TEA19031AT
USB-PD controller for SMPS
Rev. 2 — 1 December 2017
1
Product data sheet
General description
The TEA19031AT is a highly configurable secondary side SMPS controller that is
available in many factory configured versions. Section 15 gives an overview of the offthe-shelf available versions of the TEA19031AT. To inquire about the possibilities of
customer-specific versions, contact your local sales representative.
The TEA19031AT supports the following protocols:
• USB Power Delivery (USB-PD) 2.0 (certified: 2017-03-22; test ID: 100054)
• USB type-C v1.2
Together with the TEA193x primary controller and the TEA199x secondary side
Synchronous Rectifier (SR) controller, a Switched Mode Power Supply (SMPS) can be
built.
The SMPS has a small form factor and ultra-high efficiency over the entire load range.
This power supply has an extremely low no-load input power (< 30 mW). It meets
efficiency requirements like CoC Tier-2, EuP lot 6, and DOE v6. The complete SMPS
system can be built at low cost with a minimum number of external components.
The TEA19031AT has a high level of digital integration. It incorporates all circuits,
including a charge pump to drive an external NMOS load switch directly. It also
incorporates a USB PD Physical Interface (PHY) and an integrated driver for fast output
discharge.
The output voltage and output current are continuously measured. They are used to
control the SMPS. The NTC pin can continuously measure the adapter temperature or
the temperature in the cable/connector. Optionally, the NTC pin can also be used for
other features, like OTP or Synchronous Rectification (SR). The die temperature of the
TEA19031AT is measured and protected via an internal temperature sensor.
The TEA19031AT provides best-in-class charging safety. To ensure the safe operation
of the SMPS, it incorporates all required protections. These protections cover up to 19
different failure use cases (see Section 2.3).
To ensure correct operation under all conditions, all protections are implemented in
hardware. So, when the microcontroller stops, the protections are still functional.
If an output short circuit occurs, the power dissipation from the mains input in the adapter
is less than 50 mW.
For output voltage/current regulation, and protection, only a single optocoupler is
required in the application. The TEA19031AT operates in Constant Voltage (CV) mode
with better than 2 % Voltage accuracy or in Constant Current (CC) mode with better than
2 % full load current accuracy.
TEA19031AT
NXP Semiconductors
USB-PD controller for SMPS
2
Features and benefits
2.1 General
• Best-in-class full safe application for high-power adapters, which gives complete
protection against overload conditions in the load (e.g. phone)
• Wide output voltage operating range (2.9 V to 20 V)
• Ultra-high efficiency together with TEA193x QR/DCM controller and TEA199x SR
controller
• Very low no-load power (< 30 mW for the complete system solution)
• High power density
• Dedicated SW pin to drive external NMOS directly
• Constant Voltage (CV) and Constant Current (CC) control
• Precise voltage and current control with low minimum step size (voltage 12-bit DAC,
current 10-bit DAC)
• Continuous accurate measurement of output voltage and output current
• Low-cost SO10 package (suitable for reflow soldering and wave soldering)
• Low-cost Bill Of Materials (BOM; ≈15 external components)
• Embedded MCU (with ROM, RAM, and MTP memory)
• Discharge pin for fast discharge
• Built-in series regulator and cable compensation
• Non-volatile MTP memory for storage of system configuration parameters
2.2 Protocol support
• USB-PD 2.0 (certified: 2017-03-22; test ID: 100054) and USB type C v1.2
• Supports unstructured Vendor Defined Messages (VDMs).
2.3 Protections
•
•
•
•
•
•
•
•
•
•
Internal OverTemperature Protection (OTP)
Adaptive OverVoltage Protection (OVP)
Adaptive UnderVoltage Protection (UVP)
OverCurrent Protection (OCP)
UnderVoltage LockOut (UVLO) protection
Output Short Protection (OSP)
Open-SUpply Protection (OSUP)
Overvoltage protection CC1, and CC2 pins
Soft short protection at the CC1 and CC2 pins
Soft short protection at the output
Due to dedicated functionality to drive an external load switch, which is available in
hardware, the TEA19031AT ensures safe operation under all conditions.
3
Applications
• USB-PD 2.0 and USB type-c v1.2 chargers with optional VDM support for
smartphones, tablets, and laptops
TEA19031AT
Product data sheet
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TEA19031AT
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USB-PD controller for SMPS
4
Ordering information
Table 1. Ordering information
Type number
TEA19031AET/1
TEA19031AFT/1
Package
Name
Description
Version
SO10
plastic small outline package; 10 leads; body width: 3.9 mm; body
thickness 1.35 mm
SOT1437-1
TEA19031AGT/1
TEA19031AMT/1
TEA19031AOT/1
TEA19031AQT/1
5
Marking
Table 2. Marking
TEA19031AT
Product data sheet
Type number
Marking code
TEA19031AET/1
EA19031AE
TEA19031AFT/1
EA19031AF
TEA19031AGT/1
EA19031AG
TEA19031AMT/1
EA19031AM
TEA19031AOT/1
EA19031AO
TEA19031AQT/1
EA19031AQ
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TEA19031AT
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USB-PD controller for SMPS
6
Block diagram
OPTO
VCC
30 µA
BG_det
BG_OK
SW_OFF
SUPPLY
BLOCK
BG_OK
UVLO
REF
VCC_
below_xxx
4 bits
Vout_below_vcc
VSNS
20 mA
OVP
ISNS
DISCH
OCP
amp
Vout_below_0p8
DAC
DAC
DAC
DAC
ADC
0.8 V
CHARGE
PUMP
SW
OTP
ana_ctrl
UVLO
PARAMETER
SETTINGS
PROTO
OSC
TYPEC
CONDET
NTC
ROM
GND
µC
DIGITAL
RAM
SW_OFF
PHY
I2C
(M/S)
OR
CC
block
CC1
CC2
aaa-026064
Figure 1. TEA19031AT block diagram
TEA19031AT
Product data sheet
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TEA19031AT
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USB-PD controller for SMPS
7
Pinning information
7.1 Pinning
VCC
1
10 SW
OPTO
2
9
GND
NTC
3
8
DISCH
ISNS
4
7
CC1
VSNS
5
6
CC2
IC
aaa-018957
Figure 2. TEA19031AT pinning diagram (SOT1437-1)
7.2 Pin description
Table 3. Pin description
TEA19031AT
Product data sheet
Symbol
Pin
Description
VCC
1
supply voltage
OPTO
2
OPTO driver
NTC
3
external temperature measurement
ISNS
4
current sense input
VSNS
5
voltage sense input
CC2
6
type C CC2 line detection and USB-PD communication
CC1
7
type C CC1 line detection and USB-PD communication
DISCH
8
fast discharge sink
GND
9
ground
SW
10
NMOS gate drive output
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TEA19031AT
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USB-PD controller for SMPS
8
Functional description
The TEA19031AT can be considered as a versatile replacement for the well-known
TL431 shunt regulator series, where:
• The VSNS pin takes the role of the REF input of the TL431
• The OPTO pin the role of the cathode
• The GND pin the role of the anode
In addition to the Constant Voltage (CV) mode, which is regulated via the VSNS pin, the
system supports Constant Current (CC) mode. The current control loop is regulated and
the cable compensation is added via the ISNS pin.
Alternatively, the ISNS input can be used for OverCurrent Protection (OCP). Several
other protections are available. For guaranteed safety, all protections are implemented in
hardware. So, even when the microcontroller stops, the protections are still functional.
The output voltage and the output current can be controlled via USB-PD using the CC
pins.
The output current and the output voltage are continuously measured via an integrated
AD-converter. The values can be requested via the USB-PD protocol. The applied time
constant of the digital filter is initialized via the firmware. A dedicated signal that indicates
a stable output voltage/output current for a reliable measurement is available. It can
be used, for example, to determine and monitor the resistance of the cable connected
between the charger and the portable device.
The external temperature, measured via the NTC pin is continuously monitored. From
the NTC voltage and applied current, the controller calculates the corresponding
temperature. This temperature is communicated to the portable device. For some
variants, an OTP function is also added to this external temperature measurement.
The available protections, in combination with the NMOS load switch, ensure a fully safe
operation with only one optocoupler required. When the optocoupler fails, the primary
OVP ensures a safe application, as its level can be set at a fixed percentage above
the maximum regulated output voltage. All essential protections are implemented in
hardware. They are independent from the processor actions.
The TEA19031AT fully supports the type-C connector standard.
When a Type C receptacle is used, the CC1/CC2 pair is used for plug attach/detach
detection. After a detection, communication takes place via the same CC pins according
to the USB-PD communication standard.
The USB-PD specification requires the use of a load switch and certain discharge
behavior of the output voltage at the connector Vbus. So, to drive the gate of an external
NMOS switch, the TEA19031AT is equipped with an SW pin. To be able to discharge
Vbus using an external resistor in series with an internal switch, the TEA19031AT is also
equipped with a DISCH pin.
TEA19031AT
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TEA19031AT
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USB-PD controller for SMPS
8.1 Start-up and supply
The TEA19031AT is supplied via the VCC pin connected to the secondary DC voltage of
an AC-to-DC SMPS converter (see Figure 6). To control the primary side controller, this
VCC voltage is regulated via an integrated voltage/current control loop with external loop
compensation and an external optocoupler. This optocoupler is part of the gain loop of
the primary side SMPS controller.
At each start-up and after power-on reset, the optocoupler current is initially zero. So, the
AC-to-DC converter starts up with full output power, resulting in a rapid increase of the
VCC voltage. Due to the low VCC(start) level (≈3 V), the TEA19031AT ensures that it is
fully operating before the VCC reaches the default initial regulation levels. These default
values of the initial regulation levels are programmed in the non-volatile memory (MTP)
are 5 V and 3 A, respectively.
At power-on reset, the safe default values, which are read from MTP, are set.
When the VCC voltage is below the UVLO level, the external NMOS load switch is off.
When the output is shorted while the load switch is closed, the UVLO is also triggered.
The load switch is then immediately opened and the system restarts after the safe restart
timer.
When the VCC exceeds the UVLO level, all circuits, the initial DAC value, and the
resistive divider ratio are initialized. The system regulates the output to 5 V with a limited
output current of 3 A.
To minimize the output voltage overshoot after start-up, an internal 20 mA current sink
is applied to VCC when the VCC voltage exceeds Vo(default) × 1.05. The sink current
remains active until the VCC voltage has dropped to below Vo(default) × 1.05 again.
After the output voltage has stabilized, the load switch is turned on and the system waits
for an attach. As long as no load is attached, the VCC supply current is reduced by
disabling some internal circuitry. In this way, the no-load input power is minimized.
When the voltage on only one of the CC pins drops to below the VIH(Rd) level, an attach is
detected.
If an attach is detected, all internal circuitries are enabled. The voltages can be changed
via the USB-PD protocol.
1.05 x Vo(default)
UVLO
20 mA
discharge VCC
5 V regulation
initialization
aaa-023848
Figure 3. Start-up sequence
The TEA19031AT can continuously operate on supply voltages up to 21 V. The OVP
level is set to default 120 % or 125 % of the programmed output voltage. The UVP level
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USB-PD controller for SMPS
is continuously set to default 60 % of the programmed output voltage. The voltage on the
VCC pin is used to detect an OVP and UVP.
If the supply voltage drops to below the UVLO level, the system returns to the no-supply
state and opens the load switch.
8.2 Voltage loop
The analog Constant Voltage (CV) loop regulates VCC such that the voltage on
the VSNS pin equals the internal reference voltage. For the TEA19031AET and
TEA19031AFT (maximum output 20 V), with the external resistor divider from the VCC
pin to the VSNS pin at 1/8.325, the output is 8.325 times the voltage on the VSNS pin.
Any deviation from this external resistor value results in a different gain value and so
a different output voltage. The CV loop is regulated by varying the current drawn into
the OPTO pin, so it is compatible with the optocoupler feedback used in most AC-toDC converters. An external series RC combination between the OPTO and VSNS pins
defines the dynamic behavior of the integrating part. An external resistor in series with
the optocoupler defines the dynamic behavior of the proportional part of the regulation
loop (see Section 13.3). For the TEA19031AGT and TEA19031AQTapplications up to
13 V, the gain is set to 5.476. So these applications require an external resistor divider of
1/5.476. The resistor divider layout must be close to the TEA19031AT (see Section 13.1
for details).
The TEA19031AT incorporates several protections. All these protections operate in
safe restart mode. The load switch is opened immediately. When the fault condition
disappears after a certain delay and VCC is at the default value again, the load switch is
closed. For more information on the protections (see Section 8.11).
When a new voltage is requested via the USB-PD communication protocol, the internal
reference voltage is updated to this new setting within 20 μs. The control loop via the
optocoupler generates the requested output voltage following the speed of the SMPS
system. If there is a transition down, a predefined ramp down sequence is followed to
prevent that a high undershoot occurs. The ramp down is done via a parabolic slope
control. For a transition up, no special measures are required to prevent an overshoot
when a protection is triggered. The reason is that the charging current of the loop
capacitor lifts the voltage on the VSNS pin when the VCC voltage in the application
increases.
The parabolic discharge curve (see Figure 4; patent pending) initially causes the voltage
loop to saturate, due to the initial rapid ramp down. However, it allows the loop to recover
and to resume regulation toward the end of the curve. The total parabolic sequence time
is chosen such that no undershoot under the final end value occurs.
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TEA19031AT
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USB-PD controller for SMPS
VCC
OPTO
aaa-021703
a. Circuit
VCC
Vopto
loop reference
parabola depth
loop saturated
f(parabola factor)
discharge
aaa-021705
b. Curve
Figure 4. Parabolic transition down (no-load)
8.3 Current loop
The voltage drop across a small external series resistor between the output return
terminal and the converter ground is supplied to the ISNS pin and is a measure for the
output current. Internally, an amplifier boosts up the voltage at the ISNS pin by a gain
factor 50. The boosted voltage is then converted to a current with an internal resistance
gain value. For the TEA19031AET, the TEA19031AFT, the TEA19031AMT, and the
TEA19031AOT to comply with this internal resistance gain, the external resistor must be
exactly 10 mΩ (see Section 15). For the TEA19031AGT and the TEA19031AQT, it must
be 5 mΩ (see Section 15).
Any deviation from the MTP value, e.g. due to PCB-layout imperfections, causes a
current error and must be corrected (see Section 13.2).
The external resistor value and internal multiplication factor must be such that the output
of the amplifier is limited to 2.5 V. If, for example, the maximum output current is 5 A, an
external resistor of below 10 mΩ (e.g. 5 mΩ) must be used for a multiplication factor of
50.
For SMPS voltage and current stability reasons, an external series RC combination must
be connected between the OPTO pin and the ISNS pin (see Section 13.4).
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USB-PD controller for SMPS
8.4 Cable compensation
The cable compensation is proportional with the Rsense and the resistive divider. The
maximum cable compensation for a 1 A current can be calculated with the following
equation: Rsense * 8 / Rdiv.
When Rsense is 10 mΩ and the resistive divider is 1/8.325, the maximum cable
compensation is 666 mV/A. MTP sets the default cable compensation and can be read in
Section 15. Setting the cable compensation above 200 mV/A is not recommendable.
8.5 Load switch
The load can be disconnected from the adapter output voltage via an external low-cost
NMOS transistor (see Figure 6). The load switch is connected between VCC and Vbus.
To control the NMOS, the TEA19031AT has a dedicated switch drive output (SW pin).
This output is supplied with an output voltage of 6 V above VCC via an internal charge
pump.
As long as VCC is below the UVLO level or if the VCC connection is open, the SW pin is
held low, ensuring that the load switch is off. To ensure that the NMOS is also kept off
when the SW pin is disconnected, an external (high-ohmic) resistor is required between
the gate of the NMOS and Vbus.
To overcome the influence of the back-gate diode, it is also possible to apply two NMOS
switches in series, with their sources connected together.
8.6 Discharge function
The DISCH pin, which has an internal low-ohmic switch, provides the means to discharge
the output Vbus quickly. An external resistor in series limits the maximum current and the
IC dissipation.
To check if the output voltage has dropped to below 0.8 V, a second comparator is
implemented. This voltage drop is a requirement of the USB-PD specification (vSafe0V) if
there is a hard reset.
When the internal DISCH switch is activated, the voltage at the DISCH pin is always low,
because of the external current limiting resistor. A mechanism has been implemented
to check the real output voltage. During a hard reset discharge sequence, when VCC
is below vSafe5V, the switch is opened every millisecond for 20 μs to check the output
voltage at the end of the 20 μs period. The check of the output voltage is done until the
voltage remains below 0.7 V and the hard reset discharge sequence is terminated. For
this check to work properly, the capacitance on the DISCH pin and the external current
limiting resistor must have a time constant that is short enough.
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USB-PD controller for SMPS
To ensure that the output remains low, a 1 mA sink current is present on the DISCH pin
when both the load switch and discharge switch are off. The period that the DISCH pin
is active in unattached state is typically 100 ms by default. The reason for this limitation
is to prevent that excessive power dissipation occurs when an external Vbus voltage is
applied.
8.7 Detach detection
If the type C cable is disconnected, the output voltage of the TEA19031AT application
returns to its default value (5 V) after 200 μs.
8.8 Internal temperature measurement
The internal die temperature is continuously monitored. The temperature readout is used
to make an overtemperature protection (see Table 4).
8.9 External temperature measurement
The TEA19031AT includes a dedicated NTC pin. The NTC pin can be used to, e.g.,
measure the adapter temperature or the cable connector temperature. The temperature
value is continuously available to be sent to the portable device using one of the
protocols (e.g. via VDMs in the USB-PD protocol).
For accurate temperature measurement over the complete temperature range,
the external NTC is supplied via an adaptive and trimmed internal current source
(see Figure 5).
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TEA19031AT
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USB-PD controller for SMPS
I1 = 15 µA
I2 = 60 µA
I3 = 240 µA
disable
MTP
OTP level
DIGITAL
CONTROL
FIRMWARE
ADC
NTC
CC1
CC2
USB-PD
aaa-023850
a. Circuit
VNTC
3
I1 = 15 µA
I2 = 60 µA
I3 = 240 µA
2.5
2
1.5
1
0.5
0.4
0
-50
0
50
100
Temperature
150
aaa-022812
b. Curves
Figure 5. External NTC is supplied via adaptive current sources
The voltage at the NTC pin is measured via an internal A-to-D converter. If the voltage
on the NTC pin drops to below 400 mV, the source current of the pin is increased. If the
voltage on this pin exceeds 2.4 V, the source current of the pin is decreased. In this way,
the temperatures are measured with a better than 5 °C accuracy for a range of 0 °C to
> 120 °C when using a typical external resistor.
Optionally, an OTP function can be added to these pins. The OTP level can be initialized
via the MTP and handled by the hardware, which ensures a proper OTP function that
is independent of the firmware. Depending on the type, the OTP is enabled or disabled
(see Section 15).
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USB-PD controller for SMPS
8.10 Communication
The TEA19031AT hardware supports using the CC wire in a USB Type-C cable.
The USB Type-C connectors and cables support all protocols. If a type C receptacle is
used, Vbus is only connected to the converter output via the load switch when an attach is
detected on one of the CC pins.
8.10.1 USB Type-C
The TEA19031AT adheres to the USB Type-C 1.2 specification (see Ref. 2) in the sense
that the distinct pull-up current values support attach/detach and current capability
advertising. The attach/detach detection is done in the hardware. So, if there is a detach,
a return of Vbus to vSafe5V is always ensured. The hardware implementation of the
return of Vbus to vSafe5V eliminates the risk of software implementations where Vbus may
stay at an unsafe level if the program execution stalls.
8.10.2 USB-PD
The TEA19031AT supports the USB-PD 2.0 specification (certified: 2017-03-22; test ID:
100054).
Maximum seven different Power Data Objects (PDO) can be defined in nonvolatile memory. By default, limited PDOs are supported with different current levels
(see Section 15). All PDO currents are protected with an OCP.
8.10.3 Discover identification
The TEA19031AT supports the discover identification protocol in USB-PD. It is possible
to program different VID, PID, and BCD values in dedicated memory addresses with an
NXP tool, using VDMs.
8.10.4 MTP configuration
The TEA19031AT is configurable via MTP. The different types are defined in Section 15.
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USB-PD controller for SMPS
8.11 Protections
All protections, except UVP and the external OTP, are implemented completely in the
hardware. Table 4 gives an overview of the available protections.
8.11.1 Protections overview
Table 4. Overview of protections
Protection
Description
Implementation
Default
value
Filter
UVLO
undervoltage lockout
hardware
2.8 V (fixed)
-
OVP
overvoltage protection
hardware
120 % or 125 % × PDO 30 μs
OCP
overcurrent protection
hardware
120 % × PDO
25 ms
OTP (internal) overtemperature
protection
hardware
115 °C
-
OTP external
overtemperature
protection
software
90 °C
[1]
-
UVP
undervoltage protection
software
60 % × PDO
-
OSUP
open-supply (VCC)
protection
hardware
-
-
hardware
-
10 μs analog
OV_CC1_CC2 overvoltage protection
CC1 and CC2 pins
[1]
The NTC readout and OTP levels are defined with an NTC of 47 kΩ and a B-constant of 4108. It means that the OTP
triggers with an impedance of about 4 kΩ. Adding an extra resistor of 1.8 kΩ in series with this NTC increases the OTP by
20 °C to 110 °C. The temperature readout is not accurate anymore. Also, an NTC of 100 kΩ gives the same 20 °C offset.
It also results in an OTP level of approximately 110 °C.
8.11.2 Secondary side safe restart protection
When a safe restart protection is triggered, the load switch is immediately turned off.
The voltage loop is regulated to the initial value (5 V typical). As the load switch is
immediately turned off before the regulation reduces the output power, the VCC voltage
may increase. To ensure that the VCC voltage has dropped to a safe value, before the
load switch is turned on again, VCC is discharged via an internal current source of 20 mA
if it exceeds the level of Vo(default) × 1.05.
When the protection is triggered, the safe restart timer is started. After 1 s, a restart
sequence is performed, which reinitializes all circuits.
8.11.3 UnderVoltage LockOut (UVLO)
The level at which the UVLO protection is triggered is fixed. When VCC drops to below
the UVLO level, the load switch is immediately turned off. All settings are reset to their
initial values. Internal circuitries are disabled.
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8.11.4 OverVoltage Protection (OVP)
When the level is higher than the default voltage (normally 5 V, but can be adjusted via
MTP), the OVP level is set as a percentage (120 % or 125 %) of the requested output
voltage level. When VCC continuously exceeds this level for longer than the minimum
OVP time (default 30 μs), the OVP protection is triggered.
8.11.5 OverCurrent Protection (OCP)
The default TEA19031AT setting is CC mode where the current loop defines maximum
current. However, for higher output power types (e.g. for computer applications), the
OCP mode is set. If the output current is continuously higher than the chosen current
level for more than the OCP blanking time, OCP is triggered.
8.11.6 Internal OTP
When the internally measured temperature exceeds the OTP setting, OTP is triggered.
The value is 115 °C.
8.11.7 External OTP
When the externally measured temperature exceeds the programmed OTP settings, OTP
is triggered. Section 15 gives the programmed temperatures for the different types.
8.11.8 NTC pin
The NTC function can be used to measure external temperature. The temperature can
be read via VDMs. The NTC readout is only valid with a 47 kΩ NTC resistor and a Bconstant of 4108 or a similar NTC.
8.11.9 Open-SUpply Protection (OSUP)
When the supply is not available anymore, the voltage on the OPTO pin is used to turn
off the external NMOS load switch actively.
The supply ensures the functioning of the TEA19031AT. Because of this protection, the
load can never be damaged if the supply is not available anymore.
8.11.10 UnderVoltage Protection (UVP)
The UVP level is set as a percentage requested output voltage level (60 %). The reaction
to a triggering of UVP is programmed in the firmware. The protection is a safe restart
protection. The level can never be lower than the UVLO level.
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USB-PD controller for SMPS
8.11.11 Output Short Protection (OSP)
At a shorted output, the VCC voltage drops to below the UVLO level. The load switch is
turned off. After the programmed safe restart time, the output is enabled again. When the
VCC voltage exceeds the UVLO level, the primary controller initially limits the maximum
output power.
Because the safe restart time is set to 1 s, the dissipation is limited to < 50 mW. This
limitation prevents that the application heats up when the output is shorted.
8.11.12 OVP CC1 and CC2 pins (OV_CC1_CC2)
When the CC1 or CC2 pin is shorted to Vbus, OVC_CC is triggered. OVC_CC is a safe
restart protection. When output voltage is present, this protection is active. When the
voltage at the pin exceeds 4.5 V, the protection is triggered. This OVP_CC has some
detection filtering. It only switches on after 150 μs (typical).
8.11.13 Soft-short protection CC pins
The CC pins are also protected with a soft-short protection. The impedance levels on the
CC lines are checked. If they are not in alignment with the USB-PB protocol, the output is
protected.
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9
Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Voltages
VVCC
voltage on pin VCC
−0.5
+26
V
VOPTO
voltage on pin OPTO
−0.5
+26
V
VCC1
voltage on pin CC1
−0.5
+26
V
VCC2
voltage on pin CC2
−0.5
+26
V
VSW
voltage on pin SW
−0.5
VCC + 9
V
VDISCH
voltage on pin DISCH
−0.5
+26
V
VVSNS
voltage on pin VSNS
−0.5
+3.6
V
VISNS
voltage on pin ISNS
−0.5
+3.6
V
VNTC
voltage on NTC pin
−0.5
+3.6
V
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−40
+150
°C
Human Body Model
(HBM)
−2000
+2000
V
Charged Device Model
(CDM)
−500
+500
V
Machine Model (MM)
−200
+200
V
General
ElectroStatic Discharge (ESD)
VESD
TEA19031AT
Product data sheet
electrostatic discharge
voltage
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USB-PD controller for SMPS
10 Recommended operating conditions
Table 6. Recommended operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
Voltages
VVCC
voltage on pin VCC
0
21
V
VOPTO
voltage on pin OPTO
0
21
V
VCC1
voltage on pin CC1
0
5
V
VCC2
voltage on pin CC2
0
5
V
VSW
voltage on pin SW
0
VCC + 6
V
VDISCH
voltage on pin DISCH
0
21
V
VVSNS
voltage on pin VSNS
0
3.3
V
VISNS
voltage on pin ISNS
0
3.3
V
VNTC
voltage on pin NTC
0
3.3
V
junction temperature
−25
+125
°C
General
Tj
11 Thermal characteristics
Table 7. Thermal characteristics
TEA19031AT
Product data sheet
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from
junction to ambient
JEDEC test board
115
K/W
Rth(j-c)
thermal resistance from
junction to case
JEDEC test board
44
K/W
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USB-PD controller for SMPS
12 Characteristics
Table 8. Characteristics
Tamb = 25 °C; VCC = 5.0 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply (VCC pin)
Vth(UVLO)
undervoltage lockout
threshold
falling
-
-
2.9
V
ICC
current on VCC pin
unattached; VCC = 5 V
-
1.8
-
mA
nominal; VCC = 5 V
-
4.25
-
mA
discharge supply current discharge current of
VCC during safe restart
protection; depends on
load conditions
-
20
-
mA
extra discharge current;
VCC = Vo(default)
-
20
-
mA
-
1.05 × Vo(default)
-
V
ICC(dch)
Vos
overshoot voltage
CC1/CC2 section (CC1 and CC2 pins)
Type C
Ipu
VIH
VIL
Vovp
pull-up current
current source for DFP pull-up indication
default current
−64
−80
−96
μA
1.5 A mode
−166
−180
−194
μA
3 A mode
−304
−330
−356
μA
HIGH-level input voltage with standard 5.1 kΩ pull-down resistance
LOW-level input voltage
overvoltage protection
voltage
default current
1.5
1.6
1.7
V
1.5 A mode
1.5
1.6
1.7
V
3 A mode
2.45
2.60
2.75
V
with standard 5.1 kΩ pull-down resistance
default current
0.15
0.2
0.25
V
1.5 A mode
0.35
0.40
0.45
V
3 A mode
0.75
0.80
0.85
V
CC1 and CC2 pins
-
4.5
-
V
BMC bit rate
270
300
330
Kbps
300
-
650
ns
USB-PD normative specification
fbit
bit rate
USB-PD transmitter normative specification
tfall
fall time
TEA19031AT
Product data sheet
10 % and 90 %
amplitude points;
minimum is underloaded
condition
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Symbol
Parameter
Conditions
Min
Typ
Max
Unit
trise
rise time
10 % and 90 %
amplitude points;
minimum is underloaded
condition
300
-
650
ns
Vo
output voltage
signal voltage swing
1.05
1.125
1.2
V
-
45
-
Ω
Zo
output impedance
transmitter
[1]
USB-PD receiver normative specification
Cin
input capacitance
receiver
-
250
-
pF
tfltr(lim)
time constant limiting
filter
receiver bandwidth
100
-
-
ns
zi
input impedance
receiver
10
-
-
MΩ
Vi
input voltage
receiver comparator
low level
-
0.55
-
V
high level
-
0.8
-
V
hysteresis
-
250
-
mV
Voltage control (VSNS pin)
Vref
reference voltage
input voltage range on
the VSNS pin to control
the voltage loop
0.3
-
2.4
V
Vacc
voltage accuracy
voltage loop;
Vsnsref = 2 V
−2
-
+2
%
measurement voltage
accuracy
−2
-
+2
%
gm
transconductance
VCC in; OPTO out
4
-
-
mA/mV
g(max)
maximum gain
cable compensation
at maximum
-
8
-
mV/mV
6
-
40
mV
−100
-
+100
mA
−2
-
+2
%
Current control (ISNS pin)
Iref
reference current
parameter is
programmed in MTP 10
bits
Iout
output current
current loop accuracy; Rsense = 5 mΩ
0.5 A < Iout < 5 A
Iout = 5 A
[2]
measurement current accuracy; Rsense = 5 mΩ
gm
transconductance
TEA19031AT
Product data sheet
Iout < 5 A
−100
-
+100
mA
Iout > 5 A
−3
-
+3
%
200
-
gain current;
amplifier = 50
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USB-PD controller for SMPS
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IO(NTC)
output current on pin
NTC
high temperatures
−228
−240
−252
μA
Tacc
temperature accuracy
NTC temperature
−5
-
+5
°C
Tres
temperature resolution
temperature
measurement
−1
-
+1
°C
Vovp
overvoltage protection
voltage
overvoltage is
programmed in MTP.
3
-
25
V
Vovp(acc)
overvoltage protection
voltage accuracy
Vovp = 6 V
−3
-
+3
%
Vocp(acc)
overcurrent protection
voltage accuracy
voltage at ISENSE input
pin
−3
-
+3
%
Vuvp(acc)
undervoltage protection
voltage accuracy
−3
-
+3
%
ICC(dch)
discharge supply current during safe restart
protection
-
20
-
mA
switch-on
-
80
-
kΩ
switch-off
-
600
-
Ω
hard reset
0.65
0.70
0.75
V
-
3
-
Ω
-
100
-
ms
NTC pin
[3]
Protections
SW driver
RO
output resistance
DISCH part (DISCH pin)
Vdet(rst)
reset detection voltage
Rdch
discharge resistance
tact
active time
maximum on-time during
attach state
OPTO pin
IO(min)
minimum output current
-
30
-
μA
IO(max)
maximum output current
3.75
5
6.25
mA
-
10
-
MHz
105
115
125
°C
Internal oscillator
fosc(int)
internal oscillator
frequency
Internal temperature protection
Totp
[1]
[2]
[3]
overtemperature
protection trip
switch-on
In the application, an additional resistor can be added to fulfill the USP-PD specification
The current sense pin can be used accurately from 6 mV up to 40 mV. The result is a current range that depends on the Rsense resistor. (e.g. with 10 mΩ,
the range is between 600 mA and 4 A). If the input voltage is below 3 mV, the readout current reports a fixed current of 50 mA.
See Figure 5.
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13 Application information
XV
R2
DRAIN
HVSRC
DRIVER
HVGATE
ISENSE
CTRL
TEA193x
S1
GATE
TEA199x
CAP
R3
SOURCE
AUX
GND
VCCH
PROTECT
VCCL
GND
R1
GND
TEA19031T
VCC
R4
VSNS
C1
OPTO
CC1
R7
R6
CC2
optional
C2
NTC
ISNS
R5
SW
DISCH
aaa-018975
Figure 6. Typical application diagram, including TEA193x TEA199x (low-side SR), and TEA19031AT
13.1 Resistor divider
The resistor divider (R3 / (R2 + R3) connected from the VCC pin to the VSNS pin
must reduce the output voltage to < 2.5 V for the maximum output voltage. For 20 V
applications, a divider ratio of 1/8.325 is chosen. For applications with a maximum output
voltage that does not exceed 12 V, a ratio of 1/5.476 gives the best performance. The
reference of the ground of this resistor divider must be connected as close as possible to
the GND pin of the TEA19031AT. High-load currents in this ground connection must be
prevented.
13.2 Sense resistor
The accuracy of the sense resistor R1 is very important. Any deviation from the value in
MTP gives an offset in the current measurement. Because the sense resistor is very lowohmic, the layout of the connections in the PCB can give major deviations from its initial
value.
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TEA19031AT
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To overcome this, several options are available:
• Change the MTP-resistor value so that it is in line with the typical resistor value of the
sense resistor including the PCB tracks.
• Change the sense resistor value so that the complete value is matching the typical
MTP value (10 mΩ).
• Choose the sense resistor value slightly higher (e.g. +15 % than the default MTP
value. Trim the value with a resistor divider so that the (R7 / (R5 + R7)) × (R1 +
RPCB) matches the MTP default value. RPCB is the resistance of copper wires and the
resistance change of the sense resistor due to its soldering profile.
To prevent temperature changes in the current sense measurements, the sense resistor
must have a zero temperature coefficient. Also, to ensure accuracy and temperature
stability, keep the PCB resistance as low as possible. To prevent magnetic coupling to
these parts, which results in pollution in output currents, the length and the area of the
connection must be kept as small as possible.
13.3 Voltage loop
An integrator network is connected between the VSNS pin and the optocoupler in the
application diagram. The recommended values of these components are:
• R2 = 160 kΩ to 180 kΩ
• R4 = 1 kΩ
• C1 = 10 nF; for the integral part
To prevent magnetic coupling to these parts, which results in pollution in output voltage,
the length and the area of the connection must be kept as small as possible.
13.4 Current loop
For Applications that use the CC loop, an integrator network is connected between the
ISNS pin and the optocoupler in an application. The recommended values of these
components are:
• R5 = 330 Ω when Rsense = 10 mΩ; R5 = 160 Ω when Rsense = 5 mΩ
• R6 = 5 kΩ
• C2 = 100 nF; for the integral part
To prevent magnetic coupling to these parts, which results in pollution in output currents,
the length and the area of the connection must be kept as small as possible.
For applications that only use the OCP mode, these three components can be omitted.
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TEA19031AT
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USB-PD controller for SMPS
14 Package outline
SO10: plastic small outline package; 10 leads; body width 3.9 mm; body thickness 1.35 mm
D
SOT1437-1
E
A
c
y
X
HE
v
A
Z
10
6
Q
A2
A
A1
A3
pin 1 index
1
θ
5
e
bp
(10x)
(8x)
Lp
L
w
detail X
0
5 mm
scale
Dimensions
Unit
mm
A
A1
A2
A3
bp
c
max 1.75 0.25 1.45
0.49 0.25
nom
0.18 1.35 0.25 0.43 0.22
min
0.10 1.25
0.36 0.19
D(1)
E(1)
6.3
6.2
6.1
4.0
3.9
3.8
e
HE
L
Lp
Q
v
w
6.20
1.00 0.70
1.27 6.00 1.05 0.70 0.65 0.25 0.25
5.80
0.40 0.60
y
Z
θ
0.1
0.70
0.56
0.30
8°
4°
0°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
sot1437-1_po
European
projection
Issue date
15-02-09
15-03-06
SOT1437-1
Figure 7. Package outline SOT108-1 (SO10)
TEA19031AT
Product data sheet
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USB-PD controller for SMPS
15 Appendix: Internal parameters setting per type
In this section, the internal parameter settings per type are given.
15.1 TEA19031AET
Table 9 gives an overview of the function settings in the TEA19031AET.
Table 9. Internal parameter settings
Function
TEA19031AET
power rating
45 W
default output voltage
5V
default maximum output current
3A
NTC function
[1]
NTC
OVP level
NTC-OVP protection level
120 %
[1]
-
external sense resistor
10 mΩ
external resistor divider VCC/VSNS
8.325
cable compensation
67 mV/A
PDO1
voltage
5V
current
3A
PDO2
voltage
9V
current
3A
PDO3
voltage
12 V
current
3A
PDO4
voltage
15 V
current
3A
PDO5
voltage
20 V
current
2.26 A
PDO6
voltage
off
current
off
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Function
TEA19031AET
PDO7
voltage
off
current
off
CC mode or OCP mode
[1]
OCP mode
The NTC readout and OTP levels are defined with an NTC of 47 kΩ and a B-constant of 4050. It means that the OTP triggers with an impedance of about
4 kΩ. Adding an extra resistor of 1.8 kΩ in series with this NTC increases the OTP by 20 °C to 110 °C. Note that the temperature readout is not accurate
anymore. Also, an NTC of 100 kΩ gives the same 20 °C offset. It also results in an OTP level of approximately 110 °C.
15.2 TEA19031AFT
Table 10 gives an overview of the function settings in the TEA19031AFT.
Table 10. Internal parameter settings
Function
TEA19031AFT
power rating
60 W
default output voltage
5V
default maximum output current
3A
NTC function
[1]
NTC
OVP level
NTC-OVP protection level
120 %
[1]
-
external sense resistor
10 mΩ
external resistor divider VCC/VSNS
8.325
cable compensation
67 mV/A
PDO1
voltage
5V
current
3A
PDO2
voltage
9V
current
3A
PDO3
voltage
12 V
current
3A
PDO4
voltage
15 V
current
3A
PDO5
voltage
20 V
current
3A
TEA19031AT
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USB-PD controller for SMPS
Function
TEA19031AFT
PDO6
voltage
off
current
off
PDO7
voltage
off
current
off
CC mode or OCP mode
[1]
OCP mode
The NTC readout and OTP levels are defined with an NTC of 47 kΩ and a B-constant of 4050. It means that the OTP triggers with an impedance of about
4 kΩ. Adding an extra resistor of 1.8 kΩ in series with this NTC increases the OTP by 20 °C to 110 °C. Note that the temperature readout is not accurate
anymore. Also, an NTC of 100 kΩ gives the same 20 °C offset. It also results in an OTP level of approximately 110 °C.
15.3 TEA19031AGT
Table 11 gives an overview of the function settings in the TEA19031AGT.
Table 11. Internal parameter settings
Function
TEA19031AGT
power rating
18 W
default output voltage
5V
default maximum output current
3A
NTC function
[1]
NTC with OTP
OVP level
NTC-OVP protection level
120 %
[1]
90 °C
external sense resistor
5 mΩ
external resistor divider VCC/VSNS
5.476
cable compensation
117 mV/A
[2]
PDO1
voltage
5V
current
3A
PDO2
voltage
6V
current
2.9 A
PDO3
voltage
7V
current
2.5 A
PDO4
voltage
8V
current
2.2 A
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USB-PD controller for SMPS
Function
TEA19031AGT
PDO5
voltage
9V
current
2A
PDO6
voltage
off
current
off
PDO7
voltage
off
current
off
CC mode or OCP mode
[1]
[2]
CC mode
The NTC readout and OTP levels are defined with an NTC of 47 kΩ and a B-constant of 4050. It means that the OTP triggers with an impedance of about
4 kΩ. Adding an extra resistor of 1.8 kΩ in series with this NTC increases the OTP by 20 °C to 110 °C. Note that the temperature readout is not accurate
anymore. Also, an NTC of 100 kΩ gives the same 20 °C offset. It also results in an OTP level of approximately 110 °C.
Maximum output voltage for 5.476 is 13 V.
15.4 TEA19031AMT
Table 12 gives an overview of the function settings in the TEA19031AMT.
Table 12. Internal parameter settings
Function
TEA19031AMT
power rating
30 W
default output voltage
5V
default maximum output current
3A
[1]
NTC pin function
disabled
OVP level
NTC-OVP protection level
125 %
[1]
-
external sense resistor
10 mΩ
external resistor divider VCC/VSNS
8.325
cable compensation
67 mV/A
PDO1
voltage
5V
current
3A
PDO2
voltage
9V
current
3A
PDO3
voltage
12 V
current
2.49 A
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USB-PD controller for SMPS
Function
TEA19031AMT
PDO4
voltage
15 V
current
2A
PDO5
voltage
off
current
off
PDO6
voltage
off
current
off
PDO7
voltage
off
current
off
CC mode or OCP mode
[1]
CC mode
The NTC readout and OTP levels are defined with an NTC of 47 kΩ and a B-constant of 4050. It means that the OTP triggers with an impedance of about
4 kΩ. Adding an extra resistor of 1.8 kΩ in series with this NTC increases the OTP by 20 °C to 110 °C. Note that the temperature readout is not accurate
anymore. Also, an NTC of 100 kΩ gives the same 20 °C offset. It also results in an OTP level of approximately 110 °C.
15.5 TEA19031AOT
Table 13 gives an overview of the function settings in the TEA19031AOT.
Table 13. Internal parameter settings
Function
TEA19031AOT
power rating
65 W
default output voltage
5V
default maximum output current
3A
[1]
NTC pin function
disabled
OVP level
NTC-OVP protection level
120 %
[1]
-
external sense resistor
10 mΩ
external resistor divider VCC/VSNS
8.325
cable compensation
67 mV/A
PDO1
voltage
5V
current
3A
PDO2
voltage
9V
current
3A
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USB-PD controller for SMPS
Function
TEA19031AOT
PDO3
voltage
15 V
current
3A
PDO4
voltage
20 V
current
3.25 A
PDO5
voltage
off
current
off
PDO6
voltage
off
current
off
PDO7
voltage
off
current
off
CC mode or OCP mode
[1]
OCP mode
The NTC readout and OTP levels are defined with an NTC of 47 kΩ and a B-constant of 4050. It means that the OTP triggers with an impedance of about
4 kΩ. Adding an extra resistor of 1.8 kΩ in series with this NTC increases the OTP by 20 °C to 110 °C. Note that the temperature readout is not accurate
anymore. Also, an NTC of 100 kΩ gives the same 20 °C offset. It also results in an OTP level of approximately 110 °C.
15.6 TEA19031AQT
Table 14 gives an overview of the function settings in the TEA19031AQT.
Table 14. Internal parameter settings
Function
TEA19031AQT
power rating
27 W
default output voltage
5V
default maximum output current
3A
NTC function
[1]
NTC with OTP
OVP level
NTC-OVP protection level
120 %
[1]
90 °C
external sense resistor
5 mΩ
external resistor divider VCC/VSNS
5.476
cable compensation
117 mV/A
[2]
PDO1
voltage
5V
current
3A
TEA19031AT
Product data sheet
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TEA19031AT
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USB-PD controller for SMPS
Function
TEA19031AQT
PDO2
voltage
6V
current
3A
PDO3
voltage
7V
current
3A
PDO4
voltage
9V
current
3A
PDO5
voltage
off
current
off
PDO6
voltage
off
current
off
PDO7
voltage
off
current
off
CC mode or OCP mode
[1]
[2]
CC mode
The NTC readout and OTP levels are defined with an NTC of 47 kΩ and a B-constant of 4050. It means that the OTP triggers with an impedance of about
4 kΩ. Adding an extra resistor of 1.8 kΩ in series with this NTC increases the OTP by 20 °C to 110 °C. Note that the temperature readout is not accurate
anymore. Also, an NTC of 100 kΩ gives the same 20 °C offset. It also results in an OTP level of approximately 110 °C.
Maximum output voltage for 5.476 is 13 V.
TEA19031AT
Product data sheet
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USB-PD controller for SMPS
16 Abbreviations
Table 15. Abbreviations
TEA19031AT
Product data sheet
Acronym
Description
AC
Alternating Current
BMC
Bi-phase Manchester Coding
BOM
Bill Of Materials
CC
Constant Current
CV
Constant Voltage
DAC
Digital-to-Analog Converter
DC
Direct Current
DCM
Discontinuous Conduction Mode
DFP
Downstream Facing Port
MTP
Multi-Time Programmable
NMOS
Negative channel Metal-Oxide Semiconductor
NTC
Negative Temperature Coefficient
OCP
OverCurrent Protection
OGP
Open-Ground Protection
OSP
Output Short Protection
OSUP
Open-SUpply Protection
OTP
OverTemperature Protection
OVP
OverVoltage Protection
PDO
Power Data Object
QR
Quasi-Resonant
RAM
Random-Access Memory
ROM
Read-Only Memory
SCL
Serial Clock Line
SDA
Serial Data Line
SMPS
Switched-Mode Power Supply
USB
Universal Serial Bus
USB-PD
USB Power Delivery
UVLO
UnderVoltage LockOut
UVP
UnderVoltage Protection
VDM
Vendor Defined Message
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USB-PD controller for SMPS
17 Glossary
Table 16. Glossary
Term
2
Description
I C
Inter-IC communication
vSafe0V
safe operating voltage at "zero volts" (0 V ≤ vSafe0V ≤ 0.8 V)
vSafe5V
safe operating voltage at 5 V (4.75 V ≤ vSafe5V ≤ 5.5 V)
18 References
1
USB Power Delivery Specification Rev. 2.0
Version 1.3
January 12, 2017
2
USB Type-C Cable and Connector
Specification Revision 1.2
March 25, 2016 and ECNs
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USB-PD controller for SMPS
19 Revision history
Table 17. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA19031AT v.2
20171201
Product data sheet
-
TEA19031AT v.1
Modifications:
• Variants TEA19031AQT and TEA19031AOT have been added.
TEA19031AT v.1
20170922
TEA19031AT
Product data sheet
Product data sheet
-
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-
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20 Legal information
20.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
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consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
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legal theory. Notwithstanding any damages that customer might incur for
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in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA19031AT
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
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Applications — Applications that are described herein for any of these
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no representation or warranty that such applications will be suitable
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are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
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Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
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or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
TEA19031AT
Product data sheet
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
20.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
All information provided in this document is subject to legal disclaimers.
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Contents
1
2
2.1
2.2
2.3
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.10.1
8.10.2
8.10.3
8.10.4
8.11
8.11.1
8.11.2
8.11.3
8.11.4
8.11.5
8.11.6
8.11.7
8.11.8
8.11.9
8.11.10
8.11.11
8.11.12
8.11.13
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
General description ............................................ 1
Features and benefits .........................................2
General .............................................................. 2
Protocol support ................................................ 2
Protections ......................................................... 2
Applications .........................................................2
Ordering information .......................................... 3
Marking .................................................................3
Block diagram ..................................................... 4
Pinning information ............................................ 5
Pinning ............................................................... 5
Pin description ................................................... 5
Functional description ........................................6
Start-up and supply ........................................... 7
Voltage loop .......................................................8
Current loop .......................................................9
Cable compensation ........................................ 10
Load switch ......................................................10
Discharge function ........................................... 10
Detach detection ..............................................11
Internal temperature measurement ..................11
External temperature measurement ................ 11
Communication ................................................ 13
USB Type-C .................................................... 13
USB-PD ........................................................... 13
Discover identification ......................................13
MTP configuration ............................................13
Protections ....................................................... 14
Protections overview ........................................14
Secondary side safe restart protection ............ 14
UnderVoltage LockOut (UVLO) ....................... 14
OverVoltage Protection (OVP) .........................15
OverCurrent Protection (OCP) .........................15
Internal OTP .................................................... 15
External OTP ................................................... 15
NTC pin ........................................................... 15
Open-SUpply Protection (OSUP) .................... 15
UnderVoltage Protection (UVP) .......................15
Output Short Protection (OSP) ........................ 16
OVP CC1 and CC2 pins (OV_CC1_CC2) ....... 16
Soft-short protection CC pins .......................... 16
Limiting values .................................................. 17
Recommended operating conditions .............. 18
Thermal characteristics ....................................18
Characteristics .................................................. 19
Application information .................................... 22
Resistor divider ................................................ 22
Sense resistor ..................................................22
Voltage loop .....................................................23
Current loop .....................................................23
Package outline .................................................24
Appendix: Internal parameters setting per
type ..................................................................... 25
15.1
15.2
15.3
15.4
15.5
15.6
16
17
18
19
20
TEA19031AET ................................................. 25
TEA19031AFT ................................................. 26
TEA19031AGT .................................................27
TEA19031AMT ................................................ 28
TEA19031AOT .................................................29
TEA19031AQT .................................................30
Abbreviations .................................................... 32
Glossary ............................................................. 33
References ......................................................... 33
Revision history ................................................ 34
Legal information .............................................. 35
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2017.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 December 2017
Document identifier: TEA19031AT
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