.3V
EN, PGOOD, FB, VOUT to GND...............................-0.3V to 6V
Continuous Power Dissipation (up to TA = +70°C)
(derate 9.8mW/°C above TA = +70°C)..........................784.3mW
Operating Temperature Range.......................... -40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Soldering Temperature (Reflow).......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (θJA).........102°C/W
Junction-to-Case Thermal Resistance (θJC)..................8°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
VIN = +3.6V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical specifications are at TA = TJ = +25°C. (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
INPUT SUPPLY (IN)
Input Voltage Range
IIN-SH
Input Supply Current
Undervoltage-Lockout Threshold
(UVLO)
UVLO Hysteresis
2.7
VIN
5.5
VEN = 0V, shutdown mode
0.1
IQ_SKIP
Nonswitching
40
IQ-PWM
PWM mode (switching)
6
VIN_UVLO
VIN rising
2.55
VIN_UVLO_HYS
2.6
UNITS
V
µA
mA
2.65
200
V
mV
ENABLE (EN)
EN Low Threshold
VEN_LOW
VEN falling
EN High Threshold
VEN_HIGH
VEN rising
EN Hysteresis
VEN_HYS
EN Input Leakage
IEN
0.8
2
V
V
220
mV
VEN = 5.5V, TA = TJ = +25°C
10
50
nA
POWER MOSFETS
High-Side pMOS On-Resistance
RDS-ONH
VIN = 3.6V, ILX = 190mA
120
200
mΩ
High-Side pMOS On-Resistance
RDS-ONH
VIN = 5.0V, ILX = 190mA
100
160
mΩ
Low-Side nMOS On-Resistance
RDS-ONL
VIN = 3.6V, ILX = 190mA
80
145
mΩ
Low-Side nMOS On-Resistance
RDS-ONL
VIN = 5.0V, ILX = 190mA
70
130
mΩ
LX Leakage Current
ILX_LKG
LX = GND or IN, TA = +25°C
0.1
1
µA
High-Side Peak Current Limit
ILIM_PEAK
1150
1450
1800
mA
Low-Side Valley Current Limit
ILIM_VALLEY
920
1170
1450
mA
Low-Side Negative Current Limit
Low-Side Zero-Crossing
Current Limit
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ILIM_NEG
ILIM_ZX
Current entering into LX pin
1050
mA
MODE = IN, current leaving out of LX
pin
100
mA
Maxim Integrated │ 2
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Electrical Characteristics (continued)
VIN = +3.6V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical specifications are at TA = TJ = +25°C. (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
4.16
MHz
SWITCHING FREQUENCY
Switching Frequency
Minimum Controllable On-Time
fSW
MODE = GND
3.84
tON_MIN
LX Dead Time
tSS
tSS = 4096 CLK cycles
FB Voltage Accuracy
VFB
PWM mode
FB Input Bias Current
IFB
FB = 0.6V, TA = TJ = 25°C
Soft-Start Time
4
40
ns
3
ns
1
ms
FEEDBACK (FB)
-0.75
+1
%
50
120
nA
POWER GOOD (PGOOD)
PGOOD Rising Threshold
FB rising
91.5
93.5
95.5
%
PGOOD Falling Threshold
FB falling
88
90
92
%
PGOOD Output Low
IPGOOD = 5mA
200
mV
PGOOD = 5.5V, TA = TJ = 25°C
100
nA
PGOOD Output Leakage Current
IPGOOD_LKG
MODE
MODE Pullup Current
VMODE = GND
5
µA
165
°C
10
°C
THERMAL SHUTDOWN
Thermal-Shutdown Rising
Threshold
Thermal-Shutdown Hysteresis
Temperature rising
Note 2: Limits are 100% production tested at TA = +25°C. Limits over the operating temperature range and relevant supply voltage
range are guaranteed by design and characterization.
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Maxim Integrated │ 3
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Typical Operating Characteristics
(See the Typical Application Circuits, TA = +25°C, VIN = 3.6V, unless otherwise noted.)
1.8V OUTPUT, PWM MODE,
EFFICIENCY vs. LOAD CURRENT
100
1.8V OUTPUT, SKIP MODE,
EFFICIENCY vs. LOAD CURRENT
100
95
95
80
VIN = 3.6V
75
VIN = 4.2V VIN = 5.5V
VIN = 2.7V
90
85
VIN = 5.5V
80
70
VIN = 2.7V
75
65
MODE = GND
50
150
250
350
450
70
550
1.8V OUTPUT, SKIP MODE,
LOAD AND LINE REGULATION
810
10
600
100
1.790
1.815
VIN = 5.5V
1.810
1.805
VIN = 3.6V
1.800
FEEDBACK VOLTAGE vs. TEMPERATURE
0
100
200
300
804
802
800
798
796
792
MODE = OPEN
400
0
100
200
500
790
600
-40
-20
0
20
40
60
80
400
500
600
100
120
VIN = 5.5V
VIN = 3.6V
50
45
40
35
30
VIN = 2.7V
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
LOAD CURRENT (mA)
300
INPUT SUPPLY CURRENT vs.
TEMPERATURE, SKIP MODE
60
55
806
794
VIN = 4.2V
1.795
MODE = GND
LOAD CURRENT (mA)
INPUT SUPPLY CURRENT (µA)
FEEDBACK VOLTAGE (V)
VIN = 2.7V
VIN = 4.2V
1.795
808
1.820
OUTPUT VOLTAGE (V)
VIN = 2.7V
LOAD CURRENT (mA)
1.825
1.790
VIN = 3.6V VIN = 4.2V
1.800
MODE = OPEN
1
LOAD CURRENT (mA)
1.830
OUTPUT VOLTAGE (V)
85
VIN = 5.5V
VIN = 3.6V
1.805
EFFICIENCY (%)
EFFICIENCY (%)
90
60
1.8V OUTPUT, PWM MODE,
LOAD AND LINE REGULATION
1.810
SOFT-START FROM EN, PWM MODE,
1.8V OUTPUT, NO LOAD CURRENT
SHUTDOWN CURRENT vs. TEMPERATURE
70
SHUTDOWN CURRENT (nA)
60
50
40
30
VIN = 3.6V
20
VIN = 2.7V
10
5V/div
VOUT
1V/div
VPGOOD
0
-10
VEN
VIN = 5.5V
2V/div
IOUT
-40
-20
0
20
40
60
TEMPERATURE (°C)
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80
100
120
200mA/div
200μs/div
Maxim Integrated │ 4
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Typical Operating Characteristics (continued)
(See the Typical Application Circuits, TA = +25°C, VIN = 3.6V, unless otherwise noted.)
SOFT-START WITH 1V PREBIAS,
1.8V OUTPUT, PWM MODE
SOFT-START/SHUTDOWN FROM EN,
1.8V OUTPUT, 600mA LOAD CURRENT
VEN
5V/div
VOUT
1V/div
IIN
STEADY-STATE SWITCHING WAVEFORMS,
1.8V OUTPUT, NO LOAD, PWM MODE
VEN
5V/div
VOUT
1V/div
VOUT
(AC)
10mV/div
VL X
2V/div
200mA/div
2V/div
VPGOOD
VPGOOD
1ms/div
2V/div
200mA/div
I LX
100ns/div
200μs/div
VOUT
(AC)
10mV/div
2V/div
VL X
I LX
1.8V OUTPUT, PWM MODE,
(LOAD CURRENT STEPPED
FROM NO LOAD TO 300mA)
STEADY-STATE SWITCHING WAVEFORMS,
1.8V OUTPUT, 10mA LOAD, SKIP MODE
STEADY-STATE SWITCHING WAVEFORMS,
1.8V OUTPUT, 600mA LOAD CURRENT
VOUT
(AC)
20mV/div
VLX
2V/div
I LX
500mA/div
VOUT
(AC)
20mV/div
I OUT
200mA/div
500mA/div
100ns/div
40μs/div
4µs/div
1.8V OUTPUT,
(LOAD CURRENT STEPPED
FROM 300mA TO 600mA)
VOUT
(AC)
1.8V OUTPUT, SKIP MODE,
(LOAD CURRENT STEPPED
FROM 5mA TO 300mA)
20mV/div
I OUT
40μs/div
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200mA/div
VOUT
(AC)
50mV/div
I OUT
200mA/div
40µs/div
Maxim Integrated │ 5
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Typical Operating Characteristics (continued)
(See the Typical Application Circuits, TA = +25°C, VIN = 3.6V, unless otherwise noted.)
1.8V OUTPUT, SKIP MODE,
(LOAD CURRENT STEPPED
FROM 5mA TO 50mA)
VOUT
(AC)
OVERLOAD PROTECTION, 1.8V OUTPUT
20mV/div
I OUT
VOUT
1V/div
I OUT
500mA/div
50mA/div
400µs/div
40µs/div
BODE PLOT
TOC19
GAIN (dB)
PHASE
PHASE (º)
GAIN
FCR = 189KHz,
PHASE MARGIN = 62°
FREQUENCY(Hz)
GAIN
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Maxim Integrated │ 6
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Pin Configuration
TOP VIEW
LX
VOUT
FB
PGOOD
8
7
6
5
MAX17620
+
1
2
3
4
IN
GND
EN
MODE
TDFN
(2mm x 2mm)
Pin Description
PIN
NAME
1
IN
2
GND
3
EN
4
MODE
FUNCTION
Power Supply Input. Connect a minimum 1µF ceramic capacitor from IN to GND for bypassing highfrequency noise on IN pin to ground.
Ground Pin. Connect to system ground.
Enable Input. Logic-high voltage on EN pin enables the device, while logic-low voltage disables the
device.
PWM or Skip Mode Selection Input. Connect the MODE pin to GND to enable PWM mode operation.
Leave the MODE pin unconnected to enable skip mode operation.
5
PGOOD
Open-Drain Power Good Output. Connect PGOOD pin to output voltage or IN pin through an external
pullup resistor to generate a “high” level if the output voltage is above 93% of the target regulated
voltage. If not used, leave this pin unconnected. The PGOOD is driven low if the output voltage is below
90% of the target regulated voltage.
6
FB
Feedback Input. Connect FB to the center of the external resistor-divider from output to GND to set the
output voltage.
7
VOUT
8
LX
Switching Node. Connect LX pin to the switching node of the inductor.
—
EP
Exposed Pad. Connect exposed pad to the system ground.
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Output Voltage Input. Connect the positive terminal of the output voltage to the VOUT pin.
Maxim Integrated │ 7
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Block Diagram
IN
UVLO
MAX17620
POK
HIGH-SIDE
CURRENT SENSE
LOGIC
BANDGAP
EN
HSCS
CHIPEN
HSLIM
2V
IPFM
THERMAL
SHUTDOWN
IN
THSD
DRIVER
LOGIC
CLK
OSCILLATOR
CONTROL
LOGIC
5µA
ZX
MODE
CHIPEN
LSCS
PFM_EN
0.55 x VIN
LSLIM
SKIP
VOUT
PFM_EN
SKIP
LOW SIDE
CURRENT SENSE
LOGIC
PWM
GND
SLOPE
COMPENSATION
PGOOD
SLOPE
HSCS
VREF
CLK
ERROR
AMPLIFIER
FB
++
VREF
FB
LX
PWM
0.748V
SOFT
START
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Maxim Integrated │ 8
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Detailed Description
The MAX17620 is a high-frequency, high-efficiency
synchronous step-down DC-DC converter with integrated
MOSFETs that operates over a 2.7V to 5.5V input voltage
range. The device supports up to 600mA load current
and 1.5V to 100% VIN output voltage. High-frequency
operation allows the use of small, low-cost inductors and
capacitors.
The device features a MODE pin to set the device to operate in
PWM or skip mode under light-load conditions. In PWM Mode, the
device operates with its nominal switching frequency of 4MHz
over entire load current range. In skip mode, the device skips
some cycles at light loads thereby reducing the switching
frequency and achieving high efficiency. The device
features a soft-start, open-drain power-good signal
(PGOOD) and enable input (EN).
Control Architecture
The device uses an internally compensated, peakcurrent-mode-control architecture. The high-side MOSFET
is turned on at each clock edge and the low-side MOSFET
is turned off. The high-side MOSFET remains on until the
sum of the high-side MOSFET current-sense voltage and
the internal slope compensating ramp voltage hits the
control voltage generated by the error amplifier. At this
moment, the high-side MOSFET is turned off and the lowside MOSFET is turned on.
During the high-side MOSFET on-time, the inductor
current ramps up and stores energy. During the low-side
MOSFET on-time, the inductor current ramps down and
releases the stored energy to the output.
Enable Input (EN)
The device is enabled by setting the EN pin to a logichigh. Accordingly, a logic-low disables the device. When
the device is enabled, an internal soft-start circuitry
monotonically ramps up the error amplifier’s reference
voltage from 0 to 0.8V in fixed soft-start time of 1ms. This
causes the output voltage to ramp monotonically from 0V
to set voltage. It also avoids excessive inrush current and
prevents excessive voltage drop of batteries with high
internal impedance.
Mode Selection (MODE)
The device can be set to operate in either PWM mode
or skip mode under light-load conditions by connecting
the MODE pin to ground or leaving it unconnected.
Connecting the MODE pin to ground sets the device to
PWM mode and leaving it unconnected sets the device
to skip mode.
In PWM mode, the device operates with its nominal
switching frequency of 4MHz over the entire load current
range and the inductor current is allowed to go negative.
PWM mode is useful in applications where constant
switching frequency is desired.
In skip mode, the device skips pulses at light loads for
high efficiency and the inductor current is not allowed to
go negative. In this mode, when the output voltage falls
below the target value, the internal high-side MOSFET
is turned on until the inductor current reaches to peak
current threshold in skip mode. Once the high-side FET is
turned off, the low-side FET is turned on until the inductor
current falls to zero. The device enters into PWM mode if
the output voltage is below the target voltage during the
next 3 clock cycles after the inductor current falls to zero. If
the output voltage is above the target value during the next
3 clock cycles, then both the high-side and low-side FETs
are turned off and the device enters hibernation mode until
the load discharges the output below the target value.
The peak current threshold in skip mode is a function
of the output inductor and is (375/L)mA, where L is the
output inductor value in µH. The advantage of the skip
mode is higher efficiency at light loads because of lower
quiescent current drawn from the supply. The disadvantage
is that the output-voltage ripple is higher compared
to that of the PWM mode operation and the switching
frequency is not constant at light loads. The device
always operates in skip mode during soft-start under light
loads independent of the MODE pin status. The peak
current threshold in skip mode during soft-start is reduced
by 50% during steady-state operation.
Driving EN low disables the switching and output is
discharged with a typical discharge resistor of 225Ω. The
same happens when the device gets disabled by thermal
shutdown or undervoltage-lockout trigger.
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Maxim Integrated │ 9
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Power-Good Indicator (PGOOD)
The device includes an open-drain power good output
that indicates the output voltage status. PGOOD goes
high impedance when the output voltage is above 93.5%
of the target value, and goes low when the output voltage
is below 90% of the target value.
Startup Into a Prebiased Output
The device is capable of soft-starting into a prebiased
output without discharging the output. The device
ramps up the output voltage monotonically from the
prebiased level to the target level during the soft-start
period if the prebiased voltage is less than the target
output voltage. If the prebiased voltage is more than the
target output voltage, no switching happens during the
soft-start period. The device operation after the completion
of the soft-start period under prebiased output condition
(where the prebiased voltage is higher than the target
output voltage) depends on the PWM/skip mode. In PWM
Mode, the device tries to regulate the output voltage to the
target level by sinking current from the prebiased source.
In skip mode, the device does not initiate switching until
the output voltage falls below the target output voltage.
100% Duty-Cycle Operation
The device can provide 100% duty-cycle operation. In
this mode, the high-side switch is constantly turned on,
while the low-side switch is turned off. This is particularly
useful in battery-powered applications to achieve longest
operation time by taking full advantage of the whole
battery-voltage range. The minimum input voltage to
maintain the output-voltage regulation can be calculated
as:
Undervoltage Lockout
The device features an integrated input undervoltage
lockout (UVLO) feature that turns the device on/off based
on the voltage at the IN pin. The device turns on if the IN
pin voltage is higher than the UVLO threshold (VIN_UVLO)
of 2.6V (typ) (assuming EN is at logic-high) and turns off
when the IN pin voltage is 200mV (VIN_UVLO_HYS) below
the VIN_UVLO.
Overcurrent Protection
The device features a robust overcurrent-protection
scheme that protects the device and inductor under
overload and output short-circuit conditions. A cycle-bycycle peak current limit turns off the high-side MOSFET
and turns on the low-side MOSFET whenever the highside MOSFET current exceeds the internal peak current
limit of 1.45A (typ). The low-side MOSFET remains on
until the next clock cycle. The high-side MOSFET is
turned on again, if the inductor current is less than the
valley current limit at the next clock rising edge. Otherwise,
the low-side MOSFET is kept on for the next clock cycle
as well. Under severe overload conditions, the current will
not exceed 1.45A. If the overload condition is removed,
the part recovers smoothly to target output voltage with no
overshoot.
Thermal Shutdown
Thermal-shutdown protection limits the total power
dissipation in the device. When the device junction
temperature exceeds +165°C, an on-chip thermal
sensor shuts down the device, allowing it to cool. The
thermal sensor turns the device on again after the junction
temperature cools by 10°C.
VIN_MIN = VOUT + (IOUT x RON)
where,
VIN_MIN is the minimum input voltage
VOUT is the target output voltage
IOUT is the load current
RON is the sum of the high-side FET on-resistance and
the output inductor DCR
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Maxim Integrated │ 10
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Applications information
Output Capacitor Selection
Inductor Selection
Three key inductor parameters must be specified to select
output inductor:
1) Inductor value
2) Inductor saturation current
3) DC resistance of the Inductor
The device’s internal slope compensation and current
limit are optimized for 1µH output inductor. Select 1µH
inductor with a saturation current rating higher than the
maximum peak current limit of 1.9A. Inductor with low
DC resistance improves the efficiency of the system.
Selecting ferrite-cored inductors reduces the core losses
and improves efficiency. Table 1 lists recommended
inductors for use in designs.
X7R ceramic capacitors are preferred as output capacitors due to their stability over temperature in industrial
applications. The device’s internal loop-compensation
parameters are optimized for 10µF output capacitors. The
device requires a minimum of 10µF (typ) capacitance for
stability. Table 2 lists the recommended output capacitors.
Capacitors rated less than 4V can be selected for output
voltages less than 3V.
Table 1. List of Recommended Inductors
INDUCTANCE
(µH)
CURRENT
RATING
(A)
DC RESISTANCE
(TYP)
(mΩ)
DIMENSIONS
LxWxH
(mm3)
PART NUMBER
MANUFACTURER
1
2.6
37
2.5 x 2 x 1.2
IFSC1008ABER1R0M01
Vishay Dale
1
3.2
50
2.5 x 2 x 1
252010CDMCDS-1R0MC
Sumida
1
2.3
48
2.5 x 2 x 0.9
CIG22E1R0MNE
Samsung
Electro-Mechanics
America
1
2.3
48
2.5 x 2 x 1.2
MLP2520K1R0MT0S1
TDK Corporation
1
2.7
60
2 x 1.6 x 1
MAKK2016H1ROM
Taiyo Yuden
Table 2. List of Recommended Output Capacitors
CAPACITANCE
(ΜF)
DIELECTRIC
TYPE
VOLTAGE RATING
(V)
PACKAGE
PART
NUMBER
10
X7R
6.3
0805
C2012X7R0J106K125AB
TDK Corporation
10
X7R
6.3
0805
GRM21BR70J106KE76K
Murata Americas
10
X7R
6.3
0805
JMK212B7106KG-T
www.maximintegrated.com
MANUFACTURER
Taiyo Yuden
Maxim Integrated │ 11
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Input Capacitor Selection
The input filter capacitor reduces peak current drawn from
the power source and reduces noise and voltage ripple
on the input caused by the circuit’s switching. The input
capacitor RMS current (IRMS) is defined by the following
equation:
IRMS_CIN = I OUT(MAX) x
VOUT x ( VIN − VOUT )
VIN
particular operating condition, the power losses that lead
to the temperature rise of the device are estimated as
follows:
(

 1 
2
P
=
LOSS POUT x  − 1 − I OUT x R DCR
η



)
where,
POUT is the output power given by the following equation:
POUT = VOUT x IOUT
where:
IOUT(MAX) is the maximum load current
VIN is the input voltage
VOUT is the output voltage
Use low-ESR ceramic capacitors as the input capacitor. X7R temperature coefficient capacitors are recommended in industrial applications for their stability over
temperature. Calculate the input capacitor value using the
following equation:
C IN =
I OUT(MAX) x VOUT x ( VIN − VOUT )
η x f SW x ∆VIN x VIN 2
where:
fSW is the switching frequency (= 4MHz)
η is the efficiency
In applications where the input source is located distant
from the device input, an electrolytic capacitor should
be added in parallel to the ceramic capacitor to provide
necessary damping for potential oscillations caused by
the inductance of the longer input cable and the ceramic
capacitor.
See the Typical Operating Characteristics for the powerconversion efficiency or measure the efficiency to determine the total power losses.
The junction temperature (TJ) of the device can be
estimated at any ambient temperature (TA) from the
following equation:
TJ = TA + (θJA x PLOSS)
where θJA is the junction-to-ambient thermal resistance
of the package (102°C/W for a four-layer board measured
using JEDEC specification JESD51-7).
If the application has a thermal-management system that
ensures the exposed pad of the device is maintained at a
given temperature (TEP), the junction temperature can be
estimated using the following formula:
TJ = TEP + (θJC x PLOSS)
where θJC is the junction-to-case thermal resistance of
the device (8°C/W)
Adjusting the Output voltage
The MAX17620 supports output voltages from 1.5V to
100% VIN. Set the output voltage with a resistor-divider
connected from the positive terminal of the output voltage
to the ground (see Figure 1). Choose R2 in the range of
10kΩ to 100kΩ and calculate the R1 using the following
equation:
V

R1 R2 x  OUT − 1
=
 0.8

VOUT
MAX17620
R1
FB
R2
GND
Power Dissipation
Ensure that the junction temperature of the device does
not exceed +125°C under the operating conditions. At a
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Figure 1. Adjusting the Output Voltage
Maxim Integrated │ 12
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
PCB Layout Guidelines
Careful PCB layout is critical to achieve clean and stable
operation. In particular, the traces that carry pulsating current
should be short and wide so that the parasitic inductance
formed by these traces can be minimized. Follow the
following guidelines for good PCB layout.
For a sample PCB layout that ensures first-pass success,
refer to the MAX17620 evaluation kit layout available at
http://www.maximintegrated.com
●● Place the input capacitor as close as possible to the
IN and GND pins. Use a wide trace to connect the
input capacitor to the IN and GND pins to reduce the
trace inductance.
●● Minimize the area formed by the LX pin and the inductor
connection to reduce the radiated EMI.
●● Ensure that all the feedback connections are short.
●● Route the LX node away from the FB, VOUT and
MODE pins.
Typical Application Circuit
2.7V TO 5.5V
CIN
2.2µF
L
1µH
IN
MAX17620
GND
EN
MODE
VOUT
1.8V/600mA
LX
VOUT
COUT
10µF
R1
24kΩ
FB
PGOOD
R2
19.1kΩ
CIN: 2.2µF/10V/0603/X7R,GRM188R71A225KE15D, MURATA
L1: 1μH, 60mΩ, MAKK2016H1ROM, TAIYO-YUDEN
COUT : 10μF/6.3V/0805/X7R, GRM21BR70J106KE76K, MURATA
Figure 2. 1.8V, 600mA Step-Down Regulator
www.maximintegrated.com
Maxim Integrated │ 13
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Ordering Information
Chip Information
PART
TEMP RANGE
PIN-PACKAGE
MAX17620ATA+T
-40°C to +125°C
8 TDFN
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
www.maximintegrated.com
PROCESS: CMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
8 TDFN
T822+3C
21-0168
90-0065
Maxim Integrated │ 14
MAX17620
4MHz, Miniature 600mA, Synchronous Step-Down
DC-DC Converter with Integrated MOSFETs
Revision History
REVISION
NUMBER
REVISION
DATE
PAGES
CHANGED
0
3/15
Initial release
1
6/15
Updated MODE pin description, updated global specifications for the Typical
Operating Characteristics section, and updated table 1 and table 2
2
10/15
Updated Typical Applications Circuit, replaced/added plots in Typical Operating
Characteristics section, and updated Block Diagram
DESCRIPTION
—
4–6, 7, 9, 11
1-6, 8, 10–11, 13
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
© 2015 Maxim Integrated Products, Inc. │ 15
Mouser Electronics
Authorized Distributor
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