Manual
COMe-mBT10
Kontron
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50674 Köln
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E-Mail:
Internet:
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E-Mail:
Internet:
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www.fortecag.de
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+49 (0) 221 272 273-10
west@fortecag.de
www.fortecag.de
FORTEC Elektronik AG
Büro Wien
Nuschinggasse 12
A-1230 Wien
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(Tochter der FORTEC):
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CH-5436 Würenlos
Telefon:
Telefax:
E-Mail:
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Telefax:
E-Mail:
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office@fortec.at
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+41 (0) 44 7446111
+41 (0) 44 7446161
info@altrac.ch
www.altrac.ch
The information contained in this document has been carefully researched and is, to the best
of our knowledge, accurate. However, we assume no liability for any product failures or
damages, immediate or consequential, resulting from the use of the information provided
herein. Our products are not intended for use in systems in which failures of product could
result in personal injury. All trademarks mentioned herein are property of their respective
owners. All specifications are subject to change without notice.
COMe-mBT10
Document Revision 120 valid for Rev. 02.00 and higher
www.kontron.com
» Table of Contents «
1
User Information..................................................................................5
1.1
About This Document.................................................................................................................... 5
1.2
Copyright Notice.......................................................................................................................... 5
1.3
Trademarks................................................................................................................................. 5
1.4
Standards................................................................................................................................... 5
1.5
Warranty.................................................................................................................................... 6
1.6
Technical Support......................................................................................................................... 6
2
Introduction........................................................................................7
2.1
Product Description...................................................................................................................... 7
2.2
Naming clarification..................................................................................................................... 7
2.3
Understanding COM Express® Functionality....................................................................................... 8
2.4
COM Express® Documentation......................................................................................................... 9
2.5
COM Express® Benefits.................................................................................................................. 9
3
Product Specification..........................................................................10
3.1
Module definition....................................................................................................................... 10
3.2
Functional Specification............................................................................................................... 12
3.3
Block Diagram............................................................................................................................ 16
3.4
Accessories............................................................................................................................... 16
3.5
3.5.1
3.5.2
3.5.3
3.5.4
3.5.5
3.5.6
3.6
Electrical Specification................................................................................................................ 17
Supply Voltage........................................................................................................................... 17
Power Supply Rise Time................................................................................................................ 17
Supply Voltage Ripple.................................................................................................................. 17
Power Consumption..................................................................................................................... 17
ATX Mode.................................................................................................................................. 18
Single Supply Mode..................................................................................................................... 18
Power Control............................................................................................................................ 19
3.7
3.7.1
3.7.2
3.8
Environmental Specification......................................................................................................... 20
Temperature Specification............................................................................................................ 20
Humidity................................................................................................................................... 20
Standards and Certifications......................................................................................................... 21
3.9
MTBF........................................................................................................................................ 23
3.10
Mechanical Specification.............................................................................................................. 24
3.11
Module Dimensions..................................................................................................................... 25
3.12
Onboard Fan Connector................................................................................................................ 25
3.13
Thermal Management, Heatspreader and Cooling Solutions.................................................................26
4
Features and Interfaces.......................................................................27
4.1
Onboard eMMC Flash.................................................................................................................... 27
4.2
Secure Digital Card...................................................................................................................... 27
4.3
S5 Eco Mode.............................................................................................................................. 28
www.kontron.com
COMe-mBT10 /
4.4
LPC.......................................................................................................................................... 29
4.5
Serial Peripheral Interface (SPI).................................................................................................... 30
4.6
SPI boot.................................................................................................................................... 30
4.7
M.A.R.S.................................................................................................................................... 32
4.8
UART........................................................................................................................................ 33
4.9
Fast I2C.................................................................................................................................... 34
4.10
Dual Staged Watchdog Timer......................................................................................................... 35
4.11
Speedstep Technology................................................................................................................. 36
4.12
C-States.................................................................................................................................... 37
4.13
Graphics Features....................................................................................................................... 38
4.14
ACPI Suspend Modes and Resume Events..........................................................................................39
4.15
USB......................................................................................................................................... 40
5
System Resources................................................................................41
5.1
Interrupt Request (IRQ) Lines........................................................................................................ 41
5.2
Memory Area.............................................................................................................................. 41
5.3
I/O Address Map......................................................................................................................... 41
5.4
Peripheral Component Interconnect (PCI) Devices.............................................................................42
5.5
LPC addresses............................................................................................................................ 43
5.6
I2C Bus..................................................................................................................................... 43
5.7
System Management (SM) Bus....................................................................................................... 43
6
Pinout List.........................................................................................44
6.1
General Signal Description........................................................................................................... 44
6.2
Connector X1A Row A................................................................................................................... 45
6.3
Connector X1A Row B................................................................................................................... 47
7
BIOS Operation...................................................................................49
7.1
Determining the BIOS Version....................................................................................................... 49
7.2
BIOS Update.............................................................................................................................. 49
7.3
POST Codes................................................................................................................................ 49
7.4
Setup Guide............................................................................................................................... 49
7.5
7.5.1
7.5.2
7.5.3
7.5.4
7.5.5
BIOS Setup................................................................................................................................ 51
Main......................................................................................................................................... 51
Advanced.................................................................................................................................. 55
Security.................................................................................................................................... 77
Boot........................................................................................................................................ 78
Exit.......................................................................................................................................... 79
4
COMe-mBT10 / User Information
1
1.1
User Information
About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2
Copyright Notice
Copyright © 2003-2015 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3
Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4
Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
5
COMe-mBT10 / User Information
1.5
Warranty
For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6
Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
6
COMe-mBT10 / Introduction
2
2.1
Introduction
Product Description
At the SPS/IPC/Drives show, Kontron unveiled the new credit card sized Computer-on-Modules based on the world’s
leading form factor standard COM Express®. The performance range of the new COM Express® mini modules is highly
scalable and covers the entire embedded range of Intel® Atom™ Processor E3800 and Intel® Celeron® Processor N2900
and J1900 Product Families, formerly codenamed ‘Bay Trail’. The most impressive feature of the new Kontron COMe-mBT10
Computer-on-Module family is the three times higher graphics performance compared to previous Intel® Atom™
processors coupled with unbeatable TDP (thermal design power) values. And although all the Intel® Atom™ processor
E3800 based modules are designed for the extended temperature range from -40 to +85°C, they offer an extensive set of
features, including PCIe extension options, new security functions, and optional ECC memory . The rich, powerful and
flexible x86 featureset in combination with the low-power credit card-sized footprint make the new COM Express® mini
Computer-on-Modules a perfect fit for an extremely wide range of new, graphic-rich multi-touch applications.
Users in all markets will benefit from double the performance, significantly improved performance-per-watt ratios and
the long-term availability which the rugged new x86 modules offer. The range of applications includes everything from
slim but graphics-rich and open, programmable industrial tablets and handheld PCs to in-vehicle systems and stationary
HMIs and controllers. Targeted industries are POS/POI, infotainment, digital signage, gaming, and medical technology as
well as industrial automation, and machine and plant engineering. With the availability of the new COM Express® mini
Computer-on-Modules, developers can directly make use of the extensive x86 ecosystem and the world’s leading COM
Express® form factor standard.
The new Kontron COMe-mBT10 COM Express® mini Computer-on-Module family (55 mm x 84 mm) with Type 10 pin-out is
equipped with Intel® Atom™ processor E3800 or Intel® Celeron® processors. Several module variants are included in the
range, offering wide scalability from low-power single-core Intel® Atom™ (1.46 GHz / 5 W TDP) processor performance for
energy-sensitive applications through to genuine quad-core Intel® Atom™ (4x 1.91 GHz/ 10 W TDP) and Intel® Celeron®
(4x 2.42 GHz / 10 W TDP ) processor performance in high-end applications ). The new Intel® Gen 7 HD graphics integrated
on the SoC offer up to three times more graphical power, including DirectX 11, OpenGL 3.1, and OpenCL 1.1 support for two
independent displays with 1x DP++ (DP/HDMI/DVI) up to 2560×1600@60Hz and 1x Single Channel LVDS 18/24bit with
DPtoLVDS up to 1920×1200 (optional eDP). New video HD technology additionally enables brilliant video reproduction
and stereoscopic 3D viewing for an immersive user experience. The modules come with options for data memory: two SATA
II 300 Mbps interfaces or versions with additional eMMC memory (up to 64 GB) . In addition to having two serial ports,
they include a Super Fast USB 3.0 interface, up to eight USB 2.0, Gigabit Ethernet, plus three Gen 2 PCI-Express x1 lanes
for customer specific expansions.
2.2
Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.
7
COMe-mBT10 / Introduction
2.3
Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature
Pin-Out Type 1
Pin-Out Type 10
Pin-Out Type 2
Pin-Out Type 6
HD Audio
1x
1x
1x
1x
Gbit Ethernet
1x
1x
1x
1x
Serial ATA
4x
4x
4x
4x
Parallel ATA
-
-
1x
-
PCI
-
-
1x
-
PCI Express x1
6x
6x
6x
8x
1x
PCI Express x16 (PEG)
-
-
1x
USB Client
1x
1x
-
-
USB 2.0
8x
8x
8x
8x
USB 3.0
-
2x
-
4x
VGA
1x
-
1x
1x
LVDS
Dual Channel
Single Channel
Dual Channel
Dual Channel
1x optional
1x
3x shared with PEG
3x
LPC
1x
1x
1x
1x
External SMB
1x
1x
1x
1x
External I2C
1x
1x
1x
1x
GPIO
8x
8x
8x
8x
SDIO shared w/GPIO
1x optional
1x optional
-
1x optional
UART (2-wire COM)
-
2x
-
2x
FAN PWM out
-
1x
-
1x
DP++ (SDVO/DP/HDMI/DVI)
8
COMe-mBT10 / Introduction
2.4
COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-mBT10. Additional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5
COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
9
COMe-mBT10 / Product Specification
3
Product Specification
3.1
Module definition
The COM Express® mini sized Computer-on-Module COMe-mBT10 (MVV1) follows pin-out Type 10 and is compatible to
PICMG specification COM.0 Rev 2.1. The COMe-mBT10, based on Intel's Bay Trail platform, is available in different variants
to cover the demand of different performance, price and power:
Industrial temperature grade modules (E2: -40°C to +85°C operating)
Part Number
Product Name
Processor
Memory
ECC
TPM
eMMC
34006-4016-19-4
COMe-mBTi10 E3845 4E/16GB
BayTrail-I Intel® Atom E3845
4GB
Yes
Yes
16GB MLC Intel® i210IT
Ethernet
34006-2000-19-4
COMe-mBTi10 E3845 2GB
BayTrail-I Intel® Atom E3845
2GB
-
-
SDIO
USB 2.0
shared w/GPIO
7x
-
Intel® i210IT
shared w/GPIO
7x
7x
34006-2000-17-2
COMe-mBTi10 E3827 2GB
BayTrail-I Intel® Atom E3827
2GB
-
-
-
Intel® i210IT
shared w/GPIO
34006-1040-17-2
COMe-mBTi10 E3827 1E/4S
BayTrail-I Intel® Atom E3827
1GB
Yes
-
4GB SLC
Intel® i210IT
shared w/GPIO
7x
34006-2000-15-2
COMe-mBTi10 E3826 2GB
BayTrail-I Intel® Atom E3826
2GB
-
-
-
Intel® i210IT
shared w/GPIO
7x
34006-2080-13-2
COMe-mBTi10 E3825 2GB/8S
BayTrail-I Intel® Atom E3825
2GB
-
-
8GB SLC
Intel® i210IT
shared w/GPIO
7x
34006-2000-13-2
COMe-mBTi10 E3825 2GB
BayTrail-I Intel® Atom E3825
2GB
-
-
-
Intel® i210IT
shared w/GPIO
7x
34006-1020-15-1
COMe-mBTi10 E3815 1E/2S
BayTrail-I Intel® Atom E3815
1GB
Yes
-
2GB SLC
Intel® i210IT
shared w/GPIO
7x
ECC
TPM
Ethernet
SDIO
Commercial temperature grade modules (0°C to +60°C operating)
Part Number
Product Name
Processor
34007-4000-20-4
COMe-mBTc10 J1900 4GB
BayTrail-D Intel® Celeron J1900
4GB
-
-
-
Intel® i211AT
-
4x
34007-2000-18-4
COMe-mBTc10 N2930 2GB
BayTrail-M Intel® Celeron N2930
2GB
-
-
-
Intel® i211AT
-
4x
34007-2080-16-2
COMe-mBTc10 N2807 2GB
BayTrail-M Intel® Celeron N2807
2GB
-
-
8GB SLC
Intel® i211AT
-
4x
34007-2000-16-2
COMe-mBTc10 N2807 2GB
BayTrail-M Intel® Celeron N2807
2GB
-
-
-
Intel® i211AT
-
4x
34007-1020-15-1
COMe-mBTc10 E3815 1GB/2S
BayTrail-I Intel® Atom E3815
1GB
-
-
2GB SLC
Intel® i211AT
-
4x
34007-1000-15-1
COMe-mBTc10 E3815 1GB
BayTrail-I Intel® Atom E3815
1GB
-
-
-
Intel® i211AT
-
4x
10
Memory
eMMC
USB 2.0
COMe-mBT10 / Product Specification
Memory configurations: (3400x-MMFF-xx-x)
» MM = 10: 1024MB DDR3L Memory (8x1Gbit / 128Mx8)
» MM = 20: 2048MB DDR3L Memory (8x2Gbit / 256Mx8)
» MM = 40: 4096MB DDR3L Memory (8x4Gbit / 512Mx8)
Onboard Flash configurations
» FF = 00: without eMMC Flash
» FF = 20: 2GB onboard eMMC Flash
» FF = 40: 4GB onboard eMMC Flash
» FF = 80: 8GB onboard eMMC Flash
» FF = 16: 16GB onboard eMMC Flash
» FF = 32: 32GB onboard eMMC Flash
» FF = 64: 64GB onboard eMMC Flash
Optional hardware features for E3800 Series CPU
» TPM
» ECC memory
» eMMC Flash
» eDP on COMe
» USB client PHY on USB7
» General Purpose SPI instead of Boot SPI
Optional hardware features for Celeron Series CPU
» TPM
» eMMC Flash
» eDP on COMe
» USB Hub for USB #4-6 support on COMe
» USB client PHY on USB7
» General Purpose SPI instead of Boot SPI
Optional BIOS/Software features:
» TXE Firmware with Encryption support (AES, PAVP …)
Optional hardware and BIOS features are available project based only for variants not listed
above. Please contact your local sales for customized articles.
11
COMe-mBT10 / Product Specification
3.2
Functional Specification
Processor
The 32nm Intel® Atom™ E3800 / Celeron® (BayTrail-I/M/D) CPU family supports:
» Intel® 64
» Enhanced Intel SpeedStep® Technology
» Thermal Monitoring Technologies
» Execute Disable Bit
» Virtualization Technology VT-x
» 2 Display Pipes for dual independent displays
CPU specifications
Intel®
Atom™
Atom™
Atom™
Atom™
Atom™
Atom™
Celeron®
Celeron®
Celeron®
-
E3845
E3827
E3826
E3825
E3815
E3805
J1900
N2930
N2807
Stepping
D0
D0
D0
D0
D0
D0
C0
C0
# of Cores
4
2
2
2
1
2
4
4
2
# of Threads
4
2
2
2
1
2
4
4
2
CPU Nominal
frequency
1.91GHz
1.75GHz
1.46GHz
1.33GHz
1.46GHz
1.33GHz
2.00GHz
1.83GHz
1.58GHz
CPU Burst
frequency
-
-
-
-
-
-
2.42GHz
2.16GHz
2.16GHz
LFM/LPM
Frequency
533MHz
533MHz
533MHz
533MHz
533MHz
533MHz
1333MHz
500MHz
533MHz
Tjunction
110°C
110°C
110°C
110°C
110°C
110°C
105°C
105°C
105°C
10W
8W
7W
6W
5W
3W
10W
7.5W
4.3W
Thermal
Design Power
(TDP)
SDP
C-States
C0
-
-
-
-
-
-
-
4.5W
2.5W
C1/C1E/C6
C1/C1E/C6
C1/C1E/C6
C1/C1E/C6
C1/C1E/C6
C1/C1E/C6
C1/C1E/C6
C1/C1E/C6/C7
C1/C1E/C6/C7
Smart Cache
2x1MB
2x512kB
2x512kB
2x512kB
512kB
512kB
2x1MB
2x1MB
2x512kB
Memory Type
DDR3L-1333
DDR3L-1333
DDR3L-1066
DDR3L-1066
DDR3L-1066
DDR3L-1066
DDR3L-1333
DDR3L-1333
DDR3L-1333
Max Memory
Size on Module
4GB
4GB
4GB
4GB
4GB
4GB
4GB
4GB
4GB
ECC
Memory(optio
nal)
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Graphics Model
Intel HD®
Intel HD®
Intel HD®
Intel HD®
Intel HD®
-
Intel HD®
Intel HD®
Intel HD®
GFX Base
Frequency
542MHz
542MHz
533MHz
533MHz
400MHz
-
688MHz
313MHz
313MHz
GFX Max
Dynamic Frequ.
792MHz
792MHz
667MHz
-
-
-
854MHz
854MHz
750MHz
GFX
Technology
GT1 4EU
GT1 4EU
GT1 4EU
GT1 4EU
GT1 4EU
-
GT1 4EU
GT1 4EU
GT1 4EU
AES-NI
(optional)
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Memory
Sockets
Memory Type
memory down
DDR3L-1066/1333
Maximum Size
1 - 4GB (ECC optional)
Technology
Single Channel (64bit)
12
COMe-mBT10 / Product Specification
Graphics Core
The integrated Intel® HD Graphics (Gen 7) supports:
Graphics Core Render Clock
Execution Units / Pixel Pipelines
Max Graphics Memory
GFX Memory Bandwidth (GB/s)
GFX Memory Technology
API (DirectX/OpenGL)
Shader Model
Hardware accelerated Video
Independent/Simultaneous Displays
Display Port
HDCP support
Intel® HD Graphics (Gen 7), 311-542MHz Clock, 667-854MHz Turbo
4
2048MB
up to 21.3
DVMT
11 / 3.0 + OCL 1.1
3.0
H.264 / MPEG1,2,4 / VC1 / WMV9 / Blu-ray
2
DP 1.1a / eDP 1.3
HDCP / PAVP 2 (optional)
Monitor output
CRT max Resolution
-
TV out:
-
LVDS
LVDS Bits/Pixel
LVDS Bits/Pixel with dithering
LVDS max Resolution:
1x18 / 1x24 (PTN3460 DP2LVDS)
1366x768
PWM Backlight Control:
YES
Supported Panel Data:
EDID/DID
Display Interfaces
Discrete Graphics
-
Digital Display Interface DDI1
DP++
Digital Display Interface DDI2
-
Digital Display Interface DDI3
Maximum Resolution on DDI
2560x1600@60Hz
Storage
onboard SSD
SD Card support
IDE Interface
2-64GB eMMC
1x SDIO 3.0 shared with GPIO (w/E3800 CPU only)
-
Serial-ATA
2x SATA 3Gb/s
SATA AHCI
AHCI with NCQ, HotPlug, Staggered Spinup,
SATA RAID
-
Connectivity
USB
up to 7x USB 2.0
USB 3.0
1x USB 3.0
USB Client
1x (Option)
PCI
PCI External Masters
PCI Express
Max PCI Express
PCI Express x2/x4 configuration
Ethernet
Ethernet controller
13
3x PCIe x1 Gen2
4x PCIe x1 without LAN
YES
10/100/1000 Mbit
Intel® i210IT / i211AT
COMe-mBT10 / Product Specification
Feature OS Support Matrix
-
Windows 8
-
E3800
Windows 7
Celeron E3800
WEC
Celeron E3800
Tizen
Celeron E3800
Fedora/Yocto
E3800
Android
Celeron E3800
Celeron
eMMC Storage
X
X
-
-
X
-
X
X
-
-
-
eMMC Boot
X
X
-
-
X
-
X
X
-
X
X
SD Storage
X
X
X
-
X
-
X
X
-
X
X
SD Boot
-
-
X
-
X
-
X
X
-
X
X
MIPI-CSI
-
-
-
-
-
-
-
X
-
-
-
PCI Express Configuration
By default, the COMe-mBT10 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4
configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.
PCIe
Port #0
Port #1
Port #2
Port #3
x1
x1
x1
LAN
x1
LAN
x1
x1
Default
Configuration 1
Configuration 2
x2
x1
x1
Configuration 3
x2
Configuration 4
x2
Configuration 5
x1
x1
x2
x4
Configuration 1,3,4,5 are available with customized BIOS versions only
Configuration 2,3,4,5 need hardware modification, remove LAN
Ethernet
The Intel® i210IT / i211AT ethernet supports:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Supported BIOS Size/Type
8MB SPI
Audio
HD Audio
Onboard Hardware Monitor
Trusted Platform Module
Miscellaneous
Nuvoton NCT7802Y
Atmel AT97SC3204 optional
2x UART / PWM FAN
Kontron Features
External I2C Bus
M.A.R.S. support
Embedded API
Custom BIOS Settings / Flash Backup
Watchdog support
14
Fast I2C, MultiMaster capable
YES
KEAPI3
YES
Dual Staged
COMe-mBT10 / Product Specification
Additional features
» All solid capacitors (POSCAP). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
YES
Singly Supply Support
4.75 - 20V
Supply Voltage
ACPI 3.0
ACPI
S0, S3, S4, S5
S-States
YES
S5 Eco Mode
DPST 4.0, iFFS
Misc Power Management
Power Consumption and Performance
Full Load Power Consumption
5.6 - 12.1W
Kontron Performance Index
9020 - 25917
Kontron Performance/Watt
1599 - 2935
Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer
Section.
15
COMe-mBT10 / Product Specification
3.3
16
Block Diagram
COMe-mBT10 / Product Specification
3.4
Accessories
Product specific accessories
Product Number
Heatspreader and Cooling Solutions
Comment
34006-0000-99-0
HSP COMe-mBT10 thread (11mm)
For all CPUs and temperature grades
34006-0000-99-1
HSP COMe-mBT10 through (11mm)
For all CPUs and temperature grades
34006-0000-99-2
HSP COMe-mBT10 slim thread (6.5mm)
For all CPUs and temperature grades
34006-0000-99-3
HSP COMe-mBT10 slim through (6.5mm)
For all CPUs and temperature grades
General accessories
Part Number
COMe pin-out Type 10 compatible
accessories
Project Code
Comment
34104-0000-00-0
COM Express® Reference Carrier-i Type 10 ADAP
nITX Carrier with 8mm COMe connector
34101-0000-00-1
COM Express® Eval Carrier Type 10
ADAN
ATX Eval Carrier with 8mm COMe connector
To be used in combination with ADA-Type10-Mezzanine
only
34101-0000-00-2
COM Express® Eval Carrier Type 10 Gen2
ADAN
ATX Eval Carrier with 8mm COMe connector
96007-0000-00-8
ADA-Type10-Mezzanine
AMVV
COMe basic sized stand-alone carrier or Adapter Card
for Eval Carrier Gen1
96006-0000-00-1
COMe POST T10
NFCB
POST Code / Debug Card
38019-0000-00-1
ADA-COMe-Height-single
EERC
Height Adapter
34104-0000-00-S
COMe Ref. Starterkit T10
ADAP
Starterkit with COMe Reference Carrier T10
Part Number
Mounting
Comment
34017-0000-00-0
COMe mMount Kit 5/8mm 1set
Mounting Kit for 1 module including screws for 5mm &
8mm connectors
Part Number
Cooling Solutions
Comment
34099-0000-99-0
COMe mini Active Uni Cooler
for CPUs up to 10W TDP, to be mounted on HSP
34099-0000-99-1
COMe mini Passive Uni Cooler
for CPUs up to 5W TDP, to be mounted on HSP
34099-0000-99-2
COMe mini Passive Uni Cooler Slim
for CPUs with 3-5W TDP, to be mounted on HSP
17
COMe-mBT10 / Product Specification
3.5
Electrical Specification
3.5.1
Supply Voltage
Following supply voltage is specified at the COM Express® connector:
4.75 - 20V
VCC:
Standby:
5V DC +/- 5%
RTC:
2.5V - 3.47V
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only
3.5.2
Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
3.5.3
Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
3.5.4
Power Consumption
The maximum Power Consumption of the different COMe-mBT10 variants is 5.6 - 12.1W (100% CPU load on all cores; 90°C
CPU temperature). Further information with detailed measurements are available in Application Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.
18
COMe-mBT10 / Product Specification
3.5.5
ATX Mode
By connecting an ATX power supply with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and powering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 20V in ATX Mode. On Computer-on-Modules supporting a
wide range input down to 4.75V the input voltage shall always be higher than 5V Standby (VCC > 5VSB).
State
PWRBTN#
PWR_OK
V5_StdBy
PS_ON#
G3
x
x
0V
x
0V
S5
high
low
5V
high
0V
S5 → S0
PWRBTN Event
low → high
5V
high → low
0 V→ VCC
S0
high
high
5V
low
VCC
3.5.6
VCC
Single Supply Mode
In single supply mode (or automatic power on after power loss) without 5V Standby the module will start automatically
when VCC power is connected and Power Good input is open or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 20V.
To power on the module from S5 state press the power button or reconnect VCC. Suspend/Standby States are not
supported in Single Supply Mode.
State
PWRBTN#
PWR_OK
V5_StdBy
VCC
G3
x
x
x
0
G3 → S0
high
open / high
x
connecting VCC
S5
high
open / high
x
VCC
S5 → S0
PWRBTN Event
open / high
x
reconnecting VCC
Signals marked with “x” are not important for the specific power state. There is no
difference if connected or open.
All ground pins have to be tied to the ground plane of the carrier board.
19
COMe-mBT10 / Product Specification
3.6
Power Control
Power Supply
The COMe-mBT10 supports a power input from 4.75 - 20V. The supply voltage is applied through the VCC pins (VCC) of the
module connector.
Power Button (PWRBTN#)
The power button (Pin B12) is available through the module connector described in the pinout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, typical 400ms) at low level (Power Button Event).
Pressing the power button for at least 4seconds will turn off power to the module (Power Button Override).
Power Good (PWR_OK)
The COMe-mBT10 provides an external input for a power-good signal (Pin B24). The implementation of this subsystem
complies with the COM Express® Specification. PWR_OK is internally pulled up to 3.3V and must be high level to power on
the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the pinout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chipset and active Management Engine do not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager present and SMB_ALERT# (Pin B15) connected the module always powers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.
20
COMe-mBT10 / Product Specification
3.7
Environmental Specification
3.7.1
Temperature Specification
Kontron defines following temperature grades for Computer-on-Modules in general. Please see chapter 'Product
Specification' for available temperature grades for the COMe-mBT10
Temperature Specification
Non-operating
Validated Input Voltage
0°C to +60°C
-30°C to +85°C
VCC: 4.75 - 20V
Extended Temperature (E1)
-25°C to +75°C
-30°C to +85°C
VCC: 12V
Industrial grade by Screening (XT)
-40°C to +85°C
-40°C to +85°C
VCC: 12V
Industrial grade by Design (E2)
-40°C to +85°C
-40°C to +85°C
VCC: 4.75 - 20V
Commercial grade
Operating
Operating with Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Test specification:
Temperature Grade
Validation requirements
Commercial grade
at 60°C HSP temperature the CPU @ 100% load needs to run at nominal frequency
Extended Temperature (E1)
at 75°C HSP temperature the CPU @ 75% load is allowed to start speedstepping for thermal protection
Industrial grade by Screening (XT)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Industrial grade by Design (E2)
at 85°C HSP temperature the CPU @ 50% load is allowed to start throttling for thermal protection
Operating without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.7.2
Humidity
» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068-2-78)
21
COMe-mBT10 / Product Specification
3.8
Standards and Certifications
RoHS II
The COMe-mBT10 is compliant to the directive 2011/65/EU on the Restriction of the use of certain Hazardous Substances
(RoHS II) in electrical and electronic equipment
Component Recognition UL 60950-1
The COM Express® mini form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc.
Representative samples of this component have been evaluated by UL and meet applicable UL requirements.
UL Listings:
» NWGQ2.E304278
» NWGQ8.E304278
WEEE Directive
WEEE Directive 2002/96/EC is not applicable for Computer-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.
Shock & Vibration
The COM Express® mini form factor Computer-on-Modules successfully passed shock and vibration tests according to
» IEC/EN 60068-2-6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)
» IEC/EN 60068-2-27 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)
EMC
Validated in Kontron reference housing for EMC the COMe-mBT10 follows the requirements for electromagnetic
compatibility standards
» EN55022
22
COMe-mBT10 / Product Specification
3.9
MTBF
The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue 2 calculation for the remaining parts.
The calculation method used is “Telcordia Issue 2 Method 1 Case 3” in a ground benign, controlled environment (GB,GC).
This particular method takes into account varying temperature and stress data and the system is assumed to have not
been burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.
System MTBF (hours): 489824h @ 40°C (w/o PCB)
Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.
23
COMe-mBT10 / Product Specification
3.10
Mechanical Specification
Module Dimension
» 55mm x 84mm (±0.2mm)
» Height approx. 3.5mm (withouth printed circuit board)
CAD drawings are available at EMD CustomerSection
Height
The COM Express® specification defines a module height of 13mm from bottom to heatspreader top:
Kontron provides standard HSP for the specified height of 13mm and slim-line Heatspreader for a reduced height of
8.5mm for mini sized Computer-on-Modules. Universal Cooling solutions to be mounted on the HSP are 14.3mm (340990000-00-0/1) or 8mm (34099-0000-00-2) in height. This allows combinations of a total module height of 8.5mm or
13mm with the Heatspreader and between 16.5mm and 27.3mm with a cooling solution.
24
COMe-mBT10 / Product Specification
3.11
Module Dimensions
All dimensions in mm
3.12
Onboard Fan Connector
Specification
» Part number (Molex) J3: 53261-0371
» Mates with: 51021-0300
» Crimp terminals: 50079-8100
Pin assignment
» Pin1: Tacho, Pin2: VCC, Pin3: GND
Electrical characteristic
Module Input Voltage
4.75 - 13V
FAN Output Voltage
4.75 - 13V
13V
350mA
150mA
Max. FAN Output Current
25
>13
COMe-mBT10 / Product Specification
3.13
Thermal Management, Heatspreader and Cooling Solutions
A heatspreader plate assembly is available from Kontron Europe GmbH for the COMe-mBT10. The heatspreader plate on top
of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat sink or
external cooling devices.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worstcase conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according the module specifications:
» 60°C for commercial grade modules
» 75°C for extended temperature grade modules (E1)
» 85°C for industrial temperature grade modules (E2/XT)
The aluminum slugs and thermal pads or the heat-pipe on the underside of the heatspreader assembly implement thermal
interfaces between the heatspreader plate and the major heat-generating components on the COMe-mBT10. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.
You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Active
or passive cooling solutions provided from Kontron Europe GmbH for the COMe-mBT10 are usually designed to cover the
power and thermal dissipation for a commercial grade temperature range used in a housing with proper air flow.
Documentation and CAD drawings of COMe-mBT10 heatspreader and cooling solutions are provided at
http://emdcustomersection.kontron.com.
26
COMe-mBT10 / Features and Interfaces
4
Features and Interfaces
4.1
Onboard eMMC Flash
The COMe-mBT10 features a 14x18mm onboard Micron NAND Flash drive with capacities of 2-64GB eMMC. The Flash drive
includes a Phison PS8200 micro controller and supports:
» JEDEC/MMC standard version 5.0 compliant
» class 0 (basic); class 2 (block, read); class 4 (block write); class 5 (erase); class 6 (write protect); class 7 (lock card)
» MMCplus™ and MMCmobile™ protocols
» HS200/HS400 modes
» 52 MHz clock speed (MAX)
» Boot operation (high-speed boot)
» Sleep mode
» Replay-protected memory block (RPMB)
» Secure erase and secure trim
» Permanent and power-on write protection
» Double data rate (DDR) function
» Wear Leveling, ECC and block management
» -40°C to +85°C industrial temperature range
» Multi-Level-Cell (MLC) technology
» Single-Level-Cell (SLC) technology optional by firmware re-configuration during COMe-mBT10 manufacturing
Flash Part No.
MTFC4GACAAAM-4M IT
MTFC8GACAAAM-4M IT
Nominal Flash Size MLC
4GByte
8GByte
MTFC16GAKAECN-4M IT MTFC32GAKAECN-4M IT
16GByte
32GByte
MTFC64GAKAEEY-4M IT
Nominal Flash Size pSLC
2GByte
4GByte
8GByte
16GByte
32GByte
Seq. MLC read speed /HS200
80 MB/s
120 MB/s
250 MB/s /160 MB/s
250 MB/s /160 MB/s
280 MB/s /160 MB/s
64GByte
Seq. MLC write speed /HS200
11 MB/s
24 MB/s
30 MB/s
40MB/s
50 MB/s / 40MB/s
I/O Performance read/write
4000 / 1000 IOPS
4000 / 1000 IOPS
4700 / 1200 IOPS
4700 / 1300 IOPS
4700 / 1300 IOPS
Endurance (# of P/E cycles)
MLC: 3k
SLC: 40k
MLC: 3k
SLC: 40k
MLC: 3k
SLC: 40k
MLC: 3k
SLC: 40k
MLC: 3k
SLC: 40k
Notes:
» Random access of 4KB chunk, sequential read access of 1MB chunk
» Data based on Datasheet Micron eMMC Rev. E 6/14 EN
» ~10% of the nominal flash size are reserved for Firmware and Block Management
» Baytrail eMMC interface supports HS200 mode only
Note: the onboard eMMC Flash requires pre-configuration via EFI Shell before OS
installation (e.g. diskpart utility)
27
COMe-mBT10 / Features and Interfaces
4.2
Secure Digital Card
The COMe-mBT10 supports an SDIO Interface to be used for micro/mini/standard SD Card sockets. Following SD Cards are
validated from Kontron and recommended for use:
swissbit® S-200U & S-300U Series Industrial microSD Card
» compliant to SD Card specification 2.0
» Wear Leveling of static and dynamic data
» High reliability (MTBF >3,000,000 hours, > 10,000 insertions)
» Extended or Industrial Temperature range
» up to 25MB/s data transfer speed
Delkin Devices Inc. MicroSD
» compliant to SD Card specification 2.0
» Wear Leveling and ECC
» High reliability (MTBF >2,000,000 hours, > 2,000,000 write/erase cycles)
» Industrial Temperature range
» up to 17MB/s data transfer speed
Order information
Density
Manufacturerer & Part.No.
Temperature range
mSD-SD Adapter
1GB SD1.1
swissbit SFSD1024N1BN1TO-I-DF-151-STD
-40°C to 85°C
No
2GB SD1.1
swissbit SFSD2048N1BW1MT-E-ME-111-STD
-25°C to 85°C
No
2GB SD1.1
Delkin SD02GHMSH-S2047-B
-40°C to 85°C
No
2GB SDHC
Delkin SD02GHMSH-S2000-B
-40°C to 85°C
Yes
4GB SDHC
swissbit SFSD4096N1BW1MT-E-DF-111-STD
-25°C to 85°C
No
4GB SDHC
Delkin SD04GHMSH-S2647-B
-40°C to 85°C
No
4GB SDHC
Delkin SD04GHMSH-S2600-B
-40°C to 85°C
Yes
8GB SDHC
Delkin SD08GHMSH-S2647-B
-40°C to 85°C
No
8GB SDHC
Delkin SD08GHMSH-S2600-B
-40°C to 85°C
Yes
4.3
S5 Eco Mode
Kontron’s new high-efficient power-off state S5 Eco enables lowest power-consumption in soft-off state – less than 1 mA
compared to the regular S5 state this means a reduction by at least factor 200!
In the “normal” S5 mode the board is supplied by 5V_Stb and needs usually up to 300mA just to stay off. This mode allows
to be switched on by power button, RTC event and WakeOnLan, even when it is not necessary. The new S5 Eco mode
reduces the current enormous.
The S5 Eco Mode can be enabled in BIOS Setup, when the BIOS supports this feature.
Following prerequisites and consequences occur when S5 Eco Mode is enabled
» The power button must be pressed at least for 200ms to switch on.
» Wake via Power button only.
» “Power On After Power Fail”/“State after G3”: only “stay off” is possible
28
COMe-mBT10 / Features and Interfaces
4.4
LPC
The Low Pin Count (LPC) Interface signals are connected to the LPC Bus bridge located in the CPU or chipset. The LPC low
speed interface can be used for peripheral circuits such as an external Super I/O Controller, which typically combines
legacy-device support into a single IC. The implementation of this subsystem complies with the COM Express®
Specification. Implementation information is provided in the COM Express® Design Guide maintained by PICMG. Please
refer to the official PICMG documentation for additional information.
The LPC bus does not support DMA (Direct Memory Access) and a clock buffer is required when more than one device is
used on LPC. This leads to limitations for ISA bus and SIO (standard I/O´s like Floppy or LPT interfaces) implementations.
All Kontron COM Express® Computer-on-Modules imply BIOS support for following external baseboard LPC Super I/O
controller features for the Winbond/Nuvoton 5V 83627HF/G and 3.3V 83627DHG-P:
83627HF/G
Phoenix BIOS
AMI CORE8
AMI / Phoenix EFI
PS/2
YES
YES
YES
COM1/COM2
YES
YES
YES
LPT
YES
YES
YES
HWM
YES
YES
NO
Floppy
NO
NO
NO
GPIO
NO
NO
NO
83627DHG-P
Phoenix BIOS
AMI CORE8
AMI / Phoenix EFI
PS/2
YES
YES
YES
COM1/COM2
YES
YES
YES
LPT
YES
YES
YES
HWM
NO
NO
NO
Floppy
NO
NO
NO
GPIO
NO
NO
NO
Features marked as not supported do not exclude OS support (e.g. HWM can be accessed via SMB). For any other LPC
Super I/O additional BIOS implementations are necessary. Please contact your local sales or support for further details.
29
COMe-mBT10 / Features and Interfaces
4.5
Serial Peripheral Interface (SPI)
The Serial Peripheral Interface Bus or SPI bus is a synchronous serial data link standard named by Motorola that operates
in full duplex mode. Devices communicate in master/slave mode where the master device initiates the data frame.
Multiple slave devices are allowed with individual slave select (chip select) lines. Sometimes SPI is called a “four wire”
serial bus, contrasting with three, two, and one wire serial buses.
The SPI interface can only be used with a SPI flash device to boot from external BIOS on the
baseboard.
4.6
SPI boot
The COMe-mBT10 supports boot from an external SPI Flash. It can be configured by pin A34 (BIOS_DIS#0) and pin B88
(BIOS_DIS1#) in following configuration:
BIOS_DIS0#
BIOS_DIS1#
open
open
Function
Boot on-module BIOS
GND
open
Boot baseboard LPC FWH
open
GND
Baseboard SPI = Boot Device 1, on-module SPI = Boot Device 2
GND
GND
Baseboard SPI = Boot Device 2, on-module SPI = Boot Device 1
By default only SPI Boot Device 1 is used in configuration 3 & 4. Both SPI Boot Devices are
used by splitting the BIOS with modified descriptor table in customized versions only
Recommended SPI boot flash types for 8-SOIC package
Size
Manufacturer
Part Number
Device ID
16Mbit
Atmel
AT26DF161
0x1F4600
16Mbit
Atmel
AT26DF161A
0x1F4601
16Mbit
Atmel
AT25DF161
0x1F4602
16Mbit
Atmel
AT25DQ161
0x1F8600
16Mbit
Macronix
MX25L1605A(D)(36E)(06E)
0xC22015
16Mbit
Macronix
MX25L1635D
0xC22415
16Mbit
SST/Microchip
SST25VF016B
0xBF2541
16Mbit
Winbond
W25X16BV
0xEF3015
16Mbit
Winbond
W25Q16BV(CV)
0xEF4015
Size
Manufacturer
Part Number
Device ID
32Mbit
Atmel
AT25/26DF321
0x1F4700
32Mbit
Atmel
AT25DF321A
0x1F4701
32Mbit
Macronix
MX25L3205A(D)(06E)
0xC22016
32Mbit
Macronix
MX25L3225D(35D)(36D)
0xC25E16
32Mbit
SST/Microchip
SST25VF032B
0XBF254A
32Mbit
Winbond
W25X32BV
0xEF3016
32Mbit
Winbond
W25Q32BV,
0xEF4016
Size
Manufacturer
Part Number
Device ID
64Mbit
Atmel
AT25DF641(A)
0x1F4800
64Mbit
Atmel
AT25DQ641
0x1F8800
64Mbit
Macronix
MX25L6405D(45E)(36E)(06E)(73E)
0xC22017
64Mbit
Macronix
MX25L6455E
0xC22617
64Mbit
Macronix
MX25U6435F
0xC22537
64Mbit
SST/Microchip
SST25VF064C
0xBF254B
64Mbit
Winbond
W25X64BV
0xEF3017
64Mbit
Winbond
W25Q64BV(CV)(FV)
0xEF4017
64Mbit
Winbond
W25Q64DW
0XEF6017
64Mbit
Winbond
W25Q64FW
0XEF6017
30
COMe-mBT10 / Features and Interfaces
Using an external SPI flash
To program an external SPI flash follow these steps:
» Connect a SPI flash with correct size (similar to BIOS ROM file size) to the module SPI interface
» Open pin A34 and B88 to boot from the module BIOS
» Boot the module to DOS/EFI-Shell with access to the BIOS image and Firmware Update Utility provided on EMD
Customer Section
» Connect pin B88 (BIOS_DIS1#) to ground to enable the external SPI flash
» Execute Flash.bat/Flash.efi to program the complete BIOS image to the external SPI flash
» reboot
Your module will now boot from the external SPI flash when BIOS_DIS1# is grounded.
External SPI flash on Modules with Intel® ME
If booting from the external (baseboard mounted) SPI flash then exchanging the COM Express® module for another one
of the same type will cause the Intel® Management Engine to fail during next start. This is by design of the ME because it
bounds itself to the very module it has been flashed to. In the case of an external SPI flash this is the module present at
flash time.
To avoid this issue please make sure to conduct a complete flash of the external SPI flash device after changing the
COMexpress module for another one. If disconnecting and reconnecting the same module again this step is not necessary.
31
COMe-mBT10 / Features and Interfaces
4.7
M.A.R.S.
The Smart Battery implementation for Kontron Computer-on-Modules called Mobile Application for Rechargeable Systems
is a BIOS extension for external Smart Battery Manager or Charger. It includes support for SMBus charger/selector (e.g.
Linear Technology LTC1760 Dual Smart Battery System Manager) and provides ACPI compatibility to report battery
information to the Operating System.
Reserved SM-Bus addresses for Smart Battery Solutions on the carrier:
8-bit Address
7-bit Address
Device
12h
0x09
SMART_CHARGER
14h
0x0A
SMART_SELECTOR
16h
0x0B
SMART_BATTERY
32
COMe-mBT10 / Features and Interfaces
4.8
UART
The COMe-mBT10 supports up to two Serial RX/TX only Ports defined in COM Express® specification on Pins A98/A99 for
UART0 and Pins A101/A102 for UART1. The implementation of the UART is compatible to 16450 and is supported by
default from most operating systems. Resources are subordinated to other UARTS e.g. from external LPC Super I/O.
UART features:
» 450 to 115.2k Baud (except 56000)
» 5, 6, 7 or 8bit characters
» 1 or 2 Stop bit generation
» Even, odd or no-parity generation/detection
» Complete status reporting capabilities
» Line break generation and detection
» Full prioritized interrupt system control
» No FIFO
» One additional shift register for transmit and one for receive
» No Flow Control
» No FCR register due to unavailability of FIFO
» MCR and MSR registers only implemented in loopback mode for compatibility with existing drivers and APIs
» Initialized per default to COM3 3F8h/IRQ4 and COM4 2F8/IRQ3 without external SIO
» Initialized per default to COM3 3E8h/IRQ5 and COM4 2E8/IRQ10 with external SIO present
The UART clock is generated by the 33MHz LPC clock which results in an accuracy of 0.5% on all UART timings
- Due to the protection circuitry required according COM Express® specification the
transfer speed can only be guaranteed for 9600 Baud. Please contact your local sales or
support for customized versions without protection circuitry
- Legacy console redirection via onboard serial ports may be restricted in terms of serial
input stream. Since they're only emulating a 16450 device (w/o FIFO) an input stream
generated by a program may lose characters. Inputs from a keyboard via terminal program
will be safe.
33
COMe-mBT10 / Features and Interfaces
4.9
Fast I2C
The COMe-mBT10 supports a CPLD implemented LPC to I2C bridge using the WISHBONE I2C Master Core provided from
opencores.org. The I2C Interface supports transfer rates up to 40kB/s and can be configured in Setup
Specification for external I2C:
» Speed up to 400kHz
» Compatible to Philips I2C bus standard
» Multi-Master capable
» Clock stretching support and wait state generation
» Interrupt or bit-polling driven byte-by-byte data-transfers
» Arbitration lost interrupt with automatic transfer cancellation
» Start/Stop signal generation/detection
» Bus busy detection
» 7bit and 10bit addressing
34
COMe-mBT10 / Features and Interfaces
4.10
Dual Staged Watchdog Timer
Basics
A watchdog timer (or computer operating properly (COP) timer) is a computer hardware or software timer that triggers a
system reset or other corrective action if the main program, due to some fault condition, such as a hang, neglects to
regularly service the watchdog (writing a “service pulse” to it, also referred to as “kicking the dog”, “petting the dog”,
“feeding the watchdog” or “triggering the watchdog”). The intention is to bring the system back from the nonresponsive
state into normal operation.
The COMe-mBT10 offers a watchdog which works with two stages that can be programmed independently and used one by
one.
Time-out events
Reset
A reset will restart the module and starts POST and operating system new.
NMI
A non-maskable interrupt (NMI) is a computer processor interrupt that cannot be ignored by standard interrupt masking techniques in the system. It is
typically used to signal attention for non-recoverable hardware errors.
SCI
A system control interrupt (SCI) is a OS-visible interrupt to be handled by the OS using AML code
Delay
Might be necessary when an operating system must be started and the time for the first trigger pulse must extended. (Only available in the first stage)
WDT Signal only
This setting triggers the WDT Pin on baseboard connector (COM Express® Pin B27) only
Cascade:
Does nothing, but enables the 2nd stage after the entered time-out.
WDT Signal
B27 on COM Express® Connector offers a signal that can be asserted when a watchdog timer has not been triggered within
time. It can be configured to any of the 2 stages. Deassertion of the signal is automatically done after reset. If
deassertion during runtime is necessary please ask your Kontron technical support for further help.
35
COMe-mBT10 / Features and Interfaces
4.11
Speedstep Technology
The Intel® processors offer the Intel® Enhanced SpeedStep™ technology that automatically switches between maximum
performance mode and battery-optimized mode, depending on the needs of the application being run. It enables you to
adapt high performance computing on your applications. When powered by a battery or running in idle mode, the
processor drops to lower frequencies (by changing the CPU ratios) and voltage, conserving battery life while maintaining
a high level of performance. The frequency is set back automatically to the high frequency, allowing you to customize
performance.
In order to use the Intel® Enhanced SpeedStep™ technology the operating system must support SpeedStep™ technology.
By deactivating the SpeedStep feature in the BIOS, manual control/modification of CPU performance is possible. Setup
the CPU Performance State in the BIOS Setup or use 3rd party software to control CPU Performance States.
36
COMe-mBT10 / Features and Interfaces
4.12
C-States
New generation platforms include power saving features like SuperLFM, EIST (P-States) or C-States in O/S idle mode.
Activated C-States are able to dramatically decrease power consumption in idle mode by reducing the Core Voltage or
switching of parts of the CPU Core, the Core Clocks or the CPU Cache.
Following C-States are defined:
C-State Description
Function
C0
Operating
CPU fully turned on
C1
Halt State
Stops CPU main internal clocks via software
C1E
Enhanced Halt
Similar to C1, additionally reduces CPU voltage
C2
Stop Grant
Stops CPU internal and external clocks via hardware
C2E
Extended Stop Grant
Similar to C2, additionally reduces CPU voltage
C3
Deep Sleep
Stops all CPU internal and external clocks
C3E
Extended Stop Grant
Similar to C3, additionally reduces CPU voltage
C4
Deeper Sleep
Reduces CPU voltage
C4E
Enhanced Deeper Sleep
Reduces CPU voltage even more and turns off the memory cache
C6
Deep Power Down
Reduces the CPU internal voltage to any value, including 0V
C7
Deep Power Down
Similar to C6, additionally LLC (LastLevelCache) is switched off
C-States are usually enabled by default for low power consumption, but active C-States my influence performance
sensitive applications or real-time systems.
» Active C6-State may influence data transfer on external Serial Ports
» Active C7-State may cause lower CPU and Graphics performance
It's recommended to disable C-States / Enhanced C-States in BIOS Setup if any problems occur.
37
COMe-mBT10 / Features and Interfaces
4.13
Graphics Features
The integrated Intel® HD Graphics (Gen 7) graphics supports following OS dependent featureset:
O/S
Win8 / WES8
Win7 / WES7
WEC7
Linux (F18/Yocto1.6) Linux (Tizen IVI 32b)
DP 1.1a up to 2560×1600
DisplayPort
up to 2560×1600
VGA (COMe-compact only)
Yes
Dual Independent Display
DirectDraw
2D HW acceleration
OGL4.0, DX11.1/10/9
DXVA 2
HW Media Acceleration
H.264,MPEG2,VC1,VP8
Media players
Content Protection*
X Server
OGLES 2.0
DirectShow
not supported
Windows Media Player
PowerDVD
CEPlayer
VAAPI
OGL3.2/OGLES2.0
H.264,MPEG2
PAVP
OpenGL Renderer
OGLES 1.1/2.0 in 4.2
OGLES 1.1/2.0/3.0 in
4.4 KitKat
OpenMax
H.264,MPEG2,VC1,VP8 H.264,H.263,VC1,WMV
9,VP8,MPEG4 in 4.2
H.264, VC1 in 4.4
H.264,MPEG2
v2.0
H.264
not supported
HDCP
* Supported with active TXE Engine only (available with custom BIOS only)
38
Wayland Compositor
OGL3.2/OGLES2.0
H.264,MPEG2,VC1 H.264,MPEG2,VC1,VP8
H.264,MPEG2
HW Video Encode
Blu-Ray
not supported
eDP 1.3 up to 2560×1600 or LVDS up to 1920×1080 via eDP-LVDS Bridge
eDP
HW Video Decode
not supported
HDMI 1.4a up to 1920×1200
HDMI (via external LS)
3D HW acceleration
Android 4.2/4.4
GStreamer - VAAPI
not supported
Gallery, Widevine
Widevine L1
COMe-mBT10 / Features and Interfaces
4.14
ACPI Suspend Modes and Resume Events
The COMe-mBT10 supports the S-states S0, S3, S4, S5. S5eco Support: YES
The following events resume the system from S3:
» USB Keyboard (1)
» USB Mouse (1)
» Power Button
» WakeOnLan (2)
The following events resume the system from S4:
» Power Button
» WakeOnLan (2)
The following events resume the system from S5:
» Power Button
» WakeOnLan (2)
The following events resume the system from S5Eco:
» Power Button
(1) OS must support wake up via USB devices and baseboard must power the USB Port with
StBy-Voltage
(2) Depending on the Used Ethernet MAC/Phy WakeOnLan must be enabled in BIOS setup
and driver options
39
COMe-mBT10 / Features and Interfaces
4.15
USB
The COMe-mBT10 with PN 34006 supports up to 7x USB 2.0/1x USB 3.0 with following internal EHCI/xHCI configuration:
The COMe-mBT10 with PN 34007 supports 4 USB 2.0 /1x USB 3.0 with following internal EHCI/xHCI configuration:
40
COMe-mBT10 / System Resources
5
System Resources
5.1
Interrupt Request (IRQ) Lines
IRQ #
Used For
0
Timer0
1
Keyboard
2
Redirected secondary PIC
3
Onboard - COM2
4
Onboard - COM1
5
SIO COM3 or 4
6
SIO COM3 or 4
7
SIO LPT or COM3/4
8
RTC
9
Free for PCI devices
10
Free for PCI devices
11
Free for PCI devices
12
PS/2 mouse or free for PCI devices
13
FPU
14
not used
15
not used
5.2
Memory Area
Address range (hex)
Size
Usage
00000000-0009FFFF
640 KB
DOS- (Real mode-) memory
000A0000-000BFFFF
128 KB
Display memory
000C0000-000CBFFF
48 KB
VGA BIOS
000CC000-000DFFFF
80 KB
Option ROM or XMS
000E0000-000EFFFF
64 KB
System BIOS extended space
000F0000-000FFFFF
64 KB
System BIOS base segment
0x20000000 00100000-7FFFFFFF
2 GB – 1 MB
System memory (Low DRAM)
0x20000000-0x20001000
4KB
Minimum mapping for chipset LPE device
80000000-FFF00000
2 GB – 1 MB
PCI memory, other extensions (Low MMIO)
FEC00000-FEC00040
64 Bytes
IOxAPIC
FED00000-FED003FF
1 KB
HPET (Timer)
FED1C000-FED1CFFF
4KB
Chipset internal register space
FED40000-FED4B000
44 KB
TPM hard coded memory
FFFF0000-FFFFFFFF
64 KB
Mapping space for BIOS ROM/Boot vector
100000000-17FFFFFFF
2 GB
System memory (High DRAM)
180000000-F00000000
58 GB
High MMIO
5.3
I/O Address Map
The I/O-port addresses of the are functionally identical to a standard PC/AT. All addresses not mentioned in this table
should be available. We recommend that you do not use I/O addresses below 0100h with additional hardware for
compatibility reasons, even if available.
I/O Address
Usage
0000-000F
DMA-Controller Master (8237)
0020-0021
024-025
028-029
02C-02D
030-031
034-035
038-039
03C-03D
Interrupt-Controller Master (8259)
002E-002F
External SuperI/O
040-043
050-053
Programmable Interrupt Timer (8253)
04E-04F
TPM
060, 064
KBD Interface-Controller (8042)
061, 063, 065, 067
NMI Controller
070-071
RTC CMOS / NMI mask
072-073
RTC Extended CMOS
080-083
Debug port
0A0-0A1
Interrupt-Controller Slave (8259)
41
COMe-mBT10 / System Resources
0A4-0A5
0A8-0A9
0AC-0AD
0B0-0B1
0B4-0B5
0B8-0B9
0BC-0BD
0B2-0B3
APM control
279
ISA PnP
295-296
External Hardware monitor, optionally used by external SuperIO if present
2E8-2EF
Serial port COM4 (SIO COM2)
2F8-2FF
Serial port COM2 (onboard COM2)
370-377
Floppy disk controller, optionally used by external SuperIO if present (370h to 371h)
378-37F
Parallel port LPT 1, optionally used by external SuperIO if present
3C0-3CF
VGA/EGA
3E8-3EF
Serial port COM3 (SIO COM1)
3F8-3FF
Serial Port COM1 (onboard COM1)
400-4FF
Chipset internal register I/O area
4D0-4D1
Interrupt-Controller (Slave)
500-5FF
Chipset internal register I/O area
A80-A81
Kontron CPLD control port
CF8
PCI configuration address
CF9
Reset control
CFC-CFF
PCI configuration data
5.4
Peripheral Component Interconnect (PCI) Devices
All devices follow the Peripheral Component Interconnect 2.3 (PCI 2.3) respectivily the PCI Express Base 1.0a
specification. The BIOS and OS control memory and I/O resources. Please see the PCI 2.3 specification for details.
Device
Bus/Device/Function
VID/DID default
Transaction Router (former host bridge) 0/0/0
8086h/0F00h
Graphics & display
0/2/0
8086h/0F31h
Camera image signal processor
0/3/0
8086h/0F38h
eMMC
0/16/0
8086h/0F14h
SDIO
0/17/0
8086h/0F15h
Comment
Not used
Not used
SD
0/18/0
8086h/0F16h
-
SATA
0/19/0
8086h/0F23h
-
xHCI
0/20/0
8086h/8C31h
-
Low-power Audio
0/21/0
8086h/0F28h
-
I2S port 0
0/21/1
-
-
I2S port 1
0/21/2
-
-
I2S port 2
0/21/3
-
USB3.0 device
0/22/0
8086h
-
SIO I2C DMA Configuration
0/24/0
8086h/0F40h
-
I2C1 Configuration
0/24/1
8086h/0F41h
-
I2C2 Configuration
0/24/2
8086h/0F42h
-
I2C3 Configuration
0/24/3
8086h/0F43h
-
I2C4 Configuration
0/24/4
8086h/0F44h
-
I2C5 Configuration
0/24/5
8086h/0F45h
-
I2C6 Configuration
0/24/6
8086h/0F46h
-
I2C7 Configuration
0/24/7
8086h/0F47h
-
Trusted Execution engine
0/26/0
8086h/0F18h
-
HD Audio
0/27/0
8086h/0F04h
-
PCIExpress Root port 0
0/28/0
8086h
PCIExpress Root port 1
0/28/1
-
-
PCIExpress Root port 2
0/28/2
-
-
PCIExpress Root port 3
0/28/3
-
-
EHCI
0/29/0
8086h/0F34h
-
SerialIO HSUART / PWM / SPI DMA
0/30/0
8086h/0F06h
-
PWM Port 1
0/30/1
8086h
-
PWM Port 2
0/30/2
8086h
-
HSUART1
0/30/3
8086h/0F0Ah
-
-
-
HSUART2
0/30/4
8086h/0F0Ch
-
SPI
0/30/5
8086h/0F0Eh
-
PCU LPC
0/31/0
8086h/0F1Ch
-
42
COMe-mBT10 / System Resources
5.5
LPC addresses
I/O address
Device
2Eh/2Fh
external SuperI/O Winbond/Nuvoton 83627
4Eh/4Fh
TPM
0A80h/0A81h
CPLD
5.6
I2C Bus
8-bit Address
7-bit Address
Device
Bus
58h
0x2C
S5eco resistor
internal
5Ah
0x2D
USB HSIC Hub
internal
C0h
0x60
DP2LVDS bridge
internal
A0h
0x50
LVDS EEPROM
internal
A0h
0x50
Module / JIDA EEPROM
external
AEh
0x57
Carrier EEPROM
external
5.7
System Management (SM) Bus
8-bit Address
7-bit Address
Device
10h
0x08
HSIC
Bus
internal
30h
0x18
DDR3L Thermal sensor option
internal
5Ah
0x2D
onboard HWMonitor
internal
A0h
0x50
DDR3L SPD
internal
C8h
0x64
Ethernet
internal
12h
0x09
SMART_CHARGER
external
14h
0x0A
SMART_SELECTOR
external
16h
0x0B
SMART_BATTERY
external
58h
0x2C
SIO HWMonitor
external
Do not use any reserved addresses mentioned above for other devices
43
COMe-mBT10 / Pinout List
6
6.1
Pinout List
General Signal Description
Type
Description
I/O-3,3
Bi-directional 3,3 V IO-Signal
I/O-5T
Bi-dir. 3,3V I/O (5V Tolerance)
I/O-5
Bi-directional 5V I/O-Signal
I-3,3
3,3V Input
I/OD
Bi-directional Input/Output Open Drain
I-5T
3,3V Input (5V Tolerance)
OA
Output Analog
OD
Output Open Drain
O-1,8
1,8V Output
O-3,3
3,3V Output
O-5
5V Output
DP-I/O
Differential Pair Input/Output
DP-I
Differential Pair Input
DP-O
Differential Pair Output
PU
Pull-Up Resistor
PD
Pull-Down Resistor
PWR
Power Connection
To protect external power lines of peripheral devices, make sure that: the wires have the
right diameter to withstand the maximum available current the enclosure of the peripheral
device fulfills the fire-protection requirements of IEC/EN60950
44
COMe-mBT10 / Pinout List
6.2
Connector X1A Row A
Pin
Signal
Description
Type
Termination
Comment
A1
GND
Power Ground
PWR GND
-
-
A2
GBE0_MDI3-
Ethernet Media Dependent Interface 3 -
DP-I/O
-
-
A3
GBE0_MDI3+
Ethernet Media Dependent Interface 3 +
DP-I/O
-
-
A4
GBE0_LINK100#
Ethernet Speed LED
OD
-
-
A5
GBE0_LINK1000#
Ethernet Speed LED
OD
-
-
A6
GBE0_MDI2-
Ethernet Media Dependent Interface 2 -
DP-I/O
-
-
A7
GBE0_MDI2+
Ethernet Media Dependent Interface 2 +
DP-I/O
-
-
A8
GBE0_LINK#
LAN Link LED
OD
-
-
A9
GBE0_MDI1-
Ethernet Media Dependent Interface 1 -
DP-I/O
-
A10
GBE0_MDI1+
Ethernet Media Dependent Interface 1 +
DP-I/O
-
-
A11
GND
Power Ground
PWR GND
-
-
A12
GBE0_MDI0-
Ethernet Media Dependent Interface 0 -
DP-I/O
-
-
A13
GBE0_MDI0+
Ethernet Media Dependent Interface 0 +
DP-I/O
-
-
A14
GBE0_CTREF
Center Tab Reference Voltage
O
-
100nF capacitor to GND
A15
SUS_S3#
Suspend To RAM (or deeper) Indicator
O-3.3
PD 10k
-
A16
SATA0_TX+
SATA Transmit Pair 0 +
DP-O
-
-
A17
SATA0_TX-
SATA Transmit Pair 0 -
DP-O
-
-
A18
SUS_S4#
Suspend To Disk (or deeper) Indicator
O-3.3
-
-
A19
SATA0_RX+
SATA Receive Pair 0 +
DP-I
-
-
A20
SATA0_RX-
SATA Receive Pair 0 -
DP-I
-
-
A21
GND
Power Ground
PWR GND
-
-
A22
USB_SSRX0-
USB 3.0 Receive Pair 0 -
DP-I
-
-
A23
USB_SSRX0+
USB 3.0 Receive Pair 0 +
DP-I
-
-
A24
SUS_S5#
Soft Off Indicator
O-3.3
-
A25
USB_SSRX1-
USB 3.0 Receive Pair 1 -
DP-I
-
-
A26
USB_SSRX1+
USB 3.0 Receive Pair 1 +
DP-I
-
-
A27
BATLOW#
Battery Low
I-3.3
PU 10k 3.3V (S5)
assertion will prevent wake from S3-S5 state
A28
(S)ATA_ACT#
Serial ATA activity LED
OD-3.3
PU 10k 3.3V (S0)
can sink 15mA
A29
AC/HDA_SYNC
HD Audio Sync
O-3.3
PD 20k in CPU
-
A30
AC/HDA_RST#
HD Audio Reset
O-3.3
PD 20k in CPU
-
A31
GND
Power Ground
PWR GND
-
-
A32
AC/HDA_BITCLK
HD Audio Bit Clock Output
O-3.3
PD 20k in CPU
-
A33
AC/HDA_SDOUT
HD Audio Serial Data Out
O-3.3
PD 20k in CPU
-
A34
BIOS_DIS0#
BIOS Selection Strap 0
I-3.3
PU 10k 3.3V (S0)
-
A35
THRMTRIP#
Thermal Trip
O-3.3
PU 10k 3.3V (S0)
do not use as this signal does not differ between
regular and over-temperature shutdown
A36
USB6-
USB 2.0 Data Pair Port 6 –
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port; PU
1.5kOhm +/-5% on Upstream Facing Port
A37
USB6+
USB 2.0 Data Pair Port 6 +
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port; PU
1.5kOhm +/-5% on Upstream Facing Port
A38
USB_6_7_OC#
USB Overcurrent Indicator Port 6/7
I-3.3
PU 10k 3.3V (S5)
-
A39
USB4-
USB 2.0 Data Pair Port 4 -
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port; PU
1.5kOhm +/-5% on Upstream Facing Port
A40
USB4+
USB 2.0 Data Pair Port 4 +
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port; PU
1.5kOhm +/-5% on Upstream Facing Port
A41
GND
Power Ground
PWR GND
-
-
A42
USB2-
USB 2.0 Data Pair Port 2 –
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port; PU
1.5kOhm +/-5% on Upstream Facing Port
A43
USB2+
USB 2.0 Data Pair Port 2 +
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port; PU
1.5kOhm +/-5% on Upstream Facing Port
A44
USB_2_3_OC#
USB Overcurrent Indicator Port 2/3
I-3.3
PU 15k in CPLD (S5)
resistor value can range from 5kOhm to 25kOhm
A45
USB0-
USB 2.0 Data Pair Port 0 –
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port; PU
1.5kOhm +/-5% on Upstream Facing Port
A46
USB0+
USB 2.0 Data Pair Port 0 +
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port; PU
1.5kOhm +/-5% on Upstream Facing Port
A47
VCC_RTC
Real-Time Clock Circuit Power Input
PWR 3V
-
voltage range 2.5-3.47V
A48
EXCD0_PERST#
Express Card Reset Port 0
O-3.3
-
-
A49
EXCD0_CPPE#
Express Card Capable Card Request Port 0
I-3.3
PU 10k 3.3V (S0)
-
A50
LPC_SERIRQ
Serial Interrupt Request
I/OD-3.3
PU 20k in CPU
-
A51
GND
Power Ground
PWR GND
-
-
A52
RSVD
Reserved for future use
nc
-
-
A53
RSVD
Reserved for future use
nc
-
-
A54
GPI0/SD_DATA0
General Purpose Input 0 (shared SD DATA0)
I-3.3
PU 100k 3.3V (S0)
-
A55
RSVD
Reserved for future use
nc
-
-
A56
RSVD
Reserved for future use
nc
-
-
A57
GND
Power Ground
PWR GND
-
-
45
COMe-mBT10 / Pinout List
A58
PCIE_TX3+
PCI Express Lane 3 Transmit +
DP-O
-
-
A59
PCIE_TX3-
PCI Express Lane 3 Transmit -
DP-O
-
-
A60
GND
Power Ground
PWR GND
-
A61
PCIE_TX2+
PCI Express Lane 2 Transmit +
DP-O
-
-
A62
PCIE_TX2-
PCI Express Lane 2 Transmit -
DP-O
-
-
A63
GPI1/SD_DATA1
General Purpose Input 1 (shared SD DATA1)
I-3.3
PU 100k 3.3V (S0)
-
A64
PCIE_TX1+
PCI Express Lane 1 Transmit +
DP-O
-
-
A65
PCIE_TX1-
PCI Express Lane 1 Transmit -
DP-O
-
-
A66
GND
Power Ground
PWR GND
-
-
A67
GPI2/SD_DATA2
General Purpose Input 2 (shared SD DATA2)
I-3.3
PU 100k 3.3V (S0)
A68
PCIE_TX0+
PCI Express Lane 0 Transmit +
DP-O
-
-
A69
PCIE_TX0-
PCI Express Lane 0 Transmit -
DP-O
-
-
A70
GND
Power Ground
PWR GND
-
-
A71
LVDS_A0+/eDP_TX2+
LVDS Channel A Data0 + (shared eDP TX2+)
DP-O
-
configuration as eDP_TX0+ in customised article
version possible
A72
LVDS_A0-/eDP_TX2-
LVDS Channel A Data0 - (shared eDP TX2-)
DP-O
-
configuration as eDP_TX0- in customised article
version possible
A73
LVDS_A1+/eDP_TX1+
LVDS Channel A Data1 + (shared eDP TX1+)
DP-O
-
configuration as eDP_TX1+ in customised article
version possible
A74
LVDS_A1-/eDP_TX1-
LVDS Channel A Data1 - (shared eDP TX1-)
DP-O
-
configuration as eDP_TX1- in customised article
version possible
A75
LVDS_A2+/eDP_TX0+
LVDS Channel A Data2 + (shared eDP TX0+)
DP-O
-
configuration as eDP_TX2+ in customised article
version possible
A76
LVDS_A2-/eDP_TX0-
LVDS Channel A Data2 - (shared eDP TX0-)
DP-O
-
configuration as eDP_TX2- in customised article
version possible
A77
LVDS/eDP_VDD_EN
LVDS (or eDP) Panel Power Control
O-3.3
PD 100k
configuration as eDP_VDD_EN in customised article
version possible
A78
LVDS_A3+
LVDS Channel A Data3 +
DP-O
-
-
A79
LVDS_A3-
LVDS Channel A Data3 -
DP-O
-
-
A80
GND
Power Ground
PWR GND
-
-
A81
LVDS_A_CK+/eDP_TX3+
LVDS Channel A Clock (shared eDP TX3+)
DP-O
-
configuration as eDP_TX3+ in customised article
version possible
A82
LVDS_A_CK-/eDP_TX3-
LVDS Channel A Clock - (shared eDP TX3-)
DP-O
-
configuration as eDP_TX3- in customised article
version possible
A83
LVDS_I2C_CK/eDP_AUX+
LVDS Data Channel Clock (shared eDP AUX+)
I/O-3.3
PU 2k21 3.3V (S0)
configuration as eDP_AUX+ in customised article
version possible
A84
LVDS_I2C_DAT/eDP_AUX-
LVDS Data Channel Data (shared eDP AUX-)
I/O-3.3
PU 2k21 3.3V (S0)
configuration as eDP_AUX- in customised article
version possible
A85
GPI3/SD_DATA3
General Purpose Input 3 (shared SD DATA3)
I-3.3
PU 100k 3.3V (S0)
-
A86
RSVD
Reserved for future use
nc
-
-
A87
RSVD/eDP_HPD
Reserved (shared eDP hot plug detection)
nc/I-3.3
-
configuration as eDP_HPD in customised article
version possible
A88
PCIE_CLK_REF+
Reference PCI Express Clock +
DP-O
-
-
A89
PCIE_CLK_REF-
Reference PCI Express Clock -
DP-O
-
-
A90
GND
Power Ground
PWR GND
-
-
A91
SPI_POWER
3.3V Power Output Pin for external SPI flash
O-3.3
-
might be powered during suspend
A92
SPI_MISO
SPI Master IN Slave OUT
I-3.3
PD 20k in CPU (SPI)
All SPI signals are tri-stated with 20k ohm CPU
internal weak pull-up until reset is deasserted
A93
GPO0/SD_CLK
General Purpose Output 0 (shared SD clock)
O-3.3
PD 100k
-
A94
SPI_CLK
SPI Clock
O-3.3
PD 20k in CPU (SPI)
All SPI signals are tri-stated with 20k ohm CPU
internal weak pull-up until reset is deasserted
A95
SPI_MOSI
SPI Master Out Slave In
O-3.3
PD 20k in CPU (SPI)
All SPI signals are tri-stated with 20k ohm CPU
internal weak pull-up until reset is deasserted
A96
TPM_PP
TPM Physical Presence
nc
-
TPM_PP not supported by used TPM
A97
TYPE10#
Pull down for TYPE 10 module
nc
PD 47k
-
A98
SER0_TX
Serial Port 0 TXD
O-3.3
-
20V protection circuit implemented on module, PD on
carrier board needed for proper operation
A99
SER0_RX
Serial Port 0 RXD
I-5T
PU 47k 3.3V (S0)
20V protection circuit implemented on module
A100
GND
Power Ground
PWR GND
-
-
A101
SER1_TX
Serial Port 1 TXD
O-3.3
-
20V protection circuit implemented on module, PD on
carrier board needed for proper operation
A102
SER1_RX
Serial Port 1 RXD
I-5T
PU 47k 3.3V (S0)
20V protection circuit implemented on module
A103
LID#
LID Switch Input
I-3.3
PU 47k 3.3V (S5)
20V protection circuit implemented on module
A104
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
A105
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
A106
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
A107
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
A108
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
A109
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
A110
GND
Power Ground
PWR GND
-
-
46
COMe-mBT10 / Pinout List
6.3
Connector X1A Row B
Pin
Signal
Description
Type
Termination
Comment
B1
GND
Power Ground
PWR GND
-
-
B2
GBE0_ACT
Ethernet Activity LED
OD
-
-
B3
LPC_FRAME#
LPC Frame Indicator
O-3.3
PU 20k in CPU (S0)
-
B4
LPC_AD0
LPC Multiplexed Command, Address & Data 0
I/O-3.3
PU 20k in CPU (S0)
-
B5
LPC_AD1
LPC Multiplexed Command, Address & Data 1
I/O-3.3
PU 20k in CPU (S0)
-
B6
LPC_AD2
LPC Multiplexed Command, Address & Data 2
I/O-3.3
PU 20k in CPU (S0)
-
B7
LPC_AD3
LPC Multiplexed Command, Address & Data 3
I/O-3.3
PU 20k in CPU (S0)
-
B8
LPC_DRQ0#
LPC Serial DMA/Master Request 0
I-3.3
PU 15k in CPLD (S5)
resistor value can range from 5kOhm to 25kOhm
B9
LPC_DRQ1#
LPC Serial DMA/Master Request 1
I-3.3
PU 15k in CPLD (S5)
resistor value can range from 5kOhm to 25kOhm
B10
LPC_CLK
33MHz LPC clock
O-3.3
PD 20k in CPU
33MHz at E38xx CPUs and 25MHz at other CPUs
-
B11
GND
Power Ground
PWR GND
-
B12
PWRBTN#
Power Button
I-3.3
PU 10k 3.3V (S5eco)
-
B13
SMB_CK
SMBUS Clock
O-3.3
PU 2k9 3.3V (S5)
-
B14
SMB_DAT
SMBUS Data
I/O-3.3
PU 2k9 3.3V (S5)
-
B15
SMB_ALERT#
SMBUS Alert
I/O-3.3
PU 10k 3.3V (S5)
-
B16
SATA1_TX+
SATA 1 Transmit Pair +
DP-O
-
-
B17
SATA1_TX-
SATA 1 Transmit Pair -
DP-O
-
-
B18
SUS_STAT#
Suspend Status
O-3.3
-
-
B19
SATA1_RX+
SATA 1 Receive Pair +
DP-I
-
B20
SATA1_RX-
SATA 1 Receive Pair -
DP-I
-
-
B21
GND
Power Ground
PWR GND
-
-
B22
USB_SSTX0-
USB 3.0 Transmit Pair 0 +
DP-O
-
-
B23
USB_SSTX0+
USB 3.0 Transmit Pair 0 -
DP-O
-
-
B24
PWR_OK
Power OK
I-5T
PU 61k 3.3V
pullup voltage is S0 in ATX mode/ S5 in single
supply mode / 5V tolerant
B25
USB_SSTX1-
USB 3.0 Transmit Pair 1 +
DP-I
-
-
B26
USB_SSTX1+
USB 3.0 Transmit Pair 1 -
DP-I
-
-
B27
WDT
Watch Dog Time-Out event
O-3.3
-
-
B28
AC/HDA_SDIN2
HD Audio Serial Data In 2
nc
-
SDIN2 is not supported by COMe-mBT10
B29
AC/HDA_SDIN1
HD Audio Serial Data In 1
I-3.3
PD 20k in CPU
-
B30
AC/HDA_SDIN0
HD Audio Serial Data In 0
I-3.3
PD 20k in CPU
-
B31
GND
Power Ground
PWR GND
-
-
B32
SPKR
Speaker
O-3.3
PU 20k in CPU (S0)
-
B33
I2C_CK
I2C Clock
O-3.3
PU 2k21 3.3V (S5)
-
B34
I2C_DAT
I2C Data
I/O-3.3
PU 2k21 3.3V (S5)
-
B35
THRM#
Over Temperature Input
I-3.3
PU 10k 3.3V (S0)
no function implemented
B36
USB7-
USB 2.0 Data Pair Port 7 –
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port;
PU 1.5kOhm +/-5% on Upstream Facing Port
B37
USB7+
USB 2.0 Data Pair Port 7 +
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port;
PU 1.5kOhm +/-5% on Upstream Facing Port
B38
USB_4_5_OC#
USB Overcurrent Indicator Port 4/5
I-3.3
PU 10k 3.3V (S5)
-
B39
USB5-
USB 2.0 Data Pair Port 5 –
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port;
PU 1.5kOhm +/-5% on Upstream Facing Port
B40
USB5+
USB 2.0 Data Pair Port 5 +
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port;
PU 1.5kOhm +/-5% on Upstream Facing Port
B41
GND
Power Ground
PWR GND
-
-
B42
USB3-
USB 2.0 Data Pair Port 3 –
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port;
PU 1.5kOhm +/-5% on Upstream Facing Port
B43
USB3+
USB 2.0 Data Pair Port 3 +
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port;
PU 1.5kOhm +/-5% on Upstream Facing Port
B44
USB_0_1_OC#
USB Overcurrent Indicator Port 0/1
I-3.3
PU 15k in CPLD (S5)
resistor value can range from 5kOhm to 25kOhm
B45
USB1-
USB 2.0 Data Pair Port 1 –
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port;
PU 1.5kOhm +/-5% on Upstream Facing Port
B46
USB1+
USB 2.0 Data Pair Port 1 +
DP-I/O
PD/PU in CPU
PD 15kOhm +/-5% on Downstream Facing Port;
PU 1.5kOhm +/-5% on Upstream Facing Port
B47
EXCD1_PERST#
Express Card Reset Port 1
O-3.3
-
-
B48
EXCD1_CPPE#
Express Card Capable Card Request Port 1
I-3.3
PU 10k 3.3V (S0)
-
B49
SYS_RESET#
Reset Button Input
I-3.3
PU 10k 3.3V (S5)
-
B50
CB_RESET#
Carrier Board Reset
O-3.3
-
-
B51
GND
Power Ground
PWR GND
-
-
B52
RSVD
Reserved for future use
nc
-
-
B53
RSVD
Reserved for future use
nc
-
-
B54
GPO1
General Purpose Output 1
O-3.3
PD 100k
-
B55
RSVD
Reserved for future use
nc
-
-
B56
RSVD
Reserved for future use
nc
-
-
B57
GPO2/SD_WP
General Purpose Output 2 (shared SD wr. protect)
O-3.3
PD 100k
-
47
COMe-mBT10 / Pinout List
B58
PCIE_RX3+
PCI Express Lane 3 Receive +
DP-I
-
B59
PCIE_RX3-
PCI Express Lane 3 Receive -
DP-I
-
-
B60
GND
Power Ground
PWR GND
-
-
B61
PCIE_RX2+
PCI Express Lane 2 Receive +
DP-I
-
-
B62
PCIE_RX2-
PCI Express Lane 2 Receive -
DP-I
-
-
B63
GPO3/SD_CD#
General Purpose Output 3 (shared SD card detect)
O-3.3
PD 100k
-
B64
PCIE_RX1+
PCI Express Lane 1 Receive +
DP-I
-
-
B65
PCIE_RX1-
PCI Express Lane 1 Receive -
DP-I
-
-
B66
WAKE0#
PCI Express Wake Event
I-3.3
PU 10k 3.3V (S5)
-
B67
WAKE1#
General Purpose Wake Event
I-3.3
PU 10k 3.3V (S5)
-
B68
PCIE_RX0+
PCI Express Lane 0 Receive +
DP-I
-
-
B69
PCIE_RX0-
PCI Express Lane 0 Receive -
DP-I
-
-
B70
GND
Power Ground
PWR GND
-
-
B71
DDI0_PAIR0+
Display Port 0 lane 0 +
DP-O
-
-
B72
DDI0_PAIR0-
Display Port 0 lane 0 -
DP-O
-
-
B73
DDI0_PAIR1+
Display Port 0 lane 1 +
DP-O
-
-
B74
DDI0_PAIR1-
Display Port 0 lane 1 -
DP-O
-
-
B75
DDI0_PAIR2+
Display Port 0 lane 2 +
DP-O
-
-
B76
DDI0_PAIR2-
Display Port 0 lane 2 -
DP-O
-
-
B77
DDI0_PAIR4+
Display Port 0 lane 4 +
nc
-
not used by COMe-mBT10
B78
DDI0_PAIR4-
Display Port 0 lane 4 -
nc
-
not used by COMe-mBT10
B79
LVDS/eDP_BKLT_EN
Panel Backlight On
O-3.3
PD 100k
configuration as eDP_BKLT_EN in customised
article version possible
B80
GND
Power Ground
PWR GND
-
-
B81
DDI0_PAIR3+
Display Port 0 lane 3 +
DP-O
-
-
B82
DDI0_PAIR3-
Display Port 0 lane 3 -
DP-O
-
-
B83
LVDS_BKLT_CTRL
Backlight Brightness Control
O-3.3
-
-
B84
VCC_5V_SBY
5V Standby
PWR 5V (S5)
-
optional (not neccessary in single supply mode)
B85
VCC_5V_SBY
5V Standby
PWR 5V (S5)
-
optional (not neccessary in single supply mode)
B86
VCC_5V_SBY
5V Standby
PWR 5V (S5)
-
optional (not neccessary in single supply mode)
B87
VCC_5V_SBY
5V Standby
PWR 5V (S5)
-
optional (not neccessary in single supply mode)
B88
BIOS_DIS1#
BIOS Selection Strap 1
I-3.3
PU 10k 3.3V (SPI)
PU might be powered during suspend
B89
DDI0_HPD
Display Port 0
I-3.3
PD 100k
-
B90
GND
Power Ground
PWR GND
-
-
B91
DDI0_PAIR5+
Display Port 0 lane 5 +
nc
-
not used by COMe-mBT10
B92
DDI0_PAIR5-
Display Port 0 lane 5 -
nc
-
not used by COMe-mBT10
B93
DDI0_PAIR6+
Display Port 0 lane 6 +
nc
-
not used by COMe-mBT10
B94
DDI0_PAIR6-
Display Port 0 lane 6 -
nc
-
not used by COMe-mBT10
B95
DDI0_DDC_AUX_SEL
Display Port 0 selection between AUX and DDC
I-3.3
PD 1MEG
-
B96
USB_HOST_PRSNT
USB host presence detect
nc
-
not used by COMe-mBT10
B97
SPI_CS#
SPI Chip Select
O-3.3
-
-
B98
DDI0_CTRLCLK_AUX+
Multiplexed DDI0 Data Channel Clock & AUX +
I/O-3.3
PD 100k
2k21 PU (S0) when DDI0_DDC_AUX_SEL is high
B99
DDI0_CTRLDATA_AUX-
Multiplexed DDI0 Data Channel Data & AUX -
I/O-3.3
PU 100k 3.3V (S0)
2k21 PU (S0) when DDI0_DDC_AUX_SEL is high
B100
GND
Power Ground
PWR GND
-
-
B101
FAN_PWMOUT
Fan PWM Output
O-3.3
-
20V protection circuit implemented on module,
PD on carrier board needed for proper operation
B102
FAN_TACHIN
Fan Tach Input
I-3.3
PU 47k 3.3V (S0)
20V protection circuit implemented on module
B103
SLEEP#
Sleep Button Input
I-3.3
PU 47k 3.3V (S5)
20V protection circuit implemented on module
B104
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
B105
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
B106
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
B107
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
B108
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
B109
VCC_12V
Main Input Voltage (8.5-20V)
PWR
-
-
B110
GND
Power Ground
PWR GND
-
-
The termination resistors in these tables are already mounted on the module. Refer to the
design guide for information about additional termination resistors.
48
COMe-mBT10 / BIOS Operation
7
BIOS Operation
The BIOS (Basic Input and Output System) or UEFI (Unified Extensible Firmware Interface) records hardware parameters
of the system in the CMOS on the Computer-on-Module. It's major functions include execution of the POST(Power-On-SelfTest) during system start-up, saving system parameters and loading the operating system. The BIOS includes a BIOS
Setup programm that allows to modify system configuration settings. The module is equipped with Phoenix SecureCore,
which is located in an onboard SPI serial flash memory.
7.1
Determining the BIOS Version
To determine the BIOS version currently used on the Computer-on-Modules please check System Information Page inside
Setup
7.2
BIOS Update
Kontron provides continuous BIOS updates for Computer-on-Modules. The updates are provided for download on
http://emdcustomersection.kontron.com with detailed change descriptions within the according Product Change
Notification (PCN). Please register for EMD Customer Section to get access to BIOS downloads and PCN service.
Modules with BIOS Region/Setup only inside the flash can be updated with AFU utilities (usually 1-3MB BIOS binary file
size) directly. Modules with Intel® Management Engine, Ethernet, Flash Descriptor and other options additionally to the
BIOS Region (usually 4-16MB BIOS binary file size) requires a different update process with Intel Flash Utility FPT and a
wrapper to backup and restore configurations and the MAC address. Therefore it is strongly recommended to use the batch
file inside the BIOS download package available on EMD Customer Section.
» Boot the module to DOS/EFI Shell with access to the BIOS image and Firmware Update Utility provided on EMD
Customer Section
» Execute Flash.bat in DOS or Flash.nsh in EFI Shell
Any modification of the update process may damage your module!
7.3
POST Codes
Important POST codes during boot-up
8B
Booted to DOS
68
Booted to Setup / EFI Shell
00
Booted to Windows
7.4
Setup Guide
The Setup Utility changes system behavior by modifying the Firmware configuration. The setup program uses a number of
menus to make changes and turn features on or off.
Functional keystrokes in POST:
[F2]
Enter Setup
[F5]
Boot Menu
[ESC] + [2]
Enter Setup via Remote Keyboard in Console Redirection Mode (depending on console Settings F2 may not be supported)
Functional keystrokes in Setup:
[F1]
Help
[F9]
Load default settings
[F10]
Save and Exit
49
COMe-mBT10 / BIOS Operation
Menu Bar
The menu bar at the top of the window lists different menus. Use the left/right arrow keys to make a selection.
Legend Bar
Use the keys listed in the legend bar on the bottom to make your selections or exit the current menu. The table below
describes the legend keys and their alternates.
Key
Function
← or → Arrow key
Select a menu.
↑ or ↓ Arrow key
Select fields in current menu.
<Home> or <End>
Move cursor to top or bottom of current window.
<PgUp> or <PgDn>
Move cursor to next or previous page.
+/- or F5/F6
Change Option
<Enter>
Execute command or select submenu.
Selecting an Item
Use the ↑ or ↓ key to move the cursor to the field you want. Then use the + and – keys to select a value for that field. The
Save Value commands in the Exit menu save the values displayed in all the menus.
Displaying Submenus
Use the ← or → key to move the cursor to the submenu you want. Then press <Enter>. A pointer ( ►) marks all submenus.
Item Specific Help Window
The Help window on the right side of each menu displays the Help text for the selected item. It updates as you move the
cursor to each field.
General Help Window
Pressing <F1> on a menu brings up the General Help window that describes the legend keys and their alternates. Press
<Esc> to exit the General Help window.
50
COMe-mBT10 / BIOS Operation
7.5
BIOS Setup
7.5.1
Main
Feature
Options
Description
System Date
[mm/dd/yyyy]
Set the Date. Use 'Tab' to switch between Date elements
System Time
[hh:mm:ss]
Set the Time. Use 'Tab' to switch between Time elements
51
COMe-mBT10 / BIOS Operation
System Information
52
COMe-mBT10 / BIOS Operation
Boot Features
Feature
Options
Description
NumLock
On
Off
Selects Power-on state for NumLock
Timeout
1
Number of seconds that P.O.S.T will wait for the user input before booting
CSM Support
Yes
No
Enables or Disables the UEFI CSM (Compatibility Support Module)to support legacy PC boot process. Both legacy and UEFI
boots are feasible
Quick Boot
Disabled
Enabled
Enable or Disable Quick Boot
Dark Boot
Disabled
Enabled
Enable or Disable Dark Boot
Diagnostic Splash Screen
Disabled
Enabled
Enable or Disable the Diagnostic Splash Screen
Diagnostic Summary Screen Disabled
Enabled
Display the Diagnostic Summary Screen during boot
BIOS Level USB
Enabled
Disabled
Enable/Disable all BIOS support for USB in order to reduce boot time. Note that this will prevent using a USB keyboard in
setup or a USB biometric scanner such as a fingerprint reader to control access to setup, but does not prevent the
operating system from supporting such hardware
USB Legacy
Enabled
Disabled
Enable/Disable USB BIOS SMM support for mouse, keyboard, mass storage, etc, in legacy operating systems such as DOS
Console Redirection
Disabled
Enabled
Enable/Disable Universal Console Redirection
- Console Port
All
Onboard COM1
Onboard COM2
SIO COM1
SIO COM2
Select Port for console redirection. Note: the respective port has to be enabled in setup!
- Terminal Type
ANSI
VT100
VT100+
UTF8
Set terminal type of UCR
- Baudrate
9600
19200
38400
57600
115200
Set terminal type of UCR
- Flow Control
None
RTS/CTS
XON/XOFF
Set flow control method for UCR. None = No flow control, RTS/CTS = Hardware flow control, XON/XOFF = Software flow
control
- Continue C.R. after POST
Enabled
Disabled
Enables Console Redirection after OS has loaded
Allow Hotkey in S4 resume
Enabled
Disabled
Enable hotkey detection when system resuming from Hybernate state
UEFI Boot
Enabled
Disabled
Enable the UEFI boot
Legacy Boot
Enabled\Disabled
Enable the Legacy boot
Boot in Legacy Video Mode
Disabled
Enabled
Enable to force the display adapter to switch the video mode to Text Mode 3 at the end of BIOS POST for non-UEFI boot
mode (Legacy Boot). Some legacy software, such as DUET, requires that the BIOS explicitly enter text video mode prior to
boot
Load OPROM
On Demand
All
Load all OPROMs or on demand according to the boot device
Boot Priority
UEFI First
Legacy First
Select priority of boot option between UEFI and Legacy
53
COMe-mBT10 / BIOS Operation
Platform Information
54
COMe-mBT10 / BIOS Operation
7.5.2
Advanced
Feature
Options
Description
OS Selection
Windows
Linux
Android
Select the Operating System family to be booted
55
COMe-mBT10 / BIOS Operation
Miscellaneous
Feature
Options
Description
I2C Speed
100
Select I2C Bus Speed in kHz from 1kHz to 400kHz
S5 Eco
Disabled
Enabled
Enable/Disable Kontron S5 Eco mode. Reduces supply current in Soft Off (S5) to less than 1mA. If enabled, power button is
the only wake-up source in S5! See chapter S5 Eco for further details
Smart Battery Configuration
Disabled
Auto
Charger
Manager
Enable/Disable Smart Battery System Support (e.g. Kontron M.A.R.S.)
Reset Button Behavior
Chipset Reset
Power Cycle
Select the system behavior on reset button event
56
COMe-mBT10 / BIOS Operation
Watchdog
Feature
Options
Description
Auto-reload
Disabled
Enabled
Enable automatic reload of watchdog timers on timeout
Global Lock
Disabled
Enabled
If set to enabled, all Watchdog registers (except WD_KICK) become read only until the board is reset
Stage 1 Mode
Disabled
Reset
NMI
SCI
Delay
Select Action for first Watchdog stage
- Assert WDT Signal
Enabled
Disabled
Enable/Disable assertion of WDT signal to baseboard on stage timeout
- Stage 1 Timeout
1s
5s
10s
30s
1m
3m
10m
30m
Select Timeout value for first watchdog stage
Stage 2 Mode
Disabled
Reset
NMI
SCI
Select Action for second Watchdog stage
- Assert WDT Signal
Disabled
Enabled
Enable/Disable assertion of WDT signal to baseboard on stage timeout
- Stage 2 Timeout
1s
5s
10s
30s
1m
3m
10m
30m
Select Timeout value for second watchdog stage
57
COMe-mBT10 / BIOS Operation
H/W Monitor
Feature
Value/Options
Description
CPU Temperature (Analog)
xx°C
Shows the measured temperature of the CPU Diode with onboard HWM
CPU Temperature (DTS)
xx°C
Shows the internal digital CPU temperature (DTS)
Module Temperature
xx°C
Shows the internal hardware-monitor temperature
CPU FAN
xxxx rpm
Shows the fan speed of onboard FAN connector
Fan Pulse
2
Number of pulses the CPU fan produces during one revolution. Range 1-4
FAN Control
Disabled
Manual
Auto
Set fan control mode. 'Disable' will totally stop the fan
Fan Trip Point
45
Temperature where fan accelerates. Range 20 - 80°C
Fan Speed
70
Manual fan speed in %. Minimum value is 30 (in Manual mode only)
Trip Point Speed
50
Fan speed at trip point in %. Minimum value is 30. Fan always runs at 100% at Tjmax - 10°C
Reference Temperature
CPU Temperature (Analog)
Module Temperature
Determines the temperature source which is used for automatic fan control
External FAN
xxxx rpm
Shows the fan speed of external COMe FAN
Fan Pulse
2
Select the number of pulses the external fan produces during one revolution. Range 1-4
FAN Control
Disabled
Manual
Auto
Set fan control mode. 'Disable' will totally stop the fan
Fan Trip Point
45
Temperature where fan accelerates. Range 20 - 80°C
Fan Speed
70
Manual fan speed in %. Minimum value is 30 (in Manual mode only)
Trip Point Speed
50
Fan speed at trip point in %. Minimum value is 30. Fan always runs at 100% at Tjmax - 10°C
Reference Temperature
CPU Temperature (Analog)
Module Temperature
Determines the temperature source which is used for automatic fan control
Widerange Vcc
x.xx V
Shows the Module Main Input Voltage
5.0V Standby
x.xx V
Shows the 5V Standby Voltage input
Batt volt at COMe pin
x.xx V
Shows the RTC Battery Voltage input measured at COMe connector
58
COMe-mBT10 / BIOS Operation
CPU Configuration
Feature
Options
Description
Execute Disable Bit
Enable
Disable
Execute Disable Bit prevent certain classes of malicious buffer overflow attacks when combined with a supporting OS
Limit CPUID Maximum
Enable
Disable
Disabled for Windows XP
Bi-directional PROCHOT# Enable
Disable
When a processor thermal sensor trips (either core), the PROCHOT# will be driven. If bi-direction is enabled, external agents can drive
PROCHOT# to throttle the processor
VTX-2
Enable
Disable
Enables or Disables the VT-x2 Mode support
TM1
Enable
Disable
Enables or Disables the Thermal Management 1 support
DTS
Enable
Disable
Enables or Disables the Digital Thermal Sensor
59
COMe-mBT10 / BIOS Operation
CPU Power Management
Feature
Options
Description
Intel® SpeedStep(TM)
Enabled
Disabled
Enable/Disable processor performance states (P-States)
Boot Performance Mode
Max Performance
Max Battery
Select the performance state that the BIOS sets before OS hand-off
Intel® Turbo Boost Technology
Enabled
Disabled
Enable to automatically allow processor cores to run faster then the base operating frequency if it's operating below
power, current, and temperature specification limits. This option is only valid for CPUs supporting Intel® Turbo Boost
Technology
C-States
Enabled
Disabled
Enable processor idle power saving states
Enhanced C-States
Enabled
Disabled
Enables or Disables C1E/C2E/C4E. When enabled, CPU will switch to minimum speed when all cores enter C-State
Max C-State
C7
C6
C1
Controls the maximum C-State allowed for the processor
60
COMe-mBT10 / BIOS Operation
Uncore Configuration
Feature
Options
Description
Integrated Graphics Device
Disable
Enable
Enable: enable Integrated Graphics Device (IGD) when selected as the Primary Video Adaptor. Disable: Always disable IGD
Primary Display
Auto
IGD
PCIe
SG
Select which of IGD/PCIe Graphics Devices should be Primary Display or select SG for Switchable/Hybrid Graphics
RC6 (Render Standby)
Disable
Enable
Enable or Disable Render Standby support
GTT Size
1MB
2MB
Select the GTT Memory Size of IGD
Aperture Size
128MB
256MB
512MB
Select the Graphics Aperture Size
DVMT Pre-Allocated
64M
96M
128M
160M
192M
224M
256M
288M
320M
352M
384M
416M
448M
480M
512M
Select DVMT 5.0 Pre-Allocated (fixed) Graphics Memory size used by the Internal Graphics device
IGD Turbo
Auto
Enable
Disable
Select the IGD Turbo feature
Spread Spectrum clock
Disable
Enable
Enable or Disable clock chip Spread Spectrum feature
61
COMe-mBT10 / BIOS Operation
IGD - LCD Control
Feature
Options
Description
IGD - Boot Type
Auto
EFP
LFP
Select the Integrated Graphics Video Device activated during POST. LFP = Local Flat Panel (LVDS/eDP). EFP =
External Flat Panel (Display Port)
IGD - Secondary Boot Type
Disabled
EFP
LFP
Select Secondary Display Device
LFP Type
Select LFP used by Internal Graphics Device by selecting the appropriate panel setup item
AUTO
VGA 640×480 1×18
WVGA 800×480 1×18
SVGA 800×600 1×18
XGA 1024×768 1×18
XGA 1024×768 1×24
WXGA 1280×768 1×24
WXGA 1280×800 1×18
WXGA 1366×768 1×24
WSVGA 1024×600 1×18
WSVGA 1024×600 1×24
Custom
PAID
Backlight Control
None/External
PWM
PWM Inverted
I2C
I2C Inverted
Backlight Control Setting
Backlight Value
128
Set LCD backlight brightness (0-255)
LVDS Clock Center Spreading
No Spreading
0.5%
1.0%
1.5%
2.0%
2.5%
Select LVDS clock frequency center spreading depth
EFP1 Type
DisplayPort Only
DP with HDMI/DVI
HDMI/DVI
Integrated HDMI/DisplayPort Configuration with External Connectors
Mode Persistence
Disabled
Enabled
Enables/Disables Mode Persistence
Center Mode
Disabled
EFP
Select the Display Device that should be centered
62
COMe-mBT10 / BIOS Operation
System Component
Feature
Options
Description
PNP Setting
Disable
Power & Performance
Ax Stepping
Bx Stepping
Select PNP setting mode, Disable, Performance, Power or Power&Performance mode
63
COMe-mBT10 / BIOS Operation
LAN Configuration
Feature
Options
Description
PXE ROM
Disabled
Onboard only
Addon only
Both
Enable/Disable PXE Option ROM execution for onboard LAN
64
COMe-mBT10 / BIOS Operation
South Cluster Configuration
65
COMe-mBT10 / BIOS Operation
PCI Express Configuration
Feature
Options
Description
PCIe Speed
Auto
Gen1
Gen2
Select PCIe Speed to Gen1 or Gen2
PCI Express Root Port
Disable
Enable
Control the PCI Express Root Port
66
COMe-mBT10 / BIOS Operation
USB Configuration
Feature
Options
Description
xHCI Mode
Smart Auto
Enable
Disable
Mode of operation of xHCI controller. This will also influence EHCI controller settings since certain combinations of those modes are
not allowed. 'SMART Auto' Mode is requied for OS with external Driver (e.g. Windows 7), 'Enabled' is recommended for OS with
integrated USB 3.0 Support (e.g. Windows 8). Please note, the USB HSIC Hub for COMe USB Ports #4-7 is linked to xHCI controller
which allows operation of these USB ports in OS with USB 3.0 driver only (no support in DOS or EFI Shell)
USB Per-Port Control
Disable
Enable
Controls each of the CPU USB ports (COMe USB #0-3)
- USB Port #0
- USB Port #1
- USB Port #2
- USB Port #3
Disabled
Enabled
Enable/Disable USB port
67
COMe-mBT10 / BIOS Operation
Audio Configuration
Feature
Options
Description
Audio Controller
Enable
Disable
Enable / Disable High Definition Audio interface
- HDAudio VCi Enable
Enable
Disable
Enable / Disable Virtual Channel 1 of Audio Controller
- HDAudio Docking Support Enable
Enable
Disable
Enable / Disable HDAudio Docking Support of Audio Controller
- HDAudio PMCE Enable
Enable
Disable
Enable / Disable Power Management capability of Audio Controller
- HDAudio HDMI Codec
Enable
Disable
Enable / Disable internal HDMI codec for HDAudio
HDA_SDI0
HDA_SDI0
Disable
HDAudio Codec connected on HDA_SDI0 signal
HDA_SDI1
HDA_SDI1
Disable
HDAudio Codec connected on HDA_SDI1 signal
68
COMe-mBT10 / BIOS Operation
SATA Drives
Feature
Options
Description
Chipset SATA
Enable
Disable
Enables or Disables the Chipset SATA Controller. The Chipset SATA controller supports the 2 internal SATA ports (up to 3Gb/s
supported per port)
SATA Test Mode
Disable
Enable
Enables or Disables the SATA Test Mode
Chipset SATA Mode
IDE
AHCI
IDE: compatibility mode, disables AHCI. AHCI: supports advanced SATA features such as NCQ. Warning: do not change after OS
install
SATA Port 0 Hot Plug Capability
Enable
Disable
If enabled, SATA port will be reported as HotPlug capable
SATA Port 1 Hot Plug Capability
Enable
Disable
If enabled, SATA port will be reported as HotPlug capable
69
COMe-mBT10 / BIOS Operation
LPSS & SCC Configuration
Feature
Options
Description
LPSS & SCC Devices Mode
ACPI Mode
PCI Mode
Select operation mode for Low Power Super Speed LPSS devices eMMC/SDCard. For eMMC full speed operation the LPSS mode
should be set to “ACPI”
SCC eMMC Boot Controller
Disable
Disable or select eMMC Boot mode
Auto Detect
eMMC 4.41
eMMC 4.5
eMMC 4.5 support
Disable
Enable
Enabled: eMMC 4.5, Disabled: eMMC 4.41
eMMC DDR50 Support
Disable
Enable
Enable / Disable DDR50 speed mode for eMMC
eMMC HS200 Support
Disable
Enable
Enable / Disable HS200 speed mode for eMMC. For eMMC full speed operation the HS200 mode should be enabled.
- eMMC retune timer value
8
Select the retune timer in HS200 mode
SCC SD Card Support
Use as GPIO
Enable
Switch between SDIO (Enable) or system GPIO on COMe GPIO0-3 interface
SD SDR 25 Support
Disable
Enable
Enable bus speed operation up to 25MB/s for SDCard (High Speed). Disable limits bus speed to 12.5MB/s (normal speed)
SD SDR 50 Support
Disable
Enable
Enable bus speed operation up to 50MB/s for SDCard (Ultra High Speed). Disabled activates SDR25 mode setting
70
COMe-mBT10 / BIOS Operation
Miscellaneous Configuration
Feature
Options
Description
High Precision Timer
Disable
Enable
Enables or Disables the High Precision Event Timer
Boot Time with HPET Timer
Disable
Enable
Boot time calculation with High Precision Event Timer enabled
State After G3
S0 State
S5 State
Specify what state to go to when power is re-applied after a power failure (G3 state). S0 = Power on, S5 = Stay off
SMM LOCK
Disable
Enable
Enables or Disables the SMM Lock feature. It will lock the SMRAM and unable load SMM driver any more
Pci Mmio Size
2GB
1.5GB
1.25GB
1GB
Select PCI MMIO Size
71
COMe-mBT10 / BIOS Operation
SMBIOS Event Log
Feature
Options
Description
Event Log
Disable
Enable
Enables or Disables the SMBIOS Event Log
Mark SMBIOS events as read
Enter
Mark SMBIOS events as read. Marked SMBIOS events won't be displayed
Clears SMBIOS events
Enter
Clear SMBIOS events
72
COMe-mBT10 / BIOS Operation
View SMBIOS event log
73
COMe-mBT10 / BIOS Operation
SuperIO Configuration
This setup option is only available with LPC SuperI/O Nuvoton 83627 present on the carrier board. By default the COMemBT10 supports the legacy interfaces of a 5V 83627HF(J) or 3.3V 83627DHG-P on external LPC. The SIO hardware monitor
is not supported in setup.
Feature
Options
Description
SIO Serial Port 0
Disabled
Enabled
Enable or Disable SIO Serial Port
- Base Address
3F8
2F8
3E8
2E8
Configure Serial Port Base Address
- IRQ
3
4
5
6
7
12
Configure Serial Port IRQ
SIO Serial Port 1
Disabled
Enabled
Enable or Disable SIO Serial Port
- Base Address
3F8
2F8
3E8
2E8
Configure Serial Port Base Address
- IRQ
3
4
5
6
7
12
Configure Serial Port IRQ
SIO Parallel Port
Disabled
Enabled
Enable or Disable SIO Parallel Port
- Device Mode
Standard Parallel Port
EPP
EPP & ECP
Configure Parallel Port Mode
- Base Address
378
278
3BC
Configure Parallel Port Base Address
74
COMe-mBT10 / BIOS Operation
Onboard UART Configuration
Feature
Options
Description
Serial Port 0
Disabled
Enabled
Enable or Disable Serial Port (COM) 0
Base Address
3F8
2F8
3E8
2E8
Configure Serial Port Base Address
IRQ
3
4
5
6
7
12
Configure Serial Port IRQ
Serial Port 1
Disabled
Enabled
Enable or Disable Serial Port (COM) 1
Base Address
3F8
2F8
3E8
2E8
Configure Serial Port Base Address
IRQ
3
4
5
6
7
12
Configure Serial Port IRQ
75
COMe-mBT10 / BIOS Operation
Memory ECC Error Logging
Feature
Options
Description
Error Logging
Disabled
Enabled
Enable Memory ECC Error Logging to SMBIOS Event Log. Please note that enabling ECC error logging is only useful on systems
equipped with ECC memory. Changing the settings on a non-ECC system will have no effect
- Single-Bit
Disabled
Enabled
Log single bit errors
- SECC Threshold
Disabled
Enabled
When the error times exceeds the threshold counter every time, then to record the event
- SECC Threshold Counter
20
Range from Min. to Max. ( ⇐ 65535)
- Multi-Bit
Disabled
Enabled
Log multi bit errors
- Halt on Uncorrectable Error
Disabled
Enabled
Controls whether to halt or not when uncorrectable errors are encountered
76
COMe-mBT10 / BIOS Operation
7.5.3
Security
Feature
Options
Description
Set Supervisor Password
Enter
Set or clear the Supervisor account's password
Supervisor Hint String
-
Press Enter to type Supervisor Hint String
Min. password length
1
Set the minimum number of characters for password (1-20)
TPM Support
Disabled
Enabled
This is used to decide whether TPM support should be enabled or disabled
TPM Options
Feature
Options
Description
TPM Action
No Change
Enable
Disable
Activate
Deactivate
Clear
Enable and Activate
Disable and Deactivate
Set Owner Install, with state=True
Set Owner Install, with state=False
Enable, Activate, and Set Owner Install with state=True
Disable, Deactivate, and Set Owner Install with state=False
Clear, Enable, and Activate
Require PP for provisioning
Do not require PP for provisioning
Require PP for clear
Do not require PP for clear
Enable, Activate, and clear
Enable, Activate, Clear, Enable, and Activate
Enact TPM Action
Omit Boot
Measurements
Disabled
Enabled
Enabling this option causes the system to omit recording boot device attempts in
PCR[4]
77
COMe-mBT10 / BIOS Operation
7.5.4
78
Boot
COMe-mBT10 / BIOS Operation
7.5.5
Exit
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Corporate Offices
Europe, Middle East & Africa
Lise-Meitner-Straße 3-5
86156 Augsburg
Germany
Tel.: +49 (0) 821 4086-0
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info@kontron.com
79
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Tel.: +1 888 294 4558
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FORTEC Elektronik AG
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