FAST AND COMPACT
conga-TC175
-- 7th Generation Intel® Core™ SOC processor
-- Intel® Gen9 HD Graphics with HEVC (H.265) support
-- Intel® Optane™ memory can be connected via
PCI Express Gen 3.0
-- Low power consumption (TDP 15W, cTDP 7.5W)
-- Up to 32 GByte dual channel DDR4 memory
-- COM Express Compact Type 6 module 95x95 mm²
Formfactor
COM Express® Compact, (95 x 95 mm), Type 6 Connector Pinout
CPU
Intel® Core™ i7-7600U
Intel® Core™ i5-7300U
Intel® Core™ i3-7100U
Intel® Celeron® 3965U
3.9 GHz (Burst) | 2.8 GHz Clock
Dual Core
4MB cache
15W TDP
7.5W cTDP#
Intel® HD Graphics 620
3.5 GHz (Burst) | 2.6 GHz Clock
Dual Core
3MB cache
15W TDP
7.5W cTDP
Intel® HD Graphics 620
2.4 GHz Clock
Dual Core
3MB cache
15W TDP
7.5W cTDP
Intel® HD Graphics 620
2.2 GHz Clock
Dual Core
2MB cache
15W TDP
10W cTDP
Intel® HD Graphics 610
Intel® Turbo Boost Technology | Intel® Hyper-Threading Technology (HT) | Intel® Advanced Vector Extensions 2.0 (AVX2) Intel® Advanced Encryption
Standard New Instructions (AES-NI) | Integrated dual channel memory controller up to 34,1 GByte/sec. memory bandwidth | Integrated Intel® Gen9
HD Graphics with frequency up to 1.05 GHz | Intel® Clear Video HD Technology | Intel® Virtualization Technology (VT) | Intel® Trusted Execution
Technology (TXT) | Intel® Secure Key
DRAM
2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32 GByte dual channel
Chipset
Integrated PCH-LP
Ethernet
Intel® i219-LM GbE LAN Controller with AMT 11.6 support
I/O Interfaces
8x PCI Express GEN. 3.0 lanes | 3x Serial ATA® Gen 3 (can be configured as RAID) | 4x USB 3.0 (XHCI) | 8x USB 2.0 (XHCI) | LPC bus (no DMA)
I²C bus (fast mode, 400 kHz, multi-master) | 2x UART
Sound
Digital High Definition Audio Interface with support for multiple audio codecs
Graphics
Intel® Gen9 HD Graphics Engine with OpenCL 2.1, OpenGL 5.0 and DirectX12 (for Windows 10) support | up to three independent displays: HDMI
1.4a / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40
MBit/s | HEVC, VP9 and VDENC encoding
LVDS
(eDP optional)
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200
Automatic Panel Detection via EDID/EPI
Digital Display Interface (DDI)
2x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)
congatec Board Controller
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
Embedded BIOS Features
AMI Aptio® UEFI 2.x firmware | 8/16 MByte serial SPI firmware flash
Security
The conga-TC175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e
commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management
ACPI 4.0 with battery support
Operating Systems
Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux
Power Consumption
See User’s Guide for full details
Temperature
Operating: 0 .. +60°C
Humidity
Operating: 10 - 90% r. H. non cond.
Size
95 x 95 mm (3.74” x 3.74”)
Storage: -40 .. +85°C
Storage: 5 - 95% r. H. non cond.
www.congatec.com
conga-TC175 | Block diagram
COM Express
Type 6
COM Express
Type 6
Intel® ULT SOC (CPU + PCH)
A-B Connector
VGA
®
PCIe #10
Ethernet 10/100/1000
Intel i219LM
Ethernet
PCIe #9
PCIe #6
PCIe #5
PCIe #4
PCIe #3
PCIe #2
PCIe #1
PCIe Port 5
PCIe Port 4
PCIe Port 3
PCIe Port 2
PCIe Port 1
PCIe Port 0
eDP (assembly option)
LVDS
eDP to LVDS
Bridge
HT Technology 64 Architecture
AVX2
eDP
*1
*1
*1
TSX
Integrated Intel HD Graphics
Digital Display Interfaces
DisplayPort 1.2
HDMI 2.0 (3D, 4k)
Hardware Graphics Accelerators
3D
Vector Graphics
2D
DXVA2
2x SO-DIMM (X1/X2)
OpenGL 4.4
VC1/WMV9
DirectX 12
PCIe Port 6
PCIe Port 7
DP/HDMI Port C
DP/HDMI Port B
DP/HDMI Port D
Dual Channel DDR4
USB 3.0 Port 0
USB 3.0 Port 1
USB 3.0 Port 2
USB 3.0 Port 3
APIs
OpenCL 2.1
HEVC/H.265
X
PEG x2
Low Power Interconnect
HDA I/F
SPI Flash
0
SPI
Intel® 100 Series PCH-LP
eMMC
eMMC Flash *1
High Definition Audio
ASRC
SPI
SATA 6G
SATA Port 0 - 2
LPC
TPM
MGMNT
I/O Interfaces
UART0/1
LPC Bus
SDIO
PCIe
LPC Bus
GPIOs
SATA
USB 2.0
USB 3.0
SM Bus
GPIOs/SDIO
I2C Bus
LID#/SLEEP#
FAN control
VT
AES-NI
SSE4.2
Video Codecs
MPEG-2
*1
TXT
USB 2.0
USB Port 0 - 7
SER0/1
™
Turbo Boost 2.0 Technology
PCIe #11
LVDS/eDP
C-D Connector
Optional DP to VGA
7 Generation Intel Core Processor
th
PECI
SM Bus
congatec System
Management
Controller
Mux
(TX BC)
congatec custom
GPIOs
Note:
*1 Not supported by default (assembly option)
www.congatec.com
conga-TC175 | Order Information
Article
PN
Description
conga-TC175/i7-7600U
045250
COM Express Type 6 Compact module with Intel® Core™ i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel® Smart
Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
conga-TC175/i5-7300U
045251
COM Express Type 6 Compact module with Intel® Core™ i5-7300U dual core processor with 2.6GHz up to 3.5GHz, 3MB Intel® Smart
Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
conga-TC175/i3-7100U
045252
COM Express Type 6 Compact module with Intel® Core™ i3-7100U dual core processor with 2.4GHz, 3MB Intel® Smart Cache , GT2
graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
conga-TC175/3965U
045253
COM Express Type 6 Compact module with Intel® Celeron® 3965U dual core processor with 2.2GHz, 2MB Intel® Smart Cache, GT1
graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
conga-TC170/HSP-B
045230
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
conga-TC170/HSP-T
045231
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded..
conga-TC170/CSP-B
045232
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
conga-TC170/CSP-T
045233
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
conga-TC170/CSA-B
045234
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole,
15mm fins, 18mm overall heat sink height and integrated 12V fan..
conga-TC170/CSA-T
045235
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins,
18mm overall heat sink height and integrated 12V fan.
DDR4-SODIMM-2400 (4GB)
068790
4 GByte DDR4 SODIMM memory module with 2400 MT/s
DDR4-SODIMM-2400 (8GB)
068791
8 GByte DDR4 SODIMM memory module with 2400 MT/s
DDR4-SODIMM-2400 (16GB)
068792
16 GByte DDR4 SODIMM memory module with 2400 MT/s
Article
PN
Description
conga-TEVAL
065800
Evaluation carrier board for Type 6 COM Express modules
conga-LDVI/EPI
011115
LVDS to DVI converter board for digital flat panels with onboard EEPROM
COMe-carrier-socket-5
400007
Connector for COM-Express carrier boards, height 5mm, packing unit 4 pieces
COMe-carrier-socket-8
400004
Connector for COM-Express carrier boards, height 8mm, packing unit 4 pieces
© 2018 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. Mar 16, 2018 WME
www.congatec.com
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