No.1, 1-1 and 1-2, Qun Yi Road, Jhunan, Miaoli, Taiwan 350, R.O.C.
Tel : +886-37-586-896
Email : sales@phison.com
Fax : +886-37-587-699
support@phison.com
APPROVAL SHEET
PRODUCT NAME:
PART NUMBER:
M.2 2242 (PS3111-S11)
MG11SL91-32G
MG11SL92-64G
MG11SL92-128G
AUTHORIZED SIGNATURES
PHISON Approval
CUSTOMER Approval
Aug. 18 2017
All rights are strictly reserved. Any portion of this paper shall not be reproduced, copied, or translated to
any other forms without permission from Phison Electronics Corporation.
Phison Electronics Corporation
PS3111-S11 M.2 2242 TLC Specification
Version 1.5
Phison Electronics Corporation
No.1, Qun-Yi Road, Jhunan, Miaoli County, Taiwan 350, R.O.C.
Tel: +886-37-586-896
Fax: +886-37-587-868
E-mail: sales@phison.com / suppport@phison.com
Document Number: S-17188
ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED,
OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM PHISON ELECTRONICS
CORPORATION.
Phison may make changes to specifications and product description at any time without notice. PHISON and
the Phison logo are trademarks of Phison Electronics Corporation, registered in the United States and other
countries. Products and specifications discussed herein are for reference purposes only. Copies of
documents which include information of part number or ordering number, or other materials may be
obtained by emailing us at sales@phison.com or support@phison.com.
© 2016 Phison Electronics Corp. All Rights Reserved.
Revision History
Revision
Draft Date
History
1.0
2016/05/09
1.1
2016/05/26
1.2
2017/02/13
Update performance and power consumption
Errison Chi
1.3
2017/03/09
Update performance and power consumption
Errison Chi
1.4
2017/05/09
Update performance and power consumption
Joe Leng
1.5
2017/07/10
Update performance and power consumption
Joe Leng
First release
Update performance, TBW and power consumption
Update chapter 6 supported command
Author
Lisa Wu
Lisa Wu
Product Overview




Capacity
■ 30/32 GB up to 480/512GB
Form Factor
■ M.2 2242-D5-B-M
SATA Interface
■ SATA Revision 3.2
■ SATA 1.5Gbps, 3Gbps, and 6Gbps
interface
Flash Interface
Flash type: TLC
■
1pcs to 2pcs of BGA/TSOP flash
Performance
■
Read: up to 550 MB/s
■
Write: up to 490 MB/s
Power ConsumptionNote1
■
Active mode: < 1,780 mW
■
Idle mode: < 300 mW
■
DEVSLP mode: < 5 mW


■


Notes:
1. Please see “4.2 Power Consumption” for details.
MTBF
■
More than 2,000,000 hours
Advanced Flash Management
■
Static and Dynamic Wear Leveling
■
Bad Block Management
■
TRIM
■
SMART
■
Over-Provision
■
Firmware Update
SmartZIPTM
Low Power Management
■
DEVSLP Mode (Optional)
■
DIPM/HIPM Mode
Temperature Range
■
Operation: 0°C ~ 70°C
■
Storage: -40°C ~ 85°C
RoHS compliant
■



Performance and Power Consumption
Performance
Capacity
Flash Structure
120/128GB
CrystalDiskMark
Power Consumption
ATTO
Read
Read
Write
(mW)
(MB/s) (MB/s)
Write DEVSLP
(mW) (mW)
Read
(MB/s)
Write
(MB/s)
64GBx2, BGA, TSB 15nm
550
450
560
540
1,130
1,305
4.9
240/256GB
128GBx2, BGA, TSB 15nm
550
450
560
540
1,360
1,780
4.9
30/32GB
32GBx1, TSOP, TSB Bics2
290
25
560
540
920
810
4.9
60/64GB
32GBx2, TSOP, TSB Bics2
550
55
560
540
1,205
1,040
4.9
120/128GB
64GBx2, TSOP, TSB Bics2
550
350
560
540
1,355
1,400
4.9
120/128GB
64GBx2, BGA, TSB Bics2
550
350
560
540
1,355
1,515
4.9
240/256GB
128GBx2, TSOP, TSB Bics2
550
370
560
540
1,360
1,500
4.9
240/256GB
128GBx2, BGA, TSB Bics2
550
490
560
540
1,400
1,700
4.9
30/32GB
32GBx1, TSOP, TSB Bics3
300
35
560
540
950
850
4.9
60/64GB
32GBx2, TSOP, TSB Bics3
550
100
560
540
1,215
1,020
4.9
120/128GB
64GBx2, TSOP, TSB Bics3
550
450
560
540
1,300
1,350
4.9
120/128GB
64GBx2, BGA TSB Bics3
550
450
560
540
1,270
1,360
4.9
240/256GB
128GBx2, BGA TSB Bics3
550
490
560
540
1,360
1,440
4.9
480/512GB
256GBx2, BGA TSB Bics3
550
490
560
540
1,470
1,520
4.9
500
390
560
540
1,355
1,515
4.9
120/128GB
48GBx1+96GBx1, BGA,
Micron B0KB
NOTE:
For more details on Power Consumption, please refer to Chapter 4.2.
TABLE OF CONTENTS
1.
INTRODUCTION ................................................................................................................... 1
1.1. General Description ........................................................................................................... 1
1.2. Controller Block Diagram ................................................................................................... 1
1.3. Product Block Diagram....................................................................................................... 2
1.4. Flash Management............................................................................................................. 2
1.4.1. Error Correction Code (ECC) .................................................................................... 2
1.4.2. Wear Leveling .......................................................................................................... 2
1.4.3. Bad Block Management .......................................................................................... 3
1.4.4. TRIM ........................................................................................................................ 3
1.4.5. SMART ..................................................................................................................... 3
1.4.6. Over-Provision ......................................................................................................... 3
1.4.7.
Firmware Upgrade .................................................................................................. 4
1.5. Low Power Management ................................................................................................... 4
1.5.1. DEVSLP Mode (Optional) ......................................................................................... 4
1.5.2. DIPM/HIPM Mode ................................................................................................... 4
1.6. Power Loss Protection: Flushing Mechanism (Optional) ................................................... 4
1.7.
Advanced Device Security Features ................................................................................... 5
1.7.1. Secure Erase ............................................................................................................ 5
1.7.2. Write Protect ........................................................................................................... 5
1.8. SSD Lifetime Management ................................................................................................. 5
1.8.1. Thermal Monitor (Optional) .................................................................................... 5
1.9. An Adaptive Approach to Performance Tuning ................................................................. 6
1.9.1. Throughput .............................................................................................................. 6
1.9.2. Predict & Fetch ........................................................................................................ 6
1.9.3. SmartZIPTM .............................................................................................................. 6
2.
PRODUCT SPECIFICATIONS................................................................................................... 7
3.
ENVIRONMENTAL SPECIFICATIONS ...................................................................................... 9
3.1. Environmental Conditions ................................................................................................. 9
3.1.1. Temperature and Humidity ..................................................................................... 9
3.1.2. Shock ..................................................................................................................... 10
3.1.3. Vibration ............................................................................................................... 10
3.1.4. Drop....................................................................................................................... 10
3.1.5. Bending ................................................................................................................. 10
3.1.6. Torque .................................................................................................................... 10
3.1.7. Electrostatic Discharge (ESD) ................................................................................ 11
3.1.8.
EMI Compliance .................................................................................................... 11
3.2. MTBF ................................................................................................................................ 11
3.3. Certification & Compliance .............................................................................................. 11
4.
ELECTRICAL SPECIFICATIONS .............................................................................................. 12
4.1. Supply Voltage ................................................................................................................. 12
4.2. Power Consumption ........................................................................................................ 12
5.
INTERFACE......................................................................................................................... 13
5.1. Pin Assignment and Descriptions..................................................................................... 13
6.
SUPPORTED COMMANDS .................................................................................................. 16
6.1. ATA Command List ........................................................................................................... 16
6.2. Identify Device Data ......................................................................................................... 18
7.
PHYSICAL DIMENSION ....................................................................................................... 23
8.
PRODUCT WARRANTY POLICY............................................................................................ 25
9.
REFERENCE ........................................................................................................................ 26
10. TERMINOLOGY ................................................................................................................ 27
LIST OF FIGURES
Figure 1-1 PS3111 M.2 2242 Controller Block Diagram ....................................................................... 1
Figure 1-2 PS3111 M.2 2242 Product Block Diagram .......................................................................... 2
LIST OF TABLES
Table 3-1 High Temperature Test Condition ......................................................................................... 9
Table 3-2 Low Temperature Test Condition.......................................................................................... 9
Table 3-3 High Humidity Test Condition ............................................................................................... 9
Table 3-4 Temperature Cycle Test ........................................................................................................ 9
Table 3-5 PS3111 M.2 2242 Shock Specification................................................................................ 10
Table 3-6 PS3111 M.2 2242 Vibration Specification .......................................................................... 10
Table 3-7 PS3111 M.2 2242 Drop Specification ................................................................................. 10
Table 3-8 PS3111 M.2 2242 Bending Specification ............................................................................ 10
Table 3-9 PS3111 M.2 2242 Torque Specification .............................................................................. 10
Table 3-10 PS3111 M.2 2242 Contact ESD Specification ................................................................... 11
Table 4-1 Supply Voltage of PS3111 M.2 2242 .................................................................................. 12
Table 4-2 Power Consumption of PS3111 M.2 2242.......................................................................... 12
Table 5-1 Pin Assignment and Description of PS3111 M.2 2242 ....................................................... 13
Table 6-1 ATA Command List .............................................................................................................. 16
Table 6-2 List of Device Identification ................................................................................................ 18
Table 6-3 List of Device Identification for Each Capacity ................................................................... 21
Table 9-1 List of References................................................................................................................ 26
Table 10-1 List of Terminology ........................................................................................................... 27
1. INTRODUCTION
1.1. General Description
Phison’s PS3111 M.2 2242 delivers all the advantages of flash disk technology with the Serial ATA I/II/III
interface and is fully compliant with the standard Next Generation Form Factor (NGFF) called M.2 Card
Format, which is generated by Intel. The PS3111 M.2 2242 is designed to operate at a maximum operating
frequency of 200MHz with 30MHz external crystal. Its capacity could provide a wide range up to 512GB.
The power consumption of the M.2 2242 is much lower than traditional hard drives, making it the best
embedded solution for new platforms.
1.2. Controller Block Diagram
Figure 1-1 PS3111 M.2 2242 Controller Block Diagram
1
1.3. Product Block Diagram
Figure 1-2 PS3111 M.2 2242 Product Block Diagram
1.4. Flash Management
1.4.1. Error Correction Code (ECC)
Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data.
Thus, PS3111 M.2 2242 applies the LDPC (Low Density Parity Check) of ECC algorithm, which can detect and
correct errors occur during read process, ensure data been read correctly, as well as protect data from
corruption.
1.4.2. Wear Leveling
NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the
flash media are not used evenly. If some areas get updated more frequently than others, the lifetime of the
device would be reduced significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND flash
by evenly distributing write and erase cycles across the media.
Phison provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage through
the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms,
the life expectancy of the NAND flash is greatly improved.
2
1.4.3. Bad Block Management
Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks
that are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad blocks
that are developed during the lifespan of the flash are named “Later Bad Blocks”. Phison implements an
efficient bad block management algorithm to detect the factory-produced bad blocks and manages any bad
blocks that appear with use. This practice further prevents data being stored into bad blocks and improves
the data reliability.
1.4.4. TRIM
TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD).
Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually
becomes smaller with each use. With the TRIM command, the operating system can inform the SSD which
blocks of data are no longer in use and can be removed permanently. Thus, the SSD will perform the erase
action, which prevents unused data from occupying blocks all the time.
1.4.5. SMART
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows
a hard disk drive to automatically detect its health and report potential failures. When a failure is recorded
by SMART, users can choose to replace the drive to prevent unexpected outage or data loss. Moreover,
SMART can inform users of impending failures while there is still time to perform proactive actions, such as
copy data to another device.
1.4.6. Over-Provision
Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which is not visible and cannot be
used by users. With Over Provisioning, the performance and IOPS (Input/Output Operations per Second)
are improved by providing the controller additional space to manage P/E cycles, which enhances the
reliability and endurance as well. Moreover, the write amplification of the SSD becomes lower when the
controller writes data to the flash.
3
1.4.7. Firmware Upgrade
Firmware can be considered as a set of instructions on how the device communicates with the host.
Firmware will be upgraded when new features are added, compatibility issues are fixed, or read/write
performance gets improved.
1.5. Low Power Management
1.5.1. DEVSLP Mode (Optional)
With the increasing need of aggressive power/battery life, SATA interfaces include a new feature, Device
Sleep (DEVSLP) mode, which helps further reduce the power consumption of the device. DEVSLP enables
the device to completely power down the device PHY and other sub-systems, making the device reach a
new level of lower power operation. The DEVSLP does not specify the exact power level a device can
achieve in the DEVSLP mode, but the power usage can be dropped down to 5mW or less.
1.5.2. DIPM/HIPM Mode
SATA interfaces contain two low power management states for power saving: Partial and Slumber modes.
For Partial mode, the device has to resume to full operation within 10 microseconds, whereas the device
will spend 10 milliseconds to become fully operational in the Slumber mode. SATA interfaces allow low
power modes to be initiated by Host (HIPM, Host Initiated Power Management) or Device (DIPM, Device
Initiated Power Management). As for HIPM, Partial or Slumber mode can be invoked directly by the
software. For DIPM, the device will send requests to enter Partial or Slumber mode.
1.6. Power Loss Protection: Flushing Mechanism (Optional)
Power Loss Protection is a mechanism to prevent data loss during unexpected power failure. DRAM is a
volatile memory and frequently used as temporary cache or buffer between the controller and the NAND
flash to improve the SSD performance. However, one major concern of the DRAM is that it is not able to
keep data during power failure. Accordingly, the PS3111 applies the GuaranteedFlush technology, which
requests the controller to transfer data to the cache. For PS3111, SDR performs as a cache, and its size is
4
32MB. Only when the data is fully committed to the NAND flash will the controller send acknowledgement
(ACK) to the host. Such implementation can prevent false-positive performance and the risk of power
cycling issues.
Additionally, it is critical for a controller to shorten the time the in-flight data stays in the cache. Thus,
Phison’s PS3111 applies an algorithm to reduce the amount of data resides in the cache to provide a better
performance. This SmartCacheFlush technology allows incoming data to only have a “pit stop” in the cache
and then move to the NAND flash at once. If the flash is jammed due to particular file sizes (such as random
4KB data), the cache will be treated as an “organizer”, consolidating incoming data into groups before
written into the flash to improve write amplification.
In sum, with Flush Mechanism, PS3111 proves to provide the reliability required by consumer, industrial,
and enterprise-level applications.
1.7. Advanced Device Security Features
1.7.1. Secure Erase
Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe all the data on hard drives
and SSDs. When this command is issued, the SSD controller will erase its storage blocks and return to its
factory default settings.
1.7.2. Write Protect
When a SSD contains too many bad blocks and data are continuously written in, then the SSD might not be
usable anymore. Thus, Write Protect is a mechanism to prevent data from being written in and protect the
accuracy of data that are already stored in the SSD.
1.8. SSD Lifetime Management
1.8.1. Thermal Monitor (Optional)
Thermal monitors are devices for measuring temperature, and can be found in SSDs in order to issue
warnings when SSDs go beyond a certain temperature. The higher temperature the thermal monitor
detects, the more power the SSD consumes, causing the SSD to get aging quickly. Hence, the processing
speed of a SSD should be under control to prevent temperature from exceeding a certain range. Meanwhile,
the SSD can achieve power savings.
5
1.9. An Adaptive Approach to Performance Tuning
1.9.1. Throughput
Based on the available space of the disk, PS3111 will regulate the read/write speed and manage the
performance of throughput. When there still remains a lot of space, the firmware will continuously perform
read/write action. There is still no need to implement garbage collection to allocate and release memory,
which will accelerate the read/write processing to improve the performance. Contrarily, when the space is
going to be used up, PS3111 will slow down the read/write processing, and implement garbage collection
to release memory. Hence, read/write performance will become slower.
1.9.2. Predict & Fetch
Normally, when the host tries to read data from the SSD, the SSD will only perform one read action after
receiving one command. However, PS3111 applies Predict & Fetch to improve the read speed. When the
host issues sequential read commands to the SSD, the SSD will automatically expect that the following will
also be read commands. Thus, before receiving the next command, flash has already prepared the data.
Accordingly, this accelerates the data processing time, and the host does not need to wait so long to
receive data.
1.9.3. SmartZIPTM
Write data to the NAND Flash costs time. To improve the write speed performance, PS3111 launches with
compression technique-- SmartZIPTM.
Whether a file could be compressed or not depending on the file type, for file types have redundancy data
pattern, through our embedded encode engine, we could reduce the amount of data that is actually
written to the Flash. Comparing to the SSD without the compression, write efficiency is raised and the SSD
endurance is also improved since Flash could be benefit from less data written for a longer SSD lifetime.
6
2. PRODUCT SPECIFICATIONS
Capacity

■
From 30/32GB up to 480/512GB (support 48-bit addressing mode)
Electrical/Physical Interface

■
SATA Interface

Compliant with SATA Revision 3.2

Compatible with SATA 1.5Gbps, 3Gbps and 6Gbps interface

Support power management

Support expanded register for SATA protocol 48 bits addressing mode

Embedded BIST function for SATA PHY for low cost mass production
Built-in 2-channel NAND flash interface controller

■
Compliant with Toggle 1.0 and Toggle 2.0 NAND Flash interface
■
Compliant with ONFI 4.0 interface:

SDR up to mode 5

NV-DDR up to mode 5

NV-DDR2 up to mode 7

NV-DDR3 up to mode 8
Supported NAND Flash

■
Support up to 16 Flash Chip Enables (CE) within single design
■
Toshiba 24nm SLC; 15nm/3D-NAND MLC; 15nm/3D-NAND TLC
■
Intel/Micron 16nm/3D-NAND MLC and TLC
■
Hynix 16nm/3D-NAND
■
Support all types of SLC/MLC/TLC/3D-NAND, 8KB/page and 16K/page NAND flash
■
Support ONFI 2.3, ONFI 3.0, ONFI 3.2 and ONFI 4.0 interface: 2 channels at maximum
■
Support 8-bit I/O NAND Flash
■
Contain 1pcs to 2pcs of BGA flash
ECC Scheme

■
PS3111 M.2 2242 applies the LDPC (Low Density Parity Check) of ECC algorithm.

UART function

GPIO

Support SMART and TRIM commands
7

Performance
Sequential
Capacity
Flash Structure
Flash Type
Read
Write
(MB/s)
(MB/s)
120/128GB
64GB x 2
BGA, TSB 15nm
550
450
240/256GB
128GB x 2
BGA, TSB 15nm
550
450
30/32GB
32GB x 1
TSOP, TSB Bics2
290
25
60/64GB
32GB x 2
TSOP, TSB Bics2
550
55
120/128GB
64GB x 2
TSOP, TSB Bics2
550
350
120/128GB
64GB x 2
BGA, TSB Bics2
550
350
240/256GB
128GB x 2
TSOP, TSB Bics2
550
370
240/256GB
128GB x 2
BGA, TSB Bics2
550
490
30/32GB
32GBx1
TSOP, TSB Bics3
300
35
60/64GB
32GBx2
TSOP, TSB Bics3
550
100
120/128GB
64GBx2
TSOP, TSB Bics3
550
450
120GB/128GB
64GB x 2
BGA, TSB Bics3
550
450
240GB/256GB
128GB x 2
BGA, TSB Bics3
550
490
480GB/512GB
256GB x 2
BGA, TSB Bics3
550
490
120/128GB
48GBx1+96GBx1
BGA, Micron B0KB
500
390
NOTES:
1. The performance was measured using CrystalDiskMarkv5.0x64 with SATA 6Gbps host.
2. Samples were built using Toshiba 15nm, Toshiba Bics2, Bics3 and Micron B0KB TLC.
3. Performance may differ according to flash configuration and platform.
4. The table above is for reference only. The criteria for MP (mass production) and for
accepting goods shall be discussed based on different flash configuration.
8
3. ENVIRONMENTAL SPECIFICATIONS
3.1. Environmental Conditions
3.1.1. Temperature and Humidity


Temperature:

Storage: -40°C to 85°C

Operational: 0°C to 70°C
Humidity: RH 90% under 40°C (operational)
Table 3-1 High Temperature Test Condition
Temperature
Humidity
Test Time
Operation
70°C
0% RH
72 hours
Storage
85°C
0% RH
72 hours
Result: No any abnormality is detected.
Table 3-2 Low Temperature Test Condition
Temperature
Humidity
Test Time
Operation
0°C
0% RH
72 hours
Storage
-40°C
0% RH
72 hours
Result: No any abnormality is detected.
Table 3-3 High Humidity Test Condition
Temperature
Humidity
Test Time
Operation
40°C
90% RH
4 hours
Storage
40°C
93% RH
72 hours
Result: No any abnormality is detected.
Table 3-4 Temperature Cycle Test
Operation
Storage
Temperature
Test Time
0°C
30 min
70°C
30 min
-40°C
30 min
85°C
30 min
Cycle
10 Cycles
10 Cycles
Result: No any abnormality is detected.
9
3.1.2. Shock
Table 3-5 PS3111 M.2 2242 Shock Specification
Acceleration Force
Half Sin Pulse Duration
1500G
0.5ms
Non-operational
Result: No any abnormality is detected when power on.
3.1.3. Vibration
Table 3-6 PS3111 M.2 2242 Vibration Specification
Condition
Non-operational
Frequency/Displacement
Frequency/Acceleration
20Hz~80Hz/1.52mm
80Hz~2000Hz/20G
Vibration Orientation
X, Y, Z axis/60 min for each
Result: No any abnormality is detected when power on.
3.1.4. Drop
Table 3-7 PS3111 M.2 2242 Drop Specification
Non-operational
Height of Drop
Number of Drop
80cm free fall
6 face of each unit
Result: No any abnormality is detected when power on.
3.1.5. Bending
Table 3-8 PS3111 M.2 2242 Bending Specification
Non-operational
Force
Action
≥ 20N
Hold 1min/5times
Result: No any abnormality is detected when power on.
3.1.6. Torque
Table 3-9 PS3111 M.2 2242 Torque Specification
Non-operational
Force
Action
0.5N-m or ±2.5 deg
Hold 1min/5times
Result: No any abnormality is detected when power on.
10
3.1.7. Electrostatic Discharge (ESD)
Table 3-10 PS3111 M.2 2242 Contact ESD Specification
Device
Capacity Temperature
Relative Humidity
+/- 4KV
Result
Device functions are affected,
M.2 2242
256GB
24.0°C
49% (RH)
but EUT will be back to its
normal or operational state
PASS
automatically.
3.1.8. EMI Compliance

FCC: CISPR22

CE: EN55022

BSMI 13438
3.2. MTBF
MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value
represents the average time between a repair and the next failure. The measure is typically in units of hours.
The higher the MTBF value, the higher the reliability of the device. The predicted result of Phison’s PS3111
M.2 2242 is more than 2,000,000 hours.
3.3. Certification & Compliance

RoHS

SATA III (SATA Rev. 3.2)

Up to ATA/ATAPI-8 (Including S.M.A.R.T)
11
4. ELECTRICAL SPECIFICATIONS
4.1. Supply Voltage
Table 4-1 Supply Voltage of PS3111 M.2 2242
Parameter
Rating
Operating Voltage
3.3V
4.2. Power Consumption
Table 4-2 Power Consumption of PS3111 M.2 2242
Capacity
Flash Structure
Flash Type
Read
Write
Partial
Slumber
Idle
DEVSLP
120/128GB
64GB x2
BGA, TSB 15nm
1,130
1,305
13
8.5
260
4.9
240/256GB
128GB x2
BGA, TSB 15nm
1,360
1,780
12.5
8
270
4.9
30/32GB
32GB x1
TSOP, TSB Bics2
920
810
15
10
300
4.9
60/64GB
32GB x2
TSOP, TSB Bics2
1,205
1,040
15
10
300
4.9
120/128GB
64GB x2
TSOP, TSB Bics2
1,355
1,400
15
10
300
4.9
120/128GB
64GB x2
BGA, TSB Bics2
1,355
1,400
15
10
300
4.9
240/256GB
128GB x2
TSOP, TSB Bics2
1,360
1,500
15
10
300
4.9
240/256GB
128GB x2
BGA, TSB Bics2
1,400
1,700
15
10
300
4.9
30/32GB
32GB x 1
TSOP, TSB Bics3
950
850
15
10
300
4.9
60/64GB
32GB x 2
TSOP, TSB Bics3
1,215
1,020
15
10
300
4.9
120/128GB
64GB x 2
TSOP, TSB Bics3
1,300
1,350
15
10
300
4.9
120/128GB
64GB x 2
BGA, TSB Bics3
1,270
1,360
20
15
325
4.9
240/256GB
128GB x 2
BGA, TSB Bics3
1,360
1,440
20
15
325
4.9
480/512GB
256GB x 2
BGA, TSB Bics3
1,470
1,520
22
15
325
4.9
120/128GB
48GBx1+96GBx1
BGA, Micron B0KB
1,355
1,515
14
10
300
4.9
Unit: mW
NOTES:
1.
The average value of power consumption is achieved based on 100% conversion efficiency.
2.
The measured power voltage is 3.3V.
3.
Samples were built using Toshiba 15nm, Toshiba Bics2, Bics3 and Micron B0KB TLC NAND.
It’s measured under ambient temperature.
4.
Sequential R/W is measured while testing 4000MB sequential R/W 5 times by CyrstalDiskMark. DEVSLP is
measured while entering device sleep mode for 5 minutes.
5.
Power Consumption may differ according to flash configuration and platform.
12
5. INTERFACE
5.1. Pin Assignment and Descriptions
Table 5-1 defines the signal assignment of the internal NGFF connector for SSD usage, described in the PCI
Express M.2 Specification version 1.0 of the PCI-SIG.
Table 5-1 Pin Assignment and Description of PS3111 M.2 2242
Pin #
SATA Pin
Description
1
CONFIG_3
Ground
2
3.3V
Supply pin
3
GND
Ground
4
3.3V
Supply pin
5
N/C
No Connect
6
N/C
No Connect
7
N/C
No Connect
8
N/C
9
N/C or GND
No Connect
Note
No Connect or Ground
Status indicators via LED devices that will be provided by the
10
DAS/DSS# (O) (OD)
system Active Low. A pulled-up LED with series current
limiting resistor should allow for 9mA when On.
11
N/C
12
Module Key
13
Module Key
14
Module Key
15
Module Key
16
Module Key
17
Module Key
18
Module Key
19
Module Key
20
N/C
No Connect
21
CONFIG_0
Ground
22
N/C
No Connect
23
N/C
No Connect
24
N/C
No Connect
25
N/C
No Connect
26
N/C
No Connect
27
GND
Ground
28
N/C
No Connect
No Connect
13
Pin #
SATA Pin
Description
29
N/C
No Connect
30
N/C
No Connect
31
N/C
No Connect
32
N/C
No Connect
33
GND
Ground
34
N/C
No Connect
35
N/C
No Connect
36
N/C
No Connect
37
N/C
No Connect
Device Sleep, Input.
38
DEVSLP (I) (0/3.3V)
When driven high the host is informing the SSD to enter a
low power state
39
GND
Ground
40
N/C
No Connect
41
SATA-B+
SATA differential signals in the SATA specification
42
N/C
No Connect
43
SATA-B-
SATA differential signals in the SATA specification
44
N/C
No Connect
45
GND
Ground
46
N/C
No Connect
47
SATA-A-
48
N/C
49
SATA-A+
50
N/C
No Connect
51
GND
Ground
52
N/C
No Connect
53
N/C
No Connect
54
N/C
No Connect
55
N/C
No Connect
56
57
58
Reserved for MFG
Data
GND
Reserved for MFG
Clock
59
Module Key
60
Module Key
SATA differential signals
in the SATA specification
No Connect
SATA differential signals
in the SATA specification
No Connect
Ground
No Connect
14
Pin #
SATA Pin
Description
61
Module Key
62
Module Key
63
Module Key
64
Module Key
65
Module Key
66
Module Key
67
N/C
No Connect
68
SUSCLK (I) (0/3.3V)
No Connect
69
CONFIG_1
Ground
70
3.3V
Supply pin
71
GND
Ground
72
3.3V
Supply pin
73
GND
Ground
74
3.3V
Supply pin
75
CONFIG_2
Ground
NOTE: N/C for Socket 2, and GND for Socket 3.
15
6. SUPPORTED COMMANDS
6.1. ATA Command List
The following ATA command list table is followed by ATA8-ACS4 SPEC.
Table 6-1 ATA Command List
Op Code
Description
Op Code
Description
00h
NOP
C9h
Read DMA without Retry
06h
Data Set Management
CAh
Write DMA
Recalibrate
CBh
Write DMA without Retry
20h
Read Sectors
CEh
Write Multiple FUA EXT
21h
Read Sectors without Retry
E0h
Standby Immediate
24h
Read Sectors EXT
E1h
Idle Immediate
25h
Read DMA EXT
E2h
Standby
27h
Read Native Max Address EXT
E3h
Idle
29h
Read Multiple EXT
E4h
Read Buffer
2Fh
Read Log EXT
E5h
Check Power Mode
30h
Write Sectors
E6h
Sleep
31h
Write Sectors without Retry
E7h
Flush Cache
34h
Write Sectors EXT
E8h
Write Buffer
35h
Write DMA EXT
E9h
READ BUFFER DMA
37h
Set Native Max Address EXT
EAh
Flush Cache EXT
38h
CFA Write Sectors Without Erase
EBh
Write Buffer DMA
39h
Write Multiple EXT
ECh
Identify Device
3Dh
Write DMA FUA EXT
EFh
Set Features
3Fh
Write Long EXT
EFh
02h
Enable volatile write cache
40h
Read Verify Sectors
EFh
03h
Set transfer mode
41h
Read Verify Sectors without Retry
EFh
05h
Enable the APM feature set
42h
Read Verify Sectors EXT
EFh
10h
Enable use of SATA features et
44h
Zero EXT
EFh
10h
02h
45h
Write Uncorrectable EXT
EFh
10h
03h
47h
Read Log DMA EXT
EFh
10h
06h
57h
Write Log DMA EXT
EFh
10h
07h
60h
Read FPDMA Queued
EFh
10h
09h
61h
Write FPDMA Queued
EFh
55h
Disable read look-ahead
Seek
EFh
66h
Disable reverting to power-on defaults
10h-1Fh
70h-7Fh
Enable DMA Setup FIS Auto-Activate
optimization
Enable Device-initiated interface
power state (DIPM) transitions
Enable Software Settings Preservation
(SSP)
Enable Device Automatic Partial to
Slumber transitions
Enable Device Sleep
16
Op Code
Description
Op Code
Description
90h
Execute Device Diagnostic
EFh
82h
Disable volatile write cache
91h
Initialize Device Parameters
EFh
85h
Disable the APM feature set
92h
Download Microcode
EFh
90h
Disable use of SATA feature set
93h
Download Microcode DMA
EFh
90h
02h
B0h
SMART
EFh
90h
03h
Disable DMA Setup FIS Auto-Activate
optimization
Disable Device-initiated interface
power state (DIPM) transitions
Disable Software Settings Preservation
B0h
D0h
SMART READ DATA
EFh
90h
06h
B0h
D1h
SMART READ ATTRIBUTE THRESHOLDS
EFh
90h
07h
B0h
D2h
EFh
90h
09h
B0h
D3h
SMART SAVE ATTRIBUTE VALUES
EFh
AAh
Enable read look-ahead
B0h
D4h
SMART EXECUTE OFF-LINE IMMEDIATE
EFh
CCh
Enable reverting to power-on defaults
B0h
D5h
SMART READ LOG
F1h
Security Set Password
B0h
D6h
SMART WRITE LOG
F2h
Security Unlock
B0h
D8h
SMART ENABLE OPERATIONS
F3h
Security Erase Prepare
B0h
D9h
SMART DISABLE OPERATIONS
F4h
Security Erase Unit
B0h
DAh
SMART RETURN STATUS
F5h
Security Freeze Lock
B0h
DBh
F6h
Security Disable Password
SMART ENABLE/DISABILE ATTRIBUTE
AUTOSAVE
SMART ENABLE/DISABILE AUTOMATIC
OFF-LINE
(SSP)
Disable Device Automatic Partial to
Slumber transitions
Disable Device Sleep
B1h
Device Configuration
F8h
Read Native Max Address
B4h
Sanitize
F9h
Set Max Address
C4h
Read Multiple
F9h
01h
SET MAX SET PASSWORD
C5h
Write Multiple
F9h
02h
SET MAXLOCK
C6h
Set Multiple Mode
F9h
03h
SET MAX UNLOCK
C8h
Read DMA
F9h
04h
SET MAX FREEZE LOCIK
17
6.2. Identify Device Data
The following table details the sector data returned by the IDENTIFY DEVICE command of ATA8-ACS4 SPEC.
Table 6-2 List of Device Identification
F: Fixed
V: Variable
Word
X:
Default Value
Description
retired/obsolete
/reserved
0
F
0040h
General configuration bit-significant information
1
X
*1
2
F
C837h
Specific configuration
3
X
0010h
Obsolete
4-5
X
00000000h
6
X
003Fh
7-8
X
00000000h
Obsolete
Retired
Obsolete
Reserved for assignment by the Compact Flash
Association
9
X
0000h
Retired
10-19
V
Varies
Serial number (20 ASCII characters)
20-21
X
00000000h
22
X
0000h
Obsolete
23-26
V
Varies
Firmware revision (8 ASCII characters)
27-46
V
Varies
Model number (xxxxxxxx)
47
F
8010h
7:0- Maximum number of sectors transferred per
Retired
interrupt on MULTIPLE commands
48
F
4000h
Trusted Computing feature set options(not support)
49
F
2F00h
Capabilities
50
F
4000h
Capabilities
51-52
X
000000000h
53
F
0007h
54
X
*1
Obsolete
55
X
0010h
Obsolete
56
X
003Fh
Obsolete
57-58
X
*2
Obsolete
59
F
5D10h
Obsolete
Words 88 and 70:64 valid
Sanitize and Number of sectors transferred per
interrupt on MULTIPLE commands
60-61
V
*3
62
X
0000h
Word
F: Fixed
Default Value
Maximum number of sector ( 28bit LBA mode)
Obsolete
Description
18
V: Variable
X:
retired/obsolete
/reserved
63
F
0407h
Multi-word DMA modes supported/selected
64
F
0003h
PIO modes supported
65
F
0078h
Minimum Multiword DMA transfer cycle time per
word
66
F
0078h
Manufacturer’s recommended Multiword DMA
transfer cycle time
67
F
0078h
Minimum PIO transfer cycle time without flow control
68
F
0078h
Minimum PIO transfer cycle time with IORDY flow
control
69
F
1D00h
Additional Supported (support download microcode
DMA)
70
X
0000h
71-74
X
000000000000
Reserved
Reserved for the IDENTIFY PACKET DEVICE command
0000h
75
F
001Fh
Queue depth
76
F
850Eh
Serial SATA capabilities
77
F
0006h
Serial ATA Additional Capabilities
78
F
004Ch
Serial ATA features supported
79
F
0040h
Serial ATA features enabled
80
F
0FF8h
Major Version Number
81
F
0000h
Minor Version Number
82
F
746Bh
Command set supported
83
F
7D01h
Command set supported
84
F
4163h
Command set/feature supported extension
85
F
7469h
Command set/feature enabled
86
F
BC01h
Command set/feature enabled
87
F
6163h
Command set/feature default
88
F
007Fh
Ultra DMA Modes
89
F
0003h
Time required for security erase unit completion
90
F
001Eh
Time required for Enhanced security erase completion
91
F
0000h
Current advanced power management value
92
F
FFFEh
Master Password Revision Code
93
F
0000h
Hardware reset result. For SATA devices, word 93 shall
be set to the value 0000h.
Word
F: Fixed
Default Value
Description
19
V: Variable
X:
retired/obsolete
/reserved
94
X
0000h
Obsolete
95
F
0000h
Stream Minimum Request Size
96
F
0000h
Streaming Transfer Time – DMA
97
F
0000h
Streaming Access Latency – DMA and PIO
98-99
F
0000h
Streaming Performance Granularity
100-103
V
*4
104
F
0000h
Streaming Transfer Time – PIO
105
F
0008h
Maximum number of 512-byte blocks per DATA SET
Maximum user LBA for 48 bit Address feature set
MANAGEMENT command
106
F
4000h
Physical sector size/Logical sector size
107
F
0000h
Inter-seek delay for ISO-7779 acoustic testing in
microseconds
108-111
V
Varies
112-115
X
000000000000
World Wide Name
Reserved
0000h
116
X
0000h
Reserved
117-118
F
00000000h
119
F
401Ch
Supported settings
120
F
401Ch
Command set/Feature Enabled/Supported
121-126
X
0h
Reserved
127
X
0000h
Obsolete
128
F
0021h
Security status
129-140
V
Varies
Vendor specific
141
V
Varies
Vendor specific
142-159
V
Varies
Vendor specific
160
X
000h
Reserved for CFA
161-167
X
0h
Reserved for CFA
168
V
Varies
Device Nominal Form Factor
169
F
0001h
DATA SET MANAGEMENT command is supported
170-173
F
000000000000
Words per logical Sector
Additional Product Identifier
000
0h
174-175
X
00000000h
176-205
F
0h
Reserved
Current media serial number
20
F: Fixed
V: Variable
Word
X:
Default Value
Description
retired/obsolete
/reserved
206
F
000h
SCT Command Transport
207-208
X
00000000h
209
F
4000h
210-211
F
00000000h
Write-Read-Verify Sector Count Mode 3 (not support)
212-213
F
00000000h
Write-Read-Verify Sector Count Mode 2 (not support)
214-216
X
0h
217
F
0001h
Non-rotating media device
218
X
000h
Reserved
219
X
0000h
NV Cache relate (not support)
220
V
0000h
Write read verify feature set current mode
221
X
0000h
Reserved
222
F
10FFh
Transport major version number
223
F
0000h
Transport minor version number
224-229
X
0h
230-233
F
000000000000
Reserved
Alignment of logical blocks within a physical block
Obsolete
Reserved
Extend number of user addressable sectors
0000h
234
F
0001h
Minimum number of 512-byte data blocks per
DOWNLOAD MICROCODE command for mode 03h
235
F
FFFEh
Maximum number of 512-byte data blocks per
DOWNLOAD MICROCODE command for mode 03h
236-254
X
0h
255
F
XXA5h
Reserved
Integrity word (Checksum and Signature)
XX is variable
Table 6-3 List of Device Identification for Each Capacity
Capacity
*1
*2
*3
*4
(GB)
(Word 1/Word 54)
(Word 57 – 58)
(Word 60 – 61)
(Word 100 – 103)
32
3FFFh
FBFC10h
3BA2EB0h
3BA2EB0h
64
3FFFh
FBFC10h
7740AB0h
7740AB0h
120
3FFFh
FBFC10h
DF94BB0h
DF94BB0h
128
3FFFh
FBFC10h
EE7C2B0h
EE7C2B0h
240
3FFFh
FBFC10h
FFFFFFFh
1BF244B0h
256
3FFFh
FBFC10h
FFFFFFFh
1DCF32B0h
480
3FFFh
FBFC10h
FFFFFFFh
37E436B0h
21
512
3FFFh
FBFC10h
FFFFFFFh
3B9E12B0h
22
7. PHYSICAL DIMENSION
Dimension: 42mm (L) x 22mm (W) x 3.8mm (H)
23
24
8. PRODUCT WARRANTY POLICY
In the event the Product does not conform to the specification within Phison agreed warranty
period and such inconformity is solely attributable to Phison’s cause, Phison agrees at its discretion
replace or repair the nonconforming Product. Notwithstanding the foregoing, the aforementioned
warranty shall exclude the inconformity arising from, in relation to or associated with:
(1) alternation, modification, improper use, misuse or excessive use of the Product;
(2) failure to comply with Phison’s instructions;
(3) Phison’s compliance with customer (including customer’s suppliers, subcontractors or
downstream customers) indicated instructions, technologies, designs, specifications,
materials, components, parts;
(4) combination of the Product with other materials, components, parts, goods, hardware,
firmware or software not developed by Phison; or
(5) other error or failure not solely attributable to Phison’s cause (including without limitation,
normal wear or tear, manufacturing or assembly wastage, improper operation, virus,
unauthorized maintenance or repair).
EXCEPT FOR THE ABOVE EXPRESS LIMITED WARRANTY, THE PRODUCT IS PROVIDED “AS IS,” AND
PHISON MAKES NO OTHER WARRANTIES (WHETHER EXPRESS, IMPLIED, STATUTORY OR
OTHERWISE) REGARDING THE PRODUCT OR ANY PORTION OF IT. PHISON SPECIFICALLY DISCLAIMS
ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,
NONINFRINGEMENT. UNLESS OTHERWISE PHISON AGREED IN WRITING, PHISON DOES NOT
RECOMMEND NOR WARANT PRODUCTS FOR USE IN LIFE SUPPORT, NUCLEAR, MEDICAL, MILITARY,
TRANSPORTATION, AUTOMOTIVE, AVIATION, AEROSPACE INDUSTRY OR OTHER APPLICATIONS
WHEREIN A FAILURE OR DEFECT OF THE PRODUCT MAY THREATEN LIFE, INJURY, HEALTH, LOSS OF
SIGNIFICANT AMOUNT OF MONEY (“CRITICAL USE”), AND CUSTOMER AND USER HEREBY
ASSUMES ALL RISK OF ANY CRITICAL USE OF THE PRODUCT.
25
9. REFERENCE
The following table is to list out the standards that have been adopted for designing the product.
Table 9-1 List of References
Title
RoHS
Acronym/Source
Restriction of Hazardous Substances Directive; for further information,
please contact us at sales@phison.com or support@phison.com.
M.2
http://www.pcisig.com
Serial ATA Revision 3.2
http://www.sata-io.org
ATA-8 spec
FCC: CISPR22
CE: EN55022
http://www.t13.org
Federal Communications Commission; for further information, please
contact us at sales@phison.com or support@phison.com.
Consumer electronics certification; for further information, please
contact us at sales@phison.com or support@phison.com.
The Bureau of Standards, Metrology and Inspection; for further
BSMI: 13438
information, please contact us at sales@phison.com or
support@phison.com.
26
10.
TERMINOLOGY
The following table is to list out the acronyms that have been applied throughout the document.
Table 10-1 List of Terminology
Term
ATTO
DEVSLP
Definitions
Commercial performance benchmark application
Device sleep mode
DIPM
Device initiated power management
HIPM
Host initiated power management
LBA
Logical block addressing
MB
Mega-byte
MTBF
Mean time between failures
NCQ
Native command queue
SATA
Serial advanced technology attachment
SDR
Synchronous dynamic access memory
S.M.A.R.T.
SSD
Self-monitoring, analysis and reporting technology
Solid state disk
27
Download PDF
Similar pages