QuickSpecs
HP Z1 G3 AiO Workstation
Overview
1.
2.
3.
Power Button
System Activity LED
(2) Thunderbolt 3/USB 3.1* ports
4.
5.
6.
(2) USB 3.0 ports (upper charging, lower standard)
(1) SD 4.0 Media Card Reader
(1) Headset port (Headphone/Microphone)
*Thunderbolt cable and Thunderbolt device (sold separately) must be compatible with Windows. To determine whether
your device is Thunderbolt Certified for Windows, see https://thunderbolttechnology.net/products.
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Page 1
QuickSpecs
HP Z1 G3 AiO Workstation
Overview
Form Factor
Operating Systems
All in One
Preinstalled:
Windows 10 Pro 64-bit
Windows 10 Pro 64-bit Downgrade to Windows 7 Professional 64-bit
Linux® Ready (T0K20AV)
Red Hat® Enterprise Linux® Desktop/Workstation (Paper license with 1 year support; no
preinstalled OS)
NOTES: The user must still obtain the Red Hat® software bits from Red Hat®.
Supported:
Windows 10 64-bit
Windows 10 Pro 64 Downgrade Win 7 64
Windows 10 Home 64 High-End
Red Hat® Enterprise Linux® Desktop/Workstation 6, 7
NOTE: For detailed OS/hardware support information for Linux®, see:
http://www.hp.com/support/Linux_hardware_matrix.
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Page 2
QuickSpecs
HP Z1 G3 AiO Workstation
Supported Components
Available Processors
Name
Intel®
Xeon® E31270v5 3.6
8M GT0 4C
CPU
Intel®
Xeon® E31245v5 3.5
8M GT2 4C
CPU
Intel®
Xeon® E31225v5 3.3
8M GT2 4C
CPU
Clock Intel® Turbo
Memory
Featuring
Intel®
Speed
Boost
Cache Speed
Hyper- Intel® vProHD
Cores (GHz) Technology1 (MB) (MT/s) Threading Technology Graphics
4
4
4
3.6
3.5
3.3
4.0
3.9
3.7
8
8
8
2133
2133
2133
Y
Y
Y
Y
N/A
TDP
(W)
80W
Y
Intel®
HD
80W
Graphics
P530
Y
Intel®
HD
80W
Graphics
P530
Intel® Core
i7-6700 3.4
8M 4C CPU
4
3.4
4.2
8
2133
Y
Y
Intel® Core
i5-6500 3.2
6M 4C CPU
4
3.2
3.6
6
2133
N
Y
Intel® Core
i3-6100 3.7
3M 2C CPU
2
3.7
N/A
3
2133
Y
N
Intel®
HD
65W
Graphics
530
Intel®
HD
65W
Graphics
530
Intel®
HD
65W
Graphics
530
1The
specifications shown in this column represent the maximum frequency (GHz) of one processor
core when accelerated with Intel® Turbo Boost Technology. Turbo boost stepping occurs in 100MHz
increments. Processors that do not have turbo functionality are denoted as N/A.
Available Processor Intel® Xeon E3 and Intel® Core i3 processors can support either ECC or non-ECC memory.
Disclaimers
Multi-core is designed to improve performance of certain software products. Not all customers or
software applications will necessarily benefit from use of this technology. Performance and clock
frequency will vary depending on application workload and your hardware and software
configurations. Intel -s numbering is not a measurement of higher performance.
Integrated Display
See below for detailed information
Panel
Type: IPS (in-plane switching) LED Backlit LCD
Viewable Image Area: 60 cm, (23.6 in.) widescreen; diagonally measured
Screen Opening (W x H): 52.1 x 32.1 cm, (20.5 x 11.5 in.)
Optimal Resolution: 3840 x 2160 @ 60 Hz; 8.3MP
Aspect Ratio*: 16:9 Widescreen
Viewing Angle (typical): Up to 178° horizontal / 178° vertical
Maximum Brightness (typical)*: 300 nits cd/m2
Minimum Brightness (typical)*: 50 nits cd/m2
Contrast Ratio (typical)*: 1000:1
Dynamic Contrast Ratio (typical)*: N/A
Response Time (typical)*: 14 ms (gray to gray)
Pixel Pitch: 0.04525 mm x 0.13575 mm
Backlight LED Life Time: 30,000 hours minimum
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QuickSpecs
HP Z1 G3 AiO Workstation
Supported Components
Color Gamut Coverage of sRGB: 100% (CIE 1931)
Color Support: Up to 16.7 Million colors
*All performance specifications represent the typical specifications provided by HP's component
manufacturers; actual performance may vary either higher or lower.
Signal Interface/Performance
Horizontal Frequency: 131.4 kHz
Vertical Frequency: 60 H
Native Resolution: 3840 x 2160 @ 60 Hz; 8.3MP
Preset VESA Graphic Modes (non-interlaced): 3840 x 2160 @ 60 Hz
Pixel Clock Speed(typical): 519.8 MHz
User Programmable Modes: None
Default Color Temperature: 6500 K
Anti-glare: less than 25% haze
Notes: non-touch version
Anti-glare: less than 25% haze
Convertibility
The Z1 can either be placed on the desktop in the traditional display method or mounted on a wall
with the industry standard VESA mount. The VESA mount on the Z1 uses a 100x100 VESA mount
pattern. Mounting hardware sold separately.
Expansion Slots (see
(1) MXM 3.1 (dedicated for graphics)
system board section
(2) M.2 Socket type 3. Support for Module Types 2242, 2260, and 2280-M H4.2
for more details)
(1) M.2 Socket type 1. Support for Module Type 3030-E H4.2 for WLAN*
* WLAN is only available as a Configure to Order item at the time of purchase.
Expansion Bays (see
2 internal 2.5" bays
storage section for
more details)
Side I/O
(1) USB 3.0, (1) USB 3.0 Charging Data Port, (2) Thunderbolt TM 3/USB 3.1 ports (USB Type-C
connectors), (1) SD 4.0 Media Card Reader, (1) Headset [(1) Headphone, (1) Microphone]
Internal I/O
(1) USB 2.0 Type A, 2 internal on 9-pin header (not available on touch capable option)
Rear I/O
(1) DisplayPort v1.1, (4) USB 3.0, (1) RJ-45 LAN, (1) Re-taskable Audio Port (Line-in, Line-out,
MIC).
Chassis Dimensions 21.5in x 23.5in x 8.3in (includes stand)
(H x W x D)
54.61cm x 59.69cm x 21.08
Weight
Exact weights depend upon configuration;
Max system weight WITH stand: 10.51kg (23.2lb);
Stand weight 3.12kg (6.9lb)
Temperature
Operating:
40° to 95°F (5° to 35°C)
Non-operating
-40° to 140°F (-40° to 60°C)
Humidity
Operating:
8% to 85%
Non-operating
8% to 90%
Maximum Altitude Operating:
3,000 m (10,000 ft)
(non-pressurized)
Non-operating
9,100 m (30,000 ft).
Power Supply
330 watts wide-ranging, active Power Factor Correction, 90% Efficient
Chipset
Intel® C236 chipset
Memory
4 SO-DIMM slots, supporting up to 64GB ECC or 64GB non-ECC Unbuffered DDR4 2133 MT/s
Components.
Actual Memory speed is determined by the processor.
Memory Disclaimers The CPU determines the speed at which the memory is clocked. If a 2133MT/s capable CPU is
used in the system, the maximum speed the memory will run at is 2133MT/s regardless of the
specified speed of the memory.
Workstation ISV
See the latest list of certifications at:
Certifications
http://www.hp.com/united-states/campaigns/workstations/partnerships.html
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QuickSpecs
HP Z1 G3 AiO Workstation
Supported Components
Processors
Factory
Option
Configured
Kit
6th generation Intel® Core i3 processor family
Intel® Core i3-6100 3.7 2133 2C CPU
6th generation Intel® Core processor family
Intel® Core i5-6500 3.2 2133 4C CPU
Intel® Core i7-6700 3.4 2133 4C CPU
Intel® Xeon® processor E3-1200 v5 family
Intel® Xeon® E3-1270 v5 3.6 2133 4C CPU
Intel® Xeon® E3-1245 v5 3.5 2133 4C CPU
Intel® Xeon® E3-1225 v5 3.3 2133 4C CPU
Option
Kit Part Support
Number Notes
Y
N
Note 1
Y
Y
N
N
Note 1, 3
Note 1, 3
Y
Y
Y
N
N
N
Note 1, 2
Note 2
Note 2
NOTE 1: Not supported with Intel® HD P530 graphics.
NOTE 2: Not supported with Intel® HD 530 graphics.
NOTE 3: Not supported with ECC memory.
Monitors / Displays
HP DreamColor Z24x Display
HP DreamColor Z27x Studio Display
HP DreamColor Z32x UHD Display
HP Z Display Z24i 24-inch IPS LED Backlit Monitor
HP Z Display Z30i 30-inch IPS LED Backlit Monitor
HP Z22n Narrow Bezel IPS Display
HP Z23n Narrow Bezel IPS Display
HP Z24n Narrow Bezel IPS Display
HP Z24nf Narrow Bezel IPS Display
HP Z24nq Narrow Bezel IPS Display
HP Z24s IPS UHD 4K Display
HP Z25n Narrow Bezel IPS Display
HP Z27n Narrow Bezel IPS Display
HP Z27q 27-inch IPS 5K Display
HP Z27s IPS UHD 4K Display
HP Z34c Curved Display
HP Zvr Virtual Reality Display
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QuickSpecs
HP Z1 G3 AiO Workstation
Supported Components
NOTES:
All HP Z Displays and HP DreamColor Displays are supported. For more information see
www.hp.com/go/zdisplays.
Supported by all Operating Systems available from HP
Screen Size Diagonally Measured
Storage / Hard Drives
SATA Hard Drives
Factory
Option Option Kit Part
Configured
Kit
Number
SATA Hard Drives for HP Workstations
1TB SATA 7200 rpm 6Gb/s 2.5" HDD
500GB SATA 7200 rpm 6Gb/s 2.5" HDD
Y
Y
Y
Y
Support
Notes
T0K74AA
T0K73AA
SATA SSDs
HP Solid State Drive for Workstations
HP 1TB SATA 6Gb/s SSD
Y
Y
F3C96AA
HP 512GB SATA 6Gb/s SSD
Y
Y
D8F30AA
HP 256GB SATA 6Gb/s SSD
Y
Y
A3D26AA
HP 256GB SATA 6Gb/s SED Opal SSD
Y
Y
G7U67AA
Note 1
Note 1:
The 256GB Self-Encrypting Drive (SED) version has similar performance to the standard 256GB SSD.
This device supports both Opal 2.0 and Opal 1.0 functionality.
For storage drives, GB = 1 billion bytes. Actual formatted capacity is less. Up to 35GB of system disk is
reserved for system recovery software.
PCIe SSDs
HP PCIe SSD Drives for Workstations
HP 1TB Z-Turbo NVMe M.2 SSD
Y
Y
T0K72AA
HP 512GB Z-Turbo NVMe M.2 SSD
Y
Y
M1F74AA
HP 256GB Z-Turbo NVMe M.2 SSD
Y
Y
M1F73AA
Not all configurations will be available at launch.
For storage drives, GB = 1 billion bytes. Actual formatted capacity is less. Up to 35GB of system disk is
reserved for system recovery software.
Hard Drive
Controllers
Factory
Option Option Kit Part
Configured
Kit
Number
Factory integrated RAID on motherboard for SATA drives
RAID 0 Configuration - Striped Array
Y
N
RAID 1 Configuration - Mirrored Array
Y
N
Support
Notes
Note 1
Note 1
NOTE 1: Supported with all Windows® Operating Systems. All drives must be identical in interface,
size, and speed. 2 HDDs required. Not supported with 1st hard drive SATA-SED drive.
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QuickSpecs
HP Z1 G3 AiO Workstation
Supported Components
Graphics
Factory Option
Configured
Kit
Option Kit
Part
Number
Integrated Intel® HD Graphics (Z1G3)
Intel® HD Graphics P530
Y
N
NA
Intel® HD Graphics 530
Y
N
NA
Support Supported
Notes Multi Mixed
See note
1
See note
2
1
1
NOTE 1: Supported on Intel® Xeon® E3-12xx v5 processors only
NOTE 2: Supported on Intel® Core i3/i5-6xxx processors only
Entry 3D
NVIDIA® Quadro® M1000M 2GB
Graphics
Mid-range 3D
NVIDIA® Quadro® M2000M 4GB
Graphics
Y
Y
T8W13AA
1
Y
N
NA
1
High End 3D
NOTE 1:
If a discrete graphics card is installed, Intel® integrated graphics is disabled.
Memory
CTO
Option Kit
Part Number
Support
Notes
DDR4-2133 nECC Unbuffered DIMMs CTO
HP 32GB (2x16GB) DDR4-2133 nECC RAM
HP 16GB (2x8GB) DDR4-2133 nECC RAM
HP 8GB (2x4GB) DDR4-2133 nECC RAM
HP 8GB (1x8GB) DDR4-2133 nECC RAM
HP 4GB (1x4GB) DDR4-2133 nECC RAM
DDR4-2133 ECC Unbuffered DIMMs - CTO
HP 64GB (4x16GB) DDR4-2133 ECC RAM
HP 32GB (4x8GB) DDR4-2133 ECC RAM
HP 32GB (2x16GB) DDR4-2133 ECC RAM
HP 16GB (2x8GB) DDR4-2133 ECC RAM
HP 8GB (1x8GB) DDR4-2133 ECC RAM
AMO
DDR4-2133 non-ECC Unbuffered DIMMs - AMO
HP 16GB (1x16GB) DDR4-2133 non-ECC RAM
HP 8GB (1x8GB) DDR4-2133 non-ECC RAM
HP 4GB (1x4GB) DDR4-2133 non-ECC RAM
T0H91AA
T0H90AA
T0H89AA
DDR4-2133 ECC Unbuffered DIMMs - AMO
HP 8GB (1x8GB) DDR4-2133 ECC RAM
HP 16GB (1x16GB) DDR4-2133 ECC RAM
T0H92AA
T0H93AA
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QuickSpecs
HP Z1 G3 AiO Workstation
Supported Components
Section Description/Notes
The CPU determines the speed at which the memory is clocked.
Multimedia and
Audio Devices
HP HD 2MP 1080p Webcam and Digital Mic Array
Integrated Conexant CX7501 Audio Codec with DTS
Studio Sound
Optical and
Removable Storage
Networking and
Communications
Factory
Option
Configured
Kit
Y
N
Y
N
Option Kit
Part
Number
Support
Notes
Factory Option Option Kit Support
Configured
Kit
Part Number Notes
HP External Ultra-Slim DVD-RW Drive
Y
Y
F2B56AA
Actual speeds may vary. Does not permit copying of commercially available DVD movies or other
copyright protected materials. Intended for creation and storage of your original material and other
lawful uses. Double Layer discs can store more data than single layer discs. However, double-layer
discs burned with this drive may not be compatible with many existing single-layer DVD drives and
players.
With Blu-ray, certain disc, digital connection, compatibility and/or performance issues may arise, and
do not constitute defects in the product. Flawless playback on all systems is not guaranteed. In order
for some Blu-ray titles to play, they may require a DVI or HDMI digital connection and your display
may require HDCP support. HD-DVD movies cannot be played on this workstation.
Factory
Option
Configured
Kit
Y
N
Option Kit
Part
Support
Number
Notes
Integrated Intel® I217LM PCIe GbE Controller
(Intel® vPro with Intel® AMT 9.0)
Optional Intel® 8260 Wireless LAN (802.11ac) and
Y
N
Notes 1, 2
Bluetooth® 4.2 Module
Note 1: When selected for factory installation, the module is installed into the M.2 type 1 slot.
Note 2: Intel vPro is not available on the Intel 8260 Wireless LAN module
Racking and
Physical Security
Option Kit
Factory
Option
Part
Support
Configured
Kit
Number
Notes
HP Chassis Intrusion Sensor
Y
N
Remove Computrace BIOS Module*
Y
N
The Computrace agent is shipped turned off, and must be activated by customers when they
purchase a subscription. Subscriptions can be purchased for terms ranging from one to multiple
years. Service is limited, check with Absolute for availability outside the U.S.
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QuickSpecs
HP Z1 G3 AiO Workstation
Supported Components
Input Devices
Option
Factory Configured Kit
HP USB Business Slim Keyboard
Y
Y
HP USB Laser Scroll Mouse
Y
Y
Z1 HP No Keyboard
Y
N
Z1 No Included Mouse
Y
N
HP Wireless Business Slim KBD and Mouse*
Y
Y
NOTE 1: Only allowed with the No Mouse (T0J62AV) AV selected.
Other Hardware
HP Power Cord Kit
HP ENERGY STAR® Certified Configuration
Factory
Configured
Y
Y
Option
Kit
N
N
HP Performance Advisor
Factory
Configured
Y
Option
Kit
N
HP Remote Graphics Software (RGS) 6.0
Y
N
Buy Office
Foxit PDF Solution
N
Y
N
N
Software
Option Kit
Part
Support
Number
Notes
N3R87AA
QY778AA
N3R88AA
Note 1
Option Kit
Part
Support
Number
Notes
Option Kit
Part
Support
Number
Notes
See note
1
See note
2
NOTE 1: Available as a free download here: http://www.hp.com/go/performanceadvisor
NOTE 2: Supports Windows® 7 Professional, Windows® 8.1 Professional, Windows® 10
Professional, RHEL v6.6, 7 (Red Hat® Enterprise Linux® )
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QuickSpecs
HP Z1 G3 AiO Workstation
Supported Components
Operating Systems
Support Notes
See note 4
See note 3
HP Linux® Installer Kit
Red Hat® Enterprise Linux® (RHEL) Workstation - Paper License
(1yr)
Windows 10 Pro 64
Windows 10 Pro downgrade to Windows® 7 Professional 64
See note 1
Windows 10 Home 64
NOTE 1: See http://www.microsoft.com/Windows/Windows-7/ for support details.
NOTE 2: For detailed OS/hardware support information for Linux®, see:
http://www.hp.com/support/Linux_hardware_matrix.
NOTE 3: This second OS must be ordered with the HP Linux® Installer Kit as the first OS.
Note 4: What was formally known as the HP Installer Kit for Linux® (HPIKL) is no longer offered.
However, the capability provided by the HPIKL is still available by selecting/ordering two separate
items:
Linux®-ready (T0K20AV)
o Provides the Free DOS OS load
Linux® Drivers from the HP Support web site
The user must still obtain the Red Hat software bits from Red Hat® .
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
System Board
System Board Form
Factor
Processor Socket
CPU Bus Speed
Chipset
Super I/O Controller
Memory Expansion
Slots
Memory Type
Supported
Memory Modes
Memory Speed
Supported
Maximum Memory
Custom Motherboard
Single LGA 1151
DMI Gen3
Intel® PCH C236
Nuvoton NPCD315H
4 DDR4 SO-DIMM memory slots
DDR4, UDIMM (Unbuffered), ECC & non-ECC
Non-interleaved for single channel.
Interleaved when both channels are populated.
Up to 2300MT/s DDR4
64GB ECC or 64GB non-ECC
Memory Configuration 4GB, 8GB, and 16GB non-ECC/ 4GB and 8GB ECC unbuffered SO-DIMMs are supported.
(Supported)
ECC and non-ECC memory SO-DIMMs cannot be mixed on the same system.
PCI Express
Connectors
Supported Drive
Interfaces
USB Connector(s)
HD Integrated Audio
Flash ROM
CPU Fan Header
NOTES: Maximum memory capacities assume 64-bit operating systems, such as Windows 7
Professional 64-Bit or Red Hat® Linux® 64-bit. 32-bit Windows Operating Systems support up to
4 GB. 4GB, 8GB and 16GB non-ECC/4GB and 8GB ECC unbuffered SO-DIMMs are supported.
ECC and non-ECC memory SO-DIMMs cannot be mixed on the same system.
1 MXM 3.1 slot (PCIe Gen3 x16 dedicated for graphics)
2 M.2 Socket 3 up to Type 2280-M H4.2
1 M.2 Socket 1 up to Type 3030-E H4.2 for WLAN
SATA
Integrated Serial ATA interfaces:
2 x 6Gb/s SATA 3.0
NOTE: the Z1 supports a maximum of two SATA SFF/SSD drives only.
RAID 0 and 1 supported. (Factory integrated RAID is Microsoft
Windows® only).
Integrated RAID
NOTE: Requires identical hard drives (speeds, capacity, interface)
Integrated Graphics
Intel® HD Graphics P530 (on select processors)
Unified Memory Architecture (UMA)- A region of system memory is
reserved and dedicated to the graphics display.
DirectX 11.1 compliant and OpenGL 4.0.
Integrated Graphics can support up to 3 displays: embedded display
plus two external displays via either Rear IO or TBT.
Network Controller
Integrated Ethernet PHY Connection I219LM. Management capabilities:
WOL, PXE 2.1 and AMT 11.0
Front
Side (not Front):
1 USB 3.0, 1 USB 3.0 Charging Data Port
Rear
4 USB 3.0
Internal
1 USB 2.0 Type A, 2 USB 2.0 across one 9-pin header (9-pin header is
not available when the touch display option is selected)
Intel® HD / Conexant CX7501 codec
Yes
Yes
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
Front Control
Yes
Panel/Speaker Header
CMOS Battery Holder - Yes
Lithium
Integrated Trusted
Integrated TPM 2.0
Platform Module
TPM module disabled where restricted by law.
Power Supply Headers Yes
Power Switch, Power Yes
LED & Hard Drive LED
Header
Clear Password
Yes
Jumper
Keyboard/Mouse
USB
Power Supply
Power Supply
330W 90% Efficient, Custom PSU
(Wide Ranging, Active PFC)
Operating Voltage
90-264 VAC
Range
Rated Voltage Range
100-240 VAC
Rated Voltage Range
Rated Line Frequency
50-60 Hz
Rated Line Frequency
Operating Line
47-63 Hz
Operating Line Frequency Range
Frequency Range
Rated Input Current
5A @ 100-240 VAC
Rated Input Current
Heat Dissipation
Typical: 444 btu/hr (112 kg-cal/hr)
(Configuration and
Maximum: 1126 btu/hr (284 kg-cal/hr)
software dependent)
Power Supply Fan
None
ENERGY STAR®
Yes
Qualified
(Configuration
dependent)
80 PLUS® Compliant Yes, > 90% Efficiency at 50% Load 115VAC 60Hz
Z1 G3 330W power supply efficiency report available at this link:
http://www.plugloadsolutions.com/psu_reports/HP%20INC_PA-33311_330W_ECOS%204479_Report.pdf
FEMP Standby Power Yes
Compliant @115V
ErP LOT6 Compliant @ Yes
230V
(<0.5 W in S5 - Power
Off)
CECP Compliant @
NA
220V
(<4W in S3 - Suspend
to RAM)
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
Power Consumption in <4W
sleep mode
(as defined by
ENERGY STAR®) Suspend to RAM (S3)
(Instantly Available PC)
Built-in Self Test LED Yes
Surge Tolerant Full
Yes
Ranging Power Supply
(withstands power
surges up to 2000V)
System Configurations
Example Configuration Processor Info
#1
Memory Info
Graphics Info
Disks/Optical/Floppy
Power Supply
Other
Energy Consumption
(Watts)
Windows® Idle (S0)
Windows® Busy Typ
(S0)
Windows® Busy Max
(S0)
Sleep (S3)
Off (S5)
Zero Power Mode (EuP)
Heat Dissipation**
(Btu/hr)
Windows® Idle (S0)
Windows® Busy Typ
(S0)
Windows® Busy Max
(S0)
Sleep (S3)
Off (S5)
Zero Power Mode (EuP)
1x Intel® Core i3-6100
8GB DDR4-2133 nECC (2x4GB) SODIMM RAM
Intel® HD Graphics 530
1 x 500GB 7200RPM SATA HDD
330W 90% Custom PSU
115 VAC
230 VAC
100 VAC
LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled
115 VAC
230 VAC
100 VAC
LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
Example Configuration Processor Info
#2
Memory Info
Graphics Info
Storage
Power Supply
Energy Consumption
(Watts)
1xIntel® Xeon® E3-1225v5
16GB DDR4-2133 ECC (2x8GB) SODIMM RAM
1xNVIDIA® M1000M Graphics
HP Z Turbo Drive G2 512GB PCIe 1st SSD
512GB SATA 1st SSD
330W 90% Custom PSU
115 VAC
230 VAC
100 VAC
LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled
Windows® Idle (S0)
Windows® Busy Typ
(S0)
Windows® Busy Max
(S0)
Sleep (S3)
Off (S5)
Zero Power Mode (EuP)
Heat Dissipation**
(Btu/hr)
115 VAC
230 VAC
100 VAC
Windows® Idle (S0)
Windows® Busy Typ
(S0)
Windows® Busy Max
(S0)
Sleep (S3)
Off (S5)
Zero Power Mode (EuP)
Example Configuration Processor Info
#3
Memory Info
Graphics Info
Storage
Power Supply
Other
Energy Consumption
(Watts)
Windows® Idle (S0)
Windows® Busy Typ
(S0)
Windows® Busy Max
(S0)
Sleep (S3)
Off (S5)
Zero Power Mode (EuP)
Heat Dissipation**
(Btu/hr)
Windows® Idle (S0)
Windows® Busy Typ
(S0)
938 Btu/hr
Sleep (S3)
Off (S5)
Zero Power Mode (EuP)
1xIntel® Xeon® E5-1270v3
32GB DDR4-2133 ECC (4x8GB) SODIMM RAM
1xNVIDIA® M2000M
2 x HP Z Turbo Drive G2 512GB PCIe SSD
512GB SATA 1st SSD
330W 90% Custom PSU 115 VAC
230 VAC
100 VAC
LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled
115 VAC
230 VAC
100 VAC
LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
Example
Processor Info
Configuration #4 Memory Info
Graphics Info
Storage
Other
Power Supply
Energy
Consumption
(Watts)
64 GB DDR4-2133 ECC (4x16GB) SODIMM RAM
1xNVIDIA® M2000M
2 x HP Z Turbo Drive G2 512GB PCIe SSD
2 x 1TB 7200 RPM SATA HDD
Webcam and WLAN installed
330W 90% Custom PSU
115 VAC
Windows® Idle (S0)
Windows® Busy Typ(S0)
Windows® Busy Max (S0)
Sleep (S3)
Off (S5)
Zero Power Mode (ErP)
LAN Enabled
Windows® Idle (S0)
Windows® Busy Typ(S0)
Windows® Busy Max (S0)
Sleep (S3)
Off (S5)
Zero Power Mode (ErP)
LAN Enabled
Heat Dissipation**
(Btu/hr)
1 x Intel® Xeon® E3-1225v5
LAN Disabled
115 VAC
LAN Disabled
230 VAC
100 VAC
LAN Enabled LAN Disabled LAN Enabled
230 VAC
LAN Enabled LAN Enabled
LAN Disabled
100 VAC
LAN Disabled
LAN Enabled
Declared Noise Emissions (Entry-level and High-end configurations)
System Configuration Processor Info
(Entry level)
Memory Info
Graphics Info
Disks/Optical
Declared Noise
Emissions (in
accordance with ISO
7779 and ISO 9296)
Sound Power (LWAd, bels)
Desktop Sound Pressure (LpAm,
decibels)
Idle
Hard drive Operating
(random reads)
DVD-ROM Operating
(sequential reads)
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
System Configuration Processor Info
(Entry level)
Memory Info
Graphics Info
Disks/Optical
Declared Noise
Emissions (in
accordance with ISO
7779 and ISO 9296)
Sound Power (LWAd, bels)
Desktop Sound Pressure (LpAm,
decibels)
Sound Power (LWAd, bels)
Desktop Sound Pressure (LpAm,
decibels)
Idle
Hard drive Operating
(random reads)
DVD-ROM Operating
(sequential reads)
System Configuration Processor Info
(High-end)
Memory Info
Graphics Info
Disks/Optical
Declared Noise
Emissions (in
accordance with ISO
7779 and ISO 9296)
Environmental
Requirements
Idle
Hard drive Operating
(random reads)
DVD-ROM Operating
(sequential reads)
Temperature
Humidity
Maximum Altitude
Dynamic (new)
Operating: 40° to 95° F (5° to 35° C)
Non-operating: -40° to 140° F (-40° to 60° C)
Operating: 8% to 85% RH, non-condensing
Non-operating: 8% to 90% RH, non-condensing
Operating: 10,000 feet (3,000 m)
Non-operating: 30,000 feet (9,100 m)
Shock
Operating: ½-sine: 40g, 2-3ms (~62 cm/sec)
Non-operating:
½-sine: 160 cm/s, 2-3ms (~105g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz, up to 0.0025 g²/Hz
Non-operating random: 2.0g (rms), 5-500 Hz, up to 0.0150 g²/Hz
Cooling
Values represent individual shock events and do not indicate repetitive
shock events. Values do not indicate continuous vibration.
Above 5,000 ft (1524 m) altitude, maximum operating temperature is
de-rated by 1.8° F (1° C) per 1,000 ft (305 m) elevation increase.
Physical Security and Serviceability
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
Access Panel
Hard Drives
Expansion Cards
Tool-free
Tool-less
MXM graphics assembly screws in with two M3 screws and requires a #2 Phillips screwdriver.
M.2 accessory cards screw-in with the included screw stand offs and require a Torx T8
screwdriver.
Tool-free, except for the processor heatsink.
(Blue User Touch Points) Placed on tool-free chassis mechanism touch points
Processor Socket
Green User Touch
Points
Color-coordinated
When appropriate
Cables and Connectors
Memory
Tool-less
System Board
Screw-In with 8 × 6-32 screws and requires a Torx T15 or flat headed screwdriver
Over-Temp Warning on Yes
Screen
Restore CD/DVD Set
Restores the computer to its original factory shipping operating system. Orderable with the
workstation, or available from Support.
Dual Function Side
Power on/off
Power Switch
Causes a fail-safe power off when held for 4 seconds
Cable Lock Support
Solenoid Lock and
Hood Sensor
Serial, Parallel, USB,
Audio, Network,
Enable/Disable Port
Control
Power-On Password
Setup Password
NIC LEDs (integrated)
(Green & Amber)
CPUs and Heatsinks
Yes, Cable Lock (optional): Locks rear cover and secures chassis from theft
3mm x 7mm slot at rear of system
No Solenoid Lock
Hood Sensor - The Sensor Kit detects when the access panel has been opened.
Enables or disables USB, audio, and network ports
Yes, prevents an unauthorized person from booting up the workstation
Yes, prevents an unauthorized person from changing the workstation configuration
Yes
A T-15 Torx or flat blade screwdriver is needed to remove the CPU heatsink before the CPU can
be removed. CPU removal is tool-less
Yes
Power Supply
Diagnostic LED
Side Power Button
ACPI multi-function
Side Power LED
white (normal), red (fault)
Side Hard Drive Activitywhite
LED
Internal Stereo
Two 2W speakers
Speakers
System/Emergency
Recovers corrupted system BIOS.
ROM Flash Recovery
Cooling Solutions
Air cooled forced convection
Power Supply Fans
Two 40 mm x 40 mm x 20 mm 4-wire PWM (not serviceable separately from the power supply)
System Blower
2 × 80 mm blowers require a Torx T15 screwdriver to remove.
HP PC Hardware
HP Vision Diagnostics utility must be booted from USB or CD, and enables you to perform testing
Diagnostics UEFI
and to view critical computer hardware and software configuration information from various
sources.
Access Panel Key Lock No
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
ACPI-Ready Hardware Advanced Configuration and Power Management Interface (ACPI).
Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and
peripherals in a low-power or powered-off state without affecting other elements of the
system
Trusted Platform
Module Chip
Integrated Chassis
Handles
Power Supply
M.2 Card Card
Retention
Flash ROM
Diagnostic Power
Switch LED on board
Clear Password
Jumper
Clear CMOS Button
CMOS Battery Holder
DIMM Connectors
Yes
No
Tool-less
M.2 accessory cards screw-in with the included screw stand offs and require a Torx T8
screwdriver.
WLAN/BT card screws-in with shoulder screw and requires a P1 phillips screwdriver.
Present
No
Present
Present
Present
Tool-free
BIOS
BIOS 32-bit Services
ATAPI
BBS
WMI Support
Standard BIOS 32-bit Service Directory Proposal v0.4
ATAPI Removable Media Device BIOS Specification Version 1.0.
BIOS Boot Specification v1.01.
WMI is Microsoft's implementation of Web-Based Enterprise Management (WBEM) for
Windows®. WMI is fully compliant with the Distributed Management Task Force (DMTF) Common
Information Model (CIM) and WBEM specifications.
BIOS Boot Spec 1.01+ Provides more control over how and from what devices the workstation will boot.
BIOS Power On
Users can define a specific date and time for the system to power on.
ROM Based Computer Review and customize system configuration settings controlled by the BIOS.
Setup Utility (F10)
System/Emergency
Recovers system BIOS in corrupted Flash ROM.
ROM Flash Recovery
with Video
Replicated Setup
Saves BIOS settings to USB flash device in human readable file. BIOS Configuration Utility (BCU)
can then replicate these settings on machines being deployed without entering Computer
Configuration Utility (F10 Setup).
SMBIOS
System Management BIOS 2.7.1, for system management information.
Boot Control
Disables the ability to boot from removable media on supported devices.
Memory Change Alert Alerts management console if memory is removed or changed.
Thermal Alert
Monitors the temperature state within the chassis. Three modes:
Remote ROM Flash
NORMAL - normal temperature ranges.
ALERTED - excessive temperatures are detected. Raises a flag so action can be taken to
avoid shutdown or provide for a smoother system shutdown.
SHUTDOWN - excessive temperatures are encountered. Automatically shuts down the
computer without warning before hardware component damage occurs.
Provides secure, fail-safe ROM image management from a central network console.
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
ACPI (Advanced
Configuration and
Power Management
Interface)
Allows the system to enter and resume from low power modes (sleep states).
Enables an operating system to control system power consumption based on the dynamic
workload.
Makes it possible to place individual cards and peripherals in a low-power or powered-off state
without affecting other elements of the system.
Supports ACPI 4.0 for full compatibility with 64-bit operating systems.
Ownership Tag
A user-defined string stored in non-volatile memory that is displayed in the BIOS splash screen.
Remote Wakeup/
System administrators can power on, restart, and power off a client computer from a remote
Remote Shutdown
location.
Instantly Available PC Allows for very low power consumption with quick resume time.
(Suspend to RAM ACPI sleep state S3)
Remote System
Allows a new or existing system to boot over the network and download software, including the
Installation via F12
operating system.
(PXE 2.1) (Remote Boot
from Server)
ROM revision levels
Reports the system BIOS revision level in Computer Configuration Utility (F10 Setup). Version is
available through an industry standard interface (SMBIOS) so that management SW applications
can use and report this information.
System board revision
level
Start-up Diagnostics
(Power-on Self-Test)
Auto Setup when new
hardware installed
Keyboard-less
Operation
Localized ROM Setup
Allows management SW to read revision level of the system board.
Revision level is digitally encoded into the HW and cannot be modified.
Assesses system health at boot time with selectable levels of testing.
System automatically detects addition of new hardware.
The system can be booted without a keyboard.
Common BIOS image supports System Configuration Utility (F10 Setup) menus in 14 languages
with local keyboard mappings.
Asset Tag
Enables the user or IT administrator to set a unique tag string in non-volatile memory.
Per-slot Control
Allows I/O slot parameters (option ROM, enable/disable, bus latency) to be configured
individually.
Adaptive Cooling
Control parameters are set according to detected hardware configuration for optimal acoustics.
Pre-boot Diagnostics (Pre-video) critical errors are reported via beeps and blinks on the power LED.
Digitally and
Helps to prevent the installation of unauthorized versions of a BIOS (a rogue BIOS) from a virus,
Cryptographically
malware, or other code that could lead to compromised system security, data access, physical
Signed BIOS
service, or even system board replacement.
Master Boot Record
A feature in the HP BIOS that prevents changes and/or infections to the Master Boot Record.
Protection
Useful in protecting from viruses
Boot Block Emergency The HP BIOS offers a write-protected boot block ROM that provides recovery from a failed
Recovery Mode (BIOS flashing of the computer BIOS. This special recovery mode prevents the system from becoming
Recovery)
unusable or "bricked" when a BIOS update is interrupted.
Industry Standard
Specification Support
Industry Standard
Revision Supported by the BIOS
UEFI Specification
2.4
Revision
ACPI
Advanced Configuration and Power Management Interface, Version 4.0
ASF
Alert Standard Format Specification, Version 2.0
ATA (IDE)
AT Attachment 6 with Packet Interface (ATA/ATAPI-6), Revision 3b
CD Boot
"El Torito" Bootable CD-ROM Format Specification Version 1.0
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QuickSpecs
HP Z1 G3 AiO Workstation
System Technical Specifications
EDD
PCI Express
PMM
SATA
SPD
TPM
USB
- Enhanced Disk Drive Specification Version 1.1
- BIOS Enhanced Disk Drive Specification Version 3.0
- PCI Express Mini Card Electromechanical Specification Revision 1.2
- PCI Express Base Specification, Revision 2.0
- PCI Express Base Specification, Revision 3.0
- MXM Graphics Module Mobile PCI Express Module Electromechanical
Specification Version 3.0, Revision 3.1
POST Memory Manager Specification, Version 1.01
- Serial ATA Specification, Revision 1.0a
- Serial ATA II: Extensions to Serial ATA 1.0, Revision 2.6
- Serial ATA II Cables and Connectors Volume 2 Gold
- SATA-IO SATA Revision 3.0 Specification
PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2B
Trusted Computing Group TPM Specification Version 1.2
- Universal Serial Bus Revision 1.1 Specifiation
- Universal Serial Bus Revision 2.0 Specification
- Universal Serial Bus Revision 3.0 Specification
- Universal Serial Bus Revision 3.1 Specification
Social and Environmental Responsibility
Eco-Label CertificationsThis product has received or is in the process of being certified to the following approvals and may
& Declarations
be labeled with one or more of these marks:
Batteries
ENERGY STAR® (energy-saving features available on selected configurations-Windows®
only)
US Federal Energy Management Program (FEMP)
IT ECO declaration
The battery in this product complies with EU Directive 2006/66/EC
Battery size: CR2032 (coin cell)
Battery type: Lithium Metal
The battery in this product does not contain:
Mercury greater than 5ppm by weight
Cadmium greater than 10ppm by weight
Lead greater than 40ppm by weight
Restricted Material
This product meets the material restrictions specified in HP's General Specification for the
Usage
Environment. http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf
HP is committed to compliance with all applicable environmental laws and regulations, including
the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to
exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide
basis.
Low Halogen StatementThis product is low halogen except for power cords, cables and peripherals. Service parts
obtained after purchase may not be Low Halogen.
End-of-Life
HP offers end-of-life HP product return and recycling programs in many geographic areas. To
Management and
recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales
Recycling
office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
This product is greater than 90% recyclable by weight when properly disposed of at end of life.
HP Corporate
For more information about HP's commitment to the environment:
Environmental
Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Information
Eco-label certifications
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
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HP Z1 G3 AiO Workstation
System Technical Specifications
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html
Additional Information
This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive - 2002/96/EC.
Plastic parts weighing over 25 grams used in the product are marked per ISO 11469 and
ISO1043.
This product is >90% recycle-able when properly disposed of at end of life.
Packaging
EPEAT® Gold - ENERGY STAR® qualified configurations of this product are in compliance with
the IEEE 1680 (EPEAT) standard at the Gold level where applicable. EPEAT registration varies by
country. See http://ww2.epeat.net/CompanyDetail.aspx?CompanyID=24 for registration status in
your country.
HP Workstation product packaging meets the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/society/gen_specifications.html
Does not contain restricted substances listed in HP Standard 011-1 General Specification
for the Environment
Does not contain ozone-depleting substances (ODS)
Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess
of 100 ppm sum total for all heavy metals listed
Maximizes the use of post-consumer recycled content materials in packaging materials
All packaging material is recyclable
All packaging material is designed for ease of disassembly
Reduced size and weight of packages to improve transportation fuel efficiency
Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards
formatting
Packaging Materials
Internal
External
Cushions and plastic bags made of low density polyethylene (LDPE).
Outer carton, accessories carton, and insert made of corrugated paper board.
Manageability
Industry Standard
Specifications
Intel® Active
Management
Technology (AMT)
This product meets the following industry standard specifications for manageability functionality:
DASH 1.1 required functionalities via integrated Intel® LAN
Intel® Active Management Technology (Intel® AMT) 11.0
An advanced set of remote management features and functionality which provides network
administrators the latest and most effective tools to remotely discover, heal, and protect networked
client systems regardless of the system's health or power state. AMT 11.0 includes the following
advanced management functions:
Power Management (on, off, standby, reset)
Hardware/Software Inventory (includes BIOS and firmware revisions
Hardware Alerting
Agent Presence
System Defense Filters
Serial Over LAN (SOL)
ME Wake-on-LAN
DASH 1.0 compliance
IPv6 Support
Fast Call for Help - a client inside or outside the firewall may initiate a call for help via BIOS
screen, periodic connections, or alert triggered connection
Remote Scheduled Maintenance - pre-schedule when the PC connects to the IT or service
provider console for maintenance. Remote PCs can get required patches, be inventoried,
etc. by connecting to their IT console or Service Provider when it's convenient
Remote Alerts - automatically alert IT or service provider if issues arise
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HP Z1 G3 AiO Workstation
System Technical Specifications
Access Monitor - Provides oversight into Intel® AMT actions to support security
requirements
PC Alarm Clock
Protected Audio Video Path (PAVP)
Microsoft NAP Support
Host Base set-up and configuration
Management Engine (ME) firmware roll back
Enhanced KVM resolution (Up to 4K)
Intel® vPro
The HP Z1 G3 features Intel® vPro technologies when purchased with a vPro technology
Technology
capable CPU: Intel® Xeon® E3 5th Generation processor family or 6th Generation Intel® Core
i5/i7 processors with Intel® VT-d/VT-x and Intel® TXT technology.
Remote Manageability The HP Z1 G3 Workstation is supported on the following remote manageability software consoles
Software Solutions
(sold separately):
• LANDesk Management Suite (PSG recommended solution)
• Microsoft System Center Configuration Manager
For questions or support for manageability needs, please visit http://www.hp.com/go/easydeploy
System Software
For questions or support for SSM, please visit: http://www.hp.com/go/ssm
Manager
Service, Support, and Three years parts, labor, onsite limited warranty depending on country and includes free support
Warranty
24 x 7. The warranty terms vary by region and are not available in all countries. Optional Care
Packs are available to extend your protection beyond the standard limited warranty. To choose the
right level of extended service for your HP product, visit HP Care Pack Central:
http://www.hp.com/go/cpc
NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply.
NOTE 2: On-site service may be provided pursuant to a service contract between HP and an
authorized HP third-party provider, and is not available in certain countries. Global service
response times are based on commercially reasonable best effort and may vary by country.
NOTE 3: Technical support applies only to HP-configured, HP and HP-qualified, third-party
hardware and software. 24x7 support service may not be available in some countries.
HP Care Packs are optional extended service contracts that go beyond the standard limited
warranties. Service starts from date of hardware purchase. To choose the right level of extended
service for your HP product, visit HP Care Pack Central: http://www.hp.com/go/cpc.
Product Change
Notification
Program to proactively communicate Product Change Notifications (PCNs) and Customer
Advisories by email to customers, based on a user-defined profile.
PCNs provide advance notification of hardware and software changes to be implemented in
the factory providing time to plan for transition.
Customer Advisories provide concise, effective problem resolution, greatly reducing the
need to call technical support.
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HP Z1 G3 AiO Workstation
Technical Specifications - Processors
Processors
Intel® Core i3-6100 3.7 2133 2C CPU
Intel® Core i7-6700 3.4 2133 4C CPU
Intel® Core i5-6500 3.2 2133 4C CPU
Intel® Xeon® E3-1270 v5 3.6 2133 4C CPU
Intel® Xeon® E3-1245 v5 3.5 2133 4C CPU
Intel® Xeon® E3-1225 v5 3.3 2133 4C CPU
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HP Z1 G3 AiO Workstation
Technical Specifications - Hard Drives
SATA Hard Drives for
HP Workstations
500GB SATA 7200 rpm Capacity
6Gb/s 2.5" HDD
Height
Width
500,107 MB
Media Diameter
Physical Size
Interface
Synchronous Transfer
Rate (Maximum)
Buffer
Seek Time (typical
Single Track
reads, includes
Average
controller overhead,
Full Stroke
including settling)
Rotational Speed
Logical Blocks
Operating Temperature
1TB SATA 7200 rpm
6Gb/s 2.5" HDD
Capacity
Height
Width
1,000,204MB
Media Diameter
Physical Size
Interface
Synchronous Transfer
Rate (Maximum)
Buffer
Seek Time (typical
Single Track
reads, includes
Average
controller overhead,
Full Stroke
including settling)
Rotational Speed
Logical Blocks
Operating Temperature41° to 131° F (5° to 55° C)
Rotational Speed
7,200 rpm
Operating Temperature41° to 131° F (5° to 55° C)
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HP Z1 G3 AiO Workstation
Technical Specifications - Hard Drives
SATA SSDs for HP
Workstations
HP 256GB SATA 6Gb/s SSD
HP 256GB SATA 6Gb/s SED
Opal SSD
HP 512GB SATA 6Gb/s SSD
HP 1TB SATA 6Gb/s SSD
Capacity
Height
Interface
Synchronous
Transfer Rate
(Maximum)
Operating
Temperature
256,060 MB
0.28 in; 0.7 cm
SATA 6Gb/s
Up to 500MB/s (Sequential Read)
Capacity
Height
Width
Interface
Synchronous
Transfer Rate
(Maximum)
Operating
Temperature
256,060 MB
0.28 in; 0.7 cm
Physical Size
2.5 in; 6.36 cm
6Gb/s SATA
Up to 500MB/s (Sequential Read)
Capacity
Height
Width
Interface
Synchronous
Transfer Rate
(Maximum)
Operating
Temperature
512GB
0.28 in; 0.7 cm
Physical Size
2.5 in; 6.36 cm
SATA 6Gb/s
Up to 500MB/s (Sequential Read)
Capacity
Height
Width
Interface
Synchronous
Transfer Rate
(Maximum)
Operating
Temperature
1,024,209 MB
0.28 in; 0.7 cm
Physical Size
2.5 in; 6.36 cm
SATA 6Gb/s
Up to 550MB/s (Sequential Read)
32° to 158° F (0° to 70° C)
32° to 158° F (0° to 70° C)
32° to 158° F (0° to 70° C)
32° to 158° F (0° to 70° C)
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HP Z1 G3 AiO Workstation
Technical Specifications - Hard Drives
Z Turbo Drives for HP
Workstations
HP 1TB Z-Turbo NVMe M.2
SSD
Capacity
1,024,209 MB
HP 512GB Z-Turbo NVMe M.2
SSD
Capacity
512,110 MB
HP 256GB Z-Turbo NVMe M.2
SSD
Capacity
256,060 MB
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HP Z1 G3 AiO Workstation
Technical Specifications – Graphics
Integrated Intel® HD
Graphics (Z1 G3)
Form Factor
Graphics Controller
Memory
Connectors
Maximum Resolution
Shading Architecture
Supported Graphics
APIs
Available Graphics
Drivers
Integrated in select Intel® Xeon® E3, Intel® Core i7, Core i5, Core
i3, and Pentium® processors.
Check specific platform specifications for selections.
Intel® HD Graphics
Unified Memory Architecture (UMA) frame buffer. Graphics memory is
shared with system memory. Size selectable between 32 MB to 1024
MB via BIOS setting. Default size is 128 MB. Additional memory is
allocated for graphics as needed using Intel's Dynamic Video Memory
Technology (Intel® DVMT), to provide an optimal balance between
graphics and system memory use.
Check system platform specifications where Intel® HD Graphics are
available.
Display Port: 3840x2160
DVI: 1920x1200
VGA: 2048x1536
Note: For DVI and VGA outputs, separate adapters may be required.
Shader Model 5.1
OpenGL 4.4
DirectX 12
Windows® 7 64-bit
Windows® 10 64-bit
NVIDIA® Quadro®
Form Factor
M1000M 2GB Graphics Graphics Controller
MXM v3.1 Type A (82mm x 70mm)
N16P-Q1, 993MHz core clock
512 CUDA cores
Bus Type
PCI Express Gen 3 x16 (part of MXM v3.1 connector)
Memory
2GB GDDR5
128bit wide interface
2500MHz,
80 GB/s
Connectors
One MXM v3.1 connector (285-pin)
Maximum Resolution 2 x 4096x2160 @ 60Hz digital displays +
1 x 3840x2160 @ 60Hz internal digital display
In Z1 G3 application:
- Internal Display: 3840x2160
- External Display via DP 1.2 connector: 4096x2160
- External Display via Thunderbolt 3 connector: 4096x2160
RAMDAC
Not Applicable
Image Quality FeaturesEach color component can be processed at up to 32-bit floating point
precision and displayed at up to 12-bit precision.
Advanced FXAA and TXAA antialiasing.
16K Texture and Render Processing.
MPEG-2 HD and WMV HD video playback (1920x1080p).
H.264 hardware decode acceleration.
Nvidia Scalable Geometry Engine.
Shading Architecture Shader Model 5.0 support
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QuickSpecs
HP Z1 G3 AiO Workstation
Technical Specifications – Graphics
Supported Graphics
APIs
Available Graphics
Drivers
Notes
Full IEEE 764-2008 32-bit
DirectX 12
OpenGL 4.5
Compute API support for NVIDIA® CUDA C, CUDA C++,
DirectCompute 5.0, OpenCL, Java, Python and Fortran
Windows® 7 64-bit
Windows® 10 64-bit
SUSE Linux® Enterprise Desktop 11 64-bit
Red Hat® Enterprise Linux® 6 Workstation 64-bit
See http://www.hp.com/go/support for HP supported NVIDIA graphics
drivers
NVIDIA® Quadro®
Form Factor
M2000M 4GB Graphics Graphics Controller
MXM v3.1 Type A (82mm x 70mm)
N16P-Q3, 1084MHz core clock
640 CUDA cores
Bus Type
PCI Express Gen 3 x16 (part of MXM v3.1 connector)
Memory
4GB GDDR5
128 bit wide interface
2500MHz,
80 GB/s
Connectors
One MXM v3.1 connector (285-pin)
Maximum Resolution 2 x 4096x2160 @ 60Hz digital displays +
1 x 3840x2160 @ 60Hz internal digital display
In Z1 G3 application:
- Internal Display: 3840x2160
- External Display via DP 1.2 connector: 4096x2160
- External Display via Thunderbolt 3 connector: 4096x2160
RAMDAC
Not Applicable
Image Quality FeaturesEach color component can be processed at up to 32-bit floating point
precision and displayed at up to 12-bit precision.
Advanced FXAA and TXAA antialiasing.
16K Texture and Render Processing.
MPEG-2 HD and WMV HD video playback (1920x1080p).
H.264 hardware decode acceleration.
Nvidia Scalable Geometry Engine.
AES-128 CTR/CBC/ECB decryption modes supported.
NVIDIA® 3D Vision Pro
Shading Architecture Shader Model 5.0 support
Supported Graphics
Full IEEE 764-2008 32-bit
APIs
DirectX 12
OpenGL 4.5
Compute API support for NVIDIA® CUDA C, CUDA C++,
DirectCompute 5.0, OpenCL, Java, Python and Fortran
Available Graphics
Windows® 7 64-bit
Drivers
Windows® 10 64-bit
SUSE Linux® Enterprise Desktop 11 64-bit
Red Hat® Enterprise Linux® 6 Workstation 64-bit
Notes
See www.hp.com/go/support for HP supported NVIDIA® graphics
drivers
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QuickSpecs
HP Z1 G3 AiO Workstation
Technical Specifications – Optical and removable storage
HP External Ultra-Slim Description
External 9.5mm high, tray-load
DVD-RW Drive
Mounting Orientation Either horizontal or vertical
Interface Type
USB 2.0
Dimensions (WxHxD) 144 x 14 x 137.5mm
Supported Media TypesDVD-RAM
DVD+R
DVD+RW
DVD+R DL
DVD-R DL
DVD-R
DVD-RW
CD-R
CD-RW
Disc Capacity
DVD-ROM
8.5 GB DL or 4.7 GB standard
Access Times
Full Stroke DVD
160ms (typical for Random Stroke)
Full Stroke CD
140ms (typical for Random Stroke)
Maximum Data
Transfer Rates
CD ROM Read
DVD ROM Read
Power
Operating
Environmental (all
conditions noncondensing)
Operating Systems
Supported
Kit Contents
Approvals
Source
DC Power
Requirements
DC Current
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
DVD-RAM Up to 8X
DVD+RW Up to 8X
DVD-RW Up to 8X
DVD+R DL Up to 8X
DVD-R DL Up to 8X
DVD-ROM Up to 8X
DVD-ROM DL Up to 8X
DVD+R Up to 8X
DVD-R Up to 8X
USB 2.0 DC power
5 VDC ± 5%-100 mV ripple p-p
5 VDC -< 800 mA typical, <1600 mA
maximum
41° to 104° F (5° to 40° C)
15% to 80%
84° F (29° C)
Temperature
Relative Humidity
Maximum Wet Bulb
Temperature
Windows 10 32-bit and 64-bit, Windows®8 32-bit and 64-bit, Windows®
7 Professional 32-bit and 64-bit, Windows Vista Business 64*, Windows
Vista Business 32*, Windows Vista Home Basic 32*, Windows 2000,
Windows XP Professional or Windows XP Home 32*.
Red Hat® Enterprise Linux® (RHEL) WS4**, 5, 6 Desktop/Workstation,
Removed reference to "Novell" because of acquisition and changed
product reference to "SUSE Linux® Enterprise Desktop 10 & 11",
No driver is required for this device. Native support is provided by the
operating system.
HP External Ultra-Slim DVD-RW Drive DVD Writer drive, USB 2.0 type
A to mini-B cable.
© Copyright 2016 HP Development Company, L.P.
The only warranties for HP products and services are set forth in the
express warranty statements accompanying such products and
services. Nothing herein should be construed as constituting an
DA - 15564 Worldwide QuickSpecs — Version 1 — 4.18.2016
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QuickSpecs
HP Z1 G3 AiO Workstation
Technical Specifications – Optical and removable storage
additional warranty. HP shall not be liable for technical or editorial errors
or omissions contained herein. The information contained herein is
subject to change without notice.
DA - 15564 Worldwide QuickSpecs — Version 1 — 4.18.2016
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QuickSpecs
HP Z1 G3 AiO Workstation
Technical Specifications - Networking and Communications
Integrated Intel®
I219LM PCIe GbE
Controller
(Intel® vPro with
Intel® AMT 11.0)
Connector
Controller
Memory
Data Rates Supported
Compliance
RJ-45
Intel® I219LM GbE platform LAN connect networking controller
3 KB Tx and 3KB Rx FIFO packet buffer memory
10/100/1000 Mbps
802.1as/1588, 802.1p, 802.1Q, 802.3, 802.3ab, 802.3az, 802.3i,
802.3u, 802.3z
Bus Architecture
PCI Express and SMBus
Data Transfer Mode
PCIe-based interface for active state operation (S0 state) and SMBus
for host and management traffic (Sx low power state)
Power Requirement
Requires 3.3V (integrated regulators for core Vdc)
Boot ROM Support
Yes
Network Transfer Mode Full-duplex; Half-duplex (not supported for the 1000BASE-T
transceiver)
Network Transfer Rate 10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps
Management
vPro, WOL, auto MDI crossover, PXE, iSCSI Boot, Muti-port teaming,
Capabilities
RSS, ACPI, Advanced cable diagnostic, loopback modes,
AMT 9.0 support, Circuit Breaker, VLAN, Multicast Listener Discovery
(MLD)
Optional Intel® 8260 Connector
Wireless LAN
Controller
(802.11ac) and
Compliance
Bluetooth® 4.2 Module
Bus Architecture
Power Requirement
Management
Capabilities
Throughput
M.2 (Supports 2230 form factor; E Key) Motherboard Interface
Intel® Dual Band Wireless-AC 8260
Wireless LAN: IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i,
802.11h, 802.11w, CCX 4.x/CCX Lite, WMM, WPA, WPA2, APS, WPS
2.0, Protected Management Frames
Bluetooth®: Dual Mode Bluetooth® 2.1, 2.1+EDR, 3.0, 4.0, BLE, and
4.2
PCI Express Gen3 x1 and USB 2.0
Requires 3.3V ; 1.65W TDP
Wake on WLAN (in all sleep states, excluding Max Power Savings
mode), WFA Management Frame Protection (802.11w), vPro/WiAMT
Not Currently Supported, F10 BIOS Menu option to disable/enable
WLAN and Bluetooth® radios, supports seamless roaming between
802.11 wireless access points
Max PHY throughput 887 Mbps (802.11ac) for WLAN
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QuickSpecs
HP Z1 G3 AiO Workstation
Summary of Changes
Date of change:
Version History:
From v1 to v2
Description of change:
DA - 15564 Worldwide QuickSpecs — Version 1 — 4.18.2016
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QuickSpecs
HP Z1 G3 AiO Workstation
title
© 2016 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products and services are set forth in the express warranty statements accompanying such products and
services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or
editorial errors or omissions contained herein. Intel, Core, Xeon, Pentium and Thunderbolt are trademarks of Intel
Corporation in the U.S. and other countries. Microsoft and Windows are either trademarks or registered trademarks of
Microsoft Corporation in the U.S. and other countries. Linux is the registered trademark of Linus Torvalds in the U.S. and
other countries. Bluetooth is a trademark owned by its proprietor and used by HP Inc. under license. ENERGY STAR® is a
registered trademark owned by the U.S. Environmental Protection Agency. . Red Hat is a registered trademark of Red Hat,
Inc. in the United States and other countries. NVIDIA, Quadro and the NVIDIA logo are trademarks and/or registered
trademarks of NVIDIA Corporation in the U.S. and other countries.
DA - 15564 Worldwide QuickSpecs — Version 1 — 4.18.2016
Page 33
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