Intel® Server System R1000WF
Product Family
Technical Product Specification
An overview of product features, functions, architecture, and support specifications
Revision 1.0
July 2017
Intel® Server Products and Solutions
Intel® Server System R1000WF Product Family Technical Product Specification
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Intel® Server System R1000WF Product Family Technical Product Specification
Revision History
Date
July 2017
Revision Number Modifications
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Production Release
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Intel® Server System R1000WF Product Family Technical Product Specification
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You may not use or facilitate the use of this document in connection with any infringement or other legal
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Copyright © Intel Corporation. All Rights Reserved.
4
Intel® Server System R1000WF Product Family Technical Product Specification
Table of Contents
1. Introduction ............................................................................................................................................................... 12 1.1 Document Outline.......................................................................................................................................................... 13 1.2 Server Board Use Disclaimer ..................................................................................................................................... 13 1.3 Product Errata.................................................................................................................................................................. 13 2. Server System Family Overview............................................................................................................................ 14 2.1 System Features Overview ......................................................................................................................................... 17 2.2 Server Board Architecture .......................................................................................................................................... 18 2.3 Server Board Features Overview ............................................................................................................................. 19 2.4 Back Panel Features ...................................................................................................................................................... 22 2.5 Front Control Panel ....................................................................................................................................................... 22 2.6 Front Drive Bay Options .............................................................................................................................................. 22 2.7 Locking Front Bezel Support..................................................................................................................................... 23 2.8 System Dimensions ....................................................................................................................................................... 23 2.8.1 Chassis Dimensions....................................................................................................................................................... 23 2.8.2 Label Emboss Dimensions ......................................................................................................................................... 24 2.8.3 Pull-out Tab Label Emboss Dimensions .............................................................................................................. 24 2.9 System Cable Routing Channels .............................................................................................................................. 25 2.10 Available Rack and Cabinet Mounting Kit Options .......................................................................................... 26 2.11 System Level Environmental Limits ....................................................................................................................... 27 2.12 System Packaging .......................................................................................................................................................... 28 3. System Power ............................................................................................................................................................ 29 3.1 Power Supply Configurations ................................................................................................................................... 29 3.2 Power Supply Module Options ................................................................................................................................ 30 3.2.1 Power Supply Module Efficiency ............................................................................................................................. 30 3.2.2 Power Supply Module Mechanical Overview ..................................................................................................... 30 3.2.3 Power Cord Specification Requirements ............................................................................................................. 31 3.3 AC Power Supply Input Specifications .................................................................................................................. 32 3.3.1 Power Factor .................................................................................................................................................................... 32 3.3.2 AC Input Voltage Specification ................................................................................................................................. 33 3.3.3 AC Line Isolation Requirements ............................................................................................................................... 33 3.3.4 AC Line Dropout / Holdup .......................................................................................................................................... 33 3.3.5 AC Line Fuse ..................................................................................................................................................................... 33 3.3.6 AC Inrush ........................................................................................................................................................................... 34 3.3.7 AC Line Transient Specification ............................................................................................................................... 34 3.3.8 Susceptibility Requirements...................................................................................................................................... 34 3.3.9 Electrostatic Discharge Susceptibility ................................................................................................................... 34 3.3.10 Fast Transient/Burst ..................................................................................................................................................... 35 3.3.11 Radiated Immunity ........................................................................................................................................................ 35 3.3.12 Surge Immunity............................................................................................................................................................... 35 3.3.13 Power Recovery .............................................................................................................................................................. 35 5
Intel® Server System R1000WF Product Family Technical Product Specification
3.3.14 Voltage Interruptions ................................................................................................................................................... 35 3.3.15 Protection Circuits ......................................................................................................................................................... 35 3.3.16 Power Supply Status LED ........................................................................................................................................... 36 3.4 DC Power Supply Input Specifications (iPC – AXX750DCCRPS) ................................................................ 36 3.4.1 DC Input Voltage ............................................................................................................................................................ 36 3.4.2 DC Input Fuse................................................................................................................................................................... 37 3.4.3 DC Inrush Current .......................................................................................................................................................... 37 3.4.4 DC Input Under Voltage .............................................................................................................................................. 37 3.4.5 DC Holdup Time and Dropout .................................................................................................................................. 37 3.4.6 DC Line Surge Voltages (Line Transients) ............................................................................................................ 37 3.4.7 Susceptibility Requirements...................................................................................................................................... 37 3.4.8 Protection Circuits ......................................................................................................................................................... 38 3.5 Cold Redundancy Support ......................................................................................................................................... 39 3.5.1 Powering on Cold Standby Supplies to Maintain Best Efficiency .............................................................. 39 3.5.2 Powering on Cold Standby Supplies during a Fault or Over Current Condition ................................. 40 3.5.3 BMC Requirements ........................................................................................................................................................ 40 3.5.4 Power Supply Turn On Function ............................................................................................................................. 40 3.6 Closed Loop System Throttling (CLST) ................................................................................................................. 40 3.7 Smart Ride Through (SmaRT) ................................................................................................................................... 40 3.8 Server Board Power Connectors ............................................................................................................................. 41 3.8.1 Power Supply Module Card Edge Connector ..................................................................................................... 41 3.8.2 Hot Swap Backplane Power Connector ................................................................................................................ 42 3.8.3 Peripheral Power Connector ..................................................................................................................................... 42 4. Thermal Management ............................................................................................................................................. 43 4.1 4.1.1 4.2 4.2.1 Thermal Operation and Configuration Requirements .................................................................................... 44 Memory Slot Population Requirements ............................................................................................................... 44 Thermal Management Overview.............................................................................................................................. 46 Fan Speed Control ......................................................................................................................................................... 46 4.3 System Fans ..................................................................................................................................................................... 49 4.4 Power Supply Module Fans ....................................................................................................................................... 51 4.5 FRUSDR Utility ................................................................................................................................................................. 51 5. Drive Bay Options ..................................................................................................................................................... 52 5.1 Hot Swap Drive Carriers .............................................................................................................................................. 52 5.2 Hot Swap Backplane Support ................................................................................................................................... 56 5.2.1 SGPIO Functionality ...................................................................................................................................................... 57 5.2.2 I2C Functionality ............................................................................................................................................................. 57 5.3 4 x 3.5” Drive SATA/SAS Hot-Swap Backplane ................................................................................................. 57 5.4 8 x 2.5” Drive SATA / SAS / NVMe* Combo Backplane .................................................................................. 58 6. Storage Controller Options Overview ................................................................................................................. 60 6.1 6.1.1 6.2 6
Onboard SATA Support .............................................................................................................................................. 60 Staggered Disk Spin-Up .............................................................................................................................................. 62 Onboard SATA Software RAID support ................................................................................................................ 62 Intel® Server System R1000WF Product Family Technical Product Specification
6.2.1 Intel® Rapid Storage Technology (RSTe) 5.0 ...................................................................................................... 63 6.2.2 Intel® Embedded Server RAID Technology 2 (ESRT2) 1.60 for SATA ...................................................... 63 6.3 6.3.1 6.4 M.2 SSD Support ............................................................................................................................................................ 65 Embedded RAID Support ........................................................................................................................................... 65 PCIe NVMe* Drive Support ......................................................................................................................................... 66 6.4.1 Onboard PCIe* OCuLink* Connectors ................................................................................................................... 66 6.4.2 Intel® Volume Management Device (Intel® VMD) for NVMe ......................................................................... 66 6.4.3 Intel® Virtual RAID on Chip (Intel® VROC) For NVMe ....................................................................................... 69 6.4.4 NVMe* Drive Population Rules for Intel® VROC ................................................................................................ 71 6.5 6.5.1 Intel® Integrated RAID Module Support................................................................................................................ 74 Intel® RAID Maintenance Free Backup Unit (RMFBU) Support .................................................................... 75 7. Front I/O Panel and Control Panel Overview ..................................................................................................... 77 7.1 I/O Panel Features ......................................................................................................................................................... 77 7.2 Control Panel Features ................................................................................................................................................ 77 8. PCIe* Riser Card Support ........................................................................................................................................ 80 9. OCP* Compatible Intel Ethernet Network Adapter Support .......................................................................... 82 10. Basic and Advanced Server Management Features .......................................................................................... 83 10.1 Dedicated Management Port .................................................................................................................................... 84 10.2 Embedded Web Server................................................................................................................................................ 85 10.3 Advanced Management Feature Support (Intel® RMM4 Lite) ...................................................................... 86 10.3.1 Keyboard, Video, Mouse (KVM) Redirection ....................................................................................................... 87 10.3.2 Remote Console ............................................................................................................................................................. 87 10.3.3 Performance ..................................................................................................................................................................... 88 10.3.4 Availability ......................................................................................................................................................................... 88 10.3.5 Security ............................................................................................................................................................................... 88 10.3.6 Usage ................................................................................................................................................................................... 88 10.3.7 Force-enter BIOS Setup .............................................................................................................................................. 88 10.3.8 Media Redirection .......................................................................................................................................................... 88 Appendix A. Integration and Usage Tips................................................................................................................ 90 Appendix B. POST Code Diagnostic LED Decoder ............................................................................................... 91 Appendix C. POST Code Errors ................................................................................................................................ 98 C.1. POST Error Beep Codes ........................................................................................................................................... 104 Appendix D. System Configuration Table for Thermal Compatibility........................................................... 105 Appendix E. System Cable Routing Diagrams .................................................................................................... 113 Appendix F. Statement of Volatility...................................................................................................................... 115 Glossary ........................................................................................................................................................................... 117 7
Intel® Server System R1000WF Product Family Technical Product Specification
List of Figures
Table 1. Reference Documents ........................................................................................................................................................... 12 Table 2. Intel® Server Board S2600WF Product Family Feature Set ................................................................................... 14 Table 3. Intel® Server System R1000WF Product Family Feature Set ................................................................................ 16 Table 4. System Environmental Limits Summary........................................................................................................................ 27 Table 5. Intel Product Weight Information..................................................................................................................................... 28 Table 6. 1100 Watt AC Power Supply Efficiency (80 Plus Platinum) .................................................................................. 30 Table 7. 750 Watt DC Power Supply Efficiency (80 Plus Gold).............................................................................................. 30 Table 8. AC Power Cord Specifications ............................................................................................................................................ 31 Table 9. DC Power Cable Connector Pin-out ................................................................................................................................ 32 Table 10. Power Factor Requirements ............................................................................................................................................. 32 Table 11. AC Input Voltage Range – 1100W Power Supply.................................................................................................... 33 Table 12. AC Line Holdup Time – 1100W Power Supply ......................................................................................................... 33 Table 13. AC Line Sag Transient Performance ............................................................................................................................. 34 Table 14. AC Line Surge Transient Performance ......................................................................................................................... 34 Table 15. Performance Criteria ........................................................................................................................................................... 34 Table 16. Over Current Protection – 1100 Watt Power Supply ............................................................................................ 35 Table 17. Over Voltage Protection (OVP) Limits – 1100 W Power Supply ....................................................................... 36 Table 18. LED Indicators ........................................................................................................................................................................ 36 Table 19. DC Input Rating ...................................................................................................................................................................... 36 Table 20. Line Voltage Transient Limits .......................................................................................................................................... 37 Table 21. Susceptibility Requirements ............................................................................................................................................ 38 Table 22. Over Current Protection – 750 Watt Power Supply ............................................................................................... 38 Table 23. Over Voltage Protection Limits – 750 Watt Power Supply ................................................................................. 39 Table 24. Load Share Threshold for Activating Supplies Example ................................................................................. 39 Table 25. Power Supply Module Output Power Connector Pin-out ................................................................................... 41 Table 26. Hot Swap Backplane Power Connector Pin-out (“HSBP PWR”) ........................................................................ 42 Table 27. Peripheral Drive Power Connector Pin-out (“Peripheral PWR”) ....................................................................... 42 Table 28. System Volumetric Air Flow ............................................................................................................................................. 43 Table 29. System Fan Connector Pin-out ....................................................................................................................................... 51 Table 30. Amber Drive Status LED States ....................................................................................................................................... 55 Table 31. Green Drive Activity LED States ...................................................................................................................................... 55 Table 32. PCIe SSD Drive Status LED States (VROC).................................................................................................................. 55 Table 33. SATA and sSATA Controller Feature Support .......................................................................................................... 61 Table 34. SATA and sSATA Controller BIOS Utility Setup Options ..................................................................................... 61 Table 35. CPU - PCIe* Port Routing ................................................................................................................................................... 68 Table 36. Intel® VROC Upgrade Key Options ................................................................................................................................ 70 Table 37. System Status LED State Definitions ............................................................................................................................ 78 Table 38. Power/Sleep LED Functional States ............................................................................................................................. 79 Table 39. Riser Slot #1 & #2 – PCIe* Root Port Mapping ......................................................................................................... 80 Table 40. Supported Intel® OCP Modules ...................................................................................................................................... 82 8
Intel® Server System R1000WF Product Family Technical Product Specification
Table 41. Intel® Remote Management Module 4 (RMM4) Options ...................................................................................... 83 Table 42. Basic and Advanced Server Management Features Overview ........................................................................... 83 Table 43. POST Progress Code LED Example ............................................................................................................................... 91 Table 44. MRC Progress Codes ........................................................................................................................................................... 92 Table 45. MRC Fatal Error Codes ........................................................................................................................................................ 93 Table 46. POST Progress Codes ......................................................................................................................................................... 94 Table 47. POST Error Messages and Handling ............................................................................................................................. 99 Table 48. POST Error Beep Codes .................................................................................................................................................. 104 Table 49. Integrated BMC Beep Codes ......................................................................................................................................... 104 Table 50.
Intel® Server Board S2600WFT (iPN - H48104-XXX) ................................................................................... 116 Table 51. 1U 1 Slot PCIe* Riser Card (iPN – H39531-xxx)..................................................................................................... 116 Table 52. Front Panel Board (iPN – H29366-xxx) ..................................................................................................................... 116 Table 53. 1U 4 x 3.5” Hot Swap Back Plane option (iPN – G97162-XXX) ...................................................................... 116 Table 54. 1U 8 x 2.5” SAS Hot Swap Back Plane option (iPN – H88382-XXX) ............................................................. 116 Table 55. Intel® Remote Management Module Lite Accessory Option (iPC – AXXRMM4LITE) ............................. 116 9
Intel® Server System R1000WF Product Family Technical Product Specification
List of Tables
Table 1. Reference Documents ........................................................................................................................................................... 12 Table 2. Intel® Server Board S2600WF Product Family Feature Set ................................................................................... 14 Table 3. Intel® Server System R1000WF Product Family Feature Set ................................................................................ 16 Table 4. System Environmental Limits Summary........................................................................................................................ 27 Table 5. Intel Product Weight Information..................................................................................................................................... 28 Table 6. 1100 Watt AC Power Supply Efficiency (80 Plus Platinum) .................................................................................. 30 Table 7. 750 Watt DC Power Supply Efficiency (80 Plus Gold).............................................................................................. 30 Table 8. AC Power Cord Specifications ............................................................................................................................................ 31 Table 9. DC Power Cable Connector Pin-out ................................................................................................................................ 32 Table 10. Power Factor Requirements ............................................................................................................................................. 32 Table 11. AC Input Voltage Range – 1100W Power Supply.................................................................................................... 33 Table 12. AC Line Holdup Time – 1100W Power Supply ......................................................................................................... 33 Table 13. AC Line Sag Transient Performance ............................................................................................................................. 34 Table 14. AC Line Surge Transient Performance ......................................................................................................................... 34 Table 15. Performance Criteria ........................................................................................................................................................... 34 Table 16. Over Current Protection – 1100 Watt Power Supply ............................................................................................ 35 Table 17. Over Voltage Protection (OVP) Limits – 1100 W Power Supply ....................................................................... 36 Table 18. LED Indicators ........................................................................................................................................................................ 36 Table 19. DC Input Rating ...................................................................................................................................................................... 36 Table 20. Line Voltage Transient Limits .......................................................................................................................................... 37 Table 21. Susceptibility Requirements ............................................................................................................................................ 38 Table 22. Over Current Protection – 750 Watt Power Supply ............................................................................................... 38 Table 23. Over Voltage Protection Limits – 750 Watt Power Supply ................................................................................. 39 Table 24. Load Share Threshold for Activating Supplies Example ................................................................................. 39 Table 25. Power Supply Module Output Power Connector Pin-out ................................................................................... 41 Table 26. Hot Swap Backplane Power Connector Pin-out (“HSBP PWR”) ........................................................................ 42 Table 27. Peripheral Drive Power Connector Pin-out (“Peripheral PWR”) ....................................................................... 42 Table 28. System Volumetric Air Flow ............................................................................................................................................. 43 Table 29. System Fan Connector Pin-out ....................................................................................................................................... 51 Table 30. Amber Drive Status LED States ....................................................................................................................................... 55 Table 31. Green Drive Activity LED States ...................................................................................................................................... 55 Table 32. PCIe SSD Drive Status LED States (VROC).................................................................................................................. 55 Table 33. SATA and sSATA Controller Feature Support .......................................................................................................... 61 Table 34. SATA and sSATA Controller BIOS Utility Setup Options ..................................................................................... 61 Table 35. CPU - PCIe* Port Routing ................................................................................................................................................... 68 Table 36. Intel® VROC Upgrade Key Options ................................................................................................................................ 70 Table 37. System Status LED State Definitions ............................................................................................................................ 78 Table 38. Power/Sleep LED Functional States ............................................................................................................................. 79 Table 39. Riser Slot #1 & #2 – PCIe* Root Port Mapping ......................................................................................................... 80 Table 40. Supported Intel® OCP Modules ...................................................................................................................................... 82 10
Intel® Server System R1000WF Product Family Technical Product Specification
Table 41. Intel® Remote Management Module 4 (RMM4) Options ...................................................................................... 83 Table 42. Basic and Advanced Server Management Features Overview ........................................................................... 83 Table 43. POST Progress Code LED Example ............................................................................................................................... 91 Table 44. MRC Progress Codes ........................................................................................................................................................... 92 Table 45. MRC Fatal Error Codes ........................................................................................................................................................ 93 Table 46. POST Progress Codes ......................................................................................................................................................... 94 Table 47. POST Error Messages and Handling ............................................................................................................................. 99 Table 48. POST Error Beep Codes .................................................................................................................................................. 104 Table 49. Integrated BMC Beep Codes ......................................................................................................................................... 104 Table 50.
Intel® Server Board S2600WFT (iPN - H48104-XXX) ................................................................................... 116 Table 51. 1U 1 Slot PCIe* Riser Card (iPN – H39531-xxx)..................................................................................................... 116 Table 52. Front Panel Board (iPN – H29366-xxx) ..................................................................................................................... 116 Table 53. 1U 4 x 3.5” Hot Swap Back Plane option (iPN – G97162-XXX) ...................................................................... 116 Table 54. 1U 8 x 2.5” SAS Hot Swap Back Plane option (iPN – H88382-XXX) ............................................................. 116 Table 55. Intel® Remote Management Module Lite Accessory Option (iPC – AXXRMM4LITE) ............................. 116 11
Intel® Server System R1000WF Product Family Technical Product Specification
1.
Introduction
This Technical Product Specification (TPS) provides system level information for the Intel® Server System
R1000WF product family.
This document describes the embedded functionality and available features of the integrated server system
which includes: the chassis layout, system boards, power subsystem, cooling subsystem, storage subsystem
options, and available installable options. Note that some system features are provided as configurable
options and may not be included standard in every system configuration offered. Please reference the Intel®
Server Board S2600WF Product Family Configuration Guide for a list of configured options for all system
SKUs made available.
For more additional product information, the documents listed in Table 1 should also be referenced.
Table 1. Reference Documents
Document Title
Intel® Server Board S2600WF Product Family Technical Product Specification
Document Classification
Public
Intel® Server S2600WF Product Family Configuration Guide
Public
Intel® Server System R1000WF Product Family System Integration and Service Guide
Public
Intel® Server S2600WF Product Family Power Budget & Thermal Configuration Tool
Public
Intel® Servers System BMC Firmware EPS for Intel® Xeon® processor Scalable Family
Intel Confidential
Intel® Server System BIOS EPS for Intel® Xeon® processor Scalable Family
Intel Confidential
Intel® Chipset C62X Product Family External Design Specification
Intel Confidential
Intel® Ethernet Connection X557-AT2 Product Brief
Public
Advanced Configuration and Power Interface Specification, Revision 3.0,
http://www.acpi.info/.
Public
Intelligent Platform Management Interface Specification, Version 2.0. 2004.
Public
Intelligent Platform Management Bus Communications Protocol Specification, Version 1.0.
1998
Public
Platform Support for Serial-over-LAN (SOL), TMode, and Terminal Mode External Architecture
Specification, Version 1.1, 02/01/02
Public
Intel® Remote Management Module User’s Guide, Intel Corporation.
Public
Alert Standard Format (ASF) Specification, Version 2.0, 23 April 2003, ©2000-2003,
Distributed Management Task Force, Inc., http://www.dmtf.org.
Public
SmaRT & CLST Architecture on Intel Systems and Power Supplies Specification
Public
Intel® Remote Management Module 4 Technical Product Specification
Public
Intel® Remote Management Module 4 and Integrated BMC Web Console Users Guide
Public
EPS and EDS documents are made available under NDA with Intel and must be ordered through your local
Intel representative.
12
Intel® Server System R1000WF Product Family Technical Product Specification
1.1
Document Outline
This document is divided into the following chapters:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Chapter 1 – Introduction
Chapter 2 – Product Family Overview
Chapter 3 – System Power
Chapter 4 – Thermal Management
Chapter 5 – System Storage and Peripherals Drive Bay Overview
Chapter 6 – Storage Controller Options Overview
Chapter 7 – Front Control Panel and I/O Panel Overview
Chapter 8 – PCIe* Riser Card Support
Chapter 9 – Intel® I/O Module Support
Chapter 10 – Basic and Advanced Server Management Features
Appendix A – Integration and Usage Tips
Appendix B – POST Code Diagnostic LED Decoder
Appendix C – Post Code Errors
Appendix D – System Configuration Tables for Thermal Compatibility
Appendix E – System Cable Routing Diagrams
Glossary
1.2
Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density Very Large
Scale Integration (VLSI) and power delivery components that need adequate airflow to cool. Intel ensures
through its own chassis development and testing that when Intel server building blocks are used together,
the fully integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel-developed server building blocks to
consult vendor datasheets and operating parameters to determine the amount of airflow required for their
specific application and environmental conditions. Intel Corporation cannot be held responsible if
components fail or the server board does not operate correctly when used outside any of their published
operating or non-operating limits.
1.3
Product Errata
Shipping product may have features or functionality that may deviate from published specifications. These
deviations are generally discovered after the product has gone into formal production. Intel terms these
deviations as product Errata. Known product Errata will be published in the Monthly Specification Update for
the given product family which can be downloaded from the following Intel web site:
http://www.intel.com/support
13
Intel® Server System R1000WF Product Family Technical Product Specification
2.
Server System Family Overview
The 1U server platforms within the Intel® Server System R1000WF product family offer a variety of system
options to meet varied configuration requirements of high-density, high-performance computing
environments.
This chapter provides a high-level overview of the system features and available options supported in
different system models within this product family. Greater detail for each major sub-system, feature or
option is provided in following chapters.
Each building block option or integrated system within this product family is configured around the following
Intel server board: Intel® Server Board S2600WF product family.
The following table identifies the feature set of each supported server board.
Note: Not all server board features identified in Table 2 will be supported in the 1U chassis.
specific 1U system features.
See Table 2 for
Table 2. Intel® Server Board S2600WF Product Family Feature Set
Intel® Server Board S2600WF Product Family
Feature
S2600WFT
S2600WF0
 Two LGA3647-0 (Socket P) processor sockets
 Support for one or two Intel® Xeon® processor Scalable family (Platinum, Gold, Silver, and Bronze)
Processor Support
o
Previous generation Intel® Xeon® processors are not supported
 Maximum supported Thermal Design Power (TDP) of up to 205W (Board Only)
Note: Intel Server Systems based on this server board family may support a lower maximum Thermal Design
Power (TDP). See appropriate Intel System TPS for max supported TDP
 24 Total DIMM slots (12 DIMMs per processor)
o
6 Memory Channels per processor / 2 DIMMs per Channel
 Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)
Memory
 Memory Capacity
o
Up to 1.5TB for Gold and Platinum CPUs; Up to 768GB for Silver and Bronze CPUs
 Memory data transfer rates:
o

Intel® Chipset
Intel® Quick Assist
Technology (QAT)
Intel® Omni-Path
Fabric Support
Onboard LAN
OCP Module Support

iPC = Intel Product
Code
Intel® Integrated SAS
Module Support
Onboard PCIe* NVMe
Support
14

Up to 2666 MT/s @ 1 DPC and 2 DPC (Processor SKU Dependent)
DDR4 standard voltage of 1.2V
Intel® C624 Chipset
No
DPC = DIMMs Per Channel
Intel® C624 Chipset
No
Yes
Yes
Dual Port RJ45 10GbE
No
iPC 557T2OCPG1P5 – Dual Port 10Gb RJ45
iPC 527DA2OCPG1P5– Dual Port SFP+
Yes
4 – PCIe OCuLink Connectors
Intel® VMD Support
Intel® RSTe VROC Support – Acc. Option




iPC I357T4OCPG1P5 – Quad Port 1Gb RJ45
iPC X527DA4OCPG1P5 – Quad Port SFP+
iPC X557T2OCPG1P5 – Dual
Port 10Gb RJ45
iPC X527DA2OCPG1P5 – Dual Port SFP+
Yes
4 – PCIe OCuLink Connectors
Intel® VMD Support
Intel® RSTe VROC Support – Acc. Option
Intel® Server System R1000WF Product Family Technical Product Specification
Intel® Server Board S2600WF Product Family
Feature
S2600WFT
S2600WF0
 12 x SATA 6Gbps ports (6Gb/s, 3 Gb/s and 1.5Gb/s transfer rates are supported)
Onboard SATA
Support
o
Two single port 7-pin SATA connectors
o
Two M.2 connectors – SATA / PCIe*
o
Two 4-port mini-SAS HD (SFF-8643) connectors
 Embedded SATA Software RAID
o
Intel® Rapid Storage RAID Technology (RSTe) 5.0
o
Intel® Embedded Server RAID Technology 2 (ESRT2) 1.60 with optional RAID 5 key support
o
NOTE: ESRT2 is only supported on S2600WFT and S2600WF0 boards
Concurrent support for up to three riser cards
Riser Card Support

Riser #1 – PCIe* 3.0 x24 (CPU1 x16, CPU2 x8) – 2 and 3 slot riser card options available

Riser #2 – PCIe* 3.0 x24 (CPU2 x24) – 2 and 3 slot riser card options available

Riser #3 (2U systems only) – PCIe* 3.0 (CPU 2 x12) – 2 slot riser card available
 Integrated 2D Video Controller
Video
 16MB of DDR4 Video Memory
 One DB-15 External Connector
 One 14-Pin Internal connector for optional Front Panel Video support
 Three external USB 3.0 ports
USB Support
 One internal Type-A USB 2.0 port
 One internal 20-pin connector for optional 2x USB 3.0 port Front Panel support
 One Internal 10-pin connector for optional 2x USB 2.0 port Front Panel support
Serial Port Support
 One external RJ-45 Serial-A port connector
 One internal DH-10 Serial-B port header for optional front or rear serial port support
 Integrated Baseboard Management Controller, IPMI 2.0 compliant
 Support for Intel® Server Management Software
Server Management
 Onboard dedicated RJ45 management port
 Support for Advanced Server Management features via an Intel® Remote Management Module 4 Lite
Accessory Option (iPC – AXXRMM4LITE2)
Security
 Intel®
Trusted Platform Module 2.0 (Rest of World) – iPC- AXXTPMENC8 (Accessory Option)
 Intel®
Trusted Platform Module 2.0 (China Version) – iPC- AXXTPMCHNE8 (Accessory Option)
 Six System fans supported in two different connector formats hot swap (2U) and cabled (1U)
System Fan Support
o
Six 10-pin managed system fan headers (Sys_Fan 1-6) – Used for 1U system configuration
o
Six 6-pin hot swap capable managed system fan connectors (Sys_Fan 1-6) – Used for 2U system
Configuration
15
Intel® Server System R1000WF Product Family Technical Product Specification
The following table identifies system level features associated with the Intel® Server System R1000WF
product family.
Table 3. Intel® Server System R1000WF Product Family Feature Set
Feature
Description
Chassis Type
1U Rack Mount Chassis
Server Board
Intel® Server Board S2600WF product family
Maximum Supported Processor
Thermal Design Power (TDP)
Up to 165 Watts

DB-15 Video connectors
o
External I/O Connections
Internal I/O Connectors /
Headers
System Fans
Front and Back

RJ-45 Serial Port A connector on back panel

Dual RJ-45 Network Interface connectors on back panel – (S2600WFT based systems only)

Dedicated RJ-45 server management port on back panel

Three USB 3.0 connectors on back panel

Two USB 3.0 connectors on front panel
One Type-A USB 2.0 connector
One DH-10 Serial Port B connector
Six managed 40mm dual rotor system fans
One power supply fan for each installed power supply module
Support for two riser cards:
Riser Card Support

Riser #1 – PCIe* 3.0 x24

Riser #2 – PCIe* 3.0 x24
With two riser cards installed, up to 2 possible add-in cards can be supported:
One x16 PCIe* 3.0 Add-in card slot per riser card
2 Full Height / Half Length add-in cards via Risers #1 and #2
Power Supply Module options:
Power Supply

AC 1100W Platinum

DC 750W Gold
The server system can support 1 or 2 installed power supply modules, with support for the
following power configurations: 1+0 Non-Redundant, 1+1 Redundant, and 2+0 Combined Power
Drive Support
R1304WFxxx – 4 x 3.5” hot swap drive bays + SAS/SATA backplane
R1208WFxxx – 8 x 2.5” hot swap drive bays + SAS/SATA/NVMe combo backplane
A1UFULLRAIL – Tool-less rack mount rail kit – 780mm max travel length
Supported Rack Mount Kit
Accessory Options
A1USHRTRAIL – Tool-less rack mount rail kit – 780mm max travel length – No CMA Support
AXXELVRAIL – Enhanced value rack mount rail kit – 424mm max travel length
AXX1U2UCMA – Cable Management Arm – (*supported with A1UFULLRAIL only)
AXX2POSTBRCKT – 2-post fixed mount bracket kit
16
Intel® Server System R1000WF Product Family Technical Product Specification
2.1
System Features Overview
Figure 1. System Components Overview
Figure 2. Top Cover Features
17
Intel® Server System R1000WF Product Family Technical Product Specification
2.2
Server Board Architecture
Figure 3 . Server Board Architecture
18
Intel® Server System R1000WF Product Family Technical Product Specification
2.3
Server Board Features Overview
The following illustration provides a general overview of the server board, identifying key feature and
component locations. Please refer to Intel® Server Board S2600WF Technical Product Specification for more
information.
Note: Intel® Server Board S2600WFT shown. Some features may not be present on Intel® Server Boards
S2600WF0 and/or S2600WFQ.
Figure 4. Server Board Features
19
Intel® Server System R1000WF Product Family Technical Product Specification
The server board includes several LEDs to identify system status and / or indicate a component fault.
following illustrations define each Diagnostic LED and identify their location.
Figure 5. Intel® Light Guided Diagnostic LED Identification
20
The
Intel® Server System R1000WF Product Family Technical Product Specification
Figure 6. Intel® Light Guided Diagnostics – DIMM Fault LEDs
Figure 7. System Reset and Configuration Jumpers
21
Intel® Server System R1000WF Product Family Technical Product Specification
2.4
Back Panel Features
PCIe* Riser #2
Power Supply
#1
Power Supply
#2
NIC
NIC
#2
#1
(S2600WFT
Only)
Video Serial A
3x
RJ45 USB 3.0
PCIe* Riser #1
Management
Port
Figure 8. Back Panel Feature Identification
2.5
Front Control Panel
Figure 9. Front Control Panel Options
2.6
Front Drive Bay Options
Figure 10. 3.5" Drive Bay – 4 Drive Configuration (Model R1304WFxxx)
Figure 11. 2.5" Drive Bay – 8 Drive Configuration (Model R1208WFxxx)
22
OCP
Module Bay
Intel® Server System R1000WF Product Family Technical Product Specification
2.7
Locking Front Bezel Support
The Intel 1U chassis includes features designed into the rack handles and front drive bay by to support a
locking front bezel.
Note: Intel will not offer a front bezel accessory option. OEMs looking to develop a locking front bezel can
obtain necessary CAD files of the chassis from Intel to aid with front bezel development. Contact your local
Intel representative for additional information.
Figure 12. Concept Reference Design - Front Bezel Installation
2.8
2.8.1
System Dimensions
Chassis Dimensions
1.7”
43.2 mm
19”
482.6mm
Figure 13. Chassis Dimensions
23
Intel® Server System R1000WF Product Family Technical Product Specification
2.8.2
Label Emboss Dimensions
Figure 14. Label Emboss Dimensions
2.8.3
Pull-out Tab Label Emboss Dimensions
46mm x 26mm
Figure 15. Pull-out Tab Label Emboss Dimensions
24
Intel® Server System R1000WF Product Family Technical Product Specification
2.9
System Cable Routing Channels
The 1U system provides cable routing channels along each chassis sidewall. No cables should be routed
directly in front of the system fans or through the center of the server board between the memory slots and
CPU sockets. The system fan assembly must be removed before routing cables.
Figure 16. System Cable Routing Channels
25
Intel® Server System R1000WF Product Family Technical Product Specification
2.10 Available Rack and Cabinet Mounting Kit Options
Advisory Note – Available rack and cabinet mounting kits are not designed to support shipment of the
server system while installed in a rack. If you choose to do so, Intel advises you verify your shipping
configuration with appropriate shock and vibration testing, before shipment. Intel does not perform shipping
tests which cover the complex combination of unique rack offerings and custom packaging options.
Caution: Exceeding the rail kit’s specified maximum weight limit or misalignment of the server in the rack
may result in failure of the rack rails, resulting in damage to the system or personal injury. Two people or the
use of a mechanical assist tool to install and align the server into the rack is highly recommended.
•
AXXELVRAIL – Enhanced Value Rack Mount Rail Kit
o 1U, 2U, 4U compatible
o Tool-less chassis attach
o Tools required to attach rails to rack
o Rack installation length adjustment: 610mm ~ 765mm
o 424mm travel distance (2/3 system extension from rack)
o 130 lbs. (59 Kgs) maximum supported weight
•
A1UFULLRAIL – Premium Rack Mount Rail Kit
o 1U compatible only
o Tool-less installation
o 780mm travel distance (Full system extension from rack)
o 39 lbs. (18 Kgs) maximum supported weight
o Support for Cable Management Arm (CMA) AXX1U2UCMA
•
A1USHRTRAIL – Premium Rack Mount Rail Kit
o 1U compatible only
o Tool-less installation
o 780mm travel distance (Full system extension from rack)
o 39 lbs. (18 Kgs) maximum supported weight
o No Cable Management Arm support
•
AXX2POSTBRCKT – 2-Post Fixed Mount Bracket Kit
o 1U and 2U compatible
o Tools required to attach components to rack
•
AXX1U2UCMA – Cable Management Arm
o Support for Premium Rack Mount Kit A1UFULLRAIL only
26
Intel® Server System R1000WF Product Family Technical Product Specification
2.11 System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 4. System Environmental Limits Summary
Parameter
Temperature
Limits
Operating
ASHRAE Class A2 – Continuous Operation. 10º C to 35º C (50º F to 95º F) with the
maximum rate of change not to exceed 10°C per hour
ASHRAE Class A3 – Includes operation up to 40C for up to 900 hours per year.
ASHRAE Class A4 – Includes operation up to 45C for up to 90 hours per year.
Shipping
-40º C to 70º C (-40º F to 158º F)
Altitude
Operating
Support operation up to 3050m with ASHRAE class de-ratings.
Humidity
Shipping
50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures from
25° C to 35° C)
Shock
Operating
Half sine, 2g, 11 mSec
Unpackaged
Trapezoidal, 25 g, velocity change is based on packaged weight
Packaged
ISTA (International Safe Transit Association) Test Procedure 3A 2008
Unpackaged
5 Hz to 500 Hz 2.20 g RMS random
Packaged
ISTA (International Safe Transit Association) Test Procedure 3A 2008
Voltage
90 Hz to 132 V and 180 V to 264 V
Frequency
47 Hz to 63 Hz
Source Interrupt
No loss of data for power line drop-out of 12 mSec
Surge Nonoperating and
operating
Unidirectional
Line to earth Only
AC Leads
2.0 kV
I/O Leads
1.0 kV
DC Leads
0.5 kV
Vibration
AC-DC
ESD
Acoustics
Sound Power
Measured
Air Discharged
12.0 kV
Contact Discharge
8.0 kV
Power in Watts
<300 W
Servers/Rack Mount
Sound Power Level
(in BA)
7.0
≥300 W
≥600 W
7.0
7.0
≥1000 W
7.0
See Appendix D in this document or the Intel® Server Board S2600WF Product Family Power Budget and
Thermal Configuration Tool for system configuration support limits.
27
Intel® Server System R1000WF Product Family Technical Product Specification
2.12 System Packaging
Intel system packaging is designed to provide a fully configured system the necessary protection when
exposed to the rigors of shipment. The packaging was designed and tested to meet International Safe
Transit Association (ISTA) Test Procedure 3A (2008). The packaging was also designed to be re-used for
shipment after system integration has been completed.
The original packaging includes two layers of boxes – an inner box and the outer shipping box and various
protective inner packaging components. The boxes and packaging components are designed to function
together as a protective packaging system. When reused, all of the original packaging material must be
used, including both boxes and each inner packaging component. In addition, all inner packaging
components MUST be reinstalled in the proper location to ensure adequate protection of the system for
subsequent shipment.
Note: The design of the inner packaging components does not prevent improper placement within the
packaging assembly. There is only one correct packaging assembly that will allow the package to meet the
ISTA (International Safe Transit Association) Test Procedure 3A (2008) limits. See the Intel® Server System
R1000WF Product Family System Integration and Service Guide for complete packaging assembly
instructions.
Failure to follow the specified packaging assembly instructions may result in damage to the system during
shipment.
Outer Shipping Box External Dimensions:
Length = 983mm
Breadth = 577mm
Height = 260mm
Inner Box Internal Dimensions:
Length = 956mm
Breadth = 550mm
Height = 202mm
Table 5. Intel Product Weight Information
Product Code
Product Type
Packaged
Gross Weight
Packaged
Gross Weight
Un-packaged
Net Weight
Un-packaged
Net Weight
(Kg)
(Lbs)
(Kg)
(Lbs)
R1304WFXXX
Chassis
12.57
27.65
4.265
9.38
R1208WFXXX
Chassis
13.17
28.97
4.865
10.7
R1304WFXXX
System
20.6
45.32
12.3
27.1
R1208WFXXX
System
21.42
47.12
13.12
28.86
Note: Integrated system weights will vary depending on the final system configuration. For the 1U product
family, a fully integrated un-packaged system can weigh upwards of 40 pounds (18+ Kg).
Reference the Intel® Server S2600WF Product Family Configuration Guide for product weight information
associated with each available product SKU.
28
Intel® Server System R1000WF Product Family Technical Product Specification
3.
System Power
This chapter provides a high level overview of the features and functions related to system power.
3.1
Power Supply Configurations
The server system can have up to two power supply modules installed, supporting the following power
supply configurations: 1+0 (single power supply), 1+1 Redundant Power, and 2+0 Combined Power (nonredundant). 1+1 redundant power and 2+0 combined power configurations are automatically configured
depending on the total power draw of the system. If the total system power draw exceeds the power capacity
of a single power supply module, then power from the second power supply module will be utilized. Should
this occur, power redundancy is lost. In a 2+0 power configuration, total power available may be less than
twice the rated power of the installed power supply modules due to the amount of heat produced with both
supplies providing peak power. Should system thermals exceed programmed limits, platform management
will attempt to keep the system operational. See Closed Loop System Throttling (CLST) later in this chapter,
and Chapter 4 Thermal Management, for details.
Caution: Installing two Power Supply Units with different wattage ratings in a system is not supported. Doing
so will not provide Power Supply Redundancy and will result in multiple errors being logged by the system.
The power supplies are modular, allowing for tool-less insertion and extraction from a bay in the back of the
chassis. When inserted, the card edge connector of the power supply mates blindly to a matching slot
connector on the server board.
Power Supply #1
Power Supply #2
Figure 17. Power Supply Bay
In the event of a power supply failure, redundant 1+1 power supply configurations have support for hotswap extraction and insertion. The AC input is auto-ranging and power factor corrected.
29
Intel® Server System R1000WF Product Family Technical Product Specification
3.2
Power Supply Module Options
There are two power supply options available for this server product family:
-
1100W AC 80 Plus Platinum – iPC AXX1100CRPS
750W DC 80 Plus Gold – iPC AXX750DCCRPS
iPC = Intel product code
3.2.1
Power Supply Module Efficiency
The following tables provide the required minimum efficiency level at various loading conditions. These are
provided at four different load levels: 100%, 50%, 20% and 10%.
The AC power supply efficiency is tested over an AC input voltage range of 115 VAC to 220 VAC.
Table 6. 1100 Watt AC Power Supply Efficiency (80 Plus Platinum)
Loading
100% of maximum
50% of maximum
20% of maximum
10% of maximum
91%
94%
90%
82%
Minimum Efficiency
The DC power supply efficiency is tested with a -53V DC input.
Table 7. 750 Watt DC Power Supply Efficiency (80 Plus Gold)
Loading
100% of maximum
50% of maximum
20% of maximum
10% of maximum
88%
92%
88%
80%
Minimum Efficiency
3.2.2
Power Supply Module Mechanical Overview
1100W AC Power Supply Module / Dual Fans
AC Power Cable Connector
750W DC Power Supply Module
DC Power Cable Connector
Figure 18. Power Supply Module Overview
30
Intel® Server System R1000WF Product Family Technical Product Specification
The physical size of the 1100W AC power supply enclosure is 39mm x 74mm x 185mm. The power supply
includes dual, in-line, 40mm fans, one mounted inside the enclosure, and the other extending outside the
enclosure.
Note: The second fan protrudes from the back of the power supply bay, making the total length 213mm
front to back.
The power supply has a card edge output that interfaces with a 2x25 card edge connector in the system.
Airflow Direction
FCI 2x25 card
edge connector
Retention Latch
10035388-102
B25
B
185mm
74mm
A2
A
2mm
213mm
11mm
Dual 40x40x28mm fans
39mm
8.5mm
Figure 19. 1100W AC Power Supply Module Mechanical Drawing
3.2.3
Power Cord Specification Requirements
The AC power cord used must meet the specification requirements listed in the following table.
Table 8. AC Power Cord Specifications
Cable Type
SJT
Wire Size
16 AWG
Temperature Rating
105ºC
Amperage Rating
13 A
Voltage Rating
125 V
Figure 20. AC Power Cord
The DC power cord used must meet the specification requirements listed in the following tables.
31
Intel® Server System R1000WF Product Family Technical Product Specification
Figure 21. DC Power Cord Specification
Table 9. DC Power Cable Connector Pin-out
Pin
3.3
Definition
1
+ Return
2
Safety Ground
3
- 48V
AC Power Supply Input Specifications
The following sections provide the AC Input Specifications for systems configured with AC power supply
modules.
3.3.1
Power Factor
The power supply meets the power factor requirements stated in the Energy Star* Program Requirements
for Computer Servers. These requirements are stated below.
Table 10. Power Factor Requirements
Output power
10% load
20% load
50% load
100% load
Power factor
> 0.65
> 0.80
> 0.90
> 0.95
Tested at 230Vac, 50Hz and 60Hz and 115VAC, 60Hz.
3.3.2
AC Input Voltage Specification
The power supply operates within all specified limits over the input voltage range listed in Table 10.
Harmonic distortion of up to 10% of the rated line voltage will not cause the power supply to go out of
specified limits. Application of an input voltage below 85VAC will not cause damage to the power supply,
including a blown fuse.
Table 11. AC Input Voltage Range – 1100W Power Supply
1.
2.
3.
32
Parameter
MIN
Rated
VMAX
Voltage (110)
Voltage (220)
Frequency
90 Vrms
180 Vrms
47 Hz
100-127 Vrms
200-240 Vrms
50/60
140 Vrms
264 Vrms
63 Hz
Start-up VAC
Power-off VAC
85VAC +/-4VAC
74VAC +/-5VAC
Maximum input current at low input voltage range shall be measured at 90VAC, at max load.
Maximum input current at high input voltage range shall be measured at 180VAC, at max load.
This requirement is not to be used for determining agency input current markings.
Intel® Server System R1000WF Product Family Technical Product Specification
3.3.3
AC Line Isolation Requirements
The power supply meets all safety agency requirements for dielectric strength. Transformers’ isolation
between primary and secondary windings comply with the 3000Vac (4242Vdc) dielectric strength criteria. If
the working voltage between primary and secondary dictates a higher dielectric strength test voltage the
highest test voltage should be used. In addition, the insulation system complies with reinforced insulation
per safety standard IEC 950. Separation between the primary and secondary circuits, and primary to ground
circuits comply with the IEC 950 spacing requirements.
3.3.4
AC Line Dropout / Holdup
An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any
length of time. During an AC dropout, the power supply meets dynamic voltage regulation requirements. An
AC line dropout of any duration does not cause tripping of control signals or protection circuits. If the AC
dropout lasts longer than the holdup time the power supply should recover and meet all turn on
requirements. The power supply meets the AC dropout requirement over rated AC voltages and frequencies.
A dropout of the AC line for any duration will not cause damage to the power supply.
Table 12. AC Line Holdup Time – 1100W Power Supply
Loading
70%
3.3.4.1
Holdup time
10msec
AC Line 12VSB Holdup
The 12VSB output voltage operates in regulation under its full load (static or dynamic) during an AC dropout
of 70ms min (=12VSB holdup time) whether the power supply is in an ON or OFF state (PSON asserted or deasserted).
3.3.5
AC Line Fuse
The power supply has one single line fuse on the line (Hot) wire of the AC input. The line fusing meets all
safety agency requirements. The input fuse is a slow blow type. AC inrush current does not cause the AC line
fuse to blow under any conditions. All protection circuits in the power supply do not cause the AC fuse to
blow unless a component in the power supply has failed. This includes DC output load short conditions.
3.3.6
AC Inrush
AC line inrush current does not exceed a 55A peak, for up to one-quarter of the AC cycle, after which the
input current is no more than the specified maximum input current. The peak inrush current is less than the
ratings of its critical components including: input fuse, bulk rectifiers, and surge limiting device.
The power supply meets the inrush requirements for any rated AC voltage during turn on at any phase of AC
voltage, during a single cycle AC dropout condition as well as upon recovery after AC dropout of any
duration and over the specified temperature range (Top).
3.3.7
AC Line Transient Specification
AC line transient conditions are defined as “sag” and “surge” conditions. “Sag” conditions are also commonly
referred to as “brownout”, these conditions are defined as the AC line voltage dropping below nominal
voltage conditions. “Surge” refers to conditions when the AC line voltage rises above nominal voltage.
The power supply meets all requirements under the AC line sag and surge conditions listed in Table 12
above and Table 13 below.
33
Intel® Server System R1000WF Product Family Technical Product Specification
Table 13. AC Line Sag Transient Performance
AC Line Sag (10sec interval between each sagging)
Duration
Sag
Operating AC Voltage
Line Frequency
Performance Criteria
0 to 1/2 AC cycle
> 1 AC cycle
50/60Hz
50/60Hz
No loss of function or performance
Loss of function acceptable, self-recoverable
95%
>30%
Nominal AC Voltage ranges
Nominal AC Voltage ranges
Table 14. AC Line Surge Transient Performance
AC Line Surge
Duration
Surge
Operating AC Voltage
Line Frequency
Performance Criteria
Continuous
0 to ½ AC cycle
10%
30%
Nominal AC Voltages
Mid-point of nominal AC Voltages
50/60Hz
50/60Hz
No loss of function or performance
No loss of function or performance
3.3.8
Susceptibility Requirements
The power supply meets the following electrical immunity requirements when connected to a cage with an
external EMI filter which meets the criteria defined in the SSI document EPS Power Supply Specification. For
further information on Intel standards please request a copy of the Intel® Environmental Standards
Handbook.
Table 15. Performance Criteria
Level
A
B
C
3.3.9
Description
The apparatus shall continue to operate as intended. No degradation of performance.
The apparatus shall continue to operate as intended. No degradation of performance beyond spec limits.
Temporary loss of function is allowed provided the function is self-recoverable or can be restored by the
operation of the controls.
Electrostatic Discharge Susceptibility
The power supply complies with the limits defined in EN 55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-2: Edition 1.2: 2001-04 test standard and performance criteria B defined in Annex B of CISPR 24.
3.3.10
Fast Transient/Burst
The power supply complies with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-4: Second edition: 2004-07 test standard and performance criteria B defined in Annex B of CISPR
24.
3.3.11
Radiated Immunity
The power supply complies with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-3: Edition 2.1: 2002-09 test standard and performance criteria A defined in Annex B of CISPR 24.
3.3.12
Surge Immunity
The power supply was tested with the system for immunity to the following for each power supply option:
•
1100W Power Supply – AC Unidirectional wave; 2kV line to ground and 1kV line to line, per EN 55024:
1998/A1: 2001/A2: 2003, EN 61000-4-5: Edition 1.1:2001-04 .
The pass criteria included:
•
•
•
34
No unsafe operation under any condition; all power supply output voltage levels are within proper spec
levels.
No change in operating state or loss of data during and after the test profile.
No component damage under any condition.
Intel® Server System R1000WF Product Family Technical Product Specification
The power supply complies with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-5: Edition 1.1:2001-04 test standard and performance criteria B defined in Annex B of CISPR 24.
3.3.13
Power Recovery
The power supply will recover automatically after an AC power failure.
loss of AC power that exceeds the dropout criteria.
3.3.14
AC power failure is defined to be any
Voltage Interruptions
The power supply complies with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-11: Second Edition: 2004-03 test standard and performance criteria C defined in Annex B of CISPR
24.
3.3.15
Protection Circuits
Protection circuits inside the power supply cause only the power supply’s main outputs to shut down. If the
power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 seconds and a PSON#
cycle HIGH for one second reset the power supply.
3.3.15.1
Over-Current Protection
The power supply has a current limit to prevent the outputs from exceeding the values shown in Table 15
below. If the current limits are exceeded the power supply will shut down and latch off. The latch will be
cleared by toggling the PSON# signal or by an AC power interruption. The power supply will not be damaged
from repeated power cycling in this condition. 12VSB will be auto-recovered after removing Over-Current
Protection limit.
Table 16. Over Current Protection – 1100 Watt Power Supply
Output Voltage
+12V
12VSB
3.3.15.2
Input Voltage Range
90 – 264VAC
Trip Delay
90 – 264VAC
Over Current Limits
120A min; 132A max
50mSec min
2.5A min; 3.5A max
Over-Voltage Protection (OVP)
The power supply over voltage protection is locally sensed. The power supply will shut down and latch off
after an over voltage condition occurs. This latch will be cleared by an AC power interruption. The values are
measured at the output of the power supply’s connectors. The voltage will never exceed the maximum levels
when measured at the power connectors of the power supply connector during any single point of failure.
The voltage does not trip any lower than the minimum levels when measured at the power connector. 12VSB
will be auto-recovered after removing OVP limit.
Table 17. Over Voltage Protection (OVP) Limits – 1100 W Power Supply
Output Voltage
+12V
+12VSB
3.3.15.3
MIN (V)
13.5
13.5
MAX (V)
14.5
14.5
Over-Temperature Protection (OTP)
The power supply is protected against over temperature conditions caused by loss of fan cooling or
excessive ambient temperature. In an OTP condition the PSU will shut down. When the power supply
temperature drops to within specified limits, the power supply will restore power automatically while the
12VSB remains always on. The OTP circuit has a built in margin so that the power supply will not oscillate on
and off due to a temperature recovering condition. The OTP trip level has a minimum of 4C of ambient
temperature margin.
35
Intel® Server System R1000WF Product Family Technical Product Specification
3.3.16
Power Supply Status LED
There is a single bi-color LED to indicate power supply status. The LED operation is defined in the following
table.
Table 18. LED Indicators
Power Supply Condition
Output ON and OK
No AC power to all power supplies
AC present / Only 12VSB on (PS off) or PS in Cold
redundant state
AC cord unplugged or AC power lost; with a second
power supply in parallel still with AC input power.
Power supply warning events where the power supply
continues to operate; high temp, high power, high
current, slow fan.
Power supply critical event causing a shutdown; failure,
OCP, OVP, Fan Fail
Power supply FW updating
3.4
LED State
GREEN
OFF
1Hz Blink, GREEN
AMBER
1Hz Blink, Amber
AMBER
2Hz Blink, GREEN
DC Power Supply Input Specifications (iPC – AXX750DCCRPS)
The following sections provide the DC Input Specifications for systems configured with DC power supply
modules.
Note: Product Safety Regulations pertaining to the use of DC power supplies require that chassis grounding
studs be used for all DC power supply configurations. In the event that chassis grounding studs are not
available on a given server chassis, systems must be configured with two DC power supplies, with each
connected to separate ground wires while the system is operational.
3.4.1
DC Input Voltage
The power supply operates within all specified limits over the following input voltage range.
Table 19. DC Input Rating
Parameter
DC Voltage
Input Current
3.4.2
MIN
-40.5 VDC
24A
Rated
-48VDC/-60VDC
MAX
-75VDC
12.5A
DC Input Fuse
The -48VDC power supply input is fused. The fusing meets all safety agency requirements. DC inrush current
does not cause the fuse to blow under any conditions nor do the protection circuits in the power supply
unless a component in the power supply has failed. This includes DC output load short conditions.
3.4.3
DC Inrush Current
Maximum inrush current from power-on is limited to a level below the surge rating of the input line cable,
input diodes, fuse, and EMI filter components. To allow multiple power cycling events and DC line transient
conditions max I²t value does not exceed 20% of the fuse max rating. Repetitive ON/OFF cycling of the DC
input line voltage should not damage the power supply or cause the input fuse to blow.
3.4.4
DC Input Under Voltage
The power supply contains protection circuitry (under-voltage lock-out) such that the application of an input
voltage below the specified minimum specified, will not cause damage (overstress) to the power supply unit
due to over-heating or other condition.
36
Intel® Server System R1000WF Product Family Technical Product Specification
3.4.5
DC Holdup Time and Dropout
Loading
750W (100%)
Holdup Time
0.2msec
During a DC dropout of 0.2ms or less the power supply meets dynamic voltage regulation requirements for
every rated load condition. A DC line dropout of 0.2ms or less does not cause tripping of control signals or
protection circuits. Repeated every 10 seconds starting at the min input voltage DC line dropout will not
damage the power supply under any specified load conditions. The PWOK signal does not go to a low state
under these conditions. DC dropout transients in excess of 0.2 milliseconds may cause shutdown of the PSU,
but will not damage the power supply. The power supply will recover and meet all turn on requirements for
DC dropouts that last longer than 0.2ms. The power supply meets the DC dropout requirement over rated
DC voltages and output loading conditions.
3.4.6
DC Line Surge Voltages (Line Transients)
The Power Supply tolerates transients in the input DC power line caused by switching or lightning. The
power supply has been tested and is compliant with the requirements of EN61000-4-5: “Electrical Fast
transients / Burst Requirements and Surge Immunity Requirements” for surge withstand capability. The test
voltage surge levels were: 500Vpk for each Line to Primary Earth Ground test (none required between the L1
and L2). The exact description can be found in Intel Environmental Standards Handbook 2001.
Table 20. Line Voltage Transient Limits
Duration
200μs max
3.4.7
Slope/Rate
-48V → -30V w/ +2V/μs
-30V → -48V w/ -2V/μs
Output
Rated DC Voltages
Rated DC Voltages
Performance criteria
No loss of function or performance
No loss of function or performance
Susceptibility Requirements
The power supply meets the following electrical immunity requirements when connected to a cage with an
external EMI filter which meets the criteria defined in the SSI document EPS Power Supply Specification. For
further information on Intel standards please request a copy of the Intel Environmental Standards
Handbook.
Table 21. Susceptibility Requirements
Level
A
B
C
3.4.7.1
Description
The apparatus shall continue to operate as intended. No degradation of performance.
The apparatus shall continue to operate as intended. No degradation of performance
beyond spec limits.
Temporary loss of function is allowed provided the function is self-recoverable or can
be restored by the operation of the controls.
Electrostatic Discharge Susceptibility
The power supply complies within the limits defined in EN 55024: 1998 using the IEC 61000-4-2:1995 test
standard and performance criteria B defined in Annex B of CISPR 24. Limits comply with those specified in
the Intel Environmental Standards Handbook.
3.4.7.2
Fast Transient/Burst
The power supply complies within the limits defined in EN55024: 1998 using the IEC 61000-4-4:1995 test
standard and performance criteria B defined in Annex B of CISPR 24. Limits shall with those specified in the
Intel Environmental Standards Handbook.
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Intel® Server System R1000WF Product Family Technical Product Specification
3.4.7.3
Radiated Immunity
The power supply complies within the limits defined in EN55024: 1998 using the IEC 61000-4-3:1995 test
standard and performance criteria A defined in Annex B of CISPR 24. Limits comply with those specified in
the Intel Environmental Standards Handbook. Additionally, they also comply with field strength
requirements specified in GR 1089 (10V/meter).
3.4.7.4
Surge Immunity
The power supply was tested with the system for immunity, per EN 55024:1998, EN 61000-4-5:1995 and
ANSI C62.45: 1992.
The pass criteria included:
•
•
•
No unsafe operation is allowed under any condition; all power supply output voltage levels to stay within
proper spec levels
No change in operating state or loss of data during and after the test profile
No component damage under any condition.
The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-4-5:1995 test
standard and performance criteria B defined in Annex B of CISPR 24. Limits also comply with those specified
in the Intel Environmental Standards Handbook.
3.4.8
Protection Circuits
Protection circuits inside the power supply will only cause the power supply’s main outputs to shut down. If
the power supply latches off due to a protection circuit tripping, a DC cycle OFF for 15sec and a PSON# cycle
HIGH for 1sec shall be able to reset the power supply.
3.4.8.1
Current Limit (OCP)
The power supply has current limits to prevent the outputs from exceeding the values shown in Table 20
below. If the current limits are exceeded the power supply will shut down and latch off. The latch will be
cleared by toggling the PSON# signal or by a DC power interruption. The power supply will not be damaged
from repeated power cycling in this condition. 12VSB will be auto-recovered after removing OCP limit.
Table 22. Over Current Protection – 750 Watt Power Supply
Output Voltage
+12V
12VSB
3.4.8.2
Input Voltage Range
90 – 264VAC
90 – 264VAC
Over Current Limits
72A min; 78A max
2.5A min; 3.5A max
Over Voltage Protection (OVP)
The power supply over voltage protection shall be locally sensed. The power supply shall shutdown and
latch off after an over voltage condition occurs. This latch shall be cleared by toggling the PSON# signal or
by a DC power interruption. The values are measured at the output of the power supply’s connectors. The
voltage shall never exceed the maximum levels when measured at the power connectors of the power
supply connector during any single point of fail. The voltage shall never trip any lower than the minimum
levels when measured at the power connector. 12VSBwill be auto-recovered after removing OVP limit.
Table 23. Over Voltage Protection Limits – 750 Watt Power Supply
Output Voltage
+12V
+12VSB
3.4.8.3
MIN (V)
13.3
13.3
MAX (V)
14.5
14.5
Over Temperature Protection (OTP)
The power supply is protected against over temperature conditions caused by loss of fan cooling or
excessive ambient temperature. In an OTP condition the PSU will shut down. When the power supply
38
Intel® Server System R1000WF Product Family Technical Product Specification
temperature drops to within specified limits, the power supply will restore power automatically, while the
12VSB remains always on. The OTP circuit has a built in margin so that the power supply will not oscillate on
and off due to a temperature recovering condition. The OTP trip level has a minimum of 4°C of ambient
temperature margin.
3.5
Cold Redundancy Support
The power supplies support cold redundancy allowing them to go into a low-power state (that is, cold
redundant state) in order to provide increased power usage efficiency when system loads are such that both
power supplies are not needed. When the power subsystem is in Cold Redundant mode, only the power
supply needed to support the best power delivery efficiency is ON. Any additional power supplies; including
the redundant power supply, is in Cold Standby state.
Each power supply has an additional signal that is dedicated to supporting Cold Redundancy, CR_BUS. This
signal is a common bus between all power supplies in the system. CR_BUS is asserted when there is a fault in
any power supply or the power supplies output voltage falls below the Vfault threshold. Asserting the
CR_BUS signal causes all power supplies in Cold Standby state to power ON.
Enabling power supplies to maintain optimum efficiency is achieved by looking at the Load Share bus
voltage and comparing it to a programmed voltage level via a PMBus command.
Whenever there is no active power supply on the Cold Redundancy bus driving a HIGH level on the bus all
power supplies are ON, no matter their defined Cold Redundant roll (active or Cold Standby). This
guarantees that incorrect programming of the Cold Redundancy states of the power supply will never cause
the power subsystem to shut down or become over loaded. The default state of the power subsystem is all
power supplies on. There needs to be at least one power supply in Cold Redundant Active state or Standard
Redundant state to allow the Cold Standby state power supplies to go into Cold Standby state.
3.5.1
Powering on Cold Standby Supplies to Maintain Best Efficiency
Power supplies in Cold Standby state monitor the shared voltage level of the load share signal to sense
when it needs to power on. Depending upon which position (1, 2, or 3) the system defines the power supply
to be in, the cold standby configuration will slightly change the load share threshold that the power supply
will power on at.
Table 24. Load Share Threshold for Activating Supplies Example
Enable Threshold for
VCR_ON_EN
Standard
Redundancy
Cold Redundant
Active
Disable Threshold for
VCR_ON_DIS
NA; Ignore dc/dc_ active# signal; power supply is always ON
NA; Ignore dc/dc_ active# signal; power supply is always ON
Cold Standby 1 (02h)
3.2V (40% of max)
3.2V x 0.5 x 0.9 = 1.44V
Cold Standby 2 (03h)
5.0V (62% of max)
5.0V x 0.67 x 0.9 = 3.01V
Cold Standby 3 (04h)
6.7V (84% of max)
6.7V x 0.75 x 0.9 = 4.52V
CR_BUS De-asserted / Asserted
States
OK = High
Fault = Low
OK = High
Fault = Low
OK = Open
Fault = Low
OK = Open
Fault = Low
OK = Open
Fault = Low
Notes:
1.
Maximum load share voltage = 8.0V at 100% of rated output power
2.
These are example load share bus thresholds; for a given power supply, these should be customized to maintain the best
efficiency curve for that specific model.
39
Intel® Server System R1000WF Product Family Technical Product Specification
3.5.2
Powering on Cold Standby Supplies during a Fault or Over Current Condition
When an active power supply asserts its CR_BUS signal (pulling it low), all parallel power supplies in cold
standby mode will power on within 100μsec.
3.5.3
BMC Requirements
The BMC uses the Cold_Redundancy_Config command to define or configure the power supply’s roll in cold
redundancy and to turn on/off cold redundancy.
The BMC schedules a rolling change for which PSU is the Active, Cold Stby1, Cold Stby 2, and Cold Stby 3
power supply. This allows for equal loading across power supplies over their life.
The list below are events that trigger a re-configuration of the power supplies using the
Cold_Redundancy_Config command.
•
•
•
•
AC power ON
PSON power ON
Power Supply Failure
Power supply inserted into system
3.5.4
Power Supply Turn On Function
Powering on and off of the cold standby power supplies is controlled by each PSU sensing the Vshare bus.
Once a power supply turns on after crossing the enable threshold, it lowers its threshold to the disable
threshold. The system defines the “position” of each power supply in the Cold Redundant operation. It will
do this each time the system is powered on, a power supply fails, or a power supply is added to the system.
The system is relied upon to tell each power supply where it resides in the Cold Redundancy scheme.
3.6
Closed Loop System Throttling (CLST)
The server system has support for Closed Loop System Throttling (CLST). CLST prevents the system from
crashing if a power supply module is overloaded or insufficiently cooled. Should system power reach a
pre-programmed power limit or power supply thermal sensor hit the threshold, CLST will throttle system
memory and/or processors to reduce power. System performance will be impacted should this occur.
3.7
Smart Ride Through (SmaRT)
The server system has support for Smart Ride Through Throttling (SmaRT). This feature increases the
reliability for a system operating in a heavy power load condition to remain operational during an AC line
dropout event. See Section 3.3.4, AC Line Dropout / Holdup for power supply hold up time requirements for
AC Line dropout events.
When AC voltage is too low, a fast AC loss detection circuit inside each installed power supply asserts an
SMBALERT# signal to initiate a throttle condition in the system. System throttling reduces the bandwidth to
both system memory and CPUs, which in turn reduces the power load during the AC line drop out event.
3.8
Server Board Power Connectors
The server board provides several connectors to provide power for various system options. The following
sub-sections will provide the pin-out definition and a brief usage description for each.
3.8.1
Power Supply Module Card Edge Connector
Each power supply module has a single, 2x25 card edge output connection that plugs directly into a
matching slot connector on the server board. The connector provides both power and communication
signals to the server board. The following table defines the connector pin-out.
40
Intel® Server System R1000WF Product Family Technical Product Specification
Table 25. Power Supply Module Output Power Connector Pin-out
3.8.2
Pin
Name
Pin
Name
A1
GND
B1
GND
A2
GND
B2
GND
A3
GND
B3
GND
A4
GND
B4
GND
A5
GND
B5
GND
A6
GND
B6
GND
A7
GND
B7
GND
A8
GND
B8
GND
A9
GND
B9
GND
A10
+12V
B10
+12V
A11
+12V
B11
+12V
A12
+12V
B12
+12V
A13
+12V
B13
+12V
A14
+12V
B14
+12V
A15
+12V
B15
+12V
A16
+12V
B16
+12V
A17
+12V
B17
+12V
A18
+12V
B18
+12V
A19
PMBus SDA
B19
A0 (SMBus address)
A20
PMBus SCL
B20
A1 (SMBus address)
A21
PSON
B21
12V stby
A22
SMBAlert#
B22
Cold Redundancy Bus
A23
Return Sense
B23
12V load share bus
A24
+12V remote Sense
B24
No Connect
A25
PWOK
B25
Compatibility Check pin*
Hot Swap Backplane Power Connector
The server board includes one white, 2x6-pin power connector that is cabled to provide power for hot swap
backplanes. On the server board, this connector is labeled “HSBP PWR”. The following table provides the
pin-out for this connector.
Table 26. Hot Swap Backplane Power Connector Pin-out (“HSBP PWR”)
Signal Description
Pin#
Pin#
Signal Description
GROUND
1
7
P12V_240VA3
GROUND
2
8
P12V_240VA3
GROUND
3
9
P12V_240VA2
GROUND
4
10
P12V_240VA2
GROUND
5
11
P12V_240VA1
GROUND
6
12
P12V_240VA1
41
Intel® Server System R1000WF Product Family Technical Product Specification
3.8.3
Peripheral Power Connector
The server board includes one brown, 2x3-pin power connector intended to provide power to optionally
installed peripheral devices. On the server board this connector is labeled “Peripheral PWR”. The following
table provides the pin-out for this connector.
Table 27. Peripheral Drive Power Connector Pin-out (“Peripheral PWR”)
Signal Description
42
Pin#
Pin#
Signal Description
P12V
4
1
P5V
P3V3
5
2
P5V
GROUND
6
3
GROUND
Intel® Server System R1000WF Product Family Technical Product Specification
4.
Thermal Management
The fully integrated system is designed to operate at external ambient temperatures between 10°C and
35°C, with limited excursion based operation up to 45°C, as specified in Table 4. System Environmental
Limits Summary. Working with integrated platform management, several physical features of the system are
designed to move air through the system in a front to back direction, over critical components to prevent
them from overheating and allowing the system to operate at optimum performance.
Figure 22. System Air Flow and Fan Identification
The following tables provide air flow data associated with the different system models within this 1U product
family and are provided for reference purposes only. The data was derived from actual wind tunnel test
methods and measurements using fully configured (worst case) system configurations. Lesser system
configurations may produce slightly different data results. In addition, the CFM data was derived using server
management utilities that utilize platform sensor data and may vary slightly from the data listed in the tables.
Table 28. System Volumetric Air Flow
System Airflow – R1304WFxxxx
System Airflow – R1208WFxxxx
System Fan
PSU Fan
Total Airflow (CFM)
System Fan
PSU Fan
Total Airflow (CFM)
100%
auto
85.6
100%
auto
89.0
80%
auto
67.7
80%
auto
69.6
60%
auto
48.9
60%
auto
50.8
40%
auto
31.6
40%
auto
32.6
20%
auto
13.6
20%
auto
13.8
100%
100%
89.1
100%
100%
92.6
The Intel® Server System R1000WF product family supports short-term, excursion-based, operation up to
45°C (ASHRAE A4) with limited performance impact. The configuration requirements and limitations are
described in the configuration matrix found in Appendix D of this document or in the Intel® Server Board
S2600WF Product Family Power Budget and Thermal Configuration Tool, available as a download online at:
http://www.intel.com/support
43
Intel® Server System R1000WF Product Family Technical Product Specification
The installation and functionality of several physical system components are used to maintain system
thermals. They include six managed 40mm dual rotor system fans, fans integrated into each installed power
supply module, an air duct, populated drive carriers, populated DIMM slots, and installed CPU heats sinks.
Drive carriers can be populated with a storage device (SSD or Hard Disk Drive) or supplied drive blank. In
addition, it is necessary to have specific DIMM slots populated with DIMMs or supplied DIMM blanks. See
Figure 26. System configurations that require population of specific DIMM slots will ship from Intel with
DIMM blanks pre-installed. Pre-installed DIMM blanks should only be removed when installing a memory
module in its place.
4.1
Thermal Operation and Configuration Requirements
To keep the system operating within supported maximum thermal limits, the system must meet the
following operating and configuration guidelines:






The system is designed to sustain operations at an ambient temperature of up to 35°C (ASHRAE Class
A2) with short term excursion based operation up to 45°C (ASHRAE Class A4).
The system can operate up to 40°C (ASHRAE Class A3) for up to 900 hours per year
The system can operate up to 45°C (ASHRAE Class A4) for up to 90 hours per year
System performance may be impacted when operating within the extended operating temperature range
There is no long term system reliability impact when operating at the extended temperature range within
the documented limits.
Specific configuration requirements and limitations are documented in the configuration matrix found in
Appendix D of this document or in the Intel® Server Board S2600WF Product Family Power Budget and
Thermal Configuration Tool, available as a download online at:
http://www.intel.com/support


The CPU-1 processor and CPU heat sink must be installed first. The CPU-2 heat sink must be installed at
all times, with or without a processor installed
Thermally, a system supporting fan redundancy can support the following PCI add-in cards when the
system is operating at a maximum operating ambient temperature of 35°C (ASHRAE Class 2).
4.1.1
-
Add-in cards with a minimum 300 LFM (1.5 m/s) air flow requirement or lower can be installed in
available add-in card slots in Riser Card #1 and Riser Card #2
-
Add-in cards with an air flow requirement greater than 300 LFM cannot be supported in any PCIe
slot on any riser
-
Note: Most PCI add-in cards have minimum air flow requirements of 100 LFM (0.5m/s). Some
high power add-in cards have minimum air flow requirements of 300 LFM (1.5 m/s) or higher.
System integrators should verify PCI add-in card air flow requirements from vendor
specifications when integrating add-in cards into the system.
Memory Slot Population Requirements
System thermal requirements dictate that a specific airflow be maintained over or between critical system
components. To ensure the proper air flow is achieved, specific memory slots must be populated with a
DIMM or factory installed DIMM blank while the system is in operation. The following illustration identifies
the memory slots which must be populated in all 1U system configurations.
44
Intel® Server System R1000WF Product Family Technical Product Specification
Figure 23. DIMM Population Layout
The following memory population rules apply when installing DIMMs:

DIMM population rules require that DIMMs within a channel be populated starting with the BLUE
DIMM slot or DIMM farthest from the processor in a “fill-farthest” approach.

When only one DIMM is used for a given memory channel, it must be populated in the BLUE DIMM
slot (furthest from the CPU).

Mixing of DDR4 DIMM Types (RDIMM, LRDIMM, 3DS RDIMM, 3DS LRDIMM, or NVDIMM) within a
channel socket or across sockets produces a Fatal Error Halt during Memory Initialization.

Mixing DIMMs of different frequencies and latencies is not supported within or across processor
sockets. If a mixed configuration is encountered, the BIOS will attempt to operate at the highest
common frequency and the lowest latency possible.

When populating a Quad-rank DIMM with a Single- or Dual-rank DIMM in the same channel, the
Quad-rank DIMM must be populated farthest from the processor. Intel MRC will check for correct
DIMM placement. A maximum of 8 logical ranks can be used on any one channel, as well as a
maximum of 10 physical ranks loaded on a channel.

In order to install 3 QR LRDIMMs on the same channel, they must be operated with Rank
Multiplication as RM = 2, this will make each LRDIMM appear as a DR DIMM with ranks twice as large.

The memory slots associated with a given processor are unavailable if the corresponding processor
socket is not populated.

A processor may be installed without populating the associated memory slots, provided a second
processor is installed with associated memory. In this case, the memory is shared by the processors.
However, the platform suffers performance degradation and latency due to the remote memory.

Processor sockets are self-contained and autonomous. However, all memory subsystem support
(such as Memory RAS, Error Management,) in the BIOS setup are applied commonly across processor
sockets.

For multiple DIMMs per channel:
45
Intel® Server System R1000WF Product Family Technical Product Specification
o
4.2
For RDIMM, LRDIMM, 3DS RDIMM, 3DS LRDIMM; Always populate DIMMs with higher electrical
loading in slot1, followed by slot 2.
Thermal Management Overview
In order to maintain the necessary airflow within the system, all of the previously listed components and top
cover need to be properly installed. For optimum system performance, the external ambient temperature
should remain below 35°C and all system fans (all rotors) should be operational. The system is designed for
fan redundancy when the system is configured with two power supplies, all system fans are present and
operational, and ambient air remains at or below ASHRAE Class 2 limits. In fan redundancy mode, should a
single system fan rotor failure occur, integrated platform management will: change the state of the System
Status LED to flashing Green, report an error to the system event log, and automatically adjust remaining fan
speeds as needed to maintain system temperatures below maximum thermal limits.
Note: All system fans are controlled independently of each other. The fan control system may adjust fan
speeds for different fans based on increasing/decreasing temperatures in different thermal zones within the
chassis.
In the event that system temperatures should continue to increase with the system fans operating at their
maximum speed, platform management may begin to throttle bandwidth of either the memory subsystem or
the processors or both, in order to keep components from overheating and keep the system operational.
Throttling of these subsystems will continue until system temperatures are reduced below preprogrammed
limits.
Should system thermals increase to a point beyond maximum thermal limits, the system will shut down, the
System Status LED will change to a solid Amber state, and the event will be logged to the system event log.
Should power supply thermals increase to a point beyond its maximum thermal limit or if a power supply fan
should fail, the power supply will shut down.
Note: For proper system thermal management, Sensor Data Records (SDRs) for any given system
configuration must be loaded by the system integrator as part of the initial system integration process. SDRs
are loaded using the FRUSDR utility which is part of the System Update Package (SUP) or One-boot Firmware
Update (OFU) package which can be downloaded from the following Intel website:
http://downloadcenter.intel.com
4.2.1
Fan Speed Control
The baseboard management controller (BMC) controls and monitors the system fans. Each fan is associated
with a fan speed sensor that detects fan failure. For redundant fan configurations, the fan failure and
presence status determines the fan redundancy sensor state.
The system fans are divided into fan domains, each of which has a separate fan speed control signal and a
separate configurable fan control policy. A fan domain can have a set of temperature and fan sensors
associated with it. These are used to determine the current fan domain state.
A fan domain has three states:
•
•
The sleep and boost states have fixed (but configurable through OEM SDRs) fan speeds associated with
them
The nominal state has a variable speed determined by the fan domain policy. An OEM SDR record is used
to configure the fan domain policy
The fan domain state is controlled by several factors; they are listed below in order of precedence, high to
low:
46
Intel® Server System R1000WF Product Family Technical Product Specification
•
•
Boost
o Associated fan is in a critical state or missing. The SDR describes which fan domains are boosted in
response to a fan failure or removal in each domain. If a fan is removed when the system is in ‘Fansoff’ mode it will not be detected and there will not be any fan boost until the system comes out of
‘Fans-off; mode.
o Any associated temperature sensor is in a critical state. The SDR describes which temperature
threshold violations cause fan boost for each fan domain.
o The BMC is in firmware update mode, or the operational firmware is corrupted.
o If any of the above conditions apply, the fans are set to a fixed boost state speed.
Nominal
o A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the state
of one or more associated temperature sensors.
4.2.1.1
Programmable Fan PWM Offset
The system provides a BIOS Setup option to boost the system fan speed by a programmable positive offset
or a “Max” setting. Setting the programmable offset causes the BMC to add the offset value to the fan speeds
it would otherwise be driving. The Max setting causes the BMC to replace the domain minimum speed with
alternate domain minimums that also are programmable through SDRs.
This capability is offered to provide system administrators the option to manually configure fan speeds in
instances where the fan speed optimized for a given platform may not be sufficient when a high end add-in
adapter is configured into the system. This enables easier usage of the fan speed control to support Intel as
well as third party chassis’ and better support for ambient temperatures higher than 35°C.
4.2.1.2
Fan Redundancy Detection
The BMC supports redundant fan monitoring through a fan redundancy sensor. A fan redundancy sensor
generates events when it’s associated set of fans transitions between redundant and non-redundant states,
as determined by the number and health of the fans. The definition of fan redundancy is configuration
dependent. The BMC allows redundancy to be configured on a per fan redundancy sensor basis through
OEM SDR records.
A fan failure up to the number of redundant fans specified in the SDR in a fan configuration is a non-critical
failure and is reflected at the front panel. A fan failure or removal that exceeds the number of redundant fans
is a non-fatal, insufficient-resources condition and is reflected at the front panel as a non-fatal error.
Redundancy is checked only when the system is in the DC-on state. Fan redundancy changes that occur
when the system is DC-off or when AC is removed will not be logged until the system is turned on.
4.2.1.3
Fan Domains
System fan speeds are controlled through pulse width modulation (PWM) signals, which are driven
separately for each domain by integrated PWM hardware. Fan speed is changed by adjusting the duty cycle,
which is the percentage of time the signal is driven high in each pulse.
The BMC controls the average duty cycle of each PWM signal through direct manipulation of the integrated
PWM control registers.
The same device may drive multiple PWM signals.
4.2.1.4
Nominal Fan Speed
A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the state of one
or more associated temperature sensors.
OEM SDR records are used to configure which temperature sensors are associated with which fan control
domains and the algorithmic relationship between the temperature and fan speed. Multiple OEM SDRs can
47
Intel® Server System R1000WF Product Family Technical Product Specification
reference or control the same fan control domain; and multiple OEM SDRs can reference the same
temperature sensors.
The PWM duty-cycle value for a domain is computed as a percentage using one or more instances of a
stepwise linear algorithm and a clamp algorithm. The transition from one computed nominal fan speed
(PWM value) to another is ramped over time to minimize audible transitions. The ramp rate is configurable by
means of the OEM SDR.
Multiple stepwise linear and clamp controls can be defined for each fan domain and used simultaneously.
For each domain, the BMC uses the maximum of the domain’s stepwise linear control contributions and the
sum of the domain’s clamp control contributions to compute the domain’s PWM value. A stepwise linear
instance can also be configured to provide the domain maximum.
Hysteresis can be specified to minimize fan speed oscillation and to smooth fan speed transitions. If a
Tcontrol SDR record does not contain a hysteresis definition, for example, an SDR adhering to a legacy
format, the BMC assumes a hysteresis value of zero.
4.2.1.5
Thermal and Acoustic Management
This feature refers to enhanced fan management to keep the system optimally cooled while reducing the
amount of noise generated by the system fans. Aggressive acoustic standards might require a trade-off
between fan speed and system performance parameters that contribute to the cooling requirements and
primarily memory bandwidth. The BIOS, BMC, and SDRs work together to provide control over how this
trade-off is determined.
This capability requires the BMC to access temperature sensors on the individual memory DIMMs.
Additionally, closed-loop thermal throttling is only supported with buffered DIMMs.
4.2.1.6
Thermal Sensor Input to Fan Speed Control
The BMC uses various IPMI sensors as input to the fan speed control. Some of the sensors are IPMI models
of actual physical sensors and some are “virtual” sensors whose values are derived from physical sensors
using calculations and/or tabular information.
The following IPMI thermal sensors are used as input to fan speed control:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Front Panel Temperature Sensor1
CPU Margin Sensors2,4,5
DIMM Thermal Margin Sensors2,4
Exit Air Temperature Sensor1, 7, 9
PCH Temperature Sensor3,5
Onboard Ethernet Controller Temperature Sensors3, 5
PSU Thermal Sensor3, 8
CPU VR Temperature Sensors3, 6
DIMM VR Temperature Sensors3, 6
BMC Temperature Sensor3, 6
Global Aggregate Thermal Margin Sensors 7
Hot Swap Backplane Temperature Sensors
Intel® OCP Module Temperature Sensor (With option installed)
Intel® SAS Module (With option installed)
Riser Card Temperature Sensors (2U system only)
Intel® Xeon Phi™ coprocessor (2U system only with option installed)
Notes:
1.
2.
48
For fan speed control in Intel chassis
Temperature margin to max junction temp
Intel® Server System R1000WF Product Family Technical Product Specification
3.
4.
5.
6.
7.
8.
9.
Absolute temperature
PECI value or margin value
On-die sensor
Onboard sensor
Virtual sensor
Available only when PSU has PMBus
Calculated estimate
A simple model is shown in the following figure which gives a high level representation of how the fan speed
control structure creates the resulting fan speeds.
Policy:
Sensors:
Events:
 CLTT
 Acoustic/
performance
 Auto-profile
configuration
 Front panel
 Processor
margin
 Other sensors
(chipset, temp,
etc.)
 Intrusion
 Fan failure
 Power supply
failure
System Behaviors
Memory
throttle
settings
Fan
speed
Figure 24. High Level Fan Speed Control Model
4.3
System Fans
Six dual rotor, 40 x 56mm system fans and an embedded fan for each installed power supply provide the
primary airflow for the system.
The system is designed for fan redundancy when configured with two power supply modules, all system fan
rotors are operational, and ambient air remains at or below ASHRAE class 2 limits. Should a single system fan
rotor fail, platform management will adjust air flow of the remaining system fans and manage other platform
features to maintain system thermals. Fan redundancy is lost if more than one system fan rotor is in a failed
state.
The system includes two system fan assemblies of three dual rotor fans each. The fan assemblies are held in
place by fitting them over mounting pins coming up from the chassis base.
49
Intel® Server System R1000WF Product Family Technical Product Specification
Figure 25. System Fan Assembly
•
•
•
•
•
•
•
System fans are NOT hot-swappable
Each fan and fan assembly is designed for tool-less insertion and extraction from the system. For
instructions on fan replacement, see the Intel® Server System R1000WF System Integration and Service
Guide
Each fan and fan assembly incorporates vibration dampening features used to minimize fan vibration
affects within the chassis
Fan speed for each fan is controlled by the integrated BMC on the server board. As system thermals
fluctuate high and low, the integrated BMC firmware will increase and decrease the speeds to specific
fans to regulate system thermals
Each fan has a tachometer signal for each rotor that allows the Integrated BMC to monitor their status
Each system fan includes a fault LED located near each system fan connector on the server board
Each fan has a 10-pin wire harness that connects to a matching connector on the server board
On the server board , each system fan includes a pair of fan connectors; a 1x10 pin connector to support a
dual rotor cabled fan, typically used in 1U system configurations, and a 2x3 pin connector to support a single
rotor hot swap fan assembly, typically used in 2U system configurations. Concurrent use of both fan
connector types for any given system fan pair is not supported.
Figure 26. System Fan Connector Locations on a 1U Server Board
50
Intel® Server System R1000WF Product Family Technical Product Specification
Table 29. System Fan Connector Pin-out
SYS_FAN 1
Signal Description
FAN_TACH1
FAN_PWM0
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH0
GROUND
GROUND
FM_SYS_FAN0_PRSNT_N
LED_FAN_FAULT0_R
LED_FAN0
SYS_FAN 4
Signal Description
FAN_TACH7
FAN_PWM3
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH6
GROUND
GROUND
FM_SYS_FAN3_PRSNT_N
LED_FAN_FAULT3_R
LED_FAN3
4.4
Pin#
1
2
3
4
5
6
7
8
9
10
Pin#
1
2
3
4
5
6
7
8
9
10
SYS_FAN 2
Signal Description
FAN_TACH3
FAN_PWM1
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH2
GROUND
GROUND
FM_SYS_FAN1_PRSNT_N
LED_FAN_FAULT1_R
LED_FAN1
SYS_FAN 5
Signal Description
FAN_TACH9
FAN_PWM4
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH8
GROUND
GROUND
FM_SYS_FAN4_PRSNT_N
LED_FAN_FAULT4_R
LED_FAN4
Pin#
1
2
3
4
5
6
7
8
9
10
Pin#
1
2
3
4
5
6
7
8
9
10
SYS_FAN 3
Signal Description
FAN_TACH5
FAN_PWM2
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH4
GROUND
GROUND
FM_SYS_FAN2_PRSNT_N
LED_FAN_FAULT2_R
LED_FAN2
SYS_FAN 6
Signal Description
FAN_TACH11
FAN_PWM5
P12V_CPU_DIMM
P12V_CPU_DIMM
FAN_TACH10
GROUND
GROUND
FM_SYS_FAN5_PRSNT_N
LED_FAN_FAULT5_R
LED_FAN5
Pin#
1
2
3
4
5
6
7
8
9
10
Pin#
1
2
3
4
5
6
7
8
9
10
Power Supply Module Fans
Each installed power supply module includes embedded (non-removable) 40-mm fans. They are responsible
for airflow through the power supply module. These fans are managed by the fan control system. Should a
fan fail, the power supply will shut down.
4.5
FRUSDR Utility
The purpose of the embedded platform management and fan control systems is to monitor and control
various system features, and to maintain an efficient operating environment. Platform management is also
used to communicate system health to supported platform management software and support mechanisms.
The FRUSDR utility is used to program the server board with platform specific environmental limits,
configuration data, and the appropriate sensor data records (SDRs), for use by these management features.
The FRUSDR utility must be run as part of the initial platform integration process before it is deployed into a
live operating environment. Once the initial FRU and SDR data is loaded on to the system, all subsequent
system configuration changes will automatically update SDR data using the BMC auto configuration feature,
without having to run the FRUSDR utility again. However, to ensure the latest sensor data is installed, the
SDR data should be updated to the latest revision available as part of a planned system software update.
The FRUSDR utility for a specific server platform can be downloaded as part of the System Update Package
(SUP) or One-boot Firmware Update (OFU) package from the following Intel web site:
http://downloadcenter.intel.com
Note: The embedded platform management system may not operate as expected if the platform is not
updated with accurate system configuration data. The FRUSDR utility must be run with the system fully
configured during the initial system integration process for accurate system monitoring and event reporting.
51
Intel® Server System R1000WF Product Family Technical Product Specification
5.
Drive Bay Options
The Intel® Server System R1000WF product family has support for different drive bay options including:
•
•
Up to 8 x 2.5” hot swap NVMe, SAS, or SATA drives
Up to 4 x 3.5” hot swap SAS or SATA hard disk drives or 2.5” SSDs
Video
Connector
System Label Pullout
USB 3.0
Ports
Control
Panel
8 x 2.5” Drive Bays
Figure 27. 8x2.5" Drive Bay Configuration (Model R1208WFxxx)
Video
USB 3.0
Connector Ports
System Label Pullout
Control
Panel
4 x 3.5” Drive Bays
Figure 28. 4x3.5" Drive Bay Configuration (Model R1304WFxxx)
5.1
Hot Swap Drive Carriers
Each SAS/SATA/NVMe* drive that interfaces with a backplane is mounted to a tool-less hot swap drive
carrier.
52
Intel® Server System R1000WF Product Family Technical Product Specification
Drive carriers include a latching mechanism used to assist with drive extraction and drive insertion.
Figure 29. Drive Carrier Removal
Note: To ensure proper system air flow requirements, all front drive bays must be populated with a drive
tray. Drive trays must be installed with either a drive or supplied drive blank.
There are drive carriers to support 2.5” drives and 3.5” drives. Drive blanks used with the 3.5” drive carrier
can also be used to mount a 2.5” SSD.
Figure 30. 2.5" SSD Mounted to a 3.5" Drive Tray
53
Intel® Server System R1000WF Product Family Technical Product Specification
Note: Due to degraded performance and reliability concerns, the use of the 3.5” drive blank as a 2.5” device
bracket is intended to support SSD type storage devices only. Installing a 2.5” hard disk drive into the 3.5”
drive blank is not be supported.
54
Intel® Server System R1000WF Product Family Technical Product Specification
Each drive carrier includes separate LED indicators for drive Activity and drive Status. Light pipes integrated
into the drive carrier assembly direct light emitted from LEDs mounted next to each drive connector on the
backplane to the drive carrier faceplate, making them visible from the front of the system.
Amber Status LED
Green Activity LED
2.5” only
drive tray
2.5” / 3.5”
drive tray
Amber Status LED
Green Activity LED
Figure 31. Drive Tray LED Identification
Table 30. Amber Drive Status LED States
Amber
LED State
Off
Solid on
1 Hz blinking
2 Hz blinking
Drive Status
No access and no fault
Hard drive fault has occurred
RAID rebuild in progress
Locate (identify)
Table 31. Green Drive Activity LED States
Green
Condition
Power on with no drive
activity
Power on with drive
activity
Power on and drive spun
down
Power on and drive
spinning up
Drive Type
SAS/NVMe*
SATA
SAS/NVMe*
SATA
SAS/NVMe*
SATA
SAS/NVMe*
SATA
LED Behavior
LED stays on
LED stays off
LED blinks off when processing a command
LED blinks on when processing a command
LED stays off
LED stays off
LED blinks
LED stays off
Table 32. PCIe SSD Drive Status LED States (VROC)
Amber
LED State
Off
4 Hz blinking
Solid on
1 Hz blinking
Drive Status
No fault, OK
Locate (identify)
Fault/fail
Rebuild
Note: The drive activity LED is driven by signals coming from the drive itself. Drive vendors may choose to
operate the activity LED different from what is described in the table above. Should the activity LED on a
given drive type behave differently than what is described, customers should reference the drive vendor
specifications for the specific drive model to determine the expected drive activity LED operation.
55
Intel® Server System R1000WF Product Family Technical Product Specification
5.2
Hot Swap Backplane Support
The 1U system has support for two backplane options.
•
•
8 x 2.5” drive combo backplane with support for SAS/SATA/NVMe drives
4 x 3.5” backplane with support for SAS/SATA drives
All available backplane options mount directly to the back of the drive bay as shown in the following
illustration.
Figure 32. Backplane Installation
Backplanes include the following features:
•
•
•
•
•
•
•
•
•
•
•
•
•
56
12 Gb SAS and 6Gb SAS/SATA or slower support
Drive interface connectors
o 29-pin SFF-8680 – 3.5” Backplane – SAS/SATA only – 12 Gb rated
o 68-pin SFF-8639 – 2.5” Backplane – supporting 12 Gb SAS and x4 PCIe* NVMe
Hot swap drive support
Cable Connectors
o SFF-8643 Mini-SAS HD – 2.5” and 3.5” backplanes – 12Gb SAS capable
o OCuLink* PCIe interface – 2.5” backplane
o 1x5-pin connector – I2C interface for device status communication to the BMC over slave SMBus
o 2x2- in connector - Power
SGPIO SFF-8485 interface embedded within the sideband of the mini-SAS HD connectors
HSBP microcontroller – Cypress* CY8C22545-24AXI Programmable System-on-Chip (PSoC*) device
LEDs to indicate drive activity and status for each attached device
Device presence detect inputs to the microcontroller
5V VR for devices
3.3V VR for microcontroller
In-application microcontroller FW updateable over the I2C interface
FRU EEPROM support
Temperature sensor through the use of a TMP75 (or equivalent) thermistor implementation with the
microcontroller
Intel® Server System R1000WF Product Family Technical Product Specification
5.2.1
SGPIO Functionality
Backplanes include support for an SFF-8485 compliant SGPIO interface used to activate the Status LED. This
interface is also monitored by the microcontroller for generating FAULT, IDENTIFY, and REBUILD registers
that in turn are monitored by the server board BMC for generating corresponding SEL events.
5.2.2
I2C Functionality
The microcontroller has a master/slave I2C connection to the server board BMC. The microcontroller is not
an IPMB compliant device. The BMC will generate SEL events by monitoring registers on the HSBP
microcontroller for DRIVE PRESENCE, FAULT, and RAID REBUILD in progress.
5.3
4 x 3.5” Drive SATA/SAS Hot-Swap Backplane
Intel Spare Product Code: FR1304S3HSBP
All 3.5” drive system SKUs within the product family will ship with a 4 x drive backplane capable of
supporting 12 Gb/sec SAS and 6 Gb/sec SAS / SATA drives. Both hard disks and Solid State Devices (SSDs)
can be supported within a common backplane. Each backplane can support either SATA or SAS devices.
However, mixing of SATA and SAS devices within a common hot swap backplane is not supported.
Supported devices are dependent on the type of host bus controller driving the backplane: SATA only or
SAS.
The front side of the backplane includes, 4 x 29-pin SFF-8680 drive interface connectors, each capable of
supporting 12 Gb SAS or 6 Gb SAS/SATA. The connectors are numbered 0 thru 3. Signals for all four drive
connectors are routed to a single multi-port, mini-SAS HD SFF-8643 connector on the back side of the
backplane.
Label
Description
A
HDD_0
B
HDD_1
C
HDD_2
D
HDD_3
Figure 33. 4 x 3.5” Drive Hot-Swap Backplane – Front View
57
Intel® Server System R1000WF Product Family Technical Product Specification
On the backside of the backplane are several connectors. The following illustration identifies each.
Label
Description
A
Power Harness Connector
B
Multi-port, Mini-SAS Cable Connector
C
I2C Cable Connector
Figure 34. 4 x 3.5” Drive Hot-Swap Backplane – Rear View
A – Power Harness Connector – The backplane includes a 2x2 connector supplying power to the backplane.
Power is routed to the backplane via a power cable harness from the server board.
B – Multi-port Mini-SAS Cable Connector – The backplane includes one multi-port mini-SAS cable connector
providing I/O signals for four SAS/SATA drives on the backplane. A cable can be routed from matching
connectors on the server board or add-in SAS/SATA RAID cards.
C – I2C Cable Connector – The backplane includes a 1x5 cable connector used as a management interface to
the server board.
5.4
8 x 2.5” Drive SATA / SAS / NVMe* Combo Backplane
Intel Spare Product Code: F1U8X253PHS
All R1208…. 2.5” drive systems within the Intel® Server R1000WF product family will include an eight (8)
drive combo backplane capable of supporting 12 Gb/sec SAS, 6 Gb/sec SATA and PCIe* NVMe drives.
The 8x2.5” drive combo backplane has support for different drive configurations including SAS or SATA only,
NVMe only, or a combination of both SAS and NVMe. Mixing of SATA and SAS devices within a common hot
swap backplane is not supported. Hard Disk Drives (HDDs) and Solid State Drives (SSDs) can be supported
within a common backplane.
The front side of the backplane includes 8 x 68-pin SFF-8639 drive interface connectors, each capable of
supporting SAS, SATA, or PCIe* NVMe drives. The connectors are numbered 0 thru 7.
Figure 35. 8 x 2.5” Drive SAS/SATA/NVMe Backplane – Front View
The backplane and backplane management features can support drives installed in any order when
populating mixed SATA/NVMe or SAS/NVMe drive configurations. However, when mixing NVMe and
SATA/SAS within a common backplane, Intel recommends drive types be populated together and not in an
intermixed order. In addition, drive population rules must be followed and drive support limitations exist
58
Intel® Server System R1000WF Product Family Technical Product Specification
when the optional Intel® VROC upgrade key is installed to the server board providing support for NVMe RAID
and NVMe Management features. See Section 6.4.4.
The backside of the backplane includes two multi-port mini-SAS HD connectors labeled SAS/SATA_0-3 and
SAS/SATA_4-7, and eight PCIe OCuLink connectors, each labeled PCIe SSD#, where # = 0-7, one connector
for each installed NVMe drive.
SAS/SATA
Drives 4-7
SAS/SATA
Drives 0-3
Figure 36. 8 x 2.5” Drive SAS/SATA Backplane – Rear View
Power Connector – The backplane includes a 2x2 connector supplying power to the backplane. Power is
routed to the backplane via a power cable harness from the server board.
PIN
SIGNAL
SIGNAL
PIN
1
GND
P12V
3
2
GND
P12V
4
I2C Cable Connector – The backplane includes a 1x5 cable connector used as a management interface to
the server board.
PIN
SIGNAL
1
SMB_3V3SB_DAT
2
GND
3
SMB_3V3SB_CLK
4
SMB_ADD0
5
SMB_ADD1
Multi-port Mini-SAS Cable Connectors – The backplane includes two, multi-port mini-SAS HD (SFF-8643)
cable connectors, each providing I/O signals for four SAS/SATA hard drives on the backplane. Cables can be
routed from matching connectors on the server board for SATA only support, or from an add-in SAS/SATA
RAID card.
PCIe OCuLink* Connectors – The backplane has support for up to eight (8) NVMe SFF SSDs. The backside of
the backplane includes eight OCuLink* cable connectors, one for each drive connector on the front side of
the backplane. Each installed NVMe drive must have PCIe signals cabled to the appropriate backplane
OCuLink connector from any of the following PCIe signal sources:


Available onboard PCIe* OCuLink connectors on the server board
Optional PCIe 4 or 8 Port Switch Add-in Card
See section 6.4 for NVMe support information.
59
Intel® Server System R1000WF Product Family Technical Product Specification
6.
Storage Controller Options Overview
The Intel® Server System R1000WF product family has support for a variety of storage controller and storage
device options including:





6.1
Onboard SATA support
Embedded software RAID support
M.2 SSD support
NVMe* SFF SSD support
Intel® Integrated RAID Modules support
Onboard SATA Support
The server board utilizes two chipset embedded AHCI SATA controllers, identified as SATA and sSATA,
providing for up to ten 6 Gb/sec Serial ATA (SATA) ports.
The AHCI sSATA controller provides support for up to 4 SATA ports on the server board:
•
•
Two ports accessed via two white single port 7-pin connectors labeled “sSATA-4” and “sSATA-5” on the
server board
Two ports (sSATA 1 and sSATA 2) via two M.2 SSD connectors
The AHCI SATA controller provides support for up to 8 SATA ports on the server board: (S2600WFT &
S2600WF0 boards only)
•
•
Four ports from the Mini-SAS HD (SFF-8643) connector labeled “SATA Ports 0-3” on the server board
Four ports from the Mini-SAS HD (SFF-8643) connector labeled “SATA Ports 4-7” on the server board
sSATA port 4
sSATA port 5
SATA ports 0 - 3
SATA ports 4 - 7
Figure 37. Onboard Storage Support Features
Note: The onboard SATA controllers are not compatible with and cannot be used with SAS Expander Cards.
60
Intel® Server System R1000WF Product Family Technical Product Specification
Table 33. SATA and sSATA Controller Feature Support
Feature
Description
AHCI Mode
RAID Mode
RSTe
Native Command Queuing (NCQ)
Allows the device to reorder commands for
more efficient data transfers
Supported
Supported
Auto Activate for DMA
Collapses a DMA Setup then DMA Activate
sequence into a DMA Setup only
Supported
Supported
Hot Plug Support
Allows for device detection without power
being applied and ability to connect and
disconnect devices without prior notification
to the system
Supported
Supported
Asynchronous Signal Recovery
Provides a recovery from a loss of signal or
establishing communication after hot plug
Supported
Supported
6 Gb/s Transfer Rate
Capable of data transfers up to 6 Gb/s
Supported
Supported
ATAPI Asynchronous Notification
A mechanism for a device to send a
notification to the host that the device
requires attention
Supported
Supported
Host & Link Initiated Power
Management
Capability for the host controller or device to
request Partial and Slumber interface power
states
Supported
Supported
Staggered Spin-Up
Enables the host the ability to spin up hard
drives sequentially to prevent power load
problems on boot
Supported
Supported
Command Completion Coalescing
Reduces interrupt and completion overhead
by allowing a specified number of
commands to complete and then generating
an interrupt to process the commands
Supported
N/A
RAID Mode
ESRT2
Supported
Supported
The SATA controller and the sSATA controller can be independently enabled and disabled and configured
through the <F2> BIOS Setup Utility under the “Mass Storage Controller Configuration” menu screen. The
following table identifies supported setup options.
Table 34. SATA and sSATA Controller BIOS Utility Setup Options
SATA Controller
AHCI
AHCI
AHCI
AHCI
Disabled
Disabled
Disabled
Disabled
Intel® RSTe
Intel® RSTe
Intel® RSTe
Intel® RSTe
Intel® Embedded Server RAID Technology 2
Intel® Embedded Server RAID Technology 2
Intel® Embedded Server RAID Technology 2
Intel® Embedded Server RAID Technology 2
sSATA Controller
AHCI
Disabled
Intel® RSTe
Intel® Embedded Server RAID Technology 2
AHCI
Disabled
Intel® RSTe
Intel® Embedded Server RAID Technology 2
AHCI
Disabled
Intel® RSTe
Intel® Embedded Server RAID Technology 2
AHCI
Disabled
Intel® RSTe
Intel® Embedded Server RAID Technology 2
Supported
Yes
Yes
Yes
Microsoft Windows* only
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
Microsoft Windows only
Yes
No
Yes
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Intel® Server System R1000WF Product Family Technical Product Specification
6.1.1
Staggered Disk Spin-Up
Because of the high density of disk drives that can be attached to the Intel® C620 Onboard AHCI SATA
Controller and the sSATA Controller, the combined startup power demand surge for all drives at once can be
much higher than the normal running power requirements and could require a much larger power supply for
startup than for normal operations.
In order to mitigate this and lessen the peak power demand during system startup, both the AHCI SATA
Controller and the sSATA Controller implement a Staggered Spin-Up capability for the attached drives. This
means that the drives are started up separately, with a certain delay between disk drives starting.
For the Onboard SATA Controller, Staggered Spin-Up is an option – AHCI HDD Staggered Spin-Up – in the
Setup Mass Storage Controller Configuration screen found in the <F2> BIOS Setup Utility.
6.2
Onboard SATA Software RAID support
The server board includes support for two embedded SATA RAID options:
•
•
Intel® Rapid Storage Technology (RSTe) 5.0
Intel® Embedded Server RAID Technology 2 (ESRT2) 1.60
By default, onboard RAID options are set to DISABLED in <F2> BIOS Setup. To enable onboard RAID
support, access the <F2> BIOS Setup utility during POST. The onboard RAID options can be found under the
sSATA Controller or SATA Controller options under the following BIOS setup menu::
ADVANCED -> MASS STORAGE CONTROLLER CONFIGURATION
Note: RAID partitions created using either RSTe or ESRT2 cannot span across the two embedded SATA
controllers. Only drives attached to a common SATA controller can be included in a RAID partition.
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Intel® Server System R1000WF Product Family Technical Product Specification
6.2.1
Intel® Rapid Storage Technology (RSTe) 5.0
Intel® Rapid Storage Technology enterprise (Intel® RSTe) offers several options for RAID to meet the needs of
the end user. AHCI support provides higher performance and alleviates disk bottlenecks by taking advantage
of the independent DMA engines that each SATA port offers in the chipset. Supported RAID levels include 0,
1, 5, and 10.




RAID 0 – Uses striping to provide high data throughput, especially for large files in an environment
that does not require fault tolerance.
RAID 1 – Uses mirroring so that data written to one disk drive simultaneously writes to another disk
drive. This is good for small databases or other applications that require small capacity but complete
data redundancy.
RAID 5 – Uses disk striping and parity data across all drives (distributed parity) to provide high data
throughput, especially for small random access.
RAID 10 – A combination of RAID 0 and RAID 1, consists of striped data across mirrored spans. It
provides high data throughput and complete data redundancy but uses a larger number of spans.
By using Intel® RSTe, there is no loss of PCI resources (request/grant pair) or add-in card slot. Intel® RSTe
functionality requires the following:







The embedded RAID option must be enabled in BIOS setup.
Intel RSTe option must be selected in BIOS setup.
Intel RSTe drivers must be loaded for the installed operating system.
At least two SATA drives needed to support RAID levels 0 or 1.
At least three SATA drives needed to support RAID level 5.
At least four SATA drives needed to support RAID level 10.
NVMe SSDs and SATA drives must not be mixed within a single RAID volume
With Intel® RSTe SW-RAID enabled, the following features are made available:



6.2.2
A boot-time, pre-operating-system environment, text-mode user interface that allows the user to
manage the RAID configuration on the system. Its feature set is kept simple to keep size to a
minimum, but allows the user to create and delete RAID volumes and select recovery options when
problems occur. The user interface can be accessed by pressing <CTRL-I> during system POST.
Boot support when using a RAID volume as a boot disk. It does this by providing Int13 services when
a RAID volume needs to be accessed by MS-DOS applications (such as NT loader (NTLDR)) and by
exporting the RAID volumes to the system BIOS for selection in the boot order.
At each boot-up, a status of the RAID volumes provided to the user.
Intel® Embedded Server RAID Technology 2 (ESRT2) 1.60 for SATA
Intel® Embedded Server RAID Technology 2 (powered by LSI*) is a driver-based RAID solution for SATA that
is compatible with previous generation Intel® server RAID solutions. Intel Embedded Server RAID Technology
2 provides RAID levels 0, 1, and 10, with an optional RAID 5 capability depending on whether a RAID upgrade
key is installed.
Note: The embedded Intel Embedded Server RAID Technology 2 option has no RAID support for PCIe*
NVMe* SSDs.
Intel Embedded Server RAID Technology 2 is based on LSI* MegaRAID software stack and utilizes the system
memory and CPU.
Supported RAID levels include:

RAID 0: Uses striping to provide high data throughput, especially for large files in an environment that
does not require fault tolerance.
63
Intel® Server System R1000WF Product Family Technical Product Specification



RAID 1: Uses mirroring so that data written to one disk drive simultaneously writes to another disk
drive. This is good for small databases or other applications that require small capacity but complete
data redundancy
RAID 10: A combination of RAID 0 and RAID 1, consists of striped data across mirrored spans. It
provides high data throughput and complete data redundancy but uses a larger number of spans.
Optional support for RAID Level 5
o Enabled with the addition of an optionally installed ESRT2 SATA RAID 5 Upgrade Key (iPN RKSATA4R5)
Figure 38. ESRT2 SATA RAID-5 Upgrade Key
o
RAID 5: Uses disk striping and parity data across all drives (distributed parity) to provide high
data throughput, especially for small random access.
Intel Embedded Server RAID Technology 2 on this server board supports a maximum of six drives which is
the maximum onboard SATA port support.
The binary driver includes partial source files. The driver is fully open source using an MDRAID layer in
Linux*.
Note: RAID configurations cannot span across the two embedded AHCI SATA controllers.
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Intel® Server System R1000WF Product Family Technical Product Specification
6.3
M.2 SSD Support
The Intel® Server Board S2600WF product family includes two M.2 SSD connectors labeled
“M2_x4PCIE/sSATA_1” and “M2_x2PCIE/sSATA_2” on the server board as shown below.
Figure 39. M.2 Module Connector Locations
Each M.2 connector can support PCIe* or SATA modules that conform to a 2280 (80 mm) form factor.
PCIe bus lanes for each connector are routed from the Intel chipset and can be supported in single processor
configurations.
The M.2 connector to the left of Riser Slot #1 is supported by PCIe x4 bus lanes and sSATA-1 from the
chipset embedded sSATA controller. The M.2 connector to the right of Riser Sot #1is supported by PCIe x2
bus lanes and sSATA-2 from the chipset embedded sSATA controller.
6.3.1
Embedded RAID Support
RAID support from embedded RAID options for server board mounted M.2 SSDs is defined as follows:



Neither Intel® ESRT2 nor Intel® RSTe have RAID support for PCIe* M.2 SSDs when installed to the M.2
connectors on the server board.
o
Note: NVMe RAID support using Intel® RSTe VROC requires that the PCIe bus lanes be routed
directly from the CPU. On this server board, the PCIe bus lanes routed to the onboard M.2
connectors are routed from the Intel chipset (PCH).
o
Note: The Intel® ESRT2 onboard RAID option does not support PCIe devices.
Both Intel® ESRT2 and Intel® RSTe provide RAID support for SATA devices
Neither embedded RAID option supports mixing of M.2 SATA SSDs and SATA hard drives within a
single RAID volume
Note: Storage devices used to create a single RAID volume created using either RSTe or ESRT2, cannot span
across the two embedded SATA controllers nor is mixing both SATA and NVMe devices within a single RAID
volume supported.

Open Source Compliance = Binary Driver (includes Partial Source files) or Open Source using MDRAID
layer in Linux*
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Intel® Server System R1000WF Product Family Technical Product Specification
6.4
PCIe NVMe* Drive Support
The eight drive combo backplane used within all R1208…. system models of the Intel® Server System
R1000WF product family has support for up to eight (8) PCIe NVMe 2.5” Small Form Factor (SFF) SSDs. Each
installed NVMe drive must have its own PCIe interface as cabled to the backplane from one or more of the
following PCIe signal sources:


6.4.1
Onboard PCIe OCuLink connectors on the server board
4-port PCIe 3.0 x8 Switch add-in card (accessory kit iPC – AXXP3SWX08040)
Onboard PCIe* OCuLink* Connectors
The server board provides four (4) onboard PCIe* OCuLink* connectors, each supporting a x4 PCIe signaling
interface. When cabled to the backplane, each connector provides the PCIe interface to a single installed
NVMe drive on the backplane.
PCIe* signals for onboard OCuLink connectors “PCIe_SSD0” and “PCIe_SSD1” are routed directly from
CPU_1 and PCIe signals for OCuLink connectors “PCIe_SSD2” and “PCIe_SSD3” are directly routed from
CPU_2.
PCIe SSD 1
(CPU 1)
PCIe SSD 0
(CPU 1)
PCIe SSD 3
(CPU 2)
PCIe SSD 2
(CPU 2)
Figure 40. Onboard OCuLink Connectors
6.4.2
Intel® Volume Management Device (Intel® VMD) for NVMe
Intel® Volume Management Device (Intel® VMD) is hardware logic inside the processor root complex to help
manage PCIe* NVMe* SSDs. It provides robust hot plug support and status LED management. This allows
servicing of storage system NVMe SSD media without fear of system crashes or hangs when ejecting or
inserting NVMe SSD devices on the PCIe bus.
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Intel® Server System R1000WF Product Family Technical Product Specification
NVMe Support w/o Intel® VMD
NVMe Storage with Intel® VMD
VMD-enabled
NVMe Driver
NVMe Driver
OS PCI bus driver
PCIe
Processor
PCIe
NVMe
SSDs
Storage bus event/error handled by
BIOS or OS.
OS PCI bus
Intel® VMD
NVMe
SSDs
Storage bus event/error handled by
Storage driver.
Figure 41. Storage Bus Event/Error Handled by BIOS or OS/ Storage Drive
Intel® VMD handles the physical management of NVMe storage devices as a standalone function but can be
enhanced when Intel® VROC support options are enabled to implement RAID based storage systems. See
Section 6.4.3 for more information.
















6.4.2.1
Hardware is integrated inside the processor PCIe* root complex.
Entire PCIe* trees are mapped into their own address spaces (domains).
Each domain manages x16 PCIe* lanes.
Can be enabled/disabled in BIOS setup at x4 lane granularity.
Driver sets up/manages the domain (enumerate, event/error handling)
May load an additional child device driver that is Intel VMD aware.
Hot plug support - hot insert array of PCIe* SSDs.
Support for PCIe* SSDs and switches only (no network interface controllers (NICs), graphics cards,
etc.)
Maximum of 128 PCIe* bus numbers per domain.
Support for MCTP over SMBus only.
Support for MMIO only (no port-mapped I/O).
Does not support NTB, Quick Data Tech, Intel® Omni-Path Architecture, or SR-IOV.
Correctable errors do not bring down the system.
Intel® VMD only manages devices on PCIe* lanes routed directly from the processor. Intel® VMD
cannot provide device management on PCI lanes routed from the chipset (PCH)
When Intel VMD is enabled, the BIOS does not enumerate devices that are behind Intel VMD. The
Intel VMD-enabled driver is responsible for enumerating these devices and exposing them to the
host.
Intel® VMD supports hot-plug PCIe* SSDs connected to switch downstream ports. Intel® VMD does
not support hot-plug of the switch itself.
Enabling VMD support
In order for installed NVMe devices to utilize the VMD features of the server board, VMD must be ENABLED
on the appropriate CPU PCIe* Root Ports in <F2> BIOS Setup. By default, VMD support is DISABLED on all
CPU PCIe* root ports in <F2> BIOS Setup.
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Intel® Server System R1000WF Product Family Technical Product Specification
The following table provides the PCIe root port mapping for all onboard PCIe devices, OCuLink Connectors
and Riser Card slots.
Table 35. CPU - PCIe* Port Routing
CPU 1
PCI Ports
Port DMI 3 - x4
CPU 2
Onboard Device
Chipset
Port 1A - x4
Riser Slot #1
Port 1B - x4
Port 1C – x4
PCI Ports
Port DMI 3 -
Onboard Device
x4
Riser Slot #3
Port 1A - x4
Riser Slot #2
Riser Slot #1
Port 1B - x4
Riser Slot #2
Riser Slot #1
Port 1C – x4
Riser Slot #1
Port 1D – x4
Riser Slot #1
Port 1D – x4
Riser Slot #1
Port 2A - x4
Chipset (PCH) - uplink
Port 2A - x4
Riser Slot #2
Port 2B - x4
Chipset (PCH) - uplink
Port 2B - x4
Riser Slot #2
Port 2C - x4
Chipset (PCH) - uplink
Port 2C - x4
Riser Slot #2
Port 2D - x4
Chipset (PCH) - uplink
Port 2D - x4
Riser Slot #2
Port 3A - x4
SAS Module
Port 3A - x4
Port 3B - x4
SAS Module
Port 3B - x4
Port 3C - x4
Port 3D -x4
OCuLink
PCIe_SSD0
OCuLink
PCIe_SSD1
OCuLink
PCIe_SSD2
OCuLink
PCIe_SSD3
Port 3C - x4
Riser Slot #3
Port 3D -x4
Riser Slot #3
For PCIe add-in card slot root port mapping associated with each riser slot and supported riser cards, See
Table 39. Riser Slot #1 & #2 – PCIe* Root Port Mapping
In <F2> BIOS Setup, the Intel VMD support menu can be found under the following BIOS Setup menu
options:
ADVANCED -> PCI CONFIGURATION -> VOLUME MANAGEMENT DEVICE
Figure 42. VMD Support Disabled in <F2> BIOS Setup
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Intel® Server System R1000WF Product Family Technical Product Specification
Figure 43. VMD Support Enabled in <F2> BIOS Setup
6.4.3
Intel® Virtual RAID on Chip (Intel® VROC) For NVMe
Intel® Virtual RAID on Chip (Intel® VROC) enables NVMe* boot on RAID and volume management (Intel® RSTe
5.0 + Intel® VMD)
Figure 44. Intel® VROC Basic Architecture Overview
Intel® VROC supports the following:







I/O processor with controller (ROC) and DRAM.
No need for battery backup / RAID maintenance free backup unit.
Protected write back cache – software and hardware that allows recovery from a double fault.
Isolated storage devices from OS for error handling.
Protected R5 data from OS crash.
Boot from RAID volumes based on NVMe SSDs within a single Intel VMD domain.
NVMe SSD hot plug and surprise removal on CPU PCIe* lanes.
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Intel® Server System R1000WF Product Family Technical Product Specification




LED management for CPU PCIe attached storage.
RAID / storage management using representational state transfer application programming interfaces
(APIs).
Graphical user interface (GUI) for Linux*.
4K native NVMe SSD support.
Enabling Intel® VROC support requires installation of an optional upgrade key on to the server board as
shown in the following illustration.
Figure 45. Intel® VROC Upgrade Key
The following table identifies available Intel® VROC upgrade key options.
Table 36. Intel® VROC Upgrade Key Options
NVMe* RAID Major Features
CPU attached NVMe SSD – high perf.
Boot on RAID volume
Third party vendor SSD support
Intel® RSTe 5.0 RAID 0/1/10
Intel® RSTe 5.0 RAID 5
RAID write hole closed (RMFBU replacement)
Hot plug/ surprise removal
(2.5” SSD form factor only
Enclosure LED management
Standard Intel® VROC
(iPC VROCSTANMOD)
√
√
√
√
√
Premium Intel® VROC
(iPC VROCPREMMOD)
√
√
√
√
√
√
√
√
Note: Intel® VROC Upgrade Keys referenced in Table 35 are used for PCIe* NVMe SSDs only.
RAID support, see Section 6.2.
70
√
For SATA
Intel® Server System R1000WF Product Family Technical Product Specification
6.4.4
NVMe* Drive Population Rules for Intel® VROC
In order to support NVMe RAID and NVMe Management features, the optional Intel® VROC Key must be
installed on to the server board. With the Intel VROC key installed, specific drive population rules exist and
must be followed for proper support of the NVMe management features.
The backplane can support PCIe interfaces from the Server Board OCuLink connectors and/or optional addin PCIe Switch. When cabling the PCIe interfaces from two different PCIe interface sources to the backplane,
the cables from each source must be connected in defined drive sets of four (0,1,2,3) & (4,5,6,7) as shown in
the following diagrams.
Note: The use of one or more OCuLink connectors on the server board to the backplane is considered a
single source.
PCIe Source #1
PCIe Source #2
cable connectors
PCIe Source #2
PCIe Source #1
cable connectors
Figure 46. Backplane Cabling from Two PCIe Sources
When cabling the backplane from two different PCIe sources, no other drive set combinations beyond those
defined above are supported.
Drive population rules will differ depending on the source of the PCIe interface to the backplane. In addition,
specific drive population limits exist when populating a backplane with both NVMe and SAS drive types.
The following sections define the drive population rules associated with each of the available PCIe sources to
the backplane.
Note: When connecting the backplane to two different PCIe sources, the defined population rules for each
PCIe source are applied to the drive set connected to it
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Intel® Server System R1000WF Product Family Technical Product Specification
6.4.4.1
Onboard PCIe OCuLink Connectors to 8 x 2.5” Combo Backplane
The following information is applicable when PCIe signal to the 8x2.5” combo backplane are cabled from the
PCIe OCuLink connectors located on the server board.




OCuLink connectors on the server board are considered a single PCIe source to the backplane, and
therefore can only be connected in defined drive sets 0-3 or 4-7
NVMe drive management sideband signals on the backplane are routed between drive connector pairs:
(0,1) (2,3) (4,5) and (6,7)
In order to support NVMe drive management within a defined drive pair, an NVMe drive MUST be
populated in the first drive connector of the given pair (drives 0, 2, 4, or 6)
Combining an NVMe drive with a SAS/SATA drive within a defined drive pair is NOT supported.
Example) With an NVMe drive installed to drive connector 0, drive connector 1 cannot be populated with
a SAS/SATA drive. The same rule applies to ALL other drive pairs on the backplane.
PCIe Source Drive Set
PCIe Source Drive Set
The following illustrations identify supported and unsupported drive populations associated with any
defined drive pair of the 8x2.5” combo backplane when Intel VROC is used for NVMe drive management
and the PCIe source to the backplane is from any of the onboard OCuLink connectors.
Where 1st Drive = drive connectors 0, 2, 4, or 6 and 2nd Drive = drive connectors 1, 3, 5, or 7
72
Intel® Server System R1000WF Product Family Technical Product Specification
6.4.4.2
4 port PCIe* Switch to 8 x 2.5” Combo Backplane
The following information is applicable when PCIe signal to the 8x2.5” combo backplane are cabled from a 4
port PCIe Switch add-in card option.



NVMe drive management sideband signals on the backplane are routed between drive connector sets:
(0,1,2,3) and (4,5,6,7)
In order to support NVMe drive management within a defined drive set, an NVMe drive MUST be
populated in the first drive connector of the given set (drive connectors 0 or 4). Additional NVMe drives
within the drive set must be populated in sequential order with no gaps between drive connectors.
Combining NVMe drives and SAS/SATA drives within a defined drive set is NOT supported.
PCIe Source Drive Set
PCIe Source Drive Set
The following illustrations identify supported and unsupported drive populations associated with any
defined drive set of the 8x2.5” combo backplane when an Intel® VROC key is installed to the server board
and the PCIe source to the backplane is from an add-in PCIe Switch.
1st Drive = NVMe + NVMe in any
sequential drive slot (No gaps)
Mixing NVMe and SAS within a common
drive set is not supported
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Intel® Server System R1000WF Product Family Technical Product Specification
NVMe not in 1st drive and Mixing of NVMe and SAS
within a common drive set is not supported
Where 1st Drive = drive connectors 0 or 4 on the backplane
6.5
Intel® Integrated RAID Module Support
The system has support for many Intel and third party PCIe add-in 12 Gb RAID adapters which can be
installed in available PCIe add-in cards slots. For system configurations with limited add-in card slot
availability, an optional Intel® Integrated RAID mezzanine module can be installed onto a high density 80-pin
connector (labeled “SAS Module”) on the server board.
74
Intel® Server System R1000WF Product Family Technical Product Specification
Figure 47. Intel® Integrated RAID Module
For a list of supported Intel Integrated RAID Module options, please visit the Intel® Server Configurator Tool
at https://serverconfigurator.intel.com.
Note: Intel® Integrated RAID Modules cannot be supported in systems configured with a CPU #1 processor
that supports the Integrated® Omni-Path Fabric connector.
6.5.1
Intel® RAID Maintenance Free Backup Unit (RMFBU) Support
The 1U system has support for one or two Intel® RAID Maintenance Free Backup Units (RMFBU).
Figure 48. Support for single Intel® RAID Maintenance Free Backup Unit (Standard Option)
75
Intel® Server System R1000WF Product Family Technical Product Specification
Support for two RMFBUs will require the use of an optional bracket capable of supporting stacked RMFBUs.
Intel Accessory Kit order code – AWTAUXBBUBKT
Figure 49. Support for dual Intel® RAID Maintenance Free Backup Units (Optional Accessory)
76
Intel® Server System R1000WF Product Family Technical Product Specification
7.
Front I/O Panel and Control Panel Overview
All system configurations include an I/O Panel and Control Panel and on the front of the system. This section
describes the features and functions of both.
7.1
I/O Panel Features
Video
USB 3.0
Figure 50. Front I/O Panel Features
Video Connector – The front I/O Panel video connector gives the option of attaching a monitor to the front
of the system. When BIOS detects that a monitor is attached to the front video connector, it disables the
video signals routed to the onboard video connector on the back of the system. Video resolution from the
front video connector may be lower than that of the rear onboard video connector. A short video cable
should be used for best resolution. The front video connector is cabled to a 2x7 header on the server
board labeled “FP Video”.
USB 2.0/3.0 Ports –The front I/O panel includes two, USB 2.0/3.0 ports. The USB ports are cabled to a Blue
2x5 connector on the server board labeled “FP_USB”.
** Note: Due to signal strength limits associated with USB 3.0 ports cabled to a front panel, some marginally
compliant USB 3.0 devices may not be supported from these ports. In addition, server systems based on
the Intel® Server Board S2600WF cannot be USB 3.0 certified with USB 3.0 ports cabled to a front panel.
7.2
Control Panel Features
The system includes a control panel that provides push button system controls and LED indicators for
several system features. This section will provide a description for each front control panel feature.
Figure 51. Front Control Panel Options
77
Intel® Server System R1000WF Product Family Technical Product Specification
System ID Button w/Integrated LED – Toggles the integrated ID LED and the Blue server board ID LED on
and off. The System ID LED is used to identify the system for maintenance when installed in a rack of similar
server systems. The System ID LED can also be toggled on and off remotely using the IPMI “Chassis Identify”
command which will cause the LED to blink for 15 seconds.
NMI Button – When the NMI button is pressed, it puts the server in a halt state and issues a non-maskable
interrupt (NMI). This can be useful when performing diagnostics for an issue where a memory download is
necessary to help determine the cause of the problem. To prevent an inadvertent system halt, the actual NMI
button is located behind the Front Control Panel faceplate where it is only accessible with the use of a small
tipped tool like a pin or paper clip.
Network Activity LEDs – The Front Control Panel includes an activity LED indicator for each onboard
Network Interface Controller (NIC). When a network link is detected, the LED will turn on solid. The LED will
blink when network activity occurs at a rate that is consistent with the amount of network activity that is
occurring.
System Cold Reset Button – When pressed, this button will reboot and re-initialize the system. To prevent
an inadvertent system reset, the actual Reset button is located behind the Front Control Panel faceplate
where it is only accessible with the use of a small tipped tool like a pin or paper clip.
System Status LED – The System Status LED is a bi-color (Green/Amber) indicator that shows the current
health of the server system. The system provides two locations for this feature; one is located on the Front
Control Panel, the other is located on the back edge of the server board, viewable from the back of the
system. Both LEDs are tied together and will show the same state. The System Status LED states are driven
by the onboard platform management subsystem. The following table provides a description of each
supported LED state.
Table 37. System Status LED State Definitions
LED State
System State
BIOS Status Description
Off
System is not operating.
Solid green
System is operating normally.





Blinking green
System is operating in a
degraded state although still
functioning, or system is
operating in a redundant state
but with an impending failure
warning.









78
System AC power is off.
System is in EuP Lot6 off mode.
System is in S5 soft-off state.
System is running (in S0 State) and its status is healthy. The system is not
exhibiting any errors. AC power is present and BMC has booted and
manageability functionality is up and running.
After a BMC reset, and in conjunction with the chassis ID solid on, the BMC is
booting Linux*. Control has been passed from BMC uBoot to BMC Linux*
itself. It is in this state for roughly 10-20 seconds.
Redundancy loss such as power-supply or fan. Applies only if the associated
platform sub-system has redundancy capabilities.
Fan warning or failure when the number of fully operational fans is less than
the minimum number needed to cool the system.
Non-critical threshold crossed – Temperature (including HSBP temp),
voltage, input power to power supply, output current for main power rail
from power supply and Processor Thermal Control (Therm Ctrl) sensors.
Power supply predictive failure occurred while redundant power supply
configuration was present.
Unable to use all of the installed memory (more than 1 DIMM installed).
Correctable Errors over a threshold and migrating to a spare DIMM (memory
sparing). This indicates that the system no longer has spared DIMMs (a
redundancy lost condition). Corresponding DIMM LED lit.
In mirrored configuration, when memory mirroring takes place and system
loses memory redundancy.
Battery failure.
BMC executing in uBoot. (Indicated by Chassis ID blinking at 3Hz). System in
degraded state (no manageability). BMC uBoot is running but has not
Intel® Server System R1000WF Product Family Technical Product Specification
Blinking amber
System is operating in a
degraded state with an
impending failure warning,
although still functioning.
System is likely to fail.









Solid amber
Critical/non-recoverable –
system is halted. Fatal alarm –
system has failed or shut
down.















transferred control to BMC Linux*. Server will be in this state 6-8 seconds
after BMC reset while it pulls the Linux* image into flash.
BMC Watchdog has reset the BMC.
Power Unit sensor offset for configuration error is asserted.
HDD HSC is off-line or degraded.
Critical threshold crossed – Voltage, temperature (including HSBP temp),
input power to power supply, output current for main power rail from power
supply and PROCHOT (Therm Ctrl) sensors.
VRD Hot asserted.
Minimum number of fans to cool the system not present or failed.
Hard drive fault.
Power Unit Redundancy sensor – Insufficient resources offset (indicates not
enough power supplies present).
In non-sparing and non-mirroring mode if the threshold of correctable
errors is crossed within the window.
CPU CATERR signal asserted.
MSID mismatch detected (CATERR also asserts for this case).
CPU 1 is missing.
CPU Thermal Trip.
No power good – power fault.
DIMM failure when there is only 1 DIMM present and hence no good
memory present.
Runtime memory uncorrectable error in non-redundant mode.
DIMM Thermal Trip or equivalent.
SSB Thermal Trip or equivalent.
CPU ERR2 signal asserted.
BMC/Video memory test failed. (Chassis ID shows blue/solid-on for this
condition.)
Both uBoot BMC firmware images are bad. (Chassis ID shows blue/solid-on
for this condition.)
240 VA fault.
Fatal Error in processor initialization:
o Processor family not identical
o Processor model not identical
o Processor core/thread counts not identical
o Processor cache size not identical
o Unable to synchronize processor frequency
o Unable to synchronize QPI link frequency
Uncorrectable memory error in a non-redundant mode.
Power/Sleep Button – Toggles the system power on and off. This button also functions as a sleep button if
enabled by an ACPI compliant operating system. Pressing this button will send a signal to the integrated
BMC, which will either power on or power off the system. The integrated LED is a single color (Green) and is
capable of supporting different indicator states as defined in the following table.
Table 38. Power/Sleep LED Functional States
State
Power-off
Power-on
S5
S0
Power Mode
Non-ACPI
Non-ACPI
ACPI
ACPI
LED
Off
On
Off
Steady On
Description
System power is off and the BIOS has not initialized the chipset
System power is on
Mechanical is off and the operating system has not saved any context to the hard disk
System and operating system are up and running.
Drive Activity LED – The drive activity LED on the front panel indicates drive activity from the onboard
storage controllers. The server board also provides a header giving access to this LED for add-in controllers.
79
Intel® Server System R1000WF Product Family Technical Product Specification
8.
PCIe* Riser Card Support
The server board provides three riser card slots identified as: Riser Slot #1, Riser Slot #2, and Riser Slot #3. In
a 1U system, PCIe* Add-in cards can only be installed into single slot riser cards installed to Riser Slots #1
and #2. Riser Slot #3 is not supported in a 1U system. Per the PCIe specification, each riser card slot can
support a maximum 75W of power. The PCIe* bus interface for each riser card slot is supported by each of
the two installed processors.
Note: The riser card slots are specifically designed to support riser cards only. Attempting to install a PCIe*
add-in card directly into a riser card slot on the server board may damage the server board, the add-in card,
or both.
Note: A dual processor configuration is required when using Riser Slot #2.
Riser Slot #3
x24 PCIe* 3.0
Riser #3
x24 PCIe* 3.0
Riser Slot #2
Riser #2
Riser #1
Riser Slot #1
No support in
1U
PCIe* Add-In Card
Support
PCIe* Add-In Card
Support
X12 PCIe* 3.0
X8 PCIe*
X16 PCIe* – CPU#1
CPU #2
+
+
X8 PCIe* – CPU#2
X24 PCIe* – CPU#2
X4 DMI
Figure 52. PCIe* Add-in Card Support
The following tables provide the PCIe* bus routing for all supported risers cards.
Table 39. Riser Slot #1 & #2 – PCIe* Root Port Mapping
Riser Slot #1 & #2 – Riser Card Options
1U - 1-Slot Riser Card, iPC – F1UL16RISER3APP
80
PCIe* Riser #1
PCIe* Riser #2
CPU #1 – Ports 1A thru 1D
CPU #2 – Ports 2A thru 2D
(x16 elec, x16 mech)
(x16 elec, x16 mech)
Intel® Server System R1000WF Product Family Technical Product Specification
Available 1U Riser Card:
One PCIe* add-in card slot – PCIe* x16, x16 mechanical
Figure 53. 1U One Slot PCIe* Riser Card (iPC – F1UL16RISER3APP)
Each riser card is mounted to a bracket assembly which is inserted into a riser card slot on the server board.
Figure 54. Add-in Card Support
Each riser card assembly has support for a single full height, ½ length PCIe* add-in card.
Note: Add-in cards that exceed the PCI specification for ½ length PCI add-in cards (167.65mm or 6.6in) may
interfere with other installed devices on the server board.
Figure 55. Riser Card Assembly
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Intel® Server System R1000WF Product Family Technical Product Specification
9.
OCP* Compatible Intel Ethernet Network Adapter Support
The Intel® Server Board S2600WF Product Family offers a line of LAN KR OCP mezzanine modules that
follows the OCP 2.0 form factor.
The optional OCP mezzanine module can be installed onto the connector (labeled “OCP_IO_Module”) on the
server board, as shown in the following illustration.
Figure 56. OCP Module Placement
Table 40. Supported Intel® OCP Modules
Description
Quad Port, 1GB, RJ45
Quad Port, SFP+
Dual Port, SFP+ (WFT Boards Only)
Dual Port, 10Gb RJ45 (WFT Boards Only)
Intel Product Code
I357T4OCPG1P5
X527DA4OCPG1P5
X527DA2OCPG1P5
X557T2OCPG1P5
Note: Only dual port SFP+ and dual port 10GB RJ45 OCP modules are supported on Intel® Server Board
S2600WFT.
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Intel® Server System R1000WF Product Family Technical Product Specification
10. Basic and Advanced Server Management Features
The integrated BMC has support for basic and advanced server management features. Basic management
features are available by default. Advanced management features are enabled with the addition of an
optionally installed Intel® Remote Management Module 4 Lite (Intel® RMM4 Lite) key.
Table 41. Intel® Remote Management Module 4 (RMM4) Options
Intel Product Code
AXXRMM4LITE2
Description
Intel® Remote Management Module 4 Lite
Kit Contents
RMM4 Lite Activation Key
Benefits
Enables KVM & media redirection
When the BMC firmware initializes, it attempts to access the Intel RMM4 Lite. If the attempt to access Intel
RMM4 Lite is successful, then the BMC activates the advanced features.
The following table identifies both Basic and Advanced server management features.
Table 42. Basic and Advanced Server Management Features Overview
Basic
Advanced
w/RMM4
Lite Key
IPMI 2.0 Feature Support
X
X
In-circuit BMC Firmware Update
X
X
FRB 2
X
X
Chassis Intrusion Detection
X
X
Fan Redundancy Monitoring
X
X
Hot-Swap Fan Support
X
X
Acoustic Management
X
X
Diagnostic Beep Code Support
X
X
Power State Retention
X
X
ARP/DHCP Support
X
X
PECI Thermal Management Support
X
X
E-mail Alerting
X
X
Embedded Web Server
X
X
SSH Support
X
X
Feature
Integrated KVM
X
Integrated Remote Media Redirection
X
Lightweight Directory Access Protocol (LDAP)
X
X
Intel® Intelligent Power Node Manager Support
X
X
SMASH CLP
X
X
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Intel® Server System R1000WF Product Family Technical Product Specification
On the server board the Intel® RMM4 Lite key is installed at the following location.
Intel® RMM4 Lite Key
Figure 57. Intel® RMM4 Lite Activation Key Placement
10.1 Dedicated Management Port
The server board includes a dedicated 1GbE, RJ45 Management Port. The management port is active with or
without the RMM4 Lite key installed.
RJ45 Management Port
Figure 58. Dedicated Management Port
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Intel® Server System R1000WF Product Family Technical Product Specification
10.2 Embedded Web Server
BMC base manageability provides an embedded web server and an OEM-customizable web GUI which
exposes the manageability features of the BMC base feature set. It is supported over all onboard NICs that
have management connectivity to the BMC, as well as an optional dedicated add-in management NIC. At
least two concurrent web sessions from up to two different users is supported. The embedded web user
interface supports the following client web browsers:

Microsoft Internet Explorer*

Mozilla Firefox*

Google Chrome*

Safari*
The embedded web user interface supports strong security (authentication, encryption, and firewall support) since it enables remote server configuration and control. The user interface presented by the embedded web user interface shall authenticate the user before allowing a web session to be initiated.
Encryption using 256-bit secure sockets layer (SSL) is supported. User authentication is based on user id and
password.
The GUI presented by the embedded web server authenticates the user before allowing a web session to be
initiated. It presents all functions to all users but disables those functions that the user does not have
privilege to execute. For example, if a user does not have privilege to power control, then the item shall be
displayed in a greyed-out font on that user’s UI display. The web GUI also provides a launch point for
advanced features, KVM and media redirection. These features are also grayed out in the GUI unless the
system has been updated to support these advanced features. The embedded web server displays US
English or Chinese language output only.
Additional features supported by the web GUI can

Present all the Basic features to the users

Power on/Power off/reset the server and view current power state

Display BIOS, BMC, ME and SDR version information

Display overall system health.

Display configuration of various IPMI over LAN parameters for both IPV4 and IPV6

Display configuration of alerts (SNMP and SMTP)

Display system asset information for the product, board, and chassis.

Display BMC-owned sensors (name, status, current reading, enabled thresholds), including colorcode status of sensors.

Provide ability to filter sensors based on sensor type (Voltage, Temperature, Fan and Power
supply related)

Automatically refresh of sensor data with a configurable refresh rate

Display online help

Display/clear SEL (display is in easily understandable human readable format)

Support major industry-standard browsers (Microsoft Internet Explorer* and Mozilla Firefox*)

Automatically time out the GUI session after a user-configurable inactivity period. By default, this
inactivity period is 30 minutes.

Using the Embedded Platform Debug feature, allow the user to initiate a “debug dump” to a file
that can be sent to Intel® for debug purposes
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Intel® Server System R1000WF Product Family Technical Product Specification

Employ the Virtual Front Panel to provide the same functionality as the local front panel. The
displayed LEDs match the current state of the local panel LEDs. The displayed buttons (for
example, power button) can be used in the same manner as the local buttons.

Display of ME sensor data. Only sensors that have associated SDRs loaded will be displayed.

Save the SEL to a file

Force HTTPS connectivity for greater security. This is provided through a configuration option in
the UI.

Display processor and memory information that is available over IPMI over LAN.

Get and set Node Manager (NM) power policies

Display power consumed by the server

View and configure VLAN settings

Warn users that the reconfiguration of IP address will cause a disconnect

Block logins for a period of time after several consecutive failed login attempts. The lock-out
period and the number of failed logins that initiates the lock-out period are configurable by the
user.

Employ Server Power Control to force boot-up into Setup on a reset

Report System POST results. The web server provides the system’s Power-On Self-Test (POST)
sequence for the previous two boot cycles, including timestamps. The timestamps may be
displayed as a time relative to the start of POST or the previous POST code.

Allow customization of ports. The web server provides the ability to customize the port numbers
used for SMASH, http, https, KVM, secure KVM, remote media, and secure remote media.
For additional information, refer to the Intel® Remote Management Module 4 and Integrated BMC Web
Console User Guide.
10.3 Advanced Management Feature Support (Intel® RMM4 Lite)
The integrated baseboard management controller has support for advanced management features which are
enabled when an optional Intel® Remote Management Module 4 Lite (RMM4 Lite) is installed. The Intel
RMM4-lite option offers convenient, remote KVM access and control through LAN and internet. It captures,
digitizes, and compresses video and transmits it with keyboard and mouse signals to and from a remote
computer. Remote access and control software runs in the integrated baseboard management controller,
utilizing expanded capabilities enabled by the Intel RMM4 hardware.
86

Key Features of the RMM4-lite enablement key are:
KVM redirection from either the dedicated management NIC or the server board NICs used for
management traffic; up to two KVM sessions. Automatically senses video resolution for best possible
screen capture, high performance mouse tracking and synchronization. It allows remote viewing and
configuration in pre-boot POST and BIOS setup.

Media Redirection – The media redirection feature is intended to allow system administrators or users
to mount a remote IDE or USB CDROM, floppy drive, or a USB flash disk as a remote device to the
server. Once mounted, the remote device appears just like a local device to the server allowing
system administrators or users to install software (including operating systems), copy files, update
BIOS, or boot the server from this device.
Intel® Server System R1000WF Product Family Technical Product Specification
10.3.1
Keyboard, Video, Mouse (KVM) Redirection
The BMC firmware supports keyboard, video, and mouse redirection (KVM) over LAN. This feature is available
remotely from the embedded web server as a Java applet. This feature is only enabled when the Intel® RMM4
Lite is present. The client system must have a Java Runtime Environment (JRE) version 6.0 or later to run the
KVM or media redirection applets.
The BMC supports an embedded KVM application (Remote Console) that can be launched from the
embedded web server from a remote console. USB1.1 or USB 2.0 based mouse and keyboard redirection are
supported. It is also possible to use the KVM-redirection (KVM-r) session concurrently with media-redirection
(media-r). This feature allows a user to interactively use the keyboard, video, and mouse (KVM) functions of
the remote server as if the user were physically at the managed server. KVM redirection console supports the
following keyboard layouts: English, Dutch, French, German, Italian, Russian, and Spanish.
KVM redirection includes a “soft keyboard” function. The “soft keyboard” is used to simulate an entire
keyboard that is connected to the remote system. The “soft keyboard” functionality supports the following
layouts: English, Dutch, French, German, Italian, Russian, and Spanish.
The KVM-redirection feature automatically senses video resolution for best possible screen capture and
provides high-performance mouse tracking and synchronization. It allows remote viewing and configuration
in pre-boot POST and BIOS setup, once BIOS has initialized video.
Other attributes of this feature include:

Encryption of the redirected screen, keyboard, and mouse

Compression of the redirected screen.

Ability to select a mouse configuration based on the OS type.

Support user definable keyboard macros.
KVM redirection feature supports the following resolutions and refresh rates:
10.3.2

640x480 at 60Hz, 72Hz, 75Hz, 85Hz, 100Hz

800x600 at 60Hz, 72Hz, 75Hz, 85Hz

1024x768 at 60Hx, 72Hz, 75Hz, 85Hz

1280x960 at 60Hz

1280x1024 at 60Hz

1600x1200 at 60Hz

1920x1080 (1080p) at 60Hz

1920x1200 (WUXGA+) at 60Hz

1650x1080 (WSXGA+) at 60Hz
Remote Console
The Remote Console is the redirected screen, keyboard and mouse of the remote host system. To use the
Remote Console window of your managed host system, the browser must include a Java* Runtime
Environment plug-in. If the browser has no Java support, such as with a small handheld device, the user can
maintain the remote host system using the administration forms displayed by the browser.
The Remote Console window is a Java Applet that establishes TCP connections to the BMC. The protocol
that is run over these connections is a unique KVM protocol and not HTTP or HTTPS. This protocol uses
ports #7578 for KVM, #5120 for CDROM media redirection, and #5123 for Floppy/USB media redirection.
When encryption is enabled, the protocol uses ports #7582 for KVM, #5124 for CDROM media redirection,
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Intel® Server System R1000WF Product Family Technical Product Specification
and #5127 for Floppy/USB media redirection. The local network environment must permit these
connections to be made, that is, the firewall and, in case of a private internal network, the NAT (Network
Address Translation) settings have to be configured accordingly.
10.3.3
Performance
The remote display accurately represents the local display. The feature adapts to changes to the video
resolution of the local display and continues to work smoothly when the system transitions from graphics to
text or vice-versa. The responsiveness may be slightly delayed depending on the bandwidth and latency of
the network.
Enabling KVM and/or media encryption will degrade performance. Enabling video compression provides the
fastest response while disabling compression provides better video quality.
For the best possible KVM performance, a 2Mb/sec link or higher is recommended.
The redirection of KVM over IP is performed in parallel with the local KVM without affecting the local KVM
operation.
10.3.4
Availability
The remote KVM session is available even when the server is powered off (in stand-by mode). No restart of
the remote KVM session shall be required during a server reset or power on/off. A BMC reset (for example,
due to a BMC Watchdog initiated reset or BMC reset after BMC FW update) will require the session to be reestablished. KVM sessions persist across system reset, but not across an AC power loss.
10.3.5
Security
The KVM redirection feature supports multiple encryption algorithms, including RC4 and AES. The actual
algorithm that is used is negotiated with the client based on the client’s capabilities.
10.3.6
Usage
As the server is powered up, the remote KVM session displays the complete BIOS boot process. The user is
able interact with BIOS setup, change and save settings as well as enter and interact with option ROM
configuration screens.
10.3.7
Force-enter BIOS Setup
KVM redirection can present an option to force-enter BIOS Setup. This enables the system to enter F2 setup
while booting which is often missed by the time the remote console redirects the video.
10.3.8
Media Redirection
The embedded web server provides a Java applet to enable remote media redirection. This may be used in
conjunction with the remote KVM feature, or as a standalone applet.
The media redirection feature is intended to allow system administrators or users to mount a remote IDE or
USB CD-ROM, floppy drive, or a USB flash disk as a remote device to the server. Once mounted, the remote
device appears just like a local device to the server, allowing system administrators or users to install
software (including operating systems), copy files, update BIOS, and so on, or boot the server from this
device.
The following capabilities are supported:
88

The operation of remotely mounted devices is independent of the local devices on the server. Both
remote and local devices are usable in parallel.

Either IDE (CD-ROM, floppy) or USB devices can be mounted as a remote device to the server.
Intel® Server System R1000WF Product Family Technical Product Specification

It is possible to boot all supported operating systems from the remotely mounted device and to boot
from disk IMAGE (*.IMG) and CD-ROM or DVD-ROM ISO files. See the Tested/supported Operating
System List for more information.

Media redirection supports redirection for both a virtual CD device and a virtual Floppy/USB device
concurrently. The CD device may be either a local CD drive or else an ISO image file; the Floppy/USB
device may be either a local Floppy drive, a local USB device, or else a disk image file.

The media redirection feature supports multiple encryption algorithms, including RC4 and AES. The
actual algorithm that is used is negotiated with the client based on the client’s capabilities.

A remote media session is maintained even when the server is powered off (in standby mode). No
restart of the remote media session is required during a server reset or power on/off. An BMC reset
(for example, due to an BMC reset after BMC FW update) will require the session to be re-established

The mounted device is visible to (and usable by) managed system’s OS and BIOS in both pre-boot
and post-boot states.

The mounted device shows up in the BIOS boot order and it is possible to change the BIOS boot
order to boot from this remote device.

It is possible to install an operating system on a bare metal server (no OS present) using the remotely
mounted device. This may also require the use of KVM-r to configure the OS during install.
USB storage devices will appear as floppy disks over media redirection. This allows for the installation of
device drivers during OS installation.
If either a virtual IDE or virtual floppy device is remotely attached during system boot, both the virtual IDE
and virtual floppy are presented as bootable devices. It is not possible to present only a single-mounted
device type to the system BIOS.
10.3.8.1
Availability
The default inactivity timeout is 30 minutes and is not user-configurable. Media redirection sessions persist
across system reset but not across an AC power loss or BMC reset.
10.3.8.2
Network Port Usage
The KVM and media redirection features use the following ports:

5120 – CD Redirection

5123 – FD Redirection

5124 – CD Redirection (Secure)

5127 – FD Redirection (Secure)

7578 – Video Redirection

7582 – Video Redirection (Secure)
For additional information, reference the Intel® Remote Management Module 4 and Integrated BMC Web
Console Users Guide.
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Intel® Server System R1000WF Product Family Technical Product Specification
Appendix A. Integration and Usage Tips
This section provides a list of useful information that is unique to the Intel® Server System R1000WF Product
Family and should be kept in mind while configuring your server system.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
90
Intel highly recommends that system integrators and system service personnel reference the Intel®
Server System R1000WF Product Family System Integration and Service Guide for complete system
assembly and component installation and removal instructions.
The process to install and remove processors has changed from all previous generation Intel Server
Systems. Before attempting to install or remove a processor for the first time, Intel highly recommends
that system integrators and system service personnel reference the Intel® Server System R1000WF
Product Family System Integration and Service Guide for complete processor installation and removal
instructions
When adding or removing components or peripherals, power cords must be disconnected from the
server. With power applied to the server, standby voltages are still present even though the server board
is powered off.
This server board supports the Intel® Xeon® processor Scalable family with a Thermal Design Power
(TDP) of up to and including 165 Watts in the 1U Intel Server System product family. Previous
generations of the Intel® Xeon® processors and their heat sinks, are not supported in this product family.
Processors must be installed in order. CPU 1 must be populated for the server board to operate.
To support proper air flow and system thermals when the system is operational, both processor heat
sinks must be installed, regardless of whether the system is configured with two processors or not.
To support proper air flow and system thermals when the system is operational, all 1U system
configurations must have specific DIMM slots populated with a DIMM or supplied DIMM blank. See
Section 4.1 for complete System Thermal Configuration requirements.
The riser card slots on the server board are specifically designed to support riser cards only. Attempting
to install a PCIe* add-in card directly into a riser card slot on the server board may damage the server
board, the add-in card, or both.
This server board only supports DDR4 ECC RDIMM – Registered (Buffered) DIMMS and DDR4 ECC
LRDIMM – Load Reduced DIMMs.
For the best performance, the number of DDR4 DIMMs installed should be balanced across both
processor sockets and memory channels.
On the back edge of the server board is a bank of eight diagnostic LEDs (4 Green and 4 Amber) that
display POST Codes when the system is first powered-on or reset. If the server board hangs during POST,
the LEDs display the last POST event run before the hang. See Appendix B to determine how to decode
the Diagnostic LEDs when the system is locked during the POST process.
The System Status LED will be set to a steady Amber color for all Fatal Errors that are detected during
processor initialization. A steady Amber System Status LED indicates that an unrecoverable system
failure condition has occurred
The FRUSDR utility must be run as part of the initial platform integration process before it is deployed
into a live operating environment. Once the initial FRU and SDR data is loaded on to the system, all
subsequent system configuration changes will automatically update SDR data using the BMC auto
configuration feature, without having to run the FRUSDR utility again. However, to ensure the latest
sensor data is installed, the SDR data should be updated to the latest available as part of a planned
system software update.
Make sure the latest system software is loaded on the server. This includes System BIOS, BMC Firmware,
ME Firmware and FRU/SDR data. The latest system software can be downloaded from
http://downloadcenter.intel.com.
Intel® Server System R1000WF Product Family Technical Product Specification
Appendix B. POST Code Diagnostic LED Decoder
As an aid to assist in troubleshooting a system hang that occurs during a system’s Power-On Self-Test
(POST) process, the server board includes a bank of eight POST Code Diagnostic LEDs on the back edge of
the server board, as shown in the illustration below.
During the system boot process, Memory Reference Code (MRC) and System BIOS execute a number of
memory initialization and platform configuration processes, each of which is assigned a hex POST code
number.
As each routine is started, the given POST code number is displayed to the POST Code Diagnostic LEDs on
the back edge of the server board.
During a POST system hang, the displayed POST code can be used to identify the last POST routine that was
run prior to the error occurring, helping to isolate the possible cause of the hang condition.
Each POST code is represented by eight LEDs; four Green and four Amber. The POST codes are divided into
two nibbles, an upper nibble and a lower nibble. The upper nibble bits are represented by Amber Diagnostic
LEDs and the lower nibble bits are represented by Green Diagnostic LEDs. If the bit is set in the upper and
lower nibbles, the corresponding LED is lit. If the bit is clear, the corresponding LED is off.
Note: Diag LEDs are best read and decoded when viewing the LEDs from the back of the system
Upper Nibble (Amber)
(Read 1st)
8h 4h 2h 1h
Lower Nibble (Green)
(Read 2nd)
8h
4h 2h 1h
Figure 59. POST Diagnostic LED Location
In the following example, the BIOS sends a value of AC to the diagnostic LED decoder. The LEDs are decoded
as shown in the table below, where the upper nibble bits represented by the amber LEDs equal 1010b or Ah
and the lower nibble bits represented by the green LEDs equal 1100b or Ch. The two are concatenated as
ACh.
Table 43. POST Progress Code LED Example
Upper Nibble
Lower Nibble
LED 3
(MSB)
LED 2
LED 1
LED 0
(LSB)
Binary
Code
Hex
Code
LED 3
(MSB)
LED 2
LED 1
LED 0
(LSB)
Binary
Code
Hex
Code
ON
off
ON
off
1010
A
ON
ON
off
off
1100
C
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Intel® Server System R1000WF Product Family Technical Product Specification
B.1.
Early POST Memory Initialization MRC Diagnostic Codes
Memory initialization at the beginning of POST includes multiple functions: discovery, channel training,
validation that the DIMM population is acceptable and functional, initialization of the IMC and other
hardware settings, and initialization of applicable RAS configurations.
The MRC Progress Codes are displayed to the Diagnostic LEDs that show the execution point in the MRC
operational path at each step.
Table 44. MRC Progress Codes
Diagnostic LED Decoder
1 = LED On, 0 = LED Off
Checkpoint
Upper Nibble
Lower Nibble
(Amber)
(Green)
MSB
8h
Description
LSB
4h
2h
1h
8h
4h
2h
1h
MRC Progress Codes
B0h
1
0
1
1
0
0
0
0
Detect DIMM population
B1h
1
0
1
1
0
0
0
1
Set DDR4 frequency
B2h
1
0
1
1
0
0
1
0
Gather remaining SPD data
B3h
1
0
1
1
0
0
1
1
Program registers on the memory controller level
B4h
1
0
1
1
0
1
0
0
Evaluate RAS modes and save rank information
B5h
1
0
1
1
0
1
0
1
Program registers on the channel level
B6h
1
0
1
1
0
1
1
0
Perform the JEDEC defined initialization sequence
B7h
1
0
1
1
0
1
1
1
Train DDR4 ranks
B8h
1
0
1
1
1
0
0
0
Initialize CLTT/OLTT
B9h
1
0
1
1
1
0
0
1
Hardware memory test and init
BAh
1
0
1
1
1
0
1
0
Execute software memory init
BBh
1
0
1
1
1
0
1
1
Program memory map and interleaving
BCh
1
0
1
1
1
1
0
0
Program RAS configuration
BFh
1
0
1
1
1
1
1
1
MRC is done
Should a major memory initialization error occur, preventing the system from booting with data integrity, a
beep code is generated, the MRC displays a fatal error code on the diagnostic LEDs, and a system halt
command is executed. Fatal MRC error halts do NOT change the state of the system status LED and they do
NOT get logged as SEL events.
The following table lists all MRC fatal errors that are displayed to the diagnostic LEDs.
Note: Fatal MRC errors will display POST error codes that may be the same as BIOS POST progress codes
displayed later in the POST process. The fatal MRC codes can be distinguished from the BIOS POST progress
codes by the accompanying memory failure beep code of 3 long beeps as identified in Table 48.
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Intel® Server System R1000WF Product Family Technical Product Specification
Table 45. MRC Fatal Error Codes
Diagnostic LED Decoder
1 = LED On, 0 = LED Off
Checkpoint
Upper Nibble
Lower Nibble
(Amber - Read 1st)
(Green - Read 2nd)
MSB
8h
Description
LSB
4h
2h
1h
8h
4h
2h
1h
MRC Fatal Error Codes
No usable memory error
E8h
1
1
1
0
1
0
0
0
01h = No memory was detected from SPD read, or invalid config that
causes no operable memory.
02h = Memory DIMMs on all channels of all sockets are disabled due to
hardware memtest error.
03h = No memory installed. All channels are disabled.
E9h
1
1
1
0
1
0
0
1
Memory is locked by Intel Trusted Execution Technology and is
inaccessible
DDR4 channel training error
01h = Error on read DQ/DQS (Data/Data Strobe) init
EAh
1
1
1
0
1
0
1
0
02h = Error on Receive Enable
03h = Error on Write Leveling
04h = Error on write DQ/DQS (Data/Data Strobe
Memory test failure
EBh
1
1
1
0
1
0
1
1
01h = Software memtest failure.
02h = Hardware memtest failed.
DIMM configuration population error
01h = Different DIMM types (RDIMM, LRDIMM) are detected installed in
the system.
EDh
1
1
1
0
1
1
0
1
02h = Violation of DIMM population rules.
03h = The 3rd DIMM slot cannot be populated when QR DIMMs are
installed.
04h = UDIMMs are not supported.
05h = Unsupported DIMM Voltage.
EFh
1
1
1
0
1
1
1
1
Indicates a CLTT table structure error
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Intel® Server System R1000WF Product Family Technical Product Specification
B.2.
BIOS POST Progress Codes
The following table provides a list of all POST progress codes.
Table 46. POST Progress Codes
Diagnostic LED Decoder
1 = LED On, 0 = LED Off
Checkpoint
Upper Nibble
(Amber - Read
Lower Nibble
1st)
(Green - Read 2nd)
MSB
Description
LSB
8h
4h
2h
1h
8h
4h
2h
1h
01h
0
0
0
0
0
0
0
1
First POST code after CPU reset
02h
0
0
0
0
0
0
1
0
Microcode load begin
03h
0
0
0
0
0
0
1
1
CRAM initialization begin
04h
0
0
0
0
0
1
0
0
EI Cache When Disabled
05h
0
0
0
0
0
1
0
1
SEC Core at Power on Begin
06h
0
0
0
0
0
1
1
0
Early CPU initialization during Sec Phase.
SEC Phase
UPI RC (Fully leverage without platform change)
A1h
1
0
1
0
0
0
0
1
Collect info such as SBSP, Boot Mode, Reset type etc
A3h
1
0
1
0
0
0
1
1
Setup minimum path between SBSP & other sockets
A7h
1
0
1
0
0
1
1
1
Topology discovery and route calculation
A8h
1
0
1
0
1
0
0
0
Program final route
A9h
1
0
1
0
1
0
0
1
Program final IO SAD setting
AAh
1
0
1
0
1
0
1
0
Protocol layer and other uncore settings
ABh
1
0
1
0
1
0
1
1
Transition links to full speed operation
ACh
1
0
1
0
1
1
0
0
Phy layer setting
ADh
1
0
1
0
1
1
0
1
Link layer settings
AEh
1
0
1
0
1
1
1
0
Coherency settings
AFh
1
0
1
0
1
1
1
1
UPI initialization done
07h
0
0
0
0
0
1
1
1
Early SB initialization during Sec Phase.
08h
0
0
0
0
1
0
0
0
Early NB initialization during Sec Phase.
09h
0
0
0
0
1
0
0
1
End Of Sec Phase.
0Eh
0
0
0
0
1
1
1
0
Microcode Not Found.
0Fh
0
0
0
0
1
1
1
1
Microcode Not Loaded.
10h
0
0
0
1
0
0
0
0
PEI Core
11h
0
0
0
1
0
0
0
1
CPU PEIM
15h
0
0
0
1
0
1
0
1
NB PEIM
19h
0
0
0
1
1
0
0
1
SB PEIM
PEI Phase
MRC Progress Codes
94
Intel® Server System R1000WF Product Family Technical Product Specification
Diagnostic LED Decoder
1 = LED On, 0 = LED Off
Checkpoint
Upper Nibble
(Amber - Read
Lower Nibble
1st)
(Green - Read 2nd)
MSB
Description
LSB
8h
4h
2h
1h
8h
4h
2h
1h
31h
0
0
1
1
0
0
0
1
Memory Installed
32h
0
0
1
1
0
0
1
0
CPU PEIM (CPU Init)
33h
0
0
1
1
0
0
1
1
CPU PEIM (Cache Init)
4Fh
0
1
0
0
1
1
1
1
Dxe IPL started
60h
0
1
1
0
0
0
0
0
DXE Core started
61h
0
1
1
0
0
0
0
1
DXE NVRAM Init
62h
0
1
1
0
0
0
1
0
DXE Setup Init
63h
0
1
1
0
0
0
1
1
DXE CPU Init
65h
0
1
1
0
0
1
0
1
DXE CPU BSP Select
66h
0
1
1
0
0
1
1
0
DXE CPU AP Init
68h
0
1
1
0
1
0
0
0
DXE PCI Host Bridge Init
69h
0
1
1
0
1
0
0
1
DXE NB Init
6Ah
0
1
1
0
1
0
1
0
DXE NB SMM Init
70h
0
1
1
1
0
0
0
0
DXE SB Init
71h
0
1
1
1
0
0
0
1
DXE SB SMM Init
72h
0
1
1
1
0
0
1
0
DXE SB devices Init
78h
0
1
1
1
1
0
0
0
DXE ACPI Init
79h
0
1
1
1
1
0
0
1
DXE CSM Init
80h
1
0
0
0
0
0
0
0
DXE BDS Started
81h
1
0
0
0
0
0
0
1
DXE BDS connect drivers
82h
1
0
0
0
0
0
1
0
DXE PCI Bus begin
83h
1
0
0
0
0
0
1
1
DXE PCI Bus HPC Init
84h
1
0
0
0
0
1
0
0
DXE PCI Bus enumeration
85h
1
0
0
0
0
1
0
1
DXE PCI Bus resource requested
86h
1
0
0
0
0
1
1
0
DXE PCI Bus assign resource
87h
1
0
0
0
0
1
1
1
DXE CON_OUT connect
88h
1
0
0
0
1
0
0
0
DXE CON_IN connect
89h
1
0
0
0
1
0
0
1
DXE SIO Init
8Ah
1
0
0
0
1
0
1
0
DXE USB start
8Bh
1
0
0
0
1
0
1
1
DXE USB reset
8Ch
1
0
0
0
1
1
0
0
DXE USB detect
8Dh
1
0
0
0
1
1
0
1
DXE USB enable
91h
1
0
0
1
0
0
0
1
DXE IDE begin
DXE Phase
95
Intel® Server System R1000WF Product Family Technical Product Specification
Diagnostic LED Decoder
1 = LED On, 0 = LED Off
Checkpoint
Upper Nibble
(Amber - Read
Lower Nibble
1st)
(Green - Read 2nd)
MSB
Description
LSB
8h
4h
2h
1h
8h
4h
2h
1h
92h
1
0
0
1
0
0
1
0
DXE IDE reset
93h
1
0
0
1
0
0
1
1
DXE IDE detect
94h
1
0
0
1
0
1
0
0
DXE IDE enable
95h
1
0
0
1
0
1
0
1
DXE SCSI begin
96h
1
0
0
1
0
1
1
0
DXE SCSI reset
97h
1
0
0
1
0
1
1
1
DXE SCSI detect
98h
1
0
0
1
1
0
0
0
DXE SCSI enable
99h
1
0
0
1
1
0
0
1
DXE verifying SETUP password
9Bh
1
0
0
1
1
0
1
1
DXE SETUP start
9Ch
1
0
0
1
1
1
0
0
DXE SETUP input wait
9Dh
1
0
0
1
1
1
0
1
DXE Ready to Boot
9Eh
1
0
0
1
1
1
1
0
DXE Legacy Boot
9Fh
1
0
0
1
1
1
1
1
DXE Exit Boot Services
C0h
1
1
0
0
0
0
0
0
RT Set Virtual Address Map Begin
C2h
1
1
0
0
0
0
1
0
DXE Legacy Option ROM init
C3h
1
1
0
0
0
0
1
1
DXE Reset system
C4h
1
1
0
0
0
1
0
0
DXE USB Hot plug
C5h
1
1
0
0
0
1
0
1
DXE PCI BUS Hot plug
C6h
1
1
0
0
0
1
1
0
DXE NVRAM cleanup
C7h
1
1
0
0
0
1
1
1
DXE ACPI Enable
0h
0
0
0
0
0
0
0
0
Clear POST Code
40h
0
1
0
0
0
0
0
0
S3 Resume PEIM (S3 started)
41h
0
1
0
0
0
0
0
1
S3 Resume PEIM (S3 boot script)
42h
0
1
0
0
0
0
1
0
S3 Resume PEIM (S3 Video Repost)
43h
0
1
0
0
0
0
1
1
S3 Resume PEIM (S3 OS wake)
46h
0
1
0
0
0
1
1
0
PEIM which detected forced Recovery condition
47h
0
1
0
0
0
1
1
1
PEIM which detected User Recovery condition
48h
0
1
0
0
1
0
0
0
Recovery PEIM (Recovery started)
49h
0
1
0
0
1
0
0
1
Recovery PEIM (Capsule found)
4Ah
0
1
0
0
1
0
1
0
Recovery PEIM (Capsule loaded)
E8h
1
1
1
0
1
0
0
0
No Usable Memory Error:
S3 Resume
BIOS Recovery
96
Intel® Server System R1000WF Product Family Technical Product Specification
Diagnostic LED Decoder
1 = LED On, 0 = LED Off
Checkpoint
Upper Nibble
(Amber - Read
Lower Nibble
1st)
(Green - Read 2nd)
MSB
Description
LSB
8h
4h
2h
1h
8h
4h
2h
1h
E9h
1
1
1
0
1
0
0
1
Memory is locked by Intel® Trusted Execution Technology and is
inaccessible.
EAh
1
1
1
0
1
0
1
0
DDR4 Channel Training Error:
EBh
1
1
1
0
1
0
1
1
Memory Test Failure
EDh
1
1
1
0
1
1
0
1
DIMM Configuration/Population Error
EFh
1
1
1
0
1
1
1
1
Indicates a CLTT table structure error
B0h
1
0
1
1
0
0
0
0
Detect DIMM population
B1h
1
0
1
1
0
0
0
1
Set DDR4 frequency
B2h
1
0
1
1
0
0
1
0
Gather remaining SPD data
B3h
1
0
1
1
0
0
1
1
Program registers on the memory controller level
B4h
1
0
1
1
0
1
0
0
Evaluate RAS modes and save rank information
B5h
1
0
1
1
0
1
0
1
Program registers on the channel level
B6h
1
0
1
1
0
1
1
0
Perform the JEDEC defined initialization sequence
B7h
1
0
1
1
0
1
1
1
Train DDR4 ranks
B8h
1
0
1
1
1
0
0
0
Initialize CLTT/OLTT
B9h
1
0
1
1
1
0
0
1
Hardware memory test and init
BAh
1
0
1
1
1
0
1
0
Execute software memory init
BBh
1
0
1
1
1
0
1
1
Program memory map and interleaving
BCh
1
0
1
1
1
1
0
0
Program RAS configuration
BFh
1
0
1
1
1
1
1
1
MRC is done
97
Intel® Server System R1000WF Product Family Technical Product Specification
Appendix C. POST Code Errors
Most error conditions encountered during POST are reported using POST Error Codes. These codes
represent specific failures, warnings, or are informational. POST Error Codes may be displayed in the Error
Manager screen, and are always logged to the System Event Log (SEL). Logged events are available to
System Management applications, including Remote and Out of Band (OOB) management.
There are exception cases in early initialization where system resources are not adequately initialized for
handling POST Error Code reporting. These cases are primarily Fatal Error conditions resulting from
initialization of processors and memory and are handed by a Diagnostic LED display with a system halt.
The following table lists the supported POST Error Codes. Each error code is assigned an error type which
determines the action the BIOS will take when the error is encountered. Error types include Minor, Major,
and Fatal. The BIOS action for each is defined as follows:
•
•
•
Minor: The error message is displayed on the screen or on the Error Manager screen, and an error is
logged to the SEL. The system continues booting in a degraded state. The user may want to replace the
erroneous unit. The POST Error Pause option setting in the BIOS setup does not have any effect on this
error.
Major: The error message is displayed on the Error Manager screen, and an error is logged to the SEL.
The POST Error Pause option setting in the BIOS setup determines whether the system pauses to the
Error Manager for this type of error so the user can take immediate corrective action or the system
continues booting.
Note that for 0048 “Password check failed”, the system halts, and then after the next reset/reboot will
display the error code on the Error Manager screen.
Fatal: The system halts during post at a blank screen with the text “Unrecoverable fatal error found.
System will not boot until the error is resolved” and “Press <F2> to enter setup” The POST Error Pause
option setting in the BIOS setup does not have any effect with this class of error.
When the operator presses the F2 key on the keyboard, the error message is displayed on the Error
Manager screen, and an error is logged to the SEL with the error code. The system cannot boot unless the
error is resolved. The user needs to replace the faulty part and restart the system.
Note: The POST error codes in the following table are common to all current generation Intel server
platforms. Features present on a given server board/system will determine which of the listed error codes
are supported.
98
Intel® Server System R1000WF Product Family Technical Product Specification
Table 47. POST Error Messages and Handling
Error Code
Error Message
0012
System RTC date/time not set
Action Message
Response
Major
0048
Password check failed
0140
PCI component encountered a PERR error
Please put right password.
Major
Major
0141
PCI resource conflict
Major
Please enable Memory
PCI out of resources error
Mapped I/O above 4 GB item at SETUP to
use 64bit MMIO.
Major
0191
Processor core/thread count mismatch detected
Please use identical CPU type.
Fatal
0192
Processor cache size mismatch detected
Please use identical CPU type.
Fatal
0194
Processor family mismatch detected
Please use identical CPU type.
Fatal
0195
Processor Intel(R) UPI link frequencies unable to
synchronize
0196
Processor model mismatch detected
Please use identical CPU type.
Fatal
0197
Processor frequencies unable to synchronize
Please use identical CPU type.
Fatal
5220
BIOS Settings reset to default settings
5221
Passwords cleared by jumper
0146
Fatal
Major
Major
Recommend to remind user to install
BIOS password as BIOS admin password
is the master keys for several BIOS
security features.
5224
Password clear jumper is Set
8130
Processor 01 disabled
Major
8131
Processor 02 disabled
Major
8160
Processor 01 unable to apply microcode update
Major
8161
Processor 02 unable to apply microcode update
Major
8170
Processor 01 failed self-test (BIST)
Major
Major
8171
Processor 02 failed self-test (BIST)
Major
8180
Processor 01 microcode update not found
Minor
8181
Processor 02 microcode update not found
Minor
8190
Watchdog timer failed on last boot
Major
8198
OS boot watchdog timer failure
Major
8300
Baseboard management controller failed self-test
Major
8305
Hot Swap Controller failure
Major
83A0
Management Engine (ME) failed self-test
Major
83A1
Management Engine (ME) Failed to respond
Major
84F2
Baseboard management controller failed to respond
Major
84F3
Baseboard management controller in update mode
Major
84F4
Sensor data record empty
Please update right SDR.
Major
84FF
System event log full
Please clear SEL through EWS or
SELVIEW utility.
Minor
8500
Memory component could not be configured in the
selected RAS mode
8501
DIMM Population Error
Please plug DIMM at right population.
Major
8520
CPU1_DIMM_A1 failed test/initialization
Please remove the disabled DIMM.
Major
8521
CPU1_DIMM_A2 failed test/initialization
Please remove the disabled DIMM.
Major
8522
CPU1_DIMM_A3 failed test/initialization
Please remove the disabled DIMM.
Major
8523
CPU1_DIMM_B1 failed test/initialization
Please remove the disabled DIMM.
Major
Major
99
Intel® Server System R1000WF Product Family Technical Product Specification
8524
CPU1_DIMM_B2 failed test/initialization
Please remove the disabled DIMM.
Major
8525
CPU1_DIMM_B3 failed test/initialization
Please remove the disabled DIMM.
Major
8526
CPU1_DIMM_C1 failed test/initialization
Please remove the disabled DIMM.
Major
8527
CPU1_DIMM_C2 failed test/initialization
Please remove the disabled DIMM.
Major
8528
CPU1_DIMM_C3 failed test/initialization
Please remove the disabled DIMM.
Major
8529
CPU1_DIMM_D1 failed test/initialization
Please remove the disabled DIMM.
Major
852A
CPU1_DIMM_D2 failed test/initialization
Please remove the disabled DIMM.
Major
852B
CPU1_DIMM_D3 failed test/initialization
Please remove the disabled DIMM.
Major
852C
CPU1_DIMM_E1 failed test/initialization
Please remove the disabled DIMM.
Major
852D
CPU1_DIMM_E2 failed test/initialization
Please remove the disabled DIMM.
Major
852E
CPU1_DIMM_E3 failed test/initialization
Please remove the disabled DIMM.
Major
852F
CPU1_DIMM_F1 failed test/initialization
Please remove the disabled DIMM.
Major
8530
CPU1_DIMM_F2 failed test/initialization
Please remove the disabled DIMM.
Major
8531
CPU1_DIMM_F3 failed test/initialization
Please remove the disabled DIMM.
Major
8532
CPU1_DIMM_G1 failed test/initialization
Please remove the disabled DIMM.
Major
8533
CPU1_DIMM_G2 failed test/initialization
Please remove the disabled DIMM.
Major
854A
CPU1_DIMM_D2 disabled
Please remove the disabled DIMM.
Major
854B
CPU1_DIMM_D3 disabled
Please remove the disabled DIMM.
Major
854C
CPU1_DIMM_E1 disabled
Please remove the disabled DIMM.
Major
854D
CPU1_DIMM_E2 disabled
Please remove the disabled DIMM.
Major
854E
CPU1DIMM_E3 disabled
Please remove the disabled DIMM.
Major
854F
CPU1DIMM_F1 disabled
Please remove the disabled DIMM.
Major
8550
CPU1DIMM_F2 disabled
Please remove the disabled DIMM.
Major
8551
CPU1DIMM_F3 disabled
Please remove the disabled DIMM.
Major
8552
CPU1DIMM_G1 disabled
Please remove the disabled DIMM.
Major
8553
CPU1DIMM_G2 disabled
Please remove the disabled DIMM.
Major
8554
CPU1DIMM_G3 disabled
Please remove the disabled DIMM.
Major
8555
CPU1DIMM_H1 disabled
Please remove the disabled DIMM.
Major
8556
CPU1DIMM_H2 disabled
Please remove the disabled DIMM.
Major
8557
CPU1DIMM_H3 disabled
Please remove the disabled DIMM.
Major
8558
CPU2_DIMM_A1 disabled
Please remove the disabled DIMM.
Major
8559
CPU2_DIMM_A2 disabled
Please remove the disabled DIMM.
Major
855A
CPU2_DIMM_A3 disabled
Please remove the disabled DIMM.
Major
855B
CPU2_DIMM_B1 disabled
Please remove the disabled DIMM.
Major
855C
CPU2_DIMM_B2 disabled
Please remove the disabled DIMM.
Major
855D
CPU2_DIMM_B3 disabled
Please remove the disabled DIMM.
Major
855E
CPU2_DIMM_C1 disabled
Please remove the disabled DIMM.
Major
CPU2_DIMM_C2 disabled
Please remove the disabled DIMM.
Major
855F
(Go to
85D0)
8560
CPU1_DIMM_A1 encountered a Serial Presence
Detection (SPD) failure
Major
8561
CPU1_DIMM_A2 encountered a Serial Presence
Detection (SPD) failure
Major
8562
CPU1_DIMM_A3 encountered a Serial Presence
Detection (SPD) failure
Major
8563
CPU1_DIMM_B1 encountered a Serial Presence
Detection (SPD) failure
Major
100
Intel® Server System R1000WF Product Family Technical Product Specification
8564
CPU1_DIMM_B2 encountered a Serial Presence
Detection (SPD) failure
Major
8565
CPU1_DIMM_B3 encountered a Serial Presence
Detection (SPD) failure
Major
8566
CPU1_DIMM_C1 encountered a Serial Presence
Detection (SPD) failure
Major
8567
CPU1_DIMM_C2 encountered a Serial Presence
Detection (SPD) failure
Major
8568
CPU1_DIMM_C3 encountered a Serial Presence
Detection (SPD) failure
Major
8569
CPU1_DIMM_D1 encountered a Serial Presence
Detection (SPD) failure
Major
856A
CPU1_DIMM_D2 encountered a Serial Presence
Detection (SPD) failure
Major
856B
CPU1_DIMM_D3 encountered a Serial Presence
Detection (SPD) failure
Major
856C
CPU1_DIMM_E1 encountered a Serial Presence
Detection (SPD) failure
Major
856D
CPU1_DIMM_E2 encountered a Serial Presence
Detection (SPD) failure
Major
856E
CPU1_DIMM_E3 encountered a Serial Presence
Detection (SPD) failure
Major
856F
CPU1_DIMM_F1 encountered a Serial Presence
Detection (SPD) failure
Major
8570
CPU1_DIMM_F2 encountered a Serial Presence
Detection (SPD) failure
Major
8571
CPU1_DIMM_F3 encountered a Serial Presence
Detection (SPD) failure
Major
8572
CPU1_DIMM_G1 encountered a Serial Presence
Detection (SPD) failure
Major
8573
CPU1_DIMM_G2 encountered a Serial Presence
Detection (SPD) failure
Major
8574
CPU1_DIMM_G3 encountered a Serial Presence
Detection (SPD) failure
Major
8575
CPU1_DIMM_H1 encountered a Serial Presence
Detection (SPD) failure
Major
8576
CPU1_DIMM_H2 encountered a Serial Presence
Detection (SPD) failure
Major
8577
CPU1_DIMM_H3 encountered a Serial Presence
Detection (SPD) failure
Major
8578
CPU2_DIMM_A1 encountered a Serial Presence
Detection (SPD) failure
Major
8579
CPU2_DIMM_A2 encountered a Serial Presence
Detection (SPD) failure
Major
857A
CPU2_DIMM_A3 encountered a Serial Presence
Detection (SPD) failure
Major
857B
CPU2_DIMM_B1 encountered a Serial Presence
Detection (SPD) failure
Major
857C
CPU2_DIMM_B2 encountered a Serial Presence
Detection (SPD) failure
Major
857D
CPU2_DIMM_B3 encountered a Serial Presence
Detection (SPD) failure
Major
101
Intel® Server System R1000WF Product Family Technical Product Specification
857E
857F
(Go to
85E0)
CPU2_DIMM_C1 encountered a Serial Presence
Detection (SPD) failure
Major
CPU2_DIMM_C2 encountered a Serial Presence
Detection (SPD) failure
Major
85C0
CPU2_DIMM_C3 failed test/initialization
Please remove the disabled DIMM.
Major
85C1
CPU2_DIMM_D1 failed test/initialization
Please remove the disabled DIMM.
Major
85C2
CPU2_DIMM_D2 failed test/initialization
Please remove the disabled DIMM.
Major
85C3
CPU2_DIMM_D3 failed test/initialization
Please remove the disabled DIMM.
Major
85C4
CPU2_DIMM_E1 failed test/initialization
Please remove the disabled DIMM.
Major
85C5
CPU2_DIMM_E2 failed test/initialization
Please remove the disabled DIMM.
Major
85C6
CPU2_DIMM_E3failed test/initialization
Please remove the disabled DIMM.
Major
85C7
CPU2_DIMM_F1 failed test/initialization
Please remove the disabled DIMM.
Major
85C8
CPU2_DIMM_F2 failed test/initialization
Please remove the disabled DIMM.
Major
85C9
CPU2_DIMM_F3 failed test/initialization
Please remove the disabled DIMM.
Major
85CA
CPU2_DIMM_G1 failed test/initialization
Please remove the disabled DIMM.
Major
85CB
CPU2_DIMM_G2 failed test/initialization
Please remove the disabled DIMM.
Major
85CC
CPU2_DIMM_G3 failed test/initialization
Please remove the disabled DIMM.
Major
85CD
CPU2_DIMM_H1 failed test/initialization
Please remove the disabled DIMM.
Major
85CE
CPU2_DIMM_H2 failed test/initialization
Please remove the disabled DIMM.
Major
85CF
CPU2_DIMM_H3 failed test/initialization
Please remove the disabled DIMM.
Major
85D0
CPU2_DIMM_C3 disabled
Please remove the disabled DIMM.
Major
85D1
CPU2_DIMM_D1 disabled
Please remove the disabled DIMM.
Major
85D2
CPU2_DIMM_D2 disabled
Please remove the disabled DIMM.
Major
85D3
CPU2_DIMM_D3 disabled
Please remove the disabled DIMM.
Major
85D4
CPU2_DIMM_E1 disabled
Please remove the disabled DIMM.
Major
85D5
CPU2_DIMM_E2 disabled
Please remove the disabled DIMM.
Major
85D6
CPU2_DIMM_E3 disabled
Please remove the disabled DIMM.
Major
85D7
CPU2_DIMM_F1 disabled
Please remove the disabled DIMM.
Major
85D8
CPU2_DIMM_F2 disabled
Please remove the disabled DIMM.
Major
85D9
CPU2_DIMM_F3 disabled
Please remove the disabled DIMM.
Major
85DA
CPU2_DIMM_G1 disabled
Please remove the disabled DIMM.
Major
85DB
CPU2_DIMM_G2 disabled
Please remove the disabled DIMM.
Major
85DC
CPU2_DIMM_G3 disabled
Please remove the disabled DIMM.
Major
85DD
CPU2_DIMM_H1 disabled
Please remove the disabled DIMM.
Major
85DE
CPU2_DIMM_H2 disabled
Please remove the disabled DIMM.
Major
85DF
CPU2_DIMM_H3 disabled
Please remove the disabled DIMM.
Major
85E0
CPU2_DIMM_C3 encountered a Serial Presence
Detection (SPD) failure
Major
85E1
CPU2_DIMM_D1 encountered a Serial Presence
Detection (SPD) failure
Major
85E2
CPU2_DIMM_D2 encountered a Serial Presence
Detection (SPD) failure
Major
85E3
CPU2_DIMM_D3 encountered a Serial Presence
Detection (SPD) failure
Major
85E4
CPU2_DIMM_E1 encountered a Serial Presence
Detection (SPD) failure
Major
85E5
CPU2_DIMM_E2 encountered a Serial Presence
Detection (SPD) failure
Major
102
Intel® Server System R1000WF Product Family Technical Product Specification
85E6
CPU2_DIMM_E3 encountered a Serial Presence
Detection (SPD) failure
Major
85E7
CPU2_DIMM_F1 encountered a Serial Presence
Detection (SPD) failure
Major
85E8
CPU2_DIMM_F2 encountered a Serial Presence
Detection (SPD) failure
Major
85E9
CPU2_DIMM_F3 encountered a Serial Presence
Detection (SPD) failure
Major
85EA
CPU2_DIMM_G1 encountered a Serial Presence
Detection (SPD) failure
Major
85EB
CPU2_DIMM_G2 encountered a Serial Presence
Detection (SPD) failure
Major
85EC
CPU2_DIMM_G3 encountered a Serial Presence
Detection (SPD) failure
Major
85ED
CPU2_DIMM_H1 encountered a Serial Presence
Detection (SPD) failure
Major
85EE
CPU2_DIMM_H2 encountered a Serial Presence
Detection (SPD) failure
Major
85EF
CPU2_DIMM_H3 encountered a Serial Presence
Detection (SPD) failure
Major
8604
POST Reclaim of non-critical NVRAM variables
Minor
8605
BIOS Settings are corrupted
Major
8606
NVRAM variable space was corrupted and has been
reinitialized
Major
Recovery boot has been initiated.
8607
Note: The Primary BIOS image may be corrupted or the
system may hang during POST. A BIOS update is
required.
Fatal
92A3
Serial port component was not detected
Major
92A9
Serial port component encountered a resource conflict
error
Major
A000
TPM device not detected
Minor
A001
TPM device missing or not responding
Minor
A002
TPM device failure
Minor
A003
TPM device failed self-test
Minor
A100
BIOS ACM Error
Major
A421
PCI component encountered a SERR error
Fatal
A5A0
PCI Express component encountered a PERR error
Minor
A5A1
PCI Express component encountered an SERR error
Fatal
A6A0
DXE Boot Services driver: Not enough memory
available to shadow a Legacy Option ROM
Please disable OpRom at SETUP to save
runtime memory.
103
Minor
Intel® Server System R1000WF Product Family Technical Product Specification
C.1.
POST Error Beep Codes
The following table lists the POST error beep codes. Prior to system video initialization, the BIOS uses these
beep codes to inform users on error conditions. The beep code is followed by a user-visible code on the
POST Progress LEDs.
Table 48. POST Error Beep Codes
Beeps
Error Message
POST Progress Code
Description
1 short
USB device action
N/A
Short beep sounded whenever USB device is discovered in POST,
or inserted or removed during runtime.
1 long
Intel® TXT security
violation
AE, AF
System halted because Intel® Trusted Execution Technology
detected a potential violation of system security.
3 short
Memory error
Multiple
System halted because a fatal error related to the memory was
detected.
3 long & 1
short
CPU mismatch error
E5, E6
System halted because a fatal error related to the CPU
family/core/cache mismatch was detected.
2 short
BIOS recovery
started
N/A
Recovery boot has been initiated.
4 short
BIOS recovery failed
N/A
Recovery has failed. This typically happens so quickly after
recovery is initiated that it sounds like a 2-4 beep code.
The Integrated BMC may generate beep codes upon detection of failure conditions. Beep codes are sounded
each time the problem is discovered, such as on each power-up attempt, but are not sounded continuously.
Codes that are common across all Intel® Server Systems that use same generation chipset are listed in the
following table. Each digit in the code is represented by a sequence of beeps whose count is equal to the
digit.
Table 49. Integrated BMC Beep Codes
Code
Error Message
Description
1-5-1-2
VR Watchdog Timer
VR controller DC power on sequence not completed in time.
1-5-1-4
Power Supply Status
The system does not power on or unexpectedly power off and a
power supply unit (PSU) is present that is an incompatible model
with one or more other PSUs in the system
1-5-2-1
CPU Socket Population Error
CPU1 socket is empty or sockets are populated incorrectly – CPU1
must be populated before CPU2
1-5-2-4
MSID Mismatch
MSID mismatch occurs if a processor is installed into a system
board that has incompatible power capabilities.
1-5-4-2
Power Fault
DC power unexpectedly lost (power good dropout) – Power unit
sensors report power unit failure offset.
1-5-4-4
Power Control Fault
Power good assertion timeout – Power unit sensors report soft
power control failure offset.
104
Intel® Server System R1000WF Product Family Technical Product Specification
Appendix D. System Configuration Table for Thermal Compatibility
This section provides system configuration compatibility data based on various supported system operating thermal limits. Two tables are
provided. The first table identifies supported system configurations while the system is in “normal” operating mode; all systems fans are
present, on-line, and operational. The second table identifies supported system configurations while the system is in a “fan fail” mode; one
system fan or system fan rotor is no longer on-line or operational and fan redundancy is lost.
The following notes communicate support criteria associated with specific configurations identified in the following tables. Each relevant note to
a configuration is identified by reference number in the table. Listed notes that are not specified in the table will reflect support criteria for a
similar 2U based system within the Intel® Server Board S2600WF product family, details of which can be found in the Intel® Server System
R2000WF Technical Product Specification.
Thermal configuration table notes:
1. The 27°C configuration alone is limited to elevations of 900m or less. Altitudes higher than 900m need to be de-rated to ASHRAE Class 2
levels.
2. To support system fan redundancy, the system must be configured with two power supplies to maintain sufficient cooling. Concurrent system
and power supply fan failures is not supported.
3. Processor and memory throttling may occur which may impact system performance. CPU reliability is not impacted.
4. In fan fail mode, Intel® Ethernet Connection X557-T2 and Intel® Ethernet Connection X527-DA2, both dual-port OCP mezzanine cards are only
supported in the specified base system model configured with 120W processors and DRx4 memory.
5. Use of the designated PCIe* slot is limited to add-in cards that have air flow requirements of 100 LFM or less. See add-in card specs for air flow
requirements.
6. For ASHRAE Class 3 and Class 4 support, the following power supply margining is required to meet thermal specifications:
a) For dual power supply configurations, the power budget must fit within a single power supply rated load and be installed in a dual
configuration, or
b) For single power supply configurations, the power budget must be sized with 30% margin to single power supply rated load.
7. PCIe* SSD AIC FF devices can only be supported in the bottom add-in card slot on Riser Slot #1 and Riser Slot #2.
8. The Intel® RAID Maintenance Free Backup Unit (AXXRMFBUx) can support a case temperature of up to 45°C with the system operating in
normal mode and up to 55°C with the system operating in a fan fail mode. The case temperature of Intel® Smart RAID Battery (AXXRSBBUx) can
support up to 45°C in both normal and fan fail mode. Excursions over these specs may result in a reliability impact.
9. LBG cooling is not sufficient at higher ambient temperatures, performance could be limited to reduce preheating.
10. System cooling capability testing was carried out in environmental lab controlled conditions according to ASHRAE standard.
11. Performance depends on data center environmental temperature and relative humidity levels controls provided by end user.
12. It is the responsibility of the system integrator to both consider the thermal configuration matrix and power budget tool documents in order
to arrange end use configuration.
13. M.2 drives may see performance impact under heavy work load.
14. Light workload is assuming 70% write, 30% read, 100% Random, 100% access, 8kb transfer rate, and IO "delay" of 8.
105
Intel® Server System R1000WF Product Family Technical Product Specification
15. See TPS for thermal limitations.
16. AEP electrically/system not supported on the program.
17. PSU Unit 2 supported up to max CPU TDP of 150 W.
18. PSU Unit 2 supported up to max CPU TDP of 140 W.
19. PSU Unit 2 supported up to max CPU TDP of 125 W.
20. PSU Unit 2 supported up to max CPU TDP of 105 W.
21. PSU Unit 2 supported up to max CPU TDP of 85 W.
22. Intel NVME drives were used for thermal testing.
23. During fan fail mode CPU throttling might occur due power limiting feature for PSU 2.
24. PSU 2 supported up to a max CPU TDP of 135 W (Applies for Fabric sku only).
25. PSU 2 supported up to max CPU TDP of 113 W (Applies for Fabric sku only).
106
Intel® Server System R1000WF Product Family Technical Product Specification
Thermal Configuration Matrix
Normal Operating Mode
"●" = Full Support without limitation
"4,5" (Cell with number) = Conditional support with
limitation (See notes above)
" " (Blank) = No support
R1304 HDD WF
R1208 HDD WF
R1208 NVME WF
ASHRAE (See Note 1)
PS (See Note 6)
173 W
165 W
160 W
CPU TDP
150 W
140 W
Classifications
27C
Max Ambient
27°C
(1)
A2
35°C
Altitude
900
1100W AC
750W DC
A3
A4
27C
40°C
45°C
27°C,
(1)
A2
35°C
900
900
900
900
●
●
●
●
17,
24
19,
24
20,
25
21
A3
A4
27C
A2
A3
A4
40°C
45°C
27°C
(1)
35°C
40°C
45°C
900
900
900
900
900
900
900
●
●
●
●
●
●
●
●
17,
24
19,
24
20
21
3
Intel® Xeon® Platinum 8176F _28C
●
Intel® Xeon® Platinum 8176 _28C
●
3
3
3
3
Intel® Xeon® Platinum 8170_26C
●
3
3
3
3
Intel® Xeon® Gold 6150_18C
●
●
●
3
3
Intel® Xeon® Platinum 8170F_26C
●
●
●
●
●
Intel® Xeon® Platinum 8160F_24C
●
●
●
●
●
Intel® Xeon® Gold 6148F_20C
●
●
●
●
●
Intel® Xeon® Gold 6142F_16C
●
●
●
●
●
Intel® Xeon® Platinum 8164_26C
●
3
3
●
3
●
Intel® Xeon® Platinum 8160_24C
●
3
3
●
3
●
Intel® Xeon® Gold 6148_20C
●
3
3
●
3
●
Intel® Xeon® Gold 6136_12C
●
●
●
●
●
●
Intel® Xeon® Platinum 8158_12C
●
●
●
●
●
●
Intel® Xeon® Gold 6142_16C
●
3
3
●
3
●
Intel® Xeon® Gold 6132_14C
●
●
●
●
●
●
107
●
●
●
Intel® Server System R1000WF Product Family Technical Product Specification
Intel® Xeon® Gold 6152_22C
●
●
●
●
3
●
●
●
Intel® Xeon® Gold 6140_18C
●
●
●
●
●
●
●
●
Intel® Xeon® Gold 6138F_20C
●
●
●
●
●
●
●
●
Intel® Xeon® Gold 6130F_16C
●
●
●
●
●
●
●
●
Intel® Xeon® Gold 6126F_12C
●
●
●
●
●
●
●
●
Intel® Xeon® Gold 6134_8C
●
●
●
●
●
●
●
●
Intel® Xeon® Gold 6138_20C
●
●
●
3
●
●
●
●
●
●
3
Intel® Xeon® Gold 6130_16C
●
●
●
3
●
●
●
●
●
●
3
Intel® Xeon® Platinum 8153_16C
●
●
●
3
●
●
●
●
●
●
3
Intel® Xeon® Gold 6126_12C
●
●
●
●
●
●
●
●
●
●
●
115 W
Intel® Xeon® Gold 6128_6C
●
●
●
●
●
●
●
●
●
●
●
113 W
Intel® Xeon® Gold 5117F_14C
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Gold 5122_4C
●
●
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Platinum 8156_4C
●
●
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Gold 5120_14C
●
●
●
●
●
●
●
●
●
●
●
3
Intel® Xeon® Gold 5118_12C
●
●
●
●
●
●
●
●
●
●
●
3
Intel® Xeon® Gold 5115_10C
●
●
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Silver 4116_12C
●
●
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Silver 4114_10C
●
●
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Silver 4110_8C
●
●
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Silver 4108 _8C
●
●
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Bronze 3106 _8C
●
●
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Bronze 3104_6C
●
●
●
●
●
●
●
●
●
●
●
●
Intel® Xeon® Silver 4112_4C
●
●
●
●
●
●
●
●
●
●
●
●
RDIMM-2Rx8,1Rx4, 1Rx8
●
●
●
●
●
●
●
●
●
●
●
●
RDIMM-DRx4
●
●
●
●
●
●
●
●
●
●
●
●
LRDIMM-QRx4 DDP
●
●
3
3
●
●
3
3
●
●
3
3
135 W
130 W
125 W
105 W
85 W
Memory Type
(See Note 16)
108
Intel® Server System R1000WF Product Family Technical Product Specification
Add-in Cards
(See Note 5)
SAS and OCP
Modules
(See Note 4)
Battery Backup
(See Note 9)
2.5" SFF NVMe SSD
(DC P3700/P3500)
( See Note 22)
SATA HDD
PCIe SSD AIC FF
(DC P3700/P3500)
(See Note 8)
M.2 Sustained Max
Power (TDP)
M.2 Light Workload
(See Note 14)
Riser #1 - Bottom Slot (1U riser and
2U riser)
Riser #2 - Bottom Slot (1U riser and
2U riser)
Intel® Integrated RAID Modules
(Mezzanine cards)
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
16 port tri mode mezzanine
●
●
12
12
●
●
12
12
●
●
12
12
Dual 10GBase-T Taylor Canal
●
●
●
●
●
●
●
●
●
●
●
●
Dual SFP+ Cascade Canal
●
●
●
●
●
●
●
●
●
●
●
●
Quad SFP+ Cascade Canal
●
●
●
●
●
●
●
●
●
●
●
●
1GBase-T Quad Main Canal
●
●
●
●
●
●
●
●
●
●
●
●
BBU (rated to 45C)
●
●
●
●
●
●
●
●
●
Supercap (rated to 55C)
●
●
●
●
●
●
●
●
●
Cache Offload Module (rated to
55C)
●
●
●
●
●
●
●
●
●
●
1600GB/2TB
●
●
●
●
800GB
●
●
●
●
600GB
●
●
●
●
400GB
●
●
●
●
200GB
●
●
●
●
●
●
Up to 2 TB
●
●
●
●
●
●
●
●
●
●
●
●
1600GB/2TB
●
●
●
●
●
●
●
●
●
●
●
●
800GB
●
●
●
●
●
●
●
●
●
●
●
●
600GB
●
●
●
●
●
●
●
●
●
●
●
●
400GB
●
●
●
●
●
●
●
●
●
●
●
●
200GB
●
●
●
●
●
●
●
●
●
●
●
●
Intel 120G and 80G SATA
●
●
13
13
●
●
13
13
●
●
13
13
Non-Intel M.2
●
●
15
15
●
●
15
15
●
●
15
15
Intel 120G and 80G SATA
●
●
●
13
●
●
●
13
●
●
●
13
Non-Intel M.2
●
●
●
15
●
●
●
15
●
●
●
15
109
Intel® Server System R1000WF Product Family Technical Product Specification
Thermal Configuration Matrix
Fan Fail Mode
"●" = Full Support without limitation
"4,5" (Cell with number) = Conditional support with
limitation (See notes above)
" " (Blank) = No support
R1304 HDD WF
R1208 HDD WF
R1208 NVME WF
ASHRAE (See Note 1)
PS (See Note 6)
173 W
165 W
CPU TDP
160 W
150 W
110
Classifications
27C
A2
A3
A4
27C
A2
A3
A4
27C
A2
A3
A4
Max Ambient
27°C
(1)
35°C
40°C
45°C
27°C,
(1)
35°C
40°C
45°C
27°C
(1)
35°C
40°C
45°C
Altitude
900
900
900
900
900
900
900
900
900
900
900
900
1100W AC
2
2
2
2
2
2
2
2
2
2
2
2
750W DC
2, 20,
24
2, 21,
24
2
2
2, 20,
24
2, 21
2
2
Intel® Xeon® Platinum 8176F _28C
23
23
23
23
Intel® Xeon® Platinum 8176 _28C
23
23
23
23
Intel® Xeon® Platinum 8170_26C
23
23
23
23
Intel® Xeon® Gold 6150_18C
23
23
23
23
Intel® Xeon® Platinum 8170F_26C
23
23
23
23
23
Intel® Xeon® Platinum 8160F_24C
23
23
23
23
23
Intel® Xeon® Gold 6148F_20C
23
23
23
23
23
Intel® Xeon® Gold 6142F_16C
23
23
23
23
23
Intel® Xeon® Platinum 8164_26C
3
23
23
23
23
23
Intel® Xeon® Platinum 8160_24C
3
23
23
23
23
23
Intel® Xeon® Gold 6148_20C
3
23
23
23
23
23
Intel® Xeon® Gold 6136_12C
3
23
23
23
23
23
Intel® Xeon® Platinum 8158_12C
3
23
23
23
23
23
Intel® Server System R1000WF Product Family Technical Product Specification
Intel® Xeon® Gold 6142_16C
3
23
23
23
23
Intel® Xeon® Gold 6132_14C
3
3
23
3
23
23
3
23
Intel® Xeon® Gold 6152_22C
3
3
23
3
23
23
3
23
Intel® Xeon® Gold 6140_18C
3
3
23
3
23
23
3
23
Intel® Xeon® Gold 6138F_20C
3
3
23
3
23
23
●
23
Intel® Xeon® Gold 6130F_16C
3
3
23
3
23
23
●
23
Intel® Xeon® Gold 6126F_12C
3
3
23
3
23
23
●
23
Intel® Xeon® Gold 6134_8C
●
3
23
●
23
23
●
23
Intel® Xeon® Gold 6138_20C
●
3
23
23
●
3
23
23
●
3
23
Intel® Xeon® Gold 6130_16C
●
3
23
23
●
3
23
23
●
3
23
Intel® Xeon® Platinum 8153_16C
●
3
23
23
●
3
23
23
●
3
23
Intel® Xeon® Gold 6126_12C
●
3
23
23
●
3
23
23
●
3
23
115 W
Intel® Xeon® Gold 6128_6C
●
●
●
23
●
●
23
23
●
●
23
113 W
Intel® Xeon® Gold 5117F_14C
●
●
23
23
●
●
23
23
●
●
23
Intel® Xeon® Gold 5122_4C
●
●
3
23
●
●
3
23
●
●
3
23
Intel® Xeon® Platinum 8156_4C
●
●
3
23
●
●
3
23
●
●
3
23
Intel® Xeon® Gold 5120_14C
●
●
3
23
●
●
3
23
●
●
3
23
Intel® Xeon® Gold 5118_12C
●
●
3
23
●
●
3
23
●
●
3
23
Intel® Xeon® Gold 5115_10C
●
●
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23
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23
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●
●
23
Intel® Xeon® Silver 4116_12C
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23
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23
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23
Intel® Xeon® Silver 4114_10C
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23
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23
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23
Intel® Xeon® Silver 4110_8C
●
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23
●
●
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23
●
●
●
23
Intel® Xeon® Silver 4108 _8C
●
●
●
23
●
●
●
23
●
●
●
23
Intel® Xeon® Bronze 3106 _8C
●
●
●
23
●
●
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23
●
●
●
23
Intel® Xeon® Bronze 3104_6C
●
●
●
23
●
●
●
23
●
●
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23
Intel® Xeon® Silver 4112_4C
●
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23
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23
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●
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23
RDIMM-2Rx8,1Rx4, 1Rx8
●
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●
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140 W
135 W
130 W
125 W
105 W
85 W
Memory Type
111
23
Intel® Server System R1000WF Product Family Technical Product Specification
(See Note 16)
Add-in Cards
(See Note 5)
SAS and OCP
Modules
(See Note 4)
Battery Backup
(See Note 9)
2.5" SFF NVMe SSD
(DC P3700/P3500)
( See Note 22)
SATA HDD
PCIe SSD AIC FF
(DC P3700/P3500)
(See Note 8)
M.2 Sustained Max
Power (TDP)
M.2 Light Workload
(See Note 14)
112
RDIMM-DRx4
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LRDIMM-QRx4 DDP
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3
3
3
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3
3
3
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3
3
3
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16 port tri mode mezzanine
●
12
12
12
●
12
12
12
●
12
12
12
Dual 10GBase-T Taylor Canal
●
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Dual SFP+ Cascade Canal
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Quad SFP+ Cascade Canal
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1GBase-T Quad Main Canal
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BBU (rated to 45C)
●
●
●
●
●
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Supercap (rated to 55C)
●
●
●
●
●
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Cache Offload Module (rated to
55C)
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1600GB/2TB
●
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800GB
●
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600GB
●
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400GB
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200GB
●
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Riser #1 - Bottom Slot (1U riser and
2U riser)
Riser #2 - Bottom Slot (1U riser and
2U riser)
Intel® Integrated RAID Modules
(Mezzanine cards)
●
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Up to 2 TB
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1600GB/2TB
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800GB
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600GB
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400GB
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200GB
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Intel 120G and 80G SATA
●
13
13
13
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13
13
13
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13
13
13
Non-Intel M.2
●
15
15
15
●
15
15
15
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15
15
15
Intel 120G and 80G SATA
●
13
13
13
●
13
13
13
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13
13
13
Non-Intel M.2
●
15
15
15
●
15
15
15
●
15
15
15
Intel® Server System R1000WF Product Family Technical Product Specification
Appendix E. System Cable Routing Diagrams
Figure 60. R1304WFxxx
113
Intel® Server System R1000WF Product Family Technical Product Specification
Figure 61. R1208WFxxx
114
Intel® Server System R1000WF Product Family Technical Product Specification
Appendix F. Statement of Volatility
The tables in this section are used to identify the volatile and non-volatile memory components for system
boards used within the Intel® Server System R1000WF product family.
The tables provide the following data for each identified component.
Component Type
Three types of memory components are used on the server board assembly. These include:
•
Non-volatile: Non-volatile memory is persistent, and is not cleared when power is removed from the
system. Non-Volatile memory must be erased to clear data. The exact method of clearing these areas
varies by the specific component. Some areas are required for normal operation of the server, and
clearing these areas may render the server board inoperable.
•
Volatile: Volatile memory is cleared automatically when power is removed from the system.
•
Battery powered RAM: Battery powered RAM is similar to volatile memory, but is powered by a battery on
the server board. Data in Battery powered Ram is persistent until the battery is removed from the server
board.
Size
The size of each component includes sizes in bits, Kbits, bytes, kilobytes (KB) or megabytes (MB).
Board Location
The physical location of each component is specified in the Board Location column. The board location
information corresponds to information on the server board silkscreen.
User Data
The flash components on the server boards do not store user data from the operating system. No operating
system level data is retained in any listed components after AC power is removed. The persistence of
information written to each component is determined by its type as described in the table.
Each component stores data specific to its function. Some components may contain passwords that provide
access to that device’s configuration or functionality. These passwords are specific to the device and are
unique and unrelated to operating system passwords. The specific components that may contain password
data are:
•
BIOS: The server board BIOS provides the capability to prevent unauthorized users from configuring
BIOS settings when a BIOS password is set. This password is stored in BIOS flash, and is only used to set
BIOS configuration access restrictions.
•
BMC: The server boards support an Intelligent Platform Management Interface (IPMI) 2.0 conformant
baseboard management controller (BMC). The BMC provides health monitoring, alerting and remote
power control capabilities for the Intel® server board.
The BMC does not have access to operating
system level data.
The BMC supports the capability for remote software to connect over the network and perform health
monitoring and power control. This access can be configured to require authentication by a password. If
configured, the BMC will maintain user passwords to control this access. These passwords are stored in
the BMC flash.
115
Intel® Server System R1000WF Product Family Technical Product Specification
Table 50.
Intel® Server Board S2600WFT (iPN - H48104-XXX)
Intel® Server Board S2600WFO (iPN - H87179-XXX)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
512MB
U3D1
No(BIOS)
BIOS Flash
Non-Volatile
512MB
U1D1
No(FW)
BMC Flash
Non-Volatile
4MB
U5M1
No
10 GB NIC EEPROM
Non-Volatile
N/A
U1E3
No
CPLD
Volatile
4GB
U1D2
No
BMC SDRAM
Non-Volatile
8GB
U8N1
No
BMC eMMC
Table 51. 1U 1 Slot PCIe* Riser Card (iPN – H39531-xxx)
Component Type
Size
Board Location
User Data
Name
N/A
N/A
None
No
N/A
Table 52. Front Panel Board (iPN – H29366-xxx)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
256x8
None
Yes
PSOC / Microcontroller
Table 53. 1U 4 x 3.5” Hot Swap Back Plane option (iPN – G97162-XXX)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
16384x8
None
Yes
PSOC / Microcontroller / FRU
Non-Volatile
1024x8
None
No
SAS Re-Driver Settings
Table 54. 1U 8 x 2.5” SAS Hot Swap Back Plane option (iPN – H88382-XXX)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
16384x8
None
Yes
PSOC / Microcontroller / FRU
Non-Volatile
1024x8
None
No
SAS Re-Driver Settings
Table 55. Intel® Remote Management Module Lite Accessory Option (iPC – AXXRMM4LITE)
Component Type
Size
Board Location
User Data
Name
Non-Volatile
1Mbit
U2B1
No
RMM Programming
116
Intel® Server System R1000WF Product Family Technical Product Specification
Glossary
Word/Acronym
Definition
BMC
Baseboard Management Controller
BIOS
Basic Input/Output System
CLST
Closed Loop System Throttling
CMOS
Complementary Metal-oxide-semiconductor
CPU
Central Processing Unit
DDR4
Double Data Rate 4th edition
DIMM
Dual In-line Memory Module
DOM
Disk-on-module
DPC
DIMMs per Channel
EDS
External Design Specification
EPS
External Product Specification
FP
Front Panel
FRB
Fault Resilient Boot
FRU
Field Replaceable Unit
GPGPU
General Purpose Graphic Processing Unit
HDD
Hard Disk Drive
I2C
Inter-integrated Circuit bus
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LFM
Linear Feet per Minute – Air Flow measurement
LPC
Low-pin Count
LRDIMM
Load Reduced DIMM
LSB
Least Significant Bit
MSB
Most Significant Bit
MTBF
Mean Time Between Failure
NIC
Network Interface Card
NMI
Non-maskable Interrupt
OCP
Over-current Protection
OTP
Over-temperature Protection
OVP
Over-voltage Protection
PCI
Peripheral Component Interconnect
PCB
Printed Circuit Board
PCIe*
Peripheral Component Interconnect Express*
PCI-X
Peripheral Component Interconnect Extended
PFC
Power Factor Correction
POST
Power-on Self-Test
117
Intel® Server System R1000WF Product Family Technical Product Specification
118
Word/Acronym
Definition
PSU
Power Supply Unit
RAID
Redundant Array of Independent Disks
RAM
Random Access Memory
RDIMM
Registered DIMM
ROC
RAID On Chip
SAS
Serial Attached SCSI
SATA
Serial Advanced Technology Attachment
SCA
Single Connector Attachment
SCSI
Small Computer System Interface
SDR
Sensor Data Record
SFF
Small Form Factor
SSD
Solid State Drive
TDP
Thermal Design Power
TPM
Trusted Platform Module
TPS
Technical Product Specification
USB
Universal Serial Bus
VLSI
Very Large Scale Integration
VSB
Voltage Standby
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