Dell PowerEdge T410 Technical Guide

PowerEdge T410
Technical Guide
Inspired by
professionals like
you, the T410 is
built to simplify
daily operations
and maximize
uptime.
Dell
This document is for informational purposes only. Dell reserves the right to make changes without
further notice to any products herein. The content provided is as is and without express or implied
warranties of any kind.
Dell, PowerEdge and Dell OpenManage are trademarks of Dell, Inc. Intel, Xeon, and SpeedStep are
registered trademarks and MMX is a trademark of Intel Corporation in the U.S. and other countries.
Broadcom is a registered trademark and NetXtreme is a trademark of Broadcom Corporation and/or
its affiliates in the United States, certain other countries and/or the EU. Emulex is a registered
trademark of Emulex Corporation. ENERGY STAR is a registered trademark of the U.S. Environmental
Protection Agency. eToken is a trademark of Aladdin Knowledge Systems, Ltd. Linux is a registered
trademark of Linus Torvalds. Matrox is a registered trademark of Matrox Electronic Systems Ltd.
Microsoft, Windows, Windows Server, SQL Server, Hyper-V, and BitLocker are either registered
trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.
Novell and SUSE are registered trademarks of Novell, Inc. in the United States and other countries.
Red Hat is a registered trademark of Red Hat, Inc. in the United States and other countries. Other
trademarks and trade names may be used in this document to refer to either the entities claiming
the marks and names or their products. Dell disclaims proprietary interest in the marks and names of
others.
©Copyright 2012 Dell Inc. All rights reserved. Reproduction or translation of any part of this work
beyond that permitted by U.S. copyright laws without the written permission of Dell Inc. is unlawful
and strictly forbidden.
December 2012 | Version 4.0
PowerEdge T410 Technical Guide
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Table of Contents
1
2
3
4
5
6
7
Product Comparison ........................................................................................... 6
1.1
Overview .................................................................................................. 6
1.2
Customer-Inspired Design ............................................................................... 6
1.3
Energy-Efficient .......................................................................................... 6
1.4
Easy to Manage ........................................................................................... 6
1.5
Comparison ............................................................................................... 7
Key Technologies............................................................................................... 9
System Overview ............................................................................................. 10
Mechanical .................................................................................................... 12
4.1
Chassis Description..................................................................................... 12
4.2
Dimensions and Weight ................................................................................ 12
4.3
Front Panel View and Features ...................................................................... 13
4.4
Back Panel View and Features ....................................................................... 14
4.5
Hard Drive LED Indicators ............................................................................. 15
4.6
Power Supply Indicators ............................................................................... 15
4.7
NIC Indicators ........................................................................................... 16
4.8
Internal Chassis Views ................................................................................. 16
4.9
Rails and Cable Management ......................................................................... 17
4.10 Fans ...................................................................................................... 17
4.11 Control Panel ........................................................................................... 17
4.11.1
LCD Panel Configuration ........................................................................ 17
4.11.2
LED Panel Configuration......................................................................... 18
4.12 Security .................................................................................................. 19
4.12.1
Cover Latch ....................................................................................... 19
4.12.2
Bezel ............................................................................................... 19
4.12.3
Hard Drive ......................................................................................... 19
4.12.4
TPM ................................................................................................. 19
4.12.5
Power Off Security ............................................................................... 19
4.12.6
Intrusion Alert .................................................................................... 19
4.12.7
Secure Mode ...................................................................................... 19
4.13 USB Key .................................................................................................. 19
4.14 Battery ................................................................................................... 20
4.15 Field Replaceable Units (FRU)........................................................................ 20
4.16 User Accessible Jumpers, Sockets, and Connectors ............................................... 20
Power, Thermal, Acoustic .................................................................................. 21
5.1
Power Supplies ......................................................................................... 21
5.2
Power Supply Specifications .......................................................................... 21
5.3
Heat Dissipation ........................................................................................ 21
5.4
Environmental Specifications......................................................................... 22
5.5
Maximum Input Amps .................................................................................. 22
5.6
ENERGY STAR Compliance ............................................................................ 22
5.7
Acoustics ................................................................................................ 23
Processors ..................................................................................................... 24
6.1
Overview ................................................................................................ 24
6.2
Features ................................................................................................. 25
6.3
Supported Processors .................................................................................. 25
6.4
Processor Configurations .............................................................................. 26
6.5
Processor Installation .................................................................................. 26
Memory ........................................................................................................ 27
7.1
Overview ................................................................................................ 27
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7.2
DIMMs Supported .......................................................................................
7.3
DIMM Population Rules ................................................................................
7.4
DIMM Slots ...............................................................................................
7.5
Low Voltage DIMMs.....................................................................................
7.6
Speed ....................................................................................................
7.7
Sparing ...................................................................................................
7.8
Mirroring .................................................................................................
7.9
Supported Configurations .............................................................................
8
Chipset ........................................................................................................
8.1
Overview ................................................................................................
8.2
Intel 5500 Chipset Features ..........................................................................
8.2.1
Intel QuickPath Interconnect ...................................................................
8.2.2
PCI Express Interfaces ...........................................................................
8.2.3
SMBus Interfaces .................................................................................
8.2.4
ESI interface ......................................................................................
8.3
Intel ICH10R South Bridge.............................................................................
8.3.1
SATA interface ....................................................................................
8.3.2
USB interface .....................................................................................
9
BIOS ............................................................................................................
9.1
Overview ................................................................................................
9.2
Supported ACPI States .................................................................................
9.3
BIOS Power Management ..............................................................................
9.4
I2C (Inter-Integrated Circuit) .........................................................................
10 Embedded NICs/LAN on Motherboard (LOM) .............................................................
11 I/O Slots .......................................................................................................
11.1 Overview ................................................................................................
11.2 Quantities and Priorities ..............................................................................
11.3 PCI Card Dimensions ...................................................................................
12 Storage ........................................................................................................
12.1 Overview ................................................................................................
12.2 Internal Hard Disk Drives ..............................................................................
12.3 RAID Configurations ....................................................................................
12.4 Storage Controllers ....................................................................................
12.4.1
SAS 6/iR ...........................................................................................
12.4.2
PERC 6/i ...........................................................................................
12.4.3
PERC H200 .........................................................................................
12.4.4
PERC H700 .........................................................................................
12.4.5
PERC H800 .........................................................................................
12.5 Optical Drives ...........................................................................................
12.6 Tape Drives .............................................................................................
13 Video ...........................................................................................................
14 Rack Information .............................................................................................
15 Operating Systems ...........................................................................................
16 Systems Management ........................................................................................
16.1 Overview ................................................................................................
16.2 Server Management ....................................................................................
16.3 Embedded Server Management ......................................................................
16.4 Dell Lifecycle Controller and Unified Server Configurator .......................................
16.5 Integrated Dell Remote Access Controller..........................................................
16.6 iDRAC6 Express .........................................................................................
16.7 iDRAC6 Enterprise ......................................................................................
16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media .............................................
17 Peripherals ....................................................................................................
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30
30
30
31
31
31
31
31
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32
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33
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34
35
35
35
35
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Appendix A. Statement of Volatility ..........................................................................
Appendix B. Certifications .....................................................................................
A.1
Regulatory Certifications .............................................................................
A.2
Product Safety Certifications .........................................................................
A.3
Electromagnetic Compatibility .......................................................................
A.4
Ergonomics, Acoustics and Hygienics ...............................................................
Appendix C. Additional Information and Options ...........................................................
49
53
53
53
54
55
56
Tables
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
Comparison of PowerEdge T410 to T310 and T610 ............................................... 7
Product Features Summary ........................................................................ 10
Power Supply Status ................................................................................ 16
Power Supply Specifications ....................................................................... 21
Heat Dissipation ..................................................................................... 21
Environmental Specifications ...................................................................... 22
Acoustical Performance ............................................................................ 23
Intel Xeon 5500 and 5600 Processor Series Overview .......................................... 24
Supported Processors ............................................................................... 25
Wake-Up States...................................................................................... 33
Supported Hard Drives.............................................................................. 36
Factory RAID Configurations ....................................................................... 36
Graphics Video Modes .............................................................................. 40
Unified Server Configurator Features and Description......................................... 44
Features List for Base Management Functionality, iDRAC6, and vFlash Media ............. 46
Volatility Table ...................................................................................... 49
Product Safety Certifications ...................................................................... 53
Electromagnetic Compatibility Certifications ................................................... 54
Ergonomics, Acoustics and Hygienics............................................................. 55
Industry Standards .................................................................................. 56
Figures
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
Chassis Dimensions ..................................................................................
Front View (With Bezel) ............................................................................
Front View (Cabled Hard Drive Chassis Without Bezel) ........................................
Front View (Hot-plug Hard Drive Chassis Without Bezel)......................................
Back View (Non-redundant Power Supply) ......................................................
Back View (Redundant Power Supplies Installed) ..............................................
Internal View (Cabled Hard Drive Configuration)...............................................
Internal View (Hot-plug Hard Drive Configuration) ............................................
LCD Control Panel ...................................................................................
LED Control Panel ...................................................................................
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15
16
17
18
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1 Product Comparison
1.1 Overview
Inspired by the requirements of and feedback from small-business, medium-business and corporate
users, the Dell™ PowerEdge™ T410 is a powerful, reliable server that delivers balanced high
performance. The T410 is a 2-socket tower server featuring Intel® Xeon® processor 5500 and 5600
series, DDR3 memory, and 6 hard drive bays that can accommodate 3.5‖ or 2.5‖ hard drives.
Featuring excellent acoustics for office environments as well as energy-efficient technologies, the
T410 deploys easily and is managed in a simplified, straightforward manner throughout its lifecycle.
1.2 Customer-Inspired Design
Inspired by our customers, the PowerEdge T410 was built to simplify daily operations and maximize
uptime. Consistent component layout and purposeful placement of interface ports and power
supplies enable easy installation and replacement. With a depth of 24‖ (617 mm), the PowerEdge
T410 chassis is easy to access and designed to reside in a back office, retail, or small office setting
where a small chassis and quiet acoustics matter.
Robust, metal hard drive carriers and organized cabling are designed to improve access to internal
components of the server, as well as airflow across them. The purposeful design of the T410 includes
an optional LCD screen positioned on the front panel for ease of monitoring.
1.3 Energy-Efficient
Energy efficiency is designed into the PowerEdge T410. Several Energy Smart standards-based
components reduce power consumption while providing increased performance. For example,
Energy Smart 90%+ efficient power supply units are right-sized for the system requirements of the
PowerEdge T410. Power management features include power capping, power inventory, and power
budgeting to best manage power in your specific environment.
1.4 Easy to Manage
The Dell PowerEdge T410 lets you focus on running your business rather than running your servers.
Dell OpenManage systems management software helps to automate common management tasks,
thereby enhancing efficiency, improving productivity, and reducing the potential for error (which can
cause downtime).
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1.5 Comparison
Table 1.
Comparison of PowerEdge T410 to T310 and T610
Feature
T310
T410
T610
Intel® Xeon® processor
5500 and 5600 series
Intel® Xeon® processor
5500 and 5600 series
Processor
Intel® Xeon® processor
3400 series,
Intel Celeron® G1101,
Intel Pentium® G6950,
Intel Core® i3 processor
500 series
Front Side Bus
Direct Media Interface
(DMI)
6.4 GT/s QuickPath
Interconnect (QPI) links
6.4 GT/s QuickPath
Interconnect (QPI) links
# Sockets
1
2
2
# Cores
2 or 4
4 or 6
4 or 6
L2/L3 Cache
8MB
4MB, 8MB, and 12MB
4MB, 8MB, and 12MB
Chipset
Intel® 3400
Intel® 5500
Intel® 5520
DIMMs
6
8
12
Min/Max RAM
1GB/32GB
1GB/128GB
1GB/192GB
Drive Bays
Optional hot-plug
4 x 2.5‖ or
4 x 3.5‖
Optional hot-plug
6 x 2.5‖ or
6 x 3.5‖
Hot-plug
8 x 2.5‖ or
8 x 3.5‖
Hard Drive Types
SSD, SAS, nearline SAS,
SATA
SSD, SAS, nearline SAS,
SATA
SSD, SAS, nearline SAS,
SATA
2 x 5.25‖
2 x 5.25‖
2 x 5.25‖
PERC H200, PERC H700,
SAS 6/iR, PERC 6/i,
PERC S100, PERC S300
PERC H200, PERC H700,
SAS 6/iR, PERC 6/i,
PERC S100, PERC S300
PERC H200, PERC H700,
SAS 6/iR, PERC 6/i,
PERC S100, PERC S300
Non-RAID:
SAS 5/E
LSI 2032 (for tape
backup unit only)
6Gbps SAS HBA
Non-RAID:
SAS 5/E
LSI 2032 (for tape backup
unit only)
6Gbps SAS HBA
Non-RAID:
SAS 5/E
LSI 2032 (for tape backup
unit only)
6Gbps SAS HBA
RAID:
SAS 6/iR
PERC H200
PERC 6/i
PERC H700
PERC 6/E
PERC H800
PERC S300
(software-based)
RAID:
SAS 6/iR
PERC H200
PERC 6/i
PERC H700
PERC 6/E
PERC H800
RAID:
SAS 6/iR
PERC H200
PERC 6/i
PERC H700
PERC 6/E
PERC H800
External Drive
Bays
Embedded Hard
Drive Controller
Optional Storage
Controller
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Feature
T310
T410
T610
Optional hot-plug hard
drives
Optional hot-plug
redundant power
ECC memory
Quad-pack LED or LCD
diagnostic
Optional hot-plug hard
drives
Optional hot-plug
redundant power
ECC memory
Memory mirroring
Quad-pack LED or LCD
diagnostic
Hot-plug hard drives
Optional hot-plug
redundant power
Hot-plug redundant
cooling
ECC memory
Memory mirroring
LCD diagnostic
One dual-port embedded
NIC with TOE
Server
Management
Baseboard Management
Controller (BMC), IPMI
2.0, Dell OpenManage™
Optional: iDRAC6
Express, iDRAC6
Enterprise, vFlash media
Baseboard Management
Controller (BMC), IPMI
2.0, Dell OpenManage™
Optional: iDRAC6
Express, iDRAC6
Enterprise, vFlash media
Baseboard Management
Controller (BMC), IPMI
2.0, Dell OpenManage™,
iDRAC6 Express
Optional: iDRAC6
Enterprise, vFlash media
I/O Slots
2
1
1
1
4 PCIe x8 (x4 routing)
1 PCIe x16 (x8 routing)
2 PCIe x8
3 PCIe x4 Gen 2
NIC/LOM
2 x GbE LOM
Optional: various NICs
available
2 x GbE LOM
Optional: various NICs
available
2 x GbE LOM with TOE
Optional: various NICs
available
USB
2 front, 4 back,
2 internal
2 front, 4 back,
2 internal
2 front, 6 back,
1 internal
Power Supplies
Non-redundant 375W or
Optional hot-plug
redundant
2 x 400W
Non-redundant 525W or
Optional hot-plug
redundant
2 x 580W
Hot-plug redundant
2 x 570W (Energy Smart)
or
2 x 870W (High-output)
Fans
Non hot-plug, nonredundant
Non hot-plug, nonredundant
Optional hot-plug
redundant
Availability
PCIe x1
PCIe x8 (x8 routing)
PCIe x8 (x4 routing)
PCIe x16 (x8 routing)
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2 Key Technologies
Key technologies of the PowerEdge T410 include the following:






Intel® Xeon® 5500 and 5600 series processors
Intel 5500 chipset
Memory RAS feature (mirroring)
Support for optional Integrated Dell Remote Access Controller (iDRAC6)
Support for virtualization applications
Support for SSD drives
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3 System Overview
Table 2 summarizes the product features for the PowerEdge T410. For the latest information on
supported features for the PowerEdge T410, visit Dell.com.
Table 2.
Product Features Summary
Feature
Technical Specification
Form Factor
Tower
Processors
Latest quad-core or six-core Intel® Xeon® processors 5500 and 5600 series
Processor Sockets
2
Front Side Bus or
HyperTransport
Intel® QuickPath Interconnect (QPI)
Cache
Up to 12MB
Chipset
Intel® 5500 Chipset
Memory1
Up to 128GB (8 DIMM slots): 1GB/2GB/4GB/8GB/16GB DDR3 800MT/s, 1066MT/s or
1333MT/s
I/O Slots
4 PCIe x8 (x4 routing) + 1 PCIe x16 (x8 routing)
RAID Controller
Drive Bays
Maximum Internal
Storage
Hard Drives1
Internal Controller:
PERC H200 (6Gb/s)
PERC H700 (6Gb/s) (non-volatile batterybacked cache: 512MB, 1GB)
SAS 6/iR
PERC 6/i (battery-backed cache: 256MB)
PERC S100 (software-based)
PERC S300 (software-based)
External Controller:
PERC H800 (6Gb/s) (non-volatile
battery-backed cache: 512MB, 1GB)
PERC 6/E (battery-backed cache:
256MB, 512MB)
External HBAs (non-RAID):
6Gbps SAS HBA
SAS 5/E HBA
LSI2032 PCIe SCSI HBA
6 x 3.5‖ cabled hard drives or
6 x 3.5‖ hot-plug hard drives or
6 x 2.5‖ hot-plug hard drives
2 x 5.25‖ drive bays for DVD-ROM,
DVD+/-RW, or tape backup unit (TBU)
Up to 18TB
Hot-plug Hard Drive Options:
2.5" SATA SSD, SAS (10K)
3.5" SAS (15K, 10K), nearline SAS (7.2K),
SATA (7.2K)
PowerEdge T410 Technical Guide
Cabled Hard Drive Options:
3.5" SAS (15K, 10K), nearline SAS (7.2K),
SATA (7.2K)
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Embedded dual-port Broadcom®
NetXtreme II™ 5716 Gigabit Ethernet
Optional Add-in HBA/CNA:
Brocade® single-port 8Gb FC HBA
Brocade dual-port 8Gb FC HBA
Emulex® single-port 4Gb HBA
Emulex dual-port 4Gb HBA
Emulex single-port 8Gb HBA
Emulex dual-port 8Gb HBA
Emulex 10Gb CNA (FCoE)
Emulex 10Gb HBA (iSCSI)
QLogic® single-port 4Gb HBA
QLogic dual-port 4Gb FC HBA
QLogic single-port 8Gb FC HBA
QLogic dual-port 8Gb FC HBA
QLogic dual-port 10Gb CNA/FC (FCoE)
Communications
Optional Add-in NICs:
Broadcom dual-port 1GbE NIC
Broadcom quad-port 1GbE NIC
Broadcom dual-port 10GbE NIC
Intel® single-port 1GbE NIC
Intel dual-port 1GbE NIC
Intel quad-port 1GbE NIC
Intel dual-port 10GbE NIC
Power Supply
One non-redundant 525W or Two redundant hot-plug 580W
Availability
Quad-pack LED Diagnostic or LCD diagnostic (with hot-plug HDD chassis); TPM;
optional hot-plug hard drives; optional hot-plug redundant power supply; optional
PERC 6/i RAID controller with battery-backed cache; toolless chassis
Video
Integrated Matrox® G200
Remote Management
Optional iDRAC6 Enterprise, iDRAC6 Express
Systems Management
Dell™ OpenManage™
Microsoft® System Center Essential (SCE) 2010 v2
BMC, IPMI 2.0 compliant
Operating Systems
Microsoft® Windows Server® 2012
Microsoft Windows® Small Business Server 2011
Microsoft Windows Small Business Server 2008
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V®)
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2)
Novell® SUSE® Linux® Enterprise Server
Red Hat® Enterprise Linux
Virtualization options:
Citrix® XenServer®
VMware® vSphere® ESX™ and ESXi™
Red Hat Enterprise Virtualization®
For more information on the specific versions and additions, visit
Dell.com/OSsupport.
Featured Database
Application
Microsoft SQL Server® solutions (see Dell.com/SQL)
1
GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.
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4 Mechanical
4.1 Chassis Description
The PowerEdge T410 is a tower chassis design that is available in cabled hard drive or hot-plug hard
drive configurations. The chassis supports the following features:




Flexible power supply (redundant or non-redundant)
Two fixed hard drive cages (cabled and hot-plug chassis)
Common power-supply bay to accommodate two power supplies (non-redundant and
redundant)
User-friendly chassis—most devices are toolless:
o Hard drives (cabled and hot-plug)
o Optical drive and tape backup unit
o Fans
o Expansion cards
o Planar
o Backplane
o Power distribution board
o Redundant power supply (non-redundant power supply is secured with three screws)
4.2 Dimensions and Weight
Xa
Xb
Ya
Yb
Yc
Za
(With
bezel)
217.9mm
282.5mm
433.3mm
444.9mm
N/A
37.0mm
Za
(Without
bezel)
Zb*
Zc
Max
Weight
21.5mm
574.8mm
579.8mm
28.4kg
(62.61lbs)
*Note: Zb goes to the nominal rear wall external surface where the motherboard I/O connectors reside.
Figure 1.
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Chassis Dimensions
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4.3 Front Panel View and Features
Figure 2, Figure 3, and Figure 4 show the front views of the PowerEdge T410.
Figure 2.
Figure 3.
Front View (With Bezel)
Front View (Cabled Hard Drive Chassis Without Bezel)
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Figure 4.
Front View (Hot-plug Hard Drive Chassis Without Bezel)
See the Front-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge T410 Hardware Owner’s Manual on Support.Dell.com for more information.
4.4 Back Panel View and Features
Figure 5 and Figure 6 show the back views of the PowerEdge T410.
Figure 5.
Back View (With Non-redundant Power Supply)
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Figure 6.
Back View (With Redundant Power Supplies)
See the Back-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge T410 Hardware Owner’s Manual on Support.Dell.com for more information.
4.5 Hard Drive LED Indicators
Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED
is driven by the disk drive during normal operation. The bicolor LED is controlled by the storage
enclosure processor (SEP) device on the backplane. Both LEDs are used to indicate certain conditions
under direction of a storage controller.
For more information, see the Hard-Drive Indicator Patterns section in the About Your System
chapter in the Dell PowerEdge T410 Systems Hardware Owner’s Manual on Support.Dell.com.
4.6 Power Supply Indicators
The PowerEdge T410 optional redundant power supplies have one status bi-color LED: green for AC
power present and amber for a fault as detailed in Table 3.
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Table 3.
LED
Power Supply Status
Power Supply Status
AC Power is not present
AC Power is present
Fault of any kind is detected
DC Power is applied to the system
↔
Redundant power supply mismatch
(when hot-plugged/swapped)
See the Power Indicator Codes section in the About Your System chapter of the PowerEdge T410
Hardware Owner’s Manual on Support.Dell.com for more information.
4.7 NIC Indicators
See the NIC Indicator Codes section in the About Your System chapter of the PowerEdge T410
Hardware Owner’s Manual on Support.Dell.com for more information.
4.8 Internal Chassis Views
Figure 7 and Figure 8 show the internal views of the PowerEdge T410 server.
Figure 7.
Internal View (Cabled Hard Drive Configuration)
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Figure 8.
Internal View (Hot-plug Hard Drive Configuration)
4.9 Rails and Cable Management
The PowerEdge T410 is not a rackable system and does not have a rack kit. However, the T410 can
be stored in a rack using a third-party rack tray.
For information on power-cord cable-management, see the Installation and Configuration section in
the Dell PowerEdge T410 Getting Started Guide on Support.Dell.com.
4.10 Fans
There is one cabled system fan located at back of the system. It is not hot-swappable.
4.11 Control Panel
The PowerEdge T410 is available with an LCD control panel (hot-plug hard drive chassis) or an LED
control panel (cabled hard drive chassis).
4.11.1 LCD Panel Configuration
Figure 9 shows the LCD control panel.
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Figure 9.
LCD Control Panel
The LCD panel is located on the front of the system chassis to provide user access to buttons,
display, and I/O interfaces. Features of the LCD panel include the following:
•
•
•
•
•
•
Power button
LCD screen with controls
Two navigation buttons
Select button
System ID button
Non-maskable Interrupt (NMI) button (recessed)
For more information on the LCD panel, see the LCD Panel Features (Optional) section in the About
Your System chapter in the PowerEdge T410 Hardware Owner’s Manual on Support.Dell.com.
4.11.2 LED Panel Configuration
Figure 10 shows the LED control panel.
Figure 10. LED Control Panel
For a complete description of LED indicators, their causes, and possible courses of action to take to
resolve an error, see the Diagnostic Lights (Optional) section in the About Your System chapter in the
PowerEdge T410 Hardware Owner’s Manual on Support.Dell.com.
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4.12 Security
For additional information regarding the following security features, see the PowerEdge T410
Hardware Owner’s Manual on Support.Dell.com.
4.12.1 Cover Latch
The PowerEdge T410 comes with a tooled latch on the side cover of the system that secures it to the
chassis. A lock secures the cover latch.
4.12.2 Bezel
A bezel is mounted to the front of the chassis. A lock on the bezel is used to protect unauthorized
access to remove or install an optional tape backup unit, optical disk drives, or hot-plug hard drives
(hot-plug hard drive chassis only). System status on the LCD or LED control panel is viewable even
when the bezel is installed.
4.12.3 Hard Drive
For T410 systems with a hot-plug hard drive chassis, the front bezel of the system contains a lock
which secures the system hard drives.
For systems with a cabled hard drive chassis, the drives are secured by the cover-latch lock on the
side of the system.
4.12.4 TPM
The Trusted Platform Module (TPM) is used to generate and store keys, protect and authenticate
passwords, and create and store digital certificates. The TPM can also be used to store Microsoft®
BitLocker™ keys for hard drive encryption features in Microsoft Windows Server® 2008. TPM is
enabled through a BIOS option.
4.12.5 Power Off Security
The control panel is designed so the power switch cannot be accidentally activated. The lock on the
bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup that
disables the power button function.
4.12.6 Intrusion Alert
A switch mounted on the inside of the chassis, near the 5.25‖ drive bays, is used to detect chassis
intrusion. When the cover is opened, the switch circuit closes to indicate intrusion.
4.12.7 Secure Mode
BIOS has the ability to enter a secure boot mode through Setup. This mode includes the option to
lock out the power and NMI switches on the control panel or set up a system password.
For more information, see System and Setup Password Features section in the About Your System
chapter in the PowerEdge T410 Hardware Owner’s Manual on Support.Dell.com.
4.13 USB Key
The PowerEdge T410 has two ports inside the system on the planar for optional USB keys. Some
possible applications of the USB key are listed as follows:
•
User custom boot and pre-boot OS for ease of deployment or diskless environments
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•
•
USB license keys for software applications like eToken™ or Sentinel Hardware Keys
Storage of custom logs or scratch pads for portable user defined information (not hotswappable)
4.14 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH chip.
There is also a battery holder for optional PERC cards which is located under the chassis cover.
4.15 Field Replaceable Units (FRU)
The planar contains a 16K x 8 serial EEPROM to store FRU information including Dell part number,
part revision level, and serial number. This part is also used as a system event log (SEL) to be used by
the baseboard management controller (BMC).
4.16 User Accessible Jumpers, Sockets, and Connectors
See the Jumpers and Connectors chapter in the PowerEdge T410 Hardware Owner’s Manual on
Support.Dell.com.
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5 Power, Thermal, Acoustic
5.1 Power Supplies
The PowerEdge T410 system includes a single non-redundant 525W power supply or an optional
redundant 580W power supply.
The power supply subsystem provides power to the planar, six internal hard drive bays (cabled hard
drive chassis), the hard drive backplane (hot-plug hard drive chassis), and the two 5.25‖ drive bays.
Power is soft-switched, allowing power cycling using a switch on the front of the system enclosure or
through software control (through server management functions). The power system is compatible
with industry standards, such as ACPI and Server 2000.
For a redundant power supply configuration, the second power supply provides hot-pluggable power
redundancy. In redundant mode, the system distributes the power load across both power supplies to
maximize efficiency. When a power supply is removed with the system powered on, the full power
load is picked up by the remaining power supply.
If using only one hot-plug power supply, the power supply is installed in the PS1 location and a blank
module (metal cover) is installed in the PS2 location for factory consistency. Electrically, the system
can operate with a single power supply in either bay. The power supply has automatic input voltage
detection. An auxiliary power-out receptacle is not provided on this unit.
The type of power supply can be selected when ordering a system. After purchase, upgrading from a
non-redundant to a redundant configuration, or vice-versa, is not possible.
5.2 Power Supply Specifications
Table 4 shows the power supply specifications.
Table 4.
Power Supply Specifications
Feature
525W Power Supply
(Non-redundant)
580W Power Supply
(Redundant)
Input Voltage
90–264 VAC
Auto-ranging
Yes
Line Frequency
47–63Hz
Maximum Inrush Current
55A per supply for 10ms or less
Hot-Plug Capability
No
Yes
5.3 Heat Dissipation
Table 5 details heat dissipation for the PowerEdge T410.
Table 5.
Heat Dissipation
Description
Non-redundant Power Supply
Redundant Power Supply
Wattage
525W
580W
Heat Dissipation
2240 BTU/hr maximum
2330 BTU/hr maximum
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5.4 Environmental Specifications
Table 6 summarizes the environmental specifications for the PowerEdge T410.
Table 6.
Environmental Specifications
Temperature
Operating
10° to 35°C (50° to 95°F) with a maximum
temperature gradation of 10°C per hour
Note: For altitudes above 2950 feet, the
maximum operating temperature is derated
1°F/550 ft.
Storage
-40° to 65°C (-40° to 149°F) with a maximum
temperature gradation of 20°C per hour
Relative Humidity
Operating
20% to 80% (non-condensing) with a maximum
humidity gradation of 10% per hour
Storage
5% to 95% (non-condensing) with a maximum
humidity gradation of 10% per hour
Maximum Vibration
Operating
0.25 Grms at 3–200Hz for 15 minutes
Storage
1.54 Grms at 3–200Hz for 15 minutes
Maximum Shock
Operating
One shock pulse in the positive z axis (one pulse
on each side of the system) of 31G for 2.6ms in
the operational orientation
Storage
Six consecutively executed shock pulses in the
positive and negative x, y, and z axes (one pulse
on each side of the system) of 71G for up to 2ms
Altitude
Operating
-16 to 3048m (-50 to 10,000ft) Note: For
altitudes above 2950 feet, the maximum
operating temperature is de-rated 1°F/550ft
Storage
-16 to 10,600m (-50 to 35,000ft)
Airborne contaminant level
Class G1 or lower as defined by ISA-S71.04-1985 (G1 maximum corrosive contaminant levels
measured at ≤ 50% relative humidity)
5.5 Maximum Input Amps
The power supply or power supplies are equipped with automatic input voltage detection.
5.6 ENERGY STAR Compliance
ENERGY STAR® qualified configurations can be accessed from the ENERGY STAR Compliance results
landing page on Dell.com.
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5.7 Acoustics
The acoustical design of the PowerEdge T410 reflects adherence to Dell’s high sound quality
standards. Sound quality is different from sound power level and sound pressure level in that it
describes how humans respond to annoyances in sound, like whistles or hums. One of the sound
quality metrics in the Dell specification is prominence ratio of a tone as shown in Table 7.
Table 7.
Acoustical Performance
Typical Configuration @ 23 ± 2°C
DIMM
Power
Supply
Hard Drives
RAID
4 x 1GB
525W
cabled
4 x 3.5‖ SATA
(7.2K) 250GB
1 x SAS
6/iR
Operating
Mode
LWA-UL
(Bels)
LpA
(dBA)
Prominent
Tones
Idle
5.2
40
None
Stressed
5.4
44
None
Definitions
Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific
activity.
Stressed: An operating mode per ISO7779 (1999) definition 3.1.6; SPECPower set to 50% loading is
used.
LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and
measured in accordance to ISO7779 (1999).
LpA-Op: A-Weighted sound pressure level. The system is placed in center of ISO7779 table, while the
acoustic transducer is located 150 cm above the floor and 50 cm in front of the equipment.
Prominent tones: Criteria of D.6 and D.11 of ECMA-74 11th ed. (2010) are followed to determine if
discrete tones are prominent. The system is placed in a rack with its bottom at 75-cm from the floor.
The acoustic transducer is at front bystander position, ref ISO7779 3rd (2010), Section 8.6.2.
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6 Processors
6.1 Overview
The Intel® Xeon® processor 5500 and 5600 series 2S is the microprocessor designed specifically for
servers and workstation applications. The Intel Xeon processor 5500 series features quad-core
processing to maximize performance and performance/watt for data center infrastructures and
highly dense deployments. The Intel 5600 series features six-core processing, offering enhanced
system-level performance, virtualization, and energy efficiency. The Intel Xeon processor 5500 and
5600 series also feature Intel’s Core™ micro-architecture and Intel 64 architecture for flexibility in
64-bit and 32-bit applications and operating systems.
The Intel Xeon processor 5500 and 5600 series uses a 1366-contact Flip-Chip Land Grid Array
(FC-LGA) package that plugs into a surface mount socket.
The PowerEdge T410 provides support for up to two processors.
Table 8.
Intel Xeon 5500 and 5600 Processor Series Overview
Feature
5500 Series
5600 Series
# Cores
4
6
Last Level Cache
8MB shared
12MB shared
Multi-processor support
1–2 Processors
1-2 Processors
Front Side Bus (FSB) (MT/s)/
Link Frequency (GT/s)
Up to 6.4 GT/s
Up to 6.4 GT/s
Max Thermal Design Power
(TDP)
130W (workstation)
95W (server)
130W (workstation)
95W (server)
Max Frequency
>3GHz
>3GHz
Memory Controller
Integrated 3-channel DDR3
Integrated 3-channel DDR3
Process Technology
45nm
32nm
Intel® Trusted Execution
Technology
No
Yes
Intel® Advanced Encryption
Security- New Instructions
No
Yes
Intel® Virtualization
Technology
Yes
Yes
Intel® 64
Yes
Yes
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Feature
5500 Series
5600 Series
Intel® Hyper-Threading
Technology
Yes
Yes
Socket
LGA1366
LGA1366
6.2 Features
Key features of the Intel Xeon processor 5500 and 5600 series include:

















Two, four, or six cores per processor
Two point-to-point QuickPath Interconnect links at 6.4 GT/s
1366-pin FC-LGA package
32 nm and 45 nm process technology
No termination required for non-populated processors (must populate CPU socket 1 first)
Integrated QuickPath DDR3 memory controller 64-byte cache line size RISC/CISC hybrid
architecture
Compatible with existing x86 code base
Intel MMX™ support—Execute Disable Bit Intel Wide Dynamic Execution
Ability to execute up to four instructions per clock cycle
Simultaneous Multi-Threading (SMT) capability
Support for CPU Turbo Mode (on certain processors)—increases processor frequency if
operating below thermal, power, and current limits for streaming SIMD (Single Instruction,
Multiple Data) Extensions 2, 3, and 4
Intel 64 Technology Intel VT-x and VT-d Technology for virtualization support Enhanced Intel
SpeedStep® Technology
Demand-based switching for active processor power management as well as support for ACPI
P-States, C-States and T-States
Support for DDR3L, 1.35v DIMMs for even lower system power (5600 series)
Support for memory sparing (5600 series)
AES-NI (hardware encryption assist) for more efficient encryption for uses such as online
transactions SSL (5600 series)
Intel TXT (Trusted Execution Technology) provides hardware assisted protection against
emerging software attacks (5600 series)
6.3 Supported Processors
For the latest information on supported processors for the PowerEdge T410, visit Dell.com.
Table 9.
Supported Processors
Model
Speed
Power
Cache
Cores
QPI Speed
X5660
2.80GHz
95W
12M
6
6.4GT/s
X5650
2.66GHz
95W
12M
6
6.4GT/s
E5649
2.53GHz
80W
12M
6
5.86GT/s
E5645
2.40GHz
80W
12M
6
5.86GT/s
X5560
2.80GHz
95W
8M
4
6.4GT/s
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Model
Speed
Power
Cache
Cores
QPI Speed
E5640
2.66GHz
80W
12M
4
5.86GT/s
E5630
2.53GHz
80W
12M
4
5.86GT/s
E5620
2.40GHz
80W
12M
4
5.86GT/s
E5530
2.40GHz
80W
8M
4
5.86GT/s
E5607
2.26GHz
80W
8M
4
4.8GT/s
E5606
2.13GHz
80W
8M
4
4.8GT/s
E5506
2.13GHz
80W
4M
4
4.8GT/s
E5603
1.6GHz
80W
4M
4
4.8GT/s
E5503
2.00GHz
80W
4M
2
4.8GT/s
6.4 Processor Configurations
The PowerEdge T410 will operate with either a single processor or dual processors. However, since
the memory controller is embedded in the processor, when only one processor is installed in the
system, it supports 4 DIMMs, minimum 1GB and maximum 64GB. When two processors are installed in
the system, it supports 8 DIMMs, minimum 2GB and maximum 128GB.
6.5 Processor Installation
Refer to the Processors section in the Installing System Components chapter of the Dell PowerEdge
T410 Systems Hardware Owner’s Manual on Support.Dell.com for processor installation and removal
instructions.
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7 Memory
7.1 Overview
The PowerEdge T410 utilizes DDR3 memory, providing a high performance, high-speed memory
interface capable of low latency response and high throughput. The T410 supports Registered ECC
DDR3 DIMMs (RDIMM) or Unbuffered ECC DDR3 DIMMs (UDIMM).
Key features of the T410 memory system include:






3 channels per processor
8 (2/1/1) DIMM sockets (128 GB maximum capacity)
Support for ECC DDR3 RDIMMs or ECC DDDR3 UDIMMs
DDR3 speeds of 800/1066/1333 supported (maximum memory clock speed depends on the
processors selected)
Support for single-, dual-, and quad-rank DIMMs
Intel® Xeon® processor 5600 series also supports low voltage (LV) DIMMs and sparing
7.2 DIMMs Supported
The DDR3 memory interface consists of three channels with up to two RDIMMs or UDIMMs per channel
for single or dual rank and up to two RDIMMs per channel for quad rank. The following DIMMs are
supported by the PowerEdge T410:















1GB, DDR3 UDIMM, 1066 w/ECC
1GB, DDR3 UDIMM, 1333 w/ECC
1GB, DDR3 RDIMM, 1066 w/ECC
1GB, DDR3 RDIMM, 1333 w/ECC
2GB, DDR3 UDIMM, 1066 w/ECC
2GB, DDR3 UDIMM, 1333 w/ECC
2GB, DDR3 RDIMM, 1066 w/ECC
2GB, DDR3 RDIMM, 1333 w/ECC
4GB, DDR3 UDIMM, 1066 w/ECC
4GB, DDR3 UDIMM, 1333 w/ECC
4GB, DDR3 RDIMM, 1066 w/ECC
4GB, DDR3 RDIMM, 1333 w/ECC
8GB, DDR3 RDIMM, 1066 w/ECC
8GB, DDR3 RDIMM, 1333 w/ECC
16GB, DDR3 RDIMM, 1066 w/ECC
For information on the latest memory offerings for the T410, visit Dell.com.
7.3 DIMM Population Rules
The following DIMM population rules apply:




If DIMMs of different speeds are mixed, all channels will operate at the fastest common
frequency.
RDIMMs and UDIMMs cannot be mixed.
Mixing of ECC and non-ECC UDIMMs will force the system to function in non-ECC mode.
Mixing quad-rank RDIMMs in one channel and 3DPC in another channel with the same
processor socket is not supported.
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

DIMMs must be installed in each channel starting with the DIMM slot farthest from the
processor (slot 0)
For each processor, Channel 0 supports up to two DIMMs and Channel 1 and 2 support one
DIMM each
7.4 DIMM Slots
The T410 planar provides four 72-bit (240-pin) sockets per processor for DIMM memory modules.
These modules can be DDR3 800/1066/1333 Registered DIMMs. The DIMMs are configured as 72 bits
wide to provide for ECC, which is performed by the memory controller in the processor.
7.5 Low Voltage DIMMs
With the introduction of the Intel® Xeon® processor 5600 series, low voltage (LV) DIMMs have been
added for selected memory configurations for the PowerEdge T410. Only this processor series
supports operating DIMMs at the lower voltage (1.35V, also referred to as DDR3L). The Intel Xeon
5500 processor series does not support low voltage operation. However, they can be operated at
1.5V. Therefore, DDR3L DIMMs can be used in systems with either processor series, and the platform
will automatically choose the appropriate operating voltage based on the processor populated.
DDR3L DIMMs will be qualified and available for use with Intel Xeon 5500 processor series mid-year
2011. Contact your Dell Sales Representative or visit Dell.com for more information.
LV DIMMs operate at 1.35V, creating power savings vs. standard memory which operates at 1.5V. In
order to achieve power savings, all DIMMs in the system must be of the LV type. If the system detects
a mixture of standard and LV DIMMs, the BIOS will operate all memory at 1.5V. When operating at
the lower voltage, additional frequency and population restrictions can take effect. For example, 3
DIMMs per channel operation is not supported at low voltage.
The DDR3L standard is completely backwards-compatible at standard voltage. DDR3L DIMMs can
operate at 1.5V without any limitations beyond standard voltage DDR3 DIMMs. As part of the addition
of LV DIMMs, the platform has certain default behaviors. Whenever possible, if there is no
performance degradation, the platform will default to 1.35V operation when using DDR3L DIMMs. In
certain cases, where a configuration is populated that cannot support 1.35V or a performance
degradation would result, the platform defaults to 1.5V operation. There are also options to override
default voltage within allowed limits.
7.6 Speed
The memory speed of each channel depends on the memory configuration:


For single- or dual-rank memory modules:
o One memory module per channel supports up to 1333 MT/s
o Two memory modules per channel supports up to 1066 MT/s
For quad-rank memory modules:
o One memory module per channel supports up to 1066 MT/s
o Two memory modules per channel are limited to 800 MT/s, regardless of memory
module speed
If memory modules with different speeds are installed, they will operate at the fastest common
frequency of the installed memory module(s).
7.7 Sparing
Systems with the Intel Xeon processor 5600 series support memory sparing. Sparing requires identical
memory installed in all three channels. One of the three channels is considered the Spare Channel,
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and two-thirds of the total installed memory is usable and is the amount reported during POST and in
BIOS setup.
7.8 Mirroring
The T410 system supports memory mirroring if identical memory modules are installed in the first
two channels and no memory is installed in the 3rd channel. Mirroring must be enabled in the System
Setup program. In a mirrored configuration, the total available system memory is one-half of the
total installed physical memory.
7.9 Supported Configurations
See the System Memory section in the Installing System Components chapter in the Dell PowerEdge
T410 Systems Hardware Owner's Manual on Support.dell.com.
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8 Chipset
8.1 Overview
Introduction of the new Intel® Xeon® processor 5600 series includes a stepping revision of the Intel
5520 and 5500 chipset, which is required to enable the full 5600 series feature set. Dell servers
shipped with the new chipset revision have the symbol II in the System Revision Field visible through
Dell OpenManage™ Server Administrator (OMSA) and the iDRAC GUI. They are physically marked with
a 12 mm x 6 mm rectangular label containing the symbol II. The memory interface is optimized for
800/1066/1333 MT/s DDR3 SDRAM memory with ECC when running with Intel Xeon processor 5600
series.
8.2 Intel 5500 Chipset Features
The following high-level features are supported by the Intel 5500 chipset:

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
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
8.2.1
Intel® 5500 IOH Chipset (north bridge)
Intel QuickPath interconnect: 2 ports
ESI interface: x4 lanes
Intel Virtualization Technology
24 PCIe Gen2 lanes
Riser card (x16 slot + x8 slot) connecting to IOH PCIe x16 Gen 2 and IOH PCIe x4 Gen 2
Integrated Intel® Management Engine
JTAG support
Intel ICH10R Chipset (south bridge)
Integrated USB 2.0 with 12-port capability
o Two back ports from ICH10R
o Two front ports
o Two internal ports from the USB hub (1 port from ICH10R) on the front panel board
Integrated storage controllers
Six SATA channels (through ICH10R)
Maximum of one SATA drive (300MB/s, Gen 2) on each channel
Intel QuickPath Interconnect
Intel QuickPath Interconnect features include:
•
•
•
•
•
•
•
8.2.2
Point-to-point cache-coherent interconnect
Fast/narrow unidirectional links
Concurrent bi-directional traffic
Error detection via CRC
Error correction via Link level retry
Intel® Interconnect BIST (Intel IBIST) toolbox built-in
Packet-based protocol
PCI Express Interfaces
PCI Express Interfaces include:
•
•
•
Intel® 5500 chipset IOH provides multiple PCI Express Gen 2 interfaces
Point-to-point, serial bi-directional interconnect
One x4 ESI link to ICH10
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•
•
•
•
•
8.2.3
Up to six x4 PCI Express Gen 2 ports
x4 link pairs can be combined to form x8 links and or x16 links
Each signal is 8b/10b encoded with an embedded clock
Signaling bit rate of 5 Gbit/sec/lane/direction; for an x4 link, bandwidth is 2 GB/sec in each
direction
Hot insertion and removal supported with the addition of hot-plug control circuitry
SMBus Interfaces
SMBus Interfaces include:
•
•
•
•
8.2.4
Global connections to processors, IOHs, and ICH through a common shared bus hierarchy
Low pin count, low-speed management interface
Access to configuration status registers (CSR)
Mastered by the baseboard management controller (BMC)
ESI interface
The ESI interface connects the Intel® 5500 chipset MCH to the ICH10R. The ESI interface runs at 2
GB/s with a 100 MT/s reference clock.
8.3 Intel ICH10R South Bridge
The PowerEdge T410 planar incorporates the Intel ICH10R chip. The ICH10R is a highly integrated I/O
controller.
8.3.1
SATA interface
The ICH10R contains 6 integrated Serial ATA host controllers capable of independent DMA operation
on 6 ports.
The ICH10R SATA interface supports data transfers up to 300 MB/s. The ICH10R has an integrated
AHCI controller.
8.3.2
USB interface
The ICH10R is USB 2.0 compliant. It has six UHCI host controllers to support twelve ports and two
EHCI host controller to support twelve ports. An over-current condition can be detected on all twelve
ports.
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9 BIOS
9.1 Overview
The T410 BIOS is based on the Dell BIOS core, supporting the following features:


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
Intel® 5500 2S support
Simultaneous Multi-Threading (SMT) support
CPU Turbo Mode support
PCI 2.3 compliant
Plug and Play 1.0a compliant
MP (Multiprocessor) 1.4 compliant
Ability to boot from hard drive, optical drive, iSCSI drive, and USB key
ACPI support
Direct Media Interface (DMI) support
PXE and WOL support for on-board NICs
Memory mirroring support
SETUP access through <F2> key at end of POST
USB 2.0 (USB boot code is 1.1 compliant)
F1/F2 error logging in CMOS
Virtual KVM, CD, and floppy support
Unified Server Configurator support
Power management support including DBS, Power Inventory, and multiple Power Profiles
UEFI support
Intel TXT (5600 processor series)
Intel AESNI (5600 processor series)
The T410 BIOS does not support the following:


BIOS language localization
BIOS recovery after bad flash (can be recovered from iDRAC6 Express)
9.2 Supported ACPI States
•
•
ACPI compliance: OS, S4, S5 supported
NO S1, S2, S3 (STR) support
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Table 10.
Wake-Up States
Wake-Up Events
States Can Wake From
RTC
OS-S4
Power Button
S5
RI#
Not supported
PME#
S5
KB
Not supported
MOUSE
Not supported
USB
Not supported
WOL
OS-S4
9.3 BIOS Power Management
The T410 BIOS provides a Performance/Power page in the BIOS configuration screen, and these BIOS
features are consolidated into a single page. The BIOS will also provide user-friendly Power Profiles
that adjust various BIOS settings.
Concerning the Power Profiles, some of the power management settings can be grouped together. A
group of a set of different parameters is called Power Profile. The BIOS setup provides five options:
OS Control, Active Power Controller, Static Max Performance, and Custom. OS Control mode is the
default mode.
9.4 I2C (Inter-Integrated Circuit)
I2C is a simple bi-directional two-wire bus for efficient inter-integrated circuit control. All I2C -bus
compatible devices incorporate an on-chip interface that allows them to communicate directly with
each other via the I2C-bus. This solves the many interfacing problems encountered when designing
digital control circuits. These I2C devices perform communication functions between intelligent
control devices (such as microcontrollers), general-purpose circuits (such as LCD drivers, remote I/O
ports, memories), and application-oriented circuits.
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10 Embedded NICs/LAN on Motherboard (LOM)
The PowerEdge T410 has an embedded dual-port Gigabit Ethernet controller. The embedded
Broadcom® 5716 dual-port LAN controller is on the T410 planar as an independent Gigabit Ethernet
interface device. There are two RJ-45 connectors on the back of the system. The firmware for the
LOM chip resides in a flash part. The PowerEdge T410 supports Wake-On-LAN (WOL) from either port.
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11 I/O Slots
11.1 Overview
The PowerEdge T410 has five PCI Express expansion slots which are detailed as follows:




One x16 PCIe Gen2 slot for a full-height half-length card
Two x8 PCIe Gen2 slots for full-height full-length cards
One x8 PCIe Gen2 slot for a full-height half-length card
One x8 PCIe Gen1 slot for a full-height full-length card
The system supports 25W maximum power for all PCIe cards. The system does not support hotplugging or hot-removal of PCIe cards.
11.2 Quantities and Priorities
For information on expansion-card quantities and priorities, see the Expansion Cards section in the
Installing System Components chapter of the Dell PowerEdge T410 Systems Hardware Owner’s
Manual on Support.dell.com.
11.3 PCI Card Dimensions
For information about PCIe slots and card dimensions, see the Expansion Cards section in the
Installing System Components chapter in the Dell PowerEdge T410 Systems Hardware Owner’s
Manual on Support.Dell.com.
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12 Storage
12.1 Overview
The PowerEdge T410 is available in either a cabled hard-drive chassis configuration or a hot-swap
hard-drive chassis configuration. The following hard-drive configurations are available:




4
6
6
6
x
x
x
x
3.5‖ cabled SATA drives using the motherboard SATA connectors
3.5‖ cabled SAS or SATA drives using an optional storage controller
3.5‖ hot-plug SAS or SATA drives using an optional storage controller
2.5‖ hot-plug SAS, SATA, or SSD drives using an optional storage controller
The use of 2.5‖ hard drives requires the hot-plug chassis configuration and the Dell 3.5‖ hard drive
carrier and retention kit.
Upgrading between cabled and hot-plug configurations is not possible after purchase.
12.2 Internal Hard Disk Drives
The T410 system supports up to six 2.5‖ or 3.5‖ hard disk drives. See Table 11 for information on
supported hard drives. For the most up-to-date information on supported hard drives, visit Dell.com.
Table 11.
Supported Hard Drives
Form Factor
Capacity
Speed
Type
2.5‖
146GB, 300GB, 600GB, 900GB
10K
SAS
2.5‖
50GB, 100GB
N/A
SATA SSD
3.5‖
250GB, 500GB, 1TB, 2TB, 4TB
7.2K
SATA
3.5‖
500GB, 1TB, 2TB, 3TB, 4TB
7.2K
NL SAS
3.5‖
146GB, 300GB, 450GB, 600GB
15K
SAS
12.3 RAID Configurations
Table 12 details RAID configurations for the PowerEdge T410.
Table 12.
Factory RAID Configurations
Non-Mixed drives
all SATA, all SAS, or
all SSD; all 2.5” or all
3.5”
Factory Configuration
Cabled/
Hot-plug
Config Type
Configs
Cabled
No Hard Drive
C0A
Hot-plug
No Hard Drive
Cabled
Embedded
SATA
Description
Min HDD
Max HDD
NCZCBL
No HDD, Cabled HDD Chassis
0
0
C0B
NCZ
No HDD, Hot-plug HDD Chassis
0
0
C1
MSTCBL
Onboard SATA Controller (ICH10R)
1
4
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Non-Mixed drives
all SATA, all SAS, or
all SSD; all 2.5” or all
3.5”
Factory Configuration
Cabled/
Hot-plug
Config Type
Configs
Description
Min HDD
Max HDD
SAS/SATA—
No RAID
C2
ASSCBL
Add-in SAS/SATA RAID card, No RAID
(SAS 6/iR, PERC H200)
1
6
C3
ASSR0CBL
Add-in SAS/SATA RAID card, RAID 0
(SAS 6/iR, PERC 6/i, PERC H200, PERC
H700)
1
4
SAS/SATA—
RAID 1
C4
ASSR1CBL
Add-in SAS/SATA RAID card, RAID 1
(SAS 6/iR, PERC 6/i, PERC H700, PERC
H200)
2
2
SAS/SATA—
RAID 5
C5
ASSR5CBL
Add-in SAS/SATA RAID card, RAID 5
(PERC H700)
3
4
SAS/SATA—
RAID 6
C6
ASSR6CBL
Add-in SAS/SATA RAID card, RAID 6
(PERC H700)
4
4
SAS/SATA
/SSD—NO
RAID
C7
ASS
Add-in SAS/SATA RAID card, No RAID
(SAS 6/iR, PERC H200)
1
6
SAS/SATA
/SSD—RAID 0
C8
ASSR0
Add-in SAS/SATA RAID card, RAID 0
(SAS 6/iR, PERC 6/i, PERC H700,
PERC H200)
1
6
SAS/SATA
/SSD—RAID 1
C9
ASSR1
Add-in SAS/SATA RAID card, RAID 1
(SAS 6/iR, PERC 6/i, PERC H700, PERC
H200)
2
2
SAS/SATA/SSD
—No RAID
C10
ASS
Add-in SAS/SATA RAID card, No RAID
(SAS 6/iR, PERC H200)
1
4
C11
ASSR0
Add-in SAS/SATA RAID card, RAID 0
(SAS 6/iR, PERC 6/i, PERC H200, PERC
H700)
1
4
SAS/SATA
/SSD—RAID 10
C12
ASSR1
Add-in SAS/SATA RAID card, RAID 1
(SAS 6/iR, PERC 6/i, PERC H200, PERC
H700)
2
2
SAS/SATA
/SSD—RAID 1
+ RAID 1
C13
ASSR5
Add-in SAS/SATA RAID card, RAID 5
(PERC H700)
3
4
SAS/SATA
/SSD—RAID 1
+ RAID 5
C14
ASSR6
Add-in SAS/SATA RAID card, RAID 6
(PERC H700)
4
4
SAS/SATA—
RAID 0
Hot-plug
SAS/SATA/SSD
—RAID
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Non-Mixed drives
all SATA, all SAS, or
all SSD; all 2.5” or all
3.5”
Factory Configuration
Cabled/
Hot-plug
Config Type
SW RAID (ICH)
Cabled
SW RAID
(Add-in Card)
Cabled/ Hot-plug
Config Type
Cabled/
Hot-plug
Config
Type
C18A
MSTR0CBL
RAID 0 for 2 drives (PERC S100)
2
2
C18B
MSTR0CBL
RAID 0 for 3 and above HDDs
(PERC S100)
3
4
C19
MSTR1CBL
RAID 1 (PERC S100)
2
2
C20
MSTR10CBL
RAID 10 (PERC S100)
4
4
C21
MSTR5CBL
RAID 5 (PERC S100)
3
4
C22A
ASSR0CBL
RAID 0 for 2 drives (PERC S300)
2
2
C22B
ASSR0CBL
RAID 0 for 3 and above drives
(PERC S300)
3
6
Mixed Hard Drive (SAS + SATA) Factory Configuration
Cabled/
Hot-plug
Hot-plug
Config Type
Configs
Mix SAS and
SATA—No
RAID
C15
Mix SAS and
SATA—RAID 1
+ RAID 1
Mix SAS and
SATA—RAID 1
+ RAID 5
Mixed SAS + SATA
Min: 2xSAS+1xSATA
Max: 2xSAS+4xSATA;
all 2.5” or 3.5”
Description
Min HDD
Max HDD
ASS-X
Add-in SAS/SATA RAID card, No RAID
(SAS 6/iR, PERC H200)
2xSAS +
1xSATA
2xSAS +
4xSATA
C16
ASSR1R1-X
Add-in SAS/SATA RAID card, RAID 1 +
RAID 1 (SAS 6/iR, PERC 6/i, PERC
H700, PERC H200)
2xSAS +
2xSATA
2xSAS +
2xSATA
C17
ASSR1R5-X
Add-in SAS/SATA RAID card, RAID 1 +
RAID 5 (PERC 6/i, PERC H700)
2xSAS +
3xSATA
2xSAS +
4xSATA
12.4 Storage Controllers
The PowerEdge T410 supports the storage controllers listed below. For information on card
quantities and priorities, see the Expansion Cards section in the Installing System Components
chapter of the Dell PowerEdge T410 Systems Hardware Owner’s Manual on Support.dell.com.
12.4.1 SAS 6/iR
The T410 internal SAS 6/iR HBA is an expansion card that plugs into one of the PCI Express x8 slots
(four lanes wired). It incorporates two four-channel SAS IOCs for connection to SAS or SATA hard disk
drives.
12.4.2 PERC 6/i
If you want an internal RAID solution, select the PERC 6/i or PERC H700. The PERC 6/i uses the LSI
1078 ROC (RAID on Chip) processor with a PCI Express host interface and DDR2 memory. A battery is
also available for backup.
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12.4.3 PERC H200
The H200 SAS HBA is an expansion card that plugs into one of the PCI Express x8 slots. It incorporates
two four-channel 6 Gb/s SAS IOCs for connection to SAS hard disk drives. It is designed in a form
factor that allows the same card to be used in other 11G 2U rack-form factor platforms.
12.4.4 PERC H700
If you want an internal RAID solution, select the PERC H700 or PERC 6/i. The PERC H700 card has its
own processor with a PCI Express Gen2 host interface and DDR2 memory and installs into one of the
PCI Express x8 slots. A battery is also available for backup. It supports the internal 6 Gb/s backplane
interface for internal storage options (SAS, SATA, or SSD HDD). The PowerEdge T410 supports both
256MB and 512MB cache options on the internal H700.
12.4.5 PERC H800
The PowerEdge T410 can support up to two PERC H800 adapter cards installed in the PCI Express x8
slots for access to external SAS direct-attach storage. Features of the PERC H800 include:







LSI 2108 (Liberator) ROC
6 Gb/s SAS
PCIe Gen2 x8
800 MT/s Core PPC
DDR2 800 mini-DIMM
Dual mini-SAS connectors
Supports connection to 6 Gb/s enclosures only
12.5 Optical Drives
Optical drives are optional in all PowerEdge T410 systems and connect to the planar through the
SATA interface. The following internal optical drives are available on the PowerEdge T410:


DVD-ROM
DVD+RW
If optical or tape drives are not ordered with the system, blanks are installed in the empty 5.25‖
bays.
12.6 Tape Drives
Internal and external tape drives and tape libraries are supported. For more information on
supported tape drives and tape libraries, see Dell.com/Storage.
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13 Video
The PowerEdge T410 is equipped with a Matrox® G200eW with 8 MB memory integrated in the
Nuvoton® WPCM450 (Baseboard Management Controller [BMC]). Supported resolutions are listed in
Table 13.
Table 13.
Graphics Video Modes
Resolution
Refresh Rate (Hz)
Color Depth
(bit)
640 x 480
60, 72, 75, 85
8, 16, 32
800 x 600
60, 72, 75, 85
8, 16, 32
1024 x 768
60, 72, 75, 85
8, 16, 32
1152 x 864
75
8, 16, 32
60
32
60, 75, 85
8, 16
1280 x 10241
1280 x 1024
2
1
32 bit color only supported at 60Hz for this resolution.
85Hz for KVM and 1600x1200 at 60Hz for video out.
2
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14 Rack Information
Dell does not provide rack support for the PowerEdge T410. However, the system can be placed in a
rack enclosure using a 3rd party tray.
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15 Operating Systems
For detailed information, see the following:


Operating System Support Matrix for Dell PowerEdge Systems on Dell.com
Dell PowerEdge T410 Systems Getting Started Guide on Support.Dell.com
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16 Systems Management
16.1 Overview
Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of
managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell
developed systems management solutions gives you choice and flexibility, so you can simplify and
save in IT environments of any size. To help you meet your server management demands, Dell offers
Dell OpenManage™ systems management solutions for:
•
•
•
Deployment of one or many servers from a single console
Monitoring of server and storage health and maintenance
Update of system, operating system, and application software
Dell offers IT management solutions for organizations of all sizes—priced and sized appropriately and
supported comprehensively.
16.2 Server Management
A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are
included with the product. ISO images are also available. A brief description of available content:
•
•
•
•
•
•
•
Dell Systems Build and Update Utility (SBUU): Dell Systems Build and Update Utility assists in
OS install and pre-OS hardware configuration and updates.
Server Update Utility (SUU): This DVD has an inventory tool for managing updates to
firmware, BIOS, and drivers for either Linux or Windows varieties.
OpenManage Server Administrator (OMSA): The OpenManage Server Administrator tool
provides a comprehensive, one-to-one (one console to one server) systems management
solution, designed for system administrators to manage systems locally and remotely over a
network. OMSA allows system administrators to focus on managing their entire network by
providing comprehensive one-to-one systems management.
Management Console: Dell IT Assistant (ITA) is also included, as well as tools to allow access
to our remote management products. These tools are Remote Access Service for iDRAC and
the Baseboard Management Controller (BMC) Utility.
Active Directory Snap-in Utility: The Active Directory Snap-in Utility provides an extension
snap-in to the Microsoft Active Directory. This allows you to manage Dell specific Active
Directory objects. The Dell-specific schema class definitions and their installation are also
included on the DVD.
Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the
latest Dell optimized drivers, utilities, and operating system-based diagnostics that you can
use to update your system.
eDocs: The section includes PDF files for PowerEdge systems, storage peripherals, and Dell
OpenManage™ software.
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•
Dell Management Console (DMC): The Dell Management Console is a systems management
console that enables systems administrators to discover and inventory devices on your
network. It provides functions such as health and performance monitoring of networked
devices and patch management capabilities for Dell systems. DMC differs from the IT Assistant
management console (described above) in that with DMC, value-add plug-ins that enable
advanced functionality can be purchased and added to the base DMC product.
16.3 Embedded Server Management
The PowerEdge T410 implements circuitry for the next generation of Embedded Server Management.
It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The optional iDRAC (Integrated
Dell Remote Access Controller) is responsible for acting as an interface between the host system and
its management software and the periphery devices. These periphery devices consist of the power
supplies, the storage backplane, the integrated SAS HBA or PERC 6/I (PERC H700), and the control
panel with LCD display.
The optional upgrade to iDRAC6 provides features for managing the server remotely or in data center
lights-out environments.
Advanced iDRAC features require the installation of the optional iDRAC6 Enterprise card.
16.4 Dell Lifecycle Controller and Unified Server Configurator
Embedded management is comprised of several interdependent pieces:
• Dell Lifecycle Controller
• Unified Server Configurator
• iDRAC6
Dell Lifecycle Controller powers the embedded management features. It includes integrated and
tamper-proof storage for system-management tools and enablement utilities (firmware, drivers). For
servers with iDRAC6 Express, the Lifecycle Controller offers pre-OS server deployment, OS
installation, platform updates, platform configuration, and diagnostics capabilities. For servers
without iDRAC6 Express, this utility has limited functionality and offers OS installation and
diagnostics capabilities only.
Dell Unified Server Configurator (USC) is a graphical user interface (GUI) that aids in local server
provisioning in a pre-OS environment. To access the Unified Server Configurator, press the <F10> key
within 10 seconds of the Dell logo appearance during the system boot process. Table 14 details the
current functionality enabled by the USC.
Table 14.
Unified Server Configurator Features and Description
Feature
Description
Faster O/S Installation
Drivers and the installation utility are embedded
on system, so no need to scour Dell.com.
Faster System Updates
Integration with Dell support automatically
directed to latest versions of the Unified Server
Configurator, iDRAC, RAID, BIOS, NIC, and Power
Supply.
Update Rollback
Ability to recover to previous ―known good state‖
for all updatable components.
More Comprehensive Diagnostics
Diagnostic utilities are embedded on system.
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Feature
Description
Simplified Hardware Configuration
Detects RAID controller and allows user to
configure virtual disk and choose virtual disk as
boot device, eliminating the need to launch a
separate utility. Also provides configuration for
iDRAC, BIOS, and NIC/LOM.
16.5 Integrated Dell Remote Access Controller
The integrated Dell Remote Access Controller (iDRAC6) provides IT Administrators comprehensive yet
straightforward management of remote servers, by delivering ―as if you are there‖ presence and
control. iDRAC6 helps users to save time and money by eliminating travel to the remote server(s),
whether that server is located in a different room, a different building, a different city, or in a
different country. iDRAC6 is a purchasable option and is available as three offerings: iDRAC6 Express,
iDRAC6 Enterprise, and Virtual Flash (vFlash) media:



iDRAC6 Express is most appropriate for small-to-medium business customers with limited
remote management needs.
iDRAC6 Enterprise is appropriate for large data center customers with distributed servers.
iDRAC6 with vFlash media is provided for large enterprise customers with requirements for
system management automation.
16.6 iDRAC6 Express
The optional iDRAC6 Express is the first tier of iDRAC6 upgrades. In addition to upgrading the system
with a Lifecycle Controller, iDRAC6 Express offers the following key features:
•
•
•
•
Graphical web interface
Standard-based interfaces
Server Sensor monitoring and fault alerting
Secure operation of remote access functions including authentication, authorization, and
encryption
• Power control and management with the ability to limit server power consumption and
remotely control server power states
• Advanced troubleshooting capabilities
For more information on iDRAC6 Express features, see Table 15.
16.7 iDRAC6 Enterprise
The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6
Enterprise connects directly to the T410 planar and is mounted parallel to the planar with stand-offs.
Key features for the iDRAC6 Enterprise include:
•
•
•
•
Scripting capability with Dell’s Racadm command-line
Remote video, keyboard, and mouse control with Virtual Console
Remote media access with Virtual Media
Dedicated network interface
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16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media
The iDRAC6 Enterprise can be upgraded by adding the vFlash media card. This is an 8 GB
Dell-branded SD card that enables a persistent 256 MB virtual flash partition. The vFlash media
delivers the following key features:


Support for 8 GB SD storage media
Can be used as a repository for a pre-OS image, eliminating the need to maintain a network
infrastructure for OS deployment
Can also be used for permanent diagnostics image for use after system failures, or permanent
failsafe image for periodic configuration changes

A more detailed feature list for iDRAC6 Express, iDRAC6 Enterprise, and vFlash media is shown in
Table 15.
Table 15.
Feature
Features List for Base Management Functionality, iDRAC6, and vFlash Media
Base Management
Functionality
iDRAC6 Express
iDRAC6
Enterprise
vFlash Media
Interface and Standards Support
IPMI 2.0




Web-based GUI



SNMP



WSMAN



SMASH-CLP





Racadm commandline
Conductivity
Shared/Failover
Network Modes




IPv4




VLAN Tagging












IPv6
Dynamic DNS

Dedicated NIC
Security and Authentication
Role-based
Authority




Local Users




Active Directory



SSL Encryption



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Feature
Base Management
Functionality
iDRAC6 Express
iDRAC6
Enterprise
vFlash Media
Remote Management and Remediation
Remote Firmware
Update




Server power
control




Serial-over-LAN
(with proxy)




Serial-over-LAN (no
proxy)



Power capping



Last crash screen
capture



Boot capture



Serial-over-LAN



Virtual media


Virtual console


Virtual console
sharing


Virtual flash

Monitoring
Sensor Monitoring
and Alerting




Real-time Power
Monitoring




Real-time Power
Graphing




Historical Power
Counters













Logging Features
System Event Log
RAC Log
Trace Log
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17 Peripherals
The T410 supports the following USB devices:



DVD-ROM
DVD+RW
USB key (bootable)
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Appendix A.
Statement of Volatility
The Dell PowerEdge T410 contains both volatile and non-volatile (NV) components. Volatile
components lose their data immediately upon removal of power from the component. Non-volatile
components continue to retain their data even after the power has been removed from the
component. Components chosen as user-definable configuration options (those not soldered to the
motherboard) are not included in the Statement of Volatility. Configuration option information
(pertinent to options such as microprocessors, system memory, remote access controllers, and
storage controllers) is available by component separately. The non-volatile (NV) components detailed
in Table 16 are present in the PowerEdge T410 server.
Table 16.
Volatility Table
Server BIOS Memory
Details
Size:
32 Mbit
Type [e.g. Flash PROM, EEPROM]:
Flash EEPROM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g. boot code]
Boot Code and Configuration Information
How is data input to this memory?
Loading flash memory requires a vendorprovided firmware file and loader
program which is executed by booting up
the system from a floppy or OS-based
executable containing the
firmware file and the loader. A system
loaded with arbitrary data in firmware
memory would not operate.
How is this memory write protected?
Software write protected
Remarks
Server CMOS (Complementary Metal-Oxide
Semiconductor) Memory
Details
Size:
512 Bytes
Type: [e.g. Flash PROM, EEPROM]:
Battery backed NVRAM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g. boot code]
RTC & Configuration settings
How is data input to this memory?
F2 Setup Menu during POST
How is this memory write protected?
N/A
Remarks
Jumper on motherboard can be used to
clear to factory default settings
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LOM (LAN [Network Interface] on Motherboard)
Memory
Details
Size:
4Mb (1MB)
Type: [e.g. Flash PROM, EEPROM]:
Flash
Can user programs or operating system write
data to it during normal operation?
Yes, under software control.
Purpose? [e.g. boot code]
Contains LOM boot code and config data
How is data input to this memory?
Requires vendor provided firmware file and
loader program used during factory
assembly or possible field update. A system
loaded with arbitrary data in firmware
memory would not operate.
How is this memory write protected?
Software control.
Remarks
Server System FRU
Details
Size:
16 KB
Type: [e.g. Flash PROM, EEPROM]:
SEEPROM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g. boot code]
Store System Events
How is data input to this memory?
BMC controller write
How is this memory write protected?
Not write protected
Remarks
Power Supply FRU
Details
Size:
256 Bytes
Type: [e.g. Flash PROM, EEPROM]:
SEEPROM
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g. boot code]
Store power supply information
How is data input to this memory?
Programmed by the power supply
manufacturer.
How is this memory write protected?
Not write protected
Remarks
TPM (Trusted Platform Module; boards sold to
destinations in China do not have TPM at this
time.)
Details
Size:
Unspecified size of user ROM, RAM,
EEPROM;
128 bytes of OTP memory included
Type: [e.g. Flash PROM, EEPROM]:
ROM, RAM, EEPROM
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Can user programs or operating system write
data to it during normal operation?
Yes, OS’s and applications that conform to
the TCG standard can write data to the TPM
during normal operation. Access to the NV
Storage is controlled by the TPM owner.
Purpose? [e.g. boot code]
Trusted Platform Module NV storage. May
be used to securely storage of encryption
keys.
How is data input to this memory?
TCG TPM Specification defined command
interface or Using TPM Enabled operating
systems
How is this memory write protected?
As defined by the TCG TPM Specification,
protection of this NV memory area is
configurable by the TPM owner.
Remarks
Backplane Firmware and FRU
Details
Size:
32 KB
Type: [e.g. Flash PROM, EEPROM]:
Flash
Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g. boot code]
Backplane Firmware and FRU data storage
How is data input to this memory?
Loading flash memory requires a vendor
provided firmware file and loader
program which is executed by booting up
the system from a floppy or OS based
executable containing the
firmware file and the loader. A system
loaded with arbitrary data in firmware
memory would not operate.
Embedded Bootable Memory Device
Details
Size:
1 GB
Type: [e.g. Flash PROM, EEPROM]:
SD card
Can user programs or operating system write
data to it during normal operation?
Yes
Purpose? [e.g. boot code]
Optional embedded boot device
How is data input to this memory?
Factory installed or via USB bus.
How is this memory write protected?
Not write protected
Remarks
Server BMC (Baseboard Management
Controller) Firmware Flash Memory
Details
Size:
16MB Flash
Type: [e.g. Flash PROM, EEPROM]:
SPI Flash
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Can user programs or operating system write
data to it during normal operation?
No
Purpose? [e.g. boot code]
Stores the BMC Firmware
How is data input to this memory?
Loading flash memory requires a vendor
provided firmware file and loader
program which is executed by booting up
the system from a floppy or OS based
executable containing the
firmware file and the loader. System
loaded with arbitrary data in firmware
memory would not operate.
How is this memory write protected?
Software write protected
Remarks
To obtain optional component information, please refer to the Dell Statement of Volatility for the
individual components. Please direct any questions to your Dell Marketing contact.
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Appendix B.
Certifications
A.1 Regulatory Certifications
Regulatory compliance certificates can be located at the following sites:

http://www.dell.com/content/topics/global.aspx/about_dell/values/regulatory_compliance
/dec_conform?c=us&l=en&s=corp
A.2 Product Safety Certifications
The product has been certified and bears the Mark, as applicable, of the Product Safety authorities
as indicated in Table 17.
Table 17.
Product Safety Certifications
Country/Region
Authority or Mark
Argentina
IRAM
Belarus
BELLIS
Canada
SCC
China
CNCA or CCC
Croatia
KONCAR
European Union
CE
Germany
TUV
IECEE
IECEE CB
Israel
SII
Kazakhstan
OTAN – CKT
Kenya
KEBS
Kuwait
KUCAS
Mexico
NYCE or NOM
Moldova
INSM
Nigeria
SONCAP
Norway
NEMKO
Russia
GOST
Saudi Arabia
KSA ICCP
South Africa
NRCS
Taiwan
BSMI
Ukraine
UKRTEST or
UKRSERTCOMPUTER
United States
NRTL
Uzbekistan
STZ
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A.3 Electromagnetic Compatibility
The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated
in Table 18.
Table 18.
Electromagnetic Compatibility Certifications
Country/Region
Authority or Mark
Australia/New
Zealand
ACMA or C-Tick
Belarus
BELLIS
Bosnia &
Herzegovina,
Montenegro, Serbia
KVALITET
Canada
ICES
Class A
China
CNCA or CCC
Class A
Croatia
KONCAR
Class A
European Union
CE
Class A
Israel
SII
Class A
Japan
VCCI
Class A
Kazakhstan
OTAN – CKT
Class A
Moldova
INSM
Class A
Norway
NEMKO
Class A
Russia
GOST
Class A
South Africa
SABS
Class A
South Korea
KCC
Class A
Taiwan
BSMI
Class A
Ukraine
UKRTEST or UKRSERTCOMPUTER
Class A
United States
FCC
Class A
Uzbekistan
STZ
Class A
Vietnam
ICT
Class A
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Class A
Class A
Class A
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A.4 Ergonomics, Acoustics and Hygienics
The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics and
Hygienics authorities as indicated in Table 19.
Table 19.
Ergonomics, Acoustics and Hygienics
Country/Region
Authority or Mark
Belarus
BELLIS
Germany
GS
Russia
GOST
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Appendix C.
Additional Information and Options
The PowerEdge T410 system conforms to the industry standards detailed in Table 20.
Table 20.
Industry Standards
Standard
URL for Information and Specifications
ACPI
Advance Configuration and
Power Interface Specification,
v2.0c
http://www.acpi.info/
Energy Star
EPA Version 1.0 of the
Computer Server specification
http://www.energystar.gov/index.cfm?c=archives.enterprise_servers
Ethernet
IEEE 802.3-2005
http://standards.ieee.org/getieee802/802.3.html
IPMI
Intelligent Platform
Management Interface, v2.0
http://www.intel.com/design/servers/ipmi/
DDR3 Memory
DDR3 SDRAM Specification,
Rev. 3A
http://www.jedec.org/download/search/JESD79-3A.pdf
LPC
Low Pin Count Interface
Specification, Rev. 1.1
http://developer.AMD.com/design/chipsets/industry/lpc.htm
PCI Express
PCI Express Base Specification
Rev. 2.0
http://www.pcisig.com/specifications/pciexpress/
PMBus
Power System Management
Protocol Specification, v1.1
http://pmbus.info/specs.html
SAS
Serial Attached SCSI, v1.1
http://www.t10.org/cgi-bin/ac.pl?t=f&f=sas1r10.pdf
SATA
Serial ATA Rev. 2.6;
SATA II, Extensions to SATA
1.0a, Rev. 1.2
http://sata-io.org/
SMBIOS
System Management BIOS
Reference Specification, v2.6
http://www.dmtf.org/standards/smbios/
TPM
Trusted Platform Module
Specification, v1.2
http://www.trustedcomputinggroup.org/resources/tpm_main_
specification
UEFI
Unified Extensible Firmware
Interface Specification, v2.1
http://www.uefi.org/specs/
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Standard
URL for Information and Specifications
USB
Universal Serial Bus
Specification, Rev. 2.0
http://www.usb.org/developers/docs/
Windows Logo
Windows Logo Program System
and Device Requirements,
v3.10
http://www.microsoft.com/whdc/winlogo/hwrequirements.mspx
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