HUAWEI ES3000 V2
HUAWEI ES3000 series PCIe SSD cards solve storage
IO bottlenecks and unleash servers’ potential. It
significantly accelerates business applications, while
reduce your TCO.
Fastest IO Performance
High Reliability
Application Optimization
PRODUCT SPECIFICATIONS
ES3000 V2 Model
600
800
1200
1600
1200H
2400H
3200H
600 GB
800 GB
1,200 GB
1,600 GB
1,200 GB
2,400 GB
3,200 GB
1.55
1.55
1.55
1.55
3.1
3.1
3.1
390,000
390,000
395,000
395,000
770,000
770,000
770,000
Min. Read Latency
31 µs
31 µs
31 µs
31 µs
31 µs
31 µs
31 µs
Max. Write BW (GB/s)
0.73
0.9
1
1.1
1.46
2.05
2.2
Max. Write IOPS (4KB)
180,000
225,000
240,000
270,000
360,000
480,000
540,000
Stable Write IOPS (4KB)
75,000
90,000
110,000
115,000
150,000
220,000
230,000
9 µs
9 µs
9 µs
9 µs
9 µs
9 µs
9 µs
Stable Mix IOPS
(R/W:7/3, 4KB)
175,000
200,000
260,000
295,000
350,000
520,000
590,000
Power Consumption
12~21 W
12~25 W
12~23 W
12~25 W
25~42 W
25~50 W
25~55 W
200 g
225 g
200 g
225 g
375 g
375 g
400 g
Usable Capacity
Max. Read BW (GB/s)
Stable Read IOPS (4KB)
Min. Write Latency
Weight
Form Factor
Low Profile
NAND Type
Full-Height, Half-Length
19/20 nm MLC (Multi Level Cell)
Bus Interface
PCI-Express 2.0 x8
Endurance
3 DWPD, 5 Years
Operating Systems
Microsoft Windows: Windows Server 2012 R2, Windows Server 2012, Windows Server 2008 R2, Windows
Server 2008, Windows 7/8
Linux:
RHEL 5/6/7, SLES 11, CentOS 5/6/7, Ubuntu 12/13
Hypervisors:
VMware ESXi 5.0/5.1/5.5, Microsoft Windows Hyper-V, Huawei FusionSphere
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ES3000 V2
ENVIRONMENTAL SPECIFICATIONS
Min.
Max.
Operational Temperature
Non-operational Temperature
0 °C
55 °C
- 40 °C
70 °C
300
/
Air Flow (LFM)
Operational Humidity (%)
5
85
Altitude (m)
/
3,000
CERTIFICATION
US/Canada
FCC CFR47 Part 15 Subpart B:2012 Class A
ICES-003 Issue 5:2012 Class A
CAN/CSA-CISPR 22-10
Europe
EN 55022:2010
EN 55024:2010
CISPR 22:2008
CISPR 24:2010
ETSI EN 300 386 V1.6.1:2012
ETSI ES 201 468 V1.4.1:2014
IEC 61000-6-2:2005/EN 61000-6-2:2005
IEC 61000-6-4:2006+A1:2010/EN 61000-6-4:2007+A1:2011
IEC 60950-1:2005 (2nd Edition) + A1:2009 and/or
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011+A2:2013
Japan
VCCI V-3:2014
Australia/New Zealand
AS/NZS CISPR 22:2009+A1:2010
RoHS
2002/95/EC, 2011/65/EU, EN50581:2012
REACH
EC NO. 1907/2006
WEEE
2002/96/EC, 2012/19/EU
Note: Certified by Sep 2014.
Copyright © Huawei Technologies Co., Ltd. 2014. All rights reserved.
General Disclaimer
The information in this document may contain predictive statements including,
without limitation, statements regarding the future financial and operating results,
future product portfolio, new technology, etc. There are a number of factors
that could cause actual results and developments to differ materially from those
expressed or implied in the predictive statements. Therefore, such information
is provided for reference purpose only and constitutes neither an offer nor an
acceptance. Huawei may change the information at any time without notice.
HUAWEI TECHNOLOGIES CO., LTD.
Huawei Industrial Base
Bantian Longgang
Shenzhen 518129, P.R. China
Tel: +86-755-28780808
Version No.: M3-035260-20140911-C-1.0
www.huawei.com
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