RM23708/12/24 RB23708/12/24

RM23708/12/24
RB23708/12/24
Technical Product Specification
A document providing an overview of product features, functions, architecture,
and support specifications
Revision 1.1
March 2017
Chenbro RM Product Marketing
Revision History
Date
Revision Number
Modifications
2016/12/9
R0.9
Initial Release
2017/1/19
R1.0
Official version
2017/3/13
R1.1_draft0.91
Add RM23724 spec and warning
2017/3/20
R1.1_draft0.92
Add RM23708 spec
2017/3/22
R1.1_final
Modified warning description
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RM237 Series and RB237 Series TPS
Disclaimers
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by
this document.
Chenbro disclaims all express and implied warranties, including without limitation, the implied warranties
of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising
from course of performance, course of dealing, or usage in trade.
This document contains information on products, services and/ or processes in development. All
information provided here is subject to change without notice. Contact your Chenbro representative to
obtain the latest TPS.
The products and services described may contain defects or errors known as errata which may
cause deviations from published specifications. Current characterized errata are available on
request.
Chenbro, and the Chenbro logo are trademarks of Chenbro Micorn Co.,Ltd in the worldwide.
*Other names and brands may be claimed as the property of others
© 2017 Chenbro Micorn Co.,Ltd.
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RM237 Series and RB237 Series TPS
Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or
any other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components will void the UL listing and other regulatory approvals of the product and will most
likely result in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power button DOES NOT turn off the system AC power. To remove power from
the system, you must unplug the AC power cord from the wall outlet. Make sure the AC power cord is
unplugged before you open the chassis, add, or remove any components.
Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the server and disconnect the power cord,
telecommunications systems, networks, and modems attached to the server before opening it. Otherwise,
personal injury or equipment damage can result.
Electrostatic discharge (ESD) and ESD protection: ESD can damage disk drives, boards, and other
parts. We recommend that you perform all procedures in this chapter only at an ESD workstation. If one is
not available, provide some ESD protection by wearing an antistatic wrist strap attached to chassis ground any unpainted metal surface - on your server when handling parts.
ESD and handling boards: Always handle boards carefully. They can be extremely sensitive to ESD. Hold
boards only by their edges. After removing a board from its protective wrapper or from the server, place the
board component side up on a grounded, static free surface. Use a conductive foam pad if available but not
the board wrapper. Do not slide board over any surface.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine
needle nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to
remove or install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides.
Gripping the wide sides can damage the contacts inside the jumper, causing intermittent problems with the
function controlled by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to
remove a jumper, or you may bend or break the pins on the board.
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RM237 Series and RB237 Series TPS
Table of Contents
1.
2.
Introduction ............................................................................................................................................................ 1
1.1
Chapter Outline ...................................................................................................................................... 1
1.2
Server Board Use Disclaimer ................................................................................................................. 1
1.3
Product Errata......................................................................................................................................... 2
Product Overview ................................................................................................................................................... 3
2.1
2.1.1
OS Validation Levels ............................................................................................................................. 5
2.1.2
OS Technical Support Levels................................................................................................................. 5
2.2
System Features Overview ..................................................................................................................... 5
2.3
Server Board Features Overview ........................................................................................................... 6
2.4
Back Panel Features ............................................................................................................................... 9
2.5
Front Control Panel ................................................................................................................................ 9
2.6
Front Drive Bay Options ...................................................................................................................... 10
2.7
System Dimensions .............................................................................................................................. 10
2.7.1
Chassis Dimensions ............................................................................................................................. 10
2.7.2
HDD Tray Dimensions ........................................................................................................................ 11
2.7.3
Pull-out Tag Label Emboss Dimensions .............................................................................................. 12
2.8
Available Rack Mounting Kit Options................................................................................................. 13
2.9
System Level Environmental Limits .................................................................................................... 13
2.10
System Packaging ................................................................................................................................ 14
2.10.1
3.
Operating System Support ..................................................................................................................... 4
RM23708/12/24 Weight Information................................................................................................... 15
System Power ........................................................................................................................................................ 16
3.1
General Description And Scope ........................................................................................................... 16
3.1.1
Power Supply Module Mechanical Overview ..................................................................................... 17
3.1.2
LED Marking and Identification .......................................................................................................... 18
3.1.3
Power Supply Card Edge Pin-Out ........................................................................................................ 19
3.1.4
Environmental Requirements ............................................................................................................... 19
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RM237 Series and RB237 Series TPS
3.1.4.1
Temperature and Humidity Requirements ......................................................................... 19
3.1.4.2
Altitude Requirements ........................................................................................................ 20
3.2
Electrical Performance ......................................................................................................................... 20
3.2.1
AC power Input Specification ............................................................................................................. 20
3.2.1.1
AC Inlet connector ............................................................................................................. 20
3.2.1.2
Input voltage and frequency specification .......................................................................... 20
3.2.1.3
HVDC Input voltage........................................................................................................... 20
3.2.1.4
Input current ....................................................................................................................... 21
3.2.1.5
AC Line Fuse...................................................................................................................... 21
3.2.1.6
AC line inrush..................................................................................................................... 21
3.2.1.7
Input Power Factor Correction ........................................................................................... 21
3.2.1.8
AC line dropout .................................................................................................................. 21
3.2.1.9
Efficiency ........................................................................................................................... 22
3.2.1.10
Suspeceptibility Requirements ........................................................................................... 22
3.2.1.10.1
Electrical Discharge Susceptibility ...................................................................................................... 22
3.2.1.10.2
Fast Transient/Burst .................................................................................................................... 22
3.2.1.10.3
Radiated Immunity............................................................................................................................... 22
3.2.1.10.4
Surge Immunity ................................................................................................................................... 23
3.2.1.10.5
AC Line Transient Specification ......................................................................................................... 23
3.2.1.10.6
AC line fast transient (EFT) specification ........................................................................................... 23
3.2.2
3.2.1.11
Power Recovery.................................................................................................................. 24
3.2.1.12
Voltage Brown Out............................................................................................................. 24
3.2.1.13
AC Line Leakage Current .................................................................................................. 24
DC output voltages .............................................................................................................................. 24
3.2.2.1
Grounding ........................................................................................................................... 24
3.2.2.2
Output rating....................................................................................................................... 24
3.2.2.3
Auxiliary Output (Standby) ................................................................................................ 24
3.2.2.4
No load operation ............................................................................................................... 24
3.2.2.5
Voltage Regulation ............................................................................................................. 25
3.2.2.6
Ripple and Noise Regulation .............................................................................................. 25
3.2.2.7
Dynamic loading ................................................................................................................ 25
3.2.2.8
Capacitive load ................................................................................................................... 25
3.2.2.9
Close loop stability ............................................................................................................. 26
3.2.2.10
Residual Voltage Immunity in Standby mode .................................................................... 26
3.2.2.11
Soft starting ........................................................................................................................ 26
3.2.2.12
Hot Swap Requirements ..................................................................................................... 26
3.2.2.13
Load sharing control ........................................................................................................... 26
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RM237 Series and RB237 Series TPS
3.2.3
3.2.4
3.3
Timing Requirements ........................................................................................................................... 27
3.2.3.1
Output Voltage Timing ....................................................................................................... 27
3.2.3.2
Overshoot ............................................................................................................................ 28
3.2.3.3
Undershoot .......................................................................................................................... 28
3.2.3.4
Temperature coefficient ...................................................................................................... 28
Control and Indicator functions............................................................................................................ 28
3.2.4.1
PSON# Input Signal (Power supply enable)....................................................................... 28
3.2.4.2
Power OK (PG or PWOK) Output Signal .......................................................................... 29
3.2.4.3
SMBAlert# (PSAlert) Output Signal Pin ............................................................................ 29
3.2.4.4
A0 ....................................................................................................................................... 30
3.2.4.5
A1 ....................................................................................................................................... 30
3.2.4.6
12VRS and Return Sense.................................................................................................... 30
3.2.4.7
Present................................................................................................................................. 30
3.2.4.8
SDA and SCL ..................................................................................................................... 30
Protection circuits................................................................................................................................. 31
3.3.1
Over Voltage Protection (OVPmain & OVPauxilary ) ........................................................................ 31
3.3.2
Over Current and Short Circuit Protection (OCP/SCPmain & OCP/SCPauxilary ) ............................ 31
3.3.3
Over Temperature Protection (OTP) .................................................................................................... 31
3.3.4
Fan Failure Protection .......................................................................................................................... 32
3.4
Power Supply Management ................................................................................................................. 32
3.4.1
Hardware Layer.................................................................................................................................... 32
3.4.2
Power Supply Management Controller (PSMC) .................................................................................. 33
3.4.3
3.5
3.5.1
3.4.2.1
Related Documents ............................................................................................................. 33
3.4.2.2
Data Speed .......................................................................................................................... 33
3.4.2.3
Bus Errors ........................................................................................................................... 33
3.4.2.4
Write byte/word .................................................................................................................. 34
3.4.2.5
Read byte/word ................................................................................................................... 34
3.4.2.6
Block write/read.................................................................................................................. 35
3.4.2.7
Sensor Accuracy ................................................................................................................. 35
3.4.2.8
PSMC Sensors .................................................................................................................... 36
Power Supply Field Replacement Unit (FRU) ..................................................................................... 36
Smart On Function ............................................................................................................................... 42
PMBus command for Smart On ........................................................................................................... 42
3.5.1.1
Hardware Connection ......................................................................................................... 42
3.5.1.2
Configuring Smart On with SMART_ON_CONFIG (D0h) .............................................. 42
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RM237 Series and RB237 Series TPS
3.5.2
3.5.3
3.6
3.5.2.1
Powering on Smart Standby supplies to maintain best efficiency ...................................... 43
3.5.2.2
Powering on Smart Standby supplies during a fault or over current condition .................. 43
The Way to Enable Smart On Function ............................................................................................... 43
ENVIRONMENTAL ........................................................................................................................... 43
3.6.1
Temperature ......................................................................................................................................... 44
3.6.2
Humidity .............................................................................................................................................. 44
3.6.3
Altitude ................................................................................................................................................ 44
3.6.4
Vibration .............................................................................................................................................. 44
3.6.5
Mechanical Shock ................................................................................................................................ 44
3.6.6
Thermal shock (Shipping).................................................................................................................... 44
3.6.7
Catastrophic Failure ............................................................................................................................. 44
3.6.8
EMI ...................................................................................................................................................... 44
3.6.9
Magnetic Leakage Fields ..................................................................................................................... 45
3.6.10
Voltage Fluctuations and Flicker ......................................................................................................... 45
3.7
4.
Smart Standby Power Supply Operating State .................................................................................... 42
Reliability / Warranty / Service ........................................................................................................... 45
3.7.1
Mean Time between Failures (MTBF) ................................................................................................ 45
3.7.2
Warranty .............................................................................................................................................. 45
3.7.3
Serviceability ....................................................................................................................................... 45
Thermal Management ......................................................................................................................................... 46
4.1
Thermal Operation and Configuration Requirements .......................................................................... 47
4.2
Thermal Management Overview ......................................................................................................... 49
4.2.1
Fan Speed Control ............................................................................................................................... 50
4.2.2
Programmable Fan PWM Offset ......................................................................................................... 50
4.2.3
Hot-Swap Fans ..................................................................................................................................... 50
4.2.4
Fan Redundancy Detection .................................................................................................................. 50
4.2.5
Fan Domains ........................................................................................................................................ 51
4.2.6
Nominal Fan Speed .............................................................................................................................. 51
4.2.7
Thermal and Acoustic Management .................................................................................................... 51
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RM237 Series and RB237 Series TPS
4.2.8
5.
4.3
System Fans ......................................................................................................................................... 53
4.4
Power Supply Module Fans ................................................................................................................. 54
System Storage and Peripheral Drive Bay Overview ....................................................................................... 55
5.1
Front Mount Drive Support .................................................................................................................. 55
5.2
System Fan RVI and Hard Disk Drive Storage Performance .............................................................. 55
5.3
External Hot Swap Drive Carriers ....................................................................................................... 56
5.4
Peripheral Power Sources .................................................................................................................... 58
5.5
Storage Backplane Optional ................................................................................................................. 59
5.5.1
SGPIO Functionality ............................................................................................................................ 60
5.5.2
I2C Functionality ................................................................................................................................. 60
5.5.3
3.5’’ Drive Hot-Swap Backplane Overview ........................................................................................ 60
12G Mini SAS HD 12 Port Backplane ............................................................................... 60
5.5.3.2
12G Mini SAS HD 12 Port Backplane ............................................................................... 62
5.5.3.3
3.5’’ drive Backplane pin define......................................................................................... 63
SW Function......................................................................................................................................... 66
5.5.4
24 x 2.5” Drive Hot-Swap active Backplane Overview....................................................................... 67
5.5.4.1
24 port active backplane block diagram ............................................................................. 67
5.5.4.2
12G active backplane with Mini-SAS HD interface........................................................... 68
5.5.4.3
12G 16 port passive backplane ........................................................................................... 69
5.5.4.4
12G 8 port passive backplane ............................................................................................. 70
5.5.4.5
12G 24 port active backplane Pin definition....................................................................... 71
8x3.5’’ Drive Hot Swap passive backplane overview ......................................................................... 76
5.6
2 x 2.5’’ Hot Swap Drive Bay Accessory Kit ...................................................................................... 76
5.7
Low Profile eUSB SSD Support .......................................................................................................... 78
5.8
SATA DOM Support ........................................................................................................................... 79
Front Control Panel and I/O Panel Overview ................................................................................................... 81
6.1
I/O Panel Features ................................................................................................................................ 81
6.2
Control Panel Features ......................................................................................................................... 81
6.2.1
7.
5.5.3.1
5.5.3.3.1
5.5.5
6.
Thermal Sensor Input to Fan Speed Control ........................................................................................ 52
LED Board with Cable and Connectors ............................................................................................... 82
PCIe* Riser Card Support .................................................................................................................................. 84
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RM237 Series and RB237 Series TPS
7.1
Riser Card Assembly ........................................................................................................................... 84
7.2
Riser Card Option ................................................................................................................................ 85
7.2.1
2-Slot PCIe Riser Card – Chenbro Product Code: 80H09323702A1 .................................................. 85
7.2.2
3-Slot PCIe Riser Card – Chenbro Product Code: 80H09323701A0 .................................................. 86
8.
Intel® I/O Module Support ................................................................................................................................. 87
9.
Basic and Advanced Server Management Features ......................................................................................... 88
9.1.1
Dedicated Management Port ................................................................................................................ 89
9.1.2
Embedded Web Server ........................................................................................................................ 89
9.1.3
Advanced Management Feature Support (RMM4 Lite) ...................................................................... 91
9.1.3.1
Keyboard, Video, Mouse (KVM) Redirection ................................................................... 91
9.1.3.2
Remote Console.................................................................................................................. 92
9.1.3.3
Performance ........................................................................................................................ 92
9.1.3.4
Security ............................................................................................................................... 93
9.1.3.5
Availability ......................................................................................................................... 93
9.1.3.6
Usage .................................................................................................................................. 93
9.1.3.7
Force-enter BIOS Setup ..................................................................................................... 93
9.1.3.8
Media Redirection .............................................................................................................. 93
Appendix A: Integration and Usage Tips ..................................................................................................................... 95
Appendix B: POST Code Diagnostic LED Decoder .................................................................................................... 96
Appendix C: POST Code Errors................................................................................................................................. 101
Appendix D: System Cable Routing Diagram ............................................................................................................ 108
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RM237 Series and RB237 Series TPS
List of Figures
Figure 1.System Components Overview......................................................................................................................... 6
Figure 2.Top Cover Features .......................................................................................................................................... 6
Figure 3.Server Board S2600WT Features .................................................................................................................... 7
Figure 4.On-board Diagnostic LEDs .............................................................................................................................. 8
Figure 5.DIMM Fault LEDs ............................................................................................................................................ 8
Figure 6.System Reset and Configuration Jumpers ...................................................................................................... 9
Figure 7. Back Panel Feature Identification .................................................................................................................. 9
Figure 8. Front Control Panel Options......................................................................................................................... 10
Figure 9.3.5’’ Drive Bay-12 Drive Configuration ........................................................................................................ 10
Figure 10.2.5’’ Drive Bay-24 Drive Configuration ...................................................................................................... 10
Figure 11.3.5’’ Drive Bay-8 Drive Configuration ........................................................................................................ 10
Figure 12. Chassis Dimensions ...................................................................................................................................... 11
Figure 13. 3.5’’ HDD Tray Dimensions ........................................................................................................................ 12
Figure 14. 2.5’’ HDD Tray Dimensions ........................................................................................................................ 12
Figure 15. Pull-out Tag Label Emboss Dimensions ..................................................................................................... 13
Figure 16. 800W AC Fixed Power Supply.................................................................................................................... 16
Figure 17. Power Supply installation ............................................................................................................................ 16
Figure 18. Energy hazards warning aera ..................................................................................................................... 17
Figure 19. FSP800W-20ERM Power Supply Mechanical drawings .......................................................................... 18
Figure 20. FSP800W-20ERM Card Edge Diminsion .................................................................................................. 18
Figure 21.Turn On/Off Timing (Power Supply Signals) ............................................................................................. 28
Figure 22.Write byte protocol with PEC ...................................................................................................................... 34
Figure 23.Write Word protocol with PEC ................................................................................................................... 34
Figure 24.Read byte protocol with PEC ....................................................................................................................... 34
Figure 25.Read Word protocol with PEC .................................................................................................................... 34
Figure 26.Block Write with PEC .................................................................................................................................. 35
Figure 27.Block Read with PEC ................................................................................................................................... 35
Figure 28.System Air Flow and Fan Identification ..................................................................................................... 46
Figure 29.Fan Control Model ........................................................................................................................................ 53
Figure 30.System Fan Connector Locations ................................................................................................................ 53
Figure 31.System Fan Assembly ................................................................................................................................... 54
Figure 32. 12x3.5’’ Drive Bay Configuration ............................................................................................................... 55
Figure 33. 24x2.5’’ Drive Bay Configuration ............................................................................................................... 55
Figure 34. 8x3.5’’ Drive Bay Configuration ................................................................................................................. 55
Figure 35. 2.5’’/3.5’’ Hot Swap Storage Device Carrier Removal ............................................................................. 56
Figure 36. 2.5’’ SSD mounted to 3.5’’ Drive Tray ....................................................................................................... 57
Figure 37.3.5''/2.5’’HDD Installation ........................................................................................................................... 57
Figure 38.3.5''/2.5’’HDD Removal ................................................................................................................................ 57
Figure 39. Drive Tray LED Identification ................................................................................................................... 57
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RM237 Series and RB237 Series TPS
Figure 40.Server Board Peripheral Power Connectors ...............................................................................................58
Figure 41. Backplane Installation-12x3.5’’ ...................................................................................................................59
Figure 42. Backplane Installation-24x2.5’’ ...................................................................................................................59
Figure 43. Backplane Installation-8x3.5’’ .....................................................................................................................60
Figure 44. 12G Mini SAS HD 12 Port Backplane– front view ....................................................................................61
Figure 45. 12G Mini SAS HD 12 Port Backplane – rear view.....................................................................................62
Figure 46. 12G Mini SAS HD 8 Port Backplane– front view ......................................................................................63
Figure 47. 12G Mini SAS HD 8 Port Backplane – rear view.......................................................................................63
Figure 48.SW Function ...................................................................................................................................................67
Figure 49. 24 port active backplane block diagram .....................................................................................................68
Figure 50. 12G active Backplane with Mini SAS HD interface– front view ..............................................................69
Figure 51. 12G active Backplane with Mini SAS HD interface– rear view................................................................69
Figure 52. 12G 16 port Backplane– front view .............................................................................................................70
Figure 53. 12G 16 port Backplane– rear view ..............................................................................................................70
Figure 54. 12G 8 port Backplane– front view ...............................................................................................................71
Figure 55. 12G 8 port Backplane– rear view ................................................................................................................71
Figure 56.2 x 2.5'' Rear Mount Backplane Kit Placement ..........................................................................................76
Figure 57.2 x 2.5'' Hot Swap Backplane ........................................................................................................................77
Figure 58.Low Profile eUSB SSD ..................................................................................................................................79
Figure 59. Apacer* and Innodisk* Dimension .............................................................................................................79
Figure 60.SATA DOM Placement .................................................................................................................................80
Figure 61. Front I/O Panel Features..............................................................................................................................81
Figure 62. Front Panel Control and Buttons ................................................................................................................81
Figure 63.LED Board with Cable and Connectors .............................................................................................................82
Figure 64.LED Connectors Pin-out ...............................................................................................................................83
Figure 65. Riser Card Bracket 1 ....................................................................................................................................84
Figure 66. Riser Card Bracket 2 ....................................................................................................................................84
Figure 67. Riser Card Assembly ....................................................................................................................................85
Figure 68. 2-Slot PCIe Riser Card .................................................................................................................................85
Figure 69. 2-Slot PCIe Riser Card .................................................................................................................................86
Figure 70. Intel ® I/O Module Placement .....................................................................................................................87
Figure 71. Intel® RMM4 Lite Activation Key Installation .........................................................................................89
Figure 72. Replacing the Backup Battery .....................................................................................................................89
Figure 73. POST Diagnostic LED Location ..................................................................................................................96
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RM237 Series and RB237 Series TPS
List of Tables
Table 1.Reference Documents ......................................................................................................................................... 1
Table 2. Chenbro RM23708/12/24 Feature Set .............................................................................................................. 3
Table 3. Operating System Support List ........................................................................................................................ 4
Table 4. Operating System Validation Levels ................................................................................................................ 5
Table 5. System Environmental Limits Summary ...................................................................................................... 13
Table 6. RM23708/12/24 Weight Information ............................................................................................................. 15
Table 7.LED Status Information .................................................................................................................................. 18
Table 8.LED Status Information .................................................................................................................................. 19
Table 9.Temperature Requirements ............................................................................................................................. 19
Table 10.Altitude Requirements ................................................................................................................................... 20
Table 11.Rated output power for each input voltage range ....................................................................................... 20
Table 12.HVDC input voltage range ............................................................................................................................ 20
Table 13.Maximum input current ................................................................................................................................ 21
Table 14.Power Factor correction ................................................................................................................................ 21
Table 15.H0ld-up time until Power output goes out of regulations ........................................................................... 22
Table 16.Module efficiency requirements .................................................................................................................... 22
Table 17.Performance criteria ...................................................................................................................................... 22
Table 18.AC Line SAG transient performance ........................................................................................................... 23
Table 19.AC Line SURGE transient performance ...................................................................................................... 23
Table 20.Output Power and Current Ratings ............................................................................................................. 24
Table 21.Output Voltage regulation ............................................................................................................................. 25
Table 22.Ripple and Noise Regulation.......................................................................................................................... 25
Table 23.Transient Load Requirements ....................................................................................................................... 25
Table 24.Capacitive Loading Conditions ..................................................................................................................... 26
Table 25.Load share bus output characteristics .......................................................................................................... 27
Table 26.Turn on/off timing .......................................................................................................................................... 27
Table 27.PS ON# signal characteristics ........................................................................................................................ 28
Table 28.PWOK signal characteristics ......................................................................................................................... 29
Table 29.PWOK signal characteristics ......................................................................................................................... 30
Table 30.Over Voltage Protection requirements ......................................................................................................... 31
Table 31.Over Current/Short Circuit Protection ........................................................................................................ 31
Table 32.Over Temperature Protection ....................................................................................................................... 32
Table 33.Fan Failure Protection ................................................................................................................................... 32
Table 34.Fan Failure Protection ................................................................................................................................... 33
Table 35.Sensor Accuracy ............................................................................................................................................. 35
Table 36.PSMC Sensor list ............................................................................................................................................ 36
Table 37.Sensor Accuracy ............................................................................................................................................. 36
Table 38.FRU Data Format ........................................................................................................................................... 37
Table 39.SMART_ON_CONFIG .................................................................................................................................. 42
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RM237 Series and RB237 Series TPS
Table 40. System Volumetric Air Flow-RM23712 .......................................................................................................46
Table 41. System Volumetric Air Flow-RM23724 .......................................................................................................46
Table 42. System Volumetric Air Flow-RM23708 .......................................................................................................47
Table 43. System Fan Connector Pin-out......................................................................................................................53
Table 44 Drive Power LED/Activity LED States .........................................................................................................57
Table 45.12G Mini SAS HD 12 Port Backplane specification .....................................................................................60
Table 46.12G Mini SAS HD 8 Port Backplane specification .......................................................................................62
Table 47.Connector Pin-out – Mini SAS HD Backplane .............................................................................................63
Table 48.SW Function Setting .......................................................................................................................................67
Table 49.12G Active Backplane Specification ..............................................................................................................68
Table 50.12G 16 port Backplane Specification .............................................................................................................69
Table 51.12G 8 port Backplane Specification ...............................................................................................................70
Table 52.12G 24 port active Backplane Pin Definition ................................................................................................71
Table 53.12G SAS 2 Port Backplane .............................................................................................................................76
Table 54.2 x 2.5'' Rear Backplane Connectors .............................................................................................................77
Table 55.SATA Connector Pin-out ................................................................................................................................80
Table 56. Front Control Panel Buttons And Indicators ..............................................................................................82
Table 57.LED Board Specification ................................................................................................................................82
Table 58. Supported Intel® I/O Modules ......................................................................................................................87
Table 59. Intel®Remote Management Module 4 (RMM4) Options ...........................................................................88
Table 60. Basic and Advanced Server Management Features Overview ...................................................................88
Table 61.POST Progress Code LED Example ..............................................................................................................96
Table 62.MRC Progress Codes ......................................................................................................................................97
Table 63.MRC Fatal Error Codes .................................................................................................................................98
Table 64.Diagnostic LED POST Code Decoder ...........................................................................................................99
Table 65.POST Error Messages and Handling ..........................................................................................................102
Table 66.POST Error Beep Codes ...............................................................................................................................106
Table 67.Integrated BMC Beep Codes ........................................................................................................................107
xiii
1. Introduction
This document describes the embedded functionality and available features of the integrated
server system which includes: the chassis layout, system boards, power subsystem, cooling
subsystem, storage subsystem options, and available installable options. Note that some system
features are provided as configurable options and may not be included standard in every system
configuration offered.
Server board specific detail can be obtained by referencing the Intel ®Server Board S2600WT
Technical Product Specification.
NOTE: Some of the documents listed in the following table are classified as “ Chenbro
Confidential”. These documents are made available under a Non-Disclosure Agreement (NDA)
with Chenbro and must be ordered through your local Chenbro representative.
Table 1.Reference Documents
Document Title
Document
Classification
RM23708/12/24 Datasheet
Chenbro Confidential
RM23708/12/24 Sales kit
Chenbro Confidential
RM23708/12/24 System Test Report
Chenbro Confidential
Intel® Server Board S2600WT Family Technical Product
Specification 1.0
Intel Confidential
WARNING: Only trained and qualified personnel should be allowed to install, replace,
or service this equipment.
1.1 Chapter Outline
This document is divided into the following chapters:
 Chapter 1 – Introduction
 Chapter 2 – Product Overview
 Chapter 3 – System Power
 Chapter 4 – Thermal Management
 Chapter 5 – System Storage and Peripherals Drive Bay Overview
 Chapter 6 – Front Control Panel and I/O Panel Overview
 Chapter 7 – PCIe* Riser Card Support
 Chapter 8 – Intel® I/O Module Support
 Chapter 9 – Basic and Advanced Server Management Features
 Appendix A – Integration and Usage Tips
 Appendix B – POST Code Diagnostic LED Decoder
 Appendix C – POST Code Errors
 Appendix D – System Cable Routing Diagram
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
VLSI and power delivery components that need adequate airflow to cool. Chenbro ensures through
its own chassis development and testing that when Intel® server building blocks are used together,
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RM237 Series and RB237 Series TPS
the fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Chenbro-developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount of
airflow required for their specific application and environmental conditions. Chenbro Corporation
cannot be held responsible if components fail or the server board does not operate correctly when
used outside any of their published operating or non-operating limits.
1.3 Product Errata
Shipping product may have features or functionality that may deviate from published specifications.
These deviations are generally discovered after the product has gone into formal production.
Chenbro terms these deviations as product Errata. Known product Errata will be embedded in the
TPS for the given product which can be downloaded from the following Chenbro web site:
http:/ / www.chenbro.com
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RM237 Series and RB237 Series TPS
2.
Product Overview
This chapter provides a high-level overview of the system features and available options as
supported in different system models within this product. Greater detail for each major
sub-system, feature, or option is provided in the following chapters.
Table 2. Chenbro RM23708/12/24 Feature Set
Feature
Description
Chassis Type
Server Board
2U Rack Mount Chassis
• Intel®Server Board S2600WT w/Dual 1GbE ports – (Intel product code - S2600WT2)
• Two LGA2011-3 (Socket R3) processor sockets
Processor Support • Support for one or two Intel®Xeon®processors E5-2600 v3 product family
• Maximum supported Thermal Design Power (TDP) of up to 145 W.
24 DIMM slots – 3 DIMMs/Channel – 4 memory channels per processor
• Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)
• Memory data transfer rates:
Memory
o DDR4 RDIMM: 1600 MT/s (3DPC), 1866 MT/s (2DPC) and 2133 MT/s (1DPC)
o DDR4 LRDIMM: 1600 MT/s (3DPC), 2133 MT/s (2DPC& 1DPC)
• DDR4 standard I/O voltage of 1.2V
Intel®C612 chipset
• DB-15 Video connectors
Chipset
o Back on storage systems
• RJ-45 Serial Port A connector
External
connections
I/O
• Dual RJ-45 Network Interface connectors supporting either :
o 1 GbERJ-45 connectors
• Dedicated RJ-45 server management port
• Three USB 2.0 / 3.0 connectors on back panel
• Two USB 2.0 / 3.0 ports on front panel (non-storage models only)
• One USB 2.0 port on rack handle (storage models only)
• One Type-A USB 2.0 connector
• One 2x5 pin connector providing front panel support for two USB 2.0 ports
• One 2x10 pin connector providing front panel support for two USB 2.0 / 3.0 ports
Internal
connectors/
Headers
I/O • One 2x15 pin SSI-EEB compliant front panel header
• One 2x7pin Front Panel Video connector
• One 1x7pin header for optional Intel®Local Control Panel (LCP) support
• One DH-10 Serial Port B connector
The server board includes a proprietary on-board connector allowing for the installation of
a variety of available I/O modules. An installed I/O module can be supported in addition to
standard on-board features and add-in PCIe cards.
• AXX4P1GBPWLIOM – Quad port RJ45 1 GbEbased on Intel®Ethernet Controller I350
Intel®I/O Module
Accessory
Options
• AXX10GBTWLIOM3 – Dual port RJ-45 10GBase-T based on Intel® Ethernet Controller x540
• AXX10GBNIAIOM – Dual port SFP+ 10 GbEmodule based on Intel®82599 10 GbEcontroller
• AXX1FDRIBIOM – Single port QSFP FDR56 GT/S speed InfiniBand* module
• AXX2FDRIBIOM – Dual port QSFP FDR56 GT/S speed infiniband* module
• AXX1P40FRTIOM – Single port QSFP+ 40 GbEmodule
• AXX2P40FRTIOM – Dual port QSFP+ 40 GbEmodule
System Fans
• Six managed hot swap system fans
• One power supply fan for each installed power supply module
3
RM237 Series and RB237 Series TPS
Concurrent support for up to three riser cards.
• Riser #1 – PCIe* Gen3 x24 – up to 3 PCIe slots
• Riser #2 – PCIe* Gen3 x24 – up to 3 PCIe slots
Riser
Support
Card
• Riser #3 – PCIe* Gen3 x8 + DMI x4 (operating in PCIe mode) – up to 2 PCIe slots (Optional)
With three riser cards installed, up to 8 possible add-in cards can be supported:
•4 Full Height / Full Length + 2 Full Height / Half Length add-in cards via Risers #1 and #2
•2 low profile add-in cards via Riser #3 (option)
See Chapter 7 for available riser card options
• Integrated 2D Video Controller
•16 MB DDR3 Memory
• Intel® Trusted Platform Module (TPM) - AXXTPME5 (Accessory Option)
• Integrated Baseboard Management Controller, IPMI 2.0 compliant
Video
Security
Server
Management
• Support for Intel®Server Management Software
• On-board RJ45 management port
• Advanced Server Management via an Intel®Remote Management Module 4
Lite (Accessory Option)
Power
Options
Supply
• FSP800W
Hot Swap Backplane Options:
Note: All available backplane options have support for SAS 3.0 (12 Gb/sec)
•12 x 3.5” SAS/SATA
•12 x 3.5” Mini-SAS HD
•24 x 2.5” Mini-SAS HD with expander
•8 x 3.5” Mini-SAS HD
Storage
Options
SAS /SATA Backplane Options
• Internal mount for 2.5” drive configurations
Storage Bay Options:
•8 x 3.5” SAS/SATA Hot Swap Drive Bay
•12 x 3.5” SAS/SATA Hot Swap Drive Bay
•24 x 2.5” SAS/SATA Hot Swap Drive Bay
Supported
Mount
Accessory
Option
Rack
Kit
• 84H314610-003 – Tool-less rack mount rail kit – 560mm max travel length
2.1 Operating System Support
As of this writing, the Chenbro RM23708/12/24 provides support for the following operating
systems. This list will be updated as new operating systems are validated by Chenbro.
Table 3. Operating System Support List
Operating System
Operating System
Validation Level(P)
Windows Server 2012* R2 with Hyper-Vx64
& EFI
Red Hat Enterprise Linux* 7.0
with KVM x64 & UEFI
SuSELinux Enterprise Server* 12 with XEN x64
P1
Red Hat Enterprise Linux 6U5 with KVM x64 &
UEFI
VMWare ESXi* 5.5 U3
P2
SuSELinux Enterprise Server 11 SP4 with
XEN x64
Windows Server 2008 R2 SP1
P2
Windows 7*
P2
Ubuntu* 14.04
P2
P1
P1
P2
P2
4
RM237 Series and RB237 Series TPS
FreeBSD* 10.1
P3
CentOS* 7.0
P3
Table 4. Operating System Validation Levels
Operating System Validation Levels
P1
P2
P3
Basic Installation testing
Yes
Yes
Yes
Test all on-board I/O features in all modes
Yes
Adapter\Peripheral
Compatibility & Stress testing
Yes
Technical Support Level
T1
T2
T3
See the following sections for additional information regarding validation levels and technical
support levels as referenced in Table 4.
2.1.1
OS Validation Levels
Basic installation testing is performed with each supported operating system. The testing
validates that the system can install the operating system and that the base hardw are feature set is
functional. A small set of peripherals is used for installation purposes only. Add -in adapter cards are
not tested.
Adapter compatibility validation (CV) testing uses test suites to gain an accurate view of how the
server performs with a wide variety of adapters under the primary supported operating systems.
These tests are designed to show hardware compatibility between the cards and the server platform
and include functional testing only. No heavy stressing of the systems or the cards is performed for
CV testing.
Stress Testing uses configurations that include add-in adapters in all available slots for a 48-hour
(two-day), or a 72-hour (three-day) test run without injecting errors. Each configuration passes an
installation test and a Network/Disk Stress test. Any fatal errors that occur require a complete test
restart.
2.1.2
OS Technical Support Levels
T1: Chenbro will provide support for issues involving the installation and/or functionality of a
specified operating system as configured with or without supported adapters and/or peripherals.
T2: Chenbro will provide and test operating system drivers for each of the server board’s integrated
controllers, provided that the controller vendor has a driver available upon request. Vendors will not
be required by Chenbro to develop drivers for operating systems that they do not already support.
Chenbro will NOT provide support for issues related to the use of any add-in adapters or peripherals
installed in the server system when an operating system that received only basic installation testing
is in use.
T3: Chenbro will not provide technical support for an open source operating system. All questions
and issues related to an open source operating system must be submitted to and supported by the
open source community supporting the given operating system.
2.2 System Features Overview
5
RM237 Series and RB237 Series TPS
Cooling fans
Front Control Panel
MB
Riser bracket
Front HS HDDs
HDD BP
PSU
Info.Tag
Rear HS HDDs
Front I/O Panel
Figure 1.System Components Overview
Tool-less Top Cover Removal Latch
Figure 2.Top Cover Features
2.3 Server Board Features Overview
The following illustration provides a general overview of the server board, identifying key feature
and component locations. Please refer to Intel ® Server Board S2600WT Technical Product
Specification for more information.
6
RM237 Series and RB237 Series TPS
Figure 3.Server Board S2600WT Features
The server board includes several LEDs to identify system status. The following illustrations define
supported LEDs and identify their location.
7
RM237 Series and RB237 Series TPS
Figure 4.On-board Diagnostic LEDs
Figure 5.DIMM Fault LEDs
8
RM237 Series and RB237 Series TPS
Figure 6.System Reset and Configuration Jumpers
2.4 Back Panel Features
2x2.5''Hot Swap
Drive Bay(Optional)
1
0
Power Supply #1
Riser Card #2
Riser Card #3
1
2
Power Supply #2
NIC 1
(RJ45)
NIC 2
(RJ45)
Riser Card #1
1
1
2
2
3
3
Video Serial 3xStacked Remote
Intel
port port A USB 2.0/3.0 Management I/O Module
(VGA) (RJ45) Ports
Port(RJ45)
Bay
Figure 7. Back Panel Feature Identification
2.5 Front Control Panel
A
B
C
D
Left ear
E
F
G
H
I
J
Right ear
9
RM237 Series and RB237 Series TPS
Label
Description
A
Power on Button
B
ID Switch
C
System Reset Button
D
USB 2.0 port
E
HDD Activity LED
F
FAN Activity LED
G
LAN1 Activity LED
H
LAN2 Activity LED
I
VGA port
J
USB 3.0 port
Figure 8. Front Control Panel Options
2.6 Front Drive Bay Options
8
9
10
11
4
5
6
7
0
1
2
3
Figure 9.3.5’’ Drive Bay-12 Drive Configuration
0
16
8
Figure 10.2.5’’ Drive Bay-24 Drive Configuration
4
5
6
7
0
1
2
3
Figure 11.3.5’’ Drive Bay-8 Drive Configuration
2.7 System Dimensions
2.7.1
Chassis Dimensions
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RM237 Series and RB237 Series TPS
438mm/17.2''
735mm/29''
87mm/3.5''
Figure 12. Chassis Dimensions
2.7.2
HDD Tray Dimensions
11
RM237 Series and RB237 Series TPS
Figure 13. 3.5’’ HDD Tray Dimensions
Figure 14. 2.5’’ HDD Tray Dimensions
2.7.3
Pull-out Tag Label Emboss Dimensions
12
RM237 Series and RB237 Series TPS
Figure 15. Pull-out Tag Label Emboss Dimensions
2.8 Available Rack Mounting Kit Options
Advisory Note – Available rack and cabinet mounting kits are not designed to support shipment of
the server system while installed in a rack. If you chose to do so, Chenbro advises you verify your
shipping configuration with appropriate shock and vibration testing, before shipment. Chenbro does
not perform shipping tests which cover the complex combination of unique rack offerings and
custom packaging options.
Caution: Exceeding the rail kit’s specified maximum weight limit or misalignment of the server in the
rack may result in failure of the rack rails, resulting in damage to the system or personal injury. Two
people or the use of a mechanical assist tool to install and align the server into the rack is highly
recommended.
Available Rack mounting kits:
 84H314610-003 (Tool-less)– Vale plus short rail
-
560mm max travel length
123 lbs. (56 Kg) max support weight
Stab-in system install
x8 #10-32 screws to mount rail kit on rack flange (screw kit come with rail kit
assembling) - No cable management arm support
2.9 System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 5. System Environmental Limits Summary
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RM237 Series and RB237 Series TPS
Parameter
Limits
Operating
ASHRAE Class A2 – Continuous Operation. 10ºC to
35ºC (50ºF to
95ºF) with the maximum rate of change not to exceed 10°Cper hour
Shipping
-40ºCto 70ºC(-40ºF to 158ºF)
Altitude
Operating
Support operation up to 3050m with ASHRAEclass deratings.
Humidity
Shipping
50% to 90%, non-condensing with a maximum wet bulb of 28° C (at
temperatures from 25°Cto 35°C)
Operating
Half sine, 2 g, 11 mSec
Unpackaged
Trapezoidal, 25 g, velocity change is based on packaged weight
Packaged
ISTA (International Safe Transit Association) Test Procedure 3A 2008
Unpackaged
5 Hz to 500 Hz 2.20 g RMS random
Packaged
ISTA (International Safe Transit Association) Test Procedure 3A 2008
Voltage
90 V to 132 V and 180 V to 264 V
Frequency
47 Hz to 63 Hz
Temperature
Shock
Vibration
AC-DC
Source Interrup
No loss of data for power line drop-out of 12 mSec
t
Surge Nonoperating
and opera
Unidirectional
ting
ACLeads 2.0 kV
Line to
Only
earth I/O Leads 1.0 kV
DCLeads 0.5 kV
Air Discharged
ESD
12.0 kV
Contact Discha
8.0 kV
rge
Power in Watts 800W
Servers/Rack
Acoustics
Sound Power Mount Sound
Power
Measured
Level (in BA)
2.10
7.0
System Packaging
The original Chenbro packaging, in which the server system is delivered, is designed to provide
protection to a fully configured system and was tested to meet ISTA (International Safe Transit
Association) Test Procedure 1A (2008). The packaging was also designed to be re-used for
shipment after system integration has been completed.
The original packaging includes – a small inner box for ship along accessories, the outer shipping
main box, and various protective inner packaging components. The boxes and p ackaging
components are designed to function together as a protective packaging system. When reused, all
14
RM237 Series and RB237 Series TPS
of the original packaging material must be used, including both boxes and each inner packaging
component. In addition, all inner packaging components MUST be reinstalled in the proper location
to ensure adequate protection of the system for subsequent shipment.
NOTE: The design of the inner packaging components does not prevent improper placement
within the packaging assembly. There is only one correct packaging assembly that will allow the
package to meet the ISTA (International Safe Transit Association) Test Procedu re 1A (2008)
limits.
Failure to follow the specified packaging assembly instructions may result in damage to the
system during shipment.
2.10.1 RM23708/12/24 Weight Information
Table 6. RM23708/12/24 Weight Information
Product
Net Weight(kg) Gross Weight(kg) Net Weight (Lbs.) Gross Weight (Lbs.)
RM23712
14.9
19.0
32.8
41.9
RM23724
14.9
19.0
32.8
41.9
RM23708
14.9
19.0
32.8
41.9
NOTE: An L6 system does not include processors, memory, drives, or add-in cards. It is the
system configuration as shipped from Chenbro. Integrated system weights (System configurations
that include the items above) will vary depending on the final system conf iguration. For the 2U
product, a fully integrated un-packaged system can weigh up to 65 Lbs. (29.5Kg).
15
RM237 Series and RB237 Series TPS
3. System Power
This chapter provides a high level overview of the features and functions related to system power.
BEFORE YOU BEGIN
WARNING: Before working with your server product, observe the safety and ESD
precautions found in the Warnings section at the beginning of this manual.
3.1 General Description And Scope
This is the specification of Model FSP800-20ERM;
The specification below is intended to describe as detailedly as possible the functions and
performance of the subject power supply. Any comment or additional requirements to this
specification from our customers will be highly appreciated and treated as a new target for us to
approach.
Figure 16. 800W AC Fixed Power Supply
WARNING: Danger of explosion if battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the equipment manufacturer. Discard used
batteries according to manufacturer's instructions.
Figure 17. Power Supply installation
Insert the power supply module into the power supply cage and push all the way until it clicks into
place.
Indicates to unplug all AC power cord(s) to disconnect AC power.
16
RM237 Series and RB237 Series TPS
Figure 18. Energy hazards warning aera
WARNING: WHEN THE AC POWER IS TURNED ON, DON’T TOUCH THE ENERGY
HAZARDS WARNING AERA.
3.1.1
Power Supply Module Mechanical Overview
The physical size of the power supply enclosure is intended to accommodate the power range of up
to 800W.The physical size is 39/40mm x 73.5mm x 185mm (height x width x length).
17
RM237 Series and RB237 Series TPS
Figure 19. FSP800W-20ERM Power Supply Mechanical drawings
Figure 20. FSP800W-20ERM Card Edge Diminsion
3.1.2
LED Marking and Identification
The power supply shall have two LED for indication of the power supply status.
Table 7.LED Status Information
Power supply condition
Power supply LED
Output ON and OK
Green
No AC power to all PSU
OFF
AC present/only standby output on
1 Hz Flashing Green
AC cord unplugged or AC power lost;with a second power
Amber
supply in parallel still with AC input power.
Power supply warning events where the power supply
1Hz Blink Amber
continues to operate;high temp,high power,high
(0.5s:OFF; 0.5s:Amber)
18
RM237 Series and RB237 Series TPS
current,slow fan.
Power supply critical event causing a
Amber
shutdown;failure,OCP,OVP,Fan Fail
Power supply FW update mode
3.1.3
2Hz Blink Green
Power Supply Card Edge Pin-Out
Table 8.LED Status Information
3.1.4
Environmental Requirements
The power supply shall operate within all specified limits over specified condition in 2.3.
The defined operation condition include temperature, humidity, altitude, shock and vibration.
3.1.4.1 Temperature and Humidity Requirements
The power supply shall operate within all specified limits over Top temperature range and specified
humidity Range. All airflow shall pass through the power supply and not over the exterior surfaces of
the power supply.
The power supply shall withstand thermal storage specified in Tnon-OP without any damage.
Table 9.Temperature Requirements
Item
Description
MIN
MAX
Unit
Top
Operation temperature range.
0
50
oC
Tnon-OP
Non-Operating temperature range
-40
70
oC
HOP
Operating humidity range, non condensing
90
%
19
RM237 Series and RB237 Series TPS
Hnon-OP
Non-Operating humidity range, non condension
%
3.1.4.2 Altitude Requirements
The power supply shall operate within all specified limits over Aop Altitude range. The change
pressure condition shall not harm the power supply and the operation within specified reg ulations
shall be assured.
The power supply shall withstand Altitude storage specified in Anon-OP without any damage.
Table 10.Altitude Requirements
Item
Description
MIN
MAX
Unit
Aop
Operating Altitude range.
0
5000
m
Anon-OP
Non- Operating Altitude range
-40
15000
m
3.2 Electrical Performance
3.2.1
AC power Input Specification
3.2.1.1 AC Inlet connector
The power supply shall incorporate an AC input connector complying to IEC 320 C-14 power inlet
connector specification. This inlet shall be rated for operation at 10A/250VAC.
3.2.1.2 Input voltage and frequency specification
The power supply shall operate within all specified limits over the following input range. Harmonic
distortions of up to 10% of the rated line voltage must not cause the power supply to go out of
specified limits.The power supply shall power off if the AC input is below VAClow_limit and shall
start (auto recover) if VACrecover is reached. Input of VAC below VACr ecover shall not cause any
damage to the power supply, including the input fuse.
The power supply shall supply the full output power in the voltage range of 90VAC to 264VAC.
Table 11.Rated output power for each input voltage range
Parameter
Minimum input
Rated Input
Maximum Input
11VAC
90Vrms
100-127 Vrms
140 Vrms
230VAC
180 Vrms
200-240 Vrms
264 Vrms
Frequency
47Hz
50/60Hz
63Hz
3.2.1.3 HVDC Input voltage
The power supply supports High Voltage Direct Current (HVDC) input. Allowed HVDC input range
as shown in below table. The power supply shall operate within all specified limits, when HVDC
input meet requirements defined in this chapter.
Table 12.HVDC input voltage range
Parameter
Minimum input
Rated Input
Maximum Input
HVDC(240)
180V
240V
310V
20
RM237 Series and RB237 Series TPS
3.2.1.4 Input current
The maximum input current defines the maximum possible input current to ensure the proper function of the power supply to
meet all defined specifications.
Table 13.Maximum input current
Input voltage
Input current
Max power
90VAC
11A
800W
100-127VAC
10A
800W
180VAC
5.5A
800W
200-240VAC
5A
800W
264VAC
3.5A
800W
240VDC
4A
800W
3.2.1.5 AC Line Fuse
The power supply shall incorporate one input fuse on the line side for input over-current protection
to prevent damage to the power supply and meet product safety requirements. AC inrush current
shall not cause the AC line fuse to blow under any conditions. All protection circuits in the power
supply shall not cause the AC fuse to blow unless a component in the power supply has failed. This
includes DC output load short conditions.
3.2.1.6 AC line inrush
AC line inrush current shall not exceed 55A peak, for up to one -quarter of the AC cycle, after which,
the input current should be no more than the specified maximum input current. The peak inrush
current shall be less than the ratings of its critical components (including input fuse, bulk rectifiers,
and surge limiting device).
The power supply must meet the inrush requirements for any rated AC voltage, during turn on at any
phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery after AC
dropout of any duration, and over the specified temperature range (Top).
3.2.1.7 Input Power Factor Correction
The input Power Factor shall be greater than 0.98/115Vac and 0.95/230Vac.
Table 14.Power Factor correction
Input voltage
20% loading
50% loading
100% loading
11VAC/60Hz
>0.8
>0.95
0.98
230VAC/50Hz
>0.8
>0.90
0.95
3.2.1.8 AC line dropout
An AC line dropout is a transient condition defined as the AC input to the power supply drops to 0
VAC at any phase of the AC line for any length of time. During an AC dropout the power supply must
meet dynamic voltage regulations requirements. An AC line dropout of any duration shall not cause
dripping of the control signals and protection circuits. If the AC dropout lasts longer than the holdup
21
RM237 Series and RB237 Series TPS
time, the power supply should recover when VAC meets VACrecover and meet all turn on
requirements.
A Input dropout of any length shall not cause any damage to the power supply.
Table 15.H0ld-up time until Power output goes out of regulations
Loading
Main output
Standby output
100%
12mS
70mS
3.2.1.9 Efficiency
The redundant power supply module efficiency should meet at least Climate Saver 3 / 80Plus
Platinum rating, specified in below table. The efficiency should be measured at 230VAC and with
external fan power according to Climate Saver /80Plus efficiency measurement specifications
(CSCI-09-10)
Table 16.Module efficiency requirements
Efficiency
20% load
50% load
100% load
Std
(12V is 13A,12vsb is 0.42A)
(12V is 32.5A,12vsb is 1.05A)
(12V is 65A,12vsb is 2.1A)
Platinum
90%
94%
91%
3.2.1.10
Suspeceptibility Requirements
The power supply shall meet the following electrical immunity requirements when connected to a
cage with an external EMI filter, which meets the criteria defined in the SSI document EPS Power
Supply Specification.
Table 17.Performance criteria
Level
Description
A
The apparatus shall continue to operate as intended.No degradation of performance.
The apparatus shall continue to operate as intended.No degradation of performance
B
beyond spec.limits.
Temporary loss of function is allowed provided the function is self-recoverable or can
C
be restored by the operation of the controls.
3.2.1.10.1 Electrical Discharge Susceptibility
The power supply shall comply with the limits defined in EN 55024:1998 using the IEC
61000-4-2:1995 test standard and performance criteria B defined in Annex B of CISPR 24.
3.2.1.10.2 Fast Transient/Burst
The power supply shall comply with the limits defined in EN55024:1998 using the IEC
61000-4-4:1995 test standard and performance criteria B define in Annex B of CISPR 24.
3.2.1.10.3 Radiated Immunity
The power supply shall comply with the limits defined in EN55024:1998 using the
IEC61000-4-3:1995 test standard and performance criteria A defined in Annex B of CISPR 24.
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RM237 Series and RB237 Series TPS
3.2.1.10.4 Surge Immunity
The power supply shall be tested with the system for immunity to AC Ringwave and AC
Unidirectional wave, both up to 2kV(Differential mode 2K,Common mode 1K), per EN55024:1998,
EN 61000-4-5:1995 and ANSI C62.45:1992.
The pass criteria include: No unsafe operation is allowed under any condition; all power supply
output voltage levels to stay within proper spec levels; No change in operating state or loss of data
during and after the test profile; No component damage under any condition.
The power supply shall comply with the limits defined in EN55024:1998 using the IEC
61000-4-5:1995 test standard and performance criteria B defined in Annex B f CISPR 24.
3.2.1.10.5 AC Line Transient Specification
AC line transient conditions shall be defined as “sag” and “surge” conditions.
“Sag” conditions are also commonly referred to as “brownout”, these conditions will be
defined as the AC line voltage dropping below nominal voltage conditions.
“Surge” will be defined to refer to conditions when the AC line voltage rises above nominal
voltage.
The power supply shall meet the requirements under the following AC line sag and surge conditions.
Table 18.AC Line SAG transient performance
AC Line SAG (10sec interval between each sagging)
Duration
Sag
Operation
Line frequency
Performance criteria
0 to 1/2 AC cycle
95%
Nominal AC voltage
50/60Hz
No loss of function or performance
>1 AC cycles
>30%
Nominal AC voltage
50/60Hz
Loss of function acceptable,self
recoverable
Table 19.AC Line SURGE transient performance
AC Line Surge
Duration
Surge
Operation at voltage
Line frequency
Performance criteria
Continuous
10%
Nominal AC voltage
50/60Hz
No loss of function or performance
0 to 1/2 AC cycle
30%
50/60Hz
No loss of function or performance
Mid-point of nominal
AC voltage
3.2.1.10.6 AC line fast transient (EFT) specification
The power supply shall meet the EN61000-4-5 directive and any additional requirements in
IEC1000-4-5:1995 and the level 3 requirements for surge-withstand capability, with the following
conditions and exceptions:

These input transients must not cause any out-of-regulation conditions, such as overshoot and
undershoot, normust it cause any nuisance trips of any of the power supply protection circuits.

The surge-withstand test must not produce damage to the power supply.

The supply must meet surge-withstand test conditions under maximum and minimum
DC-output load conditions.
23
RM237 Series and RB237 Series TPS
3.2.1.11
Power Recovery
The power supply shall recover automatically (auto recover) after an AC power failure. AC power
failure is defined to be any loss of AC power that exceeds the dropout criteria.
3.2.1.12
Voltage Brown Out
The power supply shall comply with the limits defined in EN55024:1998 using the IEC
61000-4-11:1995 test standard and performance criteria C defined in Annex B of CISPR 24.
In addition the power supply shall meet the following requirements:
A continuous input voltage below the nominal input range shall not damage the power supply or
cause overstress to any power supply component. The power supply must be able to return to
normal power up state after a brownout (Sag) condition. During brownout test from 120VAC to 0VAC
@ 800W with 3mins ramp, input current shall never exceed fuse and shall not blow the fuse.
3.2.1.13
AC Line Leakage Current
The maximum leakage current to ground for each power supply shall be 1.0 mA when tested a t
264Vac/60Hz.
3.2.2
DC output voltages
3.2.2.1 Grounding
The output ground of the pins of the power supply provides the output power return path. The
ground output at the PCB card edge shall be connected to the safety ground (power supply
enclosure). This grounding should be well designed to ensure passing the max allowed Common
Mode Noise levels.
The power supply shall be provided with a reliable protective earth ground. All secondary circuits
shall be connected to protective earth ground. Resistance of the ground returns to chassis shall not
exceed 100 mΩ (Test Conditions 40A for 120sec). This path may be used to carry DC-current.
3.2.2.2 Output rating
The following table defines the power and current rating of the 800W power supply. The combined
output power of all outputs shall not exceed the rated output power. The power supply must meet
both static and dynamic voltage regulation requirements.
Table 20.Output Power and Current Ratings
Minimum
Maximum
Current(A)
Current(A)
+12V
0.5
65
780W
+12Vsb
0
2.1
25.2W
Output
Output Power(W)
800W
3.2.2.3 Auxiliary Output (Standby)
The 12Vsb output shall be present when an AC input greater than Vrecover is applied.
3.2.2.4 No load operation
24
RM237 Series and RB237 Series TPS
The power supply shall meet all requirements except for the transient loading requirements when
operated at no load on all outputs.
3.2.2.5 Voltage Regulation
The power supply shall meet the Voltage regulation under all operating conditions ( AC line,
transient loading, output loading ). These limits include the peak-peak ripple/noise. The regulation
of Table 14 shall be measured at the output connector of the power supply, subject to the dynamic
loading conditions in paragraph 3.2.2.7.
Table 21.Output Voltage regulation
Output
Minimum
Nominal
Maximum
Unit
+12V
11.4
12.0
12.6
Vdc
+12Vsb
11.4
12.0
12.6
Vdc
3.2.2.6 Ripple and Noise Regulation
Ripple and Noise is defined in table 15. Ripple and Noise shall be measured over a Bandwidth of
0Hz to 20MHz at the power supply output connector. A 0.1μF ceramic capacitor and 10μF of
tantalum capacitor shall be placed at each point of measurement. The measurement points shall be
as close as possible to the point of load.
The ripple and noise specification shall be met over all load ranges and AC line voltages with 1+1
power supplies in parallel operation.
Table 22.Ripple and Noise Regulation
Output
Maximum
Unit
+12V
120
mV
+12Vsb
120
mV
3.2.2.7 Dynamic loading
The power supply shall operate within specified limits and meet regulation requirements for step
loading and capacitive loading specified below.
The load transient repetition rate shall be tested between 50Hz to 5kHz at duty cycles ranging . The
load transient repetition rate is only a test specification. The Δ step load may occur anywhere
within the MIN load and the MAX load.
This shall be tested with no additional bulk capacitance added to the load.
Table 23.Transient Load Requirements
Output
∆ Step size
Slew Rate
Capacitive Load
+12V
60% OF MAX
0.25 A/μs
2000μF
+12Vsb
1.0A
0.25 A/μs
20μF
Note:For dynamic conditions +12V min. loading is 1A
3.2.2.8 Capacitive load
25
RM237 Series and RB237 Series TPS
The power supply shall operate within specifications over the capacitive loading ranges defined
below in table 23.
Table 24.Capacitive Loading Conditions
Output
Min
Max
+12V
500μF
25000μF
+12Vsb
20μF
3100μF
3.2.2.9 Close loop stability
The power supply shall be unconditionally stable under all line/load/transient load conditions
including capacitive load ranges. A minimum of: 45 degrees phase margin and -12dB-gain margin is
required.
Closed-loop stability must be ensured at the maximum and minimum loads as applicable.
3.2.2.10
Residual Voltage Immunity in Standby mode
The power supply should be immune to any residual voltage placed on its outputs (typically a
leakage voltage through the system from standby output) up to 500mV. There shall be no additional
heat generated nor stressing of any internal components with this voltage applied to any individual
or all outputs simultaneously. It also should not trip the protection circuits during turn on/off.
The residual voltage at the power supply outputs for no load condition shall not exceed 100mV when
AC voltage is applied.
3.2.2.11
Soft starting
The power supply shall contain control circuit which provides monotonic soft start for its outputs
without overstress of the AC line or any power supply components at any specified AC line or load
condition.
3.2.2.12
Hot Swap Requirements
Hot swapping a power supply is the process of inserting and extracting a power supply from an
operating power system. During this process the output voltages shall remain within the limits with
the capacitive load specified.
The hot swap test must be conducted when the system is operating under static, dynamic, and zero
loading conditions.
The power supply shall use a latching mechanism to prevent insertion and extraction of the power
supply when the AC power cord is inserted into the power supply.
3.2.2.13
Load sharing control
The +12 V output shall have active load sharing. When operating at 50% of full load, the output
current of any 1+1 power supplies shall be within (+/-10%). For example, if power supply #1 is
operating at 20A, then all other power supplies within the system shall be operating between 18A to
22A (+/- 10% of 20A).
26
RM237 Series and RB237 Series TPS
All current sharing functions shall be implemented internal to the power supply by making use of the
SBus signal. The power distribution board (Housing Back Plane), must connect the SBus signals
between the power supplies together.The power supply shall be able to share with up to 1+N supply
in parallel.
The failure of a power supply shall not affect the load sharing or output voltages of the other
supplies still operating.
The power supplies must be able to load share with 100mV of drop between different power supply ’s
output.
If the load sharing is disabled by shorting the load share bus to ground, the power supply shall
continue to operate within regulation limits for loads less than or equal to the rating of one power
supply.
Table 25.Load share bus output characteristics
Item
Description
Min
Nominal
Max
Units
Voltage of load share bus at specified max output
V share ;I out =MAX
8
V
8/I outmax
V/A
current
∆V share /∆I out
3.2.3
Slope of load share bus voltage with changing load
Timing Requirements
These are the timing requirements for the power supply operation. The output voltages must rise
from 10% to within regulation limits (Tvout_rise) within 5 to 70ms. For 12Vsb, it is allowed to rise
from 1 to 25ms. All outputs must rise monotonically. Table below shows the timing requirements for
the power supply being turned on and off via the AC input, with PSON held low and the PSON signal,
with the AC input applied.
3.2.3.1 Output Voltage Timing
The timing of signals and outputs are specified in below Table 19 and illustrated in Figure 2.
Table 26.Turn on/off timing
27
RM237 Series and RB237 Series TPS
Figure 21.Turn On/Off Timing (Power Supply Signals)
3.2.3.2 Overshoot
Any output overshoot at turn on shall be less than 10% of the nominal output value.
3.2.3.3 Undershoot
Any output shall not undershoot at turn on or off cycle under any circumstances.
3.2.3.4 Temperature coefficient
After operating for 30 minutes or longer at 25 °C ambient, the output voltages shall not change by
more than ± 0.05% per degree C for any given line and load conditions.
3.2.4
Control and Indicator functions
The following section define the input and output signals from the power supply.
Signals that can be defined as low true use the following convention:
Signal # = low true.
3.2.4.1 PSON# Input Signal (Power supply enable)
The PSON # signal is required to remotely turn on/off the main output of the power supply.
PSON # is and active low signal that turns on the main output power rail. When this signal is not
pulled low by the system or left open, the outputs (except the Standby output) turn off.
PSON # is pulled to a standby voltage by a pull-up resistor internal to the power supply.
See Table 20.
Table 27.PS ON# signal characteristics
Accepts an open collector/drain input from the system.
Signal Type
Pull-up to +3.3V located in the power supply.
28
RM237 Series and RB237 Series TPS
PSON#=Low
ON
PSON#=High or Open
OFF
PSON#=Low, PSKILL=Open
OFF
Logic level low (power supply ON)
Logic level high (power supply OFF)
MIN
MAX
0V
0.66V
2.64V
3.64V
Source current, V pson =low
4mA
Power up delay: T pson on delay
5ms
400ms
PWOK delay: T pson pwok
50ms
3.2.4.2 Power OK (PG or PWOK) Output Signal
PWOK is a power good signal and shall be pulled HIGH by the power supply to indicate that all
outputs are within regulation limits. When any output voltage falls below regulation limits, an internal
failure or when AC power has been removed for a time sufficiently long, so that power supply
operation is no longer guaranteed, PWOK will be de-asserted to a LOW state. The start of the
PWOK delay time shall inhibited as long as any power supply output is in current limit.
See Table 21.
Table 28.PWOK signal characteristics
Open collector/drain output from power supply.
Signal Type
Pull-up to +3.3V located in the power supply.
PWOK=High
Power Good
PWOK=Low
Power Not Good
Logic level low voltage, I sink =4mA
Logic level high voltage,
MIN
MAX
0V
0.66V
2.64V
3.46V
I source =200μA
Sink current, PWOK =low
4mA
Source current, PWOK =high
2mA
PWOK delay: T pwok_on
100ms
PWOK rise and fall time
Power down delay: T pwok_off
1000ms
100μsec
1ms
200ms
3.2.4.3 SMBAlert# (PSAlert) Output Signal Pin
This signal indicates that the power supply is experiencing a problem that the user should
investigate. This shall be asserted due to Critical events or Warning events. The signal shall
activate in the case of critical component temperature reached a warning threshold, general failure,
over-current, over-voltage, under-voltage, failed fan. This signal may also indicate the power supply
is reaching its end of life or is operating in an environment exceeding the specified limits.
This signal is to be asserted in parallel with LED turning solid amber or blinking amber/green.
29
RM237 Series and RB237 Series TPS
See Table 22.
Table 29.PWOK signal characteristics
Open collector/drain output from power supply.
Signal Type
Pull-up to +3.3V located in the power supply.
#
Power OK
#
Power Alert to system
Alert =High
Alert =Low
Logic level low voltage, I sink =4mA
Logic level high voltage, I sink =50μA
MIN
MAX
0V
0.66V
2.64V
3.46V
#
Sink current, Alert =low
4mA
#
Source current, Alert =high
Rise and fall time
2mA
100μsec
3.2.4.4 A0
PSU Module Address Line 0. This signal line is provided for determining the address for the specific
PSU FRU and SMBus address. The pull-up resister should be located in power supply.
3.2.4.5 A1
PSU Module Address Line 1. This signal line is provided for determining the address for the specific
PSU FRU and SMBus address. The pull-up resister should be located in power supply.
3.2.4.6 12VRS and Return Sense
The power supply has remote sense return (Return Sense) to regulate out ground drops for all
output voltages. The power supply uses remote sense to regulate out drops in the system for the
main outputs. The +12V output only uses remote sense with reference to the Return Sense signal.
The remote sense input impedance to the power supply must be greater than 10Ω on the main
outputs and is 10Ω on Return Sense. These are the values of the resistors connecting the
remote senses to the output voltage internal to the power supply. Remote sense is able to regulate
out a minimum of 300mV of drop on the +12V output. The remote sense return is able to regulate
out drops of 300mV as well. The current in any remote sense line shall be less than 5mA to prevent
voltage sensing errors. The power supply operates within specification over the full range of voltage
drops from the power supply’s output connector to the remote sense points.
3.2.4.7 Present
This signal is connected to the power supply’s output ground.
3.2.4.8 SDA and SCL
One pin is the serial clock (SCL), and the other pin is used for serial data (SDA). The SCL and SDA
signals are pulled up by system, both pins are bi-directional, open drain signals, and are used to
form a serial bus.
30
RM237 Series and RB237 Series TPS
3.3 Protection circuits
Protection circuits inside the power supply shall cause only the main output to shutdown (latch off).
If the power supply latches off due to a protection circuit assert, an Input Power cycle OFF for 15sec
or a PSON# cycle HIGH for 1sec shall be able to reset the power supply.
Specific protection circuits shall not latch, but auto recover when the latching reason had been
cleared. This protection circuits will be written in cursive writing and will have a Auto Recover in the
chapter name.
The auxiliary output shall not affected by any protection circuit, unless the auxiliary output itself is
affected.
3.3.1
Over Voltage Protection (OVPmain & OVPauxilary )
All Over Voltage Condition shall be measured internal to the power supply on all outputs (Main and
Auxiliary Output) at the card edge output. The power supply shall shutdown and latch off after an
Over Voltage condition occurs on main outputs, the auxiliary output shall be auto recover after the
OVP had been removed.
The voltages never shall exceed the maximum levels specified in below table when measured
during any fail.
Table 30.Over Voltage Protection requirements
Output Voltage
3.3.2
MIN(V)
MAX(V)
+12V
13.3
14.5
+12Vsb
13.3
14.5
Over Current and Short Circuit Protection (OCP/SCPmain & OCP/SCPauxilary )
The Over Current Condition shall be measured internal to the power supply on all outputs (Main and
Auxiliary Output), and preventing outputs to exceed current limits specified in below table. The
power supply shall shutdown and Auto Recovery after an over current condition on Main and
Auxiliary Outputs, and shall be Auto Recovery when OCP/SCP condition is removed.
The power supply shall alert the system of the OCP/SCP condition via SMBAlert # and fail LED
indicator.
The power supply shall not be damaged from repeated power cycling in this condition.
Table 31.Over Current/Short Circuit Protection
Voltage
Over Current Limit (Iout limit)
≤109%, Continue;
110-120%, for 12S;
+12V
121-150%, for 100ms;
≥150%, immediately
+12Vsb
3.3.3
6A maximum
Over Temperature Protection (OTP)
31
RM237 Series and RB237 Series TPS
The power supply shall have minimum of two thermal sensors to measure the inside environmental
(T in_env ) and critical component (T Heatsink ) temperature. The thermal sensors shall be part of a
protection circuit to protected against over temperature conditions caused by loss of fan cooling or
excessive ambient temperature. In an critical Over temperature condition, specified in below table,
the PSU shall be shutdown with the exception of the auxiliary outp ut.
The power supply shall alert the system of the OTP condition via SMBAlert # and fail LED indicator.
The power supply will auto recover from this condition, when the temperature is dropping within
specification again. If the OTP is caused due to a defective fan, the power supply shall latch off and
not auto recovery.
Table 32.Over Temperature Protection
3.3.4
o
Timing for
o
Condition
Warning in C
Critical in C
Tin_env
60
65
1msec
T Heatsink
70
75
1msec
SMBAlert#/LED
Fan Failure Protection
The power supply shall have a circuit internal to monitor the power supply internal fan. The fan
failure protection shall monitor the fan speed and should assert SMBAlert# and fail LED signal in
case the fan Rotation Per Minute (RPM) drop lower threshold or set PWM Δ as defined in below
table.
The fan failure state shall shut down and latch off the main outputs, and shall be cleared by toggling
the PSON# signal or by an AC input recycle.
Table 33.Fan Failure Protection
Timing for
Condition
FAN RPN
Critical
1000
SMBAlert#/LED
1sec
3.4 Power Supply Management
3.4.1
Hardware Layer
The serial bus communication devices for Power Supply Management Controller (PSMC) and Field
Replacement Unit (FRU) in the power supply shall be compatible with both SMBus 2.0 “high
power” and I2C Vdd based power and drive specification.
This bus shall operate at 3.3V but be tolerant to 5V pull-ups. The power supply should not have any
internal pull-ups on the SMBus, pull-ups shall be located on system side.
Two pins are allocated on the power supply. One pin is the serial clock (SCL). The second pin is
used for serial data (SDA). Both pins are bi-directional and are used to form a serial bus. The
device(s) in the power supply shall be located at an address(s) determined by addressing pins A0
and A1 on the power supply module. The circuits inside the power supply shall derive their 3.3V
power from the 12Vsb bus through a buffer. Device(s) shall be powered from the s ystem side of the
32
RM237 Series and RB237 Series TPS
12Vsb oring device. No pull-up resistors shall be on SCL or SDA inside the power supply. The
pull-up resistors should be located external to the power supply on system/application side.
3.4.2
Power Supply Management Controller (PSMC)
The PSMC device in the power supply shall derive its power of the 12Vsb output on the system side
of the oring device and shall be grounded to return. It shall be compatible with SMBus specification
2.0 and PMBusTM Power System Management Protocol Specification Part I and Part II in Revision
1.2 or later
Refer to the specification posted on www.ssiforum.org and www.pmbus.org website for details on
the power supply monitoring interface requirements and refer to followed section of supported
features. The below table reflect the power module addresses complying with the position in the
housing.
Table 34.Fan Failure Protection
PDB position and
PM1 B0h/B1h
PM2 B2h/B3h
0/0
0/1
PSMC address
Pin A1/A0
3.4.2.1 Related Documents

PMBus TM Power System Management Protocol Specification Part I – General Requirements,
Transport And Electrical Interface; Revision 1.1 and 1.2

PMBus TM Power System Management Protocol Specification Part II – Command Language;
Revision 1.1 and 1.2

System Management Bus (SMBUS) Specification 2.0
3.4.2.2 Data Speed
The PSMC device in the power supply shall operate at the full 100kbps (100kHz) SMBus speed and
avoid using clock stretching that can slow down the bus. For example, the power supply is allowed
to clock stretch while parsing a command or servicing multiple interrupts or NACK.
Unsupported commands may respond with a NACK but must always set the communication error
status bit in STATUS_CML.
The PSMC may support 400kbps (400kHz) PMBus speed.
3.4.2.3 Bus Errors
The PSMC shall support SMBus clock-low timeout (T timeout ). This capability requires the PSMC to
abort any transaction and drop off the bus if it detects the clock being held low for >25ms, and be
able to respond to new transactions within 10ms later. The total reset time from detection of the
condition till restarted, ready to receive commands condition shall not exceed 35ms.
The device must recognize SMBus START and STOP conditions on ANY clock interval. The PSMC
must not hang due to ’runt clocks’, ‘runt data’, or other out-of-spec bus timing. This is defined as
signals, logic-level glitches, setup. Or hold times that are shorter than the minimums specified by
the SMBus specifications. The PSMC is not required to operate normally, but must return to normal
33
RM237 Series and RB237 Series TPS
operation once ‘in spec’ clock and data timing is again received. Note if the PSMC ‘misses’ a clock
from the master due to noise or other bus errors, the device must continue to accept ‘in spec’ clocks
and NACK. The PSMC is supposed to re-synch with the master on the next START or STOP
condition.
3.4.2.4 Write byte/word
The first byte of a Write Byte/Word access is the command code. The next one or two bytes,
respectively, are the data to be written. In this example the master asserts the slave device address
followed by the write bit. The device acknowledges and the master delivers the command code. The
slave again acknowledges before the master sends the data byte or word (low byte first). The slave
acknowledges each byte, and the entire transaction is finished with a STOP condition.
Figure 22.Write byte protocol with PEC
Figure 23.Write Word protocol with PEC
3.4.2.5 Read byte/word
Reading data is slightly more complicated than writing data. First the host must write a command to
the slave device. Then it must follow that command with a repeated START condition to denote a
read from that device’s address. The slave then returns one or two bytes of data.
Note that there is no STOP condition before the repeated STA RT condition, and that a NACK
signifies the end of the read transfer.
Figure 24.Read byte protocol with PEC
Figure 25.Read Word protocol with PEC
34
RM237 Series and RB237 Series TPS
3.4.2.6 Block write/read
The Block Write begins with a slave address and a write condition. After the command code the host
issues a byte count which describes how many more bytes will follow in the message. If a slave has
20 bytes to send, the byte count field will have the value 20 (14h), followed by the 20 bytes of data.
The byte count does not include the PEC byte. The byte count may not be 0. A Block Read or Write
is allowed to transfer a maximum of 32 data bytes.
Figure 26.Block Write with PEC
A Block Read differs from a block write in that the repeated START condition exists to satisfy the
requirement for a change in the transfer direction. A NACK immediately preceding the STOP
condition signifies the end of the read transfer.
Figure 27.Block Read with PEC
3.4.2.7 Sensor Accuracy
The sensor of the PSMC shall meet below accuracy requirements for sensor readings. The accuracy
shall be meet at the specified environmental condition and the full range of rated input voltage.
READ_VIN

READ_IIN

READ_VOUT

READ_IOUT

READ_POUT

READ_PIN
Table 35.Sensor Accuracy
Required Accuracy (+/-x% of equipment reading)
(Vin range=100v-240v)
Sensor
<10% load
10% - 20% load
>20% - 100% load
Pin
± 10W
± 10W
± 5%
Pout
± 10W
± 10W
± 5%
Vin
± 5%
Vout
± 5%
Iin
NA
± 15%
± 5%
35
RM237 Series and RB237 Series TPS
Iout
NA
± 10%
± 5%
3.4.2.8 PSMC Sensors
Sensors shall be available to the PSMC for monitoring purpose.
All Sensors shall continue to provide real time data as long as the PSMC device is powered.
This means in standby and operation mode, while in standby the main output(s) of the power supply
shall read zero Amps and Volts.
Table 36.PSMC Sensor list
3.4.3
Power Supply Field Replacement Unit (FRU)
The power supply shall support electronic access of FRU information over an I 2 C bus. Six pins at
the power supply connector are allocated for this. They are named SCL, SDA, A1, A0 and Write
protect. SCL is serial clock. SDA is serial data. These two bidirectional signals from the basic
communication lines over the I 2 C bus. A0 and A1 are input address lines to the power supply. The
backplane defines the state of these lines such that the address to the power supply is unique within
the system. The resulting I 2C address shall be per table below. The Write protection pin is to
ensure that data will not accidentally overwritten.
The device used for this shall be powered from a 3.3V bias voltage derived from the +12 Vsb output .
The pull-up resistors shall be on SCL or SDA inside the power supply.
Table 37.Sensor Accuracy
A1
A0
EEPROM
MCU
PSU
0
0
A0
B0
1
0
1
A2
B2
2
1
0
A4
B4
3
1
1
A6
B6
4
36
RM237 Series and RB237 Series TPS
The information to be contained in the FRU device is shown in the following table.
Table 38.FRU Data Format
37
RM237 Series and RB237 Series TPS
38
RM237 Series and RB237 Series TPS
39
RM237 Series and RB237 Series TPS
40
RM237 Series and RB237 Series TPS
41
RM237 Series and RB237 Series TPS
3.5
3.5.1
Smart On Function
PMBus command for Smart On
3.5.1.1 Hardware Connection
Before enabling Smart On function, make sure pin B22 (SMART ON) on output golden finger of each
PSU is connected together.
3.5.1.2 Configuring Smart On with SMART_ON_CONFIG (D0h)
The PMBus manufacturer specific command MFR_SPECIFIC_00 is used to configure the operating
state of the power supply related to Smart On. We will call the command SMART_ON_CONFIG
(D0h). Below is the definition of the values used with the Read-Write Byte SMBus protocol with
PEC.
Table 39.SMART_ON_CONFIG
The default state of power supply is in Standard Redundancy mode. Power supply need to be
re-specified a state whenever initial power on or any power supply in the system is in fault situation .
The SMART_ON_CONFIG command will reset to 00h (Standard Redundancy) when any fault or
over current happened. The faults include AC loss, over hot spot temperature, over ambient
temperature, +12V short internally (under voltage), +12V over voltage, fan locked, D2D controller
soft-start short.
3.5.2
Smart Standby Power Supply Operating State
A power supply is put into Smart Standby whenever PSON# is asserted, and SMART_ON_CONFIG
value is set to 02h.In the Smart Standby mode the power supply must:
1. Power ON when Smart_On bus is driven LOW
2. Keep PWOK asserted
3. No PMBus fault or warning conditions reported via STATUS commands
42
RM237 Series and RB237 Series TPS
4. keep all fans rolling
5. LED is green blinking
3.5.2.1 Powering on Smart Standby supplies to maintain best efficiency
Power supplies in Smart Standby state shall monitor the shared voltage level of the load share
signal to sense when it needs to power on. Depending upon which position the system defines that
power supply to be in the Smart Standby configuration; will slightly change the load share threshold
that the power supply shall power on at.
3.5.2.2 Powering on Smart Standby supplies during a fault or over current
condition
Some warnings happen or 12V output shutdown due to any fault. When an active power supply
asserts, all parallel power supplies in Smart Standby mode shall power on immediately.
The trigger condition:
1. 12V OC fault happens
2. 12V OVP fault
3. 12V UVP fault
4. OTP warning/ fault
5. fan speed fault
6. AC loss(low than 75V +/-5V)
When an active power supply asserts, all parallel power supplies in Smart Standby mode shall
power on immediately.
3.5.3
The Way to Enable Smart On Function
Here are the steps to put PSU into smart on mode. PSU which is assigned as smart on standby can
operate in a power-off state and turn on main power if necessary.
The trigger levels above may have a +/-10% tolerance for actual application.
Step1: Make sure every PSU has AC power cord applied. Use write byte command to set command
0xD0 for each PSU to has it own role (must one PSU as active role).
The command format for Smart On function will be as following example.
B0 in smart_on_active (S B0 w D0 01 PEC P)
B2 in smart_on_standby (S B2 w D0 02 PEC P)
Step2: PSU will enter smart slave mode once the load is lower than the corresponding trigger point.
Step3: If SMART_ON signal falls to low, all PSU will turn on the main power and reset smart_config
to 0x00 (standard redundancy). System needs to re-assign the roles for all PSU to enable smart on
function again.
3.6 ENVIRONMENTAL
The power supply shall operate normally, and sustain no damage as a result of the environmental
conditions listed in this chapter.
43
RM237 Series and RB237 Series TPS
3.6.1
Temperature
Operating Ambient, normal mode (inlet Air): 0°C min/+50°C max at 5000m above sea level.
(At full load, with a maximum rate of change of 5°C/10 minutes, but no more than 10°C/hr)
Operating Ambient, stand-by mode (inlet Air): -5°C min/+50°C max at 5000m above sea level.
Non-operating ambient: -40°C to +70°C (Maximum rate of change shall be 20°C/hr)
3.6.2
Humidity
Operating: 5%- 90% relative humidity (non-condensing)
Non-operating: 5%- 95% relative humidity (non-condensing)
Note: 95% relative humidity is achieved with a dry bulb temperature of 55 °C and a wet bulb
temperature of 54°C.
3.6.3
Altitude
A) Operation : sea level to 5000m
B) Non-Operation : sea level to 15,200m
3.6.4
Vibration
A) Operation : 0.01g²/Hz at 5 Hz sloping to 0.02g²/Hz at 20 Hz, and maintaining 0.02g²/Hz
from 20Hz to 500Hz. The area under the PSD curve is 3.13gRMS. The duration shall be 20
minutes per axis for all three axes on all samples.
B) Non-Operation :- Sine sweep: 5Hz to 500Hz @ 0.5gRMS at 0.5 octave/min; dwell 15min at
each of 3 resonant points;
3.6.5
Mechanical Shock
A) Operation: 10G, 4.3 mSec, no malfunction
B) Non operating: 50G Trapezoidal Wave, Velocity change = 4.3m/sec. Three drops in each
of six directions are applied to each of the samples.
3.6.6
Thermal shock (Shipping)
Non-operating: -40°C to +70°C, 50 cycles, 30°C/min. ≥transition time ≥15°C/min., duration of
exposure to temperature extremes for each half cycle shall be 30minutes.
3.6.7
Catastrophic Failure
The power supply shall be designed to fail without startling noise or excessive smoke.
3.6.8
EMI
The power supply shall comply with FCC part 15, CRISP 22 and EN55-22; Class B for both
conducted and radiated emissions with a 3dB margin. Test shall be conducted using a shielded DC
output calbe to a shielded load. The load shall be adjusted to 100% load. Test will be performed at
115VAC @ 60Hz and 230VAC @ 50Hz power.
44
RM237 Series and RB237 Series TPS
The power supply shall comply with EN55024.
The power supply when installed in the system must meet the following all the immunity
requirements when integrated into the end system.
3.6.9
Magnetic Leakage Fields
The PFC choke magnetic leakage field shall not cause any interference with a high resolution
computer monitor placed next to or on top of the chassis.
3.6.10 Voltage Fluctuations and Flicker
The power supply shall meet the specified limits of EN61000-3-3, for voltage fluctuations and flicker
for equipment ≤16 amps connected to low voltage distribution systems.
3.7 Reliability / Warranty / Service
3.7.1
Mean Time between Failures (MTBF)
The power supply shall have a minimum MTBF at continuous operation of 200,000 hours calculated
at 100%,according to BELL CORE TR-322 at 25°C excluding the Fan MTBF, and at least 100,000
hours including the fan MTBF.
3.7.2
Warranty
The Warranty for the power supply is 36 months (three years) from production date code.
3.7.3
Serviceability
No troubleshooting by maintenance personnel is to be performed. Units shall be returned to FSP
Power for any troubleshooting, unless agreed by both parties.
The power supply will lose warranty if opened other than FSP service personal or agreed by both
parties.
45
RM237 Series and RB237 Series TPS
4. Thermal Management
The fully integrated system is designed to operate at external ambient temperatures of between
10°C and 35°C. Working with integrated platform management, several features within the system
are designed to move air in a front to back direction, through the system and over critical
components to prevent them from overheating and allow the system to operate with best
performance.
BEFORE YOU BEGIN
WARNING: Before working with your server product, observe the safety and ESD
precautions found in the Warnings section at the beginning of this manual.
Air Flow
FAN
Figure 28.System Air Flow and Fan Identification
The following tables provide air flow data associated with one of the system models within this
product, and is provided for reference purposes only. The data was derived from actual wind tunnel
test methods and measurements using fully configured (worst case) system configurations. Lesser
system configurations may produce slightly different data results. In addition, the CFM data was
derived using server management utilities that utilize platform sensor data, and may vary slightly
from the data listed in the tables.
Table 40. System Volumetric Air Flow-RM23712
System Fan
PSU Fan
Total Airflow
100%
Auto
66.0
80%
Auto
51.7
60%
Auto
36.9
40%
Auto
21.5
20%
Auto
7.6
100%
100%
69.5
(CFM)
Table 41. System Volumetric Air Flow-RM23724
46
RM237 Series and RB237 Series TPS
System Fan
PSU Fan
Total Airflow
100%
Auto
88.2
80%
Auto
69.1
60%
Auto
49.1
40%
Auto
30.0
20%
Auto
12.3
100%
100%
91.8
(CFM)
Table 42. System Volumetric Air Flow-RM23708
System Fan
PSU Fan
Total Airflow
100%
Auto
176.0
80%
Auto
140.7
60%
Auto
102.7
40%
Auto
64.2
20%
Auto
26.3
(CFM)
RM23708/12/24 is thermally designed and developed in compliance with ASHRAE Class A2
environment guidance; however, there is extra thermal margin for all components in the system, so
ASHRAE Class A3 environment conditions can be thermally supported.
Note: ASHARE Class A3 – Includes operation up to 40°C for up to 900 hours per year. Refer to
Appendix D for detailed HTA guidance.
The installation and functionality of several system components are used to maintain system
thermals. They include three managed 40mm single rotor system fans, fans integrated into each
installed power supply module, an air duct, populated drive carriers, and a CPU heat sink. Drive
carriers can be populated with a storage device (SSD or Hard Disk Drive) or supplied drive blank.
4.1 Thermal Operation and Configuration Requirements
To keep the system operating within supported maximum thermal limits, the system must meet the
following operating and configuration guidelines:

The system is designed for sustained operation with an external amb ient temperature of up to
35°C (ASHRAE Class A2) with short term excursion based operation up to 45°C (ASHRAE
Class A4).
。
The system can operate at an external ambient temperature of 40°C (ASHRAE Class A3)
for up to 900 hours per year
。
The system can operate at an external ambient temperature of 45°C (ASHRAE Class A4)
for up to 90 hours per year
。
System performance may be impacted when operating at external ambient air
temperatures above 35°C
47
RM237 Series and RB237 Series TPS
。
There is no long term system reliability impact when operating the system at the
extended temperature range within the specified limits.

Specific configuration requirements and limitations are documented in the configuration matrix
found in Appendix D of this document

The CPU-1 processor + CPU heat sink must be installed first. The CPU-2 heat sink must be
installed at all times, with or without a processor installed.

Memory Slot population requirements –

NOTE: Some system configurations may come with pre-installed DIMM blanks. DIMM blanks
should only be removed when installing a DIMM in the same DIMM slot. Memory population
rules apply when installing DIMMs.
。
DIMM Population Rules on CPU-1 – Install DIMMs in order; Channels A, B, C, and D.
Start with the 1st DIMM (Blue Slot) on each channel, then slot 2, then slot 3. Only
remove factory installed DIMM blanks when populating the slot with memory.
。
DIMM Population on CPU-2 – Install DIMMs in order; Channels E, F, G, and H. Start
with the 1st DIMM (Blue Slot) on each channel, then slot 2, then slot 3. Only remove
factory installed DIMM blanks when populating the slot with memory.
。
The following system configurations require that specific memory slots be populated at
all times using either a DIMM or supplied DIMM Blank
System Configuration –24 x 2.5’’ front drive bay or 12 x 3.5” front drive bay

configuration

System Configuration –8 x 3.5” front drive bay configuration



Memory slots 2 and 3 populated on all memory channels
Memory slots 3 populated on all memory channels
All externally accessed drive bays must be populated. Drive carriers can be populated with a
storage device (SSD or HDD) or supplied drive blank.

With the system operating, the air duct must be installed at all times

In single power supply configurations, the 2nd power supply bay must have the supplied filler
blank installed at all times.

Some system configurations require that dual power supplies be installed for the system to
support fan redundancy. See Appendix D for supported thermal configuration data.

System fan redundancy is not supported with systems operating at ASHRAE A3 or A4 thermal
limits

Termally, a system supporting fan redundancy can support the following PCI add -in cards when
the system is operating at a maximum external ambient temperature of 35°C(ASHRAE Class
2).

System Configuration – Storage Models - 12 x 3.5”/24 x 2.5’’ front drive bay
configurations

Add-in cards with a minimum 100 LFM (0.5 m/s) air flow requirement can be
installed in any available add-in card slot in Riser Card #1, Riser Card #2, and
48
RM237 Series and RB237 Series TPS
Riser Card #3

Add-in cards with a minimum 200 LFM (1 m/s) air flow requirement can be
installed in any available add-in card slot on Riser Card #2 and the bottom add-in
card slot on Riser Card #1. Middle and Top add-in card slots on Riser Card #1
cannot support PCI add-in cards with air flow requirements greater than 100 LFM.

Add-in cards with an air flow requirement greater than 200 LFM cannot be
supported in any PCIe* slot on any riser

System Configuration – Storage Models - 8 x 3.5” front drive bay configurations

Add-in cards with a minimum 200 LFM (1 m/s) air flow requirement can be
installed in any available add-in card slot in Riser Card #1, Riser Card #2, and
Riser Card #3

Add-in cards with a minimum 300 LFM (1 m/s) air flow requirement can be
installed in any available add-in card slot on Riser Card #1 and Riser Card #2.

Add-in cards with an air flow requirement greater than 300 LFM cannot be
supported in any PCIe* slot on any riser
。
Note: Most PCI add-in cards have minimum air flow requirements of 100 LFM (0.5m/s).
Some high power add-in cards have minimum air flow requirements of 300 LFM (1.5 m/s)
or higher. System integrators should verify PCI add-in card air flow requirements from
vendor specifications when integrating add-in cards into the system.

The system top-cover must be installed at all times when the system is in operation. The only
exception to this requirement is to hot replace a failed system fan, in which case the top cover
can be removed for no more than 3 minutes at a time.
4.2 Thermal Management Overview
In order to maintain the necessary airflow within the system, all of the previously listed components
need to be properly installed. For best system performance, the external ambient temperature
should remain below 35°C and all system fans (all rotors) should be operational.
For system configurations that support fan redundancy, should a single fan failure occur (System
fan or Power Supply Fan), integrated platform management will: change the state of the System
Status LED to flashing Green, report an error to the system event log, and automatically adjust fan
speeds as needed to maintain system temperatures below maximum thermal limits.
NOTE: All system fans are controlled independent of each other. The fan control system may adjust
fan speeds for different fans based on increasing/decreasing temperatures in different thermal
zones within the chassis.
In the event that system temperatures should continue to increase with the system fans operating at
their maximum speed, platform management may begin to throttle bandwidth of either the memory
subsystem or the processors or both, in order to keep components from overheating and keep the
49
RM237 Series and RB237 Series TPS
system operational. Throttling of these subsystems will continue until system temperatures are
reduced below preprogrammed limits.
The power supply will be protected against over temperature conditions caused by excessive
ambient temperature. In an over-temperature protection condition, the power supply module
will shut down.
4.2.1
Fan Speed Control
The baseboard management controller (BMC) supports monitoring and control of fan speed (RPM).
Each fan is associated with a fan speed sensor that detects fan failure.
The system fans are divided into fan domains, each of which has a separate fan speed control
signal and a separate configurable fan control policy. A fan domain can have a set of temperature
and fan sensors associated with it. These are used to determine the current fan domain state.
4.2.2
Programmable Fan PWM Offset
The system provides a BIOS Setup option to boost the system fan speed by a programmable
positive offset or a “Max” setting. Setting the programmable offset causes th e BMC to add the offset
to the fan speeds to which it would otherwise be driving the fans. The Max setting causes the BMC
to replace the domain minimum speed with alternate domain minimums that also are programmable
through SDRs.
This capability is offered to provide system administrators the option to manually configure fan
speeds in instances where the fan speed optimized for a given platform may not be sufficient when
a high end add-in adapter is configured into the system. This enables easier usage of t he fan speed
control to support Intel as well as third party chassis and better support of ambient temperatures
higher than 35°C.
4.2.3
Hot-Swap Fans
Hot-swap fans are supported. These fans can be removed and replaced while the system is
powered on and operating. The BMC implements fan presence sensors for each hot-swappable
fan.
When a fan is not present, the associated fan speed sensor is put into the reading/unavailable state,
and any associated fan domains are put into the boost state. The fans may already be boosted due
to a previous fan failure or fan removal.
When a removed fan is inserted, the associated fan speed sensor is rearmed. If there are no other
critical conditions causing a fan boost condition, the fan speed returns to the nominal state. Power
cycling or resetting the system re-arms the fan speed sensors and clears fan failure conditions. If
the failure condition is still present, the boost state returns once the sensor has re -initialized and the
threshold violation is detected again.
4.2.4
Fan Redundancy Detection
The BMC supports redundant fan monitoring and implements a fan redundancy sensor. A fan
redundancy sensor generates events when its associated set of fans transitions between redundant
and non-redundant states, as determined by the number and health of the fans. The definition of fan
redundancy is configuration dependent. The BMC allows redundancy to be configured on a per fan
50
RM237 Series and RB237 Series TPS
redundancy sensor basis through OEM SDRrecords.
A fan failure or removal of hot-swap fans up to the number of redundant fans specified in the SDRin
a fan configuration is a non-critical failure and is reflected in the front panel status. A fan failure or
removal that exceeds the number of redundant fans is a non-fatal, insufficient-resources condition
and is reflected in the front panel status as a non-fatal error.
Redundancy is checked only when the system is in the DC-on state. Fan redundancy changes
that occur when the system is DC-off or when AC is removed will not be logged until the system
is turned on.
4.2.5
Fan Domains
System fan speeds are controlled through pulse width modulation (PWM) signals, which are driven
separately for each domain by integrated PWM hardware. Fan speed is changed by adjusting the
duty cycle, which is the percentage of time the signal is driven hi gh in each pulse.
The BMCcontrols the average duty cycle of each PWM signal through direct manipulation of the
integrated PWM control registers.
The same device may drive multiple PWM signals.
4.2.6
Nominal Fan Speed
A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the state
of one or more associated temperature sensors.
Chenbro customized SDRrecords are used to configure which temperature sensors are associated
with which fan control domains and the algorithmic relationship between the temperature and fan
speed. Multiple Chenbro customized SDRs can reference or control the same fan control domain;
and multiple Chenbro customized SDRs can reference the same temperature sensors.
The PWM duty-cycle value for a domain is computed as a percentage using one or more instances
of a stepwise linear algorithm and a clamp algorithm. The transition from one computed nominal fan
speed (PWM value) to another is ramped over time to minimize audible transitions. The ramp rate is
configurable by means of the OEM SDR.
Multiple stepwise linear and clamp controls can be defined for
simultaneously. For each domain, the BMC uses the maximum of
control contributions and the sum of the domain’s clamp control
domain’s PWM value, except that a stepwise linear instance can
domain maximum.
each fan domain and used
the domain’s stepwise linear
contributions to compute the
be configured to provide the
Hysteresis can be specified to minimize fan speed oscillation and to smooth fan speed transitions. If
a Tcontrol SDR record does not contain a hysteresis definition, for example, an SDR adhering to a
legacy format, the BMC assumes a hysteresis value of zero.
4.2.7
Thermal and Acoustic Management
This feature refers to enhanced fan management to keep the system optimally cooled while
reducing the amount of noise generated by the system fans. Aggressive acoustics standards might
require a trade-off between fan speed and system performance parameters that contribute to the
cooling requirements and primarily memory bandwidth. The BIOS, BMC, and SDRs work together to
provide control over how this trade-off is determined.
This capability requires the BMC to access temperature sensors on the individual me mory DIMMs.
Additionally, closed-loop thermal throttling is only supported with buffered DIMMs.
51
RM237 Series and RB237 Series TPS
4.2.8
Thermal Sensor Input to Fan Speed Control
The BMC uses various IPMI sensors as input to the fan speed control. Some of the sensors are IPMI
models of actual physical sensors whereas some are “virtual” sensors whose values are derived
from physical sensors using calculations and/or tabular information.
The following IPMI thermal sensors are used as input to fan speed control:














Front Panel Temperature Sensor 1
CPU Margin Sensors 2,4,5
DIMM Thermal Margin Sensors 2,4
Exit Air Temperature Sensor 1, 7, 9
PCH Temperature Sensor 3,5
Add-In Intel SAS Module Temperature Sensors 6
PSU Thermal Sensor 3, 8
CPU VRTemperature Sensors 5
DIMM VRTemperature Sensors 5
BMC Temperature Sensor 3, 6
Global Aggregate Thermal Margin Sensors 7
Hot Swap Backplane Temperature Sensors
I/O Module Temperature Sensor (With option installed)
Intel®SAS Module (With option installed)
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
For fan speed control in Chenbro chassis
Temperature margin from throttling threshold
Absolute temperature
PECI value or margin value
On-die sensor
On-board sensor
Virtual sensor
Available only when PSU has PMBus
Calculated estimate
A simple modul is shown in the following figure which gives a high level representation of how the
fan speed control structure creates the resulting fan speeds
52
RM237 Series and RB237 Series TPS
Figure 29.Fan Control Model
4.3 System Fans
Six 60 x 38mm system fans, and dedicated fans for the installed power supply modules provide the
primary airflow for the system.
The server board is capable of supporting up to a total of six system fans. On the server board, each
system fan includes a pair of fan connectors. a 2x3 pin connector to support a single rotor hot swap
fan assembly.
Figure 30.System Fan Connector Locations
Table 43. System Fan Connector Pin-out
Hot Swap SYS_FAN # (1-6)
Signal
Pin#
Pin#
Signal
GROUND
1
2
P12V FAN
FAN TACH
3
4
FAN PWM
SYS FAN
PRSNT
5
6
LED FAN FAULT
The system fan assembly is designed for ease of use and supports several features.
 The entire fan assembly can be removed making it easier to service other features of the
system

Each individual fan is hot-swappable

Each fan is blind mated to a matching 6-pin connector located on the server board
53
RM237 Series and RB237 Series TPS

Each fan is designed for tool-less insertion and extraction from the fan assembly

Fan speed for each fan is controlled by integrated platform management. As system thermals
fluctuate high and low, the integrated BMC firmware will increase and decrease the speeds
to specific fans within the fan assembly to regulate system thermals

Each fan has a tachometer signal that allows the integrated BMC to monitor its status

On top of each fan is an integrated fault LED. Platform management illuminates the fault LED
for the failed fan.
Figure 31.System Fan Assembly
WARNING: HAZARDOUS MOVING PARTS KEEP FINGERS AND OTHER BODY PARTS
AWAY
4.4 Power Supply Module Fans
Each installed power supply module includes embedded (non-removable) 40-mm fans. They are
responsible for airflow through the power supply module. These fans are managed by the fan
control system. Should a fan fail, the power supply will shut down.
54
RM237 Series and RB237 Series TPS
5. System Storage and Peripheral Drive Bay Overview
RM23712/24 has support for a variety of different storage options, including:




Support for 12 Front Mount Hot Swap 3.5’’ SAS/SATA Drives
Support for 24 Front Mount Hot Swap 2.5’’ SAS/SATA Drives
Support for 8 Front Mount Hot Swap 3.5’’ SAS/SATA Drives
Accessory Kit option to support for 2 RearMount2.5’’ Hot Swap Drives
Support for different storage and peripheral options will vary depending on the system model and/or
available accessory options installed. This section will provide an overview of each available option.
BEFORE YOU BEGIN
WARNING: Before working with your server product, observe the safety and ESD
precautions found in the Warnings section at the beginning of this manual.
5.1 Front Mount Drive Support
RM23708/12/24 supports 12x3.5” front mounted drives or 24x2.5” front mounted drives or 8x3.5”
front mounted drives, and provides front panel I/O and front control panel support.
Figure 32. 12x3.5’’ Drive Bay Configuration
Figure 33. 24x2.5’’ Drive Bay Configuration
Figure 34. 8x3.5’’ Drive Bay Configuration
5.2 System Fan RVI and Hard Disk Drive Storage Performance
Hard disk drive storage technology, which utilizes the latest state-of-the-art track density
architectures, are susceptible to the effects of system fan rotational vibration interference (RVI)
55
RM237 Series and RB237 Series TPS
within the server system. As system fan speeds increase to their upper limits (>80% PWM or >
10,200 RPM), hard disk drive performance can be impacted.
Chenbro publishes a list of supported hard drives on its Tested Hardware and OS List (THOL). In
general, unless identified in the NOTES column in the THOL, all listed hard drives have been tested
to meet Chenbro performance targets when the systems fans are operating above 80% PWM and/or
the system is operating at or below the platform ambient thermal limit of 35°C (95°F).
The THOL may also list hard drives that are only recommended for use in non -extreme operating
environments, where the ambient air is at or below 20°C (68°F) and /or the hard drives are installed
in system configurations where the system fans regularly operate below 80% PWM. Hard drives that
require these support criteria for a given system will include an “Environmental Limitation” tag and
message in the THOL “NOTES” column for that device. Using these drives in the more extreme
operating environments puts these devices at higher risk of performance degradation.
Chenbro recommends the following general support guidelines for server systems configu red with
hard drive storage technology:

Avoid sustained server operation in extreme operating environments. Doing so will cause the
system fans to operate at their upper speed limits and produce higher levels of RVI which could
affect hard drive performance.
NOTE: Solid State Drive (SSD) performance is not impacted by the effects of system fan RVI.
5.3 External Hot Swap Drive Carriers
Each SAS/SATA hard disk drive or SSD that interfaces with a backplane is mounted to a hot swap
drive carrier. Drive carriers include a latching mechanism used to assist with drive extraction and
drive insertion.
Picture is being prepared
(2.5’’ Hot Swap Storage Device Carrier
Removal
)
Figure 35. 2.5’’/3.5’’ Hot Swap Storage Device Carrier Removal
NOTE: To ensure proper system air flow requirements, all front drive bays must be populated with
a drive carrier. Drive carriers must be installed with either a drive or supplied drive blank.
There are drive carriers to support 2.5” devices and 3.5” devices. To maintain system thermals, all
drive bays must be populated with a drive carrier mounted with a hard disk drive, SSD, or supplied
drive blank. Drive blanks used with the 3.5” drive carrier can also be used to mount a 2.5” SSD into
it as shown below.
56
RM237 Series and RB237 Series TPS
Figure 36. 2.5’’ SSD mounted to 3.5’’ Drive Tray
Figure 37.3.5''/2.5’’HDD Installation
Figure 38.3.5''/2.5’’HDD Removal
NOTE: Due to degraded performance and reliability concerns, the use of the 3.5” drive blank as a
2.5” device bracket is intended to support SSD type storage devices only. Installing a 2.5” hard
disk drive into the 3.5” drive blank cannot be supported.
Each drive carrier includes separate LED indicators for drive Activity and drive Status. Light pipes
integrated into the drive carrier assembly direct light emitted from LEDs mounted next to each drive
connector on the backplane to the drive carrier faceplate, making them visible from the front of the
system.
Blue power LED
Green Activity LED
2.5'' only drive tray
Blue power LED
2.5''/3.5'' drive tray
Green Activity LED
Figure 39. Drive Tray LED Identification
Table 44 Drive Power LED/Activity LED States
LED
Color
Behavior
Condition
57
RM237 Series and RB237 Series TPS
N/A
Stay off
Hard drive fault has occurred
Blue
Solid on
When power on
Green
Stay on
When HDD is busy
Red
Blink
Drive spinning up
Power LED
Activity LED
NOTE: The drive activity LED is driven by signals coming from the drive itself. Drive vendors may
choose to operate the activity LED different from what is described in the table above. Should the
activity LED on a given drive type behave differently than what is described, customers should
reference the drive vendor specifications for the specific drive model to determine what the
expected drive activity LED operation should be.
5.4 Peripheral Power Sources
Power for all backplanes and peripheral storage devices is drawn from two power connectors
labeled as “HSBP_PWR” and the “Peripheral PWR” on the server board as illustrated below.
Figure 40.Server Board Peripheral Power Connectors
HSBP Power – The hot swap backplane power connector provides power for all front mounted
backplane options. Appropriate power cables to support any given backplane option will be
included with the given system model or given backplane accessory kit. See Table 27. Hot Swap
58
RM237 Series and RB237 Series TPS
Backplane Power Connector Pin-out (“HSBP PWR").
Peripheral Power – The “Peripheral_PWR” connector is used to provide power to various add -in
options including: Optical SATA Drive, internal mounted SSD Storage devices, and the 2 x 2.5” Rear
Mount Hot Swap Backplane Accessory Kit. Appropriate power cables to support any supported
peripheral option will be included with the given system model or given accessory kit optio n.
5.5 Storage Backplane Optional
RM237 series has support for two backplane options.
 12
x 3.5” Mini SAS HD backplane
 24
x 2.5’’ Mini SAS HD with expander backplane
All available backplane options mount directly to the back of the drive bay as shown in the
following illustration.
Picture is being prepared
Figure 41. Backplane Installation-12x3.5’’
①.Install backplane vertically into the chassis to align the screw holes with the hooks.
②.Secure the backplane with three screws as shown.
Picture is being prepared
Figure 42. Backplane Installation-24x2.5’’
59
RM237 Series and RB237 Series TPS
Picture is being prepared
Figure 43. Backplane Installation-8x3.5’’
All available SAS/SATA compatible backplanes include the following common features:





5.5.1
12 Gb SAS and 6Gb SAS/SATA
29-pin SFF-8680 12 Gb rated drive interface connectors, providing both power and I/O
signals to attached devices
Hot swap support for SAS/SATA devices
I2C interface from a 3-pin connector for device status communication to the BMC over
slave SMBus
LEDs to indicate drive activity and status for each attached device
SGPIO Functionality
Backplane includes support for a SFF-8485 compliant SGPIO interface used to activate the Status
LED. This interface is also monitored by the microcontroller for generating FAULT, IDENTIFY, and
REBUILD registers that in turn are monitored by the server board BMC for generating corresponding
SEL events.
5.5.2
I2C Functionality
The microcontroller has a master/slave I2C connection to the server board BMC. The
microcontroller is not an IPMB compliant device. The BMC will generate SEL events by monitoring
registers on the HSBP microcontroller for DRIVE PRESENCE, FAULT, and RAID REBUILD in
progress.
5.5.3
3.5’’ Drive Hot-Swap Backplane Overview
The 3.5” drive system SKUs within the product family will ship with a 12x drive or 8x drive backplane
capable of supporting 12 Gb/sec SAS drives. Both hard disks and Solid State Drives (SSDs) can be
supported within a common backplane. Each backplane can support SAS devices. However, SATA
and mixing of SATA and SAS devices within a common hot swap backplane are not supported.
Supported devices are dependent on the type of host bus controller driving the backplane.
The front side of the backplane includes 4 x 29-pin drive interface connectors, each capable of
supporting 12 Gb SAS or 6 Gb SAS/SATA. The connectors are numbered 0 thru 3. Signals for all
four drive connectors are routed to a single multi-port mini-SAS HD connector or four SATA host
connector on the back side of the backplane.
5.5.3.1 12G Mini SAS HD 12 Port Backplane
Table 45.12G Mini SAS HD 12 Port Backplane specification
60
RM237 Series and RB237 Series TPS
Specification
Host Interface
Mini SAS HD
HDD Interface
SAS
Hot-Swap
Yes, allows user to on line replace Hard Disk Drive
LED indicates Hard Disk Drive status
Power LED – Blue (When HDD is present)
Display
Access LED – Green (When HDD is busy)
Error LED – Red (When HDD is error)
Cooling
Four Fan connector
Environment Monitor
Temperature senor detect(TEMP1,TEMP2)
1.SAS29P *12
2.Mini-SAS HD Connector for Raid card or Table Link *2
3.ATX 8P Power connector *2 for +12V from power supply
Connectors
4. PIN Header 2.54mm (1x4) *1, (2x3) *1
5. Wafer 2.54mm Connector 2P *2
6. Wafer 2.5mm Connector 4P *1
Dimension
432.0(L) x 81.0(W) x 2.4(H) mm
Material
FR4
8 layer
E
C
D
F
B
A
Figure 44. 12G Mini SAS HD 12 Port Backplane– front view
Label
A
B
C
D
E
F
Description
HDD_0
HDD_3
HDD_4
HDD_7
HDD_8
HDD_11
On the backside of the backplane are several connectors. The following illustration identifies each.
61
RM237 Series and RB237 Series TPS
C
A
B
B
A
Figure 45. 12G Mini SAS HD 12 Port Backplane – rear view
Label
A
B
C
Description
Power connector
SAS/SATA Ports 0-12 Mini-SAS HD cable connector
I2C connector
A – Power Connector – The backplane includes a 2x4 connector supplying power to the backplane.
Power is routed to the backplane via a power cable harness from the Power Supply Modules.
B – Multi-port Mini-SAS Cable Connector – The backplane includes one multi-port mini-SAS cable
connector providing data signals for four SAS/SATA drives on the backplane. A cable can be routed
from matching connectors on the server board or add-in SAS/SATA RAID cards.
C – I2C Cable Connector – The backplane includes a 1x3 cable connector used as a management
interface to the server board.
5.5.3.2 12G Mini SAS HD 12 Port Backplane
Table 46.12G Mini SAS HD 8 Port Backplane specification
Specification
Host Interface
Mini SAS HD
HDD Interface
SAS
Hot-Swap
Yes, allows user to on line replace Hard Disk Drive
LED indicates Hard Disk Drive status
Display
Power LED – Blue (When HDD is present)
Access LED – Green (When HDD is busy)
Error LED – Red (When HDD is error)
Cooling
Four Fan connector
Environment Monitor
Temperature senor detect(TEMP1,TEMP2)
1.SAS29P *8
2.Mini-SAS HD Connector for Raid card *2
Connectors
3.ATX 8P Power connector *1 for +12V from power supply
4. PIN Header 2.54mm, (2x3) *1
5. Wafer 2.54mm Connector 2P *2
6. Wafer 2.5mm Connector 4P *1
Dimension
432.0(L) x 53.2(W) x 2.4(H) mm
Material
FR4
8 layer
62
RM237 Series and RB237 Series TPS
C
D
A
B
Figure 46. 12G Mini SAS HD 8 Port Backplane– front view
Label
Description
HDD_0
HDD_3
HDD_4
HDD_7
HDD_8
HDD_11
A
B
C
D
E
F
On the backside of the backplane are several connectors. The following illustration identifies each.
C
B
A
B
Figure 47. 12G Mini SAS HD 8 Port Backplane – rear view
Label
A
B
C
Description
Power connector
SAS/SATA Ports 0-8 Mini-SAS HD cable connector
I2C connector
5.5.3.3 3.5’’ drive Backplane pin define
Table 47.Connector Pin-out – Mini SAS HD Backplane
Connector
Pin Number
Pin Definition
Input/output
Description
Power
1
GND
Power Output
Power GND
Connector
2
GND
Power Output
Power GND
(JP01&JP02)
3
GND
Power Output
Power GND
4
GND
Power Output
Power GND
5
+12V
Power Output
Power +12V
6
+12V
Power Output
Power +12V
7
+12V
Power Output
Power +12V
Drawing
63
RM237 Series and RB237 Series TPS
8
+12V
Power Output
Power +12V
Fan
1
GND
Power Output
Power GND
Connector
2
+12V
Power Output
Power +12V
3
TACHO
Input
(JF2~JF5)
FAN Sensor
signal
4
PWM
Output
FAN PWM signal
1
GND
Power Output
Power GND
2
PSU Alarm
Input
Fail signal Input
1
GND
Power Output
Power GND
2
PSU Mute
Output
Mute signal Input
RS232
1
GND
Power Output
Power GND
Connector
2
KEY PIN
NA
NA
3
UART_RX
Input
Power FAIL
ALARM
Connector
(JC7)
Power FAIL
MUTE
Connector
(JC6)
(JC4)
Serial Port
Received Data
Serial Port
4
UART_TX
Output
Transmitted Data
2.54 Pin
1
FAIL LED +
Power Output
2
FAIL LED -
Output
Header
Power +5V
GB Fail signal
(JC5)
output
3
KEY PIN
NA
NA
4
NA
NA
NA
5
Mute SW +
Input
Mute signal Input
6
GND
Power Output
Power GND
1
SDA
I/O
Serial SG Data
2
GND
Power Output
Power GND
3
SCL
I/O
Serial SG Clock
4
+5V
Power Output
Power +5V
S1
GND
GND
GND
S2
TP
Input
I2C
Connector
(JC1)
HDD IN
Connector
(CH00, …….
Transmitter data
(+)
CH11)
Transmitter data
S3
TN
Input
(-)
64
RM237 Series and RB237 Series TPS
S4
GND
GND
GND
S5
RN
Output
Receiver data (-)
S6
RP
Output
Receiver data (+)
S7
GND
GND
GND
S8
NC
NC
NC
S9
NC
NC
NC
S10
NC
NC
NC
S11
NC
NC
NC
S12
NC
NC
NC
S13
NC
NC
NC
S14
NC
NC
NC
P1
NC
NC
NC
P2
NC
NC
NC
P3
NC
NC
NC
P4
GND
GND
GND
Plug-in
P5
HDD Plug-in
Input
detection
detection
P6
GND
GND
GND
P7
5V Pre-Charge
Input
Pre-Charge +5V
P8
5V
Power
Power +5V
P9
5V
Power
Power +5V
P10
GND
GND
GND
P11
NC
NC
NC
P12
GND
GND
GND
Input
Pre-charge +12V
12V
P13
Pre-Charge
P14
12V
Power
Power +12V
P15
12V
Power
Power +12V
Mini SAS HD
A1
NC
NC
NC
Connector
A2
NC
NC
NC
(CB1&CB2)
A3
GND
GND
GND
A4
RP1
Input
Receiver data 1
(+)
Receiver data 1
A5
RN1
Input
(-)
A6
GND
GND
A7
RP3
Input
GND
Receiver data 3
(+)
Receiver data 3
A8
RN3
Input
(-)
A9
GND
GND
GND
65
RM237 Series and RB237 Series TPS
B1
NC
NC
NC
B2
NC
NC
NC
B3
GND
GND
GND
B4
RP0
Input
Receiver data 0
(+)
Receiver data 0
B5
RN0
Input
(-)
B6
GND
GND
B7
RP2
Input
GND
Receiver data 2
(+)
Receiver data 2
B8
RN2
Input
(-)
B9
GND
GND
GND
C1
NC
NC
NC
C2
NC
NC
NC
C3
GND
GND
GND
C4
TP1
Output
Transmitter data
1(+)
Transmitter data
C5
TN1
Output
1(-)
C6
GND
GND
C7
TP3
Output
GND
Transmitter data
3(+)
Transmitter data
C8
TN3
Output
3(-)
C9
GND
GND
GND
D1
NC
NC
NC
D2
NC
NC
NC
D3
GND
GND
GND
D4
TP0
Output
Transmitter data 0
(+)
Transmitter data 0
D5
TN0
Output
(-)
D6
GND
GND
D7
TP2
Output
GND
Transmitter data 2
(+)
Transmitter data 2
D8
TN2
Output
(-)
D9
5.5.3.3.1
GND
GND
GND
SW Function
66
RM237 Series and RB237 Series TPS
Figure 48.SW Function
SW number
Function
Setting
Description
SW1-1
FAN Number
ON
3
OFF
4
PWM
ON
Enable
Enable/Disable
OFF
Disable
ON
55oC
OFF
65oC
FAN ALARM
ON
Enable
Enable/Disable
OFF
Disable
BUZZER
ON
Enable
Enable/Disable
OFF
Disable
SES
ON
Enable
Enable/Disable
OFF
Disable
SW1-2
SW1-3
TEMP Threshold
SW1-4
SW1-5
SW1-6
Table 48.SW Function Setting
5.5.4
24 x 2.5” Drive Hot-Swap active Backplane Overview
The 12Gbs active backplane with Mini-SAS HD interface towards MB is equipped with an LSISAS3x36
expander to support 24x2.5’’ bay HDDs. Besides providing excellent disk IO access performance, intelligent
LED control and thermal monitoring are also for system optimization and differentiation through on-board
MCU firmware programming.
5.5.4.1 24 port active backplane block diagram
67
RM237 Series and RB237 Series TPS
Figure 49. 24 port active backplane block diagram
5.5.4.2 12G active backplane with Mini-SAS HD interface
Table 49.12G Active Backplane Specification
68
RM237 Series and RB237 Series TPS
Figure 50. 12G active Backplane with Mini SAS HD interface– front view
Figure 51. 12G active Backplane with Mini SAS HD interface– rear view
5.5.4.3 12G 16 port passive backplane
Table 50.12G 16 port Backplane Specification
69
RM237 Series and RB237 Series TPS
Figure 52. 12G 16 port Backplane– front view
Figure 53. 12G 16 port Backplane– rear view
5.5.4.4 12G 8 port passive backplane
Table 51.12G 8 port Backplane Specification
70
RM237 Series and RB237 Series TPS
Figure 54. 12G 8 port Backplane– front view
Figure 55. 12G 8 port Backplane– rear view
5.5.4.5 12G 24 port active backplane Pin definition
Table 52.12G 24 port active Backplane Pin Definition
71
RM237 Series and RB237 Series TPS
Storage Host Connector(CB1,CB2,CB3)
72
RM237 Series and RB237 Series TPS
Power Source Connector(JP01)
Fan Connector (JF2~JF5)
DIP Switch Setting (SW1)
73
RM237 Series and RB237 Series TPS
I2C for BMC Access (JC1)
Alarm from PSU (JC6)
Fail and Mute to Front panel (JC4)
74
RM237 Series and RB237 Series TPS
Fail and Mute to Front panel (JC5)
Serial Port (JC3 and JC2)
JTAG for Expander (JA1)
75
RM237 Series and RB237 Series TPS
5.5.5
8x3.5’’ Drive Hot Swap passive backplane overview
5.6 2 x 2.5’’ Hot Swap Drive Bay Accessory Kit
Chenbro Accessory Kit Product Code: 83H803237-005
The 2U product family provides the option to support two 6 Gb/ sec hot swap SATA SSDs installed
to a modular drive bay mounted in the back of the system.
2x2.5''Hot Swap
Drive Bay(Optional)
Figure 56.2 x 2.5'' Rear Mount Backplane Kit Placement
Supported SATA SSDs must not exceed the following power and thermal limits:
 1 or 2 SATA SSDs supporting up to 4W per device with a case temperature rating of 70 degree C
 1 or 2 SATA SSDs supporting up to 1.5W per device with a case temperature rating of 60 degree C
Note- The maximum supported SSD power and thermal limits documented above,were derived
based on thermal testing using a maximum system configuration with fan redundancy support
operating at ambient input air temp of 35°C. The test system was based on the system models
utilizing a maximum number of front and rear drive storage devices – 12 x 3.5” in the front + 2 x 2.5”
in the back
- Because of thermal limits in this area of the chassis, the rear hot swap drive bay option cannot
support the thermal requirements to support hard disk drives in any system configuration.
The backplane includes several connectors and a jumper block, as defined in the following
illustrations.
Table 53.12G SAS 2 Port Backplane
Specification
Host Interface
SATA
HDD Interface
SAS
Hot-Swap
Yes, allows user to on line replace Hard Disk Drive
LED indicates Hard Disk Drive status
Display
Power LED – Blue (When HDD is present)
Access LED – Green (When HDD is busy)
Error LED – Red (When HDD is error)
Environment Monitor
Temperature senor TMP75 detect(U2)
76
RM237 Series and RB237 Series TPS
1.SATA7P *2
2. SAS 29P *2
Connectors
3.Standard ATX 4P Power connector *1 for +5V, +12V from
power supply
4. I2C Connector *1
Dimension
77.0(L) x 38.7(W) x 2.4(H) mm
Material
FR4
4 layer
Activity and
Status LEDs
SATA Drive
Connectors
Power
Connector
HOST IN
Connectors
I2C Connector
Figure 57.2 x 2.5'' Hot Swap Backplane
Table 54.2 x 2.5'' Rear Backplane Connectors
Connector
Pin Number
Pin Definition
Input/output
Description
Power
1
GND
GND
GND
Connector
2
GND
GND
GND
(CN1)
3
+12V
Power Input
Power +12V
4
+5V
Power Input
Power +5V
1
SDA
I/O
I2C Data
I2C
Connector
Signal(Internal
(JC1)
pull high +5V)
2
GND
GND
GND
3
SCL
Input
I2C Clock
Drawing
Signal(Internal
pull high +5V)
4
+5V
Power
Power +5V to I2C
only (Option)
HOST IN
A1
GND
GND
GND
Connector
A2
RP
Output
Receiver data(+)
(CH11&CH21
A3
GND
Output
Receiver data(-)
A4
GND
GND
GND
)
77
RM237 Series and RB237 Series TPS
A5
TN
Input
Transmitter
data(-)
A6
TP
Input
Transmitter
data(+)
A7
GND
GND
GND
HDD IN
S1
GND
GND
GND
Connector
S2
TP
Input
Transmitter data
(CH12,
CH22)
(+)
S3
TN
Input
Transmitter data
(-)
S4
GND
GND
GND
S5
RN
Output
Receiver data (-)
S6
RP
Output
Receiver data (+)
S7
GND
GND
GND
S8
NC
NC
NC
S9
NC
NC
NC
S10
NC
NC
NC
S11
NC
NC
NC
S12
NC
NC
NC
S13
NC
NC
NC
S14
NC
NC
NC
P1
NC
NC
NC
P2
NC
NC
NC
P3
NC
NC
NC
P4
GND
GND
GND
P5
Plug-in
Input
HDD Plug-in
detection
detection
P6
GND
GND
GND
P7
5V Pre-Charge
Input
Pre-Charge +5V
P8
5V
Power
Power +5V
P9
5V
Power
Power +5V
P10
GND
GND
GND
P11
NC
NC
NC
P12
GND
GND
GND
P13
12V
Input
Pre-charge +12V
Pre-Charge
P14
12V
Power
Power +12V
P15
12V
Power
Power +12V
5.7 Low Profile eUSB SSD Support
78
RM237 Series and RB237 Series TPS
The system provides support for a low profile eUSB SSD storage device. A 2mm 2x5 -pin connector
labeled “eUSB SSD” near the rear I/O section of the server board is used to plug this small flash
storage device into.
Figure 58.Low Profile eUSB SSD
Support eUSB features include:




2 wire small form factor Universal Serial Bus 2.0 (Hi-Speed USB) interface to host
Read Speed up to 35 MB/ s and write Speed up to 24 MB/ s
Capacity range from 256 MB to 32 GB
Support USB Mass Storage Class requirements for Boot capability
5.8 SATA DOM Support
The system has support for up to two vertical low profile Disk-on-Module (DOM) devices.
Supported SATADOMs for this server board include those from Apacer* or Innodisk*.
Note: In this server system, SATADOMs from Innodisk* must have firmware version S130710 or later.
Figure 59. Apacer* and Innodisk* Dimension
79
RM237 Series and RB237 Series TPS
Each installed SATA DOM plugs directly into one of the white single port SATA connectors on the
server board, which provide both power and I/O signals.
Figure 60.SATA DOM Placement
Each single port SATA connector has the following 7 + 2 pinout
Table 55.SATA Connector Pin-out
PIN
SIGNAL
PWR 2
GND
1
GND
2
SATAx_TX_DP
3
SATAx_TX_DN
4
GND
5
SATAx_RX_DN
6
SATAx_RX_DP
7
GND
PWR 1
5V
80
RM237 Series and RB237 Series TPS
6. Front Control Panel and I/O Panel Overview
RM23708/12/24 includes a Control Panel and I/O Panel on the front of the system.
6.1 I/O Panel Features
A
B
C
Left ear
Right ear
Label
Description
A
VGA Connector
B
USB 2.0
C
USB 3.0
Figure 61. Front I/O Panel Features
USB 2.0/3.0 Ports –The front I/O panel includes one USB 2.0 and one USB3.0 ports. The USB
ports are cabled to a Blue 2x5 connector on the server board labeled “ FP_USB”.
** NOTE: Due to signal strength limits associated with USB 3.0 ports cabled to a front panel, some
marginally compliant USB 3.0 devices may not be supported from these ports. In addition, server
systems based on the Intel®Server Board S2600WT cannot be USB 3.0 certified with USB 3.0
ports cabled to a front panel.
6.2 Control Panel Features
A
B
C
D
E
F
G
Left ear
Figure 62. Front Panel Control and Buttons
81
RM237 Series and RB237 Series TPS
The system includes a front panel that provides button system controls and LED indicators for
several system features. This section will provide a description for each front control panel feature.
Table 56. Front Control Panel Buttons And Indicators
Label
6.2.1
Description
A
Power on Button
B
ID Switch
C
System Reset Button
D
HDD Activity LED
E
FAN Activity LED
F
LAN1 Activity LED
G
LAN2 Activity LED
LED Board with Cable and Connectors
Figure 63.LED Board with Cable and Connectors
Table 57.LED Board Specification
Specification
Display
Connectors
LED indicates status
Power LED – Blue (When power on)
ID LED – Blue (when locate this machine)
HDD LED – Amber (when HDD is busy)
FAN LED – Green (whenFan is busy) ,Red (when signal is
error)
LAN1、LAN2 LED – Green (when internet is busy)
(2x15) *1, (2x5) *1
USB connector *1
Dimension
54.8(L)x17.2(W)x1.6(H)mm
Material
FR4
2
layer
82
RM237 Series and RB237 Series TPS
Figure 64.LED Connectors Pin-out
NOTE: The Status LED is controlled by the BMC but the BIOS informs the BMC of the state to
which the Status LED should be set.
The BMC-detected states are included in the LED states. For fault states that are monitored by the
BMC sensors, the contribution to the LED state follows the associated sensor state, with priority
given to the most critical asserted state.
When the server is powered down (transitions to the DC-off state ), the BMC is still on standby
power and retains the sensor and front panel status LED state established before the power-down
event.
When AC power is first applied to the system, the status LED turns solid blue and then immediately
changes to extinguish to indicate that the power is failure.
83
RM237 Series and RB237 Series TPS
7. PCIe* Riser Card Support
The system includes a riser card slot on the server board. This section will provide an overview and
description of the server board features and architecture supporting it.
NOTE: The riser card slot is specifically designed to support riser cards only. Attempting to
install a PCIe* add-in card directly into a riser card slot on the server board may damage the
server board, the add-in card, or both.
The system supports two slots PCIe* x16 (16 lanes, x16 slot) and one PCIe x8 riser card. The riser
card is mounted to a bracket assembly which is inserted into the riser card slot on the server board.
BEFORE YOU BEGIN
WARNING: Before working with your server product, observe the safety and ESD
precautions found in the Warnings section at the beginning of this manual.
7.1 Riser Card Assembly
The system includes two different riser cards assemblies, one supporting three full height slots and
one supporting two low profile slots in a back-to-back butterfly configuration.
Figure 65. Riser Card Bracket 1
Figure 66. Riser Card Bracket 2
Depending on the riser card option installed, Riser Slots #1 and #2 can each support up to two full
height full length add-in cards (top and middle slots on each riser) and one full height ½ length
84
RM237 Series and RB237 Series TPS
add-in card (bottom slot on each riser).
NOTE: Add-in cards that exceed the PCI specification for ½ length PCI add-in cards (167.65mm or
6.6in) may interfere with other installed devices on the server board when installed in the bottom
add-in card slot.
Installation of each riser card assembly into the chassis is tool-less. Hooks on the back edge of the
riser card assembly are aligned with slots on the chassis, then each assembly is pushed down into
the respective riser card slots on the server board.
Figure 67. Riser Card Assembly
7.2 Riser Card Option
Several multi-slot PCI riser card options are available for this server product.
7.2.1
2-Slot PCIe Riser Card – Chenbro Product Code: 80H09323702A1
Riser Card bracket 2 is provided to support up to two additional PCIe add-in card slots for 2U server
configurations.The available riser card option is designed to support low profile add -in cards only.
Slot #
Description
Slot-1 (Top)
PCIe x8 elec, x8 mechanical
Slot-2 (Bottom)
PCIe x8 elec, x8 mechanical
Figure 68. 2-Slot PCIe Riser Card
85
RM237 Series and RB237 Series TPS
7.2.2
3-Slot PCIe Riser Card – Chenbro Product Code: 80H09323701A0
Riser Card bracket 1 is provided to support up to three additional PCIe add-in card slots for 2U server
configurations.
Slot #
Slot-1 (Top)
Description
PCIe x8 elec, x16 mechanical
Slot-2 (Middle)
PCIe x8 elec, x16 mechanical
Slot-3 (Bottom)
PCIe x8 elec, x8 mechanical
Figure 69. 2-Slot PCIe Riser Card
86
RM237 Series and RB237 Series TPS
8. Intel® I/O Module Support
To broaden the standard on-board feature set, the server board provides support for one of several
available Intel® I/O Module options. The I/O module attaches to a high density 80-pin connector on
the server board (labeled “IO_Module”) and is supported by x8 PCIe Gen3 signals from the IIO
module of the CPU 1 processor.
BEFORE YOU BEGIN
WARNING: Before working with your server product, observe the safety and ESD
precautions found in the Warnings section at the beginning of this manual.
Figure 70. Intel ® I/O Module Placement
Supported I/O modules include:
Table 58. Supported Intel® I/O Modules
Description
Intel Product Code
Quad port RJ45 1 GbEbased on Intel®Ethernet Controller I350
Intel®I/O Module AXX4P1GBPWLIOM
Dual port RJ-45 10GBase-T I/O Module based on
Intel®Ethernet Controller x540
Intel®I/O Module AXX10GBTWLIOM3
Dual port SFP+ 10 GbEmodule based on Intel®82599 10 GbEcontroller Intel®I/O Module AXX10GBNIAIOM
Single port QSFP FDR56 GT/S speed InfiniBand* module
Intel®I/O Module AXX1FDRIBIOM
Dual port QSFP FDR56 GT/S speed infiniband* module
Intel®I/O Module AXX2FDRIBIOM
Single port QSFP+ 40 GbEmodule
Intel®I/O Module AXX1P40FRTIOM
Dual port QSFP+ 40 GbEmodule
Intel®I/O Module AXX2P40FRTIOM
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9. Basic and Advanced Server Management Features
The integrated BMC has support for basic and advanced server management features. Basic
management features are available by default. Advanced management features are enabled with
the addition of an optionally installed Remote Management Module 4 Lite (RMM 4 Lite) key.
BEFORE YOU BEGIN
WARNING: Before working with your server product, observe the safety and ESD
precautions found in the Warnings section at the beginning of this manual.
Table 59. Intel® Remote Management Module 4 (RMM4) Options
Intel Product
Description
Kit Contents
Benefits
Code
Intel®Remote Management Module 4
AXXRMM4LITE
RMM4 Lite Activation Key Enables KVM & media redirection
Lite
When the BMC FW initializes, it attempts to access the Intel®RMM4 lite. If the attempt to access
Intel®RMM4 lite is successful, then the BMC activates the Advanced features.
The following table identifies both Basic and Advanced server management feature s.
Table 60. Basic and Advanced Server Management Features Overview
Feature
Basic
Advanced
w/RMM4
Lite Key
IPMI 2.0 Feature Support
X
X
In-circuit BMCFirmware Update
X
X
FRB 2
X
X
Chassis Intrusion Detection
X
X
Fan Redundancy Monitoring
X
X
Hot-Swap Fan Support
X
X
Acoustic Management
X
X
Diagnostic Beep Code Support
X
X
Power State Retention
X
X
ARP/DHCP Support
X
X
PECI Thermal Management Support
X
X
E-mail Alerting
X
X
Embedded Web Server
X
X
SSH Support
X
X
Integrated KVM
X
Integrated Remote Media Redirection
X
Lightweight Directory Access Protocol (
LDAP)
Intel®Intelligent Power Node Manager
Support
SMASH CLP
X
X
X
X
X
X
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On the server board the Intel®RMM4 Lite key is installed at the following location.
Figure 71. Intel® RMM4 Lite Activation Key Installation
Figure 72. Replacing the Backup Battery
A:Gently press the metal clip as shown to release the battery
B:Remove the battery from the plastic socket
WARNING: RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT
TYPE.DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS.
9.1.1
Dedicated Management Port
The server board includes a dedicated 1GbE RJ45 Management Port. The management port is
active with or without the RMM4 Lite key installed.
9.1.2
Embedded Web Server
BMC Base manageability provides an embedded web server and an OEM-customizable web GUI
which exposes the manageability features of the BMC base feature set. It is supported over all
on-board NICs that have management connectivity to the BMC as well as an optional dedicated
add-in management NIC. At least two concurrent web sessions from up to two dif ferent users is
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supported. The embedded web user interface shall support the following client web browsers:

Microsoft Internet Explorer 9.0*

Microsoft Internet Explorer 10.0*

Mozilla Firefox 24*

Mozilla Firefox 25*
The embedded web user interface supports strong security (authentication, encryption, and firewall
support) since it enables remote server configuration and control. The user interface presented by
the embedded web user interface, shall authenticate the user before allowing a web session to be
initiated. Encryption using 128-bit SSL is supported. User authentication is based on user id and
password.
The GUI presented by the embedded web server authenticates the user before allowing a web
session to be initiated. It presents all functions to all users but grays-out those functions that the
user does not have privilege to execute. For example, if a user does not have privilege to power
control, then the item shall be displayed in grey-out font in that user’s UI display. The web GUI also
provides a launch point for some of the advanced features, such as KVM and media redirection.
These features are grayed out in the GUI unless the system has been updated to support these
advanced features. The embedded web server only displays US English or Chinese l anguage
output.
Additional features supported by the web GUI includes:

Presents all the Basic features to the users

Power on/off/reset the server and view current power state

Displays BIOS, BMC, MEand SDRversion information

Display overall system health.

Configuration of various IPMI over LAN parameters for both IPV4 and IPV6

Configuration of alerting (SNMP and SMTP)

Display system asset information for the product, board, and chassis.

Display of BMC-owned sensors (name, status, current reading, enabled thresholds),
including color-code status of sensors.

Provides ability to filter sensors based on sensor type (Voltage, Temperature, Fan and
Power supply related)

Automatic refresh of sensor data with a configurable refresh rate

On-line help

Display/clear SEL (display is in easily understandable human readable format)

Supports major industry-standard browsers (Microsoft Internet Explorer* and Mozilla
Firefox*)

The GUI session automatically times-out after a user-configurable inactivity period. By
default, this inactivity period is 30 minutes.

Embedded Platform Debug feature - Allow the user to initiate a “debug dump” to a file that
can be sent to Intel for debug purposes.

Virtual Front Panel. The Virtual Front Panel provides the same functionality as the local
front panel.The displayed LEDs match the current state of the local panel LEDs. The
displayed buttons (for example, power button) can be used in the same manner as the
local buttons.

Display of ME sensor data. Only sensors that have associated SDRs loaded will be
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RM237 Series and RB237 Series TPS
displayed.

Ability to save the SEL to a file

Ability to force HTTPS connectivity for greater security. This is provided through a
configuration option in the UI.

Display of processor and memory information as is available over IPMI over LAN.

Ability to get and set Node Manager (NM) power policies

Display of power consumed by the server

Ability to view and configure VLAN settings

Warn user the reconfiguration of IP address will cause disconnect.

Capability to block logins for a period of time after several consecutive failed login
attempts. The lock-out period and the number of failed logins that initiates the lock -out
period are configurable by the user.



Server Power Control – Ability to force into Setup on a reset
System POST results – The web server provides the system’s Power-On Self-Test (POST)
sequence for the previous two boot cycles, including timestamps. The timestamps may be
viewed in relative to the start of POST or the previous POST code.
Customizable ports – The web server provides the ability to customize the port numbers
used for SMASH, http, https, KVM, secure KVM, remote media, and secure remote media.
For additional information, reference the Intel®Remote Management Module 4 and Integrated BMC
Web Console Users Guide.
9.1.3
Advanced Management Feature Support (RMM4 Lite)
The integrated baseboard management controller has support for advanced management features
which are enabled when an optional Intel®Remote Management Module 4 Lite (RMM4 Lite) is
installed. The Intel RMM4 add-on offers convenient, remote KVM access and control through LAN
and internet. It captures, digitizes, and compresses video and transmits it with keyboard and mouse
signals to and from a remote computer. Remote access and control software runs in the integrated
baseboard management controller, utilizing expanded capabilities enabled by the Intel RMM4
hardware.
Key Features of the RMM4 add-on are:



KVM redirection from either the dedicated management NIC or the server board NICs used
for management traffic; up to two KVM sessions
Media Redirection – The media redirection feature is intended to allow system
administrators orusers to mount a remote IDE or USB CDROM, floppy drive, or a USB
flash disk as a remote device to the server. Once mounted, the remote device appears just
like a local device to the server allowing system administrators or users to install software
(including operating systems), copy files, update BIOS, or boot the server from this device.
KVM – Automatically senses video resolution for best possible screen capture, high
performancemouse tracking and synchronization. It allows remote viewing and
configuration in pre-boot POST and BIOS setup.
9.1.3.1 Keyboard, Video, Mouse (KVM) Redirection
The BMC firmware supports keyboard, video, and mouse redirection (KVM) over LAN. This feature
is available remotely from the embedded web server as a Java applet. This feature is only enabled
when the Intel®RMM4 lite is present. The client system must have a Java Runtime Environment
(JRE) version 6.0 or later to run the KVM or media redirection applets.
The BMC supports an embedded KVM application (Remote Console) that can be launched f rom the
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embedded web server from a remote console. USB1.1 or USB 2.0 based mouse and keyboard
redirection are supported. It is also possible to use the KVM-redirection (KVM-r) session
concurrently with media-redirection (media-r). This feature allows a user to interactively use the
keyboard, video, and mouse (KVM) functions of the remote server as if the user were physically at
the managed server. KVM redirection console supports the following keyboard layouts: English,
Dutch, French, German, Italian, Russian, and Spanish.
KVM redirection includes a “soft keyboard” function. The “soft keyboard” is used to simulate an
entire keyboard that is connected to the remote system. The “soft keyboard” functionality supports
the following layouts: English, Dutch, French, German, Italian, Russian, and Spanish.
The KVM-redirection feature automatically senses video resolution for best possible screen capture
and provides high-performance mouse tracking and synchronization. It allows remote viewing and
configuration in pre-boot POST and BIOS setup, once BIOS has initialized video.
Other attributes of this feature include:

Encryption of the redirected screen, keyboard, and mouse

Compression of the redirected screen.

Ability to select a mouse configuration based on the OS type.

Supports user definable keyboard macros.
KVM redirection feature supports the following resolutions and refresh rates:

640x480 at 60Hz, 72Hz, 75Hz, 85Hz, 100Hz

800x600 at 60Hz, 72Hz, 75Hz, 85Hz

1024x768 at 60Hx, 72Hz, 75Hz, 85Hz

1280x960 at 60Hz

1280x1024 at 60Hz

1600x1200 at 60Hz

1920x1080 (1080p),

1920x1200 (WUXGA)

1650x1080 (WSXGA+)
9.1.3.2 Remote Console
The Remote Console is the redirected screen, keyboard and mouse of the remote host system. To
use the Remote Console window of your managed host system, the browser must include a Java*
Runtime Environment plug-in. If the browser has no Java support, such as with a small handheld
device, the user can maintain the remote host system using the administration forms displayed by
the browser.
The Remote Console window is a Java Applet that establishes TCP connections to the BMC. The
protocol that is run over these connections is a unique KVM protocol and not HTTP or HTTPS. This
protocol uses ports #7578 for KVM, #5120 for CDROM media redirection, and #5123 f or
Floppy/USB media redirection. When encryption is enabled, the protocol uses ports #7582 for KVM,
#5124 for CDROM media redirection, and #5127 for Floppy/USB media redirection. The local
network environment must permit these connections to be made, that is, the firewall and, in case of
a private internal network, the NAT (Network Address Translation) settings have to be configured
accordingly.
9.1.3.3 Performance
The remote display accurately represents the local display. The feature adapts to changes to the
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video resolution of the local display and continues to work smoothly when the system transitions
from graphics to text or vice-versa. The responsiveness may be slightly delayed depending on the
bandwidth and latency of the network.
Enabling KVM and/or media encryption will degrade performance. Enabling video compression
provides the fastest response while disabling compression provides better video quality.
For the best possible KVM performance, a 2Mb/sec link or higher is recommended.
The redirection of KVM over IP is performed in parallel with the local KVM without affecting the
local KVM operation.
9.1.3.4 Security
The KVM redirection feature supports multiple encryption algorithms, including RC4 and AES. The
actual algorithm that is used is negotiated with the client based on the client’s capabilities.
9.1.3.5 Availability
The remote KVM session is available even when the server is powered-off (in stand-by mode). No
re-start of the remote KVM session shall be required during a server reset or power on/off. A BMC
reset (for example, due to a BMC Watchdog initiated reset or BMC reset after BMC FW update) will
require the session to be re- established.
KVM sessions persist across system reset, but not across an AC power loss.
9.1.3.6 Usage
As the server is powered up, the remote KVM session displays the complete BIOS boot process.
The user is able interact with BIOS setup, change and save settings as well as enter and interact
with option ROM configuration screens.
At least two concurrent remote KVM sessions are supported. It is possible for at least two different
users to connect to same server and start remote KVM sessions.
9.1.3.7 Force-enter BIOS Setup
KVM redirection can present an option to force-enter BIOS Setup. This enables the system to enter
F2 setup while booting which is often missed by the time the remote console redirects the video.
9.1.3.8 Media Redirection
The embedded web server provides a Java applet to enable remote media redirection. This may be
used in conjunction with the remote KVM feature, or as a standalone applet.
The media redirection feature is intended to allow system administrators or users to mount a remote
IDE or USB CD-ROM, floppy drive, or a USB flash disk as a remote device to the server. Once
mounted, the remote device appears just like a local device to the serve r, allowing system
administrators or users to install software (including operating systems), copy files, update BIOS,
and so on, or boot the server from this device.
TPS The following capabilities are supported:

The operation of remotely mounted devices is independent of the local devices on the
server. Both remote and local devices are useable in parallel.

Either IDE (CD-ROM, floppy) or USB devices can be mounted as a remote device to the
server.

It is possible to boot all supported operating systems from the remotely mounted device
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





and to boot from disk IMAGE (*.IMG) and CD-ROM or DVD-ROM ISO files. See the
Tested/supported Operating System List (Table 3) for more information.
Media redirection supports redirection for both a virtual CD device and a virtual
Floppy/USB device concurrently. The CD device may be either a local CD drive or else an
ISO image file; the Floppy/USB device may be a local Floppy drive, a local USB device, or
a disk image file.
The media redirection feature supports multiple encryption algorithms, including RC4 and
AES. The actual algorithm that is used is negotiated with the client based on the client’s
capabilities.
A remote media session is maintained even when the server is powered-off (in standby
mode). No restart of the remote media session is required during a server reset or power
on/off. An BMC reset (for example, due to an BMC reset after BMC FW update) will require
the session to be re-established
The mounted device is visible to (and useable by) managed system’s OS and BIOS in both
pre-boot and post-boot states.
The mounted device shows up in the BIOS boot order and it is possible to change the BIOS
boot order to boot from this remote device.
It is possible to install an operating system on a bare metal server (no OS present) using
the remotely mounted device. This may also require the use of KVM-r to configure the OS
during install.
USB storage devices will appear as floppy disks over media redirection. This allows for the
installation of device drivers during OS installation.
If either a virtual IDE or virtual floppy device is remotely attached during system boot, both the
virtual IDE and virtual floppy are presented as bootable devices. It is not possible to present only a
single-mounted device type to the system BIOS.
Availability
The default inactivity timeout is 30 minutes and is not user -configurable. Media redirection sessions
persist across system reset but not across an AC power loss or BMC reset.
Network Port Usage
The KVM and media redirection features use the following ports:

5120 – CD Redirection

5123 – FD Redirection

5124 – CD Redirection (Secure)

5127 – FD Redirection (Secure)

7578 – Video Redirection

7582 – Video Redirection (Secure)
For additional information, reference the Intel®Remote Management Module 4 and Integrated
BMC Web Console Users Guide.
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Appendix A: Integration and Usage Tips
This section provides a list of useful information that is unique to the Chenbro RM23708/12/24 and
should be kept in mind while configuring your server system.

When adding or removing components or peripherals, power cords must be disconnected
from the server. With power applied to the server, standby voltages are still present even
though the server board is powered off.

This server board supports the Intel®Xeon®Processor E5-2600 v3 product family with a
Thermal Design Power (TDP) of up to and including 145 Watts. Previous generations of
the Intel®Xeon® processors are not supported. Server systems using this server board
may or may not meet the TDP design limits of the server board. Validate the TDP limits of
the server system before selecting a processor.

Processors must be installed in order. CPU 1 must be populated for the server board
to operate Riser Slots #2 and #3 are only supported in dual processor configurations

The riser card slots are specifically designed to support riser cards only. Attempting to
install a PCIe* add-in card directly into a riser card slot on the server board may da mage
the server board, the add- in card, or both.

This server board only supports DDR4 ECC RDIMM – Registered (Buffered) DIMMS and
DDR4 ECC LRDIMM – Load Reduced DIMMs

For the best performance, the number of DDR4 DIMMs installed should be balanced
across both processor sockets and memory channels

On the back edge of the server board are eight diagnostic LEDs that display a sequence of
amber POST codes during the boot process. If the server board hangs during POST, the
LEDs display the last POST event run before the hang.

The System Status LED will be set to a steady Amber color for all Fatal Errors that are
detected during processor initialization. A steady Amber System Status LED indicates that
an unrecoverable system failure condition has occurred

The FRUSDRutility must be run as part of the initial platform integration process before it is
deployed into a live operating environment. Once the initial FRU and SDRdata is loaded on
to the system, all subsequent system configuration changes will automatically update
SDRdata using the BMC auto configuration feature, without having to run the
FRUSDRutility again. However, to ensure the latest sensor data is installed, the SDRdata
should be updated to the latest available as part of a planned system software update.

Make sure the latest system software is loaded on the server.This includes System BIOS,
BMC Firmware, ME Firmware and FRUSDR. The latest system software can be
downloaded from WWW.Chenbro.com
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RM237 Series and RB237 Series TPS
Appendix B: POST Code Diagnostic LED Decoder
As an aid to assist in trouble shooting a system hang that occurs during a system’s Power-On
Self-est (POST) process, the server board includes a bank of eight POST Code Diagnostic LEDs on
the back edge of the server board.
During the system boot process, Memory Reference Code (MRC) and System BIOS execute a
number of memory initialization and platform configuration processes, each of which is assigned a
specific hex POST code number. As each routine is started, the given POST code number is
displayed to the POST Code Diagnostic LEDs on the back edge of the se rver board.
During a POST system hang, the displayed post code can be used to identify the last POST
routine that was run prior to the error occurring, helping to isolate the possible cause of the hang
condition.
Each POST code is represented by eight LEDs; four Green and four Amber. The POST codes are
divided into two groups, an upper nibble and a lower nibble. The upper nibble bits are represented
by Amber Diagnostic LEDs #4, #5, #6, #7. The lower nibble bits are represented by Green
Diagnostics LEDs #0, #1, #2 and #3. If the bit is set in the upper and lower nibbles, the
corresponding LED is lit. If the bit is clear, the corresponding LED is off.
Figure 73. POST Diagnostic LED Location
In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder.
The LEDs are decoded as follows:
Table 61.POST Progress Code LED Example
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RM237 Series and RB237 Series TPS
Note: Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are concatenated
as ACh
Early POST Memory Initialization MRC Diagnostic Codes
Memory Initialization at the beginning of POST includes multiple functions, including: discovery,
channel training, validation that the DIMM population is acceptable and functional, initialization of
the IMC and other hardware settings, and initialization of applicable RAS configurations.
The MRC Progress Codes are displays to the Diagnostic LEDs that show the execution point in
the MRC operational path at each step.
Table 62.MRC Progress Codes
Should a major memory initialization error occur, preventing the system from booting with data integrity,
a beep code is generated, the MRC will display a fatal error code on the diagnostic LEDs, and a system
halt command is executed. Fatal MRC error halts do NOT change the state of the System Status LED, and
they do NOT get logged as SEL events. The following table lists all MRC fatal errors that are displayed to
the Diagnostic LEDs.
NOTE: Fatal MRC errors will display POST error codes that may be the same as BIOS POST progress
codes displayed later in the POST process. The fatal MRC codes can be distinguished from the BIOS
POST progress codes by the accompanying memory failure beep code of 3 long beeps as identified in
Table 57.
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RM237 Series and RB237 Series TPS
Table 63.MRC Fatal Error Codes
BIOS POST Progress Codes
The following table provides a list of all POST progress codes.
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RM237 Series and RB237 Series TPS
Table 64.Diagnostic LED POST Code Decoder
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RM237 Series and RB237 Series TPS
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RM237 Series and RB237 Series TPS
Appendix C: POST Code Errors
Most error conditions encountered during POST are reported using POST Error Codes. These
codes represent specific failures, warnings, or are informational. POST Error Codes may be
displayed in the Error Manager Display screen, and are always logged to the System Event Log
(SEL). Logged events are available to System Management applications, including Remote and
Out of Band (OOB) management.
There are exception cases in early initialization where system resources are not adequately
initialized for handling POST Error Code reporting. These cases are primarily Fatal Error conditions
resulting from initialization of processors and memory, and they are handed by a Diagnostic LED
display with a system halt.
The following table lists the supported POST Error Codes. Each error code is assigned an error
type which determines the action the BIOS will take when the error is encountered. Error types
include Minor, Major, and Fatal. The BIOS action for each is defined as follows:
 Minor: The error message is displayed on the screen or on the Error Manager screen, and an
error is logged to the SEL. The system continues booting in a degraded state. The user may
want to replace the erroneous unit. The POST Error Pause option setting in the BIOS setup
does not have any effect on this error.
 Major: The error message is displayed on the Error Manager screen, and an error is logged to
the SEL. The POST Error Pause option setting in the BIOS setup determines whether the
system pauses to the Error Manager for this type of error so the user can take immediate
corrective action or the system continues booting.
Note that for 0048 “Password check failed”, the system halts, and then after the next
reset/reboot will displays the error code on the Error Manager screen.
 Fatal: The system halts during post at a blank screen with the text “Unrecoverable fatal error
found.System will not boot until the error is resolved” and “Press <F2> to enter
setup” The POST Error Pause option setting in the BIOS setup does not have any effect
with this class of error.
When the operator presses the F2 key on the keyboard, the error message is displayed on the Error
Manager screen, and an error is logged to the SEL with the error code. The system cannot boot
unless the error is resolved. The user needs to replace the faulty part and restart the system.
NOTE: The POST error codes in the following table are common to all current generation Intel
server platforms. Features present on a given server board/system will determine which of the listed
error codes are supported
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RM237 Series and RB237 Series TPS
Table 65.POST Error Messages and Handling
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RM237 Series and RB237 Series TPS
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RM237 Series and RB237 Series TPS
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POST Error Beep Codes
The following table lists the POST error beep codes. Prior to system video initialization, the BIOS
uses these beep codes to inform users on error conditions. The beep code is followed by a
user-visible code on the POST Progress LEDs.
Table 66.POST Error Beep Codes
The Integrated BMC may generate beep codes upon detection of failure conditions. Beep codes
are sounded each time the problem is discovered, such as on each power -up attempt, but are not
sounded continuously. Codes that are common across all Intel server boards and systems that use
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RM237 Series and RB237 Series TPS
same generation chipset are listed in the following table. Each digit in the code is represented by a
sequence of beeps whose count is equal to the digit.
Table 67.Integrated BMC Beep Codes
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RM237 Series and RB237 Series TPS
Appendix D: System Cable Routing Diagram
Picture is being prepared
108
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