Intel® Server System SR1695WB

Intel® Server System SR1695WB
Technical Product Specification
Intel order number: E92079-002
Revision 1.1
May 2010
Enterprise Platforms and Services Division
Revision History
Intel® Server System SR1695WB TPS
Revision History
Date
21 April 2010
Revision Number
1.0
24 May 2010
1.1
Modifications
Initial Release.
Updated Figure 14. Power Supply Device Address.
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's
Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any
express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual
property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel
may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or
"undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
®
The Intel Server System SR1695WB may contain design defects or errors known as errata which may cause
the product to deviate from published specifications. Current characterized errata are available on request.
This document and the software described in it is furnished under license and may only be used or copied in
accordance with the terms of the license. The information in this manual is furnished for informational use only, is
subject to change without notice, and should not be construed as a commitment by Intel Corporation. Intel
Corporation assumes no responsibility or liability for any errors or inaccuracies that may appear in this document
or any software that may be provided in association with this document.
Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval system, or
transmitted in any form or by any means without the express written consent of Intel Corporation.
Intel, Pentium and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2010. Portions Copyright
®
2010 by LSI Corporation*.
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Table of Contents
Table of Contents
1. Introduction .......................................................................................................................... 1 1.1 Chapter Outline........................................................................................................ 1 1.2 Server Board Use Disclaimer .................................................................................. 1 2. Product Overview................................................................................................................. 2 2.1 System Views .......................................................................................................... 4 2.2 System Dimensions ................................................................................................. 4 2.3 System Components ............................................................................................... 5 2.4 Hard Drive and Peripheral Bays .............................................................................. 5 2.5 Server Board Overview............................................................................................ 6 2.6 Rack and Cabinet Mounting Options ....................................................................... 9 3. Power Sub-System............................................................................................................. 10 3.1 Mechanical Overview............................................................................................. 10 3.1.1 AC Power Supply Module Dimension Overview .................................................... 10 3.1.2 AC input connector ................................................................................................ 10 3.1.3 AC Power Cord Specification Requirements ......................................................... 10 3.1.4 DC Power Supply Module Dimension Overview.................................................... 11 3.1.5 DC input connector ................................................................................................ 11 3.1.6 Power Supply Module DC Output Connector ........................................................ 12 3.1.7 Power Distribution Board Mechanic Outline .......................................................... 12 3.1.8 Power Distribution Board Output connectors......................................................... 12 3.2 AC Voltage Input Specification .............................................................................. 13 3.2.1 Input Voltage And Frequency ................................................................................ 13 3.2.2 Input Current.......................................................................................................... 13 3.2.3 Input Current Harmonics........................................................................................ 13 3.2.4 AC Line Fuse ......................................................................................................... 14 3.2.5 AC Line Inrush ....................................................................................................... 14 3.2.6 Input Power Factor ................................................................................................ 14 3.2.7 AC Line Dropout .................................................................................................... 14 3.2.8 Brownout................................................................................................................ 14 3.2.9 Efficiency ............................................................................................................... 14 3.3 DC Voltage Input Specification .............................................................................. 15 3.3.1 Input Voltage.......................................................................................................... 15 3.3.2 Input Current.......................................................................................................... 15 3.3.3 DC Line Fuse......................................................................................................... 15 3.3.4 DC Line Inrush....................................................................................................... 15 3.3.5 Brownout................................................................................................................ 15 3.3.6 Efficiency ............................................................................................................... 15 3.4 Control And Indicator Functions ............................................................................ 16 3.4.1 PSON#(Power supply enable)............................................................................... 16 3.4.2 PSKILL/A1 ............................................................................................................. 16 3.4.3 PWOK (power good).............................................................................................. 16 3.4.4 B/P Fail function..................................................................................................... 17 iii
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3.4.5 LED indicators ....................................................................................................... 17 3.5 DC output voltages ................................................................................................ 17 3.5.1 Output rating .......................................................................................................... 17 3.5.2 Remote Sensing (+12VRS) ................................................................................... 18 3.5.3 No load operation .................................................................................................. 18 3.5.4 Regulation, ripple and noise .................................................................................. 18 3.5.5 Ripple and noise .................................................................................................... 18 3.5.6 Transient loading ................................................................................................... 18 3.5.7 Capacitive load ...................................................................................................... 19 3.5.8 Maximum load change........................................................................................... 19 3.5.9 Load sharing control(+12V load sharing)............................................................... 19 3.5.10 Output voltage rise time......................................................................................... 19 3.5.11 Output voltage hold-up time................................................................................... 19 3.5.12 Overshoot .............................................................................................................. 19 3.5.13 Temperature coefficient ......................................................................................... 20 3.6 Protection circuits .................................................................................................. 20 3.6.1 +12V Over voltage protection ................................................................................ 20 3.6.2 Over current/short circuit protection....................................................................... 20 3.6.3 Thermal protection................................................................................................. 20 3.6.4 Thermal Fan Speed Control(External Control) ...................................................... 21 3.7 PMBus*.................................................................................................................. 21 4. Cooling Sub-System ..........................................................................................................22 4.1 CPU Heatsink ........................................................................................................ 22 4.2 Four-Fan Module ................................................................................................... 23 4.3 Power Supply Fan ................................................................................................. 24 4.4 Air Duct Module ..................................................................................................... 24 4.5 Drive Bay Population Requirement........................................................................ 25 5. Peripheral Drive Support ................................................................................................... 26 6. Hard Disk Drive Support.................................................................................................... 27 6.1 Hard Disk Drive Bays............................................................................................. 27 6.2 Hard Drive Trays.................................................................................................... 27 6.3 Hot-Swap Hard Drive Support ............................................................................... 28 6.3.1 Backplane Feature set:.......................................................................................... 28 6.3.2 Backplane Block Diagram:..................................................................................... 29 6.3.3 Backplane Connector Definition ............................................................................ 29 6.3.4 Backplane LED Support ........................................................................................ 30 6.3.5 Backplane Connector Definition ............................................................................ 31 7. Front Panel Control and Indicators .................................................................................. 34 7.1 Control Panel Button.............................................................................................. 34 7.2 Control Panel LED Indicators ................................................................................ 34 7.2.1 Power/Sleep LED .................................................................................................. 35 7.2.2 System Status LED................................................................................................ 36 7.2.3 System Status LED – BMC Initialization ................................................................ 37 7.2.4 System Identification LED...................................................................................... 37 iv
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Table of Contents
7.3 Front Panel Connectors......................................................................................... 37 8. Configuration Jumpers...................................................................................................... 39 8.1 Force Integrated BMC Update (J1B5) ................................................................... 40 8.2 Password Clear (J1C2).......................................................................................... 40 8.2.1 Clearing the BIOS Password ................................................................................. 40 8.3 BIOS Recovery Mode (J1C3) ................................................................................ 41 8.4 Reset BIOS Configuration (J1B4).......................................................................... 41 8.4.1 Clearing the CMOS................................................................................................ 41 8.5 Video Master (J6A3) .............................................................................................. 42 8.6 Serial Interface (J6A2) ........................................................................................... 42 9. PCI Riser Card and Assembly........................................................................................... 43 10. Environmental and Regulatory Specifications ................................................................ 44 10.1 System Level Environmental Limits....................................................................... 44 10.2 Serviceability and Availability................................................................................. 44 10.3 Replacing the Backup Battery ............................................................................... 45 10.4 Product Regulatory Compliance ............................................................................ 45 10.5 Use of Specified Regulated Components.............................................................. 46 10.6 Electromagnetic Compatibility Notices .................................................................. 48 10.6.1 USA ....................................................................................................................... 48 10.6.2 ICES-003 (Canada) ............................................................................................... 49 10.6.3 Europe (CE Declaration of Conformity) ................................................................. 49 10.6.4 Japan EMC Compatibility ...................................................................................... 49 10.6.5 BSMI (Taiwan) ....................................................................................................... 49 10.6.6 KCC (Korea) .......................................................................................................... 50 10.7 Rack Mount Installation Guidelines ....................................................................... 50 10.7.1 If AC power supplies are installed: ........................................................................ 50 10.7.2 If DC power supplies are installed: ........................................................................ 51 10.8 Power Cord Usage Guidelines .............................................................................. 51 10.9 Product Ecology Compliance................................................................................. 51 10.10 Other Markings ...................................................................................................... 53 Appendix A: Integration and Usage Tips................................................................................ 54 Appendix B: POST Code LED Decoder .................................................................................. 55 Appendix C: Video POST Code Errors ................................................................................... 60 Appendix D: Jumper Block Settings and Usage.................................................................... 65 Glossary..................................................................................................................................... 69 Reference Documents .............................................................................................................. 72 v
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List of Figures
Intel® Server System SR1695WB TPS
List of Figures
Figure 1. System Overview (HDD and Memory DIMMs are not included in package) ................. 4
Figure 2. Major Chassis Components........................................................................................... 5
Figure 3. Drive Bay Overview ....................................................................................................... 6
Figure 4. Intel® Server Board S5500WB 12V only ........................................................................ 6
Figure 5. Intel® Server Board S5500WB 12V only Components................................................... 7
Figure 6. Connector and Component Definitions.......................................................................... 8
Figure 7. Back Panel Feature Overview ....................................................................................... 8
Figure 8. Light-Guided Diagnostic LED Locations ........................................................................ 9
Figure 9. AC Power Supply Module Dimension Overview .......................................................... 10
Figure 10. DC Power Supply Module Overview.......................................................................... 11
Figure 11. Mating Male and Female Connector.......................................................................... 11
Figure 12. DC Output Power Connector ..................................................................................... 12
Figure 13. Power Distribution Board Overview ........................................................................... 12
Figure 14. Power Supply Device Address .................................................................................. 21
Figure 15. CPU Heatsink Overview ............................................................................................ 22
Figure 16. Fan Module Assembly ............................................................................................... 23
Figure 17. Air Duct Module ......................................................................................................... 24
Figure 18. Air Duct Module assembly process ........................................................................... 25
Figure 19. Hot-swap HDD Tray with SAS/SATA HDD Installed ................................................. 25
Figure 20. View of Slim-line Drive Bay (in Deep Black) .............................................................. 26
Figure 21. HDD Bays and Numbering ........................................................................................ 27
Figure 22. 3.5-inch HDD Assembly Overview............................................................................. 27
Figure 23. 2.5-inch HDD Assembly Overview............................................................................. 28
Figure 24. Passive Backplane Block Diagram ............................................................................ 29
Figure 25. Backplane Component and Connectors (Front View) ............................................... 29
Figure 26. Backplane Component and Connectors (Back View) ................................................ 30
Figure 27. Hard Drive Tray LED Locations ................................................................................. 30
Figure 28. Front Control Panel.................................................................................................... 34
Figure 29. Jumper Locations and Functions............................................................................... 39
Figure 30. 1U PCI Express* Riser Card Mechanical Drawing .................................................... 43
Figure 31. Intel® Server System SR1695WB PCI Express* Riser Assembly.............................. 43
Figure 32. Diagnostic LED Placement Diagram ......................................................................... 55
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List of Tables
List of Tables
Table 1. System Feature Set ........................................................................................................ 2
Table 2. Chassis Dimensions ....................................................................................................... 4
Table 3. AC power cord specification ......................................................................................... 10
Table 4. P1 – Main Power Connector Pin-out............................................................................. 12
Table 5. P3 – PMBus*/Power Signal Connector Pin-out ............................................................ 13
Table 6. Rated output power for each input voltage range. ........................................................ 13
Table 7. Maximum input current. ................................................................................................ 13
Table 8. AC Brownout and Recover ........................................................................................... 14
Table 9. Power Supply Efficiency ............................................................................................... 14
Table 10. Power Supply Fan Power Loss................................................................................... 14
Table 11. DC Voltage Input Range ............................................................................................. 15
Table 12. Maximum Input Current .............................................................................................. 15
Table 13. DC Brownout And Recover......................................................................................... 15
Table 14. PS ON# Signal Characteristics. .................................................................................. 16
Table 15. PSKILL# Signal Characteristics .................................................................................. 16
Table 16. PWOK Signal Characteristics ..................................................................................... 17
Table 17. Power Supply Module LED Indicator .......................................................................... 17
Table 18. DC Power Supply Module LED Indicator. ................................................................... 17
Table 19. Output rating ............................................................................................................... 18
Table 20. Output voltage regulation............................................................................................ 18
Table 21. Ripple and Noise......................................................................................................... 18
Table 22. Transient loading ........................................................................................................ 19
Table 23. Capacitive Load .......................................................................................................... 19
Table 24. +12V Over voltage protection requirements ............................................................... 20
Table 25. Over current/short circuit protection............................................................................ 20
Table 26. Fan Speed Control...................................................................................................... 21
Table 27. 4-pin Connector Pin-Out for Processor Cooling Fan .................................................. 24
Table 28. 8-pin Connector Pin-Out for Memory Cooling Fan...................................................... 24
Table 29. Optical Drive SATA Connector Pin-out ....................................................................... 26
Table 30. Optical Drive SATA Power Connector Pin-out............................................................ 26
Table 31. Hard Drive Tray LED Functions .................................................................................. 30
Table 32. Backplane Power Connector Pin-out .......................................................................... 31
Table 33. Hot-Swap SATA/SAS Connector Pin-out.................................................................... 31
Table 34. SATA/SAS Drive Control Connector Pin-out .............................................................. 32
Table 35. IPMB Connector Pin-out ............................................................................................. 32
Table 36. SMBus Connector Pin-out .......................................................................................... 32
Table 37. SGPIO Connector Pin-out........................................................................................... 32
Table 38. SES Connector Pin-out............................................................................................... 33
Table 39. Front Control Button Function..................................................................................... 34
Table 40. Front LED Indicator Functions .................................................................................... 34
Table 41. SSI Power LED Operation .......................................................................................... 35
Table 42. System Status LED Operation .................................................................................... 36
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List of Tables
Intel® Server System SR1695WB TPS
Table 43. System ID LED Indicator States ................................................................................. 37
Table 44. Front Panel SSI connector pin-out.............................................................................. 37
Table 45. Front Panel USB connector pin-out ............................................................................ 38
Table 46. Force Integrated BMC Update Jumper ....................................................................... 40
Table 47. BIOS Password Clear Jumper .................................................................................... 40
Table 48. BIOS Recovery Mode Jumper .................................................................................... 41
Table 49. Reset BIOS Jumper .................................................................................................... 41
Table 50. Video Master Jumper.................................................................................................. 42
Table 51. Serial Interface Jumper............................................................................................... 42
Table 52. System Office Environmental Summary ..................................................................... 44
Table 53. Maintenance Activity Duration .................................................................................... 44
Table 54. Product Safety and Electromagnetic (EMC) Compliance ........................................... 47
Table 55. POST Progress Code LED Example .......................................................................... 56
Table 56. POST Progress Code LED Example .......................................................................... 56
Table 57. POST Error Message and Handling ........................................................................... 60
Table 58. BIOS Recovery Mode (J1C3) ..................................................................................... 66
Table 59. Reset BIOS Configuration (J1B4) ............................................................................... 67
Table 60. Video Master (J6A3) ................................................................................................... 67
Table 61. Serials Interface Setting (J6A2) .................................................................................. 68
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List of Tables
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1.
Introduction
Introduction
This Technical Product Specification (TPS) provides system specific information detailing the
features, functionality, and high-level architecture of the Intel® Server System SR1695WB.
You should also reference the Intel® Server Board S5500WB Technical Product Specification
to obtain greater detail of functionality and architecture of the server board integrated in this
server system.
In addition, you can obtain design-level information for specific sub-systems by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given
sub-system. EPS and EDS documents are not publicly available. They are only made
available under NDA with Intel and must be ordered through your local Intel representative.
For a complete list of available documents, refer to the Reference Documents section at the
end of this document.
The Intel® Server System SR1695WB may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Refer to the Intel®
Server Board S5500WB/Intel® Server System SR1695WB Specification Update for
published errata.
Chapter Outline
1.1
This document is divided into the following chapters:
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1.2
Chapter 1 – Introduction
Chapter 2 – Product Overview
Chapter 3 – Power Sub-System
Chapter 4 – Cooling Sub-System
Chapter 5 – Peripheral Driver Support
Chapter 6 – Hard Disk Driver Support
Chapter 7 – Front Panel Control and Indicators
Chapter 8 – Configuration Jumpers
Chapter 9 – PCI Riser Card and Assembly
Chapter 10 – Environmental and Regulatory Specifications
Appendix A – Integration and Usage Tips
Appendix B – POST code LED Decoder
Appendix C – Video POST Code Errors
Appendix D – Jumper Block Settings and Usage
Glossary
Reference Documents
Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of highdensity VLSI and power delivery components that need adequate airflow to cool. Intel
ensures through its own chassis development and testing that when Intel server building
blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel developed server building blocks to consult vendor datasheets and
operating parameters to determine the amount of air flow required for their specific
application and environmental conditions. Intel Corporation cannot be held responsible if
components fail or the server board does not operate correctly when used outside any of
their published operating or non-operating limits.
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Product Overview
2.
Intel® Server System SR1695WB TPS
Product Overview
The Intel® Server System SR1695WB is a rack mount 1U server system, purpose-built for
high-energy efficiency and lowest total cost of ownership in dense computing applications.
The system is integrated with an Intel® Server Board S5500WB and supports up to four hotswap SAS or SATA hard drives.
This chapter provides a high-level overview of the system features. The following chapters
provide greater detail for each major system component or feature.
Table 1. System Feature Set
Feature
Raw Storage Capacity
Description
System raw storage capacity is based on the HDD capacity and number of HDDs
used in the system. Raw storage capacity is the sum of single HDD capacity used in
system. For example: if four 1 TB HDDs are used in system, the system raw storage
capacity is 4.0 TB
External Drive Bays
Four hot-pluggable external drive bays
Hard Disk Drive
3.5-inch SATA, SAS HDD.
Supported
2.5-inch SATA, SAS HDD.
Support for one or two Intel® Xeon® Processor 5500 or 5600 series processors in FCLGA 1366 Socket B package with up to 95 W Thermal Design Power (TDP) .
Processor
Supports future processor compatibility guidelines
4.8 GT/s, 5.86 GT/s, and 6.4 GT/s Intel® Quick Path Interconnect (Intel® QPI).
Meets EVRD11.1
Memory Capacity
Expandable to 64 GB maximum.
240-pin keyed support for 800/166/1333 MT/s ECC Registered (RDIMM) or
Unbuffered (UDIMM) DDR3 memory.
Memory Type
8 DIMMs total across six memory channels (three channels per processor in a 2:1:1
configuration).
No support for Quad-Rank x4 DIMMs.
DIMM Slots
Eight
®
Intel Chipset which includes the following components:
Chipset
Intel® 5500 chipset IOH(IOH24D)
®
Intel 82801Jx I/O Controller Hub (ICH10R)
External I/O connectors:
DB-15 Video connectors
RJ-45 serial Port A connector
RJ-45 connector for 10/100/1000 LAN
One 2x USB 2.0 connectors
One RJ-45 over USB for 10/100/1000 LAN
Internal connectors/headers:
System Connectors
Two USB 2x5 pin header, supporting up to four USB 2.0 ports
/ Headers
One low-profile USB 2x5 pin
One DH-10 Serial Port B header
One 2x8 pin VGA header with presence detection to switch from rear I/O
video connector
Six SATA II connectors
Dual Connectors for Intel® I/O Expansion Module
®
One RMM3 connector to support optional Intel Remote Management
Module 3
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Product Overview
Feature
Description
SATA SW RAID 5 Activation Key Connector
One front panel header
System Fan Support
Add-in Adapter Support
Two sets of CPU fans
Two sets of DIMM fans
One riser slot supporting full-height or low-profile 1U and 1U MD2 PCI Express* x16
riser cards.
Two connectors supporting double- and single-wide Intel® I/O Expansion Modules.
On-board Server Engines* LLC Pilot II Controller
On-board Video
Matrox* G200 2D Video Graphics controller
Uses 8 MB of the BMC 32 MB DDR2 Memory
LAN Support
®
®
Two 10/100/1000 ports provided by Intel 82576 with Intel I/O Acceleration
Technology (I/OAT)
System Power
1+1 450-W AC or DC power supply, 80 plus silver with PFC
On-board Server Engines* LLC Pilot II Controller.
Integrated Baseboard Management Controller (Integrated BMC), IPMI 2.0 compliant
Basic
BMC Controller: ARC 926E-S microcontroller
System Management
Super IO: Serial Port logic, legacy interfaces, LPC interface, Port80
Hardware Monitoring: Fan speed control and voltage monitoring
Advanced
Video and USB compression and redirection
NC-SI port, a high-speed sideband management interface
Integrated Super I/O on LPC interface
The Intel® Server System SR1695WB system is supporting all Intel® Xeon® 5500 and 5600
series processors with TDP 95 W and below. You can find a full list of supported processors
at the Intel Support Website:
http://www.intel.com/support/motherboards/server/S5500WB/sb/CS-030205.htm
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Product Overview
2.1
Intel® Server System SR1695WB TPS
System Views
Figure 1. System Overview (HDD and Memory DIMMs are not included in package)
2.2
System Dimensions
Table 2. Chassis Dimensions
Height
43 mm
1.69 inches
Width without rails
451.17 mm
17.76 inches
Width with rails
482 mm
18.97 inches
Depth without CMA
671.08 mm
26.42 inches
Weight
Chassis – basic configured (1 PSU, 0
drives)
Chassis – fully configured (2 PSU, 4 drives)
9.92 kg
15.09 kg
21.85 lbs
33.25 lbs
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2.3
Product Overview
System Components
A
B
C
D
E
Mother Board
Power Supply Module
External hot-swap HDD Carriers
Slim-line Optical Drive
System Fans Module
F
G
H
I
J
1U Chassis
Air Duct
Front Panel and Front USB module
Optional BBU Assembly Position
Optional PCI Express* Add-in Card
Not shown: Rack slide rail, front bezel, and top cover.
Figure 2. Major Chassis Components
2.4
Hard Drive and Peripheral Bays
Slim-line SATA Optical Drive
Slim-line USB Floppy Drive
Intel® Server System SR1695WB
Supported
No Support
SATA Drives (3.5-inch or 2.5-inch)
Up to four
SAS Drives (3.5-inch or 2.5-inch)
Up to four
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Product Overview
Intel® Server System SR1695WB TPS
B
A
D C
E
A
System Control Panel
B
Slim-line drive bay
C
HDD Power LED
D
HDD Activity/Fault LED
E
Hard drive bays 0~3
Figure 3. Drive Bay Overview
2.5
Server Board Overview
The chassis is mechanically and functionally designed to support the Intel® Server Board
S5500WB 12V only. The following sections provide an overview of the server board feature
sets.
Figure 4. Intel® Server Board S5500WB 12V only
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Product Overview
The following figure shows the layout of the server board. Each connector and major
component is identified by a number or letter, and a description is given below the figure.
Figure 5. Intel® Server Board S5500WB 12V only Components
A
Description
Dual Intel® I/O Expansion Module Connectors
V
Description
Processor Socket 1
B
C
PCI Express* x16 Gen2
W
8-pin CPU Connector
Remote Management Module 3
X
Processor Socket 2
D
POST Code LEDs
Y
4-pin Fan Connector (CPU2)
E
External I/O
Z
4-pin Fan Connector (CPU2A)
F
USB Connector
AA
4-pin Fan Connector (MEM2)
G
Battery
BB
8-pin Fan Connector (MEM2R)
H
SATA Connectors 0~5
CC
DIMM Slot D2
I
N/A
DD
DIMM Slot D1
J
8-pin Power Connector
EE
DIMM Slot E1
K
Aux Power
FF
DIMM Slot F1
L
RAID Key
GG
Front Panel Connector
M
DIMM Slot C1
HH
HDD LED Header
N
DIMM Slot B1
II
Low-Profile USB Connector
O
DIMM Slot A1
JJ
Internal VGA Connector
P
DIMM Slot A2
KK
BMC Power Cycle Header
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Product Overview
Intel® Server System SR1695WB TPS
Q
Description
8-pin Fan Connector (MEM1R)
LL
USB Connector
Description
R
4-pin Fan Connector (MEM1)
MM
Slot 1 PCI Express* x8 Gen2
S
4-pin Fan Connector (CPU1A)
NN
SGPIO Connector
T
4-pin Fan Connector (CPU1)
OO
IMPB Connector
U
HDD Power Connector
PP
Serial Port B
Figure 6. Connector and Component Definitions
A
Power In
G
RJ-45 Serial
B
PS Status LED
H
NIC 2 connector RJ-45
C
NIC 1 connector RJ-45
I
Dual USB 8/9
D
Thumb Screw
J
Dual USB 2/5
E
PCIe Add-in Card Slot
K
Status LED
F
Video Out
L
ID LED
Figure 7. Back Panel Feature Overview
Important Note: The Intel® Server System SR1695WB requires the use of shielded LAN
cable to comply with Emission/Immunity regulatory requirements. Use of non shield cables
may result in product non-compliance.
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Product Overview
A
Description
Diagnostic LED
E
Description
CPU1 DIMM fault LED
B
System Status LED
F
Fan Fault LED
C
System ID LED
G
CPU2 DIMM Fault LED
D
5V Standby LED
Figure 8. Light-Guided Diagnostic LED Locations
Rack and Cabinet Mounting Options
2.6
The chassis was designed to support 19 inches wide by up to 30 inches deep server
cabinets. The system supports the following Intel rack mount options:
ƒ
A basic slide rail kit (Product order code – AXXBASICRAIL) is designed to mount the
chassis into a standard (19 inches by up to 30 inches deep) EIA-310D compatible
server cabinet.
ƒ
A tool-less slide rail kit (Product order code – AXXHERAIL2) is designed to mount
the chassis into a standard (19 inches by up to 30 inches deep) EIA-310D compatible
server cabinet.
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Power Sub-System
3.
Intel® Server System SR1695WB TPS
Power Sub-System
The system includes 450W 1+1 hot swap power supply module and one power distribution
board which can support 1U rack server system. Power supply modules have two SKUs: AC
module and DC module. AC module is 80 plus energy efficiency, demonstrating climate
saver with silver rating.
3.1
Mechanical Overview
Both AC and DC power supply modules are in same form factor. The module has a simple
retention mechanism to retain the module self once it is inserted. This mechanism shall
withstand the specified mechanical shock and vibration requirements. The power distribution
board will be fixed on the chassis with screws. This specification defines a 450W 1+1 hot
swap redundancy power supply that supports a 1U server system. Using existing power
supply module provided by vendor with updated PMBus* and custom-made power connector
board to support Intel® S5500 Series Server Boards. The power supply shall have 2 outputs:
12V and 5VSB. The input shall be auto ranging and power factor corrected. The PMBus*
features included in this specification are requirements for AC/DC silver box power supply
for use in server systems based on Intel® S5500 Series Server Platforms. This specification
is based on the PMBus* specifications part I and II, revision 1.1.
3.1.1
AC Power Supply Module Dimension Overview
The casing dimension is W 50.5mm x L 310mm x H 40.2mm:
Figure 9. AC Power Supply Module Dimension Overview
3.1.2
AC input connector
The power supply shall have an internal IEC320 C14 power inlet.
3.1.3
AC Power Cord Specification Requirements
The AC power cord used must meet the following specification requirements:
Table 3. AC power cord specification
Cable Type
SJT
Wire Size
16 AWG
Temperature Rating
105º C
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Intel® Server System SR1695WB TPS
3.1.4
Power Sub-System
Amperage Rating
13A
Cable Type
SJT
DC Power Supply Module Dimension Overview
The casing dimension is W 50.5mm x L 310mm x H 40.2mm:
Figure 10. DC Power Supply Module Overview
3.1.5
DC input connector
The power supply shall have an internal Positronic Industries PLA03M3BN0A1/AA DC inlet.
The mating female connector is Positronic Industries PLA037000/AA.
Pin
1
Wire Spec
UL1015 12AWG
Color
GRN/YEL
Length
500
2
UL1015 12AWG
Black
500
3
UL1015 12AWG
Red
500
Figure 11. Mating Male and Female Connector
Revision 1.1
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3.1.6
Intel® Server System SR1695WB TPS
Power Supply Module DC Output Connector
Both AC and DC Power Supply Module have a same DC output connector.
The DC output connector is the FCI#51731-042LF or equivalent.
Signal Pins
Power Blade
1
A0
2
PWOK
3
+5VSB
C
12VLS
+15Vcc
+12VRS
B
PS-ON
SCL
B/P Fail
A
PS-Kill/A1
SDA
+5VSB
D
P1
RTN
P2
P3
P4
RTN
+12V
+12V
Figure 12. DC Output Power Connector
3.1.7
Power Distribution Board Mechanic Outline
Figure 13. Power Distribution Board Overview
3.1.8
Power Distribution Board Output connectors
The power distribution board provides two output connectors to the various system boards.
P1 – Main Power Connector
Connector housing: 24-Pin
Table 4. P1 – Main Power Connector Pin-out
Pin
1
2
3
4
5
6
7
8
Signal
5V
GND
3.3V
GND
GND
GND
GND
GND
Pin
13
14
15
16
17
18
19
20
Signal
5V
GND
3.3V
GND
12V
12V
12V
12V
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Intel® Server System SR1695WB TPS
Power Sub-System
Pin
9
10
11
12
Signal
GND
GND
GND
GND
Pin
21
22
23
24
Signal
12V
12V
12V
12V
P2 –PMBus*/Power Signal Connector
Connector housing: 7-Pin
Table 5. P3 – PMBus*/Power Signal Connector Pin-out
Pin
1
3.2
Signal
SCL
2
SDA
3
PWR_Alert
4
GND
5
12V_sense
6
PS_ON
7
5VSB
AC Voltage Input Specification
Note: This section is suitable only for system inserted AC Power Supply Module.
3.2.1
Input Voltage And Frequency
The power supply shall be capable of supplying the rated power as specified in Table 6 in
the voltage range of 90VAC to 264VAC.
Table 6. Rated output power for each input voltage range.
Input Voltage Range
Nominal Voltage
Max Power
90 – 132VAC
115VAC
450W
180 – 264VAC
230VAC
450W
The power supply shall operate at any input frequency between 47Hz and 63Hz.
3.2.2
Input Current
The maximum input current shall be 15A for each input voltage range of Table 7.
Table 7. Maximum input current.
3.2.3
Input Voltage
90 – 132V
Input Current
8A
180 – 264V
4A
Input Current Harmonics
The input current drawn on the power line shall not exceed the limits set by IEC-61000-3-2
and JEIDA MIT1 standards.
Revision 1.1
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Power Sub-System
3.2.4
Intel® Server System SR1695WB TPS
AC Line Fuse
The power supply shall incorporate one input fuse on the line side for input over-current
protection to prevent damage to the power supply and meet product safety requirement.
Fuse should be slow blow type or equivalent to prevent nuisance trips. AC inrush current
shall not cause the AC line fuse to blow under any conditions. All protection circuits in the
power supply shall not cause the AC fuse to blow unless a component in the power supply
has failed. This includes DC output load short conditions.
3.2.5
AC Line Inrush
The maximum AC line inrush current shall be 60A peak at an input voltage of 264VAC.
Inrush current shall be measured at an ambient temperature of 25 deg C after the input
voltage has been removed from the power supply for a minimum of 10 minutes.
3.2.6
Input Power Factor
The input power factor shall be greater than 0.98/115Vac and 0.94/230Vac over all input
voltage at loads greater than 50% of the power supply’s rated output.
3.2.7
AC Line Dropout
An AC line dropout is a transient condition defined as the AC input to the power supply drops
to 0Vrms for one AC cycle or less. An AC line dropout shall not damage the power supply
under any load condition. During an AC line dropout, the power supply must meet voltage
regulation requirements in section 3.5.4 over the rated load. An AC line dropout shall not
cause any power supply protection circuit to trip.
If the AC line dropout transient lasts longer than one input frequency period, the power
supply may shutdown or go out of regulation. A dropout period of any length shall not cause
damage to the power supply.
3.2.8
Brownout
The power supply should withstand a brownout and recover from it without any damage
stated in below table 8:
Table 8. AC Brownout and Recover
0 – 115VAC
Full Load
3.2.9
Shut Down
80Vac
Recover
88Vac
Efficiency
The Efficiency should meet at least Climate Saver 2/80Plus Silver rating, specified in below
table 8 and 9. The efficiency should be measured at 230VAC and with external fan power
source or deduction of the power consumed by the fan at specified loading, according to
Climate Saver/80Plus efficiency measurement specifications.
Table 9. Power Supply Efficiency
Input
20%
50%
100%
230VAC
85%
89%
85%
Table 10. Power Supply Fan Power Loss
Input 230VAC/Load
20%
50%
100%
Fan(Power Loss)
2W
5W
10W
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Power Sub-System
The minimum efficiency at 90~264VAC for the Max load shell be at least 83%.
3.3
DC Voltage Input Specification
Note: This section is suitable only for system inserted DC Power Supply Module.
3.3.1
Input Voltage
The power supply input DC voltage shall be taken to -75Vdc for 1sec. The range is in Table
11.
Table 11. DC Voltage Input Range
Minimum
-36V
Range 1
3.3.2
Nominal
-48V
Maximum
-72V
Peak
-75V
Input Current
The maximum input current shall be 20A for each input voltage range of Table 12.
Table 12. Maximum Input Current
Input Voltage
-36 -- -72VDC
3.3.3
Maximum Input Current
20 – 9A
Max Power
100A 2u second
DC Line Fuse
The power supply shall incorporate one input fuse on the return fuse on the return side for
input over-current protection to prevent damage to the power supply and meet product
safety requirements. Fuses should be slow blow type or equivalent to prevent nuisance trips.
DC inrush current shall not cause the DC line fuse to blow under any conditions. All
protection circuits in the power supply shall not cause the DC fuse to blow unless a
component in the power supply has failed. This includes DC output load short conditions.
3.3.4
DC Line Inrush
The maximum DC line inrush current shall be 100A peak at an input voltage of -48VDC.
Inrush current shall be measured at an ambient temperature of 25 deg C after the input
voltage has been removed from the power supply for a minimum of 10 minutes.
3.3.5
Brownout
The power supply should withstand a brownout and recover from it without any damage
stated in below table 13:
Table 13. DC Brownout And Recover.
-36 -- -72Vin
Full Load
3.3.6
Shut Down
-33 +/-1V Vin
Recover
-35 +/-1V Vin
Efficiency
85% minimum at -48V ~ -72V for the max load.
Revision 1.1
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Power Sub-System
3.4
Intel® Server System SR1695WB TPS
Control And Indicator Functions
Signals that can be defined as low true or high true shall adopt the following conversion:
signal# = low true.
3.4.1
PSON#(Power supply enable)
Both AC and DC power supply module’s PSON# signal is required to remotely turn on/off the
+12V output in the power supply. When the power supply is in standby mode the power
supply fan shall be OFF. PSON# is pulled to a standby voltage by a pull-up resistor internal
to the power supply. See Table 14.
Table 14. PS ON# Signal Characteristics.
Signal Type
PSON# =Low, PSKILL=Low
Pull-up To Housekeeping Voltage In Power Supply
ON
PSON# =Open, PSKILL=Low or Open
OFF
PSON# =Low, PSKILL=Open
OFF
Min
Logic level low(power supply ON)
Max
0V
1.0V
Logic level high(power supply OFF)
2.0V
5.25V
Source current, Vpson=low
N/A
1mA
3.4.2
PSKILL/A1
The purpose of the PSKILL/A1 pin is to allow for hot swapping of the power supply. The
PSKILL/A1 pin on the power supply is shorter than the other signal pins. The mating pin of
this signal in the system shall be tied to ground. Internal to the power supply, the PSKILL/A1
pin shall be connected to a standby voltage through a pull-up resistor. Upon receiving a
<4.1V state at the PSKILL/A1 pin, a PSON# signal shall enable the power supply to turn on.
See Table 15.
Table 15. PSKILL# Signal Characteristics
Signal Type(Input Signal To Supply)
Accepts A Ground Input From The System. Pull-up To VSB Located In
The Power Supply
ON
PSON# =Low, PSKILL/A1=Low
PSON# =Open, PSKILL/A1=Low or Open
OFF
PSON# =Low, PSKILL/A1=Open
OFF
Logic level low(power supply ON)
Logic level high(power supply OFF)
Source current, Vpskill/A1=low
3.4.3
Min
Max
0V
4.1V(for AC Module)/1.0V(For
DC Module)
4.1V(For AC Module)/2.0V(For
DC Module)
5.25V
N/A
4mA
PWOK (power good)
PWOK is a power good signal and shall be pulled HIGH by the power supply to indicate that
all outputs are above their respective lower regulation limits. See Table 16.
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Intel® Server System SR1695WB TPS
Power Sub-System
Table 16. PWOK Signal Characteristics
Open Collector/Drain Output From Power Supply.
Pull-up To VSB Located Power Supply
Power Good
Signal Types
PWOK=High
PWOK=Low
Power Not Good
Min
Logic level lowvoltage, Isink=4mA
Logic level high voltage, Isource=200uA
Max
0V
0.4V
2.4V
5.25V
Sink current, PWOK=Low
4mA
Source current, PWOK=High
2mA
3.4.4
B/P Fail function
The pin senses the backplane fail signal, when the backplane outputs causes OCP, OVP, or
any other fail, the B/P fail signal pin goes HIGH, the module will shut down and the LED will
indicate “red”.
3.4.5
LED indicators
These will be a bi-color LED to indicate power supply status, Refer to the tables below for
AC power supply module and DC power supply modules.
Table 17. Power Supply Module LED Indicator
Power Supply Condition
No AC power to all PSU
Power Supply LED
OFF
No AC power to this PSU only
Flashing RED*
AC present/only standby output on
Flashing GREEN*
Power supply DC output ON and OK
GREEN
Power supply failure
RED
Power supply warning
Flashing RED/GREEN*
Note: *Flashing frequency: 1 sec on/ 1 sec off
Table 18. DC Power Supply Module LED Indicator.
Power Supply Condition
No DC power to all PSU
OFF
Power Supply LED
No DC power to this PSU only
Flashing RED*
DC present/only standby output on
Flashing BlUE*
Power supply DC output ON and OK
BLUE
Power supply failure
RED
Power supply warning
Flashing RED/BLUE*
Note: *Flashing frequency: 1 sec on/ 1 sec off
3.5
DC output voltages
3.5.1
Output rating
Each DC output shall be capable of supplying the output current shown in Table 19.
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Intel® Server System SR1695WB TPS
Table 19. Output rating
3.5.2
Output
+12V
Min
2A
Max
37A
+5VSB
0
3A
Remote Sensing (+12VRS)
The power supply shall have remote sense (ReturnS) to compensate for output ground
drops for output voltages: +12V. The power supply system output shall have remote sense
(12VRS) to compensate for drops in the system for the +12V output. The remote sense input
impedance to the power supply shall be greater than 200ohms on +12VRS. Remote sense
shall be able to compensate for a minimum of 400mV drop on the +12V output. The current
in any remote sense line shall be less than 5mA to minimum voltage sensing errors.
3.5.3
No load operation
The power supply shall meet all requirements except for the transient loading requirements
when operated at no load on all outputs.
3.5.4
Regulation, ripple and noise
The power supply shall meet the regulation, ripple and noise limit under all operating
conditions (AC/DC line, transient loading, output loading). The regulation of Table 20 shall
be measured at the output connector of the power supply, subject to the cross loading
condition in Table 19.
Table 20. Output voltage regulation
3.5.5
Output
+12V
Minimum
11.64V
+5VSB
4.8V
Output Voltage Limits(Vdc)
Nominal
Maximum
12V
12.36V
5V
REG
+/-3%
5.2V
+/-4%
Ripple and noise
Ripple and noise shall be measured with 0.1uF of ceramic capacitance and 10uF of tantalum
capacitance on each of the power supply output connector terminal. The ripple and noise
shall be met over all load ranges and AC/DC line voltages with 1 to 2 power supplies in
parallel operation. The output noise requirements shall apply over a 0Hz to 20MHz
bandwidth. Table 21 shows the ripple and noise.
Table 21. Ripple and Noise
3.5.6
Output
+12V
5VSB
Maximum ripple/noise
150mVp-p
50mVp-p
Transient loading
The power supply shall operate within specified limits and meet regulation requirements over
the following transient loading conditions anywhere within the specified load range of the
power supply. This shall be tested with no additional bulk capacitance added to the load.
Table 22 shows the transient loading.
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Power Sub-System
Table 22. Transient loading
Output
+12V
Step Size
60% of max
Slew Rate
0.5A/usec
Capacitive Load
2200uF
+5VSB
25% of max
0.5A/usec
1uF
Note: when test the transient loading, the 12V limit is +/-5%
3.5.7
Capacitive load
The power supply shall operate within specifications over the capacitive load defined. Table
23 shows the capacitive load.
Table 23. Capacitive Load
3.5.8
Output
+12V
Min
10uF
Max
11,000uF
+5VSB
1uF
350uF
Maximum load change
The power supply shall continue to operate normally when there is a step change < 1 A/uS
between minimum load and maximum load.
3.5.9
Load sharing control(+12V load sharing)
The +12V output shall have active load sharing. When operating at 50% of full load, the
output current of any two power supplies shall be within (+/-6.5%). For example, if power
supply #1 is operating at 20A, then all other power supplies within the system shall be
operating between 18.7A to 21.3A (+/-6.5% of 20A). all current sharing functions shall be
implemented internal to the power supply by making use of the 12VLS signal. The power
supply must connect the 12VLS signals between the power supplies together. The power
supply shall be able to share with up to 1+1 power supply in parallel.
If the load sharing is disabled by shorting the load share bus to ground, the power supply
shall continue to operate within regulation limits for loads less than or equal to the rating of
one power supply.
3.5.10
Output voltage rise time
The turn on waveform for the +12V output shall be monotonic with less than 5% of overshoot.
The rise time from 10 % (1.2V) to 90% (10.8V) shall be less than 50msec for a single power
supply.
3.5.11
Output voltage hold-up time
Upon loss of input voltage (at nominal), the output voltages shall remain in regulation for at
least 16msec.
3.5.12
Overshoot
Any output overshoot at turn on shall be less than 10% of the nominal output value. Any
overshoot shall recover to within the specified regulation in less than 0.5mS.
Revision 1.1
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Power Sub-System
3.5.13
Intel® Server System SR1695WB TPS
Temperature coefficient
After operating for 30 minutes or longer at 25℃ ambient, the output voltages shall not
change by more than +/-0.05% per degree C for any given line and load conditions.
3.6
Protection circuits
The 5VSB output shall remain on if the failure does not involve this output. When a
protection circuit shuts down a power supply, all the LED show a failed status and shall be
active, if the power supply latched off due to a protection circuit tripping. For AC power
supply module, an AC cycle off for 15 sec and PSON cycle high for 1 sec shall reset the
power supply, while For DC power supply module, a DC cycle off for 15 sec and PSON cycle
high for 1 sec shall reset the power supply. Else the power should auto-recover, when the
fail had been cleared or the power supply is within specification again.
3.6.1
+12V Over voltage protection
An over voltage condition shall measured on the +12V output of the power supply DC
connector. The power supply must shutdown and latch off when the +12V reaches the
voltage shown in Table 24. The latch can be cleared by togging the PSON signal or by an
AC or DC cycle off.
Table 24. +12V Over voltage protection requirements
Output
+12V
3.6.2
Min
13.3V
Max
14.5V
Units
VOLTS
Over current/short circuit protection
The power supply shall have current limit to prevent the +12V output from exceeding the
value shown in Table 23. The current limiting shall be of the constant current type for the
+12V.
The power supply shall auto-recover, when OCP/SCP had been cleared. The power supply
shall not be damaged power cycling in this condition.
Table 25. Over current/short circuit protection
Voltage
+12V
3.6.3
Over current limit
110% MIN; 150% MAX
Thermal protection
The power supply shall be protected against over temperature conditions caused by loss of
fan cooling or excessive ambient temperature. In an over temperature condition the PSU
shall be shut down with the exception of the 5VSB output. The power supply shall alert the
system of the OTP condition via the power supply the fail LED indicator. The power supply
will auto recover from this condition, when the temperature is within specification again. In
case of a fan fail, the power supply will latch off.
ƒ
Warning: 80°C (+/-6°C)
ƒ
Critical shut down: 90°C (+/-6°C)
ƒ
Re-start PSU: 75°C (+/-6°C)
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3.6.4
Power Sub-System
Thermal Fan Speed Control(External Control)
The power supply Fan shall be external control able through a hardware pin on the
connector. This function allows overwriting the MCU Fan control due to thermal stress at the
PDB. In normal operation the MCU controls the fan depending on Loading and internal
temperature. The Pin B3 (B/P fail) controls the internal Fan duty depending on voltage level
recognized, corresponding to Table 26.
Table 26. Fan Speed Control
Voltage @ Pin B3
< 1.00V
3.7
Fan Duty
MCU controlled
1.25V
50%
1.5V
60%
1.75V
70%
2.00V
80%
2.5V
100%
PMBus*
The PMBus* features are requirements for AC/DC silver box power supply for use in server
systems. It is also required to enable Intel® Intelligent Power Node Manager. This
specification is based on the PMBus* specifications part I and II, revision 1.1. The power
supply device address locations are shown below:
Figure 14. Power Supply Device Address Revision 1.1
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Cooling Sub-System
4.
Intel® Server System SR1695WB TPS
Cooling Sub-System
Several components and configuration requirements make up the cooling sub-system of the
chassis. These include processors, chipsets, VR heatsinks, system fan module, power
supply fans, CPU air duct, and drive bay population. All are necessary to provide and
regulate the air flow and air pressure needed to maintain the system’s thermals when
operating at or below the maximum specified thermal limits.
In order to maintain the necessary airflow within the system, you must properly install the air
duct and the top cover.
The chassis uses a variable fan speed control engine to provide adequate cooling for the
system at various ambient temperature conditions, under various server workloads, and with
the least amount of acoustic noise possible. The fans operate at the lowest speed for any
given condition to minimize acoustics.
Note: The server system does not support redundant cooling fans. If any of the fans fail, you
must power down the system as soon as possible to replace the fan.
4.1
CPU Heatsink
Two heatsinks are included in the system package. These heatsinks are designed for
optimal cooling and performance. Each processor is cooled by a passive heatsink. To
achieve better cooling performance, you must properly attach the heatsink bottom base with
TIM (thermal interface material). ShinEtsu* G-751 or 7783D or Honeywell* PCM45F TIM is
recommended. The mechanical performance of the heatsink must satisfy mechanical
requirement of Intel® Xeon® processors. To keep chipsets and VR temperature at or below
maximum temperature limit, the heatsink is required if necessary.
Figure 15. CPU Heatsink Overview
Note: The passive heatsink is Intel® standard thermal solution for 1U/2U rack chassis.
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4.2
Cooling Sub-System
Four-Fan Module
The system includes a fan assembly consisting of four managed 40x40x56 mm dual-rotor,
multi-speed fans. Four fans are separated into two types with different fan connectors.
The center two fans use two 4-pin connectors; each matches the processor fan header on
the server board. The outer two fans use one 8-pin connector; each matches the memory
fan header on the server board.
They provide the primary cooling for the processors, memory, and the hard drive bays on the
front panel. Each fan is designed for tool-less insertion to or removal from the fan module
housing.
The system fan module is designed for ease of use and supports several management
features that the server board management system can use.
Note: The fans are NOT hot-swappable. You must turn off the system to replace a failed fan.
Each fan within the module is capable of supporting multiple speeds. Fan speed changes
automatically when internal ambient temperature of the system or processor temperature
changes. The fan speed control algorithm is programmed into the server board’s BIOS.
Each fan connector within the module supplies a tachometer signal that allows the BMC to
monitor the status of each fan. If one of the fans should fail, the system fault LED on front
panel will light.
Note: There is a spare fan kit that contains one CPU cooling fan and one memory cooling
fan.
A
Memory Cooling Fans
B
Processor Cooling Fans
Figure 16. Fan Module Assembly
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Cooling Sub-System
Intel® Server System SR1695WB TPS
Each memory fan (Group A) uses 8-pin connector, which is connected to fan connector on
mother board (Connector BB and Q in Figure 5).
Each processor fan (Group B) uses 4-pin connector, which is connected to processor fan
connector on mother board (Connector S, T and Y, Z in Figure 5).
The fan connector pin-out definition is as follows:
Table 27. 4-pin Connector Pin-Out for Processor Cooling Fan
Pin
1
Signal Name
GND
Description
2
12V
3
Tach Out
FAN_TACH signal output
4
PWM In
PWM signal input
Ground
Power Supply +12 V
Table 28. 8-pin Connector Pin-Out for Memory Cooling Fan
4.3
Pin
1
Signal Name
GND
2
12V
Description
Ground
Power Supply 12 V
3
Tack0
Tach signal output from FAN0
4
PMW0
PWM control signal input for FAN0
5
GND
Ground
6
12V
Power Supply 12 V
7
Tach1
Tach signal output from FAN1
8
PWM1
PWM control signal input for FAN1
Power Supply Fan
Each power supply module supports one non-redundant 40 mm fan. The fans control the
cooling of the power supply and some drive bays. These fans are not replaceable.
Therefore, if a power supply fan fails, you must replace the power supply module.
4.4
Air Duct Module
The chassis requires the use of an air duct module to direct airflow over critical areas within
the system. The following provides a summary and description of Air Duct Module.
Figure 17. Air Duct Module
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Intel order number: E92079-002
Intel® Server System SR1695WB TPS
Cooling Sub-System
The following provides a description for Air Duct module assembling process.
Figure 18. Air Duct Module assembly process
4.5
Drive Bay Population Requirement
In order to maintain system thermal requirements, you must fully populate all hard drive
bays. Hard drive trays used for hot-swap drives must either have a hard drive installed or not
have a hard drive installed.
Important: If the drive bay is missing or not fully populated, the system will not meet the
thermal cooling requirements of the processor, which will most likely result in degraded
performance as a result of throttling or thermal shutdown of the system. It is recommended
to apply the air block on the blank HDD carrier if the installed HDD quantity is less than four
pieces.
Figure 19. Hot-swap HDD Tray with SAS/SATA HDD Installed
Revision 1.1
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Peripheral Drive Support
5.
Intel® Server System SR1695WB TPS
Peripheral Drive Support
The system provides a slim-line drive bay that can populate with a SATA optical drive (CDROM, DVD, and DVD/CD-R). The drive is mounted on a tool-less tray, which allows for easy
installation into and removal from the system. The slim-line device is not hot-swappable. It is
recommended to use Intel® validated optical drive..
Figure 20. View of Slim-line Drive Bay (in Deep Black)
The drive is directly connected to a SATA cable and a SATA power cable. The other end of
the SATA cable is connected to one SATA port on the server board.
Table 29. Optical Drive SATA Connector Pin-out
Pin
1
2
Signal Name
Description
GND
Ground
SATA_TX_P
Positive side of transmit differential pair
3
SATA_TX_N
Negative side of transmit differential pair
4
GND
Ground
5
SATA_RX_N
Negative side of receive differential pair
6
SATA_RX_P
Positive side of receive differential pair
7
GND
Ground
Table 30. Optical Drive SATA Power Connector Pin-out
Pin
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
Signal Name
Not Used
Not Used
Not Used
GND
GND
GND
P5V
P5V
P5V
GND
Reserved
GND
P12V
P12V
P12V
Description
Ground
Ground
Ground
Power supply 5V
Power supply 5V
Power supply 5V
Ground
Ground
Power supply 12V
Power supply 12V
Power supply 12V
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6.
Hard Disk Drive Support
Hard Disk Drive Support
The server system provides four hard drive bays at the front of the chassis. You can
populate all hard drive bays with a carrier-mounted 3.5-inch or 2.5-inch SATA or SAS hard
disk drives.
6.1
Hard Disk Drive Bays
The server system 1U chassis can support up to four carrier-mounted SATA or SAS 3.5-inch
or 2.5-inch hard disk drives. The drives may be “electrically” hot-swapped while the system
power is applied, but you must take caution before hot-swapping while the system is
functioning under operating system/application control or data may be lost.
Note: All drive bays (0 through 3) are controlled by the server board or the RAID controller
card.
Figure 21. HDD Bays and Numbering
If a failed drive needs replacing, it is recommended you replace it with the same
manufacturer, model, and capacity.
6.2
Hard Drive Trays
You can use hard drive trays for 3.5-inches or 2.5-inches hot-swap hard drive configurations.
Hot-swap drive trays make insertion and extraction of the drive from the system very simple.
Each drive tray has its own latching mechanism, which is used to both insert and extract
drives from the chassis and lock the tray in place. Each drive tray supports two light pipes to
direct light from the drive status LEDs on the backplane to the tray’s face allowing it to be
viewable from the front of the system.
Figure 22. 3.5-inch HDD Assembly Overview
Revision 1.1
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Hard Disk Drive Support
Intel® Server System SR1695WB TPS
Figure 23. 2.5-inch HDD Assembly Overview
6.3
Hot-Swap Hard Drive Support
The Intel® Server System SR1695WB can support up to four hot-swap SATA or SAS hard
drives. Hard drives interface with the passive backplane through a blind mate connection
when drives are installed into a hard drive bay using hot-swap drive trays.
The passive backplane acts as an intermediate pass-through interface board where SATA
ports of the server board or add-in SAS/SATA controller are cabled to the backplane. The on
board Intel® 82801Jx I/O Controller Hub provides the necessary drive interface. You can
also connect the passive backplane to an add-in PCI Express* based SAS/SATA RAID card.
The following sections describe the feature and connections between the backplane and
server board.
6.3.1
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
Backplane Feature set:
Vitesse* VSC410 enclosure management controller
Integrated v3000 32 bit RISC microprocessor core
External non-volatile Flash ROM
Four I2C interfaces
44 GPIO pins
Four drive control connectors supporting either SATA ports from the server board or
SAS/SATA ports from an add-in RAID card
Support for up to four hot-swap SAS/SATA drives
4x2 hard drive activity/fault LEDs
2x4 pin power connector
One 4-pin IPMB connector
One 4-pin SMBus connector
One 4-pin SGPIO connector
One 3-pin SES connector
Four internal SAS/SATA connectors
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6.3.2
Hard Disk Drive Support
Backplane Block Diagram:
Figure 24. Passive Backplane Block Diagram
6.3.3
Backplane Connector Definition
The following diagrams show the layout of major components and connectors for backplane.
A
HDD Connectors 0~3 (left to right)
B
HDD On-line LEDs 0~3 (left to right)
C
HDD Act/Fault LEDs 0~3 (left to right)
Figure 25. Backplane Component and Connectors (Front View)
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Hard Disk Drive Support
Intel® Server System SR1695WB TPS
A
4-pin power connectors 1~2 for backplane
B
SATA/SAS connectors 0~3 (right to left)
C
4-pin SGPIO connector
D
4-pin SMBus connector
E
3-pin SES connector
F
4-pin IPMB connector
Figure 26. Backplane Component and Connectors (Back View)
6.3.4
Backplane LED Support
The backplanes support both HDD online and activity/fault LEDs for each of the hard drive
connectors. A light duct in HDD tray is used to conduct LED light to front panel. The
following lists LED functionality.
Figure 27. Hard Drive Tray LED Locations
Table 31. Hard Drive Tray LED Functions
LED color
Power LED
Blue
Green
Activity LED
Amber
Condition
ON
Description
HDD On-line
OFF
HDD Not On-line
OFF
Standby/Stopped
Flashing(on 0.5s off 0.5s)
Spin-Up/Spin-Down
ON
Active/Idle power
Flashing(on 1s off 1s)
Formatting
ON
Fault
Flashing(on 0.5s off 0.5s)
Rebuild
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6.3.5
Hard Disk Drive Support
Backplane Connector Definition
The backplanes include several different connectors. This section defines the purpose and
pin out associated with each.
1)
Power Connector(J1A1, J5A1)
The backplane provides power to the three hard drive bays and the slim-line drive bay. An 8pin power cable is routed from the power supply and plugs into two 4-pin shrouded plastic
PC power connector on the backplane. The following table shows the power connector pinout.
Table 32. Backplane Power Connector Pin-out
Pin
2)
Signal
Pin
Signal
1
COM
3
+5VDC
2
+12VDC
4
+3V3DC
Hot-Swap SATA/SAS Drive Connectors(JC2L1, JC4L1, JC6L1, JC9L1)
The backplanes provide four hot-swap SATA/SAS connectors, which provide power and
signals using a single docking connector. Each drive attaches to the backplane using one of
these connectors.
Table 33. Hot-Swap SATA/SAS Connector Pin-out
Pin#
SI
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
PTH0
PTY1
Signal Description
Ground
SAS#_TX_DP (# = 0…2)
SAS#_TX_DN (# = 0…2)
Ground
SAS#_RX_DN (# = 0…2)
SAS#_RX_DP (# = 0…2)
Ground
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Ground
Ground
P3V3
P5V
P5V
P5V
Ground
LED_SAS#_ACT_L (# = 0…2)
Ground
P12V
P12V
P12V
Ground
Ground
Revision 1.1
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Hard Disk Drive Support
3)
Intel® Server System SR1695WB TPS
SATA/SAS Drive Control Connectors (J1A2, J4A1, J6A2, and J8A2)
The passive backplane includes four drive control connectors. These are used to attach
SATA/SAS cables from the backplane to either the SATA ports on the server board, or to
SAS/SATA ports from an add-in card. Each drive control connector has the following pin-out.
Table 34. SATA/SAS Drive Control Connector Pin-out
Pin#
1
2
3
4
5
6
7
4)
Description
GROUND
SATA # TX_DP (# = 0,1,2)
SATA # TX_DN (# = 0,1,2)
GROUND
SATA # RX_DN (# = 0,1,2)
SATA # RX_DP (# = 0,1,2)
GROUND
System Management(IPMB) Connector(J9A1)
The backplanes provide connectors to interface with system management buses. The
following tables define the pin-out for each of these connectors.
Table 35. IPMB Connector Pin-out
Pin #
1
2
3
4
5)
Description
SMB_5VSB_IPMB_DAT
GND
SMB_5VSB_IPMB_CLK
SMB_PWR_IPMB_CONN
System Management Bus (SMBus) Connector (J8A1)
The backplanes provide connectors to interface with System Management Bus. The
following tables define the pin-out for each of this connector.
Table 36. SMBus Connector Pin-out
Pin #
1
2
3
4
6)
Description
SMB_5V_DAT
GND
SMB_5V_CLK
GND
System General Purpose IO (SGPIO) Connector (J4A2)
The backplanes provide connectors to interface with System General Purpose IO control.
The following tables define the pin-out for each of this connector.
Table 37. SGPIO Connector Pin-out
Pin #
1
2
3
4
Description
Data In
Data Out
End Control
Clock
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Intel® Server System SR1695WB TPS
7)
Hard Disk Drive Support
SCSI Enclosure Services (SES) Connector (J9A2)
The backplanes provide connectors to interface with SCSI Enclosure Services (SES)
signals. The following tables define the pin-out for each of this connector.
Table 38. SES Connector Pin-out
Pin #
1
2
3
Description
SMB_HBA_I2C_DAT
GND
SMB_HBA_I2C_CLK
Revision 1.1
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Intel® Server System SR1695WB TPS
7.
Front Panel Control and Indicators
Front Panel Control and Indicators
The Intel® Server System SR1695WB Front Control Panel integrates control buttons, LEDs,
and USB ports. The control panel assembly is pre-assembled and fixed to the chassis.
A
B
C
D
E
F
G
H
I
Power/Sleep Button
System Reset Button
Power/Sleep LED
System NIC 1 Activity LED
System NIC 2 Activity LED
System Identification LED
System Status LED
System Identification Button
USB 2.0 Connectors – Port 0/1
Figure 28. Front Control Panel
7.1
Control Panel Button
The following table lists the control panel features and functions. The control panels features
a system power button.
Table 39. Front Control Button Function
Feature
Function
Toggles the system power on/off. This button also functions as a
Sleep Button if enabled by an ACPI-compliant operating system.
Reset system to reboot
Turn On/turn off ID LED
Power/Sleep Button
System Reset Button
System ID Button
7.2
Control Panel LED Indicators
The control panel houses five LEDs, which are viewable to display the system’s operating
status.
The following table identifies each LED and describes their functionality.
Table 40. Front LED Indicator Functions
LED Indicator
Color
Condition
What it describes
Green
On
Power On/ACPI S0 state
Green
Blink
Sleep /ACPI S1 state
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Front Panel Control and Indicators
LED Indicator
LAN 1 and LAN 2
Intel® Server System SR1695WB TPS
Color
Condition
What it describes
-
Off
Power Off /ACPI S5 state
Green
On
LAN Link no Access
Green
Blink
LAN Activity
-
Off
No Link
System ID
Blue
On
Identify Active via command or button
-
Off
No Identification
System Status
Green
On
System Ready/No Alarm
Green
Blink
System ready, but degraded: redundancy lost such
as the power supply or fan failure; non-critical
temp/voltage threshold; battery failure; or predictive
power supply failure.
Amber
On
Critical Alarm: Critical power modules failure, critical
fans failure, voltage (power supply), critical
temperature and voltage
Amber
Blink
Non-Critical Alarm: Redundant fan failure, redundant
power module failure, non-critical temperature and
voltage
-
Off
Power off: System unplugged
Power on: System powered off and in standby, no
prior degraded\non-critical\critical state
Note:
Blink rate is ~1 Hz at 50% duty cycle.
It is also off when the system is powered off (S5) or in a sleep state (S1).
The power LED sleep indication is maintained on standby by the chipset. If the system is powered down without
going through the BIOS, the LED state in effect at the time of power off is restored when the system is powered
on until the BIOS clear it.
If the system is not powered down normally, it is possible the Power LED will blink at the same time the system
status LED is off due to a failure or configuration change that prevents the BIOS from running.
7.2.1
Power/Sleep LED
Table 41. SSI Power LED Operation
State
Power Off
Power On
Power Mode
Non-ACPI
Non-ACPI
LED
Off
Solid On
S5
ACPI
Off
S1 Sleep
ACPI
Blink
S0
ACPI
Solid On
Description
System power is off and the BIOS has not initialized the chipset.
System power is on but the BIOS has not yet initialized the
chipset.
Mechanical is off and the operating system has not saved any
context to the hard disk.
DC power is still on. The operating system has saved context and
gone into a level of low-power state.
System and the operating system are up and running.
Note: Blink rate is ~ 1Hz at 50% duty cycle.
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7.2.2
Front Panel Control and Indicators
System Status LED
Table 42. System Status LED Operation
Color
Off
N/A
State
Criticality
Not ready
Description
Power off or BMC initialization completes if no degraded, noncritical, critical, or non-recoverable conditions exist after power cable
plug in
Green/
Amber
Both Solid
On
Not ready
Pre DC Power On – 15-20 second BMC Initialization when AC is
applied to the server. The system will not POST until BMC
initialization completes.
Green
Solid on
Ok
System ready
Green
Blink
Degraded
BIOS detected
1. Unable to use all of the installed memory (more than one DIMM
installed).1
2. In a mirrored configuration, when memory mirroring takes place
and system loses memory redundancy. This is not covered by
(2). 1
3. PCI Express* correctable link errors.
Integrated BMC detected
1. Redundancy loss such as a power supply or fan. Applies only if
the associated platform subsystem has redundancy capabilities.
2. CPU disabled – if there are two CPUs and one CPU is disabled.
3. Fan alarm – Fan failure. Number of operational fans should be
more than minimum number needed to cool the system.
4. Non-critical threshold crossed – Temperature, voltage, power
nozzle, power gauge, and PROCHOT2 (Therm Ctrl) sensors.
5. Battery failure.
6. Predictive failure when the system has redundant power
supplies.
Amber
Blink
Non-critical
Non-fatal alarm – system is likely to fail
BIOS Detected
1. In non-mirroring mode, if the threshold of ten correctable errors
is crossed within the window.1
2. PCI Express* uncorrectable link errors.
Integrated BMC Detected
1. Critical threshold crossed – Voltage, temperature, power nozzle,
power gauge, and PROCHOT (Therm Ctrl) sensors.
2. VRD Hot asserted.
3. Minimum number of fans to cool the system are not present or
have failed.
Amber
Solid on
Critical, nonrecoverable
Fatal alarm – system has failed or shutdown
BIOS Detected
1. DIMM failure when there is one DIMM present and no good
1
memory is present.
2. Run-time memory uncorrectable error in non-redundant mode.1
3. CPU configuration error (for instance, processor stepping
mismatch).
Integrated BMC Detected
1. CPU CATERR signal asserted.
2. CPU 1 is missing.
3. CPU THERMTRIP.
4. No power good – power fault.
Power Unit Redundancy sensor – Insufficient resources
offset (indicates not enough power supplies are present).
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Front Panel Control and Indicators
Intel® Server System SR1695WB TPS
Notes:
1. The BIOS detects these conditions and sends a Set Fault Indication command to the Integrated BMC to
provide the contribution to the system status LED
2. Blink rate is ~ 1Hz at 50% duty cycle.
7.2.3
System Status LED – BMC Initialization
When power is first applied to the system and 5V-STBY is present, the BMC controller on
the server board requires 15-20 seconds to initialize. During this time, the system status LED
will be solid on, both amber and green. Once BMC initialization has completed, the status
LED will stay green solid on. If power button is pressed before BMC initialization completes,
the system will not boot to POST.
7.2.4
System Identification LED
The system ID LED provides a visual indication of a system being serviced. The state of the
system ID LED is affected by the following:
ƒ
ƒ
ƒ
Toggled by the system ID button
Controlled by the Chassis Identify command (IPMI)
Controlled by the Chassis Identify LED command (OEM)
Table 43. System ID LED Indicator States
State
Identify active via button
LED State
Solid on
Identify active via command
~1 Hz blink
Off
Off
There is no precedence or lock-out mechanism for the control sources. When a new request
arrives, all previous requests are terminated. For example, if the system ID LED is blinking
and the system ID button is pressed, then the system ID LED changes to solid on. If the
button is pressed again with no intervening commands, the system ID LED turns off.
Front Panel Connectors
7.3
Front Panel uses 2 cables to connect with motherboard, one is 24-pin SSI control panel
cable to J1D3 on motherboard, another is 10-pin 2 ports USB cable to J9A2 (USB port 0/1)
on motherboard.
The pin-out for SSI control cable is as follows:
Table 44. Front Panel SSI connector pin-out
1
Pin
Signal Name
P3V3_STBY (Power LED Anode)
Pin
2
Signal Name
P3V3_STBY (Front Panel Power)
3
Key
4
P5V_STBY (ID LED Anode)
5
FP_PWR_LED_N
6
FP_ID_LED_BUF_N
7
P3V3 (HDD Activity LED Anode)
8
FP_LED_STATUS_GREEN_N
9
LED_HDD_ACTIVITY_N
10
FP_LED_STATUS_A MBER_N
11
FP_PWR_BTN_N
12
NIC1_ACT_LED_N
13
GND (Power Button GND)
14
NIC1_LINK_LED_N
15
BMC_RST_BTN_N
16
SMB_SENSOR_3V3STB_DATA
Revision 1.1
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Intel® Server System SR1695WB TPS
Front Panel Control and Indicators
Pin
17
Signal Name
GND (Reset GND)
Pin
18
Signal Name
SMB_SENSOR_3V3STB_CLK
19
FP_ID_BTN_N
20
FP_CHASSIS_INTRU
21
NC
22
NIC2_ACT_LED_N
23
FP_NMI_BTN_N
24
NIC2_LINK_LED_N
Front panel USB connector pin-out is as follows:
Table 45. Front Panel USB connector pin-out
Pin
Signal Name
Pin
2
Signal Name
Key Pin
1
NC
3
GND
4
GND
5
USB_P
6
USB_P
7
USB_N
8
USB_N
9
+5V
10
+5V
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Revision 1.1
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Configuration Jumpers
8.
Intel® Server System SR1695WB TPS
Configuration Jumpers
The following table provides a summary and description of configuration, test, and debug
jumpers on the Intel® Server Board S5500WB, which is used in Intel® Server System
SR1695WB.
Figure 29. Jumper Locations and Functions
Revision 1.1
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Intel® Server System SR1695WB TPS
Configuration Jumpers
Force Integrated BMC Update (J1B5)
8.1
When performing a standard BMC firmware update procedure, the update utility places the
BMC into an update mode, allowing the firmware to load safely onto the flash device. In the
unlikely event the BMC firmware update process fails due to the BMC not being in the proper
update state, the server board provides a BMC Force Update jumper (J1B5) that forces the
BMC into the proper update state. You must complete the following procedure in the event
the standard BMC firmware update process fails.
Table 46. Force Integrated BMC Update Jumper
Jumper Position
1-2
Mode of Operation
Normal
2-3
Update
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
Note
Integrated BMC GPIO [1] is pulled HIGH. Default position.
Integrated BMC GPIO [1] is pulled LOW.
Power down and remove the power cord.
Open the server chassis. Refer to your server chassis documentation for
instructions.
Move the jumper from the default operating position, covering pins 1 and 2, to the
enabled position, covering pins 2 and 3.
Close the server chassis.
Reconnect the power cord and power up the server.
Perform the BMC firmware update procedure as documented in the README.TXT
file included in the given BMC firmware update package. After the successful
completion of the firmware update process, the firmware update utility may
generate an error stating the BMC is still in update mode.
Power down and remove the power cord.
Open the server chassis.
Move the jumper from the enabled position, covering pins 2 and 3 to the disabled
position, covering pins 1 and 2.
Close the server chassis.
Reconnect the power cord and power up the server.
Note: Normal BMC functionality is disabled when the Force BMC Update jumper is set to the
enabled position. You should never run the server with the BMC Force Update jumper set in
this position. You should only use this jumper setting when the standard firmware update
process fails. This jumper should remain in the default/disabled position when the server is
running normally.
Password Clear (J1C2)
8.2
This 3-pin jumper is used to clear the BIOS password.
Table 47. BIOS Password Clear Jumper
Jumper Position
1-2
Mode of Operation
Normal
Note
ICH10R INTRUDER# pin is pulled HIGH. Default position.
2-3
Clear Password
ICH10R INTRUDER# pin is pulled LOW.
8.2.1
1.
2.
3.
4.
Clearing the BIOS Password
Power down server. Do not unplug the power cord.
Open the chassis. For instructions, refer to your server chassis documentation.
Move the jumper (J1B6) from the default operating position, covering pins 1 and 2,
to the password clear position, covering pins 2 and 3.
Close the server chassis.
40
Revision 1.1
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Configuration Jumpers
5.
6.
7.
8.
9.
Intel® Server System SR1695WB TPS
Power up the server, wait 10 seconds or until POST completes.
Power down the server.
Open the chassis and move the jumper back to default position, covering pins 1 and
2.
Close the server chassis.
Power up the server. The password is now cleared and you can reset it by going into
the BIOS setup. The BIOS password is now cleared.
BIOS Recovery Mode (J1C3)
8.3
The Intel® Server Board S5500WB uses the BIOS recovery to repair the system BIOS from
flash corruption in the main BIOS and Boot Block. This 3-pin jumper is used to reload the
BIOS when the image is suspected to be corrupted. For instructions on how to recover the
BIOS, refer to the specific BIOS release notes.
Table 48. BIOS Recovery Mode Jumper
Jumper Position
1-2
Mode of Operation
Normal
2-3
Recovery
Note
ICH10R GPIO [55] is pulled HIGH. Default position.
ICH10R GPIO [55] is pulled LOW.
Reset BIOS Configuration (J1B4)
8.4
This jumper used to be the CMOS Clear jumper. The BIOS has moved CMOS data to the
NVRAM region of the BIOS flash since the previous generation. The BIOS checks during
boot to determine if the data in the NVRAM must be set to default.
Table 49. Reset BIOS Jumper
Jumper Position
1-2
Mode of Operation
Normal
2-3
Reset BIOS Configuration
8.4.1
Note
ICH10R RTCRST# pin is pulled HIGH. Default position.
ICH10R RTCRST# pin is pulled LOW.
Clearing the CMOS
1.
2.
Power down server. Do not unplug the power cord.
Open the server chassis. For instructions, refer to your server chassis
documentation.
3. Move the jumper (J1B4) from the default operating position, covering pins 1 and 2,
to the reset/clear position, covering pins 2 and 3.
4. Wait five seconds.
5. Remove power cable.
6. Move the jumper back to default position, covering pins 1 and 2.
7. Close the server chassis.
8. Power up the server.
The CMOS settings are now cleared.
Note: Removing power before performing the CMOS Clear operation causes the system to
automatically power up and immediately power down, after the procedure is followed and
power is re-applied. If this happens, remove the power cord again, wait 30 seconds, and reinstall the power cord. Power up system and proceed to the <F2> BIOS Setup Utility to reset
the preferred settings.
Revision 1.1
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Intel® Server System SR1695WB TPS
8.5
Configuration Jumpers
Video Master (J6A3)
This jumper is used to set the video output port if both internal and external add-in video
card are used.
Table 50. Video Master Jumper
Jumper Position
1-2
2-3
8.6
Mode of Operation
Internal
External
Note
Internal connector overrides if both connectors are used.
External connector overrides if both connectors are used.
Serial Interface (J6A2)
This jumper is used to set the communication mode of serial port.
Table 51. Serial Interface Jumper
Pins
1–2
2–3
None
Mode
DTR
DCD
DSR
Description
Data Terminal Ready
Data Carrier Detect
Data Set Ready
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PCI Riser Card and Assembly
9.
Intel® Server System SR1695WB TPS
PCI Riser Card and Assembly
Each Intel® Server System SR1695WB includes one PCI Express* riser slot that accepts
one PCI Express* x16 full height or low profile adapter card. The riser also accommodates
PCI Express x8, x4, and x1 adapters.
Figure 30. 1U PCI Express* Riser Card Mechanical Drawing
Figure 31. Intel® Server System SR1695WB PCI Express* Riser Assembly
Note: The PCI Express* riser card is separately orderable as spare.
Revision 1.1
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Intel® Server System SR1695WB TPS
Environmental and Regulatory Specifications
10. Environmental and Regulatory Specifications
10.1
System Level Environmental Limits
The following table defines the system level operating and non-operating environmental
limits.
Table 52. System Office Environmental Summary
Parameter
Operating Temperature
Limits
+10 C to +35 C with the maximum rate of change not to exceed 10 C per
hour
Non-Operating
Temperature
-40 C to +70 C
Non-Operating Humidity
50%- 90%, non-condensing with a maximum wet bulb of 28 C
Acoustic noise
Sound Pressure: 55 dBA (Rackmount) in an idle state at typical office
ambient temperature. (23 C +/- 2 C) Sound Power: 7.0 BA in an idle state at
typical office ambient temperature. (23 +/- 2 degrees C)
Shock, operating
Half sine, 2 g peak, 11 mSec
Shock, unpackaged
Trapezoidal, 25 g, velocity change 136 inches/sec (≧40 lbs to > 80 lbs)
Shock, packaged
Non-palletized free fall in height 24 inches (≧40 lbs to > 80 lbs)
Vibration, unpackaged
5 Hz to 500 Hz, 2.20 g RMS random
Shock, operating
Half sine, 2 g peak, 11 mSec
ESD
+/-15kV except I/O port +/-8KV per Intel Environmental test specification
System Cooling
Requirement in BTU/Hr
2050 BTU/hour
EMI operating
Required to meet EMI emission requirements, tested as part of system
10.2
®
Serviceability and Availability
The system is designed to be serviced by qualified technical personnel only.
The desired Mean Time To Repair (MTTR) the system is 30 minutes, which includes
diagnosing the system’s problem. To meet this goal, the system enclosure and hardware
was designed to minimize the MTTR.
The following are the maximum time a trained field service technician should take to perform
the listed system maintenance procedures after diagnosing the system and identifying the
failed component(s).
Table 53. Maintenance Activity Duration
Activity
Remove and replace top cover
Remove and replace hard disk drive
Remove and replace power supply module(include cable routing)
Remove and replace system fan(each)
Remove and replace backplane board(include cable routing)
Remove and replace server board(include cable routing)
44
Time Estimate
26 sec
1 min
4 min 3sec
1 min 10sec
8 min 20 sec
15 min 40 sec
Revision 1.1
Intel order number: E92079-002
Environmental and Regulatory Specifications
10.3
Intel® Server System SR1695WB TPS
Replacing the Backup Battery
The lithium battery on the server board powers the real time clock (RTC) for up to 10 years
in the absence of power. When the battery starts to weaken, it loses voltage, and the server
settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong.
Contact your customer service representative or dealer for a list of approved devices.
WARNING
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type
recommended by the equipment manufacturer. Discard
used batteries according to manufacturer’s instructions.
ADVARSEL!
Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri af samme fabrikat
og type. Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Lithiumbatteri - Eksplosjonsfare. Ved utskifting benyttes
kun batteri som anbefalt av apparatfabrikanten. Brukt
batteri returneres apparatleverandøren.
VARNING
Explosionsfara vid felaktigt batteribyte. Använd samma
batterityp eller en ekvivalent typ som rekommenderas av
apparattillverkaren. Kassera använt batteri enligt
fabrikantens instruktion.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan
suosittelemaan tyyppiin. Hävitä käytetty paristo
valmistajan ohjeiden mukaisesti.
10.4
Product Regulatory Compliance
The server chassis product, when correctly integrated per this guide, complies with the
following safety and electromagnetic compatibility (EMC) regulations.
Intended Application – This product was evaluated as Information Technology Equipment
(ITE), which may be installed in offices, schools, computer rooms, and similar commercial
type locations. The suitability of this product for other product categories and environments
(such as: medical, industrial, telecommunications, NEBS, residential, alarm systems, test
equipment, etc.), other than an ITE application, may require further evaluation.
Revision 1.1
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Environmental and Regulatory Specifications
Notifications to Users on Product Regulatory Compliance and Maintaining
Compliance – To ensure regulatory compliance, you must adhere to the assembly
instructions in this guide to ensure and maintain compliance with existing product
certifications and approvals. Use only the described, regulated components specified in this
guide. Use of other products/components will void the UL listing and other regulatory
approvals of the product and will most likely result in noncompliance with product regulations
in the region(s) in which the product is sold.
To help ensure EMC compliance with your local regional rules and regulations, before
computer integration, make sure that the chassis, power supply, and other modules have
passed EMC testing using a server board with a microprocessor from the same family (or
higher) and operating at the same (or higher) speed as the microprocessor used on this
server board. The final configuration of your end system product may require additional EMC
compliance testing. For more information please contact your local Intel Representative. This
is an FCC Class A device and its use is intended for a commercial type market place.
10.5
Use of Specified Regulated Components
To maintain the UL listing and compliance to other regulatory certifications and/or
declarations, the following regulated components must be used and conditions adhered to.
Interchanging or use of other component will void the UL listing and other product
certifications and approvals.
Updated product information for configurations can be found on the Intel Server Builder Web
site at the following URL:
http://channel.intel.com/go/serverbuilder
If you do not have access to Intel’s Web address, please contact your local Intel
representative.
Server chassis (base chassis is provided with power supply and fans) – NRTL listed.
Server board – you must use an Intel server board – UL recognized.
Add-in boards – must have a printed wiring board flammability rating of minimum
UL94V-1. Add-in boards containing external power connectors and/or lithium
batteries must be UL recognized or UL listed. Any add-in board containing modem
telecommunication circuitry must be UL listed. In addition, the modem must have
the appropriate telecommunications, safety, and EMC approvals for the region in
which it is sold.
Peripheral Storage Devices – must be UL recognized or UL listed accessory and
TUV or VDE licensed. Maximum power rating of any one device or combination of
devices can not exceed manufacturer’s specifications. Total server configuration is
not to exceed the maximum loading conditions of the power supply.
The following table references Server Chassis Compliance and markings that may appear
on the product. Markings below are typical markings however, may vary or be different
based on how certification is obtained.
Note: Certifications Emissions requirements are to Class A.
46
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Environmental and Regulatory Specifications
Intel® Server System SR1695WB TPS
Table 54. Product Safety and Electromagnetic (EMC) Compliance
Compliance Regional Description
Australia/New Zealand
Argentina
Compliance
Reference
Compliance Reference Marking Example
AS/NZS CISPR22 (Emissions)
N232
IRAM Certification (Safety)
CSA 60950-1 – UL 60950-1
(Safety) Listing
Canada/USA
Industry Canada ICES-003
(Emissions)
FCC
CFR 47, Part 15 (Emissions)
CENELEC Europe
Germany
International
None Required
CB Certification – IEC60950-1
CISPR 22/CISPR 24
VCCI Certification
Korea
KCC Certification
MIC Notice No. 1997-41 (EMC) &
1997-42 (EMI)
Ukraine
This device complies with Part 15 of the
FCC Rules. Operation of this device is
subject to the following two conditions:
(1) This device may not cause harmful
interference, and (2) This device must
accept interference receive, including
interference that may cause undesired operation.
Low Voltage Directive
2006/95/EC(Europe – EN60950-1);
EMC Directive 2004/108/EEC
EN55022 (Emissions)
EN55024 (Immunity)
EN61000-3-2 (Harmonics)
EN61000-3-3 (Voltage Flicker)
CE Declaration of Conformity
GS Certification – EN60950-1
Japan
Russia
CANADA ICES-003 CLASS A
CANADA NMB-003 CLASSE A
인증번호: CPU-SR1695(A)
GOST-R 50377-92 Certification
GOST R 29216-91 (Emissions)
GOST R 50628-95 (Immunity)
Ukraine Certification
Revision 1.1
MO04
None Required
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Intel order number: E92079-002
Intel® Server System SR1695WB TPS
Compliance Regional Description
Taiwan
10.6
10.6.1
Environmental and Regulatory Specifications
Compliance
Reference
Compliance Reference Marking Example
BSMI CNS13438
BSMI CNS14336
R33025
Electromagnetic Compatibility Notices
USA
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses, and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
ƒ
Reorient or relocate the receiving antenna.
ƒ
Increase the separation between the equipment and the receiver.
ƒ
Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
ƒ
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could
void the user’s authority to operate the equipment. The customer is responsible for ensuring
compliance of the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with
FCC Class B limits may be attached to this computer product. Operation with noncompliant
peripherals is likely to result in interference to radio and TV reception.
48
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Environmental and Regulatory Specifications
Intel® Server System SR1695WB TPS
All cables used to connect to peripherals must be shielded and grounded. Operation with
cables, connected to peripherals that are not shielded and grounded may result in
interference to radio and TV reception.
10.6.2
ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils
numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Appareils
Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.
(English translation of the notice above) This digital apparatus does not exceed the Class A
limits for radio noise emissions from digital apparatus set out in the interference-causing
equipment standard entitled “Digital Apparatus,” ICES-003 of the Canadian Department of
Communications.
10.6.3
Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage
Directive (73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with
the CE Mark to illustrate its compliance.
10.6.4
Japan EMC Compatibility
Electromagnetic Compatibility Notices (International)
English translation of the notice above:
This is a Class A product based on the standard of the Voluntary Control Council For
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or
television receiver in a domestic environment, it may cause radio interference. Install and
use the equipment according to the instruction manual.
10.6.5
BSMI (Taiwan)
The BSMI Certification number and the following warning is located on the product safety
label which is located on the bottom side (pedestal orientation) or side (rack mount
configuration).
Revision 1.1
49
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Intel® Server System SR1695WB TPS
10.6.6
Environmental and Regulatory Specifications
KCC (Korea)
Following is the KCC certification information for Korea.
인증번호: CPU-SR1695 (A)
10.7
Rack Mount Installation Guidelines
Anchor the equipment rack: The equipment rack must be anchored to an unmovable support
to prevent it from falling over when one or more servers are extended in front of the rack on
slides. You must also consider the weight of any other device installed in the rack. A crush
hazard exists should the rack tilt forward which could cause serious injury.
Temperature: The temperature, in which the server operates when installed in an
equipment rack, must not go below 5 °C (41 °F) or rise above 40 °C (104 °F). Extreme
fluctuations in temperature can cause a variety of problems in your server.
Ventilation: The equipment rack must provide sufficient airflow to the front of the server
to maintain proper cooling. The rack must also include ventilation sufficient to exhaust a
maximum of 1023 BTUs (British Thermal Units) per hour for the server. The rack
selected and the ventilation provided must be suitable to the environment in which the
server will be used.
10.7.1
If AC power supplies are installed:
Mains AC power disconnection: The AC power cord(s) is considered the mains
disconnect for the server and must be readily accessible when installed. If the individual
server power cord(s) will not be readily accessible for disconnection then you are
responsible for installing an AC power disconnect for the entire rack unit. This main
disconnect must be readily accessible, and it must be labeled as controlling power to the
entire rack, not just to the server(s).
Grounding the rack installation: To avoid the potential for an electrical shock hazard, you
must include a third wire safety ground conductor with the rack installation. If the server
power cord is plugged into an AC outlet that is part of the rack, then you must provide
proper grounding for the rack itself. If the server power cord is plugged into a wall AC
outlet, the safety ground conductor in the power cord provides proper grounding only for
the server. You must provide additional, proper grounding for the rack and other devices
installed in it.
Overcurrent protection: The server is designed for an AC line voltage source with up to 20
amperes of overcurrent protection per cord feed. If the power system for the equipment
rack is installed on a branch circuit with more than 20 amperes of protection, you must
provide supplemental protection for the server.
50
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Environmental and Regulatory Specifications
10.7.2
Intel® Server System SR1695WB TPS
If DC power supplies are installed:
Connection with a DC (Direct Current) source should only be performed by trained service
personnel. The server with DC input is to be installed in a Restricted Access
Location in accordance with articles 110-16, 110-17, and 110-18 of the National Electric
Code, ANSI/NFPA 70. The DC source must be electrically isolated by double or reinforced
insulation from any hazardous AC source.
Main DC power disconnect: You are responsible for installing a properly rated DC power
disconnect for the server system. This mains disconnect must be readily accessible, and it
must be labeled as controlling power to the server. The circuit breaker of a centralized DC
power system may be used as a disconnect device when easily accessible and should be
rated no more than 10 amps.
Grounding the server: To avoid the potential for an electrical shock hazard, you must
reliably connect an earth grounding conductor to the server. The earth grounding
conductor must be a minimum 18AWG connected to the earth ground stud(s) on the rear
of the server. The safety ground conductor should be connected to the chassis stud with a
Listed closed two-hole crimp terminal having 5/8 inch pitch. The nuts on the chassis earth
ground studs should be installed with a 10 in/lbs torque. The safety ground conductor
provides proper grounding only for the server. You must provide additional, proper grounding
for the rack and other devices installed in it.
Overcurrent protection: Overcurrent protection circuit breakers must be provided as part
of each host equipment rack and must be incorporated in the field wiring between the DC
source and the server. The branch circuit protection shall be rated minimum 75Vdc, 10 A
maximum per feed pair. If the DC power system for the equipment rack is installed with
more than 10 amperes of protection, you must provide supplemental protection for the
server.
10.8
Power Cord Usage Guidelines
Warning: Do not attempt to modify or use a power cord set that is not the exact type required.
You must use a power cord set that meets the following criteria:
• Rating: In the U.S. and Canada, cords must be UL (Underwriters Laboratories, Inc.) Listed/CSA
(Canadian Standards Organization) Certified type SJT, 18-3 AWG (American Wire Gauge). Outside
of the U.S. and Canada, cords must be flexible harmonized (<HAR>) or VDE (Verband Deutscher
Electrotechniker, German Institute of Electrical Engineers) certified cord with 3 x 0.75 mm
conductors rated 250 VAC (Volts Alternating Current).
• Connector, wall outlet end: Cords must be terminated in grounding-type male plug designed for use
in your region. The connector must have certification marks showing certification by an agency
acceptable in your region and for U.S. must be Listed and rated 125% of overall current rating of the
server.
• Connector, server end: The connectors that plug into the AC receptacle on the server must be an
approved IEC (International Electrotechnical Commission) 320, sheet C13, type female connector.
• Cord length and flexibility: Cords must be less than 4.5 meters (14.76 feet) long.
10.9
Product Ecology Compliance
Intel has a system in place to restrict the use of banned substances in accordance with world
wide product ecology regulatory requirements. The following is Intel’s product ecology
compliance criteria.
Revision 1.1
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Intel order number: E92079-002
Intel® Server System SR1695WB TPS
Compliance Regional
Description
Environmental and Regulatory Specifications
Compliance Reference
Compliance Reference Marking
Example
Special handling may
apply. See
www.dtsc.ca.gov/hazardo
uswaste/perchlorate
California
CA. Lithium Perchlorate insert
California Code of Regulations, Title 22, Division
4.5; Chapter 33: Best Management Practices for
Perchlorate Materials.
This notice is required
by California Code of
Regulations, Title 22,
Division 4.5; Chapter
33: Best Management
Practices for
Perchlorate Materials.
This product/part
includes a battery which
contains Perchlorate
material.
China RoHS
China RoHS (MII Measure 39)
China
Product marked with the Environmental Friendly
Usage Period (EFUP) label of 20yrs, substance
table in Simplified Chinese either placed with the
product documentation or separate insert.
China Recycling (GB18455-2001)
Mark requires to be applied to be retail product
only. Marking applied to bulk packaging and
single packages. Not applied to internal
packaging such as plastics, foams, etc.
Intel Internal
Specification
Europe
Intel Internal
Specification
All materials, parts and subassemblies must not
contain restricted materials as defined in Intel’s
Environmental Product Content Specification
of Suppliers and Outsourced Manufacturers –
http://supplier.intel.com/ehs/environmental.htm
European Directive 2002/95/EC Restriction of Hazardous Substances (RoHS)
Threshold limits and banned substances are
noted below.
Quantity limit of 0.1% by mass (1000 PPM) for:
Lead, Mercury, Hexavalent Chromium,
Polybrominated Biphenyls Diphenyl Ethers
(PBB/PBDE)
Quantity limit of 0.01% by mass (100 PPM) for:
Cadmium
ISO11469 - Plastic parts weighing >25gm are
intended to be marked with per ISO11469.
52
None Required
None Required
>PC/ABS<
Revision 1.1
Intel order number: E92079-002
Environmental and Regulatory Specifications
Compliance Regional
Description
International
Intel® Server System SR1695WB TPS
Compliance Reference
Compliance Reference Marking
Example
Recycling Markings – Fiberboard (FB) and
Cardboard (CB) are marked with international
recycling marks. Applied to outer bulk packaging
and single package.
10.10 Other Markings
Compliance
Description
Compliance Reference
60950 Safety Requirement
Applied to product is stand-by power switch is
Stand-by Power
used.
Multiple Power
Cords
Ground Connection
60950 Safety Requirement
Applied to product if more than one power cord is
used.
60950 Deviation for Nordic Countries
Logistic Requirements
Applied to products to indicate where product
Country of Origin
was made.
Revision 1.1
Compliance Reference Marking
Example
.
English:
This unit has more than one
power supply cord. To reduce
the risk of electrical shock,
disconnect (2) two power supply
cords before servicing.
Simplified Chinese:
注意:
本设备包括多条电源系统电缆。
为避免遭受电击,在进行维修之
前应断开两(2)条电源系统电
缆。
Traditional Chinese:
注意:
本設備包括多條電源系統電纜。
為避免遭受電擊,在進行維修之
前應斷開兩(2)條電源系統電
纜。
German:
Dieses Geräte hat mehr als ein
Stromkabel. Um eine Gefahr des
elektrischen Schlages zu
verringern trennen sie beide (2)
Stromkabeln bevor
Instandhaltung.
Line1 :
“WARNING:”
Swedish on line2:
“Apparaten skall anslutas till
jordat uttag, när den ansluts till ett
nätverk.”
Finnish on line 3:
“Laite on liitettävä
suojamaadoituskoskettimilla
varustettuun pistorasiaan.”
English on line 4:
“Connect only to a properly earth
grounded outlet.”
Made in China
53
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Intel® Server System SR1695WB TPS
Appendix A: Integration and Usage Tips
Appendix A: Integration and Usage Tips
Before attempting to integrate and configure your system, you should reference this section,
which provides a list of useful information.
ƒ
After the system is integrated with processors, memory, and peripheral devices, the
FRUSDR utility must be run to load the proper Sensor Data Record data to the
integrated Server Management subsystem. Failure to run this utility may prevent
Server Management from accurately monitoring system health and may affect
system performance. The FRUSDR utility for this server system can either be run
from the Intel Deployment CDROM that came with your system, or can be
downloaded from the Intel website referenced at the bottom of this page.
ƒ
To ensure the highest system reliability, make sure the latest system software is
loaded on the server before deploying the system onto a live networking
environment. This includes system BIOS, FRUSDR, BMC firmware, and hot-swap
controller firmware. The system software can be updated using the Intel Deployment
CDROM that came with your system or can be downloaded from the Intel website
referenced at the bottom of this page.
ƒ
System fans are not hot-swappable.
ƒ
Only supported memory validated by Intel should be used in this server system. A list
of supported memory can be found in the Intel® Server System SR1695WB Tested
Memory List which can be downloaded from the Intel website referenced at the
bottom of this page.
ƒ
This system supports the Intel® Xeon® processor 5500 and 5600 sequence. You
cannot use Intel® Xeon® processors not referenced on the supported processor list in
this server system.
ƒ
You must use the CPU/memory air duct to maintain system thermals.
ƒ
To maintain system thermals, you must populate all hard drive bays with either a
hard drive or drive blank.
ƒ
You must remove power from the system prior to opening the chassis for service
You can download the latest system documentation, drivers, and system software from the
Intel Support website:
http://support.intel.com/support/motherboards/server/S5500WB/
54
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Appendix B: POST Code LED Decoder
Intel® Server System SR1695WB TPS
Appendix B: POST Code LED Decoder
During the system boot process, the BIOS executes a number of platform configuration
processes, each of which is assigned a specific hex POST code number. As each
configuration routine is started, the BIOS displays the POST code to the POST Code
Diagnostic LEDs on the back edge of the server board. To assist in troubleshooting a system
hang during the POST process, you can use the diagnostic LEDs to identify the last POST
process executed.
Each POST code is represented by the eight amber diagnostic LEDs. The POST codes are
divided into two nibbles, an upper nibble and a lower nibble. The upper nibble bits are
represented by diagnostic LEDs #4, #5, #6, and #7. The lower nibble bits are represented by
diagnostics LEDs #0, #1, #2, and #3. If the bit is set in the upper and lower nibbles, then the
corresponding LED is lit. If the bit is clear, then the corresponding LED is off.
The diagnostic LED #7 is labeled as “MSB” (Most Significant Bit), and the diagnostic LED #0
is labeled as “LSB” (Least Significant Bit).
Figure 32. Diagnostic LED Placement Diagram
In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder.
The LEDs are decoded as follows:
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Appendix B: POST Code LED Decoder
Table 55. POST Progress Code LED Example
Upper Nibble LEDs
LEDs
Status
Lower Nibble LEDs
MSB
LED #7
8h
ON
LED #6
4h
OFF
LED #5
2h
ON
LED #4
1h
OFF
LED #3
8h
ON
LED #2
4h
ON
LED #1
2h
OFF
LSB
LED #0
1h
OFF
1
0
1
0
1
1
0
0
Results
Ah
Ch
Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are
concatenated as ACh.
Table 56. POST Progress Code LED Example
Diagnostic LED Decoder
1 = On, 0=Off
Upper Nibble
Lower Nibble
Checkpoint
Description
LSB
2h 1h
#1 #0
Host Processor
0
0
Power-on initialization of the host processor (bootstrap processor)
1
0
Host processor cache initialization (including AP)
1
0
Starting application processor initialization
1
1
SMM initialization
Selection of Processor with least features to be used as Boot Strap
0
0
Processor
1
0
Switch an AP processor to become the new Boot Strap Processor
Chipset
1
0
Initializing a chipset component
Memory
1
0
Reading configuration data from memory (SPD on FBDIMM)
1
1
Detecting presence of memory
0
0
Programming timing parameters in the memory controller
1
0
Configuring memory parameters in the memory controller
1
0
Optimizing memory controller settings
1
1
Initializing memory, such as ECC init
0
0
Testing memory
BIOS cannot communicate with DIMM (serial channel hardware
0
0
failure)
1
0
DIMM(s) failed Memory iBIST or Memory Link Training failure
0
0
No memory available (system halted)
1
0
Unsupported or invalid DIMM configuration (system halted)
1
0
DIMM training sequence failed (system halted)
1
1
Memory test failed (system halted)
0
0
Unsupported or invalid DIMM configuration (system halted)
1
0
Unsupported or invalid DIMM configuration (system halted)
1
1
DIMM with corrupted SPD data detected (system halted)
QuickPath Interconnect (QPI)
0
0 QPI Initialization
1 QPI Initialization
0
1
0 QPI Initialization
1
1 QPI Initialization
0
0 QPI Initialization
1 QPI Initialization
0
LED
MSB
8h
#7
4h
#6
2h
#5
1h
#4
8h
#3
4h
#2
0x10h
0x11h
0x12h
0x13h
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0x14h
0
0
0
1
0
1
0x15h
0
0
0
1
0
1
0x21h
0
0
1
0
0
0
0x22h
0x23h
0x24h
0x25h
0x26h
0x27h
0x28h
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
1
1
1
0
0xE4h
1
1
1
0
0
1
0xE6h
0xE8h
0xE9h
0xEAh
0xEBh
0xECh
0xEDh
0xEBh
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
0
0xA0h
0xA1h
0xA2h
0xA3h
0xA4h
0xA5h
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0xA6h
1
0
1
0
0
1
1
0
QPI Initialization
0xA7h
0xA8h
0xA9h
1
1
1
0
0
0
1
1
1
0
0
0
0
1
1
1
0
0
1
0
0
1
0
1
QPI Initialization
QPI Initialization
QPI Initialization
56
Revision 1.1
Intel order number: E92079-002
Appendix B: POST Code LED Decoder
Intel® Server System SR1695WB TPS
Diagnostic LED Decoder
1 = On, 0=Off
Upper Nibble
Lower Nibble
Checkpoint
Description
LED
MSB
8h
#7
4h
#6
2h
#5
1h
#4
8h
#3
4h
#2
2h
#1
LSB
1h
#0
0xAAh
1
0
1
0
1
0
1
0
0xABh
0xACh
0xADh
0xAEh
0xAFh
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0
0
0
0
0
1
1
1
1
1
0xB0h
0xB1h
0xB2h
0xB3h
0xB4h
0xB5h
0xB6h
0xB7h
0xB8h
0xB9h
0xBAh
0xBBh
0xBCh
0xBDh
0xBEh
0xBFh
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0x50h
0x51h
0x52h
0x53h
0x54h
0x55h
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0x56h
0x57h
0x58h
0x59h
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0x5Ah
0x5Bh
0x5Ch
0x5Dh
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0x5Eh
0x5Fh
0
0
1
1
0
0
1
1
1
1
0x61h
0
1
1
0
0
0x63h
0
1
1
0
0
0x70h
0x71h
0x72h
0x73h
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0x78h
0x79h
0
0
1
1
1
1
1
1
1
1
1
1 QPI Initialization
0
0 QPI Initialization
1 QPI Initialization
0
1
0 QPI Initialization
1
1 QPI Initialization
Integrated Memory Controller (IMC)
0
0
0 Memory Initialization of Integrated Memory Controller
1 Memory Initialization of Integrated Memory Controller
0
0
1
0
0 Memory Initialization of Integrated Memory Controller
1
1 Memory Initialization of Integrated Memory Controller
0
1
0
0 Memory Initialization of Integrated Memory Controller
1
1 Memory Initialization of Integrated Memory Controller
0
1
1
0 Memory Initialization of Integrated Memory Controller
1
1
1 Memory Initialization of Integrated Memory Controller
0
0
0 Memory Initialization of Integrated Memory Controller
1 Memory Initialization of Integrated Memory Controller
0
0
1
0
0 Memory Initialization of Integrated Memory Controller
1
1 Memory Initialization of Integrated Memory Controller
0
1
0
0 Memory Initialization of Integrated Memory Controller
1
1 Memory Initialization of Integrated Memory Controller
0
1
1
0 Memory Initialization of Integrated Memory Controller
1
1
1 Memory Initialization of Integrated Memory Controller
PCI Bus
0
0
0 Enumerating PCI buses
1 Allocating resources to PCI buses
0
0
1
0
0 Hot Plug PCI controller initialization
1
1 Reserved for PCI bus
0
1
0
0 Reserved for PCI bus
1
1 Reserved for PCI bus
0
USB
1
1
0
Initializing USB host controllers
1
1
1
Detecting USB devices
0
0
0
Resetting USB bus
1
0
0
Reserved for USB devices
ATA/ATAPI/SATA
1
0
0
Resetting SATA bus and all devices
1
1
0
Detecting the presence of ATA device
1
0
0
Enable SMART if supported by ATA device
1
1
0
Reserved for ATA
SMBUS
1
1
0
Resetting SMBUS
1
1
1
Reserved for SMBUS
I/O Controller Hub
1
0
0
Initializing I/O Controller Hub
Super I/O
1
1
0
Initializing Super I/O
Local Console
0
0
0
Resetting the video controller (VGA)
1
0
0
Disabling the video controller (VGA)
1
0
0
Enabling the video controller (VGA)
1
1
0
Reserved for video controller (VGA)
Remote Console
0
0
0
Resetting the console controller
1
0
0
Disabling the console controller
QPI Initialization
0
1
1
1
1
Revision 1.1
57
Intel order number: E92079-002
Intel® Server System SR1695WB TPS
Diagnostic LED Decoder
1 = On, 0=Off
Upper Nibble
Lower Nibble
Checkpoint
LED
0x7Ah
0x7Bh
MSB
8h
#7
0
0
4h
#6
1
1
2h
#5
1
1
1h
#4
1
1
0x90h
0x91h
0x92h
0x93h
0x94h
0x96h
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0x98h
0x99h
0x9Ah
0x9Bh
0x9Ch
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
0xA8h
0xA9h
0xAAh
0xABh
0xACh
0xADh
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0xB0h
0xB1h
1
1
0
0
1
1
1
1
0xB2h
1
0
1
1
0xB3h
0xB4h
1
1
0
0
1
1
1
1
0xB8h
0xB9h
1
1
0
0
1
1
1
1
0xBAh
1
0
1
1
0xBCh
0xBDh
1
1
0
0
1
1
1
1
0xD0
0xD1
0xD2
0xD3
0xD4
0xD5
0xD6
0xDF
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0xE0h
0xE1h
0xE2h
0xE3h
0xF0h
0xF1h
0xF2h
0xF3h
Appendix B: POST Code LED Decoder
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
Description
LSB
8h 4h 2h 1h
#3 #2 #1 #0
1
1
0
0
Enabling the console controller
1
1
1
0
Reserved for console controller
Keyboard (only USB)
0
0
0
0
Resetting the keyboard
1
0
0
0
Disabling the keyboard
1
0
0
0
Detecting the presence of the keyboard
1
1
0
0
Enabling the keyboard
1
0
0
0
Clearing keyboard input buffer
1
1
0
0
Reserved for keyboard
Mouse (only USB)
1
0
0
0
Resetting the mouse
1
1
0
0
Detecting the mouse
1
1
0
0
Detecting the presence of mouse
1
1
1
0
Enabling the mouse
1
0
0
0
Reserved for mouse
Serial Port
1
0
0
0
Resetting the serial port
1
1
0
0
Disabling the serial port
1
1
0
0
Detecting the presence of the serial port
1
1
1
0
Clearing serial port buffer
1
1
0
0
Enabling serial port
1
1
1
0
Reserved for serial port
Fixed Media
0
0
0
0
Resetting fixed media device
1
0
0
0
Disabling fixed media device
Detecting presence of a fixed media device (SATA hard drive
1
0
0
0
detection, and so forth)
1
1
0
0
Enabling/configuring a fixed media device
1
0
0
0
Reserved for fixed media
Removable Media
1
0
0
0
Resetting removable media device
1
1
0
0
Disabling removable media device
Detecting presence of a removable media device (SATA CDROM
1
1
0
0
detection, and so forth)
1
1
0
0
Enabling/configuring a removable media device
1
1
1
0
Reserved for removable media device
Boot Device Selection (BDS)
0
0
0
0
Entered the Boot Device Selection phase (BDS)
1
0
0
0
Return to last good boot device
1
0
0
0
Setup boot device selection policy
1
1
0
0
Connect boot device controller
1
0
0
0
Attempt flash update boot mode
Transfer control to EFI boot
1
1
0
0
1
1
0
0
Trying to boot device selection
1
1
1
1
Reserved for boot device selection
Pre-EFI Initialization (PEI) Core
0
0
0
0
Entered Pre-EFI Initialization phase (PEI)
1
0
0
0
Started dispatching early initialization modules (PEIM)
1
0
0
0
Initial memory found, configured, and installed correctly
1
1
0
0
Transfer control to the DXE Core
PEI Modules
0
0
0
0
Install PEIM for Platform Status Codes
0
0
1
0
Detecting Platform Type
Early Platform Initialization
1
0
0
0
1
1
0
0
PEI Modules initialized
Driver eXecution Environment (DXE) Core
58
Revision 1.1
Intel order number: E92079-002
Appendix B: POST Code LED Decoder
Intel® Server System SR1695WB TPS
Diagnostic LED Decoder
1 = On, 0=Off
Upper Nibble
Lower Nibble
Checkpoint
LED
0xE4h
0xE5h
0xE6h
MSB
8h
#7
1
1
1
4h
#6
1
1
1
2h
#5
1
1
1
1h
#4
0
0
0
8h
#3
0
0
0
0xE7h
0xE8h
0xE9h
0xEAh
0xEBh
0xECh
0xEDh
0xEEh
0xEFh
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0x30h
0x31h
0x34h
0x35h
0x36h
0x3Eh
0x3Fh
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
4h
#2
1
1
1
2h
#1
0
0
1
LSB
1h
#0
0
1
0
Description
Entered EFI driver execution phase (DXE)
Started dispatching drivers
Started connecting drivers
DXE Drivers
1
1
0
Waiting for user input
0
0
0
Checking password
1
0
0
Entering BIOS setup
1
0
0
Flash Update
1
1
0
Legacy Option ROM initialization
0
0
0
DXE Drivers initialized
1
0
0
Transfer control to Boot Device Selection (BDS)
1
0
0
Calling Int 19. One beep unless silent boot is enabled.
1
1
0
Unrecoverable boot failure
Pre-EFI Initialization Module (PEIM)/Recovery
0
0
0
Crisis recovery initiated because of a user request
1
0
0
Crisis recovery initiated by software (corrupt flash)
1
0
0
Loading crisis recovery capsule
1
0
1
Handing off control to the crisis recovery capsule
1
1
0
Begin crisis recovery
1
1
0
No crisis recovery capsule detected
1
1
1
Crisis recovery capsule failed integrity check of capsule descriptors
Revision 1.1
59
Intel order number: E92079-002
Intel® Server System SR1695WB TPS
Appendix C: Video POST Code Errors
Appendix C: Video POST Code Errors
Whenever possible, the BIOS outputs the current boot progress codes on the video screen.
Progress codes are 32-bit quantities plus optional data. The 32-bit numbers include class,
subclass, and operation information. The class and subclass fields point to the type of
hardware being initialized. The operation field represents the specific initialization activity.
Based on the data bit availability to display progress codes, a progress code can be
customized to fit the data width. The higher the data bit, the higher the granularity of
information that can be sent on the progress port. The progress codes may be reported by
the system BIOS or option ROMs.
The Response section in the following table is divided into three types:
No Pause: The message is displayed on the local Video screen during POST or in the Error
Manager. The system continues booting with a degraded state. The user may want to
replace the erroneous unit. The setup POST error Pause setting does not have any effect
with this error.
Pause: The message is displayed on the Error Manager screen, and an error is logged to
the SEL. The setup POST error Pause setting determines whether the system pauses to the
Error Manager for this type of error, where the user can take immediate corrective action or
choose to continue booting.
Halt: The message is displayed on the Error Manager screen, an error is logged to the SEL,
and the system cannot boot unless the error is resolved. The user needs to replace the
faulty part and restart the system. The setup POST error Pause setting does not have any
effect with this error.
Table 57. POST Error Message and Handling
Error Code
0012
0048
0108
0109
0113
0140
0141
0146
0192
0194
0195
0196
0197
0198
019F
5220
5221
5224
8110
8111
8120
8121
8130
8131
8140
Error Message
CMOS date/time not set
Password check failed
Keyboard component encountered a locked error
Keyboard component encountered a stuck key error
Fixed Media The SAS RAID firmware cannot run properly. The user should
attempt to re-flash the firmware.
PCI component encountered a PERR error
PCI resource conflict
PCI out of resources error
L3 cache size mismatch
CPUID, processor family are different
Front side bus mismatch
Processor model mismatch
Processor speed mismatch
Processor family is unsupported
Processor and chipset stepping configuration is unsupported
CMOS/NVRAM configuration cleared
Password cleared by jumper
Password clear jumper is set
Processor 01 internal error (IERR) on last boot
Processor 02 internal error (IERR) on last boot
Processor 01 thermal trip error on last boot
Processor 02 thermal trip error on last boot
Processor 01 disabled
Processor 02 disabled
Processor 01 Failed FRB-3 Timer.
60
Response
Pause
Halt
No Pause
No Pause
Pause
Pause
Pause
Pause
Halt
Halt
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
No Pause
Revision 1.1
Intel order number: E92079-002
Appendix C: Video POST Code Errors
Error Code
8141
8160
8161
8170
8171
8180
8181
8190
8198
8300
84F2
84F3
84F4
84FF
8500
8520
8521
8522
8523
8524
8525
8526
8527
8528
8529
852A
852B
852C
852D
852E
852F
8540
8541
8542
8543
8544
8545
8546
8547
8548
8549
854A
854B
854C
854D
854E
854F
8560
8561
8562
8563
8564
8565
8566
8567
Intel® Server System SR1695WB TPS
Error Message
Processor 02 Failed FRB-3 Timer.
Processor 01 unable to apply BIOS update
Processor 02 unable to apply BIOS update
Processor 01 failed Self Test (BIST).
Processor 02 failed Self Test (BIST).
Processor 01 BIOS does not support the current stepping for processor
Processor 02 BIOS does not support the current stepping for processor
Watchdog timer failed on last boot
Operating system boot watchdog timer expired on last boot
Integrated Baseboard Management Controller failed self-test
Integrated Baseboard Management Controller failed to respond
Integrated Baseboard Management Controller in update mode
Sensor data record empty
System event log full
Memory component could not be configured in the selected RAS mode.
DIMM_A1 failed Self Test (BIST).
DIMM_A2 failed Self Test (BIST).
DIMM_A3 failed Self Test (BIST).
DIMM_A4 failed Self Test (BIST).
DIMM_B1 failed Self Test (BIST).
DIMM_B2 failed Self Test (BIST).
DIMM_B3 failed Self Test (BIST).
DIMM_B4 failed Self Test (BIST).
DIMM_C1 failed Self Test (BIST).
DIMM_C2 failed Self Test (BIST).
DIMM_C3 failed Self Test (BIST).
DIMM_C4 failed Self Test (BIST).
DIMM_D1 failed Self Test (BIST).
DIMM_D2 failed Self Test (BIST).
DIMM_D3 failed Self Test (BIST).
DIMM_D4 failed Self Test (BIST).
DIMM_A1 Disabled.
DIMM_A2 Disabled.
DIMM_A3 Disabled.
DIMM_A4 Disabled.
DIMM_B1 Disabled.
DIMM_B2 Disabled.
DIMM_B3 Disabled.
DIMM_B4 Disabled.
DIMM_C1 Disabled.
DIMM_C2 Disabled.
DIMM_C3 Disabled.
DIMM_C4 Disabled.
DIMM_D1 Disabled.
DIMM_D2 Disabled.
DIMM_D3 Disabled.
DIMM_D4 Disabled.
DIMM_A1 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_A2 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_A3 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_A4 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_B1 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_B2 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_B3 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_B4 Component encountered a Serial Presence Detection (SPD) fail error.
Revision 1.1
Response
No Pause
Pause
Pause
Pause
Pause
No Pause
No Pause
Pause
Pause
Pause
Pause
Pause
Pause
No Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
61
Intel order number: E92079-002
Intel® Server System SR1695WB TPS
Error Code
8568
8569
856A
856B
856C
856D
856E
856F
8580
8581
8582
8583
8584
8585
8586
8587
8588
8589
858A
858B
858C
858D
858E
858F
85A0
85A1
85A2
85A3
85A4
85A5
85A6
85A7
85A8
85A9
85AA
85AB
85AC
85AD
85AE
85AF
Appendix C: Video POST Code Errors
Error Message
Response
DIMM_C1 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_C2 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_C3 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_C4 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_D1 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_D2 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_D3 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_D4 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_A1 Correctable ECC error encountered.
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause after 10
Occurrence
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
DIMM_A2 Correctable ECC error encountered.
DIMM_A3 Correctable ECC error encountered.
DIMM_A4 Correctable ECC error encountered.
DIMM_B1 Correctable ECC error encountered.
DIMM_B2 Correctable ECC error encountered.
DIMM_B3 Correctable ECC error encountered.
DIMM_B4 Correctable ECC error encountered.
DIMM_C1 Correctable ECC error encountered.
DIMM_C2 Correctable ECC error encountered.
DIMM_C3 Correctable ECC error encountered.
DIMM_C4 Correctable ECC error encountered.
DIMM_D1 Correctable ECC error encountered.
DIMM_D2 Correctable ECC error encountered.
DIMM_D3 Correctable ECC error encountered.
DIMM_D4 Correctable ECC error encountered.
DIMM_A1 Uncorrectable ECC error encountered.
DIMM_A2 Uncorrectable ECC error encountered.
DIMM_A3 Uncorrectable ECC error encountered.
DIMM_A4 Uncorrectable ECC error encountered.
DIMM_B1 Uncorrectable ECC error encountered.
DIMM_B2 Uncorrectable ECC error encountered.
DIMM_B3 Uncorrectable ECC error encountered.
DIMM_B4 Uncorrectable ECC error encountered.
DIMM_C1 Uncorrectable ECC error encountered.
DIMM_C2 Uncorrectable ECC error encountered.
DIMM_C3 Uncorrectable ECC error encountered.
DIMM_C4 Uncorrectable ECC error encountered.
DIMM_D1 Uncorrectable ECC error encountered.
DIMM_D2 Uncorrectable ECC error encountered.
DIMM_D3 Uncorrectable ECC error encountered.
DIMM_D4 Uncorrectable ECC error encountered.
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Appendix C: Video POST Code Errors
Error Code
8601
8602
8603
8604
9000
9223
9226
9243
9246
9266
9268
9269
9286
9287
9288
92A3
92A9
92C6
92C7
92C8
94C6
94C9
9506
95A6
95A7
95A8
9609
9641
9667
9687
96A7
96AB
96E7
0xA022
0xA027
0xA028
0xA421
0xA500
0xA501
0xA5A0
0xA5A1
0xA5A4
0xA6A0
Intel® Server System SR1695WB TPS
Error Message
Override jumper is set to force boot from lower alternate BIOS bank of flash ROM
Watchdog timer expired (secondary BIOS may be bad!)
Secondary BIOS checksum fail
Chipset Reclaim of non critical variables complete.
Unspecified processor component has encountered a non specific error.
Keyboard component was not detected.
Keyboard component encountered a controller error.
Mouse component was not detected.
Mouse component encountered a controller error.
Local Console component encountered a controller error.
Local Console component encountered an output error.
Local Console component encountered a resource conflict error.
Remote Console component encountered a controller error.
Remote Console component encountered an input error.
Remote Console component encountered an output error.
Serial port component was not detected
Serial port component encountered a resource conflict error
Serial Port controller error
Serial Port component encountered an input error.
Serial Port component encountered an output error.
LPC component encountered a controller error.
LPC component encountered a resource conflict error.
ATA/ATPI component encountered a controller error.
PCI component encountered a controller error.
PCI component encountered a read error.
PCI component encountered a write error.
Unspecified software component encountered a start error.
PEI Core component encountered a load error.
PEI module component encountered an illegal software state error.
DXE core component encountered an illegal software state error.
DXE boot services driver component encountered an illegal software state error.
DXE boot services driver component encountered invalid configuration.
SMM driver component encountered an illegal software state error.
Processor component encountered a mismatch error.
Processor component encountered a low voltage error.
Processor component encountered a high voltage error.
PCI component encountered a SERR error.
ATA/ATPI ATA bus SMART not supported.
ATA/ATPI ATA SMART is disabled.
PCI Express* component encountered a PERR error.
PCI Express* component encountered a SERR error.
PCI Express* IBIST error.
DXE boot services driver Not enough memory available to shadow a legacy
option ROM.
Revision 1.1
Response
No Pause
No Pause
No Pause
No Pause
Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
Pause
Pause
No Pause
No Pause
No Pause
No Pause
Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
Halt
Halt
Halt
No Pause
Halt
Pause
No Pause
No Pause
Halt
No Pause
No Pause
No Pause
Halt
Pause
No Pause
63
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Appendix D: Jumper Block Settings and Usage
Intel® Server System SR1695WB TPS
Appendix D: Jumper Block Settings and Usage
The server board has several 2-pin and 3-pin jumper blocks that can be used to configure,
protect, or recover specific features of the server board. Pin 1 on each jumper block is
denoted by an “*” or “▼”.
Force Integrated BMC Update (J1B5)
When performing a standard BMC firmware update procedure, the update utility places the
BMC into an update mode, allowing the firmware to load safely onto the flash device. In the
unlikely event the BMC firmware update process fails due to the BMC not being in the proper
update state, the server board provides a BMC Force Update jumper (J1B5) which will force
the BMC into the proper update state. The following procedure should be followed in the
event the standard BMC firmware update process fails.
Jumper Position
Mode of Operation
1-2
Normal
2-3
Update
Note
Integrated BMC GPIO [1] is pulled HIGH. Default
position.
Integrated BMC GPIO [1] is pulled LOW.
1. Power down and remove the power cord.
2. Open the server chassis. See your server chassis documentation for instructions.
3. Move jumper from the default operating position, covering pins1 and 2, to the
enabled position, covering pins 2 and 3.
4. Close the server chassis.
5. Reconnect the power cord and power up the server.
6. Perform the BMC firmware update procedure as documented in the README.TXT
file included in the given BMC firmware update package. After successful completion
of the firmware update process, the firmware update utility may generate an error
stating the BMC is still in update mode.
7. Power down and remove the power cord.
8. Open the server chassis.
9. Move the jumper from the enabled position, covering pins 2 and 3 to the disabled
position, covering pins 1 and 2.
10. Close the server chassis.
11. Reconnect the power cord and power up the server.
Note: Normal BMC functionality is disabled with the Force BMC Update jumper is set to the
enabled position. You should never run the server with the BMC Force Update jumper set in
this position. You should only use this jumper setting when the standard firmware update
process fails. This jumper should remain in the default/disabled position when the server is
running normally.
Password Clear (J1C2)
The user sets this 3-pin jumper to clear the password.
Jumper Position
Mode of Operation
1-2
2-3
Normal
Clear Password
Note
ICH10R INTRUDER# pin is pulled HIGH. Default position.
ICH10R INTRUDER# pin is pulled LOW.
1. Power down server. Do not unplug the power cord.
2. Open the chassis. For instructions, see your server chassis documentation.
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Appendix D: Jumper Block Settings and Usage
3. Move jumper (J1B6) from the default operating position, covering pins 1 and 2, to
the password clear position, covering pins 2 and 3.
4. Close the server chassis.
5. Power up the server, wait 10 seconds or POST completes.
6. Power down the server.
7. Open the chassis and move the jumper back to default position, covering pins 1
and 2.
8. Close the server chassis.
9. Power up the server.
BIOS Recovery Mode (J1C3)
The Intel® Server Board S5500WB uses BIOS recovery to repair the system BIOS from flash
corruption in the main BIOS and Boot Block. This 3-pin jumper is used to reload the BIOS
when the image is suspected to be corrupted. For directions on how to recover the BIOS,
refer to the specific BIOS release notes.
Table 58. BIOS Recovery Mode (J1C3)
Jumper Position
Mode of Operation
Note
1-2
2-3
Normal
Recovery
ICH10R GPIO [55] is pulled HIGH. Default position.
ICH10R GPIO [55] is pulled LOW.
You can accomplish a BIOS recovery from the SATA CD and USB Mass Storage device.
Please note that this platform does not support recovery from a USB floppy.
The recovery media must contain the following files under the root directory:
1.
2.
3.
4.
FVMAIN.FV
UEFI iFlash32 2.6 Build 9
*Rec.CAP
Startup.nsh (update accordingly to use proper *Rec.CAP file)
The BIOS starts the recovery process by first loading and booting to the recovery image file
(FVMAIN.FV) on the root directory of the recovery media (SATA CD or USB disk).
This process takes place before any video or console is available. Once the system boots to
this recovery image file (FVMAIN.FV), it boots automatically into the EFI Shell to invoke the
Startup.nsh script and start the flash update application (IFlash32.efi).
IFlash32.efi requires the supporting BIOS Capsule image file (*Rec.CAP).
After the update is complete, a message displays, stating the "BIOS has been updated
successfully". This indicates the recovery process is finished.
The user should then switch the recovery jumper back to normal operation and restart the
system by performing a power cycle.
The following steps demonstrate this recovery process:
1. Power OFF the system.
2. Insert recovery media.
3. Switch the recovery jumper. Details regarding the jumper ID and location can be
obtained from the Board EPS for that Platform.
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Appendix D: Jumper Block Settings and Usage
Intel® Server System SR1695WB TPS
4. Power ON the system.
5. The BIOS POST screen will appear displaying the progress, and the system
automatically boots to the EFI SHELL.
6. The Startup.nsh file executes, and initiates the flash update (IFlash32.efi) with a new
capsule file (*Rec.CAP). The regular IFlash message displays at the end of the
process—once the flash update succeeds.
7. Power OFF the system, and revert the recovery jumper position to "normal operation".
8. Power ON the system.
9. Do NOT interrupt the BIOS POST during the first boot.
Reset BIOS Configuration (J1B4)
This jumper used to be the CMOS Clear jumper. Since the previous generation, the BIOS
has moved CMOS data to the NVRAM region of the BIOS flash. The BIOS checks during
boot to determine if the data in the NVRAM needs to be set to default.
Table 59. Reset BIOS Configuration (J1B4)
Jumper Position
1-2
Mode of Operation
Normal
Note
ICH10R RTCRST# pin is pulled HIGH. Default position.
2-3
Reset BIOS Configuration
ICH10R RTCRST# pin is pulled LOW.
1. Power down server. Do not unplug the power cord.
2. Open the server chassis. For instructions, see your server chassis documentation.
3. Move jumper (J1B4) from the default operating position, covering pins 1 and 2, to the
reset/clear position, covering pins 2 and 3.
4. Wait five seconds.
5. Remove power cable.
6. Move the jumper back to default position, covering pins 1 and 2.
7. Close the server chassis.
8. Power up the server.
The CMOS is now cleared and you can reset it by going into the BIOS setup.
Note: Removing power before performing the CMOS Clear operation causes the system to
automatically power up and immediately power down, after the procedure is followed and
power is re-applied. If this happens, remove the power cord again, wait 30 seconds, and reinstall the power cord. Power-up the system and proceed to the <F2> BIOS Setup Utility to
reset the desired settings.
Video Master (J6A3)
This jumper determines which video is the primary.
Table 60. Video Master (J6A3)
Jumper Position
1-2
Mode of Operation
Internal
Notes
Internal connector will override if both connectors are used.
2-3
External
External connector will override if both connectors are used.
J6A3, 1-2 jumpered: Internal video connector is primary, but video can come out of external
video connector if you connect to it.
J6A3, 2-3 jumpered: External video connector is primary, but video can come out of internal
video connector if you connect to it.
Serials Interface Setting (J6A2)
Revision 1.1
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Intel® Server System SR1695WB TPS
Appendix D: Jumper Block Settings and Usage
Table 61. Serials Interface Setting (J6A2)
Pins
Mode
Description
1–2
DCD to DTR
Data Carrier Detect
3–4
DSR to DTR
Data Set Ready
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Glossary
Intel® Server System SR1695WB TPS
Glossary
Term
ACPI
Definition
Advanced Configuration and Power Interface
AP
Application Processor
APIC
Advanced Programmable Interrupt Control
ASIC
Application Specific Integrated Circuit
ASMI
Advanced Server Management Interface
BIOS
Basic Input/Output System
BIST
Built-In Self Test
BMC
Baseboard Management Controller
Bridge
Circuitry connecting one computer bus to another, allowing an agent on one to access the other
BSP
Bootstrap Processor
Byte
8-bit quantity.
CBC
Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis.)
CEK
Common Enabling Kit
CHAP
Challenge Handshake Authentication Protocol
CMOS
In terms of this specification, this describes the PC-AT compatible region of battery-backed 128
bytes of memory, which normally resides on the server board.
DPC
Direct Platform Control
EEPROM
Electrically Erasable Programmable Read-Only Memory
EHCI
Enhanced Host Controller Interface
EMP
Emergency Management Port
EPS
External Product Specification
ESB2-E
Enterprise South Bridge 2
FBD
Fully Buffered DIMM
FMB
Flexible Mother Board
FRB
Fault Resilient Booting
FRU
Field Replaceable Unit
FSB
Front Side Bus
GB
1024MB
GPIO
General Purpose I/O
GTL
Gunning Transceiver Logic
HSC
Hot-Swap Controller
Hz
Hertz (1 cycle/second)
I2 C
Inter-Integrated Circuit Bus
IA
Intel® Architecture
IBF
Input Buffer
ICH
I/O Controller Hub
ICMB
Intelligent Chassis Management Bus
IERR
Internal Error
IFB
I/O and Firmware Bridge
INTR
Interrupt
IP
Internet Protocol
IPMB
Intelligent Platform Management Bus
IPMI
Intelligent Platform Management Interface
Revision 1.1
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Intel® Server System SR1695WB TPS
Glossary
Term
IR
Definition
Infrared
ITP
In-Target Probe
KB
1024 bytes
KCS
Keyboard Controller Style
LAN
Local Area Network
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LPC
Low Pin Count
LUN
Logical Unit Number
MAC
Media Access Control
MB
1024KB
MCH
Memory Controller Hub
MD2
Message Digest 2 – Hashing Algorithm
MD5
Message Digest 5 – Hashing Algorithm – Higher Security
ms
milliseconds
MTTR
Memory Type Range Register
Mux
Multiplexor
NIC
Network Interface Controller
NMI
Nonmaskable Interrupt
OBF
Output Buffer
OEM
Original Equipment Manufacturer
Ohm
Unit of electrical resistance
PEF
Platform Event Filtering
PEP
Platform Event Paging
PIA
Platform Information Area (This feature configures the firmware for the platform hardware)
PLD
Programmable Logic Device
PMI
Platform Management Interrupt
POST
Power-On Self Test
PSMI
Power Supply Management Interface
PWM
Pulse-Width Modulation
RAM
Random Access Memory
RASUM
Reliability, Availability, Serviceability, Usability, and Manageability
RISC
Reduced Instruction Set Computing
RMM3
Remote Management Module – 3rd generation
RMM3 NIC
Remote Management Module – 3rd generation dedicated management NIC
ROM
Read Only Memory
RTC
Real-Time Clock (Component of ICH peripheral chip on the server board)
SDR
Sensor Data Record
SECC
Single Edge Connector Cartridge
SEEPROM
Serial Electrically Erasable Programmable Read-Only Memory
SEL
System Event Log
SIO
Server Input/Output
SMI
Server Management Interrupt (SMI is the highest priority nonmaskable interrupt)
SMM
Server Management Mode
SMS
Server Management Software
SNMP
Simple Network Management Protocol
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Glossary
Intel® Server System SR1695WB TPS
Term
SSI
Definition
Server System Infrastructure
TBD
To Be Determined
TIM
Thermal Interface Material
UART
Universal Asynchronous Receiver/Transmitter
UDP
User Datagram Protocol
UHCI
Universal Host Controller Interface
UTC
Universal time coordinate
VID
Voltage Identification
VRD
Voltage Regulator Down
Word
16-bit quantity
ZIF
Zero Insertion Force
Revision 1.1
71
Intel order number: E92079-002
Intel® Server System SR1695WB TPS
Reference Documents
Reference Documents
Refer to the following documents for additional information:
ƒ
Intel® Server Board S5500WB Technical Product Specification
ƒ
Intel® Server System SR1695WB Service Guide
72
Revision 1.1
Intel order number: E92079-002
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