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Agilent HFCT-5942xxx Single Mode Laser
Small Form Factor Transceivers for
ATM, SONET OC-48/SDH STM-16
Part of the Agilent METRAK family
Data Sheet
Description
The HFCT-5942xxx are high
performance, cost effective
modules for serial optical data
communications applications at
2488 Mb/s. They are designed
to provide SONET/SDH
compliant links at 2488 Mb/s
for both short and
intermediate reach links.
The modules are designed for
single mode fiber and operate
at a nominal wavelength of
1300 nm. They incorporate
high performance, reliable, long
wavelength optical devices and
proven circuit technology to
give long life and consistent
service.
The transmitter section of the
HFCT-5942L/AL/G/AG
incorporates a 1300 nm Fabry
Perot (FP) laser. The
transmitter in the HFCT5942TL/ATL/TG/ATG uses a
Distributed Feedback (DFB)
Laser packaged in conjunction
with an optical isolator for
excellent back reflection
performance. The transmitter
has full IEC 825 and CDRH
Class 1 eye safety.
For each device the receiver
section uses an MOVPE grown
planar SEDET PIN
photodetector for low dark
current and excellent
responsivity.
A positive ECL logic interface
simplifies interface to external
circuitry.
The transceivers are supplied
in the new industry standard
2 x 10 DIP style package with
the LC fiber connector
interface and is footprint
compatible with SFF Multi
Source Agreement (MSA).
Features
• HFCT-5942L/AL:
Links of 2 km with 9/125 µm
single mode fiber (SMF)
• HFCT-5942TL/ATL:
Links of 15 km with 9/125 µm
single mode fiber (SMF)
• Multisourced 2 x 10 package style
with LC receptacle
• Single +3.3 V power supply
• Temperature range:
HFCT-5942L/G:
0°C to +70°C
HFCT-5942TL/TG:
0°C to +70°C
HFCT-5942AL/AG: -40°C to +85°C
HFCT-5942ATL/ATG:
-20°C to +85°C
• Wave solder and aqueous wash
process compatible
• Manufactured in an ISO9002
certified facility
• Fully Class 1 CDRH/IEC 825
compliant
• Compliant with ITU-T G.957
STM-16, I-16 and S-16.1 Optical
Interfaces
• HFCT-5942L/AL/TL/ATL:
with EMI nose shield
• HFCT-5942G/AG/TG/ATG:
without EMI nose shield
Applications
• SONET/SDH equipment
interconnect, OC-48/SDH STM-16
rate
• Short and intermediate reach
ATM/SONET links
Functional Description
Receiver Section
Design
The receiver section for the
HFCT-5942xxx contains an
InGaAs/InP photo detector and
a preamplifier mounted in an
optical subassembly. This
optical subassembly is coupled
to a postamp/decision circuit
on a circuit board. The design
of the optical assembly is such
that it provides better than 27
dB Optical Return Loss (ORL).
The postamplifier is ac coupled
to the preamplifier as
illustrated in Figure 1. The
coupling capacitors are large
enough to pass the SONET/
SDH test pattern at 2488 Mb/s
without significant distortion
or performance penalty. If a
lower signal rate, or a code
which has significantly more
low frequency content is used,
sensitivity, jitter and pulse
distortion could be degraded.
Figure 1 also shows a filter
function which limits the
bandwidth of the preamp
output signal. The filter is
designed to bandlimit the
preamp output noise and thus
improve the receiver
sensitivity.
These components will reduce
the sensitivity of the receiver
as the signal bit rate is
increased above 2488 Mb/s.
As an optional feature the
device also incorporates a
photodetector bias circuit. The
circuit works by providing a
mirrored output of the bias
current within the photodiode.
This output must be connected
to VCC and can be monitored
by connecting through a series
resistor (see Application
Section).
Noise Immunity
The receiver includes internal
circuit components to filter
power supply noise. However
under some conditions of EMI
and power supply noise,
external power supply filtering
may be necessary (see
Application Section).
The Signal Detect Circuit
The signal detect circuit works
by sensing the peak level of
the received signal and
comparing this level to a
reference. The SD output is
low voltage TTL.
PHOTODETECTOR
BIAS
PECL
OUTPUT
BUFFER
AMPLIFIER
GND
Figure 1. Receiver Block Diagram
2
DATA OUT
FILTER
TRANSIMPEDANCE
PREAMPLIFIER
SIGNAL
DETECT
CIRCUIT
TTL
OUTPUT
BUFFER
DATA OUT
SD
Functional Description
Transmitter Section
Design
A schematic diagram for the
transmitter is shown in Figure
2. The HFCT-5942L/AL/G/AG
incorporates an FP laser and
the HFCT-5942TL/TG/ATL/ATG
uses a DFB packaged in
conjunction with an optical
isolator. Both packages have
been designed to be compliant
with IEC 825 eye safety
requirements under any single
fault condition and CDRH
under normal operating
conditions. The optical output
is controlled by a custom IC
that detects the laser output
via the monitor photodiode.
This IC provides both dc and
ac current drive to the laser to
ensure correct modulation, eye
diagram and extinction ratio
over temperature, supply
voltage and operating life.
The transmitters also include
monitor circuitry for both the
laser diode bias current and
laser diode optical power.
FP or
DFB
LASER
DATA
LASER
MODULATOR
DATA
PECL
INPUT
BMON(+)
BMON(-)
LASER BIAS
DRIVER
LASER BIAS
CONTROL
PMON(+)
PMON(-)
Figure 2. Simplified Transmitter Schematic
3
PHOTODIODE
(rear facet monitor)
Package
The overall package concept
for the device consists of the
following basic elements; two
optical subassemblies, two
electrical subassemblies and
the housing as illustrated in
the block diagram in Figure 3.
The package outline drawing
and pin out are shown in
Figures 4 and 5. The details of
this package outline and pin
out are compliant with the
multisource definition of the 2
x 10 DIP.
A metallic nose clip provides
connection to chassis ground
for both EMI and thermal
dissipation.
The electrical subassemblies
consist of high volume
multilayer printed circuit
boards on which the IC and
various surface-mounted
passive circuit elements are
attached.
The receiver electrical
subassembly includes an
internal shield for the
electrical and optical
subassembly to ensure high
immunity to external EMI
fields.
The optical subassemblies are
each attached to their
respective transmit or receive
electrical subassemblies. These
two units are then fitted
within the outer housing of the
transceiver that is molded of
filled nonconductive plastic to
provide mechanical strength.
The housing is then encased
with a metal EMI protective
shield. The case is signal
ground and we recommend
soldering the four ground tabs
to host card signal ground.
The pcb’s for the two electrical
subassemblies both carry the
signal pins that exit from the
bottom of the transceiver. The
solder posts are fastened into
the molding of the device and
are designed to provide the
mechanical strength required
to withstand the loads
imposed on the transceiver by
mating with the LC
connectored fiber cables.
Although they are not
connected electrically to the
transceiver, it is recommended
to connect them to chassis
ground.
RX SUPPLY
*
PHOTO DETECTOR
BIAS
DATA OUT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
QUANTIZER IC
DATA OUT
RX GROUND
SIGNAL
DETECT
LC
RECEPTACLE
TX GROUND
DATA IN
DATA IN
Tx DISABLE
BMON(+)
BMON(-)
PMON(+)
PMON(-)
LASER BIAS
MONITORING
LASER DRIVER
AND CONTROL
CIRCUIT
LASER DIODE
OUTPUT POWER
MONITORING
TX SUPPLY
LASER
OPTICAL
SUBASSEMBLY
CASE
* NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Figure 3. Block Diagram
4
15.0 ± 0.2
(0.591 ± 0.008)
13.59 + 0
- 0.2
0.535 +0
-0.008
(
13.59
(0.535)
MAX
)
TOP VIEW
6.25
(0.246)
48.5 ± 0.2
(1.91 ± 0.008)
10.8 ± 0.2
(0.425 ± 0.008)
9.8
(0.386)
MAX
3.81 ± 0.15
(0.15 ± 0.006)
10.16 ± 0.1
(0.4 ± 0.004)
4.06 ± 0.1
(0.16 ± 0.004)
9.6 ± 0.2
(0.378 ±0.008)
Ø 1.07 ± 0.1
(0.042 ± 0.004)
19.5 ±0.3
(0.768 ±0.012)
FRONT VIEW
1 ± 0.1
(0.039 ± 0.004)
SIDE VIEW
0.25 ± 0.1
(0.01 ± 0.004)
20 x 0.5 ± 0.2
(0.02 ± 0.008)
1 ± 0.1
(0.039 ± 0.004)
BACK VIEW
1.78 ± 0.1
(0.07 ± 0.004)
48.5 ± 0.2
(1.91 ± 0.008)
9.8
(0.386)
MAX
G MODULE - NO EMI NOSE SHIELD
Ø 1.07 ± 0.1
(0.042 ± 0.004)
19.5 ±0.3
(0.768 ±0.012)
1 ± 0.1
(0.039 ± 0.004)
SIDE VIEW
3.81 ± 0.1
(0.15 ± 0.004)
0.25 ± 0.1
(0.01 ± 0.004)
20 x 0.5 ± 0.2
(0.02 ± 0.008)
1.78 ± 0.1
(0.07 ± 0.004)
20 x 0.25 ± 0.1 (PIN THICKNESS)
(0.01 ± 0.004)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4. HFCT-5942xxx Package Outline Drawing
5
Connection Diagram
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
PHOTO DETECTOR BIAS
RECEIVER SIGNAL GROUND
RECEIVER SIGNAL GROUND
NOT CONNECTED
NOT CONNECTED
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUTPUT BAR
RECEIVER DATA OUTPUT
Figure 5. Pin Out Diagram (Top View)
o 1
20 o
o 2 Top 19 o
o 3
o
View 18
o 4
17 o
o 5
16 o
o 6
15 o
o 7
14 o
o 8
13 o
o 9
12 o
o 10
11 o
LASER DIODE OPTICAL POWER MONITOR - POSITIVE END
LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END
LASER DIODE BIAS CURRENT MONITOR - POSITIVE END
LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END
TRANSMITTER SIGNAL GROUND
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
Pin Descriptions:
Pin 1 Photo Detector Bias, VpdR:
This pin enables monitoring of
photo detector bias current. The
pin should either be connected
directly to VCCRX, or to VCCRX
through a resistor for monitoring
photo detector bias current.
Pin 9 Receiver Data Out Bar RD-:
PECL logic family. Output
internally biased and ac coupled.
Pins 2, 3, 6 Receiver Signal Ground VEE
RX:
Directly connect these pins to
the receiver ground plane.
Pin 11 Transmitter Power Supply
VCC TX:
Provide +3.3 V dc via the
recommended transmitter power
supply filter circuit. Locate the
power supply filter circuit as
close as possible to the VCC TX
pin.
Pins 4, 5 DO NOT CONNECT
Pin 7 Receiver Power Supply VCC RX:
Provide +3.3 V dc via the
recommended receiver power
supply filter circuit. Locate the
power supply filter circuit as
close as possible to the VCC RX
pin. Note: the filter circuit
should not cause VCC to drop
below minimum specification.
Pin 8 Signal Detect SD:
Normal optical input levels to
the receiver result in a logic “1”
output.
Low optical input levels to the
receiver result in a logic “0”
output.
This Signal Detect output can be
used to drive a TTL input on an
upstream circuit, such as Signal
Detect input or Loss of Signalbar.
6
Pin 10 Receiver Data Out RD+:
PECL logic family. Output
internally biased and ac coupled.
Pins 12, 16 Transmitter Signal
Ground VEE TX:
Directly connect these pins to
the transmitter signal ground
plane.
Pin 13 Transmitter Disable TDIS:
Optional feature, connect this
pin to +3.3 V TTL logic high “1”
to disable module. To enable
module connect to TTL logic low
“0”.
Pin 14 Transmitter Data In TD+:
PECL logic family.
Internal terminations are
provided (Terminations, ac
coupling).
Pin 15 Transmitter Data In Bar TD-:
Internal terminations are
provided (Terminations, ac
coupling).
Pin 17 Laser Diode Bias Current Monitor
- Negative End BMON–
The laser diode bias current is
accessible by measuring the
voltage developed across pins 17
and 18. Dividing the voltage by
10 Ohms (internal) will yield the
value of the laser bias current.
Pin 18 Laser Diode Bias Current Monitor
- Positive End BMON+
See pin 17 description.
Pin 19 Laser Diode Optical Power
Monitor - Negative End PMON–
The back facet diode monitor
current is accessible by
measuring the voltage developed
across pins 19 and 20. The
voltage across a 200 Ohm
resistor between pins 19 and 20
will be proportional to the photo
current.
Pin 20 Laser Diode Optical Power
Monitor - Positive End PMON+
See pin 19 description.
Mounting Studs/Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is
recommended that the holes in
the circuit board be connected to
chassis ground.
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
The following information is
provided to answer some of
the most common questions
about the use of the parts.
optical power (dBm avg) and
the lowest receiver sensitivity
(dBm avg). This OPB provides
the necessary optical signal
range to establish a working
fiber-optic link. The OPB is
allocated for the fiber-optic
cable length and the
corresponding link penalties.
For proper link performance,
all penalties that affect the
link performance must be
accounted for within the link
optical power budget.
Optical Power Budget and
Link Penalties
The worst-case Optical Power
Budget (OPB) in dB for a
fiber-optic link is determined
by the difference between the
minimum transmitter output
Electrical and Mechanical Interface
Recommended Circuit
Figure 6 shows the
recommended interface for
deploying the Agilent
transceivers in a +3.3 V
system.
Application Information
The Applications Engineering
Group at Agilent is available
to assist you with technical
understanding and design
trade-offs associated with
these transceivers. You can
contact them through your
Agilent sales representative.
Data Line Interconnections
Agilent’s HFCT-5942xxx fiberoptic transceivers are designed
to couple to +3.3 V PECL
signals. The transmitter driver
circuit regulates the output
optical power. The regulated
light output will maintain a
constant output optical power
provided the data pattern is
balanced in duty cycle. If the
data duty cycle has long,
continuous state times (low or
high data duty cycle), then the
output optical power will
gradually change its average
output optical power level to
its preset value.
Z = 50 W
VCC (+3.3 V)
TDIS (LVTTL)
130 W
BMONZ = 50 W
TD-
BMON+
NOTE A
130 W
PMON-
TD+
PMON+
VEE TX o
TD- o
VEE TX o
VCC TX o
o DNC
o DNC
o VEE RX
o VCC RX
o SD
o RD-
o RD+
TDIS o
BMON- o
o VEERX
TD+ o
PMON- o
BMON+ o
o VEE RX
RX
PMON+ o
TX
o VpdR
20 19 18 17 16 15 14 13 12 11
1
2
3
4
5
6
7
8
9
10
VCC (+3.3 V)
1 µH
C2
10 µF
RD+
C1
10 µF
2 kW
NOTE C
VCC (+3.3 V)
1 µH
Z = 50 W
VCCRX (+3.3 V)
C3
100 W
NOTE B
RD-
10 nF
Z = 50 W
3k
SD
Note:
C1 = C2 = C3 = 10 nF or 100 nF
TD+, TD- INPUTS ARE INTERNALLY TERMINATED AND AC COUPLED.
RD+, RD- OUTPUTS ARE INTERNALLY BIASED AND AC COUPLED.
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT.
Note B: CIRCUIT ASSUMES HIGH IMPENDANCE INTERNAL BIAS @ VCC - 1.3 V.
Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 2 kW.
Figure 6. Recommended Interface Circuit
7
LVTTL
The HFCT-5942xxx has a
transmit disable function which
is a single-ended +3.3 V TTL
input which is dc-coupled to
pin 13. In addition the devices
offer the designer the option
of monitoring the laser diode
bias current and the laser
diode optical power. The
voltage measured between pins
17 and 18 is proportional to
the bias current through an
internal 10 Ω resistor.
Similarly the optical power
rear facet monitor circuit
provides a photo current
which is proportional to the
voltage measured between pins
19 and 20, this voltage is
measured across an internal
200 Ω resistor.
2 x Ø 2.29 MAX. 2 x Ø 1.4 ±0.1
(0.055 ±0.004)
(0.09)
The receiver section is
internally ac-coupled between
the preamplifier and the postamplifier stages. The Data and
Data-bar outputs of the postamplifier are internally biased
and ac-coupled to their
respective output pins (pins 9,
10).
Signal Detect is a singleended, +3.3 V TTL compatible
output signal that is dccoupled to pin 8 of the
module. Signal Detect should
not be ac-coupled externally to
the follow-on circuits because
of its infrequent state changes.
8.89
(0.35)
7.11
(0.28)
2 x Ø 1.4 ±0.1
(0.055 ±0.004)
The designer also has the option
of monitoring the PIN photo
detector bias current. Figure 6
shows a resistor network,
which could be used to do this.
Note that the photo detector
bias current pin must be
connected to VCC. Agilent also
recommends that a decoupling
capacitor is used on this pin.
Caution should be taken to
account for the proper
intercon-nection between the
supporting Physical Layer
integrated circuits and these
transceivers. Figure 6
illustrates a recommended
interface circuit for
interconnecting to a +3.3 V dc
PECL fiber-optic transceiver.
3.56
(0.14)
4 x Ø 1.4 ±0.1
(0.055 ±0.004)
13.34
(0.525)
10.16
(0.4)
7.59
(0.299)
9.59
(0.378)
3
(0.118)
9 x 1.78
(0.07)
3
(0.118)
6
(0.236)
4.57
(0.18)
16
(0.63)
2
(0.079)
2
2 x Ø 2.29
(0.079) (0.09)
3.08
(0.121)
20 x Ø 0.81 ±0.1
(0.032 ±0.004)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT AREAS.
3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26 PCB HOLES (20 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
4. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
5. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
Figure 7. Recommended Board Layout Hole Pattern
8
Power Supply Filtering and Ground
Planes
It is important to exercise care
in circuit board layout to
achieve optimum performance
from these transceivers. Figure
6 shows the power supply
circuit which complies with the
small form factor multisource
agreement. It is further
recommended that a
continuous ground plane be
provided in the circuit board
directly under the transceiver
to provide a low inductance
ground for signal return
current. This recommendation
is in keeping with good high
frequency board layout
practices.
Package footprint and front panel
considerations
The Agilent transceivers
comply with the circuit board
“Common Transceiver
Footprint” hole pattern defined
in the current multisource
agreement which defined the 2
x 10 package style. This
drawing is reproduced in
Figure 7 with the addition of
ANSI Y14.5M compliant
dimensioning to be used as a
guide in the mechanical layout
of your circuit board. Figure 8
shows the front panel
dimensions associated with
such a layout.
Eye Safety Circuit
For an optical transmitter
device to be eye-safe in the
event of a single fault failure,
the transmit-ter must either
maintain eye-safe operation or
be disabled.
The HFCT-5942xxx is
intrinsically eye safe and does
not require shut down
circuitry.
9
10.16 ± 0.1
(0.4 ± 0.004)
15.24
(0.6)
TOP OF PCB
B
B
DETAIL A
15.24
(0.6)
1
(0.039)
A
SOLDER POSTS
14.22 ±0.1
(0.56 ±0.004)
15.75 MAX. 15.0 MIN.
(0.62 MAX. 0.59 MIN.)
SECTION B - B
DIMENSIONS IN MILLIMETERS (INCHES)
1.
2.
FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER.
SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING.
Figure 8. Recommended Panel Mounting
Signal Detect
The Signal Detect circuit
provides a deasserted output
signal when the optical link is
broken (or when the remote
transmitter is OFF). The Signal
Detect threshold is set to
transition from a high to low
state between the minimum
receiver input optical power
and
-35 dBm avg. input optical
power indicating a definite
optical fault (e.g. unplugged
connector for the receiver or
transmitter, broken fiber, or
failed far-end transmitter or
data source). The Signal Detect
does not detect receiver data
error or error-rate. Data errors
can be determined by signal
processing offered by upstream
PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board
designer’s foremost concerns is
the control of electromagnetic
emissions from electronic
equipment. Success in
controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard and
more importantly, it reduces
the possibility of interference
to neighboring equipment.
Agilent has designed the
HFCT-5942xxx to provide good
EMI performance. The EMI
performance of a chassis is
dependent on physical design
and features which help
improve EMI suppression.
Agilent encourages using
standard RF suppression
practices and avoiding poorly
EMI-sealed enclosures.
Agilent’s OC-48 LC
transceivers (HFCT-5942xxx)
have nose shields which
provide a convenient chassis
connection to the nose of the
transceiver. This nose shield
improves system EMI
performance by effectively
closing off the LC aperture.
Localized shielding is also
improved by tying the four
metal housing package
grounding tabs to signal
ground on the PCB. Though
not obvious by inspection, the
nose shield and metal housing
are electrically separated for
customers who do not wish to
directly tie chassis and signal
grounds together. The
recommended transceiver
position, PCB layout and panel
opening for both devices are
the same, making them
mechanically drop-in
compatible. Figure 8 shows
the recommended positioning
of the transceivers with
respect to the PCB and
faceplate.
Package and Handling Instructions
Flammability
The HFCT-5942xxx transceiver
housing consists of high
strength, heat resistant and UL
94 V-0 flame retardant plastic
and metal packaging.
Recommended Solder and Wash
Process
The HFCT-5942xxx are
compatible with industrystandard wave solder
processes.
Process plug
This transceiver is supplied
with a process plug for
protection of the optical port
within the LC connector
receptacle. This process plug
prevents contamination during
wave solder and aqueous rinse
as well as during handling,
shipping and storage. It is
made of a high-temperature,
molded sealing material that
can withstand +85°C and a
rinse pressure of 110 lbs per
square inch.
Recommended Solder fluxes
Solder fluxes used with the
HFCT-5942xxx should be
water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux
from Alpha-Metals of Jersey
City, NJ.
Recommended Cleaning/Degreasing
Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane
Other: naphtha.
Do not use partially
halogenated hydrocarbons such
as 1,1.1 trichloroethane,
ketones such as MEK, acetone,
chloroform, ethyl acetate,
methylene dichloride, phenol,
methylene chloride, or
N-methylpyrolldone. Also,
Agilent does not recommend
the use of cleaners that use
halogenated hydrocarbons
because of their potential
environmental harm.
LC SFF Cleaning Recommendations
In the event of contamination
of the optical ports, the
recommended cleaning process
is the use of forced nitrogen.
If contamination is thought to
have remained, the optical
ports can be cleaned using a
NTT international Cletop stick
type (diam. 1.25mm) and
HFE7100 cleaning fluid.
10
Regulatory Compliance
The Regulatory Compliance for
transceiver performance is
shown in Table 1. The overall
equipment design will
determine the certification
level. The transceiver
performance is offered as a
figure of merit to assist the
designer in considering their
use in equipment designs.
Electromagnetic Interference (EMI)
Most equipment designs
utilizing these high-speed
transceivers from Agilent will
be required to meet FCC
regulations in the United
States, CENELEC EN55022
(CISPR 22) in Europe and
VCCI in Japan. Refer to EMI
section (page 9) for more
details.
Electrostatic Discharge (ESD)
The device has been tested to
comply with MIL-STD-883E
(Method 3015). It is important
to use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and
floor mats in ESD controlled
areas.
Immunity
Transceivers will be subject to
radio-frequency
electromagnetic fields following
the IEC 61000-4-3 test method.
Eye Safety
These laser-based transceivers
are classified as AEL Class I
(U.S. 21 CFR(J) and AEL Class
1 per EN 60825-1 (+A11).
They are eye safe when used
within the data sheet limits
per CDRH. They are also eye
safe under normal operating
conditions and under all
reasonably foreseeable single
fault conditions per EN608251. Agilent has tested the
transceiver design for
compliance with the
requirements listed below
under normal operating
conditions and under single
fault conditions where
applicable. TUV Rheinland has
granted certification to these
transceivers for laser eye
safety and use in EN 60950
and
EN 60825-2 applications. Their
performance enables the
transceivers to be used
without concern for eye safety
up to 3.6 V transmitter VCC.
Table 1: Regulatory Compliance - Targeted Specification
Feature
Electrostatic Discharge
(ESD) to the
Electrical Pins
Electrostatic Discharge
(ESD) to the LC
Receptacle
Electromagnetic
Interference (EMI)
Test Method
MIL-STD-883E
Method 3015
Performance
Class 2 (>2 kV).
Variation of IEC 61000-4-2
Tested to 8 kV contact discharge.
Margins are dependent on customer board and chassis
designs.
Immunity
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class I
Variation of IEC 61000-4-3
Laser Eye Safety
and Equipment Type
Testing
US 21 CFR, Subchapter J
per Paragraphs 1002.10
and 1002.12
EN 60825-1: 1994 +A11
EN 60825-2: 1994
EN 60950: 1992+A1+A2+A3
Component
Recognition
11
Underwriters Laboratories and
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment Including Electrical
Business Equipment.
Typically show no measurable effect from a
10 V/m field swept from 27 to 1000 MHz applied to the
transceiver without a chassis enclosure.
AEL Class I, FDA/CDRH
CDRH Accession Number:
HFCT-5942L/AL ) 9521220 - 37
HFCT-5942ATL/TL ) 9521220 - 38
HFCT-5942ATG/AG/G/TG ) 9521220 - 41
AEL Class 1, TUV Rheinland of North America
TUV Bauart License:
HFCT-5942L/GL/AL/AG ) 933/510111/04
HFCT-5942ATL/ATG/TL/TG ) 933/510111/05
UL File Number: E173874
CAUTION:
There are no user serviceable
parts nor any maintenance
required for the HFCT5942xxx. All adjustments are
made at the factory before
shipment to our customers.
Tampering with or modifying
the performance of the parts
will result in voided product
warranty. It may also result in
improper operation of the
circuitry, and possible
overstress of the laser source.
Device degradation or product
failure may result.
Connection of the devices to a
non-approved optical source,
operating above the
recommended absolute
maximum conditions or
operating the HFCT-5942xxx in
a manner inconsistent with its
design and function may result
in hazardous radiation
exposure and may be
considered an act of modifying
or manufacturing a laser
product. The person(s)
performing such an act is
required by law to recertify
and reidentify the laser
product under the provisions
of U.S. 21 CFR (Subchapter J).
12
Absolute Maximum Ratings (HFCT-5942xxx)
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values
of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Storage Temperature
Supply Voltage
Data Input Voltage
Data Output Current
Relative Humidity
Receiver Optical Input
Symbol
TS
VCC
VI
ID
RH
PINABS
Min.
-40
-0.5
-0.5
Typ.
0
Max.
+85
3.6
VCC
50
85
6
Unit
°C
V
V
mA
%
dBm
Reference
Max.
Unit
Reference
+70
+85
+85
3.5
2
2
2
10
50
°C
°C
°C
V
mVP-P
V
W
mA
µA
V
V
µs
µs
Max.
+260/10
Unit
°C/sec.
Reference
6
1
Recommended Operating Conditions (HFCT-5942xxx)
Parameter
Ambient Operating Temperature
HFCT-5942L/TL/G/TG
HFCT-5942AL/AG
HFCT-5942ATL/ATG
Supply Voltage
Power Supply Rejection
Transmitter Differential Input Voltage
Data Output Load
TTL Signal Detect Output Current - Low
TTL Signal Detect Output Current - High
Transmit Disable Input Voltage - Low
Transmit Disable Input Voltage - High
Transmit Disable Assert Time
Transmit Disable Deassert Time
Symbol
Min.
TA
TA
TA
VCC
PSR
VD
RDL
IOL
IOH
TDIS
TDIS
TASSERT
TDEASSERT
0
-40
-20
3.1
Symbol
TSOLD/tSOLD
Min.
Typ.
100
0.3
2.4
50
1.0
-400
0.6
2.2
3
4
5
Process Compatibility (HFCT-5942xxx)
Parameter
Wave Soldering and Aqueous Wash
Typ.
Notes:
1. The transceiver is class 1 eye safe up to VCC = 3.6 V.
2. Ambient operating temperature utilizes air flow of 2 ms-1 over the device.
3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the VCC supply with the recommended power supply filter in place.
Typically less than a 1 dB change in sensitivity is experienced.
4. Time delay from Transmit Disable Assertion to laser shutdown.
5. Time delay from Transmit Disable Deassertion to laser startup.
6. Aqueous wash pressure <110 psi.
13
Transmitter Electrical Characteristics
HFCT-5942L/G: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V)
HFCT-5942AL/AG: TA = -40°C to +85°C, VCC = 3.1 V to 3.5 V)
Parameter
Supply Current
Power Dissipation
Data Input Voltage Swing (single-ended)
Transmitter Differential
Data Input Current - Low
Transmitter Differential
Data Input Current - High
Laser Diode Bias Monitor Voltage
Power Monitor Voltage
Symbol
ICCT
PDIST
VIH - VIL
Min.
150
IIL
-350
IIH
Typ.
100
0.33
Max.
175
0.61
1200
-2
18
10
Unit
mA
W
mV
Reference
µA
350
400
100
µA
mV
mV
Max.
140
0.49
930
150
150
0.8
Unit
mA
W
mV
ps
ps
V
V
µs
µs
µA/µW
1, 2
1, 2
Receiver Electrical Characteristics
HFCT-5942L/G: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V)
HFCT-5942AL/AG: TA = -40°C to +85°C, VCC = 3.1 V to 3.5 V)
Parameter
Supply Current
Power Dissipation
Data Output Voltage Swing (single-ended)
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time (OFF to ON)
Signal Detect Deassert Time (ON to OFF)
Responsivity
Symbol
ICCR
PDISR
VOH - VOL
tr
tf
VOL
VOH
ASMAX
ANSMAX
Min.
575
100
100
Typ.
115
0.38
125
125
2.0
0.6
0.9
100
100
1.2
Reference
3
4
5
6
6
7
7
8
9
Notes:
1. Measured at TA =+25°C.
2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing
resistors, 10 W and 200 W (under modulation).
3. Includes current for biasing Rx data outputs.
4. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of VCC and ICC minus the sum of the
products of the output voltages and currents.
5. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.
6. These are 20 - 80% values.
7. SD is LVTTL compatible.
8. For multi-rate applications LOS may be detected for long”all - zeros” patterns. Please refer to Application Note.
9. Responsivity is valid for input optical power from -18 dBm to -4 dBm at 1310 nm.
14
Transmitter Optical Characteristics
HFCT-5942L/G: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V)
HFCT-5942AL/AG: TA = -40°C to +85°C, VCC = 3.1 V to 3.5 V)
Parameter
Output Optical Power 9 µm SMF
Center Wavelength
Spectral Width - rms
Optical Rise Time
Optical Fall Time
Extinction Ratio
Output Optical Eye
Back Reflection Sensitivity
Jitter Generation
Symbol
POUT
lC
s
Min.
-10
1260
Typ.
-6
Max.
-3
1360
4
70
225
Unit
dBm
nm
nm rms
ps
ps
dB
1.8
30
tr
150
tf
8.2
12
ER
Compliant with eye mask Telcordia GR-253-GORE
-8.5
dB
pk to pk
70
mUI
RMS
7
mUI
Reference
1
2
3
3
4
5
5
Receiver Optical Characteristics
HFCT-5942L/G: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V)
HFCT-5942AL/AG: TA = -40°C to +85°C, VCC = 3.1 V to 3.5 V)
Parameter
Symbol
Receiver Sensitivity
PIN MIN
Receiver Overload
PIN MAX
-3
Input Operating Wavelength
l
1260
Signal Detect - Asserted
PA
Signal Detect - Deasserted
PD
-35
-28.7
Signal Detect - Hysteresis
PH
0.5
1.4
4
dB
-35
-27
dB
Reflectance
Min.
Typ.
Max.
Unit
-23
-19
dBm avg.
6, 7
dBm avg.
6
+1
-27.3
1570
nm
-19.5
dBm avg.
Reference
dBm avg.
Notes:
1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.
2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which
results in RMS = FWHM/2.35.
3. These are unfiltered 20 - 80% values.
4. This meets the “desired” requirement in SONET specification (GR253). The figure given is the allowable mismatch for 1 dB degradation in receiver
sensitivity.
5. For the jitter measurements, the device was driven with SONET OC-48C data pattern filled with a 223-1 PRBS payload.
6. PIN represents the typical optical input sensitivity of the receiver. Minimum sensitivity (PINMIN) and saturation (PINMAX) levels for a 223-1 PRBS with
72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to provide output data with a Bit Error Rate better than or equal to
1 x 10-10.
7. Beginning of life sensitivity at +25°C is -22 dBm (worst case).
15
Transmitter Electrical Characteristics
HFCT-5942TL/TG: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V)
HFCT-5942ATL/ATG: TA = -20°C to +85°C, VCC = 3.1 V to 3.5 V)
Parameter
Supply Current
Power Dissipation
Data Input Voltage Swing (single-ended)
Transmitter Differential
Data Input Current - Low
Transmitter Differential
Data Input Current - High
Laser Diode Bias Monitor Voltage
Power Monitor Voltage
Symbol
ICCT
PDIST
VIH - VIL
Min.
150
IIL
-350
IIH
Typ.
100
0.33
Max.
175
0.61
1200
-2
18
0
10
Unit
mA
W
mV
Reference
µA
350
400
100
µA
mV
mV
Max.
140
0.49
930
150
150
0.8
Unit
mA
W
mV
ps
ps
V
V
µs
µs
µA/µW
1, 2
1, 2
Receiver Electrical Characteristics
HFCT-5942TL/TG: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V)
HFCT-5942ATL/ATG: TA = -20°C to +85°C, VCC = 3.1 V to 3.5 V)
Parameter
Supply Current
Power Dissipation
Data Output Voltage Swing (single-ended)
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time (OFF to ON)
Signal Detect Deassert Time (ON to OFF)
Responsivity
Symbol
ICCR
PDISR
VOH - VOL
tr
tf
VOL
VOH
ASMAX
ANSMAX
Min.
575
100
100
Typ.
115
0.38
125
125
2.0
0.6
0.9
100
100
1.2
Reference
3
4
5
6
6
7
7
8
9
Notes:
1. Measured at T A =+25°C.
2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing resistors,
10 W and 200 W (under modulation).
3. Includes current for biasing Rx data outputs.
4. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of VCC and ICC minus the sum of the
products of the output voltages and currents.
5. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.
6. These are 20 - 80% values.
7. SD is LVTTL compatible.
8. For multi-rate applications LOS may be detected for long” all - zeros” patterns. Please refer to Application Note.
9. Responsivity is valid for input optical power from -18 dBm to -4 dBm at 1310 nm.
16
Transmitter Optical Characteristics
HFCT-5942TL/TG: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V)
HFCT-5942ATL/ATG: TA = -20°C to +85°C, VCC = 3.1 V to 3.5 V)
Parameter
Output Optical Power 9 µm SMF
Center Wavelength
Spectral Width
Side Mode Suppression Ratio
Optical Rise Time
Optical Fall Time
Extinction Ratio
Output Optical Eye
Back Reflection Sensitivity
Jitter Generation
Symbol
POUT
lC
s
Min.
-5
1260
Typ.
-3
Max.
0
1360
1
Unit
dBm
nm
nm (pk -20 dB)
dB
ps
ps
dB
SMSR
30
tr
30
70
tf
110
160
ER
8.2
10.5
Compliant with eye mask Telcordia GR-253-CORE
-8.5
dB
pk to pk
70
mUI
RMS
7
mUI
Reference
1
2
3
3
4
5
5
Receiver Optical Characteristics
HFCT-5942TL/TG: TA = 0°C to +70°C, VCC = 3.1 V to 3.5 V)
HFCT-5942ATL/ATG: TA = -20°C to +85°C, VCC = 3.1 V to 3.5 V)
Parameter
Receiver Sensitivity
Receiver Overload
Input Operating Wavelength
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
Reflectance
Symbol
PIN MIN
PIN MAX
l
Min.
0
1260
PA
PD
PH
-35
0.5
Typ.
-23
+1
-27.3
-28.7
1.4
-35
Max.
-19
1570
-19.5
4
-27
Unit
dBm
dBm
nm
dBm
dBm
dB
dB
avg.
avg.
Reference
6, 7
6
avg.
avg.
Notes:
1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.
2. Spectral width of main laser peak measured 20 dB below peak spectral density.
3. These are unfiltered 20 - 80% values.
4. This meets the “desired” requirement in SONET specification (GR253). The figure given is the allowable mismatch for 1 dB degradation in receiver
sensitivity.
5. For the jitter measurements, the device was driven with SONET OC-48C data pattern filled with a 223-1 PRBS payload.
6. PIN represents the typical optical input sensitivity of the receiver. Minimum sensitivity (P INMIN) and saturation (PINMAX ) levels for a 223-1 PRBS with
72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to provide output data with a Bit Error Rate better than or equal to
1 x 10-10.
7. Beginning of life sensitivity at +25°C is -22 dBm (worst case).
17
Design Support Materials
Agilent has created a number
of reference designs with
major PHY IC vendors in order
to demonstate full functionality
and interoperability. Such
design information and results
can be made available to the
designer as a technical aid.
Please contact your Agilent
representative for further
information if required.
Ordering Information
1300 nm FP Laser (Temperature range 0°C to +70°C)
HFCT-5942L
HFCT-5942G
1300 nm FP Laser (Temperature range -40°C to +85°C)
HFCT-5942AL
HFCT-5942AG
1300 nm DFB Laser (Temperature range 0°C to +70°C)
HFCT-5942TL
HFCT-5942TG
1300 nm DFB Laser (Temperature range -20°C to +85°C)
HFCT-5942ATL
HFCT-5942ATG
Class 1 Laser Product: This product conforms to the
applicable requirements of 21 CFR 1040 at the date of
manufacture
Date of Manufacture:
Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore
Handling Precautions
1. The HFCT-5942xxx can be damaged by current surges or overvoltage.
Power supply transient precautions should be taken.
2. Normal handling precautions for electrostatic sensitive devices
should be taken.
For product information and a complete list of
Agilent contacts and distributors, please go to
our web site.
www.agilent.com/
semiconductors
E-mail: SemiconductorSupport@agilent.com
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes: 5988-5924EN
August 3, 2004
5988-8146EN
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