MP5414
PMU for 3D Glasses
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The MP5414 is a highly-efficient fully-integrated
PMU with a current-mode step-up converter,
four single-pole/double-throw switches, low
drop-out, and a battery charger designed for
battery-powered supply applications.
BOOST
• 1.8V Low Voltage Start-Up
• 1.8V to 5.5V Input Range
• Output Disconnect
• Integrated Power MOSFET and Schottky
Diode
• Variable Frequency Control
• <1μA Shutdown Current
• Current Mode Control with Internal
Compensation
• Inrush Current Limiting and Internal SoftStart
• Input Under-Voltage Lockout
The step-up converter can start-up from an
input voltage as low as 1.8V. It uses a currentlimited variable-frequency control algorithm to
optimize efficiency and minimize external
component size and cost. The internal lowresistance N-Channel MOSFET switch can
withstand up to 10V, allowing the MP5414 to
produce a high output voltage with high
efficiency from a dual-cell NiCd/NiMH or singlecell Li-ion battery. In addition, the step-up
converter can disconnect all loads from the
input DC power supply.
The charger features constant-current and
constant-voltage charging modes with a
programmable charge current (50mA to
300mA), trickle-charge capability, and a chargestatus indicator. Charging is enabled with an
input voltage greater than 3.5V, and is disabled
when unplugged from the AC adaptor. The
charger does not need an external reverseblocking diode.
The low-dropout linear regulator operates with
low noise from a 2.7V-to-6.5V input voltage,
and regulates the output voltage with 2%
accuracy from 1.25V to 5V.
The MP5414 is available in a 4mm x 5mm 28pin QFN package.
CHARGER
• 0.75% VBATT Accuracy
• Low Reverse-Battery Current (< 1µA)
• Programmable Charge Current
• Charge Status Indication
• No External Sense Resistor
• No External Reverse Blocking Diode
LINEAR REGULATOR
• Low 100mV Dropout at 100mA Output
• Programmable Output Voltage with 2%
Accuracy
• Up to 6.5V Input Voltage
• High PSRR: 70dB at 1kHz
• Better Than 0.001%/mA Load Regulation
• Stable With Low-ESR Output Capacitor
APPLICATIONS
•
•
•
•
•
2-Cell and 3-Cell NiCd/NiMH or Single-cell
Li-Ion Battery Consumer Products
3D Glass Driver
Small LCD Displays Bias Supply
Digital Still and Video Cameras
Smartphones, Netbooks, and Handheld
Video Game Consoles
All MPS parts are lead-free and adhere to the RoHS directive. For MPS green
status, please visit MPS website under Quality Assurance. “MPS” and “The
Future of Analog IC Technology” are Registered Trademarks of Monolithic
Power Systems, Inc.
MP5414 Rev.1.12
12/13/2012
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© 2012 MPS. All Rights Reserved.
1
MP5414—PMU FOR 3D GLASSES
TYPICAL APPLICATION
MP5414 Rev.1.12
12/13/2012
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2
MP5414—PMU FOR 3D GLASSES
ORDERING INFORMATION
Part Number*
Package
Top Marking
MP5414DV
QFN28 (4x5mm)
MP5414
* For Tape & Reel, add suffix –Z (e.g. MP5414DV–Z);
For RoHS Compliant Packaging, add suffix –LF (e.g. MP5414DV–LF–Z)
PACKAGE REFERENCE
MP5414 Rev.1.12
12/13/2012
S3
D
C
B
A
S0
TOP VIEW
28
27
26
25
24
23
21
BSTEN
BSTISET
3
20
BSTL
BSTGND
4
19
BSTIN
BATT
5
18
BSTOUT
IPGM
6
17
BSTSW
CHGGND
7
16
LDOFB
CHGIN
8
15
LDOOUT
9
10
11
12
13
14
LDOOUT
2
LDOGND
BSTFB
LDOIN
S1
LDOEN
22
CHGZ
1
CHGGND
S2
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3
MP5414—PMU FOR 3D GLASSES
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
BSTSW, A, B, C, D to BSTGND ...-0.5V to +12V
CHGIN to CHGGND .....................-0.3V to +25V
LDOIN to LDOGND......................-0.3V to +7.0V
LDOFB to LDOGND.... -0.3V to (VLDOOUT + 0.3V)
All other Pins................................-0.3V to +6.0V
Continuous Power Dissipation (TA = 25°C) (2)
............................................................ 3.1 W
Junction Temperature ...............................140°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
QFN28 (4x5mm) ....................40 ....... 9 .... °C/W
Recommended Operating Conditions
(3)
(4)
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)TA)/ θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operation conditions.
4) Measured on JESD51-7 4-layer board.
VBSTIN .............................................1.8V to 5.5V
VBSTOUT .......................................... VBSTIN to 10V
VCHGIN .........................................4.75V to 5.25V
VLDOIN ..............................................2.7V to 6.5V
VLDOOUT .............................................1.25V to 5V
ILDOOUT .....................................250mA Maximum
Operating Junction Temp. (TJ). -40°C to +125°C
MP5414 Rev.1.12
12/13/2012
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4
MP5414—PMU FOR 3D GLASSES
ELECTRICAL CHARACTERISTICS
VBSTIN = 2.4V, VBSTOUT=10V, IBSTOUT=2mA, VCHGIN = VLDOIN = 5V, TA = 25°C, unless otherwise noted.
Parameters
Symbol
Step-Up Converter
Operating Input Voltage
Minimum Startup Voltage
VBSTIN
VBSTST
Quiescent Current
IBSTQ_NS
Shutdown Current
IN Under Voltage Lockout
Under Voltage Lockout
Hysteresis
Maximum On Time
Minimum Off Time
SW On-Resistance
SW Leakage Current
SW Current Limit
Schottky Diode Forward
Voltage
IBSTSD
VBSTUVLO
Fixed OUT Supply Voltage
VBSTFW
VBSTOUT_FD
FB Input Bias Current
Output Disconnect Switch OnResistance
Thermal Shutdown
Charger
Supply Current from VIN
Input UVLO
Battery Reverse Current to
BATT Pin
Battery Voltage Regulation
IBSTFB
MP5414 Rev.1.12
12/13/2012
Typ
Max
Units
5.5
1.8
V
V
28
50
µA
0.1
1.58
1
1.7
µA
V
1.8
VBSTOUT=0V
IBSTOUT=0, VBSTFB=1.3V,
No switching
VBSTEN=0V
VBSTIN Rising
TBSTON
TBSTOFF
RBSTDS_ON IBSTSW = 200mA
IBSTSW_LKG VBSTSW=12V
IBSTSW_LIMIT RBSTISET=300kΩ
VBSTFB
Trickle Current
Trickle Threshold Voltage
Trickle Voltage Hysteresis
CHGZ Low-to-High Threshold
CHGZ Sink Current
Min
100
FB Voltage (Regulation Mode)
Constant Current Regulation
Condition
RDISC_ON
ISUPPLY
IBSTFW=100mA
Let BSTFB pin floating,
1.8V<VBSTIN<5.5V
Connect R-divider to BSTFB,
1.8V<VBSTIN<5.5V
VBSTFB = 1.23V
4
400
ICHG
TA = 0°C to +50°C, ICHG = 5mA
VCHGIN = 5V, VBATT = 3.8V
RPGM = 1.6kΩ
VCHGIN = 5V, VBATT = 3.8V,
RPGM = 1.5kΩ – 7.2kΩ,
-40°C < TA < +85°C
VCHGIN = 5V, VBATT = 2.3V
VBATT Rising
Pin Voltage = 0.2 V
µs
ns
Ω
µA
mA
0.4
0.5
0.6
V
9.7
10
10.3
V
1.20
1.23
1.26
V
1
µA
0.8
Ω
0.7
1.8
150
°C
0.5
2.3
2.8
mA
V
2
µA
Input=GND or float, VBAT=4V
VBATT
7.5
700
0.8
2
180
VBSTOUT=10V
ICHG = 0A,
Input falling
6
550
0.73
mV
4.16
4.20
4.24
V
225
250
275
mA
90
100
110
%ICHG
5
2.45
10
2.6
190
10
15
2.75
5
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(5)
%ICHG
V
mV
%ICHG
mA
5
MP5414—PMU FOR 3D GLASSES
ELECTRICAL CHARACTERISTICS (continued)
VBSTIN = 2.4V, VBSTOUT=10V, IBSTOUT=2mA, VCHGIN = VLDOIN = 5V, TA = 25°C, unless otherwise noted.
Parameters
Symbol
Condition
Dropout Voltage
VCHGINVBATT
VBATT = 3.8V, ICHG = 150mA,
Current drop 10%
VBATT = 4.25V
Overcharge Protection
Thermal Limit (6)
LDO
Operating Voltage
Ground Pin Current
Shutdown Current
Dropout Voltage (7)
Output Voltage Noise
Line Regulation
Load Regulation
PSRR
MP5414 Rev.1.12
12/13/2012
Typ
Max
0.25
0
ILDOOUT = 1mA
ILDOOUT = 1mA–250mA
VLDOEN = 0V, VLDOIN = 5V
2.7
6.5
125
155
0.1
1
1.197 1.222 1.246
-40°C ≤ TA ≤ +85°C
VLDOOUT = 3V, ILDOOUT = 150mA
VLDOOUT = 4V, ILDOOUT = 150mA
f = 1kHz, CLDOFB > 0.1μF,
ILDOOUT = 1mA
ILDOOUT = 1mA,
VLDOIN = (VLDOOUT + 0.5V) to 6.5V (8)
ILDOOUT = 1mA to 150mA,
VLDOIN = VLDOOUT + 0.5V (8)
VLDOIN > VLDOOUT +0.5V,
CLDOOUT = 2.2μF,
VLDOIN(AC) = 100mV, f = 1kHz
VLDOIN > VLDOOUT + 0.5V,
CLDOOUT = 2.2μF,
VLDOIN(AC) = 100mV, f = 1MHz
1.194 1.222 1.249
VBSTEN_H
VBSTEN_L
IBSTEN
μA
°C
V
μA
μA
V
150
125
mV
300
nV/√
Hz
0.005
%/V
0.001
%/mA
70
dB
30
dB
0.01
155
30
V
V
μA
°C
°C
1.5
VLDOEN = 0V, 5V
Units
V
130
FB Regulation Voltage
LDOEN Input High Voltage
LDOEN Input Low Voltage
LDOEN Input Bias Current
Thermal Protection
Thermal Protection Hysteresis
Control Interface
BSTEN/SX Input High Voltage
BSTEN/SX Input Low Voltage
BSTEN/SX Input Bias Current
Min
0.4
1
1.4
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0.4
1
V
V
µA
6
MP5414—PMU FOR 3D GLASSES
ELECTRICAL CHARACTERISTICS (continued)
VBSTIN = 2.4V, VBSTOUT=10V, IBSTOUT=2mA, VCHGIN = VLDOIN = 5V, TA = 25°C, unless otherwise noted.
Parameters
SPDT Switch
Switch On-Resistance
Switch On-Resistance Match
Between Channels
Turn-on Time
Turn-off Time
Protection
Output Disconnect Switch OnResistance
Thermal Shutdown
Symbol
Condition
RSPDT_ON
VBSTOUT=10V, IA, IB, IC, ID=2mA
∆RSPDT_ON
VBSTOUT=10V, IA, IB, IC, ID=2mA
TON
TOFF
RDISC_ON
Min
Typ
Max
Units
25
50
Ω
10
Ω
RL= 300Ω, CL= 35pF
RL= 300Ω, CL= 35pF
80
170
VBSTOUT=10V
0.74
150
ns
ns
0.8
Ω
°C
Notes:
5) ICHG is the target preprogrammed charge current (Die temperature below 110°C).
6) Guarantee by design
7) Dropout Voltage is defined as the input to output differential when the output voltage drops 1% below its normal value
8) VLDOIN = 2.7V for VLDOOUT = 1.25V to 2.2V.
MP5414 Rev.1.12
12/13/2012
www.MonolithicPower.com
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7
MP5414—PMU FOR 3D GLASSES
TYPICAL PERFORMANCE CHARACTERISTICS
Step-Up Converter
VBSTIN = VBSTEN = 2.4V, VBSTOUT = 10V, IBSTOUT = 2mA, L1 = 10µH/150mΩ, unless otherwise noted.
MP5414 Rev.1.12
12/13/2012
www.MonolithicPower.com
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© 2012 MPS. All Rights Reserved.
8
MP5414—PMU FOR 3D GLASSES
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Charger
VCHGIN = 5V, C3 = C5 = 1µF, TA = 25°C, unless otherwise noted.
Battery Charge Curve
4.9
0.30
VBATT
4.2
0.25
3.5
0.20
2.8
IBATT
VSTATUS
0.15
2.1
0.10
1.4
0.05
0.7
0.00
0
20
40
60
0.0
80
100
4.30
0.30
4.26
0.24
4.22
0.18
4.18
0.12
4.14
0.06
0.00
Charge Current vs.
Battery Voltage
CHARGE CURRENT (A)
Battery Voltage vs.
Input Voltage
0.36
CHARGE CURRENT (A)
0.35
CHARGE CURRENT (A)
Charge Current vs.
Battery Votlage
0
0.9
1.8
2.7
3.6
4.5
4.10
4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0
Charge Current vs.
Input Voltage
0.36
350
8
0.30
300
7
6
250
0.24
5
200
0.18
4
150
0.12
0.06
0.00
2.9
3.1
3.3
3.5
3.7
3.9
4.1
2
50
1
4.5
6.0
7.5
9.0
0.75
0.65
0.5
152
0.6
148
0.55
0.4
0.5
0.3
144
0.45
0.2
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
MP5414 Rev.1.12
12/13/2012
50 100 150 200 250 300 350 400
156
0.7
0.6
0
160
0.8
0.7
0
Charge Current vs.
Temperature
Reverse Current vs.
Battery Votlage
Forward Leakage Current
0.8
3
100
0
Charge Current vs.
RPGM Resistance
0.4
2.5
2.8
3.1
3.4
3.7
4
4.3
140
-50
-25
0
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25
50
75
9
MP5414—PMU FOR 3D GLASSES
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Charger
VCHGIN = 5V, C3 = C5 = 1µF, TA = 25°C, unless otherwise noted.
MP5414 Rev.1.12
12/13/2012
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10
MP5414—PMU FOR 3D GLASSES
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
LDO
VLDOIN = 4.5V, VLDOOUT = 2.85V, C4 = 1μF, CBYP = 0.1μF, C6 = 2.2μF, TA = 25°C, unless otherwise
noted.
MP5414 Rev.1.12
12/13/2012
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11
MP5414—PMU FOR 3D GLASSES
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
SPDT Switch
VBSTIN = VBSTEN = 2.4V, VBSTOUT = 10V, IBSTOUT = 2mA, L1 = 10µH/150mΩ, unless otherwise noted.
MP5414 Rev.1.12
12/13/2012
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12
MP5414—PMU FOR 3D GLASSES
PIN FUNCTIONS
Pin #
Name
1
S2
2
BSTFB
3
BSTISET
4
BSTGND
5
BATT
6
7, 9
8
10
11
12
13
Pin Function
C-Channel SPDT Switch Control Input. If the chip is enabled, a logic low input switches C to
GND and a logic high input switches C to BSTOUT. Do not leave this pin floating.
Step-Up Converter Regulator Feedback. Connect to the tap of an external resistor divider
from the output to BSTFB to set the boost converter output voltage. Float this pin to achieve
fixed 10V output.
Step-Up Converter Constant Peak Current Set. Connect to an external resistor to BSTGND
to set the boost converter peak current.
Step-Up Converter and SPDT Ground.
Charger Output.
Constant-Charge–Current Programmer. Connect to an external resistor to ground to
IPGM
program the charging current in constant-current mode. Do not connect a capacitor to this
pin.
CHGGND Charger Ground.
CHGIN
Charger Input Supply. CHGIN receives the AC adapter.
CHGZ
Open-Drain Charger Status Indicator.
Low Dropout Enabled. Drive LDOEN high to turn on the low dropout, drive LDOEN low to
LDOEN
turn it off. For automatic startup, connect LDOEN to LDOIN.
Low Dropout Power Source Input. LDOIN supplies the internal power to the low dropout and
LDOIN
is the source of the pass transistor. Bypass LDOIN to LDOGND with a 1μF or greater
capacitor.
LDOGND Low Dropout Ground.
14, 15
LDOOUT
16
LDOFB
17
BSTSW
18
BSTOUT
19
BSTIN
20
BSTL
21
BSTEN
22
S1
23
S0
MP5414 Rev.1.12
12/13/2012
Low Dropout Regulator Output. LDOOUT is the output of the linear regulator. Bypass
LDOOUT to LDOGND with a 1μF or greater capacitor.
Low Dropout Feedback Input. Connect a resistor divider from LDOOUT to LDOFB to set the
output voltage.
Step-Up Converter Output Switch Node. BSTSW is the drain node of the internal low-side NChannel MOSFET. Connect the inductor from BSTL to BSTSW to complete the step-up
converter.
Step-Up Converter Output.
Step-Up Converter and SPDT Input Supply. BSTIN pin powers the internal circuitry and is
the drain of the internal disconnecting N-channel MOSFET. Bypass locally.
Step-Up Converter Inductor Output. BSTL is the source/body of the internal N-channel
MOSFET, M3. Connect the inductor from this pin to BSTSW.
Step-Up Converter and SPDT On/Off Control Input. A logic high input turns the chip on.. Do
not leave this pin floating.
B-Channel SPDT Switch Control Input. If the chip is enabled, a logic low input switches B to
GND and a logic high input switches B to BSTOUT. Do not leave this pin floating.
A-Channel SPDT Switch Control Input. If the chip is enabled, a logic low input switches A to
GND and a logic high input switches A to BSTOUT. Do not leave this pin floating.
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13
MP5414—PMU FOR 3D GLASSES
PIN FUNCTIONS (continued)
Pin #
24
25
26
27
Name
A
B
C
D
28
S3
Exposed
Pad
MP5414 Rev.1.12
12/13/2012
Pin Function
A-Channel SPDT Switch Output.
B-Channel SPDT Switch Output.
C-Channel SPDT Switch Output.
D-Channel SPDT Switch Output.
D-Channel SPDT Switch Control Input. If the chip is enabled, a logic low input switches D to
GND and a logic high input switches D to BSTOUT. Do not leave this pin floating.
Connect exposed pad to ground plane in PCB for proper thermal performance.
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14
MP5414—PMU FOR 3D GLASSES
FUNCTIONAL BLOCK DIAGRAM
L1
C2
BSTL
M2
BSTIN
BSTSW
M3
Driver
Driver
BSTOUT
C1
R1
Regulator
BSTOUT
Step-up
Converter
Control
Logic
M1
Step-up Converter
Internal Power Supply
-
BSTGND
+
Current
Sensing AMP
Step-up & SPDT
Enable Control
Peak Current
Control
S0
S1
BSTISET
-
Control
Signal
EA
S2
+
BSTEN
R2
BSTFB
1.23V
S3
SPDT Control
BSTOUT
A
L+
B
L-
C
R+
D
R-
CHGIN
BATT
C3
VIN
C5
R
Battery
LDOIN
-
C4
+
LDOOUT
VLDOOUT
C6
CBYP
R3
R4
Bandgap
Reference
Battery
Charger
Control
LDOFB
CHGZ
CHGGND
RPGM
IPGM
LDOGND
LDOEN
Figure 1—Functional Block Diagram
MP5414 Rev.1.12
12/13/2012
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15
MP5414—PMU FOR 3D GLASSES
OPERATION
The MP5414 is a high-efficiency fully-integrated
PMU with a current-mode step-up converter, four
single-pole/double-throw (SPDT) switches, low
dropout (LDO), and a battery charger designed
for low-power battery-operated bias-supply
applications.
Step-Up Converter
Output Disconnection
The step-up converter integrates a disconnect
switch between the BSTIN and the BSTL pins.
The switch is composed of an NMOS and a
PMOS in parallel. The step-up converter can
disconnect all loads from input DC power supply
when the BSTEN pin is connected to ground.
Under Voltage Lockout
An under-voltage lockout (UVLO) function
prevents device startup for values of VBATT < 1.5V.
If VBSTIN falls below 1.5V during device operation
and battery discharge, the device automatically
enters the shutdown mode.
Step-Up Converter Start-Up
The converter undergoes the following steps
after first applying the input signal and followed
by the enable signal:
1. PMOS of the disconnect switch turns on,
2. Internal soft-start boosts step-up converter,
causing VBSTOUT to rise,
3. VBSTOUT drives the NMOS of the disconnect
switch when VBSTOUT reaches threshold.
Because the on-resistance of the NMOS is
smaller than that of PMOS, the NMOS shorts the
PMOS under normal operation to reduce
conduction loss.
The MP5414 offers both soft-start and inrush
current limiting during start-up and under normal
operation.
converter limits this inrush current by increasing
the current limit in three steps, rising from 0A to
ILIM/4 in 256 switching cycles, then ILIM/4 to ILIM/2
for the next 256 cycles, before rising to the full
current limit. The soft-start time varies greatly
with load current; output voltage, and input
voltage.
Variable Frequency
Constant-Peak–Current Operation
When the power MOSFET M1 is turned on, the
inductor current increases until it hits its current
limit. The power MOSFET then turns off for a set
minimum-off time. If the feedback pin is still lower
than the 1.23V internal reference at the end of
this minimum off time, the power MOSFET will
turn on again. Otherwise the step-up converter
waits until the voltage drops below the threshold
before turning on the MOSFET again. This
process allows for optimal use of the inductor
while minimizing the output ripple, reducing the
size of the output capacitor, and maintaining low
operating current.
Integrated Schottky Diode
A high switching frequency requires high-speed
rectification for optimum efficiency. The step-up
converter integrates a low-voltage–drop schottky
diode to reduce the number of external parts to
save critical board space.
Four SPDT Switches
The MP5414 includes four SPDT analog
switches, where pins S0 through S3 control the
switches, respectively. While the chip is enabled,
a logic-low input switches the corresponding
channel output to BSTGND. Conversely, a logichigh input switches the channel to BSTOUT.
Table 1 shows the control logic.
Soft-Start
The step-up converter implements a soft-start by
charging an internal capacitor with a very weak
current source. The voltage on this capacitor, in
turn, slowly ramps the peak inductor current limit
from zero to the setting value. The step-up
MP5414 Rev.1.12
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MP5414—PMU FOR 3D GLASSES
Table 1—Switching Selection Control Logic
Control Input
BSTEN
S0
S1
S2
S3
A
B
C
D
L
X
X
X
X
Open
Open
Open
Open
H
L
L
L
L
BSTGND
BSTGND
BSTGND
BSTGND
H
H
L
L
L
BSTOUT
BSTGND
BSTGND
BSTGND
H
L
H
L
L
BSTGND
BSTOUT
BSTGND
BSTGND
H
H
H
L
L
BSTOUT
BSTOUT
BSTGND
BSTGND
H
L
L
H
L
BSTGND
BSTGND
BSTOUT
BSTGND
H
H
L
H
L
BSTOUT
BSTGND
BSTOUT
BSTGND
H
L
H
H
L
BSTGND
BSTOUT
BSTOUT
BSTGND
H
H
H
H
L
BSTOUT
BSTOUT
BSTOUT
BSTGND
H
L
L
L
H
BSTGND
BSTGND
BSTGND
BSTOUT
H
H
L
L
H
BSTOUT
BSTGND
BSTGND
BSTOUT
H
L
H
L
H
BSTGND
BSTOUT
BSTGND
BSTOUT
H
H
H
L
H
BSTOUT
BSTOUT
BSTGND
BSTOUT
H
L
L
H
H
BSTGND
BSTGND
BSTOUT
BSTOUT
H
H
L
H
H
BSTOUT
BSTGND
BSTOUT
BSTOUT
H
L
H
H
H
BSTGND
BSTOUT
BSTOUT
BSTOUT
H
H
H
H
H
BSTOUT
BSTOUT
BSTOUT
BSTOUT
H: High Level
MP5414 Rev.1.12
12/13/2012
Switch Output
L: Low Level
X: Irrelevant
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MP5414—PMU FOR 3D GLASSES
VBATT
IBATT
Soft-Start
Time
VBATT
4.2V
ICHG
Thermal
Regulation
90% of ICHG
2.6V
IBATT
Trickle
Charging
CC
Mode
CV
Mode
Charge
End
Figure 2—Charger Typical Charging
Procedure
Programming of Charge Current and Battery
Full Current
Table 2—RPGM and ICHG Relationship
RPGM (kΩ)
7.210
5.555
4.010
3.742
2.497
1.873
1.492
1.249
1.080
ICHG (mA)
54.67
70.99
98.70
105.90
159.80
214.30
269.90
323.00
371.00
A resistor (RPGM) connecting the IPGM pin to
ground programs the charge current, ICHG. Table
2 and Figure 3 show the relationship between the
charge current and the value of the programming
resistor.
When the battery voltage falls below the tricklecharge threshold (2.6V), the charge current is
limited to 10% of the programmed value. After
the battery voltage reaches 2.6V, the charger
switches to constant-current (CC) mode using a
MP5414 Rev.1.12
12/13/2012
Charge Current vs
1/RPGM Resistance
400
350
300
250
200
150
100
50
0
10% of ICHG
Charge
Start
programmed current value, ICHG. Once the battery
voltage reaches 4.2V, the charger will operate in
the Constant Voltage (CV) mode until the battery
is fully charged.
CHARGE CURRENT (mA)
Charger
The charger is enabled when the input supply
voltage reaches 3.5V, the UVLO threshold, or the
battery voltage—whichever voltage is highest. An
internal 500kΩ pull-down resistor connects the
CHGIN and CHGGND pins. The charger
automatically switches between CC/CV charging
algorithms depending on the battery status.
Figure 2 shows a typical charging sequence.
0
0.2
0.4
0.6
0.8
1.0
Figure 3—Charge Current vs. 1/RPGM
Resistance
Charge Status (CHGZ)
The open-drain CHGZ pin monitors charge status
by connecting to VBATT through an LED, a resistor,
or both. The CHGZ pin signals the end-ofcharge—or battery full—when its voltage goes
from LOW to HIGH (i.e. the LED turns off), which
occurs when ICHG decreases to 10% of the
programmed value.
Thermal Protection
The charger automatically limits the die
temperature to 130°C by reducing the current to
prevent overheating. The current remains
continuous throughout.
LDO
The MP5414 has an integrated low-current, lownoise, high-PSRR, low-dropout linear regulator. It
is suitable for use in devices that require very low
noise power supplies and high-PSRR such as
PLL VCO supplies for mobile handsets and
802.11 PC Cards, as well as audio codecs and
microphones. The LDO uses a PMOS pass
element and features internal thermal shutdown.
An optional feed-forward capacitor CBYP between
LDOFB and LDOOUT pins for improves transient
response.
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MP5414—PMU FOR 3D GLASSES
APPLICATION INFORMATION
Components referenced below apply to
Typical Application Circuit on page 2.
For example, if R1=178kΩ and R2 = 24.9kΩ,
then VBSTOUT = 10V.
Setting the Step-Up Converter BSTSW
Current Limit
Selecting the Step-Up Converter Inductor
The resistor on the BSTISET pin sets the
BSTSW current limit. Figure 4 illustrates the
relationship of the BSTSW current limit vs. the
BSTISET resistor. In constant-peak-current mode,
the inductor current increases until the current
limit is reached after the power MOSFET turns
on. Since the response delay, the actual BSTSW
peak current value exceeds the setting current
limit a little. Under same condition, a lower
current limit allows lower BSTSW current and
higher switching frequency, while a higher
current limit allows higher BSTSW current and
lower switching frequency.
RBSTISET vs. Current Limit
900
800
700
500
400
300
200
100
0
Selecting the Step-Up Converter Input
Capacitor
The input capacitor, C1, reduces both the surge
current drawn from the input supply and the
switching noise from the device. Select a
capacitor with a switching frequency impedance
less than the input source impedance to prevent
high-frequency switching current from passing
through the input: for example, ceramic
capacitors with X5R or X7R dielectrics with low
ESR and small temperature coefficients. A 4.7μF
or 10μF capacitor will suffice for most
applications.
Selecting the Step-Up Converter Output
Capacitor
600
0
Select an inductor with a DC current rating of at
least 40% higher than the maximum input current.
For best efficiency, select an inductor with the
lowest-possible DC resistance.
200
400
600
800
1000
Figure 4—BSTISET Resistance vs. BSTSW
Current Limit
Setting the BSTOUT Output Voltage
MP5414’s step-up converter features an internal
resistor divider that allows the device to output a
fixed 10V when the BSTFB is left floating.
Connecting the BSTFB pin to the tap of an
external resistor divider between BSTOUT to
ground otherwise sets the boost converter output
voltage, where:
VBSTOUT = VBSTFB ×
The output capacitor, C2, limits the output
voltage and improves feedback loop stability.
Select an output capacitor with a low switching
frequency impedance, such as ceramic
capacitors with X7R dielectrics with low ESR
characteristics. A ceramic capacitor with a value
of less than 10μF will suffice for most
applications.
Flow Chart of Charger Operation
The power-on reset (POR) feature can ensure
that the device initiates in a known state. The
flow chart in Figure 5 describes the conditions
that lead to charger operation modes, such as
constant voltage charge (CVC) and constantcurrent charge (CCC).
R1 + R2
R2
Where VBSTFB = 1.23V.
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MP5414—PMU FOR 3D GLASSES
Figure 5—Flow Chart of Charger Operation
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MP5414—PMU FOR 3D GLASSES
Setting the LDO Output Voltage
Selecting the LDO Input Capacitor
The LDO output voltage can be also adjusted by
using an external resistor divider (R3 and R4 in
the Functional Block Diagram). However, the
value of R3 and R4 in series should not exceed
100kΩ to minimize the impact on the internal
resistor divider. To accurately set the output
voltage, use 10kΩ (±1%) for the low-side resistor
(R4), and determine the value of the high-side
resistor R3 using the following equation:
For proper operation, place a ceramic capacitor
(C4) between 1µF and 10µF of dielectric type
X5R or X7R between the LDOIN pin and ground.
Larger values in this range will help improve line
transient response at the cost of increased size.
⎛V
− VLDOFB ⎞
R3 = R4 × ⎜ LDOOUT
⎟
V
LDOFB
⎝
⎠
Where VLDOFB is the OUT feedback threshold
voltage equal to 1.222V.
For example, for a 2.5V output
2.5V − 1.222V
R3 =
= 10.41kΩ
⎛ 1.222V ⎞
⎜
⎟
⎝ 10kΩ ⎠
You can select a standard 10.5kΩ (±1%) resistor
for R3.
The following table lists the selected standard R3
values for correlated with their output voltages:
Table 3—Adjustable LDO Output Voltage
R3 Values
VLDOOUT (V)
R3 (Ω)
1.25
232
1.5
2.26k
1.8
4.75k
2
6.34k
2.5
10.5k
2.8
13k
3
14.7k
3.3
16.9k
4
22.6k
5
30.9k
MP5414 Rev.1.12
12/13/2012
R4 (Ω)
10k
Selecting the LDO Output Capacitor
For stable operation, use a ceramic capacitor of
type X5R or X7R between 1µF and 10µF for the
LDOOUT capacitor, C6. Larger values in this
range will help improve load transient response
and reduce noise at the cost of increased size.
Other dielectric types can be used, but their
temperature-sensitivity can unduly influence their
capacitances.
To improve load transient response, add a small
ceramic (X5R, X7R or Y5V dielectric) 100nF
feed-forward capacitor in parallel with R3. The
feed-forward capacitor is not required for stable
operation.
Layout Considerations
Proper layout of the high frequency switching
path is critical to limit noise issues and
electromagnetic interference. The circuit loop
from BSTOUT pin, output capacitor to BSTGND
pin is flowing with high frequency pulse current. It
must be as short as possible. The BSTIN pin is
the power supply input for the internal MOSFET
switch gate driver and the internal control
circuitry and requires decoupling. For the LDO,
the input and output need bypass ceramic
capacitors close to the LDOIN pin and LDOOUT
pin respectively. Ensure all feedback connections
are short and direct. Place the feedback resistors
and compensation components as close to the
chip as possible. Connect LDOIN, LDOOUT and
especially LDOGND respectively to a large
copper area to cool the chip to improve thermal
performance and long-term reliability. See the
MP5414 demo board layout for reference.
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MP5414—PMU FOR 3D GLASSES
PACKAGE INFORMATION
QFN28 (4x5mm)
2.50
2.80
3.90
4.10
23
28
PIN 1 ID
SEE DETAIL A
PIN 1 ID
MARKING
22
1
0.50
BSC
PIN 1 ID
INDEX AREA
3.50
3.80
4.90
5.10
0.18
0.30
8
15
0.35
0.45
TOP VIEW
14
9
BOTTOM VIEW
PIN 1 ID OPTION A
0.30x45º TYP.
PIN 1 ID OPTION B
R0.25 TYP.
0.80
1.00
0.20 REF
0.00
0.05
DETAIL A
SIDE VIEW
3.90
NOTE:
2.70
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) EXPOSED PADDLE SIZE DOES NOT INCLUDE MOLD FLASH.
3) LEAD COPLANARITY SHALL BE 0.10 MILLIMETER MAX.
4) DRAWING CONFORMS TO JEDEC MO-220, VARIATION VGHD-3.
5) DRAWING IS NOT TO SCALE.
0.70
0.25
0.50
3.70 4.90
RECOMMENDED LAND PATTERN
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP5414 Rev. 1.12
12/13/2012
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22
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