INDUSTRIAL GRADE
ATP Electronics, Inc.
DRAM & FLASH SOLUTIONS
2018
Product Catalog
ATP Electronics, Inc.
ATP Electronics, Inc.
Product Longevity & Stability
ATP TAIWAN (HQ)
ATP USA
ATP EUROPE
ATP JAPAN
ATP CHINA
TEL: +886-2-2659-6368
FAX: +886-2-2659-4982
sales-apac@atpinc.com
TEL: +1-408-732-5000
FAX: +1-408-732-5055
sales@atpinc.com
TEL: +49-89-374-9999-0
FAX: +49-89-374-9999-29
sales-europe@atpinc.com
TEL: +81-3-6890-8277
FAX: +81-3-6890-8301
sales-japan@atpinc.com
TEL: +86-21-5080-2220
FAX: +86-21-9687-0000-026
sales@cn.atpinc.com
© Copyright 2018 ATP Electronics, Inc. All rights reserved.
Specifications or details may change without notice.
All trademarks and registered trademarks are the property of their respective owners.
Testing Capabilities
Advanced Technologies
& Engineering Support
Targeted Product Portfolio
Engineered Specifically
for Your Mission-Critical Applications
www.atpinc.com
ATP Global Support Offices
ATP EUROPE
ATP USA
MUNICH, GERMANY
ATP JAPAN
ATP CHINA
SAN JOSE, CA, USA
SHANGHAI, CHINA
TOKYO, JAPAN
ATP HEADQUARTERS
TAIPEI, TAIWAN
ATP TAIWAN
ATP USA
ATP EUROPE
ATP JAPAN
ATP CHINA
TEL: +886-2-2659-6368
FAX: +886-2-2659-4982
sales-apac@atpinc.com
10F, No. 185, Tiding Blvd. Sec. 2,
Neihu, Taipei,
Taiwan 11493
TEL: +1-408-732-5000
FAX: +1-408-732-5055
sales@atpinc.com
2590 North First Street, Suite
#150 , San Jose, CA 95131,
USA
TEL: +49-89-374-9999-0
FAX: +49-89-374-9999-29
sales-europe@atpinc.com
Max-Planck-Str. 5,
D-85716 Unterschleißheim,
Germany
TEL: +81-3-6890-8277
FAX: +81-3-6890-8301
sales-japan@atpinc.com
16-1, Konan 2-chome, Minato-ku,
Tokyo 108-0075 Shinagawa East
One Tower 4F
Japan
TEL: +86-21-5080-2220
FAX: +86-21-9687-0000-026
sales@cn.atpinc.com
2F, Building 15, No. 115, Lane
572, Bibo Road, Zhangjiang
High-Tech Park Pudong,
Shanghai, China 201203
Headquarters
Table of Contents
ATP Global Support Offices..........................................
2
About ATP.............................................................................
3
Why ATP.................................................................................
4
Market Focus & Applications......................................
6
2018 Product Highlights
DRAM DDR4-2666
13
DRAM Unique Features......................................................... 14
DDR4-2666 Modules.............................................................. 15
Legacy (SDR/DDR) DRAM Modules................................... 16
ATP Testing Systems.............................................................. 17
Complete DRAM Product Line............................................. 18
Flash Solutions
Industrial Temperature NVMeTM SSDs
Extensive SATA III SSD Range............................................
DRAM Solutions
8
Flash Products Naming Rule...............................................
NVMe M.2 SSDs......................................................................
3D MLC Memory Cards........................................................
9
Configurable SSDs..................................................................
ATP Technologies..............................................................
10
Memory Card Solutions for Automotive Applications...
High-Performance SATA III SSDs.......................................
Memory Cards..........................................................................
Embedded Products...............................................................
Complete Flash Products......................................................
2
ATP Product Catalog 2018
19
20
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24
25
28
32
About ATP
About ATP
Why ATP
The ATP brand continues to grow through industrial OEM
sales channels with offices in the USA, Europe, and Asia
offering worldwide engineering and sales support.
ATP Technologies
2018
Product Highlights
The ATP Electronics name is synonymous with absolute
dedication to uncompromising product and service quality,
and this is why companies around the world entrust their
storage and memory needs to us. ATP products are designed
and built to meet the exacting demands of modern computing
and to accomplish mission-critical tasks even under the
toughest operating conditions.
Advanced packaging techniques like System-in-Package
(SiP), and unique technologies such as PowerProtector,
Secure Erase, and more, demonstrate our astute technical
capabilities. Testing and validation processes such as Test
During Burn-In and Automatic Test Equipment systems
showcase our exceptional manufacturing and testing
capabilities as well as our resolute commitment to deliver
best-in-class products.
Market Focus
& Applications
For over 25 years, we have been transforming the industrial
and enterprise computing landscape with our
high-performance and high-endurance NAND flash storage
products and DRAM memory modules. Acutely aware of
the rigors of data-hungry applications, we design, test and
manufacture products according to the most meticulous
standards.
Flash Solutions
DRAM Solutions
Product Range
Memory Cards
Embedded Modules
SSDs
DRAM Modules
ATP Product Catalog 2018
3
Why ATP
Core Competencies
With more than 25 years of solid experience in manufacturing industrial memory and storage solutions, ATP is a trusted name
among leading businesses worldwide. Automotive, Health Care, Telecom, IoT, Aerospace/Avionics, and various industries rely on
ATP to deliver reliable, durable and high-performance solutions for mission-critical applications.
Our Innovative Technology
Our Unwavering Assurance
Our High-Performance Products
We pride ourselves in being at the
forefront of the latest memory and
storage manufacturing technologies,
offering unique features and valueadded solutions that safeguard data
integrity, deliver reliable performance
and prolong usage to maximize your
investment. Our top-of-the-line
engineering support capabilities
enable us to meet your customization
requirements. We also offer OEM joint
validation programs. Consider our lab
your lab.
ATP’s strategic partnership with Micron
Technology, Inc. under the Product
Longevity Program (PLP) ensures
long-term bill of materials (BOM)
stability for DRAM and NAND flash
storage products. Proactive supply
chain disaster recovery planning
involves dual-sourcing strategy to
ensure supply stability. We implement
controlled BOM to guarantee long
product cycles with buffer inventory,
making sure that any changes affecting
the process or product, as well as
product end of life, are communicated
to you.
Our products undergo rigorous
testing to ensure high performance
and longevity in the most demanding
enterprise and industrial environments.
Testing capabilities range from IC level
to ensure die reliability; module level
covering design and layout, controller
hardware and firmware validation,
and OEM customer joint validation for
new devices and modules to ensure
complete module functionality; and,
mass production level Rapid Diagnostic
Test (RDT) to establish 100% proven
reliability at MP scale. ATP memory and
storage modules are manufactured
at ATP’s own facilities and feature
exceptional technologies for the
most challenging applications and
environments.
Industry Associations and Compliances
4
ATP Product Catalog 2018
ATP as a True Manufacturer
At the core of our process ownership is the goal to provide
customers the highest quality of products and services. By
maintaining control of the base stages of the manufacturing
process, we are able to manage every critical phase to ensure
that components are evaluated, tested and validated with
the utmost care. This gives us the unique advantage and
flexibility to meet customers' specific requirements as well as
the solid confidence of the ATP name.
About ATP
All our products are designed, produced and tested at our
own purpose-built factory with state-of-the-art equipment
and world-class engineers, allowing us to meet and adapt
to customer needs quickly. Our proprietary technologies and
resources are available to customers, giving us the unique
edge of managing every activity of the manufacturing process
to ensure quality and product longevity while significantly
restraining costs.
Why ATP
We at ATP take charge of all the stages of the manufacturing
process from materials sourcing all the way to mass
production to make sure that all products coming out of
our manufacturing facilities are consistently backed by the
assurance of quality and long-term product cycles.
We also implement controlled bill of materials (BOM) with
longevity planning. We maintain buffer inventory to prevent
stock outs, ensuring steady access to valuable, often scarce
resources. Any changes affecting the process or product, as
well as product end of life, are communicated to our clients.
We work together to forecast demand, enabling efficient
supply planning and management.
Market Focus
& Applications
As a true manufacturer, we maintain complete control of
our supply and value chains, enabling us to offer the finest
products and most extensive range of services to our clients.
3 Stages of ATP’s Process Ownership
All DRAM and flash storage products go through a series of
Functional and Reliability Tests to ensure that they match
the specifications agreed upon by ATP and the customer
and to ensure that they are compatible with different host
environments.
2018
Product Highlights
For over 25 years, companies around the world have trusted
us to provide the best-in-class memory and flash storage
products. Their confidence in the ATP name is rooted in our
thorough and stringent testing and validation processes,
which start from the component level up to the product level.
1. NAND Flash IC Level
• Built-In Self-Test (BIST)
By incorporating additional
hardware and software
features, ICs can conduct
functional and parametric tests
on their own. This minimizes
dependence on automated
test equipment and eliminates
the need for an external host
or controller, so false failures
due to host-related issues are
reduced.
DRAM Solutions
3. Mass Production Level
To ensure complete module functionality and reliability, we perform:
• Module design/layout validation
• Controller hardware validation
• Controller firmware/FTL (flash translation layer) validation
• OEM customer joint validation: Compatibility testing for new device; module-level
validation with host platform
100% Rapid Diagnostic Test (RDT) performed during the pilot run ensures proven
reliability at mass production (MP) scale. This stage includes the following
components:
• Wide Temperature
ATP’s DRAM and flash storage
products are designed to
withstand extreme temperature
variations common in
demanding applications. ATP
performs wide temperature
testing from extremely low
-40°C to very high 85°C
industrial temperature ranges.
Upon request, ATP can also
perform temperature testing
for commercial ratings
(0°C to 70°C or -25°C to 85°C).
• Complete Drive Test
For NAND flash storage
products, the entire drive,
including firmware, user and
spare areas, is thoroughly
tested. DRAM products also
undergo complete testing,
covering PHY and controller,
including meta/mapping and
data caching areas.
• Reliability and Quality Trending
We make sure that products
are consistently high in quality
and meet all customers’
specifications. ATP implements
a rating and quality monitoring
system, which entails
classifying various grades
and establishing proper
production-level screening
mechanisms to ensure quality.
ATP Product Catalog 2018
Flash Solutions
2. Module Level
ATP Technologies
We ensure the reliability of the NAND flash via thorough meticulous IC-level
validation for reliability and functionality.
5
ATP Market Focus and Applications
ATP is committed to providing the most reliable and enduring memory and storage solutions to enterprise and industrial
operations where premium quality is of utmost importance. We recognize that failure or disruption can cause critical
impact on business operations; this is why we manufacture all our products according to the strictest standards.
ATP products best serve the following markets:
Networking/Telecommunications
Automotive Computing
Non stop, high speed data transmission 24/7 and immense
workload volumes are key challenges in telecom and networking
applications. ATP solutions deliver fast, reliable, highcapacity, and future-ready performance to handle arduous
and ever-changing demands. State-of-the-art Testing During
Burn-In (TDBI) ensures long-term memory reliability, while
PowerProtector technology averts the damaging effects of
power loss events.
From in-vehicle infotainment to navigation systems,
surveillance systems, event data recorders, fleet monitoring
and more, automotive applications face challenging electrical
and environment conditions. ATP solutions employ the unique
System in Package (SiP) technology to withstand shock,
vibration, dust, electromagnetic interference (EMI), electrostatic
discharge (ESD), and variable weather conditions like extreme
temperature and humidity.
The Internet of Things
Automation
IoT refers to everyday physical objects that collect and transmit
data via the Internet. With more and more devices getting
connected to the Internet and communicating with one another
via Wi-Fi capabilities, the Internet of Things (IoT) is expanding
to practically every facet of life. As a member of the Intel® IoT
Solutions Alliance, ATP is recognized as one of the leading IoT
hardware platforms and manufacturers. We are committed
to building a better-connected world by enabling intelligent
network infrastructures, enhancing industrial operations, and
ensuring safety through IoT.
The application of technology in manufacturing has been
changing how factories operate, making them increasingly
intelligent and dynamic. From machine/equipment control to
monitoring, processes are being improved with a combination
of production, information and communication technologies.
ATP’s industrial memory and storage products feature
PowerProtector for power failure protection, data consistency/
retention, industrial operating temperature, and a host of other
outstanding reliability technologies for the smart factory.
6
ATP Product Catalog 2018
About ATP
Why ATP
Market Focus
& Applications
2018
Product Highlights
In this increasingly connected world, business data and
employees are also increasingly becoming more mobile.
ATP’s industrial memory cards have been certified in accordance
with the Motorola Solutions Independent Hardware Vendor
(IHV) Program for their proven track record in rugged reliability.
ATP memory solutions are built with SiP technology for robust
protection against the elements, as well as security features like
Secure Erase to safeguard data integrity.
Health Care
Aerospace and Defense
Health care applications demand very high standards for safety
and reliability. They need to address such issues as patient
privacy and rigid regulatory compliances. Technology in the
medical field should be fast, reliable and interoperable with
connected devices to improve the quality of patient care and
minimize medical errors. ATP’s memory and storage products
for health care applications are used in patient monitoring
devices, diagnostic imaging systems, life support/data logging,
EEG/ECG/EMG devices, and bedside infotainment.
In aerospace and defense applications, the smallest margin of
error is intolerable. Devices operate in severe conditions,
so every component should be extremely reliable. ATP products
meet the most rigid military standards, making sure that critical
missions are accomplished. Security features like Secure Erase
ensure that sensitive data is totally wiped out when the storage
device is at its end of life or if it will be repurposed or disposed
of, so it cannot be retrieved or restored by adversarial groups.
ATP Product Catalog 2018
ATP Technologies
Embedded systems control many devices available today,
and are used in transportation systems, medical equipment,
telecommunication systems, military applications and more.
ATP memory and storage products designed for industrial PCs
and embedded systems feature fast data transfer rates and
higher bandwidth. They are extremely durable to withstand
the rigors of tough operations, compact enough to fit various
form factors, and power-efficient without compromising
performance.
DRAM Solutions
Enterprise Mobility
Flash Solutions
Industrial/Embedded PC
7
2018 Product Highlights
Industrial Temperature NVMeTM SSDs
Unleash the Real Speed of NAND Flash
ATP’s new NVMeTM-based SSDs in the M.2 form factor
leverage the blazing-fast bandwidth of the PCI Express®
(PCIe®) interface to support the growing data-hungry needs
of today’s enterprise. Fitting in a PCIe 3.0 x4 slot, ATP NVMe
SSDs outperform Serial ATA 6 Gb/s SSDs with 4-6X faster
access, over 3X lower latency, and higher Input/Output per
Second (IOPS). Industrial operating temperature (iTemp)
enables NVMe SSDs to deliver stable performance even in
extreme temperatures ranging from -40°C to 85°C.
High Speed
High Capacity & Performance
High Endurance & Reliability
• 32 Gb/s bandwidth on a PCIe 3.0 8 Gb/s
interface, x4 lanes
• Sequential read speed up to 2,540 MB/s
• Sequential write speed up to 1,100 MB/s
• Massive densities up to 1 TB
• Random Read IOPS: up to 100,000
• Dynamic Thermal Throttling
mechanism to prevent overheating
• Available in industrial (-40°C to 85°C)
or commercial (0°C to 70°C) operating
temperature
• 1,536 TB maximum TBW
Extensive SATA III SSD Range Offers Ideal Solutions
for Embedded and Industrial Applications
ATP’s solid state drives using the SATA 6 Gb/s interface offer
high speed, stable performance and power savings, making
them leading choices in embedded and industrial applications.
Available in different form factors and capacities ranging from
8 GB to 1 TB, ATP’s SATA 6 Gb/s SSDs consume less power
than traditional hard disk drives, are more resistant to shocks
and vibrations because they have no mechanical parts,
and are suitable for big workloads demanding consistently
dependable performance.
Tried and Tested Performance
Compact Form Factor Options
Power-Packed with Unique
Technologies
• High-speed SATA 6 Gb/s transfer
speed
• Available in industrial (-40°C to 85°C)
or commercial (0°C to 70°C) operating
temperature
• Temperature sensor to detect device’s
& controller’s temperatures*
• Dynamic Thermal Throttling
mechanism to prevent overheating*
• 2.5” SSD
• M.2 2280, 2260, 2242
• mSATA
• SlimSATA
• Enhanced power loss protection with
PowerProtector
• Dynamic Over-Provisioning for
consistent performance and extended
endurance*
• Advanced Wear Leveling for longer
endurance
* For certain models only.
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ATP Product Catalog 2018
About ATP
Accelerate Enterprise Performance with DDR4-2666
Why ATP
Data-intensive applications will benefit greatly from the fast
data transfer speed, low voltage, and copious density of ATP’s
latest range of industrial DDR4 modules.
Energy-Efficiency
Defensive Durability
• 2666 MT/s data rate
• Available in densities from 4 to 32 GB
(RDIMM) and 4 to 16 GB (ECC UDIMM,
ECC SO-DIMM, UDIMM and SO-DIMM)
• Low 1.2V power consumption
• Thicker 30µ gold finger plating
• Conformal Coating
2018
Product Highlights
24/7 Stable Performance
Market Focus
& Applications
Built for the latest Intel® Xeon® Scalable and 8th-generation
Intel® Core™ i7/i5/i3 processors, ATP’s latest DDR4 modules
with 2666 MT/s data transfer rate and low 1.2V power
consumption boost performance, keep systems cool and save
on energy costs.
ATP Technologies
3D MLC Memory Cards Deliver Enhanced
Reliability and Endurance
DRAM Solutions
As global trends inevitably shift from 2D planar NAND to 3D,
ATP leads the implementation of 3D multi-level cell (MLC)
flash technology on its SD and microSD memory cards.
The 3D MLC memory cards take advantage of 3D NAND’s
higher performance and capacity while sustaining the
reliability and endurance levels of the previous generation.
They meet the growing demands of automotive applications
such as in-vehicle infotainment (IVI), event data recording
and Advanced Driver Assistance Systems (ADAS) with fast
random read-write performance (SDA A1 spec) and reliability
under extremely low or high temperatures.
Benefits of ATP 3D MLC Memory Cards
ATP Product Catalog 2018
Flash Solutions
• Superior endurance
• A1 Application Performance Class min. Random read/write: 1500/500 IOPS
• Optimized cost efficiency
• Rugged design–waterproof/dustproof, ESD-resistant
• Passed environmental testing (bend/torque/salt/spray/solar radiation)
• High endurance via Advanced Wear Leveling algorithm
• Advanced data integrity and retention technologies: SD Life Monitor, Auto Refresh, and Dynamic Data Refresh*
*By model
9
ATP Technologies
As a technology-driven company, ATP is committed to developing innovative solutions and harnessing the most advanced
technologies to ensure that our products deliver the highest levels of data integrity, reliability and retention for mission-critical
applications.
Data Integrity
SD Life Monitor/S.M.A.R.T.
Provides a user-friendly interface for monitoring the health status and life expectancy of
a flash product.
Power Failure Protection/PowerProtector
Prevents data loss during a power loss event by ensuring that the last read/write/erase
command is completed and data is stored safely in non-volatile flash memory.
Advanced Wear Leveling
Manages the reads and writes across blocks evenly to optimize the overall life
expectancy of a flash product.
AutoRefresh
Monitors the error bit level in every operation. Before the error bit in a block reaches or
exceeds the preset threshold value, AutoRefresh moves the data to a healthy block, thus
preventing the controller from reading blocks with too many error bits and averting read
disturbance and data corruption.
Secure Erase
A sanitization solution made especially for SSDs and memory cards making sure that
sensitive data is not recovered or retrieved if the SSD or memory card needs to be
disposed or repurposed. By making sure that no remnant of sensitive data remains,
Secure Erase is the ideal solution for government, military, and business applications
with intense security requirements.
10
ATP Product Catalog 2018
About ATP
Why ATP
Data Reliability
Market Focus
& Applications
Industrial Temperature
Operational stability in extreme temperatures from -40°C to 85°C.
2018
Product Highlights
Anti-Sulfur Resistors
ATP DRAM modules and NAND flash storage products offer an
anti-sulfur resistor option to prevent the corrosive effects of sulfur
contamination, guaranteeing continued dependable performance
for a long time.
ATP Technologies
Conformal Coating
Protects electronic circuits with a coating of the chemical
compound Parylene to resist dust, chemical contaminants,
extreme temperature, moisture and corrosion.
DRAM Solutions
SiP (System in Package)
Flash Solutions
Manufacturing process that encapsulates all exposed components
to provide protection and shielding.
Thicker Gold Finger
30µ”-thick gold plating of the DRAM contact optimizes signal
transmission quality between the connector and DRAM modules.
ATP Product Catalog 2018
11
ATP Technologies
Data Retention
Dynamic Data Refresh
Runs automatically in the background to reduce the risk of read disturbance and
sustain data integrity in seldom-accessed areas by sequentially scanning the user
area flag record without affecting the read/write operation. The data that has been
completely moved to another block will be read and compared with the source data to
ensure data integrity.
Add-On Services
Joint Validation
ATP conducts compatibility/function tests with client-supplied host devices and
systems, to proactively detect and minimize failures that may not be caught in
production tests, thus improving overall quality.
Test During Burn-In (TDBI)
Components are subjected to low and elevated temperatures within an enclosed
chamber to detect failure as a result of high-failure rates in the early life failure (ELF)
period.
Complete Drive Test
For NAND flash storage products, the entire drive, including firmware, user and spare
areas, is thoroughly tested to ensure that there are no bad blocks. DRAM products also
undergo complete testing, covering PHY and controller, including meta/mapping and
data caching areas.
For detailed information on available solutions for your industrial application needs,
visit the ATP website at http://www.atpinc.com.
12
ATP Product Catalog 2018
DRAM Solutions
Intense Performance for Intense
Workloads
ATP’s industrial DRAM modules are built tough and can meet the exacting
demands of the growing enterprise. On call 24/7, these hardworking modules
are fast, can withstand harsh operating environments, and can handle large
bandwidth requirements. ATP’s DRAM lineup consists of legacy SDRAM, and a
complete range of DDR1, DDR2, DDR3, and DDR4 modules including the latest
DDR4-2666. They are available as RDIMM, RDIMM VLP, UDIMM/UDIMM ECC,
SO-DIMM/SO-DIMM ECC, SO-CDIMM, Mini-RDIMM, FB-DIMM, and
Mini-UDIMM/Mini-UDIMM ECC.
ATP Product Catalog 2018
13
ATP DRAM Unique Features
Unique memory technologies and solutions enable ATP DRAM modules to deliver peak performance and exceptional reliability
in any demanding industrial computing environment.
Industrial Temperature
Conformal Coating
ATP DRAM modules can endure extreme temperatures
ranging from -40°C to 85°C, ensuring long-term stability
for systems installed in telecom, industrial and military/
aerospace operations where consistent availability and
steadfast performance are of critical importance.
A protective layer of Parylene is applied to electronic circuits
and modules, accessing spaces as narrow as 0.01 mm
to shield against dust, chemical, extreme temperatures,
moisture and corrosion. The coating film is formed by the
chemical vapor deposition (CVD) process, and unlike dipping
and spraying techniques, is completely pinhole free as the
film conforms to any irregular shape, forming a vacuum-like
environment to coat all components and points of failure.
ATP’s modules undergo two levels of testing to ensure
maximum reliability:
1. Advanced IC Level Testing screens for ICs with the best
reliability and quality characteristics that are suitable for
applications requiring wide temperature.
2. Enhanced Module Level Test During Burn-In (TDBI) and
Automatic Test Equipment (ATE) guarantee that modules
meet and even exceed qualifying parameters.
Increased Thickness, Strength
Anti-Sulfur Resistors
30μ”
In order to ensure the quality of the signal transmission
between the connector and ATP DRAM module, ATP utilizes
gold finger plating with 30μ” thickness, compared to
competitors’ DRAM modules thickness typically at less
than 10μ”.
14
ATP Product Catalog 2018
Ordinary silver resistors corrode and become non-conductive
when exposed to sulfur. ATP DRAM modules use antisulfur resistors that repel the damaging effects of sulfur
contamination, guaranteeing continued dependable
performance for a long time and lowering the total cost
of ownership by preventing unnecessary downtime and
expensive component replacements.
Why ATP
About ATP
ATP DDR4-2666 modules for Intel® Xeon® Scalable
and 8th-generation Intel® Core™ Processors
Rev Up Your Enterprise
High-performance computing (HPC) applications such as
telecommunication infrastructure, networking storage
systems, NAS (Network Attached Storage), micro/cloud
servers, and embedded systems like industrial PCs will
greatly benefit from:
Market Focus
& Applications
Blaze through massive memory workloads while generating
big power savings with ATP DDR4-2666 modules built for
the latest Intel® Xeon® Platinum, Gold, Silver and Bronze
Scalable processors and 8th-generation Intel® Core™ i7/
i5/i3 processors. Designed to meet growing and evolving
enterprise demands, ATP DDR4 solutions can expand
operational capabilities, cut down TCO, and ensure that your
organizations are ready for the future.
2018
Product Highlights
Accelerated Performance
Enterprise-level density meets large-scale, memory-intensive workloads. The fast 2666 MT/s data rate delivers speedy
performance for greater productivity.
Immense Power Savings
A mere 1.2V power consumption keeps systems cool and energy costs at a minimum, translating to better efficiency and big
savings.
ATP Technologies
Future-Ready Scalability
The 8 Gbit IC design enables cost-effective expansion of memory footprints to keep pace with future requirements.
Data Rate
Voltage
PCB Height
Operating
Temperature
Golden Finger
Density
RDIMM
2666 MT/s
1.2 V
STD 31.25 mm
0-85°C
30 µ
4 GB/8 GB/16 GB/32 GB
ECC UDIMM
2666 MT/s
1.2 V
STD 31.25 mm
0-85°C
30 µ
4 GB/8 GB/16 GB
ECC SO-DIMM
2666 MT/s
1.2 V
STD 30 mm
0-85°C
30 µ
4 GB/8 GB/16 GB
UDIMM
2666 MT/s
1.2 V
STD 31.25 mm
0-85°C
30 µ
4 GB/8 GB/16 GB
SO-DIMM
2666 MT/s
1.2 V
STD 30 mm
0-85°C
30 µ
4 GB/8 GB/16 GB
ATP Product Catalog 2018
Flash Solutions
Type
DRAM Solutions
Product Family
15
Legacy (SDR/DDR) DRAM Modules
Micron endorses ATP as a partner to support selected SDR/DDR
DRAM Modules
The expanded coverage demonstrates the strong partnership
between ATP and Micron. As a strategic partner, ATP works
closely and exclusively with Micron to transfer module designs
and extend long-term support to offer the legacy modules in
selected form factors (SO-DIMM, UDIMM and RDIMM) and
densities, along with ATP’s unique services and features.
Under a license agreement with Micron Technology, Inc. signed
in August 2015, ATP will continue to manufacture legacy
(SDR/DDR) DRAM modules for Micron’s customers who are
unable to migrate. The agreement was expanded in 2016 with
the addition of selected legacy DRAM modules specifically for
customers using AMD Embedded/Geode platforms.
The license agreement stipulates the following conditions for ATP:
•100% follow Micron’s firmware settings. Implement SPD in
addition to the manufacturer’s information.
•100% follow Micron’s specifications. Each module will be
manufactured to the equivalent specifications and test
processes of the corresponding Micron part number.
•100% follow Micron’s design. Offer extended support for
these legacy products to minimize the customer’s
(re)qualification efforts.
•100% follow Micron’s BOM selection. Implement the same
key components (such as IC configuration and Register/
PLL type), as well as passive components (such as resistors,
capacitors and EEPROM) to meet the specifications of
Micron’s BOM.
Endorsements
“Embedded applications require a long life cycle, which is why
AMD is pleased to collaborate with ATP and Micron to support
the extended life of AMD’s Geode platform. ATP’s legacy SDR/
DDR SO-DIMM module solutions utilizing Micron memory are
a critical component to industrial control and automation,
industrial PCs, HMI panels, point of sales and communication
applications.” - Colin Cureton, Product Marketing Manager,
AMD Embedded Solutions
“Micron Technology, Inc. is committed to supporting legacy
application requirements. By partnering with ATP, we’re able to
provide stability for our customers who are unable to transition
their existing platforms.” - Bruce Franklin, Product Marketing
Director, Micron’s Embedded Business Unit
Product Information
Standard Solutions
Module Type
DDR SO-DIMM
DDR SO-DIMM (Industrial Grade)
Capacity
128 MB / 256 MB / 512 MB/ 1 GB
256 MB / 512 MB / 1 GB
Function
Unbuffered Non-ECC
Unbuffered Non-ECC
Frequency
400 MHz
400 MHz
Number of Pins
200
200
PCB Height
1.25"
1.25"
Build To Order (BTO)
16
Module Type
DDR RDIMM
DDR UDIMM
DDR SO-DIMM
SDRAM SO-DIMM
Capacity
1 GB / 2 GB
256 MB / 512 MB
256 MB / 512 MB / 1 GB
Function
Registered ECC
Unbuffered ECC/
Unbuffered Non ECC
64 MB / 128 MB /
256 MB / 512 MB
Unbuffered ECC
Unbuffered Non ECC
Frequency
400 MHz
400 MHz
400 MHz
133 MHz
Number of Pins
184
184
200
144
PCB Height
1.125"/1.2"
1.25"
1.25"
1.0"/1.25"
ATP Product Catalog 2018
Why ATP
About ATP
ATP Testing Systems
Memory chips, such as all semiconductor devices, follow
a reliability/failure pattern known as the “Bathtub Curve.”
According to this pattern, most failures occur during the first
three months of use. Once the early life failure (ELF) period
passes, failures become extremely rare, and the useful life is
estimated to be 20 years or more. End of life failures refer to
those that occur when the semiconductor product wears out
and fails.
Market Focus
& Applications
Highly complex and demanding networks should maintain
availability and operational efficiency while running round
the clock. Any down time arising from component failure has
the potential to cause disastrous data losses with significant
legal and financial impact. Aware of the need for outstanding
reliability at all times, ATP makes sure that DRAM modules
coming out of its manufacturing facilities are thoroughly
tested and potential failures screened out.
The ATP TDBI system simulates the ELF period by applying
extreme high/low temperature, high/low voltage, and pattern
testing on the DRAM modules.
The system consists of:
• Miniature Chamber, which isolates temperature cycling to
the targeted area.
• Module Riser Adapters from the motherboard, which allow
easy module insertions in production-level volumes.
• Multiple temperature sensors, which regulate temperature
profiles, operating on a wide testing temperature range of
-40° to 85°C.
ATP Technologies
ATP’s Test During Burn-In (TDBI) aims to effectively screen
out defective DRAM chips that will potentially fail during the
early life failure (ELF) period. By ensuring that only robust
DRAM chips are on the module, TDBI can significantly lower
failure rates and extend the product service life.
2018
Product Highlights
Test During Burn-In (TDBI)
Also, based on customers’ requests, tailor-made electrical
testing patterns can be programed and implemented into
the ATE testing process. The ATE testing system can pinpoint
individual defective ICs or defective DRAM PCB boards, thus
providing a more efficient failure analysis method for both
new product development and mass production stages.
Flash Solutions
ATE detects component defects and structural defects related
to the DIMM assembly and screens out marginal timing
and signal integrity (SI) sensitivities. ATE provides electrical
testing patterns with various parameter settings, such as
marginal voltage, signal frequency, clock, command timing
and data timing under continuous thermal cycle. For specific
weaknesses of some ICs, ATE can provide specific testing
patterns to stress the screening of the particular defects
during the testing.
DRAM Solutions
Automatic Testing Equipment (ATE)
ATP Product Catalog 2018
17
Complete DRAM Product Line
Product
Category
DDR4
Speed
(MT/s)
Form Factor
Features
2133
2400
2666
• Density: 2 GB to 64 GB
• Low profile
• Increased performance and bandwidth
• Very Low Profile (VLP) options
(up to 3200 MT/s)
(VLP: 0.74" height)
• Decreased voltage for better power consumption
• Ultra Low Profile (ULP) options
• Provides better reliability, availability and serviceability
(ULP: 0.7"~0.72” height)
(RAS) and improves data integrity.
RDIMM
UDIMM/UDIMM ECC
SO-RDIMM
SO-DIMM/SO-DIMM ECC
Mini-RDIMM
Mini-UDIMM ECC
1866
1600
1333
1066
• Density: 1 GB to 32 GB
• Chipkill support
• Low profile
• Fly-by command/address/control bus with
• Very Low Profile (VLP) options
on-DIMM termination.
(VLP: 0.74" height)
• Higher bandwidth performance, effectively up to
• Ultra Low Profile (ULP) options
1866 MT/s
(ULP: 0.7"~0.72” height)
• Better performance at low power; 1.5 V (Normal)
and 1.35 V (Low Voltage)
RDIMM
UDIMM/UDIMM ECC
SO-RDIMM
SO-CDIMM
SO-DIMM
Mini-RDIMM
FB-DIMM*
800
667
533
400
• Low Profile
• Very Low Profile (VLP) options
(VLP: 0.72"~0.74" height)
UDIMM/UDIMM ECC
SO-CDIMM
SO-DIMM
400
333
266
• Low Profile
• Very Low Profile (VLP) options
(VLP: 0.72"~0.74" height)
• Chipkill support
• Legacy system support
SO-DIMM
133
100
• Low Profile
• Legacy system support
LRDIMM/RDIMM
UDIMM/UDIMM ECC
SO-DIMM/SO-DIMM ECC
Mini-RDIMM
Mini-UDIMM ECC
DDR3
DDR2
• Density: 1 GB to 8 GB
• Chipkill support
FB-DIMM
• Low power and low voltage options
• Apple FB-DIMM
DDR*
SDRAM*
Product Portfolio
Industrial Grade
Family
Category
SO-DIMM
UDIMM
RDIMM
Mini-DIMM
* Available on a project basis.
18
ATP Product Catalog 2018
Product
DDR4
DDR3
DDR2
DDR*
SDRAM*
Features
• Extended temperature: -40°C ~ 95°C
• Controlled BOM and SPD
• For mission-critical industrial applications
• Conformal Coating
About ATP
Why ATP
Market Focus
& Applications
Flash Solutions
Ruggedized Industrial Flash Products
for Mission-Critical Applications
Flash Solutions
DRAM Solutions
ATP Technologies
2018
Product Highlights
ATP’s industrial flash products deliver dependable performance, efficient
responsiveness, and long usage life to accomplish mission-critical tasks. Sturdy
and built to withstand rigorous operating environments, ATP flash storage comes
in different form factors such as 2.5” SSDs, M.2 embedded modules, mSATA,
SlimSATA, CFast, CompactFlash, SD/microSD memory cards, and USB drives for
enterprise and industrial applications. They support high-speed interfaces such
as SATA 6 Gb/s and the latest NVMe™ protocol on a PCIe® 3.0 x4 interface for
reliable, blazing-fast, and future-ready performance.
ATP Product Catalog 2018
19
Flash Products Naming Rule
N 600 i
Interface
Product Endurance spec.
Temp./Segment/Category
N: PCIe (NVMe)
A: SATA
B: USB
I : PATA/IDE (CF)
S: SD/microSD
600: Standard
700: Enhanced
800: Optimal
900: Reserved
c: Commercial Temp
i: Industrial Temp
a: Automotive Line
p: Premium Line (with I-Temp)
v: Value Line (with C-Temp)
(uppercase)
(number)
(lowercase)
Flash Product Line
Premium Line
The ATP Premium Line consists of mass storage solutions built for uncompromising performance, maximum dependability,
and exceptional endurance. Outfitted with best-in-class technologies ensuring the highest levels of reliability, these solutions
are hardwired for the most demanding mission-critical applications where system failures or interruptions can significantly
impact operations. With industrial temperature ratings of -40°C to 85°C, these rugged solutions can withstand harsh operating
environments and extreme temperatures. Unparalleled usage life and brisk write speeds set the Premium Line a cut above the
rest. High input/output operations per second (IOPS) ensure consistently high performance, and PowerProtector Technology
guarantees that data in transit are safely stored to the flash chip in the event of a power loss, thus safeguarding data integrity,
averting data loss or corruption, and preventing device damage.
Superior Line
The ATP Superior Line brings together powerful and proven features and technologies for rigorous operations in diverse
industries, capably handling mixed workloads with high IOPS requirements. Generous storage densities make these products
ideal for data-hungry and write-intensive applications; mid-density drive options offer a wider range of choices for cost
efficiency; and, configurable over-provisioning gives users flexibility to make adjustments based on actual workloads for
the optimal balance between drive performance and endurance. ATP Superior Line products are available in both industrial
temperature (-40°C to 85°C) and commercial temperature ratings (embedded SSD: 0°C to 70°C; SD/microSD card: -25°C to
85°C), giving users the flexibility to choose the temperature range most appropriate for their needs.
Value Line
The ATP Value Line integrates advanced essential solutions to the growing needs of enterprises and industries, offering
sustained, reliable performance and consistent reliability. Superb choices as embedded boot or boot image devices, they are ideally
suited for Internet of Things (IoT) applications, spurring greater connectivity for homes, cars, medical equipment, and other smart
devices. Ample storage capacity is available for installing an operating system with space to spare for other applications.
20
ATP Product Catalog 2018
Why ATP
About ATP
NVMe™ M.2 SSDs: NAND Flash in the Fast Lane
Market Focus
& Applications
ATP debuts this new industry standard protocol in its latest
line of SSDs in the M.2 2280 form factor. ATP’s NVMe SSD
modules fit on a PCIe Gen3 x4 slot, delivering up to 32 Gb/s
(8 Gb/s per lane) bandwidth and high sequential read/write
speeds. With an industrial operating temperature rating of
-40°C to 85°C, NVMe SSDs give dependable performance
even in extreme temperatures. Dynamic Thermal Throttling
automatically adjusts the speed to maintain cooler operation
under intense and heavy workloads.
The NVM Express® (NVMe™) protocol takes advantage of the
high-bandwidth bus technology of the PCI Express® (PCIe®)
interface, bringing dramatic improvements in speed and
capabilities and outperforming Serial ATA (SATA) 6 Gb/s by up
to 6X. Designed to move past the limitations of mechanical
drives, NVMe was specifically built from the ground up for
faster, more efficient access to storage devices with
non-volatile memory such as current NAND flash solutions
and future non-volatile memory technologies. These SSDs
can deliver fast, reliable and durable performance for any
demanding application.
2018
Product Highlights
Key Features
• Superior Read/Write performance
• LDPC & RAID Data Recovery for error correction
• Dynamic Thermal Throttling
• Global wear leveling
• TRIM function support
2280-D2-M
Product Line
Superior
Naming
N600i
Flash Type
iTemp MLC
N600c
MLC
Density
Sequential Read up to (MB/s)
2,540
Sequential Write up to (MB/s)
1,100
Up to 100,000
Random Read IOPS (4K, QD32)
Interface
PCIe Gen3 8 Gb/s Interface, x4 Lanes
Operating Temperature
Reliability
DRAM Solutions
128 GB to 1 TB
-40°C to 85°C
0°C to 70°C
TBW* (max.)
1,280 TB
1,536 TB
DWPD* ( max.)
1.75
MTBF @ 25°C
Dimensions: L x W x H (mm)
2.10
>2,000,000 hours
80.0 x 22.0 x 3.5
Flash Solutions
Performance
ATP Technologies
M.2 NVMe
Product Name
* Under highest Sequential write value. May vary by density, configuration and applications.
ATP Product Catalog 2018
21
Configurable SSDs
1 TB
768 GB
192 G
B
OP
Endu
rance
&
256 GB
Bette
r
Mid-D
384 GB
Config
urable
ensity
Perfo
rman
ce
512 GB
128 GB
28%
7%
Mid-Density NAND Flash Modules Offer More Choices
for Cost-Effective Storage Allocation
ATP has announced the release of the new Mid-Density
technology for industrial NAND flash module solutions.
This ATP signature technology provides a different perspective
when it comes to the cost-effectiveness of NAND flash
storage.
Typically, NAND flash storage products are offered in powers
of two - 64/128/256/512 GB or 1 TB. As capacities increase,
so does the gap between each capacity point, resulting in
higher marginal cost jumps.
ATP offers storage capacities that do not come in powers of
two. These “in-between” capacities, such as 96/192/384/768
GB, expand ATP’s portfolio to give users more choices that
can match what they really need and what they are willing to
pay for, resulting in optimized cost-per-gigabyte. Mid-density
options minimize the cost jump from lower to higher capacity,
giving users a wider range of choices based on their needs
and resulting in more cost-effective resource allocation.
Adjustable Dynamic Over-Provisioning
Optimizes SSD Performance and Endurance
ATP launches a new breed of embedded SSDs breaking the
mold from rigid factory-set configurations.
ATP embedded SSDs featuring the ATP Dynamic OverProvisioning (OP) solution offer the freedom and flexibility to
configure SSDs according to the actual workloads of specific
applications. While OP percentage is typically set to a default
7% for client applications or 28% for enterprise storage
applications, ATP recognizes that it is essential to determine
and implement the right configurations that will address
various workloads to ensure the operational health of the
storage device.
22
ATP Product Catalog 2018
Different OP percentages can affect SSD performance and
endurance. With ATP’s Dynamic Over-Provisioning solution,
users can evaluate actual workloads and configure the overprovisioned space accordingly using simple software. They
have the freedom and flexibility to optimally configure SSDs
with 7%, 14%, 28% and even 50% or more OP space for the
best-possible performance and endurance. By enabling
users to configure the OP setting based on actual needs,
the ATP Dynamic Over-Provisioning solution maximizes the
performance and life span of the SSD, translating to greater
productivity and better operational efficiency.
Industrial SATA III SSDs: High-Performance,
High-Density Storage in Compact Form Factors
About ATP
Serial ATA (SATA) SSDs use the most common storage interface and are extensively deployed for applications requiring strict
data integrity and maximum uptime. ATP’s SATA SSDs provide the excellent balance of reliable performance, high capacity, and
cost-efficiency to meet demanding data-intensive applications.
Wide Temperature Ratings
M.2: Power-Packed Performance
in a Lean Footprint
2018
Product Highlights
M.2 SSD modules provide higher performance and capacity
while minimizing the overall module footprint. ATP M.2 iTemp
modules are available in types 2242, 2260 and 2280 and are
suitable for networking and thin storage systems, point-ofsale systems (POS), and industrial computer applications.
Adopting the double-sided M.2 configuration to enable
higher densities, M.2 2242 SSDs pack up to 256 GB capacity;
2260 has a maximum capacity of 512 GB; and 2280 loads a
massive capacity of up to 1 TB.
Market Focus
& Applications
Why ATP
ATP offers an extensive range of SATA SSDs in small form factors packed with high densities and able to withstand severe
temperature shifts common in industrial environments. Wide operating temperature ratings of -40°C to 85°C make these small
SSDs capable of functioning dependably in extremely cold or hot locations.
ATP Technologies
SlimSATA:
Premium Reliability
DRAM Solutions
Occupying just half the footprint of a 1.8” SSD and
holding up to 512 GB capacity, ATP’s SlimSATA SSDs
are ideal for business-critical industrial PCs, advanced
telecommunications computing architecture, single-board
computers, surveillance and security, and networking
environments.
Flash Solutions
mSATA:
Cost-Effective Efficiency
Just roughly the size of a business card, ATP’s iTemp mSATA
SSDs offer up to 512 GB capacity and the same speed and
efficiency of SATA. They are designed to fit in systems with
space constraints and high-performance requirements such
as embedded and networking applications.
ATP Product Catalog 2018
23
Memory Card Solutions for Automotive Applications
The era of Internet of Vehicles (IoV) continues to drive the
automotive industry evolution forward and vehicles are
becoming more connected. ATP’s automotive solutions
deliver the quality and reliability assurance to meet the
requirements of major automotive OEM/Tier 1 suppliers,
system developers and service providers for higher levels of
data accuracy, consistency and integrity in applications such
as maps/navigation systems, in-vehicle infotainment (IVI),
Advanced Driver Assistance Systems (ADAS), and other dataintensive applications. These solutions can withstand extreme
temperatures, dust and shock/vibration, and maintain data
integrity under power cycling or sudden power-off events.
Leveraging over 25 years of manufacturing experience and
8 years of automotive experience, ATP uses its vast
knowledge base to analyze and simulate usage cases
according to customized test criteria with specific software
and test scripts. This enables ATP to tailor-fit products and
adapt to customer-specific requirements. Under the Joint
Validation program, compatibility and functional tests are
conducted with customers’ host devices and systems.
At mass production stage, 100% production level burn-in test
using wide temperature ranges sorts out manufacturing or
component defects before shipping to customers.
Quality Capabilities
Engineering Capabilities
• VDA 6.3/APQP/ASPICE*
• Certifications: ISO9001, ISO14001, ISO/TS16949**
• Product Validation: PPAP*
• IMDS (International-Material-Data-System)
• Continuous improvement — 8D reports and failure analysis
* Available on a project basis.
**On select models
• ATP IVI Test Plan
•Selected AEC-Q100 test items and conditions approved by
customers
•Power Cycling test: ATP unique F/W and testing script
•ATP NAND flash IC-level test (Data Retention, Endurance,
Read Disturbance)
•Joint Validation: compatibility and function tests with IVI
systems
Product Line
Automotive
Product Name
SD/SDHC/SDXC
microSD/microSDHC/microSDXC
Naming
Flash Type
S600a
iTemp MLC
Density
Performance
MLC
8 GB* to 32 GB
Sequential Read up to (MB/s)
95
95
Sequential Write up to (MB/s)
79
79
Interface
8 GB ~ 64 GB, UHS-I
-40°C to 85°C
-25°C to 85°C
8 GB ~ 64 GB, UHS-I
-40°C to 85°C
-25°C to 85°C
TBW** (max.)
76.8 TB
38 TB
MTBF @ 25°C
>2,000,000 hours
>2,000,000 hours
20,000 (SDA spec minimum 10,000)
Number of Insertions:
Dimensions: L x W x H (mm)
32.0 x 24.0 x 2.1
* By project support.
**Under highest Sequential write value. May vary by density, configuration and applications.
24
iTemp MLC
8 GB* to 64 GB
Operating Temperature
Reliability
MLC
ATP Product Catalog 2018
15.0 x 11.0 x 1.0
Why ATP
About ATP
SD/SDHC/SDXC Cards
Key Features
• Power failure protection
• Industrial Temperature
• Joint Validation
• 100% MP Level Test
SD/SDHC/SDXC
Premium
Superior
Value
Naming
S800p
S700p
S700c
S600i
S600c
S600v
Flash Type
SLC
iTemp SLC mode
SLC mode
iTemp MLC
MLC
MLC
Density
8 GB to 64 GB
8 GB to 256 GB*
8 GB to 32 GB
Performance
512 MB to 8 GB
4 GB to 64 GB
4 GB to 64 GB
Sequential Read
up to (MB/s)
69
96
96
96
96
Sequential Write
up to (MB/s)
39
80
80
78
59
512 MB~2 GB,
HS mode
4 GB~8 GB, UHS-I
UHS-I
Interface
Operating Temperature
-40°C to 85°C
TBW** (max.)
Reliability
UHS-I
MTBF @ 25°C
192 TB
512 TB
UHS-I
-25°C to 85°C
-40°C to 85°C
-25°C to 85°C
-25°C to 85°C
512 TB
77 TB
307 TB
38 TB
>5,000,000 hours >3,000,000 hours >3,000,000 hours
Number of
Insertions:
2018
Product Highlights
Product Line
>2,000,000 hours
ATP Technologies
Product Name
Market Focus
& Applications
SD Life Monitor
Advanced Wear Leveling
SiP (System in Package)
AutoRefresh technology
Dynamic Data Refresh
>2,000,000 hours
20,000 (SDA spec minimum 10,000)
Dimensions: L x W x H (mm)
32.0 x 24.0 x 2.1
DRAM Solutions
•
•
•
•
•
* By project support.
** Under highest Sequential write value. May vary by density, configuration and applications.
Product Line
Premium
∆
●
●
●
∆
●
●
●
●
∆
Superior
∆
●
●
●
●
●
∆
●
●
∆
Value
* Please refer to pages 10-12.
●
Flash Solutions
Technologies &
Add-On Services*
●
Δ: Customization option available on a project basis.
ATP Product Catalog 2018
25
microSD/microSDHC/microSDXC Cards
Key Features
• SD Life Monitor
• Advanced Wear Leveling
• SiP (System in Package)
• AutoRefresh technology
• Dynamic Data Refresh
• Power failure protection
• Industrial temperature
• Joint Validation
• 100% MP Level Test
Product Name
microSD/microSDHC/microSDXC
Product Line
Premium
Superior
Value
Naming
S800p
S700p
S700c
S600i
S600c
S600v
Flash Type
SLC
iTemp SLC mode
SLC mode
iTemp MLC
MLC
MLC
Density
512 MB to 8 GB
4 GB to 16 GB
4 GB to 64 GB
8 GB to 32 GB
8 GB to 128 GB
8 GB to 32 GB
82
88
96
79
96
79
39
78
85
75
81
75
512 MB~2 GB,
HS mode
4 GB~8 GB, UHS-I
UHS-I
Performance
Sequential Read
up to (MB/s)
Sequential Write
up to (MB/s)
Interface
Operating Temperature
-40°C to 85°C
TBW* (max.)
Reliability
192 TB
UHS-I
-25°C to 85°C
128 TB
MTBF @ 25°C >5,000,000 hours
-40°C to 85°C
-25°C to 85°C
-25°C to 85°C
38 TB
153 TB
38 TB
512 TB
>3,000,000 hours >3,000,000 hours
Number of
Insertions:
UHS-I
>2,000,000 hours
>2,000,000 hours
20,000 (SDA spec minimum 10,000)
Dimensions: L x W x H (mm)
15.0 x 11.0 x 1.0
* Under highest Sequential write value. May vary by density, configuration and applications.
Technologies &
Add-On Services*
Product Line
Premium
∆
●
●
●
∆
●
●
●
●
∆
Superior
∆
●
●
●
●
●
∆
●
●
∆
Value
* Please refer to pages 10-12.
26
●
Δ: Customization option available on a project basis.
ATP Product Catalog 2018
●
CompactFlash Cards
Key Features
Product Name
CompactFlash Card
Premium
Superior
Naming
I800p
I700c
I600c
Flash Type
SLC
SLC mode
MLC
Density
512 MB to 32 GB
4 GB to 16 GB
8 GB to 32 GB
Sequential Read up to (MB/s)
61
110
108
Sequential Write up to (MB/s)
55
80
46
Interface
UDMA 0~4
UDMA 0~6
Operating Temperature
-40°C to 85°C
0°C to 70°C
1,280 TB
128 TB
DWPD* (max.)
22.4
11.2
MTBF @ 25°C
>5,000,000 hours
38 TB
1.7
>2,000,000 hours
10,000 minimum
Number of Insertions:
Dimensions: L x W x H (mm)
Market Focus
& Applications
Reliability
TBW* (max.)
Why ATP
Product Line
Performance
About ATP
• Global wear leveling and bad block management
• AutoRefresh technology
• PowerProtector
• Power saving mode
• S.M.A.R.T support
36.4 x 42.8 x 3.3
* Under highest Sequential write value. May vary by density, configuration and applications.
Product Line
Premium
●
Superior
●
* Please refer to pages 10-12.
●
●
●
●
●
●
●
●
∆
∆
∆
∆
2018
Product Highlights
Technologies &
Add-On Services*
Δ: Customization option available on a project basis.
CFast Cards
Key Features
Product Name
CFast Card
Premium
Superior
Naming
A800p
A600i
A600c
Flash Type
SLC
iTemp MLC
MLC
Density
8 GB to 32 GB
16 GB to 128 GB
16 GB to 128 GB
Sequential Read up to (MB/s)
500
445
445
Sequential Write up to (MB/s)
300
160
160
Random Read IOPS up to
35,800
29,400
29,400
Interface
SATA III 6 Gb/s
Operating Temperature
-40°C to 85°C
-40°C to 85°C
0°C to 70°C
TBW* (max.)
2,667 TB
267 TB
320 TB
DWPD* (max.)
46.8
2.9
3.5
MTBF @ 25°C
>2,000,000 hours
>2,000,000 hours
Flash Solutions
Reliability
DRAM Solutions
Product Line
Performance
ATP Technologies
• Advanced wear leveling algorithm
• Bad block management
• AutoRefresh technology
• PowerProtector
• S.M.A.R.T support
10,000 minimum
Number of Insertions:
Dimensions: L x W x H (mm)
36.4 x 42.8 x 3.6
* Under highest Sequential write value. May vary by density, configuration and applications.
Technologies &
Add-On Services*
Product Line
Premium
●
●
●
●
●
●
●
∆
∆
Superior
●
●
●
●
●
●
∆
∆
∆
* Please refer to pages 10-12.
Δ: Customization option available on a project basis.
ATP Product Catalog 2018
27
M.2
Key Features
• Global wear leveling
• TRIM function support
• Static Data Refresh and Idle Clean F/W algorithm
• Firmware live update
• PowerProtector
M.2
Product Name
2242 D2-B-M
2260 D2-B-M
Product Line
Premium
Naming
A800p
A600i
A600c
A800p
A700p
A600i
A600c
Flash Type
SLC
iTemp MLC
MLC
SLC
iTemp SLC mode
iTemp MLC
MLC
Density
8 GB to 64 GB
32 GB to 256 GB*
530
520
530
550
550
400
150
430
440
450
76,000
70,000
76,000
73,000
70,000
Performance
Sequential Read
up to (MB/s)
Sequential Write
up to (MB/s)
Random Read
IOPS up to
Superior
Premium
Interface
-40°C to 85°C
-40°C to 85°C
0°C to 70°C
-40°C to 85°C
0°C to 70°C
5,333 TB
267 TB
320 TB
10,677 TB
8,533 TB
1,067 TB
1,280 TB
DWPD** (max.)
77.9
2.9
3.5
78.0
46.8
11.7
14.0
-40°C to 85°C
>2,000,000 hours
MTBF @ 25°C
42.0 x 22.0 x 3.5
60.0 x 22.0 x 3.5
M.2
Product Name
2280 D2-B-M
Product Line
Premium
Superior
Naming
A700p
A600i
A600c
Flash Type
iTemp SLC mode
iTemp MLC
MLC
Density
64 GB to 512 GB
128 GB to 1 TB
550
550
440
450
73,000
70,000
Sequential Read
up to (MB/s)
Sequential Write
up to (MB/s)
Random Read
IOPS up to
Interface
SATA III 6 Gb/s
Operating Temperature
Reliability
64 GB to 512 GB
TBW** (max.)
Dimensions: L x W x H (mm)
Performance
32 GB to 128 GB 64 GB to 512 GB
SATA III 6 Gb/s
Operating Temperature
Reliability
Superior
-40°C to 85°C
-40°C to 85°C
0°C to 70°C
TBW** (max.)
17,066 TB
2,133 TB
2,560 TB
DWPD** (max.)
46.8
2.9
3.5
>2,000,000 hours
MTBF @ 25°C
Dimensions: L x W x H (mm)
80.0 x 22.0 x 3.5
* By project support.
** Under highest Sequential write value. May vary by density, configuration and applications.
Technologies &
Add-On Services*
Product Line
Premium
●
●
●
●
●
●
●
∆
∆
Superior
●
●
●
●
●
●
∆
∆
∆
* Please refer to pages 10-12.
28
Δ: Customization option available on a project basis.
ATP Product Catalog 2018
2.5” SSDs
Key Features
Why ATP
About ATP
• Global wear leveling
• TRIM function support
• Static Data Refresh and Idle Clean F/W algorithm
• Firmware live update
• PowerProtector
• Write protect disabled/enabled
• NSA-compliant Secure Erase
Velocity 2.5" SSD
SII Pro
Product Line
XE
MV
Premium
Naming
Superior
A800p
A700p
A600i
A600c
Flash Type
SLC
iTemp SLC mode
iTemp MLC
MLC
Density
8 GB to 256 GB
64 GB to 512 GB
64 GB to 1 TB
64 GB to 1 TB
520
540
530
530
420
450
420
420
76,000
73,000
70,000
70,000
-40°C to 85°C
0°C to 70°C
2,133 TB
2,560 TB
5.8
7.0
Interface
SATA III 6 Gb/s
Operating Temperature
Reliability
-40°C to 85°C
TBW* (max.)
21,333 TB
17,066 TB
DWPD* (max.)
77.9
46.8
2018
Product Highlights
Performance
Sequential Read
up to (MB/s)
Sequential Write
up to (MB/s)
Random Read
IOPS up to
Market Focus
& Applications
Product Name
>2,000,000 hours
MTBF @ 25°C
Dimensions: L x W x H (mm)
100.0 x 69.9 x 9.2
ATP Technologies
* Under highest Sequential write value. May vary by density, configuration and applications.
Technologies &
Add-On Services*
Premium
●
●
●
●
●
●
●
∆
∆
Superior
●
●
●
●
●
●
∆
∆
∆
Δ: Customization option available on a project basis.
DRAM Solutions
* Please refer to pages 10-12.
Flash Solutions
Product Line
ATP Product Catalog 2018
29
mSATA
Key Features
• Global wear leveling
• TRIM function support
• AutoRefresh and Idle Clean F/W algorithm
• Firmware live update
• PowerProtector
Product Name
mSATA
Product Line
Premium
Naming
Superior
A800p
A700p
Value
A600i
A600c
A600v
Flash Type
SLC
iTemp SLC mode
iTemp MLC
MLC
MLC
Density
8 GB to 128 GB
64 GB to 256 GB
16 GB to 512 GB
16 GB to 512 GB
32 GB to 128 GB
530
550
550
550
450
430
440
450
450
400
76,000
73,700
70,000
70,000
60,000
-40°C to 85°C
Performance
Sequential Read
up to (MB/s)
Sequential Write
up to (MB/s)
Random Read
IOPS up to
Interface
SATA III 6 Gb/s
Operating Temperature
Reliability
-40°C to 85°C
0°C to 70°C
0°C to 70°C
TBW* (max.)
10,667 TB
8,533 TB
1,067 TB
1,280 TB
160 TB
DWPD* (max.)
77.9
46.8
2.9
3.5
>5,000,000 hours
MTBF @ 25°C
3.5
>2,000,000 hours
Dimensions: L x W x H (mm)
>2,000,000 hours
50.8 x 29.85 x 3.4
* Under highest Sequential write value. May vary by density, configuration and applications.
Technologies &
Add-On Services*
Product Line
Premium
●
●
●
●
●
●
●
∆
∆
Superior
●
●
●
●
●
●
∆
∆
∆
Value
●
●
●
●
* Please refer to pages 10-12.
Δ: Customization option available on a project basis.
SlimSATA
Key Features
• Global wear leveling
• TRIM function support
• AutoRefresh and Idle Clean F/W algorithm
• Firmware live update
• PowerProtector
Product Name
SlimSATA
Product Line
Premium
Naming
Superior
A800p
A700p
A600i
A600c
Flash Type
SLC
iTemp SLC mode
iTemp MLC
MLC
Density
8 GB to 128 GB
64 GB to 256 GB
16 GB to 512 GB
16 GB to 512 GB
530
550
550
550
430
440
450
450
76,000
73,700
70,000
70,000
Performance
Sequential Read
up to (MB/s)
Sequential Write
up to (MB/s)
Random Read
IOPS up to
Interface
SATA III 6 Gb/s
Operating Temperature
-40°C to 85°C
10,667 TB
TBW* (max.)
Reliability
-40°C to 85°C
0°C to 70°C
8,533 TB
1,067 TB
1,280 TB
2.9
DWPD* (max.)
77.9
46.8
MTBF @ 25°C
>5,000,000 hours
>2,000,000 hours
Dimensions: L x W x H (mm)
3.5
>2,000,000 hours
54.0 x 39.0 x 4.0
* Under highest Sequential write value. May vary by density, configuration and applications.
Technologies &
Add-On Services*
Product Line
Premium
●
●
●
●
●
●
●
∆
∆
Superior
●
●
●
●
●
●
∆
∆
∆
* Please refer to pages 10-12.
30
Δ: Customization option available on a project basis.
ATP Product Catalog 2018
eUSB
Key Features
Product Name
eUSB
Product Line
Premium
Superior
Naming
B800p
B600c
Flash Type
SLC
MLC
Density
1 GB to 32 GB
8 GB to 32 GB
Sequential Read up to (MB/s)
30
25
Sequential Write up to (MB/s)
25
Compatible with USB 2.0 ( 480 Mbps)
Operating Temperature
TBW* (max.)
Reliability
Why ATP
19
Interface
-40°C to 85°C
0°C to 70°C
1,280 TB
38.4 TB
DWPD* (max.)
37.4
1.7
MTBF @ 25°C
>5,000,000 hours
>2,000,000 hours
10,000 minimum
Number of Insertions:
Dimensions: L x W x H (mm)
36.9 x 26.6 x 9.5
Connector Pin Pitch**
2.54 mm
Market Focus
& Applications
Performance
About ATP
• Global wear leveling
• PowerProtector
* Under highest Sequential write value. May vary by density, configuration and applications.
** 2.00 mm connector pin pitch by project support.
Product Line
Premium
●
●
●
∆
Superior
●
●
∆
∆
* Please refer to pages 10-12.
2018
Product Highlights
Technologies &
Add-On Services*
Δ: Customization option available on a project basis.
NANODURA
Key Features
NANODURA
Product Line
Premium
Superior
Naming
B800p
B600c
SLC
MLC
Density
512 MB to 8 GB
8 GB to 16 GB
Sequential Read up to (MB/s)
21
25
Sequential Write up to (MB/s)
16
18
Interface
Compatible with USB 2.0 (480 Mbps)
Operating Temperature
TBW* (max.)
Reliability
-40°C to 85°C
0°C to 70°C
192 TB
19.2 TB
DWPD* (max.)
13.5
1.7
MTBF @ 25°C
>5,000,000 hours
>2,000,000 hours
Flash Solutions
Performance
Flash Type
DRAM Solutions
Product Name
ATP Technologies
• Global wear leveling
• Bad block management algorithm
• High reliability
• Hot swap supported
10,000 minimum
Number of Insertions:
Dimensions: L x W x H (mm)
34.0 x 12.2 x 4.6
* Under highest Sequential write value. May vary by density, configuration and applications.
Technologies &
Add-On Services*
Product Line
Premium
●
●
●
Superior
●
∆
●
* Please refer to pages 10-12.
Δ: Customization option available on a project basis.
ATP Product Catalog 2018
31
Complete Flash Products
Product
Dimensions
(L x W x H mm)
Flash
Type
Densities
Operating
Temp.
Data Transfer
Rate (max.)
TBW**
(max.)
SLC
8 GB~256 GB
-40°C~ 85°C
Read: 520 MB/s
Write: 420 MB/s
21,333 TB
iTemp
64 GB~512 GB
SLC mode
-40°C~ 85°C
Read: 540 MB/s
Write: 450 MB/s
17,066 TB
SATA
Velocity
SII Pro
Velocity
XE
2.5" SSD
100.0 x 69.9 x 9.2
iTemp
MLC
Velocity
MV
-40°C~ 85°C
0°C~ 70°C
iTemp
64 GB~512 GB
SLC mode
2280
D2-B-M
80.0 x 22.0 x 3.5
iTemp
MLC
SLC
M.2
60.0 x 22.0 x 3.5
0°C~ 70°C
32 GB~128 GB
iTemp
SLC mode
iTemp
MLC
-40°C~ 85°C
64 GB~512 GB
MLC
SLC
2242
D2-B-M
42.0 x 22.0 x 3.5
iTemp
MLC
0°C~ 70°C
8 GB~64 GB
-40°C~ 85°C
32 GB~256 GB*
MLC
SLC
mSATA
50.8 x 29.85 x 3.4
0°C~ 70°C
8 GB~128 GB
iTemp
64 GB~256 GB
SLC mode
iTemp
MLC
SlimSATA
54.0 x 39.0 x 4.0
0°C~ 70°C
8 GB~128 GB
iTemp
64 GB~256 GB
SLC mode
iTemp
MLC
-40°C~ 85°C
16 GB~512 GB
MLC
SLC
-40°C~ 85°C
16 GB~512 GB
MLC
SLC
-40°C~ 85°C
128 GB~1 TB
MLC
2260
D2-B-M
Read: 530 MB/s
Write: 420 MB/s
64 GB~1 TB
MLC
2,133 TB
0°C~ 70°C
2,560 TB
Read: 550 MB/s
Write: 440 MB/s
Read: 550 MB/s
Write: 450 MB/s
2,133 TB
2,560 TB
Read: 530 MB/s
Write: 430 MB/s
10,667 TB
Read: 550 MB/s
Write: 440 MB/s
8,533 TB
Read: 550 MB/s
Write: 450 MB/s
Read: 530 MB/s
Write: 400 MB/s
Read: 520 MB/s
Write: 150 MB/s
1,067 TB
1,280 TB
5,333 TB
267 TB
320 TB
Read: 530 MB/s
Write: 430 MB/s
10,667 TB
Read: 550 MB/s
Write: 440 MB/s
8,533 TB
Read: 550 MB/s
Write: 450 MB/s
1,067 TB
1,280 TB
Read: 530MB/s
Write: 430 MB/s
10,667 TB
Read: 550 MB/s
Write: 440 MB/s
8,533 TB
Read: 550 MB/s
Write: 450 MB/s
Read: 500 MB/s
Write: 300 MB/s
8 GB~32 GB
17,066 TB
1,067 TB
1,280 TB
2,667 TB
-40°C~ 85°C
CFast
36.4 x 42.8 x 3.6
iTemp
MLC
267 TB
Read: 445 MB/s
Write: 160 MB/s
16 GB~128 GB
MLC
32
ATP Product Catalog 2018
0°C~ 70°C
320 TB
Power Failure
Secure
Life
Protection /
Erase
Monitor
PowerProtector (S/W)*** (S/W)***
Dimensions
Flash Type
(L x W x H mm)
Densities
Operating
Temp.
Data Transfer
Rate (max.)
Life
Failure Secure
TBW** Power
Protection /
(max.) PowerProtector Erase Monitor
(S/W)*** (S/W)***
About ATP
Product
NVMe
M.2
-40°C~ 85°C
Read: 2,540 MB/s
Write: 1,100 MB/s
128 GB~1 TB
80.0 x 22.0 x 3.5
MLC
1,280 TB
0°C~ 70°C
1,536 TB
Why ATP
iTemp
MLC
CompactFlash
36.4 x 42.8 x 3.3
SLC
512 MB~32 GB
SLC mode
4 GB~16 GB
-40°C~ 85°C
Read: 61 MB/s
Write: 55 MB/s
1,280 TB
Read: 110 MB/s
Write: 80 MB/s
128 TB
-
Read: 108 MB/s
Write: 46 MB/s
38 TB
-
Market Focus
& Applications
PATA/IDE
0°C~ 70°C
MLC
8 GB~32 GB
SLC
1 GB~32 GB
-40°C~ 85°C
Read: 30 MB/s
Write: 25 MB/s
1,280 TB
-
-
MLC
8 GB~32 GB
0°C~ 70°C
Read: 25 MB/s
Write: 19 MB/s
38.4 TB
-
-
SLC
512 MB~8 GB
-40°C~ 85°C
Read: 21 MB/s
Write: 16 MB/s
192 TB
-
-
-
MLC
8 GB~16 GB
0°C~ 70°C
Read: 25 MB/s
Write: 18 MB/s
19.2 TB
-
-
-
SLC
512 MB~8 GB
-40°C~ 85°C
Read: 69 MB/s
Write: 39 MB/s
192 TB
Read: 96 MB/s
Write: 80 MB/s
512 TB
eUSB
NANODURA
36. 9 x 26.6 x 9.5
34 x 12.2 x 4.6
2018
Product Highlights
USB Drive
microSD/
microSDHC/
microSDXC
15.0 x 11.0 x 1.0
iTemp
SLC mode
4 GB~64 GB
-40°C~ 85°C
MLC
8 GB~256 GB*
-25°C~ 85°C
iTemp
MLC
8 GB~64 GB
-40°C~ 85°C
SLC
512 MB~8 GB
-40°C~ 85°C
Read: 82 MB/s
Write: 39 MB/s
192 TB
SLC mode
4 GB~64 GB
-25°C~ 85°C
Read: 96 MB/s
Write: 85 MB/s
512 TB
iTemp
SLC mode
4 GB~16 GB
-40°C~ 85°C
Read: 88 MB/s
Write: 78 MB/s
128 TB
MLC
8 GB~128 GB
-25°C~ 85°C
Read: 96 MB/s
Write: 81 MB/s
153 TB
iTemp
MLC
8 GB~32 GB
-40°C~ 85°C
Read: 79 MB/s
Write: 75 MB/s
38 TB
Read: 96 MB/s
Write: 78 MB/s
307 TB
DRAM Solutions
32.0 x 24.0 x 2.1
77 TB
Flash Solutions
-25°C~ 85°C
SLC mode
SD/SDHC/SDXC
ATP Technologies
SD
* By project support.
** Under highest Sequential write value. May vary by density, configuration and applications.
*** ATP software support for demo use only.
ATP Product Catalog 2018
33
34
50.8 mm
42.0 mm
60.0 mm
22.0 mm
29.85 mm
M.2 2280
M.2 2260
M.2 2242
mSATA
11.0 mm
36.4 mm
22.0 mm
36.4 mm
M.2 NVMe
36.9 mm
39.0 mm
2.5” SATA SSD
22.0 mm
32.0 mm
22.0 mm
34.0 mm
69.9 mm
80.0 mm
80.0 mm
100.0 mm
Product Dimensions (Size) Comparison
54.0 mm
26.6 mm
42.8 mm
42.8 mm
12.2 mm
24.0 mm
15.0 mm
SlimSATA
eUSB
CF
CFast
USB Drive
SD
microSD
ATP Product Catalog 2018
Follow us on
ATP Website
Digital version of this product guide can be downloaded via ATP Electronics website
www.atpinc.com
ATP Product Catalog 2018
35
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